<?xml version="1.0" encoding="utf-8"?>
<tw-patent-applications total-count="2332"> 
  <tw-patent-application no="1" publication-number="202613960"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613960.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613960</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134915</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於照片特徵的格局圖產生裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241031B">G06Q50/16</main-classification>  
        <further-classification edition="201301120241031B">G06F3/048</further-classification>  
        <further-classification edition="201801120241031B">G06F8/34</further-classification>  
        <further-classification edition="202001120241031B">G06F30/12</further-classification>  
        <further-classification edition="201901120241031B">G06F16/44</further-classification>  
        <further-classification edition="201901120241031B">G06F16/54</further-classification>  
        <further-classification edition="202201120241031B">G06V30/413</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>信義房屋股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宏明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明基於照片特徵的格局圖產生裝置主要包含物件資料庫、格局圖資料庫、產生模組、操作模組。產生模組依據該格局圖資料庫所提供的該格局圖，而在操作介面所顯示的該格局圖上標示出可被選取的複數個場景選取鈕，並在該場景選取鈕被啟動時，以透過該操作介面播放被啟動該場景選取鈕所在的位置相對的複數個環景影像。在該標籤符號被啟動時，依據相對於該標籤符號的該預定座標，計算出相對應的該視角指令，呈現帶有該標籤符號的預定視角畫面並且展示帶有文字與圖片的該標籤說明，其中該標籤說明為可移除式的視窗。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">1:操作介面</p>  
        <p type="p">10:物件資料庫</p>  
        <p type="p">12:格局圖資料庫</p>  
        <p type="p">13:操作模組</p>  
        <p type="p">14:產生模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2" publication-number="202613961"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613961.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613961</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113134919</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於照片的物件估價裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241204B">G06Q50/16</main-classification>  
        <further-classification edition="202301120241204B">G06Q30/02</further-classification>  
        <further-classification edition="201901120241204B">G06F16/587</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>信義房屋股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宏明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊國昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種基於照片的物件估價裝置，該基於照片的物件估價裝置包含資料庫、分析模組、估價模組以及傳輸模組。該資料庫儲存複數個不動產資訊，其中各該不動產資訊包括至少物件屬性，該物件屬性中包含房價影響率、位置資訊、交易價格、複數個估價回饋以及相對於估價回饋之一回饋可信度；當使用者按下查詢按鈕之後，分析模組所分析的特定不動產資訊的該位置資訊、以及系統指定且隱藏性的搜尋條件；估價模組則找出與該特定不動產資訊的該位置資訊落在預定距離範圍內，且與該搜尋條件互相符合之複數不動產資訊，而產生包含特定數量的複數不動產資訊之估價結果；傳輸模組則可使得使用者端的顯示裝置得以呈現包含該交易價格的該估價結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">10:基於照片的物件估價裝置</p>  
        <p type="p">101:使用者端</p>  
        <p type="p">105:資料庫</p>  
        <p type="p">106:複數個不動產資訊</p>  
        <p type="p">120:分析模組</p>  
        <p type="p">130:估價模組</p>  
        <p type="p">130:傳輸模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="3" publication-number="202612981"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612981.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612981</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135020</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多功能游泳安全裝置</chinese-title>  
        <english-title>MULTI-FUNCTIONAL SWIMMING SAFETY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">B63C9/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林振基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林振基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種多功能游泳安全裝置。多功能游泳安全裝置包括浮體裝置及一固定帶。浮體裝置由一或多個管狀浮體所形成，適於穿戴於人體的胸背部位，使得人體浮於水面上。固定帶設於該浮體裝置上，用於調整穿戴在人體上的浮體裝置的鬆緊度。固定帶解開時，浮體裝置展開而從人體卸下，並且固定帶扣合時，浮體裝置變形摺疊而貼附於人體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-functional swimming safety device is provided. The multi-functional swimming safety device includes a flotation device and a strap. The flotation device is formed by one or more tubular floats and is suitable for being worn on the chest and back of the human body, allowing the human body to float on the water surface. The strap is attached to the flotation device and is used to adjust the tightness of the flotation device on the body. When the strap is unfastened, the flotation device unfolds and can be removed from the body, and when the strap is fastened, the flotation device deforms and folds to fit closely to the body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:游泳安全裝置</p>  
        <p type="p">110:浮體裝置</p>  
        <p type="p">112:第一環形部分</p>  
        <p type="p">114:第二環形部分</p>  
        <p type="p">120:固定帶</p>  
        <p type="p">122:公扣</p>  
        <p type="p">124:第一調整固定帶</p>  
        <p type="p">126:母扣</p>  
        <p type="p">128:第二調整固定帶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="4" publication-number="202613466"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613466.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613466</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135033</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>類鑽石型太陽能集光板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241028B">F24S10/55</main-classification>  
        <further-classification edition="201801120241028B">F24S40/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾邦材</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾邦材</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">&lt;b&gt;一種具有加强聚集光能之太陽能板，係使用透明度高、耐熱又耐候的強化玻璃或有同樣性質之透明塑膠類(如壓克力等)作成板狀，其上表面作成多數半圓型凸透鏡狀，其凸透鏡邊緣採成六角型緊密交錯方式排列，在其六角型之底部和半圓型圓心間呈稜角型，形成類似鑽石狀之立體化太陽能板，固定套蓋在原平面太陽能板上，無論時辰(太陽偏東或偏西)無論季節(太陽偏南或偏北)如何變化都能聚集更多太陽光能以提升轉換電力之效能。&lt;/b&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">&lt;b&gt;(1-1)&lt;/b&gt;:類鑽石型太陽能集光板&lt;b&gt;正上面半圓形凸透鏡&lt;/b&gt;</p>  
        <p type="p">&lt;b&gt;(1-2)&lt;/b&gt;:類鑽石型太陽能集光板&lt;b&gt;正上面半圓型凸透鏡間之光暈渠道&lt;/b&gt;</p>  
        <p type="p">&lt;b&gt;(1-3)&lt;/b&gt;:類鑽石型太陽能集光板&lt;b&gt;之墊柱&lt;/b&gt;</p>  
        <p type="p">&lt;b&gt;(1-4)&lt;/b&gt;:類鑽石型太陽能集光板&lt;b&gt;兩側之固定翼&lt;/b&gt;</p>  
        <p type="p">(1-5):類鑽石型太陽能集光板之稜角線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="5" publication-number="202614094"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614094.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614094</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135034</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬網格結構與觸控面板</chinese-title>  
        <english-title>METAL MESH STRUCTURE AND TOUCH PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241126B">H01B5/12</main-classification>  
        <further-classification edition="200601120241126B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恆顥科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENGHAO TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳學智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HSUEH-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅啟文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃上榛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHAN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜芷榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, TZU-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏哲偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, CHE-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種金屬網格結構，其包含複數個單位圖案行，各單位圖案行包括複數個單位圖案沿著第一方向連續重複排列，單位圖案行沿著第二方向並排。各單位圖案包含第一框形圖案與第二框形圖案，彼此相接排列成人字形。各框形圖案分別包含第一邊、第二邊、第三邊和第四邊，其中第一邊連接第二、四邊，且第一、三邊小於第二、四邊。第一框形圖案之第一邊部分重疊於第二框形圖案之第四邊，第一框形圖案之第二邊與第二框形圖案之第四邊相交而形成一節點與互為補角的兩個夾角，且第一框形圖案之第四邊與第二框形圖案之第一邊相接並共用一頂點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a metal mesh structure, which includes a plurality of unit pattern columns. Each of the unit pattern columns includes a plurality of unit patterns. The unit patterns are repetitively arranged in a first direction. The unit pattern columns are arranged in a second direction. Each of the unit patterns include a first frame-shaped pattern and a second frame-shaped pattern, and both are arrange next to each other to form a Λ-shaped structure. Each of the frame-shaped patterns includes a first side, a second side, a third side, and a fourth side. The first side is connected to the second side and the fourth side. The first side and the third side are smaller than the second side and the fourth side. The first side of the first frame-shaped pattern is overlapped with a portion of the fourth side of the second frame-shaped pattern. The second side of the first frame-shaped pattern intersects with the fourth side of the second frame-shaped pattern to form a node and two angles, which are supplementary angles to each other. The fourth side of the first frame-shaped pattern connects with the first side of the second frame-shaped pattern while sharing the same vertex.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:金屬網格結構</p>  
        <p type="p">10:單位圖案</p>  
        <p type="p">COL:單位圖案行</p>  
        <p type="p">DR1:第一方向</p>  
        <p type="p">DR2:第二方向</p>  
        <p type="p">DR3:第三方向</p>  
        <p type="p">P,P1,P2:節點</p>  
        <p type="p">V:頂點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="6" publication-number="202613234"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613234.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613234</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135037</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚氯乙烯組成物及塑膠地磚</chinese-title>  
        <english-title>POLYVINYL CHLORIDE COMPOSITION AND PLASTIC FLOOR TILE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240919B">C08L27/06</main-classification>  
        <further-classification edition="200601120240919B">C08K5/10</further-classification>  
        <further-classification edition="200601120240919B">C08K5/15</further-classification>  
        <further-classification edition="200601120240919B">C08K5/098</further-classification>  
        <further-classification edition="200601120240919B">B32B27/22</further-classification>  
        <further-classification edition="200601120240919B">E04F15/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN YA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁敬堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHING-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹俊哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, CHUN-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴振和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHEN-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種聚氯乙烯組成物及塑膠地磚。聚氯乙烯組成物包含30重量份至60重量份的聚氯乙烯樹脂、0.5重量份至5.0重量份的增塑劑、及1重量份至8重量份的脂肪酸安定劑。其中，脂肪酸安定劑為複合配方，且至少包含：脂肪酸鈣化合物、脂肪酸鋅化合物、季戊四醇酯類化合物、及β-二酮類化合物。聚氯乙烯組成物具有不大於20秒的膠化時間及於180 °C下不小於153分鐘的一熱穩定時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a polyvinyl chloride (PVC) composition and a plastic floor tile. The PVC composition comprises 30 to 60 parts by weight of polyvinyl chloride resin, 0.5 to 5.0 parts by weight of a plasticizer, and 1 to 8 parts by weight of a fatty acid stabilizer. The fatty acid stabilizer is a composite formulation, which at least includes a calcium fatty acid compound, a zinc fatty acid compound, a pentaerythritol ester compound, and a β-diketone compound. The PVC composition has a gelation time of no more than 20 seconds and a thermal stability time of no less than 153 minutes at 180°C.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="7" publication-number="202614847"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614847.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614847</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135040</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>橫向擴散金屬氧化物半導體及其製作方法</chinese-title>  
        <english-title>LDMOS AND FABRICATING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D84/80</main-classification>  
        <further-classification edition="202501120250102B">H10D30/60</further-classification>  
        <further-classification edition="202501120250102B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周澤瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHOU, ZE-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭鎮銨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHEN-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林克峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KE-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIU-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YAN-HUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅際杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, JI-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃信哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSIN-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇慧中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HUEY-JONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種橫向擴散金屬氧化物半導體包含一基底，一閘極電極設置於基底上，一第一閘極介電層設置於閘極電極和基底之間，一第二閘極介電層包含一第一部分和一第二部分，一源極埋入於閘極電極一側的基底，一汲極埋入於閘極電極另一側的基底，第二閘極介電層的第二部分沿著水平方向朝向汲極延伸，第一部分被閘極電極覆蓋，第二部分沒有被閘極電極覆蓋，第一部分沿著水平方向具有一第一長度，第二部分沿著水平方向具有一第二長度，第二長度可以調整以用來調整橫向擴散金屬氧化物半導體的崩潰電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laterally diffused metal oxide semiconductor (LDMOS) includes a substrate. A gate electrode is disposed on the substrate. A first gate dielectric layer is disposed between the gate electrode and the substrate. A second gate dielectric layer includes a first part and a second part. A source is embedded in the substrate at one side of the gate electrode. A drain is embedded in the substrate at the other side of the gate electrode. The second part of the second gate dielectric layer is extended toward the drain along a horizontal direction. The first part is covered by the gate electrode, and the second part is not covered by the gate electrode. Along the horizontal direction, the first part has a first length, and the second part has a second length. The second length is adjustable for adjusting the breakdown voltage of the LDMOS.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基底</p>  
        <p type="p">12:第一深摻雜井</p>  
        <p type="p">14:第二閘極介電層</p>  
        <p type="p">16:第二深摻雜井</p>  
        <p type="p">18:飄移區</p>  
        <p type="p">20:第一閘極介電層</p>  
        <p type="p">22:閘極電極</p>  
        <p type="p">24:體區</p>  
        <p type="p">26a:源極</p>  
        <p type="p">26b:汲極</p>  
        <p type="p">28:金屬矽化物阻擋層</p>  
        <p type="p">30:多晶矽層</p>  
        <p type="p">32:金屬矽化物層</p>  
        <p type="p">100:橫向擴散金屬氧化物半導體</p>  
        <p type="p">141:第一部分</p>  
        <p type="p">142:第二部分</p>  
        <p type="p">283:第三部分</p>  
        <p type="p">304:第四部分</p>  
        <p type="p">L1:第一長度</p>  
        <p type="p">L2:第二長度</p>  
        <p type="p">L3:第三長度</p>  
        <p type="p">L4:第四長度</p>  
        <p type="p">L5:第五長度</p>  
        <p type="p">X:水平方向</p>  
        <p type="p">Y:垂直方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="8" publication-number="202613465"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613465.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613465</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135050</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水氣冷式冷凝器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">F24F13/26</main-classification>  
        <further-classification edition="200601120241230B">F24F13/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張國群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張國群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘俞宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種水氣冷式冷凝器，主要包括:外管、內管、散熱結構及散熱設備，其中外管界定有空間且兩端分別設置與空間連通的輸出管及輸入管，內管設置於空間且與外管之間形成供流通高壓流體的輸送道，而內管流通的冷卻水則溫度低於高壓流體溫度，冷卻水由內管兩端的入水管及出水管輸送循環，散熱結構主要包覆於外管的壁面以供增加高壓流體散熱的散熱表面，散熱設備產生的對流空氣朝向散熱結構並降低散熱表面溫度，藉由內管水冷與外管氣冷二種型態運作散熱達成節水節能的冷卻成效，進而讓高壓高溫的流體溫度，能在多種環境與條件下快速降低，並且提升更好的冷卻效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:水氣冷式冷凝器</p>  
        <p type="p">101:輸出管</p>  
        <p type="p">102:輸入管</p>  
        <p type="p">105:連通管</p>  
        <p type="p">120:入水管</p>  
        <p type="p">122:出水管</p>  
        <p type="p">14:散熱結構</p>  
        <p type="p">16:散熱設備</p>  
        <p type="p">2:架體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="9" publication-number="202614612"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614612.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614612</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135052</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>立體影像格式轉換方法與立體影像格式轉換系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR CONVERTING STEREOSCOPIC IMAGE FORMAT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250102B">H04N13/139</main-classification>  
        <further-classification edition="201801120250102B">H04N13/172</further-classification>  
        <further-classification edition="201801120250102B">H04N13/178</further-classification>  
        <further-classification edition="201901120250102B">G06F16/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚勝雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, SHENG-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹淩帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, LING-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種立體影像格式轉換方法與立體影像格式轉換系統。立體影像格式轉換方法包括下列步驟。接收對一資料夾下達的一影像格式轉換指令，而此資料夾包括多個影像媒體檔案。根據各個影像媒體檔案的檔案資訊，判斷各個影像媒體檔案是否為第一立體檔案格式或第二立體檔案格式。反應於多個影像媒體檔案中的第一影像媒體檔案為第一立體檔案格式，將第一影像媒體檔案自第一立體檔案格式轉換為第二立體檔案格式。反應於多個影像媒體檔案中的第一影像媒體檔案為第二立體檔案格式，將第一影像媒體檔案自第二立體檔案格式轉換為第一立體檔案格式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and a system for converting stereoscopic image format are provided. The method includes the following steps. An image format conversion command to a folder is received, and the folder contains multiple image media files. Based on file information of each image media file, whether each image media file is in a first stereo file format or a second stereo file format is determined. In response to the first image media file being in the first stereo file format, the first image media file is converted from the first stereo file format to the second stereo file format. In response to the first image media file being in the second stereo file format, the first image media file is converted from the second stereo file format to the first stereo file format.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210~S240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="10" publication-number="202612939"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612939.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612939</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135059</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>補強裝置與包含其之車門把手組件</chinese-title>  
        <english-title>REINFORCEMENT DEVICE AND CAR DOOR HANDLE ASSEMBLY INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240927B">B60N5/00</main-classification>  
        <further-classification edition="200601120240927B">E05B1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虎山實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUSHAN AUTOPARTS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳映志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHING-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇長生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHANG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明主要揭示一種補強裝置，其用以組裝至一車門把手，從而和該車門把手一同組成一車門把手組件。依據本發明之設計，該補強裝置包括一L形蓋件與一內板，其中該L形蓋件包括一第一板與連接該第一板的一第二板。具體地，該第一板覆蓋該車門把手的一端邊，該第二板覆蓋該車門把手的一表面，且該內板夾置於該第一板與該車門把手的該端邊之間。如此，在利用所述補強裝置包覆該車門把手的該端邊與該表面的情況下，該補強裝置可以有效減少外力對於該車門把手的作用，藉此方式延長該車門把手的使用壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a reinforcement device for attaching to a car door handle so as to form a car door handle assembly. The reinforcement device comprises a L-shaped cover member and an inner plater, of which the L-shaped cover member consists of a first plate and a second plate. Specifically, the first plate covers one end side of the car door handle, the second plate covers one surface of the car door handle, and the inner plate is disposed between the first plate and the end side. Therefore, in case of the end side and the surface of the car door handle being covered by the reinforcement device, an impact of an external force applied onto the car door handle can be buffered by the reinforcement device, such that a service life of the car door handle is hence prolonged.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:補強裝置</p>  
        <p type="p">11:L形蓋件</p>  
        <p type="p">111:第一板</p>  
        <p type="p">1110:第一彎折部</p>  
        <p type="p">1111:淺凹槽部</p>  
        <p type="p">1113:第三螺孔</p>  
        <p type="p">112:第二板</p>  
        <p type="p">1120:凹陷部</p>  
        <p type="p">1126:第六螺孔</p>  
        <p type="p">1127:第七螺孔</p>  
        <p type="p">12:內板</p>  
        <p type="p">120:第二彎折部</p>  
        <p type="p">122:第二螺孔</p>  
        <p type="p">2:車門把手</p>  
        <p type="p">20:凹槽</p>  
        <p type="p">204:第四螺孔</p>  
        <p type="p">S1:第一螺固件</p>  
        <p type="p">S2:第二螺固件</p>  
        <p type="p">S3:第三螺固件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="11" publication-number="202614524"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614524.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614524</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135069</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電力線材</chinese-title>  
        <english-title>POWER CABLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241219B">H02G15/02</main-classification>  
        <further-classification edition="200601120241219B">H02G15/08</further-classification>  
        <further-classification edition="200601120241219B">H01B9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佳必琪國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JESS-LINK PRODUCTS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張旭峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSU FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帥貞雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHUAI, ZHEN XIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電力線材，其包含一連接器、一第一線束、一第二線束及一限位件。連接器包含一絕緣座、一第一導體及一第二導體，第一導體及第二導體埋設在絕緣座。第一線束包含一第一焊接端，第一焊接端連接第一導體。第二線束包含一第二焊接端，第二焊接端連接第二導體。限位件包含一第一限位環及一第二限位環，第一限位環環繞第一焊接端，第二限位環環繞第二焊接端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure is directed to a power cable having a connector, a first wire harness, a second wire harness and a limiting member. The connector has an insulative base, a first conductor and a second conductor. The first conductor and the second conductor are embedded in the insulative base. The first wire harness has a first welding end, and the first welding end is connected to the first conductor. The second wire harness has a second welding end, and the second welding end is connected to the second conductor. The limiting member has a first limiting ring and a second limiting ring. The first limiting ring surrounds the first welding end, and the second limiting ring surrounds the second welding end.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:連接器</p>  
        <p type="p">110:絕緣座</p>  
        <p type="p">111:第一舌部</p>  
        <p type="p">112:第二舌部</p>  
        <p type="p">121:第一導體</p>  
        <p type="p">121a:第一電力端子</p>  
        <p type="p">122:第二導體</p>  
        <p type="p">122a:第二電力端子</p>  
        <p type="p">210:第一線束</p>  
        <p type="p">210a:第一焊接端</p>  
        <p type="p">211:第一電力線</p>  
        <p type="p">212:第一絕緣覆層</p>  
        <p type="p">220:第二線束</p>  
        <p type="p">220a:第二焊接端</p>  
        <p type="p">221:第二電力線</p>  
        <p type="p">222:第二絕緣覆層</p>  
        <p type="p">231:第一絕緣套</p>  
        <p type="p">232:第二絕緣套</p>  
        <p type="p">300:限位件</p>  
        <p type="p">310:第一限位環</p>  
        <p type="p">320:第二限位環</p>  
        <p type="p">330:架橋</p>  
        <p type="p">334:夾具</p>  
        <p type="p">411:第一訊號端子</p>  
        <p type="p">412:第二訊號端子</p>  
        <p type="p">421:第一訊號線</p>  
        <p type="p">422:第二訊號線</p>  
        <p type="p">511:第一屏蔽端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="12" publication-number="202614703"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614703.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614703</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135086</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配電裝置和伺服器系統</chinese-title>  
        <english-title>POWER DISTRIBUTION DEVICE AND SERVER SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H05K7/12</main-classification>  
        <further-classification edition="200601120241202B">H05K7/14</further-classification>  
        <further-classification edition="200601120241202B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>耿朝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENG, ZHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田光召</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, GUANG-ZHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宏州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HONG-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俞帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種配電裝置以及伺服器系統。配電裝置包括殼體、配電模組、配電連接器及交流電連接模組。殼體的內腔並列開設有至少2個第一槽位；配電模組與第一槽位的數目相同，並且分別裝設於第一槽位內，配電模組的各個第一插拔結構組合成第一插接部；配電連接器與配電模組的數目相同，配電連接器的各個第二插拔結構組合成第二插接部；交流電連接模組裝設於內腔，用於外接高壓交流電並與電源供應器電連接。上述方案透過將各個配電模組裝設於殼體的空腔內，實現了配電模組的模組化，一方面有助於進行配電模組的模組化管理並提高了空間利用率，另一方面使得各個第一插拔結構組合成第一插接部，有助於模組化地進行插拔操作，降低了維修的難度及成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a power distribution device and a server system. The power distribution device includes a housing, multiple power distribution modules, multiple power distribution connectors and an AC connection module. An inner chamber of the casing is provided with at least 2 first slots arranged side by side. The number of the power distribution modules is the same as that of the first slots, and the power distribution modules are respectively installed in the first slots. Each first plug structure of the power distribution modules is combined into a first plug part. The number of the power distribution connectors and the power distribution modules is the same, and each second plug structure of the power distribution connectors is combined into a second plug part. The AC connection module is installed in the inner chamber, and is configured to connect to external high-voltage alternating current and electrically connect to a power supply. The above solution realizes the modularization of the power distribution modules by installing each power distribution module in the inner chamber of the casing. On the one hand, it facilitates the modular management of the power distribution modules and improves the space utilization. On the other hand, each first plug structure is combined into the first plug part, which helps to perform modular plug-in operations and reduces the difficulty and cost of operation and maintenance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:配電裝置</p>  
        <p type="p">100:殼體</p>  
        <p type="p">100a:內腔</p>  
        <p type="p">100b:第一槽位</p>  
        <p type="p">110:第一插孔</p>  
        <p type="p">120:第二插孔</p>  
        <p type="p">130:第三插孔</p>  
        <p type="p">140:凸起結構</p>  
        <p type="p">200:配電模組</p>  
        <p type="p">210:第一插拔結構</p>  
        <p type="p">200a:第一插接部</p>  
        <p type="p">300:配電連接器</p>  
        <p type="p">300a:第二插接部</p>  
        <p type="p">310:第二插拔結構</p>  
        <p type="p">400:交流電連接模組</p>  
        <p type="p">L1:第一方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="13" publication-number="202613475"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613475.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613475</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135092</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙冷板液冷散熱系統</chinese-title>  
        <english-title>DUAL COLD PLATE LIQUID COOLING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">F28D1/06</main-classification>  
        <further-classification edition="200601120241104B">H05K7/20</further-classification>  
        <further-classification edition="200601120241104B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳昂湃技術股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APALTEK CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖啟能</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, QINENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭達高</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, DA GAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒馳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱俊春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIU, JUN CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請為一種雙冷板液冷散熱系統，包括第一冷板結構、第二冷板結構及進排水結構，第一冷板結構內部具有第一輸水流道且其包括第一主散熱部及第一副散熱部，第一主散熱部具有與第一輸水流道連通的熱交換腔室及在熱交換腔室內設有鰭片，第一副散熱部環設在第一主散熱部的外周圍；第二冷板結構相應於第一冷板結構配置且其內部具有第二輸水流道；進排水結構連通第一輸水流道和第二輸水流道。藉此，不僅能夠提升整體的散熱效能且組裝容易。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dual cold plate liquid cooling system includes a first cold plate structure, a second cold plate structure and an inlet and drainage structure. The first cold plate structure includes a first water flow channel, a first main heat dissipation portion and a first secondary heat dissipation portion. The first main heat dissipation portion having a heat exchange chamber that is communicated with the first water flow channel and is provided with fins in the heat exchange chamber. The first secondary heat dissipation portion is located around the outer periphery of the first main heat dissipation portion. The second cold plate structure corresponds to the first cold plate structure configuration and having a second water channel. The inlet and drainage structure are connected to the first water flow channel and the second water flow channel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一冷板結構</p>  
        <p type="p">111:下T形部</p>  
        <p type="p">112:凸條</p>  
        <p type="p">119:導熱板</p>  
        <p type="p">12:罩蓋</p>  
        <p type="p">129:支撐柱</p>  
        <p type="p">13:水嘴</p>  
        <p type="p">14:防漏環圈</p>  
        <p type="p">20:第二冷板結構</p>  
        <p type="p">21:螺柱</p>  
        <p type="p">22:螺栓</p>  
        <p type="p">70:顯示卡模組</p>  
        <p type="p">71:電路板</p>  
        <p type="p">72:圖形處理器</p>  
        <p type="p">73:記憶體</p>  
        <p type="p">80:導熱墊</p>  
        <p type="p">C:主散熱部</p>  
        <p type="p">D:第一副散熱部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="14" publication-number="202613877"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613877.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613877</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135093</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>企業輿情偵測系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241101B">G06F40/20</main-classification>  
        <further-classification edition="201901120241101B">G06F16/90</further-classification>  
        <further-classification edition="202301120241101B">G06Q40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國泰世華商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CATHAY UNITED BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉浩翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高秋蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王弈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王政雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳瑞俞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林季葦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種企業輿情偵測系統，包含一處理單元。其中，該處理單元將多筆新聞資料分類成至少一包含該等新聞資料的新聞類別。並且該處理單元藉由一自然語言模型對該新聞類別中的該等新聞資料進行分析，而產生分別對應於該等新聞資料的多個重要詞組。該處理單元將一詞語資料庫的多筆詞句資料及對應於該等新聞資料的該等重要詞組輸入一辨識模型進行分析，以產生該等新聞資料中對應於該新聞類別的多個關鍵詞。該處理單元根據該等關鍵詞產生多個輿情資訊，並將每一該輿情資訊的一數量與該閾值進行比對，當該處理單元判斷該數量的值大於該閾值時，該處理單元產生一風險清單。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:企業輿情偵測系統</p>  
        <p type="p">2:通訊單元</p>  
        <p type="p">3:儲存單元</p>  
        <p type="p">4:處理單元</p>  
        <p type="p">8:資料來源端伺服器</p>  
        <p type="p">9:內部伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="15" publication-number="202613066"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613066.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613066</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135094</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生物基雙酚及其衍生之寡聚（２，６—二甲基苯醚）、其製備方法、其固化及應用</chinese-title>  
        <english-title>BIO-BASED BIPHENOL AND OLIGO(2,6-DIMETHYL PHENYLENE ETHER) DERIVATIVES THEREOF, PREPARATION METHOD THEREOF, CURING, AND APPLICATIONS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">C07C37/14</main-classification>  
        <further-classification edition="200601120250501B">C07C39/17</further-classification>  
        <further-classification edition="200601120250501B">C08G65/48</further-classification>  
        <further-classification edition="200601120250501B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中興大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNG HSING UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林慶炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHING-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭祺興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHI-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王奕程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, I-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李奕廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古乃任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種生物基雙酚及其衍生之寡聚(2,6-二甲基苯醚)、其製備方法、其固化及應用。生物基雙酚具有式(I)所示之結構，且衍生之寡聚(2,6-二甲基苯醚)具有式(II)所示之結構，式(I)及式(II)中各符號如說明書中所定義者。其所製備的固化物具有低介電損失特性可作為高頻電路板基材的製作材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Bio-based biphenols and oligo(2,6-dimethyl phenylene ether) derivatives, preparation method, curing, and applications are reported. The bio-based biphenols and oligo(2,6-dimethyl phenylene ether) derivatives, have structure represented by formulae (I) and (II), respectively, in which the symbols are defined as specified in the specification. The cured products prepared therefrom possess low dielectric loss characteristics, making them suitable as materials for the manufacture of high-frequency circuit board substrates.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="16" publication-number="202613896"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613896.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613896</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135098</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶片封膠缺陷預測方法</chinese-title>  
        <english-title>METHOD FOR PREDICTING DEFECTS IN DIE MOLDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250227B">G06N20/20</main-classification>  
        <further-classification edition="200601120250227B">H01L21/56</further-classification>  
        <further-classification edition="200601120250227B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立高雄大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY OF KAOHSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張保榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, BAO RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳家甄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIA-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶片封膠缺陷預測方法，用以解決習知封膠製程中膠缺陷的問題。該方法係包含：匯入一生產資料，該生產資料包含多個封膠製程參數及相對應各該封膠製程參數之一真實良率；對生產資料進行一特徵重要性分析，以識別影響真實良率的一關鍵參數；利用關聯於關鍵參數的多個生產資料，訓練一深度學習模型；及利用訓練完成的深度學習模型，輸入一機台在封膠過程的關鍵參數，並輸出相對應的一預測良率，藉以調整機台的關鍵參數，以減少膠缺陷情況。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for predicting defects in die molding is adapted to solve the problem of encapsulation defects in conventional molding processes. The method includes importing production data that contains multiple molding process parameters and their corresponding actual yield; performing feature importance analysis on the production data to identify key parameters that affect the actual yield; using multiple production data related to the key parameters to train a deep learning model; and utilizing the trained deep learning model to input key parameters of a machine during a molding process and output the corresponding predicted yield to adjust the molding process parameters to reduce the situation of molding defects.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="17" publication-number="202613420"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613420.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613420</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135099</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>安全掛鈎結構</chinese-title>  
        <english-title>SAFETY HOOK STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">F16B45/00</main-classification>  
        <further-classification edition="200601120241129B">A62B35/00</further-classification>  
        <further-classification edition="200601120241129B">F16B19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭惠文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, HUI WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭惠文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, HUI WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案係一種安全掛鈎結構，包括鉤體、鎖桿組及鎖筒。鉤體具有開口，鉤體包含位在開口二側的樞接段及定位段，且定位段設置有扣槽及凸塊。鎖桿組包含連桿及軸桿，連桿設有樞孔及卡掣部，連桿透過軸桿穿設樞孔而樞接樞接段作樞轉、並透過卡掣部卡掣扣槽而封閉開口。鎖筒可活動地套置在連桿外，鎖筒在面向定位段的一側設置有鎖固槽，且鎖固槽中容置有凸塊而不致令鎖筒產生旋轉；藉此避免連桿在繩索的拉力作用下發生鬆動或開鎖的情況，增加使用時的安全性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A safety hook structure includes a hook body, a lock rod set and a lock cylinder. The hook body has an opening, and the hook body includes a pivot section and a positioning section located on two sides of the opening, and the positioning section is provided with a buckle groove and a bump. The lock rod set includes a connecting rod and a shaft. The connecting rod is provided with a pivot hole and a latch part. The connecting rod pivots with the pivot section through the shaft rod inserting the pivot hole for pivoting, and close the opening through the latch part engaging with the buckle groove. The lock cylinder is movably disposed outside the connecting rod. The lock cylinder is provided with a locking groove on the side facing the positioning section, and the bum is accommodated in the locking groove to prevent the lock cylinder from rotating.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:安全掛鈎結構</p>  
        <p type="p">2:繩索</p>  
        <p type="p">10:鉤體</p>  
        <p type="p">11:樞接段</p>  
        <p type="p">12:定位段</p>  
        <p type="p">121:扣槽</p>  
        <p type="p">122:凸塊</p>  
        <p type="p">20:鎖桿組</p>  
        <p type="p">21:連桿</p>  
        <p type="p">212:卡掣部</p>  
        <p type="p">221:軸頭</p>  
        <p type="p">30:鎖筒</p>  
        <p type="p">31:鎖固槽</p>  
        <p type="p">32:卡槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="18" publication-number="202612855"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612855.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612855</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135103</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有校正扭力功能之電動工具系統</chinese-title>  
        <english-title>ELECTRIC TOOL SYSTEM WITH TORQUE-CORRECTING FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241030B">B25B23/147</main-classification>  
        <further-classification edition="200601120241030B">G01L3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瞬豐實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATATAKITOYO TOOL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳逸民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YI MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有校正扭力功能之電動工具系統，包含一電動工具裝置及一倍力器裝置；該倍力器裝置係組裝至該電動工具裝置；該倍力器裝置被配置為傳送一扭力測試數據及一扭力原始數據至該電動工具裝置；該電動工具裝置被配置為計算該扭力測試數據及該扭力原始數據以得到一扭力校正數據；該電動工具裝置被配置為依據該扭力校正數據驅動該倍力器裝置轉動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electric tool system with a torque-correcting function includes an electric tool apparatus and a force multiplier apparatus. The force multiplier apparatus is assembled to the electric tool apparatus. The force multiplier apparatus is configured to transmit a torque test data and a torque original data to the electric tool apparatus. The electric tool apparatus is configured to calculate the torque test data and the torque original data to obtain a torque correction data. The electric tool apparatus is configured to drive the force multiplier apparatus to rotate based on the torque correction data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:具有校正扭力功能之電動工具系統</p>  
        <p type="p">20:倍力器裝置</p>  
        <p type="p">30:電動工具裝置</p>  
        <p type="p">30a:控制電路</p>  
        <p type="p">30b:資料接收器</p>  
        <p type="p">40:工作物</p>  
        <p type="p">105:扭力測試數據</p>  
        <p type="p">106:扭力原始數據</p>  
        <p type="p">107:扭力校正數據</p>  
        <p type="p">201:倍力器出力端結構</p>  
        <p type="p">202:齒輪組</p>  
        <p type="p">203:倍力器入力端結構</p>  
        <p type="p">204:倍力器端訊號傳遞電路</p>  
        <p type="p">205:倍力器端記憶體</p>  
        <p type="p">206:處理器</p>  
        <p type="p">301:工具出力端結構</p>  
        <p type="p">302:動力傳輸組</p>  
        <p type="p">303:工具端訊號傳遞電路</p>  
        <p type="p">304:工具端記憶體</p>  
        <p type="p">305:使用者介面</p>  
        <p type="p">306:扭力需求數據</p>  
        <p type="p">1061:變矩係數數據</p>  
        <p type="p">1062:最大輸出扭力數據</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="19" publication-number="202613963"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613963.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613963</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135104</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>派車系統及派車方法</chinese-title>  
        <english-title>CAR DISPATCHING SYSTEM AND CAR DISPATCHING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250102B">G06Q50/40</main-classification>  
        <further-classification edition="202401120250102B">G06Q50/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>榮成紙業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LONG CHEN PAPER CO.,LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林言彌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YEN MI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種派車方法，包括：於進入派車程序時從資料庫中獲得交貨日期符合條件的複數訂單；依據複數訂單之一的內容判斷是否有可添加的派車單，其中派車系統於既有派車單指定的車型與訂單對應的車型限制相符時判斷有可添加的派車單；於不具有可添加的派車單時建立新的派車單；於具有可添加的派車單時依據訂單內容更新派車單；於複數訂單皆確認完成前持續更新既有派車單或建立新的派車單；及，於複數訂單皆確認完成後輸出一或多張派車單。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A car dispatching method is disclosed and includes: retrieving multiple delivery orders from a database when starting a dispatching procedure, wherein each delivery order records a delivery date satisfying a condition; determining whether an addable dispatch order is currently existed according to the content of one of the multiple delivery orders, wherein the dispatch order is determined to be addable and existed when a car model designated by the dispatch order matches with a car-model restriction corresponding to the delivery order; establishing a new dispatch order for the delivery order when no addable dispatch order exists; updating the dispatch order according to the content of the delivery order when it exists; continuously updating current-existed dispatch order(s) or establishing new dispatch order(s) until all the delivery orders are confirmed; and, outputting one or more dispatch orders after the multiple delivery orders are finished confirming.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S51~S57:派車步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="20" publication-number="202613673"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613673.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613673</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135107</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示設備及其驅動裝置與極性調整方法</chinese-title>  
        <english-title>DISPLAY EQUIPMENT, DRIVING DEVICE AND POLARITY ADJUSTMENT METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">G02F1/133</main-classification>  
        <further-classification edition="200601120241129B">G09G3/36</further-classification>  
        <further-classification edition="200601120241129B">G09G5/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向瑞傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIANG, JUI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種顯示設備及其驅動裝置與顯示面板的極性調整方法。驅動裝置基於當下極性模式將當下影像幀的每一個子像素的灰階資料轉換為灰階電壓值。驅動裝置基於所述每一個子像素的灰階電壓值而沿顯示面板的資料線方向計算所述每一個子像素的電壓切換量。驅動裝置使用所述每一個子像素的電壓切換量計算當下極性模式的耦合雜訊評分值。驅動裝置基於耦合雜訊評分值決定是否調整當下極性模式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a display equipment, a driving device thereof, and a polarity adjustment method for a display panel. The driving device converts the grayscale data of each sub-pixel of a current image frame into a grayscale voltage value based on a current polarity pattern. The driving device calculates a voltage toggle amount of each sub-pixel along a data line direction of the display panel based on the grayscale voltage value of each sub-pixel. The driving device uses the voltage toggle amount of each sub-pixel to calculate a coupling noise score value of the current polarity pattern. The driving device determines whether to adjust the current polarity pattern based on the coupling noise score value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310~S340:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="21" publication-number="202613681"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613681.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613681</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135108</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抑制漏光層與顯示面板</chinese-title>  
        <english-title>LIGHT LEAKAGE SUPPRESSION LAYER AND DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G02F1/1335</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何品緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, PIN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡玉堂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YUTANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田堃正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIEN, KUN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林世雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種抑制漏光層，包括彼此分隔的多個柱狀結構。在抑制漏光層的俯視圖中，柱狀結構符合以下排列規則：柱狀結構中的每一者以及與其之間具有固定間距A的所有柱狀結構中的其他者以多條虛擬連線連接以構成多個擬多邊形，其中虛擬連線具有相等長度，且其中柱狀結構位於擬多邊形的角及/或邊上，且擬多邊形包括多種不同的形狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light leakage suppression layer includes a plurality of columnar structures separated from each other. In the top view of the light leakage suppression layer, the columnar structures follow the following arrangement rules: each of the columnar structures, along with all other columnar structures with a fixed spacing A between them, are connected by multiple virtual lines to form multiple hypothetical polygons, where the virtual lines have equal lengths. The columnar structures are located at the corners and/or edges of the hypothetical polygons, and the hypothetical polygons include various different shapes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示面板</p>  
        <p type="p">100:抑制漏光層</p>  
        <p type="p">110:柱狀結構</p>  
        <p type="p">120:透明層</p>  
        <p type="p">200:第一透明基板</p>  
        <p type="p">300:多個發光元件</p>  
        <p type="p">400:光學膠層</p>  
        <p type="p">500:第二透明基板</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">H:高度</p>  
        <p type="p">P1,P2:間距</p>  
        <p type="p">W:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="22" publication-number="202612961"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612961.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612961</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135111</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自行車龍頭可切換式避震結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">B62K19/32</main-classification>  
        <further-classification edition="200601120241029B">B62K21/20</further-classification>  
        <further-classification edition="200601120241029B">B62K21/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈞成金屬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許耿禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種自行車龍頭可切換式避震結構，其前龍頭與後龍頭樞結部結合，可以相對產生一範圍樞轉，該後龍頭與該前龍頭間並設置一彈性元件推抵，使該前龍頭與該後龍頭產生一角度的彈性擺動；一切換機構設置於該前龍頭與該後龍頭之間，利用操作切換該切換機構令該前龍頭與該後龍頭無法樞轉，或操作切換令該前龍頭與該後龍頭可以樞轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:前龍頭</p>  
        <p type="p">11:前樞結部</p>  
        <p type="p">12:前定位部</p>  
        <p type="p">13:容置槽</p>  
        <p type="p">14:開口</p>  
        <p type="p">15:結合孔</p>  
        <p type="p">16:限位件</p>  
        <p type="p">17:前上檔部</p>  
        <p type="p">18:把手桿</p>  
        <p type="p">20:後龍頭</p>  
        <p type="p">21:後樞結部</p>  
        <p type="p">22:後定位部</p>  
        <p type="p">23:卡結部</p>  
        <p type="p">24:後上檔部</p>  
        <p type="p">25:前叉上管</p>  
        <p type="p">30:樞軸</p>  
        <p type="p">40:彈性元件</p>  
        <p type="p">50:切換機構</p>  
        <p type="p">51:操作部</p>  
        <p type="p">52:限位部</p>  
        <p type="p">53:卡固部</p>  
        <p type="p">54:通過部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="23" publication-number="202612807"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612807.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612807</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135114</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>軋機耐磨板之更換裝置</chinese-title>  
        <english-title>DEVICE FOR REPLACING WEAR PLATE OF ROLLING MILL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B21B31/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>單祥霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAN, HSIANG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱韋霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CIOU, WEI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種軋機耐磨板之更換裝置，包含基座、支撐架、二滑軌、以及二鎖固元件。基座具有彼此相對之第一側面與第二側面。支撐架立設於基座上且鄰近第一側面。支撐架配置以承托軋機之耐磨板。耐磨板具有二第一通孔、以及二第二通孔位於第一通孔之下方。支撐架具有二滑軌孔分別與第一通孔對應、以及二鎖固孔分別與第二通孔對應。二滑軌配置以分別穿設於對應之滑軌孔與第一通孔中。耐磨板可在滑軌上滑動於支撐架與軋機之間。二鎖固元件配置以分別穿鎖於對應之鎖固孔與第二通孔中，以將耐磨板固定在支撐架上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for replacing a wear plate of a rolling mill includes a base, a support frame, two slide rails, and two locking elements. The base has a first side surface and a second side surface, which are opposite to each other. The support frame is erected on the base and adjacent to the first side surface. The support frame is configured to support the wear plate of the rolling mill. The wear plate has two first through holes and two second through holes that are located below the first through holes. The support frame has two slide rail holes corresponding to the first through holes, and two locking holes corresponding to the second through holes. The two slide rails are configured to pass through the corresponding slide rail holes and the first through holes respectively. The wear plate can slide on the slide rails between the support frame and the rolling mill. The two locking elements are configured to penetrate and be locked in the corresponding locking holes and the second through holes respectively to fix the wear plate on the support frame.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:軋機耐磨板之更換裝置</p>  
        <p type="p">200:基座</p>  
        <p type="p">202:第一側面</p>  
        <p type="p">204:第二側面</p>  
        <p type="p">206:頂面</p>  
        <p type="p">210:配重塊</p>  
        <p type="p">300:支撐架</p>  
        <p type="p">302:滑軌孔</p>  
        <p type="p">304:鎖固孔</p>  
        <p type="p">330:托架</p>  
        <p type="p">400:滑軌</p>  
        <p type="p">500:鎖固元件</p>  
        <p type="p">600:斜撐柱</p>  
        <p type="p">700:高程微調器</p>  
        <p type="p">BP:底部</p>  
        <p type="p">TH1:第一通孔</p>  
        <p type="p">TH2:第二通孔</p>  
        <p type="p">WP:耐磨板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="24" publication-number="202614373"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614373.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614373</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135116</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子封裝件及其製法</chinese-title>  
        <english-title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240926B">H01L23/28</main-classification>  
        <further-classification edition="200601120240926B">H01L21/56</further-classification>  
        <further-classification edition="200601120240926B">G02B6/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽品精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>符毅民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, YI-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何祈慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, CHI CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王愉博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子封裝件及其製法，該電子封裝件包括承載結構、電子元件、橋接元件、包覆層、以及光子元件。該承載結構具有相對之第一表面與第二表面。該電子元件設於該承載結構之第二表面，以電性連接該承載結構。該橋接元件設於該承載結構之第二表面，以電性連接該承載結構。該包覆層包覆該電子元件與該橋接元件。該光子元件設於該包覆層之一表面上，且電性連接該橋接元件。該電子封裝件及其製法係於完成該包覆層之形成與研磨後再設置該光子元件，以避免該包覆層覆蓋該光子元件，進而避免污染或損毀該光子元件之光發射器與光接收器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic package and a manufacturing method thereof are provided. The electronic package includes a carrier structure, an electronic component, a bridge component, an encapsulation layer, and a photonic component. The carrier structure has a first surface and a second surface opposite each other. The electronic component is disposed on the second surface of the carrier structure and is electrically connected to the carrier structure. The bridge component is disposed on the second surface of the carrier structure and is electrically connected to the carrier structure. The encapsulation layer covers the electronic component and the bridge component. The photonic component is disposed on a surface of the encapsulation layer and is electrically connected to the bridge component. The electronic package and its manufacturing method finish the forming and the polishing of the encapsulation layer and then dispose the photonic component, so as to prevent the encapsulation layer from covering the photonic component, and thus to avoid contamination or damage to the light transmitters and the light receivers of the photonic component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子封裝件</p>  
        <p type="p">11:承載結構</p>  
        <p type="p">111:絕緣層</p>  
        <p type="p">112:線路層</p>  
        <p type="p">12:導電體</p>  
        <p type="p">15:電子元件</p>  
        <p type="p">16:第一導電元件</p>  
        <p type="p">21:橋接元件</p>  
        <p type="p">211:第二導電元件</p>  
        <p type="p">212:導電接點</p>  
        <p type="p">213:導電通孔</p>  
        <p type="p">22:第一底膠</p>  
        <p type="p">31:包覆層</p>  
        <p type="p">51:光子元件</p>  
        <p type="p">51a:第一表面</p>  
        <p type="p">51b:第二表面</p>  
        <p type="p">511:光發射器或光接收器</p>  
        <p type="p">52:第三導電元件</p>  
        <p type="p">53:第二底膠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="25" publication-number="202614431"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614431.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614431</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135117</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子封裝件及其製法</chinese-title>  
        <english-title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">H01L23/528</main-classification>  
        <further-classification edition="200601120241007B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽品精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱彥瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, YEN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宗俞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TSUNG YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡中信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, TSUNG XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝昌谷遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIE, CHANG KU YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子封裝件及其製法，主要於基板結構上配置電子元件與被動元件，再以包覆層包覆該電子元件及該被動元件，並於該包覆層中形成外露出該被動元件之接地端的開孔，以及於該開孔中形成電性連接該被動元件之導電材，之後於該包覆層上設有電性連接該導電材之金屬件，據此，令該金屬件與該被動元件之接地端可透過該導電材電性連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic package and its manufacturing method, which configures an electronic component and a passive component on a substrate structure, then covers the electronic component and the passive component with a covering layer, and forms an opening in the covering layer to expose the ground terminal of the passive component, and a conductive material electrically connected to the passive component is formed in the opening, and then a metal piece is provided on the covering layer to electrically connect the conductive material, whereby the metal piece and the ground terminal of the passive component can be electrically connected through the conductive material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子封裝件</p>  
        <p type="p">10:基板結構</p>  
        <p type="p">11:電子元件</p>  
        <p type="p">12:被動元件</p>  
        <p type="p">121:第一電極端</p>  
        <p type="p">13:包覆層</p>  
        <p type="p">14:導電材</p>  
        <p type="p">15:金屬件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="26" publication-number="202613948"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613948.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613948</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135126</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>淨零轉型利率定價系統及其方法</chinese-title>  
        <english-title>NET ZERO TRANSITION INTEREST RATE PRICING SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241101B">G06Q40/03</main-classification>  
        <further-classification edition="201201120241101B">G06Q40/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣土地銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAND BANK OF TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝依雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, YI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種淨零轉型利率定價系統，包括需求分析模組、資訊整合模組、評分計算模組及利率定價模組。上述需求分析模組用以根據客戶淨零轉型資訊分析客戶需求，產生客戶淨零需求資訊。上述資訊整合模組用以收集並整合淨零轉型相關資訊，產生淨零轉型商機表。上述評分計算模組根據客戶淨零需求資訊及淨零轉型商機表分別對客戶進行評分，產生客戶年度淨零轉型得分資訊。上述利率定價模組根據既有專案資訊列出客戶年度淨零轉型得分資訊適用專案，並計算融資適用利率，產生客戶淨零轉型利率定價資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A net zero transition interest rate pricing system, comprising a demand analysis module, an information integration module, a scoring calculation module, and an interest rate pricing module. The demand analysis module is used to analyze customer needs based on the customer's net zero transition information to generate customer net zero demand information. The information integration module is used to collect and integrate net zero transition-related information to produce a net zero transition business opportunity table. The scoring calculation module scores customers based on the customer net zero demand information and the net zero transition business opportunity table, generating customer annual net zero transition score information. The interest rate pricing module lists applicable projects based on the existing project information and the customer annual net zero transition score information, and calculates the applicable financing interest rate, generating customer net zero transition interest rate pricing information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:淨零轉型利率定價系統</p>  
        <p type="p">110:需求分析模組</p>  
        <p type="p">112:專案資料庫</p>  
        <p type="p">120:資訊整合模組</p>  
        <p type="p">130:評分計算模組</p>  
        <p type="p">140:利率定價模組</p>  
        <p type="p">150:通知判斷模組</p>  
        <p type="p">160:內部資料庫</p>  
        <p type="p">170:外部資料庫</p>  
        <p type="p">180:分行裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="27" publication-number="202613425"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613425.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613425</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135127</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>動力離合裝置以及使用動力離合裝置的擊碎裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">F16D13/58</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力本機械有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡芮綜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝依良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種動力離合裝置以及使用動力離合裝置的擊碎裝置，所述動力離合裝置包括一個外蓋以及複數個摩擦塊，所述外蓋可以調整定位的位置用以改變所述外蓋包括的一個摩擦面與各所述摩擦塊各自包括的一個外周面之間隔開的距離，因而調整各所述摩擦塊與所述外蓋接合與不接合的轉速。所述動力離合裝置可以但不限制與所述擊碎裝置包括的一個刀具部分可連動地結合，透過所述刀具部分的轉速改變由所述動力離合裝置控制是否要將所述刀具部分的動力傳遞至一個進料滾輪，進一步達動控制所述擊碎裝置適當進料速度的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">72:動力離合裝置</p>  
        <p type="p">74:側蓋</p>  
        <p type="p">77:推動部</p>  
        <p type="p">78:摩擦塊</p>  
        <p type="p">79:套接管</p>  
        <p type="p">80:外周面</p>  
        <p type="p">82:嵌槽</p>  
        <p type="p">84:環型彈簧</p>  
        <p type="p">86:外蓋</p>  
        <p type="p">86A:端壁</p>  
        <p type="p">86B:周圍壁</p>  
        <p type="p">86C:槽室</p>  
        <p type="p">86D:連動部</p>  
        <p type="p">86E:抵接部</p>  
        <p type="p">87:墊片</p>  
        <p type="p">88:帶動輪</p>  
        <p type="p">88A:齒部</p>  
        <p type="p">88B:連動段</p>  
        <p type="p">88C:螺紋段</p>  
        <p type="p">88D:套接孔</p>  
        <p type="p">88E:阻擋壁</p>  
        <p type="p">89:摩擦面</p>  
        <p type="p">91:迫緊環</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="28" publication-number="202613946"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613946.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613946</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135129</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>臨櫃交易表單填製助理系統及其方法</chinese-title>  
        <english-title>OVER-THE-COUNTER TRANSACTION FORM FILLING ASSISTANT SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241101B">G06Q40/02</main-classification>  
        <further-classification edition="202301120241101B">G06Q10/06</further-classification>  
        <further-classification edition="200601120241101B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣土地銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAND BANK OF TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林雍晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUNG CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種臨櫃交易表單填製助理系統，包括平板裝置、攝影裝置、收音裝置及交易表單填製裝置。平板裝置用以投放表單或表單結果給客戶觀看。攝影裝置及收音裝置用以接收客戶資訊。交易表單填製裝置包括通訊模組、辨識填寫模組及比對模組。上述通訊模組用以傳輸及接收資訊。上述辨識填寫模組用以根據業務執行請求選擇表單，並透過客戶資訊填寫表單，產生一表單結果。比對模組用以將表單結果與防制洗錢及打擊資恐資訊系統中的名單進行比對，產生一比對結果，並將未命中的表單結果傳輸置對應的業務系統進行業務辦理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A counter transaction form filling assistant system comprises a tablet device, a camera device, a microphone device, and a transaction form filling device. The tablet device is used to display forms or form results for the customer to view. The camera device and microphone device are used to receive customer information. The transaction form filling device includes a communication module, a recognition and filling module, and a comparison module. The communication module is used to transmit and receive information. The recognition and filling module is used to select forms according to business execution requests and to fill in the forms with customer information, generating a form result. The comparison module is used to compare the form result with the lists in the Anti-Money Laundering and Counter-Terrorism Financing Information System, generating a comparison result and transmitting unmatched form results to the corresponding business system for transaction processing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:臨櫃交易表單填製助理系統</p>  
        <p type="p">110:平板裝置</p>  
        <p type="p">112:顯示裝置</p>  
        <p type="p">114:輸入裝置</p>  
        <p type="p">120:交易表單填製裝置</p>  
        <p type="p">122:通訊模組</p>  
        <p type="p">124:辨識填寫模組</p>  
        <p type="p">126:比對模組</p>  
        <p type="p">128:翻譯模組</p>  
        <p type="p">130:攝影裝置</p>  
        <p type="p">140:收音裝置</p>  
        <p type="p">150:行員裝置</p>  
        <p type="p">160:業務系統</p>  
        <p type="p">170:防制洗錢及打擊資恐資訊系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="29" publication-number="202612911"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612911.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612911</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135130</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>噴墨晶片結構</chinese-title>  
        <english-title>INKJET CHIP STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240927B">B41J2/14</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>研能科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICROJET TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫皓然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOU, HAO-JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張正明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHENG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖文雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, WEN-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種噴墨晶片結構，包含：基板層；加熱電阻器，設於基板層上。其中加熱電阻器更包含：加熱層，用以加熱墨水，其中加熱層之材料為多晶矽材料(Polycrystalline Silicon)；介電層，將加熱層包覆於其中；以及，保護層，覆蓋於加熱電阻器上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An inkjet chip structure is disclosed and includes a base layer and a heating resistor. The heating resistor is disposed on the base layer and further comprises a heating layer, a dielectric layer and a protection layer. The heating layer is used for heating ink and is made of polycrystalline silicon. The dielectric layer wraps the heating layer. The protection layer covers the heating resistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:噴墨晶片結構</p>  
        <p type="p">201:基板層</p>  
        <p type="p">202:第一氧化層</p>  
        <p type="p">203:介電層</p>  
        <p type="p">205:加熱層</p>  
        <p type="p">206:連接層</p>  
        <p type="p">207:控制層</p>  
        <p type="p">208:保護層</p>  
        <p type="p">208A:第一保護層</p>  
        <p type="p">208B:第二保護層</p>  
        <p type="p">209:控制電晶體</p>  
        <p type="p">209A:第二氧化層</p>  
        <p type="p">209B:多晶矽層</p>  
        <p type="p">S:源極</p>  
        <p type="p">D:汲極</p>  
        <p type="p">G:閘極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="30" publication-number="202613889"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613889.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613889</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135131</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體內運算(CIM)裝置及其縮放係數的訓練方法</chinese-title>  
        <english-title>COMPUTING IN MEMORY (CIM) DEVICE AND A TRAINING METHOD FOR ITS SCALING COEFFICIENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241202B">G06N3/08</main-classification>  
        <further-classification edition="202301120241202B">G06N3/0464</further-classification>  
        <further-classification edition="200601120241202B">G11C11/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立陽明交通大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張添烜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TIAN-SHEUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林民瀚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MING-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種使用AI模組訓練縮放係數的訓練方法，包含下列步驟：(a)提供一輸入特徵、複數卷積核、以及一第一融合縮放係數，其中每一該複數卷積核具有一權重特徵，且該第一融合縮放係數包括一第一權重縮放係數以及一第一部分和縮放係數；(b)將該權重特徵與該第一融合縮放係數進行一第一縮放運算以獲得一第一縮放權重；以及(c)量化該第一縮放權重以獲得一第一量化權重，並將該第一量化權重與該輸入特徵進行一卷積和運算，以獲得一第一卷積和。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A training method for training scaling coefficients using an AI module, including the following steps: (a) providing an input feature, a plural convolution kernel, and a first fusion scaling coefficient, wherein each of the plural convolution kernel has a weight feature , and the first fusion scaling coefficient includes a first weight scaling coefficient and a first partial sum scaling coefficient; (b) perform a first scaling operation on the weight feature and the first fusion scaling coefficient to obtain a first scaling weight; and (c) quantize the first scaling weight to obtain a first quantized weight, and perform a convolution sum operation on the first quantized weight and the input feature to obtain a first convolution sum.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S40:使用AI模組訓練縮放係數的訓練方法</p>  
        <p type="p">S401~S403:使用AI模組訓練縮放係數的訓練方法的步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="31" publication-number="202613461"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613461.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613461</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135132</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>室內空氣潔淨聯網機制系統</chinese-title>  
        <english-title>INDOOR AIR CLEANING NETWORK MECHANISM SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120240930B">F24F11/72</main-classification>  
        <further-classification edition="201801120240930B">F24F11/58</further-classification>  
        <further-classification edition="201801320240930B">F24F110/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>研能科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICROJET TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫皓然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOU, HAO-JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳錦銓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIN-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃啟峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHI-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種室內空氣潔淨聯網機制系統，包含：多個氣體偵測器，偵測空污；至少一室內空污處理設備；一聯網雲端運算服務裝置；聯網雲端運算服務裝置包含一無線網路雲端運算服務模組、一雲端控制服務單元、一裝置管理單元、一應用程式單元及一生成式人工智慧(AIGC)模型，其中聯網雲端運算服務裝置透過物聯網收來自該氣體偵測器所輸出空氣品質數據，並基於生成式人工智慧模型(AIGC)技術進行分析，根據分析結果發出智能控制指令，以自動調節該室內空污處理設備的運行模式，進行室內場域內循環空污淨化趨零無塵室處理，提供室內場域達到無塵室等級之潔淨度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An indoor air cleaning network mechanism system is disclosed and includes plural air detectors, at least one indoor air pollution processing device, a networked cloud computing service device. The plural air detectors detect air pollution. The networked cloud computing service device includes a wireless network cloud computing service module, a cloud control service unit, a device management unit, an application unit and a generative artificial intelligence (AIGC) model. The networked cloud computing service device receives air quality data outputted from the plural air detectors through an internet of things, analyzes the air quality data by the technology of the generative artificial intelligence (AIGC) model, sends out intelligent control command according to the result of the analyzation to automatically adjust an operation mode of the indoor air pollution processing device for carrying out an air circulation in an indoor area to purify the air pollution to zero to achieve a clean room treatment to provide the indoor area with a clean room level cleanliness.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:氣體偵測器</p>  
        <p type="p">2:室內空污處理設備</p>  
        <p type="p">3:聯網雲端運算服務裝置</p>  
        <p type="p">4:存儲中心</p>  
        <p type="p">5:中控電腦智能控制設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="32" publication-number="202614546"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614546.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614546</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135133</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源開關的控制裝置</chinese-title>  
        <english-title>CONTROL DEVICE OF POWER SWITCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H02M1/12</main-classification>  
        <further-classification edition="200701120241202B">H02M1/32</further-classification>  
        <further-classification edition="200601120241202B">H02M3/156</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杰力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EXCELLIANCE MOS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡銘宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, MING-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡采薇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TSAI WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">電源開關的控制裝置包括放電電流產生器。放電電流產生器耦接在電源開關的控制端與參考電壓間。在使電源開關被關斷的時間區間中，放電電流產生器在第一子時間區間組合第一電流以及第二電流以產生第三電流，並使電源開關的控制端根據第三電流進行放電。放電電流產生器在第二子時間區間僅提供第二電流，並使電源開關的控制端根據第二電流進行放電。其中，第三電流大於第二電流，第一電流在第一子時間區間中隨時間遞減，第二電流為恆定電流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A control device of a power switch includes a discharge current generator. The discharge current generator is coupled between a control end of the power switch and a reference voltage. During a time period for cutting off the power switch, the discharge current generator combines a first current with a second current to generate a third current during a first-sub time period, and set the control end of the power switch to be discharged according to the third current. The discharge current generator merely provides the second current to set the control end of the power switch to be discharged according to the third current during a second-sub time period. The third current is larger than the second current, and the first current decreases with time during the first-sub time period, and the second current is a constant current.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:控制裝置</p>  
        <p type="p">110:放電電流產生器</p>  
        <p type="p">MP:電晶體</p>  
        <p type="p">PSW:電源開關</p>  
        <p type="p">VG:控制電壓</p>  
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">VOUT:輸出電壓</p>  
        <p type="p">VSS:參考電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="33" publication-number="202613854"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613854.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613854</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135134</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多國語言智能語音系統及多國語言智能語音服務之方法</chinese-title>  
        <english-title>MULTILANGUAGE AUTOMATIC VOICE RECOGNITION SYSTEM AND THE METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241202B">G06F21/32</main-classification>  
        <further-classification edition="202001120241202B">G06F40/40</further-classification>  
        <further-classification edition="201301120241202B">G06F3/048</further-classification>  
        <further-classification edition="201201120241202B">G06Q20/40</further-classification>  
        <further-classification edition="202301120241202B">G06Q40/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣土地銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAND BANK OF TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾筱珺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, HSIAO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種多國語言智能語音系統及多國語言智能語音服務之方法，多國語言智能語音系統訊號連接使用者裝置、客戶主機系統、財金公司主機及國際財金主機，用以提供即時的多國語文及語音之辨識與轉換。多國語言智能語音系統包括電性相連接之介面模組；語文語音辨識模組；以及語文語音轉換模組。多國語言智能語音服務之方法則包括下列步驟：接收客戶輸入資料(步驟S110)；辨識客戶國別及身分別(步驟S120)；多國語文語音轉換(步驟S130)；以及語文語音顯示或播報(步驟S140)。藉由本發明之實施，不但可以自動切換成客戶主要使用語言及語音，建立便利的操作介面；減少語言翻譯及系統換版的大量人力作業，降低建置成本；無需找尋切換語系或語音的按鍵，使用電子化通路更加快速方便與節省時間，進而增加電子化通路使用率；更可以辨別身心障礙者之身分，自動切換為無障礙語音，提供身心障礙者便利的服務。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a multi-language automatic voice recognition system and a method thereof. The multi-language automatic voice recognition system provides multi-language words translation and voice recognition and translation, and links to a user device, a client server, a financial mainframe and an international financial mainframe. Said multi-language automatic voice recognition system includes an interfacing module, a language recognition module and a language translation module. The method includes receiving customer information, identifying nationality and identity information, multi-language voice translation and language displaying and voice playing. With the implementation of the present invention, real time multi-language translation can be achieved, cost of implementation and manpower reduced, saving operation time of customers, and with the identifying of disabled people, considerate services can also be provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:多國語言智能語音系統</p>  
        <p type="p">10:介面模組</p>  
        <p type="p">20:語文語音轉換模組</p>  
        <p type="p">30:語文語音辨識模組</p>  
        <p type="p">D1:客戶輸入資料</p>  
        <p type="p">D2:播放資料</p>  
        <p type="p">D3:客戶身份資料</p>  
        <p type="p">200:使用者裝置</p>  
        <p type="p">300:客戶主機系統</p>  
        <p type="p">400:財金公司主機</p>  
        <p type="p">500:國際財金主機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="34" publication-number="202613855"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613855.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613855</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135138</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有語言辨識的自動櫃員機及多國語言智能語音服務之方法</chinese-title>  
        <english-title>CASH MACHINE WITH VOICE RECOGNITION AND MULTILINGUAL INTELLIGENT VOICE SERVICE METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241202B">G06F21/32</main-classification>  
        <further-classification edition="202001120241202B">G06F40/263</further-classification>  
        <further-classification edition="201301120241202B">G06F3/048</further-classification>  
        <further-classification edition="201201120241202B">G06Q20/40</further-classification>  
        <further-classification edition="202301120241202B">G06Q40/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣土地銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAND BANK OF TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾筱珺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, HSIAO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有語言辨識的自動櫃員機，用於提供多個使用者語言切換的服務。此具有語言辨識的自動櫃員機包括：顯示模組，用於顯示使用者語言切換服務的語言服務畫面；語音提示輸入裝置，用於接收並偵測使用者的語音資訊；輸入模組，用於提供使用者對語言服務畫面輸入操作指令；身份辨識模組，用於根據使用者以輸入模組輸入的身分訊息搜尋銀行伺服器是否有對應的客戶身分訊息；語音語言辨識模組，用於接收使用者根據顯示模組顯示的文字字串，以輸入模組產生語音資訊後，將語音資訊和語音參考資料進行比對；身分語言辨識模組，根據客戶身分訊息中的國籍產生對應的語音服務畫面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a cash machine with voice recognition and the method thereof. The cash machine with voice recognition is for voice services for multiple users, and includes a display module implemented as a servicing display; a voice prompt module detecting and receiving voice inputs; an input module receiving user instructions; an identity recognition module for identifying the identity information; a voice recognition module for identifying input voice; and a nationality language recognition module for providing voice or sentence information with exact language through the display module. The method includes receiving customer information, identifying nationality and identity information, multi-language voice translation and language displaying and voice playing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:銀行伺服器</p>  
        <p type="p">102:財金公司主機</p>  
        <p type="p">103:國際財金主機</p>  
        <p type="p">110:具有語言辨識的自動櫃員機</p>  
        <p type="p">111:顯示模組</p>  
        <p type="p">112:輸入模組</p>  
        <p type="p">113:身分辨識模組</p>  
        <p type="p">114:語音語言辨識模組</p>  
        <p type="p">115:身分語言辨識模組</p>  
        <p type="p">116:語音提示輸入裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="35" publication-number="202613441"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613441.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613441</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135139</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三角凡而之改良結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">F16K5/00</main-classification>  
        <further-classification edition="200601120241105B">F16K11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>統領工業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張金發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳行一</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種三角凡而之改良結構，主要係設有一三通管本體，於三通管本體設有一供組接於供水管路之入水端、一與入水端呈垂直貫通，以供連接供水設備之出水端，以及一具有調整栓以供控制出水端之出水量，且鎖合有帽蓋之控水端。其中，該三通管本體之控水端處係設有一可扳轉部，該可扳轉部係由鄰近控水端處水平延伸至出水端；該帽蓋之圓徑係小於該可扳轉部的外周緣。俾於施工時，因該可扳轉部設於控水端處，可供不同工具置於該可扳轉部進行裝設作業，使三角凡而之施工更為方便、快捷，改善習知三角凡而易受施工環境妨礙之缺失，進而提升作業效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:三通管本體</p>  
        <p type="p">31:入水端</p>  
        <p type="p">32:出水端</p>  
        <p type="p">33:控水端</p>  
        <p type="p">331:帽蓋</p>  
        <p type="p">34:調整栓</p>  
        <p type="p">35:可扳轉部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="36" publication-number="202613463"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613463.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613463</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135140</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>過樑風管結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240925B">F24F13/02</main-classification>  
        <further-classification edition="200601120240925B">F24F7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>統領工業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張金發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳行一</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種過樑風管結構，主要係包含導風管體及連接管。其中，該導風管體兩端係分別設有第一接口及第二接口，該第一接口係設為圓形，該第二接口係設為扁平狀之四邊形，該第一接口與該第二接口間，係設為彎弧狀傾斜漸縮之銜接部，且該第二接口的截面積係大於該第一接口；該連接管係供銜接於兩導風管體之第二接口。藉此，可將過樑風管置於橫樑下方，以供通風管分別連接於第一接口，俾於不穿樑破壞結構狀態下，令通風管順利通過橫樑，解決橫樑無法打洞穿孔的問題，且不虞發生流量變小與避免通風效率不佳情形，進而使橫樑下所裝修的天花板不會產生高度過低的問題，達到兼具美觀及安全之目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:導風管體</p>  
        <p type="p">11:第一接口</p>  
        <p type="p">12:第二接口</p>  
        <p type="p">13:銜接部</p>  
        <p type="p">141:下緣</p>  
        <p type="p">16:突耳</p>  
        <p type="p">161:固定孔</p>  
        <p type="p">2:連接管</p>  
        <p type="p">3:橫樑</p>  
        <p type="p">4:繩體</p>  
        <p type="p">5:樓層板</p>  
        <p type="p">6:通風管</p>  
        <p type="p">7:天花板</p>  
        <p type="p">A:過樑風管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="37" publication-number="202613836"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613836.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613836</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135142</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於功能即服務的分散式計算系統及方法</chinese-title>  
        <english-title>DISTRIBUTED COMPUTING SYSTEM AND METHOD BASED ON FUNCTIONS AS A SERVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250102B">G06F16/182</main-classification>  
        <further-classification edition="202201120250102B">H04L67/1097</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣大哥大股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN MOBILE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁雋傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, CHUN CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武祺淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHI YUEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡忠婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHUNG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳淑琴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHU-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">基於功能即服務的分散式計算系統包括第一儲存裝置、分層控制模組、偵測判斷模組以及第二儲存裝置。第一儲存裝置儲存檔案數據。分層控制模組根據檔案數據的處理流程規劃至少第一處理層以及第二處理層。偵測判斷模組根據檔案數據類別產生分群規則。分層控制模組執行第一處理層的處理程序呼叫第一雲端函式根據該分群規則分群該檔案數據為複數群。第二儲存裝置儲存複數群檔案數據。分層控制模組執行第二處理層的處理程序，呼叫複數第二雲端函式同步處理複數群檔案數據。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The distributed computing system based on functions as a service includes a first storage device, a hierarchical control module, a detection and judgment module and a second storage device. The first storage device stores file data. The hierarchical control module plans at least the first processing layer and the second processing layer according to the processing flow of the file data. The detection and judgment module generates grouping rules based on file data categories. The hierarchical control module executes the processing program of the first processing layer and calls the first cloud function to group the file data into plurality of group file data according to the grouping rule. The second storage device stores the plurality of group file data. The hierarchical control module executes the processing program of the second processing layer and calls a plurality of second cloud functions to synchronously process the plurality of group file data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基於功能即服務的分散式計算系統</p>  
        <p type="p">110:第一儲存裝置</p>  
        <p type="p">120:第二儲存裝置</p>  
        <p type="p">130:偵測判斷模組</p>  
        <p type="p">140:分層控制模組</p>  
        <p type="p">150:地端元件</p>  
        <p type="p">160:差異分析元件</p>  
        <p type="p">200:網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="38" publication-number="202614734"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614734.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614734</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135148</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241001B">H10B12/00</main-classification>  
        <further-classification edition="202301120241001B">H10N97/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李振彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHEN CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體結構，包含基板以及電容器結構。基板包含半導體基板、設置在半導體基板上的介電層，以及設置在介電層內的複數個金屬接觸。電容器結構包含複數個垂直電容杯體，分別連接金屬接觸，其中各垂直電容杯體具有內側高度以及外側高度，內側高度小於外側高度。一種形成半導體結構的方法亦在此揭露。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure includes a substrate and a capacitor structure. The substrate includes a semiconductor subsrate, a dielecric layer disposed on the semiconductor substrate, and a plurality of metal contacts disposed in the dielectric layer. The capacitor structure includes a plurality of vertical capacitor cups coupled to the metal contacts, respectively. Each of the vertical capacitor cups has an inside height and an outside height, in which the inside height is smaller than the outside height. A method of forming the semiconductor structure is also disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體結構</p>  
        <p type="p">110:基板</p>  
        <p type="p">112:半導體基板</p>  
        <p type="p">114:介電層</p>  
        <p type="p">116:金屬接觸</p>  
        <p type="p">1201:第一支撐層</p>  
        <p type="p">1202:第二支撐層</p>  
        <p type="p">1203:第三支撐層</p>  
        <p type="p">1204:第四支撐層</p>  
        <p type="p">140:電容器結構</p>  
        <p type="p">1401:第一導電層</p>  
        <p type="p">1402:電容介電層</p>  
        <p type="p">1403:第二導電層</p>  
        <p type="p">160:多晶矽材料</p>  
        <p type="p">AR1:電容陣列區域</p>  
        <p type="p">AR2:預留區域</p>  
        <p type="p">A-A,B-B:平面</p>  
        <p type="p">C1,C3:垂直電容杯體</p>  
        <p type="p">C’:附加電容</p>  
        <p type="p">H5:高度</p>  
        <p type="p">H3:內側高度</p>  
        <p type="p">H4:外側高度</p>  
        <p type="p">S24:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="39" publication-number="202614134"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614134.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614134</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135149</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以電漿進行表面熱處理的裝置及使用該裝置的方法</chinese-title>  
        <english-title>APPARATUS FOR PROCEEDING SURFACE HEAT TREATMENT BY PLASMA AND METHOD USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241122B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐瑞美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, JUI-MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李祐昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種以電漿進行表面熱處理的裝置及使用該裝置的方法，該裝置包含一本體，於本體內設有第一流道、第二流道、第三流道與一狹縫。第一流道平行於第一軸線具有相對之第一端與第二端；第二流道平行於第一軸線具有相對之第三端與第四端，第三端與第二端相連通，第二流道之內徑大於第二端之內徑；第三流道平行於第二軸線具有相對之第五端與第六端，第五端與第二流道相連通，第六端貫穿本體，第二軸線與第一軸線之間夾角等於或大於0度；狹縫平行於第三軸線延伸貫穿本體，狹縫平行於第三軸線之投影範圍落在第三流道平行於第三軸線之投影範圍內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus for proceeding surface heat treatment by plasma and method using the same. The apparatus includes a body with first flow channel, second flow channel, third flow channel and slot. The first flow channel has a first end and a second end relatively along a first axis. The second flow channel has a third end and a fourth end relatively along the first axis. The third end connects with the second end and inner diameter of the second flow channel is bigger than inner diameter of the second end. The third flow channel has a fifth end and a sixth end relatively along a second axis. The fifth end connects with the second flow channel and the six end penetrates through the body. Angle between the first axis and the second axis is equal or bigger than 0 degree. The slot penetrates through the body along a third axis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:本體</p>  
        <p type="p">10:第一流道</p>  
        <p type="p">11:第一端</p>  
        <p type="p">12:第二端</p>  
        <p type="p">20:第二流道</p>  
        <p type="p">21:第三端</p>  
        <p type="p">22:第四端</p>  
        <p type="p">30:第三流道</p>  
        <p type="p">31:第五端</p>  
        <p type="p">32:第六端</p>  
        <p type="p">40:狹縫</p>  
        <p type="p">41:第一內側壁</p>  
        <p type="p">42:第二內側壁</p>  
        <p type="p">D11,D12,D20,D30:內徑</p>  
        <p type="p">C1:第一軸線</p>  
        <p type="p">C2:第二軸線</p>  
        <p type="p">C3:第三軸線</p>  
        <p type="p">W:寬度</p>  
        <p type="p">θ:夾角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="40" publication-number="202613393"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613393.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613393</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135151</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於破壞後自動鎖定之鎖心結構</chinese-title>  
        <english-title>LOCK CYLINDER STRUCTURE WITH AUTOMATIC LOCKING AFTER DAMAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">E05B15/00</main-classification>  
        <further-classification edition="200601120241105B">E05B63/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安得烈股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEDERAL LOCK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉天靠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TIEN-KAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>時渝恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種基於破壞後自動鎖定之鎖心結構，其包含：一鎖體，其設有二鎖心，該鎖體於所述鎖心間具有一凸輪，且所述鎖心與凸輪間具有一帶動塊，所述帶動塊內設有限位組件；帶動塊內設置有傳動器，傳動器係於軸向方向相互傳動接設；所述傳動器側緣設置有傳動塊，並分別於一側徑向凹設一移動槽及一限位單元；鎖心係於軸向之一端處設有一傳動片，該傳動片係對應傳動接設於帶動塊；傳動片係組接一傳動桿，傳動桿設置有一傳動銷，傳動銷係對應滑動接設於傳動器之移動槽內；藉此，於一端之鎖心被破壞以取出後，鎖心會被人力拉出，而同時軸向連動拉出傳動片、傳動桿及傳動銷，使傳動銷對應拉動傳動器，進而同時拉動另一端之傳動器，使另端傳動器之限位單元對位於其對應限位組件而自動鎖定，使於軸向方向被限位，同時，該另端之傳動塊係對應伸入於凸輪之滑槽，令鎖心遭破壞之一端的傳動器與帶動塊僅能空轉而無法開鎖，且由於傳動塊係由破壞人員經人力拉出，且鎖定之一端係位於被破壞之另側，故亦無法透過敲擊方式以破解自動鎖定之機制，藉以達致優良之防盜效果，而另端之鎖心仍可藉由其傳動器而傳動於凸輪而開鎖，不致使鎖體因其一端之鎖心遭破壞而反鎖。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a lock cylinder structure with automatic locking after damage, which includes: a lock body with two lock cylinders, where the lock body has a cam positioned between the two lock cylinders, and a driving block situated between the lock cylinder and the cam, with a limiting component inside the driving block; a transmitter is installed within the driving block, which transmits motion axially in alignment with each other; the side edge of the transmitter is equipped with a driving block, which features a radially recessed moving groove and a limiting unit on one side; one end of the lock cylinder has a driving plate, which is aligned and connected to the driving block; the driving plate is coupled with a driving rod, which includes a driving pin, and the driving pin is slidable engaged in the moving groove of the transmitter; thus, when one end of the lock cylinder is damaged and removed, the lock cylinder will be manually pulled out, simultaneously axially driving out the driving plate, driving rod, and driving pin, causing the driving pin to actuate the transmitter and in turn, pulling the transmitter at the other end. This action results in the limiting unit of the other end's transmitter aligning with its corresponding limiting component and automatically locking, thus providing axial limitation. Additionally, the driving block at the other end extends into the cam's sliding groove, preventing the lock cylinder from being unlocked by only rotating the driving block and cam at the damaged end. As the driving block is manually pulled out by the tamper, and the locking end is on the side opposite the damaged one, the automatic locking mechanism cannot be compromised through tapping, thus achieving excellent anti-theft protection. Meanwhile, the lock cylinder at the other end can still be unlocked via its transmitter acting on the cam, ensuring that the lock body does not become locked due to the damage at one end.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鎖體</p>  
        <p type="p">11:襯套</p>  
        <p type="p">12:連接桿</p>  
        <p type="p">13:連接片</p>  
        <p type="p">14:定位槽</p>  
        <p type="p">15:孔槽</p>  
        <p type="p">151:插銷</p>  
        <p type="p">2:鎖心</p>  
        <p type="p">21:軸孔</p>  
        <p type="p">211:彈性元件</p>  
        <p type="p">212:推動銷</p>  
        <p type="p">22:傳接槽</p>  
        <p type="p">221:固定孔</p>  
        <p type="p">3:凸輪</p>  
        <p type="p">32:凹陷部</p>  
        <p type="p">321:凹接面</p>  
        <p type="p">33:固接槽</p>  
        <p type="p">34:穿槽</p>  
        <p type="p">35:限位片</p>  
        <p type="p">36:定位環</p>  
        <p type="p">361:連接部</p>  
        <p type="p">4:帶動塊</p>  
        <p type="p">41:傳動槽</p>  
        <p type="p">42:組接槽</p>  
        <p type="p">43:限位組件</p>  
        <p type="p">431:止動塊</p>  
        <p type="p">432:定位塊</p>  
        <p type="p">433:彈性單元</p>  
        <p type="p">44:弧槽</p>  
        <p type="p">45:連接槽</p>  
        <p type="p">46:凹環部</p>  
        <p type="p">47:限位孔</p>  
        <p type="p">471:止擋部件</p>  
        <p type="p">5:傳動器</p>  
        <p type="p">51:凸接部</p>  
        <p type="p">511:切槽</p>  
        <p type="p">52:扣接元件</p>  
        <p type="p">521:環部</p>  
        <p type="p">53:傳動塊</p>  
        <p type="p">54:移動槽</p>  
        <p type="p">55:限位單元</p>  
        <p type="p">6:傳動片</p>  
        <p type="p">61:組接孔</p>  
        <p type="p">62:組接銷</p>  
        <p type="p">63:接腳</p>  
        <p type="p">631:定位孔</p>  
        <p type="p">64:固定銷</p>  
        <p type="p">7:傳動桿</p>  
        <p type="p">71:傳動銷</p>  
        <p type="p">72:卡槽</p>  
        <p type="p">73:穿孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="41" publication-number="202613272"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613272.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613272</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135152</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著劑組合物及其應用</chinese-title>  
        <english-title>ADHESIVE COMPOSITION AND USES OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">C09J145/00</main-classification>  
        <further-classification edition="200601120241007B">C09J147/00</further-classification>  
        <further-classification edition="200601120241007B">C09J11/06</further-classification>  
        <further-classification edition="200601120241007B">B32B7/12</further-classification>  
        <further-classification edition="200601120241007B">B32B15/08</further-classification>  
        <further-classification edition="200601120241007B">H05K3/38</further-classification>  
        <further-classification edition="200601120241007B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台燿科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN UNION TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐瑞祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, JUI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種黏著劑組合物，其包含（A）多環芳香烴化合物、（B）烯烴共聚物、以及（C）矽烷偶合劑。成分（B）包含下式（I）至（III）之重複單元，且式（II）重複單元之含量為1莫耳%至小於100莫耳%。 &lt;br/&gt;&lt;img align="absmiddle" height="577px" width="405px" file="ed10124.JPG" alt="ed10124.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;R &lt;sup&gt;1&lt;/sup&gt;至R &lt;sup&gt;22&lt;/sup&gt;、m、n、o、p係如本文中所定義。以成分（A）、成分（B）及成分（C）之總重量計，成分（A）的含量為33重量%至64重量%，成分（B）的含量為35重量%至66重量%，成分（C）的含量為0.1重量%至4.0重量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An adhesive composition is provided. The adhesive composition comprises (A) a polycyclic aromatic hydrocarbon compound, (B) an olefin copolymer, and (C) a silane coupling agent. The component (B) comprises the repeating units represented by the following formulas (I) to (III), and the content of the repeating unit (B-2) ranges from 1 mol% to less than 100 mol%. &lt;br/&gt;&lt;img align="absmiddle" height="387px" width="391px" file="ed10125.JPG" alt="ed10125.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="187px" width="375px" file="ed10126.JPG" alt="ed10126.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;R &lt;sup&gt;1&lt;/sup&gt;to R &lt;sup&gt;21&lt;/sup&gt;, m, n, o, and p are as defined in the specification. Based on the total weight of the component (A), component (B) and component (C), the amount of the component (A) ranges from 33 wt% to 64 wt%, the amount of the component (B) ranges from 35 wt% to 66 wt%, and the amount of the component (C) ranges from 0.1 wt% to 4 wt%.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:積層板</p>  
        <p type="p">11:導電層</p>  
        <p type="p">12:黏著層</p>  
        <p type="p">13:介電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="42" publication-number="202613405"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613405.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613405</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135156</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>風力加重力共振發電結構</chinese-title>  
        <english-title>WIND GENERATOR WITH GRAVITY RESONANCE PROCEDURE BY WIND-COMPENSATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240927B">F03D5/06</main-classification>  
        <further-classification edition="201601120240927B">F03D9/10</further-classification>  
        <further-classification edition="201601120240927B">F03D9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊春足</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHUN CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊春足</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHUN CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">以類比百年來鐘擺成功運作的重力共振原理，由地球重力在地面上捕獲的風力補償形成風力補償器，如同棘齒輪加彈簧組合推力補償鐘擺來回擺動的各種損耗，使本發明的風力加重力磁擺達到共振效果。藉由重力磁擺上加重及高磁力密度製成圓弧形排列的永久磁鐵組，對固定不動板架上且同半徑圓弧形排列繞線圈組擺動，產生較強感應電流。由於重力磁錘上加重及高磁力密度的複數個並排以重力共振不停來回擺動永久磁鐵組，不必高速旋轉以提升電壓而建於高塔上；改建於地面以降低成本且大量並排同步共振擺動地提升感應電流產生電力及儲存，解決人類缺電的威脅。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">On the analogy of successful principle in pendulum that was resonated by the aid with both the gravity and the spring force act at ratchet to compensate the loss of swinging energy since hundred years ago, the invention use the same principle to create the gravitational magnetic pendulum to resonate with wind-compensator catching wind power on the ground. Depending on a great deal of permanent magnets which provide high density magnetic power and been arranged in arch-shaped magnets within pendulum, it swings along the fixed arch-shaped stators which is arch-shaped structures with a stator coil of a wound copper wire disposed in to generate high induction current electrical power. The fixed arch-shaped stators is the same radius as the arch-shaped magnets within pendulum. As the gravitational magnetic resonate pendulum is constituted by a plurality of a great deal of permanent magnets that have high density magnetic power to be synchronously resonated moving parallelly backwards and forwards work on the ground, it need not build in high tower to work with high speed running in order to get high voltage. Above all, it may build on the ground to decrease building cost and to get the more high induction current from the gravitational magnetic pendulum to resonate with wind-compensator. It will help all mankind to dissolve the menace of lacking electric power.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:受風面</p>  
        <p type="p">101:重力磁擺</p>  
        <p type="p">102:重力磁擺的擺動軸</p>  
        <p type="p">103:重力磁擺的支撐轉盤</p>  
        <p type="p">103-1:風向轉軸</p>  
        <p type="p">103-2:支撐轉盤的上轉盤平板</p>  
        <p type="p">103-3:支撐轉盤的下轉盤平板</p>  
        <p type="p">104:重力磁擺配掛架</p>  
        <p type="p">105-1:重力磁擺配掛架下方吊掛的左方圓弧形場磁鐵排</p>  
        <p type="p">105-2:重力磁擺配掛架下方吊掛的右方圓弧形場磁鐵排</p>  
        <p type="p">106:圓弧形串連排列繞線圈組電路板</p>  
        <p type="p">106-1:圓弧形串連排列繞線圈組電路板固定架</p>  
        <p type="p">107:風速計及提供風速給受風口閘門板智能開關電路</p>  
        <p type="p">109:受風口閘門板</p>  
        <p type="p">110:受風口閘門板智能開關</p>  
        <p type="p">111:受風通道</p>  
        <p type="p">112:風向尾翼</p>  
        <p type="p">113:風向調整裝置及控制轉動軸訊息的電路</p>  
        <p type="p">114:風向智能轉動伺服馬達</p>  
        <p type="p">115:受風面設定最大角度止限板</p>  
        <p type="p">115-1:受風口閘門控制關閉的開關及信號輸出源</p>  
        <p type="p">116:重力磁擺設定擺回最大角度止限板</p>  
        <p type="p">116-1:受風口閘門控制開啟的開關及信號輸出源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="43" publication-number="202613401"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613401.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613401</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135159</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複數電動窗簾同步升降之控制系統</chinese-title>  
        <english-title>CONTROL SYSTEM FOR SYNCHRONOUSLY LIFTING ELECTRIC WINDOW BLINDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240925B">E06B9/68</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富聯智科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FULLLINK SMART TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳榮富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JUNG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明複數電動窗簾同步升降之控制系統，利用該控制系統複數電動窗簾同步升降進行作動，而透過該控制系統包含有行程偵測單元、時間計數單元、電流偵測單元、儲存單元及處理單元等；其中，藉由該儲存單元儲存有各電動窗簾之驅動裝置所需運轉行程的驅動指令、運轉時間，促使運轉時，該行程偵測單元其可偵測該每一驅動裝置運轉狀態，且該處理單元比對該每一驅動裝置運轉狀態，並且針對驅動裝置未符合該儲存單元中之運轉行程時，該處理單元將調整電流輸出至該驅動裝置，以控制該每一電動窗簾之遮擋件達到同步升降功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A control system for synchronously lifting electric window blinds is capable of controlling a plurality of electric window blinds to allow the electric window blinds to lift up or down simultaneously. The control system includes a route detecting unit, a time counting unit, a current monitoring unit, a storage unit, and a processing unit. Route datum of a drive device of each electric window blind that include drive commands and operating duration are stored in the storage unit. The route detecting unit is then adapted to monitor and compare the operating route of each drive device with the route datum. The processing unit adjusts the current delivered to the drive device if the operating route of the drive device does not conform to the route datum, thereby achieving a synchronous lifting action of the electric window blinds.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:控制系統</p>  
        <p type="p">31:行程偵測單元</p>  
        <p type="p">32:時間計數單元</p>  
        <p type="p">33:電流偵測單元</p>  
        <p type="p">34:儲存單元</p>  
        <p type="p">35:處理單元</p>  
        <p type="p">4:電動窗簾</p>  
        <p type="p">41:框架</p>  
        <p type="p">42:遮擋件</p>  
        <p type="p">43:驅動裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="44" publication-number="202612624"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612624.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612624</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135160</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具碰停、過載保護功能之電動窗簾</chinese-title>  
        <english-title>ELECTRIC WINDOW BLIND HAVING A HALTING FUNCTION WHILE ENCOUNTERING OBSTACLES AND HAVING OVERLOAD PROTECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">A47H5/02</main-classification>  
        <further-classification edition="200601120240929B">E06B9/40</further-classification>  
        <further-classification edition="200601120240929B">E06B9/42</further-classification>  
        <further-classification edition="200601120240929B">E06B9/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富聯智科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FULLLINK SMART TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳榮富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JUNG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明具碰停、過載保護功能之電動窗簾，其主要在於該電動窗簾之控制裝置設置有電流偵測單元及處理單元，且該處理單元內設一第一檢測模式，該第一檢測模式係利用該電流偵測單元將會偵測正常上下運轉的最大電流，作為第一基準電流與第二基準電流儲存，或者更可適時於該處理單元內設一第二檢測模式，以便利用運轉過程中的前一時間點所得之即時電流定義為第三基準電流，故使用過程中，偵測到的即時電流大於該第一或第二或第三基準電流，該處理單元將控制該驅動馬達停止動力輸出，更進而達到精準碰到障礙物停止及過載保護之功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electric window blind having a halting function while encountering obstacles and having overload protection is disclosed. The electric window blind mAinly includes a current monitoring unit and a processing unit disposed in a control device. The processing unit includes a first detecting mode. The first detecting mode is applied by monitoring respective mAximum currents while lifting and descending a covering sheet normAlly. The monitored mAximum currents are respectively defined as a first basis current and a second basis current and stored. The processing unit can further include a second detecting mode. The second detecting mode is applied by defining a third basis current. The third basis current is an instant current occurring at a preceding time point prior to a current instant current occurring at a time point right after the preceding time point. Accordingly, a drive motor of the electric window blind halts under the control of the processing unit if the current instant current is larger than the first basis current, the second basis current, or the third basis current. Thus, a halting function performed while the covering sheet encounters obstacles and a function of overload protection can be attained.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:電動窗簾</p>  
        <p type="p">31:框架</p>  
        <p type="p">32:遮擋件</p>  
        <p type="p">33:傳動裝置</p>  
        <p type="p">34:驅動馬達</p>  
        <p type="p">35:控制裝置</p>  
        <p type="p">351:電流偵測單元</p>  
        <p type="p">352:處理單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="45" publication-number="202612891"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612891.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612891</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135162</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於注塑餘料去除的餘料去除裝置</chinese-title>  
        <english-title>RESIDUE-REMOVING APPARATUS APPLIED TO REMOVE INJECTED RESIDUE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B29C44/34</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>天崗精機科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIEN KANG CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃鳳梧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, FONG-WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明用於注塑系統的餘料去除裝置，其主要在於注塑系統一側加設有餘料去除裝置，該餘料去除裝置具有一設於一注塑系統之傳送裝置側邊的集收單元以及一可位於該傳送裝置上方且與該集收單元連接之去除單元；藉由通過該集收單元與該去除單元的配合，能讓完成注塑的成型模具被該傳送裝置傳送至一對應於該去除單元之位置處，以對產生在該成型模具表面上的餘料進行去除與集收，使去除作業得以一次快速去除，有利於提升後續脫模作業順暢與加工生產良率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A residue-removing apparatus is mainly disposed on one side of an injection system. The residue-removing apparatus includes a collecting unit disposed beside a conveyor device of the injection system and a removing unit disposed above the conveyor device and connected to the collecting unit. The collecting unit cooperates with the removing unit, and the cooperation allows each mold whose injection operation is completed to be moved to a working position associated with the removing unit, thereby removing residues from a surface of each mold and collecting the removed residues. Thus, a removing operation can be quickly fulfilled to facilitate a preferable demolding operation and increase the yield rate of the injection molding production.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(本發明)</p>  
        <p type="p">3:注塑系統</p>  
        <p type="p">31:傳送裝置</p>  
        <p type="p">32:注塑裝置</p>  
        <p type="p">33:成型模具</p>  
        <p type="p">331:注塑孔</p>  
        <p type="p">4:餘料去除裝置</p>  
        <p type="p">41:集收單元</p>  
        <p type="p">42:去除單元</p>  
        <p type="p">411:本體</p>  
        <p type="p">412:作動件</p>  
        <p type="p">413:集收件</p>  
        <p type="p">414:收料件</p>  
        <p type="p">421:軌道</p>  
        <p type="p">422:移動座</p>  
        <p type="p">423:推動器</p>  
        <p type="p">424:除料器</p>  
        <p type="p">a:餘料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="46" publication-number="202614695"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614695.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614695</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135165</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>階梯狀卡合構件</chinese-title>  
        <english-title>STEPPED ENGAGING MEMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H05K5/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王敬元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈宜威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, I-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林君憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIUN-SHIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種階梯狀卡合構件，適用於電子裝置，其中階梯狀卡合構件包括：卡扣組件，設置於殼體上，並具有不同高度的至少二卡合端部；以及卡合部，包括鉤部、本體以及卡栓槽，其中，卡栓槽具有對應於卡合端部階梯狀板面，用以貼合卡合端部，並與卡扣組件卡合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A stepped engaging member suitable for electronic devices, wherein the stepped engaging member includes: a buckle component, which is provided on the housing and has at least two engaging end portions of different heights; and an engaging portion including a hook part, a body and a latch groove, wherein the latch groove has a stepped plate surface corresponding to the engaging end, for fitting the engaging end and engaging with the latch component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:階梯狀卡合構件</p>  
        <p type="p">11:卡扣組件</p>  
        <p type="p">111:第一卡合端部</p>  
        <p type="p">112:第二卡合端部</p>  
        <p type="p">12:卡合部</p>  
        <p type="p">121:鉤部</p>  
        <p type="p">122:本體</p>  
        <p type="p">123:卡栓槽</p>  
        <p type="p">2:殼體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="47" publication-number="202613760"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613760.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613760</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135166</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池單元固定結構</chinese-title>  
        <english-title>BATTERY UNIT FIXING STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G06F1/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王敬元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈宜威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, I-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電池單元固定結構，係用以將電池單元固定於電子裝置之電路板上的容置空間，其中電池單元固定結構包括：固定組件，設置於容置空間側，用以固定電池單元，固定組件更包括：固持件，可轉動地設置於電路板上，以選擇性位於第一位置或第二位置，固持件包括通孔、受力部、限位部、以及干涉部，用以干涉電池單元放置位置；以及固定螺絲，透過通孔使固持件固定於電路板上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery unit fixing structure is used to fix the battery unit to an accommodating space on a circuit board of an electronic device. The battery unit fixing structure includes: a fixing component disposed on the side of the accommodating space for fixing the battery unit. The component further includes: a holder, which is rotatably disposed on the circuit board to selectively be located in the first position or the second position. The holder includes a through hole, a force-receiving part, a limiting part, and an interference part for interfering with the battery. The unit placement position; and the fixing screws to fix the holder to the circuit board through the through holes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:固定組件</p>  
        <p type="p">11:固持件</p>  
        <p type="p">111:通孔</p>  
        <p type="p">112:受力部</p>  
        <p type="p">113:限位部</p>  
        <p type="p">114:干涉部</p>  
        <p type="p">12:固定螺絲</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="48" publication-number="202613949"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613949.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613949</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135169</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>信保逾放處理系統</chinese-title>  
        <english-title>OVERDUE LOAN CREDIT INSURANCE PROCESSING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241101B">G06Q40/03</main-classification>  
        <further-classification edition="201201120241101B">G06Q20/38</further-classification>  
        <further-classification edition="201201120241101B">G06Q50/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣土地銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAND BANK OF TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文樑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WEN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種信保逾放處理系統，包括銀行放款主機和信保申請系統。銀行放款主機的逾放判斷模組從放款案件資料庫接收放款資料並判斷是否符合逾放標準，符合時將案件轉為逾放案件並傳送至催收裝置進行法催。信保申請系統包含信保逾放資料庫和下述模組。信保判斷模組接收逾放案件資料，判斷是否具備信用保險，符合時將其轉為信保逾放案件並儲存之。文件接收模組接收債權證明文件，掃描辨識模組辨識債權證明文件的內容並傳送至信保判斷模組，確認其是否屬於信保逾放案件。屬於時，信保判斷模組請求申請表格模組生成信保申請表，提交信保作業系統審核。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An overdue loan credit insurance processing system is provided. This system includes a bank loan host and a credit insurance application system. The overdue determination module of the bank loan host receives loan data from the loan case database and determines whether it meets the overdue standard. If it does, the case is converted into an overdue case and transmitted to a debt collection device for legal debt collection procedures. The credit insurance application system includes a credit insurance overdue database and the following modules. The credit insurance determination module receives overdue case data, determines whether it has a credit insurance, and if so, converts it into a credit insurance overdue case and stores it. The document reception module receives debt proof documents, and the scan recognition module identifies the contents of the debt proof documents and transmits them to the credit insurance determination module to confirm whether they belong to credit insurance overdue cases. If they do, the credit insurance determination module requests the application form module to generate a credit insurance application form, which is then submitted to the credit insurance operating system for review.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:信保逾放處理系統</p>  
        <p type="p">110:銀行放款主機</p>  
        <p type="p">111:放款案件資料庫</p>  
        <p type="p">112:逾放判斷模組</p>  
        <p type="p">120:信保申請系統</p>  
        <p type="p">121:信保逾放資料庫</p>  
        <p type="p">122:信保判斷模組</p>  
        <p type="p">123:文件接收模組</p>  
        <p type="p">124:掃描辨識模組</p>  
        <p type="p">125:申請表格模組</p>  
        <p type="p">126:信保通知模組</p>  
        <p type="p">127:報表輸出模組</p>  
        <p type="p">130:放款裝置</p>  
        <p type="p">140:催收裝置</p>  
        <p type="p">150:法院主機</p>  
        <p type="p">160:信保作業系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="49" publication-number="202613433"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613433.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613433</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135178</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>諧波減速裝置</chinese-title>  
        <english-title>HARMONIC DRIVE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">F16H49/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盟英科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAIN DRIVE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝昆儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, KUN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱嵩翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, SUNG-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程雲豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YUN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉玟秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEN-HSIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種諧波減速裝置，其包含靜態剛輪、柔輪、柔性軸承、輸入構件、中空動態剛輪、輸出構件及端蓋。輸入構件位於靜態剛輪輸入端。輸入構件與柔性軸承連接。中空動態剛輪的外側與柔輪嚙合。柔輪的外側與靜態剛輪的內側嚙合。輸入構件能通過柔性軸承，帶動柔輪運動，而柔輪能帶動中空剛輪旋轉。中空剛輪內部具有內螺旋結構。輸出構件包含外螺旋結構。輸出構件的外螺旋結構與內螺旋結構螺接。當中空剛輪旋轉時，輸出構件將被帶動，沿著軸向方向移動。本發明的諧波減速裝置能將以旋轉方式進行運作的動力，轉換為沿軸向方向移動的動力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a harmonic drive device, comprising a static rigid gear, a flexible gear, a flexible bearing, an input member, a hollow dynamic rigid gear, an output member, and an end cover. The input member is located at the input end of the static rigid gear. The input member is connected to the flexible bearing. The outer side of the hollow dynamic rigid gear meshes with the flexible gear. The outer side of the flexible gear meshes with the inner side of the static rigid gear. The input member can drive the flexible gear through the flexible bearing, and the flexible gear can drive the hollow rigid gear to rotate. The interior of the hollow rigid gear has an internal helical structure. The output member includes an external helical structure. The external helical structure of the output member is screwed with the internal helical structure. When the hollow rigid gear rotates, the output member is driven to move along the axial direction. The harmonic drive device of the present invention can convert rotational power into power that moves along the axial direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:諧波減速裝置</p>  
        <p type="p">AX:軸線</p>  
        <p type="p">1:靜態剛輪</p>  
        <p type="p">11:中空外殼</p>  
        <p type="p">11A:輸出容槽</p>  
        <p type="p">11B:輸入容槽</p>  
        <p type="p">11BL:長度</p>  
        <p type="p">13:第一內齒狀結構</p>  
        <p type="p">2:端蓋</p>  
        <p type="p">21:穿孔</p>  
        <p type="p">3:輸出構件</p>  
        <p type="p">31:連接部</p>  
        <p type="p">311:外螺旋結構</p>  
        <p type="p">32:輸出軸</p>  
        <p type="p">4:中空動態剛輪</p>  
        <p type="p">41:內螺旋結構</p>  
        <p type="p">42:外環狀限位結構</p>  
        <p type="p">43:第二外齒狀結構</p>  
        <p type="p">5:外輔助軸承</p>  
        <p type="p">6:外扣環</p>  
        <p type="p">7:輸入構件</p>  
        <p type="p">7L:長度</p>  
        <p type="p">7A:內軸承容槽</p>  
        <p type="p">7B:柔性軸承槽</p>  
        <p type="p">71:底部</p>  
        <p type="p">72:環狀壁</p>  
        <p type="p">721:內環狀限位結構</p>  
        <p type="p">7211:環狀卡合槽</p>  
        <p type="p">7212:環狀凸起結構</p>  
        <p type="p">73:外連接部</p>  
        <p type="p">8:環狀油封構件</p>  
        <p type="p">9:內輔助軸承</p>  
        <p type="p">100:柔輪</p>  
        <p type="p">101:第一外齒狀結構</p>  
        <p type="p">102:第二內齒狀結構</p>  
        <p type="p">200:柔性軸承</p>  
        <p type="p">300:內扣環</p>  
        <p type="p">Q:螺絲</p>  
        <p type="p">4A:開口</p>  
        <p type="p">7212L:長度</p>  
        <p type="p">200L:長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="50" publication-number="202614872"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614872.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614872</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135179</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種減少印刷塗層疊印厚度以增加光子穿透率並提升彩色太陽能板光電轉換率的印刷方法</chinese-title>  
        <english-title>A PRINTING METHOD THAT REDUCES THE OVERPRINT THICKNESS OF A PRINTING COATING TO INCREASE PHOTON TRANSMITTANCE AND IMPROVE THE PHOTOELECTRIC CONVERSION RATE OF COLOR SOLAR PANELS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250914B">H10F10/10</main-classification>  
        <further-classification edition="202501120250914B">H10F77/30</further-classification>  
        <further-classification edition="202501120250914B">H10F77/40</further-classification>  
        <further-classification edition="200601120250914B">B41M1/14</further-classification>  
        <further-classification edition="201501120250914B">G02B1/115</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖宸賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHEN XIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛煒立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUE, WEI LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>睿田能源有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖宸賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHEN XIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛煒立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUE, WEI LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭朋深</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種減少印刷塗層疊印厚度以增加光子穿透率並提升彩色太陽能板光電轉換率的印刷方法，其方法步驟包括有廣色域印刷技術應用、墨水材料選擇、塗層疊印厚度控制、專色印刷應用、提升光子穿透率與光電轉換率、採彩色光陷阱結構增強印刷及光學測試與優化，本發明之方法利用廣色域及專色印刷技術，減少彩色太陽能板的塗層疊印厚度，而提高了光子穿透率和光電轉換效率，本發明之方法在顏色表現上達到高標準，通過優化塗層結構層，使彩色太陽能板達到高效能性與美觀性的優勢，並且有市場上應用的前景。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention is a printing method that reduces the overprint thickness of a printing coating to increase photon transmittance and improve the photoelectric conversion rate of color solar panels. The method steps include application of wide color gamut printing technology, selection of ink materials, and coating overprint thickness. Control, spot color printing applications, improving photon transmittance and photoelectric conversion rate, using colored light trap structures to enhance printing, and optical testing and optimization. The present invention uses wide color gamut and spot color printing technology to successfully reduce the coating overprint thickness of color solar panels, thereby significantly improving photon transmittance and photoelectric conversion efficiency. The invention reaches a high standard in color performance, and by optimizing the coating structure, the colored solar panel has the advantages of both high efficiency and aesthetics, and has great market application prospects.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:廣色域印刷技術的應用</p>  
        <p type="p">B:墨水與材料選擇</p>  
        <p type="p">C:塗層疊印厚度的控制</p>  
        <p type="p">D:專色的應用</p>  
        <p type="p">E:光子穿透率與光電轉換效率提升</p>  
        <p type="p">F:採彩色光陷阱結構增強印刷</p>  
        <p type="p">G:光學測試與優化</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="51" publication-number="202614012"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614012.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614012</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135187</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光二極體裝置</chinese-title>  
        <english-title>LIGHT EMITTING DIODE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250102B">G09G3/32</main-classification>  
        <further-classification edition="200601120250102B">G09G5/02</further-classification>  
        <further-classification edition="200601120250102B">G09G5/10</further-classification>  
        <further-classification edition="202501120250102B">H10H20/85</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隆達電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEXTAR ELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪裕萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, YU-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁偉傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, WEI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, ZONG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉誠議</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHEN-GYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王文勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEN-SYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏川淇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, CHUAN-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種發光二極體裝置，包括複數發光二極體、儲存模組、控制模組、驅動模組與封裝結構。發光二極體發出不同色光。儲存模組預存發光二極體的電流/電壓對應色座標參考資訊與亮度參考資訊。控制模組接收對應於發光二極體的色座標需求資訊與亮度需求資訊，且將色座標參考資訊、亮度參考資訊、色座標需求資訊與亮度需求資訊依據混光演算法，產生第一控制信號。驅動模組依據第一控制信號產生驅動信號，用以驅動發光二極體發出符合需求的色座標與亮度。封裝結構用以容置發光二極體、儲存模組、控制模組與驅動模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light emitting diode device includes a plurality of light emitting diodes, a storage module, a control module, a driving module and a packaging structure. The light emitting diodes emit different colors of light. The storage module pre-stores color coordinate reference information and brightness reference information corresponding to a current/voltage of the light emitting diodes. The control module receives the color coordinate reference information and the brightness reference information corresponding to the light emitting diodes, and uses the color coordinate reference information, the brightness reference information, color coordinate requirement information and brightness requirement information according to a light mixing algorithm to generate a first control signal. The driving module generate a driving signal according to the first control signal, so as to drive the light emitting diodes to emit the color coordinate and brightness that meet requirements. The packaging structure is configured to accommodate the light emitting diodes, the storage module, the control module and the driving module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:發光二極體裝置</p>  
        <p type="p">111,112,113:發光二極體</p>  
        <p type="p">120:儲存模組</p>  
        <p type="p">130:控制模組</p>  
        <p type="p">140:驅動模組</p>  
        <p type="p">150:封裝結構</p>  
        <p type="p">160:溫度感測模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="52" publication-number="202614631"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614631.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614631</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135188</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>喇叭後蓋及喇叭</chinese-title>  
        <english-title>SPEAKER BACK COVER AND SPEAKER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">H04R5/02</main-classification>  
        <further-classification edition="200601120241101B">H04R7/02</further-classification>  
        <further-classification edition="200601120241101B">H04R31/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明基電通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENQ CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂東科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, TUNG-KO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林致宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種喇叭，包含一喇叭單體及一喇叭後蓋。該喇叭單體後側具有一盆架。該喇叭後蓋密封固定至該盆架，並包含二殼件。該二殼件相對可動地連接並形成一諧振空間。該諧振空間位於該喇叭單體後側。其中一殼件具有一第一通道結構，該第一通道結構具有一內開口。另一殼件具有一第二通道結構，該第二通道結構具有一外開口。該內開口露出於該諧振空間，該外開口露出於該喇叭後蓋。該第一通道結構與該第二通道結構連通以使該諧振空間經由該內開口及該外開口與該喇叭後蓋外部連通。該二殼件可相對移動或轉動以調整該內開口至該外開口之一通道路徑長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A speaker includes a speaker driver and a speaker back cover. The speaker driver has a basket at its rear side. The speaker back cover is sealed and fixed to the basket. The speaker back cover includes two casing parts which are relatively movably or rotatably connected and form a resonance space. The resonance space is located at the rear side of the speaker driver. One of the casing parts has a first channel structure with an inner opening. The other of the casing parts has a second channel structure with an outer opening. The inner opening is exposed in the resonance space. The outer opening is exposed on the speaker back cover. The first channel structure communicates with the second channel structure so that the resonance space communicates with the outside of the speaker back cover through the inner opening and the outer opening. The two casing parts can be moved or rotated relative to each other to adjust a channel path length from the inner opening to the outer opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:喇叭</p>  
        <p type="p">12:喇叭單體</p>  
        <p type="p">122:盆架</p>  
        <p type="p">14:喇叭後蓋</p>  
        <p type="p">14a:旋轉軸</p>  
        <p type="p">140:諧振空間</p>  
        <p type="p">142:第一殼件</p>  
        <p type="p">1422b:第一槽道</p>  
        <p type="p">1424:第一底部</p>  
        <p type="p">1424a:第一內表面</p>  
        <p type="p">1424b:第一外表面</p>  
        <p type="p">144:第二殼件</p>  
        <p type="p">1442a:外開口</p>  
        <p type="p">1442b:第二槽道</p>  
        <p type="p">1444:第二底部</p>  
        <p type="p">1444a:第二內表面</p>  
        <p type="p">1444b:第二外表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="53" publication-number="202614770"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614770.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614770</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135189</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三維記憶體元件</chinese-title>  
        <english-title>3D MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120240924B">H10B43/20</main-classification>  
        <further-classification edition="202301120240924B">H10B43/35</further-classification>  
        <further-classification edition="200601120240924B">G11C8/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>旺宏電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊智凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種三維記憶體元件，其包括堆疊結構、第一組通道結構與第二組通道結構、隔牆結構以及至少一個支撐結構。堆疊結構包括交替堆疊的多層導電層以及多層介電層。堆疊結構的頂表面平行於由第一方向與第二方向定義的平面。第一組通道結構與第二組通道結構貫穿堆疊結構且沿著第一方向排列。隔牆結構設置於第一組通道結構與第二組通道結構之間且包括多個不連續的隔牆結構。多個不連續的隔牆結構沿著第二方向排列且貫穿堆疊結構。至少一個支撐結構設置於相鄰的不連續的隔牆結構之間。本揭露提供的三維記憶體元件可為一種具有高容量與高性能的3D NAND快閃記憶體元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A 3D memory device including a stacked structure, a first group of channel structures and a second group of channel structures, a partition structure and at least one support structure is provided. The stacked structure includes a plurality of conductive layers and a plurality of dielectric layers stacked alternately. A top surface of the stacked structure is parallel to a plane defined by a first direction and a second direction. The first group of channel structures and the second group of channel structures penetrate the stacked structure and are arranged along a first direction. The partition structure includes a plurality of discrete partition structures and is disposed between the first group of channel structures and the second group of channel structures. The plurality of discrete partition structures are arranged along the second direction and penetrate the stacked structure. At least one support structure is disposed between the adjacent discrete partition structures. The 3D memory device is a 3D NAND flash memory device with high capacity and performance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:通道結構</p>  
        <p type="p">200A:第一組通道結構</p>  
        <p type="p">200B:第二組通道結構</p>  
        <p type="p">300:分隔結構</p>  
        <p type="p">310:第一隔牆結構</p>  
        <p type="p">310a:不連續的隔牆結構</p>  
        <p type="p">312:第一隔離層</p>  
        <p type="p">314:第一源極面接觸窗</p>  
        <p type="p">320:第二隔牆結構</p>  
        <p type="p">322:第二隔離層</p>  
        <p type="p">324:第二源極面接觸窗</p>  
        <p type="p">400:支撐結構</p>  
        <p type="p">A-A’、B-B’、C-C’:剖線</p>  
        <p type="p">AR1:陣列區</p>  
        <p type="p">CL:導電層</p>  
        <p type="p">D1、D2:距離</p>  
        <p type="p">SLIT1a:子狹縫</p>  
        <p type="p">SLIT2:第二狹縫</p>  
        <p type="p">VC:通道孔</p>  
        <p type="p">X、Ý、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="54" publication-number="202614489"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614489.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614489</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135194</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線收發器</chinese-title>  
        <english-title>WIRELESS TRANSCEIVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">H01Q9/04</main-classification>  
        <further-classification edition="200601120250102B">H01Q1/36</further-classification>  
        <further-classification edition="201501120250102B">H04B1/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商美律電子(深圳)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERRY ELECTRONICS(SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池昀蓁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIH, YUN CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪天富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, TIEN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李品毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, PIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種無線收發器，包括一電路板、一天線及一電流抵銷元件。電路板包括一第一面。天線包括一饋入端，天線透過饋入端連接至電路板的第一面。電流抵銷元件包括一接地端，電流抵銷元件透過接地端連接至電路板的第一面，且電流抵銷元件與天線設置於電路板的同一側。天線共振出一頻段，天線的長度為頻段的1/4倍波長，且電流抵銷元件的長度為頻段的1/4倍波長。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wireless transceiver includes a circuit board, an antenna and a current offset component. The circuit board includes a first surface. The antenna includes a feed end, and the antenna is connected to the first surface of the circuit board through the feed end. The current offset component includes a ground end, the current offset component is connected to the first surface of the circuit board through the ground end, and the current offset component and the antenna are disposed at a same side of the circuit board. The antenna resonates in a frequency band, a length of the antenna is 1/4 times wavelength of the frequency band, and a length of the current offset component is 1/4 times the wavelength of the frequency band.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">D:距離</p>  
        <p type="p">W1、W2:寬度</p>  
        <p type="p">100:無線收發器</p>  
        <p type="p">110:電路板</p>  
        <p type="p">111、113、116:側面</p>  
        <p type="p">112:第一面</p>  
        <p type="p">114:第二面</p>  
        <p type="p">118:連接器</p>  
        <p type="p">120:天線</p>  
        <p type="p">122:饋入端</p>  
        <p type="p">130:電流抵銷元件</p>  
        <p type="p">132:接地端</p>  
        <p type="p">141:第一段</p>  
        <p type="p">142:第二段</p>  
        <p type="p">143:第三段</p>  
        <p type="p">144:第四段</p>  
        <p type="p">145:第五段</p>  
        <p type="p">146:第六段</p>  
        <p type="p">147:第七段</p>  
        <p type="p">148:第八段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="55" publication-number="202613828"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613828.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613828</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135199</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>傳送頻寬分配方法以及通訊裝置</chinese-title>  
        <english-title>TRANSMISSION BANDWIDTH ALLOCATION METHOD AND COMMUNICATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">G06F13/38</main-classification>  
        <further-classification edition="200901120250102B">H04W28/20</further-classification>  
        <further-classification edition="202301120250102B">H04W72/044</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃躍興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YUEH-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種傳送頻寬分配方法包含有：藉由一傳送裝置來透過一特定介面自一接收裝置接收一需求資訊；藉由傳送裝置來透過特定介面將對應於需求資訊的一屬性資訊傳送至接收裝置；以及藉由傳送裝置來根據屬性資訊以動態地分配一傳送頻寬，以供傳送多筆資料至接收裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transmission bandwidth allocation method includes: receiving, by a transmission device, requirement information from a reception device via a specific interface; transmitting, by the transmission device, attribute information to the reception device via the specific interface; and dynamically allocating, by the transmission device, a transmission bandwidth according to the attribute information for transmitting multiple data to the reception device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S300,S302,S304:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="56" publication-number="202613376"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613376.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613376</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135201</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>變色纖維、變色裝置及其製造方法</chinese-title>  
        <english-title>COLOR CHANGEABLE FIBER, COLOR CHANGEABLE DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">D02G3/02</main-classification>  
        <further-classification edition="200601120241230B">D02G3/36</further-classification>  
        <further-classification edition="200601120241230B">D02G3/44</further-classification>  
        <further-classification edition="201901120241230B">G02F1/167</further-classification>  
        <further-classification edition="201901120241230B">G02F1/1675</further-classification>  
        <further-classification edition="200601120241230B">G09G3/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元太科技工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>E INK HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳淇銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHI MENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁金聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, CHIN TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭哲成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHE CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張謙聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIEN SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供變色纖維、變色裝置及其製造方法。變色纖維包括核心導線、顯示層、透明導電層以及保護層。顯示層設置於核心導線的表面上並與核心導線直接接觸或通過助黏劑與核心導線接觸，其中顯示層包括多個微膠囊，多個微膠囊各自包括多個電泳粒子。透明導電層設置於顯示層的表面之上。保護層設置於透明導電層的表面之上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A color changeable fiber, a color changeable device and manufacturing method thereof are provided. The color changeable fiber includes a core conductive line, a display layer, a transparent conductive layer and a protective layer. The display layer is disposed on a surface of the core conductive line and is in direct contact with the core conductive line or the display layer is in contact with the core conductive line through an adhesive promoter. The display layer includes a plurality of microcapsules and the plurality of microcapsules each includes electrophoretic particles. The transparent conductive layer is disposed over a surface of the display layer. The protective layer is disposed over a surface of the transparent layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:變色裝置</p>  
        <p type="p">10:變色纖維</p>  
        <p type="p">10a:第一端</p>  
        <p type="p">10b:第二端</p>  
        <p type="p">100:核心導線</p>  
        <p type="p">110:顯示層</p>  
        <p type="p">120:透明導電層</p>  
        <p type="p">125:導電膠帶</p>  
        <p type="p">130:保護層</p>  
        <p type="p">E1:第一電極</p>  
        <p type="p">E2:第二電極</p>  
        <p type="p">T1:第一端子</p>  
        <p type="p">T2:第二端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="57" publication-number="202614469"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614469.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614469</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135215</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電化學堆、電池封裝及使用電化學堆和電池封裝的方法</chinese-title>  
        <english-title>ELECTROCHEMICAL STACK, CELL PACK, AND METHODS OF USING ELECTROCHEMICAL STACK AND CELL PACK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120241008B">H01M10/647</main-classification>  
        <further-classification edition="201001120241008B">H01M10/0583</further-classification>  
        <further-classification edition="200601120241008B">H01M4/36</further-classification>  
        <further-classification edition="202101120241008B">H01M50/15</further-classification>  
        <further-classification edition="202101120241008B">H01M50/183</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　伍家珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, VIOLET CHIA CHEN WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　伍家珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, VIOLET CHIA CHEN WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露是有關於可充電電池(即二次電池)，其外形尺寸較大，且包括陰極活性材料，例如但不限於磷酸鐵鋰(Lithium Iron Phosphate，LFP)活性材料、磷酸錳鐵鋰(Lithium Manganese Iron Phosphate，LMFP)活性材料或其組合。本揭露也揭露其使用方法及其製造程序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure concerns rechargeable batteries (i.e., secondary batteries) having large form factors that include cathode active materials such as, but not limited to, lithium iron phosphate (LFP) active material, lithium manganese iron phosphate (LMFP) active material, or a combination thereof. Also disclosed herein are methods of using the same and processes for making the same.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201:正極端子</p>  
        <p type="p">202:負極端子</p>  
        <p type="p">205:排氣孔</p>  
        <p type="p">+:正極</p>  
        <p type="p">-:負極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="58" publication-number="202612651"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612651.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612651</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135229</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>交感神經訊號感測系統與方法</chinese-title>  
        <english-title>SYMPATHETIC NERVOUS SIGNAL SENSING SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241105B">A61B5/25</main-classification>  
        <further-classification edition="202101120241105B">A61B5/294</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王廷瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種交感神經訊號感測系統。交感神經訊號感測系統包含電極對、高輸入阻抗接收電路、差分電路以及後處理電路。電極對設置於受測者，且包括經配置以接收第一訊號的第一電極以及經配置以接收第二訊號的第二電極。高輸入阻抗接收電路包括經配置以接收第一訊號並輸出第三訊號的第一隨耦器以及經配置以接收第二訊號並輸出第四訊號的第二隨耦器。差分電路經配置以將第三訊號及第四訊號進行差分處理以產生第五訊號。後處理電路經配置以將第五訊號以第一濾波頻段進行濾波以輸出交感神經訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The sympathetic nervous signal sensing system includes an electrode pair, a high input impedance receiving circuit, a differential circuit, and a post-processing circuit. The electrode pair is arranged on a subject and includes a first electrode configured to receive a first signal and a second electrode configured to receive a second signal. The high input impedance receiving circuit includes a first follower configured to receive a first signal and output a third signal, and a second follower configured to receive a second signal and output a fourth signal. The differential circuit is configured to perform a differential processing on the third signal and the fourth signal to generate a fifth signal. The post-processing circuit is configured to filter the fifth signal according to a first filtering frequency band to output a sympathetic nervous signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:受測者</p>  
        <p type="p">12:皮膚</p>  
        <p type="p">13:衣物</p>  
        <p type="p">100:交感神經訊號感測系統</p>  
        <p type="p">110:電極對</p>  
        <p type="p">111:第一電極</p>  
        <p type="p">112:第二電極</p>  
        <p type="p">120:高輸入阻抗接收電路</p>  
        <p type="p">121:第一隨耦器</p>  
        <p type="p">122:第二隨耦器</p>  
        <p type="p">130:差分電路</p>  
        <p type="p">140:後處理電路</p>  
        <p type="p">AS:交感神經訊號</p>  
        <p type="p">BP1:第一濾波頻段</p>  
        <p type="p">S1:第一訊號</p>  
        <p type="p">S2:第二訊號</p>  
        <p type="p">S3:第三訊號</p>  
        <p type="p">S4:第四訊號</p>  
        <p type="p">S5:第五訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="59" publication-number="202612649"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612649.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612649</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135231</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生理感測系統及其適用之貼片讀取裝置與生理感測貼片</chinese-title>  
        <english-title>BIOMEDICAL SENSING SYSTEM, AND PATCH READING DEVICE AND BIOMEDICAL SENSING PATCH THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241105B">A61B5/242</main-classification>  
        <further-classification edition="202101120241105B">A61B5/05</further-classification>  
        <further-classification edition="200601120241105B">A61B5/022</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王廷瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">生理感測系統包含生理感測貼片以及貼片讀取裝置。生理感測貼片包括第一薄膜以及電極。電極設置於第一薄膜上。電極經配置以接收第一電磁訊號，並響應於接收第一電磁訊號產生第二電磁訊號。貼片讀取裝置，包括發射模組以及讀取模組。發射模組經配置以輸出第一電磁訊號。讀取模組經配置以讀取第二電磁訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The biomedical sensing system includes a biomedical sensing patch and a patch reading device. The biomedical sensing patch includes a first thin film and an electrode. The electrode is arranged on the first thin film. The electrode is configured to receive a first electromagnetic signal and generate a second electromagnetic signal in response to receiving the first electromagnetic signal. The patch reading device includes a transmission module and a reading module. The transmission module is configured to output the first electromagnetic signal. The reading module is configured to read the second electromagnetic signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:生理感測系統</p>  
        <p type="p">200:生理感測貼片</p>  
        <p type="p">210:第一薄膜</p>  
        <p type="p">211:第一面</p>  
        <p type="p">212:第二面</p>  
        <p type="p">220:電極</p>  
        <p type="p">300:貼片讀取裝置</p>  
        <p type="p">310:發射模組</p>  
        <p type="p">320:讀取模組</p>  
        <p type="p">400:受測者</p>  
        <p type="p">410:皮膚</p>  
        <p type="p">411:表面</p>  
        <p type="p">420:血管</p>  
        <p type="p">MS1:第一電磁訊號</p>  
        <p type="p">MS2:第二電磁訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="60" publication-number="202613773"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613773.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613773</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135236</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液冷散熱裝置及運算設備</chinese-title>  
        <english-title>LIQUID COOLING DEVICE AND COMPUTING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">G06F1/20</main-classification>  
        <further-classification edition="200601120241129B">H05K7/20</further-classification>  
        <further-classification edition="200601120241129B">F28F1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩摩亞商得樂士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELUXE POINT LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>WS</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張育閎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉芸婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種液冷散熱裝置，其包複數個扁管組件，所述扁管組件相互平行設置且兩所述扁管組件之間設置有散熱組件，所述扁管組件第一扁管，配置成供熱液流通第二扁管，配置成供冷液流通；回液組件流體連通於第一扁管與所述第二扁管，以供熱液以及冷液流通；以及第一導流組件流體連通於第一扁管，以輸入熱液，第二導流組件流體連通於第二扁管，以輸出冷液；其中扁管組件中的第一扁管與第二扁管分隔配置，且複數個第一扁管相對於複數個第二扁管更靠近液冷散熱裝置之排風端。本發明優化液體散熱路徑的結構可以提高散熱效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:液冷散熱裝置</p>  
        <p type="p">110:扁管組件</p>  
        <p type="p">111:第一扁管</p>  
        <p type="p">112:第二扁管</p>  
        <p type="p">120:散熱組件</p>  
        <p type="p">130:回液組件</p>  
        <p type="p">140:第一導流組件</p>  
        <p type="p">150:第二導流組件</p>  
        <p type="p">P1:進風端</p>  
        <p type="p">P2:排風端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="61" publication-number="202612585"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612585.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612585</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135240</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無繩漁具收放裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">A01K79/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣海洋大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>基隆市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄盛煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周恩毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆凌吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪于婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃千芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭振華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種無繩漁具收放裝置，其包含一殼體，殼體具有上下相對的一頂蓋及一底蓋，頂蓋蓋設固定於上開口，進出孔貫穿底蓋；一浮力變換裝置，其包含一上座、一下座、複數固定桿、一驅動裝置及至少一活塞，上座及下座上下相對的固設於殼體內，各固定桿的二端分別固設於上座及下座，驅動裝置設置於殼體內，活塞的一端連接於驅動裝置，活塞的另一端與底蓋之間具有一容置空間且容置空間與進出孔相連通；一供電裝置，其設置於殼體內且電性連接驅動裝置；一控制裝置，其設置於殼體且電性連接供電裝置；本發明可取代現有技術之浮球連接籠子投入海中，透過驅動裝置調整減少本發明之浮力並沉入海床上，再透過提升浮力使本發明上浮至海面供漁民打撈，達到捕撈期間無繩漂浮於海面及海底之間，以維護海洋生態，且本發明之結構作動良率高可重複使用，可提升捕撈率及降低成本。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:殼體</p>  
        <p type="p">13:頂蓋</p>  
        <p type="p">14:底蓋</p>  
        <p type="p">15:抗壓件</p>  
        <p type="p">20:浮力變換裝置</p>  
        <p type="p">21:下座</p>  
        <p type="p">22:中座</p>  
        <p type="p">23:上座</p>  
        <p type="p">24:固定桿</p>  
        <p type="p">25:導軌</p>  
        <p type="p">26:氣缸</p>  
        <p type="p">27:活塞</p>  
        <p type="p">28:驅動裝置</p>  
        <p type="p">30:供電裝置</p>  
        <p type="p">40:控制裝置</p>  
        <p type="p">50:強化支架</p>  
        <p type="p">60:備援裝置</p>  
        <p type="p">61:釋放機構</p>  
        <p type="p">62:浮球</p>  
        <p type="p">621:閃光裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="62" publication-number="202614848"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614848.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614848</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135242</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>橫向擴散金屬氧化物半導體及其製作方法</chinese-title>  
        <english-title>LDMOS AND FABRICATING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D84/80</main-classification>  
        <further-classification edition="202501120250102B">H10D84/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏浩評</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, HAO-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃雅歆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YA-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭晉佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHIN-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張維軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種橫向擴散金屬氧化物半導體包含一半導體基底，半導體基底包含一鰭狀結構和一平面基底，鰭狀結構由平面基底延伸出來，一閘極電極覆蓋平面基底和鰭狀結構，一第一閘極介電層覆蓋平面基底的上表面，第一閘極介電層位在閘極電極和平面基底之間，一第二閘極介電層覆蓋鰭狀結構的上表面與平面基底的上表面，第一閘極介電層和第二閘極介電層相連，第二閘極介電層位在閘極電極和鰭狀結構之間以及閘極電極和平面基底之間，一源極設置在閘極電極一側的鰭狀結構中以及一汲極設置在閘極電極另一側的平面基底中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laterally diffused metal oxide semiconductor includes a semiconductor substrate. The semiconductor substrate includes a fin structure and a planar substrate. The fin structure extends from the planar substrate. A gate electrode covers the planar substrate and the fin structure. A first gate dielectric layer covers a top surface of the planar substrate. The first gate dielectric layer is disposed between the gate electrode and the planar substrate. A second gate dielectric layer covers a top surface of the fin structure and the top surface of the planar substrate. The first gate dielectric layer is connected to the second gate dielectric layer. The second gate dielectric layer is between the gate electrode and the fin structure and between the gate electrode and the planar substrate. A source is disposed in the fin structure at one side of the gate electrode and a drain is disposed in the planar structure at the other side of the gate electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體基底</p>  
        <p type="p">12:鰭狀結構</p>  
        <p type="p">14:平面基底</p>  
        <p type="p">16b:第二淺溝渠隔離</p>  
        <p type="p">18b:第二絶緣結構</p>  
        <p type="p">20:深摻雜區</p>  
        <p type="p">22:摻雜區</p>  
        <p type="p">24a:第一閘極介電層</p>  
        <p type="p">24b:第二閘極介電層</p>  
        <p type="p">26:閘極電極</p>  
        <p type="p">28:側壁子</p>  
        <p type="p">30:漂移區</p>  
        <p type="p">32a:汲極</p>  
        <p type="p">32b:源極</p>  
        <p type="p">34:金屬矽化物</p>  
        <p type="p">100:橫向擴散金屬氧化物半導體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="63" publication-number="202612677"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612677.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612677</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135248</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智能藥盒及其照護系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">A61J7/04</main-classification>  
        <further-classification edition="201801120241007B">G16H20/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞東學校財團法人亞東科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳槐桂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳暐迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘惠瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李采芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宗霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何羿辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃信嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝煒勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種智能藥盒及其照護系統，其中該智能藥盒可透過使用者取藥操作而自動儲存用藥時間紀錄，其中該智能藥盒包含：一本體、一光感應裝置、一處理器及一環蓋。該本體具有一上表面及一環側面，且內部具有數量四個以上各自獨立之置物室，對應該等置物室位置之該上表面處係分別開設有一取藥口，對應該等置物室之該環側面處係分別開設有一置物口；其中，該等取藥口係各自對應設有透明材質之一滑動蓋，且該等滑動蓋朝向該本體之該上表面之中心位置係分別延伸具有一遮斷件，透過該遮斷件遮斷該光感應裝置進而觸發生成一用藥時間資訊傳送至該處理器供以儲存紀錄或再發送。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:智能藥盒</p>  
        <p type="p">10:本體</p>  
        <p type="p">101:上表面</p>  
        <p type="p">1011:取藥口</p>  
        <p type="p">102:環側面</p>  
        <p type="p">1021:置物口</p>  
        <p type="p">103:置物室</p>  
        <p type="p">1031:置藥室</p>  
        <p type="p">1032:乾燥室</p>  
        <p type="p">104:滑動蓋</p>  
        <p type="p">1041:遮斷件</p>  
        <p type="p">105:孔洞隔板</p>  
        <p type="p">12:光感應裝置</p>  
        <p type="p">120:發射器</p>  
        <p type="p">121:接收器</p>  
        <p type="p">122:開槽</p>  
        <p type="p">14:處理器</p>  
        <p type="p">16:環蓋</p>  
        <p type="p">160:開口</p>  
        <p type="p">7:擋止塊</p>  
        <p type="p">8:推移件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="64" publication-number="202613761"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613761.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613761</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135257</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱裝置及組裝支架</chinese-title>  
        <english-title>HEAT DISSIPATION DEVICE AND BRACKET ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">G06F1/16</main-classification>  
        <further-classification edition="200601120241105B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱裝置，用以熱耦合於熱源，並包含組裝支架及散熱器。組裝支架包含固定架、活動架、滑動件、連桿及受壓件。固定架具有用以供熱源設置的鏤空部。活動架連接於固定架而位於打開位置或關閉位置。滑動件設置於固定架。連桿位於固定架與活動架之一側。連桿連接於滑動件與活動架。受壓件穿過固定架並設置於滑動件。滑動件可相對受壓件滑動。散熱器裝設於固定架。受壓件穿過散熱器。散熱器透過鏤空部熱耦合於熱源。當活動架自打開位置轉動至關閉位置時，滑動件透過連桿的帶動而下壓受壓件，使得受壓件下壓散熱器，以令散熱器貼合於熱源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation device is configured to be thermally coupled with a heat source, and includes a bracket assembly and a heat sink. The bracket assembly includes a fixed bracket, a movable bracket, a sliding member, connecting rods and a pressure member. The fixing bracket has a hollow portion configured for the heat source to be disposed. The movable bracket is connected to the fixed bracket, and is located on an open position or a closed position. The sliding member is disposed on the fixed bracket. The connecting rod is located on a side of the fixed bracket and the movable bracket. The connecting rod is connected to the sliding member and the movable bracket. The pressure member passes through the fixed bracket, and is disposed on the sliding member. The sliding portion can slide relative to the pressure member. The heat sink is mounted on the fixed bracket. The pressure member passes through the heat sink. The heat sink is thermally coupled to the heat source via the hollow portion. When the movable bracket rotates from the open position to the closed position, the sliding member is forces to press the pressure member by the connecting rod, so that the pressure member presses the heat sink. Accordingly, the heat sink fits tightly to the heat source.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:散熱裝置</p>  
        <p type="p">11:組裝支架</p>  
        <p type="p">111:固定架</p>  
        <p type="p">112:活動架</p>  
        <p type="p">113:滑動件</p>  
        <p type="p">114:連桿</p>  
        <p type="p">115:受壓件</p>  
        <p type="p">12:散熱器</p>  
        <p type="p">121:缺槽</p>  
        <p type="p">20:電路板</p>  
        <p type="p">30:熱源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="65" publication-number="202614696"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614696.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614696</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135258</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及機殼</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND CHASSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">H05K5/02</main-classification>  
        <further-classification edition="200601120241129B">H05K7/14</further-classification>  
        <further-classification edition="200601120241129B">G06F1/16</further-classification>  
        <further-classification edition="200601120241129B">G06F1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包含機殼及多個電源供應器。機殼包含承載架及多個電源供應器支架。這些電源供應器支架設置於承載架。每一電源供應器支架包含支架頂板、第一支架側板及第二支架側板。第一支架側板與第二支架側板連接於支架頂板之相對兩側。支架頂板、第一支架側板及第二支架側板共同圍繞出容置空間。第一支架側板具有第一卡扣結構，第二支架側板具有第二卡扣結構。這些電源供應器支架之一者的第一支架側板與相鄰之電源供應器支架的第二支架側板透過第一卡扣結構可拆卸地卡扣於第二卡扣結構而相定位。這些電源供應器分別位於這些容置空間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a chassis and a plurality of power supplies. The chassis includes a supporting cage and a plurality of power supply cages. The plurality of power supply cages are disposed on the supporting cage. Each power supply cage includes a top plate, a first side plate and a second side plate. The first side plate and the second side plate are connected to opposite sides of the top plate. The top plate, the first side plate and the second side plate together surround and form an accommodation space. The first side plate has a first engagement structure. The second side plate has a second engagement structure. The first side plate of one of the power supply cages is positioned to the second side plate of the adjacent power supply cage via the first engagement structure detachably engaged with the second engagement structure. The power supplies are located respectively in the accommodation spaces.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">20:機殼</p>  
        <p type="p">21:承載架</p>  
        <p type="p">211:承載架底板</p>  
        <p type="p">212:承載架側板</p>  
        <p type="p">22,22A:電源供應器支架</p>  
        <p type="p">30:第一緊固件</p>  
        <p type="p">40:電源供應器</p>  
        <p type="p">60:第三緊固件</p>  
        <p type="p">S:容置空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="66" publication-number="202613762"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613762.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613762</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135259</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子組件及殼體組件</chinese-title>  
        <english-title>ELECTRONIC ASSEMBLY AND CHASSIS ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240925B">G06F1/16</main-classification>  
        <further-classification edition="200601120240925B">H05K5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳偉銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子組件及殼體組件，其中電子組件包含一機殼、一轉接卡模組以及一顯示卡模組。轉接卡模組包含一組裝架及一轉接卡。組裝架包含一架體及一把手。把手包含二安裝部及一操作部。轉接卡設置於架體。顯示卡模組包含一托架、一顯示卡及一限位罩。顯示卡設置於托架並電性連接於轉接卡。限位罩設置於托架的一側。架體及托架沿相異方向可滑動地設置於機殼。當托架組裝於機殼時，限位罩將操作部罩住，而防止操作部帶動二安裝部相對架體樞轉，進而防止把手帶動架體相對機殼滑動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic assembly and a chassis assembly, where the electronic assembly includes a chassis, a riser card assembly and a graphic card assembly. The riser card assembly includes a bracket and a riser card. The bracket includes a body and a handle. The handle includes two mount parts and a handheld part. The riser card is disposed on the body. The graphic card assembly includes a tray, a graphic card and a restriction cover. The graphic card is disposed on the tray and electrically connected to the riser card. The restriction cover is disposed on a side of the tray. The bracket and the tray are slidably disposed on the chassis along different directions. When the tray is mounted on the chassis, the restriction cover covers the handheld part, to prevent the handheld part from rotating the two mount parts relative to the bracket, thereby preventing the handle from allowing the bracket to slide relative to the chassis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:轉接卡模組</p>  
        <p type="p">211:架體</p>  
        <p type="p">212:把手</p>  
        <p type="p">213:安裝部</p>  
        <p type="p">214:操作部</p>  
        <p type="p">220:轉接卡</p>  
        <p type="p">300:顯示卡模組</p>  
        <p type="p">310:托架</p>  
        <p type="p">313:支撐架</p>  
        <p type="p">320:顯示卡</p>  
        <p type="p">330:限位罩</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="67" publication-number="202613763"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613763.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613763</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135261</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子組件及殼體組件</chinese-title>  
        <english-title>ELECTRONIC ASSEMBLY AND CHASSIS ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">G06F1/16</main-classification>  
        <further-classification edition="200601120241129B">H05K5/02</further-classification>  
        <further-classification edition="200601120241129B">H05K7/12</further-classification>  
        <further-classification edition="200601120241129B">H05K7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳偉銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子組件及殼體組件，其中電子組件包含一機殼、一轉接卡模組以及一顯示卡模組。轉接卡模組包含一組裝架及一轉接卡。組裝架包含一架體、一把手及至少一第一限位結構。把手的一側樞接於架體。轉接卡設置於架體。顯示卡模組包含一托架、一顯示卡及至少一第二限位結構。顯示卡設置於托架並電性連接於轉接卡。至少一第一限位結構位於托架的一側。架體及托架沿相異方向可滑動地設置於機殼。當托架組裝於機殼時，至少一第一限位結構及至少一第二限位結構彼此卡合，而防止把手相對架體樞轉，進而防止把手帶動架體相對機殼滑動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic assembly and a chassis assembly, where the electronic assembly includes a chassis, a riser card assembly and a graphic card assembly. The riser card assembly includes a bracket and a riser card. The bracket includes a body, a handle and a first limiting structure. A side of the handle is pivotally connected to the body. The riser card is disposed on the body. The graphic card assembly includes a tray, a graphic card and a second limiting structure. The graphic card is disposed on the tray and electrically connected to the riser card. The first limiting structure is located on a side of the tray. The body and the tray slidably disposed on the chassis along different directions. When the tray is mounted on the chassis, the first and second limiting structures are engaged with each other, to prevent the handle from being pivoted relative to the body, thereby preventing the body from sliding relative to the chassis by the handle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">211:架體</p>  
        <p type="p">213:第一限位結構</p>  
        <p type="p">214:安裝部</p>  
        <p type="p">215:操作部</p>  
        <p type="p">220:轉接卡</p>  
        <p type="p">221,321:連接器</p>  
        <p type="p">312:側板</p>  
        <p type="p">320:顯示卡</p>  
        <p type="p">330:第二限位結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="68" publication-number="202614531"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614531.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614531</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135262</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池電源管理保護板及其快速關機方法與快速放電電路</chinese-title>  
        <english-title>BATTERY POWER MANAGEMENT PROTECTION BOARD, QUICK SHUTDOWN METHOD AND QUICK DISCHARGE CIRCUIT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241223B">H02J7/36</main-classification>  
        <further-classification edition="200601120241223B">G06F1/26</further-classification>  
        <further-classification edition="200601120241223B">H02H7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIUNN-JOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電池電源管理保護板及其快速關機方法與快速放電電路。快速放電電路包括一第一分壓電路、一第二分壓電路、一比較器、一接地路徑及一接地路徑開關。第一分壓電路連接於一電池，以接收一電池電壓後，輸出一第一分壓。第二分壓電路連接於一放電開關，以接收一放電開關控制電壓後，輸出一第二分壓。比較器之第一輸入端接收第一分壓。比較器之第二輸入端接收第二分壓。若比較器判斷第一分壓高於第二分壓，則比較器輸出一導通電壓至接地路徑開關，以導通接地路徑。透過接地路徑，對電池電源管理保護板之一剩餘電容電量進行快速放電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery power management protection board, a quick shutdown method and a quick discharge circuit thereof are provided. The fast discharge circuit includes a first voltage dividing circuit, a second voltage dividing circuit, a comparator, a ground path and a ground path switch. The first voltage dividing circuit is connected to a battery to receive a battery voltage and then output a first divided voltage. The second voltage dividing circuit is connected to a discharge switch to output a second divided voltage after receiving a discharge switch control voltage. A first input terminal of the comparator receives the first divided voltage. A second input terminal of the comparator receives the second divided voltage. If the comparator determines that the first divided voltage is higher than the second divided voltage, the comparator outputs a conduction voltage to the ground path switch to conduct the ground path. Through the ground path, the remaining capacitance of the battery power management protection board is quickly discharged.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:快速放電電路</p>  
        <p type="p">310:第一分壓電路</p>  
        <p type="p">311:第一電阻</p>  
        <p type="p">312:第二電阻</p>  
        <p type="p">320:第二分壓電路</p>  
        <p type="p">323:第三電阻</p>  
        <p type="p">324:第四電阻</p>  
        <p type="p">330:比較器</p>  
        <p type="p">331:第一輸入端</p>  
        <p type="p">332:第二輸入端</p>  
        <p type="p">333:輸出端</p>  
        <p type="p">340:接地路徑</p>  
        <p type="p">350:接地路徑開關</p>  
        <p type="p">360:二極體</p>  
        <p type="p">370:電源</p>  
        <p type="p">V100:電池電壓</p>  
        <p type="p">V200:放電開關控制電壓</p>  
        <p type="p">V310:第一分壓</p>  
        <p type="p">V320:第二分壓</p>  
        <p type="p">V330H:導通電壓</p>  
        <p type="p">V330L:關斷電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="69" publication-number="202614479"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614479.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614479</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135265</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天線裝置</chinese-title>  
        <english-title>ANTENNA DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241211B">H01Q1/36</main-classification>  
        <further-classification edition="200601120241211B">H01Q21/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余俊緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHUN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝舜誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, SHUN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴郁書</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, YU SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭偉晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種天線裝置，包含基板及天線單元。天線單元設置於基板，並包含二鉤狀激發體、導向體、反射體及阻抗匹配體。二鉤狀激發體相分離。二鉤狀激發體之相對兩端分別相對。二鉤狀激發體之一者的一端具有饋入端。二鉤狀激發體之另一者的一端具有接地端。導向體位於二鉤狀激發體之一側。反射體位於二鉤狀激發體遠離導向體之一側。反射體靠近二鉤狀激發體之一側具有二第一直線邊及弧線邊。二第一直線邊分別連接於弧線邊之相對兩端。阻抗匹配體包含電感件。電感件位於二鉤狀激發體與反射體之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An antenna device includes a substrate and an antenna component. The antenna component is disposed on the substrate, and includes two hook-shaped exciters, a guider, a reflector and an impedance matching body. The two hook-shaped exciters are spaced apart from each other. Two opposite ends of the two hook-shaped exciters face each other, respectively. One end of one of the two hook-shaped exciters has a feeding end. One end of another hook-shaped exciter has a grounding end. The guider is located on one side of the two hook-shaped exciters. The reflector is located on the side of the two hook-shaped exciters away from the guider. A side of the reflector closed to the two hook-shaped exciters has two first linear sides and a curve side. The two first linear sides are connected to opposite ends of the curve side, respectively. The impedance matching body includes an inductor. The inductor is located between the two hook-shaped exciters and the reflector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:天線裝置</p>  
        <p type="p">11:基板</p>  
        <p type="p">12:天線單元</p>  
        <p type="p">121:鉤狀激發體</p>  
        <p type="p">122:導向體</p>  
        <p type="p">123:反射體</p>  
        <p type="p">124:阻抗匹配體</p>  
        <p type="p">1241:電感件</p>  
        <p type="p">1242:第一電容件</p>  
        <p type="p">1243:第二電容件</p>  
        <p type="p">1244:第三電容件</p>  
        <p type="p">E1:饋入端</p>  
        <p type="p">E2:接地端</p>  
        <p type="p">L11:長度</p>  
        <p type="p">T:厚度</p>  
        <p type="p">W11:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="70" publication-number="202614480"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614480.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614480</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135269</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天線裝置</chinese-title>  
        <english-title>ANTENNA DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241219B">H01Q1/36</main-classification>  
        <further-classification edition="201501120241219B">H01Q5/30</further-classification>  
        <further-classification edition="200601120241219B">H01Q21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃士瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晉瑀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JIN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴郁書</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, YU SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭偉晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種天線裝置，包含第一基板、第二基板、激發單元、多個矩形輻射單元、多個圓形輻射單元及阻抗匹配單元。第一基板具有相背對的第一底面及第一頂面。第二基板疊設於第一基板，並具有相背對的第二底面及第二頂面。第二底面與第一頂面相連。激發單元設置於第一底面，並包含音叉狀激發體、條狀激發體及柵狀激發體。音叉狀激發體包含柄部及分岔部。柄部、條狀激發體及柵狀激發體連接於分岔部。這些矩形輻射單元、這些圓形輻射單元及阻抗匹配單元設置於第二頂面。這些矩形輻射單元圍繞這些圓形輻射單元。這些圓形輻射單元圍繞阻抗匹配單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An antenna device includes a first substrate, a second substrate, an exciting component, a plurality of rectangular radiating components, a plurality of circular radiating components and an impedance matching component. The first substrate has a first bottom surface and a first top surface opposite to each other. The second substrate is stacked on the first substrate, and has a second bottom surface and a second top surface opposite to each other. The second bottom surface is connected to the first top surface. The exciting component is disposed on the first bottom surface, and includes a tuning fork-shaped exciting body, a bar-shaped exciting body and a fence-shaped exciting body. The tuning fork-shaped exciting body includes a handle portion and a bifurcated portion. The handle portion, the bar-shaped exciting body and the fence-shaped exciting body are connected to the bifurcation portion. The rectangular radiating components, the circular radiating components and the impedance matching component are disposed on the second top surface. The rectangular radiating components surround the circular radiating components. The circular radiating components surround the impedance matching component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:天線裝置</p>  
        <p type="p">20:第一基板</p>  
        <p type="p">21:第一底面</p>  
        <p type="p">22:第一頂面</p>  
        <p type="p">30:第二基板</p>  
        <p type="p">31:第二底面</p>  
        <p type="p">32:第二頂面</p>  
        <p type="p">40:激發單元</p>  
        <p type="p">4111:饋入點</p>  
        <p type="p">50:訊號耦合單元</p>  
        <p type="p">51:缺槽</p>  
        <p type="p">60:矩形輻射單元</p>  
        <p type="p">70:圓形輻射單元</p>  
        <p type="p">80:阻抗匹配單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="71" publication-number="202614481"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614481.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614481</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135274</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天線裝置</chinese-title>  
        <english-title>ANTENNA DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241219B">H01Q1/36</main-classification>  
        <further-classification edition="201501120241219B">H01Q5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯俊安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, CHUN-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高文霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, WEN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴郁書</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, YU SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭偉晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種天線裝置，包含基板、激發體及低頻匹配體。基板具有相背對的第一面及第二面。激發體設置於第一面，並包含相分離的二第一激發部及第二激發部。二第一激發部相對稱。每一第一激發部包含第一激發段、第二激發段、第三激發段、第四激發段及第五激發段。第二激發段之一端連接於第一激發段之一端。第三激發段之一端連接於第二激發段之另一端。第四激發段之一端連接於第三激發段之另一端。第五激發段之一端連接於第四激發段之另一端。二第四激發段及第二激發部分別與基板之相異側邊相鄰。低頻匹配體設置於第二面，並與基板之側邊相分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An antenna device includes a substrate, an exciting body and a low-frequency matching body. The substrate has a first surface and a second surface opposite to each other. The exciting body is disposed on the first surface, and includes two first exciting portions and a second exciting portion spaced apart from each other. The two first exciting portions are symmetrical. Each of the two first exciting portions includes a first exciting section, a second exciting section, a third exciting section, a fourth exciting section and a fifth exciting section. One end of the second exciting section is connected to one end of the first exciting section. One end of the third exciting section is connected to another end of the second exciting section. One end of the fourth exciting section is connected to another end of the third exciting section. One end of the fifth exciting section is connected to another end of the fourth exciting section. The fourth exciting section and the second exciting section are adjacent to different sides of the substrate, respectively. The low-frequency matching body is disposed on the second surface, and is spaced apart from the sides of the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:天線裝置</p>  
        <p type="p">11:基板</p>  
        <p type="p">111:第一側邊</p>  
        <p type="p">112:第二側邊</p>  
        <p type="p">113:第三側邊</p>  
        <p type="p">114:第四側邊</p>  
        <p type="p">115:第一面</p>  
        <p type="p">116:第二面</p>  
        <p type="p">12:激發體</p>  
        <p type="p">121:第一激發部</p>  
        <p type="p">122:第二激發部</p>  
        <p type="p">13:接地體</p>  
        <p type="p">14:饋入體</p>  
        <p type="p">15:低頻匹配體</p>  
        <p type="p">16:去耦合體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="72" publication-number="202614735"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614735.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614735</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135275</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241001B">H10B12/00</main-classification>  
        <further-classification edition="200601120241001B">H01L23/522</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王守得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHOU-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置，包括：基底；設置於基底上的閘極結構；覆蓋閘極結構的第一絕緣層；設置穿過第一絕緣層的接觸件，其中接觸件橫向地鄰近閘極結構；設置於第一絕緣層上且物理接觸接觸件的金屬層；以及覆蓋金屬層的側壁的第一介電層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes: a substrate; a gate structure disposed on the substrate; a first insulating layer covering the gate structure; a contact disposed through the first insulating layer, wherein the contact is laterally adjacent to the gate structure; a metal layer disposed on the first insulating layer and in physical contact with the contact; and a first dielectric layer covering a sidewall of the metal layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體裝置</p>  
        <p type="p">10A:記憶體區</p>  
        <p type="p">10B:周邊區</p>  
        <p type="p">100:基底</p>  
        <p type="p">120:淺溝槽隔離結構</p>  
        <p type="p">122:隔離層</p>  
        <p type="p">124,280,360:蓋層</p>  
        <p type="p">140,160:井區</p>  
        <p type="p">200:字元線</p>  
        <p type="p">220,320,560,820,860:介電層</p>  
        <p type="p">240:阻障層</p>  
        <p type="p">260:導電填充物</p>  
        <p type="p">300:位元線</p>  
        <p type="p">340,530:導電層</p>  
        <p type="p">400:電容接觸件</p>  
        <p type="p">500A,500B,500C:閘極結構</p>  
        <p type="p">510:閘極導體</p>  
        <p type="p">520:黏著層</p>  
        <p type="p">540:硬遮罩</p>  
        <p type="p">550:間隔物</p>  
        <p type="p">620,640,1000:絕緣層</p>  
        <p type="p">660:襯層</p>  
        <p type="p">680:接觸件</p>  
        <p type="p">720,740,760:金屬層</p>  
        <p type="p">A-A’:線段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="73" publication-number="202613479"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613479.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613479</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135276</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三維均溫板構造</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">F28D15/04</main-classification>  
        <further-classification edition="200601120241129B">F28F3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴耀惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴耀惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宇樞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種三維均溫板構造，包含有：一底均溫板具有一底板以及一頂板，該頂板具有一連接口，該頂板具有沿該連接口的周緣彎曲而連續形成一上升部、一水平部以及一彎折部，該彎折部與該上升部之間形成一凹窩。以及包含一直立均溫單元，藉該連接口結合於該底均溫板，該直立均溫單元具有一肩部進入該連接口並由下向上抵於該彎折部，且具有一上毛細層延伸至該肩部底面而與該頂毛細材構成在毛細現象上相通的關係；其中，該肩部與該彎折部之間係具有一縫隙，該縫隙與該頂毛細材及該上毛細層在毛細現象上相隔絕而不相通。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">111:底板</p>  
        <p type="p">112:頂板</p>  
        <p type="p">113:連接口</p>  
        <p type="p">113a:上升部</p>  
        <p type="p">113b:水平部</p>  
        <p type="p">113c:彎折部</p>  
        <p type="p">113d:外緣</p>  
        <p type="p">12:容置空間</p>  
        <p type="p">14:底毛細材</p>  
        <p type="p">141:毛細立柱</p>  
        <p type="p">16:頂毛細材</p>  
        <p type="p">161:穿孔</p>  
        <p type="p">19:凹窩</p>  
        <p type="p">22:外殼</p>  
        <p type="p">223:肩部</p>  
        <p type="p">223d:外肩緣</p>  
        <p type="p">23:上毛細層</p>  
        <p type="p">231:直立毛細層</p>  
        <p type="p">24:直立空間</p>  
        <p type="p">26:底部開口</p>  
        <p type="p">99:焊料</p>  
        <p type="p">S:縫隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="74" publication-number="202614589"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614589.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614589</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135278</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加速自舉的全同態加密計算器、計算系統及其運作方法</chinese-title>  
        <english-title>ACCELERATED BOOTSTRAPPING HOMOMORPHIC ENCRYPTION CALCULATOR, COMPUTING SYSTEM, AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250102B">H04L9/00</main-classification>  
        <further-classification edition="200601120250102B">H04L9/08</further-classification>  
        <further-classification edition="201301120250102B">G06F21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭彧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顧昱得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, YU-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何明倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, MING-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許之凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張明清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MING-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳維超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉峰豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, FENG-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪士灝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, SHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">加速自舉（bootstrapping）的全同態加密計算器，包括記憶體、控制器、任務排程器、多個處理單元以及匯流排。記憶體用於儲存結構為環上誤差學習（Learning With Errors over Rings, RLWE）的密文。控制器用於接收第一指令以將密文儲存至記憶體，並產生用於依據密文進行自舉的第二指令。任務排程器用於接收第二指令以產生多個任務並進行這些任務的排程。多個處理單元用於將密文分解為多個任務，並依據排程執行多個運算以產生結構為環上誤差學習的中間結果或最終結果。匯流排電性連接記憶體、控制器、任務排程器以及多個處理單元。匯流排用於傳輸密文、第二指令及最終結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An accelerated bootstrapping homomorphic encryption calculator includes a memory, a controller, a task scheduler, a plurality of processing units, and a bus. The memory is configured to store ciphertext structured as Learning With Errors over Rings (RLWE). The controller is configured to receive a first instruction to store the ciphertext in the memory and generate a second instruction for bootstrapping according to the ciphertext. The task scheduler is configured to receive the second instruction to generate a plurality of tasks and generate a schedule of the plurality of tasks. The plurality of processing units are configured to decompose the ciphertext into the plurality of tasks and perform computations according to the schedule to generate an intermediate result or a final result structured as RLWE. The bus is electrically connected to the memory, the controller, the task scheduler, and the plurality of processing units. The bus is configured to transmit the ciphertext, the second instruction, and the final result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:主機</p>  
        <p type="p">A1:儲存裝置</p>  
        <p type="p">A2:處理器</p>  
        <p type="p">A3:通訊裝置</p>  
        <p type="p">B:全同態加密計算器</p>  
        <p type="p">B1:記憶體</p>  
        <p type="p">B2:控制器</p>  
        <p type="p">B3:任務排程器</p>  
        <p type="p">B4:處理單元</p>  
        <p type="p">B5:匯流排</p>  
        <p type="p">RLWE:計算模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="75" publication-number="202613975"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613975.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613975</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135281</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於分布外的異常檢測方法及非暫態電腦可讀取媒體</chinese-title>  
        <english-title>ANOMALY DETECTION METHOD BASED ON OUT-OF-DISTRIBUTION AND NON-TRANSITORY COMPUTER-READABLE MEDIA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241007B">G06V10/774</main-classification>  
        <further-classification edition="201701120241007B">G06T7/194</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳維超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李政霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JENG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎　軒喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GALAYDA, NIKITA MIKHAYLOVICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">基於分布外的異常檢測方法包括：取得包括多個影像的一訓練資料集，這些影像包括一第一影像及多個第二影像，分割每個影像中的物件及背景，計算第一影像的物件與每個第二影像的物件的相似度，從多個第二影像中選擇相似度大於閾值的候選影像，混合第一影像的物件與候選影像中的背景以產生混合影像，依據訓練資料集及混合影像訓練檢測模型，執行檢測模型以依據訓練資料集及混合影像產生多個分布內嵌入，依據一測試樣本產生測試嵌入，計算這些分布內嵌入與該測試嵌入之間的多個距離，若這些距離中的最小值超過一預設值，將測試樣本分類為異常。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An anomaly detection based on out-of-distribution includes: obtaining a training dataset comprising a plurality of images, where the plurality of images include a first image and a plurality of second images, separating an object and a background in each image, calculating a similarity between an object in the first image and an object in each of the plurality of second images, selecting a candidate image from the plurality of second images with a similarity greater than a threshold, mixing the object in the first image with the context in the candidate images to generate a mixed image, training a detection model according to the training dataset and the mixed image, executing the detection model to generate a plurality of in-distribution embeddings according to the training dataset and the mixed image, generating a test embedding according to a test sample, calculating a plurality of distances between the plurality of in-distribution embeddings and the test embedding, and classifying the test sample as anomalous if a minimum value among the plurality of distances exceeds a preset value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1-S9:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="76" publication-number="202614598"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614598.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614598</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135287</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>網路交換機之測試裝置及測試方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241007B">H04L43/0829</main-classification>  
        <further-classification edition="202201120241007B">H04L43/0894</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明泰科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉純恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許家華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李易撰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種網路交換機之測試裝置，包括：中央處理單元、加速埠以及至少一傳輸埠，加速埠開啟內部回送及存取控制清單，傳輸埠連接至少一待測網路交換機之待測傳輸埠，加速埠及傳輸埠設定成同一虛擬區域網路。中央處理單元將封包傳送至加速埠，封包經由內部回送及存取控制清單迴環傳送在加速埠達到一預定線速並經由虛擬區域網路之泛洪機制傳送至傳輸埠；傳輸埠將達到預定線速之封包傳送至待測傳輸埠；中央處理單元於測試時間到期時停止傳輸埠傳送封包。另揭露一種網路交換機之測試方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:網路交換機之測試裝置</p>  
        <p type="p">10:中央處理單元</p>  
        <p type="p">11:埠</p>  
        <p type="p">111:加速埠</p>  
        <p type="p">112:傳輸埠</p>  
        <p type="p">V1:虛擬區域網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="77" publication-number="202613850"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613850.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613850</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135291</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以影像識別布料髒污選擇洗滌方式的系統及其方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR SELECTING WASHING METHODS BASED ON IMAGE RECOGNITION OF FABRIC STAIN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241105B">G06F18/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張凱傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KAI CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張凱傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KAI CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種以影像識別布料髒污選擇洗滌方式的系統及其方法，透過資料庫主機儲存布料訊息及污漬訊息，以及由預訓練主機使用人工智慧技術預先訓練出布料識別模型及污漬識別模型，再由洗滌裝置對布料進行拍攝及掃瞄至少其中之一以生成布料圖像且進行標準化處理以生成標準化圖像，接著，將標準化圖像分別輸入至布料識別模型及污漬識別模型以獲得布料類型及污漬類型，以及分析污漬位置及污漬面積，以便從洗滌方式中篩選出最佳洗滌方式，用以達到提高洗滌的效率及效果之技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and method for selecting washing methods based on image recognition of fabric stain is disclosed. By storing fabric and stain information in a database server, and utilizing a pre-trained server with artificial intelligence technology to develop fabric recognition models and stain recognition models, the washing device captures and scans the fabric to generate a fabric image. This image is then standardized to produce a standardized image. The standardized image is subsequently input into both the fabric recognition model and the stain recognition model to identify the fabric type and stain type, analyze the stain location and stain area, and thereby select the most suitable washing method from the available options. The mechanism is help to improve the efficiency and the effectiveness of washing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:資料庫主機</p>  
        <p type="p">120:預訓練主機</p>  
        <p type="p">130:洗滌裝置</p>  
        <p type="p">131:成像裝置</p>  
        <p type="p">132:非暫態電腦可讀儲存媒體</p>  
        <p type="p">133:硬體處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="78" publication-number="202614697"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614697.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614697</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135292</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機櫃及減震機構</chinese-title>  
        <english-title>CABINET APPARATUS AND VIBRATION REDUCTION MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241118B">H05K5/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡協良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, HSIEH-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡文誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, WEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佳宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種機櫃，包含一櫃體、多個電子裝置及至少一減震機構。這些電子裝置設置於櫃體內。減震機構設置於櫃體內且包含一外殼及一配重組件，配重組件設置於外殼內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cabinet apparatus includes a cabinet, a plurality of electronic devices and at least one vibration reduction mechanism. The electronic devices are disposed in the cabinet. The vibration reduction mechanism is disposed in the cabinet and includes a casing and a weight distribution assembly disposed in the casing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31:外殼</p>  
        <p type="p">311:底板</p>  
        <p type="p">3111:承載面</p>  
        <p type="p">312:側板</p>  
        <p type="p">32:配重組件</p>  
        <p type="p">321:配重板</p>  
        <p type="p">322:配重塊</p>  
        <p type="p">C:中心線</p>  
        <p type="p">N:法線</p>  
        <p type="p">P:多邊形</p>  
        <p type="p">G:重心</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="79" publication-number="202614473"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614473.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614473</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135293</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>頻率選擇表面結構</chinese-title>  
        <english-title>FREQUENCY SELECTIVE SURFACE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">H01P1/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王顥翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAO-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴郁書</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, YU SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭偉晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種頻率選擇表面結構包含一基板以及至少一導電層。至少一導電層設置於基板上並包含四中央雙頻選擇片。四中央雙頻選擇片彼此分離且排列成2ⅹ2陣列。於四中央雙頻選擇片每一者中，中央雙頻選擇片呈多邊形並具有一中央角落部、多個外角落部及多個缺口。中央角落部較外角落部靠近至少一導電層之幾何中心。缺口分別位於外角落部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A frequency selective surface structure including a substrate and at least one conductive layer. The at least one conductive layer is disposed on the substrate and includes four center double frequency selective sheets spaced apart from one another and arranged in a 2ⅹ2 array. In each center double frequency selective sheet, the center double frequency selective sheet is in a polygonal shape and has a center corner part, outer corner parts and recesses. The center corner part is located closer to a center of the at least one conductive layer than the outer corner parts. The recesses are located on the outer corner parts, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:外表面</p>  
        <p type="p">210:中央雙頻選擇片</p>  
        <p type="p">211:中央角落部</p>  
        <p type="p">212:外角落部</p>  
        <p type="p">213:缺口</p>  
        <p type="p">214:外邊緣</p>  
        <p type="p">215:開孔</p>  
        <p type="p">230:高頻選擇片</p>  
        <p type="p">231:周緣部</p>  
        <p type="p">233:凸部</p>  
        <p type="p">250:低頻選擇片</p>  
        <p type="p">251:第一頻率選擇條</p>  
        <p type="p">252:第二頻率選擇條</p>  
        <p type="p">253:重合區域</p>  
        <p type="p">T:厚度</p>  
        <p type="p">C:幾何中心</p>  
        <p type="p">R:外圍區域</p>  
        <p type="p">L1,L2,L3,L4:長度</p>  
        <p type="p">W1,W2,W3,W6,W7,W8:寬度</p>  
        <p type="p">W4:外寬度</p>  
        <p type="p">W5:內寬度</p>  
        <p type="p">D1,D2,D3:距離</p>  
        <p type="p">E1,E2:延伸方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="80" publication-number="202614482"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614482.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614482</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135295</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>射頻感測系統</chinese-title>  
        <english-title>RADIO FREQUENCY SENSING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241211B">H01Q1/36</main-classification>  
        <further-classification edition="200601120241211B">H01Q1/44</further-classification>  
        <further-classification edition="200601120241211B">H01P1/18</further-classification>  
        <further-classification edition="200601120241211B">H01P5/12</further-classification>  
        <further-classification edition="200601120241211B">G06K19/067</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭偉晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施易成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, YI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴郁書</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, YU SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種天線裝置，包含第一基板、第二基板、訊號耦合體、介質共振元件及輻射體。第一基板具有第一頂面及相對於第一頂面的第一底面。第二基板具有第二頂面及相對於第二頂面的第二底面。訊號耦合體設置於第一頂面及第二底面之間，且具有十字開槽。介質共振元件設置於第二頂面。輻射體設置於第一底面，且包含第一輻射單元及第二輻射單元，其中第一輻射單元及第二輻射單元用於接收或輸出不同極化訊號。一種射頻感測系統，包含天線裝置及切換元件。切換元件電性連接於天線裝置的輻射體，用於切換天線裝置連接至雷達電路或網卡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An antenna device includes a first substrate, a second substrate, a signal coupler, a dielectric resonance element and a radiator. The first substrate has a first top surface and a first bottom surface opposite to the first top surface. The second substrate has a second top surface and a second bottom surface opposite to the second top surface. The signal coupler is disposed between the first top surface and the second bottom surface and has a cross slot. The dielectric resonance element is disposed on the second top surface. The radiator is disposed at the first bottom surface and includes a first radiating unit and a second radiating unit, wherein the first radiating unit and the second radiating unit is used to receive or transmit different polarized signals. A radio frequency sensing system includes the antenna device and a switching element. The switching element is electrically connected to the radiator of the antenna device, and is used to switch the connection of the antenna device to a radar circuit or a network card.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:天線裝置</p>  
        <p type="p">11:第一基板</p>  
        <p type="p">111:第一頂面</p>  
        <p type="p">112:第一底面</p>  
        <p type="p">12:第二基板</p>  
        <p type="p">121:第二頂面</p>  
        <p type="p">122:第二底面</p>  
        <p type="p">13:輻射體</p>  
        <p type="p">131:第一輻射單元</p>  
        <p type="p">132:第二輻射單元</p>  
        <p type="p">133:第三輻射單元</p>  
        <p type="p">14:介質共振元件</p>  
        <p type="p">15:訊號耦合體</p>  
        <p type="p">151:十字開槽</p>  
        <p type="p">L1-L3:長度</p>  
        <p type="p">W1-W3:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="81" publication-number="202614665"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614665.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614665</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135302</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有內埋式加熱機制之雙層式裝置及其處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241014B">H05B3/20</main-classification>  
        <further-classification edition="200601220241014B">A47J27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣福材工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何建智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙元寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係準備一雙層式結構及一加熱裝置。雙層式結構具有一內壁、一外壁及複數間隔部；內壁具有一第一熔點；複數間隔部間隔於內壁與外壁之間；每一間隔部係設複數凹部接觸內壁，加熱裝置具有一控制部、複數導線及複數電熱絲部；複數電熱絲部對應複數間隔部，而埋設於內壁內。當控制部透過複數導線控制複數電熱絲部產生熱，係使內壁鄰近複數凹部之位置超過第一熔點，而具有流動性而可塑性變形成複數凸部，恰可填入複數凹部，並當控制部控制複數電熱絲部不產生熱，複數凸部冷卻固化與複數凹部緊密結合為一體。達成內埋式設計相當方便及可以較接近之路徑加熱較有效率等優點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:雙層式結構</p>  
        <p type="p">11:內壁</p>  
        <p type="p">111:儲存空間</p>  
        <p type="p">12:外壁</p>  
        <p type="p">13:間隔部</p>  
        <p type="p">131:第一表面</p>  
        <p type="p">132:第二表面</p>  
        <p type="p">13A:凹部</p>  
        <p type="p">20:加熱裝置</p>  
        <p type="p">21:控制部</p>  
        <p type="p">22:導線</p>  
        <p type="p">23:電熱絲部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="82" publication-number="202614647"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614647.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614647</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135305</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於重新綁定通訊應用程式的系統</chinese-title>  
        <english-title>SYSTEM FOR REBINDING COMMUNICATION APPLICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120250102B">H04W8/18</main-classification>  
        <further-classification edition="200901120250102B">H04W8/02</further-classification>  
        <further-classification edition="202301120250102B">G06Q40/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兆豐國際商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEGA INTERNATIONAL COMMERCIAL BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭怡婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHENG, YI TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡甄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭偉誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, WEI CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種用於重新綁定通訊應用程式的系統。用於重新綁定通訊應用程式的系統包括使用者裝置、通訊應用程式伺服器以及銀行伺服器。使用者裝置包括通訊應用程式，且使用者裝置對應於原使用者綁定身分。銀行伺服器儲存原使用者綁定身分。當銀行伺服器獲得對應於使用者裝置的新使用者身分時，銀行伺服器經由通訊應用程式伺服器來傳送通訊應用程式重新綁定通知至使用者裝置。使用者裝置經由通訊應用程式伺服器來傳送通訊應用程式重新綁定請求至銀行伺服器。銀行伺服器儲存對應於使用者裝置的新使用者綁定身分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for rebinding a communication application is provided. The system for rebinding the communication application includes a user device, a communication application server, and a bank server. The user device includes a communication application, and the user device corresponds to an original user binding identity. The bank server stores the original user binding identity. When the bank server obtains a new user identity corresponding to the user device, the bank server transmits a communication application rebinding notification to the user device via the communication application server. The user device transmits a communication application rebinding request to the bank server via the communication application server. The bank server stores a new user binding identity corresponding to the user device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:用於重新綁定通訊應用程式的系統</p>  
        <p type="p">110:使用者裝置</p>  
        <p type="p">111:通訊應用程式</p>  
        <p type="p">130:通訊應用程式伺服器</p>  
        <p type="p">150:銀行伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="83" publication-number="202614519"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614519.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614519</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135317</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鎖模雷射檢測裝置及方法</chinese-title>  
        <english-title>MODE-LOCKING LASER DETECTION DEVICE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120240930B">H01S3/1106</main-classification>  
        <further-classification edition="200601120240930B">H01S3/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞勝開發有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>A-WINS DEVELOPMENT CO. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳震偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請為一種鎖模雷射檢測裝置，其包含有一分光模組、一第一反射模組及一第二反射模組。分光模組接收鎖模雷射，分光模組根據一分光比例處理鎖模雷射，以輸出一脈衝光波；第一反射模組接收脈衝光波，第一反射模組根據第一反射率反射脈衝光波，以得到一第一反射光波；第二反射模組接收脈衝光波，第二反射模組根據第二反射率反射脈衝光波，以得到一第二反射光波；第一反射光波之波長不同於第二反射光波之波長，藉以得到鎖模雷射的波長寬度。藉此，找出脈衝雷射的光譜寬度，以確認脈衝雷射的狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mode-locking laser detection device, which comprises a splitter module, a first reflection module and a second reflection module. The splitter module receives the mode-locked laser, and the splitter module processes the mode-locked laser according to the ratio of one beam to output a pulse light wave; the first reflection module receives the pulse light wave, and the first reflection module reflects the pulse light wave according to a first reflectivity to obtain a first reflected light wave; the second reflection module receives the pulse light wave, and the second reflection module reflects the pulse light wave according to a second reflectivity to obtain a second reflected light wave; The first reflected light wave is different from the second reflected light wave, and a wavelength width of the mode-locked laser is obtained. Thus, the spectral width of the pulsed laser can be found to confirm the status of the pulsed laser.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:鎖模雷射檢測裝置</p>  
        <p type="p">200:脈衝雷射裝置</p>  
        <p type="p">1:鎖模雷射</p>  
        <p type="p">2:脈衝光波</p>  
        <p type="p">10:分光模組</p>  
        <p type="p">20:第一反射模組</p>  
        <p type="p">21:第一反射光波</p>  
        <p type="p">22:第一脈衝光波</p>  
        <p type="p">23:第一奈米狀結構</p>  
        <p type="p">30:第二反射模組</p>  
        <p type="p">31:第二反射光波</p>  
        <p type="p">32:第二脈衝光波</p>  
        <p type="p">33:第二奈米狀結構</p>  
        <p type="p">40:偵測器</p>  
        <p type="p">41:第一偵測訊號</p>  
        <p type="p">42:第二偵測訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="84" publication-number="202614520"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614520.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614520</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135318</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鎖模雷射監測設備及方法</chinese-title>  
        <english-title>MODE-LOCKING LASER MONITORING EQUIPMENT AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120240930B">H01S3/1106</main-classification>  
        <further-classification edition="200601120240930B">H01S3/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立彰化師範大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHANGHUA UNIVERSITY OF EDUCATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張譽鐘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳震偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請為一種鎖模雷射監測設備，其包含有一光源模組、一分光模組、一濾光模組及一監測模組。光源模組用以產生一脈衝雷射光；分光模組接收脈衝雷射光，脈衝雷射光經過分光模組而得到一第一反射光波及一第二反射光波；濾光模組接收第一反射光波及第二反射光波，第一反射光波與第二反射光波經過濾光模組的濾光分別得到一第一濾光光波及一第二濾光光波；監測模組接收第一濾光光波與第二濾光光波，藉以得知脈衝雷射光的波長寬度。藉此，本申請不需要複雜的、昂貴的設備，即可確認鎖模雷射的狀態及穩定性，以利於相關人員的監測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mode-locking laser monitoring equipment, which comprises a light source module, a splitter module, a filter module and a monitoring module. The light source module is used to generate a pulsed laser light; The splitter receives the pulsed laser light, and the pulsed laser light passes through the splitter module to obtain a first reflected light wave and a second reflected light wave; the filter module receives the first reflected light wave and the second reflected light wave, and the first reflected light wave and the second reflected light wave obtain a first filter light wave and a second filter light wave respectively through the filter light of the filter module; The monitoring module receives the first filter light wave and the second filter light wave to know the wavelength width of the pulsed laser light. Thus, the application does not require complex and expensive equipment to confirm the status and stability of the mode-locking laser, which is convenient for the monitoring of relevant personnel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:鎖模雷射監測設備</p>  
        <p type="p">10:光源模組</p>  
        <p type="p">11:脈衝雷射光</p>  
        <p type="p">20:分光模組</p>  
        <p type="p">21:第一反射光波</p>  
        <p type="p">22:第二反射光波</p>  
        <p type="p">30:濾光模組</p>  
        <p type="p">31:第一濾光光波</p>  
        <p type="p">32:第二濾光光波</p>  
        <p type="p">40:監測模組</p>  
        <p type="p">41:第一輸出訊號</p>  
        <p type="p">42:第二輸出訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="85" publication-number="202613758"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613758.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613758</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135323</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調式參考電壓產生器</chinese-title>  
        <english-title>TUNABLE VOLTAGE REFERENCE GENERATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241211B">G05F3/08</main-classification>  
        <further-classification edition="200601120241211B">G05F1/565</further-classification>  
        <further-classification edition="200601120241211B">G06F1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇景光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIMAX TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范銘彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, MING YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳義夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BO RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊茗豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, MING FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林敬倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可調式參考電壓產生器，包含四電晶體電路，其包含第一電晶體、第二電晶體、第三電晶體及第四電晶體，依序串聯於電源與地之間，其中第一電晶體與第二電晶體互相連接於第一節點，其輸出參考電壓，第二電晶體與第三電晶體互相連接於第二節點，第三電晶體與第四電晶體互相連接於第三節點；及微調電路，連接至第三節點。其中第一電晶體的臨界電壓低於第二電晶體、第三電晶體及第四電晶體的臨界電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tunable voltage reference generator includes a four-transistor circuit composed of a first transistor, a second transistor, a third transistor and a fourth transistor that are sequentially connected in series between a power supply and ground, the first transistor and the second transistor being interconnected at a first node that outputs a reference voltage, the second transistor and the third transistor being interconnected at a second node, the third transistor and the fourth transistor being interconnected at a third node; and a trimming circuit connected to the third node. The threshold voltage of the first transistor is lower than the threshold voltages of the second transistor, the third transistor and the fourth transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:可調式參考電壓產生器</p>  
        <p type="p">11:四電晶體電路</p>  
        <p type="p">12:微調電路</p>  
        <p type="p">121:第一微調分支</p>  
        <p type="p">Vdd:電源</p>  
        <p type="p">Vref:參考電壓</p>  
        <p type="p">Vb0~Vb3:微調位元</p>  
        <p type="p">N1:第一節點</p>  
        <p type="p">N2:第二節點</p>  
        <p type="p">N3:第三節點</p>  
        <p type="p">M1:第一電晶體</p>  
        <p type="p">M2:第二電晶體</p>  
        <p type="p">M3:第三電晶體</p>  
        <p type="p">M4:第四電晶體</p>  
        <p type="p">M5:第五電晶體</p>  
        <p type="p">M9:第六電晶體</p>  
        <p type="p">M6~M8,M10~12:電晶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="86" publication-number="202613801"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613801.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613801</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135325</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子控制系統</chinese-title>  
        <english-title>ELECTRONIC CONTROL SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G06F9/22</main-classification>  
        <further-classification edition="200601120241202B">G06F9/48</further-classification>  
        <further-classification edition="202201120241202B">B60R1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓舜文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, SHUN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉訓成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HSUN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子控制系統包含微控制器以及片上系統。微控制器用以接收控制器局域網喚醒訊號以及點火開關訊號。片上系統耦接微控制器。在待機模式中，該片上系統處於第一狀態，並且微控制器根據控制器局域網喚醒訊號以及點火開關訊號，判斷是否將待機模式切換為啟動模式或休眠模式。在啟動模式中，片上系統處於相異於第一狀態的第二狀態，以進行系統啟動程序，且當系統啟動程序完成，微控制器將啟動模式切換為工作模式。在工作模式中，片上系統處於第二狀態，以控制錄影機錄製影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic control system includes a microcontroller and a system on chip. The microcontroller is configured to receive a controller area network wake-up signal and an ignition switch signal. The system on chip is coupled to the microcontroller. In a standby mode, the system on ship is in a first state, and the microcontroller determines whether to switch the standby mode to a boot mode or a sleep mode according to the controller area network wake-up signal and the ignition switch signal. In the boot mode, the system on chip is in a second state different from the first state, so as to performing a system boot process, and when the system boot process is complete, the microcontroller switches the boost mode to an active mode. In the active mode, the system on chip is in a second state, in order to control a camera to record a video.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子控制系統</p>  
        <p type="p">110:微控制器</p>  
        <p type="p">112:喚醒訊號</p>  
        <p type="p">114:關閉訊號</p>  
        <p type="p">120:片上系統</p>  
        <p type="p">122:保持活動訊號</p>  
        <p type="p">124:狀態訊號</p>  
        <p type="p">130:控制器局域網匯流排</p>  
        <p type="p">132:控制器局域網喚醒訊號</p>  
        <p type="p">134:電池電量資訊</p>  
        <p type="p">140:點火開關</p>  
        <p type="p">142:點火開關訊號</p>  
        <p type="p">150:車載網關</p>  
        <p type="p">160:顯示器</p>  
        <p type="p">162:錄影機</p>  
        <p type="p">164:音訊設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="87" publication-number="202614708"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614708.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614708</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135326</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241028B">H05K7/20</main-classification>  
        <further-classification edition="200601120241028B">B60R11/02</further-classification>  
        <further-classification edition="200601120241028B">F04D25/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉尚衡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SHANG-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於一種電子裝置，包括殼體以及散熱模組。殼體包含上蓋以及下蓋。上蓋具有上蓋內表面。下蓋具有下蓋內表面及位於下蓋內表面的發熱元件。散熱模組包含風扇以及散熱件。風扇位於上蓋內表面的一側。散熱件位於上蓋內面上，具有發熱元件接觸面、第一側面以及貫穿第一側面的至少一個通孔。發熱元件接觸面配置以接觸發熱元件。該至少一個通孔距離第一側面的邊緣至少2毫米。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure relates to an electronic device, which includes a housing and a heat dissipation module. The housing has a top cover and a bottom cover. The top cover has a top cover inner surface. The bottom cover has a bottom cover inner surface and a heating element located at the bottom cover inner surface. The heat dissipation module has a fan and a heat dissipation component. The fan is located at a side of the top cover inner surface. The heat dissipation component is located at the top cover inner surface and has a heating element contact surface, a first side surface, and at least one via hole running through the first surface. The heat dissipation component is configured to contact the heating element. A distance between of the at least one via hole and an edge of the first side surface is at least 2 mm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">100:殼體</p>  
        <p type="p">110:上蓋</p>  
        <p type="p">120:下蓋</p>  
        <p type="p">121:下蓋內表面</p>  
        <p type="p">123:發熱元件</p>  
        <p type="p">200:散熱模組</p>  
        <p type="p">210:風扇</p>  
        <p type="p">220:散熱件</p>  
        <p type="p">x:第一軸向</p>  
        <p type="p">y:第二軸向</p>  
        <p type="p">z:第三軸向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="88" publication-number="202612780"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612780.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612780</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135327</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可清潔過濾膜片的過濾裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B01D65/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晉湧有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昌潭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種可清潔過濾膜片的過濾裝置，包含桶體、心軸、淨水輸出管、複數個過濾膜片及複數個清潔組件，心軸能轉動地設於桶體內，淨水輸出管設於桶體內且伸出於桶體外，複數個過濾膜片相間隔地固定於桶體的內部，且設有環繞淨水輸出管的引水開口，複數個清潔組件連結於該心軸上，各清潔組件設有延伸臂，延伸臂位於相鄰的兩過濾膜片之間，在過濾膜片過濾廢水的同時，能以心軸驅動清潔組件轉動，以延伸臂將過濾膜片表面的污濁物刮除，相較以加壓流體衝擊過濾膜片的方式，清潔效果更佳，且較不會損壞過濾膜片，可延長過濾膜片使用壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:心軸</p>  
        <p type="p">21:限位環</p>  
        <p type="p">30:淨水輸出管</p>  
        <p type="p">400:定位板</p>  
        <p type="p">41:過濾膜片</p>  
        <p type="p">42:清潔組件</p>  
        <p type="p">43:間隔環</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="89" publication-number="202614007"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614007.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614007</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135328</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及其驅動方法</chinese-title>  
        <english-title>DISPLAY DEVICE AND DRIVING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241001B">G09G3/20</main-classification>  
        <further-classification edition="200601120241001B">G09G3/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何雨璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, YU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林弘哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUNG-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃孟秋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, MENG-CHIOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包含陣列基板、對向基板及液晶層。陣列基板包含多條掃描線、多條資料線及多個畫素電極，掃描線與資料線互相交錯，畫素電極電性連接資料線。對向基板設置於陣列基板上並包含共同電極。液晶層設置於陣列基板與對向基板之間。於一顯示期間，顯示裝置具有更新畫面區域及維持畫面區域，位於更新畫面區域的各掃描線接收掃描訊號，且掃描訊號為遞減電壓，位於維持畫面區域的各畫素電極與共同電極的電壓差小於液晶驅動電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes an array substrate, a counter substrate and a liquid crystal layer. The array substrate includes multiple scan lines, multiple data lines, and multiple pixel electrodes. The scan lines and the data lines are interlaced with each other, and the pixel electrodes are electrically connected to the data lines. The counter substrate is disposed on the array substrate and includes a common electrode. The liquid crystal layer is disposed between the array substrate and the counter substrate. During a display period, the display device has an update area and a holding area. Each of the scan lines located in the update area receives a scan signal, and the scan signal is a decreasing voltage. The voltage difference between each of the pixel electrodes located in the holding area and the common electrode is less than the liquid crystal driving voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示裝置</p>  
        <p type="p">100:陣列基板</p>  
        <p type="p">102:第一基材</p>  
        <p type="p">104:掃描線</p>  
        <p type="p">106:資料線</p>  
        <p type="p">108:畫素電極</p>  
        <p type="p">110、110’:掃描驅動單元</p>  
        <p type="p">120:資料驅動單元</p>  
        <p type="p">HA:維持畫面區域</p>  
        <p type="p">UA:更新畫面區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="90" publication-number="202614698"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614698.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614698</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135329</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>模組基座及機箱組件</chinese-title>  
        <english-title>MODULE BASE AND CHASSIS ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240927B">H05K5/02</main-classification>  
        <further-classification edition="200601120240927B">H05K7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝念臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, NIEN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於一種機箱組件及設置於其內的模組基座。模組基座包括座體、第一側壁、第二側壁、第一止擋件以及第二止擋件。座體包含底面。第一側壁連接底面，並沿著第一軸向遠離底面延伸。第一側壁包含卡合槽，卡合槽由第一側壁遠離底面的邊緣凹陷形成。第二側壁連接底面，並沿著第一軸向遠離底面延伸。第一側壁與第二側壁分別位於底面的相反二側，且第二側壁包含凹槽。凹槽由第二側壁遠離底面的邊緣朝向底面凹陷形成。第一止擋件設置於底面上，並位於第一側壁與第二側壁之間。第二止擋件設置於底面上，位於第二側壁遠離凹槽的一端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure relates to a chassis assembly and a module base disposed therein. The module base includes a base body, a first side wall, a second side wall, a first stopping component, and a second stopping component. The base body includes a bottom surface. The first side wall is connected to the bottom surface and extended away from the bottom surface along a first axis. The first side wall includes an engagement slot. The engagement slot is concavely formed from an edge of the first side wall away from the bottom surface. The second side wall is connected to the bottom surface and extended away from the bottom surface along the first axis. The first side wall and the second side wall are respectively located at opposed sides of the bottom surface. The second side wall includes a concave slot. The concave slot is concavely formed from an edge of the second side wall away from the bottom surface toward to the bottom surface. The first stopping component is disposed on the bottom surface and located between the first side wall and the second side wall. The second stopping component is disposed on the bottom surface and located at an end of the second side wall away from the concave slot.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:模組基座</p>  
        <p type="p">110:座體</p>  
        <p type="p">111:底面</p>  
        <p type="p">120:第一側壁</p>  
        <p type="p">121:邊緣</p>  
        <p type="p">123:卡合槽</p>  
        <p type="p">125:連接部</p>  
        <p type="p">1251:缺口</p>  
        <p type="p">130:第二側壁</p>  
        <p type="p">131:邊緣</p>  
        <p type="p">133:凹槽</p>  
        <p type="p">140:第一止擋件</p>  
        <p type="p">150:第二止擋件</p>  
        <p type="p">1501:限位部</p>  
        <p type="p">1503:表面</p>  
        <p type="p">160:組裝口</p>  
        <p type="p">A1:第一軸向</p>  
        <p type="p">A2:第二軸向</p>  
        <p type="p">A3:第三軸向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="91" publication-number="202613480"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613480.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613480</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135331</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>纖維編織網複合毛細結構</chinese-title>  
        <english-title>FIBER BRAIDED MESH COMPOUND CAPILLARY STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">F28D15/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼得科超眾科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIDEC CHAUN-CHOUNG TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李全祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHUAN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金嘉玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIN, CHIA LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王政諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JHENG YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種纖維編織網複合毛細結構，包括一網狀層、以及一編織套，編織套 由相互編織的至少二纖維線交織而成，且二纖維線係依循網狀層外圍進行編織，以於編織套內形成一空隙並供網狀層位於空隙內，使編織套與網狀層相結合者。俾透過可作為毛細組織的該網狀層（如金屬網），以供二纖維線可依循網狀層進行編織，從而使網狀層、以及編織於其上的纖維套構成所述複合毛細結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fiber braided mesh compound capillary structure having a mesh layer and a braided sleeve is provided. The braided sleeve is made of at least two fiber threads braided to each other. The fiber threads are braided along a periphery of the mesh layer to form a gap in the braided sleeve for the mesh layer being arranged and combined. Through the mesh layer (such as metal mesh) may be available as a capillary structure such that the fiber threads are braided along the mesh layer to make the mesh layer and the braided sleeve together form the fiber braided mesh compound capillary structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:複合毛細結構</p>  
        <p type="p">10:網狀層</p>  
        <p type="p">11:編織套</p>  
        <p type="p">110:纖維線</p>  
        <p type="p">111:編織孔目</p>  
        <p type="p">112:空隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="92" publication-number="202614709"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614709.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614709</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135332</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液冷式散熱裝置</chinese-title>  
        <english-title>LIQUID-COOLING HEAT DISSIPATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H05K7/20</main-classification>  
        <further-classification edition="200601120241105B">F28D1/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>冠鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUAN DING INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘冠達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, KUAN DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭明正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, MING CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請係關於一種液冷式散熱裝置，包括基座、吸熱結構及液體驅動機構，基座具有容置空間、熱交換腔室及第一管體；吸熱結構連接基座並位於熱交換腔室且具有抵貼平面；液體驅動機構連接基座並位於容置空間且包括殼體及水泵，殼體包括容腔、第二管體及第三管體，第三管體耦接基座且連通熱交換腔室，水泵設在容腔且包括葉輪、轉子及軸桿，轉子具有中間軸套，中間軸套和葉輪一體構成並設有供冷卻液進出輸送的開孔，軸桿穿接中間軸套且具有平行於抵貼平面設置的軸心線。藉此，不僅能夠延長整體裝置的使用壽命，還能降低軸桿在運轉過程中的溫升。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A liquid-cooling heat dissipation device includes a base, an endothermic structure and a liquid drive mechanism. The base includes a storage space, a heat exchange chamber and a first tube. The endothermic structure is connected to the base and in the heat exchange chamber with an offset plane. The liquid drive mechanism is connected to the base and in the storage space. The liquid drive mechanism includes a housing and a water pump. The housing includes a cavity, a second tube body and a third tube body. The third tube body is connected to the base and the heat exchange chamber. The water pump is in the cavity and includes an impeller, a rotor and a shaft. The rotor having an intermediate bushing. The intermediate bushing and the impeller are integrated and having an opening for coolant to enter and exit. The shaft passes through the intermediate bushing and having an axis line parallel to the offset plane setting.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:液冷式散熱裝置</p>  
        <p type="p">10A:基座</p>  
        <p type="p">11:容置空間</p>  
        <p type="p">13:第一管體</p>  
        <p type="p">14:輸水管</p>  
        <p type="p">15:環形槽</p>  
        <p type="p">16:螺柱</p>  
        <p type="p">30:液體驅動機構</p>  
        <p type="p">31:殼體</p>  
        <p type="p">312:第二管體</p>  
        <p type="p">313:第三管體</p>  
        <p type="p">314:凸耳</p>  
        <p type="p">315:穿孔</p>  
        <p type="p">317:軸桿支架</p>  
        <p type="p">32:水泵</p>  
        <p type="p">323:定子</p>  
        <p type="p">33:螺固元件</p>  
        <p type="p">40:密封元件</p>  
        <p type="p">41:底墊</p>  
        <p type="p">42:內環圈</p>  
        <p type="p">421:內側止水環</p>  
        <p type="p">43:外環圈</p>  
        <p type="p">431:外側止水環</p>  
        <p type="p">60:第一接頭</p>  
        <p type="p">70:第二接頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="93" publication-number="202612675"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612675.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612675</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135337</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>粉狀藥劑集藥分包機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">A61J3/00</main-classification>  
        <further-classification edition="200601120241105B">B65B37/00</further-classification>  
        <further-classification edition="200601120241105B">B65B1/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳志榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳志榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳恕琮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種粉狀藥劑集藥分包機，具有藥架、取藥機構、混藥筒、攪拌機構及包藥機等主要部份；該藥架上設有多個依特定規則排列的藥罐，該取藥機構能驅動一承接容器分別朝向該藥架方向及各該藥罐排列位置往復活動，藉以分別位移至對應所選擇之不同藥罐的位置，集取所需的粉狀藥劑，再將分別取得的多種粉狀藥劑倒入該混藥筒中，並對各該集取的粉狀藥劑進行攪拌後，再將該混藥筒中之粉狀藥劑導入該包藥機中，以供進行分袋包裝作業。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:藥架</p>  
        <p type="p">11:循環活動機構</p>  
        <p type="p">111:循環輸送件</p>  
        <p type="p">112:輸送動力源</p>  
        <p type="p">113:橫向支撐件</p>  
        <p type="p">11a:正向上升側</p>  
        <p type="p">11b:反向下降側</p>  
        <p type="p">12:藥罐</p>  
        <p type="p">122:封蓋</p>  
        <p type="p">123:被抵頂部</p>  
        <p type="p">124:彈性元件</p>  
        <p type="p">2:取藥機構</p>  
        <p type="p">2a:取藥驅動機構</p>  
        <p type="p">21:主滑座</p>  
        <p type="p">211:主驅動組件</p>  
        <p type="p">22:副滑座</p>  
        <p type="p">221:副驅動組件</p>  
        <p type="p">23:承接容器</p>  
        <p type="p">24:連動組件</p>  
        <p type="p">3:混藥筒</p>  
        <p type="p">31:容置空間</p>  
        <p type="p">311:開口</p>  
        <p type="p">32:邊緣</p>  
        <p type="p">33:底座</p>  
        <p type="p">4:移置機構</p>  
        <p type="p">41:移置動力源</p>  
        <p type="p">42:擺臂</p>  
        <p type="p">5:攪拌機構</p>  
        <p type="p">51:攪拌座</p>  
        <p type="p">52:攪拌元件</p>  
        <p type="p">53:連結組件</p>  
        <p type="p">54:罩帽</p>  
        <p type="p">55:攪拌動力源</p>  
        <p type="p">6:包藥機</p>  
        <p type="p">61:入藥開口</p>  
        <p type="p">62:包藥裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="94" publication-number="202612816"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612816.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612816</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135340</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搪孔車刀結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B23B27/06</main-classification>  
        <further-classification edition="200601120241204B">B23B29/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張新添</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSIN-TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張新添</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSIN-TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明搪孔車刀結構，包含一刀把、一刀桿以及一刀頭，所述之刀桿係以相同之圓弧交集形成刀桿之外側緣面及內側緣面，並形成上、下具有圓弧尖端之形狀，所述之上、下圓弧尖端位置設有一上連接鍵以及一下連接鍵，所述刀桿之刀桿端面朝內設一錐孔，所述之刀頭，以相同之圓弧交集形成上、下具有圓弧尖端形狀之本體並形成一外側面及一內側面，所述之內側面延伸設一刀刃，所述之刀頭於刀頭端面朝前延伸一尺寸漸縮之錐體，所述刀頭端面之上、下圓弧尖端位置各設有一上鍵槽以及一下鍵槽，所述之刀頭搭配一螺絲將所述之刀頭鎖固於刀桿之刀桿端面。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">1:搪孔車刀結構</p>  
        <p type="p">11:刀把</p>  
        <p type="p">111:中心垂線</p>  
        <p type="p">112:外側面</p>  
        <p type="p">12:刀桿</p>  
        <p type="p">120:刀桿端面</p>  
        <p type="p">121:中心軸線</p>  
        <p type="p">122:外側緣面</p>  
        <p type="p">123:內側緣面</p>  
        <p type="p">124:錐孔</p>  
        <p type="p">125:上連接鍵</p>  
        <p type="p">126:下連接鍵</p>  
        <p type="p">127:內螺孔</p>  
        <p type="p">3:刀頭</p>  
        <p type="p">30:本體</p>  
        <p type="p">31:外側面</p>  
        <p type="p">32:內側面</p>  
        <p type="p">33:刀刃</p>  
        <p type="p">34:刀頭端面</p>  
        <p type="p">35:錐體</p>  
        <p type="p">361:上鍵槽</p>  
        <p type="p">362:下鍵槽</p>  
        <p type="p">37:沉頭孔</p>  
        <p type="p">38:螺絲</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="95" publication-number="202613316"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613316.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613316</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135341</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於生產N-乙醯神經胺酸的方法</chinese-title>  
        <english-title>METHOD FOR PRODUCING N-ACETYLNEURAMINIC ACID</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241001B">C12P19/26</main-classification>  
        <further-classification edition="200601120241001B">C12N9/90</further-classification>  
        <further-classification edition="200601120241001B">C12N9/88</further-classification>  
        <further-classification edition="200601120241001B">C12N15/63</further-classification>  
        <further-classification edition="200601120241001B">C12N15/866</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣中油股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CPC CORPORATION, TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李筱萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HSIAO-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳岳隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YUEH-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李信毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HSIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勁中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳錦坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIN-KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於生產N-乙醯神經胺酸的方法，其包含下列步驟：使用帶有編碼N-乙醯葡萄糖胺2-表異構酶與N-乙醯神經胺酸醛縮酶的外源基因之桿狀病毒來感染真核細胞，而使得N-乙醯葡萄糖胺2-表異構酶與N-乙醯神經胺酸醛縮酶能夠被表現；以及將所得到之經桿狀病毒感染的真核細胞在N-乙醯葡萄糖胺與丙酮酸的存在下進行培養。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a method for producing N-acetylneuraminic acid, comprising the following steps: infecting eukaryotic cells with baculoviruses carrying foreign genes encoding N-acylglucosamine 2-epimerase and N-acetylneuraminic acid aldolase, so that N-acylglucosamine 2-epimerase and N-acetylneuraminic acid aldolase can be expressed; and incubating the obtained baculovirus-infected eukaryotic cells under the presence of N-acetylglucosamine and pyruvate.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="96" publication-number="202613303"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613303.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613303</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135348</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製備表達FNDC5基因的外泌體的方法、鳶尾素外泌體、及其用途</chinese-title>  
        <english-title>METHOD FOR PREPARING EXOSOME EXPRESSING FNDC5 GENE, IRISIN-EXOSOME, AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250421B">C12N5/077</main-classification>  
        <further-classification edition="200601120250421B">C12M3/00</further-classification>  
        <further-classification edition="200601120250421B">A61K38/22</further-classification>  
        <further-classification edition="200601120250421B">A61P19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長庚醫療財團法人高雄長庚紀念醫院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAOHSIUNG CHANG GUNG MEMORIAL HOSPITAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王逢興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, FENG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂承烋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHENG-HSIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連韋雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAN, WEI-SHIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫瑞文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, RE-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳于珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例提供一種製備表達FNDC5基因的外泌體的方法，包括以下步驟。提供過度表達FNDC5基因的細胞。將細胞培養於包含培養液的培養基中，培養細胞直到達到細胞匯合度時，分離細胞後獲得細胞懸浮液。對細胞懸浮液執行離心操作並取得上清液。過濾上清液並獲得複數個鳶尾素外泌體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of this disclosure provide a method for preparing exosome expressing FNDC5 gene, including the following steps. Cell overexpressed the FNDC5 gene are provided. The cells are cultured in a plate containing a medium. Until the cells are reached a cell confluence, the cells are separated from the plate to obtain a cell suspension. The cell suspension is centrifuged to obtain a supernatant. The supernatant is filtered to obtain a plurality of irisin-exosomes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101,S103,S105,S107,S109:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="97" publication-number="202614710"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614710.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614710</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135349</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子或電腦產品水冷散熱裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">H05K7/20</main-classification>  
        <further-classification edition="200601120241129B">F28D15/02</further-classification>  
        <further-classification edition="200601120241129B">F28F3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鑫創電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許育瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳友炘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子/電腦產品水冷散熱裝置，包括︰一上蓋，包含一冷媒冷板及二散熱支架，該冷媒冷板設有至少二組容置冷媒之一流道及與該流道相通之多個發熱元件，該冷媒冷板兩端設有呈相對且與該流道相通之一出口及一入口；多個導管，設於該出口及該入口且於上端具有一支撐架；一冷凝器，設於該支撐架且於兩側具有一側架，該冷凝器包含至少二冷卻流道、多個導熱板及多個散熱擴增片；該冷媒冷板包含相互疊合之一第一層底板、一第二層複合板、一第三層金屬板及一第四層頂板；透過該發熱元件熱源使該冷媒氣化及該冷凝器冷卻呈液態並利用虹吸原理及壓力差產生循環。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:上蓋</p>  
        <p type="p">11:冷媒冷板</p>  
        <p type="p">110:發熱元件</p>  
        <p type="p">111:第一層底板</p>  
        <p type="p">112:第二層複合板</p>  
        <p type="p">1120:流道</p>  
        <p type="p">113:第三層金屬板</p>  
        <p type="p">114:第四層頂板</p>  
        <p type="p">1141:出口</p>  
        <p type="p">1142:入口</p>  
        <p type="p">12:散熱支架</p>  
        <p type="p">2:導管</p>  
        <p type="p">21:支撐架</p>  
        <p type="p">3:冷凝器</p>  
        <p type="p">31:冷卻流道</p>  
        <p type="p">32:導熱板</p>  
        <p type="p">33:散熱擴增片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="98" publication-number="202612754"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612754.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612754</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135350</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種可撓細長導線之阻力指標的量測系統、量測方法及其操作應用</chinese-title>  
        <english-title>A FLEXIBLE SLENDER WIRE RESISTANCE INDEX MEASUREMENT SYSTEM, MEASUREMENT METHOD, AND ITS OPERATION APPLICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241014B">A61M25/06</main-classification>  
        <further-classification edition="202201120241014B">G06V30/146</further-classification>  
        <further-classification edition="200601120241014B">G06T9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晤智股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUSA SMART INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷晉源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAY, JINN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷晉源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAY, JINN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林建佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可撓細長導線之阻力指標的測量系統、量測方法及其操作應用。該測量系統包括一圖案、一影像擷取模組和一提示模組；其中該圖案設置於該可撓細長導線的近端表面；該影像擷取模組設有一供可撓細長導線無任何阻礙穿過的通道；該影像擷取模組於該通道內擷取該圖案的影像。當操作人員將該可撓細長導線向循環系統內推進及旋轉時，該圖案因該可撓細長導線受到循環系統內的環境阻力而產生形變；該影像擷取模組根據該圖案的形變量計算該可撓細長導線的受力情形，並產生阻力指標；由該提示模組將該阻力指標提示給操作人員，使操作人員操作該可撓細長導線的手感數位化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a flexible slender wire resistance index measurement system, measurement method and its operation application. The measurement system includes a pattern, an image capture module and a prompt module; wherein the pattern is disposed on the proximal surface of the flexible slender wire; the image capture module offers a non-resistance passage to the flexible slender wire for passing through; the image capture module captures the image of the pattern in the passage. When the operator moves and rotates the flexible slender wire into the circulatory system, the pattern will be deformed due to the environmental resistance in the circulatory system; the image capture module calculates the stress state of the flexible slender wire by the deformation of the pattern, and generates the resistance index; the prompt module provides the resistance index to the operator, so that the operator's sense of operating the flexible slender wire can be digitized.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:可撓細長導線</p>  
        <p type="p">11:遠端</p>  
        <p type="p">12:近端</p>  
        <p type="p">20:影像擷取模組</p>  
        <p type="p">26:機構通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="99" publication-number="202612881"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612881.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612881</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135351</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>混凝土剩餘料的回收方法</chinese-title>  
        <english-title>METHOD OF RECYCLING CONCRETE REMNANT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B28C7/04</main-classification>  
        <further-classification edition="200601120241105B">B28C7/02</further-classification>  
        <further-classification edition="202201120241105B">B09B3/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORMOSA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊玉筵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, YU-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳忠毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHONG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種混凝土剩餘料的回收方法。在此方法中，先混合吸水性樹脂與混凝土剩餘料，以形成預混合物，其中混凝土剩餘料的含水率為8.33%至25%，且吸水性樹脂與混凝土剩餘料中的水的重量比例為1：1至1：20。接著，對預混合物進行攪拌操作，以獲得混凝土回收料。藉此，可提升混凝土回收料的流動性，而易於回收。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of recycling a concrete remnant is provided. In the method, a superabsorbent polymer and the concrete remnant are firstly mixed to form a premix. The concrete remnant has a water content of 8.33% to 25%. A weight ratio of the superabsorbent polymer and the concrete remnant is 1:1 to 1:20. Next, the premix is subjected to a stirring operation, thereby obtaining a reclaimed concrete material. Therefore, the reclaimed concrete material can have an increased mobility and be easily recycled.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="100" publication-number="202613870"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613870.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613870</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135353</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路檢測方法以及電路檢測裝置</chinese-title>  
        <english-title>CIRCUIT DETECTION METHOD AND CIRCUIT DETECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241223B">G06F30/33</main-classification>  
        <further-classification edition="202001120241223B">G06F30/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉龍錦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, LUNG-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李孟蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MENG-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅幼嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, YU-LAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">電路檢測方法包含：取得電路網表的複數個電晶體中連接於至少一高準位接腳或至少一低準位接腳的至少一主要電晶體；取得複數個電晶體中連接於至少一主要電晶體的至少一次要電晶體；判斷至少一次要電晶體之次要寬長比是否大於至少一主要電晶體的主要寬長比；以及若至少一次要電晶體之次要寬長比大於至少一主要電晶體的主要寬長比，回報至少一次要電晶體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit detection method includes: obtaining at least one main transistor connected to at least one high level pin or at least one low level pin among a plurality of transistors of a circuit netlist; obtaining at least one secondary transistor connected to the at least one main transistor among the plurality of transistors; determining whether a secondary width-to-length ratio of the at least one secondary transistor is larger than a main width-to-length ratio of the at least one main transistor; and if the secondary width-to-length ratio of the at least one secondary transistor is larger than the main width-to-length ratio of the at least one main transistor, reporting the at least one secondary transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:方法</p>  
        <p type="p">210~240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="101" publication-number="202612930"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612930.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612930</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135354</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源監控與自動充電管理系統及其實施方法</chinese-title>  
        <english-title>POWER MONITORING AND AUTOMATIC CHARGING MANAGEMENT SYSTEM AND ITS IMPLEMENTATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241224B">B60L58/10</main-classification>  
        <further-classification edition="201901120241224B">B60L58/18</further-classification>  
        <further-classification edition="201601120241224B">H02J7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和緯車輛技術股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO-WEI CAR TECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂川毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHUAN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝宗秉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, TSUNG-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佑俞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電源監控與自動充電管理系統及其實施方法，該系統包括：整車控制器、自動電壓檢測系統、電瓶系統、電源分配系統和高壓電力供應轉換系統。自動電壓檢測系統預存有預設電壓閾值，與整車控制器資訊連接，用於接收操作指令並提供喚醒指令。電瓶系統與自動電壓檢測系統電性連接，其電壓可被偵測。電源分配系統與整車控制器資訊連接，用於分配電力資源。高壓電力供應轉換系統與電源分配系統及電瓶系統電性連接，提供高壓電力並轉換為適合電瓶系統的電壓。當電壓低於預設閾值時，整車控制器控制電源分配系統驅動高壓電力供應轉換系統作動，實現電瓶系統的自動充電管理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power monitoring and automatic charging management system and its implementation method. The system comprises: a vehicle control unit, an automatic voltage detection system, a battery system, a power distribution system, and a high-voltage power supply conversion system. The automatic voltage detection system pre-stores preset voltage thresholds and is informationally connected to the vehicle control unit, used for receiving operation commands and providing wake-up instructions. The battery system is electrically connected to the automatic voltage detection system, and its voltage can be detected. The power distribution system is informationally connected to the vehicle control unit for distributing power resources. The high-voltage power supply conversion system is electrically connected to both the power distribution system and the battery system, providing high-voltage power and converting it to a voltage suitable for the battery system. When the voltage falls below the preset threshold, the vehicle control unit controls the power distribution system to activate the high-voltage power supply conversion system, achieving automatic charging management of the battery system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電源監控與自動充電管理系統</p>  
        <p type="p">101:整車控制器</p>  
        <p type="p">102:自動電壓檢測系統</p>  
        <p type="p">1021:預設電壓閾值</p>  
        <p type="p">103:電瓶系統</p>  
        <p type="p">104:電源分配系統</p>  
        <p type="p">105:高壓電力供應轉換系統</p>  
        <p type="p">M1:操作指令</p>  
        <p type="p">M2:喚醒指令</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="102" publication-number="202614011"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614011.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614011</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135359</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於電子裝置的驅動器的驅動方法及驅動器</chinese-title>  
        <english-title>DRIVING METHOD FOR DRIVER OF ELECTRONIC DEVICE AND DRIVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G09G3/30</main-classification>  
        <further-classification edition="200601120241202B">G09G5/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃永曆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YUNG-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏琬真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, WAN-JHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱湛峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHAN-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於電子裝置的驅動器的驅動方法，包括步驟：接收複數個畫面資料，每個畫面資料包含複數個子像素數據資料，且子像素數據資料包含複數個列子像素數據資料，每個列子像素數據資料對應複數條掃描線的其中一者所對應的部分的複數個子像素；偵測其中一畫面資料為重載畫面資料或非重載畫面資料；其中，當連續P個畫面資料為重載畫面資料，且P大於或等於一閾值時，將驅動器由第一驅動狀態切換為第二驅動狀態，或維持在第二驅動狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A driving method of a driver for an electronic device is provided. The driving method includes steps of: receiving a plurality of frame data including a plurality of sub pixel data, and each sub pixel data includes a plurality of row sub pixel data, wherein each row sub pixel data corresponds to a part of a plurality of sub pixels corresponding to one of the plurality of scan lines; detecting whether one of the plurality of frame data is a critical frame data or a non-critical frame data ; wherein when P consecutive frame data are critical frame data, and P is greater than or equal to a threshold, switching the driver from a first driving status to a second driving status, or maintaining the second driving status.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A1~A5:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="103" publication-number="202613841"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613841.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613841</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135362</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檔案自動分類系統</chinese-title>  
        <english-title>FILE AUTOMATIC CLASSIFICATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">G06F16/35</main-classification>  
        <further-classification edition="201901120250102B">G06F16/906</further-classification>  
        <further-classification edition="202001120250102B">G06F40/10</further-classification>  
        <further-classification edition="201901120250102B">G06N20/20</further-classification>  
        <further-classification edition="202301120250102B">G06Q10/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣土地銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAND BANK OF TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳凱靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KAI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">檔案自動分類系統包含擷取模組、關鍵詞庫及分類模組。擷取模組與承辦裝置通訊連接，以接收文件並擷取其中的關鍵詞，統計其出現次數，生成綜合排序。關鍵詞庫儲存檔案類別與分類關鍵詞之綜合排序對應的分類對照表。分類模組與擷取模組、關鍵詞庫及檔案資料庫通訊，接收文件的關鍵詞綜合排序及分類對照表，利用機器學習模型判斷文件的判定類別，並將文件依判定類別儲存至檔案資料庫中的相應檔案中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A provided file automatic classification system includes an extraction module, a keyword database, and a classification module. The extraction module communicates with a processing device to receive a document, extracts keywords, and calculates their frequency to generate a comprehensive ranking. The keyword database stores a classification table that maps file categories to the comprehensive ranking of the keywords. The classification module, connected to the extraction module, keyword database, and file database to receive the comprehensive rankings of keywords and the classification table, uses a machine learning model to determine the document’s category and then stores the document in a file in the determined category of the file database.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:檔案自動分類系統</p>  
        <p type="p">112:擷取模組</p>  
        <p type="p">114:關鍵詞庫</p>  
        <p type="p">116:分類模組</p>  
        <p type="p">118:檢核模組</p>  
        <p type="p">120:檔案資料庫</p>  
        <p type="p">130:承辦裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="104" publication-number="202614385"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614385.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614385</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135363</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合式板材封裝結構</chinese-title>  
        <english-title>COMPOSITE BOARD PACKAGE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240925B">H01L23/29</main-classification>  
        <further-classification edition="200601120240925B">H01L23/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>同欣電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG HSING ELECTRONIC INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉得丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, DEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴致瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, JHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施建宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, JIAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種複合式板材封裝結構，其包含一第一陶瓷板、埋置於所述第一陶瓷板的多個導通柱、形成於所述第一陶瓷板外板面的多個接合墊、形成於所述第一陶瓷板內板面的多個佈局線路、形成於所述內板面的一感光型光阻牆、接合於所述感光型光阻牆的一感光型光阻層、及接合於所述感光型光阻層的一第二陶瓷板。每個所述導通柱的兩端分別連接於一個所述接合墊與一個所述佈局線路，所述感光型光阻牆圍繞於多個所述佈局線路的外側。所述感光型光阻層、所述感光型光阻牆、及所述第一陶瓷板共同形成一封閉空間，其容納多個所述佈局線路於其內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a composite board package structure, which includes a first ceramic board, a plurality of conductive pillars embedded in the first ceramic board, a plurality of bonding pads formed on an outer surface of the first ceramic board, a plurality of layout circuits formed on an inner surface of the first ceramic board, a photosensitive photoresist (PR) wall formed on the inner surface, a photosensitive PR layer connected to the photosensitive PR wall, and a second ceramic board that is connected to the photosensitive PR layer. Two ends of each of the conductive pillars are respectively connected to one of the bonding pads and one of the layout circuits, and the photosensitive PR wall surrounds the layout circuits. The photosensitive PR layer, the photosensitive PR layer, and the first ceramic board jointly define an enclosed space that receives the layout circuits therein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:複合式板材封裝結構</p>  
        <p type="p">1:直接鍍銅基板</p>  
        <p type="p">11:第一陶瓷板</p>  
        <p type="p">111:內板面</p>  
        <p type="p">1111:佈局區塊</p>  
        <p type="p">112:外板面</p>  
        <p type="p">12:導通柱</p>  
        <p type="p">121:內端點</p>  
        <p type="p">122:外端點</p>  
        <p type="p">13:接合墊</p>  
        <p type="p">14:金屬擋牆</p>  
        <p type="p">2:佈局線路</p>  
        <p type="p">3:陶瓷蓋板</p>  
        <p type="p">31:第二陶瓷板</p>  
        <p type="p">32:感光型光阻環</p>  
        <p type="p">321:內環段</p>  
        <p type="p">322:外環段</p>  
        <p type="p">323:接合段</p>  
        <p type="p">4:金錫共晶焊料</p>  
        <p type="p">E:封閉空間</p>  
        <p type="p">H32:高度</p>  
        <p type="p">W32:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="105" publication-number="202613865"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613865.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613865</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135365</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>幾何圖形之閉迴圈路徑偵測方法及電子裝置</chinese-title>  
        <english-title>CLOSED-LOOP PATH DETECTION METHOD FOR GEOMETRIC PATTERN AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241007B">G06F30/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林胤廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YIN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃振洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHEN-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種幾何圖形之閉迴圈路徑偵測方法，包括於電腦輔助設計影像檔案中偵測出第一元件及第二元件；於第一元件及第二元件上定義出目標點及目標點之位置；於第一運作期間將第一元件由初始位置朝向第一方向移動；基於第一運作期間偵測到第一元件碰觸第二元件，判斷出第一最小間隙位置；於第二運作期間，將第一元件由初始位置朝向第二方向移動；基於第二運作期間偵測到第一元件碰觸第二元件，判斷出第二最小間隙位置；根據第一元件及第二元件上之目標點之位置、第一最小間隙位置及第二最小間隙位置判斷出該一元件及第二元件之尺寸路徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A closed-loop path detection method for geometric pattern is provided, which includes detecting a first component and a second component in a computer-aided design image file, defining target points and positions of the target points on the first component and the second component, moving the first component from an initial position toward a first direction during a first operation period, based on determining that the first component touches the second component during the first operation, determining a first minimum gap position, moving the first component from the initial position toward a second direction during a second operation period, based on determining that the first component touches the second component during the second operation, determining a second minimum gap position, and determining dimension paths of the first component and the second component according to the positions of the target points of the first component and the second component, the first minimum gap position and the second minimum gap position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:流程</p>  
        <p type="p">S100,S102,S104,S106,S108,S110,S112,S114,S116:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="106" publication-number="202612834"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612834.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612834</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135366</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高效表面結構重組的方法及雷射加工設備</chinese-title>  
        <english-title>EFFICIENT SURFACE STRUCTURE REORGANIZATION METHOD AND LASER PROCESSING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120241202B">B23K26/352</main-classification>  
        <further-classification edition="201401120241202B">B23K26/082</further-classification>  
        <further-classification edition="201401120241202B">B23K26/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聚嶸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游智偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種表面結構重組的處理方法，其包括：提供物件及執行結構重組步驟，以千兆赫茲雷射掃描物件的表面的至少一部分，使表面的至少一部分進行結構重組。本發明還提供一種雷射加工設備，可對所述物件進行結構重組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A surface structural reorganization processing method includes providing an object. The structural reorganization step is performed to scan at least a portion of the surface of the object with a giga-hertz laser, so that at least a portion of the surface undergoes structural reorganization. A laser processing equipment is also provided. The laser processing equipment could perform structural reorganization of the object.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">S1-S2:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="107" publication-number="202612814"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612814.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612814</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135369</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射燒結的方法及雷射加工設備</chinese-title>  
        <english-title>LASER SINTERING METHOD AND LASER PROCESSING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120240926B">B22F10/36</main-classification>  
        <further-classification edition="202101120240926B">B22F12/41</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聚嶸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游智偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種雷射燒結的方法，其包括：提供燒結物。執行燒結步驟，以千兆赫茲(GHz)雷射掃描燒結物使燒結物固化成形。本發明還提供一種雷射加工設備。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laser sintering method includes: providing a be-sintered material. Perform the sintering step, scanning the be-sintered material with a giga-hertz (GHz) laser to solidify the sintered material into shape. A laser processing equipment is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">S1-S2:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="108" publication-number="202614821"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614821.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614821</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135381</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高壓半導體結構以及其製作方法</chinese-title>  
        <english-title>HIGH-VOLTAGE SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/67</main-classification>  
        <further-classification edition="202501120250102B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊柏宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, PO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種高壓半導體結構，包含一基底，一鰭狀結構位於該基底上，一閘極結構位於該基底上並且跨越該鰭狀結構，以及一第一絕緣結構以及一第二絕緣結構跨越於該鰭狀結構上且位於部分該鰭狀結構內，該閘極結構位於該第一絕緣結構以及該第二絕緣結構之間，其中該第一絕緣結構的一頂面、該第二絕緣結構的一頂面以及該閘極結構的一頂面相互齊平。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a high-voltage semiconductor structure, which comprises a substrate, a fin structure located on the substrate, a gate structure located on the substrate and spanning the fin structure, and a first insulation structure and a second insulation structure spanning the fin structure and located in part of the fin structure, wherein the gate structure is located between the first insulation structure and the second insulation structure, and a top surface of the first insulating structure, a top surface of the second insulating structure and a top surface of the gate structure are aligned with each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">13:介電層</p>  
        <p type="p">14A:第一絕緣結構(單擴散阻斷)</p>  
        <p type="p">14B:第二絕緣結構(絕緣層)</p>  
        <p type="p">16:介電層</p>  
        <p type="p">17:飄移區</p>  
        <p type="p">20:介電層</p>  
        <p type="p">A1:區域</p>  
        <p type="p">A2:區域</p>  
        <p type="p">A3:區域</p>  
        <p type="p">CT1:接觸結構</p>  
        <p type="p">CT2:接觸結構</p>  
        <p type="p">D:汲極端</p>  
        <p type="p">E1:磊晶層(第一摻雜區)</p>  
        <p type="p">E2:磊晶層(第二摻雜區)</p>  
        <p type="p">E3:磊晶層(第三摻雜區)</p>  
        <p type="p">E4:磊晶層</p>  
        <p type="p">F:鰭狀結構</p>  
        <p type="p">G:閘極端</p>  
        <p type="p">I:電流路徑</p>  
        <p type="p">MG:金屬閘極(閘極結構)</p>  
        <p type="p">S:源極端</p>  
        <p type="p">SP:側壁子</p>  
        <p type="p">Sub:基底</p>  
        <p type="p">SDB:單擴散阻斷</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="109" publication-number="202612861"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612861.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612861</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135384</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體基板搬運手臂</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241129B">B25J9/08</main-classification>  
        <further-classification edition="200601120241129B">B25J18/00</further-classification>  
        <further-classification edition="200601120241129B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玟締科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINDIRS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宣志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳逸君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體基板搬運手臂，係包含：一轉向座；一手臂組，具有一第一手臂、一第二手臂及一第三手臂；一第一連動組件，具有一第一連動帶套組於一第一驅動輪及一第一從動輪，該第一驅動輪的直徑大於該第一從動輪的直徑，該第一驅動輪固定結合該轉向座，該第一從動輪固定結合該第二手臂；及一第二連動組件，具有一第二連動帶套組於一第二驅動輪及一第二從動輪，該第二驅動輪的直徑小於該第二從動輪的直徑，該第二驅動輪與該第一從動輪共軸，且該第二驅動輪固定結合該第一手臂，該第二從動輪固定結合該第三手臂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:轉向座</p>  
        <p type="p">2:手臂組</p>  
        <p type="p">21:第一手臂</p>  
        <p type="p">22:第二手臂</p>  
        <p type="p">23:第三手臂</p>  
        <p type="p">24:夾具</p>  
        <p type="p">3:第一連動組件</p>  
        <p type="p">31:第一連動帶</p>  
        <p type="p">32:第一驅動輪</p>  
        <p type="p">33:第一從動輪</p>  
        <p type="p">4:第二連動組件</p>  
        <p type="p">41:第二連動帶</p>  
        <p type="p">42:第二驅動輪</p>  
        <p type="p">43:第二從動輪</p>  
        <p type="p">5:馬達</p>  
        <p type="p">6:第三連動組件</p>  
        <p type="p">61:第三連動帶</p>  
        <p type="p">62:第三驅動輪</p>  
        <p type="p">63:第三從動輪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="110" publication-number="202612827"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612827.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612827</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135388</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於焊接複合材料的超短脈衝雷射焊接系統與方法</chinese-title>  
        <english-title>ULTRASHORT PULSE LASER WELDING SYSTEM AND METHOD FOR WELDING COMPOSITE MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240926B">B23K26/03</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聚嶸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游智偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種用於焊接複合材料的超短脈衝雷射焊接系統與方法。超短脈衝雷射焊接系統包括：一雷射光產生模組，用以提供雷射光束；一第一雷射分光模組，用以區分雷射光束為第一穿透雷射光束以及第一反射雷射光束；一雷射光量測模組，用以將第一反射雷射光束轉換為雷射光量測資訊；一雷射光分析模組，用以分析雷射光量測資訊來獲得雷射光參數；一雷射光振鏡掃描模組，用以依據多個旋轉角度來反射第一穿透雷射光束，以將第一穿透雷射光束反射至複合材料；以及一承載模組，用以承載複合材料。所述雷射光束的脈衝寬度位於50~500 fs之間，所述雷射光束的重複頻率位於0.5~10 GHz之間，所述雷射光束的脈衝能量位於100~1000 μJ之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an ultrashort pulse laser welding system and method for welding composite material. The ultrashort pulse laser welding system comprises: a laser light generator module, configured to provide a laser beam; a first laser beam splitter module, configured to split the laser beam into s first penetrating laser beam and a first reflected laser beam; a laser light measurement module, configured to convert the first reflected laser beam into a laser light measurement information; a laser light analysis module, configured to analyze the laser light measurement information to obtain laser light parameter; a laser light Galvo scanner module, configured to reflect the first penetrating laser beam based on a plurality of rotation angles, so as to reflect the first penetrating laser beam to composite material; and a carrier module, configured to carry the composite material. The pulse width of the laser beam is between 50 and 500 fs, the repetition frequency of the laser beam is between 0.5 and 10 GHz, and the pulse energy of the laser beam is between 100 and 1000 μJ.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:超短脈衝雷射焊接系統</p>  
        <p type="p">202:雷射光產生模組</p>  
        <p type="p">204:第一雷射分光模組</p>  
        <p type="p">206:雷射光量測模組</p>  
        <p type="p">208:雷射光分析模組</p>  
        <p type="p">210:雷射光振鏡掃描模組</p>  
        <p type="p">212:承載模組</p>  
        <p type="p">214:複合材料</p>  
        <p type="p">216:焊接處</p>  
        <p type="p">L1:雷射光束</p>  
        <p type="p">L2:第一穿透雷射光束</p>  
        <p type="p">L3:第一反射雷射光束</p>  
        <p type="p">M1:雷射光量測資訊</p>  
        <p type="p">P1:雷射光參數</p>  
        <p type="p">V:平移速度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="111" publication-number="202614889"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614889.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614889</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135389</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導接柱結構及其製法</chinese-title>  
        <english-title>PILLAR BUMP STRUCTRUE AND FABRICATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10H20/857</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慧隆科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMAZING COOL TECHNOLOGY CORPORATION.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡憲聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, HSIEN-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施養明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, YANG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許宏源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HUNG-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種導接柱結構，包含：一基底；一接合墊，設置於該基底上；一銅柱層，設於該接合墊上；以及一石墨烯錫合金結構，設置於該銅柱層上。本發明可透過石墨烯錫融合如錫、銀、銅等鍍材，以於焊接接合所採用的銅柱上形成一具有良好傳導效率及可靠性的導接柱結構，從而降低阻抗，並更佳適合應用於尺寸相對較小的封裝場合上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A conductive pillar bump structure includes a substrate, a bonding pad disposed on the substrate, a copper pillar layer disposed on the bonding pad, and a grapheme-tin alloy structure disposed on the copper pillar layer. The grapheme-tin alloy can fuse with plating materials such as tin, silver, and copper to form a conductive pillar bump structure having good conductivity and reliability on a copper pillar for soldering, thereby reducing impedance and being more suitable for application in relatively small-size packaging.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基底</p>  
        <p type="p">10:接合墊</p>  
        <p type="p">11:凸塊底層金屬(UBM)層</p>  
        <p type="p">2:銅柱層</p>  
        <p type="p">20:銅層</p>  
        <p type="p">21:介質層</p>  
        <p type="p">22:銅層</p>  
        <p type="p">4:石墨烯錫合金結構</p>  
        <p type="p">CP:導接柱結構</p>  
        <p type="p">PA:鈍化層</p>  
        <p type="p">OP:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="112" publication-number="202612941"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612941.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612941</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135390</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光源切換裝置</chinese-title>  
        <english-title>LIGHT SOURCE SWITCHING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">B60Q1/14</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷家祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, CHIA-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷家祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, CHIA-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷漢晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, HAN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種光源切換裝置，其包含一固定件、一磁閥件、一連動件及一遮擋件。固定件在一第一方向上具有相對的一缺口側及一固定側。缺口側具有一缺口。磁閥件設置於固定件且鄰近於固定側。磁閥件具有一穿設口；穿設口的開口方向對應於第一方向。連動件連接於磁閥件，且可活動地穿設於穿設口，以受磁閥件驅動而位移。在第一方向上，遮擋件相對的兩側分別具有一固定部及一遮蔽部。固定部固定於連動件遠離磁閥件的一端。遮蔽部對應於缺口，並在受連動件驅使而遮蔽或未遮蔽缺口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a light source switching device, which includes a fixed component, a magnetic-valve component, a linking component and a blocking component. In a first direction, the fixed component oppositely has a notch side and a fixed side. A notch is disposed on the notch side. The magnetic-valve component is arranged on the fixed component and adjacent to the fixed side. The magnetic-valve member has a penetration opening corresponding to the first direction. The linking component is movably disposed at the penetration opening to be driven by the magnetic-valve component to move. In the first direction, the two sides oppositely of the blocking component have a fixed part and a shielding part respectively. The fixed part is fixed on an end of the linking component. The shielding part corresponds to the notch, and is moved by the linking component to cover or not cover the notch.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:光源切換裝置</p>  
        <p type="p">21:固定件</p>  
        <p type="p">211:缺口側</p>  
        <p type="p">212:固定側</p>  
        <p type="p">213:缺口</p>  
        <p type="p">214:彎折限位部</p>  
        <p type="p">22:磁閥件</p>  
        <p type="p">221:穿設口</p>  
        <p type="p">222:限位部</p>  
        <p type="p">223:間隙</p>  
        <p type="p">23:連動件</p>  
        <p type="p">24:遮擋件</p>  
        <p type="p">241:固定部</p>  
        <p type="p">242:遮蔽部</p>  
        <p type="p">243:彈性件</p>  
        <p type="p">244:延伸臂</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="113" publication-number="202612841"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612841.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612841</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135391</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>五連桿機構</chinese-title>  
        <english-title>FIVE-LINKAGE MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B23Q1/44</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>城市學校財團法人臺北城市科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIPEI CITY UNIVERSITY OF SCIENCE &amp; TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊子毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TZYY-YIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊子毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TZYY-YIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宥瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">連桿機構機械工程的重要傳動構造之一，一般的連桿機構自由度為一，能夠精確地傳遞運動與能量，本發明的五連桿機構擁有兩個自由度，可以實現更多的運動形式，它的應用範圍更廣，適合於需要多樣運動的機械系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">101:固定桿</p>  
        <p type="p">102:輸入桿</p>  
        <p type="p">103:連接桿一</p>  
        <p type="p">104:連接桿二</p>  
        <p type="p">105:輸出桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="114" publication-number="202614374"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614374.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614374</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135393</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構及其製造方法</chinese-title>  
        <english-title>PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240924B">H01L23/28</main-classification>  
        <further-classification edition="200601120240924B">H01L23/488</further-classification>  
        <further-classification edition="200601120240924B">H01L21/56</further-classification>  
        <further-classification edition="200601120240924B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樂鑫材料科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AG MATERIALS TECHNOLOGY CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊東漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, TUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳吟瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YIN-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡志欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIH-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡幸樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, HSING-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周眾信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHUNG-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種封裝結構，包括晶片、設置在晶片上方的第一金屬薄膜、設置在第一金屬薄膜上且與第一金屬薄膜直接接觸的燒結層、設置在燒結層上的金屬箔、以及設置在金屬箔上且與晶片電性連接的內連線導體。所述第一金屬薄膜具有第一奈米孿晶結構。本揭露更提供一種封裝結構的製造方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package structure includes a chip; a first metal film disposed over the chip; a sintered layer disposed on and in direct contact with the first metal film; a metal foil disposed on the sintered layer; and an interconnection conductor disposed on the metal foil and is electrically connected to the chip. The first metal film includes a first nano-twinned structure. A method for manufacturing the package structure is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:封裝結構</p>  
        <p type="p">102:晶片</p>  
        <p type="p">1021:銲墊</p>  
        <p type="p">1022:介電層</p>  
        <p type="p">104:黏著層</p>  
        <p type="p">106:第一金屬薄膜</p>  
        <p type="p">108:燒結層</p>  
        <p type="p">110:金屬箔</p>  
        <p type="p">112:內連線導體</p>  
        <p type="p">1121、1122:端</p>  
        <p type="p">302:載板</p>  
        <p type="p">304、304a、304b:銅銲墊</p>  
        <p type="p">A、B:銲點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="115" publication-number="202614095"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614095.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614095</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135403</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有壓電特性之導電氧化銦錫薄膜、其製備方法及應用其之電容</chinese-title>  
        <english-title>CONDUCTIVE INDIUM TIN OXIDE FILM WITH PIEZOELECTRIC PROPERTIES, THE PREPARATION METHOD THEREOF, AND CAPACITORS UTILIZING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">H01B5/14</main-classification>  
        <further-classification edition="202301120241104B">H10N30/09</further-classification>  
        <further-classification edition="200601120241104B">C30B7/10</further-classification>  
        <further-classification edition="200601120241104B">H01B13/00</further-classification>  
        <further-classification edition="200601120241104B">H01G4/008</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮至正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUAN, JR JENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林煥恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUAN EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI HSUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於具有壓電特性之導電氧化銦錫薄膜、其製備方法及應用其之電容。該具有壓電特性之導電氧化銦錫薄膜之壓電係數大於3 pm/V，電阻值小於10 Ω。本發明藉由低溫水熱法於ITO中摻雜金屬元素，使ITO同時具有壓電性質與導電性質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a conductive indium tin oxide (ITO) film with piezoelectric properties, the preparation method thereof, and capacitors utilizing the same. The piezoelectric coefficient of the conductive ITO film with piezoelectric properties is greater than 3 pm/V, and the resistance value is less than 10 Ω. The present disclosure achieves simultaneous piezoelectric and conductive properties in ITO by doping metal elements into ITO via a low-temperature hydrothermal method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="116" publication-number="202613519"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613519.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613519</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135411</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微流體檢測模組及微流體檢測裝置</chinese-title>  
        <english-title>MICROFLUIDIC DETECTION MODULE AND MICROFLUIDIC DETECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250421B">G01N21/25</main-classification>  
        <further-classification edition="200601120250421B">G01N21/64</further-classification>  
        <further-classification edition="200601120250421B">G01N33/483</further-classification>  
        <further-classification edition="200601120250421B">G01N33/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上準微流體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICAREO TAIWAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游輝民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HUI-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳榮耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUNG YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隋壽齡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種微流體檢測模組，包含微流道載板、密封板及儲液盒。微流道載板包含微流道。密封板覆蓋微流道載板的微流道。密封板或微流道載板具有連通微流道的多個開孔。微流道載板及/或密封板包含可見光可穿透區域，可見光可穿透區域涵蓋微流道的至少一部分。儲液盒連接密封板或微流道載板。儲液盒包含至少三個槽體，各槽體底部具有至少一通孔，各槽體的通孔連接開孔中的一個。儲液盒具有光學偵測區，光學偵測區位在三個槽體之外。光學偵測區與可見光可穿透區域在垂直微流道載板的方向上重疊。在此亦揭露一種微流體檢測裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A microfluidic detection module includes a microchannel carrier plate, a sealing plate, and a liquid storage box. The microchannel carrier plate includes microchannels. The sealing plate covers the microchannels of the microchannel carrier plate. The sealing plate or the microchannel carrier plate has openings communicating with the microchannels. The microchannel carrier plate and/or the sealing plate include a visible light-transmissive region covering at least a portion of the microchannels. The liquid storage box is connected to the sealing plate or the microchannel carrier plate. The liquid storage box includes at least three reservoirs, each reservoir bottom having at least one through-hole, each through-hole of the reservoirs being connected to one of the openings. The liquid storage box has an optical detection area located outside the three reservoirs. The optical detection area overlaps with the visible light-transmissive region in the direction perpendicular to the microchannel carrier plate. Also disclosed herein is a microfluidic detection device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:微流體檢測模組</p>  
        <p type="p">110:微流道載板</p>  
        <p type="p">120:密封板</p>  
        <p type="p">130:儲液盒</p>  
        <p type="p">130Z:光學偵測區</p>  
        <p type="p">132:底板</p>  
        <p type="p">133:上表面</p>  
        <p type="p">134:下表面</p>  
        <p type="p">140:第一槽體</p>  
        <p type="p">150:第二槽體</p>  
        <p type="p">160:第三槽體</p>  
        <p type="p">171:第一子槽</p>  
        <p type="p">172:第二子槽</p>  
        <p type="p">173:第三子槽</p>  
        <p type="p">174:第四子槽</p>  
        <p type="p">175:連通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="117" publication-number="202612989"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612989.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612989</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135413</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>設備提取件</chinese-title>  
        <english-title>EQUIPMENT EXTRACTION COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">B65D25/38</main-classification>  
        <further-classification edition="200601120241007B">B65D25/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致茂電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHROMA ATE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉崇琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHONG LIN, LIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡嘉慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種設備提取件，被用於提取一設備，包含一定型層與一補強層。該定型層具有一本體、二第一摺線、二第二摺線與至少二第一提取孔，該等第一摺線與該等第二摺線係由該本體的長邊中心為始依序朝向該本體的短邊方向而設。該補強層係固定於該定型層其中一表面上，其與該定型層的材質不同，該補強層具有至少二第二提取孔，該等第二提取孔的位置與該等第一提取孔的位置相對應。其中，該設備提取件係沿著該等第一摺線與該等第二摺線向內摺疊而成，該設備提取件可包覆該設備，並將該設備從一包材中取出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an equipment extraction component. The component is used to extract equipment and contains a shaping layer and a reinforcing layer. The shaping layer has a body, two first folding lines, two second folding lines, and at least two first extraction holes. The first folding lines and the second folding lines are arranged sequentially from the center of the long edge of the body towards the short edge direction of the body. The reinforcing layer is fixed on one surface of the shaping layer and is made of different materials from the shaping layer. The reinforcing layer has at least two second extraction holes, the positions of which correspond to the positions of the first extraction holes. The equipment extraction component is formed by folding inward along the first fold lines and the second fold lines. The equipment extraction component is used to wrap equipment and take equipment out of a package.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:設備提取件</p>  
        <p type="p">20:定型層</p>  
        <p type="p">21:本體</p>  
        <p type="p">211:長邊</p>  
        <p type="p">212:短邊</p>  
        <p type="p">22:第一摺線</p>  
        <p type="p">23:第二摺線</p>  
        <p type="p">24:第一提取孔</p>  
        <p type="p">30:補強層</p>  
        <p type="p">31:第二提取孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="118" publication-number="202614835"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614835.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614835</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135414</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及製造半導體裝置的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D62/832</main-classification>  
        <further-classification edition="202501120250102B">H10D62/834</further-classification>  
        <further-classification edition="202501120250102B">H10D30/60</further-classification>  
        <further-classification edition="202501120250102B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢磊科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉原良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YUAN LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張元洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YUAN CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宜蓁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YI CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置，其包括碳化矽磊晶層，其包括：p型阱區；接面場效區，其與該p型阱區相鄰；重摻雜n型區，其在該p型阱區的表面上；以及重摻雜p型區，其在該重摻雜n型區之下且在該p型阱區內。該半導體裝置還包括島狀氧化物，其在該接面場效區上；閘極氧化層，其覆蓋該p型阱區、該接面場效區、該重摻雜n型區、該重摻雜p型區和該島狀氧化物；以及複晶矽層，其在該閘極氧化物層上，並且未與該島狀氧化物接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:碳化矽磊晶層</p>  
        <p type="p">102B:閘極氧化物層</p>  
        <p type="p">103:複晶矽層</p>  
        <p type="p">105:重摻雜p區</p>  
        <p type="p">107:重摻雜n區</p>  
        <p type="p">109:氧化物層</p>  
        <p type="p">109A:島狀氧化物</p>  
        <p type="p">PW:p型阱區</p>  
        <p type="p">W2:寬度</p>  
        <p type="p">T3:厚度</p>  
        <p type="p">T4:厚度</p>  
        <p type="p">DA2:區域</p>  
        <p type="p">JF2:接面場效區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="119" publication-number="202612963"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612963.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612963</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135415</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自行車的車頭與車把手鎖固結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">B62K21/18</main-classification>  
        <further-classification edition="200601120241202B">B62K21/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昌慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昌慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡昇寶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是提供一種自行車的車頭與車把手鎖固結構，主要係藉由一本體及一內徑擴張器所相對構成，內徑擴張器包含有兩對向設置的導引座及一擴張插件，該導引座係提供嵌入於該本體之擴張切口，該擴張插件之兩外側壁分別形成一斜面形態，並對應該兩導引座的滑槽分別設一導軌，當擴張插件從較小斜面的頭端進入該兩導引座的滑槽，進而至較大斜面的尾端進入至該兩對向滑槽，俾使組合內徑空間擴張成較大的外徑，以便利不同外徑大小或曲線變化的車把手之組合部作套合組設者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:內徑擴張器</p>  
        <p type="p">10:本體</p>  
        <p type="p">11:龍頭豎桿</p>  
        <p type="p">12:立管組合部</p>  
        <p type="p">13:立管組合槽</p>  
        <p type="p">14:車頭組合部</p>  
        <p type="p">15:組合內徑空間</p>  
        <p type="p">16:擴張切口</p>  
        <p type="p">17:側端緣</p>  
        <p type="p">18:第一螺組部</p>  
        <p type="p">19:第二螺組部</p>  
        <p type="p">20:擴張插件</p>  
        <p type="p">21:尾端</p>  
        <p type="p">22:頭端</p>  
        <p type="p">23:導軌</p>  
        <p type="p">24:凹緣</p>  
        <p type="p">30:導引座</p>  
        <p type="p">31:第一端</p>  
        <p type="p">32:第二端</p>  
        <p type="p">33:第一擋止端</p>  
        <p type="p">34:第二擋止端</p>  
        <p type="p">35:滑槽</p>  
        <p type="p">36:凸緣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="120" publication-number="202613742"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613742.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
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      <publication-reference> 
        <document-id> 
          <doc-number>202613742</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135417</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多通道氣體微流量異相催化反應特性分析控制系統及其控制方法</chinese-title>  
        <english-title>MULTI-CHANNEL MICROFLOW REACTION CONTROL SYSTEM AND ITS CONTROL METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">G05B19/43</main-classification>  
        <further-classification edition="200601120250512B">G05D7/06</further-classification>  
        <further-classification edition="200601120250512B">B01J8/00</further-classification>  
        <further-classification edition="200601120250512B">G01F1/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊汶達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WEN-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉雅瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIOU, YA-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種多通道氣體微流量異相催化反應特性分析控制系統及其控制方法。透過在集成架體內設置流量控制模組及電源管理模組，配合外接氣瓶和反應裝置，達到可以同時控制多股反應所需的氣體，以及用以應對複雜的催化反應程序所需的條件，形成能夠廣泛適用於傳統實驗室研究的反應設備系統，用於提供氣固相的異質介面催化反應或是預處理程序的各式組合氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-channel microflow reaction control system and its control method, a flow control module and a power management module are disposed in an integrated frame and cooperate with an external gas cylinder and a reaction device to simultaneously control the gas required for multiple reactions and achieve the conditions needed to response to the complex catalytic reaction program, so as to form a reaction equipment system that can be widely used for traditional laboratory research, providing heterogeneous interface catalytic reactions or various combined gases of the preprocessing program.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:集成架體</p>  
        <p type="p">11:控制面板區</p>  
        <p type="p">12:電路集成區</p>  
        <p type="p">R1:上層空間</p>  
        <p type="p">R2:下層空間</p>  
        <p type="p">20:流量控制模組</p>  
        <p type="p">21:流量控制器</p>  
        <p type="p">22:流量計</p>  
        <p type="p">221:流量計開關</p>  
        <p type="p">25:三向閥開關</p>  
        <p type="p">26:四向閥開關</p>  
        <p type="p">40:溫度控制模組</p>  
        <p type="p">41:溫度控制器</p>  
        <p type="p">421:加熱器開關</p>  
        <p type="p">50:電源管理模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="121" publication-number="202612800"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612800.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612800</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135422</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於四向穿梭車貨架內的清潔維修車系統</chinese-title>  
        <english-title>CLEANING AND MAINTENANCE VEHICLE SYSTEM IN FOUR-WAY SHUTTLE RACKS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B08B7/00</main-classification>  
        <further-classification edition="200601120241105B">B65G45/10</further-classification>  
        <further-classification edition="200601120241105B">B65G1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃德瑞克智能倉儲設備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WORLD RACK INTELLIGENCE STORAGE EQUIPMENT CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林明我</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MING-WO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於四向穿梭車貨架內的清潔維修車系統，包含一四向清潔維修車其包含：一四向車體、一電池模組、一清潔模組具有可升降的清潔頭、一鏡反光電裝置具有一檢測光電對用以偵測是否對準軌道上的貨位標記、一觸控螢幕具有可被用以控制該四向清潔維修車的一控制介面；一四向清潔維修車的控制模式之切換方式，包含一初始模式、一觸控螢幕手動模式其經由手動操作該觸控螢幕的該控制介面來控制該四向清潔維修車、一觸控螢幕維修模式、及一位置判斷步驟；該初始模式可被切換至該觸控螢幕手動模式，然後該觸控螢幕的手動模式與維修模式可互相切換。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cleaning and maintenance vehicle system for a four-way shuttle rack, comprises a four-way cleaning and maintenance vehicle including a four-way vehicle body, a battery module, a cleaning module having a cleaning head being ascendable and descendible, a mirror-reflecting photoelectric device having a detection photoelectric pair for detecting a cargo location mark on a shuttle track, and a touch screen having a control interface for controlling the four-way cleaning and maintenance vehicle. A method for switching among various control modes of the four-way cleaning and maintenance vehicle, comprises an initial mode, a touch screen manual mode in which the vehicle is controlled by manually operating the control interface, a touch screen maintenance mode, and a position determination step; wherein the initial mode can be switched to the touch screen manual mode and then the touch screen can be switched between the touch screen manual mode and the touch screen maintenance mode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:四向清潔維修車</p>  
        <p type="p">11:四向車體</p>  
        <p type="p">111:乘載面</p>  
        <p type="p">112:側面</p>  
        <p type="p">12:電池箱</p>  
        <p type="p">13:清潔模組</p>  
        <p type="p">14:觸控螢幕</p>  
        <p type="p">15:蜂鳴燈杆</p>  
        <p type="p">16:圍欄</p>  
        <p type="p">17:車輪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="122" publication-number="202612925"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612925.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612925</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135423</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>模組化充電連接器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241007B">B60L53/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江陰信承電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡振興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸麒宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種模組化充電連接器，包括一整合主體、一插座本體、一交直流端子並聯模組、一導熱測溫模組、一接地暨低壓信號模組；該整合主體與插座本體結合，並使交直流端子並聯模組、導熱測溫模組同時容置其間，該導熱測溫模組與交直流端子並聯模組之直流／交流端子構成熱接觸，以導熱方式偵測充電時的工作溫度，該接地暨低壓信號模組構成一連接器形式，用與插座本體結合，並與整合主體構成互鎖；上述連接器將主要元組件予以模組化，並以整合主體作為核心，整合並集中各個模組，藉此達成易於組裝生產、利於實現自動化布局之目的；另一方面，導熱測溫模組充分運用空間，以同組感測元件利用導熱方式同時感測直流／交流充電端子的工作溫度，可更精確地偵測充電溫度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:整合主體</p>  
        <p type="p">20:插座本體</p>  
        <p type="p">21:插座</p>  
        <p type="p">210:閂孔</p>  
        <p type="p">60:電子鎖</p>  
        <p type="p">61:手動拉繩</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="123" publication-number="202614578"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614578.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614578</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135453</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>射頻開關電路及其操作方法</chinese-title>  
        <english-title>RADIO-FREQUENCY SWITCHING CIRCUIT AND METHOD FOR OPERATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241223B">H04B1/04</main-classification>  
        <further-classification edition="200601120241223B">H01P1/15</further-classification>  
        <further-classification edition="200601120241223B">H01P1/212</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神基科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GETAC TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃經維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHING WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種射頻開關電路包含第一天線、第二天線、功率分配器、以及分頻單元。第一天線與射頻干擾源相鄰。第二天線設置在射頻干擾源的干擾距離之外。功率分配器的第一輸入埠及第二輸入埠分別與第一天線及第二天線耦接。分頻單元與功率分配器的輸出埠耦接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A radio-frequency switching circuit includes a first antenna, a second antenna, a power divider, and a frequency dividing unit. The first antenna is adjacent to a radio-frequency interference source. The second antenna is arranged outside an interfering range of the radio-frequency interference source. A first input port and a second input port of the power divider are coupled with the first antenna and the second antenna, respectively. The frequency dividing unit is coupled with an output port of the power divider.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:射頻開關電路</p>  
        <p type="p">210:天線</p>  
        <p type="p">220:天線</p>  
        <p type="p">230:功率分配器</p>  
        <p type="p">231:輸入埠</p>  
        <p type="p">232:輸入埠</p>  
        <p type="p">233:輸出埠</p>  
        <p type="p">240:分頻單元</p>  
        <p type="p">240a:輸入端</p>  
        <p type="p">240b:輸出端</p>  
        <p type="p">241:雙工器</p>  
        <p type="p">242:提取器</p>  
        <p type="p">250:放大器</p>  
        <p type="p">260:開關單元</p>  
        <p type="p">261:開關元件</p>  
        <p type="p">262:開關元件</p>  
        <p type="p">270:外部天線</p>  
        <p type="p">280:訊號處理單元</p>  
        <p type="p">290:訊號處理單元</p>  
        <p type="p">n:節點</p>  
        <p type="p">S1~S3:訊號</p>  
        <p type="p">Sa:訊號</p>  
        <p type="p">Sc:訊號分量</p>  
        <p type="p">Sm:訊號分量</p>  
        <p type="p">So:整合訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="124" publication-number="202614711"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614711.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614711</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135455</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>伺服器</chinese-title>  
        <english-title>SERVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240927B">H05K7/20</main-classification>  
        <further-classification edition="200601120240927B">H05K7/18</further-classification>  
        <further-classification edition="200601120240927B">H05K7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SHUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何凡普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, FANPU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李小雙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIAOSHUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田光召</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, GUANG-ZHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宏州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HONG-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俞帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種伺服器，包括殼體、主處理器模組、圖形處理卡模組、圖形處理卡背板和散熱模組。殼體具有一容置腔；主處理器模組容置於容置腔內；圖形處理卡模組容置於容置腔內；圖形處理卡背板設置於容置腔內，且圖形處理卡背板與容置腔的底部之間具有縫隙，圖形處理卡背板的第一側面上設有多個用於匹配連接圖形處理卡模組的插槽，圖形處理卡背板的第二側面上設有多個資料傳輸晶片，多個資料傳輸晶片與多個插槽對應電性連接；散熱模組靠近圖形處理卡模組設置，且散熱模組與外部空氣連通，散熱模組用於對圖形處理卡模組和資料傳輸晶片散熱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A server includes a casing, a main processor module, a graphic processing card module, a graphic processing card backplane and a heat dissipation module. The casing has an accommodation chamber. The main processor module is accommodated in the accommodation chamber. The graphic processing card module is accommodated in the accommodation chamber. The graphic processing card backplane is disposed in the accommodation chamber, and there is a gap located between the graphic processing card backplane and a bottom part of the accommodation chamber. The graphic processing card backplane is provided with a plurality of slots for matching and connecting the graphic processing card module on a first side thereof and a plurality of data transmitting chips on a second side thereof which are correspondingly and electrically connected to the slots. The heat dissipation module is disposed close to the graphic processing card module and is in air communication connection with external environment, and the heat dissipation module is configured to dissipate heat of the graphic processing card module and the data transmitting chips.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:殼體</p>  
        <p type="p">4:主處理器模組</p>  
        <p type="p">6:圖形處理卡模組</p>  
        <p type="p">62:限位件</p>  
        <p type="p">64:圖形處理卡</p>  
        <p type="p">8:圖形處理卡背板</p>  
        <p type="p">82:插槽</p>  
        <p type="p">10:散熱模組</p>  
        <p type="p">16:可插拔光學模組板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="125" publication-number="202614177"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614177.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614177</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135456</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構的製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H01L21/28</main-classification>  
        <further-classification edition="202501120250102B">H10D84/82</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體結構的製造方法。所述半導體方法包括以下步驟。於基底中形成元件隔離結構，以界定出低壓元件區、中壓元件區、第一高壓元件區與第二高壓元件區。同時移除所述中壓元件區與所述第二高壓元件區中的所述基底的一部分。同時移除所述第一高壓元件區與所述第二高壓元件區中的所述基底的一部分。於所述低壓元件區、所述中壓元件區、所述第一高壓元件區與所述第二高壓元件區中的所述基底上形成第一氧化物層。移除所述低壓元件區中的所述第一氧化物層。於所述低壓元件區中的所述基底上形成第二氧化物層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of a semiconductor structure is provided. The method includes the following steps. A device isolation structure is formed in a substrate to define a low-voltage device region, a medium-voltage device region, a first high-voltage device region and a second high-voltage device region. A part of the substrate in the medium-voltage device region and a part of the second high-voltage device region are simultaneously removed. A part of the substrate in the first high-voltage device region and a part of the substrate in the second high-voltage device region are simultaneously removed. A first oxide layer is formed on the substrate in the low-voltage device region, the medium-voltage device region, the first high-voltage device region and the second high-voltage device region. The first oxide layer in the low-voltage device region is removed. A second oxide layer is formed on the substrate in the low-voltage device region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底</p>  
        <p type="p">102:墊氧化物層</p>  
        <p type="p">104:罩幕層</p>  
        <p type="p">106:元件隔離結構</p>  
        <p type="p">108:第一圖案化罩幕層</p>  
        <p type="p">HV1:第一高壓元件區</p>  
        <p type="p">HV2:第二高壓元件區</p>  
        <p type="p">LV:低壓元件區</p>  
        <p type="p">MV:中壓元件區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="126" publication-number="202614754"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614754.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614754</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135466</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURES AND　METHODS FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250102B">H10B41/00</main-classification>  
        <further-classification edition="202301120250102B">H10B41/30</further-classification>  
        <further-classification edition="202301120250102B">H10B41/35</further-classification>  
        <further-classification edition="202301120250102B">H10B41/60</further-classification>  
        <further-classification edition="202501120250102B">H10D64/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉奇青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉重顯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHUNG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體結構。半導體結構包含基板、設置在基板上的穿隧介電層、設置在穿隧介電層上的複數個電晶體。每個電晶體包括依序設置在穿隧介電層上的浮置閘極、閘極間介電層、與控制閘極。沿著第一方向的一剖面圖中，控制閘極設置於浮置閘極的兩側壁之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure of this invention is provided. The semiconductor structure includes a substrate, a tunneling dielectric layer disposed on the substrate, a plurality of transistor structure disposed on the tunneling dielectric layer. Each of the transistor structures includes a floating gate, an inter-gate dielectric layer, and a control gate sequentially disposed on the tunneling layer. In a cross-sectional view along a first direction, the control gate is disposed between two sidewalls of the floating gate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:控制閘極</p>  
        <p type="p">20:閘極間介電層</p>  
        <p type="p">30:浮置閘極</p>  
        <p type="p">40:側壁保護層</p>  
        <p type="p">100:基板</p>  
        <p type="p">200:穿隧介電層</p>  
        <p type="p">G:氣隙</p>  
        <p type="p">U:電晶體結構</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Z:高度方向</p>  
        <p type="p">AA’:剖線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="127" publication-number="202613885"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613885.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613885</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135467</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>激勵函數計算裝置及其計算方法</chinese-title>  
        <english-title>ACTIVATION FUNCTION COMPUTING DEVICE AND COMPUTING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241223B">G06N3/048</main-classification>  
        <further-classification edition="202301120241223B">G06N3/063</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>創鑫智慧股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEUCHIPS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃紳睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHEN-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅元隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, YUAN LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種激勵函數計算裝置及其計算方法。激勵函數計算裝置計算符合浮點數格式的輸入值以產生輸出值。激勵函數計算裝置包括多個查找表以及控制器。多個查找表分別儲存多個尾數值與多個係數之間的對應關係。控制器根據輸入值的輸入指數部分以及輸入尾數部分從多個係數中選擇選中係數。控制器根據包括乙狀函數的近似函數計算選中係數以及輸入值以產生符合浮點數格式且具有高精確度的輸出值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An activation function computing device and a computing method thereof are provided. The activation function computing device computes an input value conforming to a floating-point number format to generate an output value. The activation function computing device includes multiple lookup tables and a controller. The lookup tables respectively stores correspondences between multiple mantissa values and multiple coefficients. The controller selects a selected coefficient from the coefficients according to an input exponent part and an input mantissa part of the input value. The controller computes the selected coefficient and the input value according to an approximation function including a Sigmoid function to generate the output value which conforms to the floating-point number format and has high accuracy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:激勵函數計算裝置</p>  
        <p type="p">110:控制器</p>  
        <p type="p">BT:選中係數</p>  
        <p type="p">DIN:輸入值</p>  
        <p type="p">DOUT:輸出值</p>  
        <p type="p">LUT1~LUTN:查找表</p>  
        <p type="p">PI1:輸入符號部分</p>  
        <p type="p">PI2:輸入指數部分</p>  
        <p type="p">PI3:輸入尾數部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="128" publication-number="202614805"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614805.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614805</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135472</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高壓半導體裝置</chinese-title>  
        <english-title>HIGH-VOLTAGE SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/60</main-classification>  
        <further-classification edition="202501120250102B">H10D64/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHIN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊鎮嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JHEN-JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林岳璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUEH-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃善禧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHAN-SHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種高壓半導體裝置包括半導體基底、閘極結構、第一漂移區、第二漂移區以及閘極接觸結構。閘極結構設置在半導體基底上，第一漂移區與第二漂移區設置在半導體基底中，且第一漂移區的一部分與第二漂移區的一部分分別位於閘極結構在水平方向上的兩相對側。第一漂移區在垂直方向上部分位於閘極結構之下，且該半導體基底包括半導體區在水平方向上被夾設在第一漂移區與第二漂移區之間。閘極接觸結構設置在閘極結構上且與閘極結構電性連接，且閘極接觸結構位於半導體區在垂直方向上的正上方。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A high-voltage semiconductor device includes a semiconductor substrate, a gate structure, a first drift region, a second drift region, and a gate contact structure. The gate structure is disposed on the semiconductor substrate. The first drift region and the second drift region are disposed in the semiconductor substrate. A part of the first drift region and a part of the second drift region are located at two opposite sides of the gate structure in a horizontal direction, respectively. The first drift region is partly located under the gate structure in a vertical direction, and the semiconductor substrate includes a semiconductor region sandwiched between the first drift region and the second drift region in the horizontal direction. The gate contact structure is disposed on and electrically connected with the gate structure, and the gate contact structure is located directly above the semiconductor region in the vertical direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">24A:第一漂移區</p>  
        <p type="p">24B:第二漂移區</p>  
        <p type="p">32:閘極結構</p>  
        <p type="p">AA:主動區</p>  
        <p type="p">CT1:第一源極/汲極接觸結構</p>  
        <p type="p">CT2:第二源極/汲極接觸結構</p>  
        <p type="p">CT3:閘極接觸結構</p>  
        <p type="p">D1:水平方向</p>  
        <p type="p">D2:水平方向</p>  
        <p type="p">D3:垂直方向</p>  
        <p type="p">RG:半導體區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="129" publication-number="202614096"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614096.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614096</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135476</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗硫薄膜電阻及其製造方法</chinese-title>  
        <english-title>ANTI-SULFUR THIN FILM RESISTOR AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">H01C1/028</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國巨股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAGEO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭勝利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, SHEN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李煥文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HWAN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種抗硫薄膜電阻及其製造方法。抗硫薄膜電阻包含基板、第一內電極對、電阻層、鈍化層、兩抗硫導電層及第二內電極對，其中抗硫導電層包含碳材，且抗硫導電層之每一者分別具有溝槽。藉由利用具有溝槽且含碳的抗硫導電層覆蓋第一內電極對，以保護第一內電極對不發生硫化反應，且可藉有具有良好導電性的抗硫導電層進行電性傳導。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An anti-sulfur thin film resistor and a method of forming the same are provided. The anti-sulfur thin film resistor includes a substrate, a pair of first internal electrodes, a resistor layer, a passivation layer, two anti-sulfur conductive layers and a pair of second internal electrodes, in which the anti-sulfur conductive layers includes carbon material, and each of the anti-sulfur conductive layers has a trench. The pair of first internal electrodes are protected from sulfurization reaction by using the anti-sulfur conductive layers with the trench and including carbon, and the anti-sulfur conductive layers can be used to perform electrical conduction by having great electrical conductivity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:抗硫薄膜電阻</p>  
        <p type="p">110:基板</p>  
        <p type="p">110A:上表面</p>  
        <p type="p">110B:下表面</p>  
        <p type="p">110C:側部</p>  
        <p type="p">120A,120B:第一內電極</p>  
        <p type="p">130:電阻層</p>  
        <p type="p">140:鈍化層</p>  
        <p type="p">150A,150B:抗硫導電層</p>  
        <p type="p">152:溝槽</p>  
        <p type="p">160:第一絕緣保護層</p>  
        <p type="p">170A,170B:第二內電極</p>  
        <p type="p">180:第二絕緣保護層</p>  
        <p type="p">190A,190B:背電極</p>  
        <p type="p">192:連接層</p>  
        <p type="p">195:外電極對</p>  
        <p type="p">195A:銅層</p>  
        <p type="p">195B:鎳層</p>  
        <p type="p">195C:錫層</p>  
        <p type="p">L:長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="130" publication-number="202613890"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613890.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613890</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135477</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機器學習模型的訓練方法、訓練樣本的優化方法與電子裝置</chinese-title>  
        <english-title>TRAINING METHOD, REFINEMENT METHOD OF TRAINING SAMPLE, AND ELECTRIC DEVICE FOR MACHINE LEARNING MODEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250102B">G06N3/08</main-classification>  
        <further-classification edition="201901120250102B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉書豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, SHU-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳尚德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHANG-DE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫際恬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, CHI-TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃彥勲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YEN-SHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王冠堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, GUAN-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提出一種機器學習模型的訓練方法以及訓練樣本的優化方法。此訓練方法包含：取得訓練樣本的特徵向量，對特徵向量進行分群以後取得代表性訓練樣本，再根據代表性訓練樣本來訓練機器學習模型。優化方法包含：根據一原始樣本查詢外部資料庫以取得補充資料，根據一個機器學習模型對原始樣本進行評論以產生評論資料，然後使用另一個機器學習模型根據補充資料以及評論資料對原始樣本進行優化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a training method for a machine learning model and a refinement method for training samples. The training method includes: obtaining feature vectors of the training samples, clustering the feature vectors to obtain representative training samples, and then training the machine learning model based on the representative training samples. The refinement method includes: querying an external database based on an original sample to obtain supplementary data, using a machine learning model to evaluate the original sample to generate evaluation data, and then using another machine learning model to refine the original sample based on the supplementary data and the evaluation data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">501~504:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="131" publication-number="202614013"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614013.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614013</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135478</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250102B">G09G3/32</main-classification>  
        <further-classification edition="202501120250102B">H10H29/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王慧媛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勇達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNG-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍詠翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAN, YUNG-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包括基板、第一導電層、絕緣層、第二導電層、多個微型發光元件以及多個微型控制晶片。第一導電層以及第二導電層配置於基板的一表面上。該些微型發光元件包括第一微型發光元件以及第二微型發光元件。該些微型控制晶片包括第一微型控制晶片以及第二微型控制晶片。第一微型控制晶片藉由第一導電層連接第一微型發光元件，第二微型控制晶片藉由第二導電層連接第二微型發光元件。第一微型控制晶片與第二微型發光元件在基板上的垂直投影相重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device including a substrate, a first conductive layer, an insulating layer, a second conductive layer, a plurality of micro light emitting elements and a plurality of micro control chips is provided. The first conductive layer and the second conductive layer are disposed on a surface of the substrate. The micro light emitting elements include a first micro light emitting element and a second micro light emitting element. The micro control chips include a first micro control chip and a second micro control chip. The first micro control chip connects the first micro light emitting element via the first conductive layer, and the second micro control chip connects the second micro light emitting element via the second conductive layer. A vertical projection of the first micro control chip on the substrate and a vertical projection of the second micro light emitting element on the substrate overlap with each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">100:顯示裝置</p>  
        <p type="p">101、102、104:微型發光元件</p>  
        <p type="p">201、202、203:微型控制晶片</p>  
        <p type="p">300:絕緣層</p>  
        <p type="p">301:第一絕緣層</p>  
        <p type="p">302:第二絕緣層</p>  
        <p type="p">401:第一導電層</p>  
        <p type="p">402:第二導電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="132" publication-number="202614691"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614691.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614691</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135479</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>元件基板及其製造方法</chinese-title>  
        <english-title>DEVICE SUBSTRATE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240926B">H05K3/46</main-classification>  
        <further-classification edition="200601120240926B">H05K3/40</further-classification>  
        <further-classification edition="200601120240926B">H05K1/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜振源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, CHEN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃伊莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-SHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林岱佐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TAI-TSO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種元件基板包括電路基板與多個接合墊。這些接合墊各自包括金屬層、鎢合金層與鎢合金氧化層。金屬層設置在電路基板上。鎢合金層設置在金屬層背對電路基板的一側。鎢合金氧化層設置在鎢合金層背對金屬層的一側。金屬層、鎢合金層與鎢合金氧化層沿著堆疊方向彼此重疊。一種元件基板的製造方法也被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device substrate including a circuit substrate and a plurality of bonding pads is provided. Each of the bonding pads includes a metal layer, a tungsten alloy layer and a tungsten alloy oxide layer. The metal layer is disposed on the circuit substrate. The tungsten alloy layer is disposed on one side of the metal layer facing away from the circuit substrate. The tungsten alloy oxide layer is disposed on one side of the tungsten alloy layer facing away from the metal layer. The metal layer, the tungsten alloy layer and the tungsten alloy oxide layer overlap each other along a stacking direction. A manufacturing method of the device substrate is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:元件基板</p>  
        <p type="p">100:電路基板</p>  
        <p type="p">110:基板</p>  
        <p type="p">120:驅動電路層</p>  
        <p type="p">141:金屬層</p>  
        <p type="p">143:鎢合金層</p>  
        <p type="p">145:鎢合金氧化層</p>  
        <p type="p">160:鈍化層</p>  
        <p type="p">160op:開口</p>  
        <p type="p">BP、BP1、BP2、BPr:接合墊</p>  
        <p type="p">E1:第一電極</p>  
        <p type="p">E2:第二電極</p>  
        <p type="p">ES:磊晶結構</p>  
        <p type="p">LED:發光元件</p>  
        <p type="p">t1:第一厚度</p>  
        <p type="p">t2:第二厚度</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="133" publication-number="202613297"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613297.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613297</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135480</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>模擬腫瘤微環境的藥物篩選平台</chinese-title>  
        <english-title>DRUG SCREENING PLATFORM THAT SIMULATES THE TUMOR MICRO ENVIRONMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">C12M1/34</main-classification>  
        <further-classification edition="200601120241125B">C12M1/36</further-classification>  
        <further-classification edition="200601120241125B">C12M3/06</further-classification>  
        <further-classification edition="200601120241125B">C12M3/00</further-classification>  
        <further-classification edition="201001120241125B">C12N5/09</further-classification>  
        <further-classification edition="200601120241125B">G01N33/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙梓茵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, ZIG-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉承賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHENG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種模擬腫瘤微環境的藥物篩選平台包含腫瘤微環境模擬用晶片、藥物試驗用晶片，及設置在腫瘤微環境模擬用晶片與藥物試驗用晶片間的通透性薄膜。腫瘤微環境模擬用晶片包括微環境建立單元，微環境建立單元用於供化學反應進行以產生用來模擬腫瘤微環境的酸性氣體、鹼性氣體及/或氧氣濃度。藥物試驗用晶片包括用於供治療藥物與細胞水膠進行相互作用的試驗單元，試驗單元的正投影落在微環境建立單元上。本發明透過腫瘤微環境模擬用晶片模擬出腫瘤微環境，供治療藥物與細胞水膠在模擬出的腫瘤微環境中進行相互作用而得到精準的測試結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A drug screening platform that simulates the tumor micro environment comprises a chip for simulating the tumor microenvironment, a chip for drug testing, and a permeable film placed between said chip for simulating the tumor microenvironment and said chip for drug testing. Said chip for simulating the tumor microenvironment includes a microenvironment establishment unit used for chemical reactions to produce acidic gas, alkaline gas and/or oxygen concentration to simulate the tumor microenvironment. Said chip for drug testing includes a testing units for interaction of therapeutic drugs with tumor cell hydrocolloids. The orthographic projection of the testing unit falls on said microenvironment establishment unit. The present invention simulates the tumor microenvironment by said chip for simulating the tumor microenvironment, allowing therapeutic drugs to interact with the tumor cell hydrocolloid in the simulated tumor microenvironment to obtain accurate test results.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:腫瘤微環境模擬用晶片</p>  
        <p type="p">11:微環境建立單元</p>  
        <p type="p">110:化學反應區</p>  
        <p type="p">2:藥物試驗用晶片</p>  
        <p type="p">21:試驗單元</p>  
        <p type="p">210:試驗區</p>  
        <p type="p">4:加熱設備</p>  
        <p type="p">41:加熱裝置</p>  
        <p type="p">42:測溫裝置</p>  
        <p type="p">43:控溫裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="134" publication-number="202613299"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613299.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613299</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135481</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>仿肺部環境的藥物測試平台</chinese-title>  
        <english-title>DRUG TESTING PLATFORM THAT SIMULATES THE LUNG ENVIRONMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">C12M3/00</main-classification>  
        <further-classification edition="200601120241125B">C12M3/06</further-classification>  
        <further-classification edition="200601120241125B">C12M1/36</further-classification>  
        <further-classification edition="200601120241125B">C12M1/00</further-classification>  
        <further-classification edition="201001120241125B">C12N5/071</further-classification>  
        <further-classification edition="200601120241125B">G01N33/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯奕廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, YI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉承賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHENG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種仿肺部環境的藥物測試平台包含微流體晶片及拉伸裝置。該微流體晶片界定出微流道結構，該微流道結構包括測試區單元、細胞分流道單元及藥物分流道單元。該拉伸裝置包括夾持結構及運動單元。該夾持結構具有固定部、與該固定部相間隔的活動部，及形成在該固定部與該活動部間的溝部，該固定部及該活動部相配合而夾持住該微流體晶片的兩相反端且使該微流體晶片的測試區單元的正投影全部重合該溝部。本發明仿肺部環境的藥物測試平台能夠建構出模擬人體肺部呼吸運動的環境，且進行一次測試就能獲得多種測試結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A drug testing platform that simulates the lung environment comprise a microfluidic chip and a stretching device. Said microfluidic chip defines a microfluidic structure. Said microfluidic structure includes a test area unit, a cell shunt unit, and a drug shunt unit. Said stretching device includes a clamping structure and a motor unit. Said clamping structure has a fixed part, a movable part spaced apart from said fixed part, and a groove formed between said fixed part and said movable part. Said fixed part and said movable part cooperate to clamp the two opposite ends of said microfluidic chip and make the orthographic projection of said test area unit of said microfluidic chip completely overlap said groove part. The present invention can construct an environment that simulates the breathing movement of human lungs, and can obtain multiple test results in one test.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:微流體晶片</p>  
        <p type="p">10:微流道結構</p>  
        <p type="p">101:測試區單元</p>  
        <p type="p">102:細胞分流道單元</p>  
        <p type="p">103:藥物分流道單元</p>  
        <p type="p">2:拉伸裝置</p>  
        <p type="p">21:夾持結構</p>  
        <p type="p">211:固定部</p>  
        <p type="p">212:活動部</p>  
        <p type="p">213:溝部</p>  
        <p type="p">22:運動單元</p>  
        <p type="p">221:驅動模組</p>  
        <p type="p">222:凸輪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="135" publication-number="202613471"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613471.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613471</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135482</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冰箱照明裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">F25D27/00</main-classification>  
        <further-classification edition="200601120241202B">F25D23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣松下電器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHITA ELECTRIC (TAIWAN) CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏群展</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許紘瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳品勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊政憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王昇皇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳煜閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種冰箱照明裝置，適用於設置在一冰箱的一內壁。該冰箱照明裝置包含一燈座、一遮光罩、一發光件及一燈罩。燈座設置於該內壁，並包括一開口。遮光罩設置於該燈座並遮蓋該開口的一部份，該遮光罩呈框形並具有一出光口。發光件設置於該燈座內並朝向該遮光罩。燈罩設置於該遮光罩並遮蓋該出光口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:冰箱照明裝置</p>  
        <p type="p">20:內壁</p>  
        <p type="p">1:燈座</p>  
        <p type="p">11:開口</p>  
        <p type="p">12:上卡勾</p>  
        <p type="p">13:下卡勾</p>  
        <p type="p">2:遮光罩</p>  
        <p type="p">3:發光件</p>  
        <p type="p">4:燈罩</p>  
        <p type="p">41:接合側緣</p>  
        <p type="p">42:接合卡勾</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="136" publication-number="202613950"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613950.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613950</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135484</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>企業貸款審核系統及方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241101B">G06Q40/03</main-classification>  
        <further-classification edition="201201120241101B">G06Q20/38</further-classification>  
        <further-classification edition="202301120241101B">G06Q10/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國信託商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CTBC BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳凱炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇賢哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫瑞黛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹承叡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種企業貸款審核系統，包含一處理單元及一電連接該處理單元的儲存單元。該處理單元用於根據一申貸請求資料獲得多筆相關於企業負責人及其關係人的待審核對象資料，並對每一待審核對象資料執行一審核處理以產生多個審核結果，以及在每一審核結果皆指示出審核通過的情況下產生並輸出一審核通過通知，以及在任一審核結果指示出審核不通過的情況下產生並輸出一審核不通過通知。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:企業貸款審核系統</p>  
        <p type="p">11:處理單元</p>  
        <p type="p">12:儲存單元</p>  
        <p type="p">DB:企業客戶資料庫</p>  
        <p type="p">20:使用端電子裝置</p>  
        <p type="p">30A:第一外部伺服端</p>  
        <p type="p">30B:第二外部伺服端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="137" publication-number="202614083"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614083.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614083</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135499</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>旋轉自動倉儲供料供電系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241105B">G16H20/13</main-classification>  
        <further-classification edition="200601120241105B">B65G1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝榮華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAO, LUNG-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝榮華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAO, LUNG-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李毓庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張朝坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種旋轉自動倉儲供料供電系統，包括：一旋轉倉儲機，其內部包括有提供動力之一動力裝置且該動力裝置透過旋軸穿置於一傳動單元中，該傳動單元與複數循環取料模組連接且使其做一循環轉動，該循環取料模組上設有內部置放至少一藥劑之複數盛裝件，且該盛裝件可移動至該旋轉倉儲機一側之取料空間，該些盛裝件於一側凸伸有至少二彈性導電件；複數供電裝置，裝設於該旋轉倉儲機內部且位於該取料空間處，該供電裝置於對應該盛裝件之該二彈性導電件處設有二導電軌道，而取料空間處之盛裝件之二彈性導電件彈性抵接於二導電軌道並使盛裝件具備供電能力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:旋轉倉儲機</p>  
        <p type="p">10:取料空間</p>  
        <p type="p">131:盛裝件</p>  
        <p type="p">1311:彈性導電件</p>  
        <p type="p">2:供電裝置</p>  
        <p type="p">21:導電軌道</p>  
        <p type="p">22:導線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="138" publication-number="202612880"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612880.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612880</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135500</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>直立式木材裁切裝置</chinese-title>  
        <english-title>WOOD CUTTING DEVICE CAPABLE OF CUTTING STANDING WOOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">B27B5/06</main-classification>  
        <further-classification edition="200601120240929B">B27B5/29</further-classification>  
        <further-classification edition="200601120240929B">B27B31/00</further-classification>  
        <further-classification edition="200601120240929B">B27C5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立虎尾科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭俊卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, CHUN CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許坤明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHU, KUEN MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王德文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種直立式木材裁切裝置，係用以切割沿一垂直方向直立之一木材，其包含有：一平台，設有一夾持組件，用以夾持該木材；一升降組件，具有一升降座及一升降單元；該升降座設於該平台下方，該升降單元連接該升降座及該平台，用以供驅動而帶動該平台沿該垂直方向上下移動；以及一裁切組件，具有一基座、一軌道及一切刀；該基座設於該平台旁，具有一定高度；該軌道設於該基座，並沿平行於該平台之一水平方向延伸；該切刀以可活動的方式設於該軌道中，用以受驅動而沿該軌道中來回移動以切割該木材。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wood cutting device capable of cutting standing wood comprises: A platform equipped with a clamping assembly for holding the wood; A lifting assembly, which includes a lifting seat and a lifting unit; the lifting seat is positioned below the platform, and the lifting unit connects the lifting seat and the platform, allowing the platform to move up and down along the vertical direction when driven; A cutting assembly that includes a base, a track, and a cutting blade; the base is located beside the platform and has a certain height. The track is installed on the base and extends horizontally, parallel to the platform. The cutting blade is movably mounted on the track and can be driven to move back and forth along the track to cut the wood.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:平台</p>  
        <p type="p">11:夾持組件</p>  
        <p type="p">12:固定夾持件</p>  
        <p type="p">13:活動夾持件</p>  
        <p type="p">20:升降組件</p>  
        <p type="p">21:升降座</p>  
        <p type="p">22:升降單元</p>  
        <p type="p">30:裁切組件</p>  
        <p type="p">31:基座</p>  
        <p type="p">32:軌道</p>  
        <p type="p">33:切刀驅動單元</p>  
        <p type="p">34:切刀</p>  
        <p type="p">40:支撐組件</p>  
        <p type="p">41:支撐架</p>  
        <p type="p">42:垂直調整單元</p>  
        <p type="p">43:水平調整單元</p>  
        <p type="p">100:木材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="139" publication-number="202612945"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612945.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612945</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135504</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輔助判定路徑風險的車輛動態穩定方法及其系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120240924B">B60W30/02</main-classification>  
        <further-classification edition="201201120240924B">B60W30/08</further-classification>  
        <further-classification edition="200601120240924B">B60W30/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人車輛研究測試中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUTOMOTIVE RESEARCH &amp; TESTING CENTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張彥翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YEN-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許騌譁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, TSUNG-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏嘉樂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, JIA-LE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種輔助判定路徑風險的車輛動態穩定方法，適用於一車輛，並藉由一處理模組來實施，且包含以下步驟：(A)獲得一相關於該車輛之車輛資訊；(B)根據該車輛資訊判定該車輛是否行駛於一高風險路徑；(C)當判定出該車輛行駛於該高風險路徑時，計算一補償轉向角度；(D)根據一預計方向盤轉角及該補償轉向角度，計算一目標轉向角度；及(E)根據該目標轉向角度獲得至少一待控制輪，及其對應的至少一控制命令。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21~29:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="140" publication-number="202612714"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612714.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612714</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135513</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金滑菇的水萃取物與植物乳桿菌LP119的組合在改善異位性皮膚炎上的用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241001B">A61K36/07</main-classification>  
        <further-classification edition="201501120241001B">A61K35/747</further-classification>  
        <further-classification edition="200601120241001B">A61P17/04</further-classification>  
        <further-classification edition="201601120241001B">A23L33/10</further-classification>  
        <further-classification edition="201601120241001B">A23L33/135</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳文良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃冠中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種包含有金滑菇(yellow strain &lt;i&gt;Flammulina velutipes&lt;/i&gt;)的水萃取物與植物乳桿菌( &lt;i&gt;Lactiplantibacillus plantarum&lt;/i&gt;) LP119的組合可被用來改善異位性皮膚炎。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="141" publication-number="202614712"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614712.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614712</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135514</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶片型導熱貼片及其製造方法</chinese-title>  
        <english-title>CHIP TYPE THERMAL CONDUCTIVE PATCH AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">H05K7/20</main-classification>  
        <further-classification edition="200601120241007B">H01L23/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國巨股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAGEO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭名宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, MING-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐瑞岡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>N/A, IYYAMPERUMAL SEERANGAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊竣凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHUN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶片型導熱貼片，包含第一與第二銅片、導熱絕緣雙面貼合膜、絕緣防焊保護層、及第一與第二端電極。第一銅片具有第一溝槽，將第一銅片分成彼此分隔之第一與第二部分。第二銅片具有第二溝槽，將第二銅片分成彼此相隔之第三與第四部分。導熱絕緣雙面貼合膜夾設在第一與第二銅片之間，而形成堆疊結構。堆疊結構具有中心軸，第一與第二溝槽分別位於中心軸之相對二側。堆疊結構包含中間部、及位於中間部之相對二側之第一與第二端部。絕緣防焊保護層包覆中間部且填入第一與第二溝槽。第一端電極包覆第一端部。第二端電極包覆第二端部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chip type thermal conductive patch includes a first copper sheet, a second copper sheet, a thermally conductive and insulating double-sided adhesion film, an insulating solder resist protective layer, a first terminal electrode, and a second terminal electrode. The first copper sheet has a first groove to divide the first copper sheet into a first portion and a second portion, which are separated from each other. The second copper sheet has a second groove to divide the second copper sheet into a third portion and a fourth portion, which are separated from each other. The thermally conductive and insulating double-sided adhesion film is sandwiched between the first copper sheet and the second copper sheet to form a stacked structure. The stacked structure has a central axis, and the first groove and the second groove are respectively located on opposite sides of the central axis. The stacked structure includes a middle portion, and a first end portion and a second end portion located on opposite sides of the middle portion. The insulating solder resist protective layer covers the middle portion and fills the first second groove and the second groove. The first terminal electrode covers the first end portion. The second terminal electrode covers the second end portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶片型導熱貼片</p>  
        <p type="p">110:第一銅片</p>  
        <p type="p">112:第一溝槽</p>  
        <p type="p">114:第一部分</p>  
        <p type="p">116:第二部分</p>  
        <p type="p">120:第二銅片</p>  
        <p type="p">122:第二溝槽</p>  
        <p type="p">124:第三部分</p>  
        <p type="p">126:第四部分</p>  
        <p type="p">130:導熱絕緣雙面貼合膜</p>  
        <p type="p">132:下表面</p>  
        <p type="p">134:上表面</p>  
        <p type="p">140:絕緣防焊保護層</p>  
        <p type="p">142:上表面</p>  
        <p type="p">150:第一端電極</p>  
        <p type="p">152:銅層</p>  
        <p type="p">152t:上表面</p>  
        <p type="p">154:鎳層</p>  
        <p type="p">156:錫層</p>  
        <p type="p">160:第二端電極</p>  
        <p type="p">162:銅層</p>  
        <p type="p">162t:上表面</p>  
        <p type="p">164:鎳層</p>  
        <p type="p">166:錫層</p>  
        <p type="p">170:堆疊結構</p>  
        <p type="p">170a:第一短邊</p>  
        <p type="p">170b:第二短邊</p>  
        <p type="p">172:中間部</p>  
        <p type="p">174:第一端部</p>  
        <p type="p">176:第二端部</p>  
        <p type="p">CA:中心軸</p>  
        <p type="p">d1:第一距離</p>  
        <p type="p">d2:第二距離</p>  
        <p type="p">t1:厚度</p>  
        <p type="p">t2:厚度</p>  
        <p type="p">t3:厚度</p>  
        <p type="p">w1:寬度</p>  
        <p type="p">w2:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="142" publication-number="202613698"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613698.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613698</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135517</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像感測模組、相機模組與電子裝置</chinese-title>  
        <english-title>IMAGE SENSING MODULE, CAMERA MODULE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241202B">G03B17/28</main-classification>  
        <further-classification edition="202101120241202B">G03B17/12</further-classification>  
        <further-classification edition="201501120241202B">G02B1/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大根光學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARGAN INDUSTRIAL OPTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳朝斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TSAO-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳子淦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TZU KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭慎吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, SHEN-WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張臨安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, LIN AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡溫祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, WEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張建邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIEN-PANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種影像感測模組，包含電路基板、光學平板元件、感光元件、金屬凸塊以及抗反射層。電路基板具有相對的上表面與下表面、連接上表面與下表面的開口表面以及位於開口表面處的開口。光學平板元件固定於上表面。感光元件設置於下表面。開口位於感光元件與光學平板元件之間。感光元件與光學平板元件之間形成空氣間隙。開口表面環繞空氣間隙。金屬凸塊設置於電路基板與感光元件之間，並電性連接電路基板與感光元件。抗反射層設置於空氣間隙處的表面上。抗反射層包含奈米脊狀結構。奈米脊狀結構朝向空氣間隙延伸，且以不規則的形式排列設置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image sensing module includes a circuit substrate, an optical flat element, a sensing element, a metal protrusion and an anti-reflection layer. The circuit substrate has an upper surface, a lower surface opposite to the upper surface, an opening surface connected to the upper and lower surfaces, and an opening located at the opening surface. The optical flat element is fixed on the upper surface. The sensing element is disposed on the lower surface. The opening is located between the sensing element and the optical flat element. The sensing element and the optical flat element form an air gap therebetween. The opening surface surrounds the air gap. The metal protrusion is disposed between and electrically connected to the circuit substrate and the sensing element. The anti-reflection layer is disposed on a surface at the air gap and includes a nano-ridge-shaped structure extending towards the air gap and irregularly arranged.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:相機模組</p>  
        <p type="p">1a:鏡頭模組</p>  
        <p type="p">1b:影像感測模組</p>  
        <p type="p">110:電路基板</p>  
        <p type="p">120:光學平板元件</p>  
        <p type="p">130:感光元件</p>  
        <p type="p">1c:保護層</p>  
        <p type="p">AG:空氣間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="143" publication-number="202612678"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612678.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612678</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135521</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鼻胃管灌食器</chinese-title>  
        <english-title>NASOGASTRIC TUBE FEEDING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">A61J15/00</main-classification>  
        <further-classification edition="200601120240929B">A61M3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞東學校財團法人亞東科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASIA EASTERN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寶如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PAO-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈品辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, PIN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡嘉慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鼻胃管灌食器，包含一容器與一灌食管。該容器係用於容置一流質食品，該灌食管具有一銜接段、一第一彎曲段、一第二彎曲段、一體內連通段與一灌食通道，該銜接段一端係可拆式地設置於該容器，該銜接段、該第一彎曲段與該第二彎曲段係連續地相接，該第一彎曲段與該第二彎曲段係相接呈S型，該體內連通段係可拆式地與該第二彎曲段相接，該體內連通段一端係連通至患者胃內，該灌食通道於該銜接段、該第一彎曲段、該第二彎曲段與該體內連通段內部相通而成。如此，該流質食品可通過該灌食管自動地流入患者胃內，以達到灌食之目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a nasogastric tube feeding device. The device contains a container and a feeding tube. The container is used to hold liquid food. The feeding tube has a connecting section, a first curved section, a second curved section, an internal communication section, and a feeding channel. One end of the connecting section is detachably provided on the container. The connecting section, the first curved section, and the second curved section are continuously connected. The first curved section and the second curved section are connected to form an S shape. The internal communication section is detachably connected to the second curved section. One end of the internal communication section is used to connect to a patient's stomach. The feeding channel is connected inside the connecting section, the first curved section, the second curved section, and the internal communication section. In this way, the liquid food can automatically flow into the patient's stomach through the feeding tube to feed the patient.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:鼻胃管灌食器</p>  
        <p type="p">20:容器</p>  
        <p type="p">21:容器本體</p>  
        <p type="p">22:排氣孔</p>  
        <p type="p">23:容器孔</p>  
        <p type="p">24:容器蓋</p>  
        <p type="p">25:銜接孔</p>  
        <p type="p">251:管接頭</p>  
        <p type="p">30:灌食管</p>  
        <p type="p">31:銜接段</p>  
        <p type="p">32:第一彎曲段</p>  
        <p type="p">33:第二彎曲段</p>  
        <p type="p">34:體內連通段</p>  
        <p type="p">35:灌食通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="144" publication-number="202614699"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614699.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614699</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135527</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>限位模組與電子裝置</chinese-title>  
        <english-title>LIMITATION MODULE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H05K5/02</main-classification>  
        <further-classification edition="200601120241105B">H05K13/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯創資通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許逸杏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYU, YI SING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種限位模組，包含一固定件、一限位件、至少一按壓件以及至少一第一復位件。限位件可移動地設置於固定件以將限位件的至少部分凸出固定件或收納於固定件內。所述至少一按壓件可移動地設置於固定件。所述至少一按壓件選擇性地按壓限位件而帶動限位件移動。所述至少一第一復位件連接限位件與固定件以將限位件復位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A limitation module includes a fixed element, a limitation element, at least one press element and at least one first return element. The limitation element is movably disposed on the fixed element such that at least part of the limitation element protrudes from or retracts into the fixed element. The at least one press element is movably disposed on the fixed element. The at least one press element selectively presses the limitation element to move the limitation element. The at least one first return element is connected to the limitation element and the fixed element to return the limitation element back to its original position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:限位模組</p>  
        <p type="p">11:固定件</p>  
        <p type="p">11a:第一固定件</p>  
        <p type="p">11b:第二固定件</p>  
        <p type="p">110:裝設孔</p>  
        <p type="p">111:第一勾部</p>  
        <p type="p">12:限位件</p>  
        <p type="p">121:滑移部</p>  
        <p type="p">122:止擋部</p>  
        <p type="p">123:受壓部</p>  
        <p type="p">1230:受壓面</p>  
        <p type="p">13:按壓件</p>  
        <p type="p">131:連接段</p>  
        <p type="p">132:凸台</p>  
        <p type="p">133:按壓臂</p>  
        <p type="p">14:第一復位件</p>  
        <p type="p">15:第二復位件</p>  
        <p type="p">AH:組裝孔</p>  
        <p type="p">ND:法線方向</p>  
        <p type="p">MD1:第一移動方向</p>  
        <p type="p">MD2:第二移動方向</p>  
        <p type="p">SP1:第一空間</p>  
        <p type="p">SP2:第二空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="145" publication-number="202612982"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612982.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612982</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135529</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多水深應用可變螺距系統及其運作方法</chinese-title>  
        <english-title>CONTROLLABLE PROPELLER PITCH SYSTEM FOR DIFFERENT WATER DEPTHS AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B63H3/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凌天海洋科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKYBOUND OCEAN INNOVATIONS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆凌吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MU, LING-JI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯天恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, TIEN-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭振華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, JEN-HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪于婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, YU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃昭仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了多水深應用可變螺距系統及其運作方法。具體來說，多水深應用可變螺距系統包含一轉子、一外蓋、複數個葉片、一齒輪、一液壓補償器、一轉軸、一齒條模組和一動力單元。動力單元提供動力給轉軸，使轉軸帶動齒條模組和齒輪進而帶動複數個葉片旋轉。液壓補償器平衡轉子內部壓力和外部水壓，使得多水深應用可變螺距系統可以在不同水壓下運作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a controllable propeller pitch system for different water depths and operating method thereof. The controllable propeller pitch system for different water depths includes a rotor, an outer cover, multiple blades, a gear wheel, a hydraulic compensator, a spindle, a gear rack module and a power unit. The power unit supplies power to the spindle, the spindle drives the gear wheel, and the gear wheel drives the gear rack module, and the gear rack module drives the multiple blades to spin. The hydraulic compensator balances inner pressure of the rotor and outer water pressure, allowing the controllable propeller pitch system to operate under different water depths.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:多水深應用可變螺距系統</p>  
        <p type="p">10:轉子</p>  
        <p type="p">20:外蓋</p>  
        <p type="p">30:葉片</p>  
        <p type="p">40:齒輪</p>  
        <p type="p">50:液壓補償器</p>  
        <p type="p">60:轉軸</p>  
        <p type="p">61:液壓缸</p>  
        <p type="p">62:第一管道</p>  
        <p type="p">63:第二管道</p>  
        <p type="p">64:第二活塞</p>  
        <p type="p">70:齒條模組</p>  
        <p type="p">80:動力單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="146" publication-number="202614249"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614249.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614249</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135535</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓測試異常警示系統及其方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241216B">H01L21/66</main-classification>  
        <further-classification edition="200601120241216B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欣銓科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林建昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶圓測試異常警示系統，包含一測試裝置及連接該測試裝置的一異常警示裝置；該測試裝置對一晶圓中的複數晶粒進行測試以取得各該晶粒經過測試得到的一量測值，並根據該些晶粒的量測值產生一量測值分布資料，以及根據該量測值分布資料判斷該些晶粒的量測值之分布是否偏移，以產生一偏移判斷結果，再根據該偏移判斷結果產生一統計分析資料；該異常警示裝置根據該統計分析資料判斷是否進行警示；當該統計分析資料中該偏移判斷結果為異常時，產生一警示訊息以發出警示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:晶圓測試異常警示系統</p>  
        <p type="p">10:測試裝置</p>  
        <p type="p">11:探針卡</p>  
        <p type="p">12:探針組</p>  
        <p type="p">12A:第一探針組</p>  
        <p type="p">12B:第二探針組</p>  
        <p type="p">12C:第三探針組</p>  
        <p type="p">12D:第四探針組</p>  
        <p type="p">20:異常警示裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="147" publication-number="202614627"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614627.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614627</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135537</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊傳收方法以及通訊裝置</chinese-title>  
        <english-title>INFORMATION TRANSCEIVING METHOD AND COMMUNICATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">H04Q11/00</main-classification>  
        <further-classification edition="201101120250102B">H04N7/00</further-classification>  
        <further-classification edition="200601120250102B">H04N7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃躍興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YUEH-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種資訊傳收方法，其使用在具有一傳送裝置以及複數接收裝置的一資訊傳收系統上，並包含有：由傳送裝置收集複數需求，其中該等需求至少包括各接收裝置所對應之一輸出能力；由傳送裝置根據該等需求決定一傳收規格，其中傳收規格至少優於該等接收裝置中之一第一接收裝置所對應之輸出能力；以及由傳送裝置根據傳收規格將資訊傳送至該等接收裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An information transceiving method is implemented by an information transceiving system including a transmitting device and multiple receiving devices, and includes: collecting multiple requirements by the transmitting device, wherein the multiple requirements at least include an output capability corresponding to each of the multiple receiving devices; determining a transceiving specification according to the multiple requirements by the transmitting device, wherein the transceiving specification is at least better than an output capability corresponding to a first receiving device among the multiple receiving devices; and transmitting information to the multiple receiving devices according to the transceiving specification by the transmitting device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S202,S204,S206,S208,S210:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="148" publication-number="202614090"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614090.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614090</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135543</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>結合患病資料與天氣資料預測病情之裝置及方法</chinese-title>  
        <english-title>DEVICE AND METHOD FOR INTEGRATING DISEASE DATA AND WEATHER DATA TO PREDICT ILLNESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241001B">G16H80/00</main-classification>  
        <further-classification edition="201801120241001B">G16H50/00</further-classification>  
        <further-classification edition="201801120241001B">G16H10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁瑛心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YING HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種結合患病資料與天氣資料預測病情之裝置及方法，其透過依據罹患疾病分類病患醫療記錄後，由包含被選擇之罹患疾病之病患醫療記錄、與包含被選擇之罹患疾病之病患醫療記錄對應之健康狀況資料及天氣狀況資料中分別取出與罹患疾病對應之多個預測模型對應的特徵資料，並依據與各預測模型對應之特徵資料分別訓練各個預測模型，及依據目標健康資料與當期天氣資料使用各個預測模型產生預期罹患疾病及患病預測結果之技術手段，可以綜合天氣條件預測病患疾病，並達成提高疾病預測準確性與診斷輔助效果的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device and a method for integrating disease data and weather data to predict illness are provided. By classifying patient medical records according to disease, extracting feature data corresponding to multiple prediction models corresponding to the selected disease from the patient medical records documenting the selected disease, health status data and the weather conditions data corresponding to the patient medical records documenting the selected disease, training the prediction models separately based on the feature data corresponding to each of the prediction model, and using the prediction models to generate expected disease and illness prediction results based on target health data and current weather data, the device and the method can predicting patient diseases based on comprehensive weather conditions, and can achieve the effect of improving disease prediction accuracy and diagnostic auxiliary effect.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟310:載入病患醫療資料、病患健康資料及歷史天氣資料，病患醫療資料包含記錄罹患疾病之病患醫療記錄，病患健康資料包含對應病患醫療記錄之健康狀況資料，歷史天氣資料包含對應病患醫療記錄之天氣狀況資料，天氣狀況資料與既有病患之生活區域對應</p>  
        <p type="p">步驟320:依據罹患疾病分類病患醫療記錄</p>  
        <p type="p">步驟330:逐一選擇罹患疾病，並由包含被選擇之罹患疾病之病患醫療記錄、及與包含被選擇之罹患疾病之病患醫療記錄對應之健康狀況資料與天氣狀況資料中分別取出與各個預測模型對應之特徵資料</p>  
        <p type="p">步驟340:分別依據與各預測模型對應之特徵資料訓練各預測模型</p>  
        <p type="p">步驟350:載入目標健康資料及與目標病患之生活區域對應之當期天氣資料</p>  
        <p type="p">步驟360:依據目標健康資料與當期天氣資料使用預測模型產生預期罹患疾病及對應之患病預測結果</p>  
        <p type="p">步驟370:依據預期罹患疾病、目標健康資料、當期天氣資料產生治療建議</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="149" publication-number="202612762"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612762.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612762</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135544</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>依據練習狀況與生理狀況產生評量內容之裝置及方法</chinese-title>  
        <english-title>DEVICE AND METHOD FOR GENERATING EVALUATION CONTENT BASED ON PRACTICE STATUS AND PHYSIOLOGICAL STATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250122B">A63B24/00</main-classification>  
        <further-classification edition="200601120250122B">A63B23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁瑛心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YING HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種依據練習狀況與生理狀況產生評量內容之裝置及方法，其透過在演練模式時讀取演練評量資料，並依據使用者在技能演示場景之手部動作與身體姿態的技能實踐訊息由演練評量資料中取得對應的互動接續資料，以使使用者在技能演示場景中實現專業技能的演練，並依據技能實踐訊息與使用者的生理狀態資料選擇是否建立評量資料，而在評量模式讀取與評量資料對應的演練評量資料以提供使用者在技能演示場景中實現專業技能的演練，並依據使用者在技能演示場景之手部動作與身體姿態的技能實踐訊息產生評量分數之技術手段，可以精確地偵測使用者動作和生理狀況，並達成透過實境技術提供有效評量機制的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for generating evaluation content based on practice status and physiological status and a method thereof are provided. By reading practice evaluation data in a practice mode, obtaining interactive connection data from the practice evaluation data based on skill practice information o indicating user's hand movements and user’s body postures in skill demonstration scene for the user can perform the skill demonstration realize the practice of professional skills in the scene, choosing whether to create evaluation data based on the skill practice information and physiological state data of the user, reading the practice evaluation data corresponding to the evaluation data in an evaluation mode to provide the user with skills in the skill realize the practice of professional skills in the demonstration scene, and generating an evaluation score based on the user's hand movements and user’s body postures in the skill demonstration scene, the device and the method can accurately detect user movements and physiological conditions, and can achieve the effect of interaction and measurement through reality technology.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟301:實境伺服器提供穿戴裝置連接</p>  
        <p type="p">步驟310:實境伺服器載入與專業技能對應之技能實境資料，並由技能實境資料中讀出場景資料及與互動模式對應之演練評量資料</p>  
        <p type="p">步驟320:穿戴裝置依據實境伺服器所傳送之場景資料顯示技能演示場景</p>  
        <p type="p">步驟330:穿戴裝置依據穿戴裝置之使用者在技能演示場景中之手部動作及身體姿態產生技能實踐訊息，並傳送技能實踐訊息至實境伺服器</p>  
        <p type="p">步驟340:穿戴裝置在互動模式為演練模式時取得使用者之生理狀態資料並傳送生理狀態資料至實境伺服器</p>  
        <p type="p">步驟350:實境伺服器由演練評量資料中取得與技能實踐訊息對應之互動接續資料，並傳送被取出之互動接續資料至穿戴裝置</p>  
        <p type="p">步驟360:穿戴裝置依據互動接續資料在技能演示場景中顯示與使用者之手部訊號及身體姿態對應的實境內容</p>  
        <p type="p">步驟370:實境伺服器在互動模式為演練模式且判斷技能實踐訊息或生理狀態資料滿足評量條件時，在評量題庫中記錄評量資料為與技能實踐訊息對應之互動接續資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="150" publication-number="202614533"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614533.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614533</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135545</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智慧型電表的離線傳輸系統及其方法</chinese-title>  
        <english-title>OFFLINE TRANSMISSION SYSTEM FOR SMART METER AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241219B">H02J13/00</main-classification>  
        <further-classification edition="200601120241219B">G01R22/00</further-classification>  
        <further-classification edition="202401120241219B">G06Q50/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張英彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YING PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種智慧型電表的離線傳輸系統及其方法，透過傳感器持續感測電力使用量並傳輸至遠端伺服器，當智慧型電表偵測到網路斷線時，自動啟動離線傳輸模式，使智慧型電表儲存電力使用量，當遠端伺服器偵測到智慧型電表離線時，提示抄表員前往智慧型電表設置處，並且傳送相應此智慧型電表的金鑰訊息至抄表員的行動裝置，以便通過金鑰訊息建立智慧型電表與行動裝置的非接觸式傳輸通道，進而離線獲得電力使用量，用以達成提高智慧型電表的可用性之技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An offline transmission system for smart meter and method thereof is disclosed. By continuously measuring power usage through sensors and transmitting the data to a remote server, when the smart meter detects a network disconnection, it automatically activates offline transmission mode, causing the smart meter to store power usage data. When the remote server detects that the smart meter is offline, it prompts the meter reader to the smart meter's location and sends the corresponding key information for the smart meter to the meter reader's mobile device. This allows for the establishment of a non-contact transmission channel between the smart meter and the mobile device via the key information, enabling offline retrieval of power usage data. The mechanism is help to improve the availability of the smart meter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:遠端伺服器</p>  
        <p type="p">120:行動裝置</p>  
        <p type="p">130:智慧型電表</p>  
        <p type="p">131a~131n:傳感器</p>  
        <p type="p">132:離線傳輸元件</p>  
        <p type="p">133:儲存元件</p>  
        <p type="p">134:硬體處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="151" publication-number="202613986"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613986.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613986</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135546</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具嚇阻功能的居家防護系統及其方法</chinese-title>  
        <english-title>HOME PROTECTION SYSTEM WITH DETERRENT FUNCTIONALITY AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G08B13/19</main-classification>  
        <further-classification edition="200601120241202B">G08B13/194</further-classification>  
        <further-classification edition="200601120241202B">G08B15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張英彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YING PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具嚇阻功能的居家防護系統及其方法，透過整合智慧型燈具、智慧型音箱、智慧型開關及智慧型電視形成居家防護機制，持續通過智慧型電視的攝像裝置及運動感應器偵測是否存在異常活動，若是，則驅動智慧型燈具發出閃爍的暗紅或暗綠光線、驅動智慧型音箱持續播放恐怖音效、驅動智慧型電視播放恐怖影像，以及驅動智慧型開關以隨機頻率啟閉傳統燈具，進而共同營造恐怖氣氛，用以達成提高居家防護的嚇阻性之技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A home protection system with deterrent functionality and method thereof is disclosed. By integrating a smart TV, smart lighting, smart switches, and smart speakers to form a home protection mechanism, continuously detecting abnormal activity through the smart TV's camera and motion sensors, and if detected, activating the smart lighting to emit flashing dark red or dark green light, driving the smart speakers to continuously play frightening sound effects, driving the smart TV to display scary images, and driving the smart switches to randomly turn conventional lights on and off, thereby creating a frightening atmosphere. The mechanism is help to improve the deterrent effect of home security.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:智慧型燈具</p>  
        <p type="p">120:智慧型音箱</p>  
        <p type="p">130:智慧型開關</p>  
        <p type="p">140:智慧型電視</p>  
        <p type="p">141:儲存元件</p>  
        <p type="p">142:顯示器</p>  
        <p type="p">143:攝像裝置</p>  
        <p type="p">144:運動傳感器</p>  
        <p type="p">145:硬體處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="152" publication-number="202612929"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612929.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612929</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135547</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於殘餘電量的充電樁篩選與導航系統及其方法</chinese-title>  
        <english-title>CHARGING STATION FILTER AND NAVIGATION SYSTEM BASED ON RESIDUAL POWER AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250102B">B60L53/60</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張光閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KUANG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於殘餘電量的充電樁篩選與導航系統及其方法，當殘餘電量值小於等於充電閾值時，電動車輛提供車輛資訊、殘餘電量值、車輛位置資訊以及充電規格資訊至充電路徑規劃伺服器，充電路徑規劃伺服器依據殘餘電量值以及每單位電量的行駛里程資訊計算出充電行駛里程值，依據車輛位置資訊以及充電行駛里程值計算出篩選範圍，再依據充電規格資訊篩選出充電樁位置資訊位於篩選範圍內的正選充電樁資訊組以及/或是備選充電樁資訊組，提供給電動車輛選擇後再反饋充電行車路徑與導航，藉此可以達成基於殘餘電量的充電樁篩選與導航的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A charging station filter and navigation system based on residual power and a method thereof are provided. Vehicle information, residual power value, vehicle location information and charging specification information are provided to charging path planning server from electric vehicle. Charging mileage value is calculated according to residual power value and mileage information per unit of electricity by charging path planning server. Filter range is calculated according to vehicle location information and charging mileage value by charging path planning server. Primary charging station and/or secondary charging station are filtered according to charging specification information and charging station location information within filter range. Primary charging station and/or secondary charging station are provided and selected to electric vehicle and feedback charging driving route and navigation. Therefore, the efficiency of charging station filter and navigation based on residual power may be achieved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:動車輛</p>  
        <p type="p">11:電池管理模組</p>  
        <p type="p">12:車輛位置模組</p>  
        <p type="p">13:傳輸模組</p>  
        <p type="p">14:顯示模組</p>  
        <p type="p">15:選定模組</p>  
        <p type="p">16:導航模組</p>  
        <p type="p">20:充電路徑規劃伺服器</p>  
        <p type="p">21:充電樁資料庫</p>  
        <p type="p">22:接收模組</p>  
        <p type="p">23:充電行駛里程計算模組</p>  
        <p type="p">24:充電樁篩選模組</p>  
        <p type="p">25:路徑規劃模組</p>  
        <p type="p">26:傳送模組</p>  
        <p type="p">30:充電樁管理伺服器</p>  
        <p type="p">50:道路救援伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="153" publication-number="202613514"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613514.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613514</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135548</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>載運車輛的輪胎磨耗即時評估系統及其方法</chinese-title>  
        <english-title>TIRE WEAR ASSESSMENT IMMEDIATELY SYSTEM FOR TRANSPORT VEHICLE AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">G01M17/02</main-classification>  
        <further-classification edition="200601120241105B">G01N3/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張光閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KUANG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種載運車輛的輪胎磨耗即時評估系統及其方法，載運車輛由紅外線檢測裝置取得對應輪胎的輪胎表面胎紋厚度資訊，再透過行車電腦提供車輛重量、輪胎表面胎紋厚度資訊以及行車路徑至輪胎磨耗評估伺服器，將行車路徑拆解為多個路段，依據車輛重量查詢出每一個路段對應的磨耗率以及計算次數，依照路段的順序將輪胎表面胎紋厚度資訊、磨耗率以及計算次數計算直到磨耗厚度小於等於警示閾值，再生成行駛風險警示提供至載運車輛以由車用多媒體裝置加以顯示，藉此可以達成提供載運車輛的輪胎磨耗即時評估的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tire wear assessment immediately system for transport vehicle and a method thereof are provided. Tire surface tread thickness information of tire obtained by transport vehicle through infrared detection device. Vehicle weight, tire tread thickness information and driving route are provided to tire wear assessment server from transport vehicle through vehicle mounted computer. Multiple road sections are dismantled by tire wear assessment server and wear rate and calculation time which are correspondence with each of road sections are inquired according to vehicle weight. Tire surface tread thickness information, wear rate and calculation time are calculated according to order of road sections until wear thickness is less than or equal to warning threshold. Driving risk warning is generated and provided to transport vehicle and driving risk warning is displayed by on-board computer. Therefore, the efficiency of providing tire wear assessment immediately for transport vehicle may be achieved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:載運車輛</p>  
        <p type="p">11:紅外線檢測裝置</p>  
        <p type="p">12:車用多媒體裝置</p>  
        <p type="p">13:行車電腦</p>  
        <p type="p">20:輪胎磨耗評估伺服器</p>  
        <p type="p">21:磨耗率資料庫</p>  
        <p type="p">22:路段資料庫</p>  
        <p type="p">23:接收模組</p>  
        <p type="p">24:路段拆解模組</p>  
        <p type="p">25:查詢模組</p>  
        <p type="p">26:輪胎磨耗計算模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="154" publication-number="202613992"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613992.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613992</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135549</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>判斷可通行車輛數以控制行車管制號誌之裝置及方法</chinese-title>  
        <english-title>DEVICE AND METHOD FOR DETERMINING NUMBER OF PASSABLE VEHICLES TO CONTROL TRAFFIC CONTROL SIGNALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240930B">G08G1/00</main-classification>  
        <further-classification edition="200601120240930B">G08G1/09</further-classification>  
        <further-classification edition="200601120240930B">G08G1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭錫勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, SHYI SHIUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種判斷可通行車輛數以控制行車管制號誌之裝置及方法，其透過判斷當前路口的下一個行車管制號誌為紅燈時，取得介於當前路口與下一個行車管制號誌間之各行駛車道的剩餘長度、尚未通過當前路口且在可通行之車流方向上的行進車輛數與在不可通行之車流方向上的停等車輛數，並依據各行駛車道的剩餘長度、行進車輛數、停等車輛計算可通行車輛數，及依據可通行車輛數決定綠燈燈號之綠燈時長，並依據綠燈時長控制第一行車管制號誌顯示綠燈之時間之技術手段，可以依據路口實際車流動態調整顯示燈號，並達成避免有車輛堵在路口導致它向在綠燈時無法通行的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for determining a number of passable vehicles to control traffic control signals and a method thereof are provided. By obtaining remaining length of each driving lane between a current intersection and a next traffic control signal, a moving number of vehicles that have not passed the current intersection and are traveling in a direction of passable traffic flow, and a waiting number of vehicles that have not passed the current intersection and are in a direction of impassable traffic flow when determining the next traffic control signal at the current intersection to be a red light, calculating the passing number of vehicles that can pass based on the remaining length of each driving lane, the moving number of vehicles and the waiting number of vehicles, determining time length of green light based on the passing number of vehicles, and controlling the time when the first traffic control signal displays green light based on the time length, the device and the method can adjust the display traffic lights based on the actual traffic flow at intersection dynamically, and can achieve the effect of avoiding vehicles blocking intersection causing other vehicles in different traffic directions to be unable to pass same intersection when the traffic light turns green.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟301:在第一行車管制號誌管制不可通行之第一車流方向可通行前，取得第二行車管制號誌之燈號訊息</p>  
        <p type="p">步驟310:當燈號訊息為紅燈時，判斷在車輛行進方向上且介於當前路口與第二行車管制號誌間之行駛車道之剩餘長度</p>  
        <p type="p">步驟320:依據尚未通過當前路口之行進車輛之行駛車道及車輛速度，判斷將通過當前路口行駛進入車輛行進方向之行進車輛數</p>  
        <p type="p">步驟330:依據尚未通過當前路口之停等車輛之行駛車道預測通過當前路口且行駛進入車輛行進方向之停等車輛</p>  
        <p type="p">步驟340:依據剩餘長度、行進車輛數、行進車輛之車輛長度、停等車輛、停等車輛之車輛長度計算可通行車輛數</p>  
        <p type="p">步驟380:依據可通行車輛數決定第一行車管制號誌管制第一車流方向上與車輛行進方向對應之綠燈燈號之綠燈時長</p>  
        <p type="p">步驟390:依據綠燈時長控制第一行車管制號誌顯示與第一車流方向對應之綠燈之時間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="155" publication-number="202612942"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612942.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612942</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135550</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>依據駕駛人視角顯示駕駛人盲點影像之裝置及方法</chinese-title>  
        <english-title>DEVICE AND METHOD FOR DISPLAYING DRIVER'S BLIND SPOT IMAGES BASED ON DRIVER'S PERSPECTIVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241105B">B60R1/20</main-classification>  
        <further-classification edition="201201120241105B">B60W30/08</further-classification>  
        <further-classification edition="200601120241105B">B60W40/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭錫勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, SHYI SHIUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種依據駕駛人視角顯示駕駛人盲點影像之裝置及方法，其透過分析駕駛人頭部影像以產生駕駛人之頭部資料與眼球位置並依據頭部姿態與眼球位置判斷駕駛人之駕駛視角後，依據車輛三維模型與駕駛視角判斷駕駛人之駕駛盲點，並依據車輛三維模型由車輛外部影像取得與駕駛盲點對應的盲點影像之技術手段，可以顯示因為車輛結構造成之盲點位置的車輛外部影像，並可以達成提供更完整之盲點偵測的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for displaying driver's blind spot images based on driver's perspective and a method thereof are provided. By analyzing a head image of a driver to generate a head posture and an eye position of the driver, determining a driving perspective of the driver based on the head posture and the eye position, determining a blind spots of the driver based on a vehicle's three-dimensional model and the driving perspective, and obtaining blind spot images corresponding to the blind spots from vehicle's external images based on the vehicle's three-dimensional model, the device and the method can display vehicle’s external images in driver’s blind spots caused by vehicle structure, and can achieve the effect of providing more complete blind spot detection.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟301:使用第一影像擷取單元持續擷取駕駛人之頭部影像</p>  
        <p type="p">步驟310:分析頭部影像以產生車輛之駕駛人之頭部姿態及眼球位置</p>  
        <p type="p">步驟320:依據頭部姿態與眼球位置判斷駕駛人之駕駛視角</p>  
        <p type="p">步驟330:依據車輛之車輛三維模型與駕駛視角判斷駕駛人之駕駛盲點</p>  
        <p type="p">步驟340:持續使用第二影像擷取單元擷取車輛外部影像</p>  
        <p type="p">步驟350:依據車輛三維模型由車輛外部影像取得與駕駛盲點對應之盲點影像</p>  
        <p type="p">步驟360:於與駕駛盲點對應之盲點顯示器顯示盲點影像</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="156" publication-number="202613005"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613005.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613005</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135551</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>載運車輛的地磅重量即時稽核系統及其方法</chinese-title>  
        <english-title>TRANSPORT VEHICLE WEIGHT AUDIT IMMEDIATELY SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B65G43/02</main-classification>  
        <further-classification edition="200601120241105B">B65G67/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施保重</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, PAO CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種載運車輛的地磅重量即時稽核系統及其方法，由檢測器檢測得到對應懸吊系統的位移檢測結果或是電壓檢測結果，再透過行車電腦提供車輛識別資訊以及多個位移檢測結果或是多個電壓檢測結果至稽核伺服器，地磅站裝置提供車輛識別資訊以及地磅載重重量值至稽核伺服器，稽核伺服器依據位移檢測結果或是電壓檢測結果計算出預估載重重量值，當地磅載重重量值與預估載重重量值的差值大於等於警示閾值且地磅載重重量值大於預估載重重量值時，稽核伺服器生成警示資訊並分別提供至載運車輛以及地磅站裝置，藉此可以達成提供載運車輛的地磅重量即時稽核的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transport vehicle weight audit immediately system and a method thereof are provided. Displacement detection result or voltage detection result of a suspension system of a transport vehicle is detected by a detector which is correspondence with the suspension system. Vehicle identification information and multiple displacement detection results or multiple voltage detection results are provided to an audit server through an on-board computer of the transport vehicle. The vehicle identification information and a weighbridge loading weight value are provided to the audit server from a weighbridge device. An estimated loading weight value is calculated according to multiple displacement detection results or multiple voltage detection results by the audit server. Warning information is generated by the audit server and the warning information is provided to the transport vehicle and the weighbridge device when difference between the weighbridge loading weight value and the estimated loading weight value is greater than or equal to the warning threshold and the weighbridge loading weight value is greater than the estimated loading weight value. Therefore, the efficiency of auditing transport vehicle weighbridge weight immediately may be achieved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:載運車輛</p>  
        <p type="p">11:檢測器</p>  
        <p type="p">12:行車電腦</p>  
        <p type="p">13:車用多媒體裝置</p>  
        <p type="p">20:地磅站裝置</p>  
        <p type="p">30:稽核伺服器</p>  
        <p type="p">31:車重計算模組</p>  
        <p type="p">32:警示模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="157" publication-number="202613994"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613994.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613994</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135552</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>交通罰單的證據圖像查驗系統及其方法</chinese-title>  
        <english-title>EVIDENCE IMAGE INSPECTION SYSTEM FOR TRAFFIC TICKET AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241223B">G08G1/017</main-classification>  
        <further-classification edition="202201120241223B">G06V30/14</further-classification>  
        <further-classification edition="202201120241223B">G06V20/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施保重</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, PAO CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種交通罰單的證據圖像查驗系統及其方法，當交通罰單中證據圖片被識別出車牌資訊且至少一被識別出的車牌資訊與其他的車牌資訊不一致時，交通罰單查驗伺服器生成證據圖片錯誤訊息，當交通罰單中至少一證據圖片無法被識別出車牌資訊且至少一被識別出的車輛特徵與其他被識別出的車輛特徵不一致時，交通罰單查驗伺服器生成證據圖片錯誤訊息，交通罰單查驗伺服器提供證據圖片錯誤訊息至交通裁罰伺服器並加以顯示與警示，藉此可以達成提供對交通罰單的證據圖像查驗的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An evidence image inspection system for traffic ticket and a method thereof are provided. An evidence picture error message is generated by a traffic ticket verification server when license plate information is identified from evidence pictures in a traffic ticket and at least one of the identified license plate information is inconsistent with other license plate information. The evidence picture error message is generated by the traffic ticket verification server when at least one evidence picture cannot be identified with license plate information and at least one identified vehicle feature is inconsistent with other identified vehicle features. The evidence picture error message is provided to a traffic penalty server from the traffic ticket verification server and the evidence picture error message is displayed and alerted by the traffic penalty server. Therefore, the efficiency of providing evidence image inspection for traffic ticket may be achieved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:交通裁罰伺服器</p>  
        <p type="p">20:交通罰單查驗伺服器</p>  
        <p type="p">21:車牌識別模組</p>  
        <p type="p">22:特徵識別模組</p>  
        <p type="p">23:可交換影像檔案格式識別模組</p>  
        <p type="p">24:車型識別模組</p>  
        <p type="p">40:監理伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="158" publication-number="202613796"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613796.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613796</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135553</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>避免過度使用的手寫控制系統及其方法</chinese-title>  
        <english-title>HANDWRITING CONTROL SYSTEM FOR AVOIDING OVERUSE AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241219B">G06F3/0487</main-classification>  
        <further-classification edition="200601120241219B">G06F3/041</further-classification>  
        <further-classification edition="201301120241219B">G06F3/038</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊錦華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, 　CHIN　HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種避免過度使用的手寫控制系統及其方法，透過觸控顯示器感應手寫輸入，並且接收來自手寫筆的使用狀態、運動狀態、禁能信號和致能信號，當觸控顯示器接收到禁能信號時，禁能感應器以停止感應手寫輸入，同時顯示保健提示訊息以要求使用者進行手腕運動，直到接收到致能訊號為止，當接收到使用狀態時，顯示接收到的使用狀態，其中，手寫筆持續通過傳感器感測使用狀態及運動狀態，以便比對是否與休息條件及手腕運動特徵相匹配，進而根據比對結果產生禁能信號及致能信號以傳送至觸控顯示器，用以達成提高手寫效率及降低手寫疲勞之技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A handwriting control system for avoiding overuse and method thereof is disclosed. By sensing handwritten input through a touch display and receiving a usage status, a motion status, a disable signal, and an enable signal from a stylus, when the touch display receives the disable signal, it disables a plurality of sensors to stop sensing handwritten input and displays a health tip message prompting the user to perform wrist exercises until the enable signal is received. Upon receiving the usage status, the display shows the received usage status. The stylus continuously monitors the usage status and the motion status through the sensors to determine if they match rest conditions and wrist motion characteristics. Based on this comparison, the disable and enable signals are generated and sent to the touch display. The mechanism is help to improve handwriting efficiency and to reduce handwriting fatigue.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:觸控顯示器</p>  
        <p type="p">120:手寫筆</p>  
        <p type="p">121a~121n:傳感器</p>  
        <p type="p">122:儲存元件</p>  
        <p type="p">123:硬體處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="159" publication-number="202613473"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613473.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613473</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135554</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>整合人工智慧的智慧型冷藏系統及其方法</chinese-title>  
        <english-title>INTELLIGENT REFRIGERATION SYSTEM INTEGRATED WITH ARTIFICIAL INTELLIGENCE AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240925B">F25D29/00</main-classification>  
        <further-classification edition="200601120240925B">F25D25/00</further-classification>  
        <further-classification edition="200601120240925B">G06F3/01</further-classification>  
        <further-classification edition="200601120240925B">G06F3/147</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊錦華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, 　CHIN　HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種整合人工智慧的智慧型冷藏系統及其方法，透過感測器持續監測冷藏環境及冷藏物，並且搭配人工智慧模型預測冷藏需求的變化，以便驅動溫度控制器主動進行溫度控制，同時根據冷藏物的種類及放置時間生成擺放建議訊息，並且將此擺放建議訊息傳送至行動裝置進行提示，進而有效利用冷藏空間且避免冷藏物過期，用以達成提高冷藏的能源利用性及食物保鮮性之技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An intelligent refrigeration system integrated with artificial intelligence and method thereof is disclosed. By continuously monitoring the refrigeration environment and stored items using sensors, and employing artificial intelligence models to forecast changes in refrigeration requirements, the system enables the temperature controller to actively adjust temperature settings. Additionally, based on the type of stored items and their placement duration, the system generates optimized placement recommendations, which are then transmitted to a mobile device for user notification. This approach enhances the efficient use of refrigeration space and mitigates the risk of stored items expiring. The mechanism is help to improve the energy efficiency and the preservation of food.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:行動裝置</p>  
        <p type="p">120:智慧型冷藏裝置</p>  
        <p type="p">121:第一感測元件</p>  
        <p type="p">122:第二感測元件</p>  
        <p type="p">123:第三感測元件</p>  
        <p type="p">124:電腦可讀儲存媒體</p>  
        <p type="p">125:預訓練單元</p>  
        <p type="p">126:硬體處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="160" publication-number="202613988"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613988.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613988</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135555</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>適用於地下車道的多階段淹水警示系統及其方法</chinese-title>  
        <english-title>MULTI-STAGE FLOODING WARNING SYSTEM FOR UNDERGROUND LANE AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G08B21/10</main-classification>  
        <further-classification edition="200601120241202B">G08B21/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種適用於地下車道的多階段淹水警示系統及其方法，由設置在地下車道相對低點處的水位檢測器依據不同水位觸發與提供不同的警示資訊，淹水警示裝置依據不同的警示資訊提供對應的淹水起始警示訊息、淹水通行注意警示訊息或是淹水禁行注意警示訊息以警示駕駛者，且透過圖資伺服器提供路段淹水警示資訊或是路段淹水禁行警示資訊，使得車輛的多媒體裝置可即時變更所規劃的行車路徑並進行導航，藉此可以達成提供適用於地下車道的多階段淹水警示的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-stage flooding warning system for underground lane and a method thereof are provided. Different warning messages are triggered and provided according to different water levels detected by water level detector which is set at a relatively low point in the underground lane. Flooding start warning message, flooding traffic warning message or flooding prohibition warning message is provided by a flood warning device according to different warning messages. Flooding traffic warning message or flooding prohibition warning message is provided through an image server such that planned driving route is changed and navigated immediately by multimedia device of vehicle. Therefore, the efficiency of providing multi-stage flooding warning for underground lane may be achieved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:水位檢測器</p>  
        <p type="p">20:淹水警示裝置</p>  
        <p type="p">21:訊息推播模組</p>  
        <p type="p">22:資訊生成模組</p>  
        <p type="p">30:圖資伺服器</p>  
        <p type="p">40:車輛</p>  
        <p type="p">41:多媒體裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="161" publication-number="202613930"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613930.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613930</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135556</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中古車輛的價值估算系統及其方法</chinese-title>  
        <english-title>VALUE ESTIMATION SYSTEM FOR USED VEHICLE AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241101B">G06Q30/0283</main-classification>  
        <further-classification edition="202301120241101B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種中古車輛的價值估算系統及其方法，消費者裝置提供廠牌資料、車型資料、車牌資料、現況里程以及車輛照片至價值估算伺服器，以自監理伺服器取得車輛行照資料以及車輛監理資料，自權威車訊伺服器取得權威車訊資料以查詢出權威車價，自車輛認證伺服器取得車輛認證資料，透過使用價值估算模型的人工智慧得到對應的里程權重值、車輛認證權重值以及外觀權重值再結合權威車價以計算得到中古車輛預估價值，藉此可以達成降低中古車交易判定車輛狀況主觀性並提供中古車輛價值估算的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A value estimation system for used vehicle and a method thereof are provided. Make information, model information, license plate information, current situation mileage and vehicle photos are provided to a value estimation server from a consumer device. Vehicle license information and vehicle supervision information are obtained by value estimation server from a supervision server. Authoritative vehicle information is obtained by value estimation server from an authoritative vehicle server to query an authoritative value. Vehicle certification information is obtained by value estimation server from a vehicle certification server. A mileage weight value, a vehicle certification weight value and an appearance weight value are analyzed by artificial intelligence to use value estimation model. An estimated value of used vehicle is calculated according to the authoritative value, the mileage weight value, the vehicle certification weight value and the appearance weight value. Therefore, the efficiency of reducing subjectivity of determined vehicle condition at used vehicle trading and provided used vehicle value estimate may be achieved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:消費者裝置</p>  
        <p type="p">20:監理伺服器</p>  
        <p type="p">30:權威車訊伺服器</p>  
        <p type="p">40:車輛認證伺服器</p>  
        <p type="p">50:價值估算伺服器</p>  
        <p type="p">51:車輛行照模組</p>  
        <p type="p">52:權威車訊模組</p>  
        <p type="p">53:權威車價查詢模組</p>  
        <p type="p">54:認證資料模組</p>  
        <p type="p">55:人工智慧價值估算模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="162" publication-number="202614036"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614036.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614036</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135557</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>依據語音訊號顯示對應手語之裝置及方法</chinese-title>  
        <english-title>DEVICE AND METHOD FOR DISPLAYING SIGN LANGUAGE BASED ON CORRESPONDING VOICE SIGNAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">G10L15/26</main-classification>  
        <further-classification edition="201301120250102B">G10L21/06</further-classification>  
        <further-classification edition="200601120250102B">G09B21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞有華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, YU HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種依據語音訊號顯示對應手語之裝置及方法，其透過轉換語音訊息為語言文字資料並由語言文字資料中分析出多個詞彙後，將手語字詞資料轉換為符合目標手語系統之語法結構之排列順序的手語符號，並依據手語符號及其排列順序使用3D動畫引擎產生以虛擬人物表達之手語影像的技術手段，可以透過虛擬人物表達手語，並達成減少手語翻譯之成本的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for displaying a sign language based on corresponding voice signal and a method thereof are provided. By converting a voice signal into text data, analyzing multiple vocabulary words from the text data to generate sign word data, converting the sign word data into symbols of sign language that match to an order of grammatical structure of a target sign language system, using a 3D animation engine to generate sign language videos expressed as a virtual character based on the symbols and the order, the system and the method can express sign language through virtual character, and can achieve the effect of reducing cost of sign language translation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟310:取得語音訊息</p>  
        <p type="p">步驟320:轉換語音訊息為語言文字資料</p>  
        <p type="p">步驟330:分析語言文字資料之語法以產生語言分析結果，語言分析結果包含詞彙及對應之語意</p>  
        <p type="p">步驟350:依據語言分析結果進行轉換作業以轉換語言文字資料為符合手語系統之手語字詞資料，手語字詞資料包含符合語法結構之排列順序之被選詞彙</p>  
        <p type="p">步驟360:取得手語字詞資料中各詞彙之手勢訊息與表情訊息</p>  
        <p type="p">步驟370:載入虛擬人物之人物模型</p>  
        <p type="p">步驟380:依據手語字詞資料中之各詞彙之排列順序及手勢訊息與表情訊息使用3D動畫引擎及動畫控制技術與動作過渡技術組合產生實現虛擬人物之手勢變化與表情控制之手語影像</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="163" publication-number="202613979"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613979.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613979</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135558</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分析視訊中臉部影像以建立搜尋特徵之裝置及方法</chinese-title>  
        <english-title>DEVICE AND METHOD FOR ANALYZING FACIAL IMAGES IN VIDEO STREAM TO CREATE SEARCH FEATURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120240924B">G06V40/16</main-classification>  
        <further-classification edition="202201120240924B">G06V10/40</further-classification>  
        <further-classification edition="200601120240924B">H04N7/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞有華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, YU HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鼎鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種分析視訊中臉部影像以建立搜尋特徵之裝置及方法，其透過由視訊通話時所接收的影音通話訊號中擷取出聯絡人的人臉影像特徵，並比對人臉影像特徵與聯絡人之臉部影像特徵的相似度，當相似度低於門檻值時依據人臉影像特徵產生聯絡人臉部的特徵描述資料，並提供依據特徵描述資料搜尋聯絡人之技術手段，可以透過人臉的特徵描述資料搜尋聯絡人，並達成提高聯絡人名單之查找效率的技術功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for analyzing facial images in a video stream to create search features and a method thereof are provided. By extracting facial image features of a contact from a video stream received during a video call, comparing a similarity of the facial image features of the contact and saved facial image features, generating a feature description word for a face of the contact based on the facial image features of the contact when the similarity is lower than a threshold, and providing search for contacts based on the feature description word, the device and the method can search contacts through feature description word of face, and can achieve the effect of improving efficiency of searching contacts in contact list.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟301:儲存包含臉部影像特徵之聯絡人影像訊息</p>  
        <p type="p">步驟310:與聯絡人進行視訊通話時，接收影音通話訊號</p>  
        <p type="p">步驟320:由影音通話訊號中擷取出人臉影像</p>  
        <p type="p">步驟330:由人臉影像中擷取出人臉影像特徵</p>  
        <p type="p">步驟340:比對人臉影像特徵與臉部影像特徵以產生人臉相似度</p>  
        <p type="p">步驟350:判斷人臉相似度低於相似門檻值時，依據人臉影像特徵產生特徵描述資料</p>  
        <p type="p">步驟370:記錄特徵描述資料到聯絡人影像訊息中</p>  
        <p type="p">步驟380:提供以特徵描述資料搜尋聯絡人</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="164" publication-number="202613781"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613781.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613781</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135566</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多感官人機互動系統及多感官人機互動方法</chinese-title>  
        <english-title>MULTI-SENSORY HUMAN-COMPUTER INTERACTION SYSTEM AND MULTI-SENSORY HUMAN-COMPUTER INTERACTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">G06F3/01</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭義錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭義錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多感官人機互動系統包含互動裝置、複數個感測器以及伺服器。伺服器耦接於複數個感測器，並用以控制互動裝置。多感官人機互動系統執行以下運作：複數個感測器各者分別自現實環境接收複數個感測訊號；伺服器基於複數個感測訊號，產生對應於複數個感測訊號各者之事件資料，其中複數個事件資料表示現實環境之情況；伺服器基於複數個事件資料，產生對應於情況之複數個多感官關聯性資料；伺服器基於複數個多感官關聯性資料，決定感官反饋結果；以及互動裝置基於感官反饋結果，產生互動訊息。互動訊息用以與使用者互動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-sensory human-computer interaction system includes an interactive device, a plurality of sensors and a server. The server is coupled to a plurality of sensors and is configured to control the interactive device. The multi-sensory human-computer interaction system performs the following operations: each of the plurality of sensors receives a plurality of sensing signals from a real environment; the server generates a plurality of event data corresponding to each of the plurality of sensing signals according to the plurality of sensing signals, wherein a plurality of event data represents the situation of the real environment; the server generates a plurality of multi-sensory correlation data corresponding to the situation according to the plurality of event data; the server determines a sensory feedback result according to the plurality of multi-sensory correlation data; and the interactive device is configured to generate interactive messages according to sensory feedback result. The interactive messages are configured to interact with users .</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:多感官人機互動系統</p>  
        <p type="p">110:感測器</p>  
        <p type="p">120:伺服器</p>  
        <p type="p">121:記憶體</p>  
        <p type="p">122:處理器</p>  
        <p type="p">130:神經網路模型</p>  
        <p type="p">140:互動裝置</p>  
        <p type="p">141:感官輸出裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="165" publication-number="202612931"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612931.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612931</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135567</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具智能管理之長效高功率電池保護系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241007B">B60L58/10</main-classification>  
        <further-classification edition="200601120241007B">H02H7/18</further-classification>  
        <further-classification edition="201901120241007B">B60L58/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇國信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇大宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李訓逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇國信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇大宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李訓逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳吉隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關一種具智能管理之長效高功率電池保護系統，其包括電池、電芯、突波吸收電芯及電池管理系統（BMS），於電池管理系統（BMS）中設有副控制系統、低功率開關元件、高容量繼電器及電池電芯電壓平衡系統，通過副控制系統中之負載偵測及預充控制電路偵測車輛啟動產生之大電流負載時，低功率開關元件除先中斷連接電池管理系統（BMS）之高負載，並即時啟動高容量繼電器，使大電流可由高容量繼電器通過，以提供車輛負載設備如引擎啟動馬達於啟動引擎時所需之大電流，有效控制車輛啟動時瞬間產生大電流的路徑，並通過電池電芯電壓平衡系統有效控制電池之每一電芯間電壓差，以達保護電池電芯及電池管理系統（BMS）中其他電路並可大幅增加電池壽命之目的，同時通過於電池外部並聯一突波吸收電芯，能有效消除供電軌上瞬間電壓突波不造成昂貴的車輛電控單元（ECUs）損壞同步達保護車輛元件之目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電池</p>  
        <p type="p">11:電芯</p>  
        <p type="p">12:充放之高功率電流</p>  
        <p type="p">13:低功率負載電流</p>  
        <p type="p">14:突波吸收電芯</p>  
        <p type="p">2:電池管理系統(BMS)</p>  
        <p type="p">21:副控制系統</p>  
        <p type="p">211:過載、過充、過放及過溫控制電路</p>  
        <p type="p">212:負載偵測及預充控制電路</p>  
        <p type="p">213:緊急啟動控制電路</p>  
        <p type="p">214:強制開關</p>  
        <p type="p">22:低功率開關元件</p>  
        <p type="p">23:高容量繼電器</p>  
        <p type="p">24:電池電芯電壓平衡系統</p>  
        <p type="p">3:車輛負載</p>  
        <p type="p">31:發電機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="166" publication-number="202613947"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613947.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613947</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135570</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線上查調系統和線上查調方法</chinese-title>  
        <english-title>ONLINE INQUIRY SYSTEM AND ONLINE INQUIRY METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241223B">G06Q40/02</main-classification>  
        <further-classification edition="201201120241223B">G06Q40/06</further-classification>  
        <further-classification edition="202301120241223B">G06Q10/0633</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兆豐國際商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEGA INTERNATIONAL COMMERCIAL BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉家羽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIA-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種線上查調系統，包含：資料庫伺服器、集中作業伺服器、以及區塊鏈節點裝置。資料庫伺服器配置以接收來自多個分行上傳的多個帳務資料檔案。集中作業伺服器與資料庫伺服器通訊連接。集中作業伺服器包含查調要求接收單元和檔案調閱單元。查調要求接收單元配置以接收來自查調單位的對於一帳務檔案的查調要求。檔案調閱單元配置以從資料庫伺服器調閱帳務檔案的備份電子檔。區塊鏈節點裝置與集中作業伺服器通訊連接，區塊鏈節點裝置在一區塊鏈網路中，並且區塊鏈網路包含查調單位的節點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An online inquiry system includes a database server, a centralized operation server, and a blockchain node device. The database server is configured to receive multiple accounting information files uploaded from branches. The centralized operation server communicates with the database server. The centralized operation server includes an inquiry request receiving unit and a file retrieve unit. The inquiry request receiving unit is configured to receive the inquiry request for an account file from an inquiry unit. The file retrieve unit is configured to retrieve a backup electronic file of the account file from the database server. The blockchain node device communicates with the centralized operation server, and the blockchain node device is in a blockchain network, and the blockchain network includes the node of the inquiry unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:線上查調系統</p>  
        <p type="p">100:資料庫伺服器</p>  
        <p type="p">110:第一分行伺服器</p>  
        <p type="p">120:第二分行伺服器</p>  
        <p type="p">130:第三分行伺服器</p>  
        <p type="p">20:查調單位</p>  
        <p type="p">200:集中作業伺服器</p>  
        <p type="p">30:查調平台伺服器</p>  
        <p type="p">300:計算裝置</p>  
        <p type="p">310:審核單元</p>  
        <p type="p">40:區塊鏈網路</p>  
        <p type="p">410、412、414、416、418、420:區塊鏈節點裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="167" publication-number="202614797"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614797.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614797</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135572</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高電子遷移率電晶體的半導體結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE OF HIGH ELECTRON MOBILITY TRANSISTOR AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/47</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商海珀電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIPER SEMICONDUCTOR INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林伯融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PO-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳啟桐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖和信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種高電子遷移率電晶體的半導體結構及其製造方法，其中該方法包括下列步驟：於通道層上沉積阻障層；於阻障層上沉積摻雜控制層；於腔體內預供氣(preflow)含有金屬摻雜之第一摻雜來源氣體一預設時間；預設時間結束後，於摻雜控制層上沉積摻雜穩定層，摻雜穩定層與摻雜控制層皆具有金屬摻雜，其中金屬摻雜於該摻雜穩定層具有介於 1E19cm &lt;sup&gt;-3&lt;/sup&gt;至3E19cm &lt;sup&gt;-3&lt;/sup&gt;之間的第一摻雜濃度，金屬摻雜於摻雜控制層  具有介於 5E17cm &lt;sup&gt;-3&lt;/sup&gt;至1E19cm &lt;sup&gt;-3&lt;/sup&gt;之間的第二摻雜濃度；及，於摻雜穩定層上沉積閘極金屬以形成高電子遷移率電晶體的半導體結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure of a high electron mobility transistor and a manufacturing method thereof, wherein the method includes the following steps: depositing a barrier layer on the channel layer; depositing a doping control layer on the barrier layer; pre-supplying gas in the cavity (preflow) the first doping source gas containing metal doping for a preset time; after the preset time, a doping stable layer is deposited on the doping control layer, and both the doping stable layer and the doping control layer have metal doping , wherein the metal doped in the doping stable layer has a first doping concentration between 1E19cm &lt;sup&gt;-3&lt;/sup&gt;and 3E19cm &lt;sup&gt;-3&lt;/sup&gt;, and the metal doped in the doping control layer has a first doping concentration between 5E17cm &lt;sup&gt;-3&lt;/sup&gt;and 1E19cm &lt;sup&gt;-3&lt;/sup&gt;.A second doping concentration between; and, depositing a gate metal on the doping stabilizing layer to form a semiconductor structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟S1至步驟S5</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="168" publication-number="202613861"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613861.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613861</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135575</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多站點驗證授權之資料交換系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR MULTI-SITE AUTHENTICATION-AUTHORIZATION AND DATA EXCHANGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241223B">G06F21/62</main-classification>  
        <further-classification edition="202201120241223B">H04L9/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國泰金融控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CATHAY FINANCIAL HOLDING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江崑成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, KUN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖銘宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, MING-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何美瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容是關於一種多站點驗證授權之資料交換系統及方法，所述系統包含一主伺服器和複數個服務裝置，其中各該服務裝置設有服務端伺服器及驗證閘道用以控制所述服務端伺服器之訪問。所述主伺服器設有一註冊資料庫，其儲存有各該服務裝置的索引資料，且該些索引資料同步於各個驗證閘道中。因此，本發明透過主伺服器與各該驗證閘道調控所建立的交換平台，能夠以任一服務裝置作為中介，再以轉導機制向目標服務裝置取得特定資料，並蒐集提供與用戶端，使得資料交換的驗證過程更佳便利。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein is a system and method for data exchange. The system includes a main server and multiple service devices, each of which is equipped with a service server and a gateway for authentication and authorization. The gateway is configured to control access to the service server. The main server is equipped with a registration database that stores index data for each service device, which is synchronized and stored in the gateways. Therefore, the present invention provides an exchange platform regulated by the main server and the gateways for authentication and authorization, enabling any service device to act as an intermediary to retrieve specific data from a target service device through a relay mechanism and then collect and provide the data to a user end, thereby making the authentication and authorization process for data exchange more convenient.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:多站點驗證授權之資料交換系統</p>  
        <p type="p">110:主伺服器</p>  
        <p type="p">112:註冊資料庫</p>  
        <p type="p">114:權限管理運算模組</p>  
        <p type="p">120:第一服務裝置</p>  
        <p type="p">122:第一驗證閘道</p>  
        <p type="p">124:第一服務端伺服器</p>  
        <p type="p">130:第二服務裝置</p>  
        <p type="p">132:第二驗證閘道</p>  
        <p type="p">134:第二服務端伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="169" publication-number="202614649"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614649.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614649</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135578</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於零信任架構的訪問控制方法及裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251105B">H04W12/03</main-classification>  
        <further-classification edition="202101120251105B">H04W12/0433</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>誠雲科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CREATING CLOUD TECHNOLOGY CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>項嵩仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIANG, SUNG-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝延昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAO, YEN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡佳銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIA-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳竣煜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董　璟和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG, KENG-WO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MO</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭家佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOU, CHIA-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許力仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, LI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁玉芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基於零信任的存取控制方法與裝置。系統包含用戶、設備和管理伺服器，每個設備部署身份鑑別、設備鑑別及存取閘道管控等模組。各設備透過存取閘道管控模組互連，並與管理伺服器建立通訊。設備可取得及產生身份與設備安全金鑰，並產生金鑰憑證向管理伺服器註冊。當設備發出存取請求時，會將金鑰憑證一同傳送給目標設備。目標設備再將此憑證送至管理伺服器驗證。若驗證通過，則允許存取；否則拒絕。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">10:用戶</p>  
        <p type="p">20:設備</p>  
        <p type="p">21:身份鑑別代理模組</p>  
        <p type="p">22:設備鑑別代理模組</p>  
        <p type="p">23:存取閘道管控模組</p>  
        <p type="p">30:管理伺服器</p>  
        <p type="p">40:身份鑑別伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="170" publication-number="202613589"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613589.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613589</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135582</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷達訊號處理方法及雷達偵測裝置</chinese-title>  
        <english-title>RADAR SIGNAL PROCESSING METHOD AND RADAR DETECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">G01S7/02</main-classification>  
        <further-classification edition="200601120250102B">G01S13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯創資通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YAO-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳胤語</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YIN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭凱仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, KAI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒宗穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, TSUNG-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖正農</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHENG-NUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種雷達訊號處理方法及雷達偵測裝置。所述方法包括：對複數通道訊號執行一範圍處理以獲得一矩陣，其中矩陣依據一分隔頻率點區分為一第一部位及一第二部位；根據第一部位獲得一第一資訊與相應的一第一角度；根據第二部位獲得一第二資訊與相應的一第二角度；及根據相匹配的第一角度與第二角度所分別對應的各第一資訊與各第二資訊，獲得對應於一標的之複數資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A radar signal processing method and a radar detection device are provided. The method includes: performing a range processing on multiple channel signals to obtain a matrix, wherein the matrix is divided into a first part and a second part based on a separation frequency point; obtaining first information and a corresponding first angle based on the first part; obtaining second information and a corresponding second angle based on the second part; and obtaining a plurality of pieces of information corresponding to a target based on the respective first information and second information corresponding to the matched first angle and second angle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S910~S940:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="171" publication-number="202612879"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612879.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612879</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135583</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>食材切斷刀具的洗淨用治具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250228B">B26D7/18</main-classification>  
        <further-classification edition="200601120250228B">B26D3/16</further-classification>  
        <further-classification edition="200601120250228B">B26D3/24</further-classification>  
        <further-classification edition="200601120250228B">B26D1/02</further-classification>  
        <further-classification edition="200601120250228B">B26D7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鈴茂器工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUMO MACHINERY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木美奈子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, MINAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河野哲也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWANO, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種食材切斷刀具的洗淨用治具，係能夠安裝至切斷架並且於洗淨切斷刀具時使用，該切斷架係能夠以自由裝卸的方式裝配至棒狀食材切斷裝置的殼體。其中具有：防護板，係以對向於切斷刀具的刀具尖部之方式將洗淨用治具安裝至切斷架的刀具框架體，並且洗淨用治具會覆蓋切斷刀具；磁鐵，係設置於防護板並將防護板固定至切斷架；以及多個貫通孔，係形成於防護板，並且將洗淨液引導至切斷刀具。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:切斷架</p>  
        <p type="p">12a,12b:縱框架片</p>  
        <p type="p">13a,13b:橫框架片</p>  
        <p type="p">14:刀具框架體</p>  
        <p type="p">15a,15b,29a,29b:把手</p>  
        <p type="p">16a,16b,25a,25b,30a:開口部</p>  
        <p type="p">17:切斷刀具</p>  
        <p type="p">18:刀具尖部</p>  
        <p type="p">20:洗淨用治具</p>  
        <p type="p">21:防護板</p>  
        <p type="p">22:外周凸緣</p>  
        <p type="p">23b:縱凸緣</p>  
        <p type="p">24a:橫凸緣</p>  
        <p type="p">26b:區隔框架</p>  
        <p type="p">31a,31b:磁鐵</p>  
        <p type="p">32:貫通孔</p>  
        <p type="p">35:引導孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="172" publication-number="202612854"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612854.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612854</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135586</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>扭力扳手</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240926B">B25B23/14</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寶達精業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林添龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TIEN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳洲平</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種扭力扳手，其係包含有一管體，且該管體一端係可轉動地連接有一握把，其中，該管體係設有至少一定位槽，而該握把係為塑膠材質並對應該定位槽設有至少一金屬材質之加強件，該加強件係穿設有一定位孔，該定位孔內係容置有一定位件，同時該握把外圍更可滑動地套設有一控制滑套，該控制滑套可迫使該定位件之一部分凸出該定位孔並卡掣於該定位槽，此時若使用者轉動該握把，將可藉由該加強件確保該定位孔不被破壞，而具有防呆效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:管體</p>  
        <p type="p">12:第二端</p>  
        <p type="p">13:定位槽</p>  
        <p type="p">50:握把</p>  
        <p type="p">51:握持段</p>  
        <p type="p">52:設置段</p>  
        <p type="p">53:定位部</p>  
        <p type="p">54:加強件</p>  
        <p type="p">541:定位孔</p>  
        <p type="p">55:擋止部</p>  
        <p type="p">56:限位部</p>  
        <p type="p">60:鎖定單元</p>  
        <p type="p">61:定位件</p>  
        <p type="p">62:控制滑套</p>  
        <p type="p">63:彈簧</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="173" publication-number="202614486"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614486.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614486</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135587</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多頻天線</chinese-title>  
        <english-title>MULTI-FREQUENCY ANTENNA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120241224B">H01Q5/30</main-classification>  
        <further-classification edition="200601120241224B">H01Q1/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁寶電腦工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMPAL ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖彥傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, YAN-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案關於一種多頻天線，包含介質基板、輻射元件、連接部及接地系統部。輻射元件設置於介質基板上，且包含第一輻射部及第二輻射部。第一輻射部架構於產生第一頻段前端之無線訊號收發。第二輻射部架構於產生第二頻段之無線訊號收發。連接部設置於介質基板上，且包含饋入部及短路部。饋入部連接於第一輻射部及第二輻射部之間，架構於饋入訊號。短路部連接饋入部及接地系統部之間，且包含第二段部。第二段部架構於產生第三頻段之無線訊號收發。第一槽縫形成於輻射元件與第二段部之間。接地系統部設置於介質基板上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-frequency antenna is disclosed and includes a substrate, a radiating element, a connection potion and a grounding system portion. The radiating element is disposed on the substrate, and includes a first radiating portion and a second radiating portion. The first radiating portion is configured to receive wireless signal of a front end of a first frequency band. The second radiating portion is configured to receive wireless signal of a second frequency band. The connection portion is disposed on the substrate, and includes a feed-in portion and short-circuit portion. The feed-in portion is in connection between the first radiating portion and the second radiating portion, and configured to import signal. The short-circuit portion is in connection between the feed-in portion and the grounding system portion, and includes a second segment. The second segment is configured to receive wireless signal of a third frequency band. A first gap is formed between the radiating element and the second segment. The grounding system portion is disposed on the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:多頻天線</p>  
        <p type="p">1:介質基板</p>  
        <p type="p">2:輻射元件</p>  
        <p type="p">2a:第一輻射部長邊</p>  
        <p type="p">2b:第一輻射部側邊</p>  
        <p type="p">2c:連接側邊</p>  
        <p type="p">2d:第二輻射部側邊</p>  
        <p type="p">21:第一輻射部</p>  
        <p type="p">22:第二輻射部</p>  
        <p type="p">3:連接部</p>  
        <p type="p">31:饋入部</p>  
        <p type="p">32:短路部</p>  
        <p type="p">321:第一段部</p>  
        <p type="p">322:第二段部</p>  
        <p type="p">323:第三段部</p>  
        <p type="p">4:接地系統部</p>  
        <p type="p">41:接地部</p>  
        <p type="p">42:延伸部</p>  
        <p type="p">421:第一延伸部</p>  
        <p type="p">422:第二延伸部</p>  
        <p type="p">5:第一寄生調整部</p>  
        <p type="p">51:第四段部</p>  
        <p type="p">52:第五段部</p>  
        <p type="p">52a:第五段部側邊</p>  
        <p type="p">53:第六段部</p>  
        <p type="p">53a:第六段部側邊</p>  
        <p type="p">54:第七段部</p>  
        <p type="p">54a:第七段部側邊</p>  
        <p type="p">6:第二寄生調整部</p>  
        <p type="p">61:第八段部</p>  
        <p type="p">61a:第八段部側邊</p>  
        <p type="p">62:第九段部</p>  
        <p type="p">62a:第九段部側邊</p>  
        <p type="p">S1:第一槽縫</p>  
        <p type="p">S2:第二槽縫</p>  
        <p type="p">S3:第三槽縫</p>  
        <p type="p">S4:第四槽縫</p>  
        <p type="p">S5:第五槽縫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="174" publication-number="202614407"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614407.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614407</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135588</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板構造</chinese-title>  
        <english-title>SUBSTRATE ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">H01L23/48</main-classification>  
        <further-classification edition="200601120241104B">H01L23/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方略電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANELSEMI CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳顯德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIEN-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱珍元</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種基板構造，包括無機基板、與多個導電材。無機基板具有複數通孔；其中一通孔之直徑小於無機基板之厚度；各通孔之孔壁具有一預定義壓應力。該些導電材分別設於該些通孔；其中一導電材之至少一部分接觸所對應之該通孔之該孔壁、且該導電材之熱膨脹係數大於無機基板之熱膨脹係數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate assembly includes an inorganic substrate and a plurality of conductive materials. The inorganic substrate includes a plurality of through holes; each of the through holes defines a hole wall provided with a pre-determined compressive stress. A diameter of one of the through holes is less than a thickness of the inorganic substrate. The plurality of conductive materials are respectively arranged in the through holes, at least a portion of one of conductive materials is in contact with the hole wall of the corresponding one of the through holes, and a coefficient of thermal expansion (CTE) of the conductive materials is greater than a coefficient of thermal expansion of the inorganic substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板構造</p>  
        <p type="p">10:無機基板</p>  
        <p type="p">11:強化表面</p>  
        <p type="p">12(121~123):通孔</p>  
        <p type="p">122r:斜角</p>  
        <p type="p">12w(121w~123w):孔壁</p>  
        <p type="p">T1:厚度</p>  
        <p type="p">g1~g3:間距</p>  
        <p type="p">d1~d2:直徑</p>  
        <p type="p">20(21~23):導電材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="175" publication-number="202612763"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612763.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612763</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135590</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兒童體適能教學之模組化教具</chinese-title>  
        <english-title>A MODULAR TEACHING AIDS FOR CHILDREN’S PHYSICAL FITNESS TEACHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241031B">A63B69/00</main-classification>  
        <further-classification edition="200601120241031B">A63B21/00</further-classification>  
        <further-classification edition="200601120241031B">A63B71/00</further-classification>  
        <further-classification edition="200601120241031B">A63B23/00</further-classification>  
        <further-classification edition="200601120241031B">G09B9/00</further-classification>  
        <further-classification edition="200601120241031B">G09B5/06</further-classification>  
        <further-classification edition="200601120241031B">G09B19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余嘉齡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許永達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種兒童體適能教學之模組化教具，包含有；至少一基底板，為一板體，頂面設置有卡接部；所述之基底板之前、後端分別設置有一組接部；二斜坡板，頂面一側沿寬度方向設置有一斜坡，該二斜坡板之寬度與該基底板之端面寬度相當，該二斜坡板未設置斜坡之側設置有一連接部，該二斜坡板分別以該連接部與所述之基底板之前、後端組接部相嵌接 ；至少一功用單元，底部相對於卡接部設置有容接部，使所述之容接部可以與卡接部相互套接；該功用單元之頂面設置有一功能部，可凸出於該基底板之頂面，透過變化該功能單元即可調整場地的形狀的布置，可以快速且便利的增加該場地的變化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a modular teaching aid for children's physical fitness teaching, which includes: at least one base plate, which is a plate body, and the top surface is provided with clamping portions at intervals; the front and rear ends of the base plate are respectively provided connecting portions; two slope plates, one side of the top surface is provided with a slope along the width direction, and the side of the two slope plates that is not provided with a slope is provided with a connecting portion. The two slope plates are respectively engaged with the front and rear end assembly portions of the base plate through the connecting portion; at least one functional unit has a receiving portion at the bottom relative to the clamping portions, so that the receiving portion can of functional unit is socketed with each other; the top surface of the functional unit is provided with a functional part that can protrude from the top surface of the base plate. By changing the functional unit, the layout of the shape of the venue can be adjusted quickly and conveniently.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:基底板</p>  
        <p type="p">21:頂面</p>  
        <p type="p">22:卡接部</p>  
        <p type="p">221:凸塊</p>  
        <p type="p">23:組接部</p>  
        <p type="p">231:楔形塊</p>  
        <p type="p">30:斜坡板</p>  
        <p type="p">31:斜坡</p>  
        <p type="p">32:連接部</p>  
        <p type="p">321:楔形塊</p>  
        <p type="p">40:功用單元</p>  
        <p type="p">41:前斜塊</p>  
        <p type="p">411:容接部</p>  
        <p type="p">412:前斜部</p>  
        <p type="p">413:凹部</p>  
        <p type="p">42:後斜塊</p>  
        <p type="p">421:容接部</p>  
        <p type="p">422:後斜部</p>  
        <p type="p">423:凸部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="176" publication-number="202612764"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612764.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612764</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135591</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>體適能教學之模組化教具</chinese-title>  
        <english-title>A MODULAR TEACHING AID FOR PHYSICAL FITNESS TEACHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241031B">A63B69/00</main-classification>  
        <further-classification edition="200601120241031B">A63B21/00</further-classification>  
        <further-classification edition="200601120241031B">A63B71/00</further-classification>  
        <further-classification edition="200601120241031B">A63B23/00</further-classification>  
        <further-classification edition="200601120241031B">G09B9/00</further-classification>  
        <further-classification edition="200601120241031B">G09B5/06</further-classification>  
        <further-classification edition="200601120241031B">G09B19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余嘉齡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU,JIA-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許永達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU,YUNG-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種體適能教學之模組化教具，包含有；一基底板，局部位置設置有一功能區；所述之基底板之前、后兩端分別設置有一組接部，該功能區之頂面具有一功能部凸出於該基底板之頂面；二斜坡板，頂面一側沿寬度方向設置有一斜坡，該二斜坡板相對該二組接部設置有一連接部，該二斜坡板分別以該連接部與該基底板之二組接部相嵌接；透過變化該基底板的功能區，即可使場地產生不同的變化，其變化快速，並且不需變化整組教具，切換組裝容易。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a modular teaching aid for physical fitness teaching, which includes: a base plate with a partial functional area; the front and rear ends of the two sides of the base plate are respectively provide a connecting portion, and a functional part of the functional area protrudes from the base plate; two slope plates, one side of the top surface is provided with a slope along the width direction. A connecting portion is provided on the side of the two slope plates. The two slope plates are respectively connected with the two assembly portions of the base plate through the connecting portion; by changing the functional area of ​​the base plate can cause different changes in the venue, and the changes are rapid, and there is no need to change the entire set of teaching aids, and it is easy to switch and assemble.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:模組化教具</p>  
        <p type="p">20:基底板</p>  
        <p type="p">21:平面區</p>  
        <p type="p">211:組接部</p>  
        <p type="p">22:功能區</p>  
        <p type="p">221:組接部</p>  
        <p type="p">222:功能部</p>  
        <p type="p">223:波浪塊</p>  
        <p type="p">2231:凸起</p>  
        <p type="p">30:斜坡板</p>  
        <p type="p">31:斜坡</p>  
        <p type="p">32:連接部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="177" publication-number="202612848"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612848.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612848</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135594</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高速自動含油面生成方法</chinese-title>  
        <english-title>METHOD FOR RAPIDLY AND AUTOMATICALLY FORMING OIL-CONTAINING SURFACE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">B24C1/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立虎尾科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃學良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSUEH-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈金鐘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, CHIN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹炳熾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAN, BING-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡奇璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIR-JANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, HSIN-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡文修</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種高速自動含油面生成方法，其係以噴射的方式將金屬微粒對一研磨過的金屬加工表面進行高速擊打，藉由金屬微粒與加工表面的相互撞擊，而使加工表面得形成一定深度的油坑，進而對該加工表面形成一含油面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method for rapidly and automatically forming oil-containing surface. The method has an act of spraying metal micro particles onto a worked surface which is well grounded for hitting the worked surface at high speed. With the bumping between the metal micro particles and the worked surface, multiple oil cavities are defined in the worked surface. Accordingly, an oil-containing surface is formed on the worked surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:加工表面</p>  
        <p type="p">12:油坑</p>  
        <p type="p">20:金屬微粒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="178" publication-number="202612806"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612806.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612806</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135595</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具平整化且節能的太陽能模組回收分離工序固定方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241028B">B09B3/30</main-classification>  
        <further-classification edition="202201320241028B">B09B101/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崑鼎綠能環保股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ECOVE ENVIRONMENT CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊傑銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIEH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邢忠彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHING, CHUNG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昇芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHENG-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林呈叡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG-RUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹師維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, CATHERINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪建皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, JIAN-HAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具平整化且節能的太陽能模組回收分離工序固定方法，包括：設置步驟，設置銑削艙，銑削艙的底部設置有開口；放置步驟，將太陽能模組放置在該開口上方；注水步驟，在銑削艙內注水至浸沒太陽能模組，並使太陽能模組由於水壓而平整服貼在銑削艙底部的上表面並密封該開口；銑削步驟，利用銑削機在水面液位下對太陽能模組的元件層進行銑削以將其去除；排水步驟，將銑削艙內的水排出；以及取出步驟，將銑削後剩餘的玻璃面板取出。由於在銑削過程中注水，利用水壓的特性固定太陽能模組並提升其平整度，從而提高銑削均勻性，並且由於銑削過程在水中進行，可以避免粉塵或碎片的飛濺並減少銑削產生的噪音，另一方面，由於省略了真空泵、抽氣泵及排氣過濾設備的設置，因此大幅降低這些設備的運作成本及噪音。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:銑削艙</p>  
        <p type="p">2:太陽能模組</p>  
        <p type="p">3:過濾器</p>  
        <p type="p">11:開口</p>  
        <p type="p">12:浮筒</p>  
        <p type="p">13:銑削機</p>  
        <p type="p">21:背板</p>  
        <p type="p">21a:背板碎片</p>  
        <p type="p">22:電池層</p>  
        <p type="p">22a:電池層碎片</p>  
        <p type="p">23:玻璃面板</p>  
        <p type="p">31:過濾進水管線</p>  
        <p type="p">32:過濾排水管線</p>  
        <p type="p">a’:升高的水面液位</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="179" publication-number="202614022"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614022.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614022</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135602</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>像素驅動電路及微型顯示面板</chinese-title>  
        <english-title>PIXEL DRIVING CIRCUIT AND MICRO DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120240927B">G09G3/3233</main-classification>  
        <further-classification edition="201601120240927B">G09G3/3266</further-classification>  
        <further-classification edition="201601120240927B">G09G3/3275</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錼創顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PLAYNITRIDE DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅政祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHENG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎　宏琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, HOONG-LIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡書慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳嘉敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種像素驅動電路及微型顯示面板，係主要於各像素驅動電路單元之至少一子像素電路單元內設置一修復開關，並以一控制單元控制該修復開關作動，當該至少一個子像素的一微型發光二極體於非驅動期間內仍有電流流過而發亮(呈亮點狀態)，該控制單元即控制該修復開關作動，中斷該微型發光二極體的電流，令該至少一子像素的微型發光二極體不在非驅動期間內發亮，以修復亮點問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a pixel driving circuit and micro display panel. The pixel driving circuit has at least one sub-pixel circuit unit, a repairing switch and a controlling unit. The controlling unit controls an operation of the repairing switch. When a current passes through a micro-LED of the at least one sub-pixel during non-driving period and the micro-LED emits light (also known as light spot), the controlling unit controls the repairing switch to disconnect the current passing through the micro-LED. Therefore, the micro-LED of the at least one sub-pixel does not emit light during non-driving period and light spot issue is solved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:掃描驅動電路</p>  
        <p type="p">30:資料驅動電路</p>  
        <p type="p">40:像素驅動電路單元</p>  
        <p type="p">41:子像素電路單元</p>  
        <p type="p">50:修復開關</p>  
        <p type="p">60:控制單元</p>  
        <p type="p">71:像素</p>  
        <p type="p">72:子像素</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="180" publication-number="202614023"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614023.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614023</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135605</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板</chinese-title>  
        <english-title>DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120240925B">G09G3/3233</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀚宇彩晶股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANNSTAR DISPLAY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅祈恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, QI-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉政諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHENG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高翎誌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, LING-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張少謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHAO-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱靖雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, JING-YA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳映蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種顯示面板，包括雙閘線陣列基板，其包括基板、多條閘線、多條資料線及多個畫素結構。閘線、資料線與畫素結構設置在基板上。畫素結構各自包括薄膜電晶體及畫素電極。薄膜電晶體的閘極、源極與汲極分別耦接閘線中的一者、資料線中的一者與畫素電極。各個畫素結構的源極與汲極均沿著同一方向依序設置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a display panel including a dual gate array substrate, which includes a substrate, a plurality of gate lines, a plurality of data lines, and a plurality of pixel structures. The gate lines, the data lines, and the pixel structures are disposed on the substrate. Each of the pixel structures includes a thin-film transistor and a pixel electrode. A gate, a source and a drain of the thin-film transistor are respectively coupled to one of the gate lines, one of the data lines and the pixel electrode. The source and the drain of each of the pixel structures are arranged along the same direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:薄膜電晶體</p>  
        <p type="p">161,162:虛設電極</p>  
        <p type="p">2:雙閘線陣列基板</p>  
        <p type="p">BE:下電極</p>  
        <p type="p">C(q),C(q+1),C(q+2),C(q+3):畫素結構行</p>  
        <p type="p">CE1:連接電極</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">DE:汲極</p>  
        <p type="p">DGL:雙閘線</p>  
        <p type="p">DL,DL1,DL2:資料線</p>  
        <p type="p">DP2:顯示面板</p>  
        <p type="p">GE:閘極</p>  
        <p type="p">GL,GL1,GL2:閘線</p>  
        <p type="p">ND:法線方向</p>  
        <p type="p">OP1:開口</p>  
        <p type="p">PX(p,q),PX(p,q+1),PX(p,q+2),PX(p,q+3),PX(p+1,q),PX(p+1,q+1),PX(p+1,q+2),PX(p+1,q+3):畫素結構</p>  
        <p type="p">R(p),R(p+1):畫素結構列</p>  
        <p type="p">SE:源極</p>  
        <p type="p">SEM:半導體層</p>  
        <p type="p">Sub1:第一基板</p>  
        <p type="p">TE:上電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="181" publication-number="202613559"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613559.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613559</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135610</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>容納多懸臂式探針的同軸針結構</chinese-title>  
        <english-title>COAXIAL NEEDLE STRUCTURE FOR ACCOMMODATING MULTIPLE PROBES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240925B">G01R1/04</main-classification>  
        <further-classification edition="200601120240925B">G01R1/067</further-classification>  
        <further-classification edition="202001120240925B">G01R31/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商芯戈控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XINGR HOLDINGS PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOU, CHOON LEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HO YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程文顥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴遠霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, YUAN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃鴻俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HUNG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種容納多探針的同軸針結構，包括管狀結構、複數個探針以及至少一固定結構。管狀結構具有貫穿其中的中空部分，複數個探針穿設於中空部分，至少一固定結構設置於一部分的中空部分。至少一固定結構具有複數個穿孔，複數個探針分別穿設於複數個穿孔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A coaxial needle structure for accommodating multiple of probes includes a tubular structure, a plurality of probes and at least one fixed structure. The tubular structure has a hollow portion penetrating through it. The plurality of probes pass through the hollow portion, and at least one fixed structure is disposed in a part of the hollow portion. The at least one fixed structure has a plurality of perforations, the plurality of probes respectively pass through the plurality of perforations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:同軸針結構</p>  
        <p type="p">10:管狀結構</p>  
        <p type="p">11:中空部分</p>  
        <p type="p">11a:第一開口</p>  
        <p type="p">11b:第二開口</p>  
        <p type="p">12:管狀結構管壁</p>  
        <p type="p">20:懸臂式探針</p>  
        <p type="p">30:固定結構</p>  
        <p type="p">30a:第一固定結構</p>  
        <p type="p">30b:第二固定結構</p>  
        <p type="p">31:穿孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="182" publication-number="202613976"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613976.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613976</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135618</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>衛星影像判識植生物種系統及方法</chinese-title>  
        <english-title>VEGETATION SATELLITE IMAGE IDENTIFICATION SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241007B">G06V20/13</main-classification>  
        <further-classification edition="202201120241007B">G06V10/77</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞竣科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHI TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宏君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HUNG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連婉茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIEN, WAN-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宗琴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG,TSUNG-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種衛星影像判識植生物種系統及方法。本發明的衛星影像判識植生物種系統執行本發明的衛星影像判識植生物種方法，包含以下步驟：基於樣本植生影像，訓練一植生機器學習模型辨識出樣本植生影像中的一目標植生；擷取待測區域的影像作為待測區域影像；以及將待測區域影像輸入經過訓練的植生機器學習模型，以通過植生機器學習模型辨識出待測區域內的待測植生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A vegetation satellite image identification system and method are provided. The vegetation image identification system performs the vegetation image identification method including steps of: training a vegetation machine learning model to be used to identify a target vegetation in a sample vegetation image based on the sample vegetation image; capturing an image of a tested region as a tested region image; and inputting the tested region image to the trained vegetation machine learning model for identifying a tested vegetation in the tested region via the trained vegetation machine learning model .</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:訓練模型建立模組</p>  
        <p type="p">20:待測影像擷取模組</p>  
        <p type="p">30:植生影像辨識模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="183" publication-number="202614104"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614104.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614104</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135626</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶片型薄膜電容及其製造方法</chinese-title>  
        <english-title>CHIP FILM CAPACITOR AND FABRICATING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">H01G4/33</main-classification>  
        <further-classification edition="202501120250102B">H10D1/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國巨股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAGEO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪哲緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, JHE-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王人弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, REN-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出一種晶片型薄膜電容及其製造方法。晶片型薄膜電容包含陶瓷基板、兩個第一電極層、兩個介電層、兩個第二電極層、第一連接層和第二連接層。在陶瓷基板中，第一表面和第二表面每一者具有多個溝槽。第一電極層分別設置在第一表面及第二表面上，且填充至這些溝槽內。這些第一電極層皆延伸至第一側面的邊緣。介電層分別位於這些第一電極層上。第二電極層分別位於這些介電層上。這些第二電極層皆延伸至第二側面的邊緣。第一連接層電性連接在第一表面和第二表面上的第一電極層。第二連接層電性連接在第一表面和第二表面上的第二電極層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chip film capacitor and a fabricating method of the same are provided. The chip film capacitor includes a ceramic substrate, two first electrode layers, two dielectric layers, two second electrode layers, a first connecting layer, and a second connecting layer. In the ceramic substrate, each of a first surface and a second surface has multiple grooves. The first electrode layers are respectively disposed on the first surface and the second surface and the grooves are filled with the first electrode layers. The first electrode layers extend to an edge of a first side. The dielectric layers are located on the first electrode layers. The second electrode layers are located on the dielectric layers. The second electrode layers extend to an edge of a second side. The first connecting layer is electrically connected to the first electrode layers on the first surface and the second surface. The second connecting layer is electrically connected to the second electrode layers on the first surface and the second surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶片型薄膜電容</p>  
        <p type="p">110:陶瓷基板</p>  
        <p type="p">111,112:表面</p>  
        <p type="p">113,114:側面</p>  
        <p type="p">117:溝槽</p>  
        <p type="p">120:第一電極層</p>  
        <p type="p">130:介電層</p>  
        <p type="p">140:第二電極層</p>  
        <p type="p">150:鈍化層</p>  
        <p type="p">160:保護層</p>  
        <p type="p">170,180:連接層</p>  
        <p type="p">190A,190B:外部電極層</p>  
        <p type="p">191:銅層</p>  
        <p type="p">192:鎳層</p>  
        <p type="p">193:錫層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="184" publication-number="202613571"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613571.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613571</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135631</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測試載板及測試方法</chinese-title>  
        <english-title>TEST LOAD BOARD AND TEST METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241211B">G01R31/26</main-classification>  
        <further-classification edition="202001120241211B">G01R31/01</further-classification>  
        <further-classification edition="200601120241211B">G01R1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新唐科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種測試載板，包括一第一導線、一第二導線、一第三導線、一插槽以及一開關。第一導線傳送一第一測試信號。第二導線傳送一第二測試信號。第三導線傳送一感測信號。插槽用以設置一待測元件。開關提供第一測試信號或第二測試信號予待測元件，並包括一第一接腳以及一第二接腳。第一接腳電性連接第一導線。第二接腳電性連接第二及第三導線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A Test load board including a first conducting line, a second conducting line, a third conducting line, a socket, and a switch is provided. The first conducting line transmits a first test signal. The second conducting line transmits a second test signal. The third conducting line transmits a sensing signal. The socket is configured to contact a device under test. The switch provides the first or second test signal to the device under test and comprises a first pin and a second pin. The first pin is electrically connected to the first conducting line. The second pin is electrically connected to the second and third conducting lines.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:測試載板</p>  
        <p type="p">110:插槽</p>  
        <p type="p">111:待測元件</p>  
        <p type="p">112、121~123:接腳</p>  
        <p type="p">120A:開關</p>  
        <p type="p">130、140:硬體資源</p>  
        <p type="p">131、141、142:導線</p>  
        <p type="p">150、160、170:輸入輸出墊</p>  
        <p type="p">ST、SF:測試信號</p>  
        <p type="p">SO:輸出信號</p>  
        <p type="p">SS:感測信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="185" publication-number="202613843"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613843.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613843</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135632</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輸入裝置與運用輸入裝置執行搜尋的方法</chinese-title>  
        <english-title>INPUT DEVICE AND SEARCH METHOD PERFORMED THROUGH THE INPUT DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241211B">G06F16/90</main-classification>  
        <further-classification edition="200601120241211B">G06F17/40</further-classification>  
        <further-classification edition="200601120241211B">G06F3/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寶德科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXIN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧賀隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, HO-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露書關於一種輸入裝置與運用輸入裝置執行搜尋的方法，所述方法執行於連接輸入裝置的電腦系統中。其中，運用輸入裝置選擇一搜尋目標，並通過電腦系統產生搜尋描述，接著自輸入裝置的記憶體中取得一搜尋引擎的識別符。之後，將搜尋目標、搜尋描述與識別符包裹形成一搜尋包裹，經網路傳送搜尋包裹至對應識別符的搜尋引擎，由搜尋引擎根據搜尋包裹中的搜尋目標與搜尋描述執行搜尋，得出搜尋結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An input device and a search method performed through the input device are provided. The method is performed in a computer system connected with the input device. The input device is used to select a search target. A search description is generated by the computer system. An identifier corresponding to a search engine can be retrieved from a memory of the input device. After that, the search target, the search description and the identifier are packaged into a search package. The search package is transmitted to the search engine via a network. The search engine relies on the search target and the search description retrieved from the search package to conduct search so as to generate a search result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電腦主機</p>  
        <p type="p">110:使用者介面</p>  
        <p type="p">112:搜尋描述</p>  
        <p type="p">114:搜尋目標</p>  
        <p type="p">101:輸入裝置一</p>  
        <p type="p">102:輸入裝置二</p>  
        <p type="p">30:網路</p>  
        <p type="p">300:搜尋平台</p>  
        <p type="p">301:自然語言模型</p>  
        <p type="p">302:資料庫</p>  
        <p type="p">303:搜尋引擎</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="186" publication-number="202613782"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613782.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613782</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135633</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>適應操作行為的訊號傳輸器與運作方法</chinese-title>  
        <english-title>SIGNAL TRANSMITTER ADAPTED TO MANIPULATION BEHAVIOR AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G06F3/01</main-classification>  
        <further-classification edition="200601120241007B">G06F3/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寶德科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXIN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧賀隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, HO-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露書關於一種適應操作行為的訊號傳輸器與運作方法，訊號傳輸器設有微控制器以及訊號傳輸電路，訊號傳輸電路用於建立輸入裝置與電腦主機之間傳輸訊號的連線，微控制器用於接收輸入裝置傳送的輸入訊號，從輸入訊號中取得操作數據，操作數據可為使用者操作輸入裝置的觸按速率、轉動速率或觸控行程，即可根據操作數據得出使用者的操作行為，以判斷出操作指令，再將操作指令通過訊號傳輸電路傳送至電腦主機，由電腦主機中運行的作業系統執行操作指令。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A signal transmitter adapted to manipulation behavior and an operating method are provided. The signal transmitter includes a microcontroller and a signal transmitting circuit. The signal transmitting circuit is used to establish a connection between an input device and a computer host. The microcontroller is used to receive input signals transmitted by the input device and extract manipulation data from the input signals. The manipulation data can be a touching rate, a rolling rate or a touch-traveling route. The manipulation data is used to derive a manipulation behavior of a user and determine a manipulation instruction. The manipulation instruction is transmitted to the computer host by the signal transmitting circuit. An operating system operated in the computer host then executes the manipulation instruction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:訊號傳輸器</p>  
        <p type="p">201:微控制器</p>  
        <p type="p">203:記憶體</p>  
        <p type="p">205:訊號傳輸電路</p>  
        <p type="p">206:電源電路</p>  
        <p type="p">207:天線單元</p>  
        <p type="p">209:傳輸介面</p>  
        <p type="p">23:輸入裝置</p>  
        <p type="p">25:電腦主機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="187" publication-number="202613785"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613785.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613785</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135670</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸控顯示裝置及其操作方法</chinese-title>  
        <english-title>TOUCH DISPLAY DEVICE AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240927B">G06F3/041</main-classification>  
        <further-classification edition="200601120240927B">G06F3/147</further-classification>  
        <further-classification edition="200601120240927B">G09G5/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奕力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ILI TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉宥昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛威虢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIN, WEI KUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林永福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUNG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐建昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHENG-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種觸控顯示裝置以及觸控顯示裝置的操作方法。觸控顯示裝置包括觸控顯示面板、觸控模組以及顯示驅動電路。觸控顯示面板包括多個顯示區域。觸控模組接收觸控感測值。顯示驅動電路依據影像數據獲得對應於所述多個顯示區域的多個亮度值。觸控模組依據所述多個亮度值來校正基準值，並基於觸控感測值與基準值之間的差異來提供觸控感測結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A touch display device and an operating method of the touch display device are provided. The touch display device includes a touch display panel, a touch module and a display driving circuit. The touch display panel includes display areas. The touch module provides a touch sensing value. The display driving circuit obtains luminance values corresponding to the display areas according to an image data. The touch module calibrates a base value according to the luminance values, and provides touch sensing results based on a difference between the touch sensing value and the base value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">110:觸控顯示面板</p>  
        <p type="p">120:觸控模組</p>  
        <p type="p">130:顯示驅動電路</p>  
        <p type="p">BG:基準值</p>  
        <p type="p">DR1~DRn:顯示區域</p>  
        <p type="p">IMG:影像數據</p>  
        <p type="p">LU1~LUn:亮度值</p>  
        <p type="p">SNL1~SNLn:觸控感測雜訊</p>  
        <p type="p">SS:觸控感測值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="188" publication-number="202613592"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613592.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613592</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135675</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微波感測器</chinese-title>  
        <english-title>MICROWAVE SENSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G01S13/04</main-classification>  
        <further-classification edition="200601120241007B">G01S7/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立積電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭丁元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, TING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種微波感測器，包括本地頻率電路、回波路徑電路以及處理電路。在省電模式中，處理電路禁能本地頻率電路，其中回波路徑電路發出第一雷達訊號至天線且從天線接收第一回波訊號。響應於處理電路判定偵測到物體，微波感測器從省電模式進入正常模式。在正常模式中，處理電路致能本地頻率電路，其中本地頻率電路發出第二雷達訊號至天線且輸出本地頻率訊號至回波路徑電路。回波路徑電路從天線接收第二回波訊號。響應於處理電路判定未偵測到任何物體，微波感測器從正常模式進入省電模式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a microwave sensor including a local frequency circuit, an echo path circuit and a processing circuit. In a power saving mode, the processing circuit disables the local frequency circuit, wherein the echo path circuit transmits a first radar signal to an antenna and receives a first echo signal from the antenna. In response to the processing circuit determining that an object has been detected, the microwave sensor enters a normal mode from the power saving mode. In the normal mode, the processing circuit enables the local frequency circuit, wherein the local frequency circuit transmits a second radar signal to the antenna and output a local frequency signal to the echo path circuit. The echo path circuit receives a second echo signal from the antenna. In response to the processing circuit determining that no object has been detected, the microwave sensor enters the power saving mode from the normal mode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:天線模組</p>  
        <p type="p">11:物體</p>  
        <p type="p">100:微波感測器</p>  
        <p type="p">110:本地頻率電路</p>  
        <p type="p">120:回波路徑電路</p>  
        <p type="p">130:處理電路</p>  
        <p type="p">IF11、IF12:辨識訊號</p>  
        <p type="p">LO11:本地頻率訊號</p>  
        <p type="p">RFIN11、RFIN12:回波訊號</p>  
        <p type="p">RFOUT11、RFOUT12:雷達訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="189" publication-number="202613869"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613869.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613869</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135679</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三維物體的檢查方法及用於三維物體的檢查系統</chinese-title>  
        <english-title>INSPECTION METHOD AND SYSTEM FOR THREE-DIMENSIONAL OBJECT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250512B">G06F30/27</main-classification>  
        <further-classification edition="202001120250512B">G06F30/17</further-classification>  
        <further-classification edition="202401120250512B">G06T3/067</further-classification>  
        <further-classification edition="200601120250512B">G01B11/02</further-classification>  
        <further-classification edition="200601120250512B">G01B11/22</further-classification>  
        <further-classification edition="200601120250512B">G01B11/26</further-classification>  
        <further-classification edition="200601120250512B">G01B11/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹燕越</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, YAN-YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃振洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHEN-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王皓生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAO-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種三維物體的檢查方法，包含有載入一物體之一三維模型；以一人工智慧辨識方法，確定該三維模型之一特定構件；以及根據該特定構件之一幾何資訊，確認該特定構件是否符合一工程要求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An inspection method for three-dimensional (3D) objects includes loading a 3D model of an object; determining a specific component of the 3D model with an artificial intelligent (AI) recognition method; and determining whether the specific component conforms to an engineering requirement or not according to geometry information of the specific component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:檢查流程</p>  
        <p type="p">202-210:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="190" publication-number="202613764"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613764.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613764</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135683</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>伺服器裝置及限位件</chinese-title>  
        <english-title>SERVER DEVICE AND LIMITING COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">G06F1/16</main-classification>  
        <further-classification edition="200601120241104B">H01R13/629</further-classification>  
        <further-classification edition="200601120241104B">H01R13/58</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林日隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIH LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種伺服器裝置，包含機體及連接器組件。機體包含外殼及第一電連接器。第一電連接器設置於外殼。連接器組件包含第二電連接器及限位件。第二電連接器可分離地電性連接於第一電連接器，並包含本體部及限位凸部。限位凸部凸出於本體部。限位件包含組裝架、限位架及限位缺口。組裝架可分離地設置於外殼。限位架包含限位板體及分隔體。限位板體連接於組裝架。分隔體連接於限位板體遠離組裝架之一側。分隔體與限位板體共同圍繞出限位空間。限位缺口位於組裝架與限位板體之相連處。本體部可分離地位於限位空間。限位凸部可分離地位於限位缺口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A server device includes a machine body and a connector assembly. The machine body includes a casing and a first electrical connector. The first electrical connector is disposed on the casing. The connector assembly includes a second electrical connector and a limiting component. The second electrical connector is detachably electrically connected to the first electrical connector, and includes a body portion and a limiting protrusion. The limiting protrusion protrudes from the body portion. The limiting component includes an assembly frame, a limiting frame and a limiting notch. The assembly frame is detachably disposed on the casing. The limiting frame includes a limiting plate and partitions. The limiting plate is connected to the assembly frame. The partitions are connected to a side of the limiting plate away from the assembly frame. The partitions and the limiting plate together surround and form a limiting space. The limiting notch is located at the connection between the assembly frame and the limiting plate. The body portion is detachably located at the limiting space. The limiting protrusion is detachably located at the limiting notch.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:伺服器裝置</p>  
        <p type="p">20:機體</p>  
        <p type="p">21:外殼</p>  
        <p type="p">30:連接器組件</p>  
        <p type="p">31:第二電連接器</p>  
        <p type="p">311:本體部</p>  
        <p type="p">312:限位凸部</p>  
        <p type="p">32:限位件</p>  
        <p type="p">321:組裝架</p>  
        <p type="p">322:限位架</p>  
        <p type="p">3221:限位板體</p>  
        <p type="p">3222:分隔體</p>  
        <p type="p">32221:第一分隔部</p>  
        <p type="p">32222:第二分隔部</p>  
        <p type="p">323:限位缺口</p>  
        <p type="p">3231:開口部</p>  
        <p type="p">3232:限位部</p>  
        <p type="p">3233:導引部</p>  
        <p type="p">324:活動式緊固件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="191" publication-number="202612647"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612647.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612647</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135685</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無晶片監測結構</chinese-title>  
        <english-title>CHIPLESS MONITORING STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">A61B5/20</main-classification>  
        <further-classification edition="200601120241007B">A61F13/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭偉晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施易成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, YI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴郁書</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, YU SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種無晶片監測結構，包含至少一第一監測單元。至少一第一監測單元包含一第一基板以及一第一訊號傳感部。第一訊號傳感部包含一第一訊號傳感段、一第二訊號傳感段、一第三訊號傳感段以及一第四訊號傳感段。第一訊號傳感段、第二訊號傳感段、第三訊號傳感段以及第四訊號傳感段圍繞於基板的周緣。第一訊號傳感段與第三訊號傳感段分別連接於第二訊號傳感段之相對兩端。第四訊號傳感段連接於第三訊號傳感段，並以一缺口與第一訊號傳感段相分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chipless monitoring structure includes at least one first monitoring component. The at least one first monitoring component includes a first substrate and a first signal sensing portion. The first signal sensing portion includes a first signal sensing section, a second signal sensing section, a third signal sensing section and a fourth signal sensing section. The first signal sensing section, the second signal sensing section, the third signal sensing section and the fourth signal sensing section surround the periphery of the substrate. The first signal sensing section and the third signal sensing section are connected to opposite ends of the second signal sensing section, respectively. The fourth signal sensing section is connected to the third signal sensing section, and is spaced apart from the first signal sensing section by a gap.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:無晶片監測結構</p>  
        <p type="p">11:第一監測單元</p>  
        <p type="p">111:第一基板</p>  
        <p type="p">112:第一訊號傳感部</p>  
        <p type="p">1121:第一訊號傳感段</p>  
        <p type="p">1122:第二訊號傳感段</p>  
        <p type="p">1123:第三訊號傳感段</p>  
        <p type="p">1124:第四訊號傳感段</p>  
        <p type="p">G:缺口</p>  
        <p type="p">L1:長度</p>  
        <p type="p">T1:厚度</p>  
        <p type="p">W1:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="192" publication-number="202614713"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614713.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614713</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135687</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及電子機櫃</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND ELECTRONIC CABINET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H05K7/20</main-classification>  
        <further-classification edition="200601120241105B">H05K5/02</further-classification>  
        <further-classification edition="200601120241105B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄔將軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JIANG-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>項品義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIANG, PIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳雪鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, XUEFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YING, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔應翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CUI, YINGXIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄔榮強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, RONGQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，適於容納一冷卻液，包含一機殼組件、一主機板、一第一熱源、一第一冷板及一第一管路。機殼組件包含一殼體、一液面調節接口、一出液接口及一供液接口。殼體具有一內部空間，內部空間具有相連通的一液體腔室及一氣體腔室，液體腔室用以容納冷卻液。液面調節接口、出液接口及供液接口設置於殼體，且液面調節接口及出液接口連通於內部空間。主機板位於液體腔室內且用以至少部分浸沒於冷卻液。第一熱源位於液體腔室內且電性連接於主機板。第一冷板熱耦合於第一熱源，第一冷板具有一第一入液口及一第一出液口，第一冷板的第一出液口連通於殼體的內部空間。第一管路連接供液接口及第一冷板的第一入液口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device is adapted to accommodate a coolant and includes a casing assembly, a motherboard, a first heat source, a first cold plate and a first pipeline. The casing assembly includes a casing, a regulating connector, an outlet connector and an inlet connector. The casing has an interior space, and the interior space has a liquid chamber and a gas chamber communicating with each other. The liquid chamber is configured to accommodate the coolant. The regulating connector, the outlet connector and the inlet connector are disposed on the casing, and the regulating connector and the outlet connector communicate with the interior space. The motherboard is located in the liquid chamber and is configured to be at least partially immersed in the coolant. The first heat source is located in the liquid chamber and is electrically connected to the motherboard. The first cold plate is thermally coupled to the first heat source. The first cold plate has a first inlet and a first outlet. The first outlet of the first cold plate communicates with the interior space of the casing. The first pipeline is connected to the inlet connector and the first inlet of the first cold plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:電子裝置</p>  
        <p type="p">211:殼體</p>  
        <p type="p">2111:外殼</p>  
        <p type="p">2112:托盤</p>  
        <p type="p">212:液面調節接口</p>  
        <p type="p">213:出液接口</p>  
        <p type="p">214:供液接口</p>  
        <p type="p">22:主機板</p>  
        <p type="p">23:第一熱源</p>  
        <p type="p">24:第一冷板</p>  
        <p type="p">241:第一入液口</p>  
        <p type="p">242:第一出液口</p>  
        <p type="p">25:第一管路</p>  
        <p type="p">26:第一液位感測器</p>  
        <p type="p">27:第二液位感測器</p>  
        <p type="p">28:電子模組</p>  
        <p type="p">28’:電子組件</p>  
        <p type="p">281:電路板</p>  
        <p type="p">282:第二熱源</p>  
        <p type="p">283:第二冷板</p>  
        <p type="p">2831:第二入液口</p>  
        <p type="p">2832:第二出液口</p>  
        <p type="p">284:液體分配件</p>  
        <p type="p">2841:入口</p>  
        <p type="p">2842:出口</p>  
        <p type="p">29:分水器</p>  
        <p type="p">30:第二管路</p>  
        <p type="p">31:導流件</p>  
        <p type="p">311:第一端</p>  
        <p type="p">312:第二端</p>  
        <p type="p">32,33:第三熱源</p>  
        <p type="p">34:傳輸接口</p>  
        <p type="p">35:供電接口</p>  
        <p type="p">S:內部空間</p>  
        <p type="p">S1:液體腔室</p>  
        <p type="p">S2:氣體腔室</p>  
        <p type="p">C:冷卻液</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="193" publication-number="202613389"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613389.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613389</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135688</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>橫梁裝置</chinese-title>  
        <english-title>GIRDER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241203B">E04C3/292</main-classification>  
        <further-classification edition="200601120241203B">E04B1/30</further-classification>  
        <further-classification edition="200601120241203B">E04B1/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝英俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH,YING-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘銘源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAN, MING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜怡萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, YI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秉勲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BING-SYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝英俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, YING-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘銘源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAN, MING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種橫梁裝置，包含一個輕型鋼桁架單元、一個集成木單元，及一固定單元。該輕型鋼桁架單元包括一個左右延長的中間模組、一個左右延伸且連接該中間模組之底端部的底部模組，及一個左右延伸且連接在該中間模組之頂端部的頂部模組。該中間模組、該底部模組與該頂部模組界定二個開口背向朝外的凹槽。該集成木單元設置在該輕型鋼桁架單元的外表面。該固定單元將該集成木單元固定於該輕型鋼桁架單元，並包括數個鎖設在該集成木單元的第一螺絲。藉由該集成木單元與該固定單元的結構設計，提升該橫梁裝置的抗彎能力、抗破壞能力與防火能力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A girder device includes a light steel truss unit, an assembly wood unit, and a fixing unit. The light steel truss unit includes a left - right extending intermediate module, a bottom module extending in the left - right direction and connected to the bottom end of the intermediate module, and a top module extending in the left - right direction and connected to the top end of the intermediate module. The intermediate module, the bottom module, and the top module define two recesses opening outwardly facing away from each other. The assembly wood unit is disposed on an outer surface of the light steel truss unit. The fixing unit fixes the assembly wood unit to the light steel truss unit, and includes a plurality of first screws secured to the assembly wood unit. Through the structural design of the assembly wood unit and the fixing unit, the bending resistance, damage resistance and fire resistance of the girder device can be enhanced.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:橫梁裝置</p>  
        <p type="p">2:輕型鋼桁架單元</p>  
        <p type="p">21:中間模組</p>  
        <p type="p">212:直桿</p>  
        <p type="p">213:斜桿</p>  
        <p type="p">22:底部模組</p>  
        <p type="p">221:下弦桿</p>  
        <p type="p">23:頂部模組</p>  
        <p type="p">231:上弦桿</p>  
        <p type="p">3:集成木單元</p>  
        <p type="p">331:支撐件</p>  
        <p type="p">4:固定單元</p>  
        <p type="p">41:第一螺絲</p>  
        <p type="p">42:第二螺絲</p>  
        <p type="p">43:連接螺桿</p>  
        <p type="p">44:黏著劑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="194" publication-number="202612717"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612717.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612717</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135690</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含甘草萃取物之組成物及其用於動物骨骼肌生長之方法和用途</chinese-title>  
        <english-title>COMPOSITION COMPRISING GLYCYRRHIZA URALENSIS EXTRACT AND METHOD AND USE THEREOF FOR SKELETAL MUSCLE GROWTH IN ANIMALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250502B">A61K36/48</main-classification>  
        <further-classification edition="200601120250502B">A61K31/352</further-classification>  
        <further-classification edition="200601120250502B">A61K31/35</further-classification>  
        <further-classification edition="200601120250502B">A61K31/12</further-classification>  
        <further-classification edition="200601120250502B">A61K31/045</further-classification>  
        <further-classification edition="200601120250502B">A61K31/4375</further-classification>  
        <further-classification edition="200601120250502B">A61K31/4745</further-classification>  
        <further-classification edition="200601120250502B">A61K31/70</further-classification>  
        <further-classification edition="200601120250502B">A61P21/00</further-classification>  
        <further-classification edition="201601120250502B">A23K10/30</further-classification>  
        <further-classification edition="201601120250502B">A23K20/116</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中央研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACADEMIA SINICA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁佑全</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YU-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐柏榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OU, BOR-RUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種含有本發明提供了一種含有植生素的組成物及其在農業中的應用。具體地，本揭露關於包含甘草( &lt;i&gt;Glycyrrhiza uralensis&lt;/i&gt;)萃取物或從甘草萃取物所分離的活性化合物之組成物、利用該組成物促進動物骨骼肌生長之方法、以及該組成物作為用於動物的植生素飼料添加劑之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a phytogenic-containing composition and applications thereof in agriculture. Specifically, the present disclosure relates to a composition comprising &lt;i&gt;Glycyrrhiza uralensis&lt;/i&gt;extract, or an active compound isolated from the &lt;i&gt;G. uralensis&lt;/i&gt;extract, a method for promoting skeletal muscle growth of animals by utilizing the composition, and use of the composition as a phytogenic feed additive for animals.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="195" publication-number="202613892"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613892.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613892</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135694</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>持續學習模型的訓練方法及非暫態電腦可讀取媒體</chinese-title>  
        <english-title>A TRAINING METHOD FOR A CONTINUAL LEARNING MODEL AND NON-TRANSITORY COMPUTER-READABLE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250102B">G06N20/00</main-classification>  
        <further-classification edition="202301120250102B">G06N3/08</further-classification>  
        <further-classification edition="200601120250102B">G06F3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許之凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳維超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張明清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MING-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提出一種持續學習模型的訓練方法及執行此方法的非暫態電腦可讀取媒體。所述方法包括：當目前的訓練過程為持續學習的第一個任務時，依據第一個任務的原始資料訓練本質生成程序中的編碼器及自注意力層，否則凍結編碼器及自注意力層的參數，執行本質生成程序以將原始資料轉換為資料本質，將資料本質加入本質記憶區，重複執行訓練程序直到持續學習模型收斂。訓練程序包括：從原始資料中取得訓練批次，依據訓練批次更新回放記憶區，依據回放記憶區及本質記憶區訓練持續學習模型，當目前的訓練過程為第一個任務時，更新本質記憶區中的資料本質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A training method for a continual learning model and a non-transitory computer-readable medium executing this method are proposed. The method includes: when the current training process is for the first task in continual learning, training the encoder and self-attention layer in the essence generation process based on the raw data of the first task; otherwise, freezing the parameters of the encoder and self-attention layer, executing the essence generation process to convert the raw data into the data essence, and adding the data essence to the essence memory. The training process is repeated until the continual learning model converges. The training process includes: obtaining a training batch from the raw data, updating the replay memory based on the training batch, training the continual learning model based on the replay memory and the essence memory, and updating the data essence in the essence memory when the current training process is for the first task.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">T1,T2,T3,T4,T5,T6:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="196" publication-number="202614579"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614579.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614579</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135697</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於MIPI　C-PHY的接收器</chinese-title>  
        <english-title>A RECEIVER USING FOR MIPI C-PHY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H04B1/16</main-classification>  
        <further-classification edition="200601120250203B">H04B3/04</further-classification>  
        <further-classification edition="200601120250203B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商希羅斯無線股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIRIUS WIRELESS PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳駿邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUN-PANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭　理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIH, KWOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧治中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種用於MIPI C-PHY的低功耗接收器，其包括：一振盪器、一延遲校正器(Delay cell calibration)、一邊緣檢測及脈波生成器(Edge detection &amp;amp; Pulse gen)與一採樣與線狀態解碼器(Sampler &amp;amp; Wire state decoder)。其中，所述之延遲校正器與該振盪器訊號連接，並接收自該振盪器所產生的頻率訊號。該邊緣檢測及脈波生成器與該延遲校正器訊號連接，並用以接收該MIPI C-PHY所傳遞之訊號。該採樣與線狀態解碼器與該邊緣檢測及脈波生成器訊號連接，並用以接收該MIPI C-PHY所傳遞之訊號，以及輸出一解碼結果。 本發明利用已知的振盪器脈衝寬度 (OSC clock high的周期寬度，即脈衝信號高電平持續的時間)，即為1個 delay cell的延遲時間。經過延遲校正器(delay cell calibration)電路後，可以換算得知在選定的振盪器OSC周期時間中有多少個 delay cell。再由已知的data rate，送選擇碼給邊緣檢測器(edge detector)內的相同delay cell，以得到邊緣脈衝(edge pulse)產生的延遲時間。邊緣脈衝(edge pulse)送到取樣器(sampler) 取樣資料，取樣後再判斷是屬於哪個狀態的解碼動作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a low-power receiver for MIPI C-PHY. The low-power receiver includes an oscillator, a Delay cell calibration, an edge detection and a pulse generator and a sampler &amp;amp; wire state decoder. Wherein, the Delay cell calibration is connected to the oscillator signal and receives the frequency signal generated by the oscillator. The edge detection and pulse generator is signal-connected to the Delay cell calibration and used to receive signals transmitted by the MIPI C-PHY. The sampling and line state decoder is signal-connected to the edge detection and pulse generator and is used to receive signals transmitted by the MIPI C-PHY and output a decoding result. The present invention uses the known oscillator pulse width (the period width of OSC clock high, that is, the duration of the high level of the pulse signal), which is the delay time of one delay cell. After passing through the Delay cell calibration circuit, it can be converted to know how many delay cells there are in the selected oscillator OSC cycle time. Then, based on the known data rate, the selection code is sent to the same delay cell in the edge detector to obtain the delay time of edge pulse generation. The edge pulse is sent to the sampler to sample the data. After sampling, it is determined which state the decoding action belongs to.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:振盪器</p>  
        <p type="p">20:延遲校正器</p>  
        <p type="p">30:邊緣檢測及脈波生成器</p>  
        <p type="p">40:採樣與線狀態解碼器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="197" publication-number="202613867"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613867.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613867</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135707</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>風扇補強結構設計自動化方法及其裝置</chinese-title>  
        <english-title>AUTOMATED METHOD FOR FAN REINFORCED STRUCTURE DESIGN AND DEVICE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241007B">G06F30/17</main-classification>  
        <further-classification edition="202001320241007B">G06F119/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡子琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, TZU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳學良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSUEH-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪宗顯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, TZUNG-SHIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種風扇補強結構設計自動化方法，包含產生風扇參數資料集，於風扇參數資料集中挑選參數組合，根據參數組合計算筆電底殼與風扇外殼的受力位移組合，根據筆電底殼與風扇外殼的受力位移組合進行最佳化運算以獲得風扇支撐肋設計參數；及根據風扇支撐肋設計參數計算筆電底殼的當前受力位移及風扇外殼的當前受力位移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An automated method for fan reinforcement structure design includes generating a fan parameter dataset, selecting a parameter set from the fan parameter dataset, calculating a force-deflection set of a D cover and a fan cover according to the parameter set, performing an optimization operation according to the force- deflection set of the D cover and the fan cover to obtain design parameters of a fan rib, and calculating a current deflection of the D cover and a current deflection of the fan cover according to the design parameters of the fan rib.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:風扇補強結構設計自動化方法</p>  
        <p type="p">S301-S309:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="198" publication-number="202613497"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613497.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613497</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135709</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>停車路徑規劃系統</chinese-title>  
        <english-title>PARKING PATH PLANNING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240926B">G01C21/34</main-classification>  
        <further-classification edition="200601120240926B">G08G1/14</further-classification>  
        <further-classification edition="201901120240926B">G06F16/29</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朝陽科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAOYANG UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭煜輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YU-HUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種停車路徑規劃系統，其用於規劃車輛於停車場之最短停車路徑，停車場具有入口處及複數停車位，本申請包含相互耦接的資料儲存模組、車位紀錄模組及停車路徑規劃模組。資料儲存模組儲存有停車場的各項資料；車位紀錄模組耦接於各停車位的感測裝置，車位紀錄模組根據感測裝置的感測結果，將對應的停車位的停車位座標資料紀錄為無車座標資料或有車座標資料；停車路徑規劃模組係根據入口座標資料、無車座標資料以及車道座標資料，並利用遺傳演算法進行多次迭代運算，以計算出最短停車路徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A parking path planning system designed to plan the shortest parking path for vehicles in a parking lot. The parking lot includes an entrance and multiple parking spaces. This application comprises a data storage module, a parking space recording module, and a parking path planning module, all of which are interconnected.The data storage module stores various data related to the parking lot. The parking space recording module is connected to the sensors at each parking space, and based on the sensor results, it records the corresponding parking space’s coordinates as either empty or occupied. The parking path planning module uses the entrance coordinates, empty parking space coordinates, and lane coordinates to perform multiple iterations using a genetic algorithm to calculate the shortest parking path.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:停車路徑規劃系統</p>  
        <p type="p">400:感測裝置</p>  
        <p type="p">10:資料儲存模組</p>  
        <p type="p">20:車位紀錄模組</p>  
        <p type="p">30:停車路徑規劃模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="199" publication-number="202613205"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613205.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613205</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135713</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>羥基高分子材料、其製造方法以及所構成之結構件</chinese-title>  
        <english-title>HYDROXYL POLYMER MATERIAL, MANUFACTURING METHOD THEREOF, AND STRUCTURAL COMPONENT COMPOSED THEREBY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240926B">C08G63/91</main-classification>  
        <further-classification edition="200601120240926B">C08K3/34</further-classification>  
        <further-classification edition="200601120240926B">C08K3/36</further-classification>  
        <further-classification edition="200601120240926B">C08K3/22</further-classification>  
        <further-classification edition="200601120240926B">C08K3/04</further-classification>  
        <further-classification edition="201901120240926B">B32B7/022</further-classification>  
        <further-classification edition="200601120240926B">C08J5/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華碩電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUSTEK COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊玉純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YU-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃博文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊國林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, GUO-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牛二保</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIU, ER-BAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種羥基高分子材料的製造方法。首先，準備一羥基樹脂改性材料。隨後，準備一液體，此液體內添加有機聚合物、碳化矽以及氧化鋁作為第一輔料。然後，準備一丙烯酸混合反應樹脂材料，此丙烯酸混合反應樹脂材料內添加有二氧化矽、金剛石粉末、陶瓷顆粒材料以及玻璃纖維粉末作為第二輔料。接下來，將羥基樹脂改性材料、液體以及丙烯酸混合反應樹脂材料均勻混合，以產出一羥基混合反應樹脂材料。然後，將羥基混合反應樹脂材料與一丙烯酸化合樹脂材料均勻混合，以產出一羥基高分子材料。本案並提供此羥基高分子材料及其構成之結構件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing a hydroxyl polymer material is provided. First, a hydroxyl resin modified material is provided. Subsequently, a liquid with organic polymer, silicon carbide, and aluminium oxide as a first auxiliary material added therein is prepared. Then, an acrylic mixed reaction resin material with silica, diamond powders, ceramic particle material, and glass fiber powders as a second auxiliary material added therein is prepared. Next, the hydroxyl resin modified material, the liquid and the acrylic mixed reaction resin material are evenly mixed to produce a hydroxyl mixed reaction resin material. Then, the hydroxyl mixed reaction resin material and an acrylic compound resin material are uniformly mixed to produce the hydroxyl polymer material. A structural component manufactured by using the hydroxyl polymer material is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110,S120,S130,S140,S150:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="200" publication-number="202613887"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613887.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613887</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135717</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>風扇按壓分析的類神經網路模型的訓練方法及其裝置</chinese-title>  
        <english-title>TRAINING METHOD OF NEURAL NETWORK MODEL FOR FAN PRESSING ANALYSIS AND DEVICE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241220B">G06N3/063</main-classification>  
        <further-classification edition="202001120241220B">G06F30/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡子琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, TZU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李政霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JENG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張嘉和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種風扇按壓分析的類神經網路模型的訓練方法，包含產生風扇參數資料集，根據風扇參數資料集產生複數個圖檔，分析複數個圖檔以取得分析結果，根據分析結果及風扇參數資料集訓練類神經網路模型，及取得類神經網路模型的模型權重參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A training method of a neural network model for fan pressing analysis includes generating a fan parameter data set, generating a plurality of computer graphics according to the fan parameter data set, analyzing the plurality of computer graphics to obtain analysis results; training the neural network model according to the analysis results and the fan parameter data set, and obtain model weight parameters of the neural network model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100,S101-S105:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="201" publication-number="202613406"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613406.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613406</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135735</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>軟體機器人</chinese-title>  
        <english-title>SOFT ROBOT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">F03G7/00</main-classification>  
        <further-classification edition="200601120241105B">B25J11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊燿州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YAO-JOE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳姸君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳妍君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種軟體機器人，包含液晶彈性體。液晶彈性體形成載物平台、兩前肢及兩後肢，其中，載物平台包含前部及後部，前部包含第一緣、第二緣、以及兩側緣，第一緣與第二緣相對，兩側緣連接第一緣及第二緣，後部包含第三緣、第一後緣及第二後緣，第三緣與前部的第二緣連接，且第一後緣相對於第二後緣具有後夾角；兩前肢分別連接於兩側緣且鄰近第一緣；兩後肢分別連接於第一後緣及第二後緣。軟體機器人藉由光驅動，無需攜帶電池，可應用於惡劣環境中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A soft robot comprises liquid crystal elastomer. The liquid crystal elastomer forms a loading platform, two forelimbs and two hind limbs. The loading platform includes a front part and a rear part; the front part includes a first edge, a second edge, and two side edges, the first edge is opposite to the second edge, both side edges connect the first edge and the second edge; the rear part includes a third edge, a first trailing edge and a second trailing edge, the third edge is connected to the second edge of the front part, and the rear part has a trailing angle between the first trailing edge and the second trailing edges. The two forelimbs are respectively connected to both side edges and adjacent to the first edge of the loading platform. The two hind limbs are respectively connected to the first trailing edge and the second trailing edge. The soft robot is activated by light without batteries, and can be used in harsh environments.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:軟體機器人</p>  
        <p type="p">12:液晶彈性體</p>  
        <p type="p">2:載物平台</p>  
        <p type="p">22:前部</p>  
        <p type="p">24:後部</p>  
        <p type="p">26:載物凹槽</p>  
        <p type="p">4:前肢</p>  
        <p type="p">6:後肢</p>  
        <p type="p">A:後夾角</p>  
        <p type="p">E1:第一緣</p>  
        <p type="p">E2:第二緣</p>  
        <p type="p">E3:第三緣</p>  
        <p type="p">S:側緣</p>  
        <p type="p">M1:第一後緣</p>  
        <p type="p">M2:第二後緣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="202" publication-number="202613430"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613430.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613430</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135744</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>減振及磁電雙穩態振動擷能系統</chinese-title>  
        <english-title>VIBRATION DAMPING AND MAGNETO-ELECTRIC BISTABLE VIBRATION ENERGY HARVESTING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">F16F15/03</main-classification>  
        <further-classification edition="200601120241105B">F03G7/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淡江大學學校財團法人淡江大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMKANG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王怡仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YI-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏詮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PO-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種減振及磁電雙穩態振動擷能系統，其包含一減振組件與一擷能組件。減振組件包括一彈性件、一第一磁性件與一滑軌裝置，彈性件連接於振動主體；擷能組件包括一懸臂、一第二磁性件與至少一壓電元件，第二磁性件與壓電元件設置於懸臂相對兩端，第二磁性件與第一磁性件的磁性相同且相鄰設置。當振動主體產生振動可牽動彈性件並帶動第一磁性件滑移，第二磁性件因第一磁性件的磁性互斥力而擺動並帶動懸臂振動，由壓電元件將懸臂振動所產生的振動能轉換為電能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A vibration damping and magneto-electric bistable vibration energy harvesting system, which includes a damping component and an energy harvesting component. The damping component comprises an elastic element, a first magnetic element, and a sliding rail device, with the elastic element connected to a vibrating body. The energy harvesting component includes a cantilever beam, a second magnetic element, and at least one piezoelectric element, with the second magnetic element and the piezoelectric element positioned at opposite ends of the cantilever. The second magnetic element has the same magnetic polarity as the first magnetic element and is placed adjacent to it. When the vibrating body generates vibrations, the elastic element is pulled, causing the first magnetic element to slide. The repulsive force between the two magnetic elements makes the second element swing, driving the cantilever to vibrate, and the piezoelectric element converts this vibration into electrical energy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:減振及磁電雙穩態振動擷能系統</p>  
        <p type="p">10:減振組件</p>  
        <p type="p">11:彈性件</p>  
        <p type="p">111:第一端</p>  
        <p type="p">112:第二端</p>  
        <p type="p">12:第一磁性件</p>  
        <p type="p">13:滑軌裝置</p>  
        <p type="p">131:滑座</p>  
        <p type="p">132:滑軌</p>  
        <p type="p">20:擷能組件</p>  
        <p type="p">21:懸臂</p>  
        <p type="p">211:自由端</p>  
        <p type="p">212:固定端</p>  
        <p type="p">213:支撐座</p>  
        <p type="p">22:第二磁性件</p>  
        <p type="p">23:壓電元件</p>  
        <p type="p">24:數據擷取系統</p>  
        <p type="p">25:人機介面</p>  
        <p type="p">90:振動主體</p>  
        <p type="p">D:距離</p>  
        <p type="p">F1:第一方向</p>  
        <p type="p">F2:第二方向</p>  
        <p type="p">LQ:流體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="203" publication-number="202613696"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613696.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613696</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135752</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>能自動排水的埋入式影像裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241105B">G03B17/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉哲安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHE-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉哲安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHE-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種能自動排水的埋入式影像裝置，包含一筒身單元、一頂座單元及一自動排水單元。該筒身單元圍繞界定出一集水室。該頂座單元沿一頂底方向蓋設在該筒身單元的頂端，且具有一可透光的視窗部。該自動排水單元包括一位於該集水室內且被電力驅動的驅動器，及一抽水管。該抽水管沿該頂底方向延伸。該驅動器被驅動時能將由外界滲入及/或流入該集水室內的水通過該抽水管的頂端朝外排出，因此具有自動排水的功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:筒身單元</p>  
        <p type="p">20:集水室</p>  
        <p type="p">21:底座</p>  
        <p type="p">22:筒身</p>  
        <p type="p">221:接線孔</p>  
        <p type="p">300:頂座單元</p>  
        <p type="p">301:頂座組</p>  
        <p type="p">31:外筒</p>  
        <p type="p">32:濾網</p>  
        <p type="p">34:內筒體</p>  
        <p type="p">340:水槽</p>  
        <p type="p">342:視窗部</p>  
        <p type="p">344:透光片</p>  
        <p type="p">35:內筒基座</p>  
        <p type="p">36:抵靠膠墊</p>  
        <p type="p">37:噴嘴座</p>  
        <p type="p">371:座體</p>  
        <p type="p">372:噴嘴頭</p>  
        <p type="p">38:進水閥</p>  
        <p type="p">4:上蓋</p>  
        <p type="p">41:導水區</p>  
        <p type="p">411:導水凹部</p>  
        <p type="p">412:水流口</p>  
        <p type="p">5:防水膠墊</p>  
        <p type="p">7:自動排水單元</p>  
        <p type="p">71:驅動器</p>  
        <p type="p">72:抽水管</p>  
        <p type="p">74:液位感測組</p>  
        <p type="p">741:低水位感測器</p>  
        <p type="p">742:高水位感測器</p>  
        <p type="p">8:影像單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="204" publication-number="202613233"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613233.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613233</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135759</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>塑料合金皮層</chinese-title>  
        <english-title>PLASTIC ALLOY SKIN LAYER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241220B">C08L23/06</main-classification>  
        <further-classification edition="200601120241220B">C08L51/06</further-classification>  
        <further-classification edition="200601120241220B">C08L67/02</further-classification>  
        <further-classification edition="200601120241220B">B32B27/00</further-classification>  
        <further-classification edition="200601120241220B">B32B27/18</further-classification>  
        <further-classification edition="200601120241220B">B32B27/32</further-classification>  
        <further-classification edition="200601120241220B">B32B27/36</further-classification>  
        <further-classification edition="200601120241220B">D06N3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雄材大智材料科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRONG AND WISE MATERIAL TECH COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林正雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃大維</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種塑料合金皮層，所述塑料合金皮層係由聚乙烯(PE)、聚對苯二甲酸乙二酯(PET)及兼容劑混合後，經擠壓成型所製成；將所述塑料合金皮層包覆於塑木材料或衣纖木時，可大幅降低塑木材料因吸水所造成之膨脹及皮層脫落之問題，也可改善衣纖木因其外觀顏色不一造成美觀度不佳之問題。此外，藉由所述塑料合金皮層的材料特性，可進一步提高塑木材料或衣纖木的抗刮性及耐磨性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a plastic alloy skin layer. The plastic alloy skin layer is made by extrusion molding after mixing polyethylene(PE), polyethylene terephthalate(PET) and a compatibilizer; when the plastic alloy skin layer is coated on plastic wood materials or clothing fiber wood, it can greatly reduce the expansion and peeling of the skin layer caused by water absorption of the plastic wood material. The plastic alloy skin layer can also improve the problem of poor appearance caused by different colors of clothing fiber wood. In addition, through the material properties of the plastic alloy skin layer, the scratch resistance and wear resistance of the plastic wood material or clothing fiber wood can be further improved.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="205" publication-number="202612679"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612679.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612679</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135760</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>灌食袋的鼻胃管流速閥門及其使用方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241001B">A61J15/00</main-classification>  
        <further-classification edition="200601120241001B">A61J9/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾奇爾生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辜雅文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辜雅文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許耿禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種灌食袋的鼻胃管流速閥門及其使用方法，該灌食袋的鼻胃管流速閥門包含：一袋體、一導引管體及一流速閥門，該流速閥門設置於該導引管體上，該流速閥門包含一流速調節器及一銜接頭，該灌食袋的鼻胃管流速閥門使用方法，包含六個步驟：吊掛灌食袋、排出導引管體內空氣、抽取胃內容物、打入溫水、進行灌食及清洗管壁，該流速調節器具有鎖定功能，便於調節和維持設定流速，該銜接頭設有歧管和封蓋，方便進行反抽觀察及注入溫水，從而提高操作的安全性和效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:袋體</p>  
        <p type="p">11:入口</p>  
        <p type="p">12:出口</p>  
        <p type="p">13:袋腔</p>  
        <p type="p">14:塞蓋</p>  
        <p type="p">15:吊環</p>  
        <p type="p">20:導引管體</p>  
        <p type="p">21:第一端</p>  
        <p type="p">30:止逆閥</p>  
        <p type="p">40:流速閥門</p>  
        <p type="p">41:流速調節器</p>  
        <p type="p">42:銜接頭</p>  
        <p type="p">422:插接部</p>  
        <p type="p">423:歧管</p>  
        <p type="p">424:封蓋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="206" publication-number="202613467"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613467.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613467</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135761</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>太陽能發電裝置同步追日系統</chinese-title>  
        <english-title>SYNCHRONIZED SOLAR TRACKING SYSTEM FOR A SOLAR POWER GENERATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250122B">F24S50/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向陽農業生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNNY RICH AGRIC. &amp; BIOTECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳貴光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUEI-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張以彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種太陽能發電裝置同步追日系統， 包括一太陽能發電模組、複數液壓缸、一動力控制單元，該液壓缸與該太陽能發電模組及位於該太陽能發電模組外部之固定位置樞接，具一封閉容室，該容室內充滿液壓油，又該容室二端分別設置一第一通孔、一第二通孔；又各該液壓缸由導管串接組合，並使一該液壓缸之第一通孔連接該導管與另一該液壓缸之第二通孔連接；又該動力控制單元具一方向控制閥、一動力裝置、一控制器，該方向控制閥具一第一端、一第二端，該第一端及該第二端分別連接該導管與呈串聯之一該液壓缸之第一通孔及另一該液壓缸之第二通孔連接；藉此本發明各液壓缸可同步帶動太陽能發電模組改變角度動作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A solar power generation device with a synchronized solar tracking system comprises a solar power generation module, a plurality of hydraulic cylinders, and a power control unit. The hydraulic cylinders are pivotally connected to the solar power generation module and a fixed position external to the module. Each hydraulic cylinder has a sealed chamber filled with hydraulic oil, with a first through-hole and a second through-hole respectively located at both ends of the chamber. The hydraulic cylinders are connected in series via conduits, with the first through-hole of one hydraulic cylinder connected to the conduit, and the second through-hole of another hydraulic cylinder connected to the conduit. The power control unit includes a directional control valve, a power device, and a controller. The directional control valve has a first end and a second end, which are respectively connected to the conduit and the first through-hole of one hydraulic cylinder and the second through-hole of another hydraulic cylinder. Through this design, the hydraulic cylinders can synchronously drive the solar power generation module to adjust its angle of operation</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:太陽能發電設備集合</p>  
        <p type="p">1:太陽能發電模組</p>  
        <p type="p">11:太陽能板</p>  
        <p type="p">12:立桿</p>  
        <p type="p">13:基座</p>  
        <p type="p">2:液壓缸</p>  
        <p type="p">21:外殼</p>  
        <p type="p">214:樞接部</p>  
        <p type="p">22:活塞桿</p>  
        <p type="p">223:作動端部</p>  
        <p type="p">24:導管</p>  
        <p type="p">31:方向控制閥</p>  
        <p type="p">32:動力裝置</p>  
        <p type="p">33:控制器</p>  
        <p type="p">4:感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="207" publication-number="202612997"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612997.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612997</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135762</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>容器回收裝置</chinese-title>  
        <english-title>CONTAINER RECYCLING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B65F1/14</main-classification>  
        <further-classification edition="200601120241105B">B29B17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡僅鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, JIN-PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡僅鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, JIN-PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種容器回收裝置，可供回收一待回收容器，包括：一主體，其包括一辨識區、一分類區及一回收區，該辨識區設有至少二攝影單元，該分類區設於該辨識區及該回收區之間且設有一分類件，該分類件可於一第一位置及一第二位置之間移動，該回收區設有一第一回收容器及一第二回收容器；其中，當該至少二攝影單元辨識位於該辨識區內之該待回收容器為有色時，該分類件移至該第一位置使該辨識區連通該第一回收容器；當該至少二攝影單元供辨識該辨識區內之該待回收容器為無色時，該分類件移至該第二位置使該辨識區連通該第二回收容器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A container recycling device is provided, being adapted to recycle a container, including: a main body, including an identification region, a sorting region and a recycling region, the identification region having at least two photographing units, the sorting region located between the identification region and the recycling region and having a sorting member, the sorting member being movable between a first position and a second position, the recycling region having a first recycling container and a second recycling container; wherein when the at least two photographing units identify the container which is located in the identification region is colored, the sorting member is moved to the first position to allow the identification region to communicated with the first recycling container; when the at least two photographing units identify the container which is located in the identification region is colorless, the sorting member moves to the second position to allow the identification region to communicated with second recycling container.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:容器回收裝置</p>  
        <p type="p">10:主體</p>  
        <p type="p">20:辨識區</p>  
        <p type="p">30:分類區</p>  
        <p type="p">40:回收區</p>  
        <p type="p">50:絞碎區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="208" publication-number="202614657"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614657.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614657</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135765</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>適用於WIFI訊號的接收方法</chinese-title>  
        <english-title>A METHOD FOR RECEIVING WIFI SIGNALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120250102B">H04W52/02</main-classification>  
        <further-classification edition="200601120250102B">H04L25/02</further-classification>  
        <further-classification edition="201701120250102B">H04B7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商希羅斯無線股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIRIUS WIRELESS PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳駿邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUN-PANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒伊秦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, YI-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳邦寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PANG-NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜韜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENJAMIN, CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳佩熹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PEI-SI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧治中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種適用於WIFI訊號的接收方法，方法包含：使用無線區域網路將數個使用者裝置所產生的數個訊號傳輸至接受器之存取點，該些訊號包括來自該些使用者裝置的頻寬；及透過濾波器以改變該些使用者裝置的中心頻率的位置，使該些訊號在較小的子通道頻寬下，將I、Q路徑ΔΣADC組合成單複合ΔΣADC，並選擇合適的該中心頻率的位置並降低其時脈速率。藉此，本發明的接收方法針對物聯網市場的小尺寸、功能有限晶片的新產品線，以實現滿足物聯網性能範圍所需的最低功耗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a method for receiving WIFI signals. The method includes using a wireless local area network path to transmit digital signals generated by a digital user device to an access point of a receiver. These signals include those from the bandwidth of certain user devices; and filters to change the position of the center frequencies of these user devices so that these signals combine the I and Q path ΔΣADC into a single composite ΔΣADC at a smaller sub-channel bandwidth, and select proper location of this center frequency and reduce its clock rate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:無線區域網路</p>  
        <p type="p">20:濾波器</p>  
        <p type="p">30:轉阻放大器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="209" publication-number="202613554"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613554.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613554</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135766</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調節針壓的彈簧針介面裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">G01R1/02</main-classification>  
        <further-classification edition="200601120241205B">G01R1/04</further-classification>  
        <further-classification edition="200601120241205B">G01R1/067</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利亙通國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張建文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏廣炯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可調節針壓的彈簧針介面裝置，其係在一彈簧針介面設有至少一彈簧針與至少一針壓調節裝置，該彈簧針的至少一端設置一伸縮針頭，並於該彈簧針內部設有一壓縮彈簧，該針壓調節裝置設有至少一調節旋鈕，藉此，只需透過旋擰該調節旋鈕就可以方便快速的改變該壓縮彈簧的壓縮程度或改變該彈簧針下端的外凸長度，因此很容易單獨的調節變化該彈簧針的針壓大小，使該彈簧針介面具備更良好的調節機能，甚至可以靈活更換使用粗細不同的該彈簧針，因此更容易適應實際應用需求的多樣變化，可有效提升彈簧針介面的實用性，此外，還可以在該針壓調節裝置加入緩衝機制，提升該彈簧針介面的耐用程度，使其不容易損壞。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">100:可調節針壓的彈簧針介面裝置</p>  
        <p type="p">10:彈簧針介面</p>  
        <p type="p">11:彈簧針</p>  
        <p type="p">111:針管</p>  
        <p type="p">112:伸縮針頭</p>  
        <p type="p">12:彈簧針介面基座</p>  
        <p type="p">14:絕緣件</p>  
        <p type="p">20:針壓調節裝置</p>  
        <p type="p">21:調節旋鈕</p>  
        <p type="p">211:訊號連接器</p>  
        <p type="p">213:旋鈕螺紋段</p>  
        <p type="p">22:旋鈕固定座</p>  
        <p type="p">221:固定螺絲</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="210" publication-number="202612761"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612761.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612761</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135768</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>跑步機之支撐底架組裝結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">A63B22/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡育倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡育倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種跑步機之支撐底架組裝結構，係由二平行固定側架之前段與中段位置之間各連接有橫向之一第一橫桿及一第二橫桿，該第一橫桿及第二橫桿之外管徑小於該固定側架之內管徑，其中，二該固定側架對應之內側前段位置各設有一通孔，並其中段位置各設有一橫向貫穿該固定側架之穿孔，該第一橫桿二端穿設過各該固定側架內側之通孔後，並分別焊接固定於各該固定側架內部對應另側之內管壁以及該固定側架內側之通孔孔緣，而該第二橫桿二端穿設過各該固定側架之穿孔後，並分別焊接固定於該固定側架內、外側之穿孔孔緣上；藉此，得以更加穩固而不晃動地放置於地面上並支撐跑步機之扶手架及跑步裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">10:固定側架</p>  
        <p type="p">11:通孔</p>  
        <p type="p">111:孔緣</p>  
        <p type="p">12:穿孔</p>  
        <p type="p">121:孔緣</p>  
        <p type="p">122:孔緣</p>  
        <p type="p">20:第一橫桿</p>  
        <p type="p">30:第二橫桿</p>  
        <p type="p">40:第三橫桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="211" publication-number="202613256"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613256.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613256</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135770</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓印油墨及其壓印方法</chinese-title>  
        <english-title>IMPRINT INK AND IMPRINT METHOD USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120241104B">C09D11/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華碩電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUSTEK COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊國林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, GUO-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃博文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊玉純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YU-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牛二保</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIU, ER-BAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種壓印油墨，其包含65wt%-70wt%之聚合性預聚物、7wt%-13wt%之感光性單體、0.5wt%-1.5wt%之光引發劑、8wt%-17wt%之耐磨丙烯酸混合反應樹脂以及助劑。本案並提供一種壓印方法。首先，提供一基材。隨後，利用壓印油墨，在基材上形成一壓印油墨層。接下來，對壓印油墨層施以一半固化處理，而形成一半固化壓印油墨層。然後，利用一模具施壓於半固化壓印油墨層，而形成一半固化壓印油墨輪廓層。最後，再對半固化壓印油墨輪廓層施以一全固化處理，而在基材上形成一壓印圖案層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An imprint ink comprising 65wt%-70wt% of aggregation prepolymer, 7wt%-13wt% of photosensitivity monomer, 0.5wt%-15wt% of photoinitiator, 8wt%-17wt% of acrylic mixed reaction resin, and auxiliary is provided. An imprint method is also provided. Firstly, a substrate is provided. Then, an imprint ink layer is formed on the substrate by using the imprint ink. Thereafter, a semi cuffing process is applied to the imprint ink layer to form a semi-cured imprint ink layer. Afterward, a mold is used pressing against the semi-cured imprint ink layer to form a semi-cured imprint ink contour layer. Then, a fully curing process the semi-cured imprint ink contour layer to form an imprint contour layer on the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110,S120,S130,S140,S150:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="212" publication-number="202613931"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613931.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613931</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135776</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>網路商城管控系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251128B">G06Q30/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐凱得股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔茜萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王榮輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種網路商城管控系統，係應用於一網路商城；該網路商城管控系統包含一網站系統內駐於一中央伺服器內，該網站系統包含：一管理者設定介面及一購物輸入介面連接各會員；一系統設定單元，該系統設定包含：基本設定、交易相關設定、訊息推送、簡訊配置、入口管理、包含商城入口管理、會員中心入口管理、購物車入口管理、優惠券入口管理等，及其他的設定諸如會員設定、層級分類設定、物流資訊界面的管理等。應用該網站系統可以控制整個網站內的配送及運費單元、商品管理單元、首頁管理單元、店鋪營運單元、頁面裝修次單元、會員管理單元、數據統計單元、訂單管理單元、門市管理單元、財務管理單元、營銷管理單元、優惠券管理單元等各個單元而達到有效的管理。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">1:網站系統</p>  
        <p type="p">5:管理者</p>  
        <p type="p">10:中央伺服器</p>  
        <p type="p">11:處理器</p>  
        <p type="p">12:記憶體</p>  
        <p type="p">25:會員</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="213" publication-number="202614876"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614876.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614876</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135777</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>紅外光全彩影像感測器</chinese-title>  
        <english-title>INFRARED FULL COLOR IMAGE SENSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10F39/15</main-classification>  
        <further-classification edition="202501120250102B">H10F77/40</further-classification>  
        <further-classification edition="200601120250102B">G02B5/22</further-classification>  
        <further-classification edition="202301120250102B">H10K39/32</further-classification>  
        <further-classification edition="202301120250102B">H10K59/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳肇欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHAO-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞　志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEE, CHEE KEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳明峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MING-JUNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾怡慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YI-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　清鬆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRECHATAVANICH, NATCHANON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　再償</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUTHEEBANJERD, THEERADECH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種紅外光全彩影像感測器，包括CMOS影像感測器（CIS）、隔離部件、紅色光轉換單元、綠色光轉換單元以及藍色光轉換單元。隔離部件設置於CIS上，以定義出多個轉換區。紅色光、綠色光及藍色光轉換單元分別設置於不同的轉換區內。每個轉換單元包括紅外光濾光片、陽極層、第一電子傳輸層、吸光量子點層、電洞傳輸層、發光量子點層、第二電子傳輸層以及陰極層。陰極層與CIS直接接觸。吸光量子點層吸收通過紅外光濾光片進入轉換區內的紅外光並產生電子電洞對。發光量子點層複合出電子電洞對並激發出紅色、綠色與藍色可見光。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An infrared (IR) full color image sensor includes a CMOS image sensor (CIS), isolation components, red light conversion units, green light conversion units and blue light conversion units. The isolation components are disposed on the CIS to define a plurality of conversion areas. The red light, the green light and the blue light conversion units are respectively located in different conversion areas. Each conversion unit includes an IR filter, an anode layer, a first electron transport layer, a light-absorbing quantum dot layer, a hole transport layer, a light-emitting quantum dot layer, a second electron transport layer and a cathode layer. The cathode layer is in direct contact with the CIS. The light-absorbing quantum dot layer absorbs IR that enters the conversion area through the IR filter and then generates electron-hole pairs. Electron-hole pairs are recombined in the light-emitting quantum dot layer to excite red, green, and blue visible lights.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:紅外光全彩影像感測器</p>  
        <p type="p">102:隔離部件</p>  
        <p type="p">104:陰極層</p>  
        <p type="p">106:陽極層</p>  
        <p type="p">BC:藍色光轉換單元</p>  
        <p type="p">BL:藍色光</p>  
        <p type="p">CA:轉換區</p>  
        <p type="p">CIS:CMOS影像感測器</p>  
        <p type="p">ETL1:第一電子傳輸層</p>  
        <p type="p">ETL2:第二電子傳輸層</p>  
        <p type="p">F1、F2、F3:紅外光濾光片</p>  
        <p type="p">GC:綠色光轉換單元</p>  
        <p type="p">GL:綠色光</p>  
        <p type="p">HTL:電洞傳輸層</p>  
        <p type="p">IR:紅外光</p>  
        <p type="p">LA1、LA2、LA3:吸光量子點層</p>  
        <p type="p">LE1、LE2、LE3:發光量子點層</p>  
        <p type="p">RC:紅色光轉換單元</p>  
        <p type="p">RL:紅色光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="214" publication-number="202612617"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612617.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612617</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135778</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電動椅底座及包含該電動椅底座的電動椅</chinese-title>  
        <english-title>BASE FRAME OF ELECTRIC CHAIR AND ELECTRIC CHAIR HAVING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">A47C1/031</main-classification>  
        <further-classification edition="200601120241105B">A61G5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力陽工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG LIBER INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳科伯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KO-PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方孟隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, MENG-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電動椅底座，具有第一底座、第二底座與第三底座，第二底座設置於第一底座並能後傾擺動，第三底座設置於第二底座並能升降移動，另以升降伸縮桿拉動第三底座升降移動，於第三底座降至最底點時，因第三底座不能再下降，則可帶動第二底座後傾擺動，藉此，能以單一伸縮桿控制升降調整高度與擺動傾斜兩種動作，兼具簡潔構造與多樣化動作特點，在可控制的成本之下，提供能自由調整高度的使用功能，具極佳的市場價值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention reveals a base frame of electric chair, which has a first base, a second base, and a third base. The second base is provided on the first base and can tilt backward. The third base is provided on the second base and can move up and down. The third base is pulled up and down by an electric lifting telescopic rod. When the third base reaches the lowest position, where the third base can no longer go down, the second base can be driven to tilt backwards. As such, the lifting and the tilting can be controlled by a single telescopic rod. It provides the function of freely adjusting height at a controllable cost and has excellent market value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:第二基座</p>  
        <p type="p">51:安裝部</p>  
        <p type="p">52:承靠部</p>  
        <p type="p">53:樞接座</p>  
        <p type="p">54:滑軌</p>  
        <p type="p">60:第三基座</p>  
        <p type="p">71:第一升降桿</p>  
        <p type="p">72:輔助桿</p>  
        <p type="p">73:第一平衡桿</p>  
        <p type="p">74:滑座</p>  
        <p type="p">75:助力桿</p>  
        <p type="p">76:樞接軸</p>  
        <p type="p">80:升降伸縮桿</p>  
        <p type="p">121:第二升降桿</p>  
        <p type="p">122:第二平衡桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="215" publication-number="202614088"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614088.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614088</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135779</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>畫鐘測驗的評分方法</chinese-title>  
        <english-title>SCORING METHOD FOR CLOCK DRAWING TEST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241007B">G16H50/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺北大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIPEI UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林道通</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, DAW-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐煜昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種畫鐘測驗的評分方法。所述評分方法包括：尋找待測影像中的時鐘物件的中心位置；偵測時鐘物件中的多個數字分別在待測影像中的多個座標資訊；基於中心位置以及各數字的座標資訊，計算第一分數；透過直線偵測演算法來偵測時鐘物件的時針以及分針，並確認時針及分針分別指向的第一方向及第二方向；基於第一方向及第二方向，計算第二分數；以及基於第一分數與第二分數，獲得輸出分數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A scoring method for clock drawing test is provided. The scoring method includes: finding a center position of a clock object in an image to be measured; detecting multiple coordinate information of multiple numbers in the clock object in the image to be measured; calculating a first score based on the center position and the coordinate information of each number; detecting a hour hand and a minute hand of the clock object through a straight line detection algorithm, and confirming a first direction and a second direction that the hour hand and minute hand point to respectively; calculating a second score based on the first direction and the second direction; and obtaining an output score based on the first score and the second score.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S305~S330:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="216" publication-number="202613483"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613483.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613483</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135780</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於冷卻水塔之扁平式永磁同步直驅馬達</chinese-title>  
        <english-title>A FLAT PERMANENT-MAGNETIC SYNCHRONOUS DIRECT DRIVE MOTOR APPLIED TO A COOLING TOWER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">F28F27/00</main-classification>  
        <further-classification edition="200601120241105B">F28C3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴柏端</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, PO-TUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴柏端</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, PO-TUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明用於冷卻水塔之扁平式永磁同步直驅馬達，其安裝於一冷卻水塔使用，利用該永磁同步直驅馬達之轉子芯之直徑大於該轉子芯之高度設計，故使該永磁同步直驅馬達之殼體得以呈扁平之低重心型態的安裝於該冷卻水塔上穩定使用，再加上該永磁同步直驅馬達具有構件簡單且具高負載慣量特性，並且使用上具有可穩定起動或停止一風葉的運轉，亦避免反電動勢造成該永磁同步直驅馬達之變頻啟動器損壞，以保障變頻啟動器正常使用，不僅大幅降低該扁平式永磁同步直驅馬達之整體後續維修成本，更能達到降低該冷卻水塔之安裝成本及該扁平式永磁同步直驅馬達之故障率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flat permanent-magnetic synchronous direct drive motor is disposed on a cooling tower and is characterised in that a diameter of a rotor core of the motor is greater than a height of the rotor core so that a housing of the motor is flat in shape for contributing to a lower center of gravity. This arrangement allows the motor to be stably mounted on the cooling tower and used. The motor includes simplified elements and possesses high load inertia. The use of the motor allows a fan member to be actuated or come to a halt in a stable manner and also prevents counter electromotive force from damaging a variable-frequency starter of the motor, thereby allowing the variable-frequency starter to be in normal operation. As a whole, the maintenance costs of the motor can be greatly reduced, and the cost of installing the cooling tower and the failure rate of the motor can also be decreased.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:扁平式永磁同步直驅馬達</p>  
        <p type="p">31:殼體</p>  
        <p type="p">32:定子</p>  
        <p type="p">33:轉子</p>  
        <p type="p">34:接線盒</p>  
        <p type="p">35:導熱封膠</p>  
        <p type="p">36:底座</p>  
        <p type="p">37:軸承</p>  
        <p type="p">321:線圈</p>  
        <p type="p">331:軸桿</p>  
        <p type="p">332:轉子芯</p>  
        <p type="p">333:永磁體</p>  
        <p type="p">332D:轉子芯之直徑</p>  
        <p type="p">332H:轉子芯之高度</p>  
        <p type="p">341:接線插頭</p>  
        <p type="p">31D:殼體之直徑</p>  
        <p type="p">31H:殼體之高度</p>  
        <p type="p">44:風葉組</p>  
        <p type="p">441:風葉</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="217" publication-number="202613388"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613388.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613388</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135781</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有隱藏式瀝水盤的水槽</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">E03C1/18</main-classification>  
        <further-classification edition="201901120241105B">E03C1/186</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>登美廚具實業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡巽洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡建全</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種具有隱藏式瀝水盤的水槽，其包括：一水槽及一瀝水盤；該水槽的一側壁近上端緣處設有一貫穿部，貫穿部水平延伸並連通側壁的內面與外面；該瀝水盤為表面設有多數瀝水孔的盤體，其一側邊穿入水槽的貫穿部中，使瀝水盤能以水平方向被推進貫穿部中並隱藏在流理台或廚櫃台面的下方，也能以水平方向被拉出來跨置在水槽上。藉此本發明能提供使用者需要瀝水盤時再拉出來放在水槽上，而不使用瀝水盤時可推到流理台或廚櫃台面下方的隱藏位置，達到方便取出使用與收藏以及不佔空間收藏等功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:水槽</p>  
        <p type="p">11:底壁</p>  
        <p type="p">12:周側壁</p>  
        <p type="p">13:貫穿部</p>  
        <p type="p">14:支撐階</p>  
        <p type="p">20:瀝水盤</p>  
        <p type="p">21:瀝水孔</p>  
        <p type="p">22:周側壁</p>  
        <p type="p">23:卡掣部</p>  
        <p type="p">24:刀具插孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="218" publication-number="202614186"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614186.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614186</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135785</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>穿孔基板蝕刻設備與方法</chinese-title>  
        <english-title>THROUGH VIA SUBSTRATE ETCHING APPARATUS AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240927B">H01L21/302</main-classification>  
        <further-classification edition="200601120240927B">H01L21/66</further-classification>  
        <further-classification edition="200601120240927B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞智科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANZ TAIWAN LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林楠皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, NAN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝獻益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HSIEN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳政哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHENG-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉箐茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種穿孔基板蝕刻設備與方法，其可以在初次或需要時對蝕刻處理後之基板檢測，並在通過檢測後，以通過檢測時對應的累積蝕刻時間對後續其他基板進行蝕刻處理。如此一來，穿孔基板處理設備與方法能夠減少製造時間及檢測時間，並提升製造良率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S401~S412:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="219" publication-number="202613956"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613956.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613956</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135787</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理設備與方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241104B">G06Q50/04</main-classification>  
        <further-classification edition="200601120241104B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞智科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANZ TAIWAN LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林楠皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, NAN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝獻益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HSIEN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳政哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHENG-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉箐茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基板處理設備與方法，其可以在初次或需要時對特定處理後之基板檢測，並在通過檢測後，以通過檢測時對應的累積處理時間對後續其他基板進行特定處理，其中特定處理可以是改質處理、蝕刻處理、填孔處理或塗鍍處理。如此一來，基板處理設備與方法能夠減少製造時間及檢測時間，並提升製造良率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S401~S412:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="220" publication-number="202614534"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614534.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614534</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135788</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>動能循環裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">H02J15/00</main-classification>  
        <further-classification edition="200601120250512B">H02J7/04</further-classification>  
        <further-classification edition="200601120250512B">H02K7/18</further-classification>  
        <further-classification edition="200601120250512B">H02K7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三立通科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOLUTION LEADER TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林登基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, DENG-JI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇彥文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為有關一種動能循環裝置，其作動時主要為當驅動裝置利用儲電元件供電運作，以配合帶動件讓第一偏心軸與第二偏心軸同步旋轉時，乃藉由第一、第二實心部與第一、第二空心部的設計，在轉動同時利用重力及慣性，產生對第一、第二偏心軸轉動的助力，以減少驅動裝置帶動發電裝置運作的電力，且第一、第二實心部始終保持位置相反，達到重力平衡、避免產生額外阻力，再結合加速機構提升發電裝置的發電效益，而產出之電能經由轉換裝置的整流模組或變壓裝置給電輸出元件，以透過人機介面選擇直流輸出單元與交流輸出單元的輸出電壓，或透過回流單元回存至儲電元件，藉此減少電能損耗、降低運作噪音、及達到電能回充再利用。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">1:驅動裝置</p>  
        <p type="p">11:儲電元件</p>  
        <p type="p">21:第一偏心軸</p>  
        <p type="p">211:第一實心部</p>  
        <p type="p">212:第一空心部</p>  
        <p type="p">22:第二偏心軸</p>  
        <p type="p">221:第二實心部</p>  
        <p type="p">222:第二空心部</p>  
        <p type="p">23:帶動件</p>  
        <p type="p">3:加速機構</p>  
        <p type="p">4:發電裝置</p>  
        <p type="p">5:轉換裝置</p>  
        <p type="p">51:整流模組</p>  
        <p type="p">52:變壓模組</p>  
        <p type="p">6:電輸出元件</p>  
        <p type="p">61:直流輸出單元</p>  
        <p type="p">62:交流輸出單元</p>  
        <p type="p">63:回流單元</p>  
        <p type="p">7:人機介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="221" publication-number="202613452"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613452.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613452</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135789</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遮光設備</chinese-title>  
        <english-title>SHADING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">F21V1/12</main-classification>  
        <further-classification edition="200601120241202B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明基電通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENQ CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江進富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHIN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張永燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YUNG-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有照明功能的遮光設備，應用於一顯示螢幕。該遮光設備包含有一遮光罩以及一對色燈模組。該遮光罩設置在該顯示螢幕。該遮光罩包含一頂板、一第一側板、一第二側板以及一第一結合元件。該頂板安裝在該顯示螢幕之一頂側。該第二側板相對於該第一側板。該第一結合元件設置在該頂板。該對色燈模組設置在該遮光罩上。該對色燈模組包含一承載件、一第二結合元件以及一照明燈座。該承載件具有一容置部、一連接部與一定位部。該第二結合元件設置在該容置部並以可分離方式結合該第一結合元件。該照明燈座以可旋轉方式設置在該連接部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A shading apparatus with an illumination function is applied to a display panel. The shading apparatus includes a shelter and a color assessment light module. The shelter is disposed on the display panel, and includes a top member, a first lateral member, a second lateral member and a first assembling component. The top member is disposed on an upper side of the display panel. The second lateral member is relative to the first lateral member. The first assembling component is disposed on the top member. The color assessment light module is disposed on the shelter, and includes a supporting component, a second assembling component and an illumination holder. The supporting component includes an accommodating portion, a connecting portion and a position portion. The second assembling component is detachably disposed on the accommodating portion and assembled with the first assembling component. The illumination holder is rotatably disposed on the connecting portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:遮光設備</p>  
        <p type="p">14:遮光罩</p>  
        <p type="p">16:對色燈模組</p>  
        <p type="p">18:頂板</p>  
        <p type="p">181:第一端邊</p>  
        <p type="p">182:第二端邊</p>  
        <p type="p">20:第一側板</p>  
        <p type="p">22:第二側板</p>  
        <p type="p">24:第一結合元件</p>  
        <p type="p">25:吸光元件</p>  
        <p type="p">26:承載件</p>  
        <p type="p">28:第二結合元件</p>  
        <p type="p">30:照明燈座</p>  
        <p type="p">32:破孔區</p>  
        <p type="p">34:容置部</p>  
        <p type="p">36:連接部</p>  
        <p type="p">38:定位部</p>  
        <p type="p">40:轉軸</p>  
        <p type="p">42:穿孔結構</p>  
        <p type="p">44:遮光條</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="222" publication-number="202613072"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613072.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613072</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135790</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>Type　I/Type　II複合型可見光三苯胺肟酯衍生物光起始劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">C07C251/64</main-classification>  
        <further-classification edition="200601120241007B">C08F2/50</further-classification>  
        <further-classification edition="200601120241007B">C08J3/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立高雄科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳永忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凃維庠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡坪芫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明乃是一種Type I/Type II複合型可見光三苯胺肟酯衍生物光起始劑，本專利以WH-2為基礎於三苯胺的R位置上導入苯基酮及其對位含有不同推電子取代基團，製備出衍生物分別為對位具甲氧基之TU-1、具第三丁基之TU-2、具氫基之TU-3、具甲基之TU-4。除了比較其光反應特性外，亦評估可見光波長Type I和Type II複合型三苯胺肟酯光起始劑之可行性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="223" publication-number="202613490"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613490.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613490</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135798</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>整合干涉儀定位回授之晶圓厚度變化檢測設備</chinese-title>  
        <english-title>TESTING APPARATUS FOR TESTING CHANGE OF THICKNESS OF A WAFER AND COUPLED WITH AN INTERFEROMETER FEEDBACK SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G01B11/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立虎尾科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃學良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSUEH-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>覺文郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JYWE, WEN-YUH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳家鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林冠辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUAN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡文修</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種整合干涉儀定位回授之晶圓厚度變化檢測設備，其包含有一機台、一運動平台系統、一干涉儀量測回授系統及一對稱型共焦式探頭厚度量測系統，該運動平台系統係設置於機台上並包含有兩線性馬達，及由兩線性馬達所雙軸驅動的一承載平台，該干涉儀量測回授系統係設置於機台上，其包含有一雷射本體、一分光鏡、數個轉角鏡及兩位於承載平台上的長條反射鏡，該對稱型共焦式探頭厚度量測系統，係可移動地設置於機台上，其包含有上下對稱擺設之兩共焦式探頭。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a testing apparatus for testing change of thickness of a wafer and coupled with an interferometer feedback system. The apparatus has a base, a moving platform system, an interferometer feedback system, and a symmetry confocal thickness-testing probe system. The moving platform system is disposed on the base and has two linear motors and a platform driven by the two linear motors. The interferometer feedback system is mounted on the base and has a laser body, a beam splitter, multiple angle mirrors, and two longitudinal reflective mirrors mounted on the platform. The symmetry confocal thickness-testing probe system is mounted moveably on the base and has two symmetry confocal probes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:機台</p>  
        <p type="p">20:運動平台系統</p>  
        <p type="p">30:干涉儀量測回授系統</p>  
        <p type="p">40:對稱型共焦式頭厚度量測系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="224" publication-number="202613572"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613572.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613572</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135804</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓測機構之檢測裝置與方法</chinese-title>  
        <english-title>DEVICE AND METHOD FOR INSPECTING A TEST MECHANISM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241105B">G01R31/26</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽品精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳錫池</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSI-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林明仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MING-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓訓永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, HSUN-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭凌飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, LING FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TSUNG TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種壓測機構之檢測裝置與方法。該壓測機構包括氣囊及壓測頭，該壓測頭用於擷取電子元件，該氣囊用於在充氣時推動該壓測頭，以將該電子元件壓入測試機台之測試座，俾進行該電子元件之通電測試。該檢測裝置與方法能檢測該氣囊中之氣壓是否正常，且能檢測該壓測頭是否水平，以判斷該壓測機構是否能準確進行電子元件之通電測試，俾解決習知壓測機構之氣囊漏氣或壓測頭傾斜時無法發出警示而導致通電測試不準之缺點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device and a method for inspecting a test mechanism are provided. The test mechanism includes an airbag and a pick-up head. The pick-up head is configured to capture an electronic component. The airbag is configured to actuate the pick-up head when inflated to press the electronic component into a test socket of a test rig to conduct a power-up test of the electronic component. The device and the method can inspect whether the air pressure in the airbag is normal or not, and can inspect whether the pick-up head is level or not, in order to determine whether the test mechanism can accurately perform the power-up test of the electronic component, so as to solve the disadvantage of a conventional test mechanism that cannot give warning when the airbag leaks or the pick-up head is tilted, which leads to an inaccurate power-up test.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31:壓測機構</p>  
        <p type="p">312:氣囊</p>  
        <p type="p">313:壓測頭</p>  
        <p type="p">3131:平面</p>  
        <p type="p">32:檢測裝置</p>  
        <p type="p">321:氣體管路</p>  
        <p type="p">322:氣壓感測器</p>  
        <p type="p">323:顯示器</p>  
        <p type="p">324:高度感測器</p>  
        <p type="p">3241:探針</p>  
        <p type="p">341,342:虛線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="225" publication-number="202613675"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613675.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613675</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135817</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及顯示裝置之重工方法</chinese-title>  
        <english-title>DISPLAY DEVICE AND REWORK METHOD OF DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">G02F1/1333</main-classification>  
        <further-classification edition="200601120241202B">G02F1/13357</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亮巖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, LIANG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慧娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUI-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳家豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種顯示裝置及其重工方法。所述顯示裝置包含：顯示模組；設置於顯示模組下方且包括具有底面之背板之背光模組，其中，背板具有第一開口、第二開口及位於兩者之間之擋板；以及各別包括基材及卡合板之定位元件。基材自顯示模組延伸至底面並依序自第一開口及第二開口穿過，使得基材包含部分容置於擋板內側之第一區段及經由第二開口穿過而位於底面外側之第二區段。卡合板之硬度大於基材之硬度，且包含黏附於第二區段之接附部分及自接附部分朝向第一開口伸出之卡合部分。該擋板至少部分位於第一區段與卡合部分之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a display device and a rework method thereof. The display device includes: a display module; a backlight module disposed below the display module and including a back plate with a bottom surface, wherein the back plate has a first opening, a second opening and a partition located between them; and positioning components each including a base material and a clamping plate. The base material extends from the display module to the bottom surface and passes through the first opening and the second opening in sequence, so that the base material includes a first section partially accommodated inside the partition and a second section passed through the second opening and located outside the bottom surface. The hardness of the clamping plate is greater than the hardness of the base material, and includes an attachment portion adhered to the second section and a clamping portion protruding from the attachment portion toward the first opening. The partition is at least partially located between the first section and the clamping portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示裝置</p>  
        <p type="p">100:顯示模組</p>  
        <p type="p">200:背光模組</p>  
        <p type="p">210:背板</p>  
        <p type="p">220:發光面板</p>  
        <p type="p">250:光學膜片</p>  
        <p type="p">300、400:定位元件</p>  
        <p type="p">310:基材</p>  
        <p type="p">320:卡合板</p>  
        <p type="p">500:定位部</p>  
        <p type="p">800:電路基板</p>  
        <p type="p">810:軟性電路板</p>  
        <p type="p">BS:底面</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">S1:第一側邊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="226" publication-number="202612748"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612748.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612748</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135819</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透析液袋</chinese-title>  
        <english-title>DIALYSATE BAGS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">A61M1/28</main-classification>  
        <further-classification edition="200601120250203B">A61M1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商阿瓦克科技私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AWAK TECHNOLOGIES PTE LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝魯爾　本卡塔拉亞　蘇雷什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELUR VENKATARAYA, SURESHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈里　曼達爾　馬諾哈爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GORI, MANDAR MANOHAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許　耀隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOH, YAU LUONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費爾南德斯　喬爾　普雷塔姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FERNANDES, JOEL PREETHAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕夫拉克　馬爾辛　巴特洛米耶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAWLAK, MARCIN BARTLOMIEJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多納迪奧　亞歷山德羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONADIO, ALESSANDRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿吉拉爾　格拉赫達　里卡多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGUILAR GRAJEDA, RICARDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海伍德　彼得　費迪南德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYWOOD, PETER FERDINAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳啟桐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖和信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一透析液袋以及涉及該透析液袋的系統和方法被公開。該透析液袋包括一第一進/出口、一第二進/出口，以及一個包含腹膜濃縮透析液的內腔室，該內腔室與第一和第二進/出口流體連接。當第一和第二進/出口處於開啟狀態時，每個進/出口都會使內腔室流體連接到透析液袋的外部；當處於關閉狀態時，每個第一和第二進/出口會將內腔室與透析液袋的外部流體隔離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are dialysate bags, and systems and methods involving the dialysate bags. The dialysate bag comprises a first inlet/outlet port; a second inlet/outlet port; and an inner chamber comprising a peritoneal dialysate concentrate, the inner chamber being fluidly connected to the first and second inlet/outlet ports, wherein the first and second inlet/outlet ports have an open state and a closed state, when in the open state each of the first and second inlet/outlet ports fluidly connect the inner chamber to an exterior of the dialysate bag, and when in the closed state each of the first and second inlet/outlet ports fluidly isolates the inner chamber from the exterior of the dialysate bag.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:透析液袋</p>  
        <p type="p">101:第一區域</p>  
        <p type="p">102:第二區域</p>  
        <p type="p">103:可破碎屏障</p>  
        <p type="p">104:水源</p>  
        <p type="p">105:第一流體進/出口</p>  
        <p type="p">106:第二進/出口</p>  
        <p type="p">1001、1002:連接管</p>  
        <p type="p">1003:單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="227" publication-number="202613795"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613795.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613795</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135823</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人工智慧模型的操作引導方法以及電子裝置</chinese-title>  
        <english-title>OPERATION GUIDANCE METHOD OF ARTIFICIAL INTELLIGENCE MODEL AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241007B">G06F3/0481</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁寶電腦工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMPAL ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陽耀賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YAO-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZOU, JYH-CHYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫孟儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MENG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉漢財</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HAN-TSAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種人工智慧模型的操作引導方法以及電子裝置。人工智慧模型的操作引導方法包括以下步驟：接收輸入資料；分析輸入資料，以根據輸入資料產生輸入選項以及風格選項的至少一提示子選項；透過使用者介面顯示輸入選項、風格選項以及生成選項；根據輸入選項以及風格選項分別的至少一提示子選項以及生成選項的選項執行結果來生成模型輸入資料；以及將模型輸入資料輸入至人工智慧模型，以使人工智慧模型根據模型輸入資料產生輸出資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An operation guidance method of an artificial intelligence model and an electronic device are provided. The operation guidance method of the artificial intelligence model includes the following steps: receiving input data; analyzing the input data to generate at least one prompt sub-option of an input option and a style option based on the input data; displaying the input option, the style option and a generation option through an user interface; generating model input data according to an option execution result of the at least one prompt sub-option of the input option and the style option respectively, and the generation option; and inputting the model input data to the artificial intelligence model, so that the artificial intelligence model generates output data based on the model input data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210~S250:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="228" publication-number="202613336"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613336.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613336</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135824</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鐵基非晶合金磁粉的製造方法及其設備、鐵基磁粉芯及其製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD FOR IRON-BASED AMORPHOUS ALLOY MAGNETIC POWDER AND EQUIPMENT THEREOF, IRON-BASED MAGNETIC POWDER CORE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">C22C45/02</main-classification>  
        <further-classification edition="202201120241128B">B22F1/00</further-classification>  
        <further-classification edition="200601120241128B">B22F9/02</further-classification>  
        <further-classification edition="200601120241128B">H01F1/153</further-classification>  
        <further-classification edition="200601120241128B">H01F3/08</further-classification>  
        <further-classification edition="200601120241128B">H01F41/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡朝棋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAIN, CHAOCHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊子毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TZU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種鐵基非晶合金磁粉的製造方法及其設備、一種鐵基磁粉芯及其製造方法。鐵基非晶合金磁粉的製造方法包含兩道次的水霧化步驟。用於形成鐵基非晶合金磁粉的設備包含在第二道水霧化區域中的多個噴嘴。獲得的鐵基非晶合金磁粉經過篩分步驟、造粒步驟、壓製成型步驟以及退火步驟，以形成鐵基磁粉芯。獲得的鐵基磁粉芯具有較高的導磁率和較低的磁損。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a manufacturing method for an iron-based amorphous alloy magnetic powder and equipment thereof, an iron-based magnetic powder core and a manufacturing method thereof. The manufacturing method for the iron-based amorphous alloy magnetic powder includes two water atomization steps. The equipment used to form the iron-based amorphous alloy magnetic powder includes a plurality of nozzles in a second water atomization zone. The obtained iron-based amorphous alloy magnetic powder is subjected to a sieving step, a granulation step, a pressing step, and an annealing step to form the iron-based magnetic powder core. The obtained iron-based magnetic powder core has higher magnetic permeability and lower magnetic loss.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">110,120,130:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="229" publication-number="202612979"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612979.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612979</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135825</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>風力發電之半潛式浮動平台</chinese-title>  
        <english-title>SEMI-SUBMERSIBLE FLOATING PLATFORM FOR WIND POWER GENERATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241203B">B63B35/44</main-classification>  
        <further-classification edition="202001120241203B">B63B75/00</further-classification>  
        <further-classification edition="201601120241203B">F03D9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞獵士科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALEX GLOBAL TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳威瑾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳豐裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種風力發電之半潛式浮動平台，係包含有一承板，所述承板可對應供安裝風電系統，再於所述承板下方設有多數個浮力座，所述浮力座為一具有內部空間的框體，於所述內部空間置放有多數個中空浮體單元，所述中空浮體單元為由合金基材經擠壓或捲彎焊接成中空管，再將二端封口加工後，經排列組裝固定而成；藉此，透過中空管的簡易組裝結合，有效簡化施工程序與時間，達到降低成本及增加結構強度的功效，同時，也具備有消波、消音、防搖晃及防腐蝕等效益。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a semi-submersible floating platform for wind power generation, which comprises a supporting plate that is designed to accommodate the installation of a wind power system. Below the supporting plate, multiple buoyancy seats are arranged. Each buoyancy seat is a frame structure with an internal space, within which multiple hollow buoyancy units are placed. These hollow buoyancy units are made of alloy materials that are extruded or roll-bent and welded into hollow tubes, then both ends are sealed. The hollow buoyancy units are fixed together through an arranged assembly. Through the simple assembly of the hollow tubes, the construction process and time are effectively simplified, achieving cost reduction and increased structural strength. Additionally, the platform provides benefits such as wave absorption, noise reduction, anti-sway, and corrosion resistance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:浮動平台</p>  
        <p type="p">1:承板</p>  
        <p type="p">2:浮力座</p>  
        <p type="p">21:框體</p>  
        <p type="p">211:內部空間</p>  
        <p type="p">22:蓋板</p>  
        <p type="p">23:中空浮體單元</p>  
        <p type="p">3:風電系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="230" publication-number="202613010"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613010.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613010</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135826</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吸附式基板裁切裝置</chinese-title>  
        <english-title>ADSORPTION SUBSTRATE CUTTING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B65G47/91</main-classification>  
        <further-classification edition="200601120241105B">B25J15/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張方睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, FANG-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張方睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, FANG-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>時渝恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種吸附式基板裁切裝置，其包含：承載部件，其頂端具有一承載面，所述承載面間係對應形成一平面，並於至少一側緣處界定有一裁切位置；承載面設有複數氣孔；通氣管路，其係對應組接所述承載部件；一抽取裝置，其係對應連通於所述通氣管路，用以於一吸附狀態時，令所述通氣管路及所述腔室形成負壓，以令所述承載部件透過所述氣孔進行吸附者；裁切裝置，其係傳動配置有一刀具；藉此，本發明係可透過承載部件之氣孔以對應吸附定位一基板，並透過裁切裝置對基板進行裁切，以有效防止基板於裁切過程中位移，並可使裁切後之基板尺寸可予一致化，以提升裁切精度，進而可增進後續加工或成品之品質者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an adsorption substrate cutting device, which includes: a carrier component with a carrying surface at the top that has a corresponding flat area, defining a cutting position at least along one edge; the carrying surface is equipped with multiple air holes. Then, a vent line that is correspondingly connected to the carrier component, and a suction device that is correspondingly connected to the vent line to create a negative pressure in the vent line and chamber during an adsorption state, allowing the carrier component to adsorb through the air holes. Additionally, the device includes a cutting device equipped with a cutting tool. This invention allows for the positioning and adsorption of a substrate through the air holes of the carrier component, and enables the cutting device to cut the substrate, effectively preventing the substrate from shifting during the cutting process, while ensuring that the dimensions of the cut substrate are standardized. This enhances cutting precision and subsequently improves the quality of further processing or finished products.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:承載部件</p>  
        <p type="p">11:腔室</p>  
        <p type="p">12:承載面</p>  
        <p type="p">13:氣孔</p>  
        <p type="p">14:升降裝置</p>  
        <p type="p">2:載台</p>  
        <p type="p">3:通氣管路</p>  
        <p type="p">31:通氣艙</p>  
        <p type="p">4:抽取裝置</p>  
        <p type="p">5:裁切裝置</p>  
        <p type="p">51:刀具</p>  
        <p type="p">52:移動裝置</p>  
        <p type="p">521:驅動裝置</p>  
        <p type="p">522:螺桿</p>  
        <p type="p">53:鏤空部</p>  
        <p type="p">6:基板</p>  
        <p type="p">7:天車</p>  
        <p type="p">71:轉軸</p>  
        <p type="p">72:輸送裝置</p>  
        <p type="p">73:校準單元</p>  
        <p type="p">8:旋轉平台</p>  
        <p type="p">S:平面</p>  
        <p type="p">R:裁切位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="231" publication-number="202614798"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614798.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614798</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135829</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製造方法以及高電子遷移率電晶體及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF, AND HIGH ELECTRON MOBILITY TRANSISTOR AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/47</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃敬源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, KING-YUEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴俊豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHUN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種半導體結構，其包含一基板、一通道層、一阻障層、一閘極結構、一第一鈍化層及一第二鈍化層。通道層設置於基板。阻障層設置於通道層。閘極結構與第一鈍化層設置於阻障層。第二鈍化層設置於第一鈍化層，且第二鈍化層的一材料組成不同於第一鈍化層的一材料組成。通道層靠近阻障層處具有二第一二維電子氣區域，且二第一二維電子氣區域分別位於閘極結構的二側。阻障層靠近第一鈍化層處具有二第二二維電子氣區域，且二第二二維電子氣區域分別位於閘極結構的二側。藉此，可具有增強型及雙通道之效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure includes a substrate, a channel layer, a barrier layer, a gate structure, a first passivation layer and a second passivation layer. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The gate structure and the first passivation layer are disposed on the barrier layer. The second passivation layer is disposed on the first passivation layer, and a material composition of the second passivation layer is different from a material composition of the first passivation layer. The channel layer has two first two-dimensional electron gas regions near the barrier layer, and the two first two-dimensional electron gas regions are respectively located on two sides of the gate structure. The barrier layer has two second two-dimensional electron gas regions near the first passivation layer, and the two second two-dimensional electron gas regions are respectively located on two sides of the gate structure. Therefore, the semiconductor structure can have enhancement-mode and dual-channel effects.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體結構</p>  
        <p type="p">102:基板</p>  
        <p type="p">104:緩衝層</p>  
        <p type="p">106:通道層</p>  
        <p type="p">108:阻障層</p>  
        <p type="p">110:閘極結構</p>  
        <p type="p">112:半導體層</p>  
        <p type="p">114:閘極電極</p>  
        <p type="p">120:第一鈍化層</p>  
        <p type="p">122:第二鈍化層</p>  
        <p type="p">R1:第一二維電子氣區域</p>  
        <p type="p">R2:第二二維電子氣區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="232" publication-number="202613344"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613344.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613344</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135832</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>異質過渡金屬硫族化物材料、其製備方法及感測器</chinese-title>  
        <english-title>JANUS TRANSITION METAL DICHALCOGENIDE MATERIAL, METHOD FOR FABRICATING THEREOF, AND SENSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">C23C16/30</main-classification>  
        <further-classification edition="200601120241104B">G01N21/65</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>闕郁倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUEH, YU-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭毓仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, YU-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種異質過渡金屬硫族化物材料的製備方法，其包含進行加熱步驟、進行電漿形成步驟以及進行沉積步驟。加熱步驟為於加熱溫度下對硫族元素固體進行加熱以形成硫族元素氣體。電漿形成步驟為通入反應氣體以輔助硫族元素氣體形成硫族元素電漿。沉積步驟為將基板設置鄰近於硫族元素電漿，基板包含基材及鍍層，硫族元素電漿與鍍層於反應溫度與反應壓力下進行沉積反應，以形成具有優異的光學特性和表面增強拉曼散射效應的異質過渡金屬硫族化物材料。藉此，異質過渡金屬硫族化物材料可應用於表面增強拉曼散射的感測器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a method for fabricating a Janus transition metal dichalcogenide including a heating step, a plasma-forming step, and a depositing step. The heating step is to heat a chalcogenide solid to form a chalcogenide gas with a heating temperature. The plasma-forming step is to introduce a reaction gas to assist the chalcogenide gas to form a chalcogenide plasma. The depositing step is to put a substrate near the chalcogenide plasma, in which the substrate includes a base layer and a coating layer. A deposition reaction is performed between the chalcogenide plasma and the coating layer at a reaction temperature and a reaction pressure to form the Janus transition metal dichalcogenide with excellent optical properties and surface-enhanced Raman scattering effects. Therefore, the Janus transition metal dichalcogenide can be applied to a sensor with the surface-enhanced Raman scattering.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:異質過渡金屬硫族化物材料的製備方法</p>  
        <p type="p">101,102,103:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="233" publication-number="202612664"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612664.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612664</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135836</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>頭型矯正頭盔</chinese-title>  
        <english-title>HEAD SHAPE CORRECTION HELMET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">A61F5/01</main-classification>  
        <further-classification edition="200601120241125B">A42B3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昌駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHANG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周邦昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, PANG-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳孟澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MENG-TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種頭型矯正頭盔，包含一外殼本體以及一內襯本體。外殼本體具有一內表面。內襯本體設置於內表面，其中內襯本體包含複數個內襯結構。所述內襯結構環設於內表面，且所述內襯結構彼此連接並連續地形成內襯本體。頭型矯正頭盔具有一縱向軸線，且內襯本體垂直於縱向軸線的一切面呈多邊形。藉此，本揭示內容之頭型矯正頭盔可穩定地固定於使用者的頭部，進而有利於提升臨床治療的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a head shape correction helmet including an outer shell mainbody and an inner lining mainbody. The outer shell mainbody has an inner surface. The inner lining mainbody is disposed on the inner surface, wherein the inner lining mainbody includes a plurality of inner lining structures. The inner lining structures surround and are disposed on the inner surface, and the inner lining structures are connected to each other and continuously form the inner lining mainbody. The head shape correction helmet has a longitudinal axis, and a cutting plane of the inner lining mainbody perpendicular to the longitudinal axis is polygon. Therefore, the head shape correction helmet of the present disclosure can be stably positioned on a user’s head, so that it is favorable for enhancing the clinical treatment effect.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:頭型矯正頭盔</p>  
        <p type="p">110:外殼本體</p>  
        <p type="p">120:內襯本體</p>  
        <p type="p">A:縱向軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="234" publication-number="202613991"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613991.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613991</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135838</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>交通事故警示系統及方法</chinese-title>  
        <english-title>TRAFFIC ACCIDENT WARNING SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241206B">G08B21/24</main-classification>  
        <further-classification edition="200601120241206B">G08B3/10</further-classification>  
        <further-classification edition="202201120241206B">G06V20/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳引</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUAN-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳引</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUAN-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種交通事故警示系統，用於：獲得一即時影像資料；利用一事故影像辨識模型判斷該即時影像資料是否呈現出交通事故；在判定該即時影像資料有呈現出交通事故的情形下產生一事故警示資料，並將該事故警示資料以廣播的方式輸出，以供至少一台設置於另一車輛的車載裝置在接收到該事故警示資料後據以輸出一事故警示通知。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a traffic accident warning system which is used for: obtaining a real-time image data; using an accident image recognition model to determine whether the real-time image data presents a traffic accident; generating an accident warning data upon determining the real-time image data presents a traffic accident, and outputting the accident warning data in a broadcast mode for at least one vehicle-mounted device disposed in another vehicle to output an accident warning notification accordingly after receiving the accident warning data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:交通事故警示系統</p>  
        <p type="p">1:處理單元</p>  
        <p type="p">2:儲存單元</p>  
        <p type="p">3:拍攝單元</p>  
        <p type="p">4:無線通訊單元</p>  
        <p type="p">5:定位單元</p>  
        <p type="p">6:輸出單元</p>  
        <p type="p">7:輸入單元</p>  
        <p type="p">20:車載裝置</p>  
        <p type="p">30:車載裝置</p>  
        <p type="p">M1:事故影像辨識模型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="235" publication-number="202614707"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614707.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614707</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135840</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滑軌裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">H05K7/18</main-classification>  
        <further-classification edition="200601120240929B">F16C29/10</further-classification>  
        <further-classification edition="200601120240929B">H05K7/14</further-classification>  
        <further-classification edition="200601120240929B">H05K5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富世達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOSITEK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇家弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王浩評</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAO-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種滑軌裝置，適用於連接一伺服器機箱，伺服器機箱具有一接合件。滑軌裝置包含一中軌單元及一內軌單元。中軌單元包括一中軌及一設置於中軌的擋止復位件。內軌單元包括一可活動地設置於中軌的內軌、一設置於內軌的鎖定件及一設置於內軌且連接鎖定件的解鎖件。內軌具有一朝向中軌的內中面、一第一端、一第二端及一鎖定槽。鎖定槽供接合件伸入，鎖定件可卡抵接合件以防止接合件自鎖定槽脫離。解鎖件可被操作朝第二端移動並推抵鎖定件遠離內中面，以解除鎖定件與接合件的卡抵關係。當內軌單元相對於中軌朝第二端的方向移動時，擋止復位件可抵接解鎖件並推抵解鎖件朝第一端移動而復位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:中軌單元</p>  
        <p type="p">21:中軌</p>  
        <p type="p">211:中內面</p>  
        <p type="p">212:中外面</p>  
        <p type="p">213:內中擋止件</p>  
        <p type="p">214:穿槽</p>  
        <p type="p">222:擋止復位部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="236" publication-number="202614704"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614704.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614704</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135841</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滑軌裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240925B">H05K7/14</main-classification>  
        <further-classification edition="200601120240925B">H05K5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富世達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOSITEK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇家弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王浩評</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAO-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種滑軌裝置，適用於連接一具有一接合件的伺服器機箱，該滑軌裝置包含一中軌及一內軌單元。內軌單元包括一可活動地設置於該中軌的內軌、一設置於該內軌的鎖定件及一設置於該內軌且連接該鎖定件的解鎖件，該內軌具有一朝向該中軌的內中面及一鎖定槽，該鎖定槽供該接合件伸入，該鎖定件可卡抵該接合件以防止該接合件自該鎖定槽脫離，該解鎖件可被操作推抵該鎖定件遠離該內中面，以解除該鎖定件與該接合件的卡抵關係。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:內軌單元</p>  
        <p type="p">31:內軌</p>  
        <p type="p">311:內中面</p>  
        <p type="p">312:內外面</p>  
        <p type="p">313:第一端</p>  
        <p type="p">315:鎖定槽</p>  
        <p type="p">32:鎖定件</p>  
        <p type="p">321:安裝部</p>  
        <p type="p">322:卡抵部</p>  
        <p type="p">322a:卡孔</p>  
        <p type="p">33:解鎖件</p>  
        <p type="p">331:操作部</p>  
        <p type="p">332:包覆部</p>  
        <p type="p">34:脫離操作件組</p>  
        <p type="p">341:脫離操作件</p>  
        <p type="p">341a:脫離平板部</p>  
        <p type="p">342:脫離連接片</p>  
        <p type="p">343:脫離擋止件</p>  
        <p type="p">343a:脫離樞接部</p>  
        <p type="p">343b:脫離擋止部</p>  
        <p type="p">343d:脫離鉤部</p>  
        <p type="p">35:收回操作件組</p>  
        <p type="p">351:收回操作件</p>  
        <p type="p">351a:收回平板部</p>  
        <p type="p">352:收回連接片</p>  
        <p type="p">352a:收回推抵部</p>  
        <p type="p">353:收回擋止件</p>  
        <p type="p">353a:收回樞接部</p>  
        <p type="p">353b:收回擋止部</p>  
        <p type="p">353c:收回致動部</p>  
        <p type="p">353d:收回鉤部</p>  
        <p type="p">36:擋止彈性件</p>  
        <p type="p">4:接合件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="237" publication-number="202613582"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613582.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613582</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135845</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具邊界測試的晶片與邊界測試系統</chinese-title>  
        <english-title>CHIP WITH BOUNDARY TESTING AND BOUNDARY TESTING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241220B">G01R31/3181</main-classification>  
        <further-classification edition="202001120241220B">G06F30/333</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張斯揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SZU-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具邊界測試的晶片包含二待測電路群。在第一推值期間中，第一待測電路群接收第一測試輸入，且第一待測電路群的第一邊界電路在接收第一測試輸入後具有第一邊界資料。在第一推值期間後的第一運算期間中，第二待測電路群的第二邊界電路擷取第一邊界資料，且第二待測電路群根據第一邊界資料執行電路運算以產生第一測試輸出。在第一運算期間後的第二推值期間中，第二待測電路群的第二主電路輸出第一測試輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chip with boundary testing includes two to-be-tested groups. During a first shift-in period, the first to-be-tested group receives a first testing input, and a first boundary circuit of the first to-be-tested group has first boundary data after receiving the first testing input. During a first calculation period after the first shift-in period, a second boundary circuit of the second to-be-tested group captures the first boundary data, and the second to-be-tested group performs a circuit calculation according to the first boundary data to generate a first testing output. During a second shift-in period after the first calculation period, a second main circuit of the second to-be-tested group output the first testing output.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">T1~T2:測試週期</p>  
        <p type="p">S10:步驟</p>  
        <p type="p">S30~S70:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="238" publication-number="202614554"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614554.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614554</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135846</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線性放大裝置及其線性放大方法</chinese-title>  
        <english-title>LINEAR AMPLIFYING DEVICE AND LINEAR AMPLIFYING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">H03F1/32</main-classification>  
        <further-classification edition="200601120241101B">H03F1/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾冠豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, KUAN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王柏之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PO-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種線性放大裝置及線性放大方法是有關於線性放大裝置，其包含一放大電路、一衰減器、一線性器以及一相位位移器。衰減器之一端電性連接於放大電路之輸出端。線性器之輸入端電性連接於衰減器之另一端。相位位移器之一端電性連接於線性器之輸出端，並且相位位移器之另一端電性連接於放大器之輸入端。線性放大方法包含：接收一輸入訊號；根據輸入訊號及一增益產生一輸出訊號；衰減輸出訊號；於衰減後的輸出訊號中產生一非線性載波；調整非線性載波的相位以產生一回授訊號；以及根據輸入訊號、回授訊號及增益產生另一輸出訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A linear amplifying device and a linear amplifying method are related to the linear amplifying device, which includes an amplifying circuit, an attenuator, a linearizer, and a phase shifter. One terminal of the attenuator is electrically connected to an output terminal of the amplifying circuit. An input terminal of the linearizer is electrically connected to the other terminal of the attenuator. One terminal of the phase shifter is electrically connected to an output terminal of the linearizer, and the other terminal of the phase shifter is electrically connected to an input terminal of the amplifier. The linear amplifying method includes: receiving an input signal; generating an output signal according to the input signal and a gain; attenuating the output signal; generating a non-linear carrier wave in the output signal after being attenuated; adjusting a phase of the non-linear carrier wave to generate a feedback signal; and generating another output signal according to the input signal, the feedback signal, and the gain.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:線性放大裝置</p>  
        <p type="p">10:放大電路</p>  
        <p type="p">11:衰減器</p>  
        <p type="p">12:線性器</p>  
        <p type="p">13:相位位移器</p>  
        <p type="p">Sf1,Sf2,Sf3:回授訊號</p>  
        <p type="p">Sin,Sin’:輸入訊號</p>  
        <p type="p">Sout,Sout’:輸出訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="239" publication-number="202614605"> 
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      <tif no="1" file="TIF/202614605.zip"/> 
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      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202614605</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135851</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>投影裝置及其控制方法</chinese-title>  
        <english-title>PROJECTION DEVICE AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241206B">H04N9/31</main-classification>  
        <further-classification edition="202201120241206B">G06F3/0488</further-classification>  
        <further-classification edition="202101120241206B">G03B31/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中強光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORETRONIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳煜騏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳育俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種投影裝置，包括辨識模組、運算判斷單元、控制模組、介面模組、信號處理模組、投影模組以及音訊模組。辨識模組用以產生多個辨識感測資料。運算判斷單元基於該些辨識感測資料識別手勢內容產生控制指令。控制模組判斷控制指令的指令通道對像。指令通道對像為介面模組及/或信號處理模組。介面模組將控制指令傳送至信號源，使信號源相應於控制指令作動。信號處理模組基於控制指令以及輸入資料產生投影資料及/或音訊資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is related to a projection device comprising an identification module, a determining unit, a control module, an interface module, a signal processing module, a projection module and an audio module. The identification module is configured to generate multiple identification sensing data. The determining unit is configured to recognize a gesture content based on the identification sensing data and generate a control instruction. The control module is configured to determine a command channel object of the control command. The command channel object is the interface module and/or signal processing module. The interface module is configured to transmit the control command to a signal source, so that the signal source operates corresponding to the control command. The signal processing module is configured to generate projection data and/or audio data based on the control command and input data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:投影裝置</p>  
        <p type="p">2:信號源</p>  
        <p type="p">100:辨識模組</p>  
        <p type="p">110:手勢辨識模組</p>  
        <p type="p">120:護眼辨識模組</p>  
        <p type="p">200:運算判斷單元</p>  
        <p type="p">300:控制模組</p>  
        <p type="p">400:介面模組</p>  
        <p type="p">410:前端處理器</p>  
        <p type="p">410a:HDMI前處理器</p>  
        <p type="p">410b:VGA前處理器</p>  
        <p type="p">410c:TYPE-C前處理器</p>  
        <p type="p">420:介面接口</p>  
        <p type="p">420a:HDMI接口</p>  
        <p type="p">420b:VGA接口</p>  
        <p type="p">420c:TYPE-C接口</p>  
        <p type="p">500:信號處理模組</p>  
        <p type="p">510:影像處理模組</p>  
        <p type="p">520:聲音處理模組</p>  
        <p type="p">600:投影模組</p>  
        <p type="p">700:音訊模組</p>  
        <p type="p">710:音訊放大模組</p>  
        <p type="p">720:喇叭裝置</p>  
        <p type="p">800:狀態偵測模組</p>  
        <p type="p">900:儲存模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="240" publication-number="202612896"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612896.zip"/> 
    </tif-files>  
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        <document-id> 
          <doc-number>202612896</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135855</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>螢幕貼膜輔助器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241011B">B29C63/02</main-classification>  
        <further-classification edition="200601120241011B">B29C63/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>愛進化科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVOLUTIVE LABS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林釗玄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHAO-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施凱偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, KAI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的螢幕貼膜輔助器包含：一基板，具有一穿透口；一機體固定模組，適於抵固於一行動裝置的側緣；一第一定位模組，具有一第一抵固件及一第一彈性件，該第一抵固件及該第一彈性件皆凸出於該第一表面，並以一第一方向相對地設於該穿透口外周；及一第二定位模組，具有一第二抵固件及一第二彈性件，該第二抵固件及該第二彈性件皆凸出於該第一表面，並以一第二方向相對地設於該穿透口外周，該第二方向不同於該第一方向；其中，該第一抵固件、該第二抵固件、該第一彈性件及該第二彈性件共同圈圍以定義適於容納一保護貼的一容室。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">1a:第一表面</p>  
        <p type="p">11:穿透口</p>  
        <p type="p">12:簍空部</p>  
        <p type="p">14:環牆</p>  
        <p type="p">2:機體固定模組</p>  
        <p type="p">21:擋片</p>  
        <p type="p">211:外凸部</p>  
        <p type="p">212:肋</p>  
        <p type="p">22:推抵件</p>  
        <p type="p">3:第一定位模組</p>  
        <p type="p">31:第一抵固件</p>  
        <p type="p">32:第一彈性件</p>  
        <p type="p">4:第二定位模組</p>  
        <p type="p">41:第二抵固件</p>  
        <p type="p">42:第二彈性件</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">E:行動裝置</p>  
        <p type="p">M:保護貼</p>  
        <p type="p">S:容室</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="241" publication-number="202613916"> 
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      <tif no="1" file="TIF/202613916.zip"/> 
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        <document-id> 
          <doc-number>202613916</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135857</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>出票組件及出票設備</chinese-title>  
        <english-title>TICKET DISPENSING MODULE AND TICKET DISPENSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120240927B">G06Q20/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐士銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OU, SHI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種出票組件，適用於出票機，其中出票組件包括導引板、第一樞接部、出票板以及第二樞接部。導引板具有導引正面與相對於導引正面的導引背面。第一樞接部設置於導引背面，並包括第一調節件。出票板具有出票正面與相對於出票正面的出票背面。第二樞接部設置於出票背面，並包括第二調節件。第一樞接部樞接於第二樞接部，導引正面鄰接出票正面，第一調節件與第二調節件配合，以調整導引正面與出票正面之間的夾角。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A ticket dispensing module is suitable for a ticket dispensing machine, wherein the ticket dispensing module includes a guide plate, a first pivot joint part, a ticket dispensing plate, and a second pivot joint part. The guide plate has a guide front side and a guide back side relative to the guide front side. The first pivot joint part is disposed on the guide back side and includes a first adjusting member. The ticket dispensing plate has a ticket dispensing front side and a ticket dispensing back side relative to the ticket dispensing front side. The second joint part is disposed on the ticket dispensing back side and includes a second adjusting member. The first pivot joint part is pivoted to the second pivot joint part, and the guide front side is adjacent to the ticket dispensing front side. The first adjusting member cooperates with the second adjusting member to adjust an angle between the guide front side and the ticket dispensing front side.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:外殼</p>  
        <p type="p">12:顯示器</p>  
        <p type="p">13:出票機</p>  
        <p type="p">132:原始出票口</p>  
        <p type="p">14:出票組件</p>  
        <p type="p">15:外殼</p>  
        <p type="p">20:導引板</p>  
        <p type="p">40:出票板</p>  
        <p type="p">404:阻擋件</p>  
        <p type="p">60:滑道板</p>  
        <p type="p">B:方框</p>  
        <p type="p">S:容置空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="242" publication-number="202612770"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612770.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612770</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135858</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙軸同步收放帶體傳動按摩機之結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">A63H23/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫東和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫東和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳芳池</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雙軸同步收放帶體傳動按摩機之結構，其包含有一按摩椅座與一按摩機，按摩椅座具有一椅框，椅框內前側、後側左右分別各設有一第一捲帶、一第二捲帶，按摩機前後分別樞設有一第一轉軸與一第二轉軸，第一轉軸左右各設有一第一捲輪，第一捲帶固定並捲於第一捲輪上，第一轉軸上設有一第一齒輪，第二轉軸左右各設有一第二捲輪，第二捲帶固定並捲於第二捲輪上，第二轉軸上設有一第二齒輪，按摩機設有一馬達轉動該第一轉軸或該第二轉軸，一傳動齒輪與第一齒輪及第二齒輪嚙合，使第一轉軸與第二轉軸相同方向轉動同步捲收第一捲帶、第二捲帶。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">(10):按摩椅座</p>  
        <p type="p">(11):椅框</p>  
        <p type="p">(12):第一捲帶</p>  
        <p type="p">(13):第二捲帶</p>  
        <p type="p">(20):按摩機</p>  
        <p type="p">(21):第一轉軸</p>  
        <p type="p">(211):第一捲輪</p>  
        <p type="p">(212):第一齒輪</p>  
        <p type="p">(22):第二轉軸</p>  
        <p type="p">(221):第二捲輪</p>  
        <p type="p">(222):第二齒輪</p>  
        <p type="p">(23):馬達</p>  
        <p type="p">(24):傳動齒輪</p>  
        <p type="p">(25):按摩件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="243" publication-number="202612672"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612672.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612672</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135860</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>按摩椅之服貼傳動機構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">A61H15/00</main-classification>  
        <further-classification edition="200601120241202B">A61H1/00</further-classification>  
        <further-classification edition="200601120241202B">A61H7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海榮泰健康科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫東和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白丞堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種按摩椅之服貼傳動機構，其包含有一按摩椅座與一按摩機，其中，按摩椅座具有一椅框，椅框內前側左右各設有一第一捲繩，椅框內後側左右各設有一第二捲繩，按摩機前後分別樞設有一第一轉軸與一第二轉軸，第一轉軸左右各設有一第一轉輪，第一轉輪上設有一第一螺段，第一捲繩纏於第一螺段上，第二轉軸左右各設有一第二轉輪，第二轉輪上設有一第二螺段，第二捲繩纏於第二螺段上，按摩機設有一馬達轉動第一轉軸或第二轉軸，一傳動輪與第一轉輪及第二轉輪嚙合，使第一轉輪與第二轉輪二者相同方向進行轉動，從而令按摩機沿椅框往復前後移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">(10):按摩椅座</p>  
        <p type="p">(11):椅框</p>  
        <p type="p">(12):第一捲繩</p>  
        <p type="p">(13):第二捲繩</p>  
        <p type="p">(20):按摩機</p>  
        <p type="p">(21):第一轉軸</p>  
        <p type="p">(211):第一轉輪</p>  
        <p type="p">(212):第一螺段</p>  
        <p type="p">(22):第二轉軸</p>  
        <p type="p">(221):第二轉輪</p>  
        <p type="p">(222):第二螺段</p>  
        <p type="p">(23):馬達</p>  
        <p type="p">(24):傳動輪</p>  
        <p type="p">(25):按摩件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="244" publication-number="202613765"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613765.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613765</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135863</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於熱源與散熱器間之液態介質儲存器及其散熱裝置</chinese-title>  
        <english-title>LIQUID MEDIUM STORAGE DEVICE AND A HEAT DISSIPATION DEVICE HAVING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G06F1/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>冠鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUAN DING INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘冠達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, KUAN-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭明正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, MING-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於熱源與散熱器間之液態介質儲存器及其散熱裝置，液態介質儲存器用以設於熱源與散熱器之間，並包括一熱源座與一夾層；熱源座具有一頂部、以及由頂部周緣向下延伸的一環圍部，且頂部上設有一裸空區；而夾層平置於熱源座之頂部上，夾層具有一容納區並對應至裸空區，且容納區實質上等於或小於裸空區；其中，熱源的表面係通過裸空區而緊配迫入容納區內，而散熱器則貼接於夾層上，以於容納區內的熱源與散熱器之間供液態介質注入。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A liquid medium storage device and a heat dissipation device having the same. The liquid medium storage device is arranged between a heat source and a heat dissipator, and has a heat source seat and an interlayer. The heat source seat has a top and a surrounding portion extends downward from a periphery of the top, and an open area is defined on the top. The interlayer is placed flat on the top of the heat source base, and the interlayer has an accommodation area corresponding to the open area, and the accommodation area is substantially equal to or smaller than the open area. A surface of a heat source is tightly fit into the accommodation area through the bare space area, and the heat dissipator is attached on the interlayer to allow the liquid medium to be filled into the accommodation area and between the heat dissipator the heat source and the heat dissipator.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:液態介質儲存器</p>  
        <p type="p">10:熱源座</p>  
        <p type="p">100:頂部</p>  
        <p type="p">101:環圍部</p>  
        <p type="p">102:裸空區</p>  
        <p type="p">103:固定孔</p>  
        <p type="p">11:夾層</p>  
        <p type="p">110:容納區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="245" publication-number="202613918"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613918.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613918</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135866</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用在人工智慧服務上的帳戶安全管理系統及方法</chinese-title>  
        <english-title>ACCOUNT SECURITY MANAGEMENT SYSTEM AND METHOD APPLIED TO ARTIFICIAL INTELLIGENCE SERVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250102B">G06Q20/34</main-classification>  
        <further-classification edition="201301120250102B">G06F21/33</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>網聯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NET ALLIANCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奇卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奇卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張秀夏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種帳戶安全管理架構，包括一AI管理系統、一監管系統及一通訊裝置；使用者欲登入AI管理系統時，透過通訊裝置輸入登入帳號及密碼；接著，使用者透過通訊裝置從AI管理系統收到一驗證實體卡的訊息，以一卡片讀取器讀取一實體卡中的一內碼，透過通訊裝置發送內碼至監管系統；監管系統收到內碼後，以內碼驗證實體卡之持有者的身分且發送一具有實體卡持有者的身分的通知訊息至AI管理系統；AI管理系統收到具有實體卡持有者的身分的通知訊息後，若比對實體卡之持有者的身分相同於當前使用者的身分，核准通訊裝置的登入。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides an account security management architecture. When user wants to login to an AI management system, he can input a login ID and password via a communication device. Then, the user receives a message for verifying a physical card from the AI management system via the communication device, reads an internal code from the physical card by a card reader, and sends the internal code to a supervision system via the communication device. The supervision system verifies an identity of the physical card holder by the internal code, and sends a notification message with the identity of the physical card holder to the AI management system. If the AI management system determines that the identity of the holder of the physical card matches the identity of the user who wants to login the AI management system, the communication device will be allowed to login the AI management system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:帳戶安全管理架構</p>  
        <p type="p">10:人工智慧管理系統</p>  
        <p type="p">11:第一處理器</p>  
        <p type="p">12:管理模組</p>  
        <p type="p">121:人工智慧管理程序</p>  
        <p type="p">1211:驗證實體卡的指示訊息</p>  
        <p type="p">1212:驗證當前使用者的身分的指示訊息</p>  
        <p type="p">1213:驗證碼</p>  
        <p type="p">1214:輸入驗證碼的指示訊息</p>  
        <p type="p">13:管理資料庫</p>  
        <p type="p">131:AI服務所需的資料</p>  
        <p type="p">132:使用者的身分</p>  
        <p type="p">133:使用者帳戶的登入帳號及密碼</p>  
        <p type="p">14:第一通訊介面</p>  
        <p type="p">20:監管系統</p>  
        <p type="p">21:第二處理器</p>  
        <p type="p">22:監管模組</p>  
        <p type="p">221:監管人工智慧服務使用者身分的程序</p>  
        <p type="p">2211:核准當前使用者登入的通知訊號</p>  
        <p type="p">2212:禁止當前使用者登入的通知訊號</p>  
        <p type="p">23:監管資料庫</p>  
        <p type="p">231:實體卡持有者的身分</p>  
        <p type="p">232:內碼</p>  
        <p type="p">24:第二通訊介面</p>  
        <p type="p">30:通訊裝置</p>  
        <p type="p">31:第三處理器</p>  
        <p type="p">32:輸入模組</p>  
        <p type="p">33:資料儲存器</p>  
        <p type="p">34:第三通訊介面</p>  
        <p type="p">40:卡片讀取器</p>  
        <p type="p">50:實體卡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="246" publication-number="202613666"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613666.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613666</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135870</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於立體攝像模組的晶圓級製造方法及立體攝像模組</chinese-title>  
        <english-title>WAFER-LEVEL MANUFACTURING METHOD FOR STEREOSCOPIC CAMERA MODULE AND STEREOSCOPIC CAMERA MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250102B">G02B30/20</main-classification>  
        <further-classification edition="202501120250102B">H10H29/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塗宗偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, TSUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於立體攝像模組的晶圓級製造方法，包括：在第一基板上形成多個影像感測器。在第二基板上形成多個鏡頭。將第一基板及第二基板進行對位、堆疊及切割，再進行封裝，以形成多個影像感測器模組。將影像感測器模組中的兩者組成立體攝像模組。立體攝像模組的其中之一影像感測器模組設置在基線的一側，且影像感測器的感測面的中心軸相對於鏡頭的光軸朝遠離該側的方向偏移。立體攝像模組的其中之另一影像感測器模組設置在基線的另一側，且影像感測器的感測面的中心軸相對於鏡頭的光軸朝遠離該另一側的方向偏移。一種立體攝像模組亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wafer-level manufacturing method for stereoscopic camera module including: forming a plurality of image sensors on a first substrate. Forming a plurality of lenses on a second substrate. Aligning, stacking and cutting the first substrate and the second substrate, and then packaging them to form a plurality of image sensor modules. Combining two of the image sensor modules to form a stereoscopic camera module. One of the image sensor modules of the stereoscopic camera module is disposed on one side of a baseline, and a central axis of a sensing surface of the image sensor, relative to an optical axis of the lens, is shifted toward a direction away from the one side. The other one of the image sensor modules of the stereoscopic camera module is disposed on other one side of the baseline, and a central axis of a sensing surface of the image sensor, relative to an optical axis of the lens, is shifted toward a direction away from the other one side. A stereoscopic camera module is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S200、S300、S400:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="247" publication-number="202613993"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613993.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613993</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135873</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>公開場所監控系統</chinese-title>  
        <english-title>PUBLIC PLACE SURVEILLANCE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G08G1/01</main-classification>  
        <further-classification edition="200601120241007B">G08G1/005</further-classification>  
        <further-classification edition="202201120241007B">G06V20/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>逸陞有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTOASSET INC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭康祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, KANG-YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊代強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種公開場所監控系統，應用於一受監控之公開場所，該系統包含：一第一影像產生器，用以根據該受監控之公開場所來產生一第一影像信號；一影像處理單元，信號連接於該第一監控影像產生器，其上運行一影像分析模型，用以接收該第一影像信號並由該影像分析模型進行分析，進而得到於一時間段中該受監控之公開場所中一第一區域中之一第一人員分佈狀態資訊與一第二區域中一第二人員分佈狀態資訊，根據該第一人員分佈狀態資訊所判斷出的一第一變化特徵滿足一第一預設條件時而發出一第一指令，根據該第二人員分佈狀態資訊所判斷出的一第二變化特徵滿足一第二預設條件時而發出一第二指令；以及一監控信號產生單元，信號連接於該影像處理單元，用以因應該第一指令與該第二指令而分別發出一第一監控信號與一第二監控信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A public place surveillance system applied to a monitored public place, the system comprising: a first image generator, used to generate a first image signal according to the monitored public place; an image processing unit, signal-connected to the first image generator, on which an image analysis model is running, used to receive the first image signal and analyze it through the image analysis model, thereby obtaining first personnel distribution status information in a first area and second personnel distribution status information in a second area within the monitored public place during a time period. A first instruction is issued when a first change feature determined from the first personnel distribution status information meets a first preset condition, and a second instruction is issued when a second change feature determined from the second personnel distribution status information meets a second preset condition; and a monitoring signal generating unit, signal-connected to the image processing unit, is used to issue a first monitoring signal and a second monitoring signal in response to the first instruction and the second instruction, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:系統</p>  
        <p type="p">10:受監控之公開場所</p>  
        <p type="p">11:第一影像產生器</p>  
        <p type="p">12:第二影像產生器</p>  
        <p type="p">13:影像處理單元</p>  
        <p type="p">14:監控信號產生單元</p>  
        <p type="p">130:影像分析模型</p>  
        <p type="p">101:左側月台</p>  
        <p type="p">102:右側月台</p>  
        <p type="p">103:上下樓的手扶梯</p>  
        <p type="p">104:左側二樓通道</p>  
        <p type="p">105:右側二樓通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="248" publication-number="202614621"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614621.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614621</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135876</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預測填充的訊號處理方法</chinese-title>  
        <english-title>SIGNAL PROCESSING METHOD OF PREDICTIVE PADDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120250102B">H04N19/61</main-classification>  
        <further-classification edition="201401120250102B">H04N19/117</further-classification>  
        <further-classification edition="201401120250102B">H04N19/80</further-classification>  
        <further-classification edition="201401120250102B">H04N19/86</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立陽明交通大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏群樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, CHUN-SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張祐誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙品瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, PIN-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>管彥鳴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUAN, YEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱珍元</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種預測填充的訊號處理方法，其係用以將一原始訊號進行預測填充，並據以產生一預測填充訊號，包含一第一核函數處理程序、一預測填充處理程序、以及一訊號合併處理程序。第一核函數處理程序係將該原始訊號以一第一核函數進行運算以分離出一任務相關訊號和一雜訊訊號。預測填充處理程序係將一預測外插訊號填充於該任務相關訊號之一端、並將一常數值訊號填充於該雜訊訊號之一端。訊號合併處理程序係將填充有預測外插訊號之該任務相關訊號以及填充有常數值訊號之該雜訊訊號進行合併，據以產生預測填充訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a signal processing method for predictive padding, which is used to perform predictive padding on an original signal and generate a predictive padding signal. The signal processing method for predictive padding includes a first kernel function process, a predictive padding process, and a signal merging process. The first kernel function process operates the original signal with a first kernel function to extract a task-related signal and a noise signal. The predictive padding process pads one end of the task-related signal with a predicted extrapolation signal and pads one end of the noise signal with a constant value signal. The signal merging process merges the task-related signal padded with the predicted extrapolation signal and the noise signal padded with the constant value signal to generate a predictive padding signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">P&lt;sub&gt;21&lt;/sub&gt;:第一核函數處理程序</p>  
        <p type="p">P&lt;sub&gt;22&lt;/sub&gt;:預測填充處理程序</p>  
        <p type="p">P&lt;sub&gt;23&lt;/sub&gt;:訊號合併處理程序</p>  
        <p type="p">S&lt;sub&gt;O&lt;/sub&gt;:原始訊號</p>  
        <p type="p">S&lt;sub&gt;NO&lt;/sub&gt;:雜訊訊號</p>  
        <p type="p">S&lt;sub&gt;TR&lt;/sub&gt;:任務相關訊號</p>  
        <p type="p">S&lt;sub&gt;P&lt;/sub&gt;:預測外插訊號</p>  
        <p type="p">S&lt;sub&gt;A&lt;/sub&gt;:常數值訊號</p>  
        <p type="p">S’&lt;sub&gt;NO&lt;/sub&gt;:填充後之雜訊訊號</p>  
        <p type="p">S’&lt;sub&gt;TR&lt;/sub&gt;:填充後之任務相關訊號</p>  
        <p type="p">S&lt;sub&gt;FP&lt;/sub&gt;:預測填充訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="249" publication-number="202614250"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614250.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614250</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135878</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於電子器件的缺陷檢驗方法和裝置</chinese-title>  
        <english-title>DEFECT INSPECTION METHOD AND APPARATUS FOR ELECTRONIC DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240930B">H01L21/66</main-classification>  
        <further-classification edition="200601120240930B">H01L21/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商先進科技新加坡有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASMPT SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭宜龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, YILONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張培亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, PEILIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱昱宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於檢驗半導體封裝的方法包括以下步驟：產生激發雷射光束並且將其導向至該半導體封裝的第一側上的激發區域，從而在該半導體封裝中產生超聲波振動；產生測量雷射光束並且將其導向至該半導體封裝的第二側上的測量區域，其中該第一側和該第二側彼此相對；並且用振動檢測器檢測從該測量區域反射的該測量雷射光束，以測量由該激發雷射光束產生的該超聲波振動，從而檢驗該半導體封裝的品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Method for inspecting a semiconductor package includes the steps of generating anddirecting an excitation laser beam toward an excitation area on a first side of thesemiconductor package so as to generate ultrasonic vibration in the semiconductorpackage, generating and directing a measurement laser beam toward a measurementarea on a second side of the semiconductor package, wherein the first and second sidesare opposite to each other, and detecting the measurement laser beam reflected fromthe measurement area with a vibration detector to measure the ultrasonic vibrationgenerated by the excitation laser beam, thereby inspecting a quality of thesemiconductor package.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:裝置</p>  
        <p type="p">102a:半導體封裝</p>  
        <p type="p">102b:半導體封裝</p>  
        <p type="p">102c:半導體封裝</p>  
        <p type="p">104:襯底</p>  
        <p type="p">106:激發區域</p>  
        <p type="p">106':激發區域</p>  
        <p type="p">108:空隙缺陷</p>  
        <p type="p">190A:直線電機</p>  
        <p type="p">190B:直線電機</p>  
        <p type="p">110:裸片</p>  
        <p type="p">112:測量區域</p>  
        <p type="p">112':測量區域</p>  
        <p type="p">120:激發鐳射元件</p>  
        <p type="p">121:激發雷射光束</p>  
        <p type="p">122:激發鐳射發生器</p>  
        <p type="p">124:激發束轉向設備</p>  
        <p type="p">127:振鏡驅動器</p>  
        <p type="p">128:f-θ透鏡</p>  
        <p type="p">140:測量鐳射元件</p>  
        <p type="p">141:測量雷射光束</p>  
        <p type="p">142:測量鐳射發生器</p>  
        <p type="p">144:測量束轉向設備</p>  
        <p type="p">146:振鏡</p>  
        <p type="p">147:振鏡驅動器</p>  
        <p type="p">148:f-θ透鏡</p>  
        <p type="p">160:振動檢測器</p>  
        <p type="p">180:控制系統</p>  
        <p type="p">182:數模轉換器</p>  
        <p type="p">184:控制器時鐘</p>  
        <p type="p">186:控制模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="250" publication-number="202612719"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612719.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612719</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135879</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於調控胰島素阻抗的組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">A61K36/75</main-classification>  
        <further-classification edition="200601120250501B">A61K36/74</further-classification>  
        <further-classification edition="200601120250501B">A61K36/73</further-classification>  
        <further-classification edition="200601120250501B">A61P3/00</further-classification>  
        <further-classification edition="200601120250501B">A61P3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拜寧騰能生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIONIN BIOTECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>宜蘭縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃雅婕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YA-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀之軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, JHIH-JYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃江鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIANG-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳褕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, IU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勝騰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHENG-TENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種用於調控胰島素阻抗的組合物，其係至少包含有以下成分：60~90wt%的金柑酵解物；5~30wt%的綠咖啡萃取物；1~10wt%的洋蔥萃取物；以及1~10wt%的蘋果萃取物。該組合物能夠有效地減少腎臟醣類再吸收、降低胰島素阻抗、提高肌肉葡萄糖利用，進而降低堆積在身體各部位中造成慢性發炎、老化、血管硬化等問題，有助於應用在醫藥或是保健食品等用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="251" publication-number="202612642"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612642.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612642</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135880</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>坐姿辨識模型之建立方法及坐姿辨識系統</chinese-title>  
        <english-title>METHOD FOR ESTABLISHING SITTING POSTURE RECOGNITION MODEL AND SITTING POSTURE RECOGNITION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241001B">A61B5/11</main-classification>  
        <further-classification edition="201701120241001B">G06T7/70</further-classification>  
        <further-classification edition="201801120241001B">G16H20/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺北大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIPEI UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏匯民生股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HUI MIN SHENG CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林伯星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, BOR-SHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施宜均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, YI-JYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種坐姿辨識模型之建立方法及坐姿辨識系統，坐姿辨識系統包括：感測器、處理器、訓練後坐姿辨識模型及使用者反饋模組。感測器擷取即時圖像數據，並將其傳送至處理器及訓練後坐姿辨識模型進行運算以生成複數筆預測標籤。基於複數筆姿勢標籤，將預測標籤與姿勢標籤進行比對，以產生比對結果，透過藍芽通訊連接至人機交互介面，顯示比對結果以及建議的坐姿調整，在辨識到不正確坐姿時，向該使用者發出警示或建議以進行坐姿調整。藉此，本發明坐姿辨識模型之建立方法及系統有效改善坐姿並減少久坐引發的健康問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method for establishing a sitting posture recognition model and a sitting posture recognition system. The sitting posture recognition system includes: a sensor, a processor, a trained sitting posture recognition model and a user feedback module. The sensor captures real-time image data and transmits it to the processor and the trained sitting posture recognition model performs calculations to generate multiple prediction labels. Based on multiple posture labels, the predicted labels are compared with the posture labels to generate comparison results, which are connected to the human-computer interaction interface through Bluetooth communication to display the comparison results and recommended sitting posture adjustments. When incorrect sitting postures are identified When the situation occurs, a warning or suggestion is issued to the user to adjust the sitting posture. Through this, the method and system for establishing a sitting posture recognition model of the present invention can effectively improve sitting posture and reduce health problems caused by sitting for long periods of time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:坐姿辨識系統</p>  
        <p type="p">10:資料集</p>  
        <p type="p">20:感測器</p>  
        <p type="p">30:處理器</p>  
        <p type="p">301:即時圖像數據</p>  
        <p type="p">40:訓練後坐姿辨識模型</p>  
        <p type="p">50:使用者反饋模組</p>  
        <p type="p">51:人機交互介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="252" publication-number="202614110"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614110.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614110</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135881</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以改善螢幕錯誤關閉結構</chinese-title>  
        <english-title>STRUCTURE FOR IMPROVING THE ERROR CLOSING OF THE SCREEN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">H01H36/00</main-classification>  
        <further-classification edition="200601120250512B">H01H1/64</further-classification>  
        <further-classification edition="200601120250512B">H01F27/36</further-classification>  
        <further-classification edition="200601120250512B">G01R15/20</further-classification>  
        <further-classification edition="200601120250512B">G01R1/067</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李國瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐丞甫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHENG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用以改善螢幕錯誤關閉結構，適用於可攜式電子裝置，其中用以改善螢幕錯誤關閉結構包括：電路板，包括第一表面以及第二表面，第二表面相反於第一表面；磁力單元，沿磁力單元的軸具有可變的高斯值；感測器，設置於第一表面，用以感測高斯值；以及干擾擋片，設置第二表面，用以降低當磁力單元位於第二表面時，感測器感側的高斯值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A structure for improving the error closing of the screen, suitable for portable electronic devices, wherein the structure for improving the error closing of the screen includes: a circuit board, including a first surface and a second surface, the second surface being opposite to the first surface; magnetic force The unit has a variable Gaussian value along the axis of the magnetic unit; the sensor is arranged on the first surface to sense the Gaussian value; and the interference block is arranged on the second surface to reduce the noise when the magnetic unit is located on the second surface. surface, the Gaussian value of the sensing side of the sensor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:可攜式電子裝置</p>  
        <p type="p">11:電路板</p>  
        <p type="p">12:磁力單元</p>  
        <p type="p">13:感測器</p>  
        <p type="p">14:干擾擋片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="253" publication-number="202613415"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613415.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613415</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135882</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種離心式風扇之扇葉</chinese-title>  
        <english-title>A BLADE OF A CENTRIFUGAL FAN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">F04D29/30</main-classification>  
        <further-classification edition="200601120241202B">F04D29/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃文錚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種離心式風扇之扇葉，包括：基座；風扇下蓋，設置於該基座的外部對稱；連接板，設置於該風扇下蓋的內部，包括：複數個第二葉片，設置於該連接板上， 包括：小葉片，外部有葉片斜角；以及風扇上蓋，設置於該連接板遠離該風扇下蓋的一端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A blade of a centrifugal fan, comprising: a base; a lower fan cover, symmetrically disposed on the exterior of the base; a connecting plate, disposed on the interior of the lower fan cover, comprising: a plurality of second blades, disposed on the connecting plate, including: small blades with an inclined outer edge; and an upper fan cover, disposed on the end of the connecting plate opposite the lower fan cover.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基座</p>  
        <p type="p">21:第一靜音環</p>  
        <p type="p">22:第二靜音環</p>  
        <p type="p">23:條形貫穿槽</p>  
        <p type="p">24:熱板固定螺絲</p>  
        <p type="p">26:電子部件</p>  
        <p type="p">31:圓形貫穿槽</p>  
        <p type="p">32:第一葉片</p>  
        <p type="p">33:風扇擋板</p>  
        <p type="p">34:第一通風口</p>  
        <p type="p">35:第一螺絲孔</p>  
        <p type="p">41:風扇下蓋</p>  
        <p type="p">42:第二葉片</p>  
        <p type="p">421:小葉片</p>  
        <p type="p">422:葉片斜角</p>  
        <p type="p">43:連接板</p>  
        <p type="p">44:風扇上蓋</p>  
        <p type="p">45:熱管本體</p>  
        <p type="p">46:第二通風口</p>  
        <p type="p">47:第二螺絲孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="254" publication-number="202614040"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614040.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614040</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135884</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種記憶體裝置及其組裝方法</chinese-title>  
        <english-title>MEMORY DEVICE AND ASSEMBLY METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240925B">G11C5/04</main-classification>  
        <further-classification edition="200601120240925B">G11C5/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳政豫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體裝置，包括有：下殼體，包括有三根定位柱；主板，設置於該下殼體上；連接器，設置於該主板上；記憶體模組，設置於該連接器上；上殼體，設置於該記憶體模組上，包括有三個定位孔，該些定位柱穿過該些定位孔；插銷，設置與該上殼體上，由兩段相同長度、寬度以及高度的金屬片組成，包括有三個孔洞，該插銷安裝在該定位柱上。藉此，一種記憶體裝置不依賴螺絲與螺母的組合來維持裝置的結構，而是使用插銷來確保結構的穩定性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device comprising: a lower shell including at least one positioning post; a mainboard arranged on the lower shell; a connector arranged on the mainboard; and a memory module arranged on the connector; The upper shell is provided on the memory module and includes at least one positioning hole, which is connected to the positioning post; the plug is provided on the upper shell and consists of two sections of the same length, width and height It consists of a metal sheet and includes at least one hole, and the plug is installed on the positioning post. Thereby, a memory device does not rely on a combination of screws and nuts to maintain the structure of the device but uses plug to ensure structural stability.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:下殼體</p>  
        <p type="p">20:定位柱</p>  
        <p type="p">30:主板</p>  
        <p type="p">40:連接器</p>  
        <p type="p">50:記憶體模組</p>  
        <p type="p">60:上殼體</p>  
        <p type="p">70:插銷</p>  
        <p type="p">100:記憶體裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="255" publication-number="202614000"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614000.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614000</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135885</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置的資訊標籤</chinese-title>  
        <english-title>DISPLAY DEVICE’S INFORMATION LABEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">G09F3/18</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張永晃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YUNG-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置的資訊標籤，其包括：一顯示裝置本體，其在螢幕的前框延長下邊框，在下邊框中間空出一個長條形空間的一標籤槽，且該標籤槽所在位置的前框面設置為一透明板，形成對應該標籤槽的透明視窗；一標籤托盤，其表面可用於置放至少一標籤卡，且該標籤托盤以抽插方式進出該標籤槽，可隨意抽換該標籤卡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An information label for a display device, which includes: a display device body, which extends a lower frame from the front frame of the screen and leaves a label slot with a long strip space in the middle of the lower frame. And the front frame surface where the label slot is located is set as a transparent plate to form a transparent window corresponding to the label slot. A label tray, the surface of which can be used to place at least one label card. The label tray can be pulled in and out of the label slot, and the label card can be replaced at will.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示裝置本體</p>  
        <p type="p">101:前框面</p>  
        <p type="p">102:下邊框</p>  
        <p type="p">110:透明板</p>  
        <p type="p">200:標籤槽</p>  
        <p type="p">300:標籤托盤</p>  
        <p type="p">301:表面</p>  
        <p type="p">400:標籤卡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="256" publication-number="202613774"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613774.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613774</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135886</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固態硬碟散熱組件</chinese-title>  
        <english-title>SOLID STATE DRIVE HEAT DISSIPATION COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">G06F1/20</main-classification>  
        <further-classification edition="200601120241101B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭紹堂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, SHAO TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉堂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TANG AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游智欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHIH-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊智凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種固態硬碟散熱組件，其係用於電子裝置中的固態硬碟，其中固態硬碟散熱組件包括：散熱金屬板，其具有第一表面，及相反側作為接觸固態硬碟之第二表面，散熱鰭片，設置於第一表面，複數個導流鰭片，間隔設置於散熱金屬板上，且各導流鰭片間形成有導流面，使冷卻氣流沿導流面流動；至少三壓電元件，設置於第一表面，用以形成冷卻氣流；以及外殼，係與散熱金屬板結合，用以形成導流空間，並限制冷卻氣流於導流空間流動；其中，壓電元件用以產生冷卻氣流並沿導流面流動，藉以帶走固態硬碟運作產生的熱能，用以散熱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A solid state drive heat dissipation component, which is used for solid state hard drives in electronic devices, wherein the solid state hard drive heat dissipation component includes: a heat dissipation metal plate with a first surface and an opposite side as a second surface that contacts the solid state hard drive. , the heat dissipation fins are arranged on the first surface, a plurality of guide fins are arranged on the heat dissipation metal plate at intervals, and a guide surface is formed between each guide fin, so that the cooling airflow flows along the guide surface; at least three A piezoelectric element is provided on the first surface to form a cooling airflow; and a casing is combined with a heat dissipation metal plate to form a flow guide space and restrict the flow of cooling airflow in the flow guide space; wherein, the piezoelectric element is used to Cooling airflow is generated and flows along the guide surface to take away the heat energy generated by the operation of the solid state drive for heat dissipation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:固態硬碟散熱組件</p>  
        <p type="p">11:散熱金屬板</p>  
        <p type="p">12:散熱鰭片</p>  
        <p type="p">13:壓電元件</p>  
        <p type="p">14:外殼</p>  
        <p type="p">15:導風元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="257" publication-number="202614714"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614714.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614714</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135887</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置散熱結構</chinese-title>  
        <english-title>ELECTRONIC DEVICE HEAT DISSIPATION STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240924B">H05K7/20</main-classification>  
        <further-classification edition="200601120240924B">G06F1/20</further-classification>  
        <further-classification edition="200601120240924B">H01L23/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭紹堂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, SHAOTANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉堂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TANG AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置散熱結構，其係用於電子裝置，其中電子裝置散熱結構包括：外殼體，係用於電子裝置上，並具有固定凹槽；散熱片，係設置於外殼體內部，一端具有連接接頭，且連接接頭與散熱片間設有空氣管道；以及連接管，為中空結構，使外部低溫氣流於連接管內部流動，連接管一端設置有使連接管可裝卸地嵌合於外殼體之嵌合部，另一端設置有組接部，用以取得外部低溫氣流；其中，當連接管安裝於外殼體上並取得外部低溫氣流時，使外部低溫氣流透過散熱片導入電子裝置內部，用以散熱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device heat dissipation structure, which is used for electronic devices. The electronic device heat dissipation structure includes: an outer shell, which is used on the electronic device and has a fixed groove; a heat sink, which is arranged inside the outer shell and has a connection at one end. a joint, and an air pipe is provided between the connecting joint and the heat sink; and the connecting pipe is a hollow structure, allowing external low-temperature airflow to flow inside the connecting pipe. The other end is provided with a joint part to obtain external low-temperature airflow; when the connecting pipe is installed on the outer shell and obtains the external low-temperature airflow, the external low-temperature airflow is introduced into the electronic device through the heat sink to heat dissipation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:外殼體</p>  
        <p type="p">11:固定凹槽</p>  
        <p type="p">2:散熱片</p>  
        <p type="p">21:連接接頭</p>  
        <p type="p">22:空氣管道</p>  
        <p type="p">3:連接管</p>  
        <p type="p">31:嵌合部</p>  
        <p type="p">32:組接部</p>  
        <p type="p">4:鎖固構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="258" publication-number="202613414"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613414.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613414</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135888</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙層風扇模組</chinese-title>  
        <english-title>DOUBLE LAYER FAN MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">F04D29/00</main-classification>  
        <further-classification edition="200601120241202B">F04D29/44</further-classification>  
        <further-classification edition="200601120241202B">F04D29/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳郁澧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雙層風扇模組包括殼體、第一扇葉、第二扇葉、第一軸向風口、第一徑向風口、第二軸向風口、加壓腔及旁通流道。殼體包括頂板、底板、側牆、第一間隔板、第二間隔板及內部隔板。頂板、第一間隔板與側牆形成第一容置空間。底板、第二間隔板與側牆形成第二容置空間。第一扇葉位於第一容置空間內。第二扇葉位於第二容置空間內。第一軸向風口位於頂板上，具有加壓噴流結構。第一徑向風口相對於側牆。第二軸向風口位於底板上。加壓腔位於第一間隔板與第二間隔板之間。旁通流道連通加壓噴流結構與加壓腔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A double layer fan module includes a case, a first fan blade, a second fan blade, a first axial air outlet, a first radial opening, a second axial opening, a pressurized chamber and a bypass flow channel. The case includes a top board, a bottom board, a side wall, a first partition board, a second partition board and an internal partition board. The top board, the first partition board and the side wall form a first accommodation space. The bottom board, the second partition board and the side wall form a second accommodation space. The first fan blade is located in the first accommodation space. &lt;br/&gt;The second fan blade is located in the second accommodation space. The first radial opening is opposite to the side wall. The second axial opening is located on the bottom board. The pressurized chamber is located between the first partition board and the second partition board. The bypass flow channel connects the pressurized jet structure and the pressurized chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:雙層風扇模組</p>  
        <p type="p">110:殼體</p>  
        <p type="p">112:頂板</p>  
        <p type="p">114:底板</p>  
        <p type="p">116:側牆</p>  
        <p type="p">118:承托件</p>  
        <p type="p">120:第一間隔板</p>  
        <p type="p">122:第二間隔板</p>  
        <p type="p">124:內部隔板</p>  
        <p type="p">126:支撐柱</p>  
        <p type="p">130:內頂板</p>  
        <p type="p">132:內側牆</p>  
        <p type="p">140:第一容置空間</p>  
        <p type="p">142:第二容置空間</p>  
        <p type="p">144:第一容置腔室</p>  
        <p type="p">146:第二容置腔室</p>  
        <p type="p">160:第一扇葉</p>  
        <p type="p">162:第一軸向風口</p>  
        <p type="p">164:第一徑向風口</p>  
        <p type="p">166:軸心</p>  
        <p type="p">170:第二扇葉</p>  
        <p type="p">172:第二軸向風口</p>  
        <p type="p">174:加壓腔</p>  
        <p type="p">176:旁通流道</p>  
        <p type="p">178:加壓噴流結構</p>  
        <p type="p">180:第三扇葉</p>  
        <p type="p">182:第三軸向風口</p>  
        <p type="p">184:第二徑向風口</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="259" publication-number="202613972"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613972.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613972</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135889</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>擴增實境協作系統及其協作方法</chinese-title>  
        <english-title>AUGMENTED REALITY COLLABORATION SYSTEM AND COLLABORATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120241007B">G06T19/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚智原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, CHIH-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃楚立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHU-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佑鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, YOU-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳維超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏智斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, CHIH-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種擴增實境協作系統包含組裝平台、第一投影機、攝影機以及運算電路。組裝平台用於放置待組裝物件。第一投影機用於投影第一投影畫面至組裝平台。攝影機用於拍攝組裝平台以及投影於組裝平台的第一投影畫面，以取得第一拍攝畫面。運算電路用於在虛擬三維空間中製作立體模型，編排標準作業流程，根據標準作業流程在立體模型上設置標記圖案，並分析第一拍攝畫面，對第一投影機進行校正操作以得出第一校正參數。運算電路使第一投影機根據第一校正參數以及標記圖案以產生第一校正圖案，並根據標準作業流程將第一校正圖案投影至待組裝物件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An augmented reality collaboration system includes an assembly platform, a first projector, a camera and a computing circuit. The assembly platform places an object-to-be-assembled. The first projector projects a first projection image to the assembly platform. The camera shoots the assembly platform and the first projection image projected on the assembly platform to obtain a first shooting image. The computing circuit creates a three-dimensional model in a virtual three-dimensional space, arranges a standard operating process, sets a mark pattern on the three-dimensional model according to the standard operating process, analyzes the first shooting picture, and performs a correction operation on the first projector to obtain a first correction parameter. The computing circuit makes the first projector to generate a first corrected pattern according to the first correction parameter and the mark pattern, and projects the first corrected pattern to the object to the object-to-be-assembled according to the standard operating procedure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:擴增實境協作系統</p>  
        <p type="p">110:組裝平台</p>  
        <p type="p">112、114、116、118:實體座標</p>  
        <p type="p">120:待組裝物件</p>  
        <p type="p">125:校正圖案</p>  
        <p type="p">130:運算電路</p>  
        <p type="p">135:編輯器</p>  
        <p type="p">CMR1:攝影機</p>  
        <p type="p">PRJ1、PRJ2:投影機</p>  
        <p type="p">RCP1、RCP2:校正參數</p>  
        <p type="p">SC1、SC2、SCC:拍攝畫面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="260" publication-number="202613775"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613775.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613775</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135890</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱模組與電子裝置</chinese-title>  
        <english-title>HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">G06F1/20</main-classification>  
        <further-classification edition="200601120241205B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡智全</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIH CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種散熱模組，包含底座以及散熱翅片。散熱翅片設置在底座上。每一散熱翅片包含弧凸面、弧凹面以及轉折弧面。弧凹面朝向弧凸面凹陷。弧凸面的第一端與弧凹面的第一端相連而形成尖銳邊緣。轉折弧面平滑地連接於弧凸面的第二端與弧凹面的第二端之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a heat dissipation module including a base and heat dissipation fins. The heat dissipation fins are disposed on the base. Each of the heat dissipation fins includes a convex arc surface, a concave arc surface, and a turning arc surface. The concave arc surface is concave toward the convex arc surface. A first end of the convex arc surface is connected to a first end of the concave arc surface to form a sharp edge. The turning arc surface is smoothly connected between a second end of the convex arc surface and a second end of the concave arc surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:散熱模組</p>  
        <p type="p">110:底座</p>  
        <p type="p">120:散熱翅片</p>  
        <p type="p">122:弧凸面</p>  
        <p type="p">124:弧凹面</p>  
        <p type="p">125:尖銳邊緣</p>  
        <p type="p">126:轉折弧面</p>  
        <p type="p">200:電子裝置</p>  
        <p type="p">210:殼體</p>  
        <p type="p">220:內表面</p>  
        <p type="p">230:熱源</p>  
        <p type="p">800:風扇裝置</p>  
        <p type="p">A:延伸方向</p>  
        <p type="p">D:第一橫向方向</p>  
        <p type="p">G:第二橫向方向</p>  
        <p type="p">S1,S2,S3,S4,S5,S6,S7,S8:熱源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="261" publication-number="202613220"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613220.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613220</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135892</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可發泡樹脂組成物及其製造方法</chinese-title>  
        <english-title>FOAMABLE RESIN COMPOSITION AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241007B">C08J9/04</main-classification>  
        <further-classification edition="200601120241007B">C08F290/06</further-classification>  
        <further-classification edition="202001120241007B">B33Y70/00</further-classification>  
        <further-classification edition="201701120241007B">B29C64/00</further-classification>  
        <further-classification edition="200601120241007B">B29C44/02</further-classification>  
        <further-classification edition="200601120241007B">B29C69/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台科三維科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN TECH 3D CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝秉臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, BING JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種可發泡樹脂組成物包括：基質樹脂、光引發劑、發泡劑，基質樹脂包括以可發泡樹脂組成物之總重量計為0.1~90重量%的丙烯酸酯寡聚物、及以可發泡樹脂組成物之總重量計為0.1~90重量%的丙烯酸酯單體。光引發劑以可發泡樹脂組成物之總重量計為0.1~10重量%；發泡劑以可發泡樹脂組成物之總重量計為5~90重量%。在光固化後，可發泡樹脂組成物在光固化後，經過加熱發泡膨脹。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a foamable resin composition comprising: a matrix resin, a photoinitiator, and a blowing agent. The matrix resin includes 0.1 to 90 weight% of an acrylate oligomer based on the total weight of the foamable resin composition, and 0.1 to 90 weight% of an acrylate monomer based on the total weight of the foamable resin composition. The photoinitiator accounts for 0.1 to 10 weight% of the total weight of the foamable resin composition. The blowing agent accounts for 5 to 90 weight% of the total weight of the foamable resin composition. After light curing, the foamable resin composition undergoes thermal expansion and foaming.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="262" publication-number="202614506"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614506.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614506</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135896</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>易鎖連接器總成</chinese-title>  
        <english-title>EASY-LOCK CONNECTOR ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">H01R13/639</main-classification>  
        <further-classification edition="201101120241230B">H01R12/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>禾昌興業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>P-TWO INDUSTRIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張君瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種易鎖連接器總成，包括第一連接器及第二連接器。第一連接器包括第一絕緣殼體及第一金屬外殼，第一絕緣殼體具有收容空間，第二連接器可沿第一方向插入該收容空間。第二連接器包括第二絕緣殼體、第二金屬外殼及操作構件。第二絕緣殼體係形成有鎖定臂，該鎖定臂可在與第一方向垂直的第二方向於鎖定位置及解鎖位置之間移動且恆常地偏置至該鎖定位置。操作構件係以可移動的方式由第二絕緣殼體保持且配置成推壓鎖定臂，使鎖定臂偏置離開鎖定位置。藉此，實現具有良好的操作性且可靠度高的易鎖連接器總成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An easy-lock connector assembly is provided, which includes a first connector and a second connector. The first connector includes a first insulating housing having a receiving space and a first metal shell, and the second connector can be inserted into the receiving space in a first direction. The second connector includes a second insulating housing, a second metal shell and an operating member. The second insulating housing is formed with a locking arm which is movable between a locking position and an unlocking position in a second direction perpendicular to the first direction and normally biased to the locking position. The operating member is movably retained by the second insulating housing and is configured to push the locking arm to bias the locking arm away from the locking position. As such, an easy-lock connector assembly with good operability and high reliability is achieved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:易鎖連接器總成</p>  
        <p type="p">10:插座連接器</p>  
        <p type="p">20:插頭連接器</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="263" publication-number="202613044"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613044.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613044</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用氨能驅動的微生物暗固碳系統</chinese-title>  
        <english-title>MICROBIAL DARK CARBON FIXATION SYSTEM DRIVEN BY AMMONIA ENERGY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241001B">C02F3/00</main-classification>  
        <further-classification edition="202301120241001B">C02F3/34</further-classification>  
        <further-classification edition="200601120241001B">C12M1/42</further-classification>  
        <further-classification edition="200601120241001B">C12M1/107</further-classification>  
        <further-classification edition="200601320241001B">C02F101/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宇沛永續股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AET CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂理維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, LI WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王若凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JO-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯　繼勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRIAMBODO, RICKY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳哲宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JER-HORNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉詩薇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, SHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭淑芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種利用氨能驅動的微生物暗固碳系統，包含進流基質桶、微生物反應槽和二氧化碳捕捉的氣體供應管路。進流基質桶提供銨氮廢水作為進流水，並加強對二氧化碳吸收；微生物反應槽接收進流水並設有生物載體，生物載體負載氨氧化菌與厭氧銨氧化菌，此氨氧化菌與厭氧銨氧化菌為自營性無機氮代謝微生物，利用銨氮廢水中化學能固定二氧化碳；氣體供應管路對微生物反應槽導入含氧氣和二氧化碳的氣體，提供微生物生長所需碳源與氧氣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A microbial dark carbon fixation system driven by ammonia energy is provided. The microbial dark carbon fixation system driven by ammonia energy includes an inflow matrix tank, a microbial reaction tank and a gas supply pipeline for capturing carbon dioxide. The inflow matrix tank provides a wastewater containing ammonium to be treated as inflow water and enhances the absorption of carbon dioxide. The microbial reaction tank receives the inflow water and is equipped with a biological carrier. The biological carrier is loaded with ammonia oxidizing bacteria and anaerobic ammonium oxidizing bacteria. The ammonia oxidizing bacteria and anaerobic ammonium oxidizing bacteria are self-operated inorganic nitrogen-metabolizing microorganisms that utilize chemical energy in ammonium nitrogen wastewater to fix carbon dioxide. The gas supply pipeline introduces gas containing oxygen and carbon dioxide into the microbial reaction tank to provide the carbon source and oxygen required for the microorganisms’ growth.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:銨氮廢水</p>  
        <p type="p">10:進流基質桶</p>  
        <p type="p">11:進流泵浦</p>  
        <p type="p">12:進流管路</p>  
        <p type="p">13:加壓泵浦</p>  
        <p type="p">14:出流管路</p>  
        <p type="p">15:迴流管路</p>  
        <p type="p">20:微生物反應槽</p>  
        <p type="p">21:生物載體</p>  
        <p type="p">25:氧氣與二氧化碳感測器</p>  
        <p type="p">30:氣體供應管路</p>  
        <p type="p">31:鼓風機</p>  
        <p type="p">32:曝氣管路</p>  
        <p type="p">33:二氧化碳鋼瓶</p>  
        <p type="p">34:二氧化碳導入管</p>  
        <p type="p">35:質量流量控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="264" publication-number="202613661"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613661.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613661</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135901</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學模組及顯示裝置</chinese-title>  
        <english-title>OPTICAL MODULE AND DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">G02B27/01</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商榮諭科技（成都）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASPHETEK SOLUTION (CHENGDU) LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>榮諭科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASPHETEK SOLUTION INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許雲凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YUN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉忠武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHUNG-WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學模組，包括顯示組件及屈光組件。顯示組件具有顯示側，顯示組件能夠向顯示側發射成像光線。屈光組件設於顯示側，並貼附於顯示組件，屈光組件用於調整成像光線之屈光度。前述光學模組能夠節省屈光組件與顯示組件之間之空間，從而使光學模組之厚度減小，本創作一併提供一種包含該光學模組之顯示裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical module comprises a display component and a diopter component. The display component has a display side, and the display component can emit imaging light to the display side. The diopter component is arranged on the display side and attached to the display component. The diopter component is used to adjust the diopter of the imaging light. The optical module can save the space between the diopter component and the display component, so as to reduce the thickness of the optical module. A display device containing the optical module is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:顯示裝置</p>  
        <p type="p">100:光學模組</p>  
        <p type="p">10:顯示組件</p>  
        <p type="p">11:彩色濾光層</p>  
        <p type="p">12:第二液晶層</p>  
        <p type="p">20:屈光組件</p>  
        <p type="p">21:液晶透鏡</p>  
        <p type="p">211:第一基板</p>  
        <p type="p">212:第一電極</p>  
        <p type="p">213:第一液晶層</p>  
        <p type="p">214:第二電極</p>  
        <p type="p">30:薄餅透鏡</p>  
        <p type="p">50:線性偏振片</p>  
        <p type="p">200:外殼</p>  
        <p type="p">A:成像光線之傳播方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="265" publication-number="202614518"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614518.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614518</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135902</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>轉接頭及充電系統</chinese-title>  
        <english-title>ADAPTER AND CHARGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H01R31/06</main-classification>  
        <further-classification edition="201901120241202B">B60L53/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司 新北市土城區自由街 2 號</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIH-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣駿麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, JYUN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪志德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIH-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張豫成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳炯翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIUNG-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏毅倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, YI-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂忠衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高振庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, CHEN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏聖力</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, SHENG-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHENG-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳奇臨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭修豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HSIU-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范姜凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN CHIANG, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種轉接頭，包括殼體、充電槍鎖止組件及傳動組件。殼體設有安裝腔，充電槍鎖止組件可活動地設於殼體，並具有能夠將充電槍鎖止於安裝腔內之第一鎖止位置，及能夠將充電槍從安裝腔內解鎖之第一解鎖位置。傳動組件可活動地設於殼體，並能夠與充電槍鎖止組件抵接，以將充電槍鎖止組件限位於第一鎖止位置。傳動組件能夠於充電槍伸入安裝腔時，於充電槍之帶動下推動充電槍鎖止組件，以使充電槍鎖止組件從第一解鎖位置切換至第一鎖止位置。前述轉接頭能夠提高將充電槍與轉接頭鎖止時之操作便捷性，本創作一併提供一種包含該轉接頭之充電系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An adapter comprises a shell, a charging gun locking assembly and a transmission assembly. The shell is provided with a mounting cavity, the charging gun locking assembly is movably arranged in the shell, and has a first locking position capable of locking the charging gun in the mounting cavity, and a first unlocking position capable of unlocking the charging gun from the mounting cavity. The transmission assembly is movably arranged in the shell and can be interfacing with the charging gun locking assembly to limit the charging gun locking assembly to the first locking position. The transmission assembly can push the charging gun locking assembly under the drive of the charging gun when the charging gun is extended into the mounting cavity, so as to switch the charging gun locking assembly from the first unlocking position to the first locking position. The adapter can improve the operation convenience when locking the charging gun and the adapter, and a charging system including the adapter is provided in this creation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:轉接頭</p>  
        <p type="p">10:殼體</p>  
        <p type="p">11:第一部分</p>  
        <p type="p">12:第二部分</p>  
        <p type="p">20:充電槍鎖止組件</p>  
        <p type="p">30:傳動組件</p>  
        <p type="p">31:第一傳動輪組</p>  
        <p type="p">32:第一齒條</p>  
        <p type="p">33:第二齒條</p>  
        <p type="p">34:第二傳動輪組</p>  
        <p type="p">35:第三齒條</p>  
        <p type="p">36:第四齒條</p>  
        <p type="p">40:基座鎖止件</p>  
        <p type="p">A:第一方向</p>  
        <p type="p">B:第二方向</p>  
        <p type="p">C:第三方向</p>  
        <p type="p">D:第四方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="266" publication-number="202613555"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613555.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613555</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135904</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物件電性檢測治具及其操作方法</chinese-title>  
        <english-title>ELECTRICAL DETECTION FIXTURE OF ARTICLE AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241223B">G01R1/02</main-classification>  
        <further-classification edition="202001120241223B">G01R31/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威光自動化科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAS AUTOMATION CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃金福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒智文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, CHIH-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連仁偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIEN, JEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈維揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種物件電性檢測治具及其操作方法，依序包括憑藉該治具以懸持方式承載該物件，接續憑藉一高壓空氣驅動一氣囊膨脹，以生成一可壓縮式作用力驅動該物件移動，致使該物件的至少一電性連接埠能柔性的嵌接於該治具內具有通電特性的一檢測接座，以達保護所述電性連接埠、檢測接座和物件內載的電子構裝的目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides an electrical detection fixture of article and operation method thereof, sequentially includes loading the article in a suspended manner by means of the fixture, and then relying a high-pressure air to driver a gasbag inflates, so that a compressible force is generated by the gasbag to drive the article moves, so as to bring about at least one electrical port of the article can be flexibly embedded in a detection connector with energizing characteristics in the fixture. In order to achieve the purpose for protecting the electronic constructions in the electrical port, the electrical connector and the article.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基體</p>  
        <p type="p">11:頂艙</p>  
        <p type="p">12:中置艙</p>  
        <p type="p">13:底艙</p>  
        <p type="p">14:座板</p>  
        <p type="p">15:檢測接座</p>  
        <p type="p">17:側牆</p>  
        <p type="p">18:導持件</p>  
        <p type="p">20:置放座</p>  
        <p type="p">22:立牆</p>  
        <p type="p">23:滑座</p>  
        <p type="p">231:邊牆</p>  
        <p type="p">232:連接牆</p>  
        <p type="p">233:舌部</p>  
        <p type="p">24:驅動器</p>  
        <p type="p">241:缸桿</p>  
        <p type="p">25:彈性元件</p>  
        <p type="p">251:立柱</p>  
        <p type="p">40:物件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="267" publication-number="202612747"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612747.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612747</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135906</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>空氣過濾系統</chinese-title>  
        <english-title>AIR FILTRATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">A61L9/013</main-classification>  
        <further-classification edition="200601120241029B">A61L9/03</further-classification>  
        <further-classification edition="201601120241029B">F03D80/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佩青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PEI CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林存孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TSUEN SHIAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佩青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PEI CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳世宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHIH HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種空氣過濾系統，包括一過濾裝置及一發電裝置，該過濾裝置內部設有一水區域，該水區域具有吸附材料與水生植物，該發電裝置內部設有一特斯拉閥模組，當污染的氣體進入該過濾裝置後，可透過該吸附材料與水生植物過濾後形成淨化後之空氣，再自該過濾裝置排入該發電裝置，且該發電裝置內的特斯拉閥模組的內部，設置有至少一組發電模組，使經由該特斯拉閥模組的空氣可推動該發電模組運轉發電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An air filtration system includes a filter device and a power generation device. The filter device is provided with a water area inside. The water area has adsorbent materials and aquatic plants. The power generation device is equipped with a Tesla valve module inside. When the pollution is After the gas enters the filtering device, it can be filtered through the adsorbent material and aquatic plants to form purified air, which is then discharged from the filtering device into the power generation device, and the inside of the Tesla valve module in the power generation device, At least one set of power generation modules is provided, so that the air passing through the Tesla valve module can push the power generation module to operate and generate electricity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:過濾裝置</p>  
        <p type="p">15:渦流吸風扇</p>  
        <p type="p">2:發電裝置</p>  
        <p type="p">23:導風管</p>  
        <p type="p">26:渦流排風扇</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="268" publication-number="202614525"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614525.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614525</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135915</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">H02H9/02</main-classification>  
        <further-classification edition="200601120241104B">H05F3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李淑芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHU-FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡傳枝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, CHUAN-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖小鳳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, HSIAO-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳勇勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YUNG-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">電子裝置包含基板、第一金屬層、第一絕緣層、第二金屬層、第三金屬層、電子元件、覆晶薄膜接墊及軟性電路板接墊。基板包含第一側及對應於第一側的第二側。第一金屬層設置於基板上。第一絕緣層設置於第一金屬層上。第二金屬層設置於第一絕緣層上。第三金屬層設置於第二金屬層上，且至少一部份的第三金屬層用以形成靜電防護電路的至少一部份。電子元件包含第一端，其電性連接於至少另一部份的第三金屬層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a substrate, a first metal layer, a first insulating layer, a second metal layer, a third metal layer, an electronic component, a chip on film pad, and a flexible printed circuit pad. The substrate includes a first side and a second side corresponding to the first side. The first metal layer is disposed on the substrate. The first insulating layer is disposed on the first metal layer. The second metal layer is disposed on the first insulating layer. The third metal layer is disposed on the second metal layer. At least a portion of the third metal layer is used for forming at least a portion of an electrostatic discharge protection circuit. The electronic component includes a first terminal electrically connected to at least another portion of the third metal layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:金屬環結構</p>  
        <p type="p">S1:基板</p>  
        <p type="p">M1:第一金屬層</p>  
        <p type="p">M2:第二金屬層</p>  
        <p type="p">DL1:第一絕緣層</p>  
        <p type="p">M3:第三金屬層</p>  
        <p type="p">DL2:第二絕緣層</p>  
        <p type="p">DL3:第三絕緣層</p>  
        <p type="p">M4:第四金屬層</p>  
        <p type="p">S(1)至S(N):N筆資料</p>  
        <p type="p">PVDD:高電壓信號</p>  
        <p type="p">PVSS:低電壓信號</p>  
        <p type="p">TH1至TH4:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="269" publication-number="202614033"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614033.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614033</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135923</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>裝置控制方法與電子裝置</chinese-title>  
        <english-title>DEVICE CONTROL METHOD AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241220B">G09G5/36</main-classification>  
        <further-classification edition="201701120241220B">G06T7/174</further-classification>  
        <further-classification edition="200601120241220B">H04N5/262</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮鈺珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUAN, YU-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳良其</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIANG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置控制方法與電子裝置。所述方法包括：在電子裝置的顯示器呈現螢幕影像的期間，基於螢幕擷取頻率對顯示器執行螢幕擷取操作，以取得多個螢幕截圖；透過影像分析模型分析所述多個螢幕截圖，以偵測螢幕影像的類型並取得偵測結果；以及根據所述偵測結果，調整所述螢幕擷取頻率及電子裝置的至少一設定參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device control method and an electronic device are disclosed. The method includes: performing a screen capture operation on a display of the electronic device based on a screen capture frequency to obtain a plurality of screenshot images during a period when the display presents a screen image; analyzing the screenshot images by an image analysis model to detect a type of the screen image and obtain a detection result; and adjusting the screen capture frequency and at least one setting parameter of the electronic device according to the detection result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S401~S403:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="270" publication-number="202612924"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612924.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612924</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135925</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>駕駛系統及其防眩光的方法</chinese-title>  
        <english-title>DRIVING SYSTEM AND METHOD TO PREVENT GLARE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">B60J3/04</main-classification>  
        <further-classification edition="202201120240929B">B60R1/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯創資通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林秀美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIU MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊千慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIEN HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳力維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LI WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井民全</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JING, MING CHIUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林慧珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用以設置在車輛內駕駛系統。駕駛系統包括攝影機、第一控制器、光控制器以及第二控制器。攝影機用以感測車輛前方的影像。第一控制器電性連接至攝影機，用以辨識影像中車輛的同向車輛及對向車輛。光控制器用以設置在車輛的擋風玻璃處。第二控制器電性連接至第一控制器及光控制器。第二控制器分析影像，並在對向車輛的攝影機視野對向車輛位置中發生亮度大於等於亮度閥值時，將亮度大於等於亮度閥值的攝影機視野高亮度位置座標轉換為駕駛視野高亮度位置，再控制光控制器降低駕駛視野高亮度位置處的透光度。一種駕駛系統防眩光的方法亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A driving system configured to be disposed in a vehicle is provided. The driving system includes a camera, a first controller, a light controller and a second controller. The first controller is electrically connected to the camera and is configured to identify same-direction vehicles and oncoming-direction vehicles in the image. The light controller is configured to be disposed on a windshield of the vehicle. The second controller is electrically connected to the first controller and the light controller. The second controller analyzes the image. When a brightness is greater than or equal to a brightness threshold in an oncoming-direction vehicle position of a camera view of the oncoming-direction vehicle, the second controller coordinately converts a high-brightness position of the camera view with the brightness greater than or equal to the brightness threshold into a high-brightness position of a driving view, and then control the light controller to reduce a light transmittance at the high-brightness position of the driving view. A method to prevent glare in a driving system is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:駕駛系統</p>  
        <p type="p">20:控制面板</p>  
        <p type="p">100:攝影機</p>  
        <p type="p">200:第一控制器</p>  
        <p type="p">300:第二控制器</p>  
        <p type="p">400:光控制器</p>  
        <p type="p">500:抬頭顯示器</p>  
        <p type="p">CAN-FD:彈性資料率的控制器區域網路</p>  
        <p type="p">GPIO:通用輸入/輸出</p>  
        <p type="p">LVDS:低壓差分信號技術接口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="271" publication-number="202612991"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612991.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612991</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135935</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多樣化紙摺包裝結構</chinese-title>  
        <english-title>VARIETY OF FOLDING PACKAGING STRUCTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B65D81/05</main-classification>  
        <further-classification edition="200601120241105B">B65D85/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李靜惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JING-HUEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉素凌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SULING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉佩儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, PEI-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明包括內、外側板體及間隔板，外側板體由對摺的內、外側板構成，外側板具有緩衝塊界於外側板與箱子間，內側板設第一承接部以承接物品，外側板的第一槽縫與內側板的第二槽縫形成第一接縫，內側板體由第一、第二板體構成，第二板體具有第二承接部以承接另一物品，第一板體的第三槽縫與第二板體的第四槽縫可形成第二接縫，間隔板由第一、第二直板構成，第一直板的第五槽縫與第二直板的第六槽形成第三接縫，第三接縫與外側板體的第一接縫/內側板體的第二接縫對接，形成收容空間收納複數物品並裝於箱子內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention wraps the inner and outer panels and partition panels of paper. The outer panel body is composed of inner and outer panels that are folded in half. The outer panel has a buffer block between the outer panel and the box. The inner panel is provided with a first receiving portion to receive items. The first slot of the outer panel and the second slot of the inner panel form a first seam. The inner plate body is composed of first and second plate bodies. The second plate body has a second receiving portion to receive another article. The third slot of the first plate body and the fourth slot of the second plate body may form a second seam. The first partition plate is composed of first and second straight plates. The fifth slot of the first straight plate and the sixth slot of the second straight plate form a third joint. The third seam is butted with the first seam of the outer panel body/the second seam of the inner panel body. Form a storage space to store multiple items and pack them into boxes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">W1:下方寬度</p>  
        <p type="p">W2:上方寬度</p>  
        <p type="p">100:收容空間</p>  
        <p type="p">10:外側板體</p>  
        <p type="p">127:緩衝塊</p>  
        <p type="p">137:第一接縫</p>  
        <p type="p">141:第一細縫</p>  
        <p type="p">151:第一凹槽</p>  
        <p type="p">161:第一組配槽</p>  
        <p type="p">20:第二板體</p>  
        <p type="p">241:第二細縫</p>  
        <p type="p">251:第二凹槽</p>  
        <p type="p">30a:第一間隔板</p>  
        <p type="p">30b:第二間隔板</p>  
        <p type="p">30c:第三間隔板</p>  
        <p type="p">30d:第四間隔板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="272" publication-number="202612657"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612657.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612657</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135936</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可同步調整高度及寬度之椎間融合器</chinese-title>  
        <english-title>BIAXIAL SYNCHRONOUSLY ADJUSTABLE INTERVERTEBRAL FUSION CAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">A61B17/70</main-classification>  
        <further-classification edition="200601120240929B">A61F2/44</further-classification>  
        <further-classification edition="200601120240929B">A61F2/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立虎尾科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳守義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHOU-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林新逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳毅鍇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宥諝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YOU-SYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何沐光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, MU-GUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙志祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可同步調整高度及寬度之椎間融合器，係包括：一第一調整塊及一第二調整塊，於該第一、二調整塊之相對端，分別設有至少一斜面，並於各該斜面上設有一第一導引部及一第二導引部；一螺桿，穿置於該第一、二調整塊中，以聯動該第一、二調整塊相互趨近或遠離；以及至少一融合塊組，該融合塊組係由一第一融合塊與一第二融合塊組成，該第一、二融合塊之兩端分別形成一斜面部，以吻合地跨置於該第一、二調整塊之該斜面間，令該第一融合塊位於兩端之各該斜面部上分別設有第一導引構件，且各該第一導引構件對應地與該第一、二調整塊之各該第一導引部形成運動對，並令該第二融合塊位於兩端之各該斜面部上分別設有一第二導引構件，且各該第二導引構件對應地與該第一、二調整塊之各該第二導引部形成運動對，令旋轉該螺桿以相對趨近或遠離該第一、二調整塊時，該第一、二融合塊係沿該第一、二調整塊之該斜面上升或下降，且令該第一融合塊受該第一導引構件之導引、該第二融合塊受該第二導引構件之導引，而驅使該第一、二融合塊相互趨近或相對遠離，以同步調整本發明所示椎間融合器之高度及寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A biaxial synchronously adjustable intervertebral fusion cage includes: a first adjustment block and a second adjustment block. The opposite ends of the first adjustment block and the second adjustment block are respectively provided with at least one slope, and a first guide portion and a second guide portion are provided on each slope: screws are inserted into the first adjustment block and the second adjustment block. In the block, the first adjustment block and the second adjustment block are connected to be close to or away from each other: and at least one fusion block group, the fusion block group is composed of the first fusion block and the second fusion block. Both ends of the first welding block and the second welding block respectively form inclined portions to span the first welding block and the second welding block. Between the inclined surfaces of the two adjusting blocks, first guide members are respectively provided on the inclined surfaces at both ends of the first welding block, and each first guide member is connected to the first and second adjusting blocks correspondingly. Each first guide forms a moving pair, second guides are respectively provided on the inclined portions at both ends of the second welding block, and each second guide corresponds to the first guide. The second guide portions of the first adjustment block and the second adjustment block form a moving pair, so that when the screw rotates relatively close to or away from the first adjustment block and the second adjustment block, the first fusion block and the second fusion block move along the first The adjusting block and the second adjusting block move. The inclination of the adjustment block rises or falls, the first welding block is guided by the first guide member, and the second welding block is guided by the second guide member, thereby driving the first welding block and the second welding block. The fusion blocks are moved closer or farther away from each other to synchronously adjust the height and width of the intervertebral fusion cage of the present invention.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(11):第一調整塊</p>  
        <p type="p">(12):第二調整塊</p>  
        <p type="p">(13a)(13a’):斜面</p>  
        <p type="p">(13b)(13b’):斜面</p>  
        <p type="p">(14a)(14a’):第一導引部</p>  
        <p type="p">(14b)(14b’):第二導引部</p>  
        <p type="p">(20):螺桿</p>  
        <p type="p">(21):頭部</p>  
        <p type="p">(22):第二端</p>  
        <p type="p">(23):聯動部</p>  
        <p type="p">(30)(30’):融合塊組</p>  
        <p type="p">(31)(31’):第一融合塊</p>  
        <p type="p">(32)(32’):第二融合塊所</p>  
        <p type="p">(311a)(311b)(311a’)(311b’):斜面部</p>  
        <p type="p">(321a)(321a’)(321b)(321b’)]:斜面部</p>  
        <p type="p">(33)(33’):第一導引構件</p>  
        <p type="p">(34)(34’):第二導引構件</p>  
        <p type="p">(35):導槽</p>  
        <p type="p">(36):導軌</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="273" publication-number="202612671"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612671.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612671</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135939</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>升降桿裝置及含有其的能升降手把高低的助行車</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">A61H3/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫錦滄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHING TSANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫錦滄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHING TSANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種升降桿裝置及含有其的能升降手把高低的助行車，該升降桿裝置包含一伸縮桿及一升降調整組。該伸縮桿包括一外管及一內管。該內管具有多個凹部。該升降調整組包括一固定座、一橫向推桿、一推塊、至少一彈性件及一扳動件。該橫向推桿設置在該固定座與該外管。該橫向推桿具有一在一第二方向的長度，及一在一第三方向的寬度。該橫向推桿沿該第三方向被壓入並卡合於該內管的其中一該凹部。至少一該彈性件能沿該第三方向被彈壓地設置在該推塊與該橫向推桿之間，並恆推動該橫向推桿卡合於該內管。該扳動件用來帶動該推塊沿該第三方向移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:伸縮桿</p>  
        <p type="p">211:外管</p>  
        <p type="p">212:內管</p>  
        <p type="p">217:凹部</p>  
        <p type="p">23:固定座</p>  
        <p type="p">234:凹室</p>  
        <p type="p">25:橫向推桿</p>  
        <p type="p">26:推塊</p>  
        <p type="p">261:容孔</p>  
        <p type="p">263:凹面部</p>  
        <p type="p">264:橫向槽</p>  
        <p type="p">27:彈性件</p>  
        <p type="p">28:扳動件</p>  
        <p type="p">281:凸輪部</p>  
        <p type="p">282:扳動部</p>  
        <p type="p">X:第二方向</p>  
        <p type="p">Y:第三方向</p>  
        <p type="p">L:長度</p>  
        <p type="p">W:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="274" publication-number="202612831"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612831.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612831</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135942</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>動態光束調整裝置、雷射加工系統以及雷射加工方法</chinese-title>  
        <english-title>DYNAMIC BEAM ADJUSTMENT DEVICE, LASER PROCESSING SYSTEM AND LASER PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120241204B">B23K26/064</main-classification>  
        <further-classification edition="200601120241204B">B23K26/067</further-classification>  
        <further-classification edition="201401120241204B">B23K26/08</further-classification>  
        <further-classification edition="201401120241204B">B23K26/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李姿儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZIH-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林盈佐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YING-TSO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡家瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CHIA-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶展</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-CHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐尚聿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, SHANG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雷射加工系統，包括光束發射模組、動態光束調整裝置、聚焦鏡組及加工平台。光束發射模組提供雷射光束。動態光束調整裝置包括光束波前調變模組及分光修整單元。光束波前調變模組調整雷射光束的波前後得到經調整波前後之雷射光束。分光修整單元包括分光模組、光學調變模組、合光模組及傅立葉轉換模組。分光模組將經調整波前後之雷射光束分為第一光束與第二光束。光學調變模組對第一光束與第二光束進行相位調整成第一修整光束與第二修整光束。合光模組將第一修整光束與第二修整光束合成為合成光束。傅立葉轉換模組對其進行傅立葉轉換成經傅立葉轉換後之光束。聚焦鏡組對經傅立葉轉換後之光束聚焦成加工光束至置放於加工平台的待加工物，且當加工平台沿移動方向移動，加工光束沿改質方向對待加工物之內部進行加工。此外，一種動態光束調整裝置與雷射加工方法亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laser processing system includes a beam emission module, a dynamic beam adjustment device, a focusing lens assembly, and a processing platform. The beam emission module provides a laser beam. The dynamic beam adjustment device comprises a beam wavefront modulation module and a beam split correction unit. The beam wavefront modulation module adjusts the wavefront of the laser beam to obtain a waveform-adjusted laser beam. The beam split correction unit includes a beam splitter module, an optical modulation module, a beam combining module, and a Fourier transform module. The beam splitter module divides the waveform-adjusted laser beam into a first beam and a second beam. The optical modulation module adjusts the phase of the first beam and the second beam to obtain a first corrected beam and a second corrected beam. The beam combining module combines the first corrected beam and the second corrected beam into a composite beam. The Fourier transform module converts it into a Fourier-transformed beam. The focusing lens assembly focuses the Fourier-transformed beam into a processing beam onto a workpiece to be placed on the processing platform, and when the processing platform moves along a movement direction, the processing beam processes the interior of the workpiece along a modification direction. In additional, a dynamic beam adjustment device and a laser processing method are also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:待加工物</p>  
        <p type="p">100:雷射加工系統</p>  
        <p type="p">110:光束發射模組</p>  
        <p type="p">120:光束波前調變模組</p>  
        <p type="p">170:聚焦鏡組</p>  
        <p type="p">180:加工平台</p>  
        <p type="p">LA,LB:雷射光束</p>  
        <p type="p">LD:經傅立葉轉換後之光束</p>  
        <p type="p">LE:加工光束</p>  
        <p type="p">TA:動態光束調整裝置</p>  
        <p type="p">TA1:分光修整單元</p>  
        <p type="p">TB:控制裝置</p>  
        <p type="p">TB1:控制軟體程式</p>  
        <p type="p">TB2:驅動控制器</p>  
        <p type="p">TB3:感測元件</p>  
        <p type="p">PA:移動方向</p>  
        <p type="p">PB:改質方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="275" publication-number="202614894"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614894.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614894</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135949</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蓋板結構及使用其的顯示面板</chinese-title>  
        <english-title>COVER PLATE STRUCTURE AND DISPLAY PANEL USING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10H29/10</main-classification>  
        <further-classification edition="202501120250102B">H10H20/855</further-classification>  
        <further-classification edition="200601120250102B">H05K5/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錼創顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PLAYNITRIDE DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施　曉權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SI, HIO-KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MO</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴皓云</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, HAO-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種蓋板結構。蓋板結構包含折射層，折射層具有第一折射率且區分成多個折射區域。在折射層的第一側具有多個第一凸出部，且每個折射區域對應一個第一凸出部。蓋板結構更包含至少一屈光結構，屈光結構設置於折射層的第二側並具有第二折射率。第二側與第一側相對，且第二折射率與第一折射率不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cover plate structure is provided. The cover plate structure includes a refractive layer that has a first refractive index and is divided into multiple refractive regions. The first side of the refractive layer has multiple first protrusions, and each refractive region corresponds to one first protrusion. The cover plate structure further includes at least one refraction structure disposed on the second side of the refractive layer and has a second refractive index. The second side is opposite the first side, and the second refractive index is different from the first refractive index.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示面板</p>  
        <p type="p">10:電路基板</p>  
        <p type="p">10R:反射層</p>  
        <p type="p">20B,20G,20R:微型發光晶片</p>  
        <p type="p">30:折射層</p>  
        <p type="p">30A:折射區域</p>  
        <p type="p">30C:凹陷部</p>  
        <p type="p">30P:凸出部</p>  
        <p type="p">30PS:表面</p>  
        <p type="p">31:第一側</p>  
        <p type="p">32:第二側</p>  
        <p type="p">40:屈光結構</p>  
        <p type="p">40P:頂點</p>  
        <p type="p">40S1,40S2:曲面</p>  
        <p type="p">50:透光層</p>  
        <p type="p">60:陣列結構</p>  
        <p type="p">60T:頂面</p>  
        <p type="p">CP:蓋板結構</p>  
        <p type="p">d1,d2:距離</p>  
        <p type="p">P:畫素區域</p>  
        <p type="p">W30A,WP:寬度</p>  
        <p type="p">X,Z:坐標軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="276" publication-number="202614785"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614785.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614785</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135950</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種齊納二極體與製作方法</chinese-title>  
        <english-title>A ZENER DIODE AND MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D8/25</main-classification>  
        <further-classification edition="202501120250102B">H10D62/10</further-classification>  
        <further-classification edition="202501120250102B">H10D8/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汎星半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANSTAR SEMICONDUCTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, I-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種齊納二極體與製作方法，其包含：一基板；一掩埋層，該掩埋層在該基板的一設置面上的至少一部分區域形成；一磊晶層，該磊晶層至少在該掩埋層上形成；以及一擴散層，該擴散層至少在該磊晶層上形成；其中該擴散層與該掩埋層間具有一間距。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a Zener diode and a manufacturing method, which includes: a substrate; a buried layer formed on at least a part of a setting surface of the substrate; an epitaxial layer, the epitaxial layer formed on at least the buried layer; and a diffusion layer formed on at least the epitaxial layer; wherein there is a distance between the diffusion layer and the buried layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">101:設置面</p>  
        <p type="p">200:磊晶層</p>  
        <p type="p">300:掩埋層</p>  
        <p type="p">400:擴散層</p>  
        <p type="p">Y:間距</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="277" publication-number="202613593"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613593.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613593</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135956</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>降低雷達目標物角度(DoA)計算複雜度的演算法及雷達系統</chinese-title>  
        <english-title>METHOD FOR REDUCING COMPUTATIONAL COMPLEXITY IN DETERMINING DIRECTION OF ARRIVAL (DOA) FOR A RADAR SYSTEM AND RADAR SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">G01S13/06</main-classification>  
        <further-classification edition="200601120250102B">G01S13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明泰科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALPHA NETWORKS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇炫榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HSUAN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯崇毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU,CHUNG YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡文濬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAY, WEN-JIUNN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊宗憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TZONG-SHIANN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種降低雷達目標物角度(DoA)計算複雜度的演算法，由一雷達系統執行，包含：根據接收信號建立信號矩陣，並定義一行選擇矩陣及一列選擇矩陣；初始化該等選擇矩陣；在第k次的遞歸運算中，選出與第k-1次的殘差的內積為最大值的原子；利用第k-1次的選擇矩陣擴展得到該原子的選擇矩陣；利用遞迴反轉技術計算等價最小平方的方式，找出與該信號矩陣Z誤差範數最小的最佳稀疏矩陣；及根據該最佳稀疏矩陣更新殘差值，然後使k=k+1，回到選出原子的步驟重複運算直到k=K，獲得且輸出行選擇矩陣及該列選擇矩陣以進行相位補償而估算獲得目標物角度(DoA)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for reducing computational complexity in determining direction of arrival (DoA) for a radar system, includes: establishing a signal matrix based on received signals, defining a row selection matrix and a column selection matrix; initializing the selection matrices; in the kth recursive computation, selecting an atom whose residual from the (k-1) &lt;sub&gt;th&lt;/sub&gt;computation has the largest product; expanding the (k-1) &lt;sub&gt;th&lt;/sub&gt;selection matrix to obtain a selection matrix for that atom; obtaining an optimal sparse matrix with the smallest Froenius Norm of the error with the signal matrix Z by using the equivalent least square computed by the recursive inversion technique; updating the residual according to the optimal sparse matrix, then making k=k+1, going back to the step of selecting an atom and repeating the operation until k=K, and obtaining and outputting a row-selection matrix and a column-selection matrix to perform phase compensation for estimating the DoA.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S17:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="278" publication-number="202614035"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614035.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614035</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135957</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於偵測詐騙之語音辨識方法</chinese-title>  
        <english-title>A SPEECH RECOGNITION METHOD FOR DETECTING FRAUD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250102B">G10L15/18</main-classification>  
        <further-classification edition="201301120250102B">G10L21/06</further-classification>  
        <further-classification edition="201301120250102B">G10L25/63</further-classification>  
        <further-classification edition="202001120250102B">G06F40/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺北科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾建屏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, CHIEN-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅浚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹芷瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, CHIH-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝孟劭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, MENG-SHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁琇瑗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, HSIU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於偵測詐騙之語音辨識方法，藉由一電腦裝置來實施，該電腦裝置訊號連接一客服端裝置，該客服端裝置訊號連接一客戶端裝置，包含：(A)根據客服專員與客戶之對話，獲得一待分析語音資料；(B)根據該待分析語音資料，獲得一關於客戶的語音情緒分析結果；(C)根據該待分析語音資料，獲得一待分析文字資料；(D)根據該待分析文字資料，利用大型語言模型，獲得一關於客戶語意表達不合理處的語意不合理分析結果；(E)根據該等分析結果，判定客戶是否具有詐騙行為；(F) 當判定出客戶具有詐騙行為時，產生並傳送一警示通知至該客服端裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A speech recognition method for detecting fraud is implemented by a computer device, the computer device is connected to a service device, and the service device is connected to a client device, including: (A) Obtain speech data to be analyzed based on the conversation between the customer service staff and the customer; (B) Obtain a speech emotion analysis result about the customer based on the speech data to be analyzed; (C) Obtain text data to be analyzed based on the speech data to be analyzed; (D) Based on the text data to be analyzed, use a LLM to obtain a semantic unreasonable analysis result regarding the unreasonable parts of the customer's semantic expression; (E) Based on the analysis results, determine whether the customer has committed fraud; (F) When it is determined that the customer has committed fraud, generate and send a warning notification to the service device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S301~S309:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="279" publication-number="202613951"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613951.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613951</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135958</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>貸後授信條件變更自動化系統及貸後授信條件變更自動化方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241101B">G06Q40/03</main-classification>  
        <further-classification edition="202301120241101B">G06Q40/02</further-classification>  
        <further-classification edition="201201120241101B">G06Q20/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國信託商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CTBC BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊子萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉兆婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧孟儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樂威廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佳玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李亭儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種貸後授信條件變更自動化系統，適於與一供一用戶操作的用戶端電子裝置通訊，並包含一儲存單元及與其電連接的一處理單元。該儲存單元儲存該用戶的一貸後授信條件變更申請資料。該處理單元產生一專屬該用戶的個人化網址，並將該個人化網址傳送給該用戶端電子裝置。於該用戶端電子裝置經由該個人化網址連結至該貸後授信條件變更自動化系統之後，該處理單元將該貸後授信條件變更申請資料傳送給該用戶端電子裝置。於該處理單元接收到該用戶端電子裝置回傳的一貸後授信條件變更確認資料之後，該處理單元執行一貸後授信條件變更程序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:貸後授信條件變更自動化系統</p>  
        <p type="p">1:儲存單元</p>  
        <p type="p">2:處理單元</p>  
        <p type="p">200:用戶端電子裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="280" publication-number="202614806"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614806.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614806</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135964</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及製造半導體裝置的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/60</main-classification>  
        <further-classification edition="202501120250102B">H10D62/60</further-classification>  
        <further-classification edition="202501120250102B">H10D30/01</further-classification>  
        <further-classification edition="200601120250102B">H01L21/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢磊科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉原良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YUAN LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張元洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YUAN CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宜蓁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YI CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置，其包括：碳化矽磊晶層，其包括：p型阱區；重摻雜n型區，其在該p型阱區的表面上；以及重摻雜p型區，其在該重摻雜n型區之下且在該p型阱區內。該半導體裝置還包括第一閘極溝槽，其穿過該p型阱區；第一深摻雜p型區，其中，該第一深摻雜p型區的寬度窄於該第一閘極溝槽的寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">101:碳化矽磊晶層</p>  
        <p type="p">102:閘極氧化物層</p>  
        <p type="p">103:複晶矽層</p>  
        <p type="p">104:層間介電質層</p>  
        <p type="p">105:重摻雜p區</p>  
        <p type="p">106:金屬層</p>  
        <p type="p">107:重摻雜n區</p>  
        <p type="p">109:鈍化層</p>  
        <p type="p">110:聚醯亞胺層</p>  
        <p type="p">111:碳化矽基板</p>  
        <p type="p">112:金屬層</p>  
        <p type="p">ILD1:層間介電質層</p>  
        <p type="p">ILD2:層間介電質層</p>  
        <p type="p">DP1:深摻雜p型區</p>  
        <p type="p">DP2:深摻雜p型區</p>  
        <p type="p">PW:p型阱區</p>  
        <p type="p">FOX:場氧化物層</p>  
        <p type="p">SC:金屬矽化物</p>  
        <p type="p">GR:保護環區</p>  
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        <p type="p">TR2:閘極溝槽</p>  
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        <chinese-title>主動矩陣式膽固醇液晶顯示裝置的驅動系統及其靜態影像顯示方法</chinese-title>  
        <english-title/> 
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        <main-classification edition="200601120240926B">G09G3/36</main-classification>  
        <further-classification edition="200601120240926B">G06F3/147</further-classification> 
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                <last-name>富動科技股份有限公司</last-name>  
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                <last-name>李騏</last-name>  
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                <last-name>陳正育</last-name>  
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                <last-name>閻啓泰</last-name>  
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                <last-name>林景郁</last-name>  
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        <p type="p">一種主動矩陣式膽固醇液晶顯示裝置的靜態影像顯示方法，用於控制一主動矩陣式膽固醇液晶顯示裝置，包含根據一靜態影像參數資料、一資料致能訊號與一垂直同步訊號，產生一電壓控制指令、一閘極控制指令及一影像顯示指令；根據該電壓控制指令產生一閘極驅動電壓及複數資料驅動電壓；執行一靜態畫面顯示程序，於該靜態影像顯示程序中輸出該閘極驅動電壓控制該主動矩陣式膽固醇液晶顯示裝置的複數顯示單元開啟或關閉，並根據該閘極控制指令控制該複數顯示單元的開關時序，以及輸出該複數資料驅動電壓至開啟的該複數顯示單元。</p> 
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        <p type="p">1:主動矩陣式膽固醇液晶顯示裝置的驅動系統</p>  
        <p type="p">10:時序控制器</p>  
        <p type="p">11:電源控制埠</p>  
        <p type="p">12:閘極控制埠</p>  
        <p type="p">13:資料控制埠</p>  
        <p type="p">14:溫度通訊埠</p>  
        <p type="p">20:電源供應模組</p>  
        <p type="p">21:電源通訊埠</p>  
        <p type="p">22:閘極驅動電壓埠</p>  
        <p type="p">23:資料驅動電壓埠</p>  
        <p type="p">24:共通電極電壓埠</p>  
        <p type="p">30:溫度偵測模組</p>  
        <p type="p">31:溫度訊號輸出埠</p>  
        <p type="p">100:主動矩陣式膽固醇液晶顯示裝置</p>  
        <p type="p">110:顯示面板</p>  
        <p type="p">111:顯示單元</p>  
        <p type="p">120:閘極驅動元件</p>  
        <p type="p">121:閘極通訊埠</p>  
        <p type="p">122:閘極電壓輸入埠</p>  
        <p type="p">123:共通電壓輸入埠</p>  
        <p type="p">130:資料驅動元件</p>  
        <p type="p">131:資料通訊埠</p>  
        <p type="p">132:資料電壓輸入埠</p>  
        <p type="p">Iv:電壓控制指令</p>  
        <p type="p">Ig:閘極控制指令</p>  
        <p type="p">Id:影像顯示指令</p>  
        <p type="p">Vg:閘極驅動電壓</p>  
        <p type="p">Vd:資料驅動電壓</p>  
        <p type="p">Vcom:共通電極電壓</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">GL:閘極線</p>  
        <p type="p">T:溫度訊號</p> 
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        <chinese-title>主動矩陣式膽固醇液晶顯示裝置的驅動系統及其動態影像顯示方法</chinese-title>  
        <english-title/> 
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        <main-classification edition="200601120241206B">G09G3/36</main-classification>  
        <further-classification edition="200601120241206B">G02F1/133</further-classification>  
        <further-classification edition="200601120241206B">G02F1/137</further-classification> 
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                <last-name>富動科技股份有限公司</last-name>  
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                <middle-name/>  
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                <last-name>李騏</last-name>  
                <first-name/> 
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                <first-name/> 
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              <chinese-name name-type="organization"> 
                <last-name>陳正育</last-name>  
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                <middle-name/>  
                <first-name/> 
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              <english-country>TW</english-country> 
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                <last-name>林景郁</last-name>  
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        <p type="p">11:電源控制埠</p>  
        <p type="p">12:閘極控制埠</p>  
        <p type="p">13:資料控制埠</p>  
        <p type="p">14:溫度通訊埠</p>  
        <p type="p">20:電源供應模組</p>  
        <p type="p">21:電源通訊埠</p>  
        <p type="p">22:閘極驅動電壓埠</p>  
        <p type="p">23:資料驅動電壓埠</p>  
        <p type="p">24:共通電極電壓埠</p>  
        <p type="p">30:溫度偵測模組</p>  
        <p type="p">31:溫度訊號輸出埠</p>  
        <p type="p">100:主動矩陣式膽固醇液晶顯示裝置</p>  
        <p type="p">110:顯示面板</p>  
        <p type="p">111:顯示單元</p>  
        <p type="p">120:閘極驅動元件</p>  
        <p type="p">121:閘極通訊埠</p>  
        <p type="p">122:閘極電壓輸入埠</p>  
        <p type="p">123:共通電壓輸入埠</p>  
        <p type="p">130:資料驅動元件</p>  
        <p type="p">131:資料通訊埠</p>  
        <p type="p">132:資料電壓輸入埠</p>  
        <p type="p">Iv:電壓控制指令</p>  
        <p type="p">Ig:閘極控制指令</p>  
        <p type="p">Id:影像顯示指令</p>  
        <p type="p">Vg:閘極驅動電壓</p>  
        <p type="p">Vd:資料驅動電壓</p>  
        <p type="p">Vcom:共通電極電壓</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">GL:閘極線</p>  
        <p type="p">T:溫度訊號</p> 
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        <chinese-title>主動矩陣式膽固醇液晶顯示裝置的驅動系統及其手寫影像顯示方法</chinese-title>  
        <english-title/> 
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        <further-classification edition="200601120240926B">G06F3/147</further-classification> 
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                <last-name>富動科技股份有限公司</last-name>  
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        <p type="p">110:顯示面板</p>  
        <p type="p">111:顯示單元</p>  
        <p type="p">120:閘極驅動元件</p>  
        <p type="p">121:閘極通訊埠</p>  
        <p type="p">122:閘極電壓輸入埠</p>  
        <p type="p">123:共通電壓輸入埠</p>  
        <p type="p">130:資料驅動元件</p>  
        <p type="p">131:資料通訊埠</p>  
        <p type="p">132:資料電壓輸入埠</p>  
        <p type="p">Iv:電壓控制指令</p>  
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        <p type="p">Vg:閘極驅動電壓</p>  
        <p type="p">Vd:資料驅動電壓</p>  
        <p type="p">Vcom:共通電極電壓</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">GL:閘極線</p>  
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                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳裕承</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作為一種安全警示裝置，其包括有一底座、一分隔件及一警示標示件；其中，該分隔件以至少一彈性件與該底座相連結而能相對該底座偏擺；該警示標示件設於該分隔件。在本創作中，該底座和該分隔件分開設置，並且以所述彈性件相連結，使該分隔件受到汽車或機車衝撞時能夠相對該底座偏擺且能受碰撞而彈性地復位，不僅能減少衝撞之汽車或機車的損傷，還能解決一體成形之現有警示分隔柱遭到衝撞時容易損壞或斷裂的問題，提供一種不易因承受衝擊力而損壞而更加耐用的安全警示裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:底座</p>  
        <p type="p">11:固定部</p>  
        <p type="p">12:定位部</p>  
        <p type="p">20:分隔件</p>  
        <p type="p">30:彈性件</p>  
        <p type="p">50:固定件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="285" publication-number="202614539"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614539.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614539</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135984</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁懸浮發電裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H02K7/02</main-classification>  
        <further-classification edition="200601120241105B">H02K7/09</further-classification>  
        <further-classification edition="200601120241105B">H02N15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹昌文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, CHANG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹昌文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, CHANG-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊延壽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種利用磁懸浮技術，有效減少摩擦，提升運行穩定性與發電效率，適用於高效能源轉換的磁懸浮發電裝置，其特徵在於包括：一基座，具有頂板、底板及支撐柱；一懸浮磁鐵盤組，設於頂板一側，包括有主動轉子、主動軸、被動轉子、被動軸及磁鐵，磁鐵相互之間的N極與S極以相同磁極方向排列設置，用於產生磁場同性相斥效應，使主動轉子、被動轉子在磁斥作用下懸浮並進行旋轉；一驅動裝置，設置於頂板另一側，並與主動轉子的主動軸連接，用以驅動主動轉子旋轉，進而同步驅動各個被動轉子進行旋轉；以及數個發電機，分別設置於頂板一側，並與被動轉子的被動軸連接，用於將被動轉子的旋轉動能轉換為電能。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">1:基座</p>  
        <p type="p">11:頂板</p>  
        <p type="p">12:底板</p>  
        <p type="p">13:支撐柱</p>  
        <p type="p">23:被動轉子</p>  
        <p type="p">25:磁鐵</p>  
        <p type="p">26:固定架</p>  
        <p type="p">3:驅動裝置</p>  
        <p type="p">31:汽缸</p>  
        <p type="p">32:連接臂</p>  
        <p type="p">33:曲柄</p>  
        <p type="p">4:發電機</p>  
        <p type="p">6:支撐腳架</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="286" publication-number="202613914"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613914.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613914</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135987</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>整合開放式循環使用之環保杯登載系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250122B">G06Q10/30</main-classification>  
        <further-classification edition="202301120250122B">G06Q30/0207</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白丞堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種整合開放式循環使用之環保杯登載系統，用於管理至少一循環杯杯體，該循環杯杯體設有一辨識單元，透過一讀取裝置對該辨識單元進行辨認，接著由一管理系統連線到金流系統、資料庫，藉由授予該循環杯杯體具有金流價值，使得在使用時能扣取該循環杯杯體的儲值金等金流資訊，並同時給予收集該循環杯杯體的使用期間就地清洗系統預扣與核銷的碳排放量資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">1:循環杯杯體</p>  
        <p type="p">11:識別單元</p>  
        <p type="p">21:讀取裝置</p>  
        <p type="p">22:顯示裝置</p>  
        <p type="p">3:管理系統</p>  
        <p type="p">4:金流系統</p>  
        <p type="p">5:資料庫</p>  
        <p type="p">6:就地清洗系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="287" publication-number="202613857"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613857.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613857</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135988</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示系統、顯示裝置以及其解鎖方法</chinese-title>  
        <english-title>DISPLAY SYSTEM, DISPLAY DEVICE AND UNLOCKING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241204B">G06F21/35</main-classification>  
        <further-classification edition="201301120241204B">G06F21/43</further-classification>  
        <further-classification edition="201301120241204B">G06F21/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧圖碼股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OPTOMA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王國銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, KUO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓昱丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JHUO, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了顯示系統、顯示裝置及其解鎖方法。顯示系統包括用戶終端、顯示裝置和伺服器。顯示裝置基於超寬頻訊號獲取位置資訊及用戶識別碼，且判斷位置資訊是否符合預設條件，並發送包含用戶識別碼的驗證請求訊號至伺服器，伺服器對用戶識別碼執行驗證程序，產生驗證結果，且傳送其給顯示裝置使得解鎖螢幕的使用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display system, a display device and an unlocking method thereof are disclosed. The display system includes a user terminal device, the display device and a server. The display device obtains location information and an user identification code according to an ultra-wideband signal. The display device determines whether the location information meets a preset condition. The display device sends a verification request signal including the user identification code to the server. The server receives the verification request signal and executes a verification process to verify the user identification code to generate a verification result. The server sends the verification result to the display device. A screen of the display device is unlocked.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示系統</p>  
        <p type="p">100:顯示裝置</p>  
        <p type="p">200:用戶終端</p>  
        <p type="p">300:伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="288" publication-number="202612940"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612940.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612940</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113135993</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>行動餐車之工作桌台</chinese-title>  
        <english-title>TABLE FOR FOOD TRUCK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241031B">B60P3/025</main-classification>  
        <further-classification edition="200601120241031B">B60N3/00</further-classification>  
        <further-classification edition="200601120241031B">B60P3/36</further-classification>  
        <further-classification edition="200601120241031B">A47B31/06</further-classification>  
        <further-classification edition="200601120241031B">A47B9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃爾奇動力機電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VALSCH DYNAMIC MECHATRONICS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊安陶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, AN-TAO ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種行動餐車之工作桌台，能夠減少站在地面之餐食購買者拿取餐食的高度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a table for food truck for reducing the height of pick-up space of the table for the buyer standing on the ground.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:底盤結構</p>  
        <p type="p">102:前輪</p>  
        <p type="p">103:後輪</p>  
        <p type="p">104:第一車廂</p>  
        <p type="p">105:第二車廂</p>  
        <p type="p">106:第一廂門</p>  
        <p type="p">107:第二廂門</p>  
        <p type="p">110:工作桌台</p>  
        <p type="p">111:第一開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="289" publication-number="202612966"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612966.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612966</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136002</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自行車踏板</chinese-title>  
        <english-title>BICYCLE PEDAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250228B">B62M3/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上曉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種自行車踏板，其包含一踏板軸、一踏體、一踏板體及一偏置元件。該踏體相對於該踏板軸可旋轉地支撐以圍繞該踏板軸之一旋轉中心軸線旋轉。該踏體具有一第一踏面及一第二踏面。該踏板體相對於該踏板軸可旋轉地支撐以圍繞該旋轉中心軸線旋轉且圍繞該旋轉中心軸線相對於該踏體樞轉。該偏置元件操作地安置於該踏體之一第一偏置部分與該踏板體之一第二偏置部分之間。該偏置元件使該踏板體相對於該踏體遠離一中性體位置朝向一第一踏板體位置偏置以擴大該第一偏置部分與該第二偏置部分之間的一距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bicycle pedal includes a pedal axle, a tread body, a pedal body and a biasing element. The tread body is rotatably supported with respect to the pedal axle to rotate around a rotational center axis of the pedal axle. The tread body has a first tread surface and a second tread surface. The pedal body is rotatably supported with respect to the pedal axle to rotate around the rotational center axis, and to pivot relative to the tread body around the rotational center axis. The biasing element is operatively disposed between a first biased portion of the tread body and a second biased portion of the pedal body. The biasing element biases the pedal body relative to the tread body away from a neutral body position towards a first pedal body position to enlarge a distance between the first biased portion and the second biased portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:自行車踏板</p>  
        <p type="p">14:踏體</p>  
        <p type="p">18:偏置元件</p>  
        <p type="p">18a:第一部分</p>  
        <p type="p">18b:第二部分</p>  
        <p type="p">22:第一緩衝構件</p>  
        <p type="p">64:第一偏置部分</p>  
        <p type="p">64a:凹槽</p>  
        <p type="p">66:第二偏置部分</p>  
        <p type="p">66a:突起</p>  
        <p type="p">67:支撐軸</p>  
        <p type="p">68:螺旋彈簧</p>  
        <p type="p">68a:螺旋部分</p>  
        <p type="p">70:鄰接部</p>  
        <p type="p">71:第一鄰接面</p>  
        <p type="p">72:第二鄰接面</p>  
        <p type="p">80:第一扣片耦合單元</p>  
        <p type="p">82:第二扣片耦合單元</p>  
        <p type="p">84:第一扣片固定構件</p>  
        <p type="p">86:第二扣片固定構件</p>  
        <p type="p">88:第三扣片固定構件</p>  
        <p type="p">90:第四扣片固定構件</p>  
        <p type="p">A1:旋轉中心軸線</p>  
        <p type="p">A2:彈簧軸線</p>  
        <p type="p">A3:中心樞軸線</p>  
        <p type="p">CT:扣片</p>  
        <p type="p">P1:第一樞軸線</p>  
        <p type="p">P2:第二樞軸線</p>  
        <p type="p">P3:第三樞軸線</p>  
        <p type="p">P4:第四樞軸線</p>  
        <p type="p">PL:參考平面</p>  
        <p type="p">S:自行車運動鞋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="290" publication-number="202614733"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614733.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614733</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136003</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜態隨機存取記憶體以及其製作方法</chinese-title>  
        <english-title>STATIC RANDOM ACCESS MEMORY AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241220B">H10B10/10</main-classification>  
        <further-classification edition="200601120241220B">G11C11/412</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JUN-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭有策</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YU-TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種靜態隨機存取記憶體，至少包含一第一上拉電晶體(PU1)、一第一下拉電晶體(PD1)、一第二上拉電晶體(PU2)與一第二下拉電晶體(PD2)、一第一讀取電晶體(RPD)與一第二讀取電晶體(RPG)。其中，第一下拉電晶體(PD1)與第二存取電晶體(PG2)各自包含有一閘極結構包含有一P型功函數金屬層，以及一N型功函數金屬層位於P型功函數金屬層上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a static random access memory, which comprises at least a first pull-up transistor (PU1), a first pull-down transistor (PD1), a second pull-up transistor (PU2), a second pull-down transistor (PD2), a first access transistor (PG1), a second access transistor (PG2), a first read port transistor (RPD) and a second read port transistor (RPD). Wherein the gate structures of the first pull-down transistor (PD1) and the second access transistor (PG2) each include a P-type work function metal layer, and an N-type work function metal layer is located on the P-type work function metal layer in the gates of the first pull-down transistor (PD1) and the second access transistor (PG2).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:閘極介電層</p>  
        <p type="p">22:高介電常數層</p>  
        <p type="p">24:底阻障層</p>  
        <p type="p">24A:氮化鈦層</p>  
        <p type="p">24B:氮化鉭層</p>  
        <p type="p">25:P型功函數金屬層</p>  
        <p type="p">26:N型功函數金屬層</p>  
        <p type="p">27:擴散阻擋層</p>  
        <p type="p">28:電極層</p>  
        <p type="p">30:側壁子</p>  
        <p type="p">G1:閘極結構</p>  
        <p type="p">G2:閘極結構</p>  
        <p type="p">G3:閘極結構</p>  
        <p type="p">G4:閘極結構</p>  
        <p type="p">G5:閘極結構</p>  
        <p type="p">PU1:第一上拉電晶體</p>  
        <p type="p">PU2:第二上拉電晶體</p>  
        <p type="p">PD1:第一下拉電晶體</p>  
        <p type="p">PD2:第二下拉電晶體</p>  
        <p type="p">PG1:第一存取電晶體</p>  
        <p type="p">PG2:第二存取電晶體</p>  
        <p type="p">RPD:第一讀取電晶體</p>  
        <p type="p">RPG:第二讀取電晶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="291" publication-number="202612900"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612900.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612900</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136006</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>瓦楞紙成型設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240929B">B31F1/20</main-classification>  
        <further-classification edition="200601120240929B">B31F5/04</further-classification>  
        <further-classification edition="200601120240929B">D21C5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴黌溢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴黌溢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種瓦楞紙成型設備，包含一送紙部、一成型部、一定型部、一上膠部、一原紙部、一預熱部、一壓合部以及一裁切部，其中該送紙部堆疊複數瓦楞平板，供逐片輸出該瓦楞平板，該成型部承接該瓦楞平板，該成型部包括一成型輸送帶以及一成型輪，藉由該成型部將該瓦楞平板滾壓壓製呈波浪狀，透過該定型部定型和該上膠部塗膠，再以該原紙部輸出一原紙經過該預熱部預熱，及通過該壓合部將預熱後的該原紙與該瓦楞平板呈波浪狀壓合乾燥後為平整的瓦楞紙，經由該裁切部以裁切兩個該瓦楞紙之間上方的該原紙，而以水平方向完成該瓦楞紙的生產，減少生產過程該瓦楞紙的變形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:瓦楞紙成型設備</p>  
        <p type="p">3:送紙部</p>  
        <p type="p">4:成型部</p>  
        <p type="p">41:成型輸送帶</p>  
        <p type="p">411:第一成型齒</p>  
        <p type="p">4121:齒輪</p>  
        <p type="p">414:鏈條</p>  
        <p type="p">42:成型輪</p>  
        <p type="p">421:第二成型齒</p>  
        <p type="p">5:定型部</p>  
        <p type="p">51:上模桿</p>  
        <p type="p">52:壓桿</p>  
        <p type="p">6:上膠部</p>  
        <p type="p">61:噴嘴</p>  
        <p type="p">7:原紙部</p>  
        <p type="p">71:原紙架</p>  
        <p type="p">72:原紙捲筒</p>  
        <p type="p">73:滾輪</p>  
        <p type="p">74:原紙</p>  
        <p type="p">8:預熱部</p>  
        <p type="p">81:導入輪</p>  
        <p type="p">82:預熱輪</p>  
        <p type="p">83:塑壓輪</p>  
        <p type="p">9:壓合部</p>  
        <p type="p">91:輸送帶式壓輪</p>  
        <p type="p">92:裁切部</p>  
        <p type="p">P:瓦楞平板</p>  
        <p type="p">P1:瓦楞紙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="292" publication-number="202614526"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614526.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614526</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136007</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種綠能供電的溫控空間模組</chinese-title>  
        <english-title>A TEMPERATURE-CONTROLLED SPACE MODULE POWERED BY GREEN ENERGY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241203B">H02J1/00</main-classification>  
        <further-classification edition="200601120241203B">H02J13/00</further-classification>  
        <further-classification edition="200601120241203B">H02J15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鴻文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HON WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>宜蘭縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鴻文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HON WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一種綠能供電的溫控空間模組，使用綠能及全直流製冷系統的最佳模組化結構設計，合理配置太陽能板等綠能供電、儲能系統、優化製冷系統等工作單元，實現自給自足的綠能供電系統。消除對外部電網和化石燃料的依賴，可應用於無電網覆蓋的偏遠地區需溫控空間之需求，大量降低運營成本和能源消耗及二氧化碳排放狀態，達到能源使用的高度韌性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a green energy-powered temperature-controlled space module, which uses the optimal modular design of a green energy and fully DC refrigeration system. It reasonably configures work units such as green energy power supply (e.g., solar panels), energy storage systems, and optimized refrigeration systems to achieve a self-sufficient green energy power supply. This system eliminates reliance on external power grids and fossil fuels, making it applicable to temperature-controlled spaces in remote areas without grid coverage. It significantly reduces operational costs, energy consumption, and carbon dioxide emissions, achieving a high level of energy resilience.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:綠能供電的低溫空間模組</p>  
        <p type="p">2:空間結構基座</p>  
        <p type="p">3:溫控空間</p>  
        <p type="p">31:複合絕熱層</p>  
        <p type="p">32:內含物</p>  
        <p type="p">4:綠能供電模組</p>  
        <p type="p">5:儲能系統</p>  
        <p type="p">6:直流電溫控系統</p>  
        <p type="p">61:溫控外部單元</p>  
        <p type="p">62:溫控內部單元</p>  
        <p type="p">7:電路控制系統</p>  
        <p type="p">8:遠程監控系統</p>  
        <p type="p">81:感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="293" publication-number="202612669"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612669.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612669</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136009</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>復健醫療用椅之連動機構改良</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241031B">A61G5/10</main-classification>  
        <further-classification edition="200601120241031B">A61G5/12</further-classification>  
        <further-classification edition="200601120241031B">A61G1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳玟均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳玟均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種復健醫療用椅之連動機構改良，係主要由一主架體具有二平行之側架，各該側架上設置有一扶手側板，且二該側架之間至少樞接有一主轉動桿，而二該扶手側板之間至少結合有一伸縮阻尼驅動器、一座架組件、一椅背架組件、一腿靠架組件、以及一升降機構組件，該座架組件之前、後側分別連結該腿靠架組件及椅背架組件，該升降機構組件連結驅動該座架組件上升或下降，其中，該伸縮阻尼驅動器連接並驅動該主轉動桿轉動，再藉由一第一擺動桿連動該椅背架組件產生擺動，使得該座架組件、升降機構組件、以及腿靠架組件之間同時各產生不同擺動的夾角度；藉此，當使用復健醫療用椅時，得藉由伸縮阻尼驅動器間接擺動椅背架組件，調整上半身坐、躺姿勢、以及腿部抵靠的角度與高度，並使該升降機構組件、座架組件、以及腿靠架組件的構件之間能夠順利地連動，以確保機台的安全、品質且延長使用壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">5:第一長形剖槽</p>  
        <p type="p">6:第二長形剖槽</p>  
        <p type="p">11:升降導位板</p>  
        <p type="p">13:主轉動桿</p>  
        <p type="p">131:樞耳</p>  
        <p type="p">16:第一擺動桿</p>  
        <p type="p">161:第一固定桿</p>  
        <p type="p">18:第二固定桿</p>  
        <p type="p">19:第二擺動桿</p>  
        <p type="p">20:伸縮阻尼驅動器</p>  
        <p type="p">21:伸縮桿</p>  
        <p type="p">22:馬達裝置</p>  
        <p type="p">31:座架</p>  
        <p type="p">32:第一從動桿</p>  
        <p type="p">33:第三擺動桿</p>  
        <p type="p">34:第一連動件</p>  
        <p type="p">35:第二連動件</p>  
        <p type="p">36:第三同步連接桿</p>  
        <p type="p">41:連接件</p>  
        <p type="p">42:第四擺動桿</p>  
        <p type="p">43:背架</p>  
        <p type="p">44:第四同步連接桿</p>  
        <p type="p">45:第五同步連接桿</p>  
        <p type="p">51:第一擺動件</p>  
        <p type="p">52:從動件</p>  
        <p type="p">53:第二擺動件</p>  
        <p type="p">61:第一外側擺動桿</p>  
        <p type="p">62:第二外側擺動桿</p>  
        <p type="p">63:連動件</p>  
        <p type="p">64:彈簧</p>  
        <p type="p">65:導位柱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="294" publication-number="202613034"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613034.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613034</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136010</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硫酸氧釩的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING VANADYL SULFATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240926B">C01G31/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虹京金屬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG JING METAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫玉龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YU-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-ZHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉永浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YUNG-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種硫酸氧釩的製造方法，用以解決習知方法的高成本的問題。該方法包含：將一釩鉬廢觸媒焙燒物以水液進行粗萃取，形成一含釩鉬水溶液；將該含釩鉬水溶液的酸鹼值調整為酸性，形成一酸性含釩鉬貴液，續使該酸性含釩鉬貴液中的正五價釩離子還原為正四價釩離子，得一經還原含釩鉬貴液；以一第一萃取劑萃取該經還原含釩鉬貴液，得一含鉬萃取液及一剩餘萃取液；以一第二萃取劑萃取該剩餘萃取液，得一含釩萃取液；及以一硫酸水溶液反萃取該含釩萃取液，使該含釩萃取液中的正四價釩離子分配於該硫酸水溶液中，得一硫酸氧釩水溶液。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing vanadyl sulfate is used to solve the problem of high cost of the conventional method. The method includes: coarsely extracting a roasted product of vanadium molybdenum waste catalyst with water to obtain a V-Mo-containing aqueous solution; adjusting the pH value of the V-Mo-containing aqueous solution to acidic to form an acidic V-Mo-containing noble solution, followed by reducing the V &lt;sup&gt;5+&lt;/sup&gt;ion in the acidic V-Mo-containing noble solution to V &lt;sup&gt;4+&lt;/sup&gt;ion to obtain a reduced V-Mo-containing liquid; extracting the reduced V-Mo-containing liquid with a first extractant to obtain a molybdenum-containing extract and a remaining extract; extracting the remaining extract with a second extractant to obtain a vanadium-containing extraction solution; and reversely extracting the vanadium-containing extraction solution by an aqueous sulfuric solution to allocate the V &lt;sup&gt;4+&lt;/sup&gt;ion to the aqueous sulfuric solution, forming an aqueous solution of vanadyl sulfate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:粗萃取步驟</p>  
        <p type="p">S2:除鋁步驟</p>  
        <p type="p">S3:還原步驟</p>  
        <p type="p">S4:鉬萃取步驟</p>  
        <p type="p">S5:分離步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="295" publication-number="202614478"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614478.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614478</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136015</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無人載具天線抑制敵方干擾及增進我方信號強度的系統架構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">H01Q1/27</main-classification>  
        <further-classification edition="200601120250102B">H01Q1/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全波科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童玉瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種無人載具天線抑制敵方干擾及增進我方信號強度的系統架構，包含: 一無人載具，其機體表面至少設有一全向性天線；當無人載具在「前進」時，其前方以一金屬板遮蔽，不讓信號往前輻射，且完全不影響我方與該無人載具的通訊；反之，當無人載具在「回程」時，改由後方以一金屬板遮蔽，不讓信號往後輻射，據以抑制敵方干擾信號；且金屬板上設有眾多的空氣流通孔，可降低無人載具在行進時的風阻，再者，金屬板除了具有抑制敵方干擾信號之外，因其與全向性天線共同接地，使得金屬板同時成為一輻射信號的增強板，提高無人載具的天線輻射效率，有效擴大天線的覆蓋範圍，具有提高與我方的通信品質之功效增進。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:無人載具</p>  
        <p type="p">11:機體表面</p>  
        <p type="p">20:全向性天線</p>  
        <p type="p">30F:第一金屬板</p>  
        <p type="p">30R:第二金屬板</p>  
        <p type="p">40:接地介面</p>  
        <p type="p">50F:第一制動模組</p>  
        <p type="p">50R:第二制動模組</p>  
        <p type="p">60:控制模組</p>  
        <p type="p">61:通信模組</p>  
        <p type="p">62:導航感測模組</p>  
        <p type="p">63:動力源</p>  
        <p type="p">64:供電模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="296" publication-number="202614357"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614357.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614357</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136017</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件及其製作方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">H01L21/76</main-classification>  
        <further-classification edition="202501120250102B">H10D30/01</further-classification>  
        <further-classification edition="202501120250102B">H10D30/60</further-classification>  
        <further-classification edition="202501120250102B">H10D62/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHANG-YIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李國興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUO-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾坤賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, KUN-SZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭鳳筠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, FENG-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫偉鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, WEI-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翊文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王堯展</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YAO-JHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種製作半導體元件的方法，其主要先形成第一井區於一基底內，然後形成一淺溝隔離於該第一井區兩側，形成一閘極結構於該基底上，形成複數個摻雜區於該閘極結構兩側，再形成複數個接觸插塞於該等摻雜區上。其中第一井區深度小於淺溝隔離深度且第一井區以及該等摻雜區包含不同導電型式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for fabricating a semiconductor device includes the steps of first forming a first well region in a substrate, forming a shallow trench isolation (STI) adjacent to two sides of the first well region, forming a gate structure on the substrate, forming doped regions adjacent to two sides of the gate structure, and then forming contact plugs on the doped regions. Preferably, a depth of the first well region is less than a depth of the STI and the first well region and the doped regions have different conductive type.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:基底</p>  
        <p type="p">14:深N井</p>  
        <p type="p">16:P井</p>  
        <p type="p">18:N井</p>  
        <p type="p">20:淺溝隔離</p>  
        <p type="p">22:閘極結構</p>  
        <p type="p">24:閘極結構</p>  
        <p type="p">26:閘極介電層</p>  
        <p type="p">30:側壁子</p>  
        <p type="p">32:摻雜區</p>  
        <p type="p">34:矽化金屬層</p>  
        <p type="p">40:層間介電層</p>  
        <p type="p">42:高介電常數介電層</p>  
        <p type="p">44:功函數金屬層</p>  
        <p type="p">46:低阻抗金屬層</p>  
        <p type="p">48:硬遮罩</p>  
        <p type="p">50:層間介電層</p>  
        <p type="p">52:接觸插塞</p>  
        <p type="p">54:金屬間介電層</p>  
        <p type="p">56:金屬內連線</p>  
        <p type="p">102:OTP電容區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="297" publication-number="202612606"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612606.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612606</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136018</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多功能手機收納結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241030B">A45C1/02</main-classification>  
        <further-classification edition="200601120241030B">A45C13/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富美盛科技材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU MEI SHENG MATERIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳芳池</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多功能手機收納結構，其包含有一收納包，收納包可固定於一組合部上，其中，收納包具有二本體，本體之間一側相連並設有一拉鏈，拉鏈可使二本體閉合或張開，二本體內部兩側各設有一可調整長度之拉掣繩以限制二本體張開的角度，一本體內側設有一黏合面，數輔助固定件可自由與黏合面黏合固定，輔助固定件設有一具彈性之固定帶，以固定帶可夾住一行動裝置的角落從而將其固定，收納包設有數組合條用以固定於組合部上，組合部可設於背心或背包上。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">(10):收納包</p>  
        <p type="p">(111):黏合面</p>  
        <p type="p">(13):拉掣繩</p>  
        <p type="p">(141):固定帶</p>  
        <p type="p">(15):組合條</p>  
        <p type="p">(11):本體</p>  
        <p type="p">(12):拉鏈</p>  
        <p type="p">(14):輔助固定件</p>  
        <p type="p">(142):加固板</p>  
        <p type="p">(151):組合條緣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="298" publication-number="202613399"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613399.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613399</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136019</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>窗簾限位連動裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241031B">E06B9/32</main-classification>  
        <further-classification edition="200601120241031B">E06B9/56</further-classification>  
        <further-classification edition="200601120241031B">A47H3/02</further-classification>  
        <further-classification edition="200601120241031B">A47H5/06</further-classification>  
        <further-classification edition="200601120241031B">A47H1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>進東窗飾有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳孝誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳芳池</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種窗簾限位連動裝置，包括一連動件以及一離合件，該連動件具有一底座、一頂蓋、一第一螺桿以及一第二螺桿，該底座與該頂蓋係相對合組裝，並於之間界定出中空圓柱狀之一制動槽道，該第一螺桿以及該第二螺桿係分別螺設於該制動槽道兩端，該連動件係分別透過該第一、第二螺桿達到窗簾上樑以及下樑的升降控制，不僅可在該下樑上移時連動該上樑同步作動，另一方面更搭配該離合件具有齒合連動以及跳脫空轉之效果，可避免該連動件過度操作，進一步防止該第一、第二拉繩器同步轉動，並有效減少繩體纏繞打結之情況，大幅提升結構耐用度及實用性者。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">10:連動件</p>  
        <p type="p">11:底座</p>  
        <p type="p">12:頂蓋</p>  
        <p type="p">126:剖槽</p>  
        <p type="p">127:補強凸肋</p>  
        <p type="p">13:第一螺桿</p>  
        <p type="p">14:第二螺桿</p>  
        <p type="p">20:離合件</p>  
        <p type="p">21:殼體</p>  
        <p type="p">217:卡扣柱</p>  
        <p type="p">24:從動塊</p>  
        <p type="p">241:中心軸柱</p>  
        <p type="p">36:第一驅動軸</p>  
        <p type="p">38:第二驅動軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="299" publication-number="202614408"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614408.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614408</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136020</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子元件及電子封裝件之製法</chinese-title>  
        <english-title>ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF ELECTRONIC PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241203B">H01L23/48</main-classification>  
        <further-classification edition="200601120241203B">H01L21/56</further-classification>  
        <further-classification edition="200601120241203B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽品精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯景中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, CHING-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子元件及電子封裝件之製法，主要提供一包含有電子主體之電子元件，該電子主體具有相對之第一側與第二側，該第一側上形成有複數第一導電凸塊，該第二側上形成有複數第二導電凸塊，並以包覆層包覆該複數第二導電凸塊，以令機械手臂能以真空吸附方式吸附該電子元件之包覆層，避免發生電子元件掉落之問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic component and a method for manufacturing electronic package, which mainly provides an electronic component including an electronic body. The electronic body has a first side and a second side opposite to each other. A plurality of first conductive bumps are formed on the first side and a plurality of second conductive bumps are formed on the second side, and the plurality of second conductive bumps are covered with a coating layer, so that a bonding head can adsorb the coating layer of the electronic component by vacuum suction to avoid the occurrence of problems with falling electronic component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2a:電子元件</p>  
        <p type="p">20:電子主體</p>  
        <p type="p">20a:第一側</p>  
        <p type="p">20b:第二側</p>  
        <p type="p">200:導電穿孔</p>  
        <p type="p">21:第一導電凸塊</p>  
        <p type="p">22:第二導電凸塊</p>  
        <p type="p">23:線路層</p>  
        <p type="p">24:包覆層</p>  
        <p type="p">24a:第一表面</p>  
        <p type="p">24b:第二表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="300" publication-number="202613384"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613384.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613384</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136023</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>平面轉成立體的三角錐</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120241105B">E01F9/654</main-classification>  
        <further-classification edition="200601220241105B">B60Q7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭翠菁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭翠菁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許耿禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一種平面轉成立體的三角錐，包含一錐體，該錐體係呈中空圓錐狀，由可撓性的扇形片體捲曲而成，該錐體的圓錐面上設有複數透孔、複數插孔及至少一卡槽，而可配合底座組合使用或單獨使用，以實現產品多樣性，不僅降低製作成本和庫存壓力，符合節能減碳要求，還可以根據消費者需求自由搭配組裝不同的錐體和底座，提升產品的實用性，此外，該設計有助於降低風阻，減少被風吹倒的風險，同時減少包裝材積，降低運輸成本及運輸碳排放。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:錐體</p>  
        <p type="p">11:大徑端</p>  
        <p type="p">111:固定柱</p>  
        <p type="p">13:圓錐面</p>  
        <p type="p">131:透孔</p>  
        <p type="p">132:插孔</p>  
        <p type="p">20:底座</p>  
        <p type="p">21:穿孔</p>  
        <p type="p">22:結合孔</p>  
        <p type="p">221:導入部</p>  
        <p type="p">222:定位部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="301" publication-number="202614522"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614522.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614522</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136024</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光元件及其製造方法</chinese-title>  
        <english-title>LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">H01S5/30</main-classification>  
        <further-classification edition="202501120250102B">H10H20/857</further-classification>  
        <further-classification edition="202501120250102B">H10H20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳權威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUAN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李尚澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHANG-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳皇名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUANG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種發光元件及其製造方法，發光元件包含一磊晶層、一第一接觸電極、一蕭特基介面、一第一金屬墊、一第二接觸電極以及一第二金屬墊。該磊晶層具有一溝槽，將磊晶層縱向分割為彼此分離之一第一區域及一第二區域。第一接觸電極設置於磊晶層之上，且包含一開孔，電性連接第一區域之上表面，其中第一區域於開孔以下具有一電流侷限區。蕭特基介面設置於電流侷限區外圍之第一區域之上表面，與部分之第一接觸電極間形成一蕭特基能障。第一金屬墊設置於磊晶層之第二區域之下，且縱向延伸而電性連接第一接觸電極。第二接觸電極設置於磊晶層之上，電性連接第二區域之上表面。第二金屬墊設置於磊晶層之第一區域之下，且縱向延伸而電性連接第二接觸電極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light-emitting device and a manufacturing method thereof are provided. The light-emitting device includes an epitaxial layer, a first contact electrode, a Schottky interface, a first metal pad, a second contact electrode and a second metal pad. The epitaxial layer has a trench, which longitudinally divides the epitaxial layer into a first region and a second region that are separated from each other. The first contact electrode is disposed on the epitaxial layer and includes an opening electrically connected to the upper surface of the first region, wherein the first region has a current confinement region below the opening. The Schottky interface is disposed on the upper surface of the first area outside the current confinement region, and forms a Schottky barrier between the interface and part of the first contact electrode. The first metal pad is disposed under the second region of the epitaxial layer and extends longitudinally to electrically connect to the first contact electrode. The second contact electrode is disposed on the epitaxial layer and is electrically connected to the upper surface of the second region. The second metal pad is disposed under the first region of the epitaxial layer and extends longitudinally to electrically connect the second contact electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:發光元件</p>  
        <p type="p">11:磊晶層</p>  
        <p type="p">11a:N型磊晶層</p>  
        <p type="p">11b:多重量子井</p>  
        <p type="p">11c:P型磊晶層</p>  
        <p type="p">11d:電流阻障層</p>  
        <p type="p">11e:氧化孔徑</p>  
        <p type="p">12:第一接觸電極</p>  
        <p type="p">12a:開孔</p>  
        <p type="p">13:第二接觸電極</p>  
        <p type="p">14:第一金屬墊</p>  
        <p type="p">15:第二金屬墊</p>  
        <p type="p">16:溝槽</p>  
        <p type="p">17:第一縱向貫穿孔</p>  
        <p type="p">18:第二縱向貫穿孔</p>  
        <p type="p">19:歐姆接觸介面</p>  
        <p type="p">20:蕭特基介面</p>  
        <p type="p">R1:第一區域</p>  
        <p type="p">R2:第二區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="302" publication-number="202613856"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613856.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613856</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136025</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>身份註冊方法及身份註冊裝置</chinese-title>  
        <english-title>IDENTIFICATION REGISTRATION METHOD AND IDENTIFICATION REGISTRATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250102B">G06F21/32</main-classification>  
        <further-classification edition="201301120250102B">G06F21/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁冬昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, DONG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王瀚陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAN-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃思博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SZU-PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳世澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIH-TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種身份註冊方法，由處理器讀取儲存於記憶體的至少一指令所執行，上述身份註冊方法包含以下步驟：於作業系統的生物識別登入之身份註冊開始時，傳送開始命令至影像擷取裝置；由影像擷取裝置根據開始命令以擷取複數個第一影像；由影像擷取裝置的神經處理器對複數個第一影像進行第一影像處理以取得第一生物識別特徵；以及由影像擷取裝置的神經處理器註冊第一生物識別特徵於快閃記憶體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An identification registration method executed by a processor reading at least command stored in a memory is disclosed herein. The identification registration method includes following steps: when an identification registration of a biometric login of an operation system begins, transmitting an activation command to an image capturing device; capturing a plurality of first images according to the activation command by the image capturing device; executing a first image processing to the plurality of first images to obtain a first biometric feature by a neural processor of the image capturing device; and registering the first biometric feature in a flash memory by the neural processor of the image capturing device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:方法</p>  
        <p type="p">210~240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="303" publication-number="202612992"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612992.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612992</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136028</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保鮮防黴紙及其製備方法</chinese-title>  
        <english-title>FRESH-KEEPING AND ANTIFUNGAL PAPER AND THE MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B65D81/24</main-classification>  
        <further-classification edition="200601120241105B">D21H21/14</further-classification>  
        <further-classification edition="200601120241105B">D21H27/10</further-classification>  
        <further-classification edition="200601120241105B">A23B7/154</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新川創新股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUSTAINABLE CARBOHYDRATE INNOVATION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游璟筠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHING-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施承昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHENG-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種保鮮防黴紙及其製備方法。保鮮防黴紙包括紙基材層及塗佈層，其中該塗佈層由保鮮防黴液塗佈而成，該保鮮防黴液包括：熱封性樹脂、蠟及防黴劑的混合物。一種保鮮防黴紙的製備方法，其中該方法包括以下步驟：S1：混合並攪拌熱封性樹脂及蠟以獲得保鮮劑；S2：將防黴劑添加至該保鮮劑中並進行混合及攪拌以獲得保鮮防黴液；S3：將該保鮮防黴液塗佈在紙質基材上以獲得保鮮防黴紙。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a fresh-keeping and antifungal paper and the manufacturing method thereof. The fresh-keeping and antifungal paper includes a paper substrate layer and a coating layer, wherein the coating layer is formed by coating fresh-keeping and antifungal solution. The fresh-keeping and antifungal solution includes a mixture of heat-sealing resin, wax, and antifungal agents. The manufacturing method of the fresh-keeping and antifungal paper includes the following steps: S1: Mixing and stirring the heat-sealing resin and wax to obtain a fresh-keeping solution. S2: Adding the antifungal agents to the fresh-keeping solution, then mixing and stirring to obtain the fresh-keeping and antifungal solution. S3: Coating the fresh-keeping and antifungal solution on the paper substrate to obtain the fresh-keeping and antifungal paper.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:步驟</p>  
        <p type="p">S2:步驟</p>  
        <p type="p">S3:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="304" publication-number="202614487"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614487.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614487</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136030</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天線調諧系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120250102B">H01Q5/30</main-classification>  
        <further-classification edition="200601120250102B">H01Q1/12</further-classification>  
        <further-classification edition="200601120250102B">H01Q9/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上緯科技電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周祐邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳毅文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周鈞廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉爾順</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種天線調諧系統，包括天線模組以及調諧模組。天線模組具有饋入路徑以及接地路徑，以及調諧模組與天線模組的接地路徑連接，調諧模組包括複數個被動元件電路以及開關電路。複數個被動元件電路與天線模組的接地路徑連接，以及開關電路與複數個被動元件電路連接，且開關電路的共接點與一接地端連接，其中，開關電路用以選擇將複數個被動元件電路中的至少其中之一與接地端連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:天線模組</p>  
        <p type="p">100:饋入路徑</p>  
        <p type="p">101:接地路徑</p>  
        <p type="p">11:調諧模組</p>  
        <p type="p">110a、110b、110c、110d:被動元件電路</p>  
        <p type="p">111:開關電路</p>  
        <p type="p">112:接地端</p>  
        <p type="p">Feed point:饋入點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="305" publication-number="202613403"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613403.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613403</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136031</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>改良式洋流發電系統</chinese-title>  
        <english-title>IMPROVED OCEAN CURRENT POWER GENERATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241203B">F03B13/12</main-classification>  
        <further-classification edition="200601120241203B">F03B15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>軒陽科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORN SUN TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>嘉義市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張萬子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WAN ZEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王德文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種改良式洋流發電系統，係用以藉海洋的海流進行發電及儲存電力，其包含有：一固定平台，漂浮於海面上；一活動平台，漂浮於海面上並連接於該固定平台，可受海流驅動而相對該固定平台移動；一第一發電模組，具有一絞盤、一纜繩及一第一發電機；該絞盤設於該固定平台與該活動平台之其中一者；該纜繩一端纏繞於該絞盤，另一端連接於該固定平台與該活動平台之另一者，用以於該活動平台相對該固定平台位移時驅動該絞盤轉動；該第一發電機連接於該絞盤，用以將該絞盤轉動之動力轉化為電力；一阻滯模組，設於該固定平台與該活動平台之其中一者且至少一部分沉入海面下，用以受驅動而調整海流所產生之阻滯力大小；以及一控制模組，連接該阻滯模組，用以在二該平台相互遠離時驅動該組滯模組提升海流所產生之阻滯力，及二該平台相互接近時驅動該組滯模組降低海流所產生之阻滯力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An improved ocean current power generation system, designed to generate and store electricity using ocean currents, comprises: A fixed platform floating on the sea surface; A movable platform floating on the sea surface and connected to the fixed platform, which can move relative to the fixed platform driven by ocean currents; A first power generation module that includes a winch, a cable, and a first generator. The winch is installed on either the fixed platform or the movable platform, with one end of the cable wound around the winch and the other end connected to the other platform. As the movable platform moves relative to the fixed platform, it drives the winch to rotate; The first generator is connected to the winch and converts the rotational energy of the winch into electricity; A resistance module, installed on either the fixed or movable platform, with at least a portion submerged beneath the water's surface, used to adjust the resistance generated by ocean currents when driven; A control module connected to the resistance module, designed to increase the resistance force generated by ocean currents when the two platforms move apart, and to decrease the resistance force when the platforms move closer to each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:固定平台</p>  
        <p type="p">11:固定件</p>  
        <p type="p">20:活動平台</p>  
        <p type="p">21:風帆</p>  
        <p type="p">22:風箏</p>  
        <p type="p">30:第一發電模組</p>  
        <p type="p">31:絞盤</p>  
        <p type="p">32:纜繩</p>  
        <p type="p">34:第一發電機</p>  
        <p type="p">35:儲能單元</p>  
        <p type="p">40:阻滯模組</p>  
        <p type="p">41:基座</p>  
        <p type="p">42:活動件</p>  
        <p type="p">52:第一驅動單元</p>  
        <p type="p">60:第二發電模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="306" publication-number="202614014"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614014.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614014</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136034</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提高第1行LED燈珠亮度之方法及資訊處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120241101B">G09G3/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京集創北方科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIPONE TECHNOLOGY (BEIJING) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏子豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張漢儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉盛豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明主要揭示一種提高第1行LED燈珠亮度之方法，供一LED顯示驅動晶片執行，且包括以下步驟：該LED行驅動電路對第1行的X個所述LED燈珠執行所述行掃描操作之時，在所述第一子時間區間內對各所述源極線的一源極線電壓執行一電壓調降處理。如此，在應用本發明之方法的情況下，常發生在LED顯示裝置的第1行LED燈珠亮度偏暗的問題係獲得有效解決。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:LED顯示裝置</p>  
        <p type="p">11:LED面板</p>  
        <p type="p">110:寄生電容</p>  
        <p type="p">111:LED燈珠</p>  
        <p type="p">11G:閘極線</p>  
        <p type="p">11S:源極線</p>  
        <p type="p">12:LED行驅動電路</p>  
        <p type="p">13:LED顯示驅動晶片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="307" publication-number="202614623"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614623.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614623</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136035</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>幀間隔調整方法、LED控制電路及LED顯示器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120241104B">H04N21/44</main-classification>  
        <further-classification edition="201601120241104B">G09G3/3208</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京集創北方科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIPONE TECHNOLOGY (BEIJING) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李士達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雍尚剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉盛豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種幀間隔調整方法，係應用於一LED控制電路中，且其包括：設定一幀期間之多個子幀期間之總數之初始值為n，n為大於1之整數；偵測任二相鄰所述幀期間中之在前幀之第n個子幀的結束時點與在後幀之垂直同步信號的起始時點之時間差；以及依該時間差與一閾值範圍之相對關係對該在後幀進行一子幀修調操作，其中，當該時間差大於該閾值範圍之上限時，增加該些子幀期間之間隔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟a:設定一幀期間之多個子幀期間之總數之初始值為n，n為大於1之整數</p>  
        <p type="p">步驟b:偵測任二相鄰所述幀期間中之在前幀之第n個子幀的結束時點與在後幀之垂直同步信號的起始時點之時間差</p>  
        <p type="p">步驟c:依該時間差與一閾值範圍之相對關係對該在後幀進行一子幀修調操作，其中，當該時間差大於該閾值範圍之上限時，增加該些子幀期間之間隔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="308" publication-number="202613997"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613997.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613997</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136036</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導讀系統及導讀方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240927B">G09B5/06</main-classification>  
        <further-classification edition="201201120240927B">G06Q50/20</further-classification>  
        <further-classification edition="200601120240927B">G06K19/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晶實科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STUDIO A INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程應龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YING-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種導讀系統，包括：計算機裝置，包括顯示器及應用程式，應用程式中儲存書籍內容資料、多語言翻譯內容資料以及互動提示資訊；以及讀取裝置，包括掃描單元且電性連接至計算機裝置；其中，讀取裝置藉由掃描單元掃描書籍的封面資訊，應用程式讀取封面資訊，並從書籍內容資料中找出對應的書籍封面資料，且將書籍封面資料顯示於顯示器上，讀取裝置藉由掃描單元掃描書籍的頁碼資訊，應用程式讀取頁碼資訊，並將對應的書籍內容資料及/或多語言翻譯內容資料及/或互動提示資訊顯示在顯示器上。再者，本發明亦提供一種導讀方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:導讀系統</p>  
        <p type="p">10:計算機裝置</p>  
        <p type="p">20:讀取裝置</p>  
        <p type="p">30:書籍</p>  
        <p type="p">101:顯示器</p>  
        <p type="p">103:應用程式</p>  
        <p type="p">1031:書籍內容資料</p>  
        <p type="p">1033:多語言翻譯內容資料</p>  
        <p type="p">1035:互動提示資訊</p>  
        <p type="p">201:掃描單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="309" publication-number="202613766"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613766.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613766</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136038</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>平板電腦保護套裝置</chinese-title>  
        <english-title>TABLET COMPUTER PROTECTIVE CASE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241203B">G06F1/16</main-classification>  
        <further-classification edition="200601120241203B">H05K7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樂晴科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNNYLOVE TECHNOLOGY COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林國元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳啟桐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖和信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">平板電腦保護套裝置用以收納一平板電腦，平板電腦包括一平板母接頭。平板電腦保護套裝置包括一保護套本體。保護套本體包括一主平面板、一側邊牆板、一導電連接線和一容納空間。側邊牆板連接於主平面板周圍，其中側邊牆板包括一公接頭，公接頭用以連接平板母接頭。導電連接線用以連接公接頭。容納空間由主平面板與側邊牆板所形成，以收納平板電腦。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tablet computer protective case device is used for storing a tablet computer, and the tablet computer includes a tablet female connector. The tablet computer protective case device includes a protective case body. The protective cover body includes a main plane plate, a side wall plate, a conductive connecting wire and an accommodation space. The side wall plate is connected around the main plane plate, wherein the side wall plate includes a male connector, and the male connector is used for connecting to the tablet female connector. The conductive connecting wire is used for connecting to the male connector. The accommodation space is formed by the main plane plate and the side wall plate, to store the tablet computer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:平板電腦保護套裝置</p>  
        <p type="p">10:保護套本體</p>  
        <p type="p">11:主平面板</p>  
        <p type="p">13:側邊牆板</p>  
        <p type="p">13b:底側</p>  
        <p type="p">131:公接頭</p>  
        <p type="p">15:導電連接線</p>  
        <p type="p">19:容納空間</p>  
        <p type="p">30:鍵盤</p>  
        <p type="p">31:按鍵</p>  
        <p type="p">35:鍵盤母接頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="310" publication-number="202613966"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613966.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613966</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136041</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像特徵增強方法及電子裝置</chinese-title>  
        <english-title>IMAGE FEATURE ENHANCEMENT METHOD AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250102B">G06T5/70</main-classification>  
        <further-classification edition="202401120250102B">G06T5/73</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華碩電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUSTEK COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李先揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HSIEN-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉佛明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIOU, FOU-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊佳霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIA-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政大</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭露一種影像特徵增強方法及電子裝置。此影像特徵增強方法包含：對一原始影像進行模糊化處理，以取得一第一模糊影像；計算原始影像及第一模糊影像之差異，以提取一第一紋理特徵影像；對第一模糊影像及第一紋理特徵影像分別進行伽馬校正，以產生校正後的一第二模糊影像及一第二紋理特徵影像；以及合併第二模糊影像及第二紋理特徵影像，以產生特徵強化後的一最終影像。本案可以快速強化影像的紋理特徵結構，使影像看起來更為清晰。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides an image feature enhancement method and an electronic device. The image feature enhancement method includes: blurring an original image to obtain a first blurred image; calculating a difference between the original image and the first blurred image to extract a first texture feature image; performing gamma correction on the first blurred image and the first texture feature image respectively to generate a second blurred image and a second texture feature image; and merging the second blurred image and the second texture feature image to generate a final image with enhanced features. The disclosure can quickly enhance the texture feature structure of the image to make the image look clearer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S16:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="311" publication-number="202612653"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612653.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612653</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136045</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電腦斷層影像之定位與辨識方法及其系統</chinese-title>  
        <english-title>LOCALIZATION AND IDENTIFICATION METHOD AND SYSTEM FOR COMPUTED TOMOGRAPHY IMAGES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">A61B6/03</main-classification>  
        <further-classification edition="200601120241204B">A61B6/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立陽明交通大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUN YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘　婕立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUPTA, PUSHPANJALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許耀峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YAO CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHE LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱原嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, YUAN CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱家聲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, CHIA SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昭亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JAW LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李騰裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TENG YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡坤旺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明包括自動對局部肝臟病灶進行初始定位，然後進行二元分類（例如良性或惡性）或多類別分類（例如肝細胞癌、血管瘤或囊腫）。資料蒐集包含病人的人口學數據，例如性別、年齡以及與病人相關的電腦斷層影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention involves the automatic initial localization of focal liver lesions, followed by binary classification (e.g., benign or malignant) or multiclass classification (e.g., hepatocellular carcinoma, hemangioma, or cyst). Data collection includes patient demographic information such as gender, age, and computed tomography (CT) images relevant to the patient.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:局部肝臟病灶診斷方法</p>  
        <p type="p">410,420,430,440,450,460,470:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="312" publication-number="202614446"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614446.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614446</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136048</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241202B">H01L23/58</main-classification>  
        <further-classification edition="200601120241202B">H01L23/60</further-classification>  
        <further-classification edition="202001120241202B">G01R31/26</further-classification>  
        <further-classification edition="200601120241202B">G01R1/067</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>積亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇信銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HSIN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡名彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體結構及其製造方法，其中半導體結構包含一元件區域、一接面終端區域、一切割道區域及一保護層，其中接面終端區域環設於元件區域外圍，具有複數個防護環設置於接面終端區域中且環設於元件區域外圍。切割道區域環設於接面終端區域外圍。保護層覆蓋接面終端區域及切割道區域，其中保護層實質防止切割道區域於進行一高壓測試時因產生電弧而損壞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure comprises a cell region, a junction terminal region, a street line and a passivation layer. The junction terminal region is disposed to surround the cell region and has a plurality of guard rings which are disposed in the junction terminal region and surround the cell region. The street line is disposed to surround the junction terminal region. The passivation layer covers the junction terminal region and the street line, and the passivation layer substantially prevents the street line from being damaged due to arcing generated during a high-voltage test.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:碳化矽基板</p>  
        <p type="p">20:磊晶層</p>  
        <p type="p">30:主動元件</p>  
        <p type="p">40:防護環</p>  
        <p type="p">50:多晶矽層</p>  
        <p type="p">60:層間介電層</p>  
        <p type="p">70:金屬層</p>  
        <p type="p">80:保護層</p>  
        <p type="p">A:元件區域</p>  
        <p type="p">B:接面終端區域</p>  
        <p type="p">C:晶粒邊緣區域</p>  
        <p type="p">D:切割道區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="313" publication-number="202613968"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613968.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613968</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136051</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智慧化冬蟲夏草生產系統及方法</chinese-title>  
        <english-title>INTELLIGENT OPHIOCORDYCEPS SINENSIS PRODUCTION SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120241001B">G06T7/00</main-classification>  
        <further-classification edition="202301120241001B">G06N3/04</further-classification>  
        <further-classification edition="200601120241001B">C12N1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中山大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許煜亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YU-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張興政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSING-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, KUA-NJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇科銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, KE-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭景元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, CHING-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種智慧化冬蟲夏草生產系統，包含：一蠶蛹品質檢測裝置，包含：一影像擷取單元，用以擷取一蠶繭之一蠶繭透光影像；以及一品質檢測伺服器，包含：一影像前處理模組，用以對蠶繭透光影像進行影像前處理；以及一智慧分類模組，用以根據蠶繭透光影像以機器學習生成對應於蠶繭之一蠶蛹品質檢測結果，以判斷蠶繭是否適合用於生產冬蟲夏草；一切割裝置，切開適合用於生產冬蟲夏草之蠶繭之繭殼以使蠶蛹露出；一注射裝置，用以對蠶蛹進行冬蟲夏草菌種注射；以及一收集裝置，用以收集經注射之蠶蛹。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An intelligent ophiocordyceps sinensis production system includes a silkworm chrysalis quality determining device, including: an image capturing unit, used for capturing a cocoon translucent image of a cocoon; an image pre-processing module, used for performing an image pre-proccing of the cocoon translucent image; and an intelligent classify module, used for generating a silkworm chrysalis quality determination result by machine learning based on the cocoon translucent image, to determine whether the cocoon is suitable for an ophiocordyceps sinensis production; and also includes a cutting device, used for cutting a cocoon shell of the cocoon suitable for the ophiocordyceps sinensis production to expose the silkworm chrysalis; an injecting device, used for performing an injection of ophiocordyceps sinensis strains into the silkworm chrysalis; and a collecting device, used for collecting the silkworm chrysalis which has been injected.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:冬蟲夏草生產系統</p>  
        <p type="p">110:蠶蛹品質檢測裝置</p>  
        <p type="p">111:蠶繭供給單元</p>  
        <p type="p">112:紅外線感測單元</p>  
        <p type="p">113:光學單元</p>  
        <p type="p">114:影像擷取單元</p>  
        <p type="p">115:品質檢測伺服器</p>  
        <p type="p">116:蠶繭分類單元</p>  
        <p type="p">120:切割裝置</p>  
        <p type="p">130:注射裝置</p>  
        <p type="p">131:消毒單元</p>  
        <p type="p">132:注射單元</p>  
        <p type="p">140:收集裝置</p>  
        <p type="p">141:蠶蛹收集單元</p>  
        <p type="p">142:繭殼收集單元</p>  
        <p type="p">150:輸送裝置</p>  
        <p type="p">160:人機監控介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="314" publication-number="202613372"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613372.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613372</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136054</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以製造紡織紗線的紡口結構</chinese-title>  
        <english-title>SPINNERET STRUCUTRE FOR MANUFACTURING TEXTILE YARNS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">D01D4/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>展頌股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAIN YARN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀博文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI, PO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃冠融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUAN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陽忠勤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHUNG-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐偉倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEI-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用以製造紡織紗線的紡口結構，其包含本體以及複數個通孔，且通孔貫穿本體。每一個通孔包含第一通道、第二通道以及第三通道，其中第一通道、第二通道以及第三通道依序相接以形成每一個通孔。第一通道在本體的一側面有一入料口，且第三通道在本體的另一側面有一出料口，其中第三通道呈圓柱狀且有內直徑為D，第一通道的長度為L1，第二通道的長度為L2，第三通道的長度為L3，且入料口的直徑為D1。當用以製造紡織紗線的紡口結構滿足特定條件時，有助於延長用以製造紡織紗線的紡口結構的使用壽命且提升產品的品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a spinneret structure for manufacturing textile yarns that includes a main body and a plurality of through holes, and the through holes penetrate the main body. Each of the through holes includes a first channel, a second channel and a third channel, wherein the first channel, the second channel and the third channel are sequentially arranged to form the through hole. An inlet of the first channel is disposed on one side of the main body, and an outlet of the third channel is disposed on another side of the main body, wherein the third channel is cylindrical and an inner diameter of the third channel is D, a length of the first channel is L1, a length of the second channel is L2, a length of the third channel is L3, and a diameter of the inlet is D1. When specific conditions of the spinneret structure for manufacturing textile yarns are satisfied, the service life of the spinneret structure for manufacturing textile yarns can be extended and the product quality can be improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:用以製造紡織紗線的紡口結構</p>  
        <p type="p">110:本體</p>  
        <p type="p">120:通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="315" publication-number="202614799"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614799.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614799</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136071</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/47</main-classification>  
        <further-classification edition="202501120250102B">H10D64/20</further-classification>  
        <further-classification edition="202501120250102B">H10D62/85</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JHE-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游政昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, JHENG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體元件包括基材結構、源極結構、汲極結構以及閘極結構。源極結構、汲極結構以及閘極結構位於基材結構的半導體層上方且沿著第一方向排列。閘極結構位於源極結構與汲極結構之間。汲極結構包括多個第一島狀結構與多個第二島狀結構沿著第二方向交替地排列。第二方向與第一方向實質上垂直。每個第一島狀結構包括p型半導體層與位於p型半導體層上方的第一金屬電極。每個第二島狀結構包括第二金屬電極。每個第一島狀結構的p型半導體層沿著第一方向的寬度不同於每個第二島狀結構的第二金屬電極沿著第一方向的寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a substrate structure, a source structure, a drain structure, and a gate structure. The source structure, the drain structure, and the gate structure are over a semiconductor layer of the substrate structure and are arranged along a first direction. The gate structure is between the source structure and the drain structure. The drain structure includes a plurality of first electrode units and a plurality of second electrode units arranged alternately along a second direction. The second direction is substantially perpendicular to the first direction. Each of the first electrode units includes a p-type semiconductor layer and a first metal electrode over the p-type semiconductor layer. Each of the second electrode units includes a second metal electrode. A width of the p-type semiconductor layer of each of the first electrode units is different from a width of the second metal electrode of each of the second electrode units.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體元件</p>  
        <p type="p">100:基材結構</p>  
        <p type="p">108:半導體層</p>  
        <p type="p">110:源極結構</p>  
        <p type="p">111:源極電極</p>  
        <p type="p">112:源極穿孔</p>  
        <p type="p">120:汲極結構</p>  
        <p type="p">121:第一島狀結構</p>  
        <p type="p">121a:p型半導體層</p>  
        <p type="p">121b,122a:金屬電極</p>  
        <p type="p">121c:第一汲極穿孔</p>  
        <p type="p">122:第二島狀結構</p>  
        <p type="p">122b:第二汲極穿孔</p>  
        <p type="p">130:閘極結構</p>  
        <p type="p">131:閘極半導體</p>  
        <p type="p">132:閘極金屬電極</p>  
        <p type="p">A-A’,B-B’,C-C’:線段</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">G1:間隔</p>  
        <p type="p">L1,L2:長度</p>  
        <p type="p">W1,W2:寬度</p>  
        <p type="p">X1,X2,X3:間距</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="316" publication-number="202614356"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614356.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614356</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136072</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">H01L21/71</main-classification>  
        <further-classification edition="202501120250102B">H10D1/62</further-classification>  
        <further-classification edition="202301120250102B">H10N97/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游政昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, JHENG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱漢欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, HAN-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體元件的製造方法包括執行第一圖案化製程，以形成第一溝槽於基材結構中，其中基材結構包括基材與位於基材上方的化合物半導體層，且第一溝槽通過化合物半導體層並暴露基材。製造方法還包括形成電容結構於第一溝槽中，其中形成電容結構包括形成第一金屬層襯於第一溝槽且接觸於基材，形成第一介電層襯於第一金屬層且接觸於第一金屬層以及形成第二金屬層襯於第一介電層且接觸於第一介電層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fabricating method of a semiconductor device includes performing a first patterning process to form a first trench in a substrate structure, in which the substrate structure includes a substrate and a compound semiconductor layer over the substrate, and the first trench passes through the compound semiconductor layer and exposes the substrate. The fabricating method further includes forming a capacitor structure in the first trench, in which forming the capacitor structure includes forming a first metal layer lining the first trench and in contact with the substrate, forming a first dielectric layer lining the first metal layer and in contact with the first metal layer, and forming a second metal layer lining the first dielectric layer and in contact with the first dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基材結構</p>  
        <p type="p">102:基材</p>  
        <p type="p">104:化合物半導體層</p>  
        <p type="p">110,140,160,180:介電層</p>  
        <p type="p">120:穿孔</p>  
        <p type="p">130,150,170:金屬層</p>  
        <p type="p">150a:水平部位</p>  
        <p type="p">OP1,OP2,OP3:開口</p>  
        <p type="p">S/D:源極/汲極接觸</p>  
        <p type="p">T1,T2:溝槽</p>  
        <p type="p">TR:電晶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="317" publication-number="202614604"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614604.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614604</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136090</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線上會議系統及其方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H04N7/15</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣大哥大股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN MOBILE CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡政嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林發立</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種線上會議系統，使複數個目標計算機裝置進行一第一線上會議，該複數個目標計算機裝置包含一第一計算機裝置，該第一計算機裝置關聯於一使用者帳號，該線上會議系統包含：一資料庫，儲存一關鍵字資料，該關鍵字資料指示出複數個關鍵字，該關鍵字資料關聯於該使用者帳號；以及一伺服器，存取該資料庫，並通訊連接該複數個目標計算機裝，該伺服器於該第一線上會議進行的過程中持續產生一第一當前會議影音資料，並將該第一當前會議影音資料傳送至該複數個目標計算機裝置，該第一當前會議影音資料關聯於該第一線上會議；其中該伺服器基於當前所產生的該第一當前會議影音資料符合該關鍵字資料，而產生一第一提醒資料，並將該第一提醒資料傳送至該第一計算機裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:線上會議系統</p>  
        <p type="p">110:資料庫</p>  
        <p type="p">120:伺服器</p>  
        <p type="p">900A:第一計算機裝置</p>  
        <p type="p">900B:第二計算機裝置</p>  
        <p type="p">900N:第三計算機裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="318" publication-number="202612923"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612923.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612923</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136094</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高流量氣嘴</chinese-title>  
        <english-title>HIGH-VOLUME TIRE VALVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">B60C29/00</main-classification>  
        <further-classification edition="200601120241125B">F16K15/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿米瑟工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE LEGION ENGINEERING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫　韋恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOORE, WAYNE-IAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種高流量氣嘴，包括：一管件，包括一通道、一擋肩及一頸縮部，該通道包括位於該擋肩相對二側的第一通道及一第二通道，該頸縮部位於該第二通道中且徑向朝內延伸；一閥芯，容設於該通道中，包括一管身及一連接該管身的端部，該管身圍構一軸孔且設有至少一連通該軸孔之側孔，該軸孔一端開放，該管身插入該第一通道；一密封件，設於該閥芯外側且位於該第二通道中，該密封件的外徑大於該第一通道的徑向尺寸；一擋件，自該第二通道中可回復地擠壓通過該頸縮部且軸向抵擋於該頸縮部；及一彈性件，抵接於該閥芯的端部與該擋件之間，頂推該閥芯使得該密封件可釋放地密封於該擋肩。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A high-volume tire valve is provided, wherein the high-volume tire valve includes: a tubular member including a channel, a shoulder and a necked portion, the channel including a first channel and a second channel between which the shoulder is located, the necked portion being located in the second channel and extending radially inward; a valve pin received in the channel and including a tubular portion and an end portion connected to the tubular portion, the tubular portion including an axial hole and at least one lateral hole in communication with the axial hole, one end of the axial hole being open, the tubular portion being inserted within the first channel; a seal disposed on the valve pin and located in the second channel, the seal having an outer diametric dimension larger than a diametric dimension of the first channel; a seat being resiliently squeezed through the necked portion from the second channel and axially blocked by the necked portion; and an elastic member abutted between the end portion of the valve pin and the seat to bias the valve pin so that the seal releasably seals against the shoulder.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:高流量氣嘴</p>  
        <p type="p">10:管件</p>  
        <p type="p">60:蓋件</p>  
        <p type="p">61:蓋體</p>  
        <p type="p">62:插件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="319" publication-number="202614552"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614552.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614552</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136103</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可變增益放大器及其操作方法</chinese-title>  
        <english-title>VARIABLE GAIN AMPLIFIER AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">H03F1/08</main-classification>  
        <further-classification edition="200601120250102B">H03F1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡政翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, JENG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張映晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YING-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳秉勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PING-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可變增益放大器，包括：第一級共源極放大電路、第二級共源極放大電路與第一變壓器。第二級共源極放大電路包括差動電路與電流汲取電路。差動電路與電流汲取電路耦接至共同連接節點，且電流汲取電路經由共同連接節點來抽取流經差動電路的至少一部分電流。第一變壓器具有一次側與二次側。一次側的第一端耦接至第一級共源極放大電路的輸出端，且一次側的第二端耦接至共同連接節點。二次側的第一端耦接至差動電路的第一差動輸入端，且二次側的第二端耦接至差動電路的第二差動輸入端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A variable gain amplifier includes a first stage common-source (CS) amplifier, a second stage CS amplifier, and a first transformer. The second stage CS amplifier includes a differential circuit and a current steering circuit. The differential circuit and the current steering circuit are coupled to a common connecting node, and the current steering circuit draws at least part of a current, which flows through the differential circuit, from the common connecting node. The first transformer includes a primary side and a secondary side. A first terminal of the primary side is coupled to an output terminal of the first stage CS amplifier, and a second terminal of the primary side is coupled to the common connecting node. A first terminal of the secondary side is coupled to a first differential input terminal of the differential circuit, and a second terminal of the secondary side is coupled to a second differential input terminal of the differential circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:可變增益放大器</p>  
        <p type="p">110:第一級共源極放大電路</p>  
        <p type="p">111:輸出端</p>  
        <p type="p">120:第二級共源極放大電路</p>  
        <p type="p">121:差動電路</p>  
        <p type="p">122:電流汲取電路</p>  
        <p type="p">130:第一變壓器</p>  
        <p type="p">131:一次側</p>  
        <p type="p">132:二次側</p>  
        <p type="p">1211:第一差動輸入端</p>  
        <p type="p">1212:第二差動輸入端</p>  
        <p type="p">P:共同連接節點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="320" publication-number="202613022"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613022.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613022</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136107</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製作方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">B81B7/02</main-classification>  
        <further-classification edition="200601120241205B">B81B3/00</further-classification>  
        <further-classification edition="200601120241205B">B81C1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇昭安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHAO-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翁宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WENG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐長生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHANG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, KUO-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王佳雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIA-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭文豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體結構，包含：一基板，其上具有一空腔；一膜片，懸浮在該空腔上方並錨固至該基板，其中，該膜片包含一中心區域、一外圍懸邊區域以及位於該中心區域和該外圍懸邊區域之間的一線圈區域；以及一線圈，埋設於該膜片的該線圈區域內，其中，該外圍懸邊區域具有一第一凹部及一第一凸部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure includes a substrate having a cavity thereon; a membrane suspended above the cavity and anchored to the substrate, wherein the membrane comprises a central region, a peripheral suspension region, and a coil region between the central region and the peripheral suspension region; and a coil embedded in the coil region of the membrane, wherein the peripheral suspension region has a first concave portion and a first convex portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體結構</p>  
        <p type="p">100:基板</p>  
        <p type="p">110:膜片</p>  
        <p type="p">110a:第一凹部</p>  
        <p type="p">110b:第一凸部</p>  
        <p type="p">110c:第二凹部</p>  
        <p type="p">110d:第三凹部</p>  
        <p type="p">110e:第四凹部</p>  
        <p type="p">120:線圈圖案</p>  
        <p type="p">a1:底角</p>  
        <p type="p">a2:頂角</p>  
        <p type="p">CA:空腔</p>  
        <p type="p">CR:中心區域</p>  
        <p type="p">MR:線圈區域</p>  
        <p type="p">PR:外圍懸邊區域</p>  
        <p type="p">S1:底面</p>  
        <p type="p">S2:頂面</p>  
        <p type="p">S3:傾斜側壁</p>  
        <p type="p">X、Y:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="321" publication-number="202613779"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613779.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613779</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136109</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其耗電通知方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND POWER CONSUMPTION NOTIFICATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241104B">G06F1/3203</main-classification>  
        <further-classification edition="200601120241104B">G06F3/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華碩電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUSTEK COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳啟龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉書宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, SHU-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭示一種電子裝置及其耗電通知方法。所述方法包括下列步驟：確認當下在背景執行的多個應用程式；在應用程式中找出具有耗電行為的耗電應用程式；以及在耗電應用程式不具有代理人程式的情況下，執行耗電通知操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device and a power consumption notification method thereof are provided. The method includes following steps: identifying a plurality of applications currently running in a background; finding a power consumption application with power consumption behavior among the applications; and performing a power consumption notification operation in a state that the power consumption application has no agent program.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S200~S204:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="322" publication-number="202614715"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614715.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614715</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136111</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱裝置及其適用的功率模組</chinese-title>  
        <english-title>HEAT DISSIPATION DEVICE AND POWER MODULE ADAPTED THERETO</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H05K7/20</main-classification>  
        <further-classification edition="200601120241105B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHUN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱鴻年</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, HUNG-NIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊志偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐陽圳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OU YANG, JHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱裝置包含第一板狀體及第二板狀體。第一板狀體包含第一板件。第一板件具有複數個孔洞。第一板件具有彼此相對的第一面及第二面，且第一面朝向功率模組中的發熱源。第二板狀體與第一板狀體疊合設置，且第二板狀體包含第二板件及複數個凸起件。第二板件具有彼此相對的第三面及第四面，且第三面與第二面相鄰。複數個凸起件設置於第三面上，且複數個凸起件的至少一部分對應穿置於複數個孔洞中，並接觸發熱源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation device includes a first plate type component and a second plate type component. The first plate type component includes a first plate. The first plate has plural holes. The first plate includes a first surface and a second opposite to each other, and the first surface faces a heat source in a power module. The second plate type component is stacked with the first plate type component and includes a second plate and plural protrusions. The second plate includes a third surface and a fourth surface opposite to each other, and the third surface is adjacent to the second surface. The plural protrusions are disposed on the third surface, and at least a portion of the plural protrusions are penetrated through the plural holes for contacting the heat source.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:散熱裝置</p>  
        <p type="p">20:第一板狀體</p>  
        <p type="p">21:第一板件</p>  
        <p type="p">212:第二面</p>  
        <p type="p">22:孔洞</p>  
        <p type="p">24:凸起部</p>  
        <p type="p">30:第二板狀體</p>  
        <p type="p">31:第二板件</p>  
        <p type="p">312:第四面</p>  
        <p type="p">32:凸起件</p>  
        <p type="p">34:第二起伏結構</p>  
        <p type="p">X、Y、Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="323" publication-number="202614586"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614586.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614586</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136112</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>波束成型天線校準方法與波束成型天線校準系統</chinese-title>  
        <english-title>BEAMFORMING ANTENNA CALIBRATION METHOD AND BEAMFORMING ANTENNA CALIBRATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120250102B">H04B17/21</main-classification>  
        <further-classification edition="200601120250102B">H04B7/06</further-classification>  
        <further-classification edition="200601120250102B">H04B7/185</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宗智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JENG-JR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳燦煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TSAN-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳博現</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BOR-SEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種波束成型天線校準方法與波束成型天線校準系統。所述方法適用於一地面終端裝置，並包含以下步驟。獲取一目標衛星的原始位置資訊。對原始位置資訊進行一資料前處理而獲取目標衛星的經處理位置資訊。根據目標衛星的經處理位置資訊利用一深度神經網路模型，決定天線陣列的多個天線單元其中每一者的控制參數。控制所述天線陣列根據多個天線單元其中每一者的控制參數產生用以與目標衛星進行通訊的目標波束。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An aspect of the disclosure includes a beamforming antenna calibration method and a beamforming antenna calibration system. The method is adapted to a ground terminal device and includes the following steps. Original position information of a target satellite is obtained. A data pre-processing is performed on the original position information to obtain processed position information of the target satellite. A deep neural network model is used to determine a control parameter of each of antenna elements of an antenna array based on the processed position information of the target satellite. The antenna array is controlled to generate a target beam for communicating with the target satellite based on the control parameter of each of the antenna elements.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S410~S440:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="324" publication-number="202613293"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613293.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613293</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136113</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>供核酸合成的合成管柱</chinese-title>  
        <english-title>SYNTHETIC COLUMN FOR NUCLEIC ACID SYNTHESIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">C12M1/00</main-classification>  
        <further-classification edition="200601120241125B">C12M1/14</further-classification>  
        <further-classification edition="200601120241125B">C12M1/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李芳承</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, FANG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃偉欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳安利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, AN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉松河</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SUNG-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林明濬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MING-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴寯亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHUN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種供核酸合成的合成管柱，包括一管柱本體、多個第一螺旋刀片及多個第二螺旋刀片。管柱本體具有一軸心、一內壁、相對的一入口端及一出口端。這些第一螺旋刀片由軸心朝向內壁沿一第一螺旋方向螺旋延伸。各個第一螺旋刀片的兩端分別連接軸心及內壁。這些第二螺旋刀片由內壁朝向軸心沿一第二螺旋方向螺旋延伸，且第一螺旋方向相異於第二螺旋方向。這些第一螺旋刀片及這些第二螺旋刀片交錯排列。各個第二螺旋刀片的一端連接內壁，且其另一端具有一第二螺旋側。第二螺旋側從入口端朝向出口端逐漸靠近軸心。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A synthetic column for nucleic acid synthesis includes a column body, a plurality of first spiral blades and a plurality of second spiral blades. The column body has an axis, an inner wall, an inlet end and an outlet end opposite each other. The first spiral blades spirally extend in a first spiral direction from the axis toward the inner wall. Two ends of each the first spiral blade are connected to the axis and the inner wall, respectively. The second spiral blades spirally extend in a second spiral direction from the inner wall toward the axis, and the first spiral direction is different from the second spiral direction. The first spiral blades and the second spiral blades are arranged in a staggered manner. One end of each the second spiral blade is connected to the inner wall, and an other end has an inner spiral side. The inner spiral side gradually approaches the axis center from the inlet end toward the outlet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:合成管柱</p>  
        <p type="p">110:管柱本體</p>  
        <p type="p">111:軸心</p>  
        <p type="p">112:內壁</p>  
        <p type="p">113:入口端</p>  
        <p type="p">114:出口端</p>  
        <p type="p">120:第一螺旋刀片</p>  
        <p type="p">130:第二螺旋刀片</p>  
        <p type="p">131:第二螺旋側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="325" publication-number="202614503"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614503.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614503</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136116</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置之連接器組合結構</chinese-title>  
        <english-title>CONNECTOR ASSEMBLING STRUCTURE OF ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241114B">H01R13/52</main-classification>  
        <further-classification edition="200601120241114B">H01R13/74</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS,INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李易軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI-SYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐清釧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHING-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏仕銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, SHIH MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置之連接器組合結構，其包括一盒體、一連接器及一膠圈。盒體具有一第一殼件及一第二殼件，第一殼件及第二殼件相互依附配置，第一殼件具有一第一通口，第二殼件具有一第二通口，且第一通口及第二通口相互對齊配置。連接器設置在盒體內，連接器具有一接頭，接頭穿過第一通口及第二通口而凸露出盒體。膠圈套設在接頭且被夾持在第一殼件及第二殼件之間。在第一通口及第二通口的其中之一者的內緣設有一內斜面，在膠圈設有一外斜面，且內斜面抵壓外斜面。第一殼件及第二殼件夾持膠圈而同時達到連接器定位及防水之效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure is directed to a connector assembly structure for an electronic device, which has a box, a connector and a rubber ring. The box has a first housing and a second housing. The first housing and the second housing are attached with each other. The first housing has a first through opening, and the second housing has a second through opening. The first through opening is arranged to the second through opening. The connector is arranged in the box. The connector has a joint passing through the first through opening and the second through opening and protruding from the box. The rubber ring is set on the joint and clamped between the first housing part and the second housing part. An inner slope is arranged on an inner edge of one of the first through opening and the second through opening, an outer slope is arranged on the rubber ring, and the inner slope abuts against the outer slope. The rubber ring is clamped between the first housing and the second housing, thereby positioning and sealing the connector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:盒體</p>  
        <p type="p">101b:內斜面</p>  
        <p type="p">102:開口</p>  
        <p type="p">110:第一殼件</p>  
        <p type="p">112:缺口</p>  
        <p type="p">120:第二殼件</p>  
        <p type="p">121:第二通口</p>  
        <p type="p">200:連接器</p>  
        <p type="p">210:接頭</p>  
        <p type="p">300:膠圈</p>  
        <p type="p">311b:外斜面</p>  
        <p type="p">400:電路板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="326" publication-number="202613920"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613920.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613920</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136121</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>行銷輔助系統及方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120240927B">G06Q30/02</main-classification>  
        <further-classification edition="201901120240927B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國信託商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CTBC BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊程予</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹正城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許元銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周錫彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種行銷輔助系統包含一處理單元及一電連接該處理單元的儲存單元。該儲存單元儲存有一利用機器學習技術實現的行銷時段預測模型。該處理單元用於：根據一行銷輔助請求獲得一對應於一目標行銷對象的對象特徵資料，利用該行銷時段預測模型對該對象特徵資料進行分析，以計算該目標行銷對象在多個不同之預設候選行銷時段中對行銷行為產生回應的概率，並產生一指示出一個最佳行銷時段的時段分析結果，且根據該時段分析結果執行一對應於該目標行銷對象的輔助行銷處理，以對該目標行銷對象進行行銷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:行銷輔助系統</p>  
        <p type="p">11:處理單元</p>  
        <p type="p">12:儲存單元</p>  
        <p type="p">DB:客戶資料庫</p>  
        <p type="p">M:行銷時段預測模型</p>  
        <p type="p">D:客戶資料集合</p>  
        <p type="p">D’:目標客戶資料集合</p>  
        <p type="p">5:使用端電子裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="327" publication-number="202613448"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613448.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613448</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136130</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣瓶充填裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">F17C5/02</main-classification>  
        <further-classification edition="200601120241204B">F17C13/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣保安工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林豐基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種氣瓶充填裝置，其用於連接一液化瓦斯槽並能填充一流體。氣瓶充填裝置具有一支撐座、一主閥門、多個分裝管道及多個連結座。主閥門及各分裝管道設置於支撐座，各連結座裝配並連接於各分裝管道。主閥門具有一主閥管道，各分裝管道皆連接於主閥管道。各連結座具有一連結管道，各連結管道連接於各分裝管道。本發明讓流體能同時自主閥管道流入分裝管道及連結管道中。藉此，使用氣瓶充填裝置能於花費相同的人力及流程的情況下，提高單次的灌裝量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:支撐座</p>  
        <p type="p">11:底座</p>  
        <p type="p">12:頂蓋</p>  
        <p type="p">13:支柱</p>  
        <p type="p">14:手把</p>  
        <p type="p">20:主閥門</p>  
        <p type="p">21:進氣口</p>  
        <p type="p">23:主閥開關</p>  
        <p type="p">50:氣瓶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="328" publication-number="202613188"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613188.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613188</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136134</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吸水性聚合物、其製造方法及含其食品包裝材料</chinese-title>  
        <english-title>SUPERABSORBENT POLYMER, METHOD OF MANUFACTURING THE SAME, AND FOODSTUFF PACKAGING MATERIAL INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">C08F2/10</main-classification>  
        <further-classification edition="200601120241105B">C08F2/38</further-classification>  
        <further-classification edition="200601120241105B">C08F220/06</further-classification>  
        <further-classification edition="200601120241105B">C08F222/38</further-classification>  
        <further-classification edition="200601120241105B">C08F290/06</further-classification>  
        <further-classification edition="200601120241105B">C08J3/12</further-classification>  
        <further-classification edition="200601120241105B">C08J7/12</further-classification>  
        <further-classification edition="200601120241105B">B01J20/26</further-classification>  
        <further-classification edition="200601120241105B">B01J20/28</further-classification>  
        <further-classification edition="200601120241105B">B01J20/30</further-classification>  
        <further-classification edition="200601120241105B">B65D81/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣塑膠工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORMOSA PLASTICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳忠毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHONG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴泰宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, TAI-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是有關於一種吸水性聚合物、其製造方法及含其食品包裝材料，其係在反應組成物中添加含沒食子酸之多酚類化合物，於聚合反應時可提高反應組成物中含羧基單體的聚合程度及穩定性，從而降低所製得之吸水性聚合物之低分子量萃取物的含量，不僅使吸水性聚合物具有安全性及抗菌性，還保留吸水性聚合物優異的保水能力及吸收能力，可應用於作為食品包裝材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is related to a superabsorbent polymer, a method of manufacturing the same, and a foodstuff packaging material including the same. By adding a gallic acid-containing polyphenol compound with into a reaction composition, the level of polymerization and the stability of a carboxyl group-containing monomer in the reactant can be increased, thereby decreasing amounts of low-molecular-weight extractable components in the obtained superabsorbent polymer. The superabsorbent polymer not only can be safe and have antibacterial property but also maintain excellent absorption capacity and retention capacity, and can be used as the foodstuff packaging material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:製造方法</p>  
        <p type="p">110,120:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="329" publication-number="202612597"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612597.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612597</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136139</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組合物及添加大麥嫩葉之飲食品之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250501B">A23L29/206</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋新藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYO SHINYAKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋宏哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, HIROYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木太士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, TAISHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永瀧達大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGATAKI, TATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種組合物，其特徵在於：其含有大麥嫩葉，且黏度為100 mPa・s以上且18,000 mPa・s以下。較佳為組合物進而含有水。亦屬較佳為該組合物中之大麥嫩葉之含量為10質量%以上。亦屬較佳為該組合物中之含水量為50質量%以上。又，本發明亦提供一種添加大麥嫩葉之飲食品之製造方法，其使用上述組合物。亦屬較佳為該製造方法係將上述組合物與水性液體混合而製造添加大麥嫩葉之飲料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="330" publication-number="202612595"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612595.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612595</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136140</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組合物及添加大麥嫩葉之飲食品之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250501B">A23L7/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋新藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYO SHINYAKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋宏哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, HIROYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木太士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, TAISHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永瀧達大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGATAKI, TATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種組合物，其特徵在於：其含有大麥嫩葉，且黏度為500 mPa・s以上且100,000 mPa・s以下。較佳為組合物進而含有水。亦屬較佳為該組合物中之大麥嫩葉之含量為10質量%以上。亦屬較佳為該組合物中之含水量為30質量%以上。又，本發明亦提供一種添加大麥嫩葉之飲食品之製造方法，其使用上述組合物。較佳為該製造方法包括以組合物中之大麥嫩葉之含量成為10質量%以上之方式將大麥嫩葉與水混合之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="331" publication-number="202613874"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613874.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613874</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136144</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料分頁自動化方法及其相關電腦系統</chinese-title>  
        <english-title>DATA PAGINATION AUTOMATION METHOD AND RELATED COMPUTER SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250203B">G06F40/10</main-classification>  
        <further-classification edition="202001120250203B">G06F40/103</further-classification>  
        <further-classification edition="202001120250203B">G06F40/114</further-classification>  
        <further-classification edition="202001120250203B">G06F40/166</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳維超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張明淇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MING-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳卓叡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUO-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種資料分頁自動化方法，用於處理複數筆資料，包含有根據該複數筆資料之一有序不重複鍵，決定用來排序該複數筆資料之一排序依據；根據該排序依據對該複數筆資料進行排序及分頁；以及根據該有序不重複鍵以及至少一過濾條件，更新該複數筆資料之一分頁資訊表並且收集對應的資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data pagination automation method, for processing a plurality of data, includes determining a sorting basis for sorting the plurality of data according to an ordered unique key of the plurality of data; sorting and paging the plurality of data according to the sorting basis; and updating a pagination information table of the plurality of data and collect corresponding data according to the ordered unique key and at least a filtering condition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:資料分頁自動化方法</p>  
        <p type="p">202-210:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="332" publication-number="202612603"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612603.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612603</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136146</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>毛髮結構及於其上形成繩結的方法</chinese-title>  
        <english-title>HAIR STRUCTURE AND METHOD FOR FORMING A KNOT THEREON</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241031B">A41G5/00</main-classification>  
        <further-classification edition="200601120241031B">A41G3/00</further-classification>  
        <further-classification edition="200601120241031B">A45D2/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何珮楨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, PEI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何珮楨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, PEI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳孚竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種毛髮結構，其包括毛髮本體以及連接該毛本體的繩結部，其中，該繩結部具有相對的第一端部和第二端部以及介於該第一端部和該第二端部之間的打結區段，藉由該繩結部的設計，可增強毛髮植入於頭皮的穩固性，並且由於所植入的毛髮具有可移動的固定點，因而在需要時可將所植入的毛髮可逆地移除。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a hair structure, including a hair body and a knot portion connected to the hair body, where the knot portion has an opposing first end and second end, and a knotting section in between. The knot portion enhances the stability of hair implantation into the scalp, which can be reversibly removed, when necessary, due to the movable fixation point of the implanted hair.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:毛髮結構</p>  
        <p type="p">10:毛髮本體</p>  
        <p type="p">11:繩結部</p>  
        <p type="p">11a:第一端部</p>  
        <p type="p">11b:第二端部</p>  
        <p type="p">11c:打結區段</p>  
        <p type="p">90:軸線</p>  
        <p type="p">91:第一圓圈部</p>  
        <p type="p">92:第二圓圈部</p>  
        <p type="p">920:尾部</p>  
        <p type="p">A:第一區域</p>  
        <p type="p">B:第二區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="333" publication-number="202613605"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613605.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613605</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136147</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閃耀光柵、波導以及顯示裝置</chinese-title>  
        <english-title>BLAZED GRATING, WAVEGUIDE AND DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G02B5/18</main-classification>  
        <further-classification edition="201501120241204B">G02B1/10</further-classification>  
        <further-classification edition="200601120241204B">G02B6/34</further-classification>  
        <further-classification edition="200601120241204B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華碩電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUSTEK COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪文璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, WEN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃亭維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盛季平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENG, JI-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張博凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, BO-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭示一種閃耀光柵、波導以及顯示裝置。閃耀光柵包括閃耀光柵基底以及多個鋸齒結構。鋸齒結構設置於閃耀光柵基底上，其中各鋸齒結構包括閃耀面和次閃耀面，閃耀面與閃耀光柵基底的基準面之間形成閃耀角，次閃耀面與閃耀角相對，各鋸齒結構的閃耀面上鍍有至少一光學膜層組。各至少一光學膜層組包括第一光學層與第二光學層，第一光學層的折射率高於第二光學層。至少一光學膜層組的第一光學層與第二光學層週期性地交互堆疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A blazed grating, a waveguide and a display device are provided. The blazed grating includes a blazed grating base and a plurality of sawtooth structures. The sawtooth structures are provided on the blazed grating base. Each of the sawtooth structures includes a blazed surface and a secondary blazed surface. A blazed angle is formed between the blazed surface and a reference plane of the blazed grating base. The secondary blazed surface is opposite to the blazed angle. The blazed surface of each of the sawtooth structures is coated with at least one optical film layer group. Each of the at least one optical film layer group includes a first optical layer and a second optical layer. The first optical layer has a higher refractive index than the second optical layer. The first optical layer and the second optical layer of the at least one optical film layer group are periodically stacked alternately.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:閃耀光柵</p>  
        <p type="p">110:閃耀光柵基底</p>  
        <p type="p">120:鋸齒結構</p>  
        <p type="p">130:光學膜層組</p>  
        <p type="p">131:第一光學層</p>  
        <p type="p">132:第二光學層</p>  
        <p type="p">S1:閃耀面</p>  
        <p type="p">S2:次閃耀面</p>  
        <p type="p">SB:基準面</p>  
        <p type="p">Tc:厚度</p>  
        <p type="p">L:長度</p>  
        <p type="p">φ:閃耀角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="334" publication-number="202613875"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613875.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613875</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136148</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於檢索增強生成技術的服務建議書文件生成系統及其方法</chinese-title>  
        <english-title>SERVICE PROPOSAL DOCUMENT GENERATUIN SYSTEM AND METHOD THEREOF BASE ON RETRIEVAL ENHANCED GENERATION TECHNOLOGY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250203B">G06F40/10</main-classification>  
        <further-classification edition="202001120250203B">G06F40/174</further-classification>  
        <further-classification edition="202301120250203B">G06Q10/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仲詠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHONG-YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於檢索增強生成技術的服務建議書文件生成系統及其方法，包括對服務建議書歷史文件進行文字分段，將各文字分段建置成各向量並儲存至向量資料庫；依據使用者輸入的第一類型提詞並且取得與第一類型提詞對應的服務建議書所需要的章節，並且生成提詞框架；依據第二類型提詞以及提詞框架取得與各章節對應的表格格式提詞；於提詞框架生成後，依據提詞框架及第三提詞範本生成分別與各章節對應的多個使用者介面；以及依據提詞框架、第三提詞範本及表格格式提詞且經由大型語言模型查詢向量資料庫產製服務建議書。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A service proposal document generation and method thereof base on retrieval enhanced generation technology is provided, includes segmenting historical service proposal documents into text segments, constructing each text segment into vector and storing the vectors in a vector database, obtaining chapters required for a service proposal corresponding to a first type of prompt according to the first type of prompt input by a user, and generating a prompt frame, obtaining tabular prompts corresponding to each chapter according to a second type of prompt and the prompt frame, a plurality of user interfaces corresponding to each chapter are generated according to the prompt frame and a third prompt template after the prompt frame is generated, and producing a service proposal according to the prompting framework, the third prompting template and the tabular prompts and through the large language model query the vector database.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:向量資料庫建置模組</p>  
        <p type="p">200:服務建議書生成模組</p>  
        <p type="p">110:向量資料庫建置單元</p>  
        <p type="p">120:向量資料庫</p>  
        <p type="p">210:大型語言模型</p>  
        <p type="p">220:提詞框架生成單元</p>  
        <p type="p">230:表格格式提詞生成單元</p>  
        <p type="p">240:使用者介面生成單元</p>  
        <p type="p">250:程式碼生成模型單元</p>  
        <p type="p">260:文件產出格式單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="335" publication-number="202613667"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613667.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613667</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136150</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>立體圖像顯示系統與其立體圖像顯示方法</chinese-title>  
        <english-title>STEREOSCOPIC IMAGE DISPLAY SYSTEM AND STEREOSCOPIC IMAGE DISPLAY METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120240927B">G02B30/22</main-classification>  
        <further-classification edition="200601120240927B">G02B27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和　佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANTERO CLARES, SERGIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種立體圖像顯示系統與其立體圖像顯示方法。此方法適用於包括第一立體顯示器的立體圖像顯示系統並包括下列步驟。獲取一顯示圖幀。從顯示圖幀識別出多個圖像區域，其中多個圖像區域包括二維內容圖像區域與三維內容圖像區域。根據各圖像區域的區域特性，決定各圖像區域的繪製優先權。根據各個圖像區域的繪製優先權，依序將各個圖像區域的圖像內容繪製於包括第一左眼圖像與第一右眼圖像的第一立體格式圖像之中。由操作於立體顯示模式的第一立體顯示器來顯示第一立體格式圖像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An stereoscopic image display system and a stereoscopic image display method thereof are disclosed. The method is adapted to the stereoscopic image display system including a first 3D display and includes the following steps. The method is applicable to the stereoscopic image display system including a first stereoscopic display and comprises the following steps. An image frame is obtained. Multiple image regions are identified from the display image frame, wherein the image regions include a two-dimensional content image region and a three-dimensional content image region. A rendering priority of each image region is determined based on a regional characteristic of each image region. According to the rendering priority of each image region, image content of each image region is sequentially drawn into a first stereoscopic format image including a first left-eye image and a first right-eye image. The first stereoscopic format image is displayed by the first stereoscopic display operating in stereoscopic display mode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310~S350:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="336" publication-number="202613840"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613840.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613840</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136151</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>料品質動態資訊處理方法及資料處理裝置</chinese-title>  
        <english-title>PROCESSING METHOD OF DATA QUALITY DYNAMIC INFORMATION AND DATA PROCESSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250102B">G06F16/215</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳維超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張明淇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MING-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊舒惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHU-HUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種資料處理裝置包括儲存裝置及資料品質評估測度運算模組。儲存裝置用以自資料中心取得並儲存資料中心之資料表單之異動資料。資料品質評估測度運算模組根據異動資料及資料品質評估測度參考值計算出更新後資料品質評估測度值及更新後資料品質特徵資料，將更新後資料品質評估測度值及更新後資料品質特徵資料記錄至資料品質評估測度值表單。資料品質評估測度運算模組比較更新後資料品質評估測度值與資料品質閥值以產生比較結果，並於比較結果顯示更新後資料品質評估測度值大於或等於資料品質閥值時產生並發送出通知信號以執行通知功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data processing device is provided, which includes a storage device and a data quality assessment measurement calculation module. The storage device is configured to obtain and store change data of data tables from a data center. The data quality assessment measurement calculation module is configured to calculate an updated data quality assessment measurement value and an updated data quality characteristic data according to the change data and a data quality assessment measurement reference value, record the updated data quality assessment measurement value and the updated data quality characteristic data into a data quality assessment measurement value table, and perform a notification function according to the updated data quality assessment measurement value and a data quality threshold. The data quality assessment measurement calculation module is configured to compare the updated data quality assessment measurement value with the data quality threshold to generate a comparison result. The data quality assessment measurement calculation module is configured to generate and send a notification signal to perform a notification function when the comparison result indicates that the updated data quality assessment measurement value is greater than or equal to the data quality threshold.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:流程</p>  
        <p type="p">S200,S202,S204,S206,S208,S210,S212:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="337" publication-number="202612856"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612856.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612856</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136156</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工具定位板</chinese-title>  
        <english-title>TOOL POSITIONING PLATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240930B">B25H3/00</main-classification>  
        <further-classification edition="200601120240930B">B25H3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝志堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIH-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝志堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIH-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳居亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種工具定位板，用於設置一插置件，該插置件具有一穿柱及一凸部，該凸部連接該穿柱的一側，該工具定位板，包括一板狀結構的主體，其中該主體具有一頂緣側及一底緣側，該頂緣側與該底緣側之間的長度定義為第一長度，該穿柱的軸向長度定義為第二長度，該第一長度至少等於該第二長度，該主體貫穿數個設置孔，該主體形成數個孔壁，至少每三個該孔壁依序鄰接並於其間形成一個該設置孔，該主體形成數個止擋面，據使各該止擋面分別對進入該設置孔的該凸部形成止擋，從而限制該插置件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a tool positioning plate for use with an insertion member, the insertion member comprising a penetrating column and a protrusion, the protrusion being connected to one side of the penetrating column. The tool positioning plate comprises a body having a plate-like structure, the body comprising a top edge side and a bottom edge side, wherein a length between the top edge side and the bottom edge side is defined as a first length, and an axial length of the penetrating column is defined as a second length, wherein the first length is at least equal to the second length. The body comprises a plurality of setting holes extending therethrough, and the body forms a plurality of hole walls, wherein at least every three of the hole walls are sequentially adjacent, and a setting hole is formed between each of the adjacent hole walls. The body further comprises a plurality of stop surfaces, wherein each of the stop surfaces respectively forms a stop against the protrusion that enters the setting hole, thereby restricting the insertion member.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:主體</p>  
        <p type="p">21:頂緣側</p>  
        <p type="p">22:底緣側</p>  
        <p type="p">23:孔壁</p>  
        <p type="p">24:止擋面</p>  
        <p type="p">30:設置孔</p>  
        <p type="p">32:凹槽</p>  
        <p type="p">d:深度</p>  
        <p type="p">D1:第一距離</p>  
        <p type="p">L1:第一長度</p>  
        <p type="p">W1:寬度</p>  
        <p type="p">Z:軸向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="338" publication-number="202613435"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613435.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613435</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136163</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>諧波減速機及跳脫裝置</chinese-title>  
        <english-title>HARMONIC REDUCER AND DISENGAGING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120240929B">F16H57/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盟英科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAIN DRIVE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝昆儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, KUN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱嵩翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, SUNG-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭鈺嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YU-SSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種諧波減速機及跳脫裝置。跳脫裝置包含一帶動軸、一凸輪、一限位件、兩個第一摩擦環、一第二摩擦環、一環形壓板及一彈性件。凸輪穿設於帶動軸上。凸輪與帶動軸共同形成一設置空間。限位件機械連接於帶動軸上以抵靠凸輪。兩個第一摩擦環機械連接於帶動軸上且位於設置空間內。第二摩擦環機械連接於帶動軸上且位於兩個第一摩擦環之間。環形壓板設置於帶動軸上且位於設置空間內。彈性件抵靠於環形壓板及凸輪的一內壁。環形壓板能通過彈性件的彈力沿著軸向方向推抵兩個第一摩擦環與第二摩擦環，使環形壓板與帶動軸的一擋止牆夾持兩個第一摩擦環與第二摩擦環。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A harmonic reducer and a disengaging device are provided. The disengaging device includes a driving shaft, a cam, a limiting member, two first friction rings, a second friction ring, an annular pressure plate, and an elastic member. The cam is fitted on the driving shaft. The cam and the driving shaft together form a setup space. The limiting member is mechanically connected on the driving shaft to abut against the cam. The two first friction rings are mounted on the driving shaft and are located within the setup space. The second friction ring is mechanically connected on the driving shaft and positioned between the two first friction rings. The annular pressure plate is disposed on the driving shaft and located within the setup space. The elastic member abuts against the annular pressure plate and an inner wall of the cam. The annular pressure plate, driven by the elastic force of the elastic member, can push the two first friction rings and the second friction ring in the axial direction, causing the annular pressure plate and a stop wall of the driving shaft to clamp the two first friction rings and the second friction ring.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:跳脫裝置</p>  
        <p type="p">11:帶動軸</p>  
        <p type="p">111:桿體</p>  
        <p type="p">112:擋止牆</p>  
        <p type="p">113:限位槽</p>  
        <p type="p">12:凸輪</p>  
        <p type="p">121:限位凸塊</p>  
        <p type="p">122:橢圓外蓋</p>  
        <p type="p">13:限位件</p>  
        <p type="p">14:第一摩擦環</p>  
        <p type="p">141:第一弧形部位</p>  
        <p type="p">142:第一抵靠部位</p>  
        <p type="p">15:第二摩擦環</p>  
        <p type="p">151:第二弧形部位</p>  
        <p type="p">152:第二抵靠部位</p>  
        <p type="p">16:環形壓板</p>  
        <p type="p">161:座部</p>  
        <p type="p">162:凸起部</p>  
        <p type="p">17:彈性件</p>  
        <p type="p">D1:徑向方向</p>  
        <p type="p">D2:軸向方向</p>  
        <p type="p">SP:設置空間</p>  
        <p type="p">GP1:第一容屑間隙</p>  
        <p type="p">GP2:第二容屑間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="339" publication-number="202612684"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612684.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612684</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136165</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療激躁之經皮右美托咪啶(DEXMEDETOMIDINE)</chinese-title>  
        <english-title>TRANSDERMAL DEXMEDETOMIDINE FOR TREATING AGITATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250502B">A61K31/4174</main-classification>  
        <further-classification edition="200601120250502B">A61P25/00</further-classification>  
        <further-classification edition="200601120250502B">A61K9/70</further-classification>  
        <further-classification edition="200601120250502B">A61M37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商帝國製藥美國有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEIKOKU PHARMA USA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋　皖寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, WAN-NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱　蓋瑞　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAY, GARY G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於使用含有右美托咪啶(dexmedetomidine)之經皮遞送貼劑治療激躁之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to methods of using transdermal delivery patches containing dexmedetomidine to treat agitation.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="340" publication-number="202614853"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614853.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614853</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136166</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D84/83</main-classification>  
        <further-classification edition="200601120250102B">H01L23/58</further-classification>  
        <further-classification edition="202501120250102B">H10D84/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾裕騰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YU-TENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邢懷錦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSING, HUAI-JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖子維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, TZU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張竹君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHU-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐啓軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, CHI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳廣修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUANG-HSIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林世雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHI-XIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊國裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KUO-YUH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬　瑞吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERMA, PURAKH RAJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體元件，包括一基底，該基底包括一絕緣層以及一元件層設置在該絕緣層上，該元件層包括一主動區。多個閘極結構，設置在該主動區上且互相平行。一凹槽，位於相鄰兩該閘極結構之間的該主動區中，並且貫穿該元件層。一磊晶層，填充該凹槽。一氣隙，其中該磊晶層的一底面以及該絕緣層的一頂面之間包括一氣隙。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a substrate having an insulating layer and a device layer disposed on the insulating layer, wherein the device layer includes an active region, a plurality of gate structures disposed on the active region and are parallel to each other, an recess formed in the active region between adjacent two of the gate structures and extending through the device layer, an epitaxial layer filling the recess, and an air gap between a bottom surface of the epitaxial layer and a top surface of the insulating layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基底</p>  
        <p type="p">12:底層</p>  
        <p type="p">14:絕緣層</p>  
        <p type="p">16:元件層</p>  
        <p type="p">18:隔離結構</p>  
        <p type="p">20:閘極結構</p>  
        <p type="p">34:第二凹槽</p>  
        <p type="p">42:磊晶層</p>  
        <p type="p">44:氣隙</p>  
        <p type="p">160:主動區</p>  
        <p type="p">14a:頂面</p>  
        <p type="p">34a:側壁</p>  
        <p type="p">42a:底面</p>  
        <p type="p">A2:銳角</p>  
        <p type="p">H1:高度</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="341" publication-number="202612857"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612857.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612857</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136167</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工具定位裝置</chinese-title>  
        <english-title>TOOL POSITIONING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240930B">B25H3/00</main-classification>  
        <further-classification edition="200601120240930B">B25H3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝志堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIH-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝志堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIH-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳居亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種工具定位裝置，用於設置一插置件，該插置件具有一穿柱，該穿柱側向形成一抵靠部，該工具定位裝置，包括一板狀結構的主體，其中該主體具有一頂緣側及一底緣側，該頂緣側與該底緣側之間的長度定義為第一長度，該穿柱的軸向長度定義為第二長度，該第一長度至少等於該第二長度，該主體貫穿數個設置孔，提供該穿柱由上而下插入，該主體形成數個限制部分別位於各該設置孔，各該限制部分別對進入各該設置孔的該抵靠部形成止擋，從而限制該插置件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a tool positioning device for accommodating an insertion member, the insertion member comprising a penetrating column, the penetrating column having a lateral abutment portion. The tool positioning device comprises a body having a plate-like structure, the body comprising a top edge side and a bottom edge side, wherein a length between the top edge side and the bottom edge side is defined as a first length, and an axial length of the penetrating column is defined as a second length, wherein the first length is at least equal to the second length. The body further comprises a plurality of setting holes extending therethrough, providing for insertion of the penetrating column from top to bottom. The body forms a plurality of restriction portions, each positioned at a respective one of the setting holes, wherein each restriction portion forms a stop against the abutment portion that enters the respective setting hole, thereby restricting the insertion member.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:主體</p>  
        <p type="p">21:頂緣側</p>  
        <p type="p">22:底緣側</p>  
        <p type="p">23:設置孔</p>  
        <p type="p">24:孔壁</p>  
        <p type="p">30:限制部</p>  
        <p type="p">32:承抵面</p>  
        <p type="p">D1:第一距離</p>  
        <p type="p">L1:第一長度</p>  
        <p type="p">W1:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="342" publication-number="202612947"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612947.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612947</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136171</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>前車路徑追蹤系統與方法</chinese-title>  
        <english-title>PRECEDING VEHICLE PATH FOLLOWING SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120240927B">B60W30/16</main-classification>  
        <further-classification edition="202001120240927B">B60W30/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人車輛研究測試中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUTOMOTIVE RESEARCH &amp; TESTING CENTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏毓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許琮明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, TSUNG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯明寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, MING-KUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種前車路徑追蹤系統與方法，其應用於一本車，本車接收前車資訊、並偵測前車的本車資訊後，先根據本車資訊產生一前車估測路徑。接著根據前車資訊產生一前車輪速路徑，並匹配出目前本車位於前車輪速路徑上的位置，以做為一路徑追蹤起始點，並根據前車輪速路徑及前車估測路徑的狀態產生一追蹤路徑決策。最後，根據追蹤路徑決策操控控制器以切換本車之追蹤路徑，使本車追蹤前車輪速路徑或前車估測路徑。本發明可在偵測車道線失效時，追蹤前車的路徑以達到轉向追蹤的目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A preceding vehicle path following system and method, which is applied to a vehicle. The vehicle receives front vehicle information of a front vehicle and detects local vehicle information of the front vehicle, and generates a front vehicle estimated path based on the local vehicle information. Then a front vehicle wheel speed path is generated based on the front vehicle information, and the current position of the vehicle on the front vehicle wheel speed path is matched as a starting point for path following. A following path decision is generated based on the state of the front vehicle wheel speed path and the front vehicle estimated path. Finally, the controller is controlled to switch the following path of the vehicle according to the following path decision, so that the vehicle follows the front vehicle wheel speed path or the front vehicle estimated path. The present invention can follow the path of the vehicle in front to achieve the purpose of steering and following when detecting lane line failure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:本車</p>  
        <p type="p">12:雷達</p>  
        <p type="p">14:車對車無線通訊模組</p>  
        <p type="p">16:本車輪速計</p>  
        <p type="p">18:影像擷取裝置</p>  
        <p type="p">20:前車路徑追蹤系統</p>  
        <p type="p">21:傳送接收介面</p>  
        <p type="p">24:前車路徑估測模組</p>  
        <p type="p">26:路徑匹配模組</p>  
        <p type="p">28:路徑切換模組</p>  
        <p type="p">29:車距維持模組</p>  
        <p type="p">31:縱向控制</p>  
        <p type="p">32:橫向控制</p>  
        <p type="p">40:前車</p>  
        <p type="p">42:底盤回授</p>  
        <p type="p">44:前車輪速計</p>  
        <p type="p">46:車對車無線通訊模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="343" publication-number="202613596"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613596.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613596</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136175</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>安裝於車輛的雷達裝置及安裝方法</chinese-title>  
        <english-title>RADAR DEVICE FOR INSTALLING ON VEHICLE AND INSTALLING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241209B">G01S13/931</main-classification>  
        <further-classification edition="200601120241209B">G01S7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>智易科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARCADYAN TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃冠霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUAN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝政翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIE, JENG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許展維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHAN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭信郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, SHIN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了一種安裝於車輛的雷達裝置。雷達裝置包括用以產生雷達波束的雷達模組及調整機構。調整機構包括車輛安裝部，用於固定於車輛。調整機構同樣包括雷達固定部，樞接於車輛安裝部，使雷達固定部可樞轉於車輛安裝部，及雷達固定部被設置以固定雷達模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A radar device for being installed on a vehicle is provided by the presnt disclosure. The radar device comprises a radar module configured to generate beamforming and an adjusting mechanism. The adjusting mechanism includes a vehicle installation part configured to being mounted on the vichecle. The adjusting mechanism also includes a radar mounting part pivotly connected to the vehicle installation part, such the radar mounting part is pivotable from the vehicle installation part, and the radar mounting part configured to mounting the radar module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:雷達裝置</p>  
        <p type="p">110:雷達模組</p>  
        <p type="p">111:連接器</p>  
        <p type="p">112:固件</p>  
        <p type="p">120:調整機構</p>  
        <p type="p">130:雷達固定部</p>  
        <p type="p">131:第一面</p>  
        <p type="p">132:第一側</p>  
        <p type="p">135:第二側</p>  
        <p type="p">135a,135b:開孔</p>  
        <p type="p">137:開口</p>  
        <p type="p">140:車輛安裝部</p>  
        <p type="p">141:第二面</p>  
        <p type="p">PA:轉動軸心</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="344" publication-number="202613408"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613408.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613408</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136176</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帕斯卡自產力引擎</chinese-title>  
        <english-title>POWER ENGINE MADE BY PASCAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">F03G7/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉代宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TAI-TZUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉代宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TAI-TZUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種帕斯卡自產力引擎包括引擎外殼本體、馬達、第一齒輪、第二齒輪、鏈條、凸輪、曲餅、第一活塞、傳動輪、第二活塞與引擎控制本體。引擎外殼本體兩側分別具有第一油孔與第二油孔。第一齒輪隨著馬達的運作而轉動。傳動輪會與第二齒輪一起連動。第二活塞之一端與傳動輪接觸，第一活塞與第二活塞之間為第一儲油空間。引擎控制本體，其內具有一第二儲油空間與一第三活塞，第二儲油空間內具有一油脂，第三活塞根據外力來推動第二儲油空間內之油脂且使油脂從第三油孔與第四油孔流出且進入至第一儲油空間且透過油壓方式來驅動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power engine made by Pascal includes an engine casing, a motor, a first gear, a second gear, a chain, a cam, a crank, a first piston, a transmission wheel, a second piston, and an engine control body. The engine casing has a first oil hole and a second oil hole on both sides. The first gear rotates with the operation of the motor. The transmission wheel is connected to the second gear. One end of the second piston is in contact with the transmission wheel, and there is a first oil storage space between the first piston and the second piston. The engine control body has a second oil storage space and a third piston, the second oil storage space contains a grease, the third piston pushes the grease in the second oil storage space by an external force and causes the grease to flow out of a third oil hole and a fourth oil hole and enter into the first oil storage space, and the power the third piston is driven hydraulically.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:帕斯卡自產力引擎</p>  
        <p type="p">101:引擎外殼本體</p>  
        <p type="p">101A:第一油孔</p>  
        <p type="p">101B:第二油孔</p>  
        <p type="p">101P:容納空間</p>  
        <p type="p">103:第一齒輪</p>  
        <p type="p">104:第二齒輪</p>  
        <p type="p">105:鏈條</p>  
        <p type="p">106:凸輪</p>  
        <p type="p">107:曲餅</p>  
        <p type="p">108:第一活塞</p>  
        <p type="p">109:傳動輪</p>  
        <p type="p">110:第二活塞</p>  
        <p type="p">111:引擎控制本體</p>  
        <p type="p">111A:第三活塞</p>  
        <p type="p">111B:第三油孔</p>  
        <p type="p">111C:第四油孔</p>  
        <p type="p">AP1:第一傳動軸</p>  
        <p type="p">AP2:第二傳動軸</p>  
        <p type="p">BP1:第一儲油空間</p>  
        <p type="p">BP2:第二儲油空間</p>  
        <p type="p">CP1:第一油管線</p>  
        <p type="p">CP2:第二油管線</p>  
        <p type="p">ST:彈簧</p>  
        <p type="p">TD:三孔閥門</p>  
        <p type="p">PE:油脂</p>  
        <p type="p">200:手把</p>  
        <p type="p">210:前端凸輪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="345" publication-number="202612921"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612921.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612921</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136185</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>爆胎續跑裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">B60C17/00</main-classification>  
        <further-classification edition="200601120241104B">B60C9/02</further-classification>  
        <further-classification edition="200601120241104B">B60C19/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許水鎮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>宜蘭縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許水鎮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種爆胎續跑裝置，包括複數個受拘束排列為圓形的支撐元件，各支撐元件具有主壁，於主壁的一側連接一勾部，於該些勾部環套一束環，於主壁另一側連接外壁、中壁與內壁，於外壁與內壁連接擋壁，以中壁分隔形成鋼索穿孔與彈性環穿孔，於該些鋼索穿孔穿置一鋼索環，於該些彈性環穿孔穿置、嵌設一彈性環，於擋壁形成一彈性環受壓縮後可通過的置入口；當本發明使用時，係以該些勾部配合主壁扣掛於胎壁基部形成的凸環固定，當車輛的輪胎爆胎時，以該些支撐元件的主壁與外壁形成的支撐面可支撐胎面，使輪胎能持續滾動，避免車輛失控的狀況發生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:爆胎續跑裝置</p>  
        <p type="p">10:支撐元件</p>  
        <p type="p">20:束環</p>  
        <p type="p">30:鋼索環</p>  
        <p type="p">32:鋼索</p>  
        <p type="p">34:鋼索調整件</p>  
        <p type="p">40:彈性環</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="346" publication-number="202612670"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612670.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612670</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136186</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輔助椅</chinese-title>  
        <english-title>AUXILIARY CHAIR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">A61G5/12</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國睦工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERITS HEALTH PRODUCTS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭明權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, MING-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭舜遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, SHUN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種輔助椅，包含椅身、至少一快速釋放結構及至少一擺位支撐結構。快速釋放結構連接於椅身。擺位支撐結構連接於快速釋放結構且包含至少二連桿、二第一關節模組及第二關節模組。二第一關節模組分別連接於前述至少二連桿中第一者的二端，各第一關節模組具有第一旋轉軸線，且二第一旋轉軸線彼此平行。第二關節模組連接於前述至少二連桿中第二者遠離第一者的一端且具有第二旋轉軸線，第二旋轉軸線正交於各第一旋轉軸線。其中，操作快速釋放結構，允許擺位支撐結構相對椅身整體旋轉或脫離椅身。藉此增加使用便利性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an auxiliary chair including a chair body, at least one quick releasing structure and at least one posture support structure. The quick releasing structure is connected to the chair body. The posture support structure is connected to the quick releasing structure and includes at least two bars, two first joint modules and a second joint module. The two first joint modules are respectively connected to two ends of a first one of the at least two bars. Each of the first joint modules has a first rotary axis. The two first rotary axes are parallel to each other. The second joint module is connected to one end, being away from the first one of the at least two bars, of a second one of the at least two bars and has a second rotary axis. The second rotary axis is orthogonal to each of the first joint modules. Operation of the quick releasing module allows the posture support structure to rotate relative to or separate from the chair body. Therefore, the using convenience is increased.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:椅身</p>  
        <p type="p">1100:椅背</p>  
        <p type="p">1200:扶手</p>  
        <p type="p">1300:坐板</p>  
        <p type="p">2000,3000,4000,5000,6000:擺位支撐結構</p>  
        <p type="p">2000a,3000a,4000a,5000a,6000a:快速釋放結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="347" publication-number="202613859"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613859.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613859</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136191</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生成式人工智慧資安管理系統及方法</chinese-title>  
        <english-title>GENERATIVE ARTIFICIAL INTELLIGENCE INFORMATION SECURITY MANAGEMENT SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250102B">G06F21/50</main-classification>  
        <further-classification edition="201301120250102B">G06F21/57</further-classification>  
        <further-classification edition="202301120250102B">G06N3/045</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳維超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張明淇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MING-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳卓叡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUO-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種生成式人工智慧資安管理方法，其包含以下步驟。接收對於本地生成式人工智慧模型的問題；提供問題的資安風險分析資訊，資安風險分析資訊包含資安疑慮的布林值；透過本地生成式人工智慧模型提供對於問題的回應；在本地生成式人工智慧模型提供對於問題的回應以後，當收到以外部生成式人工智慧回答之要求時，判斷資安疑慮的布林值是否為真；當資安疑慮的布林值為真時，提供關於問題有資安疑慮之信息。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a generative artificial intelligence information security management method, which includes steps as follows. A question to a local generative artificial intelligence model is received; the security risk analysis information of the question is provided, and the security risk analysis information includes a Bollinger value of an information security concern; a response to the question is provided through the local generative artificial intelligence model; after the local generative artificial intelligence model provides the response to the question, when receiving a request for an external generative artificial intelligence answer, it is determined whether the Bollinger value of the information security concern is true; when the Bollinger value of the information security concern is true, a message that the question has the information security concern is provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:生成式人工智慧資安管理方法</p>  
        <p type="p">S101~S111:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="348" publication-number="202612716"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612716.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612716</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136192</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>促進幹細胞增生之食品組合物及其製備方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241001B">A61K36/185</main-classification>  
        <further-classification edition="200601120241001B">A61K38/06</further-classification>  
        <further-classification edition="200601120241001B">A61K36/9066</further-classification>  
        <further-classification edition="200601120241001B">A61K31/51</further-classification>  
        <further-classification edition="200601120241001B">A61K31/4415</further-classification>  
        <further-classification edition="200601120241001B">A61K31/525</further-classification>  
        <further-classification edition="200601120241001B">A61K33/00</further-classification>  
        <further-classification edition="200601120241001B">A61K36/736</further-classification>  
        <further-classification edition="200601120241001B">A61P37/00</further-classification>  
        <further-classification edition="201601120241001B">A23L33/105</further-classification>  
        <further-classification edition="201601120241001B">A23L33/10</further-classification>  
        <further-classification edition="201601120241001B">A23L33/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾憲群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾憲群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱昱宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種促進幹細胞增生之食品組合物及其製備方法，其中該食品組合物其每一單位包括余甘子萃取物100-300mg、穀胱甘肽50-100mg、薑黃萃取液30-90mg、維生素B1成分0.5-3mg、維生素B6成分1-5mg、維生素B2成分1-5mg、高溶氧水300-10000mg、烏梅蜜100mg、黑糖100mg，該促進幹細胞增生之食品組合物之製備方法包括原料提供、攪拌混合、殺菌、過濾、填充裝瓶及包裝。本發明藉由應用主要原料余甘子萃取物、穀胱甘肽、薑黃萃取液、維生素、高溶氧水等成分，另外搭配輔助原料，經過多次實驗與調整最後獲得各成分和諧、平衡之比例，除了便於口服及可提升口服時之口味、口感良好效果，人體服用本發明製成之食品後可有效促進血液細胞中造血幹細胞(如CD34+/CD45+)數量之增生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:促進幹細胞增生之食品組合物</p>  
        <p type="p">10:余甘子萃取物</p>  
        <p type="p">20:穀胱甘肽</p>  
        <p type="p">30:薑黃萃取液</p>  
        <p type="p">40:維生素B1成分</p>  
        <p type="p">50:維生素B6成分</p>  
        <p type="p">60:維生素B2成分</p>  
        <p type="p">70:高溶氧水</p>  
        <p type="p">80:烏梅蜜</p>  
        <p type="p">90:黑糖</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="349" publication-number="202614807"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614807.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614807</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136193</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/60</main-classification>  
        <further-classification edition="202501120250102B">H10D84/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊詠方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YUNG-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭晉佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHIN-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHUN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭竣文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHUN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜銘祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, MING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃雅歆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YA-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置及其形成方法，半導體裝置包括基底、溝槽、第一閘極介電層、第一閘極電極以及第一插塞。基底包括一中壓區和一低壓區。溝槽設置在基底內並位在該中壓區內。第一閘極介電層，設置在該溝槽的一平面上。第一閘極電極設置在該第一閘極介電層上。第一插塞設置在該第一閘極電極和該溝槽的該平面之上，該第一插塞電性連接該第一閘極電極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device and method of fabricating the same, includes a substrate, a recess, a first gate oxide layer, a first gate electrode, and a first contact. The substrate includes a medium-voltage region and a low-voltage region. The recess is disposed in the substrate, within the MV region. The first gate oxide layer is disposed on a top surface of the recess. The first gate electrode is disposed on the first gate oxide layer. The first contact is disposed on the first gate electrode and on the recess, and the first contact is electrically connected the first gate electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體裝置</p>  
        <p type="p">100:基底</p>  
        <p type="p">100L:低壓區</p>  
        <p type="p">100M:中壓區</p>  
        <p type="p">100p:平面</p>  
        <p type="p">100t:頂表面</p>  
        <p type="p">102:擴散區</p>  
        <p type="p">102t:頂表面</p>  
        <p type="p">104:鰭狀結構</p>  
        <p type="p">104t:頂表面</p>  
        <p type="p">106:淺溝渠隔離</p>  
        <p type="p">110:閘極結構</p>  
        <p type="p">112:第一閘極介電層</p>  
        <p type="p">114:第一閘極電極</p>  
        <p type="p">120:第一插塞</p>  
        <p type="p">122:第二插塞</p>  
        <p type="p">130:閘極結構</p>  
        <p type="p">132:第二閘極介電層</p>  
        <p type="p">134:第二閘極電極</p>  
        <p type="p">D2:方向</p>  
        <p type="p">R1:溝槽</p>  
        <p type="p">S1:平面</p>  
        <p type="p">Y:垂直方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="350" publication-number="202613900"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613900.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613900</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136194</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>法遵管理系統之伺服器裝置及其操作方法</chinese-title>  
        <english-title>SERVER DEVICE OF LAW COMPLIANCE MANAGEMENT SYSTEM AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250102B">G06Q10/06</main-classification>  
        <further-classification edition="200601120250102B">G05B19/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>律盟風險管理顧問股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEAVEN RM CONSULTANCY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭偉松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, WEI-SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳弈錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, I-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王逸凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YI-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳姿臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZIH-JHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張大山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TA-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳弈錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之部分實施例係關於一種伺服器裝置，包含一處理模組、一分類模組、一分析模組、及一通訊模組。該處理模組經組態以在一第一週期期間自一周邊裝置即時地接收第一資料。該分類模組經組態以依據分類資訊將該第一資料進行分類。該分析模組經組態以分析該經分類第一資料並產生一分析結果，且產生一警示訊息以回應於該分析結果超過一臨限值。該通訊模組經組態以將該警示訊息即時地在該第一週期期間回饋至該周邊裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In some embodiments, the present disclosure relates to a server device, which includes a processing module, a classifying module, an analysis module, and a communication module. The processing module is configured to receive first data in real time from a peripheral device during a first period. The classification module is configured to classify the first data according to classification information. The analysis module is configured to analyze the classified first data and generate an analysis result, and generate an alert message in response to the analysis result exceeding a threshold value. The communication module is configured to feedback the analysis message to the peripheral device in real time during the first period.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:管理系統</p>  
        <p type="p">20:伺服器裝置</p>  
        <p type="p">21:周邊裝置</p>  
        <p type="p">22:周邊裝置</p>  
        <p type="p">23:網路</p>  
        <p type="p">201:處理模組</p>  
        <p type="p">202:儲存模組</p>  
        <p type="p">203:分類模組</p>  
        <p type="p">204:分析模組</p>  
        <p type="p">205:通訊模組</p>  
        <p type="p">211:感測模組</p>  
        <p type="p">212:儲存模組</p>  
        <p type="p">213:處理模組</p>  
        <p type="p">214:通訊模組</p>  
        <p type="p">221:感測模組</p>  
        <p type="p">222:儲存模組</p>  
        <p type="p">223:處理模組</p>  
        <p type="p">224:通訊模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="351" publication-number="202613999"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613999.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613999</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136195</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學品噴濺之災害模擬系統</chinese-title>  
        <english-title>ACCIDENT SIMULATION SYSTEM FOR SPATTER OF CHEMICALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">G09B9/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勞動部職業安全衛生署</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OCCUPATIONAL SAFETY AND HEALTH ADMINISTRATION, MINISTRY OF LABOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國家科學及技術委員會南部科學園區管理局</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOUTHERN TAIWAN SCIENCE PARK BUREAU, MINISTRY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁富傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIUNG, FU-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, CHIA-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種化學品噴濺之災害模擬系統，用以解決習知模擬裝置體驗性不佳的問題。係包含：頭戴式裝置具有顯示器及影像擷取模組，該影像擷取模組用於獲取擷取影像；影像模組與該頭戴式裝置耦接，以生成虛擬影像於該顯示器中；及處理模組分別與該顯示器、該影像擷取模組及該影像模組耦接，以接收該虛擬影像與該擷取影像；該處理模組識別該擷取影像與該虛擬影像的交互關係，並當所述交互關係滿足預設腳本中的狀態時，該處理模組發出控制訊號以更新影像模組傳送至該顯示器之虛擬影像。藉此可以提升使用者對於災難處置的學習效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An accident simulation system for spatter of chemicals is adapted for solving the problem of poor interactivity of the conventional simulation equipment. The system includes a headwear device, an image module and a processing module. The headwear device has a displaying device and an image-capturing module configured to obtain a captured image. The image module is coupled with the headwear device to generate a virtual image in the displaying device. The processing module is coupled with the displaying device, the image-capturing module and the image module respectively so as to receive the virtual image and the captured image. The processing module identifies the inter-relationship between the captured image and the virtual image. When said inter-relationship satisfies a status in a predetermined script, the processing module transmits a control signal to activate the image module to update a virtual image to be transmitted to the displaying device. The present invention improves the user’s learning effectiveness in handling accidents.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:頭戴式裝置</p>  
        <p type="p">11:顯示器</p>  
        <p type="p">12:影像擷取模組</p>  
        <p type="p">2:影像模組</p>  
        <p type="p">3:處理模組</p>  
        <p type="p">4:實體場景道具</p>  
        <p type="p">41:實體化學設備</p>  
        <p type="p">41a:實體管路</p>  
        <p type="p">41b:第一噴灑模組</p>  
        <p type="p">42:實體沖洗設備</p>  
        <p type="p">42a:實體拉動件</p>  
        <p type="p">42b:第二噴灑模組</p>  
        <p type="p">C:擷取影像</p>  
        <p type="p">V:虛擬影像</p>  
        <p type="p">VH:資訊提示</p>  
        <p type="p">VO:互動式物件</p>  
        <p type="p">VS:影像場景</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="352" publication-number="202614716"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614716.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614716</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136196</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱單元、散熱組件及電子裝置</chinese-title>  
        <english-title>HEAT SINK UNIT, HEAT SINK ASSEMBLY AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H05K7/20</main-classification>  
        <further-classification edition="200601120241105B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>啓碁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WNC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉英志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YING-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林亦杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建鋐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辜煜夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, YU-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BO-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱單元，包含一第一板部及一第二板部。第一板部一體成型製成並包含一外表面、一內表面及至少一凸包。第二板部連接第一板部。第一板部及第二板部之間的一第一夾角介於5度及175度之間，第一板部的外表面較內表面遠離第二板部，凸包位於外表面。藉此，有利於降低成本及重量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat sink unit includes a first plate portion and a second plate portion. The first plate portion is integrally formed and includes an outer surface, an inner surface and at least one protrusion. The second plate portion is connected to the first plate portion. A first included angle between the first plate portion and the second plate portion is between 5 degrees and 175 degrees. The outer surface of the first plate portion is farther from the second plate portion than the inner surface therefrom, and the protrusion is located on the outer surface. Therefore, it is advantageous in reducing cost and weight.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第一散熱單元</p>  
        <p type="p">101:凸包</p>  
        <p type="p">102:邊緣</p>  
        <p type="p">103:第一開孔</p>  
        <p type="p">104:第一豎起片</p>  
        <p type="p">110:第一板部</p>  
        <p type="p">115,125:外表面</p>  
        <p type="p">116:內表面</p>  
        <p type="p">117,127:主體區</p>  
        <p type="p">120:第二板部</p>  
        <p type="p">130:第三板部</p>  
        <p type="p">180:螺柱</p>  
        <p type="p">188:定位結構</p>  
        <p type="p">190:接合部</p>  
        <p type="p">a1:第一夾角</p>  
        <p type="p">a3:第一豎起夾角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="353" publication-number="202613568"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613568.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613568</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136197</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可讀取多組線圈數據的線圈套組及方法</chinese-title>  
        <english-title>A SETS OF COIL SETS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">G01R15/20</main-classification>  
        <further-classification edition="200601120241104B">G06F11/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>展綠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>3EGREEN TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王煌樑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUANG-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳仁作</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, REN-ZUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊益松</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種可讀取多組線圈數據的線圈套組，其包括；複數羅式線圈，該複數羅式線圈分別包括有線圈輸入單元、多段式切換單元、放大線路單元、過載保護單元、類比數位轉換單元，多段式切換單元具有低檔位測量模式與高檔位測量模式；主機，其有微處理控制計算單元、無線傳輸單元、直流-直流電壓轉換單元、有線USB供電傳輸單元，微處理控制計算單元與無線傳輸單元、有線USB供電傳輸單元電性連接，直流-直流電壓轉換單元與有線USB供電傳輸單元電性連接；複數羅式線圈以多段式切換單元、類比數位轉換單元與主機之微處理控制計算單元電性連結。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A Sets of Coil Sets . It includes a plurality of Rogowski coils and a host. The plurality of Rogowski coils respectively include a coil input unit, a multi-stage switching unit, an amplification circuit unit, an overload protection unit, and an analog-to-digital conversion unit. The multi-segment switching unit has a low gear measurement mode and a high gear measurement mode. The host is provided with a micro-processing control calculation unit, a wireless transmission unit, a direct-current-direct current voltage conversion unit and a wired USB power supply transmission unit, wherein the micro-processing control calculation unit is electrically connected with the wireless transmission unit and the wired USB power supply transmission unit, and the direct-current-direct current voltage conversion unit is electrically connected with the wired USB power supply transmission unit. The plurality of Rogowski coils are electrically connected to the micro-processing control calculation unit of the host through the multi-stage switching unit and the analog-to-digital conversion unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:羅式線圈</p>  
        <p type="p">11:線圈輸入單元</p>  
        <p type="p">12:多段式切換單元</p>  
        <p type="p">13:放大線路單元</p>  
        <p type="p">14:過載保護單元</p>  
        <p type="p">15:類比數位轉換單元</p>  
        <p type="p">2:主機</p>  
        <p type="p">21:微處理控制計算單元</p>  
        <p type="p">22:無線傳輸單元</p>  
        <p type="p">23:直流-直流電壓轉換單元</p>  
        <p type="p">24:有線USB供電傳輸單元</p>  
        <p type="p">25:乙太網路傳輸單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="354" publication-number="202613767"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613767.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613767</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136198</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可分離充電之無線行動電源</chinese-title>  
        <english-title>DETACHABLE CHARGING WIRELESS POWER BANK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241224B">G06F1/16</main-classification>  
        <further-classification edition="200601120241224B">G06F1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辰星數位有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MSTAR DIGITAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉秉昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, PING-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施惠恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, HUI-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宜家</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, I-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊益松</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種可分離充電之無線行動電源，包括：充電本體，表面具有結合部；充電基座，組卸於該充電本體之結合部並具有充電表面及充電孔，該充電表面提供無線充電功能；其中，當該充電基座組合該充電本體時，該充電本體對該充電基座進行充電，當該充電基座卸離該充電本體時，該充電基座之充電孔連接外部電源對該其進行充電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention is a detachable and rechargeable wireless mobile power supply, which includes: a charging body with a connecting portion on the surface; a charging base that is assembled at the connecting portion of the charging body and has a charging surface and a charging hole. The charging surface provides wireless Charging function; wherein, when the charging base is combined with the charging body, the charging body charges the charging base, and when the charging base is detached from the charging body, the charging hole of the charging base is connected to an external power source. It's time to recharge.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:充電本體</p>  
        <p type="p">10:容設空間</p>  
        <p type="p">12:充電線</p>  
        <p type="p">120:充電接頭</p>  
        <p type="p">13:結合部</p>  
        <p type="p">130:槽壁</p>  
        <p type="p">14:第一電性連接部</p>  
        <p type="p">2:充電基座</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="355" publication-number="202613567"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613567.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613567</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136199</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電磁能充電鉤表</chinese-title>  
        <english-title>ELECTROMAGNETIC ENERGY CHARGING HOOK METER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241224B">G01R15/12</main-classification>  
        <further-classification edition="200601120241224B">G01R19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>展綠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>3EGREEN TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王煌樑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUANG-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳仁作</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, REN-ZUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊益松</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種電磁能充電鉤表，包括：電磁感應單元，電性連接該待測電線；自動切換單元，電性連接該電磁感應單元；二段式檔位切換單元，電性連接該自動切換單元之測量端並具有低檔位測量與高檔位測量；交流/直流轉換單元，電性連接該二段式檔位切換單元；微處理計算單元，電性連接該交流/直流轉換單元並具有充電控制輸出裝置及測量控制輸出裝置，該充電控制輸出裝置電性連接至該自動切換單元，該測量控制輸出裝置電性連接至該二段式檔位切換單元；整流單元，電性連接該自動切換單元之充電端；能量暫存單元，電性連接該整流單元；充電電池，電性連接該充電單元以提供電量至該微處理計算單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention is an electromagnetic energy charging hook meter, which includes: an electromagnetic induction unit, electrically connected to the wire to be measured; an automatic switching unit, electrically connected to the electromagnetic induction unit; and a two-stage gear switching unit, electrically connected to the The measuring end of the automatic switching unit has low-gear measurement and high-gear measurement; the AC/DC conversion unit is electrically connected to the two-stage gear switching unit; the microprocessor calculation unit is electrically connected to the AC/DC conversion unit and has A charging control output terminal and a measuring output terminal, the charging control output terminal is electrically connected to the automatic switching unit, the measuring output terminal is electrically connected to the two-stage gear switching unit; the rectifier unit is electrically connected to the automatic switching unit The charging terminal; the energy temporary storage unit is electrically connected to the rectifier unit; the rechargeable battery is electrically connected to the charging unit to provide power to the microprocessing calculation unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電待測電線</p>  
        <p type="p">2:磁感應單元</p>  
        <p type="p">3:自動切換單元</p>  
        <p type="p">30:測量端</p>  
        <p type="p">31:充電端</p>  
        <p type="p">4:二段式檔位切換單元</p>  
        <p type="p">40:低檔位測量</p>  
        <p type="p">41:高檔位測量</p>  
        <p type="p">42:第一過壓保護單元</p>  
        <p type="p">43:交流/直流轉換單元</p>  
        <p type="p">5:微處理計算單元</p>  
        <p type="p">50:充電控制輸出裝置</p>  
        <p type="p">51:測量控制輸出裝置</p>  
        <p type="p">52:無線傳輸單元</p>  
        <p type="p">520:第一外部電子裝置</p>  
        <p type="p">53:有線傳輸單元</p>  
        <p type="p">530:第二外部電子裝置</p>  
        <p type="p">6:整流單元</p>  
        <p type="p">60:第二過壓保護單元</p>  
        <p type="p">7:能量暫存單元</p>  
        <p type="p">70:充電單元</p>  
        <p type="p">71:充電保護單元</p>  
        <p type="p">72:充電電池</p>  
        <p type="p">73:直流/直流轉換單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="356" publication-number="202613564"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613564.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613564</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136202</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合式測試連接器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">G01R1/073</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰可廣科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳欣龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種複合式測試連接器，係用於設置在測試系統的電路載板作為半導體元件或晶圓等半導體待測物電性連接媒介，其係在探針座中裝設多支彈性探針及多支接觸探針，並設有軟式電路板由探針座之主動面延伸至電路載板，軟式電路板中具有阻抗匹配之多條訊號傳輸線路電性連接電路載板，每一訊號傳輸線路位於主動面上方的訊號連接點能與對應的半導體待測物的訊號接點電性接觸，每一彈性探針分別在對應訊號連接點的位置提供工作行程之彈性，每一接觸探針電性連接電路載板且分別穿過軟式電路板並能電性接觸半導體待測物的電源接點或接地接點，藉由軟式電路板中阻抗匹配之多條訊號傳輸線路提供高頻訊號傳輸路徑，以符合半導體待測物之高頻測試作業需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:複合式測試連接器</p>  
        <p type="p">10:探針座</p>  
        <p type="p">40:軟式電路板</p>  
        <p type="p">41:測試連接部</p>  
        <p type="p">42:延伸段</p>  
        <p type="p">43:固定連接部</p>  
        <p type="p">5:電路載板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="357" publication-number="202613955"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613955.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613955</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136219</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雲端預算管理系統及其操作方法</chinese-title>  
        <english-title>CLOUD BUDGET MANAGEMENT SYSTEM AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250203B">G06Q40/12</main-classification>  
        <further-classification edition="202301120250203B">G06Q10/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃惠君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HUI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴弘忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, HUNG-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, I-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種雲端預算管理系統及其操作方法。所述操作方法包括：由預算管控模組儲存多筆已核准資訊；由預算管控模組接收對應於公雲服務的申請表單及佐證檔案，並根據申請表單產生表單影像；由簽核模組基於申請表單輸出申請簽核通知；響應於接收到對應於申請簽核通知的申請許可通知且申請表單的申請項目為新增申請，由簽核模組將申請表單及佐證檔案作為第一已核准資訊；由資源配發模組週期性地基於多筆已核准資訊建立預算檢查表，並基於預算檢查表執行預算檢查操作；以及響應於預算檢查操作為異常，由資源配發模組產生並輸出預算超支通知。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cloud budget management system and operation method thereof are provided. The operation method includes: storing a plurality of approved information through a budget control module; receiving an application form and a supporting file corresponding to a public cloud service and generating a form image based on the application form through the budget control module; outputting an application approval notification based on the application form through an approval module; in response to receiving an application permission notification corresponding to the application approval notification and an application item in the application form is a new application, using the application form and the supporting file as a first approved information through the approval module; periodically establishing a budget check list based on the plurality of approved information and performing a budget check operation based on the budget check list through a resource allocation module; and in response to the budget check operation being abnormal, generating and outputting a budget overrun notification through the resource allocation module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:雲端預算管理系統</p>  
        <p type="p">110:處理器</p>  
        <p type="p">120:儲存媒體</p>  
        <p type="p">121:預算管控模組</p>  
        <p type="p">122:簽核模組</p>  
        <p type="p">123:資源配發模組</p>  
        <p type="p">130:收發器</p>  
        <p type="p">200-1、200-2、200-3、200-N:終端設備</p>  
        <p type="p">300:公用雲端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="358" publication-number="202613041"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613041.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613041</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136225</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁式流體管</chinese-title>  
        <english-title>FLUID TUBE OF MAGNETOSTATIC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241209B">C02F1/48</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>磁河智慧財產顧問有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMIO-YU INTELLECTUAL PROPERTY CONSULTING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫智傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MO, CHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種磁式流體管，包括一管體及多個磁環段，其中每一磁環段由多個組合塊組成，而且相鄰兩磁環段的所述多個組合塊的磁極排列不同。利用將多個磁環段的組合塊設置成多個不同磁極方向的排列方式，能夠有效提高流體的磁化效率，並且節省磁環段的設置空間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fluid tube of magnetostatic is provided. The fluid tube comprises a body and a plurality of ring segments, wherein each ring segment is composed of a plurality of blocks, and the magnetic pole arrangements of the blocks of two adjacent ring segments are different. By arranging the blocks of ring segments into arrangements with different magnetic pole directions, the magnetization efficiency of the fluid can be effectively improved, and the installation space of the ring segments can be reduced.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:管體</p>  
        <p type="p">3:磁環段</p>  
        <p type="p">31:段面</p>  
        <p type="p">32:通孔</p>  
        <p type="p">33:組合塊</p>  
        <p type="p">A:第一磁環段</p>  
        <p type="p">B:第二磁環段</p>  
        <p type="p">C:第三磁環段</p>  
        <p type="p">D:第四磁環段</p>  
        <p type="p">X、Y、Z:座標軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="359" publication-number="202614375"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614375.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614375</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136227</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加工方法、加工設備及其上模裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">H01L23/28</main-classification>  
        <further-classification edition="200601120241204B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬潤科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALL RING TECH CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉泰宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TAI-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥佐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAN-ZUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種加工方法、加工設備及其上模裝置，該加工方法包括使一積體電路元件以一基板載置在一下模裝置上。使一上模裝置與該下模裝置結合，以相配合界定出對該積體電路元件進行加工的一加工區間。使一負壓源對該加工區間抽氣，以使一加工氣體流入該加工區間內而能與該積體電路元件之一上蓋產生氧化還原反應。使該上模裝置對該上蓋施加壓力。透過使該加工氣體流入該加工區間而能使該上蓋形成之氧化膜層進行還原之設計，能夠提升該上蓋與一晶片間的黏合度，以提升封裝加工品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:上模裝置</p>  
        <p type="p">31:儲氣單元</p>  
        <p type="p">311:容器</p>  
        <p type="p">312:加熱器</p>  
        <p type="p">313:容液區</p>  
        <p type="p">314:容氣區</p>  
        <p type="p">32:進氣單元</p>  
        <p type="p">321:進氣管</p>  
        <p type="p">322:進氣閥</p>  
        <p type="p">33:抽氣單元</p>  
        <p type="p">331:抽氣管</p>  
        <p type="p">332:抽氣閥</p>  
        <p type="p">34:負壓源</p>  
        <p type="p">4:下模裝置</p>  
        <p type="p">40:加工區間</p>  
        <p type="p">41:承載單元</p>  
        <p type="p">42:下壓模單元</p>  
        <p type="p">421:第二加熱座</p>  
        <p type="p">422:下壓模</p>  
        <p type="p">423:第二加熱件</p>  
        <p type="p">43:底罩單元</p>  
        <p type="p">5:檢測器</p>  
        <p type="p">64:上模單元</p>  
        <p type="p">641:壓桿機構</p>  
        <p type="p">642:封罩</p>  
        <p type="p">643:第一加熱座</p>  
        <p type="p">644:上壓模</p>  
        <p type="p">645:抽氣接頭</p>  
        <p type="p">646:進氣接頭</p>  
        <p type="p">647:第一加熱件</p>  
        <p type="p">8:積體電路元件</p>  
        <p type="p">81:基板</p>  
        <p type="p">82:晶片</p>  
        <p type="p">83:熱界面材</p>  
        <p type="p">84:上蓋</p>  
        <p type="p">91:氧化還原液體</p>  
        <p type="p">92:加工氣體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="360" publication-number="202613290"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613290.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613290</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136228</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於高鹼性離子水之環保型切削液</chinese-title>  
        <english-title>ENVIRONMENTALLY FRIENDLY CUTTING FLUID BASED ON HIGHLY ALKALINE IONIZED WATER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">C10M173/02</main-classification>  
        <further-classification edition="200601320241205B">C10N20/00</further-classification>  
        <further-classification edition="200601320241205B">C10N40/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立勤益科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃逸仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI-JEN, HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林岳鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUE-FENG, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林永昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基於高鹼性離子水之環保型切削液，以該切削液總重量為100wt%計算，該切削液包括聚乙二醇(PEG)、環氧乙烷聚酯(EP)及高鹼性離子水；其中，該聚乙二醇的含量為：5wt%＜PEG≦7wt%；該環氧乙烷聚酯的含量為：7wt%≦EP≦9wt%；以及餘量為該高鹼性離子水。本發明前述切削液經測試證實，相較於市售傳統切削液，具有更低的摩擦係數(小於或等於0.13)、磨耗率(小於或等於2.8×10-3 mm³/Nm)，以及更高的防鏽性能，腐蝕電壓(Ecorr)大於或等於-0.27V，腐蝕電流(Icorr)小於或等於3.17×10-8A/cm²。本發明提供一種高效且環保的切削液選擇，適用於多種金屬加工操作的環保型切削液。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an environmentally friendly cutting fluid based on highly alkaline ionized water. Calculated as 100 wt% of the total weight of the cutting fluid, the fluid comprises polyethylene glycol (PEG), ethylene oxide polyester (EP), and highly alkaline ionized water. Specifically, the content of polyethylene glycol is: 5 wt% ＜ PEG ≤ 7 wt%; the content of ethylene oxide polyester is: 7 wt% ≤ EP ≤ 9 wt%; and the remainder is the highly alkaline ionized water.Tests have confirmed that, compared to commercially available traditional cutting fluids, the cutting fluid of this invention exhibits a lower friction coefficient (less than or equal to 0.13), a lower wear rate (less than or equal to 2.8 × 10⁻³ mm³/Nm), and superior anti-rust performance, with a corrosion potential (Ecorr) greater than or equal to -0.27V and a corrosion current (Icorr) less than or equal to 3.17 × 10⁻⁸ A/cm². This invention offers a high-efficiency and environmentally friendly cutting fluid option suitable for various metal processing operations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:高鹼性離子水混合環氧乙烷聚酯之切削液</p>  
        <p type="p">2:環氧乙烷聚酯沉澱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="361" publication-number="202613952"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613952.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613952</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136232</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>支援多元化產品整併服務之數位申貸系統及數位申貸方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241224B">G06Q40/03</main-classification>  
        <further-classification edition="202301120241224B">G06Q40/02</further-classification>  
        <further-classification edition="201201120241224B">G06Q20/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國信託商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CTBC BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳凱炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇賢哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫瑞黛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭靖娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種支援多元化產品整併服務之數位申貸系統，包含一銀行伺服器及與其電連接的一服務端電子裝置。該銀行伺服器儲存有多個貸款產品資料。該服務端電子裝置傳送相關於該等貸款產品資料其中多者的一產品組合請求給該銀行伺服器。該銀行伺服器產生包含該產品組合請求相關的該等貸款產品資料的一組合性產品資料、一待填寫貸款申請資料及一線上申貸網址。該客戶端電子裝置透過該線上申貸網址連結至該銀行伺服器後，該銀行伺服器將該待填寫貸款申請資料傳送給該客戶端電子裝置，並自該客戶端電子裝置接收一貸款申請資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:支援多元化產品整併服務之數位申貸系統</p>  
        <p type="p">1:銀行伺服器</p>  
        <p type="p">2:服務端電子裝置</p>  
        <p type="p">200:客戶端電子裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="362" publication-number="202612897"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612897.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612897</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136233</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>減少支撐材之積層製造裝置及方法</chinese-title>  
        <english-title>APPARATUS AND METHOD OF REDUCING SUPPORT MATERIAL IN ADDITIVE MANUFACTURING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120241105B">B29C64/227</main-classification>  
        <further-classification edition="201501120241105B">B33Y30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李典儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, DIAN-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃中道</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUNG-TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為解決積層製造支撐材料耗費及製程與移除支撐材後處理時間過長而導致使用成本上升的問題，本發明提供一種減少支撐材之積層製造裝置，包括：主平台，由可被動抬升的子平台模組依照預計製造的工件所需製造形狀拼接而成；抬升機構，連接於該主平台上方的積層製造模組並由致動器驅動；控制系統，連接於該積層製造模組與該致動器，通過控制系統來執行演算法決定各該子平台模組的抬升高度，並驅動致動器來實現該積層製造模組對準該子平台模組的其中之一、驅動該抬升機構、牽引該子平台模組抬升作為支撐用途，進一步降低積層製造機台的支撐材料的使用，提高積層製造的產能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To solve the problem of increased costs caused by the excessive consumption of support materials and prolonged process times in additive manufacturing, as well as the lengthy process and post-processing time required to remove the support structures, this invention provides a device that reduces the use of support materials in additive manufacturing, comprising: a main platform, formed by the passive elevation of sub-platform modules, which are assembled according to the required manufacturing shape of the intended workpiece; a lifting mechanism, connected to the additive manufacturing module above the main platform and driven by an actuator; a control system, connected to the additive manufacturing module and the actuator. The control system executes algorithms to determine the lifting height of each sub-platform module and drives the actuator to align the additive manufacturing module with one of the sub-platform modules, drive the lifting mechanism, and elevate the sub-platform module to serve as support. These actions further reduce the use of support materials in the additive manufacturing machine and increase manufacturing productivity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:減少支撐材之積層製造實現裝置</p>  
        <p type="p">10:工件</p>  
        <p type="p">1100:子平台</p>  
        <p type="p">1200:抬升機構</p>  
        <p type="p">1300:控制系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="363" publication-number="202614800"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614800.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614800</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136235</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/47</main-classification>  
        <further-classification edition="202501120250102B">H10D62/85</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JHE-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游政昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, JHENG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體元件包括基材結構、源極結構、汲極結構以及閘極結構。基材結構包括半導體層。源極結構、汲極結構以及閘極結構位於基材結構的半導體層上方且沿著第一方向排列。閘極結構位於源極結構與汲極結構之間。汲極結構包括多個第一島狀結構與多個第二島狀結構沿著第二方向交替且間隔地排列。第二方向與第一方向實質上垂直。每個第一島狀結構包括p型半導體層與位於p型半導體層上方的第一金屬電極。每個第二島狀結構包括第二金屬電極。在導通狀態下，第一島狀結構的第一金屬電極的電位不同於第二島狀結構的第二金屬電極的電位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a substrate structure, a source structure, a drain structure, and a gate structure. The substrate structure includes a semiconductor layer. The source structure, the drain structure, and the gate structure are over the semiconductor layer of the substrate structure and are arranged along a first direction. The gate structure is between the source structure and the drain structure. The drain structure includes a plurality of first island structures and a plurality of second island structures arranged alternately and spaced apart along a second direction. The second direction is substantially perpendicular to the first direction. Each of the first island structures includes a p-type semiconductor layer and a first metal electrode over the p-type semiconductor layer. Each of the second island structures includes a second metal electrode. In a conducting state, a potential of the first metal electrode of each of the first island structures is different from a potential of the second metal electrode of each of the second island structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體元件</p>  
        <p type="p">100:基材結構</p>  
        <p type="p">108:半導體層</p>  
        <p type="p">110:源極結構</p>  
        <p type="p">111:源極電極</p>  
        <p type="p">112:源極穿孔</p>  
        <p type="p">120:汲極結構</p>  
        <p type="p">121:第一島狀結構</p>  
        <p type="p">121a:p型半導體層</p>  
        <p type="p">121b,122a:金屬電極</p>  
        <p type="p">121c,122b:汲極穿孔</p>  
        <p type="p">122:第二島狀結構</p>  
        <p type="p">130:閘極結構</p>  
        <p type="p">131:閘極半導體</p>  
        <p type="p">132:閘極金屬電極</p>  
        <p type="p">A-A’,B-B’,C-C’:線段</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">G:間隔</p>  
        <p type="p">L1,L2:長度</p>  
        <p type="p">W1,W2:寬度</p>  
        <p type="p">X1,X2,X3:間距</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="364" publication-number="202614801"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614801.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614801</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136236</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/47</main-classification>  
        <further-classification edition="202501120250102B">H10D62/85</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JHE-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游政昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, JHENG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體元件包括基材結構、源極結構、汲極結構以及閘極結構。源極結構、汲極結構以及閘極結構位於基材結構的半導體層上方且沿著第一方向排列。閘極結構位於源極結構與汲極結構之間。汲極結構包括多個第一電極單元與多個第二電極單元沿著第二方向交替地排列。第二方向與第一方向實質上垂直。每個第一電極單元包括p型半導體層與位於p型半導體層上方的第一金屬電極。每個第二電極單元包括第二金屬電極。每個第一電極單元的p型半導體層沿著第一方向的寬度實質上等於每個第二電極單元的第二金屬電極沿著第一方向的寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a substrate structure, a source structure, a drain structure, and a gate structure. The source structure, the drain structure, and the gate structure are over a semiconductor layer of the substrate structure and are arranged along a first direction. The gate structure is between the source structure and the drain structure. The drain structure includes a plurality of first electrode units and a plurality of second electrode units arranged alternately along a second direction. The second direction is substantially perpendicular to the first direction. Each of the first electrode units includes a p-type semiconductor layer and a first metal electrode over the p-type semiconductor layer. Each of the second electrode units includes a second metal electrode. A width of the p-type semiconductor layer of each of the first electrode units along the first direction is substantially equal to a width of the second metal electrode of each of the second electrode units along the first direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體元件</p>  
        <p type="p">100:基材結構</p>  
        <p type="p">108:半導體層</p>  
        <p type="p">110:源極結構</p>  
        <p type="p">111:源極電極</p>  
        <p type="p">112:源極穿孔</p>  
        <p type="p">120:汲極結構</p>  
        <p type="p">121:第一電極單元</p>  
        <p type="p">121a:p型半導體層</p>  
        <p type="p">121b,122a:金屬電極</p>  
        <p type="p">121c:第一汲極穿孔</p>  
        <p type="p">122:第二電極單元</p>  
        <p type="p">122b:第二汲極穿孔</p>  
        <p type="p">130:閘極結構</p>  
        <p type="p">131:閘極半導體</p>  
        <p type="p">132:閘極金屬電極</p>  
        <p type="p">A-A’,B-B’,C-C’:線段</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">G1:間隔</p>  
        <p type="p">L1,L2:長度</p>  
        <p type="p">W1,W2:寬度</p>  
        <p type="p">X1,X2,X3:間距</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="365" publication-number="202614808"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614808.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614808</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136237</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/60</main-classification>  
        <further-classification edition="202501120250102B">H10D62/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JHE-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游政昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, JHENG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體元件包括基材結構、源極結構、汲極結構及閘極結構。源極結構、汲極結構及閘極結構位於基材結構上方且沿第一方向排列。汲極結構包括多個第一電極單元與多個第二電極單元沿第二方向交替地排列。第二方向與第一方向實質上垂直。每個第一電極單元包括p型半導體層與第一金屬電極。p型半導體層具有第一底面積。每個第二電極單元包括第二金屬電極。第二金屬電極具有第二底面積。第二底面積大於第一底面積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a substrate structure, a source structure, a drain structure, and a gate structure. The source structure, the drain structure, and the gate structure are over the substrate structure and are arranged along a first direction. The drain structure includes a plurality of first electrode units and a plurality of second electrode units arranged alternately along a second direction. The second direction is substantially perpendicular to the first direction. Each of the first electrode units includes a p-type semiconductor layer and a first metal layer. Each of the second electrode units includes a second metal layer. A bottom area of the second metal layer is greater than a bottom area of the p-type semiconductor layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體元件</p>  
        <p type="p">100:基材結構</p>  
        <p type="p">108:半導體層</p>  
        <p type="p">110:源極結構</p>  
        <p type="p">111:源極電極</p>  
        <p type="p">112:源極穿孔</p>  
        <p type="p">120:汲極結構</p>  
        <p type="p">121:第一電極單元</p>  
        <p type="p">121a:p型半導體層</p>  
        <p type="p">121b,122a:金屬電極</p>  
        <p type="p">121c:第一汲極穿孔</p>  
        <p type="p">122:第二電極單元</p>  
        <p type="p">122b:第二汲極穿孔</p>  
        <p type="p">130:閘極結構</p>  
        <p type="p">131:閘極半導體</p>  
        <p type="p">132:閘極金屬電極</p>  
        <p type="p">A-A’,B-B’,C-C’:線段</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">G:間隔</p>  
        <p type="p">L1,L2:長度</p>  
        <p type="p">W1,W2:寬度</p>  
        <p type="p">X1,X2,X3:間距</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="366" publication-number="202614109"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614109.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614109</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136238</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>旋轉開關裝置</chinese-title>  
        <english-title>ROTARY SWITCH DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H01H19/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群光電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHICONY ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳璟忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政大</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖韋齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種旋轉開關裝置包括基座、第一電路板、第二電路板、旋轉板及旋鈕。第一電路板具有發射電極。第二電路板與第一電路板彼此保持間距而形成一夾層空間，第二電路板具有接收電極，且接收電極的位置對應於發射電極的位置。旋轉板可旋轉地設置於夾層空間內，旋轉板具有複數個導電部，多個導電部間隔排列設置且彼此互不接觸。旋鈕連接於旋轉板，旋鈕可相對於基座轉動，以同步帶動旋轉板相對於第一電路板與第二電路板旋轉，使發射電極、接收電極以及多個導電部之其中一者至少部分重疊，而使發射電極與接收電極間的電容產生變化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A rotary switch device includes a base, a first circuit board, a second circuit board, a rotating plate, and a knob. The first circuit board has an emitting electrode. The second circuit board and the first circuit board are spaced apart from each other to form a mezzanine space. The second circuit board has a receiving electrode, and the position of the receiving electrode corresponds to the position of the emitting electrode. The rotating plate is rotatably disposed in the mezzanine space. The rotating plate has a plurality of conductive portions. The plurality of conductive portions are disposed at intervals and do not contact each other. The knob is connected to the rotating plate, and the knob can rotate relative to the base to synchronously drive the rotating plate to rotate relative to the first circuit board and the second circuit board, so that the emitting electrode, the receiving electrode, and one of the conductive portions at least partially overlap, so as to cause a change in capacitance between the emitting electrode and the receiving electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:旋轉開關裝置</p>  
        <p type="p">10:基座</p>  
        <p type="p">12:底部</p>  
        <p type="p">13:止滑件</p>  
        <p type="p">20:第一電路板</p>  
        <p type="p">201:第一中空部</p>  
        <p type="p">21:第一側面</p>  
        <p type="p">TX:發射電極</p>  
        <p type="p">TX1:第一電極區</p>  
        <p type="p">TX2:第二電極區</p>  
        <p type="p">30:第二電路板</p>  
        <p type="p">301:第二中空部</p>  
        <p type="p">40:旋轉板</p>  
        <p type="p">401:第三中空部</p>  
        <p type="p">42:第二表面</p>  
        <p type="p">43:鏤空槽</p>  
        <p type="p">45:導電部</p>  
        <p type="p">46:旋轉座</p>  
        <p type="p">461:第一端</p>  
        <p type="p">462:第二端</p>  
        <p type="p">463:基板</p>  
        <p type="p">464:內表面</p>  
        <p type="p">465:凹槽</p>  
        <p type="p">50:旋鈕</p>  
        <p type="p">60:電路板定位組件</p>  
        <p type="p">61:第一定位板</p>  
        <p type="p">611:第一穿孔</p>  
        <p type="p">62:第二定位板</p>  
        <p type="p">63:間隔柱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="367" publication-number="202613791"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613791.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613791</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136240</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸控顯屏模組及顯屏模組</chinese-title>  
        <english-title>TOUCH DISPLAY MODULE AND DISPLAY MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">G06F3/044</main-classification>  
        <further-classification edition="202301120241230B">H10K59/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商宸美（廈門）光電有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TPK ADVANCED SOLUTIONS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄢仁源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, REN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓敬凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, CHING-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳嘉靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIA-JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">觸控顯屏模組包含具有塑料基板、第一金屬網格電極層及第二金屬網格電極層的觸控感測層及有機發光二極體顯示器。塑料基板的厚度為10微米至400微米，塑料基板具有不同方向的第一折射率及第二折射率，且第一折射率與第二折射率的差值為0至0.0001。第一金屬網格電極層設置於塑料基板的第一表面。第二金屬網格電極層設置於塑料基板的第二表面，且第二表面相對於第一表面。有機發光二極體顯示器設置於觸控感測層的一側，其中有機發光二極體顯示器的亮度峰值至少為390尼特。觸控顯屏模組經由黑階測試的暗態亮度為0.0001燭光/平方公尺至0.0005燭光/平方公尺。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A touch display module includes a touch layer and an organic light-emitting diode display. The touch sensor layer includes a plastic substrate, a first metal mesh electrode layer, and a second metal mesh electrode layer. A thickness of the plastic substrate is 10 μm to 400 μm. The plastic substrate has a first refractive index and a second refractive index in different directions, and a difference between the first refractive index and the second refractive index is 0 to 0.0001. The first metal mesh electrode layer is disposed on a first surface of the plastic substrate. The second metal mesh electrode layer is disposed on a second surface of the plastic substrate, in which the second surface is facing away from the first surface. The organic light-emitting diode display is disposed on one side of the touch layer, in which a peak brightness of the organic light-emitting diode display is at least 390 nits. A max black level luminance of the touch display module is 0.0001 cd/m &lt;sup&gt;2&lt;/sup&gt;to 0.0005 cd/m &lt;sup&gt;2&lt;/sup&gt;measured by black level testing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:觸控顯屏模組</p>  
        <p type="p">110:觸控感測層</p>  
        <p type="p">111:表面</p>  
        <p type="p">111a:第一表面</p>  
        <p type="p">111b:第二表面</p>  
        <p type="p">112:塑料基板</p>  
        <p type="p">114:電極層</p>  
        <p type="p">114a:第一電極層</p>  
        <p type="p">114b:第二電極層</p>  
        <p type="p">120:有機發光二極體顯示器</p>  
        <p type="p">130:遮光層</p>  
        <p type="p">150:光學膠層</p>  
        <p type="p">150a:第一光學膠層</p>  
        <p type="p">150b:第二光學膠層</p>  
        <p type="p">S1,S2:側</p>  
        <p type="p">B:亮態區</p>  
        <p type="p">D:暗態區</p>  
        <p type="p">H,H1:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="368" publication-number="202613407"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613407.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613407</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136241</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高壓氣體式水下儲能系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">F03G7/06</main-classification>  
        <further-classification edition="200601120241105B">F17C5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嘉凱能源科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIA KAI ENERGY TECHNOLOGY CO. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊文宙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WEIN-JOE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種高壓氣體式水下儲能系統，包括儲氣槽、高壓氣體來源、高壓氣體應用裝置及氣體輸送裝置。儲氣槽開設腔室及開口並放置在水底。氣體輸送裝置連接腔室、高壓氣體來源和高壓氣體應用裝置。高壓氣體來源提供高壓氣體，高壓氣體藉由氣體輸送裝置輸送至腔室中，腔室中的水受到高壓氣體的擠壓而通過開口往儲氣槽的外部排出，使得高壓氣體儲存在腔室中，且腔室的氣壓等於儲氣槽的外部的水壓。腔室中的高壓氣體藉由氣體輸送裝置輸送至高壓氣體應用裝置中。藉此，本發明能夠將高壓氣體儲存在水下隨時釋放其他各種用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:儲氣槽</p>  
        <p type="p">11:本體</p>  
        <p type="p">111:腔室</p>  
        <p type="p">112:開口</p>  
        <p type="p">12:支撐柱</p>  
        <p type="p">13:水流空間</p>  
        <p type="p">20:高壓氣體來源</p>  
        <p type="p">21:空氣壓縮機</p>  
        <p type="p">22:進氣管</p>  
        <p type="p">23:軸部</p>  
        <p type="p">24:驅動裝置</p>  
        <p type="p">30:高壓氣體應用裝置</p>  
        <p type="p">31:空氣輪機</p>  
        <p type="p">321:排氣管</p>  
        <p type="p">322:下游裝置</p>  
        <p type="p">33:軸部</p>  
        <p type="p">34:發電機</p>  
        <p type="p">40:氣體輸送裝置</p>  
        <p type="p">41:第一輸氣管</p>  
        <p type="p">42:第二輸氣管</p>  
        <p type="p">43:第三輸氣管</p>  
        <p type="p">44:第一閥體</p>  
        <p type="p">45:第二閥體</p>  
        <p type="p">46:逆止閥</p>  
        <p type="p">50:配重塊</p>  
        <p type="p">60:承載裝置</p>  
        <p type="p">61:容置槽</p>  
        <p type="p">70:錨定裝置</p>  
        <p type="p">71:固定部</p>  
        <p type="p">72:纜繩</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="369" publication-number="202612581"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612581.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612581</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136244</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以茶渣與檳榔梗屑之混合物為主原料之菇類培養基質，其製法及於菇類栽培之應用</chinese-title>  
        <english-title>MUSHROOM CULTURE MEDIUM BASED ON A MIXTURE OF TEA DREG AND BETEL NUT STALK, ITS PREPARING METHOD AND THE USE THEREOF IN MUSHROOM CULTIVATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241001B">A01G18/20</main-classification>  
        <further-classification edition="202001120241001B">C05G5/40</further-classification>  
        <further-classification edition="200601120241001B">C05F11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖訓章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, HSUN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡依庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡孟妍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, MENG-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃竑雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HONG-YA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>駱奕帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, I-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳啓東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖訓章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, HSUN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡依庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡孟妍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, MENG-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃竑雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HONG-YA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳修閘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種菇類培養基質，特徵在於係以一包含茶渣與檳榔梗屑之混合物為該基質的主原料，並含有一包含米糠、粉頭、玉米粉及石灰之輔料。本發明之菇類培養基質係以茶渣與檳榔梗屑之混合物(混合比例較佳為7:3)取代傳統太空包之木屑，做為主要的基質成分，其中之茶渣係茶葉沖泡完畢即可利用於製備基質材料，無需額外耗能進行乾燥。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a mushroom culture medium characterized by the use of a mixture of tea dreg and betel nut stalk as the main substrate material and an auxiliary ingredient comprising rice bran, flour, cornstarch and lime. The mushroom culture substrate of the present invention utilizes a mixture of tea dreg and betel nut stalk (preferably at a ratio of 7:3) to replace the wood shavings of a traditional space bag. The tea dreg is reused in making the substrate material after tea leaves have been brewed, and do not require additional energy for drying.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A.將筊白筍殼剪成小片，將黃豆渣的水分擠出</p>  
        <p type="p">B.將前述筊白筍殼小片、黃豆渣混合玉米澱粉及黏結劑</p>  
        <p type="p">C.將前述混合物塑型</p>  
        <p type="p">D.加熱乾燥定型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="370" publication-number="202613962"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613962.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613962</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136250</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天災風險量化與避險建議系統及其方法</chinese-title>  
        <english-title>NATURAL DISASTER RISK QUANTIFICATION AND HEDGING RECOMMENDATION SYSTEM AND METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250122B">G06Q50/16</main-classification>  
        <further-classification edition="202301120250122B">G06Q10/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安家百科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許永佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YUNG-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯明憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種天災風險量化與避險建議系統及其方法，旨在根據用戶所在建物的位置，提供量化的天災風險評估及具體避險建議。該系統包括中央處理器、房屋建築資料輸入介面、資料庫、及多個分析模組，如災害發生機率、災害衝擊分析、衝擊損失分析模組，並透過圖文呈現模組處理及報告生成模組輸出專屬報告。此外，資料庫包含多種天災相關歷史與模擬資料，如淹水深度、地震、土壤液化、坡地災害及氣候變遷數據，以及外部資料介接模組以擴展資料來源。藉此，解決現有災害模擬報告在理解和應用上的困難，並提升公眾對天災風險的認識及應對能力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides a system and method for quantifying natural disaster risk and offering hedging recommendations, aimed at providing quantitative risk assessments and specific hedging advice based on the location of the user's building. The system includes a central processor, a building data input interface, a database, and multiple analytical modules such as disaster occurrence probability, disaster impact analysis, and impact loss analysis modules. It also processes data through a visual presentation module and outputs a customized report via a report generation module. Additionally, the database contains various historical and simulated disaster-related data, including flood depth, earthquakes, soil liquefaction, landslide risks, and climate change data, along with an external data integration module to expand data sources. This addresses the difficulties in understanding and applying current disaster simulation reports and enhances public awareness and ability to respond to natural disaster risks.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:天災風險量化與避險建議系統</p>  
        <p type="p">10:中央處理器</p>  
        <p type="p">11:房屋建築資料輸入介面</p>  
        <p type="p">12:資料庫</p>  
        <p type="p">121:淹水深度模擬資料庫</p>  
        <p type="p">122:地震相關資料庫</p>  
        <p type="p">123:土壤液化資料庫</p>  
        <p type="p">124:坡地災害資料庫</p>  
        <p type="p">125:氣候變遷影響資料庫</p>  
        <p type="p">126:外部資料介接模組</p>  
        <p type="p">13:災害發生機率分析模組</p>  
        <p type="p">14:災害衝擊分析模組</p>  
        <p type="p">15:衝擊損失分析模組</p>  
        <p type="p">16:期望損失分析模組</p>  
        <p type="p">17:圖文呈現模組</p>  
        <p type="p">171:地圖</p>  
        <p type="p">172:分析文案</p>  
        <p type="p">173:分析圖表</p>  
        <p type="p">18:報告生成模組</p>  
        <p type="p">200:互動式電子裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="371" publication-number="202613838"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613838.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613838</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136254</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加權方法、數據分類方法、設備及介質</chinese-title>  
        <english-title>WEIGHTING METHOD, DATA CLASSIFICATION METHOD, DEVICE AND MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250102B">G06F16/20</main-classification>  
        <further-classification edition="201901120250102B">G06F16/28</further-classification>  
        <further-classification edition="201901120250102B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>疆域醫創科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGYU INNOVATIVE MEDICAL TECHNOLOGY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭　振鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUOK, CHAN-PANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MO</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種加權方法、數據分類方法、設備及介質。所述加權方法包括：對數據進行預設操作，得到多個線性加權值；對每個所述線性加權值進行歸一化處理，得到歸一加權值；其中，所述預設操作包括線性變換，所述數據包括多個元素。利用上述方法，能夠使得分類更加專注於數據中對分類影響較大的元素，以及能夠避免不同尺度干擾，從而能夠提高分類準確性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a weighting method , a data classification method, a device and a medium. The weighting method for includes: obtaining a plurality of linear weighting values by performing a preset operation on data, acquiring a normalized weighting value by performing a normalization processing on each of the plurality of linear weighting values, the preset operation including linear transformation, and the data including a plurality of elements. By utilizing the present application, the elements that have a greater impact on the classification can be focused, and the interference of different scales can be avoided, so that the classification accuracy can be improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S12:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="372" publication-number="202614575"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614575.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614575</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136255</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>數據分類方法、數據壓縮方法、設備及介質</chinese-title>  
        <english-title>METHOD FOR CLASSIFYING DATA, METHOD FOR COMPRESSING DATA, DEVICE AND MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">H03M7/30</main-classification>  
        <further-classification edition="200601120250102B">G06F17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>疆域醫創科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGYU INNOVATIVE MEDICAL TECHNOLOGY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭　振鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUOK, CHAN-PANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MO</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種數據分類方法、數據壓縮方法、設備及介質。所述數據分類方法包括：獲取時序數據，對所述時序數據進行壓縮運算，得到壓縮數據，對所述壓縮數據進行特徵提取運算，得到目標數據特徵，對所述目標數據特徵進行分類運算，得到數據類別。利用上述方法，能夠確保壓縮數據的時序性，從而能夠確保數據類別的分類準確性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a method for classifying data, a method for compressing data, a device and a medium. The method for classifying data includes: acquiring time series data, obtaining compressed data by performing a compression operation on the time series data, obtaining target data feature by performing a feature extraction operation on the compressed data, and acquiring a data category by performing a classification operation on the target data feature. By utilizing the present application, the timing of the compressed data can be ensured, so that the classification accuracy of data category can be ensured.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S21~S24:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="373" publication-number="202614576"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614576.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614576</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136258</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉助於電路複雜度降低進行同位位元計算以供進行錯誤更正之方法、錯誤更正電路以及使用錯誤更正電路之電路模組</chinese-title>  
        <english-title>METHOD FOR PERFORMING PARITY BIT CALCULATION WITH AID OF CIRCUIT COMPLEXITY REDUCTION FOR PERFORMING ERROR CORRECTION, AND ASSOCIATED APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H03M13/11</main-classification>  
        <further-classification edition="200601120250203B">H03M13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何柏緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, PO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供藉助於電路複雜度降低進行同位位元計算以供進行錯誤更正之方法以及相關設備。該方法可包含：於採用一預定錯誤更正碼之一錯誤更正電路中，配置對應於一預定碼字長度之複數個互斥或（簡稱XOR）運算電路中之一第一組XOR運算電路，而非該複數個XOR運算電路中之所有XOR運算電路，以供降低該錯誤更正電路之電路複雜度，其中該第一組XOR運算電路可為基於同位位元覆蓋降低來實現的一組優化的XOR運算電路；以及利用該第一組XOR運算電路進行該同位位元計算，以供進行對應於一較短碼字長度之錯誤更正，其中可達到較小XOR運算數及較短關鍵路徑長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for performing parity bit calculation with aid of circuit complexity reduction for performing error correction and associated apparatus are provided. The method may include: in an error correction circuit adopting a predetermined error correction code, configuring a first set of exclusive OR (XOR) operation circuits corresponding to a predetermined codeword length among a plurality of XOR operation circuits, rather than all XOR operation circuits among the plurality of XOR operation circuits, for reducing circuit complexity of the error correction circuit, where the first set of XOR operation circuits may be a set of optimized XOR operation circuits implemented based on parity bit coverage reduction; and utilizing the first set of XOR operation circuits to perform the parity bit calculation, for performing error correction corresponding to a shorter codeword length, where a smaller XOR operation count and a shorter critical path length can be reached.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S12:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="374" publication-number="202614004"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614004.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614004</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136262</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">G09F9/33</main-classification>  
        <further-classification edition="200601120241101B">G02B6/00</further-classification>  
        <further-classification edition="200601120241101B">G02B3/02</further-classification>  
        <further-classification edition="200601120241101B">G02B5/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃子芩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TZU-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包括多個顯示像素。各顯示像素包括第一顯示單元。第一顯示單元包括第一發光元件、色轉換層、第一濾光層以及第一光學結構。第一發光元件配置於顯示裝置的下基板的內表面上。色轉換層覆蓋第一發光元件。第一濾光層配置於顯示裝置的上基板的內表面上。第一光學結構具備折光能力。第一濾光層位於上基板以及第一光學結構之間。第一濾光層的入光面以及出光面不為平面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device including a plurality of display pixels. Each display pixel includes a first display unit. The first display unit includes a first light-emitting element, a color conversion layer, a first color filter layer and a first optical structure. The first light-emitting element is disposed on an inner surface of a lower substrate of the display device. The color conversion layer covers the first light-emitting element. The first color filter layer is disposed on an inner surface of an upper substrate of the display device. The first optical structure having refractive power. The first color filter layer is disposed between the upper substrate and the first optical structure. A light entrance surface and a light-emitting surface of the first color filter layer are not a plane.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1、2:顯示單元</p>  
        <p type="p">10:下基板</p>  
        <p type="p">20:上基板</p>  
        <p type="p">30:填充層</p>  
        <p type="p">40:緩衝層</p>  
        <p type="p">50:堤</p>  
        <p type="p">100:顯示裝置</p>  
        <p type="p">101、201:光學結構</p>  
        <p type="p">103、203:濾光層</p>  
        <p type="p">105:介質層</p>  
        <p type="p">107:色轉換層</p>  
        <p type="p">207:散射層</p>  
        <p type="p">L1、L2:發光元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="375" publication-number="202614422"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614422.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614422</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136263</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120240930B">H01L23/50</main-classification>  
        <further-classification edition="200601120240930B">H01L23/28</further-classification>  
        <further-classification edition="200601120240930B">H01L21/56</further-classification>  
        <further-classification edition="200601120240930B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樂瑞仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUEH, JUI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張砥中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TI-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置，包含基板、第一電路層、第一半導體晶粒、第二電路層以及多個第一導電元件。第一電路層設置於基板上且包含多個第一接觸墊。第一半導體晶粒設置於第一電路層上。第二電路層與第一半導體晶粒電性連接且包含多個第二接觸墊。第一導電元件設置於第一電路層與第二電路層之間，第一導電元件與第一接觸墊以及第二接觸墊電性連接，且第一導電元件包含鄰近於第一接觸墊的第一部分、鄰近於第二接觸墊的第二部分以及位於第一部分與第二部分之間的中間部分。再者，第一導電元件包含多個第一型導電元件以及多個第二型導電元件，第一型導電元件於中間部分具有最大寬度，且第二型導電元件於第一部分具有最大寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device is included. The electronic device includes a substrate, a first circuit layer, a first semiconductor die, a second circuit layer, and a plurality of first conductive elements. The first circuit layer is disposed on the substrate and includes a plurality of first pads. The first semiconductor die is disposed on the first circuit layer. The second circuit layer is electrically connected to the first semiconductor die and disposed between the first circuit layer and the first semiconductor die. The second circuit layer includes a plurality of second pads. The first conductive elements are disposed between the first circuit layer and the second circuit layer. Each of the first conductive elements is electrically connected to one of the first pads and one of the second pads and includes a first portion adjacent to one of the first pads, a second portion adjacent to one of the second pads, and a middle portion between the first portion and the second portion. The first conductive elements include a plurality of first-type conductive elements and a plurality of second-type conductive elements. Moreover, each of the first-type conductive elements has a maximum width at the middle portion and each of the second-type conductive elements has a maximum width at the first portion</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子裝置</p>  
        <p type="p">100:基板</p>  
        <p type="p">102:第一電路層</p>  
        <p type="p">110:第一接觸墊</p>  
        <p type="p">202:第二電路層</p>  
        <p type="p">204:第一半導體晶粒</p>  
        <p type="p">206:封裝層</p>  
        <p type="p">210:第二接觸墊</p>  
        <p type="p">300:第一導電元件</p>  
        <p type="p">300A:第一型導電元件</p>  
        <p type="p">300B:第二型導電元件</p>  
        <p type="p">A1、A2:區域</p>  
        <p type="p">R1:主要區</p>  
        <p type="p">R2:邊緣區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="376" publication-number="202612905"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612905.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612905</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136265</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用回收彈性材料製備之吸震結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B32B27/00</main-classification>  
        <further-classification edition="200601120241105B">B32B27/20</further-classification>  
        <further-classification edition="200601120241105B">B32B3/26</further-classification>  
        <further-classification edition="200601120241105B">B32B37/06</further-classification>  
        <further-classification edition="200601120241105B">B32B37/08</further-classification>  
        <further-classification edition="202201120241105B">B09B3/00</further-classification>  
        <further-classification edition="200601120241105B">F16F9/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡單綠能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMPLE GREEN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高振益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, CHEN-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高上傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, SHANG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃彥誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宇呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐吉弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, CHI-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種利用回收彈性材料製備之吸震結構，包含有相對之一第一層與一第二層，係分別以至少二種回收彈性材料混合後加熱至預定溫度以成型，且，該第一層與一第二層之間設有複數空間，各該空間係相互連通之開放型式；藉此，該第一層或第二層表面受外力衝擊時，可藉由該第一層與第二層之彈性及第一層與第二層之間各空間中空氣受壓流動之方式，產生吸震、緩衝效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">10:利用回收彈性材料製備之吸震結構</p>  
        <p type="p">12:第一層</p>  
        <p type="p">14:第二層</p>  
        <p type="p">22:空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="377" publication-number="202612755"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612755.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612755</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136266</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>適形貼合的鈦金屬貼片裝置</chinese-title>  
        <english-title>FORM-FITTING TITANIUM METAL PATCH DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241001B">A61N5/06</main-classification>  
        <further-classification edition="202401120241001B">A61F13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羽鈦有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIMAS TITAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝涵淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HAN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝涵婕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HAN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種適形貼合的鈦金屬貼片裝置，用來貼附於一人體的表面，其包括：一彈性載體，彈性載體具有一外表面，和一內表面，內表面能夠區分為至少一個貼片組合區域，和圍繞於彈性載體外週緣的黏貼區域；及多個貼片單元，排列設置於貼片組合區域內，每一個所述貼片單元為鈦金屬片或為鈦合金片，每一個貼片單元配置為具有多個直線狀的邊的幾何形狀，任一個貼片單元至少相鄰另一個貼片單元，並且相鄰的兩個貼片單元分別具有相鄰的兩個邊，相鄰的兩個邊具有相等長度且相互並排；彈性載體的黏貼區域能夠貼合於人體表面，而將多個所述貼片單元固定於所述人體表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a form-fitting titanium metal patch device for attaching to the surface of a human body. It includes: an elastic carrier. The elastic carrier has an outer surface and an inner surface. The inner surface can be distinguished as At least one patch combination area and an adhesive area surrounding the outer periphery of the elastic carrier; and a plurality of patch units arranged in an array in the patch combination area, each of the patch units being a titanium metal sheet or a titanium alloy Each patch unit is configured as a geometric shape with multiple straight descending sides. Any patch unit is adjacent to at least another patch unit, and the two adjacent patch units each have two adjacent Sides, two adjacent sides have equal lengths and are arranged side by side; the adhesive area of the elastic carrier can fit on the surface of the human body, and a plurality of the patch units are fixed on the surface of the human body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鈦金屬貼片裝置</p>  
        <p type="p">100:彈性載體</p>  
        <p type="p">110:外表面</p>  
        <p type="p">120:內表面</p>  
        <p type="p">130:貼片組合區域</p>  
        <p type="p">140:黏貼區域</p>  
        <p type="p">200:貼片單元</p>  
        <p type="p">210:邊</p>  
        <p type="p">G:鄰接間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="378" publication-number="202614474"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614474.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614474</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136270</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>訊號抑制裝置</chinese-title>  
        <english-title>SIGNAL SUPPRESSION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H01P1/212</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴郁書</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, YU SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭偉晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種訊號抑制裝置，包含一基板以及至少一訊號抑制結構。至少一訊號抑制結構包含一外訊號抑制體以及四內訊號抑制體。外訊號抑制體設置於基板之周緣。四內訊號抑制體設置於基板，且四內訊號抑制體分別連接於外訊號抑制體的四角落。四內訊號抑制體分別朝基板的中心延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A signal suppression device includes a substrate and at least one signal suppression structure. The at least one signal suppression structure includes a peripheral signal suppressor and four extended signal suppressors. The peripheral signal suppressor is disposed on the periphery of the substrate. The four extended signal suppressors are disposed on the substrate, and the four extended signal suppressors are connected to the four corners of the peripheral signal suppressor, respectively. The four extended signal suppressors extend toward the center of the substrate, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:訊號抑制裝置</p>  
        <p type="p">20:基板</p>  
        <p type="p">30:訊號抑制結構</p>  
        <p type="p">31:外訊號抑制體</p>  
        <p type="p">32:內訊號抑制體</p>  
        <p type="p">321:矩形部</p>  
        <p type="p">322:塔形部</p>  
        <p type="p">L1:長度</p>  
        <p type="p">W1:寬度</p>  
        <p type="p">T:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="379" publication-number="202614475"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614475.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614475</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136271</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>訊號抑制裝置</chinese-title>  
        <english-title>SIGNAL SUPPRESSION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241206B">H01P1/212</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PO-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴郁書</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, YU SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭偉晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種訊號抑制裝置，包含一基板以及至少一訊號抑制結構。至少一訊號抑制結構設置於基板，並包含一十字形訊號抑制體以及四L形訊號抑制體。十字形訊號抑制體包含一中心部以及四分支部。中心部呈矩形，且四分支部分別連接於中心部之相異側。四分支部分隔四L形訊號抑制體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A signal suppression device includes a substrate and at least one signal suppression structure. The at least one signal suppression structure is disposed on the substrate, and includes a cross-shaped signal suppressor and four L-shaped signal suppressors. The cross-shaped signal suppressor includes a central portion and four branch portions. The central part is rectangular, and the four branch portions are connected to different sides of the central portion. The four branch portions separate the four L-shaped signal suppressors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:訊號抑制裝置</p>  
        <p type="p">20:基板</p>  
        <p type="p">30:訊號抑制結構</p>  
        <p type="p">31:十字形訊號抑制體</p>  
        <p type="p">311:中心部</p>  
        <p type="p">312:分支部</p>  
        <p type="p">32:L形訊號抑制體</p>  
        <p type="p">321:第一延伸段</p>  
        <p type="p">322:第二延伸段</p>  
        <p type="p">L1:長度</p>  
        <p type="p">W1:寬度</p>  
        <p type="p">T:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="380" publication-number="202612984"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612984.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612984</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136272</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙自旋雷射無人機導引降落系統及方法</chinese-title>  
        <english-title>DUAL SPINNING LASER-BASED UAV POSITIONING AND LANDING SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">B64D45/04</main-classification>  
        <further-classification edition="200601120241029B">G01S13/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許健平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEU, JANG-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭永清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YUNG-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雙自旋雷射無人機導引降落系統，包括第一雷射模組、第一旋轉模組、第二雷射模組、第二旋轉模組、訊號收發器、控制器以及基板。第一雷射模組用以提供繞第一軸旋轉發出的第一光束。第一旋轉模組用以帶動第一雷射模組繞垂直於第一軸的旋轉軸旋轉，使第一光束在空間中掃描。第二雷射模組用以提供繞第二軸旋轉發出的第二光束。第二旋轉模組用以帶動第二雷射模組繞垂直於第二軸的旋轉軸旋轉，使第二光束在空間中掃描。在第一光束先投射在無人機上時，無人機發出訊號。在訊號收發器接收訊號後，控制器取得第一夾角。在第二光束再投射在無人機上時，無人機發出訊號。在訊號收發器接收訊號後，控制器取得第二夾角且計算相對位置，並控制訊號收發器將相對位置訊號傳送至無人機。一種雙自旋雷射無人機導引降落方法亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dual spinning laser-based UAV positioning and landing system includes a first laser module, a first rotation module, a second laser module, a second rotation module, a signal transceiver, a controller and a substrate. The first laser module is configured to provide a first beam emitted by rotating around a first axis. The first rotation module is configured to drive the first laser module to rotate around a rotation axis perpendicular to the first axis, so that the first beam scans in a space. The second laser module is configured to provide a second beam emitted by rotating around a second axis. The second rotation module is configured to drive the second laser module to rotate around a rotation axis perpendicular to the second axis, so that the second beam scans in the space. When the first beam is first projected on a UAV, the UAV emits a signal. After the signal transceiver receives the signal, the controller obtains a first included angle. When the second beam is then projected on the UAV, the UAV emits the signal. After the signal transceiver receives the signal, the controller obtains a second included angle and calculates a relative position, and controls the signal transceiver to transmit a relative position signal to the UAV. A dual spinning laser-based UAV positioning and landing method is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:雙自旋雷射無人機導引降落系統</p>  
        <p type="p">20:基板</p>  
        <p type="p">100:第一雷射模組</p>  
        <p type="p">200:第一旋轉模組</p>  
        <p type="p">300:第二雷射模組</p>  
        <p type="p">400:第二旋轉模組</p>  
        <p type="p">500:光感測器</p>  
        <p type="p">600:顯示模組</p>  
        <p type="p">700:充電模組</p>  
        <p type="p">800:位置調整模組</p>  
        <p type="p">LP:降落位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="381" publication-number="202613768"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613768.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613768</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136273</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>筆記型電腦及樞接蓋體</chinese-title>  
        <english-title>NOTEBOOK COMPUTER AND HINGE CAP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241210B">G06F1/16</main-classification>  
        <further-classification edition="200601120241210B">F16C11/04</further-classification>  
        <further-classification edition="200601120241210B">H05K7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英業達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INVENTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡明澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, MIG-ZE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳家震</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIA-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種筆記型電腦，包含一主機、一顯示器、至少一樞接件以及一樞接蓋體。主機具有一導引環槽。主機與顯示器透過至少一樞接件相樞接，以令顯示器可相對主機轉動。樞接蓋體包含一本體部以及一滑動凸部。本體部穿過主機並可拆卸地連接於顯示器。本體部覆蓋至少一樞接件。滑動凸部連接於本體部。本體部將滑動凸部圍繞於內。滑動凸部可拆卸地設置於導引環槽，並可相對導引環槽滑動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A notebook computer includes a host, a display, at least one hinge and a hinge cap. The host has a guiding ring recess. The host and the display are pivotally connected via the at least one hinge, so that the display can rotate relative to the host. The hinge cap includes a body portion and a sliding portion. The body portion is disposed through the host, and is detachably connected to the display. The body portion covers the at least one hinge. The sliding portion is connected to the body portion. The body portion surrounds the sliding portion. The sliding portion is detachably disposed in the guiding ring recess, and can slide relative to the guiding ring recess.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:筆記型電腦</p>  
        <p type="p">11:主機</p>  
        <p type="p">111:導引環槽</p>  
        <p type="p">12:顯示器</p>  
        <p type="p">14:樞接蓋體</p>  
        <p type="p">141:本體部</p>  
        <p type="p">143:滑動凸部</p>  
        <p type="p">1431:滑動塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="382" publication-number="202613636"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613636.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613636</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136274</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像鏡頭</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241125B">G02B7/02</main-classification>  
        <further-classification edition="200601120241125B">G02B9/62</further-classification>  
        <further-classification edition="200601120241125B">G02B11/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佳凌科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CALIN TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊尚儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉沁瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像鏡頭，沿著一光軸從一物側至一像側依序包括有一第一鏡群、一光圈及一第二鏡群。第一鏡群由物側至像側沿光軸排列之一第一透鏡、一第二透鏡以及一第三透鏡所構成，該第一透鏡至該第三透鏡的屈折力排列為負負正；第二鏡群由物側至像側沿光軸排列之一第四透鏡、一第五透鏡，以及一第六透鏡所構成，該第四透鏡至該第六透鏡的屈折力排列為正負正，上述六片透鏡之間存在間隙而非相互膠合，藉由該光學成像鏡頭的透鏡排列，以滿足-3≦fg1/fg2≦-1的條件，fg1為該第一鏡群的組合焦距，fg2為該第二鏡群的組合焦距，進而實現良好的成像品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學成像鏡頭</p>  
        <p type="p">G1:第一鏡群</p>  
        <p type="p">G2:第二鏡群</p>  
        <p type="p">L1:第一透鏡</p>  
        <p type="p">L2:第二透鏡</p>  
        <p type="p">L3:第三透鏡</p>  
        <p type="p">L4:第四透鏡</p>  
        <p type="p">L5:第五透鏡</p>  
        <p type="p">L6:第六透鏡</p>  
        <p type="p">L7:紅外線濾光片</p>  
        <p type="p">Im:成像面</p>  
        <p type="p">S7:光圈</p>  
        <p type="p">Z:光軸</p>  
        <p type="p">S1,S3,S5,S8,S10,S12,S14:物側面</p>  
        <p type="p">S2,S4,S6,S0,S11,S13,S15:像側面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="383" publication-number="202614763"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614763.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614763</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136275</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非揮發性記憶體結構</chinese-title>  
        <english-title>NON-VOLATILE MEMORY STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241101B">H10B41/30</main-classification>  
        <further-classification edition="202301120241101B">H10B41/60</further-classification>  
        <further-classification edition="202301120241101B">H10B43/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王子嵩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZIH-SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種非揮發性記憶體結構，包括基底、閘介電層與浮置閘極結構。閘介電層位在基底上。浮置閘極結構位在閘介電層上。浮置閘極結構包括緩衝多晶矽層、碳摻雜多晶矽層、摻雜多晶矽層、第一氮化物層與第一氧化物層。緩衝多晶矽層位在閘介電層上。碳摻雜多晶矽層位在緩衝多晶矽層上。摻雜多晶矽層位在碳摻雜多晶矽層上。第一氮化物層位在緩衝多晶矽層與閘介電層之間。第一氧化物層位在摻雜多晶矽層與碳摻雜多晶矽層之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A non-volatile memory structure including a substrate, a gate dielectric layer, and a floating gate structure is provided. The gate dielectric layer is located on the substrate. The floating gate structure is located on the gate dielectric layer. The floating gate structure includes a buffer polysilicon layer, a carbon-doped polysilicon layer, a doped polysilicon layer, a first nitride layer, and a first oxide layer. The buffer polysilicon layer is located on the gate dielectric layer. The carbon-doped polysilicon layer is located on the buffer polysilicon layer. The doped polysilicon layer is located on the carbon-doped polysilicon layer. The first nitride layer is located between the buffer polysilicon layer and the gate dielectric layer. The first oxide layer is located between the doped polysilicon layer and the carbon-doped polysilicon layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:非揮發性記憶體結構</p>  
        <p type="p">100:基底</p>  
        <p type="p">102:閘介電層</p>  
        <p type="p">104:浮置閘極結構</p>  
        <p type="p">106:隔離結構</p>  
        <p type="p">108:緩衝多晶矽層</p>  
        <p type="p">110:碳摻雜多晶矽層</p>  
        <p type="p">112:摻雜多晶矽層</p>  
        <p type="p">114,122,126,130:氮化物層</p>  
        <p type="p">116,124,128:氧化物層</p>  
        <p type="p">118:控制閘極</p>  
        <p type="p">120:介電層結構</p>  
        <p type="p">AA:主動區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="384" publication-number="202614692"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614692.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614692</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136277</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱電路板的製造方法</chinese-title>  
        <english-title>METHOD FOR PRODUCING A HEAT DISSIPATION CIRCUIT BOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241030B">H05K3/46</main-classification>  
        <further-classification edition="200601120241030B">H05K3/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>健鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRIPOD TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳永論</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNG-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桂華榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUI, HUA-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種散熱電路板的製造方法，其包含一前置步驟、一預切步驟、一組合步驟及一壓合步驟。於所述前置步驟中，提供一第一內層電路板及一第二內層電路板。於所述預切步驟中，切割以形成貫穿所述第一內層電路板的一通孔。於所述組合步驟中，於所述第二內層電路板塗佈一聚丙烯樹脂，將所述第一內層電路板設置於所述聚丙烯樹脂，並且將一散熱銅塊通過所述通孔設置於所述聚丙烯樹脂。於所述壓合步驟中，對所述第一內層電路板、所述第二內層電路板、所述聚丙烯樹脂及所述散熱銅塊進行壓合，以形成一散熱電路板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for producing a heat dissipation circuit board. The method for producing the heat dissipation circuit board includes a preparing process, a pre-cutting process, an assembling process, and a laminating process. In a preparing process, at least two inner circuit boards respectively defined as a first inner circuit board and a second inner circuit board are provided. In the pre-cutting process, the first inner circuit board is cut to form a thru-hole penetrating through the first inner circuit board. In the assembling process, a surface of the second inner circuit board is coated with a polypropylene resin, the first inner circuit board is disposed onto the polypropylene resin, and a heat dissipation copper block is disposed onto the polypropylene resin through the thru-hole. In the laminating process, the first inner circuit board, the second inner circuit board, the polypropylene resin, and the heat dissipation copper block are laminated to form a heat dissipation circuit board.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110:前置步驟</p>  
        <p type="p">S120:預切步驟</p>  
        <p type="p">S130:組合步驟</p>  
        <p type="p">S140:壓合步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="385" publication-number="202612697"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612697.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612697</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136281</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>活性物質用於製備促進脂肪代謝之組合物的用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">A61K31/495</main-classification>  
        <further-classification edition="200601120250501B">A61K31/41</further-classification>  
        <further-classification edition="200601120250501B">A61K31/435</further-classification>  
        <further-classification edition="200601120250501B">A61K31/40</further-classification>  
        <further-classification edition="200601120250501B">A61K31/185</further-classification>  
        <further-classification edition="200601120250501B">A61K38/04</further-classification>  
        <further-classification edition="200601120250501B">A61K47/36</further-classification>  
        <further-classification edition="200601120250501B">A61P3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林于婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林于婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種活性物質用於製備促進脂肪代謝之組合物的用途，其中該組合物包含具有多層包覆結構的一微粒結構，該微粒結構包括:一活性顆粒，其包括一核心以及形成於該核心的外表面上的一內殼層，其中該核心包含一或多種所述活性物質，所述活性物質是選自於由下列所構成之群組:咖啡因、吡咯並喹啉醌、萃取物、水解物、蛋白質、胜肽、胺基酸，以及它們的組合，該內殼層包含有一多醣；以及一外殼層，其包覆該活性顆粒，其中該外殼層包含有一乳化劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="386" publication-number="202613537"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613537.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613537</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136305</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>X射線量測系統及複合式半導體檢測系統</chinese-title>  
        <english-title>X-RAY MEASURMENT SYSTEM AND COMPOSITE SEMICONDUCTOR INSPECTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250328B">G01N23/20</main-classification>  
        <further-classification edition="200601120250328B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈視科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐陽宇彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AU YONG, YU-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林家佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓宗憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, TSUNG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉軍廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHUN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何柏青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, PO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳柏蒼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PO-TSANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種X射線量測系統及複合式半導體檢測系統。X射線量測系統包括多軸樣品載台、X射線產生器、X射線光學元件組、X射線偵測器及處理裝置。X射線產生器包括電子束產生器、電磁透鏡組、X射線靶材及真空腔體。X射線靶材接收經聚焦的入射電子束並產生測量X射線束。X射線靶材包括散熱基材及分散嵌入散熱基材的多個激發靶材。X射線光學元件組將測量X射線束引導至待測樣品。X射線偵測器用於接收X射線待測訊號，產生X射線圖譜資訊。處理裝置根據X射線圖譜資訊執行擬合分析程序，以取得待測樣品的結構參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An X-ray measurement system and a composite semiconductor inspection system are provided. The X-ray measurement system includes a multi-axis sample stage, an X-ray generator, an X-ray optical component group, an X-ray detector and a processing device. The X-ray generator includes an electron beam generator, an electromagnetic lens group, an X-ray target material and a vacuum cavity. The X-ray target material receives a focused incident electron beam and generates a measuring X-ray beam. The X-ray target material includes a heat dissipation base material and a plurality of excitation target materials dispersedly embedded in the heat dissipation base material. The X-ray optical component group guides the measuring X-ray beam to the sample to be measured. The X-ray detector receives the X-ray signal to be measured and generates X-ray spectrum information. The processing device executes a fitting analysis process based on the X-ray spectrum information to obtain structural parameters of the sample to be tested.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:X射線量測系統</p>  
        <p type="p">10:多軸樣品載台</p>  
        <p type="p">12:X射線產生器</p>  
        <p type="p">120:電子束產生器</p>  
        <p type="p">122:電磁透鏡組</p>  
        <p type="p">123:靶材作動裝置</p>  
        <p type="p">124:X射線靶材</p>  
        <p type="p">126:真空腔體</p>  
        <p type="p">14:X射線光學元件組</p>  
        <p type="p">16:X射線偵測器</p>  
        <p type="p">SP:待測樣品</p>  
        <p type="p">Lx:測量X射線束</p>  
        <p type="p">Lx’:X射線待測訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="387" publication-number="202612906"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612906.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612906</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136308</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>再生聚酯複合織物及再生聚酯織物</chinese-title>  
        <english-title>RECYCLED POLYESTER COMPOSITED FABRIC AND RECYCLED POLYESTER FABRIC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B32B27/12</main-classification>  
        <further-classification edition="200601120241105B">B32B27/36</further-classification>  
        <further-classification edition="200601120241105B">B32B5/02</further-classification>  
        <further-classification edition="200601120241105B">B32B7/12</further-classification>  
        <further-classification edition="200601120241105B">B29B17/00</further-classification>  
        <further-classification edition="202201120241105B">B09B3/00</further-classification>  
        <further-classification edition="200601120241105B">D01F6/92</further-classification>  
        <further-classification edition="200601120241105B">D01F8/14</further-classification>  
        <further-classification edition="200601120241105B">D02G3/02</further-classification>  
        <further-classification edition="202101120241105B">D03D15/283</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明基材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENQ MATERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏翊展</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, YI-CHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇順良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, SHUN LIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YA-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游淞仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, SUNG-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡冠彣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種再生聚酯複合織物，其包含：一外層織物，其係一再生聚酯織物，其包含複數條紗線彼此交錯編織，其中該些紗線包含：3%至55%間自離型膜回收的第一再生聚乙烯對苯二甲酸酯；以及45%至97%間自寶特瓶回收的第二再生聚乙烯對苯二甲酸酯；一內層織物；及一透氣膜，該透氣膜位在該外層織物與該內層織物之間，其中，該透氣膜乃藉由一第一接著層及一第二接著層分別與該外層織物以及該內層織物結合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A recycled polyester composited fabric is disclosed, which comprises a outer fabric, which is a recycled polyester fabric by interweaving multiple yarns, wherein the yarns comprise 3 % to 55 % of first recycled polyethylene terephthalate obtained from recycled release film and 45 % to 97 % of second recycled polyethylene terephthalate obtained from recycled PET bottle; an inner fabric; and a breathable membrane disposed between the outer fabric and the inner fabric, wherein the breathable membrane is bonded to the outer fabric and the inner fabric by a first adhesive layer and a second adhesive layer, respectively.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="388" publication-number="202614580"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614580.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614580</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136312</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有隔離串接電容的數位隔離器電路</chinese-title>  
        <english-title>DIGITAL ISOLATOR CIRCUITRY WITH SERIALLY CONNECTED ISOLATION CAPACITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250528B">H04B1/44</main-classification>  
        <further-classification edition="202401120250528B">H04B5/75</further-classification>  
        <further-classification edition="200601120250528B">H01L23/52</further-classification>  
        <further-classification edition="200601120250528B">H03K17/689</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晶焱科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMAZING MICROELECTRONIC CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李冠舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, GUAN-SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有隔離串接電容的數位隔離器電路，包括第一集成電路區與第二集成電路區，第一集成電路區中具有第一收發器電路與複數個形成串接的高壓隔離電容，第二集成電路區中具有第二收發器電路與複數個形成串接的高壓隔離電容，一金屬打線係接合於第一、第二集成電路區之高壓隔離電容之間，而並未與該第一、第二收發器電路電耦接的高壓隔離電容形成接觸。基於本發明所公開的數位隔離器電路具有多個串接的隔離電容，能有效減緩金屬打線接合的硬力對介電層的損傷，提高整體良率，確保元件的耐壓能力，並對於封裝打線的環境具有更高的環境耐受度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A digital isolator circuitry with serially connected isolation capacitors is provided, comprising a first integrated circuit and a second integrated circuit. A first transceiver and a plurality of serially connected HV isolation capacitors are configured in the first integrated circuit. A second transceiver and a plurality of serially connected HV isolation capacitors are configured in the second integrated circuit. A wire bonding is connected between the HV isolation capacitors in the first and second integrated circuit, but not in contact with the HV isolation capacitors connected to the first and second transceivers. Since the proposed digital isolator circuitry is characterized by having serially connected isolation capacitors, damages to the dielectric layer caused by the metal wire bonding can be suppressed, enhancing the entire yield, ensuring withstanding voltages and thus having higher tolerance to the wiring encapsulation environment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:具有隔離串接電容的數位隔離器電路</p>  
        <p type="p">211:第一隔離屏障</p>  
        <p type="p">212:第二隔離屏障</p>  
        <p type="p">C11、C12:第一隔離電容</p>  
        <p type="p">C21、C22:第二隔離電容</p>  
        <p type="p">C31、C32:第三隔離電容</p>  
        <p type="p">C41、C42:第四隔離電容</p>  
        <p type="p">M1:第一金屬打線</p>  
        <p type="p">M2:第二金屬打線</p>  
        <p type="p">DI:資料輸入訊號</p>  
        <p type="p">RO:資料輸出訊號</p>  
        <p type="p">CHIP1:第一集成電路區</p>  
        <p type="p">CHIP2:第二集成電路區</p>  
        <p type="p">V&lt;sub&gt;ss1&lt;/sub&gt;:第一接地電壓</p>  
        <p type="p">V&lt;sub&gt;ss2&lt;/sub&gt;:第二接地電壓</p>  
        <p type="p">TR1:第一收發器電路</p>  
        <p type="p">TR2:第二收發器電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="389" publication-number="202613786"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613786.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613786</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136315</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具觸控手勢應用功能的電腦裝置及應用於其上的觸控手勢應用方法</chinese-title>  
        <english-title>COMPUTER DEVICE WITH TOUCH GESTURE APPLICATION FUNCTION AND TOUCH GESTURE APPLICATION METHOD APPLIED THERETO</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">G06F3/041</main-classification>  
        <further-classification edition="201301120250203B">G06F3/0354</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致伸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRIMAX ELECTRONICS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志惟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝杰紘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIEH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹偉平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, WEI-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃韋強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種具觸控手勢應用功能的電腦裝置及應用於其上的觸控手勢應用方法。該電腦裝置具有一力量觸控板、一處理模組和一螢幕。該電腦裝置存有一資料庫和多個應用程式，該資料庫存有多個預設手勢圖案。每一該預設手勢圖案對應至該些應用程式之其一。該方法包含步驟：由使用者以一啟動方式對力量觸控板輸入，以使力量觸控板進入一人工智能應用狀態，並於螢幕顯示一提示面板；由使用者以一第一手勢對力量觸控板輸入，並由處理模組辨識；以及當第一手勢相應於該些預設手勢圖案之其一時，由處理模組執行該預設手勢圖案所對應的應用程式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A computer device with touch gesture application function and a touch gesture application method applied thereto are provided. The computer device includes a force touch pad, a processing module and a screen. The computer device stores a database and a plurality of application programs, and the database stores a plurality of preset gesture patterns. Each of the preset gesture patterns corresponds to one of the application programs. The method includes the following steps. Firstly, the user inputs to the force touch pad in a start up manner, so that the force touch pad enters an artificial intelligence application state and displays a prompt panel on the screen. Then, the user inputs to the force touch pad in a first gesture, and a input result is recognized by the processing module. Afterwards, when the first gesture corresponds to one of the preset gesture patterns, the processing module executes the application program corresponding to the preset gesture pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:提示面板</p>  
        <p type="p">200:提示區域</p>  
        <p type="p">21~24:提示圖符</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="390" publication-number="202613042"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613042.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613042</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136326</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>礦質水生產系統與方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241104B">C02F1/52</main-classification>  
        <further-classification edition="202301120241104B">C02F1/68</further-classification>  
        <further-classification edition="200601120241104B">B01J19/18</further-classification>  
        <further-classification edition="200601120241104B">B01D21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隆銳有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAUREL ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭振華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉箐茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種礦質水生產系統，其具有礦質水生產槽與磨石裝置，而礦質水生產槽具有槽體、攪拌裝置與汲水閥。槽體具有內部容置空間，其中槽體用於接收逆滲透濾淨煮沸水與石粉，並將接收的逆滲透濾淨煮沸水與石粉儲存於內部容置空間。攪拌裝置配置於槽體的內部容置空間，用於對內部容置空間中的逆滲透濾淨煮沸水與石粉攪拌一段第一特定時間，以產生礦質水。汲水閥設置於槽體，並用於在礦質水被靜置沉澱一段第二特定時間後，被開啟以取出礦質水。磨石裝置設置於礦質水生產槽之外，用於對岩石進行磨石，以產生石粉給槽體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:槽體</p>  
        <p type="p">111:內部容置空間</p>  
        <p type="p">12:攪拌裝置</p>  
        <p type="p">121:驅動電機</p>  
        <p type="p">122:攪拌軸體</p>  
        <p type="p">123:攪拌葉片</p>  
        <p type="p">14:汲水閥</p>  
        <p type="p">15:入料閥</p>  
        <p type="p">16:入水閥</p>  
        <p type="p">18:槽底閥</p>  
        <p type="p">RP:石粉</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="391" publication-number="202613831"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613831.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613831</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136327</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>模組式配線整合裝置</chinese-title>  
        <english-title>MODULAR WIRING INTEGRATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">G06F13/40</main-classification>  
        <further-classification edition="200601120241104B">H01R11/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辰銪科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN-YO TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃伯勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉箐茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種模組式配線整合裝置包括主線路板、終端接口、終端排線、邏輯控制器接口及邏輯控制器排線。終端接口插設於主線路板上。終端排線相對兩端分別具有第一插拔單元以及第二插拔單元。第一插拔單元插接至終端接口。終端接口藉由終端排線的插接電性連接至終端部件。邏輯控制器接口插設於主線路板上。邏輯控制器排線相對兩端分別具有第三插拔單元以及第四插拔單元。第三插拔單元插接至邏輯控制器接口。邏輯控制器接口藉由邏輯控制器排線的插接電性連接至可程式邏輯控制器。模組式配線整合裝置可傳遞終端部件與可程式邏輯控制器之間的訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:模組式配線整合裝置</p>  
        <p type="p">110:主線路板</p>  
        <p type="p">120:終端接口</p>  
        <p type="p">130:終端排線</p>  
        <p type="p">132:第一插拔單元</p>  
        <p type="p">134:第二插拔單元</p>  
        <p type="p">140:終端接座</p>  
        <p type="p">142:終端接槽</p>  
        <p type="p">144:終端接腳</p>  
        <p type="p">150:邏輯控制器接口</p>  
        <p type="p">160:邏輯控制器排線</p>  
        <p type="p">162:第三插拔單元</p>  
        <p type="p">164:第四插拔單元</p>  
        <p type="p">170:邏輯控制器接座</p>  
        <p type="p">172:邏輯控制器接槽</p>  
        <p type="p">174:邏輯控制器接腳</p>  
        <p type="p">200:終端部件</p>  
        <p type="p">210:終端座體</p>  
        <p type="p">300:可程式邏輯控制器</p>  
        <p type="p">310:控制器座體</p>  
        <p type="p">A:安全繼電器</p>  
        <p type="p">B:保險絲</p>  
        <p type="p">C:燈號控制器</p>  
        <p type="p">D:切換開關</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="392" publication-number="202613318"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613318.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613318</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136338</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢測屈公病毒及或茲卡病毒的套組及方法及三股核酸探針</chinese-title>  
        <english-title>KIT AND METHOD FOR DETECTING CHIKUNGUNYA VIRUS AND OR ZIKA VIRUS AND TRIPLEX FORMING OLIGONUCLEOTIDE PROBE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250501B">C12Q1/6888</main-classification>  
        <further-classification edition="200601120250501B">C12Q1/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張崴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周柏豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, PO-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋政達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, JHENG-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　子翃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOH, ZEE-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡昆男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, KUN-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱全芊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIOU, CHIUAN-CHIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種檢測屈公病毒的套組及方法，包含引子組合物，其包含外部引子對、內部引子對以及環狀引子對。外部引子對包含順向外部引子與逆向外部引子，內部引子對包含順向內部引子與逆向內部引子，環狀引子對包含順向環狀引子與逆向環狀引子。另提供一種多重檢測屈公病毒及茲卡病毒的套組及方法，以達成快速且可靠的核酸檢測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a kit and a method for detecting chikungunya virus, including a primer composition, which includes an outer primer pair, an inner primer pair and a circular primer pair. The outer primer pair includes a forward outer primer and a reverse outer primer, then inner primer pair includes a forward inner primer and a reverse inner primer, and the loop primer pair includes a forward loop primer and a reverse loop primer. It also provides a multiplex detection kit and method for chikungunya virus and Zika virus to achieve rapid and reliable nucleic acid detection.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="393" publication-number="202612799"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612799.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612799</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136340</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>旋風噴頭</chinese-title>  
        <english-title>CYCLONE NOZZLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">B08B5/02</main-classification>  
        <further-classification edition="201801120241029B">B05B15/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鉦生股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JENG SHENG CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣國欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, KUO-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種旋風噴頭，其包括：一罩管、一噴氣組件及至少一吸入孔。該罩管圍構有相連通之一內部空間、一第一端口及一第二端口；該噴氣組件自該第一端口穿入該內部空間，該噴氣組件包含有一噴氣軟管及一輸氣單元，該噴氣軟管之一端連接該輸氣單元、另端為自由端，於該噴氣軟管之另端開設有一位於該內部空間之出氣口；該至少一吸入孔貫設於該罩管且介於該出氣口與該第二端口之間；其中，由該出氣口噴出的氣體朝向該第二端口移動過程中會流經該至少一吸入孔，使得位於該罩管外之氣體會因壓力差由該至少一吸入孔被吸入該內部空間而一同由該第二端口噴出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to a cyclone nozzle, which includes: a cover tube, an air jet component, and at least one intake hole. The cover tube forms an internal space that is interconnected, a first port, and a second port. The air jet component extends into the internal space from the first port. The air jet component includes an air hose and an air supply unit. One end of the air hose is connected to the air supply unit, and the other end is a free end. An air outlet is located at the free end of the air hose within the internal space. The at least one intake hole is formed on the cover tube and is positioned between the air outlet and the second port. When air is ejected from the air outlet and moves toward the second port, it flows through the at least one intake hole, causing the air outside the cover tube to be drawn into the internal space due to the pressure difference, and then ejected together from the second port.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:罩管</p>  
        <p type="p">22:第二端口</p>  
        <p type="p">23:內部空間</p>  
        <p type="p">41:第一錐管段</p>  
        <p type="p">42:轉折管段</p>  
        <p type="p">43:第二錐管段</p>  
        <p type="p">44:中心線</p>  
        <p type="p">5:噴氣組件</p>  
        <p type="p">51:噴氣軟管</p>  
        <p type="p">511:出氣口</p>  
        <p type="p">6:吸入孔</p>  
        <p type="p">8:管套</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="394" publication-number="202612608"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612608.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612608</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136341</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膏劑外殼及膏劑</chinese-title>  
        <english-title>PASTE SHELL AND PASTE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">A45D33/28</main-classification>  
        <further-classification edition="200601120241029B">A45D40/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>棨美有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIME BEAUTY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　重棨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林松柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種膏劑外殼，包括殼體及膏體移動件。殼體內部具有通道。通道於一側設有第一螺接部。膏體移動件套接於通道，並具有第二螺接部以及相對的操作部。操作部露出於通道外。第二螺接部位於通道內並螺接第一螺接部，並使膏體移動件相對於殼體轉動時同時於通道內移動。亦提供一種膏劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A paste shell includes a shell and a paste moving member. The shell has a channel inside. The channel is provided with a first screw connection part on one side. The paste moving member is sleeved in the channel and is provided with a second screw connection part and an opposite operating part. The operating part is exposed outside the channel. The second screw connecting part is located in the channel and is screwed the first screw connecting part so that the paste moving member moves in the channel at the same time when the paste moving member rotates relative to the shell. A paste is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:膏劑外殼</p>  
        <p type="p">1:殼體</p>  
        <p type="p">10:通道</p>  
        <p type="p">1A:第一部件</p>  
        <p type="p">11:貫通孔</p>  
        <p type="p">1B:第二部件</p>  
        <p type="p">13:底部</p>  
        <p type="p">14:收容通道</p>  
        <p type="p">2:膏體移動件</p>  
        <p type="p">2A:第一段</p>  
        <p type="p">21A:螺旋軌道</p>  
        <p type="p">21:第二螺接部</p>  
        <p type="p">2B:第二段</p>  
        <p type="p">22:操作部</p>  
        <p type="p">23:固定槽</p>  
        <p type="p">3:前蓋</p>  
        <p type="p">31:開口</p>  
        <p type="p">A:中心軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="395" publication-number="202612609"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612609.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612609</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136343</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膏劑外殼以及膏劑</chinese-title>  
        <english-title>PASTE SHELL AND PASTE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">A45D33/28</main-classification>  
        <further-classification edition="200601120241205B">A45D40/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>棨美有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIME BEAUTY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　重棨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林松柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種膏劑外殼，包括：殼體、旋轉件以及膏體移動件。殼體內部具有通道。旋轉件可轉動的套設殼體。旋轉件具有操作部及與套接部相對的套接部，操作部露出於殼體外，套接部套設在通道內並於內部具有收容通道。膏體移動件適於沿著通道移動，膏體移動件的外表面具有第一連接部以及與第一連接部相對的第二連接部，第一連接部可旋轉的連接於收容通道，第二連接部不可轉動的滑接於通道內。亦提供一種使用上述膏劑外殼的膏劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A paste shell includes a shell, a rotating member and a paste moving member. The shell has a channel inside. The rotating member is rotatably sleeved on the shell. The rotating member has a sleeve part and an operating part opposite to the sleeve part. The operating part exposed outside the shell. The sleeve part is sleeved in the channel and having a receiving channel inside. The paste moving member is adapted to move along the channel. An outer surface of the paste moving member has a first connecting part and a second connecting part opposite to the first connecting part. The first connecting part is rotatably connected to the receiving channel. The second connecting part is non-pivoting and slip connecting in the channel. A paste using the paste shell is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:膏劑外殼</p>  
        <p type="p">1:殼體</p>  
        <p type="p">10:通道</p>  
        <p type="p">101a:內壁面</p>  
        <p type="p">11:組合部</p>  
        <p type="p">2:旋轉件</p>  
        <p type="p">21:套接部</p>  
        <p type="p">211:收容通道</p>  
        <p type="p">211a:凸塊</p>  
        <p type="p">22:操作部</p>  
        <p type="p">3:膏體移動件</p>  
        <p type="p">31:第一連接部</p>  
        <p type="p">311:螺旋軌道</p>  
        <p type="p">32:第二連接部</p>  
        <p type="p">321:導引滑槽</p>  
        <p type="p">4:前蓋</p>  
        <p type="p">41:開口</p>  
        <p type="p">5:膏體</p>  
        <p type="p">A:中心軸</p>  
        <p type="p">O:旋轉軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="396" publication-number="202613472"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613472.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613472</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136351</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冰箱及冰箱庫外氣氛燈顯示控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">F25D27/00</main-classification>  
        <further-classification edition="200601120241230B">F25D29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣松下電器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHITA ELECTRIC (TAIWAN) CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王靜美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳毓軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫源標</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳柏昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝家偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭任翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚永燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林文昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種冰箱庫外氣氛燈顯示控制方法，包括於冰箱設置一燈條，該燈條對應於冰箱的一門板的一側邊，該門板可被開啟地封閉冰箱的一儲藏室；設於冰箱的一感測器感測到該門板由關閉狀態變成開啟狀態時，傳送一開啟訊號給冰箱的一控制器，使該控制器控制該燈條點亮並維持於一固定亮度；設於冰箱的該感測器感測到該門板由開啟狀態變成關閉狀態時，傳送一關閉訊號給冰箱的該控制器，使該控制器控制該燈條運作於氣氛燈模式，該氣氛燈模式使該燈條呈現亮度逐漸改變的效果及點燈、滅燈等狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S5:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="397" publication-number="202613809"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613809.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613809</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136352</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用備援作業系統的開機方法</chinese-title>  
        <english-title>BOOT METHOD USING REDUNDANT OPERATING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250203B">G06F9/4401</main-classification>  
        <further-classification edition="201801120250203B">G06F9/44</further-classification>  
        <further-classification edition="200601120250203B">G06F11/07</further-classification>  
        <further-classification edition="200601120250203B">G06F11/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神雲科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITAC COMPUTING TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林啓榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種使用備援作業系統的開機方法，由一電腦裝置執行，該電腦裝置包括多個具有順序性的硬碟、一基板管理控制單元，及一處理單元，每一硬碟儲存一作業系統，包含以下步驟：(A)該處理單元開始進行一開機自檢程序；(B)該處理單元產生並傳送一詢問指令至該基板管理控制單元，以使該基板管理控制單元產生並回傳一相關於前次開機情況的回覆訊息；(C)該處理單元根據該回覆訊息判斷前次開機是否成功；(D)當判斷出前次開機失敗時，該處理單元將該等硬碟中的一當前開機硬碟之下一顆硬碟更新為一新的開機硬碟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A boot method using redundant operating system is executed by a computer device. The computer device includes a plurality of sequential hard disks, a baseboard management control unit, and a processing unit. Each hard disk stores an operating system. It includes the following steps: (A) The processing unit starts a power-on self-test program; (B) The processing unit generates and sends an inquiry command to the baseboard management control unit, so that the baseboard management control unit generates and sends a reply message related to the last boot situation back; (C) The processing unit determines whether the previous boot was successful based on the reply message; (D) When it is determined that the previous boot failed, the processing unit updates a next hard disk of a current boot hard disk among the hard disks to a new boot hard disk.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201~213:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="398" publication-number="202614717"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614717.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614717</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136369</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液冷裝置</chinese-title>  
        <english-title>LIQUID COOLING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241206B">H05K7/20</main-classification>  
        <further-classification edition="200601120241206B">F28F7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳昂湃技術股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APALTEK CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖啟能</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, QINENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭達高</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, DAGAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳敏銳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MINRUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係一種液冷裝置，包括主體、中軸、定子組件、轉子組件及軸墊，主體具有腔室及卡槽，中軸固定於主體且位於腔室及卡槽內，定子組件設於主體且環繞中軸，轉子組件容置在腔室內，轉子組件包括轉輪及軸承，軸承具有內緣、外緣、第一端面及第二端面，中軸穿接且固定於內緣，轉輪固接於外緣且環繞定子組件，第一端面抵接於轉輪，軸墊套設中軸且包括基座、凸環及弧形抵接部，基座卡固於卡槽，凸環自基座凸出延伸且凸環的外徑小於基座的外徑，弧形抵接部自凸環凸出延伸並抵接第二端面；藉此，能夠有效提升軸墊的使用壽命並大幅降低噪音。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A liquid cooling device having a body, a draft, a stator assembly, a rotor assembly, and a draft pad is provided. The body has a chamber and a groove. The draft is fixed to the body and located in the chamber and the groove. The stator assembly is arranged on the body and surrounds the draft. The rotor assembly is accommodated in the chamber and includes a wheel and a bearing having an inner edge, an outer edge, a first end surface, and a second end surface. The draft penetrates and is fixed to the inner edge. The wheel is fixed to the outer edge and surrounds the stator assembly. The first end surface abuts against to the wheel. The draft pad is adapted to sheathe the draft and includes a base, a convex ring and an arc-shaped abutting portion. The base is fixed to the groove. The convex ring is protruded from the base, and an outer diameter of the convex ring is smaller than an outer diameter of the base. The arc-shaped abutting portion is protruded from the convex ring and abuts against to the second end surface. The draft pad is therefore extending the service life and reducing noise significantly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:主體</p>  
        <p type="p">11:腔室</p>  
        <p type="p">20:中軸</p>  
        <p type="p">30:定子組件</p>  
        <p type="p">31:安裝板</p>  
        <p type="p">32:定子</p>  
        <p type="p">40:轉子組件</p>  
        <p type="p">41:轉輪</p>  
        <p type="p">42:軸承</p>  
        <p type="p">50:軸墊</p>  
        <p type="p">60:分隔組件</p>  
        <p type="p">601:通槽組</p>  
        <p type="p">602:入液腔</p>  
        <p type="p">61:分隔板</p>  
        <p type="p">62:導流板</p>  
        <p type="p">70:底座</p>  
        <p type="p">71:鰭片</p>  
        <p type="p">80:外殼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="399" publication-number="202612851"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612851.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612851</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136372</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>扳手結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241113B">B25B13/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穩陞工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖嘉冠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種扳手結構，其係包括：一本體係設有一驅動部、一柄部、一凸塊部及一握把部，該驅動部、該柄部、該凸塊部及該握把部之間係形成不同厚度及寬度，該柄部、該凸塊部及該握把部相對該驅動部具有不同高度，該凸塊部頂部相對該驅動部具有最高之高度，該凸塊部底部相對該驅動部具有最高高度；該柄部係設有一第一面、一第一底面、一第一連接面及一第一側面；該凸塊部設有一第二面、一第二底面、一第二連接面、一第二側面及一第三連接面；該握把部設有一第三面、一第四連接面、一第三底面、一第三側面、一第四側面及一第五連接面。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">10:本體</p>  
        <p type="p">11:驅動部</p>  
        <p type="p">12:柄部</p>  
        <p type="p">121:第一面</p>  
        <p type="p">13:凸塊部</p>  
        <p type="p">14:握把部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="400" publication-number="202613957"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613957.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613957</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136374</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>批次且分階段檢測的互動式機台參數優化系統及方法</chinese-title>  
        <english-title>SYSTEM FOR INTERACTIVE MACHINE PARAMETERS OPTIMIZATION THROUGH BATCHES AND PHASED TESTING, AND METHOD FOR USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241104B">G06Q50/04</main-classification>  
        <further-classification edition="200601120241104B">G05B23/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS,INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳聖華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHENG-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方思涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, SIH-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施中山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHUNG SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡易霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種互動式機台參數優化系統，包括資料庫及處理器。資料庫記錄要檢測的多個參數類別。處理器執行下列程序：取得批次推薦組數；基於多個參數類別及批次推薦組數產生至少一組參數組合；對依據每組參數組合生產的產品進行至少一階段檢測並產生每個階段檢測對應的檢測結果，其中在當前的階段數未達到預設的檢測階段數時，取得符合此階段標準的參數組合，並對這些參數組合對應的產品進行下一階段檢測；於達到檢測階段數且滿足預設停止條件時產生最佳化參數組合；及於達到檢測階段數但未滿足預設停止條件時，重複上述程序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for interactive machine parameters optimization including a database and a processor is disclosed. The database records multiple parameter categories, which are used for quality measurement. The processor executes following actions: obtaining a batch recommended groups number; generating at least one parameter group according to the parameter categories and the batch recommended groups number; performing at least one stage-testing to a product produced based on the parameter group to generate a measured result for the parameter group of each stage-testing, wherein, until current stage reaches a preset measurement stage, obtaining another parameter group satisfied current stage-standard and performing next stage-testing to the product corresponding to the obtained parameter group; generating an optimized parameter group when the preset testing-stage is reached and a default stopping condition is satisfied; and, when the preset testing-stage is reached but the default stopping condition is unsatisfied, repeating the actions</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S20~S28:優化步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="401" publication-number="202612852"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612852.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612852</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136376</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>起子旋動結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">B25B15/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種起子旋動結構，其係包括：一固定座設有二個第一容槽、一第一樞部、一第二容槽、一第三容槽、二個第四容槽、一凹陷槽、二個第一邊面、一第二邊面、一第一容彈槽及一限制部；一驅動件係設有一棘輪部及一環槽；二卡掣組；一第一彈體；一控制件；一固定板係設有一樞孔；二個卡扣件係與該固定座及該驅動件相容設，該卡扣件係容設於該第四容槽處，該卡扣件係凸設有一卡扣塊，該卡扣塊係樞設於該環槽內，該卡扣件係將驅動件樞設於該固定座上，該卡扣件底部係設有一第三抵面；一定位珠及一第二彈體容設於該第一容彈槽內。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">10:固定座</p>  
        <p type="p">20:驅動件</p>  
        <p type="p">21:套合部</p>  
        <p type="p">30:卡掣組</p>  
        <p type="p">40:第一彈體</p>  
        <p type="p">50:控制件</p>  
        <p type="p">60:固定板</p>  
        <p type="p">70:卡扣件</p>  
        <p type="p">80:定位珠</p>  
        <p type="p">81:第二彈體</p>  
        <p type="p">82:磁性體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="402" publication-number="202614154"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614154.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614154</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136385</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置的製作方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">H01L21/02</main-classification>  
        <further-classification edition="200601120241101B">H01L21/48</further-classification>  
        <further-classification edition="200601120241101B">H01L23/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧喬乙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, CHIAO-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂泱儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YANG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志嶽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHIH-YUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高葦昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, WEI-XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡湘綺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, HSIANG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置的製作方法，包括下列步驟。首先，提供第一半導體結構及第二半導體結構。第一半導體結構包括第一導電柱及連接於第一導電柱的第一傳導層，第二半導體結構包括第二導電柱及連接於第二導電柱的第二傳導層，其中第一傳導層的材料與第二傳導層的材料為導電材料，且在預定溫度下為可揮發。此後，接合第一半導體結構及第二半導體結構，使得第一導電柱結合於第二導電柱，在接合第一半導體結構及第二半導體結構的步驟完成之後，第一傳導層與第二傳導層自第一半導體結構及第二半導體結構之中消失。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing a semiconductor device includes the following steps. First, a first semiconductor structure and a second semiconductor structure are provided. The first semiconductor structure includes a first conductive pillar and a first conductive layer connected to the first conductive pillar, and the second semiconductor structure includes a second conductive pillar and a second conductive layer connected to the second conductive pillar, wherein a material of the first conductive layer and a material of the second conductive layer are conductive material and are volatilizable at a predetermined temperature. Thereafter, the first semiconductor structure and the second semiconductor structure are bonded so that the first conductive pillar is combined with the second conductive pillar. After the step of combining the first semiconductor structure and the second semiconductor structure is finished, the first conductive layer and the second conductive layer are disappeared.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110’:第一半導體結構</p>  
        <p type="p">111:第一基板</p>  
        <p type="p">113:第一氧化物層</p>  
        <p type="p">115:第一佈線層</p>  
        <p type="p">117:第一介電層</p>  
        <p type="p">117p:第一開口</p>  
        <p type="p">119:第一導電柱</p>  
        <p type="p">150:第一傳導層</p>  
        <p type="p">1191:第一障蔽層</p>  
        <p type="p">1192:第一導電層</p>  
        <p type="p">130’:第二半導體結構</p>  
        <p type="p">131:第二基板</p>  
        <p type="p">133:第二氧化物層</p>  
        <p type="p">135:第二佈線層</p>  
        <p type="p">137:第二介電層</p>  
        <p type="p">137p:第二開口</p>  
        <p type="p">139:第二導電柱</p>  
        <p type="p">170:第二傳導層</p>  
        <p type="p">1391:第二障蔽層</p>  
        <p type="p">1392:第二導電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="403" publication-number="202614030"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614030.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614030</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136391</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閘極驅動器</chinese-title>  
        <english-title>GATE DRIVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241206B">G09G3/36</main-classification>  
        <further-classification edition="200601120241206B">G02F1/133</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇益正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, YI CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林煒力</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係為一種閘極驅動器。閘極驅動器電連接於時序控制器，且閘極驅動器包含N級閘極驅動電路。第n級閘極驅動電路包含：電連接於時序控制器與中介端點的輸出信號設定模組。在全閘極同步期間，輸出信號設定模組根據時序控制器傳送的全閘極同步啟用信號而設定第n級像素閘極信號。在輪續掃描期間中的第n級單級掃描期間，輸出信號設定模組因應中介端點的電壓而選擇性設定第n級列掃描狀態信號與第n級像素閘極信號。輪續掃描期間包含與N級閘極驅動電路分別對應的N級單級掃描期間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A gate driver is provided. The gate driver is electrically connected to a timing controller, and the gate driver includes N gate driving circuits. An n-th gate driving circuit includes an output signal setting module being electrically connected to the timing controller and a middle node. During an all-gate synchronization duration, the output signal setting module sets an n-th pixel gating signal according to an all-gate synchronization enablement signal sent by the timing controller. During an n-th single-stage scanning duration of a rotating scanning duration, the output signal setting module selectively sets an n-th row scanning state signal and the n-th pixel gating signal according to the voltage of the middle node. The rotating scanning duration includes N single-stage scanning durations respectively corresponding to the N gate driving circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">VGHD:閘極供應電壓</p>  
        <p type="p">ST[n-p]:第(n-p)級列掃描狀態信號(線)</p>  
        <p type="p">nmuCKT[n]:中介端點上拉電路</p>  
        <p type="p">gtCKT[n]:第n級閘極驅動電路</p>  
        <p type="p">ssCKT[n]:狀態信號設定電路</p>  
        <p type="p">HC[k]:逐列選取信號</p>  
        <p type="p">XON_C:全閘極同步期間信號(線)</p>  
        <p type="p">XON_S:全閘極同步啟用信號</p>  
        <p type="p">NDmd[n]:中介端點</p>  
        <p type="p">gsCKT[n]:閘極信號設定電路</p>  
        <p type="p">C[n]:電容</p>  
        <p type="p">L1a,L1b,L1c,L2a,L2b:虛線線段</p>  
        <p type="p">G[n]:第n級像素閘極信號</p>  
        <p type="p">ST[n]:第n級列掃描狀態信號</p>  
        <p type="p">nmdCKT[n]:中介端點下拉電路</p>  
        <p type="p">stbCKT[n]:穩壓電路</p>  
        <p type="p">stbsCKT[n]:穩壓端點設定電路</p>  
        <p type="p">stbMDL[n]:穩壓模組</p>  
        <p type="p">VSSQ:中介端點接地電壓</p>  
        <p type="p">VSSG:像素閘極接地電壓(信號線)</p>  
        <p type="p">LC:穩壓端點供應電壓</p>  
        <p type="p">ST[n+q]:第(n+q)級列掃描狀態信號(線)</p>  
        <p type="p">rstST:中介端點重置信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="404" publication-number="202614102"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614102.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614102</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136393</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電感器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241211B">H01F38/14</main-classification>  
        <further-classification edition="200601120241211B">H01F27/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西北臺慶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝明諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, MING-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游承翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHENG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒俊德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, CHUN-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂冠儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, KUAN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪振雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電感器，其包含：一第一線圈，包含一第一主體部、一第一腳位部及一第二腳位部，第一主體部由複數個直線段及複數個彎曲段相連接所組成，第一腳位部及第二腳位部分別連接於第一主體部，第一腳位部呈直線狀，第二腳位部呈彎折狀，第一腳位部與第二腳位部位於同一直線上；一第二線圈，包含一第二主體部、一第三腳位部及一第四腳位部，二主體部由一傾斜段、複數個直線段及複數個彎曲段相連接所組成，第三腳位部及第四腳位部分別連接於第二主體部，第三腳位部呈直線狀，第四腳位部呈彎折狀，第三腳位部與第四腳位部呈錯位設置，使第三腳位部與第四腳位部位於不同直線上；以及一包覆層，包含複數個合金粉末，包覆層包覆第一線圈及第二線圈。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">1:第一線圈</p>  
        <p type="p">11:第一主體部</p>  
        <p type="p">111:直線段</p>  
        <p type="p">112:彎曲段</p>  
        <p type="p">12:第一腳位部</p>  
        <p type="p">13:第二腳位部</p>  
        <p type="p">2:第二線圈</p>  
        <p type="p">21:第二主體部</p>  
        <p type="p">211:傾斜段</p>  
        <p type="p">212:直線段</p>  
        <p type="p">213:彎曲段</p>  
        <p type="p">22:第三腳位部</p>  
        <p type="p">23:第四腳位部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="405" publication-number="202614883"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614883.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614883</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136394</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光元件</chinese-title>  
        <english-title>LIGHT EMITTING ELEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10H20/81</main-classification>  
        <further-classification edition="202501120250102B">H10H20/819</further-classification>  
        <further-classification edition="202501120250102B">H10H20/83</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇薪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佳安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳映羽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YINYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊文瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林冠亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUAN-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種發光元件包括第一型半導體層、第二型半導體層、主動層、本徵半導體層、第一電極及第二電極。第二型半導體層設置於第一型半導體層的對向。主動層設置於第一型半導體層與第二型半導體層之間。本徵半導體層具有多個微結構。第二型半導體層設置於本徵半導體層與主動層之間。第一電極及第二電極分別設置於主動層的相對兩側。第二電極設置於本徵半導體層的貫孔及第二型半導體層的凹陷中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light-emitting element includes a first type semiconductor layer, a second type semiconductor layer, an active layer, an intrinsic semiconductor layer, a first electrode and a second electrode. The second type semiconductor layer is disposed opposite to the first type semiconductor layer. The active layer is disposed between the first type semiconductor layer and the second type semiconductor layer. The intrinsic semiconductor layer has multiple microstructures. The second type semiconductor layer is disposed between the intrinsic semiconductor layer and the active layer. The first electrode and the second electrode are respectively disposed on opposite sides of the active layer. The second electrode is disposed in a through hole of the intrinsic semiconductor layer and a recess of the second type semiconductor layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:發光元件</p>  
        <p type="p">110:第一型半導體層</p>  
        <p type="p">120:第二型半導體層</p>  
        <p type="p">120a:凹陷</p>  
        <p type="p">120s、140s:側壁</p>  
        <p type="p">130:主動層</p>  
        <p type="p">140:本徵半導體層</p>  
        <p type="p">140a:貫孔</p>  
        <p type="p">142:微結構</p>  
        <p type="p">150:第一電極</p>  
        <p type="p">160:第二電極</p>  
        <p type="p">170:絕緣層</p>  
        <p type="p">D:深度和</p>  
        <p type="p">d1:第一方向</p>  
        <p type="p">d2:第二方向</p>  
        <p type="p">S:半導體結構</p>  
        <p type="p">Sa:第一側壁</p>  
        <p type="p">T:厚度</p>  
        <p type="p">W&lt;sub&gt;140a&lt;/sub&gt;:寬度</p>  
        <p type="p">I-I’:線段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="406" publication-number="202614764"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614764.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614764</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136395</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非揮發性記憶體結構</chinese-title>  
        <english-title>NON-VOLATILE MEMORY STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241101B">H10B41/30</main-classification>  
        <further-classification edition="202301120241101B">H10B41/60</further-classification>  
        <further-classification edition="202301120241101B">H10B43/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王子嵩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZIH-SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種非揮發性記憶體結構，包括基底、閘介電層與浮置閘極結構。閘介電層位在基底上。浮置閘極結構位在閘介電層上。浮置閘極結構包括多晶矽晶種層、緩衝多晶矽層、摻雜多晶矽層與第一氧化物層。多晶矽晶種層位在閘介電層上。多晶矽晶種層的粒徑為10奈米至30奈米。緩衝多晶矽層位在多晶矽晶種層上。摻雜多晶矽層位在緩衝多晶矽層上。第一氧化物層位在摻雜多晶矽層與緩衝多晶矽層之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A non-volatile memory structure including a substrate, a gate dielectric layer, and a floating gate structure is provided. The gate dielectric layer is located on the substrate. The floating gate structure is located on the gate dielectric layer. The floating gate structure includes a polysilicon seed layer, a buffer polysilicon layer, a doped polysilicon layer, and a first oxide layer. The polysilicon seed layer is located on the gate dielectric layer. The grain size of the polysilicon seed layer is 10 nm to 30 nm. The buffer polysilicon layer is located on the polysilicon seed layer. The doped polysilicon layer is located on the buffer polysilicon layer. The first oxide layer is located between the doped polysilicon layer and the buffer polysilicon layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:非揮發性記憶體結構</p>  
        <p type="p">100:基底</p>  
        <p type="p">102:閘介電層</p>  
        <p type="p">104:浮置閘極結構</p>  
        <p type="p">106:隔離結構</p>  
        <p type="p">108:多晶矽晶種層</p>  
        <p type="p">110:緩衝多晶矽層</p>  
        <p type="p">112:摻雜多晶矽層</p>  
        <p type="p">114,116,124,128:氧化物層</p>  
        <p type="p">118:控制閘極</p>  
        <p type="p">120:介電層結構</p>  
        <p type="p">122,126,130:氮化物層</p>  
        <p type="p">AA:主動區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="407" publication-number="202614026"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614026.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614026</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136397</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閘極驅動電路</chinese-title>  
        <english-title>GATE DRIVING CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250122B">G09G3/3266</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵昌民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAO, CHANG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅睿騏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, JUI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種閘極驅動電路被提出。該閘極驅動電路包括：邏輯電路、第一電壓區隔電路、第一閘極線輸出電路、第二電壓區隔電路、第一時序電路以及電壓回授電路。邏輯電路提供控制電壓以及下拉控制訊號。第一電壓區隔電路接收控制電壓，並提供第一閘極電壓。第一閘極線輸出電路基於第一閘極電壓和第一調變脈波訊號輸出當前掃描訊號。第二電壓區隔電路接收控制電壓，並提供第二閘極電壓。第一時序電路基於第二閘極電壓和第一時脈訊號輸出當前時序訊號。電壓回授電路在當前時序訊號不同於控制電壓時接通當前時序訊號與控制電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A gate driving circuit is provided. The gate driving circuit includes: a logic circuit, a first voltage isolation circuit, a first gate line output circuit, a second voltage isolation circuit, a first timing circuit and a voltage feedback circuit. The logic circuit provides a control voltage and a pull-down control signal. The first voltage isolation circuit receives the control voltage and provides a first gate voltage. The first gate line output circuit outputs a current scan signal based on the first gate voltage and the first modulated pulse signal. The second voltage isolation circuit receives the control voltage and provides a second gate voltage. The first timing circuit outputs a current timing signal based on the second gate voltage and a first clock signal. The voltage feedback circuit conducts the current timing signal and the control voltage when the current timing signal is an enabled voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:閘極驅動電路</p>  
        <p type="p">110:邏輯電路</p>  
        <p type="p">120:第一電壓區隔電路</p>  
        <p type="p">130:第一閘極線輸出電路</p>  
        <p type="p">140:第二電壓區隔電路</p>  
        <p type="p">150:第一時序電路</p>  
        <p type="p">160:下拉電路</p>  
        <p type="p">170:第一電壓回授電路</p>  
        <p type="p">U2D:正向掃描訊號</p>  
        <p type="p">D2U:反向掃描訊號</p>  
        <p type="p">ST(n-2)、ST(n+4):時序訊號</p>  
        <p type="p">VP:控制電壓</p>  
        <p type="p">VI:下拉控制訊號</p>  
        <p type="p">P、Q1、Q2:節點</p>  
        <p type="p">VQ1、VQ2:閘極電壓</p>  
        <p type="p">ENB_HC1:調變脈波訊號</p>  
        <p type="p">SR(n):當前掃描訊號</p>  
        <p type="p">HC1:時脈訊號</p>  
        <p type="p">ST(n):當前時序訊號</p>  
        <p type="p">ST(n+2):時序訊號</p>  
        <p type="p">XDONB:系統低電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="408" publication-number="202614802"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614802.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614802</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136409</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/47</main-classification>  
        <further-classification edition="202501120250102B">H10D62/80</further-classification>  
        <further-classification edition="200601120250102B">H01L21/314</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台亞半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHUN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉彥宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁國隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體結構及其製造方法，其中半導體結構包含一矽基板、一氮化物緩衝複合層、一主動層及一矽阻擋複合層。氮化物緩衝複合層設置於矽基板上方，主動層設置於氮化物緩衝複合層上方，矽阻擋複合層夾置於氮化物緩衝複合層中，實質阻擋來自矽基板之一矽雜質擴散以降低漏電流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure and the manufacturing method thereof are provided. The semiconductor structure comprises a silicon substrate, a nitride buffer composite layer, an active layer and a silicon barrier composite layer. The nitride buffer composite layer is disposed above the silicon substrate, the active layer is disposed above the nitride buffer composite layer, and the silicon barrier composite layer is sandwiched in the nitride buffer composite layer to substantially block the diffusion of silicon impurities from the silicon substrate to reduce leakage current.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:矽基板</p>  
        <p type="p">20:氮化物緩衝複合層</p>  
        <p type="p">22:第一氮化鋁緩衝層</p>  
        <p type="p">24:第二氮化鋁緩衝層</p>  
        <p type="p">30:矽阻擋複合層</p>  
        <p type="p">30&lt;sub&gt;1&lt;/sub&gt;:含鋁氮化物層</p>  
        <p type="p">30&lt;sub&gt;2&lt;/sub&gt;:含鋁氮化物層</p>  
        <p type="p">30&lt;sub&gt;3&lt;/sub&gt;:含鋁氮化物層</p>  
        <p type="p">30&lt;sub&gt;n-1&lt;/sub&gt;:含鋁氮化物層</p>  
        <p type="p">30&lt;sub&gt;n&lt;/sub&gt;:含鋁氮化物層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="409" publication-number="202613977"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613977.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613977</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136411</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自適應性影像監控方法及其關注區域更新方法</chinese-title>  
        <english-title>AUTOMATED ADAPTIVE IMAGE MONITORING METHOD AND INTERESTED ZONE RENEWING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250203B">G06V20/56</main-classification>  
        <further-classification edition="202201120250203B">G06V20/58</further-classification>  
        <further-classification edition="202201120250203B">G06V10/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>輝創電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHETRON ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖玉燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, YU-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡聰賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, TSUNG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自適應性影像監控方法及其關注區域更新方法，用以解決習知監控方法中的關注區域無法提供重要物件資訊的問題。係包含：自監控影像中識別出至少一物件及其所對應的一類別；計算出該至少一物件中每一者的評估分數，且各該評估分數中最大者所對應的一物件定義為一最大分數物件；及自該監控影像中的多個子區域中的一者決定一關注區域，且該關注區域中具有該最大分數物件；該關注區域中的各該物件的該評估分數的總和，不小於包含有該最大分數物件的其他子區域中的各該物件的該評估分數的總和。本發明可以提升駕駛安全性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An automated adaptive image monitoring method and interested zone renewing method thereof are applied for solving the problem that the interested zone of the conventional monitoring method cannot provide important object information. The monitoring method includes the following steps: identifying at least one object and a respective one type for each of the at least one object from a monitoring image; calculating an evaluation score for each of the at least one object, and defining the object having the highest evaluation score as a highest score object; determining an interested zone from multiple sub-areas within the monitoring image, where the interested zone contains the highest score object, and a sum of the evaluation score of each object within the interested zone is not less than a sum of the evaluation score of each object within the sub-areas each containing the highest score object. The present invention can enhance the driving safety.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:影像擷取步驟</p>  
        <p type="p">S2:監控影像合成步驟</p>  
        <p type="p">S3:物件辨識步驟</p>  
        <p type="p">S4:物件評估分數計算步驟</p>  
        <p type="p">S5:關注區域生成步驟</p>  
        <p type="p">S51:立體影像生成步驟</p>  
        <p type="p">S6:關注區域更新步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="410" publication-number="202613424"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613424.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613424</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136414</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滾輪迷宮裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241206B">F16C33/80</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>駿維實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建田</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪福隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊璧卉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作係一種滾輪迷宮裝置，其係用以設置於滾輪端部，並連接滾輪的輪軸及輪體，滾輪迷宮裝置包含設於輪體之軸承座以及由內而外設置於軸承座內的軸承、軸向阻隔組件及外蓋，本創作滾輪迷宮裝置能藉由軸承座與外蓋的蓋體之間形成徑向迷宮通道，並於軸向阻隔組件內部形成軸向迷宮通道，能有效大幅延長外部環境中的雨水、風砂及粉塵等從外部侵入至軸承之間的距離，同時，外蓋的油封環能設置於徑向迷宮通道與軸向迷宮通道之間，並能確實阻隔雨水、風砂及粉塵等，以提高侵入難度，使本創作滾輪迷宮裝置能確實達到防水防塵之目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:軸承座</p>  
        <p type="p">11:裝配空間</p>  
        <p type="p">13:第一徑向阻隔部</p>  
        <p type="p">131:阻隔凸肋</p>  
        <p type="p">14:內端預留空間</p>  
        <p type="p">20:軸承</p>  
        <p type="p">30:軸向阻隔組件</p>  
        <p type="p">31:第一軸向阻隔單元</p>  
        <p type="p">311:主阻隔片</p>  
        <p type="p">312:阻隔翼片</p>  
        <p type="p">32:第二軸向阻隔單元</p>  
        <p type="p">321:擋片</p>  
        <p type="p">322:延伸翼片</p>  
        <p type="p">33:軸向迷宮通道</p>  
        <p type="p">331:軸向迷宮入口</p>  
        <p type="p">332:軸向迷宮出口</p>  
        <p type="p">40:外蓋</p>  
        <p type="p">41:蓋體</p>  
        <p type="p">411:第二徑向阻隔部</p>  
        <p type="p">412:延伸凸肋</p>  
        <p type="p">42:油封環</p>  
        <p type="p">43:徑向迷宮通道</p>  
        <p type="p">44:外端預留空間</p>  
        <p type="p">50:滾輪</p>  
        <p type="p">51:輪體</p>  
        <p type="p">52:輪軸</p>  
        <p type="p">53:裝配孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="411" publication-number="202613842"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613842.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613842</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136419</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無相機攝影系統及其方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR CAMERALESS PHOTOGRAPHY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250203B">G06F16/50</main-classification>  
        <further-classification edition="201901120250203B">G06F16/58</further-classification>  
        <further-classification edition="202301220250203B">H04N23/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺北科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林惠勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUEI-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明躍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MING-YIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種無相機攝影系統及其方法，包括環境擷取模組，其包含載有軟體的智慧裝置、全球定位系統、應用程式介面以及慣性測量單元，透過全球定位系統以及慣性測量單元產生環境資訊，再透過應用程式介面產生天氣資訊以及時間資訊；以及演算模組，包含運算單元以及圖像資料庫，運算單元接收環境資訊、天氣資訊以及時間資訊後，於圖像資料庫中篩選出與環境資訊、天氣資訊以及時間資訊最匹配之至少一圖像，而後智慧裝置顯示圖像；其中環境擷取模組與演算模組進行通訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a system and method for cameraless photography, comprising a environment acquisition module, and a calculation module. The environment acquisition module includes a smart device loaded with software, a global positioning system, an application programming interface, and an inertial measurement unit. An Environmental information is generated by the global positioning system and the inertial measurement unit. A weather information and a time information are generated by the application programming interface. The calculation module includes a computing unit and an image database. After receiving the environmental information, the weather information and the time information, the computing unit filters out at least one image in the image database that best matches the environmental information, the weather information and the time information. The smart device then displays the image The environment acquisition module communicates with the calculation module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:環境擷取模組</p>  
        <p type="p">11:智慧裝置</p>  
        <p type="p">111:軟體</p>  
        <p type="p">12:全球定位系統</p>  
        <p type="p">13:應用程式介面</p>  
        <p type="p">14:慣性測量單元</p>  
        <p type="p">141:陀螺儀</p>  
        <p type="p">2:演算模組</p>  
        <p type="p">21:運算單元</p>  
        <p type="p">22:圖像資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="412" publication-number="202613323"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613323.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613323</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136423</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>脫硫用助熔劑的製法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241008B">C21C7/076</main-classification>  
        <further-classification edition="200601120241008B">C21C7/064</further-classification>  
        <further-classification edition="200601120241008B">C21C5/52</further-classification>  
        <further-classification edition="202201120241008B">B09B3/40</further-classification>  
        <further-classification edition="202201320241008B">B09B101/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嘉德技術開發股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何長慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, CHANG-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳威德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEI-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林啟明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈峻名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, JYUN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏世卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種脫硫用助熔劑的製法，包含步驟(a)將鋁渣於900℃進行氧化以使該鋁渣中的氮化鋁轉變成氧化鋁，形成經氧化鋁渣；及步驟(b)將包含氧化鈣及氧化硼的組合物與經氧化鋁渣於1400℃進行熔煉，製得脫硫用助熔劑，當經氧化鋁渣的用量為47~51重量份時，氧化鈣的用量為44~47重量份，氧化硼的用量為3~5重量份。透過上述步驟(a)及步驟(b)的搭配設計，讓製得的脫硫用助熔劑具有熔點不超過1300℃的特性而有助於脫硫劑的快速液化，且脫硫用助熔劑與脫硫劑搭配使用能產生良好的脫硫效果，可見脫硫用助熔劑的製法可將鋁渣資源化再利用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="413" publication-number="202613417"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613417.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613417</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136431</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可快速判斷故障狀態的液壓系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">F15B13/16</main-classification>  
        <further-classification edition="200601120241105B">F15B20/00</further-classification>  
        <further-classification edition="200601220241105B">F15B19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱樁德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱宣翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種液壓系統，藉由儲存在油箱的液壓油驅動，並推動和拉動一物件。推拉模組用於推動和拉動物件，推拉偵測裝置偵測推拉模組在推動和拉動時液壓油的壓力值。控制模組輸出液壓油給推拉模組，也接收推拉模組輸出的液壓油，控制偵測裝置偵測控制模組中液壓油的壓力值和流量值。動力模組將油箱中的液壓油輸入控制模組，動力偵測裝置偵測動力模組中液壓油的壓力值。監控模組偵測到的壓力值流量值與運作異常判斷資料做比對，並將比對之後的結果輸出為運作狀態資訊，達成監控液壓系統運作，並在液壓系統發生故障或異常時供判斷異常原因。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:推拉模組</p>  
        <p type="p">2:控制模組</p>  
        <p type="p">3:動力模組</p>  
        <p type="p">4:偵測模組</p>  
        <p type="p">41:推拉偵測裝置</p>  
        <p type="p">42:控制偵測裝置</p>  
        <p type="p">43:動力偵測裝置</p>  
        <p type="p">5:監控模組</p>  
        <p type="p">91:油箱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="414" publication-number="202613959"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613959.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613959</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136432</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動化烹調料理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241031B">G06Q50/12</main-classification>  
        <further-classification edition="200601120241031B">A47J27/086</further-classification>  
        <further-classification edition="200601120241031B">A47J27/09</further-classification>  
        <further-classification edition="200601120241031B">A47J37/06</further-classification>  
        <further-classification edition="200601120241031B">A47J44/00</further-classification>  
        <further-classification edition="200601120241031B">A47J47/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣城餐飲有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭以忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自動化烹調料理系統，包含一中央控管單元、連接於該中央控管單元的一運作單元、一粉料供應單元、一醬料供應單元，及一攪拌單元。該運作單元包括一天車，及一連結於該天車且適用於取用食材並置入一鍋體的機械手臂。該粉料供應單元包括多個粉料儲存桶、多個分別設置於該等粉料儲存桶的出料模組，及一使調味粉根據粉量訊號輸出的粉料操作介面。該醬料供應單元包括多個醬料儲存桶、多個分別連接該等醬料儲存桶的導出模組，及一使調味醬根據用量訊號輸出的醬料操作介面。該攪拌單元包括一固定在一鍋蓋內且用以拌炒的拌動機構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:中央控管單元</p>  
        <p type="p">11:安全模組</p>  
        <p type="p">12:確保模組</p>  
        <p type="p">3:粉料供應單元</p>  
        <p type="p">31:粉料儲存桶</p>  
        <p type="p">4:醬料供應單元</p>  
        <p type="p">41:醬料儲存桶</p>  
        <p type="p">42:導出模組</p>  
        <p type="p">43:醬料操作介面</p>  
        <p type="p">5:供水單元</p>  
        <p type="p">51:水源</p>  
        <p type="p">52:控制閥</p>  
        <p type="p">53:供水操作介面</p>  
        <p type="p">54:出水模組</p>  
        <p type="p">6:配料供應區</p>  
        <p type="p">8:爐具</p>  
        <p type="p">81:鍋體</p>  
        <p type="p">9:走道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="415" publication-number="202613288"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613288.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613288</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136433</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬防鏽油</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241011B">C10M141/12</main-classification>  
        <further-classification edition="200601120241011B">C10M101/00</further-classification>  
        <further-classification edition="200601320241011B">C10N20/02</further-classification>  
        <further-classification edition="200601320241011B">C10N30/12</further-classification>  
        <further-classification edition="200601320241011B">C10N30/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾保仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇育俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種金屬防鏽油，以重量百分濃度計，包含70至90%的礦物油、5至20%的中性磺酸鈣、1至5%的羧酸，及1至3%的有機硼酸酯。其中，所述金屬防鏽油的含水量低於700ppm。所述金屬防鏽油在例如800mg/m &lt;sup&gt;2&lt;/sup&gt;的較低塗油量下，經過鹽霧試驗、濕熱試驗，及脫脂試驗，證實能達成所要求的防鏽能力，且同時具有較佳的可清洗性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="416" publication-number="202613746"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613746.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613746</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136440</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>載具系統及其控制方法</chinese-title>  
        <english-title>SYSTEM AND CONTROL METHOD FOR VEHICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120241105B">G05D1/43</main-classification>  
        <further-classification edition="200601120241105B">G05D3/00</further-classification>  
        <further-classification edition="202401320241105B">G05D109/10</further-classification>  
        <further-classification edition="202401320241105B">G05D105/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林文仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEN-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種載具系統及其控制方法，控制方法包含：一起點位置及一目標位置；該目標位置垂直投影於該起點位置所在之一第一方向虛擬延伸線上之一目標投影位置；依據該目標投影位置決定一轉向起始位置；控制該載具沿該第一方向虛擬延伸線行進至該轉向起始位置，其中，抵達該轉向起始位置時之該載具之速度為一第一速度；當該載具通過該轉向起始位置後，基於該載具之即時位置垂直投影於該第一方向虛擬延伸線之一即時投影位置，來決定並調整該載具之一舵向角度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a system and a control method for a vehicle, The control method includes: a starting position and a target position; the target position is vertically projected at a target projection position in a first direction virtual extension line where the starting position is located; according to the target projection position determines a turning starting position; the vehicle is controlled to travel along the first direction virtual extension line to the turning starting position, wherein the speed of the vehicle when arriving at the turning starting position is a first speed; after the vehicle passes the turning starting position, the rudder angle of the vehicle is determined and adjusted based on the real-time projection of the real-time position of the unmanned vehicle vertically in the first direction virtual extension line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">510、530、550、570、590:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="417" publication-number="202612625"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612625.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612625</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136441</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>飲料萃取器</chinese-title>  
        <english-title>BEVERAGE EXTRACTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250422B">A47J31/02</main-classification>  
        <further-classification edition="200601120250422B">A47J31/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>末廣峰治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUEHIRO, MINEJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>末廣峰治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUEHIRO, MINEJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種在咖啡等萃取過程中能夠維持或調節理想成分萃取所需溫度的萃取器或濾杯。飲料萃取器1具有藉由使液體通過而萃取素材成分的萃取室2和溫度調節室3。前述溫度調節室3以形成前述萃取室2的內側壁20或內底壁23為隔壁設置在外側。為了調節前述萃取室2中萃取過程的溫度，通過注入口7將溫度控制的溫度調節介質導入前述溫度調節室3。藉此維持或調節萃取過程中液體的萃取溫度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides an extraction device or dripper capable of maintaining or adjusting the temperature necessary for the ideal extraction of components during the beverage extraction process, such as coffee.The beverage extraction device 1 comprises an extraction chamber 2, where material components are extracted by passing liquid through it, and a temperature adjustment chamber 3. The temperature adjustment chamber 3 is provided on the outside, using the inner wall 20 or the inner bottom wall 23, which form the boundaries of the extraction chamber 2, as a partition. To adjust the temperature during the extraction process of the extraction chamber 2, a temperature-controlled temperature adjustment medium is introduced into the temperature adjustment chamber 3 through the inlet 7. This allows the extraction temperature of the liquid to be maintained or adjusted during the extraction process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:萃取器</p>  
        <p type="p">2:萃取室</p>  
        <p type="p">3:溫度調節室</p>  
        <p type="p">4:注水口</p>  
        <p type="p">5:萃取孔</p>  
        <p type="p">6:濾材承接器</p>  
        <p type="p">7:注入口</p>  
        <p type="p">8:濾材</p>  
        <p type="p">15:排出孔</p>  
        <p type="p">16:排出孔塞</p>  
        <p type="p">17:加熱器</p>  
        <p type="p">18:溫度計</p>  
        <p type="p">19:顯示面板</p>  
        <p type="p">20:內側壁</p>  
        <p type="p">21:中側壁</p>  
        <p type="p">22:外側壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="418" publication-number="202614376"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614376.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614376</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136444</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子封裝件及其製法</chinese-title>  
        <english-title>ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOFE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">H01L23/28</main-classification>  
        <further-classification edition="200601120241029B">H01L23/34</further-classification>  
        <further-classification edition="200601120241029B">H01L21/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽品精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張世平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHIH-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳亮斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIANG-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子封裝件及其製法，係先將封裝模組與半導體晶片設於承載結構上，再設置壓合件於該半導體晶片與該封裝模組上，之後設置散熱件於該承載結構及壓合件上，故藉由該壓合件之配置，以平均分散該承載結構之應力，因而避免該半導體晶片發生脫層的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic package and manufacturing method thereof, which comprise placing a packaging module and a semiconductor chip on a carrier structure, then placing a pressing member on the semiconductor chip and the packaging module, and then placing a heat sink on the carrier structure and pressing member. Therefore, through the arrangement of the pressing member, the stress of the carrier structure is evenly distributed, thereby avoiding the problem of delamination of the semiconductor chip.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:封裝模組</p>  
        <p type="p">26:光通訊元件</p>  
        <p type="p">3:電子封裝件</p>  
        <p type="p">30:承載結構</p>  
        <p type="p">30a:第一側</p>  
        <p type="p">30b:第二側</p>  
        <p type="p">31:半導體晶片</p>  
        <p type="p">32:功能晶片</p>  
        <p type="p">33:功能件</p>  
        <p type="p">34:壓合件</p>  
        <p type="p">340,350:散熱層</p>  
        <p type="p">35:散熱件</p>  
        <p type="p">35a:散熱體</p>  
        <p type="p">35b:支撐腳</p>  
        <p type="p">36:膠材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="419" publication-number="202614718"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614718.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614718</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136452</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於伺服器的液冷裝置</chinese-title>  
        <english-title>LIQUID-COOLING DEVICE FOR SERVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H05K7/20</main-classification>  
        <further-classification edition="200601120241105B">F28D1/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳昂湃技術股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APALTEK CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖啟能</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, QINENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請為一種用於伺服器的液冷裝置，包括第一液冷模組、第二液冷模組及熱交換器，第一液冷模組包括第一管路及三通閥，三通閥具有第一通道、第二通道及第三通道；第二液冷模組設置在第一液冷模組的一側邊且包括第二管路；熱交換器設置在第一管路和第二管路之間，並用以提供第一管路和第二管路的熱交換；其中在常態下，第二通道連通第一通道，在非常態下，第二通道和第三通道同時連通第一通道；其中第一管路和第二管路在常態時的熱交換量大於其在非常態時的熱交換量。藉此，能夠有效地防止第二管路凝結水珠。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A liquid-cooling device for server includes a first liquid-cooled module, a second liquid-cooled module and a heat exchanger. The first liquid-cooled module includes a first pipeline and a three-way valve. The three-way valve having a first channel, a second channel and a third channel. The second liquid-cooled module is arranged on side of the first liquid-cooled module and includes a second pipeline. The heat exchanger is arranged between the first pipeline and the second pipeline and used to provide heat exchange between the first pipeline and the second pipeline. In the normal state, the second channel is connected to the first channel, and in the abnormal state, the second channel and the third channel are connected to the first channel. Wherein the heat exchange of the first pipeline and the second pipeline under normal conditions is greater than that in abnormal conditions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一液冷模組</p>  
        <p type="p">11:第一管路</p>  
        <p type="p">111:第一輸水段</p>  
        <p type="p">113:第二輸水段</p>  
        <p type="p">1131:第一熱交換段</p>  
        <p type="p">115:第三輸水段</p>  
        <p type="p">13:三通閥</p>  
        <p type="p">131:第一通道</p>  
        <p type="p">1311:第一接口</p>  
        <p type="p">133:第二通道</p>  
        <p type="p">1331:第二接口</p>  
        <p type="p">135:第三通道</p>  
        <p type="p">1351:第三接口</p>  
        <p type="p">15:進水端</p>  
        <p type="p">17:出水端</p>  
        <p type="p">20:第二液冷模組</p>  
        <p type="p">21:第二管路</p>  
        <p type="p">211:第一水管段</p>  
        <p type="p">2111:主管道</p>  
        <p type="p">2113:次管道</p>  
        <p type="p">213:第二水管段</p>  
        <p type="p">215:第二熱交換段</p>  
        <p type="p">23:緩衝水箱</p>  
        <p type="p">25:水泵組件</p>  
        <p type="p">251:第一水泵</p>  
        <p type="p">253:第一單向閥</p>  
        <p type="p">255:第二水泵</p>  
        <p type="p">257:第二單向閥</p>  
        <p type="p">27:過濾器</p>  
        <p type="p">30:熱交換器</p>  
        <p type="p">43:溫度傳感器</p>  
        <p type="p">45:壓力傳感器</p>  
        <p type="p">47:溫濕度傳感器</p>  
        <p type="p">8:伺服器</p>  
        <p type="p">81:機櫃</p>  
        <p type="p">82:水冷板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="420" publication-number="202614081"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614081.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614081</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136453</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>醫療檢測報告翻譯、摘要生成及處置建議系統</chinese-title>  
        <english-title>REPORT TRANSLATION, SUMMARY GENERATION AND DISPOSAL RECOMMENDATION SYSTEM FOR MEDICAL DETECTING REPORT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241101B">G16H10/00</main-classification>  
        <further-classification edition="201801120241101B">G16H10/40</further-classification>  
        <further-classification edition="201801120241101B">G16H15/00</further-classification>  
        <further-classification edition="201801120241101B">G16H70/00</further-classification>  
        <further-classification edition="201801120241101B">G16H80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寬廣科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YESTURNKEY TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>偉創生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VICTREND BIOPHARM CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴承正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, CHENG-JENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳蒨樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, QIAN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周沂潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOW, YI-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂毓榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEU, YUH-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種醫療檢測報告翻譯、摘要生成及處置建議系統包含資料搜集單元、輸入單元、翻譯單元、特徵提取單元、摘要生成單元及報告生成單元。資料搜集單元用以搜集一醫療資料。輸入單元用以輸入一外語醫療檢測報告。翻譯單元用以翻譯外語醫療檢測報告以產生一中文醫療檢測報告。特徵提取單元以一特徵模型分析中文醫療檢測報告以產生複數個向量特徵資料並且分析外語醫療檢測報告以產生至少一關鍵字。摘要生成單元以一語言模型分析該等向量特徵資料及中文醫療檢測報告以產生一報告摘要。報告生成單元根據醫療資料以及至少一關鍵字產生一處置建議書。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A report translation, summary generation and disposal recommendation system for medical detecting report includes a data searching unit configured to search a medical data, an input unit configured to input a foreign language medical test report, a translating unit configured to translate the foreign language medical test report into a Chinese medical test report, a feature obtaining unit configured to analyze the Chinese medical test report to generate a plurality of vector feature data and analyze the foreign language medical test report to generate at least one keyword by a feature model, a summary generating unit configured to analyze the vector feature data and the Chinese medical test report to generate a summary report by a language model, and a report generating unit configured to generate a disposal recommendation report according to the medical data and the keyword.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S:醫療檢測報告翻譯、摘要生成及處置建議系統</p>  
        <p type="p">1:終端裝置</p>  
        <p type="p">11:輸入單元</p>  
        <p type="p">2:伺服器</p>  
        <p type="p">21:資料搜集單元</p>  
        <p type="p">22:資料類型判斷單元</p>  
        <p type="p">23:翻譯單元</p>  
        <p type="p">24:特徵提取單元</p>  
        <p type="p">25:摘要生成單元</p>  
        <p type="p">26:報告生成單元</p>  
        <p type="p">27:回應單元</p>  
        <p type="p">3:資料庫</p>  
        <p type="p">31:關聯式資料庫</p>  
        <p type="p">32:向量資料庫</p>  
        <p type="p">4:外部資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="421" publication-number="202613954"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613954.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613954</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136455</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>貨物運輸保險智能風險評估與核保方法及系統</chinese-title>  
        <english-title>INTELLIGENT RISK ASSESSMENT AND UNDERWRITING METHOD AND SYSTEM FOR MARINE CARGO INSURANCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120241007B">G06Q40/08</main-classification>  
        <further-classification edition="202301120241007B">G06Q10/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富邦產物保險股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUBON INSURANCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱有為</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, YU WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種貨物運輸保險智能風險評估與核保系統，用以根據要保資料進行資料核對及風險評估以產生要保書。本系統包含資料收集模組、資料核對改正模組、風險與核保評估模組、費率推薦模組以及要保書產出模組。資料收集模組接收要保資料。資料核對改正模組將要保資料與外部資訊資料庫中的資料集進行比對(包含資料集間的交叉比對)以產生比對結果，並根據比對結果修正要保資料以產生正確之要保資料。風險與核保評估模組針對正確之要保資料根據內外部資料集進行承保條件配對以及運輸風險評估，並產生複數個整合性風險分析結果。費率推薦模組根據每一整合性風險分析結果產生對應之推薦費率。要保書產出模組根據每一整合性風險分析結果以及對應之推薦費率產生報價單和/或要保書。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An intelligent risk assessment and underwriting system for marine cargo insurance is used to generate an insurance proposal according to data matching and risk assessment of insurance application information. The system comprises a data collection module, a data matching and correction module, a risk and underwriting assessment module, a rate recommendation module and an insurance proposal generation module. The data collection module receives the insurance application information. The data matching and correction module compares the insurance application information with a dataset in an external information database (includes cross-referencing between datasets) to generate a comparison result, and corrects the insurance application information based on the comparison result to generate correct insurance application information. The risk and underwriting assessment module performs underwriting condition matching and transportation risk assessment based on an internal and external dataset for the correct insurance application information and generates a plurality of integrated risk analyses. The rate recommendation module generates corresponding recommended rates based on each integrated risk analysis. The insurance proposal generation module generates the insurance proposal based on each integrated risk analysis and the corresponding recommended rates.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:貨物運輸保險智能風險評估與核保系統</p>  
        <p type="p">11:資料收集模組</p>  
        <p type="p">12:資料核對改正模組</p>  
        <p type="p">13:風險與核保評估模組</p>  
        <p type="p">14:費率推薦模組</p>  
        <p type="p">15:要保書產出模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="422" publication-number="202613464"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613464.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613464</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136458</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁浮排液裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">F24F13/22</main-classification>  
        <further-classification edition="200601120241029B">F16T1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>能揚興業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUPER AIR COMPRESSOR TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉慶得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHING-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉瑾雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHING-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉宗彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, TSUNG-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉宗翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, TSUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種磁浮排液裝置包含儲液桶、界定進、出氣通道的磁吸閥控制機構及排液機構。磁吸閥控制機構包括在進、出氣通道間的第一活塞及磁吸單元與浮球單元。磁吸單元包括連接第一活塞的第一磁吸件及連接浮球單元的第二磁吸件。第一活塞在封閉出氣通道的封閉位置及第一、二磁吸件相吸使第一活塞移離出氣通道的通氣位置間移動。排液機構包括排液口、氣壓缸及於氣壓缸的推桿組。推桿組在封閉排液口的關閉位置與受氣壓而移離排液口的排液位置間移動。利用第一、二磁吸件相吸開啟出氣通道，進而帶動排液機構自動排出液體，提升裝置使用壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:儲液桶</p>  
        <p type="p">11:桶本體</p>  
        <p type="p">12:上蓋</p>  
        <p type="p">121:孔內周面</p>  
        <p type="p">122:安裝孔</p>  
        <p type="p">13:儲液空間</p>  
        <p type="p">131:出液口</p>  
        <p type="p">132:入液口</p>  
        <p type="p">2:磁吸閥控制機構</p>  
        <p type="p">21:閥基座單元</p>  
        <p type="p">211:氣動閥下座</p>  
        <p type="p">212:氣動閥上座</p>  
        <p type="p">213:下座內周面</p>  
        <p type="p">214:磁吸閥氣動空間</p>  
        <p type="p">215:進氣通道</p>  
        <p type="p">216:出氣通道</p>  
        <p type="p">22:彈力閥單元</p>  
        <p type="p">221:第一活塞</p>  
        <p type="p">222:第一彈性件</p>  
        <p type="p">223:頭部</p>  
        <p type="p">224:延伸部</p>  
        <p type="p">225:氣隙</p>  
        <p type="p">23:浮球單元</p>  
        <p type="p">231:樞接桿</p>  
        <p type="p">232:浮球</p>  
        <p type="p">24:磁吸單元</p>  
        <p type="p">241:第一磁吸件</p>  
        <p type="p">242:第二磁吸件</p>  
        <p type="p">3:排液機構</p>  
        <p type="p">31:排液基座單元</p>  
        <p type="p">311:中空外殼</p>  
        <p type="p">312:分隔件</p>  
        <p type="p">313:排液口</p>  
        <p type="p">314:排液通道</p>  
        <p type="p">32:氣壓缸單元</p>  
        <p type="p">320:排液氣動空間</p>  
        <p type="p">321:氣壓缸</p>  
        <p type="p">322:推桿組</p>  
        <p type="p">323:第二彈性件</p>  
        <p type="p">324:第二活塞</p>  
        <p type="p">325:桿部</p>  
        <p type="p">326:塞心</p>  
        <p type="p">327:第一空間部</p>  
        <p type="p">328:第二空間部</p>  
        <p type="p">33:壓力管路</p>  
        <p type="p">91:液體</p>  
        <p type="p">92:進氣進水管路</p>  
        <p type="p">M:長向方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="423" publication-number="202613148"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613148.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613148</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136459</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>苦瓜胜肽及其在降血糖上的用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">C07K7/08</main-classification>  
        <further-classification edition="200601120241101B">A61K38/10</further-classification>  
        <further-classification edition="200601120241101B">A61P3/10</further-classification>  
        <further-classification edition="201601120241101B">A23L33/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳文良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃冠中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種苦瓜胜肽，該苦瓜胜肽可被用來降低血糖位準(blood glucose level)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="424" publication-number="202612721"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612721.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612721</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136460</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>苦瓜胜肽及其在抗血栓形成上的用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">A61K38/16</main-classification>  
        <further-classification edition="200601120250501B">A61P7/00</further-classification>  
        <further-classification edition="200601120250501B">A61P7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳文良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃冠中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種苦瓜胜肽，該苦瓜胜肽可被用來抗血栓形成(anti-thrombosis)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="425" publication-number="202612720"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612720.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612720</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136461</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>毛豆胜肽在降血糖上的用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241101B">A61K38/08</main-classification>  
        <further-classification edition="200601120241101B">C07K7/06</further-classification>  
        <further-classification edition="200601120241101B">A61P3/10</further-classification>  
        <further-classification edition="201601120241101B">A23L33/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳文良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃冠中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種毛豆( &lt;i&gt;Glycine max&lt;/i&gt;)胜肽供應用於製備一用來降低血糖位準(blood glucose level)之組成物的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="426" publication-number="202612722"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612722.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612722</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136462</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>毛豆胜肽在抗血栓形成上的用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">A61K38/16</main-classification>  
        <further-classification edition="200601120250501B">A61P7/00</further-classification>  
        <further-classification edition="200601120250501B">A61P7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳文良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃冠中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種毛豆( &lt;i&gt;Glycine max&lt;/i&gt;)胜肽供應用於製備一用來抗血栓形成(anti-thrombosis)之組成物的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="427" publication-number="202614077"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614077.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614077</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136464</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體參數校正測試系統及方法</chinese-title>  
        <english-title>TEST SYSTEM AND METHOD FOR MEMORY PARAMETER CALIBRATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">G11C29/06</main-classification>  
        <further-classification edition="200601120250102B">G11C29/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張芷楹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體參數校正測試系統及方法。記憶體參數校正測試系統包括待測的多個記憶體晶片、夾具、輸入裝置及記憶體測試裝置。記憶體測試裝置傳送測試命令至記憶體晶片。每個記憶體晶片包括第一測試電路區塊以及第二測試電路區塊。第一測試電路區塊根據測試命令依序採用N個測試選項來產生對應的N個原始信號組，且根據所選擇的欲校正的測試參數而將每個原始信號組進行信號處理，以產生分別對應於N個測試選項的N個補償量。第二測試電路區塊從N個補償量中逐一篩選出最佳補償量，以提供與最佳補償量對應的測試選項作為校正用測試選項。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A test system and method for memory parameter calibration are provided. The test system includes a plurality of memory chips to be tested, a fixture, an input device and a memory testing device. The memory test device sends a test command to the memory chips. Each of the memory chips includes a first testing circuit block and a second testing circuit block. The first testing circuit block sequentially uses N test options to generate corresponding N original signal groups based on the test command, and performs signal processing on each of the original signal groups according to a test parameter to be calibrated to generate N compensation amounts respectively corresponding to the N test options. The second testing circuit block one by one filters a best compensation amount from the N compensation amounts to provide the test option corresponding to the best compensation amount as a calibration test option.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體參數校正測試系統</p>  
        <p type="p">110_1~110_M:記憶體晶片</p>  
        <p type="p">120:夾具</p>  
        <p type="p">130:輸入裝置</p>  
        <p type="p">140:記憶體測試裝置</p>  
        <p type="p">Comr:燒錄命令</p>  
        <p type="p">Coms:偏移命令</p>  
        <p type="p">Comt:測試命令</p>  
        <p type="p">Op_1~Op_N:測試選項</p>  
        <p type="p">Test:測試操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="428" publication-number="202614896"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614896.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614896</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136465</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置以及顯示裝置的修復方法</chinese-title>  
        <english-title>DISPLAY DEVICE AND REPAIR METHOD OF DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250305B">H10H29/20</main-classification>  
        <further-classification edition="202501120250305B">H10H29/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包括第一、第二以及第三子畫素。第一、第二以及第三子畫素各自具有預設發光區以及維修區。第一子畫素包括分別設置於預設發光區以及維修區中的第一發光元件以及第一修復發光元件。第二子畫素包括設置於維修區中的第二修復發光元件。第三子畫素包括設置於預設發光區中的第三發光元件。第一發光元件、第一修復發光元件、第二修復發光元件以及第三發光元件具有相同的發光顏色的發光元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes first, second and third sub-pixels. The first, second and third sub-pixels each have a default light-emitting area and a repair area. The first sub-pixel includes a first light-emitting element and a first repair light-emitting element respectively disposed in the default light-emitting area and the repair area. The second sub-pixel includes a second repair light-emitting element disposed in the repair area. The third sub-pixel includes a third light-emitting element disposed in the default light-emitting area. The first light-emitting element, the first repair light-emitting element, the second repair light-emitting element and the third light-emitting element are light-emitting elements of the same color.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示裝置</p>  
        <p type="p">BL:C類預設發光區</p>  
        <p type="p">BLD:C類發光元件</p>  
        <p type="p">BM:黑矩陣</p>  
        <p type="p">BR:C類維修區</p>  
        <p type="p">BSP’:C類子畫素</p>  
        <p type="p">DR1:第一方向</p>  
        <p type="p">DR2:第二方向</p>  
        <p type="p">GL:B類預設發光區</p>  
        <p type="p">GLD:B類發光元件</p>  
        <p type="p">GR:B類維修區</p>  
        <p type="p">GSP’:B類子畫素</p>  
        <p type="p">h,p:長度</p>  
        <p type="p">RL1:第一A類預設發光區</p>  
        <p type="p">RL2:第二A類預設發光區</p>  
        <p type="p">RL3:第三A類預設發光區</p>  
        <p type="p">RL4:第四A類預設發光區</p>  
        <p type="p">RL5:第五A類預設發光區</p>  
        <p type="p">RL6:第六A類預設發光區</p>  
        <p type="p">RLD1:第一A類發光元件</p>  
        <p type="p">RLD2:第二A類發光元件</p>  
        <p type="p">RLD3:第三A類發光元件</p>  
        <p type="p">RLD4:第四A類發光元件</p>  
        <p type="p">RLD5:第五A類發光元件</p>  
        <p type="p">RLD6:第六A類發光元件</p>  
        <p type="p">RR1:第一A類維修區</p>  
        <p type="p">RR2:第二A類維修區</p>  
        <p type="p">RR3:第三A類維修區</p>  
        <p type="p">RR4:第四A類維修區</p>  
        <p type="p">RR5:第五A類維修區</p>  
        <p type="p">RR6:第六A類維修區</p>  
        <p type="p">RRD1:第一A類修復發光元件</p>  
        <p type="p">RRD2:第二A類修復發光元件</p>  
        <p type="p">RSP1’:第一A類子畫素</p>  
        <p type="p">RSP2’:第二A類子畫素</p>  
        <p type="p">RSP3’:第三A類子畫素</p>  
        <p type="p">RSP4’:第四A類子畫素</p>  
        <p type="p">RSP5’:第五A類子畫素</p>  
        <p type="p">RSP6’:第六A類子畫素</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="429" publication-number="202612826"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612826.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612826</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136467</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池電極的摩擦攪拌點銲方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241030B">B23K20/12</main-classification>  
        <further-classification edition="202101120241030B">H01M50/516</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裕隆汽車製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李華斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HUA-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪飛義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, FEI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周信穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, HSIN-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電池電極的摩擦攪拌點銲方法，包含：準備步驟，準備一點銲頭、一第一電極片及一第二電極片。該點銲頭具有一本體及一針柱。該第一電極片具有一介於0.3mm至1mm的第一厚度，該第二電極片具有一介於2mm至4mm的第二厚度。點銲步驟，將該第一電極片部分重疊於該第二電極片上，再讓該點銲頭旋轉並下壓在該第一電極片以進行摩擦攪拌點銲。該點銲頭的針柱刺穿該第一電極片的第一厚度並穿入該第二電極片的至少一半該第二厚度。脫離步驟，該點銲頭上升並脫離該第一、第二電極片。本發明能降低製造成本並提高銲接可靠度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:點銲頭</p>  
        <p type="p">11:本體</p>  
        <p type="p">111:大直徑段</p>  
        <p type="p">112:圓錐段</p>  
        <p type="p">12:針柱</p>  
        <p type="p">121:柱體</p>  
        <p type="p">122:錐角端</p>  
        <p type="p">2:第一電極片</p>  
        <p type="p">3:第二電極片</p>  
        <p type="p">H:點銲孔</p>  
        <p type="p">Z:上下方向</p>  
        <p type="p">T1:第一厚度</p>  
        <p type="p">T2:第二厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="430" publication-number="202613912"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613912.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613912</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136472</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車輛診斷專家系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241219B">G06Q10/20</main-classification>  
        <further-classification edition="201901120241219B">G06F16/25</further-classification>  
        <further-classification edition="200601120241219B">B60S5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴慶明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳育龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴慶明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳育龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種車輛診斷專家系統包含一規則暫存資料庫、一知識資料庫、一管理系統、一操作裝置以及一智能處理模組，該規則暫存資料庫儲存複數車輛維修規則，各該車輛維修規則包含車輛故障描述及維修建議；該管理系統與該規則暫存資料庫及該知識資料庫連接，能顯示該些車輛維修規則，供專家評估該些車輛維修規則是否正確，被判斷為正確之車輛維修規則存入該知識資料庫中；該智能處理模組與該操作裝置及該知識資料庫連接，該智能處理模組接收該操作裝置輸出之一維修詢問訊息以於該知識資料庫中查詢及檢索，並生成一應答訊息輸出至該操作裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:車輛診斷專家系統</p>  
        <p type="p">10:規則暫存資料庫</p>  
        <p type="p">20:知識資料庫</p>  
        <p type="p">30:管理系統</p>  
        <p type="p">40:操作裝置</p>  
        <p type="p">50:智能處理模組</p>  
        <p type="p">60:輸入介面</p>  
        <p type="p">70:客製化資料庫</p>  
        <p type="p">80:零件資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="431" publication-number="202613379"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613379.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613379</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136473</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多層彈性複合織物結構</chinese-title>  
        <english-title>MULTI-LAYER ELASTIC COMPOSITE FABRIC STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241105B">D03D15/56</main-classification>  
        <further-classification edition="202101120241105B">D03D15/258</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏英斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, YING-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏英斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, YING-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種多層彈性複合物結構，以解決過往織物結構無法100％化學回收的問題，包括：主體，其為一筒狀結構，該主體包含開口部、上段部、轉折段、下段部，以及封口部，其中，該開口部設置於該主體的一端，其一側對外敞開，另一側則連接至該上段部；該封口部設置於該主體設置有該開口部的另一端，該封口部連接至該下段部；該轉折段的一側與該上段部連接，其另一側則與該下段部連接；其中，該主體包括表紗部與底紗部，該表紗部位於該主體的外側，而該底紗部位於該主體的內側，並且，該表紗部採用聚酯材質的空氣複合紗所織成，該底紗部採用聚酯材質的複合彈性纖維織成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a multi-layer elastic composite fabric structure designed to solve the issue of non-100% chemical recyclable fabric structures. It includes a cylindrical body with an opening section, upper section, turning section, lower section, and a sealed section; the opening section is open on one side and connected to the upper section on the other; the sealed section is at the opposite end, connected to the lower section; the body is made up of an face yarn layer composed of Air-Textured polyester yarn and an plating yarn layer made from polyester composite elastic fiber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:主體</p>  
        <p type="p">10:開口部</p>  
        <p type="p">20:上段部</p>  
        <p type="p">30:轉折段</p>  
        <p type="p">40:下段部</p>  
        <p type="p">50:封口部</p>  
        <p type="p">60:表紗部</p>  
        <p type="p">70:底紗部</p>  
        <p type="p">80:縫合線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="432" publication-number="202614572"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614572.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614572</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136476</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>採用串列DAC的SAR　ADC、控制晶片及電子裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">H03M1/14</main-classification>  
        <further-classification edition="200601120241101B">H03M1/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京集創北方科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIPONE TECHNOLOGY (BEIJING) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉盛豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種採用串列DAC的SAR ADC，其具有一串列電荷重分配DAC及與該串列電荷重分配DAC耦接之一比較電路，該串列電荷重分配DAC具有一開關電路、一第一輸出電容及一第二輸出電容，且其特徵在於：該開關電路具有一第一輸入端以耦接一第一直流電壓、一第二輸入端以耦接一第二直流電壓、一第三輸入端以耦接一類比電壓、一第一輸出端及一第二輸出端；一第一輸出電容，耦接於該第一輸出端與一參考地之間以提供一第一輸出電壓；以及一第二輸出電容，耦接於該第二輸出端與該參考地之間以提供一第二輸出電壓；其中，該開關電路之工作時序包括一比較器偏移補償採樣階段，用以使該第三輸入端與該第一輸出端及該第二輸出端電氣連接以使該第一輸出電壓及該第二輸出電壓均等於該類比電壓以供該比較電路進行一偏移補償操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:SAR ADC</p>  
        <p type="p">110:串列電荷重分配DAC</p>  
        <p type="p">120:比較電路</p>  
        <p type="p">130:採樣電路</p>  
        <p type="p">140:時序控制單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="433" publication-number="202614783"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614783.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614783</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136477</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三維電容佈局、電子晶片及資訊處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250512B">H10D1/60</main-classification>  
        <further-classification edition="202501120250512B">H10D89/10</further-classification>  
        <further-classification edition="200601120250512B">H03M1/66</further-classification>  
        <further-classification edition="200601120250512B">H03M9/00</further-classification>  
        <further-classification edition="200601120250512B">H01L23/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京集創北方科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIPONE TECHNOLOGY (BEIJING) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉盛豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明主要揭示一種三維電容佈局，用以整合在一串行式數位類比轉換器(serial charge-based DAC)的積體電路之中，且主要包括：相互堆疊的N個金屬層與N-1個絕緣層，其中，任二個金屬層之間夾置有一個絕緣層，以通過該絕緣層所具有的複數個接觸孔(contact)而相互電性連接。依據本發明，各金屬層皆包括一下極板單元、二個第一上極板單元以及二個第二上極板單元，其中，該下極板單元包括複數個金屬條以圍出四個區域，且該二個第一上極板單元和該二個第二上極板單元位於四個區域內，使得任一個第一上極板單元與任一個第二上極板單元之間係通過該下極板單元而相互隔離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:三維電容佈局</p>  
        <p type="p">23:第三金屬層</p>  
        <p type="p">231:下極板單元</p>  
        <p type="p">2311:周圍金屬結構</p>  
        <p type="p">2312:隔離金屬結構</p>  
        <p type="p">2313:金屬柵欄結構</p>  
        <p type="p">23R1:第一區域</p>  
        <p type="p">23R2:第二區域</p>  
        <p type="p">23R3:第三區域</p>  
        <p type="p">23R4:第四區域</p>  
        <p type="p">232:第一上極板單元</p>  
        <p type="p">233:第二上極板單元</p>  
        <p type="p">25:第二絕緣層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="434" publication-number="202614573"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614573.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614573</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136478</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>採用串列DAC的SAR　ADC、控制晶片及電子裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">H03M1/14</main-classification>  
        <further-classification edition="200601120241101B">H03M1/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京集創北方科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIPONE TECHNOLOGY (BEIJING) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉盛豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種採用串列DAC的SAR ADC，其具有一串列電荷重分配DAC及與該串列電荷重分配DAC之一第一輸出端及一第二輸出端耦接之一比較電路，該比較電路具有一對軌至軌放大器、一對串接電容及一輸出放大電路；於操作時，該比較電路之工作時序包括一偏移補償採樣階段，在該偏移補償採樣階段中，該串列電荷重分配DAC之二輸出端均輸出一採樣電壓，且該輸出放大電路形成一單位增益組態，以使該對串接電容儲存該對軌至軌放大器及該輸出放大電路之輸入偏移電壓，從而在所述電壓比較階段中起到消除該比較電路之偏移電壓之作用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120:比較電路</p>  
        <p type="p">121:軌至軌放大器</p>  
        <p type="p">122:串接電容</p>  
        <p type="p">123:串接電容</p>  
        <p type="p">124:輸出放大器</p>  
        <p type="p">125:開關</p>  
        <p type="p">126:開關</p>  
        <p type="p">127:閂鎖比較器</p>  
        <p type="p">128:緩衝器</p>  
        <p type="p">129:反互斥或單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="435" publication-number="202613556"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613556.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613556</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136480</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種堆疊式測試裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">G01R1/02</main-classification>  
        <further-classification edition="200601120241104B">B65G49/07</further-classification>  
        <further-classification edition="202001120241104B">G01R31/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商無錫艾方芯動自動化設備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林德禮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許穎龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱創先</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種堆疊式測試裝置，包括：機台、測試機架、晶片放置區、移載總成、飛梭移動總成及移料臂總成，測試機架設置於機台上，測試機架設有多層測試槽，測試槽內設有可進出的測試載板，測試載板上設有用以承載晶片的數個測試單元；晶片放置區設置於測試機架一側的機台上；飛梭移動總成設置於晶片放置區一側的機台上；移載總成設置於機台上，移載總成用於將晶片於晶片放置區與飛梭移動總成之間進行轉運；移料臂總成設置於機台上，移料臂總成用以將晶片於飛梭移動總成與測試單元之間進行轉運，藉由本發明一種堆疊式測試裝置能在機台有限空間下進行更多晶片的測試。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:機台</p>  
        <p type="p">2:測試機架</p>  
        <p type="p">21:測試槽</p>  
        <p type="p">22:測試載板</p>  
        <p type="p">3:晶片放置區</p>  
        <p type="p">31:托盤承載機構</p>  
        <p type="p">4:移載總成</p>  
        <p type="p">41:取放頭</p>  
        <p type="p">5:飛梭移動總成</p>  
        <p type="p">51:往復移動機構</p>  
        <p type="p">52:飛梭載板</p>  
        <p type="p">53:承載治具</p>  
        <p type="p">6:移料臂總成</p>  
        <p type="p">61:吸取頭</p>  
        <p type="p">7:托盤</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="436" publication-number="202613020"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613020.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613020</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136481</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>螺旋排氣漏斗</chinese-title>  
        <english-title>SPIRAL EXHAUSTING FUNNEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">B67C11/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中信金學校財團法人中信科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CTBC UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳逸謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YAO-DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏福楨</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種螺旋排氣漏斗，其具有一漏斗，該漏斗的主體外側於預定多處往內凹陷而界定出複數凹槽，該主體內側則界定出複數凸條，藉此將該主體緊貼地置放於容器的口部，並將液體倒入該主體而使其流入容器內時，容器內的空氣會從該凹槽向外排出，藉此即可讓液體能夠順暢地流入容器內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention related to a spiral exhausting funnel. The outside of the main body of the funnel was recessed to form several grooves. And the inside of the main body defined several ribs. When the main body was put on an inlet of a container closely and the liquid was poured into the container through the main body, the air in the container would flow out through the grooves. So the liquid can flow into the container smoothly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:漏斗</p>  
        <p type="p">11:主體</p>  
        <p type="p">12:凹槽</p>  
        <p type="p">13:凸條</p>  
        <p type="p">14:握把</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="437" publication-number="202614351"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614351.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614351</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136482</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種用於晶圓掃描的夾持裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241206B">H01L21/687</main-classification>  
        <further-classification edition="200601120241206B">H01L21/67</further-classification>  
        <further-classification edition="200601120241206B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商無錫艾方芯動自動化設備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林德禮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於晶圓掃描的夾持裝置，包括：掃描單元及機台，掃描單元包括移動機構及至少一個掃描器，掃描器是以線性分佈的一掃描區進行掃描，移動機構負責帶動掃描器移動 ；機台於中央空間具有一作業區，掃描單元設置於機台且能對位於作業區的晶圓進行掃描，機台於作業區周圍設有至少四個電控座，每一個電控座控制一承接件移動並與晶圓接觸或分離，在掃描區移動掃描過程中，該掃描區經過的路徑中會控制該處承接件暫時與晶圓分離，並由另外至少三個承接件接續固定晶圓位置，藉此獲得正確的掃描影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:掃描單元</p>  
        <p type="p">11:移動機構</p>  
        <p type="p">12:掃描器</p>  
        <p type="p">15:側壁掃描器</p>  
        <p type="p">2:機台</p>  
        <p type="p">21:作業區</p>  
        <p type="p">22:電控座</p>  
        <p type="p">221:承接件</p>  
        <p type="p">222:圓弧壁</p>  
        <p type="p">23:支撐壁</p>  
        <p type="p">24:承載高台</p>  
        <p type="p">25:動力座</p>  
        <p type="p">251:載件</p>  
        <p type="p">252:弧形壁</p>  
        <p type="p">4:晶圓</p>  
        <p type="p">51:升降組件</p>  
        <p type="p">511:安裝架</p>  
        <p type="p">512:動力裝置</p>  
        <p type="p">52:吸附組件</p>  
        <p type="p">521:真空吸盤</p>  
        <p type="p">522:旋轉台</p>  
        <p type="p">523:旋轉電機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="438" publication-number="202614494"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614494.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614494</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136491</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器訊號傳輸系統及其連接器訊號傳輸方法、連接器總成與板端連接器</chinese-title>  
        <english-title>CONNECTOR SIGNAL TRANSMISSION SYSTEM, ALONG WITH ITS CONNECTOR SIGNAL TRANSMISSION METHOD, CONNECTOR ASSEMBLY, AND BOARD-END CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120250418B">H01R12/70</main-classification>  
        <further-classification edition="201101120250418B">H01R13/6597</further-classification>  
        <further-classification edition="200601120250418B">H01R4/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐虞企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TARNG YU ENTERPRISE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞唐虞電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN TARNG YU ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳盈仲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃睦容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, MU-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林顥軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HAO-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭志弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種連接器訊號傳輸系統及其連接器訊號傳輸方法、連接器總成與板端連接器，該連接器總成還包括可對接該板端連接器的線端連接器，且該連接器訊號傳輸系統係具有電路基板，其中，該電路基板係可於該板端連接器與該線端連接器的導電端子接觸後，以及該板端連接器與該線端連接器的導電端子對接到位後，令對該連接器總成傳輸訊號，如此，可以解決習知連接器總成所屬的多個連接器容易因對接未到位而無法有效傳輸訊號等技術問題，使得本申請的連接器總成可適時地傳輸訊號而在電子設備上的作用符合預期。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A connector signal transmission system, along with its connector signal transmission method, connector assembly, and board-end connector are described. The connector assembly also includes a wire-end connector capable of docking with the board-end connector. The connector signal transmission system features a circuit board. The circuit board is designed to transmit signals to the connector assembly after the conductive terminals of the board-end connector and wire-end connector make contact, and after the conductive terminals of the board-end connector and wire-end connector are properly docked. This setup addresses technical issues such as ineffective signal transmission due to incomplete docking of multiple connectors belonging to conventional connector assemblies. As a result, the connector assembly described in this application can timely transmit signals, ensuring its expected performance in electronic devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:連接器訊號傳輸系統</p>  
        <p type="p">11:電路基板</p>  
        <p type="p">110:控制模組</p>  
        <p type="p">111:訊號傳輸模組</p>  
        <p type="p">112:端子接觸偵測模組</p>  
        <p type="p">113:對接到位偵測模組</p>  
        <p type="p">12:連接器總成</p>  
        <p type="p">L1:第一連接器對接側</p>  
        <p type="p">L2:第二連接器對接側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="439" publication-number="202614634"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614634.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614634</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136492</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>VR設備與揚聲器間的延遲校正方法、電子裝置及儲存媒體</chinese-title>  
        <english-title>LATENCY CALIBRATION METHOD BETWEEN VR DEVICE AND SPEAKERS, ELECTRONIC DEVICE AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H04R5/04</main-classification>  
        <further-classification edition="200601120250203B">H04S3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商鴻運科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林栢滄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PO-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種VR設備與揚聲器間的延遲校正方法、電子裝置及儲存媒體，應用於電子裝置中，包括下列步驟：使一虛擬實境（Virtual reality，VR）裝置與複數揚聲器配對連接；計算該VR裝置到該些揚聲器的複數音訊時間延遲；以及根據該些音訊時間延遲並通過數位訊號處理器（Digital Signal Processor，DSP）即時運算校正該些揚聲器欲發送的複數音頻訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A latency calibration method between VR device and speakers is disclosed. A VR device is paired and connected with a plurality of speakers. Multiple audio time latencies from the VR device to the speakers are calculated. a plurality of audio signals to be sent by the speakers are calibrated according to the audio time latencies via the digital signal processor (DSP) real-time calculation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10..S30:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="440" publication-number="202614680"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614680.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614680</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136494</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>內埋元件電路板及其製造方法</chinese-title>  
        <english-title>CIRCUIT BOARD WITH EMBEDDED COMPONENT AND FABRICATING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250122B">H05K1/03</main-classification>  
        <further-classification edition="200601120250122B">H05K1/16</further-classification>  
        <further-classification edition="200601120250122B">H05K3/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商宏啟勝精密電子(秦皇島)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商鵬鼎控股(深圳)股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鵬鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃智勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZHI-YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林原宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出一種內埋元件電路板及其製造方法，內埋元件電路板包含線路基板、金屬板、多個電子元件、絕緣材料以及兩層線路層。線路基板包含連通線路基板的相對兩側的容置開槽，而金屬板設置於線路基板的容置開槽內並與線路基板連接。金屬板包含一凹槽，而此凹槽的開口朝向線路基板的其中一側。電子元件設置於金屬板的凹槽內並與金屬板連接。絕緣材料設置於線路基板並覆蓋金屬板、電子元件以及部分線路基板。線路層分別設置於線路基板的相對兩側，而金屬板、電子元件以及絕緣材料位於線路層之間，且其中一線路層電性連接至電子元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit board with embedded components and a fabricating method of the same are provided. The circuit board with embedded components includes a circuit base board, a metal board, a plurality of electronic components, an insulation material and two circuit layers. The circuit base board includes a storage cavity connecting two opposite sides of the circuit base board, while the metal board is disposed inside the storage cavity and is connected to the circuit base board. The metal board includes a cavity whose opening faces one side of the circuit base board. The electronic components are disposed inside the cavity and are connected to the metal board. The insulation material is disposed on the circuit base board and covers the metal board, the electronic components and a part of the circuit base board. The circuit layers are disposed on two opposite sides of the circuit base board. The metal board, the electronic components and the insulation material are between the circuit layers, while one of the circuit layers is electrically connected to the electronic components.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:內埋元件電路板</p>  
        <p type="p">110:線路基板</p>  
        <p type="p">112:絕緣層</p>  
        <p type="p">114a,114b,180a,180b:線路層</p>  
        <p type="p">115:容置開槽</p>  
        <p type="p">120:金屬板</p>  
        <p type="p">122,124:凹槽</p>  
        <p type="p">122b:底面</p>  
        <p type="p">126:固定元件</p>  
        <p type="p">140a,140b,140c:第一電子元件</p>  
        <p type="p">141a,141b,141c:第一端面</p>  
        <p type="p">142a,142b,142c:第二端面</p>  
        <p type="p">144:接墊</p>  
        <p type="p">150a,150b:第二電子元件</p>  
        <p type="p">160:絕緣材料</p>  
        <p type="p">170:導電孔</p>  
        <p type="p">C1,C2,C3:連接區</p>  
        <p type="p">DR:分隔區</p>  
        <p type="p">d1,d2,d3:間距</p>  
        <p type="p">t1,t2:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="441" publication-number="202613978"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613978.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613978</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136498</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雞隻疾病的檢測及預警系統</chinese-title>  
        <english-title>DETECTION AND EARLY WARNING SYSTEM FOR CHICKEN DISEASE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250203B">G06V40/10</main-classification>  
        <further-classification edition="202201120250203B">G06V10/40</further-classification>  
        <further-classification edition="202201120250203B">G06V20/52</further-classification>  
        <further-classification edition="200601120250203B">A01K29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中興大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNG HSING UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡燿全</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YAO-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡秀芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, HSIU-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃仁弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JEN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昱傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳膺介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳銘文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, MING-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雞隻疾病的檢測及預警系統，包含：攝影裝置，用以擷取雞隻的影像；雲端模組，連接該攝影裝置，用以接收並且儲存該影像；運算模組，連接該雲端模組，用以辨識該影像以獲得雞冠子影像以及眼睛子影像中的至少一者，而相應分析該雞冠子影像的雞冠色彩、雞冠外觀以及該眼睛子影像的眼睛外觀中的至少一者，以根據經分析到的該雞冠色彩的結果、該雞冠外觀的結果以及該眼睛外觀的結果中的至少一者來判斷異常雞隻的有無，並輸出代表異常雞隻存在的警示訊息；以及預警模組，連接該運算模組，用以接收該警示訊息並根據該警示訊息發出警報。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A detection and early warning system for chicken disease is disclosed. The detection and early warning system for chicken disease comprises: a photography device used to capture images of chickens; a cloud module connected to the photography device, used to receive and store the images; a computing module connected to the cloud module, used to identify the images to obtain at least one of a cockscomb sub-image and an eye sub-image, and to correspondingly analyze at least one of cockscomb color of the cockscomb sub-image, cockscomb appearance of the cockscomb sub-image, and eye appearance of the eye sub-image, so that presence of abnormal chickens can be determined based on at least one of analyzed results of the cockscomb color, the comb appearance, and the eye appearance, and to output a warning message representing existence of the abnormal chickens; and an early warning module connected to the computing module to receive the warning message and to issue an alarm based on the warning message.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:攝影裝置</p>  
        <p type="p">2:雲端模組</p>  
        <p type="p">21:伺服器</p>  
        <p type="p">22:雲端資料庫</p>  
        <p type="p">3:運算模組</p>  
        <p type="p">4:預警模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="442" publication-number="202614459"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614459.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614459</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136499</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋰離子電池矽基負極材料的預鋰化方法及其產物</chinese-title>  
        <english-title>PRELITHIATION METHOD OF SILICON-BASED ANODE MATERIALS FOR LITHIUM-ION BATTERIES AND PRODUCTS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120241008B">H01M4/1395</main-classification>  
        <further-classification edition="201001120241008B">H01M4/134</further-classification>  
        <further-classification edition="201001120241008B">H01M10/0525</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊怡君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林子淇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TZU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>段興宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUAN, HSING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳祐頎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容提供一種鋰離子電池矽基負極材料的預鋰化方法，包括：(a)將一第一聯苯衍生物與一第二聯苯衍生物溶解於一有機溶劑中形成一混合溶液；(b)將一鋰金屬溶解於該混合溶液中形成一預鋰化溶劑；以及(c)將一矽基負極材料浸泡在該預鋰化溶劑中一預定時間，得到一預鋰化矽基負極材料。本揭露內容還提供一種以該預鋰化方法製備出的矽基負極材料，以及使用該矽基負極材料製備的鋰離子電池的負極與鋰離子電池。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a prelithiation method for silicon-based anode materials for lithium ion batteries, including: (a) dissolving a first biphenyl derivative and a second biphenyl derivative in an organic solvent to form a mixed solution ; (b) dissolving a lithium metal in the mixed solution to form a pre-lithiation solvent; and (c) soaking a silicon-based anode material in the pre-lithiation solvent for a predetermined time to obtain a pre-lithiation silicon based anode material. The present disclosure also provides a silicon-based anode material produced by using the prelithiation method, an anode for a lithium-ion battery and a lithium-ion battery manufactured using the silicon-based anode material.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="443" publication-number="202614377"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614377.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614377</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136500</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝及半導體封裝的製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">H01L23/28</main-classification>  
        <further-classification edition="200601120241029B">H01L23/043</further-classification>  
        <further-classification edition="200601120241029B">H01L21/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>典琦科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMCHIP TECHNOLOGY CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴建志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIENCHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林泓彣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUNGWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體封裝包含第一晶粒、第二晶粒、模壓材以及導電層。第一晶粒具有第一導電件。第二晶粒位於第一晶粒下方，且具有第二導電件，其中第一導電件位於第一晶粒背對該第二晶粒的表面上，且第二導電件位於第二晶粒背對第一晶粒的表面上。模壓材具有第一部分及第二部分，其中第一部分與第二部分分別圍繞第一晶粒及第二晶粒，且第一導電件與第二導電件分別位於模壓材的第一部分與第二部分中。導電層位於模壓材的外側壁上，延伸到模壓材的第一部分的頂面及模壓材的第二部分的底面至少其中一者，且電性接觸第一導電件與第二導電件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor package includes a first die, a second die, a molding compound and a conductive layer. The first die has a first conductive element. The second die is located below the first die and has a second conductive element, in which the first conductive element is located on a surface of the first die facing away from the second die, and the second conductive element is located on a surface of the second die facing away from the first die. The molding compound has a first portion and a second portion, in which the first portion and the second portion surround the first die and the second die, respectively, and the first conductive element and the second conductive element are located in the first portion and the second portion of the molding compound, respectively. The conductive layer is located on the outer sidewall of the molding compound, extends to at least one of a top surface of the first portion of the molding compound and a bottom surface of the second portion of the molding compound, and electrically contacts with the first conductive element and the second conductive element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體封裝</p>  
        <p type="p">110A:第一晶粒</p>  
        <p type="p">110B:第二晶粒</p>  
        <p type="p">112A:第一導電件</p>  
        <p type="p">112B:第二導電件</p>  
        <p type="p">120:模壓材</p>  
        <p type="p">122:第一部分</p>  
        <p type="p">124:第二部分</p>  
        <p type="p">130:導電層</p>  
        <p type="p">132:垂直部</p>  
        <p type="p">134A,134B:水平部</p>  
        <p type="p">140:金屬保護層</p>  
        <p type="p">150:導熱層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="444" publication-number="202614378"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614378.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614378</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136501</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓合方法及裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">H01L23/28</main-classification>  
        <further-classification edition="200601120241204B">H01L21/56</further-classification>  
        <further-classification edition="200601120241204B">B32B38/00</further-classification>  
        <further-classification edition="200601120241204B">B32B37/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬潤科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALL RING TECH CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王安田</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉泰宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種壓合方法及裝置；該壓合方法包括：提供一待壓合物，其在一積體電路元件的上側罩覆一上蓋，並設有高度不同的複數個壓合區段於該上蓋；提供一下壓模，設有供該待壓合物承放的一支撐座；提供一上壓模，可受驅動而相對該下壓模作上下位移；該上壓模設有一驅力機構驅動的一壓塊機構；該壓塊機構設有對應複數個壓塊模組；當對該待壓合物作壓合時，先使該上壓模下降至該壓塊機構壓觸該上蓋，再使該驅力機構驅動該壓塊機構的各該壓塊模組分別對該上蓋的各該壓合區段施加壓力；藉此可對該待壓合物不同高度的壓合區段施加壓力。</p> 
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      <isu-abst lang="en"> 
        <p type="p"/> 
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      <representative-img> 
        <p type="p">C:驅力機構</p>  
        <p type="p">C2:活塞</p>  
        <p type="p">C3:柱塞</p>  
        <p type="p">C31:受力部</p>  
        <p type="p">C32:壓桿</p>  
        <p type="p">C41:驅動桿</p>  
        <p type="p">D:壓塊機構</p>  
        <p type="p">D1:第一壓塊模組</p>  
        <p type="p">D11:第一壓塊組件</p>  
        <p type="p">D113:抵壓件</p>  
        <p type="p">D3:第三壓塊模組</p>  
        <p type="p">D312:抵壓件</p>  
        <p type="p">W:待壓合物</p>  
        <p type="p">W2:上蓋</p>  
        <p type="p">W211:第一壓合區段</p>  
        <p type="p">W213:第三壓合區段</p> 
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        <document-id> 
          <doc-number>113136502</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓合方法及裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241025B">H01L21/603</main-classification>  
        <further-classification edition="200601120241025B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬潤科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALL RING TECH CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王安田</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉泰宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種壓合方法及裝置；該壓合方法，包括：提供一待壓合物；提供一下壓模，設有供該待壓合物承放的一支撐座；提供一上壓模，可受驅動而相對該下壓模作上下位移；該上壓模設有可受驅動作上下位移的柱塞及可受該柱塞壓抵的壓塊機構；一荷重量測單元位於該柱塞與該壓塊機構間；當對該待壓合物作壓合時，先使該上壓模下降至該壓塊機構壓觸該待壓合物，再驅動該柱塞壓抵該荷重量測單元，以偵測該柱塞受驅動對該待壓合物的施加壓力；藉此可對施加的壓力作精準的掌控。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">D11:第一壓塊組件</p>  
        <p type="p">D111:固定件</p>  
        <p type="p">D114:定位槽</p>  
        <p type="p">D115:荷重量測單元</p>  
        <p type="p">D116:承載區間</p>  
        <p type="p">D21:第二壓塊組件</p>  
        <p type="p">D211:固定件</p>  
        <p type="p">D214:定位槽</p>  
        <p type="p">D31:第三壓塊組件</p>  
        <p type="p">D311:固定件</p>  
        <p type="p">D313:定位槽</p> 
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        <document-id> 
          <doc-number>113136503</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓合方法及裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241025B">H01L21/603</main-classification>  
        <further-classification edition="200601120241025B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬潤科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALL RING TECH CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王安田</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉泰宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種壓合方法及裝置；該壓合方法，包括：提供一待壓合物，設有複數個壓合區段於該待壓合物的一上表面；提供一下壓模，設有供該待壓合物承放的一支撐座；提供一上壓模，可受驅動而相對該下壓模作上下位移；該上壓模設有一驅力機構與可受該驅力機構驅動的一壓塊機構，該壓塊機構設有複數個分別各自獨立且分離的壓塊模組；當對該待壓合物作壓合時，該上壓模的該壓塊機構壓觸該待壓合物的該上表面，各該壓塊模組分別各對該待壓合物的各該壓合區段施加壓力；藉此使不同的該壓合區段可以分別各自承受獨立的施力，以符合不同的該壓合區段受力需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">C:驅力機構</p>  
        <p type="p">C117:下座體</p>  
        <p type="p">C14:套固件</p>  
        <p type="p">C32:壓桿</p>  
        <p type="p">C321:定位部</p>  
        <p type="p">C32A:第一群組</p>  
        <p type="p">C32B:第二群組</p>  
        <p type="p">C32C:第三群組</p>  
        <p type="p">D11:第一壓塊組件</p>  
        <p type="p">D111:固定件</p>  
        <p type="p">D112:微調件</p>  
        <p type="p">D113:抵壓件</p>  
        <p type="p">D21:第二壓塊組件</p>  
        <p type="p">D211:固定件</p>  
        <p type="p">D212:微調件</p>  
        <p type="p">D213:抵壓件</p>  
        <p type="p">D31:第三壓塊組件</p>  
        <p type="p">D311:固定件</p>  
        <p type="p">D312:抵壓件</p> 
      </representative-img> 
    </description> 
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        <document-id> 
          <doc-number>113136504</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓合方法及裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241210B">H01L21/603</main-classification>  
        <further-classification edition="200601120241210B">H01L21/67</further-classification> 
      </classification-ipc>  
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        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬潤科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALL RING TECH CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王安田</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉泰宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種壓合方法及裝置；該壓合方法包括：提供一待壓合物、一下壓模及一上壓模；該上壓模設有一驅力機構與可受該驅力機構驅動的一壓塊機構；該驅力機構設有可容置流體的一容室、可藉位移改變該容室中該流體壓力的一活塞、及可作上下位移的柱塞；壓合時，該壓塊機構壓觸該待壓合物的該上表面，使該壓塊機構對該柱塞施加向上之壓力，該驅力機構再以該活塞對該容室內流體作用，間接經由該流體對該柱塞施予反向壓力，而使該柱塞對該待壓合物施壓；藉此使單一該活塞之驅動力擴增至多個柱塞的驅動力，並確保壓塊機構壓觸該待壓合物時的下壓施力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">C:驅力機構</p>  
        <p type="p">C1:本體</p>  
        <p type="p">C11:座體</p>  
        <p type="p">C111:容室</p>  
        <p type="p">C112:柱塞通道</p>  
        <p type="p">C113:通孔</p>  
        <p type="p">C114:擋件</p>  
        <p type="p">C115:靠座</p>  
        <p type="p">C116:上座體</p>  
        <p type="p">C117:下座體</p>  
        <p type="p">C12:封蓋</p>  
        <p type="p">C121:活塞通道</p>  
        <p type="p">C122:軸座</p>  
        <p type="p">C123:端口</p>  
        <p type="p">C124:通孔</p>  
        <p type="p">C125:擋件</p>  
        <p type="p">C13:襯套</p>  
        <p type="p">C14:套固件</p>  
        <p type="p">C141:軸孔</p>  
        <p type="p">C2:活塞</p>  
        <p type="p">C21:上端部</p>  
        <p type="p">C211:推抵部</p>  
        <p type="p">C22:下端部</p>  
        <p type="p">C3:柱塞</p>  
        <p type="p">C31:受力部</p>  
        <p type="p">C32:壓桿</p>  
        <p type="p">C322:聯結件</p>  
        <p type="p">C32A:第一群組</p>  
        <p type="p">C32B:第二群組</p>  
        <p type="p">C32C:第三群組</p>  
        <p type="p">C41:驅動桿</p>  
        <p type="p">D:壓塊機構</p>  
        <p type="p">D11:第一壓塊組件</p>  
        <p type="p">D111:固定件</p>  
        <p type="p">D112:微調件</p>  
        <p type="p">D113:抵壓件</p>  
        <p type="p">D115:荷重量測單元</p>  
        <p type="p">D31:第三壓塊組件</p>  
        <p type="p">D311:固定件</p>  
        <p type="p">D312:抵壓件</p>  
        <p type="p">D4:螺固件</p>  
        <p type="p">F34:下滑座</p>  
        <p type="p">F341:鏤空區間</p>  
        <p type="p">S:流體</p> 
      </representative-img> 
    </description> 
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        <document-id> 
          <doc-number>113136509</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清掃規劃方法、裝置、電子設備及儲存介質</chinese-title>  
        <english-title>METHOD FOR PLANNING CLEANING, DEVICE, ELECTRONIC DEVICE AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">G01C21/34</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧志德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHIH-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭錦斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHIN-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周育楷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YU-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種清掃規劃方法、裝置、電子設備及儲存介質。所述方法包括：採集清掃資源資訊及複數個待清掃地區的環境監測數據；依據每個待清掃地區的環境監測數據，預測所述每個待清掃地區的衛生狀態等級；根據所述清掃資源資訊及所述複數個待清掃地區的衛生狀態等級，生成所述複數個待清掃地區對應的清掃方案。利用上述方法，能夠提高垃圾收集效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a method for planning cleaning, a device, an electronic device and a storage medium. The method includes: collecting cleaning resource information and environmental monitoring data of a plurality of areas to be cleaned; predicting a level of sanitation status for each area to be cleaned based on the environmental monitoring data of each area; and generating a corresponding cleaning plan for the plurality of areas to be cleaned according to the cleaning resource information and the levels of sanitation statuses of the plurality of areas. By utilizing the present application, the efficiency of garbage collection can be improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S13:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="449" publication-number="202612774"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612774.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612774</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136520</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>被動式油煙分離機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">B01D45/14</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林國臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林國臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種被動式油煙分離機，包括：一密閉空間旁設一抽風空間，密閉空間往前設一入風口，密閉空間往抽風空間方向設一油霧分離器，抽風空間旁設一馬達與內設一抽風葉輪動力連接，油霧分離器內部氣體得導通抽送至抽風葉輪，抽風空間側邊設一出風口，使抽風葉輪送出氣體由出風口排出，主要於：密閉空間內之入風口處設一支撐架及至少一軸承組裝一被動葉輪，馬達驅動抽風葉輪轉動得使密閉空間產生負壓，進而使大量油煙由入風口被抽吸進入，其抽吸之油煙因氣流通過使被動葉輪得以一直旋轉，並使抽吸之油煙得大量擴散快速通過將油甩出，讓油霧分離器得以更全面及更有效的分解去除油煙者。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">10:密閉空間</p>  
        <p type="p">11:入風口</p>  
        <p type="p">20:抽風空間</p>  
        <p type="p">21:出風口</p>  
        <p type="p">30:油霧分離器</p>  
        <p type="p">40:馬達</p>  
        <p type="p">50:抽風葉輪</p>  
        <p type="p">60:被動葉輪</p>  
        <p type="p">601:攔油網</p>  
        <p type="p">61:支撐架</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="450" publication-number="202612715"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612715.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612715</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136530</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樟芝萃取物用以製備調控NRF2蛋白的醫藥組合物的用途</chinese-title>  
        <english-title>USE OF ANTRODIA CINNAMOMEA EXTRACT FOR PREPARING PHARMACEUTICAL COMPOSITION FOR REGULATING NRF2 PROTEIN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">A61K36/07</main-classification>  
        <further-classification edition="200601120241101B">A61K31/575</further-classification>  
        <further-classification edition="200601120241101B">A61K31/341</further-classification>  
        <further-classification edition="200601120241101B">A61K31/4015</further-classification>  
        <further-classification edition="200601120241101B">A61K31/365</further-classification>  
        <further-classification edition="200601120241101B">A61P39/06</further-classification>  
        <further-classification edition="200601120241101B">A61P29/00</further-classification>  
        <further-classification edition="200601120241101B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葡萄王生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRAPE KING BIO LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭靜娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHING-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃致翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勁初</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIN-CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林定威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱心彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, HSIN-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林靖倚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JING-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曉苓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSIAO-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種樟芝萃取物的用途，所述樟芝萃取物具有調控Nrf2蛋白活化所介導的訊息傳遞下游路徑之功效。藉此，樟芝萃取物可用於製備調控Nrf2蛋白的醫藥組合物，並有相關市場的應用潛力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a use of &lt;i&gt;Antrodia cinnamomea&lt;/i&gt;extract. The &lt;i&gt;Antrodia cinnamomea&lt;/i&gt;extract has a capability to regular the downstream of the Nrf2 activation-mediated signal pathway. Therefore, the &lt;i&gt;Antrodia cinnamomea&lt;/i&gt;extract can be used to prepare a pharmaceutical composition for regulating Nrf2 protein, and has application potential in the relevant market.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="451" publication-number="202612775"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612775.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612775</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136559</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兼具多功能實質環保效益的船舶專用脫硫系統及其裝置</chinese-title>  
        <english-title>MULTIFUNCTION SHIP-SPECIFIC DESULFURIZATION SYSTEM HAVING SUBSTANTIAL ENVIRONMENTAL EFFECTS AND DEVICE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B01D53/18</main-classification>  
        <further-classification edition="200601120241105B">B01D53/50</further-classification>  
        <further-classification edition="200601120241105B">B01D53/56</further-classification>  
        <further-classification edition="200601120241105B">B01D53/79</further-classification>  
        <further-classification edition="200601120241105B">B63H21/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立高雄科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL KAOHSIUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊春陵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂家彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種兼具多功能實質環保效益的船舶專用脫硫系統及其裝置，主要的目的在採用閉迴路的脫硫循環系統，透過中和劑將廢氣中的硫氧化物、氮氧化物進行脫硫並淨化廢氣，使產生的廢氣符合防汙公約的規定外，用於收集殘留物的氧化區加入如石灰反應形成硫酸鈣，透過離心機脫水將硫酸鈣等反應物分離，而分離後的中和劑還原能再次進行脫硫處理，過程不會將廢水排入海洋，不會造成水汙染的情況發生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multifunction ship-specific desulfurization system having substantial environmental effects and a device thereof are disclosed. The main objective is to apply a closed-loop desulfurization circulation system to desulfurize sulfur oxides and nitrogen oxides in the flue gas through a neutralizing agent, and to purify the flue gas, so that the generated flue gas will meet the standards of MARPOL Annex Regulations. Lime is added, for example, and react with residues collected and kept in the oxidation area to produce calcium sulfate; calcium sulfate and reactants then are dehydrated and separated through a centrifuge; after the separation treatment, the neutralizing agent undergoes the reduction process and can be recycled for desulfurization treatments again. Waste water will not be discharged to the ocean during the desulfurization process and seawater will not be polluted.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:淨化塔</p>  
        <p type="p">11:進氣管</p>  
        <p type="p">12:渦輪機</p>  
        <p type="p">13:排氣管</p>  
        <p type="p">14:氣體感應器</p>  
        <p type="p">20:柴油機</p>  
        <p type="p">30:加壓泵</p>  
        <p type="p">1:網孔式除霧器</p>  
        <p type="p">2:多層噴淋裝置</p>  
        <p type="p">21:霧化噴頭</p>  
        <p type="p">22:集氣環</p>  
        <p type="p">23:加壓空氣通道</p>  
        <p type="p">3:射流震盪器</p>  
        <p type="p">4:氧化區</p>  
        <p type="p">41:鹼性液體注入管</p>  
        <p type="p">42:離心設備</p>  
        <p type="p">5:吸收區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="452" publication-number="202612673"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612673.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612673</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136563</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可攜式按摩裝置</chinese-title>  
        <english-title>PORTABLE MASSAGE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241106B">A61H23/00</main-classification>  
        <further-classification edition="200601120241106B">A61H23/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>智晶光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISECHIP SEMICONDUCTOR INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉文欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, WEN-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡永誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YUNG-CHENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高然星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, JAN-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂艾侖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, AI-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林柏欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PO-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許郁莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可攜式按摩裝置，包括：殼體、揚聲震動單元、控制單元及環形彈性體。殼體具有對外的出音口，揚聲震動單元及控制單元均安裝於殼體內，且揚聲震動單具有朝向出音口的一個震動源；控制單元則可驅動揚聲震動單元自震動源產生震動訊號。環形彈性體可與殼體相結合並環繞出音口。環形彈性體可與皮膚表面相貼合以阻隔震動訊號，避免震動訊號的洩漏。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a portable massage device, including: a casing, a speaker-vibration unit, a control unit and an annular elastic body. The casing has an external sound outlet, the speaker-vibration unit and the control unit are both disposed within the casing, and the speaker-vibration unit has a vibration source facing the external sound outlet; the control unit can drive the speaker-vibration unit to generate vibration signals from the vibration source. The annular elastic body can be combined with the casing and surround the external sound outlet. The annular elastic body can fit with the surface of the body's skin to block vibration signals and avoid leakage of vibration signals.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:容置空間</p>  
        <p type="p">S2:腔室</p>  
        <p type="p">SF:皮膚表面</p>  
        <p type="p">SW:震動訊號</p>  
        <p type="p">LW:光源訊號</p>  
        <p type="p">RW:遠紅外線</p>  
        <p type="p">1:可攜式按摩裝置</p>  
        <p type="p">10:殼體</p>  
        <p type="p">11:蓋體</p>  
        <p type="p">12:底蓋</p>  
        <p type="p">121:出音口</p>  
        <p type="p">20:環形彈性體</p>  
        <p type="p">30:揚聲震動單元</p>  
        <p type="p">31:震動源</p>  
        <p type="p">40:發光元件</p>  
        <p type="p">50:供電單元</p>  
        <p type="p">60:控制單元</p>  
        <p type="p">9:固定元件</p>  
        <p type="p">91:固定座</p>  
        <p type="p">911:通孔</p>  
        <p type="p">92:固定帶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="453" publication-number="202614803"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614803.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614803</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136567</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D30/47</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>世界先進積體電路股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連羿韋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIEN, YI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭韋志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, WEI-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡信錩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, HSIN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許浩青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HAO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例提供半導體裝置。半導體裝置包括基板、閘極結構、第一層間介電層、源極結構、汲極結構、介電圖案、第一場板以及第二場板。閘極結構設置於基板上。第一層間介電層設置於基板上，且部分覆蓋閘極結構。源極結構以及汲極結構設置於基板上，且位於閘極結構的兩側。介電圖案設置於閘極結構與汲極結構之間的第一層間介電層上。第一場板設置於基板上，且覆蓋閘極結構與介電圖案之間的第一層間介電層以及介電圖案。第二場板設置於第一場板以及介電圖案的上方，且朝汲極結構延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments provide a semiconductor device. The semiconductor device includes a substrate, a gate structure, a first interlayer dielectric layer, a source structure, a drain structure, a dielectric pattern, a first field plate and a second field plate. The gate structure is disposed on the substrate. The first interlayer dielectric layer is disposed on the substrate and partially covers the gate structure. The source structure and the drain structure are disposed on the substrate and located on opposite sides of the gate structure. The dielectric pattern is disposed on the first interlayer dielectric layer between the gate structure and the drain structure. The first field plate is disposed on the substrate and covers the first interlayer dielectric layer between the gate structure and the dielectric pattern and the dielectric pattern. The second field plate is disposed above the first field plate and the dielectric pattern and extends toward the drain structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100,110:方向</p>  
        <p type="p">200:基板</p>  
        <p type="p">200T,208T,210T,212T:頂面</p>  
        <p type="p">202:緩衝層</p>  
        <p type="p">204:通道層</p>  
        <p type="p">206:阻障層</p>  
        <p type="p">208:閘極層</p>  
        <p type="p">208E:邊緣</p>  
        <p type="p">210,216,226:層間介電層</p>  
        <p type="p">212:介電圖案</p>  
        <p type="p">212T1:第一部分</p>  
        <p type="p">212T2:第二部分</p>  
        <p type="p">212S1,212S2,214S1,214S2,218S1,218S2,230S-S:側面</p>  
        <p type="p">214:第一場板</p>  
        <p type="p">214-1T,214-2T,218-1T,218-2T:上表面</p>  
        <p type="p">218:第二場板</p>  
        <p type="p">218G:閘極電極層</p>  
        <p type="p">220:閘極結構</p>  
        <p type="p">230S:源極結構</p>  
        <p type="p">230D:汲極結構</p>  
        <p type="p">500A:半導體裝置</p>  
        <p type="p">D1:第一距離</p>  
        <p type="p">D2:第二距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="454" publication-number="202613460"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613460.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613460</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136568</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>照射設備及其控氧系統</chinese-title>  
        <english-title>IRRADIATION APPARATUS AND OXYGEN CONTROL SYSTEM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250613B">F24F11/30</main-classification>  
        <further-classification edition="200601120250613B">F24F13/20</further-classification>  
        <further-classification edition="201401120250613B">G01N21/3504</further-classification>  
        <further-classification edition="201801320250613B">F24F110/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>志聖工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>C SUN MFG. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳承翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHENG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林順德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHUN-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種照射設備包含光源裝置、輸送系統及控氧系統。其中控氧系統包含用以於光源裝置周圍定義控氧區域的氣體範圍限制裝置，用以將氣體提供至光源裝置及控氧區域的氣體供應模組，用以偵測控氧區域的氧氣濃度的含氧偵測器，及連接控制氣體範圍限制裝置、氣體供應模組及含氧偵測器的控制模組，且控制模組根據氧氣濃度控制氣體供應模組而調整氣體的供氣條件，以使控氧區域的氧氣濃度維持在設定範圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An irradiation apparatus includes a light source device, a conveying system, and an oxygen control system. The oxygen control system includes a gas confining device for defining an oxygen control region around the light source device, a gas supplying module for providing a gas to the light source device and the oxygen control region, an oxygen detector for detecting an oxygen concentration in the oxygen control region, and a control module connected to the gas confining device, the gas supplying module and the oxygen detector for controlling the gas supplying module, based on the detected oxygen concentration, to adjust a gas supplying condition of the gas, so as to maintain the oxygen concentration in the oxygen control region within a predetermined range.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:照射設備</p>  
        <p type="p">10:光源裝置</p>  
        <p type="p">21:輸送帶</p>  
        <p type="p">34:氣體範圍限制裝置</p>  
        <p type="p">36:抽氣裝置</p>  
        <p type="p">37:設置平台</p>  
        <p type="p">38:遮擋件</p>  
        <p type="p">40:操作界面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="455" publication-number="202613676"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613676.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613676</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136571</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241209B">G02F1/1333</main-classification>  
        <further-classification edition="200601120241209B">G02F1/1335</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許明貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, MING-KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂映儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YING-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃昱琮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余雅各</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, YA-KE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾任黴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, REN-MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種顯示裝置，包含後殼、背光模組、光學膜片、框件以及面板模組。背光模組設置於後殼上方。光學膜片設置於背光模組上。面板模組設置於光學膜片上方，並與後殼形成第一內部空間。框件設置於光學膜片及面板模組之間，且框件之不同側邊分別具有第一開口以及第二開口。背光模組、光學膜片以及框件位於第一內部空間中。面板模組、框件以及光學膜片間形成第二內部空間。第一內部空間以及第二內部空間藉由框件之第一開口以及第二開口互相連通。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device is disclosed, wherein the display device includes a back shell, a backlight module, an optical film, a frame and a panel module. The backlight module is disposed above the back shell. The optical film is disposed on the backlight module. The panel module is disposed above the optical film and forms a first internal space with the back shell. The frame is disposed between the optical film and the panel module, wherein different sides of the frame have first openings and second openings respectively. The backlight module, the optical film and the frame are located in the first internal space. A second internal space is formed between the panel module, the frame and the optical film. The first internal space and the second internal space are connected to each other through the first opening and the second opening of the frame.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:後殼</p>  
        <p type="p">200:背光模組</p>  
        <p type="p">300:光學膜片</p>  
        <p type="p">400:框件</p>  
        <p type="p">410:第一開口</p>  
        <p type="p">420:第二開口</p>  
        <p type="p">500:面板模組</p>  
        <p type="p">510:液晶面板</p>  
        <p type="p">520:面板玻璃</p>  
        <p type="p">610:內循環風扇</p>  
        <p type="p">710:第一內部空間</p>  
        <p type="p">720:第二內部空間</p>  
        <p type="p">900:顯示裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="456" publication-number="202613462"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613462.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613462</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136577</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>溫度調控方法、裝置、設備及儲存介質</chinese-title>  
        <english-title>TEMPERATURE CONTROL METHOD, DEVICE, APPARATUS AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241105B">F24F11/80</main-classification>  
        <further-classification edition="200601120241105B">G05D23/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊榮浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JUNG-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧志德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHIH-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭錦斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHIN-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種溫度調控方法、裝置、設備及儲存介質，溫度調控方法包括：獲取建築物內多個區域之即時環境資料，及獲取不同區域之溫控設備之目標溫度，即時環境資料包括溫度資料、人員活動資料；利用預設之人工智慧模型，基於即時環境資料，預測出每個區域之溫度變化趨勢，及識別出不同區域之間之溫度差異資訊；利用預設之策略預測模型，基於溫度變化趨勢、溫度差異資訊及目標溫度，動態調整溫控設備之運行參數。本申請實現了對建築內部溫度之即時監測、智慧分析與動態調控，提升了建築物內部之溫度管理效率與居住舒適度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a temperature control method, a device, an apparatus and a storage medium. The temperature control method includes: obtaining real-time environmental data of a plurality of areas in a building, and obtaining target temperatures of temperature control apparatuses in different areas, the real-time environmental data including temperature data and personnel activity data; based on the real-time environmental data, predicting a temperature trend of each area by using a preset artificial intelligence model, and identifying temperature differences between different areas; based on the temperature trend, the temperature difference and the temperature difference, dynamically adjusting operating parameters of the temperature control apparatuses by using a preset strategy prediction model. This application can realize the real-time monitoring, intelligent analysis and dynamic regulation of the temperatures inside the building, and improves the efficiency of temperature management and living comfort inside the building.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S14:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="457" publication-number="202614557"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614557.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614557</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136581</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體布局圖案以及射頻電路布局圖案</chinese-title>  
        <english-title>SEMICONDUCTOR LAYOUT PATTERN AND RADIO FREQUENCY CIRCUIT LAYOUT PATTERN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">H03F3/213</main-classification>  
        <further-classification edition="200601120250102B">H03F3/195</further-classification>  
        <further-classification edition="202001120250102B">G06F30/39</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃智顯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李易晉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭淳良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHUN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴聖輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI, SHENG-HUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體布局圖案，包含一基底，基底上定義有一主動區，多個閘極結構位於主動區內，多個摻雜區，位於主動區內，其中主動區內所包含的些多個閘極結構以及多個摻雜區組成一第一放大器與一第二放大器，第一放大器與第二放大器相互串聯，且第一放大器的一汲極摻雜區以及第二放大器的一源極摻雜區共用同一個摻雜區。本發明具有節省元件空間以及提升放大器效能的優點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a semiconductor layout pattern, which comprises a substrate, an active region is defined on the substrate, a plurality of gate structures are located in the active region, and a plurality of doped regions are located in the active region, wherein the plurality of gate structures and doped regions contained in the active region form a first amplifier and a second amplifier, the first amplifier and the second amplifier are connected in series with each other, and a drain doped region of the first amplifier and a source doped region of the second amplifier share the same doped region. The invention has the advantages of saving element space and improving the efficiency of the amplifier.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">AA:主動區</p>  
        <p type="p">CT:接觸結構</p>  
        <p type="p">CS:第一放大器</p>  
        <p type="p">CS-D:第一放大器的汲極</p>  
        <p type="p">CS-G:第一放大器的閘極</p>  
        <p type="p">CS-S:第一放大器的源極</p>  
        <p type="p">CG:第二放大器</p>  
        <p type="p">CG-D:第二放大器的汲極</p>  
        <p type="p">CG-G:第二放大器的閘極</p>  
        <p type="p">CG-S:第二放大器的源極</p>  
        <p type="p">D:汲極</p>  
        <p type="p">D1:第一汲極摻雜區</p>  
        <p type="p">D2:第二汲極摻雜區</p>  
        <p type="p">G:閘極結構</p>  
        <p type="p">G1:第一閘極結構</p>  
        <p type="p">G2:第二閘極結構</p>  
        <p type="p">M1:金屬導線層</p>  
        <p type="p">M2:金屬導線層</p>  
        <p type="p">S:源極</p>  
        <p type="p">S1:第一源極摻雜區</p>  
        <p type="p">S2:第二源極摻雜區</p>  
        <p type="p">Sub:基底</p>  
        <p type="p">SD:源/汲極摻雜區</p>  
        <p type="p">SD3:共用摻雜區</p>  
        <p type="p">STI:淺溝隔離</p>  
        <p type="p">VG1:電壓源</p>  
        <p type="p">VG2:電壓源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="458" publication-number="202612751"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612751.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612751</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136594</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鼻液吸取裝置</chinese-title>  
        <english-title>NASAL ASPIRATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241031B">A61M15/08</main-classification>  
        <further-classification edition="200601120241031B">A61M1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許宏興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HUNG HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許宏興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HUNG HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖玉惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湛隆蕣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種鼻液吸取裝置，包含：一吸鼻元件用以插入鼻腔，並吸取鼻液；一儲存元件，用以暫存鼻液；一手動抽氣元件，包含：一彈性殼體、一筒身、一連桿、一吸力盤及一異形推板；筒身係懸掛設置於彈性殼體內，具有一頂部及一底部，頂部連接至儲存元件；連桿設置於筒身內，並向下延伸至筒身外；吸力盤為彈性材質，設置於筒身內，受連桿拉動而產生形變；異形推板設置於筒身與彈性殼體之間，當彈性殼體受外力向內擠壓時，使異形推板產生可自主回彈之形變，並帶動連桿及吸力盤向下移動，使筒身內部壓力改變而產生吸力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a nasal aspirator, including an aspiration unit for insertion into the nasal cavity to extract nasal liquid; a storage unit for temporarily holding the nasal liquid; a manual suction unit, including: an elastic casing, a cylinder, a connecting rod, a suction cup, and a irregularly shaped push plate. The cylinder, including a top and a bottom, is suspended within an elastic casing with the top connected to a storage unit. The connecting rod is located inside the cylinder and extends downward outside the cylinder. The suction cup, made of elastic material, is placed inside the cylinder and deforms when pulled by the connecting rod. The irregularly shaped push plate is positioned between the cylinder and the elastic casing. When the elastic casing is compressed inward by external force, the irregularly shaped push plate deforms in a self-rebounded state, driving the connecting rod and the suction cup downward. This movement alters the internal pressure of the cylinder and generates suction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鼻液吸取裝置</p>  
        <p type="p">10:吸鼻元件</p>  
        <p type="p">20:儲存元件</p>  
        <p type="p">21:儲存蓋</p>  
        <p type="p">22:儲存槽</p>  
        <p type="p">23:容置空間</p>  
        <p type="p">24:吸鼻管</p>  
        <p type="p">25:導氣管</p>  
        <p type="p">30:手動抽氣元件</p>  
        <p type="p">31:筒身</p>  
        <p type="p">311:頂部</p>  
        <p type="p">312:進氣口</p>  
        <p type="p">313:進氣閥門</p>  
        <p type="p">314:排氣口</p>  
        <p type="p">315:排氣閥門</p>  
        <p type="p">316:底部</p>  
        <p type="p">318:閥門固定蓋</p>  
        <p type="p">32:連桿</p>  
        <p type="p">33:吸力盤</p>  
        <p type="p">34:異形推板</p>  
        <p type="p">35:彈性殼體</p>  
        <p type="p">40:防塵蓋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="459" publication-number="202612804"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612804.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612804</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136596</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於室溫處理有機廢棄物的集成化系統</chinese-title>  
        <english-title>INTEGRATED SYSTEM FOR PROCESSING ORGANIC WASTE AT ROOM TEMPERATURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241011B">B09B3/00</main-classification>  
        <further-classification edition="202201120241011B">B09B3/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連橫生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORIGINLIMIT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>宜蘭縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申川機械工廠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOON STRONG MACHINERY WORKS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>宜蘭縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許玉樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YU SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡瀚霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童行</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於室溫處理有機廢棄物的集成化系統，包括收集模塊、精細化模塊、攪拌模塊、材料產出模塊及控制模塊。收集模塊包括有機廢棄物儲存單元及與其相通的進料口。儲存單元通過一個輸送機將有機廢棄物輸送至精細化模塊中，然後將精細化有機廢棄物輸送至含有菌種的攪拌模塊中，最終將經菌種活化的材料輸送至材料產出模塊並裝桶。控制模塊包括控制單元及至少一個感測器與電氣控制箱電路連接，電氣控制箱內的電路進一步與各模塊連接，以監控和控制各模塊在該集成化系統中安全運行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated system for ambient temperature treatment of organic waste, including a collection module, a refinement module, a mixing module, a material output module, and a control module. The collection module includes an organic waste storage unit and a feed inlet communicating with it. The storage unit transports organic waste to the refinement module via a conveyor, then the refined organic waste is conveyed to the mixing module containing microbial strains, and finally, the material activated by the microbial strains is transported to the material output module and filled into barrels. The control module consists of a control unit and at least one sensor connected to the electrical control box circuitry, which is further connected to each module to monitor and control the safe operation of each module in the integrated system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:集成化系統</p>  
        <p type="p">11:殼體</p>  
        <p type="p">101:收集模塊</p>  
        <p type="p">102:精細化模塊</p>  
        <p type="p">103:攪拌模塊</p>  
        <p type="p">104:材料產出模塊</p>  
        <p type="p">105:控制模塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="460" publication-number="202614424"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614424.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614424</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136603</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製作方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241203B">H01L23/522</main-classification>  
        <further-classification edition="200601120241203B">H01L23/535</further-classification>  
        <further-classification edition="200601120241203B">H01L21/762</further-classification>  
        <further-classification edition="200601120241203B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林大鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, DA-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施易安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, YI-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡濱祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, BIN-SIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馥郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, FU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體結構，包含：一矽覆絕緣（SOI）基板，包含一基底板、位於該基底板上的一埋入氧化物層，以及位於該埋入氧化物層上的一元件層；一電路元件，設置於該元件層上且被該SOI基板中的一溝槽隔離區圍繞；以及一埋入電源軌，嵌入在該溝槽隔離區和該埋入氧化物層中，其中，該埋入電源軌透過該埋入氧化物層和該溝槽隔離區中的溝槽填充氧化物與該元件層隔離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure includes a SOI substrate having a base substrate, a buried oxide layer on the base substrate, and a device layer on the buried oxide layer. A circuit element is disposed on the device layer and surrounded by a trench isolation region in the SOI substrate. A buried power rail is embedded in the trench isolation region and the buried oxide layer. The buried power rail is isolated from the device layer by the buried oxide layer and a trench-fill oxide in the trench isolation region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體結構</p>  
        <p type="p">100:矽覆絕緣基板</p>  
        <p type="p">110:主動區域</p>  
        <p type="p">111:基底板</p>  
        <p type="p">112:埋入氧化物層</p>  
        <p type="p">113:元件層</p>  
        <p type="p">120:溝槽填充氧化物</p>  
        <p type="p">210:閘極氧化層</p>  
        <p type="p">220:高介電常數(high-k)材料層</p>  
        <p type="p">230:阻障層</p>  
        <p type="p">280:蝕刻停止層</p>  
        <p type="p">310:介電層</p>  
        <p type="p">320:介電層</p>  
        <p type="p">360:硬遮罩層</p>  
        <p type="p">400:導電層</p>  
        <p type="p">420:氧化物襯墊層</p>  
        <p type="p">BPR:埋入電源軌</p>  
        <p type="p">D:電路元件</p>  
        <p type="p">DR:摻雜區</p>  
        <p type="p">IT:溝槽隔離區</p>  
        <p type="p">LI:區域內連線</p>  
        <p type="p">MG:金屬閘極</p>  
        <p type="p">TSV:穿板通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="461" publication-number="202613145"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613145.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613145</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136607</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>CsPbBr3鈣鈦礦奈米晶體、其製備方法及包含其之鈣鈦礦膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">C07F7/24</main-classification>  
        <further-classification edition="202301120241105B">H10K30/50</further-classification>  
        <further-classification edition="202301120241105B">H10K85/50</further-classification>  
        <further-classification edition="201101120241105B">B82Y30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中山大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝淑貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, SHU CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種CsPbBr &lt;sub&gt;3&lt;/sub&gt;鈣鈦礦奈米晶體，其特徵係該CsPbBr &lt;sub&gt;3&lt;/sub&gt;鈣鈦礦奈米晶體摻雜苝四甲酸二酐（PTCDA），該PTCDA係藉由C=O基團的氧原子與該CsPbBr &lt;sub&gt;3&lt;/sub&gt;鈣鈦礦奈米晶體的鉛原子形成鍵結。本發明亦提供一種製備前述CsPbBr &lt;sub&gt;3&lt;/sub&gt;鈣鈦礦奈米晶體的方法，其特徵係於製備CsPbBr &lt;sub&gt;3&lt;/sub&gt;前驅物溶液時加入PTCDA。本發明亦提供一種包含前述CsPbBr &lt;sub&gt;3&lt;/sub&gt;鈣鈦礦奈米晶體的鈣鈦礦膜。藉由本發明之於CsPbBr &lt;sub&gt;3&lt;/sub&gt;鈣鈦礦中摻雜PTCDA的方法，可以獲得缺陷密度降低、高濕度環境中的穩定性提升，同時具有增強的電子傳輸能力的摻雜PTCDA的CsPbBr &lt;sub&gt;3&lt;/sub&gt;鈣鈦礦。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="462" publication-number="202614092"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614092.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614092</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136610</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>核能電廠除役過渡階段前期安全監督系統</chinese-title>  
        <english-title>SAFETY SUPERVISION SYSTEM FOR THE EARLY STAGE OF TRANSITION PHASE OF DECOMMISSIONING NUCLEAR POWER PLANTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241128B">G21D3/04</main-classification>  
        <further-classification edition="200601120241128B">G21C17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國家原子能科技研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL ATOMIC RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林玉婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅武斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, WU-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅崇功</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, CHUNG-KUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種核能電廠安全監督系統，可提供核能電廠計算機組除役過渡階段前期排程中每天之風險。在除役過渡階段前期的風險計算功能設計中，採用檔案輸入的方式，讀取使用者所準備的完整除役過渡階段前期排程，初步先行過濾排程中所可能隱含的錯誤訊息，即時於頁面顯示錯誤來源與相關訊息，提供使用者修訂錯誤參考。當核能電廠安全監管系統讀取合理的除役過渡階段前期排程後，即開始以小時為單位進行為期150天除役過渡階段前期排程的風險計算，使用者可利用所提供的風險分析結果，尋求最適合的因應措施及改善方案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a nuclear power plant safety supervision system, which can provide daily risks in the early schedule of the decommissioning transition phase of the nuclear power plant. In the design of the risk calculation function in the early stage of the decommissioning transition phase, the file input method is used to read the complete early stage decommissioning transition stage schedule prepared by the user, and initially filter out the error messages that may be hidden in the schedule, and instantly display error sources and related information on the page to provide users with reference for correcting errors. When the nuclear power plant safety supervision system reads the reasonable pre-decommissioning transition stage schedule, it will start to calculate the risk of the 150-day decommissioning transition stage pre-stage schedule on an hourly basis. Users can use the provided risk analysis results, seeking the most appropriate response measures and improvement plans.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:核能電廠除役過渡階段前期安全監督系統</p>  
        <p type="p">14:定性風險處理模組</p>  
        <p type="p">15:定量風險評估模組</p>  
        <p type="p">16:緊要安全狀態分布模組</p>  
        <p type="p">17:緊要安全功能與其支援系統狀態顯示模組</p>  
        <p type="p">18:緊要安全功能管理準則模組</p>  
        <p type="p">19:風險輪廓模組</p>  
        <p type="p">20:維修計畫分析計算模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="463" publication-number="202614787"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614787.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614787</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136618</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蕭特基二極體及其製作方法</chinese-title>  
        <english-title>SCHOTTKY DIODE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D8/60</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李國興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KUO-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛勝元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSUEH, SHENG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃鼎翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃冠凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, GUAN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白啟宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAI, CHI-HORN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種製作蕭特基二極體的方法，其主要先形成一鰭狀結構於一基底上，然後形成一磊晶層於該鰭狀結構內，形成一第一接觸插塞於該磊晶層上，再形成一第二接觸插塞於該磊晶層旁之該鰭狀結構上。其中該第一接觸插塞包含歐姆接觸而第二接觸插塞則包含蕭特基接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for fabricating a Schottky diode includes the steps of first forming a fin-shaped structure on a substrate, forming an epitaxial layer in the fin-shaped structure, forming a first contact plug on the epitaxial layer, and then forming a second contact plug on the fin-shaped structure adjacent to the epitaxial layer. Preferably, the first contact plug includes an ohmic contact and the second contact plug includes a Schottky contact.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:基底</p>  
        <p type="p">14:鰭狀結構</p>  
        <p type="p">16:淺溝隔離</p>  
        <p type="p">18:閘極結構</p>  
        <p type="p">20:閘極結構</p>  
        <p type="p">26:側壁子</p>  
        <p type="p">28:磊晶層</p>  
        <p type="p">30:層間介電層</p>  
        <p type="p">40:金屬閘極</p>  
        <p type="p">42:介質層</p>  
        <p type="p">44:高介電常數介電層</p>  
        <p type="p">46:功函數金屬層</p>  
        <p type="p">48:低阻抗金屬層</p>  
        <p type="p">50:硬遮罩</p>  
        <p type="p">52:接觸插塞</p>  
        <p type="p">54:接觸插塞</p>  
        <p type="p">56:層間介電層</p>  
        <p type="p">58:矽化金屬層</p>  
        <p type="p">102:二極體區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="464" publication-number="202613682"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613682.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613682</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136633</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250121B">G02F1/1335</main-classification>  
        <further-classification edition="200601120250121B">G02B5/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊承諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴名柔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, MING-JOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡嘉豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置，包括基板、電路層、濾光層以及介質層。電路層設置在基板上，且電路層包括訊號線。濾光層設置在電路層上，且濾光層包括多個濾光圖案。多個濾光圖案的其中一個濾光圖案包括第一弧角以及第二弧角，第一弧角與第二弧角鄰近於訊號線。濾光層設置在電路層與介質層之間。其中，第一弧角的曲率半徑不同於第二弧角的曲率半徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device including a substrate, a circuit layer, a color filter layer and a medium layer is disclosed. The circuit layer is disposed on the substrate and includes a signal line. The color filter layer is disposed on the circuit layer and includes a plurality of color filter patterns. One of the color filter patterns includes a first arc angle and a second arc angle, and the first arc angle and the second arc angle are adjacent to the signal line. The color filter layer is disposed between the circuit layer and the medium layer. A curvature radius of the first arc angle is different from a curvature radius of the second arc angle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">210:訊號線</p>  
        <p type="p">300:濾光層</p>  
        <p type="p">310:濾光圖案</p>  
        <p type="p">311:第一濾光圖案</p>  
        <p type="p">312:第二濾光圖案</p>  
        <p type="p">313:第三濾光圖案</p>  
        <p type="p">C1:第一弧角</p>  
        <p type="p">C2:第二弧角</p>  
        <p type="p">C3,C4:弧角</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">ED:電子裝置</p>  
        <p type="p">GL:掃描線</p>  
        <p type="p">R1,R2:曲率半徑</p>  
        <p type="p">V1:孔洞</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="465" publication-number="202612913"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612913.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612913</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136636</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多頁循環式雙面列印方法</chinese-title>  
        <english-title>MULTI-PAGE CIRCULATING DUPLEX PRINTING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250122B">B41J3/60</main-classification>  
        <further-classification edition="200601120250122B">B41J13/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虹光精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVISION INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周科良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, KE LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃敏童</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, MIN TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉信金</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多頁循環式雙面列印方法包含以下步驟：在一列印單元列印一第一文件的一正面後，從一第一通道饋出並饋回第一文件至一反轉通道；在列印單元列印一第二文件的一正面後，從一第二通道饋出並饋回第二文件至反轉通道；在列印單元列印一第三文件的一正面後，從第一通道饋出並饋回第三文件至反轉通道；在列印單元列印第一文件的一背面後，從第二通道饋出第一文件至一出紙匣；在列印單元列印第二文件的一背面後，從第二通道饋出第二文件至出紙匣；以及在列印單元列印第三文件的一背面後，從第二通道饋出第三文件至出紙匣，藉此提升列印速度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-page circulating duplex printing method includes steps of: printing a front side of a first document using a printing unit and then partially feeding and fully retracting the first document from a first passage to a reverse passage; printing a front side of a second document using the printing unit and then partially feeding and fully retracting the second document from a second passage to the reverse passage; printing a front side of a third document using the printing unit and then partially feeding and fully retracting the third document from the first passage to the reverse passage; printing a backside of the first document using the printing unit and then transporting the first document from the second passage to a discharge tray; printing a backside of the second document using the printing unit and then transporting the second document from the second passage to the discharge tray; and printing a backside of the third document using the printing unit and then transporting the third document from the second passage to the discharge tray, so that a printing speed is increased.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S01~S13:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="466" publication-number="202613683"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613683.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613683</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136637</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241209B">G02F1/1335</main-classification>  
        <further-classification edition="200601120241209B">G01J3/28</further-classification>  
        <further-classification edition="200601120241209B">G02F1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商群豐駿科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARUX TECHNOLOGY PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭亦顓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YI-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊舜臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHUN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳其偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林子翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TZU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置。電子裝置包括面板以及超延遲膜。超延遲膜設置在面板上。當面板顯示白畫面時，於面板的出光表面量測出的光譜具有第一主波。第一主波的第一波峰大於或等於580 nm且小於或等於680 nm，且第一主波具有第一半高寬範圍，第一半高寬範圍大於或等於15 nm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an electronic device and a transportation device. The electronic device includes a panel and a super retardation film. The super retardation film is disposed on the panel, when the panel displays a white screen, a spectrum measured on a light emitting surface of the panel has a first main wave. A first peak of the first main wave is greater than or equal to 580 nm and less than or equal to 680 nm, and the first main wave has a first full width at half maximum, and a range of the first full width at half maximum is greater than or equal to 15 nm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:電子裝置</p>  
        <p type="p">100:背光模組</p>  
        <p type="p">110:顯示模組</p>  
        <p type="p">111:面板</p>  
        <p type="p">112:上偏光板</p>  
        <p type="p">113:下偏光板</p>  
        <p type="p">120:超延遲膜</p>  
        <p type="p">130:黏著層</p>  
        <p type="p">L:光束</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="467" publication-number="202612912"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612912.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612912</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136640</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋼材之鐳射打印機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241030B">B41J3/413</main-classification>  
        <further-classification edition="200601120241030B">B41J3/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣達國際機械有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃建程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林湧群</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹銘煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓修齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鋼材之鐳射打印機，設一機台，機台上方設一上移動鐳射機構，上鐳射機構設三個第一鐳射裝置，各第一鐳射裝置驅動一鐳射單元沿X軸向、Y軸向及Z軸向移動，分別對應鋼材之左側面、頂面及右側面鐳射標記；一下移動鐳射機構設於上移動鐳射機構下方，具有一個第二鐳射裝置，第二鐳射裝置驅動其鐳射單元沿X軸向、Y軸向及Z軸向移動，對鋼材底面鐳射標記；下移動鐳射機構之前、後方分別設一傳送裝置，各傳送裝置藉由二相對設置之導入擋板輔助導正鋼材，以二輔助夾具夾持穩固鋼材導送位置，再由一主動滾軸推動鋼材移動至加工位置進行標記。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:機台</p>  
        <p type="p">101:中控裝置</p>  
        <p type="p">1:上移動鐳射機構</p>  
        <p type="p">11:上排軌道</p>  
        <p type="p">12:支撐柱</p>  
        <p type="p">13:第一鐳射裝置</p>  
        <p type="p">2:下移動鐳射機構</p>  
        <p type="p">4:傳送裝置</p>  
        <p type="p">6:下滾送裝置</p>  
        <p type="p">61:下滾送軸</p>  
        <p type="p">62:軸座</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="468" publication-number="202613294"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613294.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613294</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136643</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高效能細胞培養容器</chinese-title>  
        <english-title>HIGH-PERFORMANCE CELL CULTURE CONTAINER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">C12M1/00</main-classification>  
        <further-classification edition="200601120241101B">C12M3/02</further-classification>  
        <further-classification edition="200601120241101B">C12M3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美榮生醫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CELLFABS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱運輸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIOU, YUN-SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林上智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHANG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林永昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種高效能細胞培養容器，包括：一罐體由一罐底部向上延伸有一罐身部與一容置口，該罐身部由該罐底部向該容置口方向渦旋繞設有至少一導流條，一蓋體蓋合於該罐體，該蓋體中央處開設有一蓋口，且該蓋體設有一第一結合部與一第二結合部，該第一結合部處以一蓋板遮蓋於該蓋口，一連結架以一框體固定於該第一結合部與該第二結合部，該框體容置該蓋體，且該框體鏤空形成有至少一流通口，又該框體向該罐底部延伸有一桿體，且該桿體末端設有一固定部，而該固定部設置有一功能組件，透過該功能組件的替換實現兼具懸浮型與貼壁型的細胞培養功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A high-performance cell culture container comprises: a container body extending upward from a base to form a body section and an accommodating opening. The body section has at least one flow guide strip spirally arranged from the base toward the opening. A lid is fitted onto the container body, with a central opening formed at its center. The lid has a first and second coupling section, and a cover plate is positioned over the central opening at the first coupling section. A connecting frame is fixed to both the first and second coupling sections, with the frame housing the lid. The frame is hollowed out to form at least one flow opening, and it extends toward the base of the container, ending in a rod. At the end of the rod is a fixed component, which is equipped with a functional module. Through the replacement of the functional module, the container can be used for both suspension and adherent cell culture functions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:罐體</p>  
        <p type="p">11:罐底部</p>  
        <p type="p">111:定位凹穴</p>  
        <p type="p">12:罐身部</p>  
        <p type="p">121:導流條</p>  
        <p type="p">13:容置口</p>  
        <p type="p">14:夾持部</p>  
        <p type="p">20:蓋體</p>  
        <p type="p">21:蓋口</p>  
        <p type="p">22:窗口</p>  
        <p type="p">221:透氣膜</p>  
        <p type="p">25:蓋板</p>  
        <p type="p">26:軸桿</p>  
        <p type="p">27:彈性體</p>  
        <p type="p">30:連結架</p>  
        <p type="p">31:框體</p>  
        <p type="p">311:流通口</p>  
        <p type="p">32:桿體</p>  
        <p type="p">321:固定部</p>  
        <p type="p">40:功能組件</p>  
        <p type="p">41:擾流件</p>  
        <p type="p">411:翼片</p>  
        <p type="p">412:穿孔</p>  
        <p type="p">42:鎖固件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="469" publication-number="202613851"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613851.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613851</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136644</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於硬體資訊來產生軟體的授權元件的系統</chinese-title>  
        <english-title>SYSTEM FOR GENERATING AUTHORIZATION COMPONENT OF SOFTWARE BASED ON HARDWARE INFORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250203B">G06F21/10</main-classification>  
        <further-classification edition="201301120250203B">G06F21/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>粘雅真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIEN, YA CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊于霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, YU TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐昱誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OU, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種基於硬體資訊來產生軟體的授權元件的系統。所述系統包括處理器。處理器接收被授權裝置的硬體資訊，且處理器利用硬體資訊來決定是否允許被授權裝置；處理器對硬體資訊執行加密操作來獲得加密後的硬體資訊；處理器接收軟體的軟體授權時間，且處理器對軟體授權時間執行加密操作來獲得加密後的軟體授權時間；處理器利用軟體的程式碼來獲得混淆與編譯後的程式碼；處理器利用加密後的硬體資訊、加密後的軟體授權時間以及混淆與編譯後的程式碼來產生軟體的授權元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for generating an authorization component of a software based on hardware information is provided. The system includes a processor. The processor receives the hardware information of an authorized device, and the processor uses the hardware information to determine whether to allow the authorized device; the processor performs an encryption operation on the hardware information to obtain the encrypted hardware information; the processor receives a software authorization time of the software from an authorization initiating device, and the processor performs an encryption operation on the software authorization time to obtain the encrypted software authorization time; the processor uses a program code of the software to obtain the obfuscated and compiled program code; the processor uses the encrypted hardware information, the encrypted software authorization time, and the obfuscated and compiled program code to generate the authorization component of the software.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基於硬體資訊來產生軟體的授權元件的系統</p>  
        <p type="p">120:處理器</p>  
        <p type="p">130:授權裝置</p>  
        <p type="p">131:開發端授權裝置</p>  
        <p type="p">132:客戶端授權裝置</p>  
        <p type="p">140:授權元件</p>  
        <p type="p">300:被授權裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="470" publication-number="202614597"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614597.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614597</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136646</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種管理多個企業專網案場狀態的方法及電腦可讀儲存介質</chinese-title>  
        <english-title>A METHOD FOR MANAGING STATUS OF MULTIPLE ENTERPRISE PRIVATE NETWORK AND COMPUTER-READABLE STORAGE MEDIA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250203B">H04L41/50</main-classification>  
        <further-classification edition="202201120250203B">H04L41/0246</further-classification>  
        <further-classification edition="202301120250203B">G06Q10/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中華電信股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張振遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHEN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>温英佐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, YING-TSO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳世偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓敏儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, MIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種管理多個企業專網案場狀態的方法及電腦可讀儲存介質，方法包括獲取企業案場中各設備的告警清單；依據告警清單判斷是否有告警；以及獲取企業案場的案場狀態，以提供給維運人員快速獲知企業案場當下的運作狀況，維運人員可依據不同案場狀態來選擇要優先關注處理的企業案場，提升維運效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for managing status of multiple enterprise private network and computer-readable storage media are provided, the method includes obtaining an alarm list of each device in an enterprise case; determining whether there are any alarms according to the alarm list; and obtaining case status of the enterprise case to provide maintenance personnel with a quick understanding of the current operating status of the enterprise case, maintenance and operation person can select priority enterprise case according to different case statuses to improve maintenance efficiency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101、S102、S103、S104、S105、S106、S107、S108、S109、S110、S111、S112:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="471" publication-number="202614674"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614674.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614674</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136648</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>柔性電路板</chinese-title>  
        <english-title>FLEXIBLE CIRCUIT BOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">H05K1/02</main-classification>  
        <further-classification edition="200601120250418B">H05K3/00</further-classification>  
        <further-classification edition="200601120250418B">H05K3/38</further-classification>  
        <further-classification edition="200601120250418B">H01R4/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳煒福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEI-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂佳蘋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHIA-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種柔性電路板適於經由膠層電性接合至目標基板上。柔性電路板包括基材與多個接合引腳。基材具有基材邊緣。多個接合引腳沿著排列方向排列在基材上，且鄰近基材邊緣。基材在這些接合引腳的任兩相鄰者之間設有至少一孔洞，且至少一孔洞沿著排列方向重疊於這些接合引腳。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flexible circuit board adapted to be electrically bonded to a target substrate via an adhesive layer is provided. The flexible circuit board includes a substrate and a plurality of bonding leads. The substrate has a substrate edge. The plurality of bonding leads are arranged on the substrate along an arrangement direction, and adjacent to the substrate edge. The substrate is provided with at least one hole between any two adjacent bonding leads, and the at least one hole overlap the bonding leads along the arrangement direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:柔性電路板</p>  
        <p type="p">20:目標基板</p>  
        <p type="p">100:基材</p>  
        <p type="p">100e:基材邊緣</p>  
        <p type="p">100h1、100h2:孔洞</p>  
        <p type="p">100p1、100p2:部分</p>  
        <p type="p">120:接合引腳</p>  
        <p type="p">141、142:導電圖案</p>  
        <p type="p">141e、142e:圖案邊緣</p>  
        <p type="p">180:對位記號</p>  
        <p type="p">200:基板</p>  
        <p type="p">200e:基板邊緣</p>  
        <p type="p">210:天線電極</p>  
        <p type="p">215:饋入線</p>  
        <p type="p">220:接地電極</p>  
        <p type="p">230:虛設電極</p>  
        <p type="p">DA:顯示區</p>  
        <p type="p">he1、he2:孔洞邊緣</p>  
        <p type="p">S、Sa、Sb:間距</p>  
        <p type="p">W1、W2、Wa、Wb:寬度</p>  
        <p type="p">X、Y、Z:方向</p>  
        <p type="p">A-A’、B-B’:剖線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="472" publication-number="202613677"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613677.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613677</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136650</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241120B">G02F1/1333</main-classification>  
        <further-classification edition="200601120241120B">G09F11/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃郁淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何恕德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, SHU-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包括一框架、一可撓顯示模組、一輸送機構及一支撐機構。可撓顯示模組可彎曲地收合於框架的一容置槽且具有一側邊。輸送機構包括一輸送組件及一鏈條組件。鏈條組件設置於可撓顯示模組。輸送組件設置於框架且適於帶動鏈條組件移動。支撐機構設置於框架且樞接於側邊。當可撓顯示模組處於一收合模式時，輸送機構沿一收合方向帶動鏈條組件移動，以使可撓顯示模組彎折地沿收合方向移動至容置槽內。當可撓顯示模組處於一展開模式時，輸送機構沿相反於收合方向的一展開方向帶動鏈條組件移動，以使可撓顯示模組沿展開方向移出容置槽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a frame, a flexible display module, a conveying mechanism and a support mechanism. The flexible display module is bendably folded in a receiving trough and has a lateral side. The conveying mechanism includes a conveying assembly and a chain assembly. The chain assembly is disposed on the flexible display module. The conveying mechanism is disposed in the frame and is adapted to drive the chain assembly to move. The support mechanism is disposed in the frame and is pivotally connected to the lateral side. When the flexible display module is in a folding mode, the conveying mechanism drives the chain assembly to move in a folding direction so that the flexible display module bendably moves into a receiving trough in the folding direction. When the flexible display module is in an unfolding mode, the conveying mechanism drives the chain assembly to move in an unfolding direction opposite to the folding direction, so that the flexible display module moves out of the receiving trough in the unfolding direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示裝置</p>  
        <p type="p">110:可撓顯示模組</p>  
        <p type="p">112:側邊</p>  
        <p type="p">112a:兩端</p>  
        <p type="p">112b:中央區</p>  
        <p type="p">140:鏈條組件</p>  
        <p type="p">146:鏈條單元</p>  
        <p type="p">156a:第一連動子部</p>  
        <p type="p">157a:第三連動子部</p>  
        <p type="p">200:殼體</p>  
        <p type="p">202:開口</p>  
        <p type="p">R:顯示區域</p>  
        <p type="p">R1:第一區</p>  
        <p type="p">R2:第二區</p>  
        <p type="p">X2:展開方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="473" publication-number="202613910"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613910.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613910</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136658</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兼具專利管理功能以及結構化專利閱讀功能的專利管理整合系統</chinese-title>  
        <english-title>PATENT MANAGEMENT INTEGRATED SYSTEM WITH BOTH PATENT MANAGEMENT FUNCTIONS AND STRUCTURED PATENT READING FUNCTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250203B">G06Q10/10</main-classification>  
        <further-classification edition="201201120250203B">G06Q50/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雲拓科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTEGRAL SEARCH INTERNATIONAL LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳邑宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志青</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種兼具專利管理功能以及結構化專利閱讀功能的專利管理整合系統，包含：專利管理子系統以及結構化專利閱讀子系統。專利管理子系統提供專利管理功能。結構化專利閱讀子系統提供該結構化專利閱讀功能。結構化專利閱讀子系統具有結構化專利閱讀模組並儲存有專利閱讀資料。結構化專利閱讀模組提供結 構化專利閱讀介面以供使用者以結構化專利閱讀方式閱讀專利閱讀資料中的說明書資料、請求項資料及圖式資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A patent management integrated system with both patent management functions and structured patent reading functions, includes: a patent management subsystem and a structured patent reading subsystem. The patent management subsystem provides the patent management functions. The structured patent reading subsystem provides the structured patent reading functions. The structured patent reading subsystem has a structured patent reading module and stores patent reading data. The structured patent reading module provides a structured patent reading interface for users to read specification data, claim data and drawing data in the patent reading data in a structured patent reading manner.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:專利管理整合系統</p>  
        <p type="p">1:專利管理子系統</p>  
        <p type="p">11:提案模組</p>  
        <p type="p">12:審核模組</p>  
        <p type="p">13:申請模組</p>  
        <p type="p">14:答辯模組</p>  
        <p type="p">15:年費管理模組</p>  
        <p type="p">16:專利支出管理模組</p>  
        <p type="p">17:專利移轉模組</p>  
        <p type="p">18:專利分析模組</p>  
        <p type="p">2:結構化專利閱讀子系統</p>  
        <p type="p">21:結構化專利閱讀模組</p>  
        <p type="p">22:書目資料分析模組</p>  
        <p type="p">23:資料傳遞模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="474" publication-number="202612882"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612882.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612882</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136659</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輕質氣泡水泥的配料泵送一體化生產裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">B28C9/02</main-classification>  
        <further-classification edition="200601120241230B">B28C5/38</further-classification>  
        <further-classification edition="200601120241230B">B28C7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林憬寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林憬良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林憬寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林憬良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種輕質氣泡水泥的配料泵送一體化生產裝置，包括用以實現帶包裝上料、拆包及供料的一乾料給料機、用以攪拌製備料漿的一攪拌製備機；以及用以提送泵送充填的一泵送充填主機；該乾料給料機與該攪拌製備機之間具有可拆卸的一定位連接構件，該定位連接構件用以通過連接關係確保該乾料給料機與該攪拌製備機之間的位置關係，從而保證粉料提升機構的粉料出口與該攪拌製備機的乾料入口的精準快速連接；該乾料給料機的皮帶輸送機構為可折疊結構，且其拆疊動作觸發聯動該粉料提升機構翻轉；該粉料提升機構為可翻轉結構，且其翻轉動作觸發聯動該定位連接構件。本發明實現了各設備自身的結構空間優化以及整體設備在裝配要求中的對位連接，一方面能夠適用更多對空間要求的場景，另一方面也提高了整體裝置的裝配連接效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">100:乾料給料機</p>  
        <p type="p">200:攪拌製備機</p>  
        <p type="p">300:泵送充填主機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="475" publication-number="202614072"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614072.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614072</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136668</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快閃記憶體裝置及其抹除方法</chinese-title>  
        <english-title>FLASH MEMORY APPARATUS AND ERASING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">G11C16/14</main-classification>  
        <further-classification edition="200601120250102B">G11C16/34</further-classification>  
        <further-classification edition="200601120250102B">G11C16/06</further-classification>  
        <further-classification edition="202301120250102B">H10B43/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHENG HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種快閃記憶體裝置及其抹除方法。快閃記憶體裝置包括記憶體陣列以及記憶體控制電路。記憶體陣列包括多個記憶體區塊。記憶體控制電路經配置以在抹除操作期間，將施加至多個記憶體區塊中的目標記憶體區塊的抹除電壓從參考電壓值拉升至抹除電壓值，且經過抹除時間後將抹除電壓從抹除電壓值分兩個放電階段來進行調降。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flash memory apparatus and an erasing method of this invention are provided. The flash memory apparatus includes a memory array and a memory control circuit. The memory array includes a plurality of memory blocks. The memory control circuit is configured to pull up an erase voltage applied to a target memory block in the plurality of memory blocks from a reference voltage value to an erase voltage value during an erase operation, and reduce after an erase time, the erase voltage from the erase voltage value in two discharge stages.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:快閃記憶體裝置</p>  
        <p type="p">110:記憶體陣列</p>  
        <p type="p">112:記憶體區塊</p>  
        <p type="p">114:目標記憶體區塊</p>  
        <p type="p">120:記憶體控制電路</p>  
        <p type="p">Vers:抹除電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="476" publication-number="202612835"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612835.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612835</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136670</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射對位清洗裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120241029B">B23K26/36</main-classification>  
        <further-classification edition="200601120241029B">B08B7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>微勁精密有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊智仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施國彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張范青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雷射對位清洗裝置，包含一基座單元、一驅動單元、一噴座單元及一雷射單元。該基座單元用於限位一晶圓。該驅動單元包括一左右滑座、一左右滑台組、一上下滑座、一上下滑台組及一載板。該噴座單元連接於該載板底側，且包括一噴座本體及至少一噴嘴件。該噴嘴件連接於該噴座本體。該雷射單元連接於該左右滑座，該雷射單元所發出的雷射光投射在該晶圓的部分與該噴嘴件所噴出的藥劑接觸該晶圓的部分相互交疊。本發明藉由使該雷射單元與該噴座單元同動，從而確保該雷射單元發出的雷射光針對該噴嘴件噴出的藥劑進行標記，進而更容易地確認該晶圓的清洗過程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基座單元</p>  
        <p type="p">2:驅動單元</p>  
        <p type="p">21:前後滑座組</p>  
        <p type="p">22:前後滑台組</p>  
        <p type="p">23:左右滑座</p>  
        <p type="p">24:左右滑台組</p>  
        <p type="p">25:上下滑座</p>  
        <p type="p">26:上下滑台組</p>  
        <p type="p">27:載板</p>  
        <p type="p">3:噴座單元</p>  
        <p type="p">4:雷射單元</p>  
        <p type="p">41:雷射安裝座</p>  
        <p type="p">411:固定板部</p>  
        <p type="p">412:連板部</p>  
        <p type="p">413:安裝件部</p>  
        <p type="p">414:安裝孔</p>  
        <p type="p">42:雷射發射器</p>  
        <p type="p">5:圖像擷取單元</p>  
        <p type="p">9:晶圓</p>  
        <p type="p">D1:前後方向</p>  
        <p type="p">D2:左右方向</p>  
        <p type="p">D3:上下方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="477" publication-number="202613893"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613893.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613893</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136672</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於模型與可重組硬體的裝置及方法</chinese-title>  
        <english-title>DEVICE AND METHOD FOR MODEL AND RECONFIGURABLE HARDWARE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250203B">G06N20/00</main-classification>  
        <further-classification edition="200601120250203B">G06N3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YAN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昆蔚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUEN-WEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴伯承</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, BO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳奕霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏子芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, TZU-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宇霈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-PEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種用於模型與可重組硬體的裝置及方法。所述方法包括以下步驟：將管線階段的數量以及管線的分割點設置為軟體參數，且將分塊尺寸、處理元件的數量以及處理元件的尺寸設置為硬體參數，其中分割後模型包括管線階段以及分割點，其中處理元件對應於可重組硬體；利用機器學習編譯器來編譯分割後模型，以獲得主機程式碼；利用高階合成工具以及硬體參數來合成出可重組硬體的位元流；以及獲得對應於主機程式碼以及位元流的執行時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device and a method for a model and a reconfigurable hardware are provided. The method includes following steps: setting a number of pipeline stages and a dividing point of pipelines as a software parameter, and setting a tiling size, the number of a processing element, and a size of the processing element as a hardware parameter, wherein a segmented model includes the pipeline stages and the dividing point, and the processing element corresponds to the reconfigurable hardware; using a machine learning compiler to compile the segmented model to obtain a host code; using a high-level synthesis tool and the hardware parameter to synthesize a bitstream of the reconfigurable hardware; and obtaining an execution time corresponding to the host code and the bitstream.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1、S2、S3、S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="478" publication-number="202613684"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613684.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613684</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136677</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>強化顯示器像素受光能量系統的應用方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">G02F1/1335</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>點晶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金際遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴國榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種強化顯示器像素受光能量系統的應用方法，主要包括：一影像擷取模組，以對外在影像進行捕捉；一光線優化單元，由一微透鏡陣列所構成，使被取像具有比較亮的光綫，以及；一光路優化單元，由液晶鏡片所構成，內具有中空電極層採用分割區塊控制，以調整光路強化光感測器像素受光能量；方法重點在於可應用sub-pixel總和減像素，將大分區總和像素能量減去其中之一單點像素能量，而能在微弱光線中精準測得每一單點像素的能量，再予重新運算加強補光，適合夜視應用在智慧手機、監控攝像、車載顯示等，而能有效改善增強整體受光以提高影像的解析度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:強化顯示器像素受光能量系統</p>  
        <p type="p">1:影像擷取模組</p>  
        <p type="p">11:攝像頭</p>  
        <p type="p">12:顯示器</p>  
        <p type="p">13:光感測器</p>  
        <p type="p">2:光線優化單元</p>  
        <p type="p">20:微透鏡陣列</p>  
        <p type="p">3:光路優化單元</p>  
        <p type="p">30:液晶鏡片</p>  
        <p type="p">31:玻璃基板</p>  
        <p type="p">34:液晶層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="479" publication-number="202614895"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614895.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614895</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136684</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10H29/10</main-classification>  
        <further-classification edition="202501120250102B">H10H20/856</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佳安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇薪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊文瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳映羽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YINYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林冠亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUAN-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種顯示裝置，包括基板以及配置於基板上的多個顯示像素，每一顯示像素包括發光單元以及絕緣層。發光單元包括沿著遠離基板的方向依序配置的第一歐姆接觸金屬、發光二極體以及第二歐姆接觸金屬。絕緣層配置於發光二極體的至少一側上，且包括第一突出部，其中第一突出部與基板的距離大於或等於發光二極體的頂面與基板的距離。第二歐姆接觸金屬的一部份配置於第一突出部朝向發光二極體的第一側壁上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device including a substrate and a plurality of display pixels on the substrate is provided. Each display pixel includes a light emitting unit and an insulating layer. The light emitting unit includes a first ohmic contact metal, a light emitting diode and a second ohmic contact metal that are disposed in sequence along a direction away from the substrate. The insulating layer is disposed on at least a side of the light emitting diode, and includes a first protruding portion, wherein a distance between the first protruding portion and the substrate is greater than or equal to a distance between a top surface of the light emitting diode and the substrate. A part of the second ohmic contact metal is disposed on a first side wall of the first protruding portion facing the light emitting diode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:顯示裝置</p>  
        <p type="p">10:基板</p>  
        <p type="p">100:發光二極體</p>  
        <p type="p">100C:中央區域</p>  
        <p type="p">100P:邊緣區域</p>  
        <p type="p">100T:頂面</p>  
        <p type="p">101、102:歐姆接觸金屬</p>  
        <p type="p">103、104:導電層</p>  
        <p type="p">200:絕緣層</p>  
        <p type="p">201、202:突出部</p>  
        <p type="p">D1、D2、D3:距離</p>  
        <p type="p">L1、L2:光線</p>  
        <p type="p">LU:發光單元</p>  
        <p type="p">S1、S2、S3、S4:側壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="480" publication-number="202614379"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614379.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614379</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136686</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>孔壁形成側面可潤濕結構的封裝元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">H01L23/28</main-classification>  
        <further-classification edition="200601120241029B">H01L23/043</further-classification>  
        <further-classification edition="200601120241029B">H01L23/488</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>強茂股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何中雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王永輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李季學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳威廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種孔壁形成側面可潤濕結構的封裝元件，該封裝元件的一複合基板上覆蓋有一塑封層，該塑封層上形成有一頂重佈線層，該頂重佈線層的頂面邊緣未受一絕緣保護層覆蓋而形成至少一邊緣銲接面，且鄰近該複合基板的邊緣有至少一導電孔切割形成的至少一導電接腳，各該邊緣銲接面分別連接各該導電接腳的切割面，且各該邊緣銲接面及各該導電接腳的側壁均具有一抗氧化金屬層供後續銲錫爬附，便於自動光學檢查儀器判斷銲接情況，且本發明封裝元件中原本的導電孔外移至整體的邊緣處，故可透過一次切割即形成側面可潤濕結構而降低製程上的複雜性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:複合基板</p>  
        <p type="p">100:容置空間</p>  
        <p type="p">11:基層</p>  
        <p type="p">12:頂導電層</p>  
        <p type="p">13:底導電層</p>  
        <p type="p">30:晶粒</p>  
        <p type="p">41:塑封層</p>  
        <p type="p">410:晶片連接孔</p>  
        <p type="p">411:基板連接孔</p>  
        <p type="p">50:頂種子層</p>  
        <p type="p">51:底種子層</p>  
        <p type="p">52:頂金屬層</p>  
        <p type="p">520:導電盲孔</p>  
        <p type="p">521:邊緣導電盲孔</p>  
        <p type="p">53:底金屬層</p>  
        <p type="p">540:邊緣銲接面</p>  
        <p type="p">55:導電接腳</p>  
        <p type="p">550:切割面</p>  
        <p type="p">60:絕緣保護層</p>  
        <p type="p">70:抗氧化導電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="481" publication-number="202614171"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614171.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614171</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136687</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>改變二維電子氣載子濃度之方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">H01L21/205</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國家中山科學研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠顯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, GUAN-SHIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇文生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, VIN-CENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIN-TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張國仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, KUO-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種改變二維電子氣載子濃度之方法，利用於基板內製作不同的微奈米結構，在特定的磊晶條件下，將可於磊晶層內產生不同的應力累積或釋放，此應力累積或釋放將可間接改變異質磊晶接面上所產生的能帶分布，進而影響二維電子氣載子濃度。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">2:二氧化矽層</p>  
        <p type="p">3:氮化鋁層</p>  
        <p type="p">4:氮化鎵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="482" publication-number="202613958"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613958.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613958</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136694</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預測產品製造指標的方法及裝置</chinese-title>  
        <english-title>METHOD AND DEVICE FOR PREDICTING PRODUCT MANUFACTURING INDEX</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250203B">G06Q50/04</main-classification>  
        <further-classification edition="202301120250203B">G06Q10/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯穎科技服務股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIWYNN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方格煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, GE-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張志偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種預測產品製造指標的方法，包含對一產品的一展開圖進行一圖像預處理，以轉換該展開圖為一輸入資料；對該輸入資料進行一主成分分析方法，以轉換該輸入資料為一主成分資料；以及利用一第一人工智慧模型，根據該主成分資料，預測該產品的一製造指標。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for predicting product manufacturing index includes performing an image preprocessing on a flat development drawing of a product to convert the flat development drawing into input data; performing a principal component analysis on the input data to convert the input data into a principal component data; and using a first artificial intelligence (AI) model to predict a manufacturing index of the product according to the principal component data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:展開圖</p>  
        <p type="p">14:製造指標</p>  
        <p type="p">31:第一人工智慧模型</p>  
        <p type="p">310:第一初始模型</p>  
        <p type="p">32:第二人工智慧模型</p>  
        <p type="p">320:第二初始模型</p>  
        <p type="p">33:展開圖</p>  
        <p type="p">34:製造指標集</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="483" publication-number="202614240"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614240.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614240</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136703</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用於半導體之立體導電結構之成形方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250529B">H01L21/60</main-classification>  
        <further-classification edition="200601120250529B">B05D3/00</further-classification>  
        <further-classification edition="200601120250529B">B05C5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德芮達科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱雲堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊智軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昆亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周文杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林明璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係揭露一種應用於半導體之立體導電結構之成形方法，係至少包括下列步驟：一噴塗步驟：利用一噴塗模組將一材料噴塗於一載體表面之噴塗位置；以及一固化步驟：利用一雷射光固化模組聚焦於該噴塗位置，且該固化步驟係與該噴塗步驟同時進行，以令該材料於該噴塗位置立即固化；其中，透過重複進行該噴塗步驟與該固化步驟以形成該立體導電結構。因此，本發明之應用於半導體之立體導電結構之成形方法係可令該材料於該噴塗位置立即固化，不但可於短時間內完成該材料的固化，還能避免該載體上的電子元件損壞，以提升產品良率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:噴塗模組</p>  
        <p type="p">20:材料</p>  
        <p type="p">30:載體</p>  
        <p type="p">40:雷射光固化模組</p>  
        <p type="p">P:噴塗位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="484" publication-number="202613428"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613428.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613428</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136704</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>煞車卡鉗</chinese-title>  
        <english-title>BRAKE CALIPER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241114B">F16D55/226</main-classification>  
        <further-classification edition="200601120241114B">F16D65/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三陽工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANYANG MOTOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭榮彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, RONG-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種煞車卡鉗，包括有一缸體、一煞車片以及一第一活塞。缸體包括一第一側、一第二側及一連接部，煞車片包括有一摩擦材及一襯板，摩擦材較靠近連接部之一側具有一第一輪廓，摩擦材較遠離連接部之一側具有一第二輪廓，第一活塞具有一第一活塞中心。當液壓油壓力增加時，第一活塞將會被往煞車片之方向推動，使煞車片夾持煞車碟盤，此時第一活塞對煞車片之一第一施力位於第一活塞中心，並以第一活塞中心作為一活塞施力中心，經過活塞施力中心相對於煞車碟盤中心的切線方向為一活塞施力中心切線，活塞施力中心切線到第一輪廓之間的摩擦材面積大於活塞施力中心切線到第二輪廓之間的摩擦材面積。藉此，可使摩擦材上、下半部的面壓趨近相等，以避免摩擦材因缸體之連接部發生彈性變形而發生磨耗不均等問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a brake caliper, which includes a cylinder, a brake pad and a first piston. The cylinder includes a first side, a second side and a connecting part. The brake pad includes a friction material and a lining plate. The side of the friction material closer to the connecting part has a first profile, and the side of the friction material further away the connecting part has a second profile. The first piston has a first piston center. When the hydraulic oil pressure increases, the first piston will be pushed in the direction of the brake pad, so that the brake pad clamps the brake disc. At this time, the first force exerted by the first piston on the brake pad is located at the center of the first piston, and taking the first piston center as a piston force application center, the tangent direction passing through the piston force application center relative to the brake disc center is a piston force application center tangent, and the friction material area between the piston force application center tangent and the first profile is greater than the friction material area between the tangent line of the piston force center and the second profile. As such, the surface pressure of the upper and lower halves of the friction material can be made nearly equal to avoid problems such as uneven wear of the friction material due to elastic deformation of the connecting portion of the cylinder.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1a:缸體</p>  
        <p type="p">11a:第一側</p>  
        <p type="p">113a:裝置部</p>  
        <p type="p">114a:進油口</p>  
        <p type="p">2a:固定架</p>  
        <p type="p">22a:安裝孔</p>  
        <p type="p">3a:煞車片</p>  
        <p type="p">31a:摩擦材</p>  
        <p type="p">311a:第一輪廓</p>  
        <p type="p">312a:第二輪廓</p>  
        <p type="p">313a:活塞施力中心</p>  
        <p type="p">314a:活塞施力中心切線</p>  
        <p type="p">32a:襯板</p>  
        <p type="p">4a:第一活塞</p>  
        <p type="p">41a:第一活塞中心</p>  
        <p type="p">8a:煞車碟盤</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="485" publication-number="202614528"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614528.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614528</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136705</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多電池系統和多電池自適應仲裁與識別方法</chinese-title>  
        <english-title>MULTI-BATTERY SYSTEM AND MULTI-BATTERY SELF-ADAPTIVE ARBITRATION AND IDENTIFICATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241206B">H02J7/00</main-classification>  
        <further-classification edition="201301120241206B">G06F21/71</further-classification>  
        <further-classification edition="201901120241206B">B60L58/10</further-classification>  
        <further-classification edition="201901120241206B">B60L58/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達方電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DARFON ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達宇電能科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DARFON ENERGY TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIEN, KAI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佳駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳聰男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TSUNG-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多電池系統，包含有複數個電池模組，其中該複數個電池模組中的每一電池模組分別包含一微控制器，該控制器用來執行一多電池自適應仲裁與識別方法，其中該多電池自適應仲裁與識別方法包含有接收分別來自該複數個電池模組的複數個第一啟動訊號，其中該複數個第一啟動訊號中的每一第一啟動訊號包含一配置識別碼和一第一隨機識別碼；根據該複數個第一啟動訊號，產生一仲裁結果，其中該仲裁結果指示該複數個電池模組之間的一優先排序；以及傳送該仲裁結果給該複數個電池模組的每一電池模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-battery system includes a plurality of battery modules. Each battery module of the plurality of battery modules includes a mirco-controller-unit. The micro-controller-unit is configured to perform a multi-battery self-adaptive arbitration and identification method, which includes receiving a plurality of first boot information, wherein each first boot information includes a configuration identification code and a first node identification code; generating an arbitration result according to the plurality of first boot information, wherein the arbitration result indicates a prioritization between the plurality of battery modules; and transmitting the arbitration result to each of the plurality of battery modules.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S200,S202,S204,S206,S208:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="486" publication-number="202613127"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613127.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613127</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136706</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚脯胺酸奈米籠狀化合物、其製備方法及其用途</chinese-title>  
        <english-title>POLYPROLINE NANOCAGE COMPOUND, MANUFACTURING METHOD THEREOF AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">C07D487/22</main-classification>  
        <further-classification edition="200601120241101B">A61K31/407</further-classification>  
        <further-classification edition="201701120241101B">A61K47/69</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立清華大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王聖凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHENG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡嘉龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIA-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐詣誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱筱玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, HSIAO-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳芓源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TZU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種聚脯胺酸奈米籠狀化合物，其包含二環肽骨架以及至少三連接分子。每一個環肽骨架包含至少三聚脯胺酸螺旋桿以及至少三轉角分子，且至少三聚脯胺酸螺旋桿中之二者由至少三轉角分子中之一者連接形成一閉合環。至少三連接分子分別自二環肽骨架中之一者的每一個聚脯胺酸螺旋桿連接至二環肽骨架中之另一者的每一個聚脯胺酸螺旋桿。藉此，本發明之聚脯胺酸奈米籠狀化合物具有生物相容性，且可控制官能基的連接位置與數量，以適於各種應用層面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a polyproline nanocage compound, which includes two cyclic peptide scaffolds and at least three connecting molecules. Each of the two cyclic peptide scaffolds includes at least three polyproline II helix rods and at least three turn-angle molecules, and two of the at least three polyproline II helix rods are connected by one of the at least three turn-angle molecules to form a closed ring. The at least three connecting molecules are connected from each of the polyproline II helix rods of one of the two cyclic peptide scaffolds to each of the polyproline II helix rods of another of the two cyclic peptide scaffolds. Accordingly, the polyproline nanocage compound of the present disclosure is biocompatible, and the connection position and the number of the functional groups can be controlled, which is suitable for the various applications.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:聚脯胺酸奈米籠狀化合物</p>  
        <p type="p">110:環肽骨架</p>  
        <p type="p">111:聚脯胺酸螺旋桿</p>  
        <p type="p">112:轉角分子</p>  
        <p type="p">113:重複單元</p>  
        <p type="p">114:官能基</p>  
        <p type="p">120:連接分子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="487" publication-number="202614646"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614646.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614646</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136707</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用電信資料之地震災害搜救系統及方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250203B">H04W4/90</main-classification>  
        <further-classification edition="201801120250203B">H04W76/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣大哥大股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN MOBILE CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡政嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林發立</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種利用電信資料之地震災害搜救系統及方法。首先，根據一地震活動事件，決定地理上的一淺在搜救範圍、時間上的一前篩選條件及一後篩選條件。接著，識別存在於該淺在搜救範圍中的一或多個基地台。進一步，根據該前篩選條件及該後篩選條件，調用地震發生前後關於該一或多個基地台的前後兩筆基地台註冊資料，及調用地震發生前後關於該一或多個基地台的基地台資料。最終，至少根據該前後兩筆基地台註冊資料的比對，以形成至少一風險門號清單。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100至S110:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="488" publication-number="202613418"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613418.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613418</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136710</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有防止鑽孔工件碎裂功能的雙排屑溝螺絲鑽刃結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">F16B25/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯亮宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯亮宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明主要目的在於提供一種具有防止鑽孔工件碎裂功能的雙排屑溝螺絲鑽刃結構，其結構包含有，一螺絲頭、一螺紋段、一鑽身，該螺絲頭底側連接螺紋段，螺紋段底側連接鑽身，鑽身上部設有雙排屑溝、底部設有定位鑽刃，定位鑽刃在定位後進行鑽孔，工件產生的碎屑可沿著雙排屑溝大量快速排出，減低螺絲鑽尖擰進去工件時的阻力，快速鑽孔、大量排屑一氣呵成，故可節省施工時間，並避免鑽孔施工時工件産生碎裂的現象。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">100:防止鑽孔工件碎裂功能的雙排屑溝螺絲鑽刃結構</p>  
        <p type="p">20:螺紋段</p>  
        <p type="p">30:鑽身</p>  
        <p type="p">31:雙排屑溝</p>  
        <p type="p">311:溝底</p>  
        <p type="p">312:溝頂</p>  
        <p type="p">313A:面</p>  
        <p type="p">314B:面</p>  
        <p type="p">32:兩鑽切刃</p>  
        <p type="p">35:定位鑽刃尖點</p>  
        <p type="p">36:定位鑽刃</p>  
        <p type="p">40:螺旋陵線</p>  
        <p type="p">D1:雙排屑溝外徑</p>  
        <p type="p">D2:定位鑽刃外徑</p>  
        <p type="p">D3:螺紋段外徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="489" publication-number="202612918"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612918.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612918</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136734</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自行車電動輔助輪轂</chinese-title>  
        <english-title>BICYCLE ELECTRIC AUXILIARY HUB</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241206B">B60B27/00</main-classification>  
        <further-classification edition="201001120241206B">B62M6/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍文鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAN, WEN CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍文鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAN, WEN CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃世瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種自行車電動輔助輪轂，其包括：一基體、一主軸及一電控模組。該基體包含有一外殼、一定子模組及一轉子模組，該外殼沿一組接方向開設有一插孔，該轉子模組與該定子模組可相對轉動地容設於該外殼；該主軸穿設該插孔地與該定子模組相連結；該電控模組容設於該外殼，該電控模組包含有一電路基板及至少一電池，該電路基板與該定子模組相連結，該至少一電池電性連接地定位於該電路基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a bicycle electric auxiliary wheel hub, comprising: a base body, a main shaft, and an electronic control module. The substrate comprises a housing, a certain submodule, and a rotor module. The housing is provided with a socket along a set of connecting directions, and the rotor module and the stator module are rotatably accommodated in the housing; The spindle is connected to the stator module through the socket; The electronic control module is housed in the housing and includes a circuit board and at least one battery. The circuit board is connected to the stator module, and the at least one battery is electrically connected to the circuit board.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:電控模組</p>  
        <p type="p">41:電路基板</p>  
        <p type="p">42:貫孔</p>  
        <p type="p">43:電池</p>  
        <p type="p">46:夾掣組件</p>  
        <p type="p">47:夾掣件</p>  
        <p type="p">49:電池模組</p>  
        <p type="p">7:溫度感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="490" publication-number="202612592"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612592.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612592</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136741</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種咖啡的製造方法</chinese-title>  
        <english-title>A METH FOR PRODUCING COFFEE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">A23F5/36</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文豊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文豊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">創新一種咖啡豆萃取模式</p>  
        <p type="p">將 咖啡豆與飲用水</p>  
        <p type="p">置入 高速攪拌機的容器中</p>  
        <p type="p">經過 一次型充分碎化拌合</p>  
        <p type="p">取出 內容物經靜置後的上浮液(相對於下沉澱物)</p>  
        <p type="p">供 飲用</p>  
        <p type="p">此一創新咖啡豆經水萃取模式</p>  
        <p type="p">稱謂為〔汨咖啡(rapid coffee)〕</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Innovate a coffee bean extraction mode</p>  
        <p type="p">Will Coffee beans and drinking water</p>  
        <p type="p">place into High-speed pug mill container</p>  
        <p type="p">go through One-time type fully crushed and mixed</p>  
        <p type="p">take out The floating liquid after the contents have been allowed to stand (relative to the sediment)</p>  
        <p type="p">for Drink</p>  
        <p type="p">This innovative coffee bean extraction mode</p>  
        <p type="p">The title is [rapid coffee]</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="491" publication-number="202612794"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612794.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612794</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136745</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感測器塗佈方法、遮蔽組件及感測器</chinese-title>  
        <english-title>PAINTING METHOD FOR SENSOR, SHIELDING ASSEMBLY AND SENSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">B05D1/32</main-classification>  
        <further-classification edition="202001120241104B">G01S17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>輝創電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHETRON ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李育民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YU-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種感測器塗佈方法，用以解決習知感測器塗佈方法的步驟繁瑣的問題。係包含：提供一感測器，該感測器具有一載體與一探頭，該感測器經預先組裝而使該探頭安裝至該載體，且該探頭凸出於該載體之外的一局部形成一凸出部；提供一遮蔽組件遮蔽該凸出部，該凸出部受該遮蔽組件遮蔽的區域形成一間隙部，且使該凸出部露出於該遮蔽組件外的區域形成一塗佈區域；及於該塗佈區域形成一塗佈層，使該塗佈層與該間隙部具有不同顏色。本發明可以達成提升感測器的塗佈出貨效率的功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A painting method for sensor is adapted for solving the problem of the conventional sensor painting method involving tedious steps. The painting method includes the following steps: providing a sensor which has a carrier and a sensing unit and is pre-assembled to install the sensing unit to the carrier to form a protruding portion by a part of the sensing unit exposed from the carrier; providing a shielding assembly cover around the protruding portion to make a portion of the protruding portion covered by the shield assembly form a gap region, and make a region of the protruding portion exposed from the shielding assembly form a painting region; and forming a painting layer on the painting region so as to make the painting region has a different color from the gap region. The present invention can improve the painting efficiency and product finished efficiency for the sensor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:載體</p>  
        <p type="p">2:探頭</p>  
        <p type="p">3:基座</p>  
        <p type="p">3a:底端</p>  
        <p type="p">3b:頂端</p>  
        <p type="p">30:凹槽</p>  
        <p type="p">4:遮罩</p>  
        <p type="p">40:穿孔</p>  
        <p type="p">40R:周緣</p>  
        <p type="p">SA:遮蔽組件</p>  
        <p type="p">SD:感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="492" publication-number="202613375"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613375.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613375</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136746</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>纖維束強化結構</chinese-title>  
        <english-title>FIBER-REINFORCED STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241031B">D01F9/12</main-classification>  
        <further-classification edition="200601120241031B">D01F6/00</further-classification>  
        <further-classification edition="200601120241031B">B29C70/06</further-classification>  
        <further-classification edition="200601120241031B">B29C70/40</further-classification>  
        <further-classification edition="200601120241031B">B29C70/04</further-classification>  
        <further-classification edition="200601120241031B">B29B15/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滙歐科技開發股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EURO-ACE COMPOSITE MANUFACTURING CO,. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭清松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAW, CHING-SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王順造</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHUN-TSAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何崇民</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種纖維束強化結構，其包含一第一纖維以及一第二纖維，該第二纖維之剛性小於該第一纖維，該第二纖維與該第一纖維結合成一連續纖維束，該第二纖維不均勻地分布於該第一纖維，且該第二纖維不均勻地分布於該連續纖維束之截面，該第二纖維的分布提升該纖維束強化結構的抗衝擊性、抗疲勞性、成型加工性以及設計靈活性，並且減少一應力直接破壞該第一纖維。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fiber-reinforced structure has a first fiber and a second fiber, where the second fiber has less rigidity than the first fiber. The second fiber is combined with the first fiber to form a continuous fiber bundle, and the second fiber is unevenly distributed within the first fiber and unevenly distributed across the cross-section of the continuous fiber bundle. The second fiber enhances the impact resistance, fatigue resistance, moldability, and design flexibility of the fiber bundle reinforcement structure, while also reducing the likelihood of direct stress-induced failure of the first fiber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:纖維束強化結構</p>  
        <p type="p">11:第一纖維</p>  
        <p type="p">111:A側</p>  
        <p type="p">112:B側</p>  
        <p type="p">N:應力</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="493" publication-number="202612777"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612777.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612777</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136751</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣體分解裝置(三)</chinese-title>  
        <english-title>GAS DECOMPOSITION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B01D53/46</main-classification>  
        <further-classification edition="200601120241105B">F23G7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>暉盛科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANO ELECTRONICS AND MICRO SYSTEM TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許嘉元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIA YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁國超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, KUO CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳浚誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUN CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳濟宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHI YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳豐裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種氣體分解裝置，係主要於氣體分解裝置之主體內設有一介電管，並使該主體一側與一微波產生器之波導管相連結，且於該主體另側設有一點火器，藉此，當供氣單元將甲烷等氣體送入介電管時，係使點火器將電子打入介電管內，當輸入介電管之甲烷等氣體與電子通過主體內所設波導區間時，即可受到微波能量作用，而將甲烷等氣體解離成電漿，並藉由電漿生成時產生高溫將甲烷等氣體裂解成固態碳與氣態氫，據此簡便結構設計，俾達到將甲烷等有害氣體處理成對環境無害物質及回收再利用效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a gas decomposition device, which primarily features a dielectric tube within the main body of the gas decomposition device. One side of the main body is connected to a waveguide of a microwave generator, while the other side is equipped with an igniter. When a gas supply unit delivers gases such as methane into the dielectric tube, the igniter injects electrons into the dielectric tube. As the methane gas passes through the waveguide section inside the main body along with the electrons, it is subjected to microwave energy, causing the methane to dissociate into plasma. The high temperature generated during plasma formation breaks down the methane into solid carbon and gaseous hydrogen. With this simple structural design, the device efficiently processes harmful gases such as methane into environmentally harmless substances, allowing for recycling and reuse.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一主體</p>  
        <p type="p">11:波導管銜接部</p>  
        <p type="p">111:開口</p>  
        <p type="p">12:波導區間</p>  
        <p type="p">13:第一通孔</p>  
        <p type="p">14:冷卻通道</p>  
        <p type="p">2:第二主體</p>  
        <p type="p">21:第一組立孔</p>  
        <p type="p">22:氣旋產生件</p>  
        <p type="p">221:輸氣孔</p>  
        <p type="p">222:導流孔</p>  
        <p type="p">23:進氣口</p>  
        <p type="p">24:點火器</p>  
        <p type="p">3:第三主體</p>  
        <p type="p">31:第二通孔</p>  
        <p type="p">32:觀景窗</p>  
        <p type="p">4:第四主體</p>  
        <p type="p">41:第二組立孔</p>  
        <p type="p">42:氣密件</p>  
        <p type="p">5:第五主體</p>  
        <p type="p">51:出料通道</p>  
        <p type="p">6:介電管</p>  
        <p type="p">61:管孔</p>  
        <p type="p">7:儲碳筒</p>  
        <p type="p">71:入料端</p>  
        <p type="p">72:導料口</p>  
        <p type="p">82:第二調波器</p>  
        <p type="p">9:振盪單元</p>  
        <p type="p">a1:波導管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="494" publication-number="202613792"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613792.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613792</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136753</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電容感測電路</chinese-title>  
        <english-title>CAPACITANCE SENSING CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">G06F3/044</main-classification>  
        <further-classification edition="200601120250102B">G06K7/08</further-classification>  
        <further-classification edition="200601120250102B">G01R27/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAYDIUM SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯書穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, SHU-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種電容感測電路，包括積分電路、比較電路、I/Q解調變電路及回授電路。積分電路用以根據觸控電容變化量產生電荷輸出訊號。比較電路耦接積分電路，用以根據電荷輸出訊號產生一位元數位碼。I/Q解調變電路耦接比較電路，用以根據一位元數位碼產生原始資料。回授電路包括N個數位類比轉換器及D型正反器鏈。該N個數位類比轉換器耦接至積分電路。D型正反器鏈的一端耦接該N個數位類比轉換器且其另一端耦接至比較電路與I/Q解調變電路之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A capacitance sensing circuit including an integrating circuit, a comparison circuit, an I/Q demodulation circuit and a feedback circuit is disclosed. The integrating circuit is configured to generate a charge output signal according to touch capacitance change amount. The comparison circuit is coupled to the integrating circuit and configured to generate a one-bit digital code according to the charge output signal. The I/Q demodulation circuit is coupled to the comparison circuit and configured to generate raw data according to the one-bit digital code. The feedback circuit includes N digital-to-analog converters and a D-type flip-flop chain. The N digital-to-analog converters are coupled to the integrating circuit. One terminal of the D-type flip-flop chain is coupled to the N digital-to-analog converters and the other terminal is coupled between the comparison circuit and the I/Q demodulation circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:電容感測電路</p>  
        <p type="p">30:積分電路</p>  
        <p type="p">32:比較電路</p>  
        <p type="p">34:I/Q解調變電路</p>  
        <p type="p">36:回授電路</p>  
        <p type="p">300:誤差放大器</p>  
        <p type="p">360:D型正反器鏈</p>  
        <p type="p">CTH:可變觸控電容</p>  
        <p type="p">TRX:觸控電壓</p>  
        <p type="p">GND:接地端</p>  
        <p type="p">VREF(SIN):正弦波參考電壓</p>  
        <p type="p">CF:電容</p>  
        <p type="p">OUT:電荷輸出訊號</p>  
        <p type="p">VREF(DC):直流參考電壓</p>  
        <p type="p">CLK:採樣時脈訊號</p>  
        <p type="p">1BD:一位元數位碼</p>  
        <p type="p">RD:原始資料</p>  
        <p type="p">FB:回授訊號</p>  
        <p type="p">CON1~CONN:控制訊號</p>  
        <p type="p">IDAC1~IDACN:數位類比轉換器</p>  
        <p type="p">IUP、IDN:充電泵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="495" publication-number="202614442"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614442.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614442</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136755</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板間的訊號傳輸電路</chinese-title>  
        <english-title>SIGNAL TRANSMISSION CIRCUIT BETWEEN SUBSTRATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H01L23/538</main-classification>  
        <further-classification edition="200601120250401B">H01L23/48</further-classification>  
        <further-classification edition="200601120250401B">H05K1/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宗霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TZONG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林克翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KE-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁誠吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, CHENG-WU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張秀夏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種基板間的訊號傳輸電路，包括一第一基板及一第二基板；第一基板包括一第一導體、至少一第一參考金屬面及複數個第一連接孔；第一參考金屬面圍繞在第一導體的外圍，第一連接孔設置在第一基板的板體結構中且連接第一參考金屬面；第二基板包括一第二導體、至少一第二參考金屬面及複數個第二連接孔；第二參考金屬面圍繞在第二導體的外圍，第二連接孔設置在第二基板的板體結構中且連接第二參考金屬面；第一基板與第二基板通過第一導體及第二導體之間的電磁耦合而以一無線方式傳輸訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides a signal transmission circuit between substrates, which includes a first substrate and a second substrate. The first substrate comprises a first conductor, at least a first reference metal surface and a plurality of first connection holes. The first reference metal surface surrounds the periphery of the first conductor. The first connection holes are provided in the body of the first substrate and connected to the first reference metal surface. The second substrate comprises a second conductor, at least a second reference metal surface and a plurality of second connection holes. The second reference metal surface surrounds the periphery of the second conductor. The second connection holes are provided in the body of the second substrate and connected to the second reference metal surface. The first substrate and the second substrate transmit signals in a wireless through an electromagnetic coupling between the first conductor and the second conductor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:訊號傳輸電路</p>  
        <p type="p">31:第一基板</p>  
        <p type="p">311:第一導體</p>  
        <p type="p">3111:量測點</p>  
        <p type="p">312:第一參考金屬面</p>  
        <p type="p">314:第一接地面</p>  
        <p type="p">32:第二基板</p>  
        <p type="p">321:第二導體</p>  
        <p type="p">3211:量測點</p>  
        <p type="p">322:第二參考金屬面</p>  
        <p type="p">324:第二接地面</p>  
        <p type="p">33:空隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="496" publication-number="202614630"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614630.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614630</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136757</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聲音訊號的調整方法及播放裝置</chinese-title>  
        <english-title>SOUND SIGNAL ADJUSTMENT METHOD AND PLAYBACK DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H04R3/00</main-classification>  
        <further-classification edition="200601120250203B">H04R1/32</further-classification>  
        <further-classification edition="200601120250203B">H04R1/40</further-classification>  
        <further-classification edition="201301120250203B">G10L21/0208</further-classification>  
        <further-classification edition="200601120250203B">G06F3/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜博仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, PO-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張嘉仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JIA-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾凱盟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZENG, KAI-MENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種聲音訊號的調整方法及播放裝置。偵測聲音來源相對於麥克風陣列的來源方向。透過麥克風陣列產生對應於來源方向的波束，其中波束是基於波束成形技術所產生的，且波束的波瓣的收音方向朝向來源方向。依據來源方向調整揚聲器的輸出功率。反應於波瓣的收音範圍涵蓋揚聲器中的第一者，降低第一者的輸出功率，其中收音範圍是由麥克風陣列朝收音方向延伸而出的。藉此，可提升通話品質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sound signal adjustment method and playback device are provided. The direction of a sound source relative to the microphone array is detected. A beam corresponding to the source direction is generated through the microphone array, where the beam is generated based on beamforming technology, and the sound-receiving direction of the beam lobe is toward the source direction. The speaker output power is adjusted based on the source direction. In response to the sound-receiving range of the lobe covering the first speaker among the speakers, the output power of the first speaker is reduced. The sound-receiving range is extended from the microphone array toward the sound-receiving direction. Therefore, the call quality could be improved.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210~S230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="497" publication-number="202613451"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613451.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613451</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136762</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車燈散熱裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241211B">F21S45/47</main-classification>  
        <further-classification edition="201501120241211B">F21V29/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>統亞電子科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宗明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧信智</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種車燈散熱裝置，包括一燈座，該燈座內部界定一容室，該容室內部設一發光組件，且該燈座背部於鄰近該發光組件設一組散熱鰭片，且該燈座分別設一第一冷卻腔管與第二冷卻腔管，該第一冷卻腔管與第二冷卻腔管各設一入口以及一出口，該各出口與該組散熱鰭片於該容室外部形成接觸。藉此透過該各入口之入風，分別經由該第一冷卻腔管與第二冷卻腔管，而令該各出口於該容室外部與該組散熱鰭片形成接觸，可以加速該組散熱鰭片與風之接觸而強化該發光組件與該容室內部，因發光生熱之冷卻效果，且使得該第一冷卻腔管與第二冷卻腔管形成一獨立於該容室外部之管路，對於該容室內部不致產生環境中沙土、塵垢、雨水之侵蝕。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(1):燈座</p>  
        <p type="p">(2):容室</p>  
        <p type="p">(3):發光組件</p>  
        <p type="p">(4):散熱鰭片</p>  
        <p type="p">(51):第一冷卻腔管</p>  
        <p type="p">(52):第二冷卻腔管</p>  
        <p type="p">(51A):入口</p>  
        <p type="p">(52A):入口</p>  
        <p type="p">(51B):出口</p>  
        <p type="p">(52B):出口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="498" publication-number="202614536"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614536.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614536</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136764</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>同步磁阻馬達及其設計方法</chinese-title>  
        <english-title>SYNCHRONOUS RELUCTANCE MOTOR AND DESIGN METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H02K1/16</main-classification>  
        <further-classification edition="200601120250203B">H02K1/26</further-classification>  
        <further-classification edition="200601120250203B">H02K3/04</further-classification>  
        <further-classification edition="200601120250203B">H02K41/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立宜蘭大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL ILAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>宜蘭縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳正虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHENG-HU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚昱成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JUN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林瑞裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, RUEY-YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種同步磁阻馬達，包括：定子，包括複數個定子槽、複數個定子齒部、定子外邊緣以及一定子軛部寬度(W &lt;sub&gt;y&lt;/sub&gt;)；以及轉子，包括複數個電機極數，每一個電機極數中包括複數個轉子障壁及第一個導磁通道至第 &lt;img align="absmiddle" height="22px" width="22px" file="ed10042.JPG" alt="ed10042.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;個導磁通道，第一個導磁通道包括第一個導磁通道寬度(W &lt;sub&gt;1&lt;/sub&gt;)，第 &lt;img align="absmiddle" height="22px" width="22px" file="ed10042.JPG" alt="ed10042.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;個導磁通道包括第 &lt;img align="absmiddle" height="22px" width="22px" file="ed10042.JPG" alt="ed10042.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;個導磁通道寬度(W &lt;sub&gt;n&lt;/sub&gt;)， &lt;img align="absmiddle" height="22px" width="22px" file="ed10042.JPG" alt="ed10042.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;為大於1的正整數，其中，在每一個電機極數中包括導磁通道寬度總和 &lt;img align="absmiddle" height="26px" width="56px" file="ed10043.JPG" alt="ed10043.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，導磁通道寬度總和 &lt;img align="absmiddle" height="26px" width="56px" file="ed10043.JPG" alt="ed10043.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;的公式為 &lt;img align="absmiddle" height="37px" width="306px" file="ed10044.JPG" alt="ed10044.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，其中，導磁通道寬度總和 &lt;img align="absmiddle" height="31px" width="54px" file="ed10045.JPG" alt="ed10045.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;與定子軛部寬度(W &lt;sub&gt;y&lt;/sub&gt;)的關係為： &lt;img align="absmiddle" height="44px" width="134px" file="ed10046.JPG" alt="ed10046.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。再者，本發明亦提供一種同步磁阻馬達的設計方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a synchronous reluctance motor, comprising: a stator including a plurality of stator slots, a plurality of stator teeth, a stator edge, and a stator yoke width (W &lt;sub&gt;y&lt;/sub&gt;); and a rotor including a plurality of motor poles, each motor pole includes a plurality of rotor barriers and the first to n-th magnetic channels. The first magnetic channel includes the first magnetic channel width (W &lt;sub&gt;1&lt;/sub&gt;), the n-th magnetic channel includes the n-th magnetic channel width (W &lt;sub&gt;n&lt;/sub&gt;), n is a positive integer greater than 1, wherein, each motor poles includes a total width of the magnetic channels &lt;img align="absmiddle" height="30px" width="55px" file="ed10048.JPG" alt="ed10048.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. The formula for the total width of the magnetic channels &lt;img align="absmiddle" height="30px" width="55px" file="ed10048.JPG" alt="ed10048.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;is &lt;img align="absmiddle" height="39px" width="305px" file="ed10049.JPG" alt="ed10049.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, wherein, the relationship between the total width of the magnetic channels &lt;img align="absmiddle" height="30px" width="61px" file="ed10050.JPG" alt="ed10050.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; and the width of the stator yoke (W &lt;sub&gt;y&lt;/sub&gt;) is: &lt;img align="absmiddle" height="51px" width="136px" file="ed10047.JPG" alt="ed10047.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. Furthermore, the present invention also provides a design method of a synchronous reluctance motor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:定子</p>  
        <p type="p">20:轉子</p>  
        <p type="p">101:定子槽</p>  
        <p type="p">103:定子齒部</p>  
        <p type="p">105:定子外邊緣</p>  
        <p type="p">1011:定子槽底端</p>  
        <p type="p">201:電機極數</p>  
        <p type="p">203:轉子障壁</p>  
        <p type="p">205:導磁通道</p>  
        <p type="p">W&lt;sub&gt;y&lt;/sub&gt;:定子軛部寬度</p>  
        <p type="p">W&lt;sub&gt;t&lt;/sub&gt;:定子齒部寬度</p>  
        <p type="p">L1:定子槽底端中心邊緣切線</p>  
        <p type="p">L2:定子外邊緣切線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="499" publication-number="202613797"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613797.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613797</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136767</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶片及其記憶體管理方法</chinese-title>  
        <english-title>CHIP AND ITS MEMORY MANAGEMENT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">G06F3/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商星宸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉學麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, XUE-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席文帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XI, WEN-SHUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了一種晶片及其記憶體管理方法。該晶片耦接一記憶體。該記憶體包含一記憶體區段。該記憶體區段包含複數個記憶體塊。該晶片包含一記憶體管理電路及一計算電路。計算電路耦接該記憶體及該記憶體管理電路，用來運行一記憶體管理驅動程式以執行以下步驟：接收一記憶體請求；根據一記憶體區域鏈表在一記憶體區域中搜尋至少一閒置的記憶體塊，其中，該記憶體區域鏈表包含一節點，該節點對應於該記憶體區域，且該記憶體區域係該記憶體區段的一部分；以及，使用該記憶體管理電路對搜尋到的該至少一閒置的記憶體塊進行記憶體映射。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chip is coupled to a memory. The memory includes a memory section. The memory section includes multiple memory blocks. The chip includes a memory management circuit and a computing circuit. The computing circuit is coupled to the memory and the memory management circuit and configured to run a memory management driver to perform the following steps: receiving a memory request; searching a memory region for at least one free memory block according to a memory region linked list, wherein the memory region linked list includes a node, the node corresponds to the memory region, and the memory region is a part of the memory section; and performing memory mapping, via the memory management circuit, on the at least one free memory block found.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">126:記憶體塊結構陣列</p>  
        <p type="p">128:記憶體區域鏈表</p>  
        <p type="p">205_1,205_2,205_3,205_4,205_5,205_6,205_7,205_8,205_9,205_10,205_11:MBS(記憶體塊結構)</p>  
        <p type="p">212:該記憶體塊對應的物理地址</p>  
        <p type="p">214:所屬記憶體區域的結構的地址</p>  
        <p type="p">216:下一個記憶體塊的虛擬地址</p>  
        <p type="p">220:起點</p>  
        <p type="p">222:記憶體區域的頭節點</p>  
        <p type="p">224:記憶體區域的個數</p>  
        <p type="p">230,240:節點</p>  
        <p type="p">232,242:該記憶體區域的第1個記憶體塊的虛擬地址</p>  
        <p type="p">234,244:引用計數</p>  
        <p type="p">236,246:閒置記憶體塊的列表</p>  
        <p type="p">addrA,addrB,addrC,addrD:虛擬地址</p>  
        <p type="p">MBS:記憶體塊結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="500" publication-number="202614675"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614675.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614675</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136768</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板組件及其製造方法</chinese-title>  
        <english-title>CIRCUIT BOARD ASSEMBLY AND FABRICATING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">H05K1/02</main-classification>  
        <further-classification edition="200601120241104B">H05K1/11</further-classification>  
        <further-classification edition="200601120241104B">H05K1/18</further-classification>  
        <further-classification edition="200601120241104B">C08G73/10</further-classification>  
        <further-classification edition="200601120241104B">H05K3/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>先豐通訊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOARDTEK ELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖中興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHUNG-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出一種電路板組件及其製造方法。電路板組件包含第一線路層、第二線路層、散熱座、晶片、感光絕緣層和導電結構。散熱座位於第一線路層和第二線路層之間。晶片設置在散熱座上。感光絕緣層位於第一線路層和第二線路層之間，且覆蓋並環繞晶片。導電結構設置於晶片與第二線路層之間，且電性連接晶片和第二線路層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit board assembly and a fabricating method of the same are provided. The circuit board assembly includes a first wiring layer, a second wiring layer, a heat dissipation base, a chip, a photosensitive insulation layer, and a conductive structure. The heat dissipation base is located between the first wiring layer and the second wiring layer. The chip is mounted on the heat dissipation base. The photosensitive insulation is located between the first wiring layer and the second wiring layer, and covers and surrounds the chip. The conductive structure is disposed between the chip and the second wiring layer, and is connected to the chip and the second wiring layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電路板組件</p>  
        <p type="p">111~114:線路層</p>  
        <p type="p">121:黏合層</p>  
        <p type="p">122:介電層</p>  
        <p type="p">130:散熱座</p>  
        <p type="p">131,132:表面</p>  
        <p type="p">140:膠材</p>  
        <p type="p">150:晶片</p>  
        <p type="p">151~153:晶片接墊</p>  
        <p type="p">160:導電黏合層</p>  
        <p type="p">170:感光絕緣層</p>  
        <p type="p">180:導電結構</p>  
        <p type="p">191,192:防焊層</p>  
        <p type="p">210:導電盲孔</p>  
        <p type="p">220:導電通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="501" publication-number="202613784"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613784.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613784</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136771</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸控筆</chinese-title>  
        <english-title>STYLUS PEN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241007B">G06F3/0354</main-classification>  
        <further-classification edition="200601120241007B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群光電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHICONY ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-SHUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崛內光雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIUCHI, MITSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政大</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖韋齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種觸控筆包括中空筆管、筆頭、懸臂板、第一應變電極及第二應變電極。筆頭設置於中空筆管的開口端。懸臂板設置於中空筆管內部，懸臂板具有固定側、自由側、第一表面及第二表面，固定側固定於中空筆管，第一表面朝向開口端。第一應變電極設置於懸臂板之第一表面。第二應變電極設置於懸臂板之第二表面。筆頭可相對於中空筆管移動，以帶動懸臂板產生變形，使第一應變電極與第二應變電極同步產生變形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A stylus pen includes a hollow pen tube, a pen head, a cantilever plate, a first strain electrode, and a second strain electrode. The pen head is disposed at a open end of the hollow pen tube. The cantilever plate is disposed inside the hollow pen tube, and the cantilever plate has a fixed side, a free side, a first surface and a second surface. The fixed side is fixed to the hollow pen tube, and the first surface faces the open end. The first strain electrode is disposed on the first surface of the cantilever plate. The second strain electrode is disposed on the second surface of the cantilever plate. The pen head can move relative to the hollow pen tube to drive the cantilever plate to deform, so that the first strain electrode and the second strain electrode deform simultaneously.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:觸控筆</p>  
        <p type="p">10:中空筆管</p>  
        <p type="p">101:筆身管體</p>  
        <p type="p">102:筆頭管體</p>  
        <p type="p">11:開口端</p>  
        <p type="p">20:筆頭</p>  
        <p type="p">201:第一螺紋部</p>  
        <p type="p">30:懸臂板</p>  
        <p type="p">31:固定側</p>  
        <p type="p">32:自由側</p>  
        <p type="p">33:第一表面</p>  
        <p type="p">34:第二表面</p>  
        <p type="p">36:支撐板</p>  
        <p type="p">361:開口槽</p>  
        <p type="p">37:固定板</p>  
        <p type="p">42:第二應變電極</p>  
        <p type="p">45:第一可撓性片</p>  
        <p type="p">46:第二可撓性片</p>  
        <p type="p">461:第二側邊</p>  
        <p type="p">47:彎折片</p>  
        <p type="p">50:連動件</p>  
        <p type="p">51:第一端</p>  
        <p type="p">52:第二端</p>  
        <p type="p">53:中空柱</p>  
        <p type="p">54:觸壓板</p>  
        <p type="p">541:凸出部</p>  
        <p type="p">55:連接板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="502" publication-number="202614684"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614684.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614684</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136777</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>內埋元件電路板及其製造方法</chinese-title>  
        <english-title>CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">H05K1/18</main-classification>  
        <further-classification edition="200601120241104B">H05K1/03</further-classification>  
        <further-classification edition="200601120241104B">H05K3/32</further-classification>  
        <further-classification edition="200601120241104B">H05K3/40</further-classification>  
        <further-classification edition="200601120241104B">H05K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>先豐通訊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOARDTEK ELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖中興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHUNG-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種內埋元件電路板，包含線路基板、內埋於線路基板的導電結構、電子元件及金屬塊。電子元件與金屬塊設置於導電結構的第一表面上。電子元件分別通過其源極、閘極與汲極電性連接至線路基板。汲極通過第一表面電性連接至導電結構，源極與閘極通過線路基板的線路層電性連接至線路基板，且電子元件位於線路層及導電結構之間。導電結構通過金屬塊，但不通過導電結構的第二表面電性連接至線路基板。源極與閘極及導電結構的第二表面之間分別具有第一間距，汲極及導電結構的第二表面之間具有小於第一間距的第二間距。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit board with embedded components is provided. The circuit board with embedded components includes a circuit substrate, a conductive structure embedded in the conductive structure, an electronic component and a metal bulk. The electronic component and the metal bulk are disposed on a first surface of the conductive structure. The electronic component is electrically connected to the circuit substrate through a source, a gate and a drain, respectively. The drain is electrically connected to the conductive structure through the first surface. The source and the gate are electrically connected to the circuit substrate through a circuit layer of the circuit substrate, while the electronic component is located between the circuit layer and the conductive structure. The conductive structure is electrically connected to the circuit substrate through the metal bulk instead of a second surface of the conductive structure. A first spacing is between the second surface of the conductive structure and the source and the drain separately. A second spacing between the drain and the second surface of the conductive structure is smaller than the first spacing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:內埋元件電路板</p>  
        <p type="p">103v:導電埋孔</p>  
        <p type="p">110:防焊層</p>  
        <p type="p">113v:導電盲孔</p>  
        <p type="p">120:線路基板</p>  
        <p type="p">122a,122b,122c,122d,122e,122f:線路層</p>  
        <p type="p">124a,124b,124c,124d,124e:絕緣層</p>  
        <p type="p">130:絕緣材料</p>  
        <p type="p">140:導電結構</p>  
        <p type="p">120s,140f,140s:表面</p>  
        <p type="p">140w:側壁</p>  
        <p type="p">142a,142b:第一金屬層</p>  
        <p type="p">144a,144b:第二金屬層</p>  
        <p type="p">150:金屬塊</p>  
        <p type="p">160:電子元件</p>  
        <p type="p">160d:汲極</p>  
        <p type="p">160g:閘極</p>  
        <p type="p">160s:源極</p>  
        <p type="p">165:主體</p>  
        <p type="p">165f,165s:平面</p>  
        <p type="p">170:絕緣基板</p>  
        <p type="p">180:金屬燒結層</p>  
        <p type="p">190:電鍍通孔</p>  
        <p type="p">d1,d2:間距</p>  
        <p type="p">DR:汲極區</p>  
        <p type="p">GR:閘極區</p>  
        <p type="p">N1:法線</p>  
        <p type="p">SR:源極區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="503" publication-number="202613685"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613685.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613685</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136778</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示系統</chinese-title>  
        <english-title>DISPLAY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241211B">G02F1/1335</main-classification>  
        <further-classification edition="200601120241211B">G02F1/1333</further-classification>  
        <further-classification edition="200601120241211B">G02B27/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林倖如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SING-RU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳英杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YING-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍詠翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAN, YUNG-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范姜士奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN-JIANG, SHIH-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勇志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUNG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示系統，包括顯示面板、相機模組、四分之一波片、線偏振片、光學層以及覆蓋層。相機模組設置在顯示面板的一側，且設置在顯示面板的顯示區內。四分之一波片相對相機模組設置在顯示面板的另一側。四分之一波片設置在顯示面板與線偏振片之間。光學層設置在線偏振片與覆蓋層之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display system includes a display panel, a camera module, a quarter wave plate, a linear polarizing plate, an optical layer and a covering layer. The camera module is disposed on a side of the display panel and disposed in a display area of the display panel. The quarter wave plate is disposed on the other side of the display panel opposite to the camera module. The quarter wave plate is disposed between the display panel and the linear polarizing plate. The optical layer is disposed between the linear polarizing plate and the cover layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示系統</p>  
        <p type="p">100:顯示面板</p>  
        <p type="p">102:發光元件</p>  
        <p type="p">200:相機模組</p>  
        <p type="p">300:四分之一波片</p>  
        <p type="p">400:線偏振片</p>  
        <p type="p">500:光學層</p>  
        <p type="p">600:覆蓋層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="504" publication-number="202613511"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613511.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613511</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136781</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>判定用於組裝Ｎ個光學元件的組合的配方的方法、以及所得到的光學模組</chinese-title>  
        <english-title>METHOD OF DETERMINING A RECIPE FOR ASSEMBLING A COMBINATION OF N OPTICAL ELEMENTS, AND RESULTING OPTICAL MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250704B">G01M11/02</main-classification>  
        <further-classification edition="200601120250704B">G02B27/62</further-classification>  
        <further-classification edition="200601120250704B">G02B3/02</further-classification>  
        <further-classification edition="202101120250704B">G02B7/02</further-classification>  
        <further-classification edition="200601120250704B">G02B11/00</further-classification>  
        <further-classification edition="202301120250704B">H04N23/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商法格爾光學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOGALE OPTIQUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>列格羅斯　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEGROS, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩蒂格朗　希爾萬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETITGRAND, SYLVAIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隆格　布魯諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUONG, BRUNO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種用於判定用於組裝諸如光學透鏡之光學元件的配方之方法，所述光學元件意欲裝備光學模組，該模組具有堆疊軸(z)及垂直於該堆疊軸之參考平面(x, y)且包含N種類型的光學透鏡（L &lt;sub&gt;k&lt;/sub&gt;）之組合，k = [1, ... N]，所述光學透鏡具有兩個界面f且安裝於鏡筒（10）中，該方法旨在對於n個透鏡之子集判定相對於參考角位置Θ &lt;sub&gt;0&lt;/sub&gt;之旋轉角度Θ &lt;sub&gt;k&lt;/sub&gt;，該參考角位置對應於該子集之投影在該參考平面(x, y)中的2n個頂點（CO &lt;sub&gt;k,f&lt;/sub&gt;）之最大近似值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method for determining a recipe for assembling optical elements, such as optical lenses, intended to equip an optical module, said module having a stacking axis (z) and a reference plane (x, y) perpendicular to the stacking axis, and comprising a combination of N types of optical lenses (L &lt;sub&gt;k&lt;/sub&gt;), k = [1, ... N] provided with two interfaces f and mounted in a barrel (10), the method aiming to determine, for a subset of n lenses, the angle Θ &lt;sub&gt;k&lt;/sub&gt;of rotation with respect to a reference angular position Θ &lt;sub&gt;0&lt;/sub&gt;, corresponding to a maximum approximation of the 2n apexes (CO &lt;sub&gt;k,f&lt;/sub&gt;) of said subset, projected in the reference plane (x, y).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光學模組</p>  
        <p type="p">10:鏡筒</p>  
        <p type="p">Lk:透鏡</p>  
        <p type="p">Si:間隔件</p>  
        <p type="p">(x):軸</p>  
        <p type="p">(y):軸</p>  
        <p type="p">(z):光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="505" publication-number="202612805"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612805.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612805</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136782</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>廚餘處理設備及其使用方法</chinese-title>  
        <english-title>KITCHEN WASTE TREATMENT EQUIPMENT AND USAGE METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250501B">B09B3/00</main-classification>  
        <further-classification edition="200601120250501B">C05F9/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中欣實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG CIN ENTERPRISE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪家昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳立憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾孟雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李冠群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪煜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王律凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁化昱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為解決解決傳統廚餘處理設備中反應效率低、容易堵塞、操作單一等問題，本發明提供一種廚餘處理設備，包括：艙體部，設置外艙與內軸，並由複數隔板區隔出至少一艙；驅動裝置 ，連接該內軸，複數撥片支架連接該內軸；複數撥片，設置於該複數撥片支架上；以及轉動模組，支撐並轉動該外艙； 其中，透過選擇集中模式或推進模式，該驅動裝置轉動該內軸至不同角度，於該至少一艙相應地推動該複數撥片支架上不同旋向的該複數撥片參與該外艙的轉動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To solve the problems of low fermentation efficiency, easy blockage, and single operation mode in traditional kitchen waste treatment equipment, this invention provides a kitchen waste treatment equipment, including: a compartment part, equipped with an outer compartment and an inner shaft, and divided by multiple partitions into at least one compartment; a driving device, connected to the inner shaft, multiple paddle brackets connected to the inner shaft; multiple paddles, arranged on the multiple paddle brackets; and a rotating module, supporting and rotating the outer compartment; wherein, by selecting a concentrated mode or a propulsion mode, the driving device rotates the inner shaft to different angles, correspondingly driving the multiple paddles on the multiple paddle brackets in different rotational directions to participate in the rotation of the outer compartment within the at least one compartment..</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:廚餘處理設備</p>  
        <p type="p">1100:艙體部</p>  
        <p type="p">1110:外艙</p>  
        <p type="p">1120:內軸</p>  
        <p type="p">1130:隔板</p>  
        <p type="p">1140:撥片支架</p>  
        <p type="p">1141:撥片</p>  
        <p type="p">1150:轉動模組</p>  
        <p type="p">1310:驅動裝置</p>  
        <p type="p">1200:進料部</p>  
        <p type="p">1300:出料部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="506" publication-number="202613380"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613380.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613380</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136783</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>紡織物的脫色預處理方法和脫色處理液</chinese-title>  
        <english-title>PRETREATMENT METHOD FOR TEXTILE DECOLORIZATION AND DECOLORIZATION TREATMENT LIQUID</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">D06B19/00</main-classification>  
        <further-classification edition="200601220241105B">D06P1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新川創新股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUSTAINABLE CARBOHYDRATE INNOVATION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊文潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WEN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃雅惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YA-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種紡織物的脫色預處理方法和脫色處理液，該脫色預處理方法包括以下步驟：S10：混合纖維澎潤劑、染料溶出劑和還原劑以獲得脫色處理液，其中該纖維澎潤劑選自鹼類化合物，該染料溶出劑選自醇醚類化合物及酮類化合物中的至少一種或其混合物，該還原劑選自甲醛次硫酸氫鈉及二硫亞磺酸鈉中的至少一種或其混合物；S20：加熱該脫色處理液並將含有染料的紡織物加入該脫色處理液中進行脫色反應以去除染料；S30：待該脫色反應結束後，從該脫色處理液中取出經脫色的該紡織物。本發明的脫色預處理方法具有脫色效果優異、降低纖維損失率、省時、降低成本等優點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a pretreatment method for textile decolorization and a decolorization treatment solution. The pretreatment method for decolorization includes the following steps. S10: Mixing a fiber swelling agent, a dye eluent, and a reducing agent to obtain a decolorization treatment solution, wherein the fiber swelling agent is selected from alkaline compounds, the dye eluent is selected from at least one of alcohol ether compounds or ketone compounds or their mixtures, and the reducing agent is selected from at least one of sodium formaldehyde sulfoxylate （SFS） or sodium dithionite or their mixtures. S20: Heating the decolorization treatment solution and adding the dye-containing textile to the decolorization treatment solution to undergo a decolorization reaction to remove the dye. S30: After the decolorization reaction is completed, remove the decolorized textile from the decolorization treatment solution. The pretreatment method for decolorization of the present invention has the advantages of excellent decolorization effect, reduced fiber loss, time-saving, and cost reduction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10:步驟</p>  
        <p type="p">S20:步驟</p>  
        <p type="p">S30:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="507" publication-number="202613989"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613989.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613989</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136787</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>監控系統及其操作方法</chinese-title>  
        <english-title>MONITORING SYSTEM AND OPERATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">G08B21/18</main-classification>  
        <further-classification edition="200601120241105B">A61B5/11</further-classification>  
        <further-classification edition="201801220241105B">G16H20/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣大哥大股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN MOBILE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳淑琴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHU-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張美惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, MEI-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林正雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種監控系統的操作方法，包括：拍攝使用者的影像；判斷使用者是否正在觀看螢幕裝置；以及當使用者正在觀看螢幕裝置時，進行以下操作:基於影像辨識使用者的身體部位位置；依據身體部位位置判斷使用者是否具有不正常頸部姿勢；以及當判斷使用者具有不正常頸部姿勢時，藉由螢幕裝置發送提醒通知。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An operating method of a monitoring system, comprising: photographing an image of an user; determining whether the user is gazing at a screen; and when the user is gazing at the screen device, performing the following multiple operations: recognizing locations of multiple body parts of the user based on the image; determining whether the user has inappropriate neck position according to the locations of multiple body parts; and when the user has been determined to have inappropriate neck position, sending a reminder by the screen device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:方法</p>  
        <p type="p">610、620、630、640、650、660:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="508" publication-number="202614001"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614001.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614001</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136792</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>折疊式電子裝置</chinese-title>  
        <english-title>FOLDABLE ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241021B">G09F9/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞明軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, MING-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一折疊式電子裝置包含中央轉軸、二殼體、二帶動機構及二顯示器。中央轉軸包含二旋轉中心線，二旋轉中心線平行且不相交。二殼體分別連接於中央轉軸的二側。二帶動機構分別設置於二殼體。二顯示器分別可動地設置於二殼體，且各顯示器包含背板、面板、加強塊及卡榫。背板連接各帶動機構。面板設置於背板上。加強塊設置背板的下方，且鄰近背板的內緣。卡榫設置於加強塊。其中，二殼體分別繞二旋轉中心線相對彼此遠離時，連動二顯示器由第一位置朝中央轉軸滑動至第二位置，使二顯示器彼此組合且二卡榫對組。藉此改善觸感及避免摺痕。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a foldable electronic device including a central rotary shaft, two housings, two moving mechanisms and two displays. The central shaft includes two rotary central axes, and the rotary central axes are parallel and do not cross each other. The two housings are respectively connected to two sides of the central shaft. The two moving mechanisms are respectively disposed at the two housings. The two displays are respectively movable disposed at the two housings. Each of the displays includes a backboard, a panel, a reinforced block and an engaging portion. The backboard is connected to each of the driving mechanisms. The panel is disposed above the backboard. The reinforced block is disposed below the backboard and is near an inner edge of the backboard. The engaging portion is disposed at the reinforced block. As the two housings are respectively rotated about the two rotary central axes to be away from each other, each of the two displays are slid toward the central rotary shaft from a first position to a second position, the two displays are assembled, and the engaging portions are assembled. Therefore, a tactile impression can be improved and a crease is prevented.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1100:中央轉軸</p>  
        <p type="p">1110,1120:軸桿</p>  
        <p type="p">1130:中央轉輪</p>  
        <p type="p">1140:限位塊</p>  
        <p type="p">1150:讓位溝</p>  
        <p type="p">1210,1220:顯示器</p>  
        <p type="p">1211:面板</p>  
        <p type="p">1212:背板</p>  
        <p type="p">1212a:挖孔</p>  
        <p type="p">1213:加強塊</p>  
        <p type="p">1214:卡榫</p>  
        <p type="p">1300:帶動機構</p>  
        <p type="p">1310:連動轉軸</p>  
        <p type="p">1311:軸體</p>  
        <p type="p">1312:連動齒輪</p>  
        <p type="p">1313:蝸輪</p>  
        <p type="p">1314:咬合輪</p>  
        <p type="p">1320:蝸桿</p>  
        <p type="p">1321:螺紋</p>  
        <p type="p">1330:滑塊組</p>  
        <p type="p">1340:導引軌道</p>  
        <p type="p">1350,1360:阻力調變彈簧</p>  
        <p type="p">1370:蝸桿支撐架</p>  
        <p type="p">1410,1420:殼體</p>  
        <p type="p">1411:殼部</p>  
        <p type="p">1412:蓋板</p>  
        <p type="p">1412a:開口</p>  
        <p type="p">X,Y,Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="509" publication-number="202613019"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613019.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613019</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136794</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固定式起重機防護碰撞感測系統</chinese-title>  
        <english-title>ANTI-COLLISION SYSTEM FOR AN OVERHEAD CRANE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B66C15/04</main-classification>  
        <further-classification edition="200601120241105B">B66C15/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立虎尾科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃學良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSUEH-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈金鐘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, CHIN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李希凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HSI-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, HSIN-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡文修</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一固定式起重機防護碰撞感測系統，其包含有一起重機本體、一掛鉤、一連接件、至少一個雷射感測器及一警報裝置，該掛鉤係透過連接件與起重機本體可昇降地相連接，該至少一雷射感測器係設置於起重機本體底面且可發出雷射光線，該警報裝置係與該至少一雷射感測器相連接，以發出一警報訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an anti-collision system for an overhead crane comprising a crane body, a hook, a connection member, at least one laser sensor, and a warning device. The hook is connected movably to the crane body by the connection member. The at least one laser sensor is mounted on a bottom of the crane body and is applied to shoot a laser beam. The warning device is connected electrically with the at least one laser sensor to generate a warning signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:起重機本體</p>  
        <p type="p">12:掛鉤</p>  
        <p type="p">14:連接件</p>  
        <p type="p">20:雷射感測器</p>  
        <p type="p">30:物件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="510" publication-number="202612781"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612781.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612781</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136797</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高效能氣體溶解設備</chinese-title>  
        <english-title>HIGH-EFFICIENCY GAS DISSOLVING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120241105B">B01F23/20</main-classification>  
        <further-classification edition="200601120241105B">F15C1/18</further-classification>  
        <further-classification edition="200601120241105B">F15D1/06</further-classification>  
        <further-classification edition="200601120241105B">A01K63/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華照環保設備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾良信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾昇儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾佩蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之高效能氣體溶解設備，包括：液流管主體以及氣體導流件。該液流管主體具有：進水口、進氣口、排流口以及凸肋。該進水口形成於該液流管主體的一端；進氣口設置於靠近進水口的液流管主體之外表面。該氣體導流件設置於液流管主體之中，並且外徑小於液流管主體的管體內徑，用以形成導氣間隙，以及遮蓋住進氣口使氣體順著導氣間隙流動。該氣體導流件具有：凸緣端、斜面端、導氣肋條以及複數凸塊，其中，該凸緣端形成於氣體導流件靠近進氣口的一端；該斜面端形成於相對另一端；該導氣肋條設置於氣體導流件的管體外表面；以及複數凸塊間隔設置於斜面端，並且連接導氣肋條。該斜面端形成一斜角，使氣體導流件靠近進氣口一側的長度比相對另一側長，從而讓氣體進入導氣間隙後到各出氣孔的距離相近，用以控制氣體均勻地從出氣孔離開形成體積相近的氣泡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A high-efficiency gas dissolving equipment of the present invention includes a liquid flow tube main body and a gas guide element. The liquid flow tube main body has a water inlet, an air inlet, a discharge outlet, and a convex rib. The water inlet is formed at one end of the liquid flow tube main body. The air inlet is provided on the outer surface of the liquid flow tube main body closes to the water inlet. The gas guide element is used to be disposed in the liquid flow tube main body, which having an outer diameter smaller than the inner diameter of the liquid flow tube main body, so as to form an air guide gap between the outer diameter of the gas guide element and the inner diameter of the liquid flow tube main body. The gas guide element covers the air inlet, allowing gas to flow along the air guide gap. The gas guide element has a flange end, a bevel end, a gas guide rib, and a plurality of bumps. Wherein, the flange end is formed on one end of the gas guide element near to the air inlet, while the bevel end is formed on the opposite end. The gas guide ribs are arranged on the outer surface of the gas guide element, and a plurality of bumps are　arranged on the out surface of the gas guide element closes to the bevel end. The bevel end forms a bevel angle, which leading one side of the gas guide element being longer than the opposite side. This ensures that the distances from the positions of the gas entering the air guide gap to the discharge outlet are similar, which allowing for the uniform distribution of gas and forming similar volume bubbles to discharge through the discharge outlet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:液流管主體</p>  
        <p type="p">11:進水口</p>  
        <p type="p">12:進氣口</p>  
        <p type="p">13:排流口</p>  
        <p type="p">14:凸肋</p>  
        <p type="p">141:第一凸肋</p>  
        <p type="p">142:第二凸肋</p>  
        <p type="p">201:導氣間隙</p>  
        <p type="p">21:凸緣端</p>  
        <p type="p">23:導氣肋條</p>  
        <p type="p">231:第一導氣肋條</p>  
        <p type="p">232:第二導氣肋條</p>  
        <p type="p">24:凸塊</p>  
        <p type="p">25:防呆凸鍵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="511" publication-number="202614087"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614087.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614087</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136813</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>醫療管理系統</chinese-title>  
        <english-title>MEDICAL MANAGEMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120241011B">G16H40/20</main-classification>  
        <further-classification edition="201801120241011B">G16H40/40</further-classification>  
        <further-classification edition="202301120241011B">G06Q10/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>世大福智科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEDA G-TECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐業良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YEH-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易均鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI, CHUN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃聖凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHENG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐浩恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HAO-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種醫療管理系統，其包含中央控制裝置、多個無線接收器多個智慧床墊及管理應用程式。多個無線接收器設置於多個房間中，各個房間設置有至少一張智慧床墊。各個智慧床墊能每間隔預設時間廣播床墊封包。各床墊封包包含床墊識別資料。各無線接收器能每間隔預設時間，向中央控制裝置傳遞整合資訊。整合資訊包含無線接收器接收到的各個床墊封包及其對應的RSSI值。中央控制裝置接收多個整合資訊後，能依據RSSI值篩選出位於同一個房間的智慧床墊，並據以判斷各個房間中的智慧床墊的床墊識別資料，與初始設定是否相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a medical management system, comprising a central control device, a plurality of wireless receivers, a plurality of pressure sensing mattress, and a management application. The plurality of wireless receivers are installed in a plurality of rooms, each room being equipped with at least one pressure sensing mattress. Each pressure sensing mattress is capable of broadcasting mattress packets at predetermined intervals. Each mattress packet comprises mattress identification data. The wireless receivers are configured to transmit integration information to the central control device at predetermined intervals. The integration information comprises the mattress packets received by the wireless receivers and their corresponding RSSI values. Upon receiving the integration information from the plurality of wireless receivers, the central control device is capable of filtering the pressure sensing mattress located in the same room based on the RSSI values and determining whether the mattress identification data of the pressure sensing mattress in each room matches the initial configuration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:查找步驟</p>  
        <p type="p">S2:比對步驟</p>  
        <p type="p">S3:警示步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="512" publication-number="202613860"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613860.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613860</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136819</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>漏洞修補主機稽查系統及其方法</chinese-title>  
        <english-title>VULNERABILITY PATCHING HOST AUDIT SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250203B">G06F21/57</main-classification>  
        <further-classification edition="201801120250203B">G06F8/65</further-classification>  
        <further-classification edition="202301120250203B">G06Q40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣土地銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAND BANK OF TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, KUAN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種漏洞修補主機稽查系統包括通訊模組、漏洞資訊比對模組及漏洞修補管理模組。上述通訊模組用以接收及傳輸資訊。上述漏洞資訊比對模組，用以透過通訊模組發查外部資料庫以取得一漏洞修補資訊，並將漏洞修補資訊與銀行軟硬體設備資訊進行比對，產生一受影響軟硬體設備資訊，或根據受影響軟硬體設備資訊對漏洞修補完成資訊進行比對，產生一稽查結果。上述漏洞修補管理模組用以將受影響軟硬體設備資訊的一漏洞修補任務進行派送，並追蹤漏洞修補任務的修補進度，以及接收通訊模組傳輸的預計完成日期，並供行員裝置透過進行漏洞修補任務。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A vulnerability patching host audit system includes a communication module, a vulnerability information comparison module, and a vulnerability patch management module. The communication module is configured to receive and transmit information. The vulnerability information comparison module is used to compare vulnerability patch information with the hardware and software information of banking systems, generating affected hardware and software information, or to compare the vulnerability patch completion information based on the affected hardware and software information, thereby generating an audit result. The vulnerability patch management module allows security personnel to view and assess the affected hardware and software information, assign a patching task for the affected hardware and software, track the progress of the patching task, and receive the estimated completion date transmitted by the communication module. The vulnerability patch management module also enables banking staff to perform patching tasks through their devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:漏洞修補主機稽查系統</p>  
        <p type="p">110:通訊模組</p>  
        <p type="p">120:漏洞資訊比對模組</p>  
        <p type="p">130:漏洞修補管理模組</p>  
        <p type="p">140:審核模組</p>  
        <p type="p">150:漏洞修補資料庫</p>  
        <p type="p">160:外部資料庫</p>  
        <p type="p">170:行員裝置</p>  
        <p type="p">180:主機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="513" publication-number="202613503"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613503.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613503</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136822</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>秤重裝置及電位平衡器</chinese-title>  
        <english-title>WEIGHING DEVICE AND POTENTIAL BALANCER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">G01G7/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>章嘉企業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG JIA LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃振榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHENG JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃啟軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHI HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃啟睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHI-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種秤重裝置，包括一殼體、一秤盤、一測重感應單元及一電位平衡器。殼體具有一固定座，秤盤設置於殼體的固定座上，秤盤與測重感應單元連接，待測物置放於秤盤上時，待測物對測重感應單元施壓，用以進行秤重。電位平衡器設置於秤盤的周圍，電位平衡器包含一基座及至少一個輻射源，輻射源設置於基座上，輻射源包含放射性元素，能釋放出α粒子，以達到電位平衡。由此，能達到消除靜電的目的，以提升秤值的準確性和精密性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A weighing device includes a housing, a weighing pan, a weight sensing unit, and a potential balancer. The housing has a fixed seat, and the weighing pan is arranged on the fixed seat of the housing. The weighing pan is connected to the weight sensing unit. When an object to be measured is placed on the weighing pan, the object exerts pressure on the weight sensing unit for weighing. The potential balancer is arranged around the weighing pan. The potential balancer includes a base and at least one radiation source. The radiation source is arranged on the base. The radiation source contains radioactive elements and can release alpha particles to achieve potential balance. Therefore, the purpose of eliminating static electricity can be achieved to improve the accuracy and precision of the scale value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:殼體</p>  
        <p type="p">11:固定座</p>  
        <p type="p">2:秤盤</p>  
        <p type="p">3:測重感應單元</p>  
        <p type="p">4:電位平衡器</p>  
        <p type="p">5:重量顯示單元</p>  
        <p type="p">6:秤盤防風罩</p>  
        <p type="p">G:間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="514" publication-number="202613366"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613366.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613366</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136823</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固定模組以及處理裝置</chinese-title>  
        <english-title>FIXED MODULE AND PROCESSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">C25D17/06</main-classification>  
        <further-classification edition="200601120241029B">C25D21/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鎧柏科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADNANOTEK CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊楷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種固定模組以及處理裝置。固定模組包括一第一夾持元件、一第二夾持元件、一固定元件、一轉動元件以及一彈性元件。第一夾持元件被配置用於夾持一物件。第二夾持元件對應於第一夾持元件，第二夾持元件被配置用於夾持物件。固定元件對應於第二夾持元件。轉動元件對應於第二夾持元件。彈性元件連接於第二夾持元件與固定元件，彈性元件之一部分本體套設於轉動元件。固定模組藉由彈性元件拉動第二夾持元件，以使第二夾持元件對物件施予一拉緊力。藉此，本發明之固定模組以及處理裝置可提升鍍膜良率及表面鍍膜均勻度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fixed module and a processing device are provided. The fixed module includes a first clamping element, a second clamping element, a fixed element, a rotating element and an elastic element. The first clamping element is configured to clamp an object. The second clamping element corresponds to the first clamping element and is configured to clamp the object. The fixed element corresponds to the second clamping element. The rotating element corresponds to the second clamping element. The elastic element is connected to the second clamping element and the fixed element, and a part of the body of the elastic element is sleeved on the rotating element. The fixed module pulls the second clamping element through the elastic element, so that the second clamping element exerts a tensile force on the object. By means of the present disclosure, the fixed module and the processing device can improve the coating yield and surface coating uniformity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">D:固定模組</p>  
        <p type="p">D1:第一夾持元件</p>  
        <p type="p">D10:第一底座件</p>  
        <p type="p">D11:第一上夾件</p>  
        <p type="p">D12:第一下夾件</p>  
        <p type="p">D2:第二夾持元件</p>  
        <p type="p">D20:第二底座件</p>  
        <p type="p">D21:第二上夾件</p>  
        <p type="p">D22:第二下夾件</p>  
        <p type="p">D3:固定元件</p>  
        <p type="p">D4:轉動元件</p>  
        <p type="p">D5:彈性元件</p>  
        <p type="p">D6:基座元件</p>  
        <p type="p">D60:滑槽部</p>  
        <p type="p">B:物件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="515" publication-number="202612680"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612680.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612680</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136833</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鼻胃管結構</chinese-title>  
        <english-title>NASOGASTRIC TUBE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">A61J15/00</main-classification>  
        <further-classification edition="200601120241125B">A61M39/08</further-classification>  
        <further-classification edition="200601120241125B">A61M39/10</further-classification>  
        <further-classification edition="200601120241125B">A61M25/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺北醫學大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIPEI MEDICAL UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周百謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, PAI-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇雪蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HSUEH-LIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊雅婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUANG, YA-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳孚竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種鼻胃管結構，其包括嵌埋於可撓性管體的管壁中的可溫控形變線體，以配合溫度的變化致使線體形變，進而改變管體的管徑大小，藉此可以小管徑的狀態進行放置鼻胃管的操作，以提升患者的舒適度，並於完成鼻胃管的放置後，能使管體隨著線體的形變而成為大管徑的狀態，以利於患者的進食和服藥。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a nasogastric tube structure including a temperature-controllable and deformable wire embedded within the wall of a flexible tube. The wire deforms in response to temperature changes, thereby altering the diameter of the tube. This allows the nasogastric tube to be inserted with a reduced diameter, enhancing patient comfort during the procedure. After the nasogastric tube is in place, the tube expands to a larger diameter as the wire deforms, facilitating the patient’s feeding and medication administration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:鼻胃管結構</p>  
        <p type="p">10:管體</p>  
        <p type="p">10c:管壁</p>  
        <p type="p">100:通道</p>  
        <p type="p">11:線體</p>  
        <p type="p">110:環狀結構</p>  
        <p type="p">111:桿狀結構</p>  
        <p type="p">S:缺口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="516" publication-number="202612752"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612752.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612752</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136834</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣切管結構</chinese-title>  
        <english-title>TRACHEOSTOMY TUBE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A61M16/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺北醫學大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIPEI MEDICAL UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周百謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, PAI-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇雪蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HSUEH-LIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊雅婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUANG, YA-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳孚竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種氣切管結構，其包括嵌埋於可撓性管體的管壁中的可溫控形變線體，以配合溫度的變化致使線體形變，進而改變管體的管徑大小，藉此可以小管徑的狀態進行放置氣切管的操作，以提升患者的舒適度，並於完成氣切管的放置後，能使管體隨著線體的形變而成為大管徑的狀態，以利於患者的呼吸，並避免痰液的積累而造成生物膜的形成，以及痰液積留在氣切管和氣管間空間的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a tracheostomy tube structure, which includes a temperature-controllable and deformable wire embedded in the wall of a flexible tube. The wire deforms in response to temperature changes, thereby altering the diameter of the tube. This allows the tracheostomy tube to be inserted with a reduced diameter, enhancing patient comfort during the procedure. After the tracheostomy tube is in place, the tube can expand to a larger diameter as the wire deforms, preventing the accumulation of sputum that could lead to biofilm formation and addressing the issue of sputum accumulation in the space between the tracheostomy tube and the trachea, thereby facilitating better breathing for the patient.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:氣切管結構</p>  
        <p type="p">10:管體</p>  
        <p type="p">10c:管壁</p>  
        <p type="p">100:通道</p>  
        <p type="p">11:線體</p>  
        <p type="p">110:環狀結構</p>  
        <p type="p">111:桿狀結構</p>  
        <p type="p">S:缺口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="517" publication-number="202614529"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614529.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614529</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136848</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>充電器</chinese-title>  
        <english-title>CHARGER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">H02J7/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡博文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, BO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種充電器，包括一印刷電路板組件以及一散熱殼體結構。散熱殼體結構包括一主體、一鰭片結構以及一風扇。主體具有一收納部、一第一側壁以及一第二側壁。第一側壁具有一內表面和與內表面相對之一外表面。第一側壁之內表面面向印刷電路板組件。第二側壁垂直於第一側壁。鰭片結構設置於主體的第一側壁之外表面。風扇設置於第二側壁，將鰭片結構所吸收的熱向外抽出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A charger is provided. The charger includes a printed circuit board assembly and a heat dissipation housing structure. The heat dissipation housing structure includes a body, a fin structure, and a fan. The body has an accommodating portion, a first surface, and a second surface. The first surface is the surface of the accommodating portion facing away from the printed circuit board assembly. The second surface is perpendicular to the first surface. The fin structure is disposed on the first surface of the body. The fan is disposed on the second surface, extracting the heat absorbed by the fin structure outward.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:充電器</p>  
        <p type="p">1001:入風口</p>  
        <p type="p">1002:出風口</p>  
        <p type="p">1210:主體</p>  
        <p type="p">1212:第二側壁</p>  
        <p type="p">1213:淨空部</p>  
        <p type="p">1217:開口</p>  
        <p type="p">1219:電源連接部</p>  
        <p type="p">1220:鰭片結構</p>  
        <p type="p">1230:風扇</p>  
        <p type="p">1235:旋轉軸</p>  
        <p type="p">1400:上蓋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="518" publication-number="202612927"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612927.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612927</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136849</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>充電樁</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241225B">B60L53/31</main-classification>  
        <further-classification edition="201901120241225B">B60L53/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林松柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明包括：一個主軌、一個充電樁、一台電機與一個支架。該支架結合該主軌，能沿著該主軌的一個長度方向往復運動。該充電樁結合該支架。該充電樁伸出一條充電線帶有一個接頭。該電機帶動該支架相對該主軌位移，移動該充電樁靠近不動的電動車、蓄電電池或設備予以充電，藉此消弭先前技術讓電動車、蓄電電池或設備移動地靠近充電樁所造成的壅塞現象。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:主軌</p>  
        <p type="p">11:齒條</p>  
        <p type="p">14:電力線</p>  
        <p type="p">20:充電樁</p>  
        <p type="p">21:充電線</p>  
        <p type="p">22:接頭</p>  
        <p type="p">23:電機</p>  
        <p type="p">25:收發器</p>  
        <p type="p">26:電機軸</p>  
        <p type="p">27:齒輪</p>  
        <p type="p">30:控制器</p>  
        <p type="p">31:傳輸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="519" publication-number="202612928"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612928.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612928</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136850</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>饋電移動式充電樁</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120241029B">B60L53/31</main-classification>  
        <further-classification edition="201901120241029B">B60L53/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林松柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明包括：一個導電面；一台發電機，其供應電力至該導電面；一個充電樁，其伸出一條充電線帶有一個接頭；多個輪子，設在該充電樁的底部，該輪子是不導電的，其滾動接觸該導電面；以及，一個處理器，其結合該充電樁一起位移，該處理器接收該發電機的電，決定各該輪子帶動該充電樁在該導電面移動。本發明採用饋電模式，移動該充電樁靠近電動車、蓄電電池或設備充電，藉以消弭先前技術移動電動車、蓄電電池或設備靠近充電樁所造成的壅塞現象。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:導電面</p>  
        <p type="p">11、13:焊點</p>  
        <p type="p">12:導電網</p>  
        <p type="p">14:導電體</p>  
        <p type="p">15:發電機</p>  
        <p type="p">16:開關</p>  
        <p type="p">20:充電樁</p>  
        <p type="p">21:導電桿</p>  
        <p type="p">22:集電弓</p>  
        <p type="p">23:電機</p>  
        <p type="p">24:轉向器</p>  
        <p type="p">25:輪子</p>  
        <p type="p">26:電力線</p>  
        <p type="p">27:充電線</p>  
        <p type="p">28:接頭</p>  
        <p type="p">29:導電輪</p>  
        <p type="p">30:控制單元</p>  
        <p type="p">31:按鍵</p>  
        <p type="p">32:傳輸</p>  
        <p type="p">33:處理器</p>  
        <p type="p">34:收發單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="520" publication-number="202613324"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613324.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613324</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136851</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無鋁電磁鋼精煉方法與系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR REFINING ALUMINUM-FREE ELECTROMAGNETIC STEEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">C21D8/12</main-classification>  
        <further-classification edition="200601120241204B">C22C38/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭弘志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HUNG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李韋易</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WEI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林常盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHANG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳正桓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHENG-HUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種無鋁電磁鋼精煉方法與系統。此系統包含記憶體與處理器。處理器係用以載入記憶體之指令，以進行上述之方法，上述控制方法包含：計算合金材料之最低成本投入量組合；根據最低成本投入量組合來將合金材料投入至鋼液中；進行精煉製程，以利用含有合金材料之鋼液來生產精煉後無鋁電磁鋼液。最低成本投入量之計算包含：提供預設線性方程式：根據精煉製程之歷史資料以及預設線性方程式來利用類神經網路預測得到濃度上升與下降函式；代入當前製程參數值至預設線性方程式；進行投入量最佳化計算，以獲得上述最低成本投入量組合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and a system for refining aluminum-free electromagnetic steel are provided. The system includes a memory and a processor. The processor is configured to load instructions in the memory to perform the method. The method includes: calculating an input amount set of alloy material for lowest cost; putting the alloy material into molten steel in accordance with the input amount set of alloy material for lowest cost; performing a refining process to use the molten steel having the alloy material to produce aluminum-free electromagnetic steel. The calculating the input amount set of alloy material for lowest cost includes: providing a predetermined linear equation; predicting a concentration increasing function and a concentration decreasing function by using an artificial neural network in accordance with historical data of the refining process and the predetermined linear equation; substituting current values of process parameters into the predetermined linear equation; performing an optimized input amount calculation to obtain the input amount set of alloy material for lowest cost.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:步驟</p>  
        <p type="p">210~240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="521" publication-number="202612863"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612863.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612863</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136862</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偵測機器人關節極限角度的裝置及方法</chinese-title>  
        <english-title>DEVICE AND METHOD FOR DETECTING LIMIT ANGLES OF ROBOT JOINTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241030B">B25J9/12</main-classification>  
        <further-classification edition="200601120241030B">B25J17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>先鋒材料科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PIONEER MATERIAL PRECISION TECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉禮源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, LI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張昌祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHANG-QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃偉煜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉欽宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHING-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種偵測機器人關節極限角度的裝置，包括電流檢測晶片、脈衝寬度調變(Pulse-width modulation; PWM)訊號輸出晶片、可調式穩壓模組及主控晶片。電流檢測晶片用以檢測機器人關節的馬達之消耗電流，PWM訊號輸出晶片用以輸出PWM訊號以驅動馬達，可調式穩壓模組用以提供馬達所需的供電電壓及主控晶片，連接至電流檢測晶片、PWM訊號輸出晶片及可調式穩壓模組，用以根據消耗電流及PWM訊號判斷馬達何時堵轉並計算馬達旋轉的正轉極限角度、反轉極限角度及初始角度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device for detecting the limit angle of robot joints, including a current detecting chip, a pulse-width modulation (PWM) signal output chip, an adjustable power supply module and a main control chip. The current detecting chip is used to detect the current consumption of a motor of the robot joint. The PWM signal output chip is used to output the PWM signal to drive the motor. The adjustable power supply module is used to provide the power supply required by the motor. The main control chip is connected to the current detecting chip, the PWM signal output chip and the adjustable power supply module, and used to determine when the motor is stalled based on the current consumption and PWM signal and calculate the forward limit angle, reverse limit angle and initial angle of the motor rotation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:裝置</p>  
        <p type="p">102:主控晶片</p>  
        <p type="p">104:電流檢測晶片</p>  
        <p type="p">106:PWM訊號輸出晶片</p>  
        <p type="p">108:可調式穩壓模組</p>  
        <p type="p">110:馬達</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="522" publication-number="202613223"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613223.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613223</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136875</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可可殻降解成聚醣接枝於高分子及其紗線之製程方法</chinese-title>  
        <english-title>PRODUCTION METHOD FOR DEGRADING COCOA SHELL INTO POLYSACCHARIDE FOR GRAFTING ONTO POLYMER AND YARNS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">C08J11/10</main-classification>  
        <further-classification edition="200601120250901B">C08L97/00</further-classification>  
        <further-classification edition="200601120250901B">C08B37/00</further-classification>  
        <further-classification edition="200601120250901B">C08F251/00</further-classification>  
        <further-classification edition="200601120250901B">D01F8/18</further-classification>  
        <further-classification edition="200601120250901B">D01D5/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張寺榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SI-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張寺榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SI-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可可殻降解成聚醣接枝於高分子之製程方法，其製程方法包括有：製備有厭氧嗜熱木質素分解菌及可可殻粉體；取可可殻粉體加入一具有厭氧嗜熱木質素分解菌之分解菌培養液，得到可可殻降解水溶液；由可可殻降解水溶液之中取得一降解後之醣類液體，再與山梨醇及檸檬酸進行高溫熔融以聚合成一聚醣粉體；再將聚醣粉體、N-異丙基丙烯醯胺(NIPAAm)、引發劑置入一裝有乙醇之反應容器內，得到一聚醣接枝N-異丙基丙烯醯胺(NIPAAm)粉體；最後，再與高分子物進行一共混程序，即完成令聚醣接枝N-異丙基丙烯醯胺(NIPAAm)粉體和高分子物共價接合；此外，可再進一步製成塑膠母粒，藉以抽紗織成布料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A production method for degrading cocoa shell into polysaccharide for grafting onto polymer. The production method includes: preparing anaerobic thermophilic lignin-decomposing bacteria and cocoa shell powder; adding the cocoa shell powder into decomposing bacteria culture solution with anaerobic thermophilic lignin-decomposing bacteria to obtain a cocoa shell degradation aqueous solution; obtaining a degraded saccharide liquid from the cocoa shell degradation aqueous solution to undergo high temperature melting with sorbitol and citric acid so as to polymerize into a polysaccharide powder; then placing the polysaccharide powder, N-isopropylacrylamide (NIPAAm), and an initiator into a reaction vessel filled with ethanol to obtain a polysaccharide-grafted N-isopropylacrylamide (NIPAAm) powder; and finally, performing a blending process with a polymer to complete covalent bonding of the polysaccharide-grafted N-isopropylacrylamide (NIPAAm) powder and the polymer. In addition, a plastic masterbatch can then be made for drawing into yarns and weaving into fabrics.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">步驟1~步驟4</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="523" publication-number="202612765"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612765.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612765</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136880</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智慧型投球訓練模組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241031B">A63B69/00</main-classification>  
        <further-classification edition="200601120241031B">A63B71/00</further-classification>  
        <further-classification edition="200601120241031B">A63B71/14</further-classification>  
        <further-classification edition="200601120241031B">A63B24/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立體育大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN SPORT UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱炳坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, PING-KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯文慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, TZU TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王偉杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種智慧型投球訓練模組，其包含一手套本體，手套本體包含有一手掌部、一開口部、複數指套孔及複數指套部，其中各指套部分別為手掌部之延伸；複數負重物，各負重物分別結合於各指套部之末端；複數彈力元件，各彈力元件分別結合於各指套部對應人體指背之一面；及至少一感測單元，其可結合於手掌部或指套部。當使用者將手由後向前揮動時，負重物及各彈力元件即產生一反作用力拉動手指，因而達到鍛鍊手指之功效，可增進投球揮臂速度和球速；感測單元並可偵測並傳送使用者手部移動的相關力學數據至一運算裝置進行分析。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:手套本體</p>  
        <p type="p">10:手掌部</p>  
        <p type="p">11:負重物</p>  
        <p type="p">12:指套部</p>  
        <p type="p">13:開口部</p>  
        <p type="p">14:指套孔</p>  
        <p type="p">15:彈力元件</p>  
        <p type="p">2:感測單元</p>  
        <p type="p">20:感測器</p>  
        <p type="p">21:電力元件</p>  
        <p type="p">22:無線傳輸元件</p>  
        <p type="p">23:充電元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="524" publication-number="202613662"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613662.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613662</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136881</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示模組及包含其之顯示系統</chinese-title>  
        <english-title>DISPLAY MODULE AND DISPLAY SYSTEM INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241213B">G02B27/01</main-classification>  
        <further-classification edition="200601120241213B">G02B5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃彥茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YEN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳嘉鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李岳衡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YUEH-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭璿睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, HSUAN-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種顯示模組及包含其之顯示系統。顯示模組包含背光模組；第一稜鏡層，設置於背光模組上且具有複數條第一稜鏡柱沿著第一方向延伸；第二稜鏡層，設置於第一稜鏡層上且具有複數條第二稜鏡柱沿著橫切第一方向之第二方向延伸；及顯示面板，設置於第二稜鏡層上。第一稜鏡柱背向背光模組突出，且在第一方向為法線方向之虛擬平面上具有三角形之第一稜鏡剖面。第二稜鏡柱背向背光模組突出，且在第二方向為法線方向之虛擬平面上具有三角形之第二稜鏡剖面。第二稜鏡剖面之頂點垂直投影在底邊上時沿著第一方向相對底邊中心偏移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a display module and a display system including the same. The display module includes a backlight module; a first prism layer disposed on the backlight module and having a plurality of first prismatic structure extending along a first direction; a second prism layer disposed on the first prism layer and having a plurality of second prismatic structure extending along a second direction transverse to the first direction; and a display panel disposed on the second prism layer. The first prismatic structure protrudes away from the backlight module and has a first prismatic section with a triangular profile on a virtual plane in which the normal direction is the first direction. The second prismatic structure protrudes away from the backlight module and has a second prismatic section with a triangular profile on a virtual plane in which the normal direction is the second direction. The vertex of the second prismatic section is offset along the first direction relative to a center of a base edge when vertically projected onto the base edge.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示模組</p>  
        <p type="p">100:第一稜鏡層</p>  
        <p type="p">110:第一稜鏡柱</p>  
        <p type="p">200:第二稜鏡層</p>  
        <p type="p">220:第二稜鏡柱</p>  
        <p type="p">300:光學元件</p>  
        <p type="p">310:第一光學層</p>  
        <p type="p">320:第二光學層</p>  
        <p type="p">BL:背光模組</p>  
        <p type="p">DP:顯示面板</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">VT1:虛擬平面</p>  
        <p type="p">VT2:虛擬平面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="525" publication-number="202613645"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613645.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613645</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136884</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>取像光學系統、取像裝置及電子裝置</chinese-title>  
        <english-title>IMAGING OPTICAL SYSTEM, IMAGE CAPTURING UNIT AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241209B">G02B11/32</main-classification>  
        <further-classification edition="202101120241209B">G02B7/02</further-classification>  
        <further-classification edition="200601120241209B">G02B3/00</further-classification>  
        <further-classification edition="202101120241209B">G03B17/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大立光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARGAN PRECISION CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯郁淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, YU-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖冠智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, GUAN-JR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種取像光學系統，包含六片透鏡。六片透鏡沿光路由物側至像側依序為第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡與第六透鏡。第二透鏡像側表面於近光軸處為凹面。第三透鏡具有正屈折力。第四透鏡具有負屈折力，且第四透鏡像側表面於近光軸處為凸面。第五透鏡具有正屈折力，且第五透鏡像側表面於近光軸處為凸面。第六透鏡像側表面具有至少一反曲點。取像光學系統更包含一光圈，且光圈位於被攝物與第二透鏡之間。當滿足特定條件時，取像光學系統能同時滿足微型化、大視角和高成像品質的需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An imaging optical system includes six lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element and a sixth lens element. The second lens element has an image-side surface being concave in a paraxial region thereof. The third lens element has positive refractive power. The fourth lens element with negative refractive power has an image-side surface being convex in a paraxial region thereof. The fifth lens element with positive refractive power has an image-side surface being convex in a paraxial region thereof. The sixth lens element has an image-side surface having at least one inflection point. The imaging optical system further includes an aperture stop located between an imaged object and the second lens element. When specific conditions are satisfied, the requirements of compact size, large field of view and high image quality can be met by the imaging optical system, simultaneously.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:取像裝置</p>  
        <p type="p">ST:光圈</p>  
        <p type="p">S1,S2,S3:光闌</p>  
        <p type="p">E1:第一透鏡</p>  
        <p type="p">E2:第二透鏡</p>  
        <p type="p">E3:第三透鏡</p>  
        <p type="p">E4:第四透鏡</p>  
        <p type="p">E5:第五透鏡</p>  
        <p type="p">E6:第六透鏡</p>  
        <p type="p">E7:濾光元件</p>  
        <p type="p">IMG:成像面</p>  
        <p type="p">IS:電子感光元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="526" publication-number="202613829"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613829.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613829</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136885</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單一信號線協定方法</chinese-title>  
        <english-title>SINGLE-WIRE PROTOCOL METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">G06F13/38</main-classification>  
        <further-classification edition="200601120250203B">G06F13/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致新科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBAL MIXED-MODE TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖振羽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種單一信號線協定方法包含：根據一脈波定義表，經由一單一信號線匯流排輸入(X1+M1)個脈波，其中M1小於或等於2 &lt;sup&gt;A1&lt;/sup&gt;。根據該脈波定義表，輸入該(X1+M1)個脈波後，經由該單一信號線匯流排輸入(Y1+N1)個脈波，其中N1小於或等於2 &lt;sup&gt;B1&lt;/sup&gt;，該(M1+N1)個脈波係用以設定一第一輸出電壓，基於A1與B1，該第一輸出電壓至多具有 &lt;img align="absmiddle" height="29px" width="88px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;個電壓位準。藉由將該第一輸出電壓拆分為兩組，即可減少一電壓設定指令之一寫入時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A single-wire protocol method comprises: inputting (X1+M1) pulses through a single-wire bus according to a pulse definition table, where M1 is less than or equal to 2 &lt;sup&gt;A1&lt;/sup&gt;; and after inputting the (X1+M1) pulses, inputting (Y1+N1) pulses through the single-wire bus according to the pulse definition table, where N1 is less than or equal to 2 &lt;sup&gt;B1&lt;/sup&gt;, the (M1+N1) pulses are utilized to set a first output voltage, and the first output voltage has at most &lt;img align="absmiddle" height="30px" width="99px" file="ed10011.JPG" alt="ed10011.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; voltage levels based on A1 and B1. By dividing the first output voltage into two parts, it is capable of reducing a write time of a voltage setting instruction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電源供應電路</p>  
        <p type="p">SWB:單一信號線匯流排</p>  
        <p type="p">AVEE:第一輸出電壓</p>  
        <p type="p">VSS:第二輸出電壓</p>  
        <p type="p">AVDD:第三輸出電壓</p>  
        <p type="p">VCORE:第四輸出電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="527" publication-number="202612910"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612910.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612910</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136888</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多層膜料的製造方法及膜料裁切方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING MULTI-LAYER FILM AND FILM CUTTING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B32B37/26</main-classification>  
        <further-classification edition="200601120241105B">B32B38/00</further-classification>  
        <further-classification edition="200601120241105B">B26D1/12</further-classification>  
        <further-classification edition="200601120241105B">B26D3/08</further-classification>  
        <further-classification edition="200601120241105B">B26D7/18</further-classification>  
        <further-classification edition="200601120241105B">B26F1/38</further-classification>  
        <further-classification edition="200601120241105B">H01L21/02</further-classification>  
        <further-classification edition="200601120241105B">H01L21/67</further-classification>  
        <further-classification edition="200601120241105B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>志聖工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>C SUN MFG. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MING-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴家偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIA-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳士正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHI-ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種多層膜料的製造方法。提供原始膜料，包含至少一功能膜以及一離型膜。提供結構加強膜料，包含結構加強膜及離型膜。以離型機構自結構加強膜料移除離型膜。以夾貼機構將結構加強膜與功能膜貼合，而獲得包含功能膜及結構加強膜的多層膜料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">a method for manufacturing multi-layer film includes a step of providing an initial film containing at least one functional layer and one release layer, a step of providing a structural strengthening layer, a step of separating the release layer from the structural strengthening layer by a release mechanism, and a step of using a clamping mechanism to adhere the structural strengthening layer to the functional layer, such that a multilayer film containing said structural strengthening layer said the functional layer is obtained.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">F:原始膜料</p>  
        <p type="p">F”:多層膜料</p>  
        <p type="p">F0:結構加強膜料</p>  
        <p type="p">F3:結構加強膜</p>  
        <p type="p">F4:離型膜</p>  
        <p type="p">1:離型機構</p>  
        <p type="p">10a、10b:安裝輥</p>  
        <p type="p">11a、11b:捲收輥</p>  
        <p type="p">100:加工區域</p>  
        <p type="p">2:夾貼機構</p>  
        <p type="p">20:壓膜輥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="528" publication-number="202613998"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613998.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613998</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136889</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遠端操控的反饋方法及系統</chinese-title>  
        <english-title>METHOD AND SYSTEM OF REMOTE OPERATION FEEDBACK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241028B">G09B5/08</main-classification>  
        <further-classification edition="200601120241028B">G09B5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人資訊工業策進會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INSTITUTE FOR INFORMATION INDUSTRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉記顯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHI HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王上銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHANG MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種遠端操控的反饋方法及系統。遠端操控的反饋方法，由運算裝置執行，包括：利用被操作數位物件的多筆訓練資料進行訓練以產生腳本模型，其中各訓練資料包括被操作數位物件受控在多個自由度的運動的訓練軌跡及對應的預設軌跡類型，根據來自授權裝置的權限開放指令開放多個被授權裝置操作被操作數位物件的權限，以從被授權裝置取得被操作數位物件受控在自由度的運動的多個待推論軌跡，將待推論軌跡輸入至腳本模型以取得推論軌跡類型，以及受來自授權裝置的權限回收指令觸發，以根據推論軌跡類型及被操作數位物件輸出動畫腳本至授權裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure proposes a method and system of remote operation feedback. The method of remote operation feedback, performed by a computing device, includes: using pieces of training data of a manipulated digital object to performing training to generate a script model, wherein each of the pieces training data includes a training trajectory of movement of the manipulated digital object controlled across degrees of freedom along with a corresponding default trajectory type, granting permission of authorized devices to manipulate the manipulated digital object according to a permission release from a authorizing device to obtain to-be-inferenced trajectories of movement of the manipulated digital object controlled across the degrees of freedom from the authorized devices, inputting the to-be-inferenced trajectories into the script model to obtain inferenced trajectory types, and triggered by a permission revocation command from the authorizing device to output an animation script to the authorizing device according to the inferenced trajectory types and the manipulated digital object.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101,S103,S105,S107:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="529" publication-number="202613863"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613863.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613863</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136892</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物理不可複製功能產生器結構</chinese-title>  
        <english-title>PHYSICAL UNCLONABLE FUNCTION GENERATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241104B">G06F21/73</main-classification>  
        <further-classification edition="200601120241104B">H04L9/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHIH-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡博安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, BO-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>車行遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHE, SHYNG-YEUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種物理不可複製功能產生器結構，包括第一二極體、第二二極體、第一熔絲與第二熔絲。第一二極體包括第一陽極與第一陰極。第二二極體包括第二陽極與第二陰極。第一陽極耦接於第二陽極。第一熔絲耦接於第一陰極。第二熔絲耦接於第二陰極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A physical unclonable function (PUF) generator including a first diode, a second diode, a first fuse, and a second fuse is provided. The first diode includes a first anode and a first cathode. The second diode includes a second anode and a second cathode. The first anode is coupled to the second anode. The first fuse is coupled to the first cathode. The second fuse is coupled to the second cathode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:物理不可複製功能產生器結構</p>  
        <p type="p">100,102:二極體</p>  
        <p type="p">200,202:熔絲</p>  
        <p type="p">300:電晶體</p>  
        <p type="p">302,304,306:電極</p>  
        <p type="p">308:基體</p>  
        <p type="p">A1,A2:陽極</p>  
        <p type="p">C1,C2:陽極</p>  
        <p type="p">V1,V2:電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="530" publication-number="202613626"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613626.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613626</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136894</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>矽光子晶圓的晶圓凸塊的形成方法和其晶圓保護結構</chinese-title>  
        <english-title>METHOD FOR FORMING WAFER BUMP OF SILICON PHOTONICS WAFER AND WAFER PROTECTION DEVICE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241024B">G02B6/13</main-classification>  
        <further-classification edition="200601120241024B">G02B6/122</further-classification>  
        <further-classification edition="200601120241024B">G02B6/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞峰半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAYTEK SEMICONDUCTOR, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巫金軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIN-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇靖凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, JING-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚志祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, CHIH-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡宏棋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, HUNG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許郁莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種矽光子晶圓的晶圓凸塊的形成方法及其晶圓保護結構。提供具有一光導入槽和一鋁墊分佈於一第一表面上的一矽光子晶圓基板，一第一保護層覆蓋於第一表面上並暴露出光導入槽和鋁墊的部分表面；共形地形成一球下金屬層於第一表面上；形成一第二保護結構於光導入槽上；形成一圖案化第一光阻層於第一表面上，其中圖案化第一光阻層覆蓋第二保護結構並暴露出鋁墊上的部分球下金屬層，因此構成一晶圓保護結構；形成一凸塊結構層於被暴露出的球下金屬層上；以及移除圖案化第一光阻層、第二保護結構和部分球下金屬層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for forming wafer bump of silicon photonics wafer and a wafer protection device are provided and include: providing a silicon photonics wafer which includes an optical fiber groove and an aluminum pad on a first surface and a passivation layer covering the first surface but exposing the optical fiber groove and partial surface of the aluminum pad; conformally forming a under bump metallization layer on the first surface; forming a second protect structure on the optical fiber groove; forming a pattern first photoresist layer on the first surface to cover the second protect structure and expose a portion of the under bump metallization layer on the aluminum pad so as to form a wafter protection device; forming a bump structure member on the exposed portion of the bump metallization layer; and removing the patterned first photoresist layer, the second protect structure, and the under bump metallization layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">41、43、45、46、47、49:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="531" publication-number="202612655"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612655.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612655</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136896</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>腋下汗腺切除刀具</chinese-title>  
        <english-title>EXCISION DEVICE FOR AXILLARY SUDORIFEROUS GLANDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">A61B17/3205</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李經維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佑俞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種腋下汗腺切除刀具，其包括：一汗腺切除模組，其包括：一剃刀外殼體，外部具有一連接用的螺孔以及一隔柵；至少一剃刀片，設於該剃刀外殼體內，該剃刀片具有一切除端以及一遠離該切除端的固定端，該切除端面向該隔柵；一彈性刀片底座，設置於該剃刀外殼體內的底部與該剃刀片之，用以固定支撐該剃刀片的該固定端；一握持管體，其一端成型有一螺孔連接部，該握持管體通過該螺孔連接部與剃刀外殼體的該螺孔連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a surgical instrument for axillary sudoriferous gland excision, comprising:A sudoriferous gland excision module, which includes:A razor housing, having an externally threaded hole for connection and a grid;At least one razor blade, disposed within the razor housing, said razor blade having an excision end and a fixing end distal to the excision end, with the excision end facing the grid;An elastic blade base, positioned within the bottom of the razor housing and beneath the razor blade, for fixedly supporting the fixing end of the razor blade;A grip tube, with one end formed as a threaded connecting portion, said grip tube being connected to the threaded hole of the razor housing via the threaded connecting portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:腋下汗腺切除刀具</p>  
        <p type="p">101:汗腺切除模組</p>  
        <p type="p">1011:剃刀外殼體</p>  
        <p type="p">1012:螺孔</p>  
        <p type="p">1013:隔柵</p>  
        <p type="p">102:握持管體</p>  
        <p type="p">1021:螺孔連接部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="532" publication-number="202612986"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612986.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612986</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136903</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>動力手持打包機結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">B65B13/32</main-classification>  
        <further-classification edition="200601120241230B">B65B13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>展旭包裝機材有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>温順賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林湧群</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹銘煌</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓修齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種動力手持打包機結構，其包括一主體、一束帶機構、一摩擦熔接裝置及一電動推桿裝置。束帶機構設在主體之前端，摩擦熔接裝置設在束帶機構之後方，電動推桿裝置設在摩擦熔接裝置之懸臂上方，並在主體中間位置設置一握把，其後端設置一電池插槽以安裝電池提供電源。捆紮帶環由束帶機構束緊，然後電動推桿裝置下壓懸臂至摩擦熔接位置將捆紮帶環夾緊，摩擦熔接裝置的偏心傳動裝置驅動滑設在懸臂內之摩擦滑塊快速往返平移，使捆紮帶環之上下重疊位置因摩擦發熱而熔化連接，藉由電動推桿裝置穩定加壓以穩固懸臂在摩擦熔接位置，確保捆紮帶被牢固熔接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:主體</p>  
        <p type="p">11:握把</p>  
        <p type="p">12:電池插槽</p>  
        <p type="p">13:電池</p>  
        <p type="p">14:操作桿</p>  
        <p type="p">15:底座</p>  
        <p type="p">2:束帶機構</p>  
        <p type="p">21:束緊底板</p>  
        <p type="p">3:摩擦熔接裝置</p>  
        <p type="p">4:電動推桿裝置</p>  
        <p type="p">41:推桿</p>  
        <p type="p">5:驅動馬達</p>  
        <p type="p">8:操作介面</p>  
        <p type="p">9:操作按鈕</p>  
        <p type="p">91:第一開關按鈕</p>  
        <p type="p">92:第二開關按鈕</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="533" publication-number="202614884"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614884.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614884</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136905</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件</chinese-title>  
        <english-title>SEMICONDUCTOR ELEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10H20/83</main-classification>  
        <further-classification edition="202501120250102B">H10H20/857</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富采光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENNOSTAR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳日康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIH-KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖清翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHING-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖偉鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, WEI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體元件包括半導體疊層、第一電極、第二電極、第一金屬結構以及第二金屬結構。半導體疊層包括第一半導體層、第二半導體層以及位於第一半導體層與第二半導體層之間的活性層。第一電極的一部分設置在半導體疊層的凹陷部中，並透過凹陷部電性連接第一半導體層。第二電極設置在第二半導體層上並電性連接第二半導體層。第一金屬結構設置在第一電極上，第二金屬結構設置在第二電極上。第一金屬結構與第二金屬結構沿著垂直於法線方向的第一方向排列，而在垂直法線方向的第二方向上，第一金屬結構的長度大於第二金屬結構的長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor element includes a semiconductor stack, a first electrode, a second electrode, a first metal structure and a second metal structure. The semiconductor stack includes a first semiconductor layer, a second semiconductor layer and an active layer located therebetween. A portion of the first electrode is electrically connected to the first semiconductor layer through a recess portion of the semiconductor stack. The second electrode is disposed on the second semiconductor layer and is electrically connected to the second semiconductor layer. The first metal structure is disposed on the first electrode, and the second metal structure is disposed on the second electrode. The first metal structure and the second metal structure are arranged along a first direction perpendicular to a normal direction, and in a second direction perpendicular to the normal direction, a length of the first metal structure is greater than a length of the second metal structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">AL:活性層</p>  
        <p type="p">CT:接觸電極</p>  
        <p type="p">DR1:第一方向</p>  
        <p type="p">DR2:第二方向</p>  
        <p type="p">E1:第一電極</p>  
        <p type="p">E2:第二電極</p>  
        <p type="p">EO1:第一電極輪廓</p>  
        <p type="p">EO2:第二電極輪廓</p>  
        <p type="p">L1,L2,L4,L5,L3,L6:長度</p>  
        <p type="p">M1:第一金屬結構</p>  
        <p type="p">M2:第二金屬結構</p>  
        <p type="p">MO1:第一金屬輪廓</p>  
        <p type="p">MO2:第二金屬輪廓</p>  
        <p type="p">P1,P2,P3,P4:部分</p>  
        <p type="p">PL:絕緣結構</p>  
        <p type="p">PS:平台結構</p>  
        <p type="p">RS:凹陷部</p>  
        <p type="p">S1:第一半導體層</p>  
        <p type="p">S2:第二半導體層</p>  
        <p type="p">SE:半導體元件</p>  
        <p type="p">SL2:側邊</p>  
        <p type="p">SS:半導體疊層</p>  
        <p type="p">V1,V2:穿孔</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="534" publication-number="202613011"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613011.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613011</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136907</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種改進的吸嘴裝置</chinese-title>  
        <english-title>AN IMPROVED NOZZLE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250325B">B65G47/91</main-classification>  
        <further-classification edition="200601120250325B">B25J15/06</further-classification>  
        <further-classification edition="200601120250325B">H01L21/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華東科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALTON ADVANCED ENGINEERING INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李玉莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YU-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林曜聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YAO-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪奇仕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, CI-SHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何浩千</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, HAO-CIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡士淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, SHIH-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖建銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, JIAN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種改進的吸嘴裝置，適用於電子元件製造過程中吸取和放置小尺寸電子元件。該裝置包括硬式吸嘴、柔性矽膠吸嘴及真空通道。硬式吸嘴具備耐磨塗層，提升使用壽命與耐用性；柔性矽膠吸嘴設計為可拆卸地套裝在硬式吸嘴上，並具備微細紋理表面和多孔結構，以提高摩擦力和吸附效果，確保吸附過程中的穩定性。真空通道內設置濾網，用於過濾空氣中的雜質，防止吸嘴堵塞並維持吸附力穩定。此外，硬式吸嘴與柔性矽膠吸嘴之間設有彈簧緩衝器，用以減輕吸嘴接觸電子元件時的壓力，保護元件不受損壞並提高操作精度。本發明能夠有效提升吸附小尺寸電子元件的穩定性、精準度和保護性能，適合於高精度、高效率的電子製造過程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to an improved nozzle device suitable for picking up and placing small-sized electronic components during the manufacturing process of electronic components. The device includes a hard nozzle, a flexible silicone nozzle, and a vacuum channel. The hard nozzle is coated with a wear-resistant layer, enhancing its durability and lifespan. The flexible silicone nozzle is designed to be detachably fitted onto the hard nozzle and features a fine-textured surface and a porous structure to increase friction and improve suction performance, ensuring stability during the suction process. A filter is installed inside the vacuum channel to filter out air impurities, preventing nozzle blockage and maintaining stable suction. Additionally, a spring buffer is positioned between the hard nozzle and the flexible silicone nozzle to reduce pressure when the nozzle contacts electronic components, protecting the components from damage and improving operational precision. This invention effectively enhances the stability, accuracy, and protective capabilities when handling small-sized electronic components, making it suitable for high-precision and high-efficiency electronic manufacturing processes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:硬式吸嘴</p>  
        <p type="p">11:耐磨塗層</p>  
        <p type="p">12:硬式吸嘴的外徑</p>  
        <p type="p">20:柔性矽膠吸嘴</p>  
        <p type="p">21:柔性矽膠吸嘴的內徑</p>  
        <p type="p">30:真空通道</p>  
        <p type="p">E:電子元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="535" publication-number="202614700"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614700.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614700</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136908</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H05K5/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>啓碁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WNC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張峯銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, FENG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃寶毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, BAU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括一裝置殼體以及一電子零件。裝置殼體包括複數個第一肋條以及複數個第二肋條。該等第一肋條排列於一第一平面。該等第二肋條排列於一第二平面，該第二平面平行於該第一平面，其中，該等第一肋條之間形成有至少一第一散熱口，該等第二肋條之間形成有至少一第二散熱口，在平行於該第一平面的一投影面上，至少部分之該等第二肋條與至少部分之該等第一肋條彼此錯位。該電子零件設於該裝置殼體之內，該等第一肋條以及該等第二肋條對該電子零件提供視覺遮蔽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device is provided. The electronic device includes a device housing and an electronic component. The device housing includes a plurality of first ribs and a plurality of second ribs. The first ribs are arranged on a first plane. The second ribs are arranged on a second plane, which is parallel to the first plane. At least one first heat dissipation opening is formed between the first ribs, and at least one second heat dissipation opening is formed between the second ribs. On a projection plane parallel to the first plane, at least a portion of the second ribs is misaligned with at least a portion of the first ribs. The electronic component is located inside the device housing, and the first and second ribs provide visual shielding for the electronic component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">E1:電子裝置</p>  
        <p type="p">1:第一殼體組件</p>  
        <p type="p">11:第一遮板</p>  
        <p type="p">111:第一肋條</p>  
        <p type="p">112:第一散熱口</p>  
        <p type="p">16:卡勾</p>  
        <p type="p">2:第二殼體組件</p>  
        <p type="p">21:第二遮板</p>  
        <p type="p">211:第二肋條</p>  
        <p type="p">212:第二散熱口</p>  
        <p type="p">3:第三殼體組件</p>  
        <p type="p">31:第三遮板</p>  
        <p type="p">311:第三肋條</p>  
        <p type="p">312:第三散熱口</p>  
        <p type="p">9:電子零件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="536" publication-number="202613179"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613179.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613179</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136911</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗ＣＤ１４７抗體及使用其之方法</chinese-title>  
        <english-title>ANTI-CD147 ANTIBODIES AND METHODS OF USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250303B">C07K16/30</main-classification>  
        <further-classification edition="200601120250303B">A61K39/395</further-classification>  
        <further-classification edition="200601120250303B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一三共股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIICHI SANKYO COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉塚直人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIZUKA, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水野翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUNO, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橫山幹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOYAMA, MIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大津陽子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSU, YOUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>追立真孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OITATE, MASATAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>櫻井健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKURAI, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井口拓馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGUCHI, TAKUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福地圭介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUCHI, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>七井佳代子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANAI, KAYOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平井俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAI, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神山惠美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIYAMA, EMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種抗CD147抗體、包含其之醫藥組成物、及治療癌症之方法，該方法包含將此種抗CD147抗體或醫藥組成物投予至受試者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are anti-CD147 antibodies, pharmaceutical compositions comprising the same, and methods of treating cancer comprising administering to a subject such anti-CD147 antibodies or pharmaceutical compositions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="537" publication-number="202614067"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614067.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614067</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136916</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快閃記憶體裝置及其抹除方法</chinese-title>  
        <english-title>FLASH MEMORY APPARATUS AND ERASING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241225B">G11C16/10</main-classification>  
        <further-classification edition="200601120241225B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李芳立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, FANG LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHENG HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種快閃記憶體裝置及其抹除方法。抹除方法包括下列步驟：根據操作命令，對記憶體區塊進行操作；在記憶體區塊中的任一者經過編程抹除循環之後，判斷記憶體區塊中的任一者的編程抹除循環所累計的循環次數是否達到多個中斷點的其中一者；當記憶體區塊中的任一者的循環次數達到中斷點的其中一者時，記錄記憶體區塊中的任一者在編程抹除循環的過程中通過抹除驗證所需的步進脈衝的當下脈衝計數值；以及根據當下脈衝計數值，調整用於抹除驗證的抹除驗證電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flash memory apparatus and an erasing method thereof of this invention are provided. The erasing method includes following steps: operating memory blocks according to the operation command; determining whether an accumulated cycle count of a program/erase cycling of any one of the memory blocks reaches one of a plurality of interruption points after any one of the memory blocks undergoes the program/erase cycling; recording a current pulse count value of step pulses required for any one of the memory blocks to pass an erase verification during the program/erase cycling when the cycle count of any one of the memory blocks reaches one of the plurality of interruption points; and adjusting an erase verification voltage for the erase verification based on the current pulse count value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S200、S210、S220、S230、S232、S234:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="538" publication-number="202614439"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614439.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614439</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136917</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">H01L23/535</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>力晶積成電子製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHIH-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱維正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張聖如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SHENG-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃彬傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PIN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種半導體結構，其包括基底、內連線層以及導電構件。基底包括第一表面以及與第一表面相對的第二表面。內連線層設置在基底的第一表面上。導電構件設置在基底中且包括導電通孔結構以及環繞導電通孔結構的介電結構。介電結構包括第一介電層以及第二介電層。第一介電層鄰接基底且具有第一熱膨脹係數。第二介電層設置在第一介電層和導電通孔結構之間且具有大於第一熱膨脹係數的第二熱膨脹係數。導電通孔結構包括熱膨脹係數大於第二熱膨脹係數的導電通孔，且基底具有小於第一熱膨脹係數的熱膨脹係數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure including a substrate, an interconnection layer, and a conductive component. The substrate includes a first surface and a second surface opposite to the first surface. The interconnection layer is disposed on the first surface of the substrate. The conductive component is disposed in the substrate and includes a conductive via structure and a dielectric structure surrounding the conductive via structure. The dielectric structure includes a first dielectric layer adjacent to the substrate and having a first coefficient of thermal expansion (CTE) and a second dielectric layer disposed on the first dielectric layer and having a second CTE. The conductive via structure includes a conductive via having a CTE greater than the second CTE, and the substrate has a CTE lower than the first CTE.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底</p>  
        <p type="p">100d1:第一深度</p>  
        <p type="p">100d2:第二深度</p>  
        <p type="p">110:終止層</p>  
        <p type="p">120:內連線層</p>  
        <p type="p">130:介電結構</p>  
        <p type="p">140:導電通孔結構</p>  
        <p type="p">142:介電襯層</p>  
        <p type="p">144:阻障層</p>  
        <p type="p">146:導電通孔</p>  
        <p type="p">DL1:第一介電層</p>  
        <p type="p">DL2:第二介電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="539" publication-number="202613432"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613432.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613432</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136925</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁動力傳輸裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241120B">F16H1/20</main-classification>  
        <further-classification edition="200601120241120B">H02K7/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐千又</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>花蓮縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐柏齡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>花蓮縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭詠鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>花蓮縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐千又</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐柏齡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李保祿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供是一種磁動力傳輸裝置，其包括有：一齒輪組，具有至少一出力輪與至少一施力輪，該出力輪的軸心設置有一傳動軸，該施力輪的軸心設置有一施力軸；該出力輪的外圍布設有出力輪齒，該施力輪的外圍布設有施力輪齒，且該出力輪的直徑大於該施力輪的直徑，使該施力輪以該施力輪齒推動該出力輪的該出力輪齒進行動力傳輸；該施力輪齒的表面設置有施力輪磁性單元，該出力輪齒的表面設置有出力輪磁性單元，該施力輪磁性單元與該出力輪磁性單元呈同極面對配置；一動力產生器，以連接並帶動該施力軸進行旋轉；以及一負載，連接至該傳動軸，由該傳動軸帶動該負載進行工作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:齒輪組</p>  
        <p type="p">110:出力輪</p>  
        <p type="p">111:傳動軸</p>  
        <p type="p">112:出力輪齒</p>  
        <p type="p">113:出力輪磁性單元</p>  
        <p type="p">115:L型壓板</p>  
        <p type="p">120:施力輪</p>  
        <p type="p">121:施力軸</p>  
        <p type="p">122:施力輪齒</p>  
        <p type="p">123:施力輪磁性單元</p>  
        <p type="p">125:L型壓板</p>  
        <p type="p">200:動力產生器</p>  
        <p type="p">300:負載</p>  
        <p type="p">400:煞車部</p>  
        <p type="p">500:儲能單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="540" publication-number="202613604"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613604.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613604</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136926</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學膜片</chinese-title>  
        <english-title>OPTICAL FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241210B">G02B5/04</main-classification>  
        <further-classification edition="200601120241210B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李岳衡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YUEH-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳嘉鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾世福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, SHIH-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學膜片包括第一基板與多個稜鏡結構。多個稜鏡結構沿著第一方向排列在第一基板的第一基板表面上並且沿著第二方向延伸。第一基板沿著第一方向的相對兩側分別設有第一側緣與第二側緣。各個稜鏡結構具有相對於第一基板表面的結構高度，且各個稜鏡結構的結構高度由第一側緣往第二側緣先遞增後遞減。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical film including a first substrate and a plurality of prism structures is provided. The plurality of prism structures are arranged on a first substrate surface of the first substrate along a first direction and extend along a second direction. Two opposite sides of the first substrate along the first direction are respectively provided with a first side edge and a second side edge. Each of the prism structures has a structural height relative to the first substrate surface, and the structural height of each prism structure increases first and then decreases from the first side edge to the second side edge.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光源模組</p>  
        <p type="p">50:光源</p>  
        <p type="p">60:擴散片</p>  
        <p type="p">100:光學膜片</p>  
        <p type="p">101、151:基板</p>  
        <p type="p">101e1、101e2:側緣</p>  
        <p type="p">101s:基板表面</p>  
        <p type="p">120、121~125、153:稜鏡結構</p>  
        <p type="p">150:稜鏡片</p>  
        <p type="p">160:光學增亮膜</p>  
        <p type="p">A1、A2:夾角</p>  
        <p type="p">H:結構高度</p>  
        <p type="p">L1~L5:光線</p>  
        <p type="p">ss1、ss2:結構面</p>  
        <p type="p">SX:結構中軸</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="541" publication-number="202612885"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612885.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612885</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136935</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚酯布的脫色方法</chinese-title>  
        <english-title>DECOLORIZATION METHOD OF POLYESTER CLOTH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">B29B17/02</main-classification>  
        <further-classification edition="200601120250901B">C08J11/08</further-classification>  
        <further-classification edition="200601120250901B">D06P3/52</further-classification>  
        <further-classification edition="200601120250901B">D06P5/13</further-classification>  
        <further-classification edition="200601320250901B">B29K67/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人紡織產業綜合研究所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN TEXTILE RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林岩錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YEN-HSI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊秉欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, PING-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃振麒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHEN-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種聚酯布的脫色方法包括：準備包括燒瓶、萃取管、虹吸管、蒸氣管及冷凝管的索氏萃取器；將聚酯布及溶劑分別置入萃取管及燒瓶中，其中聚酯布經染料染色，且聚酯布直接接觸萃取管的內側壁；加熱燒瓶中的溶劑，使溶劑相變為氣態並沿著蒸氣管流動以抵達冷凝管，並於接觸冷凝管後相變為液態並回流至萃取管中以接觸聚酯布，直到溶劑在萃取管中的液面高於虹吸管的最高處。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A decolorization method of polyester cloth includes the following steps. A Soxhlet extractor including a flask, an extraction tube, a siphon tube, a steam tube, and a condenser tube is prepared. The polyester cloth and a solvent are respectively placed into the extraction tube and the flask, in which the polyester cloth is dyed, and the polyester cloth directly contacts an inner sidewall of the extraction tube. The solvent in the flask is heated, such that the solvent turns into a gaseous state and flows along the steam tube to contact the condenser tube, and then the solvent turns into a liquid state and refluxes into the extraction tube to contact the polyester cloth until a solvent level in the extraction tube is above a highest point of the siphon tube.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S30:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="542" publication-number="202612808"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612808.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612808</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136951</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>軋機間的鋼帶量測方法與系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR STEEL STRIP MEASUREMENT BETWEEN MILLS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241108B">B21B38/04</main-classification>  
        <further-classification edition="200601120241108B">G05B19/401</further-classification>  
        <further-classification edition="201701120241108B">G06T7/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋誼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOR, CHIOU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳翊安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YI-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石益三</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, YI-SAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周子琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, TZU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴德揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI, DE-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種軋機間的鋼帶量測方法與系統。此系統包含：校正板、攝影機以及電腦裝置。此方法包含：進行一攝影機位置調整階段，以利用校正板影像的第一校正圖案和第二校正圖案來計算出攝影機之一攝影機位置調整參數；進行一攝影機影像校正階段，以根據校正板影像之第一校正圖案、第二校正圖案以及張力調整裝置之複數個舉升角度來計算出一攝影機座標系對世界座標系轉換關係式；以及進行一線上監控階段，以根據鋼帶影像、張力調整裝置於線上監控階段之舉升角度以及攝影機座標系對世界座標系轉換關係式來計算鋼帶之一寬度與一中心偏差量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and system for steel strip measurement between mills are provided. The system includes: a calibration board, a camera and a computer device. The method includes: performing a camera position tuning stage to calculate a camera position tuning parameter by using first calibration patterns and second calibration patterns of an image of the calibration board; performing a camera image calibration stage to calculate a transformation relationship between camera coordinates and world coordinates in accordance with plural lift angles of a tension adjustment device and the first calibration patterns and the second calibration patterns of the image of the calibration board; and performing an on-line monitoring stage to calculate a width and a center-deviation distance of a steel strip in accordance with an image of the steel strip, a lift angle of the tension adjustment device at the on-line monitoring stage and the transformation relationship between camera coordinates and world coordinates.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:軋機間的鋼帶量測方法</p>  
        <p type="p">510~540:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="543" publication-number="202614628"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614628.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614628</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136952</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>麥克風模組、揚聲器模組及通訊裝置</chinese-title>  
        <english-title>MICROPHONE MODULE, SPEAKER MODULE AND COMMUNICATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H04R1/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緯創資通股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳晁永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHAO YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周永昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, YUNG HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, HSIN HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種麥克風模組，包括一承載結構及一麥克風組件。承載結構包括一承載部及兩支撐部，兩支撐部連接於承載部。麥克風組件包括一麥克風本體部及兩掛設部，麥克風本體部懸設於承載部，兩掛設部分別連接於麥克風本體部的相對兩側且分別掛設於兩支撐部。此外，一種揚聲器模組及一種通訊裝置亦被提及。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A microphone module includes a carrying structure and a microphone assembly. The carrying structure includes a carrying part and two supporting parts, and the two supporting parts are connected to the carrying part. The microphone assembly includes a microphone body part and two hanging parts, the microphone body part is suspended on the carrying part, and the two hanging parts are respectively connected to two opposite sides of the microphone body part and hung on the two supporting parts respectively. In addition, a speaker module and a communication device are also mentioned.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">130:麥克風模組</p>  
        <p type="p">132:承載結構</p>  
        <p type="p">1321:承載部</p>  
        <p type="p">1322:支撐部</p>  
        <p type="p">134:麥克風組件</p>  
        <p type="p">1341:麥克風本體部</p>  
        <p type="p">1341a:殼體</p>  
        <p type="p">1341b:麥克風</p>  
        <p type="p">1342:掛設部</p>  
        <p type="p">1342a:止擋凸緣</p>  
        <p type="p">A:水平軸線</p>  
        <p type="p">C2:幾何中心</p>  
        <p type="p">D2:寬度方向</p>  
        <p type="p">D3:上下方向</p>  
        <p type="p">G:間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="544" publication-number="202612858"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612858.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612858</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136953</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工具扣合結構</chinese-title>  
        <english-title>TOOL FASTENING STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241030B">B25H3/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳王振</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WANG CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳王振</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WANG CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種工具扣合結構，包括：本體，具有前壁、第一側壁及第二側壁，前壁、第一側壁及第二側壁之間形成導槽；樞擺件，具有相反之扳動端及擺動端，扳動端及擺動端之間具有樞接單元，樞接單元將樞擺件樞設於前壁，擺動端之端面呈弧狀，擺動端之部分伸入導槽，當使用者扳動扳動端時，擺動端則離開導槽，樞擺件另具有引導面，引導面銜接擺動端之端面，引導面朝向導槽傾斜；復位手段，供以驅動樞擺件復位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tool fastening structure includes a body having a front wall, a first side wall and a second side wall, a guide groove is formed between the front wall, the first side wall and the second side wall, a pivot member having a pull end and a swing end opposite to the pull end, between the pull end and the swing end is provided a pivot unit making the pivot member pivoted to the front wall, an end surface of the swing end is arc-shaped, part of the swing end is inserted into the guide groove, when the user pulls the pull end, the swing end is separated from the guide groove, the pivot member has a guide surface connecting to the end surface of the swing end and inclining toward the guide groove, and a reset means for driving the pivot member to reset.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:本體</p>  
        <p type="p">10A:第一側</p>  
        <p type="p">10B:第二側</p>  
        <p type="p">11:前壁</p>  
        <p type="p">12:第一側壁</p>  
        <p type="p">121:第一擋部</p>  
        <p type="p">13:第二側壁</p>  
        <p type="p">131:第二擋部</p>  
        <p type="p">132:上緣擋部</p>  
        <p type="p">132A:止擋端面</p>  
        <p type="p">14:導槽</p>  
        <p type="p">141:主槽部</p>  
        <p type="p">142:第一側溝</p>  
        <p type="p">143:第二側溝</p>  
        <p type="p">15:頂溝</p>  
        <p type="p">16:後壁</p>  
        <p type="p">17:上連接壁</p>  
        <p type="p">171:第一延伸部</p>  
        <p type="p">172:第一共通穿孔</p>  
        <p type="p">18:下連接壁</p>  
        <p type="p">181:第二延伸部</p>  
        <p type="p">182:凸塊</p>  
        <p type="p">183:第二共通穿孔</p>  
        <p type="p">184:組設空間</p>  
        <p type="p">19:穿設孔</p>  
        <p type="p">20:樞擺件</p>  
        <p type="p">20A:扳動端</p>  
        <p type="p">20B:擺動端</p>  
        <p type="p">20C:樞接單元</p>  
        <p type="p">21:頂面</p>  
        <p type="p">22:底面</p>  
        <p type="p">221:弧槽</p>  
        <p type="p">223A:限止栓</p>  
        <p type="p">25:引導面</p>  
        <p type="p">251:入端</p>  
        <p type="p">252:出端</p>  
        <p type="p">30:彈性件</p>  
        <p type="p">Y:橫向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="545" publication-number="202612946"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612946.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612946</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136954</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於權重調整的車輛定位方法及系統</chinese-title>  
        <english-title>VEHICLE POSITIONING METHOD BASED ON WEIGHT ADJUSTMENT AND VEHICLE POSITIONING SYSTEM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241105B">B60W30/12</main-classification>  
        <further-classification edition="200601120241105B">B60W30/14</further-classification>  
        <further-classification edition="202201220241105B">B60R1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人車輛研究測試中心</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUTOMOTIVE RESEARCH &amp; TESTING CENTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林農閎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, NONG-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林祐賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YOU-SIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於權重調整的車輛定位方法，其係使用設置於一車輛的一定位系統執行以下步驟，定位系統產生一影像品質值及一車道線信心度，定位系統根據影像品質值及車道線信心度產生一影像信心度，定位系統根據所接收到的複數個定位資料產生一定位信心度，定位系統根據影像信心度及定位信心度，調整一行車影像權重值、一定位資料權重值及一慣性資料權重值，以及定位系統根據行車影像權重值、定位資料權重值及慣性資料權重值，調整定位系統所獲得的一原始定位座標值，產生一最終定位座標值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A vehicle positioning method based on weight adjustment, which performed by a vehicle positioning system installed in a vehicle, comprises following steps of: the positioning system to generate an image quality value and a lane line confidence value. The positioning system to generate an image confidence value based on the image quality value and the lane line confidence value. The positioning system to generate a positioning confidence value based on a plurality of positioning data. The positioning system to adjust a driving image weight value, a positioning data weight value and an inertial data weight value based on the image confidence value and the positioning confidence value. The positioning system to adjust an original positioning coordinate value obtained by the positioning system based on the driving image weight value, the positioning data weight value and the inertial data weight value to generate a final positioning coordinate value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:車輛定位系統</p>  
        <p type="p">10:影像品質模組</p>  
        <p type="p">11:車道線信心度模組</p>  
        <p type="p">12:影像信心度模組</p>  
        <p type="p">13:定位信心度模組</p>  
        <p type="p">14:權重調整模組</p>  
        <p type="p">15:定位調整模組</p>  
        <p type="p">16:儲存模組</p>  
        <p type="p">2:車輛</p>  
        <p type="p">3:全球導航衛星系統</p>  
        <p type="p">4:雲端</p>  
        <p type="p">40:建圖模組</p>  
        <p type="p">5:慣性量測模組</p>  
        <p type="p">6:影像擷取模組</p>  
        <p type="p">7:定位感測模組</p>  
        <p type="p">8:無線接收模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="546" publication-number="202614432"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614432.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614432</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136955</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件及其製作方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241209B">H01L23/528</main-classification>  
        <further-classification edition="200601120241209B">H01L23/488</further-classification>  
        <further-classification edition="200601120241209B">H01L21/60</further-classification>  
        <further-classification edition="200601120241209B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯華電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江俊松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHUNG-SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾奕銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, I-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳禹鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施易安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, YI-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體元件，包含一第一晶圓以及一第二晶圓。第一晶圓包含一第一基底以及一第一電感層。第一電感層包含一第一金屬線以及一第一互連結構，其中第一金屬線設置於第一基底上，且第一互連結構與第一金屬線電性連接。第二晶圓包含一第二基底以及一第二電感層。第二電感層包含一第二金屬線以及一第二互連結構，其中第二金屬線設置於第二基底上，第二互連結構與第二金屬線電性連接，且第二互連結構與第一互連結構接合，以使第一電感層及第二電感層共同形成一電感元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a first wafer and a second wafer. The first wafer includes a first substrate and a first inductance layer. The first inductance layer includes a first metal line and a first interconnect structure, wherein the first metal line is disposed on the first substrate, and the first interconnect structure is electrically connected with the first metal line. The second wafer includes a second substrate and a second inductance layer. The second inductance layer includes a second metal line and a second interconnect structure, wherein the second metal line is disposed on the second substrate, and the second interconnect structure is electrically connected with the second metal line. The second interconnect structure is bonded with the first interconnect structure, so that the first inductance layer and the second inductance layer together form an inductance element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體元件</p>  
        <p type="p">10:第一晶圓</p>  
        <p type="p">20:第二晶圓</p>  
        <p type="p">30:電感元件</p>  
        <p type="p">110:第一基底</p>  
        <p type="p">120:第一電感層</p>  
        <p type="p">121:第一鍵合表面</p>  
        <p type="p">130:第一金屬線</p>  
        <p type="p">140:第一互連結構</p>  
        <p type="p">150:第一介電層</p>  
        <p type="p">210:第二基底</p>  
        <p type="p">220:第二電感層</p>  
        <p type="p">221:第二鍵合表面</p>  
        <p type="p">230:第二金屬線</p>  
        <p type="p">240:第二互連結構</p>  
        <p type="p">250:第二介電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="547" publication-number="202612614"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612614.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612614</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136956</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滑軌裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120241128B">A47B88/40</main-classification>  
        <further-classification edition="200601120241128B">H05K5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富世達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOSITEK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚旭鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, HSU-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張謨宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, MO-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種滑軌裝置，包含一第一滑軌單元及一第二滑軌單元。該第一滑軌單元包括一第一滑軌，該第一滑軌具有一擋止塊。第二滑軌單元包括一可活動地設置於該第一滑軌的第二滑軌及一設置於該第二滑軌的補強件。該補強件具有一沿著該第二滑軌延伸本體部及一自該本體部凸出的擋止部。該擋止部可卡抵於該擋止塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:滑軌裝置</p>  
        <p type="p">1:第一滑軌單元</p>  
        <p type="p">11:第一滑軌</p>  
        <p type="p">111:第一底板</p>  
        <p type="p">111a:第一端</p>  
        <p type="p">111b:第二端</p>  
        <p type="p">111c:滑動面</p>  
        <p type="p">112:第一側牆</p>  
        <p type="p">12:擋止塊</p>  
        <p type="p">13:滾珠條</p>  
        <p type="p">14:擋止支撐件</p>  
        <p type="p">2:第二滑軌單元</p>  
        <p type="p">21:第二滑軌</p>  
        <p type="p">211:第一面</p>  
        <p type="p">212:第二面</p>  
        <p type="p">22:補強件</p>  
        <p type="p">221:本體部</p>  
        <p type="p">222:擋止部</p>  
        <p type="p">23:推抵支撐件</p>  
        <p type="p">3:第三滑軌</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="548" publication-number="202613334"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613334.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613334</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136960</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鉻鉬鋼板及其製造方法</chinese-title>  
        <english-title>CHROME MOLYBDENUM STEEL PLATE AND METHOD OF MAKING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">C22C38/22</main-classification>  
        <further-classification edition="200601120241101B">C21D8/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宗荃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TSUNG-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是有關於一種鉻鉬鋼板及其製造方法。此製造方法包含以特定溫度對軋延鋼板進行回火步驟，以使得麻田散鐵形成回火麻田散鐵，並提升所製得之鉻鉬鋼板的延性及韌性，但降低其強度及微硬度差，且所製得之鉻鉬鋼板具有較佳的衝壓加工性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is related to a chrome molybdenum steel plate and a method of making the same. The method includes performing a tempering step at a specific temperature on a rolled steel plate, so that martensite becomes tempered martensite, thereby enhancing ductility and toughness as well as decreasing the strength and microhardness difference of the obtained chrome molybdenum steel plate, and the obtained chrome molybdenum steel plate has a better punching processability.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">B:變韌鐵</p>  
        <p type="p">TM:回火麻田散鐵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="549" publication-number="202613358"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613358.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613358</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136961</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具整流結構之大尺寸水平爐管</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250122B">C23C16/54</main-classification>  
        <further-classification edition="200601120250122B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人國家實驗研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL APPLIED RESEARCH LABORATORIES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳峰志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, FONG-ZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁洧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳維鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宏彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丘坤安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, KUN-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王尉霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳華琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUA-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐奉璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具整流結構之大尺寸水平爐管，係用於沉積大面積二維材料，主要沉積過程位於一水平爐管當中，由前端導入載氣及氣態前驅物，該水平爐管中有一整流治具。該整流治具有兩種整流模式，其一是內縮的水平內管，其噴出口端接續多孔狀噴口。其二是水平內管於噴出口端接續一錐狀噴頭，該錐狀噴頭於漸擴段接續多孔狀噴口後將氣流噴出。藉此，可大幅減少氣流流經過的內管體積，減少迴流產生，並具有加速氣流流速及提升氣流均勻度的效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:水平爐管</p>  
        <p type="p">11:反應腔體</p>  
        <p type="p">12:載台</p>  
        <p type="p">13:軌道</p>  
        <p type="p">14:試片</p>  
        <p type="p">2:整流治具</p>  
        <p type="p">21:錐狀流道</p>  
        <p type="p">22:水平內管</p>  
        <p type="p">23:多孔狀噴口</p>  
        <p type="p">24:錐狀噴頭</p>  
        <p type="p">25:外管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="550" publication-number="202614583"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614583.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614583</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136973</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通訊系統與其天線選擇方法</chinese-title>  
        <english-title>COMMUNICATION SYSTEM AND ANTENNA SELECTION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H04B7/06</main-classification>  
        <further-classification edition="200601120250203B">H04B7/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡緻衡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIH-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張維軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱奕棠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, YI-TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">通訊系統包含收發器電路以及控制器電路。收發器電路依序傳輸第一與第二觸發訊框給電子裝置，以使電子裝置響應於第一觸發訊框以第一空間串流數發出第一封包，並響應於第二觸發訊框以第二空間串流數發出第二封包。收發器電路經由第一組天線接收第一封包，並經由第二組天線接收第二封包。控制器電路根據第一封包決定對應於第一組天線的第一通道狀態資訊，根據第二封包決定對應於第二組天線的第二通道狀態資訊，並根據第一與第二通道狀態資訊自第一與第二組天線選出一對應組天線，以經由對應組天線自該電子裝置接收資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A communication system includes a transceiver circuit and a controller circuit. The transceiver circuit sequentially transmits first and second trigger frames to an electronic device, such that the electronic device utilizes a first number of spatial streams to transmit a first packet responsive to the first trigger frame, and utilizes a second number of spatial streams to transmit a second packet responsive to the second trigger frame. The transceiver circuit receives the first packet via a first set of antennas and receives the second packet via a second set of antennas. The controller circuit determines first channel state information corresponding to the first set of antennas according to the first packet, determines second channel state information corresponding to the second set of antennas according to the second packet, and selects a corresponding set of antennas from the first and second sets of antennas according to the first and second channel state information, in order to receive data from the electronic device via the corresponding set of antennas.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:通訊系統</p>  
        <p type="p">101:電子裝置</p>  
        <p type="p">110:收發器電路</p>  
        <p type="p">120:控制器電路</p>  
        <p type="p">RX1,RX2,RX3:接收器天線</p>  
        <p type="p">SP1,SP2,SP3:封包</p>  
        <p type="p">TR1,TR2,TR3:觸發訊框</p>  
        <p type="p">TX1,TX2,TX3:發射器天線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="551" publication-number="202613409"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613409.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613409</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136980</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓力錶可收納之落地式打氣筒</chinese-title>  
        <english-title>FLOOR PUMP WITH STOWABLE PRESSURE GAUGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241118B">F04B33/00</main-classification>  
        <further-classification edition="200601120241118B">F04B39/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雙餘實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BETO ENGINEERING &amp; MARKETING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王羅平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LOPIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種壓力錶可收納之落地式之打氣筒，包含有：一底座；一筒部，設於該底座並向上凸出；一內凹的容室，設於該筒部；一缸體，其底端裝設於該底座的筒部；一活塞桿及一活塞，裝設於該缸體的壓縮空間中；一壓力錶，具有相連接之一頭部與一歧管；一軸心歧管，裝設於該底座及缸體之間，並穿伸該容室；該壓力錶之該歧管係樞接於該軸心歧管，使該壓力錶可於一收納位置及一使用位置之間變換。該壓力錶位於該收納位置時，係與該底座重合；該壓力錶位於該使用位置時，則未與該底座重合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A floor pump with stowable pressure gauge, comprising: a base; a barrel portion provided on the base and projecting upwardly; a concave chamber provided in the barrel portion; a cylinder, a bottom end of the cylinder is disposed in the barrel portion of the base; a piston rod and a piston, which are disposed in a compression space of the cylinder; a pressure gauge having a head and a manifold coupled thereto; a shaft manifold disposed between the base and the cylinder and extends through the chamber; the manifold of the pressure gauge is pivoted on the shaft manifold so that the pressure gauge can be switched between a stowed position and an in-use position. When the pressure gauge is in the stowed position, it overlaps with the base, when the pressure gauge is in the in-use position, it does not overlap with the base.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:底座</p>  
        <p type="p">22:筒部</p>  
        <p type="p">23:裝設孔</p>  
        <p type="p">24:第一踏板</p>  
        <p type="p">25:第二踏板</p>  
        <p type="p">26:容室</p>  
        <p type="p">271:收納定位點</p>  
        <p type="p">28:心孔</p>  
        <p type="p">30:缸體</p>  
        <p type="p">32:壓縮空間</p>  
        <p type="p">33:迫緊環套</p>  
        <p type="p">34:氣密環</p>  
        <p type="p">40:活塞桿</p>  
        <p type="p">42:活塞</p>  
        <p type="p">43:環圈</p>  
        <p type="p">50:壓力錶</p>  
        <p type="p">51:頭部</p>  
        <p type="p">52:歧管</p>  
        <p type="p">521:樞接端</p>  
        <p type="p">53:定位部</p>  
        <p type="p">54:樞孔</p>  
        <p type="p">55:第一流道</p>  
        <p type="p">56:轉軸</p>  
        <p type="p">57:指針</p>  
        <p type="p">58:刻度盤</p>  
        <p type="p">59:氣壓構件</p>  
        <p type="p">60:軸心歧管</p>  
        <p type="p">601:凸環</p>  
        <p type="p">602:第一止漏環</p>  
        <p type="p">603:第二止漏環</p>  
        <p type="p">604:第三止漏環</p>  
        <p type="p">62:第二流道</p>  
        <p type="p">621:縱向段</p>  
        <p type="p">622:徑向段</p>  
        <p type="p">623:環槽</p>  
        <p type="p">65:端件</p>  
        <p type="p">66:連通孔</p>  
        <p type="p">68:第四止漏環</p>  
        <p type="p">70:止逆構件</p>  
        <p type="p">76:止逆件</p>  
        <p type="p">82:軟管</p>  
        <p type="p">84:出氣流道</p>  
        <p type="p">85:出氣接頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="552" publication-number="202613328"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613328.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613328</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136981</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋁板及其製造方法</chinese-title>  
        <english-title>ALUMINUM PLATE AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241205B">C22C21/06</main-classification>  
        <further-classification edition="200601120241205B">C22F1/047</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍昭憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHAO-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李淑芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHU-FEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高逸帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, YI-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃獻慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSIEN-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鋁板的製造方法包含以下步驟。對鋁胚進行加熱步驟、軋延步驟、盤捲步驟以及冷卻步驟，以獲得鋁板。軋延步驟中的粗軋步驟以及熱連軋步驟可將鋁胚快速軋至完軋厚度，可以節省生產時間。此外，此製造方法可產出長度不受限之鋁板，有利於後續裁切鋁板至特定尺寸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing an aluminum plate includes the following steps. The aluminum billet is subjected to a heating step, a rolling step, a coiling step, and a cooling step to obtain the aluminum plate. A rough rolling step and a hot continuous step in the rolling step can quickly roll the aluminum billet to a finishing thickness, which can save production time. In addition, the manufacturing method can produce the aluminum plate with unlimited length, which facilitates subsequent cutting the aluminum plate to specific sizes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">110,120,130,132,134,140,150,160:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="553" publication-number="202614097"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614097.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614097</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136983</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電阻器及其製作方法</chinese-title>  
        <english-title>RESISTOR AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H01C1/06</main-classification>  
        <further-classification edition="200601120241105B">H01C17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國巨股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAGEO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施伯勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, PO-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯旻萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, MIN-SYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電阻器包含基板、第一電極、電阻層、第一絕緣層、第一抗磁金屬層、第二絕緣層、第二電極、第二抗磁金屬層、第三絕緣層、第三電極及外接電極。第一電極設置於基板的第一表面上，電阻層設置於第一電極上並連接第一電極，第一絕緣層覆蓋電阻層及部分第一電極，第二絕緣層覆蓋第一抗磁金屬層及第一絕緣層，第二電極設置於第二絕緣層上並分別電性連接第一電極。第二抗磁金屬層設置於基板的相對於第一表面的第二表面上，第三絕緣層覆蓋第二抗磁金屬層，第三電極設置於第三絕緣層上，外接電極電性連接第一電極、第二電極及第三電極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resistor includes a substrate, first electrodes, a resistance layer, a first insulating layer, a first diamagnetism metal layer, a second insulating layer, second electrodes, a second diamagnetism metal layer, a third insulating layer, third electrode and external electrodes. The first electrodes are disposed on a first surface of the substrate. The resistance layer is disposed on the first electrodes and connects to the first electrodes. The first insulating layer covers the resistance layer and part of the first electrodes. The second insulating layer covers the first diamagnetism metal layer and the first insulating layer. The second electrodes are disposed on the second insulating layer and are electrically connected to the first electrodes, respectively. The second diamagnetism metal layer is disposed on a second surface of the substrate opposite to the first surface. The third insulating layer covers the second diamagnetism metal layer. The third electrodes are disposed on the third insulating layer. The external electrodes are electrically connected to the first electrodes, the second electrodes and the third electrodes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電阻器</p>  
        <p type="p">100:基板</p>  
        <p type="p">101、101’:第一電極</p>  
        <p type="p">102:電阻層</p>  
        <p type="p">103:第一絕緣層</p>  
        <p type="p">104:第一抗磁金屬層</p>  
        <p type="p">105:第二絕緣層</p>  
        <p type="p">106、106’:第二電極</p>  
        <p type="p">107:第二抗磁金屬層</p>  
        <p type="p">108:第三絕緣層</p>  
        <p type="p">109、109’:第三電極</p>  
        <p type="p">110、110’:外接電極</p>  
        <p type="p">110A、110A’:第一外電極</p>  
        <p type="p">110B、110B’:第二外電極</p>  
        <p type="p">111:鈍化層</p>  
        <p type="p">112、112’:連接電極</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">S1:第一表面</p>  
        <p type="p">S2:第二表面</p>  
        <p type="p">S3:第三表面</p>  
        <p type="p">S4:第四表面</p>  
        <p type="p">T:溝槽圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="554" publication-number="202612864"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612864.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612864</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113136986</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於形狀記憶離子凝膠的微型雙穩態致動器及其夾持器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250704B">B25J9/12</main-classification>  
        <further-classification edition="200601120250704B">B25J1/12</further-classification>  
        <further-classification edition="200601120250704B">B25J15/08</further-classification>  
        <further-classification edition="202301120250704B">H10N30/20</further-classification>  
        <further-classification edition="202301120250704B">H10N30/85</further-classification>  
        <further-classification edition="202301120250704B">H10K85/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊燿州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YAO-JOE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳姸君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅立渝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, LI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林沛亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PEI-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓加育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, CHIA-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐奉璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基於形狀記憶離子凝膠的微型雙穩態致動器，係利用離子凝膠的形狀記憶效應所開發，具有檢測其位置（狀態）的應變感測能力。所提微型雙穩態致動器由奈米碳管分散的離子凝膠手指、具有熱響應特性的液晶彈性體（LCE）懸臂、及微機械的加熱器層組成。該LCE懸臂作為該離子凝膠手指變形的致動材料，而該加熱器層則用於通過提高LCE溫度來誘導該LCE懸臂變形。該離子凝膠手指利用單向形狀記憶效應特性使其能保持在任一穩定位置而不消耗功率，從而實現能產生大變形的雙穩態行為。該離子凝膠手指還用作感測材料，以無感測器方式檢測其狀態。本發明更展示一種由兩個所提微型雙穩態致動器組裝而成的微型雙穩態夾持器，由於具有雙穩態特性，使該微型雙穩態夾持器可以在不消耗任何功率的情況下抓取並穩定地夾持物體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:微型雙穩態致動器</p>  
        <p type="p">1:離子凝膠手指</p>  
        <p type="p">11:第一電導線</p>  
        <p type="p">2:LCE懸臂</p>  
        <p type="p">3:加熱器層</p>  
        <p type="p">31:第二電導線</p>  
        <p type="p">4:PMMA基座</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="555" publication-number="202612824"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612824.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612824</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137012</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>儲能模組及其超音波銲接方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241206B">B23K20/10</main-classification>  
        <further-classification edition="200601120241206B">B23K20/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裕隆汽車製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李華斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HUA-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪飛義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, FEI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周信穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, HSIN-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種儲能模組及其超音波銲接方法，該儲能模組的超音波銲接方法，包含以下步驟：超音波銲接步驟：將一感測線的一導體端以超音波銲接在一金屬板。該金屬板為一體成型件且由鋁或鋁合金構成。該金屬板包括一板體，及至少一形成在該板體且供該導體端穿入的連接端子。該板體具有一第一厚度，該連接端子具有一第二厚度，該第一厚度介於2mm至4mm，該第二厚度不大於1mm。在超音波銲接步驟後，該連接端子、該感測線的導體端及該板體以固態接合並形成一銲接區。本發明通過該連接端子與該板體是一體成型的設計，除了能降低製造成本，還提高銲接可靠度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:儲能模組</p>  
        <p type="p">1:金屬板</p>  
        <p type="p">11:板體</p>  
        <p type="p">12:連接端子</p>  
        <p type="p">2:感測線</p>  
        <p type="p">3:電芯單元</p>  
        <p type="p">31:電芯</p>  
        <p type="p">4:訊號處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="556" publication-number="202612922"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612922.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612922</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137014</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>胎壓偵測器的節能定位方式</chinese-title>  
        <english-title>AN ENERGY-SAVING POSITIONING METHOD FOR A TIRE PRESSURE DETECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B60C23/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>系統電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYSGRATION LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史　都華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEWART, WILLIAM DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游智為</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊益松</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種胎壓偵測器的節能定位方式，其包括有以下步驟：車用主機判斷引擎開關是否由開轉變為關；每一個胎壓偵測器分別記錄X軸、Y軸、Z軸中至少兩者的首筆資料；每一個胎壓偵測器分別定期記錄X軸、Y軸、Z軸中至少兩者的資料；車用主機將引擎開關開啟的訊號發送至各個胎壓偵測器；步驟五，每個胎壓偵測器檢查所記錄的數值與最後一筆紀錄的數值是否有變化；車用主機依據從胎壓偵測器接收到的位置變化訊息進行判斷，若有變化則接續步驟A，若無變化則接續步驟B；步驟A：車用主機不進行自動定位，車用主機沿用先前個胎壓偵測器之定位數據；步驟B：車用主機啟動自動定位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An energy-saving positioning method for a tire pressure detector includes the following steps: a vehicle host determines whether an engine switch is switched from ON to OFF; and each tire pressure detector records the first data of at least two of the X-axis, the Y-axis and the Z-axis respectively; and each tire pressure detector periodically records at least two of the X-axis, the Y-axis, and the Z-axis; the vehicle host sends the signal turned on by the engine switch to each tire pressure detector; step 5, each tire pressure detector checks whether the recorded value changes with the last recorded value; the vehicle host judges according to the position change message received from the tire pressure detector; if there is a change, step A is followed; if there is no change, step B is followed; step A: the vehicle host does not perform automatic positioning, and the vehicle host uses the positioning data of the previous tire pressure detector; and step B: the vehicle host starts automatic positioning.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:車輛</p>  
        <p type="p">2:車用主機</p>  
        <p type="p">21:藍牙無線傳輸系統</p>  
        <p type="p">22:自動定位系統</p>  
        <p type="p">3:胎壓偵測器</p>  
        <p type="p">31:位置判斷模組</p>  
        <p type="p">32:紀錄模組</p>  
        <p type="p">33:無線傳輸模</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="557" publication-number="202614098"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614098.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614098</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137016</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶片電阻器及其製造方法</chinese-title>  
        <english-title>CHIP RESISTOR AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H01C1/142</main-classification>  
        <further-classification edition="200601120241105B">H01C17/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國巨股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAGEO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭勝利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, SHEN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊竣凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHUN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李煥文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HWAN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種晶片電阻器及其製造方法，此晶片電阻器包含基材、設置於基材上的電阻層、兩個電極、阻隔層以及保護層。電阻層具有相對的第一表面與第二表面，而基材位於電阻層的第一表面。兩個電極間隔設置於電阻層的第二表面的相對兩端。阻隔層設置電極之間，並且覆蓋電阻層的第二表面。保護層設置於阻隔層上，並且覆蓋每一個電極的頂表面以及阻隔層，而阻隔層位於保護層以及電阻層的第二表面之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chip resistor and a method for manufacturing the same are provided. The chip resistor includes a substrate, a resistance layer on the substrate, two electrodes, a barrier layer and a protective layer. The resistance layer has a first surface and a second surface which are opposite to each other, while the substrate is located at the first surface of the resistance layer. Two electrodes are disposed on two opposite ends of the second surface of the resistance layer and spaced from each other. The barrier layer is disposed between the electrodes and covers the second surface of the resistance layer. The protective layer is disposed on the barrier layer and covers the barrier layer and the top surface of each electrode. The barrier layer is located between the protective layer and the second surface of the resistance layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶片電阻器</p>  
        <p type="p">110:基材</p>  
        <p type="p">120:電阻層</p>  
        <p type="p">120f:第一表面</p>  
        <p type="p">120s:第二表面</p>  
        <p type="p">140a,140b:第一電極</p>  
        <p type="p">142t,150t,180t:頂表面</p>  
        <p type="p">142s:側表面</p>  
        <p type="p">150a,150b:第二電極</p>  
        <p type="p">160:阻隔層</p>  
        <p type="p">170a,170b:焊接層</p>  
        <p type="p">180:保護層</p>  
        <p type="p">190:修阻區</p>  
        <p type="p">C1:交界區域</p>  
        <p type="p">d1:間距</p>  
        <p type="p">R1:區塊</p>  
        <p type="p">t1,t2:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="558" publication-number="202614495"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614495.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614495</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137024</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子轉接模組</chinese-title>  
        <english-title>ELECTRONIC ADAPTER MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120241029B">H01R12/72</main-classification>  
        <further-classification edition="200601120241029B">H01R13/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞市康祥電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN KANGXIANG ELECTRONIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林永常</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUNG-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張弘典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HUNG-TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾軒禾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, HSUAN HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭振田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種電子轉接模組，包括第一電連接器、電性連接組、壓蓋件及第二電連接器，第一電連接器上設有第一端子，電性連接組件包括組件本體以及設置於組件本體的複數個線路，線路具有第一連接端及第二連接端分別對應地電性連接第一端子及第二端子，該第二連接端具有突出之第一限位部；壓蓋件設置並包覆於該第二連接端上方，壓蓋件之內側壁上設有第一定位部，壓蓋件之末端向後延伸有一第三定位部；第二電連接器內設有第二限位部、第二定位部及第四定位部分別應第一限位部、第一定位部及第三定位部並可相互卡合定位。藉由本發明的電子轉接模組，使人員在進行電連接器的組接時能夠輕易快速地完成組接，並且於組裝完成後不須銲接固定，後續須維修時可直接拆卸後進行個別組件之維修，提升了後續維護之便利性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses an electronic adapter module, comprising a first electrical connector, an electrical connection assembly, a press cover, and a second electrical connector. The first electrical connector is equipped with a first terminal. The electrical connection assembly includes an assembly body and a plurality of circuits arranged on the assembly body. The circuits have a first connection end and a second connection end, which are electrically connected to the first terminal and the second terminal, respectively. The second connection end has a protruding first limiting portion. The press cover is placed over the second connection end, and the inner wall of the press cover is provided with a first positioning part. The end of the press cover extends backward with a third positioning part. Inside the second electrical connector, there is a second limiting portion, a second positioning part, and a fourth positioning part, which correspond to the first limiting portion, the first positioning part, and the third positioning part, respectively, allowing for mutual engagement and positioning. With the electronic adapter module of this invention, personnel can easily and quickly complete the assembly of the electrical connector. After assembly, no soldering is required for fixation, and during subsequent maintenance, individual components can be disassembled and repaired directly, improving the convenience of future maintenance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子轉接模組</p>  
        <p type="p">10:第一電連接器</p>  
        <p type="p">11:第一端子</p>  
        <p type="p">12:第一絕緣結構</p>  
        <p type="p">13:外殼件</p>  
        <p type="p">20:電性連接組件</p>  
        <p type="p">21:組件本體</p>  
        <p type="p">211:第一連接端</p>  
        <p type="p">30:壓蓋件</p>  
        <p type="p">32:第一定位部</p>  
        <p type="p">34:第三定位部</p>  
        <p type="p">40:第二電連接器</p>  
        <p type="p">41:第二端子</p>  
        <p type="p">42:第二絕緣結構</p>  
        <p type="p">422:第二限位部</p>  
        <p type="p">424:第二定位部</p>  
        <p type="p">426:第四定位部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="559" publication-number="202614517"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614517.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614517</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137026</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二合一USB連接器</chinese-title>  
        <english-title>TWO IN ONE USB CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">H01R27/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商和鍥電子（崑山）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONNTECH ELECTRONIC (KUNSHAN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡佳諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, JIA-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭振田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種二合一USB連接器，包括有一母座及一公座。所述母座其延伸設有第一、二舌部，並相對於母座與第一、二舌部其內部設置有一體成形金屬之第一夾片；所述公座設有第二殼體，第二殼體設有左、右對應之第一、二插口；當母座與公座對接時，第一舌部能對應置入第一插口內，令第一舌部所設之第一端子組與第一插口內所設置之第三端子組電性連接，以及第二舌部能對應置入第二插口內，令第二舌部所設之第二端子組與第二插口內所設置之第四端子組電性連接，使得不增加整體連接器其厚度情況下，具有雙插槽之機能，達成在充電效能及傳輸效能上具二倍提升效益。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a two in one USB connector, which includes a female socket and a male socket. The female socket is extended with first and second tongue portions, and a first clip of integrally formed metal is provided inside the female socket and the first and second tongue portions; the male socket is provided with a second shell, the second housing is provided with the first and second sockets corresponding to the left and right; when the female socket and the male socket are connected, the first tongue portion can be correspondingly inserted into the first socket, so that the first tongue portion is set to the first socket. The terminal set is electrically connected to the third terminal set provided in the first socket, and the second tongue portion can be correspondingly inserted into the second socket so that the second terminal set provided in the second tongue portion is connected to the second terminal set provided in the second socket. The fourth terminal set is provided for electrical connection, so that it has the function of dual slots without increasing the thickness of the overall connector, achieving a doubling improvement in charging performance and transmission performance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:母座</p>  
        <p type="p">10:第一基座</p>  
        <p type="p">11:第一舌部</p>  
        <p type="p">111:第一卡接凹部</p>  
        <p type="p">12:第二舌部</p>  
        <p type="p">121:第二卡接凹部</p>  
        <p type="p">13:凹設空間</p>  
        <p type="p">14:卡合部</p>  
        <p type="p">15:第一殼體</p>  
        <p type="p">151:第一彈片</p>  
        <p type="p">152:凸肋</p>  
        <p type="p">16:第一蓋體</p>  
        <p type="p">17:第一端子組</p>  
        <p type="p">18:第二端子組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="560" publication-number="202614629"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614629.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614629</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137034</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>收音結構</chinese-title>  
        <english-title>SOUND RECEIVING STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">H04R1/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原兆科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OPEN ROAD SOLUTIONS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周錦材</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHING TSAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊傳鏈</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種收音結構，具有抗風噪音的功能，該收音結構包含一外殼體，外殼體具有至少一外部入聲口，外殼體內部設有至少一腔體與外部入聲口相互連通，各腔體設有多孔體，外殼體另具有至少一內部入聲道連通腔體與至少一麥克風單體，內部入聲道的截面積小於腔體的截面積。當外部聲音經由外部入聲口與腔體傳遞至麥克風單體，並透過腔體內的多孔體與內部入聲道大幅且確實減少風聲干擾，確保麥克風的收音品質，收音結構更適用於複數個麥克風單體設置，並能根據需求調整腔體與通道數量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A Sound receiving structure with wind noise resistance comprises a housing body with at least one enternal sound inlet. Inside the housing body comprises at least one chamber connected to the external sound inlet, eaxh chamber containing a porous body. The housing body also includes at least one internal sound channel connecting to the chamber and at least one microphone unit, with the cross-sectional area of the internal channel smaller than of the chamber. External sound passes through the chamber and the porous body to the microphone unit, effectively reducing wind noise and improving sound quality. This structure supports multiple microphones and adjustable cavity and channel configurations as needed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:外殼體</p>  
        <p type="p">11:外部入聲口</p>  
        <p type="p">12:第一腔體</p>  
        <p type="p">13:連接通道</p>  
        <p type="p">14:第二腔體</p>  
        <p type="p">15:內部入聲道</p>  
        <p type="p">20:多孔體</p>  
        <p type="p">30:防水透氣層</p>  
        <p type="p">40:防塵件</p>  
        <p type="p">50:麥克風單體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="561" publication-number="202614502"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614502.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614502</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137044</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>匯流排連接器</chinese-title>  
        <english-title>BUS BAR CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">H01R13/40</main-classification>  
        <further-classification edition="201101120241127B">H01R12/72</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佳必琪國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JPC CONNECTIVITY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張旭峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSU FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帥貞雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHUAI, ZHEN XIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係一種匯流排連接器，包括絕緣主體及預裝組件，絕緣主體具有穿槽及內緣表面，預裝組件沿第一方向插接穿槽，預裝組件包括絕緣內芯、一對電源夾持端子及一對訊號端子，絕緣內芯具有一對嵌槽及一對卡槽，各電源夾持端子分別沿第二方向插設在各嵌槽內且平行排列而使絕緣內芯及內緣表面共同包覆各電源夾持端子的外緣之部分，第一方向及第二方向彼此相互垂直，各訊號端子分別設於各卡槽內且平行於第一方向而使絕緣內芯及內緣表面共同包覆各訊號端子的外緣之部分；藉此可有效防止匯流排連接器拔出時造成各電源夾持端子鬆動脫落。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure is directed to a bus bar connector having an insulative body and a pre-assembled component. The insulative body has a through slot and an internal surface. The pre-assembled component is inserted into the through slot along a first direction. The pre-assembled component includes an insulative inner core, a pair of clamping power terminals and a pair of signal terminals. The insulative core has a pair of embedding slots and a pair of snapping slots. The clamping power terminals are respectively inserted into the embedding slots along the second direction and arranged in parallel so that the insulative core and the internal surface jointly cover a portion of an outer edge of each power clamping terminal. The first direction and the second direction are perpendicular to each other. The signal terminals are respectively arranged in the snapping slots and parallel to the first direction so that the insulative core and the internal surface jointly cover the portion of the outer edge of each signal terminal. The clamping power terminals may be effectively prevented from loosening and falling off when the bus bar connector is pulled out.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:絕緣主體</p>  
        <p type="p">11:穿槽</p>  
        <p type="p">12:內緣表面</p>  
        <p type="p">13:倒鉤</p>  
        <p type="p">14:夾持板</p>  
        <p type="p">15:第一卡扣</p>  
        <p type="p">20:預裝組件</p>  
        <p type="p">21:絕緣內芯</p>  
        <p type="p">211:嵌槽</p>  
        <p type="p">212:卡槽</p>  
        <p type="p">213:卡鉤</p>  
        <p type="p">215:第二卡扣</p>  
        <p type="p">22:電源夾持端子</p>  
        <p type="p">221:擋臂</p>  
        <p type="p">222:擋塊</p>  
        <p type="p">23:訊號端子</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="562" publication-number="202612623"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612623.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612623</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137048</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>紀念自動倉儲平台系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241130B">A47G33/00</main-classification>  
        <further-classification edition="202401120241130B">G06Q10/08</further-classification>  
        <further-classification edition="200601120241130B">E04H13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫朝堂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江銜文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫朝堂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種紀念自動倉儲平台系統，包含一倉儲單元、一自動尋取單元、一憑弔單元、一中控單元及一連網單元。該倉儲單元具有至少一儲藏櫃及多數祭祀盒體。該自動尋取單元具有至少一取運裝置及至少一攝影裝置。該憑弔單元具有一憑弔空間及一顯示器。該中控單元具有一人機介面及一尋盒裝置。該連網單元供使用者運用程式由遠端連線到該中控單元，可遠端控制該攝影裝置快速擷取該祭祀盒體的畫面。藉此，當面臨生命告別時，生者可親自至亡者遺物存放地，或者可在遠端進行祭拜儀式，檢視摯親的遺物，達成方便民眾追思至親的目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:倉儲單元</p>  
        <p type="p">11:儲藏櫃</p>  
        <p type="p">111:儲盒空間</p>  
        <p type="p">112:取盒間隙</p>  
        <p type="p">12:祭祀盒體</p>  
        <p type="p">121:抽屜</p>  
        <p type="p">13:移櫃機構</p>  
        <p type="p">20:自動尋取單元</p>  
        <p type="p">21:取運裝置</p>  
        <p type="p">211:第一基座</p>  
        <p type="p">212:第一X軸軌道</p>  
        <p type="p">213:第一Y軸螺桿</p>  
        <p type="p">214:第一Z軸螺桿</p>  
        <p type="p">215:夾具</p>  
        <p type="p">216:運盒平台</p>  
        <p type="p">22:攝影裝置</p>  
        <p type="p">221:第二基座</p>  
        <p type="p">222:第二X軸軌道</p>  
        <p type="p">223:第二Y軸螺桿</p>  
        <p type="p">224:第二Z軸螺桿</p>  
        <p type="p">225:攝影機</p>  
        <p type="p">30:憑弔單元</p>  
        <p type="p">31:憑弔空間</p>  
        <p type="p">311:祭祀平台</p>  
        <p type="p">32:顯示器</p>  
        <p type="p">33:播音模組</p>  
        <p type="p">40:中控單元</p>  
        <p type="p">41:人機介面</p>  
        <p type="p">411:觸控面板</p>  
        <p type="p">412:鍵盤</p>  
        <p type="p">42:尋盒裝置</p>  
        <p type="p">421:無線發射器</p>  
        <p type="p">43:影音資料庫</p>  
        <p type="p">50:連網單元</p>  
        <p type="p">100:連網顯示器</p>  
        <p type="p">a:移櫃訊號</p>  
        <p type="p">b:取盒訊號</p>  
        <p type="p">c:運盒信號</p>  
        <p type="p">S:音檔</p>  
        <p type="p">B:取景訊號</p>  
        <p type="p">V:即時影像訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="563" publication-number="202614483"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614483.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614483</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137051</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天線配置</chinese-title>  
        <english-title>ANTENNA ARRANGEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">H01Q1/36</main-classification>  
        <further-classification edition="200601120250102B">H01Q1/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>啓碁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON NEWEB CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚德劭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, DE SHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連崇哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIEN, CHUNG-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴志峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, CHIH FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種天線配置，包含一影像感測模組以及一天線模組。天線模組的垂直投影部分重疊於影像感測模組，並包含一第一輻射部及一饋入件。饋入件設置於第一輻射部。其中，饋入件與影像感測模組之間具有一第一間距。藉此，解決電子裝置中天線設置空間受限的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An antenna arrangement is proposed. The antenna arrangement includes an image sensing module and an antenna module. An orthogonal projection of the antenna module partially overlaps the image sensing module. The antenna module includes a first radiating part and a feeding part. The feeding part is disposed on the first radiating part. A first distance is between the feeding part and the image sensing module. Thus, the antenna arrangement of the present disclosure can solve the problem of limited space for antenna installation in the electronic device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:天線配置</p>  
        <p type="p">110:影像感測模組</p>  
        <p type="p">120:天線模組</p>  
        <p type="p">121:第一輻射部</p>  
        <p type="p">122:饋入件</p>  
        <p type="p">123:第二輻射部</p>  
        <p type="p">124:接地部</p>  
        <p type="p">125:本體</p>  
        <p type="p">B1,B2:輻射區域</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">G:天線地</p>  
        <p type="p">X:第一間距</p>  
        <p type="p">Y:第二間距</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="564" publication-number="202614511"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614511.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614511</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137053</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電連接器（十八）</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251030B">H01R13/658</main-classification>  
        <further-classification edition="200601120251030B">H01R13/648</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維將科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>V-GENERAL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉博文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, PO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉子維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, TZU-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉語侖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, YU-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇彥文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為涉及一種電連接器，包括一電路基板、數個固定部、數個訊號傳導部、及至少一導電部，其中所述固定部、訊號傳導部、及導電部皆設於電路基板上，且固定部可供一電連接器之插接腳插設，而訊號傳導部係為符合高畫質多媒體介面(High Definition Multimedia Interface，HDMI)或數位式視訊介面(DisplayPort，DP)通訊傳輸協定的訊號傳導部，以供電連接器之焊接部進行結合，尤其導電部係位於訊號傳導部及各個固定部所共同圍出之區域內，藉此，電連接器可透過底部與導電部接觸，以有效的增加雜訊宣洩的路徑，進而達到降低電磁干擾與射頻干擾之優勢，且具有較佳之高頻特性。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">1:電路基板</p>  
        <p type="p">11:固定部</p>  
        <p type="p">12:訊號傳導部</p>  
        <p type="p">121:導體</p>  
        <p type="p">13:導電部</p>  
        <p type="p">14:絕緣區域</p>  
        <p type="p">15:導電銅材區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="565" publication-number="202612773"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612773.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612773</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137060</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>太陽熱能低壓蒸餾與乾燥兩用裝置</chinese-title>  
        <english-title>SOLAR THERMAL DEVICE FOR LOW-PRESSURE DISTILLATION AND DRYING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B01D3/04</main-classification>  
        <further-classification edition="202301120241204B">C02F1/14</further-classification>  
        <further-classification edition="200601120241204B">F26B23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慈濟學校財團法人慈濟大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZU CHI UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>花蓮縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文曲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEN CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇美惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, MEI HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴昌賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, CHANG HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種太陽熱能低壓蒸餾與乾燥兩用裝置，其中集熱單元有流入管道、匯流區、儲能匯流區、複數真空管、儲能空間、第一儲能管及第二儲能管，真空管內部設有集熱管，集熱管連通流入管道，集熱管中的集熱管流道連通真空管中的真空管流道，全部或部分的真空管的一端連通儲能匯流區，剩餘的真空管的一端連通匯流區，後續將熱能儲存至儲能匯流區，或將熱能直接從匯流區輸出至乾燥箱及/或蒸餾箱使用，藉此本發明可以透過太陽熱能進行集熱，並將產生的熱能進行儲存，或是將熱能直接輸出供烘乾箱或蒸餾箱使用，實現太陽熱能的多元應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:集熱單元</p>  
        <p type="p">11:流入管</p>  
        <p type="p">111:流入管道</p>  
        <p type="p">112:輸入端</p>  
        <p type="p">113:第二控制閥</p>  
        <p type="p">12:匯流箱</p>  
        <p type="p">121:匯流區</p>  
        <p type="p">122:輸出端</p>  
        <p type="p">13:真空管</p>  
        <p type="p">131:集熱管</p>  
        <p type="p">132:集熱管流道</p>  
        <p type="p">133:真空管流道</p>  
        <p type="p">14:儲能箱</p>  
        <p type="p">141:儲能空間</p>  
        <p type="p">15:儲能匯流管</p>  
        <p type="p">151:儲能匯流區</p>  
        <p type="p">16:第一儲能管</p>  
        <p type="p">161:第一端</p>  
        <p type="p">162:第二端</p>  
        <p type="p">163:第三端</p>  
        <p type="p">164:第一控制閥</p>  
        <p type="p">17:第二儲能管</p>  
        <p type="p">171:第四端</p>  
        <p type="p">172:第五端</p>  
        <p type="p">173:流量閥</p>  
        <p type="p">2:乾燥箱</p>  
        <p type="p">21:烘乾空間</p>  
        <p type="p">22:流體輸入端</p>  
        <p type="p">221:第一管路</p>  
        <p type="p">222:開關閥</p>  
        <p type="p">23:流體輸出端</p>  
        <p type="p">24:隔板</p>  
        <p type="p">25:空氣濾清器</p>  
        <p type="p">26:方向閥</p>  
        <p type="p">261:流體回流端</p>  
        <p type="p">3:偵測單元</p>  
        <p type="p">31:第一溫度偵測器</p>  
        <p type="p">32:第二溫度偵測器</p>  
        <p type="p">33:濕度偵測器</p>  
        <p type="p">4:正壓產生器</p>  
        <p type="p">5:負壓產生器</p>  
        <p type="p">6:除濕單元</p>  
        <p type="p">61:第二管路</p>  
        <p type="p">62:第三管路</p>  
        <p type="p">63:逆止閥</p>  
        <p type="p">7:輔助加熱器</p>  
        <p type="p">71:插頭</p>  
        <p type="p">8:控制單元</p>  
        <p type="p">9:太陽能供電單元</p>  
        <p type="p">10:蒸餾箱</p>  
        <p type="p">102:蒸餾透板</p>  
        <p type="p">20:預熱箱</p>  
        <p type="p">202:預熱透板</p>  
        <p type="p">30:淨水管道</p>  
        <p type="p">301:淨水控制閥</p>  
        <p type="p">40:第四管路</p>  
        <p type="p">50:第五管路</p>  
        <p type="p">501:文氏管</p>  
        <p type="p">502:延伸管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="566" publication-number="202612837"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612837.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612837</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137063</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>點焊品質異常偵測裝置和方法</chinese-title>  
        <english-title>SPOT WELDING ABNORMAL QUALITY DETECTION DEVICE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241125B">B23K31/12</main-classification>  
        <further-classification edition="200601120241125B">B23K11/11</further-classification>  
        <further-classification edition="200601120241125B">B23K11/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人資訊工業策進會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INSTITUTE FOR INFORMATION INDUSTRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱育賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, YU-XIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳承輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHENG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種點焊品質異常偵測裝置和方法，該方法由一處理器執行，且該方法包括以下步驟：利用一壓力訊號切割一電流訊號，以產生複數個電流訊號區段；判斷該些電流訊號區段是否高於一電流門檻值，將高於該電流門檻值的該些電流訊號區段分別轉換為對應的一頻域熱力圖；利用一異常偵測模型產生一重構熱力圖，計算該頻域熱力圖與該重構熱力圖的差異，並產生一損失值；以及當該損失值大於一門檻值時，產生一點焊品質異常訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A spot welding abnormal quality detection device and method are provided. The method is performed by a processor and includes the following steps: segmenting a current signal using a pressure signal to generate a plurality of current signal segments; determining whether the current signal segments are greater than a current threshold, and converting the current signal segments greater than the current threshold into corresponding frequency heat maps; utilizing an abnormality detection model to generate a reconstructed heat map, and calculating a difference between the frequency heat map and the reconstructed heat map for generating a loss value; and generating a spot welding abnormal quality signal when the loss value is greater than a threshold value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10、S20、S30、S40、S50、S60、S70:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="567" publication-number="202613983"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613983.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613983</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137067</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>便利食品自助販售煮食系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">G07F17/00</main-classification>  
        <further-classification edition="200601120250203B">G07F9/10</further-classification>  
        <further-classification edition="201201120250203B">G06Q50/12</further-classification>  
        <further-classification edition="202301120250203B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技業資訊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂永評</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作為一種便利食品自助販售煮食系統，供應用於一無人商店中，該系統包含一控制主機、一點餐機、一升降承載架、一配料販賣機及一加熱機，該點餐機提供消費者在該無人商店中選購餐點及配料並輸出列印一條碼單；該升降承載架具有多個可迴轉升降之鏈板以供承載便利食品包裝；該配料販賣機中放置食材配料包裝；該加熱機可根據消費者之點餐資訊，自動輸出對應的水量及控制加熱時間，以加熱該些便利食品及其食材配料；本創作無論是便利食品或食材配料均已預先包裝，該控制主機根據讀取該條碼單上的資訊，控制該升降承載架及該配料販賣機將選購的食材移動供消費者取用，不僅各種食材的販售情況能精確掌握，還可避免食材直接外露而導致的食品汙染問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:控制主機</p>  
        <p type="p">20:點餐機</p>  
        <p type="p">30:升降承載架</p>  
        <p type="p">40:配料販賣機</p>  
        <p type="p">50:加熱機</p>  
        <p type="p">60:遠端伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="568" publication-number="202612665"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612665.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612665</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137068</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調式止鼾裝置</chinese-title>  
        <english-title>ADJUSTABLE ANTI-SNORING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241024B">A61F5/56</main-classification>  
        <further-classification edition="200601120241024B">A61M16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐　瑋勗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG, ALLEN SUE-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐　瑋勗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG, ALLEN SUE-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可調式止鼾裝置，包含二側片、上弧形結構、二連接件以及下弧形結構，其中上弧形結構的二端分別連接於二側片。每一連接件的一端連接於其中一側片，其中每一連接件包含二基塊、二引導桿及調整螺桿，二引導桿可移動地穿設於二基塊，調整螺桿位於二引導桿之間且可移動地穿設於二基塊。下弧形結構的一端連接於其中一連接件的另一端，下弧形結構的另一端連接於另一連接件的另一端。藉此，可調式止鼾裝置可依據使用者需求調整以解決打鼾問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an adjustable anti-snoring device that includes two side pieces, an upper curved structure, two connectors, and a lower curved structure, wherein two ends of the upper curved structure connect to the two side pieces, respectively. One end of each of the connectors connects to one of the side pieces. Each of the connectors includes two blocks, two guiding rods and an adjusting screw, the guiding rods are movably inserted through the blocks, and the adjusting screw is between the guiding rods and movably inserted through the blocks. One end of the lower curved structure connects to the other end of one of the connectors, and the other end of the lower curved structure connects to the other end of the other one of the connectors. Therefore, the adjustable anti-snoring device can be adjusted based on needs of the user to solve snoring problems.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:可調式止鼾裝置</p>  
        <p type="p">110:側片</p>  
        <p type="p">120:上弧形結構</p>  
        <p type="p">121:凹槽</p>  
        <p type="p">130:連接件</p>  
        <p type="p">131:基塊</p>  
        <p type="p">132:引導桿</p>  
        <p type="p">133:調整螺桿</p>  
        <p type="p">140:下弧形結構</p>  
        <p type="p">141:凹槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="569" publication-number="202613457"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613457.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613457</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137071</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環境保護設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241230B">F24F3/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣松下電器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHITA ELECTRIC (TAIWAN) CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳逸民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮展亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭宇晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王儷蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱漢樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種環境保護設備，包含一支架單元、至少一空氣淨化裝置、一集液槽單元，及一綠電單元。該支架單元內部界定出一個過濾空間。該至少一空氣淨化裝置包括一灑水單元、一送風單元，及一淨化單元。該灑水單元可用以朝該過濾空間噴灑水液。該送風單元可產生通過所述水液噴灑區域的氣流。該淨化單元可用以對水液進行過濾處理。該集液槽單元可用以收集該空氣淨化裝置處理後的水液。該綠電單元可用以供電驅動該送風單元與該灑水單元。藉由該空氣淨化裝置淨化空氣，以及該綠電單元提供能源，進而達到與樹木相似的效果，且不需要土壤以及生長的時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:苔蘚植物</p>  
        <p type="p">2:支架單元</p>  
        <p type="p">21:過濾空間</p>  
        <p type="p">22:進氣口</p>  
        <p type="p">23:出氣口</p>  
        <p type="p">3:空氣淨化裝置</p>  
        <p type="p">31:灑水單元</p>  
        <p type="p">311:第一槽體</p>  
        <p type="p">311a:底壁</p>  
        <p type="p">311b:內環壁</p>  
        <p type="p">311c:外環壁</p>  
        <p type="p">311d:頂壁</p>  
        <p type="p">311e:入水孔</p>  
        <p type="p">311f:溢流孔</p>  
        <p type="p">311g:水槽</p>  
        <p type="p">312:灑水器</p>  
        <p type="p">312a:灑水孔</p>  
        <p type="p">313:馬達容置槽</p>  
        <p type="p">32:送風單元</p>  
        <p type="p">321:風扇</p>  
        <p type="p">322:驅動機構</p>  
        <p type="p">322a:第一馬達</p>  
        <p type="p">322b:轉軸</p>  
        <p type="p">33:淨化單元</p>  
        <p type="p">331:陶瓷燒結濾網</p>  
        <p type="p">332:高壓管結構體</p>  
        <p type="p">332a:通孔</p>  
        <p type="p">332b:出水孔</p>  
        <p type="p">333:防潑濺濾網</p>  
        <p type="p">334:防水檔板</p>  
        <p type="p">335:載體</p>  
        <p type="p">336:中央區間</p>  
        <p type="p">337:連外區間</p>  
        <p type="p">338:光源</p>  
        <p type="p">4:集液槽單元</p>  
        <p type="p">41:緩衝網</p>  
        <p type="p">42:第二槽體</p>  
        <p type="p">421:下槽部</p>  
        <p type="p">422:上槽部</p>  
        <p type="p">423:阻汙板部</p>  
        <p type="p">43:抽水泵</p>  
        <p type="p">44:抽汙管</p>  
        <p type="p">45:溢流管</p>  
        <p type="p">46:送水管</p>  
        <p type="p">461:下管部</p>  
        <p type="p">462:上管部</p>  
        <p type="p">47:紫外線淨水器</p>  
        <p type="p">5:綠電單元</p>  
        <p type="p">51:頂架</p>  
        <p type="p">511:支撐板</p>  
        <p type="p">52:太陽能光電板</p>  
        <p type="p">53:風力發電機組</p>  
        <p type="p">531:發電機</p>  
        <p type="p">532:垂直軸風車</p>  
        <p type="p">54:蓄電池</p>  
        <p type="p">55:清潔刷</p>  
        <p type="p">56:第二馬達</p>  
        <p type="p">57:排水槽</p>  
        <p type="p">58:插座</p>  
        <p type="p">6:製水單元</p>  
        <p type="p">61:熱交換器</p>  
        <p type="p">62:集水盤</p>  
        <p type="p">7:集液管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="570" publication-number="202614642"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614642.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614642</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137073</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>耳機之空間音效的控制裝置及其控制方法</chinese-title>  
        <english-title>CONTROL DEVICE FOR SPATIAL SOUND EFFECT OF HEADPHONE AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H04S7/00</main-classification>  
        <further-classification edition="200601120250203B">H04R1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏碁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACER INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜博仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, PO-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張嘉仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JIA-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾凱盟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZENG, KAI-MENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種耳機之空間音效的控制裝置及其控制方法。耳機之空間音效的控制裝置包括一接收單元、一頭部追蹤單元、至少三等化器、一切換器及一控制器。頭部追蹤單元用以追蹤一頭部方向。等化器用以依據頭部方向，對原始聲音訊號進行處理，以至少獲得一第一調整後聲音訊號、一第二調整後聲音訊號及一第三調整後聲音訊號。切換器用以依據頭部方向，將第一調整後聲音訊號輸出。若頭部方向變動為第一預計轉動方向，則控制器控制切換器輸出第二調整後聲音訊號。若頭部方向變動為第二預計轉動方向，則控制器控制切換器輸出第三調整後聲音訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A control device for spatial sound effect of a headphone and a control method thereof are provided. The control device for the spatial sound effect of the headphone includes a receiving unit, a head tracking unit, at least three equalizers, a switch, and a controller. The head tracking unit is used to track a head direction. The equalizers are used to process an original sound signal according to the head direction to obtain at least a first adjusted sound signal, a second adjusted sound signal and a third adjusted sound signal. The switch is used to output the first adjusted sound signal according to the head direction. If the head direction changes to a first expected rotation direction, the controller controls the switch to output the second adjusted sound signal. If the head direction changes to a second expected rotation direction, the controller controls the switch to output the third adjusted sound signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110,S120,S130,S140,S150,S160,S170:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="571" publication-number="202613883"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613883.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613883</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137074</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於注意力分數的注意力機制調整方法及使用所述方法的計算裝置</chinese-title>  
        <english-title>ATTENTION MECHANISM ADJUSTMENT METHOD BASED ON ATTENTION SCORE AND COMPUTING DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250203B">G06N3/045</main-classification>  
        <further-classification edition="202301120250203B">G06N3/08</further-classification>  
        <further-classification edition="202301120250203B">G06N3/082</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人工業技術研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YAO-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林柏宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PO-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃稚存</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-TSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提供一種基於注意力分數的注意力機制調整方法，適用於轉換器模型。該方法包括:針對轉換器模型的當前轉換器區塊，根據輸入序列獲取查詢矩陣、鍵矩陣及值矩陣；利用自注意力模組產生多個注意力分數矩陣，對應多個注意力頭；在執行Softmax函數前，對注意力分數矩陣進行跨頭列方向聚合運算，獲取Token重要性向量；比較重要性分數與訓練後重要性分數門檻值，判斷是否需要剪枝；對需剪枝的目標Token執行剪枝操作，獲得剪枝後注意力分數矩陣；對剪枝後注意力分數矩陣執行Softmax函數運算，獲取剪枝後注意力機率矩陣，其中被剪枝Token的機率值為零。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An attention mechanism adjustment method based on attention scores, applicable to Transformer models, is provided. The method includes: for the current Transformer block of the Transformer model, obtaining query matrix, key matrix, and value matrix based on the input sequence; using the self-attention module to generate multiple attention score matrices corresponding to multiple attention heads; before executing the softmax function, performing cross-head column-wise aggregation operation on the attention score matrices to obtain a token importance vector; comparing importance scores with the trained importance score threshold to determine if pruning is needed; executing pruning operations on target tokens that need pruning to obtain pruned attention score matrices; performing softmax function operations on the pruned attention score matrices to obtain a pruned attention probability matrix, where the probability values of the pruned tokens are zero.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210~S260:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="572" publication-number="202613512"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613512.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613512</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137083</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢測系統</chinese-title>  
        <english-title>INSPECTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">G01M11/02</main-classification>  
        <further-classification edition="201601120250418B">G09G3/32</further-classification>  
        <further-classification edition="202001120250418B">H05B45/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪永傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, YONG JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TZUNG HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁廖杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, LIAO-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種檢測系統，包括多個光源板、感測器以及控制器。光源板以中心為球心排成半球形，且用以朝待檢測物發出多個光束。感測器設置在光源板旁，且用以朝待檢測物感測光束的反射光束。控制器電性連接至光源板與感測器。控制器控制光源板以流水式點亮，並同時記錄感測器取得的反射光束的訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A inspection system includes a plurality of light source plates, sensors and controllers. The light source plates are arranged in a hemispherical shape with a center as a spherical center, and are configured to emit a plurality of light beams toward the object to be inspected. The sensor is disposed next to the light source plate and is configured to sense reflected light beams of the light beams toward the object to be inspected. The controller is electrically connected to the light source plates and the sensor. The controller controls the light source plates to light up in a waterflow manner, and simultaneously records signals of the reflected beams obtained by the sensor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:檢測系統</p>  
        <p type="p">100:光源板</p>  
        <p type="p">300:控制器</p>  
        <p type="p">C:中心</p>  
        <p type="p">L:光束</p>  
        <p type="p">OI:待檢測物</p>  
        <p type="p">P:平面</p>  
        <p type="p">θ:夾角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="573" publication-number="202614635"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614635.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614635</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137084</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配合薄型音圈的磁迴組件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H04R9/04</main-classification>  
        <further-classification edition="200601120250203B">H04R9/06</further-classification>  
        <further-classification edition="200601120250203B">H04R7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富祐鴻科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORTUNE GRAND TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳炫諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSUAN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂劍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LV, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾明軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, MING JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種配合薄型音圈的磁迴組件，用於結合防水振膜組件及薄型音圈組件，薄型音圈組件結合於防水振膜組件，磁迴組件包含導磁軛及主磁鐵單元；導磁軛包括底板部、長邊部、短邊部、振膜嵌接槽及組接緣，振膜嵌接槽設於長邊部之頂部以嵌接振膜組件，組接緣設於短邊部之頂部以組接振膜組件及薄型音圈組件；主磁鐵單元設於底板部。藉此，本發明的磁迴組件可形成凸型的結構設計，磁迴組件的體積可更大，磁力可更強，且薄型音圈可對應於主磁鐵單元與長邊部及短邊部之間的磁間隙，使薄型防水揚聲器的效率可更好，更有利於音質的呈現。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:磁迴組件</p>  
        <p type="p">11:導磁軛</p>  
        <p type="p">111:底板部</p>  
        <p type="p">112:長邊部</p>  
        <p type="p">113:短邊部</p>  
        <p type="p">114:振膜嵌接槽</p>  
        <p type="p">115:組接緣</p>  
        <p type="p">116:第一通氣孔</p>  
        <p type="p">117:第二通氣孔</p>  
        <p type="p">12:主磁鐵單元</p>  
        <p type="p">121:主磁鐵</p>  
        <p type="p">122:主導磁板</p>  
        <p type="p">14:磁間隙</p>  
        <p type="p">2:薄型音圈組件</p>  
        <p type="p">21:薄型音圈</p>  
        <p type="p">211:短邊側部</p>  
        <p type="p">22:彈波</p>  
        <p type="p">221:薄型音圈貼合部</p>  
        <p type="p">222:固定部</p>  
        <p type="p">223:彈性臂</p>  
        <p type="p">224:電氣接點</p>  
        <p type="p">3:防水振膜組件</p>  
        <p type="p">31:防水振膜</p>  
        <p type="p">311:長邊嵌接面</p>  
        <p type="p">312:短邊嵌接面</p>  
        <p type="p">32:平面球頂</p>  
        <p type="p">33:振膜支架</p>  
        <p type="p">331:長邊嵌接凸緣</p>  
        <p type="p">332:短邊嵌接凸緣</p>  
        <p type="p">333:環型嵌接凸緣</p>  
        <p type="p">4:環型墊片</p>  
        <p type="p">41:環型發泡體</p>  
        <p type="p">42:環型鋁箔片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="574" publication-number="202614636"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614636.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614636</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137085</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配合薄型音圈的防水振膜組件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H04R9/04</main-classification>  
        <further-classification edition="200601120250203B">H04R9/06</further-classification>  
        <further-classification edition="200601120250203B">H04R7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富祐鴻科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORTUNE GRAND TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳炫諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSUAN YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂劍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LV, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾明軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, MING JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種配合薄型音圈的防水振膜組件，用於結合磁迴組件及薄型音圈組件，防水振膜組件結合於磁迴組件，薄型音圈組件結合於防水振膜組件，防水振膜組件包含防水振膜、振膜支架及環型墊片。防水振膜設有長邊嵌接面；振膜支架結合防水振膜，振膜支架設有長邊嵌接凸緣，長邊嵌接凸緣對應設於長邊嵌接面之一側，振膜支架之長邊嵌接凸緣配合防水振膜之長邊嵌接面組合於磁迴組件；環型墊片設於防水振膜之底部，環型墊片之底部組合於薄型音圈組件。藉此，本發明的防水振膜組件可以環型墊片提供防水振膜自由作動空間，以提升薄型防水揚聲器的效率、音質及音量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:磁迴組件</p>  
        <p type="p">11:導磁軛</p>  
        <p type="p">111:底板部</p>  
        <p type="p">112:長邊部</p>  
        <p type="p">113:短邊部</p>  
        <p type="p">114:振膜嵌接槽</p>  
        <p type="p">115:組接緣</p>  
        <p type="p">116:第一通氣孔</p>  
        <p type="p">117:第二通氣孔</p>  
        <p type="p">12:主磁鐵單元</p>  
        <p type="p">121:主磁鐵</p>  
        <p type="p">122:主導磁板</p>  
        <p type="p">14:磁間隙</p>  
        <p type="p">2:薄型音圈組件</p>  
        <p type="p">21:薄型音圈</p>  
        <p type="p">211:短邊側部</p>  
        <p type="p">22:彈波</p>  
        <p type="p">221:薄型音圈貼合部</p>  
        <p type="p">222:固定部</p>  
        <p type="p">223:彈性臂</p>  
        <p type="p">224:電氣接點</p>  
        <p type="p">3:防水振膜組件</p>  
        <p type="p">31:防水振膜</p>  
        <p type="p">311:長邊嵌接面</p>  
        <p type="p">312:短邊嵌接面</p>  
        <p type="p">32:平面球頂</p>  
        <p type="p">33:振膜支架</p>  
        <p type="p">331:長邊嵌接凸緣</p>  
        <p type="p">332:短邊嵌接凸緣</p>  
        <p type="p">333:環型嵌接凸緣</p>  
        <p type="p">4:環型墊片</p>  
        <p type="p">41:環型發泡體</p>  
        <p type="p">42:環型片體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="575" publication-number="202613686"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613686.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613686</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137087</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">G02F1/1335</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林根靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KEN CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃朝偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHAO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包括一基板、一發光元件以及一封裝層。發光元件設置於基板上，封裝層設置於基板上，覆蓋發光元件，發光元件沿第一方向具有一第一寬度，封裝層具有一頂面，頂面包括一第一溝槽，第一溝槽沿第一方向具有第二寬度，第二寬度大於所述第一寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a substrate, a light-emitting element and a encapsulation layer. The light-emitting element is disposed on the substrate, the encapsulation layer is disposed on the substrate and covers the light-emitting element, the light-emitting element has a first width along a first direction, the encapsulation layer has a top surface, the top surface includes a first trench, the first trench has a second width along the first direction, and the second width is greater than the first width.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:基板</p>  
        <p type="p">120a、120b:電極</p>  
        <p type="p">130:發光元件</p>  
        <p type="p">BMT:溝槽</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">D2、D3:深度</p>  
        <p type="p">H1、H3、H4:高度</p>  
        <p type="p">IJP:封裝層</p>  
        <p type="p">MLT:溝槽</p>  
        <p type="p">OC:光學膠層</p>  
        <p type="p">TP:頂面</p>  
        <p type="p">W1、W2、W3:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="576" publication-number="202614530"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614530.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614530</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137089</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>家用移動式電源裝置及局部化供電系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H02J7/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣電力股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林建宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣仲凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李信璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳昆穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉盛豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種家用移動式電源裝置，其具有：一機車電池模組連接器，用以電氣連接一機車電池模組；以及一電力轉換器，具有一第一電力連接埠及一第二電力連接埠，該第一電力連接埠係用以與該機車電池模組連接器電氣耦接，且係用以將該機車電池模組之電壓轉成至少一輸出電壓，以及該第二電力連接埠係用以向一設施提供該至少一輸出電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:機車電池模組</p>  
        <p type="p">20:設施</p>  
        <p type="p">100:家用移動式電源裝置</p>  
        <p type="p">110:機車電池模組連接器</p>  
        <p type="p">120:電力轉換器</p>  
        <p type="p">121:第一電力連接埠</p>  
        <p type="p">122:第二電力連接埠</p>  
        <p type="p">123:第三電力連接埠</p>  
        <p type="p">131:處理器</p>  
        <p type="p">132:藍芽裝置</p>  
        <p type="p">133:顯示器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="577" publication-number="202613967"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613967.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613967</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137096</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透明平面元件全向量場檢測之方法與裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS OF FULL VECTORIAL FIELD DETECTION FOR TRANSPARENT PLANAR DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250704B">G06T5/90</main-classification>  
        <further-classification edition="200601120250704B">G06F17/10</further-classification>  
        <further-classification edition="200601120250704B">G01N21/45</further-classification>  
        <further-classification edition="200601120250704B">G01N21/21</further-classification>  
        <further-classification edition="200601120250704B">G01N21/88</further-classification>  
        <further-classification edition="200601120250704B">G02B5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣師範大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN NORMAL UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立陽明交通大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭超仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHAU-JERN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余沛慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, PEICHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江國慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具微奈米結構的透明平面元件全向量場檢測之方法與裝置，適用於超穎透鏡與玻璃基板導孔等平面光學元件之全場波前與偏振特性檢測。本方法利用數位全像技術，實現對此微奈米結構平面元件樣本透射光波的振幅、相位和偏振狀態的高解析度、全場檢測。本裝置利用數位全像顯微鏡架構擷取平面元件樣品穿透光束與參考光束形成的兩組正交偏振方向的干涉圖樣，進行全像波前重建與偏振狀態計算。透過本發明提供之方法與裝置，不僅能夠對具微奈米結構平面元件的波前相位分佈進行精確量測，還能同時獲取其偏振調制特性，為平面光學元件的設計優化、製程改進和性能評估提供了全面而精確的量化數據。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides a method and apparatus for full vectorial field detection of transparent planar devices with micro- and nano-structures, specifically suited for full-field wavefront and polarization characteristics detection of planar optical devices such as metalens, meta-optics and through-glass vias devices. The method employs digital holography to achieve high-resolution, full-field detection of the amplitude, phase, and polarization state of transmitted light waves through these micro- and nanostructured planar elements. The apparatus uses a digital holographic microscope setup to capture two sets of orthogonally polarized interference patterns formed by the transmitted light beam from the planar device sample and a reference beam. This setup enables holographic wavefront reconstruction and polarization state calculation. The method and apparatus provided by the present invention not only allow for precise measurement of the wavefront phase distribution of planar devices with micro-and nano-structures but also simultaneously obtain their polarization modulation characteristics, offering comprehensive and accurate quantitative data for design optimization, process improvement, and performance evaluation of planar optical devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S401,S402,S403,S404,S405,S406:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="578" publication-number="202614447"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614447.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614447</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137097</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電放電防護結構以及靜電放電防護電路</chinese-title>  
        <english-title>ELECTROSTATIC DISCHARGE PROTECTION STRUCTURE AND ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241011B">H01L23/60</main-classification>  
        <further-classification edition="202001120241011B">G06F30/392</further-classification>  
        <further-classification edition="202001320241011B">G06F113/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王昭龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHAO-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種靜電放電防護結構以及靜電放電防護電路被提出。靜電放電防護結構包括基底、矽穿孔、內襯氧化層、第一重摻雜區以及第二重摻雜區。基底耦接至一第一電壓軌線。矽穿孔形成在基底中。內襯氧化層環繞矽穿孔的側表面。第一重摻雜區形成在基底中，並接觸內襯氧化層的第一側邊。第二重摻雜區形成在基底中，並接觸內襯氧化層的第二側邊。第一重摻雜區透過傳輸導線耦接至矽穿孔，第二重摻雜區耦接至第二電壓軌線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrostatic discharge (ESD) protection structure and an ESD protection circuit are provided. The ESD protection structure includes a substrate, a though silicon via (TSV), a liner oxide layer, a first heavily doped region and a second heavily doped region. The substrate is coupled to a first voltage rail. The TSV is formed in the substrate. The liner oxide layer surrounds a side surface of the TSV. The first heavily doped region is formed in the substrate and contacts a first side of the liner oxide layer. The second heavily doped region is formed in the substrate and contacts a second side of the liner oxide layer. The first heavily doped region is coupled to the TSV through a transmission conductive wire, and the second heavily doped region is coupled to a second voltage rail.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:靜電放電防護結構</p>  
        <p type="p">110:基底</p>  
        <p type="p">TSV:矽穿孔</p>  
        <p type="p">120:內襯氧化層</p>  
        <p type="p">131、132:重摻雜區</p>  
        <p type="p">VR1、VR2:電壓軌線</p>  
        <p type="p">W1:傳輸導線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="579" publication-number="202613397"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613397.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613397</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137101</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙向自動復歸門軸結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">E05D15/54</main-classification>  
        <further-classification edition="200601120241104B">E05D11/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安進捲門股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳啟錠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂文勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雙向自動復歸門軸結構，係應用於一門框及一門板上，其構造包含由一門軸板、一定位板、一卡摯元件、一門板組接座所組成，該門軸板設有一軸體，該定位板具有一具傾斜面凹槽且與該軸體構成可活動組接狀，該卡摯元件，活動狀定位於該凹槽，且於該定位板轉動一角度後，令該卡摯元件可脫離於凹槽後並作定位。使門板可朝內或朝外雙向開啟且打開至兩側例如九十度角時，達到自動定位作用；再者，當門板關閉一小角度後，定位輪解除定位狀態，藉由組接板連結於門板所產生的重力，令卡摯元件移動於定位板倒V形狀具傾斜面凹槽上時，應用門板本身重力，為類似錐契卡滑所產生之回復力，達到門板自動復歸關門的功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">10:門軸板</p>  
        <p type="p">11:軸體</p>  
        <p type="p">12:開孔</p>  
        <p type="p">20:定位板</p>  
        <p type="p">21:凹槽</p>  
        <p type="p">22:軸體穿孔</p>  
        <p type="p">23:定位槽</p>  
        <p type="p">30:定位桿</p>  
        <p type="p">31:定位輪</p>  
        <p type="p">32:嵌合槽</p>  
        <p type="p">33:軸扣</p>  
        <p type="p">40:門板組接座</p>  
        <p type="p">41:組接板</p>  
        <p type="p">42:限位板</p>  
        <p type="p">43:螺件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="580" publication-number="202612616"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612616.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612616</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137103</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滑軌系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120241105B">A47B88/50</main-classification>  
        <further-classification edition="200601120241105B">F16C29/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富世達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOSITEK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚旭鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, HSU-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宣博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSUAN-PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王浩評</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAO-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種滑軌系統，包含一第一滑軌模組及一第二滑軌模組。第一滑軌模組包括一第一支撐板及一設置於該第一支撐板的第一滑軌裝置。該第一支撐板具有一第一鎖定孔。第二滑軌模組包括一可活動地設置於該第一支撐板的第二支撐板、一設置於該第二支撐板的第二滑軌裝置、一可活動地設置於該第二支撐板並伸入該第一鎖定孔的鎖定件及一可活動地設置於該第二支撐板的解鎖件。該解鎖件可被操作帶動該鎖定件脫離該第一鎖定孔，使該第二支撐板可相對於該第一支撐板移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:第二滑軌模組</p>  
        <p type="p">21:第二支撐板</p>  
        <p type="p">211:第一面</p>  
        <p type="p">212:第二面</p>  
        <p type="p">216:解鎖卡勾</p>  
        <p type="p">217:卡掣卡勾</p>  
        <p type="p">22:第二滑軌裝置</p>  
        <p type="p">221:第二外軌</p>  
        <p type="p">222:第二中軌</p>  
        <p type="p">222a:中卡勾</p>  
        <p type="p">223:第二內軌</p>  
        <p type="p">24:解鎖件</p>  
        <p type="p">241:操作部</p>  
        <p type="p">242:活動部</p>  
        <p type="p">243:解鎖槽</p>  
        <p type="p">244:鉤部</p>  
        <p type="p">25:卡掣件</p>  
        <p type="p">27:上限位件</p>  
        <p type="p">29:解鎖彈性件</p>  
        <p type="p">20:卡掣彈性件</p>  
        <p type="p">D1:水平方向</p>  
        <p type="p">D2:上下方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="581" publication-number="202614645"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614645.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614645</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137105</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於無線網格標準的多源緊急求救系統</chinese-title>  
        <english-title>MULTI-SOURCE EMERGENCY RESCUE SYSTEM BASED ON WIRELESS MESH STANDARDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250203B">H04W4/80</main-classification>  
        <further-classification edition="201801120250203B">H04W4/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譜羅科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANFI SEMICONDUCTOR CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　攸中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YU CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宸瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHEN WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是關於一種基於無線網格標準的多源緊急求救系統，包括：至少一緊急觸發設備，具有複數個藍牙訊號發射單元，配置以發射一求救訊號；一無線通訊模組，與該至少一緊急觸發設備通訊連接，配置以接收並傳輸該求救訊號；複數個接收器，與該無線通訊模組通訊連接，配置以接收從該無線通訊模組所傳輸的該求救訊號，轉換該求救訊號為一數據並傳輸該數據；以及一資訊服務系統，與該複數個接收器通訊連接，配置以接收該數據並進行一緊急求救操作。藉此，可實現大範圍、多設備的互聯，且利用無電開關觸發，即使沒有外部電源也能可靠地發送求救訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a multi-source emergency rescue system based on wireless mesh standards. The system includes at least one emergency triggering device, having a plurality of Bluetooth signal transmitting units and configured to transmit a distress signal; a wireless communication module, communicatively connected to the at least one emergency triggering device and configured to receive and transmit the distress signal; a plurality of receivers, communicatively connected to the wireless communication module and configured to receive the distress signal transmitted from the wireless communication module and convert the distress signal into data and transmit the data; and an information service system, communicatively connected to the plurality of receivers and configured to receive the data and perform an emergency rescue operation. In such a way, a large-scale and multi-device interconnection can be achieved, and the distress signal can be triggered and sent out reliably by using a powerless switch without an external power source.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基於無線網格標準的多源緊急求救系統</p>  
        <p type="p">100:緊急觸發設備</p>  
        <p type="p">110:行動通訊裝置</p>  
        <p type="p">120:無電開關</p>  
        <p type="p">121:藍牙訊號發射單元</p>  
        <p type="p">200:無線通訊模組</p>  
        <p type="p">300:接收器</p>  
        <p type="p">400:資訊服務系統</p>  
        <p type="p">500:警示系統</p>  
        <p type="p">510:照明系統</p>  
        <p type="p">520:消防廣播系統</p>  
        <p type="p">S1:求救訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="582" publication-number="202612792"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612792.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612792</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137111</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具起伏表面之物體的掃描點膠裝置及掃描點膠方法</chinese-title>  
        <english-title>SCANNING AND DISPENSING DEVICE FOR OBJECTS WITH UNDULATING SURFACES AND SCANNING AND DISPENSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">B05C11/10</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商宸大增材製造（廈門）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMPLIFI TECH (XIAMEN) LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳力瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯建安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, CHIEN-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具起伏表面之物體的掃描點膠裝置包含彼此電性連接的夾固單元、三維掃描單元、點膠單元及控制單元。夾固單元夾固物體並露出起伏表面。三維掃描單元掃描起伏表面以生成點雲圖。控制單元儲存有重疊配置的基底圖及點膠範圍圖，其中點膠範圍圖包含預設點膠邊界，預設點膠邊界至少部分位於基底圖及點膠範圍圖之重疊區域的邊界外圍且相距一距離。控制單元以點雲圖取代基底圖，並以點雲圖及點膠範圍圖重疊的區域生成實際點膠範圍圖，且根據實際點膠範圍圖規劃點膠路徑，以控制點膠單元根據點膠路徑在起伏表面進行點膠。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A scanning and dispensing device for objects with undulating surfaces includes a fixture unit, a three-dimensional scanning unit, a dispensing unit, and a control unit that are electrically connected. The fixture unit fixes an object and exposes an undulating surface of the object. The three-dimensional scanning unit scans the undulating surface to generate a point cloud image. The control unit is electrically connected to the fixture unit, the three-dimensional scanning unit, and the dispensing unit, and saves a base diagram and a dispensing range diagram that are overlapped, in which the dispensing range diagram includes a preset dispensing boundary, and the preset dispensing boundary is at least partially located outside a boundary of an overlapping area of ​​the base diagram and the dispensing range diagram and is separated from the boundary by a distance. The control unit replaces the base diagram with the point cloud image, and generates an actual dispensing range diagram by an overlapping area of ​​the point cloud image and the dispensing range diagram, and plans a dispensing path according to the actual dispensing range diagram to control the dispensing unit to dispense an adhesive on the undulating surface according to the dispensing path.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S60:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="583" publication-number="202614705"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614705.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614705</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137124</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滑軌系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241210B">H05K7/14</main-classification>  
        <further-classification edition="200601120241210B">F16C29/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富世達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOSITEK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚旭鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, HSU-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宣博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSUAN-PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王浩評</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAO-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高玉駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種滑軌系統，包含一第一滑軌模組及一第二滑軌模組。第一滑軌模組包括一第一支撐板及一設置於該第一支撐板的第一滑軌裝置。第二滑軌模組包括一可活動地設置於該第一支撐板的第二支撐板及一設置於該第二支撐板的第二滑軌裝置。藉由該第二滑軌模組的第二支撐板可活動地設置於該第一支撐板，該第二滑軌模組的重量便會施加在該第一支撐板而非該第一滑軌裝置，能夠降低該第一滑軌裝置變形而損壞的風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:第二滑軌模組</p>  
        <p type="p">21:第二支撐板</p>  
        <p type="p">211:第一面</p>  
        <p type="p">212:第二面</p>  
        <p type="p">213:活動槽</p>  
        <p type="p">214:安裝槽</p>  
        <p type="p">216:解鎖卡勾</p>  
        <p type="p">217:卡掣卡勾</p>  
        <p type="p">218:限位片</p>  
        <p type="p">23:鎖定件</p>  
        <p type="p">231:平板部</p>  
        <p type="p">231a:凸柱</p>  
        <p type="p">232:圍壁部</p>  
        <p type="p">233:卡塊部</p>  
        <p type="p">234:套管部</p>  
        <p type="p">235:鎖定彈性件</p>  
        <p type="p">236:定位件</p>  
        <p type="p">24:解鎖件</p>  
        <p type="p">241:操作部</p>  
        <p type="p">242:活動部</p>  
        <p type="p">242a:斜面</p>  
        <p type="p">243:解鎖槽</p>  
        <p type="p">244:鉤部</p>  
        <p type="p">25:卡掣件</p>  
        <p type="p">251:本體部</p>  
        <p type="p">252:卡掣部</p>  
        <p type="p">253:抵接部</p>  
        <p type="p">254:卡勾部</p>  
        <p type="p">26:助滑件</p>  
        <p type="p">27:上限位件</p>  
        <p type="p">271:安裝部</p>  
        <p type="p">272:限位部</p>  
        <p type="p">28:下限位件</p>  
        <p type="p">29:解鎖彈性件</p>  
        <p type="p">20:卡掣彈性件</p>  
        <p type="p">D1:水平方向</p>  
        <p type="p">D2:上下方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="584" publication-number="202612640"> 
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      <tif no="1" file="TIF/202612640.zip"/> 
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        <document-id> 
          <doc-number>202612640</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137126</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具電子式磁性開關之無線通訊膠囊感測器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">A61B1/00</main-classification>  
        <further-classification edition="200601120250512B">A61B5/00</further-classification>  
        <further-classification edition="200601120250512B">H03K17/95</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商道思倍司股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOTSPACE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓　威明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOW, UEI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴彥良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YEN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃信嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝煒勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種具電子式磁性開關之無線通訊膠囊感測器，係設有一電池、一微處理器及一作動模組，該電池透過一電子式磁性開關及一儲能元件電性連接該微處理器，該作動模組電連接該微處理器。該儲能元件利用該電池所輸出之小電流儲能，當該微處理器呈休眠狀態而該電子式磁性開關接收由外部所施加之磁場時，該電子式磁性開關輸出一個觸發訊號喚醒該微處理器，使該微處理器利用該儲能元件與該電池一同提供電能而驅動該作動模組進行生物訊號偵測或物理性治療之動作。當該微處理器呈工作狀態而該電子式磁性開關再次接收由外部所施加之磁場時，該電子式磁性開關再次輸出一個該觸發訊號，使該微處理器停止該作動模組作動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:無線通訊膠囊感測器</p>  
        <p type="p">130:電池</p>  
        <p type="p">131:儲能元件</p>  
        <p type="p">132:電子式磁性開關</p>  
        <p type="p">1320:觸發訊號</p>  
        <p type="p">140:微處理器</p>  
        <p type="p">142:天線</p>  
        <p type="p">143:無線傳輸電路</p>  
        <p type="p">15:作動模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="585" publication-number="202613953"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613953.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613953</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137127</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>理財配置建議系統</chinese-title>  
        <english-title>FINANCIAL ALLOCATION SUGGESTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250203B">G06Q40/06</main-classification>  
        <further-classification edition="202301120250203B">G06Q40/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兆豐國際商業銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEGA INTERNATIONAL COMMERCIAL BANK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張湘芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HSIANG-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了一種理財配置建議系統，包含輸入輸出裝置以及伺服器。輸入輸出裝置，配置以提供給使用者操作及控制。伺服器包含資產整合平台、風險分析模組以及獲利分析模組。資產整合平台配置以提供使用者透過輸入輸出裝置輸入其資產與負債以分析出當前現金流。風險分析模組配置以根據推薦商品的過去市場數據及預計投資部位進行分析，獲得未來孳息與風險資訊。獲利分析模組配置以將當前現金流與未來孳息整合成為預估現金流，以提供使用者了解當購買推薦商品後，使用者未來的整體收益與風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides a financial allocation suggestion system, including an input and output device and a server. The input and output device is configured to provide user operation and control. The server includes an asset integration platform, a risk analysis module and a profit analysis module. The asset integration platform is configured to provide the user to input assets and liabilities thereof through the input and output device to analyze a current cash flow. The risk analysis module is configured to analyze the past market data of a recommended product and an expected investment position to obtain a future interest and a risk information. The profit analysis module is configured to integrate the current cash flow and the future interest into an estimated cash flow to provide the user with an understanding of the user's overall future profits and risks after purchasing the recommended product.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:理財配置建議系統</p>  
        <p type="p">110:輸入輸出裝置</p>  
        <p type="p">120:伺服器</p>  
        <p type="p">121:資產整合平台</p>  
        <p type="p">122:風險分析模組</p>  
        <p type="p">123:獲利分析模組</p>  
        <p type="p">130:金融機構資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="586" publication-number="202613672"> 
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      <tif no="1" file="TIF/202613672.zip"/> 
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      <volno>24</volno>  
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        <document-id> 
          <doc-number>202613672</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137131</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>由布拉格繞射架構之雙聲光晶體調變器串接構成之外差光源</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241213B">G02F1/11</main-classification>  
        <further-classification edition="200601120241213B">G02B27/42</further-classification>  
        <further-classification edition="200601120241213B">G01B9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立虎尾科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, MING-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱櫂旌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHAO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳濟行</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關一種由布拉格繞射架構之雙聲光晶體調變器串接構成之外差光源，其包括第一聲光調變器、第二聲光調變器、雷射模組、波片及反射鏡。第二聲光調變器與第一聲光調變器並置。雷射模組用以發出雷射光。波片介置於第一聲光調變器與第二聲光調變器之間。反射鏡位於波片的下方；其中，雷射光以滿足布拉格繞射的條件下依序入射第一聲光調變器及第二聲光調變器。通過第一聲光調變器的+1階光經反射鏡反射後入射第二聲光調變器的直進光與通過第一聲光調變器的0階光入射第二聲光調變器產生的+1階光重合，以形成具頻差的第一組外差光源；通過第一聲光調變器的+1階光經第一反射鏡反射後入射第二聲光調變器產生的-1階光與通過第一聲光調變器的0階光經波片後入射該第二聲光調變器產生的0階光重合，以形成具頻差的第二組外差光源，藉由布拉格繞射架構的外差光源配置，而近似共光程架構，作為量測系統時穩定度較高，並可作為外差量測系統的光源，因而具有量測簡易、架構簡單、成本低廉以及在外差干涉量測相位時確實具有準確即時之效。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">10:第一聲光調變器</p>  
        <p type="p">20:第二聲光調變器</p>  
        <p type="p">30:雷射模組</p>  
        <p type="p">40:波片</p>  
        <p type="p">50:反射鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="587" publication-number="202613496"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613496.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202613496</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137132</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>全方位機車行車輔助裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">G01C21/26</main-classification>  
        <further-classification edition="200601120241230B">G01C21/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立虎尾科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊文河</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳玉林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王家觀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳濟行</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種全方位機車行車輔助裝置，其包括穿載裝置、輔助指示產生模組、物理訊號傳輸模組、多工訊號處理模組及物理訊號作用模組。輔助指示產生模組用以產生輔助指示訊息。多工訊號處理模組設於穿載裝置，並透過物理訊號傳輸模組接收輔助指示訊息，再解讀處理後產生相應指示模式的控制訊號。物理訊號作用模組設於穿載裝置，物理訊號作用模組包含用以產生光波物理訊號的燈號提示模組，光波物理訊號各自包含專屬顯示模式的光指示燈號，當燈號提示模組受到控制訊號觸發時，則產生專屬顯示模式的光指示燈號，光指示燈號包括分別用以指示左轉、左急轉、微靠左、繼續直行、迴轉、待轉、右轉、右急轉及微靠右的九個光指示燈號，俾能藉由全方位物理光波提示輔助的機能設置，而可於機車行車時以多種物理光波提示作為行車輔助指引，除了可以實現高靈敏與全方位導航輔助功能之外，並可效降低機車騎士因查看導航時注意力不集中所致的危險性。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">10:穿載裝置</p>  
        <p type="p">10a:手部護具</p>  
        <p type="p">30:物理訊號傳輸模組</p>  
        <p type="p">40:多工訊號處理模組</p>  
        <p type="p">41:供電模組</p>  
        <p type="p">50:物理訊號作用模組</p>  
        <p type="p">51:燈號提示模組</p>  
        <p type="p">510:第一發光元件</p>  
        <p type="p">511:第二發光元件</p>  
        <p type="p">512:第三發光元件</p>  
        <p type="p">513:第四發光元件</p>  
        <p type="p">514:第五發光元件</p>  
        <p type="p">515:第六發光元件</p>  
        <p type="p">516:第七發光元件</p>  
        <p type="p">52:振動式作用器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="588" publication-number="202613258"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613258.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202613258</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137134</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表面處理組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">C09G1/02</main-classification>  
        <further-classification edition="200601120250324B">C09K3/14</further-classification>  
        <further-classification edition="200601120250324B">C11D1/02</further-classification>  
        <further-classification edition="200601120250324B">C11D7/24</further-classification>  
        <further-classification edition="200601120250324B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商福吉米股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMI INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉野努</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINO, TSUTOMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木啓太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西海眞史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIUMI, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濵島将伍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAJIMA, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種表面處理組合物，其可於表面處理步驟中抑制研磨過之研磨對象物之研磨速度。 &lt;br/&gt;本發明係一種表面處理組合物，其係含有水溶性高分子及溶劑者，上述表面處理組合物用於使用研磨用組合物對研磨對象物進行研磨而獲得之研磨過之研磨對象物之表面處理中，上述表面處理於研磨粒之存在下進行，使用上述表面處理組合物並根據表面處理條件A進行表面處理時所獲得之排斥力為0.003 N/m以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="589" publication-number="202613678"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613678.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613678</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137136</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G02F1/1333</main-classification>  
        <further-classification edition="200601120250801B">H01Q1/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本顯示器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAPAN DISPLAY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳裕生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李銘祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡智閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIH-YUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUNG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何忠憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, CHUNG-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包含一顯示模組，及一設置於該顯示模組的背面側的框體。該框體與該顯示模組的背面共同界定出一容納空間，並形成有一與外界及該容納空間連通的開口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:顯示模組</p>  
        <p type="p">11:液晶面板</p>  
        <p type="p">12:背光單元</p>  
        <p type="p">13:控制單元</p>  
        <p type="p">131:軟性基板</p>  
        <p type="p">132:控制電路板</p>  
        <p type="p">14:防刮片</p>  
        <p type="p">2:框體</p>  
        <p type="p">20:容納空間</p>  
        <p type="p">21:外框部</p>  
        <p type="p">211:第一倒角</p>  
        <p type="p">22:凸起部</p>  
        <p type="p">221:第二倒角</p>  
        <p type="p">23:開口</p>  
        <p type="p">4:鐵氧體片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="590" publication-number="202613599"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613599.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613599</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137137</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>手機鏡頭保護貼</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120241022B">G02B1/10</main-classification>  
        <further-classification edition="200601120241022B">H05K5/02</further-classification>  
        <further-classification edition="200601120241022B">H05K7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橙艾創新股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGE I INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾賀捷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, HE-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明所提供之手機鏡頭保護貼，其係包括一隔部，係覆蓋於一外部之手機鏡頭的外表面上，得以將該手機鏡頭與外部環境相隔開來；其中，該隔部包括一玻璃基材、一第一增透層、一第二增透層及一三乙醯纖維素層，該玻璃基材具有彼此相背之一第一面及一第二面，且該第二面係朝向該手機鏡頭；該第一增透層設於該玻璃基材的該第一面上；該第二增透層設於該玻璃基材的該第二面上；該三乙醯纖維素層設於該第二增透層相背於該第二增透層與該玻璃基材彼此連接處的一側面上，並貼接或臨近於該手機鏡頭的外表面；其中，外部光源係依序經由該第一增透層、該玻璃基材、該第二增透層及該三乙醯纖維素層進入該手機鏡頭中，且該隔部的整體透光率為98%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">111:玻璃基材</p>  
        <p type="p">1111:第一面</p>  
        <p type="p">1112:第二面</p>  
        <p type="p">112:第一增透層</p>  
        <p type="p">113:第二增透層</p>  
        <p type="p">114:三乙醯纖維素層</p>  
        <p type="p">1211:第一框體</p>  
        <p type="p">122:環階部</p>  
        <p type="p">1231:第二框體</p>  
        <p type="p">12311:外露段</p>  
        <p type="p">12312:嵌合段</p>  
        <p type="p">124:環凹部</p>  
        <p type="p">13:第二黏著層</p>  
        <p type="p">14:第一黏著層</p>  
        <p type="p">H3:高度</p>  
        <p type="p">L1:第一預定距離</p>  
        <p type="p">L2:第二預定距離</p>  
        <p type="p">B1、B2、B3、B4、B5:厚度</p>  
        <p type="p">C:預定深度</p>  
        <p type="p">W1、W2、W3:寬度</p>  
        <p type="p">20:手機鏡頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="591" publication-number="202612667"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612667.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202612667</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137142</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸覺色彩通用系統</chinese-title>  
        <english-title>HAPTIC COLOR UNIVERSAL SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250613B">A61F9/08</main-classification>  
        <further-classification edition="200601120250613B">G09B21/00</further-classification>  
        <further-classification edition="200601120250613B">H01H13/85</further-classification>  
        <further-classification edition="200601120250613B">H01H13/83</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立中興大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHUNGHSING UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙欣怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAO, HSIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種觸覺色彩通用系統，包含複數個識別圖板。複數個識別圖板彼此並列，複數個識別圖板中的每一者具有一識別區域，且複數個識別圖板中的每一者包含至少一圓形圖塊、至少一直線圖塊及至少一波紋圖塊中的至少一者。至少一圓形圖塊、至少一直線圖塊及至少一波紋圖塊皆設置於識別區域中，至少一圓形圖塊代表一第一原色，至少一直線圖塊代表一第二原色，且至少一波紋圖塊代表一第三原色。藉此，透過本發明的觸覺色彩通用系統，可幫助視障者了解生活中的色彩，並具有優異的教育效果與相關產業的商業應用潛力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a haptic color universal system including a plurality of identified plates. The plurality of identified plates are disposed side by side. Each of the plurality of identified plates has an identified area, and each of the plurality of identified plates includes at least one of at least one circular piece, at least one linear piece and at least one wavy piece. All of the at least one circular piece, the at least one linear piece and the at least one wavy piece are disposed on the identified areas. The at least one circular piece represents a first primary color, the at least one linear piece represents a second primary color and the at least one wavy piece represents a third primary color. Therefore, the haptic color universal system of the present disclosure helps the visually impaired people understand the colors in life and has an excellent education effect as well as the potential for commercial application in related industries.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:觸覺色彩通用系統</p>  
        <p type="p">110:識別圖板</p>  
        <p type="p">111:識別區域</p>  
        <p type="p">112:圓形圖塊</p>  
        <p type="p">113:直線圖塊</p>  
        <p type="p">114:波紋圖塊</p>  
        <p type="p">120:色票元件</p>  
        <p type="p">121:顏色說明框</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="592" publication-number="202614685"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614685.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614685</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137147</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>柔性可伸縮線路板及其製備方法</chinese-title>  
        <english-title>FLEXIBLE RETRACTABLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241105B">H05K1/18</main-classification>  
        <further-classification edition="200601120241105B">H05K3/30</further-classification>  
        <further-classification edition="200601120241105B">H05K3/40</further-classification>  
        <further-classification edition="200601120241105B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商宏啟勝精密電子（秦皇島）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVARY HOLDING (SHENZHEN) CO., LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鵬鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種柔性可伸縮線路板及其製備方法。柔性可伸縮線路板包括第一線路基板和第二線路基板，第一線路基板包括在第一方向上疊設的第一基材層和第一線路層；第二線路基板設於第一線路基板的一側，第二線路基板包括在第一方向上疊設的第一彈性導體和第二基材層，第二基材層設於第一線路層背離第一基材層的一側，第一線路基板和第二線路基板之間具有第一鏤空區域，第一彈性導體部分顯露於第一鏤空區域中；柔性可伸縮線路板包括沿與第一方向垂直的第二方向依次設置的連接區和可伸縮區，第一彈性導體和第一鏤空區域位於可伸縮區內，第一彈性導體電連接所述連接區和可伸縮區。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flexible retractable circuit board and a method for manufacturing the same are provided. The flexible retractable circuit board includes a first circuit substrate and a second circuit substrate, wherein the first circuit substrate comprises a first substrate layer and a first circuit layer stacked in the first direction, the second circuit substrate is arranged on one side of the first circuit substrate, the second circuit substrate includes a first elastic conductor and a second substrate layer stacked in the first direction, the second substrate layer is arranged on one side of the first circuit layer that deviates from the first substrate layer, a first hollow area is provided between the first circuit substrate and the second circuit substrate, and the first elastic conductor is partially exposed in the first hollow area; The flexible retractable circuit board includes a connecting area and a retractable area that are sequentially arranged along the second direction perpendicular to the first direction, the first elastic conductor and the first hollow area are located in the retractable area, and the first elastic conductor electrically connects the connecting area and the retractable area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:第一基材層</p>  
        <p type="p">15:第一導電孔</p>  
        <p type="p">16:第一線路層</p>  
        <p type="p">17:第二線路層</p>  
        <p type="p">18:保護層</p>  
        <p type="p">1a:第一線路基板</p>  
        <p type="p">21:第二基材層</p>  
        <p type="p">23:第三線路層</p>  
        <p type="p">24:第一彈性導體</p>  
        <p type="p">25:第一補強片</p>  
        <p type="p">26:第一開槽</p>  
        <p type="p">27:第一粘結層</p>  
        <p type="p">2:第二線路基板</p>  
        <p type="p">31:第三基材層</p>  
        <p type="p">33:第四線路層</p>  
        <p type="p">34:第二彈性導體</p>  
        <p type="p">35:第二補強片</p>  
        <p type="p">36:第二開槽</p>  
        <p type="p">37:第二粘結層</p>  
        <p type="p">3:第三線路基板</p>  
        <p type="p">52:第三盲孔</p>  
        <p type="p">53:第二導電孔</p>  
        <p type="p">54:第三導電孔</p>  
        <p type="p">6:焊墊</p>  
        <p type="p">71:第一覆蓋層</p>  
        <p type="p">72:第二覆蓋層</p>  
        <p type="p">8:電子元件</p>  
        <p type="p">91:第一鏤空區域</p>  
        <p type="p">92:第二鏤空區域</p>  
        <p type="p">100:柔性可伸縮線路板</p>  
        <p type="p">100a:連接區</p>  
        <p type="p">100b:可伸縮區</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="593" publication-number="202613911"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613911.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613911</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137150</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人工智慧表單產生系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250203B">G06Q10/10</main-classification>  
        <further-classification edition="202301120250203B">G06Q10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊懌民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊懌民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種人工智慧表單產生系統，包含：一通訊介面，連線一用戶端電腦以接收一表單請求語句資訊；一資料庫，儲存一預設表單模板以及複數欄位項目；以及一處理單元，訊號連接該通訊介面與該資料庫，該處理單元包含一人工智慧語言模型與一表單產生模組，該人工智慧語言模型對該表單請求語句資訊進行語意分析而產生一語意分析結果，該表單產生模組根據該語意分析結果從該複數欄位項目中自動選擇多個欄位項目並載入該預設表單模板以產生一表單資訊，並將該表單資訊傳送至電腦進行顯示；該處理單元執行單一執行檔以實現該表單產生模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:人工智慧表單產生系統</p>  
        <p type="p">11:通訊介面</p>  
        <p type="p">12:資料庫</p>  
        <p type="p">120:預設表單模板</p>  
        <p type="p">121:欄位項目</p>  
        <p type="p">13:處理單元</p>  
        <p type="p">130:人工智慧語言模型</p>  
        <p type="p">131:表單產生模組</p>  
        <p type="p">14:儲存單元</p>  
        <p type="p">140:單一執行檔</p>  
        <p type="p">20:用戶端電腦</p>  
        <p type="p">30:電腦</p>  
        <p type="p">M:表單請求語句資訊</p>  
        <p type="p">R:語意分析結果</p>  
        <p type="p">F:表單資訊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="594" publication-number="202612648"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612648.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612648</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137151</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生物可植入裝置及其製造方法</chinese-title>  
        <english-title>BIO-IMPLANTABLE DEVICE AND FABRICATING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241105B">A61B5/24</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商慶鼎精密電子（淮安）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QINGDING PRECISION ELECTRONICS (HUAI'AN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鵬鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐菀翎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, WAN-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出一種生物可植入裝置及其製造方法。生物可植入裝置包含柔性線路板、感測器、彈性導電層、電極結構和彈性絕緣層。柔性線路板包含線路層。感測器設置於線路層上。彈性導電層覆蓋感測器。電極結構設置於彈性導電層上，且用於從生物收集電信號。電極結構經由彈性導電層電性連接感測器。彈性絕緣層覆蓋柔性線路板，並顯露電極結構和彈性導電層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bio-implantable device and a fabricating method of the same are provided. The bio-implantable device includes a flexible circuit board, a sensor, an elastic conductive layer, an electrode structure, and an elastic insulating layer. The flexible circuit board includes a wiring layer. The sensor is disposed on the wiring layer. The elastic conductive layer covers the sensor. The electrode structure is disposed on the elastic conductive layer and is used to collect an electric signal from a creature. The electrode structure is electrically connected to the sensor by the elastic conductive layer. The elastic insulating layer covers the flexible circuit board and exposes the electrode structure and the elastic conductive layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:生物可植入裝置</p>  
        <p type="p">200:柔性線路板</p>  
        <p type="p">211~213:線路層</p>  
        <p type="p">221,222:介電層</p>  
        <p type="p">230:導電結構</p>  
        <p type="p">241,242:覆蓋層</p>  
        <p type="p">310:感測器</p>  
        <p type="p">320:電極結構</p>  
        <p type="p">330:收發器</p>  
        <p type="p">331:射頻元件</p>  
        <p type="p">332:天線</p>  
        <p type="p">340:處理器</p>  
        <p type="p">350:電子元件</p>  
        <p type="p">410,420:彈性導電層</p>  
        <p type="p">500:導電黏合層</p>  
        <p type="p">600:彈性絕緣層</p> 
      </representative-img> 
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          <doc-number>113137152</doc-number> 
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      <invention-title> 
        <chinese-title>表面處理組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">C07D241/00</main-classification>  
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                <last-name>日商福吉米股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMI INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
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                <last-name>吉野努</last-name>  
                <first-name/> 
              </chinese-name>  
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                <last-name>YOSHINO, TSUTOMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
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                <last-name>鈴木啓太</last-name>  
                <first-name/> 
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                <last-name>SUZUKI, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
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                <last-name>西海眞史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIUMI, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
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                <last-name>濵島将伍</last-name>  
                <first-name/> 
              </chinese-name>  
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                <last-name>HAMAJIMA, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
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                <last-name>陳長文</last-name>  
                <first-name/> 
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      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種減少於表面處理步驟中產生之刮痕之方法。 &lt;br/&gt;本發明係一種表面處理組合物，其係含有水溶性高分子及溶劑者，上述表面處理組合物用於使用研磨用組合物對研磨對象物進行研磨而獲得之研磨過之研磨對象物之表面處理中，上述表面處理於研磨粒之存在下進行，使用上述表面處理組合物並根據表面處理條件A進行表面處理時所形成之含有上述水溶性高分子之保護膜之膜厚為0.5 nm以上。</p> 
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      <isu-abst lang="en"> 
        <p type="p"/> 
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      <representative-img> 
        <p type="p">無</p> 
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        <chinese-title>表面處理組合物</chinese-title>  
        <english-title/> 
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        <main-classification edition="200601120250324B">C07D241/00</main-classification>  
        <further-classification edition="201701120250324B">A61K47/58</further-classification>  
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        <further-classification edition="200601120250324B">H01L21/304</further-classification>  
        <further-classification edition="202301120250324B">H10K10/84</further-classification> 
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        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
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                <last-name>日商福吉米股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMI INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉野努</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINO, TSUTOMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
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                <last-name>鈴木啓太</last-name>  
                <first-name/> 
              </chinese-name>  
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                <last-name>SUZUKI, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
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                <last-name>西海眞史</last-name>  
                <first-name/> 
              </chinese-name>  
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                <last-name>NISHIUMI, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
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                <last-name>濵島将伍</last-name>  
                <first-name/> 
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              <english-name name-type="organization"> 
                <last-name>HAMAJIMA, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
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                <last-name>陳長文</last-name>  
                <first-name/> 
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        <p type="p">本發明提供一種減少於表面處理步驟中產生之刮痕之方法。 &lt;br/&gt;本發明係一種表面處理組合物，其係含有水溶性高分子及溶劑者，上述表面處理組合物用於使用研磨用組合物對研磨對象物進行研磨而獲得之研磨過之研磨對象物之表面處理中，上述表面處理於研磨粒之存在下進行，使用上述表面處理組合物並根據表面處理條件A進行表面處理時所形成之含有上述水溶性高分子之保護膜之黏性為2 eV以上。</p> 
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      <isu-abst lang="en"> 
        <p type="p"/> 
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      <representative-img> 
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        <chinese-title>表面處理組合物</chinese-title>  
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        <main-classification edition="200601120250324B">C07D241/00</main-classification>  
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                <first-name/> 
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                <last-name>FUJIMI INCORPORATED</last-name>  
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              </english-name>  
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              <english-country>JP</english-country> 
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                <last-name>吉野努</last-name>  
                <first-name/> 
              </chinese-name>  
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                <last-name>YOSHINO, TSUTOMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
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              <chinese-name name-type="organization"> 
                <last-name>鈴木啓太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西海眞史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIUMI, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濵島将伍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAJIMA, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
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          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種減少於表面處理步驟中產生之刮痕之方法。 &lt;br/&gt;本發明係一種表面處理組合物，其係含有水溶性高分子及溶劑者，上述表面處理組合物用於使用研磨用組合物對研磨對象物進行研磨而獲得之研磨過之研磨對象物之表面處理中，上述表面處理於研磨粒之存在下進行，使用上述表面處理組合物並根據表面處理條件A進行表面處理時所形成之含有上述水溶性高分子之保護膜之變形量為0.75 nm以下，含有上述水溶性高分子之保護膜之摩擦係數為1.9以上。</p> 
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      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
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    </description> 
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        </document-id> 
      </publication-reference>  
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        <document-id> 
          <doc-number>113137157</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>爬升式天幕結構及其使用方法</chinese-title>  
        <english-title/> 
      </invention-title>  
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        <main-classification edition="200601120241105B">E04H15/32</main-classification>  
        <further-classification edition="200601120241105B">E04H15/18</further-classification> 
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                <last-name>尤麒盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
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                <first-name/> 
              </chinese-name>  
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                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐治民</last-name>  
                <first-name/> 
              </chinese-name>  
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            </addressbook> 
          </agent> 
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        <p type="p">一種爬升式天幕結構，是在對角配置的角柱上配置有用於吊掛物料的吊運機，在角柱上端設有一平台；其中，該平台上設有一可以展開收合的頂棚；藉由電子控制裝置控制頂棚下端的滑輪組在平台上滑動，使得該頂棚提供該平台遮蔽之功能。</p> 
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      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:角柱</p>  
        <p type="p">11:吊點</p>  
        <p type="p">12:固定平台</p>  
        <p type="p">2:吊運機</p>  
        <p type="p">23:吊鏈</p>  
        <p type="p">3:平台</p>  
        <p type="p">31:框架</p>  
        <p type="p">32:連接鋼板</p>  
        <p type="p">33:軌道</p>  
        <p type="p">4:頂棚</p>  
        <p type="p">41:主支架</p>  
        <p type="p">42:棚布</p>  
        <p type="p">43:滑輪組</p>  
        <p type="p">44:副支架</p> 
      </representative-img> 
    </description> 
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      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137158</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有開關的電路板</chinese-title>  
        <english-title>CIRCUIT BOARD HAVING SWITCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">H05K1/02</main-classification> 
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          <applicant app-type="applicant" sequence="1"> 
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                <last-name>大陸商宏啟勝精密電子(秦皇島)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
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              <chinese-name name-type="organization"> 
                <last-name>大陸商鵬鼎控股(深圳)股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鵬鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李成佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHENG-JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有開關的電路板包括絕緣材料層、第一絕緣層、第二絕緣層、環形通道、第一保護層、惰性液體材料、第一導電塊、第二導電塊以及導電層。第一絕緣層位於絕緣材料層的下表面。第二絕緣層位於絕緣材料層的上表面。環形通道位於第一絕緣層、絕緣材料層以及第二絕緣層中，包括第一子通道、第二子通道、第一連接通道以及第二連接通道。第一保護層位於第一絕緣層的下表面。惰性液體材料位於環形通道之中。第一導電塊位於第一子通道之中。第二導電塊位於第二子通道之中。導電層位於絕緣材料層中且鄰近於環形通道。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit board having a switch includes an insulating material layer, a first insulating layer, a second insulating layer, a circular channel, a first cover layer, an inert liquid material, a first conductive block, a second conductive block and a conductive layer. The first insulating layer is on a bottom surface of the insulating material layer. The second insulating layer is on a top surface of the insulating material layer. The circular channel is in the first insulating layer, the insulating material layer and the second insulating layer, and includes a first sub channel, a second sub channel, a first connecting channel and a second connecting channel. The first cover layer is on a bottom surface of the first insulating layer. The inert liquid material is in the circular channel. The first conductive block is in the first sub channel. The second conductive block is in the second sub channel. The conductive layer is in the insulating material layer and adjacent to the circular channel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電路板</p>  
        <p type="p">110:絕緣材料層</p>  
        <p type="p">112、114、116、130P:部分</p>  
        <p type="p">120、130:絕緣層</p>  
        <p type="p">140、150:保護層</p>  
        <p type="p">142、152:材料層</p>  
        <p type="p">160:惰性液體材料</p>  
        <p type="p">170A、170B:導電層</p>  
        <p type="p">172、174、176、178:接觸點</p>  
        <p type="p">180:導電塊</p>  
        <p type="p">190、144、154:黏著層</p>  
        <p type="p">110A、110B、120A、120B、120C、120D、130A、130B、130C、130D:表面</p>  
        <p type="p">CH:環形通道</p>  
        <p type="p">SC1、SC2:子通道</p>  
        <p type="p">CC1、CC2:連接通道</p>  
        <p type="p">L1、L2:長度</p>  
        <p type="p">H1、H2:高度</p>  
        <p type="p">W1、W2、WS1、WS2:寬度</p>  
        <p type="p">OP1、OP2:開口</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="600" publication-number="202614101"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614101.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614101</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137159</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>平面式變壓器及其製造方法</chinese-title>  
        <english-title>PLANAR TRANSFORMER AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241127B">H01F27/28</main-classification>  
        <further-classification edition="200601120241127B">H01F30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商宏恆勝電子科技（淮安）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONGHENGSHEN ELECTRONICAL TECHNOLOGY(HUAI'AN)CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鵬鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾昭文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHAO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐薇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, WE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐攀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, PAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種平面式變壓器及其製造方法。平面式變壓器包括線圈組、隔熱層與磁芯柱。線圈組各自包括兩個線路基板、磁芯片與側面線路。線路基板各自包括介電層與線路層。介電層具有第一表面、相對於第一表面的第二表面以及一對側面。線路層設置於介電層每一個的第一表面。磁芯片夾置於兩個線路基板的第二表面之間。側面線路分別固設於這對側面。隔熱層設置於線圈組其中兩個之間。磁芯柱插設於線圈組與隔熱層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A planar transformer and a method of manufacturing the same are provided. The planar transformer includes a plurality of coil sets, a thermal insulating layer, and a plurality of magnetic pillars. The coil sets include two circuit boards, magnetic cores and side wirings apiece. The circuit boards include a dielectric layer and a circuit layer apiece. The dielectric layer has a first surface, a second surface opposite to the first surface and two sides. The circuit layer is placed on the first surface of each of the dielectric layers and opposite sides. The magnetic cores are sandwiched between the second surfaces of two circuit boards. The side wirings are fixed on opposite sides. The thermal insulating layer is placed between each two coil sets. The magnetic pillars are inserted the coil sets and the insulated layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:平面式變壓器</p>  
        <p type="p">110:線圈組</p>  
        <p type="p">120:線路基板</p>  
        <p type="p">125:接墊</p>  
        <p type="p">130:介電層</p>  
        <p type="p">140:第一表面</p>  
        <p type="p">145:線路層</p>  
        <p type="p">150:第二表面</p>  
        <p type="p">160:側面</p>  
        <p type="p">165:側面線路</p>  
        <p type="p">180:隔熱層</p>  
        <p type="p">190:磁芯柱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="601" publication-number="202613925"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613925.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613925</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137161</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>折價券營運系統</chinese-title>  
        <english-title>DISCOUNT COUPON OPERATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250203B">G06Q30/0207</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>軒陽科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORN SUN TECHNOLOGY CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>嘉義市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張萬子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WAN-ZEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種折價券營運系統，包含；一折價券管理平台，其具有一折價券產生器以及一折價券接收器，該折價券產生器可以依照需求提供特定數額的無記名之折價券，該折價券接收器可以接收消費折抵後的折價券；數折價券提供平台，可向該折價券管理平台取得特定數額的折價券；數消費者平台，可於消費後向該等折價券提供平台取得預定數額的該折價券；數折價券接受平台，可接收該等消費者平台所儲存之折價券作為消費折抵。所述消費者平台可透過不同的折價券提供平台取得折價券，並在不同的折價券接受平台使用，使消費者使用該折價券時無需記名或指定使用場所，該等折價券提供平台與折價券接收平台彼此之間為獨立不關聯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates a discount coupon operating system, including: a discount coupon management platform, which has a discount coupon generator and a discount coupon receiver. The discount coupon generator can provide a specific amount of unnamed coupons according to demand. The discount coupon receiver can receive discount coupons after consumption discounts; discount coupon providing platform can obtain a specific amount of discount coupons from the discount coupon management platform; consumer platforms can receive the discount coupons from the discount coupon providing platform after consumption. The discount coupon accepting platforms can receive the discount coupons stored in the consumer platforms as consumption discounts. The consumer platform can obtain discount coupons through different discount coupon providing platforms and use them on different discount coupon accepting platforms, so that consumers do not need to register or specify a place of use when using the discount coupons. The discount coupons providing platforms are consistent with the discount coupon receiving platforms are independent and not related to each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:折價券營運系統</p>  
        <p type="p">20:折價券管理平台</p>  
        <p type="p">21:折價券產生器</p>  
        <p type="p">22:折價券接收器</p>  
        <p type="p">23:註冊單元</p>  
        <p type="p">24:廣告產生器</p>  
        <p type="p">30:折價券提供平台</p>  
        <p type="p">31:掃描裝置</p>  
        <p type="p">40:消費者平台</p>  
        <p type="p">41:條碼</p>  
        <p type="p">42:掃描裝置</p>  
        <p type="p">50:折價券接受平台</p>  
        <p type="p">51:掃描裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="602" publication-number="202614681"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614681.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614681</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137162</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板組件及其製造方法</chinese-title>  
        <english-title>CIRCUIT BOARD ASSEMBLY AND FABRICATING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241030B">H05K1/11</main-classification>  
        <further-classification edition="200601120241030B">H05K3/46</further-classification>  
        <further-classification edition="200601120241030B">H05K3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商宏啟勝精密電子（秦皇島）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鵬鼎科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪佳慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIA-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉悅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林原宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭凌宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, LINGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出一種電路板組件及其製造方法。電路板組件包含線路板、裸晶粒和多個金屬引線。線路板包含線路層、介電層和容置槽。線路層具有多個引線接墊。介電層與線路層堆疊。容置槽自線路層延伸至介電層，並具有開口與底部。開口位於線路層，而底部位於介電層中。多個引線接墊鄰近容置槽。裸晶粒設置於容置槽內。多個金屬引線連接裸晶粒，且從容置槽延伸至多個引線接墊，以使裸晶粒及多個引線接墊電性連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit board assembly and a fabricating method of the same are provided. The circuit board assembly includes a wiring board, a die, and multiple metal leads. The wiring board includes a wiring layer, a dielectric layer and an accommodating slot. The wiring layer has multiple lead pads. The dielectric layer and the wiring layer are in stacks. The accommodating slot extends from the wiring layer to the dielectric layer, and has an opening and a bottom. The opening is located at the wiring, and the bottom is located in the dielectric layer. The lead pads are adjacent to the accommodating slot. The die is disposed in the accommodating slot. The metal leads are connected to the die and extend from the accommodating slot to the lead pads so that the die is electrically connected to lead pads.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電路板組件</p>  
        <p type="p">200:線路板</p>  
        <p type="p">211~220:線路層</p>  
        <p type="p">211a:引線接墊</p>  
        <p type="p">221~229:介電層</p>  
        <p type="p">231,232防焊層</p>  
        <p type="p">240:容置槽</p>  
        <p type="p">241:開口</p>  
        <p type="p">242:底部</p>  
        <p type="p">243:側壁</p>  
        <p type="p">300:裸晶粒</p>  
        <p type="p">310:頂面</p>  
        <p type="p">320:底面</p>  
        <p type="p">400:金屬引線</p>  
        <p type="p">500:散熱件</p>  
        <p type="p">600:導電連接結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="603" publication-number="202613894"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613894.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613894</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137163</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智能模型生成與互動系統</chinese-title>  
        <english-title>INTELLIGENT MODEL GENERATION AND INTERACTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250203B">G06N20/00</main-classification>  
        <further-classification edition="201901120250203B">G06F16/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國泰金融控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CATHAY FINANCIAL HOLDING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉明豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, MING-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧林俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, LIN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林柏亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PO-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林韻純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖銘宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, MING-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何美瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容關於一種智能模型生成與互動系統，係於伺服器內運行，包含：數據源管理模組，其包含數據字典、知識領域字典以及數據源模組；數據處理分析模組，其包含數據處理通道、儲存單元以及虛擬資料訪問層；機器學習開發模組，其包含數據採集管理模組、模型開發模組、模型評估模組、模型運行與維護模組和模型分析及再訓練模組；以及檢索增強生成模組，其包含提示工程模組、向量模組、檢索模組、大型語言模型管理模組和檢索與生成回饋模組。本揭示內容的智能模型生成與互動系統可與複數個大型語言模型通訊連接，依據使用者提供之待分析數據以及使用者查詢(user query)以分別產生模型及查詢結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein is an intelligent model generation and interaction system implemented and operated on a server. The present intelligent model generation and interaction system comprises: a data source management module including a data dictionary, a knowledge domain dictionary, and a data source module; a data processing and analysis module including a data processing pipeline, a storage unit, and a virtual data access layer; a machine learning operations (Ops) including a data acquisition management module, a model experiment module, a model evaluation module, a model deployment module, and a model output analytics retrain module; and a retrieval-augmented generation (RAG) Ops including a prompt engineering module, a vector module, a retrieval module, a large language model (LLM) management module, and an retrieval optimization module. The present intelligent model generation and interaction system is communicatively connected to a plurality of LLMs to generate models and query results based on the data to be analyzed provided by the user and the user's query.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:智能模型生成與互動系統</p>  
        <p type="p">11:數據源管理模組</p>  
        <p type="p">112:數據字典</p>  
        <p type="p">114:知識領域字典</p>  
        <p type="p">116:數據源模組</p>  
        <p type="p">13:數據處理分析模組</p>  
        <p type="p">132:數據處理通道</p>  
        <p type="p">134:儲存單元</p>  
        <p type="p">136:虛擬資料訪問層</p>  
        <p type="p">15:機器學習開發模組</p>  
        <p type="p">17:檢索增強生成模組</p>  
        <p type="p">A:共同數據模型</p>  
        <p type="p">L1:大型語言模型</p>  
        <p type="p">L2:大型語言模型</p>  
        <p type="p">L3:大型語言模型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="604" publication-number="202613839"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613839.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613839</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137164</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智能數據分析系統</chinese-title>  
        <english-title>INTELLIGENT DATA ANALYSIS SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250203B">G06F16/20</main-classification>  
        <further-classification edition="201901120250203B">G06F16/26</further-classification>  
        <further-classification edition="201901120250203B">G06F16/248</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國泰金融控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CATHAY FINANCIAL HOLDING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉明豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, MING-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧林俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, LIN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林柏亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PO-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林韻純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖銘宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, MING-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何美瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容關於一種智能數據分析系統，係於一伺服器內運行，用以對使用者之待分析數據提供圖表以及表格。所述系統包含數據源管理模組，其包含數據字典、知識領域字典以及數據源模組；數據處理分析模組，其包含數據處理通道、儲存單元以及虛擬資料訪問層；以及使用者互動模組，其包含探索式資料分析模組、對話式圖表生成模組、對話式結構化查詢語言生成模組以及筆記管理模組。可透過預先定義建構於儲存單元內的共同數據模型，依據來自使用者之對話式指令及待分析數據，分別以對話式圖表生成模組以及對話式結構化查詢語言生成模組來生成圖表和表格。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein is an intelligent data analysis system implemented and operated on a server to provide a user with visualized charts and tables for data analysis. The present intelligent data analysis system comprises, a data source management module including a data dictionary, a knowledge domain dictionary, and a data source module; a data processing and analysis module including a data processing pipeline, a storage unit, and a virtual data access layer; and a user interaction module including an exploratory data analysis (EDA) module, a chat chart generation module, a chat structured query language (SQL) generation module, and a note management module. According to the present disclosure, the visualized charts and tables are generated using the chat chart generation module and the SQL generation module, respectively, based on a predefined common data model (CDM) constructed in the storage unit and according to prompts and data provided by the user for analysis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:智能數據分析系統</p>  
        <p type="p">11:數據源管理模組</p>  
        <p type="p">112:數據字典</p>  
        <p type="p">114:知識領域字典</p>  
        <p type="p">116:數據源模組</p>  
        <p type="p">13:數據處理分析模組</p>  
        <p type="p">132:數據處理通道</p>  
        <p type="p">134:儲存單元</p>  
        <p type="p">136:虛擬資料訪問層</p>  
        <p type="p">15:使用者互動模組</p>  
        <p type="p">152:探索式資料分析模組</p>  
        <p type="p">154:對話式圖表生成模組</p>  
        <p type="p">156:對話式結構化查詢語言生成模組</p>  
        <p type="p">158:筆記管理模組</p>  
        <p type="p">A:共同數據模型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="605" publication-number="202613259"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613259.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613259</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137166</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表面處理組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250324B">C09G1/02</main-classification>  
        <further-classification edition="200601120250324B">C09K3/14</further-classification>  
        <further-classification edition="200601120250324B">C11D1/02</further-classification>  
        <further-classification edition="200601120250324B">C11D7/24</further-classification>  
        <further-classification edition="201001120250324B">G01Q60/26</further-classification>  
        <further-classification edition="200601120250324B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商福吉米股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMI INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉野努</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINO, TSUTOMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木啓太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西海眞史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIUMI, MASAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濵島将伍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAJIMA, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種表面處理組合物，其於表面處理步驟中，能夠於抑制研磨過之研磨對象物之研磨速度之同時，減小研磨過之研磨對象物之表面粗糙度。 &lt;br/&gt;本發明係一種表面處理組合物，其係含有水溶性高分子及溶劑者，上述表面處理組合物用於使用研磨用組合物對研磨對象物進行研磨而獲得之研磨過之研磨對象物之表面處理中，上述表面處理於研磨粒之存在下進行，使用上述表面處理組合物並根據表面處理條件A進行表面處理時所形成之含有上述水溶性高分子之保護膜之摩擦係數為1.9以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="606" publication-number="202614545"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614545.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614545</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137168</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>驅動電路、電壓轉換器及其控制方法</chinese-title>  
        <english-title>DRIVING CIRCUIT, VOLTAGE CONVERTER AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H02M1/08</main-classification>  
        <further-classification edition="200601120250203B">G05F1/565</further-classification>  
        <further-classification edition="202001120250203B">H03K19/1778</further-classification>  
        <further-classification edition="200601120250203B">H03K19/0185</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>能創半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWERX SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宗偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TSUNG WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岑嘉宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSEN, CHIA-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">驅動電路產生第一與第二控制訊號並將其等分別提至並聯的第一與第二功率半導體元件的各自控制電極。第一功率半導體元件的安全工作區的範圍大於第二功率半導體元件的安全工作區的範圍。驅動電路包括時間延遲電路、控制邏輯電路及緩衝器。時間延遲電路比較第二控制訊號的電壓位準與第一參考電壓或者比較第一功率半導體元件的汲極-源極電壓與第二參考電壓，且根據比較結果產生第一電壓。第一與第二參考電壓與第一與第二功率半導體元件的溫度相關聯。控制邏輯電路根據第一電壓來產生邏輯訊號。緩衝器根據邏輯訊號來產生第一或第二控制訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A driving circuit is provided for generating first and second control signals and providing them to respective control electrode of first and second power semiconductor elements coupled in parallel. A range of a safe operation area of the first power semiconductor element is larger than a range of a safe operation area of the second power semiconductor element. The driving circuit includes a time delay circuit, a control logic circuit and a buffer. The time delay circuit compares a voltage level of the second control signal with a first reference voltage or compares a drain-source voltage of the first power semiconductor element with a second reference voltage, and further generates a first voltage according to the comparison result. The first and second reference voltages are related to a temperature of the first and second power semiconductor elements. The control logic circuit generated a logic signal according to the first voltage. The buffer generates the first or second control signal according to the logic signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電壓轉換器</p>  
        <p type="p">100:驅動電路</p>  
        <p type="p">120,140,160,180:時間延遲電路</p>  
        <p type="p">122,162:溫度感測器</p>  
        <p type="p">220:控制邏輯電路</p>  
        <p type="p">BF:緩衝器</p>  
        <p type="p">Cout:輸出電容</p>  
        <p type="p">D1,D3:汲極</p>  
        <p type="p">G1,G2,G3,G4:閘極</p>  
        <p type="p">GND:接地</p>  
        <p type="p">L:電感</p>  
        <p type="p">NM1,NM2,NM3,NM4:功率半導體元件</p>  
        <p type="p">S1,S3:源極</p>  
        <p type="p">SG1,SG2,SG3,SG4:邏輯訊號</p>  
        <p type="p">SG10,SG20,SG30,SG40:控制訊號</p>  
        <p type="p">SPWM:脈衝寬度調變訊號</p>  
        <p type="p">VDD:系統電壓</p>  
        <p type="p">VG1,VG2,VG3,VG4:電壓</p>  
        <p type="p">VOUT:輸出電壓</p>  
        <p type="p">Vtemp1,Vtemp2:感測電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="607" publication-number="202614693"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614693.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614693</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137171</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板結構</chinese-title>  
        <english-title>CIRCUIT BOARD STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241101B">H05K3/46</main-classification>  
        <further-classification edition="200601120241101B">H05K3/00</further-classification>  
        <further-classification edition="200601120241101B">H01L23/538</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>先豐通訊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOARDTEK ELECTRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖中興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHUNG-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電路板結構包括第一多層板結構、第二多層板結構、導電支撐板、模芯結構、第一導電通孔結構以及第二導電通孔結構。第一多層板結構包括複數個第一線路層以及複數個第一絕緣層。第二多層板結構包括複數個第二線路層以及複數個第二絕緣層。導電支撐板位於第一多層板結構以及第二多層板結構之間。模芯結構位於第一多層板結構以及第二多層板結構之間。第一導電通孔結構自第一多層板結構的上表面延伸至第二多層板結構的所述第二線路層之一者。第二導電通孔結構自第二多層板結構的下表面向模芯結構延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit board structure includes a first multi-layer plate structure, a second multi-layer plate structure, a conductive support plate, a dummy core structure, a first conductive via structure and a second conductive via structure. The first multi-layer plate structure includes plural first wiring layers and plural first insulation layers. The second multi-layer plate structure includes plural second wiring layers and plural second insulation layers. The conductive support plate is between the first multi-layer plate structure and the second multi-layer plate structure. The dummy core structure is between the first multi-layer plate structure and the second multi-layer plate structure. The first conductive via structure extends form a top surface of the first multi-layer plate structure to one of the second wiring layers of the second multi-layer plate structure. The second conductive via structure extends from a bottom surface of the second multi-layer plate structure to the dummy core structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電路板結構</p>  
        <p type="p">110、120:多層板結構</p>  
        <p type="p">111、121:基材</p>  
        <p type="p">112、113、122、123:線路層</p>  
        <p type="p">116、117、126、127:外線路層</p>  
        <p type="p">114、115、124、125、900:絕緣層</p>  
        <p type="p">111A、111B、116A、121A、121B、127A:表面</p>  
        <p type="p">130:模芯結構</p>  
        <p type="p">132:芯板</p>  
        <p type="p">134:金屬層</p>  
        <p type="p">140:導電支撐板</p>  
        <p type="p">150、160、170:導電通孔結構</p>  
        <p type="p">180:保護層</p>  
        <p type="p">D1、D2:電子元件</p>  
        <p type="p">VH1、VH2:開孔</p>  
        <p type="p">R1、R2:區域</p>  
        <p type="p">OP:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="608" publication-number="202614687"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614687.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614687</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137172</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板</chinese-title>  
        <english-title>CIRCUIT BOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">H05K3/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>頎邦科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIPBOND TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王姵懿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PEI-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世川</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SHIH-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱建宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHIEN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張啟威</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電路板包含一載板、一線路層、一防焊層及至少一阻水層，該線路層設置於該載板，該防焊層覆蓋該線路層，並顯露出該線路層的複數個內接腳及複數個外接腳，該阻水層覆蓋該防焊層，使該線路層及該防焊層位於該載板與該阻水層之間，該阻水層可阻擋附著於該阻水層的液體或環境中水氣通過該阻水層，而滲透至該防焊層及該線路層，造成該線路層腐蝕或氧化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit board includes a substrate, a circuit layer, a solder resist layer and at least one moisture barrier layer. The circuit layer is provided on the substrate, the solder resist layer covers the circuit layer, except inner leads and outer leads of the circuit layer. The moisture barrier layer covers the solder resist layer such that the circuit layer and the soler resist layer are located between the substrate and the moisture barrier layer. Liquid adhered on the moisture barrier layer or moisture in environment cannot permeate through the solder resist layer and the circuit layer via the moisture barrier layer to cause corrosion or oxidation of the circuit layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電路板</p>  
        <p type="p">110:載板</p>  
        <p type="p">120:線路層</p>  
        <p type="p">130:防焊層</p>  
        <p type="p">140:第一阻水層</p>  
        <p type="p">150:第二阻水層</p>  
        <p type="p">160:第三阻水層</p>  
        <p type="p">161:投影</p>  
        <p type="p">170:黏著層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="609" publication-number="202614086"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614086.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614086</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137173</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像處理方法及電子裝置</chinese-title>  
        <english-title>IMAGE PROCESSING METHOD AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250203B">G16H30/40</main-classification>  
        <further-classification edition="200601120250203B">A61B1/00</further-classification>  
        <further-classification edition="201701120250203B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華碩電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUSTEK COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昱丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政大</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭露一種影像處理方法及電子裝置。電子裝置係執行影像處理方法。此影像處理方法包含：輸入一低解析度影像至一超解析度模型中；利用超解析度模型對低解析度影像進行一差值處理，以產生一第一中間影像；利用超解析度模型對低解析度影像進行一卷積激活處理，以產生一第二中間影像；以及對第一中間影像及第二中間影像進行相加運算，以產生一高解析度影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides an image processing method and an electronic device. The electronic device performs the image processing method. The image processing method includes: inputting a low-resolution image into a super-resolution model; using the super-resolution model to perform a interpolation process on the low-resolution image to generate a first intermediate image; using the super-resolution model to perform a convolution activation process on the low-resolution image to generate a second intermediate image; and performing an addition operation on the first intermediate image and the second intermediate image to generate a high-resolution image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S18:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="610" publication-number="202613422"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613422.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613422</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137174</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線性傳動模組</chinese-title>  
        <english-title>LINEAR TRANSMISSION MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">F16C29/00</main-classification>  
        <further-classification edition="200601120241230B">F16H57/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全球傳動科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TBI MOTION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李思穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SZU-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范鎧鏑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, KAI-TI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃政誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種線性傳動模組，包括滑塊本體、二端蓋及二防塵件。二端蓋分別設於滑塊本體相對之二端。各端蓋具有二組裝槽，沿一方向延伸貫穿端蓋。各組裝槽具有抵靠面、卡固部及組裝面，卡固部分別連接抵靠面及組裝面，抵靠面與組裝面為相對之表面。二防塵件，係沿一方向延伸，各防塵件其中之一端組裝於其中之一端蓋的組裝槽，各防塵件其中之另一端組裝於其中之另一端蓋的組裝槽。各防塵件具有防塵件本體、第一接觸部及第二接觸部。第一接觸部及第二接觸部分別位於防塵件本體相對二側，並分別凸出於該防塵件本體，且具有相對稱之形狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A linear transmission module includes a slider body, two end covers and two dust-proof components. The two end covers are respectively provided at two opposite ends of the slider body. Each end cover has two assembly grooves extending through the end cover in one direction. Each assembly groove has a resisting surface, a clamping portion and an assembly surface. The clamping portion is respectively connected to the resisting surface and the assembly surface, and the resisting surface and the assembly surface are opposite surfaces. The two dust-proof components extend in one direction. One end of each dust-proof component is assembled in the assembly groove of one of the end cover, and the other end of each dust-proof component is assembled in the assembly groove of the other end cover. Each dust-proof component has a dust-proof component body, a first contact part and a second contact part. The first contact portion and the second contact portion are respectively located on opposite sides of the dust-proof component body, protrude from the dust-proof component body respectively, and have relatively symmetrical shapes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:線性傳動模組</p>  
        <p type="p">110:滑塊本體</p>  
        <p type="p">111:軌道槽</p>  
        <p type="p">112A:滑塊本體內表面</p>  
        <p type="p">113:開口</p>  
        <p type="p">114A、114B:外保持器</p>  
        <p type="p">130:端蓋</p>  
        <p type="p">131、131A、131B、131C、131D:組裝槽</p>  
        <p type="p">132:穿槽</p>  
        <p type="p">133A、133B:端蓋內表面</p>  
        <p type="p">150、150A、150B、150X、150D:防塵件</p>  
        <p type="p">Z:第一方向</p>  
        <p type="p">X:第二方向</p>  
        <p type="p">Y:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="611" publication-number="202613776"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613776.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613776</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137177</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提升功率元件散熱效能的散熱結構及其電子負載裝置</chinese-title>  
        <english-title>HEAT DISSIPATION STRUCTURE FOR ENHANCING THE COOLING EFFICIENCY OF POWER COMPONENTS AND AN ELECTRONIC LOAD DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241213B">G06F1/20</main-classification>  
        <further-classification edition="200601120241213B">H01L23/367</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>致茂電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHROMA ATE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林靖雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHING-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃建興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIEN-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江曉菁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, HSIAO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾裕峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種提升功率元件散熱效能的散熱結構及其電子負載裝置，散熱結構包含：第一散熱元件及第一電路模組。第一散熱元件包括自第一安裝側凸伸的第一突起部。第一電路模組包括配置於第一安裝側的第一基板及配置於第一基板上的第一功率元件。其中第一基板包括供第一突起部伸入的第一通孔，以供第一突起部承頂第一功率元件的第一極性部。第一功率元件藉由第一突起部，與第一散熱元件之間形成第一熱傳導路徑。藉此，第一功率元件可透過第一熱傳導路徑提升散熱效能，進而讓電子負載裝置可適用於功率更高及/或更多的功率元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation structure for enhancing the cooling efficiency of power components and an electronic load device using the same, the heat dissipation structure comprising: a first heat dissipation element and a first circuit module. The first heat dissipation element includes a first protrusion extending from a first mounting side. The first circuit module includes a first substrate disposed on the first mounting side and a first power component disposed on the first substrate. The first substrate includes a first through-hole for the insertion of the first protrusion, allowing the first protrusion to support a first polarity portion of the first power component. A first heat conduction path is formed between the first power component and the first heat dissipation element via the first protrusion. Through this first heat conduction path, the cooling efficiency of the first power component is enhanced, thereby enabling the electronic load device to accommodate higher power components and/or to be configured with additional power components.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:第一散熱元件</p>  
        <p type="p">113:第一突起部</p>  
        <p type="p">120:第一電路模組</p>  
        <p type="p">121:第一基板</p>  
        <p type="p">1211:第一通孔</p>  
        <p type="p">123:第一功率元件</p>  
        <p type="p">1231:第一極性部</p>  
        <p type="p">1232:第二極性部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="612" publication-number="202614380"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614380.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614380</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137180</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝基板及其製作方法</chinese-title>  
        <english-title>PACKAGING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241113B">H01L23/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商禮鼎半導體科技秦皇島有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY QINHUANGDAO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商禮鼎半導體科技（深圳）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEADING INTERCONNECT SEMICONDUCTOR TECHNOLOGY (SHENZHEN) CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武佩成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種封裝基板及其製作方法，該製作方法包括：於第一基板的至少一表面上形成線路乾膜；於線路乾膜的側表面上形成與第一基板連接的第一線路層，第一線路層具有第一間隙和第二間隙，線路乾膜位於第一間隙；於第一線路層遠離第一基板的表面上壓合第二基板，第二基板的絕緣層延伸至第二間隙； 分板去除第一基板；去除線路乾膜，以露出第一間隙，從而得到封裝基板。該製作方法藉由線路乾膜作為支撐進行第一線路層的製作，能夠減小第一線路層的線寬和線距，實現密集線路的製作；且線路乾膜做支撐，可以改善細線路刮蹭造成的線路歪斜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A packaging substrate and a manufacturing method of the same. The manufacturing method includes: form a circuit dry film on at least one surface of a first substrate; Form a first circuit layer connected to the first substrate on the side surface of the circuit dry film, the first circuit layer having a first gap and a second gap, and the circuit dry film is located in the first gap; Press the second substrate onto the surface of the first circuit layer away from the first substrate, with the insulation layer of the second substrate extending to the second gap; Separate and remove the first substrate; Remove the dry film from the circuit to expose the first gap, thus obtaining the packaging substrate. This method uses dry film as a support for the first circuit layer, which can reduce the line width and spacing of the first circuit layer and achieve the production of dense circuits. The dry film of the circuit serves as support, which can improve the skewness of the circuit caused by scratching of the thin circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1-S5:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="613" publication-number="202614719"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614719.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614719</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137181</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱裝置及伺服器</chinese-title>  
        <english-title>HEAT DISSIPATION DEVICE AND SERVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">H05K7/20</main-classification>  
        <further-classification edition="200601120250901B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林培仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PEI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊馥綾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, FU-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種散熱裝置，包括複數第一導熱件、複數第二導熱件及兩個液冷件。複數第一導熱件沿第一方向間隔排佈。複數第二導熱件沿第一方向間隔排佈，複數第二導熱件分別與複數第一導熱件對應，第二導熱件分別與對應之第一導熱件沿第一方向之相對兩側貼合，相鄰之兩個第二導熱件之間沿第一方向限定出插槽，第二導熱件能夠沿第一方向發生彈性形變，以使記憶體可操作地擠入插槽內，並與第二導熱件緊密貼合。第一導熱件沿第二方向之兩端分別與兩個液冷件連接。上述散熱裝置能夠提高對記憶體之散熱效果，本創作一併提供一種包含該散熱裝置之伺服器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heat dissipation device comprises a plurality of first heat conductors, a plurality of second heat conductors and two liquid cooling components. A plurality of first heat conductors are arranged at intervals in the first direction. A plurality of second heat conductors are arranged at intervals in the first direction, a plurality of second heat conductors are corresponding to a plurality of first heat conductors, the second heat conductor is attached to the corresponding first heat conductor on opposite sides of the first direction, a slot is defined between the two adjacent second heat conductors in the first direction, and the second heat conductor is constructed to be able to undergo elastic deformation in the first direction. So that the memory can be operably squeezed into the slot and tightly fitted to the second heat conductor. A server containing the heat dissipation device is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:伺服器</p>  
        <p type="p">10:第一導熱件</p>  
        <p type="p">20:第二導熱件</p>  
        <p type="p">30:液冷件</p>  
        <p type="p">200:記憶體</p>  
        <p type="p">300:插接結構</p>  
        <p type="p">400:電路板</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="614" publication-number="202614337"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614337.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614337</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137182</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以提供均勻溫度分布的晶圓承載盤</chinese-title>  
        <english-title>WAFER HOLDER FOR PROVIDING EVEN TEMPERATURE DISTRIBUTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241029B">H01L21/683</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>天虹科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKYTECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俊富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHUN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭啟鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHI-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭耀璿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YAO-SYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉啟翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉國儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KUO-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易錦良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI, CHING-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱永豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種用以提供均勻溫度分布的晶圓承載盤，主要包括一支撐組件及一擴散單元，其中支撐組件包括至少一凹槽及一進氣管線。擴散單元由多孔性材料所製作，並設置在支撐組件的頂表面。擴散單元包括一本體、複數個凸起部及至少一擴散通道，其中凸起部及擴散通道設置在本體的一承載面上。擴散單元的凸起部用以承載一晶圓，其中支撐組件的進氣管線將一氣體輸送至凹槽，並經由凹槽輸送至擴散單元。氣體會經由擴散單元的孔隙傳輸至承載面及凸起部，並與擴散單元上晶圓的底部接觸，以調整晶圓的溫度，並有利於提高晶圓溫度分布的均勻度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to a wafer hoder for providing even temperature distribution, which mainly comprises a support assembly and a diffusion unit. The support assembly includes at least one recess and an inlet pipeline. The diffusion unit is made of a porous material and is disposed on a top surface of the support assembly. The diffusion unit includes a body, a plurality of protrusions, and at least one diffusion channel, wherein the protrusions and the diffusion channel are disposed on a carrying surface of the body. The protrusions of the diffusion unit are used to support a wafer, wherein the inlet pipeline of the support assembly transports a gas to the recess, and then through the recess to the diffusion unit. The gas is transmitted through the pores of the diffusion unit to the carrying surface and the protrusions, and comes into contact with the bottom of the wafer on the diffusion unit to adjust the temperature of the wafer, and is beneficial for improving the uniformity of the temperature distribution of the wafer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:晶圓承載盤</p>  
        <p type="p">11:支撐組件</p>  
        <p type="p">111:基座</p>  
        <p type="p">112:頂表面</p>  
        <p type="p">113:承載單元</p>  
        <p type="p">13:擴散單元</p>  
        <p type="p">131:本體</p>  
        <p type="p">133:凸起部</p>  
        <p type="p">135:擴散通道</p>  
        <p type="p">14:凹槽</p>  
        <p type="p">141:環形凹槽</p>  
        <p type="p">143:徑向凹槽</p>  
        <p type="p">15:進氣管線</p>  
        <p type="p">165:偏壓電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="615" publication-number="202613476"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613476.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613476</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137185</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>散熱裝置、散熱裝置的製造方法及電子設備</chinese-title>  
        <english-title>HEAT DEVICE, METHOD OF MANUFACTURING HEAT DEVICE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250904B">F28D5/00</main-classification>  
        <further-classification edition="200601120250904B">F28F3/02</further-classification>  
        <further-classification edition="200601120250904B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林培仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PEI-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊馥綾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, FU-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及散熱技術領域，提供散熱裝置、散熱裝置的製造方法及電子設備。其中，散熱裝置包括介質傳輸件、多個換熱單元和多個換熱件。介質傳輸件限定傳輸腔。多個換熱單元相互間隔地連接於介質傳輸件，換熱單元限定換熱腔，相鄰的兩個換熱單元之間限定收容空間，收容空間用於收容熱源件。多個換熱件一一設置於多個換熱腔內，多個換熱件均與介質傳輸件連接。在換熱單元處於第一狀態，換熱單元與熱源件相間隔，在換熱單元處於第二狀態，換熱單元與熱源件接觸並熱交換。本申請的有益效果是提高散熱裝置的換熱效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application relates to the field of heat dissipation technology and provides heat device, method of manufacturing heat device, and electronic devices. The heat device comprises a dielectric transfer member, a plurality of heat transfer units, and a plurality of heat transfer members. The dielectric transmission member defines a transmission cavity. A plurality of heat exchange units is spaced apart from each other and connected to the medium transfer member, the heat exchange units define the heat exchange cavity, and a holding space is defined between two adjacent heat exchange units, and the holding space is used to hold the heat source. A plurality of heat exchanger units is disposed one by one in the plurality of heat exchanger cavities, and the plurality of heat exchanger units are connected to the medium transfer member. In a first state of the heat transfer unit, the heat transfer unit is separated from the heat source, and in a second state of the heat transfer unit, the heat transfer unit is in contact with the heat source and exchanges heat. Beneficial effect of this application is to improve the heat exchange efficiency of the heat device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">24:頂壁</p>  
        <p type="p">25:第一側壁</p>  
        <p type="p">26:底壁</p>  
        <p type="p">27:第二側壁</p>  
        <p type="p">30:換熱件</p>  
        <p type="p">40:相變介質</p>  
        <p type="p">Q1:換熱腔</p>  
        <p type="p">Q2:收容空間</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Z:第三方向</p>  
        <p type="p">C1:插槽</p>  
        <p type="p">201:熱源件</p>  
        <p type="p">2011:基板</p>  
        <p type="p">2012:記憶體芯片</p>  
        <p type="p">202:電路板</p>  
        <p type="p">2031:插接部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="616" publication-number="202613659"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613659.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613659</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137186</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>調製模塊、光調製器件以及光學裝置</chinese-title>  
        <english-title>MODULATION MODULES, OPTICAL MODULATOR COMPONENTS AND OPTICAL DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">G02B26/06</main-classification>  
        <further-classification edition="200601120241104B">G02B26/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游宇豐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, YU-FONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種調製模塊，用於光調製器件，包括基板以及調製介面。所述調製介面形成於所述基板一側表面，每個所述調製介面用於接收入射光，所述調製介面用於改變所述入射光的相位和/或偏振方向。其中，所述調製介面包括複數調製區，每一所述調製區用於改變所述入射光的相位和/或偏振方向的程度相同/不同。本申請還提供一種應用上述調製模塊的光調製器件以及一種應用上述光調製器件的光學裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a modulation module. The modulation module is used by an optical modulator component. The modulation module includes a substrate and a modulation interface. The modulation interface is formed on one side surface of the substrate. Each of the modulation interface is used to receive incident light. The modulation interface is used to change the phase and/or polarization direction of the incident light. The modulation interface comprises a plurality of modulation regions. Each of the modulation regions is used to alter the phase and/or polarization direction of the incident light to the same/different degree. The present disclosure also provides an optical modulator component applying the modulation module and an optical device applying the optical modulator component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光調製器件</p>  
        <p type="p">1:調製模塊</p>  
        <p type="p">2:調製界面</p>  
        <p type="p">13:奈米結構</p>  
        <p type="p">3:基板</p>  
        <p type="p">LR:入射光</p>  
        <p type="p">LT:透射光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="617" publication-number="202612674"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612674.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612674</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137189</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顆粒藥品定量取用裝置</chinese-title>  
        <english-title>GRANULAR MEDICATION DOSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241031B">A61J1/03</main-classification>  
        <further-classification edition="200601120241031B">B65D83/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃郁婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顆粒藥品定量取用裝置，包含有：一本體，該本體內部安裝有一可活動之藥物供給管，該藥物供給管的內部設有一限位通道，該藥物供給管一端設有一投藥口，相對該投藥口的一側設有一供給口，該藥物供給管在底端外側環設一漸縮部，並在該漸縮部套設有一彈簧，該藥物供給管透過彈簧對漸縮部束緊功能，按壓該藥物供給管相對於該本體線性活動，使得該藥物供給管內存放的藥物從供給口逐一押出，達到給藥定量之功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A granular medication dosing device includes: a main body, within which a movable medication supply tube is installed. The interior of the medication supply tube is equipped with a limiting channel. One end of the medication supply tube is designed with a medication dispensing port, while the side opposite to this dispensing port is equipped with a supply port. The outer circumference near the bottom end of the medication supply tube is fitted with a tapered section, over which a spring is installed. The spring compresses the tapered section, and by pressing the medication supply tube, it moves linearly relative to the main body, causing the medication stored inside the supply tube to be dispensed one by one through the supply port, achieving the function of precise dosage administration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:本體</p>  
        <p type="p">20:藥物供給管</p>  
        <p type="p">21:限位通道</p>  
        <p type="p">22:投藥口</p>  
        <p type="p">23:供給口</p>  
        <p type="p">24:漸縮部</p>  
        <p type="p">25:彈簧</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="618" publication-number="202613980"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613980.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613980</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137190</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>臉部監控系統</chinese-title>  
        <english-title>A FACIAL MONITORING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250203B">G06V40/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江昭龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHAO-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種臉部監控系統，包含有一影像擷取模組，用以拍攝或擷取被攝者的臉部特徵，並同時生成該被攝者的一臉部參數，並將該臉部參數儲存於一資料庫模組；一語音辨識模組，用以接收或擷取被攝者的語音，並同時生成該被攝者的一語音參數，並將該語音參數儲存於該資料庫模組；一人工智慧處理模組，用以分析該語音參數的字義，並從該資料庫模組讀取相對應的一語音回覆參數，且該人工智慧處理模組再將以最新拍攝日期的臉部參數與其他拍攝日期的臉部參數相互比對，進而產生出一臉部分析報告參數；藉由上述結構，本發明使用影像擷取、語音辨識與人工智慧處理模組的技術，能夠對臉部特徵與語音進行數據分析，並生成情感分析、身份識別與健康狀況等報告。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A facial monitoring system, comprising an image capturing module used to photograph or capture the facial features of a subject, while simultaneously generating facial parameters of the subject, and storing the facial parameters in a database module; a voice recognition module, used to receive or capture the subject’s voice, while simultaneously generating the subject’s voice parameters, and storing the voice parameters in the database module; an artificial intelligence processing module, used to analyze the meaning of the voice parameters, retrieve corresponding voice response parameters from the database module, and compare the latest captured facial parameters with those from other capture dates, thus generating a facial analysis report. Through the aforementioned structure, this invention utilizes technologies in image capturing, voice recognition, and artificial intelligence processing modules to analyze facial features and voice data, generating reports on emotion analysis, identity recognition, and health status.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:臉部監控系統</p>  
        <p type="p">10:影像擷取模組</p>  
        <p type="p">11:臉部參數</p>  
        <p type="p">12:深度感測裝置</p>  
        <p type="p">20:資料庫模組</p>  
        <p type="p">30:語音辨識模組</p>  
        <p type="p">31:語音參數</p>  
        <p type="p">32:語音情感分析單元</p>  
        <p type="p">40:人工智慧處理模組</p>  
        <p type="p">41:語音回覆參數</p>  
        <p type="p">42:臉部分析報告參數</p>  
        <p type="p">43:照片回覆參數</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="619" publication-number="202612668"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612668.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612668</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137191</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高位落差調整階梯超音波感測器</chinese-title>  
        <english-title>HIGH-DROP ADJUSTMENT STEP ULTRASONIC SENSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">A61G3/06</main-classification>  
        <further-classification edition="200601120241104B">B60N5/00</further-classification>  
        <further-classification edition="200601120241104B">G01S15/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江昭龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHAO-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種高位落差調整階梯超音波感測器，包含有：一處理器、一與該處理器連線之超音波感測器，以及一斜坡板裝置，該超音波感測器係安裝於車門底部，並且該超音波感測器射出的角度固定當大客車停靠時，由駕駛開啟車門，該超音波感測器同時被啟動，該超音波感測器對前方地面射出超音波經過反射後，接收到反彈回來的超音波，使該處理器接收到車門與地面之間的距離，此時，該處理器即可透過已知的角度與距離而運算出高度，接著，該處理器即發送一訊息給該斜坡板裝置，使該斜坡板裝置推出運用行走之板體，藉此，減少車門與地面之間的高度落差，降低乘客誤判高度而造成跌落受傷的事件發生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A high-drop adjustment step ultrasonic sensor includes: a processor, an ultrasonic sensor connected to the processor, and a ramp plate device. The ultrasonic sensor is installed at the bottom of a vehicle door, with a fixed shooting angle. When a large bus stops and the driver opens the door, the ultrasonic sensor is simultaneously activated. The sensor emits ultrasonic waves towards the ground in front, which reflect back and are received by the sensor, allowing the processor to determine the distance between the door and the ground. Using the known angle and distance, the processor calculates the height. It then sends a signal to the ramp plate device, which extends a walking board to reduce the height difference between the door and the ground, minimizing the risk of passengers misjudging the height and falling, thus preventing injury.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:大客車</p>  
        <p type="p">101:車門</p>  
        <p type="p">1:處理器</p>  
        <p type="p">2:超音波感測器</p>  
        <p type="p">3:斜坡板裝置</p>  
        <p type="p">31:板體</p>  
        <p type="p">32:驅動器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="620" publication-number="202612874"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612874.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612874</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137192</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具採摘水果功能之機械手臂末端效應器</chinese-title>  
        <english-title>ROBOTIC ARM END EFFECTOR WITH FRUIT PICKING FUNCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241104B">B25J19/02</main-classification>  
        <further-classification edition="200601120241104B">B25J13/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王得安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, DER-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具採摘水果功能之機械手臂末端效應器，在一機械手臂的末端設有可拆卸或組合之一末端效應器，該末端效應器包含有一連動套件、一視覺裝置、多個壓力感測器與一迴轉式刀具所構成；透過視覺裝置辨識水果能否採收，若能夠採收，則使用機械手臂夾取水果，由視覺裝置追蹤水果位置，接著根據水果外型適當展開連動套件寬度與距離夾持水果，而連動套件上有壓力感測器偵測有無夾持水果，接著利用末端效應器切斷水果梗；據此，透過本發明的結構，能讓機械手臂獨力完成工作，大幅增進使用效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The Robotic arm end effector with fruit picking function, there is a detachable or combined end effector at the end of a robotic arm. The end effector includes a linkage kit, a vision device, multiple pressure sensors and a rotary tool; through vision The device identifies whether the fruit can be harvested. If it can be harvested, a robotic arm is used to pick the fruit, and the visual device tracks the position of the fruit. Then, the linkage kit is appropriately expanded according to the shape of the fruit, with a width and distance to clamp the fruit. There is a pressure sensor to detect whether the fruit is clamped, and then the end effector is used to cut off the fruit stem. Accordingly, through the structure of the present invention, the robot arm can complete the work independently, greatly improving the efficiency of use.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">23:夾爪</p>  
        <p type="p">25:支點</p>  
        <p type="p">40:末端效應器</p>  
        <p type="p">41:連動套件</p>  
        <p type="p">411:活動桿</p>  
        <p type="p">42:視覺裝置</p>  
        <p type="p">43:壓力感測器</p>  
        <p type="p">44:迴轉式刀具</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="621" publication-number="202613390"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613390.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613390</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137193</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智慧型水泥抹地機構</chinese-title>  
        <english-title>SMART PLASTER THE CEMENT FLOOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241210B">E04F21/06</main-classification>  
        <further-classification edition="200601120241210B">E04F21/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南開科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN KAI UNIVERSITY OF TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>南投縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王得安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, DER-AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種智慧型水泥抹地機構，包含有驅動模組，驅動模組上方設有控制平台，前述控制平台上設置視覺檢測模組，且視覺檢測模組與驅動系統處理器連線，達成抹地作業自動行走目的；控制平台的一端組合有一能多角度彎折機器臂，該機械臂多個關節部，藉此達到抹地作業來回擺動外，能根據地面狀態適當抹平之效果，前述的機械臂遠離控制平台的一端設置有可轉動的抹地裝置，控制平台下端則設有多個感測器，感測器能測定地面水泥的高(厚)度，並確保機械臂與抹地裝置在進行抹地作業時，有無保持地面的平面度與水平度，據此，藉由上述結構協助施工人員減少工作量，並達到抹地品質良好之功效。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The Smart Plaster the cement floor device, It includes a drive module, and a control platform is provided above the drive module. A visual detection module is set on the control platform, and the visual detection module is connected to the drive system processor to achieve the purpose of automatic mopping operation; one end of the control platform It is combined with a robotic arm that can be bent at multiple angles. The robotic arm has multiple joints, thereby achieving the effect of swinging back and forth during mopping operations, and can appropriately smooth the ground according to the state of the ground. The end of the aforementioned robotic arm away from the control platform is provided with an adjustable The rotating mopping device has multiple sensors at the lower end of the control platform. The sensors can measure the height (thickness) of the cement on the ground and ensure that the robot arm and mopping device are maintained properly during the mopping operation. According to the flatness and levelness of the ground, the above structure can help construction workers reduce their workload and achieve good mopping quality.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:驅動模組</p>  
        <p type="p">11:履帶模組</p>  
        <p type="p">20:控制平台</p>  
        <p type="p">21:送漿口</p>  
        <p type="p">23:滑槽</p>  
        <p type="p">30:視覺檢測模組</p>  
        <p type="p">40:驅動系統處理器</p>  
        <p type="p">50:機械臂</p>  
        <p type="p">51、52:關節部</p>  
        <p type="p">54:線性滑動裝置</p>  
        <p type="p">60:抹地裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="622" publication-number="202612779"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612779.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612779</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137201</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>免工具全戶型過濾器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B01D61/08</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溢泰實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>屏東縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林勝男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHENG NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林輝洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種免工具全戶行型過濾器，其包含其包含一濾蓋組件、一濾瓶組件、一連結裝置，濾蓋組件二端設有與水路流道相通之進、出水孔道，上端設有一與水路流道連結之切換件，用以供切換水路流道，濾瓶組件容設一濾芯與&lt;img align="absmiddle" height="25px" width="41px" file="d10009.TIF" alt="其他非圖式ed10009.png" img-content="character" orientation="portrait" inline="no" giffile="ed10009.png"/&gt;濾蓋組件下端對應套設，連結裝置設置於濾蓋組件與濾瓶組件對應接合處，係設有一體連結具樞紐承座及環形束帶之束結件，於樞紐承座內側樞設一轉輪機構及於外側套設一與轉輪機構連動之轉動件，以及設有一繞設於束結件之環形束帶與樞紐承座內側，並且與轉輪機構連結之拉引件，利用操作連結裝置之轉動件轉動帶動轉輪機構牽引拉引件控制束結件對過濾器形成扣合定位或脫離卡掣鬆退，使形成一免工具及便利性高與供快速拆裝之過濾器。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">100:過濾器</p>  
        <p type="p">20:濾蓋組件</p>  
        <p type="p">22:洩壓閥</p>  
        <p type="p">25:切換件</p>  
        <p type="p">213:進水接頭</p>  
        <p type="p">214:出水接頭</p>  
        <p type="p">30:濾瓶組件</p>  
        <p type="p">321:流道通孔</p>  
        <p type="p">40:連結裝置</p>  
        <p type="p">41:束結件</p>  
        <p type="p">411:環形束帶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="623" publication-number="202613513"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613513.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613513</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137627</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢測物件結構狀態的方法及檢測系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR DETECTING STRUCTURAL CONDITION OF OBJECT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250902B">G01M13/00</main-classification>  
        <further-classification edition="200601120250902B">G01D21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子國際（新加坡）私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納塔拉詹　薇笛雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATARAJAN, VIDHYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪慈憶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, TZU-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, QING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案為一種檢測物件結構狀態的方法與系統，系統檢測物件，且包含訊號產生裝置、感測器及處理器，訊號產生裝置提供觸發訊號，感測器透過物件接收觸發訊號，方法包含:(S1)於起始狀態時，處理器將感測器的感測結果處理成起始時域及頻域資料；(S2)於檢測狀態中，感測器檢測觸發訊號；(S3)處理器將檢測狀態中感測器輸出的感測結果處理成檢測時域及頻域資料；(S4)處理器比較檢測與起始時域資料，以計算第一差異分數，且比較檢測與起始頻域資料，以計算第二差異分數；(S5) 處理器判斷第一比較結果滿足第一條件且第二比較結果符合第二條件時，輸出警告訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A detection method and a detection system are provided for detecting structural condition of an object. The detection system detects an object and includes a signal generation device, a sensor and a processor. The signal generation device issues a trigger signal. The sensor receives the trigger signal through the object and outputs a sensing result. The detection method includes the following steps. In Step S1, in an initial state, the sensing result from the sensor is processed into an initial time domain data and an initial frequency domain data by the processor. In Step S2, the trigger signal is detected by the sensor. In Step S3, the sensing result is processed into a detection time domain data and a detection frequency domain data by the processor in the detection state. In Step S4, the processor obtains a first difference score by comparing the detection time domain data with the corresponding initial time domain data, and obtains a second difference score by comparing the detection frequency domain data with the corresponding initial frequency domain data. In Step S5, when the first comparing result satisfies the first condition and the second comparing result satisfies the second condition, the processor issues a warning signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S5:檢測方法</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="624" publication-number="202613902"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613902.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613902</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137699</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配送袋回收方法及其系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR RECOVERING DELIVERY BAG</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250203B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250203B">G06Q30/06</further-classification>  
        <further-classification edition="200601120250203B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李大明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DA MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林英洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, YOUNG SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張如然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, JOO RAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏昌訓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HA, CHANG HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙妍靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YEON JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金都號</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DO HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李韶熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SO HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳正禹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, JIN WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金敏素</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MIN SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安道賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, DO HYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宋敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SONG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許永南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEO, YOUNG NAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裴浩延</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, HO YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係有關於一種配送袋回收方法及其系統。根據本揭露一實施例的配送袋回收方法可以包括如下步驟：接收與配送袋回收相關的事件的發生資訊；和使用該事件的發生資訊生成用於回收與該事件相關的目標配送袋的回收計畫，生成該回收計畫的步驟包括如下步驟：確定表示將執行該目標配送袋的回收作業的時間區間的時間窗口（Time Window）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a method and system for recovering a delivery bag. The method for recovering a delivery bag may include receiving occurrence information of an event related to recovery of a delivery bag, and generating a recovery plan for recovery of a target delivery bag associated with the event using the occurrence information of the event, wherein the generating of the recovery plan may include determining a time window indicating a time section in which a recovery work for the target delivery bag is to be performed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S200、S300:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="625" publication-number="202613938"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613938.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613938</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137700</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>產生商品套組資訊之方法、電子裝置及記錄媒體</chinese-title>  
        <english-title>METHOD, ELECTRONIC DEVICE AND RECORDING MEDIUM FOR GENERATING PRODUCT SET INFORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">G06Q30/0601</main-classification>  
        <further-classification edition="202301120250303B">G06Q30/0251</further-classification>  
        <further-classification edition="202301120250303B">G06Q30/0241</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹英道</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN, YOUNGDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李在瑛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JAEYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之方法可包括如下步驟：於電子商務平台中銷售之商品中確定商品套組所包括之兩個以上之商品；基於與第1商品對應之第1商品資訊及與第2商品對應之第2商品資訊，動態地產生與商品套組對應之商品套組資訊；及將所產生之商品套組資訊傳輸至連接於電子商務平台之終端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:伺服器</p>  
        <p type="p">120:終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="626" publication-number="202613816"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613816.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613816</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137706</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以管理記憶體資源之裝置、方法及記錄媒體</chinese-title>  
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM FOR MANAGING MEMORY RESOURCES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G06F11/30</main-classification>  
        <further-classification edition="201601120250801B">G06F12/126</further-classification>  
        <further-classification edition="202301120250801B">G06Q30/0601</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉瀚然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HANRAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種用以管理記憶體資源之電子裝置。本發明之一實施例之電子裝置可包括：一個以上之處理器；及一個以上之記憶體，其儲存有用以藉由上述一個以上之處理器而執行之命令；且上述電子裝置可以如下方式構成：於執行上述命令時，上述一個以上之處理器如下：自用戶終端接收用以提供電子商務服務之應用程式之執行請求，基於接收到上述執行請求，將用以管理與上述應用程式相關之記憶體資源之目標程式傳輸至上述用戶終端；上述目標程式可包括如下資訊：使得監控與上述應用程式相關之記憶體資源之使用，並基於作為上述監控之結果所收集到之資料，算出於預設之時間段內上述用戶終端中發生上述應用程式之記憶體資源極限終止之次數，於上述算出之發生次數超過臨界次數之情形時，對上述應用程式執行與上述用戶終端對應之記憶體資源管理策略。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310:動作</p>  
        <p type="p">S320:動作</p>  
        <p type="p">S330:動作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="627" publication-number="202613808"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613808.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613808</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137797</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以驗證目標ＡＰＩ之裝置、方法及記錄有命令之記錄媒體</chinese-title>  
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM STORING INSTRUCTION FOR TESTING TARGET API</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250303B">G06F9/44</main-classification>  
        <further-classification edition="202501120250303B">G06F11/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉應玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUI, YINGLING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種裝置，其包括：一個以上之處理器；及一個以上之記憶體，其等儲存有用以藉由上述一個以上之處理器而執行之命令；上述裝置以如下方式構成，即，於執行上述命令時，上述一個以上之處理器如下：獲得請求驗證目標API是否存在錯誤之第1請求，上述第1請求包括指示動態資料類型之第1資訊、及用以確定模擬資料之第2資訊；基於上述第1資訊，於一個以上之驗證案例中確定屬於上述動態資料類型之至少一個目標驗證案例；基於上述第2資訊，確定用以執行上述目標API之目標模擬資料；基於上述至少一個目標驗證案例及上述目標模擬資料，執行上述目標API而產生指示上述目標API是否存在錯誤之驗證結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">110:裝置</p>  
        <p type="p">120:用戶之終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="628" publication-number="202614585"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614585.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614585</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113137834</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於雙平行調製架構的光調製器及光傳輸系統</chinese-title>  
        <english-title>OPTICAL MODULATOR AND OPTICAL TRANSMISSION SYSTEM BASED ON DUAL PARALLEL MODULATION ARCHITECTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120241204B">H04B10/516</main-classification>  
        <further-classification edition="201301120241204B">H04B10/548</further-classification>  
        <further-classification edition="200601120241204B">G02B6/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商寧波環球廣電科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBAL TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯偉康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, WEIKANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃起坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, QIKUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光調製器及光傳輸系統，所述光調製器包含一第一/第二主要光波導、一第一/第二熱電極、兩射頻訊號通道及兩接地通道。第一及第二主要光波導各包含一輸入段、一前調製段及一後調製段，所述前調製段包含兩分支光波導，第一輸入段與第二輸入段光耦合，且第一後調製段與第二後調製段光耦合。第一熱電極設置於兩第一分支光波導之一者。第二熱電極，設置於兩第二分支光波導之一者。兩射頻訊號通道分別設置於第一後調製段的一側及第二後調製段的一側。兩接地通道分別設置於第一後調製段的另一側及第二後調製段的另一側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical modulator and optical transmission system. The optical modulator includes a first/second main optical waveguide, a first/second thermal electrode, two radio frequency signal channels and two ground channels. Each of the first and second main optical waveguides includes an input section, a pre-modulation section and a post-modulation section, the pre-modulation section includes two branch optical waveguides, the first input section is optically coupled to the second input section, and the first post-modulation section is optically coupled to a second post-modulation section. The first thermal electrode is disposed at one of the two first branch optical waveguides. The second thermal electrode is disposed at one of the two second branch optical waveguides. The two radio frequency signal channels are respectively disposed on one side of the first post-modulation section and on one side of the second post-modulation section. The two ground channels are respectively disposed on the other side of the first post-modulation section and the other side of the second post-modulation section.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光傳輸系統</p>  
        <p type="p">10:光調製器</p>  
        <p type="p">1011:第一輸入段</p>  
        <p type="p">1012:第二輸入段</p>  
        <p type="p">1021,1023:第一分支光波導</p>  
        <p type="p">1022,1024:第二分支光波導</p>  
        <p type="p">1031:第一後調製段</p>  
        <p type="p">1032:第二後調製段</p>  
        <p type="p">1041:第一熱電極</p>  
        <p type="p">1042:第二熱電極</p>  
        <p type="p">1051,1052:射頻訊號通道</p>  
        <p type="p">1061,1062,1063:接地通道</p>  
        <p type="p">1071:第三熱電極</p>  
        <p type="p">1072:第四熱電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="629" publication-number="202613846"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613846.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613846</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113138089</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>訂單優化方法和系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR ORDER OPTIMIZATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250207B">G06F17/15</main-classification>  
        <further-classification edition="202001120250207B">G06F30/27</further-classification>  
        <further-classification edition="202401120250207B">G06Q10/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, KE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏崴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁修坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, XIUKUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何敬禹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, JINGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臧勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZANG, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐智俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, ZHIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁宏鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, HONGFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴　馬尼什　庫馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAY, MANISH KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德魯伊夫　賈斯柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DRUIF, JASPER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明實施例的優化方法由計算裝置執行，所述方法包括如下步驟：將第一資料輸入到第一優化模型（optimization model），使用從所述第一優化模型輸出的資料進行第一決策；及將所述第一決策結果和第二資料輸入到第二優化模型，使用從所述第二優化模型輸出的資料進行第二決策，所述第一優化模型和所述第二優化模型的優化目標不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There are provided a method for optimization executed by a computing device and an apparatus for the same. The method includes inputting first data into a first optimization model, making a first decision using data output from the first optimization model, inputting the first decision result and second data into a second optimization model, and making a second decision using data output from the second optimization model, wherein the optimization objectives of the first optimization model and the second optimization model are different.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S910、S920、S930、S940、S950:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="630" publication-number="202613903"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613903.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613903</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113138106</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>賣家分配優化方法及其系統</chinese-title>  
        <english-title>VENDOR ALLOCATION OPTIMIZATION METHOD AND SYSTEM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250207B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250207B">G06Q30/06</further-classification>  
        <further-classification edition="200601120250207B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, KE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏崴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何立文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, LIWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森　蒂米</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEM, THIMMY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬赫什瓦里　迪柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAHESHWARI, DEEPAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本揭露實施例的賣家分配優化方法，透過計算裝置執行，可以包括如下步驟：對於多個賣家中的每一個，基於第一SKU（stock keeping unit）的品質管理退回率計算第一分數；對於該多個賣家中的每一個，基於該第一SKU的滿足率（fill rate）計算第二分數；對於該多個賣家中的每一個，基於該第一SKU的客戶評分計算第三分數；對於該多個賣家中的每一個，基於該第一SKU的客戶退回率計算第四分數；基於該第一分數、該第二分數、該第三分數和該第四分數，計算該多個賣家各自的賣家分數；和基於該賣家分數，向該多個賣家中的每一個分配該第一SKU的訂貨數量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A vendor allocation optimization method according to an exemplary embodiment of the present disclosure is performed by a computing device and may include calculating a first score based on a quality control return rate of a first stock keeping unit (SKU), for each of a plurality of vendors; calculating a second score based on a fill rate of the first SKU, for each of the plurality of vendors; calculating a third score based on a customer rating of the first SKU, for each of the plurality of vendors; calculating a fourth score based on a customer return rate of the first SKU, for each of the plurality of vendors; calculating a vendor score of each of the plurality of vendors based on the first score, the second score, the third score, and the fourth score; and allocating an order quantity of the first SKU to each of the plurality of vendors based on the vendor score.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110、S120、S130、S140、S150、S160、S170:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="631" publication-number="202613799"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613799.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613799</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113138138</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置與其語音控制方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND VOICE CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250102B">G06F3/14</main-classification>  
        <further-classification edition="200601120250102B">G06F3/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商華科全球股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASUS GLOBAL PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王君騰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JUN TENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIN, SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁代祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, DAI XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案為一種電子裝置與其語音控制方法。此方法適用於包括顯示器與麥克風裝置的電子裝置，並包括下列步驟。運行一開機韌體的一上電自我測試程序。於上電自我測試程序期間，對麥克風裝置接收的一語音輸入進行語音辨識處理，以獲取一第一語音指令。於上電自我測試程序期間，根據第一語音指令利用顯示器顯示開機韌體的一設置介面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device and a voice control method thereof are provided. The method is adapted to the electronic device including a display and a microphone device and includes the following steps. A power-on self-test (POST) procedure of a boot firmware is performed. During the POST procedure, a voice recognition processing is performed to a voice input received by the microphone device to obtain a first voice command. During the POST procedure, a configuration interface of the boot firmware is displayed on the display according to the first voice command.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210~S230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="632" publication-number="202613844"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613844.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613844</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113138188</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以隨著網頁之滾動而變更頁面標頭及檢索欄之顯示之裝置、方法及記錄媒體</chinese-title>  
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM FOR CHANGING THE DISPLAY METHOD OF PAGE HEADER AND SEARCH BAR ACCORDING TO SCROLLING OF WEB PAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250303B">G06F16/95</main-classification>  
        <further-classification edition="201901120250303B">G06F16/957</further-classification>  
        <further-classification edition="202301120250303B">G06Q30/06</further-classification>  
        <further-classification edition="201301120250303B">G06F3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許乃京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUH, NAEKYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李海妍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAEYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜珠恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, JU EUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃周安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, JU AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONGEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李延成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YEONSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　伊萊恩　智英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIM, ELAINE JI YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安田　傑弗瑞　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUDA, JEFFREY WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭志秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GWAK, JISU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種用以隨著網頁之滾動而變更頁面標頭及檢索欄之顯示方法之電子裝置。本發明一實施例之電子裝置可包括：一個以上之處理器；及一個以上之記憶體，其儲存有用以藉由上述一個以上之處理器而執行之命令；且上述電子裝置以如下方式構成：於執行上述命令時，上述一個以上之處理器獲得用戶對電子商務服務之第1網頁之連接請求；產生用於輸出上述第1網頁之網頁資訊，該第1網頁包括第1內容、頁面標頭及檢索欄；及將上述網頁資訊傳輸至上述用戶之終端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310:動作</p>  
        <p type="p">S320:動作</p>  
        <p type="p">S330:動作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="633" publication-number="202613879"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613879.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613879</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113138189</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>代碼中的字串翻譯方法及其系統</chinese-title>  
        <english-title>METHOD FOR TRANSLATING STRING INCLUDED IN CODE AND SYSTEM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250203B">G06F40/40</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓宇超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, YUCHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的實施例的代碼中的字串翻譯方法藉由計算裝置執行，包括如下步驟：接收與以第一語言實現的目標服務對應的第一源代碼中包括的多個字串中使用預設的第一函數編寫的第一字串，其中所述第一函數是指示需要翻譯所述第一字串的函數；接收第二字串，該第二字串是以與所述第一語言不同的第二語言翻譯所述第一字串的結果；生成由所述第二字串替換所述第一字串的第二源代碼；及基於所述第二源代碼以所述第二語言向客戶終端提供所述目標服務。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for translating a string included in a code is performed by a computing device, and may include receiving a first string written using a first function that is preset among a plurality of strings included in a first source code corresponding to a target service implemented in a first language, the first function being a function indicating that translation of the first string is required, receiving a second string that is a result of translating the first string into a second language different from the first language, generating a second source code in which the first string is replaced with the second string, and providing the target service to a client terminal in the second language based on the second source code.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S200、S300、S400:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="634" publication-number="202613793"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613793.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613793</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113138193</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>選擇選項顯示方法及其系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR DISPLAYING SELECTION OPTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250208B">G06F3/048</main-classification>  
        <further-classification edition="200601120250208B">G06F17/40</further-classification>  
        <further-classification edition="202301120250208B">G06Q30/06</further-classification>  
        <further-classification edition="202401120250208B">G06Q10/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種選擇選項顯示方式以及用於執行該方法的計算系統。該方法包括如下步驟：回應於對於用於選擇第一商品的第一選項項目的第一頁面的第一請求，發送該第一頁面；接收包括查詢參數的URL(Uniform Resource Locator)，該查詢參數包括對於該第一選項項目中的第一選項的第一使用者選擇；回應於對於用於選擇第二選項項目的第二頁面的第二請求，發送該第二頁面；當接收到對於該第二選項項目中的第二選項的第二使用者選擇時，基於該第二使用者選擇確定是否調整該查詢參數；和若確定調整該查詢參數，則回應於對於該第一頁面的第三請求，發送顯示調整的該查詢參數的第三頁面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a method for displaying selection options and a computing system for performing the method. The method includes: transmitting a first page, in response to a first request for the first page for selection of a first option item related to a first product; receiving a Uniform Resource Locator (URL) including a query parameter including a first user selection for a first option of the first option item; transmitting a second page, in response to a second request for the second page for selection of a second option item; determining whether to adjust the query parameter based on a second user selection when the second user selection for a second option of the second option item is received; and transmitting a third page that displays the adjusted query parameter, in response to a third request for the first page, when it is determined that the query parameter is adjusted.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S200、S300、S400、S500:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="635" publication-number="202613939"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613939.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613939</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113138897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>實行ＡＢ測試之電子裝置、方法及記錄媒體</chinese-title>  
        <english-title>ELECTRONIC APPARATUS, METHOD AND RECORDING MEDIUM FOR PERFORMING AB TEST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250401B">G06Q30/0601</main-classification>  
        <further-classification edition="202301120250401B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金珠熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林秀珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, SUJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施例之藉由電子裝置而實行之方法可包括如下步驟：獲得與購買商品相關之一個以上之第1網頁日誌，上述網頁日誌包括上述商品之詳細頁面中之日誌記錄；基於上述一個以上之第1網頁日誌，識別於上述商品之詳細頁面中實行之一個以上之AB測試中的目標AB測試結果；及基於上述目標AB測試結果而更新網頁資訊，該網頁資訊係用於展露實行上述目標AB測試之一個以上之商品各者所屬之各類別的詳細頁面者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310:步驟</p>  
        <p type="p">S320:步驟</p>  
        <p type="p">S330:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="636" publication-number="202613817"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613817.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613817</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113138952</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>服務異常檢測方法、裝置及記錄媒體</chinese-title>  
        <english-title>METHOD, DEVICE AND RECORDING MEDIUM FOR SERVICE ANOMALY DETECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250801B">G06F11/36</main-classification>  
        <further-classification edition="200601120250801B">G06F11/30</further-classification>  
        <further-classification edition="200601120250801B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種服務異常檢測方法，其係藉由電子裝置實行，檢測提供至用戶終端之服務發生之異常。方法可包括如下步驟：電子裝置根據自用戶終端傳輸來之諮詢用文本資料算出第1向量；電子裝置將第1向量及與第1向量對應之時間戳資訊儲存於向量資料庫；電子裝置獲得成為用以判定服務是否發生異常之基準之基準向量；電子裝置基於基準向量而自向量資料庫獲得一個以上之虛擬向量，其中各虛擬向量與基準向量之相似度為預設之臨界值以上，與各虛擬向量對應之時間戳資訊所表示之時刻屬於預設之期間內；電子裝置獲得與隨時間推移而變化之虛擬向量之數量分佈相關之資料；及電子裝置基於與虛擬向量之數量分佈相關之資料，判定服務是否發生異常。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10:步驟</p>  
        <p type="p">S20:步驟</p>  
        <p type="p">S30:步驟</p>  
        <p type="p">S40:步驟</p>  
        <p type="p">S50:步驟</p>  
        <p type="p">S60:步驟</p>  
        <p type="p">S70:步驟</p>  
        <p type="p">S80:步驟</p>  
        <p type="p">SE:結束</p>  
        <p type="p">SS:開始</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="637" publication-number="202613908"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613908.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613908</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139130</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>庫存管理方法及其系統</chinese-title>  
        <english-title>METHOD FOR MANAGING INVENTORY AND SYSTEM THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250208B">G06Q10/087</main-classification>  
        <further-classification edition="202401120250208B">G06Q10/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏崴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金堰安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, YANAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, KE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張光耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, GUANGYAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供庫存管理方法及其系統。根據本揭露的一實施例的庫存管理方法，其由計算裝置執行，可包括：接收對於第一庫存管理單位的商品的第一物流中心的第一請求訂單數量及對於上述第一庫存管理單位的商品的第二物流中心的第二請求訂單數量的步驟；接收上述第一物流中心和上述第二物流中心各自的儲存容量現狀，識別超過儲存容量的上述第一物流中心的步驟；從上述第一請求訂單數量中減去上述第一庫存管理單位的商品的最小移送單位數量的倍數值，獲取第一數量的步驟；合計上述第一數量和上述第二請求訂單數量，獲取可分攤到上述第二物流中心的第二數量的步驟；以及以上述最小移送單位數量的倍數值對上述第二數量執行四捨五入，獲取要向上述第二物流中心移送的最終移送數量的步驟，上述第二物流中心可以是不超過儲存容量的物流中心。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There are provided a method for managing inventory and a system therefor. The method for managing inventory is performed by a computing device, and may include receiving a first requested order quantity of a first logistics center for a product of a first inventory management unit and a second requested order quantity of a second logistics center for the product of the first inventory management unit; receiving a storage capacity state of each of the first logistics center and the second logistics center and identifying the first logistics center whose storage capacity is exceeded; subtracting a multiple value of a minimum transfer unit quantity of the product of the first inventory management unit from the first requested order quantity and obtaining a first quantity; adding up the first quantity and the second requested order quantity and obtaining a second quantity assignable to the second logistics center; and rounding off the second quantity to the multiple value of the minimum transfer unit quantity and obtaining a final transfer quantity to be transferred to the second logistics center, wherein the second logistics center may be a logistics center whose storage capacity is not exceeded.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S200、S300、S400、S500:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="638" publication-number="202613921"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613921.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613921</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139261</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>商品折扣價格確定方法及其系統</chinese-title>  
        <english-title>METHOD FOR DETERMINING DISCOUNT PRICE FOR PRODUCT AND SYSTEM THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250208B">G06Q30/02</main-classification>  
        <further-classification edition="202401120250208B">G06Q10/08</further-classification>  
        <further-classification edition="202301120250208B">G06Q30/06</further-classification>  
        <further-classification edition="200601120250208B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, KE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏崴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張光耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, GUANGYAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋　志訓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, JI HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬赫什瓦里　迪柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAHESHWARI, DEEPAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種折扣價格確定方法。所述方法包括如下步驟：獲取多個最小存貨單位（SKU，Stock Keeping Unit）中每一個的第一價格；根據與所述多個SKU中每一個對應的多個第二價格，獲取所述多個SKU中每一個的第一預測需求值；基於所述多個第二價格、所述多個SKU中每一個的所述第一價格及所述第一預測需求值，生成訓練資料集；使用生成的所述訓練資料集來訓練第一模型；將目標SKU輸入到所述第一模型，輸出所述目標SKU的價格彈性（price elasticity）；及基於輸出的所述價格彈性來計算所述目標SKU的折扣價格，計算所述折扣價格的步驟包括如下步驟：優化所述折扣價格的目的函數的值來計算優化的折扣價格，根據所述優化的折扣價格的所述目標SKU的第二預測需求值不超過與所述目標SKU對應的預設的第一值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided a method for determining a discount price. The method includes obtaining a first price of each of a plurality of stock keeping units (SKUs), obtaining first predicted demand values for each of the plurality of SKUs according to a plurality of second prices corresponding to each of the plurality of SKUs, generating a training data set based on the plurality of second prices, the first price of each of the plurality of SKUs, and the first predicted demand values, training a first model using the generated training data set, inputting a target SKU to the first model and outputting a price elasticity for the target SKU, and calculating a discount price for the target SKU based on the output price elasticity, wherein the calculating of the discount price includes calculating an optimized discount price by optimizing a value of an objective function for the discount price, a second predicted demand value for the target SKU according to the optimized discount price not exceeding a first value preset to correspond to the target SKU.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S200、S300、S400、S500、S600、S610:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="639" publication-number="202613904"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613904.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613904</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139262</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>庫存管理方法及其系統</chinese-title>  
        <english-title>METHOD FOR MANAGING INVENTORY AND SYSTEM THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250208B">G06Q10/08</main-classification>  
        <further-classification edition="200601120250208B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬赫什瓦里　迪柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAHESHWARI, DEEPAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏崴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>強尼　拉維　拉朱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHN, RAVI RAJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森　蒂米</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEM, THIMMY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張光耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, GUANGYAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金堰安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, YANAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裴賢俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, HYEON JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴里拉　拉胡爾　庫馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHARILLA, RAHUL KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種庫存管理方法及其系統。根據本揭露的一實施例的庫存管理方法，其由計算裝置執行，可包括：對於第一庫存管理單位（Stock Keeping Unit），獲取第一履行中心（Fulfillment Center）的第一請求訂單數量及第二履行中心的第二請求訂單數量的步驟，合計上述第一請求訂單數量及上述第二請求訂單數量，獲取整體請求訂單數量的步驟，運算與上述整體請求訂單數量對應的最終訂單數量的步驟；以及將包括對於上述第一庫存管理單位的上述最終訂單數量的購買訂單發送至銷售商終端的步驟，上述最終訂單數量可以是訂購上述第一庫存管理單位的商品的最小單位即最小訂單單位數量的倍數（multiple）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a method for managing inventory and a system therefor. A method for managing inventory, performed by a computing device according to an exemplary embodiment of the present disclosure includes: obtaining a first request order quantity of a first fulfillment center and a second request order quantity of a second fulfillment center, for a first stock keeping unit; adding the first request order quantity and the second request order quantity and obtaining a total request order quantity; calculating a final order quantity corresponding to the total request order quantity; and transmitting a purchase order including the final order quantity for the first stock keeping unit to a vendor terminal, wherein the final order quantity is a multiple of a minimum order unit quantity, which is a minimum unit for ordering a product of the first stock keeping unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:第一FC終端</p>  
        <p type="p">22:第二FC終端</p>  
        <p type="p">11:訂單確定模組</p>  
        <p type="p">12:移送確定模組</p>  
        <p type="p">30:銷售商終端</p>  
        <p type="p">40:物流中心終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="640" publication-number="202613635"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613635.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613635</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139296</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像鏡頭</chinese-title>  
        <english-title>OPTICAL IMAGING LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250305B">G02B7/00</main-classification>  
        <further-classification edition="202101120250305B">G02B7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀志忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, ZHIZHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王福寶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, FUBAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈懷斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, HUAIBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像鏡頭，包括多片透鏡，從一物側至一像側沿一光軸依序設置。各透鏡皆具有一朝向物側的物側面及一朝向像側的像側面，這些透鏡更包含讓成像光線通過的光學部及一由光學邊界徑向向外延伸的組裝部，光學邊界為通過透鏡的表面徑向最外側的邊緣光線與透鏡的表面相交的一點。這些透鏡透過膠水彼此嵌合組裝成一個整體。對於介於從物側到像側數來第一片透鏡及從像側到物側數來第一片透鏡之間的這些透鏡而言，組裝部的物側面具有第一承靠面、第一斜面及至少三個儲膠區域。這些儲膠區域彼此不相接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging lens including a plurality of lens elements arranged in sequence along an optical axis from an object side to an image side is provided. Each of the lens elements has an object-side surface facing the object side and an image-side surface facing the image side. The lens elements further include an optical region allowing imaging rays to pass through and a mounting portion extending outwards from an optical boundary. The optical boundary is an intersection of a marginal ray passing through the outmost side in the radial direction on the surface of the lens element and the surface of the lens element. The lenses are assembled with each other through glue to form a whole. For the lens elements between a first lens element counted from the object side to the image side and a first lens element counted from the image side to the object side, the object-side surface of the assembly region has a first leaning surface, a first inclined surface, and at least three glue storage regions. The glue storage regions do not contact with each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:成像面</p>  
        <p type="p">60:濾光片</p>  
        <p type="p">70:保護蓋板</p>  
        <p type="p">100:光學成像鏡頭</p>  
        <p type="p">110、120:膠水</p>  
        <p type="p">130:吸光膜</p>  
        <p type="p">170:遮光片</p>  
        <p type="p">200、210、220、230、240、250:透鏡</p>  
        <p type="p">202:光學部</p>  
        <p type="p">204:組裝部</p>  
        <p type="p">322:第一平面</p>  
        <p type="p">324:第二斜面</p>  
        <p type="p">326:凹槽</p>  
        <p type="p">332:第二承靠面</p>  
        <p type="p">334:第三斜面</p>  
        <p type="p">A1:物側</p>  
        <p type="p">A2:像側</p>  
        <p type="p">B1:物側面</p>  
        <p type="p">B2:像側面</p>  
        <p type="p">C:光軸</p>  
        <p type="p">E:光學邊界</p>  
        <p type="p">MTL、OTL:最大高度</p>  
        <p type="p">Tlal:厚度</p>  
        <p type="p">α:角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="641" publication-number="202613693"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613693.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613693</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139338</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像鏡頭</chinese-title>  
        <english-title>OPTICAL IMAGING LENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250311B">G03B11/00</main-classification>  
        <further-classification edition="202101120250311B">G02B7/00</further-classification>  
        <further-classification edition="201801120250311B">C09J7/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉清樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, QINGSHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅愷鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, KAI-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬靜如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供之光學成像鏡頭從物側到像側沿光軸包括複數透鏡，每一透鏡都包含朝向物側的物側全面與朝向像側的像側全面且徑向上由內向外形成光學部與組裝部，物側全面包括對應組裝部的物側承靠面，像側全面包括對應組裝部的像側承靠面。兩透鏡之間包括一遮光片及兩可被激活膠。遮光片包含朝向物側的物側面與朝向像側的像側面。可被激活膠為環形，且其一係設置在遮光片的物側面與一透鏡的像側承靠面之間，另一係設置在遮光片的像側面與另一透鏡的物側承靠面之間。對於各可被激活膠，光學成像鏡頭並滿足兩條件式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging lens is provided by the present invention. The optical imaging lens comprises a plurality of lens elements, positioned from an object side to an image side. Each of the lens elements comprises an object-side full surface facing the object side and an image-side full surface facing the image side and an optical portion and an mounting portion, formed in a radial direction, from center to edge. The object-side full surface comprises an objects-side bearing surface corresponding to the mounting portion. The image-side full surface comprises an image-side bearing surface corresponding to the mounting portion. A soma and two pieces of activated reactive bonding film is positioned between two of the lens elements. The soma comprises an object-side surface facing the object-side and an image-side surface facing the image side. The two pieces of activated reactive bonding film is in a shape of ring. One of the two pieces of activated reactive bonding film is positioned between the object-side surface of the soma and the image-side bearing surface of one of the two lens elements, and the other one of the two pieces of activated reactive bonding film is positioned between the image-side surface of the soma and the object-side bearing surface of the other one of the two lens elements. With respect to each of the pieces of activated reactive bonding film, the optical imaging lens may satisfy two inequalities.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">32、33、34、35、36、37:組件</p>  
        <p type="p">31:下座</p>  
        <p type="p">38:墊圈</p>  
        <p type="p">39:限位件</p>  
        <p type="p">I:光軸</p>  
        <p type="p">L1:第一透鏡</p>  
        <p type="p">L1A1:第一透鏡物側全面</p>  
        <p type="p">L1A2:第一透鏡像側全面</p>  
        <p type="p">L2:第二透鏡</p>  
        <p type="p">L2A1:第二透鏡物側全面</p>  
        <p type="p">L2A2:第二透鏡像側全面</p>  
        <p type="p">L3:第三透鏡</p>  
        <p type="p">L3A1:第三透鏡物側全面</p>  
        <p type="p">L3A2:第三透鏡像側全面</p>  
        <p type="p">L4:第四透鏡</p>  
        <p type="p">L4A1:第四透鏡物側全面</p>  
        <p type="p">L4A2:第四透鏡像側全面</p>  
        <p type="p">L4:第五透鏡</p>  
        <p type="p">L4A1:第五透鏡物側全面</p>  
        <p type="p">L4A2:第五透鏡像側全面</p>  
        <p type="p">L6:第六透鏡</p>  
        <p type="p">L6A1:第六透鏡物側全面</p>  
        <p type="p">L6A2:第六透鏡像側全面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="642" publication-number="202613901"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613901.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613901</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139584</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>節能資訊推播裝置及方法</chinese-title>  
        <english-title>ENERGY SAVING INFORMATION PROVIDING APPARATUS AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250102B">G06Q10/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人資訊工業策進會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INSTITUTE FOR INFORMATION INDUSTRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉書安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SU AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣貴君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, KUEI CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪永杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, YUNG CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種節能資訊推播裝置及方法。該裝置儲存複數個節能資訊。該裝置基於一使用者帳戶的一回饋記錄，確認該使用者帳戶的一用戶等級。該裝置基於該使用者帳戶的一用電記錄，將該使用者帳戶分群至複數個用電類型其中一第一用電類型。該裝置基於該第一用電類型，自複數個帳戶中篩選出至少一相似帳戶。該裝置基於該使用者帳戶的該用戶等級以及該至少一相似帳戶的至少一回饋記錄，自該些節能資訊篩選出一推薦節能資訊以對該使用者帳戶推播該推薦節能資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An energy saving information providing apparatus and method are provided. The apparatus stores a plurality of pieces of energy saving information. The apparatus assigns a user level for a user account based on a feedback record of the user account. The apparatus groups the user account into a first energy usage type of a plurality of energy usage types based on an energy usage record of the user account. The apparatus selects at least one similar account from a plurality of accounts based on the first energy usage type. The apparatus selects a recommended energy saving information from the energy saving information based on the user level of the user account and at least one feedback record of the at least one similar account, and sends the recommended energy saving information to the user account.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:節能資訊推播裝置</p>  
        <p type="p">12:處理器</p>  
        <p type="p">14:儲存器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="643" publication-number="202612768"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612768.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612768</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113139859</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於圖像檢測的射擊遊戲裝置</chinese-title>  
        <english-title>SHOOTING GAME DEVICE BASED ON IMAGE DETECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120250328B">A63F13/213</main-classification>  
        <further-classification edition="201401120250328B">A63F13/211</further-classification>  
        <further-classification edition="200601120250328B">A63F9/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝長清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, CHANG-QING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聶江濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIE, JIANG-TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李家吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">射擊遊戲裝置包含觸發裝置、圖像感測器電路以及圖像檢測電路。觸發裝置用以發出一觸發訊號。圖像感測器電路用以響應於該觸發訊號朝向一標靶圖擷取一圖像資料。圖像檢測電路用以根據該圖像資料的一亮度資訊決定一遊戲分數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A shooting game device includes a triggering device, an image sensor circuit, and an image detection circuit. The triggering device is configured to emit a triggering signal. The image sensor circuit is configured to capture image data of a target image in response to the triggering signal. The image detection circuit is configured to determine a game score according to brightness information of the image data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:射擊遊戲裝置</p>  
        <p type="p">101:標靶圖</p>  
        <p type="p">101A:電子螢幕</p>  
        <p type="p">102:外部裝置</p>  
        <p type="p">103:無線網路協議</p>  
        <p type="p">110:觸發裝置</p>  
        <p type="p">110A:觸發元件</p>  
        <p type="p">110B:磁性元件</p>  
        <p type="p">110C:霍爾感測器</p>  
        <p type="p">120:圖像感測器電路</p>  
        <p type="p">130:圖像檢測電路</p>  
        <p type="p">140:分數播報電路</p>  
        <p type="p">150:資料傳輸電路</p>  
        <p type="p">160:更新電路</p>  
        <p type="p">DC:難度係數</p>  
        <p type="p">GS:遊戲分數</p>  
        <p type="p">SD:圖像資料</p>  
        <p type="p">ST:觸發訊號</p>  
        <p type="p">SU:更新訊號</p>  
        <p type="p">TH:預設值</p>  
        <p type="p">UCMD:更新指令</p>  
        <p type="p">VS:震動訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="644" publication-number="202613783"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613783.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613783</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113140234</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>主機、基於單相機的追蹤系統及基於單相機的追蹤方法</chinese-title>  
        <english-title>HOST, SINGLE-CAMERA-BASED TRACKING SYSTEM, AND SINGLE-CAMERA-BASED TRACKING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">G06F3/02</main-classification>  
        <further-classification edition="201701120241231B">G06T7/20</further-classification>  
        <further-classification edition="201401120241231B">A63F13/213</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王有慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述一種主機。處理器被配置為存取程式碼，以執行：通過追蹤裝置的相機，獲取影像資料，其中追蹤裝置被配置為被放置在原點位置；基於影像資料，判定追蹤裝置是否在原點位置；響應於追蹤裝置不在原點位置，基於影像資料，執行追蹤裝置的裝置追蹤；基於裝置追蹤，判定追蹤裝置的裝置座標；基於影像資料，判定追蹤裝置是否被放置回到原點位置；以及響應於追蹤裝置被放置回到原點位置，將追蹤裝置的裝置座標，判定為與原點位置的原點座標相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A host is described herein. A processor is configured to access a program code to execute: obtaining image data through a camera of a tracking device, wherein the tracking device is configured to be disposed on a home location; determining that whether the tracking device is at the home location or not based on the image data; in response to the tracking device being not at the home location, performing a device tracking of the tracking device based on the image data; determining a device coordinate of the tracking device based on the device tracking; determining that whether the tracking device is disposed back to the home location or not based on the image data; and in response to the tracking device being disposed back to the home location, determining that the device coordinate of the tracking device being same as a home coordinate of the home location.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:基於單相機的追蹤方法</p>  
        <p type="p">S510、S520、S530、S540、S550、S560:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="645" publication-number="202613757"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613757.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613757</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113140254</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>降壓轉換器及操作降壓轉換器的方法</chinese-title>  
        <english-title>CURRENT BUCK CONVERTER AND METHOD FOR OPERATING CURRENT BUCK CONVERTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250122B">G05F1/565</main-classification>  
        <further-classification edition="200601120250122B">H02M3/156</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立錡科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTEK TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉宇軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊詠竣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, YUNG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種降壓轉換器包括功率級、耦接至功率級的反饋網路、控制迴路、耦接至控制迴路的邏輯電路、耦接於邏輯電路和功率級之間的驅動電路，以及負載檢測器。功率級包括用於接收輸入電壓的輸入端，以及用於傳輸輸出電壓的輸出端。反饋網路用以根據輸出電壓產生反饋電壓。控制迴路包括錯誤放大器及耦接至錯誤放大器的比較器。錯誤放大器用以通過比較參考電壓和反饋電壓來產生錯誤信號。比較器用以根據錯誤信號產生比較信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A buck converter includes a power stage, a feedback network coupled to the power stage, a control loop, a logic circuit coupled to the control loop, a driver circuit coupled between the logic circuit and the power stage, and a load detection circuit. The power stage includes an input terminal for receiving an input voltage, and an output terminal for transmitting an output voltage. The feedback network is used to generate a feedback voltage according to the output voltage. The control loop includes an error amplifier and a comparator coupled to the error amplifier. The error amplifier is used to generate an error voltage by comparing a reference voltage to the feedback voltage. The comparator is used to generate a comparator signal according the error voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:降壓轉換器</p>  
        <p type="p">110:功率級</p>  
        <p type="p">120:反饋網路</p>  
        <p type="p">130:控制迴路</p>  
        <p type="p">132:錯誤放大器</p>  
        <p type="p">134:比較器</p>  
        <p type="p">136:電流源</p>  
        <p type="p">140:邏輯電路</p>  
        <p type="p">150:驅動電路</p>  
        <p type="p">160:負載檢測器</p>  
        <p type="p">170:零電流檢測器</p>  
        <p type="p">180:導通時間產生器</p>  
        <p type="p">VIN:輸入電壓</p>  
        <p type="p">VOUT:輸出電壓</p>  
        <p type="p">VFB:反饋電壓</p>  
        <p type="p">VREF:參考電壓</p>  
        <p type="p">VEAO:錯誤放大器輸出電壓</p>  
        <p type="p">VLX:開關節點電壓</p>  
        <p type="p">VRAMP:斜率電壓</p>  
        <p type="p">IL:電感電流</p>  
        <p type="p">ILOAD:負載電流</p>  
        <p type="p">S1:第一開關</p>  
        <p type="p">S2:第二開關</p>  
        <p type="p">S3:鉗位開關</p>  
        <p type="p">LOUT:輸出電感</p>  
        <p type="p">COUT:輸出電容</p>  
        <p type="p">CFF:前饋電容</p>  
        <p type="p">RLOAD:負載電阻</p>  
        <p type="p">RFB1,RFB2:反饋電阻</p>  
        <p type="p">REAO:錯誤放大器輸出電阻</p>  
        <p type="p">CEAO:錯誤放大器輸出電容</p>  
        <p type="p">dCOMP:比較器輸出信號</p>  
        <p type="p">dCLAMP:鉗位信號</p>  
        <p type="p">dSLP:睡眠模式信號</p>  
        <p type="p">dDSLP:深度睡眠模式信號</p>  
        <p type="p">dDSLP_RST:深度睡眠模式重設信號</p>  
        <p type="p">TON:導通時間信號</p>  
        <p type="p">LGC:邏輯控制信號</p>  
        <p type="p">EN_CMP:比較器啟動信號</p>  
        <p type="p">EN_CLAMP:鉗位啟動信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="646" publication-number="202613402"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613402.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613402</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113140580</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>汽輪機</chinese-title>  
        <english-title>STEAM TURBINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250224B">F01D25/30</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周榮光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, JUNG-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周榮光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, JUNG-KUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">&lt;b&gt;一種汽輪機，係以一汽輪中央配置一主軸，汽輪外圓設有一方形凹槽，為因應轉動平衡及溫度變化，汽輪兩端分別増設一組較粗機軸，以多數楔片分別以長方弧形槽夾持，細端依序環繞機軸上，粗端以彈簧施壓，構成輔助軸承。一汽缸頭沿旋轉方向中央設有一進氣口，當高壓氣流射入時產生真空吸力及進氣室氣壓使一活動板自動起立，一汽輪外罩浮懸把持於汽輪外圓上，上方由一固定在機架下之汽缸施壓，使汽輪外罩與方形凹槽密合，構成一汽缸體。&lt;/b&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">&lt;b&gt;A steam turbine is equipped with a main axis in the central configuration of the FAW wheel. There is a square groove in the outer circle of the steam wheel. In order to rotate the balance and temperature change, there are a set of coarse axes at both ends of the steam wheels. The several wedges were held by the Rectangular arc groove, the thin end is surrounded by the axis of the machine in order, and the thick end is press by a Rectangular arc groove with spring to form auxiliary bearings. A cylinder head is provided with an air inlet in the center along the direction of rotate. When the high-pressure airflow is injected, vacuum suction and intake chamber air pressure are generated to cause a movable plate to stand up automatically. A steam turbine outer cover is suspended and held on the outer circle of the steam turbine, with a cylinder fixed under the frame applies pressure to make the turbine outer cover closely fit with the square groove to form a cylinder block.&lt;/b&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:機架</p>  
        <p type="p">2:汽輪</p>  
        <p type="p">3:機軸</p>  
        <p type="p">4:汽缸頭</p>  
        <p type="p">5:汽輪外罩</p>  
        <p type="p">6:開口</p>  
        <p type="p">7:汽缸</p>  
        <p type="p">20:氣密牆</p>  
        <p type="p">21:主軸</p>  
        <p type="p">22:進氣室</p>  
        <p type="p">23:活動板</p>  
        <p type="p">24:氣密溝</p>  
        <p type="p">26:輪桿</p>  
        <p type="p">27:方形凹槽</p>  
        <p type="p">28:汽輪外圓</p>  
        <p type="p">33:進氣口</p>  
        <p type="p">34:進氣口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="647" publication-number="202614602"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614602.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614602</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141218</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>網路封包處理裝置以及網路封包處理方法</chinese-title>  
        <english-title>NETWORK PACKET PROCESSING DEVICE AND NETWORK PACKET PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250203B">H04L47/31</main-classification>  
        <further-classification edition="202201120250203B">H04L47/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商達發科技（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIROHA TECHNOLOGY (SUZHOU) LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃偉華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEIHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種網路封包處理裝置，包含硬體加速轉發電路以及網路處理器。該硬體加速轉發電路用以自一網路連接埠接收複數個L4S封包，並在無需中央處理器介入之下，透過硬體加速轉發來將該複數個L4S封包發送至另一網路連接埠。該網路處理器用以對該複數個L4S封包中至少一部分的L4S封包進行ECN標記。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a network packet processing device that includes a hardware-accelerated forwarding circuit and a network processing unit (NPU). The hardware-accelerated forwarding circuit is used to receive a plurality of L4S packets from a network port and send the plurality of L4S packets to another network port through hardware-accelerated forwarding without intervention of a central processing unit (CPU). The NPU is used to perform ECN marking on at least a portion of the L4S packets.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:網路封包處理裝置</p>  
        <p type="p">102:中央處理器</p>  
        <p type="p">104:硬體加速轉發電路</p>  
        <p type="p">106:網路處理器</p>  
        <p type="p">108:佇列直接記憶體存取系統</p>  
        <p type="p">110,112:網路連接埠</p>  
        <p type="p">114:硬體轉發表</p>  
        <p type="p">116:網路協定堆疊</p>  
        <p type="p">118:L4S佇列</p>  
        <p type="p">120:傳統佇列</p>  
        <p type="p">122:多工器(基於QoS規則運行)</p>  
        <p type="p">124:流量監測電路</p>  
        <p type="p">126:佇列監測電路</p>  
        <p type="p">128:ECN標記電路</p>  
        <p type="p">PKT&lt;sub&gt;L4S&lt;/sub&gt;:L4S封包</p>  
        <p type="p">PKT&lt;sub&gt;C&lt;/sub&gt;:傳統封包</p>  
        <p type="p">B&lt;sub&gt;MAX&lt;/sub&gt;:最大頻寬</p>  
        <p type="p">L&lt;sub&gt;l&lt;/sub&gt;,L&lt;sub&gt;c&lt;/sub&gt;:發送速率</p>  
        <p type="p">P:ECN標記機率</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="648" publication-number="202614736"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614736.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614736</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141683</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241202B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡鎮宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, JHEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種半導體結構。半導體結構包括基板及字元線。字元線嵌入基板中，字元線包括高功函數層及在高功函數層上的低功函數層，其中高功函數層的平均功函數大於低功函數層的平均功函數，低功函數層包括下部及在下部上的上部，以及下部的平均晶粒尺寸小於上部的平均晶粒尺寸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a semiconductor structure. The semiconductor structure includes a substrate and a word line. The word line is embedded in the substrate and includes a high work function layer and a low work function layer on the high work function layer, in which an average work function of the high work function layer is larger than an average work function of the low work function layer, the low work function layer includes a lower portion and an upper portion on the lower portion, and an average grain size of the lower portion is smaller than an average grain size of the upper portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:基板</p>  
        <p type="p">102:介電層</p>  
        <p type="p">103:字元線</p>  
        <p type="p">103H:高功函數層</p>  
        <p type="p">103L:低功函數層</p>  
        <p type="p">104:阻障層</p>  
        <p type="p">105:介電層</p>  
        <p type="p">GS1:平均晶粒尺寸</p>  
        <p type="p">GS2:平均晶粒尺寸</p>  
        <p type="p">P1:下部</p>  
        <p type="p">P2:上部</p>  
        <p type="p">T1:厚度</p>  
        <p type="p">T2:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="649" publication-number="202613669"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613669.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613669</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141696</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>採用穩定機制以最小化固定方向中不對稱眼瞼偏差之影響的複曲面隱形眼鏡及相關設計方法</chinese-title>  
        <english-title>TORIC CONTACT LENSES EMPLOYING STABILIZATION MECHANISM TO MINIMIZE EFFECT OF ASYMMETRIC EYELID BIAS IN SETTLED ORIENTATION, AND RELATED METHODS OF DESIGN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G02C7/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商壯生和壯生視覺關懷公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON &amp; JOHNSON VISION CARE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>理查森　蓋瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHARDSON, GARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格利干德　皮埃爾　伊夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GERLIGAND, PIERRE-YVES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露複曲面隱形眼鏡以及相關的設計方法，該隱形眼鏡採用一穩定機制來使該複曲面隱形眼鏡之固定方向上不對稱眼瞼偏差的影響最小化。該複曲面隱形眼鏡包括穩定區，該等穩定區各自設置在其中心光學區與該鏡片邊緣之間之該隱形眼鏡之鏡片周邊的水平側上。為了使一病患佩戴者之一眼瞼的不對稱偏差對該複曲面隱形眼鏡與該眼睛之主子午線之對準的影響最小化，該等穩定區中的經組態以在佩戴中與一上眼瞼緣相交的等高線的部分經定向為一普通病患佩戴者之一目標上眼瞼之一目標上眼瞼緣形狀。以此方式，該複曲面隱形眼鏡之該穩定區對於該配戴者之眼瞼的任何不對稱形狀更不敏感。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Toric contact lenses employing a stabilization mechanism to minimize the effect of asymmetric eyelid bias in settled orientation of the toric contact lens, and related methods of design. The toric contact lens includes stabilization zones that are each disposed horizontal sides of the lens periphery of the contact lens between its central optic zone and the lens edge. To minimize the effect of asymmetric bias of an eyelid of a patient wearer on the alignment of the toric contact lens to the principal meridians of the eye, the portion of the contour lines in the stabilization zones that are configured to intersect with an upper eyelid margin in wear are oriented to a target upper eyelid margin shape of a target upper eyelid of an average patient wearer. In this manner, the stabilization zone of the toric contact lens is more desensitized to any asymmetric shape of the wearer’s eyelid.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="650" publication-number="202614737"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614737.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614737</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141889</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有自對準淺溝槽隔離支撐樑之先進半導體記憶體元件之承載訊號的導體及其接點的製造方法</chinese-title>  
        <english-title>METHOD FOR FORMING CONDUCTORS AND THEIR CONTACTS WHICH CARRY SIGNALS FOR ADVANCED SEMICONDUCTOR MEMORY DEVICES WITH SELF-ALIGNED STI SUPPORT BEAMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241106B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊達人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, DA-ZEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林發立</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有自對準淺溝槽隔離支撐樑之先進半導體記憶體元件之承載訊號的導體及其接點的製造方法，在所述方法之製程期間，在一基底上方提供一圖案層，所述圖案層包括第一方向上的次淺溝槽隔離圖案和垂直於第一方向的第二方向上的次支撐樑圖案，接著進行淺溝槽隔離（STI）蝕刻，所述淺溝槽隔離蝕刻在所述第二方向上進行非等向性STI蝕刻，同時在所述第一方向上進行STI傾斜蝕刻，由此提供在所述第二方向上具有支撐樑懸掛在次支撐樑圖案下方並且鄰接次淺溝槽隔離圖案下方基底的淺溝槽。在整個STI製程過程中，所述支撐樑機械性地支撐所述淺溝槽，以抑制STI的彎曲、變形或傾斜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides a method for forming conductors and their contacts which carry signals for advanced semiconductor memory devices with self-aligned STI support beams, during the method process a patterning layer including a sub shallow trench isolation pattern in a first direction and a sub support beam pattern in a second direction perpendicular to the first direction is provided over a substrate, a STI etching is performed in a way that an anisotropic STI etching is executed in the second direction and a STI tilt etching is executed in the first direction simultaneously, whereby shallow trenches in the second direction with the support beams inside them hanging underneath the sub support beam pattern and adjoining the substrate underneath the sub shallow trench isolation pattern are provided. The support beams mechanically support the shallow trenches during the whole STI manufacturing to suppress the bending, deforming, or tilting of STI.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:矽基板</p>  
        <p type="p">103:氮化矽層</p>  
        <p type="p">501:第一二氧化矽襯墊層</p>  
        <p type="p">701:第一訊號承載導體</p>  
        <p type="p">702:第一導體柱</p>  
        <p type="p">801:第一淺溝槽隔離結構</p>  
        <p type="p">1101:接點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="651" publication-number="202613718"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613718.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613718</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141959</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成圖案化結構之方法</chinese-title>  
        <english-title>METHODS OF FORMING PATTERNED STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250613B">G03F7/038</main-classification>  
        <further-classification edition="200601120250613B">G03F7/004</further-classification>  
        <further-classification edition="200601120250613B">H01L21/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭超元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHAO YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種形成圖案化結構之方法。方法包括以下操作。圖案化在目標層上的光阻劑層，以形成第一開口在圖案化光阻劑層中。形成定向自組裝層在圖案化光阻劑層上及在第一開口中，其中定向自組裝層中的定向自組裝材料藉由被圖案化光阻劑層的極性度吸引而分離成在圖案化光阻劑層上的第一相及在第一開口中的第二相。移除第二相，以形成第二開口穿過定向自組裝層。藉由第二開口蝕刻目標層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a method of forming a patterned structure. The method includes the following operations. A photoresist layer on a target layer is patterned to form a first opening in a patterned photoresist layer. A directed self-assembly layer is formed on the patterned photoresist layer and in the first opening, in which a directed self-assembly material in the directed self-assembly layer separates into a first phase on the patterned photoresist layer and a second phase in the first opening by the first phase being attracted by a polarity of the patterned photoresist layer. The second phase is removed to form a second opening through the directed self-assembly layer. The target layer is etched through the second opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:方法</p>  
        <p type="p">11:操作</p>  
        <p type="p">12:操作</p>  
        <p type="p">13:操作</p>  
        <p type="p">14:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="652" publication-number="202614738"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614738.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614738</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113141978</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241202B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連振浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIEN, CHEN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔耀雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNG, YAO-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置的製造方法，包括提供初始結構，其包括位元線結構、座落墊層，與位元線結構相鄰、及隔離層，與座落墊層相鄰、在初始結構上沉積第一介電層、修改第一介電層的蝕刻特性、對第一介電層進行蝕刻製程，以形成第一開口、及在第一開口形成電容結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of fabricating a semiconductor device that includes providing an initial structure, where the initial structure includes a bit line structure, a landing pad adjacent to the bit line structure, and an isolation layer adjacent to the landing pad, depositing a first dielectric layer on the initial structure, modifying an etch property of the first dielectric layer, performing an etching process on the first dielectric layer to form a first opening, and forming a capacitor structure in the first opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:位元線結構</p>  
        <p type="p">401:第一位元線導電層</p>  
        <p type="p">402:第二位元線導電層</p>  
        <p type="p">403:覆蓋層</p>  
        <p type="p">450:位元線間隔物</p>  
        <p type="p">451:第一間隔物層</p>  
        <p type="p">453:第三間隔物層</p>  
        <p type="p">500:介電層</p>  
        <p type="p">600:接觸層</p>  
        <p type="p">700:接觸塞</p>  
        <p type="p">800:導電層</p>  
        <p type="p">900:阻隔層</p>  
        <p type="p">1002:座落墊層</p>  
        <p type="p">1100:氣隙</p>  
        <p type="p">1200:隔離層</p>  
        <p type="p">1300:第一介電層</p>  
        <p type="p">1400:第二介電層</p>  
        <p type="p">1600:電容結構</p>  
        <p type="p">1602:底部電極</p>  
        <p type="p">1604:電容器電介質</p>  
        <p type="p">1606:頂部電極</p>  
        <p type="p">S1000:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="653" publication-number="202614739"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614739.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614739</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142019</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241202B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉吉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JI-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李兆修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHAO-HSIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體結構包括半導體基板、位元線結構以及位元線間隔物。位元線結構設置於半導體基板上。位元線間隔物覆蓋位元線結構，其中位元線間隔物包括SiCO層、絕緣氧化物層以及絕緣氮化物層。SiCO層覆蓋位元線結構，其中SiCO層的氧濃度等於或大於55 at%。絕緣氧化物層覆蓋SiCO層。絕緣氮化物層覆蓋絕緣氧化物層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure includes a semiconductor substrate, a bit-line structure, and a bit-line spacer. The bit-line structure is disposed on the semiconductor substrate. The bit-line spacer covers the bit-line structure, in which the bit-line spacer includes a SiCO layer, an insulating oxide layer, and an insulating nitride layer. The SiCO layer covers the bit-line structure, in which an oxygen concentration of the SiCO layer is equal to or greater than 55 at%. The insulating oxide layer covers the SiCO layer. The insulating nitride layer covers the insulating oxide layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">510:位元線結構</p>  
        <p type="p">512:導電矽層</p>  
        <p type="p">514:阻障層</p>  
        <p type="p">516:導電層</p>  
        <p type="p">518:硬遮罩層</p>  
        <p type="p">518A:絕緣氮化物層</p>  
        <p type="p">518B:絕緣氧化物層</p>  
        <p type="p">518C:絕緣氮化物層</p>  
        <p type="p">520:半導體基板</p>  
        <p type="p">522:基板</p>  
        <p type="p">524:隔離區域</p>  
        <p type="p">530:SiCO層</p>  
        <p type="p">610:氮化物層</p>  
        <p type="p">710:絕緣氧化物層</p>  
        <p type="p">720:絕緣氮化物層</p>  
        <p type="p">910:導電矽層</p>  
        <p type="p">1012:著陸墊</p>  
        <p type="p">1100:半導體結構</p>  
        <p type="p">BS:位元線間隔物</p>  
        <p type="p">T3:溝槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="654" publication-number="202612987"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612987.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612987</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142120</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>標籤分配裝置</chinese-title>  
        <english-title>LABEL DISPENSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241204B">B65C9/26</main-classification>  
        <further-classification edition="200601120241204B">B65C9/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林瑋鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種標籤分配裝置用以將一標籤料帶上所依序承載之數個標籤貼逐一撕離，標籤分配裝置包括具有標籤出口的機殼、收集捲筒、送料捲筒、驅動機構和剝離機構。收集捲筒和送料捲筒可樞轉地設於機殼內，並將標籤料帶同時安裝其上。驅動機構驅動送料捲筒和收集捲筒其中之一，以將送料捲筒上之標籤料帶朝著收集捲筒連續輸送。剝離機構安裝於機殼內且面向標籤出口之位置，且剝離機構的最高位置設有改向凸部。改向凸部用於將從送料捲筒往標籤出口拉動標籤料帶的送料方向改變為相交送料方向且朝下輸送的回收方向，而讓標籤貼依序從標籤料帶上剝離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A label dispensing device includes a housing having a label outlet, a collection reel, a feeding reel, a driving mechanism and a peeling mechanism. The collection reel and the feeding reel are rotatably disposed in the housing. The driving mechanism drives one of the feeding reel and the collection reel for conveying a label strip from the feeding reel to the collection reel. The peeling mechanism is disposed in the housing and used to change a conveying direction of the label strip being pulled from the feeding reel towards the label outlet into a recycled direction intersected with the conveying direction from the peeling mechanism downwardly for peeling off one of label stickers from the label strip when the label sticker is passing the peeling mechanism.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:標籤分配裝置</p>  
        <p type="p">100:機殼</p>  
        <p type="p">110:底板</p>  
        <p type="p">120:側板</p>  
        <p type="p">130:標籤出口</p>  
        <p type="p">140:內部空間</p>  
        <p type="p">150:底座</p>  
        <p type="p">200:捲筒送料機構</p>  
        <p type="p">210:送料捲筒</p>  
        <p type="p">211:第一樞軸</p>  
        <p type="p">220:收集捲筒</p>  
        <p type="p">221:第二樞軸</p>  
        <p type="p">230:第一改向輥</p>  
        <p type="p">231:第三樞軸</p>  
        <p type="p">240:第二改向輥</p>  
        <p type="p">241:第四樞軸</p>  
        <p type="p">300:驅動機構</p>  
        <p type="p">510:送紙輥</p>  
        <p type="p">520:收集輥</p>  
        <p type="p">530:標籤印表機</p>  
        <p type="p">540:碳紙帶</p>  
        <p type="p">600:標籤料帶</p>  
        <p type="p">610:連續離型膜</p>  
        <p type="p">620:標籤貼</p>  
        <p type="p">M:區域</p>  
        <p type="p">P:完成品</p>  
        <p type="p">X,Y,Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="655" publication-number="202614873"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614873.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614873</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142164</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像感測器及其形成方法</chinese-title>  
        <english-title>IMAGE SENSOR AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10F39/12</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傑恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEH-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林政賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHEN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁世汎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, SHYH-FANN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">影像感測器具有三個裝置層。穿基板金屬-絕緣體-金屬（Through substrate MIM, TSMIM）電容器配置在中間裝置層中。穿基板MIM電容器可替代原本配置在第二裝置層的金屬互連結構中的電容器，使該金屬互連結構，特別是頂層金屬化層，可以更薄。薄化該上層金屬化層減少寄生電容並增加動態範圍。穿基板MIM電容器可以是相關性雙取樣（correlated double sampling, CDS）電容器、橫向溢出積分電容器（lateral overflow integration capacitors, LOFIC），或光偵測器電路中使用的任何其他類型電容器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An image sensor has a three device layers. Through substrate MIM (TSMIM) capacitors are disposed in the middle device layer. The TSMIM capacitors may replace capacitors that would otherwise be disposed in the metal interconnect structure of the second device layer allowing that metal interconnect structure, particularly the uppermost metallization layer, to be thinner. Thinning that upper metallization layer reduces parasitic capacitance and increases dynamic range. The TSMIM capacitors may be correlated double sampling (CDS) capacitors, lateral overflow integration capacitors (LOFICs), or any other type of capacitor used in a photodetector circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:影像感測器</p>  
        <p type="p">102、112:接合層</p>  
        <p type="p">104:頂層金屬化層</p>  
        <p type="p">106:次頂層金屬化層</p>  
        <p type="p">108:次抵層金屬化層</p>  
        <p type="p">110:最底層金屬化層</p>  
        <p type="p">114:源極/漏極區</p>  
        <p type="p">116:蝕刻停止層</p>  
        <p type="p">118:氧化物層</p>  
        <p type="p">120:閘極電極</p>  
        <p type="p">122:本體區</p>  
        <p type="p">135、169、175:接觸墊</p>  
        <p type="p">128:介電結構</p>  
        <p type="p">134:隔離結構</p>  
        <p type="p">136:第二介電結構</p>  
        <p type="p">137:第二金屬互連結構</p>  
        <p type="p">138:第一電極板</p>  
        <p type="p">140:電容介電層</p>  
        <p type="p">141:第二半導體基板</p>  
        <p type="p">142:第二電極板</p>  
        <p type="p">145:基板穿孔</p>  
        <p type="p">146、168:通孔</p>  
        <p type="p">147:穿基板MIM電容器</p>  
        <p type="p">150:鈍化層疊</p>  
        <p type="p">160:層間介電質</p>  
        <p type="p">161:前側</p>  
        <p type="p">162:第一介電結構</p>  
        <p type="p">163:背側</p>  
        <p type="p">164:介電結構</p>  
        <p type="p">165:電晶體</p>  
        <p type="p">172:接合介電質</p>  
        <p type="p">187、188、189:導線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="656" publication-number="202613940"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613940.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613940</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142227</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示商品套裝之方法及其裝置</chinese-title>  
        <english-title>METHOD OF DISPLAYING PRODUCT SET AND APPARATUS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250408B">G06Q30/0601</main-classification>  
        <further-classification edition="202301120250408B">G06Q30/02</further-classification>  
        <further-classification edition="200601120250408B">G06F3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許乃京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUH, NAEKYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李海妍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HAEYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜珠恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, JU EUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃周安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, JU AN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONGEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李延成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YEONSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　伊萊恩　智英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIM, ELAINE JI YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安田　傑弗瑞　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUDA, JEFFREY WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭志秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GWAK, JISU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種顯示商品套裝之方法及其裝置。本發明之一實施例之方法可包括如下步驟：基於商品之品牌、商品之類別、及商品之價格中之至少一者，確定商品套裝為第1商品套裝抑或為第2商品套裝；響應於確定上述商品套裝為上述第1商品套裝：基於上述第1商品套裝之商品各者之尺寸、體積、大小、價格、容量及商品銷售者輸入之商品詳細資訊中之至少一者，確定上述第1商品套裝中之第1主要商品與第1次要商品；以商品套裝顯示區域之橫向為基準，將上述第1主要商品之影像擴展至第1比率值；以上述商品套裝顯示區域之橫向為基準，將上述第1次要商品之影像擴展至第2比率值；將擴展之上述第1主要商品之影像及擴展之上述第1次要商品之影像顯示於上述商品套裝顯示區域中，上述商品套裝顯示區域包括以上述商品套裝顯示區域之橫向為基準而具有第3比率值之空白區域，上述空白區域位於擴展之上述第1主要商品之影像及擴展之上述第1次要商品之影像之間；響應於確定上述商品套裝為上述第2商品套裝：基於上述第2商品套裝之商品各者之尺寸、體積、大小、價格、容量及商品銷售者輸入之商品詳細資訊中之至少一者，確定上述第2商品套裝中之第2主要商品與第2次要商品；於上述商品套裝顯示區域中之第1區域中顯示上述第2主要商品之影像；及於上述商品套裝顯示區域中之第2區域中顯示上述第2次要商品之影像，上述第1區域大於上述第2區域，上述第2區域視覺上與上述第1區域區分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100:步驟</p>  
        <p type="p">S110:步驟</p>  
        <p type="p">S120:步驟</p>  
        <p type="p">S130:步驟</p>  
        <p type="p">S140:步驟</p>  
        <p type="p">S150:步驟</p>  
        <p type="p">S160:步驟</p>  
        <p type="p">S170:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="657" publication-number="202613670"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613670.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613670</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142245</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於複曲面隱形眼鏡的最佳化後表面</chinese-title>  
        <english-title>OPTIMIZED POSTERIOR SURFACE FOR TORIC CONTACT LENSES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250930B">G02C7/04</main-classification>  
        <further-classification edition="200601120250930B">A61B3/028</further-classification>  
        <further-classification edition="200601120250930B">A61B3/036</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商壯生和壯生視覺關懷公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON &amp; JOHNSON VISION CARE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格利甘　皮耶　伊夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GERLIGAND, PIERRE-YVES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤伊納利　沙羅克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEINALI, SHAHROKH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種用於改進一參考軟式複曲面隱形眼鏡組的方法、一種經改進複曲面隱形眼鏡組、及一種經改進複曲面鏡片。該方法涉及識別該等參考鏡片的幾何特性，該等幾何特性至少包括一目標球面屈光度、該周邊區之該後表面的一曲率半徑、一鏡片中心厚度、一鏡片材料折射率、該光學區直徑、及該過渡區的一外徑；識別該參考複曲面鏡片組的一參考子午線；藉由調整該周邊區的一垂度及該曲率半徑，及/或增加該過渡區的該外徑，減少沿著該參考子午線的斜率偏差；及藉由將該經調整垂度及曲率半徑、及/或該過渡區的該經增加外徑應用至該經改進鏡片組內的所有鏡片來建立該經改進鏡片組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for improving a reference set of soft toric contact lenses, an improved set of toric contact lenses and an improved toric lens are provided. The method involves identifying geometric characteristics of the reference lenses including at least a target sphere power, a radius of curvature of the posterior surface of the peripheral zone, a lens center thickness, a lens material refractive index, the optic zone diameter and an outer diameter of said transition zone; identifying a reference meridian of the reference set of toric lenses; reducing slope deviations along the reference meridian by adjusting a sag and the radius of curvature of the peripheral zone, and/or increasing the outer diameter of the transitional zone; and creating the improved set of lenses by applying the adjusted sag and radius of curvature, and/or increased outer diameter of the transition zone to all lenses within the improved set of lenses.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:鏡片</p>  
        <p type="p">101:內部光學區</p>  
        <p type="p">102:周邊區</p>  
        <p type="p">103:過渡區</p>  
        <p type="p">104:穩定特徵；雙穩定區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="658" publication-number="202614400"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614400.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614400</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142759</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝件及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H01L23/36</main-classification>  
        <further-classification edition="200601120250401B">H01L23/373</further-classification>  
        <further-classification edition="201701120250401B">H01L21/77</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳琮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TSUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪　文興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, WENSEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭榮偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, JUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體封裝件包括基底、晶粒、第一接合材料、第二接合材料和散熱系統。晶粒連接到基底。第一接合材料配置在基底上且在晶粒旁。第二接合材料配置在晶粒上並覆蓋晶粒。散熱系統具有與第二接合材料接觸的底面，配置在晶粒之上的第二接合材料上，且配置在基底上的第一接合材料上。散熱系統通過第一接合材料固定至基底。散熱系統的底面通過第二接合材料固定至晶粒，兩者之間存在有接合界面，且接合界面包括第一曲面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor package includes a substrate, a die, a first bonding material, a second bonding material and a heat dissipation system. The die is connected to the substrate. The first bonding material is disposed on the substrate beside the die. The second bonding material is disposed on and covers the die. The heat dissipation system, having a bottom surface in contact with the second bonding material, is disposed on the second bonding material over the die and on the first bonding material on the substrate. The heat dissipation system is fixed to the substrate through the first bonding material. The bottom surface of the heat dissipation system is fixed to the die through the second bonding material with a bonding interface existing therebetween, and the bonding interface includes a first curved surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100D:切割結構</p>  
        <p type="p">110B:主動表面</p>  
        <p type="p">112:半導體基底</p>  
        <p type="p">138:晶粒連接件</p>  
        <p type="p">140:中介層</p>  
        <p type="p">142:通孔</p>  
        <p type="p">152、180:底部填充劑</p>  
        <p type="p">170:連接件</p>  
        <p type="p">200:基底</p>  
        <p type="p">200T:頂面/表面</p>  
        <p type="p">202、204:連接結構</p>  
        <p type="p">210:第一接合材料</p>  
        <p type="p">250:第二接合材料</p>  
        <p type="p">300:散熱系統</p>  
        <p type="p">310:頂蓋</p>  
        <p type="p">312:頂蓋部分</p>  
        <p type="p">314:框架部分</p>  
        <p type="p">320:中間板</p>  
        <p type="p">330:基板</p>  
        <p type="p">330R:底腳部分</p>  
        <p type="p">332:底板部分</p>  
        <p type="p">332B:下表面/底面/表面</p>  
        <p type="p">332I:上表面/表面</p>  
        <p type="p">334:支撐部分</p>  
        <p type="p">336:彈性柱</p>  
        <p type="p">338:鰭片</p>  
        <p type="p">BF1:接合界面</p>  
        <p type="p">CS1、CS2、CS3:空間</p>  
        <p type="p">OS1:排氣孔/通道</p>  
        <p type="p">OS2:通孔</p>  
        <p type="p">SD1:半導體封裝件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="659" publication-number="202614666"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614666.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614666</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142792</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＬＥＤ背光控制電路</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241202B">H05B45/305</main-classification>  
        <further-classification edition="201601120241202B">G09G3/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商昂寶集成電路股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ON-BRIGHT INTEGRATIONS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李萌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種LED背光控制電路，被配置為在低頻調光信號和高頻調光信號的控制下處於高頻調光狀態或者在高低頻混合調光信號的控制下處於高低頻混合調光狀態的情況下：基於低頻調光信號和高頻調光信號或者基於高低頻混合調光信號生成調光同步信號；基於系統時鐘信號的週期計數或者基於表徵LED背光控制電路的系統輸出電壓的輸出電壓表徵信號生成系統時鐘使能信號；基於系統時鐘信號和系統時鐘使能信號生成調光時鐘信號；以及基於調光同步信號和調光時鐘信號生成用於控制LED背光控制電路中的電晶體從關斷狀態變為導通狀態的導通控制信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">1:比較器</p>  
        <p type="p">500:LED背光控制電路</p>  
        <p type="p">502:調光信號脈寬/頻率偵測模組</p>  
        <p type="p">504:高頻調光增強模組</p>  
        <p type="p">CC_fb:恆流控制回饋電壓</p>  
        <p type="p">FB:燈電流表徵信號</p>  
        <p type="p">Cc_vref,Vref1,Vref2:恆流控制基準電壓</p>  
        <p type="p">Ccomp1:補償電容</p>  
        <p type="p">Cf:電容</p>  
        <p type="p">Cin:輸入電容</p>  
        <p type="p">clk:系統時鐘信號</p>  
        <p type="p">Clk_r:調光時鐘信號</p>  
        <p type="p">Clock_EN:系統時鐘使能信號</p>  
        <p type="p">Cout:輸出電容</p>  
        <p type="p">D1:輸出二極體</p>  
        <p type="p">EA:跨導放大器</p>  
        <p type="p">EN1:調光增強使能信號</p>  
        <p type="p">FBf:濾波後燈電流表徵信號</p>  
        <p type="p">HPWM:高頻調光信號</p>  
        <p type="p">i1:輸入電流</p>  
        <p type="p">Icomp:次諧波補償電流</p>  
        <p type="p">Icsp:電感充磁表徵電流</p>  
        <p type="p">iLED1,iLEDX:燈電流</p>  
        <p type="p">L1:輸出電感</p>  
        <p type="p">LED_min:調光開關最小回饋電壓</p>  
        <p type="p">LHPWM:高低頻混合調光信號</p>  
        <p type="p">LPWM:低頻調光信號</p>  
        <p type="p">Max_duty:最大占空比表徵信號</p>  
        <p type="p">P_min:週期計數控制信號</p>  
        <p type="p">PWM:脈寬調變</p>  
        <p type="p">Q1:電晶體</p>  
        <p type="p">Q21:調光控制開關1</p>  
        <p type="p">Q2X:調光控制開關X</p>  
        <p type="p">Rcomp1:補償電阻</p>  
        <p type="p">Rf:電阻</p>  
        <p type="p">Rs,Rsense:電流感測電阻</p>  
        <p type="p">Rset:恆流設置電阻</p>  
        <p type="p">S1:開關</p>  
        <p type="p">Sum:加法器</p>  
        <p type="p">Syn_dim:調光同步信號</p>  
        <p type="p">Tri_off:關斷控制信號</p>  
        <p type="p">Tri_on:導通控制信號</p>  
        <p type="p">U1:跨導放大器</p>  
        <p type="p">Vcomp:燈電流偏差表徵信號</p>  
        <p type="p">Vcs,Vsense:電流感測信號</p>  
        <p type="p">Vin:直流輸入電壓</p>  
        <p type="p">VLED1,VLEDX:電壓差值表徵信號</p>  
        <p type="p">Vout:系統輸出電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="660" publication-number="202614740"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614740.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614740</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142823</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電容器結構及其形成方法</chinese-title>  
        <english-title>CAPACITOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241202B">H10B12/00</main-classification>  
        <further-classification edition="202301120241202B">H10N97/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃智雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIH-HSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種電容器結構。電容器結構包括底部電極、第一介電層及第一頂部電極。底部電極包括底部及側部，其中側部從底部的邊緣向上延伸，側部包括第一部分及第二部分在第一部分上，以及第一部分的第一寬度小於第二部分的第二寬度。第一介電層在底部電極上。第一頂部電極在第一介電層上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a capacitor structure. The capacitor structure includes a bottom electrode, a first dielectric layer, and a first top electrode. The bottom electrode includes a bottom portion and a side portion, in which the side portion extends upward from an edge of the bottom portion, the side portion includes a first portion and a second portion on the first portion, in which a first width of the first portion is smaller than a second width of the second portion. The first dielectric layer is on the bottom electrode. The first top electrode is on the first dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電容器結構</p>  
        <p type="p">101:電容器</p>  
        <p type="p">102:底部電極</p>  
        <p type="p">102A:第一部分</p>  
        <p type="p">102B:第二部分</p>  
        <p type="p">102C:底部</p>  
        <p type="p">103I:第一介電層</p>  
        <p type="p">103O:第二介電層</p>  
        <p type="p">104I:第一頂部電極</p>  
        <p type="p">104O:第二頂部電極</p>  
        <p type="p">105I:第一填充層</p>  
        <p type="p">105O:第二填充層</p>  
        <p type="p">106:基板</p>  
        <p type="p">106A:底部支撐層</p>  
        <p type="p">106B:中間支撐層</p>  
        <p type="p">106C:頂部支撐層</p>  
        <p type="p">B-B:線</p>  
        <p type="p">C-C:線</p>  
        <p type="p">IS:側</p>  
        <p type="p">OS:側</p>  
        <p type="p">S1:表面</p>  
        <p type="p">S2:表面</p>  
        <p type="p">W1:第一寬度</p>  
        <p type="p">W1':值</p>  
        <p type="p">W1":值</p>  
        <p type="p">W1&lt;sub&gt;MIN&lt;/sub&gt;:最小值</p>  
        <p type="p">W2:第二寬度</p>  
        <p type="p">W2&lt;sub&gt;MAX&lt;/sub&gt;:最大值</p>  
        <p type="p">△X:值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="661" publication-number="202614187"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614187.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614187</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142840</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於清潔半導體製造中使用項目的清潔設備及方法</chinese-title>  
        <english-title>LEANING APPARATUS AND METHOD FOR CLEANING ITEMS USED IN SEMICONDUCTOR FABRICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250317B">H01L21/302</main-classification>  
        <further-classification edition="200601120250317B">B08B3/04</further-classification>  
        <further-classification edition="200601120250317B">B08B3/08</further-classification>  
        <further-classification edition="200601120250317B">B08B7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳楷中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KAI-ZHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝宜霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, YI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昆彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUN-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡育奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YU-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林弘青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HOM-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊宇軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, YU HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為清潔半導體製造中使用的項目，執行至少一個清潔操作。執行至少一個清潔操作後，通過水流過裝有項目的槽來沖洗項目。在沖洗期間，獲取感測器數據，這些數據指示裝有項目的槽中及/或從槽流出的水的至少一個特性。基於感測器數據判斷沖洗停止時間，並在判斷的沖洗停止時間自動停止沖洗。在一些實例中，感測器數據包括指示裝有待清潔項目的槽中及/或從槽流出的水的酸鹼值的感測器數據。在一些這樣的實例中，基於指示酸鹼值的感測器數據已達到穩定狀態的分析來判斷沖洗停止時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To clean an item used in semiconductor fabrication, at least one cleaning operation is performed. After performing the at least one cleaning operation, the item is rinsed by flowing water through a tank containing an item. During the rinsing, sensor data are acquired, which are indicative of at least one property of water in and/or flowing out of the tank containing the item. A rinse stopping time is determined based on the sensor data, and the rinsing is automatically stopped at the determined rinse stopping time. In some examples, the sensor data includes sensor data indicative of pH of water in and/or flowing out of the tank containing the item to be cleaned. In some such examples, the rinse stopping time is determined based on analysis that the sensor data indicative of pH has reached a steady state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">60:電子控制器</p>  
        <p type="p">70、72:感測器</p>  
        <p type="p">S1:沖洗/步驟</p>  
        <p type="p">S2:酸洗/步驟</p>  
        <p type="p">S3:沖洗/步驟</p>  
        <p type="p">S4:吹乾/步驟</p>  
        <p type="p">SD:感測器數據</p>  
        <p type="p">SS:停止訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="662" publication-number="202614387"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614387.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614387</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113142871</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝件及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250527B">H01L23/31</main-classification>  
        <further-classification edition="200601120250527B">H01L23/535</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱肇瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHAO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, HSUAN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裴浩然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEI, HAO-JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林修任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIU-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝靜華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHING-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體封裝件包括並排佈置的第一晶粒和第二晶粒、側向地覆蓋第一晶粒和第二晶粒的包封體以及下伏於包封體的內連線結構。第一晶粒和第二晶粒中的每一者包括彼此相對的前側和背側。第二晶粒還包括在背側的光學介面，第二晶粒的背側的頂面和光學介面被包封體暴露出來。內連線結構連接到第一和第二晶粒的前側，並且第二晶粒藉由內連線結構與第一晶粒電性耦合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor package includes a first die and a second die disposed side-by-side, an encapsulant laterally covering the first die and the second die, and an interconnect structure underlying the encapsulant. Each of the first die and the second die includes a front side and a back side opposite to each other. The second die further includes an optical interface at the back side, and a top surface of the back side of the second die and the optical interface are exposed by the encapsulant. The interconnect structure is connected to the front sides of the first and second dies, and the second die is electrically coupled to the first die through the interconnect structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:裝置封裝件</p>  
        <p type="p">110、120、130:IC晶粒</p>  
        <p type="p">131:光學元件</p>  
        <p type="p">131L:光學介面</p>  
        <p type="p">132:PIC</p>  
        <p type="p">134:EIC</p>  
        <p type="p">136:介電層</p>  
        <p type="p">140:中介物</p>  
        <p type="p">146:內連線結構</p>  
        <p type="p">147:接觸墊</p>  
        <p type="p">148:導電凸塊</p>  
        <p type="p">152:包封體</p>  
        <p type="p">220:封裝基底</p>  
        <p type="p">222:基底芯子</p>  
        <p type="p">224:接合墊</p>  
        <p type="p">226:外部端子</p>  
        <p type="p">228:底部填充劑層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="663" publication-number="202614512"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614512.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614512</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143048</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器及電子設備的配件</chinese-title>  
        <english-title>CONNECTOR AND ASSEMBLY OF ELECTRONIC APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120241204B">H01R13/6581</main-classification>  
        <further-classification edition="200601120241204B">H05K9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞立德精密工業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN LEADER PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐紅強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, HONGQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及一種連接器及電子設備的配件，連接器包括殼結構和絕緣結構、端子組件以及屏蔽結構。絕緣結構設置於殼結構內。端子組件包括第一信號端子組和第二信號端子組，第一信號端子組和第二信號端子組沿連接器的厚度方向相對設置，且第一信號端子組的至少部分結構和第二信號端子組的至少部分結構埋設於絕緣結構內。屏蔽結構至少部分結構埋設於絕緣結構內；屏蔽結構包括中間屏蔽件，中間屏蔽件位於第一信號端子組和第二信號端子組之間。位於連接器的第一端的中間屏蔽件設置有接地端子；位於連接器的第一端的第一信號端子組、第二信號端子組以及接地端子呈同排並列設置。優化了端子組件的結構布局，薄化了連接器的整體厚度和尺寸，有利於提升連接器的緊湊性和美觀性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is related to a connector and an assembly of an electronic apparatus, and the connector includes a cover structure and an insulation structure, a terminal assembly and a shielding structure. The insulation structure is disposed inside the cover structure. The terminal assembly includes a first signal terminal module and a second signal terminal module which are relatively disposed along the thickness direction of the connector, and at least one part of the first signal terminal module and at least one part of the second signal terminal module are embedded inside the insulation structure. At least one part of the shielding structure is embedded inside the insulation structure; the shielding structure includes a middle shielding component located between the first signal terminal module and the second signal terminal module. A ground terminal is disposed on the middle shielding component located on the first terminal of the connector; the first signal terminal module, the second signal terminal module and the ground terminal located on the first terminal of the connector are disposed side by side. The foregoing configuration can optimize the distribution of the terminal assembly and thin the size and the thickness of the connector, and it is beneficial to improve the compactness and the appearance of the connector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:殼結構</p>  
        <p type="p">121:第一絕緣件</p>  
        <p type="p">121131:限位凹槽</p>  
        <p type="p">122:第二絕緣件</p>  
        <p type="p">123:第三絕緣件</p>  
        <p type="p">13:端子組件</p>  
        <p type="p">131:第一信號端子組</p>  
        <p type="p">132:第二信號端子組</p>  
        <p type="p">14:屏蔽結構</p>  
        <p type="p">141:中間屏蔽件</p>  
        <p type="p">142:第二屏蔽件</p>  
        <p type="p">143:第一屏蔽件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="664" publication-number="202613694"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613694.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613694</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143085</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鏡頭以及車輛</chinese-title>  
        <english-title>LENS AND VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250109B">G03B17/02</main-classification>  
        <further-classification edition="202101120250109B">G02B7/00</further-classification>  
        <further-classification edition="202201120250109B">B60R1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新煒科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAYPRUS TECHNOLOGIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周源栩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, YUAN-HSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種鏡頭，包括第一筒件以及第二筒件。第一筒件包括第一筒體以及設置於所述第一筒體一端之第一連接部。第二筒件包括第二筒體以及第二連接部，所述第二連接部用於與所述第一連接部連接；所述第二筒體遠離所述第二連接部之一端用於與一電路板黏接。所述第二筒件之熱膨脹係數與所述電路板之熱膨脹係數之差值之絕對值小於所述第一筒件之熱膨脹係數與所述電路板之熱膨脹係數之差值之絕對值。本申請還提供一種包括上述鏡頭之車輛。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a lens. The lens includes a first barrel and a second barrel. The first barrel includes a first barrel body and a first connecting part arranged at one end of the first barrel body. The second barrel includes a second barrel body and a second connecting part. The second connecting part is used to connect with the first connecting part. One end of the second barrel body away from the second connecting part is used for bonding with a circuit board. The absolute value of the difference between the thermal expansion coefficient of the second barrel body and the thermal expansion coefficient of the circuit board is less than the absolute value of the difference between the thermal expansion coefficient of the first barrel body and the thermal expansion coefficient of the circuit board. The present disclosure also provides a vehicle including the lens.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:鏡頭</p>  
        <p type="p">1:第一筒件</p>  
        <p type="p">11:第一筒體</p>  
        <p type="p">13:第一連接部</p>  
        <p type="p">3:第二筒件</p>  
        <p type="p">31:第二筒體</p>  
        <p type="p">5:電路板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="665" publication-number="202613899"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613899.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613899</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143123</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以實現拉取請求合併自動化之裝置及方法</chinese-title>  
        <english-title>APPARATUS AND METHOD FOR AUTOMATING PULL REQUEST MERGING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">G06Q10/04</main-classification>  
        <further-classification edition="202301120250801B">G06Q10/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用以實現拉取請求合併自動化之裝置及方法。一實施例之拉取請求合併自動化方法可包括如下步驟：接收與第1分支之代碼變更事項對應之第1拉取請求；基於包括在第1拉取請求中之資訊，驗證第1拉取請求是否滿足預設之狀態條件；及於第1拉取請求滿足狀態條件之情形時，根據預設之合併方式來將與第1拉取請求對應之代碼變更事項合併至基準分支。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="666" publication-number="202613929"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613929.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613929</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143201</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以顯示物品之評論資訊之裝置、方法及記錄媒體</chinese-title>  
        <english-title>DEVICE, METHOD, AND RECORDING MEDIUM FOR DISPLAYING REVIEW INFORMATION OF ITEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250624B">G06Q30/0282</main-classification>  
        <further-classification edition="202301120250624B">G06Q30/0601</further-classification>  
        <further-classification edition="202001120250624B">G06F40/289</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金秀正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUJUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金妍才</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YEONJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高正妍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, JUNGYOUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　寶藍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BO RAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種用以顯示物品之評論資訊之方法。本發明一實施例之方法可包括如下步驟：自用戶終端獲得用戶對第1頁面之連接請求，該第1頁面包括目標物品之詳細資訊；識別與上述目標物品對應之一個以上之評論資訊；基於上述一個以上之評論資訊來提取一個以上之評論關鍵字；以如下方式產生用於輸出上述第1頁面之第1頁面資訊，即，於上述第1頁面之至少一部分包括用以顯示上述一個以上之評論關鍵字之評論關鍵字區域；及將上述第1頁面資訊傳輸至上述用戶終端；且與上述目標物品對應之上述一個以上之評論資訊各者包括上述目標物品之評論分數資訊及詳細評價資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:電子裝置</p>  
        <p type="p">102:用戶終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="667" publication-number="202613616"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613616.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613616</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143283</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND FORMING METHOD OF THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250523B">G02B6/12</main-classification>  
        <further-classification edition="200601120250523B">G02B6/13</further-classification>  
        <further-classification edition="200601120250523B">G02B6/136</further-classification>  
        <further-classification edition="200601120250523B">G02B6/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MING-FA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭浩天</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HAO-TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒家翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, CHIA-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例的半導體裝置包括光子晶粒和反射耦合器。光子晶粒包括邊緣耦合器。反射耦合器的至少一部分配置在光子晶粒外。來自邊緣耦合器的光被反射耦合器反射，或光被反射耦合器反射然後入射到邊緣耦合器中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a photonic die and a reflector coupler. The photonic die includes an edge coupler. At least a portion of the reflector coupler is disposed outside the photonic die. A light from the edge coupler is reflected by the reflector coupler, or a light is reflected by the reflector coupler and then incident into the edge coupler.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:封裝元件</p>  
        <p type="p">102、122、140、166、178、190:介電層</p>  
        <p type="p">102a、138a、138b、178a、184a、184b:表面</p>  
        <p type="p">110:光子晶粒</p>  
        <p type="p">110s1、110s2、160s1、160s2、180s1、200s1、200s2、210s1:側壁</p>  
        <p type="p">120、164:互連結構</p>  
        <p type="p">124、168、214:導電特徵</p>  
        <p type="p">126:穿孔</p>  
        <p type="p">130:光學裝置</p>  
        <p type="p">132:光波導</p>  
        <p type="p">134:調變器</p>  
        <p type="p">136:光學耦合器</p>  
        <p type="p">138:邊緣耦合器</p>  
        <p type="p">150、170:接合結構</p>  
        <p type="p">152、172:接合介電層</p>  
        <p type="p">154、174:接合通孔</p>  
        <p type="p">156、176:接合墊</p>  
        <p type="p">160:電子晶粒</p>  
        <p type="p">162:半導體基底</p>  
        <p type="p">180:包封體</p>  
        <p type="p">184:反射耦合器</p>  
        <p type="p">200:支撐晶粒</p>  
        <p type="p">202:光學透鏡</p>  
        <p type="p">210:重分布層結構</p>  
        <p type="p">212:絕緣層</p>  
        <p type="p">220:導電連接件</p>  
        <p type="p">LB:光束</p>  
        <p type="p">θ1、θ2:角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="668" publication-number="202614788"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614788.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614788</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143301</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250529B">H10D30/01</main-classification>  
        <further-classification edition="200601120250529B">H01L21/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝志宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘國華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, KUO-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例的一面向關於一種裝置。此裝置包含在基底上方且沿著第一方向縱向延伸的主動區；在基底上方且圍繞主動區的隔離結構；在主動區上方且沿著垂直於第一方向的第二方向縱向延伸之第一閘極結構和第二閘極結構；在主動區上方的層間介電層；以及設置在第一閘極結構和第二閘極結構之間且沿著第二方向縱向延伸的切割部件。切割部件切穿層間介電層和主動區以將主動區分成兩段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One aspect of the present disclosure pertains to a device. The device includes an active region over a substrate and extending lengthwise along a first direction; an isolation structure over the substrate and surrounding the active region; first and second gate structures over the active region and extending lengthwise along a second direction perpendicular to the first direction; an interlayer dielectric (ILD) layer over the active regions; and a cut feature disposed between the first and the second gate structures and extending lengthwise along the second direction. The cut feature cuts through the ILD layer and the active region to separate the active region into two segments.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202:基底</p>  
        <p type="p">204:主動區</p>  
        <p type="p">204a:通道區</p>  
        <p type="p">204b:源極/汲極區</p>  
        <p type="p">215:切割部件</p>  
        <p type="p">218:金屬閘極結構</p>  
        <p type="p">219:層間介電層</p>  
        <p type="p">221:接觸蝕刻停止層</p>  
        <p type="p">223:層間介電層</p>  
        <p type="p">X,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="669" publication-number="202613909"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613909.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613909</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143383</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其物品分配方法</chinese-title>  
        <english-title>ELECTRONIC APPARATUS AND ASSIGNING ITEMS METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250423B">G06Q10/087</main-classification>  
        <further-classification edition="202301120250423B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴佑正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, WOO JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白鉉昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAEK, HYEON CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種藉由電子裝置來進行之物品分配方法。物品分配方法可包括如下步驟：獲得包括至少一個物品之資訊之第1訂購資訊；產生用以將與至少一個物品對應之至少一個SKU包裝成最小包裹來進行配送之至少一個出貨資訊；基於與包括上述至少一個出貨資訊之複數個出貨資訊各者對應之出庫結束時刻之資訊，將第1物流中心內之庫存分配給上述複數個出貨資訊中之對應之出庫結束時刻最早之一個以上之第1出貨資訊；及基於與上述複數個出貨資訊各者對應之出庫結束時刻之資訊，將上述第1物流中心內之庫存分配給上述複數個出貨資訊中之對應之出庫結束時刻第二早之一個以上之第2出貨資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:裝置</p>  
        <p type="p">140:資料庫</p>  
        <p type="p">S300:步驟</p>  
        <p type="p">S310:步驟</p>  
        <p type="p">S320:步驟</p>  
        <p type="p">S330:步驟</p>  
        <p type="p">S340:步驟</p>  
        <p type="p">S350:步驟</p>  
        <p type="p">S360:步驟</p>  
        <p type="p">S370:步驟</p>  
        <p type="p">S380:步驟</p>  
        <p type="p">S390:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="670" publication-number="202614381"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614381.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614381</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143390</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體晶粒、半導體封裝件及半導體晶粒的製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DIE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR DIE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250320B">H01L23/28</main-classification>  
        <further-classification edition="200601120250320B">H01L23/488</further-classification>  
        <further-classification edition="200601120250320B">H01L23/535</further-classification>  
        <further-classification edition="200601120250320B">H01L21/56</further-classification>  
        <further-classification edition="200601120250320B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李怡蓁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張任遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JEN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體晶粒，其包括半導體基底、內連結構、電容結構、重佈線層和接合導體。內連結構設置在半導體基底上。電容結構設置於內連結構上。重佈線層設置在內連結構上並電性連接到內連結構。接合導體與電容結構在接合導體的側壁處電性接觸和物理接觸，其中重佈線層位於比接合導體低的水平處。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor die including a semiconductor substrate, an interconnect structure, a capacitor conductor, a redistribution layer and a bonding structure is provided. The interconnect structure is disposed on the semiconductor substrate. The capacitor structure is disposed on the interconnect structure. The redistribution layer is disposed on and electrically connected to the interconnect structure. The bonding conductor is electrically and physically in contact with the capacitor structure at a sidewall of the bonding conductor, wherein the redistribution layer is located at a lower level than the bonding conductor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體晶粒</p>  
        <p type="p">110:半導體基底</p>  
        <p type="p">112:裝置</p>  
        <p type="p">120:內連線結構</p>  
        <p type="p">121、171、173、175、192:介電層</p>  
        <p type="p">122:導電圖案</p>  
        <p type="p">122a:佈線跡線</p>  
        <p type="p">122b:通孔</p>  
        <p type="p">123、182:蝕刻停止層</p>  
        <p type="p">130:密封環</p>  
        <p type="p">140、180:鈍化層</p>  
        <p type="p">150:重佈線層</p>  
        <p type="p">160:間隙填充介電層</p>  
        <p type="p">170:電容結構</p>  
        <p type="p">172、174:電極層</p>  
        <p type="p">194:接合導體</p>  
        <p type="p">194a:導電墊</p>  
        <p type="p">194b:導通孔</p>  
        <p type="p">X、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="671" publication-number="202614784"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614784.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614784</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143437</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造電容的方法</chinese-title>  
        <english-title>METHOD FOR FABRICATING A CAPACITOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250102B">H10D1/62</main-classification>  
        <further-classification edition="200601120250102B">H01L21/20</further-classification>  
        <further-classification edition="200601120250102B">H01L21/302</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐寜霜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, NING-SHUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製造電容的方法包括：形成模具於內連接層上；形成凹槽於模具中；沉積下電極層於模具上以及凹槽中；設置金屬氧化層於下電極層上以及凹槽中；形成表面氧化層於金屬氧化層上；以及進行無氧濕蝕刻製程，以將表面氧化層、金屬氧化層以及模具從下電極層移除。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for fabricating a capacitor includes: forming a mold on an interconnect layer; forming a recess in the mold; depositing a bottom electrode layer on the mold and into the recess; disposing a metal oxide layer on the bottom electrode layer and into the recess; forming a surface oxide layer on the metal oxide layer; and performing a non-O2 wet etching process to remove the surface oxide layer, the metal oxide layer, and the mold from the bottom electrode layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:電容</p>  
        <p type="p">220:內連接層</p>  
        <p type="p">222:介電材料</p>  
        <p type="p">224:金屬特徵</p>  
        <p type="p">226:介電襯墊</p>  
        <p type="p">260:下電極層</p>  
        <p type="p">700:介電層</p>  
        <p type="p">800:上電極層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="672" publication-number="202614368"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614368.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614368</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143601</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>堆疊結構及其製造方法</chinese-title>  
        <english-title>STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250620B">H01L23/043</main-classification>  
        <further-classification edition="200601120250620B">H01L23/535</further-classification>  
        <further-classification edition="200601120250620B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾明慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, MING-TSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林詠淇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUNG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳燕銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供包括第一接合結構、第一晶粒和第二晶粒的堆疊結構。第一晶粒配置在第一接合結構的第一側上，且第一晶粒包括第二接合結構。第一包封體材料包覆第一晶粒。第二晶粒配置在第一接合結構與第一側相對的第二側上，且第二晶粒包括第三接合結構和晶粒穿孔。第二包封體材料包覆第二晶粒。第一晶粒的第二接合結構與第一接合結構接合，且第二晶粒的第三接合結構與位於第一和第二晶粒以及第一和第二包封體材料之間的第一接合結構接合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A stacking structure including a first bonding structure, a first die and a second die is provided. The first die is disposed on a first side of the first bonding structure, and the first die includes a second bonding structure. A first encapsulation material wraps around the first die. The second die is disposed on a second side of the first bonding structure opposite to the first side, and the second die includes a third bonding structure and through die vias. A second encapsulation material wraps around the second die. The second bonding structure of the first die is bonded with the first bonding structure, and the third bonding structure of the second die is bonded with the first bonding structure located between the first and second dies and the first and second encapsulation materials.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10A、10B、20A、20B:晶粒</p>  
        <p type="p">10AV、10BV:基底穿孔</p>  
        <p type="p">16A、16B、36:接合結構</p>  
        <p type="p">35:3D堆疊結構</p>  
        <p type="p">26A、26B:接合膜</p>  
        <p type="p">30:支撐件</p>  
        <p type="p">32:輔助介電層</p>  
        <p type="p">34、38:包封體材料</p>  
        <p type="p">40:重佈線路層</p>  
        <p type="p">42:連接件</p>  
        <p type="p">364:電性浮置金屬標記</p>  
        <p type="p">AM3:非金屬對準標記</p>  
        <p type="p">RC3:凹槽</p>  
        <p type="p">T1:厚度、上部結構</p>  
        <p type="p">T2:厚度、下部結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="673" publication-number="202614625"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614625.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614625</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143694</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成像系統控制方法、計算器存儲介質和相關裝置</chinese-title>  
        <english-title>IMAGE SYSTEM CONTROL METHOD, COMPUTER STORAGE MEDIUM AND DEVICE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120241204B">H04N23/667</main-classification>  
        <further-classification edition="202301120241204B">H04N23/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游智翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHIH-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉晉利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, JIN-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳子涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TZU-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李易</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐綺蔚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秉憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, PING-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種成像系統控制方法、相關裝置以及計算機可讀介質。成像系統控制方法包括：操作多個相機模塊中的第一相機模塊以生成至少一個第一幀；操作多個相機模塊中的第二相機模塊以生成至少一個第二幀；基於至少一個第一幀生成第一統計資料並基於至少一個第二幀生成第二統計資料；以及基於至少第一統計資料確定第一相機模塊的成像控制參數的第一調整目標。本發明的成像系統控制方法、相關裝置以及計算機可讀介質增強了攝影和攝像會話期間的用戶體驗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of controlling an imaging system having a plurality of camera modules includes: operating a first camera module of the plurality of camera modules to generate at least one first frame; operating a second camera module of the plurality of camera modules to generate at least one second frame; generating first statistics based on the at least one first frame and generating second statistics based on the at least one second frame; and determining a first tuning target of imaging control parameters of the first camera module based on at least the first statistics.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101-S104:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="674" publication-number="202614874"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614874.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614874</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143843</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路元件及其形成方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT DEVICE AND FORMATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250401B">H10F39/12</main-classification>  
        <further-classification edition="202501120250401B">H10F39/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高敏峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO, MIN-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江彥廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YEN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉人誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇泊沅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, BO-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一些實施例涉及具有積體電路層的積體電路裝置。積體電路層包括基底。基底包括靠近基底第一側的多個光偵測器以及在光偵測器之間且鄰近基底第一側的多個浮置擴散區。積體電路層還包括位於介電層內的多個導電結構。介電層包括定位在基底第一側上的第一側。導電結構包括在介電層第二側的多個導電接合結構。介電層的第二側與介電層第一側相對。導電結構還包括多個導電接觸結構。每個導電接觸結構將對應浮置擴散區連接到對應導電接合結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some embodiments relate to an integrated circuit (IC) device having an IC layer including a substrate. The substrate includes a plurality of photodetectors proximate a first side of the substrate and a plurality of floating diffusion regions among the photodetectors and proximate the first side of the substrate. The IC layer further includes a plurality of conductive structures located within a dielectric layer that includes a first side positioned on the first side of the substrate. The conductive structures include a plurality of conductive bonding structures at a second side of the dielectric layer opposite the first side of the dielectric layer. The conductive structures further include a plurality of conductive contact structures. Each of the conductive contact structures connects a corresponding one of the floating diffusion regions to a corresponding one of the conductive bonding structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102A、102B:IC層</p>  
        <p type="p">104:像素胞元</p>  
        <p type="p">105A:像素胞元群組</p>  
        <p type="p">106A:浮置擴散結構</p>  
        <p type="p">304:源極隨耦電晶體</p>  
        <p type="p">306:列選擇電晶體</p>  
        <p type="p">307:重置電晶體</p>  
        <p type="p">501:浮置擴散區</p>  
        <p type="p">502:基底</p>  
        <p type="p">504:介電層</p>  
        <p type="p">506:光敏區</p>  
        <p type="p">508A、508B:傳輸閘極結構</p>  
        <p type="p">513A、513B:導電接合結構</p>  
        <p type="p">515A、515B、517:導電接觸結構</p>  
        <p type="p">518:濾光器</p>  
        <p type="p">520:透鏡</p>  
        <p type="p">522、523:導電接合結構</p>  
        <p type="p">524:導電層</p>  
        <p type="p">525:導電通孔</p>  
        <p type="p">526:3D-MIM電容器</p>  
        <p type="p">530:多晶矽電容</p>  
        <p type="p">532:轉換增益電路</p>  
        <p type="p">534:電壓域全局快門電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="675" publication-number="202614838"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614838.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614838</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143917</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250703B">H10D64/01</main-classification>  
        <further-classification edition="202501120250703B">H10D30/01</further-classification>  
        <further-classification edition="200601120250703B">H01L21/3065</further-classification>  
        <further-classification edition="202501120250703B">H10D62/17</further-classification>  
        <further-classification edition="202501120250703B">H10D64/27</further-classification>  
        <further-classification edition="202501120250703B">H10D30/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭宇正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIAU, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉韋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張振維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉超慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHAO-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱于庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CIOU, YU-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭治棠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, CHIH-TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃泰鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TAI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李資良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TZE-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於調製金屬閘極輪廓的方法和結構。所述方法包括提供具有多個半導體通道層的磊晶層堆疊的鰭片。在多個半導體通道層的相鄰半導體通道層的表面之上沉積襯層。對襯層進行電漿處理製程。去除經電漿處理襯層的第一部分，以在相鄰半導體通道層之間形成間隙，且經電漿處理襯層的第二部分保留設置在相鄰半導體通道層的表面上。在去除經電漿處理襯層的第一部分之後，在間隙內形成閘極結構，其中閘極結構具有凸形或凹形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and structures for modulating a metal gate profile include providing a fin having an epitaxial layer stack with a plurality of semiconductor channel layers. A liner layer is deposited over surfaces of adjacent semiconductor channel layers of the plurality of semiconductor channel layers. A plasma treatment process is performed to the liner layer. A first portion of the plasma-treated liner layer is removed to form a gap between the adjacent semiconductor channel layers, while a second portion of the plasma-treated liner layer remains disposed on surfaces of the adjacent semiconductor channel layers. After removing the first portion of the plasma-treated liner layer, a gate structure is formed within the gap, where the gate structure has a convex shape or a concave shape.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:方法</p>  
        <p type="p">202,204,206,208,210,212,214,216,218,220,222:區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="676" publication-number="202614702"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614702.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614702</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113143983</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>擴充卡支架、加熱器模組及應用其之室外組件</chinese-title>  
        <english-title>EXPANSION CARD BRACKET, HEATER MODULE AND OUTDOOR COMPONENT USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250625B">H05K7/02</main-classification>  
        <further-classification edition="200601120250625B">H05K7/14</further-classification>  
        <further-classification edition="200601120250625B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣達電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUANTA COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳逸傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳岳璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YUEH-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王得權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TE-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳韋儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱家慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, CHIA-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露為一種允許擴充卡在極冷條件下操作的擴充卡支架。 擴充卡支架包括具有頂表面的一底板以固定擴充卡。穿過底板形成的一開孔。具有一薄膜加熱器的加熱器模組配接到底板。加熱器模組與開孔對齊以加熱擴充卡的一區域。薄膜加熱器與擴充卡之間插入一導熱墊。擴充卡支架允許在安裝擴充卡後連接加熱器模組，以達到更好的熱傳輸並防止導熱墊意外損壞或錯位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An expansion card bracket for allowing operation of an expansion card in extreme cold conditions is disclosed. The expansion card bracket includes a base plate having a top surface to hold the expansion card. An aperture is formed through the base plate. A heater module with a thin film heater is attached to the base plate. The heater module is aligned with the aperture to heat an area of the expansion card. A thermal pad is inserted between the thin film heater and the expansion card. The expansion card bracket allows the heater module to be attached after the installation of the expansion card to allow for better thermal transmission and to prevent inadvertent damage or misalignment of the thermal pad.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">146:直豎立板</p>  
        <p type="p">150:擴充卡支架</p>  
        <p type="p">154:連接器插座</p>  
        <p type="p">310:底板</p>  
        <p type="p">312:散熱器模組</p>  
        <p type="p">314,316:側壁</p>  
        <p type="p">318:突片</p>  
        <p type="p">320:開孔</p>  
        <p type="p">330:散熱器板</p>  
        <p type="p">332:薄膜加熱器</p>  
        <p type="p">334:導熱墊</p>  
        <p type="p">336:凸起支撐件</p>  
        <p type="p">340:角突片</p>  
        <p type="p">342:螺絲孔</p>  
        <p type="p">370:螺孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="677" publication-number="202614789"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614789.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614789</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144030</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250624B">H10D30/01</main-classification>  
        <further-classification edition="200601120250624B">H01L21/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈宗翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, TSUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡有泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YU-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李威縉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WEI-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉冠廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, KUAN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　志安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUI, CHI ON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供半導體裝置及其形成方法。其方法包括：在置於基底上方的鰭狀物中的第一奈米結構的周圍，形成第一功函數金屬層；將第一功函數金屬層至少局部氧化，其中在鰭狀物的堆疊中的第一奈米結構與鄰接的第二奈米結構之間的第一功函數金屬層被氧化得較少；從第一奈米結構的周圍移除第一功函數金屬層的被氧化部分；以及在第一奈米結構的周圍形成第二功函數金屬層，其中第一功函數金屬層與第二功函數金屬層填入第一奈米結構與鄰接的第二奈米結構之間的一空孔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device and method of forming is provided. The method includes forming a first work function metal layer around a first nanostructure in a fin disposed over a substrate, oxidizing at least a portion of the first work function metal layer, where less of the first work function metal layer is oxidized between the first nanostructure and an adjacent second nanostructure in a stack in the fin, removing oxidized portions of the first work function metal layer from around the first nanostructure, and forming a second work function metal layer around the first nanostructure, where the first work function metal layer and the second work function metal layer fill a void between the first nanostructure and the adjacent second nanostructure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50N:n型區</p>  
        <p type="p">50P:p型區</p>  
        <p type="p">54:第二奈米結構</p>  
        <p type="p">66:鰭狀物</p>  
        <p type="p">68:淺溝槽隔離區</p>  
        <p type="p">100:閘極介電層</p>  
        <p type="p">102A:第一功函數金屬層</p>  
        <p type="p">102B:第二功函數金屬層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="678" publication-number="202613573"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613573.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613573</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144056</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測試半導體封裝結構的測試系統</chinese-title>  
        <english-title>TEST SYSTEM FOR TESTING SEMICONDUCTOR PACKAGE STRUCTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120241125B">G01R31/26</main-classification>  
        <further-classification edition="200601120241125B">G01R1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李芳州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, FANG-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾淑容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, SHU-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游輝昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HUI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露了測試半導體封裝結構的測試系統和方法，包括改進的接觸片設計，其提供改進的測試可靠性並最小化對封裝結構的損壞。接觸片包括晶粒推動器，其具有在包括一個或多個晶粒和密封劑材料的區域中接觸封裝結構的上表面的下表面。晶粒推動器的下表面包括非平面輪廓形狀，例如凸形或凹形形狀，其與封裝結構的上表面的非平面形狀互補。晶粒推動器的下表面包括溝槽，當晶粒推動器接觸封裝結構的上表面時，溝槽對應於封裝結構的相鄰晶粒之間的間隙的位置。接觸片可以更均勻地向封裝結構施加壓力，以提高測試可靠性，同時最小化損壞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Test systems and methods testing semiconductor package structures including an improved contact blade design that provides improved testing reliability and minimizes damage to the package structure. The contact blade includes a “die pusher” having a lower surface that contacts an upper surface of the package structure in a region including one or more dies and an encapsulant material. The lower surface of the die pusher includes a non-planar contoured shape, such as a convex or concave shape, that is complementary to the non-planar shape of the upper surface of the package structure. The lower surface of the die pusher includes a trench that corresponds to the location of a gap between adjacent dies of the package structure when the die pusher contacts the upper surface of the package structure. The contact blade may apply pressure more evenly to the package structure to improve test reliability while minimizing damage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:多晶片模組(MCM)封裝/半導體封裝結構/半導體封裝</p>  
        <p type="p">101:封裝基板/基板</p>  
        <p type="p">102:第一表面/上表面/第一側</p>  
        <p type="p">103a:第一晶粒/晶粒</p>  
        <p type="p">103b:第二晶粒/晶粒</p>  
        <p type="p">104:第二表面/第二側</p>  
        <p type="p">106:間隙</p>  
        <p type="p">107:接合特徵</p>  
        <p type="p">109:密封劑材料</p>  
        <p type="p">110:上表面</p>  
        <p type="p">111:接合墊</p>  
        <p type="p">200:測試系統</p>  
        <p type="p">201:插座底座</p>  
        <p type="p">202:測試頭</p>  
        <p type="p">203:控制器</p>  
        <p type="p">204:插座外殼/外殼</p>  
        <p type="p">205:插座外殼板</p>  
        <p type="p">206:插座</p>  
        <p type="p">207:插座外殼側壁</p>  
        <p type="p">213:接觸針</p>  
        <p type="p">214:機械擋塊</p>  
        <p type="p">215:電路板/負載板</p>  
        <p type="p">217:下表面</p>  
        <p type="p">218:溝槽</p>  
        <p type="p">219:開口</p>  
        <p type="p">220:接觸片</p>  
        <p type="p">221:卡盤</p>  
        <p type="p">223:晶粒推動器</p>  
        <p type="p">224:上部</p>  
        <p type="p">225:下部</p>  
        <p type="p">hd2:第二水平方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="679" publication-number="202613932"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613932.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613932</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144197</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供資訊之電子裝置之動作方法及支持其之電子裝置</chinese-title>  
        <english-title>OPERATING METHOD FOR ELECTRONIC APPARATUS FOR PROVIDING INFORMATION AND ELECTRONIC APPARATUS SUPPORTING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250502B">G06Q30/06</main-classification>  
        <further-classification edition="201301120250502B">G06F3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明，揭示一種藉由電子裝置而提供資訊之方法，其包括如下步驟：獲得用以實行與服務相關之測試之輸入；對應於上述輸入而確認測試執行資訊，該測試執行資訊係用以於上述服務之平台中執行上述測試者；基於上述測試執行資訊而實行上述測試；及提供與上述測試之實行對應之測試實行結果資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301:動作</p>  
        <p type="p">303:動作</p>  
        <p type="p">305:動作</p>  
        <p type="p">307:動作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="680" publication-number="202613905"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613905.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613905</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144198</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其顯示頁面之方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND METHOD OF DISPLAYING PAGE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250502B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250502B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉文廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WENTING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張來梁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LAILIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張瑾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施例之藉由電子裝置而實行之顯示頁面的方法可包括如下步驟：顯示商品之詳細頁面；接收第1用戶輸入，該第1用戶輸入係用以於上述商品之詳細頁面中選擇至少一個選項者；產生對應於上述第1用戶輸入而選擇之至少一個選項之狀態資訊；向伺服器傳輸上述商品之詳細頁面之刷新請求及上述狀態資訊；自上述伺服器接收包括刷新之商品之詳細頁面之資訊的應答；及顯示刷新之上述商品之詳細頁面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:系統</p>  
        <p type="p">100:電子裝置</p>  
        <p type="p">200:伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="681" publication-number="202613794"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613794.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613794</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144363</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>圖形用戶界面提供方法及支持其的電子裝置</chinese-title>  
        <english-title>METHOD FOR PROVIDING GRAPHICAL USER INTERFACE AND ELECTRONIC DEVICE SUPPORTING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250208B">G06F3/048</main-classification>  
        <further-classification edition="200601120250208B">G06F17/40</further-classification>  
        <further-classification edition="202301120250208B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓承美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, SEUNGMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　凱瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CATHERINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜河羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, HARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金宥菈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOO RA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔允貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, YUNJEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪　國威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, KUOWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一實施例的圖形用戶界面提供方法可由至少一個處理器執行。這種圖形用戶界面提供方法可包括如下步驟：從外部電子裝置接收對于應用程序的第一頁的第一訪問請求；響應于所接收的第一訪問請求，判斷與外部電子裝置相關的用戶賬戶是否滿足與應用程序的會員服務相關的條件；以及響應于判斷爲用戶賬戶滿足條件，向外部電子裝置發送將與會員服務相關的至少一個內容包含在內的與第一圖形用戶界面相關的信息。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for providing a graphical user interface (GUI) according to an embodiment of the disclosure may be performed by at least one processor. The method for providing the GUI may include receiving, from an external electronic device, a first access request to access a first page of an application, in response to receiving the first access request, determining whether a user account associated with the external electronic device meets condition related to a membership service of the application, and in response to determining that the user account meets the condition, transmitting, to the external electronic device, information on a first GUI including at least one content related to the membership service.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">200:網絡</p>  
        <p type="p">300:外部電子裝置</p>  
        <p type="p">410:第一頁</p>  
        <p type="p">420:第一圖形用戶界面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="682" publication-number="202613933"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613933.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613933</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144365</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>商品信息提供方法及裝置</chinese-title>  
        <english-title>METHOD AND DEVICE FOR PROVIDING PRODUCT INFORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250211B">G06Q30/06</main-classification>  
        <further-classification edition="202401120250211B">G06Q10/08</further-classification>  
        <further-classification edition="200601120250211B">G06F17/40</further-classification>  
        <further-classification edition="202301120250211B">G06Q30/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭維潭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, YOUDAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏岷宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEOM, MINWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西門弘益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEOMOON, HONGIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金賢珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUNSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙容衍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, SEUNGYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供的商品信息提供方法由至少一個處理器執行。這種方法包括如下步驟：接收用于將與第一商品相關的信息存儲在作爲虛擬的商品保管箱的購物車的第一用戶輸入；確定第一商品是否即將缺貨；以及響應于確定爲第一商品即將缺貨，一幷輸出第一信息及第二信息，所述第一信息表明已將第一商品存儲在購物車，所述第二信息表明第一商品即將缺貨。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for providing product information performed by at least one processor is disclosed. The method includes, receiving a first user input to store information associated with a first product in a shopping cart which is a virtual product storage, determining whether the first product is low in stock, and in response to determining that the first product is low in stock, outputting first information indicating that the first product has been stored in the shopping cart, and second information indicating that the first product is low in stock.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:用戶終端</p>  
        <p type="p">120:第一畫面</p>  
        <p type="p">122:圖像</p>  
        <p type="p">124:商品信息</p>  
        <p type="p">126:“添加至購物車”按鈕</p>  
        <p type="p">128:“直接購買”按鈕</p>  
        <p type="p">130:第二畫面</p>  
        <p type="p">132:“直接進入”按鈕</p>  
        <p type="p">134:“繼續添加”按鈕</p>  
        <p type="p">136:對比商品目錄</p>  
        <p type="p">138:其他客戶的購買商品目錄</p>  
        <p type="p">139:“關閉”按鈕</p>  
        <p type="p">140:第一信息</p>  
        <p type="p">142:文本</p>  
        <p type="p">144:索引圖像</p>  
        <p type="p">150:第二信息</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="683" publication-number="202614388"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614388.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614388</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144395</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝件及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H01L23/31</main-classification>  
        <further-classification edition="200601120250401B">H01L23/373</further-classification>  
        <further-classification edition="201701120250401B">H01L21/77</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡憲斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, HSIEN-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳琮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TSUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施應慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, YING-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭榮偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, JUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體封裝件包括基底、封裝件、多個半導體裝置以及散熱模組。封裝件設置在基底上方並電耦合到基底，並且包括多個晶粒。半導體裝置設置在基底上方並電耦合到基底，並且橫向地鄰近於封裝件。散熱模組設置在基底上方，並包括透過第一熱介面材料與封裝件連接並熱耦合的第一散熱元件以及透過第二熱介面材料與半導體裝置連接並熱耦合的第二散熱元件，其中第一熱介面材料的導熱率與第二熱介面材料的熱導率不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor package includes a substrate, a package, a plurality of semiconductor devices, and a thermal dissipating module. The package is disposed over and electrically coupled to the substrate, and includes a plurality of dies. The semiconductor devices are disposed over and electrically coupled to the substrate and laterally next to the package. The thermal dissipating module is disposed over the substrate and includes a first thermal dissipating element connected to and thermally coupled to the package through a first thermal interface material and a second thermal dissipating element connected to and thermally coupled to the semiconductor devices through a second thermal interface material, where a thermal conductivity of the first thermal interface material is different from a thermal conductivity of the second thermal interface material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100、200:半導體晶粒</p>  
        <p type="p">500:基底</p>  
        <p type="p">530:金屬化層</p>  
        <p type="p">510、520:接合墊</p>  
        <p type="p">400、400a、400b:半導體裝置</p>  
        <p type="p">540:主體</p>  
        <p type="p">630:連接件</p>  
        <p type="p">700:絕緣包封體</p>  
        <p type="p">710、720:底部填充劑</p>  
        <p type="p">810、830、840:熱介面材料</p>  
        <p type="p">820:接合元件</p>  
        <p type="p">1020A:散熱元件</p>  
        <p type="p">1012a、1012b:外桿</p>  
        <p type="p">1013a、1013b:內桿</p>  
        <p type="p">1021:第一部分</p>  
        <p type="p">1022A:第二部分</p>  
        <p type="p">P1:封裝件</p>  
        <p type="p">S100b、S200b:背側</p>  
        <p type="p">S110b、S400、S540b、S540t:表面</p>  
        <p type="p">S700:頂表面</p>  
        <p type="p">SP1:半導體封裝件</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="684" publication-number="202613848"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613848.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613848</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144473</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用程序的頁面提供方法及支持其的電子裝置</chinese-title>  
        <english-title>METHOD FOR PROVIDING PAGES OF AN APPLICATIONE AND ELECTRONIC DEVICE SUPPORTING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250211B">G06F17/40</main-classification>  
        <further-classification edition="201301120250211B">G06F3/048</further-classification>  
        <further-classification edition="202301120250211B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金周賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　凱瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CATHERINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜河羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, HARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金宥菈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOO RA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一實施例的應用程序的頁面提供方法可包括如下步驟：從外部電子裝置接收對與應用程序的會員服務相關的應用程序的第一頁面的訪問請求；響應于所接收的訪問請求來識別與外部電子裝置相關的用戶賬號；以及向外部電子裝置發送第一頁面的信息，所述第一頁面包括第一區域及第二區域，在所述第一區域配置有第一內容，所述第一內容包括基于所述用戶賬號的用戶識別信息，所述第二區域從所述第一區域滾動顯示，在所述第二區域配置有第一圖形用戶界面（graphical user interface，GUI），所述第一圖形用戶界面支持對與所述會員服務的管理相關的所述應用程序的第二頁面的訪問。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for providing a page of an application according to an embodiment of the disclosure may include receiving, from an external electronic device, an access request to a first page of an application related to a membership service of the application, in response to receiving the access request, identifying a user account associated with the external electronic device, and transmitting, to the external electronic device, information of the first page configured such that a first content including a user identification information based on the user account is placed in a first area, and a first graphical user interface (GUI) supporting access to a second page of the application related to management of the membership service is placed in a second area which is scrollable from the first area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">200:網絡</p>  
        <p type="p">300:外部電子裝置</p>  
        <p type="p">400:第一頁</p>  
        <p type="p">410:第一區</p>  
        <p type="p">411:第一內容</p>  
        <p type="p">420:第二區</p>  
        <p type="p">421:第一圖形用戶界面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="685" publication-number="202613934"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613934.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613934</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144480</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>購物界面提供方法及裝置</chinese-title>  
        <english-title>METHOD AND DEVICE FOR PROVIDING ITEM PURCHASE INTERFACE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250211B">G06Q30/06</main-classification>  
        <further-classification edition="202401120250211B">G06Q10/08</further-classification>  
        <further-classification edition="202301120250211B">G06Q30/02</further-classification>  
        <further-classification edition="200601120250211B">G06F17/40</further-classification>  
        <further-classification edition="201301120250211B">G06F3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭維潭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, YOUDAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西門弘益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEOMOON, HONGIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金賢珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUNSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙容衍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, SEUNGYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供購物界面提供方法，由至少一個處理器執行。所述方法可包括如下步驟：從用戶終端接收與選自購物車頁面的至少一個第一類別物品及至少一個第二類別物品相關的購買請求；響應于所接收的購買請求來判斷至少一個第一類別物品是否滿足可購買條件；以及響應于至少一個第一類別物品不滿足可購買條件，向用戶終端提供引導頁面，所述引導頁面包括與至少一個第二類別物品的購買相關的第一界面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a method for providing an interface for item purchase performed by at least one processor. The method includes receiving a purchase request for at least one first category item and at least one second category item selected from a shopping cart page from a user terminal, determining whether the at least one first category item satisfies a purchase condition, and providing a guide page comprising a first interface related to purchase of the at least one second category item to the user terminal, in response to determining that the at least one first category item does not satisfy the purchase condition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:用戶終端</p>  
        <p type="p">120:購物車頁面</p>  
        <p type="p">122:第一類別物品</p>  
        <p type="p">124:第二類別物品</p>  
        <p type="p">126:購買按鈕</p>  
        <p type="p">130:引導頁面</p>  
        <p type="p">132:第一界面</p>  
        <p type="p">134:第一微件</p>  
        <p type="p">136:第二微件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="686" publication-number="202614488"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614488.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614488</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144546</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及輻射裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND RADIATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120250729B">H01Q5/30</main-classification>  
        <further-classification edition="201501120250729B">H01Q5/50</further-classification>  
        <further-classification edition="200601120250729B">H01Q1/36</further-classification>  
        <further-classification edition="200601120250729B">H05K5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>啟碁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON NEWEB CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏仕強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, SHIH-CHIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何啟睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, CHI-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭彥詞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, YEN-TZE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置及輻射裝置，包括：金屬底殼、托座及天線。金屬底殼包括側壁，且金屬底殼具有槽孔位於側壁中。托座設置於金屬底殼內，托座包括上表面、第一側表面及下表面。天線包括饋入部、輻射部及接地部，天線經設置於托座上，使得：天線的輻射部的至少一部分分佈於托座的上表面；天線的接地部的至少一部分分佈於托座的下表面；及天線的饋入部、輻射部及接地部的其中一或多者的至少一部分分佈於托座的第一側表面。天線位於第一側表面的部分向金屬底殼的側壁的一投影面積係與槽孔至少部分重疊，及托座的第一側表面緊鄰側壁。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device and a radiation device are provided herein, the electronic device comprising: a metal base housing, a holder, and an antenna. The metal base housing includes a side wall and has a slot located in the side wall. The holder is disposed within the metal base housing and includes an upper surface, a first side surface, and a lower surface. The antenna includes a feed part, a radiating part, and a grounding part, and the antenna is disposed on the holder such that: at least a portion of the radiating part of the antenna is distributed on the upper surface of the holder; at least a portion of the grounding part of the antenna is distributed on the lower surface of the holder; and at least a portion of one or more of the feed part, the radiating part, and the grounding part of the antenna is distributed on the first side surface of the holder. Wherein, a projection area of the portion of the antenna located on the first side surface projected towards the side wall of the metal base housing at least partially overlaps with the slot, and the first side surface of the holder is adjacent to the side wall.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202:托座</p>  
        <p type="p">203:鍵盤框架</p>  
        <p type="p">204:迴圈天線</p>  
        <p type="p">206:金屬擋片</p>  
        <p type="p">208:槽孔</p>  
        <p type="p">210:側壁</p>  
        <p type="p">212:上表面</p>  
        <p type="p">214:第一側表面</p>  
        <p type="p">216:下表面</p>  
        <p type="p">218:第二側表面</p>  
        <p type="p">WH:托座的寬度</p>  
        <p type="p">HH:托座的高度</p>  
        <p type="p">LS:槽孔的長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="687" publication-number="202613858"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613858.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613858</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144567</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置、用戶認證方法及包含用以執行該方法之電腦程式之非暫時性電腦可讀記錄媒體</chinese-title>  
        <english-title>ELECTRONIC APPARATUS, AUTHENTICATING USERS METHOD AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM COMPRISING A COMPUTER PROGRAM FOR PERFORMING THE METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250501B">G06F21/44</main-classification>  
        <further-classification edition="201301120250501B">G06F21/62</further-classification>  
        <further-classification edition="200601120250501B">H04L9/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>代抗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI, KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　國威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, KUO WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱文華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, WENHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊震希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, ZHENXI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐郡明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JUNMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾慶陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, QINGYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>封曉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, XIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秀姜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SU GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李光輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, GUANGHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金坤宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, GON U</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴素正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SU JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了一種電子裝置之用戶認證方法。用戶認證方法可包括如下步驟：自第1用戶終端獲得對應用程式之第1通行金鑰註冊請求，該第1通行金鑰註冊請求包括上述第1用戶終端之識別資訊及上述第1用戶終端之第1操作系統之資訊；基於上述第1操作系統之資訊，向上述第1用戶終端提供用以註冊通行金鑰之第1類型之頁面之資訊；自上述第1用戶終端獲得第1公開金鑰之資訊，該第1公開金鑰係利用與上述第1操作系統對應之第1類型之API而產生者；及產生與上述第1用戶終端之識別資訊對應之上述第1公開金鑰之資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">200:用戶終端</p>  
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p>  
        <p type="p">S240:步驟</p>  
        <p type="p">S250:步驟</p>  
        <p type="p">S260:步驟</p>  
        <p type="p">S270:步驟</p>  
        <p type="p">S280:步驟</p>  
        <p type="p">S290:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="688" publication-number="202612801"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612801.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612801</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144589</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清洗物體的設備和方法</chinese-title>  
        <english-title>APPARATUSES AND METHODS FOR CLEANING OBJECTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241230B">B08B7/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林子根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TZU KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張乃家</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, NAI-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳青宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-HORNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭光偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, KUANG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳承先</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN-SHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於清洗物體（如半導體晶圓）的設備和方法。設備包括離子流裝置，其包括離子化器，配置為產生足以使過濾氣體分子帶電以產生離子化氣體的電場，以及噴嘴，配置為將離子化氣體排出朝向物體表面以中和表面上顆粒的靜電電荷，鼓風裝置，配置為將過濾氣體推進到離子化器並將離子化氣體推出噴嘴，配置在離子流裝置第一和第二側的通道，與物體表面流體連通，以及排氣裝置，配置為使離子化氣體從物體表面透過第一和第二通道流動以從表面移除顆粒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatuses and methods are provided for cleaning objects, such as semiconductor wafers. The apparatuses include an ion flow device that includes an ionizer configured to generate an electric field sufficient to electrically charge gas molecules of a filtered gas to produce an ionized gas and a nozzle configured to expel the ionized gas toward a surface of an object to neutralize electrostatic charges of particles on the surface, a blower device configured to propel the filtered gas to the ionizer and the ionized gas out of the nozzle, passages disposed on first and second sides of the ion flow device that are in fluidic communication with the surface of the object, and an exhaust device configured to flow the ionized gas from the surface of the object through the first and second passages to remove the particles from the surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">112:裝卸機</p>  
        <p type="p">114:晶圓儲存裝置</p>  
        <p type="p">116:第一介面門</p>  
        <p type="p">118:裝載鎖模組</p>  
        <p type="p">120:第二介面門</p>  
        <p type="p">122:搬運機</p>  
        <p type="p">124:晶圓</p>  
        <p type="p">126:風扇過濾單元</p>  
        <p type="p">128:流動</p>  
        <p type="p">130:傳輸腔體</p>  
        <p type="p">132:晶圓清洗設備</p>  
        <p type="p">134:通道</p>  
        <p type="p">136:第一或上部微粒移除裝置</p>  
        <p type="p">138:第二或下部微粒移除裝置</p>  
        <p type="p">140:鼓風裝置</p>  
        <p type="p">142:排氣裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="689" publication-number="202613518"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613518.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613518</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144610</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生物晶片</chinese-title>  
        <english-title>BIOCHIP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">G01N21/17</main-classification>  
        <further-classification edition="200601120250418B">G02B6/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>采鈺科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VISERA TECHNOLOGIES COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝馨儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HSIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家郡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種生物晶片。生物晶片包含基板及波導核心層，波導核心層設置於基板的上方。波導核心層包含第一光柵耦合器。生物晶片也包含水凝膠，水凝膠經由水凝膠交聯光進行交聯，水凝膠交聯光是透過第一光柵耦合器被耦合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A biochip is provided. The biochip includes a substrate and a waveguide core layer disposed over the substrate. The waveguide core layer includes a first grating coupler. The biochip also includes a hydrogel crosslinked via a hydrogel-crosslinking light that is coupled by the grating coupler.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:生物晶片</p>  
        <p type="p">10:基板</p>  
        <p type="p">12:光電轉換元件</p>  
        <p type="p">20:下包覆層</p>  
        <p type="p">30:波導核心層</p>  
        <p type="p">31:光柵耦合器</p>  
        <p type="p">40:上包覆層</p>  
        <p type="p">40W:奈米孔</p>  
        <p type="p">50:自組裝單層</p>  
        <p type="p">62:水凝膠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="690" publication-number="202613922"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613922.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613922</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113144801</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>會員優惠信息提供方法及其系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR PROVIDING MEMBERSHIP BENEFIT INFORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250210B">G06Q30/02</main-classification>  
        <further-classification edition="202301120250210B">G06Q30/06</further-classification>  
        <further-classification edition="200601120250210B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金周賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　凱瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CATHERINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜河羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, HARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金宥菈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOO RA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及會員優惠信息提供方法及系統。會員優惠信息提供方法由至少一個處理器執行，所述方法可包括如下步驟：對于在向用戶終端提供的應用程序上注册的用戶賬號，識別與用戶賬號使用會員的歷史相關的會員使用信息；基于會員使用信息，計算針對會員提供的多個優惠類別中的每一個優惠類別的多個優惠類別相關信息；以及通過用戶終端提供包括多個優惠類別相關信息的會員頁面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for providing membership benefit information performed by at least one processor is disclosed. The method may include identifying, for a user account registered in an application provided on a user terminal, membership usage information associated with a history that the user account uses a membership, generating information related to a plurality of benefit categories offered by the membership, based on the membership usage information, and providing a membership page comprising information related to the plurality of benefit categories via the user terminal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:用戶</p>  
        <p type="p">120:用戶終端</p>  
        <p type="p">130:會員頁面</p>  
        <p type="p">140:引導區域</p>  
        <p type="p">142:會員結算預定信息</p>  
        <p type="p">150:目標期限信息</p>  
        <p type="p">160:第一微件</p>  
        <p type="p">170:第二微件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="691" publication-number="202613945"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613945.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613945</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145007</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以顯示物品之問答資訊之裝置、方法及記錄媒體</chinese-title>  
        <english-title>DEVICE, METHOD, AND RECORDING MEDIUM FOR DISPLAYING QUESTION-AND-ANSWER DATA OF ITEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250801B">G06Q30/08</main-classification>  
        <further-classification edition="202301120250801B">G06Q30/06</further-classification>  
        <further-classification edition="200601120250801B">G06F17/40</further-classification>  
        <further-classification edition="201301120250801B">G06F3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金秀正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUJUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高正妍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, JUNGYOUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金妍才</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YEONJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　寶藍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BO RAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種用以顯示物品之問答資料之方法。本發明之一實施例之方法可包括如下步驟：自用戶終端獲得用戶對包括物品之詳情資訊之第1頁面之連接請求；識別與上述物品對應之一個以上之問答資料；以於上述第1頁面之至少一部分包括用以顯示上述一個以上之問答資料之問答區域的方式產生用於輸出上述第1頁面之第1頁面資訊；及將上述第1頁面資訊傳輸至上述用戶終端；且上述問答資料至少包括問詢資料，該問詢資料包括一個以上之顧客編寫之對上述物品之問詢內容，於登記有與上述問詢資料對應之一個以上之回答資料之情形時，進而包括上述一個以上之回答資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:電子裝置</p>  
        <p type="p">102:用戶終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="692" publication-number="202614809"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614809.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614809</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145063</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250624B">H10D30/60</main-classification>  
        <further-classification edition="202501120250624B">H10D64/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏鴻宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, HUNG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林耕竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KENG-CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭羽筠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, YU-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置，所述半導體裝置包括具有共同閘極結構的前側裝置以及背側裝置。所述半導體裝置包括具有第一摻雜區的基部結構、設置在第一摻雜區上的複數個奈米結構通道層、設置在第一摻雜區中的第二摻雜區、設置在奈米結構通道層中且接觸第二摻雜區的垂直通道區、以及圍繞奈米結構通道層以及垂直通道區的閘極結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a front side device and a backside device with a common gate structure. The semiconductor device includes a base structure having a first doped region, a plurality of nanostructured channel layers disposed on the first doped region, a second doped region disposed in the first doped region, a vertical channel region disposed in the plurality of nanostructured channel layers and in contact with the second doped region, and a gate structure surrounding the plurality of nanostructured channel layers and the vertical channel region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">106A:基部結構</p>  
        <p type="p">110A:源極/汲極(S/D)區</p>  
        <p type="p">112A、112B、112C、112D:層間介電(ILD)層</p>  
        <p type="p">114:外閘極間隔物</p>  
        <p type="p">118A、118B、118C、118D:蝕刻停止層(ESL)</p>  
        <p type="p">120:閘極結構</p>  
        <p type="p">122A、122B:摻雜區</p>  
        <p type="p">124:奈米結構水平通道(NHC)層</p>  
        <p type="p">125:奈米結構垂直通道(NVC)區</p>  
        <p type="p">126:內閘極間隔物</p>  
        <p type="p">128:界面氧化物層(IL)</p>  
        <p type="p">130:高介電常數(HK)閘極介電層</p>  
        <p type="p">132:功函數金屬(WFM)層</p>  
        <p type="p">134:閘極金屬填充層</p>  
        <p type="p">135:閘極蓋層</p>  
        <p type="p">140:襯層</p>  
        <p type="p">142:源極/汲極(S/D)接觸件金屬層</p>  
        <p type="p">144:源極/汲極(S/D)接觸件結構</p>  
        <p type="p">150:閘極接觸件結構</p>  
        <p type="p">152:互連結構</p>  
        <p type="p">158:背側襯層</p>  
        <p type="p">160:背側接觸件金屬層</p>  
        <p type="p">162:背側接觸件結構</p>  
        <p type="p">302A:p型井</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="693" publication-number="202614430"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614430.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614430</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145161</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導孔包覆結構及其形成方法</chinese-title>  
        <english-title>VIA CLADDING STRUCTURE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250703B">H01L23/525</main-classification>  
        <further-classification edition="200601120250703B">H01L23/538</further-classification>  
        <further-classification edition="200601120250703B">H01L21/762</further-classification>  
        <further-classification edition="200601120250703B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王郁盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳承軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHENG-XUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳楷程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KAI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林文益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒　志華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, ZHIHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">防止頂部導孔與帶殘留物或其他雜質發生化學反應的阻障層或包層結構透過減少金屬原子遷移和線生長，解決半導體封裝件中局部矽中介互連件的可靠性問題，從而提高長期可靠性。導孔包覆結構整合包括SiOCH、SiOx、SiON、SiNx、CuOx、Ta、Ti、TaN、TiN、Mo、MoN、TaC、TiC、TaCN或TiCN之單獨或任意組合的多層阻障件，增強電氣性能和長期可靠性。形成包覆或阻障結構的方法涉及結合包覆層沉積、圖案化、濕蝕刻、等向性乾蝕刻或非等向性乾蝕刻製程、可流動介電質沉積或旋塗介電質以及化學機械平坦化(CMP)以確保穩健且可靠的連接。這些層的整合緩解了與金屬原子遷移和線生長相關的問題，為高密度、高性能半導體封裝件不斷增長的需求提供了解決方案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Barrier or cladding structures that prevent top vias from chemically reacting to tape residue or other impurities address reliability issues in local silicon interposer interconnection in semiconductor packaging by mitigating metal atom migration and wire growth, thereby enhancing long-term reliability. The via cladding structure incorporates a multi-layered barrier comprising, alone or in any combination, SiOCH, SiO&lt;sub&gt;x&lt;/sub&gt;, SiON, SiN&lt;sub&gt;x&lt;/sub&gt;, CuO&lt;sub&gt;x&lt;/sub&gt;, Ta, Ti, TaN, TiN, Mo, MoN, TaC, TiC, TaCN, or TiCN, enhancing electrical performance and long-term reliability. The method of forming the cladding or barrier structure involves a combination of cladding layer deposition, patterning, wet etch, isotropic dry etch or anisotropic dry etch process, flowable dielectric deposition or spin-coat dielectric, and chemical mechanical planarization (CMP) to ensure robust and reliable connections. The integration of these layers mitigates issues related to metal atom migration and wire growth, providing a solution for the growing demand for high-density, high-performance semiconductor packages.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1C,S2C,S3C,S4C:步驟</p>  
        <p type="p">40:基板</p>  
        <p type="p">50:半導體材料層</p>  
        <p type="p">60,90:導孔</p>  
        <p type="p">70:深溝電容</p>  
        <p type="p">80:重分佈層</p>  
        <p type="p">113,123,133,143:包覆結構</p>  
        <p type="p">500:中介層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="694" publication-number="202613906"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613906.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613906</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145263</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供物品信息的方法及裝置</chinese-title>  
        <english-title>METHOD AND DEVICE FOR PROVIDING ITEM INFORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250203B">G06Q10/08</main-classification>  
        <further-classification edition="202301120250203B">G06Q30/06</further-classification>  
        <further-classification edition="200601120250203B">G06F17/40</further-classification>  
        <further-classification edition="201301120250203B">G06F3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭維潭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, YOUDAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏岷宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEOM, MINWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金賢珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUNSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙容衍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, SEUNGYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及通過至少一個處理器執行的提供物品信息的方法。提供物品信息的方法包括如下步驟：生成與用戶賬戶有關的物品列表，所述用戶賬戶注册在向用戶終端提供的應用程序上；生成用于進入到包含所生成的物品列表的登錄頁面的微件；通過用戶終端向應用程序的主頁提供所生成的微件；以及響應于接收選擇所提供的微件的第一用戶輸入，通過用戶終端提供顯示物品列表的登錄頁面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a method for providing item information performed by at least one processor. The method includes generating an item list associated with a user account registered in an application provided on a user device, generating a widget for accessing a landing page including the generated item list, providing the generated widget on a main page of the application through the user device, and in response to receiving a first user input selecting the provided widget, providing the landing page displaying the item list through the user device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:用戶</p>  
        <p type="p">110:用戶終端</p>  
        <p type="p">120:第一畫面</p>  
        <p type="p">130~138:區域</p>  
        <p type="p">140:微件</p>  
        <p type="p">142:用戶輸入</p>  
        <p type="p">150:第二畫面</p>  
        <p type="p">160:物品列表</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="695" publication-number="202613941"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613941.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613941</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145264</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供物品信息的方法及裝置</chinese-title>  
        <english-title>METHOD AND DEVICE FOR PROVIDING ITEM INFORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250204B">G06Q30/0601</main-classification>  
        <further-classification edition="202301120250204B">G06Q30/0251</further-classification>  
        <further-classification edition="200601120250204B">G06F3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭維潭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, YOUDAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金賢珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUNSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙容衍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, SEUNGYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及通過至少一個處理器執行的提供物品信息的方法。提供物品信息的方法包括如下步驟：生成與用戶賬戶有關的物品列表（item list），所述用戶賬戶注册在向用戶終端提供的應用程序上；生成包含推薦物品的推薦物品列表，推薦物品與包含在物品列表的物品有關；生成包含物品列表及推薦物品列表的至少一部分的微件（widget）；以及通過用戶終端向應用程序的主頁提供所生成的微件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a method for providing item information performed by at least one processor. The method includes generating an item list associated with a user account registered in an application provided on a user device, generating a recommended item list including recommended items associated with items included in the item list, generating a widget including at least part of the item list and the recommended item list, and providing, through the user device, the generated widget on a main page of the application.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:用戶</p>  
        <p type="p">110:用戶終端</p>  
        <p type="p">120:畫面</p>  
        <p type="p">130~170:區域</p>  
        <p type="p">162:物品列表</p>  
        <p type="p">164:第一物品</p>  
        <p type="p">166:推薦物品列表</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="696" publication-number="202613942"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613942.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613942</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145271</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其資訊提供方法</chinese-title>  
        <english-title>ELECTRONIC APPARATUS AND PROVIDING INFORMATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250422B">G06Q30/0601</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉勉特　阿恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAMET, ARNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉霖善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, LAM SUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金素珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SO JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金賢洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUN SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種電子裝置之資訊提供方法。上述資訊提供方法可包括如下步驟：提供第1頁面，該第1頁面顯示有用戶購買之次數為臨界值以上之一個以上之物品之資訊；獲得上述第1頁面中顯示之上述一個以上之物品之資訊中之上述用戶選擇之第1物品之資訊；基於上述第1頁面之類型，確認與上述第1物品對應之第1關鍵字；及提供第2頁面，該第2頁面顯示有與上述第1關鍵字對應之複數個第1物品之資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">120:用戶終端</p>  
        <p type="p">160:資料庫</p>  
        <p type="p">S200,S205,S210,S215,S220,S225,S230,S235,S240,S245,S250:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="697" publication-number="202613849"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613849.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613849</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145306</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物品信息提供方法及裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR PROVIDING ITEM INFORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250213B">G06F17/40</main-classification>  
        <further-classification edition="201901120250213B">G06F16/953</further-classification>  
        <further-classification edition="202301120250213B">G06Q30/06</further-classification>  
        <further-classification edition="202401120250213B">G06Q10/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏岷宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEOM, MINWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西門弘益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEOMOON, HONGIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金賢珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUNSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙容衍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, SEUNGYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及通過至少一個處理器執行的物品信息提供方法。物品信息提供方法包括如下步驟：提取與用戶賬戶有關的物品列表（item list），用戶賬戶注册在向用戶終端提供的應用程序上；判斷包含在物品列表的第一物品是否滿足用于顯示在應用程序的主頁的至少一個條件；響應于判斷爲第一物品滿足至少一個條件，生成與第一物品對應的第一微件（widget）；以及通過用戶終端向應用程序的主頁提供所生成的第一微件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a method for providing item information performed by at least one processor. The method includes extracting an item list associated with a user account registered in an application provided on a user device, determining whether a first item included in the item list satisfies at least one condition for being displayed on a main page of the application, in response to determining that the first item satisfies the at least one condition, generating a first widget corresponding to the first item, and providing, the generated first widget on the main page of the application through the user device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:用戶</p>  
        <p type="p">110:用戶終端</p>  
        <p type="p">112:網關頁面</p>  
        <p type="p">114:第一微件</p>  
        <p type="p">116:第二微件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="698" publication-number="202613919"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613919.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613919</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145307</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供資訊之電子裝置、用戶終端及其方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND USER TERMINAL FOR PROVIDING INFORMATION AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250709B">G06Q30/01</main-classification>  
        <further-classification edition="202301120250709B">G06Q30/02</further-classification>  
        <further-classification edition="202301120250709B">G06Q30/0283</further-classification>  
        <further-classification edition="202301120250709B">G06Q30/0601</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀電</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, DIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秀姜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SU GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳慧珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, HYE JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　德瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENG, DERRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明，揭示一種在電子裝置中提供資訊之方法，該方法包括如下步驟：確認目標結算方式之優惠資訊；確認至少一個比較結算方式之優惠資訊；及向用戶終端提供比較資訊，該比較資訊包括目標結算方式之優惠資訊及至少一個比較結算方式之優惠資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:電子裝置</p>  
        <p type="p">120:用戶終端</p>  
        <p type="p">130:外部裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="699" publication-number="202614881"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614881.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614881</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145327</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基材、具有基材的光學感測器封裝及封裝的製造方法</chinese-title>  
        <english-title>SUBSTRATE, OPTICAL SENSOR PACKAGE WITH A SUBSTRATE, AND METHOD FOR FABRICATING THE PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250801B">H10F77/50</main-classification>  
        <further-classification edition="200601120250801B">H01L23/498</further-classification>  
        <further-classification edition="202501120250801B">H10F71/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商半導體組件工業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博塔庫爾　斯瓦爾納爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BORTHAKUR, SWARNAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西爾斯比　克里斯多福　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILSBY, CHRISTOPHER D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種封裝包括：無機基材；以及光學感測器晶粒，該光學感測器晶粒設置在該無機基材的頂表面的第一部分上。該封裝進一步包括：第一金屬間介電層，該第一金屬間介電層設置在該無機基材的該頂表面的第二部分上；以及第二金屬間介電層，該第二金屬間介電層設置在該無機基材的底表面上。填充有或襯有導電材料的至少一個貫穿基材通孔電連接該第一金屬間介電層和該第二金屬間介電層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package includes an inorganic substrate, and an optical sensor die disposed on a first portion of a top surface of the inorganic substrate. The package further includes a first inter-metal dielectric layer disposed on a second portion of the top surface and a second inter-metal dielectric layer disposed on a bottom surface of the inorganic substrate. At least one through-substrate via filled or lined with a conductive material electrically connects the first inter-metal dielectric layer and the second inter-metal dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12A:玻璃基材(基材)</p>  
        <p type="p">100A:光學感測器封裝</p>  
        <p type="p">110:光學感測器晶粒</p>  
        <p type="p">111:氣腔</p>  
        <p type="p">112:OASA</p>  
        <p type="p">113:裝置接觸焊墊(焊墊)</p>  
        <p type="p">114:黏著劑層</p>  
        <p type="p">115:打線接合</p>  
        <p type="p">116:IMD層</p>  
        <p type="p">118:IMD層</p>  
        <p type="p">122:貫穿玻璃通孔、TGV</p>  
        <p type="p">124:金屬焊墊</p>  
        <p type="p">126:焊墊(金屬焊墊)</p>  
        <p type="p">130:玻璃蓋</p>  
        <p type="p">140:壩</p>  
        <p type="p">150:球柵陣列</p>  
        <p type="p">152:焊球</p>  
        <p type="p">160:封裝材料</p>  
        <p type="p">CW:寬度</p>  
        <p type="p">DT:厚度</p>  
        <p type="p">DW:寬度</p>  
        <p type="p">EP:邊緣部分</p>  
        <p type="p">EW:寬度</p>  
        <p type="p">GS:頂表面</p>  
        <p type="p">GT:厚度</p>  
        <p type="p">GW:寬度</p>  
        <p type="p">S1:側</p>  
        <p type="p">S2:側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="700" publication-number="202614409"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614409.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614409</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145420</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法以及將背側凸塊墊金屬對準導通孔的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME AND METHOD OF ALIGNING A BACKSIDE BUMP PAD METAL WITH A THROUGH-VIA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250922B">H01L23/48</main-classification>  
        <further-classification edition="202301120250922B">H01L25/065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳承先</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN-SHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林其諺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHI-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峰菖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, FENG-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭庭豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, TING-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳旭賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSU-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置包含第一層級結構及第二層級結構，第一層級結構包含矽部分及後段製程之後形成通過矽部分的導通孔，第一層級結構附接至第一載體，第一載體包含用以形成導通孔及對應的背側凸塊墊金屬的對準標記，背側凸塊墊金屬基於對準標記的位置對準導通孔，第二層級結構接合至第一層級結構，其中背側凸塊墊金屬位於兩層級之間。在一些實施例中，導通孔為具有底部凹口的反柱形，且頂部與底部之間具有特定比值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a first-tier structure and a second-tier structure. The first-tier structure includes a silicon portion with through-vias formed through the silicon portion after a back end of line process. The first-tier structure is attached to a first carrier that includes an alignment mark used to form the through-vias and the corresponding backside bump pad metal that are aligned with the through-vias at locations based on the alignment mark. The second-tier structure is bonded to the first-tier structure with the backside bump pad metals interposed between the two tiers. In some embodiments, the through-vias are a reverse pillar shape with a bottom recess and a specified ratio between a top portion and bottom portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1500:方法</p>  
        <p type="p">1502,1504,1506,1508,1510:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="701" publication-number="202613837"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613837.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613837</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145463</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理資料之方法、電子裝置及記錄媒體</chinese-title>  
        <english-title>METHOD OF PROCESSING DATA, ELECTRONIC DEVICE AND RECORDING MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120250801B">G06F16/185</main-classification>  
        <further-classification edition="201901120250801B">G06F16/13</further-classification>  
        <further-classification edition="200601120250801B">G06F9/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滿毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAN, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施例之藉由電子裝置而實行之處理資料之方法可包括如下步驟：接收用以將目標資料記錄於資料庫中之請求；將上述目標資料分割為具有既定之大小之複數個資料塊；於用以記錄上述複數個塊之複數個時間段中之第1時間段內，將上述複數個資料塊中之第1個數之資料塊記錄於上述資料庫中；確認上述第1時間段內之上述資料庫之資源之使用率；及基於上述所確認之資料庫之資源之使用率，確定欲於上述第1時間段之後的第2時間段內記錄於上述資料庫中之資料塊之個數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:系統</p>  
        <p type="p">100:電子裝置</p>  
        <p type="p">200:資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="702" publication-number="202614389"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614389.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614389</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145508</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構</chinese-title>  
        <english-title>PACKAGE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241211B">H01L23/31</main-classification>  
        <further-classification edition="200601120241211B">H01L23/48</further-classification>  
        <further-classification edition="200601120241211B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日月光半導體製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED SEMICONDUCTOR ENGINEERING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡文浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, WEN HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳弈錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種封裝結構及一種製造一封裝結構之方法。該封裝結構包括一第一載體、一第二載體及一第一組件。該第一載體包括安置於該第一載體之一第一表面處的一第一襯墊及一第二襯墊。該第二載體安置於該第一載體上方。該第一組件將該第一載體連接至該第二載體，且包括連接至該第一襯墊之一第一端子及連接至該第二襯墊之一第二端子。該第一襯墊與該第二襯墊之間的一第一距離實質上等於或大於該第一端子與該第二端子之間的一第二距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package structure and a method of manufacturing a package structure are provided. The package structure includes a first carrier, a second carrier, and a first component. The first carrier includes a first pad and a second pad disposed at a first surface of the first carrier. The second carrier is disposed above the first carrier. The first component connects the first carrier to the second carrier, and includes a first terminal connected to the first pad and a second terminal connected to the second pad. A first distance between the first pad and the second pad is substantially equal to or greater than a second distance between the first terminal and the second terminal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:載體</p>  
        <p type="p">10s1:第一表面</p>  
        <p type="p">10s2:第二表面</p>  
        <p type="p">10c:導電元件</p>  
        <p type="p">11:載體</p>  
        <p type="p">11s1:第一表面</p>  
        <p type="p">11s2:第二表面</p>  
        <p type="p">11c:導電元件</p>  
        <p type="p">12:囊封層</p>  
        <p type="p">13:組件</p>  
        <p type="p">13s1:第一表面</p>  
        <p type="p">13s2:第二表面</p>  
        <p type="p">13c:中心線</p>  
        <p type="p">14:第一端子</p>  
        <p type="p">15:第二端子</p>  
        <p type="p">18:連接元件</p>  
        <p type="p">19:連接元件</p>  
        <p type="p">100:封裝結構</p>  
        <p type="p">101:鈍化層</p>  
        <p type="p">111:鈍化層</p>  
        <p type="p">161:襯墊</p>  
        <p type="p">162:襯墊</p>  
        <p type="p">171:襯墊</p>  
        <p type="p">172:襯墊</p>  
        <p type="p">D10:距離</p>  
        <p type="p">D23:距離</p>  
        <p type="p">D33:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="703" publication-number="202613574"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613574.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613574</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145914</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件的測試方法</chinese-title>  
        <english-title>METHOD OF TESTING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250303B">G01R31/26</main-classification>  
        <further-classification edition="200601120250303B">G01R1/073</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余挺瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, TING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林冠宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUAN-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種半導體元件的測試方法。此方法包含：提供晶圓於卡盤上；移動卡盤至位於探針卡下方之第一預期位置；移動卡盤自第一預期位置至第二預期位置，致使晶圓之數個晶粒接觸探針卡之數個探針；測試晶圓之晶粒之第一部位；移動卡盤至第二預期位置，致使晶圓之晶粒抵靠探針卡之探針；以及測試晶圓之晶粒之第二部位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a method of testing a semiconductor device. The method includes: providing a wafer on a chuck; moving the chuck to a first expected position under a probe card; moving the chuck from the first expected position to a second expected position so that a plurality of dies of the wafer contact a plurality of pins of the probe card; testing a first portion of the dies of the wafer; moving the chuck to the second expected position so that the dies of the wafer abut against the pins of the probe card; and testing a second portion of the dies of the wafer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:探針卡</p>  
        <p type="p">112:探針</p>  
        <p type="p">D,D1,D2,D3,D4,D5,D6,D7,D8,D9,D10:晶粒</p>  
        <p type="p">MK:針痕</p>  
        <p type="p">PD:測試接觸墊</p>  
        <p type="p">T1:操作</p>  
        <p type="p">WF:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="704" publication-number="202614416"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614416.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614416</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113145961</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>功率模組、形成功率模組之方法、及用於嵌入式半導體晶粒的封裝</chinese-title>  
        <english-title>POWER MODULE, METHOD OF FORMING POWER MODULE, AND PACKAGE FOR EMBEDDED SEMICONDUCTOR DIE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250925B">H01L23/488</main-classification>  
        <further-classification edition="200601120250925B">H01L23/28</further-classification>  
        <further-classification edition="200601120250925B">H01L21/60</further-classification>  
        <further-classification edition="200601120250925B">H01L21/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商半導體組件工業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申韓吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, HANGIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金志奐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JIHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金泰均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEKYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林承園</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IM, SEUNGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示一種電子功率模組，其在未使用一導線架下形成外部電性連接。作為替代，可使用各種類型的外部連接器，諸如一壓配接腳總成組件及一整合的連接柱與電力分接頭。本文亦揭示將外部連接器固定至一多層基板的不同方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic power module is disclosed that forms external electrical connections without the use of a lead frame. Instead, various types of external connectors can be used, such as a press-fit pin assembly and an integrated connection post and power tap. Different methods of securing the external connectors to a multilayer substrate are also disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:功率模組</p>  
        <p type="p">101:半導體晶粒</p>  
        <p type="p">102:封裝</p>  
        <p type="p">103:多層基板</p>  
        <p type="p">104:導電材料</p>  
        <p type="p">105:黏著劑</p>  
        <p type="p">106:連接柱</p>  
        <p type="p">108:壓配接腳總成</p>  
        <p type="p">110:封裝材料</p>  
        <p type="p">112:導電護套</p>  
        <p type="p">114:壓配接腳</p>  
        <p type="p">116:可撓性金屬葉片</p>  
        <p type="p">118:平坦部分</p>  
        <p type="p">120:第一導電層</p>  
        <p type="p">122:非導電層</p>  
        <p type="p">124:第二導電層</p>  
        <p type="p">126:晶粒附接件</p>  
        <p type="p">130:電力分接頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="705" publication-number="202612757"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612757.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612757</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113146337</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>異常狀態檢測裝置、異常狀態檢測系統及異常狀態檢測方法</chinese-title>  
        <english-title>ABNORMAL CONDITION DETECTION DEVICE, ABNORMAL CONDITION DETECTION SYSTEM, AND ABNORMAL CONDITION DETECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120241231B">A62C3/10</main-classification>  
        <further-classification edition="200601120241231B">G08B17/12</further-classification>  
        <further-classification edition="200601120241231B">G08B17/103</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商希逷迪網路技術股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CTD NETWORKS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>磯部順一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISOBE, JUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本敦寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, ATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, WENBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的異常狀態檢測裝置係具備：航行資訊取得部，係取得位置資訊；攝像機資訊取得部，係取得拍攝車輛及車輛的周邊空間而得的攝像機資訊；溫度資訊取得部，係取得溫度資訊及每單位時間的溫度變化資訊；異常狀態判定部，係根據與位置資訊對應的假定溫度資訊、溫度資訊、及溫度變化資訊，而判定是否發生火災或有發生火災之虞；通知部，係在判定為發生火災或有發生火災之虞時，對旋轉燈、警報機、使用者終端、及管理者終端的至少一者，通知發生火災或有發生火災之虞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An abnormal condition detection device includes a navigation information acquisition unit that acquires position information, and a camera information acquisition unit that acquires camera information generated by capturing images of a vehicle and the space surrounding the vehicle. The abnormal condition detection device includes a temperature information acquisition unit that acquires temperature information and temperature change information per unit time. The abnormal condition detection device includes an abnormal condition determination unit that determines whether a fire has occurred or is likely to occur in light of estimated temperature information generated based on location information, temperature information, and temperature change information. The abnormal condition detection device includes a notification unit that, when it is determined that a fire has occurred or there is a risk of a fire, notifies at least one of a rotating light, alarm, user terminal and administrator terminal that a fire has occurred or there is a risk of a fire.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:異常狀態檢測裝置</p>  
        <p type="p">110:控制部</p>  
        <p type="p">111:航行資訊取得部</p>  
        <p type="p">112:攝像機資訊取得部</p>  
        <p type="p">113:溫度資訊取得部</p>  
        <p type="p">114:溫度急遽上升檢測部</p>  
        <p type="p">115:煙發生檢測部</p>  
        <p type="p">116:火焰發生檢測部</p>  
        <p type="p">117:異常狀態判定部</p>  
        <p type="p">118:通知部</p>  
        <p type="p">120:記憶部</p>  
        <p type="p">121:取得資訊DB</p>  
        <p type="p">122:檢測資訊DB</p>  
        <p type="p">123:判定資訊DB</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="706" publication-number="202613515"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613515.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613515</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113146457</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種試驗方法</chinese-title>  
        <english-title>TEST METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G01N1/36</main-classification>  
        <further-classification edition="202301120250401B">G06Q10/101</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王棟梁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, DONG-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種試驗方法，包括：獲取試驗資訊與箱體資訊；根據每種試驗條件所對應的樣品的數量確定每種試驗條件對應的樣品的排配順序；根據試驗箱的總數量、每個試驗箱的裝配空間、每種試驗條件所對應的樣品的數量、每個樣品的種類，以及每種樣品的尺寸，按照排配順序依次為每種試驗條件所對應的所有樣品排配相應的試驗箱；將完成排配的每個試驗箱的標識、完成排配的每個試驗箱所對應的試驗條件，以及每個試驗箱所排配的樣品的編碼進行關聯，得到試驗方案，以基於試驗方案進行試驗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a test method, which includes: obtaining test information and box information; determining an arrangement sequence of samples under each test condition based on a number of samples corresponding to each test condition; sequentially arranging corresponding test box for each sample under each test condition according to a total number of test boxes, an assembly space of each test box, the number of samples corresponding to each test condition, a type of each sample, and a size of each sample, based on the arrangement sequence; associating an identification of each test box that has been arranged, a test condition corresponding to each test box that has been arranged, and a code of each sample arranged in each test box to obtain a test plan, so as to conduct the test based on the test plan.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S15:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="707" publication-number="202613008"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613008.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613008</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113146460</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物料輸送裝置</chinese-title>  
        <english-title>MATERIAL CONVEYING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250318B">B65G47/90</main-classification>  
        <further-classification edition="200601120250318B">B65G47/34</further-classification>  
        <further-classification edition="200601120250318B">B65G47/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李曉斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIAO-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種物料輸送裝置，包括上料模組、輸送模組、夾持移動模組。輸送模組包括輸送帶和頂升機構，輸送帶用以帶動托盤沿一方向水平移動，頂升機構用以將輸送帶上的托盤頂起。上料模組可移動地設置在輸送帶的起始端，上料模組用於放置托盤並將托盤轉移至輸送帶上。夾持移動模組位於輸送帶的上方，包括驅動機構、滑軌、可滑動地設置在滑軌上的夾持機構。夾持機構用於夾持被頂升機構頂升的一個托盤，驅動機構用以驅動夾持機構沿滑軌來回滑動。本申請的物料輸送裝置，可自動化的對托盤承載的物料進行上料，並機械化轉移空置的托盤。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A material conveying device includes a feeding module, a conveying module, and a clamping-moving module. The conveying module includes a conveyor belt and a lifting mechanism. The conveyor belt is used to drive trays to move horizontally in one direction, and the lifting mechanism is used to lift the trays on the conveyor belt. The feeding module is movable at a starting end of the conveyor belt, and is used to place and transfer the trays onto the conveyor belt. The clamping-moving module is located above the conveyor belt and includes a driving component, a slide rail, and a clamping component that can be slid on the slide rail. The clamping component is used to clamp one tray lifted by the lifting mechanism, and the driving component is used to drive the clamping component to slide back and forth along the slide rail. The material conveying device of this application can automatically load materials carried by trays and mechanically transfer empty trays.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:物料輸送裝置</p>  
        <p type="p">10:上料模組</p>  
        <p type="p">30:輸送模組</p>  
        <p type="p">50:夾持移動模組</p>  
        <p type="p">31:輸送帶</p>  
        <p type="p">11:支撐頂升機構</p>  
        <p type="p">13:上料抽屜</p>  
        <p type="p">131:抽屜滑軌</p>  
        <p type="p">133:抽屜側板</p>  
        <p type="p">135:抽拉面板</p>  
        <p type="p">132:支撐臂</p>  
        <p type="p">33:頂升機構</p>  
        <p type="p">51:滑軌</p>  
        <p type="p">53:夾持機構</p>  
        <p type="p">55:驅動機構</p>  
        <p type="p">331:立板</p>  
        <p type="p">333:插臂</p>  
        <p type="p">330:導軌</p>  
        <p type="p">21:托盤導向板</p>  
        <p type="p">24:到位感應器</p>  
        <p type="p">511:安裝板</p>  
        <p type="p">56:托盤底座</p>  
        <p type="p">61:安裝支架</p>  
        <p type="p">610:貫穿孔</p>  
        <p type="p">70:單向止回機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="708" publication-number="202613935"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613935.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613935</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113146716</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>向用戶終端提供商品之資訊之方法及其電子裝置</chinese-title>  
        <english-title>METHOD OF PROVIDING INFORMATION ON ITEM AND ELECTRONIC APPARATUS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250602B">G06Q30/06</main-classification>  
        <further-classification edition="202301120250602B">G06Q30/0601</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉勉特　阿恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAMET, ARNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉霖善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, LAM SUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金賢洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUN SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據一實施例，可提供一種向用戶終端提供商品之資訊之方法，其包括如下步驟：自用戶終端接收用以將第1商品儲存至購物車之輸入；獲得存在用戶終端之用戶購買之歷史之至少一個第2商品的資訊；獲得與至少一個第2商品相關之過去購買資訊；及響應於輸入而顯示包括第1類別區域之第1頁面，該第1類別區域包括至少一個第2商品之資訊及過去購買資訊。根據另一實施例，亦可提供一種實行此種方法之電子裝置或記錄有用以實行此種方法之電腦程式之電腦可讀記錄媒體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:電子裝置</p>  
        <p type="p">120:用戶終端</p>  
        <p type="p">130:資料庫</p>  
        <p type="p">140:網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="709" publication-number="202613936"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613936.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613936</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113146719</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置於用戶終端提供折扣優惠資訊之方法及其電子裝置</chinese-title>  
        <english-title>METHOD FOR ELECTRONIC APPARATUS TO PROVIDE DISCOUNT BENEFIT INFORMATION AND ELECTRONIC APPARATUS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250909B">G06Q30/06</main-classification>  
        <further-classification edition="202301120250909B">G06Q30/0207</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秀姜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SU GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳慧珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, HYE JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　德瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENG, DERRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據一實施例，可提供一種方法，其係電子裝置向用戶終端提供折扣優惠資訊者，其包括如下步驟：自用戶終端接收顯示用戶終端之用戶之賬戶之購物車資訊的請求；判斷用戶終端之用戶之賬戶是否滿足與藉由電子裝置預先確定之支付方式相關聯之預先確定之至少一個條件；及以如下方式控制用戶終端：於判斷為滿足至少一個條件之情形時，作為對請求之響應，使用戶終端連同包括購物車資訊之第1頁面一併顯示包括折扣優惠資訊之第1物件；且折扣優惠資訊包括能於藉由預先確定之支付方式購買賬戶之購物車中儲存之至少一個商品時可應用之至少一個折扣類型之資訊。根據另一實施例，亦可提供一種實行方法之電子裝置或儲存有用以實行方法之電腦程式之非暫時性電腦可讀記錄媒體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:電子裝置</p>  
        <p type="p">120:用戶終端</p>  
        <p type="p">130:資料庫</p>  
        <p type="p">140:網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="710" publication-number="202612791"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612791.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612791</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113146780</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種點膠設備、檢測方法及校正方法</chinese-title>  
        <english-title>DISPENSING EQUIPMENT, TEST METHOD AND CALIBRATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250328B">B05C5/02</main-classification>  
        <further-classification edition="202201120250328B">G06V10/00</further-classification>  
        <further-classification edition="200601120250328B">B05C21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡廣建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, GUANG-JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李慶云</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, QING-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張軍輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JUN-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭智元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIH-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種點膠設備、檢測方法及校正方法。點膠設備包括：機台；點膠機構，安裝於機台，點膠機構包括點膠噴嘴；第一拍照設備，安裝於機台且位於點膠噴嘴下方；控制器，安裝於機台，控制器與第一拍照設備通訊連接；其中，第一拍照設備用於獲取點膠噴嘴的當前圖像，控制器用於將當前圖像與預設的正常運行圖像進行比對，並根據比對結果確定點膠噴嘴的運行狀況。本申請能夠即時監測點膠噴嘴的運行狀況。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides dispensing equipment, a test method and a calibration method. The dispensing equipment includes: a machine; a dispensing mechanism, installed on the machine, the dispensing mechanism including a dispensing nozzle; a first imaging device, installed on the machine and located below the dispensing nozzle; a controller, installed on the machine, the controller being communicatively connected to a first imaging device, which is used to obtain a current image of the dispensing nozzle, and the controller being used to compare the current image with a predetermined normal operation image and determine an operation state of the dispensing nozzle based on a comparison result. This application can monitor the operation states of the dispensing nozzle in real time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:點膠設備</p>  
        <p type="p">10:機台</p>  
        <p type="p">20:移動機構</p>  
        <p type="p">21:第一移動單元</p>  
        <p type="p">22:第二移動單元</p>  
        <p type="p">23:第三移動單元</p>  
        <p type="p">30:點膠機構</p>  
        <p type="p">31:點膠噴嘴</p>  
        <p type="p">32:點膠閥</p>  
        <p type="p">40:第一拍照設備</p>  
        <p type="p">50:控制器</p>  
        <p type="p">60:校正機構</p>  
        <p type="p">61:第二拍照設備</p>  
        <p type="p">62:校正平臺</p>  
        <p type="p">70:清洗機構</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="711" publication-number="202614274"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614274.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614274</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113146862</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及利用該裝置的多成分薄膜形成方法</chinese-title>  
        <english-title>APPARATUS FOR PROCESSING SUBSTRATE AND METHOD OF FORMING MULTI-COMPONENT THIN FILM USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250704B">H01L21/67</main-classification>  
        <further-classification edition="200601120250704B">C23C16/455</further-classification>  
        <further-classification edition="200601120250704B">C23C16/40</further-classification>  
        <further-classification edition="200601120250704B">C23C16/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商圓益ＩＰＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONIK IPS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹承熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, SEUNG HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯容昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOR, YONG HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李成煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SUNG HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴又永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, WOO YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫炳國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, BYOUNG GUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種基板處理裝置及利用該裝置的多成分薄膜沉積方法的相關技術。根據本實施例的基板處理裝置包括被複數個分離區域劃分的複數個製程區域。將複數個製程區域中的至少兩個區域控制成選擇性地噴射相互不同的兩種製程氣體。據此，通過複數個製程區域循環一次的單位循環週期生成的薄膜形成為分別包含構成所述相互不同的兩種製程氣體的原子，進而可形成多成分薄膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S4:第一基板~第四基板</p>  
        <p type="p">UC1:第一單位循環週期</p>  
        <p type="p">UC2:第二單位循環週期</p>  
        <p type="p">ST10~ST240:步驟</p>  
        <p type="p">&lt;img align="absmiddle" height="20px" width="20px" file="d10001.TIF" alt="其他非圖式ed10001.png" img-content="character" orientation="portrait" inline="no" giffile="ed10001.png"&gt; &lt;/img&gt;:供應吹掃氣體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="712" publication-number="202613814"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613814.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613814</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113146940</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>驗證資訊之裝置及其方法</chinese-title>  
        <english-title>APPARATUS FOR VALIDATING INFORMATION AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">G06F11/08</main-classification>  
        <further-classification edition="201301120250602B">G06F21/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉文廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WENTING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明，揭示一種於電子裝置中驗證資訊之方法，其包括如下步驟：確認目標資料；執行用於目標資料之綜合驗證功能；及基於綜合驗證功能而獲得目標資料之驗證結果資訊；且執行綜合驗證功能之步驟包括確認是否存在與目標資料相關聯之錯誤之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:電子裝置</p>  
        <p type="p">120:伺服器</p>  
        <p type="p">201:動作</p>  
        <p type="p">202:動作</p>  
        <p type="p">203:動作</p>  
        <p type="p">204:動作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="713" publication-number="202613622"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613622.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613622</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113147022</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250106B">G02B6/122</main-classification>  
        <further-classification edition="201301120250106B">H04B10/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日月光半導體製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED SEMICONDUCTOR ENGINEERING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳政廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHENG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林弘毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳弈錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電子裝置。該電子裝置包括複數個第一處理單元及一第一傳輸模組。該等第一處理單元安置於一資料處理中心中。該第一傳輸模組經組態以調整一光學傳輸方向以透過光學無線通信使該等第一處理單元中之一者與一第二處理單元通信。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device is provided. The electronic device includes a plurality of first processing units and a first transmission module. The first processing units are disposed in a data processing center. The first transmission module is configured to adjust an optical transmission direction to communicate one of the first processing units with a second processing unit through optical wireless communication.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子裝置</p>  
        <p type="p">1A:封裝結構</p>  
        <p type="p">1B:封裝結構</p>  
        <p type="p">10:電路結構</p>  
        <p type="p">10V:導孔</p>  
        <p type="p">50:電子組件</p>  
        <p type="p">50A:電子組件</p>  
        <p type="p">50B:電子組件</p>  
        <p type="p">50C:電子組件</p>  
        <p type="p">50N:電子組件</p>  
        <p type="p">80:電力單元</p>  
        <p type="p">101:表面</p>  
        <p type="p">102:表面</p>  
        <p type="p">110A:處理陣列</p>  
        <p type="p">110B:處理陣列</p>  
        <p type="p">300:傳輸模組</p>  
        <p type="p">300A:傳輸模組</p>  
        <p type="p">300B:傳輸模組</p>  
        <p type="p">300C:傳輸模組</p>  
        <p type="p">300N:傳輸模組</p>  
        <p type="p">300s:發光區域</p>  
        <p type="p">DR1:方向</p>  
        <p type="p">DR2:方向</p>  
        <p type="p">DR3:方向</p>  
        <p type="p">N1:法線方向</p>  
        <p type="p">P1:傳輸路徑</p>  
        <p type="p">P2:傳輸路徑</p>  
        <p type="p">P3:傳輸路徑</p>  
        <p type="p">T1:熱通道</p>  
        <p type="p">V1:電力路徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="714" publication-number="202613927"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613927.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613927</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113147116</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供廣告資訊之裝置及其方法</chinese-title>  
        <english-title>APPARATUS FOR PROVIDING ADVERTISEMENT INFORMATION AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250602B">G06Q30/0241</main-classification>  
        <further-classification edition="202301120250602B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秀姜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SU GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳慧珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, HYE JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　德瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENG, DERRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明，揭示一種於電子裝置中提供廣告資訊之方法，其包括如下步驟：確認複數個廣告關鍵詞；基於複數個廣告關鍵詞中之至少一個關鍵詞而獲得廣告訊息資訊；及判斷是否將廣告訊息資訊包括於要提供給顧客之目標訊息組中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:電子裝置</p>  
        <p type="p">120:顧客之裝置</p>  
        <p type="p">201:動作</p>  
        <p type="p">202:動作</p>  
        <p type="p">203:動作</p>  
        <p type="p">204:動作</p>  
        <p type="p">210:動作</p>  
        <p type="p">220:動作</p>  
        <p type="p">230:動作</p>  
        <p type="p">240:動作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="715" publication-number="202614006"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614006.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614006</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113147173</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偵測雜訊干擾之顯示控制電路及其控制方法</chinese-title>  
        <english-title>DISPLAY CONTROL CIRCUIT FOR DETECTING NOISE INTERFERENCE AND CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250205B">G09G3/00</main-classification>  
        <further-classification edition="200601120250205B">G09G3/36</further-classification>  
        <further-classification edition="200601120250205B">G09G5/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許亘亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HSUAN-YA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡仁傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, JEN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳澤宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TSE-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐錦鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種偵測雜訊干擾之顯示控制電路及其控制方法，顯示控制電路包括顯示驅動器與時序控制器，時序控制器耦接顯示驅動器。在控制方法中，顯示驅動器設定非同步訊號，其表示時序控制器與顯示驅動器不同步。在顯示驅動器或時序控制器判斷非同步訊號之時間區間小於預設時間區間時，顯示驅動器執行雜訊干擾模式。在顯示驅動器或時序控制器判斷非同步訊號之時間區間等於或大於預設時間區間時，且在雜訊干擾模式執行後，顯示驅動器執行當機重置模式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure describes a display control circuit for detecting noise interference and a control method thereof. The display control circuit includes a display driver and a timing controller. The timing controller is coupled to the display driver. In the control method, the display driver sets an asynchronization signal which indicates that the timing controller is desynchronized from the display driver. The display driver performs a noise interference mode when the display driver or the timing controller determines that the time duration of the asynchronization signal is less than a given time duration. The display driver performs a crash reset mode after the noise interference mode is performed when the display driver or the timing controller determines that the time duration of the asynchronization signal is equal to or greater than the given time duration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10、S12、S14、S16:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="716" publication-number="202613695"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613695.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613695</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113147496</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>監控攝影機</chinese-title>  
        <english-title>SURVEILLANCE CAMERA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120241231B">G03B17/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>四零四科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOXA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁振誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, CHEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃逸群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種監控攝影機，其包含有一殼體、一影像擷取裝置以及一鎖定裝置，該影像擷取裝置係至少部分設置於該殼體內，該鎖定裝置係設置在該殼體與該影像擷取裝置之間，該鎖定裝置包含有一操作件，該操作件係樞轉設置在該殼體與該影像擷取裝置之間且用來於一鎖定位置與一解鎖位置之間切換，當該操作件由該解鎖位置移動至該鎖定位置時，該影像擷取裝置沿一第一方向移動，以使該影像擷取裝置與該鎖定裝置彼此緊配合且該鎖定裝置與該殼體彼此緊配合，從而鎖定該影像擷取裝置的方位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A surveillance camera is provided and includes a shell, an image capturing device and a locking device. The image capturing device is at least partially disposed inside the shell. The locking device is disposed between the shell and the image capturing device. The locking device includes an operating component pivotally disposed between the shell and the image capturing device and switchable between a locking position and an unlocking position. When the operating component moves from the unlocking position to the locking position, the image capturing device moves along a first direction to establish a tight fit between the image capturing device and the locking device and a tight fit between the locking device and the shell for locking an orientation of the image capturing device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:監控攝影機</p>  
        <p type="p">112:底座</p>  
        <p type="p">113:輔助件</p>  
        <p type="p">12:影像擷取裝置</p>  
        <p type="p">121:卡合結構</p>  
        <p type="p">13:鎖定裝置</p>  
        <p type="p">131:操作件</p>  
        <p type="p">132:支撐件</p>  
        <p type="p">133:支架</p>  
        <p type="p">A1:第一轉軸</p>  
        <p type="p">A2:第二轉軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="717" publication-number="202613923"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613923.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613923</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113147677</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>會員管理方法及電子裝置</chinese-title>  
        <english-title>METHOD AND ELECTRONIC DEVICE FOR MANAGING MEMBERSHIP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250213B">G06Q30/02</main-classification>  
        <further-classification edition="202301120250213B">G06Q30/06</further-classification>  
        <further-classification edition="200601120250213B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓承美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, SEUNGMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　凱瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CATHERINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜河羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, HARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金宥菈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOO RA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開會員管理方法，所述會員管理方法通過至少一個處理器執行，所述會員管理方法包括：響應于接收與取消第一服務的會員相關的用戶輸入，判斷是否存在用戶在利用所述第一服務的過程中享受的會員的優惠歷史；當判斷爲存在優惠歷史時，按照在第一服務中提供的會員的多個優惠類別獲取用戶享受的優惠歷史信息；以及通過用于提供第一服務的第一應用程序，顯示與申請取消會員有關的畫面，所述畫面包括對應于按照多個優惠類別獲取的優惠歷史信息的至少一個第一內容。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for managing membership performed by at least one processor is disclosed. The method includes, in response to receiving a user input associated with a cancellation of a membership for a first service, determining whether a benefit history of the membership that a user received while using the first service exists, in response to determining that the benefit history exists, obtaining benefit history information received by the user for each of a plurality of benefit categories of the membership provided by the first service, and displaying, through a first application for providing the first service, a screen associated with a cancellation request for the membership and including at least one first content corresponding to the benefit history information obtained for each of the plurality of benefit categories.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:用戶</p>  
        <p type="p">110:電子裝置</p>  
        <p type="p">120:會員管理畫面</p>  
        <p type="p">130:申請取消會員畫面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="718" publication-number="202614551"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614551.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614551</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148258</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光電系統</chinese-title>  
        <english-title>PHOTOVOLTAIC SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120241219B">H02S30/00</main-classification>  
        <further-classification edition="201401120241219B">H02S20/23</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友達光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張立偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, LI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛嘉賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSUEH, CHIA-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宏洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUNG-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林恬宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TIEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布拉德福德　傑瑞德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRADFORD, JARED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光電系統包括板體、支架以及光電板。板體具有底板與兩側壁。兩側壁彼此相對並連接於底板。底板與兩側壁形成容置空間。支架於容置空間中。支架包括主要部位、第一側邊部位以及第二側邊部位。第一側邊部位自主要部位的第一側沿著兩側壁中之一者延伸並耦接至兩側壁中之所述一者。第二側邊部位自主要部位的第二側延伸。第一側相鄰於第二側。光電板於容置空間中且於支架的主要部位上方。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A photovoltaic system includes a sheet, a bracket, and a photovoltaic panel. The sheet has a base board and two side walls. The two side walls are opposite to each other and connected to the base board. The base board and the two side walls form an accommodating space. The bracket is in the accommodating space. The bracket includes a main portion, a first side portion, and a second side portion. The first side portion extends from a first side of the main portion along one of the two side walls and is coupled to the one of the two side walls. The second side portion extends from a second side of the main portion. The first side is adjacent to the second side. The photovoltaic panel is in the accommodating space and over the main portion of the bracket.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光電系統</p>  
        <p type="p">100:板體</p>  
        <p type="p">110:底板</p>  
        <p type="p">120:側壁</p>  
        <p type="p">200:支架</p>  
        <p type="p">210:主要部位</p>  
        <p type="p">211,212:側邊部位</p>  
        <p type="p">220:黏著物</p>  
        <p type="p">300:光電板</p>  
        <p type="p">D:距離</p>  
        <p type="p">S:容置空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="719" publication-number="202613943"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613943.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613943</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148286</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供物品信息的方法及電子裝置</chinese-title>  
        <english-title>METHOD AND ELECTRONIC DEVICE FOR PROVIDING ITEM INFORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250205B">G06Q30/0601</main-classification>  
        <further-classification edition="202301120250205B">G06Q30/0241</further-classification>  
        <further-classification edition="200601120250205B">G06F3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏岷宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEOM, MINWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西門弘益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEOMOON, HONGIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金賢珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUNSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙容衍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, SEUNGYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供在電子裝置中提供物品信息的方法。該物品信息提供方法包括如下步驟：識別與用戶識別信息對應的利用歷史記錄，所述用戶識別信息注册在向用戶終端提供的應用程序上；識別從包含在所識別的所述利用歷史記錄的至少一個物品中去除用戶購買的物品的物品列表；按類別分配包含在所識別的所述物品列表的物品來生成類別列表；通過所述用戶終端，向所述應用程序的主頁提供包含所生成的所述類別列表的至少一部分的主微件；以及響應于接收從包含在所述主微件的所述類別列表中選擇特定類別的用戶輸入，通過所述用戶終端提供與所述物品列表及所述特定類別有關的登錄頁面，所述登錄頁面包括：第一微件，顯示所述類別列表；第二微件，排列顯示包含在所述物品列表的物品中與所述特定類別有關的物品；以及第三微件，排列顯示未包含在所述物品列表且與所述特定類別有關的物品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a method for providing item information on an electronic device. The method includes identifying a usage history corresponding to user identification information registered in an application provided on a user device, identifying an item list that excludes items purchased by a user among at least one item included in the identified usage history, generating a category list by categorizing items included in the identified item list by category, providing a main widget that includes at least part of the generated category list on a main page of the application through the user device, and in response to receiving a user input selecting a specific category from among the category list included in the main widget, providing the item list and a landing page associated with the specific category through the user device, wherein the landing page includes a first widget displaying the category list, a second widget displaying items associated with the specific category from among the items included in the item list in an arranged order, and a third widget displaying items not included in the item list and associated with the specific category in an arranged order.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:用戶</p>  
        <p type="p">110:用戶終端</p>  
        <p type="p">120:畫面</p>  
        <p type="p">130~180:區域</p>  
        <p type="p">142:第一類別</p>  
        <p type="p">144:第二類別</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="720" publication-number="202613924"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613924.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613924</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148291</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供物品之資訊之裝置及其方法</chinese-title>  
        <english-title>APPARATUS FOR PROVIDING INFORMATION ON ITEMS AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">G06Q30/02</main-classification>  
        <further-classification edition="202401120250801B">G06Q10/08</further-classification>  
        <further-classification edition="202301120250801B">G06Q30/06</further-classification>  
        <further-classification edition="200601120250801B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉勉特　阿恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAMET, ARNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉霖善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, LAM SUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金素珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SO JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西門弘益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEOMOON, HONG IK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金賢洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUN SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本發明，揭示一種於電子裝置中提供資訊之方法，其包括如下步驟：對確定向顧客提供其資訊之物品及購買物品時可選擇之一個以上之屬性的組合進行確認；判斷與物品及一個以上之屬性之組合相關聯之顧客之購買歷史是否滿足設定的條件；於判斷為顧客之購買歷史滿足設定之條件之情形時，以包括與顧客之購買歷史相關聯之資訊之方式獲得物品之資訊及指示一個以上之屬性之組合的資訊；及向顧客提供包括物品之資訊及指示一個以上之屬性之組合之資訊的頁面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:用戶終端</p>  
        <p type="p">120:顧客之裝置</p>  
        <p type="p">210:動作</p>  
        <p type="p">220:動作</p>  
        <p type="p">230:動作</p>  
        <p type="p">240:動作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="721" publication-number="202613944"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613944.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613944</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148576</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>與服務相關之測試管理方法及用於該方法之電子裝置</chinese-title>  
        <english-title>TEST MANAGEMENT METHOD RELATED TO SERVICE AND ELECTRONIC DEVICE FOR PERFORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250602B">G06Q30/0601</main-classification>  
        <further-classification edition="202301120250602B">G06Q30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李德乾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, DEQIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋金龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, JINLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種電子裝置之與服務相關之測試管理方法。具體而言，電子裝置之與服務相關之測試管理方法可包括如下步驟：獲得與成為設定之A/B測試之對象之用戶相關的至少一個值；獲得與對應於至少一個值之複數個數位之複數個條件相關之用戶資訊；基於用戶資訊與至少一個值而確認用戶組，該用戶組包括與服務相關之用戶中之當前正在登入之用戶；及對用戶組實行A/B測試。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p>  
        <p type="p">S240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="722" publication-number="202613754"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613754.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613754</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113148738</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>溫度控制方法、系統、電子設備及存儲介質</chinese-title>  
        <english-title>TEMPERATURE CONTROL METHOD, SYSTEM, ELECTRONIC DEVICE, AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G05D23/22</main-classification>  
        <further-classification edition="200601120250401B">G05B11/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒存偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, CUN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈寶佩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIA, BAO-PEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉思</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出一種溫度控制方法、系統、電子設備及存儲介質，所述方法包括：在確定搜索到所述溫度檢測設備的通信地址的情況下，接收當前環境溫度；根據所述當前環境溫度、預設的目標溫度和預設的溫控係數，確定溫控策略以及對應的控制時長；基於所述控制時長執行所述溫控策略，其中，所述溫控策略用於改變所述溫控設備的溫度；在執行所述溫控策略的時長達到對應的所述控制時長的情況下，停止執行所述溫控策略。本申請能夠提升利用溫控設備控制環境溫度的準確度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a temperature control method, a system, an electronic device, and a storage medium. The method includes: upon a condition that a communication address of a temperature detection device is found, receiving a current ambient temperature; determining a temperature control strategy and a corresponding control duration based on the current ambient temperature, a preset target temperature, and a preset temperature control coefficient; executing the temperature control strategy based on the control duration, the temperature control strategy being used to adjust a temperature of the temperature control device; when a duration of executing the temperature control strategy reaches the corresponding control duration, stopping executing the temperature control strategy. The present application can increase the accuracy of controlling the ambient temperature using a temperature control device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S20~S23:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="723" publication-number="202612917"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612917.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612917</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149657</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>裝飾膜、裝飾膜的製造方法及目標基板的裝飾方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250630B">B44C1/16</main-classification>  
        <further-classification edition="201401120250630B">B42D25/40</further-classification>  
        <further-classification edition="200601120250630B">B32B33/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商利昂哈德　庫爾茲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEONHARD KURZ STIFTUNG &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坦皮爾　史戴方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMPIER, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃耀霆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於裝飾目標基板（40）的裝飾膜（1），特別是冷壓膜或熱壓膜，該裝飾膜包含載體膜（10）及可以自該載體膜（10）上剝離的總漆層（20），其中該載體膜（10）具有一厚度介於1.0～10.0 µm之間，特別是介於3.0～10 µm之間，較佳為介於3.0～6 µm之間，其中該總漆層（20）具有一厚度介於0.4～0.95 µm之間，特別是介於0.5～0.9 µm之間，尤其是介於0.5～0.7 µm之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:裝飾膜</p>  
        <p type="p">10:載體膜</p>  
        <p type="p">20:總漆層</p>  
        <p type="p">21:離型層</p>  
        <p type="p">22:保護漆層</p>  
        <p type="p">23:裝飾層</p>  
        <p type="p">24:打底層</p>  
        <p type="p">F:「中性軸」</p>  
        <p type="p">T:分離平面</p>  
        <p type="p">X:「中性軸」F與分離平面X之間的距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="724" publication-number="202614620"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614620.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614620</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113149885</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像處理方法與影像處理電路</chinese-title>  
        <english-title>IMAGE PROCESSING METHOD AND ASSOCIATED IMAGE PROCESSING CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120250203B">H04N19/513</main-classification>  
        <further-classification edition="201401120250203B">H04N19/50</further-classification>  
        <further-classification edition="201701120250203B">G06T7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞昱半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王燕婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YANTING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傘光宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAN, GUANGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴佳寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI, JIANING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了一種影像處理方法，其包含有以下步驟：接收一影像訊號，其中該影像訊號包含一圖框；對該圖框的多個區塊進行運動估計以產生該多個區塊的多個第一運動向量；對該圖框進行縮小操作以產生一第一縮小後圖框；對該第一縮小後圖框的一第一特定區塊進行運動估計以產生對應於該第一特定區塊的一第二運動向量；分別判斷該第一特定區塊的該第二運動向量與該多個區塊之該多個第一運動向量的差異以產生多個判斷結果；以及根據該多個判斷結果、該多個第一運動向量以及該第二運動向量，以決定出該圖框之該多個區塊的多個最終運動向量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides an image processing method, which includes the steps of: receiving an image signal, wherein the image signal includes a frame; performing motion estimation on multiple blocks of the frame to generate multiple first motion vectors of the multiple blocks; scaling-down the frame to generate a first scaled-down frame; performing motion estimation on a first specific block of the first scaled-down frame to generate a second motion vector corresponding to the first specific block; determining differences between the second motion vector of the first specific block and the multiple first motion vectors of the multiple blocks to generate multiple determination results; and determining multiple final motion vectors of the blocks of the frame according to the multiple determination results, the multiple first motion vectors and the second motion vector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:影像處理電路</p>  
        <p type="p">102:後端處理電路</p>  
        <p type="p">104:顯示面板</p>  
        <p type="p">110:接收電路</p>  
        <p type="p">120:運動估計電路</p>  
        <p type="p">130:縮放電路</p>  
        <p type="p">140:運動向量產生電路</p>  
        <p type="p">150:運動補償電路</p>  
        <p type="p">Din:影像訊號</p>  
        <p type="p">F1:圖框</p>  
        <p type="p">F1_1、F1_2:縮小後圖框</p>  
        <p type="p">MV_1,MV_m:運動向量</p>  
        <p type="p">MV:最終運動向量</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="725" publication-number="202613546"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613546.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613546</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150035</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>優化餘振頻率的檢測方法及採用於該檢測方法的檢測電路</chinese-title>  
        <english-title>DETECTION METHOD OF OPTIMIZING AN AFTERSHOCK FREQUENCY AND DETECTION CIRCUIT USED IN THE DETECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250512B">G01N29/12</main-classification>  
        <further-classification edition="200601120250512B">G01N29/04</further-classification>  
        <further-classification edition="200601120250512B">G01N29/36</further-classification>  
        <further-classification edition="200601120250512B">G01N29/30</further-classification>  
        <further-classification edition="200601120250512B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商輝創電子科技（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHETRON ELECTRONICS (SUZHOU)CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁武軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, WUJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金玉書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余奕賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種採用於優化餘振頻率的檢測方法的檢測電路，包括一個驅動電路，所述的驅動電路連接待檢測的超聲波探頭，所述的超聲波探頭向外連接一訊號處理裝置，在所述的超聲波探頭和該訊號處理裝置之間設置有兩個並聯的電阻，其中一個電阻連接一個微控制器，控制與該檢測電路連接的開關；其檢測方法包括第一步至第四步之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A detection circuit used in a detection method of optimizing aftershock frequency includes a driving circuit. The driving circuit is connected to an ultrasonic probe to be detected. The ultrasonic probe is connected to a signal processing device. There are two resistors connected in parallel and disposed between the ultrasonic probe and the signal processing device. One of the resistors is connected to a microcontroller to control a switch connected to the detection circuit. The detection method includes steps from the first step to the fourth step.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:超聲波探頭</p>  
        <p type="p">2a:電阻</p>  
        <p type="p">2b:電阻</p>  
        <p type="p">3:開關</p>  
        <p type="p">4:開關控制訊號</p>  
        <p type="p">5:微控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="726" publication-number="202613580"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613580.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613580</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150418</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可檢測顯示面板裂縫的測試電路和測試方法</chinese-title>  
        <english-title>TESTING CIRCUIT AND TESTING METHOD CAPABLE OF DETECTING CRACKS OF DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250501B">G01R31/28</main-classification>  
        <further-classification edition="200601120250501B">G02F1/133</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃秋皇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIU-HUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">測試電路和測試方法。測試電路包括第一接墊、第二接墊、第一測試訊號產生器、第二測試訊號產生器、開關電路和測試訊號接收器。第一和第二接墊分別耦合跨越導電環結構。第一測試訊號產生器耦合至第一接墊並配置為提供第一測試訊號至第一接墊。第二測試訊號產生器耦合至第二接墊並配置為提供第二測試訊號至第二接墊。開關電路配置為控制第一測試訊號產生器和第二測試訊號產生器分別在第一和第二模式中提供第一和第二測試訊號。測試訊號接收器配置為根據從第一接墊接收的電壓訊號產生測試結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Testing circuits and testing method are provided. The testing circuit includes a first pad, a second pad, a first test signal generator, a second test signal generator, a switch circuit, and a test signal receiver. The first and second pads are to be respectively coupled across the conductive ring structure. The first test signal generator is coupled to the first pad and configured to provide a first test signal to the first pad. The second test signal generator is coupled to the second pad and configured to provide a second test signal to the second pad. The switch circuit is configured to control the first test signal generator and the second test signal generator to provide the first and second test signals respectively in a first and second modes. The test signal receiver is configured to generate a test result according to a voltage signal received from the first pad.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:測試電路</p>  
        <p type="p">10:第一測試訊號產生器</p>  
        <p type="p">11:開關電路</p>  
        <p type="p">11-1:第一開關</p>  
        <p type="p">11-2:第二開關</p>  
        <p type="p">12:測試訊號接收器</p>  
        <p type="p">13:第二測試訊號產生器</p>  
        <p type="p">CRS:導電環結構</p>  
        <p type="p">P1,P2:接墊</p>  
        <p type="p">R:電阻</p>  
        <p type="p">TR1,TR2:測試結果</p>  
        <p type="p">TS1,TS2:測試訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="727" publication-number="202613812"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613812.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613812</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150581</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理方法、處理裝置、電子設備和存儲介質</chinese-title>  
        <english-title>AN INFORMATION PROCESSING METHOD, A PROCESSING APPARATUS, AN ELECTRONIC DEVICE AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">G06F9/50</main-classification>  
        <further-classification edition="200601120250602B">G06F9/06</further-classification>  
        <further-classification edition="200601120250602B">G06F3/06</further-classification>  
        <further-classification edition="201901120250602B">G06F1/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京有竹居網路技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING YOUZHUJU NETWORK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, XU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>厲航靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HANGJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝永吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, YONGJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴穩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAI, WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王劍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種資訊處理方法、處理裝置、電子設備和非暫態性電腦可讀存儲介質。該資訊處理方法包括：回應於第一處理核需要進入空閒進程，調度第一處理核進入空閒進程並同時監聽第一處理核對應的指定記憶體區域中的資料是否被修改，其中，空閒進程指示第一處理核不執行任何實際操作但保持回應狀態；回應於監聽到指定記憶體區域中的資料被修改，喚醒第一處理核。該資訊處理方法能夠使得調度空閒進程的處理核在進入睡眠狀態的同時監聽一塊預留記憶體，其它處理核可以改寫這塊預留記憶體並快速喚醒處於空閒狀態的處理核，無需發送核間中斷，大幅降低處於空閒狀態的處理核的喚醒延遲。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An information processing method, processing apparatus, electronic device and non-transitory computer-readable storage medium. The information processing method includes: in response to a first processing core requiring to enter an idle process, scheduling the first processing core to enter the idle process and simultaneously monitoring whether data in a designated memory region corresponding to the first processing core is modified, wherein the idle process indicates that the first processing core does not perform any actual operation but to keep a response state; in response to monitoring that the data in the specified memory region is modified, waking up the first processing core. The information processing method can make the processing core scheduling the idle process listen to a reserved memory while entering the sleep state, and other processing cores can rewrite this reserved memory and quickly wake up the processing core in the idle state without sending an inter-core interrupt, thus greatly reducing the wake-up delay of the processing core in the idle state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10、S20:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="728" publication-number="202614076"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614076.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614076</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150609</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置和其製造方法</chinese-title>  
        <english-title>MEMORY DEVICES AND METHODS FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G11C17/08</main-classification>  
        <further-classification edition="200601120250801B">G11C11/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳柏緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, BO-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃家恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIA-EN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇品岱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUE, PIN-DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳蓉萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUNG-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江庭瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, TING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開的實施例提供一種記憶體裝置，其包括記憶體陣列的第一部分和第二部分。第一部分包括複數個第一唯讀記憶體單元，第一唯讀記憶體單元中的每一者包括第一電晶體，第一電晶體具有第一導電類型且電性耦合至第一字元線及第一位元線。第二部分包括複數個第二唯讀記憶體單元，第二唯讀記憶體單元中的每一者包括第二電晶體，第二電晶體具有第二導電類型且電性耦合至第二字元線及第二位元線。第一字元線及第二字元線沿第一橫向方向延伸，且第一位元線及第二位元線沿垂直於第一橫向方向的第二橫向方向延伸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device includes a first portion of a memory array comprising a plurality of first read only memory (ROM) cells, each of the plurality of first ROM cells comprising a first transistor that has a first conductive type and electrically coupled to a first word line and a first bit line. The memory device includes a second portion of the memory array comprising a plurality of second ROM cells, each of the plurality of second ROM cells comprising a second transistor that has a second conductive type and electrically coupled to a second word line and a second bit line. The first word line and second word line extend along a first lateral direction, and the first bit line and second bit line extend along a second lateral direction perpendicular to the first lateral direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:記憶體陣列</p>  
        <p type="p">102A,102B,102C,102D,102E,102F,102G,102H,102I:陣列部分</p>  
        <p type="p">104:字元線電路</p>  
        <p type="p">106:I/O電路</p>  
        <p type="p">106A,106B,106C,106D,106E,106F,106G,106H,106I:I/O部分</p>  
        <p type="p">108:控制器</p>  
        <p type="p">300:配置</p>  
        <p type="p">BL&lt;sub&gt;A&lt;/sub&gt;:位元線</p>  
        <p type="p">n:n型</p>  
        <p type="p">p:p型</p>  
        <p type="p">WL&lt;sub&gt;A&lt;/sub&gt;:字元線</p>  
        <p type="p">X,Y:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="729" publication-number="202613244"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613244.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613244</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150733</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚酯樹脂組成物、其製備方法以及使用其製造的模製物</chinese-title>  
        <english-title>POLYESTER RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE MANUFACTURED USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250409B">C08L67/00</main-classification>  
        <further-classification edition="200601120250409B">C08L25/12</further-classification>  
        <further-classification edition="200601120250409B">C08K7/14</further-classification>  
        <further-classification edition="201901120250409B">B29C48/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG CHEM, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李賢錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYUN SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫先模</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, SUN MO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁玄錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HYUNSUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申光浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, KWANG HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是有關於一種聚酯樹脂組成物、其製備方法以及使用其製造的模製物。根據本發明的聚酯樹脂組成物藉由使用大面積低應變材料作為原材料而可具有優異的大面積低應變特性，滿足機械性質、流動性及熱穩定性之間的物理性質平衡，即使在高溫下亦抑制成霧，且因此為使用所述聚酯樹脂組成物製造的模製物提供優異的產品可靠性及外觀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a polyester resin composition, a method of preparing the same, and a molded article manufactured using the same. The polyester resin composition according to the present invention may have excellent large-area, low-strain characteristics by using a large-area low-strain material as a raw material, satisfy the physical property balance between mechanical properties, fluidity, and thermal stability, suppress fogging even at high temperatures, and thus provide excellent product reliability and appearance to a molded article manufactured using the polyester resin composition.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="730" publication-number="202614021"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614021.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614021</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113150885</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>數據電壓生成電路及方法、源極驅動器和顯示裝置</chinese-title>  
        <english-title>DATA VOLTAGE GENERATING CIRCUIT AND METHOD, SOURCE DRIVER AND DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250210B">G09G3/3225</main-classification>  
        <further-classification edition="201601120250210B">G09G3/3275</further-classification>  
        <further-classification edition="200601120250210B">G09G5/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉懿德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, I-TE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲境</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHE-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於顯示裝置的數據電壓生成電路及方法、源極驅動器和顯示裝置。用於顯示裝置的數據電壓生成電路包括：類比數位轉換器ADC，被配置爲將輸入的電源電壓轉換成電源電壓碼；偏移值確定模組，被配置爲至少部分地基於電源電壓碼確定用於對灰階映射值進行調整的偏移值，其中灰階映射值是灰階數據所對應的映射值；灰階映射值調整模組，被配置爲基於偏移值對灰階映射值進行調整以産生調整後映射值；以及數位-類比轉換器DAC，被配置爲基於調整後映射值生成用於驅動資料線的數據電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data voltage generating circuit and method for a display device, a source driver, and a display device are provided. The data voltage generating circuit for the display apparatus includes: an analog-to-digital converter (ADC) configured to convert an inputted power supply voltage into a power supply voltage code; an offset value determination module configured to determine, based at least in part on the power supply voltage code, an offset value for adjusting a grayscale mapping value, wherein the grayscale mapping value is a mapping value to which grayscale data corresponds; a grayscale mapping value adjustment module configured to adjust the grayscale mapping value based on the offset value to generate an adjusted mapping value; and, a digital-to-analog converter (DAC) configured to generate a data voltage for driving a data line based on the adjusted mapping value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:數據電壓生成電路</p>  
        <p type="p">501:映射模組</p>  
        <p type="p">502:數位-類比轉換器</p>  
        <p type="p">503:類比數位轉換器</p>  
        <p type="p">504:偏移值確定模組</p>  
        <p type="p">505:灰階映射值調整模組</p>  
        <p type="p">Vdata:數據電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="731" publication-number="202614046"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614046.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614046</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151202</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250502B">G11C8/12</main-classification>  
        <further-classification edition="200601120250502B">G11C8/14</further-classification>  
        <further-classification edition="200601120250502B">G11C8/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡田信彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKADA, NOBUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤光司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤学</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, MANABU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小澤貫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZAWA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉稔史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, TOSHIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>的場賢一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATOBA, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能夠高積體化的半導體記憶裝置。 &lt;br/&gt;半導體記憶裝置，係具備有被作了貼合的第1晶片與第2晶片，第2晶片，係具備有被設置在半導體基板與第1晶片之間之第1配線層與第2配線層。第2配線層，係具備有於第2方向上而交互地並排之複數之字元線電壓供給線群、和複數之區塊選擇線群，複數之字元線電壓供給線群，係具備有分別於前述第1方向上延伸並且於前述第2方向上而並排之複數之字元線電壓供給線，複數之區塊選擇線群，係分別包含有第1區塊選擇線、和第2區塊選擇線。第1區塊選擇線，係身為複數之區塊選擇線之中的從第2方向之其中一側所數起之第1個的區塊選擇線，並具備有朝向從於第2方向上而相鄰之字元線導電層而遠離之方向來作彎曲的第1彎曲部。第2區塊選擇線，係具備有在第1方向之端部處而與第1配線層作電性連接之第1連接部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401:連接部</p>  
        <p type="p">402:彎曲部</p>  
        <p type="p">BLKD:區塊解碼器</p>  
        <p type="p">BLKSEL:區塊選擇線</p>  
        <p type="p">BLKSELG(1):區塊選擇線群</p>  
        <p type="p">BLKSELG(2):區塊選擇線群</p>  
        <p type="p">BLKSELG(3):區塊選擇線群</p>  
        <p type="p">BLKSELG(4):區塊選擇線群</p>  
        <p type="p">BLKSELG(5):區塊選擇線群</p>  
        <p type="p">BLK(2n):記憶體區塊</p>  
        <p type="p">BLK(2n+1):記憶體區塊</p>  
        <p type="p">BLK(2n+2):記憶體區塊</p>  
        <p type="p">BLK(2n+3):記憶體區塊</p>  
        <p type="p">BLK(2n+4):記憶體區塊</p>  
        <p type="p">BLK(2n+5):記憶體區塊</p>  
        <p type="p">BLK(2n+6):記憶體區塊</p>  
        <p type="p">CGG(1):電壓供給線群</p>  
        <p type="p">CGG(2):電壓供給線群</p>  
        <p type="p">CGG(3):電壓供給線群</p>  
        <p type="p">CGG(4):電壓供給線群</p>  
        <p type="p">CGG(5):電壓供給線群</p>  
        <p type="p">CGG(6):電壓供給線群</p>  
        <p type="p">c4:接點</p>  
        <p type="p">D3:配線層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="732" publication-number="202614632"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614632.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614632</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151274</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抽拉結構及頭戴式耳機</chinese-title>  
        <english-title>DRAWING STRUCTURE AND HEADPHONES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250108B">H04R5/02</main-classification>  
        <further-classification edition="200601120250108B">H04R1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾英濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, YINGTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例提供了一種抽拉結構及頭戴式耳機，抽拉結構透過在頭梁殼體內設置滑道，頭梁殼體的端部具有阻尼塊容置孔，滑動臂具有依次連接的滑動段和連接段，連接段滑動設置於滑道，抽拉阻尼塊至少部分容置在阻尼塊容置孔中並與滑動段的側表面抵接以在滑動段沿滑道滑動時提供阻尼，由此頭戴式耳機的抽拉結構裝配簡單、牢固可靠，並且在調節長度的過程中能夠提供較為均衡的阻尼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a drawing structure and headphones. The drawing structure comprises a head beam housing. A slide way is disposed in the head beam housing. The end of the head beam housing is provided with a damping block accommodating hole. A sliding arm is provided with a sliding section and a connecting section connected in sequence. The connecting section is disposed on the slide way. A drawing damping block is at least partially accommodated in the damping block accommodating hole and abuts the lateral face of the sliding section to provided damping when the sliding section slides along the slide way. The drawing structure of the headphones is easy to assemble, strong and reliable. More balanced damping is provided during the length adjustment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31:滑動段</p>  
        <p type="p">313:第二止擋面</p>  
        <p type="p">32:連接段</p>  
        <p type="p">51:頭梁殼體</p>  
        <p type="p">511:滑道</p>  
        <p type="p">512:阻尼塊容置孔</p>  
        <p type="p">5121:斜壁孔段</p>  
        <p type="p">513:上殼體</p>  
        <p type="p">514:下殼體</p>  
        <p type="p">515:第一止擋面</p>  
        <p type="p">52:頭梁端蓋</p>  
        <p type="p">70:抽拉阻尼塊</p>  
        <p type="p">82:自由端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="733" publication-number="202614477"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614477.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614477</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151280</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物聯網天線</chinese-title>  
        <english-title>INTERNET OF THING ANTENNA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H01Q1/12</main-classification>  
        <further-classification edition="200601120250203B">H01Q1/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商昆山聯滔電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANTO ELECTRONIC LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁榜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, BANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金列峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, LIEFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例公開了一種物聯網天線，物聯網天線包括第一支撐桿、第二支撐桿、頻寬擴展組件、多個輻射桿和多個保護套，第二支撐桿垂直連接在第一支撐桿頂部，頻寬擴展組件和多個輻射桿安裝在第二支撐桿上。多個保護套包括至少兩個彈性組件和至少兩個保護結構，每個保護套的所有保護結構之間通過彈性組件連接形成環形結構，多個保護套分別套設於多個輻射桿外側，保護了天線結構，並避免輻射桿受外界惡劣環境影響，延長天線的使用壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an internet of thing antenna. The internet of thing antenna comprises a first supporting rod, a second supporting rod, a bandwidth extender, a plurality of radiating rod and a plurality of protective covers. The second supporting rod is orthogonally connected to the top of the first supporting rod. The bandwidth extender and the plurality of radiating rods are mounted on the second supporting rod. The plurality of protective covers comprises at least two elastic components and at least two protective structures. All of the protective structures of each protective cover are connected though the elastic components to form a ring structure. The plurality of protective covers are respectively placed on the outsides of plurality of radiating rods to protect the antenna structure and prevent the radiating rods from being affected by the harsh external environment, thereby extending the antenna’s service life.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:第一支撐桿</p>  
        <p type="p">12:第二支撐桿</p>  
        <p type="p">2:頻寬擴展組件</p>  
        <p type="p">20:擴展單元</p>  
        <p type="p">21:擴展桿</p>  
        <p type="p">3:輻射桿</p>  
        <p type="p">4:保護套</p>  
        <p type="p">5:振子</p>  
        <p type="p">6:避雷針</p>  
        <p type="p">7:反射組件</p>  
        <p type="p">71:主體桿</p>  
        <p type="p">72:反射桿</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="734" publication-number="202614633"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614633.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614633</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151281</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>旋轉結構及頭戴式耳機</chinese-title>  
        <english-title>ROTATING STRUCTURE AND HEADPHONES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H04R5/033</main-classification>  
        <further-classification edition="200601120250203B">H04R5/02</further-classification>  
        <further-classification edition="200601120250203B">H04R1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾英濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, YINGTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種旋轉結構及頭戴式耳機，透過在耳殼上連接旋轉支架，旋轉支架上設置第一旋轉限位結構，在與頭梁主體連接的滑動臂上設置第二旋轉限位結構，第二旋轉限位結構與第一旋轉限位結構相配合以限制耳殼相對於滑動臂的旋轉範圍。由此，透過將旋轉限位結構設置在頭戴式耳機的滑動臂上，使得旋轉結構便於裝配且具有良好的強度，同時這種設置方式容許耳殼具有更大的轉動範圍。並且，本發明實施例在旋轉支架的一端設置旋轉阻尼塊與連接段接觸以對滑動臂相對於旋轉支架的旋轉過程中提供阻尼，由此可以獲得良好的調節手感和角度定位效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a rotating structure and headphones. A rotating bracket is disposed on a housing. A first rotation limiting structure is disposed on the rotating bracket. A second rotation limiting structure is disposed on a sliding arm which is connected to a head beam body. The second rotation limiting structure cooperates with the first rotation limiting structure to limit the rotation range of the housing relative to the sliding arm. By disposing the rotation limiting structure on the sliding arm of the headphones, the rotating structure is easy to assemble and providing great strength, allowing the housing to have a larger rotation range. Moreover, the disclosure provides a rotation damping block on one end of the rotating bracket to contact a connecting section to provide damping during the rotation of the sliding arm relative to the rotating bracket. The great adjustment feeling and angle positioning effect is provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:耳殼</p>  
        <p type="p">11:第二安裝孔</p>  
        <p type="p">12:第二安裝槽</p>  
        <p type="p">13:連接柱</p>  
        <p type="p">20:旋轉支架</p>  
        <p type="p">30:滑動臂</p>  
        <p type="p">31:滑動段</p>  
        <p type="p">32:連接段</p>  
        <p type="p">40:旋轉阻尼塊</p>  
        <p type="p">60:耳殼頂蓋</p>  
        <p type="p">61:耳殼緊固件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="735" publication-number="202614056"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614056.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614056</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151290</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250326B">G11C16/02</main-classification>  
        <further-classification edition="200601120250326B">G11C8/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中井潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萩原洋介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAGIWARA, YOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>常盤直哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKIWA, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有薗大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARIZONO, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川尻皓之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAJIRI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊賀正彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGA, MASAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之半導體記憶裝置具備第1記憶胞電晶體、第2記憶胞電晶體、感測放大器、及控制部。控制部於第1動作模式下，藉由感測放大器感測記憶於第1記憶胞電晶體之資料。控制部於第1動作模式下，將第1規定數之第1讀出電壓調整為對應於複數個第2臨限值電壓分佈之、包含少於第1規定數之第2規定數之第2讀出電壓之第1規定數之第3讀出電壓，且將第1規定數之第3讀出電壓經由字元線，施加於第2記憶胞電晶體之閘極，藉由感測放大器感測記憶於第2記憶胞電晶體之資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:記憶體控制器</p>  
        <p type="p">2:半導體記憶裝置</p>  
        <p type="p">3:記憶體系統</p>  
        <p type="p">11:RAM</p>  
        <p type="p">12:處理器</p>  
        <p type="p">13:主機介面</p>  
        <p type="p">14:ECC電路</p>  
        <p type="p">15:記憶體介面</p>  
        <p type="p">16:匯流排</p>  
        <p type="p">ALE:位址鎖存啟動信號</p>  
        <p type="p">CLE:指令鎖存啟動信號</p>  
        <p type="p">DQ&amp;lt;7：0&amp;gt;:信號</p>  
        <p type="p">DQS:資料選通信號</p>  
        <p type="p">R/B:就緒忙碌信號</p>  
        <p type="p">RE:讀取啟動信號</p>  
        <p type="p">/CE:收發晶片啟動信號</p>  
        <p type="p">/DQS:資料選通信號</p>  
        <p type="p">/RE:讀取啟動信號</p>  
        <p type="p">/WE:寫入啟動信號</p>  
        <p type="p">/WP:寫入保護信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="736" publication-number="202614073"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614073.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614073</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151300</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250317B">G11C16/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅原昭雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGAHARA, AKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠對複數個記憶塊並行地執行抹除動作之半導體記憶裝置。半導體記憶裝置包含：複數個記憶塊，其等分別具備記憶胞及字元線；電壓供給線，其共通地電性連接於與複數個記憶塊對應之複數條字元線；複數個電晶體，其等電性連接於複數條字元線與電壓供給線之間；複數條信號供給線，其等連接於複數個電晶體之閘極電極；複數個塊解碼器單元，其等能夠根據與塊位址對應之信號之輸入而向複數條信號供給線之任一者輸出信號；及控制電路。複數個塊解碼器單元分別具備鎖存電路。控制電路在複數個記憶塊抹除動作中，覆寫與複數個選擇記憶塊對應之複數個鎖存電路之資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S114:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="737" publication-number="202613274"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613274.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613274</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151366</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層體之製造方法、二次元材料積層體之製造方法及含有二次元材料之積層體之製造裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C09J201/00</main-classification>  
        <further-classification edition="201801120251229B">C09J7/38</further-classification>  
        <further-classification edition="200601120251229B">H01L21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人九州大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商二次元材料研究所有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INSTITUTE FOR 2D MATERIALS LLC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本田哲士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONDA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吾郷浩樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中谷真季</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATANI, MAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河原憲治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAHARA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">積層體之製造方法包括：準備步驟，其係準備依序積層有第1基板(21)、二次元材料(30)、及經硬化之支持層(10)之積層體(102)；及分離步驟，其係將包含支持層(10)及二次元材料(30)之積層體(103)自第1基板(21)分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:支持層</p>  
        <p type="p">11:基材</p>  
        <p type="p">12:黏著劑層</p>  
        <p type="p">21:第1基板</p>  
        <p type="p">30:二次元材料</p>  
        <p type="p">260:氣泡形成部</p>  
        <p type="p">261:溶液</p>  
        <p type="p">262:電位源</p>  
        <p type="p">262N:負引線</p>  
        <p type="p">262P:正引線</p>  
        <p type="p">263:陽極</p>  
        <p type="p">B:氣泡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="738" publication-number="202614701"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614701.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614701</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151411</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>伺服器機箱以及伺服器</chinese-title>  
        <english-title>SERVER CHASSIS AND SERVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250418B">H05K7/00</main-classification>  
        <further-classification edition="200601120250418B">H05K7/14</further-classification>  
        <further-classification edition="200601120250418B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣達電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUANTA COMPUTER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>叢耀宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSORNG, YAW-TZORNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王銘龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MING-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳弘偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃立揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LI-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種伺服器或伺服器機箱。所述伺服器或伺服器機箱包括一基座、一對把手、以及一對可調銷，基座具有一槽，配置以接收一伺服器模組，把手耦接至基座，可調銷耦接至基板。一對可調銷的每個可調銷配置以嵌合一對把手之相應的一把手，並且每個可調銷可相對於基板移動。在各種實施例中，可調銷包括一銷基座、一細長體、一鎖定球、以及一蓋，細長體耦接至銷基座，並穿過基板的一對通孔的對應的一通孔，鎖定球位於細長體的一部分，並配置以在一展開狀態或一收縮狀態，蓋耦接至細長體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A server or server chassis is disclosed. The server or server chassis includes a base having a slot configured to receive a server module on a base plate, a pair of levers coupled to the base, and a pair of adjustable pins coupled to the base plate. Each adjustable pin of the pair of adjustable pins is configured to engage with a corresponding one of the pair of levers, and each adjustable pin is movable relative to the base plate. In various embodiments, the adjustable pin includes a pin base; an elongated body coupled to the pin base and passing through a corresponding one of a pair of through-holes of the base plate; a locking ball positioned at a portion of the elongated body and configured to be in an expanded state or in a retracted state; and a cap coupled to the elongated body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:伺服器機箱</p>  
        <p type="p">200:伺服器模組</p>  
        <p type="p">300:把手</p>  
        <p type="p">400:可調銷</p>  
        <p type="p">401:銷基座</p>  
        <p type="p">500:基座</p>  
        <p type="p">503:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="739" publication-number="202613937"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613937.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613937</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151423</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以顯示物品之認證資訊之裝置、方法及記錄媒體</chinese-title>  
        <english-title>DEVICE, METHOD, AND RECORDING MEDIUM FOR DISPLAYING CERTIFICATE INFORMATION OF ITEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250701B">G06Q30/06</main-classification>  
        <further-classification edition="202401120250701B">G06Q10/08</further-classification>  
        <further-classification edition="200601120250701B">G06F17/16</further-classification>  
        <further-classification edition="201301120250701B">G06F3/048</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金秀正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUJUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高正妍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, JUNGYOUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金妍才</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YEONJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　寶藍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BO RAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種用以顯示物品之認證資訊之方法。本發明之一實施例之方法可包括如下步驟：自用戶終端獲得用戶對包括一個以上之物品之目錄之資訊之第1頁面的連接請求；識別與上述目錄所包括之一個以上之物品各者對應之一個以上之評論資訊；基於上述一個以上之評論資訊來選擇上述目錄所包括之一個以上之物品中的至少一個目標物品；及以於與上述至少一個目標物品對應之上述第1頁面之區域顯示第1圖標的方式，產生用於輸出上述第1頁面之第1頁面資訊，上述第1圖標指示上述至少一個目標物品之認證；且與上述一個以上之物品對應之上述一個以上之評論資訊各者如下：至少包括上述一個以上之物品各者之評論分數資訊；於登記有與上述評論分數資訊對應之詳細評價資訊之情形時，進而包括上述詳細評價資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:電子裝置</p>  
        <p type="p">120:用戶終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="740" publication-number="202613928"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613928.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613928</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151738</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>廣告自動投放裝置及方法</chinese-title>  
        <english-title>AUTOMATED ADVERTISEMENT PUSHING SYSTEM AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250401B">G06Q30/0241</main-classification>  
        <further-classification edition="201901120250401B">G06F16/9535</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趣放假股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUNLIDAY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃韋力</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEILI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王慕羣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MU CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡幸君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, HSING CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴建勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIEN HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐宏昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉俞佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉思瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的廣告自動投放裝置及方法首先取得用戶電腦的上網行為資訊，其次根據該上網行為資訊判斷該用戶所屬旅遊相關階段（stages of a travel project），接著根據該判斷結果的旅遊相關階段，決定對該用戶投放的廣告並予投放。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses an automated advertisement pushing system and method that obtain browsing behavior data of a user computer, determine one travel-related stage of a travel project relating to the user computer, select an advertising content based on the determined stage and push the advertising content to the user computer.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="741" publication-number="202614741"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614741.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614741</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151791</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250110B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李芳宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, FANG-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉吉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JI-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例提供一種半導體結構，包括設置在基板上方的主動裝置層及設置在主動裝置層上的電容器結構。電容器結構包括設置於主動裝置層上的第一導電層、設置於第一導電層上的絕緣層、設置於絕緣層上的第二導電層、設置於第二導電層上的第三導電層、在俯視圖中圍繞第一導電層的底部內絕緣層、在俯視圖中圍繞底部內絕緣層的第二內導電層、及在俯視圖中圍繞第二內導電層的第三內導電層。此外，本揭露也揭露一種製造半導體結構的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of this disclosure provide a semiconductor structure, including an active device layer disposed over a substrate and a capacitor structure disposed on the active device layer. The capacitor structure includes a first conductive layer disposed on the active device layer, an insulating layer disposed on the first conductive layer, a second conductive layer disposed on the insulating layer, a third conductive layer disposed on the second conductive layer, a bottom inner insulating layer surrounding the first conductive layer in a top view, a second inner conductive layer surrounding the bottom inner insulating layer in the top view, and a third inner conductive layer surrounding the second inner conductive layer in the top view. Additionally, a method of manufacturing a semiconductor structure is also disclosed in this disclosure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:基板</p>  
        <p type="p">112:主動裝置層</p>  
        <p type="p">120:第一支撐層/第一介電層</p>  
        <p type="p">130:底部氧化物層</p>  
        <p type="p">132,152:下部</p>  
        <p type="p">134,154:中部</p>  
        <p type="p">136,156:上部</p>  
        <p type="p">140:第二支撐層/第二介電層</p>  
        <p type="p">150:頂部氧化物層</p>  
        <p type="p">160:第三支撐層/第三介電層</p>  
        <p type="p">OP1:第一開口</p>  
        <p type="p">W1,W2,W3:開口寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="742" publication-number="202614163"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614163.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614163</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151811</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造記憶體元件的方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H01L21/027</main-classification>  
        <further-classification edition="200601120250203B">H01L21/3065</further-classification>  
        <further-classification edition="202301120250203B">H10B80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳倩茹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIEN-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾自立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, TZU-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製造記憶體元件的方法包括形成硬遮罩結構於介電結構上方。硬遮罩結構包括第一硬遮罩層、位於第一硬遮罩層上方的第二硬遮罩層以及位於第二硬遮罩層上方的第三硬遮罩層。方法還包括形成間隔物層於硬遮罩結構上方。間隔物層具有圖案。方法還包括執行圖案化製程，以轉移間隔物層的圖案至硬遮罩結構的第一硬遮罩層與第二硬遮罩層。方法還包括在圖案化製程完成後，自第一硬遮罩層移除第二硬遮罩層。方法還包括通過第一硬遮罩層蝕刻介電結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing a memory device includes forming a hard mask structure over a dielectric structure. The hard mask structure includes a first hard mask layer, a second hard mask layer over the first hard mask layer, and a third hard mask layer over the second hard mask layer. The method further includes forming a spacer layer having a pattern over the hard mask structure. The method further includes performing a patterning process to transfer the pattern of the spacer layer to the first hard mask layer and the second hard mask layer of the hard mask structure. The method further includes removing the second hard mask layer from the first hard mask layer after the patterning process is complete. The method further includes etching the dielectric structure through the first hard mask layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體基材</p>  
        <p type="p">110:介電結構</p>  
        <p type="p">121:第一硬遮罩層</p>  
        <p type="p">P1:圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="743" publication-number="202612843"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612843.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612843</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>113151827</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓力調整方法、壓力調整裝置、電子設備、電腦儲存媒介和電腦程式產品</chinese-title>  
        <english-title>PRESSURE ADJUSTMENT METHOD, PRESSURE ADJUSTMENT APPARATUS, ELECTRONIC APPARATUS, COMPUTER STORAGE MEDIUM, AND COMPUTER PROGRAM PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250407B">B24B29/02</main-classification>  
        <further-classification edition="201201120250407B">B24B37/013</further-classification>  
        <further-classification edition="200601120250407B">B24B49/02</further-classification>  
        <further-classification edition="202301120250407B">G06F18/213</further-classification>  
        <further-classification edition="200601120250407B">H01L21/304</further-classification>  
        <further-classification edition="200601120250407B">G05B1/06</further-classification>  
        <further-classification edition="202101120250407B">G01N27/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華海清科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWATSING TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路新春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, XINCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田芳馨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, FANGXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏藝璿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, YIXUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何啓弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種壓力調整方法、壓力調整裝置、電子設備、電腦儲存媒介和電腦程式產品。該方法包括：獲取拋光設備包括的保持環的溝槽深度與拋光設備工作時電渦流感測器輸出的信號之間的映射關係，電渦流感測器和保持環位於拋光設備包括的拋光墊的兩側，拋光設備對晶圓進行化學機械拋光過程中，在垂直於拋光墊的方向上保持環內的金屬部分至少部分時間與電渦流感測器相對；在拋光設備對晶圓進行化學機械拋光過程中，獲取電渦流感測器的輸出信號；根據映射關係和輸出信號，確定保持環的當前溝槽深度，以調整晶圓的邊緣與拋光墊之間的壓力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pressure adjustment method, a pressure adjustment apparatus, an electronic equipment, a computer storage medium and a computer program product are provided in the embodiments of the present disclosure. The method includes obtaining the mapping relationship between a groove depth of a retaining ring included in a polishing device and a signal output by an eddy current sensor during operation of the polishing device. The eddy current sensor and the retaining ring are disposed on opposite sides of a polishing pad included in the polishing device. A metal portion included in the holding ring is at least partially opposite to the eddy current sensor in a direction perpendicular to the polishing pad in a process of chemical mechanical polishing of a wafer by the polishing device; obtaining an output signal of the eddy current sensor during the process of chemical mechanical polishing of the wafer by the polishing device; determining a current groove depth of the retaining ring based on the mapping relationship and the output signal to adjust the pressure between an edge of the wafer and the polishing pad.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401~404:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="744" publication-number="202613404"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613404.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613404</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114100373</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於發電的風力渦輪系統</chinese-title>  
        <english-title>WIND TURBINE SYSTEM FOR POWER GENERATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250507B">F03D3/04</main-classification>  
        <further-classification edition="200601120250507B">F03D3/06</further-classification>  
        <further-classification edition="201601120250507B">F03D9/11</further-classification>  
        <further-classification edition="201601120250507B">F03D9/25</further-classification>  
        <further-classification edition="201601120250507B">F03D9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商普魯斯能源公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PURUS POWER CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>考托夫　約翰　邁克爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOURTOFF, JOHN MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種風力渦輪系統。該風力渦輪系統包括一流動固結管道及一空氣驅動轉子總成。該流動固結管道為封閉式且自一固結管道上游端延伸至一固結管道下游端。該流動固結管道包括該固結管道上游端處之一氣流捕捉入口，及將該流動固結管道之一截面區域細分為三個或更多個流動路徑的複數個流動分隔件。各流動分隔件及各流動路徑在該固結管道上游端與該固結管道下游端之間延伸。各流動分隔件具有位於該固結管道下游端上游之一分隔件下游端。在各分隔件下游端處，相鄰流動路徑合併為一經合併流動路徑。該三個或更多個流動路徑在該固結管道下游端處逐漸合併為一單一流動路徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wind turbine system is provided. The wind turbine system includes a flow consolidating conduit and an air driven rotor assembly. The flow consolidating conduit is close sided and extends from a consolidating conduit upstream end to a consolidating conduit downstream end. The flow consolidating conduit includes an airflow capture inlet at the consolidating conduit upstream end, and a plurality of flow partitions that subdivide a cross-sectional area of the flow consolidating conduit into three or more flow paths. Each flow partition and each flow path extend between the consolidating conduit upstream end and the consolidating conduit downstream end. Each flow partition has a partition downstream end located upstream of the consolidating conduit downstream end. At each partition downstream end, adjacent flow paths merge into a merged flow path. The three or more flow paths gradually merge into a single flow path at the consolidating conduit downstream end.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1'-1':線</p>  
        <p type="p">2'-2':線</p>  
        <p type="p">3'-3':線</p>  
        <p type="p">100:風力渦輪系統</p>  
        <p type="p">104:建築物</p>  
        <p type="p">106:屋頂</p>  
        <p type="p">108:流動固結管道</p>  
        <p type="p">112:氣流捕捉入口</p>  
        <p type="p">120:風力渦輪外殼</p>  
        <p type="p">124:部分</p>  
        <p type="p">132a:流動分隔件</p>  
        <p type="p">132b:流動分隔件</p>  
        <p type="p">132e:流動分隔件</p>  
        <p type="p">220:旋轉軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="745" publication-number="202613787"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613787.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613787</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101107</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>觸控顯示積體電路及其操作方法以及觸控顯示面板</chinese-title>  
        <english-title>TOUCH DISPLAY INTEGRATED CIRCUIT AND OPERATING METHOD THEREOF, AND TOUCH DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250124B">G06F3/041</main-classification>  
        <further-classification edition="200601120250124B">G09G3/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐季祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OU, CHI-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游翔鉦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HSIANG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李金麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種觸控顯示積體電路及其操作方法以及觸控顯示面板。觸控顯示積體電路包括掃描電路以及處理電路。掃描電路耦接觸控顯示面板中的多個觸控板。掃描電路設定初始區域，並且透過將初始區域依序地移位預置距離來產生多個掃描觸控區域。掃描電路根據多個掃描觸控區域獲取多個觸控感應信號以產生觸控數據。初始區域的大小等於N個觸控板。處理電路耦接掃描電路。處理電路根據觸控數據計算多個掃描觸控區域中每一者所對應的觸控控制資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A touch display integrated circuit （IC） and an operating method thereof, and a touch display device are disclosed. The touch display IC includes a scanning circuit and a processing circuit. The scanning circuit is coupled to multiple touch pads of the touch display panel. The scanning circuit sets an initial area, and generates multiple scanned touch areas by sequentially shifting the initial area with a pre-setting distance. The scanning circuit obtains multiple touch sensing signals according to the scanned touch areas to generate touch data. A size of the initial area equals to N of the touch pads. The processing circuit is coupled to the scanning circuit. The processing circuit calculates touch control information corresponding to each of the scanned touch areas according to the touch data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:觸控顯示裝置</p>  
        <p type="p">100a:觸控顯示積體電路</p>  
        <p type="p">100b:觸控顯示面板</p>  
        <p type="p">110:掃描電路</p>  
        <p type="p">120:處理電路</p>  
        <p type="p">A0:初始區域</p>  
        <p type="p">A1~AQ:掃描觸控區域</p>  
        <p type="p">AA:主動區域</p>  
        <p type="p">DT:預置距離</p>  
        <p type="p">S1:觸控感應信號</p>  
        <p type="p">S2:觸控數據</p>  
        <p type="p">S3:觸控控制資訊</p>  
        <p type="p">TP:觸控板</p>  
        <p type="p">X、Y:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="746" publication-number="202614164"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614164.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614164</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101185</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構的製造方法</chinese-title>  
        <english-title>METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250203B">H01L21/027</main-classification>  
        <further-classification edition="202301120250203B">H10B12/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣友邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YUBON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體結構的製造方法，包含在基板上形成多個位元線結構；在基板上與位元線結構之間形成介電層；在介電層上形成包含經電漿處理的富氧抗反射層以及設置在其上的富矽抗反射層之層堆疊；形成包含遮罩特徵以及開口的圖案化遮罩層在層堆疊上，開口具有小於相鄰的位元線結構之間的間距之第一寬度。方法更包含修整圖案化遮罩層以擴大開口，使得開口具有大於第一寬度的第二寬度；在修整圖案化遮罩層之後，以圖案化遮罩層作為遮罩圖案化層堆疊；以及以經圖案化的層堆疊作為硬遮罩蝕刻基板，以在位元線結構之間形成接觸洞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of manufacturing a semiconductor structure includes forming bit line structures on a substrate; forming a dielectric layer on the substrate and between the bit line structures; forming a layer stack including a plasma treated oxygen-rich ARC layer and a silicon-rich ARC layer on the dielectric layer; forming a patterned mask layer including a mask feature and an opening on the layer stack, the opening has a first width smaller than a pitch between adjacent two of the bit line structures; trimming the patterned mask layer to enlarge the opening such that the opening has a second width greater than the first width; patterning the layer stack by using patterned mask layer as a mask after trimming the patterned mask layer; and etching the substrate to form a contact hole between the bit line structures by using the patterned layer stack as a hard mask.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:基板</p>  
        <p type="p">104:隔離區</p>  
        <p type="p">106:主動區</p>  
        <p type="p">108:隔離層</p>  
        <p type="p">110:位元線接觸</p>  
        <p type="p">120:位元線</p>  
        <p type="p">122:導體層</p>  
        <p type="p">124:絕緣蓋層</p>  
        <p type="p">130:間隔物層</p>  
        <p type="p">140:介電層</p>  
        <p type="p">150:層堆疊</p>  
        <p type="p">151:第一層</p>  
        <p type="p">152:第二層</p>  
        <p type="p">153:第三層</p>  
        <p type="p">154:第四層</p>  
        <p type="p">S18:步驟</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="747" publication-number="202613341"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613341.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613341</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101317</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於沉積的裝置與方法</chinese-title>  
        <english-title>DEVICES AND METHODS FOR DEPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250122B">C23C14/54</main-classification>  
        <further-classification edition="200601120250122B">C23C14/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林勇辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUNG-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴文彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, WEN-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宜玶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, YI-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於執行物理氣相沉積(PVD)的裝置及方法包括一製程腔室。該製程腔室包括一晶圓固持件、帶有環繞一中央開口之一豎直側壁的一環狀屏蔽件、具有自下表面延伸且通過該環狀屏蔽件中的複數個接腳開口之複數個對準接腳的一夾具；及組配來通過該晶圓固持件之該中央開孔的一加熱器。各對準接腳可具有一長度，以使得該對準接腳之一下端不接觸在一製程位置處之該環狀屏蔽件，在該製程位置，該加熱器及該夾具銜接該相關聯之晶圓基體且該環箍不銜接該夾具。該夾具可包括一溝槽，該溝槽銜接處於一釋放或休憩位置之該環狀屏蔽件之該豎直側壁。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Devices and methods for performing physical vapor deposition (PVD) include a process chamber. The process chamber includes a wafer holder, an annular shield with a vertical sidewall around a central opening, a clamp having a plurality of alignment pins extending from the lower surface and passing through the pin openings in the annular shield; and a heater configured to pass through the central aperture of the wafer holder. Each alignment pin may have a length such that a lower end of the alignment pin does not contact the annular shield at a process position where the heater and the clamp engage the associated wafer substrate and the hoop does not engage the clamp. The clamp may include a groove that engages the vertical sidewall of the annular shield in a release or rest position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:沉積裝置</p>  
        <p type="p">110:程序腔室</p>  
        <p type="p">112:腔室底壁，底壁</p>  
        <p type="p">114:腔室頂壁</p>  
        <p type="p">116:腔室側壁</p>  
        <p type="p">118:進入口</p>  
        <p type="p">120:晶圓基體</p>  
        <p type="p">122:上表面</p>  
        <p type="p">124:下表面</p>  
        <p type="p">130:晶圓固持件</p>  
        <p type="p">131:直徑</p>  
        <p type="p">132:支撐軸桿</p>  
        <p type="p">134:環箍本體</p>  
        <p type="p">140:支撐指狀物</p>  
        <p type="p">150:加熱器</p>  
        <p type="p">152:台座</p>  
        <p type="p">153:直徑</p>  
        <p type="p">154:軸桿</p>  
        <p type="p">160:環狀屏蔽件</p>  
        <p type="p">162:側壁</p>  
        <p type="p">164:水平壁</p>  
        <p type="p">165:內端</p>  
        <p type="p">166:接腳開口</p>  
        <p type="p">170:中央開口</p>  
        <p type="p">171:直徑</p>  
        <p type="p">172:豎直側壁</p>  
        <p type="p">173:豎直側壁高度，高度</p>  
        <p type="p">180:濺鍍標靶，標靶</p>  
        <p type="p">185:直徑</p>  
        <p type="p">190:夾具</p>  
        <p type="p">192:環體</p>  
        <p type="p">194:中央開口</p>  
        <p type="p">195:直徑</p>  
        <p type="p">220:對準接腳</p>  
        <p type="p">230:泵</p>  
        <p type="p">232:電源</p>  
        <p type="p">234,236:電路</p>  
        <p type="p">238:第三電路，電路</p>  
        <p type="p">240:氣體入口</p>  
        <p type="p">242:氣體源</p>  
        <p type="p">246:氣體出口</p>  
        <p type="p">248:控制器</p>  
        <p type="p">251:高度，釋放位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="748" publication-number="202614314"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614314.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614314</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101380</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>托架、托架總成、包括托架及托架總成之機械配置及半導體處理系統，以及製造托架總成之方法</chinese-title>  
        <english-title>BRACKETS, BRACKET ASSEMBLIES, MACHINERY ARRANGEMENTS AND SEMICONDUCTOR PROCESSING SYSTEMS INCLUDING BRACKETS AND BRACKET ASSEMBLIES, AND METHODS OF MAKING BRACKET ASSEMBLIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L21/673</main-classification>  
        <further-classification edition="200601120251229B">H01L21/677</further-classification>  
        <further-classification edition="200601120251229B">H01L21/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吕景璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LYU, JINGXUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥可卡洛　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCCULLOUGH, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫達拉　帕塔　薩拉西　雷迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDALA, PARTHA SARATHY REDDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於一種托架，其包括具有一支座部分、一第一及第二帶槽部分及一凸緣部分之一托架。此支座部分界定一托架軸線。此第一帶槽部分及此第二帶槽部分自此托架本體之此支座部分側向偏移。此第二帶槽部分進一步藉由此托架本體之此支座部分與此第一帶槽部分軸向分離。此托架本體之此凸緣部分在與此托架本體之此第一帶槽部分及此第二帶槽部分相反的一方向上側向延伸此托架本體之此支座部分。此托架本體之此凸緣部分進一步與此托架軸線平行地延伸，以約束安放於此托架本體上之一互鎖開關相對於此托架軸線之橫偏角度。亦描述了托架總成、機械配置、半導體處理系統及製造托架總成之相關方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bracket includes a bracket with a seat portion, a first and second slotted portion, and a flange portion. The seat portion defines a bracket axis. The first slotted portion and the second slotted portion are laterally offset from the seat portion of the bracket body. The second slotted portion is further axially separated from the first slotted portion by the seat portion of the bracket body. The flange portion of the bracket body extends laterally the seat portion of the bracket body in a direction opposite the first slotted portion and the second slotted portion of the bracket body. The flange portion of the bracket body further extends in parallel with the bracket axis to constrain yaw angle of an interlock switch seated on the bracket body to the bracket axis. Bracket assemblies, machinery arrangements, semiconductor processing systems, and related methods of making bracket assemblies are also described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">302:方框</p>  
        <p type="p">304:方框</p>  
        <p type="p">306:方框</p>  
        <p type="p">308:方框</p>  
        <p type="p">310:方框</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="749" publication-number="202613339"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613339.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613339</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101390</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>沉積工具及其操作方法</chinese-title>  
        <english-title>DEPOSITION TOOL AND METHODS OF OPERATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250604B">C23C14/22</main-classification>  
        <further-classification edition="200601120250604B">C23C14/56</further-classification>  
        <further-classification edition="200601120250604B">H01L21/68</further-classification>  
        <further-classification edition="200601120250604B">H01L21/687</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承運</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHENG-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田哲瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIEN, CHE-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊旻蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, MIN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">沉積工具包括可旋轉卡盤及/或脈衝化直流(DC)偏壓源。脈衝化DC源可用於在處理腔室中脈衝化DC功率，以達成處理腔室中較低的電子溫度，這使來自材料靶的材料能以高度定向的方式引導朝向半導體基板。這使沉積材料能達成低沉積角度，從而使材料能均勻對稱地沉積至半導體基板中的凹槽之側壁上。另外或其他，可旋轉卡盤可用於在將層沉積至半導體基板上期間旋轉半導體基板，以補償半導體基板上層之沉積速度的不均勻性。這會致能半導體基板上的高度水平厚度均勻性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A deposition tool includes a rotatable chuck and/or a pulsed direct current (DC) bias source. The pulsed DC source may be used to pulse a DC power in the processing chamber to achieve a lower electron temperature in the processing chamber, which enables the material from a material target to be directed toward the semiconductor substrate in a highly directional manner. This enables a low angle of deposition to be achieved for depositing the material, which enables the material to be evenly and symmetrically deposited onto sidewalls of recesses in the semiconductor substrate. Additionally and/or alternatively, the rotatable chuck may be used to rotate the semiconductor substrate during deposition of the layer onto the semiconductor substrate to compensate for nonuniformities in the deposition rate of the layer across the semiconductor substrate. This enables a high horizontal thickness uniformity across the semiconductor substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體處理系統</p>  
        <p type="p">102:主框架結構</p>  
        <p type="p">104:主框架結構</p>  
        <p type="p">106:側壁</p>  
        <p type="p">108:真空負載鎖腔</p>  
        <p type="p">110~122:處理腔室</p>  
        <p type="p">124:外部半導體基板升降機</p>  
        <p type="p">126:半導體基板轉移系統</p>  
        <p type="p">128:機械臂</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="750" publication-number="202613263"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613263.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613263</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101407</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工件加工用片及加工完成之工件的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250701B">C09J7/20</main-classification>  
        <further-classification edition="200601120250701B">C09J201/00</further-classification>  
        <further-classification edition="200601120250701B">C09J133/08</further-classification>  
        <further-classification edition="200601120250701B">C09J11/06</further-classification>  
        <further-classification edition="200601120250701B">H01L21/301</further-classification>  
        <further-classification edition="200601120250701B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商琳得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福元彰朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUMOTO, AKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">議題：提供即使為已進行加熱處理之情形亦能容易地進行工件的分離之工件加工用片。解決方式：一種工件加工用片，其係具備基材與黏著劑層之工件加工用片，前述黏著劑層層積於前述基材中之單面側，前述黏著劑層係由活性能量射線硬化性黏著劑所構成，前述活性能量射線硬化性黏著劑係由含有肟酯系光聚合起始劑及受阻胺（hindered amine）系穩定劑之黏著劑組成物所形成，前述肟酯系光聚合起始劑具有咔唑骨架。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="751" publication-number="202614382"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614382.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614382</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101716</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可獨立裝配被動元件之積體電路封裝及其製造方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT PACKAGE CAPABLE OF INDEPENDENTLY ASSEMBLING PASSIVE DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250926B">H01L23/28</main-classification>  
        <further-classification edition="200601120250926B">H01L23/36</further-classification>  
        <further-classification edition="200601120250926B">H01L21/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立錡科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTEK TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃恒賫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HENG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許麗美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可獨立裝配被動元件之積體電路封裝及其製造方法。該可獨立裝配被動元件之積體電路封裝包含：積體電路，用以安裝於電路板上；以及散熱結構，其獨立製造且具有：第一層平板，配置於積體電路之上，並與積體電路熱接觸；及空腔，位於第一層平板的一側，該空腔具有至少一開口，以裝配被動元件；其中被動元件在組裝時自散熱結構的開口裝入空腔，並透過被動元件之電性導體與電路板或積體電路電連接；其中積體電路所產生之熱經由該散熱結構傳播。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an integrated circuit package capable of independently assembling passive devices and a manufacturing method thereof. The integrated circuit package includes: an integrated circuit configured to be mounted on a circuit board; and a heat dissipation structure, which is manufactured independently and has a first-layer flat plate disposed above the integrated circuit and in thermal contact therewith, and a cavity located on one side of the first-layer flat plate. The cavity is formed with at least one opening to accommodate a passive device. During assembly, the passive device is inserted into the cavity of the heat dissipation structure through the at least one opening and is electrically connected to the circuit board or the integrated circuit via an electrical conductor of the passive device. Heat generated by the integrated circuit is transferred through the heat dissipation structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:可獨立裝配被動元件之積體電路封裝</p>  
        <p type="p">11:電路板</p>  
        <p type="p">12:電感</p>  
        <p type="p">13:電子元件</p>  
        <p type="p">101:積體電路</p>  
        <p type="p">102:散熱結構</p>  
        <p type="p">121:電性導體</p>  
        <p type="p">1021:第一層平板</p>  
        <p type="p">1022:空腔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="752" publication-number="202613822"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613822.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613822</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101880</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統、記憶裝置及控制方法</chinese-title>  
        <english-title>MEMORY SYSTEM, STORAGE APPARATUS, AND CONTROL METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250901B">G06F12/0866</main-classification>  
        <further-classification edition="200601120250901B">G06F13/38</further-classification>  
        <further-classification edition="200601120250901B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中田大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能夠對於溫度上升與性能降低作抑制的記憶體系統以及控制方法。 &lt;br/&gt;記憶體系統，係具備有：非揮發性記憶體，係具有非揮發性之記憶區域，並能夠進行對於記憶區域之資料之讀寫；和控制器，控制器，係包含有：主機介面電路，係從主機裝置，而收訊包含有使非揮發性記憶體將資料作讀寫的命令之外部命令資訊；和記憶體介面電路，係與非揮發性記憶體進行通訊；和命令資訊處理部，係基於外部命令資訊，而產生用以使非揮發性記憶體實行命令之內部命令資訊，並通過記憶體介面電路來將內部命令資訊送訊至非揮發性記憶體處；和延遲電路控制部，係基於在單位時間之期間中而藉由非揮發性記憶體所被作了讀寫的資料量、與第1臨限值，此兩者之大小關係，來對於使命令之實行作延遲的延遲電路進行控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory system includes a non-volatile memory and a controller. The controller includes an instruction information processing unit configured to generate internal instruction information for causing the nonvolatile memory to execute an instruction that causes the non-volatile memory to read and write the data based on external instruction information including the instruction and configured to transmit the internal instruction information to the non-volatile memory through the memory interface circuit, and a delay circuit control unit configured to control a delay circuit based on a magnitude relationship between a data amount read and written by the non-volatile memory during unit time and a first threshold value. The delay circuit is configured to delay execution of the instruction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:非揮發性記憶體</p>  
        <p type="p">11:記憶區域</p>  
        <p type="p">12:溫度感測器</p>  
        <p type="p">20:控制器</p>  
        <p type="p">21:內部邏輯單元</p>  
        <p type="p">22:匯流排</p>  
        <p type="p">23:揮發性記憶體</p>  
        <p type="p">24:主機介面電路</p>  
        <p type="p">25:記憶體介面電路</p>  
        <p type="p">26:計時器</p>  
        <p type="p">27:延遲電路</p>  
        <p type="p">28:動作模式選擇部</p>  
        <p type="p">29:資料量取得部</p>  
        <p type="p">30:溫度資訊取得部</p>  
        <p type="p">31:送收訊資訊處理部</p>  
        <p type="p">32:延遲電路控制部</p>  
        <p type="p">101:記憶體系統</p>  
        <p type="p">111:主機裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="753" publication-number="202613474"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613474.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613474</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101960</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冰箱及冰箱系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250204B">F25D29/00</main-classification>  
        <further-classification edition="200601120250204B">F25D23/00</further-classification>  
        <further-classification edition="201601120250204B">H02J50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立環球生活方案股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI GLOBAL LIFE SOLUTIONS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊地芳輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, YOSHITERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関根隆人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKINE, RYUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大谷匠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTANI, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種可藉由無線於冰箱頂面設置裝置之冰箱及冰箱系統。 &lt;br/&gt;本發明之冰箱具有：絕熱箱體10，其前方開口，於內箱12及金屬製之外箱11之間具備真空絕熱材44；透磁性之蓋41，其配置於絕熱箱體10之上表面；及饋電線圈40，其配置於蓋41與真空絕熱材44之間，可對配置於蓋41之上方之受電單元饋電。蓋41構成為較外箱11之上表面11a凸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:絕熱箱體</p>  
        <p type="p">11:外箱</p>  
        <p type="p">11a:上表面</p>  
        <p type="p">11b:孔(開口)</p>  
        <p type="p">12:內箱</p>  
        <p type="p">21:冷藏室</p>  
        <p type="p">40:饋電線圈(饋電側線圈)</p>  
        <p type="p">41:蓋</p>  
        <p type="p">42:外殼</p>  
        <p type="p">42a:凹部</p>  
        <p type="p">43:電磁波吸收片材</p>  
        <p type="p">44:真空絕熱材</p>  
        <p type="p">45:絕熱材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="754" publication-number="202613017"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613017.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613017</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114101980</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>切斷裝置及硬紙板片材之製造方法以及硬紙板片材製造裝置、硬紙板片材</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250608B">B65H19/18</main-classification>  
        <further-classification edition="200601120250608B">B65H26/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱重工機械系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新田隆司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之切斷裝置係切斷將平坦之裱紙與具有呈波紋形狀之複數個楞峰之內芯貼合而形成之硬紙板片材者，其沿著循相對於順著楞峰之方向傾斜規定角度之方向之切斷線，切斷硬紙板片材。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">25:裁斷機(切斷裝置)</p>  
        <p type="p">50A:第2刀齒滾筒</p>  
        <p type="p">51:上刀齒滾筒</p>  
        <p type="p">52:下刀齒滾筒</p>  
        <p type="p">54,55:軸承部</p>  
        <p type="p">A:面紙/裱紙</p>  
        <p type="p">B:內芯</p>  
        <p type="p">Ba:楞峰</p>  
        <p type="p">C:底紙/裱紙</p>  
        <p type="p">CL2:第2切斷線</p>  
        <p type="p">E,F:雙面硬紙板片材(硬紙板片材)</p>  
        <p type="p">O1,O2:軸心</p>  
        <p type="p">X,Y:方向</p>  
        <p type="p">θ:規定角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="755" publication-number="202612840"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612840.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612840</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102014</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>緊固件進料器頭</chinese-title>  
        <english-title>FASTENER FEEDER HEAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B23P19/06</main-classification>  
        <further-classification edition="200601120251231B">B30B15/30</further-classification>  
        <further-classification edition="200601120251231B">B25B23/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賓工程工廠公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENN ENGINEERING &amp; MANUFACTURING CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫雷岑　沃特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLEIZEN, WOUTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彼特里　弗洛里安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETRY, FLORIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德雷斯勒　拉爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DRESSLER, LARS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於一沖床之進料器裝置將載體條帶上之螺帽自一供應捲盤移動至進料器中，該進料器然後送出該等螺帽以遞送至工件插入地點。該壓機之沖頭自該進料器撿取每一個別緊固件且將該緊固件遞送至下方之一工件，在該工件處該沖頭將該螺帽按壓至該工件中。該進料器僅需要具有向下施加力之一壓機，且除由該壓機之向下力所傳輸之能源之外，不需要額外能源來進行其操作。該進料器之一驅動機構藉由對該壓機沖頭之一凸輪作用來提供動力，該凸輪作用使一緊固件嚙合進料輪旋轉以使該載體條帶前進至該進料器中且穿過該進料器。一分叉進料軌道將緊固件與該載體條帶分離且將鬆動緊固件遞送至該進料輪中，該進料輪將該等鬆動緊固件定位在一拾取點處。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A feeder device for a punch press moves nuts on the carrier strip from a supply reel into the feeder which then presents them for delivery to the workpiece insertion site. The punch of the press picks each individual fastener from the feeder and delivers it to a workpiece below where the punch presses the nut into the workpiece. The feeder only requires a press with downwardly applied force and requires no additional energy source for its operation other than that transmitted by the downward force of the press. A drive mechanism of the feeder is powered by a camming action against the press punch which rotates a fastener-engaging feed wheel to advance the carrier strip into and through the feeder. A bifurcated feed track separates fasteners from the carrier strip and delivers the loose fasteners into the feed wheel which positions them at a pickoff site.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">7:進料器</p>  
        <p type="p">8:端部構件/垂直端部構件/垂直構件框架構件/端部框架構件</p>  
        <p type="p">9:壓機沖頭</p>  
        <p type="p">10:底部基底構件/底部構件/底板/基底構件/進料器底部構件/底部框架構件</p>  
        <p type="p">11:載體條帶</p>  
        <p type="p">12:頂部構件</p>  
        <p type="p">13:沖頭回縮彈簧/回縮彈簧</p>  
        <p type="p">14:突鼻件</p>  
        <p type="p">15:鐵砧</p>  
        <p type="p">16:空載的剩餘載體條帶/空載剩餘部分/剩餘載體條帶</p>  
        <p type="p">18:進料器驅動器件/進料輪驅動區塊/驅動區塊/驅動機構</p>  
        <p type="p">21:螺帽/緊固件</p>  
        <p type="p">32:沖頭尖端/壓機沖頭尖端/沖頭/端部尖端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="756" publication-number="202614523"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614523.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614523</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102052</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>量子級聯雷射元件</chinese-title>  
        <english-title>Quantum Cascade Laser Element</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250509B">H01S5/30</main-classification>  
        <further-classification edition="200601120250509B">H01S5/34</further-classification>  
        <further-classification edition="201101120250509B">B82Y20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立研究開發法人理化學研究所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIKEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明曦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MINGXI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TSUNG-TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大谷知行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTANI, CHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平山秀樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAYAMA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之課題係獲得高輸出之量子級聯雷射（QCL）元件。本揭示之一實施形態的QCL具備：第1電極101，其係展開超過一定範圍的均勻膜；半導體超晶格結構110，配置於第1電極上或是其上方，具有由重複積層的多個單元結構形成的活性區域112；及第2電極102，配置於半導體超晶格結構上或是其上方。第1電極與半導體超晶格結構之間或是半導體超晶格結構與第2電極之間的至少任一者配置有電漿導電層105；第1電極與第2電極之間的輻射場磁場相對於厚度方向的座標呈現非對稱性。在第2電極形成有包含在厚度方向上貫穿其本體之開口之陣列的光子晶體，光子晶體廣泛分布於上述範圍內。第2電極為發射面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="757" publication-number="202613276"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613276.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613276</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102096</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>撥水性膜形成用藥液、裝有藥液的容器、儲存方法及撥水性膜形成用藥液的製造方法</chinese-title>  
        <english-title>WATER-REPELLENT COATING CHEMICAL SOLUTION, CONTAINER FOR CHEMICAL SOLUTION, STORAGE METHOD, AND MANUFACTURING METHOD FOR WATER-REPELLENT COATING CHEMICAL SOLUTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C09K3/18</main-classification>  
        <further-classification edition="200601120251229B">C09D5/16</further-classification>  
        <further-classification edition="200601120251229B">C09D183/00</further-classification>  
        <further-classification edition="200601120251229B">H01L21/027</further-classification>  
        <further-classification edition="200601120251229B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商中央硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大矢浩平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOYA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>公文創一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMON, SOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之純化後的撥水性膜形成用藥液包含矽化劑、具有羰基的溶劑及抗氧化劑，在該撥水性膜形成用藥液之液相在利用光散射式液中粒子偵測器之粒子量測中的粒徑0.2 μm以上之粒子的數量係每1 mL為10個以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The purified water-repellent coating chemical solution of the present invention contains silylating agents, solvent which has carbonyl groups, and antioxidants. Number of particles with a particle size of 0.2 μm or more in particle measurement using light scattering liquid-borne particle counter within the liquid phase of the water-repellent coating chemical solution is 10 or below for 1 mL.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="758" publication-number="202614839"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614839.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614839</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102341</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250709B">H10D64/01</main-classification>  
        <further-classification edition="202501120250709B">H10D64/20</further-classification>  
        <further-classification edition="202501120250709B">H10D64/27</further-classification>  
        <further-classification edition="202501120250709B">H10D64/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHAO-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊宜偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, I-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱栢挺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, PO-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳博弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, BO-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古淑瑗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, SHU-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳嘉仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, RYAN CHIA-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法，包括形成具有平行於第一方向的第一長度方向的複數個半導體區，及形成具有平行於垂直於第一方向的第二方向的第二長度方向的複數個閘極堆疊，其中複數個閘極堆疊在複數個半導體區的第一部分上。方法亦可包括蝕刻複數個半導體區以形成第一複數個開口，及用第一介電材料填充第一複數個開口以形成鰭片隔離區。方法亦可包括在鰭片隔離區與閘極堆疊之間形成隔離介面區。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method that include forming a plurality of semiconductor regions having first lengthwise directions parallel to a first direction, and forming a plurality of gate stacks having second lengthwise directions parallel to a second direction perpendicular to the first direction, wherein the plurality of gate stacks are on first portions of the plurality of semiconductor regions. The method can also include etching the plurality of semiconductor regions to form a first plurality of openings, and filling the first plurality of openings with a first dielectric material to form fin isolation regions. The method can also include forming an isolation interface region between the fin isolation regions and the gate stacks.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">70:替換閘極堆疊/閘極堆疊/閘極結構</p>  
        <p type="p">112:鰭片隔離區/CPODE隔離區/區</p>  
        <p type="p">113:CMG切割CPODE區/CMG隔離介面/區</p>  
        <p type="p">C1:凸突起</p>  
        <p type="p">E1:方形/邊緣</p>  
        <p type="p">P1:平坦側壁/平面</p>  
        <p type="p">S1:第一側壁</p>  
        <p type="p">S2:第二側壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="759" publication-number="202614742"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614742.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614742</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102377</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置與其製造方法</chinese-title>  
        <english-title>MEMORY DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250206B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊英政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, YING-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種形成記憶體裝置的方法包含：在基板中形成溝槽；形成內襯於溝槽的一第一介電層；在溝槽中形成第一導電層；回蝕第一導電層，而在第一導電層上形成原生氧化層；執行蝕刻製程以移除原生氧化層以曝光第一導電層並修整被第一導電層曝光的第一介電層的一部分；及在溝槽中形成與第一導電層接觸的第二導電層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of forming a memory device includes forming a trench in a substrate, forming a first dielectric layer lining the trench, forming a first conductive layer into the trench, etching back the first conductive layer, resulting in a native oxide layer being formed over the first conductive layer, performing an etching process to remove the native oxide layer to expose the first conductive layer and to trim a portion of the first dielectric layer exposed by the first conductive layer, and forming a second conductive layer into the trench and in contact with the first conductive layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">102:隔離結構</p>  
        <p type="p">102A:隔離結構的第一部分</p>  
        <p type="p">102B:隔離結構的第二部分</p>  
        <p type="p">104:摻雜區域</p>  
        <p type="p">110、150:介電層</p>  
        <p type="p">120、140:導電層</p>  
        <p type="p">160:覆蓋層</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">CA:電容器</p>  
        <p type="p">GD:閘極介電層</p>  
        <p type="p">P1:第一部分</p>  
        <p type="p">P2:第二部分</p>  
        <p type="p">P3:第三部分</p>  
        <p type="p">P4:第四部分</p>  
        <p type="p">WL:字元線結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="760" publication-number="202613823"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613823.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613823</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102557</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250602B">G06F12/0866</main-classification>  
        <further-classification edition="200601120250602B">G06F13/14</further-classification>  
        <further-classification edition="200601120250602B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川口優樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAGUCHI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小島慶久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOJIMA, YOSHIHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>天木健彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMAKI, TAKEHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井川原俊一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGAHARA, SHUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>檜田敏克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIDA, TOSHIKATSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明謀求提高記憶體系統之性能。 實施方式之記憶體系統具備非揮發性記憶體及記憶體控制器。非揮發性記憶體包含複數個物理完整區塊，於複數個物理完整區塊之各者中，複數個物理子區塊分別包含記憶胞，記憶胞串聯或並聯地連接於同一位元線。記憶體控制器於複數個物理完整區塊之各者中，對複數個物理子區塊之各者獨立地執行資料之抹除動作，於複數個物理完整區塊之各者中，將複數個物理子區塊全部設定為相同之記憶模式。記憶模式係表示複數個物理子區塊各者所包含之記憶胞中記憶之資料之位元數的設定狀態，於設定為相同記憶模式之物理子區塊所包含之記憶胞中記憶相同位元數之資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">FB(FBa~FBf):物理完整區塊</p>  
        <p type="p">LSB(LSB1~LSB6):邏輯子區塊</p>  
        <p type="p">SB(SBa,SBb):物理子區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="761" publication-number="202614843"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614843.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614843</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102568</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及形成半導體結構之方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250617B">H10D64/20</main-classification>  
        <further-classification edition="202501120250617B">H10D30/62</further-classification>  
        <further-classification edition="202501120250617B">H10D64/01</further-classification>  
        <further-classification edition="200601120250617B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇曼儂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, MAN-NUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭承珞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHEN-LUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張博欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, PO-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江芃萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, PENG-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇煥傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HUAN-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王菘豊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SUNG-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林斌彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PINYEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容係針對一半導體裝置之一結構以及形成該結構之一方法。該結構包括在一電晶體之一閘極結構上的一閘極接觸結構。該閘極接觸結構包括一金屬通孔，其穿過一介電層且接觸該閘極結構之一閘極電極。該金屬通孔包括具有電阻率與平均自由路徑之低乘積值的一金屬，諸如釕。在該金屬通孔與該閘極電極之間的一介面係沒有氧。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure is directed to a structure of a semiconductor device and a method of forming the structure. The structure includes a gate contact structure on a gate structure of a transistor. The gate contact structure includes a metal via through a dielectric layer and in contact with a gate electrode of the gate structure. The metal via includes a metal with a low value of a product of resistivity and a mean free path, such as ruthenium. An interface between the metal via and the gate electrode is oxygen free.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">102:基體</p>  
        <p type="p">105:電晶體</p>  
        <p type="p">110:鰭片結構</p>  
        <p type="p">115:閘極結構，金屬閘極結構</p>  
        <p type="p">115a:介面介電層</p>  
        <p type="p">115b:閘極介電層</p>  
        <p type="p">115c:閘極電極</p>  
        <p type="p">120:奈米片層，第二NS層，NS層</p>  
        <p type="p">125:S/D磊晶結構</p>  
        <p type="p">130:內間隔件結構</p>  
        <p type="p">135:閘極間隔件</p>  
        <p type="p">138:淺溝槽隔離區，STI區</p>  
        <p type="p">152,154,156:介電層</p>  
        <p type="p">163:S/D接點</p>  
        <p type="p">165:層間介電層，ILD層</p>  
        <p type="p">167:閘極接觸通孔</p>  
        <p type="p">B-B:線</p>  
        <p type="p">Lc:長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="762" publication-number="202614361"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614361.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614361</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102670</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>剝離裝置及剝離方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250703B">H01L21/78</main-classification>  
        <further-classification edition="200601120250703B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森愛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, AI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘆立浩明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASHIDATE, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小野良治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO, YOSHIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高木淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAGI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村昂平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南智彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINAMI, TOMOHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施方式提供一種剝離裝置及剝離方法，其能夠相對於進展方向對稱地進行剝離。&lt;br/&gt;實施方式的剝離裝置，係將第一基板和第二基板接合而成的貼合基板剝離為前述第一基板和前述第二基板的剝離裝置，第一吸盤，其保持前述貼合基板中的前述第一基板；第二吸盤，其保持前述貼合基板中的前述第二基板，並且沿著遠離前述第一基板的基板表面的第一方向來移動前述第二基板；調整機構，其能夠調整前述第二吸盤的傾斜度，前述傾斜度是與對於前述第二吸盤的前述第二基板的保持面上設定的設定線正交的方向上的傾斜度；及控制部，其控制前述調整機構使得前述剝離的進行相對於前述設定線成為對稱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">T:貼合基板</p>  
        <p type="p">W1:第一基板(下晶圓)</p>  
        <p type="p">W2:第二基板(上晶圓)</p>  
        <p type="p">W1j,W2j:接合面</p>  
        <p type="p">W1n,W2n:非接合面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="763" publication-number="202614059"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614059.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614059</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102816</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置、記憶體系統及資訊處理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G11C16/06</main-classification>  
        <further-classification edition="201601120250801B">G06F12/0866</further-classification>  
        <further-classification edition="200601120250801B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮原大三朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAHARA, DAIZABURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠提高動作可靠性之半導體裝置、記憶體系統及資訊處理系統。 &lt;br/&gt;一實施方式之記憶體系統具備第1半導體裝置及控制器。第1半導體裝置包含具有第1溫度感測器之第1晶片。控制器包含：比較電路，其進行由第1溫度感測器測量之第1測量溫度與第1溫度資料之比較，且輸出第1比較結果，並進行第1測量溫度與第2溫度資料之比較，且輸出第2比較結果；及檢測電路，其基於第1及第2比較結果進行第1測量溫度資料有無異常之檢測，且輸出第1檢測結果。第1晶片基於第1檢測結果而決定使用之溫度資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:記憶體系統</p>  
        <p type="p">30:半導體裝置</p>  
        <p type="p">50:記憶體控制器</p>  
        <p type="p">51:主機介面(I/F)電路</p>  
        <p type="p">52:CPU</p>  
        <p type="p">53:ROM</p>  
        <p type="p">54:RAM</p>  
        <p type="p">55:溫度感測器</p>  
        <p type="p">56:比較電路</p>  
        <p type="p">57:檢測電路</p>  
        <p type="p">61:產生電路</p>  
        <p type="p">62:記憶體介面(I/F)電路</p>  
        <p type="p">CP0~CPN:NAND晶片</p>  
        <p type="p">HB:主機匯流排</p>  
        <p type="p">MB:記憶體匯流排</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="764" publication-number="202614767"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614767.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614767</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102907</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250709B">H10B41/40</main-classification>  
        <further-classification edition="202301120250709B">H10B41/41</further-classification>  
        <further-classification edition="202301120250709B">H10B43/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福田夏樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA, NATSUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井口直</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGUCHI, TADASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施方式提供一種容易實現高積體化的半導體記憶裝置。實施方式的半導體記憶裝置包括：多個導電層，沿積層方向積層；半導體柱，沿積層方向延伸且與多個導電層相向；電荷蓄積膜，設置於多個導電層與半導體柱之間；位元線，相對於多個導電層而設置於積層方向上的其中一側，且與半導體柱連接；以及接觸電極，沿積層方向延伸且與多個導電層中的一個的位元線側的面連接，半導體柱包括沿積層方向排列的多個第一部分，相較於多個第一部分的積層方向上與位元線相反之側的端部的寬度，積層方向上的位元線側的端部的寬度大，接觸電極包括沿積層方向排列的多個第二部分，相較於多個第二部分的積層方向上與位元線相反之側的端部的寬度，積層方向上的位元線側的端部的寬度大，接觸電極中所包括的多個第二部分的數量多於半導體柱中所包括的多個第一部分的數量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">103、105、107:絕緣層</p>  
        <p type="p">110(0)、110(1)、110(2)、110(3)、110(4)、110(5)、110(6)、110(7)、110(8)、110(9)、110(10)、110(11):導電層</p>  
        <p type="p">112:半導體層</p>  
        <p type="p">1031:間隔氧化膜</p>  
        <p type="p">1032:阻擋氧化膜</p>  
        <p type="p">CC(8)、CC(10):接觸電極</p>  
        <p type="p">CC&lt;sub&gt;P&lt;/sub&gt;、HR&lt;sub&gt;P&lt;/sub&gt;:部分</p>  
        <p type="p">Ch、Vy:接觸電極</p>  
        <p type="p">HR:支撐絕緣構件</p>  
        <p type="p">HT&lt;sub&gt;11&lt;/sub&gt;、HT&lt;sub&gt;12&lt;/sub&gt;、HT&lt;sub&gt;21&lt;/sub&gt;、HT&lt;sub&gt;22&lt;/sub&gt;:分割構造</p>  
        <p type="p">MT&lt;sub&gt;1&lt;/sub&gt;、MT&lt;sub&gt;2&lt;/sub&gt;:階層構造</p>  
        <p type="p">X、Y、Z:方向</p>  
        <p type="p">Z&lt;sub&gt;1&lt;/sub&gt;、Z&lt;sub&gt;2&lt;/sub&gt;、Z&lt;sub&gt;3&lt;/sub&gt;、Z&lt;sub&gt;4&lt;/sub&gt;:高度位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="765" publication-number="202614743"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614743.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614743</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114102983</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁瑀軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YU HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種半導體結構。此半導體結構包括基板、位元線結構、晶種層、第一間隔物、第二間隔物、第三間隔物和氣隙。基板具有一凹槽，其中凹槽具有尖角。位元線結構位於基板上，其中凹槽圍繞位元線結構。晶種層位於位元線結構的側壁上。第一間隔物位於晶種層的側壁上以及凹槽的底表面上。第二間隔物填充凹槽。第三間隔物位於基板上且鄰近第一間隔物。氣隙位於第一間隔物與第三間隔物之間。其中氣隙的底部露出第二間隔物的部分頂表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure is provided. The semiconductor structure includes a substrate, a bit line structure, a seed layer, a first spacer, a second spacer, a third spacer, and an air gap. The substrate has a recess, wherein the recess has a sharp corner. The bit line structure is on the substrate, wherein the recess surrounds the bit line structure. The seed layer is located on a sidewall of the bit line structure. The first spacer is located on a sidewall of the seed layer and on a bottom surface of the recess. The second spacer is filled in the recess. The third spacer is located on the substrate and adjacent to the first spacer. The air gap is between the first spacer and the third spacer; wherein a bottom of the air gap exposes a portion of a top surface of the second spacer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體結構</p>  
        <p type="p">110:基板</p>  
        <p type="p">120:位元線結構</p>  
        <p type="p">120T:頂表面</p>  
        <p type="p">122:第一導電層</p>  
        <p type="p">124:第二導電層</p>  
        <p type="p">126:第一硬遮罩層</p>  
        <p type="p">128:第二硬遮罩層</p>  
        <p type="p">130:晶種層</p>  
        <p type="p">140:第一間隔物</p>  
        <p type="p">150:第二間隔物</p>  
        <p type="p">162:氣隙</p>  
        <p type="p">170:第三間隔物</p>  
        <p type="p">180:多晶矽層</p>  
        <p type="p">182:鎢層</p>  
        <p type="p">182L:著陸墊</p>  
        <p type="p">184:隔離層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="766" publication-number="202614155"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614155.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614155</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103049</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>原位無環二胺碳烯(ADC)沉積</chinese-title>  
        <english-title>IN SITU ACYCLIC DIAMINO CARBENE (ADC) DEPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡國立大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY OF SINGAPORE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　偉俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, WEI CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊翁奇尼　安德烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEONCINI, ANDREA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　漢永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUYNH, HAN VINH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>摩塔美瑞羅迪艾古爾　莎拉拉奎爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTA MERELO DE AGUIAR, SARA RAQUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了在半導體基板的金屬表面上選擇性地沉積鈍化層的方法。該等例示性方法可以包括將具有金屬表面及非金屬表面的該半導體基板暴露於第一前驅物，以在該金屬表面上形成該鈍化層的第一部分，該第一前驅物包括異腈。該等例示性方法可以進一步包括將包含金屬表面及非金屬表面的該半導體基板暴露於第二前驅物，以在該金屬表面上形成該鈍化層。該第二前驅物可以包括胺類、醇類，或硫醇類。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods of selectively depositing a passivation layer on a metal surface of a semiconductor substrate are described. Exemplary methods may include exposing the semiconductor substrate having a metal surface and a non-metal surface to a first precursor to form a first portion of the passivation layer on the metal surface, the first precursor including an isonitrile. The exemplary methods may further include exposing the semiconductor substrate comprising a metal surface and a non-metal surface to a second precursor to form the passivation layer on the metal surface. The second precursor may include an amine, an alcohol, or a thiol.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體基板</p>  
        <p type="p">101:半導體基板表面</p>  
        <p type="p">102:非金屬表面</p>  
        <p type="p">104:金屬表面</p>  
        <p type="p">106:第一前驅物</p>  
        <p type="p">108:結合的第一前驅物</p>  
        <p type="p">110:第二前驅物</p>  
        <p type="p">112:錯合物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="767" publication-number="202613819"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613819.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613819</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103101</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統及控制器所進行之控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">G06F12/02</main-classification>  
        <further-classification edition="200601120250701B">G11C16/02</further-classification>  
        <further-classification edition="201801120250701B">G06F9/44</further-classification>  
        <further-classification edition="201601120250701B">G06F12/0866</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>島田克行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMADA, KATSUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>酒井康輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種性能為高之記憶體系統以及控制器所進行之控制方法。&lt;br/&gt;記憶體系統，係具備有複數之記憶體胞、和控制器。控制器，係藉由使用參照讀取電壓來進行針對複數之記憶體胞之讀取，來取得與複數之記憶體胞之臨限值電壓之分布相對應之資料組。控制器，係基於資料組，來選擇取得用以對於被儲存在複數之記憶體胞中之資料作讀取的實際讀取電壓之複數之取得動作之中之1個的取得動作。複數之取得動作，係包含有使用身為已完成訓練之機械學習模型之第1模型來從資料組而取得實際讀取電壓之第1取得動作、和與第1取得動作相異之第2取得動作。控制器，係使用所被選擇了的取得動作來取得實際讀取電壓，並使用所取得了的實際讀取電壓來實行針對複數之記憶體胞之讀取。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="768" publication-number="202612796"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612796.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612796</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103139</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>廢棄物揀選系統</chinese-title>  
        <english-title>SCRAP SORTING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B07C5/342</main-classification>  
        <further-classification edition="200601120251231B">B07C5/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商休倫谷鋼鐵公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HURON VALLEY STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭　凱瑞　Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANG, KERRY FRANCIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧布丘　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUBUCHON, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>托雷克　保羅　Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOREK, PAUL VOLKENING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕蒂爾　艾西瓦莉　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIL, AISHWARY SHARAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮特曼　華特　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PITTMAN, WALTER TIMOTHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃蘭斯基　理查</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOLANSKI, RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於揀選廢棄物材料顆粒之系統及方法。該系統具有：一輸送機總成，其具有經由至少一間隙隔開的第一及第二輸送機部分；一雷射系統，其提供一雷射光束與一感測器，該感測器經定位成可偵測位於在該間隙中之目標位置內之一顆粒所發射出的光線。使用表明該顆粒所發射出之光線之一或多個選定頻率波段的光譜資料，至少一控制器經組配為可將該顆粒分類為一材料分類以響應該雷射光束與該顆粒相互作用。一種系統可設有一分離機總成，其具有鄰接該輸送機之一第一側面的至少一分離機裝置，與經定位成可從該分離機裝置橫跨該輸送機的一相關聯的貯存倉。也可提供一種具有由殼體界定之噴嘴區的光學窗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and method for sorting scrap material particles is provided. The system has a conveyor assembly with first and second conveyor portions spaced apart via at least one gap, a laser system providing a laser beam and a sensor positioned to detect light emitted from a particle within the target location in the gap. At least one controller is configured to classify the particle into a classification of material using spectral data indicative of one or more selected frequency bands of light emitted from the particle in response to the laser beam interacting with the particle. A system may be provided with a separator assembly having at least one separator device adjacent to a first side of the conveyor, and an associated bin positioned transversely across the conveyor from the separator device. An optical window with a nozzle region defined by a housing may also be provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">102:輸送機總成</p>  
        <p type="p">104:第一末端</p>  
        <p type="p">106:第二末端</p>  
        <p type="p">110:控制器</p>  
        <p type="p">120:第一輸送機部分</p>  
        <p type="p">122:第二輸送機部分</p>  
        <p type="p">124:間隙</p>  
        <p type="p">130:進料器輸送機</p>  
        <p type="p">130a:上游端區域</p>  
        <p type="p">130b:下游端區域</p>  
        <p type="p">130c:中間區域</p>  
        <p type="p">132,134:導件</p>  
        <p type="p">140:雷射光譜系統</p>  
        <p type="p">150:感測器</p>  
        <p type="p">160:其他光學組件</p>  
        <p type="p">180:(光學)圍封件</p>  
        <p type="p">220:附加屏蔽體</p>  
        <p type="p">240:分離機總成</p>  
        <p type="p">242:分離機裝置</p>  
        <p type="p">246:附加貯存倉</p>  
        <p type="p">248:貯存倉屏蔽體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="769" publication-number="202614107"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614107.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614107</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103148</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>背光模組以及發光鍵盤</chinese-title>  
        <english-title>BACKLIGHT MODULE AND LIGHTING KEYBOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250314B">H01H13/704</main-classification>  
        <further-classification edition="200601120250314B">H01H13/83</further-classification>  
        <further-classification edition="200601120250314B">G06F3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達方電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DARFON ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘奕睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, YI-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何信政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, HSIN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">發光鍵盤包含一特定功能按鍵。用於發光鍵盤的背光模組包括一燈板、一導光板以及一遮光板。燈板具有一第一發光單元和一第二發光單元。導光板具有一第一導光孔和一第二導光孔。第一發光單元位於第一導光孔中。第二發光單元位於第二導光孔中。遮光板、導光板和燈板由上而下堆疊。遮光板具有一遮罩部分。遮罩部分與第一發光單元及第二發光單元投影重疊。導光板具有一導光板溝槽。導光板溝槽與遮罩部分和特定功能按鍵的鍵帽投影區之邊界投影重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A lighting keyboard comprises a specific function key. A backlight module for the lighting keyboard comprises a lighting board, a light guide panel and a shielding sheet. The lighting board has a first light-emitting unit and a second light-emitting unit. The light guide panel has a first light guide hole and a second light guide hole. The first light-emitting unit is located in the first light guide hole. The second light guide hole is located in the second light guide hole. The shielding sheet, the light guide panel and the lighting board are stacked from top to bottom. The shielding sheet has a shielding portion. The shielding portion is projectively overlapped with the first light-emitting unit and the second light-emitting unit. The light guide panel has a light guide panel slot. The light guide panel slot is projectively overlapped with the shielding portion and a boundary of a keycap projection area of the specific function key.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">LKB:發光鍵盤</p>  
        <p type="p">KS-1:特定功能按鍵</p>  
        <p type="p">S1,S2,S3,S4:側邊</p>  
        <p type="p">BLM:背光模組</p>  
        <p type="p">SS:遮光板</p>  
        <p type="p">MP:遮罩部分</p>  
        <p type="p">MP-1:外框部</p>  
        <p type="p">MP-2:內塊部</p>  
        <p type="p">TP:透光部分</p>  
        <p type="p">LGP:導光板</p>  
        <p type="p">L0-1:第一導光孔</p>  
        <p type="p">L0-2:第二導光孔</p>  
        <p type="p">LS:導光板溝槽</p>  
        <p type="p">REF:反射層</p>  
        <p type="p">RH-1:第一反射層孔</p>  
        <p type="p">RH-2:第二反射層孔</p>  
        <p type="p">RA:貼合部分</p>  
        <p type="p">LCB:燈板</p>  
        <p type="p">LED-1:第一發光單元</p>  
        <p type="p">LED-2:第二發光單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="770" publication-number="202614060"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614060.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614060</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103269</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250909B">G11C16/06</main-classification>  
        <further-classification edition="200601120250909B">G11C16/02</further-classification>  
        <further-classification edition="202301120250909B">H10B43/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>椎野泰洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIINO, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有良好的資料保持特性、可靠性的半導體記憶裝置。半導體記憶裝置包括包含第一子記憶體區塊及第二子記憶體區塊的記憶體區塊、位元線及源極線、控制電路。第一子記憶體區塊及第二子記憶體區塊分別包括第一記憶體單元及第二記憶體單元、以及第一字元線及第二字元線。控制電路在記憶體區塊的擦除動作中，執行對第二記憶體單元的寫入狀態進行判定的第一判定動作、在第二記憶體單元為寫入狀態的情況下進行的第一擦除動作、以及在第二記憶體單元為擦除狀態的情況下進行的第二擦除動作。在第一擦除動作中，對位元線及源極線施加擦除電壓，對第一字元線及第二字元線施加較擦除電壓低的選擇擦除電壓。在第二擦除動作中，對位元線及源極線施加擦除電壓，對第一字元線施加選擇擦除電壓，對第二字元線施加較擦除電壓低且較選擇擦除電壓高的非選擇擦除電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S121、S122、S123:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="771" publication-number="202614755"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614755.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614755</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103393</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250620B">H10B41/20</main-classification>  
        <further-classification edition="202301120250620B">H10B41/30</further-classification>  
        <further-classification edition="202301120250620B">H10B41/35</further-classification>  
        <further-classification edition="202301120250620B">H10B43/20</further-classification>  
        <further-classification edition="202301120250620B">H10B43/30</further-classification>  
        <further-classification edition="202301120250620B">H10B43/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>出口将士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEGUCHI, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施形態，係提供一種能夠適當地構成階梯構造之半導體記憶裝置。&lt;br/&gt;若依據其中一個實施形態，則係提供一種具有層積體和第1絕緣膜以及1以上之第2絕緣膜之半導體記憶裝置。層積體，係使複數之導電層隔著絕緣層而被作層積。層積體，係於在平面觀察時之長邊方向之中央附近處而包含有階梯構造。第1絕緣膜，係在階梯構造中之台地部處而於層積方向上在層積體處延伸。1以上之第2絕緣膜，係被配置在當平面觀察時為於內側包含有階梯構造中之階差部的區域中。1以上之第2絕緣膜，係於層積方向上而在層積體處延伸。1以上之第2絕緣膜，係平面寬幅為較第1絕緣膜而更大、或者是配置密度為較第1絕緣膜而更高。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:柱狀體</p>  
        <p type="p">BR:架橋構造</p>  
        <p type="p">CL1~CL4:峭壁部分</p>  
        <p type="p">CC_0~CC_S:接觸插塞</p>  
        <p type="p">HR1_1~HR1_5,HR2_1,HR2_2:絕緣膜</p>  
        <p type="p">MAR1,MAR2:記憶體胞陣列區域</p>  
        <p type="p">MBR1,MBR2:多段邊界區域</p>  
        <p type="p">SBS:階梯構造</p>  
        <p type="p">ST_1~ST_3:細縫</p>  
        <p type="p">STP1~STP4:階差部分</p>  
        <p type="p">SST_1,SST_2:層積體</p>  
        <p type="p">STR:階梯區域</p>  
        <p type="p">TER1~TER5:台地部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="772" publication-number="202612815"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612815.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612815</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103406</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>管狀工件去毛刺工具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B23B5/16</main-classification>  
        <further-classification edition="200601120251231B">B23B51/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商雷恩斯坦格工具公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RENNSTEIG WERKZEUGE GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍蘭　默里茨　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLLAND-MORITZ, GEORG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏斯海特　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEISHEIT, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種針對管狀工件(2)的去毛刺工具(1)，包含兩個或兩個以上的刀具部件(10)，其係建構成對工件(2)進行去毛刺。為了進一步改進所述類型的去毛刺工具，提出：刀具部件(10)中之一個、兩個或數個係以能夠為了實現調節而運動的方式容置在去毛刺工具(1)中，以便根據管狀工件(2)的不同直徑調整刀具部件(10)，其中，能夠藉由同一刀具部件(10)或相同的幾個刀具部件(10)對不同直徑的工件(2)進行去毛刺。本發明亦有關於一種用於切割管狀工件(2)的切割工具(4)，包含用於對此種工件(2)進行去毛刺的去毛刺工具(1)，其中，去毛刺工具(1)係固定地與切割工具(4)連接，其中，去毛刺工具(1)進一步地具有兩個或兩個以上的刀具部件(10)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:去毛刺工具</p>  
        <p type="p">2:工件</p>  
        <p type="p">3:切割邊</p>  
        <p type="p">5:工具底部</p>  
        <p type="p">6:殼體部件</p>  
        <p type="p">7:驅動部件</p>  
        <p type="p">8:手柄</p>  
        <p type="p">10:刀具部件</p>  
        <p type="p">28:殼體壁</p>  
        <p type="p">30:螺釘</p>  
        <p type="p">33:開縫凹槽</p>  
        <p type="p">34,35:壁段</p>  
        <p type="p">38:緣邊</p>  
        <p type="p">39:底部周壁</p>  
        <p type="p">40:移行路徑</p>  
        <p type="p">41:凸起</p>  
        <p type="p">42:遮蓋區域</p>  
        <p type="p">43:手指凹槽</p>  
        <p type="p">d:旋轉方向</p>  
        <p type="p">x:中軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="773" publication-number="202613395"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613395.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613395</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103510</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有具備不同電池化學物之可交換電池組的電子鎖</chinese-title>  
        <english-title>ELECTRONIC LOCK WITH INTERCHANGEABLE BATTERY PACKS HAVING DIFFERENT BATTERY CHEMISTRIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">E05B47/00</main-classification>  
        <further-classification edition="200601120251229B">H02P27/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商亞薩亞布羅美國地區股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASSA ABLOY AMERICAS RESIDENTIAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕斯瑪　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PASMA, KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科爾曼　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLEMAN, KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯立吉　柯瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COOLIDGE, COREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上田　亞南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UYEDA, ALAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種電子鎖。該電子鎖可與具有不同化學物之電池組相容。在一實例中，該電子鎖可與鹼性電池組及鋰電池組兩者相容。在一些實施例中，該電子鎖之操作係基於電池組之化學物。可基於該電池組之該化學物之該電子鎖之操作之實例包含用於使一插銷在一延伸位置與一縮回位置之間移動之一馬達之操作、低電力模式操作及用於判定該電池組之一剩餘電量之程序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic lock is disclosed. The electronic lock may be compatible with battery packs having different chemistries. In an example, the electronic lock may be compatible with both alkaline battery packs and lithium battery packs. In some embodiments, operation of the electronic lock is based on the chemistry of the battery pack. Examples of operations of the electronic lock that may be based on the chemistry of the battery pack include operation of a motor for moving a bolt between an extended position and a retracted position, low-power mode operations, and processes for determining a remaining power of the battery pack.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:門</p>  
        <p type="p">100:電子鎖</p>  
        <p type="p">104:內側</p>  
        <p type="p">106:外側</p>  
        <p type="p">108:內部總成</p>  
        <p type="p">112:閂鎖總成</p>  
        <p type="p">113:接腳</p>  
        <p type="p">114:插銷</p>  
        <p type="p">115:閂鎖</p>  
        <p type="p">116:處理單元</p>  
        <p type="p">117:按鈕</p>  
        <p type="p">118:手動轉動件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="774" publication-number="202614390"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614390.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614390</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103693</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250911B">H01L23/31</main-classification>  
        <further-classification edition="200601120250911B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赤間圭一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKAMA, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明抑制金屬凸塊的裂紋。實施形態的半導體裝置包括：安裝基板；封裝基板，在與安裝基板的主表面交叉的第一方向側與主表面相向地設置；金屬凸塊，設置於安裝基板的主表面與封裝基板之間；第一填底膠，自金屬凸塊觀察時設置於沿著主表面的第二方向側；以及第二填底膠，設置於金屬凸塊與第一填底膠之間，第一填底膠與第二填底膠具有不同的玻璃轉移點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體裝置</p>  
        <p type="p">10:安裝基板</p>  
        <p type="p">10a:上表面</p>  
        <p type="p">11、212:絕緣層</p>  
        <p type="p">12、211:導電層</p>  
        <p type="p">13、23:電極</p>  
        <p type="p">20:半導體封裝</p>  
        <p type="p">21:樹脂基板</p>  
        <p type="p">21a:下表面</p>  
        <p type="p">22:半導體晶片</p>  
        <p type="p">24:模製樹脂</p>  
        <p type="p">30:金屬凸塊</p>  
        <p type="p">30a:側面</p>  
        <p type="p">100、200:填底膠</p>  
        <p type="p">210:第一部</p>  
        <p type="p">220:第二部</p>  
        <p type="p">230:第三部</p>  
        <p type="p">Dx、Dy:距離</p>  
        <p type="p">O:中心點</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="775" publication-number="202614425"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614425.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614425</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103695</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250616B">H01L23/522</main-classification>  
        <further-classification edition="202301120250616B">H10B41/27</further-classification>  
        <further-classification edition="202301120250616B">H10B43/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上奉紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>窪田吉孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, YOSHITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可較佳地製造的半導體記憶裝置。半導體記憶裝置包括經由多個貼合電極而貼合的第一晶片及第二晶片，第一晶片及第二晶片包括以包圍記憶體區域的周圍的方式而設的封邊區域（R &lt;sub&gt;ES&lt;/sub&gt;），第二晶片包括在封邊區域（R &lt;sub&gt;ES&lt;/sub&gt;）中以包圍記憶體區域的周圍的方式而設且隔開地排列的多個封邊、第一配線層及第二配線層，第一配線層包括多個第二導電層，所述多個第二導電層設在自第一方向觀察與多個封邊中的自第一方向觀察除了最外周以外的多個第一封邊重合的位置，且與多個第一封邊電性連接，且包括所述第三導電層，所述第三導電層設在自第一方向觀察與多個封邊中的最外周的第二封邊重合的位置，不與第二封邊電性連接，並與第二封邊隔開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100、110:導電層</p>  
        <p type="p">101、102、111、113、200G:絕緣層</p>  
        <p type="p">200:半導體基板</p>  
        <p type="p">200I:絕緣區域</p>  
        <p type="p">200N:N型阱區域</p>  
        <p type="p">200P:P型阱區域</p>  
        <p type="p">200S:半導體基板區域</p>  
        <p type="p">CS:通孔接觸電極</p>  
        <p type="p">CH、D0、D1、D2、D3、D4、DB、M0、M1、MB:配線層</p>  
        <p type="p">ch、d0、d1、d2、d3、d4、m0、m1、ma、V1、VB、Vy:配線</p>  
        <p type="p">C&lt;sub&gt;M&lt;/sub&gt;、C&lt;sub&gt;P&lt;/sub&gt;:晶片</p>  
        <p type="p">ES1~ES3、ES5、ES6:封邊</p>  
        <p type="p">GC:電極層</p>  
        <p type="p">gc:電極</p>  
        <p type="p">L&lt;sub&gt;MCA1&lt;/sub&gt;、L&lt;sub&gt;MCA2&lt;/sub&gt;:記憶胞元陣列層</p>  
        <p type="p">L&lt;sub&gt;SB&lt;/sub&gt;:基體結構</p>  
        <p type="p">MA:背面配線層</p>  
        <p type="p">P&lt;sub&gt;I1&lt;/sub&gt;、P&lt;sub&gt;I2&lt;/sub&gt;:貼合電極</p>  
        <p type="p">R&lt;sub&gt;ES&lt;/sub&gt;:封邊區域</p>  
        <p type="p">R&lt;sub&gt;K&lt;/sub&gt;:切口區域</p>  
        <p type="p">VZ:區域</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="776" publication-number="202612838"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612838.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612838</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103879</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於與焊料合金結合的離散碳奈米管</chinese-title>  
        <english-title>DISCRETE CARBON NANOTUBES FOR SOLDER ALLOY INTEGRATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">B23K35/34</main-classification>  
        <further-classification edition="201101120251230B">B82Y30/00</further-classification>  
        <further-classification edition="202301120251230B">C22C1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伊萊奈米公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELECT NANO, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛德爾　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOWDER, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯威尼　布蘭登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SWEENEY, BRANDON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈麥茲　亞倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOMEZ, AARON MORELOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威廉斯　布倫特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLIAMS, BRENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿奇　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACHEE, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">源自碳奈米管的併入而具有增強性質的焊料合金利用均勻地分布在整個焊料合金基質中被解束、分散以及功能化碳奈米管以產生可接受的金屬基質奈米複合焊料合金。透過內嵌功能化流程可達成在焊料合金中碳奈米管的中性浮力。這種流程涉及以緻密金屬，如：低成本高密度的鉍，以及類似鐵磁及超順磁金屬及合金的功能性填料，或類似銅及銀之導熱材料來填充碳奈米管，其可致使較低密度碳外殼的補償(offset)，從而允許碳奈米管保持懸浮在焊料合金中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Solder alloys with enhanced properties derived from incorporation of CNTs make use of debundled, dispersed, and functionalized carbon nanotubes uniformly distributed throughout the solder alloy matrix to yield an acceptable metal-matrix nanocomposite solder alloy. Neutral buoyancy of CNTs within solder alloys may be achieved by the endohedral functionalization process. This process involves filling the CNTs with dense metals, such as low-cost, high-density bismuth, as well as functional fillers like ferromagnetic and superparamagnetic metals and alloys, or thermally conductive materials like copper and silver, which may result in an offset of the lower density carbon shell, allowing the CNTs to remain suspended in solder alloys.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="777" publication-number="202612898"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612898.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612898</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103907</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輪胎密封劑注射器</chinese-title>  
        <english-title>TIRE SEALANT INJECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B29C73/16</main-classification>  
        <further-classification edition="200601120251231B">B60C5/12</further-classification>  
        <further-classification edition="200601120251231B">B60C25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商史丹效能產品有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAN'S PERFORMANCE PRODUCTS, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比塞特　德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BISSETT, DEREK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢娜　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANNA, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">液態輪胎密封劑係骯髒的且難以使用習知可再裝填注射器及變動閥桿(氣門嘴)大小及式樣來施用。本文所揭示之可再裝填輪胎密封劑注射器併入易起動柱塞及/或能夠與Schrader、Presta、Dunlop或訂製閥桿之一或多者干涉配合之夾頭。一錐形入口套筒允許一柱塞以一最少髒亂插入。與習知設計相比，干涉配合夾頭可搭配至少Schrader及Presta閥桿使用而無需重新構形，且最小化髒亂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Liquid tire sealants are messy and difficult to apply using conventional re-loadable injectors and varied valve stem sizes and styles. The reloadable tire sealant injectors disclosed herein incorporate easy start plungers and/or chucks capable of interference fit with one or more of Schrader, Presta, Dunlop, or custom valve stems. A tapered-entry barrel permits a plunger to be inserted with a minimum of mess. Interference fit chucks are used with at least Schrader and Presta valve stems without re-configuration, and minimize mess, as compared to conventional designs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:可重新裝填之輪胎密封劑注射器</p>  
        <p type="p">101:手柄端</p>  
        <p type="p">102:柱塞</p>  
        <p type="p">104:夾頭</p>  
        <p type="p">105:整合具紋理手柄</p>  
        <p type="p">106:錐形入口套筒</p>  
        <p type="p">108:排出口</p>  
        <p type="p">109:開口輸入端</p>  
        <p type="p">110:排出端</p>  
        <p type="p">112:輸出軟管</p>  
        <p type="p">114:箭頭</p>  
        <p type="p">116:洩出口</p>  
        <p type="p">124:灌注段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="778" publication-number="202614068"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614068.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614068</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103949</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250703B">G11C16/10</main-classification>  
        <further-classification edition="200601120250703B">G11C11/4074</further-classification>  
        <further-classification edition="200601120250703B">G11C16/30</further-classification>  
        <further-classification edition="200601120250703B">G11C11/4093</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒沢智紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROSAWA, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部光弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, MITSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川武志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供可抑制消耗電力的半導體記憶裝置。&lt;br/&gt;半導體記憶裝置(2)，具備：輸出入用墊群(32)；包含複數個記憶體單元之記憶體單元陣列(21)；以及設於輸出入用墊群(32)與記憶體單元陣列(21)之間的輸出入電路(22)。輸出入電路(22)，具備：複數個電晶體(QH1、QL1)；以及基板偏壓電壓供應電路(40、41)，其作為複數個電晶體(QH1、QL1)的基板偏壓電壓，可將和輸出入電路的電源電壓相同的值的第1電壓與和第1電壓不同的值的第2電壓進行切換而供應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:基板偏壓電壓供應電路</p>  
        <p type="p">A1,A2,A3:臂</p>  
        <p type="p">B1:第1偏壓佈線</p>  
        <p type="p">B2:第2偏壓佈線</p>  
        <p type="p">In:資料輸入端子</p>  
        <p type="p">Out:資料輸出端子</p>  
        <p type="p">QH1,QH2,QH3:高側電晶體(P通道型MOSFET)</p>  
        <p type="p">QL1,QL2,QL3:低側電晶體(N通道型MOSFET)</p>  
        <p type="p">SIG:資料</p>  
        <p type="p">SL1:資料傳輸線路</p>  
        <p type="p">SW1:第1開關</p>  
        <p type="p">SW2:第2開關</p>  
        <p type="p">Vbn:第2基板偏壓電壓</p>  
        <p type="p">Vbp:第1基板偏壓電壓</p>  
        <p type="p">VccQ:第2電源電壓</p>  
        <p type="p">Vne:負電源電壓</p>  
        <p type="p">Vreg:調整電壓</p>  
        <p type="p">Vss:接地電壓(第3電源電壓)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="779" publication-number="202612853"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612853.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612853</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114103965</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁性加工刀頭固持器</chinese-title>  
        <english-title>MAGNETIC BIT HOLDER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B25B23/12</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商史奈普昂公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SNAP-ON INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嘉比　尼古拉斯　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GABBEY, NICHOLAS A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇　喬治　Ｒ　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CALL, GEORGE R.R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德森　強納生　Ｉ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDERSEN, JONATHAN I.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種磁性加工刀頭固持器包含環繞該磁性加工刀頭固持器之一旋轉軸線之一環形磁體。一第一連接器相對於該環形磁體固定且沿著該旋轉軸線定位在該環形磁體之一第一側上。該第一連接器可操作以沿著該旋轉軸線緊固至一刀具。非鐵材料之一實心軸件延伸穿過該環形磁體。一第二連接器沿著該旋轉軸線定位在該環形磁體之一第二側上。該第二連接器可操作以固持一刀具刀頭。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A magnetic bit holder includes a ring magnet surrounding an axis of rotation of the magnetic bit holder. A first connector is fixed with respect to the ring magnet and positioned along the axis of rotation on a first side of the ring magnet. The first connector is operable to secure to a tool along the axis of rotation. A solid shaft of non-ferrous material extends through the ring magnet. A second connector is positioned along the axis of rotation on a second side of the ring magnet. The second connector is operable to hold a tool bit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:磁性加工刀頭固持器</p>  
        <p type="p">110:第一連接器</p>  
        <p type="p">120:環形磁體</p>  
        <p type="p">130:第二連接器</p>  
        <p type="p">140:實心軸件</p>  
        <p type="p">180:套管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="780" publication-number="202613012"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613012.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613012</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104043</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓運送裝置檢測系統及晶圓運送裝置</chinese-title>  
        <english-title>WAFER TRANSFER DEVICE DETECTION SYSTEM AND WAFER TRANSFER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251017B">B65G49/07</main-classification>  
        <further-classification edition="202001120251017B">G16Y40/10</further-classification>  
        <further-classification edition="202001120251017B">G16Y20/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉逸文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶圓運送裝置檢測系統包含多個偵測器、填充裝置、晶圓運送裝置及控制中心。多個偵測器分別設置製程之多個製程設備之間。填充裝置執行充填程序。晶圓運送裝置包含本體及感測器。晶圓運送裝置傳輸製程的晶圓。感測器檢測晶圓運送裝置內部的氣體濃度。若氣體濃度高於預設氣體濃度，感測器產生無線通訊訊號。控制中心耦接多個偵測器及填充裝置。若多個偵測器收到無線通訊訊號時，則多個偵測器通知控制中心，使控制中心從製程傳輸晶圓運送裝置至填充裝置。控制中心控制填充裝置執行充填程序，調整氣體濃度至目標氣體濃度，並重新傳回製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wafer transfer device detection system includes detectors, a filling device, a wafer transfer device and a control center. Detectors are disposed between a plurality of process equipment in a process. Filling device performs a filling procedure. Wafer transfer device includes body and sensor disposed in body. Wafer transfer device transmits wafer of process. Sensor detects a gas concentration inside wafer transfer device during a transportation stage of the process. If gas concentration is higher than a preset gas concentration, sensor generates a wireless communication signal. Control center is coupled to detectors and filling device. If detectors receive the wireless communication signal, detectors notify control center so that the control center transmits wafer transfer device to filling device from process. Control center controls the filling device to perform filling procedure so as to adjust gas concentration to a target gas concentration to retransmit wafer transfer device back to process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">140:晶圓運送裝置</p>  
        <p type="p">141:本體</p>  
        <p type="p">142:感測器</p>  
        <p type="p">143:連接機構</p>  
        <p type="p">CP1:蓋板</p>  
        <p type="p">CP2:蓋板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="781" publication-number="202614771"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614771.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614771</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104048</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250425B">H10B43/20</main-classification>  
        <further-classification edition="200601120250425B">G11C8/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美濃明良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINO, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠適宜地製造的半導體記憶裝置。半導體記憶裝置包括：多個導電層，沿積層方向積層；多個記憶體胞元，沿積層方向排列並與多個導電層連接；第一接觸電極，沿積層方向延伸並與多個導電層中的一個連接；以及第二接觸電極，沿積層方向延伸並與第一接觸電極的積層方向上的其中一側的端部連接。第一接觸電極包括：第一導電構件，沿積層方向延伸；絕緣柱，沿積層方向延伸且外周面由第一導電構件覆蓋；以及第二導電構件，設置於第一接觸電極的積層方向上的第二接觸電極側的端部，外周面與第一導電構件相接觸，且積層方向上的第二接觸電極側的面與第二接觸電極相接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101、102、103、108:絕緣層</p>  
        <p type="p">104:高介電常數絕緣膜</p>  
        <p type="p">110、113:導電層</p>  
        <p type="p">151、153:導電構件</p>  
        <p type="p">152:絕緣柱</p>  
        <p type="p">154、156:障壁導電膜</p>  
        <p type="p">155、157:金屬膜</p>  
        <p type="p">CC、Ch:接觸電極</p>  
        <p type="p">ox:氧化層</p>  
        <p type="p">RC:連接區域</p>  
        <p type="p">RL:引出區域</p>  
        <p type="p">RTH:貫通區域</p>  
        <p type="p">T:平台部</p>  
        <p type="p">WRC152、WRC154、WRC155、WRL152、WRL154、WRL155、WRTH152、WRTH154、WRTH155:寬度</p>  
        <p type="p">X、Y、Z:方向</p>  
        <p type="p">Z110O、Z110T:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="782" publication-number="202614043"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614043.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614043</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104173</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250616B">G11C7/24</main-classification>  
        <further-classification edition="200601120250616B">G11C8/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仲田裕貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松尾浩司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUO, KOUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施方式提供一種構成要素之長度得到抑制之記憶裝置。&lt;br/&gt;一實施方式之記憶裝置包含第1半導體、第1柱、第1導電體、第1電晶體及第2導電體。第1半導體於第1方向上延伸。第1柱於與第1方向相交之第2方向上延伸，且與第1半導體相接。第1導電體與第1柱之第2方向側之端部連接，且於與第1方向及第2方向相交之第3方向上延伸。第1電晶體設置於較第1導電體更靠第2方向之位置，且與第1導電體連接。第2導電體設置於較第1導電體更靠第2方向之位置，於第3方向上延伸，且與第1電晶體連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">44_1:導電體</p>  
        <p type="p">44_2:導電體</p>  
        <p type="p">61_1:半導體</p>  
        <p type="p">61_2:半導體</p>  
        <p type="p">62_1:源極/汲極區域</p>  
        <p type="p">62_2:源極/汲極區域</p>  
        <p type="p">63_1:源極/汲極區域</p>  
        <p type="p">63_2:源極/汲極區域</p>  
        <p type="p">64_1:連接器</p>  
        <p type="p">64_2:連接器</p>  
        <p type="p">65_1:連接器</p>  
        <p type="p">65_2:連接器</p>  
        <p type="p">67_1:導電體</p>  
        <p type="p">67_2:導電體</p>  
        <p type="p">68_1:連接器</p>  
        <p type="p">68_2:連接器</p>  
        <p type="p">CGP_1:電極柱</p>  
        <p type="p">CGP_2:電極柱</p>  
        <p type="p">D1:間隔</p>  
        <p type="p">D2:間隔</p>  
        <p type="p">D3:間隔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="783" publication-number="202614804"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614804.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614804</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104205</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES AND FORMING METHODS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250529B">H10D30/47</main-classification>  
        <further-classification edition="202501120250529B">H10D64/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴柏錩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, BO-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳晟煒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>褚立新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, LI-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江文智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, WEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露揭示半導體裝置，半導體裝置包括在閘極電極與汲極電極之間沿著一軸線的多個場板結構。一個場板結構更靠近於閘極電極，且另一場板結構更靠近於汲極電極。製造此類結構之方法使用一或多個蝕刻終止層，一或多個蝕刻終止層准許每一場板結構之深度控制以提供所要性質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor devices are disclosed that include multiple field plate structures along an axis between the gate electrode and the drain electrode. One field plate structure is closer to the gate electrode, and the other field plate structure is closer to the drain electrode. Methods of making such structures use one or more etch stop layers that permit depth control for each field plate structure to provide desired properties.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">110:基板</p>  
        <p type="p">116:隔離區</p>  
        <p type="p">118:主動區</p>  
        <p type="p">120:井</p>  
        <p type="p">122:上表面</p>  
        <p type="p">130:接面</p>  
        <p type="p">132:源極電極/S/D電極</p>  
        <p type="p">134:汲極電極/S/D電極</p>  
        <p type="p">136:閘極介電層</p>  
        <p type="p">138:閘極電極</p>  
        <p type="p">140:閘極間隔物</p>  
        <p type="p">142:通道</p>  
        <p type="p">150:第一介電層</p>  
        <p type="p">151:隆起部分</p>  
        <p type="p">159:上表面</p>  
        <p type="p">160:第一蝕刻終止區/蝕刻終止區</p>  
        <p type="p">170:第二蝕刻終止區/蝕刻終止區</p>  
        <p type="p">180:蝕刻終止層</p>  
        <p type="p">190:閘極通孔/通孔</p>  
        <p type="p">192:閘極襯墊</p>  
        <p type="p">194:源極通孔/通孔</p>  
        <p type="p">196:水平襯墊</p>  
        <p type="p">198:汲極通孔/通孔</p>  
        <p type="p">200:汲極襯墊</p>  
        <p type="p">210:第一場板結構</p>  
        <p type="p">212:第一通孔/通孔</p>  
        <p type="p">230:第二場板結構</p>  
        <p type="p">232:第二通孔/通孔</p>  
        <p type="p">240:第二襯墊</p>  
        <p type="p">250:層間介電質(ILD)層</p>  
        <p type="p">252:上表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="784" publication-number="202614744"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614744.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614744</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104272</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR MEMORY STRUCTURE AND METHOD FOR FOMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250303B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華邦電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINBOND ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田典昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, NORIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊峻昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIUN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳興豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSING-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體記憶裝置。半導體記憶裝置包含具有主動區與圍繞該主動區之隔離區的半導體基板、設置於半導體基板上的蓋層、設置於半導體基板上的複數個位元線。每個位元線都包含設置於半導體基板上的第一導電圖案、設置於第一導電圖案上的第二導電圖案、及設置於第二導電圖案上的介電圖案。第一導電圖案的側壁內縮於第二導電圖案的側壁。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor memory structure of this invention is provided, the semiconductor memory structure includes a semiconductor substrate having an active region and an isolation region surrounding the active region; a cap layer disposed on the semiconductor substrate; and a plurality of bit lines disposed on the semiconductor substrate. Each of bit lines includes a first conductive pattern disposed on the semiconductor substrate; a second conductive pattern disposed on the first conductive pattern; and a dielectric pattern disposed on the second conductive pattern. A sidewall of the first conductive pattern is retracted from a sidewall of the second conductive pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體基板</p>  
        <p type="p">100A:主動區</p>  
        <p type="p">100B:隔離區</p>  
        <p type="p">102:蓋層</p>  
        <p type="p">1021:第一層</p>  
        <p type="p">1022:第二層</p>  
        <p type="p">1023:第三層</p>  
        <p type="p">1041”、1042’、1043’、1044’、1045’、1046’:導電圖案</p>  
        <p type="p">104’:位元線</p>  
        <p type="p">108:介電襯層</p>  
        <p type="p">1081、1082、1084、1085:氮化物層</p>  
        <p type="p">1083:氧化物層</p>  
        <p type="p">110:電容接觸件</p>  
        <p type="p">1101:半導體層</p>  
        <p type="p">1102:矽化物層</p>  
        <p type="p">1103:黏合層</p>  
        <p type="p">1104:金屬插塞</p>  
        <p type="p">H:開孔</p>  
        <p type="p">CA”:位元線接觸件</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">Z:方向</p>  
        <p type="p">P:突出部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="785" publication-number="202614069"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614069.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614069</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104339</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250703B">G11C16/10</main-classification>  
        <further-classification edition="200601120250703B">G11C16/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前嶋洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEJIMA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據實施形態，半導體記憶裝置包含第1及第2陣列晶片、與電路晶片。第1記憶胞陣列包含第1記憶胞以及第1及第2選擇電晶體。第2記憶胞陣列包含第2記憶胞以及第3及第4選擇電晶體。第3記憶胞陣列包含第3記憶胞以及第5及第6選擇電晶體。第4記憶胞陣列包含第4記憶胞以及第7及第8選擇電晶體。第1字元線連接於第1及第3記憶胞。第2字元線連接於第2及第4記憶胞。第1位元線連接於第1及第7選擇電晶體。第2位元線連接於第3及第5選擇電晶體。於寫入動作中，對第1陣列晶片及第2陣列晶片設定不同之電壓施加條件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體記憶裝置</p>  
        <p type="p">10_1,10_2:陣列晶片</p>  
        <p type="p">11_1a,11_1b,11_2a,11_2b:記憶胞陣列</p>  
        <p type="p">20:電路晶片</p>  
        <p type="p">21:輸入輸出電路</p>  
        <p type="p">22:邏輯控制電路</p>  
        <p type="p">23:指令暫存器</p>  
        <p type="p">24:位址暫存器</p>  
        <p type="p">25:序列發生器</p>  
        <p type="p">26a,26b:列解碼器</p>  
        <p type="p">27a,27b:感測放大器</p>  
        <p type="p">28:資料暫存器</p>  
        <p type="p">29:行解碼器</p>  
        <p type="p">30:源極線驅動器</p>  
        <p type="p">ADD:位址</p>  
        <p type="p">ALE:位址鎖存啟動信號</p>  
        <p type="p">BLa,BLb:位元線</p>  
        <p type="p">CEn:晶片啟動信號</p>  
        <p type="p">CLE:指令鎖存啟動信號</p>  
        <p type="p">CMD:指令</p>  
        <p type="p">DAT:資料</p>  
        <p type="p">DQ:信號</p>  
        <p type="p">DQS,DQSn:時序信號</p>  
        <p type="p">REn:讀取啟動信號</p>  
        <p type="p">SBLK0_1,SBLK0_2,SBLK1_1,SBLK1_2,SBLK2_1,SBLK2_2,SBLK3_1,SBLK3_2:子區塊</p>  
        <p type="p">SGD1a,SGD1b,SGD2a,SGD2b,SGS1a,SGS1b,SGS2a,SGS2b:選擇閘極線</p>  
        <p type="p">SL1a,SL1b,SL2a,SL2b:源極線</p>  
        <p type="p">WEn:寫入啟動信號</p>  
        <p type="p">WLa,WLb:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="786" publication-number="202614275"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614275.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614275</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104643</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基體清潔設備及包括該基體清潔設備之基體處理系統</chinese-title>  
        <english-title>SUBSTRATE CLEANING APPARATUS AND SUBSTRATE TREATING SYSTEM INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/67</main-classification>  
        <further-classification edition="202401120251230B">B08B1/12</further-classification>  
        <further-classification edition="202401120251230B">B08B1/20</further-classification>  
        <further-classification edition="202401120251230B">B08B1/34</further-classification>  
        <further-classification edition="202401120251230B">B08B1/36</further-classification>  
        <further-classification edition="200601120251230B">B08B3/08</further-classification>  
        <further-classification edition="200601120251230B">B08B3/10</further-classification>  
        <further-classification edition="200601120251230B">B08B5/00</further-classification>  
        <further-classification edition="200601120251230B">B08B13/00</further-classification>  
        <further-classification edition="200601120251230B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商細美事有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白寅華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAEK, IN HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金順鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SOON HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭泓具</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, HONG GOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金榮浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNG HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李基範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KI-BEOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基體清潔設備可被提供且包括：一第一處理室，其組配來對一第一基體及一第二基體進行電漿處理；一基體清潔設備，其組配來清潔該第一基體及該第二基體；以及一第二處理室，其組配來將該第一基體與該第二基體彼此接合，其中該基體清潔設備進一步組配來使用一清潔液體及一刷來移除黏合至該第一基體及該第二基體之一異物，且其中該第二處理室進一步組配來在藉由該基體清潔設備清潔該第一基體及該第二基體之後將該第一基體與該第二基體彼此接合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate cleaning apparatus may be provided and include: a first process chamber configured to plasma-treat a first substrate and a second substrate; a substrate cleaning apparatus configured to clean the first substrate and the second substrate; and a second process chamber configured to bond the first substrate and the second substrate to each other, wherein the substrate cleaning apparatus is further configured to remove, using a cleaning liquid and a brush, a foreign substance adhered to the first substrate and the second substrate, and wherein the second process chamber is further configured to bond the first substrate and the second substrate to each other after the first substrate and the second substrate are cleaned by the substrate cleaning apparatus.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:基體清潔設備</p>  
        <p type="p">210:基體支撐件</p>  
        <p type="p">220:第一液體供應器</p>  
        <p type="p">230:第二液體供應器</p>  
        <p type="p">240:異物移除器</p>  
        <p type="p">D1:第一方向、寬度方向、水平方向</p>  
        <p type="p">D2:第二方向、寬度方向、水平方向</p>  
        <p type="p">D3:第三方向、垂直方向、方向</p>  
        <p type="p">WF:基體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="787" publication-number="202614729"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614729.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614729</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104654</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250624B">H10B10/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松澤雄矢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUZAWA, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野田光太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NODA, KOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施形態提供一種可製造品質較佳之半導體裝置的半導體裝置及半導體記憶裝置。&lt;br/&gt;實施形態之半導體裝置具備：複數個閘極電極，其等沿著與上下方向交叉之第1方向延伸，於與上下方向及第1方向交叉之第2方向上相互隔開地設置；複數個位元電極，其等於閘極電極之上方沿著第2方向延伸，於第1方向上相互隔開地設置；及複數個氧化物半導體，其等於沿著上下方向觀察時，按照閘極電極及位元電極交叉之每個區域設置，沿著上下方向延伸；且於沿著上下方向觀察時，通過區域即第1區域之閘極電極係介隔閘極絕緣膜與對應於第1區域之氧化物半導體對向，通過第1區域之位元電極係通過上部電極連接於對應於第1區域之氧化物半導體；氧化物半導體中與上下方向垂直之剖面具有橢圓形狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:半導體裝置</p>  
        <p type="p">42:導電層</p>  
        <p type="p">42b:包圍部</p>  
        <p type="p">42c:連結部</p>  
        <p type="p">43:閘極絕緣膜</p>  
        <p type="p">51:導電層</p>  
        <p type="p">70:氧化物半導體層</p>  
        <p type="p">CS1:剖面</p>  
        <p type="p">Dm1:距離</p>  
        <p type="p">IA,IA1:交叉區域</p>  
        <p type="p">LA1:長軸</p>  
        <p type="p">SA1:短軸</p>  
        <p type="p">TH:電晶體孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="788" publication-number="202614383"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614383.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614383</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104795</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置，及半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250627B">H01L23/28</main-classification>  
        <further-classification edition="200601120250627B">H01L23/488</further-classification>  
        <further-classification edition="200601120250627B">H01L23/535</further-classification>  
        <further-classification edition="200601120250627B">H01L21/56</further-classification>  
        <further-classification edition="200601120250627B">H01L21/60</further-classification>  
        <further-classification edition="200601120250627B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片岡忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAOKA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種抑制打線的干涉所造成的短路之半導體裝置，及半導體裝置的製造方法。&lt;br/&gt;實施方式的半導體裝置，具備：配線基板；第1半導體模組，配置於前述配線基板的主面，係1個以上的第1半導體晶片被層積而成；打線，將前述1個以上的第1半導體晶片當中的一者與前述配線基板連接；第2半導體模組，在前述配線基板的前述主面和前述第1半導體模組相鄰配置，係複數個第2半導體晶片被層積而成；前述第2半導體模組，在前述複數個第2半導體晶片當中的最下層數來第N個(N為1以上的整數)的第2半導體晶片與第N+1個的第2半導體晶片之間，具有接著劑層，前述打線的至少一部分，接觸前述接著劑層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:配線基板</p>  
        <p type="p">10a:上面</p>  
        <p type="p">11,12:電極</p>  
        <p type="p">16:絕緣層</p>  
        <p type="p">17:導電層</p>  
        <p type="p">20:阻銲劑</p>  
        <p type="p">21,22:開口部</p>  
        <p type="p">31,32:間隔材</p>  
        <p type="p">51:控制器</p>  
        <p type="p">53:電極</p>  
        <p type="p">100:第1半導體模組</p>  
        <p type="p">111~118,211~218:半導體晶片</p>  
        <p type="p">111a~118a:上面</p>  
        <p type="p">121~128,221~228:電極墊</p>  
        <p type="p">141~148,241~248:接著劑層</p>  
        <p type="p">200:第2半導體模組</p>  
        <p type="p">311~318(W1):打線</p>  
        <p type="p">315a:打線315的上端部</p>  
        <p type="p">321~328(W2):打線</p>  
        <p type="p">500:密封構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="789" publication-number="202613255"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613255.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613255</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104840</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及包含其之電子裝置</chinese-title>  
        <english-title>DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251230B">C09D11/03</main-classification>  
        <further-classification edition="201401120251230B">C09D11/033</further-classification>  
        <further-classification edition="202301120251230B">H10K50/155</further-classification>  
        <further-classification edition="202301120251230B">H10K50/17</further-classification>  
        <further-classification edition="202301120251230B">H10K50/18</further-classification>  
        <further-classification edition="202301120251230B">H10K59/35</further-classification>  
        <further-classification edition="202301120251230B">H10K85/30</further-classification>  
        <further-classification edition="202301120251230B">H10K85/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星顯示器有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安文貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AN, MOON JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置，包含一像素，該像素具有一第一子像素，其中，該第一子像素包含：一第一像素電極，以及位於該第一像素電極上的一第一發光元件及一第二發光元件；該第一發光元件及該第二發光元件各自包含一主體部分，以及位於該主體部分的第一表面的一接合電極；該主體部分包含一第一半導體層、一主動層、及一第二半導體層，其中，該第一發光元件及該第二發光元件中的至少一個以一定角度設置在該第一像素電極上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a pixel including a first subpixel, wherein the first subpixel includes: a first pixel electrode, and a first light emitting element and a second light emitting element on the first pixel electrode, each of the first light emitting element and the second light emitting element including a body portion and a bonding electrode at a first surface of the body portion, the body portion includes a first semiconductor layer, an active layer, and a second semiconductor layer, wherein at least one of the first light emitting element or the second light emitting element is disposed at an angle on the first pixel electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:顯示面板</p>  
        <p type="p">250:顯示驅動電路</p>  
        <p type="p">251:時序控制器</p>  
        <p type="p">252:資料驅動器</p>  
        <p type="p">500:電源供應單元</p>  
        <p type="p">611:寫入掃描訊號輸出單元</p>  
        <p type="p">612:初始化掃描訊號輸出單元</p>  
        <p type="p">613:偏壓掃描訊號輸出單元</p>  
        <p type="p">614:發射控制訊號輸出單元</p>  
        <p type="p">DA:顯示區域</p>  
        <p type="p">DATA:數位視訊資料</p>  
        <p type="p">DCS:資料時序控制訊號</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">EL:發射控制線</p>  
        <p type="p">GBL:偏壓掃描線</p>  
        <p type="p">GIL:初始化掃描線</p>  
        <p type="p">GWL:寫入掃描線</p>  
        <p type="p">NDA:非顯示區域</p>  
        <p type="p">SCS:掃描時序控制訊號</p>  
        <p type="p">SDC2:第二掃描驅動器</p>  
        <p type="p">SL:掃描線</p>  
        <p type="p">SPX:子像素</p>  
        <p type="p">VAINT:第四電源供應電壓</p>  
        <p type="p">VDD:第一電源供應電壓</p>  
        <p type="p">VINT:第三電源供應電壓</p>  
        <p type="p">VSS:第二電源供應電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="790" publication-number="202614840"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614840.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614840</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104917</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250709B">H10D64/01</main-classification>  
        <further-classification edition="202501120250709B">H10D64/20</further-classification>  
        <further-classification edition="202501120250709B">H10D64/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡汎軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, FAN HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余必裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, BI YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游明倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, MING LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪牧民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, MU-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊羚鈺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, LING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅振祖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, CHEN-TSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製造方法，包括：在設置於基板上方的犧牲閘極結構周圍形成閘極間隔層；對包括閘極間隔層的第一材料層執行處理操作，此些處理操作用以使得第一材料層在金屬閘極替換操作期間更能抵抗鍺(Ge)擴散；形成與第一材料層相鄰的第二材料層；及用金屬閘極替換犧牲閘極結構，其中第一材料層阻止Ge進入金屬閘極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A fabrication method, includes: forming a gate spacer layer around a sacrificial gate structure disposed over a substrate; performing, on a first material layer that includes the gate spacer layer, treatment operations that are configured to make the first material layer more resistant to Germanium (Ge) diffusion during metal gate replacement operations; forming a second material layer adjacent to the first material layer; and replacing the sacrificial gate structure with a metal gate, wherein the first material layer blocks Ge from entering the metal gate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1716:第一材料層</p>  
        <p type="p">1718:第二材料層</p>  
        <p type="p">1720:金屬閘極</p>  
        <p type="p">1722:鍺</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="791" publication-number="202613613"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613613.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613613</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104992</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光纖及光連接組件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">G02B6/032</main-classification>  
        <further-classification edition="200601120251217B">G02B6/40</further-classification>  
        <further-classification edition="200601120251217B">G02B6/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊谷傳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAGAI, TSUTARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之光纖具備：玻璃纖維，其具有纖芯、包圍纖芯之包覆層、及形成於包覆層且沿纖芯之光軸方向延伸之至少一個空孔；及樹脂被覆，其覆蓋玻璃纖維之外周面。自樹脂被覆露出之玻璃纖維之露出部包含：彎曲部，其相對於被樹脂被覆覆蓋之玻璃纖維之被覆部延伸之方向彎曲。彎曲部包含在未殘留彎曲應力之狀態下維持於曲率半徑1.5 mm以下之彎曲區間。至少一個空孔於至少彎曲區間沿光軸方向延伸。對玻璃纖維賦予曲率半徑1.5 mm以下之彎曲90度時之彎曲損耗為1.0 dB以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:光纖</p>  
        <p type="p">21a:外周面</p>  
        <p type="p">22:樹脂被覆</p>  
        <p type="p">23:露出部</p>  
        <p type="p">23a:前端面</p>  
        <p type="p">23b:末端部</p>  
        <p type="p">24:被覆部</p>  
        <p type="p">24a:基端面</p>  
        <p type="p">24b:基端部</p>  
        <p type="p">25:纖芯</p>  
        <p type="p">26:包覆層</p>  
        <p type="p">27,27A,27B:空孔</p>  
        <p type="p">27a:第一開口部</p>  
        <p type="p">27b:第二開口部</p>  
        <p type="p">28:密封構件</p>  
        <p type="p">42:光纖</p>  
        <p type="p">42a:前端面</p>  
        <p type="p">51:彎曲部</p>  
        <p type="p">51a:第一彎曲區間</p>  
        <p type="p">51b,51c:第二彎曲區間</p>  
        <p type="p">51d:外周面</p>  
        <p type="p">51e:內周面</p>  
        <p type="p">52:第一延伸部</p>  
        <p type="p">53:第二延伸部</p>  
        <p type="p">C1:中心軸</p>  
        <p type="p">R1:外側區域</p>  
        <p type="p">R2:內側區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="792" publication-number="202612785"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612785.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612785</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114104996</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於噴水器設備的閥總成及噴水器設備</chinese-title>  
        <english-title>VALVE ASSEMBLY FOR A WATER SPRAYER EQUIPMENT AND WATER SPARYER EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">B05B1/30</main-classification>  
        <further-classification edition="200601120251230B">B05B9/01</further-classification>  
        <further-classification edition="201801120251230B">B05B12/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商胡斯華納有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUSQVARNA AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷納　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RENNER, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞薩爾　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAL, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝勒　加布里耶爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHERER, GABRIELE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於一噴水器設備(1)的閥總成(3)，其包含：一閥外殼(11)，其包含具有一入口埠(10)及一出口埠(13)的一管狀閥室(14)；及圓柱形活塞(15)，其具有一實心活塞體(16)作為一閥體，該閥體軸向往復地且可旋轉地收納於該閥室(14)內，該活塞(15)的一活塞槽(20)在其相對軸向端處由二個活塞環槽岸(21, 22)限定，該活塞體(16)包含在該二個活塞環槽岸(21, 22)之間延伸的至少一個活塞桿(23, 24)；其中該等活塞環槽岸(21, 22)及活塞槽(20)界定一滑動活塞閥功能，其中在該活塞(15)的一第一軸向位置中，該入口埠及/或出口埠(10, 13)由該等環槽岸(21, 22)中之一者密封地關閉，且其中回應於該活塞(15)的一軸向滑動移動，該入口埠或出口埠(10, 13)被逐漸釋放以使得流體能夠經由該槽(20)自該入口埠(10)流至該出口埠(13)；且其中該等環槽岸(21, 22)及該至少一個活塞桿(23, 24)界定一旋轉活塞閥功能，其中該入口埠(10)與該出口埠(13)之間的一自由通路寬度可由該等桿(23)中之至少一者回應於該活塞(15)的一旋轉移動而更改。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a valve assembly (3) for a watersprayer equipment (1), comprising a valve housing (11) comprising a tubular valve chamber (14) with an inlet port (10) and an outlet port (13), and cylindrical piston (15) with a solid piston body (16) as a valve body axially reciprocally as well as rotatably re-ceived within the valve chamber (14), a piston groove (20) of the piston (15) being delimited at its opposite axial ends by two piston lands (21, 22), the pis-ton body (16) comprises at least one piston bar (23, 24) extending, between the two piston lands (21,22); wherein the piston lands (21, 22) and piston groove (20) define a sliding piston valve functionality, in which in a first axial position of the piston (15), the inlet and/or outlet port (10, 13) is/are sealingly closed by one of the lands (21,22), and in which in response to an axial sliding movement of the piston (15), the inlet or out-let port (10, 13) is gradually released to ena-ble fluid passing via the groove (20) from the inlet port (10) to the outlet port (13); and wherein the lands (21, 22) and the least one piston bar (23, 24) define a rotary piston valve functionality, in which a free passage width between the inlet port (10) and outlet port (13) is modifiable by at least one of the bars (23) in response to a rotary movement of the piston (15).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:噴水器設備；噴水器總成</p>  
        <p type="p">2:握把</p>  
        <p type="p">3:閥總成</p>  
        <p type="p">4:槓桿</p>  
        <p type="p">5:轉度盤</p>  
        <p type="p">6:噴口</p>  
        <p type="p">7:流入路徑</p>  
        <p type="p">8:快速耦接件</p>  
        <p type="p">9:流入管道</p>  
        <p type="p">10:入口埠</p>  
        <p type="p">11:閥外殼</p>  
        <p type="p">12:排放路徑</p>  
        <p type="p">13:出口埠</p>  
        <p type="p">14:閥室；管狀閥室</p>  
        <p type="p">15:活塞</p>  
        <p type="p">16:活塞體；實心活塞體</p>  
        <p type="p">17:凸緣</p>  
        <p type="p">18:樞接部</p>  
        <p type="p">19:螺旋彈簧</p>  
        <p type="p">20:活塞槽</p>  
        <p type="p">A:縱向軸線</p>  
        <p type="p">E1:第一遠端；第一端；第一遠側端部；軸向端</p>  
        <p type="p">E2:第二端；第二軸向端；軸向端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="793" publication-number="202614190"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614190.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614190</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105017</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨用組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/304</main-classification>  
        <further-classification edition="200601120251230B">C09K3/14</further-classification>  
        <further-classification edition="201201120251230B">B24B37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商福吉米股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMI INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川﨑雄介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤昌明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, MASAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坪田翔吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUBOTA, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芦高圭史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASHITAKA, KEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, OSAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種研磨用組成物，其能減低研磨後的研磨對象物表面之霧度。研磨用組成物包含二氧化矽溶膠，前述二氧化矽溶膠包含具有1.50以上的平均縱橫比之二氧化矽粒子，前述二氧化矽溶膠中，相對於全部二氧化矽粒子的個數，具有1.50以上的縱橫比之二氧化矽粒子的個數之比例為40%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="794" publication-number="202614057"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614057.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614057</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105035</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251028B">G11C16/02</main-classification>  
        <further-classification edition="202301120251028B">H10B41/20</further-classification>  
        <further-classification edition="202301120251028B">H10B43/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斉藤信美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, NOBUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>増田貴史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡嶋睦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAJIMA, MUTSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江城一樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ESHIRO, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能夠高積體化的半導體記憶裝置。半導體記憶裝置，係具備有：複數之半導體層，係於第1方向上被作層積，並在第2方向以及第3方向上而並排；和複數之通孔配線，係分別被與在第1方向上而被作了層積的複數之半導體層作電性連接；和複數之記憶體部，係分別被與複數之半導體層作電性連接；和複數之閘極電極，係分別與複數之半導體層相對向；和複數之配線構件，係分別被配置在複數之閘極電極之中之於第3方向上而相鄰之2個的閘極電極之間。複數之閘極電極，係包含有被設置在第1方向之第1位置處並且於第3方向上而並排之複數之第1閘極電極。複數之配線構件，係包含有被設置在第1方向之第1位置處並且於第3方向上而並排之複數之第1配線構件。複數之第1配線構件，係經由複數之第1閘極電極而彼此被作電性連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:絕緣層</p>  
        <p type="p">102(PL):導電層(板線)</p>  
        <p type="p">103:絕緣層</p>  
        <p type="p">104(BL):通孔配線(位元線)</p>  
        <p type="p">110(TrC):電晶體構造(電晶體)</p>  
        <p type="p">115:絕緣層</p>  
        <p type="p">120:配線構件</p>  
        <p type="p">130(CpC):電容器構造(電容器)</p>  
        <p type="p">MC:記憶體胞</p>  
        <p type="p">MCA:記憶體胞陣列</p>  
        <p type="p">ML:記憶體層</p>  
        <p type="p">Sub:半導體基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="795" publication-number="202614756"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614756.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614756</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105046</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title>SEMICONDUCTOR STORAGE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250509B">H10B41/20</main-classification>  
        <further-classification edition="202301120250509B">H10B41/30</further-classification>  
        <further-classification edition="202301120250509B">H10B41/35</further-classification>  
        <further-classification edition="202301120250509B">H10B43/20</further-classification>  
        <further-classification edition="202301120250509B">H10B43/30</further-classification>  
        <further-classification edition="202301120250509B">H10B43/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沓掛弘之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUTSUKAKE, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種對於信賴性之降低作抑制的半導體記憶裝置。本揭示之半導體記憶裝置，係具備有：半導體基板，係包含有身為源極區域或者是汲極區域之第1區域、和相對於第1區域而於第1方向上分離並且身為源極區域或者是汲極區域之第2區域；和第1接點，係被與第1區域作連接；和第2接點，係被與第2區域作連接；和第1記憶體胞，係被與第1接點作連接；和閘極電極，係被形成於第1接點與第2接點之間；和第1導電體，係為與前述閘極電極相同之高度，並被與第1接點作電性連接；和第2導電體，係為與閘極電極相同之高度，且至少一部分為被形成於閘極電極與第2接點之間，並且係與閘極電極、第1接點以及第2接點相互絕緣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor storage device according to the present disclosure includes a semiconductor substrate including a first region which is a source region or a drain region and a second region which is spaced from the first region in a first direction and which is the source region or the drain region, a first contact connected to the first region, a second contact connected to the second region, a first memory cell connected to the first contact, a gate electrode formed between the first contact and the second contact, a first conductor having a height equal to a height of the gate electrode and electrically connected to the first contact, and a second conductor having a height equal to the height of the gate electrode, having at least a portion formed between the gate electrode and the second contact, and insulated from the gate electrode, the first contact, and the second contact.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">41B:P型井區域</p>  
        <p type="p">42:N-雜質擴散區域</p>  
        <p type="p">43:雜質擴散區域</p>  
        <p type="p">44:雜質擴散區域</p>  
        <p type="p">61~65:接點</p>  
        <p type="p">66A~66E:導電體層</p>  
        <p type="p">67~69:接點</p>  
        <p type="p">101~107:電極</p>  
        <p type="p">201:電極</p>  
        <p type="p">202:電極</p>  
        <p type="p">203:電極</p>  
        <p type="p">TW0_0:傳輸電晶體</p>  
        <p type="p">TW0_1:傳輸電晶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="796" publication-number="202613494"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613494.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613494</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以具有振動補償之色像共焦感測器掃描進行原位晶圓應力量測</chinese-title>  
        <english-title>IN-SITU WAFER STRESS MEASUREMENT BY CHROMATIC CONFOCAL SENSOR SCANNING WITH VIBRATION COMPENSATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G01B11/24</main-classification>  
        <further-classification edition="200601120251230B">G01J5/10</further-classification>  
        <further-classification edition="200601120251230B">H01L21/67</further-classification>  
        <further-classification edition="200601120251230B">H01L21/687</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商奧寶科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORBOTECH LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海默爾　史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYMORE, SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯朗夫曼　阿卡迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRONFMAN, ARKADY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈伊克赫曼　塔爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOICHMAN, TAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威爾比　東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILBY, TONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅森伯格　波茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROSENBERG, BOAZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種系統包含一處理室、連接至該處理室之一輸送室、經組態以支撐一工件之一機械臂、一色像共焦感測器及與該色像共焦感測器電子通信之一處理器。該機械臂經組態以沿一移動路徑在該處理室與該輸送室之間移動該工件，且該色像共焦感測器經組態以在該機械臂沿該移動路徑移動該工件時量測由該工件反射之光之一波長。該處理器經組態以自該色像共焦感測器接收一第一掃描信號、對該第一掃描信號濾波以產生在該機械臂將該工件自該輸送室移動至該處理室時補償該機械臂之振動之一第一濾波信號及基於該第一濾波信號來產生該工件之一第一弓形輪廓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system includes a process chamber, a transport chamber connected to the process chamber, a robot arm configured to support a workpiece, a chromatic confocal sensor, and a processor in electronic communication with the chromatic confocal sensor. The robot arm is configured to move the workpiece along a movement path between the process chamber and the transport chamber, and the chromatic confocal sensor is configured to measure a wavelength of light reflected by the workpiece as the robot arm moves the workpiece along the movement path. The processor is configured to receive a first scanning signal from the chromatic confocal sensor, filter the first scanning signal to produce a first filtered signal that compensates for vibrations of the robot arm while the robot arm moves the workpiece from the transport chamber to the process chamber, and generate a first bow profile of the workpiece based on the first filtered signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">101:工件</p>  
        <p type="p">110:處理室</p>  
        <p type="p">115:卡盤</p>  
        <p type="p">116:沈積工具</p>  
        <p type="p">117:真空泵</p>  
        <p type="p">120:輸送室</p>  
        <p type="p">125:槽閥</p>  
        <p type="p">126:閘</p>  
        <p type="p">127:視窗</p>  
        <p type="p">130:機械臂</p>  
        <p type="p">135:末端效應器</p>  
        <p type="p">140:色像共焦感測器</p>  
        <p type="p">145:溫度感測器</p>  
        <p type="p">150:處理器</p>  
        <p type="p">155:電子資料儲存單元</p>  
        <p type="p">160:設備前端模組(EFEM)</p>  
        <p type="p">165:旋轉台</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="797" publication-number="202614878"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614878.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614878</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105146</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251103B">H10F39/18</main-classification>  
        <further-classification edition="202501120251103B">H10F39/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游秉程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, BING CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪豐基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, FENG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳韋龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施志承</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHIH CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉人誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一些實施例中，本揭露實施例涉及積體晶片。積體晶片包括具有裝置區域的基板，裝置區域具有一個或多個半導體裝置。基板具有沿裝置區域的相對側在基板內形成一個或多個溝槽的一個或多個內表面。多層膜堆疊件沿基板的一個或多個內表面設置。核心材料配置在一個或多個溝槽內並且由多層膜堆疊件圍繞。多層膜堆疊件包括分別具有不同電子親和能的多個介電材料。多個介電材料配置為在多層膜堆疊件內形成一個或多個電位井。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a substrate having a device region with one or more semiconductor devices. The substrate has one or more interior surfaces that form one or more trenches within the substrate along opposing sides of the device region. A multi-layer film stack is disposed along the one or more interior surfaces of the substrate. A core material is arranged within the one or more trenches and is surrounded by the multi-layer film stack. The multi-layer film stack includes a plurality of dielectric material respectively having different electron affinities. The plurality of dielectric materials are arranged to form one or more potential wells within the multi-layer film stack.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:積體晶片</p>  
        <p type="p">102:基板</p>  
        <p type="p">102a:第一側</p>  
        <p type="p">102b:第二側</p>  
        <p type="p">104:溝槽</p>  
        <p type="p">106:裝置區域</p>  
        <p type="p">108:多層膜堆疊件</p>  
        <p type="p">108a:第一介電材料</p>  
        <p type="p">108b:第二介電材料</p>  
        <p type="p">108c:第三介電材料</p>  
        <p type="p">108d:第四介電材料</p>  
        <p type="p">108e:第五介電材料</p>  
        <p type="p">110:核心材料</p>  
        <p type="p">111:溝槽隔離結構</p>  
        <p type="p">112:線</p>  
        <p type="p">114:電子</p>  
        <p type="p">116:電洞</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="798" publication-number="202613069"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613069.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613069</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105149</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含2-亞甲基-1,3-丙二醇二乙酸酯之組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">C07C69/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松下雄太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHITA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西和美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHI, KAZUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種組成物，其係包含亞甲基-1,3-丙二醇二乙酸酯(P)及2-亞甲基-1,3-丙二醇二乙酸酯之異構物(Pi)，其中相對於2-亞甲基-1,3-丙二醇二乙酸酯(P)之含量，該2-亞甲基-1,3-丙二醇二乙酸酯之異構物(Pi)之含量為100~100,000質量ppm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="799" publication-number="202614567"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614567.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614567</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105177</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體積體電路</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251020B">H03K17/08</main-classification>  
        <further-classification edition="200601120251020B">H03K17/687</further-classification>  
        <further-classification edition="200601120251020B">H03K19/094</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小原弘治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOHARA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKITA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤彰邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, AKIKUNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">若根據實施形態，則提供一種具有開關、第1控制電路及第2控制電路的半導體積體電路。&lt;br/&gt;開關是被連接於第1電源與第2電源之間。開關是在控制端子接受第1位準時關閉(OFF)。第1控制電路是具有輸入節點及輸出節點。輸出節點是被連接至開關的控制端子。第2控制電路是具有輸出節點及輸入節點。輸入節點是被連接至開關的控制端子。&lt;br/&gt;半導體積體電路是滿足以下至少一方：&lt;br/&gt;在第1控制電路中，朝第1位準的驅動力大於朝第2位準的驅動力；及&lt;br/&gt;在第2控制電路中，朝第2位準的驅動力大於朝第1位準的驅動力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">211:控制電路</p>  
        <p type="p">211a:輸入節點</p>  
        <p type="p">211b:輸出節點</p>  
        <p type="p">211c:電源節點</p>  
        <p type="p">212:控制電路</p>  
        <p type="p">212b:輸出節點</p>  
        <p type="p">212c:電源節點</p>  
        <p type="p">213:開關</p>  
        <p type="p">213a:一端</p>  
        <p type="p">213b:另一端</p>  
        <p type="p">213c:控制端子</p>  
        <p type="p">N1:節點</p>  
        <p type="p">IN:輸入節點</p>  
        <p type="p">INV1:反相器</p>  
        <p type="p">INV2:反相器</p>  
        <p type="p">VDD:電源節點</p>  
        <p type="p">TVDD:電源節點</p>  
        <p type="p">PM1:電晶體</p>  
        <p type="p">OUT:輸出節點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="800" publication-number="202613039"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613039.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613039</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105241</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>回收光敏化劑以改進ＰＦＡＳ破壞之方法及系統</chinese-title>  
        <english-title>METHODS AND SYSTEMS OF PHOTOSENSITIZER RECOVERY FOR IMPROVED PFAS DESTRUCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251229B">C02F1/32</main-classification>  
        <further-classification edition="202301120251229B">C02F1/42</further-classification>  
        <further-classification edition="202301120251229B">C02F1/44</further-classification>  
        <further-classification edition="202301120251229B">C02F1/66</further-classification>  
        <further-classification edition="200601120251229B">B01D61/02</further-classification>  
        <further-classification edition="200601120251229B">B01D61/04</further-classification>  
        <further-classification edition="200601320251229B">C02F101/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商凱洛思科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLAROS TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉澤坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ZEKUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒂拉多　約瑟夫魯埃爾萊文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIRADO, JOSEPH REUEL LEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆恩斯　索尼婭伊莉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOONS, SONJA ELISE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布洛克格雷騰斯　約翰威爾弗里德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROCKGREITENS, JOHN WILFRID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍森　艾爾文哈菲茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSSEN, ELVIN HAFFEZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波茨　特里李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POTTS, TERRY LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　特倫斯Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, TERRANCE P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供包含反應物回收與再循環之PFAS破壞方法及系統。該方法可包含結合包含PFAS之水與新鮮反應物（包含光敏化劑、亞硫酸鹽及鹼），以形成pH值約為10或更高之初始處理溶液，於光反應器中以紫外光照射該初始處理溶液，以破壞部分PFAS並形成處理排放物，使該處理排放物通過離子選擇性膜，結合廢液溶液與包含PFAS之水，以形成後續處理溶液，於光反應器中以紫外光照射該後續處理溶液，以破壞部分PFAS並形成處理排放物，並重複該程序，以使該回收之反應物再循環額外的一或多次。在回收之反應物經過多次再循環後，可清除該回收之反應物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and systems of PFAS destruction including recovery and recycling of reactants. The method may include combining water including PFAS with fresh reactants including photosensitizer, sulfite salt and base to form an initial treatment solution having a pH of about 10 or more, irradiating the initial treatment solution with UV light in a photoreactor to destroy a portion of the PFAS and form treatment effluent, passing the treatment effluent through an ion selective membrane, combining the reject solution with water including PFAS to form a subsequent treatment solution, irradiating the subsequent treatment solution with UV light in the photoreactor to destroy a portion of the PFAS and form a treatment effluent, and repeating the process to recycle the recovered reactants one or more additional times. After the recovered reactants are recycled multiple times, they may be purged.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="801" publication-number="202613013"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613013.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613013</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105289</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>裝載埠</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250722B">B65G49/07</main-classification>  
        <further-classification edition="200601120250722B">H01L21/67</further-classification>  
        <further-classification edition="200601120250722B">B25J9/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商平田機工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRATA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豊田哲慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYODA, NORIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝載埠，具備：載置台，被載置有容器，前述容器被容納有基板；容納部，被配置於前述載置台的下方；埠門，可保持前述容器的門部；對接板，被配置在前述載置台及前述容納部、與前述埠門之間，且具有可存取前述基板的開口部，前述開口部可藉由前述埠門而開閉；移動裝置，相對於前述開口部將前述埠門進行昇降，且具備：驅動機構，被容納在前述容納部；以及臂部件，通過被形成在前述對接板上的狹縫而被連結至前述埠門，且藉由前述驅動機構進行昇降；以及通路形成部件，形成排氣通路。前述排氣通路是具備入口，向前述狹縫呈開口，前述容納部內的氣體流入前述入口；以及出口；前述通路形成部件是被配置在比前述埠門還靠前述對接板之側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:對接板</p>  
        <p type="p">4:埠門</p>  
        <p type="p">3b:背面</p>  
        <p type="p">6:排氣單元</p>  
        <p type="p">31:狹縫</p>  
        <p type="p">40:保持部</p>  
        <p type="p">41:支承部</p>  
        <p type="p">60:通路形成部件</p>  
        <p type="p">60a:表面</p>  
        <p type="p">61:吸引單元</p>  
        <p type="p">62:排氣管道</p>  
        <p type="p">311:內壁部</p>  
        <p type="p">311a:垂直壁部</p>  
        <p type="p">311b:水平壁部</p>  
        <p type="p">600:入口</p>  
        <p type="p">601:橫通路</p>  
        <p type="p">602:縱通路</p>  
        <p type="p">603:出口</p>  
        <p type="p">EP:排氣通路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="802" publication-number="202613832"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613832.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613832</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105498</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通訊方法、控制器及晶片</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G06F13/42</main-classification>  
        <further-classification edition="200601120250801B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島秋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">若依據實施形態，則可提供一種通訊方法。通訊方法係包含：含有第1晶片之識別資訊和第1大小之指定的第1封包，係從控制器被發送至第1匯流排。通訊方法係包含：隨應於第1封包被第1晶片所收訊之事實，第1大小之第1資料變成可從第1晶片傳輸至第2匯流排。通訊方法係包含：在第1資料之傳輸完成後，第2匯流排係被釋放。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:記憶體系統</p>  
        <p type="p">2:控制器</p>  
        <p type="p">3_LUN0,3_LUN1,3_LUN2,3_LUN3:記憶體晶片</p>  
        <p type="p">CH:通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="803" publication-number="202613468"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613468.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613468</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105509</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷凍系統及冷凍方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250705B">F25B9/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI HEAVY INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙田亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKATA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤栄作</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, EISAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種冷凍系統及冷凍方法，能夠強力抵禦外部氣溫變動。冷凍系統，具備：第1冷凍循環部，冷卻對象溫度為0℃以下，藉由朝中間冷媒排熱而將冷卻對象冷卻；及第2冷凍循環部，冷卻對象溫度為0℃以上，藉由朝大氣直接或間接排熱而將中間冷媒冷卻；及中間冷媒管線，在第1冷凍循環部及第2冷凍循環部之間將中間冷媒循環。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:冷凍系統</p>  
        <p type="p">2:冷卻對象</p>  
        <p type="p">10:第1冷凍循環部</p>  
        <p type="p">20:第2冷凍循環部</p>  
        <p type="p">30:中間冷媒管線</p>  
        <p type="p">MR:中間冷媒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="804" publication-number="202614044"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614044.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614044</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105614</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250616B">G11C7/24</main-classification>  
        <further-classification edition="200601120250616B">G11C8/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羽賀健一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAGA, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐貫朋也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANUKI, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中塚圭祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATSUKA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮崎隆行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAZAKI, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一實施方式的記憶體裝置包含第一導電體、第一半導體、第一絕緣體、第二導電體、第三導電體及第二絕緣體。第一導電體沿第一方向延伸。第一半導體沿著與第一方向相交的第一平面包圍第一導電體。第一絕緣體沿著第一平面包圍第一半導體。第二導電體沿著第一平面包圍第一絕緣體。第三導電體位於較第一半導體更靠第一方向，沿著第一平面包圍第一導電體。第二絕緣體位於第一半導體與第三導電體之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">23、26、31:導電體</p>  
        <p type="p">24、27、29:絕緣體</p>  
        <p type="p">28:半導體</p>  
        <p type="p">261、271:第一部分</p>  
        <p type="p">262、272:第二部分</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="805" publication-number="202613190"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613190.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613190</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105634</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱硬化性光配向膜用樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C08F2/44</main-classification>  
        <further-classification edition="200601120251229B">C08F220/40</further-classification>  
        <further-classification edition="200601120251229B">C08F265/04</further-classification>  
        <further-classification edition="200601120251229B">G02B5/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木朋哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮下拓実</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYASHITA, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢田研造</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YADA, KENZO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森內正人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIUCHI, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木加名子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KANAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係在於提供一種組成物，其不須使用含有N-羥甲基、N-烷氧基甲基等的交聯劑，仍可以用低溫、短時間之煅燒得到配向性、密接性優良的配向材。&lt;br/&gt;解決手段係一種硬化膜形成組成物，其含有：&lt;br/&gt;(A)下述式(a)表示之化合物、&lt;br/&gt;(B)具有環氧基之聚合物、&lt;br/&gt;(C)熱酸產生劑，及&lt;br/&gt;(D)具有含有C=C雙鍵的自由基聚合性基及親核性基之化合物。&lt;br/&gt;&lt;img align="absmiddle" height="189px" width="645px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="806" publication-number="202614041"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614041.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614041</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105783</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251029B">G11C7/08</main-classification>  
        <further-classification edition="200601120251029B">G11C7/12</further-classification>  
        <further-classification edition="200601120251029B">G11C8/10</further-classification>  
        <further-classification edition="200601120251029B">G11C8/14</further-classification>  
        <further-classification edition="200601120251029B">G11C5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤光司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能縮短處理時間之半導體記憶裝置。實施方式之半導體記憶裝置具備：第1佈線層、第2佈線層及複數個第3佈線層，其等在第1方向上相互分離地依序排列而設置；記憶柱，其於第1方向上延伸，且其與第1佈線層相交之部分作為第1記憶單元發揮功能；以及控制電路，其控制第1記憶單元所記憶之資料之讀出動作；且控制電路於讀出動作時，執行：第1動作，其使複數個第3佈線層之電壓以第1梯度自第1電壓向較第1電壓高之第2電壓變化；第2動作，其使第2佈線層之電壓以較第1梯度大之第2梯度自第1電壓向較第2電壓高之第3電壓變化；以及第3動作，其使第1佈線層之電壓向與第1記憶單元之讀出位準相應之第4電壓變化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">AR:讀出電壓</p>  
        <p type="p">ER:讀出電壓</p>  
        <p type="p">Far:字元線之遠端</p>  
        <p type="p">Near:字元線之近端</p>  
        <p type="p">t10:時刻</p>  
        <p type="p">t11:時刻</p>  
        <p type="p">t12:時刻</p>  
        <p type="p">t13:時刻</p>  
        <p type="p">t14:時刻</p>  
        <p type="p">t15:時刻</p>  
        <p type="p">t16:時刻</p>  
        <p type="p">VREAD:電壓</p>  
        <p type="p">VREADK:電壓</p>  
        <p type="p">VSS:電壓</p>  
        <p type="p">WLk:字元線</p>  
        <p type="p">WL(k±1):字元線</p>  
        <p type="p">WL(k±2):字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="807" publication-number="202614433"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614433.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614433</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105797</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>不具有VG接觸窗和VD接觸窗的軌道的單元區域及其製造方法</chinese-title>  
        <english-title>CELL REGION HAVING VG-CONTACT-FREE AND VD-CONTACT-FREE TRACKS AND METHOD OF MANUFACTURING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">H01L23/528</main-classification>  
        <further-classification edition="200601120250801B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾威程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZENG, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昱蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江宏禮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, HUNG-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林威呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾健庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZENG, JIANN-TYNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種（裝置的）單元區域包括：主動區域；閘極段和金屬到源極/汲極區域（MD）接觸窗相互交錯；通孔到閘極（VG）接觸窗；通孔到MD接觸窗（VD）的接觸窗；VG接觸窗和VD接觸窗對應對準延伸在第一方向的α軌道；對應對準α軌道的第一佈線（RTE）段；以及第一埋入電源網格段；α軌道的第一和第二軌道鄰近單元區域的第一和第二邊界；至少第三α軌道位於第一和第二α軌道之間；第一α軌道沒有任何VG接觸窗與其對準；以及第二α軌道沒有任何VD接觸窗與其對準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cell region (of a device) includes: active regions; gate segments and metal-to-source/drain-region (MD) contacts which are interspersed; via-to-gate (VG) contacts; via-to-MD-contact (VD) contacts; the VG contacts and the VD contacts being aligned correspondingly to alpha tracks extending in the first direction; first routing (RTE) segments aligned correspondingly to the alpha tracks; and first buried power grid segments; and first and second ones of the alpha tracks being adjacent to first and second boundaries of the cell region; at least a third one of the alpha tracks being between the first and second alpha tracks; the first alpha track being free from having any of the VG contacts aligned thereto; and the second alpha track being free from having any of the VD contacts aligned thereto.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202D:巨集區域</p>  
        <p type="p">206D(1)、206D(2)、208D(1)、214(1)、214(2):功能性單元區域</p>  
        <p type="p">α0、α2、α3、α4、α5、α6、α7、α8、α9、α10、α11、α12、α13、α14、α15、α16:α軌道</p>  
        <p type="p">β0、β1、β2、β3、β4、β5、β6、β7、β8、β9、β10、β11、β12:β軌道</p>  
        <p type="p">IDG:隔離虛設閘極</p>  
        <p type="p">Gate:閘極</p>  
        <p type="p">M1:MET1層中的金屬化段</p>  
        <p type="p">M0_rte:M0段的佈線段</p>  
        <p type="p">VD:通孔到MD接觸窗</p>  
        <p type="p">VG:通孔到閘極段</p>  
        <p type="p">V0:第一內連線層(VIA0)層中的通孔結構</p>  
        <p type="p">AR:主動區域</p>  
        <p type="p">BM0_PG:0段中的電源網格(PG)</p>  
        <p type="p">gap_VD:相鄰的β共線VD接觸窗之間的最小距離</p>  
        <p type="p">gap_V0:相鄰的β共線V0結構之間的最小距離</p>  
        <p type="p">gap_M1_E2E:β共線M1_rte段的相鄰端點的最小距離</p>  
        <p type="p">gap_VG:相鄰的β共線VG接觸窗之間的最小距離</p>  
        <p type="p">p_gate:閘極(Gate)段彼此的均勻距離/間距</p>  
        <p type="p">p_M0_rte:M0_rte段彼此的均勻距離/間距</p>  
        <p type="p">4A-4A':剖面線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="808" publication-number="202614769"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614769.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614769</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105863</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250701B">H10B43/00</main-classification>  
        <further-classification edition="202301120250701B">H10B12/00</further-classification>  
        <further-classification edition="200601120250701B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐久間究</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKUMA, KIWAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大月保直</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKI, YASUNAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤部亮介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWABE, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木都文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KUNIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>船附里英子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUNATSUKI, RIEKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據實施方式，提供一種具有多個第一記憶胞元與第一選擇機構的半導體記憶裝置。多個第一記憶胞元積層在基板的上方。多個第一記憶胞元並列連接於第一垂直位元線與第一垂直源極線之間。第一垂直位元線沿積層方向延伸。第一垂直源極線沿積層方向延伸。第一選擇機構配設在積層方向上的基板與多個第一記憶胞元之間。第一選擇機構將第一垂直位元線選擇連接至第一局部位元線。第一選擇機構將第一垂直源極線選擇連接至第一局部源極線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體記憶裝置</p>  
        <p type="p">2:記憶胞元陣列</p>  
        <p type="p">81:層間絕緣膜</p>  
        <p type="p">A:部分</p>  
        <p type="p">CH:通道區域</p>  
        <p type="p">CL:連接層</p>  
        <p type="p">FE、IF1:絕緣膜</p>  
        <p type="p">IF2:絕緣層</p>  
        <p type="p">IF3:狹縫</p>  
        <p type="p">L1、L2:選擇閘極層</p>  
        <p type="p">L3:陣列層</p>  
        <p type="p">MT:記憶胞元</p>  
        <p type="p">PL3、PL13:柱狀體</p>  
        <p type="p">SB:基板</p>  
        <p type="p">SST:積層體</p>  
        <p type="p">vBL:垂直位元線</p>  
        <p type="p">vSL:垂直源極線</p>  
        <p type="p">WL:字元線</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="809" publication-number="202614761"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614761.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614761</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105874</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250624B">H10B41/27</main-classification>  
        <further-classification edition="202301120250624B">H10B43/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大隅健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSUMI, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤久詞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, HISASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木和貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KAZUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相田峻佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AITA, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種適宜地運作的半導體記憶裝置。半導體記憶裝置包括：基板；第一層～第三層，與基板分離；第一半導體層及第二半導體層，與第一層～第三層相向；第一電極，與第一層連接；第二電極，外周面由第一層包圍且端部與第二層連接；第三電極，外周面由第一層及第二層包圍且端部與第三層連接；以及第一絕緣層，分割第一層的一部分且不分割第二層及第三層。第一層包括：第一導電層，與第一半導體層相向且與第一電極連接；第二導電層，與第二半導體層相向；以及中間層，於第二電極與第三電極之間的區域中連續地形成，且與第一導電層以及第二導電層均不電性連接。第二層及第三層分別包括如下第三導電層，所述第三導電層於第一半導體層與第二半導體層之間的區域中連續地形成，且與第一半導體層及第二半導體層相向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110(SGD):導電層</p>  
        <p type="p">120:半導體層</p>  
        <p type="p">CC:接觸電極</p>  
        <p type="p">HR:支撐構造</p>  
        <p type="p">ST:區塊間構造</p>  
        <p type="p">CCG(0)、CCG(1):接觸電極行</p>  
        <p type="p">CCS:接觸電極</p>  
        <p type="p">R&lt;sub&gt;HU&lt;/sub&gt;:接線區域</p>  
        <p type="p">R&lt;sub&gt;HU_S&lt;/sub&gt;、R&lt;sub&gt;HU_W&lt;/sub&gt;:區域</p>  
        <p type="p">R&lt;sub&gt;MH&lt;/sub&gt;:記憶體孔區域</p>  
        <p type="p">SHE:串單元間絕緣層</p>  
        <p type="p">SHE_V:絕緣層</p>  
        <p type="p">SUa~SUe:串單元</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="810" publication-number="202614008"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614008.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614008</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105938</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>源極驅動器及包括源極驅動器之顯示驅動電路</chinese-title>  
        <english-title>SOURCE DRIVER AND DISPLAY DRIVING CIRCUIT INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G09G3/20</main-classification>  
        <further-classification edition="200601120251229B">G09G3/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權宅秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, TAEK SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金仁錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, IN-SUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示驅動電路可包括一源極驅動器，該源極驅動器包括一解碼器電路及一緩衝器電路。該解碼器電路基於像素資料在複數個伽馬電壓當中選擇一第一伽馬電壓及一第二伽馬電壓，且在該等複數個伽馬電壓當中選擇與該第一伽馬電壓及該第二伽馬電壓不同之一第三伽馬電壓。該緩衝器電路在該第一伽馬電壓與該第二伽馬電壓之間進行內插以輸出一第一目標電壓，且將在源極線上形成之一源極電壓升高或降低至該第一目標電壓。該緩衝器電路包括一快速轉換電路，該快速轉換電路將該第一源極電壓與該第三伽馬電壓進行比較以調整該第一源極電壓之轉換速率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display driving circuit may include a source driver that includes a decoder circuit and a buffer circuit. The decoder circuit selects a first gamma voltage and a second gamma voltage among a plurality of gamma voltages based on pixel data, and selects a third gamma voltage different from the first and second gamma voltages among the plurality of gamma voltages. The buffer circuit interpolates between the first and second gamma voltages to output a first target voltage, and steps up or steps down a source voltage formed on the source line to the first target voltage. The buffer circuit includes a fast slew circuit that compares the first source voltage with the third gamma voltage to adjust slew rate of the first source voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">123_2:解碼器電路</p>  
        <p type="p">125_2:內插電路</p>  
        <p type="p">126_2:快速轉換電路</p>  
        <p type="p">VG:伽馬電壓</p>  
        <p type="p">PD:像素資料</p>  
        <p type="p">FSD:轉換輸入資料</p>  
        <p type="p">UB2:第二緩衝器</p>  
        <p type="p">IPL:內插資料</p>  
        <p type="p">SL2:源極線</p>  
        <p type="p">VH:第一伽馬電壓</p>  
        <p type="p">VL:第二伽馬電壓</p>  
        <p type="p">VFS:第三伽馬電壓</p>  
        <p type="p">VS2:輸出電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="811" publication-number="202614810"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614810.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614810</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114105940</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251229B">H10D30/60</main-classification>  
        <further-classification edition="202501120251229B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋敏圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, MINGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫鍾龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, JONGYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴秀蕙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SUEHYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金柱然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUYOUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李炯宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYUNG JONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置可包括：一基體，其包括一第一作用圖案及一第二作用圖案，該第一作用圖案與該第二作用圖案在平行於該基體之一頂部表面之一第一方向上彼此間隔開；一裝置隔離層，其在該第一作用圖案與該第二作用圖案之間；一第一源極/汲極圖案，其安置於該第一作用圖案上；一第二源極/汲極圖案，其安置於該第二作用圖案上；一第一主動接點，其安置於該第一及第二源極/汲極圖案上；一障壁圖案，其插置於該第一主動接點與該第一源極/汲極圖案之間及該第一主動接點與該第二源極/汲極圖案之間，且延伸至該第一主動接點與該裝置隔離層之間的一空間中；以及一空氣間隙，其插置於該第一主動接點與該障壁圖案之間。該第一主動接點可電氣連接至該第一及第二源極/汲極圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device may include a substrate including a first active pattern and a second active pattern, which are spaced apart from each other in a first direction parallel to a top surface of the substrate, a device isolation layer between the first and second active patterns, a first source/drain pattern disposed on the first active pattern, a second source/drain pattern disposed on the second active pattern, a first active contact disposed on the first and second source/drain patterns, a barrier pattern interposed between the first active contact and the first source/drain pattern and between the first active contact and the second source/drain pattern and extended into a space between the first active contact and the device isolation layer, and an air gap interposed between the first active contact and the barrier pattern. The first active contact may be electrically connected to the first and second source/drain patterns.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基體</p>  
        <p type="p">100U:頂部表面</p>  
        <p type="p">110:第一層間絕緣層</p>  
        <p type="p">120:第二層間絕緣層、第二層間絕緣膜</p>  
        <p type="p">130:第三層間絕緣層</p>  
        <p type="p">AC1(AC):第一主動接點、主動接點</p>  
        <p type="p">AC1_L,AG1_L,BM_L,BP1_L,BP2_L:最底表面</p>  
        <p type="p">AC1_V(BP3_V),AG1_V,BP1_V(BP2_V):長度</p>  
        <p type="p">AC1_W,AG1_W:寬度</p>  
        <p type="p">AC3(AC):第三主動接點</p>  
        <p type="p">ACL:作用層</p>  
        <p type="p">AG1:空氣間隙、第一空氣間隙</p>  
        <p type="p">AP1:第一作用圖案、作用圖案</p>  
        <p type="p">AP2:第二作用圖案、作用圖案</p>  
        <p type="p">BM:障壁圖案</p>  
        <p type="p">BM_R:凹部區</p>  
        <p type="p">BP1:第一主體部分</p>  
        <p type="p">BP2:第二主體部分</p>  
        <p type="p">BP3:第三主體部分</p>  
        <p type="p">C-C':線</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">M1:第一金屬層</p>  
        <p type="p">M1_I:第一互連線、線</p>  
        <p type="p">M1_R1(VDD):第一電力線、線</p>  
        <p type="p">M2:第二金屬層</p>  
        <p type="p">M2_I:第二互連線</p>  
        <p type="p">NR1:第一NMOSFET區</p>  
        <p type="p">PR1:第一PMOSFET區</p>  
        <p type="p">PR2:第二PMOSFET區</p>  
        <p type="p">RS1:第一凹部</p>  
        <p type="p">RS2:第二凹部</p>  
        <p type="p">SC:矽化物圖案</p>  
        <p type="p">SD1:第一源極/汲極圖案、源極/汲極圖案</p>  
        <p type="p">SD2:第二源極/汲極圖案、源極/汲極圖案</p>  
        <p type="p">SHC1:第一單高度胞元</p>  
        <p type="p">SHC2:第二單高度胞元</p>  
        <p type="p">ST:裝置隔離層</p>  
        <p type="p">TR:溝槽</p>  
        <p type="p">UIP:上絕緣圖案</p>  
        <p type="p">VI1:第一通孔</p>  
        <p type="p">VI2:第二通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="812" publication-number="202614868"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614868.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614868</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106019</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成積體電路裝置佈局計劃的方法、用於形成積體電路裝置的佈局計劃的處理裝置以及非暫時性電腦可讀儲存媒體</chinese-title>  
        <english-title>METHOD OF FORMING LAYOUT PLAN OF INTEGRATED CIRCUIT DEVICE, PROCESSING DEVICE FOR FORMING LAYOUT PLAN OF INTEGRATED CIRCUIT DEVICE, AND NON-TRANSITORY COMPUTER-READABLE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250508B">H10D89/10</main-classification>  
        <further-classification edition="202001120250508B">G06F30/392</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉思麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SZU-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭永州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, YUNG-CHOW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳致霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳家忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIA-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁忠盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, CHUNG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王中興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHUNG-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭儀侃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YI-KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施例形成積體電路（IC）裝置佈局計劃的方法包括獲得佈局計劃區域中多個數位電路單元的佈局；獲得佈局計劃多個金屬化層子集和多個通孔層子集中一個或多個熱感測電阻單元的初始佈局；基於時鐘樹合成和一個或多個熱感測電阻單元的初始佈局獲得佈線計劃；基於多個數位電路單元的佈局和佈線計劃執行熱分析以識別佈局計劃區域中一個或多個關注區域；以及獲得一個或多個熱感測電阻單元分別在一個或多個關注區域上的精細佈局。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An embodiment method of forming a layout plan of an integrated circuit (IC) device includes obtaining a placement of a plurality of digital circuit cells in a region of a layout plan; obtaining an initial placement of one or more thermal sensing resistor cells in a subset of a plurality of metallization layers and a subset of a plurality of via layers of the layout plan; obtaining a routing plan based on a clock tree synthesis and the initial placement of the one or more thermal sensing resistor cells; performing a thermal analysis based on the placement of the plurality of digital circuit cells and the routing plan to identify one or more areas of interest in the region of the layout plan; and obtaining a refined placement of the one or more thermal sensing resistor cells respectively over the one or more areas of interest.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:方法</p>  
        <p type="p">810、820、830、840、850、860:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="813" publication-number="202614720"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614720.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614720</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106170</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於空氣的熱分離系統</chinese-title>  
        <english-title>AIR-BASED THERMAL SEPARATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H05K7/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商微軟技術授權有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICROSOFT TECHNOLOGY LICENSING, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝爾二世　佛瑞迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELL JR., FREDDIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於在機架安裝的IT裝備附近使用的基於空氣的熱分離系統包括：空氣循環系統，該空氣循環系統被配置為接收輸入空氣並產生輸出氣流；以及空氣擴散器系統，該空氣擴散器系統被配置為縱向地定位在資料中心的熱通道內，該空氣擴散器系統包括：輸入埠，該輸入埠用於接收該輸出氣流；以及基本上線性的排放埠，該基本上線性的排放埠用於在大致向上的方向上排放該輸出氣流以形成基本上平坦的排放氣流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An air-based thermal separation system for use proximate rack-mounted IT equipment including: an air circulation system configured to receive input air and generate an output airflow; and an air diffuser system configured to be longitudinally positioned within a hot aisle of a datacenter, the air diffuser system including: an input port for receiving the output airflow, and an essentially-linear discharge port for discharging the output airflow in a generally upward direction to form an essentially- planar discharge airflow.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基於空氣的熱分離系統</p>  
        <p type="p">12:機架安裝的IT裝備</p>  
        <p type="p">14:電腦機架組件</p>  
        <p type="p">16:空氣循環系統</p>  
        <p type="p">18:輸入空氣</p>  
        <p type="p">20:輸出氣流</p>  
        <p type="p">22:風扇組件</p>  
        <p type="p">24:機械冷卻系統</p>  
        <p type="p">26:管道系統</p>  
        <p type="p">28:空氣擴散器系統</p>  
        <p type="p">30:箭頭</p>  
        <p type="p">32:熱通道</p>  
        <p type="p">40:箭頭</p>  
        <p type="p">42:基本上平坦的排放氣流</p>  
        <p type="p">46:廢熱</p>  
        <p type="p">48:廢熱</p>  
        <p type="p">50:進氣增壓室</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="814" publication-number="202614833"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614833.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614833</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106232</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有偶極部的半導體元件及其製備方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE WITH DIPOLE PORTION AND METHOD FOR PREPARING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250801B">H10D62/80</main-classification>  
        <further-classification edition="202501120250801B">H10D62/60</further-classification>  
        <further-classification edition="202501120250801B">H10D62/13</further-classification>  
        <further-classification edition="202501120250801B">H10D62/10</further-classification>  
        <further-classification edition="202501120250801B">H10D30/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉雨華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YU-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種半導體元件，具有一閘極結構，設置在一半導體基底上方；以及一介電層，圍繞該閘極結構。該半導體元件亦包括一源極區和一汲極區，設置在該半導體基底中並位在該閘極結構的相對側上。該半導體元件還包括一第一偶極部，設置在該半導體基底上方並覆蓋該源極區；以及一第一介電間隙子，設置在該第一偶極部上方並鄰近該介電層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a gate structure disposed over a semiconductor substrate, and a dielectric layer surrounding the gate structure. The semiconductor device also includes a source region and a drain region disposed in the semiconductor substrate and on opposite sides of the gate structure. The semiconductor device further includes a first dipole portion disposed over the semiconductor substrate and covering the source region, and a first dielectric spacer disposed over the first dipole portion and adjacent to the dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體元件</p>  
        <p type="p">101:半導體基底</p>  
        <p type="p">103:閘極介電層</p>  
        <p type="p">105:閘極電極層</p>  
        <p type="p">107:閘極結構</p>  
        <p type="p">109:介電層</p>  
        <p type="p">113a:源極區</p>  
        <p type="p">113b:汲極區</p>  
        <p type="p">115a:暈環植入區</p>  
        <p type="p">115b:暈環植入區</p>  
        <p type="p">117a:輕度摻雜區</p>  
        <p type="p">117b:輕度摻雜區</p>  
        <p type="p">121a:偶極部</p>  
        <p type="p">121b:偶極部</p>  
        <p type="p">141a:介電間隙子</p>  
        <p type="p">141b:介電間隙子</p>  
        <p type="p">143:介電層</p>  
        <p type="p">145:層間介電層</p>  
        <p type="p">151a:源極接觸件</p>  
        <p type="p">151b:汲極接觸件</p>  
        <p type="p">SW1:側壁</p>  
        <p type="p">SW2:側壁</p>  
        <p type="p">T1:上表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="815" publication-number="202614108"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614108.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614108</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106250</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於發光鍵盤之背光模組</chinese-title>  
        <english-title>BACKLIGHT MODULE FOR LIGHTING KEYBOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">H01H13/83</main-classification>  
        <further-classification edition="200601120250401B">H01H13/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達方電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DARFON ELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何信政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, HSIN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">發光鍵盤包含第一按鍵和第二按鍵，兩者之間具有按鍵間隙區。用於發光鍵盤的背光模組包括由上而下堆疊的遮光板、導光板以及燈板。燈板具有發光單元。遮光板具有對應第一按鍵的減光圖案以遮蔽光線。背光模組具有有色材料覆層，其設置於遮光板或導光板並在縱向上重疊於按鍵間隙區。發光單元之光線由導光板導引以從減光圖案旁側通過並從第一按鍵之內部透光區域向上發出第一色光。發光單元之光線更由導光板導引以經過有色材料覆層並以從第二散熱按鍵之內部透光區域和邊界向上發出不同於第一色光的第二色光。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A lighting keyboard comprises a first key and a second key, with a key gap area between them. A backlight module for the lighting keyboard comprises a lighting board, a light guide panel and a shielding sheet, which are stacked from top to bottom. The lighting board has a light-emitting unit. The shielding sheet is provided with a light-reducing pattern corresponding to the first key for blocking light. The backlight module is provided with a colored material layer disposed on the shielding sheet or the light guide panel and overlapping the key gap area in a vertical direction. The light of the light-emitting unit is guided by the light guide panel to pass through the side of the light-reducing pattern and form a first color light upward from an inner light-transmitting area of the first ey. The light of the light-emitting unit is further guided by the light guide panel to pass through the colored material layer and form a second color light different from the first color light upward from an inner light-transmitting area and a boundary of the second key.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">LKB:發光鍵盤</p>  
        <p type="p">KS-A:第一按鍵</p>  
        <p type="p">KS-B:第二按鍵</p>  
        <p type="p">KCC:鍵帽</p>  
        <p type="p">KC0:內部透光區域</p>  
        <p type="p">KC1:外部遮光區域</p>  
        <p type="p">MEM:按鍵電路板</p>  
        <p type="p">SUP:底板</p>  
        <p type="p">Sf:支撐框</p>  
        <p type="p">BLM:背光模組</p>  
        <p type="p">PC:貫穿通道</p>  
        <p type="p">SS:遮光板</p>  
        <p type="p">LRP:減光圖案</p>  
        <p type="p">MP:遮罩部分</p>  
        <p type="p">TP:透光部分</p>  
        <p type="p">LGP:導光板</p>  
        <p type="p">CML:有色材料覆層</p>  
        <p type="p">REF:反射層</p>  
        <p type="p">LCB:燈板</p>  
        <p type="p">LED:發光單元</p>  
        <p type="p">WL:第一色光</p>  
        <p type="p">CL:第二色光</p>  
        <p type="p">G:按鍵間隙區</p>  
        <p type="p">HR:發熱區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="816" publication-number="202614061"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614061.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614061</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106263</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統及記憶體系統之控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G11C16/06</main-classification>  
        <further-classification edition="200601120251001B">G11C29/52</further-classification>  
        <further-classification edition="201601120251001B">G06F12/0866</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小島広嵩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOJIMA, HIROTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>櫻田健次</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKURADA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之實施方式之記憶體系統提高資料讀出之可靠性。&lt;br/&gt;本發明之實施方式之記憶體系統具備記憶體裝置及記憶體控制器，該記憶體裝置包含連接於複數個字元線各者之複數個記憶單元，記憶體控制器獲取與連接於選擇字元線之複數個選擇單元之閾值電壓相關之第1資料，自與第1相鄰字元線連接之複數個第1相鄰單元獲取第2資料，基於上述第2資料修正上述第1資料，獲取第1修正資料，自與第2相鄰字元線連接之複數個第2相鄰單元獲取第3資料，基於上述第3資料修正上述第1修正資料，獲取第2修正資料，執行對上述第2修正資料之軟判定處理，產生來自上述複數個選擇單元之讀出資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">MCi:選擇單元</p>  
        <p type="p">MCi-1,MCi+1:相鄰單元</p>  
        <p type="p">WLi:選擇字元線</p>  
        <p type="p">WLi-1,WLi+1:相鄰字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="817" publication-number="202614757"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614757.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614757</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106303</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251027B">H10B41/20</main-classification>  
        <further-classification edition="202301120251027B">H10B43/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷川航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEGAWA, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今野拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONNO, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據一實施方式，半導體裝置具備積層膜，該積層膜係於第1方向上交替地包含複數個第1絕緣膜及複數個電極層，且包含非階梯部、及設置於上述非階梯部之第2方向上之階梯部。上述裝置進而具備包含設置於上述階梯部內之第2絕緣膜之第1支柱部。上述積層膜包含於上述第1方向上積層之複數個部分積層膜，上述第1支柱部包含分別設置於上述複數個部分積層膜內之複數個部分支柱部。上述複數個部分支柱部包含：第1部分支柱部，其於俯視時具有第1長徑與第1短徑，且上述第2方向與上述第1長徑之角度，小於上述第2方向與上述第1短徑之角度；及第2部分支柱部，其於俯視時具有第2長徑與第2短徑，且上述第2方向與上述第2長徑之角度，大於上述第2方向與上述第2短徑之角度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:積層膜</p>  
        <p type="p">2-1:下部積層膜</p>  
        <p type="p">2-2:中間積層膜</p>  
        <p type="p">2-3:上部積層膜</p>  
        <p type="p">2a:絕緣膜</p>  
        <p type="p">5-1:下部支柱部</p>  
        <p type="p">5-2:中間支柱部</p>  
        <p type="p">5-3:上部支柱部</p>  
        <p type="p">F:指狀部</p>  
        <p type="p">L1:長徑</p>  
        <p type="p">L2:短徑</p>  
        <p type="p">R2:階梯部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="818" publication-number="202614768"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614768.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614768</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106325</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251027B">H10B41/40</main-classification>  
        <further-classification edition="202301120251027B">H10B43/40</further-classification>  
        <further-classification edition="200601120251027B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西原大貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIHARA, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤弘康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, HIROYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施方式之半導體記憶裝置具備：第1積層膜，其係將複數個第1導電層與複數個第1絕緣層於第1方向上一層一層地交替積層而成，且於與第1方向交叉之第2方向、及與第1方向及第2方向交叉之第3方向上延伸；第1芯絕緣膜，其於第1方向上貫通第1積層膜，且包含氧化物；第2芯絕緣膜，其設置於第1芯絕緣膜之周圍，於第1方向上貫通第1積層膜，且包含氮化物；第3芯絕緣膜，其設置於第2芯絕緣膜之周圍，於第1方向上貫通第1積層膜，且包含氧化物；第1通道半導體膜，其設置於第3芯絕緣膜之周圍，且於第1方向上貫通第1積層膜；第1隧道絕緣膜，其設置於第1通道半導體膜之周圍，且於第1方向上貫通第1積層膜；第1電荷儲存膜，其設置於第1隧道絕緣膜之周圍，且於第1方向上貫通第1積層膜；第2積層膜，其係將複數個第2導電層與複數個第2絕緣層於第1方向上一層一層地交替積層而成，且於第2方向及第3方向上延伸；第4芯絕緣膜，其於第1方向上貫通第2積層膜，且包含氧化物；第2通道半導體膜，其設置於第4芯絕緣膜之周圍，且於第1方向上貫通第1積層膜；第2隧道絕緣膜，其設置於第2通道半導體膜之周圍，且於第1方向上貫通第2積層膜；及第2電荷儲存膜，其設置於第2隧道絕緣膜之周圍，且於第1方向上貫通第2積層膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30A:導電層</p>  
        <p type="p">31:導電層</p>  
        <p type="p">33:導電層</p>  
        <p type="p">34:導電層</p>  
        <p type="p">35:導電構件</p>  
        <p type="p">36:第1導電層</p>  
        <p type="p">37:第2導電層</p>  
        <p type="p">41:第1積層膜</p>  
        <p type="p">42:第2積層膜</p>  
        <p type="p">50:絕緣層</p>  
        <p type="p">53:絕緣層</p>  
        <p type="p">54:絕緣層</p>  
        <p type="p">55:絕緣層</p>  
        <p type="p">57:第1絕緣層</p>  
        <p type="p">58:絕緣層</p>  
        <p type="p">59:第2絕緣層</p>  
        <p type="p">75:導電構件</p>  
        <p type="p">76:導電構件</p>  
        <p type="p">80:第4芯絕緣膜</p>  
        <p type="p">81:第2通道半導體膜</p>  
        <p type="p">82:第2隧道絕緣膜</p>  
        <p type="p">83:第2電荷儲存膜</p>  
        <p type="p">84:第2阻擋絕緣膜</p>  
        <p type="p">90:第1芯絕緣膜</p>  
        <p type="p">91:第1通道半導體膜</p>  
        <p type="p">92:第1隧道絕緣膜</p>  
        <p type="p">93:第1電荷儲存膜</p>  
        <p type="p">94:第1阻擋絕緣膜</p>  
        <p type="p">96:第2芯絕緣膜</p>  
        <p type="p">97:第3芯絕緣膜</p>  
        <p type="p">110:記憶胞陣列</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">JT:接合部</p>  
        <p type="p">LMP:下部記憶體柱</p>  
        <p type="p">MP:記憶體柱</p>  
        <p type="p">MT0~MT7:記憶胞電晶體</p>  
        <p type="p">SGD:第1選擇閘極線</p>  
        <p type="p">SGS:第2選擇閘極線</p>  
        <p type="p">SHE:構件</p>  
        <p type="p">SL:源極線</p>  
        <p type="p">ST1,ST2:選擇電晶體</p>  
        <p type="p">SU0~SU3:串組件</p>  
        <p type="p">UMP:上部記憶體柱</p>  
        <p type="p">WL0~WL7:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="819" publication-number="202614434"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614434.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614434</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106340</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>互連結構及其形成方法</chinese-title>  
        <english-title>INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250703B">H01L23/528</main-classification>  
        <further-classification edition="200601120250703B">H01L21/768</further-classification>  
        <further-classification edition="200601120250703B">H01L21/3215</further-classification>  
        <further-classification edition="200601120250703B">H01L21/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭家邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHIA-PANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥均</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YEN-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉仁偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江明洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, MING-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁政輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, CHENG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種互連結構包括設置於第一介電層中的第一導電結構、設置於第一介電層上方的第二介電層，以及設置於該第二介電層中及該第一導電結構上方的第二導電結構。第一導電結構包括第一阻障層及第一主導電層。第二導電結構包括第二阻障層、第二主導電層以及第三導電材料。第二阻障層包括選自Ru或Mo的第一導電材料。第二主導電層設置於第二阻障層上方且包括第二導電材料。第三導電材料作為摻雜於第二主導電層中的摻雜劑或作為第二主導電層與第二阻障層之間的連續層，第三導電材料選自Mn、Ti、Co、Ru、Al、Zn、In或其組合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In some embodiments, an interconnect structure includes a first conductive structure disposed in a first dielectric layer, wherein the first conductive structure includes a first barrier layer and a first main conductive layer; a second dielectric layer disposed over the first dielectric layer; and a second conductive structure disposed in the second dielectric layer and over the first conductive structure, wherein the second conductive structure includes: a second barrier layer including a first conductive material selected from Ru or Mo; a second main conductive layer disposed over the second barrier layer and including a second conductive material; and a third conductive material being a dopant doped in the second main conductive layer or being a continuous layer between the second main conductive layer and the second barrier layer, wherein the third conductive material is selected from Mn, Ti, Co, Ru, Al, Zn, In, or combinations thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301:第一介電層</p>  
        <p type="p">308:第一導電結構</p>  
        <p type="p">310:第一阻障層</p>  
        <p type="p">312:第一主導電層</p>  
        <p type="p">314:蝕刻終止層</p>  
        <p type="p">314a:第一層</p>  
        <p type="p">314b:第二層</p>  
        <p type="p">316:第二介電層</p>  
        <p type="p">328:第二阻障層</p>  
        <p type="p">354、354a、354b:蝕刻終止層</p>  
        <p type="p">356:第三介電層</p>  
        <p type="p">670:第一阻障帽</p>  
        <p type="p">672:第二阻障帽</p>  
        <p type="p">700:互連結構</p>  
        <p type="p">732:第二主導電層</p>  
        <p type="p">734:第二導電結構</p>  
        <p type="p">734a:第一鑲嵌結構</p>  
        <p type="p">734b:第二鑲嵌結構</p>  
        <p type="p">736:導電通孔</p>  
        <p type="p">738:導電線</p>  
        <p type="p">760:金屬襯裡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="820" publication-number="202613719"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613719.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613719</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106452</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>乾式蝕刻遮罩用組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G03F7/11</main-classification>  
        <further-classification edition="200601120251229B">C07C53/06</further-classification>  
        <further-classification edition="200601120251229B">C07C53/10</further-classification>  
        <further-classification edition="200601120251229B">C07C53/126</further-classification>  
        <further-classification edition="200601120251229B">C07C57/04</further-classification>  
        <further-classification edition="200601120251229B">C07C59/08</further-classification>  
        <further-classification edition="200601120251229B">C07C59/105</further-classification>  
        <further-classification edition="200601120251229B">G03F7/40</further-classification>  
        <further-classification edition="200601120251229B">C23C28/00</further-classification>  
        <further-classification edition="200601120251229B">H05K3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商巴川集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMOEGAWA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白鳥仁朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRATORI, KIMIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤昌央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATOU, MASAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種關於乾式蝕刻遮罩用組成物的技術，該乾式蝕刻遮罩用組成物能夠形成蝕刻耐性提升的遮罩(阻劑)。&lt;br/&gt;本發明的一態樣是一種乾式蝕刻遮罩用組成物。該乾式蝕刻遮罩用組成物包含有機金屬鹽及極性溶劑。乾燥時的前述有機金屬鹽相對於固形成分整體的含率為90質量%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="821" publication-number="202613780"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613780.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613780</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106473</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體系統中的功率管理引擎</chinese-title>  
        <english-title>POWER MANAGEMENT ENGINE IN A SEMICONDUCTOR SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251230B">G06F1/324</main-classification>  
        <further-classification edition="200601120251230B">G06F1/10</further-classification>  
        <further-classification edition="200601120251230B">G06F1/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商微軟技術授權有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICROSOFT TECHNOLOGY LICENSING, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肯西　巴薩法拉哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANTHI, BASAVARAJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>札哈吉爾達　聖吉夫Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAHAGIRDAR, SANJEEV S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了使用半導體系統的功率管理引擎來提供功率管理的方法、系統及裝置。功率管理可指涉與半導體部件（例如，小晶片）相關聯的功率管理技術。該功率管理引擎支援監測功率使用情況，以及動態調整功率相關參數，以滿足小晶片的效能要求。特定言之，該功率管理引擎支援積體電路中小晶片之間的異步電壓驟降偵測，其中異步偵測表示個別小晶片在不同的時間或以不同的速率來偵測驟降事件，而沒有同步。在操作中，在第一小晶片的第一驟降偵測器處，監測與第一小晶片及第二小晶片的共享電源相關聯的電壓位準。偵測觸發第一時鐘調變賦能訊號的第一電壓驟降。將該第一時鐘調變賦能訊號傳送至具有第二驟降偵測器的第二小晶片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods, systems, and devices for providing power management using a power management engine of a semiconductor system are described. Power management can refer to power management techniques associated with a semiconductor component (e.g., chiplet). The power management engine supports monitoring power usage and dynamically adjusting power- related parameters to meet a chiplet’s performance requirements. In particular, the power management engine supports asynchronous voltage droop detection among chiplets in an integrated circuit, where asynchronous detection denotes that droop events are detected at different times or rates by individual chiplets, without being synchronized. In operation, voltage levels associated with a shared power supply of the first chiplet and a second chiplet are monitored at a first droop detector of a first chiplet. A first voltage droop that triggers a first clock modulation enable signal is detected. The first clock modulation enable signal is communicated to the second chiplet having a second droop detector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:半導體系統</p>  
        <p type="p">902:VCC</p>  
        <p type="p">910:基底晶粒</p>  
        <p type="p">920A:小晶片</p>  
        <p type="p">920B:小晶片</p>  
        <p type="p">930A:驟降偵測器</p>  
        <p type="p">930B:驟降偵測器</p>  
        <p type="p">940A:分頻器</p>  
        <p type="p">940B:分頻器</p>  
        <p type="p">950A:PLL</p>  
        <p type="p">950B:PLL</p>  
        <p type="p">960A:V限值</p>  
        <p type="p">960B:V限值</p>  
        <p type="p">970A:EN1</p>  
        <p type="p">970B:EN2</p>  
        <p type="p">972A:旁路DD1</p>  
        <p type="p">972B:旁路DD2</p>  
        <p type="p">974A:旁路EN2</p>  
        <p type="p">974B:旁路EN1</p>  
        <p type="p">980A:</p>  
        <p type="p">980B:</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="822" publication-number="202614062"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614062.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614062</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106490</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置、記憶體系統、半導體記憶裝置之控制方法</chinese-title>  
        <english-title>SEMICONDUCTOR STORAGE DEVICE, MEMORY SYSTEM, AND METHOD FOR CONTROLLING SEMICONDUCTOR STORAGE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250811B">G11C16/06</main-classification>  
        <further-classification edition="200601120250811B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金澤翔平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANAZAWA, SHOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊崎規泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAZAKI, NORIYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桶田修平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKETA, SHUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新名直也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMMYO, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體記憶裝置，其能夠提昇區塊效率。 &lt;br/&gt;本發明之半導體記憶裝置具備第1記憶體面及第2記憶體面、信號線、判定電路及控制部。信號線對與第1記憶體面之第1區塊之第1記憶胞電晶體連接之第1字元線、及與第2記憶體面之第2區塊之第2記憶胞電晶體連接之第2字元線施加電壓。判定電路基於信號線之電壓來判定第1字元線及第2字元線是否產生漏電。控制部基於判定電路之判定結果，將第1區塊登記為壞塊，並且將第2區塊登記為能夠用作為好塊之受損區塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor storage device includes a first plane and a second plane, a signal line, a determination circuit, and a control unit. The signal line applies voltages to a first word line connected to a first memory cell transistor in a first block of the first plane and a second word line connected to a second memory cell transistor in a second block of the second plane. The determination circuit determines based on a voltage of the signal line whether there is any leakage in the first word line or the second word line. Based on determination results of the determination circuit, the control unit registers the first block as a bad block and registers the second block as a victim block able to be used as a good block.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:半導體記憶裝置</p>  
        <p type="p">21:輸入輸出電路</p>  
        <p type="p">22:邏輯控制電路</p>  
        <p type="p">31:輸入輸出用焊墊群</p>  
        <p type="p">32:邏輯控制用焊墊群</p>  
        <p type="p">33:電源輸入用端子群</p>  
        <p type="p">41:定序器(控制部)</p>  
        <p type="p">42:暫存器</p>  
        <p type="p">43:電壓供給電路</p>  
        <p type="p">44:記憶體面控制電路</p>  
        <p type="p">110:記憶胞陣列</p>  
        <p type="p">120:感測放大器</p>  
        <p type="p">130:列解碼器</p>  
        <p type="p">210:記憶胞陣列</p>  
        <p type="p">220:感測放大器</p>  
        <p type="p">230:列解碼器</p>  
        <p type="p">ALE:位址鎖存賦能信號</p>  
        <p type="p">BLK(0),BLK(1),…,BLK(n-1):區塊</p>  
        <p type="p">CLE:指令鎖存賦能信號</p>  
        <p type="p">DQ&amp;lt;7：0&amp;gt;:信號</p>  
        <p type="p">DQS,/DQS:資料選通信號</p>  
        <p type="p">PL0:記憶體面(第1記憶體面)</p>  
        <p type="p">PL1:記憶體面(第2記憶體面)</p>  
        <p type="p">R/B:就緒/忙碌信號</p>  
        <p type="p">RE,/RE:讀出賦能信號</p>  
        <p type="p">Vcc,VccQ,Vpp:電源電壓</p>  
        <p type="p">Vss:接地電壓</p>  
        <p type="p">/CE:晶片賦能信號</p>  
        <p type="p">/WE:寫入賦能信號</p>  
        <p type="p">/WP:寫入保護信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="823" publication-number="202612582"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612582.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612582</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106538</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測量表面上之雨量之總成</chinese-title>  
        <english-title>AN ASSEMBLY FOR MEASURING AN AMOUNT OF RAIN ON A SURFACE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">A01G25/00</main-classification>  
        <further-classification edition="200601120251230B">G01W1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商胡斯華納有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUSQVARNA AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅克爾　馬汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERKLE, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯道夫　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUDOLF, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於測量一表面 &lt;b&gt;(200)&lt;/b&gt;上之一雨量之總成 &lt;b&gt;(100)&lt;/b&gt;，其包含：一壓電元件 &lt;b&gt;(500)&lt;/b&gt;；一評估電子設備 &lt;b&gt;(700)&lt;/b&gt;；及該表面 &lt;b&gt;(200)&lt;/b&gt;，其具有一第一側 &lt;b&gt;(202)&lt;/b&gt;以及與該第一側 &lt;b&gt;(202)&lt;/b&gt;相對的一第二側 &lt;b&gt;(204)&lt;/b&gt;，其中該第二側 &lt;b&gt;(204)&lt;/b&gt;暴露於至少一個雨滴 &lt;b&gt;(R)&lt;/b&gt;。該總成 &lt;b&gt;(100)&lt;/b&gt;的特徵在於：該壓電元件 &lt;b&gt;(500)&lt;/b&gt;與該表面 &lt;b&gt;(200)&lt;/b&gt;之該第一側 &lt;b&gt;(202)&lt;/b&gt;直接接觸，使得該至少一個雨滴 &lt;b&gt;(R)&lt;/b&gt;打擊該第二側 &lt;b&gt;(204)&lt;/b&gt;的一結構傳導聲音可由該壓電元件 &lt;b&gt;(500)&lt;/b&gt;偵測到。該壓電元件 &lt;b&gt;(500)&lt;/b&gt;進一步連接至該評估電子設備 &lt;b&gt;(700)&lt;/b&gt;，其中該壓電元件 &lt;b&gt;(500)&lt;/b&gt;產生一電信號，該電信號表示偵測到該至少一個雨滴 &lt;b&gt;(R)&lt;/b&gt;，且其中該電信號發送至該評估電子設備 &lt;b&gt;(700)&lt;/b&gt;，以評估該表面 &lt;b&gt;(200)&lt;/b&gt;上之該雨量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An assembly &lt;b&gt;(100)&lt;/b&gt;for measuring an amount of rain on a surface &lt;b&gt;(200)&lt;/b&gt;comprises a piezo-electrical element &lt;b&gt;(500)&lt;/b&gt;; an evaluation electronics &lt;b&gt;(700)&lt;/b&gt;; and the surface &lt;b&gt;(200)&lt;/b&gt;having a first side &lt;b&gt;(202)&lt;/b&gt;, and a second side &lt;b&gt;(204)&lt;/b&gt;opposite to the first side &lt;b&gt;(202)&lt;/b&gt;, wherein the second side &lt;b&gt;(204)&lt;/b&gt;is exposed to at least one rain drop &lt;b&gt;(R)&lt;/b&gt;. The assembly &lt;b&gt;(100)&lt;/b&gt;is characterized in that the piezo-electrical element &lt;b&gt;(500)&lt;/b&gt;is in direct contact with the first side &lt;b&gt;(202)&lt;/b&gt;of the surface &lt;b&gt;(200)&lt;/b&gt;such that a structure-borne sound of the at least one rain drop &lt;b&gt;(R)&lt;/b&gt;hitting the second side &lt;b&gt;(204)&lt;/b&gt;is detectable by the piezo-electrical element &lt;b&gt;(500)&lt;/b&gt;. The piezo-electrical element &lt;b&gt;(500)&lt;/b&gt;is further connected to the evaluation electronics &lt;b&gt;(700)&lt;/b&gt;, wherein the piezo-electrical element &lt;b&gt;(500)&lt;/b&gt;generates an electrical signal representative for the detection of the at least one rain drop &lt;b&gt;(R)&lt;/b&gt;, and wherein the electrical signal is sent to the evaluation electronics &lt;b&gt;(700)&lt;/b&gt;for evaluating the amount of rain on the surface &lt;b&gt;(200)&lt;/b&gt;.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:總成</p>  
        <p type="p">200:表面</p>  
        <p type="p">202:第一側</p>  
        <p type="p">204:第二側</p>  
        <p type="p">300:園藝裝置/灌溉裝置</p>  
        <p type="p">310:外表面</p>  
        <p type="p">500:壓電元件</p>  
        <p type="p">600:支撐結構/PCB</p>  
        <p type="p">700:評估電子設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="824" publication-number="202614276"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614276.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614276</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106642</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>端效器、後端機器人、及基板處理設備</chinese-title>  
        <english-title>END EFFECTOR, BACKEND ROBOT, AND SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L21/67</main-classification>  
        <further-classification edition="200601120251229B">H01L21/687</further-classification>  
        <further-classification edition="200601120251229B">B25J9/04</further-classification>  
        <further-classification edition="200601120251229B">B25J15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水澤憲司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUSAWA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>段村祐貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAMMURA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諏訪田雅栄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUWADA, MASAEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所呈現者係一種用於在一基板處理系統中輸送一基板之端效器。該端效器包含：一槳件，該槳件經組態以支撐一基板，且該槳件係平坦的；一刀片部分，該刀片部分在該槳件之一第一端處經連接至該槳件，其中該刀片部分的一遠端具備用於定位一基板之一前突出部；及複數個墊件，該等墊件經設置在複數個孔中之各者中，其中該等墊件在輸送該基板時接觸該基板，且其中該等孔經設置在該槳件及該刀片部分中。端效器可允許該等墊件傾斜，使得基板不會黏附。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An end effector used for transporting a substrate in a substrate processing system is presented. The end effector comprises a paddle configured to support a substrate and the paddle being flat; a blade part connected to the paddle at a first end of the paddle, wherein a distal end of the blade part is provided with a front protrusion for positioning a substrate; and a plurality of pads disposed in each of a plurality of holes, wherein the plurality of pads contact the substrate when transporting the substrate and wherein the plurality of holes are disposed in the paddle and the blade part. The end effectors may allow tilting of the pads so that substrates would not stick.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300A:端效器</p>  
        <p type="p">310:槳件</p>  
        <p type="p">320:刀片部分</p>  
        <p type="p">320a,320b:刀片</p>  
        <p type="p">321a,321b:前突出部/突出部</p>  
        <p type="p">330:接頭區段</p>  
        <p type="p">340:墊件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="825" publication-number="202614053"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614053.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614053</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106676</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">G11C11/4074</main-classification>  
        <further-classification edition="200601120250902B">G11C11/4096</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤朋彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, TOMOHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能抑制漏電流之半導體裝置。 本發明之半導體裝置包含：第1電源線，其被供給第1電壓；第2電源線，其被供給較第1電壓低之第2電壓；第1邏輯電路，其包含第1電極，且與第1電源線電性連接；第2邏輯電路，其包含與第1電極相隔而設之第2電極，且與第1電源線及第1邏輯電路電性連接；電壓供給電路，其藉由第1控制信號，對是否向第1電極供給較第1電壓低且較第2電壓高之第3電壓進行控制；及第1電晶體，其具有供輸入第2控制信號之閘極電極，且電性連接於第2電極與第2電源線之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">24:定序器</p>  
        <p type="p">200A:內部電路</p>  
        <p type="p">202:第1電源線</p>  
        <p type="p">204:第2電源線</p>  
        <p type="p">206:第1電極</p>  
        <p type="p">208:第2電極</p>  
        <p type="p">210:佈線</p>  
        <p type="p">212:佈線</p>  
        <p type="p">218:佈線</p>  
        <p type="p">220:佈線</p>  
        <p type="p">300A:漏電流消減電路</p>  
        <p type="p">310:邏輯電路</p>  
        <p type="p">320:邏輯電路</p>  
        <p type="p">330:邏輯電路</p>  
        <p type="p">340:邏輯電路</p>  
        <p type="p">350A:電壓供給電路</p>  
        <p type="p">410:電晶體</p>  
        <p type="p">412:閘極電極</p>  
        <p type="p">414:第1電極</p>  
        <p type="p">416:第2電極</p>  
        <p type="p">420:電晶體</p>  
        <p type="p">422:閘極電極</p>  
        <p type="p">424:第1電極</p>  
        <p type="p">426:第2電極</p>  
        <p type="p">430:電晶體</p>  
        <p type="p">432:閘極電極</p>  
        <p type="p">434:第1電極</p>  
        <p type="p">436:第2電極</p>  
        <p type="p">440:電晶體</p>  
        <p type="p">442:閘極電極</p>  
        <p type="p">444:第1電極</p>  
        <p type="p">446:第2電極</p>  
        <p type="p">450:電晶體</p>  
        <p type="p">452:閘極電極</p>  
        <p type="p">454:第1電極</p>  
        <p type="p">456:第2電極</p>  
        <p type="p">510:電晶體</p>  
        <p type="p">512:閘極電極</p>  
        <p type="p">514:第1電極</p>  
        <p type="p">516:第2電極</p>  
        <p type="p">520:電晶體</p>  
        <p type="p">522:閘極電極</p>  
        <p type="p">524:第1電極</p>  
        <p type="p">526:第2電極</p>  
        <p type="p">530:電晶體</p>  
        <p type="p">532:閘極電極</p>  
        <p type="p">534:第1電極</p>  
        <p type="p">536:第2電極</p>  
        <p type="p">540:電晶體</p>  
        <p type="p">542:閘極電極</p>  
        <p type="p">544:第1電極</p>  
        <p type="p">546:第2電極</p>  
        <p type="p">IN1:輸入端子</p>  
        <p type="p">IN2:輸入端子</p>  
        <p type="p">IN3:輸入端子</p>  
        <p type="p">IN4:輸入端子</p>  
        <p type="p">OUT1:輸出端子</p>  
        <p type="p">OUT2:輸出端子</p>  
        <p type="p">OUT3:輸出端子</p>  
        <p type="p">OUT4:輸出端子</p>  
        <p type="p">OD:控制信號</p>  
        <p type="p">S1:控制信號</p>  
        <p type="p">S2:控制信號</p>  
        <p type="p">S5:控制信號</p>  
        <p type="p">VDD:電壓</p>  
        <p type="p">VSS:電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="826" publication-number="202614241"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614241.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614241</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106679</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">H01L21/60</main-classification>  
        <further-classification edition="200601120250902B">H01L23/49</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小栗宜大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGURI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠確保導線間之間隙之半導體裝置及其製造方法。&lt;br/&gt;根據一實施方式，半導體裝置具備配線基板、第1半導體元件、第2半導體元件、第1導線、及第2導線。配線基板設置有具備第1部分及第2部分之電極，該第2部分係與第1部分之間具有階差，且距基底層之高度較第1部分高。第1半導體元件配置於配線基板上。第2半導體元件配置於第1半導體元件上。第1導線之一端連接於第1部分上之第1連接點，另一端連接於第1半導體元件。第2導線之一端連接於第2部分上之第2連接點，另一端連接於第2半導體元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體裝置</p>  
        <p type="p">2:配線基板</p>  
        <p type="p">6:密封層</p>  
        <p type="p">7:凸塊電極</p>  
        <p type="p">21:配線層</p>  
        <p type="p">22:配線層</p>  
        <p type="p">23:層間絕緣膜</p>  
        <p type="p">24:阻焊膜</p>  
        <p type="p">31:第1半導體元件</p>  
        <p type="p">32:第2半導體元件</p>  
        <p type="p">41:第1導線</p>  
        <p type="p">41a:一端</p>  
        <p type="p">41b:另一端</p>  
        <p type="p">42:第2導線</p>  
        <p type="p">42a:一端</p>  
        <p type="p">42b:另一端</p>  
        <p type="p">51:第1導電層</p>  
        <p type="p">52:第2導電層</p>  
        <p type="p">211:指狀電極</p>  
        <p type="p">211a:上層部</p>  
        <p type="p">221b:下層部</p>  
        <p type="p">ST:階差</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="827" publication-number="202613382"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613382.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613382</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106729</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>橋樑防塌緩衝鏈條</chinese-title>  
        <english-title>ANTI-FALLING BUFFER CHAIN FOR BRIDGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">E01D19/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商休邦得建設股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHO-BOND CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商昭和機械商事股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHOWA KIKAI SHOJI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商柴田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBATA INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹村浩志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEMURA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木雄飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, YUHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>太田翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTA, SHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂田繁之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKATA, SHIGEYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉地大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KICHIJI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村佳樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, YOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種橋樑防塌緩衝鏈條，衝擊荷重作用時可以防止應力集中於環彼此之間的接觸部分。&lt;br/&gt;[技術內容]一種橋樑防塌緩衝鏈條(1)，將橋橫樑等的橋樑上部構造體及橋台和橋腳等的橋樑下部構造體連結，防止橋樑上部構造體塌下，具備：由複數環彼此連結而成的環連結體(2)、及將前述環連結體(2)周圍被覆的被覆體(3)，環連結體(2)，除了端部的端部環(21a(21b))的一部分以外，由橡膠彈性體被覆，端部環(21a(21b))是與相鄰接的鄰接環(22a(22b))接觸，端部環(21a(21b))及鄰接環(22a(22b))一方或雙方的環的環形鋼材的線徑被設定成比環連結體(2)的其他的環的環形鋼材的線徑更大。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:橋樑防塌緩衝鏈條</p>  
        <p type="p">2:環連結體</p>  
        <p type="p">3:被覆體</p>  
        <p type="p">3a:端面</p>  
        <p type="p">21a:端部環(鏈條A)</p>  
        <p type="p">21b:端部環(鏈條A)</p>  
        <p type="p">22a:鄰接環(鏈條B)</p>  
        <p type="p">22b:鄰接環(鏈條B)</p>  
        <p type="p">23~27:中間環</p>  
        <p type="p">D2:間隙</p>  
        <p type="p">D3:間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="828" publication-number="202612821"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612821.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612821</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106742</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透過連續磨削加工預先定位工件的方法及對應的齒輪加工機</chinese-title>  
        <english-title>METHOD FOR MACHINING PRE-TOOTHED WORKPIECES BY CONTINUOUS GENERATING GRINDING AND CORRESPONDING GEAR CUTTING MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">B23F5/02</main-classification>  
        <further-classification edition="200601120251230B">B23F23/12</further-classification>  
        <further-classification edition="200601120251230B">B23Q15/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商瑞絲浩爾公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REISHAUER AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪茨　克里斯提安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIETZ, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示了一種透過利用一磨削蝸桿（100）進行連續展成磨削來加工預先定位工件之方法。修整該磨削蝸桿，並且利用該經修整磨削蝸桿加工工件。對於各磨削衝程，在蝸桿螺紋側腹上存在一接觸區（104、104'），在該接觸區中，該磨削蝸桿與該工件加工接合。各接觸區包含一品質界定區域。該等接觸區中之至少一些之該等品質界定區域經配置成不與所有其他接觸區之該等品質界定區域重疊，並且各工件在至少一個磨削衝程中利用其品質界定區域自修整以來尚未用於加工另一工件之一經解耦接觸區進行加工。亦揭示了一種對應設計之齒輪加工機。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for machining pre-toothed workpieces by continuous generating grinding with a grinding worm (100) is disclosed. The grinding worm is dressed, and workpieces are machined with the dressed grinding worm. For each grinding stroke, there is a contact zone (104, 104') on the worm thread flanks in which the grinding worm comes into machining engagement with the workpiece. Each contact zone comprises a quality-defining area. The quality-defining areas of at least some of the contact zones are arranged without overlapping with the quality-defining areas of all other contact zones, and each workpiece is machined in at least one grinding stroke with a decoupled contact zone whose quality-defining area has not yet been used for machining another workpiece since dressing. Also disclosed is a correspondingly designed gear cutting machine.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:蝸桿螺紋側腹</p>  
        <p type="p">104:接觸區</p>  
        <p type="p">104':接觸區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="829" publication-number="202614601"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614601.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614601</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106828</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通訊設定裝置及機器人控制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251230B">H04L47/25</main-classification>  
        <further-classification edition="200601120251230B">H04Q9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤友樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之通訊設定裝置具備：封包量計算部，其計算機器人控制裝置與外部機器之間之連接中之封包量；及通訊週期設定部，其根據由封包量計算部計算出之封包量，設定與連接相關之通訊週期。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:通訊設定裝置</p>  
        <p type="p">2:通訊控制部</p>  
        <p type="p">11:封包量計算部</p>  
        <p type="p">12:通訊週期設定部</p>  
        <p type="p">21:記憶部</p>  
        <p type="p">22:第1臨時設定部</p>  
        <p type="p">23:第2臨時設定部</p>  
        <p type="p">24:確定部</p>  
        <p type="p">31:PLC</p>  
        <p type="p">32:I/O模組</p>  
        <p type="p">100:機器人控制裝置</p>  
        <p type="p">200:機器人</p>  
        <p type="p">300:機器人教示操作盤</p>  
        <p type="p">400:外部機器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="830" publication-number="202613006"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613006.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613006</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106832</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>材料盒校準裝置及用於校準材料盒之方法</chinese-title>  
        <english-title>MATERIAL BOX CALIBRATION DEVICE AND METHOD FOR CALIBRATING MATERIAL BOX</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250909B">B65G43/08</main-classification>  
        <further-classification edition="200601120250909B">B65G47/22</further-classification>  
        <further-classification edition="200601120250909B">G05B19/19</further-classification>  
        <further-classification edition="200601120250909B">G05B19/401</further-classification>  
        <further-classification edition="200601120250909B">G05B19/406</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商達邇科技（成都）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIODES TECHNOLOGY (CHENGDU) COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海凱虹科技電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIODES SHANGHAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海凱虹電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI KAIHONG ELECTRONIC COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAN, JIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請揭示一種材料盒校準裝置及用於校準材料盒之方法。材料盒校準裝置包括外檢具及內檢具。外檢具形成有偵測孔。內檢具之至少一側固設有梳形板且其餘側設有偵測面，梳形板形成有若干偵測齒。當材料盒穿過偵測孔時，外檢具用於檢驗材料盒之外側面是否與偵測孔之內側面相吻合，若是，則材料盒之外側面合格；若否，則材料盒之外側面不合格。當內檢具穿過材料盒時，內檢具用於檢驗全部偵測齒是否一一對應地穿過材料盒之全部卡料槽，並用於檢驗全部偵測面是否皆與材料盒之內側面相吻合；若皆為是，則材料盒之內側面合格；否則，材料盒之內側面不合格。本發明僅需要使材料盒分別通過外檢具及內檢具即可，檢驗精度及檢驗效率皆較高，能高效且準確地校驗材料盒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a material box calibration device and a method for calibrating a material box. The material box calibration device includes an external inspection tool and an internal inspection tool. The external inspection tool is provided with a detecting hole. At least one side of the internal inspection tool is fixedly provided with a comb-shaped plate and the other sides of the internal inspection tool are provided with detecting surfaces, and the comb-shaped plate is provided with multiple detecting teeth. When a material box passes through the detecting hole, the external inspection tool is configured to check whether an outer side surface of the material box is consistent with an inner side surface of the detecting hole. In response to the outer side surface of the material box being consistent with the inner side surface of the detecting hole, the outer side surface of the material box is qualified. In response to the outer side surface of the material box being not consistent with the inner side surface of the detecting hole, the outer side surface of the material box is unqualified. When the internal inspection tool passes through the material box, the internal inspection tool is configured to check whether all the detecting teeth pass through all material slots of the material box one by one, and to check whether all detecting surfaces are consistent with the inner side surface of the material box. In response to all the detecting teeth passing through all material slots of the material box one by one and all detecting surfaces being consistent with the inner side surface of the material box, the inner side surface of the material box is qualified. Otherwise, the inner side surface of the material box is unqualified.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">01:材料盒</p>  
        <p type="p">1:外檢具</p>  
        <p type="p">2:內檢具</p>  
        <p type="p">3:清洗輸送帶</p>  
        <p type="p">5:接料平台</p>  
        <p type="p">6:檢具驅動缸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="831" publication-number="202613717"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613717.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613717</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106883</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光阻結構、包含該光阻結構的半導體元件及其製造方法</chinese-title>  
        <english-title>PHOTORESIST STRUCTURE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND METHOD FOR FABRICATING THE SEMICONDUCTOR DEVICE COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250401B">G03F7/027</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瀚樑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HAN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周子喻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, TZU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種光阻結構、包括該光阻結構的半導體元件、以及包括該光阻結構的該半導體元件的製備方法。該光阻結構包括一下光阻層；以及位在該下光阻層上的一上光阻層。該上光阻層的一熱膨脹係數大於該下光阻層的一熱膨脹係數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a photoresist structure, a semiconductor device including the photoresist structure, and a method for fabricating the semiconductor device including the photoresist structure. The photoresist structure includes a bottom photoresist layer; a top photoresist layer positioned on the bottom photoresist layer. A coefficient of thermal expansion of the top photoresist layer is greater than a coefficient of thermal expansion of the bottom photoresist layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體元件</p>  
        <p type="p">101:基底</p>  
        <p type="p">103:下層</p>  
        <p type="p">103TS:上表面</p>  
        <p type="p">200:光阻結構</p>  
        <p type="p">210:下光阻層</p>  
        <p type="p">210S:側壁</p>  
        <p type="p">220:上光阻層</p>  
        <p type="p">310:間隙子</p>  
        <p type="p">311:下橫向部</p>  
        <p type="p">311S:側壁</p>  
        <p type="p">313:上橫向部</p>  
        <p type="p">313S:側壁</p>  
        <p type="p">RC1:凹陷</p>  
        <p type="p">T1:厚度</p>  
        <p type="p">T2:厚度</p>  
        <p type="p">W1:寬度</p>  
        <p type="p">W2:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="832" publication-number="202614052"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614052.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614052</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106887</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250716B">G11C11/401</main-classification>  
        <further-classification edition="200601120250716B">G11C11/409</further-classification>  
        <further-classification edition="200601120250716B">G11C11/4091</further-classification>  
        <further-classification edition="202301120250716B">H10B12/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木知嶺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, TOMONE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和田政春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WADA, MASAHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">第1以及第2逆變器，係被連接於第1、第2節點之間。第1逆變器，係包含有被與第3節點作連接之第3電晶體。第2逆變器，係包含有被與第4節點作連接之第5電晶體。第6電晶體，係被與第5電晶體之閘極以及第3節點作連接。第7電晶體，係被與第3電晶體之閘極以及第4節點作連接。第8電晶體，係被與第3電晶體之閘極以及第3節點作連接。第9電晶體，係被與第5電晶體之閘極以及第4節點作連接。在第1時刻處，第6以及第7電晶體之閘極之電壓係被降低，在第2時刻處，第8以及第9電晶體之電壓係被降低，在第3時刻處，係被形成有於第1以及第2節點處而被施加有第1以及第2電壓之狀態，在第1時刻之後且較第3時刻而更之前，第6以及第7電晶體之閘極之電壓係被提高。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">19:感測放大器</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">&lt;sup&gt;－&lt;/sup&gt;BL:互補位元線</p>  
        <p type="p">EQ:訊號</p>  
        <p type="p">ISO:訊號</p>  
        <p type="p">IV1:逆變器電路</p>  
        <p type="p">IV2:逆變器電路</p>  
        <p type="p">NBP:節點</p>  
        <p type="p">OC:訊號</p>  
        <p type="p">SAC:感測放大器電路</p>  
        <p type="p">SAc:節點</p>  
        <p type="p">SAN:節點</p>  
        <p type="p">SAP:節點</p>  
        <p type="p">SAt:節點</p>  
        <p type="p">TN1~TN6:n型之MOSFET</p>  
        <p type="p">TN11:電晶體</p>  
        <p type="p">TN12:電晶體</p>  
        <p type="p">TP1:p型之MOSFET</p>  
        <p type="p">TP2:p型之MOSFET</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="833" publication-number="202614042"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614042.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614042</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106889</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有增厚層的半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE WITH THICKENING LAYER AND METHOD FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250307B">G11C7/18</main-classification>  
        <further-classification edition="200601120250307B">G11C8/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇國輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, KUO-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請揭露半導體裝置及其製造方法。半導體裝置包含基底，包括源極區和汲極區；字元線結構，包含基底內且包含U形輪廓的字元線介電層、字元線介電層上且在基底中的字元線導電層，和字元線導電層上的字元線蓋層；頂部增厚層，包含U形輪廓，在字元線導電層與字元線蓋層之間且在字元線介電層與字元線蓋層之間；底部蓋層，在基底上且相鄰字元線介電層；頂部蓋層，覆蓋底部蓋層和字元線結構；位元線，穿過頂部蓋層和底部蓋層並延伸進入源極區；和單元接觸，穿過頂部蓋層和底部蓋層並延伸進入汲極區。頂部增厚層之頂面與字元線介電層之頂面共平面，且高於基底之頂面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a semiconductor device and a method for fabricating the same. The semiconductor device includes a substrate comprising a source region and a drain region; a word line structure including a word line dielectric layer in the substrate and including a U-shaped profile, a word line conductive layer on the word line dielectric layer and within the substrate, and a word line capping layer on the word line conductive layer; a top thickening layer including a U-shaped profile, between the word line conductive layer and the word line capping layer, and between the word line dielectric layer and the word line capping layer; a bottom capping layer on the substrate and adjacent to the word line dielectric layer; a top capping layer covering the bottom capping layer and the word line structure; a bit line penetrating through the top capping layer and the bottom capping layer and extending into the source region; and a cell contact penetrating through the top capping layer and the bottom capping layer and extending into the drain region. Top surfaces of the top thickening layer and the word line dielectric layer are coplanar and higher than a top surface of the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:半導體裝置</p>  
        <p type="p">101:基底</p>  
        <p type="p">101TS:頂面</p>  
        <p type="p">103:隔離層</p>  
        <p type="p">105D:汲極區</p>  
        <p type="p">105S:源極區</p>  
        <p type="p">111:底部蓋層</p>  
        <p type="p">111TS:頂面</p>  
        <p type="p">113:頂部蓋層</p>  
        <p type="p">200:字元線結構</p>  
        <p type="p">210:字元線介電層</p>  
        <p type="p">210TS:頂面</p>  
        <p type="p">220:字元線導電層</p>  
        <p type="p">221:底部導電部分</p>  
        <p type="p">223:頂部導電部分</p>  
        <p type="p">230:字元線蓋層</p>  
        <p type="p">230TS:頂面</p>  
        <p type="p">301:底部阻障層</p>  
        <p type="p">303:中間阻障層</p>  
        <p type="p">401:底部增厚層</p>  
        <p type="p">403:頂部增厚層</p>  
        <p type="p">601:位元線</p>  
        <p type="p">601O:位元線開口</p>  
        <p type="p">603:單元接觸</p>  
        <p type="p">6011:位元線接觸</p>  
        <p type="p">6013:位元線底部電極</p>  
        <p type="p">6015:位元線頂部電極</p>  
        <p type="p">6017:位元線遮罩圖案</p>  
        <p type="p">6019:位元線間隙物</p>  
        <p type="p">6031:下部分</p>  
        <p type="p">6032:周圍表面</p>  
        <p type="p">6033:上部分</p>  
        <p type="p">6034:周圍表面</p>  
        <p type="p">AA:主動區</p>  
        <p type="p">CD1:第一關鍵尺寸</p>  
        <p type="p">CD2:第二關鍵尺寸</p>  
        <p type="p">TR:字元線溝槽</p>  
        <p type="p">VL1:垂直高度</p>  
        <p type="p">VL2:垂直高度</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="834" publication-number="202614558"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614558.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614558</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106926</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天線設備及包括天線設備之電子裝置</chinese-title>  
        <english-title>ANTENNA APPARATUS AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">H03H7/38</main-classification>  
        <further-classification edition="200601120250602B">H01Q1/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧衡煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROH, HYOUNG HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供天線設備及包括該天線設備之電子裝置。該天線設備包括彼此鄰近之一第一傳導結構及一第二傳導結構，以及耦接至該第一傳導結構及該第二傳導結構之一PCB，一匹配電路及一NFC晶片安置於該PCB上。該PCB包括電抗性耦接至該匹配電路之各別饋入端之第一接地點及第二接地點。該NFC晶片包括經組態以提供一差動激磁電流之一第一連接端子及一第二連接端子，該第一連接端子及該第二連接端子連接至該匹配電路之該等饋入端，且對應於一NFC頻率之一電流係沿著分別包括該第一傳導結構及該第二傳導結構之第一電氣接點及第二電氣接點之一迴路形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Antenna apparatus and electronic device including the same are provided. The antenna apparatus includes a first and second conductive structures adjacent to one another, and a PCB coupled to the first and second conductive structures, on which a matching circuit and an NFC chip are disposed. The PCB includes first and second ground points reactively coupled to respective feeding ends of the matching circuit. The NFC chip includes a first connection terminal and a second connection terminal, which are configured to provide a differential excitation current, the first and second connection terminals are connected to the feeding ends of the matching circuit, and a current corresponding to an NFC frequency is formed along a loop that includes first and second electrical contacts of the first and second conductive structures, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120:NFC晶片</p>  
        <p type="p">130:匹配電路</p>  
        <p type="p">140:天線</p>  
        <p type="p">300:電子裝置</p>  
        <p type="p">400:印刷電路板</p>  
        <p type="p">500:金屬構件，傳導構件</p>  
        <p type="p">510:第一傳導結構</p>  
        <p type="p">520:傳導橫樑</p>  
        <p type="p">530:第二傳導結構</p>  
        <p type="p">600:電池安裝溝槽</p>  
        <p type="p">+D1,-D1:第一方向</p>  
        <p type="p">+D2,-D2:第二方向</p>  
        <p type="p">+D3,-D3:第三方向</p>  
        <p type="p">C1:第一電容器</p>  
        <p type="p">C2:第二電容器</p>  
        <p type="p">C3:第三電容器</p>  
        <p type="p">CM1:第一接觸構件</p>  
        <p type="p">CM2:第二接觸構件</p>  
        <p type="p">CM3:第三接觸構件</p>  
        <p type="p">CT1:第一對連接端子，第一連接端子</p>  
        <p type="p">CT2:第二對連接端子，第二連接端子</p>  
        <p type="p">EC1:第一電氣接點</p>  
        <p type="p">EC2:第二電氣接點</p>  
        <p type="p">EC3:第三電氣接點</p>  
        <p type="p">FE1:第一饋入端</p>  
        <p type="p">FE2:第二饋入端</p>  
        <p type="p">L1:第一電感器</p>  
        <p type="p">L2:第二電感器</p>  
        <p type="p">N_a,N_b:節點</p>  
        <p type="p">SP:支撐構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="835" publication-number="202614758"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614758.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614758</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106964</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250701B">H10B41/20</main-classification>  
        <further-classification edition="202301120250701B">H10B43/20</further-classification>  
        <further-classification edition="200601120250701B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒井伸也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAI, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>細村嘉一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSOMURA, YOSHIKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施形態提供一種抑制製造成本之記憶體裝置。&lt;br/&gt;實施形態之記憶體裝置包含基板W1、第1電路層及第2電路層。基板具有第1區域與第2區域。第2電路層包含：積層體，其包含於第1區域內沿第2方向交替積層之第1絕緣體層及第1導電體層；複數個第1柱，其等於第1區域內，於第2方向上貫通積層體，且於積層體之上方與源極線電性連接；及至少1個第1接點，其等具有於第2區域內設置成與積層體相同高度之部分。源極線包含：第2導電體層51，其具有於第1區域內覆蓋複數個第1柱之各者之上部而設置之部分、及於第2區域內覆蓋至少1個第1接點之上部而設置之部分。第2導電體層之表面於複數個第1柱與至少1個第1接點之至少一者之上方設置成非平面狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:記憶體裝置</p>  
        <p type="p">21:絕緣體層</p>  
        <p type="p">22:半導體層</p>  
        <p type="p">23:構件</p>  
        <p type="p">24:半導體層</p>  
        <p type="p">26:絕緣體層</p>  
        <p type="p">27:絕緣體層</p>  
        <p type="p">28:絕緣體層</p>  
        <p type="p">29:絕緣體層</p>  
        <p type="p">30:絕緣構件</p>  
        <p type="p">31:導電體層</p>  
        <p type="p">32:導電體層</p>  
        <p type="p">33:導電體層</p>  
        <p type="p">34:導電體層</p>  
        <p type="p">35:導電體層</p>  
        <p type="p">41:半導體層</p>  
        <p type="p">42:積層膜</p>  
        <p type="p">46:半導體層</p>  
        <p type="p">50:半導體層</p>  
        <p type="p">51:導電體層</p>  
        <p type="p">100:CMOS層</p>  
        <p type="p">101:閘極絕緣膜</p>  
        <p type="p">102:閘極電極</p>  
        <p type="p">103:導電體層</p>  
        <p type="p">104:導電體層</p>  
        <p type="p">105:導電體層</p>  
        <p type="p">110:絕緣體層</p>  
        <p type="p">111:絕緣體層</p>  
        <p type="p">200:記憶層</p>  
        <p type="p">210:絕緣體層</p>  
        <p type="p">300:配線層</p>  
        <p type="p">301:絕緣構件</p>  
        <p type="p">302:導電體層</p>  
        <p type="p">303:絕緣體層</p>  
        <p type="p">304:絕緣體層</p>  
        <p type="p">305:絕緣體層</p>  
        <p type="p">AA:主動區域</p>  
        <p type="p">B1:接合層</p>  
        <p type="p">B2:接合層</p>  
        <p type="p">BA:絕緣區域</p>  
        <p type="p">C0:接點</p>  
        <p type="p">C1:接點</p>  
        <p type="p">C2:接點</p>  
        <p type="p">C3:接點</p>  
        <p type="p">CV:接點</p>  
        <p type="p">DAr:虛設區域</p>  
        <p type="p">DMP:虛設柱</p>  
        <p type="p">DS:虛設階梯部</p>  
        <p type="p">MP:記憶體柱</p>  
        <p type="p">PR:周邊區域</p>  
        <p type="p">SL:源極線</p>  
        <p type="p">SLA:源極線區域</p>  
        <p type="p">SLT:縫隙</p>  
        <p type="p">SM:犧牲構件</p>  
        <p type="p">TR1:電晶體</p>  
        <p type="p">TR2:電晶體</p>  
        <p type="p">V1:接點</p>  
        <p type="p">V2:接點</p>  
        <p type="p">VA:通道</p>  
        <p type="p">W1:半導體基板</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="836" publication-number="202614435"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614435.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614435</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106997</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250502B">H01L23/528</main-classification>  
        <further-classification edition="200601120250502B">H01L23/535</further-classification>  
        <further-classification edition="200601120250502B">H01L23/538</further-classification>  
        <further-classification edition="200601120250502B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡嶋睦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAJIMA, MUTSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楢崎亮太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARASAKI, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>越智孝光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OCHI, TAKAMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種較佳地運作的半導體記憶裝置。半導體記憶裝置包括：多個記憶體層，沿第一方向排列；通孔配線，沿第一方向延伸；第一配線，相對於多個記憶體層而言設置於第一方向的其中一側且沿第二方向延伸；以及絕緣層，相對於多個記憶體層而言設置於第一方向的另一側且覆蓋通孔配線的端部。多個記憶體層分別包括：半導體層，與通孔配線連接；閘極電極，與半導體層相向；第二配線，沿第三方向延伸且與閘極電極連接；以及記憶體部，相對於半導體層而言在第二方向上設置於與第二配線相反之側且與半導體層連接。通孔配線包括：導電構件，沿第一方向延伸；以及內部區域，沿第一方向延伸且外周面由導電構件包圍。內部區域的第一方向的絕緣層側的端部不由導電構件覆蓋，由絕緣層覆蓋或者與絕緣層連續。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">210、211、212、213:絕緣層</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">CAV:內部區域</p>  
        <p type="p">CC、GBLC1:接觸件</p>  
        <p type="p">C&lt;sub&gt;M&lt;/sub&gt;、C&lt;sub&gt;P&lt;/sub&gt;:晶片</p>  
        <p type="p">Cn1:電極</p>  
        <p type="p">CpC:電容器</p>  
        <p type="p">GBL:全域位元線</p>  
        <p type="p">LB:位元線選擇線</p>  
        <p type="p">m0、m1:配線</p>  
        <p type="p">M0、M1:配線層</p>  
        <p type="p">MA10、MA20:導電層</p>  
        <p type="p">MCA:記憶體胞元陣列</p>  
        <p type="p">ML:記憶體層</p>  
        <p type="p">PI1:第一貼合電極</p>  
        <p type="p">PI2:第二貼合電極</p>  
        <p type="p">PL:板線</p>  
        <p type="p">PM10、PM20:導電層</p>  
        <p type="p">PM10a、PM10b、PM20a:部分</p>  
        <p type="p">P&lt;sub&gt;X&lt;/sub&gt;:外部焊墊電極</p>  
        <p type="p">R&lt;sub&gt;MCA&lt;/sub&gt;、R&lt;sub&gt;PC&lt;/sub&gt;:區域</p>  
        <p type="p">Sub2:基板</p>  
        <p type="p">TL:電晶體層</p>  
        <p type="p">Tr:電晶體</p>  
        <p type="p">TrB:電晶體</p>  
        <p type="p">TrC:電晶體</p>  
        <p type="p">WL:字元線</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="837" publication-number="202613697"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613697.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613697</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114106999</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>相機模組</chinese-title>  
        <english-title>CAMERA MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251224B">G03B17/12</main-classification>  
        <further-classification edition="202101120251224B">G03B17/02</further-classification>  
        <further-classification edition="202101120251224B">G03B30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張濬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, JOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴虔輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, GEON HWI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河水彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HA, SOO BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭有鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, YOU JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鎭世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JIN SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開一種相機模組。相機模組包括可移動地設置在殼體內部的鏡頭模組；以及環繞殼體的至少一部分的外殼，其中外殼中設置有光通過的開口，且開口的內表面包括朝向開口的中心凸出的內表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A camera module is provided. The camera module includes a lens module that is movably disposed inside the housing; and a case that surrounds at least a portion of the housing, wherein an opening through which light has passed is disposed in the case, and an inner surface of the opening includes an inner surface that is convex toward a center of the opening.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="838" publication-number="202613649"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613649.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613649</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107178</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像透鏡系統</chinese-title>  
        <english-title>OPTICAL IMAGING LENS SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G02B13/00</main-classification>  
        <further-classification edition="200601120251230B">G02B13/18</further-classification>  
        <further-classification edition="200601120251230B">G02B13/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金琴鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KUM HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張東赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, DONG HYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁東晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, DONG SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李知秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JI SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卞世聯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BYUN, SE RYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像透鏡系統，包括第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡和第七透鏡，自物體側起依次設置，其中第一透鏡具有凸的影像側表面，第六透鏡具有凹的物體側表面，且滿足條件表達式(TTL/IMH)*Fno＜1.7，其中TTL是在光軸上自第一透鏡物體側表面至成像平面的距離且IMH是成像平面的對角線長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging lens system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens, arranged in order from an object side, wherein the first lens has a convex image-side surface, and the sixth lens has a concave object-side surface, and the following conditional expression is satisfied: (TTL/IMH)*Fno＜1.7, where TTL is a distance on an optical axis from an object-side surface of the first lens to an imaging plane and IMH is a diagonal length of the imaging plane.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學成像透鏡系統</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:第六透鏡</p>  
        <p type="p">170:第七透鏡</p>  
        <p type="p">F:濾光片</p>  
        <p type="p">IP:成像平面</p>  
        <p type="p">ST:光闌</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="839" publication-number="202614055"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614055.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614055</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107185</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體電路及操作具有記憶體陣列的記憶體裝置的方法</chinese-title>  
        <english-title>MEMORY CIRCUIT AND METHOD FOR OPERATING MEMORY DEVICE WITH MEMORY ARRAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250915B">G11C11/413</main-classification>  
        <further-classification edition="200601120250915B">G11C7/12</further-classification>  
        <further-classification edition="200601120250915B">G11C7/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>横山佳巧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOYAMA, YOSHISATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原口大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARAGUCHI, MASARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤野頼信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJINO, YORINOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原拓実</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARA, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體電路包含一記憶體陣列，該記憶體陣列包括複數個記憶體單元。該記憶體電路包含耦接至一銷及一控制線的一低通鎖存器(LL)，其中該控制線攜載一時脈訊號。該記憶體電路包含耦接至該LL、該控制線及該記憶體陣列的一高通鎖存器(HL)。該HL用以在該時脈訊號為高時傳播訊號，且在該時脈訊號為低時停止該些訊號的傳播。該LL用以在該時脈訊號為低時傳播訊號，且在該時脈訊號為高時停止該些訊號的傳播。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory circuit includes a memory array comprising a plurality of memory cells. The memory circuit includes a low-through latch (LL) coupled to a pin and a control line, wherein the control line carries a clock signal. The memory circuit includes a high-through latch (HL) coupled to the LL, the control line, and the memory array. The HL is configured to propagate signals when the clock signal is high and stop propagation of the signals when the clock signal is low. The LL is configured to propagate signals when the clock signal is low and stop propagation of the signals when the clock signal is high.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120:記憶體陣列</p>  
        <p type="p">300:示意圖</p>  
        <p type="p">302:寫入電路</p>  
        <p type="p">304:讀取電路</p>  
        <p type="p">306:字元線解碼器</p>  
        <p type="p">308A~308E:輸入銷</p>  
        <p type="p">310A~310D:低通鎖存器</p>  
        <p type="p">312A、312C、312D:高通鎖存器</p>  
        <p type="p">314:時脈產生器</p>  
        <p type="p">AA、AB:位址銷</p>  
        <p type="p">AAD、ABD:位址資料</p>  
        <p type="p">BWEB:位元寫入賦能位元</p>  
        <p type="p">CLK:時脈訊號</p>  
        <p type="p">DCLK:鎖存時脈訊號</p>  
        <p type="p">DT:寫入資料</p>  
        <p type="p">HL:高通鎖存器</p>  
        <p type="p">LL:低通鎖存器</p>  
        <p type="p">RCLK:讀取時脈</p>  
        <p type="p">WCLK:寫入時脈</p>  
        <p type="p">WL:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="840" publication-number="202614891"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614891.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614891</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107307</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>元件陣列的製造方法、元件的去除方法、元件陣列的修復方法、元件的去除裝置及元件陣列的修復裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251226B">H10H29/01</main-classification>  
        <further-classification edition="201401120251226B">B23K26/57</further-classification>  
        <further-classification edition="201401120251226B">B23K26/062</further-classification>  
        <further-classification edition="200601120251226B">B23K26/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＤＫ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TDK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀田裕平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOTTA, YUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水戸瀬智久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITOSE, TOMOHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷口晋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIGUCHI, SUSUMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仲村真彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, MASAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的是提供可以製造耐久性優異的元件陣列的製造方法、用於此製造方法的元件的去除方法、元件陣列的修復方法、元件的去除裝置及元件陣列的修復裝置。解決手段是一種元件陣列的製造方法，具有下列步驟：對於作為去除對象的特定元件37a依第一條件照射第一能量線；以及對於已去除前述特定元件之處，依第二條件照射第二能量線。第一條件為從基板34的表面去除特定元件37a並留下與基板端子38a接觸的絕緣部件39的條件，第二條件與前述第一條件不同，為將絕緣部件39去除的條件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">34:基板</p>  
        <p type="p">36:模穴框</p>  
        <p type="p">37a:特定元件</p>  
        <p type="p">38a:基板端子</p>  
        <p type="p">38b:元件端子</p>  
        <p type="p">39:助焊劑</p>  
        <p type="p">Lt:雷射光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="841" publication-number="202614063"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614063.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614063</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107440</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統及記憶體系統之控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G11C16/06</main-classification>  
        <further-classification edition="200601120250801B">G06F1/26</further-classification>  
        <further-classification edition="201601120250801B">G06F12/08</further-classification>  
        <further-classification edition="200601120250801B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林弘樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可提高可靠性及性能之記憶體系統及記憶體系統之控制方法。實施形態之記憶體系統包含記憶體器件、記憶體控制器、電源電路及蓄電裝置。記憶體控制器控制記憶體器件。電源電路將基於自外部電源供給之電力而產生之電力供給至記憶體器件及記憶體控制器。蓄電裝置可蓄積電能，於來自外部電源之電源供給停止之情形時，經由電源電路向記憶體器件及記憶體控制器供給電能。記憶體控制器進而於對記憶體器件之寫入動作中，根據蓄電裝置之蓄電能力，應用功耗不同之第1寫入模式與第2寫入模式之任一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">ST10~ST13:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="842" publication-number="202614386"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614386.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614386</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107661</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構</chinese-title>  
        <english-title>PACKAGE STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250912B">H01L23/29</main-classification>  
        <further-classification edition="200601120250912B">H01L23/373</further-classification>  
        <further-classification edition="200601120250912B">H01L23/488</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳新瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡毓祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, YU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周孟緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, MENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIEN-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>言　瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, KATHY WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種封裝結構包括一封裝基板，一中介層接合至封裝基板，一第一裸晶及一第二裸晶藉由微凸塊與中介層接合，一底部填充材料圍繞微凸塊並位於第一裸晶與中介層之間以及第二裸晶與中介層之間，一金屬層介接中介層、底部填充材料、第一裸晶之側壁以及第二裸晶之側壁，一模封材料覆蓋於金屬層上，以及一熱界面材料則覆蓋於模封材料、金屬層以及第一裸晶及第二裸晶的上方。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package structure according to the present disclosure includes a package substrate, an interposer bonded to the package substrate, a first die and a second die bonded to the interposer by way of micro bumps, an underfill surrounding the micro bumps, disposed between the first die and the interposer as well as between the second die and the interposer, a metal layer interfacing the interposer, the underfill, sidewalls of the first die, and sidewalls of the second die, a molding material over the metal layer, and a thermal interface material disposed over the molding material, the metal layer, the first die, and the second die.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:工作進行中結構，封裝結構</p>  
        <p type="p">202:封裝基板</p>  
        <p type="p">204:被動元件</p>  
        <p type="p">206:焊接特徵</p>  
        <p type="p">208:第二底部填充材料</p>  
        <p type="p">210:中介層</p>  
        <p type="p">214:第一底部填充材料</p>  
        <p type="p">216:第一成型材料</p>  
        <p type="p">220-1:第一系統裸晶</p>  
        <p type="p">220-2:第二系統裸晶</p>  
        <p type="p">240:金屬層</p>  
        <p type="p">250:被動元件</p>  
        <p type="p">262:黏合劑</p>  
        <p type="p">264:黏合劑</p>  
        <p type="p">274:第三環結構</p>  
        <p type="p">276:蓋體</p>  
        <p type="p">280:基板上模封材料</p>  
        <p type="p">290:熱界面材料結構</p>  
        <p type="p">292:膨脹空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="843" publication-number="202614826"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614826.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614826</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107779</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體元件及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251023B">H10D62/10</main-classification>  
        <further-classification edition="202501120251023B">H10D30/43</further-classification>  
        <further-classification edition="202501120251023B">H10D30/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZHI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱宗凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, TSUNG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江育賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YU-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余建霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHIEN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊固峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了通道隔離結構及其形成方法。一元件包含多層堆疊，包含第一複數奈米結構；第二複數奈米結構，位於第一複數奈米結構上方；以及第一通道隔離結構。該元件進一步包含第一源極/汲極區域，位於第一複數奈米結構的相對端點上；第二源極/汲極區域，位於第一源極/汲極區域上方，第二源極/汲極區域位於第二複數奈米結構的相對端點上；第一閘極結構，圍繞第一複數奈米結構；以及第二閘極結構，圍繞第二複數奈米結構。第一閘極結構接觸第一通道隔離結構的第一橫向表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Channel isolation structures and methods of forming thereof are provided. A device comprising a multi-layer stack comprising a first plurality of nanostructures; a second plurality of nanostructures over the first plurality of nanostructures; and a first channel isolation structure. The device further includes first source/drain regions on opposing ends of the first plurality of nanostructures; second source/drain regions over the first source/drain regions, the second source/drain regions being on opposing ends of the second plurality of nanostructures; a first gate structure around the first plurality of nanostructures; and a second gate structure around the second plurality of nanostructures. The first gate structure contacts a first lateral surface of the first channel isolation structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:基板</p>  
        <p type="p">20’:半導體束(半導體鰭)</p>  
        <p type="p">26L、26U:奈米結構</p>  
        <p type="p">44:閘極間隔物</p>  
        <p type="p">54:內間隔物</p>  
        <p type="p">56:通道隔離結構(通道隔離材料)</p>  
        <p type="p">62L、62U:源極/汲極區域</p>  
        <p type="p">66:接觸蝕刻停止層(第一CESL)</p>  
        <p type="p">68:第一ILD</p>  
        <p type="p">70:CESL</p>  
        <p type="p">72:ILD</p>  
        <p type="p">78:閘極介電質</p>  
        <p type="p">80L、80U:閘極電極</p>  
        <p type="p">90、90U、90L:閘極堆疊(閘極結構)</p>  
        <p type="p">92、92L:閘極遮罩</p>  
        <p type="p">94:金屬-半導體合金區域</p>  
        <p type="p">96U:源極/汲極接觸件</p>  
        <p type="p">104:ESL</p>  
        <p type="p">106:第三ILD</p>  
        <p type="p">108:閘極接觸件</p>  
        <p type="p">110:源極/汲極通孔</p>  
        <p type="p">112:裝置層</p>  
        <p type="p">114:前側互連結構</p>  
        <p type="p">116:介電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="844" publication-number="202614759"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614759.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614759</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107907</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置及半導體記憶裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251027B">H10B41/20</main-classification>  
        <further-classification edition="202301120251027B">H10B43/20</further-classification>  
        <further-classification edition="200601120251027B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森田匠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORITA, SHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石原典隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIHARA, NORITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提高記憶單元之動作特性。&lt;br/&gt;本發明之實施方式之半導體記憶裝置具備逐層交替地積層有複數個導電層與複數個絕緣層之積層體、及沿積層體之積層方向於積層體內延伸之柱，柱具有沿積層方向於積層體內延伸之第1半導體層、及沿積層方向於積層體內延伸且包含較第1半導體層更多晶界之第2半導體層，且包含於第1半導體層與第2半導體層之界面處具有峰值濃度之添加物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">BK:阻擋絕緣層</p>  
        <p type="p">CN:溝道層</p>  
        <p type="p">CN1,CN2,CN3:半導體層</p>  
        <p type="p">CR:核心層</p>  
        <p type="p">CT:電荷累積層</p>  
        <p type="p">MC:記憶單元</p>  
        <p type="p">ME:記憶層</p>  
        <p type="p">OL:絕緣層</p>  
        <p type="p">PL:柱</p>  
        <p type="p">TN:隧道絕緣層</p>  
        <p type="p">WL:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="845" publication-number="202614765"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614765.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614765</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107932</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250715B">H10B41/30</main-classification>  
        <further-classification edition="202301120250715B">H10B43/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川湧太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, YUTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮田正靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYATA, MASAYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有優良特性之半導體記憶裝置及其製造方法。&lt;br/&gt;半導體記憶裝置具備：複數個第1導電層，其等排列於第1方向上，沿著與上述第1方向交叉之第2方向、以及與上述第1方向及上述第2方向交叉之第3方向延伸；以及記憶體構造，其沿著上述第1方向延伸，且包含與上述複數個第1導電層對向之第1半導體層及設置於上述第1半導體層與上述複數個第1導電層之間之閘極絕緣層。上述第1半導體層包含單晶化之矽及雜質。上述雜質包含：第1金屬元素，其能夠形成矽化物；以及第2金屬元素，其構成線膨脹係數較矽材料大之金屬材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120:半導體層</p>  
        <p type="p">120A:半導體層</p>  
        <p type="p">123:矽化物層</p>  
        <p type="p">125A:犧牲芯</p>  
        <p type="p">126:犧牲芯</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="846" publication-number="202614058"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614058.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614058</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107934</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G11C16/02</main-classification>  
        <further-classification edition="200601120251001B">H01L23/52</further-classification>  
        <further-classification edition="200601120251001B">H01L21/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>末次高明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUETSUGU, TAKAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林茂樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, SHIGEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>冨松孝宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMIMATSU, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供能高集成化之半導體記憶裝置。&lt;br/&gt;半導體記憶裝置具備：半導體基板；及記憶胞陣列層，其於與半導體基板之表面交叉之第1方向上分開設置。記憶胞陣列層具備：第1及第2積層構造，其等於與第1方向交叉之第2方向上排列；及第3積層構造，其設置於第1及第2積層構造間。第1、第2及第3積層構造具備於第1方向上交替積層且沿著與第1及第2方向交叉之第3方向延伸之複數個第1層及複數個第1絕緣層。第1及第2積層構造具備於第2方向上排列之複數個塊。複數個塊具備沿著第1方向延伸且與複數個第1層對向之第1半導體層。複數個塊中除最接近第3積層構造之第1塊以外之複數個塊於第1層包含第1導電層。第3積層構造及第1塊中，第1層為第2絕緣層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100,110:導電層</p>  
        <p type="p">101,102,110A,200G,STI:絕緣層</p>  
        <p type="p">111:層間絕緣層</p>  
        <p type="p">120:半導體層(半導體柱)</p>  
        <p type="p">200:半導體基板</p>  
        <p type="p">200N:N型擴散層</p>  
        <p type="p">200P:P型擴散層</p>  
        <p type="p">200S:半導體基板區域</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">BLK1:第1記憶塊</p>  
        <p type="p">BLK2:第2記憶塊</p>  
        <p type="p">BLK3:第3記憶塊</p>  
        <p type="p">CC,ch,CS,Vy:通孔接觸電極</p>  
        <p type="p">CH:通孔接觸電極層</p>  
        <p type="p">C&lt;sub&gt;M&lt;/sub&gt;,C&lt;sub&gt;P&lt;/sub&gt;:晶片</p>  
        <p type="p">d0,d1,d2,d3,d4:連接部</p>  
        <p type="p">D0,D1,D2,D3,D4,M0,M1:配線層</p>  
        <p type="p">DB,MB:晶片貼合電極層</p>  
        <p type="p">gc:電極</p>  
        <p type="p">GC:電極層</p>  
        <p type="p">IPS:平面間構造</p>  
        <p type="p">L&lt;sub&gt;MCA&lt;/sub&gt;:記憶胞陣列層</p>  
        <p type="p">L&lt;sub&gt;SB&lt;/sub&gt;:基體層</p>  
        <p type="p">m0,m1,ma:配線</p>  
        <p type="p">MA:背面配線層</p>  
        <p type="p">MP0,MP1:記憶體平面</p>  
        <p type="p">MP0',R&lt;sub&gt;IPS&lt;/sub&gt;,VZ:區域</p>  
        <p type="p">P&lt;sub&gt;I1&lt;/sub&gt;,P&lt;sub&gt;I2&lt;/sub&gt;:貼合電極</p>  
        <p type="p">p&lt;sub&gt;I1B&lt;/sub&gt;,p&lt;sub&gt;I2B&lt;/sub&gt;:障壁導電膜</p>  
        <p type="p">p&lt;sub&gt;I1M&lt;/sub&gt;,p&lt;sub&gt;I2M&lt;/sub&gt;:金屬膜</p>  
        <p type="p">P&lt;sub&gt;x&lt;/sub&gt;:外部焊墊電極</p>  
        <p type="p">SGD:汲極側選擇閘極線</p>  
        <p type="p">SGS:源極側選擇閘極線</p>  
        <p type="p">SHE:串單元間絕緣層</p>  
        <p type="p">ST,ST1,:塊間絕緣層</p>  
        <p type="p">Tr:電晶體</p>  
        <p type="p">TV:開口</p>  
        <p type="p">WL:字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="847" publication-number="202612823"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612823.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612823</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114107938</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置之製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">B23K1/06</main-classification>  
        <further-classification edition="200601120250902B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤丸友紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMARU, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小松謙仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMATSU, KENTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>草刈眞一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSAKARI, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三九二孝弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKUNI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本間荘一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOMMA, SOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施方式提供一種可靠性提高之半導體裝置之製造方法。&lt;br/&gt;實施方式之半導體裝置之製造方法包括：第1步驟，其係對半導體元件施加第1荷重而將半導體元件之凸塊壓抵於配線基板，並且不對凸塊施加超音波振動或者對凸塊施加第1強度之超音波振動以使凸塊變形；及第2步驟，其係於第1步驟之後，對半導體元件施加第2荷重而將半導體元件之凸塊壓抵於配線基板，並且對凸塊施加較第1強度強之第2強度之超音波振動以將凸塊與配線基板之焊墊接合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method for a semiconductor device according to an embodiment includes a first step deforming a bump of a semiconductor element by applying a first load to the semiconductor element to press the bump onto a circuit board and applying either no ultrasonic vibration or ultrasonic vibration with a first strength to the bump and a second step, after the first step, bonding the bump to a pad of the circuit board by applying a second load to the semiconductor element to press the bump and applying ultrasonic vibration with a second strength stronger than the first strength to the bump.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="848" publication-number="202614760"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614760.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614760</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108031</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">H10B41/20</main-classification>  
        <further-classification edition="202301120250801B">H10B41/30</further-classification>  
        <further-classification edition="202301120250801B">H10B41/35</further-classification>  
        <further-classification edition="202301120250801B">H10B43/20</further-classification>  
        <further-classification edition="202301120250801B">H10B43/30</further-classification>  
        <further-classification edition="202301120250801B">H10B43/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中塚圭祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATSUKA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於使寄生電容平準化。 &lt;br/&gt;一實施方式之記憶體裝置具備：複數個第1導電體層，其等在第1方向上相互分離排列；第1構件，其於與第1方向交叉之第2方向上延伸，且將複數個第1導電體層分割成於與第1方向及第2方向交叉之第3方向上排列之第1部分及第2部分；複數個第1記憶體柱，其等各自於第1方向上延伸，且與複數個第1導電體層之第1部分各自交叉；及複數個第2記憶體柱，其等各自於第1方向上延伸，且與複數個第1導電體層之第2部分各自交叉。沿第1方向觀察時，複數個第2記憶體柱相對於複數個第1記憶體柱於第2方向上偏移配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">BL:位元線</p>  
        <p type="p">BLK:區塊</p>  
        <p type="p">SU:串組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="849" publication-number="202613820"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613820.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613820</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統及控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251103B">G06F12/08</main-classification>  
        <further-classification edition="201601120251103B">G06F12/10</further-classification>  
        <further-classification edition="200601120251103B">G06F13/38</further-classification>  
        <further-classification edition="200601120251103B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武田奈穂美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEDA, NAOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白川政信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAKAWA, MASANOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於識別各資料之類別之記憶體系統及控制方法。&lt;br/&gt;一實施方式之記憶體系統包含控制器，該控制器構成為將資料與歷史資訊寫入至複數個區塊中之一個區塊。當將記憶於複製源區塊之有效資料即第1資料複製至複製目標區塊時，控制器從複製源區塊讀出第1資料、及與第1資料對應之歷史資訊即第1歷史資訊，並將第1資料、及基於第1歷史資訊之值之第2歷史資訊寫入至複製目標區塊。&lt;b/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S111~S115:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="850" publication-number="202614450"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614450.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614450</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108273</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體晶片及其形成方法</chinese-title>  
        <english-title>INTEGRATED CHIP AND FORMING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251105B">H01L25/16</main-classification>  
        <further-classification edition="202501120251105B">H10F39/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余治寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHIH-KUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪豐基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, FENG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁世汎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TING, SHYH-FANN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊敦年</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAUNG, DUN-NIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種積體晶片及其製造方法。積體晶片包含光電感測器、傳輸電晶體、第一像素電晶體、電容、第二像素電晶體和接合結構。傳輸電晶體的第一端子耦合到光電感測器的第一端子。第一像素電晶體位於第一半導體晶片上。第一像素電晶體的第一端子耦合到傳輸電晶體的第二端子。電容位於第一半導體晶片上。電容的第一端子耦合到第一像素電晶體的第二端子。第二像素電晶體位於與第一半導體晶片接合的第二半導體晶片上。接合結構位於第一半導體晶片和第二半導體晶片接合在一起的介面處。接合結構將電容的第二端子耦合到第二像素電晶體的第一端子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated chip includes a photodetector, a transfer transistor, a first pixel transistor, a capacitor, a second pixel transistor, and a bonding structure. A first terminal of the transfer transistor is coupled to a first terminal of the photodetector. The first pixel transistor is on a first semiconductor chip. A first terminal of the first pixel transistor is coupled to a second terminal of the transfer transistor. The capacitor is on the first semiconductor chip. A first terminal of the capacitor is coupled to a second terminal of the first pixel transistor. The second pixel transistor is on a second semiconductor chip bonded to the first semiconductor chip. The bonding structure is at an interface where the first semiconductor chip and the second semiconductor chip are bonded together. The bonding structure couples the second terminal of the capacitor to the first terminal of the second pixel transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:截面圖</p>  
        <p type="p">101:第一半導體晶片</p>  
        <p type="p">102:第一半導體晶片</p>  
        <p type="p">104:第一半導體晶片</p>  
        <p type="p">105:第一半導體基板</p>  
        <p type="p">106:第一半導體基板</p>  
        <p type="p">108:第一半導體基板</p>  
        <p type="p">110:第二半導體基板</p>  
        <p type="p">112:第二半導體基板</p>  
        <p type="p">114:光電感測器</p>  
        <p type="p">116:傳輸電晶體</p>  
        <p type="p">118:光電二極體區</p>  
        <p type="p">119:第一源極/汲極</p>  
        <p type="p">120:第二源極/汲極</p>  
        <p type="p">122:閘極</p>  
        <p type="p">124:第一像素電晶體</p>  
        <p type="p">126:第一源極/汲極</p>  
        <p type="p">128:第二源極/汲極</p>  
        <p type="p">130:閘極</p>  
        <p type="p">132:第一電介質結構</p>  
        <p type="p">136:導電接觸件</p>  
        <p type="p">138、140:導電通孔</p>  
        <p type="p">142、144:導電線</p>  
        <p type="p">146:導電接合接觸件</p>  
        <p type="p">148:導電接合墊</p>  
        <p type="p">150:第一LOFIC</p>  
        <p type="p">152:第一電極層</p>  
        <p type="p">154:電介質層</p>  
        <p type="p">156:第二電極層</p>  
        <p type="p">158:像素電晶體/第二像素電晶體</p>  
        <p type="p">160:第一源極/汲極</p>  
        <p type="p">162:第二源極/汲極</p>  
        <p type="p">164:閘極</p>  
        <p type="p">166:附加接觸件</p>  
        <p type="p">168、170:附加導電線</p>  
        <p type="p">172：174:附加導電通孔</p>  
        <p type="p">176:第二接合墊</p>  
        <p type="p">178:第二接合接觸件</p>  
        <p type="p">180、182:導電線</p>  
        <p type="p">184:導電通孔</p>  
        <p type="p">186:接觸件</p>  
        <p type="p">188:電介質結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="851" publication-number="202613631"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613631.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613631</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108318</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">G02B6/42</main-classification>  
        <further-classification edition="200601120250801B">H01L23/528</further-classification>  
        <further-classification edition="200601120250801B">H01L23/535</further-classification>  
        <further-classification edition="200601120250801B">H01L23/498</further-classification>  
        <further-classification edition="200601120250801B">H01L23/36</further-classification>  
        <further-classification edition="200601120250801B">H01L23/29</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商台積電亞利桑那公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSMC ARIZONA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯　學文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, XUEWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊文獻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, WEN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉獻文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HSIEN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一實施例中，一種方法包括：形成積體電路晶粒，形成積體電路晶粒包括：在基底的正面上方形成內連線結構，所述內連線結構包括光子組件和加熱器，所述基底包括半導體基板上方的第一介電層；去除所述半導體基板以露出第一介電層的背面；在所述第一介電層的背面形成第二介電層；在所述第二介電層上方形成重分佈結構，所述重分佈結構延伸穿過第一介電層和第二介電層，以電性連接到所述內連線結構；並在所述重分佈結構上形成電性連接件；將封裝基板附加到所述電性連接件；並將電子晶粒附加到所述內連線結構上方和所述封裝基板的所述正面上方。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an embodiment, a method includes: forming an integrated circuit die, forming the integrated circuit die comprising: forming an interconnect structure over a front side of a substrate, the interconnect structure comprising a photonic component and a heater, the substrate comprising a first dielectric layer over a semiconductor substrate; removing the semiconductor substrate to expose a back side of the first dielectric layer; forming a second dielectric layer over the back side of the first dielectric layer; forming a redistribution structure over the second dielectric layer, the redistribution structure extending through the first dielectric layer and the second dielectric layer to be electrically connected to the interconnect structure; and forming an electrical connector over the redistribution structure; attaching a package substrate to the electrical connector; and attaching an electronic die over the interconnect structure and over the front side of the package substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:光子晶粒</p>  
        <p type="p">22:半導體基板</p>  
        <p type="p">24:加熱器</p>  
        <p type="p">26:波長調變器</p>  
        <p type="p">28:介電層</p>  
        <p type="p">32:內連線結構</p>  
        <p type="p">34:金屬通孔</p>  
        <p type="p">36:金屬線</p>  
        <p type="p">38:通孔</p>  
        <p type="p">55:導電通孔</p>  
        <p type="p">58:接合墊</p>  
        <p type="p">111:第一介電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="852" publication-number="202614443"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614443.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614443</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108362</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L23/538</main-classification>  
        <further-classification edition="202301120251229B">H01L25/18</further-classification>  
        <further-classification edition="202001120251229B">G06F30/392</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李景洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KYUNGSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張虎郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, HORANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUH, JUNHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體裝置，其整合一系列小晶片晶粒，該等小晶片晶粒各自可組配為個別半導體晶片，該等小晶片晶粒安裝於一中介層上。各小晶片晶粒配備有一晶粒對晶粒介面，從而實現該等小晶片晶粒之間的連接性。各小晶片中之該晶粒對晶粒介面包括：位於一第一小晶片晶粒內之一第一連接模組，其具有多個第一模組；以及位於一第二小晶片晶粒內之一第二連接模組，其具有多個第二模組。一選擇電路用於選擇與該第一連接模組中之對應第一模組對準的特定第二模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device integrates a series of chiplet dies, each configurable as individual semiconductor chips, mounted on an interposer. Each chiplet die is equipped with a die-to-die interface enabling connectivity amongst them. The die-to-die interface in each chiplet includes a first connection module within a first chiplet die, having multiple first modules, and a second connection module within a second chiplet die, having multiple second modules. A selection circuit is used select specific second modules that align with corresponding first modules in the first connection module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第一晶粒</p>  
        <p type="p">110:第一晶粒對晶粒介面</p>  
        <p type="p">200:第二晶粒</p>  
        <p type="p">210:第二晶粒對晶粒介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="853" publication-number="202613245"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613245.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613245</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108426</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>母料、樹脂組成物及樹脂成形體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250923B">C08L67/03</main-classification>  
        <further-classification edition="200601120250923B">C08J11/04</further-classification>  
        <further-classification edition="200601120250923B">C08L33/08</further-classification>  
        <further-classification edition="200601120250923B">C08G63/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大日精化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAINICHISEIKA COLOR &amp; CHEMICALS MFG. CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>關根卓馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKINE, TAKUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片岡美穗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAOKA, YOSHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>影山明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAGEYAMA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明所提供的母料，係利用聚酯樹脂稀釋時，可獲得加工性及成形性良好、且透明性良好、黃色度低的樹脂組成物。 &lt;br/&gt;本發明的母料係含有：非晶性PET(A)、與重量平均環氧官能基數為3以上且65以下、且重量平均分子量為2000~30000的鏈伸長劑(B)。母料中的鏈伸長劑(B)之含有量係5~30質量%。又，將單獨熔融混練後的固有黏度IV&lt;sub&gt;a&lt;/sub&gt;為0.9~1.0dL/g的結晶性PET、與母料，以鏈伸長劑(B)之含有量成為0.4質量%的比例進行熔融混練所獲得之樹脂組成物試料的固有黏度設為IV&lt;sub&gt;b&lt;/sub&gt;(dL/g)時，0＜IV&lt;sub&gt;b&lt;/sub&gt;-IV&lt;sub&gt;a&lt;/sub&gt;＜0.29。又，該母料係在樹脂組成物中的鏈伸長劑(B)之含有量成為0.01~1.0質量%的條件下與聚酯樹脂混合使用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="854" publication-number="202613257"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613257.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613257</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108438</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>紙基材塗敷用的水性液狀組成物、水性油墨、積層體、標籤以及包裝材</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250724B">C09D133/02</main-classification>  
        <further-classification edition="201401120250724B">C09D11/023</further-classification>  
        <further-classification edition="201801120250724B">C09D7/20</further-classification>  
        <further-classification edition="200601120250724B">B32B27/30</further-classification>  
        <further-classification edition="200601120250724B">B32B29/00</further-classification>  
        <further-classification edition="200601120250724B">B65D65/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大日精化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAINICHISEIKA COLOR &amp; CHEMICALS MFG. CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田治樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, HARUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊坂愛茄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMASAKA, AIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種紙基材塗敷用的水性液狀組成物，係含有：酸價為80mgKOH/g以上至260mgKOH/g以下之丙烯酸樹脂(A)(不包含丙烯酸乳液樹脂)、酸價(mgKOH/g)為10以上至未達80且玻璃轉移溫度為0℃至60℃之丙烯酸乳液樹脂(B)、R&lt;sup&gt;1&lt;/sup&gt;-O-(AO)n-R&lt;sup&gt;2&lt;/sup&gt;所表示之溶劑(C)、水性媒質(D)(不包含溶劑(C))、平均粒徑為1.5μm以上之大粒徑蠟(E)、以及平均粒徑為未達1.5μm之小粒徑蠟(F)；相對於固體成分的總質量，丙烯酸樹脂(A)之固體成分為8.2質量%至60質量%，丙烯酸乳液樹脂(B)之固體成分為20質量%至82質量%，固體成分的質量比(B)/(A)為0.25至10，揮發成分/(C)的質量比為3至20。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="855" publication-number="202614440"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614440.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614440</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108499</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有階梯狀側壁的電極之半導體元件及其製備方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE WITH ELECTRODE HAVING STEP-SHAPED SIDEWALL AND METHOD OF PREPARING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">H01L23/535</main-classification>  
        <further-classification edition="200601120250801B">H01L23/528</further-classification>  
        <further-classification edition="200601120250801B">H01L23/522</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃慶玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIN-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種半導體元件，其包括設置於該第一介電層之上的一底部電極結構。該底部電極結構包括由下往上配置的一第一金屬層、一第二金屬層、一第三金屬層、一第四金屬層、和一第五金屬層。該第一金屬層、該第三金屬層和該第五金屬層包括一第一金屬材料，且該第二金屬層和該第四金屬層包括一第二金屬材料，其與該第一金屬材料不同。該半導體元件也包括設置於該底部電極結構的相對側壁上的一高介電常數介電結構。該底部電極結構的相對側壁為階梯狀。該半導體元件更包括橫向圍繞該底部電極結構且透過該高介電常數介電結構與該底部電極結構間隔開的一頂部電極結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a bottom electrode structure disposed over a semiconductor substrate. The bottom electrode structure includes a first metal layer, a second metal layer, a third metal layer, a fourth metal layer, and a fifth metal layer, arranged from bottom to top. The first metal layer, the third metal layer and the fifth metal layer include a first metal material, and the second metal layer and the fourth metal layer include a second metal material different from the first metal material. The semiconductor device also includes a high-k dielectric structure disposed on opposite sidewalls of the bottom electrode structure. The opposite sidewalls of the bottom electrode structure are step-shaped. The semiconductor device further includes a top electrode structure laterally surrounding the bottom electrode structure and separated from the bottom electrode structure by the high-k dielectric structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體元件</p>  
        <p type="p">101:半導體基板</p>  
        <p type="p">103:第一介電層</p>  
        <p type="p">105:第二介電層</p>  
        <p type="p">105T:頂表面</p>  
        <p type="p">121:第一金屬層</p>  
        <p type="p">121S:側壁</p>  
        <p type="p">123:第二金屬層</p>  
        <p type="p">123S:側壁</p>  
        <p type="p">125:第三金屬層</p>  
        <p type="p">125S:側壁</p>  
        <p type="p">127:第四金屬層</p>  
        <p type="p">127S:側壁</p>  
        <p type="p">129:第五金屬層</p>  
        <p type="p">129S:側壁</p>  
        <p type="p">131:第六金屬層</p>  
        <p type="p">131S:側壁</p>  
        <p type="p">133:第七金屬層</p>  
        <p type="p">133S:側壁</p>  
        <p type="p">133T:頂表面</p>  
        <p type="p">135:底部電極結構</p>  
        <p type="p">151':高介電常數介電結構</p>  
        <p type="p">151a:高介電常數介電部分</p>  
        <p type="p">151b:高介電常數介電部分</p>  
        <p type="p">151T:頂表面</p>  
        <p type="p">153a:種子部分</p>  
        <p type="p">153b:種子部分</p>  
        <p type="p">155a:導電部分</p>  
        <p type="p">155b:導電部分</p>  
        <p type="p">157:頂部電極結構</p>  
        <p type="p">157T:頂表面</p>  
        <p type="p">159:第三介電層</p>  
        <p type="p">159T:頂表面</p>  
        <p type="p">163a:導電插塞</p>  
        <p type="p">163b:導電插塞</p>  
        <p type="p">163c:導電插塞</p>  
        <p type="p">165a:導電焊墊</p>  
        <p type="p">165b:導電焊墊</p>  
        <p type="p">165c:導電焊墊</p>  
        <p type="p">211B:襯層</p>  
        <p type="p">211B':襯層</p>  
        <p type="p">211C:氣隙</p>  
        <p type="p">211C':氣隙</p>  
        <p type="p">213:第四介電層</p>  
        <p type="p">2131:部分</p>  
        <p type="p">2133:部分</p>  
        <p type="p">213A:氣隙結構</p>  
        <p type="p">213B:氣隙結構</p>  
        <p type="p">1000A:圖案密集區域</p>  
        <p type="p">A-A':剖線</p>  
        <p type="p">P1:部分</p>  
        <p type="p">P2:部分</p>  
        <p type="p">P3:部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="856" publication-number="202614777"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614777.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614777</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108552</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透過晶圓接合的記憶體裝置製造</chinese-title>  
        <english-title>MEMORY DEVICE FABRICATION THROUGH WAFER BONDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251229B">H10B53/30</main-classification>  
        <further-classification edition="202301120251229B">H10B53/40</further-classification>  
        <further-classification edition="202501120251229B">H10D1/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商凱普勒運算公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEPLER COMPUTING INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古哈　比斯瓦吉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUHA, BISWAJEET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼弗里尼　莫里西奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANFRINI, MAURICIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤　徳之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, NORIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克拉克森　詹姆士　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLARKSON, JAMES DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費南德茲　阿貝爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FERNANDEZ, ABEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉蒂　索米爾庫瑪　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RATHI, SOMILKUMAR J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆克吉　尼洛伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKHERJEE, NILOY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈沙維　塔納伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOSAVI, TANAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬圖里亞　阿米塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATHURIYA, AMRITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多卡尼亞　拉杰夫　庫馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOKANIA, RAJEEV KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬尼帕圖尼　沙希坎斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANIPATRUNI, SASIKANTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建甫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置的製造方法包含形成一多層堆疊，其包含複數電極層並包含一非線性極化材料的一第一介電層。該方法更包含在該多層堆疊上形成一第二介電層、對該多層堆疊進行退火、以及在一第二基板上方形成一電晶體。一第三介電層在電晶體上方形成。第二介電層係可接合至第三介電層，且多層堆疊可被蝕刻以形成一電容器以及與電容器連接的一板電極。可形成一電極結構，其中該電極結構的至少一部分延伸穿過該板電極，並且與電晶體的一端子耦合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of fabricating a device includes forming a multi-layer stack comprising a plurality of electrode layers and a first dielectric layer comprising a non-linear polar material. The method further comprises forming a second dielectric layer on the multi-layer stack, annealing the multi-layer stack, and forming a transistor above a second substrate. A third dielectric layer is formed above the transistor. The second dielectric layer can be bonded with the third dielectric layer and the multi-layer stack can be etched to form a capacitor and a plate electrode connected with the capacitor. An electrode structure can be formed, where at least a portion of the electrode structure extends through the plate electrode and couples with a terminal of the transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101A:晶粒</p>  
        <p type="p">101B:晶粒</p>  
        <p type="p">102:電晶體</p>  
        <p type="p">104:基板</p>  
        <p type="p">108:介電質</p>  
        <p type="p">110:電極</p>  
        <p type="p">114:介電層</p>  
        <p type="p">116:介電層</p>  
        <p type="p">118:介電質</p>  
        <p type="p">120:電極</p>  
        <p type="p">120A:部分</p>  
        <p type="p">120B:部分</p>  
        <p type="p">121:部分</p>  
        <p type="p">122:間隔物</p>  
        <p type="p">126:閘極結構</p>  
        <p type="p">128:源極區域</p>  
        <p type="p">130:汲極區域</p>  
        <p type="p">132:源極結構</p>  
        <p type="p">132A、134A:多面側壁表面</p>  
        <p type="p">134:汲極結構</p>  
        <p type="p">140:閘極介電層</p>  
        <p type="p">142:閘極電極</p>  
        <p type="p">144:通道</p>  
        <p type="p">145:鰭片結構</p>  
        <p type="p">146:間隔物</p>  
        <p type="p">148:電極</p>  
        <p type="p">150:裝置結構</p>  
        <p type="p">152:電容器</p>  
        <p type="p">154:電極</p>  
        <p type="p">156:電極</p>  
        <p type="p">156A:側壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="857" publication-number="202614590"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614590.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614590</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108674</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>安全元件、通訊系統、控制方法及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H04L9/10</main-classification>  
        <further-classification edition="200601120251230B">H04L9/08</further-classification>  
        <further-classification edition="200601120251230B">H04L9/14</further-classification>  
        <further-classification edition="200601120251230B">H04L9/32</further-classification>  
        <further-classification edition="201301120251230B">G06F21/33</further-classification>  
        <further-classification edition="201301120251230B">G06F21/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大石浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OISHI, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保高志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳美簾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIN, BIREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村裕也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種安全元件，具備：記憶部，其按複數個加密演算法之每一者，儲存卡內有效期限資訊，該卡內有效期限資訊係使密碼處理指令有效之期限，該密碼處理指令係指示執行使用前述複數個加密演算法中的任一加密演算法之處理；指令處理判定部，其因應於被通知了前述密碼處理指令，而從前述記憶部讀取前述複數個加密演算法中與前述密碼處理指令對應之加密演算法的前述卡內有效期限資訊，並依據讀取到的前述卡內有效期限資訊，判定是否執行因應前述密碼處理指令之處理；及指令處理部，其依據藉由前述指令處理判定部所作成之判定結果而執行因應前述密碼處理指令之處理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="858" publication-number="202614860"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614860.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614860</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108710</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>邏輯半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251226B">H10D86/01</main-classification>  
        <further-classification edition="202501120251226B">H10D1/60</further-classification>  
        <further-classification edition="202501120251226B">H10D62/10</further-classification>  
        <further-classification edition="202501120251226B">H10D64/20</further-classification>  
        <further-classification edition="200601120251226B">H01L21/768</further-classification>  
        <further-classification edition="200601120251226B">H01L23/535</further-classification>  
        <further-classification edition="200601120251226B">H01L23/488</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAPIDUS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野中敏央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NONAKA, TOSHIHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種可縮短半導體晶片與溝槽電容器的距離之半導體裝置。在邏輯半導體裝置(1)中，依序形成矽基板部(12)、電晶體層(14)、配線層(16)及形成有貫通通孔(53)和電容器(60)的電容器部(50)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:矽晶片部</p>  
        <p type="p">11:晶片部接合面</p>  
        <p type="p">11R:晶片部接合面的背面</p>  
        <p type="p">12:矽基板部</p>  
        <p type="p">14:電晶體層</p>  
        <p type="p">16:配線層</p>  
        <p type="p">18:晶片部絕緣部</p>  
        <p type="p">50:電容器部</p>  
        <p type="p">51:電容器部接合面(配線層接合面)</p>  
        <p type="p">52:電容器部絕緣部</p>  
        <p type="p">53:貫通通孔</p>  
        <p type="p">58:電容器部背面</p>  
        <p type="p">60:溝槽電容器(電容器)</p>  
        <p type="p">151,152,153,154:箭號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="859" publication-number="202614316"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614316.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614316</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108712</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板搬運系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/677</main-classification>  
        <further-classification edition="200601120251230B">B65G49/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>網倉紀彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMIKURA, NORIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種技術，於基板搬運系統中，抑制因來自機械接觸部的揚塵而造成之基板的汙染，並具有簡單的構造。基板搬運系統，具備第1及第2基板搬運機構與緩衝單元；第1基板搬運機構，具有第1管軌、第1內側磁鐵構造體、第1驅動單元、及第1基板支持單元；第1基板支持單元，藉由第1內側磁鐵構造體之移動而使第1外側磁鐵構造體追蹤移動，第1機械腕沿第1方向移動；第2基板搬運機構，具有第2管軌、第2內側磁鐵構造體、第2驅動單元、及第2基板支持單元；第2基板支持單元，藉由第2內側磁鐵構造體之移動而使第2外側磁鐵構造體追蹤移動，第2機械腕沿第2方向移動；緩衝單元，在第1機械腕與第2機械腕之間將基板搬運。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:基板搬運系統</p>  
        <p type="p">250:腔室</p>  
        <p type="p">250a:待機區域</p>  
        <p type="p">251(251a,251b):第1搬運機構</p>  
        <p type="p">252(252a,252b,252c):第2基板搬運機構</p>  
        <p type="p">253(253a,253b,253c,253d,253e,253f):緩衝單元</p>  
        <p type="p">300:第1管軌</p>  
        <p type="p">301:第1內側磁鐵構造體</p>  
        <p type="p">302:第1驅動單元</p>  
        <p type="p">303:第1基板支持單元</p>  
        <p type="p">370:第1機械腕</p>  
        <p type="p">371:第1外側磁鐵構造體</p>  
        <p type="p">372:第1連接體</p>  
        <p type="p">400:第2管軌</p>  
        <p type="p">401:第2內側磁鐵構造體</p>  
        <p type="p">402:第2驅動單元</p>  
        <p type="p">403:第2基板支持單元</p>  
        <p type="p">470:第2機械腕</p>  
        <p type="p">471:第2外側磁鐵構造體</p>  
        <p type="p">472:連接體</p>  
        <p type="p">500:基板支持部</p>  
        <p type="p">600:交叉區域</p>  
        <p type="p">AN:對準器</p>  
        <p type="p">C:容器</p>  
        <p type="p">CU:控制部</p>  
        <p type="p">LL1,LL2:加載鎖模組</p>  
        <p type="p">LM:大氣搬運模組</p>  
        <p type="p">LP1~LP4:載入埠</p>  
        <p type="p">PM1~PM8:處理模組</p>  
        <p type="p">PS:基板處理系統</p>  
        <p type="p">SR:貯存器</p>  
        <p type="p">TM:真空搬運模組</p>  
        <p type="p">TR3:大氣搬運機械臂</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="860" publication-number="202614772"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614772.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614772</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108717</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250801B">H10B43/20</main-classification>  
        <further-classification edition="202301120250801B">H10B43/30</further-classification>  
        <further-classification edition="200601120250801B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滋賀秀裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIGA, HIDEHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡嶋睦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAJIMA, MUTSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉本剛士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIMOTO, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田代健也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TASHIRO, KENYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種合適地動作之半導體記憶裝置。半導體記憶裝置，係具備有：複數之第1半導體層，係於第1方向上被作層積；和通孔配線，係被與複數之第1半導體層作電性連接；和複數之記憶體部，係被與複數之第1半導體層作電性連接；和複數之第1閘極電極，係與複數之第1半導體層相對向。又，此半導體記憶裝置，係具備有：第1配線以及第2配線，係相對於複數之第1半導體層，而被設置在第1方向的其中一側以及另外一側處；和第2半導體層，係被設置在複數之第1半導體層與第1配線之間，並被與通孔配線作電性連接；和第1連接電極，係被與第1配線以及第2半導體層作電性連接；和第2閘極電極，係與第2半導體層相對向；和第3半導體層，係被設置在複數之第1半導體層與第2配線之間，並被與通孔配線作電性連接；和第2連接電極，係被與第2配線以及第3半導體層作電性連接；和第3閘極電極，係與第3半導體層相對向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">Sub:半導體基板</p>  
        <p type="p">ML:記憶體層</p>  
        <p type="p">MS:記憶體構造</p>  
        <p type="p">MCA:記憶體胞陣列</p>  
        <p type="p">Cb:接點電極</p>  
        <p type="p">Cp:接點電極</p>  
        <p type="p">LBu:位元線選擇線</p>  
        <p type="p">LBs:位元線選擇線</p>  
        <p type="p">TLs,TLu:電晶體層</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">WL:字元線</p>  
        <p type="p">GBL:全域位元線</p>  
        <p type="p">PL:板線</p>  
        <p type="p">TrC:電晶體</p>  
        <p type="p">CpC:電容器</p>  
        <p type="p">101:絕緣層</p>  
        <p type="p">102:導電層</p>  
        <p type="p">103:絕緣層</p>  
        <p type="p">104:通孔配線</p>  
        <p type="p">105:絕緣層</p>  
        <p type="p">106:導電層</p>  
        <p type="p">107:絕緣層</p>  
        <p type="p">110:電晶體構造</p>  
        <p type="p">120:導電層</p>  
        <p type="p">130:電容器構造</p>  
        <p type="p">133:導電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="861" publication-number="202614070"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614070.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614070</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108734</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統及半導體記憶體之寫入方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251112B">G11C16/10</main-classification>  
        <further-classification edition="200601120251112B">G11C16/06</further-classification>  
        <further-classification edition="200601120251112B">G11C16/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肥田格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIDA, ITARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山岸俊之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGISHI, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">使在資料之寫入以及讀出中的信賴性提升。 &lt;br/&gt;　　實施形態之記憶體系統所具備之記憶體控制器(20)，係對於被寫入至複數之字元線之複數之記憶體胞中之資料，而基於第1編碼參數，來實行錯誤抑制編碼而產生第1寫入資料，並根據第1寫入資料之第1讀出資料，來求取出各字元線之各別之錯誤率，並基於各字元線之各別之錯誤率，來從複數之字元線而選擇第1字元線。進而，係對於被寫入至第1字元線之第1記憶體胞中之資料，而使第1編碼參數改變並實行錯誤抑制編碼而產生第2寫入資料，並基於相對於第2寫入資料之第2讀出資料之錯誤率，來設定第2編碼參數，並且對於被寫入至第1字元線之第1記憶體胞中之資料，而基於第2編碼參數來實行錯誤抑制編碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="862" publication-number="202614745"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614745.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614745</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108735</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250811B">H10B12/00</main-classification>  
        <further-classification edition="202501120250811B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>増田貴史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斉藤信美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, NOBUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡嶋睦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAJIMA, MUTSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">對於記憶體裝置之製造成本作抑制。實施形態之記憶體裝置，係包含有第1及第2導電構件、和複數之記憶體胞、以及遮蔽電極。第1及第2導電構件之各者，係於第1方向上延伸地而被作設置。第1及第2導電構件，係於第2方向上並排。複數之記憶體胞，係於第1方向上並排。複數之記憶體胞之各者，係各別包含有於第2方向上並排之第1及第2電晶體。第1電晶體，係具有閘極電極、和被與第1導電構件作電性連接之通道區域。第2電晶體，係具有被與前述第2導電構件作電性連接之通道區域、和被與前述第1電晶體之通道區域作電性連接之閘極電極。遮蔽電極，係於在第1方向上而相鄰之2個的記憶體胞之間之各者處，被與前述第2導電構件作電性連接，並且以於第1方向上而與第2電晶體之閘極電極相重疊的方式而被作了設置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10,40,41,61:絕緣體層</p>  
        <p type="p">20,21,22:導電構件</p>  
        <p type="p">30,31:半導體層</p>  
        <p type="p">50,51,52,60,70~73:導電體層</p>  
        <p type="p">GND:接地線</p>  
        <p type="p">MC:記憶體胞</p>  
        <p type="p">ML:記憶體層</p>  
        <p type="p">MR:記憶體區域</p>  
        <p type="p">RBL:讀出位元線</p>  
        <p type="p">RT1,RT2:讀出電晶體</p>  
        <p type="p">RWL:讀出字元線</p>  
        <p type="p">SH:遮蔽電極</p>  
        <p type="p">SL:隔離層</p>  
        <p type="p">SN:儲存節點</p>  
        <p type="p">WBL:寫入位元線</p>  
        <p type="p">WT:寫入電晶體</p>  
        <p type="p">WWL:寫入字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="863" publication-number="202614781"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614781.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614781</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108775</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶裝置</chinese-title>  
        <english-title>MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">H10B63/10</main-classification>  
        <further-classification edition="202301120251103B">H10N70/20</further-classification>  
        <further-classification edition="201701120251103B">H01L21/77</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩崎剛之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWASAKI, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>酒井伊都子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, ITSUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大坊忠臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIBOU, TADAOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>天野実</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMANO, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小松克伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMATSU, KATSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長嶺真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAMINE, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有特性優異之開關元件之記憶裝置。&lt;br/&gt;本發明之實施方式之記憶裝置具備記憶單元，該記憶單元包含第1導電層、第2導電層、第1導電層與第2導電層之間之第3導電層、第1導電層與第3導電層之間之開關層、以及第3導電層與第2導電層之間之電阻變化層，開關層包含選自Al、Si、Ge、Zr、Y、Ta、La、Ce、Ti、Hf及Mg中之第1元素之第1氧化物、選自Al、Zn、Sn、Ga、In及Bi中之第2元素及選自Te、S、Se及Sb中之第3元素，開關層包含第1區域、第2區域及第3區域，第1區域設置於第2區域與第3區域之間，第1區域包含第1氧化物，第2區域及第3區域包含第2元素之第2氧化物或第3元素之第3氧化物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device of embodiments includes a memory cell including a first conductive layer, a switching layer, a third conductive layer, a variable resistance layer, and a second conductive layer in this order. The switching layer contains a first oxide of a first element selected from Al, Si, Ge, Zr, Y, Ta, La, Ce, Ti, Hf, and Mg, a second element selected from Al, Zn, Sn, Ga, In, and Bi, and a third element selected from Te, S, Se, and Sb. The switching layer includes a first region, a second region, and a third region, and the first region is between the second region and the third region. The first region contains the first oxide, and the second region and the third region contain a second oxide of the second element or a third oxide of the third element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:下部電極(第1導電層)</p>  
        <p type="p">20:上部電極(第2導電層)</p>  
        <p type="p">30:中間電極(第3導電層)</p>  
        <p type="p">40:開關層</p>  
        <p type="p">41:內部區域(第1區域)</p>  
        <p type="p">42a:第1側壁區域(第2區域)</p>  
        <p type="p">42b:第2側壁區域(第3區域)</p>  
        <p type="p">50:電阻變化層</p>  
        <p type="p">51:固定層</p>  
        <p type="p">52:隧道層</p>  
        <p type="p">53:自由層</p>  
        <p type="p">55:側壁絕緣層(絕緣層)</p>  
        <p type="p">55a:第1部分</p>  
        <p type="p">55b:第2部分</p>  
        <p type="p">MC:記憶單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="864" publication-number="202614566"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614566.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614566</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108800</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路及操作積體電路的方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT AND METHOD FOR OPERATING INTEGRATED CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250703B">H03K5/24</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢野智比古</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANO, TOMOHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喻鵬飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUH, PERNG-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積體電路包括第一多工器、第二多工輸入、第一時控比較器及第二時控比較器。第一輸入節點連接至第一多工器的第一多工輸入、第二多工器的第一多工輸入、第一時控比較器的第一比較輸入及第二時控比較器的第一比較輸入。第二輸入節點連接至第一多工器的第二多工輸入及第二多工器的第二多工輸入。第一多工器的輸出連接至第一時控比較器的第二比較輸入，且第二多工器的輸出連接至第二時控比較器的第二比較輸入。積體電路亦包括連接至第一時控比較器的比較器輸出及第二時控比較器的比較器輸出的偏移控制電路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit includes a first multiplexer, a second multiplexing-input, a first clocked comparator, and a second clocked comparator. A first input node is connected to a first multiplexing-input of the first multiplexer, a first multiplexing-input of the second multiplexer, a first comparing-input of the first clocked comparator, and a first comparing-input of the second clocked comparator. A second input node is connected to a second multiplexing-input of the first multiplexer and a second multiplexing-input of the second multiplexer. An output of the first multiplexer is connected to second comparing-input of the first clocked comparator, and an output of the second multiplexer is connected to a second comparing-input of the second clocked comparator. The integrated circuit also includes an offset control circuit connected to a comparator-output of the first clocked comparator and a comparator-output of the second clocked comparator.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電壓比較器電路</p>  
        <p type="p">101:第一輸入節點</p>  
        <p type="p">102:第二輸入節點</p>  
        <p type="p">109:輸出節點</p>  
        <p type="p">110:時控比較器</p>  
        <p type="p">111:第一比較輸入</p>  
        <p type="p">112:第二比較輸入</p>  
        <p type="p">115:偏移微調輸入</p>  
        <p type="p">119:比較器輸出</p>  
        <p type="p">120:時控比較器</p>  
        <p type="p">121:第一比較輸入</p>  
        <p type="p">122:第二比較輸入</p>  
        <p type="p">125:偏移微調輸入</p>  
        <p type="p">129:比較器輸出</p>  
        <p type="p">130:多工器</p>  
        <p type="p">131:第一多工輸入</p>  
        <p type="p">132:第二多工輸入</p>  
        <p type="p">140:多工器</p>  
        <p type="p">141:第一多工輸入</p>  
        <p type="p">142:第二多工輸入</p>  
        <p type="p">150:偏移控制電路</p>  
        <p type="p">151:輸入埠</p>  
        <p type="p">152:輸入埠</p>  
        <p type="p">157:輸出埠</p>  
        <p type="p">158:輸出埠</p>  
        <p type="p">160:多工器</p>  
        <p type="p">161:第一多工輸入</p>  
        <p type="p">162:第二多工輸入</p>  
        <p type="p">CK:時脈信號</p>  
        <p type="p">OUT:輸出</p>  
        <p type="p">SEL:邏輯信號</p>  
        <p type="p">SELB:邏輯信號</p>  
        <p type="p">V&lt;sub&gt;FB&lt;/sub&gt;:反饋電壓</p>  
        <p type="p">V&lt;sub&gt;REF&lt;/sub&gt;:參考電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="865" publication-number="202613525"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613525.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613525</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108849</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>增強光致發光之系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR ENHANCING PHOTOLUMINESCENCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G01N21/64</main-classification>  
        <further-classification edition="200601120260102B">G01N21/88</further-classification>  
        <further-classification edition="200601120260102B">G01N21/95</further-classification>  
        <further-classification edition="200601120260102B">G01N21/956</further-classification>  
        <further-classification edition="200601120260102B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　葛雷斯　秀玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GRACE HSIU-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　謹桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JINSANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林智元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, JIWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種經圖案化晶圓包含一金屬基板材料、一光致發光材料及一奈米間隔件。該奈米間隔件可配置於該金屬基板材料之一表面與該光致發光材料之一表面之間。該奈米間隔件可係由一非導電奈米材料形成，該非導電奈米材料具有大於5 nm之一厚度以防止由該金屬基板材料及該光致發光材料造成的金屬誘發之淬滅。該光致發光材料可經組態以黏結至該奈米間隔件之一表面以增強該經圖案化晶圓上之一受關注特徵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A patterned wafer includes a metal substrate material, a photoluminescent material, and a nano-spacer. The nano-spacer may be arranged between a surface of the metal substrate material and a surface of the photoluminescent material. The nano-spacer may be formed of a non-conductive nanomaterial having a thickness greater than 5 nm to prevent metal-induced quenching caused by the metal substrate material and the photoluminescent material. The photoluminescent material may be configured to bind to a surface of the nano-spacer to enhance a feature of interest on the patterned wafer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">106:基板/裸晶圓/經圖案化晶圓/樣本/金屬(或金屬氧化物)CMP式IC裝置/金屬蝕刻式IC裝置/積體電路(IC)裝置</p>  
        <p type="p">200a:層/第一層</p>  
        <p type="p">200b:層/第二層</p>  
        <p type="p">202:矽材料/第一材料</p>  
        <p type="p">204:金屬材料/第二材料/金屬</p>  
        <p type="p">208:光致發光標記物/標記物</p>  
        <p type="p">210:奈米間隔件</p>  
        <p type="p">212:非導電奈米材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="866" publication-number="202614904"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614904.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614904</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108858</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷成型ＯＬＥＤ顯示器及其製造方法</chinese-title>  
        <english-title>COLD-FORMED OLED DISPLAYS AND METHODS FOR FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251229B">H10K59/80</main-classification>  
        <further-classification edition="202301120251229B">H10K77/10</further-classification>  
        <further-classification edition="200601120251229B">G09F9/33</further-classification>  
        <further-classification edition="202301120251229B">H10K71/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班傑明　杰弗里邁克爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENJAMIN, JEFFREY MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯爾　彼得史帝文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLE, PETER STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕歇爾　約瑟夫泰勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARSHALL, JOSEPH TAYLOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯圖爾特　傑森史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEWART, JASON SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>偉可　雅林李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEIKEL, ARLIN LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種顯示器，該顯示器包括具有第二主表面的蓋玻璃基板。該顯示器進一步包括有機發光二極體(「OLED」)顯示面板，該OLED顯示面板藉由光學透明黏合劑黏著至該第二主表面。框架附接至該OLED顯示面板，以將該蓋玻璃基板及該OLED顯示面板保持在彈性彎曲狀態。除可選的導熱黏合劑層之外，該OLED顯示面板與該框架之間不存在導熱率大於5 W*m&lt;sup&gt;-1&lt;/sup&gt;*K&lt;sup&gt;-1&lt;/sup&gt;的層。此外，該框架包含大於或等於15 W*m&lt;sup&gt;-1&lt;/sup&gt;*K&lt;sup&gt;-1&lt;/sup&gt;的導熱率，且用以消散該OLED顯示面板產生的熱量。當存在時，該導熱黏合劑層為負責將該OLED顯示面板保持在該彈性彎曲狀態的唯一黏合劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a display that includes a cover glass substrate with a second major surface thereof. The display further includes an organic light emitting diode ("OLED")display panel adhered to the second major surface by the optically clear adhesive. A frame is attached to the OLED display panel so as to retain the cover glass substrate and the OLED display panel in an elastically bent state. There are no layers having a thermal conductivity greater than 5 W*m&lt;sup&gt;-1&lt;/sup&gt;*K&lt;sup&gt;-1&lt;/sup&gt; between the OLED display panel and the frame other than an optional thermally conductive adhesive layer. Moreover, the frame comprises a thermal conductivity greater than or equal to 15 W*m&lt;sup&gt;-1&lt;/sup&gt;*K&lt;sup&gt;-1&lt;/sup&gt; and is configured to dissipate heat generated by the OLED display panel. When the thermally conductive adhesive layer is present, it is the sole adhesive responsible for retaining the OLED display panel in the elastically bent state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">230:OLED顯示器</p>  
        <p type="p">232:蓋玻璃基板</p>  
        <p type="p">234:第一主表面</p>  
        <p type="p">236:第二主表面</p>  
        <p type="p">238:次表面</p>  
        <p type="p">240:OLED顯示面板</p>  
        <p type="p">241:外圍邊緣</p>  
        <p type="p">242:光學透明黏合劑</p>  
        <p type="p">244:前表面</p>  
        <p type="p">245:框架</p>  
        <p type="p">247:彎曲支撐表面</p>  
        <p type="p">250:導熱黏合劑層</p>  
        <p type="p">III-III:線</p>  
        <p type="p">R:曲率半徑</p>  
        <p type="p">W:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="867" publication-number="202612938"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612938.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612938</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108883</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>汽車座椅上之側面撞擊保護</chinese-title>  
        <english-title>SIDE IMPACT PROTECTION ON CAR SEAT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">B60N2/42</main-classification>  
        <further-classification edition="200601120251001B">B60N2/427</further-classification>  
        <further-classification edition="201801120251001B">B60N2/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科林Ｆ　埃格特　克羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLIN F, EGGERT-CROWE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞繆爾　吉爾哈特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMUEL, GEARHART</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茱莉亞　彭澤克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JULIA, PONZEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於安裝在一車輛座椅上之兒童座椅包括：一座椅主體，該座椅主體具有一直立部分，該直立部分包括至少一個直立側構件；一提把，該提把連接至該座椅主體。一側面撞擊保護（SIP）裝置配置在該至少一個直立側構件之一內部表面處。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A child seat for installation on a vehicle seat includes a seat body having an upright portion including at least one upright side member and a carrying handle connected to the seat body. A side impact protection (SIP) device arranged at an interior surface of the at least one upright side member.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">18008:第一直立側構件</p>  
        <p type="p">18014:相對端</p>  
        <p type="p">18022:襯墊主體</p>  
        <p type="p">18024:軟性物品</p>  
        <p type="p">18026:內向表面</p>  
        <p type="p">18030:遠端/上端</p>  
        <p type="p">18032:脊</p>  
        <p type="p">18040:後部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="868" publication-number="202614879"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614879.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614879</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108953</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光檢測裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251230B">H10F39/18</main-classification>  
        <further-classification edition="202301120251230B">H04N25/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索尼半導體解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本儀達寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTOGI, TATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松尾純一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUO, JUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大長央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAICHO, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田路翔一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAJI, SHOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西岡優起</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIOKA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大竹悠介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTAKE, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於謀求配線電容之降低化。 &lt;br/&gt;本技術之光檢測裝置包含在俯視下由複數個像素呈陣列狀配置而成之像素陣列部。而且，上述像素陣列部包含在俯視下沿一方向彼此相鄰地排列之第1及第2像素；且上述第1像素具有：第1光電轉換部、保持在上述第1光電轉換部經光電轉換之信號電荷之第1電荷保持部、及包含閘極電極及一對主電極區域之第1像素電晶體；上述第2像素具有：第2光電轉換部、保持在上述第2光電轉換部經光電轉換之信號電荷之第2電荷保持部、及包含閘極電極及一對主電極區域之第2像素電晶體。而且，上述第1及第2像素電晶體各者之上述一對主電極區域沿上述一方向排列，且上述第1電荷保持部、上述第1電晶體、上述第2電晶體及上述第2電荷保持部各者依序沿上述一方向排列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3,3a,3b,3c,3d,3e,3f,3g,3h:像素(感測器像素)</p>  
        <p type="p">15A,15A&lt;sub&gt;1&lt;/sub&gt;,15A&lt;sub&gt;2&lt;/sub&gt;:像素塊</p>  
        <p type="p">16A,16A&lt;sub&gt;1&lt;/sub&gt;,16A&lt;sub&gt;2&lt;/sub&gt;:共有像素塊</p>  
        <p type="p">18A:電路塊</p>  
        <p type="p">21a,21b:元件形成區域</p>  
        <p type="p">22:光電轉換區域</p>  
        <p type="p">31:淺分離區域(場分離區域)</p>  
        <p type="p">41:深分離區域</p>  
        <p type="p">64a,64b,64c:配線</p>  
        <p type="p">AMP:放大電晶體</p>  
        <p type="p">DMY:虛設電晶體</p>  
        <p type="p">Q:像素電晶體</p>  
        <p type="p">RST:重置電晶體</p>  
        <p type="p">SEL:選擇電晶體</p>  
        <p type="p">X:方向/第1平面延伸部</p>  
        <p type="p">Y:方向/第2平面延伸部</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="869" publication-number="202614426"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614426.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614426</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108963</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">H01L23/522</main-classification>  
        <further-classification edition="202301120250902B">H10B41/35</further-classification>  
        <further-classification edition="202301120250902B">H10B43/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉浦春菜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIURA, HARUNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中嶌史晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAJIMA, FUMIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高須慶之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKASU, YOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之半導體裝置提高微影裕度。 一實施方式之半導體裝置具備：控制電路，其設置於基板；及複數個導電體，其等設置於位於與基板在第1方向上分開之位置之層。複數個導電體包含依序排列於第2方向上之第1導電體、第2導電體、第3導電體及第4導電體。控制電路構成為，於對第1導電體施加第1電壓之情形時，對第3導電體及第4導電體施加與第1電壓不同之第2電壓，且與第2導電體絕緣。第3導電體及第4導電體以第1間距排列於第2方向上。第1導電體、第2導電體及第3導電體以第1間距以下之第2間距排列於第2方向上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">52A,52B,52C:導電體層</p>  
        <p type="p">D0:層</p>  
        <p type="p">P1:間距</p>  
        <p type="p">W1:線寬</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="870" publication-number="202614773"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614773.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614773</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114108969</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三維半導體裝置</chinese-title>  
        <english-title>THREE-DIMENSIONAL SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251229B">H10B43/20</main-classification>  
        <further-classification edition="202301120251229B">H10B12/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴正敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUNGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜埈求</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, JUNGOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金範宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BEOM-JONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁炯碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, HYUNGSUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種三維半導體裝置可包括：一半導體圖案，其在平行於一基體之一底部表面之一第一方向上延伸；一字線，其環繞該半導體圖案之一部分且在一第二方向上延伸，該第二方向平行於該基體之該底部表面且正交於該第一方向；一位元線，其在該半導體圖案之一第一側表面上且在垂直於該基體之該底部表面之一第三方向上延伸；一電容器，其在該半導體圖案的與該第一側表面相對之一第二側表面上；以及一金屬矽化物圖案，其在該電容器與該半導體圖案之該第二側表面之間。該電容器可包括封圍該金屬矽化物圖案之一第一電極、該第一電極上之一第二電極、及該第一電極與該第二電極之間的一介電層。該第一電極可包括一金屬氧化物材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A three-dimensional semiconductor device may include a semiconductor pattern extending in a first direction parallel to a bottom surface of a substrate, a word line surrounding a portion of the semiconductor pattern and extending in a second direction, which is parallel to the bottom surface of the substrate and is orthogonal to the first direction, a bit line on a first side surface of the semiconductor pattern and extending in a third direction perpendicular to the bottom surface of the substrate, a capacitor on a second side surface of the semiconductor pattern opposite to the first side surface, and a metal silicide pattern between the capacitor and the second side surface of the semiconductor pattern. The capacitor may include a first electrode enclosing the metal silicide pattern, a second electrode on the first electrode, and a dielectric layer between the first electrode and the second electrode. The first electrode may include a metal oxide material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:基體</p>  
        <p type="p">A-A',B-B':線</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">CAP:電容器</p>  
        <p type="p">CH:通道區</p>  
        <p type="p">CIL:介電層</p>  
        <p type="p">CP1:第一覆蓋圖案</p>  
        <p type="p">CP2:第二覆蓋圖案</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向、方向</p>  
        <p type="p">DSP:資料儲存圖案</p>  
        <p type="p">EA1:第一邊緣部分</p>  
        <p type="p">EA2:第二邊緣部分</p>  
        <p type="p">EL1:第一電極</p>  
        <p type="p">EL2:第二電極</p>  
        <p type="p">Gox:閘極絕緣層</p>  
        <p type="p">PE:板電極</p>  
        <p type="p">SC:金屬矽化物圖案</p>  
        <p type="p">SP:半導體圖案</p>  
        <p type="p">SP1:第一半導體圖案</p>  
        <p type="p">SP2:第二半導體圖案</p>  
        <p type="p">WL:字線</p>  
        <p type="p">WL1:第一字線、字線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="871" publication-number="202612996"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612996.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612996</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109119</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>衛生用薄葉紙收納容器</chinese-title>  
        <english-title>SANITARY TISSUE PAPER STORAGE CONTAINER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251130B">B65D83/08</main-classification>  
        <further-classification edition="200601120251130B">B65D43/14</further-classification>  
        <further-classification edition="200601120251130B">B65D25/22</further-classification>  
        <further-classification edition="200601120251130B">B65D25/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大王製紙股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIO PAPER CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鬼澤里奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONIZAWA, RINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種衛生用薄葉紙收納容器1，其係具備容器本體10，該容器本體10係使容器本體上部11和容器本體下部12配置成可相互接觸和分離，且於容器本體上部11和容器本體下部12之間形成有供衛生用薄葉紙P收納的收納空間S；其中，於容器本體上部11的下端部設有環狀的內緣部117，而於容器本體下部12的上端部設有環狀的凹溝部121；凹溝部121係具有：嵌合部121a，係形成於其底側並具有與內緣部117之厚度大致相同的寬幅；及誘導部121b，係以其寬幅從嵌合部121a朝向該凹溝部112的開口側逐漸變寬的方式形成；內緣部117係構成為以經由誘導部121b與嵌合部121a嵌合的方式進入凹溝部121，從而遮蔽收納空間S。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a sanitary tissue paper storage container 1 that includes a container body 10, in which an upper container body 11 and a lower container body 12 are arranged in a manner that allows them to contact and separate from each other, with a storage space S for storing sanitary tissue paper P being formed therebetween. A ring-shaped inner edge portion 117 is provided at the lower end of the upper container body 11, and a ring-shaped recessed groove portion 121 is provided at the upper end of the lower container body 12. The recessed groove portion 121 has: an engagement portion 121a that is formed on the bottom side thereof and has a width approximately the same as the thickness of the inner edge portion 117; and a guide portion 121b that is formed with a width increasing gradually from the engagement portion 121a toward an opening side of the recessed groove portion 112. The inner edge portion 117 enters the recessed groove portion 121 so as to fit into the engagement portion 121a through the guide portion 121b, whereby the storage space S is shielded.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:衛生用薄葉紙收納容器</p>  
        <p type="p">2:開閉蓋</p>  
        <p type="p">3:壓鈕部</p>  
        <p type="p">10:容器本體</p>  
        <p type="p">11:容器本體上部</p>  
        <p type="p">12:容器本體下部</p>  
        <p type="p">12a:底部</p>  
        <p type="p">12R:右側面部(側面部)</p>  
        <p type="p">12L:左側面部(側面部)</p>  
        <p type="p">13:連接部</p>  
        <p type="p">116:外緣部</p>  
        <p type="p">117:內緣部</p>  
        <p type="p">118:把手部</p>  
        <p type="p">121:凹溝部</p>  
        <p type="p">122:止滑部</p>  
        <p type="p">123:卡合突起</p>  
        <p type="p">1181:卡止部</p>  
        <p type="p">1211:外周壁部</p>  
        <p type="p">1212:內周壁部</p>  
        <p type="p">1212a:第一導引部</p>  
        <p type="p">1212b:第二導引部</p>  
        <p type="p">a:間隙</p>  
        <p type="p">S:收納空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="872" publication-number="202614362"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614362.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614362</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109124</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合裝置及接合方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L23/00</main-classification>  
        <further-classification edition="201701120251230B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原慎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIWARA, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]使基板彼此的接合精度提升。 &lt;br/&gt;　　[解決手段]接合裝置，具備第1保持部、第2保持部、攝像部、調整部、溫度檢出部、控制部。第1保持部保持第1基板。第2保持部保持第2基板。攝像部攝像保持於第1保持部的第1基板或保持於第2保持部的第2基板。調整部調整保持於第1保持部的第1基板或保持於第2保持部的第2基板的水平位置。溫度檢出部檢出收容第1保持部、第2保持部、攝像部及調整部的區域中的一以上構件的溫度。控制部使用攝像部攝像第1基板及第2基板。控制部，基於攝像部的攝像結果，控制調整部將第1基板或第2基板的水平位置調整成使第1基板與第2基板接合的接合位置，第1基板或第2基板的水平位置的調整後，基於溫度檢出部的檢出結果，補正接合位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">70:控制裝置</p>  
        <p type="p">71:控制部</p>  
        <p type="p">71a:攝像處理部</p>  
        <p type="p">71b:調整處理部</p>  
        <p type="p">71c:補正部</p>  
        <p type="p">72:記憶部</p>  
        <p type="p">72a:學習資料</p>  
        <p type="p">235:上部攝像部</p>  
        <p type="p">236:下部攝像部</p>  
        <p type="p">256:調整部</p>  
        <p type="p">400:溫度檢出部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="873" publication-number="202612626"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612626.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612626</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109160</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清掃用薄片</chinese-title>  
        <english-title>CLEANING SHEET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">A47K7/00</main-classification>  
        <further-classification edition="200601120250801B">A47L13/17</further-classification>  
        <further-classification edition="200601120250801B">B32B5/26</further-classification>  
        <further-classification edition="201201120250801B">D04H1/4382</further-classification>  
        <further-classification edition="201201120250801B">D04H1/542</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大王製紙股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIO PAPER CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長野真季</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGANO, MAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的清掃用薄片100係具備：疏水性不織布層11，係至少含有疏水性纖維；親水性不織布層12，係至少含有親水性纖維，且親水性纖維的調配率大於疏水性不織布層；以及防水層13，係配置於疏水性不織布層11與親水性不織布層12之間；疏水性不織布層11、防水層13及親水性不織布層12係層疊並接合，且親水性不織布層12含浸有藥液。藉此，將清掃用薄片100的表裡區別使用，能夠以清掃用薄片100的親水性不織布層12側適當地進行地面的汙垢的擦除掃除，且能夠以清掃用薄片100的疏水性不織布層11側適當地進行捕集地面的垃圾的掃除。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cleaning sheet 100 according to the present invention is provided with a hydrophobic nonwoven fabric layer 11 that contains at least hydrophobic fibers, a hydrophilic nonwoven fabric layer 12 that contains at least hydrophilic fibers and has a higher hydrophilic fiber content than the hydrophobic nonwoven fabric layer, and a waterproof layer 13 disposed between the hydrophobic nonwoven fabric layer 11 and the hydrophilic nonwoven fabric layer 12, such that the hydrophobic nonwoven fabric layer 11, the waterproof layer 13 and the hydrophilic nonwoven fabric layer 12 are laminated and joined together, and the hydrophilic nonwoven fabric layer 12 is impregnated with a chemical solution. By doing so, front and back sides of the cleaning sheet 100 can be used separately, so that cleaning can be done conveniently in a manner where the hydrophilic nonwoven fabric layer 12 side of the cleaning sheet 100 is used to wipe off dirt from floor surface while the hydrophobic nonwoven fabric layer 11 side of the cleaning sheet 100 is used to collect dirt from the floor surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:疏水性不織布層</p>  
        <p type="p">20:壓花(接合部)</p>  
        <p type="p">21:凸壓花</p>  
        <p type="p">22:凹壓花</p>  
        <p type="p">30:黏合點(接合部)</p>  
        <p type="p">100:清掃用薄片</p>  
        <p type="p">101:清掃面部</p>  
        <p type="p">102:卡合面部</p>  
        <p type="p">S:折線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="874" publication-number="202613853"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613853.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613853</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109246</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>身分認證系統及其方法</chinese-title>  
        <english-title>IDENTITY AUTHENTICATION SYSTEM AND METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120250507B">G06F21/31</main-classification>  
        <further-classification edition="201301120250507B">G10L17/02</further-classification>  
        <further-classification edition="201301120250507B">G10L17/24</further-classification>  
        <further-classification edition="201301120250507B">G10L25/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人國家實驗研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL APPLIED RESEARCH LABORATORIES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳建明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宗漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, TSUNG-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊智喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH-CHYAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秀玫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡依庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種身分認證系統及其方法，其應用於運算處理器執行身分認證程式，以將第一語音訊號輸入至運算處理器，進一步辨識第一語音訊號，而對應產生訊號取樣資料。藉此進一步執行身分認證程式以隨機產生並輸出認證提示訊息，以依據認證提示訊息輸入第二語音訊號至運算處理器，以將第二語音訊號比對訊號取樣資料之第一訊號片段，當第二語音訊號符合第一訊號片段時，進一步進行辨識並產生對應之語意物件資料，以比對語意物件資料與認證提示訊息，以產生身分認證結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an identity authentication system and method thereof, which applied for a operational processing unit executing an identity authentication program for inputting a first voice signal to a speaker identification unit and further identifying the first voice signal to generate a corresponding signal sample data. Hereby, further executing the identity authentication program for randomly generating an authentication tip message and outputting it. Thereby, a second voice signal corresponding to the authentication tip message is inputted to the speaker identification unit and compared with a signal segment of the signal sample data. While the second voice signal matches the signal segment, the second voice signal is identified for generating a semantic object data, and the semantic object data and the authentication tip message are compared to generate an identity authentication result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10-S12:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="875" publication-number="202614841"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614841.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614841</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109552</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251001B">H10D64/01</main-classification>  
        <further-classification edition="202501120251001B">H10D62/13</further-classification>  
        <further-classification edition="202501120251001B">H10D62/17</further-classification>  
        <further-classification edition="202501120251001B">H10D64/23</further-classification>  
        <further-classification edition="202501120251001B">H10D64/27</further-classification>  
        <further-classification edition="202501120251001B">H10D30/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳品彣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PIN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許宏彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HUNG-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林威戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳佩雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PEI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張珮珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, PEI SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱立偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, LI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佩璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, PEI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀志堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI, CHIH-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧　煒業</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOH, WEI-YIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張志維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露形成半導體裝置的奈米結構電晶體的源極/汲極區域，使得空腔從源極/汲極區域的頂部延伸到源極/汲極區域中。在一些實現方式中，該空腔完全地延伸穿過源極/汲極區域的深度。該空腔由源極/汲極區域的一個或多個磊晶層的部分磊晶生長產生。在該空腔中形成源極/汲極區域的金屬核心，並且該金屬核心電性耦接到奈米結構電晶體的源極/汲極接觸件，使得導電材料在源極/汲極區域內凹陷。與如果用磊晶生長的半導體材料完全地填充源極/汲極區域的情況相比，這為源極/汲極接觸件提供了更大量的表面積來接觸源極/汲極區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A source/drain region is formed for a nanostructure transistor of a semiconductor device such that a hollow cavity extends into the source/drain region from a top of the source/drain region into the source/drain region. In some implementations, the cavity extends fully through the depth of the source/drain region. The cavity results from partial epitaxial growth of one or more epitaxial layers of the source/drain region. A metal core of the source/drain region is formed in the cavity and electrically coupled to a source/drain contact of a nanostructure transistor such that electrically conductive material is recessed within the source/drain region. This provides a greater amount of surface area for the source/drain contact to contact the source/drain region than if the source/drain region were fully filled in with epitaxially-grown semiconductor material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">105:半導體裝置</p>  
        <p type="p">160:鰭部分</p>  
        <p type="p">220:間隔件層</p>  
        <p type="p">225:閘極介電質層</p>  
        <p type="p">310:平台區域</p>  
        <p type="p">315a:奈米結構通道</p>  
        <p type="p">315b:奈米結構通道</p>  
        <p type="p">315c:奈米結構通道</p>  
        <p type="p">410a:內部間隔件</p>  
        <p type="p">410b:內部間隔件</p>  
        <p type="p">410c:內部間隔件</p>  
        <p type="p">510:源極/汲極區域</p>  
        <p type="p">515:第一磊晶層</p>  
        <p type="p">520:第二磊晶層</p>  
        <p type="p">605:介電質層</p>  
        <p type="p">610:接觸蝕刻停止層(CESL)</p>  
        <p type="p">710:閘極結構</p>  
        <p type="p">715:閘極介電質層</p>  
        <p type="p">720:金屬閘極電極</p>  
        <p type="p">805:蝕刻停止層(ESL)</p>  
        <p type="p">820:側壁襯墊</p>  
        <p type="p">830:金屬核心</p>  
        <p type="p">835:源極/汲極接觸件</p>  
        <p type="p">1005:底部隔離層</p>  
        <p type="p">1010:封蓋層</p>  
        <p type="p">1205:介面</p>  
        <p type="p">1300:示例實現方式</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="876" publication-number="202614119"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614119.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614119</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109717</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子槍零件、電子槍及電子線裝置</chinese-title>  
        <english-title>ELECTRON GUN COMPONENT, ELECTRON GUN, AND ELECTRON BEAM DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01J37/073</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木元裕紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMOTO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>会田森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIDA, SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塚田大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUKADA, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣川晋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIROKAWA, SHIMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種電子槍零件，具備：將電子發射的電子發射構件、及具有開口的抑制電極；電子發射構件，穿通該開口；在該開口的開口面及剖面中之最小面B中，相對於最小面B的半徑R2，電子發射構件所占之區域A的中心C1與最小面B的中心C2之距離D及電子發射構件的區域A之半徑R1的和之比例([(D+R1)/R2]×100)為80.0%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electron gun component of the invention comprises an electron emitting member which emits electrons and a suppressor electrode which has an opening, wherein the electron emitting member is inserted into the opening, and in a smallest surface B which is the smaller of the opening surface and the cross-section of the opening, the ratio of the sum of the distance D between the center C1 of an area A occupied by the electron source member and a center C2 of the smallest surface B and the radius R1 of the area A of the electron emitting member relative to the radius R2 of the smallest surface B ([(D+R1)/R2]×100) is not more than 80.0%.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:區域</p>  
        <p type="p">B:最小面</p>  
        <p type="p">C1,C2:中心</p>  
        <p type="p">D:距離</p>  
        <p type="p">R1,R2:半徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="877" publication-number="202613029"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613029.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613029</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109730</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳酸化粉粒體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251229B">C01B32/60</main-classification>  
        <further-classification edition="200601120251229B">C01F11/18</further-classification>  
        <further-classification edition="202201120251229B">B01F21/20</further-classification>  
        <further-classification edition="202201120251229B">B01F23/2375</further-classification>  
        <further-classification edition="202201120251229B">B01F25/10</further-classification>  
        <further-classification edition="202201120251229B">B01F25/20</further-classification>  
        <further-classification edition="202201120251229B">B01F25/45</further-classification>  
        <further-classification edition="202201120251229B">B01F25/50</further-classification>  
        <further-classification edition="202201120251229B">B01F25/4314</further-classification>  
        <further-classification edition="202201120251229B">B01F31/80</further-classification>  
        <further-classification edition="202201120251229B">B01F33/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>星野建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSHINO, TAKERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明所提供的碳酸化粉粒體之製造方法，對環境的負荷少、可穩定地操作、且可達成高碳酸化效率。本發明的碳酸化粉粒體之製造方法，係包括有：將由水與被碳酸化粉粒體C混合所成的第1流體L1、及含二氧化碳的氣體，供應至微細氣泡生成噴嘴16的步驟；從上述微細氣泡生成噴嘴16噴射出第2流體L2的步驟，該第2流體L2係在上述第1流體L1內被分散含有上述氣體之微氣泡的微細氣泡所形成；以及在上述第2流體L2內，其上述被碳酸化粉粒體C至少其中一部分，藉由利用從上述微細氣泡溶出至上述水中的二氧化碳而被碳酸化的碳酸化反應，以獲得碳酸化粉粒體的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:試料供應配管</p>  
        <p type="p">12:混合槽</p>  
        <p type="p">14:第1配管</p>  
        <p type="p">16:微細氣泡生成噴嘴(噴嘴)</p>  
        <p type="p">18:第2配管</p>  
        <p type="p">20:閥</p>  
        <p type="p">22:第3配管</p>  
        <p type="p">24:泵(送液用泵)</p>  
        <p type="p">30:氣體供應配管</p>  
        <p type="p">32:氣體供應泵</p>  
        <p type="p">34:氣體回收配管</p>  
        <p type="p">36:閥</p>  
        <p type="p">100:製造裝置</p>  
        <p type="p">C:被碳酸化粉粒體</p>  
        <p type="p">L1:第1流體</p>  
        <p type="p">L2:第2流體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="878" publication-number="202612844"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612844.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612844</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109769</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理裝置、基板研磨裝置、推論裝置、機械學習裝置、資訊處理方法、推論方法、及機械學習方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251230B">B24B37/015</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商荏原製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBARA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹昇鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN, SEUNGHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤雅佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, MASAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可提高化學機械研磨處理的基板處理品質的資訊處理裝置及方法、基板研磨裝置、推論裝置及方法、機械學習裝置及方法。資訊處理裝置（6）具備：資訊取得部（210b），取得包含表示由基板研磨裝置（2）進行由研磨墊的研磨面研磨基板的研磨處理時的研磨面的溫度分佈的測定值的測定溫度分佈資訊和表示基板研磨裝置的裝置狀態的裝置狀態資訊的基板研磨資訊；及資訊生成部（210c），將由資訊取得部取得的基板研磨資訊輸入學習模型（10A），而生成表示由基板研磨裝置進行研磨處理時的研磨面溫度調節部的控制量的研磨面溫度控制資訊。學習模型是藉由機械學習學習了基板研磨資訊與研磨面溫度控制資訊的相關關係的學習完畢模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:基板研磨裝置</p>  
        <p type="p">6:資訊處理裝置</p>  
        <p type="p">10A:學習模型</p>  
        <p type="p">26:研磨面加熱部</p>  
        <p type="p">27:研磨面冷卻部</p>  
        <p type="p">206:研磨面加熱部</p>  
        <p type="p">207:研磨面冷卻部</p>  
        <p type="p">210a:研磨處理部</p>  
        <p type="p">210b:資訊取得部</p>  
        <p type="p">210c:資訊生成部</p>  
        <p type="p">210d:機械學習部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="879" publication-number="202613646"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613646.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613646</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109793</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成像透鏡系統</chinese-title>  
        <english-title>IMAGING LENS SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G02B11/34</main-classification>  
        <further-classification edition="202101120251230B">G02B7/02</further-classification>  
        <further-classification edition="200601120251230B">G02B13/00</further-classification>  
        <further-classification edition="200601120251230B">G02B3/00</further-classification>  
        <further-classification edition="200601120251230B">G02B9/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金赫柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUK JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫住和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, JU HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡奎玟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAE, KYU MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鏞主</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YONG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種成像透鏡系統，包括第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡、第七透鏡和第八透鏡，沿著成像透鏡系統的光軸自成像透鏡系統的物體側朝向成像透鏡系統的成像平面以遞增的編號順序依序設置，其中第二透鏡具有正的折射力，第三透鏡在近軸區域具有凸的影像側表面，成像透鏡系統滿足條件表達式0.3 ＜ f/f4 ＜ 0.4，其中f是成像透鏡系統的焦距，且f4為第四透鏡的焦距。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An imaging lens system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, and an eighth lens sequentially disposed in ascending numerical order along an optical axis of the imaging lens system from an object side of the imaging lens system toward an imaging plane of the imaging lens system, wherein the second lens has a positive refractive power, the third lens has a convex image-side surface in a paraxial region thereof, and the imaging lens system satisfies the conditional expression 0.3 ＜ f/f4 ＜ 0.4, where f is a focal length of the imaging lens system, and f4 is a focal length of the fourth lens.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:成像透鏡系統</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:第六透鏡</p>  
        <p type="p">170:第七透鏡</p>  
        <p type="p">180:第八透鏡</p>  
        <p type="p">IF:濾光片</p>  
        <p type="p">IP:成像平面</p>  
        <p type="p">IS:影像感測器</p>  
        <p type="p">ST:光闌</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="880" publication-number="202614746"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614746.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614746</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109817</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置、半導體記憶裝置及半導體裝置之製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE, SEMICONDUCTOR MEMORY DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250901B">H10B12/00</main-classification>  
        <further-classification edition="202501120250901B">H10D64/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笠原佑介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASAHARA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種電晶體特性為優良之半導體裝置。 &lt;br/&gt;　　實施形態之半導體裝置，係具備有：第1電極、和第2電極、和第1電極與第2電極之間之氧化物半導體層、以及與氧化物半導體層相對向之閘極電極。閘極電極，係包含有於兩者間而包夾有氧化物半導體層之第1部分與第2部分。第1部分，係具有第1電極側之第1端部、和第2電極側之第2端部，第2部分，係具有第1電極側之第3端部、和第2電極側之第4端部。第1端部之內側與第3端部之內側之間之第1距離，係較第2端部之內側與第4端部之內側之間之第2距離而更大，第1端部之外側與第3端部之外側之間之第3距離，係較第2端部之外側與第4端部之外側之間之第2距離而更大。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device according to an embodiment includes: a first electrode; a second electrode; an oxide semiconductor layer between the first electrode and the second electrode; and a gate electrode facing the oxide semiconductor layer. The gate electrode includes a first portion and a second portion sandwiching the oxide semiconductor layer between them. The distance between an inner side of the first portion and an inner side of the second portion decreases from the first electrode side towards the second electrode side. The distance between an outer side of the first portion and an outer side of the second portion decreases from the first electrode side towards the second electrode side.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:下部電極(第1電極)</p>  
        <p type="p">14:上部電極(第2電極)</p>  
        <p type="p">16:氧化物半導體層</p>  
        <p type="p">17:空洞</p>  
        <p type="p">18a:第1部分</p>  
        <p type="p">18b:第2部分</p>  
        <p type="p">20:閘極絕緣層</p>  
        <p type="p">22:層間絕緣層</p>  
        <p type="p">100:電晶體(半導體裝置)</p>  
        <p type="p">d1:第1距離</p>  
        <p type="p">d2:第2距離</p>  
        <p type="p">d3:第3距離</p>  
        <p type="p">d4:第4距離</p>  
        <p type="p">d5:第5距離</p>  
        <p type="p">d6:第6距離</p>  
        <p type="p">E1:第1端部</p>  
        <p type="p">E2:第2端部</p>  
        <p type="p">E3:第3端部</p>  
        <p type="p">E4:第4端部</p>  
        <p type="p">P1:第1端點</p>  
        <p type="p">P2:第2端點</p>  
        <p type="p">P3:第3端點</p>  
        <p type="p">P4:第4端點</p>  
        <p type="p">P5:第5端點</p>  
        <p type="p">P6:第6端點</p>  
        <p type="p">P7:第7端點</p>  
        <p type="p">P8:第8端點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="881" publication-number="202612909"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612909.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612909</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109854</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偏光積層體</chinese-title>  
        <english-title>POLARIZING LAMINATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">B32B37/12</main-classification>  
        <further-classification edition="201901120251216B">B32B7/023</further-classification>  
        <further-classification edition="200601120251216B">B32B7/12</further-classification>  
        <further-classification edition="200601120251216B">G02B5/30</further-classification>  
        <further-classification edition="200601120251216B">G02F1/1335</further-classification>  
        <further-classification edition="200601120251216B">G02F1/13363</further-classification>  
        <further-classification edition="200601120251216B">G02F1/1337</further-classification>  
        <further-classification edition="202301120251216B">H10K59/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬杉直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMASUGI, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祖父江彰二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOBUE, SHOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供耐久性優異之偏光積層體。 &lt;br/&gt;本發明之解決手段為一種偏光積層體，其依序具備：線性偏光片、第二貼合層、第一液晶相位差層、第一貼合層、及第二液晶相位差層。第一液晶相位差層及第二液晶相位差層之至少一者或兩者含有Si原子。含有Si原子之液晶相位差層的至少1層的前述第一貼合層側表面之Si原子的原子濃度，係大於從前述液晶相位差層的前述第一貼合層側表面起在偏光積層體之積層方向上距離10nm處之Si原子的原子濃度。第二貼合層在23℃、1Hz的儲藏彈性模數為0.03MPa以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention aims to provide a polarizing laminate with excellent durability. &lt;br/&gt;Provided as a solution in the present invention is a polarizing laminate comprised of a linear polarizer, a second bonding layer, a first liquid crystal retardation layer, a first bonding layer, and a second liquid crystal retardation layer in this order. At least one or both of the first liquid crystal retardation layer and the second liquid crystal retardation layer contain Si atoms. The atomic concentration of Si atoms on the surface of the first bonding layer side in at least one of the liquid crystal retardation layers that contain Si atoms is greater than the atomic concentration of Si atoms at a point 10 nm away from said surface of the first bonding layer side in said liquid crystal retardation layers in the lamination direction of the polarizing laminate. The second bonding layer has a storage modulus of 0.03 MPa or more at 23℃ and 1 Hz.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:第一配向膜</p>  
        <p type="p">30:第一液晶相位差層</p>  
        <p type="p">40:第一貼合層</p>  
        <p type="p">50:第二液晶相位差層</p>  
        <p type="p">60:第二配向膜</p>  
        <p type="p">150:第二貼合層</p>  
        <p type="p">180:第一保護層</p>  
        <p type="p">190:第二保護層</p>  
        <p type="p">200:偏光板</p>  
        <p type="p">220:線性偏光片</p>  
        <p type="p">300:相位差層積層體</p>  
        <p type="p">400:偏光積層體(圓偏光板)</p>  
        <p type="p">500:外側黏著劑層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="882" publication-number="202614470"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614470.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614470</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109874</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251230B">H01M50/202</main-classification>  
        <further-classification edition="202101120251230B">H01M50/50</further-classification>  
        <further-classification edition="202101120251230B">H01M50/284</further-classification>  
        <further-classification edition="202101120251230B">H01M50/296</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＭＫ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷川智生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEGAWA, TOMONARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤川浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIKAWA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森勝也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, KATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種可替換傳統電池之形狀的電源裝置。 &lt;br/&gt;　　電源裝置具有：第1基板，係具有第1電極與蓄電池；第2電極；第2基板，係具有控制部；及第3基板，係配置於前述第1基板及前述第2基板之間，且在周緣的至少一部分具有與前述第2電極連接的導體部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:電源裝置</p>  
        <p type="p">210:第1基板</p>  
        <p type="p">220:第2基板</p>  
        <p type="p">223:第1天線</p>  
        <p type="p">230:第3基板</p>  
        <p type="p">240:導體殼</p>  
        <p type="p">250:光發電片</p>  
        <p type="p">1000:電源裝置</p>  
        <p type="p">1000C:中心點</p>  
        <p type="p">1000L:直線</p>  
        <p type="p">1010:第1基板</p>  
        <p type="p">1020:第2基板</p>  
        <p type="p">1023:第1天線</p>  
        <p type="p">1030:第3基板</p>  
        <p type="p">1040:導體殼</p>  
        <p type="p">1041:第2電極</p>  
        <p type="p">1042:導體殼缺口部</p>  
        <p type="p">1043:導體殼內周面</p>  
        <p type="p">1050:光發電片</p>  
        <p type="p">1052:光發電片切口部</p>  
        <p type="p">1060:雙面膠帶</p>  
        <p type="p">1070:導電膠帶</p>  
        <p type="p">1080:基板組件</p>  
        <p type="p">1082:基板缺口部</p>  
        <p type="p">1090:輔助壁部</p>  
        <p type="p">1310:密封材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="883" publication-number="202614404"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614404.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614404</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109911</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝中用於嵌入式液體冷卻的歧管設計</chinese-title>  
        <english-title>MANIFOLD DESIGNS FOR EMBEDDED LIQUID COOLING IN A PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L23/473</main-classification>  
        <further-classification edition="200601120251230B">H01L23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈巴　貝高森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HABA, BELGACEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方騰二世　蓋烏斯　吉爾曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOUNTAIN, JR., GAIUS GILLMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥卡雷米　蘿拉　威爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIRKARIMI, LAURA WILLS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　羅恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, RON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡特卡　拉杰詡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATKAR, RAJESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種裝置封裝，其包含冷卻系統。冷卻系統包含：第一基板；第一半導體裝置，其位於第一基板之第一區域上；第二半導體裝置，其位於第一基板之第二區域上；第一冷板，其附接至第一半導體裝置；第二冷板，其附接至第二半導體裝置；及歧管，其具有第一腔室容積及第二腔室容積。第一腔室容積包含：第一入口，其耦接至第一冷卻劑管線；第一出口，其耦接至第一冷板；及第二出口，其耦接至第二冷板。第二腔室容積包含：第三出口，其耦接至第二冷卻劑管線；第二入口，其耦接至第一冷板；及第三入口，其耦接至第二冷板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device package comprising a cooling system. The cooling system comprises a first substrate, a first semiconductor device located on a first region of the first substrate, a second semiconductor device located on a second region of the first substrate, a first cold plate attached to the first semiconductor device, a second cold plate attached to the second semiconductor device, and a manifold having a first chamber volume and a second chamber volume. The first chamber volume comprises a first inlet coupled to a first coolant line, a first outlet coupled to the first cold plate, and a second outlet coupled to the second cold plate. The second chamber volume comprises a third outlet coupled to a second coolant line, a second inlet coupled to the first cold plate, and a third inlet coupled to the second cold plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201:裝置封裝</p>  
        <p type="p">202:封裝基板</p>  
        <p type="p">203:整合式冷卻總成</p>  
        <p type="p">204:第一半導體裝置</p>  
        <p type="p">206:第一冷板</p>  
        <p type="p">206A:入口開口/出口開口</p>  
        <p type="p">208:封裝罩蓋</p>  
        <p type="p">208A:側壁部分</p>  
        <p type="p">208B:側向部分</p>  
        <p type="p">210:歧管</p>  
        <p type="p">210B:入口開口/出口開口</p>  
        <p type="p">212:入口開口/出口開口</p>  
        <p type="p">214:凸出特徵</p>  
        <p type="p">218:主動側</p>  
        <p type="p">219:導電凸塊</p>  
        <p type="p">220:第一半導體裝置背側</p>  
        <p type="p">221:第一底部填充層</p>  
        <p type="p">222:密封材料層</p>  
        <p type="p">222A:入口開口/出口開口</p>  
        <p type="p">224:第一組冷卻劑通道</p>  
        <p type="p">226:第一TIM</p>  
        <p type="p">232:第二冷板</p>  
        <p type="p">234:第二半導體裝置</p>  
        <p type="p">236:第二TIM</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="884" publication-number="202614622"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614622.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614622</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109936</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>場景描述中化身控制器</chinese-title>  
        <english-title>AVATAR CONTROLLERS IN SCENE DESCRIPTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251230B">H04N21/234</main-classification>  
        <further-classification edition="201101120251230B">G06T13/20</further-classification>  
        <further-classification edition="201101120251230B">H04N21/44</further-classification>  
        <further-classification edition="201101120251230B">H04N21/81</further-classification>  
        <further-classification edition="201101120251230B">H04N21/854</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商內數位ＣＥ專利控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL CE PATENT HOLDINGS, SAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈瑟蘭　菲利普亨利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOSSELIN, PHILIPPE HENRI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勒克萊爾　弗朗索瓦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LE CLERC, FRANCOIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾薇兒　昆汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVRIL, QUENTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科瓦雷加泰羅　若奧佩德羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COVA REGATEIRO, JOAO PEDRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在範例性實施方式中，3D場景之運行時素材遞送檔案（諸如，glTF檔案）包含：複數個第一語法結構，每一個第一語法結構定義輸入權重值與場景中的複數個節點中至少一者的對應變換之間的關聯性；及至少一個第二語法結構，其使分別語義標籤與第一語法結構中至少一者相關聯。在範例性方法中，獲得此一運行時素材遞送檔案；基於相關聯的語義標籤，選擇第一語法結構中至少一者；及所選第一語法結構指示的變換係應用至節點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an example embodiment, a runtime asset delivery file for a 3D scene (such as a glTF file) includes a plurality of first syntax structures, each first syntax structure defining an association between an input weight value and a corresponding transformation of at least one of a plurality of nodes in the scene; and at least one second syntax structure associating a respective semantic tag with at least one of the first syntax structures. In an example method, such a runtime asset delivery file is obtained; at least one of the first syntax structures is selected based on the associated semantic tag; and the transformation indicated by the selected first syntax structure is applied to the node.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="885" publication-number="202614491"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614491.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614491</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114109977</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>天線裝置與通訊設備</chinese-title>  
        <english-title>ANTENNA DEVICE AND COMMUNICATION APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">H01Q19/02</main-classification>  
        <further-classification edition="201501120250602B">H01Q5/30</further-classification>  
        <further-classification edition="200601120250602B">H01Q9/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>啟碁科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISTRON NEWEB CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝皓如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HAO-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇紀綱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHI-KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃健庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIEN-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種天線裝置與通訊設備。天線裝置包括底座、立件、臂部及第一輻射部。該立件連接並站立於該底座上；該臂部包括第一臂部及第二臂部，該臂部連接至該立件；該第一輻射部包括彼此對稱的第一部分及第二部分，該第一輻射部的該第一部分連接至該第一臂部，且該第一輻射部的該第二部分連接至該第二臂部。該臂部與該底座連接於該立件的不同位置，使得在垂直於該底座的方向上，該臂部與該底座之間具有距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An antenna device and a communication apparatus are provided. The antenna device includes a base, a standing member, an arm, and a first radiation portion. The standing member is connected to and stands on the base; the arm includes a first arm and a second arm, and the arm is connected to the standing member; the first radiation portion includes a first part and a second part that are symmetrical to each other, the first part of the first radiation portion is connected to the first arm, and the second part of the first radiation portion is connected to the second arm. The arm and the base are connected to different positions of the standing member, such that in a direction perpendicular to the base, there is a distance between the arm and the base.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:天線裝置</p>  
        <p type="p">202:第一輻射部</p>  
        <p type="p">202a:第一部分</p>  
        <p type="p">202b:第二部分</p>  
        <p type="p">206:臂部</p>  
        <p type="p">206a:第一臂部</p>  
        <p type="p">206b:第二臂部</p>  
        <p type="p">210:底板</p>  
        <p type="p">212:立件</p>  
        <p type="p">214:槽孔</p>  
        <p type="p">216:底座</p>  
        <p type="p">220:饋入端</p>  
        <p type="p">222:接地端</p>  
        <p type="p">H2:長度</p>  
        <p type="p">L2:長度</p>  
        <p type="p">W2:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="886" publication-number="202614910"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614910.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614910</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110002</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓電器件及電子設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251230B">H10N30/853</main-classification>  
        <further-classification edition="200601120251230B">C23C14/08</further-classification>  
        <further-classification edition="200601120251230B">C23C14/35</further-classification>  
        <further-classification edition="200601120251230B">G01N29/14</further-classification>  
        <further-classification edition="202301120251230B">H10N30/076</further-classification>  
        <further-classification edition="202301120251230B">H10N30/20</further-classification>  
        <further-classification edition="202301120251230B">H10N30/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石田守</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIDA, MAMORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂田浩一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKATA, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中井孝洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳谷隆彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANAGITANI, TAKAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泉航太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IZUMI, KOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之壓電器件，在支撐基材上依次層疊設置第一電極、壓電體層及第二電極，該壓電體層包含摻雜有Mg的ZnO類材料，相對於Zn與Mg之總量的Mg含量為13at%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:壓電器件</p>  
        <p type="p">10:支撐基材</p>  
        <p type="p">10a:上表面</p>  
        <p type="p">20A:壓電元件</p>  
        <p type="p">21:第一電極</p>  
        <p type="p">21a:上表面</p>  
        <p type="p">22:壓電體層</p>  
        <p type="p">22a:上表面</p>  
        <p type="p">23:第二電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="887" publication-number="202614234"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614234.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614234</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110028</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體用接著膜及其製造方法、切割晶粒接合一體型膜以及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/52</main-classification>  
        <further-classification edition="200601120251230B">C09J11/08</further-classification>  
        <further-classification edition="200601120251230B">C09J163/00</further-classification>  
        <further-classification edition="201801120251230B">C09J7/30</further-classification>  
        <further-classification edition="200601120251230B">H01L21/301</further-classification>  
        <further-classification edition="202301120251230B">H01L25/065</further-classification>  
        <further-classification edition="200601120251230B">H01L25/07</further-classification>  
        <further-classification edition="202301120251230B">H01L25/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桒原惇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUWAHARA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種半導體用接著膜。該半導體用接著膜含有環氧樹脂、酚醛樹脂及改質彈性體。改質彈性體為具有環氧基之彈性體與酚醛樹脂的反應產物。該半導體用接著膜可以為用於在埋入其他半導體晶片的同時，將半導體晶片接著到基板上者。該半導體用接著膜可以為用於在埋入與其他半導體晶片連接之導線的一部分或整體的同時，將半導體晶片接著到其他半導體晶片上者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:接著膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="888" publication-number="202614191"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614191.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614191</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110064</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法及基板處理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/304</main-classification>  
        <further-classification edition="201401120251230B">B23K26/53</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下陽平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]在接合有第1基板與第2基板的重合基板，適切地進行第1基板的薄化處理。 &lt;br/&gt;[解決手段]一種基板處理方法，其處理接合有第1基板與第2基板的重合基板，並包含以下步驟： &lt;br/&gt;沿著作為在該第1基板上之去除對象的周緣上部的側面，在該第1基板的內部形成第1周緣改質區域； &lt;br/&gt;沿著該周緣上部的底面，在該第1基板的內部形成第2周緣改質區域； &lt;br/&gt;以該第1周緣改質區域與該第2周緣改質區域作為基準點，從該第1基板去除該周緣上部，並使比該周緣上部還下方的周緣下部留存在該第1基板； &lt;br/&gt;研磨該第1基板中之前述被去除的該周緣上部之徑向內側的中央部； &lt;br/&gt;將該中央部受研磨之該第1基板的整面連同該周緣下部一起蝕刻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">B:刀片</p>  
        <p type="p">C1:第1龜裂</p>  
        <p type="p">C2:第2龜裂</p>  
        <p type="p">Ds,Dw:裝置層</p>  
        <p type="p">Fs,Fw:接合用膜</p>  
        <p type="p">G:研磨面</p>  
        <p type="p">M1:第1周緣改質層</p>  
        <p type="p">M2:第2周緣改質層</p>  
        <p type="p">N1:第1周緣改質區域</p>  
        <p type="p">N2:第2周緣改質區域</p>  
        <p type="p">S:第2晶圓</p>  
        <p type="p">W:第1晶圓</p>  
        <p type="p">Wb:反面</p>  
        <p type="p">Wc:中央部</p>  
        <p type="p">Wea:周緣上部</p>  
        <p type="p">Web:周緣下部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="889" publication-number="202614277"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614277.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614277</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110072</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/67</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森寛太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, KANTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緒方信博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGATA, NOBUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸本洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUMOTO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>櫻井宏紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKURAI, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢田健二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YADA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於令使用了將至少含有硫酸之處理液、含有純水的蒸氣或霧滴之流體混合而得之混合流體的基板處理實現最佳化。 &lt;br/&gt;作為上述課題之解決手段，本發明之基板處理裝置具備：基板固持部、噴嘴、流體供給部、處理液供給部、氣體供給部、及氣體流量調整部。基板固持部係以可旋轉的方式固持基板。噴嘴係與流體供給部及處理液供給部以及氣體供給部連接，並向基板噴吐流體、處理液與非活性氣體的混合流體。流體供給部係向噴嘴供給含有受加壓之純水的蒸氣或霧滴的流體。處理液供給部係向噴嘴供給至少含有硫酸的處理液。氣體供給部係向噴嘴供給非活性氣體。氣體流量調整部係調整向噴嘴供給之非活性氣體的流量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理裝置</p>  
        <p type="p">101:腔室</p>  
        <p type="p">102:基板固持部</p>  
        <p type="p">103:杯部</p>  
        <p type="p">111:風扇過濾組</p>  
        <p type="p">121:本體部</p>  
        <p type="p">122:把持部</p>  
        <p type="p">123:支柱構件</p>  
        <p type="p">124:驅動部</p>  
        <p type="p">131:排液口</p>  
        <p type="p">132:排氣口</p>  
        <p type="p">141:第1噴嘴</p>  
        <p type="p">142:第1臂部</p>  
        <p type="p">220:SPM供給路</p>  
        <p type="p">310:第1供給路</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="890" publication-number="202613995"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613995.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613995</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110155</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無人機網路或地面輔助DAA</chinese-title>  
        <english-title>NETWORK OR GROUND ASSISTED DAA FOR UAVS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251230B">G08G5/26</main-classification>  
        <further-classification edition="202501120251230B">G08G5/57</further-classification>  
        <further-classification edition="202501120251230B">G08G5/58</further-classification>  
        <further-classification edition="200901120251230B">H04W60/00</further-classification>  
        <further-classification edition="201801120251230B">H04W76/10</further-classification>  
        <further-classification edition="200601120251230B">H04B7/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商內數位專利控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿巴斯　泰穆爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABBAS, TAIMOOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛迪　沙米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FERDI, SAMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫仲濟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, JUNG JE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　光州</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, GUANZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒙拉德　阿特勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONRAD, ATLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NO</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭露用於例如無乘員（例如，無人）航空載具（UAV）應用啟用（UAE）用戶端之類的裝置執行一或更多個UAE層輔助的基於地面的偵測及避免（DAA）過程的系統、方法、及工具。裝置可將註冊請求訊息發送至伺服器。註冊請求訊息可包含區域DAA地面站（LDGS）能力。裝置可從伺服器接收註冊回應訊息。註冊回應訊息可指示註冊已成功或註冊已失敗。裝置可從伺服器接收配置請求訊息。配置請求訊息可包含與無乘員航空系統（UAS）服務供應商（USS）相關聯之配置資訊。基於配置請求訊息，裝置可對經監控UAV提供基於地面的DAA輔助。裝置可將事件報告發送至伺服器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems, methods, and instrumentalities are disclosed herein for a device, such as an uncrewed (e.g., unmanned) aerial vehicle (UAV) application enabling (UAE) client, performing one or more UAE layer assisted ground based detect and avoid (DAA) processes. The device may may send a registration request message to a server. The registration request message may include a local DAA ground station (LDGS) capability. The device may receive a registration response message from the server. The registration response message may indicate that a registration has been successful or the registration has failed. The device may receive a configuration request message from the server. The configuration request message may include configuration information associated with an uncrewed aerial system (UAS) service supplier (USS). Based on the configuration request message, the device may provide ground-based DAA assistance to a monitored UAV. The device may send an event report to the server.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">DAA:偵測及避免</p>  
        <p type="p">DAA-GS:DAA-地面站(GS)</p>  
        <p type="p">NW-DAA:DAA機制</p>  
        <p type="p">UAE:無乘員(例如，無人)航空載具(uncrewed aerial vehicle,UAV)應用啟用</p>  
        <p type="p">UAS:無乘員航空系統</p>  
        <p type="p">UAV:無乘員(例如，無人)航空載具</p>  
        <p type="p">USS:無乘員航空系統(UAS)服務供應商</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="891" publication-number="202612583"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612583.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612583</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110318</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>寵物用吸收性物品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251021B">A01K23/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商優你　嬌美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNICHARM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福元大地</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUMOTO, DAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小松原大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMATSUBARA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大西秀幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONISHI, HIDEYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>作田公香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKUDA, KIMIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據一態樣的寵物用吸收性物品是具備：本體部，具有橫長形狀，橫長形狀具有長邊方向及短邊方向，本體部包含被配置於肌膚面側的表面片、被配置在非肌膚面側的背面片、及被配置在表面片與背面片之間的吸收體；其中，本體部具有：第一端部，被配置在相對於吸收體的長邊方向的一側；及第二端部，被配置在相對於吸收體的長邊方向的另一側；接合部件，被設置於第一端部，將第一端部與第二端部接合；以及剛性片，被設置在第一端部及第二端部的至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:寵物用吸收性物品</p>  
        <p type="p">2:本體部</p>  
        <p type="p">3:前端緣</p>  
        <p type="p">4:後端緣</p>  
        <p type="p">5:第一側端緣</p>  
        <p type="p">6:第二側端緣</p>  
        <p type="p">7:第一端部</p>  
        <p type="p">8:第二端部</p>  
        <p type="p">9:中央部</p>  
        <p type="p">10:表面片</p>  
        <p type="p">30:吸收體</p>  
        <p type="p">40:防漏褶皺</p>  
        <p type="p">41:前側防漏褶皺</p>  
        <p type="p">42:前側防漏片</p>  
        <p type="p">42a:內側緣</p>  
        <p type="p">43:前側彈性部件</p>  
        <p type="p">44:橫固定部</p>  
        <p type="p">44a:前側立起線</p>  
        <p type="p">45:第一縱固定部</p>  
        <p type="p">46:第二縱固定部</p>  
        <p type="p">47:前側立起部</p>  
        <p type="p">51:後側防漏褶皺</p>  
        <p type="p">52:後側防漏片</p>  
        <p type="p">52a:內側緣</p>  
        <p type="p">53:後側彈性部件</p>  
        <p type="p">54:橫固定部</p>  
        <p type="p">54a:後側立起線</p>  
        <p type="p">55:後側立起部</p>  
        <p type="p">70:接合部件</p>  
        <p type="p">81:第一剛性片</p>  
        <p type="p">81a:外側緣</p>  
        <p type="p">82:第二剛性片</p>  
        <p type="p">82a:外側緣</p>  
        <p type="p">CL:中心線</p>  
        <p type="p">D:距離</p>  
        <p type="p">F:襟部</p>  
        <p type="p">F1:第一襟部</p>  
        <p type="p">F2:第二襟部</p>  
        <p type="p">L1,L2,L3:長度</p>  
        <p type="p">W1,W2,W3,W4:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="892" publication-number="202613834"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613834.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613834</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110339</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自主結構和功能塑性硬體</chinese-title>  
        <english-title>AUTONOMOUSLY STRUCTURALLY AND FUNCTIONALLY PLASTIC HARDWARE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G06F15/78</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商ＬＴＵ執照有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LTU LICENS AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴爾辛　傑爾克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELSING, JERKER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕尼亞瓜　克里斯蒂娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANIAGUA, CRISTINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛　喬漢　沙利什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SING CHOUHAN, SHAILESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種小晶片配置（100）。該小晶片配置（100）具備一小晶片控制平面（300），該小晶片控制平面經組態以協調該小晶片配置（100）之一或多個微系統（200），各微系統（200）包含至少一個硬體資源（112）且經組態以在內部通信介面（120）處定址。至少一個微系統與在外部通信介面（150）處定址之一微服務（400）相關聯。該微服務（400）為一獨立且鬆散耦合之軟體服務。該小晶片配置（100）具備一小晶片可塑性平面（800），該小晶片可塑性平面經組態以提供該小晶片配置（100）之意識資料，基於該意識資料而判定該小晶片配置（100）之該一或多個微系統（200）之重組態的一機會，使得基於經判定機會而提供一新微系統，且控制該小晶片控制平面（300）以部署該新微系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chiplet arrangement (100) is presented. The chiplet arrangement (100) is provided with a chiplet control plane (300) configured to orchestrate one or more microsystems (200) of the chiplet arrangement (100), each microsystem (200) comprises at least one hardware resource (112) and is configured to be addressable at the internal communications interface (120). At least one microsystem is associated with a microservice (400) addressable at the external communications interface (150). The microservice (400) is an independent and loosely coupled software service. The chiplet arrangement (100) is provided with a chiplet plasticity plane (800) configured to provide awareness data of the chiplet arrangement (100), determine an opportunity of reconfiguration of the one or more microsystems (200) of the chiplet arrangement (100) based the awareness data, cause provisioning of a new microsystem based on the determined opportunity, and control the chiplet control plane (300) to deploy the new microsystem.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:小晶片配置</p>  
        <p type="p">112:硬體資源</p>  
        <p type="p">120:內部通信介面/小晶片網路</p>  
        <p type="p">150:外部通信介面/外部介面</p>  
        <p type="p">200:微系統</p>  
        <p type="p">300:控制平面</p>  
        <p type="p">400:微服務</p>  
        <p type="p">800:可塑性平面</p>  
        <p type="p">810:意識程序</p>  
        <p type="p">820:治理模型</p>  
        <p type="p">830:隨機性模型</p>  
        <p type="p">840:學習模型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="893" publication-number="202613282"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613282.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613282</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110394</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電光學用組成物、電光學層、積層體、轉印薄膜、光波導及光調變器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">C09K19/02</main-classification>  
        <further-classification edition="200601120251230B">C09K19/20</further-classification>  
        <further-classification edition="200601120251230B">C09K19/38</further-classification>  
        <further-classification edition="200601120251230B">C09K19/60</further-classification>  
        <further-classification edition="200601120251230B">G02F1/061</further-classification>  
        <further-classification edition="200601120251230B">G02F1/13</further-classification>  
        <further-classification edition="200601120251230B">G02F1/137</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部拓海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>星野渉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSHINO, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村秀之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, HIDEYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北村拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAMURA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森田梨奈子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORITA, RINAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米川岬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEKAWA, MISAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井野雄介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INO, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種能夠形成電光學常數高且電光學常數的經時穩定性亦優異之電光學層之電光學用組成物、以及電光學層、積層體、轉印薄膜、光波導及光調變器。本發明的電光學用組成物為含有下述A～C所示之色素化合物中的至少1種色素化合物之電光學用組成物。其中，在含有下述C所示之色素化合物之情況下，進一步含有下述A、B及D所示之化合物中的至少1種化合物。&lt;br/&gt;A：具有包含介晶基之重複單元L，且在重複單元L或其他重複單元的側鏈具有交聯性基之液晶性高分子色素化合物A&lt;br/&gt;B：具有交聯性基之液晶性低分子色素化合物B&lt;br/&gt;C：不具有交聯性基之液晶性低分子色素化合物C&lt;br/&gt;D：具有交聯性基之化合物D</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p"></p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="894" publication-number="202614900"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614900.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614900</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110401</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光電轉換元件、攝像元件、光感測器、攝像元件之製造方法及化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251230B">H10K30/60</main-classification>  
        <further-classification edition="200601120251230B">C07C391/00</further-classification>  
        <further-classification edition="200601120251230B">C07D495/04</further-classification>  
        <further-classification edition="200601120251230B">C07D495/14</further-classification>  
        <further-classification edition="200601120251230B">C07D517/04</further-classification>  
        <further-classification edition="202501120251230B">H10F39/18</further-classification>  
        <further-classification edition="202301120251230B">H10K30/30</further-classification>  
        <further-classification edition="202301120251230B">H10K39/32</further-classification>  
        <further-classification edition="202301120251230B">H10K71/00</further-classification>  
        <further-classification edition="202301120251230B">H10K85/20</further-classification>  
        <further-classification edition="202301120251230B">H10K85/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金子和平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEKO, KAZUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉浦寛記</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIURA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米久田康智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEKUTA, YASUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種在接收到綠紅色光時的量子效率的電場強度依賴性低的光電轉換元件。本發明的光電轉換元件依序具有導電性膜、光電轉換膜及透明導電性膜，其中，上述光電轉換膜包含式（1）所表示之化合物。&lt;br/&gt;&lt;img align="absmiddle" height="148px" width="344px" file="ed10043.JPG" alt="ed10043.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="895" publication-number="202612884"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612884.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612884</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110403</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連續式高剪切加工裝置及使用其的低分子量聚合物的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B29B7/38</main-classification>  
        <further-classification edition="201901120251229B">B29C48/63</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商芝浦機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBAURA MACHINE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笹井裕也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAI, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯塚佳夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIZUKA, YOSHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林克憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, KATSUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山室華穂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMURO, KAHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種連續式高剪切加工裝置1，其藉由缸體部38內的螺桿21對原料聚合物10施加剪切力，將其低分子量化而形成低分子量聚合物並連續地自模部37噴出，其中，螺桿21包括高剪切加工部3，因此可對基於擠出量的低分子量聚合物的分子量進行控制，所述高剪切加工部3具有：搬送部31，將原料聚合物10搬送至模部37側，且在外周面33上包括螺紋部35；以及軸環部32，與搬送部31的模部37側鄰接，對原料聚合物10施加剪切力，且在外周面33上不包括螺紋部35。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:高剪切加工部</p>  
        <p type="p">10:原料聚合物</p>  
        <p type="p">20:滾筒</p>  
        <p type="p">21:螺桿</p>  
        <p type="p">31:搬送部</p>  
        <p type="p">32:螺紋部</p>  
        <p type="p">33:外周面</p>  
        <p type="p">35:軸環部</p>  
        <p type="p">36:充滿區域</p>  
        <p type="p">37:模部</p>  
        <p type="p">38:缸體部</p>  
        <p type="p">39:邊界</p>  
        <p type="p">L1、L2:長度</p>  
        <p type="p">X、Y、Z1、Z2:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="896" publication-number="202614899"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614899.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614899</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110415</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於噴墨列印量子點顯示器的薄膜封裝的含環氧樹脂材料平坦化層</chinese-title>  
        <english-title>EPOXY-CONTAINING MATERIAL PLANARIZATION LAYER FOR THIN FILM ENCAPSULATION OF INKJET PRINTED QUANTUM DOT DISPLAYS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251229B">H10H29/854</main-classification>  
        <further-classification edition="202501120251229B">H10H29/85</further-classification>  
        <further-classification edition="202501120251229B">H10H29/37</further-classification>  
        <further-classification edition="202501120251229B">H10H29/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西瓦南丹　庫倫代夫盧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIVANANDAN, KULANDAIVELU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美林克　尤瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MELNIK, YURIY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫健峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, JIANFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡納帕西亞潘　西法帕奇亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANAPATHIAPPAN, SIVAPACKIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　明偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, MINGWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　浩智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NG, HOU T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕逖邦德拉　納格Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIBANDLA, NAG B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露案大體而言提供了元件及其方法。該等元件包括背板。在該背板上設置至少三個發光二極體(LED)。在該背板的上表面上，在該至少三個LED之間設置有子像素隔離(SI)結構。相鄰的SI結構限定子像素的阱。該等子像素中的每個子像素的阱具有設置在其中的顏色轉換材料。平坦化層設置在該等阱內，位於該顏色轉換材料上方及該等SI結構上方。該等元件包括薄膜封裝層堆疊。該薄膜封裝層堆疊包括設置在該平坦化層上方的第一無機含矽層。有機含矽層設置在該第一無機含矽層上方。第二無機含矽層設置在該有機含矽層上方。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure generally provides devices and methods thereof. The devices include a backplane. At least three light emitting diodes (LEDs) are disposed on the backplane. Subpixel isolation (SI) structures are disposed on an upper surface of the backplane between the at least three LEDs. Adjacent SI structures define wells of subpixels. The wells of each of the subpixels have a color conversion material disposed therein. A planarization layer is disposed in the wells over the color conversion material and over the SI structures. The devices include a thin film encapsulation layer stack. The thin film encapsulation layer stack includes a first inorganic silicon-containing layer disposed over the planarization layer. An organosilicon-containing layer is disposed over the first inorganic silicon-containing layer. A second inorganic silicon-containing layer is disposed over the organosilicon-containing layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:元件</p>  
        <p type="p">102:背板</p>  
        <p type="p">104:LED</p>  
        <p type="p">104a:LED</p>  
        <p type="p">104b:LED</p>  
        <p type="p">104c:LED</p>  
        <p type="p">106:背板電極</p>  
        <p type="p">108:微型LED電極</p>  
        <p type="p">110:子像素隔離(SI)結構</p>  
        <p type="p">112:子像素</p>  
        <p type="p">112a:紅色子像素</p>  
        <p type="p">112b:綠色子像素</p>  
        <p type="p">112c:藍色子像素</p>  
        <p type="p">113a:阱</p>  
        <p type="p">113b:阱</p>  
        <p type="p">113c:阱</p>  
        <p type="p">114:顏色轉換材料</p>  
        <p type="p">114a:紅色轉換材料</p>  
        <p type="p">114b:綠色轉換材料</p>  
        <p type="p">114c:藍色轉換材料</p>  
        <p type="p">130:薄膜封裝(TFE)層</p>  
        <p type="p">134:第一無機含矽層</p>  
        <p type="p">136:有機含矽層</p>  
        <p type="p">138:第二無機含矽層</p>  
        <p type="p">140:含金屬層</p>  
        <p type="p">141:平坦化層</p>  
        <p type="p">142:上表面</p>  
        <p type="p">150:無機層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="897" publication-number="202614790"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614790.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614790</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110446</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251103B">H10D30/01</main-classification>  
        <further-classification edition="202501120251103B">H10D64/01</further-classification>  
        <further-classification edition="202501120251103B">H10D30/62</further-classification>  
        <further-classification edition="202501120251103B">H10D62/13</further-classification>  
        <further-classification edition="202501120251103B">H10D62/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳品彣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, PIN-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林威戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許宏彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HUNG-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱立偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, LI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀志堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI, CHIH-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張志維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡明興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, MING-HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張珮珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, PEI SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳佩雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PEI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了半導體裝置及其形成方法。形成用於半導體裝置的奈米結構電晶體的源極/汲極區域，使得源極/汲極區域包括金屬核心。與源極/汲極區域完全用磊晶生長的半導體材料填充的情況相比，金屬核心為要耦接源極/汲極區域的前側源極/汲極接觸件和後側源極/汲極接觸件提供了更大的表面積。由於源極/汲極區域與前側和後側的源極/汲極接觸件之間的電流流動路徑受到的限制較小，因此增加的接觸表面積提供了源極/汲極區域與前側和後側的源極/汲極接觸件之間降低的接觸電阻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A source/drain region is formed for a nanostructure transistor of a semiconductor device such that the source/drain region includes a meta core. The metal core provides a greater amount of surface area for a front side source/drain contact and a back side source/drain contact to be coupled to the source/drain region than if the source/drain region were fully filled in with epitaxially-grown semiconductor material. The increased contact surface area provides for reduced contact resistance between the source/drain region and the front side and back side source/drain contacts because of the less-restricted current flow path between the source/drain region and the front side and back side source/drain contacts.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1500:過程</p>  
        <p type="p">1510:框</p>  
        <p type="p">1520:框</p>  
        <p type="p">1530:框</p>  
        <p type="p">1540:框</p>  
        <p type="p">1550:框</p>  
        <p type="p">1560:框</p>  
        <p type="p">1570:框</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="898" publication-number="202614688"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614688.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614688</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110525</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接結構體之製造方法、連接膜、連接膜之製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING CONNECTION STRUCTURE BODY, CONNECTION FILM, AND METHOD FOR MANUFACTURING CONNECTION FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H05K3/32</main-classification>  
        <further-classification edition="200601120251230B">H01R11/01</further-classification>  
        <further-classification edition="200601120251230B">H01R43/00</further-classification>  
        <further-classification edition="200601120251230B">H05K1/14</further-classification>  
        <further-classification edition="200601120251230B">H05K1/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商迪睿合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉岡早織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIOKA, SAORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浅羽康祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASABA, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]本發明提供一種可使用接著劑層伴有印刷不足（模糊）之連接膜而高密度地安裝電子零件的連接結構體之製造方法。 &lt;br/&gt;[解決手段]於將具有第1端子5之第1電子零件3之第1端子5、與具有第2端子6之第2電子零件4之第2端子6藉由連接膜2之接著劑層11硬化而得之硬化膜11A而連接的連接結構體之製造方法中，具有：貼附步驟，其於第1電子零件3貼附連接膜2之接著劑層11；配置步驟，其隔著接著劑層11而於第1端子5上配置第2端子6；及連接步驟，其按壓第2電子零件4，使接著劑層11硬化；接著劑層11具有：本體部12，其具有特定之厚度；及錐形之傾斜部13，其形成於本體部12之寬度方向之兩端側；於貼附步驟中，於上述接著劑層11之寬度方向上，使本體部12對準第1端子5而貼附。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:連接膜</p>  
        <p type="p">3:第1電子零件</p>  
        <p type="p">4:第2電子零件</p>  
        <p type="p">5:第1端子</p>  
        <p type="p">5RL:排列方向</p>  
        <p type="p">6:第2端子</p>  
        <p type="p">10:脫模處理膜</p>  
        <p type="p">11:接著劑層</p>  
        <p type="p">11L:長邊方向</p>  
        <p type="p">12:本體部</p>  
        <p type="p">13:傾斜部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="899" publication-number="202614827"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614827.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614827</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110605</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置以及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251110B">H10D62/10</main-classification>  
        <further-classification edition="202501120251110B">H10D64/20</further-classification>  
        <further-classification edition="202501120251110B">H10D88/00</further-classification>  
        <further-classification edition="200601120251110B">H01L21/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立臺灣大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李敏鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MIN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉呈宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHENG-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種用於製造一半導體裝置的方法。該方法包含以下步驟：將一半導體層圖案化為一通道層，其中該半導體層位於一基板上的一介電層上方；移除該通道層下方的該介電層的一第一部分以轉動通道層，使得該通道層的一第一端高於該通道層的一第二端；及在該通道層上方形成一閘極結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing a semiconductor device is provided. The method includes patterning a semiconductor layer into a channel layer, wherein the semiconductor layer is over a dielectric layer on a substrate; removing a first portion of the dielectric layer below the channel layer to turn channel layer, such that have a first end of the channel layer is higher than a second end of the channel layer; and forming a gate structure over the channel layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:基板</p>  
        <p type="p">130S:表面</p>  
        <p type="p">132:通道層</p>  
        <p type="p">132L:長度</p>  
        <p type="p">132W:寬度</p>  
        <p type="p">150:閘極結構</p>  
        <p type="p">SD:源極/汲極區域</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="900" publication-number="202612749"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612749.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612749</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110622</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搖動裝置</chinese-title>  
        <english-title>SHAKING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">A61M5/31</main-classification>  
        <further-classification edition="200601120251230B">A61M5/178</further-classification>  
        <further-classification edition="200601120251230B">B01J2/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚皇任</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, HUANG-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱紹鈺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, SHAO YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊傑宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIE-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宛伶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WAN-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種搖動裝置，其中，該搖動裝置用於安置一容器組合，且包含：至少一卡合單元，該至少一卡合單元包含：一本體；以及一卡扣元件，設置於該本體上，其中，該至少一卡合單元透過該卡扣元件與該容器組合相互卡合；一主軸，該至少一卡合單元固定於該主軸上；以及一驅動元件，與該主軸耦接；其中，該驅動元件驅動該主軸以帶動該至少一卡合單元進行轉動或擺動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A shaking device is provided, wherein the shaking device is used to place a container assembly, and comprises: at least one engagement unit comprising: a body; and a buckling element disposed on the body, wherein the at least one engagement unit engages with the container assembly through the buckling element; a spindle, the at least one engagement unit fixed on the spindle; and a driving element coupled with the spindle; wherein the driving element drives the spindle to drive the at least one engagement unit to rotate or swing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:搖動裝置</p>  
        <p type="p">11:卡合單元</p>  
        <p type="p">111:本體</p>  
        <p type="p">112:卡扣元件</p>  
        <p type="p">113:凸塊</p>  
        <p type="p">114:固定元件</p>  
        <p type="p">12:主軸</p>  
        <p type="p">13:驅動元件</p>  
        <p type="p">200:容器組合</p>  
        <p type="p">RA:旋轉軸</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="901" publication-number="202614317"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614317.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614317</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110625</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬運裝置及排氣方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/677</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浅沼朋宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASANUMA, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, MASARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]本發明旨在提供一種技術，對於將基板等送入送出於用以處理基板之處理裝置的搬運裝置來說，有助於減小其佔地面積。 &lt;br/&gt;[解決手段]一種搬運裝置，將基板送入送出於用以處理基板之處理裝置；該搬運裝置具備：本體部，包含設置有搬運該基板之搬運機器人的搬運空間。該本體部具備構成該搬運空間之殼體，該殼體具有壁部、及與該壁部連結之複數柱構件。該壁部形成：前側面，連結有供用以收納該基板之容器載置之載入埠；後側面，連結有在該處理裝置所設有之加載鎖；及一對側面，將該前側面與該後側面在進深方向連結，並在寬度方向成對向。該複數柱構件中，在該後側面一側所配置之柱構件由上部構件及下部構件構成；該下部構件在該進深方向之該後側面一側之端面，相較於該上部構件在該進深方向之該後側面一側之端面，乃配置在該前側面一側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:搬運裝置</p>  
        <p type="p">101:載入埠</p>  
        <p type="p">102:本體部</p>  
        <p type="p">103:下部收納部</p>  
        <p type="p">103A:第一收納部</p>  
        <p type="p">103B:第二收納部</p>  
        <p type="p">120:殼體</p>  
        <p type="p">120A:壁部</p>  
        <p type="p">124:底壁</p>  
        <p type="p">125:頂棚壁</p>  
        <p type="p">131:分隔壁</p>  
        <p type="p">132A:開口部</p>  
        <p type="p">160:平台</p>  
        <p type="p">160a:載置面</p>  
        <p type="p">250:排氣容器</p>  
        <p type="p">260:第一風扇過濾單元(第一FFU)</p>  
        <p type="p">500:柱構件</p>  
        <p type="p">510:柱構件</p>  
        <p type="p">511:上部構件</p>  
        <p type="p">511a:後側面</p>  
        <p type="p">512:下部構件</p>  
        <p type="p">512a:後側面</p>  
        <p type="p">513:傾斜部</p>  
        <p type="p">520:樑構件</p>  
        <p type="p">600:分隔板</p>  
        <p type="p">700:排氣口</p>  
        <p type="p">710:阻流構件</p>  
        <p type="p">711:貫穿孔</p>  
        <p type="p">750:儲存裝置用排氣導管</p>  
        <p type="p">751:連通口</p>  
        <p type="p">2000:前開式晶圓盒(FOUP)</p>  
        <p type="p">E:排氣路徑</p>  
        <p type="p">R:區域</p>  
        <p type="p">S1:搬運空間</p>  
        <p type="p">S11:儲存空間</p>  
        <p type="p">S2:收納空間</p>  
        <p type="p">S21:空間</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="902" publication-number="202613063"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613063.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613063</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110641</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>烷烴之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">C07C1/24</main-classification>  
        <further-classification edition="200601120251001B">C07C7/04</further-classification>  
        <further-classification edition="200601120251001B">C07C9/00</further-classification>  
        <further-classification edition="200601120251001B">B01J21/18</further-classification>  
        <further-classification edition="200601120251001B">B01J23/40</further-classification>  
        <further-classification edition="200601120251001B">B01J29/40</further-classification>  
        <further-classification edition="200601120251001B">B01J29/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新日本理化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEW JAPAN CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高井拓夢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAI, HIROMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種烷烴之製造方法，其在低反應溫度及反應壓力下進行反應，並且抑制來自醇之碳原子減少，轉化率及選擇率優異。 &lt;br/&gt;本發明之烷烴之製造方法係由碳數8～24之醇製造烷烴，具備如下步驟：在沸石觸媒及週期表第8～10族之貴金屬之存在下，在反應溫度為160℃以上且氫氣壓力以表壓計為3 MPa以下之條件下使上述碳數8～24之醇與氫氣進行反應；上述沸石觸媒為H-beta型或H-ZSM-5型，並且二氧化矽（SiO&lt;sub&gt;2&lt;/sub&gt;）與氧化鋁（Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;）之莫耳比（SiO&lt;sub&gt;2&lt;/sub&gt;/Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;）為20～35。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="903" publication-number="202614118"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614118.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614118</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110649</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶電粒子光學模組</chinese-title>  
        <english-title>CHARGED PARTICLE-OPTICAL MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01J37/065</main-classification>  
        <further-classification edition="200601120251230B">H01J37/28</further-classification>  
        <further-classification edition="200601120251230B">H01J1/308</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文斯特拉　羅伊　拉蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VEENSTRA, ROY RAMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史莫克曼　厄文　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMAKMAN, ERWIN PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　蘇斯特　尤根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN SOEST, JURGEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於一帶電粒子光學裝置之帶電粒子光學模組，該帶電粒子光學裝置經組態以將一帶電粒子射束沿著一射束路徑引導朝向一樣本位置，該帶電粒子光學模組包含：一發射器，其經組態以沿著一源路徑發射一帶電粒子源射束；複數個帶電粒子光學板元件，其經組態以對該源射束進行操作，其中在各帶電粒子光學板元件中界定：一射束孔徑，其經組態用於使該源射束通過；及一通氣口，其經組態以提供通過該帶電粒子光學板元件之氣體傳導，以便在該帶電粒子光學模組內維持一真空；及一真空腔室，該發射器及該複數個帶電粒子光學板元件位於該真空腔室中，該真空腔室經組態以在使用中維持一源負壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A charged particle-optical module for a charged particle-optical device configured to direct a charged particle beam along a beam path towards a sample location, the charged particle-optical module comprising: an emitter configured to emit a source beam of charged particles along a source path; a plurality of charged particle-optical plate elements configured to operate on the source beam, wherein in each charged particle-optical plate element are defined: a beam aperture configured for passage of the source beam; and a vent configured to provide gas conductance through the charged particle-optical plate element, so as to maintain a vacuum within the charged particle-optical module; and a vacuum chamber in which are located the emitter and the plurality of charged particle-optical plate elements, the vacuum chamber configured to maintain, in use, a source under pressure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">60:真空腔室</p>  
        <p type="p">61:真空設備</p>  
        <p type="p">62:磁屏蔽</p>  
        <p type="p">63:真空泵</p>  
        <p type="p">64:閥</p>  
        <p type="p">201:源</p>  
        <p type="p">208:樣本</p>  
        <p type="p">231:聚光器陣列</p>  
        <p type="p">234:物鏡端陣列</p>  
        <p type="p">235:偏轉器陣列</p>  
        <p type="p">240:偵測器陣列</p>  
        <p type="p">260:準直器陣列</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="904" publication-number="202613598"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613598.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613598</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110662</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成像透鏡系統</chinese-title>  
        <english-title>IMAGING LENS SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250610B">G02B1/00</main-classification>  
        <further-classification edition="200601120250610B">G02B3/00</further-classification>  
        <further-classification edition="202101120250610B">G02B7/02</further-classification>  
        <further-classification edition="200601120250610B">G02B9/64</further-classification>  
        <further-classification edition="200601120250610B">G02B11/34</further-classification>  
        <further-classification edition="200601120250610B">G02B13/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙柱衍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, JU YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫住和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, JU HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">成像透鏡系統包括第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡，沿著成像透鏡系統的光軸自成像透鏡系統的物體側朝向成像透鏡系統的成像平面以遞增的編號順序依序設置，其中第二透鏡具有正的折射力且由玻璃材料製成，第五透鏡由塑料材料製成，成像透鏡系統滿足條件表達式f數＜2.10，f數是成像透鏡系統的f數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An imaging lens system includes a first lens, a second lens, a third lens, a fourth lens, and a fifth lens sequentially disposed in ascending numerical order along an optical axis of the imaging lens system from an object side of the imaging lens system toward an imaging plane of the imaging lens system, wherein the second lens has a positive refractive power and is made of a glass material, the fifth lens is made of a plastic material, and the imaging lens system satisfies the conditional expression f-number ＜ 2.10, where f-number is an f-number of the imaging lens system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:成像透鏡系統</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">CG:玻璃罩</p>  
        <p type="p">IF:濾光片</p>  
        <p type="p">IP:成像平面</p>  
        <p type="p">IS:影像感測器</p>  
        <p type="p">ST:光闌</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="905" publication-number="202613638"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613638.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613638</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110665</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>頭戴式顯示裝置與變焦透鏡模組</chinese-title>  
        <english-title>HEAD-MOUNTED DISPLAY DEVICE AND ZOOM LENS MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250408B">G02B7/105</main-classification>  
        <further-classification edition="200601120250408B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>解智翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIH-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種頭戴式顯示裝置與變焦透鏡模組。變焦透鏡模組包括底座、第一透鏡組、第一緩衝材、變焦帶、第二透鏡組以及第二緩衝材。第一透鏡組可滑動地組裝至底座。第一透鏡組適於沿變焦方向相對底座不轉動地滑動。第一緩衝材組裝於底座與第一透鏡組之間。變焦帶環繞於第一透鏡組的外周壁且適於在外周壁上滑動。第二透鏡組組裝至底座。第一透鏡組位於底座與第二透鏡組之間。變焦帶位於第二透鏡組與第一透鏡組之間。第二緩衝材組裝於第一透鏡組與第二透鏡組之間。變焦帶在外周壁上滑動時，變焦帶帶動第一透鏡組在變焦方向上滑動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A head-mounted display device and zoom lens module are provided. The zoom lens module includes a base, a first lens set, a first cushion, a zoom band, a second lens set and a second cushion. The first lens set is slidably assembled to the base. The first lens set is adapted to slide relative to the base without rotation along a zooming direction. The first cushion is assembled between the base and the first lens set. The zoom band surrounds an outer peripheral wall of the first lens set and is adapted to slide on the outer peripheral wall. The second lens set is assembled to the base. The first lens set is located between the base and the second lens set. The zoom band is located between the second lens set and the first lens set. The second cushion is assembled between the first lens set and the second lens set. When the zoom band slides on the outer peripheral wall, the zoom band drives the first lens set to slide in the zooming direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">52A:顯示器</p>  
        <p type="p">110:底座</p>  
        <p type="p">112:滑槽</p>  
        <p type="p">120:第一透鏡組</p>  
        <p type="p">120A:第一透鏡框</p>  
        <p type="p">120B:第一透鏡</p>  
        <p type="p">122:外周壁</p>  
        <p type="p">122A:斜向導槽</p>  
        <p type="p">124:滑塊</p>  
        <p type="p">130:第一緩衝材</p>  
        <p type="p">140:變焦帶</p>  
        <p type="p">140A:帶體</p>  
        <p type="p">140B:桿體</p>  
        <p type="p">142:滑桿</p>  
        <p type="p">144:導塊</p>  
        <p type="p">150:第二透鏡組</p>  
        <p type="p">150A:第二透鏡框</p>  
        <p type="p">150B:第二透鏡</p>  
        <p type="p">152:周向開槽</p>  
        <p type="p">160:第二緩衝材</p>  
        <p type="p">D10:變焦方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="906" publication-number="202613367"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613367.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613367</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110775</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分離式陽極腔室的洩漏偵測</chinese-title>  
        <english-title>LEAK DETECTION FOR A SEPARATED ANODE CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">C25D21/12</main-classification>  
        <further-classification edition="200601120251230B">C25D5/00</further-classification>  
        <further-classification edition="200601120251230B">C25D21/04</further-classification>  
        <further-classification edition="200601120251230B">C25D17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>托特　克里斯托夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTH, KRISTOF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬龍　泰能　德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALONE, TANNER DREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮斯　史蒂芬　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEACE, STEVE L</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西卡曼尼　尼馬爾　尚卡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIGAMANI, NIRMAL SHANKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　利平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUA, LEE PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文呈現一種用於偵測包含分離式陽極腔室的電沉積系統中的洩漏的方法。該方法包含將一分離式陽極腔室隔離。該分離式陽極腔室中的靜壓力係被調節。該分離式陽極腔室中的壓力變化係被監測。是否存在該洩漏係基於所監測的該壓力變化大於一閾值壓力變化而判斷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for detecting a leak in an electrodeposition system comprising a separated anode chamber is presented. The method comprises isolating a separated anode chamber. A static pressure in the separated anode chamber is modified. Pressure change is monitored in the separated anode chamber. Whether the leak is present is determined based on the pressure change monitored being greater than a threshold pressure change.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電沉積系統</p>  
        <p type="p">102:電鍍槽</p>  
        <p type="p">104:陽極腔室</p>  
        <p type="p">106:陰極腔室</p>  
        <p type="p">108:陽離子交換膜材</p>  
        <p type="p">109:高電阻虛擬陽極(HRVA)</p>  
        <p type="p">110:陽極</p>  
        <p type="p">111:基板</p>  
        <p type="p">112:基板支架</p>  
        <p type="p">113:基板支架移動系統</p>  
        <p type="p">114:升降器</p>  
        <p type="p">115:充電板</p>  
        <p type="p">116:陰極電連接件</p>  
        <p type="p">117:旋轉馬達</p>  
        <p type="p">120:陰極電解液儲存槽</p>  
        <p type="p">122:幫浦</p>  
        <p type="p">124:陽極電解液儲存槽</p>  
        <p type="p">126:幫浦</p>  
        <p type="p">130:計算系統</p>  
        <p type="p">140:遠端計算系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="907" publication-number="202614278"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614278.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614278</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110825</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搭載裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/67</main-classification>  
        <further-classification edition="200601120251226B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村浩二郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, KOJIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>櫻井大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKURAI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>生田敬子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKUTA, KEIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>五十井浩平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISOI, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">載台30具有支撐部31、及落差部32。支撐部31支撐第1構件10。落差部32比支撐部31更凹陷而遠離第1構件10。從第2構件20的按壓方向觀看，支撐部31的外徑L比第1構件10的外徑L1更小且比在第1構件10中被第2構件20按壓的按壓區域R1更大。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:搭載裝置</p>  
        <p type="p">10:基板(第1構件)</p>  
        <p type="p">11:電極墊</p>  
        <p type="p">20:半導體晶片(第2構件)</p>  
        <p type="p">21:凸塊(接合部)</p>  
        <p type="p">30:載台</p>  
        <p type="p">31:支撐部</p>  
        <p type="p">32:落差部</p>  
        <p type="p">33:外周支撐部</p>  
        <p type="p">35:吸附空間</p>  
        <p type="p">36:基板吸附孔</p>  
        <p type="p">37:配管</p>  
        <p type="p">38:泵</p>  
        <p type="p">40:按壓頭</p>  
        <p type="p">41:晶片吸附孔</p>  
        <p type="p">L,L1,L2:外徑</p>  
        <p type="p">R1:按壓區域</p>  
        <p type="p">R2:接合區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="908" publication-number="202614730"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614730.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614730</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110863</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置的形成方法及其結構</chinese-title>  
        <english-title>METHODS OF FORMING MEMORY DEVICE AND THE STRUCTURES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250805B">H10B10/00</main-classification>  
        <further-classification edition="202501120250805B">H10D84/85</further-classification>  
        <further-classification edition="202501120250805B">H10D88/00</further-classification>  
        <further-classification edition="202501120250805B">H10D62/60</further-classification>  
        <further-classification edition="200601120250805B">H01L21/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZHI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法，包括在第一裝置區域中及在多個第一相鄰多層堆疊之間形成第一源極/汲極凹部，以及在第二裝置區域中及在多個第二相鄰多層堆疊之間形成第二源極/汲極凹部。方法進一步包括：在第二源極/汲極凹部中及在第二相鄰多層堆疊的多個表面上形成第一介電襯墊；在第一源極/汲極凹部中選擇性地生長第一下部源極/汲極區域；移除第一介電襯墊；及在第一源極/汲極凹部中及在第一相鄰多層堆疊的多個表面上形成第二介電襯墊。在第二源極/汲極凹部中生長第二下部源極/汲極區域。接著移除第二介電襯墊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a first source/drain recess in a first device region and between first neighboring multilayer stacks, and forming a second source/drain recess in a second device region and between second neighboring multilayer stacks. The method further includes forming a first dielectric liner in the second source/drain recess and on surfaces of the second neighboring multilayer stacks, selectively growing a first lower source/drain region in the first source/drain recess, removing the first dielectric liner, and forming a second dielectric liner in the first source/drain recess and on surfaces of the first neighboring multilayer stacks. A second lower source/drain region is grown in the second source/drain recess. The second dielectric liner is then removed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10L-S:下部場效電晶體(FET)</p>  
        <p type="p">10-S:互補式場效電晶體(CFET)/靜態隨機存取記憶體互補式場效電晶體(SRAM CFET)</p>  
        <p type="p">10U-S:上部場效電晶體(FET)</p>  
        <p type="p">20:基板</p>  
        <p type="p">20':半導體條</p>  
        <p type="p">26'L:下部半導體奈米結構</p>  
        <p type="p">26'M:中間半導體奈米結構</p>  
        <p type="p">26'U:上部半導體奈米結構</p>  
        <p type="p">44:閘極間隔件</p>  
        <p type="p">54:內部間隔件</p>  
        <p type="p">56:介電隔離層</p>  
        <p type="p">62L-S:下部源極/汲極區域</p>  
        <p type="p">62U-S:上部磊晶源極/汲極區域</p>  
        <p type="p">66:第一接觸蝕刻終止層(CESL)</p>  
        <p type="p">68:第一ILD</p>  
        <p type="p">70:第二接觸蝕刻終止層(CESL)</p>  
        <p type="p">72:第二ILD</p>  
        <p type="p">78:閘極介電質</p>  
        <p type="p">80L:下部閘極電極</p>  
        <p type="p">80U:上部閘極電極</p>  
        <p type="p">81:源極/汲極接觸插塞</p>  
        <p type="p">83:源極/汲極矽化物層</p>  
        <p type="p">90L:閘極堆疊</p>  
        <p type="p">90-S:替換閘極堆疊</p>  
        <p type="p">90U:閘極堆疊</p>  
        <p type="p">92:介電硬光罩</p>  
        <p type="p">100S:靜態隨機存取記憶體(SRAM)裝置區域</p>  
        <p type="p">S1:側向間距</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="909" publication-number="202614791"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614791.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614791</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110884</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置之製造方法及製造裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260102B">H10D30/01</main-classification>  
        <further-classification edition="202501120260102B">H10D30/60</further-classification>  
        <further-classification edition="202501120260102B">H10D30/67</further-classification>  
        <further-classification edition="200601120260102B">C01G39/00</further-classification>  
        <further-classification edition="200601120260102B">C01G39/06</further-classification>  
        <further-classification edition="200601120260102B">C01G41/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦仁嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, HITOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布瀬暁志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUSE, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於，藉由使用含有碳之有機原料作為硫族元素原料對過渡金屬進行退火而形成二維材料薄膜，並且於其上層適當地形成碳層。 &lt;br/&gt;本發明係一種半導體裝置之製造方法，其包括如下步驟：形成含過渡金屬之膜；及於使用含有碳之有機原料作為硫族元素原料之硫族元素環境下對上述含過渡金屬之膜進行退火處理，使上述含過渡金屬之膜硫族元素化，形成二維材料薄膜，且於上述二維材料薄膜之上層形成碳層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:積層結構</p>  
        <p type="p">203:犧牲膜</p>  
        <p type="p">205:含過渡金屬之膜</p>  
        <p type="p">210:二維材料薄膜</p>  
        <p type="p">215:碳層</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="910" publication-number="202614156"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614156.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614156</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110928</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉由原子層沉積(ALD)的間隙填充</chinese-title>  
        <english-title>GAP FILLING BY ATOMIC LAYER DEPOSITION (ALD)</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/02</main-classification>  
        <further-classification edition="200601120251230B">C23C16/455</further-classification>  
        <further-classification edition="200601120251230B">C23C16/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩尾俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAO, TOSHIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙　建平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, JIANPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體元件製造方法係予以提供。該方法包括：提供包括圖案化結構的晶圓，圖案化結構具有頂部、底部和側壁。透過循環沉積製程可在晶圓上形成薄膜，循環沉積製程包括一個循環的：使晶圓與包括矽前驅物的第一反應物接觸，以在晶圓的圖案化結構上形成中間層；使晶圓與第二反應物接觸，以形成材料層；以及產生包括惰性氣體物種的第二電漿，以透過將惰性氣體物種非等向性地輸送至圖案化結構的頂部來對材料層改質。矽前驅物包括矽-鹵鍵。第二反應物包括由第一電漿產生的前驅物，前驅物選自由氮前驅物、氧前驅物和碳前驅物所組成之群組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of manufacturing a semiconductor device is provided. The method includes providing a wafer including a patterned structure having a top, a bottom and a sidewall. A film can be formed on the wafer by a cyclical deposition process including a cycle of contacting the wafer with a first reactant including a silicon precursor to form an intermediate layer over the patterned structure of the wafer, contacting the wafer with a second reactant to form a material layer, and generating a second plasma including an inert gas species to modify the material layer by delivering the inert gas species anisotropically towards the top of the patterned structure. The silicon precursor includes a silicon-halogen bond. The second reactant includes a precursor generated by a first plasma and selected from the group consisting of a nitrogen precursor, an oxygen precursor and a carbon precursor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:半導體元件</p>  
        <p type="p">333:圖案化結構</p>  
        <p type="p">335:頂部</p>  
        <p type="p">337:底部</p>  
        <p type="p">339:側壁</p>  
        <p type="p">343:材料層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="911" publication-number="202614728"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614728.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614728</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114110983</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>安裝裝置及安裝裝置的控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">H05K13/04</main-classification>  
        <further-classification edition="200601120250902B">H01L21/677</further-classification>  
        <further-classification edition="200601120250902B">H01L21/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱平大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAHIRA, MASARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示的安裝裝置具備：工作台，支撐基板；安裝頭，具有保持零件的管嘴、與保持管嘴並形成內部空間的殼體；第1移動裝置，使安裝頭移動；拍攝裝置，具有紅外線相機，並拍攝包含零件的第1識別記號與基板的第2識別記號的第1圖像；第2移動裝置，使拍攝裝置移動；及控制部，依據第1圖像控制第1移動裝置，零件的至少一部分對紅外線具有穿透性，管嘴具有對紅外線具有穿透性的第1穿透部，當安裝頭藉由第1移動裝置而位於第1高度時，拍攝裝置可藉由第2移動裝置而移動至拍攝裝置的前端位於殼體的內部空間的拍攝位置，並從拍攝位置透過第1穿透部拍攝第1圖像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:安裝裝置</p>  
        <p type="p">5:安裝頭</p>  
        <p type="p">6:拍攝裝置</p>  
        <p type="p">6A:前端</p>  
        <p type="p">8:工作台</p>  
        <p type="p">11:零件</p>  
        <p type="p">12:基板</p>  
        <p type="p">51:吸附管嘴</p>  
        <p type="p">52:殼體</p>  
        <p type="p">53:貫通孔</p>  
        <p type="p">54:貫通孔</p>  
        <p type="p">59:第1移動裝置(移動裝置)</p>  
        <p type="p">62:相機</p>  
        <p type="p">63:筒構件</p>  
        <p type="p">64:反射光學系</p>  
        <p type="p">69:第2移動裝置(移動裝置)</p>  
        <p type="p">71A:識別記號</p>  
        <p type="p">71B:識別記號</p>  
        <p type="p">72A:識別記號</p>  
        <p type="p">72B:識別記號</p>  
        <p type="p">K1:內部空間</p>  
        <p type="p">G1:間隔</p>  
        <p type="p">G2:尺寸</p>  
        <p type="p">H3:第3高度</p>  
        <p type="p">H4:攝像高度</p>  
        <p type="p">P11:拍攝位置</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="912" publication-number="202613502"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613502.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613502</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111003</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>流量測定裝置及流體控制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251229B">G01F25/10</main-classification>  
        <further-classification edition="200601120251229B">G05D7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士金股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIKIN INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川慎也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平田薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRATA, KAORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西野功二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHINO, KOUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">設在流量控制裝置(20)的上游側之流量測定裝置(10)，具備：第1上游開關閥(V1)；設在第1上游開關閥的下游側之第2上游開關閥(V2)；測定第2上游開關閥的下游側的流體壓力之供給壓力感測器(12)；及連接於第1上游開關閥、第2上游開關閥及供給壓力感測器之處理電路(16)，使用在第2上游開關閥已被打開的狀態下，基於關閉第1上游開關閥後的供給壓力感測器之輸出所測定到的第1壓力下降率S、基於關閉第2上游開關閥後的供給壓力感測器之輸出所測定到的第2壓力下降率S’、第1上游開關閥與第2上游開關閥之間的已知容積Va、及與流體的種類、壓力及溫度相關聯的氣體壓力係數z，測定流量Q。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:氣體供給源</p>  
        <p type="p">4:流路</p>  
        <p type="p">6:止回閥</p>  
        <p type="p">8:處理室</p>  
        <p type="p">9:真空泵浦</p>  
        <p type="p">10:流量測定裝置</p>  
        <p type="p">12:供給壓力感測器</p>  
        <p type="p">14:溫度感測器</p>  
        <p type="p">16:處理電路</p>  
        <p type="p">20:流量控制裝置</p>  
        <p type="p">50:流體控制裝置</p>  
        <p type="p">100:氣體供給系統</p>  
        <p type="p">V1:第1上游開關閥</p>  
        <p type="p">V2:第2上游開關閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="913" publication-number="202614706"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614706.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614706</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111012</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>層架輔助結構</chinese-title>  
        <english-title>SHELVES AUXILIARY STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250602B">H05K7/14</main-classification>  
        <further-classification edition="200601120250602B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光寶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳正宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHENG-ZONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許泓錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HUNG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊期閎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, QI-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種層架輔助結構，包括: 第一支撐件、第二支撐件、第一轉接件、第二轉接件、第一連桿、第一快拆連接組件及第二快拆連接組件。第一支撐件和第二支撐件固定於層架的外框上，且彼此分離；第一轉接件固定於第一支撐件上。第二轉接件固定於第二支撐件上。第一連桿橫跨於第一支撐件和第二支撐件之間，並分別與第一支撐件和第二支撐件形成第一銳角和第二銳角。第一快拆連接組件設於第一連桿的第一端，並與第一轉接件可拆地連接。第二快拆連接組件，設於第一連桿的第二端，並與第二轉接件可拆地連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A shelf auxiliary structure includes: a first support member, a second support member, a first adapter, a second adapter, a first connecting rod, a first quick-release connection component and a second quick-release connection component. The first support member and the second support member are fixed on an outer frame of a shelf and separated from each other. The first adapter member is fixed on the first support member. The second adapter is fixed on the second support. The first connecting rod spans between the first support member and the second support member, and forms a first acute angle and a second acute angle with the first support member and the second support member respectively. The first quick-release connection component is disposed at the first end of the first connecting rod and is detachably connected to the first adapter. The second quick-release connecting component is disposed at the second end of the first connecting rod and is detachably connected to the second adapter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:層架結構</p>  
        <p type="p">10F:外框</p>  
        <p type="p">11:層架結構</p>  
        <p type="p">11F:外框</p>  
        <p type="p">110:第一支撐件</p>  
        <p type="p">110S:第一結合面</p>  
        <p type="p">110R:第一轉接面</p>  
        <p type="p">110L:第一長軸</p>  
        <p type="p">110O:第一開口</p>  
        <p type="p">111:螺栓</p>  
        <p type="p">113:第三開口</p>  
        <p type="p">120:第二支撐件</p>  
        <p type="p">120S:第二結合面</p>  
        <p type="p">120R:第二轉接面</p>  
        <p type="p">120L:第二長軸</p>  
        <p type="p">120O:第二開口</p>  
        <p type="p">124:讓位開口</p>  
        <p type="p">130:第一轉接件</p>  
        <p type="p">137:第一插銷</p>  
        <p type="p">140:第二轉接件</p>  
        <p type="p">147:第二插銷</p>  
        <p type="p">148:第三插銷</p>  
        <p type="p">150:第一連桿</p>  
        <p type="p">150A:第一端</p>  
        <p type="p">151A:第一貫通孔</p>  
        <p type="p">150B:第二端</p>  
        <p type="p">151B:第二貫通孔</p>  
        <p type="p">160:第一快拆連接組件</p>  
        <p type="p">170:第二快拆連接組件</p>  
        <p type="p">180:第二連桿</p>  
        <p type="p">180A:第三端</p>  
        <p type="p">180B:第四端</p>  
        <p type="p">190:第三轉接件</p>  
        <p type="p">197:第四插銷</p>  
        <p type="p">201:併架元件</p>  
        <p type="p">210:第三快拆連接組件</p>  
        <p type="p">220:第四快拆連接組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="914" publication-number="202614464"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614464.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614464</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111108</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>全固態電池及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251230B">H01M10/0583</main-classification>  
        <further-classification edition="201001120251230B">H01M10/0585</further-classification>  
        <further-classification edition="201001120251230B">H01M10/0562</further-classification>  
        <further-classification edition="202101120251230B">H01M50/533</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商科納維股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANADEVIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河瀬弘和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASE, HIROKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種不易產生能量密度的下降的積層型的全固態電池。全固態電池包括積層有正極層（31）和負極層（32）的多個積層體（3）、正極集電體（4）及負極集電體（6）。在經積層的多個積層體（3）間，正極層（31）彼此及負極層（32）彼此相向。正極集電體（4）以接觸至第一積層體（3）的正極層（31）、及積層於第一積層體（3）的第二積層體（3）的正極層（31）的方式，沿著第一積層體（3）及第二積層體（3）的其中一個側面（3a）而翻折。負極集電體（6）以接觸至第二積層體（3）的負極層（32）、及積層於第二積層體（3）的第三積層體（3）的負極層（32）的方式，沿著與其中一個側面（3a）為不同側的、第二積層體（3）及第三積層體（3）的另一個側面（3b）而翻折。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電池單元</p>  
        <p type="p">3:積層體(第一積層體:第三積層體)</p>  
        <p type="p">3a:側面(第一側面)</p>  
        <p type="p">3b:側面(第二側面)</p>  
        <p type="p">4、5:正極集電體</p>  
        <p type="p">4a:極耳(第一極耳)</p>  
        <p type="p">6:負極集電體</p>  
        <p type="p">6a:極耳(第二極耳)</p>  
        <p type="p">7、8:密封劑</p>  
        <p type="p">10:絕緣部</p>  
        <p type="p">11:絕緣層</p>  
        <p type="p">12:黏合層</p>  
        <p type="p">31:正極層(第一電極層)</p>  
        <p type="p">32:負極層(第二電極層)</p>  
        <p type="p">33:固態電解質層</p>  
        <p type="p">41、61:接觸部</p>  
        <p type="p">42、62:翻折部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="915" publication-number="202614279"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614279.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614279</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111120</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>溼式蝕刻半導體晶圓的方法及晶圓處理系統</chinese-title>  
        <english-title>METHOD AND WAFER PROCESSING SYSTEM FOR WET ETCHING A SEMICONDUCTOR WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/67</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡　山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種蝕刻半導體晶圓的方法及晶圓處理系統。該方法包含確定半導體晶圓的晶圓表面的一部分，該部分比晶圓表面的剩餘部分需要更高的蝕刻速率，將液態蝕刻溶液沉積至半導體晶圓的晶圓表面上，以及將熱能施加至覆蓋晶圓表面的已確定部分的液態蝕刻溶液，以增加晶圓表面的已確定部分的局部溫度，以及覆蓋晶圓表面的已確定部分的液態蝕刻溶液的蝕刻速率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and wafer processing system for etching a semiconductor wafer are provided. The method includes determining a portion of a wafer surface of the semiconductor wafer that requires a higher etch rate than a remaining portion of the wafer surface, depositing a liquid etch solution onto the wafer surface of the semiconductor wafer, and applying a heat energy to the liquid etch solution covering the determined portion of the wafer surface to increase a local temperature of the determined portion of the wafer surface and an etch rate of the liquid etch solution covering the determined portion of the wafer surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:半導體製程</p>  
        <p type="p">S910:步驟</p>  
        <p type="p">S920:步驟</p>  
        <p type="p">S930:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="916" publication-number="202614338"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614338.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614338</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111125</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用熱接觸晶粒形狀控制的晶粒對晶圓接合方法及設備</chinese-title>  
        <english-title>DIE TO WAFER BONDING METHOD AND APPARATUS WITH THERMAL CONTACT DIE SHAPE CONTROL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L21/683</main-classification>  
        <further-classification edition="200601120260102B">H01L21/67</further-classification>  
        <further-classification edition="200601120260102B">H01L21/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達沙爾　漢斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D'ACHARD, HANS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德維利耶　安東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEVILLIERS, ANTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　阿呂安　哈傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN HALEWIJN, HELGER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古爾能沃德　簡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GROENEWOLD, JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪克克斯　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIRKX, JOHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　德　布林克　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DEN BRINK, MAARTEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　葛因斯文　德克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN GRINSVEN, DIRK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康克林　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONKLIN, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舍皮斯　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHEPIS, ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑爾　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POWER, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容的實施態樣提供當夾持半導體結構時加熱半導體結構的設備。舉例而言，設備可包括配置以夾持半導體結構的半導體結構夾持裝置。設備亦可包括配置以產生特定形態之熱的加熱裝置。可將加熱裝置與半導體結構夾持裝置整合使得當半導體結構夾持裝置夾持半導體結構時，可將藉由加熱裝置所產生的特定形態之熱施加至半導體結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aspects of the present disclosure provide an apparatus that heats a semiconductor structure while holding the semiconductor structure. For example, the apparatus can include a semiconductor structure holding device that is configured to hold the semiconductor structure. The apparatus can also include a heating device that is configured to generate a certain pattern of heat. The heating device can be integrated with the semiconductor structure holding device such that when the semiconductor structure holding device is holding the semiconductor structure, the certain pattern of heat generated by the heating device can be applied to the semiconductor structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">230:半導體結構夾持裝置(夾爪)</p>  
        <p type="p">490:失真晶粒</p>  
        <p type="p">491:犧牲載體基板</p>  
        <p type="p">492:目標晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="917" publication-number="202612902"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612902.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612902</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111138</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多層體、多層體之製造方法、印刷配線板、半導體裝置、及印刷配線板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251220B">B32B5/28</main-classification>  
        <further-classification edition="200601120251220B">B32B17/04</further-classification>  
        <further-classification edition="200601120251220B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林宇志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鎌田悠仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMATA, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷部恵一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEBE, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鹿島直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASHIMA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富澤克哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMIZAWA, KATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平野俊介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRANO, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤禎啓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供可達成傳輸損失之減低的多層體、以及多層體、多層體之製造方法、印刷配線板、半導體裝置、及印刷配線板之製造方法。一種多層體，具有第一絕緣樹脂層、及接觸該絕緣樹脂層之第二絕緣樹脂層，該第二絕緣樹脂層之藉由擾動法空腔共振器測定之於頻率10GHz之介電損耗正切係比該第一絕緣樹脂層之該介電損耗正切更低。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="918" publication-number="202614153"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614153.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614153</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111146</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高效能適應型採樣系統</chinese-title>  
        <english-title>HIGH-PERFORMANCE ADAPTABLE SAMPLING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">H01J49/06</main-classification>  
        <further-classification edition="200601120251216B">H01J49/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施勒希特　查爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHLECHTE, CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙　建平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, JIANPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡默爾　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUMMEL, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據實施例，提出了一種電漿處理系統。電漿處理系統包括電漿處理腔室；經由孔口連接到腔室的二腔室泵送區塊，孔口經由壓力差產生粒子束，其上方的壓力由連接的真空泵調節；一個探測器級，偵測器台經由另一孔口連接到泵送區塊，並可連接到真空泵以引導粒子束通過第三孔口；經由第三孔口連接到偵測器台的質譜儀，質譜儀具有電離器，電離器藉由循環多個階躍的能階來電離粒子束的物質；以及安裝在泵送區塊的粒子束路徑上的快門，快門設計用於在每一能階階躍時操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to an embodiment, a plasma processing system is proposed. The plasma processing system includes a processing chamber for plasma; a two-chambered pumping block linked to the chamber through an orifice that creates a particle beam via a pressure difference, with the upper pressure regulated by a connected vacuum pump; a detector stage attached to the pumping block through another orifice and connectable to a vacuum pump to guide the beam through a third orifice; a mass spectrometer connected to the detector stage via the third orifice, featuring an ionizer that ionizes the beam's species by cycling through energy levels in multiple steps; and a shutter installed in the pumping block's path of the particle beam, designed to operate at each energy level step.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">106:處理腔室</p>  
        <p type="p">126:採樣孔</p>  
        <p type="p">200:採樣系統</p>  
        <p type="p">203:採樣腔室</p>  
        <p type="p">204:聚焦腔室</p>  
        <p type="p">206:第一孔徑</p>  
        <p type="p">208:泵送區塊</p>  
        <p type="p">210:第二孔徑</p>  
        <p type="p">212:偵測器台</p>  
        <p type="p">214:較小孔</p>  
        <p type="p">216:離子拒斥器</p>  
        <p type="p">218:快門機構</p>  
        <p type="p">220:較小開口</p>  
        <p type="p">222:第一腔室</p>  
        <p type="p">224:第二腔室</p>  
        <p type="p">226:排氣口</p>  
        <p type="p">228:較大開口</p>  
        <p type="p">230:分子束路徑</p>  
        <p type="p">232:向外粒子流</p>  
        <p type="p">234:較大開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="919" publication-number="202613164"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613164.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613164</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111172</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以抗IL-1β抗體治療化膿性汗腺炎之方法</chinese-title>  
        <english-title>METHODS OF TREATING HIDRADENITIS SUPPURATIVA WITH ANTI-IL-1BETA ANTIBODIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/24</main-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="200601120260102B">A61P17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商阿法羅醫療股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVALO THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼爾　蓋瑞　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEIL, GARRY A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬特科夫斯基　柯林　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATKOWSKI, COLLEEN D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫格　麗莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEGG, LISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於以抗IL-1β抗體治療化膿性汗腺炎之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to methods of treating hidradenitis suppurativa with anti-IL-1β antibodies.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="920" publication-number="202614106"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614106.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614106</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111304</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>能夠用於液浸式冷卻的電容器及其製造方法、液浸式冷卻方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01G9/10</main-classification>  
        <further-classification edition="200601120251230B">H01G9/00</further-classification>  
        <further-classification edition="200601120251230B">H01G9/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本貴彌功股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON CHEMI-CON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田博昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千才大蔵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENZAI, DAIZOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部浩大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, KOHTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供一種減少意外的劣化的產生、可靠性高且長壽命的能夠用於液浸式冷卻的電容器及其製造方法。一種能夠用於液浸式冷卻的電容器3000，包括電容器元件1400、電解質、收容電容器元件1400及電解質的殼體1300、以及對殼體的開口部進行密封的封口體1000，封口體1000包括：內側彈性構件，配置於殼體1300的內側且至少其一部分與電解質接觸；以及外側彈性構件，至少其一部分自殼體露出，所述封口體1000為互不相同的彈性構件積層而成的結構，內側彈性構件為選自由丁基橡膠、乙丙橡膠所組成的群組中的一種以上，外側彈性構件與烴系冷卻劑的漢森溶解度參數距離為8.0以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:封口體</p>  
        <p type="p">1100:丁腈橡膠(NBR)層</p>  
        <p type="p">1150:引線端子插通孔</p>  
        <p type="p">1200:丁基橡膠(IIR)層</p>  
        <p type="p">D:直徑</p>  
        <p type="p">H1、H2:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="921" publication-number="202614694"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614694.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614694</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111311</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電路板及具有其之封裝基板</chinese-title>  
        <english-title>CIRCUIT BOARD AND PACKAGE SUBSTRATE HAVING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H05K3/46</main-classification>  
        <further-classification edition="200601120251230B">H01L23/498</further-classification>  
        <further-classification edition="200601120251230B">H01Q1/38</further-classification>  
        <further-classification edition="200601120251230B">H05K1/02</further-classification>  
        <further-classification edition="200601120251230B">H05K1/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金相日</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SANG IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許愃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEO, SEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李東華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DONG HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫妏暎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, MUN YEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電路板，包括：一第一絕緣部，其中一第一絕緣層與一第一導電膜交替積層；一第二絕緣部，設於第一絕緣部上，且一第二絕緣層與一第二導電膜交替積層；及一中間層，置於該第一絕緣部與該第二絕緣部之間的，其中，該第二絕緣層的一第二介電常數與該第一絕緣層的一第一介電常數不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present invention disclose a circuit board which includes a first insulating portion in which first insulating layers and first conductive films are alternately laminated, a second insulating portion which is disposed on the first insulating portion and in which second insulating layers and second conductive films are alternately laminated, and an intermediate layer disposed between the first insulating portion and the second insulating portion, wherein a second dielectric constant of the second insulating layer is different from a first dielectric constant of the first insulating layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電路板</p>  
        <p type="p">111:第一絕緣部</p>  
        <p type="p">111a:1-1絕緣層</p>  
        <p type="p">111b:1-2絕緣層</p>  
        <p type="p">111c:1-3絕緣層</p>  
        <p type="p">111d:1-4絕緣層</p>  
        <p type="p">111e:第一導電膜</p>  
        <p type="p">111e1:樹脂</p>  
        <p type="p">111e2:導電球</p>  
        <p type="p">112:第二絕緣部</p>  
        <p type="p">112a:2-1絕緣層</p>  
        <p type="p">112b:2-2絕緣層</p>  
        <p type="p">112c:2-3絕緣層</p>  
        <p type="p">112d:2-4絕緣層</p>  
        <p type="p">112e:第二導電膜</p>  
        <p type="p">112e1:樹脂</p>  
        <p type="p">112e2:導電球</p>  
        <p type="p">113:中間層</p>  
        <p type="p">120:第一電極部</p>  
        <p type="p">121:第一互連電極</p>  
        <p type="p">122:第一通孔電極</p>  
        <p type="p">130:第二電極部</p>  
        <p type="p">131:第二互連電極</p>  
        <p type="p">132:第二通孔電極</p>  
        <p type="p">140:第三電極部</p>  
        <p type="p">141:第三互連電極</p>  
        <p type="p">142:第三通孔電極</p>  
        <p type="p">BA:下部區域</p>  
        <p type="p">K1:部</p>  
        <p type="p">K2:部</p>  
        <p type="p">K3:部</p>  
        <p type="p">UA:上部區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="922" publication-number="202613449"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613449.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613449</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111408</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>賦形膜、積層體、附導光層之積層體、及照明裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251230B">F21S2/00</main-classification>  
        <further-classification edition="200601120251230B">B29C59/02</further-classification>  
        <further-classification edition="200601120251230B">B29C59/04</further-classification>  
        <further-classification edition="200601120251230B">F21V8/00</further-classification>  
        <further-classification edition="200601120251230B">G02B5/02</further-classification>  
        <further-classification edition="200601120251230B">G02B6/00</further-classification>  
        <further-classification edition="200601120251230B">G02F1/13357</further-classification>  
        <further-classification edition="201601320251230B">F21Y115/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>百足山真平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKADEYAMA, SHIMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉川貴博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIKAWA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於減少亮度不均。本賦形膜係具有主表面之光學用賦形膜，且於上述主表面，將具有使光全反射之傾斜面之複數個凹部以第1週期P1排列於形成方向，且將複數個凸部以第2週期P2排列於上述形成方向，於將上述凹部之最大深度設為Dx，將上述凸部之最大高度設為Hx時，Hx/Dx為4%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">62:賦形膜</p>  
        <p type="p">65:凸部</p>  
        <p type="p">621:主表面</p>  
        <p type="p">622:凹部</p>  
        <p type="p">C11,C12,C21,C22:中心</p>  
        <p type="p">Hx:最大高度</p>  
        <p type="p">P1:第1週期</p>  
        <p type="p">P2:第2週期</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="923" publication-number="202614003"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614003.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614003</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111504</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>折疊式電子裝置</chinese-title>  
        <english-title>FOLDABLE ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">G09F9/30</main-classification>  
        <further-classification edition="200601120251231B">G06F1/16</further-classification>  
        <further-classification edition="200601120251231B">F16C11/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>信錦企業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYNCMOLD ENTERPRISE CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉建成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHIEN CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞伯璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本創作提供一種折疊式電子裝置，包括中央基座、樞軸模組、二面板本體、二傳動件、二連接件、同步模組、彈性模組以及可撓式螢幕。樞軸模組設於中央基座，面板本體相對中央基座樞轉，傳動件連接樞軸模組、同步模組及彈性模組，連接件連接面板本體及傳動件，同步模組帶動傳動件同步反轉，彈性模組連接樞軸模組，可撓式螢幕設置於中央基座及面板本體，並包含可彎折區。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a foldable electronic device, comprising: a central base, a pivot module, two panel bodies, two driving parts, two connecting parts, a synchronization module, an elastic module and a foldable display. The pivot module provided in the central base. The panel bodies pivoted relative to the central base. The driving parts connected to the pivot module, the synchronization module and the elastic module. The connecting parts connected to the panel bodies and the driving parts. The synchronization module drove the driving parts to reverse synchronously. The elastic module connected to the pivot module. The foldable display provided on the central base and the panel bodies, and included a bent area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:中央基座</p>  
        <p type="p">12:第一弧形滑塊</p>  
        <p type="p">13:第二弧形滑塊</p>  
        <p type="p">14:外殼</p>  
        <p type="p">2:樞軸模組</p>  
        <p type="p">31:第一翼件</p>  
        <p type="p">311:第一翼本體</p>  
        <p type="p">312:第一弧形滑道</p>  
        <p type="p">313:第一連桿部</p>  
        <p type="p">3131:第一樞接孔</p>  
        <p type="p">3132:第一桿體</p>  
        <p type="p">314:第一容置槽</p>  
        <p type="p">4:第一傳動件</p>  
        <p type="p">5:第一連接件</p>  
        <p type="p">61:第二翼件</p>  
        <p type="p">611:第二翼本體</p>  
        <p type="p">612:第二弧形滑道</p>  
        <p type="p">613:第二連桿部</p>  
        <p type="p">6131:第二樞接孔</p>  
        <p type="p">6132:第二桿體</p>  
        <p type="p">614:第二容置槽</p>  
        <p type="p">7:第二傳動件</p>  
        <p type="p">8:第二連接件</p>  
        <p type="p">9:同步模組</p>  
        <p type="p">A:彈性模組</p>  
        <p type="p">V3:第一外虛擬軸線</p>  
        <p type="p">V4:第二外虛擬軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="924" publication-number="202612893"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612893.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612893</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111580</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙射注塑模具</chinese-title>  
        <english-title>DUAL INJECTION MOLD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250407B">B29C45/26</main-classification>  
        <further-classification edition="200601120250407B">B29C45/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商立訊智造科技（常熟）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUXSHARE INTELLIGENT MANUFACTURE TECHNOLOGY (CHANGSHU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫響</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸新林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, XINLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種雙射注塑模具，涉及多材料注塑模具技術領域。雙射注塑模具包括公模、第一母模和第二母模。公模開設有成型槽，成型槽的底部開設有切換孔，公模轉動設置有第一成型入子和第二成型入子。第一母模能夠扣合於公模，並驅動第一成型入子轉動以封堵切換孔，第一母模與第一成型入子抵接以在成型槽內成型具有通孔的一射産品。第二母模能夠扣合於公模，並驅動第二成型入子轉動以封堵切換孔，第二母模、第二成型入子以及一射産品形成成型腔，以在通孔內成型二射産品。雙射注塑模具能夠保證二射産品的表面光潔度，優化産品外觀，提高了産品良率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a dual injection mold, and is related to the technical field of multi-material injection mold. The dual injection mold includes a core, a first cavity and a second cavity. The core has a molding slot, the bottom of the molding slot has a switch hole, and a first molding insert and a second molding insert are rotatably disposed on the core. The first cavity can be fastened to the core and drives the first molding insert to rotate to seal the switch hole. The first cavity contacts the first molding insert to mold a first injection product with a through hole inside the molding slot. The second cavity can be fastened to the core and drives the second molding insert to rotate to seal the switch hole. The second cavity, the second molding insert and the first injection product forms the molding slot to mold a second injection product in the through hole. The dual injection mold can ensure the surface cleanness of the second injection product, optimizes the appearance of the product, and improves the yield rate of the product.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:公模</p>  
        <p type="p">12:成型槽</p>  
        <p type="p">14:第一成型入子</p>  
        <p type="p">15:第二成型入子</p>  
        <p type="p">16:公模本體</p>  
        <p type="p">17:鑲塊</p>  
        <p type="p">2:第一母模</p>  
        <p type="p">21:第一避讓部</p>  
        <p type="p">22:第一母模本體</p>  
        <p type="p">23:第一壓塊</p>  
        <p type="p">25:一射膠口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="925" publication-number="202614907"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614907.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614907</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111641</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發電元件、發電匣、電子裝置、以及發電元件的製造方法</chinese-title>  
        <english-title>POWER GENERATING ELEMENT, POWER GENERATING CARTRIDGE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING POWER GENERATING ELEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251230B">H10N15/00</main-classification>  
        <further-classification edition="200601120251230B">H02N3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＧＣＥ研究開發有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GCE INSTITUTE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安田拓夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUDA, TAKUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡田誠司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKADA, SEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤雅裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德森　拉爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDERSSON, LARS MATTIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤博史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種可有效率地供水至中間層並提高發電效率的發電元件，為用以將熱能轉換為電能的發電元件(100)，包括沿預定方向堆疊的層狀構造的積層構造體(110)。積層構造體(110)至少包含一個發電單元構造(30)。發電單元構造(30)包含由功函數互異的金屬所形成的第1個電極層(2A)和第2個電極層(2B)，以及設於第1個電極層(2A)和第2個電極層(2B)之間，且具有分散的複數個微粒子(11)的中間層(1)。各微粒子(11)為具有鈣鈦礦(perovskite)構造的結晶構造的過渡金屬氧化物。第1個電極層(2A)和第2個電極層(2B)中的至少其一具有複數個導水孔(20)，作為從電極層(2)外部供給水分至中間層(1)的通路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power generating element (100), which can efficiently supply water to an intermediate layer and exhibit enhanced power generating efficiency, is provided for transforming thermal energy to electric energy. The power generating element (100) includes a laminated structure (110) having a layer structure stacked in a predetermined direction, and including at least one power generating unit (30), which includes a first electrode layer (2A) and a second electrode layer (2B) of different work functions, and an intermediate layer (1) provided between the first electrode layer (2A) and the second electrode layer (2B) and having dispersed fine particles (11). The fine particles (11) are transition metal oxides having a perovskite crystal structure. A water conducting hole (20) is disposed in at least one of the first electrode layer (2A) and the second electrode layer (2B), and serves as a pathway for supplying water from the external outside the electrode layer (2) to the intermediate layer (1).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:中間層</p>  
        <p type="p">100:發電元件</p>  
        <p type="p">110:積層構造體</p>  
        <p type="p">2:電極層</p>  
        <p type="p">20:導水孔</p>  
        <p type="p">200:發電裝置</p>  
        <p type="p">2A:第1個電極層</p>  
        <p type="p">2B:第2個電極層</p>  
        <p type="p">3:基板(導電性高分子層)</p>  
        <p type="p">3A:第1基板(導電性高分子層)</p>  
        <p type="p">3B:第2基板(導電性高分子層)</p>  
        <p type="p">4:第1配線</p>  
        <p type="p">5:第2配線</p>  
        <p type="p">R:負載</p>  
        <p type="p">X:第2方向</p>  
        <p type="p">Y:第3方向</p>  
        <p type="p">Z:第1方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="926" publication-number="202614192"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614192.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614192</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111697</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子零件加工用帶</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/304</main-classification>  
        <further-classification edition="200601120251230B">H01L21/683</further-classification>  
        <further-classification edition="201801120251230B">C09J7/29</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商古河電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUKAWA ELECTRIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河内山拓哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWACHIYAMA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種電子零件加工用帶，其特徵在於依序具備樹脂層A、底塗（primer）層、樹脂層B及黏著劑層，&lt;br/&gt;上述底塗層包含抗靜電劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子零件加工用帶</p>  
        <p type="p">2:樹脂層A</p>  
        <p type="p">3:底塗層</p>  
        <p type="p">4:樹脂層B</p>  
        <p type="p">5:黏著劑層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="927" publication-number="202614352"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614352.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614352</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111710</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>升舉銷系統及方法</chinese-title>  
        <english-title>LIFT PIN SYSTEMS AND METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/687</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古魯拉吉　蘇曼斯庫魯迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GURURAJ, SUMANTH KURUDI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史維史達瓦　拉胡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRIVASTAVA, RAHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝沙維亞加雅索莫西卡　維西瓦茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASAVARAJAIAH SOMASHEKAR, VISHWAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿拉亞里　庫許克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALAYAVALLI, KAUSHIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">基板支撐組件包括可由軸在提高的位置和低於抬升位置的降低位置之間移動的基板支撐。升舉銷置於基板支撐的孔中，並可相對於基板支撐垂直移動。在一個實施例中，升舉銷包括帶有縱向肋件的軸。在另一個實施例中，升舉銷系統包括在升舉銷外殼中的密封件，該密封件對升舉銷形成密封。在另一個實施例中，升舉銷系統可調整以改變升舉銷一端距離基準的距離。在另一個實施例中，升舉銷系統包括與升舉銷相連接的環形板。該環形板經由柱塞與致動板相連接。致動板偏置成與連接到軸的臂相接觸的狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate support assembly includes a substrate support that is moveable by a shaft between a raised position and a lowered position below the raised position. A lift pin is disposed in a hole through the substrate support, and is movable vertically with respect to the substrate support. In one implementation, the lift pin includes a shaft with a longitudinal rib. In another implementation, a lift pin system includes a seal member in a lift pin housing that forms a seal against the lift pin. In another implementation, a lift pin system is adjustable to change a distance of an end of the lift pin from a datum. In another implementation, a lift pin system includes a hoop plate to which the lift pin is coupled. The hoop plate is coupled to an actuating plate via a plunger. The actuating plate is biased against an arm coupled to the shaft.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">103:基座</p>  
        <p type="p">105:孔</p>  
        <p type="p">110:基板支撐</p>  
        <p type="p">112:支撐板</p>  
        <p type="p">113:密封板</p>  
        <p type="p">116:孔</p>  
        <p type="p">118:支撐表面</p>  
        <p type="p">154:基板</p>  
        <p type="p">170:載體</p>  
        <p type="p">172:上表面</p>  
        <p type="p">232:升舉銷外殼</p>  
        <p type="p">234:安裝凸緣</p>  
        <p type="p">236:覆蓋板</p>  
        <p type="p">240:下端</p>  
        <p type="p">250A:密封件</p>  
        <p type="p">252:偏壓件</p>  
        <p type="p">254:圓錐彈簧</p>  
        <p type="p">258:間隔物</p>  
        <p type="p">260:升舉銷</p>  
        <p type="p">262:上端</p>  
        <p type="p">264:下端</p>  
        <p type="p">266:上軸</p>  
        <p type="p">268:下軸</p>  
        <p type="p">270:肩部</p>  
        <p type="p">300:升舉銷系統</p>  
        <p type="p">302:縱軸</p>  
        <p type="p">310:柱塞組件</p>  
        <p type="p">312:柱塞外殼</p>  
        <p type="p">314:凸緣</p>  
        <p type="p">316:彈簧</p>  
        <p type="p">318:套管</p>  
        <p type="p">320:柱塞</p>  
        <p type="p">320A:上部</p>  
        <p type="p">320B:下部</p>  
        <p type="p">321:上端</p>  
        <p type="p">322:凸緣</p>  
        <p type="p">324:止動肩</p>  
        <p type="p">326:向上表面</p>  
        <p type="p">328:螺紋</p>  
        <p type="p">330:螺母</p>  
        <p type="p">332:支撐外殼</p>  
        <p type="p">334:薄片</p>  
        <p type="p">350:升舉銷組件</p>  
        <p type="p">360:升舉銷平面</p>  
        <p type="p">362:支撐平面</p>  
        <p type="p">364:載體平面</p>  
        <p type="p">370:距離</p>  
        <p type="p">372:距離</p>  
        <p type="p">374:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="928" publication-number="202614811"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614811.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614811</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111753</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三維半導體裝置</chinese-title>  
        <english-title>THREE-DIMENSIONAL SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251229B">H10D30/60</main-classification>  
        <further-classification edition="202501120251229B">H10D84/83</further-classification>  
        <further-classification edition="202301120251229B">H10B43/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳圭煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, GYUHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓珍優</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JINWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種三維半導體裝置可包括：一基體；半導體圖案，其位於該基體上，該等半導體圖案與該基體間隔開，該等半導體圖案在平行於該基體之一頂部表面的一第一方向上彼此間隔開；一第一閘極圖案，其位於該等半導體圖案之頂部表面上且在該第一方向上延伸；一第二閘極圖案，其位於該等半導體圖案之底部表面上，在該第一方向上延伸，且與該第一閘極圖案間隔開；以及一橋接圖案，其位於該等半導體圖案之間，其中該第一閘極圖案及該第二閘極圖案中之各者包括：一閘極區，其與該等半導體圖案重疊；以及一延伸區，其與該橋接圖案重疊，且其中該第一閘極圖案之該延伸區突出至在該第一閘極圖案之該閘極區下方的一區。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A three-dimensional semiconductor device may include: a substrate; semiconductor patterns that are on the substrate, spaced apart from the substrate, the semiconductor patterns spaced apart from each other in a first direction parallel to a top surface of the substrate; a first gate pattern on top surfaces of the semiconductor patterns and extending in the first direction; a second gate pattern on bottom surfaces of the semiconductor patterns, extending in the first direction, and spaced apart from the first gate pattern; and a bridge pattern between the semiconductor patterns, wherein each of the first gate pattern and the second gate pattern includes: a gate region that is overlapped with the semiconductor patterns; and an extension region that is overlapped with the bridge pattern, and wherein the extension region of the first gate pattern protrudes to a region below the gate region of the first gate pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">BP:橋接圖案</p>  
        <p type="p">BT:橋接圖案BP之厚度</p>  
        <p type="p">Ba,Bb:元件</p>  
        <p type="p">CH:通道區</p>  
        <p type="p">CR:延伸區</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">DS1,DS2:距離</p>  
        <p type="p">G1a:第一閘極圖案GE1之延伸區CR之頂部表面</p>  
        <p type="p">G1b:第一閘極圖案GE1之延伸區CR之底部表面</p>  
        <p type="p">G2a:第二閘極圖案GE2之延伸區CR之頂部表面</p>  
        <p type="p">G2b:第二閘極圖案GE2之延伸區CR之底部表面</p>  
        <p type="p">GE:閘極圖案</p>  
        <p type="p">GE1:第一閘極圖案</p>  
        <p type="p">GE2:第二閘極圖案</p>  
        <p type="p">GI:閘極絕緣圖案</p>  
        <p type="p">GR:閘極區</p>  
        <p type="p">ILD:層間絕緣層</p>  
        <p type="p">P1:部分</p>  
        <p type="p">Sa:半導體圖案SP之頂部表面</p>  
        <p type="p">Sb:半導體圖案SP之底部表面</p>  
        <p type="p">SP1:第一半導體圖案</p>  
        <p type="p">SP2:第二半導體圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="929" publication-number="202613450"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613450.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613450</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111774</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>賦形膜、積層體、附有導光層之積層體、照明裝置及模具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251230B">F21S2/00</main-classification>  
        <further-classification edition="201601320251230B">F21Y101/00</further-classification>  
        <further-classification edition="201601320251230B">F21Y115/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋鋼鈑股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYO KOHAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉川貴博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIKAWA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>百足山真平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKADEYAMA, SHIMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村恒三</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, KOZO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>逸見勇介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENMI, YUUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平山咲子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAYAMA, SAKIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明減少亮度不均。本賦形膜係一種光學用賦形膜，其具有主面，且於上述主面設置以第1週期P1於形成方向上排列之複數個凹部、及以第2週期P2於上述形成方向上排列之複數個凸部，上述凹部之最大深度大於上述凸部之最大高度，若將n設為正整數，則滿足n－0.05≤P1/P2≤n＋0.05或n－0.05≤P2/P1≤n＋0.05之任意一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">62:賦形膜</p>  
        <p type="p">65:凸部</p>  
        <p type="p">621:主面</p>  
        <p type="p">622:凹部</p>  
        <p type="p">C11,C12,C21,C22:中心</p>  
        <p type="p">Dx1:凹部之最大深度</p>  
        <p type="p">Hx1:凸部之最大深度</p>  
        <p type="p">P1:第1週期</p>  
        <p type="p">P2:第2週期</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="930" publication-number="202614490"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614490.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614490</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111832</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>構造體</chinese-title>  
        <english-title>STRUCTURE BODY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01Q15/02</main-classification>  
        <further-classification edition="200601120251229B">H01Q15/24</further-classification>  
        <further-classification edition="200601120251229B">C23C26/00</further-classification>  
        <further-classification edition="200601120251229B">H05K1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譽田祥己</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDA, YOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鶴田雅典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUTA, MASANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加持義貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMOCHI, YOSHITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中健夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, TATSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種構造體，其依序具備第一金屬圖案層、第一介電體層、第二金屬圖案層、第二介電體層、及第三金屬圖案層，其中， &lt;br/&gt;前述第一金屬圖案層及前述第三金屬圖案層為狹縫狀構造，前述第二金屬圖案層含有超穎原子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a structure body that includes a first metal pattern layer, a first dielectric layer, a second metal pattern layer, a second dielectric layer, and a third metal pattern layer in this order. The first metal pattern layer and the third metal pattern layer have slit-like structures, and the second metal pattern layer includes meta-atoms.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:構造體</p>  
        <p type="p">11:第一金屬圖案層</p>  
        <p type="p">12:第一介電體層</p>  
        <p type="p">13:第二金屬圖案層</p>  
        <p type="p">14:第二介電體層</p>  
        <p type="p">15:第三金屬圖案層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="931" publication-number="202614403"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614403.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614403</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111838</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於多晶片模組的液體及空氣組合冷卻</chinese-title>  
        <english-title>LIQUID AND AIR COMBO COOLING FOR MULTI-CHIP MODULES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L23/467</main-classification>  
        <further-classification edition="200601120251230B">H01L21/48</further-classification>  
        <further-classification edition="200601120251230B">H01L23/00</further-classification>  
        <further-classification edition="200601120251230B">H01L23/367</further-classification>  
        <further-classification edition="200601120251230B">H01L23/42</further-classification>  
        <further-classification edition="202301120251230B">H01L25/065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　羅恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, RON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方騰二世　蓋烏斯　吉爾曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOUNTAIN, JR., GAIUS GILLMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈巴　貝高森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HABA, BELGACEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡特卡　拉杰詡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATKAR, RAJESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥卡雷米　蘿拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIRKARIMI, LAURA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一些實施方案中，一種冷卻設備可包括整合式冷卻總成，該整合式冷卻總成包含第一晶粒及冷板，該冷板具有第一部分及第二部分，該第一部分附接至該第一晶粒之背側，該第二部分與該第一晶粒的該背側間隔開以在該第二部分與該第一晶粒之該背側之間界定經配置以用於液體冷卻劑的至少一個流體通道。該冷卻設備進一步包括以通信方式耦接至該第一晶粒之複數個第二晶粒以及附接至該複數個第二晶粒中之至少一個第二晶粒的一或多個散熱件。該冷板與該一或多個散熱件熱解耦。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In some implementations, a cooling apparatus may include an integrated cooling assembly comprising a first die and a cold plate having first and second portions, the first portion being attached to a backside of the first die, the second portion being spaced apart from the backside of the first die to define at least one fluid channel arranged for a liquid coolant between the second portion and the backside of the first die. The cooling apparatus further includes a plurality of second dies communicatively coupled to the first die and one or more heat sinks attached to at least one second die of the plurality of second dies. The cold plate is thermally decoupled from the one or more heat sinks.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201:裝置封裝</p>  
        <p type="p">202:封裝基板</p>  
        <p type="p">203:整合式冷卻總成</p>  
        <p type="p">204:半導體裝置/第一裝置</p>  
        <p type="p">206:冷板</p>  
        <p type="p">206A:入口及出口開口/入口開口/出口開口</p>  
        <p type="p">208:封裝罩蓋</p>  
        <p type="p">208A:側壁部分</p>  
        <p type="p">208B:側向部分</p>  
        <p type="p">210:冷卻劑通道/冷卻劑腔室容積</p>  
        <p type="p">212:入口及出口開口/入口開口/出口開口</p>  
        <p type="p">214:突出特徵</p>  
        <p type="p">218:主動側</p>  
        <p type="p">219:導電凸塊</p>  
        <p type="p">220:背側</p>  
        <p type="p">221:第一底部填充層</p>  
        <p type="p">222:密封材料層</p>  
        <p type="p">222A:開口/入口及出口開口/入口開口/出口開口</p>  
        <p type="p">224A:第一介電材料層/介電層</p>  
        <p type="p">224B:第二介電材料層</p>  
        <p type="p">230:空腔分隔件/支撐特徵</p>  
        <p type="p">232:空腔側壁</p>  
        <p type="p">234:頂部部分</p>  
        <p type="p">240:周邊側壁</p>  
        <p type="p">252:記憶體裝置/第二裝置</p>  
        <p type="p">253:記憶體裝置/第二裝置</p>  
        <p type="p">254:中介層</p>  
        <p type="p">256:氣流開口</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="932" publication-number="202614405"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614405.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614405</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111839</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>至中央處理單元/多晶片模組接合的液體冷卻及封裝製程流程</chinese-title>  
        <english-title>LIQUID COOLING TO CPU/MCM BOND AND PACKAGE PROCESS FLOW</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L23/473</main-classification>  
        <further-classification edition="200601120251230B">H01L23/46</further-classification>  
        <further-classification edition="200601120251230B">H01L21/48</further-classification>  
        <further-classification edition="200601120251230B">H01L23/00</further-classification>  
        <further-classification edition="200601120251230B">H01L23/31</further-classification>  
        <further-classification edition="200601120251230B">H01L25/00</further-classification>  
        <further-classification edition="202301120251230B">H01L25/065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方騰二世　蓋烏斯　吉爾曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOUNTAIN, JR., GAIUS GILLMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈巴　貝高森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HABA, BELGACEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡特卡　拉杰詡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATKAR, RAJESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　羅恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, RON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥卡雷米　蘿拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIRKARIMI, LAURA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一些實施方案中，一種製造冷卻設備之方法包括藉由將冷板附接至第一晶粒之背側而形成整合式冷卻總成。冷板之第一側與第一晶粒間隔開以界定通道體積，通道體積具有在冷板的與第一側相對之第二側處封閉的入口部分及出口部分。方法進一步包括：將整合式冷卻總成附接至中介層，其中複數個第二晶粒安置於中介層上；以及在將整合式冷卻總成附接至中介層之後，開啟通道體積之入口部分及出口部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In some implementations, a method of manufacturing a cooling apparatus includes forming an integrated cooling assembly by attaching a cold plate to a backside of a first die. A first side of the cold plate is spaced apart from the first die to define a channel volume having an inlet portion and an outlet portion that are closed at a second side of the cold plate opposite to the first side. The method further includes attaching the integrated cooling assembly to an interposer, wherein a plurality of second dies is disposed on the interposer, and subsequent to attaching the integrated cooling assembly to the interposer, opening the inlet portion and the outlet portion of the channel volume.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201:裝置封裝</p>  
        <p type="p">202:封裝基板</p>  
        <p type="p">203:整合式冷卻總成</p>  
        <p type="p">204:半導體裝置</p>  
        <p type="p">206:冷板</p>  
        <p type="p">206A:入口及出口開口/入口開口/出口開口</p>  
        <p type="p">208:封裝罩蓋</p>  
        <p type="p">208A:側壁部分</p>  
        <p type="p">208B:側向部分</p>  
        <p type="p">210:冷卻劑通道/冷卻劑腔室容積</p>  
        <p type="p">212:入口及出口開口/入口開口/出口開口</p>  
        <p type="p">214:突出特徵</p>  
        <p type="p">218:主動側</p>  
        <p type="p">219:導電凸塊</p>  
        <p type="p">220:背側</p>  
        <p type="p">221:第一底部填充層</p>  
        <p type="p">222:密封材料層</p>  
        <p type="p">222A:入口及出口開口/入口開口/出口開口</p>  
        <p type="p">224A:第一介電材料層</p>  
        <p type="p">224B:第二介電材料層</p>  
        <p type="p">230:支撐特徵</p>  
        <p type="p">232:空腔側壁</p>  
        <p type="p">234:頂部部分</p>  
        <p type="p">240:周邊側壁</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="933" publication-number="202614091"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614091.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614091</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111880</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生殖醫學支援伺服器、支援方法及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251230B">G16H80/00</main-classification>  
        <further-classification edition="201801120251230B">G16H10/40</further-classification>  
        <further-classification edition="201001120251230B">C12N5/073</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商美德達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDETA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤慎悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITOH, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中大登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, DAITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久松慎一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HISAMATSU, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種醫生和胚胎培養師能夠聯合支援患者之機制。生殖醫學支援伺服器包括：獲取部，獲取與患者之生殖醫學相關之醫療資訊；醫生終端輸出部，對醫生所使用之醫生終端輸出所述醫療資訊中之至少一部分；以及培養師終端輸出部，對培養師所使用之培養師終端輸出所述醫療資訊中與卵子、胚胎、培養液或精子中的至少一者相關的檢查資訊；所述獲取部構成為自所述醫生終端獲取與針對所述患者之治療相關之治療資訊作為所述醫療資訊，所述培養師終端輸出部構成為將獲取的所述治療資訊輸出至所述培養師終端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:生殖醫學支援系統</p>  
        <p type="p">101:管理伺服器</p>  
        <p type="p">102:醫生終端</p>  
        <p type="p">103:培養師終端</p>  
        <p type="p">104:患者終端</p>  
        <p type="p">105:醫療器械</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="934" publication-number="202614880"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614880.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614880</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111903</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光檢測裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251230B">H10F39/18</main-classification>  
        <further-classification edition="202501120251230B">H10F30/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索尼半導體解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三成英樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINARI, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大庭義行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHBA, YOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大石秀俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OISHI, HIDETOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤諄一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, RYOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山知亮介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMACHI, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬場公一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BABA, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明能減少暗電流並抑制量子效率下降。光檢測裝置具備：半導體層，其於一方向上具有厚度；光電轉換區域，其由分離區域加以區劃，且設置於上述半導體層；及光電轉換部，其設置於上述光電轉換區域，且將光進行光電轉換成信號電荷。而且，上述分離區域具有：凹蝕部，其設置於上述半導體層，且沿上述一方向延伸；固定電荷膜，其沿著上述凹蝕部之側面部而設置，且具有固定電荷；及金屬膜，其沿著上述凹蝕部之內側之上述固定電荷膜而設置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3,3a,3d:像素(感測器像素)</p>  
        <p type="p">21:半導體層</p>  
        <p type="p">22:光電轉換區域</p>  
        <p type="p">23:p型之井區域</p>  
        <p type="p">24:n型之半導體區域</p>  
        <p type="p">25:光電轉換部</p>  
        <p type="p">31:分離區域</p>  
        <p type="p">31a:淺分離區域</p>  
        <p type="p">31b:深分離區域</p>  
        <p type="p">32:凹蝕部</p>  
        <p type="p">32a:淺凹蝕部</p>  
        <p type="p">32b:深凹蝕部</p>  
        <p type="p">36:場絕緣膜</p>  
        <p type="p">41:閘極槽部</p>  
        <p type="p">42:閘極絕緣膜</p>  
        <p type="p">43:閘極電極</p>  
        <p type="p">43a:頭部</p>  
        <p type="p">43b:主體部</p>  
        <p type="p">61:固定電荷膜</p>  
        <p type="p">62:抗反射膜</p>  
        <p type="p">63:絕緣薄膜</p>  
        <p type="p">64:金屬薄膜(導電性膜)</p>  
        <p type="p">65:絕緣膜</p>  
        <p type="p">66:密封絕緣膜</p>  
        <p type="p">FD:n型之浮動擴散區域</p>  
        <p type="p">PD:光電二極體</p>  
        <p type="p">S1:第1面部</p>  
        <p type="p">S2:第2面部</p>  
        <p type="p">TR:傳輸電晶體</p>  
        <p type="p">V&lt;sub&gt;1&lt;/sub&gt;:第1基準電位</p>  
        <p type="p">V&lt;sub&gt;3&lt;/sub&gt;:第3基準電位</p>  
        <p type="p">W&lt;sub&gt;1&lt;/sub&gt;,W&lt;sub&gt;2&lt;/sub&gt;,W&lt;sub&gt;3&lt;/sub&gt;,W&lt;sub&gt;4&lt;/sub&gt;:寬度</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="935" publication-number="202613350"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613350.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613350</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111905</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學源容器及反應系統</chinese-title>  
        <english-title>CHEMICAL SOURCE VESSEL AND REACTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C23C16/448</main-classification>  
        <further-classification edition="200601120260102B">C23C16/455</further-classification>  
        <further-classification edition="200601120260102B">C23C16/52</further-classification>  
        <further-classification edition="200601120260102B">G01F23/04</further-classification>  
        <further-classification edition="200601120260102B">B01D3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉德內克　三世　安德魯　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEDNAK III, ANDREW MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種用於容納液體化學前驅物之化學品容器，其包括液位感測器管。液位感測器管係經配置以在將液體化學前驅物加熱至沸點或汽化點的環境中操作。液位感測器管包括具有狹槽的殼體，該狹槽經內建以防止設置在液位感測器管內之感測器的任何錯誤讀數。該液位感測器管可受一屏蔽件保護，以免在將液體引入至該環境期間發生非所要液體濺射。該液體可通過一入口引入，且一防濺壁可位於該液位感測器管與入口埠之間，藉此降低非所要液體在該液位感測器管上移位之風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chemical vessel used for holding a liquid chemical precursor is disclosed comprising a liquid level sensor tube. The liquid level sensor tube is configured to operate in an environment where the liquid chemical precursor is heated to a point of boiling or vaporization. The liquid level sensor tube comprises housing with a slot built in to prevent any false readings of sensors disposed within the liquid level sensor tube. The liquid level sensor tube can be protected by a shield from unwanted liquid splashing during introduction of liquid into the environment. The liquid may be introduced through an inlet, and a splash wall may be between the liquid level sensor tube and the inlet port, thereby reducing the risk of unwanted liquid being displaced on the liquid level sensor tube.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:化學品容器</p>  
        <p type="p">110:容器殼體</p>  
        <p type="p">120A:第一閥</p>  
        <p type="p">120B:第二閥</p>  
        <p type="p">120C:第三閥</p>  
        <p type="p">130:液位感測器埠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="936" publication-number="202614135"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614135.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614135</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111970</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遠端電漿源</chinese-title>  
        <english-title>REMOTE PLASMA SOURCES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩爾帕　嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PELPA, JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛斯　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORTH, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴魯克　美迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALOOCH, MEHDI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯洛斯　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURROWS, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康斯坦特　安迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONSTANT, ANDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡拉茲　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARAZIM, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪莫爾　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEEMER, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　葛雷格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, GREG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽德法　阿明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAEEDFAR, AMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿隆　羅扎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALON, ROZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施例是針對一種遠端電漿系統。在實例中，遠端電漿系統包括：第一管、第二管、耦接在該第一管的第一端與該第二管的第一端之間的第一隔離部件、耦接在該第一管的第二端與該第二管的第二端之間的第二隔離部件，以及耦接至該第一隔離部件的第一電容元件。在一個實例中，該第二管和該第一管共同可以具有圓形或橢圓形狀。在一個實例中，第一芯包圍該第一管的靠近該第一隔離部件的部分，第二芯包圍該第一管的靠近該第二隔離部件的部分，第三芯包圍該第二管的靠近該第一隔離部件的部分，並且第四芯包圍該第二管的靠近該第二隔離部件的部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments are directed to a remote plasma system. In an example, a remote plasma system includes a first tube, a second tube, a first isolation component coupled between a first end of the first tube and a first end of the second tube, a second isolation component coupled between a second end of the first tube and a second end of the second tube, and a first capacitive element coupled to the first isolation component. In one example, the second tube and the first tube together can have a circular or oval shape. In one example, a first magnetic core is surrounding a portion of the first tube proximate the first isolation component, a second magnetic core is surrounding a portion of the first tube proximate the second isolation component, a third magnetic core is surrounding a portion of the second tube proximate the first isolation component, and a fourth magnetic core is surrounding a portion of the second tube proximate the second isolation component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電漿處理系統</p>  
        <p type="p">100:處理腔室</p>  
        <p type="p">101:電漿</p>  
        <p type="p">103:RPS電漿</p>  
        <p type="p">111:濾波組件</p>  
        <p type="p">116:輸入感測器</p>  
        <p type="p">117:輸出感測器</p>  
        <p type="p">119:氣體處理源</p>  
        <p type="p">123:腔室蓋</p>  
        <p type="p">126:系統控制器</p>  
        <p type="p">128:氣體入口</p>  
        <p type="p">129:處理體積</p>  
        <p type="p">136:基板支撐組件</p>  
        <p type="p">171:射頻(RF)發生器</p>  
        <p type="p">172:RF匹配件</p>  
        <p type="p">173:高電壓DC供應器</p>  
        <p type="p">175:脈衝電壓(PV)波形發生器</p>  
        <p type="p">182:氣體遞送系統</p>  
        <p type="p">190:匹配件</p>  
        <p type="p">192:遠端電漿源(RPS)</p>  
        <p type="p">193:鐵氧體芯</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="937" publication-number="202613195"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613195.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613195</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111990</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚合物組成物、以及含有其之醫療用材料及黏接劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C08F212/14</main-classification>  
        <further-classification edition="200601120251229B">C08F220/30</further-classification>  
        <further-classification edition="200601120251229B">C08F220/58</further-classification>  
        <further-classification edition="200601120251229B">C08L1/00</further-classification>  
        <further-classification edition="200601120251229B">C08L5/00</further-classification>  
        <further-classification edition="200601120251229B">C08L25/02</further-classification>  
        <further-classification edition="200601120251229B">C08L25/04</further-classification>  
        <further-classification edition="200601120251229B">C08L33/00</further-classification>  
        <further-classification edition="200601120251229B">C09J133/00</further-classification>  
        <further-classification edition="200601120251229B">A61L24/00</further-classification>  
        <further-classification edition="200601120251229B">A61L24/02</further-classification>  
        <further-classification edition="200601120251229B">A61L24/04</further-classification>  
        <further-classification edition="200601120251229B">A61L24/06</further-classification>  
        <further-classification edition="200601120251229B">A61L24/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋紡股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOBO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木坂和貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISAKA, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西口靖子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIGUCHI, YASUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>入江達彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IRIE, MICHIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明課題在於提供一種黏接劑等材料，其對於濕潤狀態之材料顯示高黏接性，在長且細的管內的送液等高剪切環境下為低黏度，且在塗佈後的低剪切環境下或無剪切環境下流動性會極端地變低而不易移動，能夠適合使用於醫療用等。&lt;br/&gt; 前述課題能夠藉由一種聚合物組成物來解決，該聚合物組成物含有共聚合聚合物(P)、填料(F)、水及/或醇類溶劑(S)，該共聚合聚合物(P)含有化學式(1-A)表示之單體(A)、及與單體(A)不同的具有聚合性不飽和鍵之單體(B)作為構成成分。&lt;br/&gt;&lt;img align="absmiddle" height="81px" width="249px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; (式中，R表示氫原子或甲基，L表示醯胺鍵、酯鍵或直接鍵結，Z表示直接鍵結或碳數1~10的伸烷基，y表示1~5的整數。)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="938" publication-number="202614339"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614339.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614339</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114111999</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造設備用零件以及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/683</main-classification>  
        <further-classification edition="200601120251230B">C04B37/00</further-classification>  
        <further-classification edition="200601120251230B">H05B3/74</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本碍子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGK INSULATORS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本寛大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, KANTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川征樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森岡育久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIOKA, IKUHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供以第一半導體製造設備用零件作為原料的第二半導體製造設備用零件的製造方法，係為使用第一半導體製造設備用零件而製造第二半導體製造設備用零件的方法，其中前述第一半導體製造設備用零件包括內置電極的第一陶瓷基板，前述第一陶瓷基板具有能夠載置晶圓的具有複數個突起的上表面，前述第二半導體製造設備用零件包括內置電極的第二陶瓷基板，前述第二陶瓷基板具有能夠載置晶圓的具有複數個突起的上表面，此製造方法包括：步驟A，加工前述第一陶瓷基板的前述上表面，形成去除前述複數個突起的平坦面；步驟B1，將前述第一陶瓷基板的前述平坦面與陶瓷板的下表面常溫接合，形成前述第一陶瓷基板與前述陶瓷板接合的第二陶瓷基板；步驟C，在步驟B1的實施前或實施後，在前述陶瓷板的上表面形成能夠載置晶圓的複數個突起。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10A:半導體製造設備用零件</p>  
        <p type="p">20:陶瓷基板</p>  
        <p type="p">20a:中央部</p>  
        <p type="p">20b:外周部</p>  
        <p type="p">21,27:上表面</p>  
        <p type="p">23:下表面</p>  
        <p type="p">26a,26b:電極</p>  
        <p type="p">30:基板</p>  
        <p type="p">31:上表面</p>  
        <p type="p">32:冷媒流路</p>  
        <p type="p">35:絕緣膜</p>  
        <p type="p">40:接合層</p>  
        <p type="p">70:陶瓷板</p>  
        <p type="p">71:上表面</p>  
        <p type="p">71a,71c:上端面</p>  
        <p type="p">71b:基準面</p>  
        <p type="p">72:突起</p>  
        <p type="p">73:下表面</p>  
        <p type="p">75:密封帶</p>  
        <p type="p">80:非晶層</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="939" publication-number="202614340"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614340.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614340</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112000</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造設備用零件以及其再生方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/683</main-classification>  
        <further-classification edition="200601120251230B">C23C14/50</further-classification>  
        <further-classification edition="200601120251230B">C23C16/458</further-classification>  
        <further-classification edition="200601120251230B">H01L21/3065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本碍子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGK INSULATORS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川征樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森岡育久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIOKA, IKUHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體製造設備用零件10包括：在上表面具有晶圓載置面26之第一陶瓷板21、配置於第一陶瓷板21的下表面之第二陶瓷板22、存在第一陶瓷板21與第二陶瓷板22之間的第一非晶質層24。第一陶瓷板21與第二陶瓷板22相比為低脫粒的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體製造設備用零件</p>  
        <p type="p">20:陶瓷板積層體</p>  
        <p type="p">21:第一陶瓷板</p>  
        <p type="p">22:第二陶瓷板</p>  
        <p type="p">23:第三陶瓷板</p>  
        <p type="p">24:第一非晶質層</p>  
        <p type="p">25:第二非晶質層</p>  
        <p type="p">26:晶圓載置面</p>  
        <p type="p">26a:密封帶</p>  
        <p type="p">26b:圓形小突起</p>  
        <p type="p">26c:基準面</p>  
        <p type="p">27:吸附電極</p>  
        <p type="p">28:加熱器電極</p>  
        <p type="p">30:冷卻板</p>  
        <p type="p">32:冷媒流道</p>  
        <p type="p">40:接著片</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="940" publication-number="202614341"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614341.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614341</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112002</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造設備用零件以及其再生方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/683</main-classification>  
        <further-classification edition="200601120251230B">C23C14/50</further-classification>  
        <further-classification edition="200601120251230B">C23C16/458</further-classification>  
        <further-classification edition="200601120251230B">H01L21/3065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本碍子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGK INSULATORS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本寛大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, KANTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川征樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森岡育久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIOKA, IKUHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體製造設備用零件10包括：在上表面具有晶圓載置面26之第一陶瓷板21、配置於第一陶瓷板21的下表面之第二陶瓷板22、內埋在第二陶瓷板22的吸附電極26、存在第一陶瓷板21與第二陶瓷板22之間的第一非晶質層24。第一陶瓷板21的絕緣耐壓比前述第二陶瓷板22的絕緣耐壓更高、為70kV/mm以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體製造設備用零件</p>  
        <p type="p">20:陶瓷板積層體</p>  
        <p type="p">21:第一陶瓷板</p>  
        <p type="p">22:第二陶瓷板</p>  
        <p type="p">23:第三陶瓷板</p>  
        <p type="p">24:第一非晶質層</p>  
        <p type="p">25:第二非晶質層</p>  
        <p type="p">26:晶圓載置面</p>  
        <p type="p">26a:密封帶</p>  
        <p type="p">26b:圓形小突起</p>  
        <p type="p">26c:基準面</p>  
        <p type="p">27:吸附電極</p>  
        <p type="p">28:加熱器電極</p>  
        <p type="p">30:冷卻板</p>  
        <p type="p">32:冷媒流道</p>  
        <p type="p">40:接著片</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="941" publication-number="202613632"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613632.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613632</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112004</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有整合波導的玻璃基光子橋</chinese-title>  
        <english-title>GLASS-BASED PHOTONIC BRIDGE WITH INTEGRATED WAVEGUIDES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G02B6/42</main-classification>  
        <further-classification edition="200601120251230B">G02B6/122</further-classification>  
        <further-classification edition="200601120251230B">G02B6/26</further-classification>  
        <further-classification edition="200601120251230B">G02B6/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧研發公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING RESEARCH &amp; DEVELOPMENT CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格里吉爾　提姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRYGIEL, TIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪蒂斯　安德瑞亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATISS, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">茲提供包括玻璃基光子橋的裝置、方法和組件，各玻璃基光子橋定義第一和第二表面，及包括在第一表面內並從玻璃基光子橋的第一部分延伸到第二部分的光波導。第一表面可附接至第一光子電路，使得第一部分和光波導對齊第一光子電路且光訊號能從第一光子電路傳輸到光波導。第一表面亦可附接至第二光子電路，使得第二部分和光波導對齊第二光子電路且光訊號能從光波導傳輸到第二光子電路。光波導用作第一光子電路與第二光子電路間的光學連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Devices, methods, and assemblies are provided that include glass-based photonic bridges that each defines first and second surfaces and includes an optical waveguide within the first surface extending from a first portion to a second portion of the glass-based photonic bridge. The first surface is attachable to a first photonic circuit such that the first portion and the optical waveguide align with the first photonic circuit and optical signals are able to transfer from the first photonic circuit to the optical waveguide. The first surface is also attachable to a second photonic circuit such that the second portion and the optical waveguide align with the second photonic circuit and optical signals are able to transfer from the optical waveguide to the second photonic circuit. The optical waveguide serves as an optical connection between the first photonic circuit and the second photonic circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光子橋組件</p>  
        <p type="p">101:第一部分</p>  
        <p type="p">102:第二部分</p>  
        <p type="p">103:鋸齒部</p>  
        <p type="p">110:玻璃基光子橋</p>  
        <p type="p">111:光波導</p>  
        <p type="p">115,116:表面</p>  
        <p type="p">120,130:光子電路</p>  
        <p type="p">122a:第一部分</p>  
        <p type="p">122b,132b:對應部分</p>  
        <p type="p">124,134:最內端</p>  
        <p type="p">132a:第二部分</p>  
        <p type="p">140,150:電氣連接材料</p>  
        <p type="p">160:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="942" publication-number="202612903"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612903.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612903</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112007</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多層構造體及其製造方法、包含多層構造體之電子裝置用保護薄片以及電子裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">B32B9/00</main-classification>  
        <further-classification edition="200601120251230B">B32B9/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木良一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, RYOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久詰修平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUZUME, SHUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河邊勇步</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWABE, YUHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴田學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBATA, MANABU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾下龍也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSHITA, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊原敬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IHARA, KEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邊拓一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, TAKUICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明目的在於提供一種具有非常優異之水蒸氣阻隔性的多層構造體及其製造方法、使用其之電子裝置的保護薄片以及電子裝置。&lt;br/&gt; 本發明揭示一種多層構造體，其係於基材(X)上具有層(Y)，層(Y)包含含鋁原子之金屬氧化物(A)與無機磷化合物(BI)的反應產物(D)及多價金屬鹽(F)，於層(Y)中，構成金屬氧化物(A)之金屬原子(M)的莫耳數(N&lt;sub&gt;M&lt;/sub&gt;)與無機磷化合物(BI)的莫耳數(N&lt;sub&gt;P&lt;/sub&gt;)之比值(N&lt;sub&gt;M&lt;/sub&gt;/N&lt;sub&gt;P&lt;/sub&gt;)滿足1.0以上2.4以下，且構成多價金屬鹽(F)之金屬離子(G)的莫耳數(N&lt;sub&gt;G&lt;/sub&gt;)與前述莫耳數(N&lt;sub&gt;M&lt;/sub&gt;)之比值(N&lt;sub&gt;G&lt;/sub&gt;/N&lt;sub&gt;M&lt;/sub&gt;)為0.03以上0.25以下，多價金屬鹽(F)在25℃對水的溶解度係20g/100mL以上，構成多價金屬鹽(F)之陰離子(H)其共軛酸(H’)的酸解離常數(pKa)係1.83以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="943" publication-number="202614652"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614652.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614652</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112030</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預測覆蓋範圍及容量問題</chinese-title>  
        <english-title>PREDICTING COVERAGE AND CAPACITY ISSUES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251230B">H04W24/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商ＬＭ艾瑞克生（ＰＵＢＬ）電話公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧納迪　露卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUNARDI, LUCA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里什那莫席　文加塔納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRISHNAMOORTHI, VENGATANATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕琶　約安納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAPPA, IOANNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聖托薩　安傑羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTONZA, ANGELO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布朗　菲利普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRUHN, PHILIPP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種第一無線電存取網路RAN節點(120a)預測影響由一第二RAN節點(120b)伺服之一覆蓋區域(130)之一覆蓋範圍及容量最佳化CCO問題。該第一RAN節點(120a)將指示該經預測CCO問題之一通知訊息傳輸至該第二RAN節點(120b)。該第二RAN節點(120b)自該第一RAN節點(120a)接收該通知訊息。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A first Radio Access Network, RAN, node (120a) predicts a Coverage and Capacity Optimization, CCO, issue impacting a coverage area (130) served by a second RAN node (120b). The first RAN node (120a) transmits, to the second RAN node (120b), a notification message indicating the predicted CCO issue. The second RAN node (120b) receives the notification message from the first RAN node (120a).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">260a:第一gNB</p>  
        <p type="p">260b:第二gNB</p>  
        <p type="p">280a:第一gNB-DU</p>  
        <p type="p">280b:第二gNB-DU</p>  
        <p type="p">295a:第一gNB-CU</p>  
        <p type="p">295b:第二gNB-CU</p>  
        <p type="p">510a:第一覆蓋範圍及容量最佳化(CCO)問題通知訊息</p>  
        <p type="p">510b:第二覆蓋範圍及容量最佳化(CCO)問題通知訊息</p>  
        <p type="p">510c:第三覆蓋範圍及容量最佳化(CCO)問題通知訊息</p>  
        <p type="p">520:覆蓋範圍及容量最佳化(CCO)問題確認訊息</p>  
        <p type="p">530a:覆蓋範圍及容量最佳化(CCO)回饋訊息</p>  
        <p type="p">530b:覆蓋範圍及容量最佳化(CCO)回饋訊息</p>  
        <p type="p">550a:第一覆蓋範圍修改訊息</p>  
        <p type="p">550b:第二覆蓋範圍修改訊息</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="944" publication-number="202613271"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613271.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613271</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112057</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膜狀接著劑、具備該硬化膜之積層透鏡、膜狀接著劑用之濃液</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C09J11/04</main-classification>  
        <further-classification edition="200601120251229B">C09J11/06</further-classification>  
        <further-classification edition="200601120251229B">C09J163/00</further-classification>  
        <further-classification edition="200601120251229B">C09J171/12</further-classification>  
        <further-classification edition="201801120251229B">C09J7/35</further-classification>  
        <further-classification edition="200601120251229B">G02B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商古河電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUKAWA ELECTRIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木俊宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, TOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石黒邦彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIGURO, KUNIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森田稔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORITA, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種膜狀接著劑，其於製成硬化膜時光之透過率及反射率較低。又，其目的在於提供一種膜狀接著劑、具備該硬化膜之積層透鏡、及膜狀接著劑用之濃液，上述膜狀接著劑能夠同時滿足硬化前之貼合性、以及硬化狀態下之低吸水率及高溫下之接著力。 &lt;br/&gt;本發明之膜狀接著劑含有環氧樹脂(A)、環氧樹脂硬化劑(B)、高分子成分(C)、無機填充材(D)、著色劑(E)，且上述高分子成分(C)包含苯氧基樹脂，上述膜狀接著劑包含特定量之上述無機填充材(D)、特定量之上述環氧樹脂(A)、特定量之上述環氧樹脂硬化劑(B)、特定量之上述著色劑(E)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:透鏡</p>  
        <p type="p">2:影像感測器</p>  
        <p type="p">3:硬化膜</p>  
        <p type="p">10:積層透鏡</p>  
        <p type="p">11:側壁</p>  
        <p type="p">12:接著部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="945" publication-number="202614136"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614136.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614136</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112063</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於應力調節高密度以及模量薄膜的接地板</chinese-title>  
        <english-title>GROUNDING PLATE FOR STRESS TUNING HIGH DENSITY AND MODULUS FILMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李洙零</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SOONIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬禮克　亞伯希吉特巴蘇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALLICK, ABHIJIT BASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納拉亞南　拉賈雷姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARAYANAN, RAJARAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕拉博　普拉堤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARAB, PRAPTI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔恩　托恩Ｑ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRAN, TOAN Q.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉親也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, QINYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱德拉雅　狄瓦卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEDLAYA, DIWAKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼納　帕拉米特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANNA, PRAMIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加納基拉曼　卡希克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANAKIRAMAN, KARTHIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了處理腔室，用於形成高密度以及模量薄膜。該處理腔室包括蓋組件、位於蓋組件上的電感耦合電漿源，以及耦接至蓋組件的腔室主體，其中蓋組件包含一種非導電材料，以在電感耦合電漿源和腔室主體之間提供介電斷路。該處理腔室還包括包含有功電極的基板支撐件，以及耦接至電氣接地並安置於蓋組件與腔室主體之間的接地板。接地板被配置為作為接地電極的一部分，在有功電極與接地電極之間的處理體積中產生電漿。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process chamber for forming film high density and modulus films is provided. The process chamber includes a lid assembly, an inductively coupled plasma source disposed on the lid assembly, and a chamber body coupled to the lid assembly, wherein the lid assembly comprises a non-conductive material for providing a dielectric break between the inductively coupled plasma source and the chamber body. The process chamber also includes a substrate support comprising a powered electrode and a grounding plate coupled to an electrical ground and disposed between the lid assembly and the chamber body. The grounding plate is configured to operate as part of a grounded electrode for generating a plasma in the processing volume between the powered electrode and the grounded electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:間隔墊</p>  
        <p type="p">115:基板支撐件</p>  
        <p type="p">116:密封件</p>  
        <p type="p">120:可變壓力系統</p>  
        <p type="p">125:蓋板</p>  
        <p type="p">130:熱交換器</p>  
        <p type="p">135:噴頭</p>  
        <p type="p">140:第一處理氣體源</p>  
        <p type="p">142:第二處理氣體源</p>  
        <p type="p">144:入口</p>  
        <p type="p">145:基板</p>  
        <p type="p">155:清洗氣體源</p>  
        <p type="p">160:處理體積</p>  
        <p type="p">162:RF電極</p>  
        <p type="p">165:第一RF電源</p>  
        <p type="p">168:接地板</p>  
        <p type="p">170:第二RF電源</p>  
        <p type="p">175:致動器</p>  
        <p type="p">178:設施電纜</p>  
        <p type="p">180A:第一距離</p>  
        <p type="p">180B:第二距離</p>  
        <p type="p">182:第一泵</p>  
        <p type="p">184:第二泵</p>  
        <p type="p">185:基板移送埠</p>  
        <p type="p">186:閥門</p>  
        <p type="p">186A:內部門</p>  
        <p type="p">186B:外部門</p>  
        <p type="p">188:致動器</p>  
        <p type="p">190:氣室</p>  
        <p type="p">191:中央導管</p>  
        <p type="p">192:腔室主體</p>  
        <p type="p">194:控制器</p>  
        <p type="p">200:處理腔室</p>  
        <p type="p">205:蓋組件</p>  
        <p type="p">210:平面線圈</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="946" publication-number="202613732"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613732.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613732</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112084</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯像裝置、顯像方法及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G03F7/30</main-classification>  
        <further-classification edition="200601120260102B">B05B1/14</further-classification>  
        <further-classification edition="200601120260102B">B05B13/04</further-classification>  
        <further-classification edition="201801120260102B">B05B15/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤浩文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, HIROFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARA, KATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 提高針對顯像裝置的便利性。 &lt;br/&gt;　　[解決手段] 顯像裝置具備：第1噴嘴，其具備顯像液的第1吐出口，前述第1吐出口橫向延伸，長度足以覆蓋基板的寬度；移動機構，使前述第1噴嘴在從前述第1吐出口吐出前述顯像液期間，沿與前述第1吐出口的延伸方向交叉的方向移動，處於第1狀態；第1接液面，其形成前述第1吐出口的口緣部，在前述第1狀態下與形成在前述基板上前述顯像液的液膜接觸；第2噴嘴，其具備顯像液的第2吐出口，前述第2吐出口在前述第1吐出口的延伸方向的長度比該第1吐出口短；旋轉機構，其使前述基板旋轉，以使前述基板在從前述第2吐出口吐出前述顯像液期間處於旋轉的第2狀態；以及第2接液面，其形成前述第2吐出口的口緣部，在前述第2狀態下與形成在前述基板上前述顯像液的液膜接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第1噴嘴</p>  
        <p type="p">11,21:前端面</p>  
        <p type="p">12,22:吐出口</p>  
        <p type="p">13:嘴臂</p>  
        <p type="p">14:移動機構</p>  
        <p type="p">14A:升降機構</p>  
        <p type="p">20:第2噴嘴</p>  
        <p type="p">23:嘴臂</p>  
        <p type="p">23a:屈曲部</p>  
        <p type="p">23b:液體接收部</p>  
        <p type="p">23c:凹部</p>  
        <p type="p">24:移動機構</p>  
        <p type="p">24A:升降機構</p>  
        <p type="p">41,41R:旋轉吸盤</p>  
        <p type="p">42:旋轉軸</p>  
        <p type="p">43:旋轉機構</p>  
        <p type="p">44:杯部</p>  
        <p type="p">44U:升降機構</p>  
        <p type="p">44S:外杯</p>  
        <p type="p">44T:內杯</p>  
        <p type="p">45:圓板</p>  
        <p type="p">46:升降銷</p>  
        <p type="p">47:升降機構</p>  
        <p type="p">48:液體接收部</p>  
        <p type="p">49:環形體</p>  
        <p type="p">A1:水平移動區域</p>  
        <p type="p">A2:水平移動區域</p>  
        <p type="p">G1:水平移動機構</p>  
        <p type="p">G2:水平移動機構</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="947" publication-number="202614659"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614659.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614659</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112089</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>由環境物聯網設備執行的方法、環境物聯網設備</chinese-title>  
        <english-title>METHOD PERFORMED BY AN AMBIENT IOT DEVICE, AMBIENT IOT DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251230B">H04W52/14</main-classification>  
        <further-classification edition="200601120251230B">H04L5/00</further-classification>  
        <further-classification edition="200901120251230B">H04W8/22</further-classification>  
        <further-classification edition="200901120251230B">H04W52/36</further-classification>  
        <further-classification edition="200901120251230B">H04W72/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福亞德　亞瑟　穆罕默德　穆斯塔法　卡梅爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOUAD, YASER MOHAMED MOSTAFA KAMAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩托里　菲利普　瓊　馬克　米歇爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SARTORI, PHILIPPE JEAN MARC MICHEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">系統和方法公開用於環境物聯網系統中的省電和功率控制。由環境IoT設備消耗執行的方法包括從讀取器接收控制指示以觸發D2R傳輸和目標傳輸功率的指示；確定目標傳輸功率是否在環境IoT設備消耗的功率預算內；以及響應於確定目標傳輸功率在環境IoT設備消耗的功率預算內，以目標傳輸功率執行D2R傳輸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and a method are disclosed for power saving and power control in ambient IoT systems. A method performed by an ambient IoT device includes receiving, from a reader, a control indication to trigger a D2R transmission and an indication of a target transmission power; determining if the target transmission power is within a power budget of the ambient IoT device; and in response to determining that the target transmission power is within the power budget of the ambient IoT device, performing the D2R transmission at the target transmission power.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2001、2002、2003、2004、2005、2006、2007、2008:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="948" publication-number="202614231"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614231.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614231</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112112</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L21/36</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃東勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, DONG HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEONG KWANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文炳鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, BYUNG HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容描述一種半導體裝置，其包括：一第一下部磊晶圖案，其在一閘極結構之一側上，其中該第一下部磊晶圖案連接至一下部主動圖案；一第一上部磊晶圖案，其在該閘極結構之另一側上，其中該第一上部磊晶圖案連接至一上部主動圖案；一切割圖案，其與該下部主動圖案及該上部主動圖案間隔開，鄰近於該閘極結構，且在一第一方向上延伸；以及一通孔結構，其在該切割圖案中連接至該第一下部磊晶圖案及該第一上部磊晶圖案，其中該通孔結構包括：一第一柱部分，其在一第二方向上與該第一上部磊晶圖案重疊；一第二柱部分，其在該第二方向上與該第一下部磊晶圖案重疊；以及一連接部分，其在該第一方向上延伸以連接該第一柱部分及該第二柱部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a first lower epitaxial pattern on a side of a gate structure, wherein the first lower epitaxial pattern is connected to a lower active pattern; a first upper epitaxial pattern on another side of the gate structure, wherein the first upper epitaxial pattern is connected to an upper active pattern; a cut pattern that is spaced apart from the lower and upper active patterns, is adjacent the gate structure, and extends in a first direction; and a via structure connected to the first lower epitaxial pattern and the first upper epitaxial pattern in the cut pattern, wherein the via structure includes a first pillar part overlapping the first upper epitaxial pattern in a second direction, a second pillar part overlapping the first lower epitaxial pattern in the second direction, and a connecting part extending in the first direction to connect the first and second pillar parts.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">150:切割圖案</p>  
        <p type="p">152:襯裡絕緣膜</p>  
        <p type="p">154:填充絕緣膜</p>  
        <p type="p">160A:第一下部源極/汲極圖案</p>  
        <p type="p">180:通孔結構</p>  
        <p type="p">182:連接部分</p>  
        <p type="p">184:第一柱部分</p>  
        <p type="p">186:第二柱部分</p>  
        <p type="p">260A:第一上部源極/汲極圖案</p>  
        <p type="p">1601:第一下部磊晶圖案</p>  
        <p type="p">1602:第二下部磊晶圖案</p>  
        <p type="p">2601:第一上部磊晶圖案</p>  
        <p type="p">2602:第二上部磊晶圖案</p>  
        <p type="p">A11:第一下部主動圖案</p>  
        <p type="p">A12:第二下部主動圖案</p>  
        <p type="p">A21:第一上部主動圖案</p>  
        <p type="p">A22:第二上部主動圖案</p>  
        <p type="p">A-A',B-B',C-C',D-D',E-E':線</p>  
        <p type="p">BCA:背面源極/汲極接點</p>  
        <p type="p">BCM:背面連接接點</p>  
        <p type="p">BCM1:第二連接圖案</p>  
        <p type="p">FCA:正面源極/汲極接點</p>  
        <p type="p">FCA1:第一連接圖案</p>  
        <p type="p">G11:第一閘極結構</p>  
        <p type="p">G12:第二閘極結構</p>  
        <p type="p">G21:第三閘極結構</p>  
        <p type="p">G22:第四閘極結構</p>  
        <p type="p">G31:第五閘極結構</p>  
        <p type="p">G32:第六閘極結構</p>  
        <p type="p">I:第一區</p>  
        <p type="p">II:第二區</p>  
        <p type="p">X:第二方向</p>  
        <p type="p">Y:第三方向</p>  
        <p type="p">Z:第一方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="949" publication-number="202614906"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614906.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614906</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112117</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱電轉換模組</chinese-title>  
        <english-title>THERMOELECTRIC CONVERSION MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251230B">H10N10/80</main-classification>  
        <further-classification edition="200601120251230B">B32B3/08</further-classification>  
        <further-classification edition="200601120251230B">B32B3/30</further-classification>  
        <further-classification edition="201901120251230B">B32B7/06</further-classification>  
        <further-classification edition="200601120251230B">B32B15/04</further-classification>  
        <further-classification edition="200601120251230B">B32B15/09</further-classification>  
        <further-classification edition="200601120251230B">B32B15/20</further-classification>  
        <further-classification edition="200601120251230B">B32B27/36</further-classification>  
        <further-classification edition="200601120251230B">B32B7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商琳得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本橋望</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTOHASHI, NOZOMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種具備剝離薄片之熱電轉換模組，其不抑制熱電性能，作為製造步驟時的支撐基材發揮功能，抑制搬送及處理時的變形及損傷，其係具有P型熱電元件與N型熱電元件交互且電氣串接所配置的熱電元件層、設置於前述熱電元件層之第1表面的第1導電層、設置於前述第1導電層之中與前述熱電元件層側之面相反側之面的第1黏著劑層及設置於前述第1黏著劑層之中與前述第1導電層側之面相反側之面的第1剝離薄片，將前述第1剝離薄片切成長度250mm，以前述長度方向之中心懸吊時，前述第1剝離薄片之彎曲率為R1000以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:熱電轉換模組</p>  
        <p type="p">2:熱電元件層</p>  
        <p type="p">2p:P型熱電元件</p>  
        <p type="p">2n:N型熱電元件</p>  
        <p type="p">2a:熱電元件層2之第2表面</p>  
        <p type="p">2b:熱電元件層2之第1表面</p>  
        <p type="p">3a:第2黏著劑層</p>  
        <p type="p">3b:第1黏著劑層</p>  
        <p type="p">4a:第2導電層</p>  
        <p type="p">4b:第1導電層</p>  
        <p type="p">5a:第2剝離薄片</p>  
        <p type="p">5b:第1剝離薄片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="950" publication-number="202614397"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614397.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614397</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112123</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於電子元件的熱控制設備</chinese-title>  
        <english-title>THERMAL CONTROL APPARATUS FOR AN ELECTRONIC COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L23/34</main-classification>  
        <further-classification edition="200601120251229B">H01L23/36</further-classification>  
        <further-classification edition="200601120251229B">H01L23/367</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商波音公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE BOEING COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇丁德拉　斯瓦迪什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUDHINDRA, SWADISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯里尼瓦　薩穆爾蒂　賈亞拉姆　Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRINIVASA MURTHY, JAYARAM B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古里亞科瑟　馬修斯　萊斯利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURIAKOSE, MATHEWS LESLIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種熱控制設備。該熱控制設備包括一積體電路（IC）及配置成與該IC熱連通之一加熱器膜。該加熱器膜配置成在相對冷的條件期間或確切而言在與該IC相關聯之一溫度達到一臨限值時選擇性地加熱該IC。該熱控制設備亦包括一散熱器，該散熱器配置成與該IC熱連通用於在相對熱的條件期間耗散該IC所產生之熱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a thermal control apparatus. The thermal control apparatus includes an integrated circuit (IC) and a heater film arranged in thermal communication with the IC. The heater film is arranged to selectively heat the IC during relatively cold conditions, or rather, when a temperature associated with the IC reaches a threshold. The thermal control apparatus also includes a heatsink arranged in thermal communication with the IC for dissipating heat generated by the IC during relatively hot conditions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:熱控制設備</p>  
        <p type="p">102:PCB</p>  
        <p type="p">104:IC</p>  
        <p type="p">106:熱墊</p>  
        <p type="p">108:加熱器膜/薄膜智慧型加熱器</p>  
        <p type="p">110:框架</p>  
        <p type="p">112:繫留式螺釘</p>  
        <p type="p">114:框架體</p>  
        <p type="p">116:安裝支柱</p>  
        <p type="p">118:切口</p>  
        <p type="p">120:加熱柱/傳導柱</p>  
        <p type="p">122:各別下端</p>  
        <p type="p">124:各別上端</p>  
        <p type="p">126:頂部表面</p>  
        <p type="p">128:散熱器</p>  
        <p type="p">130:基部</p>  
        <p type="p">132:散熱片</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="951" publication-number="202612983"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612983.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612983</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112183</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於特別是飛機的外蒙皮區域的空氣動力學表面結構、相應方法及用途</chinese-title>  
        <english-title>AERODYNAMIC SURFACE STRUCTURE FOR AN OUTER SKIN AREA, IN PARTICULAR OF AN AIRCRAFT, CORRESPONDING METHOD AND USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">B64C21/10</main-classification>  
        <further-classification edition="200601120251230B">B63B1/34</further-classification>  
        <further-classification edition="200601120251230B">F15D1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商巴斯夫塗料有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASF COATINGS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商漢莎技術股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUFTHANSA TECHNIK AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克萊班博格　史凡　歐里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRABBENBORG, SVEN OLLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅內爾特　蘿拉　珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEHNERT, LAURA-JANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮茲內爾　亨德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PITZNER, HENDRIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕斯克　菲立克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PASKER, FELIX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費格　納理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEIGL, NELE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐賽爾　奧利佛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OESER, OLIVER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏納里　克勞迪亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BONELLI, CLAUDIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕賽內克　托比亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PESENACKER, TOBIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林蘭君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於受紊流氣流影響之外蒙皮區域(4)，特別是用於飛機(100)的外蒙皮區域(4)的空氣動力學表面結構，該空氣動力學表面結構(2)包括微結構化層(6)，該微結構化層(6)經組態以降低該空氣動力學表面結構(2)所附著之該外蒙皮區域(4)在紊流氣流中之摩擦阻力，其中該微結構化層(6)包括面向該氣流之方向(d&lt;sub&gt;F&lt;/sub&gt;)之前邊緣(8)。&lt;br/&gt;根據本發明，提出配置為鄰近於該前邊緣(8)之前導邊緣部分(10)，其中該前導邊緣部分(10)包括面向該氣流之該方向(d&lt;sub&gt;F&lt;/sub&gt;)之導流表面(12)，其中該導流表面(12)經組態以將該氣流導引於該前邊緣(8)上方且朝向該微結構化層(6)。該微結構化層(6)可包括肋條結構(14)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to an aerodynamic surface structure for an outer skin area (4) affected by a turbulent airflow, in particular for an outer skin area (4) of an aircraft (100), the aerodynamic surface structure (2) comprising a micro-structured layer (6) configured to reduce a frictional resistance of the outer skin area (4) to which the aerodynamic surface structure (2) is attached in a turbulent airflow, wherein the micro-structured layer (6) comprises a forward edge (8) facing towards the direction of the airflow (d&lt;sub&gt;F&lt;/sub&gt;).&lt;br/&gt;According to the invention&lt;b/&gt;a leading edge portion (10) arranged adjacent to the forward edge (8) is proposed, wherein the leading edge portion (10) comprises a flow guiding surface (12) facing towards the direction of the airflow (d&lt;sub&gt;F&lt;/sub&gt;), wherein the flow guiding surface (12) is configured to guide the airflow above the forward edge (8) and towards the micro-structured layer (6). The micro-structured layer (6) may comprise a riblet structure (14).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:空氣動力學表面層</p>  
        <p type="p">4:外蒙皮區域</p>  
        <p type="p">100:飛機</p>  
        <p type="p">102:在流之方向上變寬之表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="952" publication-number="202614444"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614444.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614444</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112232</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路封裝及其製備方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT PACKAGE AND METHOD OF FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">H01L23/538</main-classification>  
        <further-classification edition="200601120250902B">H01L23/535</further-classification>  
        <further-classification edition="200601120250902B">H01L23/525</further-classification>  
        <further-classification edition="200601120250902B">H01L23/31</further-classification>  
        <further-classification edition="200601120250902B">H01L25/10</further-classification>  
        <further-classification edition="200601120250902B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇安治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, AN-JHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李孟燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MENG-TSAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉淳亦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHUN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳世偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉泰佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TAI-YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施伯昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, PO-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉德強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, DER-CHYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種積體電路封裝及其形成的方法。積體電路封裝可包括第一重分佈結構、在第一重分佈結構之上的第一橋接晶粒、在第一橋接晶粒周圍的第一包封體、在第一橋接晶粒和第一包封體之上的第二重分佈結構、第一邏輯晶粒、第二邏輯晶粒、以及在第二重分佈結構之上的第一輸入/輸出（I/O）晶粒、以及在第一邏輯晶粒、第二邏輯晶粒、以及第一I/O晶粒周圍的第二包封體。在俯視圖中，第一I/O 晶粒可在第一邏輯晶粒和第二邏輯晶粒之間。第一橋接晶粒可將第一重分佈結構電性連接到第二重分佈結構。第一I/O晶粒可將第一邏輯晶粒電性連接到第二邏輯晶粒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit package and the method of forming are provided. The integrated circuit package may include a first redistribution structure, a first bridge die over the first redistribution structure, a first encapsulant around the first bridge die, a second redistribution structure over the first bridge die and the first encapsulant, a first logic die, a second logic die, and a first input/output (I/O) die over the second redistribution structure, and a second encapsulant around the first logic die, the second logic die, and the first I/O die. The first I/O die may be between the first logic die and the second logic die in a top-down view. The first bridge die may electrically connect the first redistribution structure to the second redistribution structure. The first I/O die may electrically connect the first logic die to the second logic die.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20、30、40、50、60、70:積體電路晶粒</p>  
        <p type="p">108、135:重分佈結構</p>  
        <p type="p">108A:精細特徵部分</p>  
        <p type="p">108B:粗糙特徵部分</p>  
        <p type="p">110、124、127、133、139、142:介電層</p>  
        <p type="p">112、126、134:金屬化圖案</p>  
        <p type="p">128、136、144:凸塊下金屬化層</p>  
        <p type="p">130:導通孔</p>  
        <p type="p">131、137:底部填充劑</p>  
        <p type="p">132、138:包封體</p>  
        <p type="p">146:膠帶</p>  
        <p type="p">148:框架</p>  
        <p type="p">154:導電連接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="953" publication-number="202613898"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613898.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613898</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112256</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理方法、資訊處理裝置及電腦程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251231B">G06N99/00</main-classification>  
        <further-classification edition="202001120251231B">G06F30/20</further-classification>  
        <further-classification edition="200601120251231B">H01L21/02</further-classification>  
        <further-classification edition="200601120251231B">H01L21/3065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安崎遼路</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANZAKI, RYOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於調整目標軌道產生算法之資訊處理方法、資訊處理裝置及電腦程式。 &lt;br/&gt;於本發明之資訊處理方法中，進行以下處理：目標軌道產生處理，其係使用目標軌道產生算法產生表示基板處理裝置之動作時所控制之變量之目標值的目標軌道，上述目標軌道產生算法包含上述目標軌道產生處理中未變更之可調整參數；及參數調整處理，其係使用用於評估上述目標軌道產生處理之結果之評估函數來調整上述可調整參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S114:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="954" publication-number="202614242"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614242.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614242</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112300</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/60</main-classification>  
        <further-classification edition="200601120251230B">H01L21/301</further-classification>  
        <further-classification edition="200601120251230B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐崎秀彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARASAKI, HIDEHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>置田尚吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKITA, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高崎俊行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKASAKI, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>針貝篤史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARIKAI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種接合體之製造方法，具備：元件晶片製備步驟，係製備第1基板經個片化之元件晶片；元件晶片運送步驟，係將所製備之元件晶片運送至集束型設備；元件晶片洗淨步驟，係洗淨由元件晶片運送步驟所運送之元件晶片；接合步驟，係將元件晶片接合於第2基板；元件晶片製備步驟具備保護膜形成步驟，係於具有元件區域及分割區域之第1基板的第1主面之上形成保護膜；除去分割區域之第1基板上之保護膜及第1基板，使第1基板分割成分別具備元件區域之複數個元件晶片，且使被覆於元件晶片之第1主面側的保護膜殘留。元件晶片洗淨步驟包含：於集束型設備所具備之洗淨單元，將保護膜自元件晶片除去。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="955" publication-number="202614822"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614822.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614822</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112335</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251231B">H10D30/67</main-classification>  
        <further-classification edition="200601120251231B">B64G1/24</further-classification>  
        <further-classification edition="200601120251231B">B64G1/36</further-classification>  
        <further-classification edition="200601120251231B">B64G1/44</further-classification>  
        <further-classification edition="200601120251231B">B64G1/54</further-classification>  
        <further-classification edition="200601120251231B">H01L21/203</further-classification>  
        <further-classification edition="200601120251231B">H01L21/205</further-classification>  
        <further-classification edition="200601120251231B">H01L21/316</further-classification>  
        <further-classification edition="202301120251231B">H10B12/00</further-classification>  
        <further-classification edition="202301120251231B">H10B41/70</further-classification>  
        <further-classification edition="202301120251231B">H10B99/00</further-classification>  
        <further-classification edition="202501120251231B">H10D30/01</further-classification>  
        <further-classification edition="202501120251231B">H10D86/40</further-classification>  
        <further-classification edition="202301120251231B">H10K59/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎舜平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, SHUNPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井坂史人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISAKA, FUMITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大野敏和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHNO, TOSHIKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤優一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, YUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種電特性良好的半導體裝置。半導體裝置包括：氧化物半導體層；第一絕緣層；具有隔著第一絕緣層與氧化物半導體層重疊的部分的導電層；以及具有隔著氧化物半導體層與第一絕緣層重疊的部分的第二絕緣層。氧化物半導體層包含銦。第二絕緣層的熱膨脹係數小於氧化物半導體層的熱膨脹係數。第一絕緣層具有俘獲氧及氫的功能，並且第二絕緣層具有包含過量氧的區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:絕緣層</p>  
        <p type="p">30:半導體層</p>  
        <p type="p">50:絕緣層</p>  
        <p type="p">60:導電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="956" publication-number="202613225"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613225.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613225</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112518</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在基材上形成圖案化光阻層的製備方法</chinese-title>  
        <english-title>METHOD OF MANUFACTURING A PATTERNED PHOTORESIST LAYER OVER A BASE MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250602B">C08K3/01</main-classification>  
        <further-classification edition="200601120250602B">C08K3/24</further-classification>  
        <further-classification edition="200601120250602B">C08K3/32</further-classification>  
        <further-classification edition="200601120250602B">C08L101/00</further-classification>  
        <further-classification edition="200601120250602B">G03F7/004</further-classification>  
        <further-classification edition="200601120250602B">G03F7/20</further-classification>  
        <further-classification edition="200601120250602B">G03F7/40</further-classification>  
        <further-classification edition="200601120250602B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南亞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊正偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種在基材上形成圖案化光阻層的製備方法以及在基層中形成複數個開口的製備方法。該製備方法包括提供一基材；在該基材上形成一光阻層，其中該光阻層包括一種負膨脹係數材料；對該光阻層進行圖案化以形成一第一實際圖案，且該第一實際圖案具有一第一關鍵尺寸；以及對該光阻層施加一能量以將該第一實際圖案變成一第二實際圖案，其中該第二實際圖案具有一第二關鍵尺寸，且該第二關鍵尺寸與該第一實際圖案的該第一關鍵尺寸不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a method of manufacturing a patterned photoresist layer over a base material and a method of manufacturing a plurality of openings in a base layer are provided. The method includes: providing a base material; forming a photoresist layer over the base material, wherein the photoresist layer includes a negative expansion coefficient material; patterning the photoresist layer to form a first actual pattern having a first critical dimension; and applying an energy to the photoresist layer so that the first actual pattern becomes a second actual pattern, wherein the second actual pattern has a second critical dimension different from the first critical dimension of the first actual pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">7:第二實際圖案</p>  
        <p type="p">7a:部分</p>  
        <p type="p">20:基材</p>  
        <p type="p">21:基層</p>  
        <p type="p">22:碳層</p>  
        <p type="p">23:抗反射塗佈(ARC)層</p>  
        <p type="p">24:犧牲層</p>  
        <p type="p">50:光阻層</p>  
        <p type="p">71:第一部分</p>  
        <p type="p">72:第二部分</p>  
        <p type="p">73:第三部分</p>  
        <p type="p">201:頂面</p>  
        <p type="p">H7:第二高度</p>  
        <p type="p">P7:第二間距</p>  
        <p type="p">S7:第二空隙</p>  
        <p type="p">W7:第二寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="957" publication-number="202614024"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614024.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614024</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112538</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>驅動電路、顯示裝置與其顯示面板的驅動方法</chinese-title>  
        <english-title>DRIVER CIRCUIT, DISPLAY DEVICE AND DRIVING METHOD OF DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120250528B">G09G3/3233</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴佳成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIA-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宜錦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YI-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種驅動電路、顯示裝置與其顯示面板的驅動方法。顯示裝置包括源極驅動器、顯示面板以及多工器。多工器的共同端耦接至源極驅動器的源極驅動通道的輸出端。多工器包括多個選擇端，每一選擇端耦接至顯示面板的多條資料線中的一對應者。這些資料線的每一者具有一對應色屬性。耦接至多工器的這些資料線中至少二者的色屬性皆為第一色。多工器在一個單元週期中對每一個選擇端選用一次。多工器在這一個單元週期中連續選用色屬性同為第一色的這些資料線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a driver circuit, a display device and a driving method of a display panel thereof. The display device includes a source driver, a display panel, and a multiplexer. A common terminal of the multiplexer is coupled to an output terminal of a source driver channel of the source driver. The multiplexer includes a plurality of selection terminals, each coupled to a corresponding one of a plurality of data lines of the display panel. Each of the data lines has a corresponding color attribute. The color attribute of at least two of the data lines coupled to the multiplexer are a first color. The multiplexer selects each of the selection terminals once in a unit period. The multiplexer continuously selects the data lines with the same color attribute as the first color in the unit period.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S410、S420:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="958" publication-number="202614215"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614215.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614215</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112689</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理設備及基板處理方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/311</main-classification>  
        <further-classification edition="200601120251230B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＰＳＫ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PSK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金雅蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, A RAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭珉在</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, MIN JAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明概念提供一種用於處理基板之設備。該處理基板之設備可包括處理腔室，具有用於在其中處理基板的處理空間；支撐單元，用於支撐在處理空間中的基板；電漿產生腔室，設置在處理腔室的外部且具有用於從處理氣體產生電漿的電漿產生空間；擋板，配置在處理空間與電漿產生空間之間；及電離裝置，用於釋放支撐單元上支撐的基板上的電荷，以移除基板上殘留的電荷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The inventive concept provides an apparatus for processing a substrate. The apparatus for processing a substrate may include a treatment chamber having a treatment space for processing a substrate therein; a support unit for supporting a substrate in the treatment space; a plasma generation chamber provided outside the treatment chamber and having a plasma generation space for generating plasma from treatment gas; a baffle disposed between the treatment space and the plasma generation space; and an ionization device for discharging a charge on a substrate supported on the support unit to remove a residual charge on the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板處理設備</p>  
        <p type="p">100:腔室</p>  
        <p type="p">110:處理腔室</p>  
        <p type="p">112:處理空間</p>  
        <p type="p">120:電漿產生腔室</p>  
        <p type="p">122:電漿產生空間</p>  
        <p type="p">200:擋板</p>  
        <p type="p">210:孔</p>  
        <p type="p">300:支撐單元</p>  
        <p type="p">310:靜電吸盤</p>  
        <p type="p">311:介電板</p>  
        <p type="p">312:靜電電極</p>  
        <p type="p">320:下電極</p>  
        <p type="p">321:流動路徑</p>  
        <p type="p">322:流體供應管線</p>  
        <p type="p">323:流體回收管線</p>  
        <p type="p">400:下電力單元</p>  
        <p type="p">410:第二電源</p>  
        <p type="p">420:第二匹配器</p>  
        <p type="p">500:源單元</p>  
        <p type="p">510:線圈</p>  
        <p type="p">520:第一電源</p>  
        <p type="p">530:第一匹配器</p>  
        <p type="p">600:氣體供應單元</p>  
        <p type="p">610:氣體供應源</p>  
        <p type="p">620:氣體供應管線</p>  
        <p type="p">700:排氣裝置</p>  
        <p type="p">800:電離裝置</p>  
        <p type="p">900:控制器</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="959" publication-number="202614812"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614812.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614812</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112919</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251106B">H10D30/60</main-classification>  
        <further-classification edition="202501120251106B">H10D62/10</further-classification>  
        <further-classification edition="202501120251106B">H10D64/20</further-classification>  
        <further-classification edition="200601120251106B">H01L21/768</further-classification>  
        <further-classification edition="200601120251106B">H01L23/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金宣嬉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEONHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金冠佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, GUANWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉承勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, SEUNGYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭恩志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, EUN-JI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪元赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, WONHYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置包括電晶體，位於基板上，電晶體包括導電圖案；第一金屬層，位於電晶體上，第一金屬層包括第一配線線和在第一配線線下方的第一通孔；以及蝕刻停止層，位於電晶體和第一金屬層之間。第一通孔穿透蝕刻停止層並連接導電圖案和第一配線線。第一通孔包括第一阻擋圖案、位於第一阻擋圖案上的第二阻擋圖案、以及位於第二阻擋圖案和蝕刻停止層之間的側阻擋圖案。側阻擋圖案包括過渡金屬氧化物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device including a transistor on a substrate, the transistor including a conductive pattern; a first metal layer on the transistor, the first metal layer including a first wiring line and a first via below the first wiring line; and an etching stop layer between the transistor and the first metal layer. The first via penetrates the etching stop layer and connects the conductive pattern and the first wiring line. The first via includes a first barrier pattern, a second barrier pattern on the first barrier pattern, and a side barrier pattern between the second barrier pattern and the etching stop layer. The side barrier pattern includes a transition metal oxide.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="960" publication-number="202612682"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612682.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612682</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114112963</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>口腔用組成物</chinese-title>  
        <english-title>COMPOSITION FOR ORAL USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K8/25</main-classification>  
        <further-classification edition="200601120260102B">A61K8/73</further-classification>  
        <further-classification edition="200601120260102B">A61K8/60</further-classification>  
        <further-classification edition="200601120260102B">A61Q11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一三共健康事業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIICHI SANKYO HEALTHCARE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大坪桃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUBO, MOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>志賀一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIGA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種口腔用組成物，其為包含研磨劑及黏結劑之口腔用組成物，將5mm拉伸試驗及10mm拉伸試驗中的拉伸恢復力分別設為TF5及TF10時，TF5相對於TF10之比(TF5/TF10)為1.1以上且10以下，牽絲性為2mm以上且未滿24mm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="961" publication-number="202613721"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613721.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613721</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113089</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於導引雷射輻射之光束導引裝置及微影系統</chinese-title>  
        <english-title>BEAM GUIDING DEVICE FOR GUIDING LASER RADIATION AND LITHOGRAPHY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G03F7/20</main-classification>  
        <further-classification edition="202101120260102B">G02B7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商創浦半導體雷射系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRUMPF LASERSYSTEMS FOR SEMICONDUCTOR SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫海　派翠克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORHAI, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡森　東尼　威爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANSSEN, TONI WIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史崔肯　艾莉珊卓　馬修思</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRUYCKEN, ALEXANDER MATTHIJS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛瑞茲基　多米尼克　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GORECKI, DOMINIK ERYK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種用於導引雷射輻射之光束導引裝置(200)，其包括：一本體(201)，其具有一內光束通道(202)；及一光束導引元件(205)，特定而言係一鏡面，其配置於該光束通道(202)內側，其中至少一個套筒(210、211)配置於該光束通道(202)內側，使得一間隙(207)存在於該套筒(210、211)之一外表面與該本體(201)之一內表面之間以用於將該套筒(210、211)與該本體(201)熱解耦。本發明進一步涉及一種微影系統(101)，特定而言係極紫外線微影系統，其包括具有如之前所提及之一光束導引裝置(200)之一驅動雷射(100)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention concerns a beam guiding device (200) for guiding laser radiation, comprising a body (201) with an inner beam channel (202) and an optical beam guiding element (205), in particular a mirror, that is arranged inside the beam channel (202), wherein at least one sleeve (210, 211) is arranged inside the beam channel (202) such that a gap (207) exists between an outer surface of the sleeve (210, 211) and an inner surface of the body (201) for thermally decoupling the sleeve (210, 211) from the body (201). The present invention further concerns a lithography system (101), in particular extreme ultraviolet lithography system, comprising a drive laser (100) with a beam guiding device (200) as mentioned before.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:光束導引裝置</p>  
        <p type="p">201:本體</p>  
        <p type="p">202:光束通道/內光束通道</p>  
        <p type="p">203:入口開口</p>  
        <p type="p">204:出口開口</p>  
        <p type="p">205:光束導引元件/鏡面</p>  
        <p type="p">207:間隙</p>  
        <p type="p">210:套筒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="962" publication-number="202613198"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613198.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613198</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113216</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分散液之製造方法及水性分散液之製造方法</chinese-title>  
        <english-title>METHOD FOR PRODUCING DISPERSION AND METHOD FOR PRODUCING AQUEOUS DISPERSION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">C08F214/18</main-classification>  
        <further-classification edition="200601120251216B">C08F2/18</further-classification>  
        <further-classification edition="200601120251216B">C08J3/075</further-classification>  
        <further-classification edition="200601120251216B">C08G18/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴崎浩輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBASAKI, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐橋祐亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAHASHI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳谷碧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANAGIYA, AOI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>織岡真理子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORIOKA, MARIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部香織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, KAORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豊田瑞菜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYODA, MIZUNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大繼聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUGU, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田口大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAGUCHI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巨勢丈裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSE, TAKEHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種分散液之製造方法，係在包含水與水溶性聚合引發劑且不含氟系乳化劑之反應系統中，將溫度保持在高於前述聚合引發劑之半衰期溫度或將壓力保持在0.8MPaG以上，使氣態氟烯烴聚合而獲得包含相對於總質量小於10質量%之聚合物之粒子的分散液，該聚合物之粒子之平均粒徑為1~150nm且包含以前述氟烯烴為主體之單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="963" publication-number="202612795"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612795.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612795</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113222</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法、基板處理裝置、及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B05D7/00</main-classification>  
        <further-classification edition="200601120251231B">B32B37/12</further-classification>  
        <further-classification edition="200601120251231B">B05C9/12</further-classification>  
        <further-classification edition="200601120251231B">B05C13/02</further-classification>  
        <further-classification edition="200601120251231B">B05C11/105</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前田雄平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA, YUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西屋憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIYA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>筒井努</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUTSUI, TSUTOMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡澤智樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAZAWA, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兵働弘充</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HYODO, HIROMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉原孝介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIHARA, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山中晋一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANAKA, SHINICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供容易在基板間的間隙填充藥液的方法及裝置。 &lt;br/&gt;　　[解決手段]基板處理方法，包含：將貼合第1基板(W1)與第2基板(W2)的層積基板(W3)以第1基板W1位於第2基板(W2)之上水平保持的狀態，對第1基板(W1)的周緣部(W1a)供應藥液，使藥液從第1基板(W1)的周緣部(W1a)移動至第1基板(W1)與第2基板(W2)的間隙(G)的步驟；使移動至間隙(G)的藥液硬化的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:液處理模組</p>  
        <p type="p">5:旋轉保持部</p>  
        <p type="p">6:第1噴嘴</p>  
        <p type="p">7:第2噴嘴</p>  
        <p type="p">8:噴嘴移動機構</p>  
        <p type="p">51:保持部</p>  
        <p type="p">52:旋轉驅動部</p>  
        <p type="p">91:第1藥液供應部</p>  
        <p type="p">92:第2藥液供應部</p>  
        <p type="p">100:控制裝置</p>  
        <p type="p">W1:第1基板</p>  
        <p type="p">W2:第2基板</p>  
        <p type="p">W1a:第1基板的周緣部</p>  
        <p type="p">W3a:層積基板的周緣部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="964" publication-number="202613722"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613722.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613722</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113272</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於導引雷射輻射之光束導引裝置及微影系統</chinese-title>  
        <english-title>BEAM GUIDING DEVICE FOR GUIDING LASER RADIATION AND LITHOGRAPHY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">G03F7/20</main-classification>  
        <further-classification edition="200601120251219B">G02B5/08</further-classification>  
        <further-classification edition="202101120251219B">G02B7/00</further-classification>  
        <further-classification edition="202101120251219B">G02B7/182</further-classification>  
        <further-classification edition="202101120251219B">G02B7/198</further-classification>  
        <further-classification edition="200601120251219B">G02B26/08</further-classification>  
        <further-classification edition="200601120251219B">G02B27/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商創浦半導體雷射系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRUMPF LASERSYSTEMS FOR SEMICONDUCTOR SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗洛里奇　薩洽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FROHLICH, SASCHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史奇林　湯姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHILLING, TOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗洛里奇　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FROHLLICH, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高德　派翠克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAUDER, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐　瓦姆希達爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONE, VAMSHIDHAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於導引雷射輻射之光束導引裝置(200)，其包括一本體(201)，該本體(201)具有一內光束通道(202)、配置於該光束通道內部之一光束導引元件(205)，特定言之一反射鏡及用於固持該本體(201)之一托架(203)，其中該本體(201)經由一第一撓曲軸承(207)、一第二撓曲軸承(208)及一旋轉接頭(209)連接至該托架(203)。本發明進一步係關於一種微影系統(101)，特定言之極紫外光微影系統，其包括具有如上文提及之一光束導引裝置(200)之一驅動雷射(100)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention concerns a beam guiding device (200) for guiding laser radiation, comprising a body (201) with an inner beam channel (202), an optical beam guiding element (205), in particular a mirror, that is arranged inside the beam channel and a bracket (203) for holding the body (201), wherein the body (201) is connected to the bracket (203) via a first flexure bearing (207), a second flexure bearing (208) and a revolute joint (209). The invention further concerns a lithography system (101), in particular extreme ultraviolet lithography system, comprising a drive laser (100) with a beam guiding device (200) as mentioned before.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:光束導引裝置</p>  
        <p type="p">201:本體</p>  
        <p type="p">202:光束通道</p>  
        <p type="p">203:托架</p>  
        <p type="p">205:光束導引元件/反射鏡</p>  
        <p type="p">205’:光束導引元件/反射鏡</p>  
        <p type="p">206:導引元件固持器</p>  
        <p type="p">207:撓曲軸承</p>  
        <p type="p">208:撓曲軸承</p>  
        <p type="p">209:旋轉接頭</p>  
        <p type="p">A:方向</p>  
        <p type="p">B:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="965" publication-number="202612611"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612611.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612611</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113301</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於保持廚房用具的裝置</chinese-title>  
        <english-title>DEVICE FOR HOLDING OF KITCHEN UTILITIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251230B">A47B88/00</main-classification>  
        <further-classification edition="201701120251230B">A47B88/60</further-classification>  
        <further-classification edition="201701120251230B">A47B88/969</further-classification>  
        <further-classification edition="201701120251230B">A47B88/981</further-classification>  
        <further-classification edition="201701120251230B">A47B88/988</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商朱利葉斯百隆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JULIUS BLUM GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯哈普特　盧卡斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLHAUPT, LUKAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈布　多明尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GABL, DOMINIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於保持廚房用具（特別是盤子）的裝置（1），包括至少一個支承架（2）和至少兩個保持件（3），其中該等至少兩個保持件（3）可拆卸地安裝在該至少一個支承架（2）上，而該等至少兩個保持件（3）之間的間距（A）可在該至少一個支承架（2）的縱向延伸（L）的方向上進行調節，其中該等至少兩個保持件（3）以較佳是圍繞該至少一個支承架（2）的縱向延伸（L）相對於該至少一個支承架（2）可旋轉的方式安裝在該至少一個支承架（2）上，以便從該至少一個支承架（2）上拆卸和/或調節該等至少兩個保持件（3）之間的間距（A）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:裝置</p>  
        <p type="p">2:支承架</p>  
        <p type="p">3:保持件</p>  
        <p type="p">3a:抵靠部分</p>  
        <p type="p">3b:固位托</p>  
        <p type="p">3c:橫向支桿</p>  
        <p type="p">4:卡入式鎖止裝置</p>  
        <p type="p">4a:第一齒形部分</p>  
        <p type="p">5:閉鎖裝置</p>  
        <p type="p">5a:凸緣</p>  
        <p type="p">5b:閉鎖元件</p>  
        <p type="p">5c:致動元件</p>  
        <p type="p">6:位置指示器</p>  
        <p type="p">7:連接件</p>  
        <p type="p">7a:凹陷式握把</p>  
        <p type="p">A:間距</p>  
        <p type="p">D:「D」部分</p>  
        <p type="p">L:縱向延伸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="966" publication-number="202613617"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613617.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613617</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113457</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子光子積體電路裝置及其操作方法以及光子積體電路裝置</chinese-title>  
        <english-title>ELECTRONIC-PHOTONIC INTEGRATED CIRCUIT DEVICE AND OPERATION METHOD THEREOF AND PHOTONIC INTEGRATED CIRCUIT DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250911B">G02B6/12</main-classification>  
        <further-classification edition="202301120250911B">G06N3/0464</further-classification>  
        <further-classification edition="202301120250911B">G06N3/063</further-classification>  
        <further-classification edition="200601120250911B">G06N3/067</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯又誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YOU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯蘇　斯帝芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUSU, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓聯洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, LAN-CHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾銘洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, MING YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃泰鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TAI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於卷積神經網路的電子光子積體電路裝置在光子積體電路中執行類比數位轉換（ADC）或數位類比轉換（DAC）的各個方面。可以使用光調製器來執行DAC。每一個光調製器接收共同表示輸入值或核權重的多個電輸入訊號。電輸入訊號被施加到不同的調製器區段。調製器區段組合起來將數位數據編碼為對應的類比光訊號。ADC可包括分割光輸出訊號以及向每一個分割訊號提供不同程度的衰減。具有各種衰減級別的分割訊號被轉換為電輸出訊號，電輸出訊號與參考電壓進行比較，以確定數位編碼。可以選擇衰減級別，以便可以使用一個參考電壓進行所有的比較。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic-photonic integrated circuit device for a convolutional neural network performs aspects of analog-to-digital conversion (ADC) or digital-to-analog conversion (DAC) in the photonic integrated circuit. The DAC may be performed using optical modulators. Each optical modulator receives a plurality of electrical input signals collectively representing an input value or kernel weight. The electrical input signals are applied to distinct modulator segments. The modulator segments combine to encode the digital data into a corresponding analog optical signal. The ADC may include splitting the optical output signals and providing distinct degrees of attenuation to each of the signal splits. The signals splits with various attenuation levels are converted into electrical output signals that are compared to a reference voltage to determine a digital encoding. The attenuation levels may be selected so that one reference voltage may be used for all the comparisons.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:EPIC裝置</p>  
        <p type="p">101:光源</p>  
        <p type="p">105:光線</p>  
        <p type="p">109:電光轉換器</p>  
        <p type="p">113:電輸入訊號</p>  
        <p type="p">117:光輸入訊號</p>  
        <p type="p">121:光輸入數據</p>  
        <p type="p">125:光學核權重</p>  
        <p type="p">129:光學芯子</p>  
        <p type="p">133、157:光輸出訊號</p>  
        <p type="p">137:分光器</p>  
        <p type="p">141:訊號分割</p>  
        <p type="p">143:電氣控制訊號</p>  
        <p type="p">145:光訊號轉換器</p>  
        <p type="p">149:衰減器</p>  
        <p type="p">153:光電輸出模組</p>  
        <p type="p">161:光電轉換器</p>  
        <p type="p">165:PIC晶粒/光子晶粒</p>  
        <p type="p">169、177:電輸出訊號</p>  
        <p type="p">173:放大器/放大器陣列</p>  
        <p type="p">181:解碼器</p>  
        <p type="p">185:EIC晶粒/電子晶粒</p>  
        <p type="p">189:現場可程式化閘陣列/FPGA</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="967" publication-number="202613283"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613283.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613283</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113468</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可聚合的液晶調配物</chinese-title>  
        <english-title>POLYMERIZABLE LIQUID CRYSTAL FORMULATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C09K19/04</main-classification>  
        <further-classification edition="200601120251229B">C09K19/18</further-classification>  
        <further-classification edition="200601120251229B">C09K19/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬克專利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙爾蓋伊娃　奧列克珊卓拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARGAIEVA, OLEKSANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>UA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛克　索斯騰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHENK, THORSTEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬爾卡希　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MULCAHY, STEPHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於可聚合的液晶調配物(作為液晶材料之子類)、尤其用於噴墨印刷之可聚合的油墨調配物，其較佳地無PFAS (以能夠減少全氟碳化物並提供環境友好材料)且包括一或多種可聚合的液晶原化合物(亦稱為反應性液晶原(RM))及一或多種選自芳香族酯及芳香族或脂肪族二酯溶劑之群之有機溶劑；自該等調配物獲得之聚合物及聚合物膜；及該等調配物、聚合物及聚合物膜在光學或電光組件或裝置中之用途，尤其用於數位光學裝置或擴增實境或虛擬實境(AR/VR)應用，如偏光器、光學補償器、反射膜、繞射或表面光柵、布拉格偏振光柵(Bragg polarization grating) (布拉格PG)、偏光體積光柵(PVG)、偏光體積全息圖(PVH)、盤查拉特納姆-貝裡(Pancharatnam Berry, PB)光柵、非機械光束導向元件、光學波導、光學耦合器、光學組合器、偏振分光器、部分反射鏡、鏡片或PB鏡片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to polymerizable liquid crystal formulations （as a subcategory of liquid crystal material）, especially to polymerizable ink formulations for inkjet printing, which are preferably PFAS-free （for enabling the reduction of perfluorocarbons and providing an environment friendly material）, and which are comprising one or more polymerizable mesogenic compounds, also known as reactive mesogens （RMs）, and one or more organic solvents selected from the group of aromatic ester and aromatic or aliphatic diester solvents, to polymers and polymer films obtained from such formulations, and to the use of the formulations, polymers and polymer films in optical or electrooptical components or devices, especially for digital optics or augmented reality or virtual reality （AR/VR） applications like polarizers, optical compensators, reflective films, diffraction or surface gratings, Bragg polarization gratings （Bragg PG）, polarization volume gratings （PVG）, polarization volume holograms （PVH）, Pancharatnam Berry （PB） gratings, nonmechanical beam steering elements, optical waveguides, optical couplers, optical combiners, polarization beam splitters, partial mirrors, lenses or PB lenses.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="968" publication-number="202613191"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613191.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613191</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113543</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚醯亞胺前驅物組合物及其製法與利用其形成絕緣層的用途及方法</chinese-title>  
        <english-title>POLYIMIDE PRECURSOR COMPOSITION AND PREPARATION METHOD THEREOF, AND USE AND METHOD OF FORMING INSULATING LAYER USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C08F2/44</main-classification>  
        <further-classification edition="200601120251229B">C08F290/14</further-classification>  
        <further-classification edition="200601120251229B">C08G73/10</further-classification>  
        <further-classification edition="200601120251229B">C08G73/12</further-classification>  
        <further-classification edition="200601120251229B">G03F7/004</further-classification>  
        <further-classification edition="200601120251229B">G03F7/027</further-classification>  
        <further-classification edition="200601120251229B">G03F7/20</further-classification>  
        <further-classification edition="200601120251229B">G03F7/40</further-classification>  
        <further-classification edition="200601120251229B">H01L21/312</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李長榮化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LCY CHEMICAL CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>高雄市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝蕙璟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HUI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡鴻名</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, HUNG-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張財源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TSAI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鵬程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PENG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱茲絜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JU, TZ-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種聚醯亞胺前驅物組合物，其包括聚醯亞胺前驅物以及添加劑化合物。所述添加劑化合物包括選自三烷氧矽基或含氮雜環基的第一官能基以及選自(甲基)丙烯酸酯基、含氮雜環基、或胺基的第二官能基。所述聚醯亞胺前驅物係選自下述中的其一或其組合：(1)具有源自具有矽-氧-矽基或丙烯酸基的二胺單體的結構單元的第一聚醯亞胺前驅物；(2)具有經含氮雜環基取代的胺基末端的第二聚醯亞胺前驅物；或(3)以具有異氰酸基的化合物改性的第三聚醯亞胺前驅物。所述聚醯亞胺前驅物及/或所述添加劑化合物中的至少其一包括含氮雜環基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polyimide precursor composition includes a polyimide precursor and an additive compound. The additive compound includes a first functional group selected from a trialkoxysilyl group and a nitrogen-containing heterocyclic group and a second functional group selected from a (meth)acrylate group, a nitrogen-containing heterocyclic group, and an amine group. The polyimide precursor is selected from one or a combination thereof of the following: (1) a first polyimide precursor having a structural unit derived from a diamine monomer having a Si-O-Si group or an acrylic group; (2) a second polyimide precursor having an amino terminal substituted with a nitrogen-containing heterocyclic group; and (3) a third polyimide precursor modified with a compound having an isocyanate group. The polyimide precursor and/or the additive compound includes a nitrogen-containing heterocyclic group.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S107:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="969" publication-number="202614887"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614887.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614887</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113558</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光半導體元件密封用片材</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251231B">H10H20/853</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浅井量子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAI, RYOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤友二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中俊平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, SHUMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種防眩性優異且顏色均勻性優異之光半導體元件密封用片材。 &lt;br/&gt;光半導體元件密封用片材1係用以密封配置於基板5上之1個以上光半導體元件6之片材。光半導體元件密封用片材1具備至少包含硬化性樹脂層(A)21之密封用樹脂層2。於密封用樹脂層2之相對於光半導體元件6密封面2a為相反側之面2b，貼附有具有凹凸面4a之剝離襯墊4之凹凸面4a。硬化性樹脂層(A)21與剝離襯墊4之凹凸面4a接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光半導體元件密封用片材</p>  
        <p type="p">2:密封用樹脂層</p>  
        <p type="p">2a:第一面(光半導體元件密封面)</p>  
        <p type="p">2b:第二面</p>  
        <p type="p">3,4:剝離襯墊</p>  
        <p type="p">4a:凹凸面</p>  
        <p type="p">21:硬化性樹脂層(A)</p>  
        <p type="p">22:硬化性樹脂層(B)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="970" publication-number="202613186"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613186.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613186</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113599</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在串聯排列的聚合區之間傳遞聚合物粒子的方法與系統</chinese-title>  
        <english-title>PROCESS AND SYSTEM FOR TRANSFERRING POLYMER PARTICLES BETWEEN POLYMERIZATION ZONES ARRANGED IN SERIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C08F2/00</main-classification>  
        <further-classification edition="200601120251229B">C08F2/01</further-classification>  
        <further-classification edition="200601120251229B">C08F2/34</further-classification>  
        <further-classification edition="200601120251229B">C08F6/00</further-classification>  
        <further-classification edition="200601120251229B">B01J8/00</further-classification>  
        <further-classification edition="200601120251229B">B01J8/12</further-classification>  
        <further-classification edition="200601120251229B">B01J8/18</further-classification>  
        <further-classification edition="200601120251229B">B01J8/26</further-classification>  
        <further-classification edition="200601120251229B">C08L23/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商魯瑪斯諾弗蘭科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUMMUS NOVOLEN TECHNOLOGY GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班格斯　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANGERTH, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種將一產物從一第一聚合區(101)傳遞至與該第一聚合區(101)串聯排列之一第二聚合區(301)的方法。該方法包含：將該第一聚合區(101)的產物從該第一聚合區(101)排出；將該產物分離成一氣相，該氣相包含該第一聚合區(101)中所使用的任何未反應單體及氣態劑，及一固相，該固相包含一聚合產物；及透過彼此併聯排列且彼此選擇性連通之一第一傳遞容器(202)及一第二傳遞容器(203)中的至少一者，將該固相傳遞至該第二聚合區(301)，其中該第一傳遞容器(202)及該第二傳遞容器(203)中之至少一者進一步與該第二聚合區(301)選擇性連通，且該第二聚合區(301)為一氣相聚合區。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process is provided for transferring a product from a first polymerization zone (101) to a second polymerization zone (301) arranged in series with the first polymerization zone (101). The process comprises: discharging a product of the first polymerization zone (101) from the first polymerization zone (101); separating the product into a gas phase comprising any unreacted monomer and gaseous agent used in the first polymerization zone (101), and a solid phase comprising a polymerization product; and transferring the solid phase to the second polymerization zone (301) via at least one of a first transfer vessel (202) and a second transfer vessel (203) arranged in parallel to each other and in selective communication with each other, wherein the at least one of the first transfer vessel (202) and second transfer vessel (203) is further in selective communication with the second polymerization zone (301), and the second polymerization zone (301) is a gas-phase polymerization zone.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:系統</p>  
        <p type="p">2,4,5,6,7,9,10,15,16,19,21,23,25,26:流動線</p>  
        <p type="p">3,8,11,12,13,14,17,18,20,22,24:閥門</p>  
        <p type="p">101:第一聚合區</p>  
        <p type="p">201:氣固分離單元</p>  
        <p type="p">202:第一傳遞容器</p>  
        <p type="p">203:第二傳遞容器</p>  
        <p type="p">204,402:壓縮機</p>  
        <p type="p">301:第二聚合區</p>  
        <p type="p">401:排放容器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="971" publication-number="202614747"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614747.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614747</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113702</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高深寬比特徵部中之垂直導電線的隔離方法</chinese-title>  
        <english-title>METHOD FOR ISOLATING VERTICAL CONDUCTIVE LINES IN HIGH ASPECT RATIO FEATURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251219B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOANG, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加尼　尼古拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANI, NICOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚忠魁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, ZHONGKUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊文兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WENBING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬踏米斯　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATAMIS, GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遲昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI, HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李柏昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BAICHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　暹華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, SAMANTHA SIAMHWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種3D-DRAM之位元線之隔離方法，包括：沉積一導電層於蝕刻停止層上及相對的電晶體堆疊之間之溝槽內；沉積一填充材料於溝槽內；以及沉積並圖案化包含複數垂直開口之遮罩層於蝕刻停止層及填充材料上。遮罩層之複數垂直開口係配置於需移除以隔離3D-DRAM之位元線之導電層之對應位置上。該方法包括，經由複數垂直開口以蝕刻溝槽內之填充材料，以移除填充材料之部分以暴露位於垂直位元線位置之間之導電層之部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for isolating bitlines of a 3D-DRAM includes depositing a conductive layer on an etch stop layer and in trenches between facing stacks of transistors; depositing a filler material in the trenches; and depositing and patterning a mask layer including a plurality of vertical openings on the etch stop layer and the filler material. The plurality of vertical openings of the mask layer are arranged above corresponding locations of the conductive layer that need to be removed to isolate bitlines of the 3D-DRAM. The method includes etching the filler material in the trenches through the plurality of vertical openings to remove portions of the filler material to expose portions of the conductive layer located between vertical bitline locations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:3D-DRAM</p>  
        <p type="p">52:基板</p>  
        <p type="p">54A:第一電晶體堆疊</p>  
        <p type="p">54B:第二電晶體堆疊</p>  
        <p type="p">82:垂直位元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="972" publication-number="202614227"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614227.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614227</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113931</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在水溶液中鉬的濕式原子層蝕刻方法</chinese-title>  
        <english-title>METHODS FOR WET ATOMIC LAYER ETCHING OF MOLYBDENUM IN AQUEOUS SOLUTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">H01L21/3213</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大漢　圖拉西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAHAL, TULASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於在濕式ALE製程中蝕刻鉬的方法。本文所揭示的方法使用廣泛諸多的技術及濕蝕刻化學品以在濕式ALE製程的表面改質步驟中氧化鉬表面並形成自限制的鉬氧化物鈍化層。在本文所揭示的濕式ALE製程及方法中，藉由添加多牙配位基至水性氧化溶液而於氧化步驟中提供自限制行為。多牙配位基與氧化後的鉬表面發生反應並相結合以形成穩定的、不可溶於水性氧化溶液中的配位基-鉬氧化物複合物。配位基-鉬複合物在水性氧化溶液中的不可溶性提供氧化步驟中的自限制行為。在形成鉬氧化物鈍化層之後，於濕式ALE製程的溶解步驟中選擇性地移除鈍化層以蝕刻鉬表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods are provided for etching molybdenum in a wet ALE process. The methods disclosed herein use a wide variety of techniques and wet etch chemistries to oxidize a molybdenum surface and form a self-limiting, molybdenum oxide passivation layer in a surface modification step of the wet ALE process. In the wet ALE processes and methods disclosed herein, self-limiting behavior is provided in the oxidation step by adding a polydentate ligand to an aqueous oxidizing solution. The polydentate ligand reacts with and binds to the oxidized molybdenum surface to form a stable, ligand-molybdenum oxide complex, which is insoluble within the aqueous oxidizing solution. The insolubility of the ligand-molybdenum complex in the aqueous oxidizing solution provides self-limiting behavior in the oxidation step. After forming the molybdenum oxide passivation layer, the passivation layer is selectively removed in a dissolution step of the wet ALE process to etch the molybdenum surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:表面改質步驟</p>  
        <p type="p">205:鉬層</p>  
        <p type="p">210:介電材料</p>  
        <p type="p">215:表面改質溶液</p>  
        <p type="p">220:氧化劑</p>  
        <p type="p">224:多牙配位基</p>  
        <p type="p">225:鉬氧化物鈍化層</p>  
        <p type="p">230:第一淨化步驟</p>  
        <p type="p">235:第一淨化溶液</p>  
        <p type="p">240:溶解步驟</p>  
        <p type="p">245:溶解溶液</p>  
        <p type="p">250:第二淨化步驟</p>  
        <p type="p">255:第二淨化溶液</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="973" publication-number="202612612"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612612.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612612</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114113953</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於保持至少一個廚房用具的保持裝置</chinese-title>  
        <english-title>HOLDING DEVICE FOR HOLDING AT LEAST ONE KITCHEN UTENSIL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251230B">A47B88/00</main-classification>  
        <further-classification edition="201701120251230B">A47B88/90</further-classification>  
        <further-classification edition="201701120251230B">A47B88/969</further-classification>  
        <further-classification edition="201701120251230B">A47B88/981</further-classification>  
        <further-classification edition="201701120251230B">A47B88/988</further-classification>  
        <further-classification edition="200601120251230B">A47B77/14</further-classification>  
        <further-classification edition="200601120251230B">A47J47/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商朱利葉斯百隆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JULIUS BLUM GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯哈普特　盧卡斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLHAUPT, LUKAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈布　多明尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GABL, DOMINIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於保持較佳是板形和/或橢圓形的至少一個廚房用具（14）的保持裝置（9），其中該保持裝置（9）包括用於支承在抽屜（6）上的至少一個支座（10），其中設置至少兩個可移動安裝的支承件（11a、11b），用於承載該至少一個廚房用具（14），其中該等支承件（11a、11b）之至少一者，較佳是兩個支承件（11a、11b）相對於該支座（10）可旋轉地安裝，其中該至少一個支承件（11a、11b）可在不同的旋轉位置上抵靠在該至少一個廚房用具（14）的圓周邊緣上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A holding device (9) for holding at least one, preferably plate-shaped and/or oval, kitchen utensil (14), the holding device (9) including at least one carrier (10) for supporting on a drawer (6), wherein at least two movably-supported bearing members (11a, 11b) are provided for holding the at least one kitchen utensil (14), wherein at least one of the bearing members (11a, 11b), preferably both bearing members (11a, 11b), is or are pivotally supported relative to the carrier (10), wherein the at least one bearing member (11a, 11b) is configured to bear against a peripheral edge of the at least one kitchen utensil (14) in different pivoting positions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6:抽屜</p>  
        <p type="p">7:抽屜壁</p>  
        <p type="p">7a:抽屜側壁</p>  
        <p type="p">7b:抽屜前面板</p>  
        <p type="p">7c:抽屜後面板</p>  
        <p type="p">8:抽屜底板</p>  
        <p type="p">9:保持裝置</p>  
        <p type="p">10:支座</p>  
        <p type="p">10a:支座部件</p>  
        <p type="p">11a:支承件</p>  
        <p type="p">11b:支承件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="974" publication-number="202614593"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614593.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614593</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114045</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＳＣＡＤＡ伺服器—用戶端系統</chinese-title>  
        <english-title>SCADA SERVER-CLIENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250901B">H04L41/06</main-classification>  
        <further-classification edition="200601120250901B">H04L12/46</further-classification>  
        <further-classification edition="200601120250901B">G05B19/042</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＭＥＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TMEIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野島章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOJIMA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水伸夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, NOBUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一個實施型態的SCADA伺服器-用戶端系統具備有：與多重化的網路之各者連接且可進行利用複數個處理器核心的平行處理之SCADA伺服器；以及與多重化的網路之各者連接且可進行利用複數個處理器核心的平行處理之用戶端。藉由使用多重化的網路，從SCADA伺服器對用戶端平行地發送資料，從用戶端對SCADA伺服器平行地發送資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A SCADA server-client system according to one embodiment of the present disclosure includes a SCADA server connected to each of multiplex networks and capable of parallel processing using multiple processor cores, and a client connected to each of the multiplex networks and capable of parallel processing using multiple processor cores. By using the multiplex networks, data are transmitted in parallel from the SCADA server to the client, and from the client to the SCADA server.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:多重化通訊路</p>  
        <p type="p">51:第一通訊路</p>  
        <p type="p">52:第二通訊路</p>  
        <p type="p">100:用戶端</p>  
        <p type="p">200:SCADA伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="975" publication-number="202613741"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613741.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613741</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114164</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理裝置、機差解析方法及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G05B19/4063</main-classification>  
        <further-classification edition="200601120260102B">G05B19/418</further-classification>  
        <further-classification edition="200601120260102B">G05B23/02</further-classification>  
        <further-classification edition="200601120260102B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卜惠貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BU, HUIZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種進一步提昇基板處理裝置的機差解析的精度的技術。 &lt;br/&gt;  一種資訊處理裝置，係進行多個基板處理裝置的機差解析，具有：再構成誤差矩陣作成部，係使用以成為基準之資料集訓練後的降維模型來驗證多個基板處理裝置的資料集的再構成誤差，以作成多個基板處理裝置的再構成誤差矩陣；機差計算部，係將選自再構成誤差矩陣所含之多個再構成誤差之至少一部分的再構成誤差的大小作為機差來加以計算出；以及顯示控制部，係使顯示裝置顯示所計算出的機差。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:裝置控制器</p>  
        <p type="p">30:機差計算部</p>  
        <p type="p">32:再構成誤差矩陣作成部</p>  
        <p type="p">34:訓練部</p>  
        <p type="p">36:資料記憶部</p>  
        <p type="p">38:顯示控制部</p>  
        <p type="p">40:操作接受部</p>  
        <p type="p">42:資料集取得部</p>  
        <p type="p">50,52:降維模型</p>  
        <p type="p">54:基準資料集記憶部</p>  
        <p type="p">56:解析資料集記憶部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="976" publication-number="202612907"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612907.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612907</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114203</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導熱性轉印帶、其製造方法、塗膜轉印具及電子零件之構裝方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">B32B27/20</main-classification>  
        <further-classification edition="201901120251224B">B32B7/027</further-classification>  
        <further-classification edition="200601120251224B">C08L83/04</further-classification>  
        <further-classification edition="201801120251224B">C08K3/013</further-classification>  
        <further-classification edition="201801120251224B">C09J7/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士高分子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJI POLYMER INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士可比安股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJICOPIAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀬古晃都</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKO, AKITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>服部真和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATTORI, MASAKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曽我部淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOGABE, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木教一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KYOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水隆史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勝呂登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATSURO, NOBORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之導熱性轉印帶1包含剝離片層3及其上之導熱性片層2，導熱性片層2包含基質樹脂及導熱性填料，導熱性片層2可自剝離片層3剝離並進行按壓轉印。該導熱性轉印帶1被捲取至塗膜轉印具內之捲取芯並裝填於其中，導熱性片層2側被按壓轉印至被轉印面。藉此，提供一種不會滴落且可連續轉印之導熱性轉印帶、其製造方法、塗膜轉印具及電子零件之構裝方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:導熱性轉印帶</p>  
        <p type="p">2:導熱性片層</p>  
        <p type="p">3:剝離片層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="977" publication-number="202614831"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614831.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614831</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114253</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括絕緣層的半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE INCLUDING INSULATING LAYERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250801B">H10D62/17</main-classification>  
        <further-classification edition="202501120250801B">H10D30/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃俊善</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, JUNSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, RA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金菊喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, GUKHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文裕智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛正熊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, JEONGWOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李潓姈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYERYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河承錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HA, SEUNGSEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置包括一基體、一基體絕緣層、一第一隔離區、閘極電極、複數個通道層、源極/汲極區、一背側接觸插塞以及一背側隔離區。該基體包括一第一區及一第二區。該基體絕緣層安置於該基體之一下部表面上。該第一隔離區穿過該基體且朝著該基體絕緣層延伸。該等閘極電極安置於該基體之一上部表面上。該等複數個通道層由該等閘極電極包圍。該等源極/汲極區安置於該等閘極電極之相對側處，且連接至該等複數個通道層。該背側接觸插塞連接至該等源極/汲極區。該背側隔離區穿過該基體及該基體絕緣層，且該背側隔離區將該基體分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a substrate, a substrate insulating layer, a first isolation region, gate electrodes, a plurality of channel layers, source/drain regions, a backside contact plug, and a backside isolation region. The substrate includes a first region and a second region. The substrate insulating layer is disposed on a lower surface of the substrate. The first isolation region passes through the substrate and extends towards the substrate insulating layer. The gate electrodes are disposed on an upper surface of the substrate. The plurality of channel layers are surrounded by the gate electrodes. The source/drain regions are disposed at opposite sides of the gate electrodes, and are connected to the plurality of channel layers. The backside contact plug is connected to the source/drain regions. The backside isolation region passes through the substrate and the substrate insulating layer, and the backside isolation region separates the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">101:半導體基體</p>  
        <p type="p">102:絕緣材料</p>  
        <p type="p">140:通道結構</p>  
        <p type="p">141:第一通道層</p>  
        <p type="p">142:第二通道層</p>  
        <p type="p">143:第三通道層</p>  
        <p type="p">150A:第一源極/汲極區</p>  
        <p type="p">150B:第二源極/汲極區</p>  
        <p type="p">152:第一磊晶層</p>  
        <p type="p">154:第二磊晶層</p>  
        <p type="p">160:閘極結構</p>  
        <p type="p">162:閘極介電層</p>  
        <p type="p">164:閘極隔片層</p>  
        <p type="p">165:閘極電極</p>  
        <p type="p">166:罩蓋層</p>  
        <p type="p">170:前部接觸插塞</p>  
        <p type="p">180:背側接觸插塞</p>  
        <p type="p">185:背側電力結構</p>  
        <p type="p">190:基體絕緣層</p>  
        <p type="p">192:第一層間絕緣層</p>  
        <p type="p">194:第二層間絕緣層</p>  
        <p type="p">196:絕緣材料</p>  
        <p type="p">198:第三層間絕緣層</p>  
        <p type="p">BIL:背側隔離區</p>  
        <p type="p">d1:長度</p>  
        <p type="p">I-I',II-II:線</p>  
        <p type="p">IL1:第一隔離區</p>  
        <p type="p">IL2:第二隔離區</p>  
        <p type="p">t1:第一厚度</p>  
        <p type="p">t2:第二厚度</p>  
        <p type="p">W1:第一寬度</p>  
        <p type="p">W2:第二寬度</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="978" publication-number="202614157"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614157.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614157</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114298</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無氧化性電漿之矽氧化物沉積</chinese-title>  
        <english-title>OXIDIZING PLASMA-FREE SILICON OXIDE DEPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H01L21/02</main-classification>  
        <further-classification edition="200601120251219B">C23C16/455</further-classification>  
        <further-classification edition="200601120251219B">C23C16/507</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼　德　卡斯楚　瑞吉兒　安娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NYE DE CASTRO, RACHEL ANNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞迪　卡蒲　瑟利西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REDDY, KAPU SIRISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豪斯曼恩　丹尼斯　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAUSMANN, DENNIS M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪克羅　安組　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCKERROW, ANDREW JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納恩　威廉　陶德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUNN, WILLIAM TODD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克勞克林　凱文　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCLAUGHLIN, KEVIN M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供利用無氧電漿沉積含矽材料（例如氧化矽）的方法及設備。方法涉及使用具有氧原子之含矽前驅物，並激發無氧電漿以將含矽前驅物轉化成氧化矽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and apparatuses for depositing silicon-containing materials such as silicon oxide using an oxygen-free plasma are provided. Methods involve using a silicon-containing precursor having an oxygen atom and igniting an oxygen-free plasma to convert the silicon-containing precursor to silicon oxide.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:操作</p>  
        <p type="p">104:操作</p>  
        <p type="p">106:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="979" publication-number="202613396"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613396.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613396</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114335</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有自動開關方向處理之電子鎖具</chinese-title>  
        <english-title>ELECTRONIC LOCKSET WITH AUTOMATIC HANDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">E05B47/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商亞薩亞布羅美國地區股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASSA ABLOY AMERICAS RESIDENTIAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科爾曼　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COLEMAN, KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅威特　馬修　登頓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOVETT, MATTHEW DENTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一般而言，本發明揭示一種具有自動開關方向判定之電子鎖具。該鎖具可安裝至一門，且該鎖具可自動判定該門之一開關方向以正確地鎖定及解鎖該門。揭示用於判定開關方向之各種技術，包含分析該門之一影像、選擇該門之一影像、基於在擺動一門時捕捉之資料導出開關方向、判定一外部參考點之一位置、判定一閂鎖總成之態樣之一旋轉位置、執行另一技術，或該等所描述技術之一組合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In general, an electronic lockset with automatic handing determination is disclosed. The lockset may be mounted to a door, and the lockset may automatically determine a handing of the door to properly lock and unlock the door. Various techniques are disclosed for determining handing, including analyzing an image of the door, selecting an image of the door, deriving handing based on data captured when swinging a door, determining a location of an external reference point, determining a rotational location of aspects of a latch assembly, performing another technique, or a combination of the described techniques.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:門</p>  
        <p type="p">100:鎖具/鎖</p>  
        <p type="p">108:內部總成</p>  
        <p type="p">110:外部總成</p>  
        <p type="p">112:閂鎖總成</p>  
        <p type="p">114:鎖栓</p>  
        <p type="p">116:處理單元</p>  
        <p type="p">117:外部電路系統</p>  
        <p type="p">120:小鍵盤</p>  
        <p type="p">131:感測器</p>  
        <p type="p">138:外部天線</p>  
        <p type="p">140:馬達</p>  
        <p type="p">142:內部天線</p>  
        <p type="p">143:運動感測器</p>  
        <p type="p">144:處理器</p>  
        <p type="p">145:安全晶片</p>  
        <p type="p">146:記憶體</p>  
        <p type="p">147:Wi-Fi介面</p>  
        <p type="p">148:藍牙介面/藍牙低功耗(BLE)介面</p>  
        <p type="p">149:安全應用程式</p>  
        <p type="p">150:電池</p>  
        <p type="p">152:閂鎖總成感測器</p>  
        <p type="p">154:感測器</p>  
        <p type="p">156:加速度計</p>  
        <p type="p">158:陀螺儀</p>  
        <p type="p">160:磁力計</p>  
        <p type="p">162:射頻感測器</p>  
        <p type="p">164:紅外線感測器</p>  
        <p type="p">166:超音波感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="980" publication-number="202614158"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614158.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614158</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114349</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>區域選擇性碳部分間隙填充製程</chinese-title>  
        <english-title>AREA SELECTIVE CARBON PARTIAL GAPFILL PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H01L21/02</main-classification>  
        <further-classification edition="200601120251219B">H01L21/768</further-classification>  
        <further-classification edition="200601120251219B">C23C16/02</further-classification>  
        <further-classification edition="200601120251219B">C23C16/04</further-classification>  
        <further-classification edition="200601120251219B">C23C16/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王珮琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PEIQI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納加拉詹　阿南沙文卡塔拉曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGARAJAN, ANANTHA VENKATARAMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加達米迪　瓦姆西克里希納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GADDAMEDI, VAMSHI KRISHNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克哈嘉　艾比杜亞西斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHAJA, ABDUL AZIZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括在處理體積中接收基板，該基板上包含具有不同臨界尺寸的結構。在處理體積中形成電漿。使用電漿以惰性終止基團對結構的頂表面進行化學改性。在對結構的頂表面進行化學改性之後，在基板的表面上方沉積介電膜。介電膜是在相鄰結構之間的溝槽中沉積的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes receiving a substrate in a process volume, the substrate comprising structures thereon having varying critical dimensions. A plasma is formed in a process volume. A top surface of the structures is chemically modified with an inert termination group using the plasma. Subsequent to modifying the top surface of the structures, a dielectric film is deposited over a surface of the substrate. The dielectric film is deposited in a trench between adjacent structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">126:基板</p>  
        <p type="p">302:結構</p>  
        <p type="p">306:介電膜</p>  
        <p type="p">510:第一層</p>  
        <p type="p">512:第二層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="981" publication-number="202614449"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614449.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614449</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114397</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及製造電子裝置的方法</chinese-title>  
        <english-title>ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L25/10</main-classification>  
        <further-classification edition="200601120251230B">H01L23/00</further-classification>  
        <further-classification edition="200601120251230B">H01L23/498</further-classification>  
        <further-classification edition="200601120251230B">H01L25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李王谷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WANG GU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, KYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫印蘇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOK, IN SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種製造一電子裝置之方法，其可包括沿著一第一載體之一上部側提供對準導電襯墊及內部互連件，及將一連接組件之對準互連件耦接至所述對準導電襯墊。該方法亦包括將該連接組件及所述內部互連件囊封於一下部囊封體中，及用一上部基板覆蓋該下部囊封體之一上部側。該方法亦包括經由該上部基板將一第一電子組件及一第二電子組件之第一互連件耦接至連接組件互連件且將該第一電子組件及該第二電子組件之第二互連件耦接至所述內部互連件。該方法進一步包括從該下部囊封體之一下部側移除該第一載體，及用一下部基板覆蓋該下部囊封體之該下部側。本文中亦揭示其他範例及相關電子裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of manufacturing an electronic device may include providing alignment conductive pads and internal interconnects along an upper side of a first carrier and coupling alignment interconnects of a connect component to the alignment conductive pads. The method also includes encapsulating the connect component and the internal interconnects in a lower encapsulant, and covering an upper side of the lower encapsulant with an upper substrate. The method also includes coupling, via the upper substrate, first interconnects of a first electronic component and a second electronic component to the connect component interconnects and second interconnects of the first electronic component and the second electronic component to the internal interconnects. The method further includes removing the first carrier from a lower side of the lower encapsulant, and covering the lower side of the lower encapsulant with a lower substrate. Other examples and related electronic devices are also disclosed herein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">120a:第一電子組件</p>  
        <p type="p">120b:第二電子組件</p>  
        <p type="p">120c:第三電子組件</p>  
        <p type="p">121:組件互連件</p>  
        <p type="p">124:連接組件</p>  
        <p type="p">125a:組件互連件</p>  
        <p type="p">125b:組件互連件</p>  
        <p type="p">126a:對準互連件</p>  
        <p type="p">126b:對準互連件</p>  
        <p type="p">130L:下部基板</p>  
        <p type="p">130U:上部基板</p>  
        <p type="p">131L:下部基板介電結構</p>  
        <p type="p">131U:上部基板介電結構</p>  
        <p type="p">132L:下部基板導電結構</p>  
        <p type="p">132La:下部基板上部端子</p>  
        <p type="p">132Lb:下部基板下部端子</p>  
        <p type="p">132U:上部基板導電結構</p>  
        <p type="p">132Ua:上部基板上部端子</p>  
        <p type="p">132Ub:上部基板下部端子</p>  
        <p type="p">140L:下部囊封體</p>  
        <p type="p">140U:上部囊封體</p>  
        <p type="p">145:內部互連件</p>  
        <p type="p">150U:上部底部填充物</p>  
        <p type="p">170:下部基板互連件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="982" publication-number="202613700"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613700.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613700</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114417</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反射型空白光罩及反射型光罩之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251216B">G03F1/20</main-classification>  
        <further-classification edition="201201120251216B">G03F1/24</further-classification>  
        <further-classification edition="201201120251216B">G03F1/48</further-classification>  
        <further-classification edition="201201120251216B">G03F1/54</further-classification>  
        <further-classification edition="201201120251216B">G03F1/60</further-classification>  
        <further-classification edition="201201120251216B">G03F1/78</further-classification>  
        <further-classification edition="201201120251216B">G03F1/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>櫻井敬佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKURAI, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[解決手段]一種反射型空白光罩，係具備有：基板；多層反射膜，將極端紫外線區域光即曝光光反射；保護膜；光吸收膜，吸收曝光光；及硬遮罩膜，保護膜，係由被設置於基板側的第1層與被設置於遠離基板之側的第2層所構成，保護膜之第2層，係以對能夠蝕刻光吸收膜之乾蝕刻具有耐性的材料所形成，光吸收膜，係具有相位移功能，由單層或複數層所形成，且單層及構成複數層之各個層，係由以釕(Ru)為主成分的材料所形成。 &lt;br/&gt;　　[效果]不會對多層反射膜造成因光吸收膜之蝕刻(圖案化)所導致的損傷而可在具有相位移功能之光吸收膜形成微細的輔助圖案，並可製造具有形成有輔助圖案之具有相位移功能的光吸收膜之圖案的反射型光罩。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">2:多層反射膜</p>  
        <p type="p">3:保護膜</p>  
        <p type="p">4:光吸收膜</p>  
        <p type="p">5:硬遮罩膜</p>  
        <p type="p">31:第1層</p>  
        <p type="p">32:第2層</p>  
        <p type="p">101:反射型空白光罩</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="983" publication-number="202612776"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612776.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612776</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114462</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>方法、系統及電腦程式</chinese-title>  
        <english-title>METHOD, SYSTEM, AND PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">B01D53/40</main-classification>  
        <further-classification edition="200601120251230B">B01D53/83</further-classification>  
        <further-classification edition="200601120251230B">F23J15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米山健太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEYAMA, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎武志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASAKI, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠更有效率地對藉由焚燒廢棄物而產生的廢氣進行中和處理的技術。根據本發明之一態樣，提供一種與對藉由焚燒廢棄物而產生的廢氣進行中和處理相關的方法。該方法具備下列各步驟。於取得步驟中，取得關於廢棄物之量的第一資訊，以及關於廢氣中所含之預定物質的濃度的第二資訊。於生成步驟中，根據第一資訊及第二資訊以及參考資訊，生成關於對廢氣進行中和處理時所使用之中和劑的第三資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To provide a technology capable of more efficiently neutralizing exhaust gas from waste incineration. According to an aspect of the present disclosure, a method is provided that is implemented in connection with neutralization of exhaust gas generated by incinerating waste. The method includes the following steps. In an acquisition step, first information related to the amount of waste and second information related to the concentration of a predetermined substance contained in the exhaust gas are acquired. In a generation step, third information related to a neutralizing agent used in neutralizing the exhaust gas is generated based on the first information, the second information, and reference information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:與中和處理相關的系統</p>  
        <p type="p">11:廢棄物供給裝置</p>  
        <p type="p">12:焚燒爐</p>  
        <p type="p">13:鍋爐</p>  
        <p type="p">14:氣體冷卻塔</p>  
        <p type="p">15:集塵機</p>  
        <p type="p">16:吸引風扇</p>  
        <p type="p">17:煙囪</p>  
        <p type="p">21:儲存筒倉</p>  
        <p type="p">22:飛灰供給裝置</p>  
        <p type="p">23:貴金屬固定劑添加裝置</p>  
        <p type="p">24:混練機</p>  
        <p type="p">25:灰坑</p>  
        <p type="p">31:重量測定器</p>  
        <p type="p">32:中和劑添加裝置</p>  
        <p type="p">33:氣體濃度測定器</p>  
        <p type="p">4:控制裝置</p>  
        <p type="p">5:通信網路</p>  
        <p type="p">6:使用者終端</p>  
        <p type="p">EG:廢氣</p>  
        <p type="p">P1:廢棄物搬入路</p>  
        <p type="p">P2:配管</p>  
        <p type="p">P3:配管</p>  
        <p type="p">P4:煙道</p>  
        <p type="p">P5:氣體排出路</p>  
        <p type="p">P6:氣體排出路</p>  
        <p type="p">P7:飛灰排出路</p>  
        <p type="p">P8:配管</p>  
        <p type="p">W:廢棄物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="984" publication-number="202613219"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613219.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613219</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114553</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>有機無機複合零件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251229B">C08J7/04</main-classification>  
        <further-classification edition="201801120251229B">C08K3/013</further-classification>  
        <further-classification edition="200601120251229B">C08K3/22</further-classification>  
        <further-classification edition="200601120251229B">C08L101/00</further-classification>  
        <further-classification edition="200601120251229B">C23C24/04</further-classification>  
        <further-classification edition="200601120251229B">B32B27/20</further-classification>  
        <further-classification edition="200601120251229B">B32B9/00</further-classification>  
        <further-classification edition="200601120251229B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商味之素股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AJINOMOTO CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡崎大地</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAZAKI, DAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小椋一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGURA, ICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種有機無機複合零件之製造方法，其能藉由氣溶膠沈積法來將金屬氧化物膜連續地形成於硬化物層上。 &lt;br/&gt;　　[解決課題之手段]一種有機無機複合零件之製造方法，包含步驟(A)：在樹脂組成物經硬化而得的硬化物層之表面上，藉由氣溶膠沈積法，形成厚度0.5μm以上的金屬氧化物膜之步驟，其中，樹脂組成物包含無機填充材，將樹脂組成物的不揮發成分設為100質量%時，無機填充材之含量為75質量%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:樹脂清漆</p>  
        <p type="p">110:硬化物層</p>  
        <p type="p">110S:硬化物層之表面</p>  
        <p type="p">111:無機填充材</p>  
        <p type="p">112:樹脂成分</p>  
        <p type="p">140:金屬氧化物膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="985" publication-number="202613917"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613917.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613917</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114682</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於離線橋接交易的網路系統及方法</chinese-title>  
        <english-title>METHODS AND NETWORK SYSTEM FOR OFFLINE BRIDGING TRANSACTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251224B">G06Q20/32</main-classification>  
        <further-classification edition="201201120251224B">G06Q20/02</further-classification>  
        <further-classification edition="201201120251224B">G06Q20/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商鏈通科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TBCASOFT, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　興泉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, SHIENG-CHYUARN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林桓毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及橋接不同支付服務提供者以執行跨提供者交易的方法及一網路系統。具體而言，本揭露的一些實施例涉及橋接不同服務提供者以執行離線跨提供者的一網路系統及方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to methods and a network system for bridging different payment service providers to execute cross-provider transactions. In particular, some embodiments of the present disclosure relate to methods and a network system for bridging different service providers to execute offline cross-provider transactions.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="986" publication-number="202614762"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614762.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614762</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114858</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251020B">H10B41/27</main-classification>  
        <further-classification edition="202301120251020B">H10B43/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李泫珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYUNJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金容寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YONGKWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金熙中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HUIJUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡熙載</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAE, HEEJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體裝置，其包括：一位元線，其在一第一方向上延伸；一第一閘極電極，其在一第二方向上在該位元線上延伸；一第一閘極絕緣圖案，其包括一第一部分及一第二部分，該第一部分覆蓋該第一閘極電極在該第一方向上的相對側壁中之各者及在該第二方向上的末端部分，該第二部分接觸該第一部分且在該第二方向上延伸；一通道，其在一第三方向上延伸，該通道在該位元線上安置於該第一閘極絕緣圖案在該第一方向上的一側上；以及一第二閘極絕緣圖案及一第二閘極電極，其在該第一方向上在該位元線上依序配置於該通道在該第一方向上的一側上。該第一閘極電極在該第二方向上的一末端部分相對於該第一方向具有一中心部分，且該末端部分在一平面圖中在該第二方向上突出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The semiconductor device include a bit line extending in a first direction, a first gate electrode extending on the bit line in a second direction, a first gate insulation pattern including a first portion covering each of opposite sidewalls in the first direction and the end portion in the second direction of the first gate electrode and a second portion contacting the first portion and extending in the second direction, a channel extending in a third direction, the channel being disposed on a side in the first direction of the first gate insulation pattern on the bit line and a second gate insulation pattern and a second gate electrode sequentially arranged in the first direction on a side in the first direction of the channel on the bit line. An end portion in the second direction of the first gate electrode has a central portion with respect to the first direction, and the end portion protrudes in the second direction in a plan view.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">108:通道</p>  
        <p type="p">109:虛設通道</p>  
        <p type="p">202:第一閘極絕緣圖案</p>  
        <p type="p">210:第一閘極電極</p>  
        <p type="p">220:罩蓋圖案</p>  
        <p type="p">250:第二閘極絕緣圖案</p>  
        <p type="p">260:第二閘極電極</p>  
        <p type="p">270:閘極分隔圖案</p>  
        <p type="p">300:著陸襯墊</p>  
        <p type="p">310:第一電容器電極</p>  
        <p type="p">350:第二絕緣間層</p>  
        <p type="p">610:第二接觸插塞</p>  
        <p type="p">620:第三接觸插塞</p>  
        <p type="p">A-A',B-B':線</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">I:第一區</p>  
        <p type="p">II:第二區</p>  
        <p type="p">WD1:第一寬度</p>  
        <p type="p">WD2:第二寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="987" publication-number="202614137"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614137.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614137</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114935</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線腔室感測器</chinese-title>  
        <english-title>WIRELESS CHAMBER SENSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01J37/32</main-classification>  
        <further-classification edition="200601120260102B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　莊嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUANG-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝謙益</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, QIANYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所揭露的實施例關於一種設備，該設備包含帶有空腔的外殼，以及具有第一表面和第二表面的蓋子。在實施例中，蓋子耦接至外殼，其中第二表面面向外殼。在實施例中，感測器位於蓋子的第一表面上，且電池電耦接至感測器。在實施例中，電池位於空腔內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments disclosed herein relate to an apparatus that includes a housing with a cavity, and a cover with a first surface and a second surface. In an embodiment, the cover is coupled to the housing with the second surface facing the housing. In an embodiment, a sensor is on the first surface of the cover, and a battery is electrically coupled to the sensor. In an embodiment, the battery is within the cavity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">112:板</p>  
        <p type="p">115:外殼</p>  
        <p type="p">117:頂表面</p>  
        <p type="p">118:空腔</p>  
        <p type="p">119:側壁</p>  
        <p type="p">120:感測器系統</p>  
        <p type="p">125:蓋子</p>  
        <p type="p">126:第一表面</p>  
        <p type="p">127:第二表面</p>  
        <p type="p">130A:感測器</p>  
        <p type="p">130B:感測器</p>  
        <p type="p">135:儲能元件</p>  
        <p type="p">136:天線</p>  
        <p type="p">137:跡線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="988" publication-number="202614138"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614138.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614138</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114952</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＢＥＯＬ中之氧化鉬還原之偏壓調節</chinese-title>  
        <english-title>BIAS MODULATION FOR MOLYBDENUM OXIDE REDUCTION IN BEOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01J37/32</main-classification>  
        <further-classification edition="200601120260102B">H01L21/67</further-classification>  
        <further-classification edition="200601120260102B">H01L21/3065</further-classification>  
        <further-classification edition="200601120260102B">H01L21/311</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岑嘉杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CEN, JIAJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周瑞楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, RUINAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏梅許　蘇哈斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMESH, SUHAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　弦龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HSIEN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫　天易</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, TIANYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文實施例一般針對在後端製程中去除金屬氧化物層施加於的系統和方法。基板處理系統包括配置為在處理腔室內產生電漿的處理腔室、嵌入於處理腔室內設置的基板支撐組件中的基板電極、與基板電極耦合的射頻（RF）發生器組件，以及控制器。該控制器配置為使清洗氣體在處理腔室內設置的基板支撐件表面上流動，並產生RF脈衝偏壓，該偏壓在脈衝週期的第一部分傳送RF波形，並在脈衝週期的第二部分停止傳送RF波形，並在處理腔室內存在電漿時將RF脈衝偏壓施加於基板電極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments herein are generally directed to systems and methods for removing metal oxide layers for back-end-of-line processes. A substrate processing system includes a processing chamber configured to generate a plasma within the processing chamber, a substrate electrode embedded within a substrate support assembly disposed within the processing chamber, a radio frequency (RF) generator assembly coupled to the substrate electrode, and a controller. The controller is configured to flow a cleaning gas over a surface of a substrate support disposed within a processing chamber and generate a radio frequency (RF) pulsed bias that delivers an RF waveform for a first portion of a pulse period and halts the delivery of the RF waveform for a second portion of the pulse period and apply the RF pulsed bias to the substrate electrode while the plasma is present in the processing chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">100:基板處理系統</p>  
        <p type="p">102:處理腔室</p>  
        <p type="p">104:基板支撐件</p>  
        <p type="p">106:基板電極</p>  
        <p type="p">108:RF電源</p>  
        <p type="p">110:第一體積</p>  
        <p type="p">112:電漿</p>  
        <p type="p">114:氣體進口</p>  
        <p type="p">116:氣體排氣裝置</p>  
        <p type="p">118:泵</p>  
        <p type="p">120:第二體積</p>  
        <p type="p">122:壁</p>  
        <p type="p">124:底部</p>  
        <p type="p">126:頂部</p>  
        <p type="p">128:介電蓋</p>  
        <p type="p">140:RF發生器組件</p>  
        <p type="p">142:RF偏壓發生器</p>  
        <p type="p">144:RF匹配電路</p>  
        <p type="p">146:過濾器組件</p>  
        <p type="p">150:氣體分配板</p>  
        <p type="p">152:孔</p>  
        <p type="p">154:感應線圈</p>  
        <p type="p">156:處理套組</p>  
        <p type="p">158:處理氣體供應線</p>  
        <p type="p">160:控制器</p>  
        <p type="p">162:中央處理單元(CPU)</p>  
        <p type="p">164:記憶體</p>  
        <p type="p">166:支援電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="989" publication-number="202614045"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614045.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614045</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114954</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有用於臨限選擇器開關之尖波衰減的非揮發性記憶體之雙極解碼器</chinese-title>  
        <english-title>BIPOLAR DECODERS FOR NONVOLATILE MEMORY WITH SPIKE ATTENUATION FOR THRESHOLD SELECTOR SWITCHES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">G11C8/10</main-classification>  
        <further-classification edition="200601120251219B">G11C7/12</further-classification>  
        <further-classification edition="200601120251219B">G11C8/02</further-classification>  
        <further-classification edition="200601120251219B">G11C7/24</further-classification>  
        <further-classification edition="200601120251219B">G11C11/16</further-classification>  
        <further-classification edition="200601120251219B">G11C11/56</further-classification>  
        <further-classification edition="202301120251219B">H10B61/00</further-classification>  
        <further-classification edition="202301120251219B">H10B63/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商晟碟科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANDISK TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊里薩里　尼可拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IRIZARRY, NICOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法蘭克林　納瑟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRANKLIN, NATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕金森　沃德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARKINSON, WARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕特爾　傑迪普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATEL, JAYDIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">對於MRAM及使用諸如雙向臨限開關之臨限選擇器開關的其他記憶體單元技術，當存取一經選擇記憶體單元諸如用於一讀取時，橫跨該記憶體單元的電壓需要足以導通該臨限選擇器開關。此導致一電流尖波，該電流尖波可損壞該記憶體單元並干擾寫入該記憶體單元中之一資料值。為了減少此類尖波，當該臨限選擇器開關導通時，可對偏壓至經選擇字線及經選擇位元線之局域選擇開關進行偏壓，以限制來自解碼電路系統之電流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">For MRAM and other memory cell technologies that use threshold selector switches such as ovonic threshold switches, when accessing a selected memory cell, such as for a read, the voltage across the memory cell needs to be sufficient to turn on the threshold selector switch. This results in a current spike that can damage the memory cell and disturb a data value written in it. To reduce such spikes, the local select switches biasing to the selected word line and selected bit line can be biased to limit the current flow from the decoding circuitry when the threshold selector switch turns on.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體系統</p>  
        <p type="p">102:控制器；記憶體控制器</p>  
        <p type="p">104:非揮發性記憶體；記憶體封裝</p>  
        <p type="p">106:局域記憶體</p>  
        <p type="p">110:前端處理器(FEP)電路</p>  
        <p type="p">112:後端處理器(BEP)電路</p>  
        <p type="p">120:主機</p>  
        <p type="p">122:主機處理器</p>  
        <p type="p">124:主機記憶體</p>  
        <p type="p">126:PCIe介面</p>  
        <p type="p">128:匯流排</p>  
        <p type="p">130:介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="990" publication-number="202614075"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614075.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614075</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114114956</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於效能改善的循環感知適應性程式電壓調諧</chinese-title>  
        <english-title>CYCLING-AWARE ADAPTIVE PROGRAM VOLTAGE TUNING FOR PERFORMANCE IMPROVEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">G11C16/34</main-classification>  
        <further-classification edition="200601120251226B">G11C16/10</further-classification>  
        <further-classification edition="200601120251226B">G11C16/12</further-classification>  
        <further-classification edition="200601120251226B">G11C16/04</further-classification>  
        <further-classification edition="200601120251226B">G11C16/08</further-classification>  
        <further-classification edition="200601120251226B">G11C16/14</further-classification>  
        <further-classification edition="202301120251226B">H10B41/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商晟碟科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANDISK TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡　成慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CHENGQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文　銅一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, DONG-IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　亨利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIN, HENRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種記憶體設備包括連接至字線的記憶體單元。該等記憶體單元設置在記憶體孔中，且經組態以保持對應於資料狀態的一臨限電壓。該等記憶體孔係以分組為串的列來組織，該等串包含複數個區塊之各者。一控制構件經組態以藉由在一智慧驗證操作中程式化連接至該等字線中之一者且與該等串中之一者相關聯的該等記憶體單元來獲取一智慧驗證程式化電壓，該智慧驗證操作包括從一初始程式電壓開始的複數個智慧驗證迴圈。該初始程式電壓係基於該等記憶體單元的一循環條件而調整。該控制構件亦經組態以基於該經調整初始程式電壓，使用該智慧驗證程式化電壓在一程式操作中程式化連接至該等字線的該等記憶體單元中之至少一些。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory apparatus includes memory cells connected to word lines. The memory cells are disposed in memory holes and are configured to retain a threshold voltage corresponding to data states. The memory holes are organized in rows grouped in strings which comprise each of a plurality of blocks. A control means is configured to acquire a smart verify programming voltage by programming the memory cells connected to one of the word lines and associated with one of the strings in a smart verify operation including a plurality of smart verify loops beginning with an initial program voltage. The initial program voltage is adjusted based on a cycling condition of the memory cells. The control means is also configured to program at least some of the memory cells connected to the word lines in a program operation using the smart verify programming voltage based on the adjusted initial program voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體裝置</p>  
        <p type="p">108:記憶體晶粒</p>  
        <p type="p">110:控制電路系統</p>  
        <p type="p">112:狀態機</p>  
        <p type="p">113:儲存區域</p>  
        <p type="p">114:晶片上位址解碼器；解碼器</p>  
        <p type="p">116:功率控制模組</p>  
        <p type="p">118:線</p>  
        <p type="p">120:資料匯流排</p>  
        <p type="p">122:控制器；晶片外控制器</p>  
        <p type="p">122a:ROM</p>  
        <p type="p">122b:RAM</p>  
        <p type="p">122c:處理器</p>  
        <p type="p">124:列解碼器；解碼器</p>  
        <p type="p">126:記憶體結構；記憶體陣列；記憶體單元陣列</p>  
        <p type="p">126a:儲存裝置</p>  
        <p type="p">128:讀取/寫入電路</p>  
        <p type="p">132:行解碼器；解碼器</p>  
        <p type="p">140:主機</p>  
        <p type="p">245:錯誤校正(ECC)引擎</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="991" publication-number="202613444"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613444.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613444</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115006</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空閥</chinese-title>  
        <english-title>VACUUM VALVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">F16K35/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商普發真空科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFEIFFER VACUUM TECHNOLOGY AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢德利　傑夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANDLEY, JEFF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋爾塔　安琪兒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUERTA, ANGEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克隆　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRONE, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷根尼特　蘭迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REGENNITTER, RANDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾倫　金特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALLEN, KINTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於中、高及/或超高真空系統之真空閥包括：閥殼，定義連接該閥殼之第一開口與第二開口之通道；閥體及互補之座，該閥體包括閥軸，該閥軸沿軸向延伸且可致動以移動該閥體於開啟位置與關閉位置之間，其中，該閥體在該關閉位置與該座配合，以便氣密式關閉該通道；以及鎖定單元，經配置以鎖固該閥體於鎖定位置，其中，該鎖定單元包括鎖定機制，該鎖定機制經配置以於該鎖定單元致動時沿設於垂直於該軸向之平面中之徑向朝向該閥軸驅動至少一鎖定元件，從而進入鎖定位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A vacuum valve for a medium-, high- and/or ultra-high vacuum system comprises a valve housing defining a passage connecting a first opening and a second opening of the valve housing, a valve body and a complementary seat, the valve body comprising a valve shaft extending in an axial direction and being actuable to move the valve body between an open position and a closed position, wherein the valve body cooperates with the seat in the closed position so as to close the passage gas-tightly, and a locking unit configured to secure the valve body in a locked position, wherein the locking unit comprises a locking mechanism configured to urge, upon actuation of the locking unit, at least one locking element in a radial direction disposed in a plane perpendicular to the axial direction towards the valve shaft to assume a locking position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:真空閥、閥</p>  
        <p type="p">11:凸緣連接、中間構件</p>  
        <p type="p">12:閥殼、殼體</p>  
        <p type="p">13:頂部構件、頂部</p>  
        <p type="p">14:第一開口、開口</p>  
        <p type="p">15:底部構件</p>  
        <p type="p">16:第二開口、開口</p>  
        <p type="p">17:密封件</p>  
        <p type="p">18:閥體</p>  
        <p type="p">19:活塞</p>  
        <p type="p">20:座</p>  
        <p type="p">21:腔室</p>  
        <p type="p">22a、22b:凸緣段</p>  
        <p type="p">23:腔室</p>  
        <p type="p">24:閥軸、軸</p>  
        <p type="p">25:空心部分</p>  
        <p type="p">26:鎖定單元</p>  
        <p type="p">27:伸縮軟管</p>  
        <p type="p">28:鎖定機制</p>  
        <p type="p">29:軸向突起</p>  
        <p type="p">30:鎖定元件</p>  
        <p type="p">31:遠端</p>  
        <p type="p">32:致動元件</p>  
        <p type="p">37:密封件</p>  
        <p type="p">39:空心部分</p>  
        <p type="p">44:空心軸、軸</p>  
        <p type="p">54:轉換機制</p>  
        <p type="p">56:致動軸、軸</p>  
        <p type="p">58:螺紋、外螺紋、螺紋連接</p>  
        <p type="p">60:螺紋、內螺紋、螺紋連接</p>  
        <p type="p">71:把手</p>  
        <p type="p">A:軸向</p>  
        <p type="p">R:徑向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="992" publication-number="202613073"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613073.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613073</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115028</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於自水溶液中之胺基酸的鹽獲得結晶形式之該胺基酸的方法</chinese-title>  
        <english-title>METHOD FOR OBTAINING AN AMINO ACID IN CRYSTALLIZED FORM FROM A SALT OF SAID AMINO ACID IN AQUEOUS SOLUTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07C319/28</main-classification>  
        <further-classification edition="200601120260102B">C07C323/58</further-classification>  
        <further-classification edition="200601120260102B">B01D9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商艾迪索法國股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADISSEO FRANCE S.A.S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫爾萬　迪迪爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORVAN, DIDIER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞柏曼　艾多瓦德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REBMANN, EDOUARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉諾多　艾梅麗克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUINAUDEAU, AYMERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴奎瑞塞　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAQUERISSE, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐莉昂　馬休</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OULLION, MATHIEU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加文　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARVIN, PHILIPPE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種用於在加壓二氧化碳存在下自水溶液中之胺基酸的鹽獲得結晶形式之該胺基酸的方法，該方法係於一強制循環結晶器(1)中實行，該強制循環結晶器(1)包含：一具有一下部(3)及一上部(4)之腔室(2)，該下部(3)含有一包含該胺基酸之水性液態介質(6)且該上部(4)含有加壓二氧化碳(7)；以及一至該腔室(2)之外部迴路(8)，其被供應該胺基酸水溶液(5)並將該胺基酸水溶液(5)引入該腔室(2)的該上部(4)，該外部迴路(8)從位於該腔室(2)之下位置處的一出口(9)經由一熱交換器(11)至位於該腔室(2)之上位置處之至少一進口(10、17)與該腔室(2)連接，該方法包含下述步驟：&lt;br/&gt; 該強制循環結晶器(1)係經由該外部迴路(8)中之至少一進口(12、12')被供應該鹽的水溶液(5)，該至少一進口(12、12')經由該進口(10)通往該腔室(2)之該上部(4)；&lt;br/&gt; 該鹽的水溶液(5)到達該腔室(2)之該上部(4)係從至少該進口(10、17)藉由射出朝向該腔室(2)之該下部(3)的向下噴射流(14)之一分配器(13)來分散；&lt;br/&gt; 二氧化碳被注入該外部迴路(8)和/或進入該腔室(2)之該上部(4)，以在該水性液態介質(6)上方的該上部(4)中獲得二氧化碳的加壓環境；&lt;br/&gt; 一含有結晶形式之該胺基酸的汁液係從該腔室(2)的底部回收，被運送至一純化模組(15)，且一實質上無結晶形式之胺基酸的汁液係被排出，於該外部迴路(8)中再循環；以及&lt;br/&gt; 該胺基酸係在該純化模組(15)中以結晶形式獲得。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention concerns a method for obtaining an amino acid in crystallized form, from a salt of said amino acid in aqueous solution, in the presence of pressurized carbon dioxide, said method being carried out in a forced circulation crystallizer (1), the latter comprising a chamber (2) having a lower part (3) and an upper part (4), the lower part (3) containing an aqueous liquid medium (6) comprising the amino acid and the upper part (4) containing pressurized carbon dioxide (7), and an external circuit (8) to this chamber (2) supplied with aqueous solution of said amino acid (5) and bringing it into the upper part (4) of the chamber (2), said external circuit (8) being connected to the chamber (2) from an outlet (9) located in the lower position of the chamber (2) to at least one inlet (10, 17) located in the upper position of the chamber (2), via a heat exchanger (11), said method comprising the following steps:&lt;br/&gt; the forced circulation crystallizer (1) is supplied with aqueous solution (5) of said salt, via at least one inlet (12, 12') in the external circuit (8) opening into the upper part (4) of the chamber (2) via the inlet (10);&lt;br/&gt; the aqueous solution (5) of said salt arriving in the upper part (4) of the chamber (2) is dispersed from at least the inlet (10, 17) by means of a distributor (13) emitting downward jets (14) towards the lower part (3) of the chamber (2);&lt;br/&gt; carbon dioxide is injected into the external circuit (8) and/or into the upper part (4) of the chamber (2) to obtain a pressurized environment of carbon dioxide in the upper part (4) above the aqueous liquid medium (6); &lt;br/&gt; a juice containing the amino acid in crystallized form is recovered at the bottom of the chamber (2) which is conveyed to a purification module (15) and a juice substantially free of amino acid in crystallized form is drawn off which is recirculated in the external circuit (8); and&lt;br/&gt; said amino acid is obtained in crystallized form in the purification module (15).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:結晶器</p>  
        <p type="p">2:腔室</p>  
        <p type="p">3:下部</p>  
        <p type="p">4:上部</p>  
        <p type="p">5:胺基酸鹽的水溶液，水溶液，溶液</p>  
        <p type="p">6:水性液態介質，介質</p>  
        <p type="p">7:加壓二氧化碳</p>  
        <p type="p">8:外部迴路</p>  
        <p type="p">9,22:出口</p>  
        <p type="p">10,12,12',17,18:進口</p>  
        <p type="p">11:熱交換器</p>  
        <p type="p">13:分配器</p>  
        <p type="p">14:噴射流</p>  
        <p type="p">15:純化模組</p>  
        <p type="p">16:噴灑噴嘴，噴嘴</p>  
        <p type="p">19:噴射器</p>  
        <p type="p">20:表面</p>  
        <p type="p">21:落下高度，距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="993" publication-number="202613759"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613759.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613759</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115038</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>即時值產生模組與其操作方法以及包括即時值產生模組之電子裝置</chinese-title>  
        <english-title>REAL-TIME VALUE GENERATION MODULE, OPERATION METHOD THEREOF, AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">G06F1/14</main-classification>  
        <further-classification edition="200601120251226B">G06F1/08</further-classification>  
        <further-classification edition="200601120251226B">G06F1/04</further-classification>  
        <further-classification edition="200601120251226B">H03M7/16</further-classification>  
        <further-classification edition="200601120251226B">H03K21/00</further-classification>  
        <further-classification edition="201901120251226B">G06F1/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙東植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, DONGSIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙康兌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, KANGTAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種電子裝置。該電子裝置包括：一時脈信號產生電路，其經組配以產生具有一第一週期之一第一時脈信號及具有一第二週期之一第二時脈信號，且選擇性地輸出該第一時脈信號及該第二時脈信號中之一者；一時間計數電路，其經組配以回應於該第一時脈信號而增加一時間格雷碼且回應於該第二時脈信號而減小該時間格雷碼；以及一功能電路，其經組配以基於該時間格雷碼來產生一即時值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device is provided. The electronic device includes: a clock signal generation circuit configured to generate a first clock signal of a first period and a second clock signal of a second period, and to selectively output one of the first clock signal and the second clock signal; a time count circuit configured to increase a time gray code in response to the first clock signal and decrease the time gray code in response to the second clock signal; and a function circuit configured to generate a real-time value based on the time gray code.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">110:時脈信號產生區塊</p>  
        <p type="p">120:時間計數區塊</p>  
        <p type="p">130:功能區塊</p>  
        <p type="p">135:即時值產生模組</p>  
        <p type="p">CLK1:第一時脈信號</p>  
        <p type="p">CLK2:第二時脈信號</p>  
        <p type="p">MS:模式信號</p>  
        <p type="p">TGC:時間格雷碼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="994" publication-number="202614498"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614498.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614498</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115124</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高電壓連接器、高電壓連接器組件及機電裝置</chinese-title>  
        <english-title>HIGH-VOLTAGE CONNECTOR, HIGH-VOLTAGE CONNECTOR ASSEMBLY, AND ELECTROMECHANICAL DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01R13/02</main-classification>  
        <further-classification edition="200601120251230B">H01R13/40</further-classification>  
        <further-classification edition="200601120251230B">H01R13/639</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商羅伯特　博世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERT BOSCH GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了高電壓連接器、高電壓連接器組件和機電裝置。所述高電壓連接器包括：具有容納部的殼體，所述容納部具有彼此相對的第一側和第二側，並且配置成用於高電壓互鎖連接器的互鎖端子從所述第一側朝向所述第二側方向插入所述容納部中，在插入就位後所述互鎖端子的外端在所述第二側向外曝露可視；其中，在所述第二側設置有凹槽，所述凹槽配置成圍繞已插入就位後的所述互鎖端子的外端的至少一部分，並且所述凹槽具有朝向所述第一側方向凹進一距離的底面，使得在所述互鎖端子插入所述容納部後能目視確定所述互鎖端子的外端是否高於所述底面。本發明之設備實用性強，可以廣泛應用於各類機電裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a high-voltage connector, a high-voltage connector assembly and an electromechanical device. The high-voltage connector comprises: a housing having containing parts, the containing parts having first sides and second sides opposite to each other, and being configured for inserting interlocking terminals of the high voltage inter-lock connector from the first sides towards the second sides into the containing parts, and outer ends of the interlocking terminals being exposed outwards to be visible at the second sides after being inserted in place; wherein grooves are disposed on the second sides, the grooves being configured to surround at least a portion of the outer ends of the interlocking terminals that have been inserted in place, and the grooves having bottom surfaces that are recessed towards the first sides by a distance, so that it is possible to visibly determine whether the outer ends of the interlocking terminals are higher than the bottom surfaces after the interlocking terminals are inserted in the containing parts. The apparatuses of the present invention are high in practicability, and can be widely applied to a variety of electromechanical devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:殼體</p>  
        <p type="p">21:互鎖端子</p>  
        <p type="p">101:容納部</p>  
        <p type="p">101b:第二側</p>  
        <p type="p">102:凹槽</p>  
        <p type="p">105:凸台</p>  
        <p type="p">211:彈性突出部</p>  
        <p type="p">H:距離</p>  
        <p type="p">P:間隙</p>  
        <p type="p">S:底面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="995" publication-number="202614677"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614677.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614677</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115148</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層基板及積層基板的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H05K1/02</main-classification>  
        <further-classification edition="200601120251217B">H05K1/09</further-classification>  
        <further-classification edition="200601120251217B">H05K1/11</further-classification>  
        <further-classification edition="200601120251217B">H05K3/42</further-classification>  
        <further-classification edition="200601120251217B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＦＩＣＴ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FICT LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾崎德一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZAKI, NORIKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮川哲郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAGAWA, TETSUROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂井直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種積層基板，其於積層複數個多層基板來製造積層基板時，作成不對謀求互相的電連接之導電膏施予應力壓力，可確保長期可靠性。解決手段為一種積層有複數個多層基板10而構成的積層基板100，在各多層基板10形成有：貫穿孔30，貫通各多層基板10且內壁面施行有鍍敷，並於內部填充有樹脂32；及接合焊盤34，在貫穿孔30之上面及下面與貫穿孔30電連接，在各多層基板10之間設置有：絕緣接著層40；及導電膏通孔50，藉由填充在被形成在絕緣接著層40之貫通孔46的導電膏，將對向之多層基板的各接合焊盤34彼此電連接，導電膏通孔50設置在與形成有貫穿孔30的位置不同的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:多層基板</p>  
        <p type="p">20:絕緣層</p>  
        <p type="p">30:貫穿孔</p>  
        <p type="p">32:樹脂</p>  
        <p type="p">34:接合焊盤</p>  
        <p type="p">35:鍍敷層</p>  
        <p type="p">38:金屬層</p>  
        <p type="p">40:接著層(絕緣接著層)</p>  
        <p type="p">42:絕緣樹脂</p>  
        <p type="p">50:導電膏通孔</p>  
        <p type="p">100:積層基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="996" publication-number="202614813"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614813.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614813</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115225</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>互補式場效電晶體</chinese-title>  
        <english-title>COMPLEMENTARY FIELD EFFECT TRANSISTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251103B">H10D30/60</main-classification>  
        <further-classification edition="202501120251103B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康惟誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈孟弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, MENG-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江宏禮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, HUNG-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊言</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾健庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZENG, JIANN-TYNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種互補式場效電晶體包括：第一導電類型的第一源/汲極區域；絕緣層，位於第一源/汲極區域上；第二導電類型的第二源/汲極區域，位於絕緣層上，第二導電類型不同於第一導電類型；垂直連接結構，延伸穿過絕緣層且電連接第一及第二源/汲極區域，第一及第二源/汲極區域用以接收相同的第一參考電壓；第一通道區域，對應於第一源/汲極區域；第二通道區域，對應於第二源/汲極區域；及閘極結構，由第一及第二通道區域共用且至少部分地圍繞第一及第二通道區域，閘極結構用以接收第二參考電壓，第二參考電壓不同於第一參考電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A complementary field effect transistor (CFET) includes first source/drain regions of a first conductivity type; an insulating layer on the first source/drain regions; second source/drain regions of a second conductivity type on the insulating layer, the second conductivity type being different from the first conductivity type; vertical connecting structures extending through the insulating layer and electrically connecting the first source/drain regions with the second source/drain regions, the first and second source/drain regions being configured to receive a same first reference voltage; a first channel region corresponding to the first source/drain regions; a second channel region corresponding to the second source/drain regions; and a gate structure that is common to and at least partially surrounds the first channel region and the second channel region, the gate structure being configured to receive a second reference voltage different from the first reference voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:方法</p>  
        <p type="p">505、510、515、520、525:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="997" publication-number="202614280"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614280.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614280</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115240</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250910B">H01L21/67</main-classification>  
        <further-classification edition="200601120250910B">B08B11/00</further-classification>  
        <further-classification edition="200601120250910B">B08B3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商盛美半導體設備(上海)股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陶曉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAO, XIAOFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃天宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TIANYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何西登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, XIDENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈社娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIA, SHENA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉文博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WENBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曉燕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAOYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡海波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, HAIBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳楊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開了一種基板處理裝置，包括基板保持機構、多個保護罩、多個升降機構和多個密封件，基板保持機構用於保持基板；多個保護罩依次徑向圍設在基板保持機構的周圍，用於分別獨立接收從基板上甩出的藥液；多個升降機構用於分別驅動多個保護罩升降至一上升位置或一下降位置；多個密封件分別設置在相鄰的保護罩之間；基板處理裝置被配置為：當兩個相鄰保護罩同處於上升位置或下降位置時，兩個相鄰保護罩均與對應的密封件接觸，以使兩個相鄰保護罩之間處於封閉狀態。本申請能夠使得多個保護罩所接收的藥液純度不受竄液影響。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板保持機構</p>  
        <p type="p">2:保護罩</p>  
        <p type="p">3:升降機構</p>  
        <p type="p">4:密封件</p>  
        <p type="p">5:接液盤</p>  
        <p type="p">7:噴嘴</p>  
        <p type="p">8:回收部</p>  
        <p type="p">9:廠務系統</p>  
        <p type="p">10:基板</p>  
        <p type="p">11:卡盤</p>  
        <p type="p">12:旋轉軸</p>  
        <p type="p">13:基座</p>  
        <p type="p">21:第一保護罩</p>  
        <p type="p">211:頂壁</p>  
        <p type="p">22:第二保護罩</p>  
        <p type="p">221:頂壁</p>  
        <p type="p">23:第三保護罩</p>  
        <p type="p">231:頂壁</p>  
        <p type="p">28:第一控制閥</p>  
        <p type="p">29:第二控制閥</p>  
        <p type="p">31:第一升降機構</p>  
        <p type="p">32:第二升降機構</p>  
        <p type="p">33:第三升降機構</p>  
        <p type="p">41:第一密封件</p>  
        <p type="p">42:第二密封件</p>  
        <p type="p">214、224、234:收集槽</p>  
        <p type="p">212、222、232:側壁</p>  
        <p type="p">51:排液管</p>  
        <p type="p">60:阻隔件</p>  
        <p type="p">216:第一倒鉤</p>  
        <p type="p">226:第二倒鉤</p>  
        <p type="p">236:第三倒鉤</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="998" publication-number="202614844"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614844.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614844</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115368</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250902B">H10D64/27</main-classification>  
        <further-classification edition="202501120250902B">H10D62/17</further-classification>  
        <further-classification edition="202501120250902B">H10D30/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴星海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EOM, BYEOL HAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜明吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, MYUNG GIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴太盂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UHM, TAE WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種半導體裝置，其可包括一堆疊結構，該堆疊結構包括：包括一第一井區之一塊體半導體圖案；該塊體半導體圖案之一上表面上之一犧牲膜；以及該犧牲膜之一上表面上之一半導體膜。該半導體裝置可進一步包括：該堆疊結構之一側上之一裝置隔離圖案；以及該塊體半導體圖案之一下表面及該裝置隔離圖案之一下表面上之一背側佈線結構，其中該堆疊結構進一步包括延伸穿過該塊體半導體圖案、該犧牲膜及該半導體膜之一第一摻雜區，並且該第一摻雜區連接至該第一井區，且其中該第一摻雜區與該塊體半導體圖案之該下表面間隔開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device may include a stacked structure including: a bulk semiconductor pattern including a first well region; a sacrificial film on an upper surface of the bulk semiconductor pattern; and a semiconductor film on an upper surface of the sacrificial film. The semiconductor device may further include: a device isolation pattern on a side of the stacked structure; and a backside wiring structure on a lower surface of the bulk semiconductor pattern and a lower surface of the device isolation pattern, wherein the stacked structure further includes a first doping region that extends across the bulk semiconductor pattern, the sacrificial film, and the semiconductor film, and the first doping region is connected to the first well region, and wherein the first doping region is spaced apart from the lower surface of the bulk semiconductor pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">105:第一裝置隔離圖案</p>  
        <p type="p">110:塊體半導體圖案</p>  
        <p type="p">111,112,113:第一半導體膜</p>  
        <p type="p">120:第一閘極介電膜</p>  
        <p type="p">130:第一閘極電極</p>  
        <p type="p">140:第一閘極間隔體</p>  
        <p type="p">150:第一閘極罩蓋膜</p>  
        <p type="p">160:第一磊晶圖案</p>  
        <p type="p">180:第一層間絕緣膜</p>  
        <p type="p">190:第一接觸圖案</p>  
        <p type="p">310:第一犧牲膜</p>  
        <p type="p">310r1:第一凹槽</p>  
        <p type="p">A1-A1:線</p>  
        <p type="p">BI:背側佈線間絕緣膜</p>  
        <p type="p">BM:背側佈線圖案</p>  
        <p type="p">BW:背側佈線結構</p>  
        <p type="p">FI:前部佈線間絕緣膜</p>  
        <p type="p">FM:前部佈線圖案</p>  
        <p type="p">FW:前部佈線結構</p>  
        <p type="p">G11:第一閘極結構</p>  
        <p type="p">G12:第二閘極結構</p>  
        <p type="p">G13:第三閘極結構</p>  
        <p type="p">G14:第四閘極結構</p>  
        <p type="p">IR1:第一摻雜區</p>  
        <p type="p">P1:第一部分</p>  
        <p type="p">P2:第二部分</p>  
        <p type="p">P3:第三部分</p>  
        <p type="p">SS:堆疊結構</p>  
        <p type="p">WR1:第一井區</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="999" publication-number="202614748"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614748.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614748</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115390</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250902B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金泰赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEHYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金澤龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEKYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧賢娥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROH, HYUNAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴台鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, TAEJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊慧娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HYE YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李賢奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYEONKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置包括：一胞元垂直主動圖案及一周邊垂直主動圖案，其位於相同垂直位階處；一胞元上部延伸源極/汲極圖案及一胞元接觸插塞，其依序堆疊於該胞元垂直主動圖案上；一周邊上部延伸源極/汲極圖案及一周邊接觸插塞，其依序堆疊於該周邊垂直主動圖案上；以及一上部互連件，其位於該周邊接觸插塞及周邊隔離圖案上。該胞元接觸插塞之一上部末端的一垂直位階與胞元隔離圖案之一上部末端的一垂直位階之間的一第一距離不同於該周邊接觸插塞之一上部末端的一垂直位階與該周邊隔離圖案之一上部末端的一垂直位階之間的一第二距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a cell vertical active pattern and a peripheral vertical active pattern at the same vertical level; a cell upper extended source/drain pattern and a cell contact plug sequentially stacked on the cell vertical active pattern; a peripheral upper extended source/drain pattern and a peripheral contact plug sequentially stacked on the peripheral vertical active pattern; and an upper interconnection on the peripheral contact plug and the peripheral isolation pattern. A first distance between a vertical level of an upper end of the cell contact plug and a vertical level of an upper end of the cell isolation pattern is different from a second distance between a vertical level of an upper end of the peripheral contact plug and a vertical level of an upper end of the peripheral isolation pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">16c:胞元背閘極電極</p>  
        <p type="p">16n:第一周邊背閘極電極</p>  
        <p type="p">16p:第二周邊背閘極電極</p>  
        <p type="p">21c:胞元垂直主動圖案</p>  
        <p type="p">24:介電層</p>  
        <p type="p">24c:胞元閘極介電層</p>  
        <p type="p">24n:第一周邊閘極介電層</p>  
        <p type="p">24p:第二周邊閘極介電層</p>  
        <p type="p">27c:胞元閘極電極</p>  
        <p type="p">27n:第一周邊閘極電極</p>  
        <p type="p">27p:第二周邊閘極電極</p>  
        <p type="p">30,33,70,90:絕緣層</p>  
        <p type="p">35c:胞元上部延伸源極/汲極圖案</p>  
        <p type="p">35D:虛設源極/汲極圖案</p>  
        <p type="p">35n:第一周邊上部延伸源極/汲極圖案</p>  
        <p type="p">35p:第二周邊上部延伸源極/汲極圖案</p>  
        <p type="p">36c:胞元下部源極/汲極層</p>  
        <p type="p">36n:第一周邊下部源極/汲極層</p>  
        <p type="p">36p:第二周邊下部源極/汲極層</p>  
        <p type="p">42c:胞元上部源極/汲極層</p>  
        <p type="p">42n:第一周邊上部源極/汲極層</p>  
        <p type="p">48p:第二周邊上部源極/汲極層</p>  
        <p type="p">52a:胞元隔離圖案</p>  
        <p type="p">53c:胞元下部傳導層</p>  
        <p type="p">53n:第一周邊下部傳導層</p>  
        <p type="p">53p:第二周邊下部傳導層</p>  
        <p type="p">54,85:絕緣結構，絕緣襯裡</p>  
        <p type="p">56:絕緣結構，第二傳導層，絕緣圖案</p>  
        <p type="p">56c:胞元上部傳導層</p>  
        <p type="p">56n:第一周邊上部傳導層</p>  
        <p type="p">56p:第二周邊上部傳導層</p>  
        <p type="p">57c:胞元接觸插塞</p>  
        <p type="p">57D:虛設接觸插塞</p>  
        <p type="p">57n:第一周邊接觸插塞</p>  
        <p type="p">57p:第二周邊接觸插塞</p>  
        <p type="p">59:第一上部傳導層</p>  
        <p type="p">62:第二上部傳導層</p>  
        <p type="p">63a:傳導圖案，襯墊圖案</p>  
        <p type="p">63n:傳導圖案，第一上部互連件</p>  
        <p type="p">63p:傳導圖案，第二上部互連件</p>  
        <p type="p">66:絕緣襯裡</p>  
        <p type="p">68a:第一電極</p>  
        <p type="p">68b:介電層</p>  
        <p type="p">68c:第二電極</p>  
        <p type="p">78c,78n,78p:下部源極/汲極圖案</p>  
        <p type="p">81:第一下部傳導層</p>  
        <p type="p">82:第二下部傳導層</p>  
        <p type="p">83c:下部互連圖案，位元線</p>  
        <p type="p">83n:下部互連圖案，第一下部互連件</p>  
        <p type="p">83p:下部互連圖案，第二下部互連件</p>  
        <p type="p">86:絕緣結構，絕緣圖案</p>  
        <p type="p">88:位元線屏蔽結構</p>  
        <p type="p">A,B,C,D:區</p>  
        <p type="p">CR:記憶體區</p>  
        <p type="p">DS:資料儲存結構</p>  
        <p type="p">I-I':線</p>  
        <p type="p">PR:周邊區</p>  
        <p type="p">ST1_A:第一部分</p>  
        <p type="p">X:第一方向，第一水平方向</p>  
        <p type="p">Y:第二方向，第二水平方向</p>  
        <p type="p">Z:垂直方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1000" publication-number="202614842"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614842.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614842</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115460</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250902B">H10D64/01</main-classification>  
        <further-classification edition="202501120250902B">H10D84/01</further-classification>  
        <further-classification edition="202501120250902B">H10D62/13</further-classification>  
        <further-classification edition="202501120250902B">H10D62/17</further-classification>  
        <further-classification edition="202501120250902B">H10D64/27</further-classification>  
        <further-classification edition="202501120250902B">H10D84/85</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾政庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, CHENG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳豪育</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HOU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">互補場效電晶體(CFET)及奈米結構場效電晶體(NSFET)形成在同一基板上以形成半導體裝置。該些CFET藉由垂直堆疊電晶體來實現高電晶體整合密度，且可適用於實現高級邏輯電路。該些NSFET實現高驅動電流，且可適用於高性能單元及/或特殊單元，諸如單極單元。本文揭示的結構及製程流程允許CFET及NSFET在同一半導體晶粒中共存，以利用CFET及NSFET的優勢。所揭示的製程流程可輕易整合至用於形成NSFET裝置的當前製程流程中，且有助於推動CFET技術的發展且能夠創建更高效、更強大的半導體裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Both complementary field-effect transistors (CFETs) and nanostructure field-effect transistors (NSFETs) are formed over a same substrate to form a semiconductor device. The CFETs achieve high transistor integration density by vertically stacking transistors together and may be suitable for implementing advanced logic circuits. The NSFETs achieve high driving current and may be suitable for high-performance cells and/or special cells such as unipolar cells. The structures and process flows disclosed herein allow for the coexistence of CFETs and NSFETs in the same semiconductor die to take advantage of the benefits of both CFETs and NSFETs. The disclosed process flow can be easily integrated into current process flow for forming NSFET devices, and helps to advance the development of CFET technology and enable the creation of more efficient and powerful semiconductor devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">56E:奈米結構</p>  
        <p type="p">56EA、56EB:端部</p>  
        <p type="p">56L:下半導體奈米結構</p>  
        <p type="p">56U:上半導體奈米結構</p>  
        <p type="p">68:介面層</p>  
        <p type="p">90:閘極間隔物</p>  
        <p type="p">92:導電特徵層</p>  
        <p type="p">92L:導電特徵層</p>  
        <p type="p">98、98L1、98U1:內間隔物</p>  
        <p type="p">99:矽化物區域</p>  
        <p type="p">100:隔離結構</p>  
        <p type="p">100R:第一裝置區域</p>  
        <p type="p">104:蝕刻終止層</p>  
        <p type="p">106:第三ILD</p>  
        <p type="p">107:第四ILD</p>  
        <p type="p">108L:下磊晶源極/汲極區域</p>  
        <p type="p">108U:上磊晶源極/汲極區域</p>  
        <p type="p">114:第一層間介電層</p>  
        <p type="p">116:介電層</p>  
        <p type="p">118:閘極接觸插塞</p>  
        <p type="p">119:源極/汲極接觸插塞</p>  
        <p type="p">120A:前側互連結構</p>  
        <p type="p">120B:背側互連結構</p>  
        <p type="p">122:第二CESL</p>  
        <p type="p">124:第二ILD</p>  
        <p type="p">132:閘極介電層</p>  
        <p type="p">133:閘極結構</p>  
        <p type="p">133L:下閘極結構</p>  
        <p type="p">133U:上閘極結構</p>  
        <p type="p">134L:下閘電極</p>  
        <p type="p">134U:上閘電極</p>  
        <p type="p">138:閘極遮罩</p>  
        <p type="p">142:裝置層</p>  
        <p type="p">300:半導體裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1001" publication-number="202614132"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614132.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614132</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115464</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣體團簇離子束裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01J37/305</main-classification>  
        <further-classification edition="200601120251226B">H01J37/08</further-classification>  
        <further-classification edition="200601120251226B">H01J27/20</further-classification>  
        <further-classification edition="200601120251226B">H01J37/20</further-classification>  
        <further-classification edition="200601120251226B">H01J37/248</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＩＩＰＴ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIPT INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>登木口克己</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKIGUCHI, KATSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潟岡泉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAOKA, IZUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>花園勝巳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANAZONO, KATSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土屋一俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUCHIYA, KATSUTOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種氣體團簇離子束裝置，能夠產生高速、高精度的脈衝束，並透過調整其脈衝寬度、脈衝週期等，進行前所未有之高精度的修整處理。 &lt;br/&gt;　　設置開關電路，該開關電路包含配置於從用以加速離子化部(5)的離子化用熱電子的離子化電源(30)，向離子化部(5)及與該離子化部(5)相同電位的陽極棒(17)供電的供電線中的開關用元件(32)。開關電路(SWC)透過對開關用元件(32)進行ON/OFF控制，使得氣體團簇離子束能夠間歇性地照射至照射基板(15)上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:撇取器</p>  
        <p type="p">5:離子化部</p>  
        <p type="p">6:加速電極</p>  
        <p type="p">11:氣體團簇離子束(GCIB)</p>  
        <p type="p">16:熱燈絲</p>  
        <p type="p">17:陽極棒</p>  
        <p type="p">22a:第1至第3高電壓電源</p>  
        <p type="p">28:馬達驅動控制器</p>  
        <p type="p">29:熱燈絲電源</p>  
        <p type="p">30:離子化電源</p>  
        <p type="p">31:高電壓工作台(紅箱)</p>  
        <p type="p">32:高電壓用FET(開關用元件)</p>  
        <p type="p">33:ROSA</p>  
        <p type="p">34:TOSA</p>  
        <p type="p">35:脈衝產生器</p>  
        <p type="p">36:光纜</p>  
        <p type="p">37:脈衝產生器控制器</p>  
        <p type="p">51:導電性殼體</p>  
        <p type="p">OL:輸出線</p>  
        <p type="p">SWC:開關電路</p>  
        <p type="p">Va:正高電壓</p>  
        <p type="p">Vi:電子加速電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1002" publication-number="202614130"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614130.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614130</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115554</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>標記位置測定方法，多帶電粒子束描繪方法及多帶電粒子束描繪裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">H01J37/304</main-classification>  
        <further-classification edition="200601120251216B">H01J37/317</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商紐富來科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUFLARE TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>七尾翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANAO, TSUBASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤大士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鶴田薫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUTA, KAORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種即使當射束陣列面內有電流量的分布的情形下，仍能夠以多射束精度良好地測定標記位置之標記位置測定方法，多帶電粒子束描繪方法及多帶電粒子束描繪裝置。 &lt;br/&gt;　　按照本實施方式之標記位置測定方法，係形成讓帶電粒子束以規定間距配置之多射束，依序切換將前述多射束當中的一部分的區域的射束設為開啟之開啟射束區域，而使前述帶電粒子束的照射位置移位，藉此擬似地掃描設於規定位置而寬度比前述規定間距還寬的標記，而檢測來自前述標記的反射帶電粒子訊號，基於檢測出的前述反射帶電粒子訊號，測定前述標記的位置，該標記位置測定方法，其中，於前述開啟射束區域的切換時，使得在形成有前述標記的基板的射束電流的單位時間平均成為一定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:描繪部</p>  
        <p type="p">2:電子光學鏡筒</p>  
        <p type="p">3:電子束</p>  
        <p type="p">4:電子源</p>  
        <p type="p">6:照明透鏡</p>  
        <p type="p">8:成形孔徑陣列基板</p>  
        <p type="p">10:遮沒孔徑陣列基板</p>  
        <p type="p">12:縮小透鏡</p>  
        <p type="p">14:限制孔徑構件</p>  
        <p type="p">15:對物透鏡</p>  
        <p type="p">17:偏向器</p>  
        <p type="p">20:描繪室</p>  
        <p type="p">22:XY平台</p>  
        <p type="p">24:鏡</p>  
        <p type="p">26:檢測器</p>  
        <p type="p">28:標記基板</p>  
        <p type="p">30:多射束</p>  
        <p type="p">50:電流檢測器</p>  
        <p type="p">70:基板</p>  
        <p type="p">100:控制部</p>  
        <p type="p">110:控制計算機</p>  
        <p type="p">111:描繪資料處理部</p>  
        <p type="p">112:描繪控制部</p>  
        <p type="p">113:標記位置算出部</p>  
        <p type="p">114:修正部</p>  
        <p type="p">115:電流分布算出部</p>  
        <p type="p">130:偏向控制電路</p>  
        <p type="p">131:數位/類比變換(DAC)放大器</p>  
        <p type="p">134:檢測放大器</p>  
        <p type="p">135:平台位置檢測器</p>  
        <p type="p">140:記憶裝置(描繪資料)</p>  
        <p type="p">142:記憶裝置(電流量資訊)</p>  
        <p type="p">M:標記</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1003" publication-number="202614363"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614363.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614363</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115616</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有FPGA　IC晶片及NVM　IC晶片的現場可編程多晶片封裝結構</chinese-title>  
        <english-title>FIELD PROGRAMMABLE MULTICHIP PACKAGE COMPRISING FPGA IC CHIP AND NVM IC CHIP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L23/00</main-classification>  
        <further-classification edition="200601120251229B">H01L23/495</further-classification>  
        <further-classification edition="200601120251229B">H01L23/498</further-classification>  
        <further-classification edition="200601120251229B">H01L23/528</further-classification>  
        <further-classification edition="200601120251229B">H01L23/538</further-classification>  
        <further-classification edition="202301120251229B">H01L25/18</further-classification>  
        <further-classification edition="202301120251229B">H10B80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成真股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICOMETRUE COMPANY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林茂雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MOU-SHIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李進源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊秉榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, PING-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種晶片封裝結構，包括：一球柵陣列 (BGA) 基板；設置於該球柵陣列 (BGA) 基板底部之第一金屬凸塊，其中該第一金屬凸塊包括錫；一設置於該球柵陣列 (BGA) 基板上方並與之電性連接之可編程晶片封裝結構，其中該可編程晶片封裝結構包括一現場可編程閘陣列 (FPGA) 積體電路 (IC) 晶片，且該可編程晶片封裝結構底部具有第二金屬凸塊，該第二金屬凸塊接合於該球柵陣列 (BGA) 基板頂部；以及一設置於該球柵陣列 (BGA) 基板下方並與之電性連接之記憶體晶片封裝結構，其中該記憶體晶片封裝結構包括一第一NVM IC 晶片，且該記憶體晶片封裝結構頂部具有第三金屬凸塊，該第三金屬凸塊接合於該球柵陣列 (BGA) 基板底部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A chip package includes a ball-grid-array (BGA) substrate; a first metal bump at a bottom of the ball-grid-array (BGA) substrate, wherein the first metal bump comprises tin; a field programmable chip package over and coupling to the ball-grid-array (BGA) substrate, wherein the field programmable chip package comprises a field-programmable-gate-array (FPGA) integrated-circuit (IC) chip therein and a second metal bump at a bottom of the field programmable chip package and bonded to a top of the ball-grid-array (BGA) substrate; and a memory chip package under and coupling to the ball-grid-array (BGA) substrate, wherein the memory chip package comprises a first non-volatile memory (NVM) integrated-circuit (IC) chip therein and a third metal bump at a top of the memory chip package and bonded to the bottom of the ball-grid-array (BGA) substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">454:導線接合線</p>  
        <p type="p">701:縱向轉彎部分</p>  
        <p type="p">703:彎曲轉彎部分</p>  
        <p type="p">702:縱向轉彎部分</p>  
        <p type="p">302:接合墊</p>  
        <p type="p">456:灌模材料</p>  
        <p type="p">216:金屬凸塊</p>  
        <p type="p">414:接合墊</p>  
        <p type="p">450:金屬凸塊</p>  
        <p type="p">414:接合墊</p>  
        <p type="p">418:內部交互連接線</p>  
        <p type="p">412:接合墊</p>  
        <p type="p">216:金屬凸塊</p>  
        <p type="p">450:金屬凸塊</p>  
        <p type="p">416:接合墊</p>  
        <p type="p">415:內部交互連接線</p>  
        <p type="p">410:交互連接線基板</p>  
        <p type="p">214:絕緣介電層</p>  
        <p type="p">222:無機介電層</p>  
        <p type="p">224:聚合物介電層</p>  
        <p type="p">212:接合墊</p>  
        <p type="p">222a:開口</p>  
        <p type="p">224a:開口</p>  
        <p type="p">282:黏著金屬層</p>  
        <p type="p">284:電鍍種子層</p>  
        <p type="p">286:電鍍銅層</p>  
        <p type="p">288:含錫焊料帽層</p>  
        <p type="p">216:金屬凸塊</p>  
        <p type="p">452:底填充物</p>  
        <p type="p">413:阻焊層</p>  
        <p type="p">417:內部交互連接線</p>  
        <p type="p">214:接合墊</p>  
        <p type="p">212:接合墊</p>  
        <p type="p">419:黏著層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1004" publication-number="202614854"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614854.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614854</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115646</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250722B">H10D84/83</main-classification>  
        <further-classification edition="202501120250722B">H10D84/01</further-classification>  
        <further-classification edition="200601120250722B">H01L21/027</further-classification>  
        <further-classification edition="200601120250722B">H01L21/302</further-classification>  
        <further-classification edition="200601120250722B">H01L21/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TSUNG-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉致鍇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, CHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉主輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEAP, CHOH-FEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在基底上方形成包含具有不同材料組成且彼此交替的第一及第二半導體層的堆疊物；圖案化堆疊物以形成主動區；形成隔離結構圍繞主動區；在隔離結構上形成硬遮罩；在堆疊物上方形成虛設閘極結構；凹陷源極/汲極區，以形成源極/汲極溝槽；選擇性移除第二半導體層，以在第一半導體層之間形成第一間隙；在第一間隙中形成介電中介層；進行第一蝕刻製程，以橫向凹陷介電中介層而形成第二間隙；在第二間隙中形成內部間隙壁；在源極/汲極溝槽中形成源極/汲極部件；移除虛設閘極結構；以及移除介電中介層的子集，而保留最底部介電中介層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a method that includes forming a stack including first and second semiconductor layers over a substrate, wherein the first and second semiconductor layers have different compositions and alternate with one another; patterning the stack to form active regions; forming an isolation structure to surround the active regions; forming a hard mask on the isolation structure; forming a dummy gate structure over the stack; recessing source/drain regions of the stack, resulting in source/drain trenches; selectively removing the second semiconductor layers, resulting in first gaps among the first semiconductor layers; forming dielectric interposers in the first gaps; performing a first etching process to laterally recess the dielectric interposers, resulting in second gaps; forming inner spacers in the second gaps; forming source/drain features in the source/drain trenches; removing the dummy gate structure; and removing a subset of the dielectric interposers while bottommost dielectric interposers remain.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:全繞式閘極裝置</p>  
        <p type="p">201:層</p>  
        <p type="p">205:摻雜部分</p>  
        <p type="p">207,220A:半導體層</p>  
        <p type="p">208:磊晶源極/汲極部件</p>  
        <p type="p">214:層間介電層</p>  
        <p type="p">228:閘極介電層</p>  
        <p type="p">230,232:金屬層</p>  
        <p type="p">240:閘極間隙壁</p>  
        <p type="p">250:內部間隙壁</p>  
        <p type="p">252:半導體部件</p>  
        <p type="p">254:底部隔離部件</p>  
        <p type="p">270,272:閘極結構</p>  
        <p type="p">274:互連部件</p>  
        <p type="p">276:背側接點</p>  
        <p type="p">278:氣隙</p>  
        <p type="p">606:介電中介層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1005" publication-number="202614774"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614774.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614774</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115719</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙面高介電常數阻擋介電質</chinese-title>  
        <english-title>DOUBLE-SIDED HIGH-K BLOCKING DIELECTRIC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251219B">H10B43/27</main-classification>  
        <further-classification edition="202301120251219B">H10B43/35</further-classification>  
        <further-classification edition="202501120251219B">H10D30/69</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美光科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧萊謝　馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOULAICHE, MARC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李冬華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DONGHWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文卡特桑　史林納斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VENKATESAN, SRINATH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭珪捧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, KYUBONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">各種應用可包含具有一或多個記憶體胞元之一或多個記憶體裝置，該一或多個記憶體胞元含有將一電荷捕捉區與一控制閘極分離之一阻擋介電質，其中該阻擋介電質包含在一寬帶隙介電質與該電荷捕捉區之間並接觸該寬帶隙介電質及該電荷捕捉區之一高介電常數介電質。另一高介電常數介電質可定位成在該寬帶隙介電質之與該第一高介電常數介電質定位於其上之面相對之一面上接觸該寬帶隙介電質，從而形成一夾置結構。論述額外裝置、系統及方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A variety of applications can include one or more memory devices having one or more memory cells containing a blocking dielectric separating a charge trap region from a control gate, where the blocking dielectric includes a high-k dielectric between and contacting a wide bandgap dielectric and the charge trap region. Another high-k dielectric can be positioned contacting the wide bandgap dielectric on a side of the wide bandgap dielectric opposite the side on which the first high-k dielectric is positioned, forming a sandwiched structure. Additional devices, systems, and methods are discussed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:記憶體胞元</p>  
        <p type="p">105:寬帶隙介電質</p>  
        <p type="p">110:第二高介電常數介電質</p>  
        <p type="p">115:第一高介電常數介電質</p>  
        <p type="p">120:電荷捕捉區</p>  
        <p type="p">125:帶隙工程化(BE)介電質</p>  
        <p type="p">130:通道結構</p>  
        <p type="p">140:存取件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1006" publication-number="202614159"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614159.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614159</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115723</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通量梯度鉬生長製程</chinese-title>  
        <english-title>FLUX GRADIENT MOLYBDENUM GROWTH PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L21/02</main-classification>  
        <further-classification edition="200601120260102B">H01L21/285</further-classification>  
        <further-classification edition="200601120260102B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷　蔚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕特爾　薩希爾賈庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATEL, SAHIL JAYKUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岳詩雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUE, SHIYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亓智敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QI, ZHIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳周玹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, JU HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了用於處理半導體元件基板的方法。在基板的表面中形成的特徵的表面上，藉由第一沉積製程沉積成核層。該第一沉積製程包括以約1×10&lt;sup&gt;-8&lt;/sup&gt;至約2×10&lt;sup&gt;-3&lt;/sup&gt;的第一流動速率比率將含鉬的前驅物和還原劑前驅物氣體流入處理腔室。藉由將沉積的成核層特徵暴露於第二沉積製程，用鉬間隙填充材料填充該特徵的至少部分。該第二沉積製程包括以約2×10&lt;sup&gt;-5&lt;/sup&gt;至約1×10&lt;sup&gt;-2&lt;/sup&gt;的第二流動速率比率將含鉬的前驅物和還原劑前驅物氣體流入處理腔室，其中該第二流動速率比率大於該第一流動速率比率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides methods for processing a semiconductor device substrate. A nucleation layer is deposited on a surface of a feature formed in a surface of a substrate by a first deposition process. The first deposition process including flowing a molybdenum-containing precursor and a reducing agent precursor gas into a processing chamber at a first flow rate ratio of about 1x10-8 to about 2x10-3 of molybdenum-containing precursor to reducing agent. At least a portion of the feature is filled with a molybdenum gap fill material by exposing the deposited nucleation layer feature to a second deposition process. The second deposition process including flowing the molybdenum-containing precursor and the reducing agent precursor gas into a processing chamber at a second flow rate ratio of about 2x10-5 to about 1x10-2 of molybdenum-containing precursor to reducing agent, wherein the second flow rate ratio is greater than the first flow rate ratio.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:方法</p>  
        <p type="p">210:操作</p>  
        <p type="p">220:操作</p>  
        <p type="p">230:操作</p>  
        <p type="p">240:操作</p>  
        <p type="p">250:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1007" publication-number="202614563"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614563.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614563</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115732</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>彈性波裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H03H9/25</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下生產工程技術股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC PRODUCTION ENGINEERING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷口典生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIGUCHI, NORIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大門克也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIMON, KATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井山明洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IYAMA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷口康政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIGUCHI, YASUMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多田憲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TADA, NORITOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能抑制不必要的波之彈性波裝置。 &lt;br/&gt;本發明之彈性波裝置1，具備：聲音反射膜4，其包含聲音阻抗相對較高之至少一層高聲音阻抗層6a, 6b、以及聲音阻抗相對較低之複數個低聲音阻抗層；壓電體層7，其設置於聲音反射膜4上，具有彼此對向之第1主面7a及第2主面7b；以及IDT電極8，其設置於壓電體層7之第1主面7a，具有複數個電極指（複數個第1、第2電極指18, 19）。低聲音阻抗層及高聲音阻抗層交互積層。複數個低聲音阻抗層包含至少一層第1低聲音阻抗層5a、及至少一層第2低聲音阻抗層15b, 15c。在將第1低聲音阻抗層5a之密度設為ρ1，楊氏模數設為E1，將第2低聲音阻抗層15b, 15c之密度設為ρ2，楊氏模數設為E2時，滿足ρ1＞ρ2及E1＞E2中之至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:彈性波裝置</p>  
        <p type="p">2:壓電性基板</p>  
        <p type="p">3:支承基板</p>  
        <p type="p">4:聲音反射膜</p>  
        <p type="p">5a:第1低聲音阻抗層</p>  
        <p type="p">6a、6b:高聲音阻抗層</p>  
        <p type="p">7:壓電體層</p>  
        <p type="p">7a:第1主面</p>  
        <p type="p">7b:第2主面</p>  
        <p type="p">8:IDT電極</p>  
        <p type="p">15b:第2低聲音阻抗層</p>  
        <p type="p">15c:第2低聲音阻抗層</p>  
        <p type="p">18:第1電極指</p>  
        <p type="p">19:第2電極指</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1008" publication-number="202614686"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614686.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614686</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115858</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遠端釋放模組及電路板裝置</chinese-title>  
        <english-title>REMOTE RELEASE MODULE AND CIRCUIT BOARD DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">H05K1/18</main-classification>  
        <further-classification edition="200601120251231B">H05K1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>技嘉科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-BYTE TECHNOLOGY CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴志明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHIH-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳文辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEN CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周慧珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, HUI-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種遠端釋放模組，包括多個按鈕、多個移動件、多個轉軸及多個卡勾。這些移動件局部地交疊於彼此，且獨立於彼此移動，這些移動件分別連動這些按鈕，且分別包括多個第一帶動部。這些轉軸獨立於彼此轉動，分別包括自周側凸出的多個第二帶動部及多個第三帶動部，各第二帶動部連動於對應的第一帶動部。這些卡勾分別設置於這些第三帶動部旁。當按壓這些按鈕的任一者時，帶動對應的移動件，第一帶動部帶動第二帶動部，而使對應的轉軸轉動，進而使第三帶動部帶動對應的卡勾退位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A remote release module includes buttons, moving members, rotating shafts and hooks. The moving members partially overlap each other and move independently of each other. The moving members link the buttons and include first driving members, respectively. The rotating shafts independently rotate from each other, and include second driving members and third driving members protruding from the circumferential side, respectively. Each second driving member is linked to the corresponding first driving member. The hooks are disposed beside the third driving members, respectively. When any one of the buttons is pressed, the corresponding moving member is driven, and the first driving member drives the second driving member, causing the corresponding rotating shaft to rotate, and then the third driving member drives the corresponding hook to disengage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">H1、H2:凸出長度</p>  
        <p type="p">100:遠端釋放模組</p>  
        <p type="p">110:按鈕</p>  
        <p type="p">112:按鈕座體</p>  
        <p type="p">115:第一斜面</p>  
        <p type="p">120:移動件</p>  
        <p type="p">121:第一段部</p>  
        <p type="p">122:第二段部</p>  
        <p type="p">123:第三段部</p>  
        <p type="p">124:第四段部</p>  
        <p type="p">125:第一帶動部</p>  
        <p type="p">126:凸部</p>  
        <p type="p">127:導引槽</p>  
        <p type="p">128:溝槽</p>  
        <p type="p">129:第二斜面</p>  
        <p type="p">130:轉軸</p>  
        <p type="p">132:第二帶動部</p>  
        <p type="p">134:第三帶動部</p>  
        <p type="p">136:卡勾</p>  
        <p type="p">138:彈性件</p>  
        <p type="p">140:卡勾座體</p>  
        <p type="p">142:凹陷部</p>  
        <p type="p">170:第二彈性件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1009" publication-number="202612976"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612976.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612976</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115865</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人力驅動車用之組件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B62M25/08</main-classification>  
        <further-classification edition="202001120251229B">B62J45/00</further-classification>  
        <further-classification edition="200601120251229B">H02N2/18</further-classification>  
        <further-classification edition="200601120251229B">B62K23/06</further-classification>  
        <further-classification edition="201001120251229B">B62M9/122</further-classification>  
        <further-classification edition="201001120251229B">B62M9/132</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加治木孝一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAJIKI, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤義和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, YOSHIKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高納尚德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKANOU, HISANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之目的在於提供一種可適宜地利用由發電部發出之電力的人力驅動車用之組件。&lt;br/&gt;本發明之人力驅動車用之組件具備：操作部，其可由使用者操作；發電部，其構成為根據上述使用者操作上述操作部之情形時之上述操作部之移位而發電；發送部，其構成為藉由上述發電部發出之電力而向其他組件發送指定信號；及控制部，其構成為當操作上述操作部時，以發送上述指定信號之方式控制上述發送部；且上述控制部構成為，以根據操作上述操作部之情形時之上述操作部之操作狀態變更上述指定信號之發送狀態之方式，控制上述發送部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:控制系統</p>  
        <p type="p">42:其他組件</p>  
        <p type="p">42A:變速裝置</p>  
        <p type="p">44:致動器</p>  
        <p type="p">46:控制部</p>  
        <p type="p">48:記憶部</p>  
        <p type="p">50:接收部</p>  
        <p type="p">52:電池</p>  
        <p type="p">60:組件</p>  
        <p type="p">64:發電部</p>  
        <p type="p">66:發送部</p>  
        <p type="p">68:控制部</p>  
        <p type="p">88:蓄電部</p>  
        <p type="p">92:記憶部</p>  
        <p type="p">94:操作檢測部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1010" publication-number="202612865"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612865.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612865</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115879</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>料箱取放方法及相關裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B25J9/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國大陸商深圳市海柔創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAI ROBOTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國大陸商深圳市庫寶軟件有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN KUBO SOFTWARE CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮瀟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀畊宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種料箱取放方法及相關裝置，方法包括：伺服器確定第一機器人待執行的第一出庫搬運任務，第一出庫搬運任務對應存儲在第一存儲位的第一待出庫料箱，以及根據第一存儲位確定第一入庫搬運任務對應的第二存儲位，並向第一機器人發送第一入庫搬運任務，第一機器人接收第一入庫搬運任務，以及搬運第一待入庫料箱到達第一列對應的第一爬升點位，並爬升至第一列中的第二存儲位，以完成第一入庫搬運任務。本申請實施例有利於提高機器人執行料箱搬運任務的效率和減少設備能耗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201:步驟</p>  
        <p type="p">202:步驟</p>  
        <p type="p">203:步驟</p>  
        <p type="p">204:步驟</p>  
        <p type="p">205:步驟</p>  
        <p type="p">206:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1011" publication-number="202614451"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614451.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614451</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用直接接合具有垂直堆疊晶粒的封裝架構</chinese-title>  
        <english-title>PACKAGE ARCHITECTURES HAVING VERTICALLY STACKED DIES WITH DIRECT BONDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251230B">H01L25/18</main-classification>  
        <further-classification edition="200601120251230B">H01L23/28</further-classification>  
        <further-classification edition="202301120251230B">H10B80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商英特爾股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇丹巴蘭　維維克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIDAMBARAM, VIVEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬哈加　拉文德納斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAHAJAN, RAVINDRANATH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜根　史蒂文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUGGAN, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種微電子組件的實施例可以包括：第一積體電路(IC)晶粒，其具有第一表面、相對的第二表面以及與第一表面和第二表面正交的第三表面，第一IC晶粒包括平行於第一表面和第二表面並且在第三表面處暴露的導電跡線；以及第二IC晶粒，其具有第四表面，第四表面具有導電接點，其中，在第一IC晶粒的第三表面處暴露的導電跡線透過金屬-金屬接合和介電質-介電質接合電氣耦接到第二IC晶粒的第四表面處的導電接點，金屬-金屬接合包括奈米雙晶銅。在一些實施例中，第一IC晶粒可以是多個第一IC晶粒中的一個。在這樣的實施例中，多個第一IC晶粒中的一些可以包括記憶體電路系統，並且多個第一IC晶粒中的一些可以包括計算電路系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of a microelectronic assembly may include a first integrated circuit (IC) die having a first surface, an opposing second surface, and a third surface orthogonal to the first and second surfaces, the first IC die including conductive traces parallel to the first and second surfaces and exposed at the third surface; and a second IC die having a fourth surface with conductive contacts, wherein the conductive traces exposed at the third surface of the first IC die are electrically coupled to the conductive contacts at the fourth surface of the second IC die by metal-metal bonds including nanotwinned copper and dielectric-dielectric bonds. In some embodiments, the first IC die may be one of a plurality of first IC dies. In such embodiments, some of the plurality of first IC dies may include memory circuitry and some of the plurality of first IC dies may include compute circuitry.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:微電子組件</p>  
        <p type="p">101(1):IC晶粒</p>  
        <p type="p">101(2):IC晶粒</p>  
        <p type="p">101(3):IC晶粒</p>  
        <p type="p">101(4):IC晶粒</p>  
        <p type="p">104:表面</p>  
        <p type="p">106:表面</p>  
        <p type="p">108:DB介電質</p>  
        <p type="p">110:DB接點</p>  
        <p type="p">120:導電跡線</p>  
        <p type="p">127:底部填充材料</p>  
        <p type="p">130:互連；DB區域</p>  
        <p type="p">131:電路板</p>  
        <p type="p">150:互連</p>  
        <p type="p">202:貫穿基板通孔(TSV)</p>  
        <p type="p">302:IC晶粒</p>  
        <p type="p">306:表面</p>  
        <p type="p">352:互連</p>  
        <p type="p">404:封裝基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1012" publication-number="202614139"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614139.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614139</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115930</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">H01J37/32</main-classification>  
        <further-classification edition="200601120251216B">H01L21/683</further-classification>  
        <further-classification edition="200601120251216B">H02N13/00</further-classification>  
        <further-classification edition="200601120251216B">H01L21/3065</further-classification>  
        <further-classification edition="200601120251216B">H01L21/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高山将歩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAYAMA, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赤尾健司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKAO, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">電漿處理裝置係包含電漿處理腔室、基台、靜電吸盤、吸附電極、接著層、環狀部件、導熱氣體供給部以及保護部件。基台係配置於電漿處理腔室內。靜電吸盤係配置於基台的上部，並具有基板支撐部及環支撐部。吸附電極係配置於環支撐部內。接著層係接合基台與靜電吸盤。環狀部件係配置於環支撐部的上表面。導熱氣體供給部係供給導熱氣體於環支撐部的上表面與環狀部件之間。保護部件係圍繞接著層的露出面，並透過基台及環狀部件來固定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">111:主體部</p>  
        <p type="p">111b:環狀區域</p>  
        <p type="p">112:環組件</p>  
        <p type="p">112a:凹部</p>  
        <p type="p">112b:溝槽</p>  
        <p type="p">113:氣體供給管路</p>  
        <p type="p">114:導熱氣體供給部</p>  
        <p type="p">120:保護部件</p>  
        <p type="p">1110:基台</p>  
        <p type="p">1110b:中央區域</p>  
        <p type="p">1110c:環狀區域</p>  
        <p type="p">1110d:溶射膜</p>  
        <p type="p">1110e:溝槽</p>  
        <p type="p">1111:靜電吸盤</p>  
        <p type="p">1111c:靜電電極</p>  
        <p type="p">1111d:溝槽</p>  
        <p type="p">1112:絕緣體環</p>  
        <p type="p">1112a:凸部</p>  
        <p type="p">1113:接著層</p>  
        <p type="p">1114:空間</p>  
        <p type="p">1114a:空間</p>  
        <p type="p">1114b:空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1013" publication-number="202614441"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614441.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614441</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115980</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHODS FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251121B">H01L23/535</main-classification>  
        <further-classification edition="200601120251121B">H01L23/488</further-classification>  
        <further-classification edition="200601120251121B">H01L21/60</further-classification>  
        <further-classification edition="200601120251121B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李怡蓁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張任遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JEN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一半導體結構包含一晶粒結構。該晶粒結構包含:一基底；在該基底上方的第一介電層；在該第一接電層中的第一導電結構；在該第一晶粒結構的邊緣表面上的第一邊緣保護層；及橫向鄰近於該第一邊緣保護層的第一絕緣層，該第一邊緣保護層位於第一絕緣層與第一晶粒結構的邊緣表面之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure includes a die structure. The die structure includes: a substrate; a first dielectric layer over the substrate; a first conductive structure within the first dielectric layer; a first edge protection layer on an edge surface of the first die structure; and a first insulating layer laterally adjacent to the first edge protection layer, the first edge protection layer between the first insulating layer and the edge surface of the first die structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">22:操作</p>  
        <p type="p">101:晶粒結構/半導體結構</p>  
        <p type="p">116:零件</p>  
        <p type="p">122:介電層</p>  
        <p type="p">130:邊緣保護層/氮氧化物層</p>  
        <p type="p">130L,130V:部分</p>  
        <p type="p">132:表面</p>  
        <p type="p">150:絕緣層</p>  
        <p type="p">160:介電層</p>  
        <p type="p">162:鍵合墊</p>  
        <p type="p">170:導電凸塊或導電球</p>  
        <p type="p">172:表面</p>  
        <p type="p">201:晶粒結構/半導體結構</p>  
        <p type="p">216:零件</p>  
        <p type="p">224:鍵合墊</p>  
        <p type="p">230:邊緣保護層</p>  
        <p type="p">230L:部分</p>  
        <p type="p">232:表面</p>  
        <p type="p">234:表面</p>  
        <p type="p">250:絕緣層</p>  
        <p type="p">300:半導體封裝結構/封裝</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1014" publication-number="202612978"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612978.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612978</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114115997</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有低摩擦隨行器之錨系統以及方法</chinese-title>  
        <english-title>ANCHOR SYSTEM WITH LOW-FRICTION FOLLOWER AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">B63B21/26</main-classification>  
        <further-classification edition="200601120251230B">B63B21/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商深錨解決方案股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEEP ANCHOR SOLUTIONS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧本尼　查爾斯　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUBENY, CHARLES P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　準浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUNHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有一低摩擦隨行器的錨系統，用於將一錨安裝至具有土壤的一海床中，該錨系統包含：一錨；一隨行器，以及一鍵控纜線。該隨行器經組配來附接至一錨，且該隨行器包括一隨行器蓋、一隨行器側壁及一土壤側摩擦降低機構。該土壤側摩擦降低機構包括自該隨行器側壁之複數個突起。該鍵控纜線經組配來連接該錨與該隨行器且包括一分離機構。該隨行器經組配以安裝深入嵌入於該海床之土壤中之該錨。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An anchor system with a low-friction follower for installation of an anchor into a seabed having soil includes an anchor, a follower, and a keying cable. The follower is configured to be attached to an anchor, and the follower includes a follower cap, a follower side wall, and a soil side friction reduction mechanism. The soil side friction reduction mechanism includes a plurality of protrusions from the follower side wall. The keying cable is configured to connect the anchor and the follower and includes a detachment mechanism. The follower is configured to install the anchor deeply embedded in the soil of the seabed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:錨系統</p>  
        <p type="p">10:錨，DERA錨，SEPLA錨</p>  
        <p type="p">11:鍵控纜線</p>  
        <p type="p">12:繫泊線</p>  
        <p type="p">13:鉤線</p>  
        <p type="p">20:隨行器，低摩擦隨行器，模組化隨行器，整體式隨行器</p>  
        <p type="p">21:空間</p>  
        <p type="p">22:泵</p>  
        <p type="p">30:海床</p>  
        <p type="p">31:初始深度</p>  
        <p type="p">32:土壤</p>  
        <p type="p">33:深度，目標深度</p>  
        <p type="p">40:海水</p>  
        <p type="p">41:水</p>  
        <p type="p">100:板</p>  
        <p type="p">101:錨連接器</p>  
        <p type="p">201:隨行器側壁</p>  
        <p type="p">202:隨行器蓋</p>  
        <p type="p">220:埠口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1015" publication-number="202614160"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614160.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614160</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116047</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於變形及弓翹補償的方法及設備</chinese-title>  
        <english-title>METHODS AND APPARATUS FOR DISTORTION AND BOW COMPENSATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">H01L21/02</main-classification>  
        <further-classification edition="200601120251223B">H01L21/3105</further-classification>  
        <further-classification edition="200601120251223B">H01L21/3205</further-classification>  
        <further-classification edition="200601120251223B">C23C16/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃彥輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YANHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　麥可　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, MICHAEL ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波特　大衛　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PORTER, DAVID W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李瑟　卡爾　費德瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEESER, KARL FREDERICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞迪　卡蒲　瑟利西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REDDY, KAPU SIRISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>珊卡　納葛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANKAR, NAGRAJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝利　柯蒂斯　華倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAILEY, CURTIS WARREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>依德柏格　艾瑞克　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDELBERG, ERIK ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舍費爾　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHAEFFER, JON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬治　喬恩　卡雷特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUDGE, JON GARRET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於減輕與半導體基板相關聯的變形之方法及設備。在一些實施例中，技術可包含：取得與該半導體基板的正面相關聯的正面輪廓，該正面輪廓表示與該半導體基板相關聯的翹曲、與該半導體基板相關聯的疊覆誤差、或其二者；基於該正面輪廓，決定該半導體基板的背面相關聯的背面輪廓；及根據該背面輪廓，修改與一背面膜的至少部分相關聯的應力，其中該修改與該至少部分相關聯的該應力之步驟補償該翹曲的至少一部分、該疊覆誤差的至少一部分、或其二者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and apparatus for mitigating distortion associated with a semiconductor substrate are provided. In some embodiments, techniques may include: obtaining a frontside profile associated with a frontside of the semiconductor substrate, the frontside profile being representative of warpage associated with the semiconductor substrate, overlay error associated with the semiconductor substrate, or both; determining, based on the frontside profile, a backside profile associated with a backside of the semiconductor substrate; and modifying a stress associated with at least portions of a backside film according to the backside profile, wherein the modifying of the stress associated with the at least portions compensates for at least a portion of the warpage, at least a portion of the overlay error, or both.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:方法</p>  
        <p type="p">922:正面輪廓</p>  
        <p type="p">932:背面輪廓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1016" publication-number="202612782"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612782.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612782</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116102</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製備多層滴丸劑的滴頭、生產系統及生產方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250506B">B01J2/06</main-classification>  
        <further-classification edition="200601120250506B">B01J2/00</further-classification>  
        <further-classification edition="200601120250506B">A61J3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳萬和製藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN WANHE PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仲蓀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHONGSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃維佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEIJIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHITAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種用於製備多層滴丸劑的滴頭、生產系統及生產方法，涉及多層滴丸劑製備技術領域，滴頭包括內層物料導管、中層物料導管和外層物料導管；中層物料導管與內層物料導管之間設有中層物料輸送通道，外層物料導管與中層物料導管之間設有外層物料輸送通道；內層物料導管與內層物料輸送管連通，內層物料輸送管設置於內層恆溫液體保溫腔體內；中層物料輸送通道與中層物料輸送管連通，中層物料輸送管設置於中層恆溫液體保溫腔體內；外層物料輸送通道與外層物料輸送管連通，外層物料輸送管設置於外層恆溫液體保溫腔體內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:滴頭</p>  
        <p type="p">6:內層物料輸送管</p>  
        <p type="p">7:內層恆溫液體保溫腔體</p>  
        <p type="p">8:中層物料輸送管</p>  
        <p type="p">9:中層恆溫液體保溫腔體</p>  
        <p type="p">10:外層物料輸送管</p>  
        <p type="p">11:外層恆溫液體保溫腔體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1017" publication-number="202614364"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614364.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614364</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116120</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含具有前側保護層之被動裝置的封裝</chinese-title>  
        <english-title>PACKAGE COMPRISING A PASSIVE DEVICE WITH A FRONT SIDE PROTECTION LAYER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L23/00</main-classification>  
        <further-classification edition="200601120260102B">H01L23/31</further-classification>  
        <further-classification edition="200601120260102B">H01L23/48</further-classification>  
        <further-classification edition="200601120260102B">H01L23/498</further-classification>  
        <further-classification edition="200601120260102B">H01L23/538</further-classification>  
        <further-classification edition="202301120260102B">H01L25/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋　彥梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, YANMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹　善雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN, SUN WOONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周忠義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHUNG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　建文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, JIANWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史東　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STONE, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種封裝，其包含一第一整合裝置；一封裝中介層，其耦接至該第一整合裝置；及一被動裝置，其至少部分位在該封裝中介層中。該被動裝置包含一被動裝置基材；複數個溝槽電容器，其等至少部分位於該被動裝置基材中；複數個貫通基材通孔，其等延伸穿過該被動裝置基材；及一保護層，其係該被動裝置之一第一表面的部分，其中該保護層包含一囊封層或一聚合物介電層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package comprising a first integrated device; a package interposer coupled to the first integrated device; and a passive device located at least partially in the package interposer. The passive device comprises a passive device substrate; a plurality of trench capacitors located at least partially in the passive device substrate; a plurality of through substrate vias extending through the passive device substrate; and a protection layer that is part of a first surface of the passive device, wherein the protection layer comprises an encapsulation layer or a polymer dielectric layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:封裝</p>  
        <p type="p">301:板</p>  
        <p type="p">302:封裝中介層</p>  
        <p type="p">303a~b:整合裝置</p>  
        <p type="p">304a~b:被動裝置</p>  
        <p type="p">305a~b:整合裝置</p>  
        <p type="p">306a~c:橋接器</p>  
        <p type="p">309:囊封層</p>  
        <p type="p">310:板介電層</p>  
        <p type="p">312:板互連件</p>  
        <p type="p">318:焊料互連件</p>  
        <p type="p">320:金屬化部分</p>  
        <p type="p">322:介電層</p>  
        <p type="p">323:金屬化互連件</p>  
        <p type="p">325:柱狀互連件</p>  
        <p type="p">330:囊封部分</p>  
        <p type="p">330a~b:柱狀互連件</p>  
        <p type="p">331a~b:柱狀互連件</p>  
        <p type="p">332:囊封層</p>  
        <p type="p">333:柱互連件</p>  
        <p type="p">334a~b:焊料互連件</p>  
        <p type="p">340:金屬化部分</p>  
        <p type="p">340a~b:焊料互連件</p>  
        <p type="p">342:介電層</p>  
        <p type="p">343:金屬化互連件</p>  
        <p type="p">345a~b:柱互連件</p>  
        <p type="p">349a~b:保護層</p>  
        <p type="p">350a~b:柱狀互連件</p>  
        <p type="p">352a~b:焊料互連件</p>  
        <p type="p">360a~c:黏著劑</p>  
        <p type="p">365a~c:柱互連件</p>  
        <p type="p">367a~c:焊料互連件</p>  
        <p type="p">390:底部填充物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1018" publication-number="202614121"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614121.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614121</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116144</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶電粒子束描繪方法及帶電粒子束描繪裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">H01J37/147</main-classification>  
        <further-classification edition="200601120251216B">H01J37/153</further-classification>  
        <further-classification edition="200601120251216B">H01J37/244</further-classification>  
        <further-classification edition="200601120251216B">H01J37/317</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商紐富來科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUFLARE TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相原一生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIBARA, ISSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安田淳平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUDA, JUMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種抑制射束位置的變動之帶電粒子束描繪方法及帶電粒子束描繪裝置。 &lt;br/&gt;　　按照本實施方式之帶電粒子束描繪方法，具備：以在對靜電型的定位偏向器的複數個電極的各者施加的各偏向電壓的範圍不包含任一個偏向電壓成為零的狀態之方式，將帶電粒子束偏向至加上偏向補償而得之位置之工序；將前述帶電粒子束照射至基板之工序；於規定的時間點，或基於前述帶電粒子束的漂移量，以全部偏向電壓成為零之偏向電壓的原點為基準而變更前述偏向補償的象限之工序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S9:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1019" publication-number="202613491"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613491.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613491</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116195</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膜的膜厚偏差測定方法、膜的膜厚偏差測定裝置、膜製造方法及膜製造裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">G01B11/06</main-classification>  
        <further-classification edition="201901120251231B">B29C48/31</further-classification>  
        <further-classification edition="201901120251231B">B29C48/92</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲盛樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INAMORI, TATSUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山中洋一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANAKA, YOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種藉由簡易且安全的裝置結構非接觸地獲取膜的膜厚偏差的方法。本發明的方法包括：一點膜厚梯度測定步驟，於光源22與光感測器陣列23之間不配置膜21而獲取作為光源的位置的本來位置，於光源22與光感測器陣列23之間配置膜21而獲取作為光源22的位置的表觀位置，根據本來位置與表觀位置，使用規定的式子求出膜21的膜厚梯度；多點膜厚梯度測定步驟，變更光源22的位置並進行多次一點膜厚梯度測定步驟；以及膜厚偏差分佈算出步驟，根據藉由多點膜厚梯度測定步驟而獲得的光源22的位置與膜21的膜厚梯度的對應關係，使用規定的式子求出膜21的膜厚偏差分佈。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:膜的膜厚偏差測定裝置/膜厚偏差測定裝置</p>  
        <p type="p">21:膜</p>  
        <p type="p">22:光源</p>  
        <p type="p">23:光感測器陣列</p>  
        <p type="p">231:光感測器</p>  
        <p type="p">24:運算部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1020" publication-number="202613068"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613068.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613068</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116208</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光電轉換元件、攝像元件、攝像元件之製造方法、光感測器、化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C07C49/39</main-classification>  
        <further-classification edition="200601120251229B">C07D209/12</further-classification>  
        <further-classification edition="200601120251229B">C07D209/60</further-classification>  
        <further-classification edition="200601120251229B">C07D209/86</further-classification>  
        <further-classification edition="200601120251229B">C07D209/96</further-classification>  
        <further-classification edition="200601120251229B">C07D307/80</further-classification>  
        <further-classification edition="200601120251229B">C07D333/22</further-classification>  
        <further-classification edition="200601120251229B">C07D333/78</further-classification>  
        <further-classification edition="200601120251229B">C07D409/04</further-classification>  
        <further-classification edition="200601120251229B">C07D409/14</further-classification>  
        <further-classification edition="200601120251229B">C07D487/04</further-classification>  
        <further-classification edition="200601120251229B">C07D495/04</further-classification>  
        <further-classification edition="200601120251229B">C07D495/14</further-classification>  
        <further-classification edition="202301120251229B">H10K30/30</further-classification>  
        <further-classification edition="202301120251229B">H10K30/60</further-classification>  
        <further-classification edition="202301120251229B">H10K39/32</further-classification>  
        <further-classification edition="202301120251229B">H10K85/20</further-classification>  
        <further-classification edition="202301120251229B">H10K85/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉浦寛記</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIURA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森田昌樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORITA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米久田康智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEKUTA, YASUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種對綠色光之量子效率的電場強度依賴性小的光電轉換元件。又，提供一種與上述光電轉換元件相關之攝像元件、攝像元件之製造方法、光感測器及化合物。本發明的光電轉換元件依序具有導電性膜、光電轉換膜及透明導電性膜，上述光電轉換膜含有式（1）或式（2）所表示之化合物。 &lt;br/&gt;&lt;img align="absmiddle" height="147px" width="411px" file="ed10047.JPG" alt="ed10047.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1021" publication-number="202614857"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614857.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614857</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116221</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250902B">H10D84/85</main-classification>  
        <further-classification edition="202501120250902B">H10D84/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡寬侃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, KUAN-KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石哲齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHE CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZHI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱宗凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, TSUNG-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊固峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KU-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　思雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, SZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置，包含：複數個第一奈米結構，在第一源極/汲極區域之間延伸；及複數個第二奈米結構，與該些第一奈米結構重疊，該些第二奈米結構在第二源極/汲極區域之間延伸。該裝置進一步包括：第一絕緣保護層，與該些第二奈米結構重疊；第一閘極堆疊，圍繞該些第一奈米結構；及第二閘極堆疊，位於該第一閘極堆疊上方且圍繞該些第二奈米結構設置。該第一絕緣保護層的側表面與該第一閘極堆疊的頂表面齊平。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device comprising includes a plurality of first nanostructures extending between first source/drain regions and a plurality of second nanostructures overlapping the plurality of first nanostructures, the plurality of second nanostructure extending between second source/drain regions. The device further includes a first insulating protective layer overlapping the second nanostructures; a first gate stack around the plurality of first nanostructures; and a second gate stack over the first gate stack and disposed around the plurality of second nanostructures. A lateral surface of the first insulating protective layer is level with a top surface of the first gate stack.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">26L:下半導體奈米結構</p>  
        <p type="p">26U:上半導體奈米結構</p>  
        <p type="p">56:介電隔離結構</p>  
        <p type="p">58:絕緣保護結構</p>  
        <p type="p">58L:下絕緣保護結構</p>  
        <p type="p">58U:上絕緣保護結構</p>  
        <p type="p">78:閘極介電層</p>  
        <p type="p">80L:下閘電極</p>  
        <p type="p">80U:上閘電極</p>  
        <p type="p">90:閘極結構</p>  
        <p type="p">90L:下閘極結構</p>  
        <p type="p">90U:上閘極結構</p>  
        <p type="p">104:ESL</p>  
        <p type="p">106:第三ILD</p>  
        <p type="p">108:閘極觸點</p>  
        <p type="p">116:介電層</p>  
        <p type="p">118:導電特徵層</p>  
        <p type="p">120:背側ESL</p>  
        <p type="p">122:背側ILD</p>  
        <p type="p">124:背側閘極觸點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1022" publication-number="202613436"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613436.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613436</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116231</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具扭力感測結構的減速機及其撓性組件</chinese-title>  
        <english-title>REDUCER WITH TORQUE SENSING STRUCTURE AND FLEXIBLE COMPONENT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250522B">F16H61/662</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鐘啟聞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, CHI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡弦龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, HSIEN-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱威穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, WEI-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡宛佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, WAN-YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭露一種具扭力感測結構的減速機及其撓性組件。撓性組件沿軸向設置於減速機等旋轉機械裝置的輸出盤上，且包括撓性本體和至少兩撓性臂。撓性本體沿軸向設置於輸出盤上。至少兩個撓性臂垂直於軸向由撓性本體向外延伸。減速機通過輸出盤輸出扭矩時，至少兩個撓性臂受力變形造成撓性本體形成位差。比對位差和輸出盤的轉動位置即可計算出輸出扭矩值，實現扭力感測器的應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a reducer with a torque sensing structure and a flexible component thereof. The flexible component is axially arranged on an output disk of a rotating mechanical device such as a reducer, and includes a flexible body and at least two flexible arms. The flexible body is axially arranged on the output disc. The at least two flexible arms are extended outwardly from the flexible body perpendicular to the axial direction. When the reducer outputs torque through the output disc, the at least two flexible arms are deformed by force, causing the flexible body to form a shifted position difference. By comparing the shifted position difference and a rotational position of the output disk, an output torque value can be calculated to realize the application of the torque sensor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:減速機</p>  
        <p type="p">2:減速機總成</p>  
        <p type="p">30:輸出端</p>  
        <p type="p">301:凸塊</p>  
        <p type="p">331:延伸段</p>  
        <p type="p">34:外套軸承</p>  
        <p type="p">400:編碼器出線端</p>  
        <p type="p">5:撓性組件</p>  
        <p type="p">51:撓性本體</p>  
        <p type="p">52:撓性臂</p>  
        <p type="p">6:螺絲</p>  
        <p type="p">9:馬達</p>  
        <p type="p">90:固定殼體</p>  
        <p type="p">C:軸向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1023" publication-number="202614849"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614849.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614849</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116244</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURES AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251106B">H10D84/80</main-classification>  
        <further-classification edition="202501120251106B">H10D84/01</further-classification>  
        <further-classification edition="202501120251106B">H10D64/20</further-classification>  
        <further-classification edition="202501120251106B">H10D62/10</further-classification>  
        <further-classification edition="202501120251106B">H10D86/80</further-classification>  
        <further-classification edition="200601120251106B">H01L21/768</further-classification>  
        <further-classification edition="200601120251106B">H01L23/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳羿輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃以理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YI-LII</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳榮佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUNG-YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳致孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH-HSIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔暉軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNG, HUI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李怡蓁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體結構及製造方法。一種半導體結構包含：基板，包括裝置區域及虛設區域；多個電晶體裝置，安置在裝置區域中且分別包括安置在第一閘極結構的多個相對側面上的多個源極/汲極特徵；多個虛設電晶體裝置，安置在虛設區域中且分別包括安置在第二閘極結構的多個相對側面上的多個虛設源極/汲極特徵；及導電路徑，由在虛設區域中的虛設電晶體裝置正上方且與虛設電晶體裝置隔離的一或多個導電結構形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor structures and methods of fabrication are provided. A semiconductor structure includes a substrate comprising a device region and a dummy region; transistor devices disposed in the device region and respectively comprising source/drain features disposed on opposing sides of a first gate structure; dummy transistor devices disposed in the dummy device region and respectively comprising dummy source/drain features disposed on opposing sides of a second gate structure; and a conductive path formed by a conductive structure or conductive structures directly over and isolated from the dummy transistor devices in the dummy region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:整合晶片結構、結構</p>  
        <p type="p">200:裝置區域、區域</p>  
        <p type="p">300:虛設區域、區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1024" publication-number="202613347"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613347.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613347</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116275</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>有機胺基-碳矽烷及利用其沉積含矽膜的方法</chinese-title>  
        <english-title>ORGANOAMINO-CARBOSILANES AND METHODS FOR DEPOSITING SILICON-CONTAINING FILMS USING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">C23C16/42</main-classification>  
        <further-classification edition="200601120251231B">C07F7/10</further-classification>  
        <further-classification edition="200601120251231B">C23C16/455</further-classification>  
        <further-classification edition="200601120251231B">H01L21/02</further-classification>  
        <further-classification edition="200601120251231B">C01B13/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬克專利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷　新建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, XINJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥當勞　馬修Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACDONALD, MATTHEW R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢德拉　哈里賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANDRA, HARIPIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳展俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示在約700⁰C或更低溫度下形成含矽膜的原子層沉積(ALD)方法，其中使用至少一具有根據式IA、IB和IC的一Si-C-Si鍵聯的有機胺基-碳矽烷前驅物化合物：&lt;br/&gt;&lt;img align="absmiddle" height="161px" width="623px" file="ed10205.JPG" alt="ed10205.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;其中R&lt;sup&gt;1&lt;/sup&gt;和R&lt;sup&gt;2&lt;/sup&gt;各自獨立選自氫、一直鏈或支鏈C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;10&lt;/sub&gt;烷基和一C&lt;sub&gt;6&lt;/sub&gt;至C&lt;sub&gt;10&lt;/sub&gt;芳基；R&lt;sup&gt;3-6&lt;/sup&gt;各自獨立選自氫和甲基；R&lt;sup&gt;7&lt;/sup&gt;選自氫、甲基和NR&lt;sup&gt;8&lt;/sup&gt;R&lt;sup&gt;9&lt;/sup&gt;其中R&lt;sup&gt;8&lt;/sup&gt;及R&lt;sup&gt;9&lt;/sup&gt;各自獨立選自氫、一直鏈或支鏈C&lt;sub&gt;1&lt;/sub&gt;至C&lt;sub&gt;10&lt;/sub&gt;烷基和一C&lt;sub&gt;6&lt;/sub&gt;至C&lt;sub&gt;10&lt;/sub&gt;芳基，但一前提條件是式IA的R&lt;sup&gt;3-7&lt;/sup&gt;不能全為氫，若R&lt;sup&gt;7&lt;/sup&gt;在式IA中為NR&lt;sup&gt;8&lt;/sup&gt;R&lt;sup&gt;9&lt;/sup&gt;，則R&lt;sup&gt;3-6&lt;/sup&gt;不能全為氫，若R&lt;sup&gt;7&lt;/sup&gt;在式IB中為NR&lt;sup&gt;8&lt;/sup&gt;R&lt;sup&gt;9&lt;/sup&gt;，則R&lt;sup&gt;3-6&lt;/sup&gt;不能全是甲基，R&lt;sup&gt;1-2&lt;/sup&gt;不能兩者都是氫，和R&lt;sup&gt;8-9&lt;/sup&gt;不能兩者都是氫，及其中R&lt;sup&gt;1&lt;/sup&gt;和R&lt;sup&gt;2&lt;/sup&gt;或是鍵聯形成一環狀環結構，或是R&lt;sup&gt;1&lt;/sup&gt;和R&lt;sup&gt;2&lt;/sup&gt;沒有鍵聯形成一環狀環結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Atomic layer deposition (ALD) process formation of silicon-containing film at temperature of about 700⁰C or lower is disclosed, wherein at least one organoamino-carbosilane precursor compound having a Si-C-Si linkage according to Formulae IA, IB and IC is used:&lt;br/&gt;&lt;img align="absmiddle" height="166px" width="619px" file="ed10206.JPG" alt="ed10206.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;wherein R&lt;sup&gt;1&lt;/sup&gt;and R&lt;sup&gt;2&lt;/sup&gt;are each independently selected from hydrogen, a linear or branched C&lt;sub&gt;1&lt;/sub&gt;to C&lt;sub&gt;10&lt;/sub&gt;alkyl group, and a C&lt;sub&gt;6&lt;/sub&gt;to C&lt;sub&gt;10&lt;/sub&gt;aryl group; R&lt;sup&gt;3-6&lt;/sup&gt;are each independently selected from hydrogen and methyl; R&lt;sup&gt;7&lt;/sup&gt;is selected from hydrogen, methyl, and NR&lt;sup&gt;8&lt;/sup&gt;R&lt;sup&gt;9&lt;/sup&gt;wherein R&lt;sup&gt;8&lt;/sup&gt;and R&lt;sup&gt;9&lt;/sup&gt;are each independently selected from hydrogen, a linear or branched C&lt;sub&gt;1&lt;/sub&gt;to C&lt;sub&gt;10&lt;/sub&gt;alkyl group, and a C&lt;sub&gt;6&lt;/sub&gt;to C&lt;sub&gt;10&lt;/sub&gt;aryl group with a provisos that R&lt;sup&gt;3-7&lt;/sup&gt;cannot be all hydrogen for IA, R&lt;sup&gt;3-6&lt;/sup&gt;cannot be all hydrogen if R&lt;sup&gt;7&lt;/sup&gt;is NR&lt;sup&gt;8&lt;/sup&gt;R&lt;sup&gt;9&lt;/sup&gt;in IA, R&lt;sup&gt;3-6&lt;/sup&gt;cannot be all methyl if R&lt;sup&gt;7&lt;/sup&gt;is NR&lt;sup&gt;8&lt;/sup&gt;R&lt;sup&gt;9&lt;/sup&gt;in IB, R&lt;sup&gt;1-2&lt;/sup&gt;cannot both be hydrogen, and R&lt;sup&gt;8-9&lt;/sup&gt;cannot both be hydrogen, and wherein R&lt;sup&gt;1&lt;/sup&gt;and R&lt;sup&gt;2&lt;/sup&gt;are either linked to form a cyclic ring structure or R&lt;sup&gt;1&lt;/sup&gt;and R&lt;sup&gt;2&lt;/sup&gt;are not linked to form a cyclic ring structure.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1025" publication-number="202613411"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613411.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613411</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116312</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於真空泵的蛤殼式定子、真空泵及其製造方法</chinese-title>  
        <english-title>CLAMSHELL STATOR FOR A VACUUM PUMP, VACUUM PUMP AND METHOD OF MANUFACTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">F04C29/12</main-classification>  
        <further-classification edition="200601120251223B">F04C25/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商愛德華有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDWARDS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾斯　麥可　亨利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NORTH, MICHAEL HENRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種製造用於一真空泵的一蛤殼式定子之方法(400)，其包括：提供(410)一第一半殼式定子組件及一第二半殼式定子組件，其中該第一半殼式定子組件及該第二半殼式定子組件包括用於界定複數個泵腔室之各自第一及第二內壁，該複數個泵腔室具有配置於其等之間的氣體輸送通路；鑽出(420)一第一孔，該第一孔延伸穿過該等第一內壁之一或多者且界定第一孔口；鑽出(430)一第二孔，該第二孔延伸穿過該等第二內壁之一或多者且界定第二孔口；分別配置(440)一第一密封構件及一第二密封構件以密封該等第一孔口及第二孔口之一或多者，使得在鄰近泵腔室之出口與入口之間提供一流體連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided a method (400) of manufacturing a clamshell stator for a vacuum pump comprising providing (410) a first half-shell stator component and a second half-shell stator component, wherein the first half-shell stator component and the second half-shell stator component comprise respective first and second internal walls for defining a plurality of pump chambers having gas transfer passages arranged therebetween; boring (420) a first bore extending through one or more of the first internal walls and defining first portholes; boring (430) a second bore extending through one or more of the second internal walls and defining second portholes; arranging (440) a first sealing means and a second sealing means respectively to seal one or more of the first portholes and second portholes such that a fluid connection is provided between the outlet and inlet of adjacent pump chambers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:方法</p>  
        <p type="p">410:提供步驟</p>  
        <p type="p">420:鑽出步驟</p>  
        <p type="p">430:鑽出步驟</p>  
        <p type="p">440:配置步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1026" publication-number="202614792"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614792.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614792</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116346</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251216B">H10D30/01</main-classification>  
        <further-classification edition="202501120251216B">H10D30/43</further-classification>  
        <further-classification edition="202501120251216B">H10D30/67</further-classification>  
        <further-classification edition="202501120251216B">H10D62/10</further-classification>  
        <further-classification edition="202501120251216B">H10D64/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>闕瑞甫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUEH, JUI FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林士堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置製造方法包括在基板上形成第一及第二多層堆疊。第一及第二多層堆疊包括沿堆疊之第一方向配置隔開的奈米片材及安置於相鄰奈米片材間的介電間隔物。遮罩層形成於第一及第二多層堆疊上。遮罩層在第一多層堆疊上的第一部分經移除以暴露奈米片材及第一多層堆疊的介電間隔物。第一多層堆疊之介電間隔物沿垂直於堆疊之第一方向之第二方向的部分被移除以降低第一多層堆疊的介電間隔物沿第二方向之厚度。遮罩層在第二多層堆疊上之第二部分經移除以暴露奈米片材及第二多層堆疊的介電間隔物，且閘極結構包覆第一及第二多層堆疊的奈米片材。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Manufacturing method of semiconductor device includes forming first and second multilayer stacks over a substrate. First and second multilayer stacks include plurality of spaced apart nanosheets arranged along first direction of stack, and dielectric spacers disposed between adjacent nanosheets. A mask layer is formed over first and second multilayer stacks. A first portion of mask layer over first multilayer stack is removed to expose plurality of nanosheets and dielectric spacers of first multilayer stack. A portion of the dielectric spacers of first multilayer stack along second direction perpendicular to first direction of stack is removed to decrease thickness of dielectric spacers of first multilayer stack along second direction. A second portion of the mask layer over second multilayer stack is removed to expose plurality of nanosheets and dielectric spacers of second multilayer stack, and gate structures wrap around plurality of nanosheets of first and second multilayer stacks.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:半導體層/奈米片材</p>  
        <p type="p">35:間隔物</p>  
        <p type="p">45a:第一側壁間隔物</p>  
        <p type="p">45b:第二側壁間隔物</p>  
        <p type="p">50:源極/汲極結構(區)</p>  
        <p type="p">68:接觸蝕刻終止層</p>  
        <p type="p">70:層間介電(ILD)層</p>  
        <p type="p">92:第一磊晶層</p>  
        <p type="p">110:高k介電層</p>  
        <p type="p">120:遮罩層</p>  
        <p type="p">125:未經摻雜磊晶區</p>  
        <p type="p">130:介電層</p>  
        <p type="p">140:ILD帽層</p>  
        <p type="p">CD&lt;sub&gt;INSP&lt;/sub&gt;:內部間隔物寬度</p>  
        <p type="p">CD&lt;sub&gt;INSP&lt;/sub&gt;':內部間隔物寬度</p>  
        <p type="p">CD&lt;sub&gt;INSP&lt;/sub&gt;":內部間隔物寬度</p>  
        <p type="p">CD&lt;sub&gt;MG&lt;/sub&gt;:閘極空間長度</p>  
        <p type="p">CD&lt;sub&gt;MG&lt;/sub&gt;':閘極空間長度</p>  
        <p type="p">CD&lt;sub&gt;MG&lt;/sub&gt;":閘極空間長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1027" publication-number="202614384"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614384.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614384</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116383</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝體、用於製造其之方法及用於形成積體電路晶粒之方法</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE, METHODS FOR FABRICATION THEREOF AND METHOD FOR FORMING INTEGRATED CIRCUIT DIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251008B">H01L23/28</main-classification>  
        <further-classification edition="200601120251008B">H01L23/16</further-classification>  
        <further-classification edition="200601120251008B">H01L23/52</further-classification>  
        <further-classification edition="200601120251008B">H01L21/302</further-classification>  
        <further-classification edition="202501120251008B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何宜臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, YI CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃晧昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HAO-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許向誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEU, SIAN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露內容之實施例提供具有圓角之IC晶粒。在一些實施例中，IC晶粒係一SOIC (系統整合單晶片)。圓角防止尖端放電，其可能不利地影響SOIC之電路結構。具有圓角之IC晶粒係改良IC封裝體中之間隙填充材料的品質，例如減少間隙填充材料中之開裂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure provide IC dies with rounded corners. In some embodiments, the IC die is a SOIC (system on integrated chip). The rounded corners prevent tip discharge which may adversely affect circuit structure of the SOIC. The IC dies with the rounded corners improve quality of gap filling material in IC packages, for example, reducing cracks in the gap filling material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:積體電路封裝體，IC封裝體</p>  
        <p type="p">102:載體基體</p>  
        <p type="p">104,117,127:接合膜</p>  
        <p type="p">106,140:間隙填充材料</p>  
        <p type="p">110:第一晶粒，晶粒</p>  
        <p type="p">111,121,131:圓化頂邊緣</p>  
        <p type="p">112,122:基體</p>  
        <p type="p">113,123:互連結構</p>  
        <p type="p">114,124:接合墊</p>  
        <p type="p">115,126:裝置層</p>  
        <p type="p">116:穿半導體通孔</p>  
        <p type="p">118:接合形貌體，接合墊</p>  
        <p type="p">120:第二晶粒</p>  
        <p type="p">125:傳導形貌體</p>  
        <p type="p">130:虛設晶粒</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1028" publication-number="202613529"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613529.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613529</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116385</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>監測容器狀態的方法以及檢查系統</chinese-title>  
        <english-title>METHOD FOR MONITORING A STATE OF A CONTAINER AND INSPECTION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">G01N21/90</main-classification>  
        <further-classification edition="200601120251219B">G01N21/94</further-classification>  
        <further-classification edition="200601120251219B">H01L21/67</further-classification>  
        <further-classification edition="200601120251219B">H01L21/673</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商布魯克斯自動化(德國)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROOKS AUTOMATION (GERMANY) GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩拉斯瓦圖拉　賈格迪什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SARASWATULA, JAGDISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威德曼　烏度</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIDMANN, UDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於監測經調適及經組態以收納晶圓或倍縮光罩之一容器之一狀態的方法，其包含以下步驟：在各個時間點，尤其以預定間隔偵測複數個容器特性中之至少一者，及基於該至少一個容器特性隨時間推移之一發展而評估該容器之該狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method for monitoring a state of a container adapted and configured to hold wafers or reticles, comprising the steps of detection of at least one of a plurality of container characteristics at various points in time, especially at predetermined intervals, and evaluation of the state of the container based on a development of the at least one container characteristic over time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:檢查系統</p>  
        <p type="p">120:偵測單元</p>  
        <p type="p">140:評估單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1029" publication-number="202614855"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614855.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614855</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116502</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251127B">H10D84/83</main-classification>  
        <further-classification edition="202501120251127B">H10D84/01</further-classification>  
        <further-classification edition="200601120251127B">H01L21/31</further-classification>  
        <further-classification edition="200601120251127B">H01L21/265</further-classification>  
        <further-classification edition="202501120251127B">H10D30/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳學儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSUEH-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭峻彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, CHUN-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TSUNG-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　志安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUI, CHI ON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示的實施例提供了一種半導體裝置結構及其形成方法。結構包括第一半導體層；第二半導體層，安置於第一半導體層上方；閘極介電層，安置於第一半導體層與第二半導體層之間；及介電材料的第一區及第二區，安置於閘極介電層的相對側。介電材料的第一區包括第一金屬，且第一金屬在第一區中的濃度在朝向閘極介電層的方向上降低。結構進一步包括第一介電間隔物及第二介電間隔物，且閘極介電層以及介電材料的第一區及第二區安置於第一介電間隔物與第二介電間隔物之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure provide a semiconductor device structure and methods for forming the same. The structure includes a first semiconductor layer, a second semiconductor layer disposed over the first semiconductor layer, a gate dielectric layer disposed between the first and second semiconductor layers, and first and second regions of a dielectric material disposed on opposite sides of the gate dielectric layer. The first region of the dielectric material includes a first metal, and a concentration of the first metal in the first region decreases in a direction towards the gate dielectric layer. The structure further includes first and second dielectric spacers, and the gate dielectric layer and the first and second regions of the dielectric material are disposed between the first and second dielectric spacers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置結構</p>  
        <p type="p">101:基板</p>  
        <p type="p">106:第一半導體層</p>  
        <p type="p">116:基板部分</p>  
        <p type="p">138:間隔物</p>  
        <p type="p">138A:第一間隔物</p>  
        <p type="p">138B:第二間隔物</p>  
        <p type="p">144:介電間隔物</p>  
        <p type="p">146:S/D區</p>  
        <p type="p">162:CESL</p>  
        <p type="p">163:ILD層</p>  
        <p type="p">170:閘極介電層</p>  
        <p type="p">172:閘電極層</p>  
        <p type="p">174:閘極結構</p>  
        <p type="p">202、204:區</p>  
        <p type="p">X、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1030" publication-number="202614281"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614281.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614281</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116513</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體接合對準系統及方法</chinese-title>  
        <english-title>SEMICONDUCTOR BONDING ALIGNMENT SYSTEMS AND METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L21/67</main-classification>  
        <further-classification edition="200601120260102B">H01L21/677</further-classification>  
        <further-classification edition="200601120260102B">H01L21/68</further-classification>  
        <further-classification edition="200601120260102B">H01L23/00</further-classification>  
        <further-classification edition="200601120260102B">G11C5/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德　賈格　皮耶特　威廉　荷曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE JAGER, PIETER WILLEM HERMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澳坦斯　喬斯特　傑洛恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTTENS, JOOST JEROEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多克　維克托　賽巴斯汀安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOLK, VICTOR SEBASTIAAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德　凱特　賈各　瑪西斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE KATER, JACOB MATTHIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿森德爾夫特　喬普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASSENDELFT, JOEP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比奇曼　阿爾罕　約翰尼斯　安敦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEUKMAN, ARJAN JOHANNES ANTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡駑戈帕蘭　斯安　帕拉雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VENUGOPALAN, SYAM PARAYIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達克森　安東尼斯　瑟多斯　安那　瑪利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DERKSEN, ANTONIUS THEODORUS ANNA MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏加爾德　羅培茲　蕾絲利　阿斯特麗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UGALDE LOPEZ, LESLYE ASTRID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥提森　賽門　吉司伯　喬瑟佛思</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATHIJSSEN, SIMON GIJSBERT JOSEPHUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英布隆　彼得　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENGBLOM, PETER DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴塔哈爾亞　卡司徒夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHATTACHARYYA, KAUSTUVE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白尼　凡丁　葉弗真葉米希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANINE, VADIM YEVGENYEVICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述了在較高產出量下具有較佳置放精度的半導體接合。在一些實施例中，使用與一軌道或轉座以操作方式相關聯的一基板固持器。該基板固持器接納並固持一第一基板，並移動該第一基板通過處理站，以使得該第一基板能夠接合至一第二基板。該等處理站包含一對準站及一接合站。該對準站處之對準感測器經組態以判定該第一基板相對於該基板固持器之一位置。一控制器致使該基板固持器沿著該軌道或轉座移動至該接合站，及基於該第一基板相對於該基板固持器之該位置而將該第一基板與該第二基板對準以進行接合。在一些更一般的實施例中，使用諸如接合墊之一(電)觸點陣列進行對準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor bonding with better placement accuracy at higher throughputs is described. In some embodiments, a substrate holder operatively associated with a track or turret is used. The substrate holder receives and holds a first substrate, and moves the first substrate through process stations to enable the first substrate to be bonded to a second substrate. The process stations comprise an alignment station and a bonding station. Alignment sensors at the alignment station are configured to determine a position of the first substrate relative to the substrate holder. A controller causes the substrate holder to move along the track or turret to the bonding station, and align the first substrate with the second substrate for bonding based on the position of the first substrate relative to the substrate holder. In some more general embodiments, an array of (electrical) contacts such as bond pads is used for alignment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:半導體接合系統</p>  
        <p type="p">202:軌道</p>  
        <p type="p">204:路徑</p>  
        <p type="p">206:基板固持器</p>  
        <p type="p">208:第一基板</p>  
        <p type="p">210:處理站/初始檢測站</p>  
        <p type="p">212:處理站/粗略置放站</p>  
        <p type="p">214:處理站/清潔站</p>  
        <p type="p">216:處理站/電漿處理站</p>  
        <p type="p">218:處理站/形貌檢測站</p>  
        <p type="p">220:處理站/調平站</p>  
        <p type="p">222:處理站/粗略對準站</p>  
        <p type="p">224:處理站/位置調整站</p>  
        <p type="p">226:處理站/精細對準站</p>  
        <p type="p">228:處理站/接合站</p>  
        <p type="p">230:第二基板</p>  
        <p type="p">232:轉移</p>  
        <p type="p">234:卡盤</p>  
        <p type="p">240:對準感測器</p>  
        <p type="p">242:對準站</p>  
        <p type="p">244:柵格板</p>  
        <p type="p">250:控制器</p>  
        <p type="p">260:感測器/運動感測器</p>  
        <p type="p">262:感測器/程序感測器</p>  
        <p type="p">270:水平軸線</p>  
        <p type="p">272:豎直軸線</p>  
        <p type="p">274:並行處理路徑</p>  
        <p type="p">275:載體</p>  
        <p type="p">280:前開式晶圓傳送盒(FOUP)</p>  
        <p type="p">282:第二FOUP</p>  
        <p type="p">285:受體FOUP</p>  
        <p type="p">290:接合晶圓FOUP</p>  
        <p type="p">298:隔離器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1031" publication-number="202613735"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613735.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613735</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116514</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>與快速掃描相結合之固定平行對準感測器</chinese-title>  
        <english-title>FIXED PARALLEL ALIGNMENT SENSORS IN COMBINATION WITH FAST SCANNING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G03F9/00</main-classification>  
        <further-classification edition="200601120260102B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比奇曼　阿爾罕　約翰尼斯　安敦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEUKMAN, ARJAN JOHANNES ANTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏利克　阿諾　詹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLEEKER, ARNO JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩羅門斯　亨利克斯　佩特羅　瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PELLEMANS, HENRICUS PETRUS MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊烏　丹尼斯　伯恩哈德　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEEUW, DENNIS BERNHARD ANTHONI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種對準系統，其包括一基板載物台、複數個感測器，及一控制系統。該基板載物台支撐且移動一基板，該基板上安置有複數個基板對準標記。該複數個感測器配置於一框架上。該控制系統相對於該框架掃描該基板載物台。該控制系統基於該複數個感測器中之個別者相對於彼此之一已知位置來控制該基板載物台之移動，以校正該複數個感測器與該複數個基板對準標記之間的任何未對準或節距失配。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An alignment system includes a substrate stage, a plurality of sensors, and a control system. The substrate stage supports and moves a substrate having a plurality of substrate alignment marks disposed thereon. The plurality of sensors are arranged on a frame. The control system scans the substrate stage with respect to the frame. The control system controls movement of the substrate stage to correct for any misalignment or pitch mismatch between the plurality of sensors and the plurality of substrate alignment marks based on a known position of individual ones of the plurality of sensors with respect to each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:對準系統</p>  
        <p type="p">502:基板載物台</p>  
        <p type="p">504:基板</p>  
        <p type="p">506:基板對準標記</p>  
        <p type="p">508:感測器</p>  
        <p type="p">508a:感測器</p>  
        <p type="p">508b:感測器</p>  
        <p type="p">508c:感測器</p>  
        <p type="p">508d:感測器</p>  
        <p type="p">508e:感測器</p>  
        <p type="p">510:框架</p>  
        <p type="p">512:機械容差</p>  
        <p type="p">514:離距</p>  
        <p type="p">516:控制系統</p>  
        <p type="p">518:掃描方向</p>  
        <p type="p">520:第一基板對準標記</p>  
        <p type="p">522:第二基板對準標記</p>  
        <p type="p">524:第三基板對準標記</p>  
        <p type="p">526:第一垂直方向</p>  
        <p type="p">528:第二垂直方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1032" publication-number="202614125"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614125.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614125</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116515</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於影像分析之在前平移</chinese-title>  
        <english-title>TRANSLATION PRIOR FOR IMAGE ANALYSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H01J37/26</main-classification>  
        <further-classification edition="201701120251219B">G06T7/00</further-classification>  
        <further-classification edition="202201120251219B">G06V10/82</further-classification>  
        <further-classification edition="201901120251219B">G06N20/00</further-classification>  
        <further-classification edition="200601120251219B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑟方丹　帕斯卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CERFONTAINE, PASCAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿　阿里夫　Ｓ　Ｍ　馬蘇杜爾　朗曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AL ARIF, S. M. MASUDUR RAHMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BD</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威赫爾　尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERHEUL, NICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德爾克斯　萊姆克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIRKS, REMCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於訓練一機器學習模型以判定用於影像分析中之一損失函數的設備，其包括：一記憶體，其儲存一指令集；及至少一個處理器，其經組態以執行該指令集以致使該設備執行：編碼一影像批次中之一影像以判定一第一潛在空間表示；變換該影像；編碼該經變換影像以判定一第二潛在空間表示；自該第一潛在空間表示及該第二潛在空間表示選擇對應參數；及基於來自該第一潛在空間表示及該第二潛在空間表示之該等所選擇對應參數而判定該影像批次中之所有影像之該損失函數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus for training a machine learning model to determine a loss function for use in image analysis includes a memory storing a set of instructions and at least one processor configured to execute the set of instructions to cause the apparatus to perform: encoding an image of a batch of images to determine a first latent space representation; transforming the image; encoding the transformed image to determine a second latent space representation; selecting corresponding parameters from the first latent space representation and the second latent space representation; and determining the loss function over all images in the batch of images based on the selected corresponding parameters from the first latent space representation and the second latent space representation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:第一實例影像/影像</p>  
        <p type="p">1002:水平線</p>  
        <p type="p">1004:豎直線</p>  
        <p type="p">1006:位置</p>  
        <p type="p">1008:編碼器</p>  
        <p type="p">1010:空間參數向量</p>  
        <p type="p">1012:參數/X移位</p>  
        <p type="p">1020:第二實例影像/影像</p>  
        <p type="p">1022:水平線</p>  
        <p type="p">1024:豎直線</p>  
        <p type="p">1026:位置</p>  
        <p type="p">1028:編碼器</p>  
        <p type="p">1030:潛在空間參數向量</p>  
        <p type="p">1034:參數/Y移位</p>  
        <p type="p">1040:第三實例影像/影像</p>  
        <p type="p">1042:水平線</p>  
        <p type="p">1044:豎直線</p>  
        <p type="p">1046:位置</p>  
        <p type="p">1048:編碼器</p>  
        <p type="p">1050:潛在空間參數向量</p>  
        <p type="p">1052:參數</p>  
        <p type="p">1060:第四實例影像/影像</p>  
        <p type="p">1062:水平線</p>  
        <p type="p">1064:豎直線</p>  
        <p type="p">1066:位置</p>  
        <p type="p">1068:編碼器</p>  
        <p type="p">1070:潛在空間參數向量</p>  
        <p type="p">1074:參數</p>  
        <p type="p">X:正X值/影像1上之疊對</p>  
        <p type="p">Y:正Y值/影像2上之疊對</p>  
        <p type="p">-X:負X值</p>  
        <p type="p">-Y:負Y值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1033" publication-number="202614140"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614140.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614140</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116560</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置及基板處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中誠治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, SEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>增澤健二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUZAWA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田洋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, YOUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種抑制反應生成物附著在整流壁的電漿處理裝置及基板處理方法。 &lt;br/&gt;一種電漿處理裝置，係藉由電漿對基板進行處理，具備：電漿生成部，係被供應生成該電漿的第1高頻功率；載置台，係在上面具有供載置該基板的載置區域，會被供應在該載置區域上形成偏壓的第2高頻功率；以及整流壁，係配置成圍繞該載置區域，其上端位在比該載置區域更上方；該整流壁係由具有凹部或內部空洞之絕緣構件及配置在該凹部或該內部空洞之導電構件所構成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:天線室</p>  
        <p type="p">G:基板</p>  
        <p type="p">S:處理室</p>  
        <p type="p">11:側壁</p>  
        <p type="p">12:頂板</p>  
        <p type="p">12a:供應口</p>  
        <p type="p">13:上腔室</p>  
        <p type="p">14:支撐框</p>  
        <p type="p">15:側壁</p>  
        <p type="p">15a:搬出入口</p>  
        <p type="p">16:底板</p>  
        <p type="p">16a:排氣口</p>  
        <p type="p">17:下腔室</p>  
        <p type="p">20:處理容器</p>  
        <p type="p">21:接地線</p>  
        <p type="p">22:密封溝</p>  
        <p type="p">23:密封構件</p>  
        <p type="p">24:閘閥</p>  
        <p type="p">30:金屬窗(電漿生成部)</p>  
        <p type="p">31:分割金屬窗</p>  
        <p type="p">32:導體板</p>  
        <p type="p">32a:上端面</p>  
        <p type="p">32b:貫通孔</p>  
        <p type="p">33:氣體擴散溝</p>  
        <p type="p">34:噴淋板</p>  
        <p type="p">34a:露出面</p>  
        <p type="p">35:氣體噴出孔</p>  
        <p type="p">37:絕緣構件</p>  
        <p type="p">37a:端面</p>  
        <p type="p">38:罩構件</p>  
        <p type="p">51:高頻天線(電漿生成部)</p>  
        <p type="p">52:氣體導入管</p>  
        <p type="p">53:供電構件</p>  
        <p type="p">54:供電線</p>  
        <p type="p">55:匹配器</p>  
        <p type="p">56:高頻電源</p>  
        <p type="p">60:處理氣體供應部</p>  
        <p type="p">61:氣體供應管</p>  
        <p type="p">62:開閉閥</p>  
        <p type="p">63:流量控制器</p>  
        <p type="p">64:處理氣體供應源</p>  
        <p type="p">70:基板載置台(載置台)</p>  
        <p type="p">71:基材</p>  
        <p type="p">71a:上面</p>  
        <p type="p">72a:調溫介質流道</p>  
        <p type="p">72b:去程配管</p>  
        <p type="p">72c:返程配管</p>  
        <p type="p">74:陶瓷層</p>  
        <p type="p">75:導電層(吸附電極)</p>  
        <p type="p">76:靜電吸盤</p>  
        <p type="p">78:台座</p>  
        <p type="p">79:屏蔽環(屏蔽構件)</p>  
        <p type="p">80:供電構件</p>  
        <p type="p">81:供電線</p>  
        <p type="p">82:匹配器</p>  
        <p type="p">83:高頻電源</p>  
        <p type="p">84:供電線</p>  
        <p type="p">85:直流電源</p>  
        <p type="p">86:冷卻器</p>  
        <p type="p">87:去程流道</p>  
        <p type="p">88:返程流道</p>  
        <p type="p">90:控制部</p>  
        <p type="p">100:電漿處理裝置</p>  
        <p type="p">200:整流壁</p>  
        <p type="p">210:絕緣構件</p>  
        <p type="p">220:導電構件</p>  
        <p type="p">300:排氣裝置</p>  
        <p type="p">301a:排氣流道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1034" publication-number="202613530"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613530.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613530</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116568</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偏振成像反射儀</chinese-title>  
        <english-title>POLARIZED IMAGING REFLECTOMETER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">G01N21/95</main-classification>  
        <further-classification edition="200601120251231B">G01N21/33</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　進鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NG, ERIC CHIN HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊根　陶德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EGAN, TODD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費茲艾拉凡尼　梅迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAEZ-IRAVANI, MEHDI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述的實施例涉及包含光引擎及複數個光源的裝置。在一個實施例中，複數個光源中每一者均被配置為發射具有不同波長頻寬的光譜頻帶。該裝置還可能包括與光引擎光學耦合的分束器，其中該分束器將光譜頻帶分割為第一光學路徑和第二光學路徑。在一個實施例中，功率監測器沿著第一光學路徑與分束器光學耦合，而反射物鏡則沿著第二光學路徑與分束器光學耦合。在一個實施例中，該反射物鏡包括第一鏡和第二鏡。在一個實施例中，該裝置還包含光學感測器，該光學感測器被配置為量測光譜頻帶在自基板反射後的光譜頻帶。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to an apparatus that includes a light engine with a plurality of light sources. In an embodiment, each of the plurality of light sources is configured to emit a spectral band with different wavelength bandwidth. The apparatus may also include a beam splitter that is optically coupled to the light engine, where the beam splitter splits the spectral bands into a first optical path and a second optical path. In an embodiment, a power monitor is optically coupled to the beam splitter along the first optical path, and a reflective objective lens is optically coupled to the beam splitter along the second optical path. In an embodiment, the reflective objective lens includes a first mirror and a second mirror. In an embodiment, the apparatus further includes an optical sensor configured to measure the spectral bands after the spectral bands have reflected off of a substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:工具</p>  
        <p type="p">113:聚焦透鏡</p>  
        <p type="p">114:聚焦透鏡</p>  
        <p type="p">115:輸入光束</p>  
        <p type="p">116:第一光學路徑</p>  
        <p type="p">117:第二光學路徑</p>  
        <p type="p">118:偏振器</p>  
        <p type="p">120:成像反射量測系統</p>  
        <p type="p">121:光引擎</p>  
        <p type="p">122:分束器</p>  
        <p type="p">123:功率監測器</p>  
        <p type="p">124:光學感測器</p>  
        <p type="p">125:反射物鏡</p>  
        <p type="p">126:主鏡</p>  
        <p type="p">127:次鏡</p>  
        <p type="p">128:分析儀</p>  
        <p type="p">129:補償器</p>  
        <p type="p">130:計量腔室</p>  
        <p type="p">131:光學窗口</p>  
        <p type="p">132:腔室壁</p>  
        <p type="p">133:工作台</p>  
        <p type="p">135:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1035" publication-number="202612650"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612650.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612650</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116587</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>周邊循環即時偵測與個人化護理裝置</chinese-title>  
        <english-title>REAL-TIME PERIPHERAL CIRCULATION MONITORING AND PERSONALIZED CARE APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251229B">A61B5/243</main-classification>  
        <further-classification edition="200601120251229B">A61B5/0295</further-classification>  
        <further-classification edition="200601120251229B">A61B5/022</further-classification>  
        <further-classification edition="200601120251229B">A61B5/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜翌群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, YI CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱銘峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王傳勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種周邊循環即時偵測與個人化護理裝置，包含第一上肢量測器、第二上肢量測器、第一下肢量測器與第二下肢量測器，分別用於夾持於四肢，以量測心電圖訊號及四肢位置的各血液容積變化訊號，根據心電圖訊號及四肢位置的各血液容積變化訊號峰值訊號之時間差獲得各脈搏傳導時間，控制單元根據四肢的各脈搏傳導時間與時間預設值之間的離差值，控制壓脈帶對四肢的肌肉部位施予個人化的加壓，並控制電刺激貼片對肢體釋放個人化的電刺激強度，以有效改善下肢水腫及四肢肌肉萎縮的現象，輕便的整合式夾體與結合電刺激貼片的壓脈帶，適於攜行與穿戴，操作方便且不受場域的限制。另具備量測上下肢血壓比(ABI)功能，可隨時掌握血管阻塞程度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A real-time peripheral circulation monitoring and personalized care apparatus includes a first upper limb measurement device, a second upper limb measurement device, a first lower limb measurement device, and a second lower limb measurement device, which are configured to be respectively clipped on the limbs for measuring ECG signal and blood volume change signal of each limb, thus obtaining respective pulse transit time of each limb based on the time difference between the peak values of their respective ECG signal and blood volume change signal. After that, a control unit applies a respective personalized pressure, according to a respective deviation between the pulse transit time of each limb and a predetermined time, to muscle of each limb through a respective blood pressure cuff, and release respective electrical stimulation of personalized intensity to the limb through respective electrical stimulation patches, thereby effectively improving lower limb edema and muscle atrophy in the limbs. The compact integrated clip and the blood pressure cuff combined with the electrical stimulation patches make the disclosed apparatus portable, easy to wear, simple to operate, and usable anywhere. Moreover, the apparatus also features the ability to measure Ankle-Brachial Index (ABI), allowing users to assess vessel occlusion levels at any time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一上肢量測器</p>  
        <p type="p">2:第二上肢量測器</p>  
        <p type="p">3:第一下肢量測器</p>  
        <p type="p">4:第二下肢量測器</p>  
        <p type="p">5:壓脈帶</p>  
        <p type="p">7:控制單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1036" publication-number="202614845"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614845.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614845</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116605</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251001B">H10D84/01</main-classification>  
        <further-classification edition="202501120251001B">H10D64/01</further-classification>  
        <further-classification edition="202501120251001B">H10D84/85</further-classification>  
        <further-classification edition="202501120251001B">H10D62/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何韋德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, WEI-DE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZHI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王冠人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, GUAN-REN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江育賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YU-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡祖禹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOO, JU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括：在一基板上方形成一下部源極/汲極區；在該下部源極/汲極區旁邊形成一閘極堆疊；在該下部源極/汲極區上方形成一上部源極/汲極區；執行一背側削薄製程以削薄該基板且顯露一犧牲區；移除該犧牲區以顯露該下部源極/汲極區；及形成一背側觸點插塞以電連接至該下部源極/汲極區。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a lower source/drain region over a substrate, forming a gate stack aside of the lower source/drain region, forming an upper source/drain region over the lower source/drain region, performing a backside thinning process to thin the substrate and to reveal a sacrificial region, removing the sacrificial region to reveal the lower source/drain region, and forming a backside contact plug to electrically connect to the lower source/drain region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:晶圓</p>  
        <p type="p">10:互補式場效電晶體(CFET)</p>  
        <p type="p">10L:奈米結構場效電晶體(FET)</p>  
        <p type="p">10U:奈米結構場效電晶體(FET)</p>  
        <p type="p">26:通道區</p>  
        <p type="p">26’L:下部半導體奈米結構</p>  
        <p type="p">26’U:上部半導體奈米結構</p>  
        <p type="p">26’M:虛設半導體層</p>  
        <p type="p">44:閘極間隔物</p>  
        <p type="p">54:內部間隔物</p>  
        <p type="p">56:介電隔離層</p>  
        <p type="p">62U:上部源極/汲極區</p>  
        <p type="p">62L:下部源極/汲極區</p>  
        <p type="p">66:第一觸點蝕刻終止層</p>  
        <p type="p">68:第一層間介電層</p>  
        <p type="p">70:第二觸點蝕刻終止層</p>  
        <p type="p">72:第二層間介電層</p>  
        <p type="p">78:閘極介電質</p>  
        <p type="p">80U:上部閘極電極</p>  
        <p type="p">80L:下部閘極電極</p>  
        <p type="p">90:閘極堆疊</p>  
        <p type="p">90U:上部閘極堆疊</p>  
        <p type="p">90L:下部閘極堆疊</p>  
        <p type="p">92:閘極遮罩</p>  
        <p type="p">94:氧化矽區</p>  
        <p type="p">96U:源極/汲極觸點插塞</p>  
        <p type="p">96L:源極/汲極觸點插塞</p>  
        <p type="p">104:虛線區</p>  
        <p type="p">106:介電層/介電基板</p>  
        <p type="p">116:介電觸點間隔物</p>  
        <p type="p">120:矽化物層</p>  
        <p type="p">122:背側觸點插塞</p>  
        <p type="p">124:蝕刻終止層</p>  
        <p type="p">126:介電層</p>  
        <p type="p">128:介電襯裡</p>  
        <p type="p">130:導電特徵</p>  
        <p type="p">W1”:底部寬度</p>  
        <p type="p">W2”:頂部寬度</p>  
        <p type="p">W3:頂部寬度</p>  
        <p type="p">W4:外部寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1037" publication-number="202614342"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614342.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614342</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116621</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於夾持彎曲基板的方法和設備</chinese-title>  
        <english-title>METHODS AND APPARATUS FOR CHUCKING A BOWED SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L21/683</main-classification>  
        <further-classification edition="200601120260102B">H01L21/67</further-classification>  
        <further-classification edition="200601120260102B">G01B11/24</further-classification>  
        <further-classification edition="200601120260102B">G01B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫特　約書亞史都華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLT, JOSHUA STUART</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈爾奇奇科　瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GORCHICHKO, MARIIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈因　舒本德拉庫瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAIN, SHUBHENDRA KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫瑪　安伽那</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, ARCHANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布里格斯　班傑明Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRIGGS, BENJAMIN D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比久科夫　伊萬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIZYUKOV, IVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>UA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供了彎曲基板的夾持方法和基板處理系統。在某些實施例中，基板處理系統包括：支撐基板的底座，該底座具有複數個夾持區域；具有一或多個感測器的翹曲偵測系統，用於偵測基板的翹曲；以及複數個可調式夾持部件，這些元件設置在底座內，且對應於複數個夾持區域，其中複數個可調式夾持部件被配置為根據基板的翹曲情況，方便對基板施加不同量的力、加熱或冷卻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and substrate processing systems of chucking a bowed substrate are provided herein. In some embodiments, a substrate processing system includes: a pedestal to support a substrate, the pedestal having a plurality of chucking regions; a warpage detection system having one or more sensors to detect warpage of the substrate; and a plurality of adjustable chucking components disposed in the pedestal corresponding with the plurality of chucking regions, wherein the plurality of adjustable chucking components are configured to facilitate applying different amounts of force, heating, or cooling to the substrate based on the warpage of the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:腔室</p>  
        <p type="p">202:腔室主體</p>  
        <p type="p">205:體積</p>  
        <p type="p">206:轉移槽</p>  
        <p type="p">208:部件</p>  
        <p type="p">210:支撐件</p>  
        <p type="p">212:基板</p>  
        <p type="p">214:支撐軸</p>  
        <p type="p">215:底座</p>  
        <p type="p">216:表面</p>  
        <p type="p">218:裝置</p>  
        <p type="p">220:推進器</p>  
        <p type="p">222:感測器</p>  
        <p type="p">240:控制器</p>  
        <p type="p">242:CPU</p>  
        <p type="p">244:記憶體</p>  
        <p type="p">246:支援電路</p>  
        <p type="p">250:真空系統</p>  
        <p type="p">252:光學偵測系統</p>  
        <p type="p">260:致動器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1038" publication-number="202614550"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614550.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614550</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116705</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>降壓升壓功率變換器及控制方法</chinese-title>  
        <english-title>BUCK-BOOST POWER CONVERTER AND CONTROL METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251119B">H02M3/156</main-classification>  
        <further-classification edition="200601120251119B">H02M1/08</further-classification>  
        <further-classification edition="200601120251119B">G05F1/565</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商達爾科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIODES INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳浩銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HAO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃鋒榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, FENG-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李歌晏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KO-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種設備包含：一時脈產生器，其經組態以產生饋送至一鎖存器之一設定輸入中之一設定信號；一誤差放大器，其經組態以產生一COMP信號；一偏移產生器，其經組態以產生不同偏移電壓；及一比較器，其經組態以產生饋送至該鎖存器之一重設輸入中之一重設信號，其中該比較器之一非反相輸入經組態以接收等於一電流感測信號與一斜率補償信號之一總和的一信號，且其中該電流感測信號等於流經一功率變換器之一電流乘以一可調整增益，且該比較器之一反相輸入經組態以接收一誤差信號，且其中該誤差信號等於該COMP信號減去由該偏移產生器產生之一偏移電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus includes a clock generator configured to generate a set signal fed into a set input of a latch, an error amplifier configured to generate a COMP signal, an offset generator configured to generate different offset voltages, and a comparator configured to generate a reset signal fed into a reset input of the latch, wherein a non-inverting input of the comparator is configured to receive a signal equal to a sum of a current sense signal and a slope compensation signal, and wherein the current sense signal is equal to a current flowing through a power converter times an adjustable gain, and an inverting input of the comparator is configured to receive an error signal, and wherein the error signal is equal to the COMP signal minus an offset voltage generated by the offset generator.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:功率變換器/四開關降壓升壓變換器</p>  
        <p type="p">106:負載</p>  
        <p type="p">200:控制器</p>  
        <p type="p">202:回饋控制單元</p>  
        <p type="p">203:偏移產生器</p>  
        <p type="p">204:誤差放大器</p>  
        <p type="p">206:比較器</p>  
        <p type="p">208:斜率補償單元</p>  
        <p type="p">210:時脈產生器</p>  
        <p type="p">212:鎖存器</p>  
        <p type="p">214:控制邏輯單元</p>  
        <p type="p">216:求和點</p>  
        <p type="p">218:求和點</p>  
        <p type="p">220:求和點</p>  
        <p type="p">222:第一偏移處理單元</p>  
        <p type="p">224:第二偏移處理單元</p>  
        <p type="p">704:可變增益放大器</p>  
        <p type="p">BB:第一控制信號</p>  
        <p type="p">BO:第二控制信號</p>  
        <p type="p">C&lt;sub&gt;IN&lt;/sub&gt;:輸入電容器</p>  
        <p type="p">C&lt;sub&gt;O&lt;/sub&gt;:輸出電容器</p>  
        <p type="p">C&lt;sub&gt;SLO&lt;/sub&gt;:斜率補償信號</p>  
        <p type="p">C1:電容器</p>  
        <p type="p">C2:電容器</p>  
        <p type="p">CLK:時脈信號</p>  
        <p type="p">D&lt;sub&gt;ON&lt;/sub&gt;:PWM信號</p>  
        <p type="p">G&lt;sub&gt;A&lt;/sub&gt;:閘極驅動信號</p>  
        <p type="p">G&lt;sub&gt;B&lt;/sub&gt;:閘極驅動信號</p>  
        <p type="p">G&lt;sub&gt;C&lt;/sub&gt;:閘極驅動信號</p>  
        <p type="p">G&lt;sub&gt;D&lt;/sub&gt;:閘極驅動信號</p>  
        <p type="p">I&lt;sub&gt;L&lt;/sub&gt;:電流</p>  
        <p type="p">I&lt;sub&gt;O&lt;/sub&gt;:輸出電流</p>  
        <p type="p">I&lt;sub&gt;S&lt;/sub&gt;:電流感測信號</p>  
        <p type="p">R&lt;sub&gt;S&lt;/sub&gt;:電流感測電阻器</p>  
        <p type="p">R1:電阻器</p>  
        <p type="p">R2:電阻器</p>  
        <p type="p">R3:電阻器</p>  
        <p type="p">S1:第一控制開關</p>  
        <p type="p">S2:第二控制開關</p>  
        <p type="p">SW&lt;sub&gt;A&lt;/sub&gt;:開關/第一高側開關</p>  
        <p type="p">SW&lt;sub&gt;B&lt;/sub&gt;:開關/第一低側開關</p>  
        <p type="p">SW&lt;sub&gt;C&lt;/sub&gt;:開關/第二低側開關</p>  
        <p type="p">SW&lt;sub&gt;D&lt;/sub&gt;:開關/第二高側開關</p>  
        <p type="p">V&lt;sub&gt;COMP&lt;/sub&gt;:COMP信號</p>  
        <p type="p">V&lt;sub&gt;ER&lt;/sub&gt;:誤差信號</p>  
        <p type="p">V&lt;sub&gt;IN&lt;/sub&gt;:輸入電壓/輸入電壓匯流排</p>  
        <p type="p">V&lt;sub&gt;L&lt;/sub&gt;:電壓</p>  
        <p type="p">V&lt;sub&gt;OFFSET&lt;/sub&gt;:偏移電壓</p>  
        <p type="p">V&lt;sub&gt;OUT&lt;/sub&gt;:輸出電壓/輸出電壓匯流排</p>  
        <p type="p">V&lt;sub&gt;REF&lt;/sub&gt;:預定參考值</p>  
        <p type="p">△V&lt;sub&gt;ER1&lt;/sub&gt;:電壓降/第一偏移電壓</p>  
        <p type="p">△V&lt;sub&gt;ER2&lt;/sub&gt;:電壓降/第二偏移電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1039" publication-number="202614358"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614358.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614358</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116746</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">H01L21/768</main-classification>  
        <further-classification edition="200601120250801B">H01L23/52</further-classification>  
        <further-classification edition="202501120250801B">H10D30/01</further-classification>  
        <further-classification edition="202501120250801B">H10D30/60</further-classification>  
        <further-classification edition="200601120250801B">B82B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱韋臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, WEI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳佳典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIA-TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佳蓁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古舒云</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, SHU-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一個實施例中，方法可以包括在介電層中形成通孔，執行定向蝕刻製程以擴大通孔的一側，並且在定向蝕刻製程之後，在介電層中形成溝槽孔，其中溝槽孔位於通孔上方並與通孔空間連接，其中定向蝕刻創建具有從通孔中心測量的第一側寬度和第二側寬度不對稱的輪廓，第二側的寬度大於第一側的寬度。該方法還可以包括用導電材料填充通孔和溝槽孔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an embodiment, a method may include forming a via hole in a dielectric layer, performing a directional etching process to enlarge one side of the via hole, and after the directional etching process, forming a trench hole in the dielectric layer, where the trench hole is above and spatially connected with the via hole, where the directional etching creates an asymmetrical profile having a first side width and a second side width measured from a center of the via hole, the second side width being greater than the first side width. The method may further include filling the via hole and the trench hole with a conductive material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:互補場效電晶體</p>  
        <p type="p">10L:奈米結構場效電晶體</p>  
        <p type="p">10U:奈米結構場效電晶體</p>  
        <p type="p">26L:半導體奈米結構</p>  
        <p type="p">26U:半導體奈米結構</p>  
        <p type="p">62L:源極/汲極區</p>  
        <p type="p">62U:源極/汲極區</p>  
        <p type="p">78:閘極介電</p>  
        <p type="p">80L:閘電極</p>  
        <p type="p">80U:閘電極</p>  
        <p type="p">90:閘極堆疊/閘極結構</p>  
        <p type="p">A-A':橫截面/線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1040" publication-number="202614141"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614141.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614141</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116752</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具電漿限制的基板處理腔室</chinese-title>  
        <english-title>SUBSTRATE PROCESSING CHAMBER WITH PLASMA CONFINEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩羅德　尤甘南達比許瓦那</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SARODE, YOGANANDA VISHWANATH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫瑪　亞南德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, ANAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於處理腔室的電漿限制屏幕系統包括內部電漿屏幕，該內部電漿屏幕具有帶有中心開口的內部環形主體，該環形主體包含複數個第一開口；以及外部電漿屏幕，該外部電漿屏幕具有帶有中心開口的外部環形主體包圍該內部電漿屏幕，該外部環形主體包含複數個第二開口，其中該外部電漿屏幕被配置為相對於該內部電漿屏幕垂直移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A plasma confinement screen system for a process chamber includes an inner plasma screen having an inner annular body with a central opening, the annular body including a plurality of first openings; and an outer plasma screen having an outer annular body with a central opening surrounding the inner plasma screen, the outer annular body including a plurality of second openings, wherein the outer plasma screen is configured for vertical movement relative to the inner plasma screen.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:處理腔室</p>  
        <p type="p">102:腔室主體</p>  
        <p type="p">104:基板處理體積</p>  
        <p type="p">106:側壁</p>  
        <p type="p">108:蓋</p>  
        <p type="p">110:底座</p>  
        <p type="p">112:上支撐襯裡</p>  
        <p type="p">114:下襯裡</p>  
        <p type="p">116:排氣孔</p>  
        <p type="p">118:底盤</p>  
        <p type="p">120:排氣孔</p>  
        <p type="p">122:排氣孔</p>  
        <p type="p">124:支撐碗</p>  
        <p type="p">126:接地板</p>  
        <p type="p">128:絕緣板</p>  
        <p type="p">130:配件板</p>  
        <p type="p">132:基板支撐件</p>  
        <p type="p">134:基板支撐表面</p>  
        <p type="p">136:處理套組</p>  
        <p type="p">138:陰極套管</p>  
        <p type="p">140:電漿限制屏幕系統</p>  
        <p type="p">142:內部電漿屏幕</p>  
        <p type="p">144:外部電漿屏幕</p>  
        <p type="p">146:金屬帶</p>  
        <p type="p">148:致動器</p>  
        <p type="p">150:升舉銷</p>  
        <p type="p">152:孔</p>  
        <p type="p">154:孔</p>  
        <p type="p">210:內部安裝凸緣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1041" publication-number="202613370"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613370.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613370</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116754</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於調整紅外線傳輸的外殼和隔離板</chinese-title>  
        <english-title>ENVELOPE AND ISOLATION PLATE FOR IR TRANSMISSION ADJUSTMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">C30B25/08</main-classification>  
        <further-classification edition="200601120251216B">C30B25/10</further-classification>  
        <further-classification edition="200601120251216B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>叢　者澎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONG, ZHEPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盛濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENG, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　尼羅德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, NIMROD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚　班哲明伊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THAM, BENJAMIN EAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科森扎　格拉西亞瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COSENZA, GRACIA MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃克　尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WARKE, NEIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所提供的本揭露的實施例包括用於調諧半導體處理腔室內基板的熱剖面的裝置和方法。該基板處理腔室包括限定處理體積的上部主體、被配置為加熱處理體積的熱源、設置於處理體積內的基板外殼組件，以及設置於基板外殼組件內的基板支撐組件。該基板處理腔室亦可以包括設置在基板支撐組件上方並並耦接至上部主體的熱源、設置於基板支撐組件與熱源之間的隔離板組件，以及基板外殼組件。該基板處理系統亦可以包括預熱筒，該預熱筒包括具有一或多個入口開口的第一可更換部分以及具有一或多個出口開口的第二可更換部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the disclosure provided herein include an apparatus and method for tuning the thermal profile on a substrate in the semiconductor processing chamber. The substrate processing chamber includes an upper body defining a processing volume, a heat source configured to heat the processing volume, a substrate envelope assembly disposed within the processing volume, and a substrate support assembly disposed within the substrate envelope assembly. The substrate processing chamber may also include a heat source disposed above the substrate support assembly and coupled to the upper body, an isolation plate assembly disposed between the substrate support assembly and the heat source, and a substrate envelope assembly. The substrate processing system may also include a pre-heat cylinder, the pre-heat cylinder includes a first replaceable portion with one or more inlet openings and a second replaceable portion with one or more outlet openings.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:基板</p>  
        <p type="p">106:基板支撐組件</p>  
        <p type="p">107:穿孔</p>  
        <p type="p">108:上窗口</p>  
        <p type="p">110:下窗口</p>  
        <p type="p">111:隔離板</p>  
        <p type="p">112:流動模組</p>  
        <p type="p">116:氣體排氣出口</p>  
        <p type="p">118:軸</p>  
        <p type="p">120:控制器</p>  
        <p type="p">121:運動組件</p>  
        <p type="p">123:支撐面</p>  
        <p type="p">132:銷</p>  
        <p type="p">136a:下部分</p>  
        <p type="p">136b:上部分</p>  
        <p type="p">138:腔室體積</p>  
        <p type="p">141:上熱源</p>  
        <p type="p">143:下熱源</p>  
        <p type="p">145:熱源模組</p>  
        <p type="p">148:主體</p>  
        <p type="p">151:處理氣體源</p>  
        <p type="p">152:地板</p>  
        <p type="p">153:清潔氣體源</p>  
        <p type="p">155:上部熱源模組</p>  
        <p type="p">156:上部主體</p>  
        <p type="p">157:排氣泵</p>  
        <p type="p">162:淨化氣體源</p>  
        <p type="p">164:淨化氣體入口</p>  
        <p type="p">178:排氣系統</p>  
        <p type="p">302:預熱環</p>  
        <p type="p">304:停止器</p>  
        <p type="p">305a:臂</p>  
        <p type="p">305b:臂</p>  
        <p type="p">311:襯墊</p>  
        <p type="p">1000:處理腔室</p>  
        <p type="p">1010:處理套組</p>  
        <p type="p">1012:第一外面</p>  
        <p type="p">1013:第二外面</p>  
        <p type="p">1014:第一入口開口</p>  
        <p type="p">1015:第二入口開口</p>  
        <p type="p">1020:上襯墊</p>  
        <p type="p">1021:環形區段</p>  
        <p type="p">1023:入口開口</p>  
        <p type="p">1024:內表面</p>  
        <p type="p">1025:出口開口</p>  
        <p type="p">1026:外表面</p>  
        <p type="p">1027:第一延伸部</p>  
        <p type="p">1028:第二延伸部</p>  
        <p type="p">1029:下表面</p>  
        <p type="p">P1:處理氣體</p>  
        <p type="p">P2:淨化氣體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1042" publication-number="202613456"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613456.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613456</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116779</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加濕器、空氣調節裝置及流路構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251223B">F24F1/0087</main-classification>  
        <further-classification edition="200601120251223B">F24F13/02</further-classification>  
        <further-classification edition="200601120251223B">F24F6/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商伸和控制工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINWA CONTROLS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青木公一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, KOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 精度良好地控制空氣的濕度。 &lt;br/&gt;　　[解決手段] 一實施形態之加濕器(20)，係具備有：加濕器本體(21)，供給蒸氣；及流路構件(22)。流路構件(22)，係具有：接收口(22a)，接收來自加濕器本體(21)的蒸氣；入口(22b)，接收空氣；及出口(22c)，使在入口(22b)接收到的空氣流出。從入口(22b)延伸至出口(22c)之流路構件(22)的壁部(23)，係形成從入口(22b)流動至出口(22c)之空氣的流路。接收口(22a)，係定位成在流路中之比出口(22c)更上游側的位置，將蒸氣供給至空氣。而且，在壁部(23)，係至少部分地形成有流路剖面積朝向出口(22c)逐漸減小的錐狀部分(23t)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:空氣調節裝置</p>  
        <p type="p">10:調溫模組</p>  
        <p type="p">11:導風管道部</p>  
        <p type="p">11A:導入口</p>  
        <p type="p">11B:送出口</p>  
        <p type="p">13:加熱部</p>  
        <p type="p">20:加濕器</p>  
        <p type="p">21:加濕器本體</p>  
        <p type="p">21A:槽</p>  
        <p type="p">21A1:放出部</p>  
        <p type="p">21B:加熱器部</p>  
        <p type="p">22:流路構件</p>  
        <p type="p">22a:接收口</p>  
        <p type="p">22b:入口</p>  
        <p type="p">22c:出口</p>  
        <p type="p">23:壁部</p>  
        <p type="p">23t:錐狀部分</p>  
        <p type="p">24:側壁部</p>  
        <p type="p">26:終端壁部</p>  
        <p type="p">27:凸緣部</p>  
        <p type="p">28:分隔板</p>  
        <p type="p">30:送風機</p>  
        <p type="p">50:框架</p>  
        <p type="p">60:連接管</p>  
        <p type="p">70:蓋材</p>  
        <p type="p">H1:第1水平方向</p>  
        <p type="p">H2:第2水平方向</p>  
        <p type="p">UD:上下方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1043" publication-number="202614814"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614814.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614814</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116831</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置與其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251001B">H10D30/60</main-classification>  
        <further-classification edition="202501120251001B">H10D64/01</further-classification>  
        <further-classification edition="202501120251001B">H10D64/23</further-classification>  
        <further-classification edition="200601120251001B">H01L21/60</further-classification>  
        <further-classification edition="200601120251001B">H01L21/762</further-classification>  
        <further-classification edition="200601120251001B">B82B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃少澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHAO-TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何韋德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, WEI-DE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪昕揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, HSIN YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, RUI-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤韋翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, WEI-XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置及形成方法。半導體裝置包括：隔離區域；第一介電層，位於隔離區域上方；第二介電層，位於第一介電層上方；第一源極/汲極區域，位於第二介電層中；第一奈米結構，位於第一源極/汲極區域的側壁上；第一閘電極，位於第一奈米結構周圍；第一源極/汲極觸點，位於第一源極/汲極區域上方且電連接第一源極/汲極區域；導電特徵，位於第一介電層及隔離區域中；以及介電特徵，位於導電特徵上方及第二介電層中。第一源極/汲極觸點的第一部分可位於介電特徵的兩個內側壁之間，且第一源極/汲極觸點的第一部分可電連接至導電特徵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device and the method of forming the same are provided. The semiconductor device may include an isolation region, a first dielectric layer over the isolation region, a second dielectric layer over the first dielectric layer, a first source/drain region in the second dielectric layer, a first nanostructure on a sidewall of the first source/drain region, a first gate electrode around the first nanostructure, a first source/drain contact over the first source/drain region electrically connected to the first source/drain region, a conductive feature in the first dielectric layer and the isolation region, and a dielectric feature over the conductive feature and in the second dielectric layer. A first portion of the first source/drain contact may be between two inner sidewalls of the dielectric feature, and the first portion of the first source/drain contact may be electrically connected to the conductive feature.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:基板</p>  
        <p type="p">34:STI區域</p>  
        <p type="p">44:閘極間隔物</p>  
        <p type="p">66:第一CESL</p>  
        <p type="p">68:第一ILD</p>  
        <p type="p">70:第二CESL</p>  
        <p type="p">72:第二ILD</p>  
        <p type="p">78:閘極介電層</p>  
        <p type="p">80:閘電極</p>  
        <p type="p">90:閘極結構</p>  
        <p type="p">122,128,136:襯墊</p>  
        <p type="p">124:垂直互連</p>  
        <p type="p">130:介電特徵</p>  
        <p type="p">137:金屬層</p>  
        <p type="p">140B:源極/汲極觸點</p>  
        <p type="p">142:導電特徵</p>  
        <p type="p">150:堆疊電晶體</p>  
        <p type="p">H1,H2:高度</p>  
        <p type="p">W1,W2:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1044" publication-number="202614749"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614749.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614749</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116838</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及半導體結構</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251216B">H10B12/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江宏禮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, HUNG-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉拉迪　卡羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GILARDI, CARLO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉杜　安娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RADU, IULIANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RO</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容的一個態樣涉及一種裝置。該裝置包括串聯耦合的第一電晶體及第二電晶體；串聯耦合的第三電晶體及第四電晶體；及第五電晶體，該第五電晶體的第一端分別耦合至該第一電晶體的第一端及該第二電晶體的第一端，且該第五電晶體的控制端在儲存節點處耦合至該第二電晶體的第二端。該第四電晶體的控制端耦合至該儲存節點，且該第一至第五電晶體中的至少一者位於該第一至第五電晶體中的另一者上方的層中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One aspect of the present disclosure pertains to a device. The device includes a first transistor and a second transistor coupled in series; a third transistor and a fourth transistor coupled in series; and a fifth transistor, a first terminal of the fifth transistor being coupled to each of a first terminal of the first transistor and a first terminal of the second transistor, and a control terminal of the fifth transistor being coupled to a second terminal of the second transistor at a storage node. A control terminal of the fourth transistor is coupled to the storage node, and at least one of the first to fifth transistors is located in a layer above another one of the first to fifth transistors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">RBL:讀取位元線</p>  
        <p type="p">RWL:讀取字元線</p>  
        <p type="p">SN:儲存節點</p>  
        <p type="p">TN1:第一寫入電晶體</p>  
        <p type="p">TN2:第二寫入電晶體</p>  
        <p type="p">TN3:BEOL回饋電晶體</p>  
        <p type="p">TP1:第一讀取電晶體</p>  
        <p type="p">TP2:第二讀取電晶體</p>  
        <p type="p">VDD:訊號線</p>  
        <p type="p">WBL:讀取字元線</p>  
        <p type="p">WWL:寫入字元線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1045" publication-number="202614543"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614543.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614543</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116861</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造設備用的電壓控制</chinese-title>  
        <english-title>VOLTAGE CONTROL FOR SEMICONDUCTOR FABRICATION EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200701120260102B">H02M1/00</main-classification>  
        <further-classification edition="200601120260102B">H02M1/08</further-classification>  
        <further-classification edition="200601120260102B">H02M3/157</further-classification>  
        <further-classification edition="200601120260102B">H02M7/219</further-classification>  
        <further-classification edition="200601120260102B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬漢　尼桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOUHAN, NISHANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古德　葛列格里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOULD, GREGORY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示用於半導體製造設備的電壓控制之技術、系統與設備。在一些實施例中，用於提供輸入電壓到至少一處理站之轉換器被提供。轉換器可包含第一開關，操作地耦接至 DC 的正軌，以及第二開關，操作地耦接至 DC 的負軌，各自配置以接收輸入 DC 電壓。轉換器可更包含控制器，配置以提供工作週期至第一開關與第二開關，以使提供至正軌的輸出電壓與提供至負軌的輸出電壓，各自相對於接地少於預定電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are techniques, systems, and apparatuses for voltage control of semiconductor fabrication apparatuses. In some embodiments, a converter for providing input voltage to at least one process station is provided. The converter may comprise a first switch operatively coupled to a positive rail of DC and a second switch operatively coupled to a negative rail of DC, each configured to receive an input DC voltage. The converter may further comprise a controller configured to provide a duty cycle to the first switch and the second switch such that the output voltage provided to the positive rail and the output voltage provided to the negative rail are each less than a predetermined voltage with respect to ground.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">302:輸入電壓源</p>  
        <p type="p">304:三相整流器電路</p>  
        <p type="p">305:降壓轉換器電路</p>  
        <p type="p">306:第一開關電路</p>  
        <p type="p">308:第一開關</p>  
        <p type="p">310:第二開關電路</p>  
        <p type="p">312:第二開關</p>  
        <p type="p">314:控制器</p>  
        <p type="p">316:電感器</p>  
        <p type="p">318:電感器</p>  
        <p type="p">320:電容器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1046" publication-number="202612949"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612949.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612949</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116922</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送車</chinese-title>  
        <english-title>TRANSPORT VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B61B13/00</main-classification>  
        <further-classification edition="200601120251229B">B62D61/10</further-classification>  
        <further-classification edition="200601120251229B">B62D7/20</further-classification>  
        <further-classification edition="200601120251229B">B60B33/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉永和治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINAGA, KAZUHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高木大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAGI, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在搬送車中，複數個車輪2包含藉由驅動源D所驅動的至少1個驅動輪21，車體框架1具備在前後方向Y上排列配置的第1框架部11及第2框架部12，前述搬送車具備：第1連結部5，將第1框架部11與第2框架部12繞著沿寬度方向X的第1擺動軸心A1擺動自如地連結；第2連結部6，將第1框架部11與支撐框架3繞著沿寬度方向X的第2擺動軸心A2擺動自如地連結；及第3連結部7，將第2框架部12與支撐框架3繞著沿寬度方向X的第3擺動軸心A3擺動自如且在前後方向Y上滑動自如地連結，控制單元是透過支撐框架3而被車體框架1所支撐。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:車體框架</p>  
        <p type="p">2:車輪</p>  
        <p type="p">3:支撐框架</p>  
        <p type="p">5:第1連結部</p>  
        <p type="p">6:第2連結部</p>  
        <p type="p">7:第3連結部</p>  
        <p type="p">10:讀取裝置</p>  
        <p type="p">11:第1框架部</p>  
        <p type="p">12:第2框架部</p>  
        <p type="p">21:驅動輪</p>  
        <p type="p">22:第1從動輪</p>  
        <p type="p">23:第2從動輪</p>  
        <p type="p">25:第1安裝構件</p>  
        <p type="p">27:第2安裝構件</p>  
        <p type="p">31:第1支柱</p>  
        <p type="p">32:第2支柱</p>  
        <p type="p">51:第1連結要件</p>  
        <p type="p">52:第2連結要件</p>  
        <p type="p">53:第1連接構件</p>  
        <p type="p">54:第2連接構件</p>  
        <p type="p">111:第1底板部</p>  
        <p type="p">112:第1側板部</p>  
        <p type="p">113:第1短面部</p>  
        <p type="p">114:第1長面部</p>  
        <p type="p">121:第2底板部</p>  
        <p type="p">122:第2側板部</p>  
        <p type="p">123:第2短面部</p>  
        <p type="p">124:第2長面部</p>  
        <p type="p">312:第1下柱部</p>  
        <p type="p">313:第1載置部</p>  
        <p type="p">322:第2下柱部</p>  
        <p type="p">323:第2載置部</p>  
        <p type="p">A1:第1擺動軸心</p>  
        <p type="p">A2:第2擺動軸心</p>  
        <p type="p">A3:第3擺動軸心</p>  
        <p type="p">Ad:驅動軸心</p>  
        <p type="p">D:驅動源</p>  
        <p type="p">E:車載機器</p>  
        <p type="p">X:寬度方向</p>  
        <p type="p">Y:前後方向</p>  
        <p type="p">Y1:前側</p>  
        <p type="p">Y2:後側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1047" publication-number="202612950"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612950.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612950</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116923</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送車</chinese-title>  
        <english-title>TRANSPORT VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B61B13/00</main-classification>  
        <further-classification edition="200601120251229B">B62D61/10</further-classification>  
        <further-classification edition="200601120251229B">B62D7/20</further-classification>  
        <further-classification edition="200601120251229B">B60B33/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高木大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAGI, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">搬送車具備：車體框架1；及複數個車輪2，被該車體框架1所支撐。複數個車輪2包含藉由驅動源D所驅動的至少1個驅動輪21，車體框架1具備在前後方向Y上排列配置的第1框架部11及第2框架部12，搬送車具備連結部5，前述連結部5將第1框架部11與第2框架部12繞著沿寬度方向X的擺動軸心A1擺動自如地連結，第1框架部11及第2框架部12的每一個具備：底板部111、121，呈平板狀；及側板部112、122，從前述底板部111、121的外緣朝上側豎立設置，前述第1框架部11及前述第2框架部12的每一個是形成為上表面開放的箱狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:車體框架</p>  
        <p type="p">2:車輪</p>  
        <p type="p">2A:第1側邊輪</p>  
        <p type="p">2B:第2側邊輪</p>  
        <p type="p">3:支撐框架</p>  
        <p type="p">5:第1連結部</p>  
        <p type="p">6:第2連結部</p>  
        <p type="p">7:第3連結部</p>  
        <p type="p">10:讀取裝置</p>  
        <p type="p">11:第1框架部</p>  
        <p type="p">12:第2框架部</p>  
        <p type="p">21:驅動輪</p>  
        <p type="p">22:第1從動輪</p>  
        <p type="p">23:第2從動輪</p>  
        <p type="p">25:第1安裝構件</p>  
        <p type="p">27:第2安裝構件</p>  
        <p type="p">31:第1支柱</p>  
        <p type="p">32:第2支柱</p>  
        <p type="p">51:第1連結要件</p>  
        <p type="p">52:第2連結要件</p>  
        <p type="p">53:第1連接構件</p>  
        <p type="p">54:第2連接構件</p>  
        <p type="p">111:第1底板部</p>  
        <p type="p">112:第1側板部</p>  
        <p type="p">113:第1短面部</p>  
        <p type="p">114:第1長面部</p>  
        <p type="p">121:第2底板部</p>  
        <p type="p">122:第2側板部</p>  
        <p type="p">123:第2短面部</p>  
        <p type="p">124:第2長面部</p>  
        <p type="p">312:第1下柱部</p>  
        <p type="p">313:第1載置部</p>  
        <p type="p">322:第2下柱部</p>  
        <p type="p">323:第2載置部</p>  
        <p type="p">A1:第1擺動軸心</p>  
        <p type="p">A2:第2擺動軸心</p>  
        <p type="p">A3:第3擺動軸心</p>  
        <p type="p">Ad:驅動軸心</p>  
        <p type="p">D:驅動源</p>  
        <p type="p">E:車載機器</p>  
        <p type="p">F1:第1相向部</p>  
        <p type="p">F2:第2相向部</p>  
        <p type="p">F3:第3相向部</p>  
        <p type="p">F4:第4相向部</p>  
        <p type="p">X:寬度方向</p>  
        <p type="p">Y:前後方向</p>  
        <p type="p">Y1:前側</p>  
        <p type="p">Y2:後側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1048" publication-number="202613704"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613704.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613704</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116926</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反射型光罩基底、反射型光罩、反射型光罩之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251219B">G03F1/24</main-classification>  
        <further-classification edition="201201120251219B">G03F1/40</further-classification>  
        <further-classification edition="200601120251219B">C23C14/06</further-classification>  
        <further-classification edition="200601120251219B">C23C14/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>筆谷大河</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUDETANI, TAIGA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種反射型光罩基底，其易於檢查導電膜表面之異物，且易於讀取將多層反射膜去除而形成之識別標記。 &lt;br/&gt;一種反射型光罩基底，其具有：基板；導電膜，其配置於基板之一面側；多層反射膜，其配置於上述基板之另一面側且反射EUV光；及吸收體膜，其配置於上述多層反射膜之與上述基板側相反之側；而且上述基板之主成分為SiO&lt;sub&gt;2&lt;/sub&gt;；上述導電膜之膜厚為50～100 nm；上述導電膜於波長400 nm、波長450 nm、及波長500 nm下滿足規定之式(1)～式(3)之關係。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:反射型光罩基底</p>  
        <p type="p">12:基板</p>  
        <p type="p">14:多層反射膜</p>  
        <p type="p">16:多層反射膜保護膜</p>  
        <p type="p">18:吸收體膜</p>  
        <p type="p">22:導電膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1049" publication-number="202614367"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614367.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614367</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114116965</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝及封裝之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H01L23/02</main-classification>  
        <further-classification edition="200601120251217B">H01L23/28</further-classification>  
        <further-classification edition="200601120251217B">H01L23/488</further-classification>  
        <further-classification edition="200601120251217B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索尼半導體解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>合庭健介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIBA, KENSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本技術之目的在於可一面抑制施加於晶片之應力，一面將晶片安裝於封裝。 &lt;br/&gt;封裝具備：晶片；基板，其安裝有晶片；蓋，其以與晶片分開之方式位於晶片上；及密封材，其以與晶片分開之方式位於基板上，支持蓋。蓋亦可為透明構件。亦可進而具備支持蓋之肋部。肋部與密封材亦可分開。蓋亦可配置於密封材之內側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:封裝</p>  
        <p type="p">111:晶片</p>  
        <p type="p">112:受光區域</p>  
        <p type="p">113:焊墊電極</p>  
        <p type="p">114:彩色濾光片</p>  
        <p type="p">115:晶載透鏡</p>  
        <p type="p">116:接合線</p>  
        <p type="p">121:安裝基板</p>  
        <p type="p">122:接合焊墊</p>  
        <p type="p">123:焊盤電極</p>  
        <p type="p">124:肋部</p>  
        <p type="p">125:密封材</p>  
        <p type="p">126:密封材</p>  
        <p type="p">127:透明基板</p>  
        <p type="p">128:晶片接合材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1050" publication-number="202614750"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614750.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614750</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117002</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251229B">H10B12/00</main-classification>  
        <further-classification edition="202301120251229B">H10N97/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔慈允</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JA YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JI EUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴晙晳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JOON SUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林漢鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, HAN JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全寅鐸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, IN TAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種半導體記憶體裝置。半導體記憶體裝置可包括彼此間隔開的第一電極和第二電極、第一電極和第二電極之間的介電膜結構、第一電極和介電膜結構之間的第一界面膜、以及第二電極和介電膜結構之間的第二界面膜。介電膜結構可包括在第一界面膜上依序堆疊的第一介電膜和第二介電膜。第一介電膜可包括具有大於20的第一介電常數的氧化物，包括於第一介電膜的氧化物為鈦（Ti）或鍶（Sr）中至少一種的氧化物。第二介電膜可包括具有比第一介電常數小至少20的第二介電常數的材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor memory device is provided. The semiconductor memory device may include a first electrode and a second electrode spaced apart from each other, a dielectric film structure between the first electrode and the second electrode, a first interfacial film between the first electrode and the dielectric film structure, and a second interfacial film between the second electrode and the dielectric film structure. The dielectric film structure may include a first dielectric film and a second dielectric film sequentially stacked on the first interfacial film. The first dielectric film may include an oxide of at least one of titanium (Ti) or strontium (Sr) having a first dielectric constant greater than 20. The second dielectric film may include a material having a second dielectric constant that is smaller than the first dielectric constant by at least 20.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301:下部電極</p>  
        <p type="p">302:上部電極</p>  
        <p type="p">400:介電膜結構</p>  
        <p type="p">501:下部界面膜</p>  
        <p type="p">502:上部界面膜</p>  
        <p type="p">601:第一介電膜</p>  
        <p type="p">602:第二介電膜</p>  
        <p type="p">D1、D2:厚度</p>  
        <p type="p">DR1:第一方向</p>  
        <p type="p">DR2:第二方向</p>  
        <p type="p">DR4:第四方向</p>  
        <p type="p">P:部分</p>  
        <p type="p">T1、T2:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1051" publication-number="202614875"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614875.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614875</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117093</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝及封裝之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251226B">H10F39/12</main-classification>  
        <further-classification edition="200601120251226B">H01L23/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索尼半導體解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栫山直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAKOIYAMA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提昇將透明構件支持於晶片上之肋與密封材之接合強度。 &lt;br/&gt;封裝具備：晶片；透明構件，其與晶片隔開地位於晶片上；及肋，其位於透明構件之下端至側面，於晶片上支持透明構件。亦可進而具備：基板，其安裝有晶片；及密封材，其於基板上位於晶片之周圍。密封材之材料可為鑄模材。透明構件之平面尺寸可小於晶片之平面尺寸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:封裝</p>  
        <p type="p">111:晶片</p>  
        <p type="p">112:受光區域</p>  
        <p type="p">113:焊墊電極</p>  
        <p type="p">114:彩色濾光片</p>  
        <p type="p">115:晶載透鏡</p>  
        <p type="p">116:接合線</p>  
        <p type="p">120:安裝基板</p>  
        <p type="p">121:配線</p>  
        <p type="p">122:接合墊</p>  
        <p type="p">123:焊盤電極</p>  
        <p type="p">124:肋</p>  
        <p type="p">125:密封材</p>  
        <p type="p">126:透明基板</p>  
        <p type="p">127:黏晶材</p>  
        <p type="p">128:焊球</p>  
        <p type="p">D1:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1052" publication-number="202614126"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614126.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614126</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117098</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於在裝置製造期間非接觸式量測裝置信號傳播延遲之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR CONTACTLESS MEASUREMENT OF DEVICE SIGNAL PROPAGATION DELAY DURING DEVICE FABRICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01J37/26</main-classification>  
        <further-classification edition="201801120260102B">G01N23/2251</further-classification>  
        <further-classification edition="200601120260102B">G01R31/303</further-classification>  
        <further-classification edition="200601120260102B">G01R31/307</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佳明　馬蒂斯　沃特　亨克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARMING, MATHIJS WOUTER HENK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高里　貝諾特　赫爾維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAURY, BENOIT HERVE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>休斯曼　湯瑪士　賈力克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUISMAN, THOMAS JARIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露用於暫態檢測電晶體之系統及方法。系統及方法包括：將一帶電或非帶電粒子射束提供至以通信方式耦接至一電容器之一第一襯墊，以將一供應電壓提供至該電容器及一反相器鏈；運用該射束掃描一第二襯墊；運用該射束掃描一第三襯墊；及基於根據該第二襯墊及該第三襯墊之該掃描偵測到之信號來判定一時間延遲，其中該第二襯墊及該第三襯墊以通信方式耦接至該反相器鏈之至少一個反相器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods for transiently inspecting transistors. Systems and methods include providing a beam of charged or non-charged particles to a first pad communicatively coupled to a capacitor to provide a supply voltage to the capacitor and an inverter chain; scanning a second pad with the beam; scanning a third pad with the beam; and determining a time delay based on detected signals from the scanning of the second and third pads, wherein the second and third pads are communicatively coupled to at least one inverter of the inverter chain.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1100:程序</p>  
        <p type="p">1102:步驟</p>  
        <p type="p">1104:步驟</p>  
        <p type="p">1106:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1053" publication-number="202614365"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614365.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614365</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117138</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有不同類型記憶體的層疊封裝</chinese-title>  
        <english-title>PACKAGE-ON-PACKAGE WITH DIFFERENT TYPES OF MEMORY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L23/00</main-classification>  
        <further-classification edition="200601120260102B">H01L23/367</further-classification>  
        <further-classification edition="200601120260102B">H01L23/498</further-classification>  
        <further-classification edition="200601120260102B">H01L23/538</further-classification>  
        <further-classification edition="202301120260102B">H01L25/16</further-classification>  
        <further-classification edition="202301120260102B">H01L25/18</further-classification>  
        <further-classification edition="202501120260102B">H10D80/00</further-classification>  
        <further-classification edition="202501120260102B">H10D80/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古普達　皮義許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUPTA, PIYUSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德利夫　波里斯迪米托夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDREEV, BORIS DIMITROV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯里尼瓦斯　瓦希納夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRINIVAS, VAISHNAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕拉恰拉　薩巴羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PALACHARLA, SUBBARAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴特　吉里許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHAT, GIRISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">各種實施例可包括一層疊封裝(PoP)，該層疊封裝具有：包含一系統單晶片(SoC)及一底部基材的一底部封裝；包含一頂部基材、一第一記憶體晶粒、及一第二記憶體晶粒的一頂部封裝，其中該第一及第二記憶體晶粒在以下至少一個方面不同：記憶體類型、記憶體密度、或記憶體容量；電子地連接該頂部封裝及該底部封裝的一中介層；及覆蓋該頂部封裝之至少一部份的一散熱器。該SoC可包括一非均勻記憶體存取(NUMA)機制，該機制經組態以橫跨該第一及第二記憶體晶粒管理資料交錯、記憶體寫入請求、記憶體存取請求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various embodiments may include a Package on Package (PoP) having a bottom package comprising a system-on-chip (SoC) and a bottom substrate, a top package comprising a top substrate, a first memory die, and a second memory die, wherein the first and second memory dies are different in at least one of: memory type, memory density, or memory capacity, an interposer electronically connecting the top package and the bottom package, and a heat sink covering at least a portion of the top package. The SoC may include a non-uniform memory access (NUMA) mechanism configured to manage data interleaving, memory write requests, memory access requests across the first and second memory dies.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:封裝</p>  
        <p type="p">101,107:記憶體裝置</p>  
        <p type="p">102,104:基材</p>  
        <p type="p">103:整合裝置</p>  
        <p type="p">105:散熱器</p>  
        <p type="p">106,110,111,132,170:焊料互連件</p>  
        <p type="p">108:囊封層</p>  
        <p type="p">109:板</p>  
        <p type="p">120,140:介電層</p>  
        <p type="p">122,142,144:互連件</p>  
        <p type="p">126,146:阻焊層</p>  
        <p type="p">130:柱互連件</p>  
        <p type="p">180:高介電常數底部填充物；高K UF；底部填充物</p>  
        <p type="p">190:板介電層</p>  
        <p type="p">192:板互連件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1054" publication-number="202613544"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613544.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613544</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117154</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>流體特性之測量</chinese-title>  
        <english-title>MEASUREMENT OF CHARACTERISTICS OF A FLUID</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G01N27/07</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商喬治費雪圖章有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEORG FISCHER SIGNET LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬巴努　克林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CIOBANU, CALIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛米堡　傑佛瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOMIBAO, JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　俊暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福特　傑洛米</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORD, JEROME BRENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於測量流體之特性的方法及設備，其使用連接至由外電極包圍的接觸導電率感測器之中央電極的積分器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and apparatus for measuring characteristics of the fluid using an integrator connected to a central electrode of a contacting conductivity sensor surrounded by an outer electrode.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1055" publication-number="202613575"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613575.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613575</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117155</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電性連接裝置，ＧＮＤ端子接觸構件及殼體構件</chinese-title>  
        <english-title>ELECTRICAL CONNECTING APPARATUS, GND TERMINAL CONTACTING COMPONENT AND HOUSING COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251216B">G01R31/26</main-classification>  
        <further-classification edition="200601120251216B">H01L23/32</further-classification>  
        <further-classification edition="200601120251216B">H01R4/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本麥克隆尼股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>工藤敬祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDO, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題是以簡單的作業來使保持殼裝的GND連接端子構件並防止其脫落。 &lt;br/&gt;　　其解決手段，本發明的電性連接裝置具備： &lt;br/&gt;　　GND連接端子構件，其接觸被檢查體的接地端子而電性連接；及 &lt;br/&gt;　　殼體構件，其在一方的側暫時配置被檢查體，從另一方的側容納並保持GND連接端子構件，而經由開口部來使被檢查體的接地端子與GND連接端子構件的接觸成為可能， &lt;br/&gt;　　殼體構件具有被嵌合部， &lt;br/&gt;　　GND連接端子構件具有嵌合部，前述嵌合部是在GND連接端子構件的本體部從殼體構件的另一方的側插入殼體構件的開口部之後，與殼體構件的被嵌合部嵌合， &lt;br/&gt;　　並且嵌合部具有藉由變形來與被嵌合部嵌合的變形止擋部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電性連接裝置</p>  
        <p type="p">2:GND端子接觸構件</p>  
        <p type="p">14:開口部</p>  
        <p type="p">30:殼體構件</p>  
        <p type="p">60:基座</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1056" publication-number="202613212"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613212.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613212</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117171</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬化性聚有機矽氧烷組成物、其用途，及含有苯并咪唑啉二酮部分之水解性矽烷化合物</chinese-title>  
        <english-title>CURABLE POLYORGANOSILOXANE COMPOSITION, ITS USES, AND HYDROLYZABLE SILANE COMPOUND CONTAINING BENZIMIDAZOLIDINONE MOIETY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">C08G77/48</main-classification>  
        <further-classification edition="200601120251216B">A61K31/4184</further-classification>  
        <further-classification edition="200601120251216B">C07F7/28</further-classification>  
        <further-classification edition="200601120251216B">G03F7/004</further-classification>  
        <further-classification edition="200601120251216B">C08L83/14</further-classification>  
        <further-classification edition="200601120251216B">C09D183/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商邁圖高新材料日本合同公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小野和久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO, KAZUHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷川英二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIGAWA, EIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種防蝕性優異，且均一性優異之硬化性聚矽氧組成物、及一種可對硬化性聚矽氧組成物賦予優異之防蝕性及均一性之化合物，又，本發明係關於一種硬化性聚有機矽氧烷組成物，其包含：(A)在一分子中具有2個以上鍵結於矽原子之水解性基之聚有機矽氧烷、(B)硬化觸媒、以及(C)在一分子中包含苯并咪唑啉二酮部分及鍵結於矽原子之水解性基的化合物；及上述成分(C)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a curable silicone composition that exhibits excellent corrosion resistance and uniformity, and a compound that can impart excellent corrosion resistance and uniformity to the curable silicone composition. Further, the present invention is related to a curable polyorganosiloxane composition comprising (A) a polyorganosiloxane having two or more silicon-bonded hydrolyzable groups in one molecule, (B) a curing catalyst, and (C) a compound that contains a benzimidazolidinone moiety and a silicon-bonded hydrolyzable group in one molecule, and related to component (C).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1057" publication-number="202614391"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614391.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614391</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117224</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝結構及其形成方法</chinese-title>  
        <english-title>PACKAGING STRUCTURE AND FORMING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250916B">H01L23/31</main-classification>  
        <further-classification edition="200601120250916B">H01L23/535</further-classification>  
        <further-classification edition="200601120250916B">H01L23/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李怡蓁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YI-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張任遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JEN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">封裝結構包括彼此堆疊的第一晶粒和第二晶粒，第一晶粒的第一表面面向第二晶粒的第二表面。第一晶粒包括ESD保護裝置。ESD保護裝置包括與第一晶粒的第一表面相鄰的導電圖案以及連接到導電圖案並朝第一晶粒的第一半導體基板延伸的互連結構，並且第一晶粒的第一半導體基板與第一晶粒的第一表面相對。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package includes a first die and a second die stacked vertically over one another. A first surface of the first die facing a second surface of the second die. The first die includes an ESD protection device. The ESD protection device includes a conductive pattern adjacent to the first surface of the first die and an interconnect structure connected to the conductive pattern and extending toward a first semiconductor substrate of the first die that is opposite to the first surface of the first die.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體晶粒/晶粒</p>  
        <p type="p">108:第一半導體基板/基板</p>  
        <p type="p">109:表面/界面</p>  
        <p type="p">110:BEOL結構</p>  
        <p type="p">111:第一裝置層</p>  
        <p type="p">112:ILD</p>  
        <p type="p">114:IMD層</p>  
        <p type="p">114A,114B,114C,114D,114E:IMD層</p>  
        <p type="p">116:金屬特徵</p>  
        <p type="p">118:鈍化層</p>  
        <p type="p">120:ESD保護裝置</p>  
        <p type="p">122:導電圖案</p>  
        <p type="p">124:互連結構</p>  
        <p type="p">126:導電墊結構/導線</p>  
        <p type="p">128:通孔結構</p>  
        <p type="p">150:TSV結構/接合層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1058" publication-number="202614793"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614793.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614793</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117241</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及製造半導體結構的方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251226B">H10D30/01</main-classification>  
        <further-classification edition="202501120251226B">H10D30/62</further-classification>  
        <further-classification edition="200601120251226B">H01L21/302</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃玉蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-LIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳筠樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUN-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃淵聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YUAN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧永誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YUNG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了一種半導體結構及一種製造半導體結構的方法。一種方法包括：在基板上形成半導體奈米片堆疊；形成鄰近堆疊的源極/汲極特徵；蝕刻源極/汲極特徵的一部分以形成一溝槽，其中溝槽延伸至堆疊中之最低半導體奈米片的最低表面處或其下方的水平面；及在溝槽中形成該源極/汲極特徵的導電接點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are semiconductor structures and methods for fabricating semiconductor structures. A method includes forming a stack of semiconductor nanosheets over a substrate; forming a source/drain feature adjacent to the stack; etching a portion of the source/drain feature to form a trench, wherein the trench extends to a horizontal plane at or below a lowest surface of a lowest semiconductor nanosheet in the stack; and forming a conductive contact to the source/drain feature in the trench.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:方法</p>  
        <p type="p">S1010:操作</p>  
        <p type="p">S1020:操作</p>  
        <p type="p">S1030:操作</p>  
        <p type="p">S1040:操作</p>  
        <p type="p">S1050:操作</p>  
        <p type="p">S1060:操作</p>  
        <p type="p">S1070:操作</p>  
        <p type="p">S1080:操作</p>  
        <p type="p">S1090:操作</p>  
        <p type="p">S1110:操作</p>  
        <p type="p">S1120:操作</p>  
        <p type="p">S1130:操作</p>  
        <p type="p">S1140:操作</p>  
        <p type="p">S1150:操作</p>  
        <p type="p">S1160:操作</p>  
        <p type="p">S1170:操作</p>  
        <p type="p">S1171:操作</p>  
        <p type="p">S1172:操作</p>  
        <p type="p">S1173:操作</p>  
        <p type="p">S1180:操作</p>  
        <p type="p">S1190:操作</p>  
        <p type="p">S1200:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1059" publication-number="202614819"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614819.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614819</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117269</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHODS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251118B">H10D30/62</main-classification>  
        <further-classification edition="202501120251118B">H10D64/20</further-classification>  
        <further-classification edition="200601120251118B">B82B3/00</further-classification>  
        <further-classification edition="201101120251118B">B82Y10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃咸誌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HSIEN-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, GUAN-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江國誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, KUO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIH-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林瑋萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一半導體裝置包括位於基板上的多個奈米片、與奈米片相鄰的源極/汲極特徵，以及位於奈米片上方並位於相鄰奈米片之間的閘極結構。閘極間隔物設置在閘極結構頂部部分兩側的對立邊緣上。內部間隔物在第一方向上夾設於相鄰奈米片的側邊端之間，並在第二方向上夾設於閘極結構和源極/汲極特徵之間。每個內部間隔物包括一核心層，並在核心層的上下表面上設有一襯墊層。在第三方向上，奈米片在介面處的一維度有一偏移量，該介面位於閘極間隔物下方的奈米片部分與閘極結構頂部下方的奈米片部分之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device includes a plurality of nanosheets over a substrate, a source/drain feature adjacent to the plurality of nanosheets, and a gate structure disposed over the plurality of nanosheets and between adjacent nanosheets. Gate spacers are disposed over sidewalls of opposing sides of a top portion of the gate structure. Inner spacers interpose lateral ends of adjacent ones of the plurality of nanosheets in a first direction and interpose portions of the gate structure and the source/drain feature in a second direction. Each of the inner spacers includes a core layer and a liner layer disposed on a top and bottom surfaces of the core layer. There is an offset of a dimension of the plurality of nanosheets in a third direction at an interface between portions of the nanosheets underneath the gate spacers and portions of the nanosheets underneath the top portion of the gate structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1200:半導體裝置</p>  
        <p type="p">304:基板</p>  
        <p type="p">310:磊晶層</p>  
        <p type="p">328:間隔層</p>  
        <p type="p">502:表面薄膜</p>  
        <p type="p">503,503A:介面層</p>  
        <p type="p">504:內部間隔襯墊層</p>  
        <p type="p">506:內部間隔核心層</p>  
        <p type="p">602:內部間隔物</p>  
        <p type="p">801,802:源極/汲極特徵</p>  
        <p type="p">902:接觸蝕刻停止層</p>  
        <p type="p">904:層間介電層</p>  
        <p type="p">1102:閘極介電層</p>  
        <p type="p">1104:金屬層</p>  
        <p type="p">X,X',Z,Z':點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1060" publication-number="202614786"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614786.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614786</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117285</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置、二極體結構及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE, DIODE STRUCTURE, AND METHOD OF MAKING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251008B">H10D8/50</main-classification>  
        <further-classification edition="202501120251008B">H10D30/60</further-classification>  
        <further-classification edition="202501120251008B">H10D64/20</further-classification>  
        <further-classification edition="202501120251008B">H10D62/60</further-classification>  
        <further-classification edition="202501120251008B">H10D62/80</further-classification>  
        <further-classification edition="202501120251008B">H10D88/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉昱宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, YU-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞乾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JUI-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林文傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WUN-JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種二極體結構包括第一半導體層堆疊，其中該第一半導體層堆疊包括：以交替方式排列的複數個第一半導體層與複數個第二半導體層。該二極體結構進一步包括第二半導體層堆疊，其中該第二半導體層堆疊包括：以交替方式排列的複數個第三半導體層與複數個第四半導體層。該二極體結構進一步包括：第五半導體層，位於該第一半導體層堆疊與該第二半導體層堆疊之間，其中該第五半導體層的成分與該些第一、第二、第三及第四半導體層中的每一者不同。該二極體結構進一步包括：n型摻雜區域，位於該第一半導體層堆疊中；及p型摻雜區域，位於該第二半導體層堆疊中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A diode structure includes a first stack of semiconductor layers, wherein the first stack of semiconductor layers includes a plurality of first semiconductor layers arranged in an alternating arrangement with a plurality of second semiconductor layers. The diode structure further includes a second stack of semiconductor layers, wherein the second stack of semiconductor layers includes a plurality of third semiconductor layers arranged in an alternating arrangement with a plurality of fourth semiconductor layers. The diode structure further includes a fifth semiconductor layer between the first stack of semiconductor layers and the second stack of semiconductor layers, wherein a composition of the fifth semiconductor layer is different from each of the plurality of first, second, third and fourth semiconductor layers. The diode structure further includes an n-type doped region in the first stack of semiconductor layers; and a p-type doped region in the second stack of semiconductor layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:堆疊式PIN型二極體</p>  
        <p type="p">105:交替半導體層堆疊</p>  
        <p type="p">107:第一半導體材料層/第一半導體層</p>  
        <p type="p">109:第二半導體材料層/第二半導體層</p>  
        <p type="p">110:半導體層</p>  
        <p type="p">120:p型井</p>  
        <p type="p">125:第一介電層</p>  
        <p type="p">130、150:接觸結構</p>  
        <p type="p">135、155:遮罩材料</p>  
        <p type="p">140:n型井</p>  
        <p type="p">145:第二介電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1061" publication-number="202614216"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614216.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614216</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117297</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有縫狀缺陷的半導體材料之蝕刻用的鈍化</chinese-title>  
        <english-title>PASSIVATION FOR ETCHING OF SEMICONDUCTOR MATERIALS WITH SEAM-LIKE DEFECTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L21/311</main-classification>  
        <further-classification edition="200601120260102B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭益凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, I-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅大宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, TA-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏　曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, MAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃敬家</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHING-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅　世禮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUI, DAVID S. L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱濟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, JI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川口　直志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAGUCHI, MARK NAOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中提供使用鈍化蒸氣及後接蒸氣氣體混合物以蝕刻材料的方法及設備。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and apparatuses for etching materials using a passivation vapor and a subsequent vapor gas mixture are provided herein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101,103,105:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1062" publication-number="202614082"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614082.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614082</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117335</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新穎定點照護系統及用於同者之方法</chinese-title>  
        <english-title>NOVEL POINT OF CARE SYSTEM AND METHOD USED FOR THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250531B">G16H10/00</main-classification>  
        <further-classification edition="201801120250531B">G16H10/60</further-classification>  
        <further-classification edition="201801120250531B">G16H15/00</further-classification>  
        <further-classification edition="201801120250531B">G16H20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嘉碩生醫電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TST BIOMEDICAL ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭家亘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHIA-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉思恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SZU-HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃鈺同</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種定點照護系統，該定點照護系統包含多通道生物反應裝置、表面聲波(SAW)訊號讀取器以及通訊模組。該多通道生物反應裝置被配置以接收從使用者收集之分析物並並產生複數SAW訊號，該複(SAW)訊號的每一者對應於該分析物中一組的目標蛋白質體標記的至少其中之一。該SAW訊號讀取器被配置以接收該SAW訊號並生成複數時間戳記資料，該複數時間戳記資料對應於該SAW訊號。該通訊模組被配置以接收該複數時間戳記資料並傳輸所接收複數時間戳記資料到一處理器，其中該處理器被配置以運行一報告產生過程，該報告產生過程用於產生包含該組的目標蛋白質體標記的一分析之一報告。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a point of care system. The point of care system includes a multichannel bio-reaction device, a surface acoustic wave (SAW) signal reader and a communication module. The multichannel bio-reaction device is configured to receive an analyte collected from a user and generate a plurality of SAW signals each of which corresponds to at least one of a set of target proteomic markers in the analyte. The SAW signal reader is configured to receive the SAW signals and produce a plurality of time-stamped data corresponding to the SAW signals. The communication module configured to receive the plurality of time-stamped data and transmit the received plurality of time-stamped data to a processor, wherein the processor is configured to run a report-generating process for generating a report including an analysis to the set of target proteomic markers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">Sg:SAW訊號</p>  
        <p type="p">Dts:時間戳記資料</p>  
        <p type="p">20:分析物</p>  
        <p type="p">100:定點照護系統</p>  
        <p type="p">120:多通道生物反應裝置</p>  
        <p type="p">140:SAW讀取器</p>  
        <p type="p">160:使用者裝置</p>  
        <p type="p">162:通訊模組</p>  
        <p type="p">164:處理器</p>  
        <p type="p">166:報告產生過程</p>  
        <p type="p">168:記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1063" publication-number="202613048"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613048.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613048</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117342</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>方法、組成物及塗層</chinese-title>  
        <english-title>METHODS, COMPOSITIONS AND COATINGS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C03C3/064</main-classification>  
        <further-classification edition="200601120251229B">C03C3/097</further-classification>  
        <further-classification edition="200601120251229B">C03C4/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商佰邦有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIOBOND LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴拉克　法迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARRAK, FADI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宇謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於合成玻璃組成物之方法，特別是合成生物活性玻璃組成物之方法；以及於基材表面上，特別是生醫植入物之表面上，提供玻璃塗層，特別是生物活性玻璃塗層之方法；具體而言，係關於於正常體內使用期間放置以使其與生物組織（例如骨及/或軟組織）接觸之生醫植入物。本發明亦包含可根據此等方法獲得之玻璃組成物、塗層與經塗布之基材，包含例如經塗布之生醫植入物等裝置；以及所揭露之玻璃組成物與塗層用於將基材（例如生醫植入物）接合至體內生物組織（例如骨或軟組織）之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to methods for synthesising glass compositions, particularly bioactive glass compositions; as well as methods for providing a glass coating, particularly a bioactive glass coating, on the surface of a substrate, particularly a surface of a biomedical implant; in particular, a biomedical implant which, during normal in vivo use, is placed in contact with biological tissue such as bone and/or soft tissue. The disclosure also embraces glass compositions, coatings and coated substrates, including devices such as coated biomedical implants, which can be obtained according to such methods; as well as the use of the disclosed glass compositions and coatings for bonding a substrate, such as a biomedical implant, to biological tissue such as bone or soft tissue in vivo.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1064" publication-number="202613561"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613561.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613561</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117448</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導線探針</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G01R1/067</main-classification>  
        <further-classification edition="200601120260102B">G01R1/073</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商風琴針股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORGAN NEEDLE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滝澤健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KENTA, TAKIZAWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>花岡智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATORU, HANAOKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤諒太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYOTA, GOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭秀霞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">(課題)&lt;br/&gt;本發明的課題在於提供一種能夠不使基材直徑變細而增厚鍍覆的導線探針。&lt;br/&gt;&lt;br/&gt;(解決方法)&lt;br/&gt;導線探針10可通過將前端部13壓接於測定物件物41而撓曲使用，具備：導電性的基材20；絕緣膜21，覆蓋所述基材20的中央部11的外周；以及鍍覆層22，覆蓋未設有所述絕緣膜21的所述基材20的前端部13，其中，所述基材20的前端部13的直徑D3小於所述基材20的中央部11的直徑D4。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:中央部</p>  
        <p type="p">13:前端部</p>  
        <p type="p">20a:大徑部</p>  
        <p type="p">20b:小徑部</p>  
        <p type="p">20c:階差</p>  
        <p type="p">21:絕緣膜</p>  
        <p type="p">22:鍍覆層</p>  
        <p type="p">22a:鍍鎳層</p>  
        <p type="p">22b:鍍金層</p>  
        <p type="p">23:止動部</p>  
        <p type="p">D1、D1’:導線探針的前端部的直徑</p>  
        <p type="p">D2、D2’:導線探針的中央部的直徑</p>  
        <p type="p">D3、D3’:基材的前端部的直徑</p>  
        <p type="p">D4、D4’:基材的中央部的直徑</p>  
        <p type="p">T1、T1’:絕緣膜的厚度</p>  
        <p type="p">T2、T2’:鍍覆層的厚度</p>  
        <p type="p">T3、T3’:鍍鎳層的厚度</p>  
        <p type="p">T4、T4’:鍍金層的厚度</p>  
        <p type="p">H:階差的高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1065" publication-number="202613349"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613349.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613349</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117475</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於清洗氣體分配板的乾式清洗模組</chinese-title>  
        <english-title>DRY CLEAN MODULE FOR CLEANING GAS DISTRIBUTION PLATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">C23C16/44</main-classification>  
        <further-classification edition="200601120251216B">C23C16/455</further-classification>  
        <further-classification edition="200601120251216B">C23C16/50</further-classification>  
        <further-classification edition="200601120251216B">C23C16/52</further-classification>  
        <further-classification edition="200601120251216B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐度陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, DUH-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邁耶　斯泰西Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEYER, STACY J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳世昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHIH-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張嘉祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明昊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MINGHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳興思</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSING SZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石紹強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, SHAO-CHIANG PHILIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃漢彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HAN-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例通常係關於一種用於乾式清洗電漿處理系統的氣體分配板的方法。該方法首先將氣體分配板中的氣體通路中的一或多者暴露於乾式清洗工具。將超聲波從噴嘴引導向氣體通路中的沉積膜。由乾式清洗工具從氣體分配板上移除由沉積膜的低密度部分組成的膜顆粒。該方法繼續在氣體分配板上分度乾式清洗工具的噴嘴。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure generally relate to a method of dry cleaning a gas distribution plate for a plasma processing system. The method begins by exposing one or more of the gas passages in the gas distribution plate to a dry cleaning tool. Ultrasonic waves are directed from the nozzle at the deposited film in the gas passages. The film particles comprised of a lower density portion of the deposited film are removed away from the gas distribution plate by the dry cleaning tool. The method continues by indexing the nozzle of the dry cleaning tool across the gas distribution plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">158:氣體分配板</p>  
        <p type="p">162:氣體通路</p>  
        <p type="p">218:第一側</p>  
        <p type="p">220:第二側</p>  
        <p type="p">390:沉積膜</p>  
        <p type="p">410:低密度部分</p>  
        <p type="p">412:膜顆粒</p>  
        <p type="p">420:乾式清洗工具</p>  
        <p type="p">422:真空孔口</p>  
        <p type="p">430:超聲波噴嘴</p>  
        <p type="p">438:超聲波</p>  
        <p type="p">460:桌台</p>  
        <p type="p">462:感測器</p>  
        <p type="p">480:系統控制器</p>  
        <p type="p">482:中央處理單元(CPU)</p>  
        <p type="p">484:記憶體</p>  
        <p type="p">486:支援電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1066" publication-number="202614084"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614084.zip"/> 
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      <volno>24</volno>  
      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202614084</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117487</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>近視控制進展模型化、追蹤、及／或治療</chinese-title>  
        <english-title>MYOPIC CONTROL PROGRESSION MODELING, TRACKING, AND/OR TREATMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260102B">G16H20/30</main-classification>  
        <further-classification edition="201801120260102B">G16H20/40</further-classification>  
        <further-classification edition="201801120260102B">G16H50/20</further-classification>  
        <further-classification edition="201801120260102B">G16H50/50</further-classification>  
        <further-classification edition="201801120260102B">G16H50/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商壯生和壯生視覺關懷公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON &amp; JOHNSON VISION CARE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布倫南　諾爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRENNAN, NOEL A</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示近視控制進展模型化、追蹤、及/或治療。近視控制進展追蹤使用合成近視進展模型化，該合成近視進展模型化採用在患者之眼睛的近視進展中的初始功效提升。用於使用合成近視進展模型化來判定經近視控制治療之患者的近視控制治療功效之方法及設備，該合成近視進展模型化採用針對各別（多個）患者群組的「未經治療」之預測近視控制進展資料，但隨後用下列各項進行變更：(1)應用所觀察之功效的初始提升；(2)後續每年預期之軸向伸長的穩定降低；及(3)累積多年（例如，三年）之軸向伸長的降低。以此方式，可產生「經治療」之預測近視控制進展模型，其可用以判定近視控制干預治療在該患者之眼睛中的實際功效是否與該近視控制干預治療的準確預測功效一致。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Myopic control progression modeling, tracking, and/or treatment is disclosed. The myopic control progression tracking uses a synthesized myopic progression modeling employing an initial efficacy boost in myopic progression of the patient’s eye. Methods and apparatuses for determining myopic control treatment efficacy in a myopic control treated patient using synthesized myopic progression modeling employing using an “untreated” predicted myopic control progression data for the respective patient group(s) but then altered with (1) application of observed initial boost in efficacy; (2) an expected consistent reduction per year in axial elongation subsequent; and (3) an accumulated multi-year (e.g. three year) reduction of axial elongation. In this manner, “treated” predicted myopic control progression models can be generated that can be used to determine whether the actual efficacy of the myopia control intervention treatment in the patient’s eye is consistent with an accurate predicted efficacy of the myopia control intervention treatment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:程序</p>  
        <p type="p">302,304,306,308,310:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1067" publication-number="202612695"> 
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      <tif no="1" file="TIF/202612695.zip"/> 
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      <volno>24</volno>  
      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202612695</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117664</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>慢性腎病之治療</chinese-title>  
        <english-title>TREATMENT OF CHRONIC KIDNEY DISEASE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/4725</main-classification>  
        <further-classification edition="200601120260102B">A61P13/12</further-classification>  
        <further-classification edition="201801120260102B">C12Q1/6883</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯特布爾　多明尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEUBL, DOMINIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>得力克　丹尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELIC, DENIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯賽尼　塔巴塔貝伊　阿扎德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSSEINI-TABATABAEI, AZADEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希瑞爾　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHREYER, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維貝　薩賓娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIEBE, SABRINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　穎芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, DIANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種阿萬西呱(avenciguat)於治療慢性腎病(chronic kidney disease；CKD)患者之CKD、降低CKD風險，及/或延遲CKD進展之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to the use of avenciguat to treat, reduce the risk of, and/or delay the progression chronic kidney disease (CKD) in CKD patients.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1068" publication-number="202612870"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612870.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612870</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117665</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>握持機構及機器人手部</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">B25J15/00</main-classification>  
        <further-classification edition="200601120251230B">B25J15/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小松原瑶太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMATSUBARA, YOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木忠則</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, TADANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石本剣昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIMOTO, KENSHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示謀求一種可於由機器人手部握持物品時，防止與環境物(例如收容物品之容器)之干涉之握持機構。&lt;br/&gt;本揭示之支持機器人手部30之握持部36所握持之物品W而防止該物品W之落下之握持機構50具備：第1握持部54，其與物品W抵接而支持該物品W；及連桿機構56，其可自將第1握持部54收納於機器人手部30之基端側之位置之收納狀態，向使第1握持部54展開至機器人手部30之前端側之位置而與物品W抵接之展開狀態展開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:握持機構</p>  
        <p type="p">52:基座臂</p>  
        <p type="p">52a:側面</p>  
        <p type="p">52c:表面</p>  
        <p type="p">54:第1握持部</p>  
        <p type="p">56:連桿機構</p>  
        <p type="p">58:第1驅動部</p>  
        <p type="p">58a:輸出軸</p>  
        <p type="p">60:第2驅動部</p>  
        <p type="p">62:動力傳遞機構</p>  
        <p type="p">66:第1可動臂</p>  
        <p type="p">68:第2可動臂</p>  
        <p type="p">68a:基端部</p>  
        <p type="p">68b:前端部</p>  
        <p type="p">68c:表面</p>  
        <p type="p">70A,70B:第1對連桿構件</p>  
        <p type="p">74,82:一端</p>  
        <p type="p">76,84,108:托架</p>  
        <p type="p">78,88:另一端</p>  
        <p type="p">80,86,90,106:軸</p>  
        <p type="p">126:托架</p>  
        <p type="p">A2:中心軸線</p>  
        <p type="p">B,V,VII:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1069" publication-number="202614210"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614210.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614210</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117693</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H01L21/31</main-classification>  
        <further-classification edition="200601120251001B">H01L21/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴星海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EOM, BYEOLHAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜明吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, MYUNG GIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴太釪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UHM, TAEWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置包括：一基底絕緣層，其包括一第一區及一第二區；一被動元件，其包括該基底絕緣層之該第一區上之一第一傳導區及一第二傳導區；以及一電晶體，其在該基底絕緣層之該第二區上。該被動元件之該第一傳導區之一部分與該第二傳導區之一部分可藉由一第一溝槽分開，且該電晶體可藉由一第二溝槽絕緣。該第二溝槽在垂直於該基底絕緣層之一表面之一第一方向上的一第二深度可比該第一溝槽在該第一方向上之一第一深度更大。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a base insulating layer which includes a first region and a second region, a passive element which includes a first conductive region and a second conductive region on the first region of the base insulating layer, and a transistor on the second region of the base insulating layer. A portion of the first conductive region and a portion of the second conductive region of the passive element may be separated by a first trench, and the transistor may be insulated by a second trench. A second depth of the second trench in a first direction perpendicular to a surface of the base insulating layer may be greater than a first depth of the first trench in the first direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基底絕緣層</p>  
        <p type="p">14A:第一傳導區</p>  
        <p type="p">14B:第二傳導區、第二傳導性類型區</p>  
        <p type="p">15:半導體基體</p>  
        <p type="p">16:作用圖案</p>  
        <p type="p">20:奈米片結構</p>  
        <p type="p">26:第一層</p>  
        <p type="p">27:通道層</p>  
        <p type="p">28:第二層</p>  
        <p type="p">32:閘極結構</p>  
        <p type="p">34:源極及汲極圖案</p>  
        <p type="p">40:絕緣層、前絕緣層</p>  
        <p type="p">51:貫通連接件</p>  
        <p type="p">52,611,612:第一接觸通孔</p>  
        <p type="p">54:第四接觸通孔</p>  
        <p type="p">62,621,622:第二接觸通孔</p>  
        <p type="p">64:第五接觸通孔</p>  
        <p type="p">66:前佈線層</p>  
        <p type="p">67:第三接觸通孔、接觸通孔</p>  
        <p type="p">68:前絕緣層</p>  
        <p type="p">72:背接觸通孔</p>  
        <p type="p">76:背佈線層</p>  
        <p type="p">78:背絕緣層</p>  
        <p type="p">100:半導體裝置、半導體元件</p>  
        <p type="p">321:閘極電極</p>  
        <p type="p">322:閘極絕緣層</p>  
        <p type="p">323:閘極間隔件</p>  
        <p type="p">324:閘極覆蓋層</p>  
        <p type="p">631,632:第三接觸通孔</p>  
        <p type="p">681:第一前絕緣層</p>  
        <p type="p">682:第二前絕緣層</p>  
        <p type="p">1000:被動元件、被動組件</p>  
        <p type="p">2000:電晶體</p>  
        <p type="p">A1:第一區</p>  
        <p type="p">A2:第二區</p>  
        <p type="p">D1:第一深度</p>  
        <p type="p">D2:第二深度</p>  
        <p type="p">DR1:第一方向</p>  
        <p type="p">DR2:第二方向</p>  
        <p type="p">DRH:高度方向</p>  
        <p type="p">DTR:絕緣溝槽</p>  
        <p type="p">STR:分開溝槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1070" publication-number="202614211"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614211.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614211</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117699</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>RF穿透構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250828B">H01L21/31</main-classification>  
        <further-classification edition="200601120250828B">H01L21/3065</further-classification>  
        <further-classification edition="200601120250828B">C23C16/455</further-classification>  
        <further-classification edition="200601120250828B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川龍之介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, RYUNOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古賀達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOGA, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種可使朝基板側供給的電漿的濃度分布均勻化之RF穿透構件。&lt;br/&gt;本發明的解決手段為一種RF穿透構件10，包含：筒狀體100；覆蓋筒狀體100的內表面130之保護膜200。在筒狀體100的一方側的端部形成有第一開口111，在筒狀體100的另一方側的端部形成有內徑大於第一開口111之第二開口121。筒狀體100的內表面130包含：第一區域D1；位於比第一區域D1還靠第二開口121側之第二區域D2。在該RF穿透構件10中，覆蓋第二區域D2的保護膜200的表面粗糙度比覆蓋第一區域D1的保護膜200的表面粗糙度還粗糙。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:RF穿透構件</p>  
        <p type="p">100:筒狀體</p>  
        <p type="p">110、120:端部</p>  
        <p type="p">111:第一開口</p>  
        <p type="p">121:第二開口</p>  
        <p type="p">130:內表面</p>  
        <p type="p">131:朝向內側突出成圓弧狀的部分</p>  
        <p type="p">132:朝向外側突出成圓弧狀的部分</p>  
        <p type="p">200:保護膜</p>  
        <p type="p">A、B:放大圖</p>  
        <p type="p">AX:中心軸</p>  
        <p type="p">D1:第一區域</p>  
        <p type="p">D2:第二區域</p>  
        <p type="p">DL:一點鏈線</p>  
        <p type="p">S1、S2:表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1071" publication-number="202614673"> 
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      <tif no="1" file="TIF/202614673.zip"/> 
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      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202614673</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117700</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>RF穿透構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">H05H1/24</main-classification>  
        <further-classification edition="200601120250901B">H05H1/46</further-classification>  
        <further-classification edition="200601120250901B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川龍之介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, RYUNOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古賀達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOGA, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種以供給到外側的線圈的交流電力比以往小的電力，並且可穩定地產生電漿之RF穿透構件。&lt;br/&gt;本發明的解決手段為一種RF穿透構件10，包含：筒狀體100；覆蓋筒狀體100的內表面130之保護膜200。在筒狀體100的一方側的端部形成有第一開口111，在筒狀體100的另一方側的端部形成有內徑大於第一開口111之第二開口121。筒狀體100的內表面130包含：第一區域D1；位於比第一區域D1還靠第二開口121側之第二區域D2。在該RF穿透構件10中，覆蓋第一區域D1的保護膜200的表面粗糙度比覆蓋第二區域D2的保護膜200的表面粗糙度還粗糙。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:RF穿透構件</p>  
        <p type="p">100:筒狀體</p>  
        <p type="p">110、120:端部</p>  
        <p type="p">111:第一開口</p>  
        <p type="p">121:第二開口</p>  
        <p type="p">130:內表面</p>  
        <p type="p">131:朝向內側突出成圓弧狀的部分</p>  
        <p type="p">132:朝向外側突出成圓弧狀的部分</p>  
        <p type="p">200:保護膜</p>  
        <p type="p">A、B:放大圖</p>  
        <p type="p">AX:中心軸</p>  
        <p type="p">CL:線圈</p>  
        <p type="p">D1:第一區域</p>  
        <p type="p">D2:第二區域</p>  
        <p type="p">DL:一點鏈線</p>  
        <p type="p">S1、S2:表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1072" publication-number="202614122"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614122.zip"/> 
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      <volno>24</volno>  
      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202614122</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117701</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>RF穿透構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">H01J37/16</main-classification>  
        <further-classification edition="200601120250902B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川龍之介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, RYUNOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古賀達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOGA, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種可持續很長的期間發揮保護膜的功能之RF穿透構件。&lt;br/&gt;本發明的解決手段為一種RF穿透構件10，包含：筒狀體100；覆蓋筒狀體100的內表面130之保護膜200。在筒狀體100的一方側的端部形成有第一開口111，在筒狀體100的另一方側的端部形成有內徑大於第一開口111之第二開口121。筒狀體100的內表面130包含：第一區域D1；位於比第一區域D1還靠第二開口121側之第二區域D2。在該RF穿透構件10中，覆蓋第一區域D1的保護膜200比覆蓋第二區域D2的保護膜200還厚</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:RF穿透構件</p>  
        <p type="p">100:筒狀體</p>  
        <p type="p">110、120:端部</p>  
        <p type="p">111:第一開口</p>  
        <p type="p">121:第二開口</p>  
        <p type="p">130:內表面</p>  
        <p type="p">131:朝向內側突出成圓弧狀的部分</p>  
        <p type="p">132:朝向外側突出成圓弧狀的部分</p>  
        <p type="p">200:保護膜</p>  
        <p type="p">A、B:放大圖</p>  
        <p type="p">AR1:箭頭</p>  
        <p type="p">AX:中心軸</p>  
        <p type="p">CL:線圈</p>  
        <p type="p">D1:第一區域</p>  
        <p type="p">D2:第二區域</p>  
        <p type="p">DL:一點鏈線</p>  
        <p type="p">T1、T2:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1073" publication-number="202614123"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614123.zip"/> 
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      <volno>24</volno>  
      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202614123</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117702</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>RF穿透構件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">H01J37/16</main-classification>  
        <further-classification edition="200601120250902B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川龍之介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, RYUNOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古賀達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOGA, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種可防止起因於殘留應力之保護膜的破損等之RF穿透構件。&lt;br/&gt;本發明的解決手段為一種RF穿透構件10，包含：筒狀體100；覆蓋筒狀體100的內表面130之保護膜200。在筒狀體100的一方側的端部形成有第一開口111，在筒狀體100的另一方側的端部形成有內徑大於第一開口111之第二開口121。在以包含筒狀體100的中心軸AX的面剖切的情形的剖面中，筒狀體100的內表面130包含：朝向內側突出成圓弧狀之第一區域D1；比第一區域D1還靠第二開口121側的部分，且朝向外側突出成圓弧狀之第二區域D2。在上述剖面中，第一區域D1的曲率大於第二區域D2的曲率，覆蓋第一區域D1的保護膜200比覆蓋第二區域D2的保護膜200還薄。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:RF穿透構件</p>  
        <p type="p">100:筒狀體</p>  
        <p type="p">110、120:端部</p>  
        <p type="p">111:第一開口</p>  
        <p type="p">121:第二開口</p>  
        <p type="p">130:內表面</p>  
        <p type="p">200:保護膜</p>  
        <p type="p">A、B:放大圖</p>  
        <p type="p">AX:中心軸</p>  
        <p type="p">CL:線圈</p>  
        <p type="p">D1:第一區域</p>  
        <p type="p">D2:第二區域</p>  
        <p type="p">T1、T2:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1074" publication-number="202614794"> 
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      <tif no="1" file="TIF/202614794.zip"/> 
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      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614794</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117707</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置的形成方法</chinese-title>  
        <english-title>METHODS OF FORMING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250801B">H10D30/01</main-classification>  
        <further-classification edition="201101120250801B">B82Y40/00</further-classification>  
        <further-classification edition="202501120250801B">H10D62/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏正禹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, CHENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林政頤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENG-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳書涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHU-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JYUN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　志安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUI, CHI ON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">藉由在垂直相鄰的奈米結構通道周圍沈積保形犧牲間隔物，然後蝕刻犧牲間隔層，在奈米結構通道之間形成犧牲間隔層，使得犧牲間隔層僅作為犧牲間隔物保留在垂直相鄰的奈米結構通道之間。可使用可流動沈積技術將犧牲間隔層的材料沈積在具有大量前驅物及反應物滲透的奈米結構通道之間。這使得奈米結構通道之間的犧牲間隔層能夠實現高縫隙填充性能，從而防止、最小化及/或以其他方式降低在奈米結構通道之間的犧牲間隔層中形成接縫的可能性。無接縫確保犧牲間隔層完全阻止功函數金屬層的材料沈積在垂直相鄰的奈米結構通道之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Sacrificial spacers are formed between vertically adjacent nanostructure channels by depositing a conformal sacrificial spacer layer around the nanostructure channels and then etching the sacrificial spacer layer such that the sacrificial spacer layer remains only between vertically adjacent nanostructure channels as the sacrificial spacers. A flowable deposition technique may be used to deposit the material of the sacrificial spacer layer in between the nanostructure channels with a high amount of precursor and reactant penetration. This enables a high gap-filling performance to be achieved for the sacrificial spacer layer in between the nanostructure channels, which prevents, minimizes, and/or otherwise reduces the likelihood of formation of seams in the sacrificial spacer layer between the nanostructure channels. The absence of seams ensures that the sacrificial spacer layer fully blocks the material from the work function metal layer from being deposited between the vertically adjacent nanostructure channels.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:製程</p>  
        <p type="p">810、820、830、840:區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1075" publication-number="202613734"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613734.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613734</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117710</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">G03F7/32</main-classification>  
        <further-classification edition="200601120251217B">H01L21/027</further-classification>  
        <further-classification edition="200601120251217B">G03F7/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁　公桂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DINH, CONG QUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長佳蓉子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, KAYOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友利光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMORI, HIKARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村松誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAMATSU, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永原誠司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAHARA, SEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]改善在形成化學增幅型光阻(CAR)的圖案時之曝光量感度及圖案表面的粗糙度兩者。 &lt;br/&gt;　　[解決手段]一種基板處理方法，其特徵係，包含有：(A)「準備形成有化學增幅型光阻之被膜並實施了曝光處理及曝光處理後的加熱處理之基板」的工程；(B)「因應於前述化學增幅型光阻為正型或負型，將前述被膜中因前述曝光處理所致之曝光部及未曝光部中的任一方去除，對前述基板實施形成前述化學增幅型光阻的圖案之第1顯像」的工程；(C)「在前述(B)工程後，對前述基板實施變更前述圖案中之前述化學增幅型光阻的特性之處理」的工程；及(D)「在前述(C)工程後，使用與前述第1顯像不同的顯像材料，對前述基板實施將前述圖案之表面的前述化學增幅型光阻去除之第2顯像」的工程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1076" publication-number="202613200"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613200.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613200</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117711</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻劑組成物及阻劑圖型形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C08F220/32</main-classification>  
        <further-classification edition="200601120251229B">C08F220/36</further-classification>  
        <further-classification edition="200601120251229B">C08F220/38</further-classification>  
        <further-classification edition="200601120251229B">C07C309/58</further-classification>  
        <further-classification edition="200601120251229B">C07C381/12</further-classification>  
        <further-classification edition="200601120251229B">C07D307/77</further-classification>  
        <further-classification edition="200601120251229B">C07D327/04</further-classification>  
        <further-classification edition="200601120251229B">C07D493/08</further-classification>  
        <further-classification edition="200601120251229B">G03F7/004</further-classification>  
        <further-classification edition="200601120251229B">G03F7/039</further-classification>  
        <further-classification edition="200601120251229B">G03F7/11</further-classification>  
        <further-classification edition="200601120251229B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂田誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKATA, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹軼陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAN, YIYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種於阻劑圖型的形成中感度良好且可減少環境負荷之阻劑組成物及阻劑圖型形成方法。該阻劑組成物包含藉由曝光產生酸，且藉由酸的作用而對顯像液的溶解性會變化之阻劑組成物，含有藉由酸的作用使對顯像液的溶解性變化之樹脂成分（A1）與藉由曝光產生酸之酸產生劑成分(B)，其中，前述樹脂成分(A1)為具有含內酯之環式基、含-SO&lt;sub&gt;2&lt;/sub&gt;-之環式基或含碳酸酯之環式基所示之構成單位(a0)，前述酸產生劑成分(B)包含具全氟芳香環(惟，排除相當於PFAS化合物者)之化合物(B0)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1077" publication-number="202614142"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614142.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614142</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117800</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有錐形底部槽及側槽的侷限環</chinese-title>  
        <english-title>CONFINEMENT RING WITH TAPERED BOTTOM SLOTS AND SIDE SLOTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁繼來</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, JILAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥斯　亞當　克利斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACE, ADAM CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪　帕梅拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, PAMELA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">侷限環結構包含延伸於下部區段之內部的第一組狹槽、以及從下部區段之外部延伸且覆蓋中間區段之下部的第二組狹槽。第二組狹槽為接續的。分隔帶定義於第一組狹槽與第二組狹槽之間。第一組狹槽及第二組狹槽係設置成使得第一組狹槽中一些者對準第二組狹槽中一些者，而第一組狹槽中其餘者偏離第二組狹槽中其餘者。第一組及第二組狹槽改善離開電漿區域的電漿之流動，該電漿區域係於處理腔室中定義在上電極與下電極之間，侷限環係定義於該處理腔室中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A confinement ring structure includes a first set of slots extending in an inner portion of a lower section and a second set of slots that extend from an outer portion of the lower section and cover a lower portion of a middle section. The second set of slots is contiguous. A separation band is defined between the first set of slots and the second set of slots. The first set of slots and the second set of slots are disposed such that some of the first set of slots align with some of the second set of slots while the remaining ones of the first set of slots are offset from the remaining ones of the second set of slots. The first set and the second set of slots improve the flow of the plasma out of a plasma region defined in processing chamber in which the confinement ring is defined between an upper electrode and a lower electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:處理腔室</p>  
        <p type="p">101:晶圓</p>  
        <p type="p">102:下電極</p>  
        <p type="p">103:電漿容積</p>  
        <p type="p">104:上電極</p>  
        <p type="p">106:上外電極</p>  
        <p type="p">108:邊緣環</p>  
        <p type="p">110:介電結構</p>  
        <p type="p">112:匹配網路</p>  
        <p type="p">114:射頻產生器</p>  
        <p type="p">116:接地環</p>  
        <p type="p">120:侷限環</p>  
        <p type="p">122:VAT閥控制部</p>  
        <p type="p">124:渦輪泵</p>  
        <p type="p">250:分隔帶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1078" publication-number="202613736"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613736.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613736</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117812</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於載台設備之定位裝置</chinese-title>  
        <english-title>POSITIONING APPARATUS FOR A STAGE APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G03F9/00</main-classification>  
        <further-classification edition="200601120260102B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　德仁特　威廉　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DRENT, WILLIAM PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於一載台設備之粗略定位設備，該粗略定位設備包含：至少一個氣體彈簧，各該至少一個氣體彈簧包含一活塞；及 &lt;br/&gt;至少一個電磁致動器；其中該至少一個氣體彈簧與該至少一個電磁致動器可操作以各自將各別互補力施加至該載台設備，以便加速該載台設備以用於粗略定位該載台設備，且其中至少該氣體彈簧貫穿該載台設備之各全衝程耦接至該載台設備。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a coarse positioning apparatus for a stage apparatus, the coarse positioning apparatus comprising: at least one gas spring, each said at least one gas spring comprising a piston; and &lt;br/&gt;at least one electromagnetic actuator; wherein said at least one gas spring and said at least one electromagnetic actuator are operable to each apply respective complementary forces to said stage apparatus so as to accelerate said stage apparatus for coarse positioning of said stage apparatus, and wherein at least said gas spring is coupled to said stage apparatus throughout each full stroke of said stage apparatus.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:長衝程模組</p>  
        <p type="p">205:倍縮光罩</p>  
        <p type="p">210:軸件</p>  
        <p type="p">215:連接結構或結構部件</p>  
        <p type="p">220:電磁致動器或電磁迫動器</p>  
        <p type="p">225:氣體彈簧</p>  
        <p type="p">230:活塞</p>  
        <p type="p">235:活塞汽缸</p>  
        <p type="p">240:汽缸外殼</p>  
        <p type="p">245:氣體供應器</p>  
        <p type="p">250:壓力調節器</p>  
        <p type="p">255:閥</p>  
        <p type="p">260:氣體軸承</p>  
        <p type="p">265:移動密封件</p>  
        <p type="p">270:髒真空區域</p>  
        <p type="p">275:潔淨真空區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1079" publication-number="202614127"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614127.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614127</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117814</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於半導體製造中之增強線內檢測的晶圓級選擇</chinese-title>  
        <english-title>WAFER-LEVEL SELECTION FOR ENHANCED INLINE INSPECTION IN SEMICONDUCTOR MANUFACTURING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01J37/26</main-classification>  
        <further-classification edition="200601120260102B">G01N21/94</further-classification>  
        <further-classification edition="201901120260102B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王智煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHIHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林晨希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHENXI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王富明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, FUMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　德勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TE SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種在大批量製造期間提供一模型輔助線內晶圓級檢測之方法。更特定言之，揭示一種用於使用一運算模型來產生指紋晶圓缺陷圖且接著導引用於線內檢測之晶圓選擇之方法。揭示一種運算機率預測模型，以按經改良準確度及通用性產生有缺陷晶粒機率估計，從而導引不同晶圓進行檢測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method to provide a model-assisted inline wafer-level inspection during high volume manufacturing is disclosed. More particularly, a method for using a computational model to generate fingerprint wafer defect maps and then guide wafer selection for inline inspection is disclosed. A computational probability prediction model is disclosed to generate defective die probability estimates with improved accuracy and versatility to guide different wafers for inspection.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:方法</p>  
        <p type="p">901:步驟</p>  
        <p type="p">902:步驟</p>  
        <p type="p">903:步驟</p>  
        <p type="p">904:步驟</p>  
        <p type="p">905:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1080" publication-number="202612783"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612783.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612783</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117827</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有高效能微結構的結構化填充元件</chinese-title>  
        <english-title>STRUCTURED PACKING ELEMENT WITH HIGH PERFORMANCE MICROSTRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">B01J19/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商蘇爾壽管理股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SULZER MANAGEMENT AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林德　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINDER, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威利　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEHRLI, MARC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧斯納　伊爾賈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUSNER, ILJA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋伯樂　安瑟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAEBLER, ANSOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於在重流體相與輕流體相之間的質量傳輸及/或熱交換的塔的結構化跨通道(cross-channel)填充元件，其中該結構化跨通道填充元件包含至少二個各自包含開口之由片所製成之相鄰層，該等開口係藉由分隔元件所包圍而彼此分隔，其中該至少二層中之至少二者係互相平行且接觸地配置，以致在該至少二層之間提供從該至少二層之一端延伸至相反端的開放空間，以致該重流體相和該輕流體相中之至少一者可流經該開放空間，其中在至少一層的片中鄰近的開口互相重疊，以致該至少一層之每一橫剖平面包含至少一開口，其中在至少一層之平均網格(grid)厚度(g)與該片材料厚度(s)之間的比為至多5.0，且其中至少一層之該平均網格厚度(g)少於1.0 mm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a structured cross-channel packing element for a column for mass transfer and/or heat exchange between a heavy and a light fluid phase, wherein A structured cross-channel packing element for a column for mass transfer and/or heat exchange between a heavy and a light fluid phase, wherein the structured cross-channel packing element comprises at least two adjacent layers made of sheets each comprising openings, which are surrounded and separated from each other by separating elements, wherein at least two of the at least two layers are arranged parallel and in touching contact with each other so that an open space extending from one end to the opposite end of the at least two layers is provided between them so that at least one of the heavy and the light fluid phase may flow through it, wherein neighboring opening in the sheet of at least one layer overlap with each other so that each cross-sectional plane of the at least one layer comprises at least one opening s, wherein the ratio between the average grid thickness g of at least one layer and the sheet material thickness s is at most 5.0, and wherein the average grid thickness g of at least one layer is less than 1.0 mm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">32:層</p>  
        <p type="p">40:該網格的開口</p>  
        <p type="p">42:該網格之分隔元件</p>  
        <p type="p">44:開口之垂直列</p>  
        <p type="p">46:開口之水平列</p>  
        <p type="p">48:突出部</p>  
        <p type="p">50:小凹坑</p>  
        <p type="p">b:分隔元件之平均寬度</p>  
        <p type="p">c:開口之最大長度</p>  
        <p type="p">d:開口之最大寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1081" publication-number="202612809"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612809.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612809</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117871</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>長筒殼</chinese-title>  
        <english-title>LONG CARTRIDGE CASE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">B21C23/20</main-classification>  
        <further-classification edition="200601120251224B">B21K21/04</further-classification>  
        <further-classification edition="200601120251224B">F42B33/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商國民機器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL MACHINERY LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史納菲力　克里斯多夫　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SNAVELY, CHRISTOPHER W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗蘭克　大衛　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRANK, DAVID L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種成型一封閉端金屬管之方法，其包含：自實心圓形金屬線切割出坯料；在該坯料中反向擠壓出一軸向孔以產生具有一厚度之中空側壁；且藉由使用一或多次改良型胡可（Modified Hooker）擠壓來減小該側壁厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of forming a closed end metal tube comprising cutting a blank from a solid round metal wire, backward extruding an axial hole in the blank to produce a hollow sidewall with a thickness, and reducing the sidewall thickness by using one or more Modified Hooker extrusions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:坯料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1082" publication-number="202614282"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614282.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614282</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117881</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用自動化系統及無線充電之監控製程的系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD OF MONITORING PROCESS USING AUTOMATION SYSTEM AND WIRELESS CHARGING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">H01L21/67</main-classification>  
        <further-classification edition="200601120251216B">H01L21/683</further-classification>  
        <further-classification edition="200601120251216B">H01L21/687</further-classification>  
        <further-classification edition="200601120251216B">H01L21/673</further-classification>  
        <further-classification edition="201601120251216B">H02J50/10</further-classification>  
        <further-classification edition="201601120251216B">H02J50/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＷＩＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIT CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金宰煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JAE HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宰源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, JAE WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種利用一自動化系統及無線充電之監控一製程的系統及方法。繼電器模組包括一主體；一無線充電接收單元，設置於主體的一側邊上；以及一無線充電傳輸單元，設置於主體的另一側邊上。此處，繼電器模組從一前開式晶圓傳輸盒(FOUP)的一外部裝置經由無線充電接收單元接收一電力，及在繼電器模組及另一裝置一起位於FOUP中時經由無線充電傳輸單元傳輸一電力至FOUP中的此另一裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and a method of monitoring a process using an automation system and wireless charging are disclosed. The relay module includes a body, a wireless charging reception unit formed on one side of the body and a wireless charging transmission unit formed on another side of the body. Here, the relay module receives a power from an external device of a FOUP through the wireless charging reception unit and delivers a power to another device in the FOUP through the wireless charging transmission unit while the relay module and the another device locate together in the FOUP.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">104:第一監控裝置</p>  
        <p type="p">200:FOUP</p>  
        <p type="p">202:站台</p>  
        <p type="p">204:繼電器模組</p>  
        <p type="p">210:狹縫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1083" publication-number="202612711"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612711.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612711</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117890</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>糞菌多層滴丸的乾燥方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251203B">A61K35/741</main-classification>  
        <further-classification edition="200601120251203B">A61K47/38</further-classification>  
        <further-classification edition="200601120251203B">A61K47/02</further-classification>  
        <further-classification edition="200601120251203B">A61P1/00</further-classification>  
        <further-classification edition="200601120251203B">A61P25/00</further-classification>  
        <further-classification edition="200601120251203B">A61P35/00</further-classification>  
        <further-classification edition="200601120251203B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳萬和製藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN WANHE PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仲蓀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHONGSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯百勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, BAISHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃維佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEIJIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明屬於藥劑製備技術領域，提供了一種糞菌多層滴丸的乾燥方法。本發明的乾燥方法首先提供糞菌多層滴丸；利用脫油劑對糞菌多層滴丸進行離心脫油後，進行分離處理，得到脫油滴丸；脫油劑為氣相二氧化矽、大豆纖維和燕麥纖維素的混合物；將脫油滴丸進行鼓風乾燥，得到預乾燥滴丸；將預乾燥滴丸進行負壓乾燥，得到黃龍滴丸。本發明提供的乾燥方法依次經離心脫油、鼓風乾燥和負壓乾燥，進一步降低了黃龍滴丸的水活度。實施例的資料表明，所得黃龍滴丸的水活度aw 為 0.08~0.14，具有優異的耐受性，尤其是體外模擬胃腸耐受性，還具有優異的穩定性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1084" publication-number="202613623"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613623.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613623</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117900</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有多級的邊緣耦合器</chinese-title>  
        <english-title>EDGE COUPLERS WITH MULTIPLE STAGES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">G02B6/122</main-classification>  
        <further-classification edition="200601120251226B">G02B6/12</further-classification>  
        <further-classification edition="200601120251226B">G02B6/13</further-classification>  
        <further-classification edition="200601120251226B">G02B6/14</further-classification>  
        <further-classification edition="200601120251226B">G02B6/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商格芯（美國）集成電路科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBALFOUNDRIES US INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卞宇生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIAN, YUSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣川貴子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIROKAWA, TAKAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬杜里　扎希杜爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOWDHURY, ZAHIDUR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達斯古普塔　阿爾潘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DASGUPTA, ARPAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於邊緣耦合器的結構以及形成此類結構的方法。該結構包括波導芯，該波導芯包括端面、第一錐形段、第二錐形段、以及縱軸。該第一錐形段沿該縱軸設置於該第二錐形段與該端面之間。該第一錐形段具有隨著沿該縱軸的位置非線性變化的第一寬度尺寸。該第二錐形段具有隨著沿該縱軸的位置非線性變化的第二寬度尺寸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Structures for an edge coupler and methods of forming such structures. The structure comprises a waveguide core including a facet, a first tapered section, a second tapered section, and a longitudinal axis. The first tapered section is positioned along the longitudinal axis between the second tapered section and the facet. The first tapered section has a first width dimension that varies non-linearly with position along the longitudinal axis. The second tapered section has a second width dimension that varies non-linearly with position along the longitudinal axis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:結構</p>  
        <p type="p">12:波導芯</p>  
        <p type="p">20:錐形段</p>  
        <p type="p">21:縱軸</p>  
        <p type="p">22:錐形段</p>  
        <p type="p">24:邊緣耦合器</p>  
        <p type="p">25:段</p>  
        <p type="p">26:端面</p>  
        <p type="p">28:側壁</p>  
        <p type="p">30:側壁</p>  
        <p type="p">32:側壁</p>  
        <p type="p">34:側壁</p>  
        <p type="p">L1:長度</p>  
        <p type="p">L2:長度</p>  
        <p type="p">W1:寬度尺寸、非線性寬度</p>  
        <p type="p">W2:寬度尺寸、非線性寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1085" publication-number="202613478"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613478.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613478</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117933</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蒸氣腔、電子機器及蒸氣腔用片材</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">F28D15/02</main-classification>  
        <further-classification edition="200601120251223B">F28D15/04</further-classification>  
        <further-classification edition="200601120251223B">H01L23/427</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大日本印刷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山木誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAKI, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寺内崇之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERAUCHI, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯塚秋男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIZUKA, AKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>太田貴之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小田和範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ODA, KAZUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之封入有作動流體(2a、2b)之蒸氣腔(1)具備：蒸氣空間(50)，其供作動流體之蒸氣(2b)通過；毛細結構芯構造體(60)，其與蒸氣空間(50)連通，供作動流體之液體(2b)通過；及貫通部(5)，其貫通蒸氣腔(1)。貫通部(5)不與蒸氣空間(50)及毛細結構芯構造體(60)中之任一者連通，貫通部(5)於俯視下具有方向性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:蒸氣腔</p>  
        <p type="p">2a:作動流體</p>  
        <p type="p">2b:作動流體</p>  
        <p type="p">3:密封空間</p>  
        <p type="p">4:器件</p>  
        <p type="p">5:貫通部</p>  
        <p type="p">10:下側片材</p>  
        <p type="p">20:上側片材</p>  
        <p type="p">37:注入流路</p>  
        <p type="p">39:支持部</p>  
        <p type="p">50:蒸氣空間</p>  
        <p type="p">CR:冷凝區域</p>  
        <p type="p">D:器件</p>  
        <p type="p">FL:彎折中心線</p>  
        <p type="p">III:線</p>  
        <p type="p">IV:線</p>  
        <p type="p">OD:方向</p>  
        <p type="p">SR:蒸發區域</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1086" publication-number="202614283"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614283.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614283</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117937</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置、基板處理系統以及基板處理方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/67</main-classification>  
        <further-classification edition="200601120251226B">H01L21/677</further-classification>  
        <further-classification edition="200601120251226B">H01L21/687</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商細美事有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金烔五</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONGOH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基板處理裝置、基板處理系統以及基板處理方法，該基板處理裝置能夠使用臨時黏接材料來轉移物件，可以包括：移送台，一側面形成有容納該物件的容納槽部，以便移送對象；以及黏接材料供給管線，形成於該移送臺上，將該臨時黏接材料供給至該容納槽部，以便將該物件和該移送台以標準黏接力以上臨時地進行黏接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:對象</p>  
        <p type="p">2:半導體封裝件條帶</p>  
        <p type="p">3a:端子面</p>  
        <p type="p">3b:成型面</p>  
        <p type="p">10:移送台</p>  
        <p type="p">11:容納槽部</p>  
        <p type="p">11a:底面</p>  
        <p type="p">12:翼部</p>  
        <p type="p">20:黏接材料供給管線</p>  
        <p type="p">21:黏接材料流入孔部</p>  
        <p type="p">22:黏接材料支管線</p>  
        <p type="p">23:黏接材料排出孔部</p>  
        <p type="p">100:基板處理裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1087" publication-number="202614217"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614217.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614217</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114117960</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置和製造半導體裝置的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES AND METHODS OF MAKING SEMICONDUCTOR DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H01L21/311</main-classification>  
        <further-classification edition="200601120251217B">H01L21/762</further-classification>  
        <further-classification edition="202501120251217B">H10D64/27</further-classification>  
        <further-classification edition="202501120251217B">H10D48/30</further-classification>  
        <further-classification edition="202501120251217B">H10D30/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林子敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, TZU-GING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製造半導體裝置的方法包括延伸開口穿過閘極結構、鰭片或薄片堆疊、淺溝槽隔離區域並進入基板內至在低於淺溝槽隔離區域和源極/汲極結構的深度。一種半導體裝置包括基板、在基板上方的淺溝槽隔離區域、在基板上方的鰭片或薄片堆疊、設置在基板和淺溝槽隔離區域上方的閘極結構、源極/汲極結構、以及包含介電質材料的開口其延伸到基板內至低於淺溝槽隔離區域和源極/汲極結構的深度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of manufacturing a semiconductor device includes extending an opening through a gate structure, a fin or sheet stack, a shallow trench isolation region, and into a substrate to a depth below the shallow trench isolation region and source/drain structures. A semiconductor device includes a substrate, a shallow trench isolation region over the substrate, a fin or sheet stack over the substrate, a gate structure disposed over the substrate and the shallow trench isolation region, source/drain structures, and an opening containing a dielectric material extending into the substrate to a depth below the shallow trench isolation region and the source/drain structures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">805:步驟</p>  
        <p type="p">810:步驟</p>  
        <p type="p">820:步驟</p>  
        <p type="p">830:步驟</p>  
        <p type="p">840:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1088" publication-number="202614193"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614193.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614193</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118027</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H01L21/304</main-classification>  
        <further-classification edition="200601120251217B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸山皓己</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUYAMA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸本洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUMOTO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 抑制在液處理中對在基板之表面上露出的部分造成損傷之技術。 &lt;br/&gt;　　[解決手段] 基板處理裝置具備保持部、噴嘴、攝像部、冷卻部和控制電路。保持部係以能夠旋轉之方式保持基板。噴嘴係對基板之表面吐出處理液。攝像部係攝像基板之表面。冷卻部係冷卻基板。控制電路係實行液處理、攝像處理、判定處理和冷卻處理。液處理係從噴嘴朝向旋轉之基板的表面吐出處理液。攝像處理係使用攝像部而攝像液處理中之基板之表面。判定處理係根據攝像處理所致的攝像畫像，針對在液處理中之基板之表面上之沿著基板之徑向的複數位置之各者，判定是否已結束處理液所致之反應。冷卻處理係針對在基板之表面上之複數位置之至少一個，判定已結束處理液所致的反應之情況，使用冷卻部冷卻基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:控制裝置</p>  
        <p type="p">16:處理單元</p>  
        <p type="p">18:控制部</p>  
        <p type="p">181:動作控制部</p>  
        <p type="p">182:攝像控制部</p>  
        <p type="p">183:判定部</p>  
        <p type="p">184:冷卻控制部</p>  
        <p type="p">19:記憶部</p>  
        <p type="p">191:配方資訊</p>  
        <p type="p">60:攝像部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1089" publication-number="202614194"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614194.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614194</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118032</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓的製造方法</chinese-title>  
        <english-title>MANUFACTURING METHOD OF WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251008B">H01L21/304</main-classification>  
        <further-classification edition="200601120251008B">H01L21/67</further-classification>  
        <further-classification edition="200601120251008B">H01L21/66</further-classification>  
        <further-classification edition="200601120251008B">B23D61/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＵＭＣＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMCO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本亮介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的是提供一種在使用固定磨粒線鋸而從單結晶晶錠製造晶圓的時候，可藉由簡單的構成抑制刮傷晶圓之晶圓的製造方法。其解決手段為一種晶圓的製造方法，使用固定磨粒線鋸而從單結晶晶錠製造晶圓，包括切片步驟以及拔出步驟。前述切片步驟係，藉由使由固定磨粒線材構成的線材列行進、並且使保持前述單結晶晶錠的保持部對於前述線材列相對地下降，而將前述單結晶晶錠切片。前述拔出步驟係，藉由使前述線材列行進、並且使前述保持部對於前述線材列相對地上升，而將切斷後的前述單結晶晶錠從前述線材列拔出。前述拔出步驟係，藉由300mm/分以上的速度使前述保持部相對地上升。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The purpose of the present invention is to provide a method for manufacturing wafers from a single crystal ingot using a fixed abrasive wire saw to prevent scratching the wafers by simple structure. A solution is a method for manufacturing wafers from a single crystal ingot using a fixed abrasive wire saw, wherein the method comprises a slicing step and a pulling-out step. The slicing step is to slice the single crystal ingot by advancing a wire array composed of fixed abrasive wires and lowering a holding portion holding the single crystal ingot relative to the wire array. The pulling-out step is to pull out the cut single crystal ingot from the wire array by advancing the wire array and raising the holding portion relative to the wire array. The pulling-out step includes raising the holding portion relative to the wire array at a speed of 300 mm/min or more.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1,S2,S3,S4,S5,S6,S7:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1090" publication-number="202613439"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613439.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613439</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118035</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝴蝶閥殼體總成</chinese-title>  
        <english-title>BUTTERFLY VALVE HOUSING ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">F16K1/22</main-classification>  
        <further-classification edition="200601120251229B">F16K1/36</further-classification>  
        <further-classification edition="200601120251229B">F16K1/226</further-classification>  
        <further-classification edition="200601120251229B">F16K27/02</further-classification>  
        <further-classification edition="200601120251229B">F16L23/036</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商喬治費雪導管系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEORG FISCHER ROHRLEITUNGSSYSTEME AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦賽斯齊　麥克辛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WASETZKI, MAXIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅爾　拉爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAYER, LARS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷克　理查</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RECH, RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾布蘭德　法比安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEUBRAND, FABIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於蝴蝶閥的蝴蝶閥殼體總成，其中蝴蝶閥具有安裝於殼體中而可繞著垂直延伸桿件而旋轉的關閉元件，蝴蝶閥殼體總成包含：殼體，由塑膠或輕合金所構成；垂直延伸桿件；貫流開口，配置於殼體中而容納關閉元件；以及凸緣，配置在末端，其中至少一強化元件配置於殼體中，該強化元件藉由力量吸收機構來連接於凸緣，而使作用在桿件上的內部壓力經由強化元件而被力量吸收機構所吸收。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Butterfly valve housing assembly for a butterfly valve having a closing element mounted in the housing so as to be rotatable about a vertically extending stem, comprising a housing consisting of plastic or light alloy, a vertically extending stem, a through-flow opening, arranged in the housing, accommodating the closing element, and flanges arranged at the ends, wherein at least one reinforcing element is arranged in the housing, which reinforcing element is connected to the flanges by means of force-absorbing means in such a way that internal pressure forces acting on the stem are absorbed by the force-absorbing means via the reinforcing element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:蝴蝶閥殼體總成</p>  
        <p type="p">2:殼體</p>  
        <p type="p">3:關閉元件</p>  
        <p type="p">4:桿件</p>  
        <p type="p">5:貫流開口</p>  
        <p type="p">6:凸緣</p>  
        <p type="p">7:強化元件</p>  
        <p type="p">8:力量吸收機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1091" publication-number="202613504"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613504.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613504</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118041</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>暫態現象的監控及偵測</chinese-title>  
        <english-title>MONITORING AND DETECTION OF TRANSIENT PHENOMENA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G01J3/28</main-classification>  
        <further-classification edition="200601120260102B">G01J3/443</further-classification>  
        <further-classification edition="200601120260102B">H01J37/32</further-classification>  
        <further-classification edition="200601120260102B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊　班傑明　桐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEE, BENJAMIN TONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦斯奎斯　麥高　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VASQUEZ, MIGUEL BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　正博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHENG-PO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供偵測瞬態現象的方法和設備。在一些實施例中，技術可以包含：透過被配置為偵測持續100奈秒或更短的光訊號的光感測器，取得在處理設備的穩定狀態操作期間至少由該處理設備內的電漿發射的一組光訊號；統計確定與該組光訊號相關聯的一或多個參考訊號強度；及至少基於超過閾值的給定訊號強度以識別與該瞬態現象相對應的光訊號，該閾值係高於經統計確定的該一或多個參考訊號強度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and apparatus for detecting a transient phenomenon are provided. In some embodiments, techniques may include: obtaining, via a photosensor configured to detect optical signals lasting 100 nanoseconds or less, a set of optical signals emitted at a processing apparatus during steady state operation of the processing apparatus; statistically determining one or more reference signal intensities associated with the set of optical signals; and identifying an optical signal corresponding to the transient phenomenon based at least on a given signal intensity exceeding a threshold that is higher than the statistically determined one or more reference signal intensities.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:處理設備</p>  
        <p type="p">301:半導體基板</p>  
        <p type="p">302:處理腔室</p>  
        <p type="p">303:電漿</p>  
        <p type="p">304:光學感測器</p>  
        <p type="p">305a:視口</p>  
        <p type="p">305b:視口</p>  
        <p type="p">306:光訊號分析器</p>  
        <p type="p">307:光纖</p>  
        <p type="p">308:控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1092" publication-number="202614669"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614669.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614669</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118061</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>除電器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">H05F3/04</main-classification>  
        <further-classification edition="200601120251223B">H01T23/00</further-classification>  
        <further-classification edition="200601120251223B">H01T19/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商基恩斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEYENCE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坪田晋伍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁世英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">使工件中感應電壓的產生防止部件與電極針之間的距離能夠穩定化。在除電器1中，通過設置在電極針33前側Df(+)（針尖端方向）的多個針帽部件3各自的導電板6（前面防止部件），可以防止工件中感應電壓的產生。而且，通過設置多個導電板6，可以使各導電板6在寬度方向Dw上形成短小。因此，可以抑制導電板6的彎曲，使導電板6與電極針33之間的距離能夠穩定化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:針帽部件</p>  
        <p type="p">4:基座部</p>  
        <p type="p">5:前蓋</p>  
        <p type="p">6:導電板</p>  
        <p type="p">31:流路部件</p>  
        <p type="p">33:電極針</p>  
        <p type="p">35:板彈簧</p>  
        <p type="p">38:螺絲</p>  
        <p type="p">41:法蘭部</p>  
        <p type="p">45:桿部</p>  
        <p type="p">62:外框</p>  
        <p type="p">311:部件本體</p>  
        <p type="p">312:法蘭</p>  
        <p type="p">331:尖端</p>  
        <p type="p">332:尖端部</p>  
        <p type="p">333:圓筒部</p>  
        <p type="p">411:法蘭框架</p>  
        <p type="p">412:前端面</p>  
        <p type="p">413:底面</p>  
        <p type="p">414:壁面</p>  
        <p type="p">415:錐形壁面</p>  
        <p type="p">418:螺絲插入孔</p>  
        <p type="p">419:端面</p>  
        <p type="p">451:桿框架</p>  
        <p type="p">452:法蘭</p>  
        <p type="p">453:錐形壁面</p>  
        <p type="p">454:壁面</p>  
        <p type="p">458:嚙合突起</p>  
        <p type="p">524:螺絲蓋</p>  
        <p type="p">525:螺絲插入孔</p>  
        <p type="p">A452:插入口</p>  
        <p type="p">C:中心軸</p>  
        <p type="p">Df(+):前側</p>  
        <p type="p">Df:送風方向</p>  
        <p type="p">f:流路</p>  
        <p type="p">F:流路</p>  
        <p type="p">F1:大徑流道</p>  
        <p type="p">Fs:小徑流道</p>  
        <p type="p">Ft:錐形流道</p>  
        <p type="p">Hf:貫通孔</p>  
        <p type="p">Hn:插入孔</p>  
        <p type="p">Hnl:圓筒插入孔</p>  
        <p type="p">Hnt:錐形插入孔</p>  
        <p type="p">Hp:貫通孔</p>  
        <p type="p">Hr:貫通孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1093" publication-number="202614402"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614402.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614402</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118081</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含整合裝置、基材、及散熱器的封裝</chinese-title>  
        <english-title>PACKAGE COMPRISING AN INTEGRATED DEVICE, A SUBSTRATE AND A HEAT SINK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L23/373</main-classification>  
        <further-classification edition="200601120251226B">H01L23/31</further-classification>  
        <further-classification edition="200601120251226B">H01L23/495</further-classification>  
        <further-classification edition="200601120251226B">H01L23/498</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　志杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHIJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫馬爾　拉杰尼許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, RAJNEESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾德雷特　曼紐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALDRETE, MANUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承宰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SANG-JAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金星浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SEONGHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種封裝，其包含：一第一基材；一整合裝置，其耦接至該基材；一第二基材，其透過至少複數個焊料互連件耦接至該第一基材，其中該第二基材位於該整合裝置的一部分上方；及一散熱器，其透過一熱界面材料耦接至該整合裝置的一背側，其中該散熱器位於該整合裝置的另一部分上方，其中該散熱器位於該第二基材的側邊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package comprising a first substrate; an integrated device coupled to the substrate; a second substrate coupled to the first substrate through at least a plurality of solder interconnects, wherein the second substrate is located over a portion of the integrated device; and a heat sink coupled to a back side of the integrated device through a thermal interface material, wherein the heat sink is located over another portion of the integrated device, wherein the heat sink is located laterally to the second substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:板</p>  
        <p type="p">102:基材</p>  
        <p type="p">104:基材</p>  
        <p type="p">105:整合裝置</p>  
        <p type="p">106:囊封層</p>  
        <p type="p">107:黏著劑</p>  
        <p type="p">109:熱界面材料</p>  
        <p type="p">110:板介電層</p>  
        <p type="p">114:焊料互連件</p>  
        <p type="p">120:介電層</p>  
        <p type="p">121:互連件</p>  
        <p type="p">126:阻焊層</p>  
        <p type="p">128:阻焊層</p>  
        <p type="p">140:介電層</p>  
        <p type="p">141:互連件</p>  
        <p type="p">146,148:阻焊層</p>  
        <p type="p">150:柱互連件</p>  
        <p type="p">152:焊料互連件</p>  
        <p type="p">156:底部填充物</p>  
        <p type="p">160:球互連件</p>  
        <p type="p">162:焊料互連件</p>  
        <p type="p">200:封裝</p>  
        <p type="p">201:封裝</p>  
        <p type="p">202:基材</p>  
        <p type="p">203:散熱器</p>  
        <p type="p">205a,205b,205c,205d:整合裝置</p>  
        <p type="p">206:囊封層</p>  
        <p type="p">214:焊料互連件</p>  
        <p type="p">220:介電層</p>  
        <p type="p">221:互連件</p>  
        <p type="p">250:打線接合</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1094" publication-number="202614670"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614670.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614670</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118103</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於產生ＥＵＶ輻射或用於進行核融合的裝置、設備和方法，以及用於製造微晶片或製造微晶片的半導體中間產品的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H05G2/00</main-classification>  
        <further-classification edition="200601120260102B">G03F7/20</further-classification>  
        <further-classification edition="200601120260102B">H01S3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商創浦半導體製造雷射系統歐洲股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRUMPF LASERSYSTEMS FOR SEMICONDUCTOR MANUFACTURING SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布須納　言斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRUNNE, JENS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種藉由以複數個雷射光束(20、22、24)照射一靶材(28)來產生EUV輻射或進行核融合的裝置(26)。該裝置(26)包括一靶室(32)、一導引裝置(38)、及一操作裝置(46)，該靶室包括一內腔(34)，該內腔具有一標的區域(36)，用於以複數個雷射光束(20、22、24)照射該靶材(28)，該導引裝置(38)係用於導引該靶材(28)至該標的區域(36)，該操作裝置(46)係用於在該標的區域(36)中形塑及/或定位該靶材(28)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:EUV輻射產生設備</p>  
        <p type="p">12:雷射光束產生裝置</p>  
        <p type="p">14:第一雷射源/雷射源</p>  
        <p type="p">16:第二雷射源/雷射源</p>  
        <p type="p">18:第三雷射源/雷射源</p>  
        <p type="p">20:第一雷射光束/雷射光束</p>  
        <p type="p">22:第二雷射光束/雷射光束</p>  
        <p type="p">24:第三雷射光束/雷射光束</p>  
        <p type="p">26:裝置</p>  
        <p type="p">28:靶材</p>  
        <p type="p">30:光束導引裝置</p>  
        <p type="p">32:靶室</p>  
        <p type="p">34:內腔</p>  
        <p type="p">36:標的區域</p>  
        <p type="p">38:導引裝置</p>  
        <p type="p">40:噴嘴</p>  
        <p type="p">42:噴嘴孔</p>  
        <p type="p">44:移動方向</p>  
        <p type="p">46:操作裝置</p>  
        <p type="p">48:控制裝置</p>  
        <p type="p">50:檢測器</p>  
        <p type="p">52:傳播方向</p>  
        <p type="p">56:第一方向分量</p>  
        <p type="p">58:第二方向分量</p>  
        <p type="p">60:傳播方向</p>  
        <p type="p">62:第一方向分量</p>  
        <p type="p">64:第二方向分量</p>  
        <p type="p">66:角</p>  
        <p type="p">68:捕捉裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1095" publication-number="202613985"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613985.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613985</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118107</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自動櫃員設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G07F19/00</main-classification>  
        <further-classification edition="202301120251230B">G06Q40/02</further-classification>  
        <further-classification edition="200601120251230B">G06K7/10</further-classification>  
        <further-classification edition="200601120251230B">G06K7/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臺灣銀行股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANK OF TAIWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程筱玟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HSIAO-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊祺雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自動櫃員設備，配合一金融伺服器運作。金融伺服器儲存多筆金融帳戶資料，每一金融帳戶資料具有至少一筆提款紀錄。自動櫃員設備包含一控制單元、一顯示單元、一操作介面、一儲鈔單元及一取鈔單元。其中，操作介面接收一帳戶驗證資料，使自動櫃員設備連線至金融伺服器執行一帳戶驗證程序。操作介面接收一用於指示一提領金額資訊的操作指令。控制單元依據符合帳戶驗證資料之金融帳戶資料的提款紀錄，產生一符合提領金額資訊的選鈔組合建議資訊，並令顯示單元顯示選鈔組合建議資訊。選鈔組合建議資訊包括總金額對應於提領金額資訊的至少一種貨幣的提領數量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:自動櫃員設備</p>  
        <p type="p">200:金融伺服器</p>  
        <p type="p">1:控制單元</p>  
        <p type="p">2:顯示單元</p>  
        <p type="p">3:操作介面</p>  
        <p type="p">4:儲鈔單元</p>  
        <p type="p">5:取鈔單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1096" publication-number="202613618"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613618.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613618</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118143</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251110B">G02B6/12</main-classification>  
        <further-classification edition="200601120251110B">G02B6/24</further-classification>  
        <further-classification edition="200601120251110B">G06N3/067</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃泰鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TAI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯蘇　斯帝芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUSU, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置包括一第一轉換器結構、一第二轉換器結構及一第一波導部分。該第一轉換器結構用以調變一光學光以產生一第一經調變光。該第二轉換器結構用以調變該第一經調變光以產生一第二經調變光。該第一波導部分用以使該第一經調變光自該第一轉換器結構透射至該第二轉換器結構，且沿著一第一方向為狹長的。該第一轉換器結構、該第一波導部分及該第二轉換器結構沿著該第一方向按次序配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a first converter structure, a second converter structure and a first waveguide portion. The first converter structure is configured to modulate an optical light to generate a first modulated light. The second converter structure is configured to modulate the first modulated light to generate a second modulated light. The first waveguide portion is configured to transmit the first modulated light from the first converter structure to the second converter structure, and elongated along a first direction. The first converter structure, the first waveguide portion, and the second converter structure are arranged along the first direction in order.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:用於製造上述半導體裝置之方法</p>  
        <p type="p">OP61~OP64:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1097" publication-number="202612699"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612699.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612699</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118195</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組合療法</chinese-title>  
        <english-title>COMBINATION THERAPY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/506</main-classification>  
        <further-classification edition="200601120260102B">A61K31/397</further-classification>  
        <further-classification edition="200601120260102B">A61K31/505</further-classification>  
        <further-classification edition="200601120260102B">A61K31/194</further-classification>  
        <further-classification edition="200601120260102B">A61P3/06</further-classification>  
        <further-classification edition="200601120260102B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商阿斯特捷利康公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASTRAZENECA AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅森邁爾　賈亞比吉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROSENMEIER, JAYA BIRGITTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫特德卡梅霍　伊娃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HURT DE CAMEJO, EVA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥卡錫　麥可查爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCCARTHY, MICHAEL CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種降低LDL-C水準、降低心血管風險及/或治療心血管疾病之方法，該方法包含向有需要之對象投予第一量的AZD0780或其醫藥上可接受之鹽、及第二量的依澤替米貝或其醫藥上可接受之鹽，其中該第一量及該第二量一起構成治療有效量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of lowering LDL-C levels, reducing cardiovascular risk and/or treatment of a cardiovascular disease, comprising administering to a subject in need thereof, a first amount of AZD0780 or a pharmaceutically acceptable salt thereof and a second amount of ezetimibe or a pharmaceutically acceptable salt thereof, wherein the first amount and the second amount together comprise a therapeutically effective amount.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1098" publication-number="202613158"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613158.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613158</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118214</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>免疫受體抑制蛋白及相關方法</chinese-title>  
        <english-title>IMMUNORECEPTOR INHIBITORY PROTEINS AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K14/705</main-classification>  
        <further-classification edition="200601120260102B">C07K14/55</further-classification>  
        <further-classification edition="200601120260102B">C12N15/63</further-classification>  
        <further-classification edition="200601120260102B">C12N5/10</further-classification>  
        <further-classification edition="200601120260102B">A61K39/00</further-classification>  
        <further-classification edition="200601120260102B">A61K38/20</further-classification>  
        <further-classification edition="200601120260102B">A61P29/00</further-classification>  
        <further-classification edition="200601120260102B">A61P37/00</further-classification>  
        <further-classification edition="200601120260102B">A61P31/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商旗艦先鋒創新有限責任(ＶＩＩ)公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLAGSHIP PIONEERING INNOVATIONS VII, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班度克瓦拉　荷茲法　賽夫丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANDUKWALA, HOZEFA SAIFUDDIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾斯克納斯　麥可　霍恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASKENASE, MICHAEL HORNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布萊特斯　伯撕　蘇菲亞　馬奎斯　度娜　里貝洛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRITES BOSS, SOFIA MARQUES TUNA RIBEIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普里亞達爾希尼　哈瓦那</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRIYADHARSHINI, BHAVANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米蘭達　德爾加多　威廉斯　歐內斯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIRANDA DELGADO, WILLIAMS ERNESTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾頓　安吉拉　溫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NORTON, ANGELA WYNNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃裕煦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供免疫受體抑制蛋白及包含其之組合物(例如醫藥組合物)；以及製備該等免疫受體抑制蛋白及組合物之方法。本文提供之免疫受體抑制蛋白適用於醫藥組合物及使用方法(包括例如抑制一或多個TNFRSF成員與一或多個TNFLSF成員之結合(例如TNFα與TNFR1及/或TNFR2之結合；及/或LTα與TNFR1及/或TNFR2之結合))。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are immunoreceptor inhibitory proteins and compositions (&lt;i&gt;e.g.,&lt;/i&gt; pharmaceutical compositions) comprising the same; as well as methods of making the immunoreceptor inhibitory proteins and compositions. The immunoreceptor inhibitory proteins provided herein are useful in pharmaceutical compositions and methods of use (including, &lt;i&gt;e.g.,&lt;/i&gt; inhibiting binding of one or more TNFRSF member to one or more TNFLSF member (&lt;i&gt;e.g.,&lt;/i&gt; binding of TNFα to TNFR1 and/or TNFR2; and/or binding of LTα to TNFR1 and/or TNFR2).</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1099" publication-number="202613165"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613165.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613165</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118216</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有IL-11和IL-17結合特異性的多特異性抗體</chinese-title>  
        <english-title>MULTISPECIFIC ANTIBODY WITH BINDING SPECIFICITY FOR IL-11 AND IL-17</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/24</main-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="200601120260102B">A61P29/00</further-classification>  
        <further-classification edition="200601120260102B">A61P17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比利時商ＵＣＢ生物製藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UCB BIOPHARMA SRL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏哈塔　帕拉畢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHATTA, PALLAVI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比亞拉斯　雅莉珊德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIALAS, ALEKSANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑舍　里歐　亞歷山德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOWSHER, LEO ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>愛德華茲　漢娜　伊莉莎白</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDWARDS, HANNAH ELIZABETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡弗瑞斯　大衛　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUMPHREYS, DAVID PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汗　阿德南　拉赫曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHAN, ADNAN RAHMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬吉奧利　艾麗莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAGGIOLI, ELISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彼得斯　雪莉　珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETERS, SHIRLEY JANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>惠特克　索菲亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHITTAKER, ZOFIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明技術係關於抑制IL-11介導之信號傳導以及IL-17A及/或IL-17F介導之信號傳導的多特異性抗體。該技術提供醫藥組合物，其包含抑制IL-11介導之信號傳導的抗體及抑制IL-17A及/或IL-17F介導之信號傳導的抗體。該技術亦關於抑制IL-11介導之信號傳導以及IL-17A及/或IL-17F介導之信號傳導的IL-11與IL-17A及/或IL-17F抑制抗體之組合或多特異性抗體或藥劑的治療性用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present technology relates to multispecific antibodies that inhibit both IL-11 mediated signaling and IL-17A and/or IL-17F mediated signaling. The technology provides pharmaceutical compositions comprising an antibody that inhibits IL-11 mediated signaling and an antibody that inhibits IL-17A and/or IL-17F mediated signaling. The technology further relates to therapeutic uses of a combination of IL-11 and IL-17A and/or IL-17F inhibiting antibodies or multispecific antibodies or agents that inhibit both IL-11 mediated signaling and IL-17A and/or IL-17F mediated signaling.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1100" publication-number="202613149"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613149.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613149</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118218</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>治療感染之組合物及方法</chinese-title>  
        <english-title>COMPOSITIONS AND METHODS FOR TREATING INFECTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K7/62</main-classification>  
        <further-classification edition="200601120260102B">A61K38/12</further-classification>  
        <further-classification edition="200601120260102B">A61P31/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商布里生物科學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRII BIOSCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　雅麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, YALI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪高里斯　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARGOLIS, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顧　培娣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, PEIDI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於治療細菌感染之組合物及方法，該等細菌感染包括藉由傳統藥物治療具難度之細菌感染，諸如醫院獲得性細菌性肺炎(hospital acquired bacterial pneumonia，HABP)、呼吸器相關細菌性肺炎(ventilator associated bacterial pneumonia，VABP)、及由碳青黴烯(carbapenem)抗性細菌(諸如鮑氏不動桿菌(&lt;i&gt;Acinetobacter baumannii&lt;/i&gt;)及綠膿桿菌(&lt;i&gt;Pseudomonas aeruginosa&lt;/i&gt;))引起之菌血症。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Compositions and methods are provided for treating bacterial infections, including those that are challenging to treat by conventional medications, such as hospital acquired bacterial pneumonia (HABP), ventilator associated bacterial pneumonia (VABP), and bacteremia, caused by carbapenem-resistant bacteria such as &lt;i&gt;Acinetobacter baumannii&lt;/i&gt; and &lt;i&gt;Pseudomonas aeruginosa.&lt;/i&gt;</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1101" publication-number="202612739"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612739.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612739</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118245</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗Ｂ７－Ｈ３抗體－藥物結合物與雄性素受體傳訊抑制劑之組合</chinese-title>  
        <english-title>COMBINATION OF ANTI-B7-H3 ANTIBODY-DRUG CONJUGATE AND ANDROGEN RECEPTOR SIGNALING INHIBITOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260102B">A61K47/68</main-classification>  
        <further-classification edition="200601120260102B">A61K31/4166</further-classification>  
        <further-classification edition="200601120260102B">A61K31/58</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一三共股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIICHI SANKYO COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商默沙東有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK SHARP &amp; DOHME LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷川純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEGAWA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>服部千春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATTORI, CHIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今井健太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAI, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波萊　克里斯丁Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POEHLEIN, CHRISTIAN H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一些態樣中，提供一種醫藥產品，其包含用於組合投予之抗B7-H3抗體-藥物結合物與雄性素受體傳訊抑制劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In some aspects, a pharmaceutical product comprising an anti-B7-H3 antibody-drug conjugate and an androgen receptor signaling inhibitor for administration in combination is provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1102" publication-number="202613501"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613501.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613501</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118247</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣體流量測定裝置、溫度測定裝置、被測定氣體流量之測定方法、及被測定氣體之溫度之測定方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G01F1/692</main-classification>  
        <further-classification edition="202101120251230B">G01K13/024</further-classification>  
        <further-classification edition="200601120251230B">G01N25/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井金屬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI KINZOKU COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松尾陽樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUO, HARUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹村翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEMURA, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井手慎吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDE, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之氣體流量測定裝置(10)具備：發熱電阻體(31)，其藉由通電產生熱；載台(21)，其支持發熱電阻體(31)；及周緣部(24)，其在俯視下與載台(21)相隔且圍繞載台(21)。發熱電阻體(31)在俯視下與載台(21)重疊。氣體流量測定裝置(10)基於發熱電阻體(31)之電阻值來測定被測定氣體之流量。發熱電阻體(31)及載台(21)之合計熱容量較佳為1.0×10&lt;sup&gt;-10&lt;/sup&gt; J/K以上且3.2×10&lt;sup&gt;-2&lt;/sup&gt; J/K以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:氣體流量測定裝置</p>  
        <p type="p">20:橋接件構造體</p>  
        <p type="p">21:載台</p>  
        <p type="p">22:橋接件</p>  
        <p type="p">24:周緣部</p>  
        <p type="p">32:焊墊</p>  
        <p type="p">34:第二密接層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1103" publication-number="202614624"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614624.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614624</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118260</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>相機致動器及包括其之相機模組</chinese-title>  
        <english-title>CAMERA ACTUATOR AND CAMERA MODULE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251217B">H04N23/54</main-classification>  
        <further-classification edition="202301120251217B">H04N23/52</further-classification>  
        <further-classification edition="202101120251217B">G03B17/02</further-classification>  
        <further-classification edition="201401120251217B">B23K26/21</further-classification>  
        <further-classification edition="202301120251217B">H04N23/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭丈熏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, JANG HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金泰坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAE GON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林翼台</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, YIK TAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一相機模組，包含：一第一相機致動器和一第二相機致動器；一遮蔽罩設置在該第一相機致動器和該第二相機致動器外；以及一托架，置於該遮蔽罩外，其中，該遮蔽罩包括彼此間隔開的複數個焊接部，及該複數個焊接部的每一個包括複數突起。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An embodiment discloses a camera module which includes a first camera actuator, a second camera actuator, a shield can disposed outside the first camera actuator and the second camera actuator, and a bracket disposed outside the shield can, wherein the shield can includes a plurality of welding portions spaced apart from each other, and each of the plurality of welding portions includes a plurality of protrusions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:相機模組</p>  
        <p type="p">1300:電路板</p>  
        <p type="p">CV:蓋子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1104" publication-number="202614049"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614049.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614049</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118326</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分散式磁阻式隨機存取記憶體之陣列架構</chinese-title>  
        <english-title>ARRAY ARCHITECTURE FOR DISTRIBUTED MRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G11C11/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾爾斯賓科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVERSPIN TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩德　麥可　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SADD, MICHAEL A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威廉斯　雅各　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLIAMS, JACOB T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾朗姆　席德　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALAM, SYED M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種記憶體裝置，其包含一陣列電路，該陣列電路包含具有一邏輯狀態之一磁性穿隧接面(MTJ)位元且包含一組MTJ。該記憶體裝置進一步包含一讀取裝置，該讀取裝置電連接至該MTJ位元且經組態以讀取該MTJ位元之該邏輯狀態。該記憶體裝置包含一寫入電路，該寫入電路電連接至該MTJ位元且經組態以寫入該MTJ位元之該邏輯狀態。該陣列電路在藉由該讀取裝置及/或該寫入電路對該MTJ位元進行之操作之間斷電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device including an array circuit including a magnetic tunnel junction (MTJ) bit having a logical state and including a set of MTJs is provided. The memory device further includes a read device electrically connected to the MTJ bit and configured to read the logical state of the MTJ bit. The memory device includes a write circuit electrically connected to the MTJ bit and configured to write the logical state of the MTJ bit. The array circuit is powered off between operations on the MTJ bit by the read device and/or the write circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:記憶體裝置</p>  
        <p type="p">302:磁性穿隧接面(MTJ)</p>  
        <p type="p">310:磁性穿隧接面(MTJ)位元</p>  
        <p type="p">312:第一磁性穿隧接面(MTJ)陣列</p>  
        <p type="p">314:第二磁性穿隧接面(MTJ)陣列</p>  
        <p type="p">320:自舉電晶體</p>  
        <p type="p">322:讀取裝置(鎖存器)</p>  
        <p type="p">324:源極線(SL)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1105" publication-number="202612759"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612759.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612759</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118347</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可調式啞鈴結構及其槓片與槓片解鎖方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250531B">A63B21/072</main-classification>  
        <further-classification edition="200601120250531B">A63B21/075</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>百盛全球股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商特里法健身有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRIPHA FITNESS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳保江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳韋安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳宏亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱謙成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可調式啞鈴結構，包含一有複數槓片的可調式重量單元、一有至少一結合件的握持組件，以及一操控件，槓片二側分別有第一、二結合部，槓片之間以第一、二結合部相互結合，結合件有一能與槓片的第一或二結合部結合的第三結合部，第一、二結合部分別為凸結合部及凹結合部，第三結合部為凸結合部或凹結合部，凸結合部有一內部空間、一設於其中的扣片，以及與內部空間連通的操作開口及鎖扣開口，凹結合部有一能與扣片卡接的卡扣槽，自操作開口伸入內部空間的操控件能將扣片在鎖扣與非鎖扣位置之間切換，讓使用者可快速且便利地調整槓片數量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:可調式啞鈴結構</p>  
        <p type="p">10:架座</p>  
        <p type="p">11:框件</p>  
        <p type="p">12:定位件</p>  
        <p type="p">123:第四結合部</p>  
        <p type="p">20:可調式重量單元</p>  
        <p type="p">21:槓片</p>  
        <p type="p">211:第一結合部</p>  
        <p type="p">212:第二結合部</p>  
        <p type="p">30:握持組件</p>  
        <p type="p">31:握柄</p>  
        <p type="p">32:結合件</p>  
        <p type="p">321:第三結合部</p>  
        <p type="p">40:操控件</p>  
        <p type="p">50:凸結合部</p>  
        <p type="p">60:凹結合部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1106" publication-number="202614795"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614795.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614795</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118360</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND THE METHOD OF FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120250722B">H10D30/01</main-classification>  
        <further-classification edition="202501120250722B">H10D30/60</further-classification>  
        <further-classification edition="200601120250722B">H01L21/302</further-classification>  
        <further-classification edition="200601120250722B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭存甫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHUN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括以下步驟：形成互補式場效電晶體，包含以下步驟：形成下源極/汲極區域及在該下源極/汲極區域上方形成上源極/汲極區域。執行蝕刻製程以蝕穿該上源極/汲極區域且形成接觸開口。該蝕刻製程終止在該下源極/汲極區域的頂表面上。該方法進一步包括以下步驟：在該接觸開口中形成介電接觸間隔物；在該下源極/汲極區域上方形成第一矽化物層；在該第一矽化物層上方形成接觸插塞且與該第一矽化物層接觸；及在該下源極/汲極區域的底表面下方形成第二矽化物層且與該下源極/汲極區域的底表面接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a complementary field-effect transistor comprising forming a lower source/drain region, and forming an upper source/drain region over the lower source/drain region. An etching process is performed to etch-through the upper source/drain region and to form a contact opening. The etching process is stopped on a top surface of the lower source/drain region. The method further includes forming a dielectric contact spacer in the contact opening, forming a first silicide layer over the lower source/drain region, forming a contact plug over and contacting the first silicide layer, and forming a second silicide layer underlying and contacting a bottom surface of the lower source/drain region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:晶圓</p>  
        <p type="p">10-A~10-C:CFET</p>  
        <p type="p">32:介電隔離區域</p>  
        <p type="p">45:鰭形間隔物</p>  
        <p type="p">62L-A~62L-C:下源極/汲極區域</p>  
        <p type="p">62U-A~62U-C:上源極/汲極區域</p>  
        <p type="p">66:第一CESL</p>  
        <p type="p">68:第一ILD</p>  
        <p type="p">70:第二CESL</p>  
        <p type="p">72:第二ILD</p>  
        <p type="p">100-A~100-C:裝置區域</p>  
        <p type="p">110、130:介電接觸間隔物</p>  
        <p type="p">114-A、114-B、132-A、132-C、152-A~152-C:矽化物層</p>  
        <p type="p">116-A、116-B:直通接觸插塞</p>  
        <p type="p">118、136:阻障層</p>  
        <p type="p">120、138:金屬材料</p>  
        <p type="p">124、140:蝕刻終止層</p>  
        <p type="p">126、142、160:介電層</p>  
        <p type="p">134-A~134-C:上源極/汲極接觸插塞</p>  
        <p type="p">144、162:導電特徵</p>  
        <p type="p">150:介電基板</p>  
        <p type="p">153:背側接觸間隔物</p>  
        <p type="p">154-A~154-C:下源極/汲極接觸插塞</p>  
        <p type="p">156、158:層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1107" publication-number="202613723"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613723.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613723</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118378</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>校準基板、判定待裝載於基板支撐件上之基板之偏移校正之方法、基板支撐件及校準基板之組合及基板處理裝置</chinese-title>  
        <english-title>CALIBRATION SUBSTRATE, METHOD TO DETERMINE AN OFFSET CORRECTION FOR A SUBSTRATE TO BE LOADED ON A SUBSTRATE SUPPORT, COMBINATION OF A SUBSTRATE SUPPORT AND A CALIBRATION SUBSTRATE, AND SUBSTRATE HANDLING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">G03F7/20</main-classification>  
        <further-classification edition="200601120251217B">G03F9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波伊茲　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POIESZ, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭托尼　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PONTONI, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯坦　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEIN, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭月明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, YUEMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏克斯　瑞克　羅伯特　艾米利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERCX, RICK ROBERT EMILIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維喬彭　馬雷克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VYCHOPEN, MAREK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費奇　提姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FETHKE, TIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安捷倫　約翰尼斯　貝爾納杜斯　查爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENGELEN, JOHANNES BERNARDUS CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於判定待裝載於一基板支撐件上之一基板之一偏移校正的校準基板，該基板支撐件包含複數個瘤節以支撐該基板，該複數個瘤節包含邊緣支撐瘤節以支撐該基板之一邊緣區域， &lt;br/&gt;其中該校準基板之待支撐於該複數個瘤節上之一支撐側具備包含一或多個隆脊之一高度輪廓，其中，當該校準基板在該基板支撐件上正確地居中時，該高度輪廓之該一或多個隆脊配置成接近於多個邊緣支撐瘤節。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a calibration substrate for determining an offset correction for a substrate to be loaded on a substrate support, the substrate support comprising a plurality of burls to support the substrate, the plurality of burls comprising edge supporting burls to support an edge area of the substrate, &lt;br/&gt;wherein a support side of the calibration substrate to be supported on the plurality of burls is provided with a height profile comprising one or more ridges, wherein, when the calibration substrate is correctly centered on the substrate support, the one or more ridges of the height profile are arranged close to a number of edge supporting burls.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:校準基板</p>  
        <p type="p">201:支撐側</p>  
        <p type="p">202:量測側</p>  
        <p type="p">203:隆脊/圓形邊緣</p>  
        <p type="p">204:第一塗層</p>  
        <p type="p">205:主體</p>  
        <p type="p">206:第二塗層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1108" publication-number="202612784"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612784.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612784</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118380</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於表徵長效可注射藥物之釋放曲線之系統、方法、及設備</chinese-title>  
        <english-title>SYSTEMS, METHODS, AND APPARATUSES FOR CHARACTERIZING RELEASE PROFILES FOR LONG-ACTING INJECTABLE MEDICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">B01L3/00</main-classification>  
        <further-classification edition="200601120260102B">G01N33/15</further-classification>  
        <further-classification edition="201901120260102B">G16C20/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商基利科學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GILEAD SCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福蒂　克里斯多夫　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOTI, CHRISTOPHER J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格雷沙姆　羅伯特　Ｃ　Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRESHAM, ROBERT C.H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亨曼威　傑弗瑞　Ｎ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEMENWAY, JEFFREY N.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何　田</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, TIEN D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈因　克魯蒂卡　哈里許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAIN, KRUTIKA HARISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫斯　圖恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHUTH, THOEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧利瓦雷斯　哈戈皮安　瑪麗亞　維多利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLIVARES HAGOPIAN, MARIA VICTORIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕瓦　帕拉維　普拉哈德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAWAR, PALLAVI PRALHAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦　宇傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIN, YUJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅伊　查理斯　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROWE, CHARLES W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史特羅　伊森　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STROH, ETHAN L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAN, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露描述用於開發長效可注射藥物配方之技術。更具體而言，該技術包括用於預測患者中之藥物釋放曲線之系統及方法。重要的是，本文所提供之技術使得能夠實質上縮短長效可注射藥物配方之開發時間軸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure described technology for developing long-acting injectable drug formulations. More specifically, the technology includes systems and methods for predicting a drug release profile in a patient. Importantly, the technologies provided herein enable substantially shortened development timelines for long-acting injectable drug formulations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:樣本接收器</p>  
        <p type="p">202:支架/水凝膠</p>  
        <p type="p">210:表面</p>  
        <p type="p">220:凹陷部</p>  
        <p type="p">221:凹陷部側壁</p>  
        <p type="p">222:凹陷部底板</p>  
        <p type="p">240:結構支撐件/支撐結構</p>  
        <p type="p">241:底板</p>  
        <p type="p">242:直立側壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1109" publication-number="202614284"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614284.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614284</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118382</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於晶粒接合自對準之系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR DIE BONDING SELF-ALIGNMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/67</main-classification>  
        <further-classification edition="200601120251226B">H01L21/68</further-classification>  
        <further-classification edition="200601120251226B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德　賈格　皮耶特　威廉　荷曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE JAGER, PIETER WILLEM HERMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡駑戈帕蘭　斯安　帕拉雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VENUGOPALAN, SYAM PARAYIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿森德爾夫特　喬普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASSENDELFT, JOEP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">現有晶粒至晶圓接合工具使用經導引對準以定位該等晶粒。一供體晶粒位置及其在一受體晶圓上之接合部位經量測，且用作一接合轉移機構之輸入。該等量測及該轉移機構促成置放誤差。晶粒至晶圓接合準確度要求正增加，其中通常需要置放準確度低至50 nm及以下。用現有晶粒至晶圓接合工具達成此準確度係具有挑戰性的。因此，已開發用於晶粒接合自對準之新系統及方法。如同經導引對準，一轉移機構使該供體晶粒移動至一受體晶圓上之一所要受體部位附近，但接著一自對準機構在該接合期間控制該晶粒與該受體晶圓之間的一相對位置。與現有晶粒至晶圓接合工具相比，此提高接合置放準確度，以及其他優勢。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Existing die-to-wafer bonding tools use guided alignment to position the dies. A donor die position and its bonding location on an acceptor wafer are measured, and used as input for a bonding transfer mechanism. The measurements and the transfer mechanism contribute to placement errors. Die-to-wafer bonding accuracy requirements are increasing, with placement accuracy down to 50 nm and below often required. Achieving this accuracy with existing die-to-wafer bonding tools is challenging. As a result, new systems and methods for die bonding self-alignment have been developed. As with guided alignment, a transfer mechanism moves the donor die in proximity to a desired acceptor location on an acceptor wafer, but then a self-alignment mechanism controls a relative position between the die and the acceptor wafer during the bonding. This enhances bonding placement accuracy compared to existing die-to-wafer bonding tools, among other advantages.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400A:結構</p>  
        <p type="p">400B:結構</p>  
        <p type="p">400C:結構</p>  
        <p type="p">401A:第一自對準圖案</p>  
        <p type="p">401B:第一自對準圖案</p>  
        <p type="p">401C:第一自對準圖案</p>  
        <p type="p">405A:第二自對準圖案</p>  
        <p type="p">405B:第二自對準圖案</p>  
        <p type="p">405C:第二自對準圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1110" publication-number="202613368"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613368.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613368</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118387</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製備有機晶體之方法</chinese-title>  
        <english-title>METHOD FOR PREPARING ORGANIC CRYSTALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C30B7/08</main-classification>  
        <further-classification edition="200601120260102B">C30B29/54</further-classification>  
        <further-classification edition="200601120260102B">C09K19/12</further-classification>  
        <further-classification edition="200601120260102B">C09K19/16</further-classification>  
        <further-classification edition="200601120260102B">C09K19/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬克專利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍克　朱利安　哈拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOECKER, JULIAN HARALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗里茲需　卡斯登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRITZSCH, CARSTEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克蕾森　梅莫　梅蘭妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLASEN-MEMMER, MELANIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯梅爾　賽巴斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOFMEYER, SEBASTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於基於含有有機分子之前體溶液製備有機晶體之方法、自該等方法獲得之結晶固體及該等結晶材料在光學膜及電光裝置中之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to methods for preparing organic crystals based on precursor solutions containing organic molecules, to crystalline solids obtained from the methods and to the use of the crystalline materials in optical films and electro-optical devices.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1111" publication-number="202613199"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613199.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613199</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118390</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>有機晶體及光學膜</chinese-title>  
        <english-title>ORGANIC CRYSTALS AND OPTICAL FILMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C08F220/00</main-classification>  
        <further-classification edition="200601120251229B">C09K19/00</further-classification>  
        <further-classification edition="200601120251229B">C09K19/34</further-classification>  
        <further-classification edition="200601120251229B">C30B29/58</further-classification>  
        <further-classification edition="200601120251229B">C30B7/08</further-classification>  
        <further-classification edition="200601220251229B">C09K19/14</further-classification>  
        <further-classification edition="200601220251229B">C09K19/16</further-classification>  
        <further-classification edition="200601220251229B">C09K19/30</further-classification>  
        <further-classification edition="200601220251229B">C09K19/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬克專利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍克　朱利安　哈拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOECKER, JULIAN HARALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗里茲需　卡斯登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRITZSCH, CARSTEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞伯　麗莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REBER, LISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克蕾森　梅莫　梅蘭妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLASEN-MEMMER, MELANIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩維斯　拉費　約瑟夫　二世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PURVIS, LAFE JOSEPH, II</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博內特　維亞查斯勞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERNAT, VIACHASLAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於包括有機分子之結晶固體及該等結晶材料在光學膜及電光裝置中之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to crystalline solids comprising organic molecules and to the use of the crystalline materials in optical films and electro-optical devices.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1112" publication-number="202613737"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613737.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613737</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118400</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>標記檢測裝置、微影裝置及物品製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">G03F9/00</main-classification>  
        <further-classification edition="200601120251217B">H01L21/027</further-classification>  
        <further-classification edition="200601120251217B">G03F7/20</further-classification>  
        <further-classification edition="200601120251217B">H01L21/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸田卓司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUTA, TAKUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及標記檢測裝置、微影裝置以及物品製造方法。一種標記檢測裝置，檢測設置於基板的對準標記的位置，其中，該標記檢測裝置具備：基板載置台，保持並移動前述基板；攝像部，包括用於對前述對準標記進行照明的光源和攝像前述對準標記的圖像感測器；以及攝像控制部，與前述基板載置台同步地控制前述攝像部，前述攝像部對前述對準標記攝像的攝像條件是能夠變更的，前述攝像控制部在與前述攝像條件相應的定時對前述攝像部提供用於攝像的指令。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">107:載置台控制裝置</p>  
        <p type="p">108:原版驅動機構</p>  
        <p type="p">109:基板驅動機構</p>  
        <p type="p">112:原版</p>  
        <p type="p">113:原版載置台</p>  
        <p type="p">114:基板</p>  
        <p type="p">115:基板載置台</p>  
        <p type="p">116:雷射干涉儀</p>  
        <p type="p">117:移動鏡</p>  
        <p type="p">120:投影光學系統</p>  
        <p type="p">128:第2標記檢測裝置</p>  
        <p type="p">129:第2標記檢測裝置</p>  
        <p type="p">200:第1標記檢測裝置</p>  
        <p type="p">210:攝像部</p>  
        <p type="p">211:光源</p>  
        <p type="p">212:光源驅動器</p>  
        <p type="p">213:圖像感測器</p>  
        <p type="p">214:感測器驅動器</p>  
        <p type="p">220:攝像控制部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1113" publication-number="202613565"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613565.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613565</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118429</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有簡化結構的探針卡</chinese-title>  
        <english-title>PROBE CARD HAVING A SIMPLIFIED STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">G01R1/073</main-classification>  
        <further-classification edition="200601120251216B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商探針科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHNOPROBE S. P. A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋托裡　裡卡爾多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VETTORI, RICCARDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述了一種用於測試待測裝置的探針卡，所述探針卡具有多個接觸元件、用於容納所述接觸元件的容納結構、用於將探針卡與測試設備介接的介面板以及至少一個用於將容納結構與介面板相互連接的連接系統。所述連接系統配備有一個連接元件，所述連接元件包括：第一部分，其透過所述第一部分固定地連接到介面板；第二部分，其從介面板突出並容納在容納結構中形成的凹槽內；以及至少一個彈性元件，所述彈性元件位於凹槽內，其第一端連接到連接元件的第二部分，其第二端連接到容納結構。所述彈性元件在連接元件的作用下處於壓縮狀態，並施加反作用彈性，使容納結構和介面板保持相互接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A probe card for testing a device under test is described, said probe card having a plurality of contact elements, a containment structure configured to house the contact elements, an interface board adapted to interface the probe card with a test equipment, and at least one connection system configured to connect the containment structure and the interface board to each other. The connection system is equipped with a connection element comprising a first portion through which it is fixedly connected to the interface board, and a second portion projecting from the interface board and housed in a recess formed in the containment structure, and at least one elastic element which is inside the recess and connected, at a first end thereof, to the second portion of the connection element and, at a second end thereof, to the containment structure, said elastic element being in a compressed configuration under the action of the connection element and exerting a reaction elastic force which maintains the containment structure and the interface board in mutual contact.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:探針卡</p>  
        <p type="p">10:接觸元件</p>  
        <p type="p">DUT:待測裝置</p>  
        <p type="p">DUTp:接觸墊</p>  
        <p type="p">20:容納結構</p>  
        <p type="p">20’:殼體</p>  
        <p type="p">20g1、20g2:導引件</p>  
        <p type="p">20g1h、20gh2:導孔</p>  
        <p type="p">23:半導體晶圓</p>  
        <p type="p">30:介面板</p>  
        <p type="p">10a、10b、40b1、40b2:端</p>  
        <p type="p">40:連接系統</p>  
        <p type="p">40a:連接元件</p>  
        <p type="p">40b:彈性元件</p>  
        <p type="p">40a1、40a2:部分</p>  
        <p type="p">20r:凹槽</p>  
        <p type="p">S、S':肩部</p>  
        <p type="p">40bus:襯套</p>  
        <p type="p">30s:底座</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1114" publication-number="202612727"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612727.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612727</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118451</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>馮威里氏病之治療</chinese-title>  
        <english-title>TREATMENT OF VON WILLEBRAND DISEASE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K39/395</main-classification>  
        <further-classification edition="200601120260102B">C07K16/36</further-classification>  
        <further-classification edition="200601120260102B">A61P7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商維加醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VEGA THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘尼克　桑迪普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANICKER, SANDIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕圖　蓋瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATOU, GARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷法斯　克里斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORVATH, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示了治療有需要之個體之馮威里氏病(VWD)之方法。該等方法包括皮下或靜脈內向該個體投與治療有效量之蛋白S抗體。該抗體可使用基於體重之給藥方案各自以約0.1 mg/kg至約10 mg/kg之一或多個劑量，或使用非基於體重之給藥方案以約100 mg/劑量至約1000 mg/劑量之一或多個劑量投與。所選治療方法在向該個體投與該抗體後產生約1μg/ml至約200 μg/ml之血漿濃度，且導致該個體中凝血酶產生及/或其他藥效學生物標記增加。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are methods of treating Von Willebrand Disease (VWD) in a subject in need. The methods include administering to the subject a therapeutically effective amount of a Protein S antibody, either subcutaneously or intravenously. The antibody may be administered using a body weight-based dosing regimen with one or more doses of about 0.1 mg/kg to about 10 mg/kg each, or a non-body weight-based dosing regimen with one or more doses of about 100 mg/dose to about 1000 mg/dose. The selected treatment methods result in a plasma concentration of about 1μg/ml to about 200 μg/ml upon administration of the antibody to the subject and results in increased thrombin generation and/or other pharmacodynamic biomarkers in the subject.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1115" publication-number="202613287"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613287.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613287</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118456</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>乳液及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">C10M105/54</main-classification>  
        <further-classification edition="200601120251230B">A61K8/70</further-classification>  
        <further-classification edition="200601120251230B">C08L71/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼歐斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEOS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>市原豊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICHIHARA, YUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠利用簡便之方法進行製備之全氟聚醚羧酸之乳液。&lt;br/&gt; 一種乳液，包含：&lt;br/&gt; (A)下述式(I)所示之全氟聚醚羧酸化合物、&lt;br/&gt; (B)鹼性化合物、&lt;br/&gt; (C)醇、及&lt;br/&gt; (D)水；&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="58px" width="450px" file="ed10014.JPG" alt="ed10014.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; (式中，Rf為碳數1～4之全氟烷基；X為氟基或三氟甲基；Y為單鍵或碳數1～10之二價基；n為7～25)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1116" publication-number="202613560"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613560.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613560</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118479</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢查裝置</chinese-title>  
        <english-title>INSPECTION APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G01R1/04</main-classification>  
        <further-classification edition="200601120260102B">G01R1/07</further-classification>  
        <further-classification edition="200601120260102B">G01R1/073</further-classification>  
        <further-classification edition="200601120260102B">G01R1/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本麥克隆尼股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安田勝男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUTA, KATSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池內秀樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEUCHI, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白戸順</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRATO, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田貴智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARATA, TAKATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]將具備被檢查體的晶圓保持非接觸狀態，並且從晶圓的一面或者兩面，使被檢查體的端子可以被接觸。 &lt;br/&gt;　　[解決手段]本發明的檢查裝置，具備：晶圓固定機構部，用於支撐具有，其中一面具有光輸出入部、另外一面具有電極端子，的被檢查體的晶圓；光探針，設置在晶圓的其中一面側，並在被檢查體的光輸出入部之間進行光訊號的收發；導電探針，設置在晶圓的另外一面側，並與被檢查體的電極端子電性連接；晶圓非接觸保持部，係在中央部上有開口部的平面構件，對晶圓進行加壓空氣的吸排氣並與晶圓間保持距離，同時藉由開口部，使存取晶圓上的被檢查體成為可能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:導電探針</p>  
        <p type="p">11:導電探針組合體</p>  
        <p type="p">16:空氣軸承部</p>  
        <p type="p">20:晶圓</p>  
        <p type="p">21:光輸出入部</p>  
        <p type="p">22:電極端子</p>  
        <p type="p">30:光探針</p>  
        <p type="p">41:真空泵</p>  
        <p type="p">42:吸排氣控制部</p>  
        <p type="p">161:吸氣管</p>  
        <p type="p">162:排氣管</p>  
        <p type="p">163:吸氣孔</p>  
        <p type="p">164:排氣孔</p>  
        <p type="p">165:開口部</p>  
        <p type="p">200:半導體裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1117" publication-number="202612728"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612728.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612728</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118480</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用靶向表現HER2之腫瘤之三特異性結合蛋白治療癌症之方法</chinese-title>  
        <english-title>METHODS OF TREATING CANCER USING TRISPECIFIC BINDING PROTEINS TARGETING HER2-EXPRESSING TUMORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K39/395</main-classification>  
        <further-classification edition="200601120260102B">C07K16/28</further-classification>  
        <further-classification edition="200601120260102B">C07K16/32</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商賽諾菲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANOFI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿巴德薩　喬瓦尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABBADESSA, GIOVANNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布戴　芭芭拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUDAY, BARBARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬西亞里　瑟琳娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASCIARI, SERENA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈爾巴烏伊　法伊扎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RHARBAOUI, FAIZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　蕾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>耶爾德里姆　奧茲萊姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YILDIRIM, OZLEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供治療具有癌症的個體之方法，該方法包括向該個體投予約0.2 μg至約4500 μg的三特異性結合蛋白，其中該三特異性結合蛋白包含結合CD28多肽的第一抗原結合位點、結合CD3多肽的第二抗原結合位點以及結合HER2多肽的第三抗原結合位點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides method of treating a subject having a cancer comprising administering to the subject about 0.2 µg to about 4500 µg of a trispecific binding protein, wherein the trispecific binding protein comprises a first antigen binding site that binds a CD28 polypeptide, a second antigen binding site that binds a CD3 polypeptide, and a third antigen binding site that binds a HER2 polypeptide.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1118" publication-number="202612654"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612654.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612654</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118501</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組織修復裝置及其施用裝置</chinese-title>  
        <english-title>A TISSUE REPAIR DEVICE AND AN APPLICATOR FOR THE TISSUE REPAIR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61B17/04</main-classification>  
        <further-classification edition="200601120260102B">A61B17/064</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商筋銳醫療私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENDONPLUS MEDICAL PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘　在鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUA, ZAI HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>可汗　哈利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOHAMED HAPIZ KHAN, AHMED KHALIL KHAN S/O</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　鐘輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, CHUNG HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種組織修補裝置，包含：一基板；複數個錨定構件、或一對或多對錨定構件，自該基板之一表面延伸，各該錨定構件具有用以刺穿組織的一錨釘端；一第一開口，設置於該基板之一部分，該第一開口用以接收一縫線；以及一第二開口，設置於該基板之另一部分，該第二開口用以接收該縫線，其中，該第二開口與該第一開口分開並且遠離該第一開口。本發明更包括用於將該組織修復裝置附接於一組織的一施用器、一安裝模組、一縫線捕抓裝置、一部件套件、以及製造該施用器、該組織修復裝置、該安裝模組、與該縫線捕抓裝置的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a tissue repair device comprising: a base plate; a plurality of anchor members or one or more pairs of anchor members, extending from a surface of the base plate, each anchor member having an anchor end operable to pierce tissue; a first aperture arranged on a part of the base plate, the first aperture operable to receive a suture; and a second aperture arranged on another part of the base plate, the second aperture operable to receive the suture, wherein the second aperture is separate to and positioned away from the first aperture. Further disclosed include an applicator for attaching the tissue repair device to a tissue, an installation module, a suture capturing device, a kit of parts and methods of manufacturing the applicator, the tissue repair device, the installation module and the suture capturing device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:組織修復裝置</p>  
        <p type="p">110:基板</p>  
        <p type="p">110a:第一表面</p>  
        <p type="p">110b:第二表面</p>  
        <p type="p">112:第一段</p>  
        <p type="p">114:第二段</p>  
        <p type="p">116:第三段</p>  
        <p type="p">122:錨定構件(第一錨定構件)</p>  
        <p type="p">124:錨定構件(第二錨定構件)</p>  
        <p type="p">126a:第一錨定側邊</p>  
        <p type="p">126b:第二錨定側邊</p>  
        <p type="p">132:第一開口</p>  
        <p type="p">134:第二開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1119" publication-number="202613161"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613161.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613161</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118509</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗Ｎ３ｐＧｌｕ　Ａβ抗體及其醫藥用途</chinese-title>  
        <english-title>ANTI-N3PGLU AB ANTIBODY AND MEDICAL USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">C07K16/18</main-classification>  
        <further-classification edition="200601120251230B">G01N33/577</further-classification>  
        <further-classification edition="200601120251230B">A61K39/395</further-classification>  
        <further-classification edition="200601120251230B">A61P25/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海恆瑞醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI HENGRUI PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金薪盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, XINSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張聃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及抗N3pGlu Aβ抗體及其醫藥用途。本揭露提供抗N3pGlu Aβ抗體在製備治療或預防與N3pGlu Aβ相關的疾病或病症的藥物中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure relates to an anti-N3pGlu Aβ antibody and medical use thereof. The disclosure provides use of an anti-N3pGlu Aβ antibody in the preparation of a medicament for treating or preventing a disease or disorder associated with N3pGlu Aβ.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1120" publication-number="202614721"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614721.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614721</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118515</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於監測高效能運算系統之液體冷卻迴路的技術</chinese-title>  
        <english-title>TECHNOLOGIES FOR MONITORING LIQUID COOLING LOOPS FOR HIGH-PERFORMANCE COMPUTING SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H05K7/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商藝康美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ECOLAB USA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦利基　羅伯特　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALICKI, ROBERT S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>繆爾西亞　麥可　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURCIA, MICHAEL J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛伊　羅伯特　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOWE, ROBERT M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐弗貝克　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OVERBECK, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種系統包括一冷卻劑刀鋒，其經調適以接收在一高效能運算刀鋒外殼中。該冷卻劑刀鋒包括一液體冷卻導管及流體耦接至該液體冷卻導管的一或多個液體感測器。當該冷卻劑刀鋒被接收在該高效能運算刀鋒外殼中時，該液體冷卻導管可移除地耦接至該高效能運算刀鋒外殼的一二次冷卻迴路。一控制器從該一或多個感測器中之至少一者接收指示該液體冷卻導管內之液體冷卻劑的一或多個性質的感測器資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system includes a coolant blade adapted to be received in a high-performance computing blade enclosure. The coolant blade includes a liquid cooling conduit and one or more liquid sensors fluidly coupled to the liquid cooling conduit. The liquid cooling conduit is removably coupled to a secondary cooling loop of the high-performance computing blade enclosure when the coolant blade is received in the high-performance computing blade enclosure. A controller receives sensor data indicative of one or more properties of liquid coolant within the liquid cooling conduit from at least one of the one or more sensors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1121" publication-number="202612686"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612686.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612686</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118520</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>失智症之行動及心理症狀之預防、進展抑制及／或治療劑</chinese-title>  
        <english-title>A PREVENTING, PROGRESSION INHIBITING AND/OR TREATING AGENT FOR BEHAVIORAL AND PSYCHOLOGICAL SYMPTOMS OF DEMENTIA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/422</main-classification>  
        <further-classification edition="200601120260102B">A61K31/4178</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4155</further-classification>  
        <further-classification edition="200601120260102B">A61P25/00</further-classification>  
        <further-classification edition="200601120260102B">A61P25/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商小野藥品工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中西美樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANISHI, MIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>星川雅充</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSHIKAWA, MASAMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供失智症之行動及心理症狀之預防、進展抑制及/或治療劑。該失智症之行動及心理症狀之預防、進展抑制及/或治療劑包含具有KDM5抑制活性之化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a preventing, progression inhibiting and/or treating agent for behavioral and psychological symptoms of dementia. The preventing, progression inhibiting and/or treating agents for behavioral and psychological symptoms of dementia comprises compounds having KDM5 inhibiting activity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1122" publication-number="202614731"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614731.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614731</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118526</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構及其形成方法</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250912B">H10B10/00</main-classification>  
        <further-classification edition="202501120250912B">H10D64/01</further-classification>  
        <further-classification edition="202501120250912B">H10D30/60</further-classification>  
        <further-classification edition="202501120250912B">H01L21/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, ZHI-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈育佃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YU-TIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林智斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳亭昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, TING-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法，包括以下步驟：在一第一裝置區域中形成一第一多層堆疊；在該第一多層堆疊上方形成一第一閘極堆疊；在一第二裝置區域中形成一第二多層堆疊；在該第二多層堆疊上方形成一第二閘極堆疊；蝕刻該第一多層堆疊以形成一第一源極/汲極凹陷；及蝕刻該第二多層堆疊以形成一第二源極/汲極凹陷。該方法進一步包括以下步驟：在該第二源極/汲極凹陷中形成一硬遮罩；及在該第一源極/汲極凹陷中形成一下部源極/汲極區域。在形成該下部源極/汲極區域之後，從該第二源極/汲極凹陷移除該硬遮罩。分別在該第一源極/汲極凹陷中形成一第一上部源極/汲極區域及在該第二源極/汲極凹陷中形成一第二上部源極/汲極區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes forming a first multilayer stack in a first device region, forming a first gate stack over the first multilayer stack, forming a second multilayer stack in a second device region, forming a second gate stack over the second multilayer stack, etching the first multilayer stack to form a first source/drain recess, and etching the second multilayer stack to form a second source/drain recess. The method further includes forming a hard mask in the second source/drain recess, and forming a lower source/drain region in the first source/drain recess. After the lower source/drain region is formed, the hard mask is removed from the second source/drain recess. A first upper source/drain region and a second upper source/drain region are formed in the first source/drain recess and the second source/drain recess, respectively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:互補場效電晶體</p>  
        <p type="p">10L:場效電晶體、下部奈米結構場效電晶體</p>  
        <p type="p">10U:場效電晶體、上部奈米結構場效電晶體</p>  
        <p type="p">20:基板</p>  
        <p type="p">20’:半導體帶</p>  
        <p type="p">26’L:下部半導體奈米結構</p>  
        <p type="p">26’M:中部半導體奈米結構</p>  
        <p type="p">26’U:上部半導體奈米結構</p>  
        <p type="p">44:閘極間隔物</p>  
        <p type="p">54:內部間隔物</p>  
        <p type="p">56:介電隔離層</p>  
        <p type="p">62L-C:下部源極/汲極區域</p>  
        <p type="p">62U-C、62U-PSC:上磊晶源極/汲極區域</p>  
        <p type="p">66:第一接觸蝕刻終止層</p>  
        <p type="p">68:第一層間介電層</p>  
        <p type="p">70:第二接觸蝕刻終止層</p>  
        <p type="p">72:第二層間介電層</p>  
        <p type="p">78:閘極介電質</p>  
        <p type="p">80L:下部閘極電極</p>  
        <p type="p">80U:上部閘極電極</p>  
        <p type="p">81T:頂部源極/汲極接觸插塞</p>  
        <p type="p">83:源極/汲極矽化物層</p>  
        <p type="p">90:替換閘極堆疊</p>  
        <p type="p">90L、90U:閘極堆疊</p>  
        <p type="p">92:介電硬遮罩</p>  
        <p type="p">100C:互補場效電晶體區域</p>  
        <p type="p">100PSC:偽互補場效電晶體區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1123" publication-number="202612690"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612690.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612690</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118533</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療肺疾病之方法及化合物</chinese-title>  
        <english-title>METHOD AND COMPOSITION FOR TREATING LUNG DISEASES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/444</main-classification>  
        <further-classification edition="200601120260102B">A61K31/495</further-classification>  
        <further-classification edition="200601120260102B">A61K31/496</further-classification>  
        <further-classification edition="200601120260102B">A61K9/14</further-classification>  
        <further-classification edition="200601120260102B">A61P11/00</further-classification>  
        <further-classification edition="200601120260102B">A61M15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商曼金德公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANNKIND CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲爾斯　瓦希姆　Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FARES, WASSIM H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費里曼　約翰　Ｊ　二世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREEMAN, JOHN J. JR.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡斯塔格納　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CASTAGNA, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種用於治療間質性肺病(包括纖維化肺病)之方法、組合物及套組。該方法係利用吸入用之組合產品，該組合產品包含於吸入器中提供以經口吸入向有需要個體投與治療量之乾粉調配物。該組合物包含用於經口吸入之二酮哌𠯤顆粒及激酶抑制劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method, composition and kit for the treatment of interstitial lung disease, including fibrotic lung disease, are disclosed. The method utilizes a combination product for inhalation comprising a therapeutic amount of a dry powder formulation provided in an inhaler to be administered to a subject in need by oral inhalation. The composition comprises diketopiperazine particles and a kinase inhibitor for oral inhalation.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1124" publication-number="202613167"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613167.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613167</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118547</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用抗ＴＬ１Ａ抗體治療發炎性腸病之方法</chinese-title>  
        <english-title>METHODS FOR TREATMENT OF INFLAMMATORY BOWEL DISEASE WITH AN ANTI-TL1A ANTIBODY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/28</main-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="200601120260102B">A61P1/04</further-classification>  
        <further-classification edition="200601120260102B">A61P29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商建南德克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENENTECH, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商輝瑞大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFIZER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴　昭子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAI, AKIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉許　凱倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LASCH, KAREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴　建泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, KUN TAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博伊西克　丹尼拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOJIC, DANIELA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RS</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾斯比　派斯可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ESPIE, PASCAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供用治療劑量之抗類 TNF 配體 1A (TL1A) 抗體治療發炎性腸病 (IBD) (例如，潰瘍性結腸炎 (UC) 或克隆氏病 (CD)) 之方法及組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides methods and compositions for treating inflammatory bowel disease (IBD), e.g., ulcerative colitis (UC) or Crohn’s disease (CD), with a therapeutic dose of an anti-TNF-like ligand 1A (TL1A) antibody.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1125" publication-number="202613701"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613701.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613701</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118549</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>極紫外線光罩及其製造方法</chinese-title>  
        <english-title>EUV PHOTOMASKS AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251001B">G03F1/22</main-classification>  
        <further-classification edition="201201120251001B">G03F1/24</further-classification>  
        <further-classification edition="201201120251001B">G03F1/46</further-classification>  
        <further-classification edition="200601120251001B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許倍誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余青芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, CHING-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李信昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HSIN-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王聖閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHENG-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝艮軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, KEN-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張思偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, SIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製造光罩的方法包括以下步驟：在光罩坯體上方形成邊界層。光罩坯體包括：基板；反射多層，設置在基板上方；及吸收層，設置在反射多層上方。移除邊界層的一部分以形成由邊界層包圍的凹槽，且選擇性地移除凹槽中的吸收層的部分以在吸收層中形成圖案。邊界層的折射率範圍為0.87至1，且消光係數大於或等於0.02。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of manufacturing a photomask includes forming a border layer over a photomask blank. The photomask blank includes: a substrate, a reflective multilayer disposed over the substrate, and an absorber layer disposed over the reflective multilayer. A portion of the border layer is removed to form a recess surrounded by the border layer, and portions of the absorber layer are selectively removed in the recess to form a pattern in the absorber layer. The border layer has a refractive index ranging from 0.87 to 1 and an extinction coefficient greater than or equal to 0.02.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">15:Mo/Si多層堆疊、多層堆疊、反射多層</p>  
        <p type="p">20:覆蓋層</p>  
        <p type="p">25:吸收層</p>  
        <p type="p">30:第一硬遮罩層</p>  
        <p type="p">35:第二硬遮罩層</p>  
        <p type="p">40:第一邊界層</p>  
        <p type="p">45:背側導電層</p>  
        <p type="p">50:第二邊界層</p>  
        <p type="p">55:緩衝層</p>  
        <p type="p">60:對準標記</p>  
        <p type="p">80d:遮罩圖案</p>  
        <p type="p">85c:邊界圖案</p>  
        <p type="p">100a:反射光罩/光罩</p>  
        <p type="p">X,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1126" publication-number="202613110"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613110.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613110</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118561</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作為澱粉素受體促效劑之經取代１Ｈ－吡唑并［３，４－ｂ］吡啶化合物及其作為治療之用途</chinese-title>  
        <english-title>SUBSTITUTED 1H-PYRAZOLO[3,4-B]PYRIDINE COMPOUNDS AS AMYLIN RECEPTOR AGONISTS AND THEIR USE AS THERAPIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D471/04</main-classification>  
        <further-classification edition="200601120260102B">A61K31/538</further-classification>  
        <further-classification edition="200601120260102B">A61K31/506</further-classification>  
        <further-classification edition="200601120260102B">A61P3/04</further-classification>  
        <further-classification edition="200601120260102B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美國禮來大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELI LILLY AND COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑爾　里納度　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAUER, RENATO A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬丁內斯　布羅考　克里斯汀娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTINEZ BROKAW, CHRISTINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈司塔諾　亞那　馬瑞雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CASTANO, ANA MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡明斯　大衛　傑西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CUMMINS, DAVID JESSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古提瑞斯　赫南德茲　莎拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUTIERREZ HERNANDEZ, SARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢米爾　傑瑞德　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMMILL, JARED T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉弗倫特　巴蘭可　席拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAFUENTE BLANCO, CELIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉基斯　哈尼　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAKKIS, HANI G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克米倫　威廉　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCMILLEN, WILLIAM THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐諾布恩　伊曼紐爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONOBUN, EMMANUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明格茲　歐塔加　喬斯　米格爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINGUEZ ORTEGA, JOSE MIGUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑茲　吉馬　康斯威羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANZ, GEMA CONSUELO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密特　安妮　瑪莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMITT, ANNE-MARIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　艾比蓋兒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, ABIGAIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦希德　索迪克　Ｏ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAHEED, SODIQ O.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王雪林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XUELIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="17"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃利　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOERLY, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="18"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴雷卡坦　麥塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAREKATAIN, MAHTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="19"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多明魁茲　福那德茲　瑪麗亞　德　卡曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOMINGUEZ FERNANDEZ, MARIA DEL CARMEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="20"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧賈格魯　尼達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OJAGHLOU, NEDA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="21"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯里尼瓦桑　斯瑞洛克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRINIVASAN, SRILOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示一種式(I)化合物： &lt;br/&gt;&lt;img align="absmiddle" height="164px" width="185px" file="ed10689.JPG" alt="ed10689.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; ， &lt;br/&gt;或其醫藥學上可接受之鹽，其中R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;、R&lt;sup&gt;5&lt;/sup&gt;、R&lt;sup&gt;6&lt;/sup&gt;及R&lt;sup&gt;10&lt;/sup&gt;如本文所定義。本文亦揭示一種包含式(I)化合物或其醫藥學上可接受之鹽及醫藥學上可接受之添加劑的醫藥組合物。本文進一步揭示一種利用透過使用式(I)化合物或其醫藥學上可接受之鹽調節澱粉素受體來預防或治療疾病或病狀之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein is a compound of formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="160px" width="183px" file="ed10690.JPG" alt="ed10690.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;or a pharmaceutically acceptable salt thereof, wherein R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, R&lt;sup&gt;4&lt;/sup&gt;, R&lt;sup&gt;5&lt;/sup&gt;, R&lt;sup&gt;6&lt;/sup&gt;, and R&lt;sup&gt;10&lt;/sup&gt; are as defined herein. Also disclosed herein is a pharmaceutical composition comprising a compound of formula (I), or a pharmaceutically acceptable salt thereof, and a pharmaceutically acceptable additive. Further disclosed herein is a method for preventing or treating a disease or condition through the modulation of the amylin receptor using a compound of formula (I), or a pharmaceutically acceptable salt thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1127" publication-number="202614436"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614436.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614436</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118563</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體電路及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR CIRCUITS AND METHODS OF MANUFACTURING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H01L23/528</main-classification>  
        <further-classification edition="200601120251103B">H01L23/538</further-classification>  
        <further-classification edition="202501120251103B">H10D84/83</further-classification>  
        <further-classification edition="202501120251103B">H10D84/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鐘彥麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, YEN LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林高正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KAO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳威震</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李培源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, PEI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林建呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIEN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周群策</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHUN TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃千輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIEN HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂詠甯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, YUNG-NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳尚霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHANG LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾嘉哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, CHIA-CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪佳琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHIA-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱冠穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, KUAN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹偉閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, WEI MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳炎輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-HUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電路包括：第一雙埠單元；第一字元線及第二字元線；以及第一位元線、第二位元線及第三位元線。第一字元線在第一方向上延伸，耦接至第一雙埠單元，且位於基板的前側上方的第一金屬層上。第二字元線在第一方向上延伸，耦接至第一雙埠單元，且位於基板的背側下方的第二金屬層上。第一位元線及第二位元線在第一方向上延伸，耦接至第一雙埠單元，且位於第一金屬層上。第三位元線在第一方向上延伸，耦接至第一雙埠單元，且至少位於第二金屬層上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit includes a first dual-port cell, a first and second word line, and a first, second and third bit line. The first word line extends in a first direction, is coupled to the first dual-port cell, and is on a first metal layer above a front-side of a substrate. The second word line extends in the first direction, is coupled to the first dual-port cell, and is on a second metal layer below a back-side of the substrate. The first and second bit line extend in the first direction, are coupled to the first dual-port cell, and are on the first metal layer. The third bit line extends in the first direction, is coupled to the first dual-port cell, and is on at least the second metal layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1200:方法</p>  
        <p type="p">1202、1202a、1202b、1202c、1202d、1204、1206、1208、1210、1212、1214、1216、1218:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1128" publication-number="202613477"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613477.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613477</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118565</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多區域冷板</chinese-title>  
        <english-title>MULTI-ZONE COLD PLATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">F28D7/00</main-classification>  
        <further-classification edition="200601120251229B">H01L23/36</further-classification>  
        <further-classification edition="200601120251229B">H01L23/427</further-classification>  
        <further-classification edition="200601120251229B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商水冷系統公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COOLIT SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古　學睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GU, XUERUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫斯塔法維　亞茲迪　賽義德　卡莫爾艾丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOSTAFAVI YAZDI, SEYED KAMALEDDIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多區域冷板至少包含第一及第二鄰近冷卻區域。各冷卻區域具有部分由一對應熱傳遞芯佔據之一熱傳遞腔室。各冷卻區域亦具有經構形以將一各自冷卻劑輸送至該各自冷卻區域之一對應入口通路。各冷卻區域進一步具有經構形以自該對應冷卻區域輸送該各自冷卻劑之一對應出口通路。定位於該第一冷卻區域與該第二冷卻區域之間的一壁防止每一各自冷卻劑與另一冷卻劑混合。此一多區域冷板可對各冷卻區域提供一獨特冷卻速率及/或一獨特操作溫度。各獨特冷卻速率或操作溫度可經定製以對應於靠近彼此定位之發熱電子裝置之指定操作參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-zone cold plate includes at least first and second adjacent cooling zones. Each cooling zone has a heat-transfer chamber partly occupied by a corresponding heat-transfer core. Each cooling zone also has a corresponding inlet passage configured to convey a respective coolant to the respective cooling zone. Each cooling zone further has a corresponding outlet passage configured to convey the respective coolant from the corresponding cooling zone. A wall positioned between the first cooling zone and the second cooling zone prevents each respective coolant from mixing with the other. Such a multi-zone cold plate can provide a unique rate of cooling and/or a unique operating temperature to each cooling zone. Each unique rate of cooling or operating temperature can be tailored to correspond to specified operating parameters of heat-generating electronic devices that are positioned close to each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:多區域冷板</p>  
        <p type="p">205:殼體/殼體蓋</p>  
        <p type="p">210:入口埠</p>  
        <p type="p">215:保持銷</p>  
        <p type="p">220:出口埠</p>  
        <p type="p">230:入口埠</p>  
        <p type="p">235:出口埠</p>  
        <p type="p">240:入口埠</p>  
        <p type="p">245:出口埠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1129" publication-number="202613211"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613211.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613211</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118581</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>深共晶液體、生物體電極組成物、生物體電極、及生物體電極之製造方法</chinese-title>  
        <english-title>DEEP EUTECTIC LIQUID, BIO-ELECTRODE COMPOSITION, BIO-ELECTRODE, AND METHOD FOR PRODUCING BIO-ELECTRODE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C08G77/38</main-classification>  
        <further-classification edition="200601120251229B">G01N27/327</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田譲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, JOE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野中汐里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NONAKA, SHIORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畠山潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATAKEYAMA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種離子傳導性高、即使接觸生物體亦安全的深共晶液體；包含該深共晶液體之生物體電極組成物，可形成貼附於皮膚後可迅速地採集訊號、不會引起皮膚殘留、可長時間穩定地取得生物體訊號之生物體電極用的生物體接觸層；一種生物體電極，其以該生物體電極組成物形成生物體接觸層；及其製造方法。 &lt;br/&gt;一種深共晶液體，其為氫鍵供給性的化合物與氫鍵接受性的化合物的混合物，其中，該氫鍵供給性的化合物為下述通式(1)所示的具有2個～100個具有羥基的單體鍵結而成的結構的化合物，該氫鍵接受性的化合物為包含具有下述通式(2)～(6)所示的4級銨陽離子或下述通式(7)所示的4級鏻陽離子的單體的化合物，該深共晶液體在25℃下以液體的形式存在。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="234px" width="324px" file="ed10026.JPG" alt="ed10026.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="407px" width="520px" file="ed10027.JPG" alt="ed10027.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a deep eutectic liquid, which is a mixture of a hydrogen bond donor compound and a hydrogen bond acceptor compound, wherein the hydrogen bond donor compound is a compound represented by the following general formula (1) having a structure in which 2 to 100 monomers having a hydroxy group are bonded, the hydrogen bond acceptor compound is a compound containing a monomer having a quaternary ammonium cation represented by the following general formulae (2) to (6) or a quaternary phosphonium cation represented by the following general formula (7), and the deep eutectic liquid is present in a liquid state at 25°C. The present invention provides a deep eutectic liquid that has high ionic conductivity and ensures safety upon contact with living bodies, a bio-electrode composition containing the deep eutectic liquid capable of promptly acquiring signals by being applied to the skin without leaving residues on the skin, stably obtaining biological signals for a long period, and forming a living body contact layer for bio-electrodes, a bio-electrode in which a living body contact layer is formed from the bio-electrode composition, as well as a method for producing the bio-electrode. &lt;br/&gt;&lt;img align="absmiddle" height="498px" width="473px" file="ed10028.JPG" alt="ed10028.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:生物體電極</p>  
        <p type="p">2:導電性基材(導電圖案)</p>  
        <p type="p">3:生物體接觸層</p>  
        <p type="p">4:導電性粒子</p>  
        <p type="p">5:深共晶液體</p>  
        <p type="p">6:樹脂</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1130" publication-number="202614343"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614343.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614343</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118584</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>載置台及電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L21/683</main-classification>  
        <further-classification edition="200601120260102B">H02N13/00</further-classification>  
        <further-classification edition="200601120260102B">H05H1/46</further-classification>  
        <further-classification edition="200601120260102B">H01J37/32</further-classification>  
        <further-classification edition="200601120260102B">H01L21/3065</further-classification>  
        <further-classification edition="200601120260102B">H01L21/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荻野孝宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGINO, TAKANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林洋志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] &lt;br/&gt;提供一技術，其能夠抑制發生於載置台的沉積。 &lt;br/&gt;[解決手段] &lt;br/&gt;一種載置台，其具備： &lt;br/&gt;靜電吸盤，載置基板； &lt;br/&gt;絕緣構件，環繞該靜電吸盤之外側； &lt;br/&gt;一個以上的環，配置於該絕緣構件的上部，並沿著該絕緣構件的周向延伸；及 &lt;br/&gt;封閉構件，沿著該絕緣構件的周向延伸，且封閉該絕緣構件與該環之間的邊界。 &lt;br/&gt;藉此，載置台能夠抑制發生於該載置台的沉積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:載置台</p>  
        <p type="p">30:電源</p>  
        <p type="p">50:本體部</p>  
        <p type="p">50a:中央區域</p>  
        <p type="p">50b:環狀區域</p>  
        <p type="p">51:基座</p>  
        <p type="p">511:凹槽</p>  
        <p type="p">52:靜電吸盤</p>  
        <p type="p">53:絕緣構件</p>  
        <p type="p">531:凸部</p>  
        <p type="p">531o:外周面</p>  
        <p type="p">55:導通部</p>  
        <p type="p">551:第1導通環</p>  
        <p type="p">552:連接構件</p>  
        <p type="p">552c:凹陷部</p>  
        <p type="p">553:第2導通環</p>  
        <p type="p">60:環狀組件</p>  
        <p type="p">61:聚焦環</p>  
        <p type="p">611:突出部</p>  
        <p type="p">62:覆蓋環</p>  
        <p type="p">621:第1覆蓋環</p>  
        <p type="p">621b:段差部</p>  
        <p type="p">621o:外周面</p>  
        <p type="p">622:第2覆蓋環</p>  
        <p type="p">622f:凸緣</p>  
        <p type="p">63:空間部</p>  
        <p type="p">70:封閉構件</p>  
        <p type="p">71:限制部</p>  
        <p type="p">71t:漸縮面</p>  
        <p type="p">C,C1,C2,C3,C4,C5:縫隙</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1131" publication-number="202613538"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613538.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613538</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118594</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>X射線檢查裝置</chinese-title>  
        <english-title>X-RAY INSPECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251217B">G01N23/20</main-classification>  
        <further-classification edition="201801120251217B">G01N23/20016</further-classification>  
        <further-classification edition="201801120251217B">G01N23/20008</further-classification>  
        <further-classification edition="200601120251217B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商理學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIGAKU CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松嶋直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHIMA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本野寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTONO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾形潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGATA, KIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>表和彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMOTE, KAZUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青柳誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOYAGI, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洞田克隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORADA, KATSUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明具備有：試料平台10，其包含配置試料之試料台11、及使該試料台11移動之試料台移動機構12；及測角儀20，其包含獨立轉動之第1轉動臂22、第2轉動臂23。而且，於第1轉動臂22安裝有對試料的表面照射聚焦X射線之聚焦X射線照射單元30。此外，於第2轉動臂23安裝有對從試料繞射或反射而來之X射線進行檢測之X射線檢測單元60。進而，於第1轉動臂22組入有使聚焦X射線照射單元30在第1轉動臂22上移動之照射單元移動調整機構50。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An X-ray inspection apparatus includes a sample stage 10 including a sample stage 11 on which a sample is placed and a sample stage moving mechanism 12 for moving the sample stage 11, and a goniometer 20 including first and second rotating arms 22, 23 that rotate independently of each other. The first rotating arm 22 is equipped with a focused X-ray irradiation unit 30 for irradiating the surface of the sample with focused X-rays. The second rotating arm 23 is equipped with an X-ray detection unit 60 for detecting X-rays diffracted or reflected from the sample. The first rotating arm 22 is incorporated with an irradiation unit movement adjusting mechanism 50 for moving the focused X-ray irradiation unit 30 on the first rotating arm 22.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:試料平台</p>  
        <p type="p">11:試料台</p>  
        <p type="p">12:試料台移動機構</p>  
        <p type="p">12a:搖台</p>  
        <p type="p">20:測角儀</p>  
        <p type="p">21:測角儀本體</p>  
        <p type="p">22:第1轉動臂</p>  
        <p type="p">23:第2轉動臂</p>  
        <p type="p">24:平衡器</p>  
        <p type="p">25:平衡臂</p>  
        <p type="p">26、26a:配重構件</p>  
        <p type="p">28:平衡器</p>  
        <p type="p">28a:平衡臂</p>  
        <p type="p">28b:配重構件</p>  
        <p type="p">29:重心位置調整機構</p>  
        <p type="p">30:聚焦X射線照射單元</p>  
        <p type="p">40:平行X射線照射單元</p>  
        <p type="p">50:照射單元移動調整機構</p>  
        <p type="p">60:X射線檢測單元</p>  
        <p type="p">61:二維X射線檢測器</p>  
        <p type="p">62:平行激光狹縫(受光側光學零組件)</p>  
        <p type="p">63:垂直激光狹縫(受光側光學零組件)</p>  
        <p type="p">64:受光狹縫(受光側光學零組件)</p>  
        <p type="p">65:分析儀(受光側光學零組件)</p>  
        <p type="p">70:受光側光學零組件自動選擇機構</p>  
        <p type="p">100:光學顯微鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1132" publication-number="202613539"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613539.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613539</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118595</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>X射線檢查裝置</chinese-title>  
        <english-title>X-RAY INSPECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251217B">G01N23/20</main-classification>  
        <further-classification edition="201801120251217B">G01N23/20016</further-classification>  
        <further-classification edition="201801120251217B">G01N23/20008</further-classification>  
        <further-classification edition="200601120251217B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商理學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIGAKU CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松嶋直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHIMA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本野寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTONO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾形潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGATA, KIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>表和彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMOTE, KAZUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青柳誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOYAGI, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洞田克隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORADA, KATSUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明具備有：試料平台10，其包含配置試料之試料台11、及使該試料台11移動之試料台移動機構12；及測角儀20，其包含獨立轉動之第1轉動臂22、第2轉動臂23。而且，於第1轉動臂22安裝有對試料的表面照射X射線之X射線照射單元20、30。此外，於第2轉動臂23安裝有對從試料繞射或反射而來之X射線進行檢測之X射線檢測單元60。其進而具備有：平衡器28，其調整測角儀20的重心位置；及重心位置調整機構29，其用以保持由該平衡器28所調整之測角儀20的重心位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An X-ray inspection apparatus includes a sample stage 10 including a sample stage 11 on which a sample is placed and a sample stage moving mechanism 12 for moving the sample stage 11, and a goniometer 20 including first and second rotating arms 22, 23 that rotate independently of each other. The first rotating arm 22 is equipped with X-ray irradiation units 20, 30 for irradiating the surface of the sample with X-rays. The second rotating arm 23 is equipped with an X-ray detection unit 60 for detecting X-rays diffracted or reflected from the sample. The X-ray inspection apparatus is further equipped with a balancer 28 for adjusting a center-of-gravity position of the goniometer 20, and a center-of-gravity position adjusting mechanism 29 for maintaining the center-of-gravity position of the goniometer 20 which has been adjusted by the balancer 28.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:試料平台</p>  
        <p type="p">11:試料台</p>  
        <p type="p">12:試料台移動機構</p>  
        <p type="p">12a:搖台</p>  
        <p type="p">20:測角儀</p>  
        <p type="p">21:測角儀本體</p>  
        <p type="p">22:第1轉動臂</p>  
        <p type="p">23:第2轉動臂</p>  
        <p type="p">24:平衡器</p>  
        <p type="p">25:平衡臂</p>  
        <p type="p">26、26a:配重構件</p>  
        <p type="p">28:平衡器</p>  
        <p type="p">28a:平衡臂</p>  
        <p type="p">28b:配重構件</p>  
        <p type="p">29:重心位置調整機構</p>  
        <p type="p">30:聚焦X射線照射單元</p>  
        <p type="p">40:平行X射線照射單元</p>  
        <p type="p">50:照射單元移動調整機構</p>  
        <p type="p">60:X射線檢測單元</p>  
        <p type="p">61:二維X射線檢測器</p>  
        <p type="p">62:平行激光狹縫(受光側光學零組件)</p>  
        <p type="p">63:垂直激光狹縫(受光側光學零組件)</p>  
        <p type="p">64:受光狹縫(受光側光學零組件)</p>  
        <p type="p">65:分析儀(受光側光學零組件)</p>  
        <p type="p">70:受光側光學零組件自動選擇機構</p>  
        <p type="p">100:光學顯微鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1133" publication-number="202613540"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613540.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613540</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118596</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>X射線檢查裝置</chinese-title>  
        <english-title>X-RAY INSPECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251217B">G01N23/20</main-classification>  
        <further-classification edition="201801120251217B">G01N23/20016</further-classification>  
        <further-classification edition="201801120251217B">G01N23/20008</further-classification>  
        <further-classification edition="200601120251217B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商理學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIGAKU CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松嶋直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHIMA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本野寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTONO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾形潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGATA, KIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>表和彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMOTE, KAZUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青柳誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOYAGI, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洞田克隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORADA, KATSUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係對試料照射X射線，並藉由X射線檢測單元60而對從試料繞射或反射而來之X射線進行檢測。X射線檢測單元60包含有二維X射線檢測器61、及受光側光學零組件自動選擇機構70。受光側光學零組件自動選擇機構70具有，對複數個受光側光學零組件62~65進行選擇，而將其各別自動地配置在二維X射線檢測器61之近前的位置，或使其從該位置各別自動地退避之功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sample is irradiated with X-rays, and X-rays diffracted or reflected from the sample are detected by an X-ray detection unit 60. The X-ray detection unit 60 includes a two-dimensional X-ray detector 61, and an automatic selection mechanism 70 for light-reception-side optical components. The automatic selection mechanism 70 for light-reception-side optical components has a function of selecting a plurality of light-reception-side optical components 62 to 65, automatically arranging each of the optical components at a position in front of the two-dimensional X-ray detector 61, and automatically retracting each of the optical components from the position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:試料平台</p>  
        <p type="p">11:試料台</p>  
        <p type="p">12:試料台移動機構</p>  
        <p type="p">12a:搖台</p>  
        <p type="p">20:測角儀</p>  
        <p type="p">21:測角儀本體</p>  
        <p type="p">22:第1轉動臂</p>  
        <p type="p">23:第2轉動臂</p>  
        <p type="p">24:平衡器</p>  
        <p type="p">25:平衡臂</p>  
        <p type="p">26、26a:配重構件</p>  
        <p type="p">28:平衡器</p>  
        <p type="p">28a:平衡臂</p>  
        <p type="p">28b:配重構件</p>  
        <p type="p">29:重心位置調整機構</p>  
        <p type="p">30:聚焦X射線照射單元</p>  
        <p type="p">40:平行X射線照射單元</p>  
        <p type="p">50:照射單元移動調整機構</p>  
        <p type="p">60:X射線檢測單元</p>  
        <p type="p">61:二維X射線檢測器</p>  
        <p type="p">62:平行激光狹縫(受光側光學零組件)</p>  
        <p type="p">63:垂直激光狹縫(受光側光學零組件)</p>  
        <p type="p">64:受光狹縫(受光側光學零組件)</p>  
        <p type="p">65:分析儀(受光側光學零組件)</p>  
        <p type="p">70:受光側光學零組件自動選擇機構</p>  
        <p type="p">100:光學顯微鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1134" publication-number="202613166"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613166.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613166</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118607</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏液栓塞的治療</chinese-title>  
        <english-title>TREATMENT FOR MUCUS PLUGGING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/24</main-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="200601120260102B">A61P11/00</further-classification>  
        <further-classification edition="200601120260102B">A61P11/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商梅迪繆思有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIMMUNE LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝爾維西　瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELVISI, MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬奇　唐娜科斯蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FINCH, DONNA KIRSTY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豪格諾登馬克　拉爾斯奧洛夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAUG NORDENMARK, LARS OLOV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱爾　克里斯多夫馬汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KELL, CHRISTROPHER MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘迪亞　希特什查帕克拉爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANDYA, HITESH CHAMPAKLAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希斯比　艾瑪蘇珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEASBY, EMMA SUZANNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供了減少患有慢性肺病之患者之黏液栓塞的方法。該方法包含向患者投予結合IL‑33並抑制IL-33介導之EGFR/RAGE活化的抗體。結合IL‑33之抗體可係托雷奇單抗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are methods for reducing mucus plugging in a patient suffering from chronic lung disease. The methods comprise administering to the patient an antibody which binds IL‑33 and inhibits IL-33-mediated activation of EGFR/RAGE. The antibody which binds IL‑33 may be tozorakimab.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1135" publication-number="202613724"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613724.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613724</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118614</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於干涉或全像度量衡之振動校正</chinese-title>  
        <english-title>VIBRATION CORRECTION FOR INTERFEROMETRIC OR HOLOGRAPHIC METROLOGY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G03F7/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹金斯　貴格瑞　瓦倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JENKINS, GREGORY WARREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金大植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAE SHIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維利加斯　洛佩茲　大衛　亞歷杭德羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VILLEGAS LOPEZ, DAVID ALEJANDRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>可拉芙　瑞納度　傑拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLAVER, RENATUS GERARDUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布吉思　羅賓　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUIJS, ROBIN DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供干涉或全像度量衡系統，其可用於判定疊對、對準及/或其他度量。經散射至不同繞射階中之光連同兩個參考光束由一第一輻射感測器偵測。該等參考光束與來自兩個源之兩個照明路徑謹慎匹配，使得一總干涉圖案形成對量測資訊進行編碼之一全像圖。該全像圖之運算處理判定度量衡值。然而，來自度量衡系統載物台沉降及/或其他源之振動引起經繞射輻射中之路徑長度移位。此不利地影響感測器效能。有利地，具有一相對較高圖框率之一第二輻射感測器用於近即時地量測來自振動之一相移且對該等振動進行校正。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Interferometric or holographic metrology systems may be used to determine overlay, alignment, and/or other metrics. Light scattered into different diffraction orders is detected by a first radiation sensor, together with two reference beams. The reference beams are carefully matched to two illumination paths from the two sources, such that a total interference pattern forms a hologram that encodes measurement information. Computational processing of the hologram determines metrology values. However, vibrations from metrology system stage settling and/or other sources cause path length shifts in the diffracted radiation. This negatively affects sensor performance. Advantageously, a second radiation sensor having a relatively higher frame rate is used to measure a phase shift from vibrations in near-real-time and make corrections for the vibrations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2A:照明輻射源</p>  
        <p type="p">2B:照明輻射源</p>  
        <p type="p">30:度量衡目標</p>  
        <p type="p">700:度量衡系統</p>  
        <p type="p">701:照明方向</p>  
        <p type="p">702:照明輻射</p>  
        <p type="p">703:照明方向</p>  
        <p type="p">704:參考輻射光束</p>  
        <p type="p">706:參考輻射源</p>  
        <p type="p">708:參考輻射源</p>  
        <p type="p">710:第一輻射感測器</p>  
        <p type="p">720:透鏡</p>  
        <p type="p">730:光學模組</p>  
        <p type="p">750:第二輻射感測器</p>  
        <p type="p">PRO:處理器</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1136" publication-number="202613090"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613090.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613090</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118619</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>乳酸脫氫酶抑制劑、包含該抑制劑的組合物及其使用方法</chinese-title>  
        <english-title>INHIBITORS OF LACTATE DEHYDROGENASE, COMPOSITIONS COMPRISING THE INHIBITOR, AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D401/04</main-classification>  
        <further-classification edition="200601120260102B">C07D403/04</further-classification>  
        <further-classification edition="200601120260102B">C07D401/14</further-classification>  
        <further-classification edition="200601120260102B">C07D413/14</further-classification>  
        <further-classification edition="200601120260102B">C07D403/14</further-classification>  
        <further-classification edition="200601120260102B">C07D409/14</further-classification>  
        <further-classification edition="200601120260102B">C07D407/14</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4439</further-classification>  
        <further-classification edition="200601120260102B">A61K31/506</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4545</further-classification>  
        <further-classification edition="200601120260102B">A61K31/55</further-classification>  
        <further-classification edition="200601120260102B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260102B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商默達生物（香港）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>META PHARMACEUTICALS (HK) LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳默元生物科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN MOYUAN PHARMACEUTICALS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許柯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, KE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮮于安今</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIANYU, ANJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢寧　赫爾穆特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANING, HELMUT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周世強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, SHIQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了具有六員芳香取代基的新型小分子化合物，其可以用作乳酸脫氫酶的抑制劑。本發明還提供了包含至少一種該新型取代化合物的藥物組合物，以及使用至少一種該化合物或組合物治療或預防與乳酸脫氫酶活性相關的疾病的方法，如自身免疫性疾病。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides novel small molecule compounds with six-membered aromatic substituents that can serve as inhibitors of lactate dehydrogenase. The present disclosure also provides pharmaceutical compositions, comprising at least one of such novel substituted compounds, and methods of using at least one of such compounds or compositions in treating or preventing diseases associated with lactate dehydrogenase activities, such as autoimmune diseases.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1137" publication-number="202612729"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612729.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612729</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118629</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>涉及抗ＨＬＡ－Ｇ抗體及抗ＥＧＦＲ抗體以及抗ＰＤ－１抗體之組合療法</chinese-title>  
        <english-title>COMBINATION THERAPY INVOLVING ANTI-HLA-G ANTIBODIES AND ANTI-EGFR ANTIBODIES AND ANTI-PD-1 ANTIBODIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K39/395</main-classification>  
        <further-classification edition="200601120260102B">A61K31/519</further-classification>  
        <further-classification edition="200601120260102B">A61K31/513</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4745</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商提聖納醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIZONA THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比爾斯　柯特妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEERS, COURTNEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧布萊恩　克里斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>O'BRIEN, CHRISTINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆魯加潘　斯瓦納坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURUGAPPAN, SWAMINATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示用於治療患有癌症之個體之方法，其藉由在第一週期期間向該個體投與抗人類HLA-G抗體以使血清藥物濃度維持高於約50 μg/mL的目標谷值，且視情況在一或多個後續週期期間投與該抗體，以在後續週期期間亦維持該血清藥物濃度高於約50 μg/mL的目標谷值。給藥方案可為約0.2-20 mg/kg Q3W。給藥亦可以2至4週的間隔進行。癌症可為實體癌症。該等方法及給藥方案可用於抗人類HLA-G抗體之單一療法或抗人類HLA-G抗體與抗EGFR或抗PD-1療法之組合療法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are methods for treating a subject suffering from cancer by administering to the subject an anti human HLA-G antibody to maintain a serum drug concentration above a target trough of about 50 μg/mL during a first cycle and optionally at one or more subsequent cycles to maintain the serum drug concentration above target trough of about 50 μg/mL during subsequent cycles as well. The dosing regimen can be about 0.2-20 mg/kg Q3W. The dosing can also be at 2 to 4 week intervals. The cancer may be a solid cancer. The methods and dosing regimens can be used for monotherapy of anti human HLA-G antibody or combination therapy of anti human HLA-G antibody with an anti EGFR or an anti PD-1 therapy.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1138" publication-number="202613091"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613091.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613091</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118632</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>乳酸脫氫酶抑制劑、包含該抑制劑的組合物及其使用方法</chinese-title>  
        <english-title>INHIBITORS OF LACTATE DEHYDROGENASE, COMPOSITIONS COMPRISING THE INHIBITOR, AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D401/04</main-classification>  
        <further-classification edition="200601120260102B">C07D403/04</further-classification>  
        <further-classification edition="200601120260102B">C07D413/14</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4439</further-classification>  
        <further-classification edition="200601120260102B">A61K31/506</further-classification>  
        <further-classification edition="200601120260102B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260102B">A61K31/501</further-classification>  
        <further-classification edition="200601120260102B">A61K31/53</further-classification>  
        <further-classification edition="200601120260102B">A61K31/497</further-classification>  
        <further-classification edition="200601120260102B">A61P19/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商默達生物（香港）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>META PHARMACEUTICALS (HK) LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳默元生物科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN MOYUAN PHARMACEUTICALS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許柯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, KE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮮于安今</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIANYU, ANJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢寧　赫爾穆特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANING, HELMUT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周世強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, SHIQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供可作為乳酸脫氫酶抑制劑的新型取代吡咯化合物、包含至少一種此類新型取代吡咯化合物的藥物組合物，以及使用至少一種此類化合物或組合物治療或預防與乳酸脫氫酶活性相關疾病的方法，例如原發性高草酸尿症。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides novel substituted pyrrole compounds that can serve as inhibitors of lactate dehydrogenase, pharmaceutical compositions, comprising at least one of such novel substituted pyrrole compounds, and methods of using at least one of such compounds or compositions in treating or preventing diseases associated with lactate dehydrogenase activities, such as primary hyperoxaluria.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1139" publication-number="202612888"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612888.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612888</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118703</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造蓋件的模具以及方法</chinese-title>  
        <english-title>MOULD AND METHOD FOR MAKING A CAP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B29C33/04</main-classification>  
        <further-classification edition="200601120251229B">B29C33/38</further-classification>  
        <further-classification edition="200601120251229B">B29C43/52</further-classification>  
        <further-classification edition="200601120251229B">B29C43/02</further-classification>  
        <further-classification edition="200601320251229B">B29L31/56</further-classification>  
        <further-classification edition="200601320251229B">B29L31/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商沙克米機械合作伊莫拉公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SACMI COOPERATIVA MECCANICI IMOLA SOCIETA' COOPERATIVA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪樂堤　皮洛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARETTI, PIERO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕納黎　大衛迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENAZZI, DAVIDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於藉由在一成型空腔中壓縮一劑料來製造一蓋件之模具(1)，其包含一下半部模具(12)及一上半部模具(11)，二者皆由鋼製成且可相對於彼此沿著一縱向軸線(X)在一打開位置與一閉合位置之間移動，該下半部模具及該上半部模具在該閉合位置處限定該成型空腔。該上半部模具(11)包括一沖模(111)，該沖模沿著一縱向軸線(X)在一第一末端(111')與一第二末端(111'')之間伸長且包括一內部沖模(111A)及一外部沖模(111B)。該沖模(111)具有一下部區，該下部區位於該第一末端(111')處且界定一模製表面，該模製表面在該模具(1)處於該閉合位置時與塑膠可操作地接觸；該模具(1)包含一冷卻系統，該冷卻系統具有：一管線系統，一冷卻流體在該管線系統中循環且該管線系統部分地位於該沖模(111)內部；以及一或多個銅元件(132)，其定位於該沖模(111)之該下部區中，且嵌入於該內部沖模(111A)及/或該外部沖模(111B)中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mould (1) for making a cap by compressing a dose in a forming cavity comprises a lower half mould (12) and an upper half mould (11), both made of steel and movable relative to each other along a longitudinal axis (X) between an open position and a closed position, where they delimit the forming cavity. The upper half mould (11) includes a die (111) elongated along a longitudinal axis (X) between a first end (111') and a second end (111'') and including an inner die (111A) and an outer die (111B). The die (111) has a lower zone located at the first end (111') and defining a moulding surface which is operatively in contact with the plastic when the mould (1) is at the closed position; the mould (1) comprises a cooling system, having a ducting system in which a cooling fluid circulates and which is located partly inside the die (111), and one or more copper elements (132) positioned in the lower zone of the die (111) and embedded in the inner die (111A) and/or in the outer die (111B).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:模具</p>  
        <p type="p">11:上半部模具</p>  
        <p type="p">12:下半部模具</p>  
        <p type="p">111:沖模</p>  
        <p type="p">111':第一末端</p>  
        <p type="p">111":第二末端</p>  
        <p type="p">111A:內部沖模</p>  
        <p type="p">111B:外部沖模</p>  
        <p type="p">121:側本體</p>  
        <p type="p">122:模具基底</p>  
        <p type="p">131:第一路徑</p>  
        <p type="p">132:銅元件</p>  
        <p type="p">X:縱向軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1140" publication-number="202613168"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613168.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613168</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118713</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗CDH17抗體、其抗體藥物偶聯物及其用途</chinese-title>  
        <english-title>ANTI-CDH17 ANTIBODY, ANTIBODY DRUG CONJUGATE THEREOF AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/28</main-classification>  
        <further-classification edition="200601120260102B">C12N15/13</further-classification>  
        <further-classification edition="200601120260102B">C12N15/63</further-classification>  
        <further-classification edition="200601120260102B">C12N5/10</further-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification>  
        <further-classification edition="200601120260102B">G01N33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商杭州中美華東製藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANGZHOU ZHONGMEIHUADONG PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, KUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹毅明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, YIMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田倩倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, QIANQIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏炎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　東舟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, DONGZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及特異性識別CDH17的抗體，其製備方法和用途。此外，本揭露還涉及靶向CDH17的抗體藥物偶聯物(ADC)以及含有該分子的組成物。本發明還涉及這些抗體、抗體片段以及抗體藥物偶聯物的治療和診斷用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to antibodies that specifically recognize CDH17, and preparation method thereof and uses thereof. In addition, the present application also relates to antibody-drug conjugates (ADCs) targeting CDH17 and compositions containing the same. The present invention also relates to therapeutic and diagnostic uses of these antibodies, antibody fragments, and antibody-drug conjugates.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1141" publication-number="202612724"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612724.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612724</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118730</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多肽組合及其用途</chinese-title>  
        <english-title>POLYPEPTIDE COMBINATIONS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K38/26</main-classification>  
        <further-classification edition="200601120260102B">C07K14/605</further-classification>  
        <further-classification edition="200601120260102B">A61P3/04</further-classification>  
        <further-classification edition="200601120260102B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商梅迪繆思有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIMMUNE LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威爾　莎拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILL, SARAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於多肽組合及其用途。特定言之，本發明係關於澱粉素(amylin)受體促效劑與GLP-1受體促效劑之組合及其用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a combination of polypeptides and uses thereof. In particular, the present invention relates to a combination of an amylin receptor agonist and a GLP-1 receptor agonist, and uses thereof.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1142" publication-number="202614869"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614869.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614869</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118746</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路裝置、製造方法及產生積體電路佈局圖的方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT DEVICE, MANUFACTURING METHOD THEREOF AND METHOD OF GENERATING INTEGRATED CIRCUIT LAYOUT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251103B">H10D89/10</main-classification>  
        <further-classification edition="202001120251103B">G06F30/392</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃敬餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊言</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林威呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾健庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZENG, JIANN-TYNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種IC裝置包括：兩個隔離結構，在半導體基板的前側沿第一方向平行延伸；堆疊式CFET電路，包括閘極及似金屬界定(MD)段，沿該第一方向在該些隔離結構之間延伸。每一閘極沿該第一方向自第一位置延伸至第二位置，且一個MD段用作該電路的參考電壓連接且自該第一位置延伸至沿該第一方向比該第二位置更遠的第三位置。前側及背側導電線沿垂直於該第一方向的第二方向延伸，且導電結構沿垂直於該第一及第二方向的第三方向自該前側導電線延伸至該背側導電線，且包括該第二與第三位置之間的該MD段的一部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An IC device includes two isolation structures extending in parallel in a first direction in a front side of a semiconductor substrate, a stacked CFET circuit including gates and metal-like defined (MD) segments extending in the first direction between the isolation structures. Each of the gates extends from first to second locations along the first direction and one of the MD segments is configured as a reference voltage connection of the circuit and extends from the first location to a third location further along the first direction than the second location. Frontside and backside conductive lines extend in a second direction perpendicular to the first direction, and a conductive structure extends from the frontside conductive line to the backside conductive line along a third direction perpendicular to each of the first and second directions and includes a portion of the MD segment between the second and third locations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:方法</p>  
        <p type="p">502、504、506:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1143" publication-number="202614009"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614009.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614009</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118761</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於顯示裝置的驅動方法</chinese-title>  
        <english-title>DRIVING METHOD FOR DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250620B">G09G3/20</main-classification>  
        <further-classification edition="200601120250620B">G09G5/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮育新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, YU-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱湛峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHAN-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, DI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張偉信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEI-SIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於顯示裝置的驅動方法，顯示裝置包含複數子像素、掃描線及數據線。該方法包括步驟：接收畫面資料，其中畫面資料包含複數子像素灰階值以對應子像素；計算第一子像素對應的第一子像素灰階值與第二子像素對應的第二子像素灰階值之間的差值絕對值，其中第一子像素電性連接一數據線及二掃描線之一者，第二子像素電性連接該數據線及該二掃描線之另一者；以及當差值絕對值大於或等於第一閾值時，調整第一子像素及第二子像素的至少一者的子像素灰階值。其中，第一子像素與第二子像素於調整後的該子像素灰階值之間的一差值絕對值小於第一子像素灰階值及第二子像素灰階值之間的差值絕對值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A driving method for a display device including a plurality of sub pixels, scan lines and data lines is provided. The driving method includes steps of: receiving a frame data including a plurality of sub pixel gray values corresponding to the plurality of sub pixels; calculating a difference absolute value between a first sub pixel gray value corresponding a first sub pixel and a second subpixel gray value corresponding to a second sub pixel, wherein the first sub pixel is electrically connected with one of the plurality of data lines and one of two of the plurality of scan lines, the second first sub pixel is electrically connected with the one of the plurality of data lines and another one of the two of the plurality of scan lines; and when the difference absolute value between the first sub pixel gray value and the second sub pixel gray value is greater than or equal to a first threshold, executing a regulation to regulate at least one of the gray values of the first sub pixel and the second sub pixel. Wherein, a difference absolute value between the gray values of the first sub pixel and the second sub pixel after the regulation is smaller than the difference absolute value between the first sub pixel gray value and the second sub pixel value.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:顯示裝置</p>  
        <p type="p">2:基板</p>  
        <p type="p">5:數據驅動器</p>  
        <p type="p">6:處理單元</p>  
        <p type="p">7:時序控制器</p>  
        <p type="p">S1~S6:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1144" publication-number="202614858"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614858.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614858</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118769</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路裝置及製造積體電路的方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT DEVICE AND METHOD FOR MANUFACTURING INTEGRATED CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251103B">H10D84/85</main-classification>  
        <further-classification edition="200601120251103B">H01L23/528</further-classification>  
        <further-classification edition="200601120251103B">H01L21/60</further-classification>  
        <further-classification edition="202501120251103B">H10D84/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾威程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZENG, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊言</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林威呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾健庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZENG, JIANN-TYNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有CFET裝置的積體電路裝置包括一第一列中的高單元及一第二列中的矮單元。該積體電路裝置進一步包括高單元的該第一列中的一或多個自對準垂直互連件。每一自對準垂直互連件至少部分地嵌入一側凹槽中。該側凹槽具有保形地塗覆有絕緣材料的一邊界表面，該些絕緣材料使與一高單元中的一主動區結構相交的至少一個閘極導體終止。在該積體電路裝置中，在該第二列中連續配置的至少三個矮單元沒有任何自對準垂直互連件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit device with CFET devices includes tall cells in a first row and short cells in a second row. The integrated circuit device further includes one or more self-aligned vertical interconnects in the first row of tall cells. Each self-aligned vertical interconnect is at least partially embedded into a side-recess. The side-recess has a boundary surface conformally coated with insulation materials which terminate at least one gate-conductor intersecting an active-region structure in a tall cell. In the integrated circuit device, at least three short cells consecutively arranged in the second row are absence of any self-aligned vertical interconnect.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">80B:第二類型主動區結構</p>  
        <p type="p">80F:第一類型主動區結構</p>  
        <p type="p">90:電路單元</p>  
        <p type="p">100:自對準垂直互連件</p>  
        <p type="p">101、109:垂直單元邊界</p>  
        <p type="p">102、108:水平邊界</p>  
        <p type="p">120B:下層電力軌</p>  
        <p type="p">120F:上層電力軌</p>  
        <p type="p">122B、124B、126B、128B:下層導線</p>  
        <p type="p">122F、124F、126F、128F:上層導線</p>  
        <p type="p">134B、134F、136B、136F:端導體</p>  
        <p type="p">152B、152F、155B、155F、158B、158F:閘極導體</p>  
        <p type="p">180:側凹槽</p>  
        <p type="p">181、183、188:邊界表面</p>  
        <p type="p">A-A’、B-B’、C-C’:線</p>  
        <p type="p">g151F、g159B、g159F:虛設閘極導體</p>  
        <p type="p">MDLI:端間連接器</p>  
        <p type="p">SA-VLI:垂直連接器</p>  
        <p type="p">VB、VD、VDB、VG:通孔連接器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1145" publication-number="202613738"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613738.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613738</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118773</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板對準系統</chinese-title>  
        <english-title>SUBSTRATE ALIGNMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G03F9/00</main-classification>  
        <further-classification edition="200601120251230B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊烏　丹尼斯　伯恩哈德　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEEUW, DENNIS BERNHARD ANTHONI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾登迪傑克　沃佛瑞德　愛德華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENDENDIJK, WILFRED EDWARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏利克　阿諾　詹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLEEKER, ARNO JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴克斯　傑洛恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEKKERS, JEROEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種基板對準系統，其包含：一固定支撐件；複數個偵測器；複數個偵測器固持器，該等偵測器固持器中之各者經組態以固持該等偵測器中之一相關聯者；複數個中間支撐件，各中間支撐件操作性地安置於該等偵測器固持器中之一相關聯者與該固定支撐件之間；複數個撓曲件，該固定支撐件及各中間支撐件在其間具有該等撓曲件中之至少一者，且各中間支撐件及該等偵測器固持器中之該相關聯者在其間具有該等撓曲件中之至少一者；及複數個致動器，該等致動器中之各者經組態以藉由移動該等中間支撐件中之一相關聯者或該等偵測器固持器中之該關聯者來實現該等偵測器之間的相對定位，該相對定位引起該等撓曲件中之至少一者的撓曲。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate alignment system, comprising: a fixed support; a plurality of detectors; a plurality of detector holders, each of the detector holders configured to hold an associated one of the detectors; a plurality of intermediate supports, each intermediate support operatively disposed between an associated one of the detector holders and the fixed support; a plurality of flexures, the fixed support and each intermediate support having at least one of the flexures therebetween, and each intermediate support and the associated one of the detector holders having at least one of the flexures therebetween; and a plurality of actuators, each of the actuators configured to effect relative positioning between the detectors by moving an associated one of the intermediate supports or the associated one of the detector holders, the relative positioning causing flexing of at least one of the flexures.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:中間支撐件</p>  
        <p type="p">1B:中間支撐件</p>  
        <p type="p">1C:中間支撐件</p>  
        <p type="p">2A:偵測器固持器</p>  
        <p type="p">2B:偵測器固持器</p>  
        <p type="p">2C:偵測器固持器</p>  
        <p type="p">3:固定支撐件</p>  
        <p type="p">4A:偵測器</p>  
        <p type="p">4B:偵測器</p>  
        <p type="p">4C:偵測器</p>  
        <p type="p">5A:輻射光束</p>  
        <p type="p">5B:輻射光束</p>  
        <p type="p">5C:輻射光束</p>  
        <p type="p">10:基板對準系統</p>  
        <p type="p">E1A:撓曲件</p>  
        <p type="p">E1B:撓曲件</p>  
        <p type="p">E1C:撓曲件</p>  
        <p type="p">E2A:撓曲件</p>  
        <p type="p">E2B:撓曲件</p>  
        <p type="p">E2C:撓曲件</p>  
        <p type="p">E3A:撓曲件</p>  
        <p type="p">E3B:撓曲件</p>  
        <p type="p">E3C:撓曲件</p>  
        <p type="p">E4A:撓曲件</p>  
        <p type="p">E4B:撓曲件</p>  
        <p type="p">E4C:撓曲件</p>  
        <p type="p">p&lt;sub&gt;AB&lt;/sub&gt;:節距</p>  
        <p type="p">p&lt;sub&gt;BC&lt;/sub&gt;:節距</p>  
        <p type="p">W:基板</p>  
        <p type="p">x:方向</p>  
        <p type="p">y:方向</p>  
        <p type="p">z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1146" publication-number="202613541"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613541.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613541</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118797</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於半導體計量應用的軟Ｘ射線工具</chinese-title>  
        <english-title>SOFT X-RAY TOOLS FOR SEMICONDUCTOR METROLOGY APPLICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120250910B">G01N23/201</main-classification>  
        <further-classification edition="200601120250910B">G02B5/30</further-classification>  
        <further-classification edition="200601120250910B">G02B5/18</further-classification>  
        <further-classification edition="200601120250910B">H01L21/67</further-classification>  
        <further-classification edition="200601120250910B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ｙ工具股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YTOOLS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒馬克　威廉Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHUMAKER, WILLIAM A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於調節軟X射線範圍內的源射束的光學系統。該光學系統被定位及配置以具有幾何形狀，以重定向該源射束的選定部分，從而以特定入射角照射半導體基板。該光學系統包含至少兩個光學元件。第一光學元件反射具有指定波長的源射束的選定部分。然後，第二光學元件將選定部分作為目標射束反射且聚焦至半導體基板上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical system for conditioning a source beam in the soft X-ray range. The optical system is positioned and configured with a geometry to redirect a selected portion of the source beam for illuminating a semiconductor substrate at a specific angle of incidence. The optical system includes at least two optical elements. A first optical element reflects the selected portion of the source beam having a specified wavelength. The second optical element then reflects and focuses the selected portion as a target beam onto the semiconductor substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">15:源射束</p>  
        <p type="p">304:多層塗層</p>  
        <p type="p">305:晶圓</p>  
        <p type="p">306:目標點</p>  
        <p type="p">316:準直射束</p>  
        <p type="p">316a:射束</p>  
        <p type="p">330:調節光學器件模組</p>  
        <p type="p">332:掃描鏡</p>  
        <p type="p">334:聚焦鏡</p>  
        <p type="p">335:目標射束</p>  
        <p type="p">335a:目標射束</p>  
        <p type="p">340:機電組件</p>  
        <p type="p">342:聚焦鏡</p>  
        <p type="p">344:馬達</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1147" publication-number="202613260"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613260.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613260</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118801</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨組合物</chinese-title>  
        <english-title>A POLISHING COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C09G1/02</main-classification>  
        <further-classification edition="200601120251201B">C09K3/14</further-classification>  
        <further-classification edition="201201120251201B">B24B37/00</further-classification>  
        <further-classification edition="200601120251201B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商福吉米股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMI INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於研磨非晶碳膜(即硬遮罩)所用的化學機械研磨組合物。具體而言，化學機械研磨組合物包括二氧化矽磨料、陰離子界面活性劑、鋁鹽、與水，其以特定量組合而提供有利特性(如高碳移除速率，亦維持低矽移除速率)的組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to chemical mechanical polishing (CMP) compositions for polishing an amorphous carbon (C) film, i.e., a hardmask. In particular, the CMP compositions include a silica abrasive, an anionic surfactant, an aluminum salt and water, combined in specified amounts to provide a composition with advantageous properties such as high C removal rate while also maintaining a low silicon removal rate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1148" publication-number="202612723"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612723.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612723</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118812</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>神經調節蛋白－１　ＨＥＲ３融合蛋白及其治療用途</chinese-title>  
        <english-title>NEUREGULIN-1 HER3 FUSION PROTEIN AND THERAPEUTIC USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K38/18</main-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="200601120260102B">C07K14/475</further-classification>  
        <further-classification edition="200601120260102B">C07K16/28</further-classification>  
        <further-classification edition="200601120260102B">C07K16/32</further-classification>  
        <further-classification edition="200601120260102B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商信立泰生物醫藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SALUBRIS BIOTHERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>墨菲　山繆爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURPHY, SAMUEL L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董　紀軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, JIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛加爾　沙拉布</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGHAL, SHALABH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥艾文　阿曼達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCEWEN, AMANDA MARIE GENTILE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">&lt;b&gt;　　&lt;/b&gt;本文提供重組融合蛋白及利用該重組融合蛋白治療心血管疾病之方法，該重組融合蛋白包含與單特異性ErbB3 (HER3)單株抗體(mAb)融合之神經調節蛋白(neuregulin)-1 (NRG-1)的活性片段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are recombinant fusion proteins comprising an active fragment of neuregulin-1 (NRG-1) fused to a monospecific ErbB3 (HER3) monoclonal antibody (mAb), and methods of using same to treat cardiovascular disease.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1149" publication-number="202613074"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613074.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613074</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118815</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>有機化合物、有機離子性化合物、聚合引發劑、光鹼產生劑及感光性組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C07D207/333</main-classification>  
        <further-classification edition="200601120251229B">C07D307/12</further-classification>  
        <further-classification edition="200601120251229B">C07D307/40</further-classification>  
        <further-classification edition="200601120251229B">C07D307/80</further-classification>  
        <further-classification edition="200601120251229B">C07D333/56</further-classification>  
        <further-classification edition="200601120251229B">C07D335/16</further-classification>  
        <further-classification edition="200601120251229B">C07D487/04</further-classification>  
        <further-classification edition="200601120251229B">G03F7/031</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大東凱米克斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAITO CHEMIX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松井吉行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUI, YOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種吸光特性優異之新穎之有機化合物及有機離子性化合物。本發明之實施型態之有機化合物具有下述式(1)所示之結構。式(1)中，R&lt;sup&gt;1&lt;/sup&gt;表示選自於由氫原子、碳數1至8之烷基、及經取代或未經取代之苯基所構成群組中之至少一種基；R&lt;sup&gt;2&lt;/sup&gt;表示選自於由氫原子、碳數1至8之烷基、碳數1至4之烷基羰基、經取代或未經取代之苯基、經取代或未經取代之苯甲醯基、及羧甲基所構成群組中之至少一種基；X表示具有於環內包含至少1個氧原子、氮原子或硫原子之雜環骨架的有機基。&lt;br/&gt;&lt;img align="absmiddle" height="323px" width="642px" file="ed10069.JPG" alt="ed10069.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1150" publication-number="202614218"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614218.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614218</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118825</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用酸形成氣體的低溫蝕刻</chinese-title>  
        <english-title>CRYOGENIC ETCH USING ACID FORMING GAS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">H01L21/311</main-classification>  
        <further-classification edition="200601120251231B">H01L21/3213</further-classification>  
        <further-classification edition="200601120251231B">H01L21/67</further-classification>  
        <further-classification edition="200601120251231B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立爾　托爾斯滕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LILL, THORSTEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　明梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MINGMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　允鎮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, YOUN-JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席恩　哈密特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, HARMEET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種用於在堆疊中蝕刻下凹特徵部的方法。將酸形成氣體與水混合以在該堆疊的表面上形成酸，其中該酸形成該堆疊的至少一改質區域。使該堆疊曝露至能量，該能量使該堆疊的該至少一改質區域揮發。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of etching recessed features in a stack is provided. An acid forming gas is mixed with water to form an acid on a surface of the stack, wherein the acid forms at least one modified region of the stack. The stack is exposed to energy that volatilizes the at least one modified region of the stack.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">104:步驟</p>  
        <p type="p">108:步驟</p>  
        <p type="p">112:步驟</p>  
        <p type="p">116:步驟</p>  
        <p type="p">120:步驟</p>  
        <p type="p">124:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1151" publication-number="202613285"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613285.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613285</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118884</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶介質</chinese-title>  
        <english-title>LIQUID-CRYSTAL MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C09K19/30</main-classification>  
        <further-classification edition="200601120260102B">C09K19/34</further-classification>  
        <further-classification edition="200601120260102B">C09K19/32</further-classification>  
        <further-classification edition="200601120260102B">C09K19/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬克專利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀奇曼　哈拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRSCHMANN, HARALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦卡瑞斯科　維根尼京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKARESKO, EWGENIJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種尤其基於極性化合物之混合物的液晶介質，且係關於其用於尤其基於VA、SA-VA、IPS、PS-IPS、FFS、PS-FFS、UB-FFS或PS-UB-FFS效應之主動矩陣顯示器的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a liquid-crystalline medium, in particular based on a mixture of polar compounds, and to the use thereof for an active-matrix display, in particular based on the VA, SA-VA, IPS, PS-IPS, FFS, PS-FFS, UB-FFS or PS-UB-FFS effect.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1152" publication-number="202612702"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612702.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612702</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118896</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吡啶并［２，３－ｄ］嘧啶－２（１Ｈ）－酮類衍生物聯合用藥在治療和預防腫瘤疾病中的用途</chinese-title>  
        <english-title>USE OF PYRIDO[2,3-D]PYRIMIDIN-2(1H)-ONE DERIVATIVES IN COMBINATION THERAPY FOR TREATMENT AND PREVENTION OF TUMOR DISEASES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/519</main-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="200601120260102B">A61K31/555</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮書君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, SHUJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴爽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, SHUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張奕宙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YIZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周遠鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YUANFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種吡啶并[2,3-d]嘧啶-2(1H)-酮類衍生物與免疫抑制劑或/和化療藥物聯合在製備抗腫瘤藥物中的聯合應用，且本發明提供了一種吡啶并[2,3-d]嘧啶-2(1H)-酮類衍生物與免疫抑制劑或/和化療藥物聯合在製備預防或治療腫瘤疾病的藥物中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to the combined use of pyrido[2,3-d]pyrimidin-2(1H)-one derivatives with immunosuppressants and/or chemotherapeutic drugs in the preparation of antitumor medications. Specifically, the invention provides a pharmaceutical application wherein the combination of pyrido[2,3-d]pyrimidin-2(1H)-one derivatives and immunosuppressants and/or chemotherapeutic drugs is employed for the prevention or treatment of tumor diseases.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1153" publication-number="202612718"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612718.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612718</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118917</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銀椴苷組成物及其製造方法</chinese-title>  
        <english-title>TILIROSIDE COMPOSITION AND METHOD FOR PRODUCING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K36/738</main-classification>  
        <further-classification edition="200601120260102B">A61K31/7048</further-classification>  
        <further-classification edition="200601120260102B">A61K47/14</further-classification>  
        <further-classification edition="200601120260102B">A61K47/26</further-classification>  
        <further-classification edition="200601120260102B">A61K47/40</further-classification>  
        <further-classification edition="200601120260102B">A61K9/14</further-classification>  
        <further-classification edition="200601120260102B">A61K9/08</further-classification>  
        <further-classification edition="200601120260102B">A61P3/06</further-classification>  
        <further-classification edition="200601120260102B">A61P3/10</further-classification>  
        <further-classification edition="201601120260102B">A23L33/105</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商森下仁丹股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORISHITA JINTAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小森紀明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMORI, NORIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小里建喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORI, KENSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小南海周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMINAMI, MICHIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村久美子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, KUMIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>乗上奈奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NORIKAMI, NANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川上宏智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAKAMI, HIROSATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種即使在組成物中存在玫瑰果(rosehip)萃取物所含之銀椴苷(tiliroside)亦可輕易地溶解於水系溶劑之銀椴苷組成物、含有該銀椴苷組成物之液狀組成物及其製造方法。 &lt;br/&gt;本發明的銀椴苷組成物包含玫瑰果萃取物與蔗糖脂肪酸酯，前述玫瑰果萃取物含有銀椴苷，前述蔗糖脂肪酸酯的平均酯化度為1.01以上且1.1以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a tiliroside composition that can be easily dissolved in an aqueous solvent, even when tiliroside contained in a rosehip extract is present in the composition; a liquid composition containing the tiliroside composition; and a method for producing the same. &lt;br/&gt;The tiliroside composition of the present invention comprises a rosehip extract and a sucrose fatty acid ester. The rosehip extract contains tiliroside, and the sucrose fatty acid ester has an average esterification degree of 1.01 or more and 1.1 or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1154" publication-number="202613231"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613231.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613231</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118942</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合化纖維素粒子</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C08L1/02</main-classification>  
        <further-classification edition="200601120260102B">C08L83/08</further-classification>  
        <further-classification edition="200601120260102B">C08J3/12</further-classification>  
        <further-classification edition="200601120260102B">A61K8/73</further-classification>  
        <further-classification edition="200601120260102B">A61K8/898</further-classification>  
        <further-classification edition="200601120260102B">A61Q1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>手塚光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEZUKA, HIKARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林祐輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和田知也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WADA, TOMOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國光隼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNIMITSU, HAYATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田貢平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之複合化纖維素粒子係含有纖維素、及功能性物質者，上述複合化纖維素粒子之壓縮彈性模數為50 MPa以下，且彈性回復率為5%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1155" publication-number="202614850"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614850.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614850</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118943</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251106B">H10D84/80</main-classification>  
        <further-classification edition="202501120251106B">H10D84/01</further-classification>  
        <further-classification edition="200601120251106B">H01L21/768</further-classification>  
        <further-classification edition="200601120251106B">H01L23/52</further-classification>  
        <further-classification edition="202501120251106B">H10D62/10</further-classification>  
        <further-classification edition="202501120251106B">H10D62/40</further-classification>  
        <further-classification edition="202501120251106B">H10D64/20</further-classification>  
        <further-classification edition="202301120251106B">H10B10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王屏薇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, PING-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞麟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JUI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪連嶸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, LIEN-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一裝置，包含具有第一面及第二面的基板；形成於第一面的第一電晶體、第二電晶體、第三電晶體，及第四電晶體，第一至第四電晶體的每一者形成且具有p型導電性；形成於第一面且位於第一至第四電晶體上方的第五至第六電晶體、第五至第六電晶體的每一者形成且具有n型導電性；形成於第一面且位於第五至第六電晶體上方的第一互連結構，第一互連結構的每一者至少耦接至第五及第六電晶體且用以乘載電源電壓；及形成於第二面的第二互連結構，第二互連結構的每一者至少耦接至第一及第二電晶體且用以乘載接地電壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device includes a substrate having a first side and a second side; a first transistor, a second transistor, a third transistor, and a fourth transistor formed on the first side, the first to fourth transistors each formed with a p-type conductivity; a fifth transistor and a sixth transistor formed on the first side and over the first to fourth transistors, the fifth to sixth transistors each formed with an n-type conductivity; first interconnect structures formed on the first side and over the fifth to sixth transistors, each of the first interconnect structures coupled at least to the fifth and sixth transistors and configured to carry a supply voltage; and second interconnect structures formed on the second side, each of the second interconnect structures coupled at least to the first and second transistors and configured to carry a ground voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2500:方法</p>  
        <p type="p">2502~2518:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1156" publication-number="202613038"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613038.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613038</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118971</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水處理裝置之量測系統及量測方法</chinese-title>  
        <english-title>MEASUREMENT SYSTEM AND MEASUREMENT METHOD FOR WATER TREATMENT DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251229B">C02F1/00</main-classification>  
        <further-classification edition="200601120251229B">G01N33/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商奧璐佳瑙股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORGANO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, TSUKASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田博史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>市原史貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICHIHARA, FUMITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種水處理裝置之量測系統50，具有：複數之採水配管L4，取得被量測水；量測配管L5，複數之採水配管L4匯流而成；至少一量測裝置11，配置於或連接於量測配管L5，量測被量測水的水質；複數之噴吹配管L8，從複數之採水配管L4分別分支出來；及複數之採水切換閥V3，分別設置在複數之採水配管L4，位在噴吹配管L8之分支部P3的下游。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A measurement system 50 for a water treatment device comprises a plurality of water sampling lines L4 which acquire samples of a water to be measured, a measurement line L5 formed by the confluence of the plurality of water sampling lines L4, at least one measurement device 11 which is disposed in or connected to the measurement line L5 and measures the water quality of the water to be measured, a plurality of blow lines L8 which branch from each of the plurality of water sampling lines L4, and a plurality of water sample switching valves V3 which are provided in each of the plurality of water sampling lines L4, positioned downstream of a branching section P3 of the blow line L8.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:純水槽</p>  
        <p type="p">8:超過濾膜裝置</p>  
        <p type="p">8A,8B:超過濾膜模組</p>  
        <p type="p">11:量測裝置</p>  
        <p type="p">12:控制裝置</p>  
        <p type="p">50:量測系統</p>  
        <p type="p">L1:母管</p>  
        <p type="p">L3:配管</p>  
        <p type="p">L4:採水配管</p>  
        <p type="p">L5:量測配管</p>  
        <p type="p">L6:主配管</p>  
        <p type="p">L7:分支管</p>  
        <p type="p">L8:噴吹配管</p>  
        <p type="p">L9:回收配管</p>  
        <p type="p">P1:匯流點</p>  
        <p type="p">P2:採水點</p>  
        <p type="p">P3:分支部</p>  
        <p type="p">V1:壓力調整閥</p>  
        <p type="p">V2:流量調整閥</p>  
        <p type="p">V3:採水切換閥</p>  
        <p type="p">V4:噴吹切換閥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1157" publication-number="202614124"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614124.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614124</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114118976</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於基板處理的加熱處理套件</chinese-title>  
        <english-title>HEATED PROCESS KIT FOR SUBSTRATE PROCESSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01J37/244</main-classification>  
        <further-classification edition="200601120251229B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安格維　帕森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGARWAL, PRASHANT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱普迪　亞南斯克里許納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUPUDI, ANANTHKRISHNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴布　薩拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BABU, SARATH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賓尤索夫李　穆罕默德赫費滋里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIN YUSOF LEE, MUHAMMAD HAFEEZ LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供用於基板處理的方法和裝置，使用的處理套件以用於處理腔室包括：具有頂側和底側的頂板；底側上設置的複數個孔；從頂板的外部延伸並與複數個孔耦合的通道；至少一個嵌入在頂板中的加熱器；以及至少一個嵌入在頂板中的溫度感測器，其中氣流路徑從通道延伸穿過複數個孔，並進入處理腔室的內部體積。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and apparatus for substrate processing are provided that use a process kit for use in a process chamber, comprising: a top plate having a top side and a bottom side; a plurality of holes disposed on the bottom side; a channel extending from an outer portion of the top plate and coupled to the plurality of holes; at least one heater embedded in the top plate; and at least one temperature sensor embedded in the top plate, wherein a gas flow path extends from the channel, through the plurality of holes, and into an interior volume of the process chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:處理腔室</p>  
        <p type="p">102:電漿</p>  
        <p type="p">104:蓋板</p>  
        <p type="p">105:下部屏蔽件</p>  
        <p type="p">106:腔室主體</p>  
        <p type="p">108:平臺</p>  
        <p type="p">109:升舉銷</p>  
        <p type="p">110:波紋管組件</p>  
        <p type="p">111:軸</p>  
        <p type="p">112:中空支撐軸</p>  
        <p type="p">113:升舉機構</p>  
        <p type="p">114:真空系統</p>  
        <p type="p">115:接地</p>  
        <p type="p">117:上部屏蔽件</p>  
        <p type="p">118:處理氣體供應期</p>  
        <p type="p">119:處理體積</p>  
        <p type="p">120:內部體積</p>  
        <p type="p">122:基板</p>  
        <p type="p">124:基板支撐件</p>  
        <p type="p">126:底表面</p>  
        <p type="p">128:泵口</p>  
        <p type="p">130:基板升舉裝置</p>  
        <p type="p">131:波紋管組件</p>  
        <p type="p">132:第二升舉機構</p>  
        <p type="p">134:狹縫閥</p>  
        <p type="p">136:底座</p>  
        <p type="p">138:氣體通道</p>  
        <p type="p">141:背部氣體供應</p>  
        <p type="p">142:氣體導管</p>  
        <p type="p">150:靜電吸盤</p>  
        <p type="p">152:上表面</p>  
        <p type="p">154:導管</p>  
        <p type="p">156:側壁</p>  
        <p type="p">158:頂面</p>  
        <p type="p">160:處理套件</p>  
        <p type="p">162:氣室</p>  
        <p type="p">164:下波紋管凸緣</p>  
        <p type="p">165:O型環</p>  
        <p type="p">166:通道</p>  
        <p type="p">168:複數個孔</p>  
        <p type="p">170:底側</p>  
        <p type="p">172:頂板</p>  
        <p type="p">174:凸緣</p>  
        <p type="p">176:熱絕緣材料</p>  
        <p type="p">177:上部熱絕緣材料</p>  
        <p type="p">178:管狀主體</p>  
        <p type="p">179:下部熱絕緣材料</p>  
        <p type="p">180:下襯墊</p>  
        <p type="p">182:環形環</p>  
        <p type="p">184:環形唇</p>  
        <p type="p">186:複數個環槽</p>  
        <p type="p">187:邊緣環</p>  
        <p type="p">188:複數個唇槽</p>  
        <p type="p">190:RF電源</p>  
        <p type="p">192:外側</p>  
        <p type="p">A:部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1158" publication-number="202613185"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613185.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613185</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119003</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低取代度羥丙基纖維素的製造方法</chinese-title>  
        <english-title>METHOD FOR PRODUCING LOW-SUBSTITUTED HYDROXYPROPYL CELLULOSE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C08B11/20</main-classification>  
        <further-classification edition="200601120260102B">C08B1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平間康之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAMA, YASUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲田慎之介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INADA, SHINNOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種維持著充分的結合性同時具有良好的崩解性之低取代度羥丙基纖維素的製造方法。 &lt;br/&gt;　　解決手段為一種羥丙氧基含量為5～16質量%的低取代度羥丙基纖維素的製造方法，其至少包含： &lt;br/&gt;　　使紙漿與鹼金屬氫氧化物溶液接觸而得到鹼纖維素之步驟； &lt;br/&gt;　　使前述鹼纖維素與環氧丙烷反應而得到反應生成物之步驟； &lt;br/&gt;　　將前述反應生成物分散於至少含有酸的水中，於一部分溶解後，以酸中和而使粗低取代度羥丙基纖維素析出之步驟； &lt;br/&gt;　　藉由螺旋壓機將前述粗低取代度羥丙基纖維素進行脫液，得到含水率為50～60質量%的精製低取代度羥丙基纖維素之步驟；及 &lt;br/&gt;　　乾燥及粉碎前述精製低取代度羥丙基纖維素之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a method for producing low-substituted hydroxypropyl cellulose having favorable disintegratability while maintaining sufficient compactibility. The method essentially includes the steps of: bringing an alkali metal hydroxide solution into contact with a pulp to prepare alkali cellulose; reacting the alkali cellulose with propylene oxide to obtain a reaction product; dispersing the reaction product into a solution containing at least an acid to partially solubilize the reaction product, and then neutralizing the reaction product with an additional amount of acid to precipitate crude low-substituted hydroxypropyl cellulose; using a screw press to remove liquid from the crude low-substituted hydroxypropyl cellulose to obtain purified low-substituted hydroxypropyl cellulose having a water content of 50 to 60% by mass; and drying and pulverizing the purified low-substituted hydroxypropyl cellulose, wherein the method produces low-substituted hydroxypropyl cellulose having a hydroxypropoxy group content of 5.0 to 16.0% by mass.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1159" publication-number="202613715"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613715.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613715</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119006</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>判定感測器基準點劣化之方法</chinese-title>  
        <english-title>METHOD OF DETERMINING DEGRADATION ON A SENSOR FIDUCIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">G03F7/00</main-classification>  
        <further-classification edition="200601120251231B">G03F9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納伽薩　達摩　拉迪烏斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGASSA DHARMA, RADIUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ID</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜曼　奧澤爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUMAN, OZER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊莎　哈姆茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISSA, HAMZE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅斯塔米　哈米德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROSTAMI, HAMIDEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡波內　盧多維科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARBONE, LUDOVICO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡勒　阿里茲門迪亞里埃塔　米克爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CALLE ARIZMENDIARRIETA, MIKEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種判定一感測器基準點之一基準點劣化度量之方法。該方法包含：獲得基準點平面位置資料，該基準點平面位置資料描述一基準點表面上之複數個標記在一時段內且在一基準點平面中之一位置；自該基準點平面位置資料判定第一基準點位置漂移資料，該第一基準點位置漂移資料描述該基準點平面位置資料內之經量測位置之一時間漂移；獲得高度資料，該高度資料描述該基準點表面之在該時段內且垂直於該基準點平面之一位置；自該高度資料判定第二基準點位置漂移資料；及自該第一基準點位置漂移資料及該第二基準點位置漂移資料判定該基準點劣化度量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a method of determining a fiducial degradation metric for a sensor fiducial. The method comprises obtaining fiducial plane position data describing a position over a time period, and in a fiducial plane, of a plurality of marks on a fiducial surface; determining first fiducial position drift data from the fiducial plane position data, said first fiducial position drift data describing a temporal drift in measured positions within the fiducial plane position data; obtaining height data describing a position over said time period, and perpendicular to the fiducial plane, of the fiducial surface; determining second fiducial position drift data from said height data; and determining the fiducial degradation metric from said first fiducial position drift data and said second fiducial position drift data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:標記</p>  
        <p type="p">410:標記</p>  
        <p type="p">420:高度資料點</p>  
        <p type="p">430:高度</p>  
        <p type="p">440:經擬合模型</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1160" publication-number="202613067"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613067.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613067</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119014</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶介質</chinese-title>  
        <english-title>LIQUID CRYSTAL MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07C39/23</main-classification>  
        <further-classification edition="200601120260102B">C09K19/30</further-classification>  
        <further-classification edition="200601120260102B">C09K19/34</further-classification>  
        <further-classification edition="200601120260102B">G02F1/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬克專利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZOE (JING)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李熙規</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HEE-KYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勞特　史分　克里斯丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAUT, SVEN CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉克納　艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LACKNER, AARON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏沙科輔　迪米崔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USHAKOV, DMITRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛特　羅可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORTTE, ROCCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍曲　飛利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUCHER, PHILIPP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於具有正介電各向異性之液晶(LC)介質及含有此等介質之液晶顯示器(LCD)，尤其係關於由主動矩陣定址之顯示器且特定言之TN、PS-TN、STN、TN-TFT、OCB、IPS、PS-IPS、FFS、HB-FFS、XB-FFS、PS-FFS、SA-HB-FFS、SA-XB-FFS、聚合物穩定之SA-HB-FFS、聚合物穩定之SA-XB-FFS、正VA或正PS-VA類型的LC顯示器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to liquid-crystalline (LC) media having positive dielectric anisotropy and to liquid-crystal displays (LCDs) containing these media, especially to displays addressed by an active matrix and in particular to LC displays of the TN, PS-TN, STN, TN-TFT, OCB, IPS, PS-IPS, FFS, HB-FFS, XB-FFS, PS-FFS, SA-HB-FFS, SA-XB-FFS, polymer stabilised SA-HB-FFS, polymer stabilised SA-XB-FFS, positive VA or positive PS-VA type.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1161" publication-number="202613137"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613137.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613137</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119022</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新晶型</chinese-title>  
        <english-title>NOVEL CRYSTAL FORM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D495/14</main-classification>  
        <further-classification edition="200601120260102B">A61K31/519</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商艾斯巴赫生物有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EISBACH BIO GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>門澤爾　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MENZER, WILLIAM M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及7-(4-溴苯基)-2-側氧-9-(三氟甲基)-1,2-二氫吡啶並[3',2':4,5]噻吩並[3,2-d]嘧啶-4-酸鈉水合物（sodium 7-(4-bromophenyl)-2-oxo-9-(trifluoromethyl)-1,2-dihydropyrido[3',2':4,5]thieno[3,2-d]pyrimidin-4-olate hydrate）的新晶型、其製備方法以及包括其的醫藥組成物。這些化合物可用於治療增生性疾病，尤其是癌症。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to novel crystal forms of sodium 7-(4-bromophenyl)-2-oxo-9-(trifluoromethyl)-1,2-dihydropyrido[3',2':4,5]thieno[3,2-d]pyrimidin-4-olate hydrate, processes for the manufacture thereof and pharmaceutical compositions comprising them. These compounds are useful in treating proliferative diseases, particularly cancer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1162" publication-number="202614637"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614637.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614637</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119025</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓電揚聲器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H04R17/00</main-classification>  
        <further-classification edition="202301120251001B">H10N30/20</further-classification>  
        <further-classification edition="202301120251001B">H10N30/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大戶康平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTO, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種壓電揚聲器(10)，包含屈曲型壓電致動器(35)、振動板(41)、固定面(17)以及中介層(42)。振動板(41)藉由屈曲型壓電致動器(35)而被振動。固定面(17)是用來固定於支撐體(80)的面。中介層(42)是配置於振動板(41)及固定面(17)之間。中介層(42)的驅動係數為1[(kg・mm)/(GPa・m&lt;sup&gt;3&lt;/sup&gt;)]以上。驅動係數是藉由將中介層(42)的厚度與中介層(42)的密度之乘積除以中介層(42)的楊氏模數而得到之值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:壓電揚聲器</p>  
        <p type="p">17:固定面</p>  
        <p type="p">30:壓電體</p>  
        <p type="p">35:屈曲型壓電致動器</p>  
        <p type="p">41:振動板</p>  
        <p type="p">42:中介層</p>  
        <p type="p">51,52,53:接合層</p>  
        <p type="p">61,62:電極</p>  
        <p type="p">70:積層構造</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1163" publication-number="202614638"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614638.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614638</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119026</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓電揚聲器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H04R17/00</main-classification>  
        <further-classification edition="202301120251001B">H10N30/20</further-classification>  
        <further-classification edition="202301120251001B">H10N30/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大戶康平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTO, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種壓電揚聲器(10)，包含屈曲型壓電致動器(35)、振動板(41)、固定面(17)以及中介層(42)。振動板(41)藉由屈曲型壓電致動器(35)而被振動。固定面(17)是用來固定於支撐體(80)的面。中介層(42)是配置於振動板(41)及固定面(17)之間。振動板(41)的屈曲係數為100[kg/(GPa・mm・m&lt;sup&gt;3&lt;/sup&gt;)]以上。屈曲係數是藉由將振動板(41)的密度除以振動板(41)的楊氏模數與振動板(41)的厚度之乘積而得到之值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:壓電揚聲器</p>  
        <p type="p">17:固定面</p>  
        <p type="p">30:壓電體</p>  
        <p type="p">35:屈曲型壓電致動器</p>  
        <p type="p">41:振動板</p>  
        <p type="p">42:中介層</p>  
        <p type="p">51,52,53:接合層</p>  
        <p type="p">61,62:電極</p>  
        <p type="p">70:積層構造</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1164" publication-number="202614639"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614639.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614639</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119027</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓電揚聲器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H04R17/00</main-classification>  
        <further-classification edition="202301120251001B">H10N30/20</further-classification>  
        <further-classification edition="202301120251001B">H10N30/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大戶康平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTO, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種壓電揚聲器(10)，包含屈曲型壓電致動器(35)、振動板(41)、固定面(17)以及中介層(42)。振動板(41)藉由屈曲型壓電致動器(35)而被振動。固定面(17)是用來固定於支撐體(80)的面。中介層(42)是配置於振動板(41)及固定面(17)之間。在平面視角下觀察振動板(41)時，在振動板(41)的面積的50%以上且100%以下的區域中存在固定面(17)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:壓電揚聲器</p>  
        <p type="p">17:固定面</p>  
        <p type="p">30:壓電體</p>  
        <p type="p">35:屈曲型壓電致動器</p>  
        <p type="p">41:振動板</p>  
        <p type="p">42:中介層</p>  
        <p type="p">51,52,53:接合層</p>  
        <p type="p">61,62:電極</p>  
        <p type="p">70:積層構造</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1165" publication-number="202612926"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612926.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612926</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119031</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電動車輛所用之通訊控制裝置及其充電控制方法</chinese-title>  
        <english-title>COMMUNICATION CONTROL DEVICE FOR ELECTRIC VEHICLE, AND CHARGING CONTROL METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251216B">B60L53/16</main-classification>  
        <further-classification edition="201901120251216B">B60L53/30</further-classification>  
        <further-classification edition="201901120251216B">B60L53/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申桄燮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, KWANG SEOB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於電動車輛的通訊控制裝置，包括：一充電控制單元，配置為產生一充電用控制訊號；一連接單元，其連接至一電動車輛供電設備 (EVSE)，並配置為根據該充電控制訊號，將從該EVSE 接收的電力傳輸至一電池；及一偵測單元，其中，該連接單元包括配置成接收來自該EVSE的一第一充電順序訊號的一第一線路、配置成接收來自該EVSE的一第二充電順序訊號的一第二線路，配置成接收該EVSE的連接器接近偵測訊號的一第三線路、配置成將一充電許可訊號傳輸至該EVSE的一第四線路，及配置成接收來自該EVSE的電源的一快速充電終端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A communication control device for an electric vehicle according to one embodiment of the present invention includes a charging control unit configured to generate a control signal for charging, and a connection unit connected to electric vehicle supply equipment (EVSE) and configured to transmit power received from the EVSE to a battery according to the control signal for charging, and a detection unit, wherein the connection unit includes a first line configured to receive a first charge sequence signal from the EVSE, a second line configured to receive a second charge sequence signal from the EVSE, a third line configured to receive a connector proximity detection signal of the EVSE, a fourth line configured to transmit a charge permission signal to the EVSE, and a fast charging terminal configured to receive the power from the EVSE.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:電路圖</p>  
        <p type="p">710:EVSE側電路圖</p>  
        <p type="p">720:EV側電路圖</p>  
        <p type="p">721:濾波單元</p>  
        <p type="p">722:開關單元</p>  
        <p type="p">723:偵測單元</p>  
        <p type="p">810:第一偵測單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1166" publication-number="202612615"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612615.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612615</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119032</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於傢俱配件的彈出裝置形式的驅動裝置</chinese-title>  
        <english-title>DRIVE DEVICE IN THE FORM OF AN EJECTION DEVICE FOR A FURNITURE FITTING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251229B">A47B88/463</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商朱利葉斯百隆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JULIUS BLUM GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊沙　帕斯卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANSER, PASCAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾哈特　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ERHART, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種形式為彈出裝置（1）的驅動裝置，該驅動裝置用於傢俱配件，使得可移動傢俱部件（2）相對於傢俱主體（3）自閉合位置（4）朝著打開位置（5）移動，包括：&lt;br/&gt; -  一殼體（6），&lt;br/&gt; -  一彈出機構（7），用於從彈出裝置（1）向可移動傢俱部件（2）傳遞作用力，&lt;br/&gt; -  一蓄能器裝置（8），用於向彈出機構（7）施加作用力，&lt;br/&gt; -  一止動件（9），用於限制彈出機構（7）在閉合方向上的移動，以及&lt;br/&gt; -  一調節機構（10），藉由該調節機構可調節彈出機構（7）在閉合位置（4）朝著閉合方向相對於調節機構（10）的間距（11），其中調節機構（10）佈置在殼體（6）上，&lt;br/&gt; 其中彈出機構（7）在閉合位置（4）上相對於調節機構（10）的間距（11），可藉由調節機構（10）透過止動件（9）或殼體（6）與彈出機構（7）相對於調節機構（10）的移動進行調節。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:彈出裝置</p>  
        <p type="p">4:閉合位置</p>  
        <p type="p">6:殼體</p>  
        <p type="p">7:彈出機構</p>  
        <p type="p">8:蓄能器裝置</p>  
        <p type="p">9:止動件</p>  
        <p type="p">10:調節機構</p>  
        <p type="p">11:間距</p>  
        <p type="p">13:距離</p>  
        <p type="p">14:調節裝置</p>  
        <p type="p">19:閉鎖裝置</p>  
        <p type="p">20:另外的閉鎖裝置</p>  
        <p type="p">21:另外的殼體</p>  
        <p type="p">22:支架</p>  
        <p type="p">23:重設機構</p>  
        <p type="p">25:搖桿</p>  
        <p type="p">30:調節輪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1167" publication-number="202613359"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613359.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613359</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119044</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造多區域噴頭</chinese-title>  
        <english-title>SEMICONDUCTOR MANUFACTURING MULTI-ZONE SHOWERHEAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">C23C16/54</main-classification>  
        <further-classification edition="200601120251226B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德維拉詹　賈納爾德罕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEVRAJAN, JANARDHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡帕庫托　阿杜安柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUPPAKKATTU, ABDUL AKBAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉瑪達斯　拉凱許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMADAS, RAKESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆斯塔法　姆漢納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUSTAFA, MUHANNAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維許納和拉　賽巴哈拉瓦吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VISHNUBHOTLA, SAI BHARADWAJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔帕西　阿比納許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRIPATHY, ABINASH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了改善流動均勻性的半導體製造處理腔室的氣體分配組件。這些氣體分配組件包括背板、噴頭和位於背板與噴頭之間的擴散板。擴散板具有中心開口和與背板中的進口及噴頭中的凹槽對齊的至少一個區域開口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Gas distribution assemblies for semiconductor manufacturing processing chambers that improve flow uniformity are described. The gas distribution assemblies comprise a backing plate, a showerhead and a diffuser plate between the backing plate and the showerhead. The diffuser plate has a center opening and at least one zone opening aligned with inlets in the backing plate and recesses in the showerhead.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:處理腔室</p>  
        <p type="p">101:腔室主體</p>  
        <p type="p">102:側壁</p>  
        <p type="p">103:底部</p>  
        <p type="p">105:內部空間</p>  
        <p type="p">106:排氣</p>  
        <p type="p">108:晶圓</p>  
        <p type="p">109:處理間隙</p>  
        <p type="p">110:氣體分配組件</p>  
        <p type="p">120:背板</p>  
        <p type="p">122:後表面</p>  
        <p type="p">123:中心進口</p>  
        <p type="p">130:噴頭</p>  
        <p type="p">131:前表面</p>  
        <p type="p">132i:後表面</p>  
        <p type="p">170:基板支撐</p>  
        <p type="p">171:支撐主體</p>  
        <p type="p">172:支撐軸</p>  
        <p type="p">175:旋轉軸</p>  
        <p type="p">190:加熱器組件</p>  
        <p type="p">211:區域進口</p>  
        <p type="p">231:中心凹槽</p>  
        <p type="p">232:內部部分</p>  
        <p type="p">235:環形區域凹槽</p>  
        <p type="p">236:外部部分</p>  
        <p type="p">240:第一環形區域凹槽</p>  
        <p type="p">242:環形壁</p>  
        <p type="p">244:第二環形區域凹槽</p>  
        <p type="p">250:擴散板</p>  
        <p type="p">260:中心開口</p>  
        <p type="p">280:第一區域開口</p>  
        <p type="p">290:第二區域開口</p>  
        <p type="p">410:外環形開口</p>  
        <p type="p">450:外環形插入件</p>  
        <p type="p">455:凸緣部分</p>  
        <p type="p">456:底表面</p>  
        <p type="p">460:下部延伸</p>  
        <p type="p">462:內面</p>  
        <p type="p">464:外面</p>  
        <p type="p">468:複數個孔</p>  
        <p type="p">470:內部通道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1168" publication-number="202613301"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613301.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613301</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119050</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>細菌培養檢測方法</chinese-title>  
        <english-title>BACTERIAL CULTURE INSPECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C12N1/00</main-classification>  
        <further-classification edition="200601120260102B">C12N1/20</further-classification>  
        <further-classification edition="200601120260102B">C12Q1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人富山大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY CORPORATION UNIVERSITY OF TOYAMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商實驗室技術股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LABTECHS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁井見英樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIIMI, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供在細菌之增殖中，縮短誘導期之方法。使用藉由(1)在培養液接種葡萄球菌屬(Staphylococcus)，得到培養後之培養液之步驟；及(2)從培養後之培養液去除葡萄球菌屬(Staphylococcus)之步驟而得到的成長刺激溶液、或使成長刺激溶液乾燥而得到的成長刺激粉末。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the invention is to provide a method for reducing the lag phase during bacterial growth. The method uses either a growth stimulating solution obtained by (1) a step of inoculating a culture medium with Staphylococcus and obtaining a cultured culture medium, and (2) a step of removing the Staphylococcus from the cultured culture medium, or a growth stimulating powder obtained by drying this growth stimulating solution.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1169" publication-number="202612822"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612822.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612822</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119053</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置用矽電極板與其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">B23H1/00</main-classification>  
        <further-classification edition="200601120260102B">C23C16/50</further-classification>  
        <further-classification edition="200601120260102B">C30B29/06</further-classification>  
        <further-classification edition="200601120260102B">H01L21/3065</further-classification>  
        <further-classification edition="200601120260102B">H01L21/31</further-classification>  
        <further-classification edition="200601120260102B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱綜合材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI MATERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村和泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松尾文晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUO, FUMIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電漿處理裝置用矽電極板，其特徵係，分別在矽電極板之板中央部、外周部、中間部具備多個狹縫狀的氣體流路(11)，是在板厚方向(D1)上，從第一面(301)貫通至與該第一面(301)相反位置的第二面(302)；氣體流路(11)形成為，從第一面(301)之入口(111)至第二面(302)之出口(112)為止的深度(C)，除以狹縫寬度(A)，所得之長寬比為10以上80以下；並且一個氣體流路(11)中，入口(111)與出口(112)之直線狀長緣與圓弧狀短緣形成寬度0.1mm以上的鑿口，則鑿口總數的平均值n1為3個以下(n1≦3)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:氣體流路</p>  
        <p type="p">111:入口</p>  
        <p type="p">111B:短緣</p>  
        <p type="p">112:出口</p>  
        <p type="p">112B:短緣</p>  
        <p type="p">113A:第一壁面部</p>  
        <p type="p">113B:第二壁面部</p>  
        <p type="p">301:第一面</p>  
        <p type="p">302:第二面</p>  
        <p type="p">b1:間隔</p>  
        <p type="p">b2:間隔</p>  
        <p type="p">D1:板厚方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1170" publication-number="202612813"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612813.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612813</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119058</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅燒結體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120260102B">B22F1/00</main-classification>  
        <further-classification edition="202201120260102B">B22F1/054</further-classification>  
        <further-classification edition="202201120260102B">B22F1/10</further-classification>  
        <further-classification edition="200601120260102B">B22F9/00</further-classification>  
        <further-classification edition="202301120260102B">C22C1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江山誉昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EYAMA, TAKAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種具有較低之彈性模數之銅燒結體及其製造方法。[1]一種銅燒結體，其拉伸彈性模數為35 GPa以下；[2]一種銅燒結體之製造方法，其包括如下步驟：對包含銅奈米粒子A及下述聚合物B之分散體D一面施加0.1 MPa以上40 MPa之壓力，一面以240℃以上300℃以下之焙燒溫度進行焙燒。聚合物B：包含源自具有羧基之單體(b-1)之結構單元、及源自具有聚伸烷基二醇鏈段之單體(b-2)之結構單元的聚合物；[3]一種銅燒結體，其係藉由如[2]所記載之製造方法而獲得；[4]一種接合體，其具備第1構件、第2構件、及將上述第1構件與上述第2構件接合之如[1]或[3]所記載之銅燒結體；[5]一種接合體之製造方法，其係具備第1構件、第2構件、及將上述第1構件與第2構件接合之銅燒結體的接合體之製造方法，且包括如下步驟：使包含銅奈米粒子A及下述聚合物B之分散體D以介置之方式賦予至上述第1構件與上述第2構件之間；及對上述分散體D一面施加0.1 MPa以上40 MPa以下之壓力，一面以240℃以上300℃以下之焙燒溫度進行焙燒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1171" publication-number="202614219"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614219.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614219</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119086</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/311</main-classification>  
        <further-classification edition="200601120251226B">C23C14/08</further-classification>  
        <further-classification edition="200601120251226B">C23C16/40</further-classification>  
        <further-classification edition="200601120251226B">H01L21/02</further-classification>  
        <further-classification edition="200601120251226B">H01L21/033</further-classification>  
        <further-classification edition="200601120251226B">H01L21/67</further-classification>  
        <further-classification edition="200601120251226B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李暁竜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIAOLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土橋和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOBASHI, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前原大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEHARA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]降低配線的粗糙度。 &lt;br/&gt;　　[解決手段]基板處理方法的(A)提供具有第1面和第2面的基板。(B)形成介電膜。(C)在介電膜上形成包含一種以上的金屬元素且不包含結晶質膜的金屬氧化膜的第1硬式光罩。(F)在(C)之後，形成第1圖案形成用的阻劑相關的第1膜。(G)在(F)之後，藉由蝕刻第1硬式光罩，在第1硬式光罩上形成對應於第1圖案的凹部。(H)藉由介電膜的蝕刻，在介電膜上形成對應於第1圖案的凹部。(I)在(H)之後，藉由洗淨去除第1硬式光罩。(J)將金屬埋入至介電膜的凹部。(K)使金屬平坦化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1172" publication-number="202613252"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613252.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613252</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119095</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反應性ＨＥＶＬ吸收染料</chinese-title>  
        <english-title>REACTIVE HEVL-ABSORBING DYES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C09B62/002</main-classification>  
        <further-classification edition="200601120251229B">C09B62/02</further-classification>  
        <further-classification edition="200601120251229B">C09B62/04</further-classification>  
        <further-classification edition="200601120251229B">C09B62/503</further-classification>  
        <further-classification edition="200601120251229B">C08F8/30</further-classification>  
        <further-classification edition="200601120251229B">C08F8/34</further-classification>  
        <further-classification edition="200601120251229B">B29D11/00</further-classification>  
        <further-classification edition="200601120251229B">G02B1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商愛爾康公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALCON INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>景峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JING, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, STEVE YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於反應性染料，該等反應性染料各自包含二氯三𠯤、氯三𠯤或乙烯基磺醯基並且能夠吸收HEVL。它們適用於生產各自由具有羥基的矽酮水凝膠材料製成的有色的矽酮水凝膠接觸鏡片之方法。本發明還關於一種有色的矽酮水凝膠接觸鏡片，該有色的矽酮水凝膠接觸鏡片包括有色圓形區域，將反應性染料施加在該有色圓形區域中並由此共價附接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is related to reactive dyes each of which comprises a dichlorotriazine, chlorotriazine or vinylsulphonyl group and is capable of absorbing HEVL. They are suitable for method for producing colored silicone hydrogel contact lenses each made of a silicone hydrogel material having hydroxyl groups. The present invention is also related to a colored silicone hydrogel contact lens comprising a colored circular region in which a reactive dye is applied and thereby covalently attached.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1173" publication-number="202612933"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612933.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612933</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119101</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有可收合遮蔽結構的兒童載具與輔助頭枕配件</chinese-title>  
        <english-title>CHILD CARRIER HAVING RETRACTABLE SHIELDING STRUCTURE AND AUXILIARY HEADREST ACCESSORY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B60N2/28</main-classification>  
        <further-classification edition="201801120251229B">B60N2/885</further-classification>  
        <further-classification edition="201801120251229B">B60N2/809</further-classification>  
        <further-classification edition="200601120251229B">B60N2/58</further-classification>  
        <further-classification edition="200601120251229B">A47C7/38</further-classification>  
        <further-classification edition="200601120251229B">A47D13/02</further-classification>  
        <further-classification edition="200601120251229B">B62B9/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉一萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, I-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭郁璇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾祖華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, CHU-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提出一種具有可收合遮蔽結構的兒童載具，可在無須設置額外的硬件或配件下賦予兒童載具遮蔽功能，為乘坐其中的兒童或幼兒遮蔽外部光線，提升其使用體驗；同時，在不需使用遮蔽結構時更可使其與兒童載具結合一體，除利於收納外，遮蔽結構的材質更可提供乘坐於兒童載具中的兒童或幼兒舒適感受。本發明還提供了一種輔助頭枕，其與各式兒童載具相容，可進一步提供兒童或幼兒穩定的支撐性及安全性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure proposes a child carrier having a retractable shielding structure, which may provide a shielding function for the child carrier without need for additional hardware or accessories, to shield external light for a child or toddler ride therein and enhance user experience; at the same time, the shielding structure may be integrated with the child carrier when not in use, facilitating storage; moreover, the material of the shielding structure may also provide a comfortable feeling for the child or toddler riding in the child carrier. The present disclosure also provides an auxiliary headrest that is compatible with various types of child carriers and may further provide stable support and safety for the child or toddler.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:兒童載具</p>  
        <p type="p">11:乘坐部</p>  
        <p type="p">12:靠背部</p>  
        <p type="p">13:頭枕部</p>  
        <p type="p">131:頭枕本體</p>  
        <p type="p">131A:上緣</p>  
        <p type="p">1311:頭靠部</p>  
        <p type="p">1312:側部</p>  
        <p type="p">132:遮蔽片</p>  
        <p type="p">132A:上周緣</p>  
        <p type="p">132B:下周緣</p>  
        <p type="p">1321:外層布材</p>  
        <p type="p">1322:內層布材</p>  
        <p type="p">1323:泡棉上層</p>  
        <p type="p">1324:泡棉下層</p>  
        <p type="p">1325:聚乙烯(PE)片材層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1174" publication-number="202613045"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613045.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613045</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119103</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>排水水質測定系統、排水處理設備及排水水質測定方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251216B">C02F3/12</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗原信一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURIHARA, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田要</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, KANAME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的排水水質測定系統（10）包括：測定單元（11），能夠貯存試驗水；試驗水供給部（12），將自排水採集的試驗水供給至測定單元（11）；空氣供給部（13），對測定單元（11）內的所述試驗水進行曝氣；溶解氧感測器（14），對自曝氣開始至曝氣結束為止的期間的試驗水的溶解氧濃度進行測定；以及控制部（15），對試驗水供給部（12）、空氣供給部（13）及溶解氧感測器（14）的動作進行控制，控制部（15）具有：第一功能部，基於藉由溶解氧感測器（14）測定出的自曝氣開始至曝氣結束為止的期間的試驗水的溶解氧濃度，求出試驗水的耗氧速度的時間變化量；以及第二功能部，基於預先獲取的排水的耗氧速度的時間變化量與排水的BOD或COD的關係，根據試驗水的耗氧速度的時間變化量預測試驗水的BOD或COD。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:排水水質測定系統/水質測定系統</p>  
        <p type="p">11:測定單元</p>  
        <p type="p">12:試驗水供給部</p>  
        <p type="p">12A、13A、17A、18A:開閉閥</p>  
        <p type="p">12B:供給噴嘴</p>  
        <p type="p">13:空氣供給部</p>  
        <p type="p">13B、17B:流量調整閥</p>  
        <p type="p">13C、17C:止回閥</p>  
        <p type="p">13D、17D:空氣噴嘴</p>  
        <p type="p">14:溶解氧感測器</p>  
        <p type="p">15:控制部</p>  
        <p type="p">16:濁度感測器</p>  
        <p type="p">17:感測器清洗部</p>  
        <p type="p">18:清洗水供給部</p>  
        <p type="p">19:排水部</p>  
        <p type="p">L1:供給流路</p>  
        <p type="p">L2、L4:空氣流路</p>  
        <p type="p">L3:排水流路</p>  
        <p type="p">L5:清洗水流路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1175" publication-number="202612899"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612899.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612899</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119112</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製造中心有色接觸鏡片之方法</chinese-title>  
        <english-title>METHOD FOR MAKING CENTRALLY COLORED CONTACT LENSES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B29D11/00</main-classification>  
        <further-classification edition="200601120251229B">G02C7/04</further-classification>  
        <further-classification edition="200601120251229B">G02C7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商愛爾康公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALCON INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普拉維尼克　蜜雪兒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PLAVNIK, MICHELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布里克夫　里查德　查里斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BREITKOPF, RICHARD CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YA-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　昀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, STEVE YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>景峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JING, FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述了一種用於生產中心有色的矽酮水凝膠接觸鏡片之方法。該方法包括將包含含羥基的可聚合組分的鏡片形成組成物澆鑄模製以形成具有共價併入其聚合物基質中的羥基的未加工的矽酮水凝膠接觸鏡片的步驟，以及將反應性染料施加並固定到僅在該鏡片的中心圓形區域中的聚合物基質的步驟，該中心圓形區域與該未加工的矽酮水凝膠接觸鏡片的中心軸線同心。所獲得的中心有色的矽酮水凝膠接觸鏡片具有中心圓形區域，該中心圓形區域僅被著色以選擇性地過濾某些波長（例如HEVL）的輻射。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein is a method for producing centrally colored silicone hydrogel contact lenses. The method comprises a step of cast molding of a lens-forming composition including a hydroxyl-containing polymerizable component to form an unprocessed silicone hydrogel contact lens having hydroxyl groups covalently incorporated into its polymer matrix and steps of applying and fixing a reactive dye to the polymer matrix only in its central circular region concentric with the central axis of the unprocessed silicone hydrogel contact lens. The obtained centrally colored silicone hydrogel contact lens has a central circular region that is only colored to selectively filter radiations of certain wavelengths, e.g., HEVL.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1176" publication-number="202612817"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612817.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612817</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119185</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搪孔頭</chinese-title>  
        <english-title>BORING HEAD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B23B29/034</main-classification>  
        <further-classification edition="200601120251229B">B23B29/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＢＩＧ　ＤＡＩＳＨＯＷＡ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIG DAISHOWA CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大昭和精機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIG DAISHOWA SEIKI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仲谷穣治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATANI, JOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緒方達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGATA, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朝倉大貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAKURA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">搪孔頭(1)，係具有軸芯(X)，並具備有:工具本體(10)，其是能夠以軸芯(X)與工作機械的主軸之旋轉軸芯成為同軸芯之方式作安裝；同步構件(40)，是呈旋轉自如地被收容在工具本體(10)中；以及複數個筒體(20)，是能夠在與軸芯(X)的垂直的方向上移動地被安裝在工具本體(10)的收容有同步構件(40)之側的端面(14a)，並能夠保持刀刃(30)。複數個筒體(20)，是在位於與工具本體(10)對置之側的底面具有被形成在與筒體(20)的移動方向的垂直的方向上的複數個卡合溝(26)。同步構件(40)具有卡合於複數個卡合溝(26)的圓柱形狀的複數個卡合銷(46)，複數個卡合銷(46)分別配置在相對於軸芯(X)呈旋轉對稱的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">L1:第1假想線</p>  
        <p type="p">L2:第2假想線</p>  
        <p type="p">θ2:角度</p>  
        <p type="p">X:軸芯</p>  
        <p type="p">Y:方向</p>  
        <p type="p">1:搪孔頭</p>  
        <p type="p">10:工具本體</p>  
        <p type="p">14:本體部</p>  
        <p type="p">14a:前端面</p>  
        <p type="p">20:筒體</p>  
        <p type="p">22:側面</p>  
        <p type="p">24:長圓孔</p>  
        <p type="p">26:卡合溝</p>  
        <p type="p">28:螺栓</p>  
        <p type="p">30:刀刃</p>  
        <p type="p">40:同步構件</p>  
        <p type="p">44:本體</p>  
        <p type="p">46:卡合銷</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1177" publication-number="202614178"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614178.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614178</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119188</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>循環電漿及熱製程以增進PECVD矽化鈦沉積選擇性</chinese-title>  
        <english-title>CYCLIC PLASMA AND THERMAL PROCESS TO IMPROVE PECVD TI SILICIDE DEPOSITION SELECTIVITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">H01L21/285</main-classification>  
        <further-classification edition="200601120251223B">C23C16/42</further-classification>  
        <further-classification edition="200601120251223B">C23C16/04</further-classification>  
        <further-classification edition="200601120251223B">C23C16/08</further-classification>  
        <further-classification edition="200601120251223B">H01L21/768</further-classification>  
        <further-classification edition="200601120251223B">C23C16/505</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬一揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAN, YIYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張書錨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SHUMAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智勛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉偉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, WEIFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂　疆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, JIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明原理的實施例大體係關於形成低電阻率的接觸以製造半導體元件。在某些實施例中，一種形成金屬矽化物層於接觸結構表面的方法包括透過向沉積腔室提供載送氣體、含金屬前驅物及含氫前驅物，在包含矽的第一表面和包含介電質材料的第二表面上沉積含金屬的第一層，並在維持基板於第一溫度的同時施加RF電力。該方法包括將含四氯化鈦（TiCl&lt;sub&gt;4&lt;/sub&gt;）的氣體混合物送入第一表面和第二表面，同時維持基板於第一溫度，以去除至少部分沉積的金屬，並循環重複金屬沉積及提供氣體混合物的製程，以達到所需的金屬矽化物層的厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present principles generally relate to forming low resistivity contacts for semiconductor device formation. In some embodiments, a method of forming a metal silicide layer on a surface of a contact structure includes depositing a first layer including a metal on a first surface that includes silicon and a second surface that includes a dielectric material by providing a carrier gas, a metal-containing precursor, and a hydrogen-containing precursor to a deposition chamber and applying an RF power while maintaining the substrate at a first temperature. The method includes delivering a gas mixture including titanium tetrachloride (TiCl&lt;sub&gt;4&lt;/sub&gt;) to the first surface and the second surface, while maintaining the substrate at the first temperature, to remove at least a portion of the deposited metal and cyclically repeating the metal deposition and the delivering the gas mixture processes to reach the desired thickness of the metal silicide layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300B:視圖</p>  
        <p type="p">302:基板</p>  
        <p type="p">304:矽基部分</p>  
        <p type="p">306:TiSi層</p>  
        <p type="p">308:薄的TiSiN層</p>  
        <p type="p">310:腔體</p>  
        <p type="p">322:場域</p>  
        <p type="p">325:底表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1178" publication-number="202612740"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612740.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612740</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119243</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>結腸直腸癌之治療</chinese-title>  
        <english-title>COLORECTAL CANCER TREATMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260102B">A61K47/68</main-classification>  
        <further-classification edition="200601120260102B">C07K16/30</further-classification>  
        <further-classification edition="200601120260102B">C07D491/22</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬克專利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕利斯　阿薩納西歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PALLIS, ATHANASIOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供根據較佳給藥方案使用抗CEACAM5免疫結合物治療結腸直腸癌之方法、化合物、組合物及套組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides methods, compounds, compositions and kits for the treatment of colorectal cancer using anti-CEACAM5 immunoconjugates according to preferred dosing regimens.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1179" publication-number="202612744"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612744.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612744</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119250</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>空間淨化裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">A61L9/01</main-classification>  
        <further-classification edition="200601120251229B">A61L9/04</further-classification>  
        <further-classification edition="202301120251229B">C02F1/461</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和田拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WADA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口正太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, SHOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯田佳奈子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIDA, KANAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">空間淨化裝置(1)具備：電解槽(10)，貯存包含氯離子的氯化物水溶液(第1水溶液(L1))，並且將氯化物水溶液電解來生成次氯酸；內部風路(30)，設置於電解槽(10)的內部上方空間(10a)，供從外部空間(R)作為氣泡(B1)而釋出到氯化物水溶液中的空氣在氯化物水溶液浮起而成為包含次氯酸氣體的混合空氣(M)並流通；及泡沫破裂部(BD)，設置於內部風路(30)，可以使因在氯化物水溶液浮起的混合空氣(M)而產生的泡沫(B2)破裂。泡沫破裂部(BD)是構成為將在內部風路(30)內從氯化物水溶液的液面(S1)朝向上方流通的混合空氣(M)，至少整流往朝向液面(S1)的方向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電解槽</p>  
        <p type="p">10a:內部上方空間</p>  
        <p type="p">11:第1側壁</p>  
        <p type="p">12:第2側壁</p>  
        <p type="p">15:內部上面</p>  
        <p type="p">16:內部底面</p>  
        <p type="p">17:突出部</p>  
        <p type="p">21a:電解槽側陽極</p>  
        <p type="p">22:空氣供給部</p>  
        <p type="p">22a:管狀構件</p>  
        <p type="p">23:第1分隔壁</p>  
        <p type="p">24:整流部</p>  
        <p type="p">25:第2分隔壁</p>  
        <p type="p">26:消除器</p>  
        <p type="p">27:水回收部</p>  
        <p type="p">28:釋出口</p>  
        <p type="p">29:第3分隔壁</p>  
        <p type="p">30:內部風路</p>  
        <p type="p">31:第1風路</p>  
        <p type="p">32:第2風路</p>  
        <p type="p">33:第3風路</p>  
        <p type="p">40:內部流路</p>  
        <p type="p">41:第1流路</p>  
        <p type="p">42:第2流路</p>  
        <p type="p">43:第3流路</p>  
        <p type="p">72:陽離子交換膜</p>  
        <p type="p">A:流通方向</p>  
        <p type="p">B1:氣泡</p>  
        <p type="p">B2:泡沫</p>  
        <p type="p">BD:泡沫破裂部</p>  
        <p type="p">F1:第1區域</p>  
        <p type="p">F2:第2區域</p>  
        <p type="p">L1:第1水溶液</p>  
        <p type="p">M:混合空氣</p>  
        <p type="p">R:外部空間</p>  
        <p type="p">S1:液面</p>  
        <p type="p">W:寬度</p>  
        <p type="p">x:x軸</p>  
        <p type="p">y:y軸</p>  
        <p type="p">z:z軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1180" publication-number="202613753"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613753.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613753</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119252</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送系統、搬送裝置、配件、被把持部、把持部、零件安裝系統及控制方法</chinese-title>  
        <english-title>CARRIER SYSTEM, CARRIER, ATTACHMENT, GRASPABLE PORTION, GRASPING PORTION, PARTS MOUNTING SYSTEM, AND METHOD FOR CONTROLLING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251229B">G05D1/667</main-classification>  
        <further-classification edition="202401120251229B">G05D1/43</further-classification>  
        <further-classification edition="200601120251229B">H05K13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石原敏孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIHARA, TOSHITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示的目的是使搬送裝置移動到可把持搬送對象的把持位置。本揭示的搬送系統(100)具備搬送對象(2)與搬送裝置(1)。搬送裝置(1)的把持部(12)可把持已設置於搬送對象(2)的被把持部(21)。在被把持部(21)設置有標記構件(40)。在把持部(12)未把持被把持部(21)的非把持狀態下，偵測部(19)偵測出標記構件(40)時，移動控制部(171)依據由偵測部(19)所進行之標記構件(40)的偵測結果，使裝置本體(10)移動到把持部(12)可把持被把持部(21)的把持位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:搬送裝置</p>  
        <p type="p">2:搬送對象</p>  
        <p type="p">3:上位系統</p>  
        <p type="p">5:中繼裝置</p>  
        <p type="p">8:第1導電部</p>  
        <p type="p">9:第2導電部</p>  
        <p type="p">13:第1連接器</p>  
        <p type="p">15:驅動輪單元</p>  
        <p type="p">15L:左驅動輪單元</p>  
        <p type="p">15R:右驅動輪單元</p>  
        <p type="p">16:把持驅動部</p>  
        <p type="p">17,31:控制部</p>  
        <p type="p">18,32:通訊部</p>  
        <p type="p">19:偵測部</p>  
        <p type="p">23:第2連接器</p>  
        <p type="p">24:功能部</p>  
        <p type="p">33:儲存部</p>  
        <p type="p">100:輸送系統</p>  
        <p type="p">171:移動控制部</p>  
        <p type="p">172:把持控制部</p>  
        <p type="p">M1L,M1R:第1馬達</p>  
        <p type="p">M2L,M2R:第2馬達</p>  
        <p type="p">NT1:網路</p>  
        <p type="p">PS1:電源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1181" publication-number="202612730"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612730.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612730</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119279</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＥＧＦＲ結合和／或補體活化抗體的給藥方案</chinese-title>  
        <english-title>DOSING REGIMEN OF AN EGFR BINDING AND/OR COMPLEMENT ACTIVATING ANTIBODY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K39/395</main-classification>  
        <further-classification edition="200601120260102B">C07K16/28</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商美勒斯公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERUS N.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>包爾　寇尼里斯　Ｊ　Ｊ　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOL, CORNELIS JACOB JOHANNES GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦瑟曼　恩尼斯托　Ｉ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WASSERMAN, ERNESTO ISAAC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈恩　洛克許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAIN, LOKESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩內拉　愛德華多　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENNELLA, EDUARDO JOSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勞斯　詹盧卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAUS, GIANLUCA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及在癌症治療中施用抗體的手段和方法。本公開尤其涉及在用EGFR結合和/或補體活化抗體治療個體的癌症中減少輸注相關反應的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates to means and methods for administration of antibodies in the&lt;br/&gt; treatment of cancer. The disclosure in particular relates to a method of reducing&lt;br/&gt; infusion-related reactions in the treatment of a cancer in an individual with an EGFR&lt;br/&gt; binding and/or complement activating antibody.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1182" publication-number="202614229"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614229.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614229</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119314</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製造包含用於捕獲電荷之層之基板之方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING A SUBSTRATE COMPRISING A LAYER FOR TRAPPING ELECTRICAL CHARGES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">H01L21/322</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商梭意泰科公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOITEC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達哈斯　馮索瓦　哈維爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DARRAS, FRANCOIS-XAVIER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克爾迪雷　賽巴斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KERDILES, SEBASTIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普隆提耶　克里斯托弗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PLANTIER, CHRISTOPHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博卡特　馬瑟爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROEKAART, MARCEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇諾強克　歐雷格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONONCHUK, OLEG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝統德　伊莎貝爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERTRAND, ISABELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維提卓　克里斯提爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VEYTIZOU, CHRISTELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於製造處置基板以形成複合基板之方法，其包括提供基底基板之步驟、在沉積腔室中沉積與該基底基板接觸之用於捕獲電荷之層之步驟。該捕獲層包含40%至80%矽原子、0.1%至45%氧原子及0.2%至50%氮原子。沉積該捕獲層之該步驟實施前驅體氣體之混合物。該混合物包含含矽氣體、含氧氣體及含氮氣體。該含氮氣體為氨氣或在該沉積步驟期間在該沉積腔室中形成氨氣之一組分子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method for manufacturing a handle substrate to form a composite substrate, including a step of providing a base substrate, a step of depositing in a deposition chamber a layer for trapping electrical charges in contact with the base substrate. The trapping layer comprises from 40% to 80% silicon atoms, from 0.1% to 45% oxygen atoms, and from 0.2% to 50% nitrogen atoms. The step of depositing the trapping layer implements a mixture of precursor gases. The mixture comprises a gas comprising silicon, a gas comprising oxygen and a gas comprising nitrogen. The gas comprising nitrogen is ammonia or a set of molecules forming ammonia in the deposition chamber during the deposition step.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:處置基板</p>  
        <p type="p">100:基底基板</p>  
        <p type="p">110:捕獲層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1183" publication-number="202612708"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612708.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612708</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119340</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組合治療</chinese-title>  
        <english-title>COMBINATION TREATMENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/7088</main-classification>  
        <further-classification edition="200601120260102B">A61K31/713</further-classification>  
        <further-classification edition="200601120260102B">A61K48/00</further-classification>  
        <further-classification edition="200601120260102B">A61P31/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商浩博生物醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUSPERBIO THERAPEUTICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程國鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, GUOFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　成勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHENG YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸婷婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, TINGTING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃裕煦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供用於治療HBV感染的方法、組成物、及套組，其包含向對象投予特異於HBV標靶的siRNA及特異於HBV標靶的反義寡核苷酸。本文所提供之該等方法、組成物、及套組降低該對象的HBV DNA水平、HBV mRNA水平、及HBV蛋白水平。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are methods, compositions, and kits for treating an HBV infection comprising administering to a subject an siRNA specific for an HBV target and an antisense oligonucleotide specific for an HBV target. The methods, compositions, and kits provided herein reduce HBV DNA, HBV mRNA, and HBV protein levels in the subject.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1184" publication-number="202614392"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614392.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614392</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119357</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其製造方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250703B">H01L23/31</main-classification>  
        <further-classification edition="200601120250703B">H01L23/535</further-classification>  
        <further-classification edition="200601120250703B">H01L23/525</further-classification>  
        <further-classification edition="200601120250703B">H01L21/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許博雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PO-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括一第一基板結構、一第一電路結構以及一封裝結構。第一電路結構設置在第一基板結構的一表面，第一電路結構包括一第一子結構。封裝結構設置在第一電路結構上且與第一電路結構電性連接。第一子結構具有一第一熱膨脹係數，封裝結構具有一第二熱膨脹係數，且第二熱膨脹係數對第一熱膨脹係數的比值大於或等於0.8且小於或等於1.5。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a first substrate structure, a first circuit structure and a package structure. The first circuit structure is disposed on a surface of the first substrate structure, and the first circuit structure includes a first substructure. The package structure is disposed on the first circuit structure and is electrically connected to the first circuit structure. The first substructure has a first coefficient of thermal expansion, the package structure has a second coefficient of thermal expansion, and a ratio of the second coefficient of thermal expansion to the first coefficient of thermal expansion is greater than or equal to 0.8 and less than or equal to 1.5.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:電子裝置</p>  
        <p type="p">110A:基板結構</p>  
        <p type="p">112A:基材層</p>  
        <p type="p">114A:導電元件</p>  
        <p type="p">1141:緩衝層</p>  
        <p type="p">120A:電路結構</p>  
        <p type="p">121A,122A,123A,124A,125A,126A:子結構</p>  
        <p type="p">130A:封裝結構</p>  
        <p type="p">132,134:電子單元</p>  
        <p type="p">136:翹曲調整層</p>  
        <p type="p">C21,C22,C23,C24,C25,C26,1142:導體層</p>  
        <p type="p">CP1:接墊</p>  
        <p type="p">CE1,CE2:接合元件</p>  
        <p type="p">G1:間隙</p>  
        <p type="p">I21,I22,I23,I24,I25,I26:絕緣層</p>  
        <p type="p">P1:第一部分</p>  
        <p type="p">P2:第二部分</p>  
        <p type="p">S1,S2,S41:表面</p>  
        <p type="p">S11,S31,S35:上表面</p>  
        <p type="p">S21:下表面</p>  
        <p type="p">S32,S33,S36,S37:側表面</p>  
        <p type="p">T21,T22,T23,T24,T25,T26,TH1:厚度</p>  
        <p type="p">TD1:孔徑</p>  
        <p type="p">TV10:穿孔</p>  
        <p type="p">UF1:填充材料</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1185" publication-number="202614128"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614128.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614128</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119368</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非均質D形聚焦離子束</chinese-title>  
        <english-title>INHOMOGENEOUS D-SHAPED FOCUSED ION BEAMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">H01J37/28</main-classification>  
        <further-classification edition="200601120251231B">H01J37/304</further-classification>  
        <further-classification edition="200601120251231B">H01J37/317</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＦＥＩ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEI COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格萊德希爾　蓋倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLEDHILL, GALEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">方法包括：使用一帶電粒子束源產生一帶電粒子束，並將該帶電粒子束沿一帶電粒子束柱的一束軸引導至一目標；引導該帶電粒子束穿過相對於該束軸以一偏移而定位的一長形孔徑；及將該束聚焦至該目標，以產生該束的一非對稱強度截面，其中該截面基於該經偏移長形孔徑而在該目標處有一尖銳強度邊緣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods include producing a charged particle beam with a charged particle beam source and directing the charged particle beam along a beam axis of a charged particle beam column to a target, directing the charged particle beam through an elongated aperture that is situated by an offset with respect to the beam axis, and focusing the beam to the target to produce an asymmetric intensity cross-section for the beam, wherein the cross-section has a sharp intensity edge at the target based on the offset elongated aperture.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:橢圓孔徑</p>  
        <p type="p">202:帶電粒子束截面；束</p>  
        <p type="p">204:目標</p>  
        <p type="p">206:切邊</p>  
        <p type="p">208:區域</p>  
        <p type="p">208a,208b:束尾部；波瓣</p>  
        <p type="p">210a,210b:區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1186" publication-number="202614318"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614318.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614318</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119370</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬運裝置、半導體製造系統及搬運方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/677</main-classification>  
        <further-classification edition="200601120251226B">H01L21/67</further-classification>  
        <further-classification edition="200601120251226B">H01L21/683</further-classification>  
        <further-classification edition="200601120251226B">H01L21/687</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松永正隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUNAGA, MASATAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種可降低製造成本且可提高基板以及框架的搬運效率的技術。為了達成上述目的，本發明之搬運裝置，包含：搬運臂；以及移動機構，其令該搬運臂移動。該搬運臂，包含端效器，其於一片板材具有：第1支持部，其可從下方支持基板；以及第2支持部，其可從下方支持配置於該基板周圍的框架。藉由像這樣於端效器具有第1支持部與第2支持部，搬運裝置便可降低製造成本，並可提高基板以及框架的搬運效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">223:端效器</p>  
        <p type="p">30:搬運裝置</p>  
        <p type="p">31:移動機構</p>  
        <p type="p">32:搬運臂</p>  
        <p type="p">32a:臂部</p>  
        <p type="p">33:端效器</p>  
        <p type="p">34:第1支持部</p>  
        <p type="p">341:開口</p>  
        <p type="p">342:第1吸附墊</p>  
        <p type="p">343:流通管路</p>  
        <p type="p">35:第2支持部</p>  
        <p type="p">352:第2吸附墊</p>  
        <p type="p">353:流通管路</p>  
        <p type="p">36:板材</p>  
        <p type="p">361:基部</p>  
        <p type="p">37:叉部</p>  
        <p type="p">371:第1支持叉部</p>  
        <p type="p">372:第2支持叉部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1187" publication-number="202612698"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612698.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612698</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119405</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吞噬血球症候群治療劑及其用途</chinese-title>  
        <english-title>HEMOPHAGOCYTIC SYNDROME THERAPEUTIC AGENT AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/4965</main-classification>  
        <further-classification edition="200601120260102B">A61K31/56</further-classification>  
        <further-classification edition="200601120260102B">A61P37/06</further-classification>  
        <further-classification edition="200601120260102B">A61P31/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片富山化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM TOYAMA CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>櫻井努</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKURAI, TSUTOMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山竹卓宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMATAKE, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">6-氟-3-羥基-2-吡&lt;img align="absmiddle" height="20px" width="18px" file="ed10002.JPG" alt="ed10002.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;甲醯胺或其鹽具有抑制血液中之鐵蛋白濃度上升的作用，有用於吞噬血球症候群治療劑及其用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">6-Fluoro-3-hydroxy-2-pyrazinecarboxamide or a salt thereof has action to inhibit an increase in the ferritin concentration in the blood, and is useful for a hemophagocytic syndrome therapeutic agent and use thereof.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1188" publication-number="202614188"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614188.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614188</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119407</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/302</main-classification>  
        <further-classification edition="200601120251226B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀川清貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIKAWA, KIYOTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今井佑輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, MASARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">抑制在圖案的深度方向上發生矽的蝕刻量的偏差。 &lt;br/&gt;在處理室的內部使露出在形成於基板上的凹狀圖案的側面的矽與包含氟氣及氨氣的處理氣體反應以進行蝕刻時，在向處理室的內部供應處理氣體之前，將基板的溫度維持在不會促使處理氣體與矽發生反應的第1溫度，對應於處理氣體向處理室的內部的供應，使基板的溫度從第1溫度升溫。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">53:層積構造</p>  
        <p type="p">54:圖案</p>  
        <p type="p">55:Si層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1189" publication-number="202614204"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614204.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614204</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119417</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法以及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H01L21/3065</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀川清貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIKAWA, KIYOTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大木雄登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKI, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係在不使用氧下，一面確保對於矽之選擇比一面蝕刻氮化矽膜。 &lt;br/&gt;　　本發明之解決手段為一種基板處理方法，係具有：將形成有矽膜與氮化矽膜之基板設置在處理空間內之工序，於維持在真空環境之前述處理空間中，對於前述處理空間內的前述基板，係使用至少含有氨氣與含氟氣體之處理氣體，在執行用以將前述處理空間維持在真空環境之排氣時，最初不將前述含氟氣體供給至前述處理空間，而是將前述氨氣供給至前述處理空間，然後不將前述氨氣供給至前述處理空間，而是將前述含氟氣體供給至前述處理空間，以對前述基板施以蝕刻處理，對於前述矽膜，一面確保選擇比一面蝕刻前述氮化矽膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1190" publication-number="202614540"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614540.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614540</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119427</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多泵送機構真空泵</chinese-title>  
        <english-title>MULTIPLE PUMPING MECHANISM VACUUM PUMP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H02K7/14</main-classification>  
        <further-classification edition="200601120251217B">F04D25/06</further-classification>  
        <further-classification edition="200601120251217B">F04C25/02</further-classification>  
        <further-classification edition="200601120251217B">H02K16/02</further-classification>  
        <further-classification edition="200601120251217B">F04C29/00</further-classification>  
        <further-classification edition="200601120251217B">H02K21/14</further-classification>  
        <further-classification edition="200601120251217B">F04D19/04</further-classification>  
        <further-classification edition="200601120251217B">H02K49/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商愛德華有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDWARDS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧切塔　艾米里亞諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUCCHETTA, EMILIANO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種具有安裝在至少兩個軸件上之多個泵送機構之真空泵。該真空泵包括一組合式電動機器及磁性齒輪傳動機構，其包括用於在兩種不同速度下旋轉該至少兩個軸件之一第一磁性齒輪構件及一第二磁性齒輪構件；其中該磁性齒輪傳動機構之至少一個組件包括該電動機器之一轉子或該電動機器之一定子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A vacuum pump having multiple pumping mechanisms mounted on at least two shafts is disclosed. The vacuum pump comprises a combined electric machine and magnetic gearing mechanism comprising a first magnetic gear member and a second magnetic gear member for rotating the at least two shafts at two different speeds; wherein at least one component of the magnetic gearing mechanism comprises a rotor of the electric machine or a stator of the electric machine.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:軸件/慢速軸件/較慢速軸件</p>  
        <p type="p">20:軸件/較快速軸件</p>  
        <p type="p">22:外環/磁性外環/磁性齒輪構件/磁性齒輪外環/外磁性齒輪環/第一磁性齒輪構件</p>  
        <p type="p">23:磁體/磁性元件</p>  
        <p type="p">24:磁體/永磁體/磁性元件</p>  
        <p type="p">30:定子/馬達定子</p>  
        <p type="p">32:繞組/馬達繞組/外環定子繞組</p>  
        <p type="p">40:轉子/馬達轉子/內部轉子</p>  
        <p type="p">42:轉子/內環/第二構件/磁性齒輪構件/磁性齒輪內環/內磁性齒輪環/第二磁性齒輪構件</p>  
        <p type="p">44:磁體/磁性元件</p>  
        <p type="p">50:軸承</p>  
        <p type="p">60:定子/泵定子</p>  
        <p type="p">70:調變器/磁性齒輪調變器/旋轉磁性齒輪調變器</p>  
        <p type="p">80:分隔件</p>  
        <p type="p">90:較低壓力區域</p>  
        <p type="p">92:主馬達/獨立電氣馬達/較高壓力區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1191" publication-number="202612704"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612704.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612704</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119429</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療CNS病症之組合物及方法</chinese-title>  
        <english-title>COMPOSITIONS AND METHODS FOR TREATING CNS DISORDERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/58</main-classification>  
        <further-classification edition="200601120260102B">C07J73/00</further-classification>  
        <further-classification edition="200601120260102B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賽吉醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAGE THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅比喬德　艾伯特　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBICHAUD, ALBERT J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩突羅　法藍西司科　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SALITURO, FRANCESCO G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴蘭可　佩拉杜　馬利亞　耶稣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLANCO-PILLADO, MARIA JESUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LA, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈里森　柏伊德　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARRISON, BOYD L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供一種式(I-I)化合物&lt;br/&gt;&lt;img align="absmiddle" height="216px" width="325px" file="ed10134.JPG" alt="ed10134.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;或其醫藥學上可接受之鹽，其中變數在本文中定義。本文亦提供包含式(I-I)化合物之醫藥組合物，及使用該等化合物例如治療CNS相關病症之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein is a compound of Formula (I-I)&lt;br/&gt;&lt;img align="absmiddle" height="231px" width="346px" file="ed10135.JPG" alt="ed10135.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;or a pharmaceutically acceptable salt thereof, wherein the variables are defined herein. Also provided herein are pharmaceutical compositions comprising a compound of Formula (I-I), and methods of using the compounds,&lt;i&gt;e.g.&lt;/i&gt;, in the treatment of CNS-related disorders.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1192" publication-number="202613990"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613990.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613990</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119455</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無水式小便斗濾芯使用程度確定與指示的系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR WATERLESS URINAL CARTRIDGE USAGE DETERMINATION AND INDICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G08B21/18</main-classification>  
        <further-classification edition="200601120251229B">E03C1/28</further-classification>  
        <further-classification edition="200601120251229B">E03C1/294</further-classification>  
        <further-classification edition="200601120251229B">A47K11/12</further-classification>  
        <further-classification edition="200601120251229B">E03D13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商發肯水科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FALCON WATER TECHNOLOGIES, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康弗雷　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONFREY, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了一種無水式小便斗濾芯使用程度確定與指示的系統。該系統包括用於測量消耗因子的測量裝置。消耗因子代表無水式小便斗濾芯的使用程度測量。該系統還包含一個指示器，用於在消耗因數達到預定閾值時發出信號/進行指示。消耗因子可以基於時間、基於使用、基於頻率或基於物理特性。該系統還可包含檢測小便斗濾芯的使用的檢測器。檢測器與測量裝置通訊，以提供使用資訊給測量裝置。預定閾值可以幫助使用無水式小便斗濾芯的小便斗的操作者確定何時更換濾芯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described is a system for waterless urinal cartridge usage determination and indication. The system comprises a measuring device for measuring a consumption factor. The consumption factor represents a usage measure of a waterless urinal cartridge. The system further includes an indicator for signaling/indicating when the consumption factor reaches a predetermined threshold. The consumption factor can be time-based, use-based, frequency-based, or physical characteristic-based. The system can also include a detector for detecting a use of the urinal cartridge. The detector communicates with the measuring device to provide use information to the measuring device. The predetermined threshold can help an operator of a urinal using a waterless urinal cartridge in determining when to replace the cartridge.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:濾芯</p>  
        <p type="p">202:殼體</p>  
        <p type="p">4200a:濾芯</p>  
        <p type="p">4200b:可蝕性材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1193" publication-number="202613096"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613096.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613096</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119480</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氘代的Ｈｅｄｇｅｈｏｇ通路ＳＭＯ受體抑制劑</chinese-title>  
        <english-title>DEUTERATED HEDGEHOG SIGNALING PATHWAY SMO RECEPTOR INHIBITOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D401/14</main-classification>  
        <further-classification edition="200601120260102B">A61K31/502</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商成都思倍博醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENGDU SIBEIBO PHARMACEUTICAL TECHNOLOGY CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陽　安樂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, ANLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李澤睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZERUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒廉鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, LIANXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周李波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, LIBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張德偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, DEWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, ZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝雙翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, SHUANGYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜書文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, SHUWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　震宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHENYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇忠海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, ZHONGHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種氘代的Hedgehog通路SMO受體抑制劑，特別是氘代的4-氟-N-甲基-N-[1-[4-(1-甲基-1H-吡唑-5-基)酞嗪-1-基]哌啶-4-基]-2-(三氟甲基)苯甲醯胺化合物、包含該化合物的醫藥組成物及其該化合物在治療可以藉由抑制SMO進行治療或預防的疾病、特別是癌症和特發性肺纖維化中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to deuterated Hedgehog signaling pathway SMO receptor inhibitor, in particular to a deuterated 4-fluoro-N-methyl-N-[1-[4-(1-methyl-1H-pyrazol-5-yl)phthalazin-1-yl]piperidin-4-yl]-2-(trifluoro-methyl)benzamide compound, a pharmaceutical composition comprising said compound, and use of said compound in treating diseases that can be treated or prevented by inhibiting SMO, in particular cancer and idiopathic pulmonary fibrosis.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1194" publication-number="202613658"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613658.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613658</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119483</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯微鏡用光學組件</chinese-title>  
        <english-title>OPTICAL ARRANGEMENT FOR MICROSCOPE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G02B21/36</main-classification>  
        <further-classification edition="200601120251229B">G02B21/00</further-classification>  
        <further-classification edition="200601120251229B">G02B13/00</further-classification>  
        <further-classification edition="200601120251229B">G02B13/18</further-classification>  
        <further-classification edition="200601120251229B">G02B21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬蘭商鏡片製造科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LENSMAKERS TECHNOLOGIES OY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤霍拉　米科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUHOLA, MIKKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩里寧　伊爾卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAARINEN, ILKKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隆丁　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUNDIN, JOHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坦卡寧　圖奧馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENKANEN, TUOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光學組件(100，100A，100B，400，500，600，710，720，730，810A，810B，820A，820B，1100)及一種光學系統(700，800，900)。該光學組件包含一第一非球面物鏡(102)，其被配置為將物體的一區域投影至一投影面(110)，包含：一有效焦距(EFL)與物體對角線之比在0.5至1.25之間；一有效焦距(EFL)在0.5毫米(mm)至30.0mm之間；及一數值孔徑(NA)在0.5至0.25之間；以及一第二非球面物鏡(104)，其被配置為將該物體的投影區域由該投影面傳輸至一影像感測器(120)，包含：該第一非球面物鏡(102)相對於該第二非球面物鏡(104)之EFL比值在0.2至5之間；一有效焦距(EFL)在0.5mm至30.0mm之間，及一有效焦距(EFL)與感測器對角線之比在0.5至4.0之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is an optical arrangement (100, 100A, 100B, 400, 500, 600, 710, 720, 730, 810A, 810B, 820A, 820B, 1100) and an optical system (700, 800, 900). The optical arrangement comprises a first aspherical objective lens (102) configured to project an area of an object onto a projection plane (110), comprising an effective focal length (EFL) to object diagonal ratio in a range of 0.5 to 1.25; an effective focal length (EFL) within a range of 0.5 millimeter (mm) to 30.0 mm, and a numerical aperture (NA) in a range of 0.5 to 0.25. The optical arrangement further comprises a second aspherical objective lens (104) configured to transfer the projected area of the object from the projection plane to an image sensor (120), comprising an EFL ratio of the first aspherical objective lens (102) with respect to the second aspherical objective lens (104) is within a range of 0.2 to 5; an effective focal length within a range of 0.5 mm to 30.0 mm, and an effective focal length to sensor diagonal ratio of within a range of 0.5 to 4.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學組件</p>  
        <p type="p">102:第一非球面物鏡</p>  
        <p type="p">104:第二非球面物鏡</p>  
        <p type="p">110:投影面</p>  
        <p type="p">120:影像感測器</p>  
        <p type="p">n:折射率</p>  
        <p type="p">O:物體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1195" publication-number="202613562"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613562.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613562</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119503</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>探針</chinese-title>  
        <english-title>PROBE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G01R1/067</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本麥克隆尼股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA NIHON MICRONICS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村本剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAMOTO, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>得丸孝一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUMARU, KOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戸次翔大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HETSUGI, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河野翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWANO, SHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的探針具備：柱狀的母材，係具有導電性，且具有第一面及朝向第一面之相反方向的第二面；第一保護材，係配置在第一面，且包含硬度比母材更高的材料；及第二保護材，係配置在第二面，且包含硬度比母材更高的材料，並且膜厚與第一保護材不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A probe according to the present invention includes: a column-shaped base material having electrical conductivity and having a first surface and a second surface facing to an opposite direction of the first surface; a first protective material arranged on the first surface and made of a material harder than the base material; and a second protective material arranged on the second surface and made of a material harder than the base material and having a film thickness different from the first protective material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:探針</p>  
        <p type="p">11:母材</p>  
        <p type="p">13:前端部</p>  
        <p type="p">101:前端面</p>  
        <p type="p">102:基端面</p>  
        <p type="p">111:第一端部</p>  
        <p type="p">112:第二端部</p>  
        <p type="p">121:第一保護材</p>  
        <p type="p">122:第二保護材</p>  
        <p type="p">S1:第一面</p>  
        <p type="p">S2:第二面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1196" publication-number="202614406"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614406.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614406</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119521</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷卻裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H01L23/473</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商聯合精密科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITED PRECISION TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲坂純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INASAKA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>名倉直紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGURA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中徳敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, NORITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖鉦達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明透過重新審視流路的形成區域，提供了一種能夠避免過多或不充分的冷卻的、價格低的冷卻裝置。該冷卻裝置具備：對裝設在半導體基板200之第一區域210中之發熱量相對較多的第一半導體晶片212進行冷卻的第一冷卻部10，對裝設在半導體基板200之第二區域220中之發熱量相對較少的第二半導體晶片222進行冷卻的第二冷卻部20，將第一冷卻部10與第二冷卻部20以平面的方式進行連接的連接部30，並且，在第一冷卻部10中形成了冷卻介質的流路，在第二冷卻部20中沒有形成冷卻介質的流路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一冷卻部</p>  
        <p type="p">12,22:第一層</p>  
        <p type="p">12A:流路部</p>  
        <p type="p">12B,22B:接受部</p>  
        <p type="p">14:第二層</p>  
        <p type="p">14A:流路部</p>  
        <p type="p">16:第三層</p>  
        <p type="p">16A:流路部</p>  
        <p type="p">16B:接受部</p>  
        <p type="p">20:第二冷卻部</p>  
        <p type="p">30:連接部</p>  
        <p type="p">100:半導體晶片用冷卻裝置</p>  
        <p type="p">200:半導體基板</p>  
        <p type="p">210:第一區域</p>  
        <p type="p">212:第一半導體晶片</p>  
        <p type="p">220:第二區域</p>  
        <p type="p">222:第二半導體晶片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1197" publication-number="202614538"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614538.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614538</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119529</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於藥物遞送裝置的馬達組件</chinese-title>  
        <english-title>MOTOR ASSEMBLY FOR DRUG DELIVERY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H02K5/22</main-classification>  
        <further-classification edition="200601120251229B">A61M5/20</further-classification>  
        <further-classification edition="200601120251229B">H02K7/116</further-classification>  
        <further-classification edition="201601120251229B">H02K11/33</further-classification>  
        <further-classification edition="200601120251229B">H02K5/04</further-classification>  
        <further-classification edition="200601120251229B">H02K3/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商再生元醫藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古雷葛斯　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRYGUS, BRYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍傑利　崔佛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANGLEY, TREVOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈爾比格　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HALBIG, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米克林斯奇　潔西卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIKLINSKI, JESSICA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅馬尼達奇斯　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROUMANIDAKIS, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓布札克　伊格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DROBNJAK, IGOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布列之　卡翠歐娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLEZY, KATRIONA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的馬達組件一般包括：具有第一側和第二側的支撐結構；以及從支撐結構的第一側延伸的馬達安裝座，馬達安裝座包括第一側和第二側，第一側相對於第二側；以及第一升起部分和第二升起部分，第一升起部分鄰近於第二升起部分；以及馬達，馬達由馬達安裝座保持；以及第一連接器和第二連接器，第一連接器和第二連接器機械地將馬達固定到馬達安裝座，並配置為形成馬達與控制器之間的電性連接，其中第一連接器和第二連接器從馬達安裝座的第一側延伸並跨越馬達安裝座至第二側，且第一連接器至少部分位於馬達安裝座的第一升起部分和第二升起部分之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A motor assembly described herein generally includes a support structure having a first side opposite a second side; a motor mount extending from the first side of the support structure, the motor mount including: a first side opposite a second side; and a first raised portion adjacent a second raised portion; a motor retained by the motor mount; and a first connector and a second connector mechanically securing the motor to the motor mount and configured to form an electrical connection between the motor and a controller, wherein the first connector and the second connector extend from the first side of the motor mount, over the motor mount, to the second side of the motor mount, wherein the first connector is at least partially positioned between the first raised portion and the second raised portion of the motor mount.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:馬達組件</p>  
        <p type="p">102:支撐結構</p>  
        <p type="p">104:第一側</p>  
        <p type="p">106:第二側</p>  
        <p type="p">108:馬達安裝座</p>  
        <p type="p">110:第一側</p>  
        <p type="p">111:電性接觸點</p>  
        <p type="p">112:第二側</p>  
        <p type="p">113:連接</p>  
        <p type="p">114:第一升起部分</p>  
        <p type="p">116:第二升起部分</p>  
        <p type="p">118:馬達</p>  
        <p type="p">120:控制器</p>  
        <p type="p">122:第一連接器</p>  
        <p type="p">128:開口</p>  
        <p type="p">132:突出</p>  
        <p type="p">134:直線部分</p>  
        <p type="p">136:曲線部分</p>  
        <p type="p">138:表面</p>  
        <p type="p">140:上表面</p>  
        <p type="p">142:延伸部分</p>  
        <p type="p">144:軸</p>  
        <p type="p">152:端子</p>  
        <p type="p">166:表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1198" publication-number="202613157"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613157.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613157</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119539</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種多肽激動劑，其製備方法及醫藥用途</chinese-title>  
        <english-title>A POLYPEPTIDE AGONIST, PREPARATION METHOD THEREOF, AND PHARMACEUTICAL USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K14/605</main-classification>  
        <further-classification edition="200601120260102B">A61K38/26</further-classification>  
        <further-classification edition="200601120260102B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董加强</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, JIAQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳運</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高美娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, MEINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王俊亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JUNLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于海洲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HAIZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種多肽激動劑，其製備方法及醫藥用途，具體地，本發明涉及通式(I)所示的多肽及其衍生物、或其可藥用鹽，其醫藥組成物，及其用於製備預防或治療代謝紊亂相關疾病或病症的藥物中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a polypeptide agonist, its preparation method, and pharmaceutical use. Specifically, the invention pertains to a polypeptide as shown in general formula (I), derivatives thereof, or pharmaceutically acceptable salts thereof, pharmaceutical compositions comprising the same, and their use in the preparation of a medicament for preventing or treating metabolic disorder-related diseases or conditions.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1199" publication-number="202612703"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612703.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612703</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119542</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種含噻吩并嘧啶化合物的藥物組合物、其製備方法及用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/519</main-classification>  
        <further-classification edition="200601120260102B">A61K47/26</further-classification>  
        <further-classification edition="200601120260102B">A61K47/38</further-classification>  
        <further-classification edition="200601120260102B">A61K9/28</further-classification>  
        <further-classification edition="200601120260102B">A61K9/14</further-classification>  
        <further-classification edition="200601120260102B">A61K9/48</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京再極醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING MAXINOVEL PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　玉光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUGUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種含噻吩并嘧啶化合物的藥物組合物、其製備方法及用途。本發明具體公開了一種包括物質X和藥用輔料的藥物組合物；其中所述物質X為式A化合物、其藥學上可接受的鹽、其溶劑化物或其藥學上可接受的鹽的溶劑化物；所述的藥用輔料包括填充劑、崩解劑和潤滑劑。本發明的藥物組合物具有以下一種或多種優勢：避免刺激胃腸道，快速釋放藥物，良好的溶出特性，較好的穩定性，滿足臨床及患者用藥需求，製備工藝簡單，安全，有效，使用方便和適於工業化生產。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1200" publication-number="202614085"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614085.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614085</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119564</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>細胞病理學中獲取目標細胞影像的方法與系統</chinese-title>  
        <english-title>METHOD AND SYSTEM TO OBTAIN IMAGES OF TARGET CELLS IN CYTOPATHOLOGY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251216B">G16H30/00</main-classification>  
        <further-classification edition="200601120251216B">G02B21/24</further-classification>  
        <further-classification edition="200601120251216B">G02B21/36</further-classification>  
        <further-classification edition="200601120251216B">G02B27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商醫乘智慧有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIXMED, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　聖雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SAMUELSHENGHSIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　弘卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHARLESHUNG-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許恩瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, ENYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡濱陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">已揭露用於擷取細胞學檢體中目標細胞影像的示例方法與系統。其中一種示例方法包含：取得第一組Z堆疊影像與第二組Z堆疊影像、生成第一焦點圖、依據第一焦點圖擷取目標細胞影像，以及生成第二焦點圖。在細胞學檢體的z軸方向上，與第一焦點圖相關的第一組目標細胞與與第二焦點圖相關的第二組目標細胞之間的距離，不同於在細胞學檢體的z軸方向上，與第一焦點圖相關的第三組目標細胞與與第二焦點圖相關的第四組目標細胞之間的距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Example methods and systems to capture images of target cells distributed in a cytology specimen have been disclosed. One example method includes obtaining a first z-stack image and a second z-stack image, generating a first focus map, capturing images of the target cells according to the first focus map, and generating a second focus map. A first distance along a z-axis of the cytology specimen between a first set of target cells associated with the first focus map and a second set of target cells associated with the second focus map is different from a second distance along the z-axis of the cytology specimen between a third set of target cells associated with the first focus map and a fourth set of target cells associated with the second focus map.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:流程</p>  
        <p type="p">710、720、730、740、750、760、770:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1201" publication-number="202613102"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613102.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613102</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119570</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>CYP11A1抑制劑的鹽及其晶型、其製備方法和應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D405/06</main-classification>  
        <further-classification edition="200601120260102B">A61K31/4035</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商遼寧海思科製藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAONING HAISCO PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONG, ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱鳳飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, FENGFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉振平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ZHENPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, JIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竇贏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOU, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林發立</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種式(I)化合物的鹽、其晶型及其製備方法，以及它們在製備相關藥物中的應用。&lt;br/&gt;&lt;img align="absmiddle" height="129px" width="333px" file="ed10091.JPG" alt="ed10091.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; 。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1202" publication-number="202612659"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612659.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612659</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119575</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>治療器具</chinese-title>  
        <english-title>Treatment Instrument</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">A61B17/92</main-classification>  
        <further-classification edition="200601120251229B">A61B17/56</further-classification>  
        <further-classification edition="201601120251229B">A61B90/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本脊椎紀事股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPINE CHRONICLE JAPAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米澤則隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEZAWA, NORITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉信金</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種治療器具，其包含從椎弓根被插入椎體內的內固定器具、外筒以及水泥分離器具，如以下那樣構成。內固定器具具有頭部、軸以及第1貫通孔。外筒具有在近位端連接於內固定器具的頭部的連接部、軸以及在與內固定器具連接時與第1貫通孔連通的第2貫通孔。水泥分離器具具有被插入連通的貫通孔的軸，在軸的外周具有分離器具側螺紋牙。治療器具具備運動方向轉換機構，該運動方向轉換機構通過上述分離器具側螺紋牙與在第1或者第2貫通孔內設置的螺紋牙嚙合，將在中心軸的周圍旋轉的旋轉力以內固定器具或者連接於內固定器具的外筒為支點轉換成使水泥分離器具的前端沿著中心軸直行的直行力。由此，即便在產生了將來拔出在椎體形成術中被埋入體內的內固定器具的必要時，也能夠提供其拔出容易的治療器具。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a treatment instrument comprising an internal fixation instrument inserted into the vertebral body from the pedicle, an outer tube, and a cement separation instrument, constructed as follows. The internal fixation instrument has a head, a shaft, and a first through hole. The outer cylinder has a connecting portion connected to the head of the internal fixation instrument at the proximal end, a shaft, and a second through hole that communicates with the first through hole when connected to the internal fixation instrument. The cement separation instrument has a shaft that is inserted into a connected through-hole, and has a separation instrument side threaded tooth on the outer circumference of the shaft. The treatment instrument is equipped with a motion direction conversion mechanism, which engages with the threaded teeth on the side of the separation instrument and the threaded teeth provided in the first or second through hole, and converts the rotational force rotating around the central axis into a straight force that causes the front end of the cement separation instrument to travel along the central axis, with the internal fixation instrument or the outer cylinder connected to the internal fixation instrument as the fulcrum. Therefore, even if it is necessary to remove the internal fixation instrument embedded in the body during vertebral body formation surgery in the future, a treatment instrument that is easy to remove can still be provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:內固定器具</p>  
        <p type="p">2:外筒</p>  
        <p type="p">8:水泥分離器具</p>  
        <p type="p">10:治療器具</p>  
        <p type="p">11:頭部</p>  
        <p type="p">12、21:連接部</p>  
        <p type="p">13:嵌合部</p>  
        <p type="p">14、24、84:軸</p>  
        <p type="p">15:攻螺紋的螺紋牙</p>  
        <p type="p">19、29:貫通孔</p>  
        <p type="p">22:外筒側螺紋牙</p>  
        <p type="p">82:分離器具側螺紋牙</p>  
        <p type="p">28、88:手柄</p>  
        <p type="p">81:前端部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1203" publication-number="202612943"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612943.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612943</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119595</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>騎乘者輔助系統及控制方法</chinese-title>  
        <english-title>RIDER ASSISTANCE SYSTEM AND CONTROL METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B60T8/17</main-classification>  
        <further-classification edition="200601120251229B">B62L3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商羅伯特　博世有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERT BOSCH GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村淳志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明抑制積蓄器內充滿剎車液之情況，並且使車體姿勢適當地穩定。於本發明之騎乘者輔助系統及控制方法中，騎乘者輔助系統具備：液壓控制單元；及控制裝置，包括執行壓力控制之執行部，上述壓力控制係藉由使剎車液自輪缸逸出至積蓄器，而執行減小輪缸之剎車液之壓力之減壓動作，於液壓控制單元未設置將積蓄器中所儲積之剎車液自積蓄器排出之泵，執行部於壓力控制中執行介入抑制動作，即於積蓄器之殘留能力資訊為表示積蓄器之殘留能力較少之資訊之情形時，相較於殘留能力資訊為表示殘留能力較多之資訊之情形，使減壓動作難以介入。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To appropriately stabilize a vehicle body posture while preventing an interior of an accumulator from being filled with brake fluid. &lt;br/&gt; In a rider assistance system and a control method according to the present invention, the rider assistance system includes a hydraulic pressure control unit and a control device including an execution unit that executes a pressure control to execute a depressurization operation of reducing the pressure of brake fluid in a wheel cylinder by releasing the brake fluid from the wheel cylinder to the accumulator, in which the hydraulic pressure control unit is not provided with a pump for discharging the brake fluid accumulated in the accumulator from the accumulator, and, in the pressure control, when remaining capacity information of the accumulator is information indicating a low remaining capacity of the accumulator, as compared to when the remaining capacity information is information indicating a high remaining capacity, the execution unit executes an intervention suppression operation that makes it more difficult for the depressurization operation to be initiated.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:剎車系統</p>  
        <p type="p">12d:前叉</p>  
        <p type="p">13:前輪</p>  
        <p type="p">15:制動操作部</p>  
        <p type="p">15a:剎車桿</p>  
        <p type="p">15b:主缸</p>  
        <p type="p">15c:貯液器</p>  
        <p type="p">16:前輪制動部</p>  
        <p type="p">16a:輪缸</p>  
        <p type="p">16b:轉子</p>  
        <p type="p">18:液壓控制單元</p>  
        <p type="p">18a:基體</p>  
        <p type="p">18b:主缸口</p>  
        <p type="p">18c:輪缸口</p>  
        <p type="p">24:液壓感測器</p>  
        <p type="p">31:液管</p>  
        <p type="p">32:液管</p>  
        <p type="p">41:主流路</p>  
        <p type="p">42:副流路</p>  
        <p type="p">51:進口閥</p>  
        <p type="p">52:釋放閥</p>  
        <p type="p">53:積蓄器</p>  
        <p type="p">60:控制裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1204" publication-number="202614143"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614143.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614143</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119596</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對多站製造腔室的RF訊號之提供</chinese-title>  
        <english-title>PROVISION OF RF SIGNALS TO A MULTI-STATION FABRICATION CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01J37/32</main-classification>  
        <further-classification edition="200601120260102B">H03H7/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗倫奇　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRENCH, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫德拉　約瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDELA, JOZEF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於將RF訊號提供至多站製造腔室的技術被提供。在一些實施例中，系統可包含：第一高頻匹配電路，配置以執行在第一高頻RF源與處理站之第一子集之間的阻抗匹配；以及第二高頻匹配電路，配置以執行在第二高頻RF源與處理站之第二子集之間的阻抗匹配。系統可包含第一分離器/組合器，配置以：接收低頻 RF 訊號；並組合低頻 RF 訊號與第一阻抗匹配的高頻 RF 訊號以產生第一組合 RF 訊號。系統可包含第二分離器/組合器，配置以：接收低頻 RF 訊號；並組合低頻 RF 訊號與第二阻抗匹配的高頻 RF 訊號以產生第二組合 RF 訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques for provision of RF signals to a multi-station fabrication chamber are provided. In some embodiments, a system may include: a first high frequency match circuit configured to perform impedance matching between a first high frequency RF source and a first subset of process stations; and a second high frequency match circuit configured to perform impedance matching between a second high frequency RF source and a second subset of the process stations. The system may include a first splitter/combiner configured to: receive a low frequency RF signal; and combine the low frequency RF signal and the first impedance matched high frequency RF signal to generate a first combined RF signal. The system may include a second splitter/combiner configured to: receive the low frequency RF signal; and combine the low frequency RF signal and the second impedance matched high frequency RF signal to generate a second combined RF signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">302,304,306,308:站</p>  
        <p type="p">310:VI探針</p>  
        <p type="p">312:低頻射頻(LF RF)產生器</p>  
        <p type="p">314:低頻射頻(LF RF)匹配電路</p>  
        <p type="p">316:VI探針</p>  
        <p type="p">318a,318b:分離器/組合器</p>  
        <p type="p">320a,320b:高頻射頻(HF RF)產生器</p>  
        <p type="p">324a,324b:高頻(HF)匹配電路</p>  
        <p type="p">326:並聯阻抗</p>  
        <p type="p">328:串聯阻抗</p>  
        <p type="p">330a,330b:VI探針</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1205" publication-number="202612859"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612859.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612859</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119601</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>前端機器人調平夾具</chinese-title>  
        <english-title>FRONT END ROBOT LEVELING JIG</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B25J9/00</main-classification>  
        <further-classification edition="200601120251231B">B25J11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝利斯　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAYLISS, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種夾具，其用於對準一基板處理系統之一雙臂機器人的一上端效器及一下端效器。該夾具經配置以容納該下端效器，並且該上端效器使用該夾具與該下端效器對準。具體言之，該夾具包括一上頂表面及一上側表面，以及藉由一下側表面與一下底表面分離之一下頂表面。該上側表面及該下頂表面耦接以形成一直角。下端效器藉由與該下頂表面及該上側表面耦接而與該夾具對準。在該下端效器之對準之後，上端效器藉由與該夾具耦接而與該下端效器對準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A jig is provided for aligning an upper end effector and a lower end effector of a dual arm robot of a substrate processing system. The jig is configured to accommodate the lower end effector and the upper end effector is aligned with the lower end effector using the jig. Specifically, the jig includes an upper top surface and an upper side surface, and a lower top surface separated from a lower bottom surface by a lower side surface. The upper side surface and the lower top surface couple to form a right angle. Lower end effector aligns with the jig by coupling with the lower top surface and the upper side surface. After alignment of the lower end effector, upper end effector aligns with lower end effector by coupling with the jig.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:夾具</p>  
        <p type="p">222:側面</p>  
        <p type="p">224:側面</p>  
        <p type="p">226:側面</p>  
        <p type="p">228a:第四下側表面</p>  
        <p type="p">228b:第四上側表面</p>  
        <p type="p">230:下部夾具區段</p>  
        <p type="p">232:側面</p>  
        <p type="p">234:側面</p>  
        <p type="p">240:上部夾具區段</p>  
        <p type="p">246:第五上側表面/側面</p>  
        <p type="p">252:第六上側表面/側面</p>  
        <p type="p">254:第八上側表面/側面</p>  
        <p type="p">260:上頂表面</p>  
        <p type="p">270:下頂表面</p>  
        <p type="p">272:第七側表面/第七上表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1206" publication-number="202612871"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612871.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612871</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119613</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁性夾持器及工業用機器人</chinese-title>  
        <english-title>MAGNET GRIPPER AND INDUSTRIAL ROBOT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B25J15/06</main-classification>  
        <further-classification edition="200601120251229B">B25J19/00</further-classification>  
        <further-classification edition="200601120251229B">B25B5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＭＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈門　佛洛里安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMMEN, FLORIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種磁性夾持器(14)，具備：第一夾持器單元(16)，具有在直徑方向上被磁化的第一磁鐵(28)；第二夾持器單元(16A)，具有在直徑方向上被磁化的第二磁鐵(28A)；以及旋轉軸(20)，將第一磁鐵(28)與第二磁鐵(28A)相連結，並以旋轉軸線為中心來使其旋轉；其中，第二夾持器單元(16A)是以不受第一夾持器單元(16)的吸附力之影響的距離，來被分離配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A magnet gripper (14) includes: a first gripper unit (16) including a first magnet (28) magnetized in the diametrical direction; a second gripper unit (16A) including a second magnet (28A) magnetized in the diametrical direction; and a rotation shaft (20) for connecting the first magnet (28) and the second magnet (28A) and rotating the first magnet (28) and the second magnet (28A) around a rotational axis, wherein the second gripper unit (16A) is arranged at a distance from the first gripper unit (16), out of the influence of an attracting force of the first gripper unit (16).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:磁性夾持器</p>  
        <p type="p">16:夾持器單元、第一夾持器單元</p>  
        <p type="p">16A:夾持器單元、第二夾持器單元</p>  
        <p type="p">20:旋轉軸</p>  
        <p type="p">20a:端部</p>  
        <p type="p">22:驅動機構</p>  
        <p type="p">24:中間殼體</p>  
        <p type="p">26:第一磁軛</p>  
        <p type="p">26A:第二磁軛</p>  
        <p type="p">26a:第一端面</p>  
        <p type="p">26b:第二端面</p>  
        <p type="p">26c:下表面</p>  
        <p type="p">26d:上表面</p>  
        <p type="p">28:第一磁鐵</p>  
        <p type="p">28A:第二磁鐵</p>  
        <p type="p">28a:磁鐵片</p>  
        <p type="p">30:磁極片</p>  
        <p type="p">34:收容室</p>  
        <p type="p">34A:收容室</p>  
        <p type="p">36:空氣間隙部</p>  
        <p type="p">36A:空氣間隙部</p>  
        <p type="p">36a:第一槽</p>  
        <p type="p">36b:第二槽</p>  
        <p type="p">38:驅動馬達</p>  
        <p type="p">38a:驅動軸部</p>  
        <p type="p">40:傳遞機構</p>  
        <p type="p">40a:帶輪</p>  
        <p type="p">40b:帶輪</p>  
        <p type="p">40c:帶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1207" publication-number="202613000"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613000.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613000</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119615</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>容器搬送系統</chinese-title>  
        <english-title>CONTAINER TRANSPORT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">B65G1/137</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>右近孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UKON, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">空容器搬送系統100具備：搬送車1，為複數台且行走於行走區E；空容器供給部2，將複數個類別的空容器3選擇性地供給至複數台搬送車1；作業站4，為複數個；為複數個且及控制部。控制部根據至少包含各個作業站4所需要的空容器3的類別之容器要求資訊，而生成用以往各個作業站4供給空容器3之空容器供給資訊，保持有與容器要求資訊對應之類別的空容器3之搬送車1根據空容器供給資訊，而將空容器3搬送至作業站4。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An empty container transport system includes a plurality of transport vehicles that travel in a travel area, an empty container supplier that supplies a plurality of empty containers of different types selectively to the respective plurality of transport vehicles, a plurality of work stations, and a controller. The controller generates, based on container request information including at least a type of empty container to be used at each of the plurality of work stations, empty container supply information to supply an empty container to each of the plurality of work stations. Each of the plurality of transport vehicles holds the empty container of the type corresponding to the container request information and transports the empty container to the corresponding work station based on the empty container supply information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:搬送車</p>  
        <p type="p">10:待機搬送車</p>  
        <p type="p">2:空容器供給部</p>  
        <p type="p">21:第1容器搬送輸送機</p>  
        <p type="p">22:第2容器搬送輸送機</p>  
        <p type="p">23:第3容器搬送輸送機</p>  
        <p type="p">24:第4容器搬送輸送機</p>  
        <p type="p">25:容器成形裝置</p>  
        <p type="p">3:空容器</p>  
        <p type="p">30:出貨對象容器</p>  
        <p type="p">31:小容器</p>  
        <p type="p">32:中容器</p>  
        <p type="p">33:大容器</p>  
        <p type="p">34:特大容器</p>  
        <p type="p">4:作業站</p>  
        <p type="p">40:接收機構</p>  
        <p type="p">41:第1輸送機</p>  
        <p type="p">42:第2輸送機</p>  
        <p type="p">43:第3輸送機</p>  
        <p type="p">44:第4輸送機</p>  
        <p type="p">45:容器保持輸送機</p>  
        <p type="p">49:元件</p>  
        <p type="p">9:作業員</p>  
        <p type="p">91:物品供給輸送機</p>  
        <p type="p">92:物品返回輸送機</p>  
        <p type="p">96:進料輸送機</p>  
        <p type="p">99:出貨輸送機</p>  
        <p type="p">100:容器搬送系統</p>  
        <p type="p">E:行走區</p>  
        <p type="p">K1:元件</p>  
        <p type="p">K2:元件</p>  
        <p type="p">P:停止位置</p>  
        <p type="p">P1:第1停止位置</p>  
        <p type="p">P2:第2停止位置</p>  
        <p type="p">P3:第3停止位置</p>  
        <p type="p">P4:第4停止位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1208" publication-number="202614251"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614251.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614251</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119626</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>原位晶圓接合傳播量測</chinese-title>  
        <english-title>IN SITU WAFER BOND PROPAGATION MEASUREMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H01L21/66</main-classification>  
        <further-classification edition="200601120251217B">H01L21/18</further-classification>  
        <further-classification edition="200601120251217B">H01L21/67</further-classification>  
        <further-classification edition="200601120251217B">H01L21/68</further-classification>  
        <further-classification edition="200601120251217B">H01L21/683</further-classification>  
        <further-classification edition="202501120251217B">H10D84/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔奇曼　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUCHMAN, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內茨班德　克里斯多福　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NETZBAND, CHRISTOPHER MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉爾德　亞當</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GILDEA, ADAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫　錫久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, ILSEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種在接合期間量測接合前沿傳播的範例方法包含使用來自第一水平光學感測器的第一雷射光束來照射在第一晶圓與第二晶圓之間的間隙，第二晶圓由第二平台固持於第一晶圓上方。該方法包含使接合前沿傳播以消除間隙，並在第一與第二晶圓之間形成接合區域。該方法包含在傳播接合前沿的同時，使用第一水平光學感測器收集第一散射雷射光束，第一散射雷射光束包含從接合前沿散射的第一雷射光束的一部分。該方法包含使用第一散射雷射光束來確定從第一水平光學感測器到接合前沿的第一距離；以及使用第一距離來確定在傳播期間的接合前沿的第一位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An example method for measuring bond front propagation during bonding includes illuminating, using a first laser beam from a first horizontal optical sensor, a gap between a first wafer and a second wafer, the second wafer held by a second platen over the first wafer. The method includes propagating a bond front to eliminate the gap and forming a bonded region between the first and the second wafers. The method includes while propagating the bond front, collecting, using the first horizontal optical sensor, a first scattered laser beam, the first scattered laser beam including a portion of the first laser beam scattered from the bond front. The method includes determining, using the first scattered laser beam, a first distance from the first horizontal optical sensor to the bond front; and determining, using the first distance, a first position of the bond front during the propagating.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶圓接合設備、設備</p>  
        <p type="p">102:第一晶圓</p>  
        <p type="p">104:第二晶圓</p>  
        <p type="p">108:雷射光束</p>  
        <p type="p">110-1:第一真空吸嘴</p>  
        <p type="p">110-2:第二真空吸嘴</p>  
        <p type="p">112:基底部分</p>  
        <p type="p">114:上平台</p>  
        <p type="p">116:下平台</p>  
        <p type="p">118:接合機構</p>  
        <p type="p">120:水平光學感測器</p>  
        <p type="p">122:間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1209" publication-number="202613054"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613054.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613054</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119632</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於藉由控制所採用之粉末的水含量來生產經燒結積層體之程序</chinese-title>  
        <english-title>PROCESS FOR PRODUCING A SINTERED LAYERED BODY BY CONTROLLING THE WATER CONTENT OF A POWDER EMPLOYED</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">C04B35/44</main-classification>  
        <further-classification edition="200601120251231B">C04B35/626</further-classification>  
        <further-classification edition="200601120251231B">C04B35/645</further-classification>  
        <further-classification edition="200601120251231B">B22F3/14</further-classification>  
        <further-classification edition="200601120251231B">B28B3/02</further-classification>  
        <further-classification edition="200601120251231B">B32B18/00</further-classification>  
        <further-classification edition="200601120251231B">C04B35/119</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賀利氏科萬特北美有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS COVANTICS NORTH AMERICA LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃克　路克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALKER, LUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐納隆　馬修喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONELON, MATTHEW JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於生產積層體之程序，其包含下列程序步驟：&lt;br/&gt;a.    將第一粉末引入內部容積中以獲得該內部容積中的第一粉末層，其中該內部容積&lt;br/&gt;i.     具有至少200 mm的橫截面寬度W，且&lt;br/&gt;ii.    至少部分地藉由模具之內部表面定界，其中該模具具有至少一個壁，且其中該壁包含碳；&lt;br/&gt;b.    使該第一粉末層經受熱及壓力以獲得該積層體，其中&lt;br/&gt;i.     該熱藉由跨該模具、該內部容積、或兩者施加的電壓產生，且&lt;br/&gt;ii.    該積層體包含第一層；&lt;br/&gt;其中以該第一粉末的總重量計，該第一粉末具有在0至0.5 wt-%之範圍內的水含量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process for producing a layered body, comprising the following process steps:&lt;br/&gt;a. introducing a first powder into an interior volume to obtain a first powder layer in the interior volume, wherein the interior volume&lt;br/&gt;i. has a cross-sectional width W of at least 200 mm, and&lt;br/&gt;ii. is at least partially bordered by an interior surface of a die, wherein the die has at least one wall, and wherein said wall comprises carbon;&lt;br/&gt;b. subjecting the first powder layer to a heat and a pressure to obtain the layered body, wherein&lt;br/&gt;i. the heat is generated by an electrical voltage applied across the die, the interior volume, or both, and&lt;br/&gt;ii. the layered body comprises a first layer;&lt;br/&gt;wherein the first powder has a water content in the range from 0 to 0.5 wt-%, based on a total weight of the first powder.&lt;b/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">001:第一推動構件</p>  
        <p type="p">002:第一活塞</p>  
        <p type="p">003:第一衝頭</p>  
        <p type="p">004:第一衝頭內部表面</p>  
        <p type="p">005:模具之內部表面</p>  
        <p type="p">006:模具</p>  
        <p type="p">007:第二衝頭內部表面</p>  
        <p type="p">008:第二衝頭</p>  
        <p type="p">009:第二活塞</p>  
        <p type="p">010:第二推動構件</p>  
        <p type="p">011:壓縮軸</p>  
        <p type="p">012:電源</p>  
        <p type="p">013:內部容積</p>  
        <p type="p">014:第一粉末層</p>  
        <p type="p">100:裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1210" publication-number="202613059"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613059.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613059</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119636</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於藉由控制所採用之粉末的碳含量來生產經燒結之積層體之程序</chinese-title>  
        <english-title>PROCESS FOR PRODUCING A SINTERED LAYERED BODY BY CONTROLLING THE CARBON CONTENT OF A POWDER EMPLOYED</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C04B35/64</main-classification>  
        <further-classification edition="200601120251229B">C04B35/119</further-classification>  
        <further-classification edition="200601120251229B">C04B35/626</further-classification>  
        <further-classification edition="200601120251229B">C04B35/44</further-classification>  
        <further-classification edition="202201120251229B">B22F1/052</further-classification>  
        <further-classification edition="202101120251229B">B22F3/00</further-classification>  
        <further-classification edition="200601120251229B">B22F3/105</further-classification>  
        <further-classification edition="200601120251229B">B30B15/00</further-classification>  
        <further-classification edition="200601120251229B">B30B15/34</further-classification>  
        <further-classification edition="200601120251229B">B32B18/00</further-classification>  
        <further-classification edition="200601120251229B">B28B1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賀利氏科萬特北美有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS COVANTICS NORTH AMERICA LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃克　路克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALKER, LUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐納隆　馬修喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONELON, MATTHEW JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於生產一積層體之程序，其包含下列程序步驟：&lt;br/&gt;a.     將第一粉末引入內部容積以獲得該內部容積中的第一粉末層，其中該內部容積&lt;br/&gt;i.      具有至少200 mm的橫截面寬度W，且&lt;br/&gt;ii.     至少部分地藉由模具之內部表面定界，其中該模具具有至少一個壁，且其中該壁包含碳；&lt;br/&gt;b.     使該第一粉末層經受熱及壓力以獲得該積層體，其中&lt;br/&gt;i.      該熱藉由跨該模具、該內部容積、或兩者施加的電壓產生，且&lt;br/&gt;ii.     該積層體包含第一層；&lt;br/&gt;其中&lt;br/&gt;該第一粉末具有在25至2000 ppm的範圍內的碳含量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process for producing a layered body, comprising the following process steps:&lt;br/&gt;a. introducing a first powder into an interior volume to obtain a first powder layer in the interior volume, wherein the interior volume&lt;br/&gt;i. has a cross-sectional width W of at least 200 mm, and&lt;br/&gt;ii. is at least partially bordered by an interior surface of a die, wherein the die has at least one wall, and wherein said wall comprises carbon;&lt;br/&gt;b. subjecting the first powder layer to a heat and a pressure to obtain the layered body, wherein&lt;br/&gt;i. the heat is generated by an electrical voltage applied across the die, the interior volume, or both, and&lt;br/&gt;ii. the layered body comprises a first layer;&lt;br/&gt;wherein&lt;br/&gt;the first powder has a carbon content in the range from 25 to 2000 ppm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">001:第一推動構件</p>  
        <p type="p">002:第一活塞</p>  
        <p type="p">003:第一衝頭</p>  
        <p type="p">004:第一衝頭內部表面</p>  
        <p type="p">005:模具之內部表面</p>  
        <p type="p">006:模具</p>  
        <p type="p">007:第二衝頭內部表面</p>  
        <p type="p">009:第二活塞</p>  
        <p type="p">010:第二推動構件</p>  
        <p type="p">011:壓縮軸</p>  
        <p type="p">012:電源</p>  
        <p type="p">013:內部容積</p>  
        <p type="p">014:第一粉末層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1211" publication-number="202613055"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613055.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613055</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119638</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於藉由使用積層體的差別冷卻速率來生產經燒結積層體之程序</chinese-title>  
        <english-title>PROCESS FOR PRODUCING A SINTERED LAYERED BODY BY USING A DIFFERENTIAL COOLING RATE OF THE LAYERED BODY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C04B35/44</main-classification>  
        <further-classification edition="200601120251229B">C04B35/645</further-classification>  
        <further-classification edition="200601120251229B">C04B35/119</further-classification>  
        <further-classification edition="200601120251229B">C04B35/64</further-classification>  
        <further-classification edition="200601120251229B">B22F3/14</further-classification>  
        <further-classification edition="200601120251229B">B22F3/105</further-classification>  
        <further-classification edition="200601120251229B">B32B18/00</further-classification>  
        <further-classification edition="200601120251229B">B28B3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賀利氏科萬特北美有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS COVANTICS NORTH AMERICA LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃克　路克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALKER, LUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐納隆　馬修喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONELON, MATTHEW JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於生產積層體之程序，其包含下列程序步驟：&lt;br/&gt;a.     將第一粉末引入內部容積中以獲得該內部容積中的第一粉末層，其中&lt;br/&gt;i.      該內部容積具有至少200 mm的橫截面寬度W，&lt;br/&gt;ii.     該內部容積藉由以下定界&lt;br/&gt;A.    第一衝頭之第一衝頭內部表面，&lt;br/&gt;B.    第二衝頭之第二衝頭內部表面，及&lt;br/&gt;C.    模具之內部表面，且&lt;br/&gt;iii.    該模具具有至少一個壁，其中該壁包含碳；&lt;br/&gt;b.     使該第一粉末層經受熱及壓力以獲得該積層體，其中&lt;br/&gt;i.      該熱藉由跨該模具、該內部容積、或兩者施加的電壓產生，&lt;br/&gt;ii.     該積層體包含第一層，且&lt;br/&gt;iii.    該積層體具有第一表面K&lt;sub&gt;T&lt;/sub&gt;及另一表面K&lt;sub&gt;S&lt;/sub&gt;；&lt;br/&gt;c.     使該積層體經受冷卻步驟，其中該冷卻步驟包含下列：&lt;br/&gt;I.      第一冷卻階段C&lt;sub&gt;1&lt;/sub&gt;，在此期間T&lt;sub&gt;S&lt;/sub&gt;＞ T&lt;sub&gt;T&lt;/sub&gt;，&lt;br/&gt;II.     C&lt;sub&gt;1&lt;/sub&gt;之後的交叉事件C&lt;sub&gt;2&lt;/sub&gt;，此時T&lt;sub&gt;S&lt;/sub&gt;= T&lt;sub&gt;T&lt;/sub&gt;，&lt;br/&gt;III.   另一冷卻階段C&lt;sub&gt;3&lt;/sub&gt;，在此期間T&lt;sub&gt;S&lt;/sub&gt;＜ T&lt;sub&gt;T&lt;/sub&gt;，&lt;br/&gt;其中T&lt;sub&gt;T&lt;/sub&gt;係針對該第一表面K&lt;sub&gt;T&lt;/sub&gt;判定之溫度，且T&lt;sub&gt;S&lt;/sub&gt;係針對該另一表面K&lt;sub&gt;S&lt;/sub&gt;判定之溫度；&lt;br/&gt;其中C&lt;sub&gt;2&lt;/sub&gt;在該冷卻步驟開始後1至100分鐘之範圍內發生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process for producing a layered body, comprising the following process steps:&lt;br/&gt;a. introducing a first powder into an interior volume to obtain a first powder layer in the interior volume, wherein&lt;br/&gt;i. the interior volume has a cross-sectional width W of at least 200 mm,&lt;br/&gt;ii. the interior volume is bordered by&lt;br/&gt;A. a first punch interior surface of a first punch,&lt;br/&gt;B. a second punch interior surface of a second punch, and&lt;br/&gt;C. an interior surface of a die, and&lt;br/&gt;iii. the die has at least one wall, wherein said wall comprises carbon;&lt;br/&gt;b. subjecting the first powder layer to a heat and a pressure to obtain the layered body, wherein&lt;br/&gt;i. the heat is generated by an electrical voltage applied across the die, the interior volume, or both,&lt;br/&gt;ii. the layered body comprises a first layer, and&lt;br/&gt;iii. the layered body has a first surface K&lt;sub&gt;T&lt;/sub&gt;and a further surface K&lt;sub&gt;S&lt;/sub&gt;;&lt;br/&gt;c. subjecting the layered body to a cooling step, wherein the cooling step comprises the following:&lt;br/&gt;I. a first cooling phase C&lt;sub&gt;1&lt;/sub&gt;during which T&lt;sub&gt;S&lt;/sub&gt;＞ T&lt;sub&gt;T&lt;/sub&gt;,&lt;br/&gt;II. a cross-over event C&lt;sub&gt;2&lt;/sub&gt;following C&lt;sub&gt;1&lt;/sub&gt;at which T&lt;sub&gt;S&lt;/sub&gt;= T&lt;sub&gt;T&lt;/sub&gt;,&lt;br/&gt;III. a further cooling phase C&lt;sub&gt;3&lt;/sub&gt;during which T&lt;sub&gt;S&lt;/sub&gt;＜ T&lt;sub&gt;T&lt;/sub&gt;,&lt;br/&gt;with T&lt;sub&gt;T&lt;/sub&gt;being a temperature determined for the first surface K&lt;sub&gt;T&lt;/sub&gt;and T&lt;sub&gt;S&lt;/sub&gt;being a temperature determined for the further surface K&lt;sub&gt;S&lt;/sub&gt;;&lt;br/&gt;wherein C&lt;sub&gt;2&lt;/sub&gt;occurs in the range from 1 to 100 minutes after the start of the cooling step.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">001:第一推動構件</p>  
        <p type="p">002:第一活塞</p>  
        <p type="p">003:第一衝頭</p>  
        <p type="p">004:第一衝頭內部表面</p>  
        <p type="p">005:內部表面</p>  
        <p type="p">006:模具</p>  
        <p type="p">007:第二衝頭內部表面</p>  
        <p type="p">008:第二衝頭</p>  
        <p type="p">009:第二活塞</p>  
        <p type="p">010:第二推動構件</p>  
        <p type="p">011:壓縮軸</p>  
        <p type="p">012:電源</p>  
        <p type="p">013:內部容積</p>  
        <p type="p">014:第一粉末層</p>  
        <p type="p">100:裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1212" publication-number="202613060"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613060.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613060</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119639</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於藉由控制所採用之粉末的硫含量來生產經燒結之積層體之程序</chinese-title>  
        <english-title>PROCESS FOR PRODUCING A SINTERED LAYERED BODY BY CONTROLLING THE SULFUR CONTENT OF A POWDER EMPLOYED</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C04B35/64</main-classification>  
        <further-classification edition="200601120251229B">C04B35/44</further-classification>  
        <further-classification edition="200601120251229B">C04B35/626</further-classification>  
        <further-classification edition="200601120251229B">C04B35/645</further-classification>  
        <further-classification edition="200601120251229B">C04B35/119</further-classification>  
        <further-classification edition="200601120251229B">B22F3/14</further-classification>  
        <further-classification edition="200601120251229B">B28B1/00</further-classification>  
        <further-classification edition="200601120251229B">B28B3/02</further-classification>  
        <further-classification edition="200601120251229B">B30B15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賀利氏科萬特北美有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS COVANTICS NORTH AMERICA LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃克　路克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALKER, LUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐納隆　馬修喬瑟夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONELON, MATTHEW JOSEPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於生產積層體之程序，其包含下列程序步驟：&lt;br/&gt;a.    將第一粉末引入內部容積中以獲得該內部容積中的第一粉末層，其中該內部容積&lt;br/&gt;i.     具有至少200 mm的橫截面寬度W，且&lt;br/&gt;ii.    至少部分地藉由模具之內部表面定界，其中該模具具有至少一個壁，且其中該壁包含碳；&lt;br/&gt;b.    使該第一粉末層經受熱及壓力以獲得該積層體，其中&lt;br/&gt;i.     該熱藉由跨該模具、該內部容積、或兩者施加的電壓產生，且&lt;br/&gt;ii.    該積層體包含第一層；&lt;br/&gt;其中&lt;br/&gt;該第一粉末具有30 ppm或更小的硫含量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process for producing a layered body, comprising the following process steps:&lt;br/&gt;a. introducing a first powder into an interior volume to obtain a first powder layer in the interior volume, wherein the interior volume&lt;br/&gt;i. has a cross-sectional width W of at least 200 mm, and&lt;br/&gt;ii. is at least partially bordered by an interior surface of a die, wherein the die has at least one wall, and wherein said wall comprises carbon;&lt;br/&gt;b. subjecting the first powder layer to a heat and a pressure to obtain the layered body, wherein&lt;br/&gt;i. the heat is generated by an electrical voltage applied across the die, the interior volume, or both, and&lt;br/&gt;ii. the layered body comprises a first layer;&lt;br/&gt;wherein&lt;br/&gt;the first powder has a sulfur content of 30 ppm or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">001:第一推動構件</p>  
        <p type="p">002:第一活塞</p>  
        <p type="p">003:第一衝頭</p>  
        <p type="p">004:第一衝頭內部表面</p>  
        <p type="p">005:模具之內部表面</p>  
        <p type="p">006:模具</p>  
        <p type="p">007:第二衝頭內部表面</p>  
        <p type="p">008:第二衝頭</p>  
        <p type="p">009:第二活塞</p>  
        <p type="p">010:第二推動構件</p>  
        <p type="p">011:壓縮軸</p>  
        <p type="p">012:電源</p>  
        <p type="p">013:內部容積</p>  
        <p type="p">014:第一粉末層</p>  
        <p type="p">015:模具壁</p>  
        <p type="p">100:根據本發明之裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1213" publication-number="202613056"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613056.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613056</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119640</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於藉由採用具有有限振幅變化的直流電來生產經燒結積層體之程序</chinese-title>  
        <english-title>PROCESS FOR PRODUCING A SINTERED LAYERED BODY BY EMPLOYING DIRECT CURRENT WITH LIMITED AMPLITUDE VARIATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">C04B35/44</main-classification>  
        <further-classification edition="200601120251231B">C04B35/645</further-classification>  
        <further-classification edition="200601120251231B">B32B18/00</further-classification>  
        <further-classification edition="200601120251231B">C04B35/119</further-classification>  
        <further-classification edition="200601120251231B">B22F3/14</further-classification>  
        <further-classification edition="200601120251231B">B28B3/02</further-classification>  
        <further-classification edition="200601120251231B">B28B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賀利氏科萬特北美有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS COVANTICS NORTH AMERICA LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃克　路克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALKER, LUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於生產積層體之程序，其包含下列程序步驟：&lt;br/&gt;a.    將第一粉末引入內部容積中以獲得該內部容積中的第一粉末層，其中該內部容積&lt;br/&gt;i.     具有至少200 mm的橫截面寬度W，且&lt;br/&gt;ii.    至少部分地藉由模具之內部表面定界，其中該模具具有至少一個壁，且其中該壁包含碳；&lt;br/&gt;b.    使該第一粉末層經受熱及壓力以獲得該積層體，其中&lt;br/&gt;i.     該熱藉由跨該模具、該內部容積、或兩者施加的電壓產生，且&lt;br/&gt;ii.    該積層體包含第一層；&lt;br/&gt;其中&lt;br/&gt;使該第一粉末層經受熱及壓力之步驟（步驟b.）包括具有至少1分鐘之持續時間的至少一個時間間隔D&lt;sub&gt;V&lt;/sub&gt;，且在該時間間隔D&lt;sub&gt;V&lt;/sub&gt;期間，該電壓相對於該時間間隔D&lt;sub&gt;v&lt;/sub&gt;內的基線電壓變化不大於15%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process for producing a layered body, comprising the following process steps:&lt;br/&gt;a. introducing a first powder into an interior volume to obtain a first powder layer in the interior volume, wherein the interior volume&lt;br/&gt;i. has a cross-sectional width W of at least 200 mm, and&lt;br/&gt;ii. is at least partially bordered by an interior surface of a die, wherein the die has at least one wall, and wherein said wall comprises carbon;&lt;br/&gt;b. subjecting the first powder layer to a heat and a pressure to obtain the layered body, wherein&lt;br/&gt;i. the heat is generated by an electrical voltage applied across the die, the interior volume, or both, and&lt;br/&gt;ii. the layered body comprises a first layer;&lt;br/&gt;wherein&lt;br/&gt;the step of subjecting the first powder layer to a heat and a pressure (step b.) includes at least one time interval D&lt;sub&gt;V&lt;/sub&gt;with a duration of at least 1 minute, and during which time interval D&lt;sub&gt;V&lt;/sub&gt;the electrical voltage does not vary by more than 15 % with respect to a baseline electrical voltage over the time interval D&lt;sub&gt;v&lt;/sub&gt;.&lt;b/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">603:時間間隔D&lt;sub&gt;V&lt;/sub&gt;期間的基線電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1214" publication-number="202612596"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612596.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612596</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119647</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>富含ＧＡＢＡ的新穎掩蓋產品</chinese-title>  
        <english-title>NEW MASKING PRODUCT RICH IN GABA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260102B">A23L27/22</main-classification>  
        <further-classification edition="201601120260102B">A23L27/24</further-classification>  
        <further-classification edition="201601120260102B">A23L33/145</further-classification>  
        <further-classification edition="200601120260102B">C12P13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商樂斯福公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LESAFFRE ET COMPAGNIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅南　胡迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MENIN, RUDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐傑　卡羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUGE, CAROLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>托馬斯　安東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THOMAS, ANTOINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫內馬斯　瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONNET-MARS, CELINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范　黃寶玉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHAM, HOANG BAO NGOC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種天然萃取物，較佳為酵母萃取物，其富含γ-胺基丁酸(GABA)；一種含有此種萃取物的產品；以及其用於掩蓋在產品中的風味(flavor)(特別是苦味及酸味)，以及令人不快的味調(note)(特別是來自甜味劑味調、蛋白質味調、及金屬味調)、或三叉神經感覺(諸如澀味)之用途，該產品有利地為食品、藥品、或營養製劑產品、或芳香製劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a natural extract, preferably a yeast extract, rich in gamma-aminobutyric acid (GABA), a product containing such an extract, and their use for masking flavors, particularly bitter and sour flavors, as well as undesirable notes, particularly from sweeteners, proteins, and metallic notes, or trigeminal sensations such as astringency, in a product, advantageously a food, pharmaceutical, or nutraceutical product, or an aromatic preparation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1215" publication-number="202613337"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613337.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613337</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119651</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遮罩、蒸鍍方法及器件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">C23C14/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大日本印刷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穂刈久実子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOKARI, KUMIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>草原朱洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSAHARA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武田利彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEDA, TOSHIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本克美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, KATSUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之遮罩亦可具備：基材，其包含第1面、第2面、及自第1面向第2面貫通之複數個第1開口；遮罩層，其包含與第2面對向之第3面、與第4面；及中間層，其位於基材之第2面與遮罩層之第3面之間。基材亦可包含矽或矽化合物。遮罩層亦可包含：複數個第1區域，其等於俯視時與第1開口重疊；及第2區域。複數個第1區域亦可分別包含有效區域，該有效區域包含自第3面向第4面貫通之複數個第2開口。中間層亦可包含：第1中間層，其位於基材之第2面，包含氧化矽或氮化矽；及第2中間層，其位於第1中間層與遮罩層之間，包含金屬。第2中間層亦可包含俯視時與第1開口重疊、但不與第1中間層重疊之面即露出面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31:第1開口</p>  
        <p type="p">32:第1壁面</p>  
        <p type="p">36:內側區域</p>  
        <p type="p">40:遮罩層</p>  
        <p type="p">43:第1區域</p>  
        <p type="p">44:第2區域</p>  
        <p type="p">50:中間層</p>  
        <p type="p">51:第1中間層</p>  
        <p type="p">52:第2中間層</p>  
        <p type="p">302:第2面</p>  
        <p type="p">431:有效區域</p>  
        <p type="p">432:周圍區域</p>  
        <p type="p">511:內緣</p>  
        <p type="p">521:內緣</p>  
        <p type="p">522:露出面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1216" publication-number="202613660"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613660.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613660</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119658</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連續可調諧振頻率掃描一維鏡</chinese-title>  
        <english-title>CONTINUOUSLY ADJUSTABLE RESONANCE FREQUENCY SCANNING 1D MIRROR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G02B26/10</main-classification>  
        <further-classification edition="200601120251229B">H02K33/00</further-classification>  
        <further-classification edition="200601120251229B">G01N21/95</further-classification>  
        <further-classification edition="202101120251229B">G02B7/182</further-classification>  
        <further-classification edition="200601120251229B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商奧寶科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORBOTECH LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈伊克赫曼　塔爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOICHMAN, TAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯朗夫曼　阿卡迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRONFMAN, ARKADY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿哈加尼　艾許坎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGHAJANI, ASHKAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈巴波　摩德查　海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HABABO, MORDECHAI HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種系統包含：一支撐部件，其經組態以支撐一鏡；一支點，其經組態以在中心支撐該支撐部件；及一基座，其經組態以支撐該支點。一音圈係安置於該基座部件上之該支點之一個側上且連接至該支撐部件之一個端。一處理器經組態以將一激勵信號發送至該音圈，該激勵信號引起該支撐部件相對於該支點振盪。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The system includes a support member configured to support a mirror, a fulcrum configured to centrally support the support member, and a base configured to support the fulcrum. A voice coil is disposed on the base member on one side of the fulcrum and connected to one end of the support member. A processor is configured to send an excitation signal to the voice coil, which causes the support member to oscillate relative to the fulcrum.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">101:工件</p>  
        <p type="p">105:載物台</p>  
        <p type="p">106:第一軸線</p>  
        <p type="p">110:光源</p>  
        <p type="p">120:鏡總成</p>  
        <p type="p">130:相機</p>  
        <p type="p">150:處理器</p>  
        <p type="p">151:記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1217" publication-number="202613353"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613353.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613353</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119681</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>針對製造製程控制紅外線資料之利用</chinese-title>  
        <english-title>UTILIZING INFRARED DATA FOR CONTROL OF FABRICATION PROCESSES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">C23C16/455</main-classification>  
        <further-classification edition="200601120251223B">C23C16/52</further-classification>  
        <further-classification edition="200601120251223B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙瓦拉尼　卡皮爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWLANI, KAPIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾許地安尼　凱翰　阿畢迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASHTIANI, KAIHAN ABIDI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗蘭森　保羅　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRANZEN, PAUL M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉比　拉福商</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RABBI, RAFSAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BD</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬丁　帕特金　約翰　埃爾斯沃思</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTIN, PATGING JOHN ELSWORTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　史貴凡迪　巴頓　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN SCHRAVENDIJK, BART J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謙德拉瑟哈蘭　拉密許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANDRASEKHARAN, RAMESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供與半導體製造製程結合的利用紅外線資料之技術。在某些實施例中，所述技術可涉及從與製程站相關聯的一或更多紅外線感測器接收資料。所述技術可進一步涉及判定紅外線溫度資料及/或發射率資料。所述技術可進一步涉及使用紅外線溫度資料及/或發射率資料判定下列至少其中一者：(1)與製程站之一或更多組件相關聯的溫度資訊；或(2)指示在製程站之組件上或正進行處理之基板之表面上所沉積材料之厚度的厚度資訊。所述技術可進一步涉及判定溫度資訊及/或厚度資訊是否超出目標規格。所述技術可進一步涉及採取至少一矯正措施。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques for utilizing infrared data in conjunction with semiconductor fabrication processes are provided. In some embodiments, the techniques may involve receiving data from one or more infrared sensors associated with a process station. The techniques may further involve determining infrared temperature data and/or emissivity data. The techniques may further involve determining at least one of: 1) temperature information associated with one or more components of the process station; or 2) thickness information indicating a thickness of deposited materials on components of the process station or on a surface of a substrate undergoing processing using the infrared temperature data and/or the emissivity data. The techniques may further involve determining whether the temperature information and/or the thickness information is out of a target specification. The techniques may further involve taking at least one corrective action.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:製程腔室</p>  
        <p type="p">102a,102b,102c,102d:製程站</p>  
        <p type="p">104a,104b,104c,104d:紅外線(IR)相機</p>  
        <p type="p">106:邊緣控制器</p>  
        <p type="p">108:系統控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1218" publication-number="202614689"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614689.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614689</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119712</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子零件之製造方法及剝離裝置</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND PEELING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">H05K3/32</main-classification>  
        <further-classification edition="200601120251223B">H05K3/34</further-classification>  
        <further-classification edition="200601120251223B">H05K13/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商迪睿合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柄木田充宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARAKITA, MITSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳谷洋夢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANAGIYA, HIROMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣芝泰祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIROSHIBA, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠使用貼片機（mounter）配置連接膜之電子零件之製造方法。該方法具有：剝離步驟（A1），其係使用將配置有複數個連接膜之單片的長條之第1膜自第1行進方向朝第2行進方向呈銳角回折之邊緣構件，藉由吸附噴嘴保持單片，使單片自第1膜剝離；及配置步驟（B1），其係使用吸附噴嘴，將自第1膜剝離之單片配置於配線基板。此處，邊緣構件為供給膜之單片的給料器之一部分，亦為貼片機之一部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1219" publication-number="202613864"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613864.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613864</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119728</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>從空間影像檢測微影光罩中的缺陷的方法</chinese-title>  
        <english-title>METHOD FOR DETECTING DEFECTS IN A PHOTOLITHOGRAPHY MASK FROM AN AERIAL IMAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251231B">G06F30/00</main-classification>  
        <further-classification edition="200601120251231B">G03F7/20</further-classification>  
        <further-classification edition="201701120251231B">G06T7/00</further-classification>  
        <further-classification edition="201201120251231B">G03F1/84</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　卓爾　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DRIEL, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴爾茲　比約恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARZ, BJOERN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博哈爾　伯庸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRAUER, BJOERN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法泰格　亞歷安卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FREYTAG, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗洛里區　伯庸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FROEHLICH, BJOERN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽德爾　德克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEIDEL, DIRK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案發明係有關於一種用於檢測一微影光罩（14）中的缺陷（58）的方法（60），該方法包括：i. 獲取微影光罩（14）的一空間影像（54）；ii. 取得該微影光罩（14）的一底層設計（64）；iii. 藉由解決一最佳化問題來產生所獲取的空間影像（54）的一合理設計（62），該最佳化問題最小化合理設計（62）的一模擬空間影像（72）與所獲取的空間影像（54）之間的偏差；以及iv. 藉由比較該底層設計（64）和該合理設計（62）來偵測該微影光罩（14）中的缺陷（58）。本發明也涉及一種相應的缺陷檢測系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method (60) for detecting defects (58) in a photolithography mask (14), the method comprising: i. Acquiring an aerial image (54) of the photolithography mask (14); ii. Obtaining an underlying design (64) of the photolithography mask (14); iii. Generating a plausible design (62) of the acquired aerial image (54) by solving an optimization problem that minimizes the deviation of a simulated aerial image (72) of the plausible design (62) from the acquired aerial image (54); and iv. Detecting defects (58) in the photolithography mask (14) by comparing the underlying design (64) to the plausible design (62). The invention also relates to a corresponding system for detecting defects.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">54:空間影像</p>  
        <p type="p">58:缺陷</p>  
        <p type="p">76:參數化表示</p>  
        <p type="p">82:最佳化參數表示</p>  
        <p type="p">83:過度參數化表示</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1220" publication-number="202613534"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613534.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613534</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119735</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於印刷電路板（ＰＣＢ）及半導體檢測之影像凍結</chinese-title>  
        <english-title>IMAGE FREEZING FOR PCB AND SEMICONDUCTOR INSPECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">G01N21/956</main-classification>  
        <further-classification edition="200601120251223B">H05K13/08</further-classification>  
        <further-classification edition="200601120251223B">G02B26/10</further-classification>  
        <further-classification edition="202301120251223B">H04N25/48</further-classification>  
        <further-classification edition="200601120251223B">H01L21/66</further-classification>  
        <further-classification edition="200601120251223B">G01N21/88</further-classification>  
        <further-classification edition="202101220251223B">G03B41/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商奧寶科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORBOTECH LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾德勒　艾夫拉漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADLER, AVRAHAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅森伯格　艾維諾安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROSENBERG, AVINOAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬圖索斯基　米加爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATUSOVSKY, MIKHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恩奎　亞維黑　海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANKRY, AVIHAY HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>悠格夫　羅奈恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOGEV, RONEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種系統包含一光源、一載物台、一相機及一鏡。該光源經組態以發射光。該載物台經組態以支撐一工件，且可移動以用該光跨安置於該載物台上之該工件掃描。該相機經組態以接收來自該工件之反射光，且基於在一曝光時間內接收到之該反射光擷取該工件之一影像。該鏡經組態以將該反射光引導至該相機，且以與該載物台之一速度及該相機之該曝光時間同步之一恆定速度旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The system includes a light source, a stage, a camera, and a mirror. The light source is configured to emit light. The stage is configured to support a workpiece and is movable to scan the light across the workpiece disposed on the stage. The camera is configured to receive reflected light from the workpiece and capture an image of the workpiece based on the reflected light received within an exposure time. The mirror is configured to direct the reflected light to the camera and rotate at a constant velocity that is synchronized with a velocity of the stage and the exposure time of the camera.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">101:工件</p>  
        <p type="p">105:載物台</p>  
        <p type="p">106:第一軸線</p>  
        <p type="p">110:光源</p>  
        <p type="p">111:光</p>  
        <p type="p">112:反射光</p>  
        <p type="p">120:鏡</p>  
        <p type="p">120a:平面鏡</p>  
        <p type="p">130:相機</p>  
        <p type="p">140:馬達</p>  
        <p type="p">150:處理器</p>  
        <p type="p">160:光學頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1221" publication-number="202613187"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613187.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613187</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119746</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬塗層形成用硬化性組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">C08F2/06</main-classification>  
        <further-classification edition="200601120251219B">C09D133/10</further-classification>  
        <further-classification edition="200601120251219B">C09D4/02</further-classification>  
        <further-classification edition="200601120251219B">C08F2/50</further-classification>  
        <further-classification edition="200601120251219B">B32B27/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大田政太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTA, SHOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>進藤和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINDO, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>出野柚子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDENO, YUZUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 提供一種能夠形成耐藥品性為優異的硬塗層的硬化性組成物。 &lt;br/&gt;　　[解決手段] 一種硬塗層形成用硬化性組成物，包含：(a)多官能(甲基)丙烯酸酯單體、(b)表面改質劑及(c)聚合起始劑，進而包含(d)作為至少1種溶劑的(d1)標準沸點為超過150℃且205℃以下的溶劑，其中，相對於前述(a)多官能(甲基)丙烯酸酯單體100質量份，以10質量份至150質量份來包含前述(d1)標準沸點為超過150℃且205℃以下的溶劑，相對於前述硬塗層形成用硬化性組成物100質量份，以4質量份至50質量份來包含前述(d1)標準沸點為超過150℃且205℃以下的溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1222" publication-number="202612998"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612998.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612998</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119751</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>垃圾收集車用貨櫃昇降裝置、以及具備垃圾收集車用貨櫃昇降裝置之垃圾收集車</chinese-title>  
        <english-title>CONTAINER LIFTING DEVICE FOR REFUSE COLLECTION VEHICLE, AND REFUSE COLLECTION VEHICLE EQUIPPED WITH THE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B65F3/04</main-classification>  
        <further-classification edition="200601120251229B">B65F3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商極東開發工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYOKUTO KAIHATSU KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福西政樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUNISHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之垃圾收集車用貨櫃昇降裝置，其係具備：基部，係固定於垃圾收集車；昇降機構，係安裝於基部，並且前端相對於基端進行昇降；昇降框，係藉由昇降機構而昇降；貨櫃保持部，係藉由昇降機構進行昇降；及貨櫃反轉機構，係使貨櫃保持部所保持之貨櫃傾倒；其中，貨櫃反轉機構，係具備反轉框及反轉連桿；該反轉框，係藉由從昇降機構之驅動源之驅動力，相對於昇降機構轉動；該反轉連桿，係因應與基部之連結位置及與反轉框之連結位置間之直線距離之變化，限制或允許反轉框之轉動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a container lifting device for a refuse collection vehicle, the device including: a base part fixed to the refuse collection vehicle; a lifting mechanism mounted to the base and configured to have a distal end moving up and down relative to a proximal end; a lifting frame configured to be moved up and down by the lifting mechanism; a container holding part configured to be moved up and down by the lifting mechanism; and a container reversing mechanism configured to tilt a container held by the container holding part. The container reversing mechanism includes: a reversing frame configured to be pivotally moved relative to the lifting mechanism by a driving force from a driving source of the lifting mechanism; and a reversing link configured to restrict or permit the pivotal movement of the reversing frame according to change in a linear distance between a position linked with the base part and a position linked with the reversing frame.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:基部</p>  
        <p type="p">5:昇降機構</p>  
        <p type="p">7:貨櫃保持部</p>  
        <p type="p">7A:爪</p>  
        <p type="p">8:貨櫃反轉機構</p>  
        <p type="p">9:固定部件</p>  
        <p type="p">10:連結板</p>  
        <p type="p">11:連結板</p>  
        <p type="p">15:引導部件</p>  
        <p type="p">15A:上端部</p>  
        <p type="p">16:伸縮汽缸</p>  
        <p type="p">17:防止脫落部件</p>  
        <p type="p">17A:抵接部</p>  
        <p type="p">17B:支架</p>  
        <p type="p">18:支撐部件</p>  
        <p type="p">41:管(橫軸)</p>  
        <p type="p">51:昇降臂</p>  
        <p type="p">52:昇降臂</p>  
        <p type="p">51A:臂</p>  
        <p type="p">52A:臂</p>  
        <p type="p">53:樞接部</p>  
        <p type="p">54:昇降框</p>  
        <p type="p">81:反轉框</p>  
        <p type="p">82:反轉連桿</p>  
        <p type="p">511:第一延出部</p>  
        <p type="p">512:第二延出部</p>  
        <p type="p">531:樞接部本體</p>  
        <p type="p">532:固定部</p>  
        <p type="p">541:縱部件</p>  
        <p type="p">542:第一管</p>  
        <p type="p">543:第二管</p>  
        <p type="p">544:第三管</p>  
        <p type="p">545:連結部件</p>  
        <p type="p">811:反轉框本體</p>  
        <p type="p">811A:閉塞部件</p>  
        <p type="p">811a:縱部件</p>  
        <p type="p">811b:水平板部</p>  
        <p type="p">812:垂直支架</p>  
        <p type="p">813:連結管</p>  
        <p type="p">814:墊層橡膠</p>  
        <p type="p">815:安裝部件</p>  
        <p type="p">X1:左右軸心</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1223" publication-number="202613640"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613640.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613640</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119755</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於偏轉雷射光束的光學裝置、光學系統、ＥＵＶ驅動雷射、ＥＵＶ光源產生設備，以及製造半導體中間產品或微晶片的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251220B">G02B7/195</main-classification>  
        <further-classification edition="201401120251220B">B23K26/064</further-classification>  
        <further-classification edition="200601120251220B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商創浦半導體製造雷射系統歐洲股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRUMPF LASERSYSTEMS FOR SEMICONDUCTOR MANUFACTURING SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希爾杰曼　揚　盧卡斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HILGERMANN, JAN LUKAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種用於偏轉雷射光束(30)的光學裝置(10)且包括一偏轉段(12)，該偏轉段係設計成偏轉該雷射光束(30)，其中該偏轉段(12)具有一偏轉區域(14)，該雷射光束(30)可在該偏轉區域(14)處偏轉。該光學裝置(10)亦包括在該偏轉區域(14)對面的一冷卻區域(16)，以及用於透過該冷卻區域(16)來冷卻該偏轉區域(14)的一冷卻裝置(22)。該冷卻裝置(22)包括一進氣管(17)及一排氣管(18)，藉由該進氣管可將一冷卻介質(19)供應至該冷卻區域(16)以便冷卻該偏轉區域(14)，該排氣管在該冷卻區域(16)與該進氣管(17)流體連接以使加熱後的冷卻介質(19)可透過該排氣管而從該冷卻區域(16)排出。一熱交換器(20)係配置於該進氣管(17)與該排氣管(18)之間，設計成將熱從該進氣管(17)中之冷卻介質(19)傳遞到該排氣管(18)中之冷卻介質(19)，或者將熱從該排氣管(18)中之冷卻介質(19)傳遞到該進氣管(17)中之冷卻介質(19)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光學裝置</p>  
        <p type="p">11:外殼</p>  
        <p type="p">12:偏轉段</p>  
        <p type="p">14:偏轉區域</p>  
        <p type="p">16:冷卻區域</p>  
        <p type="p">17:進氣管</p>  
        <p type="p">18:排氣管</p>  
        <p type="p">19:冷卻介質</p>  
        <p type="p">20:熱交換器</p>  
        <p type="p">22:冷卻裝置</p>  
        <p type="p">24:冷卻裝置控制單元</p>  
        <p type="p">25:溫度感測器</p>  
        <p type="p">30:雷射光束</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1224" publication-number="202613521"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613521.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613521</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119762</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於表徵半導體樣本的方法、計量單元及非暫時性電腦可讀媒體</chinese-title>  
        <english-title>METHOD FOR CHARACTERIZING A SEMICONDUCTOR SAMPLE, METROLOGY UNIT AND NON-TRANSITORY COMPUTER READABLE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251231B">G01N21/3586</main-classification>  
        <further-classification edition="200601120251231B">G01N21/63</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商諾威股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVA LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙菲爾　德羅爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAFIR, DROR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞格夫　耶爾庫茲韋爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEGEV, YAEL KURZWEIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於藉由兆赫（THz）時域光譜（TDS）表徵半導體樣本的系統和方法，該系統被配置為實現包括以下的方法：將具有一個或更多個光學泵參數的光學泵脈衝引導到樣本的區域上，從而在區域內引起瞬態變化；以相對於光學泵脈衝的受控時間延遲將兆赫（THz）探測脈衝引導到樣本的區域；從來自樣本的區域的THz探測脈衝的透射或反射來檢測THz回應訊號；以及根據THz回應訊號確定由光學泵脈衝引起的瞬態變化指示的樣本的至少一個特徵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and methods for characterizing a semiconductor sample by terahertz (THz) time-domain spectroscopy (TDS), the system configured to implement methods including: directing an optical pump pulse, having one or more optical pump parameters, onto a region of the sample, thereby inducing a transient change within the region; directing a terahertz (THz) probe pulse to the region of the sample at a controlled time delay relative to the optical pump pulse; detecting the THz response signal from the transmission or reflection of the THz probe pulse from the region of the sample; and determining from the THz response signal at least one characteristic of the sample indicated by the transient change induced by the optical pump pulse.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">110:光學泵源</p>  
        <p type="p">120:樣本</p>  
        <p type="p">130:第一分束器</p>  
        <p type="p">132:激發路徑</p>  
        <p type="p">134:觸發路徑</p>  
        <p type="p">136:泵光學器件</p>  
        <p type="p">138:光學脈衝</p>  
        <p type="p">140:第二分束器</p>  
        <p type="p">144:發射器觸發延遲線</p>  
        <p type="p">146:發射器延遲觸發THz發射器</p>  
        <p type="p">148:發射器光學器件</p>  
        <p type="p">150:脈衝</p>  
        <p type="p">154:檢測器觸發延遲線</p>  
        <p type="p">160:THz回應訊號</p>  
        <p type="p">166:THz檢測器</p>  
        <p type="p">168:檢測器光學器件</p>  
        <p type="p">170:處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1225" publication-number="202613365"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613365.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613365</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119769</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合氧化膜及其製備方法</chinese-title>  
        <english-title>COMPOSITE OXIDE FILM AND PREPARATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C25D11/04</main-classification>  
        <further-classification edition="200601120251201B">C25D11/24</further-classification>  
        <further-classification edition="200601120251201B">C25D13/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商富聯裕展科技（深圳）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FULIAN YUZHAN PRECISION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳楚輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHU-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐波玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, BO-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仲培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHUNG-PEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>覃仕輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIN, SHI-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡文瀚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, WEN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及陽極氧化技術領域，尤其涉及一種複合氧化膜及其製備方法，該製備方法包括如下步驟：對金屬工件表面進行陽極氧化處理形成氧化層；採用陰極電泳塗漆技術將改性有機矽高分子聚合物沉積在氧化層上形成沉積層，得到複合氧化膜；其中，改性有機矽高分子聚合物含有帶正電的改性環氧樹脂單元及帶負電的疏水含氟基團。本申請提供的複合氧化膜及其製備方法，採用在氧化層的表面沉積一層附著能力強，且具有疏水性能的沉積層，以提高氧化層的性能與使用壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to a field of anodizing technology, and in particular to a composite oxide film and a preparation method thereof. The preparation method comprises the following steps: performing an anodizing treatment on a surface of a metal workpiece to form an oxide layer; using cathode electrophoretic painting technology to deposit a modified organic silicon polymer on the oxide layer to form a deposition layer to obtain a composite oxide film; wherein the modified organic silicon polymer contains a positively charged modified epoxy resin unit and a negatively charged hydrophobic fluorine-containing group. The composite oxide film and the preparation method thereof provided in the present application deposit a deposition layer with strong adhesion and hydrophobic properties on the surface of the oxide layer to improve the performance and service life of the oxide layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S10~S20:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1226" publication-number="202612613"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612613.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612613</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119790</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於抽屜的配件裝置</chinese-title>  
        <english-title>ATTACHMENT DEVICE FOR A DRAWER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251230B">A47B88/00</main-classification>  
        <further-classification edition="201701120251230B">A47B88/90</further-classification>  
        <further-classification edition="201701120251230B">A47B88/969</further-classification>  
        <further-classification edition="201701120251230B">A47B88/981</further-classification>  
        <further-classification edition="201701120251230B">A47B88/988</further-classification>  
        <further-classification edition="201701120251230B">A47B88/994</further-classification>  
        <further-classification edition="201701120251230B">A47B88/925</further-classification>  
        <further-classification edition="201701120251230B">A47B88/975</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商朱利葉斯百隆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JULIUS BLUM GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯哈普特　盧卡斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLHAUPT, LUKAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈布　多明尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GABL, DOMINIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於抽屜(6)的配件裝置(9)，包括：&lt;br/&gt; -  至少一個支承裝置(10a、10b)，該至少一個支承裝置(10a、10b)用於將配件裝置(9)安置在抽屜壁(7)上，較佳安置在抽屜側壁(7a)、抽屜後壁(7c)及/或抽屜前面板(7b)上，&lt;br/&gt; -  與至少一個支承裝置(10a、10b)連接或可連接的至少一個配件框架(14)，&lt;br/&gt; 其中配件裝置(9)具有至少一個儲物容器(12)，該至少一個儲物容器(12)具有用於容納儲物的至少一個內部空間(12a)，其中儲物容器(12)藉由至少一個固定位置(15)以懸掛的方式固定或可固定在配件框架(14)上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An attachment device (9) for a drawer, comprising:&lt;br/&gt; - at least one bearing device (10a, 10b) for supporting the attachment device (9) on a drawer wall (7), preferably on a drawer sidewall (7a), on a drawer rear wall (7c) and/or on a drawer front panel (7b),&lt;br/&gt; - at least one attachment frame (14) connected or configured to be connected to the at least one bearing device (10a, 10b),&lt;br/&gt; wherein the attachment device (9) includes at least one storage container (12) having at least one interior space (12a) for receiving storage goods, the storage container (12) being fixed or being configured to be fixed to the attachment frame (14) in a hanging manner via at least one fastening location (15).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6:抽屜</p>  
        <p type="p">7:抽屜壁</p>  
        <p type="p">7a:抽屜側壁</p>  
        <p type="p">7c:抽屜後壁</p>  
        <p type="p">8:抽屜底板</p>  
        <p type="p">9:配件裝置</p>  
        <p type="p">10a:支承裝置</p>  
        <p type="p">10b:支承裝置</p>  
        <p type="p">11:保持裝置</p>  
        <p type="p">11a:支承件</p>  
        <p type="p">11b:樞轉件</p>  
        <p type="p">12:儲物容器</p>  
        <p type="p">12a:內部空間</p>  
        <p type="p">13:抽屜拉出導引裝置</p>  
        <p type="p">13a:主體導軌</p>  
        <p type="p">14:配件框架</p>  
        <p type="p">15:固定位置</p>  
        <p type="p">15a:介面</p>  
        <p type="p">15b:懸掛型材</p>  
        <p type="p">16a:銷釘</p>  
        <p type="p">16b:凹口</p>  
        <p type="p">17:緊固裝置</p>  
        <p type="p">17a:螺絲</p>  
        <p type="p">18a:垂直立柱</p>  
        <p type="p">18b:垂直立柱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1227" publication-number="202614235"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614235.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614235</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119796</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用通用參考板實現精確鍵合頭對準的半導體晶片鍵合方法及裝置</chinese-title>  
        <english-title>PRECISE BOND HEAD ALIGNMENT UTILIZING A UNIVERSAL REFERENCE PLATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/52</main-classification>  
        <further-classification edition="200601120251226B">H01L21/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商先進科技新加坡有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASMPT SINGAPORE PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧　江汶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, JIANG WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁　永康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEUNG, WING HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孔　繁熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, FAN HEI KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖　俊淇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHUN KI SAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　希嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HEI LAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱昱宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種用於將半導體晶片鍵合到表面上的鍵合位置的方法及裝置。使用夾頭拾取半導體晶片，然後將其放置在第一相機系統和第二相機系統之間。第一相機系統觀察夾頭和參考板，第二相機系統觀察半導體晶片和參考板，以確定半導體晶片相對於夾頭和參考板的位置和方向。此後，將夾頭移動到基板上的鍵合位置上方的位置，並且第一相機系統觀察鍵合位置，以便在半導體晶片鍵合到鍵合位置上之前可以調整半導體晶片的位置和方向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor die is picked up with a collet, which is then located betweenfirst and second camera systems. The first camera system views the collet anda reference plate, and the second camerasystem views the semiconductor dieand the reference plate, in order to determine a position andorientation of thesemiconductor die relative to the colletand the reference plate. Thereafter, thecollet is moved to a position above abonding position on a substrate, and thefirst camera system views the bondingposition so that the position andorientation of the semiconductor die may be adjusted before the semiconductordie is bonded onto the bonding position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:鍵合頭</p>  
        <p type="p">12:夾頭</p>  
        <p type="p">13:玻璃板</p>  
        <p type="p">14:反射表面</p>  
        <p type="p">16:半導體晶片</p>  
        <p type="p">18:通孔開口</p>  
        <p type="p">19:第二運動系統</p>  
        <p type="p">20:夾頭參考標記</p>  
        <p type="p">20’:反射</p>  
        <p type="p">22:晶片參考標記</p>  
        <p type="p">24:上視相機</p>  
        <p type="p">26:參考板</p>  
        <p type="p">28:參考板標記</p>  
        <p type="p">30:第一下視相機</p>  
        <p type="p">32:第二下視相機</p>  
        <p type="p">34:第一光路</p>  
        <p type="p">36:虛擬光路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1228" publication-number="202613284"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613284.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613284</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119803</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含可聚合化合物之液晶介質</chinese-title>  
        <english-title>LIQUID-CRYSTAL MEDIUM COMPRISING POLYMERIZABLE COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C09K19/12</main-classification>  
        <further-classification edition="200601120260102B">C09K19/42</further-classification>  
        <further-classification edition="200601120260102B">C09K19/54</further-classification>  
        <further-classification edition="200601120260102B">G02F1/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬克專利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佳昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, CHIA-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃怡華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, I-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳依雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, I-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周光廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, KUANG-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勞特　史分　克里斯丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAUT, SVEN CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛特　羅可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORTTE, ROCCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於包含一或多種可聚合化合物之LC介質(作為液晶材料之子類)、其用於光學、電光及電子目的、特別是用於LC顯示器中、尤其用於PSA (聚合物持續配向)或SA (自配向)模式之LC顯示器中之用途、包含該LC介質之該PSA或SA模式之LC顯示器及使用該LC介質製造該LC顯示器之方法、尤其節能LC顯示器及節能LC顯示器生產方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an LC medium (as a subcategory of liquid crystal material), comprising one or more polymerizable compounds, to its use for optical, electro-optical and electronic purposes, in particular in LC displays, especially in LC displays of the PSA (polymer sustained alignment) or SA (self-aligning) mode, to an LC display of the PSA or SA mode comprising the LC medium, and to a process of manufacturing the LC display using the LC medium, especially an energy-saving LC display and energy-saving LC display production process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1229" publication-number="202614212"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614212.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614212</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119809</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>容器總成、腔室配置及包括容器總成之半導體處理系統，以及製造容器總成及沉積材料層之方法</chinese-title>  
        <english-title>CONTAINER ASSEMBLIES, CHAMBER ARRANGEMENTS AND SEMICONDUCTOR PROCESSING SYSTEMS INCLUDING CONTAINER ASSEMBLIES, AND METHODS OF MAKING CONTAINER ASSEMBLIES AND DEPOSITING MATERIAL LAYERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H01L21/31</main-classification>  
        <further-classification edition="200601120251217B">C23C16/448</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇塔萊　安妮凱特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHITALE, ANIKET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高帆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王文濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WENTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇俊威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, JUNWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬明陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, MINGYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周靖誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, JINGCHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古　泰森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, TAISON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈里斯　史蒂文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARRIS, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種容器總成。該容器總成包括一槽、一導管及一護套。該槽由具有一第一熱導率之一第一材料形成，該導管安放於該槽中且與該槽之一內部連通，且該護套圍繞該槽延伸且由具有一第二熱導率之一第二材料形成。該第二熱導率大於該第一熱導率，且該護套利用一干涉配合附連至該槽，以限制對該槽與該護套之間的熱流之阻力。提供腔室配置及半導體處理系統、材料層沉積方法及製造容器總成之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A container assembly is provided. The container assembly includes a vessel, a conduit and a jacket. The vessel is formed from a first material having a first thermal conductivity, the conduit is seated in the vessel and is in communication with an interior of the vessel, and the jacket extends about the vessel and is formed from a second material having a second thermal conductivity. The second thermal conductivity is greater than the first thermal conductivity and the jacket is affixed to the vessel with an interference fit to limit resistance to heat flow between the vessel and the jacket. Chamber arrangements and semiconductor processing systems, material layer deposition methods and methods of making container assemblies are provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:容器總成</p>  
        <p type="p">302:內部</p>  
        <p type="p">304:液體前驅物</p>  
        <p type="p">310:槽</p>  
        <p type="p">312:頂部部分</p>  
        <p type="p">314:底部部分</p>  
        <p type="p">316:圓柱形主體</p>  
        <p type="p">320:護套</p>  
        <p type="p">322:頂部部分</p>  
        <p type="p">324:突出部分</p>  
        <p type="p">330:入口導管快速連接</p>  
        <p type="p">331:入口導管</p>  
        <p type="p">332:致動閥</p>  
        <p type="p">333:手動閥</p>  
        <p type="p">340:出口導管快速連接</p>  
        <p type="p">341:出口導管</p>  
        <p type="p">342:致動閥</p>  
        <p type="p">343:手動閥</p>  
        <p type="p">351:再填充導管</p>  
        <p type="p">352:致動閥</p>  
        <p type="p">353:手動閥</p>  
        <p type="p">355:致動閥</p>  
        <p type="p">360:探針構件</p>  
        <p type="p">361:溫度感測器</p>  
        <p type="p">362:溫度感測器</p>  
        <p type="p">363:液位感測器</p>  
        <p type="p">390:第二熱電熱泵</p>  
        <p type="p">392:第二散熱器</p>  
        <p type="p">472:壁厚度</p>  
        <p type="p">474:壁厚度</p>  
        <p type="p">482:第二材料</p>  
        <p type="p">484:第一材料</p>  
        <p type="p">486:干涉配合</p>  
        <p type="p">490:熱化合物</p>  
        <p type="p">494:突出部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1230" publication-number="202612652"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612652.zip"/> 
    </tif-files>  
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        <document-id> 
          <doc-number>202612652</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119815</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>醫療裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251229B">A61B5/265</main-classification>  
        <further-classification edition="202101120251229B">A61B5/259</further-classification>  
        <further-classification edition="200601120251229B">A61N1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商朋諾股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PELNOX, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大江祐輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OE, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井裕一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, YUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野上裕貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGAMI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁啟達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]本發明提供一種在衛生面優良，即使為一次性使用亦具有廢棄後處理之安全性高，且具有柔軟性的醫療裝置。&lt;br/&gt; [解決手段]本發明之一的醫療裝置100，其具備：彈性層10，其由導電性聚胺基甲酸酯組成；及第一電極層20，其包含銀、氯化銀與樹脂，其位於彈性層10之一側的第一面上的至少一部分。此外，此醫療裝置100中，電流可流入在第一電極層20的表面與彈性層10之另一側的第二面之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:彈性層</p>  
        <p type="p">14:第二面</p>  
        <p type="p">20:第一電極層</p>  
        <p type="p">100:醫療裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1231" publication-number="202614037"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614037.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614037</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119819</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>解碼聲音或音場的壓縮高階環境立體聲（ＨＯＡ）聲音表徵的方法、設備及非暫態電腦可讀儲存媒體</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR DECODING A COMPRESSED HIGHER ORDER AMBISONICS (HOA) SOUND REPRESENTATION OF A SOUND OR SOUND FIELD, AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120251212B">G10L19/008</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商杜比國際公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOLBY INTERNATIONAL AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科登　斯凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KORDON, SVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克魯格　亞歷山德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRUEGER, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文件相關於聲音或音場之壓縮聲音表徵的分層編碼方法。該壓縮聲音表徵包含基本壓縮聲音表徵，其包含複數個成分、基本側資訊，用於將該基本壓縮聲音表徵解碼成該聲音或音場的基本重構聲音表徵、及增強側資訊，包括用於改善該基本重構聲音表徵的參數。該方法包含將該複數個成分次分割為複數個成分群組並將該複數個群組各者指派至複數個分層的個別一者，該群組數目對應於該層數目，且該複數個層包括基層及一或多個增強分層、將該基本側資訊加至該基層、及從該增強側資訊決定增強側資訊的複數個部分並將增強側資訊的該複數個部分各者指派至該複數個層的個別一者，其中增強側資訊的各部分包括用於改善可從包括在該個別層及低於該個別層之任何層中的資料得到的重構聲音表徵的參數。本文件更相關於解碼聲音或音場之壓縮聲音表徵的方法，其中該壓縮聲音表徵編碼在包括基層及一或多個增強分層的複數個分層中，以及相關於用於壓縮聲音表徵之分層編碼的編碼器及解碼器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present document relates to a method of layered encoding of a compressed sound representation of a sound or sound field. The compressed sound representation comprises a basic compressed sound representation comprising a plurality of components, basic side information for decoding the basic compressed sound representation to a basic reconstructed sound representation of the sound or sound field, and enhancement side information including parameters for improving the basic reconstructed sound representation. The method comprises sub-dividing the plurality of components into a plurality of groups of components and assigning each of the plurality of groups to a respective one of a plurality of hierarchical layers, the number of groups corresponding to the number of layers, and the plurality of layers including a base layer and one or more hierarchical enhancement layers, adding the basic side information to the base layer, and determining a plurality of portions of enhancement side information from the enhancement side information and assigning each of the plurality of portions of enhancement side information to a respective one of the plurality of layers, wherein each portion of enhancement side information includes parameters for improving a reconstructed sound representation obtainable from data included in the respective layer and any layers lower than the respective layer. The document further relates to a method of decoding a compressed sound representation of a sound or sound field, wherein the compressed sound representation is encoded in a plurality of hierarchical layers that include a base layer and one or more hierarchical enhancement layers, as well as to an encoder and a decoder for layered coding of a compressed sound representation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2100:完整壓縮聲音表徵</p>  
        <p type="p">2110-1、2110-J:成分</p>  
        <p type="p">2120:獨立基本側資訊</p>  
        <p type="p">2130-1，…，2130-M:部分</p>  
        <p type="p">2140-1，…，2140-M:部分</p>  
        <p type="p">2200:基層封包</p>  
        <p type="p">2300-1、2300-(M-1):增強層封包</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1232" publication-number="202613381"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613381.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613381</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119821</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於化學機械拋光之平台表面上的處理方法</chinese-title>  
        <english-title>ON-PLATEN SURFACE-TREATMENT PROCESS FOR CHEMICAL-MECHANICAL POLISHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">D21H23/08</main-classification>  
        <further-classification edition="200601120251103B">C09G1/02</further-classification>  
        <further-classification edition="200601120251103B">C09K3/14</further-classification>  
        <further-classification edition="201201120251103B">B24B37/10</further-classification>  
        <further-classification edition="200601120251103B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商福吉米股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMI INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大西正悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONISHI, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製造半導體物件的方法，其包含： &lt;br/&gt;　　(a)使用拋光組成物在拋光平台上對物件的粗糙表面進行拋光，以獲得經拋光的表面；(b)在拋光平台上，將經拋光的表面用表面處理組成物進行處理，以獲得經處理的表面；以及(c)使用刷子清潔經處理的表面，以獲得經清潔的表面。在本方法中經拋光的表面的zeta電位與經處理的表面的zeta電位極性相反，且與經清潔的表面的zeta電位極性相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacture of a semiconductor article comprises: (a) polishing a rough surface of the article using a polishing composition on a polishing platen to yield a polished surface; (b) subjecting the polished surface to a surface-treatment composition on the polishing platen to yield a treated surface; and (c) cleaning the treated surface using a brush to yield a cleaned surface. In this method the zeta potential of the polished surface is of opposite polarity with respect to the zeta potential of the treated surface and of like polarity with respect to the zeta potential of the cleaned surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:方法</p>  
        <p type="p">242:粗糙表面</p>  
        <p type="p">244:經拋光的表面</p>  
        <p type="p">246:經處理的表面</p>  
        <p type="p">248:經清潔的表面</p>  
        <p type="p">240A:將物件附著於平台上</p>  
        <p type="p">240B:用CMP拋光粗糙表面以獲得經拋光的表面</p>  
        <p type="p">240C:將經拋光的表面用表面處理組成物處理以獲得經處理的表面</p>  
        <p type="p">240D:用刷子清潔經處理的表面以獲得經清潔的表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1233" publication-number="202613300"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613300.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613300</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119822</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>細胞培養擔體及細胞培養擔體之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C12M3/00</main-classification>  
        <further-classification edition="200601120260102B">C12N11/04</further-classification>  
        <further-classification edition="201001120260102B">C12N5/07</further-classification>  
        <further-classification edition="200601120260102B">C08F16/02</further-classification>  
        <further-classification edition="200601120260102B">C08L29/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平居佑亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林悟朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, GORO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田明士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, AKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平松慎二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAMATSU, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古川勝紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUKAWA, KATSUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小泉剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOIZUMI, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種細胞培養擔體，其係包含具有羥基之聚合物與鹵素的細胞培養擔體，細胞培養擔體之藉由X射線光電子光譜法所測定的鹵素含量為3~60原子%，25℃下的前述聚合物對磷酸緩衝生理食鹽水(PBS(‐))之飽和含有率為10~99質量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1234" publication-number="202612658"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612658.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612658</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119842</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製備骨水泥漿之混合系統的配接器以及包含配接器及混合系統之用於製備骨水泥漿的套組</chinese-title>  
        <english-title>ADAPTER FOR A MIXING SYSTEM FOR PREPARING A BONE CEMENT PASTE AND KIT FOR PREPARING A BONE CEMENT PASTE COMPRISING AN ADAPTER AND A MIXING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">A61B17/88</main-classification>  
        <further-classification edition="202201120251229B">B01F35/32</further-classification>  
        <further-classification edition="202201120251229B">B01F35/31</further-classification>  
        <further-classification edition="202201120251229B">B01F27/21</further-classification>  
        <further-classification edition="202201120251229B">B01F27/23</further-classification>  
        <further-classification edition="202201120251229B">B01F33/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商賀利氏醫療有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS MEDICAL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃特　賽巴斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VOGT, SEBASTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克魯格　湯馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLUGE, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於由兩種起始組分製備骨水泥漿之一混合系統的配接器，其包含：&lt;br/&gt;一緊固元件，其用於將該配接器可逆地緊固至該混合系統的一手柄，其中該手柄經設計以藉由該混合系統的一混合桿來混合該混合系統之一容器中的該兩種起始組分並因此製備該骨水泥漿，及&lt;br/&gt;一連接元件，其用於將該配接器可逆地連接至一電驅動裝置，&lt;br/&gt;其中該配接器經設計以在該電驅動裝置與該手柄之間建立一力傳遞連接，使得可使用該電驅動裝置來機械地操作該混合桿。&lt;br/&gt;本發明進一步係關於一種包含此一配接器及一混合系統之用於由兩種起始組分製備骨水泥漿的套組，以及一種用於藉由此一套組由兩種起始組分製備骨水泥漿的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to an adapter for a mixing system for preparing a bone cement paste from two starting components, comprising&lt;br/&gt;a fastening element for reversibly fastening the adapter to a handle of the mixing system, wherein the handle is designed to mix the two starting components in a container of the mixing system by means of a mixing rod of the mixing system and to thus prepare the bone cement paste, and&lt;br/&gt;a connecting element for reversibly connecting the adapter to an electric drive device,&lt;br/&gt;wherein the adapter is designed to establish a force-transmitting connection between the electric drive device and the handle so that the mixing rod can be mechanically operated using the electric drive device.&lt;br/&gt;The invention further relates to a kit for preparing a bone cement paste from two starting components that comprises such an adapter and a mixing system, as well as to a method for preparing a bone cement paste from two starting components by means of such a kit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:配接器</p>  
        <p type="p">110:緊固元件；收容器；緊固構件</p>  
        <p type="p">115:開口</p>  
        <p type="p">116:封閉蓋</p>  
        <p type="p">120:連接元件</p>  
        <p type="p">200:混合系統</p>  
        <p type="p">210:手柄</p>  
        <p type="p">220:容器</p>  
        <p type="p">225:內部</p>  
        <p type="p">230:混合桿</p>  
        <p type="p">235:混合元件</p>  
        <p type="p">300:套組</p>  
        <p type="p">400:電驅動裝置</p>  
        <p type="p">410:夾頭</p>  
        <p type="p">500:骨水泥粉末</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1235" publication-number="202612868"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612868.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612868</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119844</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>先進自主移動機器人</chinese-title>  
        <english-title>ADVANCED AUTONOMOUS MOBILE ROBOT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">B25J13/08</main-classification>  
        <further-classification edition="200601120251223B">B25J19/02</further-classification>  
        <further-classification edition="200601120251223B">B25J5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商史陶比爾ＷＦＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAUBLI WFT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹納　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANNER, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧佩爾杜斯　托馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OPELDUS, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博凱　休伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOCQUET, HUBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克萊德勒　卡耶坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KREDLER, CAJETAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格拉夫　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRAF, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪斯特勒　烏威　康拉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DISTLER, UWE KONRAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福爾格　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOLGER, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛拉　朱利安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LORA, JULIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種移動機器人(10)包括：一基座模組(12)，其包含用於分析環境之一感測器系統；及一控制單元，其用於依據來自該感測器系統之資訊來驅動該移動機器人(10)。該基座模組(12)包括面向地面且包括至少三個附接點(42)之一下板(22)，各附接點(42)經設計以與一各自輪單元(44)連接，各輪單元(44)包括至少一個輪(46)。該等輪單元(44)之至少一者係一電動輪單元，該電動輪單元包括至少一個馬達。該等馬達係藉由該控制單元依據來自該感測器系統之資訊進行控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The mobile robot (10) comprises a base module (12) including a sensor system for analyzing the environment, and a control unit for driving the mobile robot (10) as a function of information from the sensor system. The base module (12) comprises a lower plate (22) facing the ground and comprising at least three attachment points (42), each attachment point (42) being designed to connect with a respective wheel unit (44), each wheel unit (44) comprising at least one wheel (46). At least one of the wheel units (44) is a motorized wheel unit, which comprises at least one motor. The motors are controlled by the control unit as a function of information from the sensor system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:基座模組</p>  
        <p type="p">20:上板</p>  
        <p type="p">22:下板</p>  
        <p type="p">24:周邊主蓋</p>  
        <p type="p">26:固定插塞</p>  
        <p type="p">39:光學玻璃窗</p>  
        <p type="p">42:附接點</p>  
        <p type="p">44:輪單元</p>  
        <p type="p">46:輪</p>  
        <p type="p">68:第一連接器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1236" publication-number="202614144"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614144.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614144</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119845</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01J37/32</main-classification>  
        <further-classification edition="200601120260102B">H01L21/3065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下智紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本能吏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, TAKARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種於電漿處理裝置中提高使用感測器決定之電氣參數之精度之技術。電漿處理裝置具備：電漿處理腔室；基板支持部，其配置於電漿處理腔室內，基板支持部具有導電性基台、及配置於導電性基台上之靜電吸盤；RF電源，其經由RF傳輸線而電性連接於導電性基台；感測器，其構成為檢測RF傳輸線上之節點處之至少1個第1電氣參數；第1儲存部，其構成為儲存測定靜電吸盤之靜電電容所得之測定結果；以及控制部；且控制部構成為，基於藉由感測器檢測出之至少1個第1電氣參數及儲存於第1儲存部之靜電電容之測定結果，決定基板支持面上之基板之至少1個第2電氣參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電漿處理裝置</p>  
        <p type="p">2:控制部</p>  
        <p type="p">2a:電腦</p>  
        <p type="p">2a1:處理部</p>  
        <p type="p">2a2:記憶部</p>  
        <p type="p">2a3:通信介面</p>  
        <p type="p">10:腔室</p>  
        <p type="p">11:基板支持部</p>  
        <p type="p">12:電漿產生部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1237" publication-number="202613015"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613015.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613015</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119854</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在基板處理系統中識別及秤重載體</chinese-title>  
        <english-title>IDENTIFYING AND WEIGHING CARRIERS IN A SUBSTRATE PROCESSING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">B65G54/02</main-classification>  
        <further-classification edition="200601120251223B">H01L21/67</further-classification>  
        <further-classification edition="200601120251223B">H01L21/677</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普羅薩德　巴斯卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRASAD, BHASKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯瑞羅斯基　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BREZOCZKY, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙芬戴亞　基倫古莫妮拉珊卓拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAVANDAIAH, KIRANKUMAR NEELASANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李希特　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTER, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">系統的實施例包含外殼和設置在外殼內的膜。該膜將外殼內的第一區域與第二區域隔開。此外，該系統包含定位在第一區域中的磁懸浮致動器組件。該磁懸浮致動器組件被配置為產生延伸穿透該膜至第二區域的磁場。此外，該系統包含定位在外殼中的識別感測器。進一步地，該系統包含配置為支撐正被運輸穿過外殼的基板的載體，該載體包含唯一重量。該識別感測器被配置為偵測載體的唯一重量以識別該載體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An embodiment of a system includes a housing and a membrane positioned in the housing. The membrane isolates a first region within the housing from a second region within the housing. In addition, the system includes a magnetic levitation actuator assembly positioned in the first region. The magnetic levitation actuator assembly is configured to generate a magnetic field that extends through the membrane into the second region. Further, the system includes an identification sensor positioned in the housing. Still further, the system includes a carrier that is configured support a substrate that is being transported through the housing, the carrier including a unique weight. The identification sensor is configured to detect the unique weight of the carrier to identify the carrier.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">140:物件/基板</p>  
        <p type="p">200:部分</p>  
        <p type="p">206:膜</p>  
        <p type="p">207:第一區域</p>  
        <p type="p">208:第二區域</p>  
        <p type="p">220:框架構件</p>  
        <p type="p">230:線性定子</p>  
        <p type="p">240:磁懸浮元件</p>  
        <p type="p">250:特徵</p>  
        <p type="p">260:無特徵元件</p>  
        <p type="p">270:感測器</p>  
        <p type="p">320:腿</p>  
        <p type="p">321:腳</p>  
        <p type="p">342:基板支撐件</p>  
        <p type="p">410:外殼</p>  
        <p type="p">420:磁懸浮組件</p>  
        <p type="p">421:磁體</p>  
        <p type="p">460:卸載導軌組件</p>  
        <p type="p">460a:卸載導軌系統</p>  
        <p type="p">461:卸載導軌</p>  
        <p type="p">462:主體</p>  
        <p type="p">463:內部開口</p>  
        <p type="p">465:位置感測器</p>  
        <p type="p">700:站</p>  
        <p type="p">701:重量感測器</p>  
        <p type="p">701A:一個重量感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1238" publication-number="202614888"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614888.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614888</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119856</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光半導體元件密封用片材及光半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251230B">H10H20/854</main-classification>  
        <further-classification edition="200601120251230B">H01L23/29</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河野顕志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONO, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田直子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, NAOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤友二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中俊平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, SHUMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種於已將光半導體元件密封時光提取效率優異之光半導體元件密封用片材。 &lt;br/&gt;光半導體元件密封用片材1係用以密封配置於基板5上之1個以上光半導體元件6之片材。光半導體元件密封用片材1具備至少包含硬化性樹脂層(X)21之密封用樹脂層2。硬化性樹脂層(X)21含有硬化性樹脂及白色粒子，且140℃下之熔融黏度為20000 Pa·s以下。硬化性樹脂層21係於密封光半導體元件6時與光半導體元件6接觸之層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光半導體元件密封用片材</p>  
        <p type="p">2:密封用樹脂層</p>  
        <p type="p">3:剝離襯墊</p>  
        <p type="p">4:基材部</p>  
        <p type="p">21:硬化性樹脂層(X)</p>  
        <p type="p">22:著色層</p>  
        <p type="p">41:基材膜</p>  
        <p type="p">42:功能層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1239" publication-number="202612627"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612627.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612627</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119894</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>真空吸塵器</chinese-title>  
        <english-title>VACUUM CLEANER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">A47L5/24</main-classification>  
        <further-classification edition="200601120251230B">A47L9/10</further-classification>  
        <further-classification edition="200601120251230B">A47L9/12</further-classification>  
        <further-classification edition="200601120251230B">A47L9/28</further-classification>  
        <further-classification edition="200601120251230B">A47L9/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商格雷技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREY TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格雷　尼古拉斯　格蘭德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREY, NICHOLAS GERALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種真空吸塵器，尤其關於一種不利用氣旋分離或過濾的手持式無袋真空吸塵器。該真空吸塵器具有包含馬達、葉輪、集塵室和過濾器的主體。該過濾器的面積藉由跨越其第一端與第二端之間的主體以及跨越側壁的相對部分之間的主體來增加。該過濾器將主體分成兩個限定區域，第一區域包含集塵室中的集塵容積，而第二區域包含馬達和葉輪。該真空吸塵器還具有攪拌器，其配置以清除過濾器中的污垢。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to a vacuum cleaner, and in particular to a hand-held bagless vacuum cleaner which does not utilise cyclonic separation or filtration. The vacuum cleaner has a body containing a motor, an impeller, a dirt-collection chamber and a filter. The area of the filter is increased by substantially spanning the body between its first end and second ends and by substantially spanning the body between opposing parts of the side wall. The filter separates the body into two defined regions, a first region comprising a dirt-collection volume in the dirt-collection chamber and a second region containing the motor and the impeller. The vacuum cleaner also has an agitator configured to dislodge dirt from the filter.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">32:進氣口</p>  
        <p type="p">36:第一收集容積</p>  
        <p type="p">42:主過濾器</p>  
        <p type="p">44:副過濾器</p>  
        <p type="p">46:氣隙、第二收集容積</p>  
        <p type="p">48:氣隙</p>  
        <p type="p">50:彈簧閂</p>  
        <p type="p">52:板</p>  
        <p type="p">54:滑動板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1240" publication-number="202613079"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613079.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613079</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119896</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>喹啉甲醯胺化合物的固體形式</chinese-title>  
        <english-title>SOLID FORM OF A QUINOLINE CARBOXAMIDE COMPOUND</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D215/54</main-classification>  
        <further-classification edition="200601120260102B">A01N43/42</further-classification>  
        <further-classification edition="200601120260102B">A01N25/04</further-classification>  
        <further-classification edition="200601120260102B">A01P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商先正達農作物保護股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYNGENTA CROP PROTECTION AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>基特斯　亞當</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEATES, ADAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONE, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於具有式I的化合物的外消旋結晶形式， &lt;br/&gt;&lt;img align="absmiddle" height="203px" width="293px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;該外消旋結晶形式具有以下粉末X射線衍射圖，該粉末X射線衍射圖包括選自由以下組成之群組的至少三個2θ角值：8.0 ± 0.2°、8.4 ± 0.2°、10.0 ± 0.2°、10.6 ± 0.2°、10.8 ± 0.2°、11.9 ± 0.2°、13.2 ± 0.2°、14.2 ± 0.2°、15.2 ± 0.2°、15.3 ± 0.2°、16.0 ± 0.2°、16.5 ± 0.2°、17.0 ± 0.2°、17.6 ± 0.2°和17.9 ± 0.2°。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a racemic crystalline form of the compound of formula I &lt;br/&gt;&lt;img align="absmiddle" height="199px" width="291px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;  &lt;br/&gt;which has a powder X-ray diffraction pattern comprising at least three 2θ angle values selected from the group consisting of 8.0 ± 0.2°, 8.4 ± 0.2°, 10.0 ± 0.2°, 10.6 ± 0.2°, 10.8 ± 0.2°, 11.9 ± 0.2°, 13.2 ± 0.2°, 14.2 ± 0.2°, 15.2 ± 0.2°, 15.3 ± 0.2°, 16.0 ± 0.2°, 16.5 ± 0.2°, 17.0 ± 0.2°, 17.6 ± 0.2°, and 17.9 ± 0.2°.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1241" publication-number="202612860"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612860.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612860</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119913</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>手的接近方法、機器人系統以及機器人控制程序</chinese-title>  
        <english-title>HAND ACCESS METHOD, ROBOT SYSTEM AND CONTROL PROGRAM FOR ROBOT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251220B">B25J9/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福井将司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUI, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡朋暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKA, TOMOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBO, HITOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>榎本和馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENOMOTO, KAZUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大谷夏樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTANI, NATSUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於手的接近方法，其在多個電纜的組存在的狀況下，使手向適配器的接近較容易。手的接近方法包括使手(10)移動到從適配器軸(M)向與適配器軸(M)交叉的方向離開且關於適配器軸(M)的方向從適配器(91)離開的偏移位置的步驟，使手(10)以從偏移位置接近於適配器軸(M)的方式移動、且使手(10)移動到關於適配器軸(M)的方向從適配器(91)離開且與適配器(91)在適配器軸(M)的方向對向的對向位置的步驟以及使手(10)從對向位置在適配器軸(M)的方向移動到適配器(91)的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a hand access method that makes it easier for accessing an adapter in a hand in the presence of multiple groups of cables. The hand access method includes: a step of moving a hand (10) to an offset position away from an adapter axis (M) in a direction intersecting the adapter axis (M) and away from an adapter (91) in the direction of the adapter axis (M); a step of moving the hand (10) from the offset position towards the adapter axis (M) so that the hand (10) is moved to an opposing position away from the adapter (91) in the direction of the adapter axis (M) and opposing the adapter (91) in the direction of the adapter axis (M); and a step of moving the hand (10) from the opposing position to the adapter (91) in the direction of the adapter axis (M).</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1242" publication-number="202614682"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614682.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614682</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119918</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>撓性電路板、包括撓性電路板之ＣＯＦ模組及電子裝置</chinese-title>  
        <english-title>FLEXIBLE CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE INCLUDING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">H05K1/11</main-classification>  
        <further-classification edition="200601120251223B">H05K1/14</further-classification>  
        <further-classification edition="200601120251223B">H05K1/18</further-classification>  
        <further-classification edition="200601120251223B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李旼奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MINKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓相緡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, SANGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全世美娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, SEMINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兪大成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, DAESUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據一實施例之一種撓性電路板包括：一基體；一第一佈線圖案部分，其安置於該基體上；以及一保護層，其安置於該第一佈線圖案部分上且包括一敞開區，其中該第一佈線圖案部分包括一第一-第一佈線圖案部分，該第一-第一佈線圖案部分包括安置於該敞開區中之複數個第一墊，該複數個第一墊包括交替地安置之一第一-第一墊及一第一-第二墊，該第一-第一墊之一尖端與該第一-第二墊之一尖端不在同一條線上對準，該第一-第一墊包括與該第一-第一墊之該尖端相鄰之一第一接合部分及自該第一接合部分延伸之一第一延伸部分，且該第一接合部分之一寬度大於該第一延伸部分之一寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flexible circuit board according to an embodiment includes a substrate; a first wiring pattern part disposed on the substrate; and a protective layer disposed on the first wiring pattern part and including an open region, wherein the first wiring pattern part includes a first-first wiring pattern part including a plurality of first pads disposed in the open region, the plurality of first pads include a first-first pad and a first-second pad that are alternately disposed, a tip end of the first-first pad and a tip end of the first-second pad are not aligned on a same line, the first-first pad includes a first bonding part adjacent to the tip end of the first-first pad, and a first extension part extending from the first bonding part, and a width of the first bonding part is greater than a width of the first extension part.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基體</p>  
        <p type="p">800:保護層</p>  
        <p type="p">1000:撓性電路板</p>  
        <p type="p">1D:第一方向</p>  
        <p type="p">210P1:第一墊</p>  
        <p type="p">210P2:第二墊</p>  
        <p type="p">210T:第一連接圖案</p>  
        <p type="p">220P1:第三墊</p>  
        <p type="p">220P2:第四墊</p>  
        <p type="p">220T:第二連接圖案</p>  
        <p type="p">2D:第二水平方向</p>  
        <p type="p">310P1:第五墊</p>  
        <p type="p">310P2:第六墊</p>  
        <p type="p">310T:第五墊</p>  
        <p type="p">320P1:第五墊</p>  
        <p type="p">320P2:第六墊</p>  
        <p type="p">320T:第三連接佈線</p>  
        <p type="p">400P1:第七墊</p>  
        <p type="p">400P2:第八墊</p>  
        <p type="p">400T:第四連接佈線/連接圖案</p>  
        <p type="p">510P:第九墊</p>  
        <p type="p">510T:第五連接佈線</p>  
        <p type="p">520P:第九墊</p>  
        <p type="p">520T:第五連接佈線</p>  
        <p type="p">530P:第九墊</p>  
        <p type="p">530T:第五連接佈線</p>  
        <p type="p">600P:第十墊</p>  
        <p type="p">600T:連接圖案</p>  
        <p type="p">700P:第十一墊</p>  
        <p type="p">700T:連接圖案</p>  
        <p type="p">CHA:晶片安裝區/晶片安裝區域</p>  
        <p type="p">OR:第一敞開區/敞開區</p>  
        <p type="p">R1:第一區</p>  
        <p type="p">R2:第二區</p>  
        <p type="p">R3:第三區</p>  
        <p type="p">R5:第五區</p>  
        <p type="p">R6:第六區</p>  
        <p type="p">R7:第七區</p>  
        <p type="p">R8:第八區</p>  
        <p type="p">SH:鏈輪孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1243" publication-number="202613025"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613025.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613025</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119921</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>奈米管膜、防護膜、防護薄膜、曝光原版、曝光裝置、奈米管膜的製造方法及曝光用奈米管膜的評價方法</chinese-title>  
        <english-title>NANOTUBE FILM, PELLICLE FILM, PELLICLE, ORIGINAL PLATE FOR EXPOSURE, EXPOSURE APPARATUS, METHOD FOR PRODUCING NANOTUBE FILM AND METHOD FOR EVALUATING NANOTUBE FILM FOR EXPOSURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260102B">C01B32/158</main-classification>  
        <further-classification edition="201201120260102B">G03F1/22</further-classification>  
        <further-classification edition="201201120260102B">G03F1/62</further-classification>  
        <further-classification edition="201201120260102B">G03F1/84</further-classification>  
        <further-classification edition="200601120260102B">G01N21/956</further-classification>  
        <further-classification edition="201801120260102B">G01N23/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>百瀬悠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOMOSE, HARUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小野陽介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川比佐子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, HISAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示的奈米管膜是包含多個奈米管的奈米管膜。斑點的總面積相對於所述奈米管膜的主表面的面積的比例為7.00×10&lt;sup&gt;-4&lt;/sup&gt;%以下。所述斑點於所述奈米管膜的主表面的光學顯微鏡的觀察圖像中，具有基準亮度的80%以下的亮度，且具有50 μm&lt;sup&gt;2&lt;/sup&gt;以上的面積。所述觀察圖像的一個像素的尺寸為1.0 μm～2.0 μm×1.0 μm～2.0 μm。所述基準亮度由下述式（1）表示。 &lt;br/&gt;式（1）：基準亮度=所述奈米管膜的主表面的整個面的亮度的平均值+1×所述奈米管膜的主表面的整個面的亮度的標準偏差σ的高度的亮度</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1244" publication-number="202614496"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614496.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614496</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119959</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電連接器組合</chinese-title>  
        <english-title>ELECTRICAL CONNECTOR ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251231B">H01R12/75</main-classification>  
        <further-classification edition="201101120251231B">H01R12/70</further-classification>  
        <further-classification edition="201101120251231B">H01R12/71</further-classification>  
        <further-classification edition="200601120251231B">H01R13/24</further-classification>  
        <further-classification edition="200601120251231B">H01R13/627</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹姆士　Ｍ　塞博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAMES M, SABO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電連接器組合，包括插頭連接器以及與所述插頭連接器對接的插座連接器，所述插頭連接器包括插頭本體、收容於所述插頭本體內的插頭端子以及與所述插頭端子連接的線纜，所述插座連接器包括插座本體以及收容於所述插座本體內的插座端子，所述插座端子包括U型部，所述U型部包括安裝於一電路板的基部、自所述基部兩側向上延伸的一對側板部，所述側板部與所述插頭端子抵接，兩所述側板部朝遠離彼此的方向彎折延伸有彎折部，所述彎折部繼續向下延伸有安裝至所述電路板的固持部，以穩定插頭及插座連接器的對接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical connector assembly includes a plug connector and a receptacle connector that mates with the plug connector. The plug connector comprises a plug housing, a plug terminal retained in the plug housing, and a cable connected to the plug terminal. The receptacle connector includes a receptacle housing and a receptacle terminal secured in the receptacle housing. The receptacle terminal includes a U-shaped portion including a base mounted on a circuit board, and a pair of side plates extending upward from both sides of the base. The side plates abut against the plug terminal. Each of the side plates has a bend extending away from each other, and the bend further extends downward to form a holding portion that is mounted to the circuit board to stabilize the mating of the plug and receptacle connectors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:插頭連接器</p>  
        <p type="p">200:印刷電路板</p>  
        <p type="p">50:插座連接器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1245" publication-number="202614497"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614497.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614497</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119970</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具主動元件之可插式模組</chinese-title>  
        <english-title>PLUGGABLE MODULE HAVING AN ACTIVE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251226B">H01R12/78</main-classification>  
        <further-classification edition="200601120251226B">G02B6/42</further-classification>  
        <further-classification edition="201101120251226B">H01R12/71</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商太谷康奈特提威提索洛訊有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TE CONNECTIVITY SOLUTIONS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡斯特洛　布萊恩　派翠克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COSTELLO, BRIAN PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於一可插式模組(200)的電路板組件(250)，包含上和下介面印刷電路板(300、400)，其分別包含第一和第二資料通道(252、254)。介面印刷電路板於其對應的配接邊緣(320、420)處包含配接焊墊(322、422)，形成資料通道的部分且係配置以插入對應的卡緣連接器(180、182)中。電路板組件包含一主要印刷電路板(500)，其包含電連接至該第一和第二資料通道、恢復沿著所述資料通道傳輸之訊號的一主動元件(550)。電路板組件包含上和下可撓性電路(600、700)，其連接於所述介面印刷電路板和該主要印刷電路板之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A circuit board assembly (250) for a pluggable module (200) includes upper and lower interface printed circuit boards (300, 400) that includes first and second data channels (252, 254), respectively. The interface printed circuit boards includes mating pads (322, 422) at corresponding mating edges (320, 420) thereof forming portions of the data channels and configured to be plugged into corresponding card edge connectors (180, 182). The circuit board assembly includes a main printed circuit board (500) that includes an active device (550) electrically connected to the first and second data channels restoring signals transmitting along the data channels. The circuit board assembly includes upper and lower flexible circuits (600, 700) connected between the interface printed circuit boards and the main printed circuit board.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:可插式模組</p>  
        <p type="p">250:電路板組件</p>  
        <p type="p">252:第一資料通道/資料通道</p>  
        <p type="p">254:第二資料通道/資料通道</p>  
        <p type="p">256:第三資料通道/資料通道</p>  
        <p type="p">258:第四資料通道/資料通道</p>  
        <p type="p">260:纜線組件</p>  
        <p type="p">262:纜線</p>  
        <p type="p">290:主動模組</p>  
        <p type="p">300:上介面印刷電路板/剛性電路板</p>  
        <p type="p">310:剛性基板</p>  
        <p type="p">312:前部</p>  
        <p type="p">314:後部</p>  
        <p type="p">316:內表面</p>  
        <p type="p">318:外表面</p>  
        <p type="p">320:上配接邊緣</p>  
        <p type="p">322:上焊接焊墊</p>  
        <p type="p">400:下介面印刷電路板/剛性電路板</p>  
        <p type="p">410:剛性基板</p>  
        <p type="p">412:前部</p>  
        <p type="p">414:後部</p>  
        <p type="p">416:內表面</p>  
        <p type="p">418:外表面</p>  
        <p type="p">420:下配接邊緣</p>  
        <p type="p">422:下配接焊墊</p>  
        <p type="p">500:主要印刷電路板/剛性電路板</p>  
        <p type="p">510:剛性基板</p>  
        <p type="p">512:前部</p>  
        <p type="p">514:後部</p>  
        <p type="p">516:上表面</p>  
        <p type="p">518:下表面</p>  
        <p type="p">522:第一導體/導體</p>  
        <p type="p">524:第二導體/導體</p>  
        <p type="p">526:第三導體/導體</p>  
        <p type="p">528:第四導體/導體</p>  
        <p type="p">550:主動元件</p>  
        <p type="p">552:安裝區</p>  
        <p type="p">560:中繼器元件</p>  
        <p type="p">600:上可撓性電路</p>  
        <p type="p">610:可撓性基板</p>  
        <p type="p">620:導體</p>  
        <p type="p">700:下可撓性電路/可撓性電路</p>  
        <p type="p">720:導體</p>  
        <p type="p">800:上纜線印刷電路板/纜線印刷電路板/剛性電路板</p>  
        <p type="p">810:剛性基板</p>  
        <p type="p">812:前部</p>  
        <p type="p">814:後部</p>  
        <p type="p">816:內表面</p>  
        <p type="p">818:外表面</p>  
        <p type="p">820:上端接區</p>  
        <p type="p">822:上纜線焊墊</p>  
        <p type="p">900:下纜線印刷電路板/纜線印刷電路板/剛性電路板</p>  
        <p type="p">910:剛性基板</p>  
        <p type="p">912:前部</p>  
        <p type="p">914:後部</p>  
        <p type="p">916:內表面</p>  
        <p type="p">918:外表面</p>  
        <p type="p">922:下纜線焊墊</p>  
        <p type="p">1000:上可撓性電路/可撓性電路</p>  
        <p type="p">1010:可撓性基板</p>  
        <p type="p">1100:下可撓性電路/可撓性電路</p>  
        <p type="p">1110:可撓性基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1246" publication-number="202613969"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613969.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613969</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119974</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對象部分檢測裝置及移行台車</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251231B">G06T7/00</main-classification>  
        <further-classification edition="202401120251231B">G05D1/244</further-classification>  
        <further-classification edition="202401120251231B">G05D1/43</further-classification>  
        <further-classification edition="200601120251231B">G06T1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MACHINERY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本將吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, SHOGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之對象部分檢測裝置(41)係檢測在藉由攝影裝置(8)被攝影的攝影影像(IM)中所包含的四角形狀之對象部分。對象部分檢測裝置(41)具備有：分割部(49)，其將攝影影像(IM)分割成複數個區塊(M)；複數個運算部(41C)，其等被設為對應於複數個區塊(M)之各者，並可分別獨立地執行所對應之在區塊(M)中的影像處理；及檢測部(45)，其根據藉由複數個運算部(41C)所產生之運算結果，以檢測在攝影影像(IM)中所包含的對象部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6:高架移行車(移行台車)、移行車</p>  
        <p type="p">6A:前方移行車</p>  
        <p type="p">6B:後方移行車</p>  
        <p type="p">8:攝影裝置</p>  
        <p type="p">20:移行部</p>  
        <p type="p">40:控制器</p>  
        <p type="p">41:對象部分檢測裝置</p>  
        <p type="p">41A:輸入處理部</p>  
        <p type="p">41B:記憶處理部(記憶部)</p>  
        <p type="p">41C:運算處理部(運算部)</p>  
        <p type="p">41D:輸出處理部</p>  
        <p type="p">41E:記憶裝置(記憶部)</p>  
        <p type="p">43:擷取部</p>  
        <p type="p">45:檢測部</p>  
        <p type="p">47:製作部</p>  
        <p type="p">49:分割部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1247" publication-number="202614179"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614179.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614179</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114119994</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>調諧沉積選擇性</chinese-title>  
        <english-title>TUNING DEPOSITION SELECTIVITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/285</main-classification>  
        <further-classification edition="200601120251226B">C23C16/14</further-classification>  
        <further-classification edition="200601120251226B">H01L21/768</further-classification>  
        <further-classification edition="200601120251226B">C23C16/509</further-classification>  
        <further-classification edition="200601120251226B">C23C16/04</further-classification>  
        <further-classification edition="200601120251226B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬一揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAN, YIYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金允浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YUNHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張書錨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SHUMAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智勛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉偉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, WEIFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂　疆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, JIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例提供一種方法，包括從源RF產生器向處理腔室的電極發送脈衝射頻(RF)訊號。在處理腔室的處理區域中根據脈衝RF訊號形成電漿。該電漿設置於電極與基板之間。脈衝RF訊號的工作週期設置在5%至15%的範圍中。脈衝RF訊號的關閉時間設置在50至250微秒的範圍中。根據工作週期和關閉時間在基板的第二材料和基板的第三材料上沉積第一材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the disclosure provide a method that includes delivering a pulsed radio frequency (RF) signal from a source RF generator to an electrode of a processing chamber. A plasma is formed in a processing region of the processing chamber based on the pulsed RF signal. The plasma is disposed between the electrode and a substrate. The pulsed RF signal is caused to have a duty cycle in a range of 5 to 15 percent. The pulsed RF signal is caused to have an off-time in a range of 50 to 250 microseconds. A first material is deposited on a second material of the substrate and a third material of the substrate based on the duty cycle and the off-time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">702:週期</p>  
        <p type="p">703:切斷小部分</p>  
        <p type="p">704:切斷小部分</p>  
        <p type="p">705:切斷小部分</p>  
        <p type="p">706:切斷小部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1248" publication-number="202614252"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614252.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614252</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120003</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在結構上執行三維計量之方法</chinese-title>  
        <english-title>METHODS OF PERFORMING 3D METROLOGY ON A STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/66</main-classification>  
        <further-classification edition="200601120251226B">H01J37/28</further-classification>  
        <further-classification edition="200601120251226B">G01C1/00</further-classification>  
        <further-classification edition="200601120251226B">G01B15/04</further-classification>  
        <further-classification edition="201701120251226B">G06T7/60</further-classification>  
        <further-classification edition="201801120251226B">G01N23/2251</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫昱坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YUKUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種在一結構上執行3D計量之方法包含：將一電子束引導至該結構之一表面上；以一第一著陸角擷取該結構之一第一組影像；以一第二著陸角擷取該結構之一第二組影像，該第二著陸角不同於該第一著陸角；及藉由將該第一組影像與該第二組影像進行比較而判定該結構之至少一個3D參數。在該電子束跨該結構之該表面之一單次運行中擷取處於該第一著陸角之該第一組影像及處於該第二著陸角之該第二組影像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of performing 3D metrology on a structure includes directing an electron beam onto a surface of the structure, capturing a first set of images of the structure at a first landing angle, capturing a second set of images of the structure at a second landing angle, the second landing angle being different from the first landing angle, and determining, by comparing the first set of images to the second set of images, at least one 3D parameter of the structure. The first set of images at the first landing angle and the second set of images at the second landing angle are captured in a single run of the electron beam across the surface of the structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:結構</p>  
        <p type="p">12:表面</p>  
        <p type="p">14:基底</p>  
        <p type="p">20:接觸孔</p>  
        <p type="p">22:近端開口</p>  
        <p type="p">24:遠端開口</p>  
        <p type="p">D&lt;sub&gt;do&lt;/sub&gt;:遠端開口直徑</p>  
        <p type="p">D&lt;sub&gt;h&lt;/sub&gt;:孔深度</p>  
        <p type="p">D&lt;sub&gt;po&lt;/sub&gt;:近端開口直徑</p>  
        <p type="p">H&lt;sub&gt;s&lt;/sub&gt;:結構高度</p>  
        <p type="p">W&lt;sub&gt;s&lt;/sub&gt;:結構寬度</p>  
        <p type="p">Θ&lt;sub&gt;ch&lt;/sub&gt;:傾斜角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1249" publication-number="202614050"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614050.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614050</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120014</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於讀取優化的3D　NOR記憶體的系統、方法和設備</chinese-title>  
        <english-title>SYSTEM, METHOD, AND APPARATUS FOR READ OPTIMIZED 3D NOR MEMORY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G11C11/22</main-classification>  
        <further-classification edition="200601120260102B">G11C11/56</further-classification>  
        <further-classification edition="202301120260102B">H10B51/20</further-classification>  
        <further-classification edition="202301120260102B">H10B51/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商慧盛材料美國責任有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERSUM MATERIALS US, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆昆德　斯里達爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKUND, SHRIDHAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德廷格　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DERTINGER, STEPHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩哈伊　舒巴姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAHAY, SHUBHAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳展俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種積體電路裝置，其包含分為不同的位元線組和選擇線組的多個垂直結構。每個垂直結構包括一絕緣垂直插塞柱，由相鄰的源極和汲極電極柱圍繞著，以及一通道柱環繞這些元件。此外，一鐵電柱包裹在該通道柱周圍，有助於該裝置的功能。該架構亦積體化若干個水平閘極電極層，每個水平閘極電極層彼此之間以一特定的垂直間隔設置並鄰近該等垂直結構。該裝置包括一組的位元線，每個位元線連結到一相應的位元線組的一源極電極柱，以及一組的選擇線，每個選擇線連接到一相應的選擇線組的一汲極電極柱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit device is disclosed that comprises multiple vertical structures categorized into distinct bit-line and select-line groups. Each vertical structure includes an insulating vertical-plug column, surrounded by adjacent source and drain electrode columns, and a channel column encircling these components. Additionally, a ferroelectric column is wrapped around the channel column, contributing to the device's functionality. The architecture also integrates several horizontal gate-electrode layers, each positioned at a specific vertical interval from one another and adjacent to the vertical structures. The device includes a set of bit lines, each linked to a source electrode column of a corresponding bit-line group, and a set of select lines, each connected to a drain electrode column of a corresponding select-line group.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:積體電路裝置</p>  
        <p type="p">502:位元線陣列</p>  
        <p type="p">502a,502b,502m:位元線</p>  
        <p type="p">BL&lt;sub&gt;1&lt;/sub&gt;,BL&lt;sub&gt;2&lt;/sub&gt;,BL&lt;sub&gt;M&lt;/sub&gt;:位元線</p>  
        <p type="p">504:選擇線陣列</p>  
        <p type="p">504a,504b,504n:選擇線</p>  
        <p type="p">SL&lt;sub&gt;1&lt;/sub&gt;,SL&lt;sub&gt;2&lt;/sub&gt;,SL&lt;sub&gt;N&lt;/sub&gt;:選擇線</p>  
        <p type="p">506:源極選擇線電晶體</p>  
        <p type="p">506a,506b,506n:源極選擇線電晶體</p>  
        <p type="p">SSL&lt;sub&gt;1&lt;/sub&gt;,SSL&lt;sub&gt;2&lt;/sub&gt;,SSL&lt;sub&gt;N&lt;/sub&gt;:源極選擇線電晶體</p>  
        <p type="p">508:字線</p>  
        <p type="p">508a,508b,508p:字線</p>  
        <p type="p">WL&lt;sub&gt;1&lt;/sub&gt;,WL&lt;sub&gt;2&lt;/sub&gt;,WL&lt;sub&gt;P&lt;/sub&gt;:字線(水平閘極電極層)</p>  
        <p type="p">510:垂直結構</p>  
        <p type="p">510a,a,510n,a,510n,m:垂直結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1250" publication-number="202613295"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613295.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613295</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120024</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於耦合至細胞處理容器之介面</chinese-title>  
        <english-title>AN INTERFACE FOR COUPLING TO A CELL PROCESSING CONTAINER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C12M1/00</main-classification>  
        <further-classification edition="200601120251229B">C12M1/26</further-classification>  
        <further-classification edition="200601120251229B">C12M1/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商奧瑞生物技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORIBIOTECH LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賓恩　德瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEAN, DEREK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕特爾　漢札</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATEL, HAMZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛克　約書亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENKER, JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米恩　思圖雅特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILNE, STUART</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於耦合至具有用於容納細胞懸浮液之內部體積之細胞處理容器的介面，該介面能夠在該細胞處理容器內進行材料取樣。特定言之，該介面包括經組態成允許樣本排出之埠、及自該埠延伸出以便在使用期間位於該細胞處理容器之該內部體積內且能夠自其取出樣本之導管。該導管具有經組態成在該取樣過程期間最小化或減輕細胞聚結之內孔及/或入口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided an interface for coupling to a cell processing container having an internal volume for holding a cell suspension, the interface enabling sampling of material within he cell processing container. In particular, the interface includes a port configured to allow egress of a sample, and a conduit extending from said port so as to be located within the internal volume of the cell processing container and able to take a sample therefrom during use. The conduit has an internal bore and/or an inlet configured to minimise or mitigate agglomeration of cells during the sampling process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:生物反應器</p>  
        <p type="p">12:容器</p>  
        <p type="p">13:介面板</p>  
        <p type="p">14:擴展容器</p>  
        <p type="p">15:底壁/基底部分</p>  
        <p type="p">16a:向內摺疊</p>  
        <p type="p">16b:向外摺疊</p>  
        <p type="p">17:頂部部分</p>  
        <p type="p">21:埠</p>  
        <p type="p">22:擋板</p>  
        <p type="p">23:可壓縮壁</p>  
        <p type="p">24:擋板構件</p>  
        <p type="p">25:實質平坦底表面</p>  
        <p type="p">26:錐形上表面</p>  
        <p type="p">27:安裝部分</p>  
        <p type="p">28:取樣管</p>  
        <p type="p">29:材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1251" publication-number="202614331"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614331.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614331</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120029</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/68</main-classification>  
        <further-classification edition="200601120251226B">H01L21/67</further-classification>  
        <further-classification edition="201701120251226B">G06T7/60</further-classification>  
        <further-classification edition="200601120251226B">G06F17/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊木敬一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAIKI, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]精度佳地測量被形成在基板上的缺口部的頂點位置。 &lt;br/&gt;　　[解決手段]基板處理裝置具備保持部、攝像部和畫像處理部。畫像處理部進行：第1處理，其係根據基板之外周緣的畫像，計算基板之中心位置；第2處理，其係從基板之外周緣的畫像，檢測沿著位於基板之缺口部的凹部的凹部曲線；第3處理，其係將以該中心位置為中心在給定的角度範圍內旋轉後的複數凹部曲線，分別以2次曲線近似；第4處理，其係從給定的角度範圍之中，提取凹部曲線和2次曲線最近似的角度；第5處理，其係針對以被提取後的角度旋轉後的凹部曲線，計算成為最近似的2次曲線之極值的極值位置；以及第6處理，其係使計算出的極值位置，以該中心位置為中心並以在第4處理中被提取後的角度，朝與第5處理相反方向旋轉，將旋轉後的極值位置設定為缺口部的頂點位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1252" publication-number="202614189"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614189.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614189</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120041</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/302</main-classification>  
        <further-classification edition="200601120251226B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淺田泰生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASADA, YASUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑嶋亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUWAJIMA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢野琴音</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANO, KOTONE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">就各台座分別對多個台座所載置的基板獨立進行處理。 &lt;br/&gt;  一種基板處理裝置，係處理基板，具有：腔室，係收容該基板；多個台座，係在該腔室內載置該基板；以及昇降機構，係使該多個台座就各台座分別獨立昇降。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:晶圓處理裝置</p>  
        <p type="p">10:腔室</p>  
        <p type="p">11a,11b:載置台</p>  
        <p type="p">12a,12b:昇降機構</p>  
        <p type="p">13:氣體供給部</p>  
        <p type="p">14a,14b:內壁</p>  
        <p type="p">15:分隔壁</p>  
        <p type="p">16:昇降機構</p>  
        <p type="p">17:排氣部</p>  
        <p type="p">20:側壁</p>  
        <p type="p">21:頂板</p>  
        <p type="p">22:底板</p>  
        <p type="p">30a,30b:台座</p>  
        <p type="p">31a,31b:支撐部</p>  
        <p type="p">32a,32b:溫度調節機構</p>  
        <p type="p">33a,33b:加熱器</p>  
        <p type="p">34a,34b:流道</p>  
        <p type="p">40a,40b:驅動部</p>  
        <p type="p">41a,41b:驅動軸</p>  
        <p type="p">42a,42b:波紋管</p>  
        <p type="p">50:噴淋頭</p>  
        <p type="p">51:框體</p>  
        <p type="p">52:噴淋板</p>  
        <p type="p">53:空間</p>  
        <p type="p">54:開口</p>  
        <p type="p">55:氣體供給管</p>  
        <p type="p">56:氣體供給源</p>  
        <p type="p">57:流量調節機構</p>  
        <p type="p">60a,60b:本體部</p>  
        <p type="p">61a,61b:突緣部</p>  
        <p type="p">70a,70b:圓筒部</p>  
        <p type="p">71:上突緣部</p>  
        <p type="p">72:下突緣部</p>  
        <p type="p">73:密封構件</p>  
        <p type="p">74:密封構件</p>  
        <p type="p">80:驅動部</p>  
        <p type="p">81:驅動軸</p>  
        <p type="p">82:導軸</p>  
        <p type="p">83:波紋管</p>  
        <p type="p">84:波紋管</p>  
        <p type="p">90:排氣機構</p>  
        <p type="p">91:排氣埠</p>  
        <p type="p">92:排氣管</p>  
        <p type="p">93:調節閥</p>  
        <p type="p">100:控制部</p>  
        <p type="p">P2a,P2b:晶圓處理位置</p>  
        <p type="p">S:處理空間</p>  
        <p type="p">V:排氣空間</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1253" publication-number="202614398"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614398.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614398</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120049</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於達成熱均勻性之設備及系統</chinese-title>  
        <english-title>APPARATUS AND SYSTEM FOR THERMAL UNIFORMITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">H01L23/34</main-classification>  
        <further-classification edition="200601120251223B">C23C16/455</further-classification>  
        <further-classification edition="200601120251223B">H01L23/473</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李淨倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JINGLUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈里什　阿坎克沙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARISH, AKANKSHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孟昶宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MENG, CHANGYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張舒揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SHUYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方杜拉利亞　凱爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FONDURULIA, KYLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露技術之各種實施例可提供一種氣體分配系統，其具有一頂部部分及一底部部分。此頂部部分含有具有一通道之一冷卻環、蓮蓬頭區上方之一第一加熱環、沿著此頂部部分之一邊緣的一第二加熱元件、沿著此頂部部分之一邊緣的一第三加熱元件。此底部部分含有複數個加熱元件，此複數個加熱元件沿著底部部分之周長配置，自此蓮蓬頭區徑向向外。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various embodiments of the present technology may provide a gas distribution system having a top portion and a bottom portion. The top portion contains a cooling ring with a channel, a first heating ring above the showerhead region, a second heating element along an edge of the top portion, a third heating element along an edge of the top portion. The bottom portion contains a plurality of heating elements arranged along the perimeter of bottom portion, radially outwards from the showerhead region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">105:反應器</p>  
        <p type="p">110:氣體分配系統</p>  
        <p type="p">115:反應室</p>  
        <p type="p">120:頂部部分/，第一部分</p>  
        <p type="p">125:底部部分/，第二部分</p>  
        <p type="p">135:容器</p>  
        <p type="p">140:排氣系統</p>  
        <p type="p">145:基座</p>  
        <p type="p">150:基板</p>  
        <p type="p">155:反應空間</p>  
        <p type="p">180:底座</p>  
        <p type="p">190:控制器</p>  
        <p type="p">250:第一表面</p>  
        <p type="p">255:第二表面，底表面</p>  
        <p type="p">260:第二表面</p>  
        <p type="p">262:第一表面，頂表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1254" publication-number="202614369"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614369.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614369</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120070</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配線基板及配線基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L23/12</main-classification>  
        <further-classification edition="200601120251226B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤田石將士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWADAISHI, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種配線基板及配線基板之製造方法，其係能夠將微細配線部件50確實地安裝於空腔35內並靠近其側壁。 &lt;br/&gt;本發明係一種配線基板20，其係搭載至少一個以上之半導體元件40，配線基板係具有芯層60，前述芯層之第一面及第二面上係配置有配線層（21、22），前述芯層係具備至少一個以上之從前述第一面貫通至前述第二面之貫通電極30。 &lt;br/&gt;並且，在前述芯層之搭載有半導體元件之面，係形成有至少一個以上之有底之空腔35，前述空腔係載置有微細配線部件50，前述空腔之底部係形成有Sa為500nm以上之粗糙度之凹凸。藉由存在此空腔底面之凹凸，微細配線部件能夠確實地固定於配線基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:配線基板</p>  
        <p type="p">21:第一配線層</p>  
        <p type="p">22:第二配線層</p>  
        <p type="p">30:貫通電極</p>  
        <p type="p">35:空腔</p>  
        <p type="p">40:半導體元件</p>  
        <p type="p">50:微細配線部件</p>  
        <p type="p">51:DAF</p>  
        <p type="p">85:絕緣樹脂</p>  
        <p type="p">86:底部填充劑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1255" publication-number="202614370"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614370.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614370</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120071</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>配線基板及配線基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L23/12</main-classification>  
        <further-classification edition="200601120251226B">H05K3/46</further-classification>  
        <further-classification edition="200601120251226B">H05K3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤田石將士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWADAISHI, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種配線基板及配線基板之製造方法，其係能夠將微細配線部件50確實地安裝在空腔35內並靠近其側壁。 &lt;br/&gt;本發明係一種配線基板20，其係搭載至少一個以上之半導體元件40，配線基板係具有芯層60，前述芯層之第一面及第二面上係配置有配線層（21、22），前述芯層係具備至少一個以上之從前述第一面貫通至前述第二面之貫通電極30。 &lt;br/&gt;並且，在前述芯層之搭載有半導體元件之面，係形成有至少一個以上之有底之空腔35；前述空腔之側壁之傾斜角度，相對於空腔之深度之深度D1，從空腔之底部至高度40%之側壁之傾斜角度θ1，係25度至60度之範圍；從空腔之底部算起高度40%以上之側壁之傾斜角度θ2，係1.5度至5.0度之範圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">D1:空腔深度</p>  
        <p type="p">S1:空腔之上部與底部之開口差</p>  
        <p type="p">θ:空腔角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1256" publication-number="202612712"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612712.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612712</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120077</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組合物及其應用</chinese-title>  
        <english-title>COMPOSITION AND APPLICATION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120260102B">A61K35/747</main-classification>  
        <further-classification edition="200601120260102B">A61K36/54</further-classification>  
        <further-classification edition="200601120260102B">A61K31/192</further-classification>  
        <further-classification edition="200601120260102B">A61K31/198</further-classification>  
        <further-classification edition="200601120260102B">A61K31/185</further-classification>  
        <further-classification edition="200601120260102B">A61K31/7024</further-classification>  
        <further-classification edition="200601120260102B">A61K31/455</further-classification>  
        <further-classification edition="200601120260102B">A61P25/00</further-classification>  
        <further-classification edition="201601120260102B">A23L33/10</further-classification>  
        <further-classification edition="201601120260102B">A23L33/105</further-classification>  
        <further-classification edition="201601120260102B">A23L33/175</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>心悅生醫股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYNEURX INTERNATIONAL (TAIWAN) CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡果荃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, GUO-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張偉華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WEI-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂律秉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, LU-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭奇昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, CHI-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊小逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHUANG, XIAO-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一組合物，包含D-胺基酸氧化酶(DAAO)抑制劑及N-甲基-D-天門冬胺酸(NMDA)調節劑。本文中亦提供向有需要的個體給藥有效量的組合物的使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composition, comprising a D-amino acid oxidase (DAAO) inhibitor and a N-methyl-D-aspartate (NMDA) modulator. Also provided herein are the method of the uses of by administering to a subject in need thereof an effective amount of the composition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1257" publication-number="202613371"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613371.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613371</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120082</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＳｉＣ單晶體晶圓、ＳｉＣ單晶體錠、ＳｉＣ單晶體晶圓的製造方法、ＳｉＣ單晶體錠的製造方法、ＳｉＣ單晶體錠的製造裝置及ＳｉＣ磊晶生長膜的成膜方法</chinese-title>  
        <english-title>SILICON CARBIDE SINGLE CRYSTAL WAFER, SILICON CARBIDE SINGLE CRYSTAL INGOT, METHOD FOR PRODUCING SILICON CARBIDE SINGLE CRYSTAL WAFER, METHOD FOR PRODUCING SILICON CARBIDE SINGLE CRYSTAL INGOT, EQUIPMENT FOR PRODUCING SILICON CARBIDE SINGLE CRYSTAL INGOT, AND METHOD FOR FORMING SILICON CARBIDE EPITAXIAL GROWTH FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">C30B29/36</main-classification>  
        <further-classification edition="200601120251219B">C30B15/00</further-classification>  
        <further-classification edition="200601120251219B">C30B19/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商中央硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊谷和人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAGAI, KAZUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松村準也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMURA, JUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅崎智典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMEZAKI, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松田裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDA, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之SiC單晶體錠的直徑為4吋以上，在拍攝表面的影像中觀察到之包藏溶媒區域相對於表面的面積比率為5%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A SiC single crystal ingot of the present disclosure having a diameter of 4 inches or more, wherein an area ratio of the solvent inclusion region observed in a photographed image of a surface is 5% or less relative to the surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:晶種</p>  
        <p type="p">20:生長層</p>  
        <p type="p">C:中心</p>  
        <p type="p">P:外周</p>  
        <p type="p">F:生長面</p>  
        <p type="p">G:表面</p>  
        <p type="p">t&lt;sub&gt;1&lt;/sub&gt;,t&lt;sub&gt;2&lt;/sub&gt;,t&lt;sub&gt;n-1&lt;/sub&gt;,t&lt;sub&gt;n&lt;/sub&gt;:厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1258" publication-number="202613308"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613308.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613308</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120093</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＡＣＶＲ２Ａ及ＡＣＶＲ２Ｂ　ＲＮＡ干擾劑</chinese-title>  
        <english-title>ACVR2A AND ACVR2B RNA INTERFERENCE AGENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260102B">C12N15/113</main-classification>  
        <further-classification edition="200601120260102B">A61K31/713</further-classification>  
        <further-classification edition="200601120260102B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美國禮來大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELI LILLY AND COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>包爾　史考特　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAUER, SCOTT PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查亞　桑塔拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAHYA, SUNTARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　志濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHRISTINE CHIH-TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克魯伊　強尼　尤金</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CROY, JOHNNY EUGENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊薩　席夏姆　奧馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EISSA, HISHAM OMER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫爾卡尼　納里尼　霍薩哈利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KULKARNI, NALINI HOSAHALLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉克納　格雷戈里　勞倫斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LACKNER, GREGORY LAWRENCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勞倫斯　史考特　艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAWRENCE, SCOTT ALAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里拓　克利斯朵夫　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RITO, CHRISTOPHER JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩特懷特　艾利森　雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATTERWHITE, ALLYSON RAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚百林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, BAILIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦迪若　佩卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERDINO, PETRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　冀波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供活化素受體2A型(ACVR2A)及活化素受體2B型(ACVR2B) RNAi劑。本文亦提供包含該ACVR2A及/或該ACVR2B RNAi劑的組合物，該ACVR2A及/或該ACVR2B RNAi劑經由連接子或直接鍵與人類運鐵蛋白受體(TfR)結合蛋白結合。本文亦提供使用ACVR2A RNAi劑與ACVR2B RNAi劑呈分開、同時或依序組合，以治療患者的代謝病症的方法，該等代謝病症包括例如肥胖症、超重、2型糖尿病(T2DM)及代謝相關脂肪變性肝炎(MASH)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are Activin Receptor type 2A (ACVR2A) and Activin Receptor Type 2B (ACVR2B) RNAi agents. Also provided herein are compositions comprising the ACVR2A and/or the ACVR2B RNAi agents conjugated to human transferrin receptor (TfR) binding proteins via a linker or a direct bond. Also provided herein are methods of using ACVR2A RNAi agent(s) in separate, simultaneous, or sequential combination with ACVR2B RNAi agent(s) for treating metabolic disorders, including for example, obesity, overweight, Type 2 diabetes mellitus (T2DM), and metabolic associated steatohepatitis (MASH) in a patient.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1259" publication-number="202613076"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613076.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613076</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120102</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鏈接子－有效負載、由其作成之抗體－藥物共軛物及其用途</chinese-title>  
        <english-title>A LINKER-PAYLOAD, AN ANTIBODY-DRUG CONJUGATE MADE THEREBY AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D215/20</main-classification>  
        <further-classification edition="200601120260102B">C07K16/28</further-classification>  
        <further-classification edition="201701120260102B">A61K47/68</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台睿生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIRX, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡　督憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, DU-SHIENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡　督憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIEN, DU-SHIENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱伊文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, YI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥鴒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李佳駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIA-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YUAN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭盛助</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, SHENG CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘柏均</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供在治療癌症中有效的鏈接子-有效負載，其中該鏈接子-有效負載係藉由將鏈接基團連結至具有下式(I)之結構的芳基-喹啉衍生物之特定位點而作成：</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="229px" width="344px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p>  
        <p type="p">本揭露亦關於藉由將前述鏈接子-有效負載進一步共軛至抗體而作成的抗體-藥物共軛物，以及該鏈接子-有效負載及抗體-藥物共軛物的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a linker-payload being effective in treating a cancer, wherein the linker-payload is made by connecting a linking group to a specific site of an aryl-quinolin derivative having a structure of the following Formula (I):</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="216px" width="315px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p>  
        <p type="p">The present disclosure also relates to an antibody-drug conjugate made by further conjugating the aforementioned linker-payload to an antibody, and uses of the linker-payload and antibody-drug conjugate.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1260" publication-number="202612591"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612591.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612591</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120104</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>纖維狀油脂結晶及其製造方法</chinese-title>  
        <english-title>FIBROUS OIL CRYSTAL AND ITS MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A23D9/00</main-classification>  
        <further-classification edition="200601120260102B">A23D9/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三吉油脂股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYOSHI OIL &amp; FAT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大石憲孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OISHI, NORITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEKOBA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供一種纖維狀油脂結晶。纖維狀油脂結晶可藉由包括下述步驟之方法製造： &lt;br/&gt;混合作為纖維狀油脂結晶的原料之油脂及親油性溶劑，在加溫下使前述油脂溶解於親油性溶劑，而調製溶液之步驟； &lt;br/&gt;冷卻前述溶液，促進結晶核的生成之步驟；及 &lt;br/&gt;將前述冷卻後的前述溶液升溫並保管，促進前述纖維狀油脂結晶的成長之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides fibrous oil crystals. Fibrous oil crystals can be manufactured by a method containing the following steps: &lt;br/&gt;a step of mixing an oil or fat that is a raw material for fibrous oil crystals with a lipophilic solvent, and dissolving the oil or fat in the lipophilic solvent under heating to prepare a solution; &lt;br/&gt;a step of cooling the solution and promoting the generation of crystal nuclei; and &lt;br/&gt;a step of heating and storing the cooled solution to promote growth of the fibrous fat crystals.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1261" publication-number="202613716"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613716.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613716</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120109</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光波導形成用轉印膜、積層體、光波導之製造方法、化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">G03F7/004</main-classification>  
        <further-classification edition="201901120251231B">B32B7/023</further-classification>  
        <further-classification edition="200601120251231B">B32B27/00</further-classification>  
        <further-classification edition="200601120251231B">C07D215/06</further-classification>  
        <further-classification edition="200601120251231B">C07D215/14</further-classification>  
        <further-classification edition="200601120251231B">C07D215/233</further-classification>  
        <further-classification edition="200601120251231B">C08F290/12</further-classification>  
        <further-classification edition="200601120251231B">C08J5/18</further-classification>  
        <further-classification edition="200601120251231B">G02B6/12</further-classification>  
        <further-classification edition="200601120251231B">G02B6/13</further-classification>  
        <further-classification edition="200601120251231B">G02B6/138</further-classification>  
        <further-classification edition="200601120251231B">G03F7/11</further-classification>  
        <further-classification edition="200601120251231B">G03F7/027</further-classification>  
        <further-classification edition="200601120251231B">G03F7/038</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三井哲朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI, TETSURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤木大悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWAKI, DAIGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>師岡直之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOROOKA, NAOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白岩直澄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAIWA, NAOZUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的第1課題為提供一種能夠形成能夠鹼顯影且能夠實現低光傳輸損耗之光波導之光波導形成用轉印膜。又，本發明的第2課題為提供一種與上述光波導形成用轉印膜相關之積層體及光波導之製造方法。又，本發明的第3課題為提供一種與上述光波導形成用轉印膜有關之化合物。本發明的光波導形成用轉印膜為具有偽支撐體及感光性組成物層之光波導形成用轉印膜，其中，上述感光性組成物層包含不具有羥基且具有羧基之化合物和減少上述羧基的量之化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1262" publication-number="202612964"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612964.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612964</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120116</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>豎管裝置</chinese-title>  
        <english-title>STEERER DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B62K25/08</main-classification>  
        <further-classification edition="200601120251229B">B62K25/02</further-classification>  
        <further-classification edition="200601120251229B">B62K21/02</further-classification>  
        <further-classification edition="200601120251229B">B62K21/04</further-classification>  
        <further-classification edition="200601120251229B">B62K21/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商速聯有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRAM, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬克士威　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAXWELL, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕克　布倫特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PACKER, BRENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧拉普　查理斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUNLAP, CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種用於兩輪車輛之豎管裝置。該豎管裝置一般可包括適用於手把控制且可繞著一轉向軸線旋轉的一豎管，至少一叉腳總成，該至少一叉腳總成包括一車輪安裝介面，與連接該豎管和該至少一叉腳總成的一肩蓋。至少一旋轉止擋可固定在該肩蓋上，該至少一旋轉止擋的大小及形狀經製作成可限制該肩蓋繞著該轉向軸線的旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A steerer device for a two-wheeled vehicle is provided. The steerer device may generally include a steerer adaptable for handlebar control and rotatable about a steering axis, at least one fork leg assembly, the at least one fork leg assembly including a wheel mounting interface, and a crown connecting the steerer and the at least one fork leg assembly. At least one rotational stop may be fixed on the crown, the at least one rotational stop sized and shaped to limit rotation of the crown about the steering axis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">108:前叉</p>  
        <p type="p">140:叉架上部</p>  
        <p type="p">142:叉架下部</p>  
        <p type="p">144:豎管</p>  
        <p type="p">145:豎管下部</p>  
        <p type="p">146:肩蓋</p>  
        <p type="p">147:豎管過渡部分</p>  
        <p type="p">148:肩蓋介面</p>  
        <p type="p">149:豎管上部</p>  
        <p type="p">150:第一上腳</p>  
        <p type="p">151:第一腳總成</p>  
        <p type="p">152:第二上腳</p>  
        <p type="p">153:第二腳總成</p>  
        <p type="p">154:第一下腳</p>  
        <p type="p">155:下連接器</p>  
        <p type="p">156:第二下腳</p>  
        <p type="p">158:車輪安裝介面</p>  
        <p type="p">160:煞車安裝介面</p>  
        <p type="p">162:彈簧介面</p>  
        <p type="p">164:阻尼器介面</p>  
        <p type="p">B:第一腳軸線</p>  
        <p type="p">C:第二腳軸線</p>  
        <p type="p">D:方向</p>  
        <p type="p">S:轉向軸線/豎管軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1263" publication-number="202613981"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613981.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613981</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120135</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生物特徵辨識系統及相關裝置</chinese-title>  
        <english-title>BIOMETRIC IDENTIFICATION SYSTEMS AND ASSOCIATED DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251231B">G06V40/18</main-classification>  
        <further-classification edition="200601120251231B">A61B3/00</further-classification>  
        <further-classification edition="200601120251231B">A61B3/12</further-classification>  
        <further-classification edition="201701120251231B">G06T7/00</further-classification>  
        <further-classification edition="201801120251231B">G16H10/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾登斐健康股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDENTIFEYE HEALTH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅茨勒　馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAETZLER, MARCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑋斯特　羅倫斯　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEST, LAWRENCE C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾瑞恩佐　毛理齊奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARIENZO, MAURIZIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱　考德勒　歐文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAYE-KAUDERER, OWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉司頓　泰勒　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RALSTON, TYLER S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅森布魯斯　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROSENBLUTH, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅伯格　強納森　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROTHBERG, JONATHAN M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>考曼斯　賈柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUMANS, JACOB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥努帝　克里斯多弗　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCNULTY, CHRISTOPHER THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於以下之技術及設備：擷取一個人之視網膜眼底之一影像；辨識該個人；存取相關於該個人之各種電子紀錄(包含健康紀錄)或帳戶或裝置；判定該個人對特定疾病之易感性；及/或診斷該個人之健康問題。一些實施例提供具有用於擷取一個人之(若干)眼睛之一或多個影像之一或多個成像裝置之成像設備。本文中所描述之成像設備可包含用於分析及/或與其他裝置交換經擷取影像及/或健康資料之電子器件。根據各種實施例，本文中所描述之成像設備可替代地或另外經組態用於生物特徵辨識及/或健康狀態判定技術，如本文中所描述。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides techniques and apparatus for capturing an image of a person’s retina fundus, identifying the person, accessing various electronic records (including health records) or accounts or devices associated with the person, determining the person’s predisposition to certain diseases, and/or diagnosing health issues of the person. Some embodiments provide imaging apparatus having one or more imaging devices for capturing one or more images of a person’s eye(s). Imaging apparatus described herein may include electronics for analyzing and/or exchanging captured image and/or health data with other devices. In accordance with various embodiments, imaging apparatus described herein may be alternatively or additionally configured for biometric identification and/or health status determination techniques, as described herein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:方法</p>  
        <p type="p">902:步驟</p>  
        <p type="p">904:步驟</p>  
        <p type="p">906:步驟</p>  
        <p type="p">908:步驟</p>  
        <p type="p">910:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1264" publication-number="202613169"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613169.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613169</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120143</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種抗DLL3抗體、抗體藥物偶聯物及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/28</main-classification>  
        <further-classification edition="200601120260102B">C12N15/13</further-classification>  
        <further-classification edition="200601120260102B">C12N15/63</further-classification>  
        <further-classification edition="200601120260102B">C07D491/22</further-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="201701120260102B">A61K47/68</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification>  
        <further-classification edition="200601120260102B">G01N33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商映恩生物科技(上海)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUALITY BIOLOGICS (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林聖超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHENGCHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>花海清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUA, HAIQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張禹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱忠遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, ZHONGYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種抗DLL3抗體、抗體藥物偶聯物及其應用。所述抗DLL3抗體或其抗原結合片段包含重鏈可變區VH和輕鏈可變區VL，所述重鏈可變區VH包含HCDR1、HCDR2和HCDR3，所述輕鏈可變區VL包含LCDR1、LCDR2和LCDR3。所述抗體藥物偶聯物包含所述抗體或其抗原結合片段、接頭單元L和細胞毒性藥物。本發明的抗體對DLL3具有良好的親和力，對表達DLL3的細胞具有顯著的內化能力；抗體藥物偶聯物在體內外均對腫瘤細胞的增殖具有極強的抑制活性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1265" publication-number="202613117"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613117.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613117</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120146</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>依米立酮(IMIPRIDONE)衍生物的固態形式</chinese-title>  
        <english-title>SOLID STATE FORMS OF IMIPRIDONE DERIVATIVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D471/14</main-classification>  
        <further-classification edition="200601120260102B">A61K31/519</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商凱莫瑞司公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIMERIX, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬希　畢任　基秀爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOSHI, BIREN KISHOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷克希瑪南　文卡特拉曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAKSHMANAN, VENKATRAMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>道尼　艾倫　利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOWNEY, AARON LEIGH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威爾　羅伊　溫德歐　二世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WARE,ROY WENDELL JR.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於亦稱為ONC206的7-苯甲基-4-(2,4-二氟苯甲基)-2,4,6,7,8,9-六氫咪唑并[1,2-a]吡啶并[3,4-e]嘧啶-5(1H)-酮或其鹽的多晶形式及材料以及其水合物及溶劑合物，其適用於治療一或多種癌症；產生該等多晶形式及材料之方法；以及使用該等形式及材料之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to polymorphic forms and materials, as well as hydrates and solvates thereof, of 7-benzyl-4-(2,4-difluorobenzyl)-2,4,6,7,8,9-hexahydroimidazo[1,2-a]pyrido[3,4-e]pyrimidin-5(1H)-one or salts thereof, also known as ONC206, that are useful in the treatment of one or more cancers, processes to produce such polymorphic forms and materials, and methods of using such forms and materials.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1266" publication-number="202613094"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613094.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613094</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120147</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於癌症治療之雙官能化合物</chinese-title>  
        <english-title>BIFUNCTIONAL COMPOUNDS FOR CANCER TREATMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D401/12</main-classification>  
        <further-classification edition="200601120260102B">C07D401/14</further-classification>  
        <further-classification edition="200601120260102B">C07D207/16</further-classification>  
        <further-classification edition="201701120260102B">A61K47/54</further-classification>  
        <further-classification edition="201701120260102B">A61K47/55</further-classification>  
        <further-classification edition="200601120260102B">A61K51/04</further-classification>  
        <further-classification edition="200601120260102B">A61K51/06</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾克緹席拉公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACTITHERA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高托普洛斯　安卓司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOUTOPOULOS, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈克伯森　韋司　歐里特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JACOBSON WEISS,ORIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安東尼　奈維爾　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANTHONY, NEVILLE J</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案提供了雙官能化合物及相關組合物，其&lt;i&gt;尤其&lt;/i&gt;可用於癌症之治療及成像，例如與纖維母細胞活化蛋白-α (FAP)之表現相關的癌症之治療，以及其使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure features bifunctional compounds and related compositions that, &lt;i&gt;inter alia&lt;/i&gt;, may be used in the treatment and imaging of cancer, e.g., treatment of cancers associated with expression of Fibroblast Activation Protein-α (FAP), as well as methods of use thereof.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1267" publication-number="202613128"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613128.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613128</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120179</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>螺烷化合物</chinese-title>  
        <english-title>SPIROCHROMAN COMPOUND</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D491/107</main-classification>  
        <further-classification edition="200601120260102B">A61K31/496</further-classification>  
        <further-classification edition="200601120260102B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260102B">A61P17/06</further-classification>  
        <further-classification edition="200601120260102B">A61P19/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商橘生藥品工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISSEI PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧富直人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUTOMI, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森田直英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORITA, NAOHIDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳誠人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANAGI, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>棚田文也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANADA, FUMIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神谷昭寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIYA, AKINOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平澤秀明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRASAWA, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, KAORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村川駿介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAWA, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供具有IL-17調節劑作用的新穎化合物。 &lt;br/&gt;本發明係關於下式(I)所示螺𠳭烷化合物或其藥理學上容許之鹽。本發明之化合物或其藥理學上容許之鹽係具有IL-17調節劑作用，可用作為IL-17相關疾病(例如乾癬、僵直性脊椎炎、幼年型特發性關節炎、中軸性脊椎關節炎、化膿性汗腺炎、風濕性多肌痛症、肌腱病變)之治療劑。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="207px" width="289px" file="ed10087.JPG" alt="ed10087.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1268" publication-number="202613363"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613363.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613363</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120181</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電解槽之分隔壁、分隔壁組件及電解槽</chinese-title>  
        <english-title>PARTITION WALL OF ELECTROLYTIC CELL, PARTITION WALL ASSEMBLY AND ELECTROLYTIC CELL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">C25B13/02</main-classification>  
        <further-classification edition="202101120251226B">C25B9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商德山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUYAMA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>則安佑亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NORIYASU, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中康行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, YASUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電解槽之分隔壁，其即使於區隔出陽極室與陰極室的電解槽的分隔壁形成了凹部，仍可防止氣體積聚的情況發生。電解槽的分隔壁8，具有：第1主面20，以及位於第1主面20的相反側的第2主面22。第1主面20，包含：第1平坦部24，以及比第1平坦部24更凹陷的複數個第1凹部36。對第1凹部36的緣部40實施了R（圓弧）加工。第2主面22，包含：第2平坦部30，以及比第2平坦部30更凹陷的複數個第2凹部42。對第2凹部42的緣部46實施了R加工。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided a partition wall of an electrolytic cell for separating an anode chamber and a cathode chamber that is capable of suppressing gas accumulation even when the partition wall of an electrolytic cell has dents. A partition wall 8 of an electrolytic cell has a first principal surface 20 and a second principal surface 22 located on the opposite side of the first principal surface 20. The first principal surface 20 includes a first flat portion 24 and a plurality of first dents 36 that are recessed more than the first flat portion 24. An edge 40 of each of the first dents 36 is round chamfered. The second principal surface 22 includes a second flat portion 30 and a plurality of second dents 42 that are recessed more than the second flat portion 30. An edge 46 of each of the second dents 42 is round chamfered.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">8:分隔壁</p>  
        <p type="p">12:電極</p>  
        <p type="p">14:集電器</p>  
        <p type="p">20:分隔壁的第1主面</p>  
        <p type="p">22:分隔壁的第2主面</p>  
        <p type="p">24:第1平坦部</p>  
        <p type="p">26:第1突起</p>  
        <p type="p">26a:第1突起的頂部</p>  
        <p type="p">28:第1突起的裙部</p>  
        <p type="p">30:第2平坦部</p>  
        <p type="p">32:第2突起</p>  
        <p type="p">32a:第2突起的頂部</p>  
        <p type="p">34:第2突起的裙部</p>  
        <p type="p">36:第1凹部</p>  
        <p type="p">36a:第1凹部的底部</p>  
        <p type="p">38:第1傾斜部</p>  
        <p type="p">40:第1凹部的緣部</p>  
        <p type="p">42:第2凹部</p>  
        <p type="p">42a:第2凹部的底部</p>  
        <p type="p">44:第2傾斜部</p>  
        <p type="p">46:第2凹部的緣部</p>  
        <p type="p">d:直徑</p>  
        <p type="p">H:高度</p>  
        <p type="p">D:深度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1269" publication-number="202613007"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613007.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613007</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120198</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>行走機器人</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">B65G47/64</main-classification>  
        <further-classification edition="202401120251226B">G05D1/40</further-classification>  
        <further-classification edition="202401320251226B">G05D109/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>早川智久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYAKAWA, TOMOHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">行走機器人包括：行走單元，能夠在行走面上行走；以及升降單元，與行走單元組合，具有升降部及使升降部升降的升降驅動部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">R:行走機器人</p>  
        <p type="p">1:行走單元</p>  
        <p type="p">11:主體部</p>  
        <p type="p">112:周壁部</p>  
        <p type="p">2:升降單元</p>  
        <p type="p">21:升降部</p>  
        <p type="p">211:載置部</p>  
        <p type="p">212:被傳遞部</p>  
        <p type="p">22:升降驅動部</p>  
        <p type="p">3:左側驅動部</p>  
        <p type="p">31:左側升降馬達</p>  
        <p type="p">32:左側升降支撐部</p>  
        <p type="p">4:右側驅動部</p>  
        <p type="p">41:右側升降馬達</p>  
        <p type="p">42:右側升降支撐部</p>  
        <p type="p">421、422:右側行走引導部</p>  
        <p type="p">43:右側升降機構</p>  
        <p type="p">44:第一升降機構</p>  
        <p type="p">441:第一螺母</p>  
        <p type="p">442:第一連桿機構</p>  
        <p type="p">45:第二升降機構</p>  
        <p type="p">452:第二連桿機構</p>  
        <p type="p">453:第三連桿機構</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1270" publication-number="202614253"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614253.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614253</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120201</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及其製造方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250703B">H01L21/66</main-classification>  
        <further-classification edition="200601120250703B">H01L21/304</further-classification>  
        <further-classification edition="200601120250703B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>群創光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNOLUX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許博雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, PO-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種電子裝置的製造方法，其包括提供一目標基板、以及在所述目標基板上設置一電路結構。提供所述目標基板的製程包括以下步驟：(a)提供一基底層；(b)對所述基底層進行一平坦步驟後，測量所述基底層的一第一厚度變異值；(c)在所述基底層的兩側分別設置一平坦層，以形成所述目標基板；以及(d)測量所述目標基板的一第二厚度變異值，其中所述第二厚度變異值小於所述第一厚度變異值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A manufacturing method of an electronic device is provided by the present disclosure. The manufacturing method includes providing a target substrate and disposing a circuit structure on the target substrate. The process of providing the target substrate includes following steps: (a) providing a base layer; (b) performing a flattening step on the base layer, and measuring a first thickness variation of the base layer; (c) disposing planarization layers respectively on two sides of the base layer to form the target substrate; and (d) measuring a second thickness variation of the target substrate, wherein the second thickness variation is less than the first thickness variation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">M100:製造方法</p>  
        <p type="p">S100,S1001,S1002,S1003,S1004,S102:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1271" publication-number="202613313"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613313.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613313</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120208</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>肌向性ＲＡＡＶ</chinese-title>  
        <english-title>MUSCLE TROPIC RAAV</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C12N15/86</main-classification>  
        <further-classification edition="200601120260102B">C07K14/005</further-classification>  
        <further-classification edition="200601120260102B">C07K14/47</further-classification>  
        <further-classification edition="200601120260102B">A61K48/00</further-classification>  
        <further-classification edition="200601220260102B">A61P21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商薩羅塔治療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAREPTA THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯內德克　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SNEDEKER, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅帝諾　克拉帕克　路易斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RODINO-KLAPAC, LOUISE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波特　瑞秋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POTTER, RACHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>強達　艾拉尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANDA, ARANI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克蘭普頓　祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRAMPTON, SHON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑　普賈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANE, POOJA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述重組肌向性AAVrh.74殼體。另外，進一步描述包含或編碼此等重組殼體之質體、病毒載體、雙載體系統、細胞及組合物。此等重組聚核苷酸、質體、病毒載體、雙載體系統、細胞及組合物可用於治療肌肉疾病或病症，包括肌肉萎縮症及心肌病。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Recombinant myotropic AAV rh.74 capsids are described herein. In addition, plasmids, viral vectors, dual vector systems, cells, and compositions comprising or encoding such recombinant capsids are further described. Such recombinant polynucleotides, plasmids, viral vectors, dual vector systems, cells, and compositions may be used to treat muscle diseases or disorders, including muscular dystrophies and cardiomyopathies.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1272" publication-number="202613162"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613162.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613162</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120209</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>純化重組蛋白的方法</chinese-title>  
        <english-title>METHOD OF PURIFYING RECOMBINANT PROTEINS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/18</main-classification>  
        <further-classification edition="200601120260102B">C07K1/16</further-classification>  
        <further-classification edition="200601120260102B">C07K1/22</further-classification>  
        <further-classification edition="200601120260102B">B01D15/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比利時商ＵＣＢ生物製藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UCB BIOPHARMA SRL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲朋　柯提斯　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHIPPEN, CURTIS WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華森　奈爾　艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATSON, NEIL ALAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於製造包含重組抗體分子之重組蛋白之領域。特定而言，本文提供用於使用膨脹床吸附(EBA)層析來純化該等重組蛋白之方法，在該膨脹床吸附層析中在低剪切條件下加載細胞培養液。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to the field of manufacturing recombinant proteins, including recombinant antibody molecules. In particular, methods are provided herein for purifying such recombinant proteins using expanded bed adsorption (EBA) chromatography where the cell culture fluid is loaded under low shear conditions.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1273" publication-number="202613314"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613314.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613314</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120224</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新抗原之病毒遞送</chinese-title>  
        <english-title>VIRAL DELIVERY OF NEOANTIGENS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C12N15/86</main-classification>  
        <further-classification edition="200601120260102B">C12N7/01</further-classification>  
        <further-classification edition="200601120260102B">C12N15/13</further-classification>  
        <further-classification edition="200601120260102B">C07K14/74</further-classification>  
        <further-classification edition="200601120260102B">A61K39/00</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商西雅圖項目公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEATTLE PROJECT CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布萊爾　偉德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLAIR, WADE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布理克　蘇利文　布萊登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BULIK-SULLIVAN, BRENDAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴斯比　珍妮佛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUSBY, JENNIFER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德提　亞得南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DERTI, ADNAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉特林　里奥尼德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GITLIN, LEONID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古藤伯格　海斯貝特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GROTENBREG, GIJSBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>約斯　卡琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOOSS, KARIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯卡倫　夏蘭　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCALLAN, CIARAN DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉嫩史基　羅門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YELENSKY, ROMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃裕煦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示包括源於個體腫瘤之新抗原編碼核酸序列的黑猩猩腺病毒載體。亦揭示與該等載體相關之核苷酸、細胞及方法，包括該等載體作為疫苗之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are chimpanzee adenoviral vectors that include neoantigen-encoding nucleic acid sequences derived from a tumor of a subject. Also disclosed are nucleotides, cells, and methods associated with the vectors including their use as vaccines.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:患者</p>  
        <p type="p">114:候選新抗原序列</p>  
        <p type="p">118:疫苗</p>  
        <p type="p">160:呈現鑑別系統</p>  
        <p type="p">165:呈現資訊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1274" publication-number="202613227"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613227.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613227</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120236</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導電性漿料、電子零件、及積層陶瓷電容器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">C08K3/08</main-classification>  
        <further-classification edition="200601120251219B">C08L1/08</further-classification>  
        <further-classification edition="200601120251219B">C08G8/30</further-classification>  
        <further-classification edition="200601120251219B">H01G4/30</further-classification>  
        <further-classification edition="200601120251219B">H01G4/12</further-classification>  
        <further-classification edition="200601120251219B">C09D5/24</further-classification>  
        <further-classification edition="200601120251219B">C09J9/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友金屬礦山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO METAL MINING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福田健二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種導電性漿料，即使在使用了小粒徑的導電性粉末的情況下，亦能夠兼顧黏度特性及乾燥膜特性。導電性漿料包含導電性粉末、分散劑、黏合劑樹脂以及有機溶劑，其中，黏合劑樹脂包含乙基纖維素，乙基纖維素的取代度為2.60以上且2.72以下，且重均分子量為80,000以上且200,000以下，分散劑包含重均分子量為5,000以上的羧酸系高分子分散劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:積層陶瓷電容器</p>  
        <p type="p">10:陶瓷積層體</p>  
        <p type="p">11:內部電極層</p>  
        <p type="p">12:電介質層</p>  
        <p type="p">20:外部電極</p>  
        <p type="p">21:外部電極層</p>  
        <p type="p">22:電鍍層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1275" publication-number="202612681"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612681.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612681</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120240</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固態狀油中水型化妝品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K8/06</main-classification>  
        <further-classification edition="200601120260102B">A61K8/19</further-classification>  
        <further-classification edition="200601120260102B">A61K8/31</further-classification>  
        <further-classification edition="200601120260102B">A61K8/34</further-classification>  
        <further-classification edition="200601120260102B">A61K8/36</further-classification>  
        <further-classification edition="200601120260102B">A61K8/39</further-classification>  
        <further-classification edition="200601120260102B">A61K8/44</further-classification>  
        <further-classification edition="200601120260102B">A61K8/63</further-classification>  
        <further-classification edition="200601120260102B">A61K8/92</further-classification>  
        <further-classification edition="200601120260102B">A61Q1/04</further-classification>  
        <further-classification edition="200601120260102B">A61Q19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商高絲股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉野愛海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINO, AIMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種固態狀油中水型化妝品，其即使摻合囊泡組成物也不會破壞化妝品本身的結構，隨時間經過的穩定性優異，同時囊泡組成物的隨時間經過的穩定性亦優異。&lt;br/&gt; 一種固態狀油中水型化妝品，其至少含有：成分(A)囊泡組成物、成分(B)油性膠化劑、成分(C)親油性界面活性劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1276" publication-number="202614505"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614505.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614505</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120241</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可靠的高速高密度纜線連接器</chinese-title>  
        <english-title>RELIABLE HIGH-SPEED, HIGH-DENSITY CABLE CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01R13/627</main-classification>  
        <further-classification edition="201101120251226B">H01R12/77</further-classification>  
        <further-classification edition="200601120251226B">H01R13/508</further-classification>  
        <further-classification edition="200601120251226B">H01R13/631</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商安費諾商用電子産品（成都）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMPHENOL COMMERCIAL PRODUCTS (CHENGDU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何相君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, XIANGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, YAOHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可靠的高速高密度纜線連接器。該纜線連接器包括殼體和可移除地連接到殼體的傳導組件。傳導組件包括至少一個柔性扁平纜線。端子位置保證（TPA）裝置從殼體的頂部設置並配置為在鎖定狀態下將傳導組件固定到殼體並在解鎖狀態下允許傳導組件的移除。連接器位置保證（CPA）裝置從殼體的一側設置並配置為固定到配合部件。這樣的技術能夠實現具有可更換纜線的可靠的高速高密度連接器，其可以在諸如汽車所呈現的惡劣環境之類的惡劣環境中使用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Reliable high-speed, high-density cable connector. The cable connector comprises a housing and a conducting assembly removably connected to the housing. The conducting assembly includes at least one flexible flat cable. A terminal position assurance (TPA) device is disposed from a top of the housing and configured to secure the conducting assembly to the housing in a locked state and allow the removal of the conducting assembly in an unlocked state. A connector position assurance (CPA) device is disposed from a side of the housing and configured to secure to a mating component. Such techniques can enable reliable high-speed, high-density connectors with replaceable cables, which can be used in harsh environments such as one presented by an automobile.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:插頭連接器</p>  
        <p type="p">11:第一配合部分</p>  
        <p type="p">12:第一尾部部分</p>  
        <p type="p">100:第一傳導組件</p>  
        <p type="p">111:柔性扁平纜線</p>  
        <p type="p">111A:配合接觸端</p>  
        <p type="p">111C:互連部分</p>  
        <p type="p">200:第一殼體</p>  
        <p type="p">201:前殼體構件</p>  
        <p type="p">202:後殼體構件</p>  
        <p type="p">203:導向槽</p>  
        <p type="p">300:連接器位置保證裝置</p>  
        <p type="p">310:第一構件</p>  
        <p type="p">311:第一主體</p>  
        <p type="p">3111:懸臂</p>  
        <p type="p">3113:突起</p>  
        <p type="p">3114:保護器</p>  
        <p type="p">320:第二構件</p>  
        <p type="p">330:第三構件</p>  
        <p type="p">351:第一鎖定構件</p>  
        <p type="p">3511:應變消除部件</p>  
        <p type="p">352:第二鎖定構件</p>  
        <p type="p">C:第一致動器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1277" publication-number="202613064"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613064.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613064</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120255</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於環聚辛烯之耐高溫相變化熱界面材料</chinese-title>  
        <english-title>HIGH TEMPERATURE-RESISTANT PHASE-CHANGE THERMAL INTERFACE MATERIAL BASED ON POLYOCTENAMER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">C07C13/263</main-classification>  
        <further-classification edition="200601120251219B">C09K5/06</further-classification>  
        <further-classification edition="202501120251219B">C08L23/20</further-classification>  
        <further-classification edition="200601120251219B">C08K3/22</further-classification>  
        <further-classification edition="200601120251219B">C08G65/20</further-classification>  
        <further-classification edition="200601120251219B">C08L101/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商贏創運營有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVONIK OPERATIONS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布蘭肯博　簡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLANKENBURG, JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德斯曼　茱莉安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEICHMANN, JULIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕社　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAASCHE, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈格　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUG, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬可洛夫　艾力克席</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERKULOV, ALEXEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍曼　雷恩哈德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINEMANN, REINHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>根斯海默　馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENSHEIMER, MARCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史考曼　史黛芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHUMANN, STEFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩里吉亞尼迪斯　克里斯多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SARIGIANNIDIS, CHRISTOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是關於耐高溫相變化熱界面材料，並關於這些材料的製備方法及其用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to high temperature-resistant phase-change thermal interface materials, to a process for producing these materials and to the use thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1278" publication-number="202613708"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613708.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613708</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120257</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光罩空白基板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251223B">G03F1/58</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>櫻井敬佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKURAI, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮島千晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAJIMA, CHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金子英雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEKO, HIDEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[解決手段]一種光罩空白基板，其係具有透明基板，及形成於透明基板上的遮光膜，遮光膜係由含有過渡金屬與矽的材料形成，遮光膜的厚度為30nm以上80nm以下，遮光膜係由多層所構成，該多層係包含：設置於最遠離透明基板側，且由含有矽且不含過渡金屬的材料所形成的保護層；及相對於保護層設置於透明基板側，且由含有過渡金屬與矽的材料所形成之1或2層以上的遮光層，保護層的厚度為1nm以上未達8nm，遮光層中的過渡金屬的含有率為1原子%以上。 &lt;br/&gt;　　[效果]本發明之光罩空白基板的遮光膜係SPM洗淨耐性高，對遮光膜重複SPM洗淨，遮光膜的遮光性能亦難以降低。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:透明基板</p>  
        <p type="p">2:遮光膜</p>  
        <p type="p">21:保護層</p>  
        <p type="p">22:遮光層</p>  
        <p type="p">101:光罩空白基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1279" publication-number="202613720"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613720.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613720</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120263</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>圖案形成方法</chinese-title>  
        <english-title>PATTERNING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">G03F7/11</main-classification>  
        <further-classification edition="200601120251217B">G03F7/26</further-classification>  
        <further-classification edition="200601120251217B">G03F7/40</further-classification>  
        <further-classification edition="200601120251217B">G03F7/20</further-classification>  
        <further-classification edition="200601120251217B">C08L101/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林直貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口秀範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, HIDENORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石綿健汰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIWATA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供藉由進行電漿照射而相對於以往之有機下層膜圖案展現優良之邊緣粗糙度的阻劑下層膜圖案形成方法。 &lt;br/&gt;本發明之解決手段係提供一種圖案形成方法，包含下述步驟： &lt;br/&gt;於基板上形成阻劑下層膜、 &lt;br/&gt;於該阻劑下層膜上形成含矽阻劑中間膜、 &lt;br/&gt;於該含矽阻劑中間膜上形成阻劑上層膜、 &lt;br/&gt;於該阻劑上層膜形成圖案、 &lt;br/&gt;藉由將該阻劑圖案作為遮罩之複數次之蝕刻而形成阻劑下層膜圖案、 &lt;br/&gt;將該阻劑下層膜圖案進行電漿照射； &lt;br/&gt;作為該阻劑下層膜形成用組成物，使用含有具芳香環之樹脂者， &lt;br/&gt;作為於該電漿照射所使用之電漿，係使用相較於該阻劑下層膜在形成阻劑下層膜圖案之步驟中所使用之蝕刻氣體，使該阻劑下層膜蝕刻的程度更少者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a patterning process including the steps of: forming a resist underlayer film on a substrate; forming a silicon-containing resist middle layer film on the resist underlayer film; forming a resist upper layer film on the silicon-containing resist middle layer film; forming a pattern in the resist upper layer film; forming a resist underlayer film pattern by etching multiple times while using the resist pattern as a mask; and subjecting the resist underlayer film pattern to plasma irradiation, where the composition for forming the resist underlayer film contains a resin having an aromatic ring, and a plasma used in the plasma irradiation etches the resist underlayer film less than an etching gas used in the step of forming the resist underlayer film pattern. &lt;br/&gt;This can provide a method for forming a resist underlayer film pattern that exhibits better edge roughness than a conventional organic underlayer film pattern by performing plasma irradiation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:被加工基板</p>  
        <p type="p">2:被加工層</p>  
        <p type="p">2b:圖案(形成於被加工層之圖案)</p>  
        <p type="p">3:阻劑下層膜</p>  
        <p type="p">3a:阻劑下層膜圖案</p>  
        <p type="p">3b:電漿照射後之阻劑下層膜圖案</p>  
        <p type="p">4:含矽原子之阻劑中間膜</p>  
        <p type="p">4a:含矽原子之阻劑中間膜圖案</p>  
        <p type="p">4b:電漿照射後之含矽原子之阻劑中間膜圖案</p>  
        <p type="p">5:阻劑上層膜</p>  
        <p type="p">5a:阻劑上層膜圖案</p>  
        <p type="p">6:曝光部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1280" publication-number="202612959"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612959.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612959</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120272</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>運送乘客用公車</chinese-title>  
        <english-title>BUS FOR TRANSPORTING PASSENGERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B62D31/02</main-classification>  
        <further-classification edition="200601120251229B">B60R13/08</further-classification>  
        <further-classification edition="200601120251229B">B62D29/04</further-classification>  
        <further-classification edition="200601120251229B">B62D33/04</further-classification>  
        <further-classification edition="200601120251229B">B61D17/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商赫斯汽車股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARROSSERIE HESS AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內夫　亞歷克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAEF, ALEX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫德利希　簡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUNDERLICH, JAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種用於運送乘客的公共汽車包括圍繞乘客車廂的本體(1)，其中本體(1)包括金屬的框架結構(2)和固定在其上的平面元件，其中乘客車廂通過布置在金屬框架結構(2)上的絕熱系統從外部絕熱。絕熱系統包括安裝在金屬框架結構上的多層玻璃側窗(10.2、10.3、10.4、10.5、10.6)作為第一平面元件和安裝在金屬框架結構上的第二平面元件(21)，其至少在一個主表面上具有由三聚氰胺基泡沫材料製成的第一絕熱層和由氣凝膠材料製成的第二絕熱層。這種平面元件(10.2、10.3、10.4、10.5、10.6、21)的組合可以實現絕熱性能、重量和成本之間的良好比率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bus for transporting passengers comprises a body (1) which surrounds a passenger compartment, wherein the body (1) comprises a metallic framework structure (2) and planar elements fastened thereto, and wherein the passenger compartment is thermally insulated from an exterior by an insulation system arranged on the metallic framework structure (2). The insulation system comprises multiple-glazed side windows (10.2, 10.3, 10.4, 10.5, 10.6) mounted on the metallic framework structure as first planar elements and second planar elements (21) mounted on the metallic framework structure, which are provided at least on one main surface with a first insulation layer made of a melamine-based foam material and with a second insulation layer made of an aerogel material. A good ratio between insulation properties, weight and costs can be achieved by this combination of planar elements (10.2, 10.3, 10.4, 10.5, 10.6, 21).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:本體</p>  
        <p type="p">2:自立式框架結構</p>  
        <p type="p">10.1:後窗</p>  
        <p type="p">21:第二平面元件/絕熱元件</p>  
        <p type="p">24.2:厚層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1281" publication-number="202613971"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613971.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613971</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120278</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理系統、資訊處理方法及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251229B">G06T19/00</main-classification>  
        <further-classification edition="201801120251229B">G16H30/00</further-classification>  
        <further-classification edition="200601120251229B">A61B5/00</further-classification>  
        <further-classification edition="200601120251229B">A61B5/107</further-classification>  
        <further-classification edition="200601120251229B">A61K8/00</further-classification>  
        <further-classification edition="200601120251229B">A61Q17/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久光翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HISAMITSU, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡田智成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKADA, TOMONARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>針生泰史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARYUU, YASUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小原沢明彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHARAZAWA, AKIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之資訊處理系統具有控制部。控制部接收顯示皮膚外用劑於使用者身體上之塗抹狀態之塗抹資訊，基於上述塗抹資訊，將顯示上述塗抹狀態之圖像轉印於模擬人體之至少一部分之二維或三維模型上，產生包括轉印有顯示上述塗抹狀態之圖像之上述模型之提示資訊，並發送至上述使用者之使用者終端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">ST41~ST46:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1282" publication-number="202613261"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613261.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613261</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120281</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於碳基薄膜之選擇性拋光之以二氧化矽為主的漿料</chinese-title>  
        <english-title>SILICA-BASED SLURRY FOR SELECTIVE POLISHING OF CARBON-BASED FILMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C09G1/02</main-classification>  
        <further-classification edition="201201120251229B">B24B37/04</further-classification>  
        <further-classification edition="200601120251229B">H01L21/3105</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒙托托　巴蘭可　愛蕾娜　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONTOTO-BLANCO, ELENA C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞斯　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REISS, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納普頓　艾略特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KNAPTON, ELLIOT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭　育銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YU-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬銳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維拉尼　蓋爾　艾力克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VILLANI-GALE, ALEX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊雨青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YUQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種化學-機械拋光組合物，其包括：(a)二氧化矽磨料、(b)鐵陽離子、(c)配體、(d)陽離子聚合物、(e)視情況非離子聚合物及(f)水。本發明亦提供使用該組合物化學-機械拋光基板、尤其包括碳基薄膜之基板之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a chemical-mechanical polishing composition comprising: (a) a silica abrasive, (b) an iron cation, (c) a ligand, (d) a cationic polymer, (e) optionally a nonionic polymer, and (f) water. The invention also provides a method of chemically-mechanically polishing a substrate, especially a substrate comprising a carbon-based film, using said composition.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1283" publication-number="202614901"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614901.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614901</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120283</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光電轉換元件、攝像元件、光感測器、攝像元件的製造方法、化合物</chinese-title>  
        <english-title>PHOTOELECTRIC CONVERSION ELEMENT, IMAGING ELEMENT, LIGHT SENSOR, METHOD FOR MANUFACTURING IMAGING ELEMENT, AND COMPOUND</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260102B">H10K30/60</main-classification>  
        <further-classification edition="200601120260102B">C07D409/14</further-classification>  
        <further-classification edition="200601120260102B">C07D487/04</further-classification>  
        <further-classification edition="200601120260102B">C07D491/048</further-classification>  
        <further-classification edition="200601120260102B">C07D495/04</further-classification>  
        <further-classification edition="200601120260102B">C07D495/14</further-classification>  
        <further-classification edition="200601120260102B">C07F7/08</further-classification>  
        <further-classification edition="202501120260102B">H10F39/18</further-classification>  
        <further-classification edition="202301120260102B">H10K30/30</further-classification>  
        <further-classification edition="202301120260102B">H10K39/12</further-classification>  
        <further-classification edition="202301120260102B">H10K85/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金子和平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEKO, KAZUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中伸也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, NOBUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉島明典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGISHIMA, AKINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森淳一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, JUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉浦寛記</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIURA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米久田康智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEKUTA, YASUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種在接收到綠紅色光時的量子效率的電場強度依賴性小的光電轉換元件。本發明的光電轉換元件依序具有導電性膜、光電轉換膜及透明導電性膜，其中，上述光電轉換膜包含由式（1）表示之化合物。 &lt;br/&gt;&lt;img align="absmiddle" height="182px" width="585px" file="ed10025.JPG" alt="ed10025.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1284" publication-number="202613170"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613170.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613170</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120293</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>融合蛋白分子及其應用</chinese-title>  
        <english-title>FUSION PROTEIN MOLECULES AND APPLICATION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/28</main-classification>  
        <further-classification edition="200601120260102B">C07K19/00</further-classification>  
        <further-classification edition="200601120260102B">C12N15/13</further-classification>  
        <further-classification edition="200601120260102B">C12N15/63</further-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="200601120260102B">A61P3/00</further-classification>  
        <further-classification edition="200601120260102B">A61P9/00</further-classification>  
        <further-classification edition="200601120260102B">A61P19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海齊魯製藥研究中心有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI QILU PHARMACEUTICAL RESEARCH AND DEVELOPMENT CENTRE LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬彥彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, YANBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛藝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUE, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘延芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, YANFANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>應　華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YING, HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陶　維康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAO, WEIKANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提供了一種融合蛋白，其結合ACTRII，同時還能啟動GLP1受體和/或FGF21受體，在減重用途方面具有更好的增肌減脂的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a fusion protein that binds to ACTRII and activates a GLP1 receptor and/or an FGF21 receptor, with improved muscle-building and weight-loss effects with respect to weight-loss applications.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1285" publication-number="202613129"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613129.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613129</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120298</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種喜樹鹼類化合物及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D491/22</main-classification>  
        <further-classification edition="200601120260102B">A61K31/4745</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商杭州中美華東製藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANGZHOU ZHONGMEIHUADONG PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, KUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, KE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳樹倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHULUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范貝貝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, BEIBEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴新予</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI, XINYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏炎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　東舟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, DONGZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種式(I)的化合物或其藥學上可接受的鹽、酯、立體異構體、多晶型物、溶劑合物、N-氧化物、同位素標記的化合物、代謝物或前藥，包含其的藥物組合物，以及它們用於預防或治療癌症和/或腫瘤及其相關病症的用途。所述化合物具有良好的活性，其內酯環更加穩定，同時具有低外排率兼具更好的安全性，具有明顯的成藥潛力。&lt;br/&gt;&lt;img align="absmiddle" height="219px" width="207px" file="ed10160.JPG" alt="ed10160.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1286" publication-number="202613180"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613180.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613180</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120299</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>針對GPC3的抗體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/30</main-classification>  
        <further-classification edition="200601120260102B">C07K16/28</further-classification>  
        <further-classification edition="200601120260102B">C07K16/46</further-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="200601120260102B">C12N15/13</further-classification>  
        <further-classification edition="200601120260102B">C12N15/63</further-classification>  
        <further-classification edition="201701120260102B">A61K47/68</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京劑泰醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING JITAI PHARMACEUTICAL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商杭州劑泰醫藥科技有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANGZHOU JITAI PHARMACEUTICAL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃豔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉少利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SHAOLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>解晶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵帥博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAO, SHUAIBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬曉芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, XIAOYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉安東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, ANDONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及生物醫藥領域。具體而言，本發明涉及一種針對GPC3的抗體或其抗原結合片段，以及包含其的多特異性抗體或抗體綴合物。本發明還涉及所述抗體或其抗原結合片段、多特異性抗體或抗體綴合物的應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1287" publication-number="202613606"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613606.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613606</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120314</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光致發光奈米複合材料</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G02B5/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商昭榮化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHOEI CHEMICAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩耶維奇　烏拉基米爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAYEVICH, ULADZIMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>珍　拉　普朗泰　伊蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEN-LA PLANTE, ILAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　春明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHUNMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　奧斯丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, AUSTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩博　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAEBOE, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博克斯坦　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOKCHTEIN, MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一態樣之光致發光奈米複合材料為一種具有下列特徵之光致發光奈米複合材料，其包含：載體基質、分布於前述載體基質內之複數個光致發光奈米結構體、包含具有硫醇及親油性的特性之1個或複數個配位錯合物之添加劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">303:結構</p>  
        <p type="p">313:材料</p>  
        <p type="p">315:光致發光奈米結構體</p>  
        <p type="p">319:直徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1288" publication-number="202613111"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613111.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613111</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120323</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新型ＰＩ３Ｋ和／或ＰＩＫＫ抑制劑、包含其的抗體藥物偶聯物及其用途</chinese-title>  
        <english-title>NOVEL PI3K AND/OR PIKK INHIBITORS, ANTIBODY-DRUG CONJUGATES COMPRISING THE SAME AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D471/04</main-classification>  
        <further-classification edition="200601120260102B">C07D487/04</further-classification>  
        <further-classification edition="200601120260102B">C07D471/14</further-classification>  
        <further-classification edition="200601120260102B">C07K16/28</further-classification>  
        <further-classification edition="201701120260102B">A61K47/68</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商和記黃埔醫藥（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUTCHMED LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張維漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, WEIHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊海彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HAIBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇　慰國</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, WEIGUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及生物製藥領域，特別涉及新型PI3K和/或PIKK抑制劑、包含其的抗體藥物偶聯物(ADC)、其製備方法及其用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to the field of biopharmaceuticals, in particular to novel PI3K and/or PIKK inhibitors, antibody-drug conjugates (ADCs) comprising the same, methods of preparing the same, and uses thereof.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1289" publication-number="202613171"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613171.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613171</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120334</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種新穎的抗體複合體及其用途</chinese-title>  
        <english-title>NOVEL ANTIBODY CONJUGATE, AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/28</main-classification>  
        <further-classification edition="200601120260102B">C07K16/30</further-classification>  
        <further-classification edition="200601120260102B">C07D491/22</further-classification>  
        <further-classification edition="201701120260102B">A61K47/68</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>育世博生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACEPODIA BIOTECHNOLOGIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭世嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, SHIH-CHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李皓剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HAO-KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴政威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, CHENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李春霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供新穎抗體複合體，其具有包含輕鏈的抗體或其抗原結合片段，其中第一功能單元和第二功能單元分別與輕鏈表面上的第一胺基酸殘基和第二胺基酸殘基偶聯。另提供此類抗體複合體的製備方法及其在治療中的使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are novel antibody conjugates having an antibody or antigen-binding fragment thereof that comprises a light chain, wherein a first functional unit and a second functional unit are conjugated to a first amino acid residue and a second amino acid residue on a surface of the light chain, respectively. Method to produce such antibody conjugates and methods of uses thereof in therapies are also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">C:半胱胺酸殘基</p>  
        <p type="p">X:離胺酸殘基或酪胺酸殘基</p>  
        <p type="p">L1:第一連接子殘基</p>  
        <p type="p">D1:第一功能部分</p>  
        <p type="p">L2:第二連接子殘基</p>  
        <p type="p">D2:第二功能部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1290" publication-number="202613172"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613172.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613172</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120336</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗CDH17抗體、綴合物及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/28</main-classification>  
        <further-classification edition="200601120260102B">C07D491/22</further-classification>  
        <further-classification edition="201701120260102B">A61K47/68</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇先聲生物製藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU SIMCERE BIOLOGICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成廣存</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>付雅媛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李楨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐任宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及一種靶向人CDH17的抗體、其藥物偶聯物 (ADC)及其應用。具體而言，本公開涉及一種特異性結合人CDH17的人源化抗體，尤其是靶向人CDH17的抗體-藥物偶聯物。本發明的抗體及抗體-藥物偶聯物對例如胃癌、結直腸癌、胰腺癌，特別是結直腸癌具有優異的殺傷效果，並具有優良的PK性質，對開發CDH17靶向治療具有重要意義。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1291" publication-number="202613699"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613699.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613699</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120338</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>投影裝置及包括其之電子裝置</chinese-title>  
        <english-title>PROJECTION DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">G03B21/28</main-classification>  
        <further-classification edition="200601120251219B">G03B21/20</further-classification>  
        <further-classification edition="200601120251219B">H04N9/31</further-classification>  
        <further-classification edition="200601120251219B">G02B5/04</further-classification>  
        <further-classification edition="200601120251219B">G02B26/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金志晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JI SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳知恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, JI EUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池正龜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, JUNG GOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種投影裝置，包含：一光源單元，配置為朝一第一方向發射光線；一光調製器，配置為調製及反射光線；以及一第一棱鏡，設置於該光源單元與該光調製器之間，其中該第一棱鏡包含一第一層、一第二層及一第三層，且該第一層至第三層於垂直於該第一方向之一第二方向上相互重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments disclose a projection device including a light source unit configured to emit light in a first direction, a light modulator configured to modulate and reflect the light, and a first prism disposed between the light source unit and the light modulator, wherein the first prism includes a first layer, a second layer, and a third layer, and the first to third layers overlap each other in a second direction perpendicular to the first direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:投影裝置</p>  
        <p type="p">210:外殼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1292" publication-number="202612685"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612685.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612685</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120361</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含唑化合物之組合物</chinese-title>  
        <english-title>OXAZOLE COMPOUND-CONTAINING COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/421</main-classification>  
        <further-classification edition="200601120260102B">A61K9/12</further-classification>  
        <further-classification edition="200601120260102B">A61K9/08</further-classification>  
        <further-classification edition="200601120260102B">A61K47/10</further-classification>  
        <further-classification edition="200601120260102B">A61K47/14</further-classification>  
        <further-classification edition="200601120260102B">A61K47/08</further-classification>  
        <further-classification edition="201701120260102B">A61K47/44</further-classification>  
        <further-classification edition="200601120260102B">A61P17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大塚製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKA PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本健悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, KENGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三輪泰司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIWA, YASUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松田貴邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDA, TAKAKUNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[問題] &lt;br/&gt;本發明提供一種包含地法米司特(difamilast)之組合物，其具有極佳皮膚滲透性(且較佳易於擴散及具有低皮膚刺激)。 &lt;br/&gt;[解決方案] &lt;br/&gt;一種液態組合物，其包含(A)地法米司特，(B)選自由二乙二醇單乙醚、N-甲基-2-吡咯啶酮(N-methyl-2-pyrrolidone；NMP)、丙二醇及1,3-丁二醇組成之群的至少一者，(C)液態烴，及(D)油脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">[Problem] &lt;br/&gt;Provided is a difamilast-containing composition that has excellent skin permeability (and preferably is easy to spread and has low skin irritation). &lt;br/&gt;[Means for Solution] &lt;br/&gt;A liquid composition comprising (A) difamilast, (B) at least one selected from the group consisting of diethylene glycol monoethyl ether, N-methyl-2-pyrrolidone (NMP), propylene glycol, and 1,3-butylene glycol, (C) liquid hydrocarbon, and (D) fat and oil.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1293" publication-number="202612731"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612731.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612731</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120375</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種CLDN18.2/4-1BB結合蛋白的醫藥組成物及其醫藥用途</chinese-title>  
        <english-title>A PHARMACEUTICAL COMPOSITION OF CLDN18.2/4-1BB BINDING PROTEIN AND PHARMACEUTICAL USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K39/395</main-classification>  
        <further-classification edition="200601120260102B">C07K16/28</further-classification>  
        <further-classification edition="200601120260102B">A61K47/22</further-classification>  
        <further-classification edition="200601120260102B">A61K47/26</further-classification>  
        <further-classification edition="200601120260102B">A61K47/18</further-classification>  
        <further-classification edition="200601120260102B">A61K9/19</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商蘇州盛迪亞生物醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZHOU SUNCADIA BIOPHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江甜甜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, TIANTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊喜琴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, XIQIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童紅飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG, HONGFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王宏偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HONGWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露涉及一種CLDN18.2/4-1BB結合蛋白的醫藥組成物及其醫藥用途。具體而言，本揭露涉及一種包含CLDN18.2/4-1BB結合蛋白的醫藥組成物，其包含CLDN18.2/4-1BB結合蛋白和緩衝劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure relates to a pharmaceutical composition of CLDN18.2/4-1BB binding protein and pharmaceutical use thereof. Specifically, the present disclosure relates to a pharmaceutical composition comprising CLDN18.2/4-1BB binding protein, which comprises CLDN18.2/4-1BB binding protein and a buffering agent.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1294" publication-number="202614418"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614418.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614418</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120376</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體結構</chinese-title>  
        <english-title>SEMICONDUCTOR STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">H01L23/498</main-classification>  
        <further-classification edition="200601120251216B">H01L23/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱桑茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, SANG-MAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林義傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, WEN-SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳麒元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王凱正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, KAI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林世欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIH-CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝亞叡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, YA-JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種半導體結構。該半導體結構包括基板。該基板包括核、導電材料、高k介電材料和重分佈層。該核具有第一孔、第二孔和穿過該核的第三孔。設置在該第一孔中的導電材料作為電容器的第一電極，設置在該第二孔中的導電材料作為該電容器的第二電極。該高k介電材料設置在該第三孔中並作為該電容器的介電材料。該高k介電材料的介電常數高於該核的介電常數。該重分佈層設置在該核上並連接到該第一孔中的導電材料和該第二孔中的導電材料中的至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor structure is provided. The semiconductor structure includes a substrate. The substrate includes a core, a conductive material, a high-k dielectric material, and a redistribution layer. The core has a first hole, a second hole, and a third hole passing through it. The conductive material disposed in the first hole acts as a first electrode of a capacitor, the conductive material disposed in the second hole acts as a second electrode of the capacitor. The high-k dielectric material is disposed in the third hole and acts as a dielectric material of the capacitor. The dielectric constant of the high-k dielectric material is higher that the dielectric constant of the core. The redistribution layer is disposed on the core and connected to at least one of the conductive material in the first hole and the conductive material in the second hole.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500A:半導體結構</p>  
        <p type="p">200A:基板</p>  
        <p type="p">202:核</p>  
        <p type="p">204:導電材料</p>  
        <p type="p">206:高k介電材料</p>  
        <p type="p">202T:頂表面</p>  
        <p type="p">202B:底表面</p>  
        <p type="p">TH1、TH2、TH3:孔</p>  
        <p type="p">204-1、204-2:導電材料部分</p>  
        <p type="p">205:非導電材料</p>  
        <p type="p">205-1、205-2:非導電材料部分</p>  
        <p type="p">208-1、208-2:導電層</p>  
        <p type="p">210-1、210-2:絕緣層</p>  
        <p type="p">211:高k介電集成結構</p>  
        <p type="p">212-1、212-2:通孔</p>  
        <p type="p">220-1、220-2:重分佈層</p>  
        <p type="p">222:通孔</p>  
        <p type="p">224:導電線</p>  
        <p type="p">226:絕緣層</p>  
        <p type="p">230-1、230-2:阻焊層</p>  
        <p type="p">CA1:電容器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1295" publication-number="202612787"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612787.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612787</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120382</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>塗佈頭及塗佈裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">B05C5/00</main-classification>  
        <further-classification edition="200601120251230B">B05D1/26</further-classification>  
        <further-classification edition="202101120251230B">G03B19/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＰＦＡ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷佳洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASE, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松村健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMURA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷川弘和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEGAWA, HIROKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種於為更小型的同時能夠變更噴嘴的朝向的塗佈頭及塗佈裝置。將糊塗佈於電子零件的塗佈頭12包括：噴嘴40，向基板100噴出糊110；分配器30，向所述噴嘴40供給糊110；及旋轉機構64，使所述噴嘴40相對於所述分配器30繞軸旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:分配器</p>  
        <p type="p">32:本體</p>  
        <p type="p">36:連結構件</p>  
        <p type="p">38:貫通孔</p>  
        <p type="p">39:密封構件</p>  
        <p type="p">40:噴嘴</p>  
        <p type="p">42:第一噴嘴片</p>  
        <p type="p">44:第二噴嘴片</p>  
        <p type="p">46:凸緣</p>  
        <p type="p">48:第一板部</p>  
        <p type="p">50:接收口</p>  
        <p type="p">52:引導孔</p>  
        <p type="p">56:中繼間隙</p>  
        <p type="p">58:噴出口</p>  
        <p type="p">64:旋轉機構</p>  
        <p type="p">66:旋轉體</p>  
        <p type="p">68:收容孔</p>  
        <p type="p">70:軸承</p>  
        <p type="p">72:第一滑輪</p>  
        <p type="p">74:第二滑輪</p>  
        <p type="p">76:傳遞帶</p>  
        <p type="p">80:旋轉馬達</p>  
        <p type="p">82:基底板</p>  
        <p type="p">Ac:軸</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1296" publication-number="202613309"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613309.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613309</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120383</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抑制ＶＥＧＦＡ基因和ＡＮＧ－２基因表現的雙靶核酸分子</chinese-title>  
        <english-title>DUAL-TARGETING NUCLEIC ACID MOLECULE INHIBITING VEGFA AND ANG-2 GENE EXPRESSION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260102B">C12N15/113</main-classification>  
        <further-classification edition="200601120260102B">A61K31/713</further-classification>  
        <further-classification edition="200601120260102B">A61P27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商石藥集團中奇製藥技術（石家莊）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CSPC ZHONGQI PHARMACEUTICAL TECHNOLOGY (SHIJIAZHUANG) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石延君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, YAN-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雪艷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XUE-YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵昱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAO, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙成龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, CHENG-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王凌宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LING-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇曉曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, XIAO-YE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐海亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, HAI-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, HU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李春雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHUN-LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及一種抑制vegfa基因和ang-2基因表現的雙靶核酸分子，此連接子包含2-10個核苷酸或無鹼基核苷酸，其用於連接兩個相互獨立的寡核苷酸，所述連接子中的一個或多個核苷酸或無鹼基核苷酸上包含親脂性部分，所述親脂性部分為C&lt;sub&gt;12-26&lt;/sub&gt;的飽和或不飽和烴鏈。相比於此特定親脂性修飾位於雙核酸分子結構被連接起來的兩部分內部時，特定的親脂性修飾位於連接子上時，核酸分子藥效更佳，療效更持久。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to a dual-target nucleic acid molecule that inhibits the expression of the VEGFA gene and the ANG-2 gene. The molecule comprises a linker containing 2–10 nucleotides or abasic nucleotides, which is used to connect two independent oligonucleotides. One or more nucleotides or abasic nucleotides in the linker bear a lipophilic moiety consisting of a C₁₂–C₂₆ saturated or unsaturated hydrocarbon chain. Compared with placing the specific lipophilic modification inside the two joined segments of the dual nucleic acid structure, positioning this specific lipophilic modification within the linker yields superior pharmacological efficacy and longer-lasting therapeutic effects.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1297" publication-number="202612904"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612904.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612904</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120399</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於二異烯基芳烴之共聚物之層壓體</chinese-title>  
        <english-title>LAMINATES BASED ON COPOLYMERS OF DIISOALKENYLARENES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B32B15/082</main-classification>  
        <further-classification edition="200601120251231B">B32B7/12</further-classification>  
        <further-classification edition="200601120251231B">B32B15/20</further-classification>  
        <further-classification edition="200601120251231B">B32B17/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商諾塔克有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOTARK CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姆賀塔爾　維杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MHETAR, VIJAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田　傑森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, JASON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種多層層壓體，其包括多個金屬箔層及多個介電(絕緣)層。至少一個絕緣層包括含有二異丁基芳烴(DIAEA)及二乙烯基芳烴(DVA)單元的共聚物，其視情況地與填料及/或另一種介電聚合物結合。另一絕緣層包括不同於DIAEA-DVA共聚物的另一種介電聚合物。至少一個含共聚物的絕緣層與金屬箔層相鄰佈置。所述共聚物層增強了高溫下的熱穩定性，並提供了改良的電性能，例如降低的介電常數(Dk)及耗散因數(Df)，以及優異的加工性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates to a multi-layered laminate comprising multiple metal foil layers and multiple dielectric (insulating) layers. At least one of the insulating layers includes a copolymer containing diisoalkenylarene (DIAEA) and divinylarene (DVA) units, optionally combined with a filler and/or another dielectric polymer. Another insulating layer includes another dielectric polymer distinct from the DIAEA-DVA copolymer. At least one copolymer-containing insulating layer is positioned adjacent to a metal foil layer. This copolymer layer enhances thermal stability at elevated temperatures and provides improved electrical performance—such as reduced dielectric constant (Dk) and dissipation factor (Df)—along with excellent processability.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1298" publication-number="202613130"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613130.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613130</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120400</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＳＴＩＮＧ促效劑免疫刺激性抗體藥物結合物</chinese-title>  
        <english-title>STING AGONIST IMMUNOSTIMULATORY ANTIBODY DRUG CONJUGATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D491/22</main-classification>  
        <further-classification edition="200601120260102B">C07D403/12</further-classification>  
        <further-classification edition="200601120260102B">C07K16/30</further-classification>  
        <further-classification edition="201701120260102B">A61K47/68</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商安斯泰來製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASTELLAS PHARMA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱祥偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, XIANGWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡　慧勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, HUIYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴朱里　克里希納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAJJURI, KRISHNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多西　卡沙瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOSHI, KSHAMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費爾南德斯　瓦迪　丹尼爾　馬豪德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FERNANDEZ, WADIE DANIEL MAHAUAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>EC</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加卡爾　阿曼迪普　考爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAKHAL, AMANDEEP KAUR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>基弗爾　海倫娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIEFEL, HELENA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　曉凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XIAOFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯巴斯　沃納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUBAS, WERNER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛格　拉維　普拉卡什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, RAVI PRAKASH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>温　淼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, MIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊俊豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JUNHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>殷鋼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於包含至少一種STING促效劑及至少一種細胞毒性劑之雙重有效負載免疫刺激性抗體藥物結合物、其醫藥組合物，以及該等雙重有效負載免疫刺激性抗體藥物結合物及其組合物用於治療包括增生性疾病之疾病及病症的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is related to dual payload immunostimulatory antibody drug conjugates comprising at least STING agonist and at least one cytotoxic agent, pharmaceutical compositions thereof, and the use of the dual payload immunostimulatory antibody drug conjugates and compositions thereof for the treatment of diseases and disorders, including proliferative diseases.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1299" publication-number="202613126"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613126.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613126</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120419</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>稠合雜環衍生物及其在醫藥上的應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D487/18</main-classification>  
        <further-classification edition="200601120260102B">C07D487/22</further-classification>  
        <further-classification edition="200601120260102B">C07D495/22</further-classification>  
        <further-classification edition="200601120260102B">C07D471/22</further-classification>  
        <further-classification edition="200601120260102B">A61K31/55</further-classification>  
        <further-classification edition="200601120260102B">A61P29/00</further-classification>  
        <further-classification edition="200601120260102B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商海思科醫藥集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAISCO PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃江坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, JIANGKUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃清平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, QINGPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孟慶元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MENG, QINGYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐平明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, PINGMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李瑤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴龐科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, PANGKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種稠合雜環衍生物及其在醫藥上的應用，涉及一種通式(I)所述的化合物或其消旋體、立體異構體、互變異構體、藥學上可接受的鹽，及其中間體和製備方法，以及在製備治療自身免疫性疾病或炎性疾病的藥物中的應用。 &lt;br/&gt;&lt;img align="absmiddle" height="166px" width="268px" file="ed10994.JPG" alt="ed10994.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; 。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1300" publication-number="202614587"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614587.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614587</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120442</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理設備、由設備進行之方法以及包含指令的電腦可讀媒體</chinese-title>  
        <english-title>PROCESSING APPARATUS, METHOD PERFORMED BY APPARATUS AND COMPUTER READABLE MEDIUM COMPRISING INSTRUCTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251229B">H04L1/18</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬蘭商諾基亞科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOKIA TECHNOLOGIES OY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德蓋爾　馬薩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEGHEL, MATHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡哥　克勞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUGL, KLAUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供有一種設備。該設備包含：取得處於不連續傳送之一小區之一或多個非作動期之資訊用的構件；為該設備接收至少一個資源分配用的構件；確定與該小區之該一或多個非作動期完全或部分重疊之該至少一個資源分配之一或多個資源用的構件；以及至少部分地基於確定與該小區之該一或多個非作動期完全或部分重疊之該至少一個資源分配之一或多個資源來組配一混合自動重複請求確認碼本用的構件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided an apparatus. The apparatus comprises: means for obtaining information of one or more non-active periods of a cell that is in discontinuous transmission; means for receiving at least one resource allocation for the apparatus; means for determining one or more resources of the at least one resource allocation that overlap fully or in part with the one or more non-active periods of the cell; and means for configuring a hybrid automatic repeat request acknowledgement codebook based at least in part on the determining one or more resources of the at least one resource allocation that overlap fully or in part with the one or more non-active periods of the cell.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">310:UE</p>  
        <p type="p">320:gNB</p>  
        <p type="p">S301:步驟</p>  
        <p type="p">S302:步驟</p>  
        <p type="p">S303:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1301" publication-number="202614205"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614205.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614205</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120495</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔方法及電漿處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">H01L21/3065</main-classification>  
        <further-classification edition="200601120251231B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤悠貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今橋拓巳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAHASHI, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">清潔方法係電漿處理裝置的清潔方法，其係具有：支撐工序，其係於配置在腔室內且具備支撐基板的第1區域、及支撐邊緣環的第2區域之基板支撐器，支撐基板的工序；調整工序，其係藉由控制連接於設在第2區域內的阻抗調整電極的阻抗調整機構，以使第2區域的電位低於第1區域的電位的方式，來調整阻抗調整電極的電位的工序；供給工序，其係對腔室內供給清潔氣體的工序；生成工序，其係對腔室內供給電漿生成用的高頻電力而由清潔氣體來生成電漿的工序；及清潔工序，其係對腔室內供給偏壓電力來清潔腔室內的構件的工序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電漿處理裝置</p>  
        <p type="p">2:控制部</p>  
        <p type="p">2a:電腦</p>  
        <p type="p">2a1:處理部</p>  
        <p type="p">2a2:記憶部</p>  
        <p type="p">2a3:通訊介面</p>  
        <p type="p">10:電漿處理腔室</p>  
        <p type="p">11:基板支撐部</p>  
        <p type="p">12:電漿生成部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1302" publication-number="202613563"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613563.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613563</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120498</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>管狀彈簧探針</chinese-title>  
        <english-title>BARRELED SPRING PROBE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G01R1/067</main-classification>  
        <further-classification edition="201101120260102B">H01R12/70</further-classification>  
        <further-classification edition="200601120260102B">H01R13/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商史密斯英特康美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITHS INTERCONNECT AMERICAS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商安拓銳高新測試技術（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANTARES ADVANCED TEST TECHNOLOGIES (SUZHOU) LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　家春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, JIACHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱志霞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, ZHIXIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉姆齊　詹姆斯　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMSEY, JAMES M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種彈簧探針。該彈簧探針包含包括一第一組滑動指狀物之一第一導電觸點。該彈簧探針進一步包含一第二導電觸點，該第二導電觸點與該第一導電觸點同軸定位且包含經構形以當該彈簧探針處於一軸向壓縮位置中時接合該第一組滑動指狀物之一第二組滑動指狀物。該彈簧探針進一步包含與該第一導電觸點及該第二導電觸點同軸定位之一管，其中該第一導電觸點及該第二導電觸點可相對於該管軸向平移。該彈簧探針進一步包含安置於該管內且經構形以自該軸向壓縮位置軸向向外偏置該第一導電觸點及該第二導電觸點之一彈簧。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A spring probe is provided. The spring probe includes a first conductive contact including a first set of sliding fingers. The spring probe further includes a second conductive contact positioned coaxially with the first conductive contact and including a second set of sliding fingers configured to engage the first set of sliding fingers when the spring probe is in an axially compressed position. The spring probe further includes a barrel positioned coaxially with the first conductive contact and the second conductive contact, wherein the first conductive contact and the second conductive contact are axially translatable with respect to the barrel. The spring probe further includes a spring disposed within the barrel and configured to bias the first conductive contact and the second conductive contact axially outward from the axially compressed position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:彈簧探針</p>  
        <p type="p">202:第一或「上」導電觸點</p>  
        <p type="p">204:第二或「下」導電觸點</p>  
        <p type="p">208:第一組滑動指狀物</p>  
        <p type="p">210:第二組滑動指狀物</p>  
        <p type="p">212:管</p>  
        <p type="p">214:內腔</p>  
        <p type="p">216:上開口</p>  
        <p type="p">218:下開口</p>  
        <p type="p">220:彈簧</p>  
        <p type="p">222:肩部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1303" publication-number="202613619"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613619.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613619</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120500</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於包括光子積體電路的共封裝裝置的可重配置光學互連</chinese-title>  
        <english-title>RECONFIGURABLE OPTICAL INTERCONNECTS FOR CO-PACKAGED DEVICES INCLUDING PHOTONIC INTEGRATED CIRCUITS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">G02B6/12</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多桑姆　歐陸菲米Ｉ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOSUNMU, OLUFEMI I.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊子蛟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, ZIJIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅晉欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, JINXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">系統包括光學互連和一組整合在光學互連內的光子積體電路（PIC）。該光學互連包括複數個光開關、複數個多工器和複數個光分割器組。複數個多工器中的每個多工器與該組光開關中的每個光開關相連接，而複數個光分割器組中的每組光分割器則與複數個多工器中的各自多工器相連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system includes an optical interconnect and a set of photonic integrated circuits (PICs) integrated within the optical interconnect. The optical interconnect includes a plurality of optical switches, a plurality of multiplexers, and a plurality of sets of optical splitters. Each multiplexer of the plurality of multiplexers is coupled to each optical switch of the set of optical switches, and each set of optical splitters of the plurality of sets of optical splitters is coupled to a respective multiplexer of the plurality of multiplexers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">140-1:互連</p>  
        <p type="p">150:光子積體電路(PIC)</p>  
        <p type="p">200:系統</p>  
        <p type="p">210-1:光開關</p>  
        <p type="p">210-2:光開關</p>  
        <p type="p">210-3:光開關</p>  
        <p type="p">210-&lt;i&gt;n&lt;/i&gt;:光開關</p>  
        <p type="p">215-1:波導</p>  
        <p type="p">215-2:波導</p>  
        <p type="p">215-3:波導</p>  
        <p type="p">220-1:多工器</p>  
        <p type="p">220-2:多工器</p>  
        <p type="p">220-3:多工器</p>  
        <p type="p">230:光分割器組</p>  
        <p type="p">240:光分割器組</p>  
        <p type="p">250:光分割器組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1304" publication-number="202613070"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613070.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613070</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120522</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聯菲二羧酸化合物</chinese-title>  
        <english-title>BIPHENANTHRENE DICARBOXYLIC ACID COMPOUND</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C07C69/712</main-classification>  
        <further-classification edition="200601120251229B">C07C67/31</further-classification>  
        <further-classification edition="200601120251229B">C07C67/52</further-classification>  
        <further-classification edition="200601120251229B">C08G63/187</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商本州化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONSHU CHEMICAL INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小寺雅斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KODERA, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圓井邦昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUI, KUNIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤宣之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, NORIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供一種新穎二羧酸化合物，其折射率優異且熱穩定性亦優異。本發明之解決手段為提供一種通式(1)所示之聯菲二羧酸化合物， &lt;br/&gt;&lt;img align="absmiddle" height="218px" width="303px" file="ed10037.JPG" alt="ed10037.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，R&lt;sub&gt;1&lt;/sub&gt;各自獨立地表示氫原子、甲基或乙基)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to provide a novel dicarboxylic acid compound having excellent thermal stability in addition to a refractive index. As a solution, a biphenanthrene dicarboxylic acid compound represented by the general formula (1) is provided. &lt;br/&gt;&lt;img align="absmiddle" height="204px" width="291px" file="ed10038.JPG" alt="ed10038.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(In the formula, each R&lt;sub&gt;1&lt;/sub&gt; independently represents a hydrogen atom, a methyl group or an ethyl group).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1305" publication-number="202614353"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614353.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614353</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120523</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於具備供可調式低溫脫離製程用的熱活化填料之靜電夾盤總成之彈性體接合方法</chinese-title>  
        <english-title>ELASTOMER BOND METHOD FOR ELECTROSTATIC CHUCK ASSEMBLIES WITH THERMALLY ACTIVATED FILLERS FOR ADJUSTABLE LOW TEMPERATURE DEBONDING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">H01L21/687</main-classification>  
        <further-classification edition="200601120251231B">H01L21/683</further-classification>  
        <further-classification edition="200601120251231B">C09J183/04</further-classification>  
        <further-classification edition="200601120251231B">C09J11/04</further-classification>  
        <further-classification edition="200601120251231B">C08K3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商瓦特洛威電子製造公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATLOW ELECTRIC MANUFACTURING COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>包蒂斯塔　克里斯多福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAUTISTA, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法勒　理查</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHALER, RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬德森　泰瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MADSON, TERRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種接合總成包括一第一組件、一第二組件、以及結合該第一組件至該第二組件的一接合層。該接合層包括一接合組成物，其具有一聚矽氧彈性體及均勻地分散在整個該聚矽氧彈性體中的可膨脹石墨(EG)粉。該EG粉係具該接合組成物的約1.0至約5.0wt.%的量且具有約400µm 的一平均粒徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bonded assembly includes a first component, a second component, and a bond layer joining the first component to the second component. The bond layer includes a bonding composition that has a silicone elastomer and expandable graphite (EG) powder uniformly dispersed throughout the silicone elastomer. The EG powder is in an amount of about 1.0 to about 5.0 wt.% of the bonding composition and has an average particle size of about 400 µm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:接合總成</p>  
        <p type="p">22:第一組件</p>  
        <p type="p">24:第二組件</p>  
        <p type="p">26:接合層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1306" publication-number="202614467"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614467.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614467</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120526</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括雙側冷卻電池組模組之能量儲存系統</chinese-title>  
        <english-title>ENERGY STORAGE SYSTEM INCLUDING DUAL SIDE COOLED BATTERY MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251223B">H01M10/613</main-classification>  
        <further-classification edition="201401120251223B">H01M10/653</further-classification>  
        <further-classification edition="201401120251223B">H01M10/6557</further-classification>  
        <further-classification edition="202101120251223B">H01M50/204</further-classification>  
        <further-classification edition="202101120251223B">H01M50/367</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商富安能源有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLUENCE ENERGY, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施羅德　貝絲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHROEDER, BETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮特里　喬丹　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETRIE, JORDAN DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史特朗　卡拉漢　凱瑟琳　科琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRENG CALLAHAN, KATHRYN CORINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種能量儲存系統包括一電池組包及在電池組包內配置的複數個電池組模組。複數個電池組模組之各者包括一電池組模組外殼、在電池組模組外殼內配置的複數個電池組電池、及在複數個電池組模組之各者內配置的複數個冷板。複數個電池組電池配置在複數個層中，且複數個冷板中之至少一者相鄰於複數個層中之一者的底側之一者配置，且複數個冷板中之至少另一者相鄰於複數個層中之一者的頂側配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An energy storage system includes a battery pack, and a plurality of battery modules arranged within the battery pack. Each of the plurality of battery modules includes a battery module enclosure, a plurality of battery cells arranged within the battery module enclosure, and a plurality of cold plates arranged within each of the plurality of battery modules. The plurality of battery cells is arranged in a plurality of layers, and at least one of the plurality of cold plates is arranged adjacent to one of a bottom side of one of the plurality of layers, and at least another of the plurality of cold plates is arranged adjacent to a top side of the one of the plurality of layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1307" publication-number="202614471"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614471.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614471</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120528</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括具有整合式子模組支撐件之深抽托盤之能量儲存系統</chinese-title>  
        <english-title>ENERGY STORAGE SYSTEM INCLUDING DEEP DRAWN TRAYS WITH INTEGRATED SUBMODULE SUPPORTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251217B">H01M50/242</main-classification>  
        <further-classification edition="201401120251217B">H01M10/613</further-classification>  
        <further-classification edition="201401120251217B">H01M10/6554</further-classification>  
        <further-classification edition="202101120251217B">H01M50/209</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商富安能源有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLUENCE ENERGY, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮特里　喬丹　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETRIE, JORDAN DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史特朗　卡拉漢　凱瑟琳　科琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRENG CALLAHAN, KATHRYN CORINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種能量儲存外殼包括：一電池組包；複數個電池組模組，其等配置於該電池組包內；及複數個電池組子模組，其等配置於該複數個電池組模組之各者內。該複數個子模組之各者包括一托盤及配置於該托盤內之複數個子模組電池堆疊。該托盤包括：一底部部分，其相鄰於該複數個子模組電池堆疊之一底側；及一壁部分，其自該底部部分之一周邊向上延伸至一凸緣部分，該凸緣部分自該壁部分向外延伸。一第一電池擴增部分支撐件固定地附接至該托盤之該底部部分之一內表面。一第二電池擴增部分支撐件固定地附接至該托盤之該底部部分之一內表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An energy storage enclosure includes a battery pack, a plurality of battery modules arranged within the battery pack, and a plurality of battery submodules arranged within each of the plurality of battery modules. Each of the plurality of submodules includes a tray, and a plurality of submodule cell stacks arranged within the tray. The tray includes a bottom portion adjacent to a bottom side of the plurality of submodule cell stacks and a wall portion extending upwardly from a perimeter of the bottom portion to a flange portion extending outwardly from the wall portion. A first cell expansion support is fixedly attached to an inside surface of the bottom portion of the tray. A second cell expansion support is fixedly attached to an inside surface of the bottom portion of the tray.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1308" publication-number="202614468"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614468.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614468</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120529</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括整合式結構子組件之能量儲存系統</chinese-title>  
        <english-title>ENERGY STORAGE SYSTEM INCLUDING AN INTEGRATED STRUCTURAL SUBCOMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251223B">H01M10/613</main-classification>  
        <further-classification edition="201401120251223B">H01M10/6556</further-classification>  
        <further-classification edition="202101120251223B">H01M50/204</further-classification>  
        <further-classification edition="202101120251223B">H01M50/238</further-classification>  
        <further-classification edition="202101120251223B">H01M50/242</further-classification>  
        <further-classification edition="202101120251223B">H01M50/244</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商富安能源有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLUENCE ENERGY, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史特朗　卡拉漢　凱瑟琳　科琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRENG CALLAHAN, KATHRYN CORINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮特里　喬丹　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETRIE, JORDAN DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種能量儲存外殼包括一電池組包、配置在該電池組包內之複數個電池組模組、配置在該等電池組模組之各者內之複數個電池組子模組、及配置在該複數個電池組子模組之各者內之複數個電池組電池。該等電池組子模組之各者包括一結構子組件，該結構子組件具有一第一結構板、一第二結構板、固定地附接至該第一結構板及該第二結構板之一第一結構端板、及固定地附接至該第一結構板及該第二結構板之一第二結構端板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An energy storage enclosure including a battery pack, a plurality of battery modules arranged within the battery pack, a plurality of battery submodules arranged within each of the battery modules, and a plurality of battery cells arranged within each of the plurality of battery submodules. Each of the battery submodules includes a structural subcomponent having a first structural plate, a second structural plate, a first structural end plate fixedly attached to the first structural plate and the second structural plate, and a second structural end plate fixedly attached to the first structural plate and the second structural plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1309" publication-number="202613106"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613106.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613106</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120531</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新穎共晶</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D413/12</main-classification>  
        <further-classification edition="200601120260102B">C07C39/04</further-classification>  
        <further-classification edition="200601120260102B">C07C39/08</further-classification>  
        <further-classification edition="200601120260102B">C07C39/10</further-classification>  
        <further-classification edition="200601120260102B">C07C39/14</further-classification>  
        <further-classification edition="200601120260102B">C07C47/58</further-classification>  
        <further-classification edition="200601120260102B">C07C49/603</further-classification>  
        <further-classification edition="200601120260102B">C07C55/10</further-classification>  
        <further-classification edition="200601120260102B">C07C57/15</further-classification>  
        <further-classification edition="200601120260102B">C07C57/145</further-classification>  
        <further-classification edition="200601120260102B">C07C59/245</further-classification>  
        <further-classification edition="200601120260102B">C07C59/255</further-classification>  
        <further-classification edition="200601120260102B">C07C65/10</further-classification>  
        <further-classification edition="200601120260102B">C07C229/56</further-classification>  
        <further-classification edition="200601120260102B">C07C323/22</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4245</further-classification>  
        <further-classification edition="200601120260102B">A61P31/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商瑪路弘股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUHO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川﨑唯登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>乙黑沙織</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTOGURO, SAORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北川宙輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAGAWA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>櫻井尚之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKURAI, NAOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林勇太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>深水啓朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKAMI, TOSHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弓指好惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUMISASHI, YOSHIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種具有優異溶解性的阿莫奈韋(Amenamevir)之新穎共晶。&lt;br/&gt; 本發明提供一種共晶，其係構成自阿莫奈韋及共晶形成物(Coformer)之共晶，該共晶形成物係選自於由下述者所構成的群組之1種以上：琥珀酸、L-蘋果酸、D-蘋果酸、L-酒石酸、D-酒石酸、反丁烯二酸、順丁烯二酸、苯酚、柳酸、D-樟腦、1-萘酚、2-萘酚、苯并三唑、香草醛、鄰胺苯甲酸、硫代蘋果酸、五倍子酚、氫醌、利多卡因(Lidocaine)、氯甲苯酚、氯丁醇、鄰苯二酚、間苯二酚、鄰甲苯酚、間甲苯酚、對甲苯酚、1,2,4-三羥基苯、1,3,5-三羥基苯及4-甲基鄰苯二酚。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1310" publication-number="202614198"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614198.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614198</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120535</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用金屬塗布的處理頭改善半導體基板的濕式處理之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS THAT UTILIZE METAL-COATED PROCESSING HEADS TO IMPROVE WET PROCESSING OF SEMICONDUCTOR SUBSTRATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">H01L21/306</main-classification>  
        <further-classification edition="200601120251223B">H01L21/311</further-classification>  
        <further-classification edition="200601120251223B">H01L21/3213</further-classification>  
        <further-classification edition="200601120251223B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡　山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供使用金屬輔助化學蝕刻(metal assisted chemical etching，MacEtch)處理半導體基板之濕式處理系統及方法的諸多實施例。所揭示實施例使用具有一或更多金屬表面的處理頭(本文亦稱為金屬塗布的處理頭)催化在基板表面暴露於蝕刻溶液時發生於處理頭之金屬表面與半導體基板之表面之間的介面處的MacEtch反應。金屬塗布的處理頭可用以在基板表面上及/或在半導體基板內執行各式各樣的MacEtch製程。舉例而言，金屬塗布的處理頭可用以在半導體基板內蝕刻特徵部(例如孔洞、溝槽、圓盤等)，或移除基板表面上之高點以使基板表面平滑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various embodiments of wet processing systems and methods that utilize metal assisted chemical etching (MacEtch) to process a semiconductor substrate are provided herein. The disclosed embodiments utilize a processing head having one or more metal surfaces (otherwise referred to herein as a metal-coated processing head) to catalyze the MacEtch reactions that occur at the interface between the metal surface(s) of the processing head and the surface of a semiconductor substrate when the substrate surface is exposed to an etch solution. The metal-coated processing head can be used to perform a wide variety of MacEtch processes on the substrate surface and/or within the semiconductor substrate. For example, the metal-coated processing head can be used to etch features (such as, e.g., holes, trenches, circular disks, etc.) within the semiconductor substrate, or remove high points on substrate surface to smooth the substrate surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:方法</p>  
        <p type="p">210:步驟</p>  
        <p type="p">220:步驟</p>  
        <p type="p">230:步驟</p>  
        <p type="p">240:步驟</p>  
        <p type="p">250:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1311" publication-number="202613251"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613251.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613251</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120537</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藍光吸收化合物、膜、及包括其之顯示裝置</chinese-title>  
        <english-title>BLUE LIGHT ABSORBING COMPOUNDS, FILMS, AND DISPLAY DEVICES INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C09B57/08</main-classification>  
        <further-classification edition="200601120260102B">G02B5/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郑世俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, SHIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢默克　傑弗瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMMAKER, JEFFREY R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示可展現增強之耐久性的藍光吸收化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Blue light absorbing compounds which may exhibit increased durability are disclosed herein.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1312" publication-number="202614220"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614220.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614220</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120541</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金屬硬遮罩的蝕刻方法</chinese-title>  
        <english-title>METHOD FOR ETCHING A METAL HARD MASK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/311</main-classification>  
        <further-classification edition="200601120251226B">H01L21/768</further-classification>  
        <further-classification edition="200601120251226B">H01L21/3065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拜拉吉恩　約書亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAILLARGEON, JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種形成半導體裝置的方法包含接收一基板，於該基板上具有一金屬遮罩層，且在該金屬遮罩層上方具有第一遮罩層，其中該第一遮罩層係經圖案化而具有通往該金屬遮罩層的複數孔，且其中該金屬遮罩層包含鎢、矽及氮；使用第一化學品鈍化該等孔中之該金屬遮罩層的一表面，以在該金屬遮罩層之該表面上形成一鈍化層，其中該第一化學品包含硫及氫；以及以第二化學品執行一各向異性蝕刻，以移除在該等孔底部處之該鈍化層的第一鈍化部分以及該金屬遮罩層的第一金屬部分，以增加該金屬遮罩層中之該等孔的孔深度，以及其中該第二化學品包含硼及氯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for forming a semiconductor device can include receiving a substrate having a metal mask layer thereon and a first mask layer over the metal mask layer, where the first mask layer is patterned having holes that open to the metal mask layer, and where the metal mask layer contains tungsten, silicon, and nitrogen, passivating a surface of the metal mask layer in the holes using a first chemistry to form a passivation layer on the surface of the metal mask layer, where the first chemistry contains sulfur and hydrogen, and performing an anisotropic etch with a second chemistry to remove first passivation portions of the passivation layer and first metal portions of the metal mask layer at bottoms of the holes to increase hole depths of the holes in the metal mask layer, and where the second chemistry contains boron and chlorine.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1310:方塊</p>  
        <p type="p">1320:方塊</p>  
        <p type="p">1330:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1313" publication-number="202613296"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613296.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613296</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120547</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生物反應器及用於製造其之方法</chinese-title>  
        <english-title>BIOREACTORS AND METHODS FOR PRODUCING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C12M1/00</main-classification>  
        <further-classification edition="200601120260102B">C12M1/04</further-classification>  
        <further-classification edition="201501120260102B">B33Y80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商斯戴姆韋格公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAMM VEGH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波蒂利亞　祖尼加　奧馬爾　米格爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PORTILLA ZUNIGA, OMAR MIGUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CO</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布魯祖爾　耶格雷斯　耶穌　米格爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRUZUAL YEGRES, JESUS MIGUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利亞馬薩　維格　胡安　法蘭西斯科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LLAMAZARES VEGH, JUAN FRANCISCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛佩斯　巴勒莫　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOPEZ PALERMO, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷伊　佩德羅　尼古拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REY, PEDRO NICOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坎帕尼利　伊格納西奧　赫克托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAMPANILLI, IGNACIO HECTOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡巴萊羅　胡安　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CABALEIRO, JUAN MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供生物反應器及其製造方法。本揭露之生物反應器可包括巨觀結構，其包含形成複數個通道之複數個流體連接之迷你模組。通道可包含經組態以提供向該通道或自該通道之氣體擴散之氣體可滲透層。該巨觀結構可使用樹脂之三維列印來製造。該樹脂可包含可聚合組分、光引發劑、熱固化劑或其任何組合。微流體巨觀結構之一或多個表面可包含生物相容性塗層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides bioreactors and methods of producing the same. Bioreactors of the present disclosure may include a macrostructure comprising a plurality of fluidically connected minimodules that form a plurality of channels. A channel may comprise a gas permeable layer configured to provide gas diffusion to or from the channel. The macrostructure may be manufactured using three-dimensional printing of a resin. The resin may comprise a polymerizable component, photoinitiator, thermocuring agent, or any combination thereof. One or more surfaces of the microfluidic macrostructure may comprise a biocompatible coating.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:引發</p>  
        <p type="p">120:傳播</p>  
        <p type="p">130:終止</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1314" publication-number="202614206"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614206.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614206</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120550</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>循環式方向性/等向性蝕刻</chinese-title>  
        <english-title>CYCLIC DIRECTIONAL/ISOTROPIC ETCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/3065</main-classification>  
        <further-classification edition="200601120251226B">H01L21/67</further-classification>  
        <further-classification edition="200601120251226B">H01L21/311</further-classification>  
        <further-classification edition="200601120251226B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊文兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WENBING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李柏昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, BAICHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚忠魁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, ZHONGKUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIN, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加尼　尼古拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANI, NICOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOANG, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　暹華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, SAMANTHA SIAMHWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露了涉及在蝕刻特徵時控制特徵的寬度與深度關係的示例。其中一個示例提供了一種在基板上蝕刻特徵的方法。本方法包括執行多個蝕刻循環，每一蝕刻循環包括執行方向性蝕刻步驟，其中使用襯層形成物質沿著特徵的側壁形成襯層，以及執行等向性蝕刻步驟，以在特徵的蝕刻前端擴大特徵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Examples are disclosed that relate to controlling a width of a feature as a function of depth when etching the feature. One example provides a method of etching a feature in a substrate. The method comprises performing a plurality of etching cycles, each etching cycle comprising performing a directional etch step in which a liner is formed along a sidewall of the feature using a liner-forming substance, and performing an isotropic etch step to widen the feature at an etch front of the feature.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">302:步驟</p>  
        <p type="p">304:方塊</p>  
        <p type="p">306:步驟</p>  
        <p type="p">308:方塊</p>  
        <p type="p">310:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1315" publication-number="202612713"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612713.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612713</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120583</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用溶瘤病毒及轉導增強劑治療膀胱癌之方法</chinese-title>  
        <english-title>METHODS OF TREATING BLADDER CANCER USING AN ONCOLYTIC VIRUS AND A TRANSDUCTION-ENHANCING AGENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120260102B">A61K35/761</main-classification>  
        <further-classification edition="200601120260102B">C12N15/861</further-classification>  
        <further-classification edition="200601120260102B">C12N7/00</further-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="200601120260102B">A61K31/7068</further-classification>  
        <further-classification edition="200601120260102B">A61K48/00</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商永恆生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CG ONCOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡斯圖里　維杰　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASTURI, VIJAY K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>基根　柯克　Ａ　三世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEEGAN, KIRK A. III</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃裕煦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案提供用於患有膀胱癌之個體之方法，該等方法包括向該個體膀胱內投與溶瘤病毒，諸如克瑞托司替莫基因格拉納諾瑞普韋克(cretostimogene grenadenorepvec)，視情況與一或多種額外治療劑，諸如免疫檢查點調節劑或化學治療劑組合。亦提供用於治療膀胱癌之醫藥組合物及套組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides methods for individuals having bladder cancer comprising intravesically administering to the individual an oncolytic virus, such as cretostimogene grenadenorepvec, optionally in combination with one or more additional therapeutic agents, such as an immune checkpoint modulator or a chemotherapeutic agent. Also provided are pharmaceutical compositions and kits for treating bladder cancer.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1316" publication-number="202612958"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612958.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612958</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120599</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>手推車及托盤</chinese-title>  
        <english-title>STROLLER AND TRAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B62B9/26</main-classification>  
        <further-classification edition="200601120251229B">B62B7/06</further-classification>  
        <further-classification edition="200601120251229B">B62B7/14</further-classification>  
        <further-classification edition="200601120251229B">B62B9/20</further-classification>  
        <further-classification edition="200601120251229B">B62B9/12</further-classification>  
        <further-classification edition="200601120251229B">B62B9/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍夫曼Ｊｒ　赫伯特Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOFFMAN JR., HERBERT E</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿瑟諾　克萊爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARSENAULT, CLAIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝勒　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEILER, MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英格拉漢姆　傑瑞Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INGRAHAM, JERRY S</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">手推車組件和用於手推車的配件托盤組件，其中手推車組件可包括具有前腿以及第一和第二後腿的手推車框架。前腿具有與其連接的至少一個前輪。第一和第二後腿具有與其連接的後輪。後輪能圍繞後輪的水平旋轉軸線旋轉。後輪在向後方向上與至少一個前輪間隔開，該向後方向垂直於水平旋轉軸線。把手組件連接到前腿和後腿。把手組件包括定位在第一後輪與第二後輪之間的車把。車把與延伸穿過並垂直於水平旋轉軸線的豎直軸線對齊，或者與豎直軸線偏移，使得車把被定位成比水平旋轉軸線更靠近手推車框架的中心。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A stroller assembly can include a stroller frame with a front leg and first and second rear legs. The front leg having at least one front wheel connected thereto. The first and second rear legs have rear wheels connected thereto. The rear wheels are rotatable about a horizontal rotation axis of the rear wheels. The rear wheels are spaced from the at least one front wheel in a rearward direction, with the rearward direction being perpendicular to the horizontal rotation axis. A handle assembly is connected to the front leg and the rear legs. The handle assembly includes a handlebar positioned between the first and second rear wheels. The handlebar is aligned with a vertical axis extending through and perpendicular to the horizontal rotation axis, or offset from the vertical axis such that the handlebar is positioned closer to a center of the stroller frame than the horizontal rotation axis.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:手推車組件</p>  
        <p type="p">12:手推車框架</p>  
        <p type="p">14:載具</p>  
        <p type="p">16:前腿</p>  
        <p type="p">18:後腿</p>  
        <p type="p">20:把手組件</p>  
        <p type="p">22:前輪</p>  
        <p type="p">24:後輪</p>  
        <p type="p">26:水平旋轉軸線</p>  
        <p type="p">28:儲物籃</p>  
        <p type="p">30:轂</p>  
        <p type="p">32:車把</p>  
        <p type="p">34:車把延伸器</p>  
        <p type="p">36:豎直軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1317" publication-number="202613566"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613566.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613566</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120612</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在高頻下及在電導率方面具有高性能的探針頭</chinese-title>  
        <english-title>PROBE HEAD WITH HIGH PERFORMANCE AT HIGH FREQUENCIES AND IN TERMS OF ELECTRICAL CONDUCTIVITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">G01R1/073</main-classification>  
        <further-classification edition="200601120251226B">G01R1/04</further-classification>  
        <further-classification edition="200601120251226B">G01R1/067</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商探針科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHNOPROBE S.P.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費利希　史提伐諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FELICI, STEFANO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克立巴　羅貝多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRIPPA, ROBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於測試一待測裝置的探針頭，該探針頭具有多個接觸元件，該些接觸元件具有一主體其延伸在第一端部與相對的第二端部之間，適於接觸各自的接觸墊；且該探針頭具有至少一引導件，其包括多個用於容納該些接觸元件的引導孔，該些引導孔由至少一壁所界定；其中該些接觸元件的一相應部分適於接觸該至少一壁。該引導件包括一由導電材料製成的芯部，該芯部具有一介面表面，以及一由介電材料製成的外塗層，該外塗層配置在至少位於該些引導孔處的芯部介面表面的至少一部分上，該外塗層構成該些引導孔的至少一壁的至少一部分。該些引導孔至少其中一引導孔的壁，係至少部分地塗覆有一導電層，該導電層被構型為僅與容納在該至少一引導孔內的接觸元件進行機械性和電性接觸，其中，在該至少一引導孔中，該外塗層配置在該芯部和該導電層之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A probe head for testing a device under test is described, the probe head having a plurality of contact elements with a body extending between a first end portion and a second and opposite end portion, which are adapted to contact respective contact pads, and at least one guide comprising a plurality of guide holes adapted to house the contact elements, said guide holes being defined by at least one wall, wherein a corresponding portion of said contact elements is adapted to contact said at least one wall. The guide comprises a core made of a conductive material, said core having an interface surface, and an outer coating made of a dielectric material and arranged on at least part of the interface surface of the core at least at the guide holes, this outer coating forming at least part of said at least one wall of said guide holes. The wall of at least one of said guide holes is at least partially coated by a conductive layer configured to mechanically and electrically contact only the contact element housed in said at least one guide hole, wherein, in said at least one guide hole, said outer coating is arranged between said core and said conductive layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:探針頭</p>  
        <p type="p">110:接觸元件</p>  
        <p type="p">110a:第一端部</p>  
        <p type="p">110b:第二端部</p>  
        <p type="p">110:主體</p>  
        <p type="p">140:引導件</p>  
        <p type="p">140a:芯部</p>  
        <p type="p">140as:介面表面</p>  
        <p type="p">140b:外塗層</p>  
        <p type="p">140h:引導孔</p>  
        <p type="p">140l:導電層</p>  
        <p type="p">150:介面板</p>  
        <p type="p">150a:接觸墊</p>  
        <p type="p">160:夾子</p>  
        <p type="p">DUTa:待測裝置</p>  
        <p type="p">FA:面</p>  
        <p type="p">FB:面</p>  
        <p type="p">H-H:縱軸</p>  
        <p type="p">SW:半導體晶圓</p>  
        <p type="p">W:壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1318" publication-number="202612886"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612886.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612886</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120619</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>纖維成分的回收方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B29B17/02</main-classification>  
        <further-classification edition="200601120251229B">C08J11/08</further-classification>  
        <further-classification edition="200601120251229B">D01C3/00</further-classification>  
        <further-classification edition="200601120251229B">D06M11/00</further-classification>  
        <further-classification edition="200601120251229B">C08G63/183</further-classification>  
        <further-classification edition="200601120251229B">C08G63/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商帝人富瑞特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEIJIN FRONTIER CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河崎敬太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鶴田遼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUDA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>須之內慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNOUCHI, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種纖維成分的回收方法，其係以醇鹽的烷二醇溶液或含有還原劑的水溶液處理含有聚酯纖維與蛋白質纖維之纖維製品，回收聚酯纖維或蛋白質纖維的任一纖維成分。再者，較佳蛋白質纖維為獸毛纖維，或聚酯纖維以伸烷基苯二羧酸酯作為主要重複單元。較佳醇鹽為甲醇鈉，或烷二醇為聚乙二醇，可回收品質良好的蛋白質纖維。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1319" publication-number="202612878"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612878.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612878</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120625</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>食品切片機</chinese-title>  
        <english-title>FOOD SLICER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B26D1/46</main-classification>  
        <further-classification edition="200601120251229B">B26D3/28</further-classification>  
        <further-classification edition="200601120251229B">B26D7/02</further-classification>  
        <further-classification edition="200601120251229B">B26D7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商南常股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANTSUNE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷口守紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIGUCHI, YOSHINORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田賢人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, KENTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱珍元</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">食品切片機1的送入裝置3的抓持機構31具有抓持食品送出末端側的端部抓持體43，以及與食品送出末端側抵接的推板42。切片機1具備：擋板17，其與推板42對峙且可與食品送出始端側抵接；擋板驅動機構5，其使擋板17在食品運送方向進退移動而調節擋板開放量；以及控制機構113，其在食品的最終切割階段中，在使端部抓持體43從食品離開移動的狀態下，透過擋板17和推板42夾持食品，使食品透過切割裝置2切割。透過控制機構113的控制，在對食品從最初切割階段至最終切割階段之間可變更擋板開放量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The gripping mechanism 31 of the feeding device 3 of the food slicer 1 includes an end gripper 43 for gripping the food feed tail end, and a push plate 42 for contacting the food feed tail end. The slicer 1 includes: a flapper 17 that faces the push plate 42 and can contact the food feed start end; a flapper drive mechanism 5 that moves the flapper 17 forward and backward in the food feed direction to adjust the flapper open size; and a control mechanism 113 that, during the final food cutting stage, while the end gripper 43 moves away from the food, clampes the food by the flapper 17 and the push plate 42, allowing the food to be cut by the cutting device 2. The flapper open size can be varied from the initial food cutting stage to the final food cutting stage under the control of the control mechanism 113.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:切片機</p>  
        <p type="p">10:圍繞部</p>  
        <p type="p">11:鋸輪箱體</p>  
        <p type="p">12:上鋸輪</p>  
        <p type="p">126:回收箱門扉開閉感測器</p>  
        <p type="p">13:下鋸輪</p>  
        <p type="p">14:帶鋸</p>  
        <p type="p">15:機台</p>  
        <p type="p">151:支撐框架</p>  
        <p type="p">152:支架</p>  
        <p type="p">153:致動器支架</p>  
        <p type="p">154:後部蓋</p>  
        <p type="p">161:近前蓋</p>  
        <p type="p">162:右上蓋</p>  
        <p type="p">164:左後面板</p>  
        <p type="p">165:後部面板</p>  
        <p type="p">17:擋板</p>  
        <p type="p">18:鋸車馬達</p>  
        <p type="p">19:皮帶輪傳動系統</p>  
        <p type="p">2:切割裝置</p>  
        <p type="p">20:回收箱</p>  
        <p type="p">23:箱體門扉</p>  
        <p type="p">23a:擋板蓋</p>  
        <p type="p">24:回收托盤</p>  
        <p type="p">25:回收箱門扉</p>  
        <p type="p">31:抓持機構</p>  
        <p type="p">4:送出裝置</p>  
        <p type="p">5:擋板驅動機構</p>  
        <p type="p">6:擋板滑動驅動機構</p>  
        <p type="p">81:送出輸送帶</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1320" publication-number="202614319"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614319.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614319</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120626</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非接觸吸附盤</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/677</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商翁令司工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OILES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和田寛明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WADA, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>津野田優志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUNODA, YUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種非接觸吸附盤，其可在不設置物理性導件的情況下，有效果地抑制工件的位置偏移。拾取筒夾(10)，是由具備具有透氣性的多孔質體形成的多孔質構件(12)，以從吸附面(10A)側之開口朝向裡面(10C)側沿上下方向直線狀延伸地形成有單一之第1吸引通路(13)，以N為自然數，從吸附面(10A)側之開口朝向裡面(10C)側延伸地形成有至少2的(N+1)次方個第2吸引通路(15)，第2吸引通路(15)具有以前述第1吸引通路(13)的中心線(O)為基準的2的N次方次旋轉對稱性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:拾取筒夾</p>  
        <p type="p">10A:吸附面</p>  
        <p type="p">10B:表面</p>  
        <p type="p">10C:裡面</p>  
        <p type="p">11:基體</p>  
        <p type="p">12:多孔質構件</p>  
        <p type="p">13:第1吸引通路</p>  
        <p type="p">14:第1緻密質構件</p>  
        <p type="p">15:第2吸引通路</p>  
        <p type="p">16:第2緻密質構件</p>  
        <p type="p">19:第3吸引通路</p>  
        <p type="p">O:中心線</p>  
        <p type="p">W:晶片(工件)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1321" publication-number="202613342"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613342.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613342</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120630</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於硬遮罩應用之非晶形多金屬摻雜薄膜</chinese-title>  
        <english-title>AMORPHOUS MULTI-METAL-DOPED FILM FOR HARDMASK APPLICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">C23C16/02</main-classification>  
        <further-classification edition="200601120251223B">C23C16/26</further-classification>  
        <further-classification edition="200601120251223B">C23C16/30</further-classification>  
        <further-classification edition="200601120251223B">C23C16/505</further-classification>  
        <further-classification edition="200601120251223B">G03F7/11</further-classification>  
        <further-classification edition="200601120251223B">H01L23/02</further-classification>  
        <further-classification edition="200601120251223B">H01L21/033</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鐘廣顏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHONG, GUANGYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成寶睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, BAORUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏爾馬　卡希什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARMA, KASHISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾汀　艾古特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AYDIN, AYKUT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝秉樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, PING-HWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　勁文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, KELVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維克奈許　沙穆甘納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VICKNESH, SAHMUGANATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　天發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, TIEN FAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴拉蘇拔馬尼安　葛尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALASUBRAMANIAN, GANESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓　新海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, XINHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬禮克　亞伯希吉特巴蘇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALLICK, ABHIJIT BASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　思潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, SZE CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加納基拉曼　卡希克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANAKIRAMAN, KARTHIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊翁奇尼　安德烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEONCINI, ANDREA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="17"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高定民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, JUNGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="18"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔　湯姆Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, TOM S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例通常涉及積體電路的製造。更特別地，本文所述的實施例提供了在基板上沉積硬遮罩膜的技術。在一個實施例中，形成位於處理腔室中的基板上的多金屬硬遮罩膜的一種方法包括將至少一個預處理氣體流入處理腔室；以及將主要沉積氣體混合物流入處理腔室以形成多金屬硬遮罩膜，其中多金屬硬遮罩膜包括複數個金屬。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Implementations of the present disclosure generally relate to the fabrication of integrated circuits. More particularly, the implementations described herein provide techniques for deposition of hardmask films on a substrate. In one embodiment, a method of forming a multi-metal hardmask film on a substrate disposed in a processing chamber, including flowing at least one pretreatment gas into the processing chamber; and flowing a main deposition gas mixture into the processing chamber to form the multi-metal hardmask film, wherein the multi-metal hardmask film comprises a plurality of metals.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:方法</p>  
        <p type="p">202:操作</p>  
        <p type="p">204:操作</p>  
        <p type="p">206:操作</p>  
        <p type="p">208:操作</p>  
        <p type="p">210:操作</p>  
        <p type="p">212:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1322" publication-number="202613153"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613153.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613153</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120647</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工程化ＩＬ－１５變異體及其使用方法</chinese-title>  
        <english-title>ENGINEERED IL-15 VARIANTS AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K14/54</main-classification>  
        <further-classification edition="200601120260102B">A61K38/20</further-classification>  
        <further-classification edition="200601120260102B">C12N15/62</further-classification>  
        <further-classification edition="200601120260102B">C12N15/63</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification>  
        <further-classification edition="200601120260102B">G01N33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商ＦＢＤ生物製劑有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FBD BIOLOGICS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓宗顯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUO, ZONG SEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃明停</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, MING-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃聖傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHENG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林杰翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIEH-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, I-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施秋月</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHIU-YUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖怡歆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, YI-SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳逸駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, I-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范雅媞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, YA-TI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝心慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HSIN-TZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈才貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, TSAI-KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林詠筑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUNG-CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁瑞玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, RUI-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭子琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, TZU-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳語謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="17"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何捷昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, CHIEH-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="18"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡沛倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PEI-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="19"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳玫芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MEI-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示係關於工程化IL-15變異體、其蛋白質構築體及其使用方法。在一些實施例中，該工程化IL-15變異體包括非天然二硫鍵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure relates to engineered IL-15 variants, protein constructs thereof, and methods of use thereof. In some embodiments, the engineered IL-15 variants include a non-native disulfide bond.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1323" publication-number="202613155"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613155.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613155</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120648</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工程化之ＩＬ２Ｒβ變異體及其使用方法</chinese-title>  
        <english-title>ENGINEERED IL2Rβ VARIANTS AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K14/55</main-classification>  
        <further-classification edition="200601120260102B">C07K19/00</further-classification>  
        <further-classification edition="200601120260102B">C12N15/62</further-classification>  
        <further-classification edition="200601120260102B">C12N15/63</further-classification>  
        <further-classification edition="200601120260102B">A61K38/20</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商ＦＢＤ生物製劑有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FBD BIOLOGICS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓宗顯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUO, ZONG SEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃明停</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, MING-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃聖傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHENG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, I-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施秋月</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHIU-YUEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳逸駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, I-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范雅媞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, YA-TI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案係關於工程化之IL2Rβ變異體及其使用方法。在一些實施例中，該等工程化之IL2Rβ變異體包括一或多個非天然組胺酸殘基。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure relates to engineered IL2Rβ variants, and methods of use thereof. In some embodiments, the engineered IL2Rβ variants include one or more non-native histidine residues.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1324" publication-number="202613154"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613154.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613154</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120649</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工程化ＩＬ－７變異體及其使用方法</chinese-title>  
        <english-title>ENGINEERED IL-7 VARIANTS AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K14/54</main-classification>  
        <further-classification edition="200601120260102B">C07K19/00</further-classification>  
        <further-classification edition="200601120260102B">C12N15/62</further-classification>  
        <further-classification edition="200601120260102B">C12N15/63</further-classification>  
        <further-classification edition="200601120260102B">A61K38/20</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商ＦＢＤ生物製劑有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FBD BIOLOGICS LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林煥晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUAN-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊仕丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHIH-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊翔俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, HSIANG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊佳曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHIA-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁翊暄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YI-SYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡沛倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, PEI-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭子琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, TZU-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林詠筑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YUNG-CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁瑞玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, RUI-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳語謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何捷昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, CHIEH-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈才貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, TSAI-KUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳奕穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, I-YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓宗顯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUO, ZONG SEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示係關於工程化IL-7變異體、其蛋白質構築體以及其使用方法。在一些實施例中，該工程化IL-7變異體包括非天然二硫鍵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure relates to engineered IL-7 variants, protein constructs thereof, and methods of use thereof. In some embodiments, the engineered IL-7 variants include a non-native disulfide bond.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1325" publication-number="202614902"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614902.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614902</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120650</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251218B">H10K50/00</main-classification>  
        <further-classification edition="202501120251218B">H10F55/00</further-classification>  
        <further-classification edition="202501120251218B">H10D30/67</further-classification>  
        <further-classification edition="200601120251218B">G02F1/133</further-classification>  
        <further-classification edition="200601120251218B">G02F1/136</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豊高耕平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOTAKA, KOUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, KEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宍戶英明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHISHIDO, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楠紘慈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSUNOKI, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一個實施方式的目的之一是提供一種與掃描線連接的電晶體的閘極電容小的新穎結構的顯示裝置等。或者，提供一種掃描線的電阻低的新穎結構的顯示裝置等。或者，提供一種能夠以高清晰度配置像素的新穎結構的顯示裝置等。或者，提供一種製造成本的上升得到抑制的新穎結構的顯示裝置等。在包括與掃描線連接的第一閘極電極以及第二閘極電極的電晶體中，第一閘極電極由低電阻金屬材料構成，第二閘極電極由能夠減少氧化物半導體層中的氧缺陷的金屬氧化物材料構成。第一閘極電極與掃描線連接，第二閘極電極與被供應恆定電位的佈線連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A novel display device or the like in which a transistor connected to a scan line has small gate capacitance is provided. A novel display device or the like in which a scan line has low resistance is provided. A novel display device or the like in which pixels can be arranged with high density is provided. A novel display device or the like that can be manufactured without an increase in cost is provided. In a transistor including a first gate electrode and a second gate electrode, the first gate electrode is formed using a metal material with low resistance and the second gate electrode is formed using a metal oxide material that can reduce oxygen vacancies in an oxide semiconductor layer. The first gate electrode is connected to the scan line, and the second gate electrode is connected to a wiring to which a constant potential is supplied.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">GL:掃描線</p>  
        <p type="p">SL:信號線</p>  
        <p type="p">V0:佈線</p>  
        <p type="p">ANODE:電流供應線</p>  
        <p type="p">M1:電晶體</p>  
        <p type="p">M2:電晶體</p>  
        <p type="p">M3:電晶體</p>  
        <p type="p">PIX:像素</p>  
        <p type="p">C1:電容元件</p>  
        <p type="p">EL:發光元件</p>  
        <p type="p">CATHODE:公共佈線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1326" publication-number="202613224"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613224.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613224</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120651</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚酯成分之回收方法，及使用回收成分之再生聚酯之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">C08J11/20</main-classification>  
        <further-classification edition="200601120251217B">C08G63/183</further-classification>  
        <further-classification edition="200601120251217B">B29B17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商帝人富瑞特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEIJIN FRONTIER CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河崎敬太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鶴田遼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUDA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>須之內慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNOUCHI, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種聚酯成分之回收方法，其係將包含聚酯纖維與丙烯酸樹脂之纖維製品與90℃以上185℃以下之極性溶劑接觸，而回收聚酯成分。聚酯纖維較佳為以苯二羧酸伸烷酯為主要重複單位，較佳丙烯酸樹脂為交聯或非交聯丙烯酸樹脂，極性溶劑為低級醇或非質子性極性溶劑。及將藉由該回收方法所得之聚酯成分再聚合之再生聚酯之製造方法。藉由本發明，儘管使用回收之聚酯，仍可製造著色少的再生聚酯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1327" publication-number="202613061"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613061.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613061</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120653</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於藉由控制所採用之粉末的內聚強度來生產經燒結之積層體之程序</chinese-title>  
        <english-title>PROCESS FOR PRODUCING A SINTERED LAYERED BODY BY CONTROLLING THE COHESIVE STRENGTH OF A POWDER EMPLOYED</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C04B35/64</main-classification>  
        <further-classification edition="200601120251229B">C04B35/626</further-classification>  
        <further-classification edition="200601120251229B">C04B35/119</further-classification>  
        <further-classification edition="200601120251229B">C04B35/44</further-classification>  
        <further-classification edition="200601120251229B">C04B35/645</further-classification>  
        <further-classification edition="202101120251229B">B22F3/00</further-classification>  
        <further-classification edition="200601120251229B">B22F3/105</further-classification>  
        <further-classification edition="200601120251229B">B28D1/00</further-classification>  
        <further-classification edition="200601120251229B">B30B15/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賀利氏科萬特北美有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS COVANTICS NORTH AMERICA LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃克　路克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALKER, LUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑曼　珊曼莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAUMANN, SAMANTHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於生產積層體之程序，其包含下列程序步驟：&lt;br/&gt;a.    將第一粉末引入內部容積中以獲得該內部容積中的第一粉末層，其中該內部容積&lt;br/&gt;i.     具有至少200 mm的橫截面寬度W，且&lt;br/&gt;ii.    至少部分地藉由模具之內部表面定界，其中該模具具有至少一個壁，且其中該壁包含碳；&lt;br/&gt;b.    使該第一粉末層經受熱及壓力以獲得該積層體，其中&lt;br/&gt;i.     該熱藉由跨該模具、該內部容積、或兩者施加的電壓產生，且&lt;br/&gt;ii.    該積層體包含第一層；&lt;br/&gt;其中&lt;br/&gt;該第一粉末具有在41至65度之範圍內的第一靜止角。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process for producing a layered body, comprising the following process steps:&lt;br/&gt;a. introducing a first powder into an interior volume to obtain a first powder layer in the interior volume, wherein the interior volume&lt;br/&gt;i. has a cross-sectional width W of at least 200 mm, and&lt;br/&gt;ii. is at least partially bordered by an interior surface of a die, wherein the die has at least one wall, and wherein said wall comprises carbon; &lt;br/&gt;b. subjecting the first powder layer to a heat and a pressure to obtain the layered body, wherein &lt;br/&gt;i. the heat is generated by an electrical voltage applied across the die, the interior volume, or both, and&lt;br/&gt;ii. the layered body comprises a first layer;&lt;br/&gt;wherein&lt;br/&gt;the first powder has a first angle of repose that is in the range from 41 to 65 degrees.&lt;b/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:裝置</p>  
        <p type="p">001:第一推動構件</p>  
        <p type="p">002:第一活塞</p>  
        <p type="p">003:第一衝頭</p>  
        <p type="p">004:第一衝頭內部表面；衝頭內部表面</p>  
        <p type="p">005:模具之內部表面</p>  
        <p type="p">006:模具</p>  
        <p type="p">007:第二衝頭內部表面；衝頭內部表面</p>  
        <p type="p">008:第二衝頭</p>  
        <p type="p">009:第二活塞</p>  
        <p type="p">010:第二推動構件</p>  
        <p type="p">011:壓縮軸</p>  
        <p type="p">012:電源</p>  
        <p type="p">013:內部容積</p>  
        <p type="p">014:第一粉末層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1328" publication-number="202613343"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613343.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613343</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120657</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用改良電漿誘導損傷（ＰＩＤ）介電質膜沉積之較低Ｋ與高硬度</chinese-title>  
        <english-title>LOWER K AND HIGH HARDNESS WITH IMPROVED PLASMA INDUCED DAMAGE (PID) DIELECTRIC FILM DEPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">C23C16/24</main-classification>  
        <further-classification edition="200601120251231B">C23C16/27</further-classification>  
        <further-classification edition="200601120251231B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝　波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郎　紀一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANG, CHI-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏　立群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, LI-QUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡卡塔拉曼　尚卡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VENKATARAMAN, SHANKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在某些實施例中，一種形成介電質膜的方法包含在處理腔室中將基板暴露於具有通式(I)的矽前驅物，以在基板上形成含矽膜。通式(I)可表示為：&lt;br/&gt;&lt;img align="absmiddle" height="129px" width="228px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt; 其中Q&lt;sup&gt;1&lt;/sup&gt;為碳原子或氧原子，R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;、R&lt;sup&gt;5&lt;/sup&gt;、R&lt;sup&gt;6&lt;/sup&gt;、R&lt;sup&gt;7&lt;/sup&gt;及R&lt;sup&gt;8&lt;/sup&gt;中的每一者獨立地選自氫原子、取代烷基、不取代烷基、取代烷氧基、不取代烷氧基、取代乙烯基、不取代乙烯基、矽烷、取代胺、不取代胺或鹵化物。該方法進一步包含淨化處理腔室中的矽前驅物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In some embodiments, a method of forming a dielectric film includes exposing a substrate in a processing chamber to a silicon precursor having general Formula (I) to form a silicon-containing film on the substrate. Formula (I) can be represented by:&lt;br/&gt;&lt;img align="absmiddle" height="134px" width="217px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; &lt;br/&gt; wherein Q&lt;sup&gt;1&lt;/sup&gt; is a carbon atom or an oxygen atom, and each of R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, R&lt;sup&gt;4&lt;/sup&gt;, R&lt;sup&gt;5&lt;/sup&gt;, R&lt;sup&gt;6&lt;/sup&gt;, R&lt;sup&gt;7&lt;/sup&gt;, and R&lt;sup&gt;8&lt;/sup&gt; is independently selected from a hydrogen atom, a substituted alkyl, an unsubstituted alkyl, a substituted alkoxy, an unsubstituted alkoxy, a substituted vinyl, an unsubstituted vinyl, a silane, a substituted amine, an unsubstituted amine, or a halide. The method further includes purging the processing chamber of the silicon precursor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:處理腔室</p>  
        <p type="p">103:基板</p>  
        <p type="p">104:氣源</p>  
        <p type="p">106:壁</p>  
        <p type="p">108:底部</p>  
        <p type="p">110:蓋子</p>  
        <p type="p">112:製程空間</p>  
        <p type="p">114:環</p>  
        <p type="p">116:排氣埠</p>  
        <p type="p">118:噴頭</p>  
        <p type="p">120:內部側</p>  
        <p type="p">130A:偏壓電源</p>  
        <p type="p">130B:偏壓電源</p>  
        <p type="p">132:偏壓電極</p>  
        <p type="p">138:基板支撐組件</p>  
        <p type="p">142:桿</p>  
        <p type="p">144:系統</p>  
        <p type="p">146:波紋管</p>  
        <p type="p">154:裝置</p>  
        <p type="p">156:電腦處理器</p>  
        <p type="p">158:記憶體</p>  
        <p type="p">160:電漿電源</p>  
        <p type="p">162:支援電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1329" publication-number="202612586"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612586.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612586</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120661</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>白蟻防治系統和方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR TERMITE CONTROL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A01M1/10</main-classification>  
        <further-classification edition="200601120260102B">A01M1/20</further-classification>  
        <further-classification edition="200601120260102B">A01N25/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商發現購買者公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DISCOVERY PURCHASER CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>契斯特　喬安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIJLSTRA, JOHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>城島健司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHDAKE, JOHJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳天賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了與製造和使用筒式白蟻防治裝置防治白蟻種群有關的方法和系統。該筒式白蟻防治裝置包括殼體，其限定了内腔並包括白蟻進出内腔的開口。該内腔包含網狀聚氨酯泡沫筒，其浸漬有一種或多種有效防治白蟻的農藥活性成分。該筒式白蟻防治裝置的殼體可佈置在建築物的周邊，該筒裝入内腔。這樣，白蟻進入筒式白蟻防治裝置，與該筒相互作用，暴露於農藥活性成分，離開該筒式白蟻防治裝置，然後返回暴露於白蟻群落中的其他白蟻。隨後，農藥活性成分會消滅暴露的白蟻，從而縮小白蟻種群的規模。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided here are methods and systems related to the manufacture and use of a cartridge-based termite control device for controlling termite populations. The cartridge-based termite control device includes a housing that defines an interior cavity and includes openings through which termites enter and exit the interior cavity. The interior cavity contains a reticulated polyurethane foam cartridge impregnated with one or more pesticide active ingredients effective against termites. The housing of the cartridge-based termite control device may be disposed about the perimeter of a structure and the cartridge loaded into the interior cavity. As such, termites enter the cartridge-based termite control device, interact with the cartridge to be exposed to the pesticide active ingredients, exit the cartridge-based termite control device, and then return to expose other termites of the termite colony. Subsequently, the pesticide active ingredients eliminate the exposed termites, reducing the size of the termite colony.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:殼體</p>  
        <p type="p">102:筒式白蟻防治裝置</p>  
        <p type="p">104:蓋</p>  
        <p type="p">106:主體</p>  
        <p type="p">108:內腔</p>  
        <p type="p">110:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1330" publication-number="202614180"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614180.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614180</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120668</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成低電阻率接觸的方法</chinese-title>  
        <english-title>METHODS FOR FORMING LOW RESISTIVITY CONTACTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L21/285</main-classification>  
        <further-classification edition="200601120260102B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬一揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAN, YIYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>章樂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許智勛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉偉峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, WEIFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張書錨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SHUMAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱啟豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, QIHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸亦洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YIYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　立其</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, LIQI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂　疆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, JIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露一般提供在半導體基板上形成接觸結構的方法。方法包括在接觸結構的表面上形成金屬矽化物層，方式是保持基板的第一溫度，並向第一沉積腔室提供第一載氣、第一含金屬前驅物以及第一含氫前驅物。接觸結構包括在半導體基板的表面上形成的特徵。金屬矽化物層形成於側壁和含矽接觸的上方。金屬矽化物層暴露於含氯的電漿中，以去除形成在側壁上的金屬矽化物層的至少一部分。在含矽接觸的表面上形成金屬層。形成的金屬矽化物層的一部分設置於金屬層與含矽接觸的表面之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure generally provides methods of forming contact structures on semiconductor substrates. The methods include forming a metal silicide layer on a surface of a contact structure by maintaining a first temperature of a substrate and providing a first carrier gas, a first metal-containing precursor, and a first hydrogen-containing precursor to a first deposition chamber. The contact structure includes a feature formed in a surface of the semiconductor substrate. The metal silicide layer is formed over the sidewalls and the silicon containing contact. The metal silicide layer is exposed to a chlorine containing plasma to remove at least a portion of the metal silicide layer formed on the sidewalls. A metal layer is formed on a surface of the silicon containing contact. A portion of the formed metal silicide layer is disposed between the metal layer and the surface of the silicon containing contact.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">328:材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1331" publication-number="202612753"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612753.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612753</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120688</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>患者介面</chinese-title>  
        <english-title>PATIENT INTERFACE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">A61M16/06</main-classification>  
        <further-classification edition="200601120251229B">A61M16/08</further-classification>  
        <further-classification edition="200601120251229B">A61M16/10</further-classification>  
        <further-classification edition="200601120251229B">A61M16/16</further-classification>  
        <further-classification edition="200601120251229B">A61M16/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紐西蘭商費雪　＆　佩凱爾關心健康有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FISHER &amp; PAYKEL HEALTHCARE LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法來因　寇爾馬克Ｎ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLYNN, CORMAC NICHOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>后拉歐克　布魯斯Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLYOAKE, BRUCE GORDON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐斯伯尼　哈米許Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSBORNE, HAMISH ADRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布吉斯　艾迪恩Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURGESS, AIDAN ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　葛拉米Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, GRAEME MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>若亞　納桑Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROA, NATHAN JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊凡斯　艾莉西亞Ｊ　Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVANS, ALICIA JERRAM HUNTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克林克　吉爾曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLINK, GERMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>懷特　克雷格Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHITE, CRAIG KARL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派頓　馬修Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAYTON, MATTHEW JON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種患者介面，該患者介面包括：所述患者介面的至少一個鼻叉管或出口，該至少一個鼻叉管或出口將由使用者的鼻孔或嘴接收；氣體遞送側構件，該氣體遞送側構件從該至少一個鼻叉管或所述出口的一側延伸；並且其中該氣體遞送側構件包括內腔，該內腔用於氣體流從該患者介面的入口到該至少一個鼻叉管或所述出口；可塌縮部分；至少一個彎管部分或柔性部分，該至少一個彎管部分或柔性部分基本上位於或朝向所述氣體遞送構件的下游端或所述氣體遞送構件的上游端中的一個或兩個。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to a patient interface comprising at least one nasal prong or an outlet of said patient interface to be received by a user’s nare(s) or mouth; a gases delivery side member extending from a side of the at least one nasal prong or said outlet; and wherein the gases delivery side member comprises of a lumen for a flow of gases from an inlet of the patient interface to the at least one nasal prong or said outlet; a collapsible portion; at least one elbow portion or flexible portion, located substantially at or toward one or both of a downstream end of said gases delivery member or an upstream end of said gases delivery member.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:患者介面；鼻插管；鼻介面</p>  
        <p type="p">202:第一氣體導管</p>  
        <p type="p">203:增強元件；第一氣體導管</p>  
        <p type="p">204:第一部分；導管；導管部分；塌縮導管；可塌縮導管；可塌縮導管部分；可塌縮區段</p>  
        <p type="p">206:流歧管</p>  
        <p type="p">208:鼻腔遞送元件；鼻叉管</p>  
        <p type="p">210:臉頰支撐件</p>  
        <p type="p">P:患者</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1332" publication-number="202613040"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613040.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613040</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120697</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>純水製造系統的控制方法及純水製造系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251229B">C02F1/44</main-classification>  
        <further-classification edition="200601120251229B">B01D61/58</further-classification>  
        <further-classification edition="200601120251229B">B01D61/12</further-classification>  
        <further-classification edition="200601120251229B">B01D61/22</further-classification>  
        <further-classification edition="200601120251229B">B01D61/00</further-classification>  
        <further-classification edition="202301120251229B">C02F1/20</further-classification>  
        <further-classification edition="202301120251229B">C02F1/32</further-classification>  
        <further-classification edition="202301120251229B">C02F1/42</further-classification>  
        <further-classification edition="202301120251229B">C02F1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山川晴義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAKAWA, HARUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林英夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, HIDEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大河原正博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAWARA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部幸也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, KOUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的純水製造系統的控制方法中，當由位準感測器112測量的純水槽111的貯水量較基準值而言增加時，控制部件使流量調整閥113節流而使一次純水W2向純水槽111的供水量減少。然後，基於流量調整閥113的前段的第二壓力計115的測量值，以減少逆變器110的輸出的方式對升壓泵109的輸出進行控制以使所述第二壓力計115的測量值大致一定為預先決定的壓力。另外，以減少送水泵102的逆變器103的輸出的方式進行控制以使升壓泵109的前段的壓力亦成為大致一定。藉此，可避免升壓泵109中的空蝕風險而使升壓泵109穩定地運轉，從而向純水槽111供給所需量的一次純水W2。根據此種純水製造系統的控制方法，在水處理設備之間具有升壓泵的純水製造系統中，能夠根據使用水量來控制供水量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:一次純水裝置(純水製造系統)</p>  
        <p type="p">101:被處理水槽(被處理水供給源/前處理槽)</p>  
        <p type="p">102:送水泵(供水機構)</p>  
        <p type="p">103、110:逆變器</p>  
        <p type="p">104:逆滲透膜裝置(水處理設備)</p>  
        <p type="p">105:膜式脫氣裝置(水處理設備)</p>  
        <p type="p">106:紫外線氧化裝置(水處理設備)</p>  
        <p type="p">107:電再生式去離子裝置(CDI)(水處理設備)</p>  
        <p type="p">108:再生式離子交換樹脂塔(水處理設備)</p>  
        <p type="p">109:升壓泵</p>  
        <p type="p">111:純水槽</p>  
        <p type="p">112:位準感測器</p>  
        <p type="p">113:流量調整閥(流量調整機構)</p>  
        <p type="p">114:第一壓力計</p>  
        <p type="p">115:第二壓力計</p>  
        <p type="p">W1:前處理水(被處理水)</p>  
        <p type="p">W2:一次純水(純水)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1333" publication-number="202613152"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613152.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613152</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120716</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種Ｓｕｐｅｒｏｓｅ　１２分子篩串聯管柱層析去除重組人血小板生成素聚體的方法</chinese-title>  
        <english-title>A METHOD FOR REMOVING RECOMBINANT HUMAN THROMBOPOIETIN AGGREGATES USING SUPEROSE 12 MOLECULAR SIEVE TANDEM COLUMN CHROMATOGRAPHY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K14/52</main-classification>  
        <further-classification edition="200601120260102B">C07K1/14</further-classification>  
        <further-classification edition="200601120260102B">C07K1/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商瀋陽三生製藥有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENYANG SUNSHINE PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白利利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAI, LILI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>婁競</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOU, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>靳征</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種Superose 12分子篩串聯管柱層析去除重組人血小板生成素聚體的方法，屬於生物製藥領域。本發明的方法包括以下步驟：將CHO細胞表達的重組人血小板生成素收穫液超濾濃縮後依次經陽離子交換層析、第一次陰離子交換層析、反相層析、第二次陰離子交換層析濃縮換液得到濃縮中間體；濃縮中間體上樣至兩根水平串聯的Superose 12分子篩層析管柱，然後用沖提液沖提並收集目標蛋白。本發明的方法增大了樣品載量，減少上樣次數，提高工作效率，樣品分離度提高到1.5以上，收率及純度均高於現有單根管柱的層析方法，降低了單管柱的裝填高度，減少管柱壓，降低對層析管柱及層析設備的耐壓要求，實現凝膠層析規模的放大，適用於所有利用凝膠層析分離純化大分子的工藝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention pertains to the biopharmaceutical field and discloses a method for removing recombinant human thrombopoietin (rhTPO) aggregates using Superose 12 molecular sieve tandem column chromatography. The method includes the following steps: ultrafiltration and concentration of a CHO cell-derived rhTPO harvest solution, followed by sequential chromatography steps including cation exchange chromatography, a first anion exchange chromatography, reversed-phase chromatography, and a second anion exchange chromatography for further concentration and buffer exchange to yield an intermediate; loading the intermediate onto two tandemly connected Superose 12 columns; and eluting and collecting the target protein. The method of the present invention increases sample loading capacity, reduces the number of loading cycles, improves operational efficiency and resolution (&amp;gt;1.5), and achieves higher recovery rate and purity compared with existing single-column approaches. It reduces the packing height of a single column, lowers column pressure, decreases the pressure resistance requirements for chromatography columns and equipment, enables scale-up of gel chromatography, and is applicable to all processes that use gel chromatography for the separation and purification of macromolecules.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1334" publication-number="202614671"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614671.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614671</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120727</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於產生極紫外線輻射或用於操作核融合的裝置、系統和方法，以及用於生產微晶片或用於生產微晶片的半導體中間產品的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">H05G2/00</main-classification>  
        <further-classification edition="200601120251216B">G03F7/20</further-classification>  
        <further-classification edition="200601120251216B">H01L21/027</further-classification>  
        <further-classification edition="200601120251216B">G01D5/26</further-classification>  
        <further-classification edition="202001120251216B">G01S15/00</further-classification>  
        <further-classification edition="200601120251216B">H05H1/24</further-classification>  
        <further-classification edition="200601120251216B">G21B1/23</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商創浦半導體製造雷射系統歐洲股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRUMPF LASERSYSTEMS FOR SEMICONDUCTOR MANUFACTURING SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樂許　艾簡斯克許納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LERCH, AJANTHKRISHNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種藉由以一雷射光束(14)照射一靶材(18)來產生極紫外線輻射或進行核融合的裝置(16)。該裝置包括一靶室(20)、一導引裝置(26)、及一操縱裝置(34)，該靶室包括一內腔(22)，該內腔具有一標的區域(24)，用於以該雷射光束(14)照射該靶材(18)導引，該導引裝置係用於導引該靶材(18)至該標的區域(24)，該操縱裝置係用於在該標的區域(24)中成形及/或定位該靶材(18)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:系統</p>  
        <p type="p">12:雷射光束產生裝置</p>  
        <p type="p">14:雷射光束</p>  
        <p type="p">16:裝置</p>  
        <p type="p">18:靶材</p>  
        <p type="p">20:靶室</p>  
        <p type="p">22:內腔</p>  
        <p type="p">24:標的區域</p>  
        <p type="p">26:導引裝置</p>  
        <p type="p">28:噴嘴</p>  
        <p type="p">30:噴嘴孔</p>  
        <p type="p">32:移動方向</p>  
        <p type="p">34:操縱裝置</p>  
        <p type="p">36、40:揚聲器</p>  
        <p type="p">38、42:聲波</p>  
        <p type="p">44、50:傳播方向</p>  
        <p type="p">46、48:聚焦單元</p>  
        <p type="p">52、54:方向分量</p>  
        <p type="p">56:控制裝置</p>  
        <p type="p">58:檢測器</p>  
        <p type="p">60:捕捉裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1335" publication-number="202613311"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613311.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613311</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120742</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靶向PNPLA3的雙鏈核糖核酸</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C12N15/13</main-classification>  
        <further-classification edition="200601120260102B">A61K31/713</further-classification>  
        <further-classification edition="201701120260102B">A61K47/54</further-classification>  
        <further-classification edition="200601120260102B">A61P1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商正大天晴藥業集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIA TAI TIANQING PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李永旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YONGXU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭佳佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, JIAJIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛興楓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, XINGFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧丹丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, DANDAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐宏江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, HONGJIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請屬於生物醫藥領域，涉及一種靶向PNPLA3的雙鏈核糖核酸，具體而言提供一種靶向Patatin樣磷脂酶域蛋白3的雙鏈核糖核酸、其藥學上可接受的鹽或其配體綴合物，還提供了包含所述雙鏈核糖核酸、其藥學上可接受的鹽或其配體綴合物的藥物組合物，以及所述雙鏈核糖核酸、其藥學上可接受的鹽或其配體綴合物的治療用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1336" publication-number="202612700"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612700.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612700</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120746</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發炎性腸道疾病之治療</chinese-title>  
        <english-title>TREATMENT OF INFLAMMATORY BOWEL DISEASE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/506</main-classification>  
        <further-classification edition="200601120260102B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260102B">A61P29/00</further-classification>  
        <further-classification edition="200601120260102B">A61P1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商原子智慧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATOMWISE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫特扎伊　沙哈伯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORTEZAEI, SHAHAB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在例示性具體例中，提供酪胺酸激酶2(TYK2)抑制劑、包含此等化合物之醫藥調配物以及使用此等化合物治療發炎性腸道疾病之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In exemplary embodiments, inhibitors of Tyrosine Kinase 2 (TYK2), pharmaceutical formulations comprising these compounds, andmethods of using these compounds to treat Inflammatory Bowel Diseases are provided.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1337" publication-number="202613097"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613097.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613097</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120747</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>6-取代之吲哚化合物</chinese-title>  
        <english-title>6-SUBSTITUTED INDOLE COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D401/14</main-classification>  
        <further-classification edition="200601120260102B">C07D471/04</further-classification>  
        <further-classification edition="200601120260102B">C07D519/00</further-classification>  
        <further-classification edition="200601120260102B">C07D487/04</further-classification>  
        <further-classification edition="200601120260102B">C07D498/10</further-classification>  
        <further-classification edition="200601120260102B">C07D487/08</further-classification>  
        <further-classification edition="200601120260102B">C07D417/14</further-classification>  
        <further-classification edition="200601120260102B">C07D413/14</further-classification>  
        <further-classification edition="200601120260102B">C07D471/10</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4439</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4545</further-classification>  
        <further-classification edition="200601120260102B">A61K31/444</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4725</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4709</further-classification>  
        <further-classification edition="200601120260102B">A61K31/496</further-classification>  
        <further-classification edition="200601120260102B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260102B">A61K31/551</further-classification>  
        <further-classification edition="200601120260102B">A61K31/5386</further-classification>  
        <further-classification edition="200601120260102B">A61P29/00</further-classification>  
        <further-classification edition="200601120260102B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商基利科學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GILEAD SCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安曼　史蒂芬　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMMANN, STEPHEN E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡納利斯　艾達　Ｙ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANALES, EDA Y.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾　永權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, WENG K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉澤威斯　史考特　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAZERWITH, SCOTT E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秀爾　丹尼爾　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHORE, DANIEL G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露大致上係關於某些化合物、包含該等化合物之醫藥組成物、及製造及使用該等化合物及醫藥組成物之方法。本文所提供之化合物及組成物可用於治療或預防自體免疫疾病及/或發炎性病況，包括全身性紅斑性狼瘡及皮膚性紅斑性狼瘡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates generally to certain compounds, pharmaceutical compositions comprising said compounds, and methods of making and using said compounds and pharmaceutical compositions. The compounds and compositions provided herein may be used for the treatment or prevention of an autoimmune disease and/or inflammatory condition, including systemic lupus erythematosus and cutaneous lupus erythematosus.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1338" publication-number="202613317"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613317.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613317</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120790</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環肽的庫、篩選方法及肽之製作方法</chinese-title>  
        <english-title>CYCLIC PEPTIDE LIBRARY, SCREENING METHOD AND METHOD FOR PRODUCING PEPTIDE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260102B">C12Q1/68</main-classification>  
        <further-classification edition="200601120260102B">G01N33/50</further-classification>  
        <further-classification edition="200601120260102B">C40B40/10</further-classification>  
        <further-classification edition="200601120260102B">C40B40/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泉田森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IZUTA, SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井由紀子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, YUKIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種環肽的庫，其具有構成環狀部之複數個胺基酸殘基及與環狀部連接之至少1個胺基酸殘基且為10&lt;sup&gt;2&lt;/sup&gt;種以上，其中，構成環狀部之複數個胺基酸殘基由在環肽的一次結構中分開且彼此鍵結而形成環之一對胺基酸殘基及在環肽的一次結構中夾在上述一對胺基酸殘基之複數個胺基酸殘基組成，在與環狀部連接之至少1個胺基酸殘基中，與上述一對胺基酸殘基相鄰之至少1個胺基酸殘基被隨機化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:環狀部</p>  
        <p type="p">12a,12b:環化胺基酸殘基</p>  
        <p type="p">20:鏈狀部</p>  
        <p type="p">22a,22b:相鄰胺基酸殘基</p>  
        <p type="p">a~r:胺基酸殘基</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1339" publication-number="202613332"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613332.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613332</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120791</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋼及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">C22C38/00</main-classification>  
        <further-classification edition="200601120251231B">C22C38/60</further-classification>  
        <further-classification edition="200601120251231B">C21D8/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村勇希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可抑制冷加工時的裂紋的鋼。本發明的鋼具有規定的成分組成與微觀組織，固溶N量為0.0015%以下，硬度為250 HV以下，關於以Ti氮化物為核的雪明碳鐵粒子，於該粒子的周圍具有Cu及/或Ni的濃化區域，並且圓相當直徑：10 nm～100 nm的數密度為20個/mm&lt;sup&gt;2&lt;/sup&gt;以上，關於雪明碳鐵粒子整體，圓相當直徑：1 mm以上的數密度為10個/mm&lt;sup&gt;2&lt;/sup&gt;以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1340" publication-number="202613085"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613085.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613085</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120808</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>DIOPAT富集之方法</chinese-title>  
        <english-title>METHOD FOR DIOPAT ENRICHMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D251/24</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商巴地斯顏料化工廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASF SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬力茲　加賽克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALISZ, JACEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彼得斯　珍斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETERS, JENS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施皮特勒　馬庫斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPITTLER, MARKUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯隆邁爾　漢默特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRONEMAYER, HELMUT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>衛科特　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEIKART, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於自包括DIOPAT、2,4-二羥基二苯甲酮及鋁鹽之水性鹼性混合物M富集2,4-雙-(2,4-二羥基苯基)-6-(4-甲氧基苯基)-1,3,5-三嗪(DIOPAT)之改良方法，其中該方法包括下列步驟：藉由將該混合物M酸化至pH ≤ 5來沈澱該DIOPAT；使用水稀釋粗製DIOPAT懸浮液；加熱稀釋DIOPAT懸浮液至大於50℃至95℃之範圍內之溫度；視情況藉由超濾濃縮沈澱之DIOPAT以增加該稀釋DIOPAT懸浮液中之該DIOPAT之濃度；及藉由使用水滲濾該DIOPAT懸浮液以分離該沈澱之DIOPAT與溶解2,4-二羥基二苯甲酮及溶解鋁鹽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an improved process for enriching 2,4-bis-(2,4-dihydroxyphenyl)-6-(4-methoxyphenyl)-1,3,5-triazine (DIOPAT) from an aqueous alkaline mixture M comprising DIOPAT, 2,4-dihydroxybenzophenone, and aluminum salts, wherein the process comprises the steps of precipitating the DIOPAT by acidifying the mixture M to a pH ≤ 5; diluting the crude DIOPAT suspension with water; heating the diluted DIOPAT suspension to a temperature in the range of from more than 50 °C to 95 °C; optionally concentrating the precipitated DIOPAT by ultrafiltration to increase the concentration of the DIOPAT in the diluted DIOPAT suspension; and separating of the precipitated DIOPAT from the dissolved 2,4-dihydroxybenzophenone and the dissolved aluminum salts by diafiltration of the DIOPAT suspension with water.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1341" publication-number="202613292"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613292.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613292</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120822</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>啤酒風味飲料及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120260102B">C12C11/11</main-classification>  
        <further-classification edition="200601120260102B">C12C5/02</further-classification>  
        <further-classification edition="200601120260102B">C12C12/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商朝日啤酒股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI BREWERIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木繭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, MAYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種前所未有之新穎啤酒風味飲料，其即便真實萃取物與一般之皮爾遜式啤酒為相同程度，酒精濃度及醱酵所帶來之香氣亦豐富。 &lt;br/&gt;本發明之啤酒風味飲料係包含麥芽醱酵物者，其真實萃取物濃度為6.0重量%以下，酒精濃度為10.0重量%以上，選自由乙酸乙酯、乙酸異戊酯、己酸乙酯、辛酸乙酯、及乙酸苯乙酯所組成之群中之酯類之合計濃度為40.0 mg/L以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1342" publication-number="202612725"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612725.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612725</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120834</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療代謝性脂肪性肝炎(MASH)及肝硬化之雙重GLP-1及升糖素受體促效劑</chinese-title>  
        <english-title>DUAL GLP-1 AND GLUCAGON RECEPTOR AGONIST FOR THE TREATMENT OF MASH AND CIRRHOSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K38/26</main-classification>  
        <further-classification edition="200601120260102B">A61P1/16</further-classification>  
        <further-classification edition="200601120260102B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>厄特爾　茱蒂絲　瑪莉亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ERTLE, JUDITH MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤尼斯　瑞米</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOUNES, RAMY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供藉由向有需要之患者投與包括治療有效量之化合物之醫藥組合物來預防或治療代謝肝病之方法，該代謝肝病係例如代謝功能障礙相關之脂肪性肝炎(MASH)、MASH相關之肝纖維化及/或肝硬化、MASH相關之肝硬化、MASH相關之代償性肝硬化或MASH及代償性肝硬化，該化合物包括：&lt;i&gt;H&lt;/i&gt;-H-Ac4c-QGTFTSDYSKYLDERAAKDFI-K([17-羧基-十七醯基]-異Glu-GSGSGG)-WLESA-&lt;i&gt;NH&lt;/i&gt;&lt;sub&gt;2&lt;/sub&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are methods for preventing or treating a metabolic liver disease, such as metabolic dysfunction-associated steatohepatitis (MASH), MASH-associated liver fibrosis and/or cirrhosis, MASH-associated liver cirrhosis, MASH-associated compensated liver cirrhosis, or MASH and compensated cirrhosis, by administering to a patient in need thereof a pharmaceutical composition comprising a therapeutically effective amount of a compound comprising: &lt;i&gt;H&lt;/i&gt;-H-Ac4c-QGTFTSDYSKYLDERAAKDFI-K([17-carboxy-heptadecanoyl]-isoGlu-GSGSGG)-WLESA-&lt;i&gt;NH&lt;sub&gt;2&lt;/sub&gt;&lt;/i&gt;.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1343" publication-number="202613275"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613275.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613275</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120840</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>研磨劑、研磨劑用添加液、研磨方法及半導體零件之製造方法</chinese-title>  
        <english-title>POLISHING AGENT, ADDITIVE LIQUID FOR POLISHING AGENT, POLISHING METHOD, AND METHOD FOR MANUFACTURING A SEMICONDUCTOR COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C09K3/14</main-classification>  
        <further-classification edition="200601120260102B">C09G1/02</further-classification>  
        <further-classification edition="201201120260102B">B24B37/00</further-classification>  
        <further-classification edition="200601120260102B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片桐淳生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAGIRI, ATSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可提高氮化矽之研磨速度之研磨劑、使用該研磨劑之研磨方法及半導體零件之製造方法、以及適於製備上述研磨劑之研磨劑用添加液。一種研磨劑，其含有研磨粒、第1添加劑、第2添加劑、及水，上述第1添加劑係磷之含氧酸，上述第2添加劑係具有羧基之含氮化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:研磨裝置</p>  
        <p type="p">21:半導體基板</p>  
        <p type="p">22:研磨頭</p>  
        <p type="p">23:研磨壓盤</p>  
        <p type="p">24:研磨墊</p>  
        <p type="p">25:研磨劑</p>  
        <p type="p">26:研磨劑供給配管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1344" publication-number="202614285"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614285.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614285</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120851</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拾取管嘴、拾取單元及接合裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/67</main-classification>  
        <further-classification edition="200601120251230B">H01L21/52</further-classification>  
        <further-classification edition="200601120251230B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>窪田雅大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本村耕治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTOMURA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱平大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAHIRA, MASARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">拾取管嘴(14a)是用於以非接觸方式拾取晶片(6a)的管嘴，具備：連接部(14aa)，連接於為了使音波產生而在第1方向上振動的振動部(152a)；及相向部(14ac)，具有與晶片(6a)在第1方向上相向的相向面(41)，且固定於連接部(14aa)。相向部(14ac)包含：本體部(14x)；4個外側貫通孔(44)，用於吸引晶片(6a)，且貫通本體部(14x)；及4個凹部(42)，各自相對於相向面(41)凹陷，且延伸至與第1方向垂直的第2方向上的本體部(14x)之端。4個外側貫通孔(44)的每一個的至少一部分貫通4個凹部(42)當中的與該外側貫通孔(44)對應的凹部(42)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14a:拾取管嘴</p>  
        <p type="p">14aa:連接部</p>  
        <p type="p">14ab:基部</p>  
        <p type="p">14ac:相向部</p>  
        <p type="p">14c:吸引孔</p>  
        <p type="p">14x:本體部</p>  
        <p type="p">40:面</p>  
        <p type="p">41:相向面</p>  
        <p type="p">42:凹部</p>  
        <p type="p">43:內側貫通孔</p>  
        <p type="p">44:外側貫通孔</p>  
        <p type="p">C:邊界</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1345" publication-number="202613495"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613495.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613495</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120868</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢查裝置、檢查方法及檢查程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G01B11/245</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商雅馬哈智能機器控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAHA ROBOTICS HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾川謙一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関川陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKIKAWA, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯比　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIRKBY, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種即使是細且複雜地接線連接的接合引線，亦可利用較少的圖像在短時間內對所述結線路徑進行三維分析的檢查裝置等。檢查裝置是對在基板與半導體晶片之間接線連接的接合引線進行檢查的裝置，所述檢查裝置包括：第一拍攝單元，用於俯瞰拍攝半導體晶片，其中，光學系統和拍攝元件以與基板的表面平行的平面成為焦平面的方式滿足賽因福祿條件而配置，且所述第一拍攝單元具有以作為檢查對象的接合引線的環高度收斂於景深的方式進行調整的光圈；第二拍攝單元，用於自與第一拍攝單元的俯瞰方向不同的方向俯瞰拍攝半導體晶片；以及分析部，藉由將第一拍攝單元輸出的第一拍攝圖像與第二拍攝單元輸出的第二拍攝圖像進行對比，對接合引線的結線路徑進行三維分析。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">130:第一拍攝單元</p>  
        <p type="p">131:第一拍攝元件</p>  
        <p type="p">132a、142a:物側透鏡群組</p>  
        <p type="p">132b、142b:像側透鏡群組</p>  
        <p type="p">133、143:光圈</p>  
        <p type="p">140:第二拍攝單元</p>  
        <p type="p">141:第二拍攝元件</p>  
        <p type="p">190:載台</p>  
        <p type="p">310:接合引線</p>  
        <p type="p">320:基板</p>  
        <p type="p">320a:基板表面</p>  
        <p type="p">330:半導體晶片</p>  
        <p type="p">D&lt;sub&gt;P&lt;/sub&gt;:景深</p>  
        <p type="p">H&lt;sub&gt;W&lt;/sub&gt;:環高度</p>  
        <p type="p">P&lt;sub&gt;1&lt;/sub&gt;:直線</p>  
        <p type="p">S&lt;sub&gt;1&lt;/sub&gt;、S&lt;sub&gt;3&lt;/sub&gt;:平面</p>  
        <p type="p">S&lt;sub&gt;2&lt;/sub&gt;:假想面</p>  
        <p type="p">X、Y、Z:軸方向(軸)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1346" publication-number="202613021"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613021.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613021</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120870</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>飲料機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B67D1/07</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商朝日集團控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI GROUP HOLDINGS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光畑伸輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUHATA, SHINSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楠健志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSUNOKI, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西尾崇志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福成英俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUNARI, HIDETOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和田貴志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WADA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之將飲料注出至飲料容器之飲料機包含：第1注出部，其自濃縮成分噴嘴注出濃縮成分；及第2注出部，其自稀釋成分噴嘴注出稀釋成分；且前述濃縮成分噴嘴及前述稀釋成分噴嘴配置為自前述稀釋成分噴嘴注出之稀釋成分衝擊前述濃縮成分噴嘴之前端部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第1注出部(濃縮成分注出部/第1濃縮成分噴嘴)</p>  
        <p type="p">11:濃縮成分噴嘴(第1濃縮成分噴嘴)</p>  
        <p type="p">12:流路</p>  
        <p type="p">13:泵</p>  
        <p type="p">14:濃縮成分源</p>  
        <p type="p">20:第2注出部(稀釋成分注出部)</p>  
        <p type="p">21:稀釋成分噴嘴</p>  
        <p type="p">22:稀釋成分供給部</p>  
        <p type="p">40:操作部</p>  
        <p type="p">42:注出開關</p>  
        <p type="p">50:控制</p>  
        <p type="p">60:殼體</p>  
        <p type="p">100:飲料機</p>  
        <p type="p">BC:飲料容器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1347" publication-number="202613058"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613058.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613058</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120873</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>六方晶氮化硼粉末、其製造方法及樹脂組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">C04B35/5833</main-classification>  
        <further-classification edition="200601120251223B">C01B21/064</further-classification>  
        <further-classification edition="200601120251223B">C01B35/14</further-classification>  
        <further-classification edition="200601120251223B">C22C29/16</further-classification>  
        <further-classification edition="200601120251223B">B32B27/04</further-classification>  
        <further-classification edition="200601120251223B">B32B27/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商德山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUYAMA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浜坂剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMASAKA, GO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為了提供一種六方晶氮化硼粉末，其作為填料而填充於樹脂時，所獲得之樹脂組成物在高頻帶時的介電損耗正切之頻率依賴性小，本揭示相關之六方晶氮化硼粉末之中徑D50為1～10μm，比表面積為1～10m&lt;sup&gt;2&lt;/sup&gt;/g，其特徵在於：藉由以片的厚度成為0.35mm～0.45mm之方式，使用厚度0.4mm之SUS模具，將前述六方晶氮化硼粉末以30體積％的比率混入聚丙烯樹脂而獲得樹脂組成物以2噸、180℃之條件壓製2分鐘，再以2噸、40℃之條件壓製2分鐘來成形為片狀，利用共振器法(resonator method)測定該片的介電損耗正切時，於頻率10GHz、91GHz時分別測得之介電損耗正切tanδ&lt;sub&gt;10&lt;/sub&gt;、tanδ&lt;sub&gt;91&lt;/sub&gt;之比tanδ&lt;sub&gt;91&lt;/sub&gt;/tanδ&lt;sub&gt;10&lt;/sub&gt;為1.4以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1348" publication-number="202614099"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614099.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614099</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120875</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電感裝置及使用此電感裝置的電源轉換器</chinese-title>  
        <english-title>INDUCTIVE DEVICE AND POWER CONVERTER USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">H01F27/24</main-classification>  
        <further-classification edition="200601120250701B">H01F27/28</further-classification>  
        <further-classification edition="200601120250701B">H01F17/04</further-classification>  
        <further-classification edition="200601120250701B">H01F38/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光寶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾成維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHENG-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瀚民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, HAN-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳震</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電感裝置，包括：支撐體、磁芯、以及多個支路。磁芯設置於支撐體內。多個支路，設置於支撐體，且彼此並聯連接。多個支路的每一個均具有繞組結構，且分別圍繞磁芯。設置在不同支路上的所有繞組，以彼此交錯的方式設置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An inductor device includes a support body, a magnetic core, and a plurality of branches. The magnetic core is arranged in the supporting body. The plurality of branches are arranged in the support body and are connected in parallel with each other. Each of the plurality of branches has a winding structure and surrounds the magnetic core respectively. All windings arranged on different branches are arranged in an interleaved manner.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">LL&lt;sub&gt;1&lt;/sub&gt;~LL&lt;sub&gt;6&lt;/sub&gt;:板層</p>  
        <p type="p">B&lt;sub&gt;1&lt;/sub&gt;~B&lt;sub&gt;6&lt;/sub&gt;:第1支路~第3支路</p>  
        <p type="p">w&lt;sub&gt;1&lt;/sub&gt;~w&lt;sub&gt;6&lt;/sub&gt;:LL&lt;sub&gt;1&lt;/sub&gt;~LL&lt;sub&gt;6&lt;/sub&gt;板層上的繞組</p>  
        <p type="p">I:流過電感裝置的電流</p>  
        <p type="p">I&lt;sub&gt;1&lt;/sub&gt;~I&lt;sub&gt;3&lt;/sub&gt;:流過第1支路~第3支路的電流</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1349" publication-number="202612741"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612741.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612741</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120883</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二糖化合物、含有二糖化合物的抗體-藥物偶聯物及其用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260102B">A61K47/68</main-classification>  
        <further-classification edition="200601120260102B">C07H15/08</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商海南先聲再明醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAINAN SIMCERE ZAIMING PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李楨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏夢浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, MENGHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳常豔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHANGYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>付雅媛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, YAYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李正濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHENGTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王雪楓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XUEFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了式I所示的二糖化合物、含有該二糖化合物的抗體-藥物偶聯物以及其作為抗腫瘤藥物等方面的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1350" publication-number="202614455"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614455.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614455</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120889</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電極、二次電池、及電池組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251001B">H01M4/131</main-classification>  
        <further-classification edition="201001120251001B">H01M4/136</further-classification>  
        <further-classification edition="201001120251001B">H01M4/48</further-classification>  
        <further-classification edition="201001120251001B">H01M4/58</further-classification>  
        <further-classification edition="200601120251001B">H01M4/62</further-classification>  
        <further-classification edition="200601120251001B">H01M4/66</further-classification>  
        <further-classification edition="200601120251001B">H01M4/80</further-classification>  
        <further-classification edition="202101120251001B">H01M50/289</further-classification>  
        <further-classification edition="202101120251001B">H01M50/296</further-classification>  
        <further-classification edition="202101120251001B">H01M50/298</further-classification>  
        <further-classification edition="200601120251001B">H01M10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東芝股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA TOSHIBA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村田芳明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA, YOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下泰伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, YASUNOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加納顕人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANO, KENTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋圭太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, KEITARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田康宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高見則雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAMI, NORIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供可實現倍率性能及壽命性能高的二次電池及電池組的電極，以及倍率性能及壽命性能高的二次電池及電池組。 &lt;br/&gt;　　根據實施形態，提供具備包含金屬之箔形狀的集電體，及該集電體上的活性物質含有層的電極。集電體以間距3.0mm以上100mm以下開孔有複數直徑10μm以上1000μm以下的貫穿孔。相對於離貫穿孔的外周距離貫穿孔直徑的1.5倍以上之非開口部之氧原子量O&lt;sub&gt;U&lt;/sub&gt;相對於金屬原子量Me&lt;sub&gt;U&lt;/sub&gt;的比O&lt;sub&gt;U&lt;/sub&gt;/Me&lt;sub&gt;U&lt;/sub&gt;，離貫穿孔的外周距離貫穿孔之直徑的5%以內的孔周圍部之氧原子量O&lt;sub&gt;P&lt;/sub&gt;相對於金屬原子量Me&lt;sub&gt;P&lt;/sub&gt;的比O&lt;sub&gt;P&lt;/sub&gt;/Me&lt;sub&gt;P&lt;/sub&gt;為1.2倍以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10a:集電體</p>  
        <p type="p">10c:集電舌片</p>  
        <p type="p">11:貫穿孔</p>  
        <p type="p">12:孔周圍部</p>  
        <p type="p">13:非開口部</p>  
        <p type="p">13a:測定點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1351" publication-number="202612693"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612693.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612693</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120912</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>GLP-1受體激動劑的口服藥物組合物及其製備方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/4545</main-classification>  
        <further-classification edition="200601120260102B">A61K9/16</further-classification>  
        <further-classification edition="200601120260102B">A61K47/38</further-classification>  
        <further-classification edition="200601120260102B">A61K47/26</further-classification>  
        <further-classification edition="200601120260102B">A61K47/20</further-classification>  
        <further-classification edition="200601120260102B">A61K47/12</further-classification>  
        <further-classification edition="200601120260102B">A61P3/00</further-classification>  
        <further-classification edition="200601120260102B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商杭州中美華東製藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANGZHOU ZHONGMEIHUADONG PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈雨潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YURUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　東舟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, DONGZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了包含(S)-2-((4-(6-((2-氟-4-(氧雜環丁烷-3-基)苄基)氧基)吡啶-2-基)哌啶-1-基)甲基)-1-(氧雜環丁烷-2-基甲基)-1H-苯并[d]咪唑-6-甲酸(“OAD2”)或其藥學上可接受的鹽的藥物組合物，及其藥物組合物的製備方法。本發明提供的藥物組合物溶出佳，總雜質含量低，藥物組合物可在常溫常濕條件下穩定保存。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1352" publication-number="202613201"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613201.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613201</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114120931</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚醯亞胺系樹脂、聚醯胺酸樹脂、聚醯胺酸樹脂組成物及其硬化膜、以及半導體封裝件</chinese-title>  
        <english-title>POLYIMIDE RESIN, POLYAMIC ACID RESIN, POLYAMIC ACID RESIN COMPOSITION AND CURED FILM THEREOF, AND SEMICONDUCTOR PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">C08F287/00</main-classification>  
        <further-classification edition="200601120251219B">C08G73/12</further-classification>  
        <further-classification edition="200601120251219B">C08L79/08</further-classification>  
        <further-classification edition="200601120251219B">C09J179/08</further-classification>  
        <further-classification edition="200601120251219B">C08J5/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申在賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, JAEHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮本皓史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMOTO, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小沼勇輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONUMA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的係提供一種聚醯亞胺系樹脂，其係線膨脹係數低，且適合於介電特性亦優異之樹脂硬化膜的形成。 &lt;br/&gt;本發明之聚醯亞胺系樹脂係具有源自四羧酸酐之構成單元(A)及源自二胺之構成單元(B)，其中， &lt;br/&gt;前述構成單元(B)係包含式(B1)所示的源自脂肪族二胺之構成單元(B1)及源自芳香族系二胺之構成單元(B2)， &lt;br/&gt;&lt;img align="absmiddle" height="48px" width="292px" file="ed10034.JPG" alt="ed10034.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[式(B1)中，X&lt;sup&gt;1&lt;/sup&gt;係碳數14以上之脂肪族基]；且， &lt;br/&gt;前述聚醯亞胺系樹脂為包含下列者之嵌段共聚物: 包含前述構成單元(A)與前述構成單元(B1)之醯亞胺嵌段(I)；及包含前述構成單元(A)與前述構成單元(B2)之醯亞胺嵌段(II)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention aims to provide a polyimide resin suitable for forming cured resin films having a low linear expansion coefficient and excellent dielectric properties. &lt;br/&gt;Provided as a solution in the present invention is a polyimide resin having a structural unit (A) derived from a tetracarboxylic acid anhydride and a structural unit (B) derived from a diamine, wherein the structural unit (B) contains an aliphatic diamine-derived structural unit (B1) represented by formula (B1) &lt;br/&gt;&lt;img align="absmiddle" height="43px" width="264px" file="ed10035.JPG" alt="ed10035.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;[in formula B1, X&lt;sup&gt;1&lt;/sup&gt; is an aliphatic group having 14 or more carbon atoms], &lt;br/&gt;and an aromatic diamine-derived structural unit (B2). The polyimide resin is a block copolymer containing an imide block (I) composed of the structural unit (A) and the structural unit (B1), and an imide block (II) composed of the structural unit (A) and the structural unit (B2).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1353" publication-number="202614181"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614181.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614181</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121003</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對基板進行成膜之方法及對基板進行成膜之裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251227B">H01L21/285</main-classification>  
        <further-classification edition="200601120251227B">H01L21/3205</further-classification>  
        <further-classification edition="200601120251227B">H01L21/768</further-classification>  
        <further-classification edition="200601120251227B">C23C16/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>板谷剛司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITATANI, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石坂忠大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIZAKA, TADAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部朋弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡野真也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKANO, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在不同處理容器分別使金屬氮化膜及金屬膜成膜時會抑制處理容器間之搬送所致之對金屬膜之膜厚的影響。 &lt;br/&gt;  一種對基板進行成膜之方法，係包含下述工序：在第1處理容器中對該基板供給含氯的金屬原料氣體及含氮的反應氣體以使金屬氮化膜成膜；接著，在該第1處理容器中對該基板供給含氨氣或氧氣的處理氣體以實施後處理；將進行該後處理後之該基板保持在被加熱至300℃以上之基板保持部並從該第1處理容器往供進行金屬膜的成膜之第2處理容器搬送；以及在該第2處理容器中使該金屬膜成膜在該金屬氮化膜的表面側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">Ma:含Cl分子</p>  
        <p type="p">W:基板</p>  
        <p type="p">10:含Si層</p>  
        <p type="p">11:TiN膜</p>  
        <p type="p">13:TiON膜</p>  
        <p type="p">55:基板載置台</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1354" publication-number="202613351"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613351.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613351</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121004</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">C23C16/448</main-classification>  
        <further-classification edition="200601120251226B">C23C16/46</further-classification>  
        <further-classification edition="200601120251226B">C23C16/50</further-classification>  
        <further-classification edition="200601120251226B">C23C16/52</further-classification>  
        <further-classification edition="200601120251226B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提高產能。 &lt;br/&gt;基板處理方法係包含工序(a)與工序(b)。工序(a)係提供具有凹部的基板，該凹部係透過第1單體及第2單體的蒸鍍聚合反應填埋有含有脲鍵的聚合物材料。工序(b)係將基板加熱至聚合物材料會熱分解的溫度，以透過解聚將聚合物材料分解。此外，工序(b)係藉由供應含有氫、氧或鹵素系之氣體的處理氣體，透過氣體的電漿中包含的活性物質來使透過解聚而產生的反應性單體分解氣體化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1355" publication-number="202614565"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614565.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614565</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121009</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用非正弦產生器建立IEDF的系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR CREATING AN IEDF USING A NON-SINUSOIDAL GENERATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">H03K5/01</main-classification>  
        <further-classification edition="200601120251216B">G05B13/04</further-classification>  
        <further-classification edition="200601120251216B">G05B19/408</further-classification>  
        <further-classification edition="200601120251216B">H01J37/32</further-classification>  
        <further-classification edition="200601120251216B">H01L21/3065</further-classification>  
        <further-classification edition="200601120251216B">C23C16/50</further-classification>  
        <further-classification edition="200601120251216B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭順旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, SOONWOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坎伯　湯姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMP, TOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派特森　亞歷山大　米勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATERSON, ALEXANDER MILLER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">說明一種離子能量分佈函數(IEDF)控制方法、IEDF控制器及IEDF系統。IEDF方法包含接收離子能量分佈函數的中心，接收來自中心的過補償擴展的第一範圍，並接收來自中心的欠補償擴展的第二範圍。IEDF方法更包含接收過補償擴展的第一斜率，接收欠補償擴展的第二斜率，並且基於第一範圍、第二範圍、第一斜率和第二斜率，識別出要使用非正弦偏壓(NSB)電壓源達成的離子通量補償的數值組合。IEDF方法包含控制NSB電壓源以產生具有該離子通量補償的數值組合的非正弦電壓波形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An ion energy distribution function (IEDF) control method, an IEDF controller, and an IEDF system are described. The IEDF method includes receiving a center of an ion energy distribution function, receiving a first extent of an overcompensated spread from the center, and receiving a second extent of an undercompensated spread from the center. The IEDF method further includes receiving a first slope of the overcompensated spread, receiving a second slope of the undercompensated spread, and identifying, based on the first extent, the second extent, the first slope, and the second slope, a combination of values of ion flux compensation to be achieved using a non-sinusoidal bias (NSB) voltage source. The IEDF method includes controlling the NSB voltage source to generate a non-sinusoidal voltage waveform having the combination of values of ion flux compensation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">P1:點</p>  
        <p type="p">P2:點</p>  
        <p type="p">S:基板</p>  
        <p type="p">SW1:開關</p>  
        <p type="p">VDC1:直流(DC)電壓源</p>  
        <p type="p">VDC2:DC電壓源</p>  
        <p type="p">100:電漿系統</p>  
        <p type="p">102:非正弦偏壓(NSB)電壓源</p>  
        <p type="p">104:電漿腔室</p>  
        <p type="p">106:主機電腦</p>  
        <p type="p">108:電壓供應電路</p>  
        <p type="p">110:充電二極體</p>  
        <p type="p">111:諧振電感器</p>  
        <p type="p">112:放電二極體</p>  
        <p type="p">114:能量儲存和轉移電路</p>  
        <p type="p">116:IEDF二極體</p>  
        <p type="p">118:電壓供應電路</p>  
        <p type="p">120:輸入</p>  
        <p type="p">122:輸出</p>  
        <p type="p">124:處理器</p>  
        <p type="p">126:記憶體裝置</p>  
        <p type="p">128:靜電夾頭(ESC)</p>  
        <p type="p">130:上電極</p>  
        <p type="p">132:電壓感測器</p>  
        <p type="p">134:RF連接</p>  
        <p type="p">136:RF連接</p>  
        <p type="p">138:脈衝電壓波形</p>  
        <p type="p">140:修改過的脈衝DC波形、修改過的脈衝電壓波形、修改過的電壓波形</p>  
        <p type="p">142:非正弦電壓波形</p>  
        <p type="p">144:量測信號</p>  
        <p type="p">146:on控制信號</p>  
        <p type="p">148:電流波形</p>  
        <p type="p">150:修改過的電流波形</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1356" publication-number="202614286"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614286.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614286</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121024</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高壓退火裝置</chinese-title>  
        <english-title>HIGH PRESSURE ANNEALING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L21/67</main-classification>  
        <further-classification edition="200601120260102B">F27B17/00</further-classification>  
        <further-classification edition="200601120260102B">H01L21/324</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商熱思特設備技術股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEST CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>咸榮儁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAM, YOUNG JOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金楨䉨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JEONG EUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權容煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, YONG HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李進碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIN SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃昞煜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, BYUNG WOOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牟然民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MO, YEON MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李恩讚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, EUN CHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金倫煇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, RYUN HWI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種包括噴嘴組件的高壓退火裝置，公開一種當所述噴氣嘴向所述高壓退火裝置的腔體內部供應氣體時，在與氣體供應模組結合的同時防止破損的技術。根據本發明的高壓退火裝置的一實施例包括：腔體，提供工藝空間，氣體供應到所述工藝空間而與基板反應；噴嘴組件，向所述腔體的工藝空間噴射所述氣體；以及腔體支承體，被安放所述腔體而支承所述腔體，並具備從內側面凸出而安裝所述噴嘴組件的至少一部分的安裝部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:噴嘴組件</p>  
        <p type="p">130:腔體支承體</p>  
        <p type="p">131:安裝部</p>  
        <p type="p">200:噴氣嘴</p>  
        <p type="p">210:噴嘴上端</p>  
        <p type="p">211:噴射口</p>  
        <p type="p">220:噴氣嘴下端</p>  
        <p type="p">310:第一支承體</p>  
        <p type="p">360:第二支承體</p>  
        <p type="p">400:結合部件</p>  
        <p type="p">510:供應模組主體</p>  
        <p type="p">520:模組安裝蓋</p>  
        <p type="p">530:適配器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1357" publication-number="202613131"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613131.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613131</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121027</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>殼寡醣藥物構築體</chinese-title>  
        <english-title>CHITO-OLIGOSACCHARIDE DRUG CONSTRUCTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D491/22</main-classification>  
        <further-classification edition="200601120260102B">C07D498/18</further-classification>  
        <further-classification edition="200601120260102B">C07K5/02</further-classification>  
        <further-classification edition="200601120260102B">C07D487/04</further-classification>  
        <further-classification edition="200601120260102B">C07H3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商西格馬　奧爾德里奇有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIGMA-ALDRICH CO. LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪斯柯里　馬克　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASKERI, MARK A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　加米　Ｙ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JAMY Y.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏莫斯基　羅斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEMOWSKI, ROSS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供經改良之殼寡醣藥物構築體。在各種具體實例中，經改良之CO-藥物構築體包括CO-(m-PAB)-依喜替康（exatecan）、CO-(m-PAB)-(β-Ala&lt;sub&gt;2&lt;/sub&gt;)-依喜替康、CO-(m-PAB)-倍癌黴素（duocarmycin）、CO-(m-PAB)-DM1及CO-(m-PAB)S-MMAE。亦提供用於製備此等化合物之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Improved chito-oligosaccharide-drug constructs are provided. In various embodiments, the improved CO-drug constructs include CO-(m-PAB)-exatecan, CO-(m-PAB)-(β-Ala&lt;sub&gt;2&lt;/sub&gt;)-exatecan, CO-(m-PAB)-duocarmycin, CO-(m-PAB)-DM1, and CO-(m-PAB)-MMAE. Also provided are methods for preparing these compounds.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1358" publication-number="202612691"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612691.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612691</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121029</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於預防及治療起因於肥胖狀態之疾病之醫藥</chinese-title>  
        <english-title>PHARMACEUTICAL COMPOSITION FOR THE TREATMENT AND/OR PREVENTION OF DISEASES CAUSED BY OBESITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/444</main-classification>  
        <further-classification edition="200601120260102B">A61K38/26</further-classification>  
        <further-classification edition="200601120260102B">A61P3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鹽野義製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIONOGI &amp; CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>園山拓洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONOYAMA, TAKUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石橋徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIBASHI, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷岡秀樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIOKA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤秀昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹本光佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEMOTO, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河內智行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWACHI, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供具有優異之MGAT2抑制作用，且至少不伴隨消化道障礙、膽囊炎、心跳增加、低血糖、急性胰臟炎、止血異常、肝障礙、腎障礙或胚胎致死性等任一種以上副作用之用於治療及/或預防起因於肥胖狀態之疾病、特別是肥胖症疾病之醫藥組成物。 &lt;br/&gt;　　此外，提供在肥胖症中之體重管理、即體重減量、體重減量後之體重維持上非常有用之醫藥組成物。 &lt;br/&gt;　　提供含有以式(I)： &lt;br/&gt;&lt;img align="absmiddle" height="152px" width="210px" file="ed10030.JPG" alt="ed10030.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　所表示之化合物或其藥學上可接受之鹽之用於治療及/或預防起因於肥胖狀態之疾病之醫藥組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is to provide a pharmaceutical composition for the treatment and/or prevention of diseases caused by obesity, particularly obesity-related diseases, which has excellent MGAT2 inhibitory activity and is free of at least one or more side effects such as gastrointestinal disorders, cholecystitis, increased heart rate, hypoglycemia, acute pancreatitis, hemostatic disorders, liver disorders, kidney disorders, or embryonic lethality. &lt;br/&gt;In addition, the present invention is to provide a pharmaceutical composition that is extremely useful for weight management in obesity, i.e., weight loss and weight maintenance after weight loss. &lt;br/&gt;The present invention is to provide a pharmaceutical composition for the treatment and/or prevention of diseases caused by obesity, which comprises a compound represented by Formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="142px" width="217px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;or a pharmaceutically acceptable salt thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1359" publication-number="202613086"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613086.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613086</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121037</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新穎化合物</chinese-title>  
        <english-title>NOVEL COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D253/07</main-classification>  
        <further-classification edition="200601120260102B">C07D405/14</further-classification>  
        <further-classification edition="200601120260102B">C07D413/14</further-classification>  
        <further-classification edition="200601120260102B">C07D405/04</further-classification>  
        <further-classification edition="200601120260102B">A61K31/53</further-classification>  
        <further-classification edition="200601120260102B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260102B">A61P25/28</further-classification>  
        <further-classification edition="200601120260102B">A61P11/00</further-classification>  
        <further-classification edition="200601120260102B">A61P9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布什　莉亞　奧蕾莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOUCHE, LEA AURELIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古巴　沃爾夫崗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUBA, WOLFGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黑爾　莎賓娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERR, SABRINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雅克　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAESCHKE, GEORG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅斯　史黛芬妮　凱瑟琳娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MESCH, STEFANIE KATHARINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席尼德　克里斯俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHNIDER, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史戴納　珊卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEINER, SANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及具有通式 I 的新穎化合物， &lt;br/&gt;&lt;img align="absmiddle" height="117px" width="244px" file="ed10035.JPG" alt="ed10035.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中 n、R&lt;sup&gt;1&lt;/sup&gt; 及 Y 係如本文所描述；包括該等化合物的組成物；以及使用該等化合物之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to novel compounds having the general formula I &lt;br/&gt;&lt;img align="absmiddle" height="111px" width="248px" file="ed10036.JPG" alt="ed10036.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein n, R&lt;sup&gt;1&lt;/sup&gt; and Y are as described herein, composition including the compounds and methods of using the compounds.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1360" publication-number="202614419"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614419.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614419</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121038</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含壁柱互連件的裝置</chinese-title>  
        <english-title>DEVICE COMPRISING WALL PILLAR INTERCONNECTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">H01L23/498</main-classification>  
        <further-classification edition="200601120251231B">H01L23/528</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳玉貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUJEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩托　安尼奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIL, ANIKET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　志杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHIJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種封裝，其包含一基材及一被動裝置，該被動裝置透過複數個焊料互連件而耦接至該基材。該基材包含：至少一個介電層；及複數個互連件。該被動裝置包含：一晶粒基材；複數個凸塊下金屬化互連件；及複數個柱互連件，其等係耦接至該複數個凸塊下金屬化互連件，其中至少一個柱互連件包含一壁柱互連件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A package comprising a substrate and a passive device coupled to the substrate through a plurality of solder interconnects. The substrate comprises at least one dielectric layer; and a plurality of interconnects. The passive device comprises a die substrate; a plurality of under bump metallization interconnects; and a plurality of pillar interconnects coupled to the plurality of under bump metallization interconnects, wherein at least one pillar interconnect comprises a wall pillar interconnect.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">103:墊互連件</p>  
        <p type="p">103a:墊互連件</p>  
        <p type="p">103c:墊互連件</p>  
        <p type="p">106:鈍化層</p>  
        <p type="p">107:凸塊下金屬化互連件</p>  
        <p type="p">107a:凸塊下金屬化互連件</p>  
        <p type="p">109:柱互連件</p>  
        <p type="p">109a:柱互連件</p>  
        <p type="p">190:焊料互連件</p>  
        <p type="p">190a:焊料互連件</p>  
        <p type="p">300:被動裝置</p>  
        <p type="p">305:溝槽電容器</p>  
        <p type="p">320:晶粒基材</p>  
        <p type="p">500:封裝</p>  
        <p type="p">520:介電層</p>  
        <p type="p">522:互連件</p>  
        <p type="p">522a:互連件</p>  
        <p type="p">524:阻焊層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1361" publication-number="202612641"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612641.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612641</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121061</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提升了攝影準確度與速度的多角度牙齒攝影裝置</chinese-title>  
        <english-title>MULTI-ANGLE TEETH IMAGING DEVICES FOR ENHANCING PHOTOGRAPHIC ACCURACY AND SPEED</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">A61B5/00</main-classification>  
        <further-classification edition="200601120251229B">A61C17/06</further-classification>  
        <further-classification edition="200601120251229B">A61B1/05</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商愛歐白歐有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIOBIO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹紅喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, HONGCHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種多角度牙齒攝影裝置，其在插入受檢者口腔的區域以具有相異拍攝角度的方式設置3個攝影機，以便拍攝作為攝影目標的牙齒的舌側、脣側及咬合面，與此同時，攝影部以可拆卸的方式結合於主體上端部，而得以憑藉單次攝影獲取作為攝影目標的牙齒的三面(舌側、脣側及咬合面)影像，在大幅減少拍攝時間的同時，還能在拍攝時讓攝影部的兩端部得到牙齦支持而得以讓晃動最小化並使得焦距保持固定，而能夠改善攝影準確度與精密度，能提升清洗及衛生效能，能夠開創性地解決先前技術在拍攝時需要把臉頰與舌推入後進行拍攝，而使得拍攝過程複雜繁瑣並讓受檢者承受異物感與不適的問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:多角度牙齒攝影裝置</p>  
        <p type="p">3:本體</p>  
        <p type="p">5:攝影部</p>  
        <p type="p">31:平坦面</p>  
        <p type="p">33:第三攝影機</p>  
        <p type="p">50:外殼</p>  
        <p type="p">51:第一翼部</p>  
        <p type="p">52:第二翼部</p>  
        <p type="p">53:第一攝影機部</p>  
        <p type="p">54:第二攝影機部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1362" publication-number="202614751"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614751.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614751</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121064</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於形成４Ｆ動態隨機存取元件之結構及方法</chinese-title>  
        <english-title>STRUCTURES AND METHODS FOR FORMING 4F2 DYNAMIC RANDOM-ACCESS DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260102B">H10B12/00</main-classification>  
        <further-classification edition="202501120260102B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　智君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費雪伯恩　菲德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FISHBURN, FREDRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪卡拉　拉古維爾Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKALA, RAGHUVEER S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普拉納塔拉蒂哈蘭　巴拉蘇布拉馬尼安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRANATHARTHIHARAN, BALASUBRAMANIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露了DRAM元件及其形成方法。一種非限制性的方法可能包括在複數個接觸開口的每個接觸開口內凹入動態隨機存取記憶體單元的複數個垂直柱，並在動態隨機存取記憶體單元的溫度保持在低於500°C的情況下，在該等垂直柱上形成選擇性的磊晶材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are DRAM devices and methods of forming DRAM devices. One non-limiting method may include recessing a plurality of vertical pillars of a dynamic random-access memory cell within each contact opening of a plurality of contact openings, and forming a selective epitaxial material over the plurality of vertical pillars while the dynamic random-access memory cell is maintained at a temperature below 500°C.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:裝置</p>  
        <p type="p">102:垂直柱</p>  
        <p type="p">104:控制閘極</p>  
        <p type="p">106:襯墊層</p>  
        <p type="p">108:絕緣層</p>  
        <p type="p">110:接觸開口</p>  
        <p type="p">112:上表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1363" publication-number="202613112"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613112.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613112</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121069</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>野生型ＫＩＴ抑制劑</chinese-title>  
        <english-title>WILD TYPE KIT INHIBITORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D471/04</main-classification>  
        <further-classification edition="200601120260102B">C07F9/141</further-classification>  
        <further-classification edition="200601120260102B">A61K31/437</further-classification>  
        <further-classification edition="200601120260102B">A61P17/04</further-classification>  
        <further-classification edition="200601120260102B">A61P17/00</further-classification>  
        <further-classification edition="200601120260102B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商纜圖藥品公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLUEPRINT MEDICINES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海朵　安德魯　馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAIDLE, ANDREW MARC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜光焰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, GUANGYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩馬拉孔　茲瓦卡　Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMARAKOON, THIWANKA B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威爾遜　道格拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILSON, DOUGLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金凱瑪　凱特琳　Ｎ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINKEMA, CAITLIN N.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫里森　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORRISON, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布魯貝克　傑森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRUBAKER, JASON D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裴洛拉　艾曼紐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEROLA, EMANUELE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪寧　湯瑪斯　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DINEEN, THOMAS A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示化合物1、化合物2及化合物3或其醫藥學上可接受之鹽， &lt;br/&gt;&lt;img align="absmiddle" height="199px" width="554px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;化合物1、化合物2及化合物3可用於抑制人類或非人類之野生型c-kit激酶且可用於治療人類或非人類之由野生型c-kit激酶介導之病症及疾病。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are Compounds 1, 2, and 3 or a pharmaceutically acceptable salt thereof: &lt;i/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="205px" width="577px" file="ed10019.JPG" alt="ed10019.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;Compounds 1, 2, and 3 are useful for inhibiting wild type c-kit kinase and for treating disorders and diseases mediated by wild type c-kit kinase in humans or non-humans.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1364" publication-number="202613173"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613173.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613173</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121094</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多特異性抗CD40/抗FAP抗體及其用途</chinese-title>  
        <english-title>MULTISPECIFIC ANTI-CD40/ANTI-FAP ANTIBODIES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/28</main-classification>  
        <further-classification edition="200601120260102B">C07K16/40</further-classification>  
        <further-classification edition="200601120260102B">C07K16/46</further-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商必治妥美雅史谷比公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRISTOL-MYERS SQUIBB COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海吉瓦思蘿　哈拉蘭柏斯　安東尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HADJIVASSILIOU, HARALAMBOS ANTONIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恩　泰西　曼　韋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NG, TESSIE MAN WAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希爾　克里斯托弗　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HILL, CHRISTOPHER MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝敏黛　芬米尼　山謬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAMIDELE, FUNMINIYI SAMUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃克　賈斯汀　卡蜜拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALKER, JUSTINE KAMILAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞達夫　尼路　哈里瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YADAV, NEELU HARIRAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓　驍剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, XIAOGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮村　茉由</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMURA, MAYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇瑟　布萊恩　佛瑞斯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIESEL, BRIAN FORREST</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請案係關於結合於CD40及/或FAP之抗體(例如多特異性抗體)，以及編碼該等抗體之核酸、包含該等核酸之載體及宿主細胞、及產生及使用該等抗體之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to antibodies (e.g., multispecific antibodies) that bind to CD40 and/or FAP, as well as nucleic acids encoding the antibodies, vectors and host cells comprising the nucleic acids, and methods of producing and using the antibodies.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1365" publication-number="202613159"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613159.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613159</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121114</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＴＣＲ細胞療法中之ＣＤ８共受體嵌合多肽</chinese-title>  
        <english-title>CD8 CO-RECEPTOR CHIMERIC POLYPEPTIDES IN TCR CELL THERAPY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K14/725</main-classification>  
        <further-classification edition="200601120260102B">C07K14/705</further-classification>  
        <further-classification edition="202501120260102B">A61K40/11</further-classification>  
        <further-classification edition="202501120260102B">A61K40/32</further-classification>  
        <further-classification edition="202501120260102B">A61K40/42</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商英特利亞醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTELLIA THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯古特斯　博基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHULTES, BIRGIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普羅迪斯　雅倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRODEUS, AARON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供嵌合CD8多肽、表現其之經工程改造之細胞以及用於製造表現其之經工程改造之細胞的組合物及方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Chimeric CD8 polypeptides, engineered cells expressing the same, and compositions and methods for making engineered cells expressing the same are provided.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1366" publication-number="202612706"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612706.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612706</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121119</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於真菌感染治療之方法</chinese-title>  
        <english-title>METHODS FOR TREATMENT OF FUNGAL INFECTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/7048</main-classification>  
        <further-classification edition="200601120260102B">A61P31/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>挪威商拜歐賽爾根公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIOSERGEN AS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NO</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐爾森　汀　寇德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLESEN, TINE KOLD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德森　佩德　莫樂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDERSEN, PEDER MOLLER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安地斯　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDES, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃裕煦</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於以化合物1或其醫藥學上可接受之鹽或中性形式(例如化合物1乙酸鹽)之給藥方案為特徵的醫藥組合物及方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention relates to pharmaceutical compositions and methods featuring dosing regimens of Compound 1, or a pharmaceutical acceptable salt or neutral form thereof (e.g., Compound 1 acetate).</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1367" publication-number="202612760"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612760.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612760</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121141</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>啞鈴、啞鈴組件和啞鈴系統</chinese-title>  
        <english-title>DUMBBELL, DUMBBELL ASSEMBLY, AND DUMBBELL SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">A63B21/072</main-classification>  
        <further-classification edition="200601120251229B">A63B21/075</further-classification>  
        <further-classification edition="200601120251229B">A63B71/00</further-classification>  
        <further-classification edition="200601120251229B">A63B21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商好運動有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOOD SPORT LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯倫斯坦　泰勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BORENSTEIN, TAYLOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布倫卡　卡蜜兒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLUMKA, CAMILLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩瑪塔　萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMATA, LANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種啞鈴組件包括長形主體，該長形主體具有在軸向方向上基本一致的橫截面邊界。該啞鈴組件具有在長形主體的第一端處沿軸向方向延伸的孔，以及可移除地容納在該孔處的配重。配重具有配重段，該配重段具有與長形主體的橫截面邊界基本相似的橫截面邊界。當容納在孔處時，配重段位於長形主體的第一端附近，並且延伸長形主體的橫截面邊界，從而為啞鈴組件限定連續的橫截面輪廓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dumbbell assembly includes an elongated body having a substantially consistent cross-sectional boundary in an axial direction. The dumbbell assembly has a bore at a first end of the elongated body extending in the axial direction and a weight removably received at the bore. The weight has a weighted segment having a cross-sectional boundary substantially similar to the cross-sectional boundary of the elongated body. When received at the bore, the weighted segment is located adjacent the first end of the elongated body and extends the cross-sectional boundary of the elongated body so as to define a continuous cross-sectional profile for the dumbbell assembly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100、1700:啞鈴組件</p>  
        <p type="p">110:啞鈴主體</p>  
        <p type="p">120、130:配重</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1368" publication-number="202613385"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613385.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613385</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121159</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分離式管架結構的連接區段</chinese-title>  
        <english-title>CONNECTING SECTIONS OF SPLIT JACKET STRUCTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">E02B17/02</main-classification>  
        <further-classification edition="200601120251223B">E02D27/10</further-classification>  
        <further-classification edition="200601120251223B">E02D35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商汐威七工程公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEAWAY 7 ENGINEERING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅　艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAY, ALLAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝恩　馬爾科姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAIN, MALCOLM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種分離式管架結構藉由將一上部管架區段降低至一預安裝下部管架區段上而安裝在海上，其中各別管架區段之同軸對準的支腿沿一界面相互鄰接。定位於鄰接支腿之管狀壁內的一灌漿錨栓延伸跨越該界面。安置於該界面上方及下方之夾持器延伸跨越位於該錨栓與該等管狀壁之間的一環狀空間以實現該錨栓與該等鄰接支腿之間的嚙合。灌漿接著通過該灌漿錨栓注入至該環狀空間中。 &lt;br/&gt;該等夾持器經致動且該灌漿經由管線自頂側供應至該錨栓，該等管線在該上部管架區段之該支腿內在一吊升纜索旁邊延伸，該吊升纜索懸掛著該錨栓且將該錨栓降低至該下部管架區段中之一止動成型件上。該止動成型件使該錨栓之導引成型件與該等鄰接支腿中之中心定位法蘭對準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A split jacket structure is installed offshore by lowering an upper jacket section onto a pre-installed lower jacket section, with coaxially-aligned legs of the respective jacket sections in mutual abutment about an interface. A grout pin positioned within tubular walls of the abutting legs extends across the interface. Grippers disposed above and below the interface extend across an annulus between the pin and the tubular walls to effect engagement between the pin and the abutting legs. Grout is then injected into the annulus through the grout pin. &lt;br/&gt;The grippers are actuated and the grout is supplied to the pin from topside via lines that extend within the leg of the upper jacket section beside a lifting wire that suspends the pin and lowers the pin onto a stop formation in the lower jacket section. The stop formation aligns guide formations of the pin with centralising flanges in the abutting legs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:管架</p>  
        <p type="p">12:上部區段</p>  
        <p type="p">14:下部區段</p>  
        <p type="p">16:支腿</p>  
        <p type="p">18:撐臂</p>  
        <p type="p">26:界面</p>  
        <p type="p">28:海床</p>  
        <p type="p">30:基座</p>  
        <p type="p">32:表面</p>  
        <p type="p">34:工作平台</p>  
        <p type="p">36:過渡件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1369" publication-number="202612750"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612750.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612750</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121190</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具備出氣口篩孔的乾粉吸入器</chinese-title>  
        <english-title>DRY POWDER INHALER WITH AN OUTLET MESH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61M11/00</main-classification>  
        <further-classification edition="200601120260102B">A61M15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商維克圖拉傳送裝置有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VECTURA DELIVERY DEVICES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德森　凱蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDERSON, CAELAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種乾粉吸入器，包括：一個或多個劑量的藥粉；一使用者可以透過其吸入藥物的出氣口；以及一包含旋流室的空氣通道，該旋流室具有壁、出口、藥粉入口通道，並可選地包含一個或多個旁通入口通道，其中藥粉入口通道和/或旁通入口通道與壁呈切線方向。在旋流室的出口設有篩孔，該篩孔由環向元件和徑向元件組成，共同界定了多個開口。當使用者透過出氣口吸入時，藥粉會被氣流帶動，並透過空氣通道中的旋流室和篩孔流出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a dry powder inhaler comprising: one or more doses of powdered medication; an outlet through which a user may inhale a dose of medication; an airway comprising a vortex chamber having a wall, an exit, a powder inlet channel, and optionally one or more bypass inlet channels, wherein the powder inlet channel and or the bypass inlet channels are tangential to the wall. A mesh is located at the exit of the vortex chamber. The mesh is formed from circumferential elements and radial elements which together define a plurality of openings. When a user inhales on the outlet, medication is entrained in an air flow and flows through the vortex chamber and the mesh in the airway and out through the outlet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:吸嘴</p>  
        <p type="p">12:篩孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1370" publication-number="202613222"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613222.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613222</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121192</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>混合物之分離方法</chinese-title>  
        <english-title>METHOD FOR SEPARATING A MIXTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">C08J11/08</main-classification>  
        <further-classification edition="200601120251230B">B29B17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡庭麻耶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKANIWA, MAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>並木康佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMIKI, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供可在工業上簡易地從含有成分A以及成分B的混合物分離成分A及成分B之生產性及經濟性優良的混合物之分離方法等；該成分A係選自於由聚酯及蛋白質纖維構成之群組中之1種以上；該成分B係選自於由聚胺甲酸酯、尼龍、丙烯酸系纖維構成之群組中之1種以上。本揭示內容之混合物之分離方法至少包含下列步驟： &lt;br/&gt;使酸性處理液於未達50℃之條件含浸於含有選自於由聚酯及蛋白質纖維構成之群組中之1種以上的成分A、以及選自於由聚胺甲酸酯、尼龍及丙烯酸系纖維構成之群組中之1種以上的成分B之混合物，獲得含有固體狀之前述成分A與液狀之前述成分B的含浸處理混合物，及 &lt;br/&gt;從前述含浸處理混合物將固體狀之前述成分A及液狀之前述成分B予以分離； &lt;br/&gt;前述酸性處理液為含有選自於由硫酸、磷酸及多聚磷酸構成之群組中之1種以上的水溶液，且前述水溶液中所含有的水為20質量%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides, a method for separating a mixture containing at least one component A selected from the group consisting of polyester and protein fiber, and at least one component B selected from the group consisting of polyurethane, nylon, and acrylic fiber, wherein the method enables industrially-simple separation of component A and component B, is highly productive, and economically efficient. The disclosed separation method includes at least: &lt;br/&gt;a step of impregnating a mixture containing at least one component A selected from the group consisting of polyester and protein fibers and at least one component B selected from the group consisting of polyurethane, nylon, and acrylic fiber, with an acidic treatment solution at a temperature below 50°C, thereby obtaining an impregnated mixture containing solid-form component A and liquid-form component B; and &lt;br/&gt;a step of separating the solid-form component A and the liquid-form component B from the impregnated mixture, &lt;br/&gt;wherein said acidic treatment solution is an aqueous solution containing at least one selected from the group consisting of sulfuric acid, phosphoric acid, and polyphosphoric acid, with the water content in said aqueous solution being 20 wt% or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1371" publication-number="202613132"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613132.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613132</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121197</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>喜樹鹼類衍生物及其用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D491/22</main-classification>  
        <further-classification edition="200601120260102B">C07K16/28</further-classification>  
        <further-classification edition="201701120260102B">A61K47/68</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商海思科醫藥集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAISCO PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李瑤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張浩亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HAOLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文斐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WENFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王建成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIANCHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐孝浪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, XIAOLANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚志堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, ZHIJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李雪梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, XUEMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王洪斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HONGBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐平明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, PINGMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嚴龐科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, PANGKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林發立</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種喜樹鹼類衍生物及其用途。特別地，本發明涉及通式（I）所示的化合物、其製備方法、其藥物組合物，以及通式（I）所示的化合物或其藥物組合物用途，所述化合物可用作治療細胞異常增殖方面疾病的藥物，其中通式（I）中的各取代基與說明書中的定義相同。 &lt;br/&gt;&lt;img align="absmiddle" height="269px" width="175px" file="ed10402.JPG" alt="ed10402.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1372" publication-number="202613769"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613769.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613769</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121202</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有雙螢幕的電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE WITH TWO DISPLAYS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G06F1/16</main-classification>  
        <further-classification edition="200601120251001B">H05K7/14</further-classification>  
        <further-classification edition="202201120251001B">G06F3/04886</further-classification>  
        <further-classification edition="200601120251001B">G06F3/147</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁寶電腦工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMPAL ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許政皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHENG-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZOU, JYH-CHYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡易達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, I-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳羿豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, I-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括具有第一螢幕的第一機體、承載件、彈性伸縮模組以及具有第二螢幕的第二機體。承載件沿滑動方向滑設於第一機體且具有三角形凹槽及主滑軌。主滑軌沿滑動方向延伸。彈性伸縮模組的固定端鎖固於三角形凹槽，彈性伸縮模組的移動端穿設於主滑軌而鎖固於第一機體。第二機體設置於承載件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device includes a first body with a first display, a carrier, an elastic retractable module and a second body with a second display. The carrier slidably disposed on the first body along a sliding direction includes a triangular recess and a main slide rail. The main slide rail extend along the sliding direction. A fixed end of the elastic retractable module is fastened to the triangular recess, and a moving end of the elastic retractable module penetrates the main slide rail to be fastened to the first body. The second body is disposed on the carrier.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">110:第一機體</p>  
        <p type="p">111:第一螢幕</p>  
        <p type="p">112:固定件</p>  
        <p type="p">113:第一邊框</p>  
        <p type="p">114:主體</p>  
        <p type="p">120:承載件</p>  
        <p type="p">121:三角形凹槽</p>  
        <p type="p">122:主滑軌</p>  
        <p type="p">130:彈性伸縮模組</p>  
        <p type="p">140:第二機體</p>  
        <p type="p">141:第二螢幕</p>  
        <p type="p">142:第二邊框</p>  
        <p type="p">162:發光模組</p>  
        <p type="p">E1:第一邊緣</p>  
        <p type="p">S1:固定端</p>  
        <p type="p">S2:移動端</p>  
        <p type="p">SD:滑動方向</p>  
        <p type="p">V1:第一頂點</p>  
        <p type="p">V2:第二頂點</p>  
        <p type="p">V3:第三頂點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1373" publication-number="202612605"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612605.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612605</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121206</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>夾鏈帶及附夾鏈帶之容器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">A44B19/16</main-classification>  
        <further-classification edition="200601120251229B">B65D33/25</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商出光統一科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDEMITSU UNITECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉村梓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIMURA, AZUSA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤俊一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, SHUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戸髙匠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TODAKA, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上村哉生樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIMURA, YAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種夾鏈帶，其係剖面形狀上包含一對基部、及自上述一對基部之彼此對向之面分別突出且能夠彼此卡合之卡合部的長條狀之夾鏈帶，且至少上述卡合部由含有聚乙烯及改質劑之樹脂組合物形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:袋</p>  
        <p type="p">10:膜</p>  
        <p type="p">11A:第1面</p>  
        <p type="p">11B:第2面</p>  
        <p type="p">14:開口部</p>  
        <p type="p">20:夾鏈帶</p>  
        <p type="p">21A,21B:基部</p>  
        <p type="p">22A,22B:卡合部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1374" publication-number="202614752"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614752.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614752</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121208</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於三維動態隨機存取記憶體電晶體之局部氧化</chinese-title>  
        <english-title>LOCAL OXIDATION FOR THREE-DIMENSIONAL DYNAMIC RANDOM ACCESS MEMORY TRANSISTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260102B">H10B12/00</main-classification>  
        <further-classification edition="202001120260102B">G06F30/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商賽諾西斯公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYNOPSYS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯孟萱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, MENG-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿莫羅索　薩爾瓦多　瑪利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMOROSO, SALVATORE MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿謝諾夫　普拉門　阿謝諾夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASENOV, PLAMEN ASENOV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　錫偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, XI-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李可欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KO-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法可包含與提供一層堆疊相關聯之操作，該等層由該等層之間的一介電質分離，各層包括由該複數個單位單元之間的該介電質分離之複數個單位單元，各單位單元包含一矽通道、在至少兩個維度上包圍該矽通道之一閘極氧化物及在該至少兩個維度上包圍該閘極氧化物之一閘極金屬，該等操作包含凹部蝕刻以移除各單位單元中之該閘極金屬之一部分及對各單位單元中之該閘極氧化物應用一種氧化物生長程序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method may include operations associated with providing a stack of layers, the layers separated by a dielectric between the layers, each layer comprising a plurality of unit cells separated by the dielectric between the plurality of unit cells, each unit cell including a silicon channel, a gate oxide surrounding the silicon channel in at least two dimensions, and a gate metal surrounding the gate oxide in the at least two dimensions, the operations including recess etching to remove a portion of the gate metal in each unit cell and applying an oxide growth process to the gate oxide in each unit cell.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:區塊</p>  
        <p type="p">110:第一階段</p>  
        <p type="p">112:矽鍺(SiGe)層</p>  
        <p type="p">114:矽(Si)層</p>  
        <p type="p">116:Si基板/基底</p>  
        <p type="p">120:階段</p>  
        <p type="p">121:電晶體區</p>  
        <p type="p">122:電晶體隔離區/電晶體區</p>  
        <p type="p">130:階段</p>  
        <p type="p">132:閘極氧化物</p>  
        <p type="p">134:電容器區</p>  
        <p type="p">140:階段</p>  
        <p type="p">142:閘極金屬</p>  
        <p type="p">150:階段</p>  
        <p type="p">152:介電質填充物</p>  
        <p type="p">160:階段</p>  
        <p type="p">164:間隙</p>  
        <p type="p">166:源極側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1375" publication-number="202613004"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613004.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613004</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121219</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送設備</chinese-title>  
        <english-title>TRANSPORT FACILITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">B65G35/00</main-classification>  
        <further-classification edition="200601120251230B">B65G43/08</further-classification>  
        <further-classification edition="200601120251230B">B65G43/10</further-classification>  
        <further-classification edition="200601120251230B">B65G47/22</further-classification>  
        <further-classification edition="200601120251230B">B65G1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河野誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONO, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種搬送設備，具備搬送車與區間控制系統。區間控制系統是在對已先行進入至特定區間之先行搬送車1L授與第1通過地點R1或第2通過地點R2的通過許可之後，從比先行搬送車1L更之後進入至特定區間之後續搬送車1F出現了關於第1通過地點R1或第2通過地點R2的通過許可請求之情況下，於後續停止地點SF與先行停止地點SL不同，且後續通過地點RF與先行通過地點RL不同之情況下，對後續搬送車1F授與後續通過地點RF的通過許可。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transport facility includes a transport vehicle and a section control system. In a case where a following stop point is different from a leading stop point, and a following passage point is different from a leading passage point at the time when the section control system receives a passage permission request on a first passage point or a second passage point from a following transport vehicle to enter a specific section subsequently to a leading transport vehicle entering the specific section first after the section control system gives the leading transport vehicle a passage permission to pass through the first passage point or the second passage point, the section control system gives the following transport vehicle a passage permission to pass through the following passage point.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:搬送車</p>  
        <p type="p">1F:後續搬送車</p>  
        <p type="p">1L:先行搬送車</p>  
        <p type="p">90:交叉點</p>  
        <p type="p">R1:第1通過地點</p>  
        <p type="p">R2:第2通過地點</p>  
        <p type="p">RF:後續通過地點</p>  
        <p type="p">RL:先行通過地點</p>  
        <p type="p">S1:第1停止地點</p>  
        <p type="p">S2:第2停止地點</p>  
        <p type="p">SF:後續停止地點</p>  
        <p type="p">SL:先行停止地點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1376" publication-number="202612847"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612847.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612847</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121225</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>調節加工系統之系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251229B">B24B53/02</main-classification>  
        <further-classification edition="200601120251229B">B24B7/04</further-classification>  
        <further-classification edition="200601120251229B">B24B7/20</further-classification>  
        <further-classification edition="200601120251229B">B24B27/04</further-classification>  
        <further-classification edition="201201120251229B">B24B37/10</further-classification>  
        <further-classification edition="200601120251229B">B24B41/047</further-classification>  
        <further-classification edition="200601120251229B">B24B53/12</further-classification>  
        <further-classification edition="201201120251229B">B24B53/017</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商菲斯特歐洲股份兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FESTO SE &amp; CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施密特　馬可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMIDT, MARCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於調節一加工系統(2)的系統(1)，包括：一調節單元(3)，具有一軸承座(7)及一安裝在軸承座(7)的調節頭(8)，用以藉由一調節運動來調節加工系統(2)的一加工承座(12)，其中調節單元(3)藉由一樞轉軸承(13)可對一樞轉軸(14)樞轉，而調節頭(8)在一調節位置至少局部與加工系統(2)之加工承座(12)接觸及/或可與之接觸，一第一氣動致動設備(6)，其與調節單元(3)運動耦合，一壓力控制器裝置(10)，其與第一氣動致動設備(6)流體連接，其中壓力控制器裝置(10)進流及/或排流一加壓流體的質流量，用以控制調節單元(3)對第一氣動致動設備(6)的加工系統(2)的加工承座(12)的指向。此外本發明亦係關於一具有一系統(1)之加工系統(2)及一調節方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:系統</p>  
        <p type="p">3:調節單元</p>  
        <p type="p">4:致動構件</p>  
        <p type="p">5:致動器</p>  
        <p type="p">6:致動設備</p>  
        <p type="p">7:軸承座</p>  
        <p type="p">8:調節頭</p>  
        <p type="p">9:調節頭轉軸</p>  
        <p type="p">10:壓力控制器裝置</p>  
        <p type="p">11:流體管線</p>  
        <p type="p">13:樞轉軸承</p>  
        <p type="p">16:樞轉軸</p>  
        <p type="p">17:致動器殼體</p>  
        <p type="p">19:運動軸</p>  
        <p type="p">20:路徑感測器</p>  
        <p type="p">40:閥模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1377" publication-number="202613305"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613305.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613305</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121243</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>純化質體ＤＮＡ之方法</chinese-title>  
        <english-title>METHOD FOR PURIFYING PLASMID DNA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C12N15/10</main-classification>  
        <further-classification edition="200601120260102B">C12N15/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比蕭夫　安娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BISCHOF, ANNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛肯斯丹　羅伯托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FALKENSTEIN, ROBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科赫　莎賓娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOCH, SABRINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文報導一種生產重組質體 DNA 溶液之方法，該方法包含使包含重組質體 DNA 的粗製大腸桿菌裂解物穿過帶正電荷的包含二氧化矽、纖維素及聚合物樹脂的過濾器以獲得經過濾之重組質體 DNA 溶液的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Herein is reported a method for producing a recombinant plasmid DNA solution comprising the step of passing a crude E.coli lysate comprising recombinant plasmid DNA through a positively charged filter comprising silica, cellulose and a polymer resin to obtain a filtered recombinant plasmid DNA solution.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1378" publication-number="202612590"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612590.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612590</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121246</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含酵母蛋白之組成物</chinese-title>  
        <english-title>YEAST PROTEIN-CONTAINING COMPOSITIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260102B">A23C11/06</main-classification>  
        <further-classification edition="200601120260102B">A23L2/66</further-classification>  
        <further-classification edition="201601120260102B">A23L29/20</further-classification>  
        <further-classification edition="201601120260102B">A23L31/10</further-classification>  
        <further-classification edition="201601120260102B">A23L33/14</further-classification>  
        <further-classification edition="201601120260102B">A23L33/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商雀巢製品股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOCIETE DES PRODUITS NESTLE S.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞瑪吉連　路嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMAGLIANI, LUCA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪謝錫尼　喬里亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARCHESINI, GIULIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安吉里諾　尼可拉　切薩里歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANGELINO, NICOLA CESARIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃科　維洛妮卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VOLK, VERONIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>登布羅斯基　詹尼卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOMBROWSKI, JANNIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐蕾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於液體組成物、較佳地液體乳液，其包含脂肪組分、至少一種非蛋白質增稠劑、及酵母蛋白來源。酵母蛋白來源包含至少40wt.%酵母蛋白。液體組成物、較佳地液體乳液之總蛋白質含量係0.5至5wt.%。本發明亦係關於包含酵母蛋白的粉末組成物、曝氣組成物及產品。本發明亦係關於涉及該等液體組成物、粉末組成物、曝氣組成物及產品的用途及方法。本發明亦係關於用於製備液體組成物、粉末組成物及曝氣組成物之程序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to liquid compositions, preferably liquid emulsions which comprise a fat component, at least one non-proteic thickening agent and a yeast protein source. The yeast protein source comprises at least 40wt.% yeast proteins. The total protein content of the liquid compositions, preferably liquid emulsions is 0.5 to 5wt.%. It also relates to powder compositions, aerated compositions and products comprising yeast proteins. It also relates to use and method involving said liquid compositions, powder compositions, aerated compositions and products. It also relates to processes for preparing liquid compositions, powder compositions and aerated compositions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1379" publication-number="202612594"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612594.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612594</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121247</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含酵母蛋白之組成物</chinese-title>  
        <english-title>YEAST PROTEIN-CONTAINING COMPOSITIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A23L2/66</main-classification>  
        <further-classification edition="201601120260102B">A23L33/14</further-classification>  
        <further-classification edition="201601120260102B">A23L33/17</further-classification>  
        <further-classification edition="200601120260102B">A23G9/38</further-classification>  
        <further-classification edition="201601120260102B">A23L23/10</further-classification>  
        <further-classification edition="200601120260102B">A61K36/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商雀巢製品股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOCIETE DES PRODUITS NESTLE S.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞瑪吉連　路嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMAGLIANI, LUCA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪謝錫尼　喬里亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARCHESINI, GIULIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安吉里諾　尼可拉　切薩里歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANGELINO, NICOLA CESARIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐蕾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於液體組成物、較佳地液體乳液，其包含脂肪組分、至少一種非蛋白質增稠劑、及酵母蛋白來源。酵母蛋白來源包含至少40wt.%酵母蛋白。液體組成物、較佳地液體乳液之總蛋白質含量係至少5.01wt.%。本發明亦係關於包含酵母蛋白的粉末組成物及產品。本發明亦係關於用於製備所述粉末組成物及液體組成物之程序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to liquid compositions, preferably liquid emulsions which comprise a fat component, at least one non-proteic thickening agent and a yeast protein source. The yeast protein source comprises at least 40wt.% yeast proteins. The total protein content of the liquid compositions, preferably liquid emulsions is at least 5.01wt.%. It also relates to powder compositions and products comprising yeast proteins. It also relates to processes for preparing said powder compositions and liquid compositions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1380" publication-number="202613075"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613075.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613075</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121248</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吡啶醯胺Ｃａｖ３通道調節劑</chinese-title>  
        <english-title>PYRIDYL AMIDE CAV3 CHANNEL MODULATORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D213/65</main-classification>  
        <further-classification edition="200601120260102B">A61K31/4412</further-classification>  
        <further-classification edition="200601120260102B">A61P25/00</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商卡凡恩公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAVION, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布里漢　伊莉莎白　Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRIGHAM, ELIZABETH F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米列特　安托萬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILLET, ANTOINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆卡菲力　文卡塔　蘇巴　拉奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKKAVILLI,VENKATA SUBBA RAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供新穎化合物或其醫藥學上可接受之鹽，該等新穎化合物或其醫藥學上可接受之鹽為Ca&lt;sub&gt;v&lt;/sub&gt;3通道之調節劑且與異常Ca&lt;sub&gt;v&lt;/sub&gt;3通道功能或活性相關。本發明亦係關於包含此等化合物或其醫藥學上可接受之鹽之醫藥組合物。本發明進一步係關於藉由投與本文所揭示之化合物或其醫藥學上可接受之鹽及醫藥組合物來治療或預防與Ca&lt;sub&gt;v&lt;/sub&gt;3通道之異常功能或活性相關之病症、疾病及疾患之方法。本發明亦係關於本文所揭示之化合物或其醫藥學上可接受之鹽及醫藥組合物，該等化合物或其醫藥學上可接受之鹽及醫藥組合物用於治療或預防與Ca&lt;sub&gt;v&lt;/sub&gt;3通道之異常功能或活性相關之病症、疾病及疾患之方法中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides novel compounds, or pharmaceutically acceptable salts thereof, which are modulators of Ca&lt;sub&gt;v&lt;/sub&gt;3 channels, and are associated with abnormal Ca&lt;sub&gt;v&lt;/sub&gt;3 channel function or activity. The invention is also directed to pharmaceutical compositions comprising these compounds or pharmaceutically acceptable salts thereof. The invention further relates to methods of treating or preventing disorders, diseases and conditions associated with abnormal function or activity of Ca&lt;sub&gt;v&lt;/sub&gt;3 channels by administering the compounds, or pharmaceutically acceptable salts thereof, and pharmaceutical compositions disclosed herein. The invention also relates to compounds, or pharmaceutically acceptable salts thereof, and pharmaceutical compositions disclosed herein for use in methods of treating or preventing disorders, diseases and conditions associated with abnormal function or activity of Ca&lt;sub&gt;v&lt;/sub&gt;3 channels.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1381" publication-number="202614823"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614823.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614823</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121264</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251215B">H10D30/67</main-classification>  
        <further-classification edition="202501120251215B">H10D62/40</further-classification>  
        <further-classification edition="202501120251215B">H10D62/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎舜平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, SHUNPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>津吹將志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUBUKU, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋元健吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKIMOTO, KENGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大原宏樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHARA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本田達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONDA, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小俁貴嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMATA, TAKATSUGU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野中裕介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NONAKA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋正弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮永昭治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYANAGA, AKIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提出具有較穩定的導電性之氧化物半導體膜。此外，藉由使用該氧化物半導體膜來提供具有穩定電氣特性及高可靠性之半導體裝置。氧化物半導體膜包括結晶區域，且結晶區域包括其中a-b面與膜之一表面實質上平行且c軸與膜的該表面實質上垂直的晶體；氧化物半導體膜具有穩定導電性且相關於可見光、紫外線光、及之類的照射更電穩定。藉由使用這種氧化物半導體膜作為電晶體，可提供具有穩定電氣特性之高度可靠的半導體裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An oxide semiconductor film which has more stable electric conductivity is provided. Further, a semiconductor device which has stable electric characteristics and high reliability is provided by using the oxide semiconductor film. An oxide semiconductor film includes a crystalline region, and the crystalline region includes a crystal in which an a-b plane is substantially parallel with a surface of the film and a c-axis is substantially perpendicular to the surface of the film; the oxide semiconductor film has stable electric conductivity and is more electrically stable with respect to irradiation with visible light, ultraviolet light, and the like. By using such an oxide semiconductor film for a transistor, a highly reliable semiconductor device having stable electric characteristics can be provided.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1382" publication-number="202613586"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613586.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613586</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121266</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁性感測器組件和相關方法</chinese-title>  
        <english-title>MAGNETIC SENSOR ASSEMBLIES AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G01R33/00</main-classification>  
        <further-classification edition="200601120260102B">G01R33/02</further-classification>  
        <further-classification edition="200601120260102B">H01F7/00</further-classification>  
        <further-classification edition="200601120260102B">H01L21/677</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾伊曼　埃里希馬蒂亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEUMANN, ERICH MATTHIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥斯　托斯頓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEISS, THORSTEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">監測站內的載體的方法的實施例包括向位於站內的膜上方的第一軸向方向分佈的第一感測器陣列中的一或多個第一感測器的第一電磁鐵供應第一電流，並偵測由第一電磁鐵產生的第一磁場強度。此外，該方法還包括沿著第一軸向方向移動載體、降低第一電流，並向位於膜上方的第二軸向方向分佈的第二感測器陣列中的一或多個第二感測器的第二電磁鐵供應第二電流。進一步地，該方法包括偵測由第二電磁鐵產生的第二磁場強度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An embodiment of a method of monitoring a carrier within a station includes supplying a first current to a first electromagnet of one more first sensors of a first array of sensors disposed in a first axial direction above a membrane disposed within a station and detecting a first magnetic field strength generated by the first electromagnet. In addition, the method includes moving the carrier along the first axial direction, reducing the first current, and supplying a second current to a second electromagnet of one more second sensors of an second array of sensor disposed in a second axial direction above the membrane. Further, the method includes detecting a second magnetic field strength generated by the second electromagnet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">130:載體</p>  
        <p type="p">206:膜</p>  
        <p type="p">207:第一區域</p>  
        <p type="p">208:第二區域</p>  
        <p type="p">211:底面</p>  
        <p type="p">260:無特徵元件</p>  
        <p type="p">261:上表面</p>  
        <p type="p">271:間隙</p>  
        <p type="p">400:磁性感測器</p>  
        <p type="p">401:長軸</p>  
        <p type="p">410:基座/主體/PCB</p>  
        <p type="p">411:第一面</p>  
        <p type="p">412:第二面</p>  
        <p type="p">430:電磁鐵/類型</p>  
        <p type="p">431:線圈</p>  
        <p type="p">435:DC電源</p>  
        <p type="p">436:開關</p>  
        <p type="p">439:磁軸/類型</p>  
        <p type="p">440:磁場</p>  
        <p type="p">441a:可用場</p>  
        <p type="p">441b:可用場</p>  
        <p type="p">450a:感測元件</p>  
        <p type="p">450b:感測元件</p>  
        <p type="p">490:向量</p>  
        <p type="p">491:向量</p>  
        <p type="p">D1:距離</p>  
        <p type="p">F:雜散磁場</p>  
        <p type="p">G1:間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1383" publication-number="202614501"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614501.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614501</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121269</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>混合電連接器</chinese-title>  
        <english-title>HYBRID ELECTRICAL CONNECTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01R13/11</main-classification>  
        <further-classification edition="201101120251226B">H01R24/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＦＣＩ美國有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FCI USA LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅春祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, CHUN-XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江耀慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YAO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種連接器系統，具有板連接器和端接有線纜連接器的線纜組件。連接器中的任一個或兩個連接器可以具有殼體，該殼體具有配合面和設置在配合面上的第一構件。連接器包括暴露在配合面處的第一組電接觸件和第二組電接觸件。第一組電接觸件可以是電源接觸件，並且可以包括第一電接觸件和第二電接觸件。第二多個電接觸件可以設置在第一構件中，並且可以是信號電接觸件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A connector system with a board connector and a cable assembly terminated with a cable connector. Either or both of the connectors may have a housing with a mating face and a first member disposed on the mating face. The connector includes a first set of electrical contacts and second set of electrical contacts exposed at the mating face. The first set of electrical contacts may be power contacts and may include a first electrical contact and a second electrical contact. The second plurality of electrical contacts may be disposed in the first member and may be signal contacts.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電連接器系統</p>  
        <p type="p">200:電連接器</p>  
        <p type="p">300:電連接器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1384" publication-number="202613445"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613445.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613445</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121279</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>管聯軸器之墊片</chinese-title>  
        <english-title>GASKET FOR PIPE COUPLING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">F16L21/06</main-classification>  
        <further-classification edition="201601120251226B">F16J15/32</further-classification>  
        <further-classification edition="200601120251226B">F16D1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商韋克陶立公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VICTAULIC COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班奎夫特　菲利普　偉恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANCROFT, PHILIP WAYNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑曼　馬修　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOWMAN, MATTHEW A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於連結管道元件之聯軸器具有圍繞一中心空間端對端附接之鑄造段。該等段界定接納一墊片之一通道。該通道內之側表面具有成角度定向之擷取表面，該等擷取表面由該墊片上之球狀邊緣接合，以防止在將至少一管道元件插入該中心空間時該墊片自該通道中移出。側表面在該等擷取表面之間亦可具有支撐面。該墊片在一預裝配狀態下支撐該等段，其中該等段之間的間隔關係足以允許在該等段端對端附接時插入一或多個管道元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A coupling for joining pipe elements has cast segments attached end to end surrounding a central space. The segments define a channel that receives a gasket. Side surfaces within the channel have angularly oriented capture surfaces which are engaged by bulbous rims on the gasket which prevent the gasket from being dislodged from the channel when at least one pipe element is inserted into the central space. Side surfaces may also have support surfaces between the capture surfaces. The gasket supports the segments in a preassembled state wherein the segments are in spaced relation sufficient to permit insertion of one or more pipe elements while the segments are attached end to end.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:聯軸器</p>  
        <p type="p">14:第二段</p>  
        <p type="p">16:中心空間</p>  
        <p type="p">18:後壁</p>  
        <p type="p">46:第一弧形鍵</p>  
        <p type="p">48:第二弧形鍵</p>  
        <p type="p">72:腹板</p>  
        <p type="p">86:第二葉瓣</p>  
        <p type="p">88:第二密封面</p>  
        <p type="p">96:支腿</p>  
        <p type="p">100:管道元件</p>  
        <p type="p">102:管道元件</p>  
        <p type="p">104:周向槽</p>  
        <p type="p">106:周向槽</p>  
        <p type="p">108:腔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1385" publication-number="202613181"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613181.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613181</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121287</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗人ＣＤＨ１７抗體</chinese-title>  
        <english-title>ANTI-HUMAN CDH17 ANTIBODY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/30</main-classification>  
        <further-classification edition="200601120260102B">C12N15/13</further-classification>  
        <further-classification edition="200601120260102B">C12N15/63</further-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="201701120260102B">A61K47/68</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification>  
        <further-classification edition="200601120260102B">G01N33/574</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商映恩生物製藥（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUALITY BIOLOGICS (SUZHOU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉登念</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, DENGNIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬曉莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, XIAOLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李嘉賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIABIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭雨薇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENG, YUWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喻海旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, HAIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李婉麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WANLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種抗CDH17抗體。具體地，本發明提供了抗CDH17抗體、其人源化抗體及其製備和應用。本發明的抗CDH17抗體對CDH17蛋白具有優異的特異性及親和力、對表達CDH17的腫瘤細胞具有優異的親和力；對人、大鼠和猴CDH17蛋白具有種屬交叉結合活性，並且能夠介導CDH17內吞。本發明的抗CDH17抗體具備在抗腫瘤領域中應用的前景。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an anti-CDH17 antibody. Particularly, the present invention provides an anti-CDH17 antibody, a humanized antibody thereof, and a preparation and a use thereof. The anti-CDH17 antibody of the present invention has excellent specificity and affinity for CDH17 protein and excellent affinity for tumor cells expressing CDH17; has species cross-binding activity towards human, rat, and monkey CDH17 proteins, and is able to mediate internalization of CDH17. The anti-CDH17 antibody of the present invention has a promising application in the anti-tumor field.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1386" publication-number="202613373"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613373.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613373</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121290</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>纖維、布料及貼身衣物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">D01F1/10</main-classification>  
        <further-classification edition="200601120251231B">C08L67/00</further-classification>  
        <further-classification edition="201801120251231B">C08K3/013</further-classification>  
        <further-classification edition="200601120251231B">C08K3/22</further-classification>  
        <further-classification edition="200601120251231B">C08K3/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＭＴＧ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MTG CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松下剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHITA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武藤貴雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUTO, TAKAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡田歩美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKADA, AYUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石津亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIZU, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏木克仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASHIWAGI, KATSUHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">使用於衣服之纖維。纖維具有熱塑性樹脂，與分散於熱塑性樹脂中之陶瓷粉末。陶瓷粉末中包含選自由氧化鈦、碳化鈦及硼化鈦所成群之1種或2種以上之第1陶瓷成分，與選自由氧化鋯、碳化鋯及硼化鋯所成群之1種或2種以上之第2陶瓷成分。陶瓷粉末中之第1陶瓷成分之質量比率為40質量%以上80質量%以下，第2陶瓷成分之質量比率為10質量%以上60質量%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1387" publication-number="202614527"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614527.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614527</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121292</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電力轉換裝置及電力供給系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">H02J3/34</main-classification>  
        <further-classification edition="200601120250701B">H02J3/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立產機系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI INDUSTRIAL EQUIPMENT SYSTEMS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田直充</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, NAOMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉正将</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松永俊祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUNAGA, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武田賢治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEDA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於抑制輸入至系統互連用之電力轉換裝置之直流電力增加及伴隨於此之直流電壓上升。&lt;br/&gt;電力轉換裝置30係與連接有直流電源21之直流匯流排20、及經由PCS42而連接有直流電源41之交流電網40連接，將直流匯流排20之直流電力與交流電網40之交流電力相互轉換者，且基於直流匯流排20之電壓控制PCS42之動作。電力轉換裝置30中，交流電壓指令修正部當測定直流匯流排20之電壓而獲得之直流電壓測定值Vdc滿足規定之條件時，以於PCS42中發揮電壓上升抑制功能之方式修正交流電壓指令值V0。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電力供給系統</p>  
        <p type="p">2:電力系統</p>  
        <p type="p">10:系統互連用電力轉換裝置</p>  
        <p type="p">20:直流匯流排</p>  
        <p type="p">21:直流電源</p>  
        <p type="p">22:蓄電池</p>  
        <p type="p">23:轉換器</p>  
        <p type="p">24:轉換器</p>  
        <p type="p">25:直流負載</p>  
        <p type="p">30:電力轉換裝置</p>  
        <p type="p">40:交流電網</p>  
        <p type="p">41:直流電源</p>  
        <p type="p">42:功率調節器(PCS)</p>  
        <p type="p">43:交流負載</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1388" publication-number="202613092"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613092.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613092</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121302</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>GSPT1降解劑抗體偶聯物</chinese-title>  
        <english-title>GSPT1 DEGRADER-ANTIBODY CONJUGATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D401/04</main-classification>  
        <further-classification edition="200601120260102B">C07D471/04</further-classification>  
        <further-classification edition="200601120260102B">C07D401/14</further-classification>  
        <further-classification edition="200601120260102B">C07D403/04</further-classification>  
        <further-classification edition="200601120260102B">C07K16/28</further-classification>  
        <further-classification edition="201701120260102B">A61K47/68</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海齊魯製藥研究中心有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI QILU PHARMACEUTICAL RESEARCH AND DEVELOPMENT CENTRE LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王軍飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JUNFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閉瀟揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BI, XIAOYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程滄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃文淑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WENSHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王新美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XINMEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃穎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫　大慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, DAQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陶　維康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAO, WEIKANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種GSPT1降解劑抗體偶聯物，具體提供了式(I)所示化合物、其立體異構體或其藥學上可接受的鹽、含其的藥物組合物以及利用本發明化合物治療細胞增殖性疾病，例如癌症的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses GSPT1 degrader-antibody conjugates, specifically providing compounds represented by formula (I), stereoisomers thereof or pharmaceutically acceptable salts thereof, pharmaceutical compositions containing the same, and methods for treating cell proliferative diseases, such as cancers, using the compounds of the present invention.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1389" publication-number="202613440"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613440.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613440</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121304</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>閥</chinese-title>  
        <english-title>VALVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">F16K1/22</main-classification>  
        <further-classification edition="200601120251224B">F16K1/48</further-classification>  
        <further-classification edition="200601120251224B">F16K49/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商ＶＡＴ控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAT HOLDING AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈特澤　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NETZER, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>提斯豪瑟　托比亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TISCHHAUSER, TOBIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種閥（1），具有用於至少部分地封閉閥口（3）的閥盤（2）及在縱向（4）上縱向延伸之閥桿（5），其中該閥盤（2）緊固在該閥桿（5）上，並且該閥桿（5）將該閥盤（2）與該閥（1）之閥驅動器（6）連接在一起，以便調節該閥盤（2），其中在該閥桿（5）中至少局部地構建有空腔（7）並且在該空腔（7）中至少局部地佈置有連接銷（8），並且該閥桿（5）藉由該連接銷（8）與該閥驅動器（6）之驅動軸（9）抗扭連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:閥</p>  
        <p type="p">2:閥盤</p>  
        <p type="p">3:閥口</p>  
        <p type="p">4:縱向</p>  
        <p type="p">5:閥桿</p>  
        <p type="p">7:空腔</p>  
        <p type="p">8:連接銷</p>  
        <p type="p">9:驅動軸</p>  
        <p type="p">10:連接區段</p>  
        <p type="p">11:頭部</p>  
        <p type="p">12:螺紋</p>  
        <p type="p">13:凸緣</p>  
        <p type="p">14:加熱元件</p>  
        <p type="p">15:加熱元件緊固件</p>  
        <p type="p">16:閥殼</p>  
        <p type="p">17:末端</p>  
        <p type="p">18:軸線</p>  
        <p type="p">20:散熱片</p>  
        <p type="p">21:外輪廓</p>  
        <p type="p">22:樞軸承</p>  
        <p type="p">23:螺釘</p>  
        <p type="p">24:螺釘</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1390" publication-number="202613101"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613101.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613101</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121324</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種環烯類衍生物的製備方法</chinese-title>  
        <english-title>A METHOD FOR PREPARING CYCLOHEXENE DERIVATIVES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D405/04</main-classification>  
        <further-classification edition="200601120260102B">C07D211/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊雨晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YUQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐喬亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, QIAOLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周元沖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YUANCHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡錦陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, JINYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種環烯類衍生物的製備方法。本發明方法克服了現有技術中存在的問題，大大縮減了成本，改善了工藝的可操作性和收率，工藝安全性高。因此，適合工業化應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a method for preparing cyclohexene derivatives. The method of the present invention overcomes the problems existing in the prior art, greatly reduces costs, improves the operability and yield of the process, and has high process safety. Therefore, it is suitable for industrial applications.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1391" publication-number="202612732"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612732.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612732</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121344</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗ＩＬ－１１Ｒα抗體在治療特發性肺纖維化中之給藥</chinese-title>  
        <english-title>DOSING OF ANTI-IL-11Rα ANTIBODIES IN THE TREATMENT OF IDIOPATHIC PULMONARY FIBROSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K39/395</main-classification>  
        <further-classification edition="200601120260102B">C07K16/28</further-classification>  
        <further-classification edition="200601120260102B">A61P11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商拉森醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LASSEN THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯旺尼　詹姆斯　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SWANEY, JAMES STEPHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法迪斯　瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FARDIS, MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　大衛　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING, DAVID J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>君　海倫　托尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUN, HELEN TONI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供治療特發性肺纖維化(idiopathic pulmonary fibrosis；IPF)之方法，該等方法包含投與結合至人類介白素-11受體次單元α (IL-11Rα)之抗體及相關組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are methods of treating idiopathic pulmonary fibrosis (IPF) comprising administering an antibody that binds to human interleukin-11 receptor subunit α (IL-11Rα) and related compositions.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1392" publication-number="202612733"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612733.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612733</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121346</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗ＩＬ－１１Ｒα抗體在治療甲狀腺眼病中之給藥</chinese-title>  
        <english-title>DOSING OF ANTI-IL-11Rα ANTIBODIES IN THE TREATMENT OF THYROID EYE DISEASE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K39/395</main-classification>  
        <further-classification edition="200601120260102B">C07K16/28</further-classification>  
        <further-classification edition="200601120260102B">A61P27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商拉森醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LASSEN THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯旺尼　詹姆斯　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SWANEY, JAMES STEPHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法迪斯　瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FARDIS, MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　大衛　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING, DAVID J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>君　海倫　托尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUN, HELEN TONI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供治療甲狀腺眼病(TED)之方法，其包含投與結合至人類介白素-11受體次單元α (IL-11Rα)之抗體及相關組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are methods of treating thyroid eye disease (TED) comprising administering an antibody that binds to human interleukin-11 receptor subunit α (IL-11Rα) and related compositions.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1393" publication-number="202613550"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613550.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613550</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121355</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於監測多步生物製劑生產製程中之多肽類型濃度之裝置及方法</chinese-title>  
        <english-title>APPARATUS AND METHODS FOR MONITORING A POLYPEPTIDE TYPE CONCENTRATION IN A MULTI-STEP BIOLOGIC PRODUCTION PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G01N33/68</main-classification>  
        <further-classification edition="200601120260102B">G01N33/543</further-classification>  
        <further-classification edition="200601120260102B">G01N21/64</further-classification>  
        <further-classification edition="200601120260102B">C07K16/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商武田藥品工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEDA PHARMACEUTICAL COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰須納　沃夫岡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TESCHNER, WOLFGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪德蓮娜　魯斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MADLENER, RUTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>督　派瑞茲　伊亞科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOEL-PEREZ, IAGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩勞洛　馬提歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SARAULLO, MATTEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史特羅馬　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STROHMER, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於監測多肽類型濃度之方法包括自暴露於生物樣品的第一基於基材之感測器之第一量測中獲得第一信號。該第一信號包括第一組複數種多肽類型中之每一者對每次第一量測之共振貢獻，其係基於該樣品中之多肽類型濃度及第一基材對該多肽類型之結合親和力。自暴露於該樣品的第二基於基材之感測器之第二量測中獲得第二信號。該第二信號包括第二組複數種多肽類型中之每一者對每次第二量測之共振貢獻，其係基於該樣品中之多肽類型濃度及第二基材對該多肽類型之結合親和力。該第一基材及該第二基材對生物樣品中之第一多肽類型之結合親和力不同。使用該第一信號及該第二信號來確定該第一多肽類型濃度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods for monitoring a polypeptide type concentration comprise obtaining a first signal from first measurements from a first substrate-based sensor exposed to a biologic sample. The first signal includes a resonance contribution for each first measurement, for each of a first plurality of polypeptide types, based on polypeptide type concentration in the sample and first substrate binding affinity for the polypeptide type. A second signal is obtained from second measurements from a second substrate-based sensor exposed to the sample. The second signal includes a resonance contribution for each second measurement, for each of a second plurality of polypeptide types, based on polypeptide type concentration in the sample and second substrate binding affinity for the polypeptide type. The first and second substrate binding affinity for a first polypeptide type in biologic sample differ. The first polypeptide type concentration is determined using the first and second signals.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:匯流排</p>  
        <p type="p">58:記憶體</p>  
        <p type="p">60:記憶體</p>  
        <p type="p">62:控制器</p>  
        <p type="p">64:中央處理單元</p>  
        <p type="p">66:電源供應器</p>  
        <p type="p">68:使用者介面</p>  
        <p type="p">70:顯示器</p>  
        <p type="p">72:鍵盤</p>  
        <p type="p">74:圖形處理單元</p>  
        <p type="p">76:網路介面</p>  
        <p type="p">100:電腦系統</p>  
        <p type="p">101:控制模組</p>  
        <p type="p">102:樣品開始時間</p>  
        <p type="p">104:樣品注入時間</p>  
        <p type="p">106:樣品結束時間</p>  
        <p type="p">108:樣品量測窗</p>  
        <p type="p">110:樣品參數</p>  
        <p type="p">112:第一信號資料</p>  
        <p type="p">114:基於基材之感測器一之參數</p>  
        <p type="p">116:感測器一之結合親和力</p>  
        <p type="p">118:感測器一信號時間序列資料</p>  
        <p type="p">120:時間解析量測</p>  
        <p type="p">122:感測器一樣品事件</p>  
        <p type="p">124:事件後之感測器1中值信號</p>  
        <p type="p">126:感測器1基線信號</p>  
        <p type="p">128:感測器1基線校正之事件信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1394" publication-number="202612663"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612663.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612663</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121367</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透過繫帶翼提供具備自鎖功能之矯正裝置的方法與裝置</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR PROVIDING ORTHODONTIC APPLIANCE HAVING SELF-LIGATING FEATURES VIA TIE WINGS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">A61C7/28</main-classification>  
        <further-classification edition="200601120251229B">A61C7/30</further-classification>  
        <further-classification edition="200601120251229B">A61C7/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商數珍科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PEARL DIGITAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹　恆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, HENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱永紳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, YUNG SHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林桓毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了一種具有自鎖功能的齒顎矯正托槽。基座托槽包括複數&lt;br/&gt; 繫帶翼，其設置在近端側和遠端側的以及設置在其間的弓絲槽。鎖定件可拆卸地連接至繫帶翼，並能夠選擇性地將弓線固定在弓線槽中。繫帶翼同時兼具繫帶支撐與結構導引雙重功能，也可作為繫帶機構提供支撐與定位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An orthodontic bracket having self-ligating features is disclosed. The base bracket includes a plurality of tie wings disposed on the mesial and distal sides and an archwire slot positioned therebetween. A ligating element is detachably coupled to the tie wings to selectively retain an archwire within the archwire slot. The tie wings serve both as ligature supports and structural guides for the ligating mechanism.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:自鎖托槽</p>  
        <p type="p">10:基底托槽</p>  
        <p type="p">20:鎖定件</p>  
        <p type="p">30:弓絲</p>  
        <p type="p">40:近端側</p>  
        <p type="p">41:遠端側</p>  
        <p type="p">42:牙齦側</p>  
        <p type="p">43:咬合側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1395" publication-number="202613107"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613107.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613107</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121369</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物及其用途</chinese-title>  
        <english-title>COMPOUNDS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D413/14</main-classification>  
        <further-classification edition="200601120260102B">C07D401/14</further-classification>  
        <further-classification edition="200601120260102B">C07D403/04</further-classification>  
        <further-classification edition="200601120260102B">C07D401/04</further-classification>  
        <further-classification edition="200601120260102B">C07D403/14</further-classification>  
        <further-classification edition="200601120260102B">C07D231/56</further-classification>  
        <further-classification edition="200601120260102B">C07D403/06</further-classification>  
        <further-classification edition="200601120260102B">C07D401/06</further-classification>  
        <further-classification edition="200601120260102B">C07D417/04</further-classification>  
        <further-classification edition="200601120260102B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4545</further-classification>  
        <further-classification edition="200601120260102B">A61K31/496</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4178</further-classification>  
        <further-classification edition="200601120260102B">A61K31/416</further-classification>  
        <further-classification edition="200601120260102B">A61K31/506</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4439</further-classification>  
        <further-classification edition="200601120260102B">A61K31/497</further-classification>  
        <further-classification edition="200601120260102B">A61K31/433</further-classification>  
        <further-classification edition="200601120260102B">A61P29/00</further-classification>  
        <further-classification edition="200601120260102B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商皮沙米亞德醫療有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PSAMMIAD THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴瑞特　大衛　吉尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARRETT, DAVID GENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李安定</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ANDING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林盛佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHENGJIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏中華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, ZHONGHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於可用於調節糖皮質激素受體(GR)及用於治療疾病及病症(&lt;i&gt;例如&lt;/i&gt;，自體免疫疾病及發炎性疾病)之化合物、組合物及方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to compounds, compositions, and methods useful for modulating a glucocorticoid receptor (GR) and for treating diseases and disorders (&lt;i&gt;e.g.&lt;/i&gt;, autoimmune diseases and inflammatory diseases).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1396" publication-number="202613146"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613146.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613146</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121393</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生長抑素亞型-2受體(SST2R)非肽藥物偶聯物及其用途</chinese-title>  
        <english-title>SOMATOSTATIN SUBTYPE-2 RECEPTOR (SST2R) NON-PEPTIDE DRUG CONJUGATES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K5/02</main-classification>  
        <further-classification edition="200601120260102B">C07D401/14</further-classification>  
        <further-classification edition="201701120260102B">A61K47/54</further-classification>  
        <further-classification edition="201701120260102B">A61K47/65</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商克林提克斯醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRINETICS PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙　建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　米</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱　運飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, YUNFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史戚克雷恩茲　傑佛瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHKERYANTZ, JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文說明瞭靶向表現SST2R的腫瘤細胞的生長抑素亞型-2受體(SST2R)非肽藥物偶聯物(NDC)及其在癌症的治療和/或診斷中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1397" publication-number="202613982"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613982.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613982</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121394</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感應式電動鎖裝置</chinese-title>  
        <english-title>INDUCTION POWERED LOCK DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251230B">G07C9/00</main-classification>  
        <further-classification edition="200601120251230B">E05B47/06</further-classification>  
        <further-classification edition="200601120251230B">E05B47/00</further-classification>  
        <further-classification edition="200601120251230B">E05B67/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商買試得鎖有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASTER LOCK COMPANY LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧斯特拉姆　克里斯多福　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSTRAM, CHRISTOPHER T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍利斯　羅伯　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOLLIS, ROBERT R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳弈錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種鎖系統包含一鎖。該鎖包含一鎖定機構、一感應線圈及一致動器。該鎖定機構可選擇性地在一第一位置與一第二位置之間移動。該感應線圈經組態以與一可攜式裝置感應耦合以產生電力。該致動器經組態以回應於接收到由該感應線圈產生之該電力而在一鎖定組態與一解鎖組態之間致動以選擇性地使該鎖定機構在一鎖定狀態與一解鎖狀態之間轉變。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A lock system includes a lock. The lock includes a locking mechanism, an induction coil, and an actuator. The locking mechanism is selectively movable between a first position and a second position. The induction coil is configured to inductively couple with a portable device to generate power. The actuator is configured to actuate between a locked configuration and an unlocked configuration to selectively transition the locking mechanism between a locked state and an unlocked state in response to receiving the power generated with the induction coil.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:鎖</p>  
        <p type="p">20:外殼</p>  
        <p type="p">22:第一殼體</p>  
        <p type="p">24:第二殼體</p>  
        <p type="p">26:內部腔室</p>  
        <p type="p">27:後壁</p>  
        <p type="p">28:陽介面</p>  
        <p type="p">29:周邊壁</p>  
        <p type="p">30:陰介面</p>  
        <p type="p">31:切口</p>  
        <p type="p">32:開口</p>  
        <p type="p">34:肋</p>  
        <p type="p">40:鎖定機構</p>  
        <p type="p">42:鎖扣</p>  
        <p type="p">44:軸承</p>  
        <p type="p">45:趾部</p>  
        <p type="p">46:跟部</p>  
        <p type="p">48:彎曲部</p>  
        <p type="p">50:凹口</p>  
        <p type="p">52:肩部</p>  
        <p type="p">54:溝槽</p>  
        <p type="p">60:致動器</p>  
        <p type="p">62:馬達</p>  
        <p type="p">64:致動器頭</p>  
        <p type="p">66:齒輪總成</p>  
        <p type="p">68:軸</p>  
        <p type="p">70:支撐板</p>  
        <p type="p">72:引線</p>  
        <p type="p">74:凹穴</p>  
        <p type="p">80:感應總成</p>  
        <p type="p">82:印刷電路板總成(PCB-A)</p>  
        <p type="p">84:感應線圈</p>  
        <p type="p">86:孔隙</p>  
        <p type="p">90:內部支撐件</p>  
        <p type="p">92:板</p>  
        <p type="p">94:肋</p>  
        <p type="p">96:肋支撐件</p>  
        <p type="p">98:橫向支撐件</p>  
        <p type="p">100:突出部</p>  
        <p type="p">102:凹穴</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1398" publication-number="202614165"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614165.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614165</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121405</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於極紫外光圖案化層之組合處理</chinese-title>  
        <english-title>COMBINATORIAL TREATMENTS FOR EUV PATTERNED LAYERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/027</main-classification>  
        <further-classification edition="200601120251226B">H01L21/02</further-classification>  
        <further-classification edition="200601120251226B">H01L21/3105</further-classification>  
        <further-classification edition="200601120251226B">G03F7/11</further-classification>  
        <further-classification edition="200601120251226B">H01L21/311</further-classification>  
        <further-classification edition="200601120251226B">G03F7/004</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃特基　魯迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOJTECKI, RUDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄志宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZHIYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩尚　馬杜爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SACHAN, MADHUR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴蒂亞　斯瓦斯蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHATIA, SWASTI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃庫　貝可利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WORKU, BEKELE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豪塔拉　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAUTALA, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛瑪　雪恩克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARMA, SHASHANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NG, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔茲梅克里　尼拉莫漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THAZHE MECHRI, NILA MOHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文所描述的實施例係關於一種用於微影術圖案化的方法，包含在基板上方沉積圖案化堆疊，其中該圖案化堆疊包含回應層和阻劑層，以及在阻劑層中形成圖案。在實施例中，該方法進一步包含將圖案轉移至回應層中，其中該回應層具有第一線寬度粗糙度（LWR），以及處理該回應層，其中該經處理的回應層具有小於第一LWR的第二LWR。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">‎Embodiments described herein relate to a method for lithographic patterning, ‎that includes depositing a patterning stack over a substrate, where the patterning stack ‎includes a responsive layer and a resist layer, and forming a pattern in the resist layer. In ‎an embodiment, the method further includes transferring the pattern into the responsive ‎layer, where the responsive layer has a first line width roughness (LWR), and treating the ‎responsive layer, where the treated responsive layer has a second LWR that is smaller ‎than the first LWR.‎</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">760:製程</p>  
        <p type="p">761:操作</p>  
        <p type="p">762:操作</p>  
        <p type="p">763:操作</p>  
        <p type="p">764:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1399" publication-number="202612951"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612951.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612951</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121410</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送車</chinese-title>  
        <english-title>TRANSPORT VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B61B13/00</main-classification>  
        <further-classification edition="200601120251229B">B62D61/10</further-classification>  
        <further-classification edition="200601120251229B">B62D7/20</further-classification>  
        <further-classification edition="200601120251229B">B60B33/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村和誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, KAZUNARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">搬送車10具備：驅動用馬達，驅動驅動輪12；及蓄電體16，儲備供給至驅動用馬達之電力，第1框架部21與第2框架部22是繞著第1擺動軸心B1擺動自如地連結，驅動輪12被第1框架部21或第2框架部22所支撐，一對第1從動輪14a是在寬度方向Y上互相分開配置，蓄電體16配置於在寬度方向Y上的一對第1從動輪14a之間且在沿著寬度方向Y的寬度方向視角下與一對第1從動輪14a重疊的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:搬送車</p>  
        <p type="p">12:驅動輪</p>  
        <p type="p">14a:第1從動輪(從動輪)</p>  
        <p type="p">14b:第2從動輪(從動輪)</p>  
        <p type="p">15:驅動用馬達</p>  
        <p type="p">16:蓄電體</p>  
        <p type="p">17:讀取裝置</p>  
        <p type="p">20:車體框架(框架)</p>  
        <p type="p">21:第1框架部</p>  
        <p type="p">21a:第1凹部</p>  
        <p type="p">22:第2框架部</p>  
        <p type="p">22a:第2凹部</p>  
        <p type="p">31:罩蓋</p>  
        <p type="p">41:第1連結部</p>  
        <p type="p">42:第2連結部</p>  
        <p type="p">43:第3連結部</p>  
        <p type="p">A1:驅動軸心</p>  
        <p type="p">B1:第1擺動軸心</p>  
        <p type="p">X:前後方向</p>  
        <p type="p">X1:後側</p>  
        <p type="p">X2:前側</p>  
        <p type="p">Y:寬度方向</p>  
        <p type="p">Z1:上側</p>  
        <p type="p">Z2:下側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1400" publication-number="202612952"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612952.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612952</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121432</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送車</chinese-title>  
        <english-title>TRANSPORT VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B61B13/00</main-classification>  
        <further-classification edition="200601120251229B">B62D61/10</further-classification>  
        <further-classification edition="200601120251229B">B62D7/20</further-classification>  
        <further-classification edition="200601120251229B">B60B33/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村和誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, KAZUNARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">搬送車10具備框架20、第1保險桿部51及第2保險桿部52，框架20具備第1連結部41、第1框架部21及第2框架部22，前述第1連結部41將第1框架部21與第2框架部22繞著沿寬度方向Y的第1擺動軸心B1擺動自如地連結，第1保險桿部51是被前述第1框架部21所支撐，第2保險桿部52是被第2框架部22所支撐，在第1保險桿部51與第2保險桿部52的前後方向X之間設置有空隙(第1空隙M1、第2空隙M2)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:搬送車</p>  
        <p type="p">12:驅動輪</p>  
        <p type="p">14a:第1從動輪</p>  
        <p type="p">14b:第2從動輪</p>  
        <p type="p">15:驅動源</p>  
        <p type="p">16:蓄電體</p>  
        <p type="p">17:讀取裝置</p>  
        <p type="p">20:車體框架(框架)</p>  
        <p type="p">21:第1框架部</p>  
        <p type="p">21a:第1凹部</p>  
        <p type="p">22:第2框架部</p>  
        <p type="p">22a:第2凹部</p>  
        <p type="p">41:第1連結部</p>  
        <p type="p">42:第2連結部</p>  
        <p type="p">43:第3連結部</p>  
        <p type="p">50:保險桿</p>  
        <p type="p">51:第1保險桿部</p>  
        <p type="p">52:第2保險桿部</p>  
        <p type="p">53:第1保險桿安裝構件</p>  
        <p type="p">54:第2保險桿安裝構件</p>  
        <p type="p">A1:驅動軸心</p>  
        <p type="p">B1:第1擺動軸心</p>  
        <p type="p">M1:第1空隙</p>  
        <p type="p">M2:第2空隙</p>  
        <p type="p">X:前後方向</p>  
        <p type="p">X1:後側</p>  
        <p type="p">X2:前側</p>  
        <p type="p">Y:寬度方向</p>  
        <p type="p">Z1:上側</p>  
        <p type="p">Z2:下側</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1401" publication-number="202612726"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612726.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
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        <document-id> 
          <doc-number>202612726</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121435</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>誘發針對困難梭狀芽孢桿菌的免疫反應之免疫原性組成物和方法</chinese-title>  
        <english-title>IMMUNOGENIC COMPOSITIONS AND METHODS FOR ELICITING AN IMMUNE RESPONSE AGAINST CLOSTRIDIOIDES (CLOSTRIDIUM) DIFFICILE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K39/08</main-classification>  
        <further-classification edition="200601120260102B">A61K39/39</further-classification>  
        <further-classification edition="200601120260102B">A61P31/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商輝瑞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFIZER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德森　安娜麗沙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDERSON, ANNALIESA SYBIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古特曼　艾爾詹德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GURTMAN, ALEJANDRA CLARISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭伯士　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAMBERTH, ERIK FRED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛克哈特　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOCKHART, STEPHEN PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於包含困難梭狀芽孢桿菌類毒素A及/或困難梭狀芽孢桿菌類毒素B及佐劑之免疫原性組成物及使用彼之方法。本發明進一步關於用於誘發人類針對困難梭狀芽孢桿菌感染的增強免疫反應之方法。該方法包括向該人類投予有效劑量的免疫原性組成物，其包括困難梭狀芽孢桿菌類毒素及佐劑，其中該組成物係經投予二次或三次。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to immunogenic compositions that comprise a &lt;i&gt;Clostridioides difficile&lt;/i&gt; toxoid A and/or a &lt;i&gt;C. difficile&lt;/i&gt; toxoid B, and an adjuvant, and methods of use thereof. The present invention further relates to methods for eliciting an enhanced immune response in a human against a &lt;i&gt;C. difficile&lt;/i&gt; infection. The methods include administering to the human an effective dose of an immunogenic composition, which includes a &lt;i&gt;C. difficile&lt;/i&gt; toxoid and an adjuvant, wherein the composition is administered two or three times.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1402" publication-number="202613182"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613182.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613182</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121466</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗ＣＥＡＣＡＭ５抗體、抗體-藥物共軛體及彼等之使用方法</chinese-title>  
        <english-title>ANTI-CEACAM5 ANTIBODIES, ANTIBODY-DRUG CONJUGATES AND METHODS OF USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/30</main-classification>  
        <further-classification edition="200601120260102B">C07K5/02</further-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="201701120260102B">A61K47/68</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商思進公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEAGEN INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比契爾　崔維斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIECHELE, TRAVIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布拉休斯　阿曼達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLASIUS, AMANDA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米契爾　傑米</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITCHELL, JAMIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納斯特羅法　亞畢那</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NESTEROVA, ALBINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛姆　羅里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROHM, RORY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">&lt;b&gt;　　&lt;/b&gt;本發明關於與CEACAM5結合之抗體及其抗體-藥物共軛體。本發明亦關於與CEACAM5特異性結合之抗體及其抗體-藥物共軛體的組成物及使用方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to antibodies that bind to CEACAM5 and antibody-drug conjugates thereof. The present invention also relates to compositions and methods and uses of antibodies that specifically bind to CEACAM5 and antibody-drug conjugates thereof.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1403" publication-number="202613009"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613009.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613009</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121472</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在容器中儲存並取回貨物的倉儲系統</chinese-title>  
        <english-title>WAREHOUSING SYSTEM FOR STORING AND RETRIEVING GOODS IN CONTAINERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">B65G47/90</main-classification>  
        <further-classification edition="200601120251226B">B66F9/06</further-classification>  
        <further-classification edition="200601120251226B">B66F9/19</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商辛波提克有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYMBOTIC LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱波　泰德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEPPLE, TODD E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁格曼　佐伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DINGEMAN, ZOE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克勞　基思</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CROWE, KEITH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴爾蘇科夫　科斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARSUKOV, KOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝裡根　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERRIGAN, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自主後勤車輛機器人包括：車輛框架；驅動區段；以及酬載床，設置在車輛框架上且配置成在其上穩定地固持貨物酬載單元，酬載床可移動地連接於車輛框架，使得酬載床在延伸和撤回位置之間移動。酬載床具有將離散酬載固持區段編索引的索引，並且將每一被編索引的離散酬載固持區段映射至共同運送箱內的對應不同放置處。每一個別離散酬載固持區段建構成其中含有至少一貨物酬載單元，並且酬載床具有放置實施器，配置成使得酬載床在延伸位置時，放置實施器從每一被編索引的個別離散酬載固持區段來位移貨物酬載單元，並且將貨物酬載單元放置於索引所映射的對應放置處。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An autonomous logistics vehicle bot includes: a vehicle frame; a drive section; and a payload bed disposed on the vehicle frame and arranged to stably hold goods payload units thereon, the payload bed being movably connected to the vehicle frame so that the payload bed moves between extended and retracted positions. The payload bed has an index that indexes discrete payload holding sections, and maps each indexed discrete payload holding section to corresponding different place locations within a common tote. Each respective discrete payload holding section is configured to contain therein at least one goods payload unit, and the payload bed has a placement effector arranged so that with the payload bed in the extended position, the placement effector displaces the goods payload unit, from each indexed respective discrete payload holding section, and places the goods payload unit in the corresponding place location mapped by the index.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">222:索引、視覺指示器</p>  
        <p type="p">222A~222D:索引標記、視覺指示器</p>  
        <p type="p">222F:旗標</p>  
        <p type="p">222L:光源</p>  
        <p type="p">222S:感測器</p>  
        <p type="p">262:貨物機器人、自主後勤車輛機器人</p>  
        <p type="p">262C:控制器</p>  
        <p type="p">262E:末端實施器</p>  
        <p type="p">262EF:末端實施器框架</p>  
        <p type="p">262F:車輛框架</p>  
        <p type="p">262F1,262F2:縱向端</p>  
        <p type="p">262PS:開放側</p>  
        <p type="p">277:把手</p>  
        <p type="p">288:充電埠</p>  
        <p type="p">289:電源</p>  
        <p type="p">300:驅動系統或區段</p>  
        <p type="p">300C:輸送器驅動器</p>  
        <p type="p">300D:驅動輪驅動器</p>  
        <p type="p">300E:末端實施器驅動器</p>  
        <p type="p">301A:驅動輪</p>  
        <p type="p">302:腳輪</p>  
        <p type="p">310:酬載床或艙</p>  
        <p type="p">310W1~310W3:側壁</p>  
        <p type="p">320:支撐表面</p>  
        <p type="p">320B:無盡/連續皮帶輸送器</p>  
        <p type="p">320BS:無盡/連續皮帶或輸送器表面</p>  
        <p type="p">320CB:無盡或連續皮帶</p>  
        <p type="p">320EF:放置實施器</p>  
        <p type="p">320RS:滾動支撐表面</p>  
        <p type="p">377H:突起</p>  
        <p type="p">399:延伸/撤回方向</p>  
        <p type="p">CA,CB:縱向輸送器區段</p>  
        <p type="p">ESTP:緊急停止按鈕</p>  
        <p type="p">LAX:縱軸</p>  
        <p type="p">PS1:航行感測器</p>  
        <p type="p">PS2:酬載感測器</p>  
        <p type="p">PWR:電力開關</p>  
        <p type="p">QPA1,QPA2:離散酬載固持區段</p>  
        <p type="p">QPB1,QPB2:離散酬載固持區段</p>  
        <p type="p">SST:支柱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1404" publication-number="202613174"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613174.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613174</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121476</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>MUC-1條件性CD40促效劑</chinese-title>  
        <english-title>MUC-1 CONDITIONAL CD40 AGONISTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/28</main-classification>  
        <further-classification edition="200601120260102B">C07K16/30</further-classification>  
        <further-classification edition="200601120260102B">C07K16/46</further-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬克專利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙　維肖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHA, WEIXIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>剛瑟　羅夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUENTHER, RALF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供結合MUC-1及CD40之雙特異性結合蛋白及醫藥組合物、及其用於上調細胞介導之免疫反應及用於治療癌症之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides bispecific binding proteins binding MUC-1 and CD40 and pharmaceutical compositions, and their use to upregulate cell-mediated immune responses and for the treatment of cancer.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1405" publication-number="202613508"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613508.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613508</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121495</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在粒子束誘導處理設備的工作區的製程氣體壓力測量裝置</chinese-title>  
        <english-title>GAS PRESSURE MEASURING DEVICE FOR MEASURING A PRESSURE OF A PROCESS GAS AT A WORKING SITE OF AN APPARATUS FOR PARTICLE BEAM-INDUCED PROCESSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">G01L7/08</main-classification>  
        <further-classification edition="200601120251226B">G01L9/12</further-classification>  
        <further-classification edition="201201120251226B">G03F1/74</further-classification>  
        <further-classification edition="200601120251226B">G03F7/20</further-classification>  
        <further-classification edition="201201120251226B">G03F1/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布達施　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUDACH, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種氣體壓力測量裝置（100），用於測量微影光罩（302）的粒子束誘導處理設備（300）在工作區（306）的製程氣體（304）的壓力值（P、P1）。該氣體壓力測量裝置包含：一腔室（102），該腔室的第一側（118）具有一開口（104），該開口用於接收該製程氣體（304），且在該腔室的第二側（124）則設有壓力膜片（122）；以及一感測器單元（134），用於偵測該壓力膜片（122）的撓度（A），藉此測定該腔室（102）內的該製程氣體（304）的該壓力值（P1），並將該製程氣體（304）的該壓力值（P1）作為該工作區（306）的該製程氣體（304）的該壓力值（P）；其中該氣體壓力測量裝置（100）設定為使該開口（104）位於該粒子束誘導處理設備（300）的該工作區（306）內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Gas pressure measuring device (100) for measuring a pressure (P, P1) of a process gas (304) at a working site (306) of an apparatus (300) for particle beam-induced processing of a photomask (302) for microlithography, comprising：a chamber (102) with an opening (104) on a first side (118) for receiving the process gas (304) and a pressure diaphragm (122) on a second side (124), and a sensor unit (134) for detecting a deflection (A) of the pressure diaphragm (122) for ascertaining a pressure (P1) of the process gas (304) in the chamber (102) as a pressure (P) of the process gas (304) at the working site (306), wherein the gas pressure measuring device (100) is set up to be positioned in the apparatus (300) such that its opening (104) is at the working site (306) of the apparatus (300).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:氣體壓力測量裝置</p>  
        <p type="p">102:腔室</p>  
        <p type="p">104:開口</p>  
        <p type="p">106:腔室</p>  
        <p type="p">108:腔壁</p>  
        <p type="p">110:部分</p>  
        <p type="p">112:壓力膜片</p>  
        <p type="p">114:部分</p>  
        <p type="p">116:部分</p>  
        <p type="p">118:側</p>  
        <p type="p">120:外部空間</p>  
        <p type="p">122:壓力膜片</p>  
        <p type="p">124:側</p>  
        <p type="p">126:外部空間</p>  
        <p type="p">128:氣體</p>  
        <p type="p">130:靜止位置</p>  
        <p type="p">132:姿勢</p>  
        <p type="p">134:感測器單元</p>  
        <p type="p">135:支架</p>  
        <p type="p">136:感測器表面</p>  
        <p type="p">138:表面</p>  
        <p type="p">140:外部表面</p>  
        <p type="p">200:氣體壓力測量裝置</p>  
        <p type="p">202:腔室</p>  
        <p type="p">204:開口</p>  
        <p type="p">218:側</p>  
        <p type="p">222:壓力膜片</p>  
        <p type="p">224:側</p>  
        <p type="p">230:靜止位置</p>  
        <p type="p">232:位置</p>  
        <p type="p">234:感測器單元</p>  
        <p type="p">304:製程氣體</p>  
        <p type="p">306:工作區</p>  
        <p type="p">342:溫度感測器</p>  
        <p type="p">344:溫度感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1406" publication-number="202614465"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614465.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614465</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121506</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多種電力格式可充電電池及其使用方法</chinese-title>  
        <english-title>MULTIPLE POWER-FORMAT RECHARGEABLE BATTERY AND METHOD OF USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">H01M10/44</main-classification>  
        <further-classification edition="202101120251231B">H01M50/204</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商達納解析公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAANAA RESOLUTION INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德加尼　穆罕默達巴迪　索羅斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEHGHANI MOHAMMADABADI, SOROUSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>約瑟夫　戴昂　埃胡德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSEPH DAON, EHUD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林彥丞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種可充電電源，包括複數個低壓DC可充電化學單電池堆。每個單電池堆包括至少一個可充電化學單電池。每個單電池堆具有串聯且包括內部雙模態近場無線鏈路的對應的電力交換單元，該內部雙模態近場無線鏈路配置用於將單該電池堆的低壓DC電力轉換為外部電力負載所需的電力格式，並用於將來自外部電源的電力轉換為低壓DC電力，以用於對該單電池堆進行充電。各種感測器設置於與該對應的電力交換單元進行有線通信的每個單電池堆上。與每個電力交換單元通信的電力系統控制器基於外部電力負載或外部電源的電力格式要求並基於從該電力交換單元接收之關於該對應的單電池堆的感測器資料調整每個電力交換單元的雙模態鏈路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention involves a rechargeable power source comprises a plurality of low voltage DC rechargeable chemical cell stacks. Each cell stack comprises at least one rechargeable chemical cell. Each cell stack has a corresponding power transaction unit in series comprising an internal bimodal near-field wireless link configured for converting low voltage DC power of the cell stack to a power format required for an external power load, and for converting power from an external power source to low voltage DC power for recharging the cell stack. Various sensors are disposed on every cell stack in wired communication with the corresponding power transaction unit. A power system controller in communication with every power transaction unit adjusts the bimodal link of each power transaction unit based on power format requirements of the external power load or external power source and on sensor data received from the power transaction unit about the corresponding cell stack.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3820A:LSRHP電池、可充電電源</p>  
        <p type="p">3822:LVDC可充電化學單電池</p>  
        <p type="p">3824:LVDC化學單電池堆、單電池堆</p>  
        <p type="p">3825:共同底部電極連接板</p>  
        <p type="p">3826:感測器組、感測器</p>  
        <p type="p">3828:重複單元元件(ARC模組)、可充電單電池模組</p>  
        <p type="p">3840:電力系統控制器(PSC)</p>  
        <p type="p">3900A:電力交換單元(PTU)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1407" publication-number="202614452"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614452.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614452</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121507</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及製造半導體裝置的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251230B">H01L25/18</main-classification>  
        <further-classification edition="200601120251230B">H01L21/48</further-classification>  
        <further-classification edition="200601120251230B">H01L23/00</further-classification>  
        <further-classification edition="200601120251230B">H01L23/13</further-classification>  
        <further-classification edition="200601120251230B">H01L23/15</further-classification>  
        <further-classification edition="200601120251230B">H01L23/367</further-classification>  
        <further-classification edition="200601120251230B">H01L23/473</further-classification>  
        <further-classification edition="200601120251230B">H01L23/538</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　又坪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, WOOPOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供半導體裝置及製造半導體裝置的方法。舉例而言，一種半導體裝置可包括：基板；以及半導體總成，被配置成電性連接於一起，半導體總成中的每一者包括：第一半導體晶片，至少部分地位於基板的第一表面與基板的第二表面之間，第一表面面向第一方向且第二表面面向與第一方向相反的第二方向；以及電壓調節器，位於基板的第一表面上，在第一方向上與第一半導體晶片交疊，且被配置成電性連接至第一半導體晶片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor devices and methods of manufacturing the semiconductor devices are provided. For example, a semiconductor device may include: a substrate; and semiconductor assemblies that are configured to be electrically connected together, each of the semiconductor assemblies including: a first semiconductor chip that is at least partially between a first surface of the substrate and a second surface of the substrate, the first surface facing in a first direction and the second surface facing in a second direction, opposite to the first direction; and a voltage regulator that is on the first surface of the substrate, overlaps with the first semiconductor chip in the first direction, and is configured to be electrically connected to the first semiconductor chip.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體裝置</p>  
        <p type="p">10:液體冷卻冷板</p>  
        <p type="p">10U、20U:頂表面</p>  
        <p type="p">20:基板</p>  
        <p type="p">21:介電材料</p>  
        <p type="p">22:凹槽</p>  
        <p type="p">30:重佈線層(RDL)</p>  
        <p type="p">32:介電層</p>  
        <p type="p">32-1:最下部介電層</p>  
        <p type="p">32-2:最上部介電層</p>  
        <p type="p">34:通孔</p>  
        <p type="p">34-1:第一通孔</p>  
        <p type="p">34-2:第二通孔</p>  
        <p type="p">36:跡線</p>  
        <p type="p">36-1:第一跡線</p>  
        <p type="p">36-2:第二跡線</p>  
        <p type="p">36-3:第三跡線</p>  
        <p type="p">38:接墊</p>  
        <p type="p">40、40-1、40-2:半導體總成</p>  
        <p type="p">41:第一半導體晶片/半導體晶片</p>  
        <p type="p">42:電壓調節器</p>  
        <p type="p">50:焊料接頭</p>  
        <p type="p">55:底部填充膠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1408" publication-number="202613133"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613133.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613133</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121535</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含氧雜環類衍生物抑制劑、其製備方法與應用</chinese-title>  
        <english-title>OXYGEN-CONTAINING HETEROCYCLIC DERIVATIVE AS INHIBITOR, METHOD FOR PREPARING THE SAME, AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D491/22</main-classification>  
        <further-classification edition="200601120260102B">C07F9/6561</further-classification>  
        <further-classification edition="200601120260102B">C07F9/6571</further-classification>  
        <further-classification edition="200601120260102B">C07D519/00</further-classification>  
        <further-classification edition="200601120260102B">C07F5/04</further-classification>  
        <further-classification edition="200601120260102B">C07F5/02</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4188</further-classification>  
        <further-classification edition="200601120260102B">A61K31/675</further-classification>  
        <further-classification edition="200601120260102B">A61K31/427</further-classification>  
        <further-classification edition="200601120260102B">A61K31/506</further-classification>  
        <further-classification edition="200601120260102B">A61K31/444</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4375</further-classification>  
        <further-classification edition="200601120260102B">A61K31/422</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4355</further-classification>  
        <further-classification edition="200601120260102B">A61K31/433</further-classification>  
        <further-classification edition="200601120260102B">A61K31/497</further-classification>  
        <further-classification edition="200601120260102B">A61K31/519</further-classification>  
        <further-classification edition="200601120260102B">A61K31/69</further-classification>  
        <further-classification edition="200601120260102B">A61P29/00</further-classification>  
        <further-classification edition="200601120260102B">A61P37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾蜜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, MI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾明高</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, MINGGAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜堅鋼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, JIANGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及含氧雜環類衍生物抑制劑、其製備方法和應用。特別地，本發明涉及化合物、其製備方法及含有該化合物的藥物組合物，及其作為抑制劑在治療自體免疫疾病的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an oxygen-containing heterocyclic derivative as an inhibitor, a method for preparing the same, and use thereof. In particular, the present invention relates to a compound, a method for preparing the same, a pharmaceutical composition containing the compound, and use thereof as an inhibitor for treating autoimmune diseases.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1409" publication-number="202614344"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614344.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614344</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121560</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電夾盤及基板固定裝置</chinese-title>  
        <english-title>ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L21/683</main-classification>  
        <further-classification edition="200601120260102B">H02N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新光電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINKO ELECTRIC INDUSTRIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>春原昌宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNOHARA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林博幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種靜電夾盤包括陶瓷板、吸附電極、接地電極、及布線。吸附電極內置於陶瓷板的一個表面下方。接地電極設置於陶瓷板的另一表面與陶瓷板中的吸附電極之間，並且可連接至接地電位。布線連接至陶瓷板中的接地電極，並通過吸附電極延伸至陶瓷板的一個表面。布線包括設置在與吸附電極相同高度位置處的連接墊、將連接墊與接地電極或設置得比連接墊更靠近接地電極的另一連接墊連接的第一通孔、及將連接墊與陶瓷板的一個表面連接的第二通孔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrostatic chuck includes a ceramic plate, an adsorption electrode, a ground electrode, and a wiring. The adsorption electrode is built-in below one surface of the ceramic plate. The ground electrode is disposed between another surface of the ceramic plate and the adsorption electrode in the ceramic plate and connectable to a ground potential. The wiring is connected to the ground electrode in the ceramic plate and extending through the adsorption electrode to the one surface of the ceramic plate. The wiring includes a connection pad disposed at a same height position as the adsorption electrode, a first via connecting the connection pad and the ground electrode or another connection pad disposed closer to the ground electrode than the connection pad, and a second via connecting the connection pad and the one surface of the ceramic plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板固定裝置</p>  
        <p type="p">110:基底板</p>  
        <p type="p">115:電源線</p>  
        <p type="p">115a:開關</p>  
        <p type="p">115b:DC電源</p>  
        <p type="p">116:接地線</p>  
        <p type="p">116a:開關</p>  
        <p type="p">120:靜電夾盤</p>  
        <p type="p">120a:吸附表面</p>  
        <p type="p">120b:空腔</p>  
        <p type="p">120c:空腔</p>  
        <p type="p">130:電源墊</p>  
        <p type="p">140:接地墊</p>  
        <p type="p">150:布線</p>  
        <p type="p">151:連接墊</p>  
        <p type="p">152:通孔</p>  
        <p type="p">160:吸附電極</p>  
        <p type="p">160A:第一電極</p>  
        <p type="p">160B:第二電極</p>  
        <p type="p">161:通過部分</p>  
        <p type="p">170:接地電極</p>  
        <p type="p">180:布線</p>  
        <p type="p">181:連接墊</p>  
        <p type="p">182:通孔</p>  
        <p type="p">190:接地布線</p>  
        <p type="p">191:連接墊</p>  
        <p type="p">192:通孔</p>  
        <p type="p">193:通孔</p>  
        <p type="p">200:黏著劑層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1410" publication-number="202614112"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614112.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614112</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121569</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保護元件及電池組</chinese-title>  
        <english-title>PROTECTION ELEMENT AND BATTERY PACK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01H37/74</main-classification>  
        <further-classification edition="202101120251226B">H01M50/574</further-classification>  
        <further-classification edition="200601120251226B">H01M10/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商迪睿合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米田吉弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEDA, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可熔導體即便經過回焊步驟亦不熔斷，且於異常時能夠快速熔斷可熔導體之保護元件。 &lt;br/&gt;本發明之保護元件1具備：絕緣基板2；發熱體5；第1電極3及第2電極4，其等積層於絕緣基板2；發熱體引出電極6，其設置於第1及第2電極3、4之間之電流路徑上，與發熱體5電性連接；及可熔導體7，其安裝於第1電極3、第2電極4及發熱體引出電極6上，藉由發熱體5之加熱或伴隨過電流之自發熱而熔斷，從而阻斷電流路徑；可熔導體7包括積層體13，該積層體13至少包含液相溫度未達260℃之低熔點金屬層11及液相溫度超過400℃之高熔點金屬層10，積層體13為以單一合金之形式相互熔融時之合金組成之液相溫度成為300℃以上400℃以下之材料構成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:保護元件</p>  
        <p type="p">2:絕緣基板</p>  
        <p type="p">2a:正面</p>  
        <p type="p">3:第1電極</p>  
        <p type="p">4:第2電極</p>  
        <p type="p">5:發熱體</p>  
        <p type="p">5a:發熱體5之一端部</p>  
        <p type="p">5b:發熱體5之另一端部</p>  
        <p type="p">6:發熱體引出電極</p>  
        <p type="p">7:可熔導體</p>  
        <p type="p">7B:被覆構造</p>  
        <p type="p">8:絕緣保護層</p>  
        <p type="p">10:高熔點金屬層</p>  
        <p type="p">12:第2低熔點金屬層</p>  
        <p type="p">14:第1外部連接電極</p>  
        <p type="p">15:第2外部連接電極</p>  
        <p type="p">16:第1發熱體電極</p>  
        <p type="p">17:第2發熱體電極</p>  
        <p type="p">18:第3外部連接電極</p>  
        <p type="p">19:罩蓋構件</p>  
        <p type="p">35:導電性連接介質</p>  
        <p type="p">36:被覆助焊劑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1411" publication-number="202612593"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612593.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612593</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121570</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>裝填於容器之飲料及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A23L2/00</main-classification>  
        <further-classification edition="200601120260102B">A23L2/54</further-classification>  
        <further-classification edition="201901120260102B">C12G3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商朝日集團控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI GROUP HOLDINGS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商朝日啤酒股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI BREWERIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松田巧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDA, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上明大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種裝填於容器之飲料之製造方法，其中裝填於容器之飲料係於容器中放入有碳酸飲料及乾燥果實，若卸下上述容器之容器蓋，則上述乾燥果實於維持大致水平狀態之狀態下漂浮至碳酸飲料之液面；且該製造方法包括：第1步驟，其係向上述容器中放入乾燥果實、及碳酸飲料；第2步驟，其係其後將蓋安裝於上述容器；以及第3步驟，其係其後對上述碳酸飲料進行加熱使乾燥果實膨潤。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1,S2,S3,S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1412" publication-number="202613725"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613725.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613725</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121571</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於微影設備之通氣密封系統及方法</chinese-title>  
        <english-title>VENTED SEALING SYSTEMS AND METHODS FOR A LITHOGRAPHY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G03F7/20</main-classification>  
        <further-classification edition="200601120260102B">F16J15/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽澤　傑克森　雷蒙德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIZER, JACKSON RAYMOND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里斯蒂娜　格雷戈里　托馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRISTINA, GREGORY THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">圖案化裝置透過一負載鎖進入一微影設備。該負載鎖包含一真空腔室，該真空腔室經組態以在內部裝載一圖案化裝置時自一較高壓力降壓至一較低壓力。一密封系統經組態以維持該真空腔室中之該較低壓力。在先前密封系統中，少量氣體可在降壓期間被截留，且接著逸出至該真空腔室中，從而造成一不合需要之壓力尖峰。有利地，本文中所描述之新密封系統及方法提供一種減少或防止截留氣體及/或壓力尖峰之通氣設計。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Patterning devices enter a lithography apparatus through a load lock. The load lock comprises a vacuum chamber, which is configured to be depressurized from a higher pressure to a lower pressure when a patterning device is loaded inside. A sealing system is configured to maintain the lower pressure in the vacuum chamber. In prior sealing systems, a small volume of gas can become trapped during depressurization, and then escape into the vacuum chamber, causing an undesirable pressure spike. Advantageously, the new sealing systems and methods described herein provide a vented design, which reduces or prevents trapped gas and/or pressure spikes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:先前密封系統</p>  
        <p type="p">402:氣體</p>  
        <p type="p">404:氣流</p>  
        <p type="p">406:真空腔室</p>  
        <p type="p">408:真空腔室</p>  
        <p type="p">410:第一本體</p>  
        <p type="p">412:通道</p>  
        <p type="p">414:密封元件</p>  
        <p type="p">416:第二本體</p>  
        <p type="p">418:孔口</p>  
        <p type="p">420:抽吸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1413" publication-number="202614859"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614859.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614859</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121572</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自對準背側切割</chinese-title>  
        <english-title>SELF-ALIGNED BACKSIDE CUT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251226B">H10D84/85</main-classification>  
        <further-classification edition="202501120251226B">H10D64/27</further-classification>  
        <further-classification edition="202501120251226B">H10D30/43</further-classification>  
        <further-classification edition="202501120251226B">H10D30/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萬國商業機器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維嘉　雷納多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VEGA, REINALDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安藤崇志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬札　詹姆士　派翠克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAZZA, JAMES PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭齊洛　尼可拉斯　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANZILLO, NICHOLAS ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃伯特　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOLPERT, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之實施例包括一種半導體結構，其包括具有一閘極結構之一第一電晶體及具有該閘極結構之一第二電晶體。該閘極結構包括一上部部分及一下部部分，其中該上部部分包括一第一底部表面且位於該第一電晶體及該第二電晶體之一主動區外部。該上部部分位於該第一電晶體與該第二電晶體之間，其中該下部部分包括一第二底部表面且位於該第一電晶體及該第二電晶體之該主動區內部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the invention include a semiconductor structure including a first transistor having a gate structure and a second transistor having the gate structure. The gate structure includes an upper portion and a lower portion, where the upper portion includes a first bottom surface and is outside an active region of the first transistor and the second transistor. The upper portion is between the first transistor and the second transistor, where the lower portion includes a second bottom surface and is inside the active region of the first transistor and the second transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:積體電路(IC)</p>  
        <p type="p">102:基板</p>  
        <p type="p">104:淺溝槽隔離(STI)區</p>  
        <p type="p">106:層間介電質(ILD)層</p>  
        <p type="p">110:半導體層</p>  
        <p type="p">112:介電堆疊</p>  
        <p type="p">140:閘極結構</p>  
        <p type="p">170:閘極接點</p>  
        <p type="p">202:背側蓋層</p>  
        <p type="p">402:背側間隔物</p>  
        <p type="p">502:阻擋遮罩</p>  
        <p type="p">602:空腔</p>  
        <p type="p">610:底部表面</p>  
        <p type="p">612:底部表面</p>  
        <p type="p">650:上部部分</p>  
        <p type="p">652:下部部分</p>  
        <p type="p">D:距離</p>  
        <p type="p">X1:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1414" publication-number="202613118"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613118.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613118</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121586</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＨＥＲ２酪胺酸激酶抑制劑之晶體形式</chinese-title>  
        <english-title>CRYSTALLINE FORMS OF A HER2 TYROSINE KINASE INHIBITOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D487/04</main-classification>  
        <further-classification edition="200601120260102B">A61K31/519</further-classification>  
        <further-classification edition="200601120260102B">A61K9/14</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆德　傑森　艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MULDER, JASON ALAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿優博　葛哈達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AYOUB, GHADA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>LB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈利利　納賈法巴迪　巴哈雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHALILI NAJAFABADI, BAHAREH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>匡　善明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUANG, SHANMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉蒂夫　埃爾納茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LATIFI, ELNAZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬內　瓦伊吉納特　達塔特雷亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANE, VAIJINATH DATTATRYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏　赫許　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAH, HARSH S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦蒂爾　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATHIER, MATTHEW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雅雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於宗格替尼(zongertinib)之晶體形式，其為大規模製造中之特別適宜中間體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to crystalline forms of zongertinib which are particularly suitable intermediates in large scale manufacturing.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1415" publication-number="202613304"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613304.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613304</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121589</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於產生經工程改造之淋巴球之方法</chinese-title>  
        <english-title>METHODS FOR GENERATING ENGINEERED LYMPHOCYTES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260102B">C12N5/0783</main-classification>  
        <further-classification edition="200601120260102B">C12N15/86</further-classification>  
        <further-classification edition="200601120260102B">C07K14/725</further-classification>  
        <further-classification edition="200601120260102B">C07K16/28</further-classification>  
        <further-classification edition="202501120260102B">A61K35/17</further-classification>  
        <further-classification edition="202501120260102B">A61K40/11</further-classification>  
        <further-classification edition="202501120260102B">A61K40/31</further-classification>  
        <further-classification edition="202501120260102B">A61K40/42</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商凱特製藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITE PHARMA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈索　瓦利德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASO, WALEED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛瑞勾軒　美樂蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GERAGOSIAN, MELODY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供習知的CAR-T細胞製造程序之改善。具體而言，本揭露係關於用於產生CAR-T細胞之程序，該等程序係藉由使用可溶抗CD3抗體且不使用抗CD28抗體活化選自血球分離術樣本之T細胞來進行。該方法包括自該血球分離術樣本中選擇單核球，以及將所選擇之該等單核球與所選擇之該等T細胞一起培養，之後轉導該等T細胞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are improvements to the conventional CAR-T cell manufacturing process. Specifically, the instant disclosure is related to processes for generating CAR-T cells by activating T cells selected from an apheresis sample by using a soluble anti-CD3 antibody, and without the use of an anti-CD28 antibody. The method includes the selection of monocytes from the apheresis sample and incubating the selected monocytes with the selected T cells prior to transduction of the T cells.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1416" publication-number="202614410"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614410.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614410</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121598</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>傾斜超級通孔</chinese-title>  
        <english-title>TILTED SUPER VIAS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L23/48</main-classification>  
        <further-classification edition="200601120260102B">H01L23/498</further-classification>  
        <further-classification edition="200601120260102B">H01L23/522</further-classification>  
        <further-classification edition="200601120260102B">H01L23/528</further-classification>  
        <further-classification edition="200601120260102B">H01L23/532</further-classification>  
        <further-classification edition="200601120260102B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋魯里達希爾塔扎希達希爾　阿比拉什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VELLURIDATHIL THAZHATHIDATHIL, ABHILASH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏肯斯　瑪蒂努斯瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERKENS, MARTINUS MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞迪　維諾德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REDDY, VINOD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克拉弗　西蒙約翰尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLAVER, SIMON JOHANNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古普塔　阿莫勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUPTA, AMOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">示範性半導體結構可以包含基板、第一互連、絕緣體材料以及第二互連。第二互連可以由絕緣體材料與第一互連隔開。該結構可以包含將第一互連連接至第二互連的傾斜超級通孔。該結構可以包含設置於第一互連和第二互連之間的第三互連。該傾斜超級通孔可以繞過第三互連。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Exemplary semiconductor structures may include a substrate, a first interconnect, an insulator material, and a second interconnect. The second interconnect may be separated from the first interconnect by the insulator material. The structures may include a tilted super via connecting the first interconnect to the second interconnect. The structures may include a third interconnect disposed between the first interconnect and the second interconnect. The tilted super via may bypass the third interconnect.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:方法</p>  
        <p type="p">305:操作</p>  
        <p type="p">310:操作</p>  
        <p type="p">315:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1417" publication-number="202614221"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614221.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614221</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121601</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於增強的方向性沉積之回蝕</chinese-title>  
        <english-title>ETCH BACK FOR ENHANCED DIRECTIONAL DEPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/311</main-classification>  
        <further-classification edition="200601120251226B">H01L21/033</further-classification>  
        <further-classification edition="200601120251226B">H01L21/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄志宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZHIYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>娜娜雅卡拉　查瑞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANAYAKKARA, CHARITH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴蒂亞　斯瓦斯蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHATIA, SWASTI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩尚　馬杜爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SACHAN, MADHUR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豪塔拉　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAUTALA, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">此處所述的實施例涉及一種方法，包括在基板的第一層中形成圖案，其中圖案在第一軸上具有第一臨界尺寸(CD)且在第二軸上具有第二CD，且第一CD與第二CD不同。在一個實施例中，該方法進一步包括使用方向性沉積製程在第一層上沉積第二層，並蝕刻第二層，其中第二層在第一軸的第一方向上的第一蝕刻速度不同於第二層在第二方向上的第二蝕刻速度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments described herein relate to a method that includes forming a pattern in a first layer of a substrate, where the pattern has a first critical dimension (CD) in a first axis and a second CD in a second axis, and where the first CD is different than the second CD. In an embodiment, the method further includes depositing a second layer over the first layer with a directional deposition process, and etching the second layer, where a first etch rate of the second layer in a first direction of the first axis is different than a second etch rate of the second layer in a second direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">560:製程</p>  
        <p type="p">561:操作</p>  
        <p type="p">562:操作</p>  
        <p type="p">563:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1418" publication-number="202614161"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614161.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614161</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121631</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多晶矽基板及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251220B">H01L21/02</main-classification>  
        <further-classification edition="200601120251220B">H01L21/304</further-classification>  
        <further-classification edition="202501120251220B">H10D86/00</further-classification>  
        <further-classification edition="201201120251220B">B24B37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱綜合材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI MATERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>角野知之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KADONO, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤慎司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多晶矽基板，多晶矽形成為具有第一面(1a)與第二面的板狀，其中至少第一面(1a)，在與晶粒邊界交叉且長度50μm的範圍內，測量出表面最大高度與最小高度的差為60nm以下；然後將長度50μm的範圍分為多個區塊，對各個區塊測量最大高度與最小高度來求出表面傾斜的最大值，是在2nm/μm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:載體基板(多晶矽基板)</p>  
        <p type="p">1a:第一面</p>  
        <p type="p">1b:第二面</p>  
        <p type="p">1c:外周面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1419" publication-number="202613023"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613023.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613023</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121640</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＭＥＭＳ麥克風</chinese-title>  
        <english-title>MEMS MICROPHONE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">B81B7/02</main-classification>  
        <further-classification edition="200601120260102B">H04R5/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金龍權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNG KWEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任鍾凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IM, JONG BEOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜秉吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, BYEONG KIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據本公開的一個實施例的MEMS麥克風包括：第一襯底；第二襯底，層疊在第一襯底上；MEMS結構，設置在第二襯底上；以及信號處理元件，與MEMS結構間隔開並且設置在第二襯底上，其中，第二襯底可以包括至少一個絕緣層和多個金屬層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">According to an embodiment of the present disclosure, the MEMS microphone includes: a first substrate; a second substrate stacked on the first substrate; a MEMS structure disposed on the second substrate; and a signal processing component spaced apart from the MEMS structure and arranged on the second substrate, wherein the second substrate may comprise at least one insulating layer and multiple metal layers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:音孔</p>  
        <p type="p">100:第一襯底</p>  
        <p type="p">110:主焊盤</p>  
        <p type="p">200:第二襯底</p>  
        <p type="p">300:MEMS結構</p>  
        <p type="p">310:主體</p>  
        <p type="p">320:膜片</p>  
        <p type="p">330:背板</p>  
        <p type="p">340:主體焊盤</p>  
        <p type="p">400:殼體</p>  
        <p type="p">500:信號處理元件</p>  
        <p type="p">510:信號焊盤</p>  
        <p type="p">610:第一電容器</p>  
        <p type="p">620:第二電容器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1420" publication-number="202614640"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614640.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614640</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121641</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微機電麥克風</chinese-title>  
        <english-title>MEMS MICROPHONE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H04R19/04</main-classification>  
        <further-classification edition="200601120251219B">H04R19/00</further-classification>  
        <further-classification edition="200601120251219B">H04R7/02</further-classification>  
        <further-classification edition="200601120251219B">B81B7/02</further-classification>  
        <further-classification edition="200601120251219B">B81B7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任鍾凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IM, JONG BEOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜秉吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, BYEONG KIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金學海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HAK HAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種微機電系統（MEMS）麥克風，包含：一第二基板，其上形成一輔助墊片；一MEMS結構，配置於該第二基板上，其上形成一本體墊片；以及與該微機電系統結構間隔開置於該第二基板上的一訊號處理元件，其上形成一訊號墊片；其中該輔助墊片與該本體墊片及該訊號墊片中至少一者接觸，以實現電氣連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A MEMS microphone according to one embodiment of the present disclosure includes: a second substrate having an auxiliary pad formed thereon; a MEMS structure disposed on the second substrate and having a body pad formed thereon; and a signal processing element spaced apart from the MEMS structure, disposed on the second substrate, and having a signal pad formed thereon; in which the auxiliary pad may be in contact with at least one of the body pad and the signal pad to be electrically connected thereto.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:音孔</p>  
        <p type="p">100:第一基板</p>  
        <p type="p">200:第二基板</p>  
        <p type="p">300:MEMS結構</p>  
        <p type="p">310:本體</p>  
        <p type="p">320:振膜</p>  
        <p type="p">330:背板</p>  
        <p type="p">340:本體墊片</p>  
        <p type="p">360:音孔</p>  
        <p type="p">400:外殼</p>  
        <p type="p">500:訊號處理元件</p>  
        <p type="p">510:訊號墊片</p>  
        <p type="p">610:電容器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1421" publication-number="202612599"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612599.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612599</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121649</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經口組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260102B">A23L33/135</main-classification>  
        <further-classification edition="201601120260102B">A23L33/21</further-classification>  
        <further-classification edition="201601120260102B">A23L29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商江崎格力高股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EZAKI GLICO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬場悠平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BABA, YUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AZUMA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的是提供可提升基礎代謝量之經口組成物。透過對雙歧桿菌組合水溶性食物纖維，可提升基礎代謝量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1422" publication-number="202614641"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614641.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614641</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121655</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＭＥＭＳ麥克風</chinese-title>  
        <english-title>MEMS MICROPHONE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H04R19/04</main-classification>  
        <further-classification edition="200601120251229B">B81B7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金龍權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YOUNG KWEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜秉吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, BYEONG KIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金學海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HAK HAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種根據本揭露內容之一個實施例之MEMS麥克風可包括：一第一基體；一第二基體，其層壓於該第一基體上；一阻焊層，其安置於該第二基體之一上表面或一下表面中之至少一者上；一MEMS結構，其安置於該第二基體上；以及一電容器，其與該MEMS結構間隔開且安置於該第二基體上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A MEMS microphone according to one embodiment of the present disclosure may include a first substrate; a second substrate laminated on the first substrate; a solder resist layer disposed on at least one of an upper surface or a lower surface of the second substrate; a MEMS structure disposed on the second substrate; and a capacitor spaced apart from the MEMS structure and disposed on the second substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:音孔</p>  
        <p type="p">100:第一基體</p>  
        <p type="p">110:墊</p>  
        <p type="p">200:第二基體</p>  
        <p type="p">300:MEMS結構</p>  
        <p type="p">310:主體</p>  
        <p type="p">320:隔膜</p>  
        <p type="p">330:背板</p>  
        <p type="p">360:音孔</p>  
        <p type="p">400:殼體</p>  
        <p type="p">500:信號處理元件</p>  
        <p type="p">600:電容器</p>  
        <p type="p">700:阻焊層</p>  
        <p type="p">710:第一阻焊層</p>  
        <p type="p">720:第二阻焊層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1423" publication-number="202612846"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612846.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612846</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121688</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>旋轉速度計算裝置、旋轉速度計算方法、基板清洗裝置及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B24B49/10</main-classification>  
        <further-classification edition="201201120251229B">B24B41/06</further-classification>  
        <further-classification edition="200601120251229B">B24B55/06</further-classification>  
        <further-classification edition="201201120251229B">B24B37/34</further-classification>  
        <further-classification edition="200601120251229B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商荏原製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBARA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和久井康平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKUI, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松田道昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDA, MICHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大垣冬季</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAKI, FUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邊裕輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾文岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳凱智</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於更高精確度地計算基板的旋轉速度，所提供的一種旋轉速度計算裝置，係具備：振動放大器，藉由旋轉驅動保持清洗對象的基板周緣部的滾筒，旋轉前述基板時，使前述基板的周緣部的缺口碰撞前述滾筒所產生的振動放大；一個以上的振動感測器，檢測放大的振動；以及旋轉速度計算部，根據前述振動感測器所檢測的振動，計算前述基板的旋轉速度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1424" publication-number="202614169"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614169.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614169</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121694</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓與晶粒形狀控制</chinese-title>  
        <english-title>WAFER AND DIE SHAPE CONTROL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L21/18</main-classification>  
        <further-classification edition="200601120260102B">H01L21/26</further-classification>  
        <further-classification edition="200601120260102B">H01L21/268</further-classification>  
        <further-classification edition="200601120260102B">H01L21/302</further-classification>  
        <further-classification edition="200601120260102B">H01L21/78</further-classification>  
        <further-classification edition="202501120260102B">H10D62/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商卡爾蔡司ＳＭＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格羅德　古姜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GORHAD, KUJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於調整具有基板及至少一個表面層的晶圓和/或晶粒形狀的方法，該方法包含：在該晶圓和/或該晶粒內施加複數個局部修飾，其中該施加複數個局部修飾的步驟包含：在該至少一個表面層內施加複數個局部修飾；和/或藉由該至少一個表面層，在該基板內施加複數個局部修飾。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for adjusting a shape of a wafer and/or die having a substrate and at least one surface layer comprises applying a plurality of local modifications in the wafer and/or die, wherein applying the plurality of local modifications comprises applying a plurality of local modifications within the at least one surface layer and/or applying a plurality of local modifications within the substrate, via the at least one surface layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110a:局部修飾</p>  
        <p type="p">110b:局部修飾</p>  
        <p type="p">L:雷射脈衝</p>  
        <p type="p">N:中性軸</p>  
        <p type="p">S:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1425" publication-number="202613614"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613614.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613614</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121696</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學中空波導構件</chinese-title>  
        <english-title>OPTICAL HOLLOW WAVEGUIDE COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">G02B6/032</main-classification>  
        <further-classification edition="200601120251231B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安賽姆　尤傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANSELM, EUGEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波赫舒瑙　言斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROCHNAU, JENS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學中空波導構件(25)，特別是用於EUV光的均勻化，包含：兩支撐元件(26)以及兩插入元件(28)，特別是兩板狀插入元件。該等插入元件(28)插入於該等支撐元件(26)之間，使得一中空波導(11)形成在該等插入元件(28)之間。此中空波導構件(25)特別適用於照射光學單元，其用於結合EUV照射光的一光罩檢測系統(1)。具有此照射光學單元的光學系統以及具有此光學系統的光罩檢測系統也有描述。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical hollow waveguide component (25), in particular for the homogenization of EUV light, comprises two support elements (26) and two insertion elements (28), in particular two plate-shaped insertion elements. The insertion elements (28) are inserted between the support elements (26) in such a way that a hollow waveguide (11) is formed between the insertion elements (28). The hollow waveguide component (25) is suitable in particular for use in an illumination optics unit for a mask inspection system (1) for use with EUV illumination light. An optical system having such an illumination optics unit and a mask inspection system having the optical system are also described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:中空波導</p>  
        <p type="p">12:入射開口</p>  
        <p type="p">14:出射開口</p>  
        <p type="p">25:中空波導構件</p>  
        <p type="p">26:支撐元件</p>  
        <p type="p">28:插入元件</p>  
        <p type="p">30:定位槽</p>  
        <p type="p">31:黏合突出部</p>  
        <p type="p">32:排氣通道</p>  
        <p type="p">33:夾固件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1426" publication-number="202613124"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613124.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613124</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121708</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>降低ＬＲＲＫ２之方法</chinese-title>  
        <english-title>METHODS OF LOWERING LRRK2</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D487/08</main-classification>  
        <further-classification edition="200601120260102B">A61K31/4995</further-classification>  
        <further-classification edition="200601120260102B">A61P25/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾可瑞克斯生物科學公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACUREX BIOSCIENCES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美國匹茲堡大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIVERSITY OF PITTSBURGH - OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平喬夫斯基　尚恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PINTCHOVSKI, SEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史瑞德爾　威廉　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHRADER, WILLIAM D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇尼　馬修　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEENEY, MATTHEW T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格林安姆雷　Ｊ　提摩西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREENAMYRE, J. TIMOTHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明闡述15-脂肪加氧酶(15-LO)產物4-羥基壬烯醛(4HNE或4-HNE)在轉譯後修飾LRRK2且據信誘導與LRRK2介導疾病或病狀、例如帕金森氏病(Parkinson’s disease)或額顳葉矢智症有關之病理學升高之慢性LRRK2激酶活性。LRRK2-4HNE加合物、例如本文所闡述之LRRK2 Cys2024-4HNE及/或LRRK2 Cys2025-4HNE加合物之產生可指示LRRK2介導疾病或病狀。藉由15-LO抑制劑來抑制細胞中過量4HNE之產生將升高LRRK2活性轉化為正常基礎LRRK2活性程度，如實例中之細胞實驗所顯示。據信，4HNE產生之15-LO抑制僅去除與LRRK2介導疾病或病狀有關之升高之LRRK2活性而不去除其他細胞功能可能需要之正常LRRK2活性。因此，升高之LRRK2活性及/或表現之15-LO抑制可為LRRK2介導疾病或病狀提供安全及有效的治療。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure describes that the 15-lipoxygenase (15-LO) product 4-hydroxynonenal (4HNE or 4-HNE) post-translationally modifies LRRK2 and is believed to induce a pathologically elevated, chronic LRRK2 kinase activity associated with a LRRK2 mediated disease or condition, &lt;i&gt;e.g.&lt;/i&gt;, Parkinson’s disease or frontotemporal dementia. Production of LRRK2-4HNE adducts, &lt;i&gt;e.g.&lt;/i&gt;, LRRK2 Cys2024-4HNE and/or LRRK2 Cys2025-4HNE adduct described herein, may be an indication of a LRRK2 mediated disease or condition. Inhibiting the production of excessive 4HNE in cells by 15-LO inhibitors converted an elevated LRRK2 activity to a normal basal LRRK2 activity level as demonstrated in cellular experiments in the Examples. The 15-LO inhibition of 4HNE production is believed to only remove elevated LRRK2 activity associated with LRRK2 mediated diseases or conditions and not normal LRRK2 activity that may be required for other cellular functions. Accordingly, 15-LO inhibition of elevated LRRK2 activity and/or expression may afford a safe and effective treatment for LRRK2 mediated diseases or conditions.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1427" publication-number="202614856"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614856.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614856</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121732</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251120B">H10D84/83</main-classification>  
        <further-classification edition="202501120251120B">H10D84/01</further-classification>  
        <further-classification edition="202501120251120B">H10D62/10</further-classification>  
        <further-classification edition="200601120251120B">B82B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台灣積體電路製造股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林俊言</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHUN-YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林威呈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾健庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TZENG, JIANN-TYNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置，包括：活動閘極結構，其設置在基板上方；第一源極/汲極特徵，其設置在活動閘極結構之兩個相對側處；介電閘極結構，其設置在基板上方，介電閘極結構與活動閘極結構沿著垂直於基板的垂直方向堆疊於彼此上方；及第二源極/汲極特徵，其設置在介電閘極結構之兩個相對側處，其中第一源極/汲極特徵與第二源極/汲極特徵是不同的導電性類型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes an active gate structure disposed over a substrate; first source/drain features disposed at two opposite sides of the active gate structure; a dielectric gate structure disposed over the substrate, the dielectric gate structure and the active gate structure stacked one over another along a vertical direction perpendicular to the substrate; and second source/drain features disposed at two opposite sides of the dielectric gate structure, where the first source/drain features and the second source/drain features are of different conductivity types.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:方法</p>  
        <p type="p">702、704、706、708、710、712、714、716:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1428" publication-number="202613421"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613421.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613421</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121765</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滑動軸承</chinese-title>  
        <english-title>SLIDING BEARING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">F16C17/10</main-classification>  
        <further-classification edition="200601120251224B">F16C33/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＮＴＮ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NTN CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前田剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片渕恵太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAFUCHI, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西森楓華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMORI, FUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">滑動軸承(1)，具備由在周向上延續之環狀體形成的內輪(2)，以及由在周向上延續之環狀體形成的外輪(3)。外輪(3)的內周面，具有朝徑向內側凸出之環狀凸部形狀的凸曲面(3a)。內輪(2)的外周面，具有朝徑向內側凹入之環狀凹部形狀的凹曲面(2a)。內輪(2)的凹曲面(2a)，卡合於外輪(3)的凸曲面(3a)，並能夠對外輪(3)的凸曲面(3a)在周向上相對滑動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The sliding bearing (1) includes: an inner ring (2) including an annular body extending in a circumferential direction; and an outer ring (3) including an annular body extending in the circumferential direction. The outer ring (3) has an inner peripheral surface provided with a convex curved surface (3a) that has an annular convex shape projecting radially inwardly. The inner ring (2) has an outer peripheral surface provided with a concave curved surface (2a) that has an annular concave shape recessed radially inwardly. The concave curved surface (2a) of the inner ring (2) is engaged with the convex curved surface (3a) of the outer ring (3), and is operable to circumferentially slide relative to the convex curved surface (3a) of the outer ring (3).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:滑動軸承</p>  
        <p type="p">2:內輪</p>  
        <p type="p">2a:凹曲面</p>  
        <p type="p">2b:內輪側面</p>  
        <p type="p">3:外輪</p>  
        <p type="p">3a:凸曲面</p>  
        <p type="p">3b:外輪側面</p>  
        <p type="p">C:軸中心</p>  
        <p type="p">C1:軸向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1429" publication-number="202612988"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612988.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612988</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121793</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>空氣動力急速冷凍容器</chinese-title>  
        <english-title>AERODYNAMIC BLAST FREEZE CONTAINERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251220B">B65D21/02</main-classification>  
        <further-classification edition="200601120251220B">B65D81/18</further-classification>  
        <further-classification edition="202501120251220B">A01N1/162</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希多　羅伯特　Ｍ　二世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHYDO, ROBERT M. JR.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拉尼斯　特洛伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GALANIS, TROY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉安納里斯　傑西　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GEANNARIS, JESSIE M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示提供空氣動力構件及/或間隔件來改良在諸如急速冷凍等程序中使用之殼體周圍之空氣流。該等空氣動力構件可包含空氣控制表面，該等空氣控制表面經構形以控制空氣流，以便減小一急速冷凍容器上方之一流邊界層。該等間隔件可在毗鄰急速冷凍容器之間提供間距。該等間隔件及/或空氣動力構件可作為急速冷凍容器之附件或一體式結構併入至該等容器中。空氣動力構件及間隔件亦可組合成製品以用於放置在急速冷凍容器之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aerodynamic members and/or spacers are provided to improve airflow around shells used in processes such as blast freezing. The aerodynamic members can include air control surfaces configured to control airflow so as to reduce a boundary layer of flow over a blast freeze container. The spacers can provide spacing between adjacent blast freeze containers. The spacers and/or aerodynamic members can be incorporated into the blast freeze containers as attachments or integral structures of the containers. Aerodynamic members and spacers can also be combined into articles for placement between blast freeze containers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:容器殼體</p>  
        <p type="p">102:第一容器區段</p>  
        <p type="p">104:第二容器區段</p>  
        <p type="p">106:間隔件</p>  
        <p type="p">108:空氣動力構件</p>  
        <p type="p">110:空氣控制表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1430" publication-number="202614504"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614504.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614504</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121798</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電連接器及其組合</chinese-title>  
        <english-title>ELECTRICAL CONNECTOR AND ASSEMBLY THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01R13/533</main-classification>  
        <further-classification edition="200601120251229B">H01R13/641</further-classification>  
        <further-classification edition="200601120251229B">H01R13/642</further-classification>  
        <further-classification edition="201101120251229B">H01R12/72</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳銘祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, MING-XIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐國峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, KUO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電連接器組合，包括電連接器和散熱模組，所述電連接器包括絕緣本體及固定在所述絕緣本體的複數個端子，所述絕緣本體設有向外貫穿的卡槽，所述端子延伸入所述卡槽；所述電連接器設有支撐面，所述散熱模組的一端架設於所述電連接器的支撐面，所述電連接器設有暴露於所述支撐面的附加端子，所述散熱模組包括附加功能模組及連接於所述附加功能模組的接口部，當所述散熱模組的一端放置在所述支撐面時，所述接口部與所述附加端子達成接觸，從而導通所述附加功能模組的工作回路，可賦予散熱模組附加功能且操作便捷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical connector assembly includes an electrical connector having an insulating housing and plural terminals fixed on the insulating housing; and a heat dissipation module having a fixing plate at one end thereof. The electrical connector has a card slot extending outward and a supporting surface for supporting the fixing plate. The plural terminals extend into the card slot. The electrical connector has an additional terminal exposed to the supporting surface. The heat dissipation module includes an additional function module and an interface portion connected to the additional function module. When the fixing plate is placed on the supporting surface, the interface portion contacts with the additional terminal, thereby conducting the working circuit of the additional function module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:附加端子</p>  
        <p type="p">41:附加接觸部</p>  
        <p type="p">50:附加功能模組</p>  
        <p type="p">51:連接器</p>  
        <p type="p">601:接口端子</p>  
        <p type="p">602:導接部</p>  
        <p type="p">75:連接槽</p>  
        <p type="p">831:線纜連接器</p>  
        <p type="p">830:線纜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1431" publication-number="202613705"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613705.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613705</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121800</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反射型空白光罩（Ｍａｓｋ　Ｂｌａｎｋ）、反射型光罩及反射型空白光罩的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251230B">G03F1/24</main-classification>  
        <further-classification edition="201201120251230B">G03F1/48</further-classification>  
        <further-classification edition="201201120251230B">G03F1/52</further-classification>  
        <further-classification edition="201201120251230B">G03F1/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>生越大河</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGOSE, TAIGA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金子英雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEKO, HIDEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲月判臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INAZUKI, YUKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙坂卓郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSAKA, TAKURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供反射型空白光罩、反射型光罩及反射型空白光罩的製造方法，該反射型空白光罩具有相位缺陷檢測時的BGL較小、且膜應力較小的多層反射膜。 &lt;br/&gt;　　[解決手段]本發明的反射型空白光罩，係具有基板(10)，以及設置於前述基板(10)的多層反射膜(50)，該多層反射膜(50)係用於反射曝光光，並且具有包含低折射率層(30)和高折射率層(20)的週期層疊結構部(51)。前述低折射率層(30)係包含釕(Ru)，並進一步包含碳(C)和矽(Si)中之一者或兩者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">20:高折射率層</p>  
        <p type="p">30:低折射率層</p>  
        <p type="p">50:多層反射膜</p>  
        <p type="p">51:週期層疊結構部</p>  
        <p type="p">110:保護膜</p>  
        <p type="p">120:吸收體膜</p>  
        <p type="p">150:導電膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1432" publication-number="202613312"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613312.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613312</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121801</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冠狀病毒疫苗組成物和方法</chinese-title>  
        <english-title>CORONAVIRUS VACCINE COMPOSITIONS AND METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C12N15/50</main-classification>  
        <further-classification edition="200601120260102B">C07K14/165</further-classification>  
        <further-classification edition="200601120260102B">C07K14/18</further-classification>  
        <further-classification edition="200601120260102B">A61K39/215</further-classification>  
        <further-classification edition="200601120260102B">A61K9/51</further-classification>  
        <further-classification edition="202501120260102B">A61K9/127</further-classification>  
        <further-classification edition="200601120260102B">A61P31/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商亞克圖羅斯醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARCTURUS THERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇利凡　西恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SULLIVAN, SEAN MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松田大輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDA, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立川清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TACHIKAWA, KIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇福庫拉　帕德瑪納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIVUKULA, PADMANABH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡瑪利　普莉亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARMALI, PRIYA PRAKASH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴維斯　傑瑞德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAVIS, JARED HENRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>包艷潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAO, YANJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩吉　阿密特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAGI, AMIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供編碼病毒複製蛋白和抗原性冠狀病毒蛋白或彼等之片段的核酸分子。本發明亦提供包括編碼病毒複製蛋白和抗原蛋白之核酸分子和脂質的組成物。本發明提供之核酸分子可用於誘導免疫反應。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein are nucleic acid molecules encoding viral replication proteins and antigenic coronavirus proteins or fragments thereof. Also provided herein are compositions that include nucleic acid molecules encoding viral replication and antigenic proteins, and lipids. Nucleic acid molecules provided herein are useful for inducing immune responses.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1433" publication-number="202613218"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613218.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613218</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121811</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>覆金屬積層板的製造方法、覆金屬積層板、印刷線路板及其製造方法、半導體封裝體及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">C08J5/24</main-classification>  
        <further-classification edition="200601120251217B">C08L63/02</further-classification>  
        <further-classification edition="200601120251217B">B32B37/00</further-classification>  
        <further-classification edition="200601120251217B">B32B15/092</further-classification>  
        <further-classification edition="200601120251217B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鶴田英壽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUDA, HIDETOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北嶋貴代</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAJIMA, TAKAYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中西晃太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANISHI, KOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫田誠也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAGOTA, SEIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種覆金屬積層板的製造方法，其將預浸體及金屬箔藉由加熱及加壓來積層，前述預浸體含有熱硬化性樹脂組成物及厚度40 μm以上的纖維基材，且具有：第一樹脂層，其設置於前述纖維基材的一面上且含有熱硬化性樹脂組成物；及第二樹脂層，其設置於前述纖維基材的另一面上且含有熱硬化性樹脂組成物；將前述第一樹脂層的厚度設為d&lt;sub&gt;1&lt;/sub&gt;且將前述第二樹脂層的厚度設為d&lt;sub&gt;2&lt;/sub&gt;時，式(1)表示的厚度差值的比例的絕對值R為8.0％以下，依照既定方法來求出的縱方向的尺寸變化量的變異範圍為60 ppm以下且橫方向的尺寸變化量的變異範圍為60 ppm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:覆金屬積層板</p>  
        <p type="p">1:纖維基材</p>  
        <p type="p">2:第一樹脂層</p>  
        <p type="p">3:第二樹脂層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1434" publication-number="202613338"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613338.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613338</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121813</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>選擇性材料沉積</chinese-title>  
        <english-title>SELECTIVE MATERIAL DEPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">C23C14/04</main-classification>  
        <further-classification edition="200601120251216B">C23C14/14</further-classification>  
        <further-classification edition="200601120251216B">C23C14/26</further-classification>  
        <further-classification edition="200601120251216B">C23C16/42</further-classification>  
        <further-classification edition="200601120251216B">B08B5/00</further-classification>  
        <further-classification edition="200601120251216B">H01L21/203</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康　席恩Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, SEAN S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈馬尼　史林尼法斯Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEMANI, SRINIVAS D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　怡利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIEH, ELLIE Y.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在半導體處理腔室中沉積含金屬層的方法及設備。一個示例方法大體包括在一段時間內將處理氣體送入半導體處理腔室，其中處理氣體包括以第一速率送入的第一前驅物和以第二速率送入的蝕刻劑，在該段時間的至少第一部分期間內，持續維持由半導體處理腔室中存在的第一前驅物形成的電漿，並在該段時間內在半導體結構的至少一部分上沉積含金屬層，直到達到終點厚度。將處理氣體送入半導體處理腔室大體包括在該段時間內送入第一前驅物和蝕刻劑，或在該段時間的第一部分送入第一前驅物，而在該段時間的第二部分送入蝕刻劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and apparatus for depositing a metal containing-layer in a semiconductor processing chamber. One example method generally includes delivering a processing gas into the semiconductor processing chamber during a time period, where the processing gas comprises a first precursor delivered at a first rate and etchants delivered at a second rate, sustaining a plasma formed from the first precursor present in the semiconductor processing chamber during at least a first portion of the time period, and depositing the metal containing-layer on at least a portion of a semiconductor structure during the time period until an endpoint thickness is reached. Delivering the processing gas into the semiconductor processing chamber generally includes delivering the first precursor and the etchants during the time period or delivering the first precursor during a first part of the time period and delivering the etchants during a second part of the time period.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:方法</p>  
        <p type="p">205:操作</p>  
        <p type="p">210:操作</p>  
        <p type="p">220:操作</p>  
        <p type="p">230:操作</p>  
        <p type="p">240:操作</p>  
        <p type="p">250:操作</p>  
        <p type="p">260:操作</p>  
        <p type="p">270:操作</p>  
        <p type="p">280:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1435" publication-number="202612610"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612610.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612610</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121817</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>運動包</chinese-title>  
        <english-title>ATHLETIC POUCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">A45F5/02</main-classification>  
        <further-classification edition="200601120251230B">A45C1/02</further-classification>  
        <further-classification edition="200601120251230B">A45C11/00</further-classification>  
        <further-classification edition="200601120251230B">A45C13/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澳大利亞商斯納基客私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SNACKET PTY LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查菲　卡拉　蘇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAFFEY, KARLA SUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種運動包，用於在進行運動活動時攜帶個人物品或食物，運動包包括：一使用中的下部、一使用中的上部、以及前板的一運動包附著部。下部包括一基座，自基座延伸出一前板、一後板以及間隔設置的側板，前板經由側板連接至後板，運動包的內部容積由前板、後板、側板以及基座的內側限定，用於收納食物或個人物。上部包括一設置於袋基座相對側的開口，配置以存取運動包的內部容積，以接收與取出食物或個人物品。運動包附著部自前板的使用中上部區域延伸，用於透過將使用者衣物的一部分接收於運動包附著部與前板之間，實現運動包的可釋放式附著。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An athletic pouch for carrying personal items or food items while conducting sporting activity, the pouch comprising:- an in-use lower portion, wherein the lower portion comprises a base from which a front panel, a rear panel and spaced apart side panels extends therefrom, the front panel being connected to the rear panel by the side panels wherein an internal volume of the pouch is defined by the interior sides of each of the front panel, the rear panel, the side panels and the base, for storing said food items or personal items therein;- an in-use upper portion, wherein the upper portion comprises an opening opposite the base of the pouch, the opening being configured for accessing the internal volume of the pouch for receiving and retrieving said food items or personal items; and- a pouch attachment portion of the front panel extending from an in-use upper region of the front panel for effecting releasable attachment of the pouch by receiving a portion of a user’s clothing between the pouch attachment portion and the front panel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:運動包</p>  
        <p type="p">20:基座</p>  
        <p type="p">30:前板</p>  
        <p type="p">50:側板</p>  
        <p type="p">60:閉合蓋片/蓋片</p>  
        <p type="p">110:運動包附著部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1436" publication-number="202612999"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612999.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612999</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121831</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>升降車廂</chinese-title>  
        <english-title>A LIFT WAGON</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">B65G1/04</main-classification>  
        <further-classification edition="200601120251224B">B65G1/06</further-classification>  
        <further-classification edition="200601120251224B">B65G47/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>挪威商自動存儲技術股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUTOSTORE TECHNOLOGY AS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NO</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧斯崔翰　特朗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUSTRHEIM, TROND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NO</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容係關於一種用於在一自動化儲存及取出系統中垂直地輸送產品容器之升降車廂，其包括一水平輸送器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates to a lift wagon for vertically conveying product containers in an automated storage and retrieval system, including a horizontal conveyor</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:上部網格、網格、第一網格或產品容器儲存部分、第一產品容器部分、儲存部分</p>  
        <p type="p">600:升降總成</p>  
        <p type="p">602:驅動機構</p>  
        <p type="p">604:升降車廂</p>  
        <p type="p">606:箱子升降軌道、升降軌道、箱子升降軌道或框架</p>  
        <p type="p">608:水平輸送器、升降車廂水平輸送器、升降車廂輸送器、輸送器、升降車廂、升降車廂容器</p>  
        <p type="p">608a:第一輸送器、輸送器、升降車廂輸送器</p>  
        <p type="p">608b:第二輸送器、輸送器、升降車廂輸送器</p>  
        <p type="p">610:停靠站、升降車廂停靠位置</p>  
        <p type="p">612:進給輸送器、插入及提取輸送器、插入輸送器、輸送器</p>  
        <p type="p">612a:插入或進給輸送器</p>  
        <p type="p">612b:插入或進給輸送器、插入輸送器</p>  
        <p type="p">614:出口輸送器、插入及提取輸送器、「獲取」輸送器、出口輸送器</p>  
        <p type="p">614a:提取或出口輸送器、提取輸送器</p>  
        <p type="p">614b:提取或出口輸送器</p>  
        <p type="p">616:位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1437" publication-number="202613510"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613510.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613510</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121842</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>洩漏檢查用噴霧單元、洩漏檢查系統及洩漏檢查方法</chinese-title>  
        <english-title>SPRAY UNIT FOR LEAKAGE TEST, LEAKAGE TEST SYSTEM AND LEAKAGE TEST METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">G01M3/20</main-classification>  
        <further-classification edition="200601120251224B">G01M3/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＭＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川村陽一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMURA, YOUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田安徳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, YASUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種洩漏檢查用噴霧單元(30)，具備：檢查液配管(48)，供給螢光檢查液；噴霧空氣配管(46)，供給噴霧空氣；二流體噴嘴(44)，將螢光檢查液與噴霧空氣混合，並將螢光檢查液的霧氣排出；以及殼體(40)，容納檢查液配管(48)、噴霧空氣配管(46)及二流體噴嘴(44)；其中，殼體(40)是具備：排出埠(50)，被形成於二流體噴嘴(44)的排出方向上，並將霧氣排出到殼體(40)的外部；以及稀釋埠(62)，將輔助空氣導入至殼體(40)之內部的混合室(42)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A spray unit for leakage detection (30) includes: a test solution line (48) through which a fluorescent test solution is supplied; a spray air line (46) through which a spray air is supplied; a two-fluid nozzle (44) for mixing the fluorescent test solution with the spray air and discharging a mist of the fluorescent test solution; and a housing (40) for accommodating the test solution line (48), the spray air line (46) and the two-fluid nozzle (44), wherein the housing (40) includes: a discharge opening (50) formed on a discharging side of the two-fluid nozzle (44) to discharge the mist outward of the housing (40); and a dilution hole (62) for introducing an assist air into a mixing chamber (42) inside the housing (40).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:洩漏檢查用噴霧單元</p>  
        <p type="p">40:殼體</p>  
        <p type="p">42:混合室</p>  
        <p type="p">44:二流體噴嘴</p>  
        <p type="p">44a:中心流路</p>  
        <p type="p">44b:徑向方向流路</p>  
        <p type="p">46:噴霧空氣配管</p>  
        <p type="p">46a:彎曲部</p>  
        <p type="p">48:檢查液配管</p>  
        <p type="p">50:排出埠</p>  
        <p type="p">52:筒體</p>  
        <p type="p">54:基端壁</p>  
        <p type="p">56:前端壁</p>  
        <p type="p">56a:基端位置</p>  
        <p type="p">58:噴霧空氣埠</p>  
        <p type="p">58a:第一連接器</p>  
        <p type="p">60:檢查液埠</p>  
        <p type="p">60a:第二連接器</p>  
        <p type="p">62:稀釋埠</p>  
        <p type="p">62a:第三連接器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1438" publication-number="202613077"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613077.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613077</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121863</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＴＳＨＲ拮抗劑化合物、藥物組合物及其製備方法和用途</chinese-title>  
        <english-title>TSHR ANTAGONIST COMPOUND, PHARMACEUTICAL COMPOSITION, PREPARATION METHOD AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D215/38</main-classification>  
        <further-classification edition="200601120260102B">C07D405/06</further-classification>  
        <further-classification edition="200601120260102B">C07D491/044</further-classification>  
        <further-classification edition="200601120260102B">C07D491/056</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4704</further-classification>  
        <further-classification edition="200601120260102B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260102B">A61P5/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商長春金賽藥業有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGCHUN GENESCIENCE PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何衛明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, WEI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翟文強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAI, WEN-QIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊方龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, FANG-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王思勤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SI-QIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種TSHR拮抗劑化合物、藥物組合物及其製備方法和用途。所述化合物具有良好的TSHR拮抗作用，用以治療甲狀腺相關的病症和/或疾病，例如甲狀腺機能亢進症、格雷夫斯病、格雷夫斯眼病、甲狀腺眼病，以及製備用於此類病症或疾病的藥物。 &lt;br/&gt;&lt;img align="absmiddle" height="150px" width="294px" file="ed11480.JPG" alt="ed11480.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a TSHR antagonist compound, a pharmaceutical composition, a preparation method and use thereof. The compound exhibits favorable TSHR antagonistic effect and is useful for treating thyroid-related disorders and/or diseases, such as hyperthyroidism, Graves' disease, Graves' ophthalmopathy, and thyroid eye disease, as well as for the manufacture of a medicament for such disorders or diseases.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1439" publication-number="202612894"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612894.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612894</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121865</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>密封模具、樹脂密封裝置及樹脂密封方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B29C45/26</main-classification>  
        <further-classification edition="200601120251231B">B29C45/14</further-classification>  
        <further-classification edition="200601120251231B">B29C45/16</further-classification>  
        <further-classification edition="200601120251231B">H01L21/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商山田尖端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APIC YAMADA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斉藤高志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大橋好美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHASHI, KONOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前所聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDOKORO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長崎雅彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGASAKI, MASAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠藉由使用了一種密封模具的一次閉模步驟，來進行利用不同的兩種密封樹脂的成形的密封模具、樹脂密封裝置及樹脂密封方法。本發明的密封模具（202）包括第一模（206）以及第二模（204），並進行樹脂密封，所述密封模具包括：第一罐（231），供第一樹脂（R1）投入；第二罐（232），供第二樹脂（R2）投入；第一澆道（271），構成自第一罐（231）流入的第一樹脂（R1）的流路；第二澆道（272），構成自第二罐（232）流入的第二樹脂（R2）的流路；分隔部（203），被第一模（206）與第二模（204）夾持，將第一澆道（271）與第二澆道（272）分隔；以及流路形成部（209），在成為和分隔部（203）接觸的狀態的第一位置與成為不和分隔部（203）接觸的狀態的第二位置之間移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">203:分隔部</p>  
        <p type="p">208、208A、208B:模腔</p>  
        <p type="p">209:流路形成部</p>  
        <p type="p">210:上模模座</p>  
        <p type="p">212:下模模座</p>  
        <p type="p">214:上模槽套區塊</p>  
        <p type="p">216:下模槽套區塊</p>  
        <p type="p">218:上模夾持區塊</p>  
        <p type="p">220:下模夾持區塊</p>  
        <p type="p">226:下模模腔區塊</p>  
        <p type="p">228:上模模腔區塊</p>  
        <p type="p">270:連通路</p>  
        <p type="p">271:第一澆道</p>  
        <p type="p">272:第二澆道</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1440" publication-number="202613119"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613119.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613119</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121871</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>PROTAC嵌合化合物的固體形式、其製備方法、藥物組合物和用途</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D487/04</main-classification>  
        <further-classification edition="200601120260102B">A61K31/513</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商杭州中美華東製藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANGZHOU ZHONGMEIHUADONG PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高岳君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, YUEJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭皓文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, HAOWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱壯志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, ZHUANGZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡海寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, HAINING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張智敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭劉斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, LIUBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　東舟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, DONGZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供PROTAC嵌合化合物的結晶形式、其製備方法、藥物組合物和用途，具體地涉及1-(2-氯-5-(4-((1-(5-(7-(1-(2,2,2-三氟乙基)-1H-吡唑-4-基)-5H-吡咯并[2,3-b]吡𠯤-2-基)吡啶-2-基)哌啶-4-基)甲基)哌啶-1-羰基)苯基)二氫嘧啶-2,4(1H,3H)-二酮的晶型A、晶型B、晶型C、晶型D、晶型E、晶型F、晶型G、晶型H、晶型I、晶型J、晶型K、晶型L、晶型M、晶型N、晶型O、晶型P、晶型Q、晶型R、晶型S、晶型T和晶型V，以及這些結晶形式的製備方法、藥物組合物和用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1441" publication-number="202614287"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614287.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614287</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121880</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔方法、半導體裝置的製造方法、程式及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H01L21/67</main-classification>  
        <further-classification edition="200601120251103B">H01L21/302</further-classification>  
        <further-classification edition="200601120251103B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商國際電氣股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name/>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMANE, YOMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石橋清久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIBASHI, KIYOHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野原慎吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOHARA, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供能夠抑制處理室內的蝕刻量的不均勻性的技術。 &lt;br/&gt;　　[解決手段]具有：(a)將清潔氣體或與前述清潔氣體反應的添加氣體中的任一者作為第一氣體，從第一方向的1處或多處的第一位置，供給至構成為能夠沿著垂直於前述第一方向的平面收納基板的處理室內的工程；以及(b)將前述清潔氣體或與前述清潔氣體反應的添加氣體中的另一者作為第二氣體，從前述第一方向中不同於前述第一位置的1處或多處的第二位置，供給至前述處理室內的工程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理裝置</p>  
        <p type="p">2:反應管</p>  
        <p type="p">2A:第一緩衝室</p>  
        <p type="p">2B:第二緩衝室</p>  
        <p type="p">2E:開口部</p>  
        <p type="p">2F:開口部</p>  
        <p type="p">3:加熱器</p>  
        <p type="p">4:溫度檢測器</p>  
        <p type="p">5:歧管</p>  
        <p type="p">6:密封構件</p>  
        <p type="p">7:處理容器</p>  
        <p type="p">8:處理室</p>  
        <p type="p">9:密封蓋</p>  
        <p type="p">13:旋轉軸</p>  
        <p type="p">14:晶舟</p>  
        <p type="p">15:隔熱結構體</p>  
        <p type="p">16:旋轉機構</p>  
        <p type="p">17:晶舟升降機</p>  
        <p type="p">18:氣體供給機構</p>  
        <p type="p">19:氣體供給管</p>  
        <p type="p">20:氣體供給部</p>  
        <p type="p">21:MFC</p>  
        <p type="p">22:閥</p>  
        <p type="p">23:噴嘴</p>  
        <p type="p">24(LA):供給孔</p>  
        <p type="p">24(LB):供給孔</p>  
        <p type="p">26:排氣口</p>  
        <p type="p">30:基板支撐件</p>  
        <p type="p">32:排氣管</p>  
        <p type="p">33:壓力感測器</p>  
        <p type="p">34:APC閥</p>  
        <p type="p">35:真空泵</p>  
        <p type="p">36:控制器</p>  
        <p type="p">37:輸入/輸出裝置</p>  
        <p type="p">38:外部記憶裝置</p>  
        <p type="p">EA:基板配置區域</p>  
        <p type="p">EB:基板非配置區域</p>  
        <p type="p">CA:中心軸</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1442" publication-number="202614288"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614288.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614288</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121883</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法，半導體裝置的製造方法，基板處理裝置及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/67</main-classification>  
        <further-classification edition="200601120251230B">C23C16/455</further-classification>  
        <further-classification edition="200601120251230B">C23C16/52</further-classification>  
        <further-classification edition="200601120251230B">H01L21/205</further-classification>  
        <further-classification edition="200601120251230B">G05D16/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商國際電氣股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有田春輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARITA, HARUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平野誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRANO, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題是在於提供一種抑制因熱分解的處理氣體導致的階梯覆蓋率的下降之技術。 &lt;br/&gt;　　其解決手段，具備： &lt;br/&gt;　　(a)將儲存部中儲存的處理氣體導入處理室之工序； &lt;br/&gt;　　(b)在開始將前述處理氣體導入到前述處理室之後，將前述處理室的排氣流路的傳導予以預定時間維持在非零的值之工序；及 &lt;br/&gt;　　(c)在前述預定時間經過後，將前述處理室的排氣流路的傳導最大化之工序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1443" publication-number="202613756"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613756.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613756</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121885</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>溫度控制方法、半導體裝置的製造方法、程式、控制器及處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G05D23/32</main-classification>  
        <further-classification edition="200601120251201B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商國際電氣股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉下雅士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGISHITA, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口英人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, HIDETO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>重松聖也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIGEMATSU, SEIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種具有以將依照預先保持的預測模型所算出的預測溫度行趨近於將來目標溫度行之方式來控制供給至加熱器的電力之工程的技術；該技術構成為：在將保持具及由保持具支承的基板插入爐內之後，以使前述爐內的溫度在一定時間不上升之方式，獲得前述將來目標溫度行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">36:上位控制器</p>  
        <p type="p">238:溫度控制部</p>  
        <p type="p">238a:預測控制部</p>  
        <p type="p">238b:PID控制部</p>  
        <p type="p">718:電力供給部</p>  
        <p type="p">800:溫度履歷記憶部</p>  
        <p type="p">802:電力供給值履歷記憶部</p>  
        <p type="p">804:個別特性作成部</p>  
        <p type="p">808:整合特性作成部</p>  
        <p type="p">810:受限最佳化計算部</p>  
        <p type="p">811:功率輸出決定部</p>  
        <p type="p">812:限制器</p>  
        <p type="p">870:目標溫度行算出部</p>  
        <p type="p">871:溫差算出部</p>  
        <p type="p">872:PID運算部</p>  
        <p type="p">F1,F2:輸入端</p>  
        <p type="p">S1,S2:輸入端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1444" publication-number="202613113"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613113.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613113</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121891</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吡唑類衍生物抑制劑、其製備方法和應用</chinese-title>  
        <english-title>PYRAZOLE DERIVATIVE INHIBITOR, PREPARATION METHOD THEREFOR AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D471/04</main-classification>  
        <further-classification edition="200601120260102B">C07D417/14</further-classification>  
        <further-classification edition="200601120260102B">C07D487/04</further-classification>  
        <further-classification edition="200601120260102B">C07D513/04</further-classification>  
        <further-classification edition="200601120260102B">A61K31/444</further-classification>  
        <further-classification edition="200601120260102B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260102B">A61K31/437</further-classification>  
        <further-classification edition="200601120260102B">A61K31/427</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4245</further-classification>  
        <further-classification edition="200601120260102B">A61K31/519</further-classification>  
        <further-classification edition="200601120260102B">A61K31/429</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4188</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4162</further-classification>  
        <further-classification edition="200601120260102B">A61P11/06</further-classification>  
        <further-classification edition="200601120260102B">A61P17/04</further-classification>  
        <further-classification edition="200601120260102B">A61P29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇光縣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, GUANGXIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王少寶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHAOBAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>修文華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIU, WENHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及吡唑類衍生物抑制劑、其製備方法和應用。特別地，本發明涉及式(I’)所示的化合物、其製備方法及含有該化合物的醫藥組成物，及其作為激酶抑制劑在治療自身免疫性疾病的用途，其中式(I’)中的各取代基與說明書中的定義相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a pyrazole derivative inhibitor, preparation method therefor and use thereof. In particular, the present invention relates to the compound represented by general formula (I’), a preparation method therefor, a pharmaceutical composition containing the compound, and a use thereof as a kinase inhibitor for the treatment of autoimmune diseases, wherein the substituents in the formula (I’) are the same as those in the description in definition.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1445" publication-number="202613641"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613641.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613641</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121900</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有兩組透鏡與反射鏡之混合式遠攝相機</chinese-title>  
        <english-title>2-GROUP LENS-ON-MIRROR HYBRID TELE CAMERA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G02B9/62</main-classification>  
        <further-classification edition="200601120251230B">G02B1/00</further-classification>  
        <further-classification edition="200601120251230B">G02B13/00</further-classification>  
        <further-classification edition="200601120251230B">G02B13/18</further-classification>  
        <further-classification edition="200601120251230B">G02B9/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商核心光電有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COREPHOTONICS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝勒　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHERER, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝梅什　齊夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEMESH, ZIV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種相機，包括具有N≥4個透鏡元件L&lt;sub&gt;i&lt;/sub&gt;的透鏡，其中該些透鏡元件分為兩組，第一透鏡組和第二透鏡組，該相機具有一有效焦距EFL，其中該第一透鏡元件L&lt;sub&gt;1&lt;/sub&gt;面向該相機的一物側，一光路折疊元件OPFE用於將一第一光路（OP1）折疊到一第二光路（OP2），以及一影像感測器，其中該相機被包括在具有沿該第一光路量測的高度（HM）的一相機模組中，該第一透鏡組位於該光路折疊元件的一物側；該第一透鏡組的高度是沿該第一光路量測；該第二透鏡組位於物側光路折疊元件的一像側，其中8毫米＜EFL＜50毫米。該相機是一折疊式相機，其中該些透鏡元件中的一個透鏡元件是一超穎透鏡，其他透鏡元件是折射的，超穎透鏡元件位於該第一透鏡組中，從而降低高度HM。相關的裝置和方法也被描述。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A camera including a lens with N ≥ 4 lens elements L&lt;sub&gt;i&lt;/sub&gt; where the lens elements are divided into two groups G1 and G2, the camera having an effective focal length EFL, where a first lens element L&lt;sub&gt;1&lt;/sub&gt; faces an object side of the camera, an optical path folding element OPFE for folding a first optical path (OP1) to a second optical path (OP2), and an image sensor, wherein the camera is included in a camera module having a height (HM) measured along OP1, G1 is located at an object side of the OPFE, a height of G1 is measured along OP1, G2 is located at an image side of the O-OPFE, 8mm＜EFL＜50mm, the camera is a folded camera, one of the lens elements is a metalens, the other lens elements are refractive, and the metalens element is in G1, thereby reducing HM. Related apparatus and methods are also described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">352:折射透鏡組</p>  
        <p type="p">353:混合式透鏡</p>  
        <p type="p">356:第二透鏡組</p>  
        <p type="p">357:第二光學折疊元件</p>  
        <p type="p">358:影像感測器</p>  
        <p type="p">MHs:肩部高度</p>  
        <p type="p">L&lt;sub&gt;M&lt;/sub&gt;:長度</p>  
        <p type="p">MH&lt;sub&gt;M&lt;/sub&gt;:相機模組高度</p>  
        <p type="p">T&lt;sub&gt;G1&lt;/sub&gt;:透鏡高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1446" publication-number="202613481"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613481.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613481</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121909</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於疊層金屬零件中之流徑之晶格及微管結構</chinese-title>  
        <english-title>LATTICE AND MICROCAPILLARY STRUCTURES FOR FLOW PATHS IN LAMINATED METAL PARTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">F28F3/08</main-classification>  
        <further-classification edition="202201120251231B">B01F25/442</further-classification>  
        <further-classification edition="202201120251231B">B01F25/431</further-classification>  
        <further-classification edition="202201120251231B">B01F35/00</further-classification>  
        <further-classification edition="200601120251231B">F28F3/04</further-classification>  
        <further-classification edition="201501220251231B">B33Y80/00</further-classification>  
        <further-classification edition="200601220251231B">F28F3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商雅洛伊企業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALLOY ENTERPRISES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西蒙　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMON, KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪爾曼　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIEHLMANN, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克爾森　萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KORSEN, RYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛拉赫堤　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLAHERTY, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧希爾　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUSSIER, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐葛科夫　艾雷克桑德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGARKOV, ALEKSANDR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧巴爾　艾力克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUNBAR, ALEX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於高效能熱交換器及冷板之方法及構形，一些熱交換器及冷板具有內部晶格結構及微管。一些實施例包含經由疊層物件製造方法進行製造，其包含圖案化複數個金屬片使得至少一個金屬片含有複數個空隙空間之至少一個空隙空間，各金屬片包括一自支撐層；組裝該複數個金屬片使得該複數個空隙空間形成至少一個通道；及接合該複數個經組裝金屬片以形成具有由該至少一個通道形成之至少一個流徑之一熱交換器，該熱交換器具有透過各經組裝金屬片連續地自支撐之一幾何形狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and configurations for high performance heat exchangers and cold plates, some with internal lattice structures and microcapillaries. Some embodiments include manufacture via laminated object manufacturing methods, which includes patterning a plurality of metal sheets so that at least one metal sheet contains at least one void space of a plurality of void spaces, each metal sheet comprising a self-supporting layer; assembling the plurality of metal sheets so that the plurality of void spaces forms at least one channel; and bonding the plurality of assembled metal sheets to form a heat exchanger with at least one flow path formed from the at least one channel, the heat exchanger having a geometry that is continuously self-supporting through each assembled metal sheet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1400:熱交換器</p>  
        <p type="p">1402:入口歧管</p>  
        <p type="p">1404:出口歧管</p>  
        <p type="p">1406:微管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1447" publication-number="202612643"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612643.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612643</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121943</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於檢測體液中的分析物之分析物感測器系統</chinese-title>  
        <english-title>ANALYTE SENSOR SYSTEM FOR DETECTING AN ANALYTE IN A BODILY FLUID</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">A61B5/145</main-classification>  
        <further-classification edition="200601120251230B">A61B5/1486</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商羅氏血糖健康醫護公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROCHE DIABETES CARE GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德克　法蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DECK, FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王淑靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林蘭君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種檢測體液中的至少一種分析物之分析物感測器系統 (114)、醫療裝置 (110) 以及製造分析物感測器系統 (114) 之方法，該分析物感測器系統 (114) 包含至少一個經皮分析物感測器 (116)，其具有：至少一個可撓性基板 (118)；設置在該可撓性基板 (118) 上的至少兩個感測器電極 (120)；以及具有至少兩個感測器電極接觸墊 (124)的至少一個接觸部分 (122)，該等感測器電極接觸墊 (124) 各自電連接到至少一個對應的感測器電極 (120)；該分析物感測器系統 (114) 進一步包含至少一個電子單元 (126)，其包含具有接觸表面 (128) 的至少一個基板 (127)，該電子單元 (126) 包含設置在該接觸表面 (128) 上的至少兩個電子單元接觸墊 (124)；且該分析物感測器系統 (114) 進一步包含至少一個導電彈性體元件 (132)，其中該經皮分析物感測器 (116) 之該等電極係基本上平行於該電子單元 (126) 之該接觸表面 (128) 定向，其中該經皮分析物感測器 (116) 之該接觸部分 (122) 至少部分地設置在該導電彈性體元件 (132) 與該電子單元 (126) 之該接觸表面 (128) 之間，其中該導電彈性體元件 (132) 施加壓力至該接觸部分 (122) 上，藉此將該經皮分析物感測器 (116) 之至少一個第一電極接觸墊 (134) 朝向該電子單元 (126) 之至少一個第一電子單元接觸墊 (138) 按壓，藉此使該第一電極接觸墊 (134) 與該第一電子單元接觸墊 (138) 電連接，該至少一個第一電極接觸墊位於該可撓性基板 (118) 的面向該電子單元 (126) 之該接觸表面 (128) 之正面 (136) 上，其中該導電彈性體元件 (132) 與該經皮分析物感測器 (116) 之至少一個第二電極接觸墊 (140) 電接觸，該至少一個第二電極接觸墊位於該可撓性基板 (118) 的背離該電子單元 (126) 之該接觸表面 (128) 之反面 (142) 上，且其中該導電彈性體元件 (132) 與以從該第一電子單元接觸墊 (138) 橫向偏移之方式設置在該接觸表面 (128) 上的至少一個第二電子單元接觸墊 (144) 電接觸，藉此使該第二電極接觸墊 (140) 與該第二電子單元接觸墊 (144) 電連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An analyte sensor system (114), a medical device (110), and a method for manufacturing an analyte sensor system (114) for detecting at least one analyte in a bodily fluid, the analyte sensor system (114) comprising at least one transcutaneous analyte sensor (116) having at least one flexible substrate (118); at least two sensor electrodes (120) disposed on the flexible substrate (118); and at least one contacting portion (122) having at least two sensor electrode contact pads (124) the sensor electrode contact pads (124) each being electrically connected to at least one corresponding sensor electrode (120); the analyte sensor system (114) further comprising at least one electronics unit (126) comprising at least one substrate (127) having a contacting surface (128), the electronics unit (126) comprising at least two electronics unit contact pads (124) disposed on the contacting surface (128); and the analyte sensor system (114) further comprising at least one electrically conductive elastomeric element (132), wherein the electrodes of the transcutaneous analyte sensor (116) are oriented essentially parallel to the contacting surface (128) of the electronics unit (126), wherein the contacting portion (122) of the transcutaneous analyte sensor (116) is at least partially disposed in between the electrically conductive elastomeric element (132) and the contacting surface (128) of the electronics unit (126), wherein the electrically conductive elastomeric element (132) exerts a pressure onto the contacting portion (122), thereby pressing at least one first electrode contact pad (134) of the transcutaneous analyte sensor (116) on a front side (136) of the flexible substrate (118) facing the contacting surface (128) of the electronics unit (126) towards at least one first electronics unit contact pad (138) of the electronics unit (126), thereby electrically connecting the first electrode contact pad (134) and the first electronics unit contact pad (138), wherein the electrically conductive elastomeric element (132) electrically contacts at least one second electrode contact pad (140) of the transcutaneous analyte sensor (116) on a reverse side (142) of the flexible substrate (118) facing away from the contacting surface (128) of the electronics unit (126), and wherein the electrically conductive elastomeric element (132) electrically contacts at least one second electronics unit contact pad (144) disposed on the contacting surface (128) in a laterally offset manner from the first electronics unit contact pad (138), thereby electrically connecting the second electrode contact pad (140) and the second electronics unit contact pad (144).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:醫療裝置</p>  
        <p type="p">112:插入針</p>  
        <p type="p">114:分析物感測器系統</p>  
        <p type="p">115:可插入部分</p>  
        <p type="p">116:經皮分析物感測器</p>  
        <p type="p">118:可撓性基板</p>  
        <p type="p">120:感測器電極</p>  
        <p type="p">122:接觸部分</p>  
        <p type="p">124:感測器電極接觸墊</p>  
        <p type="p">126:電子單元</p>  
        <p type="p">127:基板</p>  
        <p type="p">128:接觸表面</p>  
        <p type="p">130:電子單元接觸墊</p>  
        <p type="p">132:導電彈性體元件</p>  
        <p type="p">134:第一電極接觸墊</p>  
        <p type="p">136:正面</p>  
        <p type="p">138:第一電子單元接觸墊</p>  
        <p type="p">140:第二電極接觸墊</p>  
        <p type="p">142:反面</p>  
        <p type="p">144:第二電子單元接觸墊</p>  
        <p type="p">148:夾持元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1448" publication-number="202612797"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612797.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612797</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121949</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>  
        <english-title>SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251008B">B08B3/04</main-classification>  
        <further-classification edition="200601120251008B">F26B5/16</further-classification>  
        <further-classification edition="200601120251008B">H01L21/683</further-classification>  
        <further-classification edition="200601120251008B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷川紘太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIKAWA, KOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之基板處理方法包含：於清洗液與基板之正面相接之狀態下，對基板之正面供給包含帶有與相接於清洗液之基板之正面之極性相反極性之電性之第1聚合物離子的第1聚合物液，藉此於基板之正面形成包含吸附於基板之正面之第1聚合物的第1吸附膜；及於一面將第1吸附膜保留於基板之正面，一面自基板之正面去除第1聚合物液後，對基板之正面供給包含帶有與第1聚合物離子相反極性之電性之第2聚合物離子的第2聚合物液，藉此於基板之正面形成包含吸附於第1吸附膜之第2聚合物的第2吸附膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理裝置</p>  
        <p type="p">2:處理腔室</p>  
        <p type="p">2w:濕處理腔室</p>  
        <p type="p">3:控制部</p>  
        <p type="p">4:腔室</p>  
        <p type="p">5:隔板</p>  
        <p type="p">5a:送風口</p>  
        <p type="p">5b:通過口</p>  
        <p type="p">6:門</p>  
        <p type="p">7:風扇過濾單元</p>  
        <p type="p">8:排氣管道</p>  
        <p type="p">9:排氣閥</p>  
        <p type="p">10:旋轉夾盤</p>  
        <p type="p">11:夾盤銷</p>  
        <p type="p">12:旋轉基底</p>  
        <p type="p">12u:上表面</p>  
        <p type="p">13:旋轉馬達</p>  
        <p type="p">21:處理杯</p>  
        <p type="p">22:筒狀外壁</p>  
        <p type="p">23:杯</p>  
        <p type="p">24:保護件</p>  
        <p type="p">24u:上端</p>  
        <p type="p">25:圓筒部</p>  
        <p type="p">26:頂部</p>  
        <p type="p">27:升降致動器</p>  
        <p type="p">31a:第1藥液噴嘴</p>  
        <p type="p">31b:第1清洗液噴嘴</p>  
        <p type="p">31c:第2藥液噴嘴</p>  
        <p type="p">31d:第2清洗液噴嘴</p>  
        <p type="p">31e:第1聚合物液噴嘴</p>  
        <p type="p">31f:第2聚合物液噴嘴</p>  
        <p type="p">31g:第3清洗液噴嘴</p>  
        <p type="p">31h:下表面噴嘴</p>  
        <p type="p">31i:中央開口</p>  
        <p type="p">32a:第1藥液配管</p>  
        <p type="p">32b:第1清洗液配管</p>  
        <p type="p">32c:第2藥液配管</p>  
        <p type="p">32d:第2清洗液配管</p>  
        <p type="p">32e:第1聚合物液配管</p>  
        <p type="p">32f:第2聚合物液配管</p>  
        <p type="p">32g:清洗液配管</p>  
        <p type="p">32h:清洗液配管</p>  
        <p type="p">32i:惰性氣體配管</p>  
        <p type="p">33a:第1藥液閥</p>  
        <p type="p">33b:第1清洗液閥</p>  
        <p type="p">33c:第2藥液閥</p>  
        <p type="p">33d:第2清潔液閥</p>  
        <p type="p">33e:第1聚合物液閥</p>  
        <p type="p">33f:第2聚合物液閥</p>  
        <p type="p">33g:清洗液閥</p>  
        <p type="p">33h:清洗液閥</p>  
        <p type="p">33i:惰性氣體閥</p>  
        <p type="p">34a:第1噴嘴臂</p>  
        <p type="p">34b:第2噴嘴臂</p>  
        <p type="p">34c:第3噴嘴臂</p>  
        <p type="p">35a:第1噴嘴致動器</p>  
        <p type="p">35b:第2噴嘴致動器</p>  
        <p type="p">35c:第3噴嘴致動器</p>  
        <p type="p">A1:旋轉軸線</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1449" publication-number="202613279"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613279.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613279</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121960</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>量子點、波長變換構件、背光單元、圖像顯示裝置及量子點之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">C09K11/88</main-classification>  
        <further-classification edition="200601120251231B">C01B19/04</further-classification>  
        <further-classification edition="200601120251231B">G02B5/20</further-classification>  
        <further-classification edition="202501120251231B">H10H20/851</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青木伸司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野島義弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOJIMA, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鳶島一也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOBISHIMA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係包含第I-III-VI族半導體奈米結晶核心，以及具備至少接觸前述第I-III-VI族半導體奈米結晶核心的第1殼體之覆蓋前述第I-III-VI族半導體奈米結晶核心的單一或複數之半導體奈米結晶殼體的核心殼體型量子點中，滿足根據有效質量近似法估算的束縛條件之前述量子點中的激發電子能階，在前述第I-III-VI族半導體奈米結晶核心的傳導帶下端與接觸前述第I-III-VI族半導體奈米結晶核心的第1殼體的傳導帶下端之間為1個為特徵的量子點。由此，可以提供光穩定性提高的量子點及其製造方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第I-III-VI族半導體奈米結晶核心</p>  
        <p type="p">2:半導體奈米結晶殼層</p>  
        <p type="p">2A:第1殼層</p>  
        <p type="p">2B:半導體奈米結晶殼層</p>  
        <p type="p">10:量子點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1450" publication-number="202614289"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614289.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614289</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121973</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顆粒去除方法及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/67</main-classification>  
        <further-classification edition="200601120251226B">B01D43/00</further-classification>  
        <further-classification edition="202201120251226B">B01F23/2373</further-classification>  
        <further-classification edition="200601120251226B">B08B3/04</further-classification>  
        <further-classification edition="200601120251226B">B03D1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>脇田明日香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKITA, ASUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可自處理液中有效去除顆粒之顆粒去除方法及基板處理裝置。顆粒去除方法去除處理基板之處理液中之顆粒。該方法包含如下之步驟：於處理液流路中流通處理液；對處理液流路中流通之處理液供給微細氣泡；使處理液流路中流通之處理液中之顆粒，於處理液流路內附著於微細氣泡上；及將附著有顆粒之微細氣泡自處理液流路中流通之處理液分離並捕集。處理液流路亦可具備具有彎曲部之配管。該情形時，捕集步驟亦可捕集被引導至於彎曲部之接線方向上自配管分支之分支流路之微細氣泡。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S6:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1451" publication-number="202613175"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613175.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613175</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121975</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>CDH3結合蛋白及其用途</chinese-title>  
        <english-title>CDH3 BINDING PROTEIN AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/28</main-classification>  
        <further-classification edition="200601120260102B">C07K16/30</further-classification>  
        <further-classification edition="200601120260102B">C12N15/13</further-classification>  
        <further-classification edition="200601120260102B">C12N15/63</further-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="201701120260102B">A61K47/68</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification>  
        <further-classification edition="200601120260102B">G01N33/68</further-classification>  
        <further-classification edition="200601120260102B">G01N33/574</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商四川科倫博泰生物醫藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SICHUAN KELUN-BIOTECH BIOPHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田　海軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, HAIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　虹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　揚德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YANGDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉漢杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HANJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉瀟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, XIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LONG, HU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚淼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, MIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚　向陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, XIANGYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛均友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, JUNYOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示係關於疾病治療領域，且特定言之，係關於抗CDH3抗體或其抗原結合片段、編碼其之核酸分子及製備其之方法。本揭示之抗CDH3抗體或其抗原結合片段對CDH3具有高親和力結合及胞吞活性，同時展現高特異性。本揭示進一步係關於該抗體或其抗原結合片段用於治療及診斷疾病之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates to the field of disease treatment, and in particular, to an anti-CDH3 antibody or an antigen-binding fragment thereof, a nucleic acid molecule encoding the same and a method for preparing the same. The anti-CDH3 antibody or the antigen-binding fragment thereof of the disclosure has high affinity binding and endocytosis activities for CDH3, while exhibiting high specificity. The disclosure further relates to the use of the antibody or the antigen-binding fragment thereof in the treatment and diagnosis of diseases.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1452" publication-number="202614002"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614002.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614002</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114121985</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄膜電晶體基板的製造方法及薄膜電晶體基板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G09F9/00</main-classification>  
        <further-classification edition="202501120251230B">H10D30/67</further-classification>  
        <further-classification edition="202501120251230B">H10D86/60</further-classification>  
        <further-classification edition="200601120251230B">G09F9/30</further-classification>  
        <further-classification edition="200601120251230B">G02F1/1368</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林直人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, NAOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的薄膜電晶體基板的製造方法係含有下述工序：在基板(11)上，形成橫跨預定在製造後進行切斷的剖切面並且作為短路環發揮功能的第1導電層(12)之工序；在前述第1導電層(12)上及未形成有前述第1導電層(12)的前述基板(11)上形成第1絕緣層(13)，在形成於前述第1導電層(12)上的前述第1絕緣層(13)中，在從前述剖切面朝相反的兩個方向分別相隔一定距離以上之處形成接觸孔(CH)，並且在橫跨前述剖切面的前述第1導電層(12)的一部分的至少上方形成前述第1絕緣層(13)的開口部(13H)之工序；在前述第1絕緣層(13)上形成第2導電層(14或16)之工序，該第2導電層(14或16)之工序透過前述接觸孔(CH)而與前述第1導電層(12)導通，且橫跨前述剖切面並且作為不同於前述短路環的別的短路環發揮功能；將位於前述開口部(13H)下方的前述第1導電層(12)的一部分去除之工序；及形成至少將藉由前述去除而開放的空間(13S)填埋的第2絕緣層(15或18)之工序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:第1導電層</p>  
        <p type="p">13:第1絕緣層</p>  
        <p type="p">13S:空間</p>  
        <p type="p">14:第2導電層</p>  
        <p type="p">14C:接觸部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1453" publication-number="202614778"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614778.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614778</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122011</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁性記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120250924B">H10B61/00</main-classification>  
        <further-classification edition="202301120250924B">H10N50/10</further-classification>  
        <further-classification edition="202301120250924B">H10N50/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上牟田雄一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIMUTA, YUUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠確實地形成磁阻效應元件之磁性記憶裝置。 &lt;br/&gt;實施方式之磁性記憶裝置具備：磁阻效應元件，其包含具有可變磁化方向之第1磁性層、具有固定磁化方向之第2磁性層、以及設置於第1磁性層與第2磁性層之間之非磁性層，且具有將第1磁性層、第2磁性層及非磁性層積層之構造；電極，其具有連接於磁阻效應元件之下表面之上表面；及第1絕緣層，其包圍電極之側面，於較電極之上表面之位置為低之位置具有上表面，且由兩性氧化物形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:配線</p>  
        <p type="p">30:記憶胞</p>  
        <p type="p">40:磁阻效應元件</p>  
        <p type="p">41:磁阻效應元件本體</p>  
        <p type="p">42:下部電極</p>  
        <p type="p">43:上部電極</p>  
        <p type="p">50:選擇器</p>  
        <p type="p">51:選擇器材料層(開關材料層)</p>  
        <p type="p">52:下部電極</p>  
        <p type="p">53:上部電極</p>  
        <p type="p">53a:電極部分(第1電極部分)</p>  
        <p type="p">53b:電極部分(第2電極部分)</p>  
        <p type="p">60:絕緣區域</p>  
        <p type="p">61:絕緣層(第1絕緣層)</p>  
        <p type="p">62:絕緣層</p>  
        <p type="p">63:絕緣層</p>  
        <p type="p">65:絕緣層(第2絕緣層)</p>  
        <p type="p">X:方向</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1454" publication-number="202613264"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613264.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613264</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122013</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著帶</chinese-title>  
        <english-title>PRESSURE-SENSITIVE ADHESIVE TAPE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251220B">C09J7/20</main-classification>  
        <further-classification edition="200601120251220B">C09J201/00</further-classification>  
        <further-classification edition="200601120251220B">C09J11/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千葉瑞穗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIBA, MIZUHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溝端香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZOBATA, KAORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種具有優異之黏著力且能夠兼顧對被黏著體之密接性與剝離性之黏著帶。 &lt;br/&gt;本發明之實施方式之黏著帶具備基材、及包含活性能量線硬化型黏著劑之黏著劑層，活性能量線照射後之該黏著劑層之表面於使用原子力顯微鏡所得之儲存彈性模數映射圖像中具有微相分離結構，上述微相分離結構包含島部、及具有超過該島部之儲存彈性模數之儲存彈性模數之海部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a pressure-sensitive adhesive tape that has an excellent pressure-sensitive adhesive strength, and that can achieve both of adhesiveness to an adherend and peelability. The pressure-sensitive adhesive tape includes a base material; and a pressure-sensitive adhesive layer formed of an active energy ray-curable pressure-sensitive adhesive. A surface of the pressure-sensitive adhesive layer after active energy ray irradiation has a microphase-separated structure including an island portion and a sea portion having a storage elastic modulus higher than a storage elastic modulus of the island portion, in a storage elastic modulus mapping image obtained with an atomic force microscope.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1455" publication-number="202613711"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613711.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613711</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122029</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光罩檢測裝置與用於調整光罩檢測裝置的方法</chinese-title>  
        <english-title>MASK INSPECTION DEVICE AND METHOD FOR ADJUSTING A MASK INSPECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120260102B">G03F1/84</main-classification>  
        <further-classification edition="200601120260102B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波赫舒瑙　言斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROCHNAU, JENS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黑格爾　托比亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEGELE, TOBIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光罩檢測裝置，包含一真空殼體(28)，一EUV相機(23)與配置於該真空殼體(28)之內部的一投影透鏡(22)，用於將一EUV光罩(17)的至少一部份成像至該EUV相機(23)一影像感測器(24)上。該EUV相機(23)安裝在該真空殼體(28)上。該EUV相機(23)的位置可透過一調整機構(33)在相對於該真空殼體(28)的一第一位置與一第二位置之間進行調整。本發明也有關於一種用於調整一光罩檢測裝置的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Mask inspection device, comprising a vacuum housing (28), an EUV camera (23) and, arranged in the interior of the vacuum housing (28), a projection lens (22) for imaging at least one portion (20) of an EUV photomask (17) onto an image sensor (24) of the EUV camera (23). The EUV camera (23) is mounted on the vacuum housing (28). The position of the EUV camera (23) is adjustable between a first position and a second position relative to the vacuum housing (28) by means of an adjusting mechanism (33). The invention also relates to a method for adjusting a mask inspection device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">23:EUV相機</p>  
        <p type="p">24:影像感測器</p>  
        <p type="p">25:相機殼體</p>  
        <p type="p">28:真空殼體</p>  
        <p type="p">33:調整機構</p>  
        <p type="p">34:上端板</p>  
        <p type="p">35:下端板</p>  
        <p type="p">36:致動器</p>  
        <p type="p">37:波紋管(可撓性壁段)</p>  
        <p type="p">48:Z方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1456" publication-number="202612683"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612683.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612683</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122048</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>周轉促進劑及其用途</chinese-title>  
        <english-title>TURNOVER PROMOTER AND ITS USE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K8/365</main-classification>  
        <further-classification edition="200601120260102B">A61P19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大阪瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSAKA GAS CHEMICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菱谷梨江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HISHITANI, RIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木仁美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, HITOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種可促進表皮的周轉之周轉促進劑。 &lt;br/&gt;調製表皮的周轉促進劑，其係含有選自3-羥基丁酸、3-羥基丁酸之鹽及下式(1)所示之3-羥基丁酸烷酯中之至少一種3-羥基丁酸成分。 &lt;br/&gt;&lt;img align="absmiddle" height="72px" width="245px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，R表示烷基) &lt;br/&gt;前述周轉促進劑可進一步含有美白劑。前述美白劑可含有酪胺酸酶抑制劑及/或黑色素輸送抑制劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a turnover promoter capable of promoting turnover of the epidermis. &lt;br/&gt;An epidermal turnover promoter containing at least one 3-hydroxybutyric acid component selected from a 3-hydroxybutyric acid, a salt of 3-hydroxybutyric acid, and a 3-hydroxybutyric acid alkyl ester represented by the following formula (1) is prepared. The turnover promoter may further contain a whitening agent. The whitening agent may contain a tyrosinase inhibitor and/or a melanin transport inhibitor. &lt;br/&gt;&lt;img align="absmiddle" height="60px" width="229px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(wherein R represents an alkyl group)</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1457" publication-number="202612687"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612687.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612687</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122057</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於先前以GLP-1　RA治療後之維持減輕的體重或降低的HbA1c水平之GLP-1　NPA療法</chinese-title>  
        <english-title>GLP-1 NPA THERAPIES FOR MAINTAINING BODY WEIGHT LOSS OR REDUCED HBA1C LEVELS FOLLOWING A PRIOR GLP-1 RA TREATMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/437</main-classification>  
        <further-classification edition="200601120260102B">A61P3/04</further-classification>  
        <further-classification edition="200601120260102B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美國禮來大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELI LILLY AND COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布魯沃斯　布蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROUWERS, BRAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加佩林　巴迪姆　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GALPERIN, VADIM MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛蘭特　凱倫　芮妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRANT, KAREN RENEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　克萊爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CLARE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬小蘇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, XIAOSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏維爾　妮娜　阿賈瓦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XAVIER, NEENA AGARWAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示使用選自化合物1、化合物1a、化合物2、化合物3的升糖素樣肽-1 (GLP-1)受體非肽激動劑(NPA)化合物、其醫藥上可接受之鹽以及該等化合物及醫藥上可接受之鹽之水合物藉由口服投與治療患有T2DM、肥胖症或過重伴至少一種體重相關共病之個體之方法，其用以維持先前使用GLP-1 RA治療產生之減輕的體重或降低的HbA1c水平。本文亦揭示GLP-1受體NPA化合物用以製造藥劑之用途，該藥劑用於治療患有T2DM、肥胖症或過重伴至少一種體重相關共病之個體以維持先前使用GLP-1 RA治療產生之減輕的體重或降低的HbA1c水平。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are methods for treating a subject with T2DM, obesity, or overweight with at least one weight related comorbidity using a glucagon-like peptide-1 (GLP-1) receptor non-peptide agonist (NPA) compound selected from Compound 1, Compound 1a, Compound 2, Compound 3, pharmaceutically acceptable salts thereof, and hydrates of the compounds and pharmaceutically acceptable salts, by oral administration to maintain body weight loss or reduced HbA1c levels resulting from a prior treatment with a GLP-1 RA. Also disclosed herein are uses of a GLP-1 receptor NPA compound for the manufacture of a medicament for treating a subject with T2DM, obesity, or overweight with at least one weight related comorbidity to maintain body weight loss or reduced HbA1c levels resulting from a prior treatment with a GLP-1 RA.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1458" publication-number="202613974"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613974.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613974</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122058</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>學習支援裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120250701B">G06V10/77</main-classification>  
        <further-classification edition="201901120250701B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東雄大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AZUMA, YUDAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川昌義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, MASAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福田光佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新藤博之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINDO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>深谷郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKAYA, KAORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於，在關注微小檢測區域的同時，學習可分離的特徵表現，並支援以少量的教師資訊來作成圖像分類模型。本發明之學習支援裝置，作成檢查對象物是否具有異常之檢測區域圖像的集合，並以使同一前述檢測區域之間的相似度變高之方式更新特徵量提取模型，同時以使包含相異之前述檢測區域之兩個圖像區域之間的相似度變低之方式更新前述特徵量提取模型(參照圖1)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:學習支援裝置</p>  
        <p type="p">101:學習用圖像數據</p>  
        <p type="p">102:檢測區域座標數據</p>  
        <p type="p">103:檢測區域圖像作成部</p>  
        <p type="p">104:圖像相似度算出部</p>  
        <p type="p">105:圖像分布顯示部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1459" publication-number="202614031"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614031.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614031</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122059</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">G09G3/36</main-classification>  
        <further-classification edition="200601120251219B">G09G3/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平形吉晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAKATA, YOSHIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三宅博之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAKE, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上聖子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, SEIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎舜平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, SHUNPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一個方式是提供一種降低了耗電量的顯示裝置。另外，本發明的一個方式可以提供一種在折疊狀態下能夠使用的區域中顯示影像的顯示裝置。構想出的顯示裝置包括能夠展開以及折疊的顯示部、檢測上述折疊狀態的檢測部、當顯示部為折疊狀態時生成在顯示部的一部分中顯示黑影像的影像的影像處理部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device with low power consumption is provided. Furthermore, a display device in which an image is displayed in a region that can be used in a folded state is provided. The conceived display device includes a display portion that can be opened and folded, a sensing portion that senses a folded state of the display portion, and an image processing portion that generates, when the display portion is in the folded state, an image in which a black image is displayed in part of the display portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:顯示裝置</p>  
        <p type="p">210:控制部</p>  
        <p type="p">212:同步信號供應部</p>  
        <p type="p">214:電源部</p>  
        <p type="p">220:影像處理部</p>  
        <p type="p">230:顯示部</p>  
        <p type="p">230(1):第一區域</p>  
        <p type="p">230(2):第二區域</p>  
        <p type="p">230b(1):邊界</p>  
        <p type="p">230b(2):邊界</p>  
        <p type="p">232:驅動電路</p>  
        <p type="p">232G:掃描線驅動電路</p>  
        <p type="p">232S:信號線驅動電路</p>  
        <p type="p">239:標記</p>  
        <p type="p">240:檢測部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1460" publication-number="202613770"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613770.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613770</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122060</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G06F1/16</main-classification>  
        <further-classification edition="200601120260102B">G06F1/26</further-classification>  
        <further-classification edition="201801120260102B">G06F9/00</further-classification>  
        <further-classification edition="202501120260102B">H10D30/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎舜平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, SHUNPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種新穎結構的電子裝置。在電子裝置的每一個構件中設置電池，使電子裝置具有兩個電池。實現具有兩個電池並具有能夠被稱為撓性顯示器的顯示部的新穎的電子裝置，該電子裝置的顯示部具有多個可折疊部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device having a novel structure is provided. A battery is provided in each component of an electronic device, whereby the electronic device includes two batteries. The electronic device including the two batteries and a display portion that can be called a flexible display and has a plurality of foldable portions is provided as a novel device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">112:電池</p>  
        <p type="p">116d,116e:可彎曲部</p>  
        <p type="p">125:系統部</p>  
        <p type="p">753:電池</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1461" publication-number="202614722"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614722.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614722</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122062</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷卻櫃</chinese-title>  
        <english-title>COOLING CABINET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250630B">H05K7/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光寶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾品喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, PIN-CHIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳文吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEN-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>冒淑華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAU, SHU-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">冷卻櫃包括機架模組、冷卻模組及幫浦模組。機架模組包括底板及卡合件，卡合件固定於底板。冷卻模組配置在機架模組內。幫浦模組配置在機架模組內，且可選擇性地連接或脫離冷卻模組，且包括滑板、容納殼、幫浦、逆變器及把手。滑板可滑動地連接於底板。幫浦配置在滑板上。逆變器電性連接幫浦且配置在容納殼內。把手樞接容納殼且包括限位端。當幫浦模組連接於冷卻模組時，把手之限位端與卡合件干涉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cooling cabinet includes a rack module, a cooling module and a pump module. The rack module includes a bottom plate and an engaging portion, wherein the engaging component is fixed to the bottom plate. The cooling module is disposed on the rack module. The pump module is disposed on the rack module and is selectively connected to or disconnected from the cooling module, and includes a slide plate, a containing shell, a pump, an inverter and a handle. The slide plate is slidably connected to the bottom plate. The pump is disposed on the slide plate. The inverter is electrically connected to the pump and is disposed on the containing shell. The handle is pivotally connected to the containing shell and includes a limiting end. When the pump module is connected to the cooling module, the limiting end of the handle interferes with the engaging component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1051A:第一底板</p>  
        <p type="p">1051Aa:孔洞</p>  
        <p type="p">1052A:第一卡合件</p>  
        <p type="p">1052As:第二抵壓曲面</p>  
        <p type="p">1053:板件</p>  
        <p type="p">110:幫浦模組</p>  
        <p type="p">111A:第一滑板</p>  
        <p type="p">113A:第一幫浦</p>  
        <p type="p">115A:第一把手</p>  
        <p type="p">115A1:第一限位端</p>  
        <p type="p">115A1s:第一抵壓曲面</p>  
        <p type="p">116A:第一連接器</p>  
        <p type="p">117A:第一固定件</p>  
        <p type="p">120:冷卻模組</p>  
        <p type="p">120C:連接器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1462" publication-number="202612975"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612975.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612975</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122065</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人力驅動車用變速系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251229B">B62M9/126</main-classification>  
        <further-classification edition="200601120251229B">B62M11/06</further-classification>  
        <further-classification edition="200601120251229B">B62M25/08</further-classification>  
        <further-classification edition="201001120251229B">B62M6/50</further-classification>  
        <further-classification edition="201001120251229B">B62M6/55</further-classification>  
        <further-classification edition="201001120251229B">B62M9/122</further-classification>  
        <further-classification edition="201001120251229B">B62M9/132</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江村篤裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATSUHIRO, EMURA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝花聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAHANA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水谷祐太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUTANI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小坂憲太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSAKA, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白井豊土</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAI, TOYOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種可適切地使用之人力驅動車用變速系統。&lt;br/&gt;人力驅動車用變速系統係一種變速系統，其具備：曲柄臂；至少1個前鏈輪，其包含與人力驅動車用鏈條扣合之複數個鏈輪齒；前離合器機構；及馬達，其包含輸出軸，對上述至少1個前鏈輪賦予旋轉力；且藉由上述前離合器機構，上述至少1個前鏈輪構成為相對於上述曲柄臂可相對旋轉，且上述曲柄臂具有供上述馬達配置之馬達配置部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:人力驅動車用車架</p>  
        <p type="p">20:變速系統</p>  
        <p type="p">22:曲柄臂</p>  
        <p type="p">22A:馬達配置部</p>  
        <p type="p">22B:凹部</p>  
        <p type="p">24:前鏈輪</p>  
        <p type="p">24A:鏈輪齒</p>  
        <p type="p">26:前離合器機構</p>  
        <p type="p">26A:第1部分</p>  
        <p type="p">26B:第2部分</p>  
        <p type="p">26F:傳遞部</p>  
        <p type="p">26G:滾動體</p>  
        <p type="p">28:馬達</p>  
        <p type="p">28A:輸出軸</p>  
        <p type="p">34:曲柄軸</p>  
        <p type="p">38:殼體</p>  
        <p type="p">40:減速機構</p>  
        <p type="p">42:踏頻感測器</p>  
        <p type="p">44A:無線單元</p>  
        <p type="p">46:指示器</p>  
        <p type="p">50:電池</p>  
        <p type="p">50A:電池元件</p>  
        <p type="p">51:充電口</p>  
        <p type="p">54:控制部</p>  
        <p type="p">A1:輸出軸方向</p>  
        <p type="p">A2:軸向</p>  
        <p type="p">C1:旋轉中心軸心</p>  
        <p type="p">L1:最大長度</p>  
        <p type="p">L2:直徑</p>  
        <p type="p">L3:最大長度</p>  
        <p type="p">M:磁鐵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1463" publication-number="202613665"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613665.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613665</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122071</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>相機致動器及包括其之相機模組</chinese-title>  
        <english-title>CAMERA ACTUATOR AND CAMERA MODULE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">G02B27/64</main-classification>  
        <further-classification edition="202301120251216B">H04N23/68</further-classification>  
        <further-classification edition="202101120251216B">G03B30/00</further-classification>  
        <further-classification edition="200601120251216B">H02K33/18</further-classification>  
        <further-classification edition="200601120251216B">G02B26/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奉相勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BONG, SANG HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋倫祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, YUN SANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種相機致動器，包含：一外殼；一鏡頭組件，用於接收入射光線，該鏡頭組件包含一鏡頭與一棱鏡；一動子，用於固定該鏡頭組件； 及一傾斜導引單元，與該動子接觸，其中該傾斜導引單元包含與該動子接觸的一第一凸出部，該第一凸出部包含一第一凸起與一第二凸起，兩者於一第一方向上相互分離，及一延伸線，連接並貫穿該第一凸起與該第二凸起，與該鏡頭的一光軸重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An embodiment discloses a camera actuator including: a housing; a lens assembly on which light is incident and which includes a lens and a prism; a mover configured to fix the lens assembly; and a tilting guide unit in contact with the mover, wherein the tilting guide unit includes a first protruding portion that is in contact with the mover, the first protruding portion includes a first protrusion and a second protrusion that are spaced apart from each other in a first direction, and an extension line connecting and passing through the first protrusion and the second protrusion overlaps an optical axis of the lens.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1100:第一相機致動器</p>  
        <p type="p">1200:第二相機致動器</p>  
        <p type="p">1300:電路板</p>  
        <p type="p">CV:蓋板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1464" publication-number="202613378"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613378.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613378</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122098</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以熱塑性彈性體為基之織物</chinese-title>  
        <english-title>THERMOPLASTIC ELASTOMER-BASED FABRIC</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">D04B1/12</main-classification>  
        <further-classification edition="200601120251230B">B32B5/14</further-classification>  
        <further-classification edition="200601120251230B">B32B27/08</further-classification>  
        <further-classification edition="200601120251230B">B32B27/28</further-classification>  
        <further-classification edition="200601120251230B">B32B5/08</further-classification>  
        <further-classification edition="200601120251230B">D04B1/24</further-classification>  
        <further-classification edition="201801120251230B">A41D1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商瑟蘭斯聚合物控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CELANESE POLYMERS HOLDING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科維利　卡門　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COVELLI, CARMEN A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示以熱塑性彈性體為基之連續織物。該織物包括第一織物部分及第二織物部分。該第一織物部分包括複數根包括含有纖維形成材料之第一纖維及含有熱塑性彈性體之第二纖維的纖維，其中該纖維形成材料具有高於該熱塑性彈性體之熔融溫度的熔融溫度或降解溫度。該第二織物部分包括自該第一織物部分延伸之該第一纖維，其中該第一纖維至少部分地塗覆有存在於該第二織物部分中之該熱塑性彈性體。該第二織物部分具有比該第一織物部分更高之拉伸模數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A continuous thermoplastic elastomer-based fabric is disclosed. The fabric comprises a first fabric section and a second fabric section. The first fabric section comprises a plurality of fibers comprising a first fiber comprising a fiber forming material and a second fiber comprising a thermoplastic elastomer wherein the fiber forming material has a melting temperature or a degradation temperature higher than a melting temperature of the thermoplastic elastomer. The second fabric section comprises the first fiber extending from the first fabric section wherein the first fiber is at least partially coated with the thermoplastic elastomer present in the second fabric section. The second fabric section has a higher tensile modulus than the first fabric section.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1465" publication-number="202612971"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612971.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612971</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122142</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>踏板推進式交通工具驅動系統</chinese-title>  
        <english-title>PEDALLY PROPELLED VEHICLE DRIVE SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251230B">B62M6/55</main-classification>  
        <further-classification edition="200601120251230B">B62M11/00</further-classification>  
        <further-classification edition="201001120251230B">B62M6/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>挪威商蒙特投資３０公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONT INVEST 30 AS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NO</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>約斯內　克努特托雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LJOSNE, KNUT TORE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NO</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種踏板推進式交通工具驅動系統(1)及一種用於在此類系統中換擋之方法，其中該系統包括： &lt;br/&gt;一曲柄軸(3) &lt;br/&gt;一齒輪系統(8)，其具有多個可選擇齒輪比，其中，該齒輪系統具有一齒輪輸入軸(8a)及一齒輪輸出軸(8b)，且經組態以在一輸入扭矩方向上之一輸入扭矩存在於該齒輪輸入軸(8a)上時將一輸出扭矩方向上之一輸出扭矩提供於該齒輪輸出軸(8b)上； &lt;br/&gt;一電動馬達系統(50)，其中， &lt;br/&gt;該曲柄軸(8)及該電動馬達系統(50)兩者經組態以在該輸入扭矩方向上將扭矩提供至該齒輪輸入軸(8a)，且 &lt;br/&gt;該電動馬達系統進一步經組態以在該輸出扭矩方向上將一扭矩提供於該齒輪輸出軸(8b)上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pedally propelled vehicle drive system (1) and a method for shifting gears in such system, where the system comprises; &lt;br/&gt;- a crankshaft (3), &lt;br/&gt;- a gear system (8) with multiple selectable gear ratios, wherein the gear system has a gear input shaft (8a) and a gear output shaft (8b), and is configured to provide an output torque in an output torque direction on the gear output shaft (8b) when an in input torque in an input torque direction is present on the gear input shaft (8a), &lt;br/&gt;- an electric motor system (50), wherein &lt;br/&gt;both the crankshaft (8) and the electric motor system (50) are configured to provide torques to the gear input shaft (8a) in the input torque direction, and &lt;br/&gt;the electric motor system is further configured to provide a torque on the gear output shaft (8b) in the output torque direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:踏板推進式交通工具驅動系統</p>  
        <p type="p">3:曲柄軸</p>  
        <p type="p">3a:左曲柄臂</p>  
        <p type="p">3b:右曲柄臂</p>  
        <p type="p">6:曲柄軸輪</p>  
        <p type="p">7:齒輪輸入輪</p>  
        <p type="p">8:齒輪系統</p>  
        <p type="p">8a:齒輪輸入軸</p>  
        <p type="p">8b:齒輪輸出軸</p>  
        <p type="p">9:齒輪輸出輪</p>  
        <p type="p">10:中間輪</p>  
        <p type="p">11:輸出軸</p>  
        <p type="p">12:輸出輪</p>  
        <p type="p">13:鏈</p>  
        <p type="p">20:第一電動馬達</p>  
        <p type="p">20a:第一馬達輔助軸</p>  
        <p type="p">20b:第一馬達助力軸</p>  
        <p type="p">21:第一馬達輪</p>  
        <p type="p">22:第一中間馬達輪</p>  
        <p type="p">23:第二中間馬達輪</p>  
        <p type="p">24:第一馬達單向離合器、馬達第一單向離合器、第一單向離合器</p>  
        <p type="p">25:第二馬達輪</p>  
        <p type="p">26:第二馬達離合器、馬達第二離合器</p>  
        <p type="p">27:第一助力輪</p>  
        <p type="p">28:第二助力輪</p>  
        <p type="p">40:電動控制系統</p>  
        <p type="p">40a:第一電力線</p>  
        <p type="p">50:電動馬達系統、馬達系統</p>  
        <p type="p">71:曲柄單向離合器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1466" publication-number="202614882"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614882.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614882</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122158</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微型ＬＥＤ晶片系統的自動化切粒處理</chinese-title>  
        <english-title>AN AUTOMATED DICING PROCESS OF MICROLED CHIPS SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251230B">H10H20/01</main-classification>  
        <further-classification edition="202501120251230B">H10D89/00</further-classification>  
        <further-classification edition="200601120251230B">H01L21/78</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商弗瑞爾公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VUEREAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查吉　格拉姆瑞札</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAJI, GHOLAMREZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克朗寧　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRONIN, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪安戴利　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D'ANDREA, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示了一種微型LED晶片系統的自動化切粒處理，其中：一自動化切粒檢查模組，其測量參數以幫助控制一自動化切粒處理模組；及該自動化切粒處理模組，其輸入參數；及一自動化切粒後處理模組，其測量來自一第四組參數的至少一個參數，其判定該第一組及第二組的該等參數的運行情況；及一自動化切粒歷史模組，其基於各組的參數來計算複數組參數；及一自動化切粒整合模組，其用以基於該自動化切粒歷史模組的該等結果來更新該自動化切粒處理模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses an automated dicing process of microLED chips system in which an automated dicing inspection module which measures parameters to help control the automated dicing process module, and an automated dicing process module which inputs parameters, and an automated dicing post-process module which measures at least one parameter from a fourth group of parameters that determines how well the parameters of the first and second group were running, and an automated dicing historical module which calculates a plurality of group pa2rameters based upon parameters of the each group and an automated dicing integration module to update the automated dicing processing module based upon the results of the automated dicing historical module.&lt;b&gt;  &lt;/b&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:第三方切粒AI網路</p>  
        <p type="p">104:通訊介面</p>  
        <p type="p">106:記憶體</p>  
        <p type="p">108:基礎模組</p>  
        <p type="p">110:切粒檢查模組</p>  
        <p type="p">112:切粒處理模組</p>  
        <p type="p">114:切粒後處理模組</p>  
        <p type="p">116:切粒歷史模組；歷史模組</p>  
        <p type="p">118:切粒整合模組</p>  
        <p type="p">120:切粒檢查資料庫</p>  
        <p type="p">122:切粒處理資料庫</p>  
        <p type="p">124:切粒網路資料庫；網路資料庫</p>  
        <p type="p">126:雲端</p>  
        <p type="p">128:前處理切粒設備；預處理切粒設備</p>  
        <p type="p">130:通訊介面；預處理切粒設備AI模組</p>  
        <p type="p">132:記憶體</p>  
        <p type="p">134:預處理切粒設備AI模組；處理切粒設備</p>  
        <p type="p">136:預處理切粒設備資料庫</p>  
        <p type="p">138:處理切粒設備；處理切粒設備</p>  
        <p type="p">140:通訊介面</p>  
        <p type="p">142:記憶體</p>  
        <p type="p">144:處理切粒設備AI模組</p>  
        <p type="p">146:處理切粒設備資料庫</p>  
        <p type="p">148:後處理切粒設備</p>  
        <p type="p">150:通訊介面</p>  
        <p type="p">152:記憶體</p>  
        <p type="p">154:後處理切粒設備AI模組</p>  
        <p type="p">156:後處理切粒設備資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1467" publication-number="202613520"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613520.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613520</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122161</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊取得裝置、資訊取得方法及基板處理裝置</chinese-title>  
        <english-title>INFORMATION ACQUISITION APPARATUS, INFORMATION ACQUISITION METHOD AND SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251008B">G01N21/25</main-classification>  
        <further-classification edition="201401120251008B">G01N21/552</further-classification>  
        <further-classification edition="200601120251008B">G05B19/406</further-classification>  
        <further-classification edition="200601120251008B">G02B5/04</further-classification>  
        <further-classification edition="200601120251008B">H01L21/66</further-classification>  
        <further-classification edition="200601120251008B">H01L21/68</further-classification>  
        <further-classification edition="200601120251008B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前田智明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA, TOMOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於準確且以較高之時間解析度，取得與存在於基板之上表面上之特定物質之濃度或量等相關之資訊。 &lt;br/&gt;本發明之資訊取得裝置包含：光照射部，其將對於基板具有透過性且具有包含特定物質之吸收光譜之波長範圍之指向性之照射光，以在基板之內部全反射之方式照射至基板；受光部，其接收在基板之內部一面全反射一面傳播而自基板出射之全反射光，輸出與全反射光相關之測定資訊；及資訊取得部，其自測定資訊中所含之特定物質之吸收光譜取得與特定物質相關之資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板處理裝置</p>  
        <p type="p">11:腔室</p>  
        <p type="p">14:搬入搬出口</p>  
        <p type="p">15:擋門</p>  
        <p type="p">20:旋轉夾具(基板保持部)</p>  
        <p type="p">21:旋轉基座</p>  
        <p type="p">22:吸引泵(吸引部)</p>  
        <p type="p">23:吸引配管</p>  
        <p type="p">24:閥</p>  
        <p type="p">25:旋轉軸</p>  
        <p type="p">26:旋轉馬達(旋轉部)</p>  
        <p type="p">27:馬達殼體</p>  
        <p type="p">30:處理液供給部</p>  
        <p type="p">31:噴嘴</p>  
        <p type="p">32:噴嘴移動部</p>  
        <p type="p">33:配管</p>  
        <p type="p">34,36:分支配管</p>  
        <p type="p">35,37:閥</p>  
        <p type="p">40:防護部</p>  
        <p type="p">41:防護筒</p>  
        <p type="p">42:杯</p>  
        <p type="p">43:外周環</p>  
        <p type="p">44:升降部</p>  
        <p type="p">50:光照射部</p>  
        <p type="p">51:光源</p>  
        <p type="p">52:照射頭</p>  
        <p type="p">53:(第1)稜鏡</p>  
        <p type="p">54:光纖</p>  
        <p type="p">55:支持構件</p>  
        <p type="p">60:受光部</p>  
        <p type="p">61:透鏡</p>  
        <p type="p">62:受光頭</p>  
        <p type="p">63:光纖</p>  
        <p type="p">64:受光元件</p>  
        <p type="p">65:支持構件</p>  
        <p type="p">90:控制部</p>  
        <p type="p">111:基板搬送機器人</p>  
        <p type="p">A1:旋轉軸線</p>  
        <p type="p">S:基板</p>  
        <p type="p">SC:中心</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1468" publication-number="202613429"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613429.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613429</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122192</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>彈簧構件、相機模組及電子機器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">F16F3/02</main-classification>  
        <further-classification edition="200601120251231B">F16F1/18</further-classification>  
        <further-classification edition="202101120251231B">G02B7/04</further-classification>  
        <further-classification edition="202101120251231B">G03B30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商凸版控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOPPAN HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樫尾達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASHIO, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古賀修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOGA, OSAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">第1緣部係包含在第2方向上位於第1端部和第2端部之間的第1底部、第1頂部和第2底部。在第2方向上，第1頂部位於第1底部和第2底部之間。在第1方向上，沿著第2方向延伸的內側彈簧的中心軸與第1頂部之間的距離，係比中心軸與第1端部之間的距離、以及中心軸與第2端部之間的距離之至少一者還短。在第1方向上，中心軸與第1頂部之間的距離，係比中心軸與第1底部之間的距離及中心軸與第2底部之間的距離還長。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1469" publication-number="202612734"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612734.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612734</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122213</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於預防第１型糖尿病的方法及組成物</chinese-title>  
        <english-title>METHODS AND COMPOSITIONS FOR PREVENTING TYPE 1 DIABETES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K39/395</main-classification>  
        <further-classification edition="200601120260102B">C07K16/28</further-classification>  
        <further-classification edition="200601120260102B">A61P3/10</further-classification>  
        <further-classification edition="200601120260102B">G01N33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商普泛森生技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROVENTION BIO, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>耶魯大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YALE UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維吉尼亞梅森貝納羅亞研究所</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENAROYA RESEARCH INSTITUTE AT VIRGINIA MASON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里昂　法蘭西斯科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEON, FRANCISCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍洛德　凱文Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEROLD, KEVAN C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龍　莎拉Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LONG, SARAH ALICE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林斯利　彼得Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINSLEY, PETER S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在本文之一態樣中提供一種用於預防或延遲臨床第1型糖尿病(T1D)之發病的方法，其包含：提供有罹患T1D風險之一非糖尿病受試者；對該非糖尿病受試者投與一預防性有效量的抗CD3抗體；及在該投與步驟之前或之後，確定該非糖尿病受試者之全部CD3+T細胞中具有超過約10%的TIGIT+KLRG1+CD8+T細胞，其指示成功地預防或延遲臨床T1D之發病。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein, in one aspect, is a method of preventing or delaying the onset of clinical type 1 diabetes (T1D), comprising: providing a non-diabetic subject who is at risk for T1D; administering a prophylactically effective amount of an anti-CD3 antibody to the non-diabetic subject; and determining, prior to or after the administering step, that the non-diabetic subject has more than about 10% TIGIT+KLRG1+CD8+ T-cells in all CD3+ T cells, which is indicative of successful prevention or delay of the onset of clinical T1D.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1470" publication-number="202612584"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612584.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612584</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122216</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>附載體箔的超薄銅箔及其製造方法</chinese-title>  
        <english-title>CARRIER-FOIL-ATTACHED FOIL WITH ULTRA-THIN COPPER FOIL AND MANUFACTURING METHOD THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251231B">A01K61/51</main-classification>  
        <further-classification edition="201701120251231B">A01K61/85</further-classification>  
        <further-classification edition="201701120251231B">A01K61/90</further-classification>  
        <further-classification edition="200601120251231B">A01K63/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂天能源材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOTTE ENERGY MATERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金亨哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUNG CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁暢烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHANG YOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范元辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEOM, WON JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金古韓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, GEUL HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋基德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, KIDEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種附載體箔的箔材，其包含一具有低粗糙度且平滑表面的超薄銅箔。該附有載體箔的箔材包含：一載體箔、一釋離層，以及一超薄銅箔，依序層疊而成，其中，該載體箔包含一朝向該釋離層之電解拋光面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a carrier-foil-attached foil with an ultra-thin copper foil having a smooth surface with low roughness, wherein the carrier-foil-attached foil includes a carrier foil, a release layer, and an ultra-thin copper foil, which are sequentially laminated, the carrier foil including an electro-polished surface, which faces the release layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:載體箔</p>  
        <p type="p">112:粗化層</p>  
        <p type="p">120:釋離層</p>  
        <p type="p">130:耐熱層</p>  
        <p type="p">140:超薄銅箔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1471" publication-number="202612953"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612953.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612953</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122238</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>四種定位手推車</chinese-title>  
        <english-title>FOUR POSITION HAND TRUCK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B62B1/12</main-classification>  
        <further-classification edition="200601120251229B">B62B3/02</further-classification>  
        <further-classification edition="200601120251229B">B62B5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商哈柏卡車有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARPER TRUCKS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼杜沙　荷西　安卓　卡西瑞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MENDOZA, JOSE ANGEL CACERES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種手推車包含由主輪支撐之一框及具有兩個側部件之一手柄。兩個手柄托架經可樞轉地安裝於該框之相對側上。該等手柄托架經配置用於圍繞一手柄旋轉軸相對於該框旋轉。該等手柄托架亦可滑動地容納該手柄之該等側部件，使得該手柄能夠在一第一縮回位置與一第二延伸位置之間滑動。該手柄亦能夠隨著該等手柄托架在第一旋轉位置與第二旋轉位置之間旋轉。與該等手柄托架及該手柄機械地相關聯之一鎖定機構能夠可釋放地鎖定該縮回位置與延伸位置之間之至少一個位置中之該手柄之延伸之程度並能夠鎖定至少一個旋轉位置中之該手柄之該旋轉位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A hand truck includes a frame that is supported by main wheels and a handle having two side members. Two handle bracket are pivotably mounted on opposite sides of the frame. The handle brackets are arranged for rotation in relation to the frame about a handle rotation axis. The handle brackets also slidably receive the side members of the handle so that the handle is able to slide between a first retracted position and a second extended positon. The handle is also able to rotate with the handle brackets between first and second rotational positions. A lock mechanism that is mechanically associated with the handle brackets and the handle is able to releasably lock the degree of extension of the handle in at least one position between the retracted and extended positions and is able to lock the rotational position of the handle in at least one rotational position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:多定位手推車</p>  
        <p type="p">20:框總成</p>  
        <p type="p">22:框部件</p>  
        <p type="p">22A:右側部件</p>  
        <p type="p">22AE:下端</p>  
        <p type="p">22B:左側部件</p>  
        <p type="p">22BE:下端</p>  
        <p type="p">22C:上橫越部件</p>  
        <p type="p">24:輪總成</p>  
        <p type="p">24A:輪軸</p>  
        <p type="p">24S1:輪支桿</p>  
        <p type="p">24S2:輪支桿</p>  
        <p type="p">24W1:主輪</p>  
        <p type="p">24W2:主輪</p>  
        <p type="p">26:負載支撐部件/推車底盤</p>  
        <p type="p">28A:橫越部件</p>  
        <p type="p">28B:橫越部件</p>  
        <p type="p">40:手柄總成</p>  
        <p type="p">42:手柄部件</p>  
        <p type="p">42A:右側部件</p>  
        <p type="p">42AH2:鎖定孔</p>  
        <p type="p">42B:左側部件</p>  
        <p type="p">44:橫向手柄部件</p>  
        <p type="p">50:腳輪總成</p>  
        <p type="p">52:橫越部件</p>  
        <p type="p">52A:腳輪</p>  
        <p type="p">52B:腳輪</p>  
        <p type="p">70:頭總成</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1472" publication-number="202613057"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613057.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613057</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122242</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用特定圓度的ＳｉＣ粒子提供ＳｉＣ陶瓷預製件之３Ｄ列印方法</chinese-title>  
        <english-title>A 3D PRINT METHOD FOR PROVIDING A SIC CERAMIC PREFORM USING SIC PARTICLES WITH A SPECIFIC ROUNDNESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">C04B35/565</main-classification>  
        <further-classification edition="201701120251226B">B29C64/165</further-classification>  
        <further-classification edition="202201120251226B">B22F1/07</further-classification>  
        <further-classification edition="200601120251226B">B29C67/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商陶瓷技術公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CERAMTEC GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱姆　馬丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEIM, MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海帝奇　帕斯卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HETTICH, PASCAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡瑟　安得烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASCHER, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於在粉末床列印方法中使用SiC粒子(顆粒)，用於提供SiC陶瓷預製件(生坯)，其中該SiC粒子(顆粒)的特徵在於： &lt;br/&gt;　　-   平均顆粒尺寸(d&lt;sub&gt;50&lt;/sub&gt;)為2至70 µm，較佳地3至65 µm，更佳地5至50 µm，諸如25至60 µm，較佳地40至55 µm， &lt;br/&gt;　　-   圓度為＞0.55，較佳地＞0.58，更佳地＞0.6，如實驗部分所述； &lt;br/&gt;　　-   體密度為＞1.6 g/cm&lt;sup&gt;3&lt;/sup&gt;，較佳地＞1.65 g/cm&lt;sup&gt;3&lt;/sup&gt;，更佳地＞1.7 g/cm&lt;sup&gt;3&lt;/sup&gt;，甚至更佳地＞1.75 g/cm&lt;sup&gt;3&lt;/sup&gt;，根據DIN EN 725-9 ISO 23145-2。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to the use of SiC particles (grains) in a powder bed print method for providing a SiC ceramic preform (green body), wherein the SiC particles (grains) are characterized by &lt;br/&gt;&lt;br/&gt;- an average grain size (d&lt;sub&gt;50&lt;/sub&gt;) of 2 to 70 µm, preferably 3 to 65 µm, more preferably 5 to 50 µm, such as 25 to 60 µm, preferably 40 to 55 µm, &lt;br/&gt;- a roundness of ＞ 0.55, preferably ＞ 0.58, more preferably ＞ 0.6 (as described in experimental section , &lt;br/&gt;- bulk density of ＞ 1.6 g/cm&lt;sup&gt;3&lt;/sup&gt;, preferably ＞ 1.65 g/cm&lt;sup&gt;3&lt;/sup&gt;, more preferably ＞ 1.7 g/cm&lt;sup&gt;3&lt;/sup&gt;, even more preferably ＞ 1.75 g/cm&lt;sup&gt;3&lt;/sup&gt; (according to DIN EN 725-9 ISO 23145-2).</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1473" publication-number="202612694"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612694.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612694</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122245</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>以纖維母細胞生長因子受體3　(FGFR3)抑制劑治療後癌症中EGFR/HER2/3之活化</chinese-title>  
        <english-title>ACTIVATION OF EGFR/HER2/3 IN CANCER AFTER TREATMENT WITH AN INHIBITOR OF FIBROBLAST GROWTH FACTOR RECEPTOR 3 (FGFR3)</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/4545</main-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="201701120260102B">A61K47/68</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美國禮來大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELI LILLY AND COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高姿　艾娃　瑪莉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOETZ, EVA MARIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊凡斯　羅伯特　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVANS, ROBERT JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普卡　羅瑞達納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PUCA, LOREDANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里沛爾　安克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLIPPEL, ANKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃塔　維維安娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VOLTA, VIVIANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於FGFR3抑制劑及EGFR3/HER2/3路徑抑制劑之組合之用途，其用於治療、預防或改善FGFR3發揮作用之疾病或病症之方法(或治療、預防或改善疾病或病症之用途)。在所揭示方法中，可同時、分開或依序投與該FGFR3抑制劑及該EGFR/HER2/3抑制劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure relates to the use of a combination of an inhibitor of FGFR3 and an inhibitor of the EGFR3/HER2/3 pathway in methods of treating, preventing, or ameliorating a disease, or disorder, (or uses in the treatment, prevention, or amelioration of a disease, or disorder), in which FGFR3 plays a role. In the disclosed methods, the inhibitor of FGFR3 and the inhibitor of the EGFR/HER2/3 may be administered simultaneously, separately, or sequentially.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">圖11</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1474" publication-number="202612778"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612778.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612778</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122246</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二氧化碳之回收方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">B01D53/62</main-classification>  
        <further-classification edition="201701120251103B">C01B32/60</further-classification>  
        <further-classification edition="200601120251103B">C01F5/24</further-classification>  
        <further-classification edition="200601120251103B">C01F11/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商神島化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONOSHIMA CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松井誠二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUI, SEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種二氧化碳之回收方法及碳酸鹽之製造方法。上述二氧化碳之回收方法及碳酸鹽之製造方法係使含有鹼金屬離子(例如鈉離子)及水之鹼性之混合物A與含有二氧化碳之氣體B接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1475" publication-number="202614892"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614892.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614892</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122260</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於微型ＬＥＤ的自動化基於ＡＩ之濕式蝕刻</chinese-title>  
        <english-title>AN AUTOMATED AI-BASED WET ETCHING FOR MICROLEDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251231B">H10H29/01</main-classification>  
        <further-classification edition="201701120251231B">H01L21/77</further-classification>  
        <further-classification edition="200601120251231B">H01L21/66</further-classification>  
        <further-classification edition="200601120251231B">H01L21/461</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商弗瑞爾公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VUEREAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查吉　格拉姆瑞札</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAJI, GHOLAMREZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克朗寧　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRONIN, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪安戴利　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D'ANDREA, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種LED基材系統的自動化濕式蝕刻，其中一自動化濕式蝕刻檢查模組用以判定進入的處理材料的品質，且一自動化濕式蝕刻處理模組用以處理該處理材料，一自動化濕式蝕刻後處理模組用以檢查所得處理材料的可接受性，且一自動化濕式蝕刻歷史模組用以針對所有歷史資料分析最近處理的後處理結果以找出該自動化濕式蝕刻處理模組中之增強處理改變，且一自動化濕式蝕刻整合模組用以基於該自動化濕式蝕刻歷史模組的該等結果來更新該自動化濕式蝕刻處理模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an automated wet etching of LED substrates system in which an automated wet etching inspection module is used to determine the quality of incoming processing material and an automated wet etching process module is used to process the processing material, an automated wet etching post-process module is used to inspect the resultant process material for acceptability, and an automated wet etching historical module is used to analyze the post process results of the most recent process, against all historical data to find enhanced process changes in the automated wet etching process module and an automated wet etching integration module to update the automated wet etching process module based upon the results of the automated wet etching historical module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:第三方濕式蝕刻AI網路</p>  
        <p type="p">104:通訊介面</p>  
        <p type="p">106:記憶體</p>  
        <p type="p">108:基本模組</p>  
        <p type="p">110:WE檢查模組</p>  
        <p type="p">112:WE處理模組</p>  
        <p type="p">114:WE後處理模組</p>  
        <p type="p">116:WE歷史模組；歷史模組</p>  
        <p type="p">118:WE整合模組</p>  
        <p type="p">120:WE檢查資料庫</p>  
        <p type="p">122:WE處理資料庫</p>  
        <p type="p">124:WE後處理資料庫</p>  
        <p type="p">126:WE網路資料庫</p>  
        <p type="p">128:雲端</p>  
        <p type="p">130:濕式蝕刻預處理</p>  
        <p type="p">132:通訊介面</p>  
        <p type="p">134:記憶體</p>  
        <p type="p">136:濕式蝕刻預處理AI模組</p>  
        <p type="p">138:濕式蝕刻預處理資料庫</p>  
        <p type="p">140:濕式蝕刻處理</p>  
        <p type="p">142:通訊介面</p>  
        <p type="p">144:記憶體</p>  
        <p type="p">146:濕式蝕刻處理AI模組</p>  
        <p type="p">148:濕式蝕刻處理資料庫</p>  
        <p type="p">150:濕式蝕刻後處理</p>  
        <p type="p">152:通訊介面</p>  
        <p type="p">154:記憶體</p>  
        <p type="p">156:濕式蝕刻後處理AI模組</p>  
        <p type="p">158:濕式蝕刻後處理資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1476" publication-number="202614893"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614893.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614893</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122273</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於微型ＬＥＤ的自動化基於ＡＩ之取放處理</chinese-title>  
        <english-title>AN AUTOMATED AI-BASED PICK AND PLACE PROCESS FOR MICROLEDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251231B">H10H29/02</main-classification>  
        <further-classification edition="200601120251231B">H01L21/98</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商弗瑞爾公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VUEREAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查吉　格拉姆瑞札</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAJI, GHOLAMREZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克朗寧　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRONIN, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪安戴利　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D'ANDREA, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種LED基材系統的自動化取放，其中一自動化取放檢查模組用以判定進入的處理材料的品質，且一自動化取放處理模組用以處理該處理材料，一自動化取放後處理模組用以檢查所得之該處理材料的可接受性，且一自動化取放歷史模組用以針對所有歷史資料分析該最近程序的該等後處理結果以找出該自動化取放處理模組中之增強程序改變，且一自動化取放整合模組用以基於該自動化取放歷史模組的該等結果來更新該自動化取放處理模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an automated pick and place of LED substrates system in which an automated pick and place inspection module is used to determine the quality of incoming processing material and an automated pick and place process module is used to process the processing material, an automated pick, and place post-process module is used to inspect the resultant process material for acceptability, and an automated pick and place historical module is used to analyze the post process results of the most recent process, against all historical data to find enhanced process changes in the automated pick and place process module, and an automated pick and place integration module to update the automated pick and place process module based upon the results of the automated pick and place historical module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:第三方取放AI網路</p>  
        <p type="p">104:通訊介面</p>  
        <p type="p">106:記憶體</p>  
        <p type="p">108:基本模組</p>  
        <p type="p">110:PP檢查模組</p>  
        <p type="p">112:PP處理模組</p>  
        <p type="p">114:PP後處理模組</p>  
        <p type="p">116:PP歷史模組；歷史模組</p>  
        <p type="p">118:PP整合模組</p>  
        <p type="p">120:PP檢查資料庫</p>  
        <p type="p">122:PP處理資料庫</p>  
        <p type="p">124:PP後處理資料庫；PP後處理資料庫</p>  
        <p type="p">126:PP網路資料庫</p>  
        <p type="p">128:雲端；取放預處理</p>  
        <p type="p">130:取放預處理；PP預處理；PP檢查設備</p>  
        <p type="p">132:通訊介面</p>  
        <p type="p">134:記憶體；取放處理</p>  
        <p type="p">136:取放預處理AI模組</p>  
        <p type="p">138:取放預處理資料庫</p>  
        <p type="p">140:取放處理；PP處理；PP處理設備；處理</p>  
        <p type="p">142:通訊介面</p>  
        <p type="p">144:記憶體</p>  
        <p type="p">146:取放處理AI模組</p>  
        <p type="p">148:取放處理資料庫</p>  
        <p type="p">150:取放後處理；PP後處理；PP後處理設備</p>  
        <p type="p">152:通訊介面</p>  
        <p type="p">154:記憶體</p>  
        <p type="p">156:取放後處理AI模組</p>  
        <p type="p">158:取放後處理資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1477" publication-number="202614320"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614320.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614320</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122283</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於處理多種酬載類型之機器人運輸裝置</chinese-title>  
        <english-title>ROBOTIC TRANSPORT FOR HANDLING MULTIPLE PAYLOAD TYPES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/677</main-classification>  
        <further-classification edition="200601120251230B">H01L21/687</further-classification>  
        <further-classification edition="200601120251230B">H01L21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商布魯克斯自動機械美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROOKS AUTOMATION US, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫魯比雪　亞力山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRUPYSHEV, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙拉克　里夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARROCK, LEIGH F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">基板處理設備包括：運輸腔室；驅動區段，連接於運輸腔室；以及雙重獨立鉸接臂，位在運輸腔室內且耦合於驅動區段。第一臂具有多個末端執行器，其中第一末端執行器具有第一基板固持站，建構成順應於且固持具有第一預定基板特性的第一基板，並且第二末端執行器具有第二基板固持站，建構成順應於且固持具有非順應於第一基板固持站之第二預定基板特性的第二基板。第二臂具有至少第三末端執行器，具有實質對應於第一基板固持站的第三基板固持站，使得第三基板固持站順應於且固持實質具有第一預定基板特性的至少另一基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate processing apparatus includes a transport chamber, a drive section connected to the transport chamber, and dual independent articulated arms located inside the transport chamber and coupled to the drive section. A first arm has multiple end effectors, where a first end effector has a first substrate holding station configured to conform with and hold a first substrate with first predetermined substrate characteristics, and a second end effector has a second substrate holding station configured to conform with and hold a second substrate with second predetermined substrate characteristics non-conformal with the first substrate holding station. A second arm has at least a third end effector having a third substrate holding station substantially corresponding to the first substrate holding station so that the third substrate holding station conforms with and holds at least another substrate with substantially the first predetermined substrate characteristics.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">175:轉移機器人</p>  
        <p type="p">180:框架</p>  
        <p type="p">180H:外殼</p>  
        <p type="p">300:驅動區段</p>  
        <p type="p">310:同軸驅動軸桿總成</p>  
        <p type="p">370:雙重獨立鉸接臂</p>  
        <p type="p">370SC:選擇順應性組裝機器手臂(SCARA)</p>  
        <p type="p">371:雙重獨立鉸接臂</p>  
        <p type="p">EE3:第三末端執行器</p>  
        <p type="p">FPE:非製造基板或處理裝備</p>  
        <p type="p">HS:基板固持站</p>  
        <p type="p">HS1:第一基板固持站</p>  
        <p type="p">HS2:第二基板固持站</p>  
        <p type="p">M1~M4:馬達</p>  
        <p type="p">MZ:Z軸(垂直)驅動馬達</p>  
        <p type="p">P:基板或酬載</p>  
        <p type="p">R1,R2:徑向延伸軸線</p>  
        <p type="p">S:待處理基板</p>  
        <p type="p">SX:樞轉軸線、肩軸線</p>  
        <p type="p">θ:旋轉方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1478" publication-number="202613043"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613043.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613043</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122289</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用錳與鐵催化劑之組合消毒隱形眼鏡之方法</chinese-title>  
        <english-title>METHODS FOR DISINFECTING CONTACT LENSES USING A COMBINATION OF MANGANESE AND IRON CATALYSTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251219B">C02F1/64</main-classification>  
        <further-classification edition="200601120251219B">A61L12/12</further-classification>  
        <further-classification edition="201201120251219B">D04H1/073</further-classification>  
        <further-classification edition="200601120251219B">G02C7/04</further-classification>  
        <further-classification edition="200601120251219B">C08J7/06</further-classification>  
        <further-classification edition="202501120251219B">A01N1/124</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商更好視覺解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BETTER VISION SOLUTIONS LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫特唐　琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WINTERTON, LYNN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀畊宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述用於消毒隱形眼鏡之隱形眼鏡處理系統及方法。此等系統及方法利用一經塗覆催化盤與一纖維催化劑之組合。該經塗覆催化盤含有一支撐盤及通常呈二氧化錳之形式之存在於該支撐盤之至少一部分上之6至300 mg錳。該纖維催化劑含有通常呈一鐵陽離子之形式之25至50 mg鐵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Contact lens treatment systems and methods for disinfecting contact lenses are described. These systems and methods utilize a coated catalytic disc in combination with a fibrous catalyst. The coated catalytic disc contains a support disc and 6 to 300 mg of manganese present on at least a portion of the support disc, often in the form of manganese dioxide. The fibrous catalyst contains 25 to 50 mg iron, often in the form of an iron cation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:隱形眼鏡消毒系統</p>  
        <p type="p">10:帽</p>  
        <p type="p">12:容器</p>  
        <p type="p">14:隱形眼鏡籃筐</p>  
        <p type="p">16:經塗覆催化盤</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1479" publication-number="202613329"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613329.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613329</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122301</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>低熱膨脹合金</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">C22C27/06</main-classification>  
        <further-classification edition="200601120251216B">C22C38/18</further-classification>  
        <further-classification edition="200601120251216B">C22C38/04</further-classification>  
        <further-classification edition="200601120251216B">C21D1/773</further-classification>  
        <further-classification edition="200601120251216B">B22D18/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新報國材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINHOKOKU MATERIAL CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井啟道</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, HIROMICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松村信吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMURA, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大野晴康</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHNO, HARUYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小奈浩太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONA, KOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種目的在於可使用在避忌磁性之環境中的低熱膨脹合金。&lt;br/&gt; [解決手段]本發明之低熱膨脹合金含有：Fe：3.00～6.00質量%；Mn：0.50～2.00質量%；REM：0.01～2.00質量%；C：500質量ppm以下；N：500質量ppm以下；以及剩餘部分：Cr及不純物；且25～75℃下之平均熱膨脹係數為4.0×10&lt;sup&gt;-&lt;/sup&gt;&lt;sup&gt;6&lt;/sup&gt;/℃以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1480" publication-number="202613394"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613394.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613394</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122302</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有雙訊息指示器的鎖具組</chinese-title>  
        <english-title>LOCKSET WITH DUAL MESSAGE INDICATORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">E05B41/00</main-classification>  
        <further-classification edition="200601120251230B">E05B1/00</further-classification>  
        <further-classification edition="200601120251230B">E05B9/00</further-classification>  
        <further-classification edition="200601120251230B">E05B9/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商城鋼有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOWNSTEEL,INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬　斯伯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, SYBOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭源晉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, YUANJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉金城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JINCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆恩　查德Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, CHAD P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於通道的鎖具組具有協調的內側指示器與協調的外側指示器，以顯示鎖定狀態。鎖具組亦可包含教職員鎖定功能，以增強隱私保護。鎖具組亦可在外側把手中包含保護性失效點，以防止自強行進入所造成的損壞。此外，亦可包含雙動縮回連桿組，使內側把手可同時縮回插銷並解鎖鎖閂，以便於逃生。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A lockset for an accessway has coordinated inside and outside indicators to display the lock status. The lockset may also include a faculty lock function to enhance privacy. The lockset may also include a protective failure point in the outside handle to prevent damage from forced entry attempts. A dual action retract linkage may be included to allow the inside handle to both retract the latchbolt and unlock the lockbolt for convenient egress.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:滑塊</p>  
        <p type="p">144:安裝板</p>  
        <p type="p">197:套筒</p>  
        <p type="p">32:外側裝飾件</p>  
        <p type="p">33:開口</p>  
        <p type="p">35:內側指示器板</p>  
        <p type="p">39:導引板</p>  
        <p type="p">41:外殼</p>  
        <p type="p">46:固定板</p>  
        <p type="p">47:把手回彈彈簧</p>  
        <p type="p">51:內側把手</p>  
        <p type="p">63:止擋板</p>  
        <p type="p">71:支架</p>  
        <p type="p">72:彈簧腳止擋</p>  
        <p type="p">75:開孔</p>  
        <p type="p">80:內側訪問控制裝置</p>  
        <p type="p">87:內側鎖桿</p>  
        <p type="p">91:凸輪</p>  
        <p type="p">93:曲柄</p>  
        <p type="p">95:連桿組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1481" publication-number="202614345"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614345.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614345</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122303</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板支撐設備的分隔牆、基板支撐設備及基板處理設備</chinese-title>  
        <english-title>PARTITION WALL OF SUBSTRATE SUPPORTTING APPARATUS, SUBSTRATE SUPPORTING APPARATUS, AND SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/683</main-classification>  
        <further-classification edition="200601120251230B">H01L21/67</further-classification>  
        <further-classification edition="200601120251230B">C23C16/458</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商周星工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUSUNG ENGINEERING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁根壽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, GEUN SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余弘奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEO, HONG KI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張大洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, DAESOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃喆周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, CHUL-JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種被提供於基板支撐設備中且被設置成面向用於噴射氣體的氣體噴射器的分隔牆，其中分隔牆包含從基板支撐設備中所包含的支撐件的中心區域朝向氣體噴射器突出的突部、朝向氣體噴射器突出並從突部的一端沿著支撐件的一端的方向延伸的第一分隔件，以及朝向氣體噴射器突出並從突部的另一端沿著支撐件的另一端的方向延伸第二分隔件，一種基板支撐設備，以及基板處理設備。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a partition wall provided in a substrate supporting apparatus and disposed to face a gas injector for injecting gas, wherein the partition wall comprises a protrusion protruding from a central region of a supporter included in the substrate supporting apparatus toward the gas injector, a first partition protruding toward the gas injector and extending from one end of the protrusion in a direction of one end of the supporter, and a second partition protruding toward the gas injector and extending from the other end of the protrusion in a direction of the other end of the supporter, the substrate supporting apparatus, and a substrate processing apparatus.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">210,220:區域</p>  
        <p type="p">4:基板支撐設備</p>  
        <p type="p">41:支撐件</p>  
        <p type="p">42,421,422,423,424:基座</p>  
        <p type="p">5:分隔牆</p>  
        <p type="p">51,511,512:突部</p>  
        <p type="p">52:分隔件</p>  
        <p type="p">53:分隔牆</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1482" publication-number="202613114"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613114.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613114</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122316</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＦＧＦＲ抑制劑及其製備方法和用途</chinese-title>  
        <english-title>FGFR INHIBITORS, PREPARATION METHODS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">C07D471/04</main-classification>  
        <further-classification edition="200601120251231B">A61K31/4439</further-classification>  
        <further-classification edition="200601120251231B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商江蘇亞虹醫藥科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANGSU YAHONG MEDITECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海亞虹醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASIERIS PHARMACEUTICALS (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋海峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, HAIFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鐵林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TIELIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖璐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及FGFR抑制劑及其製備方法和用途。具體而言，本發明涉及一種通式(I)所示的化合物、其製備方法及含有該類化合物的醫藥組成物，以及其作為FGFR抑制劑在治療腫瘤中的用途。其中通式(I)中各基團如說明書中所定義。</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="175px" width="318px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to FGFR inhibitors, preparation methods and uses thereof. Specifically, the present invention relates to a compound as represented by general formula (I), a preparation method therefor, a pharmaceutical composition comprising the compound, and the use thereof as an FGFR inhibitor in the treatment of tumors. Each group in the general formula (I) is as defined in the description.</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="179px" width="295px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1483" publication-number="202613176"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613176.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613176</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122338</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙特異性結合蛋白及其用途</chinese-title>  
        <english-title>BISPECIFIC BINDING PROTEINS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/28</main-classification>  
        <further-classification edition="200601120260102B">C07K16/46</further-classification>  
        <further-classification edition="200601120260102B">C12N15/13</further-classification>  
        <further-classification edition="200601120260102B">C12N15/63</further-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商麥迪紐有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIMMUNE, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡斯圖藍根　史琳那</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASTURIRANGAN, SRINATH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高　常壽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, CHANGSHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞尼　高地弗雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAINEY, GODFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫羅　米雪兒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORROW, MICHELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>道伯森　克萊兒　露易絲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOBSON, CLAIRE LOUISE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德雷比克　史黛西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DRABIC, STACEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史考菲爾德　戴倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHOFIELD, DARREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡雷索　傑安路卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARLESSO, GIANLUCA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裴里吉　克莉斯坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POLLIZZI, KRISTEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅佐　亞利夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAZOR, YARIV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐柏斯特　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OBERST, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢蒙德　史考特　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMMOND, SCOTT A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅伯　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOBO, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅尼華　派克許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANIKWAR, PRAKASH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希曼　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEAMAN, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明概括性地提供結合兩個表位(例如，第一及第二表位)且呈二價用以結合至該等第一及第二表位中之每一者的蛋白。本發明亦提供結合至靶蛋白之特異性結合蛋白，包括抗體。本發明亦提供包含該等蛋白之組合物、編碼該等蛋白之核酸分子及製備該等蛋白之方法。本發明提供誘導個體免疫反應之方法以及治療或預防個體癌症之方法，其係藉由向該個體投與該等蛋白、核酸分子及/或組合物來實施。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure generally provides proteins that bind two epitopes (e.g., a first and a second epitope) and that are bivalent for binding to each of the first and second epitopes. The disclosure also provides for specific binding proteins, including antibodies, which bind to a target protein. The disclosure also provides compositions comprising such proteins, nucleic acid molecules encoding such proteins and methods of making such proteins. The disclosure provides methods of inducing an immune response in a subject as well as methods for treating or preventing cancer in a subject by administering the proteins, nucleic acid molecules and/or compositions to the subject.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1484" publication-number="202614254"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614254.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614254</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122339</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於微型ＬＥＤ之自動化基於ＡＩ之膜量測</chinese-title>  
        <english-title>AN AUTOMATED AI BASED FILM MEASUREMENT FOR MICROLEDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/66</main-classification>  
        <further-classification edition="202501120251230B">H10H29/01</further-classification>  
        <further-classification edition="202501120251230B">H10H20/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商弗瑞爾公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VUEREAL INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查吉　格拉姆瑞札</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAJI, GHOLAMREZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克朗寧　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRONIN, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪安戴利　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D'ANDREA, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種微型LED基材系統的自動化膜量測，其中一自動化膜量測檢查模組用以判定進入的處理材料的品質，且一自動化膜量測處理模組用以處理該處理材料，一自動化膜量測後處理模組用以檢查所得處理材料的允收性，且一自動化膜量測歷史模組用以針對所有歷史資料分析最近程序的後處理結果以查找該自動化膜量測處理模組中經改善之程序改變，且一自動化膜量測整合模組用以基於該自動化膜量測歷史模組的該等結果來更新該自動化膜量測處理模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an automated film measurement of microLED substrates system in which an automated film measurement inspection module is used to determine the quality of incoming processing material, and an automated film measurement process module is used to process the processing material, an automated film measurement post-process module is used to inspect the resultant process material for acceptability, and an automated film measurement historical module is used to analyze the post process results of the most recent process, against all historical data to find enhanced process changes in the automated film measurement process module and an automated film measurement integration module to update the automated film measurement process module based upon the results of the automated film measurement historical module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:第3方膜量測AI網路</p>  
        <p type="p">104:通訊介面</p>  
        <p type="p">106:記憶體</p>  
        <p type="p">108:基本模組</p>  
        <p type="p">110:FM檢查模組</p>  
        <p type="p">112:FM處理模組</p>  
        <p type="p">114:FM後處理模組</p>  
        <p type="p">116:FM歷史模組</p>  
        <p type="p">118:FM整合模組</p>  
        <p type="p">120:FM檢查資料庫</p>  
        <p type="p">122:FM處理資料庫</p>  
        <p type="p">124:FM後處理資料庫</p>  
        <p type="p">126:FM網路資料庫</p>  
        <p type="p">128:雲端</p>  
        <p type="p">130:膜量測預處理</p>  
        <p type="p">132:通訊介面</p>  
        <p type="p">134:記憶體</p>  
        <p type="p">136:膜量測預處理AI模組</p>  
        <p type="p">138:膜量測預處理資料庫</p>  
        <p type="p">140:膜量測處理</p>  
        <p type="p">142:通訊介面</p>  
        <p type="p">144:記憶體</p>  
        <p type="p">146:膜量測處理AI模組</p>  
        <p type="p">148:膜量測處理資料庫</p>  
        <p type="p">150:膜量測後處理</p>  
        <p type="p">152:通訊介面</p>  
        <p type="p">154:記憶體</p>  
        <p type="p">156:膜量測後處理AI模組</p>  
        <p type="p">158:膜量測後處理資料庫</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1485" publication-number="202614516"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614516.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614516</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122361</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>匯流排連接組件</chinese-title>  
        <english-title>BUS BAR CONNECTION ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250623B">H01R25/16</main-classification>  
        <further-classification edition="200601120250623B">H01R13/02</further-classification>  
        <further-classification edition="200601120250623B">H01R13/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝爾威勒電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELLWETHER ELECTRONIC CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅意傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, YI-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種匯流排連接組件包含一匯流排本體、一第一導電端子組、一第二導電端子組及一第三導電端子組。匯流排本體具有第一配置區、第二配置區及連接部，連接部連接第一配置區及第二配置區。第一導電端子組配置於第一配置區上，且電連接匯流排本體。第二導電端子組配置於第二配置區上，電連接匯流排本體，且具有第一突出長度。第三導電端子組配置於第二配置區上，電連接匯流排本體，且具有不同於第一突出長度之第二突出長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bus bar connection assembly includes a bus bar body, a first conductive terminal set, a second conductive terminal set and a third conductive terminal set. The bus bar body includes a first configuration area, a second configuration area and a connecting portion connected to the first configuration area and the second configuration area. The first conductive terminal set is arranged on the first arrangement area and electrically connected to the bus bar body. The second conductive terminal set is arranged on the second configuration area, electrically connected to the bus bar body, and provided with a first protruding length. The third conductive terminal set is arranged on the second arrangement area, electrically connected to the bus bar body, and has a second protruding length different from the first protruding length.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:匯流排電力傳輸裝置</p>  
        <p type="p">100:匯流排連接組件</p>  
        <p type="p">110:匯流排本體</p>  
        <p type="p">120:第一配置區</p>  
        <p type="p">130:第二配置區</p>  
        <p type="p">140:連接部</p>  
        <p type="p">141:開口</p>  
        <p type="p">200:第一導電端子組</p>  
        <p type="p">300:第二導電端子組</p>  
        <p type="p">400:第三導電端子組</p>  
        <p type="p">500:第四導電端子組</p>  
        <p type="p">600:第一工作單元</p>  
        <p type="p">700:第二工作單元</p>  
        <p type="p">800:第三工作單元</p>  
        <p type="p">830:第一絕緣貫孔</p>  
        <p type="p">840:第二絕緣貫孔</p>  
        <p type="p">900:第四工作單元</p>  
        <p type="p">A-A,B-B,C-C,D-D:線段</p>  
        <p type="p">X,Y,Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1486" publication-number="202612644"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612644.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612644</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122371</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蓋體組件及其適用之殼體與膠囊感測器</chinese-title>  
        <english-title>COVER COMPONENT AND SHELL AND CAPSULE SENSOR THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">A61B5/145</main-classification>  
        <further-classification edition="200601120251230B">A61B5/00</further-classification>  
        <further-classification edition="200601120251230B">A61B5/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商道思倍司股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOTSPACE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓　威明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOW, UEI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴彥良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, YEN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於膠囊感測器的蓋體組件。所述蓋體組件位於所述膠囊感測器之一感測空間之一側。所述蓋體組件包含第一表面、第二表面、至少一第一孔、朝向所述感測空間的至少一第二孔、以及設置分別連通對應之所述第一孔與所述第二孔的至少一通孔路徑。其中所述通孔路徑在所述感測空間中的一虛擬流體導引路徑不接觸所述感測空間內的一感測面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cover component for a capsule sensor. The cover component is located on a side of a sensing space of the capsule sensor. The cover component comprises a first surface, a second surface, at least one first hole, at least one second hole facing the sensing space, and at least one through-hole path connected to the corresponding first hole and second hole. A virtual fluid guiding path of the through-hole path in the sensing space does not contact a sensing surface in the sensing space.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">120:蓋體組件</p>  
        <p type="p">1201:第一表面</p>  
        <p type="p">1202:第二表面</p>  
        <p type="p">1203:第一孔</p>  
        <p type="p">1204:第二孔</p>  
        <p type="p">1205:通孔路徑</p>  
        <p type="p">A2:感測空間</p>  
        <p type="p">112:感測端</p>  
        <p type="p">211:感測面</p>  
        <p type="p">VL:虛擬流體導引路徑</p>  
        <p type="p">SO:感測目標</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1487" publication-number="202614462"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614462.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614462</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122406</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有位於熱箱之氣流區之柱狀壓縮彈簧的電化學電池系統</chinese-title>  
        <english-title>ELECTROCHEMICAL CELL SYSTEM CONTAINING COLUMN COMPRESSION SPRINGS LOCATED IN AIR FLOW ZONE OF A HOTBOX</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251231B">H01M8/12</main-classification>  
        <further-classification edition="200601120251231B">F16F1/44</further-classification>  
        <further-classification edition="201601120251231B">H01M8/04701</further-classification>  
        <further-classification edition="201601120251231B">H01M8/04014</further-classification>  
        <further-classification edition="200601120251231B">F16F1/04</further-classification>  
        <further-classification edition="201601120251231B">H01M8/04082</further-classification>  
        <further-classification edition="201601120251231B">H01M8/0258</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商博隆能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLOOM ENERGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕特爾　希哈薩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATEL, SIDDHARTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楚卡　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETRUCHA, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>明　約書亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MING, JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索瑪桑德倫　普拉布</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOMASUNDARAM, PRABU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種電化學電池系統，其包括熱箱及位於該熱箱中之一或多個電化學電池柱。每個電化學電池柱包括至少一個電化學電池堆疊及位於該至少一個電化學電池堆疊上方之壓縮總成。該壓縮總成包括位於該熱箱之氣流區之金屬壓縮彈簧。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrochemical cell system includes a hotbox and one or more electrochemical cell columns located in the hotbox. Each electrochemical cell column includes at least one electrochemical cell stack and a compression assembly located above the at least one electrochemical cell stack. The compression assembly includes a metal compression spring located in an air flow zone of the hotbox.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:電化學電池柱</p>  
        <p type="p">50:負載衝柱</p>  
        <p type="p">51A:上部陶瓷負載板</p>  
        <p type="p">51B:下部陶瓷負載板</p>  
        <p type="p">52:陶瓷板</p>  
        <p type="p">61:壓縮彈簧</p>  
        <p type="p">62:彈簧殼體</p>  
        <p type="p">63:陶瓷頂部區塊或板</p>  
        <p type="p">102:電池堆疊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1488" publication-number="202614133"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614133.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614133</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122411</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多帶電粒子束描繪方法及多帶電粒子束描繪裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251105B">H01J37/317</main-classification>  
        <further-classification edition="200601120251105B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商紐富來科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUFLARE TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本裕史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森紳悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, SHINGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一態樣之多帶電粒子束描繪方法，其特徵為，將多帶電粒子束做陣列分割，而設定照射試料的描繪區域的一部分的特定區域之複數個射束群組，一面同時照射多帶電粒子束，一面對試料的描繪區域的特定區域以外的區域描繪圖案，一面依複數個射束群組的每一射束群組錯開照射時期一面以各前述射束群組的射束對試料的特定區域描繪圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1489" publication-number="202613629"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613629.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613629</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122423</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對於光子積體晶片的光纖附接方法</chinese-title>  
        <english-title>METHODS FOR OPTICAL FIBER ATTACHMENT TO PHOTONIC INTEGRATED CHIP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G02B6/255</main-classification>  
        <further-classification edition="200601120260102B">G02B6/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商爾雅實驗室公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AYAR LABS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊禮梵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, LI-FAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小格里利　阿爾伯特　澤特勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREELY JR., ALBERT ZETTLER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸　海偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, HAIWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, RUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　麗娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIJUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　劍明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, KEN JIAN MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">光纖設置在光子積體晶片 (PIC) 的光纖附接區域的V型槽內。結構黏著劑設置在PIC的光纖附接區域內的光纖的第一部分上方，而不設置在PIC的光纖附接區域內的光纖的第二部分上方。光學折射率匹配黏著劑設置在PIC的光纖附接區域內的光纖的第二部分上方。在結構黏著劑以及光學折射率匹配黏著劑固化之後，在其上設置緩衝結構。移除緩衝結構。光纖、結構黏著劑以及光學折射率匹配黏著劑在PIC的頂表面上方具有共同垂直高度，此共同垂直高度小於覆晶附接結構在PIC的頂表面上方的垂直高度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Optical fibers are disposed within v-grooves of an optical fiber attachment region of a photonic integrated chip (PIC). A structural adhesive is disposed over a first portion of the optical fibers within the optical fiber attachment region of the PIC without being disposed over a second portion of the optical fibers within the optical fiber attachment region of the PIC. An optical index matching adhesive is disposed over the second portion of the optical fibers within the optical fiber attachment region of the PIC. A buffer structure is disposed on the structural adhesive and the optical index matching adhesive as they are cured. The buffer structure is removed. The optical fibers, the structural adhesive, and the optical index matching adhesive have a collective vertical height above a top surface of the PIC that is less than a vertical height of flip-chip attachment structures on the top surface of the PIC.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:操作</p>  
        <p type="p">103:操作</p>  
        <p type="p">105:操作</p>  
        <p type="p">107:操作</p>  
        <p type="p">109:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1490" publication-number="202614233"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614233.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614233</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122517</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成分區電磁遮罩的封裝方法和電子封裝模組</chinese-title>  
        <english-title>PACKAGING METHOD FOR GENERATING PARTITIONED EM-SHIELDING AND AN ELECTRONIC PACKAGING MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">H01L21/50</main-classification>  
        <further-classification edition="200601120251231B">H01L21/56</further-classification>  
        <further-classification edition="200601120251231B">H01L23/31</further-classification>  
        <further-classification edition="200601120251231B">H01L23/552</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商環維電子(上海)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIVERSAL GLOBAL TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王益昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YIXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李瑤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了一種形成分區電磁遮罩的封裝方法和電子封裝模組，該方法包括：在基板的表面安裝至少兩個電子元件；在至少一組相鄰電子元件之間安裝用於電磁遮罩的金屬製件於基板上；採用熱壓模具對電子元件和金屬製件進行塑封，形成塑封體；其中，當模具合模時，金屬製件的頂端緊密貼合熱壓模具的上模，使塑封材料熔融時不會覆蓋金屬製件的頂端；塑封完成後，在塑封體外形成電磁遮罩層，電磁遮罩層同時覆蓋露出塑封體的金屬製件的表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a packaging method for generating partitioned EM-shielding and an electronic packaging module. The method comprising: installing at least two electronic components on a substrate surface; installing a metal component for EM-shielding on the substrate between at least one group of adjacent electronic components; utilizing a hot mold to plastic-encapsulate the electronic components and the metal component to form a plastic encapsulation; wherein, when the mold is closed, the top of the metal component is tightly abutted to the upper mold of the hot mold, so that melted encapsulating material does not cover the top of the metal component. After the plastic-encapsulation, an EM-shielding layer is formed outside the plastic encapsulation, which also covers the surface of the metal component exposed from the plastic encapsulation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100,S200,S300,S400:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1491" publication-number="202612758"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612758.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612758</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122518</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於電鍍設備的火災檢測方法及檢測系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">A62C3/16</main-classification>  
        <further-classification edition="200601120251229B">C25D21/12</further-classification>  
        <further-classification edition="202301120251229B">G06F18/2433</further-classification>  
        <further-classification edition="200601120251229B">G08B17/06</further-classification>  
        <further-classification edition="200601120251229B">A62C37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商盛美半導體設備(上海)股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石軼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>左經之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZUO, JINGZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任正博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REN, ZHENGBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金一諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, YINUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了一種用於電鍍設備的火災檢測方法及檢測系統，包括獲取電鍍模組電信號；若電鍍模組電信號正常，則確定電鍍模組無火災風險；若電鍍模組電信號異常，則啟動第一滅火器對電鍍模組滅火。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110,S120,S130,S140:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1492" publication-number="202612767"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612767.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612767</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122543</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>提供使用電子骰子的棒球桌遊的方法及使用該方法的計算裝置</chinese-title>  
        <english-title>METHOD OF PROVIDING A BASEBALL BOARD GAME USING AN ELECTRONIC DICE AND COMPUTING DEVICE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">A63F9/04</main-classification>  
        <further-classification edition="200601120251230B">A63B67/04</further-classification>  
        <further-classification edition="200601120251230B">A63B67/00</further-classification>  
        <further-classification edition="200601120251230B">A63F7/06</further-classification>  
        <further-classification edition="200601120251230B">G09B19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＤＫ實驗室股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DK LAB CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高汀錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHO, JEONG SUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種提供使用電子骰子的棒球桌遊的方法，更具體地公開一種方法，其包括：（a）在第1投手信息至第n投手信息和第1擊球員信息至第m擊球員信息記錄在數據庫中的狀態下，計算裝置（i）將該第1投手信息至該第n投手信息從該數據庫傳輸到由防守方玩家操作的防守方設備，通過在該防守方設備的屏幕上顯示該第1投手信息至該第n投手信息來支持選擇多個出場投手，（ii）將該第1擊球員信息至該第m擊球員信息從該數據庫傳輸到由攻擊方玩家操作的攻擊方設備，通過在該攻擊方設備的屏幕上顯示該第1擊球員信息至該第m擊球員信息來支持選擇多個出場擊球員，並支持確定該多個出場擊球員各自的每個打擊順序信息，其中，該第1投手信息至該第n投手信息分別包括各自的平均自責分信息、各自的被安打率信息、各自的被安打數信息、各自的被本壘打數信息、各自的三振數信息、各自的四壞球數信息、各自的勝場數信息和各自的敗場數信息中的至少一部分，該第1擊球員信息至該第m擊球員信息分別包括各自的打擊率信息、各自的上壘率信息、各自的長打率信息、各自的打數信息、各自的安打數信息、各自的二壘打數信息、各自的三壘打數信息和各自的本壘打數信息中的至少一部分；（b）若選擇該出場投手和該出場擊球員並確定該打擊順序信息，則該計算裝置執行以下中的任一個過程：（i）第1過程，使安裝在第1模式用電子骰子內部的運算模塊參考該出場投手中的當前投手信息和該出場擊球員中的當前擊球員信息，計算通過安裝在該第1模式用電子骰子全部面中至少一部分面上的可變屏幕待顯示的每個可變屏幕的第1運算信息值；以及（ii）第2過程，參考該當前投手信息和該當前擊球員信息計算每個該可變屏幕的第2運算信息值並將其傳輸到該第1模式用電子骰子；以及（c）該計算裝置支持通過該可變屏幕暴露每個該可變屏幕的第1運算信息值或每個該可變屏幕的第2運算信息值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S201:步驟1</p>  
        <p type="p">S202:步驟2</p>  
        <p type="p">S203:步驟3</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1493" publication-number="202614885"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614885.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614885</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122545</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光顯示元件及包含其之顯示裝置及電子裝置</chinese-title>  
        <english-title>LIGHT EMITTING ELEMENT AND DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260102B">H10H20/84</main-classification>  
        <further-classification edition="202501120260102B">H10H20/819</further-classification>  
        <further-classification edition="202501120260102B">H10H20/831</further-classification>  
        <further-classification edition="202501120260102B">H10H20/81</further-classification>  
        <further-classification edition="202501120260102B">H10H29/01</further-classification>  
        <further-classification edition="200601120260102B">H01L25/075</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星顯示器有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙顯敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, HYUN MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金仁赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, IN HYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈泳出</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIM, YOUNG CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晉台夏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, TAE HA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔瀅洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, HYEONG SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種發光元件，包含：一第一半導體層，摻雜有一n型摻雜劑；一第二半導體層，設置在該第一半導體層上，且摻雜有一p型摻雜劑；一主動層，位於該第一半導體層及該第二半導體層之間；一電極層，設置在該第二半導體層上；以及一絕緣膜，圍繞至少該主動層的外表面。該第一半導體層的直徑在約0.5µm至約10µm的範圍內，該絕緣膜包含：一第一層，圍繞該第一半導體層、該第二半導體層及該主動層；以及一第二層，設置在該第一層上且包含氮化鋁(AlN)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light emitting element includes a first semiconductor layer doped with an n-type dopant, a second semiconductor layer disposed on the first semiconductor layer and doped with a p-type dopant, an active layer between the first semiconductor layer and the second semiconductor layer, an electrode layer disposed on the second semiconductor layer, and an insulating film surrounding an outer surface of at least the active layer. A diameter of the first semiconductor layer is in a range of about 0.5 µm to about 10 µm, and the insulating film includes a first layer surrounding the first semiconductor layer, the second semiconductor layer, and the active layer and a second layer disposed on the first layer and including aluminum nitride (AlN).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31:第一半導體層，半導體層</p>  
        <p type="p">32:第二半導體層，半導體層</p>  
        <p type="p">36:主動層，半導體層</p>  
        <p type="p">37:電極層，半導體層</p>  
        <p type="p">38:絕緣膜</p>  
        <p type="p">ED:發光元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1494" publication-number="202613018"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613018.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613018</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122632</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>纜線放線裝置、纜線放線方法以及纜線放線裝置之準備方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">B65H59/06</main-classification>  
        <further-classification edition="200601120251224B">B65D85/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商藤倉股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIKURA LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前原直也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEHARA, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鯰江彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMAZUE, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種能夠抑制纜線扭結發生以及纜線不穩定的纜線放線裝置。 &lt;br/&gt;[解決方案]纜線放線裝置1包括：容器20，包括收容纜線束10的收容空間27；導引件30，配置於纜線束10上方，並且引導從纜線束10拉出的纜線11；以及通線部40，具有纜線11通過的通線口41，並且設置在導引件30與敷設開始點50之間，通線口41的內徑D&lt;sub&gt;8&lt;/sub&gt;小於纜線束10的捲繞直徑D&lt;sub&gt;1&lt;/sub&gt;，導引件30與通線部40能夠收容在收容空間27。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:纜線放線裝置</p>  
        <p type="p">10:纜線束</p>  
        <p type="p">11:纜線</p>  
        <p type="p">20:容器</p>  
        <p type="p">21:底部</p>  
        <p type="p">22:前壁</p>  
        <p type="p">23:側壁</p>  
        <p type="p">25:後壁</p>  
        <p type="p">27:收容空間</p>  
        <p type="p">28:開口</p>  
        <p type="p">30:導引件</p>  
        <p type="p">40:通線部</p>  
        <p type="p">41:通線口</p>  
        <p type="p">42,43:基座</p>  
        <p type="p">44,45:傾斜壁</p>  
        <p type="p">46:設置配重</p>  
        <p type="p">50:敷設開始點</p>  
        <p type="p">261:蓋板</p>  
        <p type="p">261a:彎折線</p>  
        <p type="p">441,451:貫通孔</p>  
        <p type="p">FP:地面</p>  
        <p type="p">L&lt;sub&gt;1&lt;/sub&gt;:間隔</p>  
        <p type="p">L&lt;sub&gt;4&lt;/sub&gt;:距離</p>  
        <p type="p">VL:假想直線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1495" publication-number="202614207"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614207.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614207</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122658</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>瓶狀特徵部的蝕刻</chinese-title>  
        <english-title>ETCHING OF A BOTTLE-SHAPED FEATURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">H01L21/3065</main-classification>  
        <further-classification edition="200601120251216B">H01L21/3213</further-classification>  
        <further-classification edition="200601120251216B">H01L21/311</further-classification>  
        <further-classification edition="200601120251216B">C23F1/02</further-classification>  
        <further-classification edition="200601120251216B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊文兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, WENBING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉姆拿尼　潘卡吉　甘夏姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMNANI, PANKAJ GHANSHYAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉沛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, PEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　暹華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, SAMANTHA SIAMHWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　瑩我</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YOUNG AH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川口　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAGUCHI, MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒　夢楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, MENGNAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加尼　尼古拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANI, NICOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅大宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, TA-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬塞爾懷特　那森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUSSELWHITE, NATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安薩里　納維德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANSARI, NAVEED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱唯曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, WEIYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文範例係提供一種將特徵部蝕刻入基板上之材料層的方法。該方法包含藉由在材料層中執行第一定向蝕刻至第一深度來形成特徵部之第一部分；在特徵部之第一部分的側壁上形成蝕刻停止襯層；以及藉由在材料層中執行第二定向蝕刻至第二深度來形成特徵部之第二部分，接著執行各向同性蝕刻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One example provides a method of etching a feature into a material layer on a substrate. The method comprises forming a first portion of the feature by performing a first directional etch to a first depth in the material layer, forming an etch stop liner on sidewalls of the first portion of the feature, and forming a second portion of the feature by performing a second directional etch to a second depth in the material layer, followed by performing an isotropic etch.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">402:步驟</p>  
        <p type="p">404:步驟</p>  
        <p type="p">406:步驟</p>  
        <p type="p">408:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1496" publication-number="202612604"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612604.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612604</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122659</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>扣具</chinese-title>  
        <english-title>BUCKLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">A44B11/25</main-classification>  
        <further-classification edition="200601120251230B">B60R22/02</further-classification>  
        <further-classification edition="200601120251230B">B60R22/10</further-classification>  
        <further-classification edition="200601120251230B">B60R22/18</further-classification>  
        <further-classification edition="200601120251230B">E05B57/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮軍靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, JUNJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡問渠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, WENQU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開了一種扣具。該扣具包括公扣，具有被卡合部；母扣，包括殼體、蓋件及鎖定件，所述殼體和所述蓋件包圍一容納空間，所述鎖定件能活動地設置在所述容納空間，所述鎖定件具有卡合部，所述卡合部具有與所述被卡合部鎖定的鎖定位置以及與所述被卡合部釋鎖的釋鎖位置；釋鎖操作件，能活動地設置於所述母扣以選擇性地致動所述卡合部與所述被卡合部釋鎖，其中，所述蓋件或所述鎖定件設置有彈性件，所述彈性件對所述卡合部施加朝向所述鎖定位置的力。本申請提供的扣具結構簡單、重量輕且組裝成本低。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a buckle, including a male buckle having an engaged portion; a female buckle including a shell, a cover, and a locking member, the shell and the cover enclosing an accommodation space, the locking member being movably disposed within the accommodation space, the locking member having an engaging portion, the engaging portion having a locked position in which it is locked with the engaged portion and an unlocked position in which it is unlocked from the engaged portion; and an unlocking operation member, which is movably disposed on the female buckle to selectively actuate the engaging portion to be unlocked from the engaged portion. The cover or the locking member is provided with an elastic member which applies a force to the engaging portion in a direction towards the locked position. The present disclosure provides a buckle with simple structure, light weight, and low assembly cost.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:扣具</p>  
        <p type="p">10:母扣</p>  
        <p type="p">111:胯帶固定孔</p>  
        <p type="p">20:第一公扣</p>  
        <p type="p">210:肩帶固定孔</p>  
        <p type="p">230:腰帶固定孔</p>  
        <p type="p">240:織帶扣</p>  
        <p type="p">30:第二公扣</p>  
        <p type="p">330:腰帶固定孔</p>  
        <p type="p">340:織帶扣</p>  
        <p type="p">40:釋鎖操作件</p>  
        <p type="p">A、B:線</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1497" publication-number="202613291"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613291.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613291</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122663</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置用處理液</chinese-title>  
        <english-title>PROCESSING SOLUTION FOR SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">C11D7/32</main-classification>  
        <further-classification edition="200601120251218B">C09K13/08</further-classification>  
        <further-classification edition="200601120251218B">C23F1/26</further-classification>  
        <further-classification edition="200601120251218B">H01L21/311</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京應化工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name/>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMIKI, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯岡淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIOKA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田島和哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAJIMA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供鈷原子含有層及鎢原子含有層的防腐蝕性優異，且氟系殘渣的去除性優異之半導體裝置用處理液。 &lt;br/&gt;　　作為本發明的解決手段，為提供一種含有：含氟化合物、環狀醚化合物、二胺基烷烴、水的半導體裝置用處理液。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1498" publication-number="202613340"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613340.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613340</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122674</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板平台及具備有基板平台之磁控濺鍍裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">C23C14/50</main-classification>  
        <further-classification edition="200601120251219B">C23C14/35</further-classification>  
        <further-classification edition="200601120251219B">H01L23/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛發科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ULVAC, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北沢僚也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAZAWA, RYOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高木大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAGI, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 提供一種「能同時實現面內均勻性良好地將矩形基板加熱至預定溫度這樣的功能與對基板的中央部與外周緣部之間附加預定溫度梯度這樣的功能」之基板平台(ST)。 &lt;br/&gt;　　[解決手段] 構成為具備有：平台本體(6)，設置有基板；及加熱器(7)，藉由熱傳導，對基板進行加熱。平台本體之上面被區劃成內包其中心的中央區域(Cz)與包圍該中央區域的周邊區域(Sz)。周邊區域具有：第1周邊區域(Sz1)，位於中央區域之Y軸方向兩側；及第2周邊區域(Sz2)，位於其X軸方向兩側。針對中央區域、第1周邊區域及第2周邊區域分別設置加熱器，在使各加熱器動作而加熱基板時，第1周邊區域之發熱量低於中央區域的發熱量，且第2周邊區域之發熱量低於第1周邊區域的發熱量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6:平台本體</p>  
        <p type="p">7:加熱器</p>  
        <p type="p">7a:第1加熱器</p>  
        <p type="p">7b:第2加熱器</p>  
        <p type="p">7c:第3加熱器</p>  
        <p type="p">7d:第4加熱器</p>  
        <p type="p">Cz:中央區域</p>  
        <p type="p">Cz1:主區域</p>  
        <p type="p">Cz2:副區域</p>  
        <p type="p">Sg:基板</p>  
        <p type="p">Sz:周邊區域</p>  
        <p type="p">Sz1:第1周邊區域</p>  
        <p type="p">Sz2:第2周邊區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1499" publication-number="202612962"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612962.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612962</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122678</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自行車前叉冠</chinese-title>  
        <english-title>BICYCLE FORK CROWN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">B62K21/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商迪卡儂公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DECATHLON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波德瑞爾　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOURDREL, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹茹　亞利桑卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DANJOU, ALEXANDRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查特萊恩　艾迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHATELAIN, EDDY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種自行車前叉冠，其包含其中形成一中央管道(2)之一中央部分(1)、以及兩個橫向臂(4)，每一橫向臂具有攜載一橫向管道(6)之一遠端部分(5)，該等橫向及中央管道沿著一垂直軸線延伸，同時每一管道通往分別形成在該前叉冠之上部面及下部面(7b)中之孔口(2a、2b、6a、6b)，該等面被分開在一垂直方向上量測之一材料厚度，至少一個腔(16&lt;sub&gt;i&lt;/sub&gt;、16&lt;sub&gt;m&lt;/sub&gt;、16&lt;sub&gt;e&lt;/sub&gt;)安置在一各別面(7b)之兩個垂直相對區域之間，同時呈現一開口(17&lt;sub&gt;i&lt;/sub&gt;、17&lt;sub&gt;m&lt;/sub&gt;、17&lt;sub&gt;e&lt;/sub&gt;)，該開口形成在該等區域中之一者中且延伸至在一垂直方向上量測的小於該等區域之間的該厚度之80%的一深度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a bicycle fork crown, comprising a central part (1) in which a central duct (2) is formed and two lateral arms (4) each having a distal portion (5) carrying a lateral duct (6), said lateral and central ducts extending along a vertical axis while each opening into orifices (2a, 2b, 6a, 6b) formed respectively in the upper and lower faces (7b) of said fork crown, said faces being separated by a thickness of material measured in a vertical direction, at least one cavity (16&lt;sub&gt;i&lt;/sub&gt;, 16&lt;sub&gt;m&lt;/sub&gt;, 16&lt;sub&gt;e&lt;/sub&gt;) being disposed between two vertically opposed zones of a respective face (7b), while presenting an opening (17&lt;sub&gt;i&lt;/sub&gt;, 17&lt;sub&gt;m&lt;/sub&gt;, 17&lt;sub&gt;e&lt;/sub&gt;) formed in one of said zones and extending over a depth measured in a vertical direction which is less than 80% of the thickness between said zones.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:中央部分</p>  
        <p type="p">2:中央管道</p>  
        <p type="p">2a:孔口、上部孔口</p>  
        <p type="p">2b:孔口</p>  
        <p type="p">4:臂、橫向臂</p>  
        <p type="p">5:遠端部分</p>  
        <p type="p">6:橫向管道</p>  
        <p type="p">6a:孔口、上部孔口</p>  
        <p type="p">6b:孔口、下部孔口</p>  
        <p type="p">7b:下部面、下部側、面</p>  
        <p type="p">14:平坦部</p>  
        <p type="p">16&lt;sub&gt;e&lt;/sub&gt;:腔、外部腔</p>  
        <p type="p">16&lt;sub&gt;i&lt;/sub&gt;:腔、內部腔</p>  
        <p type="p">16&lt;sub&gt;m&lt;/sub&gt;:腔、中央腔</p>  
        <p type="p">17&lt;sub&gt;e&lt;/sub&gt;:開口、外部開口</p>  
        <p type="p">17&lt;sub&gt;i&lt;/sub&gt;:開口</p>  
        <p type="p">17&lt;sub&gt;m&lt;/sub&gt;:開口、中央開口、五邊形開口</p>  
        <p type="p">18:頂點</p>  
        <p type="p">19:側邊</p>  
        <p type="p">20:倒圓角立邊</p>  
        <p type="p">24:加強肋、肋</p>  
        <p type="p">25:肋</p>  
        <p type="p">D:橫向方向</p>  
        <p type="p">L:縱向平面</p>  
        <p type="p">T:對稱垂直及橫向平面、垂直平面、平面、對稱垂直平面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1500" publication-number="202613455"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613455.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613455</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122700</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>燃燒器及具備其的鍋爐</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">F23D14/48</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI HEAVY INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川元昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMOTO, NOBORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩田&amp;#55395;&amp;#56979;</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWATA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗原誠矢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURIHARA, SEIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種燃燒器，即使使用液化氣體燃料的情況，仍可以抑制熱衝擊和氣阻。燃燒器(21)，具備：噴嘴本體(60)，朝向火爐(11)將液化氨燃料(L)噴射；及外管(60c、64c)，將溫度比流動於噴嘴本體(60)外側的燃燒用空氣(A1)更低的外氣(A2)沿著噴嘴本體(60)的外周面導引。噴嘴本體(60)，具備：內管(60b)、及將內管(60b)的周圍覆蓋地設置的外管(60c)，在內管(60b)及外管(60c)之間被導引外氣(A2)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:火爐</p>  
        <p type="p">21:燃燒器</p>  
        <p type="p">60:噴嘴本體</p>  
        <p type="p">60a:前端部</p>  
        <p type="p">60b:內管</p>  
        <p type="p">60c:外管(冷卻流體供給手段)</p>  
        <p type="p">61:油噴嘴隔間</p>  
        <p type="p">62:風箱</p>  
        <p type="p">62a:側壁</p>  
        <p type="p">64:主管</p>  
        <p type="p">64b:內管</p>  
        <p type="p">64c:外管(冷卻流體供給手段)</p>  
        <p type="p">66:燃燒用空氣噴嘴</p>  
        <p type="p">A1:燃燒用空氣</p>  
        <p type="p">A2:外氣(冷卻流體)</p>  
        <p type="p">L:液化氨燃料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1501" publication-number="202613120"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613120.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613120</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122741</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>GIP受體促效劑化合物</chinese-title>  
        <english-title>GIP RECEPTOR AGONIST COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D487/04</main-classification>  
        <further-classification edition="200601120260102B">C07D471/04</further-classification>  
        <further-classification edition="200601120260102B">C07D401/14</further-classification>  
        <further-classification edition="200601120260102B">C07D231/12</further-classification>  
        <further-classification edition="200601120260102B">C07D519/00</further-classification>  
        <further-classification edition="200601120260102B">A61K31/519</further-classification>  
        <further-classification edition="200601120260102B">A61K31/444</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4439</further-classification>  
        <further-classification edition="200601120260102B">A61K31/415</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4985</further-classification>  
        <further-classification edition="200601120260102B">A61K31/53</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4375</further-classification>  
        <further-classification edition="200601120260102B">A61K31/506</further-classification>  
        <further-classification edition="200601120260102B">A61P3/04</further-classification>  
        <further-classification edition="200601120260102B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美國禮來大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELI LILLY AND COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢歐錢普　湯瑪斯　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEAUCHAMP, THOMAS JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝赫納　道格拉斯　卡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEHENNA, DOUGLAS CARL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布特勒　瑪麗亞　德　皮拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUTELER, MARIA DEL PILAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢伯思　瑞秋　凱瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAMBERS, RACHEL KATHERINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　招根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHAOGEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　界豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIEHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哲亞古　弗群　奧圖寇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DZEAGU, FORTUNE OTUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢柏　艾瑞克　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEMBRE, ERIK JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃有銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YOUMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑特　卡里納　伊方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JETTE, CARINA IVONNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫利許　史蒂芬　李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUKLISH, STEVEN LEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅根諾　伊森　林德賽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAGNO, ETHAN LINDSAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>摩爾　麥斯威爾　強森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOORE, MAXWELL JOHNSON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路克　保羅　文生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUCKER, PAUL VINCENT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史奇米特　丹尼爾　科普立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMITT, DANIEL COPLEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維德勒　路易斯　羅賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIDLER, LEWIS ROBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="17"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙改英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, GAIYING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供下式化合物： &lt;br/&gt;&lt;img align="absmiddle" height="125px" width="274px" file="ed11270.JPG" alt="ed11270.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;及其醫藥學上可接受之鹽，以及包含此等化合物之醫藥組合物及其治療II型糖尿病及肥胖症之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides compounds of the formula: &lt;br/&gt;&lt;img align="absmiddle" height="126px" width="292px" file="ed11271.JPG" alt="ed11271.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;and their pharmaceutically acceptable salts, as well as pharmaceutical compositions comprising these compounds and their use in the treatment of type II diabetes mellitus and obesity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1502" publication-number="202613221"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613221.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613221</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122742</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多孔質結構體、裝置及多孔質結構體的製造方法</chinese-title>  
        <english-title>POROUS STRUCTURE, DEVICE, AND METHOD FOR FABRICATING A POROUS STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">C08J9/232</main-classification>  
        <further-classification edition="200601120251223B">C08J7/02</further-classification>  
        <further-classification edition="200601120251223B">C08J3/075</further-classification>  
        <further-classification edition="201601120251223B">H01M8/023</further-classification>  
        <further-classification edition="201601120251223B">H01M8/1062</further-classification>  
        <further-classification edition="201701120251223B">B29C64/10</further-classification>  
        <further-classification edition="200601120251223B">C08F2/48</further-classification>  
        <further-classification edition="200601120251223B">B01J2/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成田海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARITA, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成田海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARITA, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種多孔質結構體，係藉由熱處理聚合物結構體而製作，且具有內壁以極小曲面形成的流徑週期性重複之週期結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A porous structure according to the present invention is fabricated by heat-treating a polymer structure. The porous structure has a periodic structure in which channels with inner walls formed by minimal curved surfaces are periodically repeated.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1a:孔部</p>  
        <p type="p">1b:流徑</p>  
        <p type="p">1c:內部結構</p>  
        <p type="p">d1,d2:孔徑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1503" publication-number="202613492"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613492.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613492</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122757</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>位置檢測裝置、描繪裝置以及位置檢測方法</chinese-title>  
        <english-title>POSITION DETECTION APPARATUS, DRAWING APPARATUS, AND POSITION DETECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">G01B11/06</main-classification>  
        <further-classification edition="202101120251219B">G02B7/28</further-classification>  
        <further-classification edition="201401120251219B">G01N21/55</further-classification>  
        <further-classification edition="200601120251219B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辻和輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUJI, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">膜位置檢測部係在反射光的光量分布中檢測到峰間距離比預先設定的預定間隔還要大的兩個以上的山部時，將該兩個以上的山部中的上下方向中與最上側對應的一個山部(78)的峰(781)作為選擇峰，該選擇峰為與膜反射光對應的山部的峰。膜位置檢測部係提取該反射光的光量分布中以選擇峰作為中心而於峰間臨限值的兩倍以下的提取寬度(B)的範圍所包含的部分作為膜光量分布。膜位置檢測部係基於該膜光量分布求出膜的上表面的上下方向中的位置。藉此，能精密度佳地求出膜的上表面的上下方向中的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">When two or more mountainous portions with a peak-to-peak distance greater than a predetermined interval are detected in the light intensity distribution of the reflected light, the membrane position detection part makes the peak (781) of one mountainous portion (78) corresponding to the most upper side in the vertical direction out of said two or more mountainous portions as the selection peak. The selection peak is the peak of the mountainous portion corresponding to the membrane-reflected light. The membrane position detection part extracts a portion of the light intensity distribution of said reflected light that is included within the extraction width (B), which is less than twice the peak-to-peak threshold value, centered on the selected peak, as the membrane light intensity distribution. The membrane position detection part determines the position of the upper surface of the membrane in the vertical direction based on said membrane light intensity distribution. This allows the position of the upper surface of the membrane in the vertical direction to be determined with high accuracy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">78,79:山部</p>  
        <p type="p">781,791:峰</p>  
        <p type="p">B:提取寬度(預定寬度)</p>  
        <p type="p">D1:峰間距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1504" publication-number="202612820"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612820.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612820</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122765</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>硬脆性材用之長鑽頭</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B23B51/06</main-classification>  
        <further-classification edition="200601120251229B">B23P15/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商芝技研股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBA R&amp;D CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福島大二郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUSHIMA, DAIJIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河又文春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMATA, FUMIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種適合於在硬脆性材料之製品鑽出小徑之深孔的新穎構成之硬脆性材用之長鑽頭。 &lt;br/&gt;以具備鑽頭部3、與該鑽頭部3之後端連續而形成之筆直部5、及安裝於該筆直部5之軸部7之方式構成長鑽頭1。由與鑽頭部3之基端部13連續而設置之導引部17、和自該導引部17之後端延伸之連接用延長部19一體地形成筆直部5，將圓筒狀之軸部7嵌附於連接用延長部19之外周而藉此安裝於筆直部5。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:長鑽頭</p>  
        <p type="p">3:鑽頭部</p>  
        <p type="p">5:筆直部</p>  
        <p type="p">7:軸部</p>  
        <p type="p">9:切刃</p>  
        <p type="p">11:前端部</p>  
        <p type="p">13:基端部</p>  
        <p type="p">15:排出槽</p>  
        <p type="p">17:導引部</p>  
        <p type="p">19:連接用延長部</p>  
        <p type="p">21:角部</p>  
        <p type="p">23:黏著劑</p>  
        <p type="p">27:內側孔部</p>  
        <p type="p">31:冷卻劑吐出孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1505" publication-number="202614332"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614332.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614332</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122814</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251008B">H01L21/68</main-classification>  
        <further-classification edition="200601120251008B">H01L21/67</further-classification>  
        <further-classification edition="200601120251008B">G05B19/402</further-classification>  
        <further-classification edition="200601120251008B">B05B1/30</further-classification>  
        <further-classification edition="200601120251008B">B08B3/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡部亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKABE, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種可抑制供給至基板之一主面之處理液朝基板之另一主面迴繞之技術。 &lt;br/&gt;本發明之基板處理裝置100包含：基座板11；位置規制銷13，其在基座板11上方對基板9進行位置規制；旋轉機構14，其使基座板11繞旋轉軸線J1旋轉；處理液供給部2，其朝基板9之上表面供給處理液；噴出路32，其自設置於基座板11之第1開口32a跨及朝基座板11之上表面111側開口之第2開口32b，在基座板11內延伸；及氣體供給部303，其使氣體流入第1開口32a且自第2開口32b噴出；且自第1開口32a往第2開口部32b之噴出路32之延伸方向K，自上方觀察，為相對於通過旋轉軸線J1與第1開口32a之假想直線D朝基座板11之旋轉方向R之下游側傾斜之方向。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:基座板</p>  
        <p type="p">13:位置規制銷</p>  
        <p type="p">32,32A:噴出路</p>  
        <p type="p">32a:第1開口</p>  
        <p type="p">32b:第2開口</p>  
        <p type="p">D:假想直線</p>  
        <p type="p">J1:(軸線)旋轉軸線</p>  
        <p type="p">K:延伸方向</p>  
        <p type="p">R:旋轉方向</p>  
        <p type="p">V1:速度成分(第1速度成分)</p>  
        <p type="p">V2:速度成分(第2速度成分)</p>  
        <p type="p">Vh:水平速度成分</p>  
        <p type="p">θ1:傾斜角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1506" publication-number="202613177"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613177.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613177</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122821</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>GIPR抗體及其與GLP-1的融合蛋白質，以及其藥物組合物和應用</chinese-title>  
        <english-title>GIPR ANTIBODY AND GLP-1 FUSION PROTEIN THEREOF, AND THEIR PHARMACEUTICAL COMPOSITIONS AND THERAPEUTIC APPLICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/28</main-classification>  
        <further-classification edition="200601120260102B">C07K14/605</further-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="200601120260102B">A61K38/26</further-classification>  
        <further-classification edition="200601120260102B">A61P1/16</further-classification>  
        <further-classification edition="200601120260102B">A61P3/04</further-classification>  
        <further-classification edition="200601120260102B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國大陸商鴻運華寧（杭州）生物醫藥有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GMAX BIOPHARM LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>章華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪笑峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIAOFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藥晨江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, CHENJIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>景　書謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JING, SHUQIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚金梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供GIPR抗體及其與GLP-1之融合蛋白質，以及其藥物組合物。本文還提供了GIPR抗體及其與GLP-1之融合蛋白質用於治療、預防或改善非酒精性脂肪性肝病、非酒精性脂肪性肝炎、二型糖尿病或肥胖症之一或多種症狀之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1507" publication-number="202614145"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614145.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614145</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122831</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於晶圓處理系統的分離電路</chinese-title>  
        <english-title>SPLITTER CIRCUIT FOR WAFER PROCESSING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓蒙得四世　愛德華Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMMOND IV, EDWARD P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫姆　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUMOU, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏梅薩拉　烏彭德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMMETHALA, UPENDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露描述了一種半導體晶圓處理系統，該系統使用分離電路將RF電力從電源傳送至多個處理腔室。該晶圓處理系統包括第一處理腔室、第二處理腔室、電源、匹配電路及分離電路。該電源產生電流。該匹配電路接收來自該電源的該電流並向該電源呈現阻抗。該分離電路包括第一支腿和第二支腿。該第一支腿包括第一電容器，該第一電容器將該電流的第一部分從該匹配電路引導至該第一處理腔室。該第二支腿包括第二電容器，該第二電容器將該電流的第二部分從該匹配電路引導至該第二處理腔室。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure describes a semiconductor wafer processing system that uses a splitter circuit to delivery RF power from a power supply to multiple process chambers. The wafer processing system includes a first process chamber, a second process chamber, a power supply, a match circuit, and a splitter circuit. The power supply produces an electric current. The match circuit receives the electric current from the power supply and presents an impedance to the power supply. The splitting circuit includes a first leg and a second leg. The first leg includes a first capacitor that directs a first portion of the electric current from the match circuit to the first process chamber. The second leg includes a second capacitor that directs a second portion of the electric current from the match circuit to the second process chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:處理腔室</p>  
        <p type="p">183:電源</p>  
        <p type="p">200:電力輸送電路</p>  
        <p type="p">202:電路</p>  
        <p type="p">204:分離電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1508" publication-number="202614255"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614255.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614255</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114122997</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>關鍵尺寸測量中之線性之評估</chinese-title>  
        <english-title>EVALUATION OF LINEARITY IN CRITICAL DIMENSION MEASUREMENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H01L21/66</main-classification>  
        <further-classification edition="201801120251217B">G01N23/2251</further-classification>  
        <further-classification edition="200601120251217B">H01J37/28</further-classification>  
        <further-classification edition="201701120251217B">G06T7/60</further-classification>  
        <further-classification edition="200601120251217B">G06F17/18</further-classification>  
        <further-classification edition="200601120251217B">G01B15/00</further-classification>  
        <further-classification edition="202401120251217B">G06T5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫什瓦哈　里沙布　辛格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSHWAHA, RISHABH SINGH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希迪　亞瓊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEGDE, ARJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉米尼　拉馬坎司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMINI, RAMAKANTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傑因　爾皮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAIN, ARPIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">對一工件之一影像上一特徵之一量變曲線應用一高斯傳遞函數，該影像係使用一電子束計量工具而產生。此會產生一輸出量變曲線。判定該輸出量變曲線之非線性。可選擇兩個臨限值並將其標繪於一XY平面上。判定該等臨限值之一斜率與一比較值之接近度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A Gaussian transfer function is applied to a profile of a feature on an image of a workpiece generated using an electron beam metrology tool. This generates an output profile. Non-linearity of the output profile is determined. Two threshold values can be selected and plotted on an XY plane. Proximity of a slope of the threshold values to a comparison value is determined.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1509" publication-number="202613679"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613679.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613679</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123005</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>玻璃物品的製造方法、及玻璃物品的製造裝置</chinese-title>  
        <english-title>METHOD FOR PRODUCING GLASS ARTICLE AND DEVICE FOR PRODUCING GLASS ARTICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251220B">G02F1/1333</main-classification>  
        <further-classification edition="200601120251220B">G01N3/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本電氣硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲山尚利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INAYAMA, NAOTOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的玻璃物品的製造方法具備積層片準備步驟及彎曲變形試驗步驟，積層片準備步驟會準備積層片（G2），積層片（G2）具有支撐片（P1）及載置在支撐片（P1）上的玻璃片（G1），彎曲變形試驗步驟會對玻璃片（G1）進行彎曲變形試驗。彎曲變形試驗步驟中，在積層片（G2）的玻璃片（G1）未接觸到支撐片（P1）以外的構件的狀態下進行積層片（G2）的彎曲變形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">G1:玻璃片</p>  
        <p type="p">G2:積層片</p>  
        <p type="p">P1:支撐片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1510" publication-number="202613965"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613965.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613965</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123007</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>點雲處理裝置和點雲處理方法</chinese-title>  
        <english-title>POINT CLOUD PROCESSING DEVICE AND POINT CLOUD PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250701B">G06T5/50</main-classification>  
        <further-classification edition="202401120250701B">G06T5/70</further-classification>  
        <further-classification edition="202201120250701B">G06V20/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商富士康科技集團有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOXCONN TECHNOLOGY GROUP CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗永徽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUNG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉慎軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, SHEN-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林沂蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YI-RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊凱霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KAI-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董曉云</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, XIAOYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪　建平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIANPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種點雲處理裝置和點雲處理方法。點雲處理方法包含：接收垂直掃描點雲；對垂直掃描點雲執行隨機抽樣一致演算法以取得擬合平面；根據擬合平面過濾垂直掃描點雲中的第一地面點以更新垂直掃描點雲；以及根據更新的垂直掃描點雲產生處理點雲，並輸出處理點雲。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A point cloud processing device and a point cloud processing method are provided. The point cloud processing method includes: receiving a vertically scanned point cloud; performing random sample consensus algorithm on the vertically scanned point cloud to obtain a fitting plane; filtering a first ground point of the vertically scanned point cloud according to the fitting plane to update the vertically scanned point cloud; and generating a processed cloud point according to the updated vertically scanned point cloud and outputting the processed cloud point.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S501,S502,S503,S504:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1511" publication-number="202613601"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613601.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613601</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123052</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>防眩片、片狀物品、偏光板、顯示裝置、面板、防眩片之選定方法及防眩片之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">G02B5/02</main-classification>  
        <further-classification edition="200601120251223B">B32B3/30</further-classification>  
        <further-classification edition="200601120251223B">B29C59/02</further-classification>  
        <further-classification edition="200601120251223B">B29C35/02</further-classification>  
        <further-classification edition="200601120251223B">B32B27/00</further-classification>  
        <further-classification edition="200601120251223B">G02B1/12</further-classification>  
        <further-classification edition="200601120251223B">G02F1/1335</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大日本印刷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷口幸夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIGUCHI, YUKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関戶雅幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKIDO, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大川晃次郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOKAWA, KOUJIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河本和樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMOTO, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">防眩片，包含在第1方向上相向的第1面及第2面。防眩片，包括包含凹凸面的防眩層。凹凸面，在第1方向上和第2面朝向相反側。防眩層，包含構成凹凸面的複數個單位要素部。複數個單位要素部中的各者的剖面輪廓，在中央部為朝上凸且在連接於中央部的周邊部為朝下凸，或在中央部為朝下凸且在周邊部為朝上凸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:防眩片</p>  
        <p type="p">11:第1面</p>  
        <p type="p">11X:凹凸面</p>  
        <p type="p">65:顯示裝置</p>  
        <p type="p">66:顯示元件</p>  
        <p type="p">66a:影像形成面</p>  
        <p type="p">D1:第1方向</p>  
        <p type="p">D2:第2方向</p>  
        <p type="p">D3:第3方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1512" publication-number="202612588"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612588.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612588</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123079</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>食品麵糰寬度調整方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">A21C3/04</main-classification>  
        <further-classification edition="200601120251231B">A21C5/08</further-classification>  
        <further-classification edition="200601120251231B">A21C9/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商雷恩自動機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RHEON AUTOMATIC MACHINERY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>酒井孝雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAI, TAKAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩田洋介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWATA, YOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">藉由以相同搬送速度被驅動的搬送輸送帶(2)及配置在其下游側的收受輸送帶(3)搬送麵糰片(F3)(Pa)。測量與麵糰片的寬度對應的第1測量值(S1)，並每隔第1預定時間(T1)儲存於控制裝置(5)中(Pb)。算出第2預定時間(T2)之間的第1測量值的平均值(SA)，並根據平均值由控制裝置確定麵糰片的寬度設定值(SS)(Pc)。確定寬度設定值後，測量與麵糰片寬度對應的第2測量值(S2)，並比較寬度設定值與第2測量值(Pd)。當第2測量值小於寬度設定值時，將收受輸送帶的搬送速度(V3)設定為慢於搬送輸送帶的搬送速度(V2)以擴展麵糰片的寬度(Pe)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:麵糰寬度調整系統</p>  
        <p type="p">2:搬送輸送帶</p>  
        <p type="p">2a:無端搬送帶</p>  
        <p type="p">3:收受輸送帶</p>  
        <p type="p">3a:無端搬送帶</p>  
        <p type="p">4a:麵糰寬度感測器</p>  
        <p type="p">A:搬送方向</p>  
        <p type="p">C:寬方向</p>  
        <p type="p">F3:麵糰片</p>  
        <p type="p">FW:連續的麵糰片的寬度</p>  
        <p type="p">FS:設定麵糰寬度</p>  
        <p type="p">S2:第2測量值</p>  
        <p type="p">SS:寬度設定值</p>  
        <p type="p">V2:搬送速度</p>  
        <p type="p">V3:搬送速度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1513" publication-number="202612968"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612968.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612968</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123129</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於電動自行車的多速驅動單元</chinese-title>  
        <english-title>MULTISPEED DRIVE UNIT FOR AN ELECTRIC BICYCLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251230B">B62M6/40</main-classification>  
        <further-classification edition="201001120251230B">B62M6/55</further-classification>  
        <further-classification edition="201001120251230B">B62M9/121</further-classification>  
        <further-classification edition="200601120251230B">B62M11/06</further-classification>  
        <further-classification edition="200601120251230B">B62M25/08</further-classification>  
        <further-classification edition="200601120251230B">B62M9/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商速聯有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRAM, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓恩　賽吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAHN, SAGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛普曼　克里斯多佛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIPMAN, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬丹　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JORDAN, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於一自行車之一驅動單元的扭矩傳輸裝置係包括一軸桿，其具有延伸通過該軸桿的一開口。該扭矩傳輸裝置包括一桿件，其具有一座部、一足部及一齒。該桿件係可移動地附接至該軸桿，以使得該桿件之該座部可在至少部分地界定該開口的該軸桿之一表面上旋轉。該桿件之該齒可與可繞著該軸桿安置的一齒輪之內部齒銜接，且該桿件之該足部可與可安置在該軸桿內的一凸輪銜接。該桿件可移動地附接至該軸桿，以使得該桿件之該足部被偏壓遠離該軸桿之該外圓周表面。在該座部與該足部之間的一距離大於在該齒與該座部之間的一距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A torque transmission device for a drive unit of a bicycle includes a shaft having an opening extending through the shaft. The torque transmission device includes a lever having a seat, a foot, and a tooth. The lever is movably attached to the shaft, such that the seat of the lever is rotatable on a surface of the shaft at least partially defining the opening. The tooth of the lever is engageable with internal teeth of a gear disposable about the shaft, and the foot of the lever is engageable with a cam disposable within the shaft. The lever is movably attached to the shaft, such that the foot of the lever is biased away from the outer circumferential surface of the shaft. A distance between the seat and the foot is greater than a distance between the tooth and the seat.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">880:中間軸桿</p>  
        <p type="p">892:棘爪彈簧溝槽，第一溝槽，溝槽</p>  
        <p type="p">894:第二溝槽，插銷溝槽</p>  
        <p type="p">908:齒輪</p>  
        <p type="p">922:凸輪軸桿</p>  
        <p type="p">932b:第二凸輪，凸輪</p>  
        <p type="p">933b:第二凸輪凸瓣，凸輪凸瓣</p>  
        <p type="p">954:桿件，棘爪</p>  
        <p type="p">964:棘爪座部，座部</p>  
        <p type="p">966:棘爪尖端，足部，尖端</p>  
        <p type="p">968:棘爪齒，齒</p>  
        <p type="p">974:凹部</p>  
        <p type="p">976:拉伸彈簧，彈簧</p>  
        <p type="p">978,980:插銷</p>  
        <p type="p">A:棘爪軸線，軸線</p>  
        <p type="p">F:力</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1514" publication-number="202612965"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612965.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612965</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123131</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於自行車之懸吊叉件</chinese-title>  
        <english-title>SUSPENSION FORKS FOR BICYCLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">B62K25/08</main-classification>  
        <further-classification edition="200601120251230B">B62K21/08</further-classification>  
        <further-classification edition="200601120251230B">B62K21/02</further-classification>  
        <further-classification edition="200601120251230B">F16F9/44</further-classification>  
        <further-classification edition="200601120251230B">F16F9/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商速聯有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRAM, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯塔納　布朗森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAGNER, BRONSON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林奇　提摩西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LYNCH, TIMOTHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅森伯里　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROSENBERRY, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬克士威　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAXWELL, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述數種用於自行車的懸吊叉件。示範懸吊叉件包括一第一管與可滑動地接收於該第一管內的一第二管。該第一管包括一外安裝部分。一第一容積設置在該第一管與該第二管之間。提供一密封元件用於密封在該第一管與該第二管之間的該第一容積。一容積控制元件可移除地附接至該第一管之該外安裝部分，其中該容積控制元件可操作以改變設置在該第一管與該第二管之間的該第一容積的大小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Suspension forks for bicycles are described herein. An example suspension fork includesa first tube and a second tube slidably received within the first tube. The first tube includes an outer mounting portion. A first volume is disposed between the first tube and the second tube. A sealing element is provided for sealing the first volume between the first tube and the second tube. A volume control element is removably attachable to the outer mounting portion of the first tube, wherein the volume control element is operable to change a magnitude of the first volume disposed between the first tube and the second tube.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:前叉</p>  
        <p type="p">202:阻尼器</p>  
        <p type="p">204:彈簧</p>  
        <p type="p">206:豎管</p>  
        <p type="p">208:肩蓋</p>  
        <p type="p">212:第一腳</p>  
        <p type="p">214:第二腳</p>  
        <p type="p">216:頂側</p>  
        <p type="p">218:底側</p>  
        <p type="p">220:第一上管</p>  
        <p type="p">222:第二上管</p>  
        <p type="p">224:第一下管</p>  
        <p type="p">226:第二下管</p>  
        <p type="p">228:拱部</p>  
        <p type="p">230:下殼體</p>  
        <p type="p">232,234:前輪附接部或凸緣</p>  
        <p type="p">236:殼體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1515" publication-number="202613315"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613315.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613315</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123132</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>表現因子ＶＩＩＩ之慢病毒載體之使用</chinese-title>  
        <english-title>USE OF LENTIVIRAL VECTORS EXPRESSING FACTOR VIII</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C12N15/86</main-classification>  
        <further-classification edition="200601120260102B">C07K14/755</further-classification>  
        <further-classification edition="200601120260102B">A61K38/37</further-classification>  
        <further-classification edition="200601120260102B">A61K48/00</further-classification>  
        <further-classification edition="200601120260102B">A61K39/12</further-classification>  
        <further-classification edition="200601120260102B">A61P7/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商生物化學醫療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIOVERATIV THERAPEUTICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安諾尼　安德里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANNONI, ANDREA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肯托雷　亞雷修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANTORE, ALESSIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德爾格　道格拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DRAGER, DOUGLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　彤瑤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TONGYAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米拉尼　米契拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MILANI, MICHELA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>墨菲特　傑夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOFFIT, JEFF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納迪尼　路吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NALDINI, LUIGI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕塔羅懷　蘇珊娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATARROYO-WHITE, SUSANNAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彼得斯　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETERS, ROBERT T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塞雷琴　阿列克謝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEREGIN, ALEXEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供包含密碼子優化之因子VIII序列的慢病毒載體及使用此類慢病毒載體之方法。本文揭示之靶向肝臟之慢病毒載體可用於基因療法，其中該慢病毒基因遞送能夠將轉殖基因表現卡匣穩定整合至兒科(例如新生)或成人個體之靶細胞(例如肝細胞)之基因組中，從而在低慢病毒載體劑量(例如5×10&lt;sup&gt;10&lt;/sup&gt;或更低，諸如1.5×10&lt;sup&gt;9&lt;/sup&gt;或更低，或1×10&lt;sup&gt;8&lt;/sup&gt; TU/kg或更低)下實現FVIII表現之提高(例如提高100倍)。本發明亦提供治療諸如血友病(例如A型血友病)之出血病症之方法，其包括向有需要之個體投與低劑量(1×10&lt;sup&gt;8&lt;/sup&gt; TU/kg或更低至1.5×10&lt;sup&gt;10&lt;/sup&gt; TU/kg)的包含密碼子優化之因子VIII核酸序列的靶向肝臟之慢病毒載體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides lentiviral vectors comprising codon optimized Factor VIII sequences, and methods of using such lentiviral vectors. The liver-targeted lentiviral vectors disclosed herein can be used for gene therapy, wherein the lentiviral gene delivery enables stable integration of the transgene expression cassette into the genome of targeted cells (e.g., hepatocytes) of pediatric (e.g., neonatal) or adult subjects, achieving an improvement in FVIII expression (for example, a 100-fold improvement) at low lentiviral vector doses (e.g., 5x10&lt;sup&gt;10&lt;/sup&gt; or lower, such as 1.5x10&lt;sup&gt;9&lt;/sup&gt; or lower, or 1x10&lt;sup&gt;8 &lt;/sup&gt;TU/kg or lower). The present disclosure also provides methods of treating bleeding disorders such as hemophilia (e.g., hemophilia A) comprising administering to a subject in need thereof a liver-targeted lentiviral vector comprising a codon optimized Factor VIII nucleic acid sequence at low dosages (1x10&lt;sup&gt;8&lt;/sup&gt; TU/kg or lower to 1.5x10&lt;sup&gt;10&lt;/sup&gt; TU/kg).</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1516" publication-number="202613600"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613600.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613600</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123151</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反射ＶＵＶ波長範圍內輻射的光學元件</chinese-title>  
        <english-title>OPTICAL ELEMENT FOR REFLECTION OF RADIATION IN THE VUV WAVELENGTH REGION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251217B">G02B1/10</main-classification>  
        <further-classification edition="200601120251217B">G02B5/08</further-classification>  
        <further-classification edition="201201120251217B">G03F1/84</further-classification>  
        <further-classification edition="200601120251217B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭傑　菲立克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANGE, FELIX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕齊迪斯　亞歷珊卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAZIDIS, ALEXANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福爾希特　康斯坦丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORCHT, KONSTANTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋甘德　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WIEGAND, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡佳　希克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHICK, KATJA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈特林　馬塞爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAERTLING, MARCEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於反射VUV波長範圍內的輻射（2、25、55）的光學元件（1），包含：一表面（4a、4a'）；以及一施加於該表面（4a、4a'）上的介電多層塗層（5）；其中該介電質多層塗層（5）係用於反射該VUV波長範圍內的該輻射（2、25、55），特別為寬頻反射；以及其中該表面（4a、4a'）係較佳由金屬基材組成，該金屬基材在該VUV波長範圍內的反射率為60%以下，特別為50%以下。較佳地，用於反射UV/VIS波長區域的輻射（3）的該基材在UV/VIS波長區域內的至少一個波長（λ&lt;sub&gt;VIS&lt;/sub&gt;）下的反射率大於50%，較佳大於70%，更佳大於80%，特別是大於90%。本發明亦關於一種用於VUV波長區域的光學組件，該光學組件包含至少一個光學元件（1）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to an optical element (1) for reflection of radiation (2) in the VUV wavelength region, comprising： a surface (4a, 4a`), and a dielectric multilayer coating (5) applied to the surface (4a, 4a`). The dielectric multilayer coating (5) is designed for reflection, in particular for broadband reflection, of radiation (2) in the VUV wavelength region. The surface (4a, 4a`) is formed from a preferably metallic base material having a reflectivity of 60% or less in the VUV wavelength region, in particular of 50% or less. It is preferable that the base material for reflection of radiation (3) in the UV/VIS wavelength region has a reflectivity at at least one wavelength (λVIS) in the UV/VIS wavelength region of more than 50%, preferably of more than 70%, more preferably of more than 80%, in particular of more than 90%. The invention also relates to an optical assembly for the VUV wavelength region that comprises at least one such optical element (1).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光學元件</p>  
        <p type="p">2:VUV波長區域的輻射</p>  
        <p type="p">3:UV/VIS波長區域的輻射</p>  
        <p type="p">4:金屬基板</p>  
        <p type="p">4`:薄金屬層</p>  
        <p type="p">4a,4a`:金屬表面</p>  
        <p type="p">5:介電多層塗層</p>  
        <p type="p">6a:第一層</p>  
        <p type="p">6b:第二層</p>  
        <p type="p">7:鈍化金屬氟化物層</p>  
        <p type="p">8:基板</p>  
        <p type="p">9,10:功能層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1517" publication-number="202613493"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613493.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613493</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123165</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於檢查貨櫃及道路底盤之方法、間隙檢查設備、間隙檢查裝置、系統、電腦程式及電腦程式產品</chinese-title>  
        <english-title>METHOD, CLEARANCE INVESTIGATING DEVICE, CLEARANCE INVESTIGATING ARRANGEMENT, SYSTEM, COMPUTER PROGRAM AND COMPUTER PROGRAM PRODUCT FOR INVESTIGATING A CONTAINER AND A ROAD CHASSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">G01B11/14</main-classification>  
        <further-classification edition="200601120251218B">B60P7/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商ＡＢＢ瑞士公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABB SCHWEIZ AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杰恩格倫　丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TJERNGREN, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉格荷姆　拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAGERHOLM, LARS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑德荷姆　尼克拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNDHOLM, NIKLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於檢查貨櫃(32A)及道路底盤(34A)之方法、間隙檢查設備、間隙檢查裝置、系統、電腦程式及電腦程式產品。該設備：獲取感興趣區域(ROI1)之視圖，在該感興趣區域中，貨櫃(32A)能夠經由鎖定機構(36A)被緊固至道路底盤(34A)，該視圖係在貨櫃(32A)自道路底盤(34A)上被提升時獲取；獲取對該視圖之分析，該分析包括判定在檢查區域(ROI1)中貨櫃(32A)與道路底盤(34A)之間在鎖定機構(36A)處是否存在間隙；並且基於該分析判定是否能夠繼續提升貨櫃(32A)，其中，若存在間隙，則能夠繼續提升貨櫃(32A)，並且若不存在間隙，則不能繼續提升貨櫃(32A)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a method, clearance investigating device, clearance investigating arrangement, system, computer program and computer program product for investigating a container (32A) and a road chassis (34A). The device obtains a view of a region of interest (ROI1) in which the container (32A) is fastenable to the road chassis (34A) via a locking mechanism (36A), the view being obtained when the container (32A) is being lifted from the road chassis (34A), obtains an analysis of the view comprising a determination of if there is a clearance between the container (32A) and the road chassis (34A) at the locking mechanism (36A) in the region of investigation (ROI1) and determines if lifting of the container (32A) can be continued or not based on the analysis, where the container (32A) can be continued to be lifted if there is a clearance and cannot be continued to be lifted if there is no clearance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14A:視圖擷取設備/第一視圖擷取設備</p>  
        <p type="p">32A:貨櫃/第一貨櫃</p>  
        <p type="p">32B:第二貨櫃</p>  
        <p type="p">34A:道路底盤</p>  
        <p type="p">36A:鎖定機構/第一鎖定機構</p>  
        <p type="p">38A:第二鎖定機構</p>  
        <p type="p">COA:第一貨櫃</p>  
        <p type="p">COB:第二貨櫃</p>  
        <p type="p">LM1A:第一鎖定機構</p>  
        <p type="p">LM2A:第二鎖定機構</p>  
        <p type="p">ROI1:檢查區域/感興趣區域/第一感興趣區域</p>  
        <p type="p">ROI2:第二感興趣區域</p>  
        <p type="p">VCDA:視圖擷取設備/第一視圖擷取設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1518" publication-number="202613156"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613156.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613156</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123252</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新穎之IL2促效劑及其使用方法(一)</chinese-title>  
        <english-title>NOVEL IL2 AGONISTS AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K14/55</main-classification>  
        <further-classification edition="200601120260102B">C07K16/28</further-classification>  
        <further-classification edition="200601120260102B">C07K14/715</further-classification>  
        <further-classification edition="200601120260102B">A61K38/20</further-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商再生元醫藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　家曦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JIAXI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　彤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, TONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫利納　波特拉　瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOLINA-PORTELA, MARIA DEL PILAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　家楊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIA-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米格赫　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEAGHER, THOMAS CRAIG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露內容是有關於治療概況獲得增進的IL2促效劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to IL2 agonists with improved therapeutic profiles.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1519" publication-number="202612993"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612993.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612993</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123259</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>容器裝之冷凍點心及其烹調方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B65D81/34</main-classification>  
        <further-classification edition="200601120251231B">B65D85/72</further-classification>  
        <further-classification edition="200601120251231B">A23G9/22</further-classification>  
        <further-classification edition="200601120251231B">A23G9/48</further-classification>  
        <further-classification edition="200601120251231B">A23G3/34</further-classification>  
        <further-classification edition="200601120251231B">A23G3/50</further-classification>  
        <further-classification edition="200601120251231B">A23G1/50</further-classification>  
        <further-classification edition="201701120251231B">A21D13/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商樂天股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOTTE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高松寛之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAMATSU, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>煙山裕樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEMURIYAMA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮城真実</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAGI, MAMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢内祥子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANAI, SHOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小関彬弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZEKI, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係一種容器裝之冷凍點心，其包含：帶蓋容器；分離層，其將上述容器之內部空間分為第1區域及第2區域；及冷凍點心，其配置於上述第1區域；且上述第2區域與上述蓋接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:容器裝之冷凍點心</p>  
        <p type="p">11:容器</p>  
        <p type="p">12:分離層</p>  
        <p type="p">13A:第1區域</p>  
        <p type="p">13B:第2區域</p>  
        <p type="p">14:冷凍點心</p>  
        <p type="p">15:蓋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1520" publication-number="202612689"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612689.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612689</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123277</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>殼體抑制劑之配方</chinese-title>  
        <english-title>FORMULATIONS OF CAPSID INHIBITOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/4439</main-classification>  
        <further-classification edition="200601120260102B">A61K47/10</further-classification>  
        <further-classification edition="200601120260102B">A61K9/00</further-classification>  
        <further-classification edition="200601120260102B">A61P31/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商基利科學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GILEAD SCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕瓦　帕拉維　普拉哈德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAWAR, PALLAVI PRALHAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅伊　查理斯　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROWE, CHARLES W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於包含HIV殼體抑制劑之醫藥組成物及用於治療或預防患者之人類免疫缺乏病毒(HIV)感染的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to pharmaceutical compositions comprising an HIV capsid inhibitor and methods for the treatment or prevention of a human immunodeficiency virus (HIV) infection in a patient.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1521" publication-number="202614019"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614019.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614019</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123314</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及包含其之電子設備</chinese-title>  
        <english-title>DISPLAY DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251224B">G09G3/3208</main-classification>  
        <further-classification edition="202301120251224B">H10K59/123</further-classification>  
        <further-classification edition="202301120251224B">H10K59/131</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星顯示器有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李仙花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SUNHWA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金亨錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYEONGSEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴喜眞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, HEEJEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田武經</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, MUKYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">顯示裝置包含第一像素電路，其設置在複數個島部分中的每一個中且連接至第一資料線，其中第一像素電路包含：第一電晶體，其連接在第一驅動電壓線與發光元件之間且配置為控制供應至發光元件的電流；第一電容器，其連接在連接至第一電晶體的閘極的第一節點與初始化電壓線之間；第二電晶體，其連接在第一節點與第二節點之間且包含連接至第一閘極線的閘極；第二電容器，其連接在第一資料線與第二節點之間；以及第三電晶體，其連接在第二節點與連接至發光元件的第三節點之間，其中第三電晶體包含連接至第二閘極線的閘極</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a first pixel circuit arranged in each of the plurality of island portions and connected to a first data line, wherein the first pixel circuit includes a first transistor connected between a first driving voltage line and a light-emitting element and configured to control a current supplied to the light-emitting element, a first capacitor connected between a first node connected to a gate of the first transistor, and an initialization voltage line, a second transistor connected between the first node and a second node and including a gate connected to a first gate line, a second capacitor connected between the first data line and the second node, and a third transistor connected between the second node and a third node connected to the light-emitting element, wherein the third transistor includes a gate connected to a second gate line.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">Ca:第三電容器</p>  
        <p type="p">Cpr:第二電容器</p>  
        <p type="p">Cst:第一電容器</p>  
        <p type="p">DATA:資料訊號</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">ELVDD:第一驅動電壓</p>  
        <p type="p">ELVSS:第二驅動電壓</p>  
        <p type="p">GC:第二閘極訊號</p>  
        <p type="p">GCL:第二閘極線</p>  
        <p type="p">GW:第一閘極訊號</p>  
        <p type="p">GWL:第一閘極線</p>  
        <p type="p">LED:發光元件</p>  
        <p type="p">N1:第一節點</p>  
        <p type="p">N2:第二節點</p>  
        <p type="p">N3:第三節點</p>  
        <p type="p">PC:像素電路</p>  
        <p type="p">T1:第一電晶體</p>  
        <p type="p">T2:第二電晶體</p>  
        <p type="p">T3:第三電晶體</p>  
        <p type="p">VDDL:第一驅動電壓線</p>  
        <p type="p">VIL:初始化電壓線</p>  
        <p type="p">Vint:初始化電壓</p>  
        <p type="p">VSSL:第二驅動電壓線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1522" publication-number="202613531"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613531.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613531</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123321</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自單一攝影機及多照明角度之AI三維重建</chinese-title>  
        <english-title>AI 3D-RECONSTRUCTION FROM SINGLE CAMERA AND MULTIPLE ILLUMINATION ANGLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">G01N21/95</main-classification>  
        <further-classification edition="200601120251223B">G01B11/24</further-classification>  
        <further-classification edition="200601120251223B">H01L21/66</further-classification>  
        <further-classification edition="201701120251223B">G06T7/55</further-classification>  
        <further-classification edition="201901120251223B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商奧寶科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORBOTECH LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史確特　哈吉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHECHTER, HAGIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顧森斯　肯尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOOSSENS, KENNY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種系統，其包含：複數個光源，其等各者依一不同照明角度提供且經組態以產生一光束；一載台，其經組態以使一工件固持於來自各照明角度之該光束之路徑中；一偵測器，其經組態以基於依各照明角度自該工件反射之該光束擷取該工件之複數個影像；一處理器，其與該偵測器電子通信；及一電子資料儲存單元，其與該處理器電子通信且儲存一AI模型。該處理器經組態以使用該AI模型基於自該偵測器接收之該工件之該複數個影像產生該工件之一3D高度圖。該3D高度圖包含經界定於該工件之一表面上之一3D表面特徵相對於該工件之該表面之一峰值高度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The system includes a plurality of light sources each provided at a different illumination angle and configured to generate a beam of light, a stage configured to hold a workpiece in the path of the beam of light from each illumination angle, a detector configured to capture a plurality of images of the workpiece based on the beam of light reflected from the workpiece at each illumination angle, a processor in electronic communication with the detector, and an electronic data storage unit in electronic communication with the processor and storing an AI model. The processor is configured to generate a 3D height map of the workpiece based on the plurality of images of the workpiece received from the detector using the AI model. The 3D height map includes a peak height of a 3D surface feature defined on a surface of the workpiece relative to the surface of the workpiece.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">110:步驟</p>  
        <p type="p">120:步驟</p>  
        <p type="p">130:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1523" publication-number="202614626"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614626.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614626</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123350</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有時間延遲積分（ＴＤＩ）感測器之多模態</chinese-title>  
        <english-title>MULTI-MODALITY WITH TDI SENSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251223B">H04N25/711</main-classification>  
        <further-classification edition="202501120251223B">H10F39/15</further-classification>  
        <further-classification edition="202301120251223B">H04N25/42</further-classification>  
        <further-classification edition="200601120251223B">G01N21/95</further-classification>  
        <further-classification edition="200601120251223B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商奧寶科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORBOTECH LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾德勒　艾夫拉漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADLER, AVRAHAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恩奎　亞維黑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANKRY, AVIHAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬圖索斯基　麥可爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATUSOVSKY, MIKHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一TDI感測器可為一多模TDI感測器。該多模TDI感測器可包含主動像素列、非主動像素列及一讀出電路。該等主動像素列及該等非主動像素列可依界定組態該多模TDI感測器所依之模式之數目之一序列交替。在切換於光模之間之前樣本光被掃描至之長度係基於一像素長度除以光模之數目以使該等主動及非主動列與該等光模同步。該等主動像素列可回應於接收到光而累積電荷。該電荷可在該等主動像素列與該等非主動像素列之間轉移。該等非主動像素列可在將該電荷轉移回該等主動像素列以供進一步累積之前緩衝該電荷。該讀出電路可讀出該電荷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A TDI sensor may be a multi-mode TDI sensor. The multi-mode TDI sensor may include active pixel rows, inactive pixel rows, and a readout circuit. The active pixel rows and the inactive pixel rows may alternate in a sequence defining the number of modes for which the multi-mode TDI sensor is configured. The length to which the sample light is scanned before switching between the optical modes is based on a pixel length divided by the number of optical modes to synchronize the active and inactive rows with the optical modes. The active pixel rows may accumulate charge in response to receiving light. The charge may be transferred between the active pixel rows and the inactive pixel rows. The inactive pixel rows may buffer the charge before transferring the charge back to the active pixel rows for further accumulation. The readout circuit may readout the charge.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:多模時間延遲積分(TDI)感測器</p>  
        <p type="p">102-1:第一主動像素列</p>  
        <p type="p">102-2:第二主動像素列</p>  
        <p type="p">102-n:最後主動像素列</p>  
        <p type="p">103:主動像素</p>  
        <p type="p">104-1:第一非主動像素列</p>  
        <p type="p">104-2:第二非主動像素列</p>  
        <p type="p">104-n:最後非主動像素列</p>  
        <p type="p">105:非主動像素</p>  
        <p type="p">106:讀出電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1524" publication-number="202612766"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612766.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612766</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123356</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>棒球發射器和方法</chinese-title>  
        <english-title>BASEBALL LAUNCHER AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">A63B69/40</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商斯靈格箱包有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SLINGER BAG LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡爾法　尤納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KALFA, YONAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種棒球發射器，其包含：發射機構；饋送裝置，其具有殼體，該殼體具備用於球之圍阻空間；相對於該殼體是可受控地旋轉以使得所容納之球旋轉的部件；排出開口，在任何給定時間僅一個球可從該殼體從該排出開口向下排出；及開口式導引部件，其用於將所排出之球導引至該發射機構。在一個具體實例中，在產生球存在指示信號之後操作用以警示即將發生之球發射操作的使用者之球發射器警告系統。在一球收集方法中，將所接觸之棒球引入球拾取器之管內部。在將該球拾取器舉過一肩膀後，所收集之棒球在看不見之排出操作中通過該球拾取器之上部開口以重力作用排出至背包內部中，不管舉起之球拾取器的角度如何。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A baseball launcher comprises a launching mechanism; a feed device having a casing provided with a containment space for balls; a member controllably rotatable relative to the casing to cause rotation of the contained balls; a discharge opening from which only one ball is downwardly dischargeable from the casing at any given time; and an open-ended guide member for guiding the discharged ball to the launching mechanism. In one embodiment, a ball launcher warning system to alert a user of an imminent ball launching operation is operated following generation of a ball presence indicating signal. In a ball collecting method, a contacted baseball is introduced within a tube interior of a ball picker. Upon raising the ball picker over a shoulder, collected baseballs are gravitationally discharged through its upper opening in an unseen discharging operation into a backpack interior regardless of an angle of the raised ball picker.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:蓋</p>  
        <p type="p">2:可拉伸面板</p>  
        <p type="p">3:把手</p>  
        <p type="p">4:穩定器</p>  
        <p type="p">5:外主體</p>  
        <p type="p">6:側壁</p>  
        <p type="p">7:輪</p>  
        <p type="p">9:側壁</p>  
        <p type="p">10:棒球發射器</p>  
        <p type="p">11:封閉件</p>  
        <p type="p">14:支架</p>  
        <p type="p">17:旋鈕</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1525" publication-number="202613105"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613105.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613105</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123365</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療癌症之經修飾之硫鏈絲菌肽啟發之化合物及其製備</chinese-title>  
        <english-title>MODIFIED THIOSTREPTON-INSPIRED COMPOUNDS FOR TREATMENT OF CANCER AND PREPARATION THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D413/04</main-classification>  
        <further-classification edition="200601120260102B">C07D403/14</further-classification>  
        <further-classification edition="200601120260102B">C07D417/14</further-classification>  
        <further-classification edition="200601120260102B">C07D413/14</further-classification>  
        <further-classification edition="200601120260102B">C07D403/04</further-classification>  
        <further-classification edition="200601120260102B">A61K31/538</further-classification>  
        <further-classification edition="200601120260102B">A61K31/416</further-classification>  
        <further-classification edition="200601120260102B">A61K31/428</further-classification>  
        <further-classification edition="200601120260102B">A61K31/404</further-classification>  
        <further-classification edition="200601120260102B">A61K31/454</further-classification>  
        <further-classification edition="200601120260102B">A61K31/496</further-classification>  
        <further-classification edition="200601120260102B">A61K31/5377</further-classification>  
        <further-classification edition="200601120260102B">A61K31/541</further-classification>  
        <further-classification edition="200601120260102B">A61K31/517</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＲＳ腫瘤學有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RS ONCOLOGY, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃科文　保羅　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WERKHOVEN, PAUL R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯納多　瑪利納　維吉里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERNADO, MARINA VIRGILI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅斯訥　喬哈尼斯　Ｗ　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEISSNER, JOHANNES W.G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示由硫鏈絲菌肽啟發之醫藥學上相關化合物之結構、組合物及合成，以及利用此等化合物治療癌症之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are structures, compositions and syntheses of pharmaceutically relevant compounds inspired by thiostrepton, as well as methods of treating cancer with such compounds.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1526" publication-number="202613412"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613412.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613412</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123444</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控制器、真空泵以及用於抽氫氣的方法</chinese-title>  
        <english-title>CONTROLLER, VACUUM PUMP AND METHOD FOR PUMPING HYDROGEN GAS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">F04D19/04</main-classification>  
        <further-classification edition="200601120251231B">F04D19/02</further-classification>  
        <further-classification edition="200601120251231B">F04D27/00</further-classification>  
        <further-classification edition="200601120251231B">G05D16/20</further-classification>  
        <further-classification edition="201801120251231B">G06F9/44</further-classification>  
        <further-classification edition="200601120251231B">H01L21/67</further-classification>  
        <further-classification edition="201601220251231B">H02P27/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商愛德華茲韓國有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDWARDS KOREA LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金在號</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JAEHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭詠翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種控制一真空泵以在使用最少或不使用補充沖洗氣體之情況下抽氫氣的方法(500)，該方法(500)包括控制(501)該真空泵之一轉子以在一第一模式中操作用於抽氫氣，其中在該第一模式中該轉子之一第一旋轉頻率被控制為大於或等於120 Hz。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method (500) of controlling a vacuum pump to pump hydrogen gas with minimal or no supplementary purge gas, the method (500) comprising controlling (501) a rotor of the vacuum pump to operate in a first mode for pumping hydrogen gas, wherein a first rotation frequency of the rotor in the first mode is controlled to be greater than or equal to 120Hz.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:方法</p>  
        <p type="p">501:方法之步驟/控制</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1527" publication-number="202613302"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613302.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613302</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123456</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種　５－酮基米爾貝黴素的產生菌及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C12N1/20</main-classification>  
        <further-classification edition="200601120260102B">C12P17/18</further-classification>  
        <further-classification edition="200601120260102B">C07D493/22</further-classification>  
        <further-classification edition="200601320260102B">C12R1/465</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商浙江海正藥業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHEJIANG HISUN PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳亞軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YA-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊小虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, XIAO-HU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳巧巧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, QIAO-QIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, AI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方佳雙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, JIA-SHUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>項仁鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIANG, REN-XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, QIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>應靈萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YING, LING-PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種新的鏈黴菌菌株及其應用，該菌株命名為冰城鏈黴菌 (&lt;i&gt;Streptomyces bingchenggensis)&lt;/i&gt;HS-5-OXO-MIL-116，其保藏編號為 (CGMCC No.29877) ；同時公開了利用該菌株HS-5-OXO-MIL-116培養5-酮基米爾貝黴素孢子生長的方法和製備5-酮基米爾貝黴素的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1528" publication-number="202614256"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614256.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614256</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123466</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製造裝置、膏狀接著劑的檢查方法及半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H01L21/66</main-classification>  
        <further-classification edition="200601120251219B">G01N21/95</further-classification>  
        <further-classification edition="201701120251219B">G06T7/62</further-classification>  
        <further-classification edition="201701120251219B">G06T7/174</further-classification>  
        <further-classification edition="200601120251219B">C09J5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商捷進科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FASFORD TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大森僚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMORI, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, TAIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>依田光央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YODA, MITSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題是提供一種能夠在量產塗布後，進行因應任意的經過時間之外觀檢查的技術。 &lt;br/&gt;　　半導體製造裝置具備：攝像裝置，其對塗布於塗布面上的第一膏狀接著劑進行攝像；及控制裝置，其對前述攝像裝置攝像之前述第一膏狀接著劑的圖像資料進行圖像處理，前述控制裝置構成為在量產前的登記動作中，藉由前述圖像處理，將前述攝像裝置攝像之前述第一膏狀接著劑的每個塗布後經過時間的複數參照檢查圖像，計算為前述第一形狀資料，並登記前述塗布後經過時間與前述第一形狀資料的相關資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1529" publication-number="202614166"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614166.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614166</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123470</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>降低線間距圖案線寬粗糙度及光阻損耗用的反應性離子束蝕刻</chinese-title>  
        <english-title>REACTIVE ION BEAM ETCH TO REDUCE LINE-SPACE PATTERN LINE WIDTH ROUGHNESS AND PHOTORESIST LOSS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">H01L21/027</main-classification>  
        <further-classification edition="200601120251218B">H01L21/3065</further-classification>  
        <further-classification edition="200601120251218B">G03F7/26</further-classification>  
        <further-classification edition="200601120251218B">G03F7/36</further-classification>  
        <further-classification edition="200601120251218B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>游　正義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, JENGYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　暹華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, SAMANTHA S.H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱逸思</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, YISI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHIH-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃朔罡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, SHUOGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威茲　理查</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WISE, RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德許牧克　沙珊克　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DESHMUKH, SHASHANK C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於處理半導體基板的方法。該方法包含將半導體基板提供至製程腔室，該半導體基板包含配置於其上的含金屬的圖案化光阻遮罩層。在一些實施例中，圖案為線間距圖案。在一些實施例中，該方法更包含沿著平行或實質上平行於含金屬的圖案化光阻遮罩層中的圖案的方向，將半導體基板暴露到包含至少一反應性氣體的反應性離子束。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods for processing of semiconductor substrates are provided. A method includes providing, to a processing chamber, a semiconductor substrate including a metal-containing patterned photoresist mask layer disposed thereon. In some embodiments, the pattern is a line-space pattern. In some embodiments, the method further includes exposing the semiconductor substrate to a reactive ion beam including at least one reactive gas in a direction parallel or substantially parallel to a pattern in the metal-containing patterned photoresist mask layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:線間距圖案</p>  
        <p type="p">202:離子束</p>  
        <p type="p">204A:第一光阻線</p>  
        <p type="p">204B:第二光阻線</p>  
        <p type="p">210:奈米橋</p>  
        <p type="p">212A、212B:浮渣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1530" publication-number="202614290"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614290.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614290</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123625</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法、程式及基板處理裝置</chinese-title>  
        <english-title>SUBSTRATE PROCESSING METHOD, PROGRAM, AND SUBSTRATE PROCESSING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">H01L21/67</main-classification>  
        <further-classification edition="200601120251224B">B29C61/00</further-classification>  
        <further-classification edition="200601120251224B">B29C35/08</further-classification>  
        <further-classification edition="200601120251224B">G03F7/20</further-classification>  
        <further-classification edition="200601120251224B">G03F7/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐野要平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANO, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐田徹也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SADA, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明一面向之基板處理方法，包含：成膜步驟，對於包含形成有圖案或元件構造之表面、及與該表面反向之背面的基板，在該基板之該背面形成藉由曝光會產生應力的背面膜；及曝光步驟，形成該背面膜後，對該背面膜的至少一部分進行曝光，俾減小該基板的翹曲。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate processing method according to one aspect of the invention includes: a film formation step of forming a rear surface film, which develops stress upon exposure, on the rear surface of a substrate having a main surface on which a pattern or a device structure is formed and a rear surface which faces the opposite direction from the main surface; and an exposure step, performed after forming the rear surface film, in which at least a portion of the rear surface film is exposed to reduce warping of the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">D:元件構造</p>  
        <p type="p">F:背面膜</p>  
        <p type="p">Fr:背面膜F中受曝光用光線所照射的部分</p>  
        <p type="p">S01~S08:步驟</p>  
        <p type="p">W:晶圓(基板)</p>  
        <p type="p">Wa:表面</p>  
        <p type="p">Wb:背面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1531" publication-number="202613489"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613489.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613489</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123644</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於判定貨櫃輪之貨櫃艙上之貨櫃位置的方法、控制器、判定裝置及電腦程式</chinese-title>  
        <english-title>METHOD, CONTROLLER, DETERMNATION DEVICE, AND COMPUTER PROGRAM FOR DETERMINING A POSITION OF A CONTAINER ON A CONTAINER BAY OF A CONTAINER VESSEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G01B11/00</main-classification>  
        <further-classification edition="200601120251230B">G01S17/08</further-classification>  
        <further-classification edition="202001120251230B">G01S17/86</further-classification>  
        <further-classification edition="202001120251230B">G01S17/00</further-classification>  
        <further-classification edition="202001120251230B">G01S17/87</further-classification>  
        <further-classification edition="200601120251230B">G01S17/88</further-classification>  
        <further-classification edition="200601120251230B">B66C13/46</further-classification>  
        <further-classification edition="200601120251230B">B66C13/48</further-classification>  
        <further-classification edition="200601120251230B">B66C19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商ＡＢＢ瑞士公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABB SCHWEIZ AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪斯　狄倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAAS, DERAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬拉諾　史提芬諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARANO, STEFANO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾斯納利　布魯諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARSENALI, BRUNO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杰恩格倫　丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TJERNGREN, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉格荷姆　拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAGERHOLM, LARS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑德荷姆　尼克拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNDHOLM, NIKLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述一種用於判定一貨櫃輪(20)之一貨櫃艙(22)上之一貨櫃(24)之至少一個性質之方法。該方法包括：接收來自安裝於一起重機(30)之一結構上之一相機(40)之第一影像資料，其中該起重機(30)之該結構至少部分在該貨櫃艙(22)上方延伸，且其中該等第一影像資料表示一第一影像，該第一影像展示該貨櫃(24)配置於其中之該貨櫃艙(22)之至少一區域；及接收來自安裝於該起重機(30)之一結構上之一光達裝置(50)之第一光達資料，其中該等第一光達資料表示一第一點雲，該第一點雲表示該貨櫃艙(22)之該區域之至少一部分；組合該等所接收之第一影像資料與該等所接收之第一光達資料；及取決於該等經組合資料判定該貨櫃(24)之該性質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for determining at least one property of a container (24) on a container bay (22) of a container vessel (20) is described. The method comprises: receiving first image data from a camera (40) mounted on a structure of a crane (30), wherein the structure of the crane (30) at least partly extends over the container bay (22) and wherein the first image data are representative of a first image showing at least an area of the container bay (22) in which the container (24) is arranged; and receiving first lidar data from a lidar device (50) mounted on a structure of the crane (30), wherein the first lidar data are representative of a first point cloud representing at least a part of the area of the container bay (22); combining the received first image data and the received first lidar data; and determining the property of the container (24) depending on the combined data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:貨櫃輪</p>  
        <p type="p">22:貨櫃艙</p>  
        <p type="p">24:貨櫃</p>  
        <p type="p">30:起重機</p>  
        <p type="p">32:支撐件</p>  
        <p type="p">34:吊臂</p>  
        <p type="p">36:行車</p>  
        <p type="p">38:吊具</p>  
        <p type="p">39:判定裝置</p>  
        <p type="p">40:相機</p>  
        <p type="p">42:相機視場</p>  
        <p type="p">46:光達視場</p>  
        <p type="p">50:光達裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1532" publication-number="202613536"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613536.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613536</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123647</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於多電子束光學系統之場曲率校正器</chinese-title>  
        <english-title>FIELD CURVATURE CORRECTOR FOR USE IN MULTI-ELECTRON-BEAM OPTICAL SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251217B">G01N23/04</main-classification>  
        <further-classification edition="200601120251217B">H01J37/26</further-classification>  
        <further-classification edition="200601120251217B">H01J37/28</further-classification>  
        <further-classification edition="200601120251217B">H01J37/147</further-classification>  
        <further-classification edition="200601120251217B">H01J37/153</further-classification>  
        <further-classification edition="200601120251217B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜　辛容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, XINRONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多電子束(MEB)成像系統能夠包含一場曲率校正器，該場曲率校正器用於藉由對該場曲率校正器之微透鏡個別地進行定址而個別地校正電子細束之場曲率模糊。該場曲率校正器能夠包含一導電板，其中該導電板包含被配置成一六邊形陣列之複數個孔。該場曲率校正器能夠包含一微透鏡陣列，其中該微透鏡陣列包含形成在一絕緣板上之複數個微透鏡，其中該複數個微透鏡被配置成一六邊形圖案以匹配該導電板之該等孔之該六邊形圖案。該微透鏡陣列包含用於對該微透鏡陣列中之該等微透鏡中之每一者個別地進行定址之複數個電力線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-electron-beam (MEB) imaging system may include a field curvature corrector for individually correcting electron beamlets for field curvature blur by individually addressing microlenses of the field curvature corrector. The field curvature corrector may include a conductive plate, wherein the conductive plate includes a plurality of holes arranged in a hexagonal array. The field curvature corrector may include a microlens array, wherein the microlens array includes a plurality of microlenses formed on an insulative plate, wherein the plurality of microlenses are arranged in a hexagonal pattern to match the hexagonal pattern of the holes of the conductive plate. The microlens array includes a plurality of power lines for individually addressing each of the microlenses of the microlens array.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:多電子束成像系統</p>  
        <p type="p">801:場曲率校正器</p>  
        <p type="p">802:遠心初級電子束</p>  
        <p type="p">803:電子束源</p>  
        <p type="p">804:微束形成陣列</p>  
        <p type="p">806:遠心電子細束/細束</p>  
        <p type="p">808:孔徑陣列</p>  
        <p type="p">810:微偏轉器陣列</p>  
        <p type="p">812:微消像散器陣列/孔</p>  
        <p type="p">814:電子光學器件</p>  
        <p type="p">816:樣本</p>  
        <p type="p">xo1:束交叉</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1533" publication-number="202614257"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614257.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614257</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123648</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於註記導引、深度學習模型可調性及強健性之信號雜音比度量</chinese-title>  
        <english-title>SIGNAL-TO-NOISE METRIC FOR ANNOTATION GUIDANCE, DL MODEL TUNABILITY, AND ROBUSTNESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251225B">H01L21/66</main-classification>  
        <further-classification edition="200601120251225B">G01N21/88</further-classification>  
        <further-classification edition="201701120251225B">G06T7/194</further-classification>  
        <further-classification edition="201901120251225B">G06N20/00</further-classification>  
        <further-classification edition="200601120251225B">G06F17/18</further-classification>  
        <further-classification edition="200601120251225B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒂瓦里　阿布舍克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIWARI, ABHISHEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　海東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HEDONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賀力</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫巴　拉傑西卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUPPA, RAJASEKHAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒙代爾　蘇拉吉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONDAL, SURAJIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於判定一樣品上之所關注位置之一信號雜音比度量之方法及系統。自一測試影像中與該測試影像中之一所關注位置之一圖塊影像類似之背景圖塊影像判定非缺陷信號之一或多個統計資料。藉由搜尋一參考影像以獲得與該所關注位置圖塊影像類似之圖塊影像且在該測試影像中找到對應圖塊影像而找到該等背景圖塊影像。使用該測試影像中之該所關注位置之信號及該一或多個統計資料來判定該所關注位置之一信號雜音比度量。該信號雜音比度量可用於諸如缺陷註記、深度學習(DL)模型可調性、DL模型可重複性及新穎缺陷偵測之應用中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and systems for determining a signal-to-noise metric for locations of interest on a specimen are provided. One or more statistics of non-defect signals from background patch images in a test image that are similar to a patch image of a location of interest in the test image are determined. The background patch images are found by searching a reference image for patch images that are similar to the location of interest patch image and finding the corresponding patch images in the test image. The signal of the location of interest in the test image and the one or more statistics are used to determine a signal-to-noise metric for the location of interest. The signal-to-noise metric can be used in applications such as defect annotation, deep learning (DL) model tunability, DL model repeatability, and novel defect detection.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:步驟</p>  
        <p type="p">402:步驟</p>  
        <p type="p">404:步驟</p>  
        <p type="p">406:步驟</p>  
        <p type="p">408:步驟</p>  
        <p type="p">410:步驟</p>  
        <p type="p">412:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1534" publication-number="202613232"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613232.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613232</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123733</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單劑型澱粉基膠合劑</chinese-title>  
        <english-title>ONE-PART STARCH-BASED ADHESIVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">C08L3/02</main-classification>  
        <further-classification edition="200601120251226B">C07C69/15</further-classification>  
        <further-classification edition="200601120251226B">C08F2/10</further-classification>  
        <further-classification edition="200601120251226B">C10M115/04</further-classification>  
        <further-classification edition="200601120251226B">C09J11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商生物黏合劑股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIOBOND ADHESIVES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈特　理查　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HART, RICHARD E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>衛斯特曼　克萊頓　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WESTERMAN, CLAYTON R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種單劑型膠合劑組成物，其具有優異之接著強度、耐久性及多功能性。該膠合劑可於環境溫度下輕易施用並固化，無需混合或專用設備。其成分之獨特組合可於多種基材（包含金屬、塑膠、木材及複合材料）上提供強固且持久之接著。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides to a one-part adhesive composition that exhibits superior bonding strength, durability, and versatility. The adhesive is formulated to be easily applied and cured at ambient temperatures, without the need for mixing or specialized equipment. The unique combination of ingredients provides a strong and lasting bond on a variety of substrates, including metals, plastics, wood, and composites.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1535" publication-number="202613135"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613135.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613135</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123739</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物、組成物、墨水、光電轉換元件、及光感測器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D495/04</main-classification>  
        <further-classification edition="200601120260102B">C07D519/00</further-classification>  
        <further-classification edition="200601120260102B">C07D495/14</further-classification>  
        <further-classification edition="200601120260102B">C07F7/08</further-classification>  
        <further-classification edition="200601120260102B">C07D495/22</further-classification>  
        <further-classification edition="200601120260102B">C08K5/45</further-classification>  
        <further-classification edition="200601120260102B">C08L65/00</further-classification>  
        <further-classification edition="200601120260102B">C09D11/00</further-classification>  
        <further-classification edition="202501120260102B">H10F39/18</further-classification>  
        <further-classification edition="202301120260102B">H10K30/30</further-classification>  
        <further-classification edition="202301120260102B">H10K30/50</further-classification>  
        <further-classification edition="202301120260102B">H10K30/60</further-classification>  
        <further-classification edition="202301120260102B">H10K85/10</further-classification>  
        <further-classification edition="202301120260102B">H10K85/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>横井優季</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可抑制光電轉換元件中的暗電流的化合物、組成物、墨水、光電轉換元件、及光感測器。一種化合物，由下述式（1）表示。式（1）中，D1、D2、L1、L2、m、n、A1、及A2如說明書中定義般。 &lt;br/&gt;&lt;img align="absmiddle" height="96px" width="480px" file="ed10098.JPG" alt="ed10098.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光電轉換元件</p>  
        <p type="p">11:支撐基板</p>  
        <p type="p">12:陽極</p>  
        <p type="p">13:電洞傳輸層</p>  
        <p type="p">14:活性層</p>  
        <p type="p">15:電子傳輸層</p>  
        <p type="p">16:陰極</p>  
        <p type="p">17:密封構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1536" publication-number="202612932"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612932.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612932</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123873</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可旋轉兒童座椅</chinese-title>  
        <english-title>ROTATABLE CHILD SEAT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">B60N2/26</main-classification>  
        <further-classification edition="200601120251230B">B60N2/28</further-classification>  
        <further-classification edition="201801120251230B">B60N2/815</further-classification>  
        <further-classification edition="201801120251230B">B60N2/818</further-classification>  
        <further-classification edition="201801120251230B">B60N2/806</further-classification>  
        <further-classification edition="201801120251230B">B60N2/812</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德魯Ｊ　泰勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDREW J., TAYLOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德魯Ｊ　霍斯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDREW J., HORST</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>札卡里Ｃ　哈滕斯坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZACHARY C., HARTENSTINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納撒尼爾Ｗ　基伯勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATHANIEL W., KEEBLER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派崔克Ｊ　Ｇ　鮑爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATRICK J. G., BOWERS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯蒂斯Ｍ　哈滕斯坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CURTIS M., HARTENSTINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊夫　馬爾姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEIF, MALM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可定位在一車輛座椅上之兒童座椅系統包括一支撐底座及可定位在該支撐底座上之一兒童座椅。該兒童座椅包括一座椅外殼及一增高器部分。該增高器部分可與該兒童座椅分離，以用作一無靠背增高器，且一杯托可移除地附接至該增高器部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A child seat system positionable on a vehicle seat includes a support base and a child seat positionable on the support base. The child seat includes a seat shell and a booster portion. The booster portion is separable from the child seat for use as a backless booster and a cupholder is removably attachable to the booster portion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:兒童座椅系統</p>  
        <p type="p">22:支撐底座</p>  
        <p type="p">24:兒童座椅</p>  
        <p type="p">25:座椅外殼</p>  
        <p type="p">26:座椅靠背部分</p>  
        <p type="p">28:座椅底板部分</p>  
        <p type="p">30:直立支撐表面</p>  
        <p type="p">32:座椅靠背部分之第一末端或頂部</p>  
        <p type="p">34:座椅靠背部分之第二相對末端或底部</p>  
        <p type="p">36:第一直立側部件</p>  
        <p type="p">40:第二直立側部件</p>  
        <p type="p">42:直立支撐表面之第二相對側</p>  
        <p type="p">46:頭枕</p>  
        <p type="p">50:座椅支撐表面</p>  
        <p type="p">52:座椅底板部分之第一末端或前部</p>  
        <p type="p">54:座椅底板部分之第二末端或後部</p>  
        <p type="p">56:第一座椅側部件</p>  
        <p type="p">60:第二座椅側部件</p>  
        <p type="p">72:底座座椅部分</p>  
        <p type="p">74:底座靠背部分</p>  
        <p type="p">76:第一底座部件</p>  
        <p type="p">80:第二底座部件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1537" publication-number="202614321"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614321.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614321</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123888</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>載具保管裝置、基板處理裝置及載具搬送方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">H01L21/677</main-classification>  
        <further-classification edition="200601120251224B">B65G1/137</further-classification>  
        <further-classification edition="200601120251224B">B65G49/07</further-classification>  
        <further-classification edition="200601120251224B">B25J9/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤淳一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, JUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>花木樹也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANAKI, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤井榮樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJII, EIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能增加載具的保管數的技術。 &lt;br/&gt;  本揭露一態樣之載具保管裝置，係保管會收容多片基板的載具，具有：搬送機構，係搬送該載具；第1保管架群，係設在較該搬送機構更靠第1水平軸的負側；第2保管架群，係設在較該搬送機構更靠該第1水平軸的正側；以及第3保管架群，係設在較該搬送機構更靠與該第1水平軸垂直的第2水平軸的正側或負側；該第1保管架群係具有會保管該載具的多個第1保管架；該第2保管架群係具有會保管該載具的多個第2保管架；該第3保管架群係具有會保管該載具的多個第3保管架；多個該第2保管架係沿著該第2水平軸排列配置成2列以上，且沿著鉛垂軸排列配置成2層以上；多個該第3保管架係沿著該鉛垂軸排列配置成2層以上，且分別可沿著該鉛垂軸移動；該搬送機構係構成為可將該載具搬送至多個該第1保管架、多個該第2保管架、及多個該第3保管架。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理裝置</p>  
        <p type="p">2:搬出入部</p>  
        <p type="p">20:殼體</p>  
        <p type="p">20a:內部空間</p>  
        <p type="p">21:第1保管架群</p>  
        <p type="p">21a:第1保管架</p>  
        <p type="p">22:第2保管架群</p>  
        <p type="p">22a:第2保管架</p>  
        <p type="p">23:第3保管架群</p>  
        <p type="p">23a:第3保管架</p>  
        <p type="p">23b:昇降機構</p>  
        <p type="p">24:裝載埠</p>  
        <p type="p">3:批次處理部</p>  
        <p type="p">30:殼體</p>  
        <p type="p">30a:內部空間</p>  
        <p type="p">31:熱處理爐</p>  
        <p type="p">32:晶舟</p>  
        <p type="p">33:基板搬送機構</p>  
        <p type="p">9:控制部</p>  
        <p type="p">C:載具</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1538" publication-number="202614322"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614322.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614322</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123894</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>運送設備、微影設備及物品製造方法</chinese-title>  
        <english-title>CONVEYANCE APPARATUS, LITHOGRAPHY APPARATUS, AND ARTICLE MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L21/677</main-classification>  
        <further-classification edition="200601120251229B">B65G49/07</further-classification>  
        <further-classification edition="200601120251229B">G01N21/896</further-classification>  
        <further-classification edition="200601120251229B">G03F7/20</further-classification>  
        <further-classification edition="200601120251229B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹谷公男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEYA, KIMIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了一種用於運送物體的運送設備，包含：測量裝置，其配置成測量所述物體的表面的異物；運送器，其包括支架，所述支架配置成在接觸所述物體的所述表面的一部分的同時保持所述物體，以及所述運送器配置成在由所述支架保持所述物體的同時運送已由所述測量裝置測量了所述異物的所述物體；以及控制器，其配置成根據所述支架接觸的所述物體的所述表面的接觸區域中的特定異物來控制所述運送器對所述物體的運送，其中所述特定異物是從所述測量裝置的測量結果中獲得的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a conveyance apparatus for conveying an object, comprising: a measurement device configured to measure foreign particles on a surface of the object; a conveyer including a holder configured to hold the object while contacting a part of the surface of the object, and configured to convey the object for which the foreign particles have been measured by the measurement device, while holding the object by the holder; and a controller configured to control conveying the object by the conveyer, in accordance with specific foreign particles in a contact region to which the holder contacts among the surface of the object, wherein the specific foreign particles are obtained from a measurement result of the measurement device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:照明光學系統</p>  
        <p type="p">2:原件台</p>  
        <p type="p">3:投影光學系統</p>  
        <p type="p">4:基板台</p>  
        <p type="p">5:原件儲存容器</p>  
        <p type="p">6:原件儲存容器</p>  
        <p type="p">7:開盒器</p>  
        <p type="p">8:開盒器</p>  
        <p type="p">9:第一運送機構</p>  
        <p type="p">9a:機械手</p>  
        <p type="p">9b:驅動機構</p>  
        <p type="p">10:讀碼器</p>  
        <p type="p">11:光罩儲料器</p>  
        <p type="p">12:異物檢驗裝置</p>  
        <p type="p">13:對準台</p>  
        <p type="p">14:第二運送機構</p>  
        <p type="p">14a:機械手</p>  
        <p type="p">14b:驅動機構</p>  
        <p type="p">14c:支撐構件</p>  
        <p type="p">15:偵測器</p>  
        <p type="p">100:曝光設備</p>  
        <p type="p">100a:成形設備</p>  
        <p type="p">100b:原件運送設備</p>  
        <p type="p">UI:使用者介面</p>  
        <p type="p">CNT:控制器</p>  
        <p type="p">R:原件</p>  
        <p type="p">S:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1539" publication-number="202613330"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613330.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613330</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123940</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超硬合金及切削工具</chinese-title>  
        <english-title>CEMENTED CARBIDE AND CUTTING TOOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251028B">C22C29/08</main-classification>  
        <further-classification edition="200601120251028B">B23B27/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友電工硬質合金股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO ELECTRIC HARDMETAL CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>城戸保樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIDO, YASUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中佑樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関谷喬啓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKIYA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之超硬合金係具備由複數個碳化鎢粒子構成之第1硬質相、及含有鈷之結合相者，上述超硬合金之上述第1硬質相及上述結合相之合計含有率為80.0體積%以上，上述超硬合金之上述結合相之含有率為5.0體積%以上21.0體積%以下，上述結合相之鈷含有率為50質量%以上，上述超硬合金於200℃下之硬度H&lt;sub&gt;200&lt;/sub&gt;相對於25℃下之硬度H&lt;sub&gt;25&lt;/sub&gt;之百分率(H&lt;sub&gt;200&lt;/sub&gt;/H&lt;sub&gt;25&lt;/sub&gt;)×100為85%以上100%以下，上述超硬合金於200℃下之比熱c相對於上述超硬合金之上述結合相之質量基準之含有率M的比c/M為0.028以上0.042以下，上述超硬合金之上述結合相之質量基準之含有率M為3.0質量%以上13.0質量%以下，上述比熱c之單位為J/g・K。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cemented carbide of the present disclosure is a cemented carbide comprising a first hard phase consisting of a plurality of tungsten carbide particles and a binder phase containing cobalt, wherein a total content of the first hard phase and the binder phase of the cemented carbide is 80.0% by volume or more, a content of the binder phase of the cemented carbide is 5.0% by volume or more and 21.0% by volume or less, a cobalt content of the binder phase is 50% by mass or more, a percentage (H&lt;sub&gt;200&lt;/sub&gt;/H&lt;sub&gt;25&lt;/sub&gt;) × 100 of a hardness H&lt;sub&gt;200&lt;/sub&gt; of the cemented carbide at 200 ºC to a hardness H&lt;sub&gt;25&lt;/sub&gt; of the cemented carbide at 25ºC is 85% or more and 100% or less, a ratio c/M of a specific heat c of the cemented carbide at 200ºC to a content M of the binder phase of the cemented carbide based on mass is 0.028 or more and 0.042 or less, the content M of the binder phase of the cemented carbide based on mass is 3.0% by mass or more and 13.0% by mass or less, and a unit of the specific heat c is J/g•K.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:切削工具</p>  
        <p type="p">11:刀尖</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1540" publication-number="202613207"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613207.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613207</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114123995</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層體之圖型形成方法及用於該方法之組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">C08G73/10</main-classification>  
        <further-classification edition="200601120251230B">G03F7/038</further-classification>  
        <further-classification edition="200601120251230B">C08F220/54</further-classification>  
        <further-classification edition="200601120251230B">C08F2/50</further-classification>  
        <further-classification edition="200601120251230B">C08F2/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森元雄大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIMOTO, YUDAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畑中真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATANAKA, TADASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">&lt;b&gt;　　&lt;/b&gt;一種曝光光吸收膜形成用組成物，其係用於形成防止曝光光透過之曝光光吸收膜圖型之曝光光吸收膜形成用組成物， &lt;br/&gt;　　前述曝光光吸收膜形成用組成物含有鹼可溶性樹脂、吸收前述曝光光之光吸收劑及溶劑， &lt;br/&gt;　　將前述曝光光吸收膜形成用組成物燒成形成之曝光光吸收膜，對於用以將前述曝光光吸收膜加工為圖型狀並形成前述曝光光吸收膜圖型而用以形成配置於前述曝光光吸收膜上之阻劑膜的阻劑材料中含有之溶劑顯示溶劑耐性，且對於前述阻劑膜之鹼顯影液顯示溶解性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1541" publication-number="202613872"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613872.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613872</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124034</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積體電路設計系統及積體電路設計方法</chinese-title>  
        <english-title>INTEGRATED CIRCUIT DESIGN SYSTEM AND METHOD FOR DESIGN AN INTEGRATED CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251201B">G06F30/392</main-classification>  
        <further-classification edition="202501120251201B">H10D89/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李雄揆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WOONG-GYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李泰衡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TAEHYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供積體電路設計系統和積體電路設計方法。積體電路設計系統包括儲存裝置，儲存裝置儲存包括標準單元的佈局資訊和局部佈局效應（local layout effect，LLE）模型的單元庫，以及一個或多個處理器，執行設計模組以使得一個或多個處理器基於單元庫產生包括標準單元的積體電路的佈局，從對應於佈局的電路佈局驗證（layout versus schematic，LVS）網路連線表中提取積體電路中電晶體的LLE參數，以及根據基於LLE參數和LLE模型的LLE參數計算電晶體的物理特性的變化量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit design system and a method for design an integrated circuit are provided. The integrated circuit design system includes a storage device that stores a cell library including layout information of standard cells and a local layout effect (LLE) model, and one or more processors that execute a design module to cause the one or more processors to generate a layout of an integrated circuit including the standard cells based on the cell library, extract LLE parameters for a transistor in the integrated circuit from a layout versus schematic (LVS) netlist corresponding to the layout, and calculate variations of physical characteristics of the transistor according to the LLE parameters based on the LLE parameters and the LLE model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:設計方法</p>  
        <p type="p">110:RTL資料</p>  
        <p type="p">120:閘極層級網路連線表</p>  
        <p type="p">130:佈局資料</p>  
        <p type="p">140:LVS網路連線表</p>  
        <p type="p">S10:邏輯合成</p>  
        <p type="p">S20:佈局前模擬</p>  
        <p type="p">S30:放置和佈線</p>  
        <p type="p">S40:LVS分析</p>  
        <p type="p">S50:RC提取</p>  
        <p type="p">S60:佈局後模擬</p>  
        <p type="p">S70:LLE分析</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1542" publication-number="202612810"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612810.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612810</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124071</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連續鑄造用模鑄粉</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">B22D11/108</main-classification>  
        <further-classification edition="200601120251224B">B22D11/07</further-classification>  
        <further-classification edition="200601120251224B">B22D11/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大野浩之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHNO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤堂渉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TODO, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青木穗高</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, HODAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤村誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMURA, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係可廉價地提供在亞包晶鋼的連續鑄造時，可防止起因於鑄片之縱向裂紋所造成之操作故障及品質惡化的有效連續鑄造用模鑄粉。本發明的連續鑄造用模鑄粉，係可滿足：Ca以CaO換算之含有量相對於Si以SiO&lt;sub&gt;2&lt;/sub&gt;換算之含有量的質量比所表示鹼度(%CaO)/(%SiO&lt;sub&gt;2&lt;/sub&gt;)：1.30~1.60、Al以Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;換算的含有量：0~3.0質量%、Mg以MgO換算的含有量：1.0~3.0質量%、F含有量：8.0~12.0質量%、Na以Na&lt;sub&gt;2&lt;/sub&gt;O換算的含有量：超過5.0質量%且在9.0質量%以下、及Mn以MnO換算的含有量：2.0~5.0質量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1543" publication-number="202612656"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612656.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612656</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124320</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>治療器具</chinese-title>  
        <english-title>Treatment Instrument</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">A61B17/56</main-classification>  
        <further-classification edition="200601120251231B">A61B17/58</further-classification>  
        <further-classification edition="200601120251231B">A61B17/86</further-classification>  
        <further-classification edition="200601120251231B">A61B17/88</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本脊椎紀事股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPINE CHRONICLE JAPAN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米澤則隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEZAWA, NORITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉信金</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種治療器具，其包含從椎弓根被插入椎體內的內固定器具和外筒，如以下那樣構成。內固定器具具備具有能夠與外筒連接的第1連接部的頭部、和從頭部延伸至近位端的軸，在軸設置有以對形成於椎弓根的骨孔進行攻螺紋的方式被扭入的攻螺紋的螺紋牙。外筒具有能夠與內固定器具的上述第1連接部連接的第2連接部，第2連接部與第1連接部的連接狀態相對於與內固定器具通過攻螺紋的螺紋牙被扭入的方向相反方向的旋轉被維持。能夠提供一種治療器具，在產生了將來拔出在椎體形成術中已埋入於體內的內固定器具的必要時，其拔出也能夠容易進行。另外，在椎體形成術中，能夠使從椎弓根向椎體內填充骨水泥並向其中插入內固定器具的手法順序穩定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a treatment instrument comprising an internal fixation instrument and an outer tube inserted into the vertebral body from the pedicle, as follows. The internal fixation instrument has a head with a first connection part that can be connected to the outer tube, and a shaft extending from the head to the proximal end. The shaft is provided with threaded teeth that can be screwed into the bone hole formed in the pedicle by threading. The outer cylinder has a second connection part that can be connected to the first connection part of the internal fixation instrument, and the connection state between the second connection part and the first connection part is maintained in the opposite direction of rotation relative to the direction in which the threaded teeth of the internal fixation instrument are screwed in. Can provide a treatment instrument that can be easily removed when necessary to remove the internal fixation instrument already embedded in the body during vertebral body formation surgery in the future. In addition, in vertebral body formation surgery, the sequence of techniques for filling bone cement from the pedicle into the vertebral body and inserting internal fixation instrument into it can be stabilized.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:內固定器具</p>  
        <p type="p">2:外筒</p>  
        <p type="p">3:驅動器</p>  
        <p type="p">4:骨穿孔內筒</p>  
        <p type="p">10:治療器具</p>  
        <p type="p">12:連接部</p>  
        <p type="p">13:嵌合部</p>  
        <p type="p">14:軸</p>  
        <p type="p">15:攻螺紋的螺紋牙</p>  
        <p type="p">19:貫通孔</p>  
        <p type="p">21:連接部</p>  
        <p type="p">29:貫通孔</p>  
        <p type="p">41:骨穿孔部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1544" publication-number="202612646"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612646.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612646</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124390</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分析物的檢測方法及系統、電腦可讀存儲媒體及電子設備</chinese-title>  
        <english-title>ANALYTE DETECTION METHOD AND SYSTEM, COMPUTER READABLE STORAGE MEDIUM AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">A61B5/1455</main-classification>  
        <further-classification edition="200601120251231B">G01N21/64</further-classification>  
        <further-classification edition="201401120251231B">G01N21/35</further-classification>  
        <further-classification edition="200601120251231B">G01J3/28</further-classification>  
        <further-classification edition="201701120251231B">G06T7/00</further-classification>  
        <further-classification edition="201901120251231B">G06N20/00</further-classification>  
        <further-classification edition="200601120251231B">G01N33/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商森舒瑞私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENSURA PTE. LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭宏志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, HONGZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種分析物的檢測方法、系統、媒體及設備，屬於光學分析領域，包括：成像步驟：通過第一波長範圍內的紅外光照射第一區域並對第一區域進行成像，通過第二波長範圍內的紫外光照射第一區域並對第一區域進行成像；光譜獲取步驟：從所述第二圖像中選取檢測點和參考點，得到成像區域中分析物的信息，所述分析物的信息包括分析物與光譜數據關聯的信息；補償步驟：根據檢測點與參考點之間在第一圖像中的灰度差，對分析物的信息進行補償。本申請相對於僅僅通過不同區域的光譜數據進行分析的方式，檢測結果更加準確。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method, system, media, and device for detecting an analyte belong to the field of optical analysis, which comprise: an imaging step: illuminating a first region with infrared light within a first wavelength range and imaging the first region; illuminating the first region with ultraviolet light within a second wavelength range and imaging the first region; a spectral acquisition step: selecting a detection point and a reference point from the second image to obtain information about the analyte in the imaging region, the analyte information including information associated with spectral data; and a compensation step: compensating the analyte information based on the grayscale difference between the detection point and the reference point in the first image. Compared to methods that analyze only spectral data from different regions, the application provides more accurate detection results.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1545" publication-number="202614199"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614199.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614199</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124415</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻方法及半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250822B">H01L21/306</main-classification>  
        <further-classification edition="202501120250822B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, DAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示具備，(a)工序，使用包含有自由基化之氧的氣體，分別將露出SiGe層之第1側面、露出Si層之第2側面加以氧化，而在第1側面內形成氧化SiGe膜，且在第2側面內形成氧化Si膜，(b)工序，使用氟化氫，或氟化氫與惰性氣體之混合氣體，一邊將半導體基板之溫度維持在TL(℃)以上TH(℃)以下的範圍內，一邊選擇性蝕刻氧化SiGe膜；如果SiGe層中Ge對Si之原子數比例為C(%)，(b)工序中氟化氫的壓力或分壓為P(Pa)，則C(%)＜25%，50Pa≦P(Pa)≦1000Pa，TL=11.3×LN(P)+0.23×C-97.4，TH=13×LN(P)+C-102。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:Si層</p>  
        <p type="p">2:SiGe層</p>  
        <p type="p">10:晶圓平台</p>  
        <p type="p">100:氧化Si膜</p>  
        <p type="p">200:氧化SiGe膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1546" publication-number="202614323"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614323.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614323</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124430</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及搬運計畫的製作方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250703B">H01L21/677</main-classification>  
        <further-classification edition="200601120250703B">H01L21/02</further-classification>  
        <further-classification edition="200601120250703B">B25J11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮田康平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYATA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>智田崇文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIDA, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>末光芳郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUEMITSU, YOSHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內木大地</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAIKI, DAICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">基板處理裝置(100)具有在真空環境下處理基板的真空側資源、在大氣環境下處理基板的大氣側資源、控制基板搬運的動作控制部(101)；動作控制部，是將事先定義之多個搬運動作中任一個的序列製作為搬運檔案；搬運動作包含真空機器人的預載室投入動作、真空機器人的預載室排出動作、真空機器人的預載室交換動作、大氣機器人的預載室投入動作、大氣機器人的預載室排出動作、大氣機器人的預載室交換動作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:動作控制部</p>  
        <p type="p">102:主機電腦</p>  
        <p type="p">103:網路</p>  
        <p type="p">401:處理部</p>  
        <p type="p">402:記憶部</p>  
        <p type="p">411:資料取得部</p>  
        <p type="p">412:搬運檔案選定部</p>  
        <p type="p">413:搬運檔案草案產生部</p>  
        <p type="p">414:模擬處理部</p>  
        <p type="p">415:動作指示部</p>  
        <p type="p">421:動作時間資料</p>  
        <p type="p">422:搬運動作定義資料</p>  
        <p type="p">423:搬運檔案草案資料</p>  
        <p type="p">424:晶圓狀態資料</p>  
        <p type="p">425:動作序列資料</p>  
        <p type="p">426:模擬評估資料</p>  
        <p type="p">427:等候時間評估算式</p>  
        <p type="p">428:晶圓去處資料</p>  
        <p type="p">429:設備狀態資料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1547" publication-number="202612786"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612786.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612786</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124467</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄膜製造裝置</chinese-title>  
        <english-title>THIN FILM PRODUCING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">B05B17/06</main-classification>  
        <further-classification edition="200601120251218B">B05C9/14</further-classification>  
        <further-classification edition="200601120251218B">B05C13/02</further-classification>  
        <further-classification edition="200601120251218B">B05D1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＭＥＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TMEIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩尾有佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWAO, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平松孝浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAMATSU, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中西優生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANISHI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海老沢優弥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBISAWA, MASAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北垣剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAGAKI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供可謀求節拍時間降低化的薄膜製造裝置。對此，本發明的薄膜製造裝置(501)係包含超音波霧化裝置(101)、加熱機構(201)及基材旋轉機構(301)而構成。基材旋轉機構(301)係藉由旋轉帶驅動用馬達(30)的驅動而執行基材旋轉處理，使包含成膜部(15m)的圓筒基材(15)旋轉。藉由基材旋轉處理，使圓筒基材(15)設定成第一及第二配置狀態之中的一狀態。超音波霧化裝置(101)係對設定成第一配置狀態的成膜部(15m)的成膜區域執行霧氣供給處理。加熱機構(201)係在成膜部(15m)的成膜區域設定成第二配置狀態時，執行加熱處理，將霧氣供給處理後的第二配置狀態的成膜區域加熱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure aims to provide a thin film producing apparatus that reduces takt time. A thin film producing apparatus (501) according to the present disclosure includes an ultrasonic atomizer (101), a heating mechanism (201), and a substrate rotation mechanism (301). The substrate rotation mechanism (301) performs a substrate rotation process in which a cylindrical substrate (15) including a film formation unit (15m) is rotated by driving a rotary belt drive motor (30). The substrate rotation process sets the cylindrical substrate (15) to one of a first and second arrangement states. The ultrasonic atomizer (101) performs a mist supply process on a film formation region of the film formation unit (15m) set to the first arrangement state. When the film formation region of the film formation unit (15m) is set to the second arrangement state, the heating mechanism (201) performs a heating process to heat the film formation region in the second arrangement state after the mist supply process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">15:圓筒基材</p>  
        <p type="p">15m:成膜部</p>  
        <p type="p">15s:保持部</p>  
        <p type="p">16:圓筒基材支持治具</p>  
        <p type="p">18:加熱治具</p>  
        <p type="p">30:旋轉帶驅動用馬達</p>  
        <p type="p">31:夾頭治具</p>  
        <p type="p">32:附軸承滾輪</p>  
        <p type="p">33:附軸承滾輪支持治具</p>  
        <p type="p">39:旋轉帶</p>  
        <p type="p">201:加熱機構</p>  
        <p type="p">301:基材旋轉機構</p>  
        <p type="p">501,501A:薄膜製造裝置</p>  
        <p type="p">D39:行進方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1548" publication-number="202614484"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614484.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614484</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124490</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有多種功能之整合模組</chinese-title>  
        <english-title>INTEGRATED MODULE HAVING MULTIPLE FUNCTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01Q1/52</main-classification>  
        <further-classification edition="200601120251226B">H01Q21/28</further-classification>  
        <further-classification edition="200601120251226B">H05K9/00</further-classification>  
        <further-classification edition="201501120251226B">H01Q5/378</further-classification>  
        <further-classification edition="200601120251226B">H01Q1/24</further-classification>  
        <further-classification edition="200601120251226B">H05K1/18</further-classification>  
        <further-classification edition="201101120251226B">H04N21/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商ＬＧ伊諾特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG INNOTEK CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張泰京</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, TAE GYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金亨錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUNG SUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴良洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, YANG SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳瑞田</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種根據本發明之一實施例之整合模組包括：一印刷電路板；一第一天線，其用於藍芽通訊，安置於該印刷電路板上；一第二天線及一第三天線，其用於Wi-Fi通訊，安置於該印刷電路板上；一蓋，其經組態以環繞該印刷電路板之除了該第一天線至該第三天線之外的一部分；以及一第一連接件及一第二連接件，其安置於該蓋之一上表面之一側處且經組態以接收地面廣播或衛星廣播，其中該第一天線及該第二天線安置於該印刷電路板之該上表面之該一側處，該第三天線安置於與安置有該第一天線及該第二天線之該一側相鄰之一側處，安置有該第三天線之該一側及安置有該第一連接件及該第二連接件之該一側係彼此面對之側表面，且該蓋之一些側表面係安置於該印刷電路板內部之側表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated module according to an embodiment of the present invention includes a printed circuit board, a first antenna for Bluetooth communication disposed on the printed circuit board, a second antenna and a third antenna for Wi-Fi communication disposed on the printed circuit board, a cover configured to surround a portion of the printed circuit board excluding the first to third antennas, and a first connector and a second connector disposed at one side of an upper surface of the cover and configured to receive terrestrial or satellite broadcasting, wherein the first antenna and the second antenna are disposed at the one side of the upper surface of the printed circuit board, the third antenna is disposed at one side adjacent to the one side at which the first antenna and the second antenna are disposed, the one side at which the third antenna is disposed and the one side at which the first connector and the second connector are disposed are side surfaces facing each other, and some side surfaces of the cover are side surfaces disposed inside the printed circuit board.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:整合模組</p>  
        <p type="p">110:印刷電路板(PCB)</p>  
        <p type="p">120:第一天線/天線</p>  
        <p type="p">130:天線/第二天線</p>  
        <p type="p">140:第三天線/天線</p>  
        <p type="p">150:蓋</p>  
        <p type="p">160:第一連接件</p>  
        <p type="p">170:第二連接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1549" publication-number="202614048"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614048.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614048</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124524</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>儲存裝置以及使用儲存裝置實行自參考讀取的方法</chinese-title>  
        <english-title>STORAGE DEVICE AND METHOD OF PERFORMING SELF-REFERENCE READING USING STORAGE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251118B">G11C11/02</main-classification>  
        <further-classification edition="202301120251118B">H10B61/00</further-classification>  
        <further-classification edition="200601120251118B">G11C16/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山昌彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAYAMA, MASAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施例提供一種能夠對儲存於記憶體胞元中的資料進行準確讀取的儲存裝置。 &lt;br/&gt;根據實施例，一種儲存裝置包括連接於第一配線與第二配線之間的記憶體胞元，記憶體胞元包括可變電阻記憶體元件及開關元件，且儲存裝置更包括控制器，控制器被配置成：在第一時間點處將開關元件設定為接通狀態，且獲得在經過第一時間段時施加於第一配線與第二配線之間的待確定電壓；在寫入時段期間將可變電阻記憶體元件設定為參考電阻狀態；在第二時間點處將開關元件設定為接通狀態，且獲得在經過與第一時間段不同的第二時間段時施加於第一配線與第二配線之間的參考電壓；以及基於待確定電壓及參考電壓來確定可變電阻記憶體元件的待確定電阻狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments provide a storage device capable of accurately reading data stored in memory cells. &lt;br/&gt;According to embodiments, a storage device includes a memory cell connected between first and second wires, the memory cell including a variable resistance memory element and a switching element, and the storage device further includes a controller configured to: set the switching element to an ON state at a first time point, and obtain a voltage to be determined applied between the first and second wires when a first time period elapses; set the variable resistance memory element to a reference resistance state during a write period; set the switching element to the ON state at a second time point, and obtain a reference voltage applied between the first and second wires when a second time period different from the first time period elapses; and determine, based on the voltage to be determined and the reference voltage, a resistance state to be determined of the variable resistance memory element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(a)、(b):部分/特性部分</p>  
        <p type="p">H、L:特性/電位</p>  
        <p type="p">td:待確定電壓獲得時間點</p>  
        <p type="p">ton1:第一接通狀態設定時間點</p>  
        <p type="p">ton2:第二接通狀態設定時間點</p>  
        <p type="p">tr:參考電壓獲得時間點</p>  
        <p type="p">VGND:接地電壓</p>  
        <p type="p">Vholdh:高電阻狀態</p>  
        <p type="p">Vholdl:低電阻狀態</p>  
        <p type="p">Vth+α、Vusel:電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1550" publication-number="202613046"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613046.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613046</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124604</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水處理方法及水處理系統</chinese-title>  
        <english-title>WATER TREATMENT METHOD AND WATER TREATMENT SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251230B">C02F9/00</main-classification>  
        <further-classification edition="202301120251230B">C02F1/44</further-classification>  
        <further-classification edition="200601120251230B">B01D61/02</further-classification>  
        <further-classification edition="200601120251230B">B01D61/12</further-classification>  
        <further-classification edition="200601120251230B">E03B7/07</further-classification>  
        <further-classification edition="200601320251230B">C02F101/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商奧璐佳瑙股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORGANO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村勇規</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋一重</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, KAZUSHIGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田響介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, KYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>須藤史生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUDO, FUMIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種水處理系統，其處理含有尿素之原水以生成尿素濃度降低的處理水，該水處理系統具有：藥劑添加裝置(40)，於暫時儲存原水的原水槽(11)或比原水槽(11)更上游的位置，將分解原水中所含的尿素之藥劑添加至原水；逆滲透膜裝置(20)，具備逆滲透膜(25)且被供給從原水槽(11)排出的水；及分析裝置(51)，將未透過逆滲透膜(25)而從逆滲透膜裝置(20)排出的濃縮水作為分析對象水，測定分析對象水中的尿素濃度。根據利用分析裝置(51)的測定結果，控制藉由藥劑添加裝置(40)添加至原水中之藥劑的量、原水的水溫、原水的pH之至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A water treatment system which treats a raw water containing urea to generate a treated water with a reduced urea concentration comprises: a chemical reagent addition device (40) which adds a chemical reagent that breaks down the urea in the raw water to the raw water, either in a raw water tank (11) that temporarily stores the raw water or at a position upstream of the raw water tank (11); a reverse osmosis membrane device (20) which comprises a reverse osmosis membrane (25) and to which the water discharged from the raw water tank (11) is supplied; and an analysis device (51) which measures the urea concentration in a water to be analyzed composed of the concentrate discharged from the reverse osmosis membrane device (20) without passing through the reverse osmosis membrane (25). Depending on the measurement results from the analysis device (51), at least one of the amount of the chemical reagent added to the raw water by the chemical reagent addition device (40), the temperature of the raw water, and the pH of the raw water is controlled.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:原水槽</p>  
        <p type="p">12:砂過濾裝置</p>  
        <p type="p">13,16,31:中間儲槽</p>  
        <p type="p">14:活性碳裝置</p>  
        <p type="p">15,33:離子交換裝置</p>  
        <p type="p">20:逆滲透膜(RO膜)裝置</p>  
        <p type="p">25:逆滲透膜</p>  
        <p type="p">32:紫外線氧化裝置</p>  
        <p type="p">34:膜脫氣裝置</p>  
        <p type="p">40:藥劑添加裝置</p>  
        <p type="p">41,42:泵</p>  
        <p type="p">51:尿素分析裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1551" publication-number="202613062"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613062.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613062</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124608</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合體及半導體製造裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251228B">C04B37/02</main-classification>  
        <further-classification edition="200601120251228B">B23K35/34</further-classification>  
        <further-classification edition="200601120251228B">B23K1/20</further-classification>  
        <further-classification edition="200601120251228B">H01L21/48</further-classification>  
        <further-classification edition="200601120251228B">H01L21/67</further-classification>  
        <further-classification edition="200601120251228B">H01L23/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本特殊陶業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITERRA CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中智雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, TOMOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉本修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIMOTO, OSAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>櫻井利之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKURAI, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案課題為提供一種接合體，其接合性經提升，且起因於熱膨脹係數差之殘留應力經減少。&lt;br/&gt; 本案解決手段為一種接合體，其具備以陶瓷形成之第1構件、以陶瓷或金屬形成之第2構件、及包含Ti(鈦)、Hf(鉿)與Zr(鋯)中的任一者之接合層，該接合層係配置在第1構件與第2構件之間的以In(銦)與Sn(錫)中的任一者為主成分之接合層，其中接合層具有包含Ti、Hf與Zr中的任一者之化合物，在沿著積層有第1構件、接合層及第2構件的積層方向之截面中，於在第1構件與接合層之間所形成的第1界面區域中，該化合物所占的面積比為6%以上60%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:靜電吸盤(接合體)</p>  
        <p type="p">10:陶瓷構件(第1構件)</p>  
        <p type="p">11:上部</p>  
        <p type="p">12:下部</p>  
        <p type="p">20:金屬構件(第2構件)</p>  
        <p type="p">30:接合層</p>  
        <p type="p">100:吸盤電極</p>  
        <p type="p">200:冷媒流路</p>  
        <p type="p">RG:區域</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1552" publication-number="202614195"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614195.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614195</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124806</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">H01L21/304</main-classification>  
        <further-classification edition="201401120251224B">B23K26/046</further-classification>  
        <further-classification edition="201401120251224B">B23K26/53</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栄紘太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAE, KOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久野和哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HISANO, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩永和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWANAGA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田村武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMURA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">處理基板的基板處理裝置，其具有：&lt;br/&gt; 雷射照射部，向該基板照射雷射光；&lt;br/&gt; 透鏡，包含於該雷射照射部；&lt;br/&gt; 致動器，使該透鏡升降；&lt;br/&gt; 測定部，測定該基板的正面高度；及&lt;br/&gt; 控制部；&lt;br/&gt; 該控制部，執行以下控制：&lt;br/&gt; 使用該測定部，於配置在該基板的周向上之複數個周向測定點測定該基板的正面高度；&lt;br/&gt; 根據在該周向測定點所測定之該基板的正面高度，並配合在該基板的周向位置上之該雷射光的照射位置，來決定該透鏡的高度；及&lt;br/&gt; 使用該致動器，使該透鏡移動至該決定的高度，並沿著該基板的周向以脈衝狀的方式從該雷射照射部將該雷射光照射至該基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">St1:取得卡盤100與重合晶圓T的偏心量</p>  
        <p type="p">St2:測定第1晶圓W的反面Wb的高度</p>  
        <p type="p">St3:製作關於反面Wb之高度的表格</p>  
        <p type="p">St4:決定透鏡113的高度</p>  
        <p type="p">St5:照射第1雷射光L1，形成接合力降低區域R</p>  
        <p type="p">St6:照射第2雷射光L2，形成周緣改質區域N</p>  
        <p type="p">St7:去除周緣部We</p>  
        <p type="p">St8:清洗第1晶圓W及第2晶圓S</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1553" publication-number="202612589"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612589.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612589</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124853</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生麵團供給裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">A21C3/04</main-classification>  
        <further-classification edition="200601120251231B">A21C11/20</further-classification>  
        <further-classification edition="200601120251231B">A21C11/16</further-classification>  
        <further-classification edition="201601120251231B">A23P30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商雷恩自動機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RHEON AUTOMATIC MACHINERY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川雄也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 提供能夠降低生麵團之供給中的脈動的生麵團供給裝置。 &lt;br/&gt;　　[解決手段] 生麵團供給裝置(2)的生麵團搬運機構(20)，包含左側的螺桿(23L)與右側的螺桿(23R)。從搬運方向(A)來看時，左側的螺桿(23L)與右側的螺桿(23R)，以該等的外周不會重疊的方式配置。在上游部(21)，左側的葉片(25L)與右側的葉片(25R)，處於如同鏡像般相對的相位配置，在下游部(22)，左側的葉片(25L)與右側的葉片(25R)，處於相對於上游部(21)的相位配置錯開180度的相位配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:包餡機</p>  
        <p type="p">2:生麵團供給裝置</p>  
        <p type="p">4:重合噴嘴</p>  
        <p type="p">11:底部殼體</p>  
        <p type="p">20:生麵團搬運機構</p>  
        <p type="p">21:上游部</p>  
        <p type="p">22:下游部</p>  
        <p type="p">23L:左側的螺桿</p>  
        <p type="p">23R:右側的螺桿</p>  
        <p type="p">24L:軸</p>  
        <p type="p">24R:軸</p>  
        <p type="p">25L:左側的葉片</p>  
        <p type="p">25R:右側的葉片</p>  
        <p type="p">26:開口</p>  
        <p type="p">30:容積式的泵</p>  
        <p type="p">31:螺桿泵</p>  
        <p type="p">40:泵殼體</p>  
        <p type="p">41L:左側的泵部</p>  
        <p type="p">41R:右側的泵部</p>  
        <p type="p">42L:軸</p>  
        <p type="p">42R:軸</p>  
        <p type="p">43L:左側的嚙合螺桿</p>  
        <p type="p">43R:右側的嚙合螺桿</p>  
        <p type="p">45:溝槽</p>  
        <p type="p">P1,P2,P2’,P3:螺距</p>  
        <p type="p">R1:順時針方向</p>  
        <p type="p">R2:逆時針方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1554" publication-number="202613443"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613443.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613443</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124899</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>節點隔離裝置、系統及方法</chinese-title>  
        <english-title>NODE ISOLATION DEVICES, SYSTEMS AND METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">F16K31/02</main-classification>  
        <further-classification edition="200601120251218B">F16K13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商水冷系統公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COOLIT SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舍爾溫　馬雷克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SERWIN, MAREK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納傑力　穆罕默德　雷扎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAJJARI, MOHAMMAD REZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於一閥之機電致動器，其可具有經組態以包封一市售液體耦合器之一部分的一套環。該套環可契合該液體耦合器之一區域且一偏置部件可推動該套環以位移該液體耦合器之一可移動部件且藉此打破一耦合。一凸座可抵抗由該偏置部件施加之力來保持該套環且一拉力部件可在臨限拉力下縮回該凸座，從而釋放該套環以在該偏置部件之影響下移動。其他閥具有一閘元件，該閘元件與一電樞耦合以使該閘元件在一電磁場下旋轉。該閘元件可界定一凹槽且一保持器可駐留於該凹槽中。當該閘元件旋轉時，該保持器可與該凹槽之一縱向分段對準且允許該閘元件縱向位移。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electro-mechanical actuator for a valve can have a collar configured to envelope a portion of a commercially available liquid coupler. The collar can engage a region of the liquid coupler and a bias member can urge the collar to displace a movable member of the liquid coupler and thereby to break a coupling. A dowel can retain the collar against the force applied by the bias member and a tension member can, under threshold tension, retract the dowel, releasing the collar to move under influence of the bias member. Other valves have a gate element coupled with an armature to rotate the gate element under an electromagnetic field. The gate element can define a recess and a retainer can reside in the recess. As the gate element rotates, the retainer can align with a longitudinal segment of the recess and allow the gate element to displace longitudinally.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401a:收集歧管</p>  
        <p type="p">401b:分配歧管</p>  
        <p type="p">402a:出口導管</p>  
        <p type="p">402b:進口導管</p>  
        <p type="p">410a:耦合器部件</p>  
        <p type="p">410b:耦合器部件</p>  
        <p type="p">420a:耦合器部件</p>  
        <p type="p">420b:耦合器部件</p>  
        <p type="p">430:致動器軸件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1555" publication-number="202614903"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614903.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614903</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124923</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置、電子裝置、顯示裝置的製造方法及電子裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251224B">H10K59/10</main-classification>  
        <further-classification edition="200601120251224B">H05K7/18</further-classification>  
        <further-classification edition="202301120251224B">H10K77/10</further-classification>  
        <further-classification edition="202301120251224B">H10K59/80</further-classification>  
        <further-classification edition="200601120251224B">G06F1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村肇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, HAJIME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎舜平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, SHUNPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種框架區域小的顯示裝置。本發明的一個實施方式提供一種具有撓性的顯示裝置，該顯示裝置包括第一及第二區域，所述第一區域包括能夠顯示的區域，所述第二區域包括能夠使所述顯示裝置彎折的區域，所述第二區域包括不包括剝離層的區域。由於不包括剝離層，所以可以減薄彎折部分的厚度。因此，在彎折時，可以減小曲率半徑。由此，可以縮小顯示裝置的框架區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">104:端部</p>  
        <p type="p">202:支撐基板</p>  
        <p type="p">203:支撐基板</p>  
        <p type="p">204:剝離層</p>  
        <p type="p">205:剝離層</p>  
        <p type="p">401:導電層</p>  
        <p type="p">402:絕緣層</p>  
        <p type="p">403:絕緣層</p>  
        <p type="p">404:元件部</p>  
        <p type="p">405:連接端子部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1556" publication-number="202612862"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612862.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612862</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114124941</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多關節機器人</chinese-title>  
        <english-title>ARTICULATED ROBOT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B25J9/08</main-classification>  
        <further-classification edition="200601120251229B">B25J9/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立田典久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TATSUTA, NORIHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>脇光俊介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKIMITSU, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寺西泰貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERANISHI, TAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明旨在提供一種多關節機器人（1），包括連桿（31）、第一致動器（41）、第二致動器（42）以及線條體（5），連桿（31）的第一端（311）包含於第一關節（JT1），並且第二端（312）包含於第二關節（JT2），第一致動器（41）與第一關節相連接且位於以連桿為基準的第一側，第二致動器（42）與第二關節相連接且以連桿為基準位於與第一致動器相反的第二側，線條體（5）在前述第一端與前述第二端之間，以從第一側向第二側或從第二側向第一側橫穿連桿的方式延伸，並且與第一致動器及第二致動器相連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An articulated robot according to the present invention includes a link (31) having a first end (311) that is contained in a first joint (JT1) and a second end (312) that is contained in a second joint (JT2); a first actuator (41) connected to the first joint and located on a first side of the link; a second actuator (42) connected to the second joint and located on a second side of the link opposite the first actuator; and a wire that extends across the link between the first and second ends from the first side to the second side or from the second side to the first side, and is connected to the first and second actuators.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:多關節機器人</p>  
        <p type="p">5:線束(線條體)</p>  
        <p type="p">9:控制器</p>  
        <p type="p">21:第一基座</p>  
        <p type="p">22:基座主體</p>  
        <p type="p">23:支承部</p>  
        <p type="p">31:第一連桿</p>  
        <p type="p">32:第二連桿</p>  
        <p type="p">33:第三連桿</p>  
        <p type="p">35:第二基座</p>  
        <p type="p">36:水平連桿</p>  
        <p type="p">41~45:致動器</p>  
        <p type="p">56:第六部分</p>  
        <p type="p">61:第一夾具</p>  
        <p type="p">62:第二夾具</p>  
        <p type="p">63:第三夾具</p>  
        <p type="p">64:第四夾具</p>  
        <p type="p">65:第五夾具</p>  
        <p type="p">66:第六夾具</p>  
        <p type="p">100:地板</p>  
        <p type="p">311:第一端</p>  
        <p type="p">312:第二端</p>  
        <p type="p">321:第一端</p>  
        <p type="p">322:第二端</p>  
        <p type="p">331:第一端</p>  
        <p type="p">Ax1~Ax8:軸線</p>  
        <p type="p">JT1~JT5、JT8:關節</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1557" publication-number="202613138"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613138.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613138</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125113</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偶氮化合物、組合物、膜、積層體及顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D513/04</main-classification>  
        <further-classification edition="200601120251201B">C09B35/34</further-classification>  
        <further-classification edition="200601120251201B">C09K19/60</further-classification>  
        <further-classification edition="200601120251201B">G02B5/30</further-classification>  
        <further-classification edition="200601120251201B">B32B27/20</further-classification>  
        <further-classification edition="200601120251201B">G02F1/1335</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西本真生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMOTO, MAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石渡康司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIWATA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種過濾性及經時穩定性提高之二色性色素、包含其之組合物、由該組合物形成之膜、具備該膜之積層體及具備該積層體之顯示裝置。 &lt;br/&gt;本發明之二色性色素包含至少2種以上之下式(1)所表示之偶氮化合物，且同時滿足下式(2)、(3)、(4)。 &lt;br/&gt;&lt;img align="absmiddle" height="243px" width="633px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;δD&lt;sub&gt;d&lt;/sub&gt;＝(δD&lt;sub&gt;max&lt;/sub&gt;－δD&lt;sub&gt;min&lt;/sub&gt;)/δD&lt;sub&gt;max&lt;/sub&gt;≧0.04 (2) &lt;br/&gt;δP&lt;sub&gt;d&lt;/sub&gt;＝(δP&lt;sub&gt;max&lt;/sub&gt;－δP&lt;sub&gt;min&lt;/sub&gt;)/δP&lt;sub&gt;max&lt;/sub&gt;≧0.20        (3) &lt;br/&gt;δH&lt;sub&gt;d&lt;/sub&gt;＝(δH&lt;sub&gt;max&lt;/sub&gt;－δH&lt;sub&gt;min&lt;/sub&gt;)/δH&lt;sub&gt;max&lt;/sub&gt;≧0.20 (4)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1558" publication-number="202614897"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614897.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614897</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125138</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及包括其之電子裝置</chinese-title>  
        <english-title>DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251228B">H10H29/30</main-classification>  
        <further-classification edition="202301120251228B">H10K59/12</further-classification>  
        <further-classification edition="202501120251228B">H10H29/39</further-classification>  
        <further-classification edition="202301120251228B">H10K59/123</further-classification>  
        <further-classification edition="202301120251228B">H10K59/122</further-classification>  
        <further-classification edition="201601120251228B">G09G3/3275</further-classification>  
        <further-classification edition="200601120251228B">G09G3/20</further-classification>  
        <further-classification edition="201601120251228B">G09G3/3225</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星顯示器有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔忠碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, CHUNG SOCK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高裕敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, YOOMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金善浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金惠琬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYEWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴注燦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUCHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫藝林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, YERIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李弼錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, PILSUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪性珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, SUNGJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">顯示裝置包括：複數個像素電路區塊，該複數個像素電路區塊中的每一個包括具有複數個電晶體的至少一像素驅動電路部分；發光元件，電性連接像素驅動電路部分，並包括陽極電極及陰極電極；第一電源電壓線；第二電源電壓線；開關電路部分，與像素電路區塊一對一電性連接，並包括：第一開關元件，連接至第一電源電壓線，且由第一電壓位準導通；第二開關元件，連接至第二電源電壓線，且由不同於第一電壓位準的第二電壓位準導通；以及資料線，電性連接至開關電路部分，資料線向開關電路部分提供第一電壓位準或第二電壓位準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device includes a plurality of pixel circuit blocks each including at least one pixel driving circuit part including a plurality of transistors, a light-emitting element electrically connected to the pixel driving circuit part and including an anode electrode and a cathode electrode, a first power supply voltage line, a second power supply voltage line, a switching circuit part electrically connected to the pixel circuit blocks in a one-to-one basis and including a first switching element connected to the first power supply voltage line and turned on by a first voltage level, a second switching element connected to the second power supply voltage line and turned on by a second voltage level different from the first voltage level, and a data line electrically connected to the switching circuit part which provides the first voltage level or the second voltage level to the switching circuit part.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">C1,C2,C_S:電容</p>  
        <p type="p">DATA1,DATA2:資料電壓</p>  
        <p type="p">DL_P,DL_S:資料線</p>  
        <p type="p">EL1,EL2:發光控制線</p>  
        <p type="p">ELVSS,ELVDD_H,ELVDD_L:電源電壓</p>  
        <p type="p">EM1:發光控制訊號</p>  
        <p type="p">GIL,GL,GRL,GWL:閘極線</p>  
        <p type="p">GI,GR,GS,GW:閘極訊號</p>  
        <p type="p">LED:發光元件</p>  
        <p type="p">M1-M3:開關元件</p>  
        <p type="p">N1-N5:節點</p>  
        <p type="p">PC:像素驅動電路部分</p>  
        <p type="p">PV_CL:輸出電源連接線</p>  
        <p type="p">PVL_H,PVL_L:電源電壓線</p>  
        <p type="p">PX:像素</p>  
        <p type="p">ID:驅動電流</p>  
        <p type="p">SPC:開關電路部分</p>  
        <p type="p">T1-T5,TR:電晶體</p>  
        <p type="p">VINT:初始化電壓</p>  
        <p type="p">VL1,VL2,VL3:電壓線</p>  
        <p type="p">VREF:參考電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1559" publication-number="202613996"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613996.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613996</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125183</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置及用於控制在電子裝置所顯示的影像內容之方法</chinese-title>  
        <english-title>ELECTRONIC DEVICE AND METHOD FOR CONTROLLING IMAGE CONTENT DISPLAYED THEREON</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251001B">G08G5/36</main-classification>  
        <further-classification edition="200601120251001B">G02F1/133</further-classification>  
        <further-classification edition="200601120251001B">H04N5/262</further-classification>  
        <further-classification edition="200601120251001B">G06T1/00</further-classification>  
        <further-classification edition="202401120251001B">G06T5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虹彩光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>能勢將樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOSE, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富田順二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMITA, JUNJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖奇璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHI CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，其包括麥克風、處理器、顯示控制器及顯示裝置。麥克風經配置以接收來自該電子裝置的一使用者的一語音信號。處理器經配置以根據該語音信號在大型語言模型、語音辨識模型及影像生成模型之間執行遠端協調程序。顯示控制器經配置以根據從遠端協調程序所獲得的影像信號以產生多個控制信號。顯示裝置經配置以根據該等控制信號及影像信號以呈現顯示影像。顯示裝置在更新顯示影像時開啟，並在更新顯示影像完成後關閉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device is provided, which includes a microphone, a processor, a display controller, and a display device. The microphone is configured to receive a speech signal from a user of the electronic device. The processor is configured to perform a remote coordinating procedure based on the speech signal between a large language model, a speech recognition model, and an image generation model. The display controller is configured to generate control signals based on an image signal obtained from the remote coordinating procedure. The display device is configured to render a display image based on the control signals and the image signal. The display device is turned on during updating the display image and turned off upon completion of updating the display image.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:方法</p>  
        <p type="p">510:步驟</p>  
        <p type="p">520:步驟</p>  
        <p type="p">530:步驟</p>  
        <p type="p">540:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1560" publication-number="202614223"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614223.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614223</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125210</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置、靜電夾頭之製造方法及靜電夾頭之再生方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H01L21/316</main-classification>  
        <further-classification edition="200601120251217B">H01L21/312</further-classification>  
        <further-classification edition="200601120251217B">C23C16/455</further-classification>  
        <further-classification edition="200601120251217B">H01L21/687</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤雅紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, MASANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之電漿處理裝置具備：電漿處理腔室；靜電夾頭，其配置於上述電漿處理腔室內且含有氧化鋁；氣體供給部；電漿產生部；及控制部；上述控制部構成為執行包括如下控制之控制，即：(a)於上述電漿處理腔室內，使利用上述氣體供給部供給之含三甲基鋁之氣體接觸上述靜電夾頭，而於上述靜電夾頭上沉積含三甲基鋁之膜；及(b)於上述(a)之後，於上述電漿處理腔室內，使利用上述氣體供給部及上述電漿產生部所產生之O&lt;sub&gt;2&lt;/sub&gt;電漿接觸上述含三甲基鋁之膜，而於上述靜電夾頭上形成含氧化鋁之膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電漿處理裝置</p>  
        <p type="p">2:控制部</p>  
        <p type="p">2a:電腦</p>  
        <p type="p">2a1:處理部</p>  
        <p type="p">2a2:記憶部</p>  
        <p type="p">2a3:通信介面</p>  
        <p type="p">10:電漿處理腔室</p>  
        <p type="p">10e:氣體排出口</p>  
        <p type="p">10s:電漿處理空間</p>  
        <p type="p">11:基板支持部</p>  
        <p type="p">13:中央氣體注入部</p>  
        <p type="p">13a:氣體供給口</p>  
        <p type="p">13b:氣體流路</p>  
        <p type="p">13c:氣體導入口</p>  
        <p type="p">14:天線</p>  
        <p type="p">20:氣體供給部</p>  
        <p type="p">21:氣體源</p>  
        <p type="p">22:流量控制器</p>  
        <p type="p">30:電源</p>  
        <p type="p">31:RF電源</p>  
        <p type="p">31a:第1RF產生部</p>  
        <p type="p">31b:第2RF產生部</p>  
        <p type="p">32:DC電源</p>  
        <p type="p">32a:偏壓DC產生部</p>  
        <p type="p">40:排氣系統</p>  
        <p type="p">101:介電窗</p>  
        <p type="p">102:側壁</p>  
        <p type="p">111:本體部</p>  
        <p type="p">111a:中央區域</p>  
        <p type="p">111b:外周部(環狀區域)</p>  
        <p type="p">112:環組件</p>  
        <p type="p">200:上表面</p>  
        <p type="p">1110:基台</p>  
        <p type="p">1110a:流路</p>  
        <p type="p">1111:靜電夾頭</p>  
        <p type="p">1111a:陶瓷構件</p>  
        <p type="p">1111b:靜電電極</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1561" publication-number="202612660"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612660.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612660</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125243</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>整體式增強型噴射噴霧真皮治療手持件</chinese-title>  
        <english-title>UNITARY ENHANCED JET SPRAY DERMAL TREATMENT HANDPIECE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61B18/00</main-classification>  
        <further-classification edition="200601120260102B">A61B17/3203</further-classification>  
        <further-classification edition="200601120260102B">A61M25/00</further-classification>  
        <further-classification edition="200601120260102B">A61N1/32</further-classification>  
        <further-classification edition="200601120260102B">A61N7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商塔夫科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAV - TECH LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克拉科　提姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CRANKO, TIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舒坦　娜塔莉亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHTEIN, NATALYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝特曼　謝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BETELMAN, SHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴瑞克　艾密特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARAK, AMIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴瑞克　哈凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARAK, HAGAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷文　羅納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEVIN, RONA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多技術真皮治療整體式手持件包括：噴射噴霧遞送手持件，具有細長外殼，該細長外殼端接於一或多個噴嘴中，以用於沿著軸線以距受試者的皮膚的期望噴霧施加距離朝向受試者的皮膚引導治療性噴霧；及一或多個共生治療手持件元件，端接於具有真皮觸碰表面的用於將治療物輸送到皮膚的操作端部構件，治療物與由治療性噴霧提供的治療共生，其中操作端部構件和觸碰表面與軸線側向地間隔開，並且其中操作端部構件和觸碰表面軸向位移離開一或多個噴嘴達一距離，該距離被決定為將一或多個噴嘴與受試者的皮膚的接近度限製成不小於期望噴霧施加距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-technology dermal treatment unitary handpiece includes a jet spray delivery handpiece having an elongate housing terminating in one or more nozzles for directing along an axis a therapeutic spray towards the skin of a subject at a desired spray application distance therefrom; and one or more symbiotic treatment handpiece elements terminating in an operative end member having a dermal touch surface for conveying a treatment to the skin, the treatment being symbiotic with therapy provided by the therapeutic spray, wherein the operative end member and the touch surface are laterally spaced apart from the axis, and wherein the operative end member and the touch surface are axially displaced from the one or more nozzles by a distance determined to limit the proximity of the one or more nozzles to the skin of a subject to no less than the desired spray application distance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:手持件</p>  
        <p type="p">110:皮膚</p>  
        <p type="p">111:凹入部</p>  
        <p type="p">113:部分</p>  
        <p type="p">200:噴射噴霧遞送手持件</p>  
        <p type="p">220:遞送頭</p>  
        <p type="p">230:噴嘴</p>  
        <p type="p">240:軸線</p>  
        <p type="p">241:平面</p>  
        <p type="p">242:治療性噴霧</p>  
        <p type="p">300:共生治療元件</p>  
        <p type="p">302:護套</p>  
        <p type="p">312:遠側端部</p>  
        <p type="p">314:支撐臂</p>  
        <p type="p">320:操作端部構件｜電删餘探頭</p>  
        <p type="p">323:真皮觸碰表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1562" publication-number="202612618"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612618.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612618</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125356</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>腳架、椅子下部部分和椅子</chinese-title>  
        <english-title>FUSSKREUZ, STUHLUNTERTEIL UND STUHL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">A47C7/50</main-classification>  
        <further-classification edition="200601120251230B">A47C7/02</further-classification>  
        <further-classification edition="200601120251230B">A47C7/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商吉瓦有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIWA GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布勞恩　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRAUN, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫爾德　克里斯蒂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HELD, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西貝雷爾　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIEBERER, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格茨弗里德　萊因哈德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOETZFRIED, REINHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於一種用於椅子的腳架（1），其中腳架（1）包括中央開口（2），所述中央開口構成用於容納和承載在腳架（1）的工作位置中基本上垂直的支柱（3），並且其中腳架（1）具有至少三個、較佳五個臂（4），所述臂徑向地從開口（2）伸出，其中臂（4）中的至少一個臂沿著其縱向方向（5）從外部的臂端部（6）開始具有基本上U形的型材（7）或基本上O形的型材（7），其中至少一個臂（4）沿著縱向方向（5）具有與U形的型材（7）或O形的型材（7）不同的、基本上I形的型材（8）或基本上T形的型材（8）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:腳架</p>  
        <p type="p">2:開口</p>  
        <p type="p">3:支柱</p>  
        <p type="p">4:臂</p>  
        <p type="p">5:縱向方向</p>  
        <p type="p">6:外部的臂端部</p>  
        <p type="p">7:U形的或O形的型材</p>  
        <p type="p">8:I形的或T形的型材</p>  
        <p type="p">9:連接片</p>  
        <p type="p">10:下部凸緣</p>  
        <p type="p">11:上部凸緣</p>  
        <p type="p">12:加固肋</p>  
        <p type="p">15:支腿</p>  
        <p type="p">16:在支腿之間設置的側部</p>  
        <p type="p">17:上側</p>  
        <p type="p">18:壁</p>  
        <p type="p">20:支撐區域</p>  
        <p type="p">22:外壁</p>  
        <p type="p">24:同心的區域</p>  
        <p type="p">25:雙壁部</p>  
        <p type="p">26:外部壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1563" publication-number="202613726"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613726.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613726</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125358</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光源裝置</chinese-title>  
        <english-title>LIGHT SOURCE APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">G03F7/20</main-classification>  
        <further-classification edition="200601120251226B">H01J37/22</further-classification>  
        <further-classification edition="200601120251226B">H01J37/16</further-classification>  
        <further-classification edition="200601120251226B">H01J37/32</further-classification>  
        <further-classification edition="200601120251226B">H05G2/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商雷射科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LASERTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川口潤也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAGUCHI, JUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙松峻英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAMATSU, TAKAHIDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西澤正泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIZAWA, MASAYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上雅貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種抑制EUV光的光量降低之光源裝置。本實施形態的光源裝置2係具備：光路管50，係連接用以取出電漿所產生的光之鏡之側的空間與電漿形成區域之側的空間；以及濾光片60，係以蓋住光路管50之方式配置，供電漿所產生的光穿透。於光路管50設置有：氣體導入部53，係設置於比濾光片60還靠電漿形成區域之側，用以將氣體導入至光路管50的內部。光路管50係具備：第一排出口以及第二排出口，係將氣體導引至光路管的外部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:光源裝置</p>  
        <p type="p">11:靶材</p>  
        <p type="p">13:雷射光</p>  
        <p type="p">15:EUV光</p>  
        <p type="p">17:照射位置</p>  
        <p type="p">30:聚集鏡</p>  
        <p type="p">240:排氣箱</p>  
        <p type="p">241:外側罩</p>  
        <p type="p">242:排出口</p>  
        <p type="p">243:排氣空間</p>  
        <p type="p">44:沖洗氣體</p>  
        <p type="p">46:光路空間</p>  
        <p type="p">50,56,57,80:光路管</p>  
        <p type="p">51,81,91:一端</p>  
        <p type="p">52,82,92:另一端</p>  
        <p type="p">53,83:氣體導入部</p>  
        <p type="p">54:第一排出口</p>  
        <p type="p">55:第二排出口</p>  
        <p type="p">60:濾光片</p>  
        <p type="p">70a:玻璃板</p>  
        <p type="p">70b:聚光透鏡</p>  
        <p type="p">90:坩堝</p>  
        <p type="p">93:碎屑屏障</p>  
        <p type="p">C:中心軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1564" publication-number="202614200"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614200.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614200</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125359</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法、半導體裝置之製造方法、程式及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251228B">H01L21/306</main-classification>  
        <further-classification edition="200601120251228B">C09K13/00</further-classification>  
        <further-classification edition="200601120251228B">C23F1/14</further-classification>  
        <further-classification edition="200601120251228B">H01L21/316</further-classification>  
        <further-classification edition="200601120251228B">H01L21/31</further-classification>  
        <further-classification edition="200601120251228B">H01L21/67</further-classification>  
        <further-classification edition="200601120251228B">G06F9/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商國際電氣股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中谷公彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATANI, KIMIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮田翔馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYATA, SHOMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濵田啓太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMADA, KEITARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供能夠對形成於基板的凹部的內表面中的所需表面進行選擇性處理的技術。 &lt;br/&gt;本發明之解決手段包括：(a)準備基板的步驟，上述基板包含具有第1封端並構成凹部的內表面的至少一部分的第1表面、與具有與上述第1封端不同的第2封端的第2表面；與(b)將上述基板暴露於包含與上述第1封端反應的液體及使上述液體的表面張力降低的添加劑的處理液，而相對於上述第2封端選擇性地除去上述第1封端的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:晶圓(基板)</p>  
        <p type="p">600:洗淨裝置</p>  
        <p type="p">610:處理槽</p>  
        <p type="p">620:溫度感測器</p>  
        <p type="p">630:加熱器</p>  
        <p type="p">640:處理液供給管</p>  
        <p type="p">650:液體質量流量控制器(LMFC)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1565" publication-number="202613590"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613590.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613590</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125387</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光源驅動裝置及電子裝置</chinese-title>  
        <english-title>LIGHT SOURCE DRIVING APPARATUS AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250731B">G01S7/4865</main-classification>  
        <further-classification edition="200601120250731B">G01S7/48</further-classification>  
        <further-classification edition="202001120250731B">G01S17/02</further-classification>  
        <further-classification edition="200601120250731B">G01S17/08</further-classification>  
        <further-classification edition="201901120250731B">G06F1/3203</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大根光學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARGAN INDUSTRIAL OPTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程建彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEN YEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳子淦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TZU-KAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范丞緯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, CHEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周明達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, MING-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種光源驅動裝置，包含一供電單元、一飛行時間測距模組以及一訊號處理單元。飛行時間測距模組包含一光源單元及一功率偵測單元。光源單元具有一光源輸出功率。功率偵測單元用以儲存一預設功率，並偵測光源單元的光源輸出功率。訊號處理單元用以接收功率偵測單元的一偵測訊號。當光源單元的光源輸出功率與預設功率不相同時，訊號處理單元傳送一調整訊號而調整供電單元的一供電輸出功率。藉此，確保光源單元的輸出功率的穩定性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light source driving apparatus includes a power supply unit, a time-of-flight module and a signal processing unit. The time-of-flight module includes a light source unit and a power detection unit. The light source unit has a light source output power. The power detection unit is configured to store a preset power and detect the light source output power of the light source unit. The signal processing unit is configured to receive a detection signal from the power detection unit. When the light source output power of the light source unit is different from the preset power, the signal processing unit transmits an adjustment signal to adjust a power supply output power of the power supply unit. Thus, the light source driving apparatus of the present disclosure can ensure the stability of the output power of the light source unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光源驅動裝置</p>  
        <p type="p">110:系統端</p>  
        <p type="p">111:供電單元</p>  
        <p type="p">112:訊號處理單元</p>  
        <p type="p">120:飛行時間測距模組</p>  
        <p type="p">121:光源單元</p>  
        <p type="p">122:功率偵測單元</p>  
        <p type="p">123:飛行時間感測器</p>  
        <p type="p">124:驅動單元</p>  
        <p type="p">125:連接單元</p>  
        <p type="p">DC:訊號佔空比</p>  
        <p type="p">DP:預設功率</p>  
        <p type="p">P1:光源輸出功率</p>  
        <p type="p">P2:供電輸出功率</p>  
        <p type="p">S1:偵測訊號</p>  
        <p type="p">S3:影像訊號</p>  
        <p type="p">TS:發射光源時序</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1566" publication-number="202614460"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614460.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614460</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125454</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電極材料、電極、二次電池及電池組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250923B">H01M4/485</main-classification>  
        <further-classification edition="201001120250923B">H01M10/0525</further-classification>  
        <further-classification edition="201001120250923B">H01M4/1315</further-classification>  
        <further-classification edition="201001120250923B">H01M4/131</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東芝股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA TOSHIBA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田康宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下泰伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, YASUNOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村田芳明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA, YOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供可實現可顯示優異的快速充放電性能及循環壽命性能的二次電池之電極材料、包含該電極材料的電極、具備該電極的二次電池、具備該二次電池的電池組。 &lt;br/&gt;　　根據實施形態，提供包含含鈮鈦氧化物的電極材料。含鈮鈦氧化物係含有選自由Nb&lt;sub&gt;2&lt;/sub&gt;TiO&lt;sub&gt;7&lt;/sub&gt;相、Nb&lt;sub&gt;10&lt;/sub&gt;Ti&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;29&lt;/sub&gt;相、Nb&lt;sub&gt;14&lt;/sub&gt;TiO&lt;sub&gt;37&lt;/sub&gt;相及Nb&lt;sub&gt;24&lt;/sub&gt;TiO&lt;sub&gt;64&lt;/sub&gt;相所組成的群組之至少1個結晶相。至少1個結晶相中，包含選自由Ta、W、Mo及P所組成的群組之至少1個元素，且氧化物離子之一部分被氟F取代。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電極群</p>  
        <p type="p">2:外裝構件</p>  
        <p type="p">6:負極端子</p>  
        <p type="p">7:正極端子</p>  
        <p type="p">100:二次電池</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1567" publication-number="202614832"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614832.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614832</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125490</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251008B">H10D62/17</main-classification>  
        <further-classification edition="202501120251008B">H10D88/00</further-classification>  
        <further-classification edition="200601120251008B">H01L21/301</further-classification>  
        <further-classification edition="200601120251008B">G11C7/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵炳珠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, BYEONGJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔多絮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, DASOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體記憶體裝置包括：一堆疊結構，其包括交替堆疊於一半導體基體上之字線及層間絕緣圖案，該等字線在平行於該半導體基體之一頂部表面的一第一方向上延伸；通道圖案，其與該等字線相交且在平行於該半導體基體之該頂部表面的一第二方向上具有一長軸；一下部分離絕緣層，其在該半導體基體上位於該堆疊結構之一第一側處；以及位元線，其在該下部分離絕緣層上在該第一方向上彼此間隔開，該等位元線中之各者連接至在第三方向上彼此間隔開之該等通道圖案的第一端部分。該下部分離絕緣層位於該等通道圖案中之一最下部通道圖案的一第一側表面上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor memory device includes a stack structure including word lines and interlayer insulating patterns alternately stacked on a semiconductor substrate, the word lines extending in a first direction parallel to a top surface of the semiconductor substrate; channel patterns intersecting the word lines and having a long axis in a second direction parallel to the top surface of the semiconductor substrate; a lower separation insulating layer on the semiconductor substrate at a first side of the stack structure; and bit lines spaced apart from each other on the lower separation insulating layer in the first direction, each of the bit lines connected to first end portions of the channel patterns which are spaced apart from each other in the third direction. The lower separation insulating layer is on a first side surface of a lowermost channel pattern of the channel patterns.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:第二間隔體絕緣圖案</p>  
        <p type="p">41:第一間隔體絕緣圖案</p>  
        <p type="p">100:半導體基體</p>  
        <p type="p">110:下部分離絕緣層</p>  
        <p type="p">A-A',B-B':線</p>  
        <p type="p">BLa:第一位元線</p>  
        <p type="p">BLb:第二位元線</p>  
        <p type="p">CIL:電容器介電層</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">DIP:虛設絕緣圖案</p>  
        <p type="p">DMY:虛設字線</p>  
        <p type="p">DS:資料儲存元件</p>  
        <p type="p">Gox:閘極絕緣層</p>  
        <p type="p">ILD:層間絕緣圖案</p>  
        <p type="p">MP3:第三遮罩圖案</p>  
        <p type="p">P1:部分</p>  
        <p type="p">PE:板電極</p>  
        <p type="p">SE:儲存電極</p>  
        <p type="p">SP:通道圖案</p>  
        <p type="p">ST1:第一堆疊結構</p>  
        <p type="p">TIL:上部絕緣層</p>  
        <p type="p">WLa:第一字線</p>  
        <p type="p">WLb:第二字線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1568" publication-number="202614815"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614815.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614815</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125583</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251223B">H10D30/60</main-classification>  
        <further-classification edition="200601120251223B">H01L21/31</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肥純一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOEZUKA, JUNICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木俊成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, TOSHINARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栃林克明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOCHIBAYASHI, KATSUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎舜平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, SHUNPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一個方式抑制在將氧化物半導體用於半導體膜的電晶體上包括層間絕緣膜的半導體裝置的電特性的變動。本發明的一個方式包括：在半導體膜上的由源極電極及汲極電極形成的步階區域具有空隙部，且作為成分包含氧化矽的第一絕緣膜；以及以堵住第一絕緣膜的空隙部的方式與第一絕緣膜接觸地設置且作為成分包含氮化矽的第二絕緣膜。藉由採用該結構，可以防止產生在第一絕緣膜中的空隙部進一步擴大到外側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A change in electrical characteristics of a semiconductor device including an interlayer insulating film over a transistor including an oxide semiconductor as a semiconductor film is suppressed. The structure includes a first insulating film which includes a void portion in a step region formed by a source electrode and a drain electrode over the semiconductor film and contains silicon oxide as a component, and a second insulating film containing silicon nitride, which is provided in contact with the first insulating film to cover the void portion in the first insulating film. The structure can prevent the void portion generated in the first insulating film from expanding outward.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">450:電晶體</p>  
        <p type="p">410、410a、410b:氧化物絕緣膜</p>  
        <p type="p">411:氮化物絕緣膜</p>  
        <p type="p">412:絕緣膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1569" publication-number="202612887"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612887.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612887</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125586</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂材料供給機構、樹脂成形裝置、以及樹脂成形品的製造方法</chinese-title>  
        <english-title>RESIN MATERIAL SUPPLY MECHANISM, RESIN MOLDING APPARATUS, AND METHOD FOR MANUFACTURING RESIN MOLDED PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250829B">B29C31/04</main-classification>  
        <further-classification edition="200601120250829B">B29C45/64</further-classification>  
        <further-classification edition="200601120250829B">B29C43/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＯＷＡ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOWA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田雄介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中尾聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西田賢一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIDA, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明效率良好地準備供給有樹脂材料的多個脫模膜，框體移動部使位於搬入區域及多個作業區域的多個框體分別移動至下一區域，框體移動部使多個框體分別移動後，框體搬入部將空的框體搬入至搬入區域，框體搬出部自搬出區域搬出供給有樹脂材料的框體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention efficiently prepares a plurality of release films supplied with resin material, and a frame body moving unit moves a plurality of frame bodies located in a carry-in area and a plurality of working areas to the next area respectively. After the frame body moving unit has moved the plurality of frame bodies respectively, a frame body carry-in unit carries an empty frame body into the carry-in area, and a frame body carry-out unit carries out the frame body supplied with resin material from a carry-out area.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:成形對象物搬送機構</p>  
        <p type="p">3:第一移載台(移載台)</p>  
        <p type="p">4:第二移載台(移載台)</p>  
        <p type="p">5:成形對象物供給機構</p>  
        <p type="p">6:成形對象物回收機構</p>  
        <p type="p">7A:第一成形模(成形模)</p>  
        <p type="p">7B:第二成形模(成形模)</p>  
        <p type="p">8:合模機構</p>  
        <p type="p">12:樹脂材料供給機構</p>  
        <p type="p">12a:框體搬入部</p>  
        <p type="p">12a1、12e1、20a:保持單元</p>  
        <p type="p">12a2、12e2:驅動機構部</p>  
        <p type="p">12b:框體清掃部</p>  
        <p type="p">12c:膜裝設部</p>  
        <p type="p">12d:樹脂材料供給部</p>  
        <p type="p">12e:框體搬出部</p>  
        <p type="p">12f:框體移動部</p>  
        <p type="p">13:膜配置架(配置架)</p>  
        <p type="p">14:框體配置架(配置架)</p>  
        <p type="p">15:樹脂材料搬送機構</p>  
        <p type="p">20:搬送機器人</p>  
        <p type="p">20b:多關節臂部</p>  
        <p type="p">21:基板搬送部</p>  
        <p type="p">22:成形品搬送部</p>  
        <p type="p">51:基板供給部</p>  
        <p type="p">52:基板移載部</p>  
        <p type="p">61:成形品收納部</p>  
        <p type="p">62:成形品回收部</p>  
        <p type="p">71:上模</p>  
        <p type="p">72:下模</p>  
        <p type="p">72C:空腔</p>  
        <p type="p">100:樹脂成形裝置</p>  
        <p type="p">101:軌道</p>  
        <p type="p">151:樹脂材料搬送部</p>  
        <p type="p">152:膜回收部</p>  
        <p type="p">511、611:收納盒</p>  
        <p type="p">512:取出機構</p>  
        <p type="p">513:成形前基板台</p>  
        <p type="p">514、614:導軌</p>  
        <p type="p">612:收納機構</p>  
        <p type="p">613:樹脂成形品台</p>  
        <p type="p">A:基板供給/收納模組(模組)</p>  
        <p type="p">B:樹脂成形模組(模組)</p>  
        <p type="p">C:樹脂材料供給模組(模組)</p>  
        <p type="p">CTL:控制部</p>  
        <p type="p">P:樹脂成形品(成形對象物)</p>  
        <p type="p">R1:搬入區域(區域)</p>  
        <p type="p">R2:搬出區域(區域)</p>  
        <p type="p">R3:清掃區域(作業區域、區域)</p>  
        <p type="p">R4:裝設區域(作業區域、區域)</p>  
        <p type="p">R5:供給區域(作業區域、區域)</p>  
        <p type="p">W:成形前基板(成形對象物、基板、成形完畢基板)</p>  
        <p type="p">Wx:電子零件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1570" publication-number="202613639"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613639.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613639</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125617</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學裝置</chinese-title>  
        <english-title>OPTICAL DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120250715B">G02B7/18</main-classification>  
        <further-classification edition="200601120250715B">G02B5/04</further-classification>  
        <further-classification edition="200601120250715B">G02B23/02</further-classification>  
        <further-classification edition="200601120250715B">G01C3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞洲光學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASIA OPTICAL CO., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳月葉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUE-YE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張曉耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XIAO-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬芳麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, FANG-LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, LIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉華唐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, HUA-TANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈怡宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學裝置包括稜鏡模組、基座元件、第一光學元件、第一光學元件承載座以及調節組件。基座元件連接稜鏡模組。第一光學元件承載座連接於該基座上且用於承載該第一光學元件。調節組件包括可調件、彈性件與連接件，該可調件與該連接件分別穿過該第一光學元件承載座後可活動地連接於該基座元件，該彈性件抵於該第一光學元件承載座與該基座元件之間。該可調件相對於該基座元件調節時，會連動調整該彈性件於該第一光學元件承載座與該基座元件之間的彈力，且令該第一光學元件承載座可沿該連接件的軸向移動或繞該連接件的軸向轉動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical device includes a prism module, a mount, a first optical element, a first optical element carrier, and an adjusting assembly. The mount is connected to the prism module. The first optical element carrier is connected to the mount and carries the first optical element. The adjusting assembly includes an adjusting element, a resilient element and a connecting element. The adjusting element and the connecting element are penetrated through the first optical element carrier and movably connected to the mount. The resilient element is disposed between the first optical element carrier and the mount. When the adjusting element is adjusted with respect to the mount, the resilient force between the first optical element carrier and the mount is correspondingly adjusted and the first optical element carrier is moved along the axis of the connecting element or is rotated about the axis of the connecting element.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">23:光發射器</p>  
        <p type="p">29:第一光學元件</p>  
        <p type="p">30:第二光學元件</p>  
        <p type="p">100:發射系統</p>  
        <p type="p">101:第一基座元件</p>  
        <p type="p">102:第一光學元件承載座</p>  
        <p type="p">103:印刷電路板組件</p>  
        <p type="p">104:限位件</p>  
        <p type="p">105:調節組件</p>  
        <p type="p">106:第二光學元件承載座</p>  
        <p type="p">1011:第一基部</p>  
        <p type="p">1011a:孔</p>  
        <p type="p">1012:第二基部</p>  
        <p type="p">1012a:第一部分</p>  
        <p type="p">1012b:第二部分</p>  
        <p type="p">1012d:通孔</p>  
        <p type="p">1012f:臺階面</p>  
        <p type="p">1013:第三基部</p>  
        <p type="p">1021:第一承托部</p>  
        <p type="p">1022:連接件</p>  
        <p type="p">1023:調節組件連接部</p>  
        <p type="p">1023a:孔</p>  
        <p type="p">1041:印刷電路板組件限位部</p>  
        <p type="p">1042:承載座限位部</p>  
        <p type="p">1043:中間部</p>  
        <p type="p">1051:可調件(螺栓)</p>  
        <p type="p">1052:彈性件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1571" publication-number="202612914"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612914.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612914</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125637</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱轉印受像薄片</chinese-title>  
        <english-title>THERMAL TRANSFER IMAGE RECEPTOR SHEET</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251128B">B41M5/52</main-classification>  
        <further-classification edition="200601120251128B">B41M5/50</further-classification>  
        <further-classification edition="200601120251128B">B41M5/44</further-classification>  
        <further-classification edition="200601120251128B">B41M5/42</further-classification>  
        <further-classification edition="200601120251128B">B41M5/40</further-classification>  
        <further-classification edition="200601120251128B">B32B27/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大日本印刷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畠山亮太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATAKEYAMA, RYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在本揭示，提供一種熱轉印受像薄片，其係於厚度方向依此順序具備：紙基材、與斷熱層、與受容層的熱轉印受像薄片，其特徵為上述熱轉印受像薄片的生質(Biomass)度為75%以上，上述紙基材的厚度為60μm以上300μm以下，上述斷熱層包含氯乙烯-乙酸乙烯酯共聚物、聚氯乙烯、氯化聚丙烯及聚丙烯的至少任一者之樹脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a thermal transfer image receptor sheet comprising: a paper substrate, a heat insulating layer, and a receptor layer in this order in a thickness direction, wherein a biomass degree of the thermal transfer image receptor sheet is 75% or more; a thickness of the paper substrate is 60 μm or more and 300 μm or less; and the heat insulating layer includes at least any one resin of vinyl chloride-vinyl acetate copolymer, polyvinyl chloride, chlorinated polypropylene and polypropylene.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:熱轉印受像薄片</p>  
        <p type="p">2:紙基材</p>  
        <p type="p">3:斷熱層</p>  
        <p type="p">4:受容層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1572" publication-number="202614213"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614213.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614213</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125653</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置、檢測方法、半導體裝置的製造方法及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/31</main-classification>  
        <further-classification edition="200601120251226B">H01L21/677</further-classification>  
        <further-classification edition="200601120251226B">C23C16/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商國際電氣股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米田秋彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEDA, AKIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 提供能夠簡單地檢測零件狀態的技術。 &lt;br/&gt;　　[解決手段] 具有：處理室，其係對基板進行處理；搬運部，其係搬運前述基板；零件，其係與前述處理室及前述搬運部中的至少某一方相關；記憶部，其係記憶多個動作事件；檢測部，其係能夠檢測前述零件的運轉聲音；以及控制部，其係構成為能夠取得由前述檢測部檢測出的前述運轉聲音的資料；設定有多個區域，該多個區域分別設置有前述處理室、前述搬運部和前述零件中的至少某一個；前述檢測部設於前述多個區域中的至少一個區域；前述控制部構成為與前述多個動作事件分別對應地選擇進行前述運轉聲音的檢測的前述多個區域中的至少一個區域，能夠從所選擇的前述至少一個區域的前述檢測部取得檢測資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板處理裝置</p>  
        <p type="p">12:主框體</p>  
        <p type="p">13A,13B,13C,14,15,16,18:框體</p>  
        <p type="p">20:處理模組</p>  
        <p type="p">22:反應管</p>  
        <p type="p">24:加熱器</p>  
        <p type="p">24A:流路</p>  
        <p type="p">30:搬運部</p>  
        <p type="p">32,36:搬運室</p>  
        <p type="p">34:舟皿</p>  
        <p type="p">35:舟皿升降機</p>  
        <p type="p">38:移載機</p>  
        <p type="p">40:搬運部</p>  
        <p type="p">41:蓋裝拆機構</p>  
        <p type="p">42:處理室</p>  
        <p type="p">43:匣開啟器</p>  
        <p type="p">44:架子</p>  
        <p type="p">44A:架板</p>  
        <p type="p">45:載置台</p>  
        <p type="p">46:輸送裝載機</p>  
        <p type="p">46A:升降機</p>  
        <p type="p">46B:匣搬運機構</p>  
        <p type="p">50:容器搬入搬出部</p>  
        <p type="p">51:前閘門</p>  
        <p type="p">52:裝載埠</p>  
        <p type="p">60:供給箱</p>  
        <p type="p">62:氣體供給機構</p>  
        <p type="p">70:排氣箱</p>  
        <p type="p">72:排氣管</p>  
        <p type="p">90:控制器箱</p>  
        <p type="p">112:泵</p>  
        <p type="p">114:送風機箱</p>  
        <p type="p">114A:氣體供給管</p>  
        <p type="p">114B:排氣管</p>  
        <p type="p">121:控制器(控制部)</p>  
        <p type="p">122:輸出入裝置</p>  
        <p type="p">123:外部記憶裝置</p>  
        <p type="p">B:地板</p>  
        <p type="p">P:匣</p>  
        <p type="p">R:地下空間</p>  
        <p type="p">W:晶圓(基板)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1573" publication-number="202614222"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614222.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614222</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125655</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理方法、半導體裝置的製造方法、處理裝置及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H01L21/311</main-classification>  
        <further-classification edition="200601120251219B">H01L21/306</further-classification>  
        <further-classification edition="200601120251219B">C09K13/00</further-classification>  
        <further-classification edition="200601120251219B">H01L21/67</further-classification>  
        <further-classification edition="200601120251219B">G05B19/4155</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商國際電氣股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本貴之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田原開悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAHARA, KAIGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堀田英樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORITA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於處理方法、半導體裝置的製造方法、處理裝置、及程式。其課題在於提供能夠高效地進行基板的表面的蝕刻的技術。解決手段為具有：(a)在處理室內配置有製品基板和吸附有物質(M)的非製品基板的狀態的工程；和(b)通過向配置有前述製品基板和前述非製品基板的狀態的前述處理室內供給蝕刻劑，從而使吸附於前述非製品基板的前述物質(M)與前述蝕刻劑反應，對前述製品基板的表面進行蝕刻的工程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:步驟</p>  
        <p type="p">A’:步驟</p>  
        <p type="p">B:步驟</p>  
        <p type="p">C:步驟</p>  
        <p type="p">D:步驟</p>  
        <p type="p">E:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1574" publication-number="202614208"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614208.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614208</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125714</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用選擇性離子植入的化學蝕刻</chinese-title>  
        <english-title>CHEMICAL ETCH USING SELECTIVE ION IMPLANTATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">H01L21/3065</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, AKITERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於化學蝕刻下伏材料的方法包含：使用輕質離子(例如氫離子、氦離子等等)來選擇性地改質該下伏材料(例如一含矽材料，如矽碳化物)，以形成該下伏材料的一改質區域；以及使用一含鹵素蝕刻劑氣體(例如一含氟氣體，如六氟化硫)來化學蝕刻該改質區域。該下伏材料係透過一光阻層中的開口而露出，該光阻層可含有碳及/或金屬，例如化學增幅光阻或金屬氧化物光阻。該選擇性改質步驟可將該等輕質離子植入到該下伏材料中。電漿可在該選擇性改質步驟與該化學蝕刻步驟之其中一者或兩者之期間被使用。偏壓功率可在該選擇性改質步驟期間被施加，並且可高於在該化學蝕刻步驟期間所施加的偏壓功率(其可為零)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of chemically etching an underlying material includes selectively modifying the underlying material (e.g., a silicon-containing material, like silicon carbide) using lightweight ions (e.g., hydrogen ions, helium ions, etc.) to form a modified region of the underlying material and chemically etching the modified region using a halogen-containing etchant gas (e.g., a fluorine-containing gas, like sulfur hexafluoride). The underlying material is exposed through openings in a resist layer, which may contain carbon and/or a metal, such as a chemically amplified resist or a metal oxide resist. The selective modification step may implant the lightweight ions into the underlying material. Plasma may be used during one or both of the selective modification step and the chemical etching step. Bias power may be applied during the selective modification step and may be higher than bias power applied during the chemical etching step, which may be zero.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:方法</p>  
        <p type="p">901:選擇性改質步驟</p>  
        <p type="p">902:化學蝕刻步驟</p>  
        <p type="p">903:電漿形成步驟</p>  
        <p type="p">904:離子加速步驟</p>  
        <p type="p">905:離子植入步驟</p>  
        <p type="p">908:循環</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1575" publication-number="202613098"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613098.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613098</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125768</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種APOLs抑制劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D401/14</main-classification>  
        <further-classification edition="200601120260102B">C07D471/04</further-classification>  
        <further-classification edition="200601120260102B">C07D403/12</further-classification>  
        <further-classification edition="200601120260102B">C07D409/14</further-classification>  
        <further-classification edition="200601120260102B">C07D403/14</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4439</further-classification>  
        <further-classification edition="200601120260102B">A61K31/437</further-classification>  
        <further-classification edition="200601120260102B">A61K31/404</further-classification>  
        <further-classification edition="200601120260102B">A61P13/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海旭成醫藥科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊康敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐文方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供具有抑制載脂蛋白L的化合物分子，尤其是針對APOL1 G1和/或G2等位基因變體表達的APOL1蛋白具有抑制功能的化合物，可用於治療載脂蛋白L異常引發的疾病。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1576" publication-number="202613386"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613386.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613386</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125822</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣體注入系統</chinese-title>  
        <english-title>GAS INJECTING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">E02D7/24</main-classification>  
        <further-classification edition="200601120251231B">E02D5/32</further-classification>  
        <further-classification edition="200601120251231B">E02D7/26</further-classification>  
        <further-classification edition="200601120251231B">E02D5/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹麥商沃旭能源公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORSTED WIND POWER A/S</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏普　詹斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHUPP, JENS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於安裝基礎(100)的氣體注入系統(10)，該系統具有在安裝期間沿插入方向插入土壤(200)的主體(12)。該主體(12)在遠端(20)處具有一個趾部(22)。該趾部(22)係定義通往內部空腔(18)中的一個孔(24)，其中當趾部在安裝期間穿過土壤(200)時，該土壤(200)係橫向地移位到內部空腔(18)內的位移的土壤懸浮液區域(26)中。氣體注入系統(10)包括複數個出口，用於注入氣體到位移的土壤懸浮液區域(26)中，以對懸浮在位移的土壤懸浮液區域(26)中的土壤(200)施加升力，以減少在趾部(22)處的土壤懸浮液壓力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A gas injecting system (10) for use with installing a foundation (100) having a body (12) for insertion into soil (200) in an insertion direction during installation. The body (12) having a toe (22) at its distal end (20). The toe (22) defining an aperture (24) into an internal cavity (18), wherein soil (200) is displaced laterally into a displaced soil suspension region (26) within the internal cavity (18) when the toe moves through the soil (200) during installation. The gas jetting system (10) comprises a plurality of outlets for injecting a gas into the displaced soil suspension region (26) for applying a lifting force to soil (200) suspended in the displaced soil suspension region (26) for reducing soil suspension pressure at the toe (22).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:氣體注入系統</p>  
        <p type="p">12:主體</p>  
        <p type="p">14:外側表面</p>  
        <p type="p">16:內側表面</p>  
        <p type="p">18:內部腔</p>  
        <p type="p">20:遠端</p>  
        <p type="p">22:趾部</p>  
        <p type="p">24:孔</p>  
        <p type="p">26:土壤懸浮液區域</p>  
        <p type="p">30:供給管</p>  
        <p type="p">36:噴嘴</p>  
        <p type="p">100:基礎</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1577" publication-number="202613369"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613369.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613369</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125864</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單晶矽成長過程之磁體升降曲線</chinese-title>  
        <english-title>MAGNET RAMP PROFILES DURING SINGLE CRYSTAL SILICON GROWTH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251228B">C30B15/20</main-classification>  
        <further-classification edition="200601120251228B">C30B30/04</further-classification>  
        <further-classification edition="200601120251228B">C30B15/30</further-classification>  
        <further-classification edition="200601120251228B">C30B29/06</further-classification>  
        <further-classification edition="200601120251228B">H01L21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>環球晶圓股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBALWAFERS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸　徵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, ZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴哈格維特　桑米特　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHAGAVAT, SUMEET S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在丘克拉斯基矽晶體成長中控制具有預定升降速率之磁體升降曲線，以減輕矽熔體流中之瞬態行為及其對半導體矽晶體成長及晶體品質之影響。磁場強度可在錠之恆定直徑部分之成長之至少兩個階段或至少三個階段中調節。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Control of magnet ramp profiles with predetermined ramp rates in Czochralski silicon crystal growth to mitigate the transient behavior in silicon melt flow and its impact to semiconductor silicon crystal growth and crystal quality. The magnetic field strength may be regulated in at least two stages or at least three stages of growth of the constant diameter portion of the ingot.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:拉錠器設備</p>  
        <p type="p">102:坩堝</p>  
        <p type="p">104:熔體</p>  
        <p type="p">105:軸件</p>  
        <p type="p">106:基座</p>  
        <p type="p">107:坩堝驅動單元</p>  
        <p type="p">110:底部隔熱件</p>  
        <p type="p">111:熔體表面</p>  
        <p type="p">112:提升機構</p>  
        <p type="p">113:矽錠/單晶錠</p>  
        <p type="p">114:提拉機構</p>  
        <p type="p">118:提拉纜線</p>  
        <p type="p">120:晶種固持器或卡盤</p>  
        <p type="p">122:矽晶種</p>  
        <p type="p">124:側隔熱件</p>  
        <p type="p">126:底部加熱器</p>  
        <p type="p">128:坩堝底板</p>  
        <p type="p">129:磁性線圈</p>  
        <p type="p">130:磁性線圈</p>  
        <p type="p">135:側加熱器</p>  
        <p type="p">142:冠部分</p>  
        <p type="p">145:恆定直徑部分/主體</p>  
        <p type="p">151:熱屏蔽件</p>  
        <p type="p">152:成長室</p>  
        <p type="p">154:冷卻套</p>  
        <p type="p">155:含鐵屏蔽件</p>  
        <p type="p">A:提拉軸/共同縱軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1578" publication-number="202613036"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613036.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613036</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125867</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固體電解質、活性物質、電極合劑、固體電解質層及固體電池</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251217B">C01G45/1257</main-classification>  
        <further-classification edition="200601120251217B">C01B25/10</further-classification>  
        <further-classification edition="201001120251217B">H01M10/0562</further-classification>  
        <further-classification edition="200601120251217B">H01M10/10</further-classification>  
        <further-classification edition="201001120251217B">H01M4/1315</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井金屬股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI KINZOKU COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山祐輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAYAMA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田智志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上亘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種即便於以充電狀態在高溫環境下保存固體電池之情形時，亦能夠抑制該固體電池之恢復電容之降低且能夠抑制該固體電池之電阻之上升的固體電池及活性物質。固體電解質含有鋰(Li)元素、磷(P)元素、硫(S)元素、氧(O)元素及鹵素(X)元素。鹵素(X)元素相對於磷(P)元素之莫耳比小於1.2。氧(O)元素相對於磷(P)元素之莫耳比大於0.001且小於1.0。在藉由使用CuKα射線之X射線繞射裝置所測得之X射線繞射圖案中，於2θ＝15.4°±1°之位置及2θ＝17.8°±1°之位置處具有繞射峰。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1579" publication-number="202614911"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614911.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614911</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125882</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>磁性儲存裝置</chinese-title>  
        <english-title>MAGNETIC STORAGE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251008B">H10N50/10</main-classification>  
        <further-classification edition="202301120251008B">H10N50/85</further-classification>  
        <further-classification edition="202301120251008B">H10B61/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>都甲大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKO, MASARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李永珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EEH, YOUNGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>磯田大河</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISODA, TAIGA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉山英行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIYAMA, HIDEYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中山昌彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAYAMA, MASAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高嶋梨菜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKASHIMA, RINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施例提供包括具有有利特性的磁阻效應元件的磁性儲存裝置。 &lt;br/&gt;根據一個實施例，磁性儲存裝置包括：第一磁性層；第一預定元素含有層，含有O並含有從Sc、Y、Ti、Zr、Hf、Al、Si、La、Ce、Pr、Nd、Pm、Sm、Eu、Gd、Tb、Ho、Dy、Er、Yb、和Lu中選擇的至少一種第一預定元素；第二磁性層，設置在第一磁性層和第一預定元素含有層之間；第二預定元素含有層，設置在第一預定元素含有層和第二磁性層之間，其中第二預定元素含有層實質上僅含有從P、As、Sb、Bi、S、Se、和Te中選擇的至少一種第二預定元素；以及非磁性層，設置在第一磁性層和第二磁性層之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments provide a magnetic storage device including a magnetoresistance effect element having advantageous characteristics. &lt;br/&gt;According to one embodiment, a magnetic storage device includes a first magnetic layer; a first predetermined element containing layer containing O and containing at least one first predetermined element selected from Sc, Y, Ti, Zr, Hf, Al, Si, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Ho, Dy, Er, Yb, and Lu; a second magnetic layer provided between the first magnetic layer and the first predetermined element containing layer; a second predetermined element containing layer provided between the first predetermined element containing layer and the second magnetic layer, wherein the second predetermined element containing layer substantially contains only at least one second predetermined element selected from P, As, Sb, Bi, S, Se, and Te; and a non-magnetic layer provided between the first magnetic layer and the second magnetic layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:參考層/層/第一磁性層</p>  
        <p type="p">20:儲存層/層/第二磁性層</p>  
        <p type="p">30:穿隧阻障層/層/非磁性層</p>  
        <p type="p">40:位移消除層/層/第三磁性層</p>  
        <p type="p">50:中間層/層</p>  
        <p type="p">61:第一預定元素含有層/層</p>  
        <p type="p">62:第二預定元素含有層/層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1580" publication-number="202613100"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613100.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613100</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125888</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雜環化合物、包含其的有機發光器件及有機物層用組合物</chinese-title>  
        <english-title>HETEROCYCLIC COMPOUND, ORGANIC LIGHT EMITTING DEVICE COMPRISING THE SAME AND COMPOSITION FOR ORGANIC MATERIAL LAYER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D403/10</main-classification>  
        <further-classification edition="200601120260102B">C07D409/14</further-classification>  
        <further-classification edition="200601120260102B">C07D405/14</further-classification>  
        <further-classification edition="200601120260102B">C07D403/14</further-classification>  
        <further-classification edition="200601120260102B">C09K11/06</further-classification>  
        <further-classification edition="202301120260102B">H10K85/60</further-classification>  
        <further-classification edition="202301120260102B">H10K50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＴ素材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LT MATERIALS CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭哲薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, CHEOL HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴建裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, GEON YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧永錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NO, YOUNG SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONG JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔大赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, DAE HYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種由化學式1表示的雜環化合物、包含其的有機發光器件及有機物層用組合物。 &lt;br/&gt;化學式1的各個取代基的定義與說明書中的記載相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">200:正極</p>  
        <p type="p">300:有機物層</p>  
        <p type="p">400:負極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1581" publication-number="202613873"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613873.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613873</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125915</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置設計系統、半導體裝置之設計方法及程式</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE DESIGN SYSTEM, SEMICONDUCTOR DEVICE DESIGN METHOD, AND PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251103B">G06F30/392</main-classification>  
        <further-classification edition="202501120251103B">H10D89/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, MASARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野沢靖久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOZAWA, YASUHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中島秀喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKASHIMA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉揚新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, YANGSHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種考量實際之製造製程而能夠高精度地設計半導體裝置之半導體裝置設計系統。本揭示之一態樣之半導體裝置設計系統(1)包含：設計資訊儲存部(11)，其儲存半導體裝置之設計資訊；製程特性資訊儲存部(12)，其儲存與用於製造半導體裝置之製程特性相關之資訊；及設計資訊最佳化部(13)，其使用儲存於製程特性資訊儲存部(12)之與製程特性相關之資訊將儲存於設計資訊儲存部(11)之半導體裝置之設計資訊最佳化。設計資訊最佳化部(13)以基於半導體裝置之設計資訊的半導體裝置之尺寸與實施用於製造半導體裝置之製程之後的半導體裝置之尺寸之差降低之方式，將半導體裝置之設計資訊最佳化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體裝置設計系統</p>  
        <p type="p">11:設計資訊儲存部</p>  
        <p type="p">12:製程特性資訊儲存部</p>  
        <p type="p">13:設計資訊最佳化部</p>  
        <p type="p">14:最佳化資訊儲存部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1582" publication-number="202614723"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614723.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614723</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125918</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶有冷卻液洩漏偵測之直接液體冷卻系統</chinese-title>  
        <english-title>DIRECT LIQUID COOLING SYSTEMS WITH COOLANT LEAKAGE DETECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251228B">H05K7/20</main-classification>  
        <further-classification edition="200601120251228B">G01M3/02</further-classification>  
        <further-classification edition="200601120251228B">G06F1/20</further-classification>  
        <further-classification edition="200601120251228B">G06F11/30</further-classification>  
        <further-classification edition="200601120251228B">G01K7/00</further-classification>  
        <further-classification edition="200601120251228B">G05B23/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美超微電腦股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUPER MICRO COMPUTER, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陽鳴谷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江滄明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIAN, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示用於偵測直接液體冷卻系統中之冷卻液洩漏之系統及方法。液體冷卻液流經附接至毗鄰處理器之冷板。將該等處理器之感測器讀數形成為一差動信號。判定該差動信號之分佈。自該差動信號之該分佈偵測該液體冷卻液之洩漏。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods for detecting coolant leakage in direct liquid cooling systems are disclosed. Liquid coolant is flowed through cold plates that are attached to adjacent processors. Sensor readings of the processors are formed into a differential signal. Distribution of the differential signal is determined. Leakage of the liquid coolant is detected from the distribution of the differential signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:方法</p>  
        <p type="p">701:步驟</p>  
        <p type="p">702:步驟</p>  
        <p type="p">703:步驟</p>  
        <p type="p">704:步驟</p>  
        <p type="p">705:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1583" publication-number="202614877"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614877.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614877</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114125963</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>固態攝像裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251201B">H10F39/15</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高木慎一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAGI, SHIN-ICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之固態攝像裝置1A包含電位梯度形成部20A。電位梯度形成部20A於光電轉換部10A形成電位自第2方向D2之一端201至另一端202逐漸變化之電位梯度。電位梯度形成部20A具有複數個電阻閘極部21、及複數個通氣部22。複數個電阻閘極部21分別覆蓋複數個像素區域11。複數個通氣部22分別設置於複數個像素分離區域12上。複數個通氣部22呈沿著第2方向D2之長度大於沿著第1方向D1之寬度之長條狀。各通氣部22之寬度W4之第2方向D2之平均值小於各電阻閘極部21之被夾在複數個通氣部22之間之部分之沿著第1方向D1之寬度W3之第2方向D2之平均值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:固態攝像裝置</p>  
        <p type="p">10A:光電轉換部</p>  
        <p type="p">11:像素區域</p>  
        <p type="p">12:像素分離區域</p>  
        <p type="p">13:半導體區域</p>  
        <p type="p">14:絕緣區域</p>  
        <p type="p">20A:電位梯度形成部</p>  
        <p type="p">21:電阻閘極部</p>  
        <p type="p">22:通氣部</p>  
        <p type="p">201:一端(低電位端)</p>  
        <p type="p">202:另一端(高電位端)</p>  
        <p type="p">D1:第1方向</p>  
        <p type="p">D2:第2方向</p>  
        <p type="p">D3:第3方向</p>  
        <p type="p">W1~W4:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1584" publication-number="202613265"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613265.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613265</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126008</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含填料膜、連接構造體及其製造方法</chinese-title>  
        <english-title>FILLER CONTAINING FILM, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251217B">C09J7/20</main-classification>  
        <further-classification edition="201801120251217B">C09J7/38</further-classification>  
        <further-classification edition="201801120251217B">C09J7/40</further-classification>  
        <further-classification edition="201901120251217B">B32B7/023</further-classification>  
        <further-classification edition="200601120251217B">B32B27/28</further-classification>  
        <further-classification edition="200601120251217B">G02F1/1334</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商迪睿合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀧澤雄也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIZAWA, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白岩俊紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAIWA, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野田大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NODA, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡部一夢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, KAZUMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾怜司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUKAO, REIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種含填料膜，其於經由含有能夠形成黑矩陣之黑色顏料之含填料膜，將μLED等發光元件安裝於基板上而製造μLED顯示器等連接構造體時，可進行精確之對準。 &lt;br/&gt;[解決手段]於絕緣性接著層中保持有導電粒子之含填料膜之波長400 nm以上且700 nm以下之可見光之平均穿透率為10%以下，波長800 nm以上且1200 nm以下之近紅外線之平均穿透率為30%以上。絕緣性接著層中之黑色顏料之含量為6質量%以上且30質量%以下，絕緣性接著層之層厚為1 μm以上且20 μm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:絕緣性接著層</p>  
        <p type="p">2:導電粒子</p>  
        <p type="p">10:異向性導電膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1585" publication-number="202612908"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612908.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612908</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126010</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含填料膜、連接構造體及其製造方法</chinese-title>  
        <english-title>FILLER CONTAINING FILM, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">B32B27/20</main-classification>  
        <further-classification edition="201801120251216B">C08K3/013</further-classification>  
        <further-classification edition="200601120251216B">C08K5/3437</further-classification>  
        <further-classification edition="200601120251216B">H01B5/16</further-classification>  
        <further-classification edition="200601120251216B">C09J9/02</further-classification>  
        <further-classification edition="200601120251216B">H01R11/01</further-classification>  
        <further-classification edition="200601120251216B">H01R43/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商迪睿合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤勇磨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, YUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白岩俊紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAIWA, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野田大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NODA, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾怜司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUKAO, REIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種含填料膜，其於經由含有能夠形成黑矩陣之黑色顏料之含填料膜，將μLED等發光元件安裝於基板上而製造μLED顯示器等連接構造體時，可進行精確之對準，並且能夠形成鋼琴黑色調之黑矩陣。 &lt;br/&gt;[解決手段]於絕緣性接著層中保持有導電粒子之含填料膜之波長800 nm以上且1200 nm以下之近紅外線之平均穿透率為20%以上，進而，膜表面之基於ASTM D523（60°）之60°光澤度值為60以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:絕緣性接著層</p>  
        <p type="p">2:導電粒子</p>  
        <p type="p">10:異向性導電膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1586" publication-number="202613266"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613266.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613266</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126011</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含填料膜、連接構造體及其製造方法</chinese-title>  
        <english-title>FILLER CONTAINING FILM, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251217B">C09J7/20</main-classification>  
        <further-classification edition="201801120251217B">C09J7/38</further-classification>  
        <further-classification edition="201801120251217B">C09J7/40</further-classification>  
        <further-classification edition="200601120251217B">B32B27/28</further-classification>  
        <further-classification edition="200601120251217B">C08J5/22</further-classification>  
        <further-classification edition="200601120251217B">G02F1/1334</further-classification>  
        <further-classification edition="200601120251217B">A43D25/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商迪睿合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤勇磨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, YUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白岩俊紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAIWA, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野田大樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NODA, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾怜司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUKAO, REIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種含填料膜，其於經由含有能夠形成黑矩陣之黑色顏料之含填料膜，將μLED等發光元件安裝於基板上而製造μLED顯示器等連接構造體時，可進行精確之對準，並且能夠形成啞光黑（matte black）色調之黑矩陣。 &lt;br/&gt;[解決手段]於絕緣性接著層中保持有導電粒子之含填料膜之波長800 nm以上且1200 nm以下之近紅外線之平均穿透率為20%以上，進而，膜表面之基於ASTM D523（60°）之60°光澤度值未達60。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:絕緣性接著層</p>  
        <p type="p">2:導電粒子</p>  
        <p type="p">10:異向性導電膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1587" publication-number="202612967"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612967.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612967</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126012</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於人力車輛之踏板總成</chinese-title>  
        <english-title>PEDAL ASSEMBLY FOR HUMAN POWERED VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B62M3/08</main-classification>  
        <further-classification edition="200601120251231B">A43B5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青木寿明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, TOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上暁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>臼井哲也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USUI, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種踏板總成基本上包含踏板軸、踏板本體、及扣片扣持結構。扣片扣持結構包含第一扣片固定構件。第一扣片固定構件被可在扣片固持位置與扣片非固持位置之間移動地耦接於踏板本體。樞軸將第一扣片固定構件支撐於踏板本體以在扣片固持位置與扣片非固持位置之間樞轉移動。至少一個偏壓構件將第一扣片固定構件於樞軸的軸向方向偏壓至第一軸向位置。第一扣片固定構件被可移動地設置在樞軸上，以抵抗所述的至少一個偏壓構件的偏壓力於軸向方向從第一軸向位置移動至第二軸向位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pedal assembly basically includes a pedal axle, a pedal body and a cleat retaining structure. The cleat retaining structure includes a first cleat securing member. The first cleat securing member is movably coupled to the pedal body between a cleat holding position and a cleat non-holding position. A pivot axle supports the first cleat securing member to the pedal body for pivotal movement between the cleat holding position and the cleat non-holding position. At least one biasing member biases the first cleat securing member to a first axial position in an axial direction of the pivot axle. The first cleat securing member is movably disposed on the pivot axle to move in the axial direction from the first axial position to a second axial position against a biasing force of the at least one biasing member.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:踏板總成</p>  
        <p type="p">42:踏板軸</p>  
        <p type="p">42a:外螺紋區段</p>  
        <p type="p">44:踏板本體</p>  
        <p type="p">46:扣片扣持結構</p>  
        <p type="p">48:第一扣片固定構件</p>  
        <p type="p">50:第二扣片固定構件</p>  
        <p type="p">50a:第二接合表面</p>  
        <p type="p">50b:第二抵靠表面</p>  
        <p type="p">60:支撐部分</p>  
        <p type="p">62:向前部分</p>  
        <p type="p">64:後方部分</p>  
        <p type="p">66:後方部分</p>  
        <p type="p">70:樞軸</p>  
        <p type="p">72:偏壓構件</p>  
        <p type="p">72A:第一偏壓構件，壓縮彈簧</p>  
        <p type="p">72B:第二偏壓構件，壓縮彈簧</p>  
        <p type="p">74:附加偏壓構件</p>  
        <p type="p">74A:第一附加偏壓構件</p>  
        <p type="p">74B:第二附加偏壓構件</p>  
        <p type="p">A1:旋轉中心軸線</p>  
        <p type="p">A2:樞轉軸線</p>  
        <p type="p">X:軸向方向</p>  
        <p type="p">X1:第一軸向方向</p>  
        <p type="p">X2:第二軸向方向</p>  
        <p type="p">Y:縱向方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1588" publication-number="202612676"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612676.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612676</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126066</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製藥、化妝品或醫美產品的凍乾方法、凍乾製劑和注射劑</chinese-title>  
        <english-title>Lyophilization methods, lyophilized formulations, and injections for pharmaceutical, cosmetic or aesthetic medical products</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61J3/02</main-classification>  
        <further-classification edition="200601120260102B">A61J1/06</further-classification>  
        <further-classification edition="200601120260102B">A61K9/19</further-classification>  
        <further-classification edition="200601120260102B">A61M5/14</further-classification>  
        <further-classification edition="200601120260102B">F26B5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商維昇藥業（上海）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VISEN PHARMACEUTICALS (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商前田產業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA INDUSTRY CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜豔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧安邦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, AN-BANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉田浩一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGITA, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了一種用於製藥、化妝品或醫美應用的產品的凍乾方法，包括：向雙腔卡式瓶中加入中塞、灌入待凍乾的產品、將雙腔卡式瓶放置並固定於凍乾支架上；將頂塞限位在雙腔卡式瓶的瓶口上；分別對待凍乾的產品進行冷凍、一次乾燥和二次乾燥；用頂蓋固定頂塞並密閉瓶口。本案提供的凍乾方法可以提供高品質凍乾參數與凍乾操作，以利用頂塞和頂蓋完成對雙腔卡式瓶一體化壓塞封蓋，以使獲得的凍乾產品保持更優品質，提高其使用效果和貯存時間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A lyophilization method for pharmaceutical, cosmetic, or aesthetic medical products, comprises: inserting a middle stopper into a dual-chamber cartridge bottle, filling the dual-chamber cartridge bottle with a product to be lyophilized, positioning and securing the dual-chamber cartridge bottle onto a lyophilization bracket; positioning the top stopper over the bottle opening of the dual-chamber cartridge bottle; subjecting the product to be lyophilized to freezing, primary drying, and secondary drying; securing the top stopper with a cap to seal the bottle opening. The lyophilization method provides high-quality lyophilization parameters and operations, using the top stopper and the cap to achieve integrated stoppering and capping of the dual-chamber cartridge bottle, thereby enabling the lyophilization products maintain superior quality, the efficacy and storage duration of the products are enhanced.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1589" publication-number="202614846"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614846.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614846</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126068</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶粒對晶圓及晶圓對晶圓接合的方法</chinese-title>  
        <english-title>METHODS FOR DIE-TO-WAFER AND WAFER-TO-WAFER BONDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251216B">H10D84/01</main-classification>  
        <further-classification edition="202501120251216B">H10D88/00</further-classification>  
        <further-classification edition="200601120251216B">G01B11/27</further-classification>  
        <further-classification edition="200601120251216B">H01L21/66</further-classification>  
        <further-classification edition="202201120251216B">G01B9/02055</further-classification>  
        <further-classification edition="200601120251216B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德克薩斯大學系統董事會</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯里尼瓦薩恩　思蓋塔Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SREENIVASAN, SIDLGATA V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙阿　杰伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAH, JAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿杰伊　帕拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AJAY, PARAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德烈卡　伊麗莎白奧布雷扎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDREYKA, ELIZABETH OBREZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧特爾　魯帕克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUITEL, RUPAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉特　悉達多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RATH, SIDDHARTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格萊姆斯　查爾斯沃克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRIMES, CHARLES WALKER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拉格爾　利亞姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GALLAGHER, LIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴維斯　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAVIS, ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種接合第一基板至第二基板的方法，其中第一基板具有一組對準標記，且第二基板具有一組互補對準標記。第一基板上的該組對準標記以及第二基板上的該組互補對準標記被使用以於接合之前判斷第一基板與第二基板之間的接合疊對誤差。校正接著於接合該第一基板至該第二基板的期間，基於經判斷的接合疊對誤差執行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for bonding a first substrate to a second substrate, where the first substrate has a set of alignment marks, and the second substrate has a set of complementary alignment marks. The set of alignment marks on the first substrate and the set of complementary alignment marks on the second substrate are utilized to determine a bonding overlay error between the first and second substrates prior to bonding. Corrections are then implemented during bonding of the first substrate to the second substrate based on the determined bonding overlay error.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:成像單元</p>  
        <p type="p">101:光源</p>  
        <p type="p">102:成像透鏡與感測器</p>  
        <p type="p">103:上(頂)基板</p>  
        <p type="p">104:光柵圖案(對準標記)</p>  
        <p type="p">105:下(底)基板</p>  
        <p type="p">106:棋盤格圖案(對準標記)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1590" publication-number="202613121"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613121.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613121</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126074</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有二氮雜三聚茚衍生物的化合物及包含其的光電轉換元件、鈣鈦礦太陽能電池、電子設備及電子元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D487/04</main-classification>  
        <further-classification edition="202301120260102B">H10K30/50</further-classification>  
        <further-classification edition="202301120260102B">H10K30/86</further-classification>  
        <further-classification edition="202301120260102B">H10K50/15</further-classification>  
        <further-classification edition="202301120260102B">H10K85/60</further-classification>  
        <further-classification edition="202301120260102B">H10K85/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商保土谷化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HODOGAYA CHEMICAL CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林祐一朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, YUICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊東俊昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, TOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙橋秀聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加瀬幸喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASE, KOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三枝優太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAEGUSA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明所要解決的問題在於提供一種有效用作光電轉換元件用的電洞傳輸材料的化合物及將所述化合物用於光電轉換元件用的電洞傳輸層的光電轉換特性良好的光電轉換元件以及太陽能電池。一種化合物，由下述通式（I）表示。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="257px" width="357px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:導電性支撐體(電極)</p>  
        <p type="p">2:電洞傳輸層</p>  
        <p type="p">3:光電轉換層(鈣鈦礦層)</p>  
        <p type="p">4:電子傳輸層</p>  
        <p type="p">5:緩衝層</p>  
        <p type="p">6:反電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1591" publication-number="202613727"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613727.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613727</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯影裝置及顯影方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">G03F7/20</main-classification>  
        <further-classification edition="200601120251226B">G03F7/32</further-classification>  
        <further-classification edition="200601120251226B">H01L21/027</further-classification>  
        <further-classification edition="200601120251226B">H01L21/67</further-classification>  
        <further-classification edition="200601120251226B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯塚建次</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IIZUKA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水永耕市</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUNAGA, KOUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牛丸浩二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>USHIMARU, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大島和彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOSHIMA, KAZUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之顯影裝置，使用包含弱酸之氣體以及氣霧的至少其中任一者在內的顯影用流體，令基板良好地顯影。本發明之顯影裝置，令形成有光阻膜且被實施過曝光處理的基板顯影，其特徵為包含：顯影用流體生成部，其從顯影用液體生成包含弱酸之氣體以及氣霧的至少其中任一者在內的顯影用流體；以及顯影部，其包含處理室，並利用該顯影用流體令該基板顯影，該處理室形成了收納該基板的處理空間，並設置有對該處理空間噴吐該顯影用流體的噴吐口；該顯影部，從該噴吐口向該處理空間內的該基板的表面側噴吐該顯影用流體，並包含向該處理空間內的該基板的背面側噴吐既定氣體的其他噴吐口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">310:加熱處理部</p>  
        <p type="p">320:處理室</p>  
        <p type="p">321:上處理室</p>  
        <p type="p">322:下處理室</p>  
        <p type="p">330:噴淋頭</p>  
        <p type="p">331:噴吐口</p>  
        <p type="p">340:中央排氣管路</p>  
        <p type="p">341:排氣口</p>  
        <p type="p">342:排氣管</p>  
        <p type="p">343:排氣裝置</p>  
        <p type="p">344:排氣裝置群</p>  
        <p type="p">350:外周圍排氣管路</p>  
        <p type="p">351:排氣口</p>  
        <p type="p">352:排氣管</p>  
        <p type="p">353:排氣裝置</p>  
        <p type="p">354:排氣裝置群</p>  
        <p type="p">360:熱板</p>  
        <p type="p">360a:本體部</p>  
        <p type="p">360b:加熱器</p>  
        <p type="p">361:保持構件</p>  
        <p type="p">370:升降銷</p>  
        <p type="p">371:升降驅動部</p>  
        <p type="p">372:貫通孔</p>  
        <p type="p">500:供給機構</p>  
        <p type="p">K1:處理空間</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1592" publication-number="202614172"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614172.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614172</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126108</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>海爾貝克型磁路</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/205</main-classification>  
        <further-classification edition="200601120251226B">H01L21/3065</further-classification>  
        <further-classification edition="200601120251226B">G01R33/383</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林秀樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種即使磁石的溫度變化，也能抑制內部空間中產生的磁場強度的變化之筒狀的海爾貝克型磁路。 &lt;br/&gt;　　海爾貝克型磁路(1)具備：永久磁鐵組裝體(2)，其以隨著溫度上升而殘留磁通密度會降低的複數永久磁鐵片(21～28)成為筒狀的海爾貝克排列之方式配置而成；及整磁合金板(3)，其以與前述永久磁鐵組裝體的至少一方的軸方向端面對向之方式配置。前述永久磁鐵片也可以為稀土類永久磁鐵片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:海爾貝克型磁路</p>  
        <p type="p">2:永久磁鐵組裝體</p>  
        <p type="p">3:整磁合金板</p>  
        <p type="p">21~28:永久磁鐵片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1593" publication-number="202612883"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612883.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612883</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126135</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>脆性基板之切斷方法及切斷系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR CUTTING BRITTLE SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B28D1/24</main-classification>  
        <further-classification edition="200601120251229B">B28D5/00</further-classification>  
        <further-classification edition="200601120251229B">C03B33/023</further-classification>  
        <further-classification edition="200601120251229B">C03B33/037</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穴原大将</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANAHARA, HIROMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一形態之脆性基板(GS)之切斷方法係對抵接於脆性基板(GS)之刻劃輪(31)賦予荷重，並藉由設置於脆性基板(GS)之下側之片狀之面壓感測器(20)，檢測作用於脆性基板(GS)之荷重分佈；以使荷重分佈中之最大荷重F&lt;sub&gt;max&lt;/sub&gt;處於規定之基準範圍內之方式，修正對刻劃輪(31)賦予之荷重；對刻劃輪(31)賦予修正後之荷重，將脆性基板(GS)切斷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">ST1:步驟</p>  
        <p type="p">ST2:步驟</p>  
        <p type="p">ST3:步驟</p>  
        <p type="p">ST4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1594" publication-number="202614114"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614114.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614114</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126152</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>X射線源</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251026B">H01J35/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平野友彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRANO, TOMOHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平野渡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRANO, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川上博己</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAKAMI, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之X射線源具備：光電面，其根據脈衝光之入射而釋放光電子；靶材，其根據自光電面釋放出之光電子之入射而產生X射線；及控制電極部，其配置於光電面與靶材之間。控制電極部具有：聚焦電極，其配置為與光電面相對，使自光電面釋放出之光電子聚焦；及加速電極，其配置於聚焦電極與靶材之間，使光電子加速。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:X射線源</p>  
        <p type="p">2:X射線產生部</p>  
        <p type="p">3:光電子產生部</p>  
        <p type="p">4:光源</p>  
        <p type="p">5:控制部</p>  
        <p type="p">21:筒狀部</p>  
        <p type="p">21a:端部</p>  
        <p type="p">21c:貫通孔</p>  
        <p type="p">23:陽極部</p>  
        <p type="p">23a:端部</p>  
        <p type="p">23b:傾斜面</p>  
        <p type="p">24:靶材</p>  
        <p type="p">25:X射線出射窗</p>  
        <p type="p">28:筒狀部</p>  
        <p type="p">28a:貫通孔</p>  
        <p type="p">31:光入射窗</p>  
        <p type="p">31a:表面</p>  
        <p type="p">31b:光入射部分</p>  
        <p type="p">32:光電面</p>  
        <p type="p">33:筒狀部</p>  
        <p type="p">34:筒狀部</p>  
        <p type="p">35:控制電極部</p>  
        <p type="p">36:筒狀構件</p>  
        <p type="p">37:連接部</p>  
        <p type="p">38:連接部</p>  
        <p type="p">40:聚焦電極</p>  
        <p type="p">40a:表面</p>  
        <p type="p">41:筒狀部</p>  
        <p type="p">42:連接部</p>  
        <p type="p">43:圓筒部</p>  
        <p type="p">44:彎曲部</p>  
        <p type="p">44a:表面</p>  
        <p type="p">44b:表面(第1彎曲面、第1傾斜面)</p>  
        <p type="p">44c:貫通孔</p>  
        <p type="p">45:凸緣部</p>  
        <p type="p">50:加速電極</p>  
        <p type="p">51:筒狀部</p>  
        <p type="p">52:連接部</p>  
        <p type="p">53:第1圓筒部</p>  
        <p type="p">54:底板部</p>  
        <p type="p">54a:表面(第2彎曲面、第2傾斜面)</p>  
        <p type="p">54b:表面</p>  
        <p type="p">54c:貫通孔</p>  
        <p type="p">55:第1凸緣部</p>  
        <p type="p">56:第2圓筒部</p>  
        <p type="p">57:第2凸緣部</p>  
        <p type="p">81:本體部</p>  
        <p type="p">81a:端部</p>  
        <p type="p">82:插入部</p>  
        <p type="p">82a:貫通孔</p>  
        <p type="p">83:連接部</p>  
        <p type="p">E:光電子</p>  
        <p type="p">L:脈衝光(光)</p>  
        <p type="p">P1:空間</p>  
        <p type="p">P2:等電位空間</p>  
        <p type="p">P11:第1空間</p>  
        <p type="p">P12:第2空間</p>  
        <p type="p">Q:光電子釋放點</p>  
        <p type="p">R1:中央區域</p>  
        <p type="p">R2:彎曲區域</p>  
        <p type="p">S1:第1側</p>  
        <p type="p">S2:第2側</p>  
        <p type="p">XL:X射線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1595" publication-number="202613517"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613517.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613517</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126239</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>訓練奈米粒子估計模型之方法、使用其估計奈米粒子之方法、訓練奈米粒子估計模型之裝置以及使用其估計奈米粒子之裝置</chinese-title>  
        <english-title>METHOD FOR TRAINING NANOPARTICLE ESTIMATION MODEL, METHOD FOR ESTIMATING NANOPARTICLE USING THE SAME, APPARATUS FOR TRAINING NANOPARTICLE ESTIMATION MODEL, AND APPARATUS FOR ESTIMATING NANOPARTICLE USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120250805B">G01N15/0227</main-classification>  
        <further-classification edition="200601120250805B">G01N21/17</further-classification>  
        <further-classification edition="200601120250805B">G01N21/63</further-classification>  
        <further-classification edition="201801120250805B">G01N23/22</further-classification>  
        <further-classification edition="202401120250805B">G06T3/06</further-classification>  
        <further-classification edition="202301120250805B">G06N3/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商東友精細化工有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGWOO FINE-CHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安基煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, GI HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白成顥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAEK, SUNG HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李民柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MIN JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔修榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SU YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓盛弼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, SEUNG PIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃敏起</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, MIN GI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係關於能夠提高奈米粒子估計準確度之一種訓練一奈米粒子估計模型之方法及裝置以及一種使用經訓練模型估計奈米粒子之方法及裝置。更具體而言，藉由在訓練模型之前增強訓練資料之可靠性而提高準確度；此涉及僅選擇並使用其分布落入一標準正常範圍內之訓練資料。此外，在使用經訓練模型進行估計期間，比較未知奈米粒子資料與訓練資料的類別，且僅將被確定為落入訓練資料類別之未知奈米粒子資料輸入經訓練模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a method and apparatus for training a nanoparticle estimation model, and a method and apparatus for estimating nanoparticles using the trained model, capable of improving nanoparticle estimation accuracy. More specifically, accuracy is improved by enhancing the reliability of training data before training the model; this involves selecting and using only training data whose distribution falls within a standard normal range. Furthermore, during estimation using the trained model, unknown nanoparticle data is compared against the category of the training data, and only the unknown nanoparticle data determined to fall within the training data category is input into the trained model.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1596" publication-number="202613319"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613319.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613319</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126265</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鐵水的脫磷方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">C21C1/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤良紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, YOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中瀬憲治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKASE, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中井由枝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAI, YOSHIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥山悟郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUYAMA, GORO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村井剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAI, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種在避免成為過氧化狀態的基礎上進行脫磷處理的技術。一種鐵水的脫磷方法，在向保持於容器中的鐵水供給造渣材料與氧源的同時向所述鐵水中吹入氣體並一邊攪拌一邊進行所述鐵水的脫磷處理時，以標準狀態的體積基準計，氧源中的以氧氣計的每單位質量鐵水的供給量Q&lt;sub&gt;O2&lt;/sub&gt;（Nm&lt;sup&gt;3&lt;/sup&gt;/t）與為了攪拌鐵水而供給的氣體的每單位質量鐵水的供給量Q&lt;sub&gt;B&lt;/sub&gt;（Nm&lt;sup&gt;3&lt;/sup&gt;/t）的比除以所述鐵水中的處理前碳濃度[C]i（質量%）而得的值Q&lt;sub&gt;O2&lt;/sub&gt;/（Q&lt;sub&gt;B&lt;/sub&gt;[C]i）調整為20（1/質量%）以上且4.2×10&lt;sup&gt;5&lt;/sup&gt;（1/質量%）以下的範圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:澆包</p>  
        <p type="p">2:爐蓋</p>  
        <p type="p">3:頂吹氣體供給用噴槍</p>  
        <p type="p">4:氧氣及造渣材料</p>  
        <p type="p">5:熔渣</p>  
        <p type="p">6:攪拌氣體</p>  
        <p type="p">7:鐵水</p>  
        <p type="p">8:底吹氣體供給用插塞</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1597" publication-number="202613320"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613320.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613320</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126267</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鐵水的脫磷方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">C21C1/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤良紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, YOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中瀬憲治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKASE, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中井由枝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAI, YOSHIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥山悟郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUYAMA, GORO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種進行兼顧鐵水的凝固抑制及脫磷能力的確保的脫磷處理的技術。一種鐵水的脫磷方法，向保持於容器中的鐵水供給造渣材料及氧源且向所述鐵水中吹入攪拌氣體，藉此一邊進行攪拌一邊進行所述鐵水的脫磷處理，所述鐵水的脫磷方法的特徵在於，所述脫磷處理開始時的所述鐵水的溫度為1650℃～1750℃，藉由使所述造渣材料熔解於所述鐵水中而生成的熔渣中所含的CaO相對於SiO&lt;sub&gt;2&lt;/sub&gt;的質量比即鹼度為4.0～6.0，在標準狀態的體積基準下，對所述氧源中的以氧氣計的每單位時間的供給量與為了攪拌所述鐵水而供給的所述攪拌氣體的每單位時間的供給量之比即供給氣體速度比進行調整。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:澆包</p>  
        <p type="p">2:爐蓋</p>  
        <p type="p">3:頂吹氣體供給用噴槍</p>  
        <p type="p">4:氧氣及造渣材料</p>  
        <p type="p">5:熔渣</p>  
        <p type="p">6:攪拌氣體</p>  
        <p type="p">7:鐵水</p>  
        <p type="p">8:底吹氣體供給用插塞</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1598" publication-number="202614291"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614291.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614291</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126320</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合裝置及接合方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H01L21/67</main-classification>  
        <further-classification edition="200601120251217B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河村和哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMURA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田之上隼斗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANOUE, HAYATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>増住拓朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUZUMI, TAKURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小濱範史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOHAMA, NORIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>眞鍋英二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANABE, EIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牧哲也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKI, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>元田公男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTODA, KIMIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供能降低接合基板的變形的技術。 &lt;br/&gt;　　[解決手段]接合裝置，接合第1基板與第2基板。接合裝置，包含：保持前述第1基板的第1保持部；保持前述第2基板的第2保持部；下壓前述第1保持部的前述第1基板使該第1基板接合至前述第2基板的壓動部；對前述第1基板及前述第2基板之間供應氣體的氣體供應機構。前述氣體供應機構，沿前述第1基板及前述第2基板的周方向具備複數吐出部；前述複數吐出部的各者，在前述第1基板與前述第2基板接合時，以相互不同的吐出量吐出前述氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">280:氣體供應機構</p>  
        <p type="p">281:吐出構造體</p>  
        <p type="p">281a:吐出口</p>  
        <p type="p">282,282d,282x,282y:吐出部</p>  
        <p type="p">283:隔壁</p>  
        <p type="p">284:埠</p>  
        <p type="p">285:供應部</p>  
        <p type="p">286:供應路徑</p>  
        <p type="p">286a:第1分岐路徑</p>  
        <p type="p">286b:第2分岐路徑</p>  
        <p type="p">287:氣體源</p>  
        <p type="p">288:開閉閥</p>  
        <p type="p">289:流量調節器</p>  
        <p type="p">W1:上晶圓</p>  
        <p type="p">W2:下晶圓</p>  
        <p type="p">Wy:楊氏模量</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1599" publication-number="202612771"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612771.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612771</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126367</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>點心</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">A63H33/42</main-classification>  
        <further-classification edition="200601120251231B">A63H3/00</further-classification>  
        <further-classification edition="200601120251231B">A23G3/50</further-classification>  
        <further-classification edition="200601120251231B">A23G3/54</further-classification>  
        <further-classification edition="200601120251231B">A23G1/54</further-classification>  
        <further-classification edition="200601120251231B">A23G9/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商萬代股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANDAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮脇純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山上陽平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田慎也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊藤誠二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種提高趣味性之點心。 &lt;br/&gt;本發明之點心1包括框部10及由框部10保持之零件部20，框部10構成為包圍零件部20之周圍之至少一部分。藉由以經由保持部15連結於框部10且由框部10包圍之方式配置零件部20，於在製造時利用流入點心容器101之槽部分之流動性之製造中，可考量零件部20之形狀而將保持部15之配置或保持部15之數目設為成型性佳之構成。其結果，可提供一種提高趣味性之點心。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:點心</p>  
        <p type="p">10:框部</p>  
        <p type="p">10a:第1取出部</p>  
        <p type="p">10b:第2取出部</p>  
        <p type="p">10g:框部槽</p>  
        <p type="p">11:第1邊部</p>  
        <p type="p">12:第2邊部</p>  
        <p type="p">13:第3邊部</p>  
        <p type="p">14:第4邊部</p>  
        <p type="p">15:保持部</p>  
        <p type="p">15a:狹窄部</p>  
        <p type="p">20:零件部</p>  
        <p type="p">20g:零件部槽</p>  
        <p type="p">20L:零件部(左零件部)</p>  
        <p type="p">20R:零件部(右零件部)</p>  
        <p type="p">21:第1部分</p>  
        <p type="p">22:第2部分</p>  
        <p type="p">100:點心套組</p>  
        <p type="p">101:點心容器(收容體)</p>  
        <p type="p">102:外周緣</p>  
        <p type="p">103:容器底部</p>  
        <p type="p">108:膜剝離部</p>  
        <p type="p">108b:缺口</p>  
        <p type="p">L11,L14:長度</p>  
        <p type="p">A-A,B-B:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1600" publication-number="202612772"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612772.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612772</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126368</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>點心</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">A63H33/42</main-classification>  
        <further-classification edition="200601120251231B">A63H3/00</further-classification>  
        <further-classification edition="200601120251231B">A23G3/54</further-classification>  
        <further-classification edition="200601120251231B">A23G1/54</further-classification>  
        <further-classification edition="200601120251231B">A23G1/21</further-classification>  
        <further-classification edition="200601120251231B">A23G3/34</further-classification>  
        <further-classification edition="200601120251231B">A23G9/00</further-classification>  
        <further-classification edition="200601120251231B">A23G9/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商萬代股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANDAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮脇純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山上陽平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田慎也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊藤誠二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種提高趣味性之點心。 &lt;br/&gt;本發明之點心1包括框部10、及由框部10保持之零件部20，且零件部20構成為在一面含有凸部20d，在另一面不含有凸部。藉由零件部20構成為在正反之一面含有凸部20d，可藉由該凸部20d呈現卡通形象之形狀。另一方面，藉由零件部平面20u構成為不含有凸部之平面，可設為利用平面容易貼合之構成。其結果，可呈現以凸部20d為外側之立體之卡通形象。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:點心</p>  
        <p type="p">10:框部</p>  
        <p type="p">10a:第1取出部</p>  
        <p type="p">10b:第2取出部</p>  
        <p type="p">10g:框部槽</p>  
        <p type="p">11:第1邊部</p>  
        <p type="p">12:第2邊部</p>  
        <p type="p">13:第3邊部</p>  
        <p type="p">14:第4邊部</p>  
        <p type="p">15:保持部</p>  
        <p type="p">15a:狹窄部</p>  
        <p type="p">20:零件部</p>  
        <p type="p">20g:零件部槽</p>  
        <p type="p">20L:第1零件部(零件部)</p>  
        <p type="p">20R:第2零件部(零件部)</p>  
        <p type="p">21:第1部分</p>  
        <p type="p">22:第2部分</p>  
        <p type="p">100:點心套組</p>  
        <p type="p">101:點心容器(收容體)</p>  
        <p type="p">102:外周緣</p>  
        <p type="p">103:容器底部</p>  
        <p type="p">108:膜剝離部</p>  
        <p type="p">108b:缺口</p>  
        <p type="p">L11,L14:長度</p>  
        <p type="p">A-A,B-B:線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1601" publication-number="202612901"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612901.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612901</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126440</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可降解型纖維組成物、食品載體及其製備方法</chinese-title>  
        <english-title>DEGRADABLE FIBER COMPOSITION, FOOD CARRIER AND METHOD FOR PREPARING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">B32B5/02</main-classification>  
        <further-classification edition="200601120251230B">B32B5/16</further-classification>  
        <further-classification edition="200601120251230B">C08L97/02</further-classification>  
        <further-classification edition="200601120251230B">C08L101/16</further-classification>  
        <further-classification edition="200601120251230B">C08L99/00</further-classification>  
        <further-classification edition="200601120251230B">A45C11/20</further-classification>  
        <further-classification edition="200601120251230B">A47G19/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商益昌納米新材料科技（廣東）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI CHANG NANO NEW MATERIAL TECHNOLOGY (GUANGDONG) CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>嬌朋生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVOPHANCIE BIOTECH LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王瓊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, QIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席果果</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XI, GUO GUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>段盛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUAN, SHENG WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHAO-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭思瀚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, SI HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘柏均</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種可降解型的纖維組成物、食品載體及其製備方法，該植物纖維組成物包含植物纖維和細菌纖維素。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a degradable fiber composition, food carrier and method for preparing the same, wherein the plant fiber composition comprises plant fiber and bacteria fiber.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1602" publication-number="202614346"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614346.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614346</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126491</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電吸盤</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">H01L21/683</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木雄基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白石純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAISHI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>板倉郁夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITAKURA, IKUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮崎俊哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAZAKI, SHUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種可在介電質基板與底板之間配置導電性構件之構成，並且可容易製造之靜電吸盤。&lt;br/&gt; 本發明的解決手段為一種靜電吸盤10，包含：介電質基板100；RF電極140，配設於介電質基板100的內部；底板200，由金屬形成，接合於介電質基板100；導電性構件400，將RF電極140與底板200之間電連接。在底板200之中介電質基板100側的面210形成有收納導電性構件400的一部分之凹部270。在該靜電吸盤10中，導電性構件400之中被收納在凹部270的部分的長度(L2)為導電性構件400的整體的長度(L1)的1/2以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:介電質基板</p>  
        <p type="p">110、120、210:面</p>  
        <p type="p">112:點</p>  
        <p type="p">116:底面</p>  
        <p type="p">130:吸附電極</p>  
        <p type="p">140:RF電極</p>  
        <p type="p">170、270:凹部</p>  
        <p type="p">200:底板</p>  
        <p type="p">300:接合層</p>  
        <p type="p">400:導電性構件</p>  
        <p type="p">L1、L2:長度</p>  
        <p type="p">SP:空間</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1603" publication-number="202614347"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614347.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614347</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126492</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電吸盤</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">H01L21/683</main-classification>  
        <further-classification edition="200601120250901B">H02N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOTO LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木雄基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白石純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAISHI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>板倉郁夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITAKURA, IKUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮崎俊哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAZAKI, SHUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種可容易配設連接於凸緣部的內部電極的供電構件。&lt;br/&gt; 本發明的解決手段為一種靜電吸盤10，包含：介電質基板100，具有：具有載置面之面110之第一部分101，與從第一部分101的外周端更朝外周側突出，且比第一部分101還薄之第二部分102；第一內部電極140，配設於第一部分101的內部；第二內部電極150，配設於第二部分102的內部；第一供電構件401，配設於介電質基板100的面120，對第一內部電極140電連接；第二供電構件402，配設於介電質基板100的面120，對第二內部電極150電連接。第一供電構件401及第二供電構件402都配設於介質質基板100之中第一部分101。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:靜電吸盤</p>  
        <p type="p">100:介電質基板</p>  
        <p type="p">101:第一部分</p>  
        <p type="p">102:第二部分</p>  
        <p type="p">110、120、102S、210、220:面</p>  
        <p type="p">111:封環</p>  
        <p type="p">112:點</p>  
        <p type="p">116:底面</p>  
        <p type="p">119:外側面</p>  
        <p type="p">130:吸附電極</p>  
        <p type="p">140:第一內部電極</p>  
        <p type="p">150:第二內部電極</p>  
        <p type="p">151:連接部</p>  
        <p type="p">160、260:氣孔</p>  
        <p type="p">170、180、270、280:凹部</p>  
        <p type="p">200:底板</p>  
        <p type="p">201:第一構件</p>  
        <p type="p">202:第二構件</p>  
        <p type="p">203:第三構件</p>  
        <p type="p">250:冷媒流道</p>  
        <p type="p">265:分配流道</p>  
        <p type="p">300:接合層</p>  
        <p type="p">400:供電構件</p>  
        <p type="p">401:第一供電構件</p>  
        <p type="p">402:第二供電構件</p>  
        <p type="p">B1、B2:接合邊界</p>  
        <p type="p">BD:邊界</p>  
        <p type="p">SP:空間</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1604" publication-number="202613526"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613526.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613526</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126577</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>干涉觀察裝置及干涉觀察方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G01N21/88</main-classification>  
        <further-classification edition="200601120251229B">G01N21/45</further-classification>  
        <further-classification edition="202201120251229B">G01B9/02091</further-classification>  
        <further-classification edition="202201120251229B">G01B9/02015</further-classification>  
        <further-classification edition="200601120251229B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山内豊彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAUCHI, TOYOHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之干涉觀察裝置包含：光源；干涉光學系統，其將自光源輸出之光分割成第1光及第2光，輸出由觀察對象物反射或透過觀察對象物而反射之第1光、與由參考反射鏡反射之第2光之干涉光；攝像元件；處理部；及模式切換部，其在第1光由觀察面反射之觀察模式即界面觀察模式、與第1光透過觀察面且由與觀察面離開之反射面反射之觀察模式即內部觀察模式之間，切換觀察對象物之觀察面之觀察模式。模式切換部藉由以內部觀察模式下之第2光之光路長較界面觀察模式下之第2光之光路長為長之方式控制第2光之光路長，而在界面觀察模式與內部觀察模式之間切換觀察模式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:干涉觀察裝置</p>  
        <p type="p">2:光源</p>  
        <p type="p">3:干涉光學系統</p>  
        <p type="p">4:攝像元件</p>  
        <p type="p">4a:攝像面</p>  
        <p type="p">5:控制部</p>  
        <p type="p">6:GUI(顯示部)</p>  
        <p type="p">7:記憶區域</p>  
        <p type="p">8:觀察對象物</p>  
        <p type="p">11:透鏡</p>  
        <p type="p">12:分束器</p>  
        <p type="p">12a:光學面</p>  
        <p type="p">13:物鏡</p>  
        <p type="p">14:參考物鏡</p>  
        <p type="p">15:參考反射鏡</p>  
        <p type="p">15a:參考反射面</p>  
        <p type="p">16:致動器</p>  
        <p type="p">17,18:步進馬達</p>  
        <p type="p">19:壓電元件</p>  
        <p type="p">41:透鏡</p>  
        <p type="p">51:處理部</p>  
        <p type="p">52:模式選擇部</p>  
        <p type="p">53:模式切換部</p>  
        <p type="p">54:載台控制部</p>  
        <p type="p">C:電腦/部位</p>  
        <p type="p">H:殼體</p>  
        <p type="p">L1:第1光</p>  
        <p type="p">L2:第2光</p>  
        <p type="p">L3:干涉光</p>  
        <p type="p">M:光學模組</p>  
        <p type="p">S:載台</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1605" publication-number="202612829"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612829.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612829</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126646</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射處理設備</chinese-title>  
        <english-title>LASER PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251229B">B23K26/06</main-classification>  
        <further-classification edition="201401120251229B">B23K26/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＥＯ科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EO TECHNICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權寧喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, YOUNGCHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴柾勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JUNGYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏聖萬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WI, SEONGMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玄東沅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HYUN, DONGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃程鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, JEONGHYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雷射處理設備，包括經配置以支撐作為處理目標的基板和用於量測的反射結構的載物台、經配置以輸出雷射光束的雷射輸出部、經配置以在用於處理基板的處理模式中將雷射光束聚焦在基板上並在用於量測雷射光束的量測模式中將雷射光束聚焦在反射結構上的聚焦透鏡、經配置以通過聚焦透鏡接收由反射結構反射的雷射光束的光並量測雷射光束的像差的像差量測光學系統、以及設置在從雷射輸出部入射到聚焦透鏡的雷射光束的光路上並經配置以基於雷射光束的測量像差資訊來校正雷射光束的像差的像差校正器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laser processing apparatus includes a stage configured to support a substrate as a processing target and a reflective structure for measurement, a laser output portion configured to output a laser beam, a focusing lens configured to focus the laser beam on the substrate in a processing mode for processing the substrate and to focus the laser beam on the reflective structure in a measuring mode for measuring the laser beam, an aberration measuring optical system configured to receive a reflected light of the laser beam from the reflective structure through the focusing lens and to measure aberration of the laser beam, and an aberration corrector provided on an optical path of the laser beam incident from the laser output portion to the focusing lens and configured to correct the aberration of the laser beam based on the measured aberration information of the laser beam.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:載物台</p>  
        <p type="p">22:載物台驅動器</p>  
        <p type="p">30:雷射照射器</p>  
        <p type="p">40:控制器</p>  
        <p type="p">310:雷射光源</p>  
        <p type="p">312:反射鏡</p>  
        <p type="p">326:功率控制器</p>  
        <p type="p">327:光束擴展器</p>  
        <p type="p">332:像差校正器</p>  
        <p type="p">341:光路形成部</p>  
        <p type="p">342:分束器</p>  
        <p type="p">346:波長板</p>  
        <p type="p">348:像差感測器</p>  
        <p type="p">350:聚焦透鏡</p>  
        <p type="p">ARL:抗反射層</p>  
        <p type="p">BW:反射結構</p>  
        <p type="p">L0、L1:雷射光束</p>  
        <p type="p">RL1:反射光</p>  
        <p type="p">P:焦點</p>  
        <p type="p">T1、T2:厚度</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1606" publication-number="202614556"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614556.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614556</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126665</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>切換式電容功率放大裝置及控制該裝置的方法</chinese-title>  
        <english-title>SWITCHED CAPACITOR POWER AMPLIFIER (SCPA) APPARATUS AND METHOD FOR CONTROLLING SCPA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250801B">H03F3/20</main-classification>  
        <further-classification edition="201501120250801B">H04B1/40</further-classification>  
        <further-classification edition="200601120250801B">H04B1/06</further-classification>  
        <further-classification edition="200601120250801B">H04B1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澳大利亞商摩爾斯微有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORSE MICRO PTY. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭福爾德　賈斯汀　大衛　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENFOLD, JUSTIN DAVID JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希勒　亞歷山大　麥可　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HILLER, ALEXANDER MICHAEL JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米薩拉甘達　蘇倫德拉　拉朱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEESARAGANDA, SURENDRA RAJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉信金</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">說明書描述一種切換式電容功率放大器的類比裁切技術。切換式電容功率放大器包含能夠在同相（in-phase—I）和正交相（quadrature-phase—Q）分量之間分享的多個單位單元的陣列。一對控制位元被關聯至每個單位單元，包含用於選擇性地致能該單位單元以使用同相分量的第一控制位元，以及用於選擇性地致能該單位單元以使用正交相分量的第二控制位元。真值表被組態給多個單位單元中的第一子集和第二子集，讓第一單位單元子集由同相分量驅動以響應個別對的控制位元的雙致能條件。真值表被組態以讓第二單位單元子集由正交相分量驅動以響應該雙致能條件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described are techniques for analog clipping for a switched capacitor power amplifier comprising an array of a plurality of unit cells shareable between in-phase (I) and quadrature-phase (Q) signal components. A pair of control bits is associated with each unit cell, comprising a first control bit to selectively enabling the unit cell to use the I component, and a second control bit to selectively enabling the unit cell to use the Q component. A truth table is configured for a first subset and a second subset of unit cells, and causes the unit cells of the first subset to be driven by the I component in response to a double-enabled condition of the respective pair of control bits. The truth table is configured to cause the unit cells of the second subset to be driven by the Q component in response to the double-enabled condition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:數位控制切換式電容功率放大器(ScPa)架構</p>  
        <p type="p">310:第一陣列</p>  
        <p type="p">315:方波</p>  
        <p type="p">330:第二陣列</p>  
        <p type="p">335:反相方波</p>  
        <p type="p">342:平衡-不平衡轉換器主線圈</p>  
        <p type="p">346:平衡-不平衡轉換器次線圈</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1607" publication-number="202613845"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613845.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613845</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126703</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理系統、資訊處理方法及程式產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251229B">G06F16/9535</main-classification>  
        <further-classification edition="202301120251229B">G06Q30/0251</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商樂天集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAKUTEN GROUP, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小橋川卡拉斯可　卡洛斯　安東尼奧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBASHIKAWA CARRASCO, CARLOS ANTONIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]能夠尋找對使用者而言為佳的商品。 &lt;br/&gt;　　[解決手段]資訊處理系統，係將第1查詢加以取得；從已被預先記憶之複數個商品，基於第1查詢而抽出至少1個商品；將與已被抽出之商品建立關連的其他商品加以取得；將與其他商品建立關連的至少1個查詢，當作第2查詢而加以取得；將基於第1查詢而被檢索到的商品，連同第2查詢所相應之資訊，一併輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1608" publication-number="202613356"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613356.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613356</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126725</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成膜方法、保護膜及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">C23C16/50</main-classification>  
        <further-classification edition="200601120251226B">C23C16/455</further-classification>  
        <further-classification edition="200601120251226B">C23C16/52</further-classification>  
        <further-classification edition="200601120251226B">C23C16/40</further-classification>  
        <further-classification edition="200601120251226B">C23C16/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>窪田真樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滿留和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUDOME, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種抑制微粒產生之保護膜的成膜方法、保護膜及基板處理裝置。 &lt;br/&gt;一種成膜方法，係在電漿處理裝置中於處理室內的構件的表面形成保護膜；該成膜方法中，係將包含不含氫及氟但含有矽的第1含矽氣體與含有氧的第1含氧氣體的處理氣體供應至該處理室內，向上部電極供應生成電漿的高頻電力，並藉由從包含該第1含矽氣體與該第1含氧氣體的該處理氣體所生成的電漿於該構件的表面形成矽氧化膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1609" publication-number="202614100"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614100.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614100</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126742</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有高導磁材料的變壓器</chinese-title>  
        <english-title>TRANSFORMER WITH HIGH PERMEABILITY MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250829B">H01F27/26</main-classification>  
        <further-classification edition="200601120250829B">H01F27/245</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光寶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭怡玟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧德嘉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, DE-JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳震</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種變壓器，包括一磁芯、一一次側繞組、一二次側繞組以及一高導磁材料。磁芯包括一磁柱，一次側繞組和二次側繞組繞設於磁柱上，且二次側繞組位於一次側繞組的至少一側，並和一次側繞組具有一第一距離。高導磁材料被設置以和一次側繞組具有一第二距離，其中第二距離不大於第一距離，且第一距離和第二距離在一次側繞組和二次側繞組的排列方向上。其中，高導磁材料的導磁率高於磁柱的導磁率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transformer is provided, which includes a magnetic core, a primary winding, a secondary winding, and a high permeability material. The magnetic core includes a limb. The primary and secondary windings are wound on the limb. The secondary winding is located at least on one side of the primary winding and has a first distance from the primary winding. The high permeability material is configured to have a second distance from the primary winding. The second distance does not exceed the first distance. The first and second distances are in an arrangement direction of the primary and secondary windings. A magnetic permeability of the high permeability material is higher than a magnetic permeability of the limb.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:變壓器</p>  
        <p type="p">102:磁芯</p>  
        <p type="p">104:磁柱</p>  
        <p type="p">106:一次側繞組</p>  
        <p type="p">108,108a,108b:二次側繞組</p>  
        <p type="p">110:高導磁材料</p>  
        <p type="p">D1,D2:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1610" publication-number="202614560"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614560.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614560</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126765</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高頻模組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H03H7/46</main-classification>  
        <further-classification edition="200601120251229B">H04B1/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>出口裕貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEGUCHI, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相川清志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIKAWA, KIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸本健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIMOTO, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉村嘉弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIMURA, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能小型化的高頻模組。 &lt;br/&gt;在高頻模組（1）中，第一焊墊電極（10A、10B）設於構裝基板（2）之第一主面（2a）。第二焊墊電極（13A、13B）設於構裝基板（2）之第二主面（2b）。第一表面構裝零件（3）具有第一電極（32A、32B）。第二表面構裝零件（4）具有第二電極（42A、42B）。第一表面構裝零件（3）配置於構裝基板（2）之第一主面（2a）。第二表面構裝零件（4）配置於構裝基板（2）之第二主面（2b）。第一表面構裝零件（3）之寬度（W1），較第二表面構裝零件（4）之長度（M2）更大。第一表面構裝零件（3）之第一長邊方向（Q11）及第二表面構裝零件（4）之第二長邊方向（Q21）彼此交叉。第二表面構裝零件（4）之第二電極（42A）與第一焊墊電極（10A）重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:高頻模組</p>  
        <p type="p">2:構裝基板</p>  
        <p type="p">2a:第一主面</p>  
        <p type="p">2b:第二主面</p>  
        <p type="p">3:第一表面構裝零件</p>  
        <p type="p">4:第二表面構裝零件</p>  
        <p type="p">5:第三表面構裝零件</p>  
        <p type="p">10A、10B:第一焊墊電極</p>  
        <p type="p">13A、13B:第二焊墊電極</p>  
        <p type="p">14A、14B:第三焊墊電極</p>  
        <p type="p">15:外部端子</p>  
        <p type="p">15a:輸出端子</p>  
        <p type="p">15b:輸入端子</p>  
        <p type="p">15c:接地端子</p>  
        <p type="p">31:第一本體部</p>  
        <p type="p">32A、32B:第一電極</p>  
        <p type="p">41:第二本體部</p>  
        <p type="p">42A、42B:第二電極</p>  
        <p type="p">51:第三本體部</p>  
        <p type="p">52A、52B:第三電極</p>  
        <p type="p">B1、B2:通路電極</p>  
        <p type="p">C1、C2:電容</p>  
        <p type="p">H1~H3:配線電極</p>  
        <p type="p">L1:電感</p>  
        <p type="p">Q11:第一長邊方向</p>  
        <p type="p">Q12:第一短邊方向</p>  
        <p type="p">Q21:第二長邊方向</p>  
        <p type="p">Q31:第三長邊方向</p>  
        <p type="p">M2、M3:長度</p>  
        <p type="p">W1:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1611" publication-number="202613247"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613247.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613247</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126785</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非水電解液二次電池用層合隔離膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">C08L77/10</main-classification>  
        <further-classification edition="201001120251219B">H01M10/0587</further-classification>  
        <further-classification edition="201601120251219B">H01M8/1058</further-classification>  
        <further-classification edition="200601120251219B">C08J5/22</further-classification>  
        <further-classification edition="200601120251219B">C08J9/36</further-classification>  
        <further-classification edition="200601120251219B">B32B27/32</further-classification>  
        <further-classification edition="200601120251219B">B32B5/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中澤敦史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAZAWA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種非水電解液二次電池用層合隔離膜，其可減低以捲繞體狀態下保存後的含浸液體時的TD方向的伸長。本揭示相關的非水電解液二次電池用層合隔離膜，係將多孔質層層合在聚烯烴多孔質薄膜的單面或雙面。非水電解液二次電池用層合隔離膜在30~80℃時的TD方向的平均線膨脹率為6.0×10&lt;sup&gt;-5&lt;/sup&gt;[1/K]以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1612" publication-number="202613744"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613744.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613744</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126820</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>移動體、移動體的控制方法及移動體的控制程式</chinese-title>  
        <english-title>MOBILE OBJECT, MOBILE OBJECT CONTROL METHOD, AND MOBILE OBJECT CONTROL PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251220B">G05D1/20</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有馬俊介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARIMA, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羽鳥優平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATORI, YUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBO, HITOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的移動體100係包含：移動體本體1，及一面推定移動體本體1的自我位置一面使移動體本體1執行自主移動的控制裝置6。控制裝置6係在至目的地的距離為預定的切換範圍Q外的第一區間中時，使移動體本體1執行第一自主移動，而在至目的地的距離為切換範圍Q內的第二區間中時，使移動體本體1執行與第一自主移動不同的第二自主移動。第一自主移動中，控制裝置6係藉由第一自我位置推定而推定移動體本體1的自我位置。第二自主移動中，控制裝置6係藉由推定精度高於第一自我位置推定的第二自我位置推定而推定移動體本體1的自我位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mobile object 100 includes a mobile object main body 1 and a control device 6 that causes the mobile object main body 1 to perform autonomous movement while estimating self-position of the mobile object main body 1. The control device 6 causes the mobile object main body 1 to perform a first autonomous movement in a first area where the distance to the destination is outside a predetermined switching range Q, and causes the mobile object main body 1 to perform a second autonomous movement that differs from the first autonomous movement in a second area where the distance to the destination is within the switching range Q. During the first autonomous movement, the control device 6 estimates the self-position of the mobile object main body 1 by using a first self-position estimation. During the second autonomous movement, the control device 6 estimates the self-position of the mobile object main body 1 by using a second self-position estimation that has higher estimation accuracy than the first self-position estimation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:移動體本體</p>  
        <p type="p">100:移動體</p>  
        <p type="p">Q:切換範圍</p>  
        <p type="p">S1:第一區間</p>  
        <p type="p">S2:第二區間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1613" publication-number="202613298"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613298.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613298</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126833</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>粒子檢測裝置及粒子檢測方法</chinese-title>  
        <english-title>PARTICLE DETECTION DEVICE AND PARTICLE DETECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C12M1/34</main-classification>  
        <further-classification edition="200601120260102B">G01N21/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>笠井宥佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASAI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>守本隆史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIMOTO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯川博之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUKAWA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>若林彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKABAYASHI, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大場孝浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OBA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於，提供一種粒子識別性高、能夠確保無菌性且具備自動化適性之粒子檢測裝置及粒子檢測方法。一種粒子檢測裝置，其包括：保持部，保持包含粒子之懸浮液；第1流路，與保持部連接；觀察窗，與第1流路連接；送液部，用於將保持在保持部之懸浮液移送至觀察窗；及螢光檢測部，通過觀察窗檢測從懸浮液中所包含之粒子發射之螢光。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:懸浮液</p>  
        <p type="p">10:粒子檢測裝置</p>  
        <p type="p">11:保持部</p>  
        <p type="p">12:混合部</p>  
        <p type="p">13:觀察窗</p>  
        <p type="p">13A:腔室</p>  
        <p type="p">20:流路</p>  
        <p type="p">30:閥</p>  
        <p type="p">40:送液部</p>  
        <p type="p">50:螢光檢測部</p>  
        <p type="p">60:計數部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1614" publication-number="202614650"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614650.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614650</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126883</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>金鑰生成方法、通信裝置和通信系統</chinese-title>  
        <english-title>KEY GENERATION METHOD, COMMUNICATION APPARATUS AND COMMUNICATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120260102B">H04W12/04</main-classification>  
        <further-classification edition="200601120260102B">H04L9/28</further-classification>  
        <further-classification edition="202201120260102B">H04L9/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊特拉卡　羅杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHITRAKAR, ROJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李云波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUNBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊訊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, XUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳寧樺</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請實施例提供了金鑰生成方法、通信裝置和通信系統，適用於任何環境電力IoT系統，以提高金鑰生成效率和通信效率。第一AMP STA發送攜帶第一成對主金鑰（pairwise master key，PMK）材料的第一幀。相應地，第二AMP STA接收所述第一幀。然後，所述第二AMP STA發送攜帶第二PMK材料的第二幀，其中，所述第一PMK材料和所述第二PMK材料用於生成第一PMK、第二PMK、第一成對臨時金鑰（pairwise transient key，PTK）和第二PTK。相應地，所述第一AMP STA接收所述第二幀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present application provide a key generation method, a communication apparatus and a communication system, which are applicable for any ambient power IoT system, to improv key generation efficiency and communication efficiency. A first AMP STA transmits a first frame carrying first pairwise master key (PMK) materials. Accordingly, a second AMP STA receives the first frame. Then the second AMP STA transmits a second frame carrying second PMK materials, where the first PMK materials and the second PMK materials are used to generate a first PMK, a second PMK, a first pairwise transient key (PTK) and a second PTK. Accordingly, the first AMP STA receives the second frame.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S21、S22、S23、S24、S25、S26、S27、S28、S29、S30、S31:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1615" publication-number="202614258"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614258.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614258</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>橋樑、半導體元件處理裝置、以及半導體元件試驗裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">H01L21/66</main-classification>  
        <further-classification edition="202001120251224B">G01R31/26</further-classification>  
        <further-classification edition="200601120251224B">G01R1/067</further-classification>  
        <further-classification edition="200601120251224B">G01B11/26</further-classification>  
        <further-classification edition="200601120251224B">G05D3/00</further-classification>  
        <further-classification edition="200601120251224B">H01L21/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商阿德潘鐵斯特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANTEST CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊池有朋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, ARITOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃克曼　修伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WERKMANN, HUBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的是提供一種對於半導體元件可高精度地定位光探針的橋樑。其解決手段為一種橋樑50，被安裝於處理半導體晶圓100的晶圓點測機30。橋樑50係，包括樑狀的本體部51以及第一致動器54。本體部51係，安裝有具有與待測元件110的端子112電性連接的探針21的探針卡20。第一致動器54被安裝於本體部51，將光訊號射出到待測元件110，以及/或，使被入射之光探針52對於待測元件110相對移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體元件試驗裝置</p>  
        <p type="p">10:測試器</p>  
        <p type="p">11:測試頭</p>  
        <p type="p">20:探針卡</p>  
        <p type="p">21:探針</p>  
        <p type="p">30:晶圓點測機</p>  
        <p type="p">31:上底</p>  
        <p type="p">32:開口</p>  
        <p type="p">33:下底</p>  
        <p type="p">34:支撐框架</p>  
        <p type="p">35:傾斜調整機構</p>  
        <p type="p">40:移動裝置</p>  
        <p type="p">41:保持部</p>  
        <p type="p">42:移動部</p>  
        <p type="p">50:橋樑</p>  
        <p type="p">51:本體部</p>  
        <p type="p">52:光探針</p>  
        <p type="p">54:第一致動器</p>  
        <p type="p">57:螺栓螺絲</p>  
        <p type="p">70:第一攝影機</p>  
        <p type="p">75:第二攝影機</p>  
        <p type="p">100:半導體晶圓</p>  
        <p type="p">101:上面</p>  
        <p type="p">112:端子</p>  
        <p type="p">114:光連接部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1616" publication-number="202613307"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613307.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613307</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114126986</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>免疫原組合物及其用途</chinese-title>  
        <english-title>IMMUNOGENIC COMPOSITIONS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C12N15/11</main-classification>  
        <further-classification edition="200601120260102B">C12N15/87</further-classification>  
        <further-classification edition="200601120260102B">A61K39/125</further-classification>  
        <further-classification edition="200601120260102B">A61K39/155</further-classification>  
        <further-classification edition="202501120260102B">A61K9/127</further-classification>  
        <further-classification edition="200601120260102B">A61P31/14</further-classification>  
        <further-classification edition="200601120260102B">A61P31/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商輝瑞大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFIZER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　奕瑾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, BRIDGET YIH JIIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　偉強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, WEIQIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史旺森　奇納　安妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SWANSON, KENA ANNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於RSV F、hMPV F、PIV3 F、PIV3 HN、PIV1 F及PIV1 HN蛋白突變體、編碼其等之核酸或載體、包含RSV F、hMPV F、PIV3 F、PIV3 HN、PIV1 F及/或PIV1 HN核酸或其等組合之組合物，以及其等用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to RSV F, hMPV F, PIV3 F, PIV3 HN, PIV1 F and PIV1 HN protein mutants, nucleic acids or vectors encoding them, compositions comprising a RSV F, hMPV F, PIV3 F, PIV3 HN, PIV1 F and/or PIV1 HN nucleic acid or combinations thereof, and uses thereof.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1617" publication-number="202613431"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613431.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613431</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127089</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>齒形帶及傳動系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">F16G1/28</main-classification>  
        <further-classification edition="200601120251224B">F16G5/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商阪東化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANDO CHEMICAL INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口博憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, HIRONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>椿野和之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUBAKINO, KAZUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種齒形帶，在帶長度方向上以一定的間距設置有多個帶齒，所述帶齒與在齒形帶輪的周緣以一定的間距設置的帶輪槽嚙合，所述齒形帶中，所述帶齒相對於所述帶輪槽的齒隙的面積Sb與一個所述帶輪槽的面積Sp為7.26×10&lt;sup&gt;-2&lt;/sup&gt;≧Sb/Sp≧3.46×10&lt;sup&gt;-2&lt;/sup&gt; …（1），所述帶齒的齒高度Hb與所述帶輪槽的齒槽底深度Hp為1.04≧Hb/Hp≧0.91 …（2）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:傳動系統</p>  
        <p type="p">10:齒形帶</p>  
        <p type="p">12:帶齒</p>  
        <p type="p">20:齒形帶輪</p>  
        <p type="p">21:帶輪槽</p>  
        <p type="p">22:驅動帶輪</p>  
        <p type="p">24:從動帶輪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1618" publication-number="202613423"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613423.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613423</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127099</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>直線運動導引裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250926B">F16C29/06</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本精工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NSK LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川﨑翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之直線運動導引裝置包含：導軌；滑塊，其配置為相對於導軌沿長度方向相對移動；及複數個滾動體，其等沿著形成於導軌與滑塊之間之滾動體滾動路內滾動自如地配置；且滑塊包含：滑塊本體，其具有：與導軌之軌道槽對向配置而形成滾動體之滾動體滾動路之軌道槽、及滾動體之返回路；及端蓋，其具有將返回路與滾動體滾動路連接之方向轉換路；且於導軌側之方向轉換路之端部形成有用於將滾動體朝方向轉換路舀起之舀起部；舀起部之內側面為圓筒面之一部分；圓筒面之中心線與滑塊本體之軌道槽之軸線交叉，且相對於方向轉換路之中心線沿切線方向相接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2A:滑塊本體</p>  
        <p type="p">2B:端蓋</p>  
        <p type="p">10A:軌道槽</p>  
        <p type="p">24:返回導件</p>  
        <p type="p">25:舀起部</p>  
        <p type="p">41:滾動體滾動路</p>  
        <p type="p">42:方向轉換路</p>  
        <p type="p">42a:圓筒狀凸部</p>  
        <p type="p">211:軌道槽</p>  
        <p type="p">216:返回路</p>  
        <p type="p">216a:環狀凹部/滾動體返回路</p>  
        <p type="p">221:圓弧槽</p>  
        <p type="p">241:內側圓弧面</p>  
        <p type="p">243:供油口</p>  
        <p type="p">251:內側面</p>  
        <p type="p">L:最大長度</p>  
        <p type="p">O:軸線(滾動體滾動路之中心線)</p>  
        <p type="p">Y:軸線(中心線)</p>  
        <p type="p">Z:中心線</p>  
        <p type="p">α:交叉角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1619" publication-number="202612769"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612769.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612769</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127105</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遊戲控制器</chinese-title>  
        <english-title>GAME CONTROLLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251224B">A63F13/24</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商任天堂股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NINTENDO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡村考師</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMURA, TAKANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皆川新太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINAGAWA, SHINTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神宮寺雅楽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JINGUJI, GAGAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河村哲嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMURA, TETSUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之遊戲控制器具備主體部、設置於主體部之正面之輸入部、左握把、右握把、第1按鈕及第2按鈕。左握把於遊戲控制器之背面，以與主體部至少局部地形成包含第1谷底之第1谷之方式，自主體部之左側部分突出。右握把於遊戲控制器之背面，以與主體部至少局部地形成包含第2谷底之第2谷之方式，自主體部之右側部分突出。第1及第2按鈕分別與第1谷底或第2谷底離開，且沿著該第1谷底或第2谷底設置於左握把或右握把。第1按鈕之操作面及第2按鈕之操作面各自為，其寬度在遊戲控制器之左右方向上之側面側較中心側為寬。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A game controller includes a main body portion, an input section at a front surface of the main body portion, a left grip, a right grip, a first button, and a second button. The left grip protrudes from a left side portion of the main body portion so as to at least partly form, together with the main body portion, on a back surface of the game controller, a first valley including a first valley bottom. The right grip protrudes from a right side portion of the main body portion so as to at least partly form, together with the main body portion, on the back surface of the game controller, a second valley including a second valley bottom. The first and second buttons are respectively at the left grip and the right grip extending along the first valley bottom and the second valley bottom while being spaced apart from a first valley bottom and a second valley bottom. An operation surface of the first button and an operation surface of the second button each have a width that is wider at a side of an edge of the game controller than at a side of a center of the game controller in a left-right direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:外殼</p>  
        <p type="p">2b:下緣部分</p>  
        <p type="p">2c:正面右緣部分</p>  
        <p type="p">2d:正面左緣部分</p>  
        <p type="p">2e:上表面右緣部分</p>  
        <p type="p">2f:上表面左緣部分</p>  
        <p type="p">3:正面蓋</p>  
        <p type="p">4a:中央部</p>  
        <p type="p">4b:右橋部</p>  
        <p type="p">4c:左橋部</p>  
        <p type="p">5:右握把</p>  
        <p type="p">6:左握把</p>  
        <p type="p">8:主體背面部</p>  
        <p type="p">9:主體部</p>  
        <p type="p">11~19,36:按鈕</p>  
        <p type="p">21:十字鍵</p>  
        <p type="p">22,23:類比搖桿</p>  
        <p type="p">31:R按鈕</p>  
        <p type="p">32:L按鈕</p>  
        <p type="p">33:ZR按鈕</p>  
        <p type="p">34:ZL按鈕</p>  
        <p type="p">35:連接器</p>  
        <p type="p">37:第1發光部</p>  
        <p type="p">38:第2發光部</p>  
        <p type="p">39:聲音端子</p>  
        <p type="p">41:右握把按鈕</p>  
        <p type="p">42:左握把按鈕</p>  
        <p type="p">A:位置</p>  
        <p type="p">L1,L2:長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1620" publication-number="202613712"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613712.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613712</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127136</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微影光罩的分析方法</chinese-title>  
        <english-title>METHOD FOR ANALYSING A MASK FOR LITHOGRAPHY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251229B">G03F1/84</main-classification>  
        <further-classification edition="201701120251229B">G06T7/30</further-classification>  
        <further-classification edition="201701120251229B">G06T7/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>舍普　菲利普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHOEPPE, PHILIPP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朵恩布許　凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DORNBUSCH, KAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱納　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEUNER, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於分析微影光罩的方法，包含：對準該光罩的空中影像（I）與光罩設計（ML），以形成該空中影像（I）與該光罩設計（ML）的疊加，其中CD閾值確定區域（501）和CD測量區域位於該空中影像（I）內；利用該空中影像（I）與該光罩設計（ML）的疊加來確定該CD閾值確定區域中的CD閾值；以及利用該空中影像（I）和該確定的CD閾值測量該CD測量區域中的臨界尺寸（CD）。該方法還包含使用該光罩設計（ML）確定在該CD 測量區域內確定一目標CD（CD-T）；以及將該測量的CD與確定的目標CD（CD-T）進行比較。本發明亦關於對應的電腦程式、對應的裝置和對應的系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure described herein relates to a method for analysing a mask for lithography, comprising： aligning an aerial image (I) of the mask and a mask design (ML) of the mask to form a superimposition of the aerial image (I) and the mask design (ML); wherein a CD threshold value determining region (501) and a CD measuring region are positioned within the aerial image (I); determining a CD threshold value in the CD threshold value determining region (501) using the superimposition of the aerial image (I) and the mask design (ML); measuring a critical dimension, CD, in the CD measuring region using the aerial image and the determined CD threshold value. Furthermore, the method can comprise： determining a target CD in the CD measuring region using the mask design (ML); comparing the measured CD with the determined target CD. The disclosure likewise relates to a corresponding computer program, a corresponding device and a corresponding system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">M:手動</p>  
        <p type="p">100:步驟</p>  
        <p type="p">101:步驟</p>  
        <p type="p">102:步驟</p>  
        <p type="p">A:自動</p>  
        <p type="p">103:步驟</p>  
        <p type="p">104:步驟</p>  
        <p type="p">105:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1621" publication-number="202614507"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614507.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614507</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127151</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>槓桿連接器手動鎖</chinese-title>  
        <english-title>LEVER CONNECTOR MANUAL LOCK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">H01R13/639</main-classification>  
        <further-classification edition="200601120251223B">H01R13/502</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商理想企業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IDEAL INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑佛德　道格拉斯　亞伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANFORD, DOUGLAS ALBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利德維格　傑森　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUDEWIG, JASON W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>晨陶　艾倫　伊瑪德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZANTOUT, ALAN EMAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇特　羅伯　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUTTER, ROBERT W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種槓桿連接器，其包括：連接器本體；可樞轉槓桿，其可在開啟位置與閉合位置之間移動以致動夾緊位點，從而固定導體；以及鎖定構件，其可移動地耦接至該連接器本體且經組態以在防止槓桿致動之鎖定位置與允許槓桿致動之解鎖位置之間轉變。該鎖定構件可相對於該連接器本體滑動或旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A lever connector includes a connector body, pivotable levers movable between open and closed positions to actuate clamping sites for securing conductors, and a lock member that is movably coupled to the connector body and configured to transition between a locked position, preventing lever actuation, and an unlocked position, permitting lever actuation. The lock member may slide or rotate relative to the connector body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:鎖定槓桿連接器</p>  
        <p type="p">102:本體部分</p>  
        <p type="p">106:罩蓋</p>  
        <p type="p">108A:槓桿</p>  
        <p type="p">108B:槓桿</p>  
        <p type="p">110:鎖定構件</p>  
        <p type="p">112:鎖體</p>  
        <p type="p">114A:導體插入開口</p>  
        <p type="p">114B:導體插入開口</p>  
        <p type="p">116A:楔形部分</p>  
        <p type="p">116B:楔形部分</p>  
        <p type="p">122B:鑲嵌突起</p>  
        <p type="p">124B:縱向延伸臂</p>  
        <p type="p">126B:縱向孔隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1622" publication-number="202613208"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613208.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613208</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127216</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚醯亞胺樹脂前驅物組成物及聚醯亞胺薄膜</chinese-title>  
        <english-title>POLYIMIDE RESIN PRECURSOR COMPOSITION AND POLYIMIDE FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G73/10</main-classification>  
        <further-classification edition="200601120251201B">C08J5/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安孫子洋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABIKO, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石井健太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米浜伸一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEHAMA, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周宜新</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係包含具有醯胺酸結構之聚醯亞胺樹脂前驅物(X)、及具有3個以上且5個以下之醯胺酸結構及3個以上之氧基矽基之化合物(Y)的聚醯亞胺樹脂前驅物組成物、及將前述聚醯亞胺樹脂前驅物組成物塗佈於支持體上，並加熱而得之聚醯亞胺薄膜。本發明係可獲得耐熱性及密合性優良之聚醯亞胺薄膜，且穩定性及成膜性優良之聚醯亞胺樹脂前驅物組成物，以及，耐熱性及密合性優良之聚醯亞胺薄膜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A polyimide resin precursor composition comprising: a polyimide resin precursor (X) having an amic acid structure, and a compound (Y) having 3 or more and 5 or less amic acid structures and 3 or more oxysilyl groups; and a polyimide film obtained by applying said polyimide resin precursor composition onto a support and heating it. The polyimide resin precursor composition has excellent stability and film-forming properties, and is capable of yielding a polyimide film with superior heat resistance and adhesion; and the polyimide film has excellent heat resistance and adhesion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1623" publication-number="202613024"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613024.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613024</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127286</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>立方晶氮化硼燒結體及其製造方法及工具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">C01B21/064</main-classification>  
        <further-classification edition="200601120251219B">C04B35/5831</further-classification>  
        <further-classification edition="200601120251219B">B22F3/14</further-classification>  
        <further-classification edition="200601120251219B">B01J23/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小澤広光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZAWA, HIROMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野口司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOGUCHI, TSUKASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中島巧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAJIMA, TAKUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供立方晶氮化硼燒結體及其製造方法及工具；該立方晶氮化硼燒結體為具有立方晶氮化硼，與作為前述立方晶氮化硼之剩餘部分的接合相之立方晶氮化硼燒結體，其中前述立方晶氮化硼之含量，為50.0~90.0體積%，前述接合相，含有選自由Ti之碳化物、Ti之氮化物、Ti之碳氮化物及Ti之硼化物所成之群的1種以上，與選自由W&lt;sub&gt;2&lt;/sub&gt;B及W&lt;sub&gt;2&lt;/sub&gt;CoB&lt;sub&gt;2&lt;/sub&gt;所成之群的1種以上，於以CuKα射線為射線源之前述立方晶氮化硼燒結體之X射線繞射圖型中，以屬於前述立方晶氮化硼之(111)面之繞射波峰的強度為I&lt;sub&gt;A&lt;/sub&gt;、以屬於前述W&lt;sub&gt;2&lt;/sub&gt;B之(211)面之繞射波峰的強度為I&lt;sub&gt;B&lt;/sub&gt;、以屬於前述W&lt;sub&gt;2&lt;/sub&gt;CoB&lt;sub&gt;2&lt;/sub&gt;之(211)面之繞射波峰及屬於(310)面之繞射波峰當中，強度較大之任一繞射波峰的強度為I&lt;sub&gt;c&lt;/sub&gt;時，相對於前述I&lt;sub&gt;A&lt;/sub&gt;而言，前述I&lt;sub&gt;B&lt;/sub&gt;及前述I&lt;sub&gt;C&lt;/sub&gt;之合計之比[(I&lt;sub&gt;B&lt;/sub&gt;+I&lt;sub&gt;C&lt;/sub&gt;)/I&lt;sub&gt;A&lt;/sub&gt;]為0.25以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1624" publication-number="202613325"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613325.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613325</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127315</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>來自積層陶瓷電容器之燒成後廢棄物之稀土類成分及金屬成分之分離回收方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C22B3/04</main-classification>  
        <further-classification edition="200601120251229B">C22B7/00</further-classification>  
        <further-classification edition="200601120251229B">C22B23/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口健一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱田大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMADA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種來自燒成後廢棄物之稀土類成分及金屬成分之分離回收方法。本發明之分離回收方法包括如下步驟：(A)準備積層陶瓷電容器之燒成後廢棄物的步驟，該積層陶瓷電容器係將陶瓷層、包含具有磁性之第1金屬成分之內部電極層、及包含無磁性之第2金屬成分之燒附電極層燒結而成者；(B)燒成後廢棄物之微細化步驟、(C)使用磁鐵，分離為包含陶瓷微細化物及第1金屬微細化物之第1分離物，與包含陶瓷微細化物、稀土類含有物及第2金屬微細化物之第2分離物並回收之步驟；及(H)藉由電解精煉，自經過步驟(C)後之第1分離物中回收第1金屬成分之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">BT:陶瓷粒子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1625" publication-number="202613093"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613093.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613093</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127324</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>殺微生物的喹啉化合物</chinese-title>  
        <english-title>MICROBIOCIDAL QUINOLINE COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D401/04</main-classification>  
        <further-classification edition="200601120260102B">A01N43/56</further-classification>  
        <further-classification edition="200601120260102B">A01P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商先正達農作物保護股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYNGENTA CROP PROTECTION AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維斯　馬賽亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEISS, MATTHIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>愛德門斯　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EDMUNDS, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯卡伯勒　克里斯托佛　查理斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCARBOROUGH, CHRISTOPHER CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪哈傑　艾圖爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAHAJAN, ATUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有式 (I) 的化合物 &lt;br/&gt;&lt;img align="absmiddle" height="179px" width="202px" file="ed10028.JPG" alt="ed10028.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;br/&gt;其中該等取代基係如請求項中所定義的，以及那些化合物的農用化學上可接受的鹽、或N-氧化物，其可以用作殺真菌劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A compound of formula (I) &lt;br/&gt;&lt;img align="absmiddle" height="185px" width="201px" file="ed10029.JPG" alt="ed10029.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; , &lt;br/&gt;wherein the substituents are as defined in the claims, and the agrochemically acceptable salts, or N-oxides of those compounds, which can be used as fungicides.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1626" publication-number="202614366"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614366.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614366</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127438</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用交互連接線穚之多晶片封裝的邏輯驅動器</chinese-title>  
        <english-title>LOGIC DRIVE BASED ON MULTICHIP PACKAGE USING INTERCONNECTION BRIDGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L23/00</main-classification>  
        <further-classification edition="200601120260102B">H01L23/538</further-classification>  
        <further-classification edition="200601120260102B">H01L23/18</further-classification>  
        <further-classification edition="202001120260102B">H03K19/177</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成真股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICOMETRUE COMPANY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林茂雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, MOU-SHIUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李進源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種多晶片封裝結構，包括：一交互連接線基板，包括一第一交互連接線橋接晶片，埋設在該交互連接線基板中、及一交互連接線結構，其包括一第一交互連接線金屬層、一位在該第一交互連接線金屬層上方及該交互連接線橋接晶片上方之第二交互連接線金屬層、及一位在該第一與第二交互連接線金屬層之間的聚合物層，其中該交互連接線橋接晶片係埋設在該交互連接線結構中，且該聚合物層係圍繞該交互連接線橋接晶片之側壁；一半導體積體電路(IC)晶片，位在該交互連接線基板之上方且橫跨在該交互連接線橋接晶片之邊緣的上方；一記憶體晶片，位在該交互連接線基板之上方且橫跨在該交互連接線橋接晶片之邊緣的上方，其中該第一交互連接線橋接晶片包括複數條金屬交互連接線，用於耦接該半導體積體電路(IC)晶片至該記憶體晶片之一資料匯流排，其中介於該半導體積體電路(IC)晶片與該記憶體晶片之間的該資料匯流排之位元寬度係大於或等於512。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A multi-chip package comprising: an interconnection substrate comprising an interconnection bridge embedded in the interconnection substrate, and an interconnection scheme comprising a first interconnection metal layer, a second interconnection metal layer over the first interconnection layer and the interconnection bridge, and a polymer layer between the first and second interconnection metal layers, wherein the interconnection bridge is embedded in the interconnection scheme and has sidewalls surrounded by the polymer layer; a semiconductor IC chip over the interconnection substrate and across over an edge of the interconnection bridge; a memory chip over the interconnection substrate and across over an edge of the interconnection bridge, wherein the interconnection bridge comprises a plurality of metal interconnects configured for a data bus coupling the semiconductor IC chip to the memory chip, wherein a bitwidth of the data bus between the semiconductor IC chip and the memory chip is greater than or equal to 512.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">583:金屬接墊</p>  
        <p type="p">27:交互連接線金屬層</p>  
        <p type="p">42:聚合物層</p>  
        <p type="p">565:聚合物層</p>  
        <p type="p">582:TPV</p>  
        <p type="p">563a:接合接點</p>  
        <p type="p">570:金屬凸塊或金屬柱</p>  
        <p type="p">690:細線交互連接線橋接晶片(FIB)</p>  
        <p type="p">100:半導體晶片</p>  
        <p type="p">684:交互連接線基板(IS)</p>  
        <p type="p">564:底部填充材料</p>  
        <p type="p">79:背面交互連接線結構(BISD)</p>  
        <p type="p">42a:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1627" publication-number="202614292"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614292.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614292</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127441</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>調整水的製造裝置及調整水的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251228B">H01L21/67</main-classification>  
        <further-classification edition="200601120251228B">H01L21/22</further-classification>  
        <further-classification edition="202301120251228B">C02F1/46</further-classification>  
        <further-classification edition="202301120251228B">C02F1/66</further-classification>  
        <further-classification edition="202301120251228B">C02F1/20</further-classification>  
        <further-classification edition="202301120251228B">C02F1/42</further-classification>  
        <further-classification edition="202301120251228B">C02F1/44</further-classification>  
        <further-classification edition="200601120251228B">G01N27/416</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中洋一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, YOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顔暢子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAN, NOBUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡崎有祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAZAKI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>飯野秀章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IINO, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種調整水的製造裝置，包括：摻雜劑元素的濃度調整裝置，對含有摻雜劑成分的濃度調整劑控制其添加量，並將其添加至處理對象水中；以及選自由pH調整裝置及氧化還原電位調整裝置所組成的群組中的至少一個調整裝置，所述pH調整裝置對可添加所述濃度調整劑的處理對象水的pH進行調整，所述氧化還原電位調整裝置對可添加所述濃度調整劑的處理對象水的氧化還原電位進行調整。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:調整水的製造裝置/製造裝置</p>  
        <p type="p">10:摻雜劑元素的濃度調整裝置/濃度調整裝置</p>  
        <p type="p">12:收容有濃度調整劑的罐/罐</p>  
        <p type="p">14L:供給管線</p>  
        <p type="p">20:雜質成分的去除裝置/去除裝置</p>  
        <p type="p">30:水質監視裝置/監視裝置</p>  
        <p type="p">40:控制裝置</p>  
        <p type="p">60:ORP調整裝置</p>  
        <p type="p">W:超純水等處理對象水/處理對象水</p>  
        <p type="p">L1、L2:移送管線</p>  
        <p type="p">UP:使用點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1628" publication-number="202614243"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614243.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614243</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127465</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工件保持裝置、零組件供給裝置及工件保持方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251227B">H01L21/60</main-classification>  
        <further-classification edition="200601120251227B">H05K3/34</further-classification>  
        <further-classification edition="200601120251227B">H01L23/485</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商微技中心股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRO-TEC COMPANY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸山充志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUYAMA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古畑昌人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUHATA, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於可使零組件穩定地附著於工件。 &lt;br/&gt;一種工件保持裝置910，其具備有：工件固定部915，其將具有附著零組件901之附著面的工件900予以固定；移動部970，其使上述附著面朝向下方而移動上述工件固定部915；及控制部990，其控制上述工件固定部915之移動；上述控制部990係在使零組件901附著於上述附著面的附著處理之過程中，藉由上述移動部970使上述工件固定部915移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:板材</p>  
        <p type="p">47:配置器</p>  
        <p type="p">90:框架</p>  
        <p type="p">91:零組件積存部</p>  
        <p type="p">200:零組件供給裝置</p>  
        <p type="p">900:工件</p>  
        <p type="p">901:零組件</p>  
        <p type="p">910:工件保持裝置</p>  
        <p type="p">915:工件固定部</p>  
        <p type="p">920:迴轉部</p>  
        <p type="p">930:位移部</p>  
        <p type="p">940:傾斜部</p>  
        <p type="p">950:升降部</p>  
        <p type="p">960:搬送部</p>  
        <p type="p">970:移動部</p>  
        <p type="p">980:打擊部</p>  
        <p type="p">985:相機</p>  
        <p type="p">990:控制部</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1629" publication-number="202613026"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613026.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613026</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127473</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電極、二次電池、電池包及車輛</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120250923B">C01B32/158</main-classification>  
        <further-classification edition="200601120250923B">B01J23/20</further-classification>  
        <further-classification edition="201001120250923B">H01M10/0525</further-classification>  
        <further-classification edition="201001120250923B">H01M4/131</further-classification>  
        <further-classification edition="201001120250923B">H01M4/133</further-classification>  
        <further-classification edition="202101120250923B">H01M50/204</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東芝股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA TOSHIBA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村田芳明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA, YOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋圭太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, KEITARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加納顕人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANO, KENTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>保科圭吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSHINA, KEIGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田康宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高見則雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAMI, NORIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之實施形態，係關於電極、二次電池、電池包及車輛。 &lt;br/&gt;　　提供能夠抑制氣體產生，並具有高輸出性能的電極、包含該電極的二次電池、包含該二次電池的電池包、以及包含該電池包的車輛。 &lt;br/&gt;　　根據實施形態，提供電極。電極係包含鈮含有氧化物和碳含有材料。鈮含有氧化物的羥基含量為0.25mmol/g以下。碳含有材料的官能基含量為5mmol/g以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電極群</p>  
        <p type="p">2:外裝構件</p>  
        <p type="p">6:負極端子</p>  
        <p type="p">7:正極端子</p>  
        <p type="p">100:二次電池</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1630" publication-number="202614080"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614080.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614080</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127477</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於將相機安裝於真空腔體的可操控平台、光罩檢測設備及光罩檢測設備的調整方法</chinese-title>  
        <english-title>MANIPULABLE PLATFORM FOR MOUNTING A CAMERA ON A VACUUM HOUSING, MASK INSPECTION APPARATUS AND METHOD FOR ADJUSTING A MASK INSPECTION APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G12B5/00</main-classification>  
        <further-classification edition="201201120251229B">G03F1/84</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴克曼　盧茨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REICHMANN, LUTZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案係關於用於將相機安裝於真空腔體的可操控平台、光罩檢測設備及光罩檢測設備的調整方法。根據本案的可操控平台包括一第一組件(110、210、310)，其提供用於傾斜該平台的第一調整機構，該第一組件(110、210、310)具有兩個楔形環形盤(111、112、211、212、311、312)的第一雙楔形配置，這兩個楔形環形盤通過第一滾珠軸承(115、215、315)繞一預定軸以可旋轉方式相互安裝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a manipulable platform for mounting a camera on a vacuum­ housing, to a mask inspection apparatus and to a method for adjusting a mask inspection apparatus. A manipulable platform according to the invention comprises a first assembly (110, 210, 310) which provides a first adjustment mechanism for tilting the platform, the first assembly (110, 210, 310) having a first double-wedge arrangement of two wedge-shaped annular discs (111, 112, 211, 212, 311, 312) which are rotatably mounted one on the other about a predefined­ axis via a first ball bearing (115, 215, 315).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:可操控平台</p>  
        <p type="p">105,106:切向驅動器</p>  
        <p type="p">110:第一組件</p>  
        <p type="p">111,112:楔形環形盤</p>  
        <p type="p">113:環形盤</p>  
        <p type="p">114,115,116:滾珠軸承</p>  
        <p type="p">125:真空密封部件</p>  
        <p type="p">130:底座</p>  
        <p type="p">140:中心軸</p>  
        <p type="p">150:相機</p>  
        <p type="p">151:相機法蘭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1631" publication-number="202612598"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612598.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612598</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127481</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>口服除臭用組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260102B">A23L33/105</main-classification>  
        <further-classification edition="201601120260102B">A23L33/10</further-classification>  
        <further-classification edition="200601120260102B">A61K36/534</further-classification>  
        <further-classification edition="200601120260102B">A61K33/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商小林製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田代朝弓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TASHIRO, SAYUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的在於提供一種除臭效果進一步提高的口服除臭用組成物。一種口服除臭用組成物，含有20質量%以上且80質量%以下的包含萜烯的精油、及8質量%以上且25質量%以下的炭粉末。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1632" publication-number="202613543"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613543.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613543</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127539</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於在生成半導體晶圓的檢查體積的3D斷層掃描影像時控制切片厚度的電腦實施方法</chinese-title>  
        <english-title>COMPUTER IMPLEMENTED METHOD FOR CONTROLLING A SLICE THICKNESS WHEN GENERATING A 3D TOMOGRAPHIC IMAGE OF AN INSPECTION VOLUME IN A SEMICONDUCTOR WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251008B">G01N23/2255</main-classification>  
        <further-classification edition="202201120251008B">G06V10/56</further-classification>  
        <further-classification edition="202201120251008B">G06V10/44</further-classification>  
        <further-classification edition="200601120251008B">G05B19/19</further-classification>  
        <further-classification edition="200601120251008B">H01L21/304</further-classification>  
        <further-classification edition="200601120251008B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯柏　湯瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KORB, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案發明揭示一種用於在獲取半導體晶圓檢查體積的3D斷層掃描影像時控制切片厚度之系統及方法，該方法包含：將標記結構(66)沉積在該晶圓表面(32)上，替代上：藉由在聚焦離子束系統(24)中使用聚焦離子束(34)研磨檢查體積和標記結構(66)，以暴露檢查體積中的橫截表面(48)，其中該聚焦離子束(34)的當前位置係從該標記結構(66)的橫截面重複得出，其中藉由測量研磨期間所釋出二次粒子的數量及/或類型，並且其中在當前位置到達意欲位置時則停止研磨；及對該橫截表面(48)進行成像，以確定該標記結構(66)的橫截面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a system and method for controlling a slice thickness when obtaining a 3D tomographic image of an inspection volume in a semiconductor wafer, the method comprising: depositing a marker structure (66) on the wafer surface (32), alternatingly: exposing a cross-section surface (48) in the inspection volume by milling into the inspection volume and the marker structure (66) with a focused ion beam (34) in a focused ion beam system (24), wherein a current position of the focused ion beam (34) is repeatedly derived from a cross-section of the marker structure (66), wherein the cross-section of the marker structure (66) is determined by measuring numbers and/or types of secondary particles released during milling, and wherein the milling is stopped when the current position reaches a desired position; and imaging the cross-section surface (48).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">32:晶圓表面</p>  
        <p type="p">34:聚焦離子束</p>  
        <p type="p">48:橫截表面</p>  
        <p type="p">66:標記結構</p>  
        <p type="p">68:可辨識邊緣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1633" publication-number="202613289"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613289.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613289</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127540</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經改良水性潤滑流體</chinese-title>  
        <english-title>IMPROVED WATER-BASED LUBRICATING FLUIDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">C10M173/00</main-classification>  
        <further-classification edition="200601120251231B">C10M135/00</further-classification>  
        <further-classification edition="200601120251231B">C10M169/00</further-classification>  
        <further-classification edition="200601320251231B">C10N30/06</further-classification>  
        <further-classification edition="200601320251231B">C10N40/20</further-classification>  
        <further-classification edition="200601320251231B">C10N40/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商阿科瑪法國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARKEMA FRANCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聖特　路易斯　奧古斯丁　帕斯克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAINT-LOUIS-AUGUSTIN, PASCAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樂卡　珍　克里斯多福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEC, JEAN-CHRISTOPHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海帝格　海倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEDIGER, HELENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李協書</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於潤滑流體、較佳地水性流體，其包括： &lt;br/&gt;&lt;b&gt;a)&lt;/b&gt;&lt;b/&gt;硫化合物或其鹽之一者、更尤其高半胱胺酸； &lt;br/&gt;&lt;b&gt;b)&lt;/b&gt;聚烷二醇； &lt;br/&gt;&lt;b&gt;c)&lt;/b&gt;水；及 &lt;br/&gt;&lt;b&gt;d)&lt;/b&gt;視情況一或多種功能性添加劑。 &lt;br/&gt;本發明亦係關於此潤滑流體之用途，其用於潤滑及/或清潔機械裝置、用於金屬加工、作為液壓流體或者作為採礦流體。最後，本發明係關於潤滑金屬或複合物之方法，其包括使該金屬或該複合物與該潤滑流體接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a lubricating fluid, preferably a water-based fluid, comprising: &lt;br/&gt;&lt;b&gt;a)&lt;/b&gt; a sulfur compound or one of its salts, more especially homocysteine; &lt;br/&gt;&lt;b&gt;b)&lt;/b&gt; a polyalkylene glycol; &lt;br/&gt;&lt;b&gt;c)&lt;/b&gt; water; and &lt;br/&gt;&lt;b&gt;d)&lt;/b&gt; optionally one or more functional additive(s). &lt;br/&gt;The present invention also relates to the use of this lubricating fluid, for lubricating and/or cleaning mechanical devices, for metalworking, as a hydraulic fluid, or else as mining fluid. Finally, the present invention relates to a process for lubricating a metal or a composite which comprises contacting said metal or said composite with said lubricating fluid.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1634" publication-number="202613499"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613499.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613499</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127561</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>路徑規劃搜尋方法及處理器</chinese-title>  
        <english-title>METHOD OF PATH PLAN SEARCH AND PROCESSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">G01C21/34</main-classification>  
        <further-classification edition="202401120251224B">G05D1/43</further-classification>  
        <further-classification edition="202401120251224B">G05D1/69</further-classification>  
        <further-classification edition="200601120251224B">B65G1/137</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商阿米巴能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMOEBA ENERGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>若宮遼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKAMIYA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村信一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, SHIN I.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青野真士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AONO, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡濱陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本技術包含，例如，一種由一電腦執行之一方法，用以搜尋一移動物體之一路徑規劃，該移動物體可由一時間與一位置之配對表示，該方法包含由該電腦確定該第一移動物體可活動的一可移動區域，確定小於該可移動區域的一局部區域的一尺寸，確定該第一移動物體於一第一時間點出現在一第一出發位置及該第一移動物體移動抵達的一第一抵達位置，確定位於該可移動區域內且以晚於該第一時間點的一第二時間點的該第二位置為中心的一第二局部區域，於該第二局部區域內任意位置，於晚於該第二時間點的一第三時間點，確定該位置的一移動方向與一移動距離，並於該可移動區域內，於該第三時間點以該第三位置為一中心，確定一第三局部區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present technology includes, for example, a method for searching, by a computer, for a path plan for moving a moving object, which can be represented by a pair of a time and a position, the method including determining, by the computer, a movable area in which a first moving object is movable, determining a size of a local area smaller than the movable area, determining a first departure position at which the first moving object is present at a first time and a first arrival position at which the first moving object is moved and arrives, determining a second local area that is in the movable area and has the second position as a center at a second time later than the first time, determining, at any position in the second local area, a moving direction and a moving distance from the position at a third time later than the second time, and determining a third local area that is in the movable area and has the third position as a center at the third time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:移動物體</p>  
        <p type="p">102:位置感測器</p>  
        <p type="p">104:中央處理器(CPU)</p>  
        <p type="p">106:記憶體</p>  
        <p type="p">108:通訊裝置</p>  
        <p type="p">110:輸入/輸出(I/O)裝置</p>  
        <p type="p">112:驅動機構</p>  
        <p type="p">114:裝載平台</p>  
        <p type="p">116:光學雷達感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1635" publication-number="202614176"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614176.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614176</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127595</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體基板的摻雜處理方法及摻雜處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250826B">H01L21/265</main-classification>  
        <further-classification edition="200601120250826B">H01J37/317</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商栗田工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中洋一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, YOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體基板的摻雜處理方法，具有：製備步驟，製備摻雜劑元素的濃度經調整的、pH為2以上的調整水；塗佈步驟，將調整水塗佈於半導體基板上；以及加熱步驟，對塗佈有調整水的半導體基板進行加熱，所述半導體基板的摻雜處理方法中，調整水的製備步驟具有：添加步驟，對含有摻雜劑成分的濃度調整劑控制其添加量，並將其添加至處理對象水中；以及pH調整步驟，對添加濃度調整劑前或添加濃度調整劑後的處理對象水的pH進行調整。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:調整水的製造裝置/製造裝置</p>  
        <p type="p">10:摻雜劑元素的濃度調整裝置/濃度調整裝置</p>  
        <p type="p">12:收容有濃度調整劑的罐/罐</p>  
        <p type="p">14L:供給管線</p>  
        <p type="p">20:雜質成分的去除裝置/去除裝置</p>  
        <p type="p">30:水質監視裝置/監視裝置</p>  
        <p type="p">40:控制裝置</p>  
        <p type="p">50:pH調整裝置</p>  
        <p type="p">W:超純水等處理對象水/處理對象水</p>  
        <p type="p">L1、L2:移送管線</p>  
        <p type="p">UP:使用點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1636" publication-number="202613071"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613071.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613071</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127630</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">C07C243/10</main-classification>  
        <further-classification edition="202001120251230B">C08J7/056</further-classification>  
        <further-classification edition="200601120251230B">C10G27/02</further-classification>  
        <further-classification edition="200601120251230B">C09D183/10</further-classification>  
        <further-classification edition="200601120251230B">B32B27/08</further-classification>  
        <further-classification edition="200601120251230B">B32B7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商長瀨化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGASE CHEMTEX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久留島康功</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURUSHIMA, YASUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有塗層之積層體，該塗層在具有滑動性、剝離性、防污性、耐化學品性、耐熱性、耐寒性、柔軟性、電絕緣性等矽氧烷結構所具有之特性之同時，能夠容易地分解。本發明係關於一種積層體，其包含基材、及形成於上述基材上之塗層，上述塗層由能夠藉由氧化劑分解之包含矽氧烷結構之交聯物構成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1637" publication-number="202612970"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612970.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612970</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127650</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控制系統及人力驅動車</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251231B">B62M6/50</main-classification>  
        <further-classification edition="201001120251231B">B62M6/45</further-classification>  
        <further-classification edition="200601120251231B">B62M9/00</further-classification>  
        <further-classification edition="200601120251231B">B62M25/00</further-classification>  
        <further-classification edition="202001120251231B">B62J45/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝花聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAHANA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]要提供一種控制系統，有助於人力驅動車的舒適行駛。 &lt;br/&gt;　　[解決手段]具備有：用來檢測與人力驅動車的行駛狀態相關的檢測資訊的檢測部、用來控制馬達及至少一個變速器的控制部；上述至少一個變速器的變速動作，包含伴隨上述馬達對鏈條的驅動的第1變速動作；上述控制部在上述第1變速動作中操作變速操作部的情況，因應上述檢測部的第1檢測結果，使上述馬達的驅動停止或持續。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1638" publication-number="202614603"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614603.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614603</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127651</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遠程管理系統、路由器及遠程管理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251103B">H04L69/164</main-classification>  
        <further-classification edition="202201120251103B">H04L65/1069</further-classification>  
        <further-classification edition="200601120251103B">H04L9/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商宜麗客股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELECOM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>島田純平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMADA, JUNPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種遠程管理系統，用於構建與網路設備之間安全風險較低的通訊會話，並進行遠程管理。一種遠程管理系統(100)，包括連接到私人網路(10)的網路設備(20)、路由器(30)，以及連接到網際網路(40)的遠程管理伺服器(50)和操作終端(60)；網路設備隨機生成UDP埠號和認證金鑰，並預先發送給遠程管理伺服器；當操作終端向遠程管理伺服器請求對網路設備進行操作時，遠程管理伺服器向網路設備發送認證金鑰，網路設備在接收到的認證金鑰與預先發送的認證金鑰一致的情況下，構建網路設備與遠程管理伺服器之間的通訊會話，操作終端則對網路設備進行遠程管理。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:私人網路</p>  
        <p type="p">20:網路設備</p>  
        <p type="p">30:路由器</p>  
        <p type="p">40:網際網路</p>  
        <p type="p">50:遠程管理伺服器</p>  
        <p type="p">60:操作終端</p>  
        <p type="p">100:遠程管理系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1639" publication-number="202612661"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612661.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612661</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127671</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>定位機器人手術系統之方法和系統</chinese-title>  
        <english-title>METHOD AND SYSTEM OF POSITIONING ROBOTIC SURGICAL SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120260102B">A61B34/20</main-classification>  
        <further-classification edition="201601120260102B">A61B34/30</further-classification>  
        <further-classification edition="201601120260102B">A61B34/10</further-classification>  
        <further-classification edition="201601120260102B">A61B90/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈦隼生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRAIN NAVI BIOTECHNOLOGY CO. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳階曉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIEH-HSIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯榮富</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, JUNG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐永倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YONG-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之具體實施例係關於一種定位機器人手術系統的方法。該方法包括產生該機器人手術系統之一第一三維(Three-dimensional，3D)模型、一患者之一第二3D模型、和一經計畫手術路徑。該第一3D模型係由一組多邊形網格而非由任何體積網格表示。該方法包括選擇一第一候選定位以在一虛擬環境中定位該第一3D模型、模擬該第一3D模型在該虛擬環境中之移動或旋轉；以及基於該等經模擬移動或旋轉判定與該第一3D模型相關聯的一碰撞是否發生。該方法包括產生該第一候選定位之狀態資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present invention relate to a method to position a robotic surgical system. The method includes generating a first three-dimensional (3D) model of the robotic surgical system, a second 3D model of a patient, and a planned surgical pathway. The first 3D model is represented by a set of polygon meshes but not by any volumetric mesh. The method includes selecting a first candidate position to position the first 3D model in a virtual environment, simulating movements or rotations of the first 3D model in the virtual environment; and determining whether a collision associated with the first 3D model occurs based on the simulated movements or rotations. The method includes generating status information of the first candidate position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:程序</p>  
        <p type="p">310~360:區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1640" publication-number="202614225"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614225.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614225</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127672</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＳＩＮ深孔結構的形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250904B">H01L21/318</main-classification>  
        <further-classification edition="200601120250904B">H01L21/311</further-classification>  
        <further-classification edition="200601120250904B">H01L21/3065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>代迷迷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石小兵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉健鋼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>展金秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種SiN深孔結構的形成方法，包含：將基片置於真空反應腔中，基片包含襯底及設置在襯底上的SiN介質層；通入蝕刻氣體，蝕刻氣體至少包含C&lt;sub&gt;x&lt;/sub&gt;H&lt;sub&gt;y&lt;/sub&gt;F&lt;sub&gt;z&lt;/sub&gt;氣體及含氧氣體；其中， 0≤x＜5，y≥0，z≥0，且y、z不同時為0，且至少包含一種y＞0的蝕刻氣體；施加源射頻功率，解離蝕刻氣體；及，&lt;br/&gt; 施加偏置射頻功率：交替施加第一偏置射頻功率、第二偏置射頻功率，對所述SiN介質層進行蝕刻；第一偏置射頻功率大於第二偏置射頻功率。本發明採用高低功率切換的方式施加偏置射頻功率以及特定的蝕刻氣體蝕刻SiN介質層，可以快速獲得側壁輪廓垂直的深孔結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1、S2、S3、S4:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1641" publication-number="202613755"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613755.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613755</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127697</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體處理設備中的基片支撐座溫度控制方法和系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G05D23/24</main-classification>  
        <further-classification edition="200601120251001B">G01R27/02</further-classification>  
        <further-classification edition="200601120251001B">H01L21/683</further-classification>  
        <further-classification edition="200601120251001B">H01L23/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王紅軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周曉鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜琨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體處理設備中的基片支撐座溫度控制方法和系統，線上測量加熱電阻的當前阻值，根據當前阻值和初始阻值計算阻值變化率，變化率小於或等於閾值時，將當前阻值作為更新阻值，根據更新阻值計算供應給加熱電阻的電壓或電流。本發明無需設備停機就可對加熱電阻的電阻值實現線上測量，節約了成本和時間，根據變化的阻值來即時調節供應至加熱電阻的電壓或電流，確保所有加熱電阻達到預期的加熱效果，以實現對基片支撐座進行更精準的溫度控制，達到對晶圓蝕刻過程的精準控制，提高蝕刻成功率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S6:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1642" publication-number="202614862"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614862.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614862</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127731</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於降低堆疊式半導體裝置中的跡線曝露之系統與方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR REDUCING TRACE EXPOSURE IN STACKED SEMICONDUCTOR DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251216B">H10D88/00</main-classification>  
        <further-classification edition="200601120251216B">H01L23/498</further-classification>  
        <further-classification edition="200601120251216B">H01L23/31</further-classification>  
        <further-classification edition="200601120251216B">H01L23/538</further-classification>  
        <further-classification edition="200601120251216B">H01L23/492</further-classification>  
        <further-classification edition="200601120251216B">H01L21/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美光科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倪　勝錦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, SENG KIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　奕武</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOO, KELVIN TAN AIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　宏遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NG, HONG WAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　振輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHONG, CHIN HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種具有用於減輕曝露跡線之特徵之堆疊式半導體封裝以及相關聯系統與方法。在一些實施例中，該堆疊式半導體封裝包含一基底基板、由該基底基板承載之一晶粒堆疊，及經沈積而至少部分囊封該晶粒堆疊之一模具材料。該基底基板可包含一作用表面及與該作用表面相對之一背面。此外，該作用表面可包含至該作用表面之一周邊部分中之一或多個切口(例如，在該基底基板之周邊邊緣處之階梯結構)。該基底基板亦可包含由該作用表面承載在該周邊部分上之複數個接合墊。此外，該模具材料可填充該作用表面中之該一或多個切口之各者，藉此隔絕該等接合墊以防其在該堆疊式半導體封裝之一側壁處曝露。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Stacked semiconductor packages with features to mitigate trace expose and associated systems and methods are disclosed herein. In some embodiments, the stacked semiconductor package includes a base substrate, a stack of dies carried by the base substrate, and a mold material deposited at least partially encapsulating the stack of dies. The base substrate can include an active surface and a back surface opposite the active surface. Further, the active surface can include one or more cuts into a peripheral portion of the active surface (e.g., stepped structures at the peripheral edges of the base substrate). The base substrate can also include a plurality of bond pads carried by the active surface over the peripheral portion. Still further, the mold material can fill each of the one or more cuts in the active surface, thereby insulating the bond pads from exposure at a sidewall of the stacked semiconductor package.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:堆疊式半導體裝置</p>  
        <p type="p">110:基底基板</p>  
        <p type="p">111A:中心部分</p>  
        <p type="p">111B:周邊部分</p>  
        <p type="p">112:正面</p>  
        <p type="p">114:背面/後表面</p>  
        <p type="p">116:切口</p>  
        <p type="p">118:最周邊邊緣</p>  
        <p type="p">120:金屬化結構</p>  
        <p type="p">122:金屬化層</p>  
        <p type="p">124:接合指狀物</p>  
        <p type="p">126:外部封裝接合位點</p>  
        <p type="p">130:介電層</p>  
        <p type="p">140:堆疊</p>  
        <p type="p">142:線接合</p>  
        <p type="p">150:模具材料</p>  
        <p type="p">160:外部封裝連接</p>  
        <p type="p">D&lt;sub&gt;1&lt;/sub&gt;:第一深度</p>  
        <p type="p">D&lt;sub&gt;2&lt;/sub&gt;:第二深度</p>  
        <p type="p">W&lt;sub&gt;1&lt;/sub&gt;:第一寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1643" publication-number="202614861"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614861.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614861</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127789</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>薄膜電晶體基板及包含其之顯示裝置</chinese-title>  
        <english-title>THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY DEVICE COMPRISING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251103B">H10D86/60</main-classification>  
        <further-classification edition="200601120251103B">G02F1/1333</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李永鎭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI, YOUNG-JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昭珩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SO-HYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池惠林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, HYELIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔昭陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, SOYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種薄膜電晶體基板，包含：位於底基板上的第一開關薄膜電晶體；及位於底基板上並與第一開關薄膜電晶體隔開的第二驅動薄膜電晶體。此外，第一開關薄膜電晶體包含：第一主動層；至少部分地與第一主動層重疊的第一閘極電極；及設置於底基板與第一主動層之間並與第一主動層重疊的第一遮光層。此外，第二驅動薄膜電晶體包含：第二主動層；至少部分地與第二主動層重疊的第二閘極電極；及設置於底基板與第二主動層之間並與第二主動層重疊的第二遮光層。並且，第一遮光層與第二遮光層由不同材料製成，第二主動層之氫濃度高於第一主動層之氫濃度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A thin film transistor substrate including a first switching thin film transistor on a base substrate; and a second driving thin film transistor on the base substrate and spaced apart from the first switching thin film transistor. Further, the first switching thin film transistor includes a first active layer; a first gate electrode at least partially overlapping the first active layer; and a first light-blocking layer disposed between the base substrate and the first active layer and overlapping the first active layer. In addition, the second driving thin film transistor includes a second active layer; a second gate electrode at least partially overlapping the second active layer; and a second light-blocking layer disposed between the base substrate and the second active layer and overlapping the second active layer. Also, the first light-blocking layer and the second light-blocking layer are made of different materials, and a hydrogen concentration of the second active layer is higher than a hydrogen concentration of the first active layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:薄膜電晶體基板</p>  
        <p type="p">110:底基板</p>  
        <p type="p">115:第一遮光層</p>  
        <p type="p">120:緩衝層</p>  
        <p type="p">130:第一主動層</p>  
        <p type="p">130n,230n:通道部分</p>  
        <p type="p">130a,230a:第一連接部分</p>  
        <p type="p">130b,230b:第二連接部分</p>  
        <p type="p">140,240:閘極絕緣薄膜</p>  
        <p type="p">150:第一閘極電極</p>  
        <p type="p">160:層間絕緣膜</p>  
        <p type="p">171,271:源極電極</p>  
        <p type="p">172,272:汲極電極</p>  
        <p type="p">230:第二主動層</p>  
        <p type="p">250:第二閘極電極</p>  
        <p type="p">TR11:第一薄膜電晶體</p>  
        <p type="p">TR12:第二薄膜電晶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1644" publication-number="202612995"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612995.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612995</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127800</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>隔熱容器及隔熱容器之容器本體的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B65D81/38</main-classification>  
        <further-classification edition="200601120251231B">A47J41/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商京洛股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYORAKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商虎牌熱水瓶股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIGER CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池口尚宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEGUCHI, NAOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田攻一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, KOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>末岡正章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUEOKA, MASAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樽野真輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TARUNO, SHINSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薦田弦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOMODA, GEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松浦亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUURA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭明</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王奕軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種隔熱性優異之隔熱容器及隔熱容器之容器本體的製造方法。根據本發明，提供一種隔熱容器，具備容器本體；前述容器本體係具備：內容器、以及以覆蓋前述內容器之方式配置的外容器；前述內容器與前述外容器之間係設置有密閉空間；前述內容器係以包含60質量%以上之丙烯的單聚物的樹脂所構成；前述外容器係以包含60質量%以上之丙烯與其他烯烴的隨機共聚物的樹脂所構成；前述密閉空間中之氣體係包含熱傳導率低於空氣的氣體；前述密閉空間的氣壓為0.5至1.5大氣壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:容器本體</p>  
        <p type="p">1a:口部</p>  
        <p type="p">1b:胴部</p>  
        <p type="p">1c:底部</p>  
        <p type="p">2a:口部</p>  
        <p type="p">10:隔熱容器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1645" publication-number="202613262"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613262.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613262</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127845</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於化學機械平坦化之組合物及相關系統及相關方法</chinese-title>  
        <english-title>COMPOSITIONS FOR CHEMICAL MECHANICAL PLANARIZATION AND RELATED SYSTEMS AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C09G1/02</main-classification>  
        <further-classification edition="200601120260102B">C09K3/14</further-classification>  
        <further-classification edition="201201120260102B">B24B37/00</further-classification>  
        <further-classification edition="200601120260102B">H01L21/306</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾第　斯里德維　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALETY, SRIDEVI R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維爾瑪　阿迪亞　迪利普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERMA, ADITYA DILIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪哈德威　尼拉杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAHADEV, NIRAJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛吉　潘卡吉　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, PANKAJ K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛吉　雷傑　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, RAJIV K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於用於碳化矽基板之化學機械平坦化(CMP)拋光之組合物、系統及相關方法。組合物包括基於該組合物之總重量至少5重量%之過錳酸鹽組分及複數個顆粒。該複數個顆粒具有小於500之寬度百分比(WIP)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Compositions, systems, and related methods for chemical mechanical planarization (CMP) polishing of silicon carbide substrates. A composition comprises at least 5% by weight of a permanganate component based on a total weight of the composition and a plurality of particles. The plurality of particles has a width percentage (WIP) less than 500.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">102:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1646" publication-number="202613215"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613215.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613215</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127863</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂層形成用膜、以及樹脂層形成用膜之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">C08J5/18</main-classification>  
        <further-classification edition="202301120251222B">H10K77/10</further-classification>  
        <further-classification edition="200601120251222B">B32B27/28</further-classification>  
        <further-classification edition="200601120251222B">B32B7/10</further-classification>  
        <further-classification edition="200601120251222B">B01J2/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋紡股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOBO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水口伝一朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUGUCHI, DENICHIROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀧井佳奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKII, KANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鶴野吉拡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUNO, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>市村俊介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICHIMURA, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村宗敦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, MUNEATSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡辺直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種樹脂層形成用膜，係具有基材膜，第1面的表面自由能的分散成分γd1為45mJ/m&lt;sup&gt;2&lt;/sup&gt;以下之範圍，且極性成分γp1為10mJ/m&lt;sup&gt;2&lt;/sup&gt;以上，第2面的表面自由能的極性成分γp2為20mJ/m&lt;sup&gt;2&lt;/sup&gt;以下，滿足[√((γd1-γd2)&lt;sup&gt;2&lt;/sup&gt;+(γp1-γp2)&lt;sup&gt;2&lt;/sup&gt;)≥10](γp2表示膜第2面的表面自由能的極性成分)，至少一面的表面電阻值為10&lt;sup&gt;12&lt;/sup&gt;Ω/sq以下，使第1面與第2面密接而測定到的動摩擦係數為0.9以下，玻璃轉移溫度為200℃以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1647" publication-number="202613194"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613194.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613194</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127880</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱硬化性樹脂組成物、硬化物、半導體封裝材、半導體裝置、印刷配線板用絕緣材料、及印刷配線板、以及膠囊狀改質劑</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">C08F120/20</main-classification>  
        <further-classification edition="200601120251218B">B01J13/02</further-classification>  
        <further-classification edition="200601120251218B">C08L63/04</further-classification>  
        <further-classification edition="200601120251218B">C08G59/18</further-classification>  
        <further-classification edition="200601120251218B">C08L101/12</further-classification>  
        <further-classification edition="200601120251218B">C08J5/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＤＩＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>二宮淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NINOMIYA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桝本雅也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUMOTO, MASAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三輪廣治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIWA, KOUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供改質樹脂之分散性高的熱硬化性樹脂組成物等。&lt;br/&gt; 本發明係提供：熱硬化性樹脂組成物，其係包含熱硬化性樹脂(A)、硬化劑(B)、改質劑(C)、以及選自由無機微粒子及纖維所組成的群組的1種以上之填充劑(D)的熱硬化性組成物，其中上述改質劑(C)係具有膠囊結構，該膠囊結構具有核與被覆上述核之表面的殼，上述核包含改質樹脂(c)；上述熱硬化性樹脂組成物之硬化物；以及包含上述熱硬化性樹脂組成物的半導體封裝材、半導體裝置、印刷配線板用絕緣材料、及印刷配線板。&lt;br/&gt; 又，本發明係提供膠囊狀改質劑，其具有核與被覆上述核之表面的殼，且上述核包含改質樹脂。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1648" publication-number="202613668"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613668.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613668</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127931</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於疊加虛擬影像至即時影像上的頭戴式虛擬影像模組</chinese-title>  
        <english-title>HEAD WEARABLE VIRTUAL IMAGE MODULE FOR SUPERIMPOSING VIRTUAL IMAGE ON REAL-TIME IMAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250902B">G02B30/26</main-classification>  
        <further-classification edition="200601120250902B">G02B27/01</further-classification>  
        <further-classification edition="200601120250902B">A61B3/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商沃彌股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOMII INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉逢春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, FENG-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種將虛擬影像疊加至即時影像或真實物件的系統。該系統包括右側準直光線信號產生器，用於產生右側準直光線信號，以及左側準直光線信號產生器，用於產生對應於該右側準直光線信訊號的左側準直光線信號，其係被導引朝向觀者的另一視網膜；其中，右側準直光線信號與左側準直光線信號形成具有第一景深之虛擬影像的雙眼像素，觀者所感知的第一景深係根據瞳距，藉由改變投射至觀者雙眼的右側準直光線信號與對應之左側準直光線信號的光線路徑延伸之間的匯聚角而調整，第一景深係對應於右側準直光線信號與對應之左側準直光線信號的光線路徑延伸之匯聚點的景深位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a system for superimposing a virtual image on a real-time image or real object. The system comprises a right collimated light signal generator for generating a right collimated light signal and a left collimated light signal generator for generating a left collimated light signal corresponding to the right collimated light signal which is directed towards the other retina of the viewer; wherein the right collimated light signal and the left collimated light signal form a binocular pixel of a virtual image with a first depth, the first depth which the viewer perceives is modified by changing a convergence angle between light path extensions of the right collimated light signal and the corresponding left collimated light signal projected into the viewer’s eyes based on an interpupillary distance, the first depth corresponds to a depth location of a converging point of light path extensions of the right collimated light signal and the corresponding left collimated light signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:右眼</p>  
        <p type="p">60:左眼</p>  
        <p type="p">100:系統</p>  
        <p type="p">105:真實物件</p>  
        <p type="p">110:即時影像模組</p>  
        <p type="p">140、145:分光鏡</p>  
        <p type="p">160:虛擬影像模組</p>  
        <p type="p">170:右側準直光線信號產生器</p>  
        <p type="p">175:左側準直光線信號產生器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1649" publication-number="202612850"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612850.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612850</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127952</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加工裝置及加工方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251126B">B24D3/28</main-classification>  
        <further-classification edition="200601120251126B">B24B57/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友重機械工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO HEAVY INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小原達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOHARA, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種對加工對象物造成之損傷低且能夠以高效率進行加工之新型磨削裝置。 &lt;br/&gt;　　[解決手段]加工裝置具備：砂輪，係使磨粒分散於含有熱塑性樹脂之黏結劑中；及溫度調節機構，係依據加工樣態，調節砂輪與加工對象物的接觸面的溫度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:砂輪</p>  
        <p type="p">20:溫度調節機構</p>  
        <p type="p">21:高溫用容器</p>  
        <p type="p">22:低溫用容器</p>  
        <p type="p">24:開閉閥</p>  
        <p type="p">25:開閉閥</p>  
        <p type="p">27:選擇性供給路徑</p>  
        <p type="p">31:砂輪凸緣</p>  
        <p type="p">31A:下側圓盤狀構件</p>  
        <p type="p">31B:上側圓盤狀構件</p>  
        <p type="p">33:砂輪軸</p>  
        <p type="p">35:流路</p>  
        <p type="p">50:加工對象物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1650" publication-number="202614354"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614354.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614354</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114127957</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於處理在旋轉中的產品的系統</chinese-title>  
        <english-title>SYSTEM FOR PROCESSING A PRODUCT DURING ROTATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251228B">H01L21/687</main-classification>  
        <further-classification edition="200601120251228B">H01L21/67</further-classification>  
        <further-classification edition="200601120251228B">H02P6/06</further-classification>  
        <further-classification edition="200601120251228B">G05D3/12</further-classification>  
        <further-classification edition="200601120251228B">G05B19/19</further-classification>  
        <further-classification edition="200601120251228B">G01D5/14</further-classification>  
        <further-classification edition="200601120251228B">H01L21/324</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商斯凱孚加拿大有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKF CANADA LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈里斯　蒂莫西　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARRIS, TIMOTHY ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密斯　格里高利　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMITH, GREGORY W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種用於處理一產品之系統，該系統包括：一工具，其處理該產品；及一轉子組合件，其包括支撐該產品之一轉子及具有在該轉子上施加轉矩之一或多個致動器的一定子。一工具控制器操作該工具，且傳輸包括該轉子之一期望速度的速度請求訊號以及在一週期截止時重複的具有一臨限值的一控制脈衝，該週期與該轉子在該期望速度下之一期望旋轉週期成比例。一轉子控制器接收該速度請求訊號及該控制脈衝兩者、控制一或多個定子致動器以使得該轉子以該期望速度及相位旋轉、並且一旦發生該轉子之每一預定角位移便將一轉子位置脈衝及/或相位資訊傳輸至該工具控制器。該工具控制器基於使用來自該轉子控制器之資訊所計算的該轉子之角位置來操作該工具。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for processing a product includes a tool that processes the product and a rotor assembly including a rotor supporting the product and a stator with actuator(s) exerting torque on the rotor. A tool controller operates the tool and transmits speed request signals including a desired speed of the rotor and a control pulse having a threshold value repeating at the expiration of a period proportional to a desired rotation period of the rotor at the desired speed. A rotor controller receives both the speed request signal and the control pulse, controls the stator actuator(s) such that the rotor rotates at the desired speed and phase, and transmits a rotor position pulse and/or phase information to the tool controller once every predetermined angular displacement of the rotor. The tool controller operates the tool based on the angular position of the rotor as calculated using information from the rotor controller.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:處理系統</p>  
        <p type="p">12:工具</p>  
        <p type="p">14:轉子</p>  
        <p type="p">16:轉子組合件</p>  
        <p type="p">18:工具控制器</p>  
        <p type="p">19:計數器</p>  
        <p type="p">20:轉子控制器</p>  
        <p type="p">22:定子</p>  
        <p type="p">24:致動器/轉子致動器/馬達致動器</p>  
        <p type="p">30:旋轉感測器</p>  
        <p type="p">50:副工具</p>  
        <p type="p">52:副控制器</p>  
        <p type="p">A&lt;sub&gt;C&lt;/sub&gt;:中心軸線</p>  
        <p type="p">CP:控制脈衝</p>  
        <p type="p">CS:控制訊號</p>  
        <p type="p">P:產品</p>  
        <p type="p">PP:轉子角位置脈衝</p>  
        <p type="p">SR:速度請求訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1651" publication-number="202612688"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612688.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612688</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128016</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利福布汀的凍乾製劑</chinese-title>  
        <english-title>LYOPHILIZED FORMULATIONS OF RIFABUTIN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/438</main-classification>  
        <further-classification edition="200601120260102B">A61K9/19</further-classification>  
        <further-classification edition="200601120260102B">A61K47/12</further-classification>  
        <further-classification edition="200601120260102B">A61K47/10</further-classification>  
        <further-classification edition="200601120260102B">A61P31/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商生物驗證系統股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIOVERSYS AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>耶格爾　于爾根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAEGER, JUERGEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席爾　朱利安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHILL, JULIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供了包含利福布汀的凍乾溶液、凍乾製劑和重構製劑及其製備方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides solutions for lyophilization, a lyophilized formulation, and a reconstituted formulation containing rifabutin and methods of making the same.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1652" publication-number="202614093"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614093.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614093</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128038</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>狹縫裝置及穿透型小角度散射裝置</chinese-title>  
        <english-title>SLIT DEVICE AND TRANSMISSION SMALL ANGLE SCATTERING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">G21K1/02</main-classification>  
        <further-classification edition="200601120251224B">G01N23/02</further-classification>  
        <further-classification edition="201801120251224B">G01N23/201</further-classification>  
        <further-classification edition="200601120251224B">H01L21/66</further-classification>  
        <further-classification edition="200601120251224B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商理學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIGAKU CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松嶋直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUSHIMA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本野寬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTONO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青柳誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOYAGI, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洞田克隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORADA, KATSUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森道子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, MICHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神田弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANDA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係具備有可藉由狹縫移動機構60而使形成狹縫的狹縫構件51移動的構成。利用狹縫移動機構60使狹縫構件51移動，其可將狹縫配置在接近被試料保持部所保持的試料之檢查區域之位置。此外，當更換試料等時，可使狹縫構件51從試料之檢查區域附近位置退避。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A slit device is configured such that a slit member 51 having a slit therein can be moved by a slit moving mechanism 60. By moving the slit member 51 using the slit moving mechanism 60, the slit is placed at a position near to an inspection area of a sample held by a sample holding unit. Furthermore, when the sample is replaced or the like, the slit member 51 is retracted from the position near to the inspection area of the sample.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:狹縫裝置</p>  
        <p type="p">51:狹縫構件</p>  
        <p type="p">60:狹縫移動機構</p>  
        <p type="p">61:基台</p>  
        <p type="p">62:水平移動台</p>  
        <p type="p">63:支撐台</p>  
        <p type="p">65:X導引軌道</p>  
        <p type="p">66:X驅動馬達</p>  
        <p type="p">67:X滑件</p>  
        <p type="p">69:Y導引軌道</p>  
        <p type="p">70:Y驅動馬達</p>  
        <p type="p">71:Y滑件</p>  
        <p type="p">73:Z導引軌道</p>  
        <p type="p">74:Z驅動馬達</p>  
        <p type="p">75:Z滑件</p>  
        <p type="p">90:傾斜修正機構</p>  
        <p type="p">91:支柱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1653" publication-number="202613487"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613487.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613487</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128045</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>捲尺</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251231B">G01B3/1056</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新潟精機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIIGATA SEIKI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>五十嵐利行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGARASHI, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">捲尺由捲尺帶、始端側滑動件、終端側滑動件以及吊持構件構成，因此，能夠實現輕量化以及小型化，並且與由外殼以及捲尺帶構成之所謂凸狀捲尺相比，其能夠實現輕量化以及小型化，能夠使捲尺帶從上述始端側滑動件以及上述終端側滑動件脫離，捲尺帶能夠藉由依據截面圓弧形狀之固有的直線保持性而保持為直線狀，例如，能夠用作測定水準測量中之高度尺寸的標尺。 &lt;br/&gt;捲尺具備捲尺帶1、始端側滑動件2以及終端側滑動件3、以及能夠吊持捲尺帶的捲入部I的吊持構件4，上述始端側滑動件以及上述終端側滑動件均設為相對於上述捲尺帶而裝配脫離自如。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:捲尺帶</p>  
        <p type="p">1a:表面</p>  
        <p type="p">1b:背面</p>  
        <p type="p">2:始端側滑動件</p>  
        <p type="p">2a:下框</p>  
        <p type="p">2aD:卡止凸條</p>  
        <p type="p">2aK:壁部</p>  
        <p type="p">2b:上框</p>  
        <p type="p">2bK:壁部</p>  
        <p type="p">2bM:卡止槽孔</p>  
        <p type="p">2bS:側部</p>  
        <p type="p">2QS、3QS:底面</p>  
        <p type="p">2QU、3QU:上表面</p>  
        <p type="p">2Y、3Y:指勾部</p>  
        <p type="p">3:終端側滑動件</p>  
        <p type="p">3a:下框</p>  
        <p type="p">3aD:卡止凸條</p>  
        <p type="p">3aS:側部</p>  
        <p type="p">3b:上框</p>  
        <p type="p">3bM:卡止槽孔</p>  
        <p type="p">3bS:側部</p>  
        <p type="p">3e:定位凸部</p>  
        <p type="p">3J:連結軸</p>  
        <p type="p">4:吊持構件</p>  
        <p type="p">4a:罩部</p>  
        <p type="p">4b:引導部</p>  
        <p type="p">4c:吊持部</p>  
        <p type="p">4d:突出片部</p>  
        <p type="p">4e:吊掛孔部</p>  
        <p type="p">4f:定位孔部</p>  
        <p type="p">5:立起倒伏構件</p>  
        <p type="p">6:移動爪構件</p>  
        <p type="p">6a:按壓面</p>  
        <p type="p">6f:上爪部</p>  
        <p type="p">6g:下爪部</p>  
        <p type="p">D:定位機構</p>  
        <p type="p">GP:引導位置</p>  
        <p type="p">I:捲入部</p>  
        <p type="p">IH:捲芯孔部分</p>  
        <p type="p">M:長度刻度</p>  
        <p type="p">MG:永久磁鐵</p>  
        <p type="p">MY:橫刻度</p>  
        <p type="p">NP:防脫銷</p>  
        <p type="p">S:始端側</p>  
        <p type="p">SK:捲尺</p>  
        <p type="p">T:立起倒伏操作機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1654" publication-number="202614912"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614912.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614912</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128087</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在後段製程中之憶阻運算方案</chinese-title>  
        <english-title>MEMRISTIVE COMPUTING SCHEMES IN THE BACK-END-OF-THE-LINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251219B">H10N70/20</main-classification>  
        <further-classification edition="202301120251219B">H10B63/00</further-classification>  
        <further-classification edition="200601120251219B">C23C16/455</further-classification>  
        <further-classification edition="200601120251219B">H01L21/283</further-classification>  
        <further-classification edition="200601120251219B">H01L21/768</further-classification>  
        <further-classification edition="202301120251219B">G06N3/063</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡國立大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY OF SINGAPORE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿斯蒂爾　希波呂特ＰＡＧ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASTIER, HIPPOLYTE P.A.G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼加圖查利　穆罕默德朱維德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANGATTUCHALI, MUHAMMED JUVAID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達斯　昌丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAS, CHANDAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇迪喬諾　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUDIJONO, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格拉德卡克加拉杰　希薇亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRADECAK-GARAJ, SILVIJA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供超薄膜，用作可調電阻通道（憶阻器、阻變開關、突觸節點/突觸模擬器、滯後電阻器、ReRAM或RRAM、電晶體、記憶電晶體）在後段製程（BEOL）應用中，從而在BEOL和前段製程（FEOL）中結合兩個邏輯節點。提供過渡金屬二硫屬化物（TMDC）膜、其他2D材料膜、金屬氧化物膜、金屬羰基化物膜、金屬氮化氧化物膜，以及氮化物膜，這些可用於BEOL中可調電阻通道（憶阻器、阻變開關、突觸節點/突觸模擬器、滯後電阻器、ReRAM或RRAM、電晶體、記憶電晶體）的材料應用。同時還提供利用可調電阻元件的運算方案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are ultrathin films for use as modulable-resistance channels (memristors, resistive switches, synaptic nodes/synaptic emulators, hysteretic resistors, ReRAM or RRAM, transistors, memtransistors) in the back-end-of-line (BEOL) applications, thus, combining two logic nodes in the BEOL and the front-end-of-line (FEOL). Transition metal dichalcogenides (TMDC) films, other 2D material films, metal oxide films, metal carboxide films, metal nitride oxide films, and a nitride films are provided for modulable-resistance channel (memristors, resistive switches, synaptic nodes/synaptic emulators, hysteretic resistors, ReRAM or RRAM, transistors, memtransistors) material applications in BEOL processes. Also provided are computing schemes making use of the modulable-resistance components.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">105:操作</p>  
        <p type="p">110:操作</p>  
        <p type="p">112:操作</p>  
        <p type="p">114:操作</p>  
        <p type="p">116:操作</p>  
        <p type="p">118:操作</p>  
        <p type="p">120:操作</p>  
        <p type="p">130:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1655" publication-number="202614293"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614293.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614293</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128094</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理方法、基板處理系統及電腦程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H01L21/67</main-classification>  
        <further-classification edition="202201120251217B">H04L67/125</further-classification>  
        <further-classification edition="200601120251217B">G05B19/418</further-classification>  
        <further-classification edition="201801120251217B">G06F9/451</further-classification>  
        <further-classification edition="200601120251217B">G06F11/30</further-classification>  
        <further-classification edition="201301120251217B">G06F21/60</further-classification>  
        <further-classification edition="202201120251217B">H04L41/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>船越亘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUNAKOSHI, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒木隆文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROKI, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>真﨑貴幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASAKI, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂口公也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAGUCHI, KIMINARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江藤博文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETOU, HIROFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北田泰裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITADA, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡村幸治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMURA, KOUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供保持安全性並且可進行使用終端裝置之基板處理裝置的維護控制之資訊處理方法、基板處理系統及電腦程式。 &lt;br/&gt;本發明係當於分散設置在具備複數模組之基板處理裝置的複數介面中之一個連接了終端裝置時，按照連接有該終端裝置之介面，於該終端裝置顯示在該複數模組中可從該終端裝置指示動作之模組；在該終端裝置從顯示於該終端裝置之模組中，受理作為維護對象之模組的選擇；輸出對所選擇之模組的維護之指示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理裝置</p>  
        <p type="p">2:終端裝置</p>  
        <p type="p">11:操作面板(受理元件)</p>  
        <p type="p">13:載具站區塊</p>  
        <p type="p">14:製程區塊</p>  
        <p type="p">15:窗</p>  
        <p type="p">100:基板處理系統</p>  
        <p type="p">I1:第1介面</p>  
        <p type="p">I2:第2介面</p>  
        <p type="p">I3:第3介面</p>  
        <p type="p">I4:第4介面</p>  
        <p type="p">I5:第5介面</p>  
        <p type="p">I6:第6介面</p>  
        <p type="p">I7:第7介面</p>  
        <p type="p">x:方向</p>  
        <p type="p">y:方向</p>  
        <p type="p">z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1656" publication-number="202613030"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613030.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613030</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128128</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多晶矽塊狀物的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">C01B33/035</main-classification>  
        <further-classification edition="200601120251230B">C30B28/12</further-classification>  
        <further-classification edition="200601120251230B">C30B29/06</further-classification>  
        <further-classification edition="200601120251230B">C30B33/00</further-classification>  
        <further-classification edition="200601120251230B">B07B1/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商德山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUYAMA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>植杉真也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UESUGI, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西川正芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIKAWA, MASAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露係以提供自西門子法製造的多晶矽棒體破碎後獲得的碎片堆中，藉由簡便的手法，獲得微粉的產生被高度地抑止的多晶矽塊狀物的方法為目的。有關本揭露的一態樣的多晶矽塊狀物的製造方法，其特徵在於：多晶矽塊狀原體係將西門子法製造的多晶矽棒體破碎後獲得的碎片堆中所收集到的碎片，當各碎片中包含於斷裂面存在最小徑為0.5至5mm且深度為1mm以上的凹部的碎片時，則鑿除該凹部；較佳地，當所包含的該凹部，在對於此碎片的總表面積的存在比例係為0.1個/ cm²以上時，鑿除該凹部直到該凹部的存在比例至小於前述下限值為止。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:粗破碎製程</p>  
        <p type="p">S2:破碎製程</p>  
        <p type="p">S3:爆米花MIX分選製程</p>  
        <p type="p">S4:鑿片製程</p>  
        <p type="p">P:多晶矽棒體</p>  
        <p type="p">P1:包含爆米花化表面的棒體區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1657" publication-number="202613709"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613709.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613709</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128135</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>空白光罩用基板及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251225B">G03F1/60</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉山朋陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIYAMA, TOMOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田大実</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, DAIJITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松井晴信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUI, HARUNOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹內正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEUCHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[解決手段]一種空白光罩用基板，具有152mm以上×152mm以上的矩形主表面，當以該主表面之對角線的交點為中心設定矩形區域，該矩形區域之四邊與主表面之四邊分別平行，且位於前述主表面之四邊的內側5mm，則矩形區域的平坦度為100nm以下；將矩形區域之表面形狀分離為X方向成分(Sx)與Y方向成分(Sy)，並針對Sx之最高高度與最低高度的差值PVx、Sy之最高高度與最低高度的差值PVy中，將數值小的定為PV&lt;sub&gt;min&lt;/sub&gt;，數值大的定為PV&lt;sub&gt;max&lt;/sub&gt;，則PV&lt;sub&gt;min&lt;/sub&gt;/PV&lt;sub&gt;max&lt;/sub&gt;為1/3以下。 &lt;br/&gt;　　[效果]提供一種光罩，能夠抑制高NA(高數值孔徑)世代之EUVL進行曝光對IPE的影響，尤其在採用變形鏡頭之光學系統進行曝光時，能夠抑制基板平坦度因為縮小倍率之方向性而對IPE所造成的影響；於是在主表面的廣大曝光區域中，具有更好的轉印性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S:表面形狀</p>  
        <p type="p">Sa:近似表面形狀</p>  
        <p type="p">Sm:表面形狀</p>  
        <p type="p">Sx:X方向成分</p>  
        <p type="p">Sy:Y方向成分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1658" publication-number="202612972"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612972.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612972</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128143</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人力驅動車用驅動單元</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251231B">B62M6/55</main-classification>  
        <further-classification edition="200601120251231B">B62M9/00</further-classification>  
        <further-classification edition="200601120251231B">B62M11/00</further-classification>  
        <further-classification edition="200601120251231B">B62M11/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIZAKI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成瀬光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARUSE, HIKARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亀田剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMEDA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]要提供一種人力驅動車用驅動單元，能適當對人力驅動車提供推進力。 &lt;br/&gt;　　[解決手段]人力驅動車用驅動單元，具備有：支承部、承受人力驅動力且具有第1軸心的驅動軸、設置於上述驅動軸的輸出部、具有轉子及定子的馬達、將上述馬達的馬達扭矩傳遞到上述輸出部的傳遞機構、及連接於上述轉子且具有與上述第1軸心不同的第2軸心的馬達輸出軸；上述傳遞機構，包含：具有行星齒輪機構的第1傳遞部；上述行星齒輪機構的至少局部，繞上述第2軸心旋轉且從與上述第2軸心正交的第1方向觀察與上述馬達重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12A:曲柄軸</p>  
        <p type="p">38:第1單向離合器</p>  
        <p type="p">40:驅動單元</p>  
        <p type="p">42:支承部</p>  
        <p type="p">42A:第1孔部</p>  
        <p type="p">42B:第2孔部</p>  
        <p type="p">42X:第1支承部</p>  
        <p type="p">42Y:第2支承部</p>  
        <p type="p">42Z:第3支承部</p>  
        <p type="p">44:驅動軸</p>  
        <p type="p">44A:第1驅動軸端部</p>  
        <p type="p">44B:第2驅動軸端部</p>  
        <p type="p">46:輸出部</p>  
        <p type="p">46A:第1輸出部端部</p>  
        <p type="p">46B:第2輸出部端部</p>  
        <p type="p">46C:連接部</p>  
        <p type="p">48:馬達</p>  
        <p type="p">50:傳遞機構</p>  
        <p type="p">52:馬達輸出軸</p>  
        <p type="p">52A:第1馬達輸出軸端部</p>  
        <p type="p">52B:第2馬達輸出軸端部</p>  
        <p type="p">54:殼體</p>  
        <p type="p">54A:安裝部</p>  
        <p type="p">56:轉子</p>  
        <p type="p">56A:貫穿孔</p>  
        <p type="p">56B:外周部</p>  
        <p type="p">56C:內周部</p>  
        <p type="p">56D:中間部</p>  
        <p type="p">58:定子</p>  
        <p type="p">60:第1軸承</p>  
        <p type="p">62:第2軸承</p>  
        <p type="p">64:第1傳遞部</p>  
        <p type="p">66:減速機構</p>  
        <p type="p">68:行星齒輪機構</p>  
        <p type="p">70:太陽齒輪</p>  
        <p type="p">72:環狀齒輪</p>  
        <p type="p">72A:凸緣部</p>  
        <p type="p">72B:環狀齒輪安裝部</p>  
        <p type="p">74:行星齒輪</p>  
        <p type="p">76:載架</p>  
        <p type="p">78:傳遞軸</p>  
        <p type="p">78A:第1傳遞軸端部</p>  
        <p type="p">78B:第2傳遞軸端部</p>  
        <p type="p">80:第2傳遞部</p>  
        <p type="p">82:第3單向離合器</p>  
        <p type="p">84:第3傳遞部</p>  
        <p type="p">86:電路基板</p>  
        <p type="p">86A:預定部分</p>  
        <p type="p">88:馬達旋轉狀態檢測部</p>  
        <p type="p">90:人力驅動力檢測部</p>  
        <p type="p">A1:第1方向</p>  
        <p type="p">A2:第2方向</p>  
        <p type="p">B1:第1旋轉方向</p>  
        <p type="p">B2:第2旋轉方向</p>  
        <p type="p">C1:第1軸心</p>  
        <p type="p">C2:第2軸心</p>  
        <p type="p">C3:第3軸心</p>  
        <p type="p">SA:收容空間</p>  
        <p type="p">X:軸方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1659" publication-number="202613557"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613557.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613557</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128216</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物件電性檢測治具及其操作方法</chinese-title>  
        <english-title>ELECTRICAL DETECTION FIXTURE OF ARTICLE AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">G01R1/02</main-classification>  
        <further-classification edition="202001120250902B">G01R31/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威光自動化科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAS AUTOMATION CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃金福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHIN-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒智文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSOU, CHIH-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連仁偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIEN, JEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈維揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種物件電性檢測治具及其操作方法，依序包括憑藉該治具以懸持方式承載該物件，接續憑藉一高壓空氣驅動一氣囊膨脹，以生成一可壓縮式作用力驅動該物件移動，致使該物件的至少一電性連接埠能柔性的嵌接於該治具內具有通電特性的一檢測接座，以達保護所述電性連接埠、檢測接座和物件內載的電子構裝的目的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides an electrical detection fixture of article and operation method thereof, sequentially includes loading the article in a suspended manner by means of the fixture, and then relying a high-pressure air to driver a gasbag inflates, so that a compressible force is generated by the gasbag to drive the article moves, so as to bring about at least one electrical port of the article can be flexibly embedded in a detection connector with energizing characteristics in the fixture. In order to achieve the purpose for protecting the electronic constructions in the electrical port, the electrical connector and the article.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基體</p>  
        <p type="p">11:頂艙</p>  
        <p type="p">12:中置艙</p>  
        <p type="p">13:底艙</p>  
        <p type="p">14:座板</p>  
        <p type="p">15:檢測接座</p>  
        <p type="p">17:側牆</p>  
        <p type="p">18:導持件</p>  
        <p type="p">20:置放座</p>  
        <p type="p">22:立牆</p>  
        <p type="p">23:滑座</p>  
        <p type="p">231:邊牆</p>  
        <p type="p">232:連接牆</p>  
        <p type="p">233:舌部</p>  
        <p type="p">24:驅動器</p>  
        <p type="p">241:缸桿</p>  
        <p type="p">25:彈性元件</p>  
        <p type="p">251:立柱</p>  
        <p type="p">40:物件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1660" publication-number="202614333"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614333.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614333</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128220</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於基板處理系統中之旋轉總成定心的設備及方法</chinese-title>  
        <english-title>APPARATUS AND METHOD FOR ROTATION ASSEMBLY CENTERING IN A SUBSTRATE PROCESSING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">H01L21/68</main-classification>  
        <further-classification edition="200601120251216B">G05B19/402</further-classification>  
        <further-classification edition="200601120251216B">H01L21/677</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNGBAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全柱錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEON, JUSEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種用於旋轉總成定心之系統及方法。該旋轉總成可用於一基板處理系統中以用於在該系統中之反應腔室之間移動基板，並且其定心對於處理品質至關重要。本揭露呈現一種具有一旋轉臂定心功能之基板處理設備，其包含：預定數目個反應腔室，其經組態以處理基板；一旋轉總成，其安置於該等反應腔室之一中心處；一腔室壁，其包圍該等反應腔室；一傳輸單元，其安置於旋轉板上，該傳輸單元經組態以將信號傳輸至接收器；以及複數個感測器，其安置於該腔室壁上之指定地點處，該等感測器中之各者經組態以接收自該傳輸單元傳輸之一信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and method for rotation assembly centering is disclosed. The rotation assembly may be used in a substrate processing system for moving substrates between reaction chambers in the system and its centering is important for processing quality. This disclosure presents a substrate processing apparatus with a rotation arm centering function, comprising: a predetermined number of reaction chambers configured to process substrates; a rotation assembly disposed at a center of the reaction chambers; a chamber wall surrounding the reaction chambers; a transmitting unit disposed on the rotation plate, the transmitting unit configured to transmit signals to receivers; and a plurality of sensors disposed at designated places on the chamber wall, each of the sensors configured to receive a signal transmitted from the transmitting unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">150:腔室壁</p>  
        <p type="p">151:腔室空間</p>  
        <p type="p">161:旋轉板</p>  
        <p type="p">170:傳輸器</p>  
        <p type="p">171:感測器</p>  
        <p type="p">172:感測器</p>  
        <p type="p">173:感測器</p>  
        <p type="p">174:感測器</p>  
        <p type="p">180:控制器</p>  
        <p type="p">181:水平調整單元</p>  
        <p type="p">182:豎直調整單元</p>  
        <p type="p">183:使用者介面</p>  
        <p type="p">300:系統</p>  
        <p type="p">A:輸入</p>  
        <p type="p">B:狀態</p>  
        <p type="p">h:高度</p>  
        <p type="p">h1:高度</p>  
        <p type="p">L1:信號</p>  
        <p type="p">L2:信號</p>  
        <p type="p">L3:信號</p>  
        <p type="p">L4:信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1661" publication-number="202613203"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613203.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613203</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128221</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚胺基甲酸酯水系分散體及水性塗料</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">C08G18/32</main-classification>  
        <further-classification edition="200601120251001B">C08G18/42</further-classification>  
        <further-classification edition="200601120251001B">C08G18/76</further-classification>  
        <further-classification edition="200601120251001B">C08L75/06</further-classification>  
        <further-classification edition="200601120251001B">C08L79/02</further-classification>  
        <further-classification edition="200601120251001B">C08K5/25</further-classification>  
        <further-classification edition="200601120251001B">C08K5/29</further-classification>  
        <further-classification edition="200601120251001B">C08J3/05</further-classification>  
        <further-classification edition="201801120251001B">C09D7/63</further-classification>  
        <further-classification edition="201801120251001B">C09D7/65</further-classification>  
        <further-classification edition="200601120251001B">C09D175/06</further-classification>  
        <further-classification edition="200601120251001B">C09D5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一工業製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DKS CO. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金子文弥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANEKO, FUMIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提高塗膜對於樹脂的密接性及耐UV密接性。實施形態的聚胺基甲酸酯水系分散體是包含聚酯多元醇作為構成成分的聚胺基甲酸酯樹脂（A）分散於水系分散介質中而成，且包含含碳二醯亞胺基的化合物（B）與具有下述通式（1）所表示的基的化合物（C）。聚胺基甲酸酯樹脂（A）具有羧基，聚胺基甲酸酯樹脂（A）的酸價為5 mgKOH/g～25 mgKOH/g。式（1）中，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;分別獨立地表示氫原子或碳數1～3的烴基，*表示鍵結鍵。 &lt;br/&gt;[化1] &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="90px" width="286px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1662" publication-number="202614820"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614820.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614820</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128225</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251229B">H10D30/62</main-classification>  
        <further-classification edition="202501120251229B">H10D64/20</further-classification>  
        <further-classification edition="202501120251229B">H10D64/27</further-classification>  
        <further-classification edition="202501120251229B">H10D62/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIMYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李光永</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KWANGYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪世基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, SEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體裝置可包括在第一方向上延伸並在第二方向上具有第一寬度的第一主動圖案；在第一方向上延伸並在第二方向上具有小於第一寬度的第二寬度的第二主動圖案；在第一主動圖案上延伸的第一閘極結構；在第二主動圖案上延伸的第二閘極結構；在第一閘極結構之間的第一主動圖案上的第一源極/汲極區；在第二閘極結構之間的第二主動圖案上的第二源極/汲極區；在第一源極/汲極區的側表面上的第一鰭間隔件；以及在第二源極/汲極區的側表面上的第二鰭間隔件。第一鰭間隔件在第三方向上的高度可小於第二鰭間隔件在第三方向上的高度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device may include a first active pattern extending in a first direction and having a first width in a second direction, a second active pattern extending in the first direction and having a second width in the second direction that is less than the first width, first gate structures extending on the first active pattern, second gate structures extending on the second active pattern, a first source/drain region on the first active pattern between the first gate structures, a second source/drain region on the second active pattern between the second gate structures, a first fin spacer on a side surface of the first source/drain region, and a second fin spacer on a side surface of the second source/drain region. A height of the first fin spacer in a third direction may be less than a height of the second fin spacer in the third direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體裝置</p>  
        <p type="p">101:基板</p>  
        <p type="p">105a:第一主動圖案</p>  
        <p type="p">105b:第二主動圖案</p>  
        <p type="p">110:裝置隔離層</p>  
        <p type="p">150a:第一源極/汲極區</p>  
        <p type="p">150b:第二源極/汲極區</p>  
        <p type="p">151a:第一延伸部分</p>  
        <p type="p">151b:第二延伸部分</p>  
        <p type="p">152a:第一擴展部分</p>  
        <p type="p">152b:第二擴展部分</p>  
        <p type="p">155a:第一鰭間隔件</p>  
        <p type="p">155b:第二鰭間隔件</p>  
        <p type="p">170:層間絕緣層</p>  
        <p type="p">180a:第一接觸插塞</p>  
        <p type="p">180b:第二接觸插塞</p>  
        <p type="p">H1:第一高度</p>  
        <p type="p">H2:第二高度</p>  
        <p type="p">IIIa-IIIa’、IIIb-IIIb’:線</p>  
        <p type="p">R1:第一區</p>  
        <p type="p">R2:第二區</p>  
        <p type="p">W1a:第一寬度</p>  
        <p type="p">W1b:第二寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1663" publication-number="202614324"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614324.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614324</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128245</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板搬送裝置及位置教示方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">H01L21/677</main-classification>  
        <further-classification edition="200601120251222B">B25J9/22</further-classification>  
        <further-classification edition="200601120251222B">B25J13/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑原丈二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUWAHARA, JOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基板搬送裝置及位置教示方法，其可以更簡單之構成實現教示作業之自動化。 &lt;br/&gt;本發明中，攝影部55拍攝位於基準位置Bs之手部43、及位於從基準位置Bs已前進前進量P1後之前進位置Cs之手部43的圖像。位置計算部73係從各個圖像中計算出手部43之推測移動量L1。補正係數計算部74係使用前進量P1與推測移動量L1來計算補正係數l。校正部75係以補正係數Mk對根據搬送目標物的圖像所計算出之必要移動量E進行校正，藉此計算出校正移動量H。由於校正部75對前進量P1與推測移動量L1之偏差進行校正，因此，當使用攝影部55所拍攝之光學圖像81、82來計算搬送對象的位置之構成中，其可消除因攝影部55及光學圖像81、82等引起之偏差。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理裝置</p>  
        <p type="p">10:基板搬送裝置</p>  
        <p type="p">43:手部</p>  
        <p type="p">44:進退驅動部</p>  
        <p type="p">55:攝影部(攝像系統)</p>  
        <p type="p">59:攝影機</p>  
        <p type="p">61:圖像取得部</p>  
        <p type="p">63:通信部</p>  
        <p type="p">65:控制部</p>  
        <p type="p">67:操作部</p>  
        <p type="p">69:記憶部</p>  
        <p type="p">71:驅動控制部</p>  
        <p type="p">73:位置計算部</p>  
        <p type="p">74:補正係數計算部</p>  
        <p type="p">75:校正部</p>  
        <p type="p">76:位置記憶部</p>  
        <p type="p">77:告知部</p>  
        <p type="p">TM1:基板搬送機構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1664" publication-number="202613437"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613437.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613437</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128253</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於密封地結合相對流體導管端口之環形襯墊及形成一高純度流體接頭之方法</chinese-title>  
        <english-title>RING-SHAPED GASKET FOR SEALINGLY JOINING OPPOSED FLUID CONDUIT PORTS AND METHOD OF FORMING A HIGH PURITY FLUID JOINT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">F16J15/06</main-classification>  
        <further-classification edition="200601120251223B">F16J15/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商肯發系統私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMPART SYSTEMS PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福　金　諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VU, KIM NGOC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種環形襯墊，其用於在具有與該襯墊接觸之至少一個簡單平坦表面之相對流體輸送裝置元件之間進行高純度流體通路連接。至少一個裝置元件之面通常具有一圓形埋頭孔凹陷部分以接納該襯墊，然並非必需的。該襯墊具有一主體，該主體藉由產生一流體通路且界定一徑向內部表面之一孔貫穿且額外地具有一徑向外部表面、一第一軸端表面及一第二軸端表面。該第一軸端表面及該第二軸端表面之至少一者具有徑向地毗鄰於一襯墊密封區域之一應力集中特徵部，該密封區域經構造以與一對應流體導管端口之一表面接觸。該應力集中特徵部可係毗鄰該襯墊軸端表面密封區域安置之一凹槽或複數個腔室。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A ring-shaped gasket for making high-purity fluid pathway connections between opposing fluid delivery apparatus elements having at least one simple flat surface in contact with the gasket. The face of at least one apparatus element typically has a circular counterbore depression to receive the gasket, but is not required. The gasket has a body, pierced through by a hole creating a fluid pathway and defining a radial inner surface, and additionally having a radial outer surface, a first axial end surface and a second axial end surface. At least one of the first and second axial end surfaces has a stress concentration feature radially adjacent to a gasket sealing region, the sealing region constructed to be in contact with a face surface of a corresponding fluid conduit port. The stress concentration feature may be a groove or a plurality of cavities disposed adjacent the gasket axial end surface sealing region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:第七代表性實例/襯墊</p>  
        <p type="p">920:應力集中特徵部/應力集中凹槽/底切凹槽</p>  
        <p type="p">930:唇緣/襯墊密封區域唇緣/襯墊唇緣/相對襯墊唇緣/第一軸端表面唇緣/相對軸端表面唇緣/密封區域唇緣</p>  
        <p type="p">950:襯墊主體</p>  
        <p type="p">951:孔</p>  
        <p type="p">955:流體通路內孔/襯墊內孔</p>  
        <p type="p">956:徑向內部表面</p>  
        <p type="p">970:應力集中特徵部/應力集中凹槽/底切凹槽</p>  
        <p type="p">980:唇緣/襯墊密封區域唇緣/襯墊唇緣/相對襯墊唇緣/第二軸端表面唇緣/相對軸端表面唇緣/密封區域唇緣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1665" publication-number="202614672"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614672.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614672</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128272</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於保護增強光學件在真空條件下免受電漿之不利影響之方法及設備</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR THE ENHANCED OPTICS PROTECTION FROM THE ADVERSE EFFECTS OF PLASMA UNDER VACUUM CONDITIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H05G2/00</main-classification>  
        <further-classification edition="200601120251226B">G21K1/06</further-classification>  
        <further-classification edition="200601120251226B">G02B17/08</further-classification>  
        <further-classification edition="200601120251226B">H01J37/09</further-classification>  
        <further-classification edition="200601120251226B">F16L9/19</further-classification>  
        <further-classification edition="200601120251226B">G03F7/20</further-classification>  
        <further-classification edition="200601120251226B">G01N21/88</further-classification>  
        <further-classification edition="200601120251226B">G01B11/00</further-classification>  
        <further-classification edition="200601120251226B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茲古金　康士坦丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSIGUTKIN, KONSTANTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅爾尼　迪米崔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MELNIK, DMITRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">可保護一光源內之光學件在低壓操作條件下免受電漿之不利影響。源之操作涉及激發高溫電漿，從而以一所要波長產生輻射。操作可包含供應燃料、激發能量、補充物質，及藉由折射及/或反射光學件提取所產生之輻射。在常規操作期間產生之電漿共同產生高能帶電粒子及燃料蒸氣，其在與光學件之表面相互作用時導致光學件效能劣化。為減輕劣化，可圍繞光學件實施保護性氣罩及管道。管道可提高保護性氣罩之效率，其可允許減少保護性氣體消耗需求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Optics within a light source may be protected from adverse effects of plasma under low pressure operating conditions. The operation of the source involves excitation of high-temperature plasma producing radiation at a desired wavelength. The operation may include the supply of the fuel, excitation energy, supplemental substances, and extraction of produced radiation by means of refractive and/or reflective optics. The plasma generated during regular operation co-produces highly energetic charged particles and fuel vapors, which, upon interaction with the surface of the optics results in the degradation of the optics performance. To mitigate the degradation, protective gas shields and ducts may be implemented around the optics. The ducts may improve the efficiency of the protective gas shields, which may allow for the reduction of the protective gas consumption requirements.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:照明源</p>  
        <p type="p">106:折射光學件</p>  
        <p type="p">108:靶材</p>  
        <p type="p">110:集光器</p>  
        <p type="p">113:電漿位點</p>  
        <p type="p">120:第一管道</p>  
        <p type="p">122:第二管道</p>  
        <p type="p">134:電漿至集光器區段</p>  
        <p type="p">136:集光器至中間聚焦區段</p>  
        <p type="p">138:雷射出射開口</p>  
        <p type="p">140:照明入射開口</p>  
        <p type="p">142:照明出射開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1666" publication-number="202613542"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613542.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613542</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128273</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於掃描電子束影像形成及元素分析之系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR SCANNING ELECTRON BEAM IMAGE-FORMATION WITH ELEMENTAL ANALYSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251216B">G01N23/2206</main-classification>  
        <further-classification edition="201801120251216B">G01N23/2252</further-classification>  
        <further-classification edition="200601120251216B">H01J37/28</further-classification>  
        <further-classification edition="200601120251216B">H01J37/29</further-classification>  
        <further-classification edition="201701120251216B">G06T7/00</further-classification>  
        <further-classification edition="200601120251216B">H01L21/66</further-classification>  
        <further-classification edition="200601120251216B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜　辛容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, XINRONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈菲尼格　雷夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NYFFENEGGER, RALPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尤　文靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOU, WENJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種系統，其可包含：一電子束源，其經組態以產生一初級電子束；及一電子光學柱，其包含經組態以將該初級電子束之至少一部分引導至一樣本之一部分上之一組電子光學元件。該組電子光學元件可包含沿著一光軸安置之一物鏡，其中該物鏡包含一或多個電荷控制板(CCP)，其中該電子光學柱包含經組態以同時收集自該樣本發出之一或多個反向散射電子(BSE)信號及一或多個x射線信號之一偵測器總成。該偵測器總成可包含一或多個矽漂移偵測器(SDD)感測器及一或多個BSE感測器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system may include an electron beam source configured to generate a primary electron beam and an electron-optical column including a set of electron-optical elements configured to direct at least a portion of the primary electron beam onto a portion of a sample. The set of electron-optical elements may include an objective lens disposed along an optical axis, where the objective lens includes one or more charge control plates (CCPs), where the electron-optical column includes a detector assembly configured to concurrently collect one or more backscattered electron (BSE) signals and one or more x-ray signals emanated from the sample. The detector assembly may include one or more silicon-drift detector (SDD) sensors and one or more BSE sensors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:掃描電子顯微鏡(SEM)檢測子系統</p>  
        <p type="p">104:樣本</p>  
        <p type="p">201:初級電子束/初級射束</p>  
        <p type="p">202:電子束源</p>  
        <p type="p">204:電子光學柱</p>  
        <p type="p">206:物鏡</p>  
        <p type="p">208:聚光透鏡</p>  
        <p type="p">210:孔隙</p>  
        <p type="p">212:偏轉器</p>  
        <p type="p">214:磁極片</p>  
        <p type="p">216:線圈</p>  
        <p type="p">218:電荷控制板(CCP)</p>  
        <p type="p">220:偵測器總成</p>  
        <p type="p">222:二次電子偵測器</p>  
        <p type="p">224:二次信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1667" publication-number="202613115"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613115.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613115</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128311</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>BTK降解劑及其用途</chinese-title>  
        <english-title>BTK DEGRADER AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D471/04</main-classification>  
        <further-classification edition="200601120260102B">C07D487/04</further-classification>  
        <further-classification edition="200601120260102B">C07D519/00</further-classification>  
        <further-classification edition="201701120260102B">A61K47/55</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4985</further-classification>  
        <further-classification edition="200601120260102B">A61K31/55</further-classification>  
        <further-classification edition="200601120260102B">A61K31/513</further-classification>  
        <further-classification edition="200601120260102B">A61K31/519</further-classification>  
        <further-classification edition="200601120260102B">A61K31/53</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商蘇州亞盛藥業有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASCENTAGE PHARMA (SUZHOU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商亞盛醫藥集團（香港）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASCENTAGE PHARMA GROUP CORP LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡建濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, JIANTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　建勇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIANYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁啟達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及用作BTK的降解劑或抑制劑的化合物。本公開還涉及包含它們的藥物組合物，以及它們在治療由BTK介導的疾病諸如癌症中的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1668" publication-number="202612948"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612948.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612948</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128326</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>車輛之電子裝置中的安全增強及先進較低電力狀態的啟用</chinese-title>  
        <english-title>SAFETY ENHANCEMENT AND ENABLING OF ADVANCED LOWER POWER STATES IN AN ELECTRONIC DEVICE OF A VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251219B">B60W50/02</main-classification>  
        <further-classification edition="200601120251219B">B60W50/04</further-classification>  
        <further-classification edition="200601120251219B">G06F1/28</further-classification>  
        <further-classification edition="201901120251219B">G06F1/3203</further-classification>  
        <further-classification edition="200601120251219B">B60R16/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李在坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JAE GON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加格　羅賓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARG, ROBIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼　秀婷程</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAN, XIUTING CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬基亞　尼廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKHIJA, NITIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之某些態樣提供一種在一監測裝置處之方法。該方法可包括：基於一電力控制器的監測，判定是否在一省電狀態期間完全關斷從一電源至處理元件的電力，或是否在一正常電力狀態期間完全導通從該電源至該等處理元件的該電力，該電力控制器經組態以導通或關斷從該電源至該等處理元件的該電力。該方法可進一步包括：當在該省電狀態期間，從該電源至處理元件的該電力未完全關斷時及/或在該正常電力狀態期間，從該電源至該等處理元件的該電力未完全導通時，傳輸一警告信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Certain aspects of the present disclosure provide a method at a monitoring device. The method may include determining whether power is completely turned off to processing elements from a power source during a power saving state and/or whether the power is completely turned on to the processing elements from the power source during a normal power state, based on monitoring of a power controller configured to turn or off the power to the processing elements from the power source. The method may further include transmitting an alert signal when the power is not completely turned off to processing elements from the power source during the power saving state and/or the power is not completely turned on to the processing elements from the power source during the normal power state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:操作；方法</p>  
        <p type="p">510:步驟</p>  
        <p type="p">520:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1669" publication-number="202614667"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614667.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614667</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128329</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控制方法、程式、資訊終端、開關裝置、及負載系統</chinese-title>  
        <english-title>CONTROL METHOD, PROGRAM, INFORMATION TERMINAL, SWITCH DEVICE, AND LOAD SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251228B">H05B47/10</main-classification>  
        <further-classification edition="202201120251228B">G06F3/0488</further-classification>  
        <further-classification edition="202201120251228B">G06F3/0481</further-classification>  
        <further-classification edition="201801120251228B">G06F9/451</further-classification>  
        <further-classification edition="200601120251228B">G06F3/02</further-classification>  
        <further-classification edition="202001120251228B">H05B47/19</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>八手又猛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATEMATA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田里遥香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TASATO, HARUKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川又基嗣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMATA, MOTOTSUGU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>槻木優樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUKIGI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之目的在於提高開關裝置之操作便捷性。本揭示之資訊終端(100)包含：通訊部(105)、顯示部(102)、及控制部(110)。開關裝置具備為了使1以上之第1負載之動作狀態變化而被操作之1以上之實體操作部，且設置於構造體。顯示部(102)可顯示為了經由開關裝置使1以上之第2負載之動作狀態變化而被操作之1以上之虛擬操作部。1以上之虛擬操作部之數目為1以上之實體操作部之數目以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:資訊終端</p>  
        <p type="p">100A:第1資訊終端</p>  
        <p type="p">101:信號處理部</p>  
        <p type="p">102:顯示部</p>  
        <p type="p">103:操作受理部</p>  
        <p type="p">104:相機</p>  
        <p type="p">105:通訊部</p>  
        <p type="p">106:第2通訊部</p>  
        <p type="p">107:記憶部</p>  
        <p type="p">108:輸出部</p>  
        <p type="p">109:設定部</p>  
        <p type="p">110:控制部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1670" publication-number="202614445"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614445.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614445</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128347</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電源電路封裝</chinese-title>  
        <english-title>PACKAGE FOR A POWER CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H01L23/538</main-classification>  
        <further-classification edition="200601120251103B">H01L23/52</further-classification>  
        <further-classification edition="200601120251103B">H01L23/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣　航</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, HUNT HANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒲應江</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PU, YINGJIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">電源電路封裝包含一個設置在半導體基板第一側的圖案化導電層。圖案化導電層被配置爲電耦合至設置在基板上的第一晶粒、設置在基板上的散熱器以及嵌入在基板中的第二晶粒。圖案化導電層的端子、過孔和焊墊構成了封裝的不同導電網路。通過將散熱器設置在最繁忙的網路上，可以降低電路的整體導通電阻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This power circuit package includes a patterned conductive layer arranged a first side of a semiconductor substrate. This patterned conductive layer is configured to be electrically coupled to a first die arranged on the substrate, a heat sink arranged on the substrate, and a second die embedded in the substrate. Terminals, vias and pads of patterned conductive layer form different conductive net of the package. By setting the heat sink on the “busiest” net, the overall on-resistance of a circuit can be reduced.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電源電路封裝</p>  
        <p type="p">101:第一晶粒</p>  
        <p type="p">101a:第一側</p>  
        <p type="p">101b:第二側</p>  
        <p type="p">102:第二晶粒</p>  
        <p type="p">102a:第一側</p>  
        <p type="p">102b:第二側</p>  
        <p type="p">103:基板</p>  
        <p type="p">103a:第一側</p>  
        <p type="p">103b:第二側</p>  
        <p type="p">104:散熱器</p>  
        <p type="p">104a:第一側</p>  
        <p type="p">104b:第二側</p>  
        <p type="p">105a:焊料</p>  
        <p type="p">105b:燒結金屬</p>  
        <p type="p">106:第二圖案化導電層</p>  
        <p type="p">107a:第一焊墊</p>  
        <p type="p">107b:第二焊墊</p>  
        <p type="p">108a:第一導電通孔</p>  
        <p type="p">108b:第二導電通孔</p>  
        <p type="p">109:第三導電通孔</p>  
        <p type="p">110:封裝材料</p>  
        <p type="p">111:第一端子</p>  
        <p type="p">112:第二端子</p>  
        <p type="p">113:第三端子</p>  
        <p type="p">120:第一圖案化導電層</p>  
        <p type="p">121:第一導電網路</p>  
        <p type="p">122:第二導電網路</p>  
        <p type="p">123:第三導電網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1671" publication-number="202612974"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612974.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612974</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128375</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人力車輛輪轂及人力車輛</chinese-title>  
        <english-title>HUMAN-POWERED VEHICLE HUB AND HUMAN-POWERED VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B62M9/10</main-classification>  
        <further-classification edition="200601120251231B">B62J6/12</further-classification>  
        <further-classification edition="202001120251231B">B62J45/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡智成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKA, TOMONARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐野徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANO, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原岳志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIWARA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">人力車輛輪轂包括輪轂軸、輪轂外殼、發電機、鏈輪支撐體、至少一個感測器和電力產生控制器。發電機被組配為響應於輪轂軸與輪轂外殼之間的相對旋轉而產生電力。至少一個鏈輪要被鏈輪支撐體附接。至少一個感測器被組配為感測人力車輛的狀態。至少一個感測器包括第一相對旋轉感測器，其被組配為感測輪轂軸與鏈輪支撐體之間的相對旋轉。電力產生控制器被組配為基於第一相對旋轉感測器的第一輸出以執行與發電機的電力產生相關的控制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A human-powered vehicle hub comprises a hub axle, a hub shell, a dynamo, a sprocket support body, at least one sensor, and an electricity-generation controller. The dynamo is configured to generate electricity in response to relative rotation between the hub axle and the hub shell. At least one sprocket is to be attached to the sprocket support body. The at least one sensor is configured to sense a state of a human-powered vehicle. The at least one sensor includes a first relative rotation sensor configured to sense relative rotation between the hub axle and the sprocket support body. The electricity-generation controller is configured to execute a control relating to electricity generation of the dynamo based on a first output of the first relative rotation sensor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">74:切換器電路</p>  
        <p type="p">76:保護電路</p>  
        <p type="p">S1:步驟</p>  
        <p type="p">S2:步驟</p>  
        <p type="p">S3:步驟</p>  
        <p type="p">S4:步驟</p>  
        <p type="p">S5:步驟</p>  
        <p type="p">S6:步驟</p>  
        <p type="p">S7:步驟</p>  
        <p type="p">S8:步驟</p>  
        <p type="p">S9:步驟</p>  
        <p type="p">S10:步驟</p>  
        <p type="p">ST1C1:第一連接狀態</p>  
        <p type="p">ST1C2:第一附加連接狀態</p>  
        <p type="p">ST1D:第一斷開狀態</p>  
        <p type="p">ST2C:第二連接狀態</p>  
        <p type="p">ST2D:第二斷開狀態</p>  
        <p type="p">RL:剩餘位準</p>  
        <p type="p">TL:剩餘位準臨界值</p>  
        <p type="p">OP1:第一輸出</p>  
        <p type="p">OP2:第二輸出</p>  
        <p type="p">TH1:第一旋轉臨界值</p>  
        <p type="p">TH2:第二旋轉臨界值</p>  
        <p type="p">TH3:第三旋轉臨界值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1672" publication-number="202614458"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614458.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614458</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128377</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電極、二次電池、電池包及車輛</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250923B">H01M4/133</main-classification>  
        <further-classification edition="201001120250923B">H01M4/525</further-classification>  
        <further-classification edition="201001120250923B">H01M4/505</further-classification>  
        <further-classification edition="201001120250923B">H01M10/0525</further-classification>  
        <further-classification edition="202101120250923B">H01M50/249</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東芝股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA TOSHIBA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>保科圭吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSHINA, KEIGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋圭太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, KEITARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加納顕人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANO, KENTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村田芳明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA, YOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田康宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高見則雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAMI, NORIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供能夠實現高輸入輸出密度的二次電池之電極、高輸入輸出密度的二次電池及電池包，以及包含該電池包的車輛。 &lt;br/&gt;　　根據本實施形態，提供包含複數活性物質粒子與纖維狀碳的電極。纖維狀碳係包含具有纖維徑W1在60 nm以上500 nm以下範圍內的第一部分，以及具有比纖維徑W1小的纖維徑W2的第二部分。至少第二部分的至少一部分係與複數活性物質粒子接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電極</p>  
        <p type="p">10a:集電體</p>  
        <p type="p">10b:活性物質含有層</p>  
        <p type="p">11:活性物質粒子</p>  
        <p type="p">12:纖維狀碳</p>  
        <p type="p">13:微細氧化物粒子</p>  
        <p type="p">C1:第一部分</p>  
        <p type="p">C2:第二部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1673" publication-number="202612845"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612845.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612845</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128378</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加工裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251124B">B24B47/20</main-classification>  
        <further-classification edition="200601120251124B">B24B7/02</further-classification>  
        <further-classification edition="200601120251124B">B24B47/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友重機械精科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO HEAVY INDUSTRIES FINETECH, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小原達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOHARA, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田真</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種能夠高品質地加工高硬度的加工對象物之加工裝置。 &lt;br/&gt;　　[解決手段]在從與第1方向平行的方向觀察之俯視下，在與三角形的3個頂點對應之位置配置有3個線性導件。加工單元由線性導件支撐為能夠沿第1方向升降。進給機構使加工單元沿第1方向升降。保持機構在加工單元的下方保持加工對象物。加工單元以與由保持機構保持之加工對象物相對向之方式支撐砂輪，並且包括使砂輪繞與第1方向平行的旋轉中心旋轉之主軸單元。在俯視下，加工單元的重心位於三角形的內部，在使砂輪繞旋轉中心旋轉時，砂輪通過與三角形的重心不重疊且從三角形的重心朝向由進給機構對加工單元施加升降方向的力之部位偏離之位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:線性導件</p>  
        <p type="p">20:加工單元</p>  
        <p type="p">20G:加工單元的重心</p>  
        <p type="p">21:鞍座</p>  
        <p type="p">23:砂輪凸緣</p>  
        <p type="p">25A:砂輪的軌跡</p>  
        <p type="p">26F:升降力施加部位</p>  
        <p type="p">30:三角形</p>  
        <p type="p">30G:三角形的重心</p>  
        <p type="p">31:小三角形</p>  
        <p type="p">31G:小三角形的重心</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1674" publication-number="202613973"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613973.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613973</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128385</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影像篩選方法與電子裝置</chinese-title>  
        <english-title>IMAGE SCREENING METHOD AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251008B">G06V10/22</main-classification>  
        <further-classification edition="202201120251008B">G06V10/30</further-classification>  
        <further-classification edition="202201120251008B">G06V10/36</further-classification>  
        <further-classification edition="202201120251008B">G06V10/58</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邑流微測股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLOWVIEW TEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李政哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHENG CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鈺凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林冠宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, KUAN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提出一種影像篩選方法與電子裝置。此方法包含：透過攝影鏡組擷取數位影像；擷取數位影像中的多個物件；對數位影像執行空間至頻率轉換以取得頻率影像；移除頻率影像中的第一部分，保留頻率影像中的第二部分；對第二部分執行濾波操作以得到過濾後影像；對過濾後影像執行頻率至空間轉換以得到重建影像；以及比較重建影像以及數位影像以篩選物件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure proposes an image screening method and an electronic device. The method includes: capturing a digital image through a lens assembly; extracting multiple objects from the digital image; performing a spatial-to-frequency transformation on the digital image to obtain a frequency-domain image; removing a first portion of the frequency-domain image while retaining a second portion; performing a filtering operation on the second portion to obtain a filtered image; performing a frequency-to-spatial transformation on the filtered image to obtain a reconstructed image; and comparing the reconstructed image with the digital image to screening the objects.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">301~307:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1675" publication-number="202612919"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612919.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612919</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128434</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自行車輪轂總成</chinese-title>  
        <english-title>BICYCLE HUB ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B60B27/02</main-classification>  
        <further-classification edition="200601120251229B">B60B27/04</further-classification>  
        <further-classification edition="200601120251229B">B60B1/14</further-classification>  
        <further-classification edition="200601120251229B">B62M9/12</further-classification>  
        <further-classification edition="200601120251229B">B62M9/10</further-classification>  
        <further-classification edition="200601120251229B">F16H55/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田寬司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>腰山和喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSHIYAMA, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中西崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANISHI, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自行車輪轂總成包含一鏈輪支撐主體。該鏈輪支撐主體包括經結構設計以與一自行車後鏈輪總成嚙合之至少十個外部花鍵齒。該至少十個外部花鍵齒中之每一者具有一外部花鍵傳動表面及一外部花鍵非傳動表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A bicycle hub assembly comprises a sprocket support body. The sprocket support body includes at least ten external spline teeth configured to engage with a bicycle rear sprocket assembly. Each of the at least ten external spline teeth has an external-spline driving surface and an external-spline non-driving surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">28:鏈輪支撐主體</p>  
        <p type="p">28A:內部帶螺紋部分</p>  
        <p type="p">40:外部花鍵齒</p>  
        <p type="p">41:基座支撐件</p>  
        <p type="p">42:較大直徑部分</p>  
        <p type="p">44:凸緣</p>  
        <p type="p">46:螺旋外部花鍵齒</p>  
        <p type="p">A1:旋轉中心軸線</p>  
        <p type="p">D2:軸向方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1676" publication-number="202614294"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614294.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614294</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128467</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>腔室裝置及位置調整機構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H01L21/67</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商龍雲股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAZMO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田邊雅明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANABE, MASAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之腔室機構係藉由利用密封部之彈性，而能夠於維持形成腔室之狀態之同時，使第2腔室形成部相對於第1腔室形成部之相對位置於第1位置與較第1位置更遠離之第2位置之間變化。位置調整機構係可針對第2腔室形成部之相對位置而於第1位置與第2位置之間進行調整的機構，其具備如下構成之可動部及凸輪構造。可動部設置於第1腔室形成部，其構成為可沿與第1方向垂直之第2方向平移運動。凸輪構造設置於可動部及第2腔室形成部，其構成為可將可動部向第2方向之平移運動轉換成第2腔室形成部朝向第1位置之平移運動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:腔室機構</p>  
        <p type="p">3:位置調整機構</p>  
        <p type="p">4:檢測感測器</p>  
        <p type="p">11:第1腔室形成部</p>  
        <p type="p">12:第2腔室形成部</p>  
        <p type="p">11s,12s:對向面</p>  
        <p type="p">12t:背面</p>  
        <p type="p">13:驅動部</p>  
        <p type="p">24:缸室</p>  
        <p type="p">26:密封部</p>  
        <p type="p">31A,31B:可動部</p>  
        <p type="p">32A,32B:凸輪構造</p>  
        <p type="p">41:位移感測器</p>  
        <p type="p">D1:第1方向</p>  
        <p type="p">D2:第2方向</p>  
        <p type="p">103:密封部</p>  
        <p type="p">242:軸</p>  
        <p type="p">301:施力部</p>  
        <p type="p">301Q:支撐部</p>  
        <p type="p">302:調整主要部</p>  
        <p type="p">310:滾珠螺桿</p>  
        <p type="p">311:螺桿軸</p>  
        <p type="p">312A,312B:螺帽</p>  
        <p type="p">313:導軌</p>  
        <p type="p">321A,321B:斜面</p>  
        <p type="p">322A,322B:輥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1677" publication-number="202614259"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614259.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614259</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128468</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>剝離裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H01L21/66</main-classification>  
        <further-classification edition="200601120251103B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商龍雲股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAZMO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田邊雅明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANABE, MASAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">於本發明之剝離裝置中，腔室機構藉由利用密封部之彈性，能夠維持使第1及第2腔室形成部合體之狀態，同時，使第2腔室形成部相對於第1腔室形成部之相對位置於第1位置與第2位置之間變化。剝離機構係能夠於腔室內將處於貼合狀態之2個工件藉由在其等之貼合面間使裂紋生長來進行剝離的機構，且於任一工件之正面與背面，利用腔室之內壓產生該工件之貼合面側呈正壓之壓力差，並且擴大該壓力差之產生區域，藉此使裂紋生長。控制裝置基於檢測第2腔室形成部之相對位置的位移感測器之輸出，而檢測2個工件間的剝離狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:腔室機構</p>  
        <p type="p">3:位置調整機構</p>  
        <p type="p">4:檢測感測器</p>  
        <p type="p">11:第1腔室形成部</p>  
        <p type="p">12:第2腔室形成部</p>  
        <p type="p">11s,12s:對向面</p>  
        <p type="p">12t:背面</p>  
        <p type="p">13:驅動部</p>  
        <p type="p">24:缸室</p>  
        <p type="p">26:密封部</p>  
        <p type="p">31A,31B:可動部</p>  
        <p type="p">32A,32B:凸輪構造</p>  
        <p type="p">41:位移感測器</p>  
        <p type="p">D1:第1方向</p>  
        <p type="p">D2:第2方向</p>  
        <p type="p">103:密封部</p>  
        <p type="p">242:軸</p>  
        <p type="p">301:施力部</p>  
        <p type="p">301Q:支撐部</p>  
        <p type="p">302:調整主要部</p>  
        <p type="p">310:滾珠螺桿</p>  
        <p type="p">311:螺桿軸</p>  
        <p type="p">312A,312B:螺帽</p>  
        <p type="p">313:導軌</p>  
        <p type="p">321A,321B:斜面</p>  
        <p type="p">322A,322B:輥</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1678" publication-number="202614260"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614260.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614260</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128473</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線上偵測與修復系統</chinese-title>  
        <english-title>INLINE DETECTION AND REPAIR SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H01L21/66</main-classification>  
        <further-classification edition="200601120251217B">H01L21/67</further-classification>  
        <further-classification edition="201801120251217B">G01N23/04</further-classification>  
        <further-classification edition="200601120251217B">H01J37/30</further-classification>  
        <further-classification edition="200601120251217B">H01J37/305</further-classification>  
        <further-classification edition="200601120251217B">C23C16/513</further-classification>  
        <further-classification edition="200601120251217B">H01L23/538</further-classification>  
        <further-classification edition="201901120251217B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃茲尼　莎拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOZNY, SARAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆勒　伯恩哈德甘德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUELLER, BERNHARD GUNTER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克諾柏　尼可萊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KNAUB, NIKOLAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種在基板或中介層上的缺陷執行線上偵測與修復的方法，該方法不會破壞基板或中介層。該方法在獨立平台或單一平台中的製造區域中進行。在某些實施例中，該方法可以包括遵循面板級封裝製程，使用電子束對面板表面至少部分進行成像，以偵測面板上的缺陷，識別缺陷的類型，並根據缺陷的類型，遵循面板級封裝製程修復面板上的缺陷，采用材料移除製程移除材料以修復缺陷，或使用電子束結合前驅物氣體來沉積材料以修復缺陷。材料移除製程可以包括電漿束或離子束。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for performing an inline detection and repair of a defect on a substrate or interposer that does not destroy the substrate or interposer. The method is performed in the manufacturing area in separate platforms or a single platform. In some embodiments, the method may include detecting a defect on a panel in line to a panel level packaging process using an electron beam to image at least a portion of a surface of the panel, identifying a type of the defect, and repairing the defect on the panel based on the type of the defect in line with the panel level packaging process using a material removal process to remove material to fix a defect or using the electron beam in conjunction with a precursor gas to deposit material to fix a defect. The material removal process may include a plasma beam or an ion beam.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:系統</p>  
        <p type="p">902:裝置</p>  
        <p type="p">904:裝置</p>  
        <p type="p">906:裝置</p>  
        <p type="p">908:裝置</p>  
        <p type="p">910:線</p>  
        <p type="p">912:線</p>  
        <p type="p">914A:製程</p>  
        <p type="p">914B:製程</p>  
        <p type="p">914C:製程</p>  
        <p type="p">914N:製程</p>  
        <p type="p">916:基板</p>  
        <p type="p">918:返回</p>  
        <p type="p">920:設計檔案</p>  
        <p type="p">922:裝置</p>  
        <p type="p">930:裝置</p>  
        <p type="p">950:控制器</p>  
        <p type="p">952:CPU</p>  
        <p type="p">954:記憶體</p>  
        <p type="p">956:支援電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1679" publication-number="202614173"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614173.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614173</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128474</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含矽烯層的矽基板及其製作方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">H01L21/205</main-classification>  
        <further-classification edition="202501120251224B">H10D30/47</further-classification>  
        <further-classification edition="200601120251224B">H01L21/324</further-classification>  
        <further-classification edition="200601120251224B">H01L21/22</further-classification>  
        <further-classification edition="200601120251224B">C23C16/24</further-classification>  
        <further-classification edition="200601120251224B">C23C14/14</further-classification>  
        <further-classification edition="202501120251224B">H10D62/83</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大槻剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHTSUKI, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木温</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上東洋太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEHIGASHI, YOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部達夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, TATSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為一種含矽烯層的矽基板及其製作方法，該含矽烯層的矽基板的特徵在於具有：矽基板上的矽烯層、及該矽烯層上的碳摻雜矽層。藉此，提供一種含矽烯層的矽基板及其製作方法，該含矽烯層的矽基板已抑制矽烯層的氧化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:含矽烯層的矽基板</p>  
        <p type="p">2:矽基板</p>  
        <p type="p">3:Ag層</p>  
        <p type="p">4:矽烯層</p>  
        <p type="p">5:碳摻雜矽層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1680" publication-number="202613248"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613248.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613248</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128498</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱硬化性樹脂組合物及其用途</chinese-title>  
        <english-title>HEAT-CURABLE RESIN COMPOSITION AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">C08L79/08</main-classification>  
        <further-classification edition="200601120251216B">C08L63/06</further-classification>  
        <further-classification edition="200601120251216B">C08G59/22</further-classification>  
        <further-classification edition="200601120251216B">C08K3/36</further-classification>  
        <further-classification edition="200601120251216B">C08K7/16</further-classification>  
        <further-classification edition="200601120251216B">C08G59/44</further-classification>  
        <further-classification edition="200601120251216B">C08F297/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>堤吉弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUTSUMI, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>津浦篤司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUURA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>工藤俊輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDO, SHUNSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井口洋之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGUCHI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩﨑真之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWASAKI, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>工藤雄貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUDO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的目的是提供一種熱硬化性樹脂組合物，其能提供低介電正切且接著性優異，特別是除膠耐性優異的硬化物。其解決手段為一種熱硬化性樹脂組合物，包含(A)芳香族環狀醯亞胺化合物，重量平均分子量為5,000~100,000；(B)脂肪族環狀醯亞胺化合物，重量平均分子量為100~2,000；(C)環氧樹脂，1分子中具有2個以上的環氧基；(D)環氧樹脂用硬化劑；(E)硬化觸媒；及(F)無機填充材，該(A)~(E)成分的合計含有率為組合物全體的5~99質量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a heat-curable resin composition that not only has a low dielectric tangent but also is excellent in adhesivity, and that particularly results in a cured product which exhibits an excellent desmear resistance. The heat-curable resin composition includes (A) an aromatic cyclic imide compound having a weight average molecular weight of 5,000 to 100,000, (B) an aliphatic cyclic imide compound having a weight average molecular weight of 100 to 2,000, (C) an epoxy resin having two or more epoxy groups in one molecule, (D) a curing agent for epoxy resin, (E) a curing catalyst, and (F) an inorganic filler, wherein the heat-curable resin composition contains the components (A) to (E) in a total amount of 5 to 99% by mass based on the overall composition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1681" publication-number="202613326"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613326.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613326</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128540</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用反應萃取加工陰極活性材料之方法</chinese-title>  
        <english-title>PROCESS FOR THE PROCESSING OF CATHODE ACTIVE MATERIALS BY REACTIVE EXTRACTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">C22B3/08</main-classification>  
        <further-classification edition="201001120251231B">H01M10/0525</further-classification>  
        <further-classification edition="201001120251231B">H01M4/505</further-classification>  
        <further-classification edition="201001120251231B">H01M4/525</further-classification>  
        <further-classification edition="200601120251231B">B01D59/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商Ｈ　Ｃ　施塔克鎢業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>H. C. STARCK TUNGSTEN GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米斯　馬克特舍費爾　尤利亞妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEESE-MARKTSCHEFFEL, JULIANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧爾布里希　阿爾明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLBRICH, ARMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝克　華納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAECKER, WERNER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波迪格　哈根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PODDIG, HAGEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐格納　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEUGNER, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>厄布　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ERB, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃爾貝達　傑倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VOLBEDA, JEROEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索伯利希　蒂諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAEUBERLICH, TINO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳翠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種加工陰極活性材料之方法，特別係藉由反應萃取方式回收其中之有價金屬鎳、鈷及錳。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a process for the processing of cathode active materials, in particular for the recovery of the valuable metals nickel, cobalt and manganese, by means of reactive extraction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A1:萃取</p>  
        <p type="p">A2:反萃取</p>  
        <p type="p">B1:萃取</p>  
        <p type="p">B2:反萃取</p>  
        <p type="p">C:萃取</p>  
        <p type="p">D:皂化</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1682" publication-number="202613527"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613527.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613527</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128545</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於檢查關於EUV半導體技術的物件的設備</chinese-title>  
        <english-title>APPARATUS FOR INSPECTING AN OBJECT PERTAINING TO EUV SEMICONDUCTOR TECHNOLOGY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">G01N21/88</main-classification>  
        <further-classification edition="200601120251216B">G02B17/02</further-classification>  
        <further-classification edition="202101120251216B">G02B7/00</further-classification>  
        <further-classification edition="200601120251216B">G03F7/20</further-classification>  
        <further-classification edition="200601120251216B">G02B21/00</further-classification>  
        <further-classification edition="200601120251216B">H01L21/66</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朵林　德克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOERING, DIRK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安翠克　托斯坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANTRACK, TORSTEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐子堯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, ZIYAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關於一種一種用於檢查屬於EUV半導體技術的一物件(58)的設備(51)，包含一照明單元(67)、一成像光學單元(59)和用於對該物件(58)成像和擷取的一記錄裝置(52)。此設備(51)以以下事實而具有區別性；為了對該成像光學單元(59)的一光瞳平面(66)的光瞳照明進行成像，一Bertrand模組(70、71、72、74)配置在該成像光學單元(59)內的一自由空間中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to an apparatus (51) for inspecting an object (58) pertaining to EUV semiconductor technology comprising an illumination unit (67), an imaging optical unit (59) and a recording device (52) for imaging and capturing the object (58). The apparatus (51) is distinguished by the fact that for imaging the pupil illumination of the pupil plane (66) of the imaging optical unit (59), a Bertrand module (70, 71, 72,74) is arranged in a free space in the imaging optical unit (59).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:伯特蘭模組/裝置</p>  
        <p type="p">58:物件</p>  
        <p type="p">61:鏡筒</p>  
        <p type="p">66:光瞳</p>  
        <p type="p">51:光罩檢查設備</p>  
        <p type="p">52、73、75:記錄裝置</p>  
        <p type="p">59:成像光學單元</p>  
        <p type="p">70、71、72、74:Bertrand模組</p>  
        <p type="p">70.1、71.1、71.2、72.1、74.1:Bertrand元件/反射鏡</p>  
        <p type="p">M1、M2、M3、M4:反射鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1683" publication-number="202614535"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614535.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614535</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128560</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線電力接收器中之電容性調變</chinese-title>  
        <english-title>CAPACITIVE MODULATION IN A WIRELESS POWER RECEIVER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251228B">H02J50/12</main-classification>  
        <further-classification edition="201601120251228B">H02J50/80</further-classification>  
        <further-classification edition="202401120251228B">H04B5/79</further-classification>  
        <further-classification edition="200601120251228B">H03J5/02</further-classification>  
        <further-classification edition="202401120251228B">H04B5/00</further-classification>  
        <further-classification edition="200601120251228B">H01F38/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商杜比智財授權有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOLBY INTELLECTUAL PROPERTY LICENSING, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甘尼許　賈彥提</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANESH, JAYANTI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔提柯達　舍巴雷歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TATIKONDA, SUBBARAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坎納卡薩巴　維斯瓦娜坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANAKASABAI, VISWANATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴塔葛里　雅佩塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BATAGERI, ARPITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀畊宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於自適應電容性調變之系統、方法及設備。一電力接收器可支援諸如5瓦(5 W)、15 W或25 W以及其他實例之各種功率位準下之電力接收。該電力接收器可自具有不同電容位準之複數個調變器當中選擇使用哪一調變器來與電力傳輸器通訊。在一些態樣中，一調變器之選擇係基於一經估計電感耦合因數(K&lt;sub&gt;est&lt;/sub&gt;)及功率位準。在其中耦合高之例項中，一第一調變器(例如，具有4.7奈法拉(nF)電容)用於低功率位準(例如，5 W)且一第二調變器(例如，具有10 nF至22 nF)用於高功率位準(例如，25 W)。該電力接收器可選擇調變器電容，使得該電力傳輸器避免電容性區操作，且具有足以用於有效通訊之幅移鍵控(ASK)深度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides systems, methods and apparatuses for adaptive capacitive modulation. A Power Receiver can support power reception at a variety of power levels, such as 5 watts (5W), 15W, or 25W, among other examples. The Power Receiver can select, from among a plurality of modulators having different capacitance levels, which modulator to use for communication with the Power Transmitter. In some aspects, selection of a modulator is based on an estimated induction coupling factor (K&lt;sub&gt;est&lt;/sub&gt;) and power level. In instances where coupling is high, a first modulator (e.g., having 4.7 nano-farads (nF) capacitance) is used for low power levels (e.g., 5W) and a second modulator (e.g., having 10 nF to 22 nF) is used for high power levels (e.g., 25 W). The Power Receiver can select the modulator capacitance such that the Power Transmitter avoids capacitive region operation and has sufficient amplitude shift keying (ASK) depth for effective communication.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">130:電力接收器</p>  
        <p type="p">132:電力傳送線圈</p>  
        <p type="p">136:電力接收器(PRx)儲能電路</p>  
        <p type="p">140:整流器</p>  
        <p type="p">142:轉換器</p>  
        <p type="p">146:電力接收器(PRx)控制器</p>  
        <p type="p">152:負載</p>  
        <p type="p">160:調變器</p>  
        <p type="p">530:電容器Crx1</p>  
        <p type="p">532:電容器Crx2</p>  
        <p type="p">540:開關Sr1</p>  
        <p type="p">600a:圖式</p>  
        <p type="p">610:轉儲負載</p>  
        <p type="p">612:第一調變器</p>  
        <p type="p">614:第二調變器</p>  
        <p type="p">616:第三調變器</p>  
        <p type="p">Vrect:已整流電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1684" publication-number="202613788"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613788.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613788</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128579</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>主機、使用者識別系統以及使用者識別方法</chinese-title>  
        <english-title>HOST, USER IDENTIFICATION SYSTEM, AND USER IDENTIFICATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G06F3/041</main-classification>  
        <further-classification edition="201301120251103B">G06F21/32</further-classification>  
        <further-classification edition="201301120251103B">B60R25/25</further-classification>  
        <further-classification edition="201301120251103B">B60R25/23</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇景光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIMAX TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹佳融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, JIA RONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃得祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, TE YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳恒孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HENG XIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱享</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊竣凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, CHUN-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾俊翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, CHUN HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪培元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, PEI-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱文澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, WEN-TSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述主機、使用者識別系統以及使用者識別方法。主機包括儲存電路以及處理器。儲存電路被設置成儲存程式碼。處理器耦接到儲存所述電路，並被設置成存取所述程式碼。所述處理器被設置成從觸控螢幕，接收觸控訊號。所述處理器被設置成判定識別結果，所述識別結果指示所述觸控訊號是否包括使用者識別訊號。所述處理器被設置成基於所述識別結果，判定所述觸控螢幕的當前操作者。所述處理器被設置成基於所述當前操作者，在所述觸控螢幕上，執行操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A host, a user identification system, and a user identification method are described herein. The host includes a storage circuit and a processor. The storage circuit is configured to store a program code. The processor is coupled to the storage circuit and configured to access the program code. The processor is configured to receive a touch signal from a touch screen. The processor is configured to determine an identification result indicating that whether the touch signal comprises a user identification signal or not. The processor is configured to determine a current operator of the touch screen based on the identification result. The processor is configured to perform an operation on the touch screen based on the current operator.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:主機</p>  
        <p type="p">200A:使用者識別情境</p>  
        <p type="p">202:訊號產生器</p>  
        <p type="p">204:觸控螢幕</p>  
        <p type="p">C1、C2、C3、C4:電容</p>  
        <p type="p">U1、U2、U3、U4:使用者</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1685" publication-number="202613610"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613610.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613610</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128586</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偏光板及包含該偏光板的圓偏光板</chinese-title>  
        <english-title>POLARIZING PLATE AND CIRCULAR POLARIZING PLATE CONTAINING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">G02B5/30</main-classification>  
        <further-classification edition="200601120251217B">G02F1/1335</further-classification>  
        <further-classification edition="202301120251217B">H10K59/10</further-classification>  
        <further-classification edition="201901120251217B">B32B7/02</further-classification>  
        <further-classification edition="200601120251217B">C09K19/38</further-classification>  
        <further-classification edition="200601120251217B">C08G59/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野崎真衣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOZAKI, MAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲田清孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INADA, KIYOTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永安智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAYASU, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供不易發生捲曲之偏光板及含有該偏光板之圓偏光板。 &lt;br/&gt;作為解決課題之手段係一種偏光板，其包含偏光膜及鄰接於該偏光膜之保護層，其中， &lt;br/&gt;前述偏光膜係由包含聚合性液晶化合物及含有二色性色素之聚合性液晶化合物的硬化物所構成，且具有0.1至5µm的厚度， &lt;br/&gt;前述保護層係含有陽離子聚合性化合物之硬化性組成物的硬化物層，且具有0.2至3µm的厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention aims to provide a polarizing plate resistant to curling and a circular polarizing plate containing the polarizing plate. &lt;br/&gt;A polarizing plate according to the present invention includes a polarizing film and a protective layer adjacent to the polarizing film, wherein the polarizing film is composed of a cured product of a polymerizable liquid crystal composition containing a polymerizable liquid crystal compound and a dichroic dye, and has a thickness of 0.1 to 5 μm; and the protective layer is a cured product layer of a curable composition containing a cationically polymerizable compound, and has a thickness of 0.2 to 3 μm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1686" publication-number="202614514"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614514.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614514</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128593</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可維修連接器</chinese-title>  
        <english-title>REPAIRABLE CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251017B">H01R13/6591</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本航空電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAPAN AVIATION ELECTRONICS INDUSTRY, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松永章宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUNAGA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可維修連接器，其包括連接器模組和安裝在連接器模組上的支架。該連接器模組包括：插座連接器，其配置為從外殼的外部與插頭連接器嵌合；模組基板，其上安裝有該插座連接器；以及板對板連接器，其安裝在該模組基板上，並藉由該模組基板與該插座連接器電連接，該支架包括筒部和支撐部，該支撐部固定在內部電路板上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A repairable connector includes a connector module and a bracket mounted on the connector module. The connector module includes a receptacle connector configured to be mated with a plug connector from outside an enclosure, a module substrate on which the receptacle connector is mounted, and a board-to-board connector that is mounted on the module substrate and electrically connected to the receptacle connector via the module substrate. The bracket includes a barrel portion and a support portion. The support portion is fixed to an internal circuit board.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:可維修連接器</p>  
        <p type="p">10:連接器模組</p>  
        <p type="p">11:支架</p>  
        <p type="p">12A(12):連接器安裝表面</p>  
        <p type="p">13:插座連接器</p>  
        <p type="p">14:板對板連接器</p>  
        <p type="p">40:筒部</p>  
        <p type="p">40A:容納空間</p>  
        <p type="p">41:支撐部</p>  
        <p type="p">41A:螺孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1687" publication-number="202614196"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614196.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614196</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128628</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">H01L21/304</main-classification>  
        <further-classification edition="200601120251222B">H01L21/306</further-classification>  
        <further-classification edition="200601120251222B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西山耕二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIYAMA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可適當地供給處理液之基板處理裝置。 &lt;br/&gt;本發明之基板處理裝置1具備有：前區塊3、機櫃部4及後區塊5。前區塊3具備有腔室6。後區塊5具備有腔室8。機櫃部4具備有：處理液容器71a、配管72Fa及送液部79Fa。處理液容器71a貯存處理液Ra。配管72Fa連接處理液容器71a與前區塊3的腔室6。送液部79Fa設置於配管72Fa上。前區塊3、機櫃部4及後區塊5依此順序沿前後方向X排列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理裝置</p>  
        <p type="p">2:移載傳送部</p>  
        <p type="p">3:前區塊(第1區塊、第2區塊)</p>  
        <p type="p">4:機櫃部</p>  
        <p type="p">5:後區塊(第1區塊、第2區塊)</p>  
        <p type="p">6:腔室(第1腔室)</p>  
        <p type="p">8:腔室(第2腔室)</p>  
        <p type="p">20:處理單元(第1處理單元、第2處理單元)</p>  
        <p type="p">30:處理單元</p>  
        <p type="p">41:保持部</p>  
        <p type="p">42:噴嘴</p>  
        <p type="p">43:杯</p>  
        <p type="p">71a:處理液容器(第1處理液容器)</p>  
        <p type="p">72Fa:配管(第1配管)</p>  
        <p type="p">72Ra:配管(第2配管)</p>  
        <p type="p">73Fa:上游部(第1配管之上游部)</p>  
        <p type="p">73Ra:上游部(第2配管之上游部)</p>  
        <p type="p">75Fa:下游部(第1配管之下游部)</p>  
        <p type="p">75Ra:下游部(第2配管之下游部)</p>  
        <p type="p">76Fa:內部分(第1內部分)</p>  
        <p type="p">76Ra:內部分(第2內部分)</p>  
        <p type="p">77Fa:外部分(第1外部分)</p>  
        <p type="p">77Ra:外部分(第2外部分)</p>  
        <p type="p">78Fa:接頭(第1接頭)</p>  
        <p type="p">78Ra:接頭</p>  
        <p type="p">79Fa:送液部(第1送液部)</p>  
        <p type="p">79Ra:送液部(第2送液部)</p>  
        <p type="p">Q1:交界</p>  
        <p type="p">Q2:交界</p>  
        <p type="p">Q3:交界</p>  
        <p type="p">Ra:處理液</p>  
        <p type="p">W:基板</p>  
        <p type="p">X:前後方向(第1方向)</p>  
        <p type="p">Y:寬度方向(第2方向)</p>  
        <p type="p">Z:鉛直方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1688" publication-number="202614325"> 
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      <tif no="1" file="TIF/202614325.zip"/> 
    </tif-files>  
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      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614325</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128629</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251210B">H01L21/677</main-classification>  
        <further-classification edition="200601120251210B">H01L21/67</further-classification>  
        <further-classification edition="200601120251210B">H01L21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑原丈二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUWAHARA, JOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西山耕二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIYAMA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可提高基板處理裝置的產出量(throughput)之基板處理裝置及基板處理方法。 &lt;br/&gt;本發明係關於一種基板處理裝置及基板處理方法。基板處理裝置1具備有：移載傳送部2、滑塊部3、橋接部4、第1前部5及第1後部6。移載傳送部2、滑塊部3及橋接部4依此順序沿前後方向X排列。第1前部5、橋接部4及第1後部6依此順序沿前後方向X排列。滑塊部3在移載傳送部2與橋接部4之間搬送基板W。橋接部4在滑塊部3與第1前部5之間搬送基板W。橋接部4在滑塊部3與第1後部6之間搬送基板W。第1前部5具備有複數個處理單元50。第1前部5具備有搬送機構55。第1後部6具備有複數個處理單元60。第1後部6具備有搬送機構65。滑塊部3於俯視下，與第1前部5的處理單元50相重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理裝置</p>  
        <p type="p">2:移載傳送部</p>  
        <p type="p">3:滑塊部</p>  
        <p type="p">4:橋接部</p>  
        <p type="p">5:第1前部</p>  
        <p type="p">6:第1後部</p>  
        <p type="p">7:第2前部</p>  
        <p type="p">8:第2後部</p>  
        <p type="p">50:處理單元(第1前部的處理單元)</p>  
        <p type="p">55:搬送機構(第1前搬送機構)</p>  
        <p type="p">60:處理單元(第1後部的處理單元)</p>  
        <p type="p">65:搬送機構(第1後搬送機構)</p>  
        <p type="p">70:處理單元(第2前部的處理單元)</p>  
        <p type="p">75:搬送機構(第2前搬送機構)</p>  
        <p type="p">80:處理單元(第2後部的處理單元)</p>  
        <p type="p">85:搬送機構(第2後搬送機構)</p>  
        <p type="p">Wa,Wb,Wc,Wd:基板</p>  
        <p type="p">X:前後方向(第1方向)</p>  
        <p type="p">Y:寬度方向(第2方向)</p>  
        <p type="p">Z:鉛直方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1689" publication-number="202613081"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613081.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613081</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128675</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種光引發劑、感光性樹脂組合物及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">C07D233/64</main-classification>  
        <further-classification edition="200601120250901B">C08F2/44</further-classification>  
        <further-classification edition="200601120250901B">C08F2/50</further-classification>  
        <further-classification edition="200601120250901B">G03F7/004</further-classification>  
        <further-classification edition="200601120250901B">G03F7/027</further-classification>  
        <further-classification edition="200601120250901B">G03F7/031</further-classification>  
        <further-classification edition="200601120250901B">G03F7/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商常州強力電子新材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGZHOU TRONLY NEW ELECTRONIC MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商常州強力先端電子材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGZHOU TRONLY ADVANCED ELECTRONIC MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢曉春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, XIAOCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光引發劑、感光性樹脂組合物及其應用，所述光引發劑為2,2’-二(2-烷氧基苯基)-4,4’,5,5’-四苯基二咪唑光引發劑，具有式(I)所示結構，其中R表示C3~C8的直鏈或支鏈烷基。所述感光性樹脂組合物包括(A)2,2’-二(2-烷氧基苯基)-4,4’,5,5’-四苯基二咪唑光引發劑，(B)鹼可溶性聚合物；(C)具有烯屬不飽和雙鍵的化合物。本發明的光引發劑能夠使得感光性樹脂組合物抗蝕圖案完整，圖案輪廓的直線性良好，並且感光性樹脂組合物的分散穩定性良好，具有較高的解析度，同時也具有較好的感度，並且還能夠滿足歐盟鹵素指令的要求。</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="213px" width="287px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1690" publication-number="202613080"> 
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      <tif no="1" file="TIF/202613080.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
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      <publication-reference> 
        <document-id> 
          <doc-number>202613080</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128676</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種磺酸酯類光酸產生劑及其製備方法和應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C07D221/14</main-classification>  
        <further-classification edition="200601120251103B">C09K3/00</further-classification>  
        <further-classification edition="200601120251103B">G03F7/004</further-classification>  
        <further-classification edition="200601120251103B">G03F7/039</further-classification>  
        <further-classification edition="200601120251103B">G03F7/20</further-classification>  
        <further-classification edition="200601120251103B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商常州強力先端電子材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGZHOU TRONLY ADVANCED ELECTRONIC MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商常州強力電子新材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGZHOU TRONLY NEW ELECTRONIC MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商常州強力光電材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANGZHOU TRONLY OPTO-ELECTRONIC MATERIALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QIAN, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種磺酸酯類光酸產生劑及其製備方法和應用，所述磺酸酯類光酸產生劑具有如通式(I)所示結構。本發明的光酸產生劑不含氟，且其光解生成的磺酸酸性不弱於傳統含氟光酸產生劑，可以用於解決現有的磺酸酯類光酸產生劑存在酸根含氟導致PFAS問題，而不含氟酸根酸性弱的問題，並且本發明的磺酸酯類光酸產生劑能夠提高感光組合物的感光性和解析度。</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="156px" width="327px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1691" publication-number="202612828"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612828.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612828</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128684</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射加工頭及雷射加工裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251218B">B23K26/046</main-classification>  
        <further-classification edition="201401120251218B">B23K26/064</further-classification>  
        <further-classification edition="201401120251218B">B23K26/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂本剛志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荻原孝文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGIWARA, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥間惇治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUMA, JUNJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於雷射加工頭以及雷射加工裝置。雷射加工頭具備：框體；第1鏡，其反射雷射光；板型的第2鏡，其反射被第1鏡反射的雷射光的一部分，並使被第1鏡反射的雷射光的另一部分透過；聚光部，其將雷射光的一部分聚光於對象物；光檢測部，其檢測雷射光的另一部分；及測定部，其輸出測定光，經由聚光部檢測被對象物反射的測定光。第2鏡使從測定部向聚光部行進的測定光以及從聚光部向測定部行進的測定光透過。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:光纖</p>  
        <p type="p">2a:射出端部</p>  
        <p type="p">2b:主體部分</p>  
        <p type="p">2c:前端部分</p>  
        <p type="p">10A:雷射加工頭</p>  
        <p type="p">11:框體</p>  
        <p type="p">12:入射部</p>  
        <p type="p">13:光學元件部</p>  
        <p type="p">14:聚光部</p>  
        <p type="p">14a:入射瞳面</p>  
        <p type="p">18:驅動部</p>  
        <p type="p">19:電路部</p>  
        <p type="p">21:第1壁部</p>  
        <p type="p">22:第2壁部</p>  
        <p type="p">25:第5壁部</p>  
        <p type="p">25a:孔</p>  
        <p type="p">25b:安裝部</p>  
        <p type="p">25c:罩</p>  
        <p type="p">26:第6壁部</p>  
        <p type="p">26a:孔</p>  
        <p type="p">29:分隔壁部</p>  
        <p type="p">31:鏡</p>  
        <p type="p">32:衰減器</p>  
        <p type="p">33:擴束器</p>  
        <p type="p">34:鏡</p>  
        <p type="p">35:光軸調節部</p>  
        <p type="p">36:鏡</p>  
        <p type="p">37:空間光調變器</p>  
        <p type="p">37a:反射面</p>  
        <p type="p">38:成像光學系統</p>  
        <p type="p">41:第1鏡</p>  
        <p type="p">42:第2鏡</p>  
        <p type="p">43:光檢測部</p>  
        <p type="p">43a:受光面</p>  
        <p type="p">44:測定部</p>  
        <p type="p">45:觀察部</p>  
        <p type="p">46:第3鏡</p>  
        <p type="p">47:第4鏡</p>  
        <p type="p">300:光學單元</p>  
        <p type="p">351:第1轉向鏡</p>  
        <p type="p">351a:鏡</p>  
        <p type="p">351b:保持件</p>  
        <p type="p">352:第2轉向鏡</p>  
        <p type="p">352a:鏡</p>  
        <p type="p">352b:保持件</p>  
        <p type="p">400:鏡單元</p>  
        <p type="p">430:光檢測單元</p>  
        <p type="p">440:測定單元</p>  
        <p type="p">450:觀察單元</p>  
        <p type="p">451:光源</p>  
        <p type="p">452:相機</p>  
        <p type="p">L:雷射光</p>  
        <p type="p">La:一部分</p>  
        <p type="p">Lb:一部分</p>  
        <p type="p">L10:測定光</p>  
        <p type="p">L20:觀察光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1692" publication-number="202614456"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614456.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614456</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128709</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電極、二次電池、電池包及車輛</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251201B">H01M4/131</main-classification>  
        <further-classification edition="200601120251201B">H01M4/36</further-classification>  
        <further-classification edition="201001120251201B">H01M4/485</further-classification>  
        <further-classification edition="200601120251201B">H01M4/62</further-classification>  
        <further-classification edition="201001120251201B">H01M10/0525</further-classification>  
        <further-classification edition="202101120251201B">H01M50/249</further-classification>  
        <further-classification edition="201901120251201B">B60L50/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東芝股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA TOSHIBA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋圭太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, KEITARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>保科圭吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSHINA, KEIGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加納顕人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANO, KENTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村田芳明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA, YOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田康宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高見則雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAMI, NORIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供能夠實現抑制氣體產生之二次電池的電極、能夠抑制氣體產生之二次電池和電池包、以及包含此電池包的車輛。 &lt;br/&gt;　　根據實施形態，提供包含金屬氧化物之活性物質、和包含碳材料之導電劑的電極。相對於100重量份的活性物質之重量，電極中包含的碳重量為2.5重量份以下。電極的明度L*為40≦L*≦85。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電極</p>  
        <p type="p">10a:集電體</p>  
        <p type="p">10b:活性物質含有層</p>  
        <p type="p">10c:集電舌片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1693" publication-number="202614775"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614775.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614775</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128741</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含具有多個襯墊之導電觸點之記憶體裝置</chinese-title>  
        <english-title>MEMORY DEVICE INCLUDING CONDUCTIVE CONTACTS WITH MULTIPLE LINERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251216B">H10B43/35</main-classification>  
        <further-classification edition="200601120251216B">H01L21/76</further-classification>  
        <further-classification edition="200601120251216B">H01L23/522</further-classification>  
        <further-classification edition="202301120251216B">H10B43/27</further-classification>  
        <further-classification edition="202301120251216B">H10B41/27</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美光科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金恩　馬修　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING, MATTHEW J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古普塔　席德哈沙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUPTA, SIDHARTHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　泰瑞　永錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TERRY HYUNSIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一些實施例包含設備及形成該等設備之方法。該等設備之一者包含：介電材料層級，其等與導電材料層級交錯，該等導電材料層級包含一第一導電層級及一第二導電層級；一記憶體胞元串，其包含在自該第一導電層級至該第二導電層級之一方向上延伸的一柱，該第二導電層級包含一側壁；一導電觸點，其在自該第一導電層級至該第二導電層級之該方向上延伸且接觸該第二導電層級；一第一介電材料，其在該第一導電層級與該導電觸點之間，該第一介電材料具有一第一介電常數；及一第二介電材料，其在該第一介電材料與該導電觸點之間，該第二介電材料具有一第二介電常數，其中該第二介電常數大於該第一介電常數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes levels of dielectric materials interleaved with levels of conductive materials, the levels of conductive materials including a first conductive level and a second conductive level; a memory cell string including a pillar extending in a direction from the first conductive level to the second conductive level, the second conductive level including a side wall; a conductive contact extending in the direction from the first conductive level to the second conductive level and contacting the second conductive level; a first dielectric material between the first conductive level and the conductive contact, the first dielectric material having a first dielectric constant; and a second dielectric material between the first dielectric material and the conductive contact, the second dielectric material having a second dielectric constant, wherein the second dielectric constant is greater than the first dielectric constant.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:記憶體裝置</p>  
        <p type="p">201:記憶體陣列</p>  
        <p type="p">210:記憶體胞元</p>  
        <p type="p">211:記憶體胞元</p>  
        <p type="p">212:記憶體胞元</p>  
        <p type="p">213:記憶體胞元</p>  
        <p type="p">260:選擇閘極</p>  
        <p type="p">264:選擇閘極</p>  
        <p type="p">270&lt;sub&gt;N&lt;/sub&gt;:資料線</p>  
        <p type="p">290:源極</p>  
        <p type="p">454:區</p>  
        <p type="p">501:層級</p>  
        <p type="p">502:層級</p>  
        <p type="p">503:層級</p>  
        <p type="p">504:層級</p>  
        <p type="p">505:層級</p>  
        <p type="p">506:層級</p>  
        <p type="p">507:層級</p>  
        <p type="p">508:層級</p>  
        <p type="p">509:層級</p>  
        <p type="p">510:層級</p>  
        <p type="p">510i:層級</p>  
        <p type="p">511:層級</p>  
        <p type="p">512:層級</p>  
        <p type="p">521:介電材料/介電材料層級</p>  
        <p type="p">522:導電材料/導電材料層級</p>  
        <p type="p">522E:邊緣</p>  
        <p type="p">522H:導電部分</p>  
        <p type="p">522V:導電部分</p>  
        <p type="p">525:階層</p>  
        <p type="p">550:柱</p>  
        <p type="p">581:介電材料</p>  
        <p type="p">595:電路系統</p>  
        <p type="p">599:基板</p>  
        <p type="p">644:介電結構</p>  
        <p type="p">644P:介電柱</p>  
        <p type="p">655M:導電材料</p>  
        <p type="p">655W:側壁</p>  
        <p type="p">665P:導電柱</p>  
        <p type="p">665&lt;sub&gt;SGD1&lt;/sub&gt;:導電觸點</p>  
        <p type="p">665&lt;sub&gt;SGS0&lt;/sub&gt;:導電觸點</p>  
        <p type="p">665&lt;sub&gt;WL&lt;/sub&gt;:導電觸點</p>  
        <p type="p">705:介電材料</p>  
        <p type="p">721:介電結構</p>  
        <p type="p">722:參考位置</p>  
        <p type="p">730:結構</p>  
        <p type="p">731H:介電部分</p>  
        <p type="p">731V:介電部分</p>  
        <p type="p">791:導電路徑</p>  
        <p type="p">BL&lt;sub&gt;N&lt;/sub&gt;:信號</p>  
        <p type="p">SGD1&lt;sub&gt;0&lt;/sub&gt;:信號</p>  
        <p type="p">SGS0:信號</p>  
        <p type="p">SRC:信號</p>  
        <p type="p">WL0&lt;sub&gt;0&lt;/sub&gt;至WL3&lt;sub&gt;0&lt;/sub&gt;:信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1694" publication-number="202613710"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613710.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613710</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128774</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚焦粒子束誘導處理的方法、設備和電腦程式</chinese-title>  
        <english-title>METHOD, DEVICE, AND COMPUTER PROGRAM FOR FOCUSED PARTICLE-BEAM INDUCED PROCESSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251229B">G03F1/80</main-classification>  
        <further-classification edition="200601120251229B">H01L21/306</further-classification>  
        <further-classification edition="201201120251229B">G03F1/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商卡爾蔡司（上海）管理有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SHANGHAI CO. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋佳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, JIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ALEX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳振輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHENHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐魏昱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, TOBY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>關玲玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUAN, LEANN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈德勒　提姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HADLER, TIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾德　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERD, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勞斯特　托比亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAUSTER, TOBIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈克　科琳娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAACK, KORINNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏勒曼　烏特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UHLEMANN, UTE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布倫德爾　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRENDEL, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈通　帕特里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARTUNG, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格拉斯　克里斯蒂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLASS, CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗爾曼　薩巴斯汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VOLLMAR, SEBASTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽爾　派崔克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SALG, PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="17"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅斯勒　盧卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROESSLER, LUCA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="18"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯米卡拉　拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SMYKALLA, LARS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於微影的物體的聚焦粒子束誘導處理的方法、設備和電腦程式，所述方法包括提供蝕刻氣體，提供水蒸氣，以及提供氧化劑。蝕刻氣體經由第一供應裝置以第一供應壓力提供，並且水蒸氣經由第二供應裝置以第二供應壓力提供，並且第二供應壓力是第一供應壓力的至少5%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for focused particle-beam induced processing of an object for lithography comprises providing an etching gas, providing water vapor, and providing an oxidation means. The etching gas is provided via a first supply means at a first supply pressure, and the water vapor is provided via a second supply means at a second supply pressure and the second supply pressure is at least 5% of the first supply pressure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:製程</p>  
        <p type="p">110:物體</p>  
        <p type="p">111:基板主體</p>  
        <p type="p">112、113:層</p>  
        <p type="p">121:蝕刻氣體</p>  
        <p type="p">122:水蒸氣</p>  
        <p type="p">130:聚焦粒子束</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1695" publication-number="202613104"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613104.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613104</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128784</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種液晶化合物及其製備方法和應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D409/12</main-classification>  
        <further-classification edition="200601120260102B">C09K19/34</further-classification>  
        <further-classification edition="200601120260102B">G02F1/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京八億時空液晶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張嫣然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閆成洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張生林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏景景</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>殷勝強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王文源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭忠輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董姍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種液晶化合物及其製備方法和應用，屬於液晶顯示技術領域。所述液晶化合物具有如通式I所示的結構。本發明提供的液晶化合物具有較大的負介電各項異性，適中的旋轉粘度；能夠有效降低應用其的液晶顯示裝置的驅動電壓，提高液晶顯示裝置的回應速度，同時使液晶顯示裝置具有適中的光學各向異性，較高的電荷保持率。&lt;br/&gt;                       &lt;img align="absmiddle" height="117px" width="262px" file="ed10052.JPG" alt="ed10052.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;             &lt;br/&gt;                                             </p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1696" publication-number="202613269"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613269.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613269</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128799</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導電性膏、電極及電子零件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">C09J9/02</main-classification>  
        <further-classification edition="200601120251223B">C09D5/24</further-classification>  
        <further-classification edition="200601120251223B">C08L63/00</further-classification>  
        <further-classification edition="200601120251223B">C08L79/08</further-classification>  
        <further-classification edition="202201120251223B">B22F1/068</further-classification>  
        <further-classification edition="200601120251223B">H01B1/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商納美仕股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部真一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種導電性膏，即便在使用耐熱疲勞性焊料的情況下，亦能夠抑制外部電極中的裂紋的產生。一種導電性膏，包含（A）金屬粒子、以及（B）熱硬化性樹脂，在使用掃描式電子顯微鏡觀察使導電性膏在180℃、30分鐘的加熱條件下熱硬化而成的硬化物的表面時，下述式（1）所示的金屬的面積率為50%以上，使所述導電性膏在180℃、30分鐘的加熱條件下熱硬化時的硬化物的彎曲彈性模數為6.0 GPa以下。金屬的面積率（%）=（金屬所佔的面積÷測定面積）×100··（1）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1697" publication-number="202613830"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613830.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613830</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128806</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用PCIe交換器進行PCIe裝置認證的系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHODS FOR AUTHENTICATION OF PCIE DEVICES USING PCIE SWITCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G06F13/38</main-classification>  
        <further-classification edition="201301120251229B">G06F21/41</further-classification>  
        <further-classification edition="201301120251229B">G06F21/71</further-classification>  
        <further-classification edition="200601120251229B">G06F13/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商微晶片科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICROCHIP TECHNOLOGY INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦拉達拉詹　普拉桑納文卡泰尚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VARADHARAJAN, PRASANNA VENGATESHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坎農　理查</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANNON, RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高什　阿提什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GHOSH, ATISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>提亞加拉然　庫馬拉維爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THIAGARAJAN, KUMARAVEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼伽拉潘迪安　普拉加什</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANGALAPANDIAN, PRAGASH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示一種方法，包含：將複數個主機附接至一PCIe交換器中之單獨分區；在重設時將該PCIe交換器之所有下游埠內部地路由至該PCIe交換器之一內部分區；利用一嵌入式CPU偵測連接至該內部分區之所有PCIe裝置；以及，利用一控制電路對該等裝置進行認證。在認證之後，旋即將該等PCIe裝置經由單獨分區連接至多個主機，而該等主機係連接至該PCIe交換器之上游埠。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method including attaching a plurality of hosts to separate partitions in a PCIe switch, at reset, routing all downstream ports of the PCIe switch internally to an internal partition of the PCIe switch, detecting, with an embedded CPU, all PCIe devices connected to the internal partition, and authenticating the devices with a control circuit. Upon authentication, connecting the PCIe devices to hosts connected to upstream ports of the PCIe switch via separate partitions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">111:第一主機；PCIe主機；上游主機</p>  
        <p type="p">112:第二主機；PCIe主機；上游主機</p>  
        <p type="p">113:第三主機；PCIe主機；上游主機</p>  
        <p type="p">120:(第一)PCIe交換器</p>  
        <p type="p">121:第一上游埠</p>  
        <p type="p">123:第三上游埠</p>  
        <p type="p">131:第一分區</p>  
        <p type="p">132:第二分區</p>  
        <p type="p">133:第三分區</p>  
        <p type="p">134:內部分區</p>  
        <p type="p">140:控制電路</p>  
        <p type="p">142:嵌入式中央處理單元(CPU)</p>  
        <p type="p">151:第一下游埠</p>  
        <p type="p">152:第二下游埠</p>  
        <p type="p">153:第三下游埠</p>  
        <p type="p">154:第四下游埠</p>  
        <p type="p">161:(第二)PCIe交換器；PCIe裝置</p>  
        <p type="p">162:高速非揮發性記憶體(NVMe)控制器；PCIe裝置</p>  
        <p type="p">163:乙太網路控制器；PCIe裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1698" publication-number="202612836"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612836.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612836</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128837</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加工方法及加工裝置</chinese-title>  
        <english-title>PROCESSING METHOD AND PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251230B">B23K26/50</main-classification>  
        <further-classification edition="201401120251230B">B23K26/364</further-classification>  
        <further-classification edition="201401120251230B">B23K26/082</further-classification>  
        <further-classification edition="201401120251230B">B23K26/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京精密股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO SEIMITSU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相川力</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIKAWA, CHIKARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在第一步驟中，將形成光點的第一雷射照射於加工對象區域，並同時沿著加工對象區域進行掃描，其中光點在切割道上的加工對象區域的寬度方向上的長度短於加工對象區域的寬度。在第一步驟中，照射第一雷射，以使第一雷射的光點在加工對象區域的寬度方向上形成複數條掃描軌跡。在接續第一步驟的第二步驟中，將形成光點的第二雷射照射於加工對象區域，並同時沿著加工對象區域進行掃描，其中在加工對象區域的寬度方向上的長度對應於加工對象區域的寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In a first step, a first laser that forms a spot having a length in the width direction of the processing target region on a street, the length being shorter than the width of the processing target region, is irradiated onto the processing target region while scanning along the processing target region. In the first step, the first laser is irradiated such that a plurality of scanning trajectories of the first laser spot are formed in the width direction of the processing target region. In a second step following the first step, a second laser that forms a spot having a length in the width direction of the processing target region corresponding to the width of the processing target region is irradiated onto the processing target region while scanning along the processing target region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:切割道</p>  
        <p type="p">10:加工對象區域</p>  
        <p type="p">11:光點</p>  
        <p type="p">12:掃描軌跡</p>  
        <p type="p">d1:長度</p>  
        <p type="p">W:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1699" publication-number="202613035"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613035.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613035</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128842</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於合成及/或純化鉬化合物之方法及相關組合物與相關系統</chinese-title>  
        <english-title>METHODS FOR SYNTHESIZING AND/OR PURIFYING MOLYBDENUM COMPOUNDS AND RELATED COMPOSITIONS AND RELATED SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C01G39/04</main-classification>  
        <further-classification edition="200601120251229B">C01G41/04</further-classification>  
        <further-classification edition="200601120251229B">C23C16/08</further-classification>  
        <further-classification edition="200601120251229B">C23C16/30</further-classification>  
        <further-classification edition="200601120251229B">C23C16/455</further-classification>  
        <further-classification edition="200601120251229B">H01L21/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾曼特　大衛　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ERMERT, DAVID M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>漢迪克斯　布萊恩　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENDRIX, BRYAN C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於合成及/或純化鉬化合物之方法。該方法包括獲得試劑；獲得金屬三氧化物化合物；及使該試劑與該金屬三氧化物化合物充分接觸以形成包括鉬化合物之反應產物。本發明尤其提供相關組合物、相關系統及其他相關方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods for synthesizing and/or purifying molybdenum compounds are provided. A method comprises obtaining a reagent; obtaining a metal trioxide compound; and contacting the reagent and the metal trioxide compound sufficient to form a reaction product comprising a molybdenum compound. Related compositions, related systems, and other related methods are provided, among other things.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:合成方法</p>  
        <p type="p">102:獲得/步驟</p>  
        <p type="p">104:獲得/步驟</p>  
        <p type="p">106:接觸/步驟</p>  
        <p type="p">108:流動/步驟</p>  
        <p type="p">110:冷凝/步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1700" publication-number="202612990"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612990.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612990</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128850</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學容器蓋破壞性密封件、其化學容器蓋及其化學容器總成</chinese-title>  
        <english-title>CHEMICAL CONTAINER CAP BREAKSEAL, CHEMICAL CONTAINER CAP THEREOF, AND CHEMICAL CONTAINER ASSEMBLY THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">B65D41/32</main-classification>  
        <further-classification edition="200601120251218B">B65D47/36</further-classification>  
        <further-classification edition="200601120251218B">B65D85/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欣克　格里高利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HINCK, GREGORY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種破壞性密封件係用於一化學容器蓋。一種化學容器蓋包含一蓋主體及一破壞性密封件。該破壞性密封件安置於該蓋主體中之一孔之一開口中。該破壞性密封件包含在該孔上方延伸之一基座部分、自該基座部分向外延伸之一外周邊部分及自該主體部分突出之一第一環。該基座部分經構形以在一外力下破裂。在該外周邊部分向外延伸時，該外周邊部分遠離該基座部分之一平面彎曲。該環部分經構形以與一化學容器之一端口形成一徑向密封。一種總成包含具有一端口之一化學容器及在該端口上方耦合至該化學容器之一化學容器蓋。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A breakseal is for a chemical container cap. A chemical container cap includes a cap body and a breakseal. The breakseal is disposed in an opening of a hole in the cap body. The breakseal includes a base portion extending over the hole, an outer periphery portion extending outwards from the base portion, and a first ring protruding from the body portion. The base portion is configured to rupture under an external force. The outer periphery portion curves away from a plane of the base portion as the outer periphery portion extends outwards. The ring portion is configured to form a radial seal with a port of a chemical container. An assembly includes a chemical container with a port and a chemical container cap coupled to the chemical container over the port.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:化學容器總成/化學容器系統</p>  
        <p type="p">10:化學容器</p>  
        <p type="p">30:化學容器蓋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1701" publication-number="202614562"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614562.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614562</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128857</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＺＴ石英諧振器</chinese-title>  
        <english-title>ZT-QUARTZ RESONATOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H03H9/19</main-classification>  
        <further-classification edition="200601120260102B">H03H9/02</further-classification>  
        <further-classification edition="200601120260102B">H03H3/007</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商微晶體公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRO CRYSTAL SA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達拉皮薩　西爾維歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DALLA PIAZZA, SILVIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史塔伯　菲立克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STAUB, FELIX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一個態樣係關於諧振器，包括： &lt;br/&gt;-    諧振器板，其具有厚度以及表面，該表面具有最大長度及寬度，其中該諧振器板為ZT切割石英，及； &lt;br/&gt;-    框架，其包括C形部分，該C形部分包括至少部分地圍繞該諧振器板的該橫向邊緣延伸的第一臂和第二臂，且其中該第一臂和該第二臂中的每一者藉由懸臂連接到該諧振器板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One aspect of the invention is related to the resonator comprising: &lt;br/&gt;- a resonator plate having a thickness, and a surface having a maximum length and a width, wherein the resonator plate is a ZT-cut quartz, and ; - a frame comprising a C-shaped portion comprising a first arm and a second arm extending at least partially about the lateral edges of the resonator plate and wherein each of the first arm and second arm is connected to the resonator plate by means of tethers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201:諧振器板</p>  
        <p type="p">202:框架</p>  
        <p type="p">204:第一臂</p>  
        <p type="p">205:第二臂</p>  
        <p type="p">206a,206b:懸臂</p>  
        <p type="p">207:節點平面</p>  
        <p type="p">210:第一安裝焊盤</p>  
        <p type="p">211:第二安裝焊盤</p>  
        <p type="p">212:安裝部分</p>  
        <p type="p">213:凹口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1702" publication-number="202613507"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613507.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613507</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128868</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測量機械負載的裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">G01L1/04</main-classification>  
        <further-classification edition="200601120251231B">G01L3/14</further-classification>  
        <further-classification edition="200601120251231B">G01L1/14</further-classification>  
        <further-classification edition="202001120251231B">G01L5/16</further-classification>  
        <further-classification edition="200601120251231B">G01L1/24</further-classification>  
        <further-classification edition="200601120251231B">G01L1/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商諾拉機器人學有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEURA ROBOTICS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴瑞特　艾蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARRETT, EAMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>品托　法比安岡札勒茲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PINTO, FABIAN GONZALEZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亨傑　艾提安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HENGER, ETIENNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於測量機械負載(L)的裝置(10)，包括：&lt;br/&gt; 一變形結構(12，12a)，具有一負載耦合區(14)，一負載解耦區(16)，及一設於其間之彈簧區(18，18’，18’’，18’’’)，使得一機械負載(L)在彈簧區(18，18’，18’’，18’’’)變形的情況下可被導過變形結構(12，12a)，&lt;br/&gt; 一機械滑動放大器(20)，具有一滑動放大器入口(22)，一傳遞機構(24)及一滑動放大器出口(26)，其中傳遞機構(24)進一步包括一量規(28)，在滑動放大器入口(22)與滑動放大器出口(26)之間設於一可樞轉的彈簧臂(30)上，以及一感測器(40)，其中&lt;br/&gt; 活動放大器入口(22)與負載耦合區(14)耦接，滑動放大器出口(26)與負載解耦區(16)耦接，使得活動放大器入口(22)在運動學上接設成平行於彈簧區(18，18’，18’’，18’’’)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:裝置</p>  
        <p type="p">12:變形結構</p>  
        <p type="p">14:負載耦合區</p>  
        <p type="p">16:負載解耦區</p>  
        <p type="p">18:彈簧區</p>  
        <p type="p">20:滑動放大器</p>  
        <p type="p">22:滑動放大器入口</p>  
        <p type="p">24:傳遞機構</p>  
        <p type="p">26:滑動放大器出口</p>  
        <p type="p">28:量規</p>  
        <p type="p">30:彈簧臂</p>  
        <p type="p">70:評估單元</p>  
        <p type="p">90:測量系統</p>  
        <p type="p">L:負載</p>  
        <p type="p">u:滑動</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1703" publication-number="202613687"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613687.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613687</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128892</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學各向異性堆疊體及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">G02F1/1335</main-classification>  
        <further-classification edition="202301120251217B">H10K59/10</further-classification>  
        <further-classification edition="200601120251217B">G02B5/30</further-classification>  
        <further-classification edition="200601120251217B">C08J5/18</further-classification>  
        <further-classification edition="201901120251217B">B32B7/023</further-classification>  
        <further-classification edition="200601120251217B">G02B1/08</further-classification>  
        <further-classification edition="200601120251217B">C08L65/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本瑞翁股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波多野拓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATANO, TAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大里和弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSATO, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學各向異性堆疊體，其係包含第1光學各向異性層及第2光學各向異性層的光學各向異性堆疊體，其中前述第1光學各向異性層滿足下述式（1）；前述第2光學各向異性層滿足下述式（2）；前述光學各向異性堆疊體滿足下述式（3）；前述第2光學各向異性層的NZ係數NZ2滿足下述式（4）；前述第2光學各向異性層包含樹脂，前述樹脂包含含有4-乙烯基聯苯單體單元的聚合物。&lt;br/&gt; nx1＞ny1≧nz1　　　（1）&lt;br/&gt; nz2＞nx2＞ny2　　　（2）&lt;br/&gt; Re(450)＜Re(550)＜Re(650)　　　（3）&lt;br/&gt; NZ2＜－0.2　　　（4）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學各向異性堆疊體</p>  
        <p type="p">110:第1光學各向異性層</p>  
        <p type="p">120:第2光學各向異性層</p>  
        <p type="p">A&lt;sub&gt;110&lt;/sub&gt;,A&lt;sub&gt;120&lt;/sub&gt;:慢軸</p>  
        <p type="p">θ&lt;sub&gt;1-2&lt;/sub&gt;:角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1704" publication-number="202614863"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614863.zip"/> 
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      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614863</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128965</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有重新建構晶圓及藉由光罩橋接導體耦合之多光罩晶粒之邏輯最上層半導體裝置總成</chinese-title>  
        <english-title>LOGIC-UPPERMOST SEMICONDUCTOR DEVICE ASSEMBLIES WITH RECONSTITUTED WAFERS AND MULTI-RETICLE DIES COUPLED BY RETICLE-BRIDGING CONDUCTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251217B">H10D88/00</main-classification>  
        <further-classification edition="200601120251217B">H01L23/538</further-classification>  
        <further-classification edition="200601120251217B">H01L23/522</further-classification>  
        <further-classification edition="200601120251217B">H01L21/768</further-classification>  
        <further-classification edition="202501120251217B">H10D84/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美光科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布珊　巴拉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHUSHAN, BHARAT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派瑞克　庫諾　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAREKH, KUNAL R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛　阿克斯海　Ｎ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, AKSHAY N.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>扎列斯基　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZALESKI, MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾卡爾　亞明　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKEL, AMEEN D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史崔特　伯德　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STREET, BRET K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置總成包含：複數個半導體裝置堆疊，其等藉由一間隙填充物材料水平隔開，各包含藉由TSV耦合至穿過一RDL之外部封裝接觸件之多個裝置；及一裝置連接層，其形成於該等堆疊上方且包含耦合至該等TSV之第一複數個接觸件、背離該等TSV之第二複數個接觸件、將該第一複數個接觸件之接觸件耦合至該第二複數個接觸件之對應接觸件之第一複數個導體、及將該第二複數個接觸件之接觸件耦合至該第二複數個接觸件之其他接觸件之第二複數個導體。該總成進一步包含一多光罩半導體裝置，該多光罩半導體裝置在該裝置連接層上方且包含藉由沒有任何電導體之一光罩邊緣區彼此水平隔開之複數個電路區。該裝置連接層中之該第二複數個導體使該等電路區可操作地互連。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device assembly includes a plurality of stacks of semiconductor devices horizontally spaced apart by a gap fill material, each including multiple devices coupled by TSVs to external package contacts through an RDL, and a device connection layer formed over the stacks and including a first plurality of contacts coupled to the TSVs, a second plurality of contacts facing away from the TSVs, a first plurality of conductors coupling contacts of the first plurality to corresponding contacts of the second plurality, and a second plurality of conductors coupling contacts of the second plurality to other contacts of the second plurality. The assembly further includes a multi-reticle semiconductor device over the device connection layer and including a plurality of circuit regions horizontally spaced apart from one another by a reticle-edge region absent any electrical conductors. The second plurality of conductors in the device connection layer operably interconnect the circuit regions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:載體</p>  
        <p type="p">201:晶圓</p>  
        <p type="p">203:TSV</p>  
        <p type="p">204:接觸結構/經暴露接觸件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1705" publication-number="202614146"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614146.zip"/> 
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      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614146</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128970</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置及電漿處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">H01J37/32</main-classification>  
        <further-classification edition="200601120250902B">H05H1/46</further-classification>  
        <further-classification edition="200601120250902B">G05B1/06</further-classification>  
        <further-classification edition="200601120250902B">G05B15/02</further-classification>  
        <further-classification edition="200601120250902B">G05B19/404</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川那辺哲雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWANABE, TETSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">電漿處理裝置，具備：供給用以生成電漿的第一高頻電力的第一高頻電源，和對載置試料的試料台供給第二高頻電力的第二高頻電源，和控制第一高頻電源及第二高頻電源的控制部，且被連接於伺服器。藉由伺器，在作為電漿處理條件的配方被輸入時，藉由使配方所規定的參數變化，測量電漿處理裝置的感測器值，根據參數和被測量到的感測器值的時間變動的關係判定異常值，藉由配方和異常值的關係性的學習生成模型，在作成配方時，使用所生成的模型推論參數的異常，重新作成根據被推論為異常後的參數的輸入範圍而限制參數的輸入範圍的配方。藉由控制部，根據重新作成後的配方控制第一高頻電源及第二高頻電源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1706" publication-number="202614870"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614870.zip"/> 
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      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614870</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128976</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有多光罩晶粒及光罩橋接導體之邏輯最上層半導體裝置組件之板材級形成</chinese-title>  
        <english-title>PANEL-LEVEL FORMATION OF LOGIC-UPPERMOST SEMICONDUCTOR DEVICE ASSEMBLIES WITH MULTI-RETICLE DIES AND RETICLE-BRIDGING CONDUCTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251216B">H10D89/10</main-classification>  
        <further-classification edition="200601120251216B">H01L23/538</further-classification>  
        <further-classification edition="200601120251216B">H01L23/498</further-classification>  
        <further-classification edition="200601120251216B">H01L21/768</further-classification>  
        <further-classification edition="201701120251216B">H01L21/77</further-classification>  
        <further-classification edition="200601120251216B">H01L21/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美光科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布珊　巴拉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHUSHAN, BHARAT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>派瑞克　庫諾　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAREKH, KUNAL R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛　阿克斯海　Ｎ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, AKSHAY N.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾卡爾　亞明　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKEL, AMEEN D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體裝置組件包括一重佈層(RDL)，其包含具有外觸點之一外表面、具有內觸點之一內表面及將該等內觸點耦合至該等外觸點之導體。該組件進一步包含一裝置連接層，其包含具有第一接觸墊之一第一表面、具有第二接觸墊之一第二表面、將該等第一接觸墊之各者電耦合至一對應第二接觸墊之第一導電結構及將第二複數個接觸墊之一第一子集之各者電耦合至該第二複數個接觸墊之一第二子集之一對應接觸墊之第二複數個導電結構。該組件進一步包含安置於該RDL與該裝置連接層之間的半導體裝置堆疊，各堆疊位於一單片玻璃結構之一空腔中。該等堆疊透過該等堆疊中之矽穿孔(TSV)將內觸點電耦合至該等第一接觸墊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device assembly comprises an RDL including an external surface with external contacts, an internal surface with internal contacts, and conductors coupling the internal contacts to the external contacts. The assembly further includes a device connection layer having a first surface with first contact pads, a second surface with second contact pads, first conductive structures electrically coupling each of the first contact pads to a corresponding second contact pad, and a second plurality of conductive structures electrically coupling each of a first subset of the second plurality of contact pads to a corresponding contact pad of a second subset of the second plurality of contact pads. The assembly further includes stacks of semiconductor devices disposed between the RDL and the device connection layer, each stack in a cavity in a monolithic glass structure. The stacks electrically couple internal contacts to the first contact pads through TSVs in the stacks.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:玻璃基板</p>  
        <p type="p">102:堆疊</p>  
        <p type="p">105:裝置連接層</p>  
        <p type="p">110:電路區</p>  
        <p type="p">111:電路區</p>  
        <p type="p">112:光罩邊緣區</p>  
        <p type="p">114:重佈層(RDL)</p>  
        <p type="p">115:外觸點</p>  
        <p type="p">116:焊球</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1707" publication-number="202614261"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614261.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614261</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114128999</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於晶圓頂針痕檢測及定量分析之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR WAFER LIFT PIN MARK DETECTION AND UANTITATIVE ANALYSIS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L21/66</main-classification>  
        <further-classification edition="200601120260102B">G01N21/88</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>環球晶圓股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBALWAFERS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱永星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHU, YUNG HSING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鍾宇翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUNG, YU HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許哲瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHE WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡政焜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHENG KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳亮欽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIANG CHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金泰亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEHYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種電腦裝置，其包含與至少一個記憶體裝置通信之至少一個處理器。該至少一個處理器經程式化以：a)接收待分析之一物件之掃描資料；b)平滑化該掃描資料以產生一平滑化影像；c)檢測該平滑化影像中之暗像素之輪廓；d)基於暗像素之該等經檢測輪廓產生一經呈現影像；e)檢測該經呈現影像中之經呈現輪廓；f)基於該等經呈現輪廓識別痕；及g)基於該等經識別痕判定且報告痕之屬性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A computer device includes at least one processor in communication with at least one memory device. The at least one processor is programmed to: a) receive scan data of an object to be analyzed; b) smooth the scan data to create a smoothed image; c) detect contours for dark pixels in the smoothed image; d) generate a rendered image based on the detected contours for dark pixels; e) detect rendered contours in the rendered image; f) identify marks based on the rendered contours; and g) determine and report attributes of marks based on the identified marks.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1708" publication-number="202613108"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613108.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613108</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129020</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳環或雜環類衍生物及其製備方法和用途</chinese-title>  
        <english-title>CARBOCYCLIC OR HETEROCYCLIC DERIVATIVES AND METHODS OF PREPARATION AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D417/12</main-classification>  
        <further-classification edition="200601120260102B">C07D307/84</further-classification>  
        <further-classification edition="200601120260102B">C07D471/04</further-classification>  
        <further-classification edition="200601120260102B">C07D495/04</further-classification>  
        <further-classification edition="200601120260102B">C07D417/14</further-classification>  
        <further-classification edition="200601120260102B">C07D405/12</further-classification>  
        <further-classification edition="200601120260102B">C07D401/12</further-classification>  
        <further-classification edition="200601120260102B">C07D407/12</further-classification>  
        <further-classification edition="200601120260102B">C07D209/26</further-classification>  
        <further-classification edition="200601120260102B">C07D413/12</further-classification>  
        <further-classification edition="200601120260102B">C07D403/12</further-classification>  
        <further-classification edition="200601120260102B">A61K31/422</further-classification>  
        <further-classification edition="200601120260102B">A61K31/343</further-classification>  
        <further-classification edition="200601120260102B">A61K31/437</further-classification>  
        <further-classification edition="200601120260102B">A61K31/444</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4365</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4709</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4375</further-classification>  
        <further-classification edition="200601120260102B">A61K31/404</further-classification>  
        <further-classification edition="200601120260102B">A61P29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商熙源安健醫藥（北京）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRISE PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁友浪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, YOU-LANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>婁萬喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOU, WAN-QIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>應永鋮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YING, YONG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原曉輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, XIAO-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李國春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, GUO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種取代的碳環或雜環類衍生物、其製備方法及含有該衍生物或氘代衍生物的藥物組合物在醫藥上的用途。具體而言，本發明涉及一種通式(I)、(I-A)、(I-B)所示的取代的碳環或雜環類衍生物、其製備方法及其可藥用的鹽，以及它們作為TRPM3拮抗劑，在預防和/或治療TRPM3介導的相關疾病中的用途，特別是疼痛領域。其中通式(I)、(I-A)、(I-B)中的各取代基的定義與說明書中的定義相同； &lt;br/&gt;&lt;img align="absmiddle" height="354px" width="227px" file="ed10382.JPG" alt="ed10382.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="160px" width="257px" file="ed10383.JPG" alt="ed10383.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to substituted carbocyclic or heterocyclic derivatives, their preparation methods, and the use of pharmaceutical compositions containing these derivatives or their deuterated derivatives in medicine. Specifically, the invention pertains to substituted carbocyclic or heterocyclic derivatives represented by general formulas (I), (I-A), and (I-B), their preparation methods, pharmaceutically acceptable salts thereof, and their use as TRPM3 antagonists in the prevention and/or treatment of TRPM3-mediated related diseases, particularly in the field of pain. The definitions of the substituents in the general formulas (I), (I-A), and (I-B) are the same as those provided in the description: &lt;br/&gt;&lt;img align="absmiddle" height="331px" width="245px" file="ed10384.JPG" alt="ed10384.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="143px" width="247px" file="ed10385.JPG" alt="ed10385.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1709" publication-number="202613813"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613813.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613813</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129062</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在計算裝置及共用適配器之間之通訊中使用之指令</chinese-title>  
        <english-title>INSTRUCTIONS USED IN COMMUNICATIONS BETWEEN COMPUTING DEVICE(S) AND A SHARED ADAPTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">G06F9/50</main-classification>  
        <further-classification edition="200601120251224B">G06F9/54</further-classification>  
        <further-classification edition="200601120251224B">G06F3/06</further-classification>  
        <further-classification edition="200601120251224B">G06F13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萬國商業機器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布魯斯　拉特里夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RATCLIFF, BRUCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦利　史戴芬　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VALLEY, STEPHEN R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡高　丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VANGOR, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>得瑞魏　派翠西　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DRIEVER, PATRICIA G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史帝芬斯　傑瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEVENS, JERRY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔可薩　理查　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TARCZA, RICHARD P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一計算環境內實行之一指令用於對一佇列之一或多個控制項執行至少一個操作，該佇列待在該計算環境內實行之一控制程式與該計算環境之一適配器模組之間的通訊中使用。該指令之實行包括獲得該佇列之一指示，針對該佇列，待對該佇列之該一或多個控制項執行至少一個操作。對該佇列之該一或多個控制項執行至少一個操作，且提供實行該指令之一結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An instruction executing within a computing environment is used to perform at least one operation on one or more controls of a queue to be used in communications between a control program executing within the computing environment and an adapter module of the computing environment. Execution of the instruction includes obtaining an indication of the queue for which at least one operation is to be performed on the one or more controls of the queue. At least one operation is performed on the one or more controls of the queue and a result of executing the instruction is provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2200:設定控制程式佇列控制項程序</p>  
        <p type="p">2210:步驟</p>  
        <p type="p">2220:步驟</p>  
        <p type="p">2230:步驟</p>  
        <p type="p">2232:步驟</p>  
        <p type="p">2234:步驟</p>  
        <p type="p">2250:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1710" publication-number="202614226"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614226.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614226</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129094</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有金屬恢復以及鈍化的整合封裝沉積</chinese-title>  
        <english-title>INTEGRATED ENCAPSULATION DEPOSITION WITH METAL RECOVERY AND PASSIVATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">H01L21/3205</main-classification>  
        <further-classification edition="200601120251218B">C23C8/00</further-classification>  
        <further-classification edition="200601120251218B">H01L21/324</further-classification>  
        <further-classification edition="200601120251218B">C23C16/50</further-classification>  
        <further-classification edition="200601120251218B">H01L21/67</further-classification>  
        <further-classification edition="202301120251218B">H10B12/00</further-classification>  
        <further-classification edition="202301120251218B">H10B43/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　鍾汎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, JONGBEOM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格蘭特　黛維卡Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRANT, DEVIKA S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　智君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費雪伯恩　菲德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FISHBURN, FREDRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪卡拉　拉古維爾薩蒂亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKALA, RAGHUVEER SATYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種處理半導體結構的金屬層的方法包含執行金屬表面恢復製程，以從金屬層表面上移除氧化或氮化層並恢復金屬層的金屬表面，執行金屬鈍化製程以鈍化金屬層的金屬表面並形成鈍化層，並執行封裝層沉積製程以在鈍化層上沉積封裝層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of processing a metal layer for a semiconductor structure includes performing a metal surface recovery process to remove an oxidized or nitridized layer from a surface of the metal layer and recover a metal surface of the metal layer, performing a metal passivation process to passivate the metal surface of the metal layer and form a passivation layer, and performing an encapsulation layer deposition process to deposit an encapsulation layer on the passivation layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:半導體結構</p>  
        <p type="p">302:薄金屬層</p>  
        <p type="p">304:基板</p>  
        <p type="p">310:鈍化層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1711" publication-number="202614864"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614864.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614864</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129102</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於混合接合之熱結構</chinese-title>  
        <english-title>THERMAL STRUCTURES FOR HYBRID BONDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251217B">H10D88/00</main-classification>  
        <further-classification edition="200601120251217B">H01L23/538</further-classification>  
        <further-classification edition="200601120251217B">H01L23/367</further-classification>  
        <further-classification edition="200601120251217B">H01L23/528</further-classification>  
        <further-classification edition="200601120251217B">H01L21/768</further-classification>  
        <further-classification edition="202301120251217B">H10B80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美光科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布珊　巴拉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHUSHAN, BHARAT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格里芬　艾美　雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRIFFIN, AMY RAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>多卜勒　強納森　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOEBLER, JONATHAN THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>提格　安琪拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIGUE, ANGELA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛　阿克斯海　Ｎ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINGH, AKSHAY N.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述用於混合接合之熱結構之方法、系統及裝置。熱結構可形成於諸如記憶體晶粒之堆疊記憶體裝置內以增加一系統中之散熱及導熱性。舉例而言，一裝置可包含與延伸穿過一矽基板之矽穿孔(TSV)耦合的一或多個作用接觸件，其可傳輸傳訊或電力。該裝置亦可包含可未與一或多個TSV直接耦合的一或多個非作用接觸件。為增加散熱，一或多個通孔可形成於非作用接觸件與一金屬層之間。在一些實例中，可針對至少部分位於一各別金屬層導體上方之導體形成通孔。在一些情況下，一系統可包含接合裝置對之堆疊，或接合裝置三件套之堆疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods, systems, and devices for thermal structures for hybrid bonding are described. Thermal structures may be formed within stacked memory devices, such as memory dies, to increase heat dissipation and thermal conductivity in a system. For example, a device may include one or more active contacts coupled with through-silicon vias (TSVs) extending through a silicon substrate, which may transport signaling or power. The device may also include one or more inactive contacts that may not be directly coupled with one or more TSVs. To increase heat dissipation, one or more vias may be formed between non-active contacts and a metal layer. In some examples, vias may be formed for conductors that are at least partially above a respective metal layer conductor. In some cases, a system may include stacks of bonded pairs of devices, or stacks of bonded trios of devices.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:系統</p>  
        <p type="p">205-a:晶粒</p>  
        <p type="p">207:介電材料</p>  
        <p type="p">210:主機處理器</p>  
        <p type="p">212:接觸件</p>  
        <p type="p">215:控制器</p>  
        <p type="p">216:主機介面</p>  
        <p type="p">220-a-1:介面區塊</p>  
        <p type="p">220-a-2:介面區塊</p>  
        <p type="p">221-a-1:匯流排</p>  
        <p type="p">221-a-2:匯流排</p>  
        <p type="p">222-a-1:接觸件</p>  
        <p type="p">222-a-2:接觸件</p>  
        <p type="p">223-a-1:匯流排</p>  
        <p type="p">223-a-2:匯流排</p>  
        <p type="p">225:邏輯區塊</p>  
        <p type="p">230:邏輯區塊</p>  
        <p type="p">232:匯流排</p>  
        <p type="p">234:接觸件</p>  
        <p type="p">235:非揮發性儲存裝置</p>  
        <p type="p">237:感測器</p>  
        <p type="p">240-a-1:晶粒</p>  
        <p type="p">240-a-2:晶粒</p>  
        <p type="p">242:介電材料</p>  
        <p type="p">245-a-1:介面區塊</p>  
        <p type="p">245-a-2:介面區塊</p>  
        <p type="p">246-a-1:匯流排</p>  
        <p type="p">246-a-2:匯流排</p>  
        <p type="p">247-a-1:接觸件</p>  
        <p type="p">247-a-2:接觸件</p>  
        <p type="p">250-a-1:記憶體陣列</p>  
        <p type="p">250-a-2:記憶體陣列</p>  
        <p type="p">255-a-1:匯流排</p>  
        <p type="p">255-a-2:匯流排</p>  
        <p type="p">256-a-1:接觸件</p>  
        <p type="p">256-a-2:接觸件</p>  
        <p type="p">257-a-1:接觸件</p>  
        <p type="p">257-a-2:接觸件</p>  
        <p type="p">260-a-1:接觸件</p>  
        <p type="p">265-a-1:單元</p>  
        <p type="p">265-a-2:單元</p>  
        <p type="p">280-a-1:單元</p>  
        <p type="p">280-a-2:單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1712" publication-number="202613031"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613031.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613031</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129110</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含含鋰陶瓷塗層之陰極活性材料及其製造方法</chinese-title>  
        <english-title>CATHODE ACTIVE MATERIALS COMPRISING A LITHIUM-CONTAINING CERAMIC COATING AND METHODS FOR MAKING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">C01D15/02</main-classification>  
        <further-classification edition="200601120251216B">C09C1/48</further-classification>  
        <further-classification edition="201001120251216B">H01M10/0525</further-classification>  
        <further-classification edition="201001120251216B">H01M4/131</further-classification>  
        <further-classification edition="200601120251216B">C01G29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商亞比馬利股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALBEMARLE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡馨郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, SINGYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬建興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, JIANXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡培宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, PEIYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了具有含鋰陶瓷塗層之陰極活性材料及其製造方法。該方法可包括將無機酸或氧化物與包含游離鋰之陰極活性材料混合以形成混合物；及加熱該混合物以使該無機酸或氧化物與該游離鋰反應以形成含鋰陶瓷塗層，其中該含鋰陶瓷塗層塗佈該混合物內之該活性材料以形成具有含鋰陶瓷塗層之陰極活性材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are cathode active materials with a lithium-containing ceramic coating and methods of making thereof. The method can include mixing an inorganic acid or oxide with a cathode active material comprising free lithium to form a mixture; and heating the mixture to react the inorganic acid or oxide with the free lithium to form a lithium containing ceramic coating, wherein the lithium containing ceramic coating coats the active material within the mixture to form a cathode active material with a lithium-containing ceramic coating.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1713" publication-number="202614574"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614574.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614574</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129114</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用時脈訊號的數位類比轉換器及包含其的積體電路封裝</chinese-title>  
        <english-title>DIGITAL-TO-ANALOG CONVERTERS USING CLOCK SIGNALS AND INTEGRATED CIRCUIT PACKAGES CONTAINING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H03M1/66</main-classification>  
        <further-classification edition="200601120260102B">H03M1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商天空人工智能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CELESTIAL AI INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福瑞　西蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOREY, SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納古拉帕利　拉賈塞卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGULAPALLI, RAJASEKHAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米什拉　帕爾馬南德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MISHRA, PARMANAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種數位類比轉換器（DAC）裝置，包含輸入端，用於接收包含m個最高有效位元（MSB）和n個最低有效位元（LSB）的輸入訊號。裝置包含粗調DAC，其利用與參考電壓耦合的電阻器和切換器，根據m個最高有效位元產生第一電壓。脈衝產生器在耦合至預定頻率時脈訊號下產生脈衝訊號，包含：第一脈衝訊號，具有第一平均電壓；與第二脈衝訊號，具有約為第一平均電壓一半的第二電壓。精細DAC利用n個LSB在脈衝訊號中進行選擇，產生第二電壓。輸出濾波器將第一電壓與第二電壓疊加，最終產生輸出訊號。本文還描述了包含DAC裝置的積體電路及包含積體電路的封裝。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A digital-to-analogue converter (DAC) device includes an input terminal for receiving an input signal that includes m MSBs and n least significant bits LSBs. The device includes a coarse DAC that generates a first voltage from the m MSBs, utilizing resistors and switches coupled to a reference voltage. Coupled with a clock signal of a predetermined frequency, a pulse generator produces pulse signals, including a first pulse signal with a first average voltage and a second pulse signal with a second voltage approximately half of the first average voltage. A fine DAC generates a second voltage using then LSBs to select among the pulse signals. An output filter combines the first and second voltages to produce the final output signal. Integrated circuits containing DAC devices and packages containing the integrated circuits are also described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:輸入端</p>  
        <p type="p">102:粗調DAC</p>  
        <p type="p">103:精細DAC</p>  
        <p type="p">104:電壓源</p>  
        <p type="p">105:時脈</p>  
        <p type="p">106:脈衝產生器</p>  
        <p type="p">107:濾波器</p>  
        <p type="p">108:輸出模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1714" publication-number="202614457"> 
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      <tif no="1" file="TIF/202614457.zip"/> 
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      <volno>24</volno>  
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      <publication-reference> 
        <document-id> 
          <doc-number>202614457</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129136</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>二次電池、電池包以及車輛</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251103B">H01M4/131</main-classification>  
        <further-classification edition="201001120251103B">H01M4/485</further-classification>  
        <further-classification edition="201001120251103B">H01M4/505</further-classification>  
        <further-classification edition="201001120251103B">H01M4/525</further-classification>  
        <further-classification edition="201001120251103B">H01M10/05</further-classification>  
        <further-classification edition="201001120251103B">H01M10/0568</further-classification>  
        <further-classification edition="201001120251103B">H01M10/0569</further-classification>  
        <further-classification edition="202101120251103B">H01M50/178</further-classification>  
        <further-classification edition="202101120251103B">H01M50/20</further-classification>  
        <further-classification edition="202101120251103B">H01M50/249</further-classification>  
        <further-classification edition="202101120251103B">H01M50/502</further-classification>  
        <further-classification edition="202101120251103B">H01M50/529</further-classification>  
        <further-classification edition="202101120251103B">H01M50/531</further-classification>  
        <further-classification edition="202101120251103B">H01M50/543</further-classification>  
        <further-classification edition="202101120251103B">H01M50/55</further-classification>  
        <further-classification edition="202101120251103B">H01M50/553</further-classification>  
        <further-classification edition="202101120251103B">H01M50/586</further-classification>  
        <further-classification edition="202101120251103B">H01M50/593</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東芝股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA TOSHIBA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田格弥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, KAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小板橋惟子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOITABASHI, YUIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村田芳明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA, YOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田康宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>深谷太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKAYA, TARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之實施形態，係關於二次電池、電池包以及車輛。 &lt;br/&gt;　　本發明欲解決的課題在於提供具有優異充放電循環壽命的二次電池、包含該二次電池的電池包，以及包含該電池包的車輛。 &lt;br/&gt;　　根據實施形態，提供包含正極、負極和電解質的二次電池。負極係包含含鈮氧化物。在對負極表面進行硬X線光電子能譜法分析時，200eV以上215eV以下的範圍內的面積A、與680eV以上695eV以下的範圍內的面積B的比率B/A為1.1以上4.3以下。電解質係包含第1羧酸酯。第1羧酸酯的含量相對於不含鋰鹽的電解質100質量%為70質量%以上95質量%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電極群</p>  
        <p type="p">2:外裝構件</p>  
        <p type="p">6:負極端子</p>  
        <p type="p">7:正極端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1715" publication-number="202613634"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613634.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613634</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129140</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器零件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G02B6/43</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熊谷傳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAGAI, TSUTARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之一實施形態之連接器零件係將與光進行光耦合之光零件，連接於具有供搭載零件之基板面、自基板面朝與基板面交叉之方向出射光之光IC基板。連接器零件包含供固定光零件且與基板面接觸之固定部。固定部含有耐回流銲之熱之耐熱材料。固定部具有用於減小對於基板面之接觸面積之孔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:連接器零件</p>  
        <p type="p">11:固定部</p>  
        <p type="p">11b:接觸面</p>  
        <p type="p">11c:上表面</p>  
        <p type="p">11d:第1側面</p>  
        <p type="p">11f:第2側面</p>  
        <p type="p">11h:孔</p>  
        <p type="p">11j:導引孔</p>  
        <p type="p">12:鉤扣部</p>  
        <p type="p">20:光IC基板</p>  
        <p type="p">21:基板面</p>  
        <p type="p">21b:短邊</p>  
        <p type="p">21c:長邊</p>  
        <p type="p">22:零件</p>  
        <p type="p">D1:第1方向</p>  
        <p type="p">D2:第2方向</p>  
        <p type="p">D3:第3方向</p>  
        <p type="p">H:光</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1716" publication-number="202613597"> 
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        <document-id> 
          <doc-number>202613597</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129153</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於物質探測、接近度探測和手勢控制的投射介電感測器</chinese-title>  
        <english-title>PROJECTED DIELECTRIC SENSOR FOR MATTER DETECTION, PROXIMITY DETECTION, AND GESTURE CONTROL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">G01V3/08</main-classification>  
        <further-classification edition="200601120251216B">A61B5/00</further-classification>  
        <further-classification edition="200601120251216B">G01R27/26</further-classification>  
        <further-classification edition="200601120251216B">G06F3/01</further-classification>  
        <further-classification edition="200601120251216B">G06F3/044</further-classification>  
        <further-classification edition="200601120251216B">H03K17/94</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商一號工作實驗室有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STUDIO 1 LABS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈　艾德華　聶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIM, EDWARD SUP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃爾卡邁勒　馬魯萬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EL KAMEL, MAROUANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於投射介電感測器的系統和方法，該感測器包括帶有第一導電網的第一導電路徑、帶有第二導電網的第二導電路徑以及它們之間的介電間隙。介電間隙在靜止狀態下用作開路，與傳統感測器相比，提供了更寬的探測範圍。該感測器包括連接到第一導電路徑的功率驅動器和連接到第二導電路徑的收集器。第一導電網和第二導電網包括縱向並排定位的片材，從而提高了靈敏度並簡化了製造。在一個示例中，片材由至少10釐米的介電材料間隔開。該感測器可以探測離軸物體，例如導體、車輛、人類和嬰兒座椅，使其適用於各種應用，包括車輛安全、生物識別系統、手勢和空中控制以及機器學習整合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods for a projected dielectric sensor comprising a first conductive path with a first conductive mesh, a second conductive path with a second conductive mesh, and a dielectric gap between them. The dielectric gap functions as an open circuit in a resting state, offering a broader detection range compared to traditional sensors. The sensor includes a power drive connected to the first conductive path and a collector connected to the second conductive path. The first and second conductive meshes include sheets that are positioned longitudinally side-by-side, enhancing sensitivity and simplifying manufacturing. In an example, the sheets are separated by at least 10 cm of dielectric material. The sensor can detect off-axis objects such as conductors, vehicles, humans, and baby seats, making it suitable for various applications including vehicle safety, biometric systems, gesture and mid-air control, and machine learning integration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:示例系統</p>  
        <p type="p">102:電子控制器</p>  
        <p type="p">104:導電路徑</p>  
        <p type="p">106:導電路徑</p>  
        <p type="p">108:第二導電路徑/導電路徑</p>  
        <p type="p">110:第一導電路徑/導電路徑</p>  
        <p type="p">112:相交點/感測器區域/感測器位置/感測區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1717" publication-number="202614079"> 
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      <volno>24</volno>  
      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202614079</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129213</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於記憶體部件測試的主機板組件和使用主機板組件的方法</chinese-title>  
        <english-title>MOTHERBOARD ASSEMBLY FOR MEMORY COMPONENT TESTING AND METHOD USING THE MOTHERBOARD ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">G11C29/56</main-classification>  
        <further-classification edition="200601120250901B">G11C11/406</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商睿進記憶體有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTELLIGENT MEMORY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濮　必得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POECHMUELLER, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述了一種用於測試記憶體部件的主機板組件與其使用方法。主機板組件具有與至少一個記憶體通道通訊耦接的至少一個CPU，以及被編程為在存在記憶體部件故障的情況下繼續啟動的記憶體控制器或BIOS。當檢測到故障時，記憶體控制器或BIOS會跳過讀取/寫入訓練程式，並使用之前成功啟動程式中PHY寄存器的預設值來繼續當前的啟動而不斷電。記憶體控制器或BIOS還被編程為提供可調節的數據保持時間設置和可調節的速度設置而無需重新啟動或斷電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A motherboard assembly for memory component testing and a method using the motherboard assembly are described. The motherboard assembly has at least one CPU communicatively coupled with at least one memory channel, and a memory controller or BIOS programmed to continue booting in the presence of memory component failures. The memory controller or BIOS skips read/write training procedures when a failure is detected, and uses preset values for PHY registers from a previous successful booting procedure to continue the current booting without powering off. The memory controller or BIOS is also programmed to provide adjustable retention settings and adjustable speed settings without rebooting or powering off.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:框架</p>  
        <p type="p">711:上主機板</p>  
        <p type="p">712:下主機板</p>  
        <p type="p">713:支撐連接器</p>  
        <p type="p">714:連接柱</p>  
        <p type="p">715:間隙</p>  
        <p type="p">721:CPU</p>  
        <p type="p">722:連接器</p>  
        <p type="p">723A:記憶體部件插孔</p>  
        <p type="p">800:組裝測試儀系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1718" publication-number="202613970"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613970.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613970</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129318</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>荷電粒子束裝置及立體形狀推定方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120250910B">G06T7/60</main-classification>  
        <further-classification edition="202201120250910B">G06V10/44</further-classification>  
        <further-classification edition="201801120250910B">G01N23/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玉置央和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMAKI, HIROKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之荷電粒子束裝置一面分別改變荷電粒子光學系統之焦點位置及載台119對試料130之保持高度之至少任一者、一面取得複數個觀察圖像，就構成觀察圖像之複數個局部區域像各者，算出對應於荷電粒子光學系統之焦點位置與試料之沿荷電粒子光學系統之光軸方向之偏移而變化之評估值，求得由與觀察圖像之座標對應之軸、及與荷電粒子光學系統之焦點位置或載台對前述試料之保持高度對應之軸定義之三維空間內之評估值之三維分佈，根據評估值之三維分佈而推定試料之立體形狀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101~S106:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1719" publication-number="202613891"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613891.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613891</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129362</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>量子位元包含裝置及其製造方法</chinese-title>  
        <english-title>QUBIT CONTAINING DEVICES AND METHODS FOR MAKING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251224B">G06N10/40</main-classification>  
        <further-classification edition="202501120251224B">H10D62/81</further-classification>  
        <further-classification edition="200601120251224B">H01L21/265</further-classification>  
        <further-classification edition="201101120251224B">B82Y10/00</further-classification>  
        <further-classification edition="200601120251224B">G02B6/26</further-classification>  
        <further-classification edition="200601120251224B">C30B29/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商光子公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHOTONIC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥格里　伊凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACQUARRIE, EVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽門斯　史蒂芬尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMMONS, STEPHANIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置具有包括諸如矽之一晶體材料之第一、第二及第三層之一基板。該第二層位於該第一層與該第三層之間。一輻射損傷中心(RDC)位於該第二層中。在一些實施例中，該RDC光學耦合至一光學諧振器。該第二層具有與該第一及第三層之同位素組成不同之一同位素組成。該RDC可藉由離子植入來形成。由於取決於該RDC之環境之同位素組成而變動之該RDC之特性，該RDC可獨立於位於該第二層外部之任何RDC定址。亦描述用於製造及測試裝置之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device has a substrate comprising first, second and third layers of a crystalline material such as silicon. The second layer is between the first and third layers. A radiation damage centre (RDC) is located in the second layer. In some embodiments the RDC is optically coupled to an optical resonator The second layer has an isotopic composition that is different from that of the first and third layers. The RDC may be formed by ion implantation. The RDC may be addressable independently of any RDCs located outside of the second layer as a result of characteristics of the RDC that vary depending on the isotopic composition of the environment of the RDC. Methods for making and testing devices are also described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:裝置</p>  
        <p type="p">22:基板</p>  
        <p type="p">22A:第一層</p>  
        <p type="p">22B:第二層</p>  
        <p type="p">22C:第三層</p>  
        <p type="p">24:輻射損傷中心(RDC)</p>  
        <p type="p">26:結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1720" publication-number="202613213"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613213.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613213</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129380</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連續纖維強化熱塑性樹脂基材及其製造方法</chinese-title>  
        <english-title>CONTINUOUS FIBER REINFORCED THERMOPLASTIC RESIN MATRIX AND FOR PRODUCING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">C08J5/06</main-classification>  
        <further-classification edition="200601120251218B">C08J5/18</further-classification>  
        <further-classification edition="200601120251218B">B32B27/34</further-classification>  
        <further-classification edition="200601120251218B">B32B27/04</further-classification>  
        <further-classification edition="200601120251218B">B29C70/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＵＢＥ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UBE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人福井大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIVERSITY OF FUKUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成松明哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARIMATSU, AKISATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下敦志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>植松英之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEMATSU, HIDEYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田上秀一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANOUE, SHUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畠山広大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATAKEYAMA, KODAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種連續纖維強化熱塑性樹脂基材，其可依聚醯胺樹脂之種類，相對地提高連續纖維強化熱塑性樹脂基材之拉伸強度、彎曲強度等機械物性。 &lt;br/&gt;一種連續纖維強化熱塑性樹脂基材，其係包含熱塑性樹脂及連續強化纖維者，其中，前述連續強化纖維配向於一方向，前述熱塑性樹脂含浸於前述連續強化纖維之纖維間，前述熱塑性樹脂包含聚醯胺樹脂，前述聚醯胺樹脂包含選自由內醯胺及胺基羧酸所成群組中之至少一種單體的縮聚物，且前述聚醯胺樹脂滿足下述（a）條件。（a）當末端之胺基濃度設為A μmol/g，末端之羧基濃度設為C μmol/g時，A/（A+C）之值超過0.50。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a continuous fiber reinforced thermoplastic resin matrix which can depending on the type of polyamide resin used, relatively enhance the mechanical physical properties of the continuous fiber reinforced thermoplastic resin matrix, such as tensile strength and flexural strength. &lt;br/&gt;The continuous fiber reinforced thermoplastic resin matrix comprising a thermoplastic resin and continuous reinforcing fibers, wherein the continuous reinforcing fibers are oriented in a single direction, wherein the thermoplastic resin is impregnated between the continuous reinforcing fibers, the thermoplastic resin comprises a polyamide resin, the polyamide resin comprises a polycondensation of at least one monomer selected from the group consisting of lactams and amine carboxylic acids, and the polyamide resin satisfies the following condition (a): (a) When the concentration of terminal amino groups is set to A μmol/g and the concentration of terminal carboxyl groups is set to C μmol/g, the value of A/(A+C) exceeds 0.50.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:連續纖維強化熱塑性樹脂基材製造裝置</p>  
        <p type="p">2:加熱輥</p>  
        <p type="p">3:冷卻輥</p>  
        <p type="p">4:無端皮帶</p>  
        <p type="p">5:輸送輥</p>  
        <p type="p">6:捲線軸</p>  
        <p type="p">F:連續強化纖維</p>  
        <p type="p">F0:連續強化纖維束</p>  
        <p type="p">R0:熱塑性樹脂膜</p>  
        <p type="p">S:連續纖維強化熱塑性樹脂基材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1721" publication-number="202614131"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614131.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614131</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129406</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多射束描繪方法及多射束描繪裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01J37/304</main-classification>  
        <further-classification edition="200601120251226B">H01J37/30</further-classification>  
        <further-classification edition="200601120251226B">H01J37/244</further-classification>  
        <further-classification edition="200601120251226B">G03F7/20</further-classification>  
        <further-classification edition="200601120251226B">H01J37/317</further-classification>  
        <further-classification edition="200601120251226B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商紐富來科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NUFLARE TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤悠佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相原一生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIBARA, ISSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種根據電流密度分布的變化而進行射束調整，以抑制描繪精度的降低之多射束描繪方法及多射束描繪裝置。 &lt;br/&gt;　　按照本發明的一態樣之多射束描繪方法，具備：取得運用從帶電粒子源放出的帶電粒子束而形成的多射束的電流密度分布之工序；將取得的前述電流密度分布和預先設定好的電流密度分布的理想形狀予以比較，當在規定的位置的差分比閾值還大的情形下，進行前述多射束的射束調整之工序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:電子光學鏡筒</p>  
        <p type="p">4:電子源</p>  
        <p type="p">6:照明透鏡</p>  
        <p type="p">8:成形孔徑陣列基板</p>  
        <p type="p">10:遮沒孔徑陣列基板</p>  
        <p type="p">12:縮小透鏡</p>  
        <p type="p">14:限制孔徑構件</p>  
        <p type="p">16:對物透鏡</p>  
        <p type="p">17:偏向器</p>  
        <p type="p">20:描繪室</p>  
        <p type="p">22:XY平台</p>  
        <p type="p">24:基板</p>  
        <p type="p">30:電子束</p>  
        <p type="p">30a~30e:多射束</p>  
        <p type="p">32:控制計算機</p>  
        <p type="p">34:偏向控制電路</p>  
        <p type="p">36:透鏡控制電路</p>  
        <p type="p">40:電流檢測器</p>  
        <p type="p">60:描繪資料處理部</p>  
        <p type="p">61:描繪控制部</p>  
        <p type="p">62:特徵量算出部</p>  
        <p type="p">63:判定部</p>  
        <p type="p">64:射束限制部</p>  
        <p type="p">65:預測部</p>  
        <p type="p">C:控制部</p>  
        <p type="p">W:描繪部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1722" publication-number="202613713"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613713.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613713</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129445</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢查裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120250826B">G03F1/84</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸本良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIMOTO, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提供一種可對被檢查物照射更均勻的光的檢查裝置。檢查裝置1包括：光源11、第一光導12、均化器14、傅立葉變換透鏡部13、照明光學系統17、測定台、成像光學系統21、以及圖像感測器25。光源11射出光L1。第一光導12具有供來自光源11的光L1入射的第一入射端12a及第一出射端12b。傅立葉變換透鏡部13設置在第一光導12的第一出射端12b與均化器14之間。照明光學系統17設置在均化器14的後級。測定台設置在照明光學系統17的後級，且供被檢查物配置。來自被檢查物的光L1入射到成像光學系統21。圖像感測器25接收來自成像光學系統21的光並生成拍攝圖像數據IM1。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:檢查裝置</p>  
        <p type="p">10:照明部</p>  
        <p type="p">11:光源</p>  
        <p type="p">12:第一光導</p>  
        <p type="p">12a:第一入射端</p>  
        <p type="p">12b:第一出射端</p>  
        <p type="p">12c:第一反射側面</p>  
        <p type="p">13:傅立葉變換透鏡部</p>  
        <p type="p">14:均化器</p>  
        <p type="p">15:導光構件</p>  
        <p type="p">15a:第二入射端</p>  
        <p type="p">15b:第二出射端</p>  
        <p type="p">15c:第二反射側面</p>  
        <p type="p">17:照明光學系統</p>  
        <p type="p">19:可動照明部</p>  
        <p type="p">20:檢測部</p>  
        <p type="p">21:成像光學系統</p>  
        <p type="p">22:物鏡</p>  
        <p type="p">23:孔徑光圈</p>  
        <p type="p">24:成像透鏡</p>  
        <p type="p">25:圖像感測器</p>  
        <p type="p">40:移動驅動部</p>  
        <p type="p">50:控制部</p>  
        <p type="p">60:升降驅動部</p>  
        <p type="p">80:光罩</p>  
        <p type="p">111、131:透鏡</p>  
        <p type="p">171:聚光透鏡</p>  
        <p type="p">172:視野光圈</p>  
        <p type="p">173:中繼透鏡</p>  
        <p type="p">174:孔徑光圈</p>  
        <p type="p">175:聚束透鏡</p>  
        <p type="p">IM1:拍攝圖像數據</p>  
        <p type="p">L1:光</p>  
        <p type="p">X、Y、Z:座標軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1723" publication-number="202612745"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612745.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612745</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129494</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>除臭系統、除臭控制方法以及程式</chinese-title>  
        <english-title>（無）</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">A61L9/01</main-classification>  
        <further-classification edition="200601120251231B">A61L9/015</further-classification>  
        <further-classification edition="200601120251231B">A61L9/22</further-classification>  
        <further-classification edition="200601120251231B">B01D53/38</further-classification>  
        <further-classification edition="200601120251231B">B01D53/74</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商夏普股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARP KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊豆晃一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IZU, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田憲司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上林弘和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMBAYASHI, HIROKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊川彰仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUGAWA, AKIHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鬼木涉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONIKI, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朝倉俊哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAKURA, SHUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松山貴一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUYAMA, KIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>增田宗一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, SOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供對用戶而言能夠進行更優選的除臭動作的除臭系統、除臭控制方法以及程式。除臭系統包括獲取處理部（31）以及控制處理部（33）。獲取處理部（31）獲取與在對象空間中檢測的氣味的種類相關的氣味資訊。控制處理部（33）根據氣味資訊來控制除臭部（2）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:除臭部</p>  
        <p type="p">3:控制部</p>  
        <p type="p">4:伺服器裝置</p>  
        <p type="p">5:終端裝置</p>  
        <p type="p">6:電氣設備</p>  
        <p type="p">10:空氣淨化器(除臭系統)</p>  
        <p type="p">11:氣味檢測部</p>  
        <p type="p">12:顯示部</p>  
        <p type="p">13:聲音輸出部</p>  
        <p type="p">14:操作部</p>  
        <p type="p">15:通信部</p>  
        <p type="p">21:除臭過濾器</p>  
        <p type="p">22:氣流發生部</p>  
        <p type="p">23:切換部</p>  
        <p type="p">31:獲取處理部</p>  
        <p type="p">32:分析處理部</p>  
        <p type="p">33:控制處理部</p>  
        <p type="p">34:變更處理部</p>  
        <p type="p">35:提示處理部</p>  
        <p type="p">36:推測處理部</p>  
        <p type="p">37:協作處理部</p>  
        <p type="p">38:通知處理部</p>  
        <p type="p">39:存儲部</p>  
        <p type="p">NT1:通信網(網路)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1724" publication-number="202612746"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612746.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612746</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129495</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>除臭系統、除臭控制方法以及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">A61L9/01</main-classification>  
        <further-classification edition="200601120251231B">A61L9/015</further-classification>  
        <further-classification edition="200601120251231B">A61L9/22</further-classification>  
        <further-classification edition="200601120251231B">B01D53/58</further-classification>  
        <further-classification edition="200601120251231B">B01D53/74</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商夏普股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARP KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊豆晃一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IZU, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田憲司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上林弘和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMBAYASHI, HIROKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊川彰仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUGAWA, AKIHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鬼木涉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONIKI, WATARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朝倉俊哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAKURA, SHUNYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松山貴一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUYAMA, KIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>增田宗一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, SOICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供對用戶而言能夠進行更優選的除臭動作的除臭系統、除臭控制方法以及程式。除臭系統包括獲取處理部（31）以及推測處理部（36）。獲取處理部（31）獲取與在對象空間中檢測的氣味的種類相關的氣味資訊。推測處理部至少基於所述氣味資訊來推測氣味的原因。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:除臭部</p>  
        <p type="p">3:控制部</p>  
        <p type="p">4:伺服器裝置</p>  
        <p type="p">5:終端裝置</p>  
        <p type="p">6:電氣設備(外部裝置、監視對象設備)</p>  
        <p type="p">10:空氣淨化器(除臭系統)</p>  
        <p type="p">11:氣味檢測部</p>  
        <p type="p">12:顯示部</p>  
        <p type="p">13:聲音輸出部</p>  
        <p type="p">14:操作部</p>  
        <p type="p">15:通信部</p>  
        <p type="p">21:除臭過濾器</p>  
        <p type="p">22:氣流發生部</p>  
        <p type="p">23:切換部</p>  
        <p type="p">31:獲取處理部</p>  
        <p type="p">32:分析處理部</p>  
        <p type="p">33:控制處理部</p>  
        <p type="p">34:變更處理部</p>  
        <p type="p">35:提示處理部</p>  
        <p type="p">36:推測處理部</p>  
        <p type="p">37:協作處理部</p>  
        <p type="p">38:通知處理部</p>  
        <p type="p">39:存儲部</p>  
        <p type="p">NT1:通信網(網路)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1725" publication-number="202614111"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614111.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614111</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129508</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶指示電路的熱保護金屬氧化物變阻器</chinese-title>  
        <english-title>THERMALLY PROTECTED METAL OXIDE VARISTOR WITH INDICATOR CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H01H37/08</main-classification>  
        <further-classification edition="200601120251103B">H01H37/76</further-classification>  
        <further-classification edition="200601120251103B">H01C1/04</further-classification>  
        <further-classification edition="200601120251103B">H01C7/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞令特電子有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN LITTELFUSE ELECTRONICS, CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐海浪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, HAILANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭演敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, YANJING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭德報</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, BEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及帶指示電路的熱保護金屬氧化物變阻器。一種熱保護裝置可以包括殼體內的變阻器主體，該變阻器主體包括沿第一側設置的熱電極。熱保護裝置還可以包括連接到第一側的第一端子以及連接到熱電極的第二側的第二端子。熱保護裝置還可以包括指示電路，該指示電路包括沿變阻器主體的第一側設置的第一引腳和第二引腳，其中第二引腳被連接到滑塊，其中熱事件導致滑塊在第一位置與第二位置之間移動，並且其中當滑塊處於第二位置時，第一引腳與第二引腳彼此分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A thermal protection device may include a varistor body within a housing, the varistor body comprising a thermal electrode disposed along a first side. The thermal protection device may further include a first terminal connected to the first side and a second terminal connected to a second side of the thermal electrode. The thermal protection device may further include an indicator circuit comprising a first pin and a second pin disposed along the first side of the varistor body, wherein the second pin is connected to a slider, wherein a thermal event causes movement of the slider between a first position and a second position, and wherein when the slider is in the second position, the first pin and the second pin separate from one another.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:金屬氧化物變阻器(MOV)裝置、裝置</p>  
        <p type="p">102:殼體</p>  
        <p type="p">106:變阻器主體</p>  
        <p type="p">108:熱電極</p>  
        <p type="p">120:第一端子</p>  
        <p type="p">122:第二端子</p>  
        <p type="p">124:基部</p>  
        <p type="p">125:中心部分</p>  
        <p type="p">126:內壁</p>  
        <p type="p">127:周壁</p>  
        <p type="p">128:內部</p>  
        <p type="p">130、154、158:第一端</p>  
        <p type="p">132:滑塊</p>  
        <p type="p">136:指示電路</p>  
        <p type="p">138:第一引腳</p>  
        <p type="p">140:第二引腳</p>  
        <p type="p">142:彈簧體</p>  
        <p type="p">144:開口</p>  
        <p type="p">148、160、162:第二端</p>  
        <p type="p">150:突起</p>  
        <p type="p">152:主體</p>  
        <p type="p">166:盤繞部分</p>  
        <p type="p">170:支柱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1726" publication-number="202613692"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613692.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613692</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129529</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於微影設備和/或光罩測試設備的快門裝置，以及微影設備/光罩測試設備</chinese-title>  
        <english-title>SHUTTER APPARATUS FOR A LITHOGRAPHY APPARATUS AND/OR A MASK TEST APPARATUS AND LITHOGRAPHY APPARATUS/MASK TEST APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251222B">G03B9/10</main-classification>  
        <further-classification edition="200601120251222B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>恩斯泰勒　約拿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IRNSTETTER, JOHANN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於微影設備(1)和/或光罩測試設備(1)的快門裝置(100)，具有：&lt;br/&gt; 一快門片(106)，係沿一旋轉軸(A)可旋轉地安裝，其具有與該旋轉軸(A)分隔開的至少一個開口(108)，且供用於傳輸該微影設備(1)和/或該光罩測試設備(1)的工作光(16)，以及&lt;br/&gt; 一磁性驅動與安裝裝置(110)，藉其該快門片(106)係沿該旋轉軸(A)可旋轉地安裝，其係配置以沿該旋轉軸(A)旋轉地驅動該快門片(106)，其中該快門片(106)與該磁性驅動與安裝裝置(110)係配置以配置在該微影設備(1)和/或該光罩測試設備(1)的一真空殼體(200)內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Shutter apparatus (100) for a lithography apparatus (1) and/or mask test apparatus (1), having&lt;br/&gt; a shutter disc (106) mounted rotatably about a rotation axis (A) with at least one opening (108) spaced apart from the rotation axis (A) and serving for transmitting operating light (16) of the lithography apparatus (1) and/or mask test apparatus (1), and &lt;br/&gt; a magnetic drive and mounting device (110), with the aid of which the shutter disc (106) is mounted rotatably about the rotation axis (A) and which is configured for rotationally driving the shutter disc (106) about the rotation axis (A), wherein the shutter disc (106) and the drive and mounting device (110) are configured to be arranged within a vacuum housing (200) of the lithography apparatus (1) and/or mask test apparatus (1).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">16:EUV輻射/照明輻射/使用輻射/工作光</p>  
        <p type="p">100:快門裝置</p>  
        <p type="p">102:快門元件</p>  
        <p type="p">104:計算裝置</p>  
        <p type="p">106:快門片</p>  
        <p type="p">108:開口</p>  
        <p type="p">110:磁性驅動與安裝裝置/驅動與安裝裝置</p>  
        <p type="p">112:定子</p>  
        <p type="p">114:內邊緣</p>  
        <p type="p">116:磁體</p>  
        <p type="p">118:磁線圈</p>  
        <p type="p">119:間隙</p>  
        <p type="p">120:切口</p>  
        <p type="p">121:導線繞組</p>  
        <p type="p">123:導線</p>  
        <p type="p">125:絕緣材料</p>  
        <p type="p">142:封閉迴路控制裝置</p>  
        <p type="p">200:真空殼體</p>  
        <p type="p">A:旋轉軸</p>  
        <p type="p">B:磁力</p>  
        <p type="p">C:間隙寬度</p>  
        <p type="p">V:真空</p>  
        <p type="p">R:持續時間</p>  
        <p type="p">S&lt;sub&gt;A&lt;/sub&gt;:感測器資料</p>  
        <p type="p">S&lt;sub&gt;B&lt;/sub&gt;:控制訊號</p>  
        <p type="p">φ:旋轉角</p>  
        <p type="p">ω:角頻率</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1727" publication-number="202613192"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613192.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613192</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129541</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組成物、圖案形成方法和物品製造方法</chinese-title>  
        <english-title>COMPOSITION, PATTERN FORMING METHOD, AND ARTICLE MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">C08F2/48</main-classification>  
        <further-classification edition="200601120251230B">G03F7/075</further-classification>  
        <further-classification edition="200601120251230B">D06M13/148</further-classification>  
        <further-classification edition="200601120251230B">C09D183/06</further-classification>  
        <further-classification edition="200601120251230B">C08L83/07</further-classification>  
        <further-classification edition="200601120251230B">G02B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今村成希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAMURA, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤俊樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>城野潤平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRONO, JUMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種旋轉塗佈用組成物，其包括：至少包含矽原子的可聚合化合物和溶劑，其中通過從組成物中移除溶劑而得到的材料的黏度為10mPa·s以上且1,000mPa·s以下，通過從組成物中移除溶劑而得到的材料中的矽原子的含量為30重量%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composition for spin coating contains a polymerizable compound containing at least silicon atoms, and a solvent, wherein a viscosity of a material obtained by removing the solvent from the composition is not less than 10 mPa·s and not more than 1,000 mPa·s, and a content of the silicon atoms in the material obtained by removing the solvent from the composition is not less than 30 wt%.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">1a:表面</p>  
        <p type="p">2:凹凸圖案</p>  
        <p type="p">3:殘留膜</p>  
        <p type="p">4:反轉層</p>  
        <p type="p">5:過剩反轉層</p>  
        <p type="p">11:固化膜</p>  
        <p type="p">12:暴露凸部</p>  
        <p type="p">12a:頂面</p>  
        <p type="p">13:凹部</p>  
        <p type="p">14:反轉圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1728" publication-number="202614453"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614453.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614453</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129567</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體材料、記憶體裝置及包含該記憶體裝置之電子設備</chinese-title>  
        <english-title>MEMORY MATERIAL, MEMORY DEVICE, AND ELECTRONIC APPARATUS COMPRISING THE MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251219B">H01L25/18</main-classification>  
        <further-classification edition="200601120251219B">G11C11/34</further-classification>  
        <further-classification edition="200601120251219B">G11C7/18</further-classification>  
        <further-classification edition="200601120251219B">G11C8/14</further-classification>  
        <further-classification edition="200601120251219B">G11C11/56</further-classification>  
        <further-classification edition="200601120251219B">C01B19/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴鍾峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JONGBONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康永宰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, YOUNGJAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>具本原</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOO, BONWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁基延</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, KIYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔旻雨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, MINWOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>咸龍男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAM, YONGNAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種具有自選擇特性之記憶體裝置及一種包括該記憶體裝置之電子設備。該具有自選擇特性之記憶體裝置包括複數個記憶體胞元，該等記憶體胞元中之各者配置於第一佈線與第二佈線之間、位於第一佈線與第二佈線彼此相交之一相交點處，且該等記憶體胞元中之各者包括一記憶體材料層，該記憶體材料層具有一臨限電壓取決於一施加電壓而移位之一特性。該記憶體材料層具有由A(x)D(y)M(z)表示之一組成物，其中A包括鍺(Ge)，D包括砷(As)且M包括碲(Te)，並且x可滿足0＜x＜0.45，z可滿足0.45＜z＜1且y=1-(x+z)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory device having self-selecting characteristics and an electronic apparatus including the same are disclosed. The memory device having self-selection characteristics includes a plurality of memory cells, each of the memory cells arranged between the first wiring and the second wiring at an intersection of first and second wirings that intersect each other, and including a memory material layer having a characteristic in which a threshold voltage is shifted according to an applied voltage. The memory material layer has a composition represented by A(x)D(y)M(z), wherein A includes germanium (Ge), D includes arsenic (As), and M includes tellurium (Te), and x may satisfy 0＜x＜0.45, z may satisfy 0.45＜z＜1, and y=1-(x+z).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第一單元記憶體裝置/記憶體胞元/單元記憶體胞元</p>  
        <p type="p">110:第一電極層/第一電極</p>  
        <p type="p">120:記憶體材料層</p>  
        <p type="p">130:第二電極層</p>  
        <p type="p">L1:第一佈線</p>  
        <p type="p">L2:第二佈線</p>  
        <p type="p">x,y,z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1729" publication-number="202614561"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614561.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614561</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129598</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＢＡＷ諧振器、ＢＡＷ裝置和電子設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H03H9/17</main-classification>  
        <further-classification edition="200601120251217B">H03H9/54</further-classification>  
        <further-classification edition="202301120251217B">H10N30/05</further-classification>  
        <further-classification edition="202301120251217B">H10N30/20</further-classification>  
        <further-classification edition="202301120251217B">H10N30/30</further-classification>  
        <further-classification edition="200601120251217B">G01L1/16</further-classification>  
        <further-classification edition="200601120251217B">G01P15/09</further-classification>  
        <further-classification edition="200601120251217B">G01N29/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石田守</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIDA, MAMORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂田浩一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKATA, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">依據本發明的BAW諧振器包括：在支撐基材上依次層疊的聲鏡層、第一電極、壓電層和第二電極；以及俯視圖中的、前述壓電層中由前述第一電極與前述第二電極夾著的使前述壓電層諧振的活性區域、以及除前述活性區域以外的非活性區域，前述壓電層的泊松比為1/3以上，前述聲鏡層是由一組以上的高聲學阻抗層和低聲學阻抗層交替地層疊而成的多層膜，前述高聲學阻抗層配置在比與前述活性區域對應的位置靠內側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:BAW裝置</p>  
        <p type="p">10:支撐基材</p>  
        <p type="p">20A:BAW諧振器</p>  
        <p type="p">21:聲鏡層</p>  
        <p type="p">22:第一電極</p>  
        <p type="p">23:壓電層</p>  
        <p type="p">24:第二電極</p>  
        <p type="p">212:低聲學阻抗層</p>  
        <p type="p">A1:活性區域</p>  
        <p type="p">A2:非活性區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1730" publication-number="202614542"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614542.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614542</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129626</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有分散式致動器之處理裝置及用於控制分散式致動器之方法</chinese-title>  
        <english-title>PROCESS APPARATUS WITH DISTRIBUTED ACTUATORS AND METHOD FOR CONTROLLING DISTRIBUTED ACTUATORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H02K41/03</main-classification>  
        <further-classification edition="201601120251217B">H02P25/06</further-classification>  
        <further-classification edition="201601120251217B">H02P6/00</further-classification>  
        <further-classification edition="200601120251217B">H02N15/00</further-classification>  
        <further-classification edition="200601120251217B">G05B19/418</further-classification>  
        <further-classification edition="200601120251217B">H01L21/677</further-classification>  
        <further-classification edition="200601120251217B">B65G49/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商布魯克斯自動機械美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROOKS AUTOMATION US, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>摩拉　傑羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOURA, JAIRO TERRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾　文森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSANG, VINCENT W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一線性電機器包括：一框架；配置在多於一組中的電磁體之一陣列；一反應平台，其中該等電磁體之激發產生抵抗該至少一個反應平台之懸浮及推進力；及一控制器系統，其具有一分散式控制組態以依序地激發該等電磁體以使得各反應平台係以至少四度自由度被懸浮並推進。  各別線圈控制器從該等多於一組電磁體被可選擇地耦接至多組之電磁體，該等多組之各者係在電磁體之該陣列中與該等多組之各其他組不同的對應預定位置處，該各別線圈控制器在一時刻被可變地耦接至一組且從在對應於該一組之一預定位置處的該一組切換至在一不同預定位置處的一不同組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A linear electrical machine includes: a frame; an array of electromagnets arranged in more than one sets; a reaction platen where excitation of the electromagnets generates levitation and propulsion forces against the at least one reaction platen; and a controller system that has a distributed control configuration to sequentially excite the electromagnets so that each reaction platen is levitated and propelled with at least four degrees of freedom. Each respective coil controller is selectably coupled to electromagnets of multiple sets from the more than one set of electromagnets, each of the multiple sets being at different corresponding predetermined locations in the array of electromagnets from each other set of the multiple sets, the respective coil controller being variably coupled to one set at a time and switched from the one set, at a predetermined location corresponding to the one set, to a different set at a different predetermined location.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基材處理裝置</p>  
        <p type="p">110:基材處置器</p>  
        <p type="p">115:基材處置器服務鎖</p>  
        <p type="p">116:負載鎖</p>  
        <p type="p">118:轉移室</p>  
        <p type="p">120:程序模組</p>  
        <p type="p">177:基材處置器位置感測器</p>  
        <p type="p">199:控制器</p>  
        <p type="p">700:線性電機器</p>  
        <p type="p">1510:反應平台</p>  
        <p type="p">1550:線性軌道</p>  
        <p type="p">1700:電磁體</p>  
        <p type="p">4444:基材對準器</p>  
        <p type="p">110A:基材處置器</p>  
        <p type="p">110B:基材處置器</p>  
        <p type="p">110C:車</p>  
        <p type="p">110E:端效應器</p>  
        <p type="p">110TA:轉移臂</p>  
        <p type="p">118M:框架</p>  
        <p type="p">1700A:電磁體</p>  
        <p type="p">1700n:電磁體</p>  
        <p type="p">177D:感應感測器</p>  
        <p type="p">177S:距離感測器</p>  
        <p type="p">177V:視覺感測器</p>  
        <p type="p">199D:線圈控制器</p>  
        <p type="p">199M:主控制器</p>  
        <p type="p">199S:動態切換板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1731" publication-number="202612875"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612875.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612875</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129627</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>動態級檢查系統、包括該系統的基板輸送設備以及用於其之方法</chinese-title>  
        <english-title>DYNAMIC LEVEL CHECK SYSTEM, SUBSTRATE TRANSPORT APPARATUS INCLUDING THE SYSTEM, AND METHOD THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">B25J19/02</main-classification>  
        <further-classification edition="200601120251217B">B25J9/16</further-classification>  
        <further-classification edition="200601120251217B">H01L21/677</further-classification>  
        <further-classification edition="200601120251217B">G01C9/00</further-classification>  
        <further-classification edition="200601120251217B">B25J13/08</further-classification>  
        <further-classification edition="200601120251217B">G05B11/32</further-classification>  
        <further-classification edition="200601120251217B">B65G49/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商布魯克斯自動機械美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROOKS AUTOMATION US, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格西諾　胡斯托</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRACIANO, JUSTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐彌法爾　阿默</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMIDFAR, AMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">基板輸送設備包括基底、鉸接自動機臂、控制器以及位準偵測器。鉸接自動機臂連接至基底，在其上具有端效器並且被鉸接以使得以至少一自由度移動，以及以端效器致效預定操作自動機功能。控制器連接至且組態以鉸接鉸接自動機臂以進行預定的操作自動機功能。位準偵測器可通訊地耦接至控制器，並且配置在鉸接自動機臂上以使得致效遍及致效預定操作功能之鉸接自動機臂之運動範圍之鉸接自動機臂位準的判定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate transport apparatus includes a base, an articulated robot arm, a controller, and a level detector. The articulated robot arm is connected to the base, has an end effector thereon, and is articulated so as to move with at least one degree of freedom and effect, with the end effector, a predetermined operating robot function. The controller is connected to and configured to articulate the articulated robot arm to perform the predetermined operating robot function. The level detector is communicably coupled to the controller, and disposed on the articulated robot arm so as to effect determination of articulated robot arm level throughout a range of motion of the articulated robot arm that effects the predetermined operating function.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板處理系統</p>  
        <p type="p">110:輸送容器</p>  
        <p type="p">120:負載埠模組</p>  
        <p type="p">130:環境前端模組</p>  
        <p type="p">140:基板處理模組</p>  
        <p type="p">145:基板持定位點</p>  
        <p type="p">150:基板處理區段</p>  
        <p type="p">170:位準偵測器</p>  
        <p type="p">180:基板輸送設備</p>  
        <p type="p">199:控制器</p>  
        <p type="p">230:端效器</p>  
        <p type="p">ALS:自動調平系統</p>  
        <p type="p">ENC:感測器</p>  
        <p type="p">HP:水平平面</p>  
        <p type="p">W:工件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1732" publication-number="202612707"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612707.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612707</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129634</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環碳酸酯核苷化合物之鹽、其晶體、其製備方法及其用途</chinese-title>  
        <english-title>SALT, CRYSTAL, MANUFACTURING METHOD AND THE USE OF CYCLIC CARBONATE NUCLEOSIDE COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/706</main-classification>  
        <further-classification edition="200601120260102B">C07H9/02</further-classification>  
        <further-classification edition="200601120260102B">A61P31/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商廣東晨康生物科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUANGDONG CHENKANG BIOTECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝玲花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAO, LING-HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖攀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, PAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張建港</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIANG-GANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林國明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, GUO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王志中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>高雄市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種環碳酸酯核苷化合物之鹽具有結構式I。當Y為氫溴酸及n=1時，該核苷化合物之鹽為晶型A或晶型B，其中晶型A具有物理及化學穩定性、固體性狀、水溶性，其引濕性小及口服生物利用度高，可用於製備治療或緩解由病毒〔例如：新型冠狀病毒SARS-CoV-2、貓傳染性腹膜炎病毒FCoV、呼吸道合胞病毒RSV、豬流行性腹瀉病毒PEDV或貓杯狀病毒FCV〕所引起的相關疾病之藥物組合物。</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="182px" width="320px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A salt of cyclic carbonate nucleoside compound includes has a structure I, with having a crystal A or crystal B while Y being hydrobromic acid and n=1. The crystal A has characteristics of physical and chemical stabilities, solidity, water-soluble, less hygroscopicity and high oral-bioavailability. The use of crystal A is applicable for related diseases caused by viruses, e.g., SARS-CoV-2, FCoV, RSV, PEDV or FCV.</p>  
        <p type="p">&lt;figure&gt; &lt;img align="absmiddle" height="195px" width="412px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt; &lt;/img&gt; &lt;/figure&gt;</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1733" publication-number="202614214"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614214.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614214</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129699</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法、半導體裝置之製造方法、程式及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">H01L21/31</main-classification>  
        <further-classification edition="200601120251215B">C23C16/44</further-classification>  
        <further-classification edition="200601120251215B">C23C16/455</further-classification>  
        <further-classification edition="200601120251215B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商國際電氣股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>照井祐輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERUI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松岡樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUOKA, TATSURU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田勝吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, KATSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係藉由將包含下述步驟之周期進行既定次數，而於基板上形成含有矽及氧之膜：(a)對基板供給於1分子中含有矽原子及鍵結於上述矽原子之胺基、且含有鍵結於上述矽原子之烷氧基及具有上述矽原子之矽氧烷鍵結中至少任一者的化合物的步驟；與(b)對基板供給經激發之含有氫或氘、且不含氧之反應體的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1734" publication-number="202612889"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612889.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612889</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129703</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂成形裝置、以及樹脂成形品的製造方法</chinese-title>  
        <english-title>RESIN MOLDING APPARATUS AND RESIN MOLDED PRODUCT MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251023B">B29C33/44</main-classification>  
        <further-classification edition="200601120251023B">B29C43/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＴＯＷＡ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOWA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中尾聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田雄介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西田賢一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIDA, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明將供給有樹脂材料的多個脫模膜效率良好地搬送至多個成形模中，包括：樹脂成形機構，上下配置有具有上模及下模的多個成形模；成形對象物搬送機構，將多個成形對象物搬送至多個成形模；樹脂材料供給機構，向配置於下模的脫模膜供給樹脂材料；多層膜配置架，用於配置供給有樹脂材料的脫模膜；以及樹脂材料搬送機構，將供給有樹脂材料的多個脫模膜自多層膜配置架搬送至多個成形模。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention efficiently transports multiple release films supplied with a resin material to multiple forming molds. The invention includes: a resin forming mechanism having multiple forming molds in which upper molds and lower molds are arranged vertically; a forming object transport mechanism that transports multiple forming objects to the forming molds; a resin material supply mechanism that supplies a resin material to release films disposed on the lower molds; a multi-layer film arrangement rack, provided for arranging the release films supplied with a resin material; and a resin material transport mechanism that transports the release films supplied with resin material from the multi-layer film arrangement rack to the forming molds.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:成形對象物搬送機構</p>  
        <p type="p">3:第一移載台(移載台)</p>  
        <p type="p">4:第二移載台(移載台)</p>  
        <p type="p">5:成形對象物供給機構</p>  
        <p type="p">6:成形對象物回收機構</p>  
        <p type="p">7A:第一成形模(成形模、樹脂成形機構)</p>  
        <p type="p">7B:第二成形模(成形模、樹脂成形機構)</p>  
        <p type="p">8:合模機構(樹脂成形機構)</p>  
        <p type="p">12:樹脂材料供給機構</p>  
        <p type="p">12a:框體搬入部(框體回收部)</p>  
        <p type="p">12a1、12e1、20a:保持單元</p>  
        <p type="p">12a2、12e2:驅動機構部</p>  
        <p type="p">12b:框體清掃部</p>  
        <p type="p">12c:膜裝設部</p>  
        <p type="p">12d:樹脂材料供給部</p>  
        <p type="p">12e:框體搬出部</p>  
        <p type="p">12f:框體移動部</p>  
        <p type="p">13:膜配置架(配置架)</p>  
        <p type="p">14:框體配置架(配置架)</p>  
        <p type="p">15:樹脂材料搬送機構</p>  
        <p type="p">20:搬送機器人</p>  
        <p type="p">20b:多關節臂部</p>  
        <p type="p">21:基板搬送部</p>  
        <p type="p">22:成形品搬送部</p>  
        <p type="p">51:基板供給部</p>  
        <p type="p">52:基板移載部</p>  
        <p type="p">61:成形品收納部</p>  
        <p type="p">62:成形品回收部</p>  
        <p type="p">71:上模</p>  
        <p type="p">72:下模</p>  
        <p type="p">72C:空腔</p>  
        <p type="p">100:樹脂成形裝置</p>  
        <p type="p">101:軌道</p>  
        <p type="p">151:樹脂材料搬送部</p>  
        <p type="p">152:膜回收部</p>  
        <p type="p">511、611:收納盒</p>  
        <p type="p">512:取出機構</p>  
        <p type="p">513:成形前基板台</p>  
        <p type="p">514、614:導軌</p>  
        <p type="p">612:收納機構</p>  
        <p type="p">613:樹脂成形品台</p>  
        <p type="p">A:基板供給/收納模組(模組)</p>  
        <p type="p">B:樹脂成形模組(模組)</p>  
        <p type="p">C:樹脂材料供給模組(模組)</p>  
        <p type="p">CTL:控制部</p>  
        <p type="p">P:樹脂成形品(成形對象物)</p>  
        <p type="p">R1:搬入區域(區域)</p>  
        <p type="p">R2:搬出區域(區域)</p>  
        <p type="p">R3:清掃區域(作業區域、區域)</p>  
        <p type="p">R4:裝設區域(作業區域、區域)</p>  
        <p type="p">R5:供給區域(作業區域、區域)</p>  
        <p type="p">W:成形前基板(成形對象物、基板、成形完畢基板)</p>  
        <p type="p">Wx:電子零件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1735" publication-number="202614262"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614262.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614262</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129705</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用包括基於手繪或數位生成影像之樣本導航之虛擬地圖的晶片導航</chinese-title>  
        <english-title>CHIP NAVIGATION USING VIRTUAL MAP INCLUDING SAMPLE NAVIGATION BASED ON HAND-DRAWN OR DIGITIALLY GENERATED IMAGES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251228B">H01L21/66</main-classification>  
        <further-classification edition="200601120251228B">H01J37/28</further-classification>  
        <further-classification edition="202201120251228B">G06V10/70</further-classification>  
        <further-classification edition="201701120251228B">G06T7/70</further-classification>  
        <further-classification edition="201701120251228B">G06T7/60</further-classification>  
        <further-classification edition="200601120251228B">G05B13/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＦＥＩ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEI COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫切拉　亞當</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUCERA, ADAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲切克　多明尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FICEK, DOMINIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧雷穆斯　佐爾坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OREMUS, ZOLTAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡爾利克　帕沃爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARLIK, PAVOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許布納　盧卡斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUBNER, LUKAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CZ</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電腦實施的方法，其包含：存取一樣本的一影像；偵測該影像中的一或多個形狀；基於在該影像中所偵測到的一或多個形狀及一組虛擬地圖建構規則來建構一虛擬地圖；及基於該虛擬地圖，自動地導航至該樣本的一目標區域，以使用一帶電粒子束顯微鏡來處理該樣本。另一種方法包括：存取經動態獲得之與一樣本的一影像相關聯的形狀資料；偵測該影像中的一或多個形狀，並將所偵測到的一或多個形狀轉換成找到的形狀資料；存取人工參考形狀資料；使用一物件匹配最佳化比較該找到的形狀資料與該人工參考形狀資料，以判定在該找到的形狀資料與該人工參考形狀資料之間的一對準；及基於該對準，導航至該樣本的一目標區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A computer-implemented method, comprising accessing an image of a sample, detecting one or more shapes in the image, constructing a virtual map based on the detected one or more shapes in the image and a set of virtual map construction rules, and based on the virtual map, automatically navigating to a target region of the sample to process the sample with a charged particle beam microscope. Another method includes accessing dynamically obtained shape data associated with an image of a sample, detecting one or more shapes in the image and converting the detected one or more shapes into found shape data, accessing artificial reference shape data, comparing the found shape data and the artificial reference shape data with an object matching optimization to determine an alignment between the found shape data and the artificial reference shape data, and navigating to a target region of the sample based on the alignment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:實例方法</p>  
        <p type="p">402,404,406,408,410:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1736" publication-number="202614201"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614201.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614201</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129707</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/306</main-classification>  
        <further-classification edition="200601120251230B">H01L21/324</further-classification>  
        <further-classification edition="200601120251230B">H01L21/683</further-classification>  
        <further-classification edition="200601120251230B">H01L21/67</further-classification>  
        <further-classification edition="200601120251230B">C09K13/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠提昇異物去除性能之基板處理方法及基板處理裝置。基板處理方法包括：處理液供給步驟，其對基板之圖案面供給具有溶質及溶劑之處理液；處理膜形成步驟，其使處理液固化或硬化而形成處理膜；溶劑萃取液供給步驟，其將從處理膜中萃取溶劑之溶劑萃取液供給至處理膜之表面；溶劑萃取液排出步驟，其使溶劑萃取液向基板外排出；蒸發促進步驟，其促進處理膜中之溶劑之蒸發；以及去除步驟，其將處理膜從圖案面剝離，去除至基板外。進而，亦可包括去除處理膜之殘渣之殘渣去除步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">91:處理液</p>  
        <p type="p">92:溶劑萃取液</p>  
        <p type="p">93:剝離液</p>  
        <p type="p">94:殘渣去除液</p>  
        <p type="p">100:處理膜</p>  
        <p type="p">101:處理液膜</p>  
        <p type="p">165:圖案面</p>  
        <p type="p">171:處理液供給步驟</p>  
        <p type="p">172:處理膜形成步驟</p>  
        <p type="p">173:溶劑萃取液供給步驟</p>  
        <p type="p">174:溶劑萃取液排出步驟</p>  
        <p type="p">175:蒸發促進步驟</p>  
        <p type="p">176:去除步驟</p>  
        <p type="p">177:殘渣去除步驟</p>  
        <p type="p">178:甩乾處理步驟</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1737" publication-number="202612788"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612788.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612788</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129719</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液體材料吐出裝置及塗佈裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251225B">B05C5/00</main-classification>  
        <further-classification edition="200601120251225B">B05D1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商武藏工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUSASHI ENGINEERING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>生島和正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKUSHIMA, KAZUMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種液體材料吐出裝置及搭載該裝置的塗佈裝置，該液體材料吐出裝置在當對施加至液體材料的壓力進行切換時其響應性、及貯存容器之更換作業性良好，並且不被限定於特定之機器人，且可搭載於各種機器人。 &lt;br/&gt;一種液體材料吐出裝置1及搭載該裝置的塗佈裝置40，該液體材料吐出裝置1具備有：主裝置10、與主裝置10在物理上被構成為分開並將空氣供給至與噴嘴相連通的貯存容器內的切換裝置20、及緩衝裝置22；主裝置10具有：將加壓空氣予以調整至所需壓力的加壓空氣調壓裝置12、及控制裝置11；切換裝置20具有：對於將加壓空氣調壓裝置12與貯存容器50予以連接的流路之連通或遮擋進行切換的吐出閥21；主裝置10與切換裝置20係以可變更相對位置之方式，藉由具有可撓性的空氣供給路徑32而被連接；緩衝裝置22被配置在切換裝置20內或被配置為與切換裝置相連結。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:液體材料吐出裝置(第1實施形態例)</p>  
        <p type="p">10:主裝置</p>  
        <p type="p">13:箱體</p>  
        <p type="p">20:切換裝置</p>  
        <p type="p">23:箱體</p>  
        <p type="p">24:輸出接頭</p>  
        <p type="p">31:信號纜線</p>  
        <p type="p">32:第2空氣供給路徑</p>  
        <p type="p">50:貯存容器</p>  
        <p type="p">60:轉接管</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1738" publication-number="202612789"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612789.zip"/> 
    </tif-files>  
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      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202612789</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129720</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液體材料吐出裝置及液體材料塗佈裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251225B">B05C5/00</main-classification>  
        <further-classification edition="200601120251225B">B05D1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商武藏工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUSASHI ENGINEERING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>生島和正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKUSHIMA, KAZUMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種液體材料吐出裝置及具備有該裝置之液體材料塗佈裝置，其可使現場之作業人員容易地更換吐出閥。 &lt;br/&gt;一種液體材料吐出裝置1，其對與噴嘴31相連通並被搭載在機器人的貯存部30供給加壓氣體；該液體材料吐出裝置1之特徵在於，其具備有：調壓裝置11，其將從加壓氣體供給源40所供給的加壓氣體予以調壓至所需壓力；吐出閥21，其對調壓裝置11與貯存部30之連通或遮斷進行切換；氣體供給路徑50，其連通調壓裝置11與吐出閥21；及第1框體10，其容納調壓裝置11；液體材料吐出裝置1亦具備有第2框體20，第2框體20係與第1框體10在物理上以分離個體構成，並可裝卸自如地容納吐出閥21。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:液體材料吐出裝置</p>  
        <p type="p">10:第1框體</p>  
        <p type="p">11:調壓裝置</p>  
        <p type="p">12:控制裝置</p>  
        <p type="p">13:配線</p>  
        <p type="p">14:信號纜線</p>  
        <p type="p">17:排氣口</p>  
        <p type="p">20:第2框體</p>  
        <p type="p">21:吐出閥</p>  
        <p type="p">30:貯存部</p>  
        <p type="p">31:吐出部</p>  
        <p type="p">40:加壓氣體供給源</p>  
        <p type="p">41:空氣供給管(氣管)</p>  
        <p type="p">50、51、52:氣管(流路)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1739" publication-number="202612790"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612790.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612790</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129723</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液體材料吐出裝置及塗佈裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251225B">B05C5/00</main-classification>  
        <further-classification edition="200601120251225B">B05C11/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商武藏工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUSASHI ENGINEERING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>生島和正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKUSHIMA, KAZUMASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種液體材料吐出裝置及具備有該裝置之塗佈裝置、以及液體材料吐出方法，其可較習知者更高精度地進行定量吐出。 &lt;br/&gt;一種液體材料吐出裝置、塗佈裝置及方法；其特徵在於，吐出裝置具備有：調壓裝置11，其將加壓氣體予以調壓至所需壓力；吐出閥21，其對於將調壓裝置11與貯存容器61之間予以連通或遮斷的位置進行切換；吐出閥供給路徑40，其連通調壓裝置11與吐出閥21；貯存部供給路徑50，其連通貯存容器61與吐出閥21；貯存部用壓力計22，其測定貯存部供給路徑50之壓力；第1框體10，其容納調壓裝置11；第2框體20，其與第1框體10在物理上以分離個體構成，並容納吐出閥21及貯存部用壓力計22；及控制裝置30，其以吐出一定量之液體材料之方式，在既定之時間點切換吐出閥21之上述位置；其中，控制裝置30係根據上述貯存部用壓力計之測定值，以對從上述吐出閥供給至上述貯存容器的加壓氣體之量進行控制，且貯存部供給路徑50之容積係比吐出閥供給路徑40之容積為小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:液體材料吐出裝置</p>  
        <p type="p">10:第1框體</p>  
        <p type="p">11:調壓裝置</p>  
        <p type="p">12:吐出閥用壓力計</p>  
        <p type="p">13、14、23、24:接頭</p>  
        <p type="p">20:第2框體</p>  
        <p type="p">21:吐出閥</p>  
        <p type="p">22:貯存部用壓力計</p>  
        <p type="p">30:控制裝置</p>  
        <p type="p">31~35:配線</p>  
        <p type="p">40:吐出閥供給路徑</p>  
        <p type="p">41:吐出閥第1供給路徑</p>  
        <p type="p">42:吐出閥第2供給路徑</p>  
        <p type="p">43:吐出閥第3供給路徑</p>  
        <p type="p">50:貯存部供給路徑</p>  
        <p type="p">51:貯存部第1供給路徑</p>  
        <p type="p">52:貯存部第2供給路徑</p>  
        <p type="p">60:貯存部</p>  
        <p type="p">61:貯存容器</p>  
        <p type="p">62:噴嘴(吐出部)</p>  
        <p type="p">63:轉接器</p>  
        <p type="p">70:加壓氣體供給源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1740" publication-number="202614852"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614852.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
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          <doc-number>202614852</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129724</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成用於半導體元件之含矽鍺層狀堆疊的結構與方法</chinese-title>  
        <english-title>STRUCTURE AND METHOD OF FORMING A SILICON GERMANIUM CONTAINING LAYERED STACK FOR USE IN SEMICONDUCTOR DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251226B">H10D84/82</main-classification>  
        <further-classification edition="200601120251226B">H01L21/301</further-classification>  
        <further-classification edition="200601120251226B">H01L21/76</further-classification>  
        <further-classification edition="200601120251226B">H01L21/20</further-classification>  
        <further-classification edition="202501120251226B">H10D62/10</further-classification>  
        <further-classification edition="202501120251226B">H10D62/40</further-classification>  
        <further-classification edition="202501120251226B">H10D62/60</further-classification>  
        <further-classification edition="202501120251226B">H10D62/80</further-classification>  
        <further-classification edition="202501120251226B">H10D88/00</further-classification>  
        <further-classification edition="202301120251226B">H10B12/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張子辰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, ZICHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿蘿拉　希瑪尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARORA, HIMANI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>托勒　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOLLE, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任　河</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REN, HE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康拉德　馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONRAD, MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李子匯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZIHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈辰飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, CHENFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘鋮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈克　梅伍爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAIK, MEHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　怡利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIEH, ELLIE Y.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例係關於電子元件製造領域，特定言之係關於多層磊晶堆疊，例如互補式場效應電晶體（cFET）。一種方法用於在cFET中製造層狀中間介電質隔離（MDI）結構以及對磊晶生長的矽鍺層進行碳摻雜。在某些實施例中，藉由將層狀MDI結構與矽鍺層的碳摻雜整合到cFET中，相較於傳統堆疊，堆疊中的弛豫、晶圓弓形和缺陷已顯著減少。有利的是，多層磊晶堆疊包含比傳統堆疊更多的矽通道（例如，pMOS和nMOS通道）。此外，下游過程中的選擇性提高了數個數量級。因此，具有高深寬比的溝槽分隔特徵，使得每個特徵包括含有MDI膜的多層磊晶堆疊，該膜位於頂部和底部FET模組之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure relate to the field of electronic device manufacturing, and in particular, to multi-layered epitaxial stacks, such as complementary field-effect-transistors (cFETs). A method is used to fabricate a layered middle dielectric isolation (MDI) structure and carbon-doping of epitaxially grown silicon germanium layers together in the cFETs. In some embodiments, by integrating the layered MDI structure together with carbon-doping of SiGe layers into the cFETs, relaxation, wafer bow, and defects in a stack have been significantly reduced when compared to traditional stacks. Advantageously, multi-layered epitaxial stacks incorporate a greater number of silicon channels (e.g., pMOS and nMOS channels) when compared to traditional stacks. Furthermore, the selectivity in the downstream processes is improved by an order of magnitude. As such, trenches with high aspect ratio separate features, such that each feature includes the multi-layered epitaxial stack containing the MDI film disposed between the top and bottom FET modules.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:底部FET模組</p>  
        <p type="p">112a:第一矽鍺層</p>  
        <p type="p">112b:第一矽鍺層</p>  
        <p type="p">112c:第一矽鍺層</p>  
        <p type="p">114a:矽通道層</p>  
        <p type="p">114b:矽通道層</p>  
        <p type="p">120:MDI膜</p>  
        <p type="p">122a:底部矽磊晶層</p>  
        <p type="p">122b:頂部矽磊晶層</p>  
        <p type="p">124a:第二矽鍺層</p>  
        <p type="p">124b:第二矽鍺層</p>  
        <p type="p">124c:第二矽鍺層</p>  
        <p type="p">126a:第一矽鍺層</p>  
        <p type="p">126b:第一矽鍺層</p>  
        <p type="p">130:頂部FET模組</p>  
        <p type="p">132a:第一矽鍺層</p>  
        <p type="p">132b:第一矽鍺層</p>  
        <p type="p">132c:第一矽鍺層</p>  
        <p type="p">134a:矽通道層</p>  
        <p type="p">134b:矽通道層</p>  
        <p type="p">134c:矽通道層</p>  
        <p type="p">240:多層磊晶堆疊</p>  
        <p type="p">400:工件</p>  
        <p type="p">410:特徵</p>  
        <p type="p">412:溝槽</p>  
        <p type="p">442:墊氧化物層</p>  
        <p type="p">444:氮化物層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1741" publication-number="202614147"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614147.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614147</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129728</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>平衡處理腔室內的製程套件面積和晶圓面積</chinese-title>  
        <english-title>BALANCING PROCESS KIT AREA TO WAFER AREA WITHIN A PROCESSING CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">H01J37/32</main-classification>  
        <further-classification edition="200601120251218B">H03H7/38</further-classification>  
        <further-classification edition="200601120251218B">H01G2/20</further-classification>  
        <further-classification edition="200601120251218B">H01L21/3065</further-classification>  
        <further-classification edition="200601120251218B">H01J37/36</further-classification>  
        <further-classification edition="200601120251218B">C23C16/50</further-classification>  
        <further-classification edition="200601120251218B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈西亞　艾爾法洛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARCIA, ALVARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴許　施里拉姆喬蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DASH, SHREERAM JYOTI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史密德　安德列亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMID, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿札德　Ａ　Ｎ　Ｍ瓦塞科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AZAD, A N M WASEKUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BD</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭　岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, YUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉馬斯瓦米　卡提克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMASWAMY, KARTIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布萊特　尼可拉斯Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRIGHT, NICOLAS J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">態樣大體而言係關於用於在處理腔室內調節不同部件的電容值的方法和系統。該處理腔室包括由耦接至基板的電源驅動的電極，其中在該電極與該基板之間產生第一電容，並且有邊緣環設置於該基板鄰近，該邊緣環具有第二電容，有至少一個電容器設置於該處理腔室內，以使該邊緣環的該第二電容與在該電極與該基板之間的該第一電容相匹配。在一個實例中，至少一個電容器是固定電容器。在另一個實例中，至少一個電容器是可變電容器。該處理腔室的部件可能由射頻源或脈衝發生器供電。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aspects generally relate to methods and systems for modulating capacitance values of different components within a processing chamber. The processing chamber includes an electrode driven by a power source coupled to a substrate, where a first capacitance is produced between the electrode and the substrate, an edge ring disposed adjacent the substrate, the edge ring having a second capacitance, and at least one capacitor disposed within the processing chamber to match the second capacitance of the edge ring to the first capacitance between the electrode and the substrate. In one example, the at least one capacitor is a fixed capacitor. In another example, the at least one capacitor is a variable capacitor. Components of the processing chamber may be powered by either a radiofrequency source or a pulse generator.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:電漿</p>  
        <p type="p">122:腔室壁</p>  
        <p type="p">126:基板</p>  
        <p type="p">200:簡化電容器模型</p>  
        <p type="p">202:邊緣環</p>  
        <p type="p">205:RF發生器</p>  
        <p type="p">210:電容</p>  
        <p type="p">220:電容</p>  
        <p type="p">230:電容</p>  
        <p type="p">240:點</p>  
        <p type="p">250:第一電容</p>  
        <p type="p">252:第二電容</p>  
        <p type="p">254:第三電容</p>  
        <p type="p">300:簡化電容器模型</p>  
        <p type="p">305:脈衝發生器</p>  
        <p type="p">307:電池</p>  
        <p type="p">340:點</p>  
        <p type="p">352:電容</p>  
        <p type="p">354:電容</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1742" publication-number="202612812"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612812.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612812</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129730</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於鑄造機的鑄造柱塞</chinese-title>  
        <english-title>CASTING PLUNGER FOR A CASTING MACHINE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B22D17/20</main-classification>  
        <further-classification edition="200601120251231B">B22D17/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商奧斯卡弗里茨兩合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OSKAR FRECH GMBH + CO. KG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹能曼恩　荷爾瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DANNENMANN, HELMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊秀鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">1.  一種用於一鑄造機之鑄造柱塞。 &lt;br/&gt;2.1 本發明係關於一種用於一鑄造機之鑄造柱塞，其具有：一耦合部分(1)，其在一後端區域中；一頭部部分(2)，其在一前端區域中；及一柱塞桿(4)，其固持於該耦合部分上且以一桿部分(4c)從該耦合部分延伸至該頭部部分。該頭部部分在一外圓周處具有一柱塞環(5)。該柱塞桿在該頭部部分中以其前面端處之一頭部部件(4a)結束，該頭部部件具有大於該桿部分(4c)之一外徑(4&lt;sub&gt;D&lt;/sub&gt;)之一外徑(4a&lt;sub&gt;D&lt;/sub&gt;)。 &lt;br/&gt;2.2 根據本發明，該頭部部分具有一柱塞環接納單元(21)，該柱塞環接納單元(21)經軸向推動至該桿部分上且抵靠該頭部部件，且該柱塞環固持於該柱塞環接納單元上。該柱塞桿在該柱塞環接納單元與該耦合部分之間之該桿部分中被軸向推動至該桿部分上之一隔片套筒單元(14)包圍。 &lt;br/&gt;2.3    一種例如用於熱室壓鑄機之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">1. Casting plunger for a casting machine. &lt;br/&gt;2.1 The invention relates to a casting plunger for a casting machine, which has a coupling portion (1) in a rear end region, a head portion (2) in a front end region, and a plunger rod (4) which is held on the coupling portion and extends with a rod portion (4c) from the coupling portion to the head portion. The head portion has a plunger ring (5) at an outer circumference. The plunger rod ends with a head part (4a) at its front face end in the head portion, said head part having an outside diameter (4a&lt;sub&gt;D&lt;/sub&gt;) that is larger than an outside diameter (4&lt;sub&gt;D&lt;/sub&gt;) of the rod portion (4c). &lt;br/&gt;2.2 According to the invention, the head portion has a plunger-ring receiving unit (21) which is pushed axially onto the rod portion and bears against the head part and on which the plunger ring is held. The plunger rod is surrounded, in the rod portion between the plunger-ring receiving unit and the coupling portion, by a spacer-sleeve unit (14) that is pushed axially onto the rod portion. &lt;br/&gt;2.3 Use, for example, for hot-chamber die-casting machines.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:頭部部分</p>  
        <p type="p">3:軸件區域</p>  
        <p type="p">4:柱塞桿</p>  
        <p type="p">4a:頭部部件/第一隔片套筒/前隔片套筒</p>  
        <p type="p">4b:第二隔片套筒/後隔片套筒</p>  
        <p type="p">4c:桿部分</p>  
        <p type="p">5:柱塞環</p>  
        <p type="p">6:外環形溝槽</p>  
        <p type="p">7:支撐套筒</p>  
        <p type="p">8:接納套筒</p>  
        <p type="p">12:腐蝕保護層</p>  
        <p type="p">13:可釋放連接</p>  
        <p type="p">13a:外螺紋</p>  
        <p type="p">13b:內螺紋</p>  
        <p type="p">14:隔片套筒單元</p>  
        <p type="p">14a:第一隔片套筒/前隔片套筒</p>  
        <p type="p">14b:第二隔片套筒/後隔片套筒</p>  
        <p type="p">15:保護套筒主體</p>  
        <p type="p">16:夾持套筒單元</p>  
        <p type="p">16a:前夾持套筒</p>  
        <p type="p">16b:後夾持套筒</p>  
        <p type="p">17:預負載設定裝置</p>  
        <p type="p">17a:夾持螺帽/螺紋螺帽</p>  
        <p type="p">17b:夾持裝置</p>  
        <p type="p">17c:耦合固定半殼</p>  
        <p type="p">17d:耦合固定半殼</p>  
        <p type="p">18:外工具界面</p>  
        <p type="p">20:平面</p>  
        <p type="p">21:柱塞環接納單元</p>  
        <p type="p">22:鑄造驅動器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1743" publication-number="202612869"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612869.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612869</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129790</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理裝置及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">B25J13/08</main-classification>  
        <further-classification edition="201701120251226B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安藤俊之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDO, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一態樣之資訊處理裝置，具備：記憶部，能夠記憶用於取出工件的關於以工件座標系表現之機器人前端的複數個取出位置及取出姿勢之數據；轉換部，基於以世界座標系表現之關於在容器內散裝之工件的3次元數據，將以工件座標系表現之複數個取出位置及取出姿勢轉換為世界座標系的表現；計算部，針對轉換為世界座標系的表現之複數個取出位置及取出姿勢，計算機器人前端的基準線與世界座標系的垂直軸之間的夾角；篩選部，基於計算出的角度，將轉換為世界座標系的表現之複數個取出位置及取出姿勢篩選為至少一個取出位置及取出姿勢；以及選擇部，從篩選出的至少一個取出位置及取出姿勢中選擇一個取出位置及取出姿勢。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:機器人系統</p>  
        <p type="p">2:資訊處理裝置</p>  
        <p type="p">3:控制裝置</p>  
        <p type="p">4:機器人手臂機構</p>  
        <p type="p">5:3次元感測器</p>  
        <p type="p">6:手爪</p>  
        <p type="p">7:一對指部</p>  
        <p type="p">8:手爪基座</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1744" publication-number="202613241"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613241.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613241</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129791</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環氧樹脂組成物、硬化物、半導體裝置及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">C08L63/02</main-classification>  
        <further-classification edition="200601120251216B">C08G59/40</further-classification>  
        <further-classification edition="200601120251216B">C10M139/04</further-classification>  
        <further-classification edition="201801120251216B">C08K3/013</further-classification>  
        <further-classification edition="200601120251216B">C08K3/36</further-classification>  
        <further-classification edition="200601120251216B">C08K7/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商納美仕股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊藤裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供不易產生捲入空洞之環氧樹脂組成物。又，提供上述環氧樹脂組成物之硬化物、具備上述硬化物之半導體裝置及其製造方法。 &lt;br/&gt;　　一種環氧樹脂組成物，其包含：環氧樹脂(A)、硬化劑(B)、及無機填充材料(C)，其中無機填充材料(C)包含以具有碳數4~15之烴基之矽烷耦合劑來表面處理之無機填充材料(C1)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1745" publication-number="202613242"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613242.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613242</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129792</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環氧樹脂組成物、硬化物及半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">C08L63/02</main-classification>  
        <further-classification edition="200601120251216B">C08G73/18</further-classification>  
        <further-classification edition="200601120251216B">C10M139/04</further-classification>  
        <further-classification edition="201801120251216B">C08K3/013</further-classification>  
        <further-classification edition="200601120251216B">C08K3/36</further-classification>  
        <further-classification edition="200601120251216B">C08K7/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商納美仕股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齊藤裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大江貴之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OE, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上村剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIMURA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種不易產生模製後之空洞之環氧樹脂組成物。又，提供前述環氧樹脂組成物之硬化物、具備前述硬化物之半導體裝置、前述半導體裝置之製造方法。 &lt;br/&gt;　　一種環氧樹脂組成物，其包含環氧樹脂(A)、硬化促進劑(B)、及 &lt;br/&gt;　　無機填充材料(C)，且滿足下述式(V)。 &lt;br/&gt;　　黏度(1)×黏度(2)≦500　　　　　　(V) &lt;br/&gt;　　黏度(1)：25℃下之環氧樹脂組成物之黏度(Pa・s) &lt;br/&gt;　　黏度(2)：150℃下之環氧樹脂組成物之黏度(Pa・s)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1746" publication-number="202612994"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612994.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612994</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129869</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微波爐用包裝袋、其製造方法及其加熱方法</chinese-title>  
        <english-title>PACKAGING BAG FOR MICROWAVE OVEN, MANUFACTURING METHOD THEREOF AND HEATING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B65D81/34</main-classification>  
        <further-classification edition="200601120251231B">B65D81/24</further-classification>  
        <further-classification edition="200601120251231B">B65D33/25</further-classification>  
        <further-classification edition="200601120251231B">B65D30/10</further-classification>  
        <further-classification edition="200601120251231B">B65B51/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商京洛股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYORAKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塚田泰輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUKADA, TAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迫沼博文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKONUMA, HIROFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片山亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAYAMA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種微波爐用包裝袋，其無需設置合掌部，即可抑制內容物經由蒸氣流路洩漏。其中包裝袋係由薄膜於密封部進行熱密封所構成，且具備互相對置的前面部及背面部，密封部具備周緣密封部與圍繞密封部，周緣密封部係沿著包裝袋的周緣設置，圍繞密封部係設置於比周緣密封部更靠包裝袋內側，包裝袋設有藉由周緣密封部圍繞密封部所圍繞的封閉區域，圍繞密封部的至少一部分係構成隨著包裝袋的收容空間內的內壓上升而剝離，以形成可供蒸氣流通的蒸氣流路之排氣密封部，在封閉區域中，前面部與背面部之中僅前面部設置有可供蒸氣通過的蒸氣口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:包裝袋</p>  
        <p type="p">1a:周緣</p>  
        <p type="p">1b:下緣</p>  
        <p type="p">1c:收容空間</p>  
        <p type="p">1:左緣</p>  
        <p type="p">1r:右緣</p>  
        <p type="p">1t:上緣</p>  
        <p type="p">2:周緣密封部</p>  
        <p type="p">2l:左側密封部</p>  
        <p type="p">2r:右側密封部</p>  
        <p type="p">2t:頂部密封部</p>  
        <p type="p">2c:預定密封部</p>  
        <p type="p">3:前面部</p>  
        <p type="p">5:圍繞密封部</p>  
        <p type="p">5a:第1連接部</p>  
        <p type="p">5b:第2連接部</p>  
        <p type="p">5c:前端</p>  
        <p type="p">5d:第1邊密封部</p>  
        <p type="p">5e:第2邊密封部</p>  
        <p type="p">5f:排氣密封部</p>  
        <p type="p">5g:緣部</p>  
        <p type="p">6:密封部</p>  
        <p type="p">7:封閉區域</p>  
        <p type="p">7a:第1區域</p>  
        <p type="p">7b:第2區域</p>  
        <p type="p">7c:前端</p>  
        <p type="p">8:蒸氣口</p>  
        <p type="p">G:重心</p>  
        <p type="p">L:直線</p>  
        <p type="p">La:長邊方向之長度</p>  
        <p type="p">Lb:短邊方向之長度</p>  
        <p type="p">C:中央</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1747" publication-number="202613535"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613535.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613535</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129880</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學裝置、檢查裝置、拍攝方法以及儲存有程式的電腦可讀取媒體</chinese-title>  
        <english-title>OPTICAL APPARATUS, INSPECTION APPARATUS, IMAGECAPTURING METHOD, AND PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">G01N21/956</main-classification>  
        <further-classification edition="200601120251217B">G06T5/50</further-classification>  
        <further-classification edition="200601120251217B">H01L21/66</further-classification>  
        <further-classification edition="201201120251217B">G03F1/84</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商雷射科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LASERTEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溝口道栄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZOGUCHI, MICHITERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>細見実</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOSOMI, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為以低雜訊進行試樣的拍攝。光學系統20係將藉由將照明光L1照射至試樣100而產生的反射光L2導引至檢測器50。圖像處理部60係因應檢測器50所為的反射光L2的檢測結果輸出試樣100的圖像IMG。光學距離調整單元係能夠調整試樣100與檢測器50之間的光學距離。控制部70係一邊以檢測器50與試樣100之間的光學距離變化之方式控制光學距離調整單元，一邊以基於檢測器50所為的檢測結果複數次地取得試樣100的影像之方式控制圖像處理部60。圖像處理部60係基於所取得的試樣100的複數個影像的累積結果取得試樣100的圖像。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光學裝置</p>  
        <p type="p">10:光源</p>  
        <p type="p">20:光學系統</p>  
        <p type="p">21:分光器</p>  
        <p type="p">22:物透鏡</p>  
        <p type="p">23:中繼透鏡</p>  
        <p type="p">30:台</p>  
        <p type="p">31:台面</p>  
        <p type="p">40:驅動機構</p>  
        <p type="p">50:檢測器</p>  
        <p type="p">60:圖像處理部</p>  
        <p type="p">70:控制部</p>  
        <p type="p">100:試樣</p>  
        <p type="p">101:平板構件</p>  
        <p type="p">102:圖案</p>  
        <p type="p">CON1,CON2:控制訊號</p>  
        <p type="p">DAT:檢測訊號</p>  
        <p type="p">L1:照明光</p>  
        <p type="p">L2:反射光(二次光線)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1748" publication-number="202614668"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614668.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614668</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129889</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控制包含於３Ｄ環境中的照明裝置的方法、裝置及電腦程式產品</chinese-title>  
        <english-title>METHOD, DEVICE, AND COMPUTER PROGRAM PRODUCT OF CONTROLLING A LIGHTING DEVICE COMPRISED IN A 3D ENVIRONMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251228B">H05B47/155</main-classification>  
        <further-classification edition="202001120251228B">H05B47/115</further-classification>  
        <further-classification edition="201701120251228B">G06T7/70</further-classification>  
        <further-classification edition="201101120251228B">G06T15/50</further-classification>  
        <further-classification edition="202001120251228B">H05B45/10</further-classification>  
        <further-classification edition="201801120251228B">H04W4/02</further-classification>  
        <further-classification edition="200601120251228B">G08C17/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商双翼公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WYVRN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維佐利　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VEZZOLI, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了控制照明裝置（11、12）的方法及設備。為達該目的，接收代表照明裝置（11、12）在第一環境（10）中的位置的第一資料。根據第一資料確定代表照明裝置（11、12）在第一環境（10）中的定向（101、102）的第一資訊。根據第一資訊，在第二環境中確定至少一空間樣本作為第二環境中投射的光線的相交點，色彩資訊與空間樣本組的每一個空間樣本相關聯。根據與至少一空間樣本相關聯的色彩資訊對應的色彩資料來控制照明裝置（11、12）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided methods and apparatus of controlling a lighting device (11, 12). To reach that aim, first data representative of a position of the lighting device (11, 12) in a first environment (10) is received. First information representative of orientation (101, 102) of the lighting device (11, 12) in the first environment is determined according to the first data. At least a spatial sample is determined in a second environment as the intersection with a ray casted in the second environment according to the first information, color information being associated with each spatial sample of the set of spatial samples. The lighting device (11, 12) is controlled according to color data corresponding to color information associated with the at least a spatial sample.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一環境</p>  
        <p type="p">11、12:照明裝置</p>  
        <p type="p">13:沙發</p>  
        <p type="p">14:筆記型電腦</p>  
        <p type="p">15:顯示裝置</p>  
        <p type="p">101、102:直線</p>  
        <p type="p">O&lt;sub&gt;1&lt;/sub&gt;:第一參考位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1749" publication-number="202613528"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613528.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613528</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129907</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>缺陷檢查裝置及缺陷檢查方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G01N21/88</main-classification>  
        <further-classification edition="200601120251103B">G01N21/956</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY ENGINEERING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東實先進股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TASMIT, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小池豊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOIKE, YUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大美英一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHMI, HIDEKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種在檢測矩形之元件晶片之缺陷之情形下，能夠更高精度地檢測缺陷之缺陷檢查裝置及缺陷檢查方法。 &lt;br/&gt;本發明之缺陷檢查裝置包含：攝像部，其拍攝矩形之元件晶片83；及控制部，其藉由基於由攝像部拍攝到之元件晶片83之攝像圖像60，取得外周線L1與判定線L2及L3，而檢測元件晶片83之周圍區域83b之缺陷。控制部藉由基於在矩形之元件晶片83之角部設定之角區域C，將角區域C之邊界線與沿著元件晶片83之相鄰之各邊之一對判定線L2各者之交點彼此，較將一對判定線L2各者延長之情形偏靠元件形成區域83a側地連結，而設定角區域C之內部之判定線L3。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">60:攝像圖像</p>  
        <p type="p">83:元件晶片</p>  
        <p type="p">83a:元件形成區域</p>  
        <p type="p">83b:周圍區域</p>  
        <p type="p">90a,90b,90c:缺陷候選</p>  
        <p type="p">C:角區域</p>  
        <p type="p">DA:切割區</p>  
        <p type="p">L1:外周線</p>  
        <p type="p">L2:判定線</p>  
        <p type="p">L3:判定線</p>  
        <p type="p">X,X1,X2:方向</p>  
        <p type="p">Y,Y1,Y2:方向</p>  
        <p type="p">Z,Z1,Z2:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1750" publication-number="202613523"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613523.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613523</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129908</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微分干涉檢查裝置及微分干涉檢查方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">G01N21/45</main-classification>  
        <further-classification edition="200601120251226B">G01N21/21</further-classification>  
        <further-classification edition="200601120251226B">G01N21/956</further-classification>  
        <further-classification edition="201701120251226B">G06T7/50</further-classification>  
        <further-classification edition="202401120251226B">G06T5/73</further-classification>  
        <further-classification edition="200601120251226B">G01B11/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY ENGINEERING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東實先進股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TASMIT, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤圭佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之目的在於，於使用微分干涉法之檢查方法中，可看清楚被檢查對象之凹凸。 &lt;br/&gt;微分干涉檢查裝置1具備：稜鏡10，其使互相正交之2個偏光La、Lb分開剪切量H而分支；相機20，其拍攝藉由偏光La、Lb通過稜鏡10照射至被檢查對象Wa所得之像G；及處理部30，其基於像G檢查被檢查對象Wa。稜鏡10可以對應於剪切量H之稜鏡位置P變化之方式移動。處理部30基於稜鏡位置P之絕對值Q與像G之明度E之關係，設定稜鏡位置P之基準值R0。稜鏡10基於以稜鏡位置P之基準值R0為起點之稜鏡位置P之相對值R而移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:微分干涉檢查裝置</p>  
        <p type="p">10:稜鏡</p>  
        <p type="p">20:相機</p>  
        <p type="p">30:電腦(處理部)</p>  
        <p type="p">40:致動器(稜鏡移動機構)</p>  
        <p type="p">41:柱塞</p>  
        <p type="p">G:像</p>  
        <p type="p">H:剪切量</p>  
        <p type="p">L:偏光</p>  
        <p type="p">La:偏光</p>  
        <p type="p">Lb:偏光</p>  
        <p type="p">N:缺陷</p>  
        <p type="p">O:原點</p>  
        <p type="p">P:稜鏡位置</p>  
        <p type="p">Pa:點</p>  
        <p type="p">Pb:點</p>  
        <p type="p">Q:絕對值</p>  
        <p type="p">Qa:下限</p>  
        <p type="p">Qb:上限</p>  
        <p type="p">W:基板</p>  
        <p type="p">Wa:表面(被檢查對象)</p>  
        <p type="p">δ:高低差</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1751" publication-number="202614228"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614228.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614228</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129933</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>圖案形成方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251225B">H01L21/3213</main-classification>  
        <further-classification edition="200601120251225B">H01L21/768</further-classification>  
        <further-classification edition="200601120251225B">H01L21/3065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山口達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAGUCHI, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種有助於半導體圖案化工序的產能或微細化的圖案形成方法。 &lt;br/&gt;一種圖案形成方法，係包含工序(a)~工序(f)。工序(a)，係準備基板，該基板係具備具有側面與上面的芯材及設置在芯材的上面且具有為與芯材的側面呈連續的面之側面的遮罩材。工序(b)，係以使芯材的側面的至少一部分位在較遮罩材的側面更內側之方式蝕刻芯材的側面來形成凹部。工序(c)，係將犧牲膜填埋在由芯材、遮罩材、及基板形成的凹部。工序(d)，係成膜出密封膜，該密封膜係具有覆蓋形成於凹部的犧牲膜的第1部分、與第1部分呈連續且覆蓋遮罩材的第2部分、及與第1部分呈連續且延伸到基板上的第3部分。工序(e)，係去除犧牲膜。工序(f)，係藉由蝕刻去除密封膜的第2部分及第3部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1752" publication-number="202613360"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613360.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613360</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129967</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板之製造方法、及基板之製造系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251220B">C23C18/42</main-classification>  
        <further-classification edition="200601120251220B">C23F1/28</further-classification>  
        <further-classification edition="200601120251220B">H05K3/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>幸内貴耶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOUCHI, TAKAYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴田周作</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBATA, SHUSAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之配線電路基板1之製造方法包含：蝕刻步驟，其係使用第1蝕刻液對不鏽鋼製之基材M之一部分進行蝕刻；及後處理步驟，其係利用第2蝕刻液對藉由蝕刻步驟而形成之端面S進行處理。第1蝕刻液能夠將不鏽鋼中之鐵溶解。第2蝕刻液能夠將蝕刻步驟中未溶解而殘留於端面S之金屬溶解。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:金屬支持層</p>  
        <p type="p">3:第1絕緣層</p>  
        <p type="p">4:電路圖案</p>  
        <p type="p">5:第2絕緣層</p>  
        <p type="p">41:配線</p>  
        <p type="p">G:殘留於端面S之金屬之粒子</p>  
        <p type="p">M:基材</p>  
        <p type="p">R1,R2:抗蝕塗層</p>  
        <p type="p">S:藉由蝕刻步驟而形成之端面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1753" publication-number="202614174"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614174.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614174</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114129979</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>高生長速率選擇性SI:P製程</chinese-title>  
        <english-title>HIGH GROWTH RATE SELECTIVE SI:P PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">H01L21/205</main-classification>  
        <further-classification edition="200601120251224B">H01L21/24</further-classification>  
        <further-classification edition="200601120251224B">H01L21/306</further-classification>  
        <further-classification edition="200601120251224B">C30B25/02</further-classification>  
        <further-classification edition="200601120251224B">C30B28/12</further-classification>  
        <further-classification edition="200601120251224B">C30B29/06</further-classification>  
        <further-classification edition="200601120251224B">C23C16/22</further-classification>  
        <further-classification edition="200601120251224B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳貞瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHEN-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>督比　阿布希雪克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUBE, ABHISHEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塔格瓦伊　塔赫雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAGHVAEE, TAHEREH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維拉卡爾　馬諾傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VELLAIKAL, MANOJ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布瑞爾　尼可拉斯路易斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BREIL, NICOLAS LOUIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例通常涉及選擇性沉積Si:P層到半導體結構的方法及製程。更具體地，本文所述的實施例提供了增強Si:P層在較低溫度下磊晶沉積到半導體結構的方法。在某些實施例中，一種方法包括在處理腔室的處理空間內定位基板，將包括矽源和摻雜氣體的製程氣體導入處理腔室，並在約為450°C或更低的處理溫度下，在基板的表面上形成磊晶層。矽源的分壓優選為約10Torr至約300Torr。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure generally relate to methods and processes to selectively deposit Si:P layers onto a semiconductor structure. More specifically, embodiments described herein provide for methods for enhancing epitaxial deposition of Si:P layers onto semiconductor structures at lower temperatures. In some embodiments, a method includes positioning a substrate within a processing volume of a processing chamber, introducing a process gas such as a silicon source and a dopant gas to the processing chamber, and forming an epitaxial layer on a surface of the substrate at a processing temperature of about 450 °C or less. The partial pressure of the silicon source is preferably about 10 Torr to about 300 Torr.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600c:經處理基板</p>  
        <p type="p">602:第一層</p>  
        <p type="p">604:特徵</p>  
        <p type="p">606:第二層</p>  
        <p type="p">608:磊晶層</p>  
        <p type="p">608a:結晶部分</p>  
        <p type="p">612a:層厚度</p>  
        <p type="p">612b:層厚度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1754" publication-number="202613357"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613357.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613357</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130031</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>階梯保形性擷取中之輪廓測量及用於其之工具</chinese-title>  
        <english-title>PROFILING IN STAIRCASE CONFORMALITY EXTRACTION AND A TOOL FOR THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">C23C16/52</main-classification>  
        <further-classification edition="200601120251217B">G05B13/02</further-classification>  
        <further-classification edition="200601120251217B">G01B11/24</further-classification>  
        <further-classification edition="200601120251217B">G01N21/95</further-classification>  
        <further-classification edition="200601120251217B">G01N35/00</further-classification>  
        <further-classification edition="200601120251217B">C23C16/455</further-classification>  
        <further-classification edition="200601120251217B">H01L21/205</further-classification>  
        <further-classification edition="200601120251217B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬蘭商皮寇桑公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PICOSUN OY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡洛馬奇　傑西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KALLIOMAKI, JESSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曼尼寧　伊爾卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MANNINEN, ILKKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FI</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於判定一薄膜製程前驅體之穿透深度的方法，其包含：提供一插入件(100)；將該插入件(100)配置成接觸一基體(200)以在該插入件(100)與該基體(200)之間形成複數個空間(101)；以及將該一或多個前驅體饋送至所形成空間(101)中以判定該前驅體之該穿透深度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for determining penetration depth of a thin film process precursor, comprising providing an insert (100), arranging the insert (100) to contact a substrate (200) to form a plurality of spaces (101) in between the insert (100) and the substrate (200), and feeding the precursor(s) into the formed spaces (101) to determine the penetration depth of the precursor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:插入件</p>  
        <p type="p">101:空間</p>  
        <p type="p">110:孔隙，插入件開口，空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1755" publication-number="202614472"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614472.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614472</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130062</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池組</chinese-title>  
        <english-title>BATTERY PACK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251230B">H01M50/383</main-classification>  
        <further-classification edition="202101120251230B">H01M50/143</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金在相</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JAE SANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李炫宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYUN JONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是關於一種具有火焰流路設計的電池組，其提供一種電池組包括：組體；底座蓋，設置於組體上，並具有與組體的內部連通的孔以及連接至孔的流路；壓力閥，安裝於底座蓋的孔中；把手，設置於底座蓋上；以及把手蓋，設置於把手上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a battery pack having a flame flow path design, which provides a battery pack comprising: a pack body; a base cover disposed on the pack body, and having a hole communicating with the inside of the pack body and a flow path connected to the hole; a pressure valve installed in the hole of the base cover; a handle disposed on the base cover; and a handle cover disposed on the handle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:組體</p>  
        <p type="p">20:底座蓋</p>  
        <p type="p">30:壓力閥</p>  
        <p type="p">40:把手</p>  
        <p type="p">42:固定件</p>  
        <p type="p">50:把手蓋</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1756" publication-number="202613236"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613236.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613236</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130101</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、複合材料及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">C08L33/06</main-classification>  
        <further-classification edition="200601120251218B">C08L63/02</further-classification>  
        <further-classification edition="200601120251218B">C08L25/08</further-classification>  
        <further-classification edition="200601120251218B">C08K5/14</further-classification>  
        <further-classification edition="200601120251218B">C08K5/098</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林健一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中西絵梨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANISHI, ERI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供可在低溫且短時間內硬化之樹脂組成物，以及含有前述樹脂組成物與纖維基材之複合材料。 &lt;br/&gt;　　[解決手段]一種樹脂組成物，係含有：乙烯酯樹脂(A)；含乙烯性不飽和基之單體(B)；含金屬之化合物(C)；有機過氧化物(D)；含巰基之化合物(E)；前述含金屬之化合物(C)為含有元素周期表VIIB族至IB族之金屬元素之化合物，前述含金屬之化合物(C)之金屬換算含量，相對於前述乙烯酯樹脂(A)及含乙烯性不飽和基之單體(B)之合計100質量份，為0.1×10&lt;sup&gt;-6&lt;/sup&gt;質量份至2000×10&lt;sup&gt;-6&lt;/sup&gt;質量份。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1757" publication-number="202613160"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613160.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613160</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130105</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中和Ｂ型肝炎病毒之抗體和彼之用途</chinese-title>  
        <english-title>ANTIBODIES THAT NEUTRALIZE HEPATITIS B VIRUS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/08</main-classification>  
        <further-classification edition="200601120260102B">C12N15/13</further-classification>  
        <further-classification edition="200601120260102B">C12N15/63</further-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="200601120260102B">A61P31/20</further-classification>  
        <further-classification edition="200601120260102B">G01N33/569</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商休曼斯生物醫藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUMABS BIOMED SA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇提　戴維德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORTI, DAVIDE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於抗體及其抗原結合片段，該抗體及其抗原結合片段可結合B型肝炎表面抗原(HBsAg)之抗原環圈區，並可中和B型肝炎病毒(HBV)及D型肝炎病毒(HDV)兩者的感染。本發明亦關於與該抗體及其抗原結合片段結合的表位、包含該抗原結合片段的融合蛋白、及編碼此等抗體及抗體片段的核酸和製造此等抗體及抗體片段的細胞。此外，本發明關於所揭示之抗體及抗體片段在診斷、預防及治療B型肝炎和D型肝炎的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to antibodies, and antigen binding fragments thereof, that can bind to the antigenic loop region of hepatitis B surface antigen (HBsAg) and can neutralize infection of both hepatitis B virus (HBV) and hepatitis delta virus (HDV). The present disclosure also relates to epitopes to which the antibodies and antigen binding fragments bind, as well as to fusion proteins that comprise the antigen binding fragments, and to nucleic acids that encode and cells that produce such antibodies and antibody fragments. In addition, the present disclosure relates to the use of the antibodies and antibody fragments of the present disclosure in the diagnosis, prophylaxis and treatment of hepatitis B and hepatitis D.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1758" publication-number="202614658"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614658.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614658</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130126</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物聯網網路中的傳輸器線性化</chinese-title>  
        <english-title>TRANSMITTER LINEARIZATION IN AN INTERNET OF THINGS NETWORK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251229B">H04W52/02</main-classification>  
        <further-classification edition="201801120251229B">H04W4/70</further-classification>  
        <further-classification edition="200601120251229B">H04L27/26</further-classification>  
        <further-classification edition="201701120251229B">H04B7/0413</further-classification>  
        <further-classification edition="200601120251229B">H03F1/32</further-classification>  
        <further-classification edition="200901120251229B">H04W24/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫馬　薩提許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, SATISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮納尤昌德拉瑟卡蘭　薩拉蒂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PINAYOUR CHANDRASEKARAN, SARATH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的各種態樣大致上係關於無線通訊。在一些態樣中，一種傳輸裝置可至少部分地基於意圖用於一組物聯網(IoT)裝置的一組信號來判定一組填充音調。該組填充音調可經判定以維持峰值能量、平均功率、峰均功率比、或其組合。該傳輸裝置可在第一時間週期並使用第一天線群組將該組信號結合該組填充音調傳輸至該組IoT裝置。描述多種其他態樣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a transmitting device may determine a set of filler tones based at least in part on a set of signals intended for a set of Internet of Things (IoT) devices. The set of filler tones may be determined to maintain a peak energy, an average power, a peak-to-average power ratio, or a combination thereof. The transmitting device may transmit, in a first time period and using a first antenna group, the set of signals in combination with the set of filler tones to the set of IoT devices. Numerous other aspects are described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">580:實例</p>  
        <p type="p">581-1,581-2,581-3,581-4,581-5,581-6:時間</p>  
        <p type="p">583-1~583-20:頻率</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1759" publication-number="202612832"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612832.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612832</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130134</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷射系統及雷射產生方法</chinese-title>  
        <english-title>LASER SYSTEM AND LASER GENERATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251229B">B23K26/082</main-classification>  
        <further-classification edition="201401120251229B">B23K26/064</further-classification>  
        <further-classification edition="201401120251229B">B23K26/70</further-classification>  
        <further-classification edition="201401120251229B">B23K26/364</further-classification>  
        <further-classification edition="200601120251229B">H05G1/54</further-classification>  
        <further-classification edition="200601120251229B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商創浦半導體製造雷射系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRUMPF LASERSYSTEMS FOR SEMICONDUCTOR MANUFACTURING SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁佳躍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, JIAYUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲利佩　馬汀斯　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FILIPE MARTINS, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　德　唐真　賽曼斯　裘漢納斯　葛瑞德斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN DEN DUNGEN, CLEMENS JOHANNES GERARDUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朗格　馬可　克里斯蒂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANGE, MARC CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里加德　伯瑞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REGAARD, BORIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施洛瑟　奧利佛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHLOSSER, OLIVER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍普夫　安迪亞司　克里斯蒂安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOPF, ANDREAS KRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種雷射系統，其包含用以反射一雷射光束之反射光學元件，該等反射光學元件經配置以形成用於該雷射光束之一光束路徑。該雷射系統包含一真空環境。該等反射光學元件中之至少一者特定地配置於該真空環境中，且安裝於該雷射系統之一基板上。該雷射系統包含一第一容積，該第一容積維持在不同於一周圍大氣壓力的一壓力下，且特定地用一氣體吹掃。該雷射系統進一步包含壓力偵測構件，該等壓力偵測構件經配置以偵測包含於該基板中之該第一容積中之壓力的一減小及/或一增大。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A laser system comprising reflective optical elements to reflect a laser beam, the reflective optical elements arranged to form a beam path for the laser beam. The laser system comprises a vacuum environment. At least one of the reflective optical elements is particularly arranged in the vacuum environment and mounted on a substrate of the laser system, The laser system comprises a first volume which is maintained under a pressure different from a surrounding atmospheric pressure and, in particular, is purged with a gas. The laser system further comprises pressure detection means arranged to detect a decrease and/or an increase in pressure in the first volume comprised in the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">CON:控制器</p>  
        <p type="p">DMM:熔融金屬液滴/熔融合金液滴</p>  
        <p type="p">MNPL:主脈衝雷射源</p>  
        <p type="p">OE:反射光學元件</p>  
        <p type="p">OES:基板</p>  
        <p type="p">OOE:輸出反射光學元件</p>  
        <p type="p">PGD:氣體供應導管</p>  
        <p type="p">PGI:吹掃氣體入口</p>  
        <p type="p">PGV:第二容積</p>  
        <p type="p">PGPS:壓力感測器</p>  
        <p type="p">PRPL:預脈衝雷射源</p>  
        <p type="p">POE:反射光學元件</p>  
        <p type="p">VOL:第一容積</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1760" publication-number="202614461"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614461.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614461</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130167</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含電池巢之互連件及組裝包含此互連件之電化學電池堆疊的方法</chinese-title>  
        <english-title>INTERCONNECT INCLUDING CELL NEST AND METHOD OF ASSEMBLING AN ELECTROCHEMICAL CELL STACK INCLUDING THE INTERCONNECT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251226B">H01M8/0202</main-classification>  
        <further-classification edition="201601120251226B">H01M8/0258</further-classification>  
        <further-classification edition="201601120251226B">H01M8/0271</further-classification>  
        <further-classification edition="201601120251226B">H01M8/2465</further-classification>  
        <further-classification edition="202101120251226B">C25B9/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商博隆能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BLOOM ENERGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施莫斯　托維斯　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMAUSS, TRAVIS A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博恩　沙卡爾　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BONE, SAGAR R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕哈　薩金</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARHAR, SACHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧　自桂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, ZIGUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾　巴塔維　伊瑪德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EL BATAWI, EMAD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於電化學電池堆疊之互連件，其包含反應劑孔及反應劑側，該等反應劑孔延伸穿過該互連件，該反應劑側包含：反應劑場，其含有延伸於該等反應劑孔之間的反應劑通道及反應劑肋；周邊密封表面，其包圍該反應劑場及該等反應劑孔；凹槽密封表面，其在該反應劑場之對置側上安置於該周邊密封表面之部分內部且相對於該周邊密封表面凹陷；及巢側壁，其等將該凹槽密封表面連接至該周邊密封表面。該等巢側壁實質上垂直於該周邊密封表面及該等凹槽密封表面延伸。該等巢側壁、該等凹槽密封表面及該等反應劑肋之頂部至少部分界定經組態以接收電化學電池之電池巢。空氣側包含安置於該等反應劑孔之間的空氣場及圍繞該等反應劑孔安置之環密封表面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An interconnect for an electrochemical cell stack includes reactant holes that extend through the interconnect, and a reactant side including a reactant field containing reactant channels and reactant ribs that extend between the reactant holes, a peripheral seal surface that surrounds the reactant field and the reactant holes, recess seal surfaces disposed inside portions of the peripheral seal surface on opposing sides of the reactant field and recessed relative to the peripheral seal surface, and nest sidewalls that connect the recess seal surfaces to the peripheral seal surface. The nest sidewalls extend substantially perpendicular to the peripheral seal surface and to the recess seal surfaces. The nest sidewalls, the recess seal surfaces, and tops of the reactant ribs at least partially define a cell nest configured to receive an electrochemical cell. An air side includes an air field disposed between the reactant holes, and ring seal surfaces disposed around the reactant holes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電化學電池</p>  
        <p type="p">150:接觸層</p>  
        <p type="p">200:第一互連件</p>  
        <p type="p">200':第二互連件</p>  
        <p type="p">204:周邊密封表面</p>  
        <p type="p">205:巢側壁/銅焊材料</p>  
        <p type="p">206:凹槽密封表面</p>  
        <p type="p">208:電池巢</p>  
        <p type="p">224:反應劑肋</p>  
        <p type="p">234:空氣肋</p>  
        <p type="p">236:空氣側凹槽</p>  
        <p type="p">250:邊緣密封件</p>  
        <p type="p">252:凹槽密封件</p>  
        <p type="p">252H:水平部分</p>  
        <p type="p">252V:豎直部分</p>  
        <p type="p">254:環密封件</p>  
        <p type="p">300:單元電池</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1761" publication-number="202613548"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613548.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613548</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130226</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>癌症之高通量診斷方法及治療劑之開發</chinese-title>  
        <english-title>METHODS FOR HIGH THROUGHPUT DIAGNOSTICS AND THERAPEUTIC DEVELOPMENT OF AGENTS FOR CANCER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">G01N33/574</main-classification>  
        <further-classification edition="201801120251217B">G16H50/20</further-classification>  
        <further-classification edition="200601120251217B">G01N33/487</further-classification>  
        <further-classification edition="202401120251217B">G01N15/14</further-classification>  
        <further-classification edition="201701120251217B">G06T7/40</further-classification>  
        <further-classification edition="202201120251217B">G06V10/40</further-classification>  
        <further-classification edition="202301120251217B">G06F18/21</further-classification>  
        <further-classification edition="201901120251217B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>愛爾蘭商奧夫博醫療創新有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AUFBAU MEDICAL INNOVATIONS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沛納　約翰　Ｔ　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PENA, JOHN T. G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何　凱瑟琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, KATHLEEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯塔法斯　伊里亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUTAVAS, ELIAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席蘇恩　格莫爾　Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HISUIN, GEMAL H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ET</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德　亞哥斯提諾　盧卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>D'AGOSTINO, LUCA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷立　大衛　Ｄ　二世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HURLEY, DAVID D., II</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅拉恩　高米　法里德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEHRAEIN-GHOMI, FARIDEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛席巴克茲　史蒂芬妮　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRZYBACZ, SHAYNA F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝爾德奈　夏納　Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELDNER, SHAYNA F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森席爾瑪尼　許盧西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENTHILMANI, SHRUTHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芙洛姆沛奇魯特　恰拉奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHROMPECHRUT, CHAIRATCH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴里　莎拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAHRI, SARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宇澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述可用於基於來自生物流體之細胞外基質體（ECMB）之形態分析來預測癌症的系統、裝置及方法。預測癌症之方法可包含接收對應於自人類或其他動物個體之生物流體分離之ECMB的影像資料；基於該影像資料產生ECMB資料；及至少基於該ECMB資料預測癌症參數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described here are systems, devices, and methods useful for predicting cancer based on morphological analysis of extra-cellular matrix bodies (ECMBs) from a biological fluid. A method of predicting cancer may comprise receiving image data corresponding to ECMBs separated from a biological fluid of a human or other animal subject, generating ECMB data based on the image data, and predicting a cancer parameter based on at least the ECMB data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:方法</p>  
        <p type="p">102:步驟</p>  
        <p type="p">104:步驟</p>  
        <p type="p">106:步驟</p>  
        <p type="p">108:步驟</p>  
        <p type="p">110:步驟</p>  
        <p type="p">112:步驟</p>  
        <p type="p">114:步驟</p>  
        <p type="p">116:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1762" publication-number="202614334"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614334.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614334</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130237</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>映射裝置、基板處理裝置、映射方法、半導體裝置之製造方法及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/68</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商國際電氣股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昭成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, AKINARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>手塚重倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEZUKA, SHIGENORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴田仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBATA, JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黑澤敏晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROSAWA, TOSHIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供能判別晶圓材質的技術。 &lt;br/&gt;本發明係具備有：(a)複數投光器，係排列成可對依既定間隔排列的複數基板分別照射參考光；(b)複數受光器，係配置於上述複數投光器的對面，可檢測穿透過各自對應之基板的光；(c)驅動部，係依上述複數基板通過連結上述複數投光器、與所對應之上述複數受光器的各者之複數光軸上之方式，使上述複數基板進行相對移動；(d)判定部，係根據複數受光器的受光強度，分別執行既定判定；以及(e)判別部，其係根據上述判定部的判定結果，判別上述複數基板的材質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">111:梳狀感測器</p>  
        <p type="p">112:梳狀框體</p>  
        <p type="p">112a~112d:突起部</p>  
        <p type="p">113,113a~113d:發光器(投光器)</p>  
        <p type="p">114,114a~114d:受光器</p>  
        <p type="p">115:判定部</p>  
        <p type="p">115a:第1比較器</p>  
        <p type="p">115b:第2比較器</p>  
        <p type="p">115c:保持器</p>  
        <p type="p">116:閾值設定部</p>  
        <p type="p">117:判別部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1763" publication-number="202614559"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614559.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614559</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130240</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於控制半導體製造系統之匹配網路的系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD FOR CONTROLLING A MATCHING NETWORK OF A SEMICONDUCTOR MANUFACTURING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H03H7/38</main-classification>  
        <further-classification edition="200601120251217B">H03H7/40</further-classification>  
        <further-classification edition="200601120251217B">C23C16/505</further-classification>  
        <further-classification edition="200601120251217B">H01J37/32</further-classification>  
        <further-classification edition="200601120251217B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布塔　伊姆蘭　艾哈邁德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHUTTA, IMRAN AHMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛齊克　托米斯拉夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOZIC, TOMISLAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種用於控制一半導體製造系統之一匹配網路的系統。該匹配網路包含一電子可變電抗元件(electronically variable reactance element；EVRE)，該EVRE使用不同匹配配置使其總電抗變化。一電漿腔室在一基板上進行一製程，該製程包含至少包含一第一製程步驟及一第二製程步驟之製程步驟。針對各製程步驟，一記憶體儲存用於進行該製程步驟之指令。一控制電路在連續進行該製程之該等製程步驟中之各者的同時，在預期到該電漿腔室將該第一製程步驟轉變至該第二製程步驟後，基於用於進行該第二製程步驟之該等指令而將匹配配置變更至一新匹配配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system for controlling a matching network of a semiconductor manufacturing system is disclosed. The matching network comprises an electronically variable reactance element (EVRE) that varies its total reactance using different match configurations. A plasma chamber carries out a process upon a substrate, the process comprising process steps including at least a first process step and a second process step. A memory, for each process step, stores instructions for carrying out the process step. A control circuit, while continuously carrying out each of the process steps of the process, upon anticipation that the plasma chamber will be transitioning from the first process step to the second process step, alters the match configuration to a new match configuration based on the instructions for carrying out the second process step.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:方法</p>  
        <p type="p">51:第一操作</p>  
        <p type="p">52:第二操作</p>  
        <p type="p">53:第三操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1764" publication-number="202614295"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614295.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614295</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130262</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L21/67</main-classification>  
        <further-classification edition="200601120251229B">B05C5/02</further-classification>  
        <further-classification edition="200601120251229B">G05D16/20</further-classification>  
        <further-classification edition="200601120251229B">G05D7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏山真人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASHIYAMA, MASAHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係具備：於泵15之下游由合流配管20b分歧而成，對腔室內之複數種之處理部輸送處理液的複數根之支管；與控制泵15之控制部139；複數根之支管係包含：處理液之流量最多的預濕配管PW；與處理液之流量較預濕配管PW之流量少的筒清洗配管PTR；於複數根之支管中之預濕配管PW設置檢測處理液壓力的壓力感測器51；控制部139係以由壓力感測器51檢測出既定值的方式控制泵15之輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:塗佈器區塊</p>  
        <p type="p">6:脫氣腔室</p>  
        <p type="p">6a:第1脫氣裝置</p>  
        <p type="p">6b:第2脫氣裝置</p>  
        <p type="p">11:第1槽</p>  
        <p type="p">12,22:三方閥</p>  
        <p type="p">13,23:發泡器</p>  
        <p type="p">14,24:感測器</p>  
        <p type="p">15,25:泵</p>  
        <p type="p">16,17,26,27,61,62,63,64,71,72,73,74,81,82,83,84,91,92,93,94:閥</p>  
        <p type="p">18,28:排洩器</p>  
        <p type="p">19a,29a:流入配管</p>  
        <p type="p">19b,29b:流出配管</p>  
        <p type="p">19c,29c:回送配管</p>  
        <p type="p">19d,19e,29d:分歧點</p>  
        <p type="p">20a:合流點</p>  
        <p type="p">20b:合流配管</p>  
        <p type="p">20c:上游配管</p>  
        <p type="p">21:第2槽</p>  
        <p type="p">41,42,43,44:光阻腔室</p>  
        <p type="p">50:溶劑供給源</p>  
        <p type="p">51:壓力感測器</p>  
        <p type="p">52,53,54:調節器</p>  
        <p type="p">105,205:流入口</p>  
        <p type="p">106,206:流出口</p>  
        <p type="p">107,207:排氣口</p>  
        <p type="p">139:控制部</p>  
        <p type="p">BR:背清洗配管</p>  
        <p type="p">BR1,BR2,BR3,BR4:背清洗枝管</p>  
        <p type="p">CR:杯清洗配管</p>  
        <p type="p">CR1,CR2,CR3,CR4:杯清洗枝管</p>  
        <p type="p">EBR:邊緣清洗配管</p>  
        <p type="p">EBR1,EBR2,EBR3,EBR4:邊緣清洗枝管</p>  
        <p type="p">PTR:筒清洗配管</p>  
        <p type="p">PTR1,PTR2,PTR3,PTR4:筒清洗枝管</p>  
        <p type="p">PW:預濕配管</p>  
        <p type="p">PW1,PW2,PW3,PW4:預濕枝管</p>  
        <p type="p">TP1:第1分歧點</p>  
        <p type="p">TP2:第2分歧點</p>  
        <p type="p">TP3:第3分歧點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1765" publication-number="202613216"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613216.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613216</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130290</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶聚酯線的網布</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">C08J5/20</main-classification>  
        <further-classification edition="200601120251218B">C08L67/03</further-classification>  
        <further-classification edition="200601120251218B">D06M15/19</further-classification>  
        <further-classification edition="200601120251218B">B29C43/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＮＢＣ紗網技術股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NBC MESHTEC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高森萬悠子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAMORI, MAYUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雨宮陽介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMEMIYA, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本島信一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOTOJIMA, NOBUKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泉想馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IZUMI, SOMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明可抑制伴隨加熱的網布的厚度恢復。一種網布，其是經薄化處理而成之液晶聚酯線的網布，該網布在180℃中的加熱處理之前後的網布的厚度，由下述公式(I)表示的厚度變化率為0%以上且25.0%以下。&lt;br/&gt; Δt=100×(t2－t1)／t1  ･･･(I)&lt;br/&gt; 上述公式(I)中，Δt為厚度變化率，t1為加熱處理之前的網布的厚度，t2為加熱處理之後的網布的厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1766" publication-number="202613078"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613078.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613078</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130301</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於ＮＡＤＰＨ氧化酶抑制和組蛋白去乙醯化酶抑制的雙功能化合物</chinese-title>  
        <english-title>DUAL FUNCTION COMPOUNDS FOR NADPH OXIDASE INHIBITION AND HISTONE DEACETYLASE INHIBITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D215/38</main-classification>  
        <further-classification edition="200601120260102B">C07D215/20</further-classification>  
        <further-classification edition="200601120260102B">A61K31/47</further-classification>  
        <further-classification edition="201701120260102B">A61K47/54</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>景凱生物科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIWANJ PHARMACEUTICALS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, ON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>連聖傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIEN, SHENG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佳駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIA-CHUENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳冠賜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇建太</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種如下式(I)所示的化合物及其藥學上可接受之鹽：</p>  
        <p type="p">M&lt;sub&gt;Nox&lt;/sub&gt;-L-ZBG (I)</p>  
        <p type="p">其中，M&lt;sub&gt;Nox&lt;/sub&gt;、L及ZBG如說明書中所定義。本揭露亦提供以式(I)化合物或其藥學上可接受之鹽治療癌症的方法及包含其的藥物組合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are compounds of Formula (I) below and pharmaceutically acceptable salts thereof:</p>  
        <p type="p">M&lt;sub&gt;Nox&lt;/sub&gt;-L-ZBG (I)</p>  
        <p type="p">in which each of variables M&lt;sub&gt;Nox&lt;/sub&gt;, L and ZBG is defined herein. Also disclosed is a method for treating a cancer with a compound of Formula (I) or a pharmaceutically acceptable salt thereof and a pharmaceutical composition containing the same.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1767" publication-number="202614782"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614782.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614782</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130305</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積集電感元件的封裝模組</chinese-title>  
        <english-title>PACKAGED MODULE WITH INTEGRATED INDUCTIVE COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251224B">H10D1/20</main-classification>  
        <further-classification edition="200601120251224B">H01F1/20</further-classification>  
        <further-classification edition="202301120251224B">H01L25/16</further-classification>  
        <further-classification edition="200601120251224B">H01F17/02</further-classification>  
        <further-classification edition="200601120251224B">H01F1/26</further-classification>  
        <further-classification edition="200601120251224B">H01F27/28</further-classification>  
        <further-classification edition="200601120251224B">H01L23/29</further-classification>  
        <further-classification edition="200701120251224B">H02M1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫至堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, ZHIJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金洸洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KWANG-SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓笛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, DI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜　劍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請請求保護一種封裝模組，包括設置在基板上的導電線圈和封裝該封裝模組的磁性模塑料。該磁性模塑料包含分散在非磁性材料中的包覆型磁性金屬顆粒。該封裝模組可適用於電源管理設備或電源轉換應用系統，以提高系統的積集密度和/或功率密度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A packaged module including an electrically conductive coil disposed on a substrate and a magnetic molding compound encapsulating the packaged module. The magnetic molding compound includes coated magnetic metal particles dispersed in a non-magnetic material. The packaged module may be adapted to be used in a power management apparatus or a power conversion application system to increase an integration density and/or a power density of the system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:封裝模組</p>  
        <p type="p">11:基板</p>  
        <p type="p">11D:第二表面</p>  
        <p type="p">11U:第一表面</p>  
        <p type="p">12:功率開關單元</p>  
        <p type="p">12B:背面</p>  
        <p type="p">12T:頂面</p>  
        <p type="p">13:導電線圈</p>  
        <p type="p">13S:主體/虛線方塊</p>  
        <p type="p">14:磁性模塑料(MMC)</p>  
        <p type="p">15:電容性儲能裝置</p>  
        <p type="p">111:導電佈線結構</p>  
        <p type="p">112:焊墊</p>  
        <p type="p">113:接腳</p>  
        <p type="p">121:導電焊墊</p>  
        <p type="p">122:底部填充材料</p>  
        <p type="p">123:導電柱/凸塊</p>  
        <p type="p">124:導電晶片附著材料</p>  
        <p type="p">131:第一線圈端子</p>  
        <p type="p">132:第二線圈端子</p>  
        <p type="p">133:導電附著材料</p>  
        <p type="p">136:薄絕緣層</p>  
        <p type="p">141:非磁性材料</p>  
        <p type="p">142:包覆型磁性金屬顆粒</p>  
        <p type="p">143:磁性金屬顆粒</p>  
        <p type="p">144:絕緣包覆層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1768" publication-number="202614824"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614824.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614824</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130327</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有調諧材料的氧化物半導體裝置</chinese-title>  
        <english-title>OXIDE SEMICONDUCTOR DEVICES WITH TUNING MATERIALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251219B">H10D30/67</main-classification>  
        <further-classification edition="202501120251219B">H10D62/60</further-classification>  
        <further-classification edition="202501120251219B">H10D62/80</further-classification>  
        <further-classification edition="202501120251219B">H10D64/68</further-classification>  
        <further-classification edition="202501120251219B">H10D30/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商齊耐特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZINITE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬　艾利克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, ALEX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曉泰　傑姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHOUTE, GEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在薄膜電晶體中，調諧材料本體係設置在基板與通道材料本體之間。該調諧材料本體自該通道材料本體、閘極介電材料本體、或該通道材料本體與該閘極介電材料本體兩者中移除非期望的化學物質。可設置阻隔材料本體以抑制可能由閘極材料本體所引起的此類調諧。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In a thin-film transistor, a body of tuning material is provided between a substrate and a body of channel material. The body of tuning material removes undesirable chemical species from the body of channel material, a body of gate dielectric material, or both the body of channel material and the body of gate dielectric material. A body of blocking material may be provided to inhibit such tuning that may be caused by a body of gate material.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:薄膜電晶體(TFT)</p>  
        <p type="p">12:源極</p>  
        <p type="p">14:汲極</p>  
        <p type="p">16:閘極</p>  
        <p type="p">20:基板</p>  
        <p type="p">24d:汲極材料</p>  
        <p type="p">24s:源極材料</p>  
        <p type="p">30:通道材料</p>  
        <p type="p">32:閘極介電材料</p>  
        <p type="p">34:閘極材料</p>  
        <p type="p">40:調諧材料</p>  
        <p type="p">42:中介材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1769" publication-number="202613280"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613280.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613280</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130332</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>蝕刻方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">C09K13/06</main-classification>  
        <further-classification edition="200601120251218B">C23F1/26</further-classification>  
        <further-classification edition="200601120251218B">H01L21/3213</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商花王股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡崎翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAZAKI, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>木村陽介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMURA, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明於一態樣中提供一種蝕刻方法，其即便重複使用蝕刻液，亦可抑制蝕刻液之初次使用時之蝕刻速度、與蝕刻液之重複使用時之蝕刻速度之間的速度不均。 &lt;br/&gt;本發明於一態樣中係關於一種蝕刻方法，其包括將包含第6族元素金屬之被蝕刻層利用蝕刻液進行蝕刻之步驟。上述蝕刻液包含下述成分A、成分B、成分C、成分D、成分E及第6族元素金屬離子，第6族元素金屬離子之含量為0.005質量%以上，且成分E與第6族元素金屬離子之質量比(成分E/第6族元素金屬離子)為1以上。 &lt;br/&gt;成分A：磷酸 &lt;br/&gt;成分B：硝酸 &lt;br/&gt;成分C：水 &lt;br/&gt;成分D：平均分子量為300以上之多胺 &lt;br/&gt;成分E：含氮鹼性化合物(成分D除外)</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1770" publication-number="202612696"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612696.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612696</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130339</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種治療帕金森綜合症或帕金森病的方法和藥物組合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/485</main-classification>  
        <further-classification edition="200601120260102B">A61K31/445</further-classification>  
        <further-classification edition="200601120260102B">A61P25/16</further-classification>  
        <further-classification edition="200601120260102B">A61P1/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商鹽野義有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIONOGI CHINA CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山川英訓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAKAWA, HIDEKUNI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>殷莉妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, LINI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種治療帕金森綜合症或帕金森病的方法和藥物組合物，具體涉及外周μ-鴉片受體拮抗劑用於治療帕金森綜合症或帕金森病的藥物組合物、用途和方法，本發明的藥物組合物、用途和方法可顯著改善帕金森綜合症或帕金森病的症狀，包括便秘，特別是用通用型便秘藥物治療無效或難治的便秘</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1771" publication-number="202614427"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614427.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614427</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130352</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用薄膜元件的取放製造</chinese-title>  
        <english-title>PICK AND PLACE FABRICATION USING THIN FILM COMPONENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">H01L23/522</main-classification>  
        <further-classification edition="200601120251218B">H01L21/48</further-classification>  
        <further-classification edition="200601120251218B">H01L21/78</further-classification>  
        <further-classification edition="200601120251218B">H01L23/488</further-classification>  
        <further-classification edition="200601120251218B">H05K3/34</further-classification>  
        <further-classification edition="200601120251218B">H01R43/02</further-classification>  
        <further-classification edition="201101120251218B">H01R12/71</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＢＡＥ系統資訊及電子系統整合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威考夫　納旦尼爾Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WYCKOFF, NATHANIEL P</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃倫　亞歷山大Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WARREN, ALEXANDER S</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特里　班傑明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERRY, BENJAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>利特勒　萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITTLER, RYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種用於製造電子裝置的技術。根據一個實施例，實施該技術的方法論包括在一晶片基板上形成複數個薄膜元件。該方法亦包括從該晶片基板上切割出一或多個薄膜元件及從該晶片基板中提取經切割之一或多個薄膜元件。該方法還包括將該經切割之一或多個薄膜元件沉積到一印刷電路板(PCB)組件之接墊上。該方法還包括施行導體迴流以將經沉積之該一或多個薄膜元件電耦合到該PCB組件之該接墊。該薄膜元件包括釋放層、焊錫層、焊錫阻障層、非潤濕焊錫阻障層、鈍化層及元件功能層。元件功能層可提供電阻值功能、電容值功能、二極體功能或熱電偶功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques are provided for fabrication of an electronic device. A methodology implementing the techniques according to an embodiment includes forming a plurality of thin film components on a wafer substrate. The method also includes cutting one or more of the thin film components from the wafer substrate and extracting the one or more of the thin film components from the wafer substrate. The method further includes depositing the extracted thin film components onto pads of a printed circuit board (PCB) assembly. The method further includes performing a solder reflow to electrically couple the one or more thin film components onto the pads of the PCB assembly. The thin film component comprises a release layer, solder layers, solder barrier layers, non-wetting solder barrier layers, a passivation layer, and a component function layer. The component function layer may provide a resistive function, a capacitive function, a diode function, or a thermocouple function.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:薄膜電容器</p>  
        <p type="p">310:鈍化金屬層</p>  
        <p type="p">320a:第一焊錫阻障金屬層</p>  
        <p type="p">320b:第二焊錫阻障金屬層</p>  
        <p type="p">330a:第一非潤濕焊錫阻障金屬層</p>  
        <p type="p">330b:第二非潤濕焊錫阻障金屬層</p>  
        <p type="p">340:非潤濕焊錫阻障金屬層</p>  
        <p type="p">350:焊錫金屬層</p>  
        <p type="p">360:釋放層</p>  
        <p type="p">370:厚度</p>  
        <p type="p">380:直徑</p>  
        <p type="p">390:單一層</p>  
        <p type="p">T1:厚度</p>  
        <p type="p">T2:單一層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1772" publication-number="202613197"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613197.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613197</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130358</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>中空樹脂粒子及其用途</chinese-title>  
        <english-title>HOLLOW RESIN PARTICLE AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">C08F212/36</main-classification>  
        <further-classification edition="200601120251216B">C08F2/18</further-classification>  
        <further-classification edition="200601120251216B">C08K5/01</further-classification>  
        <further-classification edition="200601120251216B">B01J13/02</further-classification>  
        <further-classification edition="200601120251216B">B01J13/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商積水化成品工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKISUI KASEI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>向井健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKAI, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松野晋弥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUNO, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在本發明之實施型態所得到的中空樹脂粒子，係具有殼體部及被該殼體部所包圍之中空部分，且，該殼體部係包含藉由含有交聯性單體的單體成分(M)之反應所得到的聚合物(P)，該單體成分(M)中之該交聯性單體的含有比率為40重量%至100重量%，且平均粒徑為0.1μm至1μm，並在氮氣環境、350℃下加熱2小時後之熱失重率係小於40%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A hollow resin particle according to an embodiment of the present invention has a shell portion and a hollow portion surrounded by the shell portion. The shell portion contains a polymer (P) obtained by a reaction of a monomer component (M) that contains a crosslinkable monomer. The content of the crosslinkable monomer in the monomer component (M) is 40% to 100% by weight, the particle has an average particle diameter of 0.1 to 1 μm, and the particle exhibits a thermal weight loss of less than 40% after being heated at 350℃ for 2 hours in a nitrogen atmosphere.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">本案無圖式。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1773" publication-number="202614089"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614089.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614089</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130361</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理方法、資訊處理裝置、記錄媒體及程式製品</chinese-title>  
        <english-title>INFORMATION PROCESSING METHOD, INFORMATION PROCESSING DEVICE, RECORDING MEDIUM, AND PROGRAM PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251217B">G16H50/20</main-classification>  
        <further-classification edition="201801120251217B">G16H50/30</further-classification>  
        <further-classification edition="200601120251217B">A61B5/00</further-classification>  
        <further-classification edition="200601120251217B">G01N33/48</further-classification>  
        <further-classification edition="201801120251217B">G16H10/60</further-classification>  
        <further-classification edition="201901120251217B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関口美知留</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKIGUCHI, MICHIRU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林健太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋康彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, YASUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可使用生物感測器而判定疾病之可能性之資訊處理方法等。資訊處理方法係由電腦執行如下處理：取得針對從對象採集之試料藉由生物感測器而得之感測資料，且將所取得之前述感測資料與前述對象之識別資訊以建立關聯之方式予以記憶，並根據前述感測資料而判定前述對象中之疾病之可能性，且將所判定之前述疾病之可能性輸出至前述對象之識別資訊所對應之輸出目的地。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an information processing method that can determine the possibility of disease using a biosensor, and so forth. An information processing method according to the present invention involves a computer executing the following processes: acquiring sensor data from a sample collected from a subject using a biosensor; storing the acquired sensor data in a manner that is associated with the subject’s identification information; determining the possibility of disease in the subject based on the sensor data; and outputting the determined possibility of disease to an output destination corresponding to the subject’s identification information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:判定裝置</p>  
        <p type="p">2:終端裝置</p>  
        <p type="p">3:檢測裝置</p>  
        <p type="p">4:嗅覺感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1774" publication-number="202614315"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614315.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614315</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130373</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有撓性保持特徵的匣</chinese-title>  
        <english-title>CASSETTE HAVING FLEXIBLE RETENTION FEATURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H01L21/673</main-classification>  
        <further-classification edition="200601120251217B">B65D43/26</further-classification>  
        <further-classification edition="200601120251217B">B65D81/02</further-classification>  
        <further-classification edition="200601120251217B">B65D25/10</further-classification>  
        <further-classification edition="200601120251217B">B65D25/28</further-classification>  
        <further-classification edition="200601120251217B">B65D85/86</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾布德　穆托利布　穆罕默德　扎卡利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABD MUTHOLIB, MOHAMAD ZAKARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林　欣潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, SIN GHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種基板容器，其包含一容器門、一容器外殼及一匣。該匣包含用於容納基板之狹槽、一把手及延伸至高於該把手處且附接至該匣之垂直保持特徵。該等垂直保持特徵經構形以當該容器圍繞該匣閉合時接觸該容器外殼。該等垂直保持特徵可經構形以當接觸該容器外殼時偏轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate container includes a container door, a container shell, and a cassette. The cassette includes slots for accommodating substrates, a handle, and vertical retention features extending above the handle and attached to the cassette. The vertical retention features are configured to contact the container shell when the container is closed around the cassette. The vertical retention features can be configured to deflect when contacting the container shell.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:容器</p>  
        <p type="p">102:門</p>  
        <p type="p">104:外殼</p>  
        <p type="p">106:匣</p>  
        <p type="p">108:對準特徵</p>  
        <p type="p">110:水平桿</p>  
        <p type="p">112:第一側壁</p>  
        <p type="p">114:第二側壁</p>  
        <p type="p">116:基板支撐件</p>  
        <p type="p">118:頂壁</p>  
        <p type="p">120:把手</p>  
        <p type="p">122:垂直保持特徵</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1775" publication-number="202613549"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613549.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613549</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130382</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>判定方法、判定裝置、記錄媒體及程式製品</chinese-title>  
        <english-title>ASSESSMENT METHOD, ASSESSMENT DEVICE, RECORDING MEDIUM, AND PROGRAM PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">G01N33/574</main-classification>  
        <further-classification edition="200601120251231B">C12Q1/02</further-classification>  
        <further-classification edition="200601120251231B">C12N15/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関口美知留</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKIGUCHI, MICHIRU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林健太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋康彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, YASUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可使用受體而判定癌症之可能性之判定方法等。判定方法係由電腦執行如下之處理：取得使用顯示與對象中之癌症之可能性相應之反應性之受體所檢測出之對於來自判定對象之對象試料之回應信號；根據所取得之對於前述對象試料之回應信號，而對判定對象中之癌症之可能性進行判定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are an assessment method and the like that assess the likelihood of cancer using a receptor. An assessment method according to the present invention involves execution of the following processes by a computer: acquiring a response signal to a target sample derived from a subject to be assessed, wherein the response signal is detected using a receptor that exhibits reactivity according to the likelihood of cancer in the subject; and assessing the likelihood of cancer in the subject based on the acquired response signal to the target sample.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:判定裝置</p>  
        <p type="p">2:終端裝置</p>  
        <p type="p">3:檢測裝置</p>  
        <p type="p">4:嗅覺感測器</p>  
        <p type="p">100:判定系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1776" publication-number="202613482"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613482.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613482</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130400</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於被動冷卻的單件成型部件</chinese-title>  
        <english-title>SINGLE-BUILD PARTS FOR PASSIVE COOLING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">F28F21/08</main-classification>  
        <further-classification edition="200601120251217B">F28F3/08</further-classification>  
        <further-classification edition="201501120251217B">B33Y30/00</further-classification>  
        <further-classification edition="202001120251217B">B33Y40/00</further-classification>  
        <further-classification edition="200601120251217B">H01L23/367</further-classification>  
        <further-classification edition="200601120251217B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商雅洛伊企業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALLOY ENTERPRISES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛拉赫堤　威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLAHERTY, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西蒙　凱文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMON, KEVIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴　以男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, ALAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧希爾　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUSSIER, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪爾曼　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIEHLMANN, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆勒　瑟賽里亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MULLER, CECELIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐葛科夫　艾雷克桑德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGARKOV, ALEKSANDR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於用於製造用於被動冷卻之單件成型部件之方法及系統。實施例包含一單件成型部件，其包括經構形以容納一流體之至少一個內部腔室。一些實施例包含經由分層實體製造方法之製造，其包含圖案化複數個金屬片，使得該等金屬片包括複數個空隙，堆疊該等經圖案化金屬片，及接合該等經堆疊金屬片以形成一單件成型部件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and systems for the manufacture of single-build parts for passive cooling. Embodiments include a single-build part comprising at least one internal chamber configured to hold a fluid. Some embodiments include manufacture via laminated object manufacturing methods, which includes patterning a plurality of metal sheets so that the metal sheets comprise a plurality of voids, stacking the patterned metal sheets, and bonding the stacked metal sheets to form a single-build part.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:熱管</p>  
        <p type="p">202:內部腔室</p>  
        <p type="p">204:套管區域</p>  
        <p type="p">206:軸線</p>  
        <p type="p">208:端區域</p>  
        <p type="p">210:流體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1777" publication-number="202613202"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613202.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613202</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130407</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">C08G18/00</main-classification>  
        <further-classification edition="200601120251218B">C08J5/22</further-classification>  
        <further-classification edition="200601120251218B">C08K5/01</further-classification>  
        <further-classification edition="200601120251218B">B32B7/10</further-classification>  
        <further-classification edition="200601120251218B">B32B27/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓑毛克弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINOMO, KATSUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新崎盛昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARASAKI, MORIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於：對現有技術的缺點進行改良而提供一種積層膜，所述積層膜具備為了以積層膜的形式使用而需要的機械特性，且相對於布等的密接性及觸感優異，並且可抑制粒子的脫落。一種積層膜，在兩表面相對於布的剝離強度不同，所述積層膜的特徵在於，當將相對於布的剝離強度相對大的表面側的最外層設為A層時，A層包含樹脂組成物及粒子，所述樹脂組成物包含0.1質量%以上且3.0質量%以下的有機異氰酸酯成分，當將所述A層的厚度設為X μm、將所述A層中所含的粒子的平均粒徑設為Y μm時，Y/X為10.0以上且20.0以下，所述A層的相反側的最外層的B層是以聚酯系樹脂為主要成分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:積層膜</p>  
        <p type="p">2:A層</p>  
        <p type="p">4:A層中所含的粒子</p>  
        <p type="p">6:凸部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1778" publication-number="202613099"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613099.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613099</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130436</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>取代的苯基化合物、及其藥物組合物和用途</chinese-title>  
        <english-title>SUBSTITUTED PHENYL COMPOUNDS, PHARMACEUTICAL COMPOSITIONS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D403/04</main-classification>  
        <further-classification edition="200601120260102B">C07D487/20</further-classification>  
        <further-classification edition="200601120260102B">C07D401/04</further-classification>  
        <further-classification edition="200601120260102B">C07D403/12</further-classification>  
        <further-classification edition="200601120260102B">C07D403/06</further-classification>  
        <further-classification edition="200601120260102B">C07D249/08</further-classification>  
        <further-classification edition="200601120260102B">C07D405/12</further-classification>  
        <further-classification edition="200601120260102B">C07D409/04</further-classification>  
        <further-classification edition="200601120260102B">C07D487/08</further-classification>  
        <further-classification edition="200601120260102B">C07D403/14</further-classification>  
        <further-classification edition="200601120260102B">C07D413/14</further-classification>  
        <further-classification edition="200601120260102B">C07D487/04</further-classification>  
        <further-classification edition="200601120260102B">C07D471/04</further-classification>  
        <further-classification edition="200601120260102B">C07D493/08</further-classification>  
        <further-classification edition="200601120260102B">C07D498/04</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4196</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4155</further-classification>  
        <further-classification edition="200601120260102B">A61P37/00</further-classification>  
        <further-classification edition="200601120260102B">A61P29/00</further-classification>  
        <further-classification edition="200601120260102B">A61P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海美悅生物科技發展有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI MEIYUE BIOTECH DEVELOPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳友喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YOUXI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳永凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YONGKAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>付賢磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, XIANLEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及一種取代的苯基化合物、及其藥物組合物和用途，具體而言，提供了一種式( I )所示的取代的苯基化合物，其可用於製備藥物，特別是製備預防和/或治療Kv1.3通道介導的疾病或病症的藥物。式( I )中各基團如說明書中所定義。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to a class of substituted phenyl compounds, pharmaceutical compositions and uses thereof. Specifically, the present application provides the substituted phenyl compounds of formula (I) that can be used to prepare pharmaceuticals, particularly pharmaceuticals for the prevention and/or treatment of Kv1.3 channel-mediated diseases or conditions. The groups in formula (I) are as defined in the specification.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1779" publication-number="202613637"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613637.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613637</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130439</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成像鏡頭驅動模組、相機模組及電子裝置</chinese-title>  
        <english-title>IMAGING LENS DRIVING MODULE, CAMERA MODULE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251202B">G02B7/04</main-classification>  
        <further-classification edition="202101120251202B">G02B7/09</further-classification>  
        <further-classification edition="202101120251202B">G03B13/36</further-classification>  
        <further-classification edition="202101120251202B">G03B30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陽科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LARGAN DIGITAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇恆毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, HENG-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾奕華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YI HUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾德生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, TE-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種成像鏡頭驅動模組，其包含一成像鏡頭、一鏡頭載體、一框架元件、一球體組、一電路基板、一彈性導線片以及一驅動單元。成像鏡頭具有一光軸，鏡頭載體用以安裝成像鏡頭，框架元件與鏡頭載體相對設置，球體組設置於鏡頭載體與框架元件之間，電路基板設置於成像鏡頭的一像側，彈性導線片用以連接鏡頭載體與電路基板，且驅動單元用以驅動鏡頭載體相對於電路基板沿平行光軸的方向或垂直光軸的方向移動。藉此，有利於增強成像鏡頭驅動模組的結構強度及穩定度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an imaging lens driving module, which includes an imaging lens assembly, a lens carrier, a frame element, a ball group, a wiring substrate, a resilience wiring sheet and a driving unit. The imaging lens assembly include an optical axis, the lens carrier is configured to install the imaging lens assembly, the frame element is disposed corresponding to the lens carrier, the ball group is disposed between the lens carrier and the frame element, the wiring substrate is disposed on an image side of the imaging lens assembly, the resilience wiring sheet is configured to connect the lens carrier and the wiring substrate, and the driving unit is configured to drive the lens carrier to move corresponding to the wiring substrate in a direction parallel to the optical axis or to move corresponding to the wiring substrate in a direction perpendicular to the optical axis. Therefore, it is favorable for improving the structural strength and the stability of the imaging lens driving module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:相機模組</p>  
        <p type="p">101:電子感光元件</p>  
        <p type="p">102:可動板</p>  
        <p type="p">103:底座</p>  
        <p type="p">110:成像鏡頭</p>  
        <p type="p">120:鏡頭載體</p>  
        <p type="p">130:框架元件</p>  
        <p type="p">131:安裝部</p>  
        <p type="p">141:第一球體組</p>  
        <p type="p">150:電路基板</p>  
        <p type="p">160:彈性導線片</p>  
        <p type="p">172:第二線圈</p>  
        <p type="p">175:第二磁石</p>  
        <p type="p">X:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1780" publication-number="202613189"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613189.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613189</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130447</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、樹脂膜、附支撐體之樹脂膜、印刷線路板及半導體封裝體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">C08F2/38</main-classification>  
        <further-classification edition="200601120251218B">C08K5/14</further-classification>  
        <further-classification edition="200601120251218B">C07D207/448</further-classification>  
        <further-classification edition="200601120251218B">C08L63/00</further-classification>  
        <further-classification edition="202001120251218B">A61K6/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛岡廣喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUZUOKA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池谷卓二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEYA, TAKUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山浦格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAURA, MASASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長島和史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGASHIMA, KAZUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種樹脂組成物以及使用前述樹脂組成物而成之樹脂膜、附支撐體之樹脂膜、印刷線路板及半導體封裝體，該樹脂組成物即便在含有自由基聚合起始劑的狀態下仍兼具對於電路基板的埋入性與硬化性。前述樹脂組成物具體而言含有：(A)馬來醯亞胺樹脂、(B)無機填充材料、(C)自由基聚合起始劑、(D)聚合禁止劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1781" publication-number="202613728"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613728.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613728</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130451</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於對基板區域上之度量衡資料模型化之方法及相關設備</chinese-title>  
        <english-title>A METHOD FOR MODELING METROLOGY DATA OVER A SUBSTRATE AREA AND ASSOCIATED APPARATUSES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">G03F7/20</main-classification>  
        <further-classification edition="200601120251222B">G03F9/00</further-classification>  
        <further-classification edition="200601120251222B">G05B13/04</further-classification>  
        <further-classification edition="200601120251222B">H01L21/68</further-classification>  
        <further-classification edition="202001120251222B">G06F30/398</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布林克夫　拉夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRINKHOF, RALPH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥更　亨力克斯　喬漢那　蘭伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEGENS, HENRICUS JOHANNES LAMBERTUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班捷恩　法蘭西斯科　哥登法蘭德斯　凱司柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIJNEN, FRANCISCUS GODEFRIDUS CASPER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示用於在一曝光程序中對用於一基板上之一第三層之曝光的對準資料模型化的方法。該方法包含：至少獲得與一第一層相關之第一層對準資料及與一第二層相關之第二層對準資料；將一第一模型擬合至該第一層對準資料以獲得一第一對準模型，且將一第二模型擬合至該第二層對準資料以獲得一第二對準模型；針對該第一對準模型及該第二對準模型之複數個不同模型參數子集中之各者，判定用於該第一模型及該第二模型中之各者之一各別加權；及根據該加權來組合該第一模型與該第二模型以判定一組合式對準模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is method for modeling alignment data for exposure of a third layer on a substrate in an exposure process. The method comprises obtaining at least first layer alignment data relating to a first layer and second layer alignment data relating to a second layer; fitting a first model to the first layer alignment data to obtain a first alignment model and fitting a second model to the second layer alignment data to obtain a second alignment model; determining, for each of a plurality of different subsets of model parameters of said first alignment model and second alignment model, a respective weighting for each of said first model and second model; and combining the first model and second model in accordance with said weighting to determine a combined alignment model.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">DA:直接對準</p>  
        <p type="p">E1:誤差源/標籤/程序影響誤差</p>  
        <p type="p">E2:誤差源/標籤/曝光誤差/曝光誤差源</p>  
        <p type="p">E3:誤差源/標籤/程序影響誤差</p>  
        <p type="p">E4:誤差源/標籤/曝光誤差/曝光誤差源</p>  
        <p type="p">E5:誤差源/標籤/程序影響誤差</p>  
        <p type="p">E6:誤差源/標籤/曝光誤差/曝光誤差源</p>  
        <p type="p">IA:間接對準</p>  
        <p type="p">PAR&lt;sub&gt;1&lt;/sub&gt;:參數標籤/場內參數子集/場內模型參數子集</p>  
        <p type="p">PAR&lt;sub&gt;2&lt;/sub&gt;:參數標籤/線性場間參數/線性場間模型參數子集</p>  
        <p type="p">PAR&lt;sub&gt;3&lt;/sub&gt;:參數標籤/較高階場間參數/較高階場間模型參數子集</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1782" publication-number="202613729"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613729.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613729</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130454</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>曝光裝置、視場光闌、及元件製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">G03F7/20</main-classification>  
        <further-classification edition="200601120251217B">G02B27/18</further-classification>  
        <further-classification edition="200601120251217B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼康股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白澤正裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRASAWA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下修平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, SHUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田亮平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, RYOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之曝光裝置包含：載台，其使基板於第1方向上移動；第1光學系統，其包含第1視場光闌，將光照射至藉由上述第1視場光闌而設定之上述基板上之第1照明區域；以及第2光學系統，其包含第2視場光闌，將光照射至藉由上述第2視場光闌而設定之上述基板上之第2照明區域；上述第1照明區域包含於上述第1方向上之寬度係既定之大小的第1中央部分、以及隨著朝向上述第1照明區域之與上述第1方向正交之第2方向上之端而於上述第1方向上之寬度減少之第1周邊部分；上述第2照明區域包含於上述第1方向上之寬度係既定之大小的第2中央部分、以及隨著朝向上述第2照明區域之上述第2方向上之端而於上述第1方向上之寬度減少之第2周邊部分；上述第1中央部分之一部分與上述第2周邊部分之一部分位於與上述第1方向平行之直線上；上述第1周邊部分與上述第2周邊部分之其他部分位於與上述第1方向平行之直線上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:光源</p>  
        <p type="p">2:橢圓鏡</p>  
        <p type="p">3、5:偏轉鏡</p>  
        <p type="p">4、6:中繼透鏡</p>  
        <p type="p">7:光纖</p>  
        <p type="p">8a、8b:輸入透鏡</p>  
        <p type="p">11a、11b:複眼透鏡</p>  
        <p type="p">12a、12b:聚光透鏡</p>  
        <p type="p">13、24:移動鏡</p>  
        <p type="p">14、25:雷射干涉計</p>  
        <p type="p">15:遮罩</p>  
        <p type="p">16:遮罩載台</p>  
        <p type="p">17:遮罩載台平台</p>  
        <p type="p">19a、19b:投影光學系統</p>  
        <p type="p">20:中間像面</p>  
        <p type="p">21a、21b:視場光闌</p>  
        <p type="p">22:感光性基板</p>  
        <p type="p">23:位置檢測光學系統</p>  
        <p type="p">27:基板載台</p>  
        <p type="p">28:基板載台平台</p>  
        <p type="p">71:入射側</p>  
        <p type="p">72a、72b:射出側</p>  
        <p type="p">100:曝光裝置</p>  
        <p type="p">221:基板</p>  
        <p type="p">222:感光材料</p>  
        <p type="p">CTR:控制裝置</p>  
        <p type="p">ILa、ILb:照明光學系統</p>  
        <p type="p">IXa、IXb、PXa、PXb:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1783" publication-number="202613204"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613204.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613204</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130463</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>潛伏性硬化劑、硬化性組成物及潛伏性硬化劑的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">C08G59/18</main-classification>  
        <further-classification edition="200601120251226B">C08F2/30</further-classification>  
        <further-classification edition="202401120251226B">B01J35/53</further-classification>  
        <further-classification edition="200601120251226B">C08L63/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商柯尼卡美能達股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONICA MINOLTA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>倉田拓己</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURATA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸山洋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUYAMA, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>滝浦佑介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKIGAURA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長澤寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGASAWA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白井亜弥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAI, AYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>和地晃矢子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WACHI, AYAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種潛伏性硬化劑，其為至少包含熱塑性樹脂與硬化成分之核-殼型之潛伏性硬化劑，其中，前述潛伏性硬化劑是材料間隙10μm以下之封裝樹脂用硬化劑、底部填充劑用硬化劑或模塑底部填充劑用硬化劑中的任一種，前述潛伏性硬化劑之平均粒徑在0.05~3.00μm之範圍內，且最大粒徑為10μm以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">H:潛伏性硬化劑</p>  
        <p type="p">LS&lt;sub&gt;10&lt;/sub&gt;:表層部分</p>  
        <p type="p">O:潛伏性硬化劑的中心部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1784" publication-number="202614428"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614428.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614428</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130495</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板結構及其製作方法</chinese-title>  
        <english-title>SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251107B">H01L23/522</main-classification>  
        <further-classification edition="200601120251107B">H05K3/04</further-classification>  
        <further-classification edition="200601120251107B">H05K3/10</further-classification>  
        <further-classification edition="200601120251107B">H05K3/12</further-classification>  
        <further-classification edition="200601120251107B">H05B3/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欣興電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNIMICRON TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王金勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHIN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹智剴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, CHIH-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程石良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, SHIH-LIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚瑞敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIN, RA-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯正達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, CHENG-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林溥如</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, PU-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基板結構，包括第一基材、第二基材、第一導電膏以及第一接合層。第一基材包括第一核心層以及第一導電件。第二基材包括第二核心層以及第二導電件。第一接合層將第一導電膏限定於第一導電件與第二導電件之間，使得第一導電膏分別與第一導電件與第二導電件直接接觸，第一接合層分別與第一核心層與第二核心層直接接觸。另提供一種基板結構的製作方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate structure includes a first substrate, a second substrate, a first conductive paste, and a first bonding layer. The first substrate includes a first core layer and a first conductive member. The second substrate includes a second core layer and a second conductive member. The first bonding layer confines the first conductive paste between the first conductive member and the second conductive member, such that the first conductive paste is in direct contact with the first conductive member and the second conductive member respectively, and the first bonding layer is in direct contact with the first core layer and the second core layer respectively. A manufacturing method of a substrate structure is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板結構</p>  
        <p type="p">110:第一基材</p>  
        <p type="p">111:第一核心層</p>  
        <p type="p">114:第一導電層</p>  
        <p type="p">115:第二導電層</p>  
        <p type="p">116:第一導電件</p>  
        <p type="p">121:第一接合層</p>  
        <p type="p">122:第二接合層</p>  
        <p type="p">131:第一導電膏</p>  
        <p type="p">132:第二導電膏</p>  
        <p type="p">210:第二基材</p>  
        <p type="p">211:第二核心層</p>  
        <p type="p">214:第三導電層</p>  
        <p type="p">215:第四導電層</p>  
        <p type="p">216:第二導電件</p>  
        <p type="p">310:第三基材</p>  
        <p type="p">311:第三核心層</p>  
        <p type="p">314:第五導電層</p>  
        <p type="p">315:第六導電層</p>  
        <p type="p">316:第三導電件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1785" publication-number="202614532"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614532.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614532</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130499</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>緊急電力供應系統</chinese-title>  
        <english-title>EMERGENCY POWER SUPPLY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H02J9/04</main-classification>  
        <further-classification edition="200601120251201B">H02J7/34</further-classification>  
        <further-classification edition="200601120251201B">H02J3/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比利時商魯滕　新能源系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUTTEN - NEW ENERGY SYSTEM SA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魯騰　貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUTTEN, JEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹尼斯　菲利克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENIS, FELIX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">緊急電力供應系統包含水渦輪機(1)，具有設置了葉片或桶斗(1B)的周緣，該水渦輪機(1)容置於調適成置於真空下的殼罩(2)中，該殼罩(2)包含或關聯於收集器(20)，調適成置於真空下且調適成當產生所需的緊急供應電力時收集推進到渦輪機之葉片或桶斗(1B)上的水。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An emergency power supply system comprising a hydraulic turbine (1) having a peripheral edge provided with blades or buckets (1B), said hydraulic turbine (1) being housed in a casing (2) adapted to be put under a vacuum, said casing (2) comprising or being associated with a collector (20) adapted to be put under vacuum and adapted to collect water propeled onto the blades or buckets (1B) of the turbine when generating the required emergency supply power.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:水渦輪機</p>  
        <p type="p">1A:軸桿</p>  
        <p type="p">1B:葉片或桶斗</p>  
        <p type="p">2:殼罩</p>  
        <p type="p">3:交流電機</p>  
        <p type="p">4:緊急能量供應迴路</p>  
        <p type="p">5:緊急儲能機構</p>  
        <p type="p">8:轉移機構</p>  
        <p type="p">9:斷路器</p>  
        <p type="p">10:公司</p>  
        <p type="p">11:主要電能來源</p>  
        <p type="p">11bis:次要電源</p>  
        <p type="p">11ter:斷路器</p>  
        <p type="p">12:真空機構</p>  
        <p type="p">14:通氣孔</p>  
        <p type="p">14A:閥</p>  
        <p type="p">20:收集器</p>  
        <p type="p">22:連接機構</p>  
        <p type="p">22bis:閥</p>  
        <p type="p">23:導管</p>  
        <p type="p">23bis:閥</p>  
        <p type="p">24:導管</p>  
        <p type="p">24bis:閥</p>  
        <p type="p">30:馬達機構</p>  
        <p type="p">40:切換機構</p>  
        <p type="p">40AIG:閉塞機構</p>  
        <p type="p">40bis:切換機構</p>  
        <p type="p">40GG:觸發器</p>  
        <p type="p">40I:注射器、注射器本體</p>  
        <p type="p">41:導管系統</p>  
        <p type="p">41A:入口</p>  
        <p type="p">41B:出口</p>  
        <p type="p">50:貯庫</p>  
        <p type="p">51:連接件</p>  
        <p type="p">52:閥</p>  
        <p type="p">60:液壓管路</p>  
        <p type="p">60bis:閥</p>  
        <p type="p">61:高壓泵</p>  
        <p type="p">62:馬達</p>  
        <p type="p">100:控制裝置</p>  
        <p type="p">200:管線</p>  
        <p type="p">201:閥</p>  
        <p type="p">CE:電路</p>  
        <p type="p">SAC:瞬間緊急電力供應裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1786" publication-number="202613691"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613691.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613691</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130525</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電致變色裝置及其製造方法</chinese-title>  
        <english-title>Electrochromic Device AND METHOD OF FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">G02F1/153</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商唯景操作公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIEW OPERATING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱拉珊　史瑞達　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAILASAM, SRIDHAR K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雪利凡斯塔瓦　達爾雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHRIVASTAVA, DHAIRYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　志偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, ZHIWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅茲畢基　羅伯特　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROZBICKI, ROBERT T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉拉斯皮耶　丹恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GILLASPIE, DANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬丁　陶德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTIN, TODD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普拉達　安殊　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PRADHAN, ANSHU A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕克　朗諾　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARKER, RONALD M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧建川</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供用於製造電致變色裝置之方法，該等方法在沒有預先判定將在該裝置上何處施加頂部匯流排的情況下減輕頂部匯流排下方之短路的形成。使用此類方法製造的裝置在該頂部匯流排下方可為去活化的，或在該頂部匯流排下方可包括活動材料。製造具有頂部匯流排下方的活動材料之裝置的方法包括沈積經改質頂部匯流排、在該電致變色裝置中製造自愈層、以及在施加匯流排之前對該裝置之頂部透明導電層進行改質。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods are provided for fabricating electrochromic devices that mitigate formation of short circuits under a top bus bar without predetermining where top bus bars will be applied on the device. Devices fabricated using such methods may be deactivated under the top bus bar, or may include active material under the top bus bar. Methods of fabricating devices with active material under a top bus bar include depositing a modified top bus bar, fabricating self-healing layers in the electrochromic device, and modifying a top transparent conductive layer of the device prior to applying bus bars.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">302:步驟</p>  
        <p type="p">304:步驟</p>  
        <p type="p">308:步驟</p>  
        <p type="p">378a:步驟</p>  
        <p type="p">378b:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1787" publication-number="202613876"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613876.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613876</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130534</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>系統、方法、邊緣伺服器及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251226B">G06F40/109</main-classification>  
        <further-classification edition="202201120251226B">H04L67/568</further-classification>  
        <further-classification edition="201901120251226B">G06F16/957</further-classification>  
        <further-classification edition="201901120251226B">G06F16/958</further-classification>  
        <further-classification edition="201301120251226B">G06F21/10</further-classification>  
        <further-classification edition="202301120251226B">G06Q30/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商森澤股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORISAWA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小室貴史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMURO, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 提供一種可更進一步提升使用到字型發布系統所管理之字型的，多樣化設計之網頁的瀏覽體驗的技術。 &lt;br/&gt;　　[解決手段] 邊緣伺服器的處理器，係執行：隨應於對利用字型發布伺服器所管理之特定之字型的網頁的使用者終端之存取，在邊緣伺服器中並未保持網頁中所被利用之特定之字型的情況下，向字型發布伺服器進行要求之步驟；和將特定之字型從字型發布伺服器予以接收並保持之步驟；和隨應於對利用字型發布伺服器所管理之特定之字型的網頁的使用者終端之存取，而於邊緣伺服器中已保持有特定之字型之資訊的情況下，則不向字型發布伺服器要求特定之字型，而是藉由向存取所涉及之使用者終端發送特定之字型，以使利用到特定之字型的網頁被使用者終端的瀏覽器所瀏覽之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1602:帳號顯示領域</p>  
        <p type="p">1606:資費方案顯示領域</p>  
        <p type="p">1618:契約者用操作畫面</p>  
        <p type="p">1620:統計結果顯示領域</p>  
        <p type="p">1622:統計期間顯示領域</p>  
        <p type="p">1624:利用量顯示領域</p>  
        <p type="p">1626:方案變更操作部</p>  
        <p type="p">1628:資費顯示領域</p>  
        <p type="p">1630:全體統計結果顯示領域</p>  
        <p type="p">1632:按字型排名操作部</p>  
        <p type="p">1634:按網域排名操作部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1788" publication-number="202614592"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614592.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614592</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130540</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通訊裝置、通訊方法、及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H04L27/26</main-classification>  
        <further-classification edition="200601120251103B">H04L5/00</further-classification>  
        <further-classification edition="200601120251103B">H04L1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉川佑生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIKAWA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可將依據IEEE802.11規格系列中所含之1個以上之規格的無線訊框發送至其他通訊裝置的通訊裝置，其中，規格中所含之第1規格中所被規定的複數個MCS之各者與用來唯一識別MCS的MCS索引之間的第1對應關係之其中至少一部分，是異於比第1規格還早被規格化的第2規格中所被規定的第2對應關係；通訊裝置係具有：生成手段，係用以生成無線訊框，其中，無線訊框係含有前文訊號和資料訊號；前文訊號係含有：第1資訊，係可讓其他通訊裝置特定出，為了從MCS索引特定出MCS而應使用第1對應關係和第2對應關係之何者、和第2資訊，係將資料訊號之生成時所被使用之MCS所對應的MCS索引，加以表示；資料訊號，係使用藉由第1資訊和第2資訊而被表示之MCS而被生成；和送訊手段，係用以將已被生成手段所生成之無線訊框，發送至其他通訊裝置；生成手段，係將把第2資訊包含在前文訊號中的U-SIG欄位中的前記無線訊框，予以生成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1789" publication-number="202613277"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613277.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613277</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130557</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>有機發光元件、其的有機物層用組成物以及其的製造方法</chinese-title>  
        <english-title>ORGANIC LIGHT EMITTING DEVICE, COMPOSITION FOR ORGANIC LAYER OF ORGANIC LIGHT EMITTING DEVICE AND MANUFACTURING METHOD OF ORGANIC LIGHT EMITTING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C09K11/06</main-classification>  
        <further-classification edition="200601120260102B">C07D307/91</further-classification>  
        <further-classification edition="200601120260102B">C07D407/12</further-classification>  
        <further-classification edition="200601120260102B">C07D405/04</further-classification>  
        <further-classification edition="200601120260102B">C07D407/04</further-classification>  
        <further-classification edition="200601120260102B">C07D307/92</further-classification>  
        <further-classification edition="200601120260102B">C07D491/048</further-classification>  
        <further-classification edition="200601120260102B">C07D495/04</further-classification>  
        <further-classification edition="202301120260102B">H10K50/00</further-classification>  
        <further-classification edition="202301120260102B">H10K85/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＴ素材股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LT MATERIALS CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李率</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許柔珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HEO, YU-JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牟晙兌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MO, JUN-TAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONG-JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔大赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, DAE-HYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本說明書涉及一種包括第一雜環化合物至第三雜環化合物的有機發光元件、其的有機物層用組成物以及其的製造方法。本申請的根據一實施形態的有機發光元件及其有機物層用組成物，不僅可以降低元件的驅動電壓，提高光效率，還可以提高化合物的熱穩定性來提高元件的壽命特性。有機發光元件包括第一電極；第二電極，與第一電極相對設置；以及一層以上的有機物層，設置在第一電極和第二電極之間，有機物層中的一層以上包括第一至第三雜環化合物，第一雜環化合物由化學式A表示，第二雜環化合物以及第三雜環化合物彼此不同，分別由化學式C表示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">200:陽極</p>  
        <p type="p">300:有機物層</p>  
        <p type="p">400:陰極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1790" publication-number="202614335"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614335.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614335</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130622</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合裝置、接合系統及接合方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">H01L21/68</main-classification>  
        <further-classification edition="202101120251218B">G02B7/09</further-classification>  
        <further-classification edition="202101120251218B">G02B7/28</further-classification>  
        <further-classification edition="200601120251218B">G05B19/404</further-classification>  
        <further-classification edition="200601120251218B">H01L23/544</further-classification>  
        <further-classification edition="200601120251218B">H01L21/302</further-classification>  
        <further-classification edition="200601120251218B">B32B37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉山享</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIYAMA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]本發明旨在提高基板彼此的接合精度。 &lt;br/&gt;[解決手段]一種接合裝置，其具備：第一固持部、第二固持部、移動部、光學系統、調整部、及控制部。第一固持部固持第一基板。第二固持部固持第二基板。移動部使第一固持部及第二固持部中一者接近另一者。光學系統對第一基板及第二基板照射光線，而以反射光或透射光拍攝在第一基板及第二基板設置的對準標記。調整部設置在光學系統的光路上，並調整光學系統的焦深。控制部執行接近處理及拍攝處理。接近處理乃是將移動部加以控制，而使第一固持部及第二固持部中一者接近另一者。拍攝處理乃是在接近處理中將調整部加以控制，而調整光學系統的焦深，藉以使第一基板及第二基板位在光學系統的焦深內後，使用光學系統拍攝第一基板及第二基板的對準標記。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">230:上吸盤</p>  
        <p type="p">231:下吸盤</p>  
        <p type="p">261,291:銷</p>  
        <p type="p">292:下側肋條</p>  
        <p type="p">300:對準標記拍攝部</p>  
        <p type="p">301:光源</p>  
        <p type="p">302:拍攝部</p>  
        <p type="p">303:準直透鏡</p>  
        <p type="p">304:反射鏡</p>  
        <p type="p">305:聚光透鏡</p>  
        <p type="p">306:準直透鏡</p>  
        <p type="p">307:半反射鏡</p>  
        <p type="p">308:接物透鏡</p>  
        <p type="p">309:中繼透鏡</p>  
        <p type="p">310:成像光圈</p>  
        <p type="p">311:成像透鏡</p>  
        <p type="p">312:貫穿孔</p>  
        <p type="p">391:外側吸附部</p>  
        <p type="p">400:調整部</p>  
        <p type="p">M1,M2:對準標記</p>  
        <p type="p">W1:上晶圓(第一基板)</p>  
        <p type="p">W2:下晶圓(第二基板)</p>  
        <p type="p">X,Y,Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1791" publication-number="202614175"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614175.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614175</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130635</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>熱處理裝置及熱處理方法</chinese-title>  
        <english-title>HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251119B">H01L21/26</main-classification>  
        <further-classification edition="200601120251119B">H01L21/324</further-classification>  
        <further-classification edition="200601120251119B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹原弘耕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEHARA, HIROYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤禎朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, YOSHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮脇真治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAWAKI, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布施和彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUSE, KAZUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可防止基板於閃光照射時彈跳之熱處理裝置及熱處理方法。 &lt;br/&gt;於基座74之保持板75之上表面，立設具有較半導體晶圓W之直徑為小之直徑之圓環形狀之石英凸狀部即支持環77。對由支持環77支持之半導體晶圓W之表面照射閃光而將半導體晶圓W加熱。當將半導體晶圓W載置於支持環77時，形成由保持板75之上表面、半導體晶圓W之下表面及支持環77之內壁面包圍之密閉空間96。於閃光照射時，藉由於較半導體晶圓W為上方之空間95與密閉空間96之間產生之壓力差，對半導體晶圓W之表面作用自上方按壓之力，可防止半導體晶圓W彈跳。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">74:基座</p>  
        <p type="p">75:保持板</p>  
        <p type="p">77:支持環</p>  
        <p type="p">95:空間</p>  
        <p type="p">96:密閉空間</p>  
        <p type="p">W:半導體晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1792" publication-number="202613235"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613235.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613235</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130645</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>丸粒及其製造方法、成形體、旋轉成形體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">C08L27/18</main-classification>  
        <further-classification edition="200601120251222B">C08J3/12</further-classification>  
        <further-classification edition="200601120251222B">B29B9/06</further-classification>  
        <further-classification edition="200601120251222B">B28B21/80</further-classification>  
        <further-classification edition="200601120251222B">C08F8/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部正登志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, MASATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西榮一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHI, EIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種於成形體表面不易產生微裂且可減低成形體之著色的丸粒及其製造方法；並提供：由前述丸粒獲得之成形體及旋轉成形體。&lt;br/&gt; 本發明丸粒含有可熔融成形之氟樹脂，前述丸粒之長徑為50~250µm，長徑相對於短徑的比為1~20，D50為30~240µm，且，(D90-D10)/D50為1.30以下。在一例中，可熔融成形之氟樹脂亦可具有以四氟乙烯為主體之單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1793" publication-number="202614816"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614816.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614816</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130656</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及其製造方法</chinese-title>  
        <english-title>A SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251219B">H10D30/60</main-classification>  
        <further-classification edition="202501120251219B">H10D64/27</further-classification>  
        <further-classification edition="202501120251219B">H10D48/32</further-classification>  
        <further-classification edition="202501120251219B">H10D84/01</further-classification>  
        <further-classification edition="200601120251219B">H01L21/762</further-classification>  
        <further-classification edition="200601120251219B">H01L21/768</further-classification>  
        <further-classification edition="200601120251219B">H01L23/528</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萬國商業機器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇里亞　亞瑟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SULEHRIA, YASIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝　瑞龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, RUILONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康宗聖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, TSUNG-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謬克什　薩加里卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKESH, SAGARIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷茲查克　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REZNICEK, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭齊洛　尼可拉斯　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANZILLO, NICHOLAS ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種半導體裝置，其包括一場效電晶體，該場效電晶體具有源極/汲極區，該等源極/汲極區具有一源極/汲極區寬度。背側觸點連接至該等源極/汲極區。該等背側觸點具有大於該源極/汲極區寬度之一尺寸。金屬線連接至該等背側觸點。該等金屬線在其間具有一間隙，且包括一金屬線寬度。該等金屬線進一步包括具有一延伸部寬度之金屬線延伸部，該延伸部寬度小於該金屬線寬度且延伸超過該金屬線寬度以在維持跨越該間隙之一間距的同時增大該等金屬線之間的尖端至尖端距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device includes a field effect transistor having source/drain regions, the source/drain regions having a source/drain region width. Backside contacts are connected to the source/drain regions. The backside contacts have a dimension greater than the source/drain region width. Metal lines are connected to the backside contacts. The metal lines have a gap therebetween and include a metal line width. The metal lines further include metal line extensions that have an extension width that is less than the metal line width and extends beyond the metal line width to increase tip to tip distance between the metal lines while maintaining a pitch across the gap.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:晶圓</p>  
        <p type="p">102:閘極線</p>  
        <p type="p">104:作用區線</p>  
        <p type="p">105:插圖</p>  
        <p type="p">108:蝕刻終止層</p>  
        <p type="p">111:閘控電晶體/功率閘電晶體</p>  
        <p type="p">114:通道層</p>  
        <p type="p">116:閘極電極</p>  
        <p type="p">118:間隔物</p>  
        <p type="p">120:層堆疊</p>  
        <p type="p">122:源極/汲極區</p>  
        <p type="p">124:閘極結構</p>  
        <p type="p">126:介電材料</p>  
        <p type="p">128:淺溝槽隔離(STI)或STI區</p>  
        <p type="p">132:第二介電材料</p>  
        <p type="p">134:錐形溝槽</p>  
        <p type="p">140:內間隔物</p>  
        <p type="p">141:觸點或通孔/前側觸點及/或通孔</p>  
        <p type="p">142:犧牲性預留位置</p>  
        <p type="p">148:層間介電質(ILD)</p>  
        <p type="p">150:後段製程(BEOL)ILD</p>  
        <p type="p">152:介電層</p>  
        <p type="p">154:金屬線</p>  
        <p type="p">156:前側後段製程(BEOL)層/BEOL層</p>  
        <p type="p">158:載體晶圓</p>  
        <p type="p">X1:截面線/截面/視圖</p>  
        <p type="p">X2:截面線/截面/視圖</p>  
        <p type="p">Y:截面線/截面/視圖</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1794" publication-number="202613028"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613028.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613028</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130682</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>正極用組成物、非水電解質二次電池用正極、及非水電解質二次電池</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251218B">C01B32/30</main-classification>  
        <further-classification edition="200601120251218B">C08L1/06</further-classification>  
        <further-classification edition="201001120251218B">H01M4/13</further-classification>  
        <further-classification edition="200601120251218B">H01M4/40</further-classification>  
        <further-classification edition="201001120251218B">H01M10/0525</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商可樂麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURARAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹島有紗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKESHIMA, ARISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>釜江祥希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMAE, YOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林祥平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, SHOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種正極用組成物，其係包含正極活性物質、多孔質碳、纖維狀碳及黏合劑之正極用組成物，&lt;br/&gt; 前述正極活性物質為無機化合物，&lt;br/&gt; 前述多孔質碳之藉由BJH法所測定的2nm以上200nm以下的細孔容積為0.8cm&lt;sup&gt;3&lt;/sup&gt;/g以上，&lt;br/&gt; 前述纖維狀碳的平均纖維直徑為0.5～200nm，平均纖維長度為1～1000μm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1795" publication-number="202612742"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612742.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612742</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130698</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含抗191P4D12抗體藥物結合物之醫藥組合物及其使用方法</chinese-title>  
        <english-title>PHARMACEUTICAL COMPOSITIONS COMPRISING ANTI-191P4D12 ANTIBODY DRUG CONJUGATES AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260102B">A61K47/68</main-classification>  
        <further-classification edition="200601120260102B">A61K47/22</further-classification>  
        <further-classification edition="200601120260102B">A61K47/26</further-classification>  
        <further-classification edition="200601120260102B">A61K47/36</further-classification>  
        <further-classification edition="200601120260102B">A61K9/08</further-classification>  
        <further-classification edition="200601120260102B">A61K9/19</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾澤西公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGENSYS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商思進公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEAGEN INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥加維　歐爾拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCGARVEY, ORLA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷特納斯威密　蓋亞希利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RATNASWAMY, GAYATHRI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫　迎慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YINGQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡　斯科拉凡迪　傑柯　瑪莉　蘿斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VAN SCHRAVENDI JK, MARIE ROSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種醫藥組合物，其包含：抗體藥物結合物，其包含與一或多個單甲基奧瑞他汀E (monomethyl auristatin E，MMAE)單元結合之191P4D12結合的抗體或其抗原結合片段；及醫藥學上可接受之賦形劑，其包含L-組胺酸、聚山梨醇酯-20 (TWEEN-20)、及二水合海藻糖與蔗糖中之至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A pharmaceutical composition comprising an antibody drug conjugate comprising an antibody or antigen binding fragment thereof that binds to 191P4D12 conjugated to one or more units of monomethyl auristatin E (MMAE) and a pharmaceutically acceptable excipient comprising L-histidine, polysorbate-20 (TWEEN-20), and at least one of trehalose dihydrate and sucrose.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1796" publication-number="202612666"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612666.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612666</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130704</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於針對眼睛的組合音波及雷射應用的方法及系統</chinese-title>  
        <english-title>METHODS AND SYSTEMS FOR COMBINED SONIC AND LASER APPLICATIONS FOR THE EYE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">A61F9/007</main-classification>  
        <further-classification edition="200601120251229B">A61F9/008</further-classification>  
        <further-classification edition="200601120251229B">A61B18/20</further-classification>  
        <further-classification edition="200601120251229B">A61B18/22</further-classification>  
        <further-classification edition="200601120251229B">A61B3/107</further-classification>  
        <further-classification edition="200601120251229B">A61B3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商藍薩爾股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LENSAR, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德森　史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDERSON, SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫拉圖　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CURATU, GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格雷　蓋瑞Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRAY, GARY P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克威爾特　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCWHIRTER, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紐頓　亞瑟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NEWTON, ARTHUR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>托伊馬　瓦拉斯基Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEUMA, VALASKI E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於執行雷射及超音波晶體乳化操作的系統及方法。提供圍繞患者的完整位置及使用情況的系統。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods for performing laser and phacoemulsification operations. Systems that provide full position and usage around a patient.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">101:殼體</p>  
        <p type="p">102:殼體</p>  
        <p type="p">103:埠</p>  
        <p type="p">104:埠</p>  
        <p type="p">105:光學導管</p>  
        <p type="p">106:殼體</p>  
        <p type="p">107:臂</p>  
        <p type="p">107a:箭頭</p>  
        <p type="p">107b:箭頭</p>  
        <p type="p">108:裝置</p>  
        <p type="p">109:監視器</p>  
        <p type="p">109a:箭頭</p>  
        <p type="p">110:升降器裝置</p>  
        <p type="p">120:箭頭</p>  
        <p type="p">121:箭頭</p>  
        <p type="p">122:箭頭</p>  
        <p type="p">150:框架</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1797" publication-number="202612818"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612818.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612818</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130718</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機械加工系統</chinese-title>  
        <english-title>MACHINING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B23B29/04</main-classification>  
        <further-classification edition="200601120251231B">B23B29/12</further-classification>  
        <further-classification edition="200601120251231B">B23B31/02</further-classification>  
        <further-classification edition="200601120251231B">B23Q3/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商科力博投資有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLIBRI BETEILIGUNG GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾柏勒　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBERLE, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇普勒　曼紐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEPPELER, MANUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">機械加工系統至少由一固定不動的夾持器安裝座(10)及一夾持器(12)所組成，此夾持器被提供用於安裝一機械加工刀具，具有一夾持器柄部(14)，並可藉著一鎖固裝置(16)能互換地鎖固在夾持器安裝座(10)中，鎖固裝置(16)係可藉著致動裝置(18)由釋放位置運動進入鎖固位置，於釋放位置中，夾持器(12)被導引以便能插入夾持器安裝座(10)並可再次由夾持器安裝座(10)抽出，而於鎖固位置中，夾持器被固持在夾持器安裝座(10)中的其插入位置中，並藉由可預定的縮回力量縮回，且反之亦然，分別作為鎖固或釋放過程的一部分，夾持器(12)具有至少一個夾緊凸輪(96)，此係布置於夾持器柄部(14)上，並將與鎖固裝置(16)之可分配的夾緊表面進入接觸或分開，分別用於鎖固或釋放過程之目的，其特徵在於此夾持器安裝座(10)具有一彈性柔順補償裝置(24)，此補償裝置允許至少在鎖固位置中補償夾持器安裝座(10)與已安裝夾持器(12)之間的公差。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Machining system at least consisting of a stationary holder mount (10) and a holder (12), which is provided for mounting a machining tool, has a holder shank (14) and can be interchangeably secured in the holder mount (10) by means of a securing device (16), the securing device (16) being movable by means of an actuation device (18) from a release position, in which the holder (12) is guided so as to be insertable into the holder mount (10) and extractable therefrom again, into a securing position, in which the holder is held in its inserted position in the holder mount (10) and is retracted by a predeterminable retraction force, and vice versa as part of a securing or releasing process, respectively, the holder (12) having at least one clamping cam (96), which is arranged on the holder shank (14) and comes into contact with or separates from an assignable clamping surface of the securing device (16) for the purpose of a securing or releasing process, respectively, characterised in that the holder mount (10) has a resiliently flexible compensation device (24) which allows tolerances to be compensated for between the holder mount (10) and the mounted holder (12) at least in the securing position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:夾持器安裝座</p>  
        <p type="p">12:夾持器</p>  
        <p type="p">14:夾持器柄部</p>  
        <p type="p">16:鎖固裝置</p>  
        <p type="p">18:致動裝置</p>  
        <p type="p">20:安裝座</p>  
        <p type="p">21:周向邊緣</p>  
        <p type="p">23:頭部幾何結構</p>  
        <p type="p">25:導引部</p>  
        <p type="p">34:安裝法蘭</p>  
        <p type="p">36:平坦接觸表面</p>  
        <p type="p">42:嚙合螺絲</p>  
        <p type="p">44:自由端面</p>  
        <p type="p">60:平坦接觸表面</p>  
        <p type="p">79:淨開口</p>  
        <p type="p">81:夾緊栓釘</p>  
        <p type="p">83:中心孔</p>  
        <p type="p">86:推力件</p>  
        <p type="p">96:夾緊凸輪</p>  
        <p type="p">102:接觸凸輪</p>  
        <p type="p">108:抓握溝槽</p>  
        <p type="p">110:冠狀齒輪</p>  
        <p type="p">122:環形表面</p>  
        <p type="p">150:孔</p>  
        <p type="p">151:外部圓周</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1798" publication-number="202612819"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612819.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612819</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130719</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機械加工系統</chinese-title>  
        <english-title>MACHINING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B23B29/04</main-classification>  
        <further-classification edition="200601120251231B">B23B31/02</further-classification>  
        <further-classification edition="200601120251231B">B23B29/12</further-classification>  
        <further-classification edition="200601120251231B">B23Q3/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商科力博投資有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLIBRI BETEILIGUNG GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾柏勒　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBERLE, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇普勒　曼紐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEPPELER, MANUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉普　弗洛里安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAPP, FLORIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">機械加工系統至少由在操作期間以固定不動的方式布置之夾持器安裝座(10)及一夾持器(12)所組成，此夾持器(12)被提供用於安裝一機械加工刀具，具有一夾持器柄部(14)，並可藉著一鎖固裝置(16)以可互換的方式鎖固在夾持器安裝座(10)中，此鎖固裝置(16)係可藉著致動裝置(18)由一釋放位置運動進入一鎖固位置，於釋放位置中，夾持器(12)被導引，以便可插入夾持器安裝座(10)並可再次由其中抽出，而於鎖固位置中，夾持器被固持在夾持器安裝座(10)中之插入位置中，並藉由可預定的縮回力量縮回，且反之亦然，分別作為鎖固或釋放過程的一部分，及夾持器(12)具有至少一個夾緊凸輪(19)，此夾緊凸輪(19)布置於夾持器柄部(14)上，並將與鎖固裝置(16)之可分配的夾緊表面(20)進入接觸或分開，分別用於鎖固或釋放過程之目的，其特徵在於夾持器安裝座(10)具有一彈性柔順之補償裝置(22)，此補償裝置至少在鎖固位置中允許補償夾持器安裝座(10)與已安裝的夾持器(12)之間的公差。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Machining system at least consisting of a holder mount (10) arranged in a stationary manner during operation and a holder (12), which is provided for mounting a machining tool, has a holder shank (14) and can be interchangeably secured in the holder mount (10) by means of a securing device (16), the securing device (16) being movable by means of an actuation device (18) from a release position, in which the holder (12) is guided so as to be insertable into the holder mount (10) and extractable therefrom again, into a securing position, in which the holder is held in its inserted position in the holder mount (10) and retracted by a predeterminable retraction force, and vice versa as part of a securing or releasing process, respectively, and the holder (12) having at least one clamping cam (19), which is arranged on the holder shank (14) and comes into contact with or separates from an assignable clamping surface (20) of the securing device (16) for the purpose of a securing or releasing process, respectively, characterised in that the holder mount (10) has a resiliently flexible compensation device (22) which allows tolerances to be compensated for between the holder mount (10) and the mounted holder (12) at least in the securing position.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:夾持器安裝座</p>  
        <p type="p">12:夾持器</p>  
        <p type="p">14:夾持器柄部</p>  
        <p type="p">16:鎖固裝置</p>  
        <p type="p">18:致動裝置</p>  
        <p type="p">19:夾緊凸輪</p>  
        <p type="p">20:夾緊表面</p>  
        <p type="p">22:補償裝置</p>  
        <p type="p">24:安裝座</p>  
        <p type="p">25:螺紋孔</p>  
        <p type="p">26:導引部</p>  
        <p type="p">30:貫通溝槽</p>  
        <p type="p">32:環狀溝槽片段</p>  
        <p type="p">34:縱軸或插入軸</p>  
        <p type="p">36:鎖固元件</p>  
        <p type="p">48:外殼零件</p>  
        <p type="p">50:外殼零件</p>  
        <p type="p">52:螺絲連接件</p>  
        <p type="p">54:介面</p>  
        <p type="p">56:夾緊栓銷</p>  
        <p type="p">58:橫向肋條</p>  
        <p type="p">60:接觸凸輪</p>  
        <p type="p">62:溝槽</p>  
        <p type="p">72:小齒輪</p>  
        <p type="p">73:嚙合點</p>  
        <p type="p">74:開鎖</p>  
        <p type="p">75:閉鎖</p>  
        <p type="p">82:接觸片段</p>  
        <p type="p">92:排放開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1799" publication-number="202614549"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614549.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614549</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130722</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於產生受控波形成型的裝置及方法</chinese-title>  
        <english-title>APPARATUSES AND METHODS FOR GENERATING CONTROLLED WAVESHAPING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">H02M3/155</main-classification>  
        <further-classification edition="200601120251224B">H02M1/088</further-classification>  
        <further-classification edition="200601120251224B">H02M1/14</further-classification>  
        <further-classification edition="200601120251224B">H03K4/00</further-classification>  
        <further-classification edition="200601120251224B">H03K5/01</further-classification>  
        <further-classification edition="200601120251224B">G05F1/46</further-classification>  
        <further-classification edition="200601120251224B">G05B19/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商先驅能源工業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADVANCED ENERGY INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷蒙德　路克　克里斯多福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAYMOND, LUKE CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴斯塔米　安納斯　阿爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BASTAMI, ANAS AL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德烈松　約翰　奧斯卡　倫納特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDREASSON, JOHAN OSCAR LENNART</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施　東尼　翰林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHI, TONY HANLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於產生定製波形之系統包括：複數個DC-DC轉換器單元，其串聯耦接以形成堆疊；及控制器，其用以產生控制信號以驅動該堆疊中之這些DC-DC轉換器單元在節點處產生定製波形，該控制器包含查找表，該查找表用以儲存影響該定製波形之至少一個特性，其中至該複數個DC-DC轉換器單元中之各者的這些控制信號至少部分地基於該至少一個特性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">System for generating customized waveforms include a plurality of DC-DC converter cells coupled in series to form a stack; and a controller to generate control signals to drive the DC-DC converter cells in the stack to generate a customized waveform at a node, the controller comprising a lookup table to store at least one characteristic affecting the customized waveform, wherein the control signals to each of the plurality of DC-DC converter cells are based at least in part on the at least one characteristic.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">104:功率級</p>  
        <p type="p">106:控制器</p>  
        <p type="p">110:DC-DC轉換器單元</p>  
        <p type="p">112:源</p>  
        <p type="p">116:堆疊</p>  
        <p type="p">118:第一堆疊</p>  
        <p type="p">120:第二堆疊</p>  
        <p type="p">126:第一DC-DC轉換器單元</p>  
        <p type="p">128:第二DC-DC轉換器單元</p>  
        <p type="p">130:第n DC-DC轉換器單元</p>  
        <p type="p">136:負載</p>  
        <p type="p">140:切換級</p>  
        <p type="p">I&lt;sub&gt;cell&lt;/sub&gt;:輸出電流</p>  
        <p type="p">V&lt;sub&gt;cell&lt;/sub&gt;:輸出電壓</p>  
        <p type="p">V&lt;sub&gt;SYS&lt;/sub&gt;:輸出電壓/輸出信號/輸出電壓波形</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1800" publication-number="202613587"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613587.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613587</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130728</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無先驗絕對參考方向知識之共同方位角之判定</chinese-title>  
        <english-title>DETERMINATION OF COMMON AZIMUTH ANGLE WITHOUT A-PRIORI ABSOLUTE REFERENCE DIRECTION KNOWLEDGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251201B">G01S5/02</main-classification>  
        <further-classification edition="200601120251201B">G01S5/00</further-classification>  
        <further-classification edition="200901120251201B">H04W64/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦西拉夫斯基　丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VASSILOVSKI, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, QING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古拉帝　卡皮爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GULATI, KAPIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一些實施方案中，判定使用者設備(UE)之間之一共同方位角可由一第一UE來執行，該第一UE可在一第一時間判定該第一UE與該第一UE之一第一坐標架構內之一第二UE之間之一UE間方向向量。額外地，該第一UE可從該第二UE接收指示該UE間方向向量與該第二UE之一第二坐標架構之間之一關係之一參考方位角。該第一UE可至少部分地基於該參考方位角及該UE間方向向量來判定該第一坐標架構與該第二坐標架構之間之一轉換。此外，該第一UE可在該第一時間之後之一第二時間獲得一方位角測量，且在該第一坐標架構與該第二坐標架構之間轉換該方位角測量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In some implementations, determining a common azimuth angle between user equipments (UEs) may be performed by a first UE, which may determine an inter-UE directional vector between the first UE and a second UE within a first coordinate frame of the first UE at a first time. In addition, the first UE may receive, from the second UE, a reference azimuth angle indicative of a relationship between the inter-UE directional vector and a second coordinate frame of the second UE. The first UE may determine, based at least in part on the reference azimuth angle and the inter-UE directional vector, a translation between the first coordinate frame and the second coordinate frame. Moreover, the first UE may obtain an azimuth angle measurement at a second time subsequent to the first time, and translate the azimuth angle measurement between the first coordinate frame and the second coordinate frame.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">800:程序/方法</p>  
        <p type="p">810:方塊</p>  
        <p type="p">820:方塊</p>  
        <p type="p">830:方塊</p>  
        <p type="p">840:方塊</p>  
        <p type="p">850:方塊</p>  
        <p type="p">860:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1801" publication-number="202614263"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614263.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614263</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130749</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於半導體基板的偏轉測量檢測裝置</chinese-title>  
        <english-title>DEFLECTOMETRY INSPECTION DEVICE FOR SEMICONDUCTOR SUBSTRATES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H01L21/66</main-classification>  
        <further-classification edition="200601120251204B">H01L21/67</further-classification>  
        <further-classification edition="200601120251204B">H01L21/68</further-classification>  
        <further-classification edition="200601120251204B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商統一半導體公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITY SEMICONDUCTOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>依斯納德　克利斯多福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISNARD, CHRISTOPHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威耶　尚　傑克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIAL, JEAN-JACQUES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝葛安德　依莎貝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERGOEND, ISABELLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於半導體基板的偏轉測量檢測裝置（1），其包含： &lt;br/&gt;-    基板支撐框架（30），其經組態以支撐待檢測之基板（4）， &lt;br/&gt;-    至少一個檢測模組（20，20a，20b），其包含檢測模組框架（6，6a，6b）、經組態以用圖案（5）照明待檢測之該基板（4）的照明螢幕（2，2a，2b）及經組態以偵測由該基板（4）之表面反射之光並對該基板（4）之具有該圖案之該表面進行成像的攝影機（3，3a，3b），該照明螢幕（2，2a，2b）及該攝影機（3，3a，3b）相對於彼此以固定位置關係配置於該檢測模組框架（20，20a，20b）上， &lt;br/&gt;其中該檢測模組框架（6，6a，6b）在操作位置與維護位置之間為可移動而不更改該照明螢幕（2，2a，2b）與該攝影機（3，3a，3b）之間的該固定位置關係，其中在該操作位置中，該檢測模組（20，20a，20b）經組態以進行檢測量測，且在該維護位置中，該檢測模組（20，20a，20b）可由操作者存取。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a deflectometry inspection device (1) for semiconductor substrates, comprising: &lt;br/&gt;- a substrate support frame (30) configured to support a substrate (4) to be inspected, &lt;br/&gt;- at least one inspection module (20, 20a, 20b) comprising an inspection module frame (6, 6a, 6b), an illumination screen (2, 2a, 2b) configured to illuminate the substrate (4) to be inspected with a pattern (5), and a camera (3, 3a, 3b) configured to detect light reflected by the surface of the substrate (4) and to image the surface of the substrate (4) with the pattern, the illumination screen (2, 2a, 2b) and the camera (3, 3a, 3b) being arranged in a fixed positional relationship with respect to each other on the inspection module frame (20, 20a, 20b), &lt;br/&gt;wherein the inspection module frame (6, 6a, 6b) is movable between an operational position and a maintenance position without altering the fixed positional relationship between the illumination screen (2, 2a, 2b) and the camera (3, 3a, 3b), wherein in the operational position, the inspection module (20, 20a, 20b) is configured to carry out inspection measurements, and in the maintenance position, the inspection module (20, 20a, 20b) is accessible by an operator.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:偏轉測量檢測裝置</p>  
        <p type="p">2a:照明螢幕</p>  
        <p type="p">2b:照明螢幕</p>  
        <p type="p">3a:攝影機</p>  
        <p type="p">3b:攝影機</p>  
        <p type="p">6a:檢測模組框架</p>  
        <p type="p">6b:檢測模組框架</p>  
        <p type="p">10:主框架</p>  
        <p type="p">20a:檢測模組</p>  
        <p type="p">20b:檢測模組</p>  
        <p type="p">30:基板支撐框架/晶圓支撐框架</p>  
        <p type="p">X:X軸</p>  
        <p type="p">Y:Y軸</p>  
        <p type="p">Z:Z軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1802" publication-number="202613001"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613001.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613001</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130750</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有故障分類的儲存及提取系統</chinese-title>  
        <english-title>STORAGE AND RETRIEVAL SYSTEM WITH FAULT CATEGORIZATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">B65G1/137</main-classification>  
        <further-classification edition="200601120251218B">G05B23/02</further-classification>  
        <further-classification edition="202401120251218B">G06Q10/08</further-classification>  
        <further-classification edition="200601120251218B">G05B19/418</further-classification>  
        <further-classification edition="202301120251218B">G06F18/25</further-classification>  
        <further-classification edition="202301120251218B">G06N5/04</further-classification>  
        <further-classification edition="201901120251218B">G06N20/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商辛波提克有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SYMBOTIC LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕特爾　阿卡許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATEL, AAKASH S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比茲利　雷蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEAZLEY, RAYMOND I.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自動化儲存及提取系統，包括：多層儲存結構；複數個行動機器人，配置來穿越通道並將貨櫃運輸往返多層儲存結構中儲存位置；以及控制電路，與複數個行動機器人通訊地耦合。控制電路配置以：發送任務給複數個行動機器人，以進行儲存及提取任務；從複數個行動機器人接收行動機器人資料；將行動機器人資料以及任務作為系統資料儲存於系統資料庫中；接收包含資產識別符以及與故障事件關聯的故障時間戳的故障報告；基於資產識別符以及故障時間戳，從系統資料庫提取與故障事件相關的系統資料；以及基於與故障事件相關的系統資料，判定故障類型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An automated storage and retrieval system includes: a multi-level storage structure; a plurality of mobile robots configured to traverse the aisles and transport containers to and from storage locations in the multi-level storage structure and a control circuit communicatively coupled to the plurality of mobile robots. The control circuit being configured to: send tasks to the plurality of mobile robots to perform storage and retrieval tasks; receive mobile robot data from the plurality of mobile robots; store the mobile robot data and the tasks as system data in a system database; receive a fault report comprising an asset identifier and a fault timestamp associated with a fault event; retrieve system data associated with the fault event from the system database based on the asset identifier and the fault timestamp; and determine a fault type based on the system data associated with the fault event.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:訂單履行設施</p>  
        <p type="p">102:儲存結構</p>  
        <p type="p">104:儲格</p>  
        <p type="p">106:儲存位置</p>  
        <p type="p">108:通道</p>  
        <p type="p">110:儲存模組</p>  
        <p type="p">112:甲板</p>  
        <p type="p">115:轉向甲板</p>  
        <p type="p">148:行動機器人</p>  
        <p type="p">115-I/O:轉向甲板輸入/輸出</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1803" publication-number="202614828"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614828.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614828</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130811</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體器件以及用於製造其的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251110B">H10D62/10</main-classification>  
        <further-classification edition="202501120251110B">H10D62/60</further-classification>  
        <further-classification edition="202501120251110B">H10D62/80</further-classification>  
        <further-classification edition="200601120251110B">H02H9/02</further-classification>  
        <further-classification edition="200601120251110B">H02H9/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商力特半導體（無錫）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITTELFUSE SEMICONDUCTOR (WUXI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張環</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, GLENDA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周繼峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, JIFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體器件、裝置、結構及其相關聯的方法。該器件包括基板、第一基層、第二基層和第三基層。基板被設置在第一基層和第二基層與第三基層之間。該器件包括一個或多個第一摻雜區和一個或多個第二摻雜區。第一摻雜區被設置在第三基層中，並且第二摻雜區的至少一部分被設置在基板中。第一摻雜區和第二摻雜區形成一個或多個結，這些結被配置為增加半導體器件的電流傳導。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device, apparatus, structure and associated methods thereof. The device includes a substrate, a first base layer, a second base layer, and a third base layer. The substrate is disposed between the first and second base layers, and the third base layer. The device includes one or more first doping regions and one or second doping regions. The first doping regions are disposed in the third base layer and at least a portion of the second doping regions is disposed in the substrate. The first doping regions and the second doping regions form one or more junctions configured to increase current conduction of the semiconductor device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:半導體器件/器件/SIDACTor器件</p>  
        <p type="p">301:MT1端子/第一端子層/端子層</p>  
        <p type="p">302:基板</p>  
        <p type="p">303:MT2端子/第二端子層/端子層</p>  
        <p type="p">304a、304b:第一基層/基層/層</p>  
        <p type="p">305a、305b:第一方向/方向</p>  
        <p type="p">306:第二基層/基層/層</p>  
        <p type="p">307:方向</p>  
        <p type="p">308:第三基層/基層/層</p>  
        <p type="p">309a、309b、311、316a、316b:P-N結</p>  
        <p type="p">310a、310b、310c、310d:區</p>  
        <p type="p">312a、312b、314a、314b:摻雜區</p>  
        <p type="p">318a、318b:鈍化層</p>  
        <p type="p">MT1、MT2:端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1804" publication-number="202612916"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612916.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612916</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130869</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>書寫用具</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B43K27/08</main-classification>  
        <further-classification edition="200601120251231B">B43K1/01</further-classification>  
        <further-classification edition="200601120251231B">B43K8/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商百樂股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA PILOT CORPORATION (ALSO TRADING AS PILOT CORPORATION)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂元大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAMOTO, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田耕輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之書寫用具(10)具備：筆尖構件(30)，其具有形成筆跡之書寫部(31)；及軸筒(20)，其收容筆尖構件(30)之一部分；且筆尖構件(30)由彈性體形成；將筆尖構件(30)之前端(35)於軸向(da)壓扁1 mm後之復原率為90%以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:書寫用具</p>  
        <p type="p">20:軸筒</p>  
        <p type="p">22:前軸</p>  
        <p type="p">24:後軸</p>  
        <p type="p">28:油墨貯存體</p>  
        <p type="p">30:筆尖構件</p>  
        <p type="p">31:書寫部</p>  
        <p type="p">32:圓柱部</p>  
        <p type="p">33:後端部</p>  
        <p type="p">35:前端</p>  
        <p type="p">37:平面部</p>  
        <p type="p">39:側面</p>  
        <p type="p">da:軸向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1805" publication-number="202614411"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614411.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614411</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130875</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於訊號之背側功率通孔</chinese-title>  
        <english-title>USE BACK SIDE POWER VIAS FOR SIGNALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">H01L23/48</main-classification>  
        <further-classification edition="200601120251224B">H01L23/522</further-classification>  
        <further-classification edition="200601120251224B">H01L21/768</further-classification>  
        <further-classification edition="202501120251224B">H10D30/60</further-classification>  
        <further-classification edition="202501120251224B">H10D62/17</further-classification>  
        <further-classification edition="202501120251224B">H10D62/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏肯斯　瑪蒂努斯瑪麗亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BERKENS, MARTINUS MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克拉弗　西蒙約翰尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLAVER, SIMON JOHANNES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體元件可以包含基板。該半導體元件可以包含安置於基板背側的背側金屬層，並且可能包含第一跡線和第二跡線。該半導體元件可以包含元件層，該元件層可以包含虛設源極、虛設閘極、主動源極及主動閘極。該半導體元件可能包含前側金屬通路，該通路電連接虛設閘極和主動閘極。該元件可以包含連接第一通道和主動源極的第一金屬基板穿孔（TSV）。該元件可以包含連接第二通道和虛設源極的第二金屬TSV。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor device may include a substrate. The semiconductor device may include a backside metal layer disposed on a backside of the substrate and may include a first track and a second track. The semiconductor device may include a device layer may include a dummy source, a dummy gate, an active source, and an active gate. The semiconductor device may include a frontside metal pathway electrically connecting the dummy gate and the active gate. The device may include a first metal through substrate via (TSV) connecting the first track and the active source. The device may include a second metal TSV connecting the second track and the dummy source.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:元件</p>  
        <p type="p">402a:第一背側金屬</p>  
        <p type="p">402b:第一背側金屬</p>  
        <p type="p">402c:第一背側金屬</p>  
        <p type="p">404:第二背側金屬</p>  
        <p type="p">410:基板穿孔(TSV)</p>  
        <p type="p">412a:源極</p>  
        <p type="p">412b:源</p>  
        <p type="p">412c:源極</p>  
        <p type="p">412d:源極</p>  
        <p type="p">414:主動閘極</p>  
        <p type="p">416a:虛設閘極</p>  
        <p type="p">416b:虛設閘極</p>  
        <p type="p">418:前側金屬</p>  
        <p type="p">420a:接觸</p>  
        <p type="p">420b:接觸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1806" publication-number="202612842"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612842.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612842</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130879</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙面或單面工具機</chinese-title>  
        <english-title>DOUBLE-SIDE OR ONE-SIDE MACHINE TOOL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B24B7/16</main-classification>  
        <further-classification edition="201201120251231B">B24B37/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商萊普瑪斯特沃斯特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAPMASTER WOLTERS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉夫力　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAVLIC, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坎羅　晶恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANZOW, JOERN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種雙面或單面工具機，其包含較佳為環形的底部第工作盤及頂部反向軸承元件(counter-bearing element)，其中該第一工作盤及該反向軸承元件可經由旋轉驅動器而驅動以相對於彼此旋轉，其中在該第一工作盤與該反向軸承元件之間形成工作間隙以加工平坦工件之兩個面或一個面，其中該雙面或單面工具機亦具有機器基底部件，該機器基底部件具有支腳，當該雙面或單面工具機處於安裝狀態時，該機器基底部件藉由所述支腳擱置於生產區域之地板上，其中該機器基底部件支撐該第一工作盤及該反向軸承元件，其中所述支腳具有用於監測該第一工作盤之對準之感測器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a double-side or one-side machine tool, comprising a preferably annular bottom first working disk and a top counter-bearing element, wherein the first working disk and the counter-bearing element can be driven to rotate relative to each other via a rotary drive, wherein a working gap is formed between the first working disk and the counter-bearing element to machine both sides or one side of flat workpieces, wherein the double-side or one-side machine tool also has a machine base part with feet with which the machine base part rests on a floor of a production area when the double-side or one-side machine tool is in the installed state, wherein the machine base part supports the first working disk and the counter-bearing element, wherein the feet have sensors for monitoring an alignment of the first working disk.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:機器基底部件</p>  
        <p type="p">12:支腳</p>  
        <p type="p">14:地板</p>  
        <p type="p">16:第一支撐盤</p>  
        <p type="p">18:第一工作盤</p>  
        <p type="p">20:樞軸外殼</p>  
        <p type="p">22:樞軸臂</p>  
        <p type="p">24:第二支撐盤</p>  
        <p type="p">26:第二工作盤/反向軸承元件</p>  
        <p type="p">28:驅動軸</p>  
        <p type="p">30:感測器/光學感測器/重量感測器</p>  
        <p type="p">32:評估設備</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1807" publication-number="202614348"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614348.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614348</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130944</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拾起裝置、接合裝置、拾起方法及接合方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">H01L21/683</main-classification>  
        <further-classification edition="200601120251222B">B25J15/06</further-classification>  
        <further-classification edition="201701120251222B">H01L21/77</further-classification>  
        <further-classification edition="200601120251222B">H01L23/488</further-classification>  
        <further-classification edition="200601120251222B">B65G47/91</further-classification>  
        <further-classification edition="200601120251222B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上田陵司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, RYOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三根陽介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINE, YOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溝本康隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZOMOTO, YASUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供相關技術，抑制裸晶對於非吸附式的第1吸附頭的位置偏移，並且抑制粒子對於裸晶的附著。 &lt;br/&gt;解決手段為：拾取裝置從載具將裸晶沿著第1方向拾取。拾取裝置具備：第1吸附頭；止動件，限制前述第1吸附頭所吸附的前述裸晶的位移；固持器，將前述止動件固定在前述第1方向及與前述第1方向為相反方向的第2方向；第1驅動軸，使前述第1吸附頭相對於固持器移動；及控制電路。前述控制電路係在將前述固持器固定在期望的位置的狀態依照以下順序進行控制：（A）使前述第1吸附頭沿著前述第2方向移動；（B）前述第1吸附頭將前述裸晶以非接觸方式吸附；及（C）使前述第1吸附頭沿著前述第1方向移動到前述止動件限制前述裸晶的位移的位置為止。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">t1~t6:時刻</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1808" publication-number="202614202"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614202.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614202</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130957</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>潤洗處理條件決定方法、基板處理方法及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">H01L21/306</main-classification>  
        <further-classification edition="200601120251216B">B05C11/10</further-classification>  
        <further-classification edition="200601120251216B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤本誠也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMOTO, SEIYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] &lt;br/&gt;配合基板的表面狀態進行適當的潤洗處理。 &lt;br/&gt;[解決手段] &lt;br/&gt;基板處理方法包括：第一潤洗步驟，其係一邊從潤洗液供給部將潤洗液供給至基板的表面，一邊以第一轉速使基板旋轉；第二潤洗步驟，其係在該第一潤洗步驟之後，一邊繼續供給該潤洗液，一邊以比該第一轉速更低的第二轉速使該基板旋轉；第一偵測步驟，其係在實施該第二潤洗步驟時，藉由液膜狀態偵測部，偵測形成於該基板的表面上的液膜的狀態；以及第一判定步驟，其係判定在第一偵測步驟中所偵測到的液膜的狀態，是否滿足與液膜的液膜破裂相關的預先設定的基準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1,S2,S3,S4,S5,S6,S7,S8,S9,S10,S11,S12:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1809" publication-number="202613345"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613345.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613345</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130970</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體基板及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">C23C16/40</main-classification>  
        <further-classification edition="200601120251223B">C04B35/565</further-classification>  
        <further-classification edition="202501120251223B">H10D84/08</further-classification>  
        <further-classification edition="202501120251223B">H10D62/834</further-classification>  
        <further-classification edition="200601120251223B">C30B29/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大槻剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHTSUKI, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上東洋太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEHIGASHI, YOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松原壽樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUBARA, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木温</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部達夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, TATSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤三千登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, MICHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種半導體基板及其製造方法，該半導體基板具有：主面的面取向為(111)的Si基板、該Si基板上的碳摻雜Si層、該碳摻雜Si層上的3C-SiC層及該3C-SiC層上的GeO&lt;sub&gt;2&lt;/sub&gt;層。藉此可提供一種使高品質的GeO&lt;sub&gt;2&lt;/sub&gt;層成長於大直徑的Si(111)基板而成之半導體基板及其製造方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體基板</p>  
        <p type="p">2:Si(111)基板</p>  
        <p type="p">3:碳摻雜Si層</p>  
        <p type="p">4:碳摻雜Si層(具有空孔)</p>  
        <p type="p">5:3C-SiC層</p>  
        <p type="p">6:GeO&lt;sub&gt;2&lt;/sub&gt;層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1810" publication-number="202613238"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613238.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613238</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130974</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物</chinese-title>  
        <english-title>RESIN COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">C08L53/00</main-classification>  
        <further-classification edition="200601120251218B">C08L23/12</further-classification>  
        <further-classification edition="200601120251218B">C08F297/02</further-classification>  
        <further-classification edition="200601120251218B">C08K3/36</further-classification>  
        <further-classification edition="200601120251218B">C07F1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG CHEM, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金泰希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAE HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴伯拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, BO RA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺守爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, SOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭鍾憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAK, JONG HEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申恩知</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, EUN JI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林秀姬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IM, SEUL KI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李賢模</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYUN MO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金潤坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, YUN KON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閔世惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIN, SE HYE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林炫錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, HYUN SUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成桓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNG WHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明有關一種同時改善室溫和低溫抗衝擊性之聚烯烴系樹脂組成物及其製備方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a polyolefin-based resin composition with room-temperature and low-temperature impact resistance being improved at the same time, and relates to a preparation method of the same.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1811" publication-number="202613416"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613416.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613416</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130979</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣動模式與液壓模式之間的自適應和自動切換</chinese-title>  
        <english-title>ADAPTIVE AND AUTOMATIC SWITCHING BETWEEN PNEUMATIC AND HYDRAULIC MODES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">F15B11/072</main-classification>  
        <further-classification edition="200601120251219B">G01N3/10</further-classification>  
        <further-classification edition="200601120251219B">G05B23/02</further-classification>  
        <further-classification edition="200601120251219B">G05B13/02</further-classification>  
        <further-classification edition="200601120251219B">G05D16/20</further-classification>  
        <further-classification edition="200601120251219B">B25B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伊利諾工具工程公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷德蕭　尼可拉斯Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRADSHAW, NICHOLAS H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿里亞娜　查德威克卡德克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARYANA, CHADWICK KADEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種系統及方法，用於氣動模式與液壓模式之間的自適應及自動切換。範例系統包括一個或多個配置用於支援機械測試的處置部件，其中每個處置部件配置為在機械測試期間與材料處置操作結合使用，且每個處置部件均由氣動或液壓驅動；至少一個配置用於控制至少一個處置部件的控制器；以及可配置為提供複數個操作模式之間的自適應及自動切換的電路元件，複數個操作模式至少包括氣動模式及液壓模式。電路元件被配置為，在提供自適應及自動切換時，確定系統的硬體配置；並基於硬體配置選擇操作模式，其中所選的操作模式為氣動模式或液壓模式中之一者；且在需要時，致使切換至所確定的操作模式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods are provided for adaptive and automatic switching between pneumatic and hydraulic modes. An example system includes one or more handling components configured for supporting mechanical testing, where each handling component configured for use in conjunction with handling material during the mechanical testing, and where each handling component is pneumatically or hydraulically driven, at least one controller configured for controlling at least one handling component, and circuitry configurable to provide adaptive and automatic switching among a plurality of modes of operation that include, at least a pneumatic mode and a hydraulic mode. The circuitry is configured to, when providing the adaptive and automatic switching, determine hardware configuration of the system, select based on the hardware configuration, a mode of operation, with the selected mode of operation being one of the pneumatic mode and the hydraulic mode, and when needed, cause a switch to the determined mode of operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:系統</p>  
        <p type="p">210:主框架</p>  
        <p type="p">220:液壓夾具控制器</p>  
        <p type="p">230:液壓手持裝置</p>  
        <p type="p">240:氣動切換</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1812" publication-number="202613739"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613739.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613739</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130987</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於晶圓對準感測器之獨立於製程之整合式光學件</chinese-title>  
        <english-title>PROCESS INDEPENDENT INTEGRATED OPTICS FOR WAFER ALIGNMENT SENSORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">G03F9/00</main-classification>  
        <further-classification edition="202101120251222B">G02B7/28</further-classification>  
        <further-classification edition="200601120251222B">G01B11/26</further-classification>  
        <further-classification edition="200601120251222B">H01L21/68</further-classification>  
        <further-classification edition="201201120251222B">G03F1/38</further-classification>  
        <further-classification edition="200601120251222B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佳哈尼　莎曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAHANI, SAMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於判定一對準感測器中一目標之一聚焦或傾斜之系統。該系統包括兩個光學感測器，該兩個光學感測器各自具有設計特徵，該等設計特徵使該兩個光學感測器基於由該兩個光學感測器感測之光而在該目標之該聚焦或該傾斜方面具有不同輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system is disclosed for determining a focus or tilt of a target in an alignment sensor. The system includes two optical sensors, each having design features that cause the two optical sensors to have differing outputs with respect to the focus or the tilt of the target based on light sensed by the two optical sensors.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:輻射或照明源</p>  
        <p type="p">4:偵測器</p>  
        <p type="p">410:光學感測器</p>  
        <p type="p">T:目標</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1813" publication-number="202612735"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612735.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612735</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114130988</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉由投予PD-1抑制劑治療皮膚癌之方法</chinese-title>  
        <english-title>METHODS OF TREATING SKIN CANCER BY ADMINISTERING A PD-1 INHIBITOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K39/395</main-classification>  
        <further-classification edition="200601120260102B">C07K16/28</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商再生元醫藥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福瑞　馬修</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURY, MATTHEW G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛伊　尹瑟列</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOWY, ISRAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於治療癌症(例如皮膚癌)、降低癌症(例如皮膚癌)之嚴重程度或抑制癌症(例如皮膚癌)生長的方法。本發明方法包含向有需要的個體投予治療有效量的程式化死亡1 (PD-1)拮抗劑(例如抗PD-1抗體)。在某些具體例中，皮膚癌為皮膚鱗狀細胞癌或基底細胞癌。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides methods for treating, reducing the severity, or inhibiting the growth of cancer (&lt;i&gt;e.g.&lt;/i&gt;, skin cancer). The methods of the present invention comprise administering to a subject in need thereof a therapeutically effective amount of a programmed death 1 (PD-1) antagonist (&lt;i&gt;e.g.&lt;/i&gt;, an anti-PD-1 antibody). In certain embodiments, the skin cancer is cutaneous squamous cell carcinoma or basal cell carcinoma.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1814" publication-number="202614825"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614825.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614825</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131012</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置、以及半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251226B">H10D30/67</main-classification>  
        <further-classification edition="202501120251226B">H10D62/80</further-classification>  
        <further-classification edition="202501120251226B">H10D30/01</further-classification>  
        <further-classification edition="200601120251226B">H01L21/20</further-classification>  
        <further-classification edition="200601120251226B">H01L21/31</further-classification>  
        <further-classification edition="200601120251226B">H01L21/3205</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎舜平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, SHUNPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部壮太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, SOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井坂史人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISAKA, FUMITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮入秀和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAIRI, HIDEKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>掛端哲弥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAKEHATA, TETSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種使用高品質的半導體膜的半導體裝置。半導體裝置包括藍寶石基板、第一絕緣層及電晶體。第一絕緣層設置在基板上並且具有到達基板的開口部。電晶體包括半導體層。半導體層包括與第一絕緣層的頂面接觸的部分以及在開口部中與基板的頂面接觸的部分。基板具有單晶結構。第一絕緣層具有非晶結構。半導體層包含金屬氧化物並且具有單晶結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:電晶體</p>  
        <p type="p">201:絕緣層</p>  
        <p type="p">210:基板</p>  
        <p type="p">220:開口部</p>  
        <p type="p">230:半導體層</p>  
        <p type="p">240a:導電層</p>  
        <p type="p">240a1:導電層</p>  
        <p type="p">240a2:導電層</p>  
        <p type="p">240b:導電層</p>  
        <p type="p">240b1:導電層</p>  
        <p type="p">240b2:導電層</p>  
        <p type="p">241a:絕緣層</p>  
        <p type="p">241b:絕緣層</p>  
        <p type="p">242a:導電層</p>  
        <p type="p">242b:導電層</p>  
        <p type="p">250:絕緣層</p>  
        <p type="p">260:導電層</p>  
        <p type="p">260a:導電層</p>  
        <p type="p">260b:導電層</p>  
        <p type="p">271a:絕緣層</p>  
        <p type="p">271b:絕緣層</p>  
        <p type="p">275:絕緣層</p>  
        <p type="p">280:絕緣層</p>  
        <p type="p">282:絕緣層</p>  
        <p type="p">283:絕緣層</p>  
        <p type="p">285:絕緣層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1815" publication-number="202614120"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614120.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614120</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131020</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學裝置及帶電粒子束裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">H01J37/10</main-classification>  
        <further-classification edition="200601120250901B">H01J37/244</further-classification>  
        <further-classification edition="200601120250901B">H01J37/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩中拓夢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWANAKA, TAKUMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>關口好文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKIGUCHI, YOSHIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立花一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TACHIBANA, ICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川野源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWANO, HAJIME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能夠從單一通過孔向試料照射計測光與狀態變化光的光學裝置及帶電粒子束裝置。一種光學裝置，具備以下構造：計測光源，其射出照射於試料的光線，該光線是用於測量前述試料之高度的計測光；通過孔，其配置在前述計測光源與前述試料之間，供前述計測光通過；狀態變化光源，其射出照射於前述試料的光線，該光線是用於改變前述試料狀態的狀態變化光；以及控制部，其控制各部件，其特徵為，還具備將前述狀態變化光導引至前述通過孔的光束合併器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學裝置</p>  
        <p type="p">101:試料</p>  
        <p type="p">110:計測光</p>  
        <p type="p">111:計測光源</p>  
        <p type="p">112:狹縫板</p>  
        <p type="p">113:聚光透鏡</p>  
        <p type="p">114:偵測透鏡</p>  
        <p type="p">115:受光元件</p>  
        <p type="p">120:狀態變化光</p>  
        <p type="p">121:狀態變化光源</p>  
        <p type="p">122:光束整形器</p>  
        <p type="p">123:載物台</p>  
        <p type="p">130:通過孔</p>  
        <p type="p">131:光束合併器</p>  
        <p type="p">140:光軸</p>  
        <p type="p">141:試料觀察部</p>  
        <p type="p">150:控制部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1816" publication-number="202614836"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614836.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614836</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131039</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碳化矽磊晶成長用基板、其製造方法及半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251224B">H10D62/832</main-classification>  
        <further-classification edition="200601120251224B">C30B25/12</further-classification>  
        <further-classification edition="201901120251224B">B32B7/06</further-classification>  
        <further-classification edition="200601120251224B">H01L21/20</further-classification>  
        <further-classification edition="200601120251224B">H01L21/425</further-classification>  
        <further-classification edition="200601120251224B">C30B33/00</further-classification>  
        <further-classification edition="200601120251224B">C30B29/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楠木克輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSUNOKI, KATSUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田雅人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧米西塔利克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOUMISSI, TARIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小西繁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONISHI, SHIGERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永田和寿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGATA, KAZUTOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 提供能避免起因於熱膨脹係數之差的翹曲等，支持基板與種晶層的接合容易，亦能耐磊晶成長製程中的高溫之碳化矽磊晶成長用基板、其製造方法及半導體裝置的製造方法。 &lt;br/&gt;　　[解決手段] SiC磊晶成長用基板(1)係依序具備：熱膨脹係數與SiC磊晶膜大致一致之支持基板(20)；具有1800℃以上的熔點之接合層(12)；及單晶SiC的種晶層(14)。其製造方法係在單晶SiC的貼合面形成接合層之同時，注入離子以形成離子注入界面，隔著接合層接合單晶SiC與支持基板後，在離子注入界面分離、剝離單晶SiC，將單晶SiC的一部分作為種晶層薄膜轉印至支持基板側。半導體裝置的製造方法係使用成長用基板(1)成長SiC磊晶膜，並在SiC磊晶膜上形成裝置結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:SiC磊晶成長用基板</p>  
        <p type="p">12:接合層</p>  
        <p type="p">14:種晶層</p>  
        <p type="p">20:支持基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1817" publication-number="202613852"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613852.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613852</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131053</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理裝置、方法、程式及系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120251228B">G06F21/10</main-classification>  
        <further-classification edition="202001120251228B">G06F40/109</further-classification>  
        <further-classification edition="200601120251228B">H04L9/32</further-classification>  
        <further-classification edition="202301120251228B">G06Q30/06</further-classification>  
        <further-classification edition="202201120251228B">H04L67/568</further-classification>  
        <further-classification edition="201901120251228B">G06F16/957</further-classification>  
        <further-classification edition="201901120251228B">G06F16/958</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商森澤股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORISAWA INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小室貴史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMURO, TAKAFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田深雪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, MIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種，在網站的製作、公開、營運是有複數個主體參與的情況下，可更進一步減輕使用到藉由與字型發布事業者之契約而接受發布之字型的網站之製作、公開、營運網站之作業負荷的技術。 &lt;br/&gt;　　[解決手段]於記憶部中係被構成為，記憶有：隨應於利用而需要利用費之支付的付費字型之資訊、和利用付費字型的契約者之資訊。程式係令1或複數個電腦處理器，執行：對於隨著付費字型之利用而支付利用費的契約，為了使付費字型在網站中被顯示而將被要嵌入至該網站之原始碼中的嵌入用之資訊，以隨著每一契約而為唯一之資訊的方式，加以生成之步驟；和將已被生成之唯一的嵌入用之資訊，與契約的資訊建立關連，而記憶在記憶部中之步驟；和藉由瀏覽者利用瀏覽器向利用付費字型的網站進行存取，就會基於該網站的嵌入用之資訊，來特定該網站中所被使用的付費字型之步驟；和藉由將已特定之付費字型予以回應，而對網站的瀏覽者，讓其在已被特定之付費字型有被使用的狀態下，瀏覽網站之步驟；並執行：在無需變更針對網站而被生成之嵌入用之資訊的情況下，就可將在網站中將利用費支付對象之字型做利用之契約所涉及之契約者之資訊的變更操作，從使用者予以受理之步驟；和隨應於契約所涉及之契約者之資訊的變更操作，在無需變更於變更前所被生成之唯一的嵌入用之資訊的情況下，就將於網站中利用付費字型的契約者之資訊予以更新，並記憶在記憶部中之步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1600:契約操作畫面</p>  
        <p type="p">1602:帳號顯示領域</p>  
        <p type="p">1604:設定顯示領域</p>  
        <p type="p">1606:資費方案顯示領域</p>  
        <p type="p">1608:契約內容指定部</p>  
        <p type="p">1616:主體更新操作部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1818" publication-number="202613331"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613331.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613331</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131073</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超硬合金、切削工具用胚料、切削工具及切削加工物的製造方法</chinese-title>  
        <english-title>CEMENTED CARBIDE, CUTTING TOOL BLANK, CUTTING TOOL, AND MANUFACTURING METHOD OF MACHINED PRODUCT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">C22C29/08</main-classification>  
        <further-classification edition="200601120251224B">B23B51/00</further-classification>  
        <further-classification edition="202301120251224B">C22C1/05</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商京瓷股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KYOCERA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤本啓佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMOTO, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青木志賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, MOTOYASU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的超硬合金係包含：複數個含有W及C的硬質粒子以及結合複數個硬質粒子的結合相；與剖面中的複數個硬質粒子的等效圓直徑相關的度數分布中，等效圓直徑的階級的寬度為0.05μm時，度數分布的眾數為0.15μm以上0.4μm以下；度數分布的眾數係小於包含賦予度數分布的半高全寬的等效圓直徑的範圍中的中央的值的階級的階級值；將包含賦予度數分布的半高全寬的等效圓直徑的範圍中的等效圓直徑的上限值的階級中的度數定義為F1，將包含上限值的階級的階級值與度數分布的半高半寬相加而獲得的值包含在內的階級中的度數定義為F2時， F1及F2係滿足F2＜F1／2的關係。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cemented carbide of the present invention is composed of a plurality of hard particles containing W and C, and a binder phase that bonds the plurality of hard particles. In a frequency distribution of equivalent circular diameters of the plurality of hard particles in a cross section, when the width of the equivalent circular diameter class is 0.05 μm, the mode of the frequency distribution is 0.15 μm or more and 0.4 μm or less, and the mode of the frequency distribution is smaller than a class value that includes a median value in the range of equivalent circular diameters that gives a full width at half maximum of the frequency distribution. The frequency F1 in a class including the upper limit value of the range of equivalent circular diameters that gives the full width at half maximum of the frequency distribution, and the frequency F2 in a class including the value obtained by adding the class value of the class including the upper limit value to a half width at half maximum of the frequency distribution, satisfy the relationship F2 ＜ F1/2.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">B(FWHM):賦予度數分布的半高全寬的等效圓直徑的範圍</p>  
        <p type="p">B(HWHM):賦予度數分布的半高半寬的等效圓直徑的範圍</p>  
        <p type="p">Bw:寬度(階級的寬度)</p>  
        <p type="p">C:B(FWHM)的中央的值</p>  
        <p type="p">Fmax:度數的最大值</p>  
        <p type="p">F1,F2,F3:度數</p>  
        <p type="p">Sup:B(FWHM)中的等效圓直徑的上限值(上限值)</p>  
        <p type="p">Mo:眾數</p>  
        <p type="p">Me:度數分布的中央值(中央值)</p>  
        <p type="p">V:包含上限值Sup的階級的階級值與度數分布的B(HWHM)相加而獲得的值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1819" publication-number="202614591"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614591.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614591</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131118</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線通訊裝置以及無線通訊裝置的操作方法</chinese-title>  
        <english-title>WIRELESS COMMUNICATION DEVICE AND OPERATION METHOD OF WIRELESS COMMUNICATION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H04L25/02</main-classification>  
        <further-classification edition="200601120251103B">H04L25/03</further-classification>  
        <further-classification edition="201701120251103B">H04B7/0413</further-classification>  
        <further-classification edition="202301120251103B">H04W72/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金周漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JOOHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閔庚白</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIN, KYOUNGBAEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭暎錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, YOUNGSEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種無線通訊裝置包括射頻積體電路（radio-frequency integrated circuit，RFIC）、包括處理電路的一或多個處理器、以及儲存指令的記憶體。指令當由一或多個處理器個別地或集體地執行時，致使得無線通訊裝置經由RFIC接收包括複數個子載波的接收信號，以及基於頻域計算第一對數似然比（log-likelihood ratio，LLR）。複數個子載波包括第一子載波和與第一子載波相鄰的第二子載波。第一LLR的計算包括測量第一子載波和第二子載波之間的通道變化，基於通道變化確定第二子載波的第二線性檢測矩陣，以及基於第一子載波的第一線性檢測矩陣和第二線性檢測矩陣中的至少一個計算第一LLR。第一子載波是樞軸子載波。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:通訊系統</p>  
        <p type="p">100:發射器(TX)</p>  
        <p type="p">102-1~102-M:傳輸天線</p>  
        <p type="p">200:接收器(RX)</p>  
        <p type="p">202-1~202-N:接收天線</p>  
        <p type="p">221:低功耗對數似然比(LLR)計算模組</p>  
        <p type="p">300:多輸入多輸出(IMO)通道</p>  
        <p type="p">h&lt;sub&gt;1,1&lt;/sub&gt;~h&lt;sub&gt;1,M&lt;/sub&gt;、h&lt;sub&gt;N,1&lt;/sub&gt;~h&lt;sub&gt;N,M&lt;/sub&gt;:有效通道增益</p>  
        <p type="p">x&lt;sub&gt;1&lt;/sub&gt;~x&lt;sub&gt;M&lt;/sub&gt;:傳輸符號</p>  
        <p type="p">y&lt;sub&gt;1&lt;/sub&gt;~y&lt;sub&gt;N&lt;/sub&gt;:接收符號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1820" publication-number="202613310"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613310.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613310</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131123</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有三氮唑結構的GalNAc化合物及其寡核苷酸綴合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120260102B">C12N15/113</main-classification>  
        <further-classification edition="200601120260102B">C07H15/26</further-classification>  
        <further-classification edition="200601120260102B">A61K31/713</further-classification>  
        <further-classification edition="201701120260102B">A61K47/54</further-classification>  
        <further-classification edition="200601120260102B">A61P1/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京悅康科創醫藥科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING YOUCAREKECHUANG PHARMACEUTICAL TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃澤傲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, ZEAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋更申</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, GENGSHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李振民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHENMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種含有三氮唑結構的GalNAc化合物及其寡核苷酸綴合物，具體揭露了一種如式（I）所示的GalNAc化合物或其藥學上可接受的鹽。本發明中的GalNAc化合物能與寡核苷酸形成綴合物，該綴合物能實現寡核苷酸的高效肝標靶遞送，調控基因表達，能夠用於預防和/或治療由肝細胞中特定基因的表達而引起的疾病。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1821" publication-number="202614162"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614162.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614162</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131136</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以預防高深寬比結構之黏滯作用及/或修補高深寬比結構的包含氟化氫、醇類及添加劑之氣體混合物</chinese-title>  
        <english-title>GAS MIXTURE INCLUDING HYDROGEN FLUORIDE, ALCOHOL AND AN ADDITIVE FOR PREVENTING STICTION OF AND/OR REPAIRING HIGH ASPECT RATIO STRUCTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">H01L21/02</main-classification>  
        <further-classification edition="200601120251218B">H01L21/324</further-classification>  
        <further-classification edition="200601120251218B">H01L21/67</further-classification>  
        <further-classification edition="200601120251218B">H01L21/687</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商蘭姆研究股份公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱濟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, JI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米拉艾特　傑洛姆　米歇爾　多明尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MELAET, GEROME MICHEL DOMINIQUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉夫多夫斯基　那森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAVDOVSKY, NATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴勒威茲　拉法爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DYLEWICZ, RAFAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅　世禮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUI, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬塞爾懷特　那森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUSSELWHITE, NATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用以處理一基材處理系統中之一基材之氣體混合物包括氟化氫氣體、醇類的蒸氣、由鹼類構成的添加劑、及載體氣體。該氣體混合物可用以處理被配置在基材的表面上之高深寬比(HAR)結構。可使用一第一潤洗液體來旋轉潤洗基材的表面。該第一潤洗液體從基材的表面被旋離。在第一潤洗液體被配送之後，該氣體混合物被引導到基材的表面上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A gas mixture for treating a substrate in a substrate processing system includes hydrogen fluoride gas, a vapor of an alcohol, an additive consisting of a base, and a carrier gas. The gas mixture can be used to treat high aspect ratio (HAR) structures arranged on a surface of a substrate. A surface of the substrate may be spin rinsed using a first rinsing liquid. The first rinsing liquid is spun off from the surface of the substrate. The gas mixture is directed onto the surface of the substrate after the first rinsing liquid is dispensed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">180:方法</p>  
        <p type="p">184,188,192,194,198,202:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1822" publication-number="202614264"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614264.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614264</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131149</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>SiGe基板的表面缺陷的評價方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L21/66</main-classification>  
        <further-classification edition="202501120251229B">H10D62/832</further-classification>  
        <further-classification edition="200601120251229B">H01L21/306</further-classification>  
        <further-classification edition="200601120251229B">G01N21/95</further-classification>  
        <further-classification edition="200601120251229B">G01N1/32</further-classification>  
        <further-classification edition="201701120251229B">G06T7/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越半導體股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大槻剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHTSUKI, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中佑宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木温</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部達夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, TATSUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤三千登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, MICHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>土屋慶太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUCHIYA, KEITARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是一種SiGe基板的表面缺陷的評價方法，其特徵在於包括：準備截面觀察用SiGe磊晶基板的步驟；第一缺陷顯現步驟，其對於截面觀察用基板的表面，透過選擇性蝕刻而使缺陷顯現出來；截面觀察步驟，其係事先針對截面觀察用基板，評價透過前述選擇性蝕刻所形成之蝕刻凹坑的截面形狀，並求出所欲評價的缺陷的橫向寬度方向尺寸相對於深度之基準比；準備評價用基板的步驟；第二缺陷顯現步驟，其對於評價用基板的表面，透過選擇性蝕刻而使缺陷顯現出來；評價步驟，其係對已供以第二缺陷顯現步驟的評價用基板實施表面觀察，僅對橫向寬度方向尺寸相對於深度之比為前述基準比以下的缺陷進行計數，來評價表面缺陷。藉此能夠提供一種SiGe基板的表面缺陷的評價方法，其能容易且高精度地實行缺陷評價。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1823" publication-number="202613419"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613419.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613419</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131157</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>滑動鎖定螺帽及其單元</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">F16B39/24</main-classification>  
        <further-classification edition="200601120251217B">F16B39/04</further-classification>  
        <further-classification edition="200601120251217B">F16B37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商中谷製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAYA SEISAKUSHO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中谷孝芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAYA, TAKAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之滑動鎖定螺帽(1)具備：大致中空圓筒形狀之螺帽本體(2)；錐形部(3)，其向螺帽本體(2)之內壁面且一端部縮徑；開合螺帽體(4)，其沿錐形部(3)於螺帽本體(2)之軸向滑動，於內側具有螺紋圈；大致中空圓筒形狀之鎖定體(5)，其相對於開合螺帽體(4)配置於螺帽本體(2)之另一端部側；以及按壓凸緣(6)及鎖定凸緣(7)，其等自鎖定體(5)之兩端部朝外側方向擴展而形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:滑動鎖定螺帽</p>  
        <p type="p">2:螺帽本體</p>  
        <p type="p">3:錐形部</p>  
        <p type="p">4:開合螺帽體</p>  
        <p type="p">5:鎖定體</p>  
        <p type="p">6:按壓凸緣</p>  
        <p type="p">7:鎖定凸緣</p>  
        <p type="p">8:圓環板</p>  
        <p type="p">9:彈簧</p>  
        <p type="p">10:彎曲部</p>  
        <p type="p">13:階差部</p>  
        <p type="p">A:螺帽本體之一端部</p>  
        <p type="p">B:螺帽本體之另一端部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1824" publication-number="202613364"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613364.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613364</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131159</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鍍敷液</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">C25D3/38</main-classification>  
        <further-classification edition="200601120251222B">C25D5/10</further-classification>  
        <further-classification edition="200601120251222B">C23C18/40</further-classification>  
        <further-classification edition="200601120251222B">C23F11/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商傑希優股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JCU CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>相澤涼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AIZAWA, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福本友理奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUMOTO, YURINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐波正浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAWA, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>椎名麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIINA, URARA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種能夠形成抗氧化鍍敷皮膜之鍍敷液。本發明之鍍敷液含有金屬離子、及電荷密度為1.5 mEq/g以上之平滑劑。平滑劑之電荷密度較佳為2.0～20.0 mEq/g。又，該鍍敷液較佳為：以10～300 mg/L之濃度含有平滑劑，進而以0.1～5 mg/L之濃度含有光澤劑，以及以0.1～2000 mg/L之濃度含有抑制劑，又，較佳為鍍敷液中之金屬離子包含銅離子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1825" publication-number="202614393"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614393.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614393</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131160</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在晶粒邊緣之封裝脫層預防結構</chinese-title>  
        <english-title>ENCAPSULATION DELAMINATION PREVENTION STRUCTURES AT DIE EDGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H01L23/31</main-classification>  
        <further-classification edition="200601120251219B">B32B7/14</further-classification>  
        <further-classification edition="200601120251219B">H01L21/56</further-classification>  
        <further-classification edition="202501120251219B">H10D62/83</further-classification>  
        <further-classification edition="202501120251219B">H10D62/85</further-classification>  
        <further-classification edition="202501120251219B">H10D80/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商沃孚半導體有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOLFSPEED, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里希特　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHTER, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴拉羅曼　德瓦拉詹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BALARAMAN, DEVARAJAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克弗森　布萊斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCPHERSON, BRICE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝祥遇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種功率半導體裝置，其包含一半導體結構，該半導體結構包括：一主動區；一封裝材料，其在該半導體結構上；及複數個黏著特徵，其等沿著與該封裝材料之一界面位於該半導體結構中或該半導體結構上。該界面橫向地位於該半導體結構之該主動區與至少一個邊緣之間。亦論述相關裝置及製造方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power semiconductor device includes a semiconductor structure comprising an active region, an encapsulation material on the semiconductor structure, and a plurality of adhesion features in or on the semiconductor structure along an interface with the encapsulation material. The interface is laterally between the active region and at least one edge of the semiconductor structure. Related devices and fabrication methods are also discussed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:主動區</p>  
        <p type="p">16:邊緣終端區/非主動區</p>  
        <p type="p">30:接面障壁(JB)元件/長形條帶</p>  
        <p type="p">36:同心保護環</p>  
        <p type="p">100:功率半導體裝置/肖特基二極體</p>  
        <p type="p">120’:半導體結構</p>  
        <p type="p">152’:保護性外塗層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1826" publication-number="202614296"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614296.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614296</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131168</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>燒結壓機</chinese-title>  
        <english-title>SINTERING PRESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">H01L21/67</main-classification>  
        <further-classification edition="200601120251216B">H01L21/683</further-classification>  
        <further-classification edition="200601120251216B">H01L23/488</further-classification>  
        <further-classification edition="200601120251216B">H05K3/32</further-classification>  
        <further-classification edition="200601120251216B">H05K3/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義大利商亞姆艾克斯自動矩陣股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMX-AUTOMATRIX S.R.L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希瓦洛基　尼古拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHIVALOCCHI, NICOLA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種燒結壓機，用於在一基板（12）上燒結電子元件（10），包含一壓板（60）、一加熱迴路（72）適於將該壓板（60）加熱至一預設燒結溫度、一較冷之基座板（80）延伸設置於該壓板（60）之下，以及一或多個間隔元件（4）設置於該壓板（60）與該基座板（80）之間，該間隔元件設置於該壓板（60）之過熱區（62），並由導熱材料製成，以允許形成在當該加熱迴路啟動時能降低該些過熱區（62）溫度的熱橋。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A sintering press for sintering electronic components (10) on a substrate (12), comprises a pressing plate (60), a heating circuit (72) adapted to bring the pressing plate (60) to a preset sintering temperature, a cooler base plate (80) extending beneath the pressing plate (60), and one or more spacer elements (4) interposed between the pressing plate (60) and the base plate (80), placed at overheating zones (62) of the pressing plate (60) and made of a thermally conductive material, so as to allow the formation of thermal bridges which lower the temperature of said overheating zones (62) when the heating circuit is activated.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:間隔元件</p>  
        <p type="p">5:下部</p>  
        <p type="p">6:彈性元件</p>  
        <p type="p">7:上部</p>  
        <p type="p">12':壓合面</p>  
        <p type="p">60:壓板</p>  
        <p type="p">72:加熱迴路</p>  
        <p type="p">80:基座板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1827" publication-number="202613625"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613625.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613625</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131183</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>大視場摺疊光柵繞射波導</chinese-title>  
        <english-title>LARGE FIELD-OF-VIEW FOLD-GRATING DIFFRACTIVE WAVEGUIDE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">G02B6/124</main-classification>  
        <further-classification edition="200601120251217B">G02B6/34</further-classification>  
        <further-classification edition="200601120251217B">G02B5/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅倫佐　賽門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LORENZO, SIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽爾　大衛亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SELL, DAVID ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴爾嘉瓦　薩馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHARGAVA, SAMARTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例大體與擴增實境波導有關，適用於擴增實境、虛擬實境及混合現實。更特定言之，此處描述的實施例提供了具有大視場的波導及其形成方法。在一個實施例中，提供了波導。該波導包括入耦合器（IC）光柵。該入耦合器（IC）光柵包含複數個閃耀結構，複數個閃耀結構位於基板的上方。複數個閃耀結構具有相對於平行於基板的平面而具有傾斜角度的閃耀表面。該波導還包括一種金屬材料，該金屬材料位於複數個閃耀結構的上方。此外，還有中間光柵和出耦合器（OC）光柵，各自包括複數個裝置結構，這些裝置結構具有可變的深度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure generally relate to augmented reality waveguides for augmented, virtual, and mixed reality. More specifically, embodiments described herein provide waveguides with a large field-of-view and a method of forming the same. In one embodiment, a waveguide is provided. The waveguide includes an incoupler (IC) grating. The incoupler (IC) grating includes a plurality of blazed structures disposed over a substrate. The plurality of blazed structures having a blazed surface with a slant angle relative to a plane parallel to the substrate. The waveguide further includes a metal material disposed over the plurality of blazed structures. An intermediate grating and an outcoupler (OC) grating each including a plurality of device structures. The plurality of device structures having a variable depth.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:波導</p>  
        <p type="p">101:基板</p>  
        <p type="p">102:入耦合器光柵</p>  
        <p type="p">103:裝置材料</p>  
        <p type="p">104:中間光柵</p>  
        <p type="p">105:第二側塗層</p>  
        <p type="p">106:出耦合器光柵</p>  
        <p type="p">108:閃耀結構</p>  
        <p type="p">110:結構</p>  
        <p type="p">200A:第一配置</p>  
        <p type="p">202:深度</p>  
        <p type="p">203:閃耀表面</p>  
        <p type="p">204:傾斜角度</p>  
        <p type="p">207:金屬材料</p>  
        <p type="p">212:深度</p>  
        <p type="p">212a:部分</p>  
        <p type="p">213:深度</p>  
        <p type="p">213b:部分</p>  
        <p type="p">214:包覆層</p>  
        <p type="p">222a:寬度</p>  
        <p type="p">222b:寬度</p>  
        <p type="p">244:總厚度</p>  
        <p type="p">246:厚度</p>  
        <p type="p">253:厚度</p>  
        <p type="p">p:平面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1828" publication-number="202613346"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613346.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613346</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131220</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超導化合物及用於製造其之方法</chinese-title>  
        <english-title>SUPERCONDUCTING COMPOUNDS AND METHODS FOR MAKING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C23C16/40</main-classification>  
        <further-classification edition="200601120260102B">C23C16/455</further-classification>  
        <further-classification edition="200601120260102B">C23C16/52</further-classification>  
        <further-classification edition="200601120260102B">C23C16/56</further-classification>  
        <further-classification edition="200601120260102B">H01B1/08</further-classification>  
        <further-classification edition="202301120260102B">H10N60/85</further-classification>  
        <further-classification edition="202301120260102B">H10N60/01</further-classification>  
        <further-classification edition="202301120260102B">H10N60/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商量子設計材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUANTUM DESIGNED MATERIALS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋特　拉法爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GATT, REFAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種超導製品包括基板及在該基板上形成之超導金屬氧化物膜。該金屬氧化物膜包括鹼金屬之離子、過渡金屬之離子以及鹼土金屬或稀土金屬之離子。舉例而言，該金屬氧化物膜可包括Rb離子、La離子及Cu離子。該超導金屬氧化物膜對於超導性起始之臨界溫度可為高於250 K，例如，高於室溫。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A superconducting article includes a substrate and a superconducting metal oxide film formed on the substrate. The metal oxide film including ions of an alkali metal, ions of a transition metal, and ions of an alkaline earth metal or a rare earth metal. For instance, the metal oxide film can include Rb ions, La ions, and Cu ions. The superconducting metal oxide film can have a critical temperature for onset of superconductivity of greater than 250 K, e.g., greater than room temperature.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11、12、13、14:過渡金屬離子</p>  
        <p type="p">21、22、23、24:陰離子</p>  
        <p type="p">31、32:緩衝離子</p>  
        <p type="p">34、35:距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1829" publication-number="202613588"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613588.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613588</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131261</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線裝置之間的參考架構協調</chinese-title>  
        <english-title>FRAME OF REFERENCE COORDINATION BETWEEN WIRELESS DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251201B">G01S5/02</main-classification>  
        <further-classification edition="200601120251201B">G01C21/16</further-classification>  
        <further-classification edition="200901120251201B">H04W64/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱薩瓦雷迪加里　喜瑪雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KESAVAREDDIGARI, HIMAJA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古拉帝　卡皮爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GULATI, KAPIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法希洛夫斯基　丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VASSILOVSKI, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬許　吉恩　衛斯理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARSH, GENE WESLEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳世俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於在無線裝置之間協調一參考架構的技術可包含：判定一無線行動裝置相對於其局部坐標系的一位移向量，該位移向量指示該無線行動裝置在一第一時間與一第二時間之間的一位移。技術可進一步包含：該無線行動裝置從一第一無線參考裝置接收該無線行動裝置相對於一共同參考方向的一位移向量的一指示，及至少部分地基於校正資訊來調整該共同參考方向相對於該無線行動裝置的局部坐標系的一所估計對準，該校正資訊由對下列的一比較來判定：(i)該無線行動裝置相對於其局部坐標系的該位移向量與(ii)該無線行動裝置相對於該共同參考方向的該位移向量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques for coordinating a frame of reference between wireless devices may comprise determining a displacement vector of a wireless mobile device with respect to its local coordinate system, the displacement vector indicative of a displacement of the wireless mobile device between a first time and a second time. Techniques may further comprise the wireless mobile device receiving, from a first wireless reference device, an indication of a displacement vector of the wireless mobile device with respect to a common reference direction, and adjusting an estimated alignment of the common reference direction with respect to the wireless mobile device’s local coordinate system, based at least in part on correction information determined from a comparison of (i) the displacement vector of the wireless mobile device with respect to its local coordinate system with (ii) the displacement vector of the wireless mobile device with respect to the common reference direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:程序</p>  
        <p type="p">505:無線參考裝置</p>  
        <p type="p">510:無線行動裝置</p>  
        <p type="p">515,530,535,540,545,555,565,575:方塊；操作</p>  
        <p type="p">520:箭頭</p>  
        <p type="p">525:箭頭</p>  
        <p type="p">550:箭頭</p>  
        <p type="p">560:箭頭</p>  
        <p type="p">570:箭頭</p>  
        <p type="p">580:箭頭</p>  
        <p type="p">585:箭頭；方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1830" publication-number="202614224"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614224.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614224</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131346</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法、及基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">H01L21/316</main-classification>  
        <further-classification edition="200601120250902B">H01L21/324</further-classification>  
        <further-classification edition="200601120250902B">H01L21/677</further-classification>  
        <further-classification edition="202501120250902B">H10D62/17</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牧祐介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹松佑介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEMATSU, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仲野彰義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, AKIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷村英昭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIMURA, HIDEAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上野智宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UENO, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基板處理方法，其適合形成較薄且優質之IL(interfacial layer)。基板處理方法包括：氧化矽膜形成工序(S2)，其係將氧化性處理液供給至形成於基板之矽層之表面，而於該矽層之表面形成氧化矽膜；及加熱工序(S4)，其係藉由閃光燈對形成有上述氧化矽膜之上述基板進行加熱。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1~S7:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1831" publication-number="202613802"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613802.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613802</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131351</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>啟用處理器裝置中的高效能可擴縮矩陣延伸（ＳＭＥ）指令發布</chinese-title>  
        <english-title>ENABLING HIGH-PERFORMANCE SCALABLE MATRIX EXTENSION (SME) INSTRUCTION ISSUE IN PROCESSOR DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251119B">G06F9/30</main-classification>  
        <further-classification edition="200601120251119B">G06F9/22</further-classification>  
        <further-classification edition="200601120251119B">G06F9/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　以然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YIRAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中揭示啟用處理器裝置中的高效能可擴縮矩陣延伸(SME)指令發布。在一些態樣中，一種處理器裝置包含保留站電路，該保留站電路經組態以在第一階段期間對微操作執行降低精度的向量累加器(ZA)追蹤操作，對於該等微操作，對應向量(Z)暫存器及對應述詞(P)暫存器準備就緒。基於降低精度的ZA追蹤操作，保留站電路選擇相關於ZA暫存器不具有寫入後讀取(RAW)危障的第一微操作及第二微操作。在後續第二階段期間，保留站電路對第一微操作及第二微操作執行全精度ZA追蹤操作，且選擇一者作為用於發布的微操作，對於該者，全精度ZA追蹤操作指示相關於ZA暫存器不存在RAW危障。保留站電路接著發布經選擇微操作以供執行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Enabling high-performance Scalable Matrix Extension (SME) instruction issue in processor devices is disclosed herein. In some aspects, a processor device comprises a reservation station circuit configured to perform, during a first phase, a reduced-precision vector accumulator (ZA) tracking operation on micro-ops for which corresponding vector (Z) registers and corresponding predicate (P) registers are ready. Based on the reduced-precision ZA tracking operation, the reservation station circuit selects a first micro-op and a second micro-op having no Read-After-Write (RAW) hazard with respect to the ZA registers. During a subsequent second phase, the reservation station circuit performs a full-precision ZA tracking operation on the first micro-op and the second micro-op, and selects one as a micro-op for issue for which the full-precision ZA tracking operation indicates no RAW hazard exists with respect to the ZA registers. The reservation station circuit then issues the selected micro-op for execution.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基於處理器之裝置</p>  
        <p type="p">102:處理器裝置</p>  
        <p type="p">104:指令處理電路</p>  
        <p type="p">106:指令</p>  
        <p type="p">106D:經解碼指令</p>  
        <p type="p">106E:經執行指令</p>  
        <p type="p">106F:經提取指令</p>  
        <p type="p">108:指令記憶體</p>  
        <p type="p">110:提取電路</p>  
        <p type="p">112:指令快取記憶體</p>  
        <p type="p">114:執行電路</p>  
        <p type="p">116:解碼電路</p>  
        <p type="p">118:重新命名電路</p>  
        <p type="p">120:暫存器存取電路</p>  
        <p type="p">122:排程器電路</p>  
        <p type="p">124(0)~124(R):保留站電路</p>  
        <p type="p">126(0)~126(M):微操作</p>  
        <p type="p">128:寫入電路</p>  
        <p type="p">130:Z暫存器檔案</p>  
        <p type="p">132(0)~132(R):Z暫存器</p>  
        <p type="p">134:P暫存器檔案</p>  
        <p type="p">136(0)~136(P):P暫存器</p>  
        <p type="p">138:ZA檔案</p>  
        <p type="p">140(0)~140(Z):ZA暫存器</p>  
        <p type="p">142(0)~142(Z):計數器</p>  
        <p type="p">I&lt;sub&gt;0&lt;/sub&gt;~I&lt;sub&gt;N&lt;/sub&gt;:指令管線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1832" publication-number="202613348"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613348.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613348</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131359</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>於基板形成金屬矽化物層之方法、及裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">C23C16/42</main-classification>  
        <further-classification edition="200601120251218B">C23C16/455</further-classification>  
        <further-classification edition="200601120251218B">C23C16/52</further-classification>  
        <further-classification edition="200601120251218B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐野達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANO, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　亮凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONG, LIANG KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">對露出有矽層的基板供應金屬鹵化物的氣體以形成金屬矽化物層。 &lt;br/&gt;一種於基板形成金屬矽化物層之方法，係包含下述工序：將露出有矽層的該基板加熱至490℃以上且600℃以下的範圍內的溫度；預備供應作為原料氣體之包含構成該金屬矽化物的金屬與鹵素之金屬鹵化物的氣體；以及對該基板交替反覆供應該原料氣體及會與該金屬鹵化物反應而獲得該金屬的反應氣體，以於該矽層的表面形成該金屬的層；使矽從該矽層向該金屬的層擴散以形成該金屬矽化物層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1833" publication-number="202613413"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613413.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613413</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131405</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷卻機櫃與冷卻迴路</chinese-title>  
        <english-title>COOLING CABINET AND COOLING LOOP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251122B">F04D27/00</main-classification>  
        <further-classification edition="200601120251122B">H02K47/02</further-classification>  
        <further-classification edition="200601120251122B">H05K7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光寶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王隆福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LUNG-FU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱永昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, YUNG-CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳清德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CING-DE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾品喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, PIN-CHIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">冷卻機櫃包括機架組件、配電模組、熱交換模組以及複數泵浦模組。配電模組設置於機架組件內。熱交換模組設置於機架組件內。複數泵浦模組可拆卸地設置於機架組件內。各個泵浦模組具有入口和出口。入口用於接收流經熱交換模組的冷卻液。各個泵浦模組包含泵浦及溫度感測器。泵浦位於鄰近入口處，且用於驅動冷卻液至出口。溫度感測器設置於泵浦的下游並位於鄰近出口處，且用於感測冷卻液的溫度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cooling cabinet includes a rack assembly, a power distribution module, a heat exchange module, and a plurality of pump modules. The power distribution module and the heat exchange module are disposed within the rack assembly. The pump modules are detachably mounted in the rack assembly. Each pump module has an inlet and an outlet. The inlet is configured to receive coolant that has passed through the heat exchange module. Each pump module includes a pump and a temperature sensor. The pump is located adjacent to the inlet and configured to drive the coolant toward the outlet. The temperature sensor is arranged downstream of the pump and located near the outlet for detecting the temperature of the coolant.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:冷卻機櫃</p>  
        <p type="p">110:機架組件</p>  
        <p type="p">120:配電模組</p>  
        <p type="p">121:殼體</p>  
        <p type="p">129:直流輸出連接器</p>  
        <p type="p">131:比例閥</p>  
        <p type="p">132:熱交換器</p>  
        <p type="p">134:補液箱</p>  
        <p type="p">135:補液泵浦</p>  
        <p type="p">140:泵浦模組</p>  
        <p type="p">150:人機介面</p>  
        <p type="p">160:液質感測模組</p>  
        <p type="p">170:歧管模組</p>  
        <p type="p">HD1,HD2:把手</p>  
        <p type="p">SE:感測器延伸板</p>  
        <p type="p">SH:感測器集線器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1834" publication-number="202612622"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612622.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612622</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131442</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>安裝板</chinese-title>  
        <english-title>MOUNTING PLATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">A47G29/087</main-classification>  
        <further-classification edition="200601120251230B">A47K10/10</further-classification>  
        <further-classification edition="200601120251230B">A47B55/02</further-classification>  
        <further-classification edition="200601120251230B">A47B77/14</further-classification>  
        <further-classification edition="200601120251230B">A47B81/00</further-classification>  
        <further-classification edition="200601120251230B">A47B96/06</further-classification>  
        <further-classification edition="200601120251230B">F16B5/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商３Ｍ新設資產公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>3M INNOVATIVE PROPERTIES COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, PEI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯普森　克瑞格　唐諾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THOMPSON, CRAIG DONALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐森　朱德　迪蘭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLSON, JUDD DYLAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫爾格森　安德魯　托馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HELGESON, ANDREW THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供黏著劑安裝總成，該黏著劑安裝總成可藉由減少一耐用品對在移除期間由該黏著劑物品所產生的剝離力的貢獻來從表面移除而不造成損傷。在一些情況下，此可以藉由一安裝板來實現，該安裝板一或多個安裝本體，該一或多個安裝本體在剝離方向上係可撓的且在重量懸掛方向上具剛性。該安裝總成可進一步包括一蓋，以在使用期間穩定該總成，並遮掩該安裝板的態樣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides adhesive mounting assemblies that can be removed from surfaces without damage by having reduced contribution of a hardgood to the peel force generated by the adhesive article during removal. In some instances, this can be accomplished by a mounting plate that includes one or more mounting bodies that are flexible in a peel direction and rigid in a weight hanging direction. The mounting assemblies may further include a cover to stabilize the assembly during use and obscure aspects of the mounting plate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:安裝總成</p>  
        <p type="p">200:收納裝置</p>  
        <p type="p">201:收納裝置之後部區域</p>  
        <p type="p">240:主層板</p>  
        <p type="p">300:美觀蓋</p>  
        <p type="p">301:美觀蓋本體</p>  
        <p type="p">X:箭頭；方向</p>  
        <p type="p">Y:箭頭；方向</p>  
        <p type="p">Z:深度方向；方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1835" publication-number="202614577"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614577.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614577</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131459</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於使用機器學習來判定積體電路參數的方法與系統</chinese-title>  
        <english-title>METHOD AND SYSTEM FOR DETERMINING INTEGRATED CIRCUIT PARAMETERS USING MACHINE LEARNING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">H04B1/00</main-classification>  
        <further-classification edition="202001120251224B">G06F30/398</further-classification>  
        <further-classification edition="201901120251224B">G06N20/00</further-classification>  
        <further-classification edition="200601120251224B">H03H7/38</further-classification>  
        <further-classification edition="200601120251224B">H03H11/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威廉馬許萊斯大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLIAM MARSH RICE UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池　泰雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI,TAIYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡　耀龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU,YAOLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭　浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO,HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種方法包括：藉由一電腦處理器，使用一最佳化引擎、一第一機器學習模型及一組目標電路效能度量而為一積體電路之一主動裝置判定一組最佳主動裝置參數；藉由該電腦處理器，使用該最佳化引擎、一第二機器學習模型及該組目標電路效能度量而為該積體電路之一被動網路判定一組最佳被動網路參數；以及藉由該電腦處理器，基於該組最佳主動裝置參數及該組最佳被動網路參數而為該積體電路產生一電路設計。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method includes determining, by a computer processor, a set of optimal active device parameters for an active device of an integrated circuit using an optimization engine, a first machine-learning model, and a set of target circuit performance metrics; determining, by the computer processor, a set of optimal passive network parameters for a passive network of the integrated circuit using the optimization engine, a second machine-learning model, and the set of target circuit performance metrics; and generating, by the computer processor, a circuit design for the integrated circuit based on the set of optimal active device parameters and the set of optimal passive network parameters.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202:程序塊</p>  
        <p type="p">204:程序塊</p>  
        <p type="p">206:程序塊</p>  
        <p type="p">208:程序塊</p>  
        <p type="p">210:程序塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1836" publication-number="202614116"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614116.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614116</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131483</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>離子植入機、控制系統、以及用於對離子植入機的聚束器進行調諧的技術</chinese-title>  
        <english-title>ION IMPLANTER, CONTROL SYSTEM, AND TECHNIQUES FOR TUNING BUNCHER OF ION IMPLANTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H01J37/04</main-classification>  
        <further-classification edition="200601120251103B">H01J37/30</further-classification>  
        <further-classification edition="200601120251103B">H01J37/304</further-classification>  
        <further-classification edition="200601120251103B">H01J37/317</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施耐德　馬克西米利安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHNEIDER, MAXIMILIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕克　威廉　赫倫　Ｊｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, WILLIAM HERRON JR.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚　偉明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAM, WAI-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫魯尼西　彼得　Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURUNCZI, PETER F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛克萊　法蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINCLAIR, FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朗　克里斯多福　伊利奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANG, CHRISTOPHER ILIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種離子植入機。所述離子植入機可包括用於產生離子束的離子源及位於離子源下游的線性加速器。線性加速器可包括用於接收離子束且輸出聚束離子束的聚束器系統、以及用於使聚束離子束加速的多個加速級。聚束器系統可包括：至少一個RF聚束器；控制器，用於在多個時刻中調整所述至少一個RF聚束器的至少一個控制參數；以及束監測器，設置於所述至少一個RF聚束器的下游，且被佈置成在所述多個時刻中實行對聚束離子束的多個束量測。如此一來，控制器可更被佈置成基於所述多個束量測來確定聚束器的焦距。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An ion implanter. The ion implanter may include an ion source to generate an ion beam, and a linear accelerator, downstream to the ion source. The linear accelerator may include a buncher system to receive the ion beam and output a bunched ion beam, and a plurality of acceleration stages, to accelerate the bunched ion beam. The buncher system may include at least one RF buncher, a controller to adjust at least one control parameter of the at least one RF buncher over a plurality of instances; and a beam monitor, disposed downstream of the at least one RF buncher, and arranged to perform a plurality of beam measurements of the bunched ion beam over the plurality of instances. As such, the controller may be further arranged to determine a focal length of the buncher based upon the plurality of beam measurements.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:控制器</p>  
        <p type="p">100:離子植入機</p>  
        <p type="p">102:離子源</p>  
        <p type="p">104:分析器</p>  
        <p type="p">106、106A:離子束</p>  
        <p type="p">106B:聚束離子束</p>  
        <p type="p">106C:高能離子束</p>  
        <p type="p">108:掃描儀</p>  
        <p type="p">110:校正器</p>  
        <p type="p">112:終端站</p>  
        <p type="p">118:線性加速器(LINAC)</p>  
        <p type="p">124:聚束器系統</p>  
        <p type="p">124A、124B:RF聚束器</p>  
        <p type="p">130:束監測器</p>  
        <p type="p">A1、A2、A3、A4、A5~AN:加速級</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1837" publication-number="202613434"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613434.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613434</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131503</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有測量格柵之應力波傳動裝置及應力波傳動裝置上之轉矩測量系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">F16H49/00</main-classification>  
        <further-classification edition="200601120251231B">G01L3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商哈默納科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARMONIC DRIVE SE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱瑟　安德烈亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAYSER, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種應力波傳動裝置(2)，包括柔輪(6)、剛輪(10)及波發生器(14)，該波發生器具有插塞(18)及圍繞該插塞(18)之滾動軸承(22)，其中該柔輪(6)上佈置有多個用於應變測量之測量格柵(28)，其中該波發生器(14)如此地構建，從而在柔輪(6)與剛輪(10)之齒系之間構建有三個嚙合區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:波發生器</p>  
        <p type="p">18:插塞</p>  
        <p type="p">22:滾動軸承</p>  
        <p type="p">26:凸輪</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1838" publication-number="202612709"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612709.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612709</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131505</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>活化粒線體的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">A61K33/00</main-classification>  
        <further-classification edition="200601120251001B">A61K33/06</further-classification>  
        <further-classification edition="200601120251001B">A61N1/44</further-classification>  
        <further-classification edition="200601120251001B">A61N5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張崇泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUNG-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張婷詒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TING-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張崇泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUNG-TAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHIA-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張婷詒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, TING-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉建忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種活化粒線體的方法，主要係透過負電荷及活性氧供應單元由外面提供負電荷及活性氧予粒線體，以作為粒線體氧化還原的原料；以及透過鈣離子通道促進單元促進體內的鈣離子通過粒線體內膜上的鈣輸送蛋白進入粒線體的基質空間內，使鈣離子的內流可以促進粒線體去極化，提高粒線體的氧化磷酸化活性。藉此增強粒線體活化和ATP的生成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:負電荷及活性氧供應單元</p>  
        <p type="p">2:鈣離子通道促進單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1839" publication-number="202613702"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613702.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613702</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131507</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>空白光罩、空白光罩之加工方法及空白光罩之製造方法</chinese-title>  
        <english-title>PHOTOMASK BLANK, METHOD FOR PROCESSING PHOTOMASK BLANK, AND METHOD FOR MANUFACTURING PHOTOMASK BLANK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251217B">G03F1/22</main-classification>  
        <further-classification edition="200601120251217B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小竹正晃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOTAKE, MASAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松澤雄太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUZAWA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉聡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木裕崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, HIROTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係提供，一種空白光罩，含有在將吸收體層藉由乾蝕刻進行加工時，可發揮作為硬遮罩之功能、且對於阻劑圖案之解析性改善亦有所貢獻之含矽硬遮罩膜。 &lt;br/&gt;本發明之解決手段係一種空白光罩 &lt;br/&gt;具備： &lt;br/&gt;基板、 &lt;br/&gt;形成於該基板上之反射EUV光的多層反射膜層、 &lt;br/&gt;形成於該多層反射膜層上之吸收該EUV光之吸收體層、 &lt;br/&gt;直接或間接地形成於該吸收體層上之含矽硬遮罩膜、及 &lt;br/&gt;形成於該含矽硬遮罩膜上之光阻劑膜； &lt;br/&gt;該含矽硬遮罩膜係於50℃以上180℃以下之溫度進行硬化之含矽硬遮罩膜形成用組成物的硬化物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a photomask blank. The photomask blank includes: a substrate; a multilayer reflective film layer that is formed on the substrate and reflects an EUV light; an absorber layer that is formed on the multilayer reflective film layer and absorbs the EUV light; a silicon-containing hard mask film that is formed directly or indirectly on the absorber layer; and a photoresist film formed on the silicon-containing hard mask film; wherein the silicon-containing hard mask film is a cured material of a composition for forming a silicon-containing hard mask film, and the composition is to cure at a temperature of 50ºC or more and 180ºC or less. The present invention can provide a photomask blank containing a silicon-containing hard mask film that can function as a hard mask when an absorber layer is being processed by dry etching, and can also contribute to improving the resolution of a resist pattern.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板</p>  
        <p type="p">2:多層反射膜層</p>  
        <p type="p">3:保護膜</p>  
        <p type="p">4:吸收體層</p>  
        <p type="p">5:硬遮罩膜之第1層</p>  
        <p type="p">6:含矽硬遮罩膜(硬遮罩之第2層)</p>  
        <p type="p">7:光阻劑膜</p>  
        <p type="p">101:空白光罩</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1840" publication-number="202614429"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614429.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614429</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131518</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於ＣｕＢＯＬ裝配封裝的黏著ＳＡＰ基材</chinese-title>  
        <english-title>ADHERED SAP SUBSTRATE FOR CUBOL ASSEMBLY PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251228B">H01L23/522</main-classification>  
        <further-classification edition="200601120251228B">H05K3/10</further-classification>  
        <further-classification edition="200601120251228B">H01L23/498</further-classification>  
        <further-classification edition="200601120251228B">H01L21/56</further-classification>  
        <further-classification edition="200601120251228B">H05K1/09</further-classification>  
        <further-classification edition="200601120251228B">H01L23/58</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文炫一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, HYUN-IL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜歸源</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, KUIWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>比奧　瓊雷伊維拉爾巴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BUOT, JOAN REY VILLARBA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏　弘博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WE, HONG BOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示了半導體封裝。一種半導體封裝可包括介電層及位於該介電層上的焊料光阻(SR)。該焊料光阻可界定第一SR區域、第二SR區域、及介於該第一SR區域與該第二SR區域之間的溝槽開放區域。該介電層的上表面可被該第一SR區域及該第二SR區域中的該SR覆蓋，且在該溝槽開放區域中不被覆蓋。一或多個跡線可在該溝槽開放區域內該介電層的該上表面上形成。至少一個跡線可包含錨。該錨可強化該跡線至該電介質的黏著，使得跡線掀離得到緩解或完全防止。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are semiconductor packages. A semiconductor package may include a dielectric layer and a solder resist (SR) on the dielectric layer. The solder resist may define a first SR area, a second SR area, and a trench open area between the first SR area and the second SR area. An upper surface of the dielectric layer may be covered with the SR in the first SR area and the second SR area, and not covered in the trench open area. One or more traces may be formed on the upper surface of the dielectric layer within the trench open area. At least one trace may comprise an anchor. The anchor may strengthen adherence of the trace to the dielectric such that trace lift is mitigated or prevented altogether.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">230:跡線</p>  
        <p type="p">235:錨</p>  
        <p type="p">240:介電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1841" publication-number="202614209"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614209.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614209</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131522</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置及電漿處理方法</chinese-title>  
        <english-title>PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">H01L21/3065</main-classification>  
        <further-classification edition="200601120251222B">H05H1/46</further-classification>  
        <further-classification edition="200601120251222B">C23C16/509</further-classification>  
        <further-classification edition="200601120251222B">H01L21/205</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>永海幸一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAMI, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示之電漿處理裝置具備腔室、基板支持器及電源系統。基板支持器具有電極，且構成為於腔室內支持基板。電源系統電性連接於電極。電源系統構成為：作為偏壓電壓，於第1期間內將第1脈衝輸出至電極，於第1期間後之第2期間內將第2脈衝輸出至電極。第1脈衝及第2脈衝分別為電壓之脈衝。第1脈衝之電壓位準與第2脈衝之電壓位準不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosed plasma processing apparatus is provided with a chamber, a substrate support, and a power source system. The substrate support has an electrode and configured to support a substrate in the chamber. The power source system is electrically connected to the electrode and configured to apply a bias voltage to the electrode to draw ions from a plasma in the chamber into the substrate on the substrate support. The power source system is configured to output a first pulse to the electrode in a first period and output a second pulse to the electrode in a second period after the first period, as the bias voltage. Each of the first pulse and the second pulse is a pulse of a voltage. A voltage level of the first pulse is different from a voltage level of the second pulse.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電漿處理裝置</p>  
        <p type="p">10:腔室</p>  
        <p type="p">10s:內部空間</p>  
        <p type="p">12:腔室本體</p>  
        <p type="p">12g:閘閥</p>  
        <p type="p">12p:通路</p>  
        <p type="p">15:支持體</p>  
        <p type="p">16:基板支持器</p>  
        <p type="p">18:下部電極</p>  
        <p type="p">18f:流路</p>  
        <p type="p">19:電極板</p>  
        <p type="p">20:靜電吸盤</p>  
        <p type="p">23a:配管</p>  
        <p type="p">23b:配管</p>  
        <p type="p">25:氣體供給管線</p>  
        <p type="p">28:筒狀部</p>  
        <p type="p">29:絕緣部</p>  
        <p type="p">30:上部電極</p>  
        <p type="p">32:構件</p>  
        <p type="p">34:頂板</p>  
        <p type="p">34a:氣體噴出孔</p>  
        <p type="p">36:支持體</p>  
        <p type="p">36a:氣體擴散室</p>  
        <p type="p">36b:氣體孔</p>  
        <p type="p">36c:氣體導入埠</p>  
        <p type="p">38:氣體供給管</p>  
        <p type="p">40:氣體源組</p>  
        <p type="p">41:閥組</p>  
        <p type="p">42:流量控制器組</p>  
        <p type="p">43:閥組</p>  
        <p type="p">48:擋板構件</p>  
        <p type="p">50:排氣裝置</p>  
        <p type="p">52:排氣管</p>  
        <p type="p">61:高頻電源</p>  
        <p type="p">61m:匹配器</p>  
        <p type="p">62:高頻電源</p>  
        <p type="p">62m:匹配器</p>  
        <p type="p">70:電源系統</p>  
        <p type="p">70f:濾波器</p>  
        <p type="p">AX:軸線</p>  
        <p type="p">ER:邊緣環</p>  
        <p type="p">MC:控制部</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1842" publication-number="202614509"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614509.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614509</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131536</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電連接器</chinese-title>  
        <english-title>ELECTRICAL CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251128B">H01R13/646</main-classification>  
        <further-classification edition="200601120251128B">H01R13/02</further-classification>  
        <further-classification edition="200601120251128B">H01R13/24</further-classification>  
        <further-classification edition="201101120251128B">H01R12/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖芳竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, FANG-JWU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電連接器，包括絕緣本體及複數端子，端子設置於絕緣本體的端子槽內，端子包括固定於端子槽的固定部、自固定部向上依序延伸的上彈性部、上接觸部及上抵接部，以及自固定部向下依序延伸的下彈性部、下接觸部及下抵接部；當上、下接觸部向絕緣本體方向移動時，上、下抵接部彼此抵靠於一起。端子的上、下接觸部數量各設置為一，則上、下抵接部數量各設置為二；或者，端子的上、下接觸部數量各設置為二，則上、下抵接部數量各設置為一。本發明通對端子接觸部和抵接部的特別設置來改善端子的阻抗，使得電連接器具有更好的高頻性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical connector includes an insulating housing and plural terminals, the insulating housing has plural terminal grooves and the terminals are retained in the terminals grooves one by one respectively. Each terminal includes a main portion fixed in the corresponding terminal groove, an upper elastic portion, an upper contacting portion and an upper abutting portion extending upward from the main portion in order, and the terminal further comprises a lower elastic portion, a lower contacting portion and a lower abutting portion extending downward from the main portion in order. The upper abutting portions and the lower abutting portions contact with each other when the upper contacting portions and the lower contacting portions are pressed. Both the number of the upper contacting portion and the lower contacting portion of each terminals is one while both the number of the upper abutting portion and the lower abutting portion of each terminal is two, or both the number of the upper contacting portion and the lower contacting portion of each terminal is two while both the number of the of the upper abutting portion and the lower abutting portion of each terminal is one. The terminals have an improved impedance by a special arrangement of the contacting portions and the abutting portions, and thus, the electrical connector has better high-frequency performance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:端子</p>  
        <p type="p">21:固定部</p>  
        <p type="p">212:上條部</p>  
        <p type="p">213:下條部</p>  
        <p type="p">22:上彈性部</p>  
        <p type="p">23:上接觸部</p>  
        <p type="p">24:下彈性部</p>  
        <p type="p">25:上抵接部</p>  
        <p type="p">26:下接觸部</p>  
        <p type="p">27:下抵接部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1843" publication-number="202614829"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614829.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614829</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131540</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251008B">H10D62/10</main-classification>  
        <further-classification edition="200601120251008B">H01L23/48</further-classification>  
        <further-classification edition="200601120251008B">H01L23/50</further-classification>  
        <further-classification edition="200601120251008B">H01L23/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商沖電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKI ELECTRIC INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日清紡微電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSHINBO MICRO DEVICES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川琢磨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, TAKUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小酒達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOSAKA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑原恒平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUWAHARA, KOUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑原秀治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUWABARA, HIDEHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古田裕典</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUTA, HIRONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷川兼一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIGAWA, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北島由隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAJIMA, YUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小川正訓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGAWA, MASANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>緒方敏洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGATA, TOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松延明彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUNOBU, AKIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">以提供可以抑制動作不良的半導體裝置為目的。其解決手段中，半導體裝置10具有：第一功能層（第一半導體層）12a、積層於前其上方的第二功能層（第二半導體層）12b及設在功能層12a、12b之間的接合層110。第一功能層12a在對向於接合層110的第一面，具有P型（第一導電型）的第一區域（103a,83a,84a,85a,86a）與N型（第二導電型）的第二區域（81a,82a）。第二功能層12b在對向於接合層110的第二面，具有P型的第三區域（103b）與N型的第四區域（81b,82b）。在功能層12a,12b之間，在第一區域中對向於第四區域的部分、或第二區域中對向於第三區域的部分中的至少一個，設有屏蔽層90（遮蔽層）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12a:第一功能膜</p>  
        <p type="p">12b:第二功能膜</p>  
        <p type="p">13a,13b:電路區域</p>  
        <p type="p">14a,14b:襯墊區域</p>  
        <p type="p">15a:虛設區域</p>  
        <p type="p">81a,81b,82a,82b:擴散區域</p>  
        <p type="p">83a,83b,84a,84b,85a,85b,86a,86b:擴散區域</p>  
        <p type="p">90,91,92,93,94,95:屏蔽層</p>  
        <p type="p">100:積層物</p>  
        <p type="p">103a:第一功能層(第一半導體層)</p>  
        <p type="p">103b:第二功能層(第二半導體層)</p>  
        <p type="p">104a,104b:電極襯墊</p>  
        <p type="p">105a,105b:保護層</p>  
        <p type="p">106b:阻劑層</p>  
        <p type="p">107a:虛設層</p>  
        <p type="p">110:接合層</p>  
        <p type="p">120:轉印基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1844" publication-number="202613663"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613663.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613663</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131545</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在AR玻璃模組中的波導與光引擎的協同優化</chinese-title>  
        <english-title>WAVEGUIDES CO-OPTIMIZATIONS WITH LIGHT ENGINES IN AR GLASS MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">G02B27/01</main-classification>  
        <further-classification edition="200601120251224B">G02B6/24</further-classification>  
        <further-classification edition="200601120251224B">G02B6/42</further-classification>  
        <further-classification edition="202401120251224B">G06T5/00</further-classification>  
        <further-classification edition="200601120251224B">G09G3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐翼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孟德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MENG, DEMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫陽陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YANGYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅晉欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, JINXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例一般涉及擴增實境系統。更具體地說，本文所述的實施例提供擴增實境系統、校正投影到波導中影像的方法及相關元件。在一或多個實施例中，擴增實境系統包括配置為發射影像的光引擎和含有基板的波導。該波導進一步包括位於該基板上方的輸入耦合器，該輸入耦合器配置為自該光引擎接收影像。輸出耦合器位於該基板上方，並配置為發射出耦影像。控制器配置為根據該出耦影像的一或多個特徵生成校正資料，並根據該校正資料調整該擴增實境系統的一或多個元件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure generally relate to augmented reality systems. More specifically, embodiments described herein provide for augmented reality systems, methods of correcting an image projected into a waveguide, and related components. In one or more embodiments, an augmented reality system includes a light engine configured to emit an image and a waveguide including a substrate. The waveguide further includes an input coupler disposed over the substrate and configured to receive the image from the light engine. An output coupler is disposed over the substrate and configured to emit an outcoupled image. A controller is configured to generate corrective data based on one or more characteristics of the outcoupled image and adjust one or more components of the augmented reality system based on the corrective data.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:擴增實境系統</p>  
        <p type="p">101:基板</p>  
        <p type="p">104a:輸入耦合器</p>  
        <p type="p">104b:瞳孔擴展器</p>  
        <p type="p">104c:輸出耦合器</p>  
        <p type="p">110:光引擎</p>  
        <p type="p">112:輸入光束</p>  
        <p type="p">114:光束</p>  
        <p type="p">116:出耦光束</p>  
        <p type="p">120:眼盒</p>  
        <p type="p">150:波導</p>  
        <p type="p">170:控制器</p>  
        <p type="p">172:中央處理單元(CPU)</p>  
        <p type="p">174:記憶體</p>  
        <p type="p">176:支援電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1845" publication-number="202614908"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614908.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614908</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131562</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>不同高度的聲波感測器系統</chinese-title>  
        <english-title>ACOUSTIC SENSOR SYSTEMS WITH DIFFERENT HEIGHTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251217B">H10N30/30</main-classification>  
        <further-classification edition="202301120251217B">H10N30/85</further-classification>  
        <further-classification edition="202301120251217B">H10N30/87</further-classification>  
        <further-classification edition="200601120251217B">G06F3/043</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯特洛夫曼　潔西卡劉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STROHMANN, JESSICA LIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王宏仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUNG-JEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　載亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, JAE HYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁偉翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, WEI-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林湘琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, SHIANG-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文揭示具有不同高度的聲學感測器系統、以及用於組態及操作此類感測器系統的方法。在一些實施例中，本文所描述之一種感測器系統可包括：一聲學接收器元件；及一聲學傳輸器元件；其中該聲學接收器元件的該壓電材料的該第一部分包含一第一厚度，且該聲學傳輸器元件的該壓電材料的該第二部分包含不同於該第一厚度的一第二厚度；且其中該隔離層經結構化以產生一間隙，該間隙將該第二電極層的該第一部分與該第二電極層的該第二部分實體地分開。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Acoustic sensor systems with different heights, as well as methods for configuring and operating such sensor systems are disclosed. In some embodiments, a sensor system described herein may include an acoustic receiver element; and an acoustic transmitter element; wherein the first portion of the piezoelectric material of the acoustic receiver element comprises a first thickness, and the second portion of the piezoelectric material of the acoustic transmitter element comprises a second thickness different from the first thickness; and wherein the isolation layer is structured to create a gap that physically separates the first portion of the second electrode layer from the second portion of the second electrode layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:實例陣列</p>  
        <p type="p">502:接收器元件</p>  
        <p type="p">504:傳輸器元件；接收元件</p>  
        <p type="p">512:基底層</p>  
        <p type="p">514:第一電極層</p>  
        <p type="p">516:平坦化層</p>  
        <p type="p">518:第二電極層</p>  
        <p type="p">520:隔離層</p>  
        <p type="p">522:電分隔</p>  
        <p type="p">523:實體凹口</p>  
        <p type="p">524:壓電材料</p>  
        <p type="p">526:第三電極層</p>  
        <p type="p">&lt;i&gt;a&lt;/i&gt;:厚度</p>  
        <p type="p">&lt;i&gt;b&lt;/i&gt;:厚度；高度；高度值</p>  
        <p type="p">&lt;i&gt;a&lt;/i&gt;+&lt;i&gt;x&lt;/i&gt;:厚度；距離</p>  
        <p type="p">A-B:線</p>  
        <p type="p">&lt;i&gt;x&lt;/i&gt;:距離；高度差異差值；差值</p>  
        <p type="p">&lt;i&gt;x'&lt;/i&gt;:距離</p>  
        <p type="p">&lt;i&gt;x&lt;/i&gt;+&lt;i&gt;b&lt;/i&gt;:厚度；高度；高度值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1846" publication-number="202612876"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612876.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612876</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131581</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機器人系統及機器人系統的控制方法</chinese-title>  
        <english-title>ROBOT SYSTEM AND ROBOT SYSTEM CONTROL METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">B25J19/02</main-classification>  
        <further-classification edition="200601120251224B">B25J13/08</further-classification>  
        <further-classification edition="200601120251224B">B25J9/04</further-classification>  
        <further-classification edition="200601120251224B">B25J9/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸林央樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUBAYASHI, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原洋揮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坪井信高</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUBOI, NOBUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之機器人系統係具備：機器人，係包含複數個關節；扭矩檢測部，係配置於複數個關節之中之預定之關節，且檢測繞著預定之關節之旋轉軸線之檢測扭矩值；及控制部，係進行下述控制：將檢測扭矩值與基準扭矩值之差分值除以從預定之關節之旋轉軸線至設定於機器人之表面上之監視點的半徑而得出第一值，並取得將前述第一值根據具有半徑之圓於監視點之切線方向與相對於設定有監視點之機器人之表面之法線方向所構成之角度而轉換為法線方向之值而得出的第二值，來作為作用於機器人之外力值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A robot system according to the present invention includes a robot with a plurality of joints; a torque detection unit that is disposed at a predetermined joint among the plurality of joints and detects a detected torque value around a rotation axis of the predetermined joint; and a control unit that performs control to acquire, as an external force value acting on the robot, a second value obtained by converting a first value obtained by dividing a difference between the detected torque value and a reference torque value by a radius from the rotation axis of the predetermined joint to a monitoring point set on a surface of the robot, into a normal direction value based on an angle formed between a tangent direction at the monitoring point of a circle having a radius and a normal direction to the surface of the robot where the monitoring point is set.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12,12b:連桿</p>  
        <p type="p">12ba:表面</p>  
        <p type="p">13,13b:關節</p>  
        <p type="p">40:監視點</p>  
        <p type="p">A2:旋轉軸線</p>  
        <p type="p">D1:動作方向</p>  
        <p type="p">Pa&lt;sub&gt;i&lt;/sub&gt;,P&lt;sub&gt;i&lt;/sub&gt;:值</p>  
        <p type="p">R:半徑</p>  
        <p type="p">θ:角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1847" publication-number="202613897"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613897.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613897</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131589</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於判定異常數據點原因的最小監督學習</chinese-title>  
        <english-title>MINIMALLY SUPERVISED LEARNING FOR DETERMINING CAUSES OF OUTLYING DATA POINTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251224B">G06N20/20</main-classification>  
        <further-classification edition="201901120251224B">G06N20/00</further-classification>  
        <further-classification edition="200601120251224B">H01L21/67</further-classification>  
        <further-classification edition="200601120251224B">G05B23/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商三角設計公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA DESIGN, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕克　查爾斯　林肯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARKER, CHARLES LINCOLN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊秀鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一系統可在製程之一程序步驟中識別複數個輸出中之異常輸出。一系統可接收與包含該異常輸出之該複數個輸出之各者相關聯之製造屬性。一系統可使用一機器學習模型來構建至少一個隔離樹模型，其包括各對應於該等製造屬性之一者之一分割條件之複數個父節點及對應於該異常輸出之一葉節點，其中該至少一個隔離樹模型之該等父節點之各者與直接導致該異常輸出之一製造屬性相關聯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system may identify anomalous output among a plurality of outputs at a process step in the manufacturing process. A system may receive manufacturing attributes associated with each of the plurality of outputs including the anomalous output. A system may build, using a machine learning model, at least one isolation tree model comprising a plurality of parent nodes each corresponding to a split condition of one of the manufacturing attributes and a leaf node corresponding to the anomalous output, wherein each of the parent nodes of the at least one isolation tree model is associated with a manufacturing attribute directly leading to the anomalous output.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">304:稀疏隔離樹</p>  
        <p type="p">X:節點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1848" publication-number="202613183"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613183.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613183</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131593</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>特異性結合Claudin18.2的嵌合抗原受體免疫細胞及其應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07K16/30</main-classification>  
        <further-classification edition="200601120251201B">C07K14/705</further-classification>  
        <further-classification edition="200601120251201B">C12N5/10</further-classification>  
        <further-classification edition="200601120251201B">C12N15/62</further-classification>  
        <further-classification edition="200601120251201B">C12N15/13</further-classification>  
        <further-classification edition="202501120251201B">A61K40/11</further-classification>  
        <further-classification edition="202501120251201B">A61K40/31</further-classification>  
        <further-classification edition="202501120251201B">A61K40/42</further-classification>  
        <further-classification edition="200601120251201B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商亘喜生物科技(上海)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRACELL BIOTECHNOLOGIES (SHANGHAI) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈連軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, LIANJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>殷文劼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, WENJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAO, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及特異性結合Claudin18.2的嵌合抗原受體免疫細胞及其應用。具體地，本發明提供了一種以靶向Claudin18.2奈米抗體作為抗原結合域的CAR-T細胞，能高特異性地靶向Claudin18.2陽性腫瘤細胞；所述CAR-T細胞共表達TGF-β受體的胞外域和任選的IL-7受體的胞內信號域，可有效阻斷或者減少TGF-β誘導的抑制信號，促進免疫細胞的擴增，存活和持久性，從而增強其對腫瘤細胞的特異性殺傷。本發明的嵌合抗原受體免疫細胞可用於治療Claudin18.2陽性腫瘤。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1849" publication-number="202613584"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613584.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613584</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131646</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於估計電池的荷電狀態的設備和方法、電腦程式產品和電腦可讀存儲介質</chinese-title>  
        <english-title>DEVICE, METHOD, COMPUTER PROGRAM PRODUCT AND COMPUTER-READABLE STORAGE MEDIUM FOR ESTIMATING STATE OF CHARGE OF BATTERY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120250901B">G01R31/36</main-classification>  
        <further-classification edition="201901120250901B">G01R31/382</further-classification>  
        <further-classification edition="201901120250901B">G01R31/396</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商凹凸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>O2MICRO, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷鳴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>車靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHE, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝振中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於估計電池的荷電狀態的設備及方法、電腦程式產品和電腦可讀存儲介質。該設備包括：採集電路，採集電池的狀態參數；處理電路，配置為根據狀態參數，使用AI模型得到電池的第一電池荷電狀態並使用預先存儲的查閱資料表得到電池的第二電池荷電狀態，其中，查閱資料表相關聯地存儲狀態參數的至少一部分與電池的荷電狀態；對第一和第二電池荷電狀態進行基於各自權重值的加權平均來得到電池的第三荷電狀態並將其作為所估計的電池的荷電狀態。可選的，所述處理電路還被配置為：根據第三荷電狀態和所述採集電路採集的狀態參數，基於卡爾曼濾波獲得第四荷電狀態並將其作為所估計的電池的荷電狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a device and a method for estimating a state of charge of a battery, a computer program product and a computer-readable storage medium are provided. The device includes: an acquisition circuit, configured to acquire state parameters of the battery; and a processing circuit, configured to: obtain a first state of charge of the battery by using an AI model based on the state parameters; obtain a second state of charge of the battery by using a pre-stored lookup table, where the lookup table stores at least a portion of the state parameters and a state of charge of the battery in association with each other; and obtain a third state of charge of the battery by calculating a weighted average of the first state of charge of the battery and the second state of charge of the battery based on weights of the first state of charge of the battery and the second state of charge of the battery, and determine the third state of charge as an estimated state of charge of the battery. Optionally, the processing circuit is further configured to: obtain a fourth state of charge based on Kalman filtering in accordance with the state parameters acquired by the acquisition circuit and the third state of charge, and determine the fourth state of charge as the estimated state of charge of the battery.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:根據第一實施例的用於估計電池的荷電狀態的設備的功能模組方塊圖</p>  
        <p type="p">11:採集模組</p>  
        <p type="p">12:AI模組</p>  
        <p type="p">13:查表模組</p>  
        <p type="p">14:第一濾波模組</p>  
        <p type="p">15:輸出模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1850" publication-number="202613196"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613196.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613196</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131654</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>阻劑組成物及圖案形成方法</chinese-title>  
        <english-title>RESIST COMPOSITION AND PATTERNING PROCESS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">C08F212/14</main-classification>  
        <further-classification edition="200601120251230B">C07C69/63</further-classification>  
        <further-classification edition="200601120251230B">C07C69/76</further-classification>  
        <further-classification edition="200601120251230B">C07D317/38</further-classification>  
        <further-classification edition="200601120251230B">C07D347/00</further-classification>  
        <further-classification edition="200601120251230B">C08F220/28</further-classification>  
        <further-classification edition="200601120251230B">G03F7/004</further-classification>  
        <further-classification edition="200601120251230B">G03F7/038</further-classification>  
        <further-classification edition="200601120251230B">G03F7/039</further-classification>  
        <further-classification edition="200601120251230B">G03F7/20</further-classification>  
        <further-classification edition="200601120251230B">G03F7/32</further-classification>  
        <further-classification edition="200601120251230B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商信越化學工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菊地駿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIKUCHI, SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>草間理志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSAMA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大山皓介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHYAMA, KOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大橋正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHASHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，感度及極限解析度優良的非化學增幅阻劑組成物、以及使用該阻劑組成物之圖案形成方法。&lt;br/&gt; 該課題之解決手段為一種阻劑組成物，含有下式(1)~(4)中任一者表示之至少1種超原子價碘化合物、羧酸衍生物化合物及溶劑，前述羧酸衍生物化合物為下式(5)表示之羧酸衍生物化合物或含有下式(6)表示之羧酸衍生物重複單元之聚合物。&lt;br/&gt;&lt;img align="absmiddle" height="547px" width="687px" file="ed10174.JPG" alt="ed10174.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resist composition comprising a hypervalent iodine compound, a carboxylic acid derivative, and a solvent is provided. When processed by photolithography using high‑energy radiation, the resist composition exhibits a high sensitivity and improved maximum resolution.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1851" publication-number="202612969"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612969.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612969</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131673</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人力驅動車用之控制裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120250911B">B62M6/45</main-classification>  
        <further-classification edition="201001120250911B">B62M6/50</further-classification>  
        <further-classification edition="200601120250911B">B62M25/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>增田慎子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUTA, NORIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村岡勉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAOKA, TSUTOMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森井浩二郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORII, KOUJIROU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可適切地控制人力驅動車用之組件的人力驅動車用之控制裝置。 &lt;br/&gt;本發明之人力驅動車用之控制裝置具備控制部，該控制部構成為控制人力驅動車用之第1組件、及與上述第1組件不同之人力驅動車用之第2組件，上述控制部構成為將上述第1組件及上述第2組件之其中一者，較上述第1組件及上述第2組件之另一者更優先地進行控制，且構成為根據與上述人力驅動車之騎乘者之運動強度相關之參數，變更上述第1組件及上述第2組件之控制之優先順序。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">40:控制系統</p>  
        <p type="p">42:檢測部</p>  
        <p type="p">42A:曲柄旋轉狀態檢測部</p>  
        <p type="p">42B:車輪旋轉狀態檢測部</p>  
        <p type="p">42C:人力驅動力檢測部</p>  
        <p type="p">44:騎乘者狀態獲取部</p>  
        <p type="p">50:人力驅動車用之組件</p>  
        <p type="p">52:第1組件</p>  
        <p type="p">54:第2組件</p>  
        <p type="p">56:馬達</p>  
        <p type="p">58:變速機</p>  
        <p type="p">60:控制裝置</p>  
        <p type="p">62:控制部</p>  
        <p type="p">64:記憶部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1852" publication-number="202614297"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614297.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614297</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131677</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資料處理裝置、基板處理系統、資料處理方法及電腦可讀取程式</chinese-title>  
        <english-title>DATA PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, DATA PROCESSING METHOD, AND COMPUTER-READABLE PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251228B">H01L21/67</main-classification>  
        <further-classification edition="200601120251228B">G06F1/14</further-classification>  
        <further-classification edition="200601120251228B">G05B19/418</further-classification>  
        <further-classification edition="200601120251228B">G07C3/08</further-classification>  
        <further-classification edition="200601120251228B">G06F17/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>生和高明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEIWA, TAKAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>島田真稔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMADA, MASATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平尾司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAO, TSUKASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之資料處理裝置(72)之資料接收部(722)受理感測器時間序列資料及控制時間序列資料。感測器時間序列資料係於基板處理裝置(1)中測定裝置狀態之感測器之輸出值之時間序列資料。控制時間序列資料係基板處理裝置(1)之控制狀態之時間序列資料。時刻同步部(724)對感測器時間序列資料及控制時間序列資料進行時間戳記處理。週期同步部(725)對感測器時間序列資料及控制時間序列資料中週期較短之時間序列資料即短週期時間序列資料，以週期較長之時間序列資料即長週期時間序列資料之週期重新取樣。藉此，可使基板處理裝置(1)之控制狀態與裝置狀態之相關關係之取得容易化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The data receiving part (722) of the data processing apparatus (72) receives sensor time-series data and control time-series data. Sensor time-series data is time-series data of output values of a sensor that measures the apparatus status in the substrate processing apparatus (1). The control time-series data is time-series data of the control state of the substrate processing apparatus (1). The time synchronization part (724) performs time stamp processing on the sensor time-series data and control time-series data. The Period Synchronization Part (725) resamples the short-period time-series data at the period of the long-period time-series data. The short-period time-series data is the time-series data with the shorter period among the sensor time-series data and control time-series data. The long-period time-series data is the time-series data with the longer period among the sensor time-series data and control time-series data. It is possible to easily obtain the relationship between the control state and the apparatus state in the substrate processing apparatus (1).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理裝置</p>  
        <p type="p">8:控制部</p>  
        <p type="p">26:振動感測器</p>  
        <p type="p">71:處理控制部</p>  
        <p type="p">72:資料處理裝置</p>  
        <p type="p">86:顯示器</p>  
        <p type="p">242:泵</p>  
        <p type="p">721:記憶部</p>  
        <p type="p">722:資料接收部</p>  
        <p type="p">723:資料發送部</p>  
        <p type="p">724:時刻同步部</p>  
        <p type="p">725:週期同步部</p>  
        <p type="p">726:相關資訊產生部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1853" publication-number="202614476"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614476.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614476</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131678</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多層基板、天線元件及天線模組</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01P3/123</main-classification>  
        <further-classification edition="200601120251226B">H01Q13/02</further-classification>  
        <further-classification edition="200601120251226B">H01P3/16</further-classification>  
        <further-classification edition="200601120251226B">H01Q1/38</further-classification>  
        <further-classification edition="200601120251226B">H05K1/14</further-classification>  
        <further-classification edition="200601120251226B">H01P5/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商索尼半導體解決方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上田慎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種能夠實現傳送特性優異之小型波導之多層基板、天線元件及天線模組。 &lt;br/&gt;本技術之一形態之多層基板具備複數個導體層、層間連接部、及至少1個脊部。前述複數個導體層具有形成彼此對向之一對主波導面之一對波導導體層。前述層間連接部具有一對柱壁，該一對柱壁由各自將前述一對波導導體層相互連接之配置成行狀之複數個導體柱構成，彼此對向地配置，在前述一對主波導面之間區劃波導。前述至少1個脊部之寬度較前述一對柱壁之間隔為窄，自前述主波導面朝前述波導側突出而配置，形成沿著前述波導均勻地延伸之脊形波導面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:導體層</p>  
        <p type="p">16:柱狀導體</p>  
        <p type="p">40:柱形波導</p>  
        <p type="p">41:波導導體層</p>  
        <p type="p">42:中間導體層</p>  
        <p type="p">43:主波導面</p>  
        <p type="p">44:波導圖案</p>  
        <p type="p">45:導體柱</p>  
        <p type="p">46:柱壁</p>  
        <p type="p">47:連接導體</p>  
        <p type="p">50:脊部</p>  
        <p type="p">51:脊導體圖案</p>  
        <p type="p">52:周邊導體圖案</p>  
        <p type="p">53:脊連接導體</p>  
        <p type="p">55:脊形波導面</p>  
        <p type="p">100:多層基板</p>  
        <p type="p">L1:第1導體層/導體層</p>  
        <p type="p">L2:第2導體層/導體層</p>  
        <p type="p">L3:第3導體層/導體層</p>  
        <p type="p">L4:第4導體層/導體層</p>  
        <p type="p">V1:內側柱狀導體</p>  
        <p type="p">V2:上側柱狀導體</p>  
        <p type="p">V3:下側柱狀導體</p>  
        <p type="p">X:方向/軸</p>  
        <p type="p">Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1854" publication-number="202613270"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613270.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613270</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131684</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>晶圓加工用帶及晶圓加工方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C09J9/02</main-classification>  
        <further-classification edition="201801120251229B">C09J7/22</further-classification>  
        <further-classification edition="201801120251229B">C09J7/35</further-classification>  
        <further-classification edition="200601120251229B">C09J133/26</further-classification>  
        <further-classification edition="200601120251229B">C09J9/00</further-classification>  
        <further-classification edition="201701120251229B">C01B32/00</further-classification>  
        <further-classification edition="200601120251229B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商電化股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENKA COMPANY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楯洋亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TATE, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金田一修平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINDAICHI, SHUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>升田優亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種晶圓加工用帶、及藉由使用該帶而能夠將複數個半導體加工步驟整合之晶圓加工方法，該晶圓加工用帶能夠抑制切割步驟中產生之切削屑因靜電而附著，又，能夠抑制於需要加熱之步驟中由抗靜電劑污染晶片，從而能夠於半導體加工中貫穿使用。 &lt;br/&gt;本發明之晶圓加工用帶具有基材層、黏著層、及配置於上述基材層與上述黏著層之間之抗靜電層，於250℃下加熱5分鐘後之上述黏著層側之表面電阻率R1相對於加熱前之上述黏著層側之表面電阻率R0之比(R1/R0)為0.001～10以下，上述表面電阻率R1為1.0×10&lt;sup&gt;12&lt;/sup&gt;以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:晶圓加工用帶</p>  
        <p type="p">11:基材層</p>  
        <p type="p">11a:正面</p>  
        <p type="p">11b:背面</p>  
        <p type="p">12:黏著層</p>  
        <p type="p">12a:正面</p>  
        <p type="p">13:抗靜電層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1855" publication-number="202613249"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613249.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613249</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131720</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚矽氧組成物、硬化產物、及增強導熱率及電磁吸收性之方法</chinese-title>  
        <english-title>SILICONE COMPOSITION, CURED PRODUCT AND METHOD OF ENHANCING THERMAL CONDUCTIVITY AND ELECTROMAGNETIC ABSORPTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">C08L83/06</main-classification>  
        <further-classification edition="200601120251222B">C08G77/20</further-classification>  
        <further-classification edition="200601120251222B">C08K3/22</further-classification>  
        <further-classification edition="201101120251222B">H01R13/658</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商陶氏有機矽公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOW SILICONES CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭艷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙丹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, DAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇鳳宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, FENGYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳其</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, QI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種有機矽組成物，其包括(A)有機聚矽氧烷、(B)填料處理劑、及(C)氧化鋅。(C)氧化鋅包括(c)平均粒徑係20 µm或更大之氧化鋅粒子。以該聚矽氧組成物之總重量計，該等(c)氧化鋅粒子之含量係30.00至90.00 wt.%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a silicone composition including (A) an organopolysiloxane, (B) a filler treating agent, and (C) zinc oxide. The (C) zinc oxide includes (c) zinc oxide particles having an average particle size of 20 μm or more. The content of the (c) zinc oxide particles is from 30.00 to 90.00 wt.%, based on the total weight of the silicone composition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1856" publication-number="202613321"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613321.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613321</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131724</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鐵水的精煉方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250827B">C21C1/02</main-classification>  
        <further-classification edition="200601120250827B">C21C5/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中野敬太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田拓之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江嶋厚知郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EJIMA, KOSHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田比瑞留</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, HIZURU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種在對高Si濃度的熔化生鐵進行精煉時，不增加使用轉爐台數地防止噴濺的技術。一種方法為如下精煉方法，所述精煉方法包括：第一步驟，將Si濃度為0.7質量%以上的熔化生鐵裝入至轉爐內；第二步驟，自頂吹噴槍吹附含氧氣體，來除去熔液中Si的一部分；第三步驟，將轉爐內的熔渣排渣至爐外；第四步驟；進行自所述頂吹噴槍吹附氧氣，來除去熔液中Si的剩餘部分的脫矽處理、脫磷處理及脫碳處理；以及第五步驟，使實施了脫矽處理、脫磷處理及脫碳處理的鋼水出鋼，所述方法中，在所述第五步驟中，使在所述第四步驟中產生的熔渣殘留於轉爐內，在下一次處理的所述第一步驟中，在使緊跟在前的處理的熔渣殘留於轉爐內的狀態下裝入熔化生鐵，並在下一次處理的所述第二步驟中再次使用所殘留的所述熔渣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:轉爐</p>  
        <p type="p">2:送氧噴槍(頂吹噴槍)</p>  
        <p type="p">3:底吹風口</p>  
        <p type="p">4:熔體排放口</p>  
        <p type="p">9:鐵水</p>  
        <p type="p">9a:熔化生鐵</p>  
        <p type="p">9b:鋼水</p>  
        <p type="p">10:(脫矽處理後、第二步驟後)熔渣</p>  
        <p type="p">11:冷鐵源</p>  
        <p type="p">12:含氧氣體(氣體氧源)</p>  
        <p type="p">13:底吹氣體</p>  
        <p type="p">14:裝入鍋</p>  
        <p type="p">17:(第四步驟後、脫磷、脫碳處理後)熔渣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1857" publication-number="202613485"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613485.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613485</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131726</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對抗使用投放式爆炸裝置之空中攻擊的頂部防禦</chinese-title>  
        <english-title>TOP PROTECTION AGAINST AERIAL ATTACKS USING DROPPED EXPLOSIVE DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">F41H11/02</main-classification>  
        <further-classification edition="200601120251226B">G01S13/88</further-classification>  
        <further-classification edition="200601120251226B">G01S3/80</further-classification>  
        <further-classification edition="200601120251226B">F41G11/00</further-classification>  
        <further-classification edition="200601120251226B">H04K3/00</further-classification>  
        <further-classification edition="200601120251226B">H01S3/10</further-classification>  
        <further-classification edition="201701120251226B">G06T7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＢＡＥ系統資訊及電子系統整合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱普勒　馬修Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEPLER, MATTHEW F</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於地面發動使用之可攜式反制設備。該可攜式反制設備包含一外殼、存放於該外殼內部之一處理器、可與該處理器配合操作且與該外殼接合之至少一偵測器、及可與該處理器配合操作且收容於該外殼內部之一防衛總成。該至少一偵測器係構造成，偵測在外在環境中位在該偵測器上方之一空中威脅。該防衛總成係構造成，針對位在該防衛總成上方之該空中威脅輸出一反制訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A portable countermeasure apparatus for ground-initiated use. The portable countermeasure apparatus includes a housing, a processor that is stored inside of the housing, at least one detector operable with the processor and engaged with the housing, and a defense assembly operable with the processor and housed inside of the housing. The at least one detector is configured to detect an aerial threat that is above the detector in the external environment. The defense assembly is configured to output a countermeasure signal at the aerial threat that is above the defense assembly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:載臺</p>  
        <p type="p">2:空中威脅</p>  
        <p type="p">3:可部署酬載</p>  
        <p type="p">4:操作員</p>  
        <p type="p">6:控制器</p>  
        <p type="p">8:控制訊號</p>  
        <p type="p">10:地面可使用反制設備</p>  
        <p type="p">30a:視域，束，偵測束</p>  
        <p type="p">58:反制訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1858" publication-number="202614466"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614466.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614466</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131756</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池裝置</chinese-title>  
        <english-title>BATTERY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251230B">H01M10/60</main-classification>  
        <further-classification edition="201401120251230B">H01M10/65</further-classification>  
        <further-classification edition="200601120251230B">H01M10/04</further-classification>  
        <further-classification edition="201401120251230B">H01M10/6556</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴成奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SUNGKYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據各種實施例的電池裝置可包括電池組件、配置為容納電池組件的外殼、複數個流道，複數個流道設置在外殼中的電池組件和外殼的內壁之間並且冷卻材料在複數個流道內冷卻電池組件中產生的熱，以及連接裝置，配置為流體地連接複數個流道的至少部分，並且連接裝置包括第一連接部以及第二連接部，第二連接部連接到第一連接部並且耦合以使得在外殼中允許相對於第一連接部的運動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery apparatus according to various example embodiment may include a battery assembly, a housing configured to accommodate the battery assembly, a plurality of flow paths that is disposed between the battery assembly and an inner wall of the housing in the housing and in which a cooling material that cools heat generated in the battery assembly, and a connection device configured to fluidly connect at least a portion of the plurality of flow paths, and the connection device includes a first connection part, and a second connection part connected to the first connection part and coupled so that movement relative to the first connection part is allowed in the housing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電池裝置</p>  
        <p type="p">100:電池組件</p>  
        <p type="p">200:外殼</p>  
        <p type="p">200I:內牆壁</p>  
        <p type="p">300:流道</p>  
        <p type="p">300a:第一流道</p>  
        <p type="p">300b:第二流道</p>  
        <p type="p">400:連接裝置</p>  
        <p type="p">410:第一連接部</p>  
        <p type="p">420:第二連接部</p>  
        <p type="p">500:整合式連接器</p>  
        <p type="p">D1、D2、D3:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1859" publication-number="202613253"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613253.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613253</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131758</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經處理之無機粒子</chinese-title>  
        <english-title>TREATED INORGANIC PARTICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">C09C1/36</main-classification>  
        <further-classification edition="200601120251231B">C09C3/08</further-classification>  
        <further-classification edition="200601120251231B">C08K5/053</further-classification>  
        <further-classification edition="201801120251231B">C09D7/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科慕ＦＣ有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林國輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, HERMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海斯特　布雷特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HESTER, BRETT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尼爾森　馬修　Ｇ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NELSON, MATTHEW G.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種經處理之無機粒子，其包含具有表面之無機粒子，且該無機粒子表面上具有表面處理，其中該表面處理包含(1)二氧化矽、(2)氧化鋁、及(3)包含多元醇及/或矽酸鹽之有機處理劑，且其中該有機處理劑之量係該經處理之無機粒子之約0.01 wt%至約1 wt%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A treated inorganic particle comprising an inorganic particle having a surface and having a surface treatment on the inorganic particle surface, wherein the surface treatment comprises (1) silica, (2) alumina, and (3) an organic treatment comprising a polyol and/or siliconate, and wherein the organic treatment is present in an amount of about 0.01 wt% to about 1 wt% of the treated inorganic particle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1860" publication-number="202614727"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614727.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614727</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131790</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電磁波屏蔽膜</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H05K9/00</main-classification>  
        <further-classification edition="200601120251219B">H05K1/02</further-classification>  
        <further-classification edition="200601120251219B">B32B3/30</further-classification>  
        <further-classification edition="201901120251219B">B32B7/025</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商拓自達電線股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TATSUTA ELECTRIC WIRE &amp; CABLE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邊正博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高見晃司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAMI, KOUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上農憲治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMINO, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種可減小傳輸損耗的電磁波屏蔽膜。&lt;br/&gt; 本發明之電磁波屏蔽膜，特徵在於：其係由保護層、積層於上述保護層之屏蔽層及積層於上述屏蔽層之接著劑層構成，於上述屏蔽層之上述接著劑層側形成有複數個導電性凸塊；從上述接著劑層側俯視上述屏蔽層時，上述導電性凸塊係配置成位於以二種以上多角形密鋪之各多角形頂點，且上述導電性凸塊係以下述方式來配置：針對上述複數個導電性凸塊，分別描繪線段來連接各上述導電性凸塊與位於最靠近位置之最接近導電性凸塊，再畫出直線是通過該等線段之其中一個線段，此時，上述直線具有未與其他上述線段重複之部分。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電磁波屏蔽膜</p>  
        <p type="p">11:保護層</p>  
        <p type="p">12:屏蔽層</p>  
        <p type="p">13:接著劑層</p>  
        <p type="p">14:導電性凸塊</p>  
        <p type="p">H:導電性凸塊之高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1861" publication-number="202614448"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614448.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614448</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131841</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電磁波遮罩片、遮罩加工晶片、半導體裝置及其製造方法</chinese-title>  
        <english-title>ELECTROMAGNETIC WAVE SHIELDING SHEET, SHIELDED WAFER, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250902B">H01L23/60</main-classification>  
        <further-classification edition="200601120250902B">H05K9/00</further-classification>  
        <further-classification edition="201901120250902B">B32B7/02</further-classification>  
        <further-classification edition="200601120250902B">B32B7/12</further-classification>  
        <further-classification edition="200601120250902B">H01L21/301</further-classification>  
        <further-classification edition="200601120250902B">H01L21/603</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商愛天思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTIENCE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東洋科美股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOCHEM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安東健次</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDO, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松戸和規</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDO, KAZUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松尾玲季</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUO, TAMAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可對單片化前的晶片進行整體被覆、被覆性優異且可靠性高的電磁波遮罩片、以及使用所述電磁波遮罩片形成的遮罩加工晶片、半導體裝置及其製造方法。本發明的課題是通過電磁波遮罩片來解決，其為用於對單片化前的半導體晶片上進行整體被覆的電磁波遮罩片（3），電磁波遮罩片（3）至少具有包含導電填料（F）及粘合劑成分的遮罩膜（30），所述電磁波遮罩片（3）的100℃下的伸長率為100%～1500%，在將電磁波遮罩片（3）在180℃下處理2小時後的硬化片中，100℃下的楊氏模量為100 MPa～1000 MPa。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a highly reliable electromagnetic wave shielding sheet that is capable of performing batch coating on a wafer before dicing and has excellent coating properties, a shielded wafer formed using the electromagnetic wave shielding sheet, a semiconductor device, and a manufacturing method thereof. An electromagnetic wave shielding sheet 3 for performing batch coating on a semiconductor wafer before dicing includes at least a shielding film 30 including a conductive filler (F) and a binder component, has an elongation rate of 100% to 1500% at 100°C, and has a Young's modulus of 100 MPa to 1000 MPa at 100°C in a cured sheet after treating the electromagnetic wave shielding sheet 3 at 180°C for 2 hours.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:半導體元件形成晶片</p>  
        <p type="p">2:SC層</p>  
        <p type="p">11:半切割槽</p>  
        <p type="p">12:元件形成區域</p>  
        <p type="p">14:多層配線結構部</p>  
        <p type="p">17:劃線</p>  
        <p type="p">20:遮罩層</p>  
        <p type="p">101:遮罩加工晶片</p>  
        <p type="p">X、Y、Z:軸/方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1862" publication-number="202613209"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613209.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613209</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131844</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶配向劑、液晶配向膜及液晶元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">C08G73/10</main-classification>  
        <further-classification edition="200601120250901B">C08L79/08</further-classification>  
        <further-classification edition="200601120250901B">C08L25/18</further-classification>  
        <further-classification edition="200601120250901B">C08L35/06</further-classification>  
        <further-classification edition="200601120250901B">C08L83/04</further-classification>  
        <further-classification edition="200601120250901B">C08K5/13</further-classification>  
        <further-classification edition="200601120250901B">C08K5/1515</further-classification>  
        <further-classification edition="200601120250901B">C08K5/20</further-classification>  
        <further-classification edition="200601120250901B">C08K5/3492</further-classification>  
        <further-classification edition="200601120250901B">G02F1/1337</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前田裕矢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEDA, YUUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木敬一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可獲得面板透過率良好的液晶元件、進而塗佈性優異的液晶配向劑。一種液晶配向劑，含有為選自由聚醯胺酸、聚醯胺酸酯及聚醯亞胺所組成的群組中的至少一種且具有選自由萘環結構、芴環結構及三嗪環結構所組成的群組中的至少一種特定結構[S]的聚合物[P]，或者含有選自由聚醯胺酸、聚醯胺酸酯及聚醯亞胺所組成的群組中的至少一種聚合物、以及具有所述特定結構[S]的化合物[A]（其中，聚合物[P]除外），還含有選自由式（1）所表示的化合物、式（2）所表示的化合物、式（3）所表示的化合物及式（4）所表示的化合物所組成的群組中的至少一種化合物[D1]。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1863" publication-number="202613811"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613811.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613811</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131851</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>暫存器重新命名裝置、暫存器重新命名方法以及暫存器重新命名系統</chinese-title>  
        <english-title>REGISTER RENAMING APPARATUS, REGISTER RENAMING METHOD AND REGISTER RENAMING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F9/46</main-classification>  
        <further-classification edition="200601120251201B">G06F13/14</further-classification>  
        <further-classification edition="200601120251201B">G06F12/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張通</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, TONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾健平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, JIANPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮茲馬尼　瑞克哈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PITCHUMANI, REKHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇　亮奭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KI, YANG SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露了一種用於暫存器重新命名的技術。衝突檢測電路配置為檢測第一解碼指令和第二解碼指令之間的暫存器衝突。暫存器衝突與第一架構暫存器和對應於第一架構暫存器的第一實體暫存器關聯。映射電路配置為將第一架構暫存器改變為第二架構暫存器，並將第二架構暫存器映射至不同於第一實體暫存器的第二實體暫存器。第一解碼指令和第二解碼指令從處理元件（processing element，PE）中的單一執行緒解碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A technique for register renaming is disclosed. A conflict detector circuit is configured to detect a register conflict between a first decoded instruction and a second decoded instruction. The register conflict is associated with a first architectural register and a first physical register corresponding to the first architectural register. A mapping circuit is configured to change the first architectural register to a second architectural register and to map the second architectural register to a second physical register different from the first physical register. The first decoded instruction and the second decoded instruction are decoded from a single thread in a processing element (PE).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">235:暫存器重新命名電路</p>  
        <p type="p">234:發佈階段</p>  
        <p type="p">270:暫存器檔案</p>  
        <p type="p">310:區塊</p>  
        <p type="p">315:區塊</p>  
        <p type="p">320:區塊</p>  
        <p type="p">332:第一解碼指令</p>  
        <p type="p">334:第二解碼指令</p>  
        <p type="p">340:衝突檢測電路</p>  
        <p type="p">350:映射電路</p>  
        <p type="p">352:映射表</p>  
        <p type="p">353:主要集合</p>  
        <p type="p">354:冗餘集合</p>  
        <p type="p">356:區塊</p>  
        <p type="p">370:區塊</p>  
        <p type="p">r1~r6、rN、pr1~pr6、prN、rpr1~rpr3、rprM:暫存器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1864" publication-number="202614298"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614298.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614298</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131857</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感測器控制方法及電腦可讀取程式</chinese-title>  
        <english-title>SENSOR CONTROL METHOD AND COMPUTER-READABLE PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L21/67</main-classification>  
        <further-classification edition="200901120251229B">H04W56/00</further-classification>  
        <further-classification edition="200601120251229B">G01D18/00</further-classification>  
        <further-classification edition="200601120251229B">G06F9/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>島田真稔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMADA, MASATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>生和高明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEIWA, TAKAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">基板處理裝置中控制感測器之感測器控制方法具備：步驟S11～S18所示之工序；及如下之工序：較步驟S18之後，於第2通信差量與第1通信差量之差的絕對值大於規定臨限值之情形(步驟S19)時，將第1通信差量更新為與第2通信差量相等(步驟S20)，回到步驟S15，進行步驟S15至步驟S19，於第2通信差量與第1通信差量之差的絕對值為臨限值以下之情形(步驟S19)時，結束感測器時刻之更新。藉此，可適當進行與基板處理裝置無線連接之感測器之時刻同步。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The sensor control method for controlling a sensor in a substrate processing apparatus includes the operations shown in steps S11 to S18 and the operations shown in steps S19 to S20, which are performed after step S18. In steps S19-S20, if the absolute value of the difference between the second communication difference and the first communication difference is greater than the predetermined threshold value (step S19), the first communication difference is updated to equal the second communication difference (step S20), and the operation returns to step S15 to step S19. On the other hand, if the absolute value of the difference between the second communication difference and the first communication difference is less than the threshold value (step S19), the sensor time update is completed. This allows for suitable synchronization of the time of sensors that are wirelessly connected to the board processor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11~S20:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1865" publication-number="202614326"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614326.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614326</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131863</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板搬送裝置、基板處理裝置及基板狀態檢測方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/677</main-classification>  
        <further-classification edition="200601120251226B">H01L21/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友田元貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMODA, GENKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森住涼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIZUMI, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河原啓之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAHARA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種基板搬送裝置、基板處理裝置及基板狀態檢測方法。基板搬送裝置1具備載置載體C之載物台9、具有投光部27A及受光部27B之映射感測器27、升降部、及控制部。控制部以投光部27A及受光部27B通過載體C內之基板W之方式，使升降部移動投光部27A及受光部27B。控制部於自映射感測器27輸出之信號波形中，取得與來自投光部27A之光被基板W遮擋而信號值變小之谷部之兩端相接之2個峰部中之至少一峰部之波形資訊。控制部基於峰部之波形資訊，檢測繞取出放入方向上延伸之軸產生之基板W之傾斜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理裝置</p>  
        <p type="p">2:傳載區塊</p>  
        <p type="p">3:處理區塊</p>  
        <p type="p">5:裝載埠</p>  
        <p type="p">7:殼體</p>  
        <p type="p">7A:壁部</p>  
        <p type="p">7B:通過口</p>  
        <p type="p">9:載物台</p>  
        <p type="p">11:蓋裝卸部</p>  
        <p type="p">19:擋板部</p>  
        <p type="p">27:映射感測器</p>  
        <p type="p">27A:投光部</p>  
        <p type="p">27B:受光部</p>  
        <p type="p">41:手部</p>  
        <p type="p">43:多關節臂</p>  
        <p type="p">45:升降台</p>  
        <p type="p">51:處理單元</p>  
        <p type="p">53:保持旋轉部</p>  
        <p type="p">55:噴嘴</p>  
        <p type="p">61:手部</p>  
        <p type="p">C:載體</p>  
        <p type="p">CR:中心機器人</p>  
        <p type="p">IR:搬送機器人</p>  
        <p type="p">PS:基板載置部</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1866" publication-number="202614724"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614724.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614724</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131879</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液冷式散熱器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">H05K7/20</main-classification>  
        <further-classification edition="200601120251223B">H01L23/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商古河電氣工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FURUKAWA ELECTRIC CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name/>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UCHIMURA, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOKI, HIROFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>引地秀太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIKICHI, SHUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HATADA, MASANOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤裕士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為了提供一種液冷式散熱器，可獲得其與發熱體之穩定的熱連接性，可防止發熱體安裝於殼體時影響鄰接的其他發熱體與液冷式散熱器之熱連接性。 &lt;br/&gt;　　液冷式散熱器具有台座、冷板、第1配管及第2配管，台座，具有作為受熱部的平面部、及從受熱部突出之突出部，且在受熱部與發熱體熱連接；冷板，在突出部之至少一部分的區域與台座熱連接，形成有熱介質流通空間，用於將從發熱體吸收的熱釋放到流過熱介質流通空間之熱介質；第1配管及第2配管連接於冷板，台座和冷板彼此分離，藉由讓沿著冷板的主表面方向之彈力作用於突出部之第1彈性體使台座與冷板熱連接，藉由第2彈性體之與主表面方向垂直的方向之彈力使台座與發熱體熱連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:液冷式散熱器</p>  
        <p type="p">10:冷板</p>  
        <p type="p">20:第1配管</p>  
        <p type="p">30:第2配管</p>  
        <p type="p">100:殼體</p>  
        <p type="p">101:發熱體收納部</p>  
        <p type="p">200:台座</p>  
        <p type="p">220:第2彈性體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1867" publication-number="202613217"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613217.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613217</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131890</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>集電體、負極用集電體、蓄電元件、二次電池、電動汽車、電動飛行器及電子機器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">C08J5/22</main-classification>  
        <further-classification edition="200601120251231B">B32B15/08</further-classification>  
        <further-classification edition="200601120251231B">B32B15/085</further-classification>  
        <further-classification edition="200601120251231B">B32B15/09</further-classification>  
        <further-classification edition="201001120251231B">H01M4/134</further-classification>  
        <further-classification edition="200601120251231B">H01M4/64</further-classification>  
        <further-classification edition="201001120251231B">H01M10/052</further-classification>  
        <further-classification edition="202301120251231B">H10K71/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡田一馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKADA, KAZUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東大路卓司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGASHIOJI, TAKUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新田優也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTA, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森藤亨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIFUJI, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山王堂尚輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANNOUDO, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾形大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGATA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加門慶一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMON, KEIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種集電體，其具有由金屬及/或金屬系化合物所構成之層(M層)與樹脂層，在主要配向正交方向-厚度方向剖面中，具有至少1層的具有扁平狀的域結構(domain structure)之樹脂層。又，一種集電體，其具有由金屬及/或金屬系化合物所構成之層(M層)與樹脂層，在主要配向正交方向-厚度方向剖面中，具有至少1層的具有厚度方向長度為1.0μm以下，且長寬比為5以上之域結構之樹脂層。提供一種集電體，尤其是負極用集電體，其尤其是在評價由金屬及/或金屬系化合物所構成之層(M層)與樹脂層的密著性之剝離試驗中，能夠抑制樹脂層的材料破壞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:反映在CV測定中之所觀測到之每單位面積的電流值之縱軸</p>  
        <p type="p">2:以在CV測定中之鋰金屬的氧化還原電位作為基準的0V之反映施加電位之橫軸</p>  
        <p type="p">3:藉由CV測定所得到之繪製相對於施加電位之每單位面積的電流值所得到之曲線</p>  
        <p type="p">4:CV測定所觀測到之電流值成為最小之電流值波峰</p>  
        <p type="p">5:CV測定所觀測到之電流值成為最大之區域的電流值波峰</p>  
        <p type="p">6:CV測定所觀測到之電流值之中絕對值成為最大之值(最大還原電流波峰強度)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1868" publication-number="202613570"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613570.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613570</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131902</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>皮膜電阻短時間過負載測試機</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251228B">G01R31/01</main-classification>  
        <further-classification edition="200601120251228B">H01C17/02</further-classification>  
        <further-classification edition="200601120251228B">G01R19/165</further-classification>  
        <further-classification edition="200601120251228B">B65G47/244</further-classification>  
        <further-classification edition="200601120251228B">G01R1/10</further-classification>  
        <further-classification edition="200601120251228B">G01R1/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李清和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHING-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李清和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHING-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種皮膜電阻短時間過負載測試機，包括機台前方設置有直立旋轉之測試盤，測試盤帶動各夾具依序通過斷電狀態進出料區之進料側，讓各夾具之導電夾頭與導電環分別夾住待測之皮膜電阻兩極端，再運載各皮膜電阻依序進入測試區實施短時間過負載電壓測試，然後測試盤運載各測試後之皮膜電阻依序進入斷電狀態進出料區之出料側，並讓夾具打開導電夾頭卸落測試後之皮膜電阻，進而避免皮膜電阻在過負載測試過程發生摩擦損傷與引起火花，以確保皮膜電阻品質與銲錫性。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img> 
        <p type="p">12:固定架</p>  
        <p type="p">2:測試盤</p>  
        <p type="p">21:絕緣盤體</p>  
        <p type="p">212:凸環圈</p>  
        <p type="p">242:第二導線</p>  
        <p type="p">25:導電環</p>  
        <p type="p">251:導電環段</p>  
        <p type="p">26:夾具</p>  
        <p type="p">261:夾座</p>  
        <p type="p">262:夾持臂</p>  
        <p type="p">263:導電夾頭</p>  
        <p type="p">264:軸承</p>  
        <p type="p">3:電極盤</p>  
        <p type="p">31:絕緣本體</p>  
        <p type="p">36:導軌</p>  
        <p type="p">361:軌座</p>  
        <p type="p">362:螺絲</p>  
        <p type="p">5:皮膜電阻</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1869" publication-number="202613730"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613730.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613730</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131916</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於圖案化層狀結構之微影設備與方法</chinese-title>  
        <english-title>LITHOGRAPHY APPARATUS, AND METHOD OF PATTERNING A LAYERED STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">G03F7/20</main-classification>  
        <further-classification edition="200601120251231B">G03F7/004</further-classification>  
        <further-classification edition="200601120251231B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商應用材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED MATERIALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班卻爾　克里斯多夫丹尼斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENCHER, CHRISTOPHER DENNIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案的實施例包括一種用於圖案化層狀結構之微影設備、圖案化系統及方法。圖案化系統包括影像形成裝置及反應層。圖案化系統允許在單一操作中創建微影圖案。微影設備包括圖案化系統和光學系統。微影設備與影像形成裝置一起使用複數個波長的光，以在反應層上創建複數個顏色圖案。圖案化方法包括將反應層曝露於複數個波長的光。依據發射到不同區域的光的波長，光會與反應層的不同區域發生不同的反應。本案揭示的方法及設備僅需要一個影像形成裝置及一個微影操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure include a lithography apparatus, patterning system, and method of patterning a layered structure. The patterning system includes an image formation device and a reactive layer. The patterning system allows for creating lithography patterns in a single operation. The lithography apparatus includes the patterning system and an optical system. The lithography apparatus uses a plurality of wavelengths of light, along with the image formation device, to create a plurality of color patterns on the reactive layer. The method of patterning includes exposing the reactive layer to a plurality of wavelengths of light. The light reacts differently with different regions of the reactive layer, depending on the wavelength of light emitted onto the different regions. The method and apparatuses disclosed herein require only one image formation device and one lithography operation.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:微影設備</p>  
        <p type="p">103:光學系統</p>  
        <p type="p">105:投影透鏡</p>  
        <p type="p">110:反應層</p>  
        <p type="p">115:基板</p>  
        <p type="p">116:基板支撐</p>  
        <p type="p">117:層狀結構</p>  
        <p type="p">118:支撐致動器</p>  
        <p type="p">120:影像形成裝置</p>  
        <p type="p">130:光源系統</p>  
        <p type="p">150:圖案化系統</p>  
        <p type="p">190:控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1870" publication-number="202612849"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612849.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612849</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131926</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>邊緣區域塗層移除裝置</chinese-title>  
        <english-title>EDGE ZONE COATING REMOVAL APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">B24C3/12</main-classification>  
        <further-classification edition="200601120251217B">B24C5/04</further-classification>  
        <further-classification edition="200601120251217B">H01L21/687</further-classification>  
        <further-classification edition="200601120251217B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商易爾德工程系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIELD ENGINEERING SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查奈亞　克里希納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANNAIAH, KRISHNA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希布　安廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBU, ANTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡爾西克　阿倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARTHICK, ARUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈曼吉　羅傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMAMJY, ROGER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫馬爾　希夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, SHIV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穆魯格甚　拉克斯曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURUGESH, LAXMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康尼格里奧　安東尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CONIGLIO, ANTHONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">從基底邊緣移除塗層的裝置包括真空夾盤組件和噴嘴組件。真空夾盤組件配置為使用吸力支撐基底。噴嘴組件包括具有一對噴嘴噴頭的噴嘴頭，配置為在基底表面上引導有角度的液體流。圍繞每個噴嘴噴頭的環形管道排出加壓氣體以在有角度的液體流周圍形成氣體護罩。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus to remove a coating from an edge of a substrate includes a vacuum chuck assembly and a nozzle assembly. The vacuum chuck assembly is configured to support the substrate using suction. The nozzle assembly includes a nozzle head with a pair of nozzle tips configured to direct an angled liquid stream on a surface of the substrate. An annular duct around each nozzle tip discharges a pressurized gas to form a gas shroud around the angled liquid stream.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基底</p>  
        <p type="p">62:噴嘴頭</p>  
        <p type="p">64A:第一噴嘴頭</p>  
        <p type="p">64B:第二噴嘴頭</p>  
        <p type="p">66:本體</p>  
        <p type="p">θ:角度</p>  
        <p type="p">72:中央腔</p>  
        <p type="p">76:管道</p>  
        <p type="p">78:導管</p>  
        <p type="p">82:吸盤</p>  
        <p type="p">84:排水管</p>  
        <p type="p">120:平面</p>  
        <p type="p">130:縱軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1871" publication-number="202613278"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613278.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613278</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131963</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>由ＡｇＡｕ硫族化物多元化合物所構成之半導體奈米粒子</chinese-title>  
        <english-title>SEMICONDUCTOR NANOPARTICLES COMPOSED OF AGAU CHALCOGEN MULTICOMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">C09K11/54</main-classification>  
        <further-classification edition="200601120251224B">C09K11/58</further-classification>  
        <further-classification edition="202401120251224B">B01J35/53</further-classification>  
        <further-classification edition="202201120251224B">B22F1/17</further-classification>  
        <further-classification edition="202201120251224B">B22F1/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立大學法人東海國立大學機構</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL UNIVERSITY CORPORATION TOKAI NATIONAL HIGHER EDUCATION AND RESEARCH SYSTEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商田中貴金屬工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA PRECIOUS METAL TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鳥本司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORIMOTO, TSUKASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亀山達矢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMEYAMA, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋吉一孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKIYOSHI, KAZUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林陽奈子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, HINAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮前千恵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAMAE, CHIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤弘規</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大武成行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OOTAKE, SHIGEYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大嶋優輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHSHIMA, YUUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關由包含Ag、Au、硫族化物(chalcogenide)元素、金屬M1及金屬M2之多元素之AgAu硫族化物所構成的半導體奈米粒子。 &lt;br/&gt;　　前述AgAu硫族化物之硫族化物元素係S、Se、Te之至少1個，金屬M1係In、Al、Ga、Tl、Cd、Hg、Cu之至少1個，前述金屬M2為Zn。而且，金屬M1係有助於AgAu硫族化物之光半導體特性之提昇，金屬M2的Zn具有對親水化處理之耐久性提昇的作用。本發明之半導體奈米粒子係以AgAu硫族化物作為核，可得到具有分別含有金屬M1與金屬M2之第1、第2殼的雙殼構造。本發明之半導體奈米粒子具有較佳之光半導體特性與耐久性，親水化處理時之破損或特性變化被抑制。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">To provide semiconductor nanoparticles composed of a multicomponent AgAu chalcogen compound containing Ag, Au, a chalcogen element, metal M1, and metal M2. The chalcogen element of the AgAu chalcogen compound is at least one of S, Se, and Te, the metal M1 is at least one of In, Al, Ga, Tl, Cd, Hg, and Cu, and the metal M2 is Zn. The metal M1 contributes to improving the optical semiconductor properties of the AgAu chalcogen compound, and the metal M2, Zn, has the effect of enhancing durability by suppressing damage and property changes due to hydrophilic treatment. The semiconductor nanoparticles can have a dual shell structure having a AgAu chalcogen compound as a core and first and second shells containing metal M1 and metal M2, respectively.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1872" publication-number="202613374"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613374.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613374</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114131974</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>萊賽爾材料、吸煙製品的過濾嘴、吸煙製品及其製造方法</chinese-title>  
        <english-title>LYOCELL MATERIAL, FILTERS FOR SMOKING ARTICLES, SMOKING ARTICLES AND METHOD FOR PREPARING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">D01F2/00</main-classification>  
        <further-classification edition="200601120251229B">D01D1/02</further-classification>  
        <further-classification edition="200601120251229B">D01D5/06</further-classification>  
        <further-classification edition="200601120251229B">D01D10/00</further-classification>  
        <further-classification edition="200601120251229B">D01D10/06</further-classification>  
        <further-classification edition="200601120251229B">D02G1/00</further-classification>  
        <further-classification edition="200601120251229B">A24D3/10</further-classification>  
        <further-classification edition="200601120251229B">A24D3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商可隆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLON INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商韓國煙草人參股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KT&amp;G CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李廷薫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JEONG HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭鍾喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, JONG CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴恩英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, EUN YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐昇潼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, SEUNG DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, GUN MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃永男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, YEONG NAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃珉姬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, MIN HEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇聖鍾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KI, SUNG JONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬京培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, KYENG BAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁眞哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIN CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河成薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HA, SUNG HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請關於萊賽爾材料、包括萊賽爾材料的用於吸煙製品的過濾嘴、以及吸煙製品。根據本申請的萊賽爾材料和用於吸煙製品的過濾嘴可以在本技術領域中替代醋酸纖維素材料和包括其的用於吸煙製品的過濾嘴。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to a lyocell material, a filter for a smoking article, which includes the lyocell material, and a smoking article. The lyocell material and the filter for a smoking article, according to the present application, may replace cellulose acetate materials and filters for smoking articles including the same, in the art.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1873" publication-number="202613193"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613193.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613193</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132005</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶配向劑、液晶配向膜、液晶元件及其製造方法</chinese-title>  
        <english-title>LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM, LIQUID CRYSTAL ELEMENT, AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250901B">C08F20/18</main-classification>  
        <further-classification edition="200601120250901B">C08F20/28</further-classification>  
        <further-classification edition="200601120250901B">C08F220/30</further-classification>  
        <further-classification edition="200601120250901B">C08F222/10</further-classification>  
        <further-classification edition="200601120250901B">C08G73/10</further-classification>  
        <further-classification edition="200601120250901B">C08L33/06</further-classification>  
        <further-classification edition="200601120250901B">C08L33/14</further-classification>  
        <further-classification edition="200601120250901B">C08L35/00</further-classification>  
        <further-classification edition="200601120250901B">C08L79/08</further-classification>  
        <further-classification edition="200601120250901B">C08K5/103</further-classification>  
        <further-classification edition="200601120250901B">C08K5/13</further-classification>  
        <further-classification edition="200601120250901B">C08K5/1515</further-classification>  
        <further-classification edition="200601120250901B">C08K5/18</further-classification>  
        <further-classification edition="200601120250901B">C08K5/20</further-classification>  
        <further-classification edition="200601120250901B">C08K5/205</further-classification>  
        <further-classification edition="200601120250901B">C08K5/3445</further-classification>  
        <further-classification edition="200601120250901B">C08K5/5435</further-classification>  
        <further-classification edition="200601120250901B">G02F1/1337</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西村達哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIMURA, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安池伸夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUIKE, NOBUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大野龍蔵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OONO, RYUUZOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中西恵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANISHI, MEGUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中宏樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勝井宏充</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATSUI, HIROMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可實現液晶元件的低電壓驅動化，並且可形成密著性優異的液晶配向膜且塗佈性優異的液晶配向劑。一種液晶配向劑，含有加成聚合物[P]，所述加成聚合物[P]包含：結構單元[A]，具有與鏈狀結構中或脂肪族環內的碳原子（其中，羰基中的碳原子及構成聚合物的主鏈的碳原子除外）鍵結的羥基；及結構單元[B]，具有式（1）所表示的部分結構且與所述結構單元[A]不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:液晶元件</p>  
        <p type="p">11:第一基板</p>  
        <p type="p">12:第二基板</p>  
        <p type="p">13:液晶層</p>  
        <p type="p">14:共用電極</p>  
        <p type="p">15:絕緣膜</p>  
        <p type="p">16:像素電極</p>  
        <p type="p">17:彩色濾光片</p>  
        <p type="p">18:外塗膜</p>  
        <p type="p">19:狹縫</p>  
        <p type="p">21、22:液晶配向膜</p>  
        <p type="p">23、24:偏光板</p>  
        <p type="p">25:液晶分子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1874" publication-number="202613147"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613147.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613147</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132066</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>胜肽及其治療癌症之用途</chinese-title>  
        <english-title>PEPTIDE AND THE USE THEREOF IN TREATMENT OF CANCER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K7/06</main-classification>  
        <further-classification edition="200601120260102B">C07K7/08</further-classification>  
        <further-classification edition="201901120260102B">A61K38/08</further-classification>  
        <further-classification edition="200601120260102B">A61K38/10</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中央研究院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACADEMIA SINICA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佩燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, RITA P.-Y.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳信良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HSIN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃　詩婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NG, SEE-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭品妡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, PIN-SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王德華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONG, TAK-WAH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃偉倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, WEI-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜　紫瑄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOR, ZHI-XUEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MY</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文提供一種式(I)之肽：A&lt;sub&gt;1&lt;/sub&gt;B&lt;sub&gt;1&lt;/sub&gt;B&lt;sub&gt;2&lt;/sub&gt;A&lt;sub&gt;2&lt;/sub&gt;B&lt;sub&gt;3&lt;/sub&gt;B&lt;sub&gt;4&lt;/sub&gt;A&lt;sub&gt;3&lt;/sub&gt;A&lt;sub&gt;4&lt;/sub&gt;B&lt;sub&gt;5&lt;/sub&gt;X；其中A&lt;sub&gt;1&lt;/sub&gt;、A&lt;sub&gt;2&lt;/sub&gt;、A&lt;sub&gt;3&lt;/sub&gt;、和A&lt;sub&gt;4&lt;/sub&gt;代表疏水性胺基酸殘基，B&lt;sub&gt;1&lt;/sub&gt;、B&lt;sub&gt;2&lt;/sub&gt;、B&lt;sub&gt;3&lt;/sub&gt;、B&lt;sub&gt;4&lt;/sub&gt;、和B&lt;sub&gt;5&lt;/sub&gt;代表帶正電的胺基酸殘基；X係0到5個胺基酸。本文另提供式(I)之肽於癌症治療之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided herein is related to a peptide of formula (I): A&lt;sub&gt;1&lt;/sub&gt;B&lt;sub&gt;1&lt;/sub&gt;B&lt;sub&gt;2&lt;/sub&gt;A&lt;sub&gt;2&lt;/sub&gt;B&lt;sub&gt;3&lt;/sub&gt;B&lt;sub&gt;4&lt;/sub&gt;A&lt;sub&gt;3&lt;/sub&gt;A&lt;sub&gt;4&lt;/sub&gt;B&lt;sub&gt;5&lt;/sub&gt;X; wherein A&lt;sub&gt;1&lt;/sub&gt;, A&lt;sub&gt;2&lt;/sub&gt;, A&lt;sub&gt;3&lt;/sub&gt;, and A&lt;sub&gt;4&lt;/sub&gt; represents hydrophobic amino acid residues and B&lt;sub&gt;1&lt;/sub&gt;, B&lt;sub&gt;2&lt;/sub&gt;, B&lt;sub&gt;3&lt;/sub&gt;, B&lt;sub&gt;4&lt;/sub&gt;, and B&lt;sub&gt;5&lt;/sub&gt; represents positively charged amino acid residues; X is 0 to 5 amino acid. Also provided herein is use of peptide of formula (I) in the treatment of cancer.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1875" publication-number="202614299"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614299.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614299</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132080</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製程腔室及半導體製程設備</chinese-title>  
        <english-title>PROCESS CHAMBER AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250904B">H01L21/67</main-classification>  
        <further-classification edition="200601120250904B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳世民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, SHI MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王石</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾慶毫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, QING HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫雨簫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YU XIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製程腔室及半導體製程設備，製程腔室包括：腔室本體，其頂部具有進氣孔，進氣孔用於向腔室本體內部輸送製程氣體；第一轉盤，繞第一軸線可轉動地設置在腔室本體內，並位於進氣孔的下方，進氣孔的軸線方向與第一軸線平行；第二轉盤，用於承載晶圓，第二轉盤繞第二軸線可轉動地設置在第一轉盤上。本申請的製程腔室通過在腔室本體頂部沿第一軸線方向設置進氣孔，可以保證製程氣體在到達第一轉盤時，在第一轉盤的內側和外側的擴散情況是一致的，因此，擴散均勻程度也是一致的，保證了晶圓的一致性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process chamber and a semiconductor process equipment are provided. The process chamber includes a chamber body having an air inlet at the top thereof, the air inlet being used to deliver process gas into the chamber body; a first turntable rotatably disposed around a first axis within the chamber body and located below the air inlet, the axis of the air inlet being parallel to the first axis; and a second turntable for carrying wafers, the second turntable being rotatably disposed around a second axis on the first turntable. The process chamber of the present application, by disposing the air inlet at the top of the chamber body along the first axis, can ensure that the diffusion conditions of the process gas on the inside and outside of the first turntable are the same when the process gas reaches the first turntable. Therefore, the diffusion uniformities on the inside and outside of the first turntable are also consistent, thereby ensuring the consistency in quality of the wafers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:腔室本體</p>  
        <p type="p">11:腔室側壁</p>  
        <p type="p">12:進氣組件</p>  
        <p type="p">13:腔室底座</p>  
        <p type="p">16:上腔</p>  
        <p type="p">17:下腔</p>  
        <p type="p">20:第一轉盤</p>  
        <p type="p">23:連通孔</p>  
        <p type="p">30:第二轉盤</p>  
        <p type="p">40:第一排氣管</p>  
        <p type="p">41:第一排氣通道</p>  
        <p type="p">42:第一排氣孔</p>  
        <p type="p">50:升降機構</p>  
        <p type="p">52:升降桿</p>  
        <p type="p">70:顆粒收集結構</p>  
        <p type="p">71:第一收集槽</p>  
        <p type="p">72:第二收集槽</p>  
        <p type="p">80:第二排氣管</p>  
        <p type="p">81:第二排氣通道</p>  
        <p type="p">82:第二排氣孔</p>  
        <p type="p">90:集塵環</p>  
        <p type="p">111:傳片口</p>  
        <p type="p">121:進氣法蘭</p>  
        <p type="p">122:孔板</p>  
        <p type="p">A1:第一軸線</p>  
        <p type="p">A2:第二軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1876" publication-number="202614129"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614129.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614129</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132090</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子探測裝置、電子信號探測方法及電子顯微鏡</chinese-title>  
        <english-title>ELECTRONIC DETECTION DEVICE, ELECTRONIC SIGNAL DETECTION METHOD AND ELECTRON MICROSCOPE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251228B">H01J37/28</main-classification>  
        <further-classification edition="200601120251228B">H01J37/26</further-classification>  
        <further-classification edition="200601120251228B">H01J37/147</further-classification>  
        <further-classification edition="200601120251228B">H01J37/244</further-classification>  
        <further-classification edition="200601120251228B">H01L21/67</further-classification>  
        <further-classification edition="201801120251228B">G01N23/2251</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東方晶源微電子科技(北京)股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGFANG JINGYUAN ELECTRON CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孟慶浪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MENG, QING-LANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林坤成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露公開了一種電子探測裝置、電子信號探測方法及電子顯微鏡。該電子探測裝置包括第一對中元件、探測器元件、第二對中元件、物鏡和用於放置測試樣品的樣品台。第一對中元件用於控制電子束偏轉，以使偏轉後的電子束偏離電子顯微鏡的鏡筒軸線第一距離；第二對中元件用於控制偏轉後的電子束再次偏轉，以使電子束與鏡筒軸線的距離小於預設距離；物鏡用於對電子束進行彙聚並作用於測試樣品，以產生返回電子信號，返回電子信號能量小於電子束能量；第二對中元件用於控制返回電子信號偏轉，以使返回電子信號偏離鏡筒軸線第二距離；探測器元件用於接收偏轉後的返回電子信號。本揭露實施例，實現了對返回電子信號的收集，避免了電子束品質的降低。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides an electronic detection device, an electronic signal detection method, and an electron microscope. The electronic detection device includes a first alignment element, a detector element, a second alignment element, an objective lens, and a sample stage for placing a test sample. The first alignment element controls the deflection of an electron beam such that the deflected electron beam deviates from the optical axis of the electron microscope by a first distance. The second alignment element further controls the deflected electron beam to deviate by less than a predetermined distance from the optical axis. The objective lens converges the electron beam and direct it onto the test sample to generate a return electron signal, the energy of which is lower than that of the electron beam. The second alignment element further controls the deflection of the return electron signal such that the return electron signal deviates from the optical axis by a second distance. The detector element receives the deflected return electron signal. According to the embodiments of the present disclosure, the return electron signal can be effectively collected while avoiding degradation of the electron beam quality.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電子探測裝置</p>  
        <p type="p">11:第一對中元件</p>  
        <p type="p">12:探測器元件</p>  
        <p type="p">13:第二對中元件</p>  
        <p type="p">14:物鏡</p>  
        <p type="p">15:樣品台</p>  
        <p type="p">101:第一場區</p>  
        <p type="p">102:第二場區</p>  
        <p type="p">121:探測器</p>  
        <p type="p">h&lt;sub&gt;1&lt;/sub&gt;:第一對中元件的有效長度</p>  
        <p type="p">h&lt;sub&gt;2&lt;/sub&gt;:第二對中元件的有效長度</p>  
        <p type="p">H&lt;sub&gt;1&lt;/sub&gt;:沿鏡筒軸線對稱分佈的第一對中元件之間的距離</p>  
        <p type="p">H&lt;sub&gt;2&lt;/sub&gt;:沿鏡筒軸線對稱分佈的第二對中元件之間的距離</p>  
        <p type="p">m:鏡筒軸線</p>  
        <p type="p">α:偏轉角度</p>  
        <p type="p">D:探測器距離鏡筒軸線的距離</p>  
        <p type="p">d&lt;sub&gt;1&lt;/sub&gt;:第一距離</p>  
        <p type="p">d&lt;sub&gt;2&lt;/sub&gt;:第二距離</p>  
        <p type="p">X,Y:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1877" publication-number="202613745"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613745.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613745</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132091</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用融合６自由度情境來最佳化機器人裝置</chinese-title>  
        <english-title>OPTIMIZING ROBOT DEVICES USING FUSED 6-DEGREES-OF-FREEDOM CONTEXT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251228B">G05D1/40</main-classification>  
        <further-classification edition="200601120251228B">A47L11/24</further-classification>  
        <further-classification edition="200601120251228B">G08C21/00</further-classification>  
        <further-classification edition="200601120251228B">G01C21/20</further-classification>  
        <further-classification edition="201701120251228B">G06T7/70</further-classification>  
        <further-classification edition="202401120251228B">G05D1/00</further-classification>  
        <further-classification edition="202201120251228B">G06V20/52</further-classification>  
        <further-classification edition="200601120251228B">B25J9/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特里維迪　尼薩格凱尤爾巴伊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRIVEDI, NISARG KEYURBHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤迪言</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TENG, DIYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓君生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JUNSHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　丹露</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, DANLU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於影像產生之技術及系統。例如，一程序可包括自一使用者裝置獲得遠端感測資訊，其中該遠端感測資訊包含6自由度(6DOF)軌跡資訊或存在資訊中之至少一者；自該機器人裝置獲得一環境地圖；基於該遠端感測資訊之一經判定偏移及旋轉而重新定向該遠端感測資訊；將該偏移及旋轉施用於該遠端感測資訊，以識別該環境地圖之包括偵測到的物體的部分；基於該環境地圖之包括該等偵測到的物體的該等部分而判定用於該機器人裝置之移動的候選區域；及輸出用於該機器人裝置之移動的該等候選區域以用於傳輸至該機器人裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques and systems are provided for image generation. For instance, a process can include obtaining remote sensing information from a user device, wherein the remote sensing information comprises at least one of 6-degrees-of-freedom (6DOF) trajectory information or presence information; obtaining an environment map from the robot device; reorienting the remote sensing information based on a determined offset and rotation for the remote sensing information; applying the offset and rotation to the remote sensing information to identify portions of the environment map that include detected objects; determining candidate areas for movement of the robot device based on the portions of the environment map that include the detected objects; and outputting the candidate areas for movement of the robot device for transmission to the robot device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:架構</p>  
        <p type="p">602:使用者裝置</p>  
        <p type="p">604:機器人清潔器</p>  
        <p type="p">606:感測引擎</p>  
        <p type="p">608:清潔控制器</p>  
        <p type="p">610:感測器</p>  
        <p type="p">612:時間</p>  
        <p type="p">614:使用者情境引擎</p>  
        <p type="p">616:環境地圖</p>  
        <p type="p">618:環境情境引擎</p>  
        <p type="p">620:地圖匹配引擎</p>  
        <p type="p">624:區域分類引擎</p>  
        <p type="p">628:清潔最佳化引擎</p>  
        <p type="p">626:地圖重疊引擎</p>  
        <p type="p">630:使用者回饋調適器</p>  
        <p type="p">632:使用者介面</p>  
        <p type="p">634:機器人回饋調適器</p>  
        <p type="p">636:環境地圖建構器</p>  
        <p type="p">638:地圖精化器</p>  
        <p type="p">640:清潔引擎</p>  
        <p type="p">642:清潔工具</p>  
        <p type="p">644:清潔用品</p>  
        <p type="p">646:運動致動器</p>  
        <p type="p">648:效能監測器</p>  
        <p type="p">650:多機器人協調器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1878" publication-number="202613594"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613594.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613594</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132112</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用具有通道跳頻的基於相位的測距的射頻識別測距</chinese-title>  
        <english-title>RADIO FREQUENCY IDENTIFICATION RANGING USING PHASE-BASED RANGING WITH CHANNEL HOPPING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01S13/82</main-classification>  
        <further-classification edition="200601120251201B">G06K7/10</further-classification>  
        <further-classification edition="200601120251201B">G01S13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西思考克　保羅多明尼克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HISCOCK, PAUL DOMINIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏克　約瑟夫派崔克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURKE, JOSEPH PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞葛拉瓦　蘇密特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGRAWAL, SUMIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂　生元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TU, SHENG-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於無線通訊的系統及技術。例如，一種程序可包括：判定對應於複數個載波頻率之間的複數個跳頻的一跳頻組態；及將一連續載波信號傳輸至一射頻識別(RFID)標籤，其中該連續載波信號包含在該複數個載波頻率中的各各別載波頻率上傳輸的一先導頻調。一種程序可包括從該RFID標籤接收一連續背向散射信號，該連續背向散射信號包括在該複數個載波頻率中的各各別載波頻率上傳輸的該先導頻調的一對應反射。一種程序可包括基於從該連續背向散射信號獲得的複數個測量來判定從一無線通訊裝置至該RFID標籤的一估計距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and techniques are provided for wireless communications. For example, a process can include determining a frequency hopping configuration corresponding to a plurality of frequency hops between a plurality of carrier frequencies, and transmitting a continuous carrier signal to a Radio Frequency Identification (RFID) tag, where the continuous carrier signal comprises a pilot tone transmitted on each respective carrier frequency of the plurality of carrier frequencies. A process can include receiving, from the RFID tag, a continuous backscatter signal including a corresponding reflection of the pilot tone transmitted on each respective carrier frequency of the plurality of carrier frequencies. A process can include determining an estimated distance from a wireless communication device to the RFID tag based on a plurality of measurements obtained from the continuous backscatter signal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600a:鏈路時序圖</p>  
        <p type="p">602:CW</p>  
        <p type="p">610:RFID讀取器</p>  
        <p type="p">615:查詢命令</p>  
        <p type="p">622:ACK</p>  
        <p type="p">626-1:查詢答覆</p>  
        <p type="p">626-2:否定ACK</p>  
        <p type="p">640:RFID標籤</p>  
        <p type="p">645:RN16訊息</p>  
        <p type="p">650:額外訊息</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1879" publication-number="202613016"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613016.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613016</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132125</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>工件的供給裝置以及工件的供給方法</chinese-title>  
        <english-title>WORKPIECE SUPPLYING APPARATUS AND WORKPIECE SUPPLYING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">B65H3/48</main-classification>  
        <further-classification edition="200601120251103B">B65H1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商維亞機械股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIA MECHANICS, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水惇生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, JUNKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簑島悠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MINOSHIMA, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保田晃弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBOTA, AKIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>増田充</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, MITSURU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種工件的供給裝置，能夠可靠地剝離在將堆疊的片狀的工件的最上部的一張工件抬起時因緊貼而一起被抬起的工件。一種工件的供給裝置，其包含：載置台，其堆疊載置片狀的工件；以及吸附頭，其吸附堆疊於載置台的最上部的工件並將其向上方抬起，該工件的供給裝置將最上部的工件向其他裝置供給，其中，工件的供給裝置包含噴射離子空氣的噴嘴，向被吸附頭抬起的狀態下的最上部的工件和與該工件緊貼的工件的端緣間斷地噴射離子空氣，將緊貼的工件剝離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a workpiece supplying apparatus capable of reliably separating a workpiece that is closely adhered and lifted together when an uppermost sheet-like workpiece of a stacked set of workpieces is lifted. The workpiece supplying apparatus comprises: a placing table on which sheet-like workpieces are stacked; and a suction head configured to attract and lift upward the uppermost workpiece stacked on the placing table, the workpiece supplying apparatus supplying the uppermost workpiece to another apparatus. The workpiece supplying apparatus further comprises a nozzle for ejecting ionized air, the nozzle intermittently ejecting ionized air toward an edge between the uppermost workpiece being lifted by the suction head and a closely adhered workpiece, thereby separating the closely adhered workpiece.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:吸附頭</p>  
        <p type="p">15:載置台</p>  
        <p type="p">17:噴嘴</p>  
        <p type="p">W:工件</p>  
        <p type="p">W1:工件</p>  
        <p type="p">W2:工件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1880" publication-number="202614521"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614521.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614521</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132130</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鎖模雷射檢測裝置及方法</chinese-title>  
        <english-title>MODE-LOCKING LASER DETECTION DEVICE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251001B">H01S3/1106</main-classification>  
        <further-classification edition="200601120251001B">H01S3/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞勝開發有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>A-WINS DEVELOPMENT CO. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>彰化縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳震偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHEN-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請為一種鎖模雷射檢測裝置，其包含有一分光模組、一第一反射模組及一第二反射模組。分光模組接收鎖模雷射，分光模組根據一分光比例處理鎖模雷射，以輸出一脈衝光波；第一反射模組接收脈衝光波，第一反射模組根據第一反射率反射脈衝光波，以得到一第一反射光波；第二反射模組接收脈衝光波，第二反射模組根據第二反射率反射脈衝光波，以得到一第二反射光波；第一反射光波之波長不同於第二反射光波之波長，藉以得到鎖模雷射的波長寬度。藉此，找出脈衝雷射的光譜寬度，以確認脈衝雷射的狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A mode-locking laser detection device, which comprises a splitter module, a first reflection module and a second reflection module. The splitter module receives the mode-locked laser, and the splitter module processes the mode-locked laser according to the ratio of one beam to output a pulse light wave; the first reflection module receives the pulse light wave, and the first reflection module reflects the pulse light wave according to a first reflectivity to obtain a first reflected light wave; the second reflection module receives the pulse light wave, and the second reflection module reflects the pulse light wave according to a second reflectivity to obtain a second reflected light wave; The first reflected light wave is different from the second reflected light wave, and a wavelength width of the mode-locked laser is obtained. Thus, the spectral width of the pulsed laser can be found to confirm the status of the pulsed laser.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100A:鎖模雷射檢測裝置</p>  
        <p type="p">200:脈衝雷射裝置</p>  
        <p type="p">1:鎖模雷射</p>  
        <p type="p">2:脈衝光波</p>  
        <p type="p">10:分光模組</p>  
        <p type="p">20:第一反射模組</p>  
        <p type="p">21:第一反射光波</p>  
        <p type="p">22:第一脈衝光波</p>  
        <p type="p">23:第一奈米狀結構</p>  
        <p type="p">30:第二反射模組</p>  
        <p type="p">31:第二反射光波</p>  
        <p type="p">32:第二脈衝光波</p>  
        <p type="p">33:第二奈米狀結構</p>  
        <p type="p">40:偵測器</p>  
        <p type="p">41:第一偵測訊號</p>  
        <p type="p">42:第二偵測訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1881" publication-number="202612973"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612973.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612973</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132215</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人力驅動車用之電池安裝構造及人力驅動車用之電池配接器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251231B">B62M6/90</main-classification>  
        <further-classification edition="202001120251231B">B62J9/00</further-classification>  
        <further-classification edition="202001120251231B">B62J11/00</further-classification>  
        <further-classification edition="202101120251231B">H01M50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福森毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUMORI, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤康信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, YASUNOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原孝彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIWARA, TAKAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大森實</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMORI, MINORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠藤晋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENDO, SUSUMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎陵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>静亮介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIZUKA, RYOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可將人力驅動車用之電池單元適切地安裝至車體的人力驅動車用之電池安裝構造及人力驅動車用之電池配接器。 &lt;br/&gt;本發明之人力驅動車用之電池安裝構造，其用以將人力驅動車之電池單元安裝至設置於人力驅動車之車體的電池支持部，電池支持部包含閂鎖，電池單元包含規定方向上之第1電池端部，第1電池端部包含與閂鎖卡合之閂鎖承接部，上述人力驅動車用之電池安裝構造具備解除構件，該解除構件以可相對於第1電池端部移動之方式安裝於第1電池端部，且用於解除閂鎖與閂鎖承接部之卡合，解除構件具有：解除構件安裝部，其將解除構件安裝至第1電池端部；及接觸部，其構成為與第1電池端部接觸，且於將閂鎖與閂鎖承接部之卡合解除之情形時包含解除構件之支點；接觸部係遠離解除構件安裝部而設置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">48:電池支持部</p>  
        <p type="p">50:第1電池支持部</p>  
        <p type="p">54:第1電池支持部本體</p>  
        <p type="p">54B:閂鎖收容部</p>  
        <p type="p">56:閂鎖</p>  
        <p type="p">58:閂鎖操作部</p>  
        <p type="p">70:電池安裝構造</p>  
        <p type="p">72A:第1電池端部</p>  
        <p type="p">90:電池配接器</p>  
        <p type="p">90A:配接器本體</p>  
        <p type="p">92:第1電池配接器</p>  
        <p type="p">96:第1配接器本體</p>  
        <p type="p">96C:凸部</p>  
        <p type="p">98:閂鎖承接部</p>  
        <p type="p">100:解除構件</p>  
        <p type="p">100A:解除構件軸心</p>  
        <p type="p">102A:接觸部支持部</p>  
        <p type="p">104B:接觸部</p>  
        <p type="p">108:操作部</p>  
        <p type="p">110:推壓部</p>  
        <p type="p">X21:高度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1882" publication-number="202614300"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614300.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614300</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132220</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電腦程式、資訊處理裝置及資訊處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251228B">H01L21/67</main-classification>  
        <further-classification edition="200601120251228B">G05B19/4155</further-classification>  
        <further-classification edition="202301120251228B">G06Q10/20</further-classification>  
        <further-classification edition="200601120251228B">G06F9/46</further-classification>  
        <further-classification edition="200601120251228B">G06F9/48</further-classification>  
        <further-classification edition="201901120251228B">G06F16/22</further-classification>  
        <further-classification edition="201901120251228B">G06F16/2455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鶴田俊寛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSURUTA, TOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供可在基板處理裝置中並行執行複數個維護之電腦程式、資訊處理裝置及資訊處理方法。 &lt;br/&gt;電腦程式使電腦執行以下處理：在受理用於使基板處理裝置執行複數個維護之指令時，判定是否能夠並行執行該複數個維護；在能夠並行執行該複數個維護時，使該基板處理裝置並行執行該複數個維護；在不能夠並行執行該複數個維護時，不並行執行該複數個維護，而執行該複數個維護內的任一個維護。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:資訊處理裝置</p>  
        <p type="p">2:基板處理裝置</p>  
        <p type="p">21:處理模組</p>  
        <p type="p">22:真空搬運腔室</p>  
        <p type="p">23:第一搬運機器人</p>  
        <p type="p">24:流量測定模組</p>  
        <p type="p">25:RF校正單元</p>  
        <p type="p">100:基板處理系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1883" publication-number="202614643"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614643.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614643</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132268</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於鄰近者上下文資訊及被動感測器資料之追蹤器裝置感測組態</chinese-title>  
        <english-title>TRACKER DEVICE SENSING CONFIGURATION BASED ON NEIGHBOR CONTEXT INFORMATION AND PASSIVE SENSOR DATA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251201B">H04W4/02</main-classification>  
        <further-classification edition="201801120251201B">H04W4/80</further-classification>  
        <further-classification edition="200601120251201B">G06K7/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索門　梅荷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOMAN, MEHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納拉亞南　沙尚克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARAYANAN, SHASHANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈亞爾　阿什溫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOYAL, ASHWIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫爾卡尼　拉什米</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KULKARNI, RASHMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供用於感測及裝置追蹤之系統及技術。例如，一程序可包括從複數個感測器獲得第一感測器資料，該複數個感測器用一第一感測器操作模式組態並包括在複數個追蹤器裝置之一追蹤器裝置中。可基於包括在該第一感測器資料中之被動感測資料來判定該追蹤器裝置之鄰近者上下文資訊，且該鄰近者上下文資訊可指示該追蹤器裝置相對於包括在該複數個追蹤器裝置中之一或多個額外追蹤器裝置之一布置。可回應於該鄰近者上下文資訊中之一或多個改變而針對該追蹤器裝置判定一經更新感測器操作模式，該經更新感測器操作模式與該第一感測器操作模式不同。可基於用該經更新感測器操作模式組態該追蹤器裝置，從該複數個感測器獲得第二感測器資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and techniques are provided for sensing and device tracking. For example, a process can include obtaining first sensor data from a plurality of sensors configured with a first sensor operation mode and included in a tracker device of a plurality of tracker devices. Neighbor context information can be determined for the tracker device based on passive sensing data included in the first sensor data, and can be indicative of a placement of the tracker device relative to one or more additional tracker devices included in the plurality of tracker devices. An updated sensor operation mode can be determined for the tracker device in response to one or more changes in the neighbor context information, the updated sensor operation mode different from the first sensor operation mode. Second sensor data can be obtained from the plurality of sensors based on configuring the tracker device with the updated sensor operation mode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:架構</p>  
        <p type="p">310:追蹤器裝置</p>  
        <p type="p">322:感測器資料</p>  
        <p type="p">326:感測器屬性組態資訊</p>  
        <p type="p">330:適應性上下文偵測(ACD)引擎</p>  
        <p type="p">332:鄰近者上下文偵測/鄰近者上下文偵測區塊</p>  
        <p type="p">334:掉落偵測</p>  
        <p type="p">336:運動上下文偵測</p>  
        <p type="p">338:感測器屬性重組態</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1884" publication-number="202613049"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613049.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613049</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132289</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>玻璃材料</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250903B">C03C3/064</main-classification>  
        <further-classification edition="200601120250903B">C03C3/066</further-classification>  
        <further-classification edition="200601120250903B">C03C3/068</further-classification>  
        <further-classification edition="200601120250903B">G02B1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商成都光明光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CDGM GLASS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛露路</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAO, LULU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>匡波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUANG, BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王友明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YOUMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種玻璃材料，其組分以重量百分比表示，含有：SiO&lt;sub&gt;2&lt;/sub&gt;：17-32%；B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;：18-32%；La&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;：7.5-23%；BaO：12-27.5%；SrO：2-15%。通過合理的組分設計，本發明獲得的玻璃材料具有較高的光透過率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1885" publication-number="202614301"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614301.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614301</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132316</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種用於熱退火設備的背側進氣組件及熱退火設備</chinese-title>  
        <english-title>BACKSIDE GAS INLET ASSEMBLY FOR THERMAL ANNEALING EQUIPMENT AND THERMAL ANNEALING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250903B">H01L21/67</main-classification>  
        <further-classification edition="200601120250903B">H01L21/324</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平林軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PING, LIN JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張吉初</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JI CHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種用於熱退火設備的背側進氣組件及熱退火設備，包括：反射板，用於向晶圓的背面反射晶圓發出的輻射能量；進氣組件，為透明材質並設置在反射板上且具有進氣內腔和出氣孔，出氣孔與進氣內腔連通；進入進氣內腔的惰性氣體在進氣內腔中分散後經出氣孔流向晶圓的背面。在使用上述的組件向晶圓的背面通氣時，惰性氣體會先流動至進氣內腔中並會擴散以降低氣壓和流速，以更小的氣壓和流速吹向晶圓，避免了晶圓發生偏移；惰性氣體在進氣內腔中擴散後會進入到出氣孔中，所以會更加均勻的吹掃晶圓的背面，使晶圓能更加均勻的被冷卻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a backside gas inlet assembly for a thermal annealing equipment and the thermal annealing equipment itself. The backside gas inlet assembly includes: a reflector, which is used to reflect a radiant energy emitted from a wafer toward a backside of the wafer; a gas inlet assembly, made of a transparent material and disposed on the reflector, having a gas inlet cavity and exhaust holes, with the exhaust holes communicating with the gas inlet cavity. Inert gas entering the gas inlet cavity is dispersed within the cavity and then flows through the exhaust holes toward the backside of the wafer. When using the aforementioned assembly to supply gas to the backside of the wafer, the inert gas first flows into the gas inlet cavity, where it diffuses to reduce both the gas pressure and the flow rate, and is then blown toward the wafer at a lower pressure and a lower flow rate, thereby preventing wafer displacement. After diffusing within the gas inlet cavity, the inert gas enters the exhaust holes, resulting in a more uniform purging of the wafer’s backside and enabling more even cooling of the wafer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:承載結構</p>  
        <p type="p">2:加熱光源</p>  
        <p type="p">3:晶圓</p>  
        <p type="p">4:石英透光板</p>  
        <p type="p">5:支撐結構</p>  
        <p type="p">6:側溫儀</p>  
        <p type="p">7:供氣管路</p>  
        <p type="p">8:反射板</p>  
        <p type="p">9:第一板體</p>  
        <p type="p">10:第二板體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1886" publication-number="202614898"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614898.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614898</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132321</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251201B">H10H29/39</main-classification>  
        <further-classification edition="202501120251201B">H10H29/856</further-classification>  
        <further-classification edition="202501120251201B">H10H29/49</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昭易</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SOYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張永仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, YOUNGIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李素榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SOYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金賢坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUNGON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南周炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAM, JUHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種顯示裝置，包括複數個子像素，該複數個子像素中的每一個包含：基板；驅動電晶體，設置在基板上；電源線，設置在基板上；反射電極，設置在驅動電晶體和電源線上，其中，反射電極包含彼此間隔開的第一反射電極和第二反射電極，第一反射電極電性連接到驅動電晶體，且第二反射電極電性連接到電源線；黏合層，設置在反射電極上；發光二極體，設置在黏合層上；第一平坦化層，設置在黏合層上，並包圍發光二極體的側邊緣的一部分；第一連接電極和第二連接電極，設置在第一平坦化層上且彼此間隔開；第二平坦化層，設置在第一平坦化層、第一連接電極和第二連接電極上；以及第三連接電極，設置在第二平坦化層上，其中，第一反射電極透過第一連接電極連接到發光二極體，並且其中，第二反射電極透過第二連接電極和第三連接電極連接到發光二極體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a display device, which comprises a plurality of sub-pixels, and each of the plurality of sub-pixels comprises: a substrate; a driving transistor disposed on the substrate; a power line disposed on the substrate; a reflective electrode disposed on the driving transistor and the power line, wherein the reflective relectrode comprises a first reflective electrode and a second reflective electrode spaced apart from each other, the first reflective electrode is electrically connected to the driving transistor, and the second reflective electrode is electrically connected to the power line; an adhesive layer disposed on the reflective electrode; a light emitting diode disposed on the adhesive layer; a first planarization layer disposed on the adhesive layer and enclosing a part of a side edge of the light emitting diode; a first connection electrode and a second connection electrode disposed on the first planarization layer and spaced apart from each other; a second planarization layer disposed on the first planarization layer, the first connection electrode and the second connection electrode; and a third connection electrode disposed on the second planarization layer, wherein the first reflective electrode is connected to the light emitting diode by the first connection electrode, and wherein the second reflective electrode is connected to the light emitting diode by the second connection electrode and the third connection electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:基板</p>  
        <p type="p">111:緩衝層</p>  
        <p type="p">112:閘極絕緣層</p>  
        <p type="p">113a:第一層間絕緣層</p>  
        <p type="p">113b:第二層間絕緣層</p>  
        <p type="p">114:鈍化層</p>  
        <p type="p">115:上覆層</p>  
        <p type="p">116:黏合層</p>  
        <p type="p">117a:第一平坦化層</p>  
        <p type="p">117b:第二平坦化層</p>  
        <p type="p">118:堤部</p>  
        <p type="p">119:第三平坦化層</p>  
        <p type="p">121:第一半導體層</p>  
        <p type="p">122:發光層</p>  
        <p type="p">123:第二半導體層</p>  
        <p type="p">124:第一電極</p>  
        <p type="p">125:第二電極</p>  
        <p type="p">126:鈍化膜</p>  
        <p type="p">ACT:主動層</p>  
        <p type="p">APA:點亮測試區</p>  
        <p type="p">APP1:第一點亮測試圖案</p>  
        <p type="p">APP2:第二點亮測試圖案</p>  
        <p type="p">CE1:第一連接電極</p>  
        <p type="p">CE3:第三連接電極</p>  
        <p type="p">CA1:第一接觸區</p>  
        <p type="p">CA2:第二接觸區</p>  
        <p type="p">CH1:第一接觸孔</p>  
        <p type="p">CH2:第二接觸孔</p>  
        <p type="p">CH3:第三接觸孔</p>  
        <p type="p">CH4:第四接觸孔</p>  
        <p type="p">CH5:第五接觸孔</p>  
        <p type="p">CH6:第六接觸孔</p>  
        <p type="p">CH7:第七接觸孔</p>  
        <p type="p">Cst:電容器</p>  
        <p type="p">Cst1:第一電容器電極</p>  
        <p type="p">Cst2:第二電容器電極</p>  
        <p type="p">DT:驅動電晶體</p>  
        <p type="p">DE:汲極電極</p>  
        <p type="p">GE:閘極電極</p>  
        <p type="p">LE:輔助電極</p>  
        <p type="p">LS:遮光層</p>  
        <p type="p">LED:發光二極體</p>  
        <p type="p">RE:反射電極</p>  
        <p type="p">RE1:第一反射電極</p>  
        <p type="p">RE2:第二反射電極</p>  
        <p type="p">SE:源極電極</p>  
        <p type="p">TM:中間電極</p>  
        <p type="p">VDD:電源線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1887" publication-number="202614779"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614779.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614779</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132323</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251209B">H10B63/00</main-classification>  
        <further-classification edition="202301120251209B">H10B61/00</further-classification>  
        <further-classification edition="200601120251209B">G11C11/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安炯祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, HYUNG-WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>島野拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秋山直紀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKIYAMA, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙亨峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, HYUNGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉野健一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINO, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種包含具有優異特性之開關元件之記憶裝置。 &lt;br/&gt;本發明之實施方式之記憶裝置具備下部配線10、上部配線20、以及包含可變電阻記憶元件40及開關元件50之記憶胞30。開關元件包含下部電極51、上部電極52、及設置於下部電極與上部電極之間之開關材料層53，上部電極包含第1層部分52a及第2層部分52b。開關材料層由含有Si、O及As之材料所形成，第1層部分由含有C之導電材料所形成，第2層部分由含有選自Ta、Ti、W、Ni、Mo、Cr、V、Zr、Al、Hf、In、Sn、Ru、Zn及Mg中之至少1種元素之導電材料所形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:下部配線</p>  
        <p type="p">20:上部配線</p>  
        <p type="p">30:記憶胞</p>  
        <p type="p">40:磁阻效應元件(可變電阻記憶元件)</p>  
        <p type="p">50:選擇器(開關元件)</p>  
        <p type="p">51:下部電極</p>  
        <p type="p">52:上部電極</p>  
        <p type="p">52a:第1層部分</p>  
        <p type="p">52b:第2層部分</p>  
        <p type="p">52c:第3層部分</p>  
        <p type="p">53:選擇器材料層(開關材料層)</p>  
        <p type="p">61:電極</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1888" publication-number="202614203"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614203.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614203</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132372</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法及基板處理裝置</chinese-title>  
        <english-title>SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">H01L21/306</main-classification>  
        <further-classification edition="200601120251218B">B05D1/02</further-classification>  
        <further-classification edition="200601120251218B">B05D7/24</further-classification>  
        <further-classification edition="200601120251218B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牧祐介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹松佑介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEMATSU, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仲野彰義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, AKIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>水上大乗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIZUKAMI, DAIJO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MINGJHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之基板處理方法包含：準備包含作為蝕刻對象之一例的矽層之基板，該蝕刻對象為矽及多晶矽中之至少一者；及藉由將作為高於室溫且提高了溶氧濃度之高溫氨水之一例的熱AOM供給至基板，而對矽層進行蝕刻。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate processing method includes preparing a substrate including a silicon layer, which is an example of an etching target that is at least one of silicon and polysilicon; and etching the etching target by supplying the substrate with hot AOM, which is an example of high-temperature ammonia water having a temperature higher than room temperature and an increased dissolved oxygen concentration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:矽層</p>  
        <p type="p">101:蝕刻終止層</p>  
        <p type="p">102:矽活性層</p>  
        <p type="p">105:自然氧化膜</p>  
        <p type="p">W:基板</p>  
        <p type="p">W1:第1矽晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1889" publication-number="202614327"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614327.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614327</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132425</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送設備</chinese-title>  
        <english-title>TRANSPORT FACILITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251220B">H01L21/677</main-classification>  
        <further-classification edition="200601120251220B">B65G43/08</further-classification>  
        <further-classification edition="202401120251220B">G05D1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大福股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIFUKU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤原遙介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIWARA, YOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種搬送設備4，具備有天花板搬送車1、地上搬送車2與搬送裝置3，在天花板搬送車1與搬送裝置3之間進行物品W的移交之移交部5，是相對於地板面200從地板面200遠離地配置於上側V1，在天花板搬送車1與地上搬送車2之間，可直接進行物品W的移交，在地上搬送車2與搬送裝置3之間，是透過天花板搬送車1及移交部5來進行物品W的移交。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transport facility 4 equipped with an overhead transport vehicle 1, a ground transport vehicle 2, and a transport device 3 includes a transfer section 5 for an article W to be transferred between the overhead transport vehicle 1 and the transport device 3, the transfer section 5 being on the upper side V1 of a floor surface 200 and separated from the floor surface 200. The overhead transport vehicle 1 and the ground transport vehicle 2 are configured to directly transfer an article W therebetween, and the ground transport vehicle 2 and the transport device 3 are configured to transfer an article W therebetween via the overhead transport vehicle 1 and the transfer section 5.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:天花板搬送車</p>  
        <p type="p">12:行走部</p>  
        <p type="p">18:支撐部</p>  
        <p type="p">2:地上搬送車</p>  
        <p type="p">3:樓層間搬送裝置(搬送裝置)</p>  
        <p type="p">31:升降機</p>  
        <p type="p">32:出入部</p>  
        <p type="p">4:搬送設備</p>  
        <p type="p">5:移交部</p>  
        <p type="p">30:搬送路徑(與天花板搬送車及地上搬送車不同之搬送路徑)</p>  
        <p type="p">100:天花板</p>  
        <p type="p">101:第1天花板</p>  
        <p type="p">102:第2天花板</p>  
        <p type="p">200:地板面</p>  
        <p type="p">201:第1地板面</p>  
        <p type="p">202:第2地板面</p>  
        <p type="p">H:路徑寬度方向</p>  
        <p type="p">V:上下方向</p>  
        <p type="p">V1:上側</p>  
        <p type="p">V2:下側</p>  
        <p type="p">W:物品</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1890" publication-number="202613516"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613516.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613516</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132428</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有可調整的測試力限制的材料測試機</chinese-title>  
        <english-title>MATERIAL TESTING MACHINES HAVING ADJUSTABLE TEST FORCE LIMITS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G01N3/08</main-classification>  
        <further-classification edition="200601120251230B">G01D3/08</further-classification>  
        <further-classification edition="200601120251230B">G05D15/00</further-classification>  
        <further-classification edition="200601120251230B">G01N3/04</further-classification>  
        <further-classification edition="200601120251230B">G01B21/16</further-classification>  
        <further-classification edition="200601120251230B">G05B1/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商伊利諾工具工程公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅因克二世　約翰Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEINCKE II, JOHN W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">所揭示的示例性材料測試系統包括：測試框架；底座，該底座經配置以夾持測試試樣上的第一位置；十字頭，該十字頭經配置以耦接至該測試試樣上的第二位置，並經致動以在材料測試期間將測試力傳遞至該測試試樣；致動器，該致動器經配置以沿該測試框架致動該十字頭並向該十字頭施加該測試力；以及控制電路系統，該控制電路系統經配置以：控制該致動器以經由該十字頭向試樣施加該測試力，使得該測試力不超過上限；以及當該十字頭與該底座之間的距離至少為閾值距離時，使該測試力的該上限自該十字頭與該底座之間的該距離小於該閾值距離時之該上限的值降低。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed example material testing systems include: a test frame; a base configured to grip a first position on a test specimen; a crosshead configured to be coupled to a second position on the test specimen, and to be actuated to transfer testing force to the test specimen during a material test; an actuator configured to actuate the crosshead along the test frame and to apply the testing force to the crosshead; and control circuitry configured to: control the actuator to apply the testing force to a specimen via the crosshead, such that the testing force does not exceed an upper limit; and while a distance between the crosshead and the base is at least a threshold distance, reduce the upper limit on the testing force from a value of the upper limit while the distance between the crosshead and the base is less than the threshold distance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:材料測試系統</p>  
        <p type="p">102:頂板</p>  
        <p type="p">104:底部底座</p>  
        <p type="p">106:導軌</p>  
        <p type="p">108:驅動軸桿</p>  
        <p type="p">110:螺紋</p>  
        <p type="p">114:驅動系統</p>  
        <p type="p">116:驅動馬達</p>  
        <p type="p">118:驅動滑輪</p>  
        <p type="p">120:從動滑輪</p>  
        <p type="p">122:計算裝置</p>  
        <p type="p">124:電源供應器</p>  
        <p type="p">126:控制電路系統</p>  
        <p type="p">128:十字頭</p>  
        <p type="p">130:驅動軸桿附件</p>  
        <p type="p">132:負載感測器</p>  
        <p type="p">134a:夾具</p>  
        <p type="p">134b:夾具</p>  
        <p type="p">136:試樣</p>  
        <p type="p">138:位置感測器</p>  
        <p type="p">140:閾值距離</p>  
        <p type="p">142:有限負載位置範圍</p>  
        <p type="p">144:閾值位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1891" publication-number="202613032"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613032.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613032</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132430</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>肥粒鐵系不鏽鋼箔</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">C01G1/02</main-classification>  
        <further-classification edition="200601120251218B">C22C38/18</further-classification>  
        <further-classification edition="201801120251218B">G01N23/2276</further-classification>  
        <further-classification edition="200601120251218B">B32B15/04</further-classification>  
        <further-classification edition="200601120251218B">C23C28/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日鐵化學材料股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石川典明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIKAWA, NORIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萩原快朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAGIWARA, YOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野裕人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNNO, HIROTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為提供兼備對於氧化被膜之上所形成之薄膜優異之密著性、與優異之電氣特性的肥粒鐵系不鏽鋼箔。藉由本揭示之肥粒鐵系不鏽鋼箔具備箔本體、與箔本體的表面上所形成之氧化被膜。箔本體係由肥粒鐵系不鏽鋼所構成。氧化被膜從氧化被膜的表面起，在深度方向，氧濃度之中間變化區域的厚度為3.0~10.0nm。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1892" publication-number="202613139"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613139.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613139</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132451</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>銅錯合物油墨的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">C07F1/08</main-classification>  
        <further-classification edition="200601120251222B">C09D5/24</further-classification>  
        <further-classification edition="200601120251222B">C07C211/03</further-classification>  
        <further-classification edition="200601120251222B">B05B1/02</further-classification>  
        <further-classification edition="200601120251222B">B22F9/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商住友金屬鑛山股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUMITOMO METAL MINING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>猪狩敦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGARI, ATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>半澤和樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANZAWA, KAZUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戸倉凜太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKURA, RINTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種銅錯合物油墨的製造方法，其能製造儲藏安定性優異，低體積電阻率且高平滑性之銅配線。 &lt;br/&gt;　　一種銅錯合物油墨的製造方法，其係包含通式(HCOO)&lt;sub&gt;2&lt;/sub&gt;Cu((CH&lt;sub&gt;3&lt;/sub&gt;)&lt;sub&gt;2&lt;/sub&gt;C(NH&lt;sub&gt;2&lt;/sub&gt;)CH&lt;sub&gt;2&lt;/sub&gt;OH)&lt;sub&gt;2&lt;/sub&gt;所示之銅錯合物的銅錯合物油墨的製造方法，其中包含攪拌步驟，該攪拌步驟係藉由薄膜迴旋法來攪拌Cu(HCOO)&lt;sub&gt;2&lt;/sub&gt;・4H&lt;sub&gt;2&lt;/sub&gt;O的粉末，與(CH&lt;sub&gt;3&lt;/sub&gt;)&lt;sub&gt;2&lt;/sub&gt;C(NH&lt;sub&gt;2&lt;/sub&gt;)CH&lt;sub&gt;2&lt;/sub&gt;OH的固形物或液狀物的混合物，前述混合物中之Cu(HCOO)&lt;sub&gt;2&lt;/sub&gt;・4H&lt;sub&gt;2&lt;/sub&gt;O與(CH&lt;sub&gt;3&lt;/sub&gt;)&lt;sub&gt;2&lt;/sub&gt;C(NH&lt;sub&gt;2&lt;/sub&gt;)CH&lt;sub&gt;2&lt;/sub&gt;OH的莫耳比為1：1.8~2.2。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1893" publication-number="202614148"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614148.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614148</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132453</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通用原子層蝕刻裝置與方法</chinese-title>  
        <english-title>UNIVERSAL ATOMIC LAYER ETCHING DEVICE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251121B">H01J37/32</main-classification>  
        <further-classification edition="200601120251121B">H01L21/67</further-classification>  
        <further-classification edition="200601120251121B">H01L21/3065</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商埃米時代技術公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLIED ANGSTROM TECHNOLOGY PTE LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　登亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, DENGLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世達</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種適用於各向同性及各向異性蝕刻的通用原子層蝕刻（ALE）裝置。該通用ALE裝置包含一個用於固定基板的承載台、一個包覆該承載台以內部密封基板的ALE腔室，以及一個配置為向ALE腔室供應等離子體的等離子體源。整合式淋浴頭位於承載台與等離子體源之間，將ALE腔室分隔為一個用於接收等離子體的第一腔室及一個用於向基板分布反應氣體的第二腔室。該整合式淋浴頭包括：具備至少一個第一進氣口以接收惰性氣體的第一階層；具備至少一個第二進氣口以接收反應氣體的第二階層；以及多個共用出氣口，用於直接向基板分布惰性氣體及反應氣體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a universal atomic layer etching (ALE) device suitable for isotropic and anisotropic etching. The universal ALE device includes a carrier for fixing a substrate, an ALE chamber covering the carrier to seal the substrate internally, and a plasma source configured to supply plasma to the ALE chamber. The integrated shower head is located between the carrier and the plasma source, and separates the ALE chamber into a first chamber for receiving plasma and a second chamber for distributing reactive gas to the substrate. The integrated shower head includes: a first layer having at least one first gas inlet for receiving an inert gas, a second layer having at least one second gas inlet for receiving a reactive gas, and a plurality of common gas outlets for directly distributing the inert gas and the reactive gas to the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:原子層蝕刻(ALE)裝置</p>  
        <p type="p">102:淋浴頭</p>  
        <p type="p">102A:頂側</p>  
        <p type="p">102B:底側</p>  
        <p type="p">104:等離子體源</p>  
        <p type="p">106:原子層蝕刻(ALE)腔室</p>  
        <p type="p">108:基板</p>  
        <p type="p">108A:第一側</p>  
        <p type="p">108B:第二側</p>  
        <p type="p">110:承載台</p>  
        <p type="p">112:離子通量控制器</p>  
        <p type="p">114:排氣口</p>  
        <p type="p">116:第一進氣口</p>  
        <p type="p">118:第二進氣口</p>  
        <p type="p">120:共用出氣口</p>  
        <p type="p">122:偏壓產生器</p>  
        <p type="p">124:射頻(RF)電源</p>  
        <p type="p">126:第一隔間</p>  
        <p type="p">128:第二隔間</p>  
        <p type="p">130:淋浴頭第一層級</p>  
        <p type="p">132:淋浴頭第二層級</p>  
        <p type="p">134:淋浴頭中心</p>  
        <p type="p">136:淋浴頭側面</p>  
        <p type="p">H:預定高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1894" publication-number="202612944"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612944.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612944</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132484</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>空氣清除碟式煞車主缸總成</chinese-title>  
        <english-title>AIR PURGING DISC BRAKE MASTER CYLINDER ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">B60T11/16</main-classification>  
        <further-classification edition="200601120251222B">B62L3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商福克斯制造有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOX FACTORY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝克　比爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BECKER, BILL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種空氣清除碟式煞車主缸總成。主缸儲槽外殼相對於碟式煞車主缸總成呈垂直定向。囊蓋構件固定至囊構件，而囊構件則收容於主缸儲槽外殼內。放氣螺孔設置在囊蓋構件中，以允許主缸儲槽外殼中積聚的氣泡逸散到大氣中。通氣孔亦設置在囊蓋構件中，以允許外部空氣直接連通於該囊構件內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An air purging disc brake master cylinder assembly is provided. A master cylinder reservoir housing is oriented vertically relative to the disc brake master cylinder assembly. A bladder cap member is secured to a bladder member and the bladder member is received within the master cylinder reservoir housing. A bleed threaded aperture is provided in the bladder cap member in order to allow accumulated air bubbles in the master cylinder reservoir housing to escape to the atmosphere. A vent hole is also provided in the bladder cap member allowing direct communication of outside air within the bladder member.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:碟式煞車主缸總成</p>  
        <p type="p">12:主缸儲槽外殼</p>  
        <p type="p">13:碟式煞車主缸主體</p>  
        <p type="p">14:囊系統總成</p>  
        <p type="p">16:煞車槓桿伸距調整螺絲</p>  
        <p type="p">18:煞車槓桿</p>  
        <p type="p">19:把手握把</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1895" publication-number="202613438"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613438.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613438</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132485</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於碟式煞車活塞密封件的跟座控制密封壓蓋</chinese-title>  
        <english-title>HEEL CONTROL SEAL GLAND FOR DISC BRAKE PISTON SEALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251222B">F16J15/32</main-classification>  
        <further-classification edition="200601120251222B">F16D65/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商福克斯制造有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOX FACTORY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝克　比爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BECKER, BILL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種具有一跟座控制密封壓蓋的碟式煞車。該碟式煞車包括一跟座控制密封壓蓋，其形成在一活塞孔中，其中該跟座控制密封壓蓋包括一窄壓蓋部分及一寬壓蓋部分。該碟式煞車進一步包括一活塞密封件，其耦接在該跟座控制密封壓蓋內。該活塞密封件的一跟座耦接在該窄壓蓋部分內。該窄壓蓋部分具有經定大小至該活塞密封件的該跟座寬度且具有額外空隙之一寬度。此外，該窄壓蓋部分的該寬度小於該寬壓蓋部分的該寬度。該跟座控制密封壓蓋控制該活塞密封件及該活塞在遠離該轉子的一方向上之軸向移動，該軸向移動係由該煞車轉子的翹曲施加一力在遠離該轉子的該活塞上而導致。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A disc brake with a heel control seal gland is provided. The disc brake includes a heel control seal gland formed in a piston bore, wherein the heel control seal gland includes a narrow gland portion and a wide gland portion. The disc brake further includes a piston seal coupled within the heel control seal gland. A heel of the piston seal is coupled within the narrow gland portion. The narrow gland portion has a width sized to the heel of the piston seal width with additional clearance. Also, the width of the narrow gland portion is less than the width of the wide gland portion. The heel control seal gland controls axial movement of the piston seal and the piston in a direction away from the rotor caused by warpage of the brake rotor applying a force on the piston away from the rotor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:碟式煞車</p>  
        <p type="p">12:內部分</p>  
        <p type="p">14:尾部煞車活塞；活塞</p>  
        <p type="p">15:活塞密封件</p>  
        <p type="p">16:前部活塞；活塞</p>  
        <p type="p">17:活塞密封件；密封件</p>  
        <p type="p">18:內煞車墊；煞車墊</p>  
        <p type="p">20:外部分</p>  
        <p type="p">24:尾部煞車活塞；活塞</p>  
        <p type="p">25:活塞密封件</p>  
        <p type="p">26:前部活塞；活塞；煞車墊</p>  
        <p type="p">27:活塞密封件</p>  
        <p type="p">28:外煞車墊；煞車墊</p>  
        <p type="p">30:正方形母壓蓋；密封壓蓋</p>  
        <p type="p">60:煞車轉子；轉子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1896" publication-number="202613426"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613426.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613426</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132486</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>單塊碟式煞車卡鉗</chinese-title>  
        <english-title>MONOBLOCK DISC BRAKE CALIPER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">F16D55/22</main-classification>  
        <further-classification edition="200601120251231B">F16D65/14</further-classification>  
        <further-classification edition="200601120251231B">F16D65/18</further-classification>  
        <further-classification edition="200601120251231B">B62L1/02</further-classification>  
        <further-classification edition="200601120251231B">B60T1/06</further-classification>  
        <further-classification edition="201201320251231B">F16D121/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商福克斯制造有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOX FACTORY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝克　比爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BECKER, BILL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種單塊碟式煞車卡鉗。該單塊碟式煞車卡鉗包括一內部分、一外部分、及一交越部分，該交越部分形成在該內部分與該外部分之間。該內部分、該外部分、及該交越部分經形成為一單一的一體式本體。該單塊碟式煞車卡鉗進一步包括一轉移埠孔隙，其形成在該交越部分中，位於該單塊碟式煞車卡鉗的一中心線處。該單塊碟式煞車卡鉗進一步包括一內轉移埠，其從該轉移埠孔隙延伸至一內活塞孔；及一外轉移埠，其從該轉移埠孔隙延伸至一外活塞孔。該單塊碟式煞車卡鉗進一步包括一轉移埠塞，該塞耦接至該轉移埠孔隙以使用一單一塞密封該等轉移埠。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A monoblock disc brake caliper is provided. The monoblock disc brake caliper includes an inner portion, an outer portion, and a crossover portion formed between the inner portion and the outer portion. The inner portion, the outer portion and the crossover portion are formed as a single, unitary body. The monoblock disc brake caliper further includes a transfer port aperture formed in the crossover portion located at a centerline of the monoblock disc brake caliper. The monoblock disc brake caliper further includes an inner transfer port extending from the transfer port aperture to an inner piston bore and an outer transfer port extending from the transfer port aperture to an outer piston bore. The monoblock disc brake caliper further includes a transfer port plug that is coupled to the transfer port aperture to seal the transfer ports with a single plug.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:單塊碟式煞車卡鉗；卡鉗</p>  
        <p type="p">12:交越部分</p>  
        <p type="p">20:內部分</p>  
        <p type="p">21:煞車線孔隙</p>  
        <p type="p">30:外部分</p>  
        <p type="p">31:洩放器孔隙</p>  
        <p type="p">50:煞車線</p>  
        <p type="p">52:洩放器螺釘</p>  
        <p type="p">60:方向</p>  
        <p type="p">62:方向箭頭</p>  
        <p type="p">63:方向</p>  
        <p type="p">64:方向</p>  
        <p type="p">66:方向</p>  
        <p type="p">67:方向</p>  
        <p type="p">70:轉移埠塞</p>  
        <p type="p">80:轉子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1897" publication-number="202613427"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613427.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613427</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132487</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>碟式煞車卡鉗本體的結構肋</chinese-title>  
        <english-title>STRUCTURAL RIB FOR A DISC BRAKE CALIPER BODY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">F16D55/22</main-classification>  
        <further-classification edition="200601120251231B">F16D65/14</further-classification>  
        <further-classification edition="200601120251231B">F16D65/18</further-classification>  
        <further-classification edition="200601120251231B">B62L1/02</further-classification>  
        <further-classification edition="200601120251231B">B60T1/06</further-classification>  
        <further-classification edition="201201320251231B">F16D121/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商福克斯制造有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOX FACTORY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝克　比爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BECKER, BILL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種具有一結構肋的碟式煞車卡鉗。該碟式煞車卡鉗包括一碟式煞車卡鉗本體，該碟式煞車卡鉗本體具有一前部安裝凸座及一尾部安裝凸座。該碟式煞車卡鉗本體經組態以耦接在一車輛的一轉子上方。該碟式煞車本體亦包括一結構肋，其在相鄰於該碟式煞車卡鉗本體的一尾部活塞部分的一位置中從該尾部安裝凸座延伸至該碟式煞車卡鉗本體。在使用中，該碟式煞車卡鉗可耦接至一車輛的一轉子。回應於在轉子旋轉期間啟動該碟式煞車，相較於不具有一結構肋的一碟式煞車卡鉗，具有結構肋的該碟式煞車卡鉗減少該碟式煞車卡鉗本體的該內尾部活塞部分的偏轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A disc brake caliper with a structural rib is provided. The disc brake caliper includes a disc brake caliper body having a leading mounting boss and a trailing mounting boss. The disc brake caliper body is configured to couple over a rotor of a vehicle. The disc brake body also includes a structural rib extending from the trailing mounting boss to the disc brake caliper body in a location adjacent to a trailing piston portion of the disc brake caliper body. In use, the disc brake caliper may be coupled to a rotor of a vehicle. In response to activating the disc brake during rotation of the rotor the disc brake caliper with structural rib reduces deflection of the inner trailing piston portion of the disc brake caliper body in comparison to a disc brake caliper without a structural rib.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:煞車卡鉗</p>  
        <p type="p">102:煞車卡鉗本體</p>  
        <p type="p">104:前部安裝凸座</p>  
        <p type="p">108:結構肋</p>  
        <p type="p">112:尾部安裝托架</p>  
        <p type="p">114:前部活塞部分；前部活塞</p>  
        <p type="p">116:尾部活塞部分；尾部活塞</p>  
        <p type="p">120:轉子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1898" publication-number="202612833"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612833.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612833</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132498</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於大面積鍵合的雷射輔助鍵合裝置和方法</chinese-title>  
        <english-title>LASER ASSISTED BONDING DEVICE AND METHOD FOR LARGE AREA BONDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251230B">B23K26/21</main-classification>  
        <further-classification edition="201401120251230B">B23K26/06</further-classification>  
        <further-classification edition="201401120251230B">B23K26/70</further-classification>  
        <further-classification edition="200601120251230B">H01L21/67</further-classification>  
        <further-classification edition="200601120251230B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商星科金朋私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴鍾贊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JONGCHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安忠烈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AHN, CHUNGLYUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李泰根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, TAEKEUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種雷射輔助鍵合裝置，其包括：雷射發射器陣列，其具有多個雷射發射器單元，其中所述雷射發射器單元中的每一者可操作以獨立於其它雷射發射器單元而接通或斷開，使得所述雷射發射器陣列能夠發射具有可控束形狀的雷射光束；載體，其用於放置基板，電子元件安置在所述基板上並且將經由焊料材料鍵合到所述基板上；轉移機構，其用於相對於所述載體移動所述雷射發射器陣列；以及控制器，其電耦接到所述轉移機構以控制所述雷射發射器陣列相對於所述載體的移動，並且電耦接到所述雷射發射器陣列以在所述電子元件經由所述焊料材料鍵合到所述基板上時以用於所述焊料材料的可控功率分佈將所述雷射光束照射到所述基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:雷射輔助鍵合裝置</p>  
        <p type="p">102:雷射發射器陣列</p>  
        <p type="p">104:載體</p>  
        <p type="p">106:基板</p>  
        <p type="p">108:雷射光束</p>  
        <p type="p">109:最大雷射功率區</p>  
        <p type="p">110:轉移機構</p>  
        <p type="p">112:控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1899" publication-number="202614463"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614463.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614463</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132507</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非水系鹼金屬蓄電元件、及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201001120251226B">H01M10/05</main-classification>  
        <further-classification edition="201001120251226B">H01M10/0567</further-classification>  
        <further-classification edition="200601120251226B">H01M10/42</further-classification>  
        <further-classification edition="201001120251226B">H01M4/13</further-classification>  
        <further-classification edition="200601120251226B">H01M4/36</further-classification>  
        <further-classification edition="201001120251226B">H01M10/058</further-classification>  
        <further-classification edition="202101120251226B">H01M50/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平川雄一朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAKAWA, YUICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之非水系鹼金屬蓄電元件（前驅體），係包含正極（前驅體）、負極（前驅體）、分隔件、外裝材料及非水系電解液之非水系鹼金屬蓄電元件（前驅體）；且負極（前驅體）係含有吸藏釋放鋰離子之材料作為活性物質；正極（前驅體），係具有含有吸藏釋放鹼金屬離子之正極活性物質之正極活性物質層。非水系鹼金屬蓄電元件（前驅體），係將鹼金屬碳酸鹽含有於正極活性物質層、抑或正極活性物質層與分隔件之間之任意中間層、或此等雙方中；非水系電解液係進一步含有碳酸鹽分解促進劑；碳酸鹽分解促進劑之氧化起始電位，係3.8V（vs Li/Li&lt;sup&gt;+&lt;/sup&gt;）以上且4.7V以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:正極</p>  
        <p type="p">10:集電箔露出端子部</p>  
        <p type="p">2:負極</p>  
        <p type="p">3:分隔件(5.5cm×10.5cm)</p>  
        <p type="p">4:Li參考電極</p>  
        <p type="p">412:附分隔件之Li參考電極</p>  
        <p type="p">5:Li箔</p>  
        <p type="p">6:SUS箔</p>  
        <p type="p">7:Ni箔</p>  
        <p type="p">8:超音波熔接部</p>  
        <p type="p">9:樹脂膠帶</p>  
        <p type="p">12:分隔件(5.5cm×5.5cm)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1900" publication-number="202614414"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614414.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614414</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132529</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合體、接合體之製造方法、感光性樹脂組成物及半導體器件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">H01L23/485</main-classification>  
        <further-classification edition="200601120251222B">H01L21/768</further-classification>  
        <further-classification edition="201901120251222B">B32B7/05</further-classification>  
        <further-classification edition="200601120251222B">H01L23/532</further-classification>  
        <further-classification edition="200601120251222B">C08G73/10</further-classification>  
        <further-classification edition="200601120251222B">C08F2/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下広祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種接合體、接合體之製造方法、接合體之製造方法中所使用之感光性樹脂組成物及包含上述接合體之半導體器件，上述接合體藉由接合第1構件和第2構件而成，上述第1構件具有：第1基材；第1絕緣圖案，配置於上述第1基材上；及第1導電圖案，存在於上述第1絕緣圖案的圖案之間，上述第2構件具有：第2基材；第2絕緣圖案，配置於上述第2基材上；及第2導電圖案，存在於上述第2絕緣圖案的圖案之間，上述接合體作為上述第1導電圖案包含第1導電圖案的與第1基材相反的一側的表面的面積大於從上述表面至深度500nm的位置處的第1導電圖案的面積之第1導電圖案。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1901" publication-number="202614183"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614183.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614183</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132572</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於包括低K介電材料之半導體裝置的切割方法</chinese-title>  
        <english-title>DICING METHOD FOR SEMICONDUCTOR DEVICES INCLUDING LOW-K DIELECTRIC MATERIALS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251020B">H01L21/301</main-classification>  
        <further-classification edition="200601120251020B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＱＯＲＶＯ美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QORVO US, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>切特里　克里希納　巴哈杜爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHETRY, KRISHNA BAHADUR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡羅爾　邁克爾　斯科特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARROLL, MICHAEL SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之一態樣係關於用於包括低K介電材料之半導體裝置的切割方法。該切割方法包括提供一基板，其具有安置在該基板上方之一介電層堆疊。在一些實施例中，該方法進一步包括自一切割道區域移除該介電層堆疊以形成暴露該基板之一表面之一溝槽。在一些實施例中，該方法進一步包括利用一矽層填充該溝槽。在一些實施例中，該方法進一步包括在執行一凸塊製程程序(bumping process)之後，移除該矽層及該基板之安置於該切割道區域中之一部分以使一晶粒自該基板單體化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">One aspect of the present disclosure pertains to dicing methods for semiconductor devices including low-K dielectric materials. The dicing method includes providing a substrate having a stack of dielectric layers disposed over the substrate. In some embodiments, the method further includes removing the stack of dielectric layers from a dicing street region to form a trench that exposes a surface of the substrate. In some embodiments, the method further includes filling the trench with a silicon layer. In some embodiments, the method further includes after performing a bumping process, removing the silicon layer and a portion of the substrate disposed in the dicing street region to singulate a die from the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1902" publication-number="202612872"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612872.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612872</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132653</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機械手</chinese-title>  
        <english-title>ROBOT HAND</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B25J15/08</main-classification>  
        <further-classification edition="200601120251231B">B25J9/10</further-classification>  
        <further-classification edition="200601120251231B">B25J15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日本國立大學法人大阪大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE UNIVERSITY OF OSAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬偉偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAN, WEIWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原田研介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARADA, KENSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張竣博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JUNBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明在於實現一種能夠適應各種尺寸物體的機械手。 本發明之機械手（100）具有第一齒條小齒輪機構（241）和第二齒條小齒輪機構（242），其中該第二齒條小齒輪機構的該第一齒條部（R2-1）固定至該第一齒條小齒輪機構的小齒輪部（G1），該第二齒條小齒輪機構的小齒輪部（G2）固定至該第一齒條小齒輪機構的第二齒條部（R1-2）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基座(底座)</p>  
        <p type="p">20-1:夾持機構</p>  
        <p type="p">20-2:夾持機構</p>  
        <p type="p">23-1:夾持部</p>  
        <p type="p">23-2:夾持部</p>  
        <p type="p">30:驅動部</p>  
        <p type="p">100:機械手</p>  
        <p type="p">212b(212):第二區塊構件(第二線性滑塊)</p>  
        <p type="p">213b(213):第三區塊構件(第三線性滑塊)</p>  
        <p type="p">221(22):第一框架(框架部)</p>  
        <p type="p">222(22):第二框架(框架部)</p>  
        <p type="p">223(22):第三框架(框架部)</p>  
        <p type="p">224(22):第四框架(框架部)</p>  
        <p type="p">R1-1,R2-1:第一齒條部</p>  
        <p type="p">R1-2,R2-2:第二齒條部</p>  
        <p type="p">G1,G2:小齒輪部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1903" publication-number="202614394"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614394.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614394</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132719</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有順應式特徵的整合裝置封裝蓋</chinese-title>  
        <english-title>INTEGRATED DEVICE PACKAGE LIDS WITH COMPLIANT FEATURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L23/31</main-classification>  
        <further-classification edition="200601120251230B">B81B7/04</further-classification>  
        <further-classification edition="200601120251230B">F16F15/04</further-classification>  
        <further-classification edition="200601120251230B">H01L23/36</further-classification>  
        <further-classification edition="200601120251230B">H01L21/56</further-classification>  
        <further-classification edition="200601120251230B">H01L23/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德　洛斯　埃羅斯　貝溫薩　路易斯　愛德華多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DE LOS HEROS BEUNZA, LUIS EDUARDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡斯蒂略　查孔　胡利安　愛德華多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CASTILLO CHACON, JULIAN EDUARDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CO</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅格曼　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROGGEMAN, BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種整合裝置封裝包括一基材及耦接至該基材的一晶粒。該整合裝置封裝亦包括耦接至該晶粒的一熱界面材料，及耦接至該基材及該熱界面材料的一蓋。該蓋包括一一體式本體，該一體式本體包括界定該一體式本體的一晶粒接觸區的一或多個開口及該一體式本體的一或多個順應式部件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated device package includes a substrate and a die coupled to the substrate. The integrated device package also includes a thermal interface material coupled to the die, and a lid coupled to the substrate and to the thermal interface material. The lid includes a unitary body that includes one or more openings that define a die contact area of the unitary body and one or more compliant members of the unitary body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:蓋</p>  
        <p type="p">102:晶粒接觸區</p>  
        <p type="p">104:基材接觸區</p>  
        <p type="p">106A:順應式部件</p>  
        <p type="p">106B:順應式部件</p>  
        <p type="p">106C:順應式部件</p>  
        <p type="p">106D:順應式部件</p>  
        <p type="p">108A:開口</p>  
        <p type="p">108B:開口</p>  
        <p type="p">108C:開口</p>  
        <p type="p">108D:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1904" publication-number="202614415"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614415.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614415</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132729</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合體之製造方法、半導體構件之製造方法、感光性樹脂組成物、接合體、半導體構件及樹脂組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L23/485</main-classification>  
        <further-classification edition="200601120251230B">H01L21/768</further-classification>  
        <further-classification edition="200601120251230B">H01L21/304</further-classification>  
        <further-classification edition="201901120251230B">B32B7/05</further-classification>  
        <further-classification edition="200601120251230B">H01L23/532</further-classification>  
        <further-classification edition="200601120251230B">G03F7/037</further-classification>  
        <further-classification edition="200601120251230B">C08F2/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下広祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種接合體之製造方法、接合體以及感光性樹脂組成物，前述接合體之製造方法為接合具備第1基材、存在於前述第1基材上之第1樹脂圖案及導通前述第1樹脂圖案之間的區域之第1導電圖案之第1積層體和具備第2基材、存在於前述第2基材上之第2絕緣圖案及導通前述第2絕緣圖案之間的區域之第2導電圖案之第2積層體之接合體之製造方法，並且包括特定步驟，前述第1積層體中的前述第1樹脂圖案在260℃下的壓入彈性模數為2.0GPa以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:第1基材</p>  
        <p type="p">100a:矽晶圓</p>  
        <p type="p">100b:SiO2層</p>  
        <p type="p">102:第1樹脂圖案</p>  
        <p type="p">104:第1晶種層</p>  
        <p type="p">106:第1導電圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1905" publication-number="202614359"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614359.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614359</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132737</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合體之製造方法、接合體、感光性樹脂組成物及半導體構件之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/768</main-classification>  
        <further-classification edition="200601120251226B">H01L23/485</further-classification>  
        <further-classification edition="200601120251226B">H01L21/311</further-classification>  
        <further-classification edition="200601120251226B">H01L21/304</further-classification>  
        <further-classification edition="200601120251226B">G03F7/037</further-classification>  
        <further-classification edition="200601120251226B">C08G73/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山下広祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMASHITA, KOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種接合體之製造方法、感光性樹脂組成物及半導體構件之製造方法， &lt;br/&gt;前述接合體之製造方法為藉由接合具備第1基材、存在於前述第1基材上的至少一部分的表面上之第1絕緣圖案及導通前述第1絕緣圖案之間的區域之第1導電圖案之第1積層體和具備第2基材、存在於前述第2基材上的至少一部分的表面上之第2絕緣圖案及導通前述第2絕緣圖案之間的區域之第2導電圖案之第2積層體而成之接合體之製造方法，並且以特定的順序包括導電層形成步驟、研磨步驟及加熱步驟，前述感光性樹脂組成物用於形成前述第1絕緣圖案，前述半導體構件之製造方法包括前述接合體之製造方法作為步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基材</p>  
        <p type="p">2a:矽晶圓</p>  
        <p type="p">2b:SiO&lt;sub&gt;2&lt;/sub&gt;層</p>  
        <p type="p">2:基材</p>  
        <p type="p">4:絕緣圖案</p>  
        <p type="p">6:導電圖案</p>  
        <p type="p">10:膜</p>  
        <p type="p">12:孔圖案</p>  
        <p type="p">14:第1前驅圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1906" publication-number="202614753"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614753.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614753</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132760</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H10B12/10</main-classification>  
        <further-classification edition="200601120251201B">G11C11/401</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宣姃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SUN JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳相赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, SANG HYEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭丞眞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, SEUNG JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李道仙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, DO SUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體記憶體裝置包括：位元線，在第一方向上延伸；第一通道圖案，在位元線的上表面上；第二通道圖案，在位元線的上表面上；第一字元線，在第二方向上延伸；第二字元線，在第二方向上延伸；第一電容器和第二電容器，分別連接到第一通道圖案和第二通道圖案；第一閘極絕緣圖案；第二閘極絕緣圖案；第一釕結構，在第一通道圖案和第一電容器之間；以及第二釕結構，在第二通道圖案和第二電容器之間，其中第一閘極絕緣圖案的最上表面設置成其上未設置第一釕結構，以及第二閘極絕緣圖案的最上表面設置成其上未設置第二釕結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor memory device includes a bitline extending in a first direction; a first channel pattern on an upper surface of the bitline; a second channel pattern on the upper surface of the bitline; a first wordline extending in a second direction; a second wordline extending in the second direction; a first capacitor and a second capacitor connected to the first channel pattern and the second channel pattern, respectively; a first gate insulating pattern ; a second gate insulating pattern ; a first ruthenium structure between the first channel pattern and the first capacitor; and a second ruthenium structure between the second channel pattern and the second capacitor, wherein an uppermost surface of the first gate insulating pattern is provided without the first ruthenium structure provided thereon, and an uppermost surface of the second gate insulating pattern is provided without the second ruthenium structure provided thereon.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A-A,B-B,C-C,D-D:線</p>  
        <p type="p">AP1:第一通道圖案/通道圖案</p>  
        <p type="p">AP2:第二通道圖案/通道圖案</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">DSP:資料儲存圖案</p>  
        <p type="p">LP:著陸接墊</p>  
        <p type="p">WL1:第一字元線/字元線</p>  
        <p type="p">WL2:第二字元線/字元線</p>  
        <p type="p">WLa:第一部分</p>  
        <p type="p">WLb:第二部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1907" publication-number="202614508"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614508.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614508</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132766</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電連接器</chinese-title>  
        <english-title>ELECTRICAL CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250912B">H01R13/642</main-classification>  
        <further-classification edition="201101120250912B">H01R13/6461</further-classification>  
        <further-classification edition="200601120250912B">H01R13/631</further-classification>  
        <further-classification edition="200601120250912B">H01R13/652</further-classification>  
        <further-classification edition="200601120250912B">H01R13/40</further-classification>  
        <further-classification edition="201101120250912B">H01R12/72</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商東莞立訊技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚坤磷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, KUNLIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宏基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HONGJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾晨輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, CHENHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁雙峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, SHUANGFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電連接器包括第一殼體、第一端子模組以及第一保護塊。前述第一殼體設有第一收容插槽以及第一安裝開口。前述第一端子模組包括複數第一導電端子。每一個第一導電端子包括第一接觸部以及第一末端部。前述第一保護塊至少部分設置於前述第一安裝開口中。前述第一保護塊設有第一容納槽，前述第一末端部位於前述第一容納槽中。前述第一保護塊配置為被前述對接模組抵接而向遠離前述第一收容插槽移動。本發明能夠藉由縮短前述第一末端部的長度來改善諧振。另，本發明降低了前述第一末端部在其長度縮短後，容易被異物插壞的風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical connector includes a first housing, a first terminal module, and a first protective block. The first housing defines a first receiving slot and a first mounting opening. The first terminal module includes a plurality of first conductive terminals. Each first conductive terminal includes a first contact portion and a first end portion. The first protective block is at least partially disposed in the first mounting opening. The first protective block is provided with a first accommodating groove in which the first end portion is located. The first protective block is configured to be abutted by a mating module to move away from the first receiving slot. The present invention is able to improve resonance by shortening a length of the first end portion. Besides, the present invention also reduces the risk of the first end portion being easily damaged by foreign objects after its length is shortened.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:第一保護塊</p>  
        <p type="p">211:第一容納槽</p>  
        <p type="p">213:第一導引面</p>  
        <p type="p">22:第二保護塊</p>  
        <p type="p">223:第二導引面</p>  
        <p type="p">300:對接模組</p>  
        <p type="p">310:第一彈性接觸臂</p>  
        <p type="p">3102:第一末端部</p>  
        <p type="p">320:第二彈性接觸臂</p>  
        <p type="p">416:第一抵接彈片</p>  
        <p type="p">426:第二抵接彈片</p>  
        <p type="p">G:圖20中畫框部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1908" publication-number="202613065"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613065.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613065</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132828</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物、聚合物、組成物、膜形成用組成物、圖型形成方法、絕緣膜之形成方法及化合物之製造方法，以及含有碘之乙烯基聚合物及其乙醯化衍生物之製造方法</chinese-title>  
        <english-title>COMPOUND, POLYMER, COMPOSITION, FILM-FORMING COMPOSITION, METHOD FOR FORMING PATTERN, METHOD FOR FORMING INSULATING FILM AND METHOD FOR PRODUCING COMPOUND, AND METHOD FOR PRODUCING IODINE-CONTAINING VINYL POLYMER AND ACETYLATED DERIVATIVE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07C17/35</main-classification>  
        <further-classification edition="200601120260102B">C07C25/24</further-classification>  
        <further-classification edition="200601120260102B">C07C37/00</further-classification>  
        <further-classification edition="200601120260102B">C07C37/62</further-classification>  
        <further-classification edition="200601120260102B">C07C39/27</further-classification>  
        <further-classification edition="200601120260102B">C07C39/373</further-classification>  
        <further-classification edition="200601120260102B">C07C45/63</further-classification>  
        <further-classification edition="200601120260102B">C07C49/825</further-classification>  
        <further-classification edition="200601120260102B">C07C67/08</further-classification>  
        <further-classification edition="200601120260102B">C07C69/157</further-classification>  
        <further-classification edition="200601120260102B">C07C69/712</further-classification>  
        <further-classification edition="200601120260102B">C07C69/96</further-classification>  
        <further-classification edition="200601120260102B">C08F12/16</further-classification>  
        <further-classification edition="200601120260102B">G03F7/039</further-classification>  
        <further-classification edition="200601120260102B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大松禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OMATSU, TADASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>片岡健太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATAOKA, KENTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本正裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, MASAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新美結士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIIMI, YUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牧野嶋高史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKINOSHIMA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>越後雅敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ECHIGO, MASATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供可獲得曝光靈敏度優異之阻劑之化合物、聚合物、組成物、阻劑組成物、圖型形成方法、絕緣膜之形成方法及化合物之製造方法。提供不需要高價的試劑、嚴苛的條件，並以高產率製造含有碘之乙烯基聚合物(含有碘之羥基苯乙烯)及其乙醯化衍生物之方法。一種化合物，其係具有一個以上之鹵素，及一個以上之親水性基或一個分解性基，及不飽和雙鍵。一種前述含有碘之乙烯基單體之製造方法，其係包含下述a)及b)步驟，a)準備具有式(1-1)所表示之一般結構之含有碘之醇性基質之步驟： &lt;br/&gt;&lt;img align="absmiddle" height="318px" width="304px" file="ed10251.JPG" alt="ed10251.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式(1-1)中之可變區之定義係如同說明書之記載。)；及 &lt;br/&gt;　　b)將前述含有碘之醇性基質脫水，獲得具有式(1)所表示之一般結構之含有碘之乙烯基單體之步驟： &lt;br/&gt;&lt;img align="absmiddle" height="305px" width="252px" file="ed10252.JPG" alt="ed10252.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式(1)中之可變區之定義係如同說明書之記載。)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Compound with which a resist with excellent exposure sensitivity can be obtained, polymer, composition, resist composition, method for forming pattern, method for forming insulating film and method for producing compound are provided. A method for producing iodine-containing vinyl polymer (iodine-containing hydroxystyrene) and its acetylated derivative with high yield without high price reagents and harsh conditions is provided. A compound has more than one halogen, more than one hydrophilic group or a decomposable group, and an unsaturated double bond. A method for producing an iodine-containing vinyl monomer comprises the following steps a) and b): a) a step of preparing an iodine-containing alcoholic matrix with the general structure represented by formula (1-1): &lt;br/&gt;&lt;img align="absmiddle" height="270px" width="252px" file="ed10253.JPG" alt="ed10253.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; &lt;br/&gt;(The definition of the variables in formula (1-1) is as described in the specification.); and &lt;br/&gt;b) a step of dehydrating the aforementioned iodine-containing alcoholic matrix to obtain the iodine-containing vinyl monomer with the general structure represented by formula (1): &lt;br/&gt;&lt;img align="absmiddle" height="277px" width="231px" file="ed10254.JPG" alt="ed10254.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; &lt;br/&gt;(The definition of the variables in formula (1) is as described in the specification.)</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1909" publication-number="202613486"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613486.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613486</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132851</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>整合式地面載具軟殺系統</chinese-title>  
        <english-title>INTEGRATED GROUND VEHICLE SOFT KILL SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">F41H11/02</main-classification>  
        <further-classification edition="200601120251222B">G01P3/481</further-classification>  
        <further-classification edition="201101120251222B">A01M29/10</further-classification>  
        <further-classification edition="202401320251222B">G05D109/20</further-classification>  
        <further-classification edition="202401320251222B">G05D109/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＢＡＥ系統資訊及電子系統整合公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱普勒　馬修Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEPLER, MATTHEW F</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法蘭克　馬克Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRANK, MARK A</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路溫　阿瓦羅Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEWIN, ALVARO D</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾斯崔奇　麥可Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ESTRIDGE, MICHAEL R</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種自備式及/或自供電式軟殺反制(SKCM)總成，其與一地面載具可重複地且可卸除地附接。該SKCM總成包括可在小於360度的一有界行程路徑內旋轉的一桅杆。具有一雷射源，用於執行軟殺反制操作。該SKCM總成具有至少一個內建威脅偵測器，可與該雷射進行有效通信。該SKCM總成可從一輛載具拆卸下來，然後安裝至另一輛載具上，而無需與待保護的載具或物體建立一反制通信介面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A self-contained and/or self-power soft kill countermeasure (SKCM) assembly that includes a repeated and releasable attachment to a ground vehicle. The SKCM assembly includes a mast that rotates in a bounded path of travel that is less than 360 degrees. There is a laser source to perform the soft kill countermeasure operations. The SKCM assembly has at least one built-in threat detector that is in operative communication with the laser. The SKCM can be removed from one vehicle and placed on another vehicle without needing to establish a countermeasure communication interface with the vehicle or object that is to be protected.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1910" publication-number="202614648"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614648.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614648</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通訊裝置、通訊方法及通訊系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251224B">H04W8/22</main-classification>  
        <further-classification edition="201801120251224B">H04W4/38</further-classification>  
        <further-classification edition="200601120251224B">G01S7/00</further-classification>  
        <further-classification edition="200601120251224B">G01S13/89</further-classification>  
        <further-classification edition="202201120251224B">H04L41/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商豐田自動車股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOTA JIDOSHA KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵校</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAO, XIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露之一態樣所涉及之通訊裝置，係具備控制部及通訊部。控制部，係隨應於第1感測請求的收訊，而將表示感測服務所需之感測的品質所涉及之要件的品質參數，加以取得。通訊部，係將含有品質參數之相關資訊的第2感測請求，發送至從連接至無線網路的1個以上之通訊機器之中所被選擇的參加者，並將藉由參加者基於品質參數而被收集的感測資料，予以接收。若依據本揭露之一態樣，則可適切地利用無線感測。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:UE</p>  
        <p type="p">20:BS</p>  
        <p type="p">30(SF):NF伺服器</p>  
        <p type="p">40(AF):應用程式伺服器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1911" publication-number="202614265"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614265.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614265</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132902</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以檢測晶片接合墊之失準的半導體晶粒及半導體晶圓</chinese-title>  
        <english-title>SEMICONDUCTOR DIES AND SEMICONDUCTOR WAFERS FOR DETECTING MISALIGNMENT OF CHIP BONDING PADS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H01L21/66</main-classification>  
        <further-classification edition="200601120251204B">H01L23/535</further-classification>  
        <further-classification edition="202001120251204B">G01R31/26</further-classification>  
        <further-classification edition="200601120251204B">G01R31/30</further-classification>  
        <further-classification edition="200601120251204B">G11C7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭尙勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, SANGHOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴榮奭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, YOUNGSEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐寧焄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, YOUNGHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹炫喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, HYUNCHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供半導體晶粒及半導體晶圓。一第一半導體晶粒、一第二半導體晶粒及一檢測器經組配以判定該第一半導體晶粒耦接至該第二半導體晶粒之對準準確度。該第一半導體晶粒之第一測試墊群組中之各者的第一測試墊透過在一第一方向上延伸之一線彼此電氣連接，並且該第二半導體晶粒之第二測試墊群組中之各者的第二測試墊透過在橫向於該第一方向之一第三方向上延伸之一線彼此電氣連接。該檢測器基於在各第一測試墊群組中之該等第一測試墊與各第二測試墊群組中之該等第二測試墊之間流動的電流來檢測該第一半導體晶粒與該第二半導體晶粒之間的失準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor dies and semiconductor wafers are provided. A first semiconductor die, a second semiconductor die, and a detector are configured to determine the degree of alignment accuracy with the first semiconductor die being coupled to the second semiconductor die. First test pads of each of first test pad groups of the first semiconductor die are electrically connected to each other through a line extending in a first direction, and second test pads of each of second test pad groups of the second semiconductor die are electrically connected to each other through a line extending in a third direction transversing the first direction. The detector detects misalignment between the first semiconductor die and the second semiconductor die, based on current flowing between the first test pads of each first test pad group and the second test pads of each second test pad group.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:第一測試墊圖案</p>  
        <p type="p">410,510:第一測試墊群組</p>  
        <p type="p">411,412,511,512:第一測試墊</p>  
        <p type="p">413,423,443,463,483,493,513,514,523,524,543,544,563,564,583,584,593,594:線</p>  
        <p type="p">420,520:第二測試墊群組</p>  
        <p type="p">421,422,521,522:第二測試墊</p>  
        <p type="p">440,540:第三測試墊群組</p>  
        <p type="p">441,442,541,542:第三測試墊</p>  
        <p type="p">460,560:第四測試墊群組</p>  
        <p type="p">461,462,561,562:第四測試墊</p>  
        <p type="p">480,580:第五測試墊群組</p>  
        <p type="p">481,482,581,582:第五測試墊</p>  
        <p type="p">490,590:第六測試墊群組</p>  
        <p type="p">491,492,591,592:第六測試墊</p>  
        <p type="p">500:第二測試墊圖案</p>  
        <p type="p">DIE1:第一半導體晶粒，第一晶粒</p>  
        <p type="p">DIE2:第二半導體晶粒，第二晶粒</p>  
        <p type="p">PAD1:第一墊</p>  
        <p type="p">PAD2:第二墊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1912" publication-number="202613488"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613488.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613488</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132917</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>全像檢測方法及系統</chinese-title>  
        <english-title>HOLOGRAPHIC INSPECTION METHOD AND SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G01B9/021</main-classification>  
        <further-classification edition="200601120251230B">G01N21/45</further-classification>  
        <further-classification edition="200601120251230B">G01N21/95</further-classification>  
        <further-classification edition="200601120251230B">G03H1/08</further-classification>  
        <further-classification edition="200601120251230B">H01L21/66</further-classification>  
        <further-classification edition="201701120251230B">G06T7/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商奧寶科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORBOTECH LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波瑞特　艾爾卡納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PORAT, ELKANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>特科　尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TURKO, NIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林登　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINDEN, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種系統，其包含：一光源，其發射被分成一參考光束及一物件光束之部分相干或相干光；及一載物台，其在透射穿過一工件之該物件光束之一路徑中支撐該工件。一第一光束分離器將該參考光束與透射穿過該工件之該物件光束組合成一經組合光束，且一相機偵測該經組合光束。一處理器基於該經組合光束產生該工件之一第一干涉影像；基於該第一干涉影像判定該物件光束之振幅及相位資訊；基於該振幅及相位資訊產生該工件之複數個深度影像；判定該複數個深度影像之各像素之一聚焦分數；及基於該等聚焦分數產生該工件之一第一3D映射圖，該第一3D映射圖包含深度積分折射率(DIRI)資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The system includes a light source that emits partially coherent or coherent light split into a reference beam and an object beam and a stage that supports a workpiece in a path of the object beam that is transmitted through the workpiece. A first beam splitter combines the reference beam with the object beam transmitted through the workpiece into a combined beam, and a camera detects the combined beam. A processor generates a first interference image of the workpiece based on the combined beam, determines amplitude and phase information of the object beam based on the first interference image, generates a plurality of depth images of the workpiece based on the amplitude and phase information, determines a focus score of each pixel of the plurality of depth images, and generates a first 3D map of the workpiece based on the focus scores, which includes depth-integrated refractive index (DIRI) information.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">101:工件</p>  
        <p type="p">102:第一側</p>  
        <p type="p">103:第二側</p>  
        <p type="p">110:載物台</p>  
        <p type="p">115:第二光束分離器</p>  
        <p type="p">120:光源</p>  
        <p type="p">121:部分相干光/相干光</p>  
        <p type="p">122:參考光束</p>  
        <p type="p">123:物件光束</p>  
        <p type="p">124:經組合光束</p>  
        <p type="p">130:光束操縱元件</p>  
        <p type="p">131:物鏡</p>  
        <p type="p">132:管透鏡</p>  
        <p type="p">133:第一光束分離器</p>  
        <p type="p">134:光束擴展器</p>  
        <p type="p">135:參考鏡</p>  
        <p type="p">140:相機</p>  
        <p type="p">150:處理器</p>  
        <p type="p">155:電子資料儲存單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1913" publication-number="202613239"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613239.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613239</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132939</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液狀樹脂組成物以及電子零件裝置及其製造方法</chinese-title>  
        <english-title>LIQUID RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">C08L63/00</main-classification>  
        <further-classification edition="200601120251218B">C08G59/18</further-classification>  
        <further-classification edition="201801120251218B">C08K3/105</further-classification>  
        <further-classification edition="200601120251218B">C10M133/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商力森諾科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RESONAC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉原佑介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIHARA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田和彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, KAZUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雨宮滋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMEMIYA, SHIGERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">第一液狀樹脂組成物含有環氧樹脂、硬化劑、無機填充材及潛在性黏度調整劑，縮水甘油胺型環氧樹脂於環氧樹脂的合計100質量份中所佔的含量未滿50質量份，當將縮水甘油胺型環氧樹脂於環氧樹脂的合計100質量份中所佔的含量設為A質量份、將潛在性黏度調整劑相對於環氧樹脂的合計100質量份的含量設為B質量份時，A×B的值超過20且為120以下。第二液狀樹脂組成物含有環氧樹脂、硬化劑、無機填充材及潛在性黏度調整劑，縮水甘油胺型環氧樹脂於環氧樹脂的合計100質量份中所佔的含量為50質量份以上，相對於環氧樹脂的合計100質量份，潛在性黏度調整劑的含量為1.5質量份以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A first liquid resin composition includes an epoxy resin, a curing agent, an inorganic filler, and a latent viscosity modifier, in which the content of glycidyl amine-type epoxy resin in a total of 100 parts by mass of the epoxy resin is less than 50 parts by mass, and when the content of the glycidyl amine-type epoxy resin in the total of 100 parts by mass of the epoxy resin is represented by A parts by mass and the content of the latent viscosity modifier relative to the total of 100 parts by mass of the epoxy resin is represented by B parts by mass, the value of A×B is greater than 20 but not more than 120. &lt;br/&gt;A second liquid resin composition includes an epoxy resin, a curing agent, an inorganic filler, and a latent viscosity modifier, in which the content of glycidyl amine-type epoxy resin in a total of 100 parts by mass of the epoxy resin is 50 parts by mass or more, and the content of the latent viscosity modifier is 1.5 parts by mass or less relative to the total of 100 parts by mass of the epoxy resin.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1914" publication-number="202614302"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614302.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614302</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132969</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體製程腔室及半導體熱處理設備</chinese-title>  
        <english-title>SEMICONDUCTOR PROCESS CHAMBER AND SEMICONDUCTOR THERMAL PROCESSING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250930B">H01L21/67</main-classification>  
        <further-classification edition="200601120250930B">C23C16/50</further-classification>  
        <further-classification edition="200601120250930B">C23C16/455</further-classification>  
        <further-classification edition="200601120250930B">H05H1/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊慧萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HUI PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種半導體製程腔室及半導體熱處理設備，屬於半導體技術領域。半導體製程腔室包括腔室本體以及內腔室，內腔室設置於腔室本體內，內腔室的內部空間作為等離子體產生區，內腔室為金屬阻隔結構，腔室本體內設有晶圓反應區，等離子體產生區與晶圓反應區相對，且內腔室設有通孔，等離子體產生區通過通孔與晶圓反應區連通。半導體熱處理設備包括上述的半導體製程腔室和供氣管路，供氣管路用於為內腔室提供製程氣體，以產生等離體子體。如此設置，內腔室的腔壁阻擋金屬離子轟擊腔室本體的腔壁，避免金屬離子擴散至晶圓反應區。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a semiconductor process chamber and a semiconductor thermal processing equipment, belonging to the field of semiconductor technology. The semiconductor process chamber includes a chamber body and an inner chamber. The inner chamber is arranged within the chamber body, and an internal space of the inner chamber serves as a plasma generation region. The inner chamber is a metal barrier structure. A wafer reaction region is provided inside the chamber body, and the plasma generation region is positioned opposite the wafer reaction region. The inner chamber is provided with through-holes, allowing the plasma generation region to communicate with the wafer reaction region through the through-holes. The semiconductor thermal processing equipment includes the aforementioned semiconductor process chamber and a gas supply pipeline, which is used to provide process gases to the inner chamber in order to generate plasma. With such configuration, the chamber wall of the inner chamber blocks metal ions from bombarding the chamber wall of the chamber body, thereby preventing metal ions from diffusing into the wafer reaction region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:製程管</p>  
        <p type="p">102:歧管腔室</p>  
        <p type="p">103:密封門</p>  
        <p type="p">110:側腔壁</p>  
        <p type="p">120:凸起部</p>  
        <p type="p">200:內腔室</p>  
        <p type="p">300:進氣管</p>  
        <p type="p">400:導氣管</p>  
        <p type="p">810:加熱器</p>  
        <p type="p">820:壓環</p>  
        <p type="p">830:晶舟</p>  
        <p type="p">840:旋轉軸</p>  
        <p type="p">850:晶圓</p>  
        <p type="p">b:晶圓反應區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1915" publication-number="202612607"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612607.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612607</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114132999</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>整發器</chinese-title>  
        <english-title>HAIR IRON</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">A45D1/04</main-classification>  
        <further-classification edition="200601120251231B">A45D1/28</further-classification>  
        <further-classification edition="200601120251231B">A45D1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商夏普股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARP KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤田健志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJITA, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村凌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, RYOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小柳智裕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOYANAGI, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種能夠讓使用者識別使用結束後的溫度的整發器。整發器包括：第一臂部，其具有第一加熱面；第二臂部，其具有與第一加熱面相對的第二加熱面；以及鉸鏈部，其將第一臂部和第二臂部以相互可擺動的方式連結。另外，整發器還包括：溫度判定部，其判定第一臂部的溫度和第二臂部的溫度中至少一者的溫度；以及溫度顯示部，其基於溫度判定部的判定結果進行顯示。溫度顯示部至少在整發器使用結束後進行顯示。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:整發器</p>  
        <p type="p">18:LED</p>  
        <p type="p">44:送風風扇</p>  
        <p type="p">50:操作部</p>  
        <p type="p">56:溫度顯示燈</p>  
        <p type="p">70:控制部</p>  
        <p type="p">71:風扇控制部</p>  
        <p type="p">72:LED控制部</p>  
        <p type="p">73:加熱器控制部</p>  
        <p type="p">74:溫度判定部</p>  
        <p type="p">76:記憶體</p>  
        <p type="p">77:定時器</p>  
        <p type="p">82:加熱器</p>  
        <p type="p">83:溫度感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1916" publication-number="202613602"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613602.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613602</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133022</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有包含圓形表面特徵之紋理化區域之製品及相關聯方法</chinese-title>  
        <english-title>ARTICLES WITH TEXTURED REGIONS COMPRISING ROUNDED SURFACE FEATURES AND ASSOCIATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">G02B5/02</main-classification>  
        <further-classification edition="200601120251222B">G02B1/12</further-classification>  
        <further-classification edition="200601120251222B">B44C1/22</further-classification>  
        <further-classification edition="200601120251222B">C03C15/00</further-classification>  
        <further-classification edition="200601120251222B">G09F9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊薩克　柯尼伊莉莎白</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISAAC, CORINNE ELIZABETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科赫三世　卡爾威廉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOCH III, KARL WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　沈平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHENPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑟那拉特涅　瓦吉夏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENARATNE, WAGEESHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍德　威廉艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WOOD, WILLIAM ALLEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種製品包含一基板，該基板具有一第一主表面及一第二主表面，該第一主表面中形成有一紋理化區域。在該紋理化區域內，該第一主表面包含複數個表面特徵，該等表面特徵為該第一主表面中之凹陷。該紋理化區域展現包含一峰角度大於2°之一峰之一表面角度分佈，並且該表面角度分佈自該峰角度向至少一側在一角度與該峰角度之偏差在1.8°以內時衰減至該峰之90%。該紋理化區域展現大於或等於0.1 µm且小於或等於0.6 µm之一Sq值及大於或等於5 µm且小於或等於100 µm之一Rsm值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An article comprises a substrate with a first major surface with a textured region formed therein and a second major surface. Within the textured region, the first major surface comprises a plurality of surface features that are depressions in the first major surface. The textured region exhibits a surface angle distribution comprising a peak at a peak angle greater than 2°, and the surface angle distribution decreases to 90% of the peak at an angle within 1.8° of the peak angle on at least one side of the peak angle. The textured region exhibits a Sq value that is greater than or equal to 0.1 µm and less than or equal to 0.6 µm and a Rsm value that is greater than or equal to 5 µm and less than or equal to 100 µm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:製品</p>  
        <p type="p">12:基板</p>  
        <p type="p">14:外殼</p>  
        <p type="p">16:顯示器</p>  
        <p type="p">18:第一主表面</p>  
        <p type="p">19:第二主表面</p>  
        <p type="p">20:紋理化區域</p>  
        <p type="p">21:厚度</p>  
        <p type="p">22:入射光線</p>  
        <p type="p">24:外部環境</p>  
        <p type="p">25:散射光線</p>  
        <p type="p">33:表面法線</p>  
        <p type="p">II:區域</p>  
        <p type="p">x:方向</p>  
        <p type="p">y:方向</p>  
        <p type="p">z:方向</p>  
        <p type="p">θ&lt;sub&gt;i&lt;/sub&gt;:入射角</p>  
        <p type="p">θ&lt;sub&gt;s&lt;/sub&gt;:散射角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1917" publication-number="202614328"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614328.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614328</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133026</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板搬送裝置、基板處理裝置及基板搬送方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L21/677</main-classification>  
        <further-classification edition="200601120251226B">H01L21/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>友田元貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOMODA, GENKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森住涼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIZUMI, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河原啓之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAHARA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種基板搬送裝置、基板處理裝置及基板搬送方法。基板處理裝置1具備針對載體之每個插槽記憶由旋轉編碼器25量測出之高度位置與預先已知之真實之高度位置之線性誤差之修正值的記憶部73。控制部71藉由以擋板升降部23使映射感測器27之投光部及受光部移動，而由旋轉編碼器25量測載置於載物台之載體內之基板之生產用高度位置。控制部71參照記憶部73，讀出與插入有基板之插槽對應之修正值，使用修正值修正生產用高度位置。控制部71基於經修正之生產用高度位置，控制搬送機器人IR之取出動作及收納動作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理裝置</p>  
        <p type="p">3:處理區塊</p>  
        <p type="p">11:蓋裝卸部</p>  
        <p type="p">21:擋板進退部</p>  
        <p type="p">23:擋板升降部</p>  
        <p type="p">25:旋轉編碼器</p>  
        <p type="p">27:映射感測器</p>  
        <p type="p">43:多關節臂</p>  
        <p type="p">45:升降台</p>  
        <p type="p">47:高度感測器</p>  
        <p type="p">71:控制部</p>  
        <p type="p">73:記憶部</p>  
        <p type="p">75:報知部</p>  
        <p type="p">IR:搬送機器人</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1918" publication-number="202614038"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614038.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614038</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133035</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>增強音頻信號之方法及裝置及相關的非暫時性電腦可讀媒體</chinese-title>  
        <english-title>METHOD AND DEVICE FOR ENHANCING AUDIO SIGNALS AND RELATED NON-TRANSITORY COMPUTER READABLE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120251219B">G10L21/02</main-classification>  
        <further-classification edition="200601120251219B">G06F3/16</further-classification>  
        <further-classification edition="200601120251219B">H04S1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商博姆雲３６０公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOOMCLOUD 360, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽得斯　柴克瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SELDESS, ZACHARY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬里吉利歐　喬瑟夫　安東尼　三世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARIGLIO, JOSEPH ANTHONY, III</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊克　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIKER, PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅斯　丹尼爾　艾華斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROSS, DANIEL ELWORTHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅爾加　拉斐爾　艾爾伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MELGAR, RAPHAEL ALBERTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛　樹泉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSUEH, CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置基於一音頻顯現系統之性質而顯現經增強音頻。舉例而言，與該裝置相關聯的一音頻顯現系統之音頻顯現系統資訊用於判定針對該音頻顯現系統最佳化之一音頻增強。查詢該裝置(&lt;i&gt;例如，&lt;/i&gt;一行動電話)之OS以判定該音頻顯現系統資訊。該音頻顯現系統資訊用於諸如藉由查詢儲存顯現系統資訊與音頻增強之間的關聯之一資料庫來判定一音頻增強。舉例而言，該音頻增強可包含一或多種類型之音頻處理(&lt;i&gt;例如，&lt;/i&gt;子頻帶空間處理、串音處理等)及用於該音頻處理之特定參數。將該音頻增強施加至一音頻信號以產生提供至該音頻顯現系統之一經增強音頻信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device renders enhanced audio based on properties of an audio rendering system. For example, audio rendering system information of an audio rendering system associated with the device is used to determine an audio enhancement optimized for the audio rendering system. The OS of the device (&lt;i&gt;e.g.&lt;/i&gt;, a mobile phone) is queried to determine the audio rendering system information. The audio rendering system information is used to determine an audio enhancement, such as by querying a database storing associations between rendering system information and audio enhancements. The audio enhancement may include, for example, one or more types of audio processing (&lt;i&gt;e.g.&lt;/i&gt;, subband spatial processing, crosstalk processing, etc.) and particular parameters for the audio processing. The audio enhancement is applied to an audio signal to generate an enhanced audio signal that is provided to the audio rendering system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:程序</p>  
        <p type="p">305:判定</p>  
        <p type="p">310:判定</p>  
        <p type="p">315:施加</p>  
        <p type="p">320:提供</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1919" publication-number="202613789"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613789.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613789</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133052</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251017B">G06F3/041</main-classification>  
        <further-classification edition="201601120251017B">G09G3/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金塤培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HOON-BAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孔南容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONG, NAMYONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成撤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNG-CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金善燁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUN-YEOP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜成珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, SUNG-JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金鍾成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JONGSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種顯示裝置包括：包括多個觸控電極的觸控面板以及透過多個通道供應觸控驅動訊號或觸控驅動補償訊號至所述多個觸控電極的觸控積體電路。在所述多個觸控電極之中，所述多個觸控電極的子集接收觸控驅動訊號且所述多個觸控電極的子集的補集接收觸控驅動補償訊號，且觸控驅動補償訊號及觸控驅動訊號彼此呈反相。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A display device including: a touch panel including a plurality of touch electrodes; and a touch integrated circuit supplying a touch driving signal or a touch driving compensation signal to the plurality of touch electrodes through a plurality of channels. Among the plurality of touch electrodes，a subset of the plurality of touch electrodes receives a touch driving signal and a complement of the subset of touch electrodes receives a touch driving compensation signal，and the touch driving compensation signal and the touch driving signal are in reverse phase with each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">390:觸控積體電路</p>  
        <p type="p">391:第一訊號產生單元</p>  
        <p type="p">392:第二訊號產生單元</p>  
        <p type="p">393:訊號選擇單元</p>  
        <p type="p">BUF:緩衝器</p>  
        <p type="p">CH_1,CH_2,CH_3,CH_m-2,CH_m-1,CH_m:通道</p>  
        <p type="p">DMUX:解多工器</p>  
        <p type="p">ED:發光裝置</p>  
        <p type="p">EM:發光訊號</p>  
        <p type="p">INV:反相器</p>  
        <p type="p">L_com:補償線</p>  
        <p type="p">L_out1,L_out2,L_out3:輸出線</p>  
        <p type="p">LS1:第一位準轉換器</p>  
        <p type="p">LS2:第二位準轉換器</p>  
        <p type="p">SENCE:感測單元</p>  
        <p type="p">SW1,SW2,SW3:補償開關</p>  
        <p type="p">V_touch:觸控驅動訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1920" publication-number="202614865"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614865.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614865</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133097</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於靈活的處理單元（ＰＵ）布置、改進的熱、及高良率的已知良好晶粒（ＫＧＤ）ＤＲＡＭ布置之高頻寬三維動態隨機存取記憶體（３Ｄ　ＤＲＡＭ）的穿矽通孔（ＴＳＶ）匯流排壓縮－重分布晶粒</chinese-title>  
        <english-title>THROUGH SILICON VIA (TSV) BUS COMPRESSION-REDISTRIBUTION DIE FOR HIGH-BANDWIDTH THREE-DIMENSIONAL DYNAMIC RANDOM-ACCESS MEMORY (3D DRAM) FOR FLEXIBLE PROCESSING UNIT (PU) PLACEMENT, IMPROVED THERMAL, AND KNOWN GOOD DIE (KGD) DRAM PLACEMENT FOR HIGH-YIELD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251222B">H10D88/00</main-classification>  
        <further-classification edition="202301120251222B">H10B12/00</further-classification>  
        <further-classification edition="200601120251222B">H01L21/768</further-classification>  
        <further-classification edition="200601120251222B">H01L23/538</further-classification>  
        <further-classification edition="200601120251222B">G11C5/06</further-classification>  
        <further-classification edition="200601120251222B">G11C7/10</further-classification>  
        <further-classification edition="202501120251222B">H10D89/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝達羅格魯　默斯塔法</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BADAROGLU, MUSTAFA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布斯　羅傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOOTH, ROGER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康　宇泰格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, WOO TAG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔　智弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JIHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　中澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHONGZE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>娜拉帕帝　吉里德爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NALLAPATI, GIRIDHAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曲丹巴瑞　派瑞安南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIDAMBARAM, PERIANNAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述一種三維(3D)堆疊記憶體封裝。該3D堆疊記憶體封裝包括一基底晶粒。該3D堆疊記憶體封裝亦包括記憶體晶粒，該等記憶體晶粒堆疊在該基底晶粒上並包括處於一第一節距的穿矽通孔(through silicon via, TSV)。該3D堆疊記憶體封裝亦包括一壓縮－重分布晶粒，其在該等記憶體晶粒與該基底晶粒之間。該壓縮－重分布晶粒包括處於一第二節距的第二TSV，該第二節距大於該第一節距。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A three-dimensional (3D) stacked memory package is described. The 3D stacked memory package includes a base die. The 3D stacked memory package also includes memory dies stacked on the base die and including through silicon vias (TSVs) at a first pitch. The 3D stacked memory package also a compression-redistribution die between the memory dies and the base die. The compression-redistribution die includes second TSVs at a second pitch greater than the first pitch.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:極端頻寬三維(3D)堆疊記憶體封裝</p>  
        <p type="p">304:封裝凸塊</p>  
        <p type="p">310:基底晶粒</p>  
        <p type="p">312:邏輯/信號TSV</p>  
        <p type="p">314:主動層</p>  
        <p type="p">320:實體IO介面(PHY)</p>  
        <p type="p">330:記憶體晶粒</p>  
        <p type="p">334:主動層</p>  
        <p type="p">340:穿矽通孔(TSV)群組</p>  
        <p type="p">350:TSV</p>  
        <p type="p">360-1~360-N:處理單元(PU)</p>  
        <p type="p">370:壓縮-重分布晶粒</p>  
        <p type="p">372:熱緩衝器</p>  
        <p type="p">374:主動層</p>  
        <p type="p">380:記憶體控制電路</p>  
        <p type="p">390:轉換器/重分布器區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1921" publication-number="202614600"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614600.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614600</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133116</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>與受測裝置（ＤＵＴ）通訊以用於測試</chinese-title>  
        <english-title>COMMUNICATING WITH A DUT FOR TESTING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251201B">H04L43/50</main-classification>  
        <further-classification edition="202201120251201B">H04L43/08</further-classification>  
        <further-classification edition="200601120251201B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商泰瑞達公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERADYNE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅西耶　傑森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MESSIER, JASON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃沃爾　格雷戈里　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WARWAR, GREGORY C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班納夫　傑佛瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENAGH, JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種實例設備經組態以與一受測裝置(device under test, DUT)通訊。該設備包括：一第一介面電路，其使用一第一協定與一測試儀器通訊；及一第二介面電路，其使用一第二協定與該DUT通訊。該第二協定係一預定義協定，該DUT經組態以針對該預定義協定進行操作。該第一協定用於與一第一頻率衰減相關聯的連接。該第二協定用於與一第二頻率衰減相關聯的連接。該第一頻率衰減大於該第二頻率衰減。電路系統經組態以執行下列操作中之一或兩者：(i)將從該測試儀器接收到之採用該第一協定的第一資料轉換為該第二協定，以供經由該第二介面電路輸出至該DUT；或(ii)將從該DUT接收到之採用該第二協定的第二資料轉換為該第一協定，以供經由該第一介面電路輸出至該測試儀器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An example apparatus is configured to communicate with a device under test (DUT). The apparatus includes a first interface circuit to communicate with a test instrument using a first protocol and a second interface circuit to communicate with the DUT using a second protocol. The second protocol is a predefined protocol for which the DUT is configured to operate. The first protocol is for connections associated with a first frequency attenuation. The second protocol is for connections associated with a second frequency attenuation. The first frequency attenuation is greater than the second frequency attenuation. Circuitry is configured to perform one or both of the following operations: (i) converting first data received from the test instrument in the first protocol to the second protocol for output to the DUT via the second interface circuit, or (ii) converting second data received from the DUT in the second protocol to the first protocol for output to the test instrument via the first interface circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:探針卡</p>  
        <p type="p">16n:測試儀器</p>  
        <p type="p">24:長程連接</p>  
        <p type="p">26:DUT</p>  
        <p type="p">30:短程連接</p>  
        <p type="p">32:基材；基材部分</p>  
        <p type="p">34:第一介面電路；介面電路</p>  
        <p type="p">36:第二介面電路；介面電路</p>  
        <p type="p">38:電路系統</p>  
        <p type="p">40:串列器/解串列器(serdes)</p>  
        <p type="p">42:串列器/解串列器(serdes)</p>  
        <p type="p">44:類比至數位轉換器(ADC)</p>  
        <p type="p">46:封裝件</p>  
        <p type="p">48:參數測量單元(PMU)</p>  
        <p type="p">50:開關</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1922" publication-number="202613583"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613583.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613583</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133117</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用協定無關電路系統與受測裝置通訊</chinese-title>  
        <english-title>COMMUNICATING WITH A DUT USING PROTOCOL-AGNOSTIC CIRCUITRY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G01R31/319</main-classification>  
        <further-classification edition="200601120251201B">G01R31/317</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商泰瑞達公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TERADYNE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅西耶　傑森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MESSIER, JASON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沃沃爾　格雷戈里　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WARWAR, GREGORY C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班納夫　傑佛瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENAGH, JEFFREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種實例設備經組態以電連接至一受測裝置(device under test, DUT)。該設備包括：一第一介面電路，其使用一第一協定與一測試儀器通訊；及一第二介面電路，其接收來自該DUT之包含具有一第二協定之資料的信號。該第二介面電路經組態以在電壓及時間上對含有資料的該等信號進行過取樣，以產生經取樣資料。過取樣包括以比奈奎斯特速率(Nyquist rate)高的一速率對含有資料的該等信號進行取樣。電路系統經組態以從該第二介面電路接收該經取樣資料，基於該經取樣資料來產生具有該第一協定的資料，並經由該第一介面電路將具有該第一協定的該資料輸出至該測試儀器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An example apparatus is configured to electrically connect to a device under test (DUT). The apparatus includes a first interface circuit to communicate with a test instrument using a first protocol and a second interface circuit to receive signals containing data from the DUT having a second protocol. The second interface circuit is configured to oversample the signals containing data in voltage and time to produce sampled data. Oversampling includes sampling the signals containing data at a rate that is higher than the Nyquist rate. Circuitry is configured to receive the sampled data from the second interface circuit, to generate the data having the first protocol based on the sampled data, and to output the data having the first protocol to the test instrument via the first interface circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">14:探針卡</p>  
        <p type="p">16n:測試儀器</p>  
        <p type="p">24:長程連接</p>  
        <p type="p">26:DUT</p>  
        <p type="p">30:短程連接</p>  
        <p type="p">32:基材；基材部分</p>  
        <p type="p">34:第一介面電路；介面電路</p>  
        <p type="p">36:第二介面電路；介面電路</p>  
        <p type="p">37:取樣電路系統；電路系統</p>  
        <p type="p">38:電路系統</p>  
        <p type="p">39:類比轉數位(ADC)電路系統</p>  
        <p type="p">40:串列器/解串列器(serdes)</p>  
        <p type="p">41:相位時脈</p>  
        <p type="p">43:暫存器</p>  
        <p type="p">45:並列匯流排</p>  
        <p type="p">46:封裝件</p>  
        <p type="p">48:參數測量單元(PMU)</p>  
        <p type="p">50:開關</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1923" publication-number="202614866"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614866.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614866</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133225</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含透過熔融接合耦接在一起的多個晶片的記憶體裝置</chinese-title>  
        <english-title>MEMORY DEVICE COMPRISING MULTIPLE CHIPS COUPLED TOGETHER THROUGH FUSION BONDING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251222B">H10D88/00</main-classification>  
        <further-classification edition="202301120251222B">H10B12/00</further-classification>  
        <further-classification edition="200601120251222B">H01L23/538</further-classification>  
        <further-classification edition="200601120251222B">H01L21/768</further-classification>  
        <further-classification edition="200601120251222B">G11C5/06</further-classification>  
        <further-classification edition="202501120251222B">H10D89/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴　繼紅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JIHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴達羅格魯　穆斯塔法</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BADAROGLU, MUSTAFA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康　佑　達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, WOO TAG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納拉帕蒂　吉里達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NALLAPATI, GIRIDHAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　忠澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHONGZE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇丹巴拉姆　佩里安南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIDAMBARAM, PERIANNAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置包含一記憶體裝置，該記憶體裝置包含：一第一記憶體晶片；一第二記憶體晶片，其耦接至該第一記憶體晶片，其中該第一記憶體晶片的一前側耦接至該第二記憶體晶片的一前側；一第三記憶體晶片，其耦接至該第二記憶體晶片，其中該第二記憶體晶片的一背側透過熔融接合耦接至該第三記憶體晶片的一背側；及一第四記憶體晶片，其耦接至該第三記憶體晶片，其中該第三記憶體晶片的一前側耦接至該第四記憶體晶片的一前側。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device comprising a memory device comprising: a first memory chip; a second memory chip coupled to the first memory chip, wherein a front side of the first memory chip is coupled to a front side of the second memory chip; a third memory chip coupled to the second memory chip, wherein a back side of the second memory chip is coupled to a back side of the third memory chip through fusion bonding; and a fourth memory chip coupled to the third memory chip, wherein a front side of the third memory chip is coupled to a front side of the fourth memory chip.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">402a:晶粒基材部分</p>  
        <p type="p">402b:晶粒基材部分</p>  
        <p type="p">402c:晶粒基材部分</p>  
        <p type="p">402d:晶粒基材部分</p>  
        <p type="p">403a:墊互連件</p>  
        <p type="p">403b:墊互連件</p>  
        <p type="p">403c:墊互連件</p>  
        <p type="p">403d:墊互連件</p>  
        <p type="p">404a:晶粒互連部分</p>  
        <p type="p">404b:晶粒互連部分</p>  
        <p type="p">404c:晶粒互連部分</p>  
        <p type="p">404d:晶粒互連部分</p>  
        <p type="p">406a:鈍化層</p>  
        <p type="p">406b:鈍化層</p>  
        <p type="p">406c:鈍化層</p>  
        <p type="p">406d:鈍化層</p>  
        <p type="p">407a:介電層</p>  
        <p type="p">407b:介電層</p>  
        <p type="p">407c:介電層</p>  
        <p type="p">407d:介電層</p>  
        <p type="p">420a:晶粒基材</p>  
        <p type="p">420b:晶粒基材</p>  
        <p type="p">420c:晶粒基材</p>  
        <p type="p">420d:晶粒基材</p>  
        <p type="p">422a:主動區</p>  
        <p type="p">422b:主動區</p>  
        <p type="p">422c:主動區</p>  
        <p type="p">422d:主動區</p>  
        <p type="p">440a:介電層</p>  
        <p type="p">440b:介電層</p>  
        <p type="p">440c:介電層</p>  
        <p type="p">440d:介電層</p>  
        <p type="p">441:電容器</p>  
        <p type="p">442a:晶粒互連件</p>  
        <p type="p">442b:晶粒互連件</p>  
        <p type="p">442c:晶粒互連件</p>  
        <p type="p">442d:晶粒互連件</p>  
        <p type="p">500:記憶體裝置</p>  
        <p type="p">501:晶片</p>  
        <p type="p">502:晶片</p>  
        <p type="p">503:晶片</p>  
        <p type="p">504:晶片</p>  
        <p type="p">505b:背側互連件</p>  
        <p type="p">505ba:背側互連件</p>  
        <p type="p">505bb:背側互連件</p>  
        <p type="p">505bc:背側互連件</p>  
        <p type="p">505c:背側互連件</p>  
        <p type="p">505ca:背側互連件</p>  
        <p type="p">505cc:背側互連件</p>  
        <p type="p">505d:背側互連件</p>  
        <p type="p">505da:背側互連件</p>  
        <p type="p">505db:背側互連件</p>  
        <p type="p">505dc:背側互連件</p>  
        <p type="p">505dd:背側互連件</p>  
        <p type="p">507b:介電層</p>  
        <p type="p">507c:介電層</p>  
        <p type="p">523a:通孔互連件</p>  
        <p type="p">523b:通孔互連件</p>  
        <p type="p">523c:通孔互連件</p>  
        <p type="p">523d:通孔互連件</p>  
        <p type="p">523e:通孔互連件</p>  
        <p type="p">523f:通孔互連件</p>  
        <p type="p">523g:通孔互連件</p>  
        <p type="p">550b:鈍化層</p>  
        <p type="p">550c:鈍化層</p>  
        <p type="p">550d:鈍化層</p>  
        <p type="p">L1:晶片</p>  
        <p type="p">L2:晶片</p>  
        <p type="p">L3:晶片</p>  
        <p type="p">L4:晶片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1924" publication-number="202614867"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614867.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614867</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133226</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>標準ＤＲＡＭ系統級封裝（ＳＩＰ）中之高容量及高頻寬三維動態隨機存取記憶體（３Ｄ　ＤＲＡＭ）整合</chinese-title>  
        <english-title>HIGH-CAPACITY AND HIGH-BANDWIDTH THREE-DIMENSIONAL DYNAMIC RANDOM-ACCESS MEMORY (3D DRAM) INTEGRATION IN STANDARD DRAM SYSTEM-IN-PACKAGE (SIP)</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251222B">H10D88/00</main-classification>  
        <further-classification edition="202301120251222B">H10B12/00</further-classification>  
        <further-classification edition="200601120251222B">H01L23/538</further-classification>  
        <further-classification edition="200601120251222B">H01L23/48</further-classification>  
        <further-classification edition="200601120251222B">H01L21/768</further-classification>  
        <further-classification edition="202501120251222B">H10D89/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴達羅格魯　穆斯塔法</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BADAROGLU, MUSTAFA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柴　繼紅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JIHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康　佑　達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, WOO TAG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　忠澤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ZHONGZE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納拉帕蒂　吉里達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NALLAPATI, GIRIDHAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇丹巴拉姆　佩里安南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIDAMBARAM, PERIANNAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述一種三維(3D)堆疊記憶體封裝。該3D堆疊記憶體封裝包括第一複數個堆疊記憶體晶粒。該3D堆疊記憶體封裝亦包括一第一基底晶粒，其堆疊在該第一複數個堆疊記憶體晶粒上。該3D堆疊記憶體封裝進一步包括一封裝基材，該封裝基材支撐該第一複數個堆疊記憶體晶粒。該3D堆疊記憶體封裝亦包括第一複數個穿矽通孔(TSV)，其等在該第一複數個堆疊記憶體晶粒與該第一基底晶粒上之一第一運算區塊之間延伸。該3D堆疊記憶體封裝進一步包括第一組打線接合，其耦接在該封裝基材與該第一基底晶粒上之一第一實體IO介面(PHY)之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A three-dimensional (3D) stacked memory package is described. The 3D stacked memory package includes a first plurality of stacked memory dies. The 3D stacked memory package also includes a first base die stacked on the first plurality of stacked memory dies. The 3D stacked memory package further includes a package substrate supporting the first plurality of stacked memory dies. The 3D stacked memory package also includes a first plurality of through silicon vias (TSVs) extending between the first plurality of stacked memory dies and a first compute block on the first base die. The 3D stacked memory package further includes a first set of wire-bonds coupled between the package substrate and a first physical IO interface (PHY) on the first base die.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:高容量及高頻寬三維動態隨機存取記憶體(3D DRAM)封裝</p>  
        <p type="p">402:封裝基材</p>  
        <p type="p">404:嵌入式模製化合物(EMC)</p>  
        <p type="p">410:第一基底晶粒</p>  
        <p type="p">416:第一運算區塊</p>  
        <p type="p">418:第一實體IO介面(PHY)</p>  
        <p type="p">420-1:第一基底記憶體晶粒</p>  
        <p type="p">420-2:第二記憶體晶粒</p>  
        <p type="p">420-3:薄記憶體晶粒/第三記憶體晶粒</p>  
        <p type="p">420-4:第四記憶體晶粒</p>  
        <p type="p">420:第一記憶體晶粒堆疊</p>  
        <p type="p">422:第一高密度穿矽通孔(TSV)</p>  
        <p type="p">430:第二基底晶粒</p>  
        <p type="p">436:第二運算區塊</p>  
        <p type="p">438:第二實體IO介面(PHY)</p>  
        <p type="p">440-1:第二基底記憶體晶粒</p>  
        <p type="p">440-2:第二記憶體晶粒</p>  
        <p type="p">440-4:第四記憶體晶粒</p>  
        <p type="p">440:第二記憶體晶粒堆疊</p>  
        <p type="p">442:第二高密度穿矽通孔(TSV)</p>  
        <p type="p">450:熱冷卻板</p>  
        <p type="p">WB&lt;sub&gt;1&lt;/sub&gt;:打線接合</p>  
        <p type="p">WB&lt;sub&gt;2&lt;/sub&gt;:打線接合</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1925" publication-number="202614303"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614303.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614303</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133303</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>安裝裝置及安裝方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/67</main-classification>  
        <further-classification edition="200601120251230B">H01L21/56</further-classification>  
        <further-classification edition="200601120251230B">H01L23/488</further-classification>  
        <further-classification edition="201401120251230B">B23K26/06</further-classification>  
        <further-classification edition="201401120251230B">B23K26/20</further-classification>  
        <further-classification edition="200601120251230B">G02B27/09</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東麗工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TORAY ENGINEERING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武久翔多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEHISA, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷川央樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIKAWA, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸山敏和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUYAMA, TOSHIKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠以適於每一晶片零件之安裝條件將複數個晶片零件同時安裝於基板之安裝裝置。具體而言，本發明之安裝裝置10係將晶片零件8安裝於基板7者，且包含接合頭11，該接合頭11朝複數個晶片零件8照射雷射，而將該等複數個晶片零件8安裝於基板7；且接合頭11具備如下構成：以基於每一晶片零件8之規定安裝條件、在對複數個晶片零件8照射雷射之照射區域內形成照射強度不同之區域之方式，將雷射之光束輪廓設為可變。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">7:基板</p>  
        <p type="p">8:晶片零件</p>  
        <p type="p">9:凸塊</p>  
        <p type="p">10:安裝裝置</p>  
        <p type="p">11:接合頭</p>  
        <p type="p">12:雷射頭本體部</p>  
        <p type="p">13:配件工具</p>  
        <p type="p">13a:晶片保持部</p>  
        <p type="p">14:雷射輸出部</p>  
        <p type="p">15:雷射振盪器</p>  
        <p type="p">16:光束輪廓可變部</p>  
        <p type="p">17:光學器件</p>  
        <p type="p">18:光透過調整器件</p>  
        <p type="p">19:空間光調變器件</p>  
        <p type="p">30:升降單元</p>  
        <p type="p">40:基板台</p>  
        <p type="p">41:台機構</p>  
        <p type="p">42:吸附載台</p>  
        <p type="p">50:控制部</p>  
        <p type="p">51:雷射振盪器控制部</p>  
        <p type="p">52:光學器件控制部</p>  
        <p type="p">53:升降單元控制部</p>  
        <p type="p">54:基板台控制部</p>  
        <p type="p">II-II:線</p>  
        <p type="p">L1:第1雷射(第1區域雷射)</p>  
        <p type="p">L2:第2雷射(第2區域雷射)</p>  
        <p type="p">X,Y,Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1926" publication-number="202614401"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614401.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614401</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133317</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以減少應力之在積體電路（ＩＣ）中的電晶體列上的柱條通孔層中的分離金屬區域及相關製造方法</chinese-title>  
        <english-title>SEPARATE METAL REGIONS IN A LAYER OF A PILLAR BAR VIA ON A TRANSISTOR ROW IN AN INTEGRATED CIRCUIT (IC) TO REDUCE STRESS AND RELATED FABRICATION METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L23/36</main-classification>  
        <further-classification edition="202501120251229B">H10D89/60</further-classification>  
        <further-classification edition="200601120251229B">H01L23/522</further-classification>  
        <further-classification edition="200601120251229B">H01L23/485</further-classification>  
        <further-classification edition="202501120251229B">H10D10/80</further-classification>  
        <further-classification edition="200601120251229B">H03F1/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張文月莉迪亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, WENYUE LYDIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法利　艾利瑞札</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VALI, ALIREZA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張家平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIAPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安永豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AN, YONGHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種積體電路(IC)可包括設置在一列電晶體上方的一條形區域中的一柱條，用以傳導一電流通過該等電晶體並將熱傳導遠離該等電晶體。柱條包括一頂部金屬層、耦接至該列中之該等電晶體之各者的一端子之一底部金屬層、以及該頂部金屬層與該底部金屬層之間的至少一個中間層。當由該等電晶體加熱時，柱條中的金屬以與IC基材不同的速率膨脹，導致與熱相關的應力，其可能會損壞IC。在本文所揭示的柱條中，該等中間層之一者包括由柱條區域中的非金屬材料分離的分離金屬區域。柱條包括中心金屬區域以及在該中心金屬區域與該柱條之該等端部之間的分離金屬區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An integrated circuit (IC) may include a pillar bar disposed in a bar area over a row of transistors to conduct a current through the transistors and to conduct heat away from the transistors. The pillar bar includes a top metal layer, a bottom metal layer coupled to a terminal of each of the transistors in the row, and at least one intermediate layer between the top metal layer and the bottom metal layer. When heated by the transistors, the metal in the pillar bar expands at a different rate than the IC substrate, causing heat-related stress that may damage the IC. In a pillar bar disclosed herein, one of the intermediate layers includes separate metal regions separated by a non-metal material in the bar area. The pillar bar includes a central metal region and separate metal regions between the central metal region and the ends of the pillar bar.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:IC</p>  
        <p type="p">502:柱條</p>  
        <p type="p">504:條形區域</p>  
        <p type="p">506:列</p>  
        <p type="p">508(1)-508(Z):電晶體</p>  
        <p type="p">510:第一中間層</p>  
        <p type="p">512(1)-512(S):金屬區域</p>  
        <p type="p">514A:第一端</p>  
        <p type="p">514B:第二端</p>  
        <p type="p">516:非金屬材料</p>  
        <p type="p">518:金屬</p>  
        <p type="p">520:中心區域</p>  
        <p type="p">522:中心金屬區域</p>  
        <p type="p">524A:第一金屬區域</p>  
        <p type="p">524B:第二金屬區域</p>  
        <p type="p">526:基材</p>  
        <p type="p">D&lt;sub&gt;504&lt;/sub&gt;:距離</p>  
        <p type="p">S1:第一側</p>  
        <p type="p">S2:第二側</p>  
        <p type="p">W&lt;sub&gt;522&lt;/sub&gt;:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1927" publication-number="202614329"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614329.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614329</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133324</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>檢查系統、電腦系統、程式、及半導體檢查系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251008B">H01L21/677</main-classification>  
        <further-classification edition="200601120251008B">H01L21/66</further-classification>  
        <further-classification edition="200601120251008B">G05B19/19</further-classification>  
        <further-classification edition="202301120251008B">G06F18/23</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦智史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海老泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EBIZUKA, YASUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>益子英一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASHIKO, EIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤永信生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJINAGA, NOBUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">檢查系統，係具備：平台移動機構，係將載置有試料的平台，予以移動；和影像平移機構，係將拍攝前記試料的視野，於視野範圍中予以平移；和控制部，係將前記平台移動機構的移動動作、及前記影像平移機構的影像平移動作，予以控制。前記控制部，係基於表示前記試料上之複數個檢查點的檢查點資訊、前記視野範圍、及將前記複數個檢查點做群組劃分的第1條件，而將前記複數個檢查點劃分成複數個群組；將藉由前記平台移動機構而使前記平台在前記群組間做依序移動的第1移動路徑，予以作成；於前記第1移動路徑中，各前記群組間的前記平台的移動距離之中存在有未滿閾值的移動距離的情況下，將做了最佳化處理以使各前記移動距離會變成前記閾值以上的第2移動路徑，予以作成；依照前記第2移動路徑來檢查前記試料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">AR21~AR23:箭頭</p>  
        <p type="p">C1~C3:中心位置</p>  
        <p type="p">G1~G3:群組</p>  
        <p type="p">IP1~IP6:檢查點</p>  
        <p type="p">STA:初期位置</p>  
        <p type="p">V1~V3:視野範圍</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1928" publication-number="202614304"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614304.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614304</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133327</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/67</main-classification>  
        <further-classification edition="200601120251230B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商龍雲股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAZMO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐野一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANO, ICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">於本發明之接合裝置中，在按壓部之前端面形成有：吸附面，其藉由吸附片材之背面而經由該片材來保持第1工件；及後退面，其在該吸附面之周圍自該吸附面後退。周邊保持部為保持片材中之貼附有第1工件之區域之周邊區域的部分，其本身構成為環狀，且具有吸附並保持該周邊區域整體之環狀的吸附面。按壓部及周邊保持部具有將後退面之外周緣與周邊保持部之內周面之間加以密閉的密閉構造。藉此，於使片材吸附於按壓部之吸附面與周邊保持部之吸附面時，在該等吸附面之間形成密閉空間。而且，接合裝置於第1工件之按壓時使密閉空間之內壓降低。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:保持機構</p>  
        <p type="p">2:按壓機構</p>  
        <p type="p">3:對準台</p>  
        <p type="p">4:檢測感測器</p>  
        <p type="p">5:控制裝置</p>  
        <p type="p">11:片材保持部</p>  
        <p type="p">12:載台</p>  
        <p type="p">13:驅動部</p>  
        <p type="p">21:按壓部</p>  
        <p type="p">21a:前端面</p>  
        <p type="p">21p:吸附面</p>  
        <p type="p">21q:後退面</p>  
        <p type="p">22:周邊保持部</p>  
        <p type="p">22p:吸附面</p>  
        <p type="p">23,24:驅動部</p>  
        <p type="p">31:壓電台</p>  
        <p type="p">32:廣範圍台</p>  
        <p type="p">211:滑動銷</p>  
        <p type="p">212:驅動部</p>  
        <p type="p">Rm:光路</p>  
        <p type="p">Sw:片材</p>  
        <p type="p">W1:第1工件</p>  
        <p type="p">W2:第2工件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1929" publication-number="202612915"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612915.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612915</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133343</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於生產包含取向非球形磁性或可磁化顏料顆粒的光學效應層的磁性裝置、磁性設備以及製程</chinese-title>  
        <english-title>MAGNETIC DEVICES, MAGNETIC APPARATUSES AND PROCESSES FOR PRODUCING OPTICAL EFFECT LAYERS COMPRISING ORIENTED NON-SPHERICAL MAGNETIC OR MAGNETIZABLE PIGMENT PARTICLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251222B">B42D25/369</main-classification>  
        <further-classification edition="200601120251222B">B44F1/00</further-classification>  
        <further-classification edition="200601120251222B">G02B5/28</further-classification>  
        <further-classification edition="200601120251222B">H01F7/02</further-classification>  
        <further-classification edition="200601120251222B">C09D5/23</further-classification>  
        <further-classification edition="200601120251222B">C08F2/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商西克帕控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SICPA HOLDING SA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祖林登　蒂博</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZURLINDEN, THIBAULT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於用於在基板上生產光學效應層(OEL)的磁性裝置、磁性設備及製程的領域，該等光學效應層包含經磁性取向的非球形磁性或可磁化顏料顆粒並提供兩個或更多個圈形體的光學印象，該等圈形體使其形狀及/或大小及/或其亮度在傾斜該光學效應層(OEL)時在相反方向上變化。特定而言，本發明係關於用於生產所述OEL作為安全文件或安全製品上的防偽手段或用於裝飾目的之磁性裝置、磁性設備及製程。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to the field of magnetic devices, magnetic apparatuses and processes for producing optical effect layers (OEL) comprising magnetically oriented non-spherical magnetic or magnetizable pigment particles on a substrate and providing an optical impression of two or more loop-shaped bodies having their shape and/or size and/or their brightness varying in opposite directions upon tilting the optical effect layer (OEL). In particular, the present invention relates magnetic devices, magnetic apparatuses and processes for producing said OELs as anti-counterfeit means on security documents or security articles or for decorative purposes.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:磁性裝置</p>  
        <p type="p">110:塗層</p>  
        <p type="p">120:基板</p>  
        <p type="p">130:磁性組件</p>  
        <p type="p">140:磁場產生裝置</p>  
        <p type="p">150:磁極片</p>  
        <p type="p">170:容置外殼</p>  
        <p type="p">171:容置外殼底蓋</p>  
        <p type="p">1000:磁性設備</p>  
        <p type="p">h:距離</p>  
        <p type="p">L1:長度</p>  
        <p type="p">L2:寬度</p>  
        <p type="p">L3:厚度</p>  
        <p type="p">L4:長度</p>  
        <p type="p">L5:寬度</p>  
        <p type="p">L6:厚度</p>  
        <p type="p">L7:長度</p>  
        <p type="p">L8:寬度</p>  
        <p type="p">L9:厚度</p>  
        <p type="p">S1:第一組</p>  
        <p type="p">S2:第二組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1930" publication-number="202614266"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614266.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614266</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133410</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括多測量感測器的螺旋掃描裝置及利用其的晶圓檢查方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">H01L21/66</main-classification>  
        <further-classification edition="201001120251222B">G01Q10/00</further-classification>  
        <further-classification edition="200601120251222B">H01L21/67</further-classification>  
        <further-classification edition="200601120251222B">G01N29/04</further-classification>  
        <further-classification edition="200601120251222B">G01N29/26</further-classification>  
        <further-classification edition="200601120251222B">G01N27/24</further-classification>  
        <further-classification edition="200601120251222B">G01N29/24</further-classification>  
        <further-classification edition="201001120251222B">G01Q60/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商高維思科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOVIS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>兪炫圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, HYEON-KYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金日光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, IL-KWANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任恩宰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, EUN-JAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明關於包括多測量感測器的螺旋掃描裝置及利用其的晶圓檢查方法。更詳細地，作為利用包括多個測量感測器的螺旋掃描裝置快速且均勻地檢查晶圓表面或內部的技術，透過控制卡盤台的旋轉速度和多個測量感測器的移動，並分離晶圓測量區域，可使多個測量感測器測量各個區域。將測量的數據輸出為圖像並將其進行合成，從而可有效地檢測晶圓表面或內部的污染及缺陷。根據這種本發明的實施例，包括多測量感測器的螺旋掃描裝置可包括卡盤台、多個測量感測器及控制部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一測量感測器</p>  
        <p type="p">20:第二測量感測器</p>  
        <p type="p">100:卡盤台</p>  
        <p type="p">110:多個測量感測器</p>  
        <p type="p">120:控制部</p>  
        <p type="p">130:旋轉軸</p>  
        <p type="p">140:馬達</p>  
        <p type="p">150:真空吸入器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1931" publication-number="202614485"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614485.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614485</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133430</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙頻帶天線</chinese-title>  
        <english-title>DUAL-BAND ANTENNA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251229B">H01Q5/28</main-classification>  
        <further-classification edition="201501120251229B">H01Q5/30</further-classification>  
        <further-classification edition="200601120251229B">H01Q1/52</further-classification>  
        <further-classification edition="200601120251229B">H01Q21/24</further-classification>  
        <further-classification edition="200601120251229B">H01Q21/28</further-classification>  
        <further-classification edition="200601120251229B">H04B7/185</further-classification>  
        <further-classification edition="201801120251229B">H04W4/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕特里奧蒂斯　馬里奧斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATRIOTIS, MARIOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費比加　桑切斯　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FABREGA SANCHEZ, JORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雙頻帶天線包括：覆疊的第一及第二貼片輻射器，其經組態以在第一及第二頻帶及正交的第一及第二偏振下操作，其中該第一頻帶低於該第二頻帶；一第一接地平面，其在該等貼片輻射器之間；一第一能量耦合器，其具有電耦接至該第一貼片輻射器之一第一耦接部分的一第一信號路徑及一第二信號路徑；一第二能量耦合器，其具有電耦接至該第二貼片輻射器之一第二耦接部分的一第三信號路徑及一第四信號路徑；及一導電壁，其與該第一貼片輻射器、該第一信號路徑、及該第二信號路徑電鄰近。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dual-band antenna includes: first and second overlaying patch radiators configured to operate at first and second frequency bands and first and second polarizations that are orthogonal, wherein the first frequency band is lower than the second frequency band; a first ground plane between the patch radiators; a first energy coupler having a first signal path and a second signal path electrically coupled to a first coupling portion of the first patch radiator; a second energy coupler having a third signal path and a fourth signal path electrically coupled to a second coupling portion of the second patch radiator; and a conductive wall in electrical proximity to the first patch radiator, the first signal path, and the second signal path.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1400:雙頻帶天線</p>  
        <p type="p">1402:第一貼片輻射器</p>  
        <p type="p">1404:第二貼片輻射器</p>  
        <p type="p">1406:第一接地平面</p>  
        <p type="p">1408:第一能量耦合器</p>  
        <p type="p">1410:第二能量耦合器</p>  
        <p type="p">1412:導電壁</p>  
        <p type="p">1414:堆疊構形</p>  
        <p type="p">1416:第一信號路徑</p>  
        <p type="p">1418:第二信號路徑</p>  
        <p type="p">1420:第一耦接部分</p>  
        <p type="p">1422:第三信號路徑</p>  
        <p type="p">1424:第四信號路徑</p>  
        <p type="p">1426:第一方向</p>  
        <p type="p">1427:第二耦接部分</p>  
        <p type="p">1428:電鄰近</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1932" publication-number="202614596"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614596.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614596</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133438</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>入侵偵測裝置及方法</chinese-title>  
        <english-title>INTRUSION DETECTION DEVICE AND METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251201B">H04L41/14</main-classification>  
        <further-classification edition="202201120251201B">H04L41/16</further-classification>  
        <further-classification edition="201301120251201B">G06F21/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂義信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YI HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林盈達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YING-DAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李維斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WEI-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施芊羽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHIEN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種入侵偵測裝置及方法。該入侵偵測裝置傳送一網路封包至一混合決策模型，以產生對應該網路封包之一偵測結果。該入侵偵測裝置響應於該偵測結果對應至一異常狀態，基於該網路封包中之一目標資訊，取得對應該目標資訊之一回饋。該入侵偵測裝置傳送該回饋至一情資偵測模型，以更新對應該網路封包之該偵測結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An intrusion detection device and method are provided. The intrusion detection device transmits a network packet to a hybrid decision model to generate a detection result corresponding to the network packet. The intrusion detection device obtains a feedback corresponding to the target information based on a target information in the network packet in response to the detection result corresponding to an abnormal state. The intrusion detection device transmits the feedback to a cti detection model to update the detection result corresponding to the network packet.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:入侵偵測方法</p>  
        <p type="p">S701、S703、S705:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1933" publication-number="202614355"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614355.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614355</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133451</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理系統用的可移動邊緣環</chinese-title>  
        <english-title>MOVEABLE EDGE RINGS FOR PLASMA PROCESSING SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L21/687</main-classification>  
        <further-classification edition="200601120260102B">H01L21/683</further-classification>  
        <further-classification edition="200601120260102B">H01L21/67</further-classification>  
        <further-classification edition="200601120260102B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肯伯　克利斯多夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMBALL, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾利奇　達瑞爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EHRLICH, DARRELL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大倉有麻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHKURA, YUMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於基板處理系統的可移動邊緣環系統包括頂部可移動環，該頂部可移動環包括圍繞著基板支撐件配置的第一環狀本體。該頂部可移動環在基板處理期間係暴露至電漿。可移動支撐環係配置在該頂部可移動環下方及該基板支撐件的基底板的徑向外側，並且包括第二環狀本體。屏蔽環係配置在該可移動支撐環的徑向外側，並且包括第三環狀本體。覆蓋環包括配置在該頂部可移動環的徑向外邊緣上方的第四環狀本體。致動器及升降銷係配置以調整該頂部可移動環及該可移動支撐環相對於該屏蔽環及該覆蓋環的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A moveable edge ring system for a substrate processing system includes a top moveable ring including a first annular body arranged around a substrate support. The top moveable ring is exposed to plasma during substrate processing. A moveable support ring is arranged below the top moveable ring and radially outside of a baseplate of the substrate support and includes a second annular body. A shield ring is arranged radially outside of the moveable support ring and includes a third annular body. A cover ring includes a fourth annular body arranged above a radially outer edge of the top moveable ring. An actuator and a lift pin are configured to adjust a position of the top moveable ring and the moveable support ring relative to the shield ring and the cover ring.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1100:方法</p>  
        <p type="p">1102~1128:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1934" publication-number="202613228"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613228.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613228</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133457</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於含金屬光刻膠的顯影劑組合物以及包括使用所述組合物的顯影步驟的形成圖案的方法</chinese-title>  
        <english-title>DEVELOPER COMPOSITION FOR METAL-CONTAINING PHOTORESIST, AND METHOD OF FORMING PATTERNS INCOUDING DEVELOPING STEP USING THE COMPOSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251218B">C08K3/11</main-classification>  
        <further-classification edition="200601120251218B">C09K13/06</further-classification>  
        <further-classification edition="200601120251218B">C11D3/06</further-classification>  
        <further-classification edition="200601120251218B">G03F7/32</further-classification>  
        <further-classification edition="200601120251218B">C07F7/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG SDI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭澤秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAK, TAEKSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文炯朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOON, HYUNGRANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>扈鍾必</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, JONGPIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓承</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, SEUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金兌鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAEHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴慶熏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, GYEONGHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛羅莎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, ROSA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林恩英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, EUNYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>具滋旼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, JAMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了一種用於含金屬光刻膠的顯影劑組合物以及一種利用顯影劑組合物形成圖案的方法。顯影劑組合物可包含金屬化合物、有機溶劑和添加劑，並且可被施加到具有曝光部分和非曝光部分的含金屬光刻膠。在非曝光部分中，在含金屬光刻膠中金屬化合物與有機溶劑之間的氫鍵數目相對於金屬化合物與添加劑之間的氫鍵數目可大於0且小於或等於約10，並且在含金屬光刻膠中添加劑與有機溶劑之間的氫鍵數目相對於金屬化合物與添加劑之間的氫鍵數目可大於0且小於或等於約5。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A developer composition for a metal-containing photoresist and a method of forming patterns utilizing the developer composition are disclosed. The developer composition may include a metal compound, an organic solvent, and an additive and may be applied to a metal-containing photoresist having an exposed portion and an unexposed portion. In the unexposed portion, the number of hydrogen bonds between the metal compound and the organic solvent relative to the number of hydrogen bonds between the metal compound and the additive in the metal-containing photoresist may be greater than 0 and less than or equal to about 10, and the number of hydrogen bonds between the additive and the organic solvent relative to the number of hydrogen bonds between the metal compound and the additive in the metal-containing photoresist may be greater than 0 and less than or equal to about 5.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:襯底</p>  
        <p type="p">110P:特徵圖案</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1935" publication-number="202614305"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614305.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614305</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133528</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>膜形成設備、膜形成方法及製造物品的方法</chinese-title>  
        <english-title>FILM FORMING APPARATUS, FILM FORMING METHOD, AND METHOD OF MANUFACTURING ARTICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L21/67</main-classification>  
        <further-classification edition="200601120251229B">B29C35/08</further-classification>  
        <further-classification edition="200601120251229B">B29C43/18</further-classification>  
        <further-classification edition="200601120251229B">B29C59/02</further-classification>  
        <further-classification edition="200601120251229B">G03F7/16</further-classification>  
        <further-classification edition="200601120251229B">B32B37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松岡佳大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUOKA, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">膜形成設備透過使部件與硬化性組成物接觸而在基板上形成硬化性組成物的膜。膜形成設備包括：保持單元，配置為在與所述部件的中央部分接觸的同時吸附地保持所述部件；以及壓力控制單元，配置為向所述保持單元的與保持所述部件的表面相反的表面施加壓力，以使所述保持單元及所述部件變形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A film forming apparatus forms a film of a curable composition on a substrate by bringing a member into contact with the curable composition. The film forming apparatus includes: a holding unit configured to adsorptively hold the member while coming into contact with a central portion of the member; and a pressure control unit configured to apply a pressure to a surface of the holding unit opposite to a surface holding the member to deform the holding unit and the member.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:基板</p>  
        <p type="p">108:覆板</p>  
        <p type="p">118:卡盤組件</p>  
        <p type="p">120:平坦化頭部</p>  
        <p type="p">124:硬化性組成物</p>  
        <p type="p">130:板體</p>  
        <p type="p">134:蓋體</p>  
        <p type="p">135:環狀體</p>  
        <p type="p">152:空間</p>  
        <p type="p">P:正壓力</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1936" publication-number="202614306"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614306.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614306</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133555</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>塗膠顯影裝置、系統和控制方法</chinese-title>  
        <english-title>GLUE COATING AND DEVELOPING APPARATUS, SYSTEM AND CONTROL METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">H01L21/67</main-classification>  
        <further-classification edition="200601120251222B">G03F7/16</further-classification>  
        <further-classification edition="200601120251222B">G03F7/30</further-classification>  
        <further-classification edition="200601120251222B">G03F7/40</further-classification>  
        <further-classification edition="200601120251222B">G05B19/418</further-classification>  
        <further-classification edition="200601120251222B">B25J9/16</further-classification>  
        <further-classification edition="200601120251222B">G03F7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商瀋陽芯源微電子設備股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENYANG KINGSEMI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程虎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, HU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳艷雙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YANSHUANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王超群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHAOQUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及塗膠顯影裝置、系統和控制方法，該塗膠顯影裝置包括：液處理模組，用於對晶圓進行包括表面塗層和顯影處理的液處理製程；熱處理模組，用於對晶圓進行包括烘烤處理的熱處理製程；層間模組，位於所述液處理模組和所述熱處理模組之間，用於存放晶圓，以銜接所述熱處理製程和液處理製程。該裝置用於提升塗膠顯影裝置中機械手的利用率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a glue coating and developing apparatus, a system and a control method. The glue coating and developing apparatus comprises: a liquid processing module, configured to perform a liquid processing process including a surface coating and a developing treatment on a wafer; a heat processing module, configured to perform a heat-processing process including a baking process on the wafer; and an interlayer module, located between the liquid processing module and the heat processing module, configured to store the wafer, so as to connect the heat-processing process and the liquid processing process. The apparatus is configured to improve a utilization rate of a manipulator in a glue coating and developing device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:晶圓機械手</p>  
        <p type="p">2:機械手</p>  
        <p type="p">3:層間回片機械手</p>  
        <p type="p">11:塗佈機器人</p>  
        <p type="p">16:顯影機器人</p>  
        <p type="p">26:烘烤機械手</p>  
        <p type="p">31:背洗機械手</p>  
        <p type="p">32:正洗機械手</p>  
        <p type="p">33:介面機械手</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1937" publication-number="202613915"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613915.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613915</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133569</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>支付系統、支付方法、存儲介質和程式產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251103B">G06Q20/08</main-classification>  
        <further-classification edition="201201120251103B">G06Q20/16</further-classification>  
        <further-classification edition="201201120251103B">G06Q20/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中國銀聯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳成錢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHENGQIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供支付系統，包括：設置在第一終端的第一應用模組，用於在支付時發送設備碼請求資訊以獲取設備碼，以及示出所獲取的設備碼，所述設備碼請求資訊至少包括用於標識所述第一終端的標識資訊；設置在第二終端的第二應用模組，其讀取所述設備碼，根據所讀取的資訊生成支付資訊，並發送所述支付資訊以待支付，所述支付資訊包括支付訂單和設備碼；設置在服務端的管理應用模組，用於接收所述設備碼請求資訊，根據所述請求資訊生成所述設備碼併發送給所述第一應用；接收所述第二應用模組發送的所述支付資訊並確定候選支付方式；將所述候選支付方式和所述支付訂單發送給所述第一應用；其中，所述第一應用模組根據所述候選支付方式和所述支付訂單進行支付。還提供支付方法、程式產品等。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:第一終端</p>  
        <p type="p">4:第二終端</p>  
        <p type="p">5:服務端</p>  
        <p type="p">30:第一應用</p>  
        <p type="p">40:第二應用</p>  
        <p type="p">50:管理應用</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1938" publication-number="202613895"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613895.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613895</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133585</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>學習系統及方法用以從未標記資料來訓練特定任務的大型語言模型以及非暫態電腦可讀取記錄媒體</chinese-title>  
        <english-title>LEARNING SYSTEM AND METHOD FOR TRAINING TASK-SPECIFIC LARGE LANGUAGE MODEL FROM UNLABELED DATA AND NON-TRANSITORY COMPUTER READABLE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251222B">G06N20/00</main-classification>  
        <further-classification edition="202301120251222B">G06N3/08</further-classification>  
        <further-classification edition="202301120251222B">G06N5/04</further-classification>  
        <further-classification edition="202001120251222B">G06F40/30</further-classification>  
        <further-classification edition="202001120251222B">G06F40/40</further-classification>  
        <further-classification edition="202501120251222B">G06F16/35</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全曜財經資訊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CMONEY TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周子軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, TZU-HSUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宜禎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YI-ZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周俊男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHUN-NAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種學習方法，其包含以下步驟。執行初始化以使用至少一零樣本學習的大型語言模型透過未標記資料集來取得標記集。執行主動學習迴圈以透過該標記集訓練特定任務的大型語言模型。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a learning method, which includes steps as follows. An initialization is performed to use at least one large language model with a zero-shot learning through an unlabeled dataset, so as to derive a labeled set. An active learning loop is performed to train a task-specific large language model through labeled set.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:學習方法</p>  
        <p type="p">101:主動學習模型框架</p>  
        <p type="p">102:預言機</p>  
        <p type="p">111:未標記資料集</p>  
        <p type="p">112:標記集</p>  
        <p type="p">S101~S111:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1939" publication-number="202613400"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613400.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613400</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133589</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>適用於操作件之錨定裝置和含有錨定裝置之窗簾</chinese-title>  
        <english-title>ANCHOR DEVICE FOR AN OPERATING ELEMENT AND WINDOW SHADE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251120B">E06B9/322</main-classification>  
        <further-classification edition="200601120251120B">E06B9/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德侑股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEH YOR CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃忠臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUNG-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵瓊慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種適用於窗簾的操作件之錨定裝置，包括：殼體，為操作件設有通道；第一夾持件，與殼體活動地連接，且具有適於與操作件接合之第一接合部；及第二夾持件，與殼體活動地連接，且具有適於與操作件接合之第二接合部。第一接合部和第二接合部可與操作件接合而使錨定裝置抓緊操作件，且第一接合部和第二接合部為鬆開操作件而可遠離彼此設置，使操作件能夠通過錨定裝置移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An anchor device for an operating element of a window shade includes a casing having a passage of an operating element, a first holding part movably connected to the casing and having a first engaging portion adapted to engage with the operating element, and a second holding part movably connected to the casing and having a second engaging portion adapted to engage with the operating element. The first engaging portion and the second engaging portion are operable to engage with the operating element so that the anchor device holds on to the operating element, and are placed away from each other to release the operating element for movement of the operating element through the anchor device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:錨定裝置</p>  
        <p type="p">102:殼體</p>  
        <p type="p">108:通道</p>  
        <p type="p">110:本體</p>  
        <p type="p">112:蓋體</p>  
        <p type="p">210:操作件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1940" publication-number="202614515"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614515.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614515</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133604</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於高速纜線的電磁干擾（ＥＭＩ）抑制</chinese-title>  
        <english-title>EMI SUPPRESSION FOR HIGH-SPEED CABLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251124B">H01R13/6592</main-classification>  
        <further-classification edition="200601120251124B">H05K9/00</further-classification>  
        <further-classification edition="200601120251124B">H01F1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商斯特華(佛山)磁材有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEWARD (FOSHAN) MAGNETICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何永學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, YONGXUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐濟海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, JIHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宏年</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JACKEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張日勝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YEAT SHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及用於高速纜線的EMI抑制。茲記載EMI吸收器的示例性實施方式，EMI吸收器可操作用於抑制和/或吸收高速纜線的相對高頻率的EMI雜訊，高速纜線是用於從晶片到母板、積體電路封裝到母板、輸入/輸出面板到母板、母板到母板、模組到母板、子系統到母板的互連並且支持高速互連技術標準（例如，周邊組件互連高速第5/6/7代等和電腦高速鏈路3.1等）的纜線。EMI吸收器包括可模製熱塑性EMI吸收器，所述可模製熱塑性EMI吸收器配置為當EMI吸收器位於纜線的一部分或另一部件上時（例如，當EMI吸收器完全地和/或連續地包圍（例如，360度地設置等）纜線的一部分或另一部件時），可操作用於抑制和/或吸收來自纜線或另一部件的包括從5千兆赫至70千兆赫的頻率的EMI雜訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Exemplary embodiments are disclosed of EMI absorbers that are operable for suppressing and/or absorbing EMI noise at relatively high frequencies for high-speed cables, e.g., cables for interconnect from chip to board, integrated circuit (IC) package to board, input/output (I/O) panel to board, board to board, module to board, subsystem to board, supporting high-speed interconnect technology standards, such as Peripheral Component Interconnect Express (PCIe) Gen 5/6/7, etc. and Computer Express Link (CXL) 3.1, etc. In exemplary embodiments, the EMI absorber comprises a moldable thermoplastic EMI absorber configured to be operable for suppressing and/or absorbing EMI noise from a cable or another component including frequencies from 5 gigahertz to 70 gigahertz when the EMI absorber is positioned on a portion of the cable or another component, e.g., when the EMI absorber entirely and/or continuously surrounds (e.g., is disposed 360 degrees around, etc.) the portion of the cable or another component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:EMI抑制熱塑性吸收器</p>  
        <p type="p">204:殼體</p>  
        <p type="p">208:第一可閉合殼體部分</p>  
        <p type="p">212:第二可閉合殼體部分</p>  
        <p type="p">216:第一經模製熱塑性EMI吸收器</p>  
        <p type="p">220:第二經模製熱塑性EMI吸收器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1941" publication-number="202613354"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613354.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613354</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133631</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多端口氣體注入系統及包括該系統之反應器系統</chinese-title>  
        <english-title>MULTI-PORT GAS INJECTION SYSTEM AND REACTOR SYSTEM INCLUDING SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C23C16/455</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬明陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, MINGYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇俊威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, JUNWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>迪摩斯　亞歷山德羅斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEMOS, ALEXANDROS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林興</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴萊特　葛雷葛瑞　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARTLETT, GREGORY MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容揭示一種氣體注入系統、一種包括該氣體注入系統之反應器系統、以及使用該氣體注入系統及反應器系統之方法。該氣體注入系統可用於氣相反應器系統中以獨立地監測及控制耦接至一反應腔室之一氣體注入系統之複數個通道中的氣體流動速率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A gas injection system, a reactor system including the gas injection system, and methods of using the gas injection system and reactor system are disclosed. The gas injection system can be used in gas-phase reactor systems to independently monitor and control gas flow rates in a plurality of channels of a gas injection system coupled to a reaction chamber.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:氣體注入系統</p>  
        <p type="p">202:第一氣體供給管線</p>  
        <p type="p">203:第一氣體源</p>  
        <p type="p">204:第二氣體供給管線</p>  
        <p type="p">205:第二氣體源</p>  
        <p type="p">206:第一氣體歧管</p>  
        <p type="p">207:流量控制器</p>  
        <p type="p">208:第二氣體歧管/流量控制器</p>  
        <p type="p">209:流量控制器/第一氣體出口</p>  
        <p type="p">210:流量控制器/第一氣體出口</p>  
        <p type="p">211:流量控制器/第一氣體出口</p>  
        <p type="p">212:流量控制器/第一氣體出口</p>  
        <p type="p">213:流量控制器/第一氣體出口</p>  
        <p type="p">214:第一氣體出口</p>  
        <p type="p">216:第一氣體出口</p>  
        <p type="p">218:第一氣體出口</p>  
        <p type="p">220:第二氣體出口</p>  
        <p type="p">222:第二氣體出口</p>  
        <p type="p">224:第二氣體出口</p>  
        <p type="p">226:第二氣體出口</p>  
        <p type="p">228:第二氣體出口</p>  
        <p type="p">230:流量感測器/流量計</p>  
        <p type="p">232:流量感測器</p>  
        <p type="p">234:流量感測器</p>  
        <p type="p">236:流量感測器</p>  
        <p type="p">238:流量感測器</p>  
        <p type="p">240:流量感測器</p>  
        <p type="p">242:流量感測器</p>  
        <p type="p">244:流量感測器</p>  
        <p type="p">246:流量感測器</p>  
        <p type="p">248:流量感測器</p>  
        <p type="p">250:氣體閥</p>  
        <p type="p">252:氣體閥</p>  
        <p type="p">254:氣體閥</p>  
        <p type="p">256:氣體閥</p>  
        <p type="p">258:氣體閥</p>  
        <p type="p">260:氣體閥</p>  
        <p type="p">262:氣體閥</p>  
        <p type="p">264:氣體閥</p>  
        <p type="p">266:氣體閥</p>  
        <p type="p">268:氣體閥</p>  
        <p type="p">270:質量流量控制器</p>  
        <p type="p">272:質量流量控制器</p>  
        <p type="p">274:質量流量控制器</p>  
        <p type="p">276:質量流量控制器</p>  
        <p type="p">278:質量流量控制器</p>  
        <p type="p">280:質量流量控制器</p>  
        <p type="p">282:質量流量控制器</p>  
        <p type="p">284:質量流量控制器</p>  
        <p type="p">286:質量流量控制器</p>  
        <p type="p">288:質量流量控制器</p>  
        <p type="p">290:反應腔室</p>  
        <p type="p">292:凸緣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1942" publication-number="202613714"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613714.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613714</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133642</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓印裝置的膜張力控制方法、壓印方法以及裝置</chinese-title>  
        <english-title>METHOD FOR CONTROLLING TENSION OF FILM FOR IMPRINT APPARATUS, METHOD FOR IMPRINT AND APPARATUS THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251226B">G03F1/92</main-classification>  
        <further-classification edition="200601120251226B">B29C59/02</further-classification>  
        <further-classification edition="200601120251226B">B65H23/00</further-classification>  
        <further-classification edition="200601120251226B">G05D15/00</further-classification>  
        <further-classification edition="200601120251226B">G03F9/00</further-classification>  
        <further-classification edition="200601120251226B">H01L21/027</further-classification>  
        <further-classification edition="200601120251226B">G01L1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商吉佳藍科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGALANE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金泰完</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAE WAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權相珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, SANG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金準基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUN KI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種壓印裝置的膜張力控制方法、壓印方法以及裝置。本發明的實施例提供一種壓印裝置的膜張力控制方法，包括：（A）能夠形成模具的膜配置於載物台上的步驟；（B）測定所述膜的張力T的步驟；（C）所述膜配置成與所述載物台上面平行的步驟；以及（D）在所述膜配置成與所述載物台上面平行的期間，支承所述膜的第二輥上升而控制所述膜的張力的步驟，在所述（C）步驟以及所述（D）步驟中所述膜的張力是所述張力T。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100~S106:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1943" publication-number="202613333"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613333.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613333</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133649</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無方向性電磁鋼板及其製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251121B">C22C38/00</main-classification>  
        <further-classification edition="200601120251121B">C22C38/02</further-classification>  
        <further-classification edition="200601120251121B">C21D1/26</further-classification>  
        <further-classification edition="200601120251121B">C21D8/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大久保智幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUBO, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤勇人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, HAYATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>末廣龍一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUEHIRO, RYUICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丸山茂宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARUYAMA, SHIGEHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種具有高磁通密度的無方向性電磁鋼板，並且提出其有利的製造方法。在對以質量%計含有C：0.0050%以下、Si：1.5%～5.0%、Mn：3.0%以下的鋼原材料進行加熱、熱軋、熱軋板退火、冷軋、最終退火來製造無方向性電磁鋼板時，藉由將所述連續鑄造後的鑄片表面溫度至1200℃為止的平均冷卻速度設為30℃/s以上，將所述熱軋前的板坯加熱前後的表面溫度差設為200℃以下，將所述最終退火的環境的露點設為-30℃以下，從而使鋼板表面的內部氧化物的厚度為1.0 μm以下，使距鋼板表面為10 μm的位置處所存在的圓相當徑為0.5 μm～2.5 μm的夾雜物的個數密度N&lt;sub&gt;S&lt;/sub&gt;（個/mm&lt;sup&gt;2&lt;/sup&gt;）成為板厚中心位置處所存在的所述大小的夾雜物的個數密度N&lt;sub&gt;C&lt;/sub&gt;（個/mm&lt;sup&gt;2&lt;/sup&gt;）的1.10倍以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">N&lt;sub&gt;S&lt;/sub&gt;、N&lt;sub&gt;C&lt;/sub&gt;:個數密度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1944" publication-number="202612895"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612895.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612895</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133657</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>壓印方法</chinese-title>  
        <english-title>METHOD FOR IMPRINT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">B29C59/02</main-classification>  
        <further-classification edition="200601120251226B">B65H23/00</further-classification>  
        <further-classification edition="200601120251226B">G03F9/00</further-classification>  
        <further-classification edition="200601120251226B">H01L21/027</further-classification>  
        <further-classification edition="201201120251226B">G03F1/92</further-classification>  
        <further-classification edition="200601120251226B">G05D15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商吉佳藍科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGALANE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金泰完</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, TAE WAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金準基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JUN KI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權相珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, SANG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的實施例提供一種壓印方法，包括：（A）將能夠形成第一作業模具的膜在載物台上配置為從載物台隔開預定距離的步驟；（B）將塗覆有第一樹脂的母模安放於載物台的步驟；（C）將膜配置成與載物台上面相鄰且平行的步驟；（D）將母模的圖案轉印於第一樹脂的步驟；（E）為了形成第一作業模具，使轉印有母模的圖案的第一樹脂固化而附著於膜的步驟；（F）第一輥和第二輥向彼此相反方向移動而通過膜膜的張力從載物台隔開預定距離，從母模分離第一作業模具的步驟；（G）從載物台排出從第一作業模具分離的母模的步驟；（H）在排出母模的載物台安放塗覆有第二樹脂的基板的步驟；以及（I）將第一作業模具的圖案轉印於第二樹脂的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100~S116:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1945" publication-number="202613703"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613703.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613703</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133667</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於整修及驗證用於EUV輻射源之材料容器之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR REFURBISHING AND QUALIFYING A MATERIAL RECEPTACLE FOR AN EUV RADIATION SOURCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251230B">G03F1/22</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASML NETHERLANDS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜珉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>包佛斯　巴特　康奈利斯　安東尼奧斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOVERS, BART CORNELIS ANTONIUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡亦強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於整修其中儲存有程序材料之一材料容器之設備，其包括一支撐框架、一歪斜機構、一安裝結構、一旋轉機構及一存貯器。該歪斜機構耦接至該支撐框架。該安裝結構耦接至該歪斜機構。該歪斜機構使該安裝結構相對於該支撐框架傾斜。該安裝結構支撐該材料容器。該旋轉機構使該材料容器繞不同於該歪斜機構之一旋轉軸線的一軸線旋轉。該存貯器耦接至該支撐框架且自該材料容器接收該程序材料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus for refurbishing a material receptacle having process material stored therein includes a support frame, a tilt mechanism, a mounting structure, a rotation mechanism, and a container. The tilt mechanism is coupled to the support frame. The mounting structure is coupled to the tilt mechanism. The tilt mechanism inclines the mounting structure relative to the support frame. The mounting structure supports the material receptacle. The rotation mechanism rotates the material receptacle about an axis different form a rotational axis of the tilt mechanism. The container is coupled to the support frame and receives the process material from the material receptacle.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:捕集系統整修設備</p>  
        <p type="p">602:支撐框架</p>  
        <p type="p">604:歪斜機構</p>  
        <p type="p">606:安裝結構</p>  
        <p type="p">608:存貯器</p>  
        <p type="p">610:旋轉機構</p>  
        <p type="p">614:重力向量</p>  
        <p type="p">616:材料容器</p>  
        <p type="p">620:出入結構</p>  
        <p type="p">622:出入結構</p>  
        <p type="p">626:伸縮支撐件</p>  
        <p type="p">630:出入結構</p>  
        <p type="p">632:加熱元件</p>  
        <p type="p">634:漏斗結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1946" publication-number="202613027"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613027.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613027</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133673</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合材料、電極及電池</chinese-title>  
        <english-title>COMPOSITE MATERIALS, ELECTRODES AND BATTERIES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120251231B">C01B32/225</main-classification>  
        <further-classification edition="202501120251231B">C01G45/1257</further-classification>  
        <further-classification edition="202501120251231B">C01G53/502</further-classification>  
        <further-classification edition="201001120251231B">H01M4/133</further-classification>  
        <further-classification edition="201001120251231B">H01M4/1391</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＤＥＫＡ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEKA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>谷内亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANIUCHI, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青山洋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOYAMA, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中田祐也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATA, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野原雄太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOHARA, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>近藤諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONDO, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種複合材料，其為薄片化石墨的表面由被覆物質被覆的複合材料，在XRD測定中，前述薄片化石墨的002繞射線的半高寬在0.15˚以上3.00˚以下的範圍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1947" publication-number="202614662"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614662.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614662</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133680</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通訊裝置、控制方法、及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W74/00</main-classification>  
        <further-classification edition="202301120251201B">H04W72/04</further-classification>  
        <further-classification edition="200901120251201B">H04W16/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉川佑生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIKAWA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">可使用依據IEEE802.11規格系列的無線訊框來與其他通訊裝置進行通訊的通訊裝置，係於通訊裝置正在使用於通訊的第1頻寬之第1頻帶中係存在有：基於其他通訊裝置所能支援的第2頻寬而被決定的第2頻帶、和第2頻帶以外的第3頻帶；通訊裝置，係於通訊裝置與包含其他通訊裝置在內的複數個裝置之間所進行的分頻多工通訊中，在第2頻帶的頻率資源是已被分配給其他通訊裝置以外之裝置的情況下，將表示其他通訊裝置是否具有：把所使用之頻帶，從第2頻帶變更成包含第3頻帶之一部分在內的第2頻寬之第4頻帶而進行分頻多工通訊的所定之能力的能力資訊，從其他通訊裝置加以取得；對其他通訊裝置分配頻率資源，並與該其他通訊裝置進行通訊；基於其他通訊裝置不具有所定之能力的事實，而不變更其他通訊裝置所使用之頻帶，並從第2頻帶之中，將頻率資源分配給其他通訊裝置；基於其他通訊裝置具有所定之能力的事實，而從第2頻帶之中，或是令其他通訊裝置所使用之頻帶被變更成第4頻帶然後從第4頻帶之中，將頻率資源分配給其他通訊裝置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:AP</p>  
        <p type="p">111:STA</p>  
        <p type="p">112:STA</p>  
        <p type="p">901:通知</p>  
        <p type="p">902:填補</p>  
        <p type="p">903:計時器</p>  
        <p type="p">904:回應</p>  
        <p type="p">905:回應</p>  
        <p type="p">906:資料</p>  
        <p type="p">907:資料</p>  
        <p type="p">908:確認回應</p>  
        <p type="p">909:確認回應</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1948" publication-number="202614103"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614103.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614103</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133745</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>積層陶瓷電容器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01G4/30</main-classification>  
        <further-classification edition="200601120251229B">H01G4/228</further-classification>  
        <further-classification edition="200601120251229B">H01G4/005</further-classification>  
        <further-classification edition="200601120251229B">B32B3/30</further-classification>  
        <further-classification edition="200601120251229B">H01G4/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商村田製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURATA MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>栗谷淳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURITANI, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邉由紀枝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, YUKIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種在安裝時可抑制焊料向安裝面相反側之面潤濕爬升之積層陶瓷電容器。 &lt;br/&gt;本發明之積層陶瓷電容器10包含：積層體，其具有：沿積層方向相對之第1面及第2面、沿與前述積層方向正交之第1方向相對之第3面及第4面、及沿與前述積層方向及前述第1方向正交之第2方向相對之第5面及第6面；第1外部電極，其配置於第1面上及前述第3面上；第2外部電極，其配置於第1面上及前述第4面上；第3外部電極，其配置於第1面上及前述第3面上；及第4外部電極，其配置於第1面上及前述第4面上。積層體包含第1內部電極及第2內部電極。第1外部電極包含：第1基底層，其與第1內部電極連接；第1薄膜層，其配置於第1面上；及第1表面鍍層。第1外部電極具有位於積層體之內側之第1凹部，第1凹部之第2方向之尺寸較第1方向之尺寸長。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:積層陶瓷電容器</p>  
        <p type="p">12:積層體</p>  
        <p type="p">12a:第1面</p>  
        <p type="p">12b:第2面</p>  
        <p type="p">12c:第3面/面</p>  
        <p type="p">12d:第4面/面</p>  
        <p type="p">12e:第5面/面</p>  
        <p type="p">12f:第6面/面</p>  
        <p type="p">30:外部電極</p>  
        <p type="p">30a:第1外部電極</p>  
        <p type="p">30b:第2外部電極</p>  
        <p type="p">30c:第3外部電極</p>  
        <p type="p">30d:第4外部電極</p>  
        <p type="p">40a1:第1凹部</p>  
        <p type="p">40a2:第1凹部</p>  
        <p type="p">40b1:第1凹部</p>  
        <p type="p">40b2:第1凹部</p>  
        <p type="p">40c2:第1凹部</p>  
        <p type="p">40d2:第1凹部</p>  
        <p type="p">42a1:第2凹部</p>  
        <p type="p">42a2:第2凹部</p>  
        <p type="p">42b1:第2凹部</p>  
        <p type="p">42b2:第2凹部</p>  
        <p type="p">42c2:第2凹部</p>  
        <p type="p">42d2:第2凹部</p>  
        <p type="p">IV-IV,V-V,VI-VI,VII-VII:線</p>  
        <p type="p">L:積層陶瓷電容器之第1方向之尺寸</p>  
        <p type="p">T:積層陶瓷電容器之積層方向之尺寸</p>  
        <p type="p">W:積層陶瓷電容器之第2方向之尺寸</p>  
        <p type="p">x:積層方向</p>  
        <p type="p">y:第1方向</p>  
        <p type="p">z:第2方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1949" publication-number="202613913"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613913.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613913</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133750</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>生產客訴解決的系統</chinese-title>  
        <english-title>SYSTEM FOR SOLVING PRODUCTION CLIENT COMPLAINS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">G06Q10/20</main-classification>  
        <further-classification edition="202301120251103B">G06Q10/063</further-classification>  
        <further-classification edition="201201120251103B">G06Q50/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立虎尾科技大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>雲林縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈金鐘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, CHIN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹炳熾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAN, BING-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡奇璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIR-JANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳勇利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUNG-LI, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOU, HSIN-HONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡文修</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>彰化縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種生產客訴解決的系統，該系統包含有一發現問題手段、原因調查手段以及一暫時或永久解決對策之規劃及執行手段，該發現問題手段係利用一使用者介面輸入於作業現場發現製品生產問題，其就人員、材料、機構、方法(Man, Material, Mechanism, Method，4M)方面進行問題的發現，該原因調查手段係利用以一人工智慧分析模組以WHY、WHY、WHY手法調查作業現場發現的問題，該暫時或永久解決對策之規劃及執行手段，其係用以透過5W1H規劃並執行所發現及調查的製品生產問題。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a system for solving production client complaints having a problem-finding means, a problem-investing means, and a temporary/permanent solution planning and implementing means. The problem-finding means is applied to input a product manufacturing problem in a working field by a user interface to input problems in man, material, mechanism and method (4M). The problem-investing means is applied to invest the problems found in the working field with a manner of WHYWHYWHY by an artificial intelligence analysis module. The temporary/permanent solution planning and implementing means is applied to plane and implement a solution to solve the production problem with a 5W1H manner.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1950" publication-number="202614493"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614493.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614493</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133781</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器及電性配線</chinese-title>  
        <english-title>CONNECTOR AND ELECTRICAL WIRING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251029B">H01R4/50</main-classification>  
        <further-classification edition="200601120251029B">H01R9/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商友華股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOWO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙橋謙太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉浦健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGIURA, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種在較細的導線彼此之間確保電性的連接的連接器及電性配線。本發明的連接器係將第一導線與第二導線電性地連接者，該連接器係具備：機殼；狹縫，係設於前述機殼；以及插入體，係從前述狹縫插入者；在前述機殼或前述插入體之至少一方具有導通區域，該導通區域具有導電性；於前述導通區域中，藉由前述機殼及前述插入體夾持前述第一導線及前述第二導線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a connector and electrical wiring that ensures electrical connection between thin conductors. The connector of the present invention electrically connects a first conductor and a second conductor, and the connector includes: a housing; a slit provided in the housing; and an insert component that is inserted from the slit; wherein at least one of the housing or the insert component on which has a conductive region having conductivity; and the first conductor and the second conductor are sandwiched by the housing and the insert component in the conductive region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:連接器</p>  
        <p type="p">110:機殼</p>  
        <p type="p">110a:正面</p>  
        <p type="p">110b:上表面</p>  
        <p type="p">110d:側面</p>  
        <p type="p">111:導線導引部</p>  
        <p type="p">112:狹縫</p>  
        <p type="p">120:插入體</p>  
        <p type="p">121:插入片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1951" publication-number="202612705"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612705.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612705</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133828</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>５α－還原酶抑制劑的含醇乳液及其製備方法和應用</chinese-title>  
        <english-title>AN ALCOHOL-CONTAINING EMULSION OF 5α-REDUCTASE INHIBITOR AND PREPARATION METHOD AND USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/58</main-classification>  
        <further-classification edition="200601120260102B">A61K9/107</further-classification>  
        <further-classification edition="200601120260102B">A61K47/06</further-classification>  
        <further-classification edition="200601120260102B">A61K47/10</further-classification>  
        <further-classification edition="201701120260102B">A61K47/44</further-classification>  
        <further-classification edition="201701120260102B">A61K47/34</further-classification>  
        <further-classification edition="200601120260102B">A61P17/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商晨笛醫藥科技(上海)有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AURORA CUTIS MEDICAL TECHNOLOGY (SHANGHAI) CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周映聰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YINGCONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉潔秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, JIEXIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張林東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LINDONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒柏舟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, BOZHOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李常輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHANGHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊麗鴛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, LIYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林國鋇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, GUOBEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種5α-還原酶抑制劑的含醇乳液及其製備方法和應用，其中該含醇乳液包含5α-還原酶抑制劑、醇、油相、乳化劑、稀釋劑和促滲劑。本發明的含醇乳液既保留了含醇製劑清爽的膚感，又解決了乙醇破壞乳劑穩定性的技術難題，具有優異的穩定性和透皮性能，適宜在頭皮部位使用，用於雄激素性脫髮的治療。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1952" publication-number="202613888"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613888.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613888</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133843</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於轉換資料布局格式以用於處理的具有轉置器的神經處理器</chinese-title>  
        <english-title>NEURAL PROCESSOR WITH TRANSPOSER FOR CONVERTING DATA LAYOUT FORMAT FOR PROCESSING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251224B">G06N3/063</main-classification>  
        <further-classification edition="200601120251224B">G06F3/06</further-classification>  
        <further-classification edition="200601120251224B">G06F13/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈塔米法爾德　賽義德　卡倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHATAMIFARD, SAYYED KAREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬克爾　傑佛瑞　丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARKER, JEFFREY DEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德爾　湯瑪斯　格雷戈里</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDERL, THOMAS GREGORY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>懷斯　基思　帕特里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WYSS, KEITH PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里歐　迪奧戈　馬丁斯　洛倫科</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REAL, DIOGO MARTINS LOURENCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克里希南　戈庫爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KRISHNAN, GOKUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例係關於一種神經處理器電路，該神經處理器電路經組態以在輸入資料的寬度最後模式與通道最後模式之間切換，以用於更有效率地處理任務。編譯器可判定神經處理器電路有可能藉由使用呈寬度最後格式或通道最後格式的輸入資料來更有效率地執行任務，並編譯指令以啟用或停用神經處理器電路中的轉置器電路。當神經處理器電路處於使用通道最後格式的模式下時，呈寬度最後格式的輸入資料在饋送至該神經處理器電路的一或多個神經引擎中之前經轉置成呈通道最後格式的經轉置輸入資料，且由一或多個神經引擎產生的輸出資料亦經轉置回寬度最後格式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure relate to a neural processor circuit configured to switch between a width-last mode and a channel-last mode of input data for more efficient processing of tasks. A compiler may determine whether the neural processor circuit is likely to perform a task more efficiently by using the input data in a width-last format or the channel-last format and compiles instructions to enable or disable a transposer circuit in the neural processor circuit. When the neural processor circuit is in a mode that uses the channel-last format, the input data in the width-last format is transposed into transposed input data in the channel-last format before being fed into one or more neural engines of the neural processor circuit, and output data generated by the one or more neural engines are also transposed back into the width-last format.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">218:神經處理器電路</p>  
        <p type="p">230:系統記憶體</p>  
        <p type="p">310:神經任務管理器</p>  
        <p type="p">314,314A~314N:神經引擎</p>  
        <p type="p">318:資料緩衝器</p>  
        <p type="p">320:緩衝器DMA</p>  
        <p type="p">322,322A~322N:輸入資料</p>  
        <p type="p">324:核心直接記憶體存取(DMA)</p>  
        <p type="p">326,326A~326N:核心資料</p>  
        <p type="p">328:輸出資料</p>  
        <p type="p">328A-328N</p>  
        <p type="p">332:轉置器</p>  
        <p type="p">336:編譯器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1953" publication-number="202614725"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614725.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614725</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133859</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251120B">H05K7/20</main-classification>  
        <further-classification edition="200601120251120B">G06F1/20</further-classification>  
        <further-classification edition="200601120251120B">F04D29/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁寶電腦工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMPAL ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古京讓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KU, CHIN-RANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何君逸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, CHUN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾雅惠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, YA-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍千盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAN, CHIEN-SHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張駿揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, CHUN-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YEN-KANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李季鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JIH-HOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括機體、風扇、散熱鰭片及風扇蓋。機體具有底面、連接底面的側面、貫穿底面的第一開口以及貫穿側面的第二開口。風扇設置於機體內，且具有對位於第一開口的入風口和對位於第二開口的出風口。散熱鰭片設置於機體內，且位於出風口與第二開口之間。風扇蓋可拆地安裝於第一開口，且包括蓋部與除塵部。蓋部適於覆蓋第一開口，且設有進氣孔。除塵部連接於蓋部，並插置於出風口與散熱鰭片之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device including a housing, a fan, heat dissipating fin, and a fan cover is provided. The housing has a bottom surface, a side surface connected to the bottom surface, a first opening penetrating the bottom surface, and a second opening penetrating the side surface. The fan is disposed within the housing and includes an air inlet aligned with the first opening and an air outlet aligned with the second opening. The heat-dissipating fin is disposed within the housing and are located between the air outlet and the second opening. The fan cover is detachably mounted to the first opening and includes a cover portion and a dust-removing portion. The cover portion is adapted to cover the first opening and is provided with air intake holes. The dust-removing portion is connected to the cover portion and is inserted between the air outlet and the heat-dissipating fin.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">110:機體</p>  
        <p type="p">111:底面</p>  
        <p type="p">111a:第一開口</p>  
        <p type="p">112b:側面</p>  
        <p type="p">113b:第二開口</p>  
        <p type="p">114:腳墊</p>  
        <p type="p">120:風扇</p>  
        <p type="p">121:入風口</p>  
        <p type="p">122b:出風口</p>  
        <p type="p">130b:散熱鰭片</p>  
        <p type="p">140:風扇蓋</p>  
        <p type="p">141:蓋部</p>  
        <p type="p">141a:進氣孔</p>  
        <p type="p">142b:除塵部</p>  
        <p type="p">1422:連通開口</p>  
        <p type="p">143:腳墊蓋部</p>  
        <p type="p">143a:輔助腳墊</p>  
        <p type="p">H1:第一高度差</p>  
        <p type="p">H2:第二高度差</p>  
        <p type="p">H3:第三高度差</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1954" publication-number="202613150"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613150.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613150</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133862</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種用於急性心肌梗塞檢測的蛋白抗原組合及應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">C07K14/47</main-classification>  
        <further-classification edition="200601120251001B">C07K14/71</further-classification>  
        <further-classification edition="200601120251001B">G01N33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海先賽生物科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹利勤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明屬於生物檢測領域，具體涉及一種用於急性心肌梗塞檢測的蛋白抗原組合及應用。具體技術方案包括：一種抗原組合，所述抗原組合中至少包括cTnI（31至164）蛋白質片段，所述cTnI（31至164）蛋白質片段的胺基酸序列如SEQ ID NO：1所示。本發明提供了可用於檢測急性心肌梗塞的抗原組合物，檢測特異性和敏感性較理想，並可根據需要進一步製備為相關試劑或套組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1955" publication-number="202613650"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613650.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613650</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133894</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學系統裝置及光學元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250916B">G02B13/00</main-classification>  
        <further-classification edition="202101120250916B">G02B7/02</further-classification>  
        <further-classification edition="200601120250916B">G02B3/02</further-classification>  
        <further-classification edition="202001120250916B">G01S17/894</further-classification>  
        <further-classification edition="200601120250916B">G01S7/481</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＣＩＶＡＸ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCIVAX CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>縄田晃史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAWATA, AKIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>北山清章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KITAYAMA, KIYOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田中覚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAKA, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提使一種光學系統裝置及光學元件，其無剝離的問題，且可自由地組合第一光學元件與第二光學元件。本發明包括：第一光學元件1，具有週期性地排列的線狀的凹透鏡11；第二光學元件2，具有沿與凹透鏡11正交的方向週期性地排列的線狀的凸透鏡21；以及照射部3，自第一光學元件1側照射波長λ的光，凹透鏡11與凸透鏡21相向地配置，若將m、n設為1以上的自然數，將凹透鏡11的焦距設為f&lt;sub&gt;1&lt;/sub&gt;，將凸透鏡21的焦距設為f&lt;sub&gt;2&lt;/sub&gt;，將凹透鏡11的間距設為P&lt;sub&gt;1&lt;/sub&gt;，將凸透鏡21的間距設為P&lt;sub&gt;2&lt;/sub&gt;，則照射部3與凹透鏡11的第一焦點面111的距離L&lt;sub&gt;1&lt;/sub&gt;、照射部3與凸透鏡21的第二焦點面211的距離L&lt;sub&gt;2&lt;/sub&gt;滿足下述式1及式2。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="448px" width="2272px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="448px" width="2272px" file="ed10002.jpg" alt="ed10002.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一光學元件</p>  
        <p type="p">2:第二光學元件</p>  
        <p type="p">3:照射部</p>  
        <p type="p">7:光源</p>  
        <p type="p">11:凹透鏡</p>  
        <p type="p">19、29:基板(基材)</p>  
        <p type="p">21:凸透鏡</p>  
        <p type="p">111:第一焦點面</p>  
        <p type="p">211:第二焦點面</p>  
        <p type="p">f&lt;sub&gt;1&lt;/sub&gt;、f&lt;sub&gt;2&lt;/sub&gt;:焦距</p>  
        <p type="p">L&lt;sub&gt;1&lt;/sub&gt;、L&lt;sub&gt;2&lt;/sub&gt;:距離</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1956" publication-number="202614236"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614236.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614236</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133996</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝基板及其製造方法</chinese-title>  
        <english-title>PACKAGING SUBSTRATE AND METHODS OF FABRICATING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">H01L21/56</main-classification>  
        <further-classification edition="200601120251222B">H01L23/28</further-classification>  
        <further-classification edition="200601120251222B">H05K1/03</further-classification>  
        <further-classification edition="202501120251222B">H10D86/00</further-classification>  
        <further-classification edition="200601120251222B">B32B27/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛玻索立克公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABSOLICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金惠珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYEJIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申東俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, DONGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">根據實施方式的封裝基板包括：芯層；第一導電層，其為與上述芯層的上表面相接佈置的導電層；及附著增強層，佈置在上述芯層上且包繞上述第一導電層的至少一部分。附著增強層包括選自由矽類化合物、丙烯酸類化合物及其組合組成的組中的一種。第一導電層的上表面的算術平均粗糙度Ra值為150nm以下。在此情況下，能夠在不使第一導電層過度粗糙化的同時有效提高第一導電層與絕緣層之間附著力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A packaging substrate according to the present disclosure comprises a core layer; a first conductive layer, which is a conductive layer disposed in contact with an upper surface of the core layer; and an adhesion reinforcement layer disposed on the core layer and surrounding at least a portion of the first conductive layer. The adhesion reinforcement layer comprises any one selected from the group consisting of a silicon-based compound, an acrylic-based compound, and a combination thereof. An arithmetic average roughness (Ra) value of the upper surface of the first conductive layer is 150 nm or less. In this case, it is possible to effectively improve the adhesion strength of the insulating layer to the first conductive layer without excessively roughening the first conductive layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:封裝基板</p>  
        <p type="p">10:芯層</p>  
        <p type="p">20:第一導電層</p>  
        <p type="p">30:附著增強層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1957" publication-number="202613281"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613281.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613281</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114133998</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藥液、基板之處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">C09K13/06</main-classification>  
        <further-classification edition="200601120251223B">C07C317/02</further-classification>  
        <further-classification edition="200601120251223B">G03F7/42</further-classification>  
        <further-classification edition="200601120251223B">C11D7/32</further-classification>  
        <further-classification edition="200601120251223B">C11D11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋智威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, TOMONORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杉島泰雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGISHIMA, YASUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種光阻剝離性優異的藥液。本發明之藥液用作半導體器件用光阻剝離液，係含有二甲基亞碸、單乙醇胺、及二乙二醇胺，二甲基亞碸的含量相對於藥液的總質量為50.0～90.0質量%，單乙醇胺的含量相對於藥液的總質量為5.0～25.0質量%，二乙二醇胺的含量相對於藥液的總質量為5.0～25.0質量%。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1958" publication-number="202614547"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614547.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614547</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134022</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>控制電路及開關電源</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200701120251201B">H02M1/42</main-classification>  
        <further-classification edition="200601120251201B">H02M3/156</further-classification>  
        <further-classification edition="200601120251201B">H02M7/217</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商新電元工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>品川盛治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINAGAWA, SEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久田茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HISADA, SHIGERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種控制電路，其能夠防止開關電源的功率因數下降，以及總諧波失真率（THD）惡化。&lt;br/&gt; 本發明的控制電路包括：定時器電容器，其上施加有COMP定時器電壓Vct，該電壓從規定的定時器充電開始下限電壓Vll開始上升，並在經過規定時間後下降回定時器充電開始下限電壓Vll，其中，當COMP定時器電壓Vct從定時器充電開始下限電壓Vll開始上升時，控制電路使開關元件Q導通，當COMP電壓達到COMP定時器電壓Vct時，控制電路使開關元件Q關斷，通過調整定時器充電開始下限電壓Vll，來控制開關元件的導通期間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:控制電路</p>  
        <p type="p">110:回饋控制部</p>  
        <p type="p">112:誤差放大器</p>  
        <p type="p">120:定時器電容器</p>  
        <p type="p">130:比較器</p>  
        <p type="p">140:定時器電容器充放電電流控制部</p>  
        <p type="p">150:運算部</p>  
        <p type="p">160:定時器基準電壓設定部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1959" publication-number="202613552"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613552.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613552</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134070</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>搬送裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">G01N35/04</main-classification>  
        <further-classification edition="200601120251231B">G01N35/02</further-classification>  
        <further-classification edition="200601120251231B">B65G17/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商藍伊精機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AOI SEIKI CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤照明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITOH, TERUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]提供一種可以提升搬送力之搬送裝置。&lt;br/&gt; [解決手段]一形態之搬送裝置是構成為可配置複數個將檢體容器以立位狀態保持並且具備第1磁鐵之保持器，且前述搬送裝置具有進給構件，前述進給構件具備在與第1磁鐵之間產生吸引力之第2磁鐵，並且沿著搬送路移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:檢體處理裝置</p>  
        <p type="p">10:搬送裝置</p>  
        <p type="p">12:構件</p>  
        <p type="p">20:處理部</p>  
        <p type="p">30:輸送機機構</p>  
        <p type="p">31a:搬送路</p>  
        <p type="p">70:檢體容器</p>  
        <p type="p">80:檢體保持器(保持器)</p>  
        <p type="p">100:控制部</p>  
        <p type="p">X,Y:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1960" publication-number="202613524"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613524.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613524</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134078</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>異物檢查裝置及異物檢查方法</chinese-title>  
        <english-title>FOREIGN MATTER INSPECTION DEVICE AND FOREIGN MATTER INSPECTION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251008B">G01N21/47</main-classification>  
        <further-classification edition="200601120251008B">G01N21/88</further-classification>  
        <further-classification edition="200601120251008B">G01N21/01</further-classification>  
        <further-classification edition="200601120251008B">G01J3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商堀場製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORIBA, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>傅行健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FU, XINGJIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>神﨑豊樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANZAKI, TOYOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>染谷翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOMEYA, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種異物檢查裝置，對附著於具有透光性的膜的異物進行檢測，所述異物檢查裝置構成為包括：檢查光照射部，自多個方向對位於規定的檢查位置的所述異物照射P偏振光的檢查光及S偏振光的檢查光；散射光檢測部，檢測由自所述多個方向的各者照射的所述P偏振光的檢查光產生的第一散射光、及由自所述多個方向的各者照射的所述S偏振光的檢查光產生的第二散射光；以及判定部，基於所述散射光檢測部檢測出的所述第一散射光的強度及所述第二散射光的強度，判定所述異物是附著於所述膜的其中一個面還是附著於另一個面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A foreign matter inspection device detects foreign matter attached to a light-transmitting film. The foreign matter inspection device includes: an inspection light irradiation unit for irradiating a foreign matter located at a predetermined inspection position with P-polarized inspection light and S-polarized inspection light from multiple directions; a scattered light detection unit for detecting first scattered light generated by the P-polarized inspection light irradiated from each of the multiple directions, and second scattered light generated by the S-polarized inspection light irradiated from each of the multiple directions; and a determination unit for determining whether the foreign matter is attached to one surface or the other surface of the film based on the intensities of the first scattered light and the second scattered light detected by the scattered light detection unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:散射光檢測部</p>  
        <p type="p">21a、21b、21c:雷射光照射器</p>  
        <p type="p">A、B、C:方向</p>  
        <p type="p">F:膜</p>  
        <p type="p">K:異物</p>  
        <p type="p">LB:雷射光</p>  
        <p type="p">SP:檢查位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1961" publication-number="202613506"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613506.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613506</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134120</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>ＰＷＭ輸出溫度感測裝置和包括該裝置的驅動器</chinese-title>  
        <english-title>PWM OUTPUT TEMPERATURE SENSING DEVICE, AND DRIVER INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">G01K7/16</main-classification>  
        <further-classification edition="200601120251226B">G01K7/25</further-classification>  
        <further-classification edition="200601120251226B">H03K7/08</further-classification>  
        <further-classification edition="200601120251226B">H03K3/03</further-classification>  
        <further-classification edition="200701120251226B">H02M1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾瓦雷斯　亞歷克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALVAREZ, ALEX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇圖拉　斯捷潘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUTULA, STEPAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>ES</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種裝置，包括週期性指數衰減訊號生成電路和脈寬調變(PWM)生成電路。週期性指數衰減訊號生成電路被配置為生成週期性指數衰減訊號。在週期性指數衰減訊號的每個週期中，週期性指數衰減訊號從第一參考電壓連續地指數衰減到第二參考電壓。PWM生成電路被配置為接收熱敏電阻的溫度回應和週期性指數衰減訊號，並且根據溫度回應和週期性指數衰減訊號生成指示熱敏電阻的感測溫度的PWM輸出溫度感測訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A device includes a periodic exponential decay signal generating circuit and a pulse-width modulated (PWM) generating circuit. The periodic exponential decay signal generating circuit is configured to generate a periodic exponential decay signal. The periodic exponential decay signal continuously and exponentially decays from an upper reference voltage to a lower reference voltage in each period of the periodic exponential decay signal. The PWM generating circuit is configured to receive a temperature response of a thermistor and the periodic exponential decay signal, and to generate, according to the temperature response and the periodic exponential decay signal, a PWM output temperature sensing signal indicating sensed temperature of the thermistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:PWM輸出溫度感測裝置</p>  
        <p type="p">110:週期性指數衰減訊號生成電路</p>  
        <p type="p">120:PWM生成電路</p>  
        <p type="p">130:非線性溫度感測電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1962" publication-number="202612802"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612802.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612802</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134125</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>管道清潔機器人</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B08B9/049</main-classification>  
        <further-classification edition="200601120251229B">B08B9/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＳＯＬＡＲＩＳ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOLARIS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡部格生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, ITARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田上賢悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAGAMI, KENGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>横山和也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOKOYAMA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種管道清潔機器人（1），具有：機器人本體（10）以及設置在機器人本體（10）外周的清掃體（20）。管道清潔機器人（1）構成為清掃體（20）的外周端（20a）受到朝向軸向一側的外力時產生的第1反作用力，比清掃體（20）的外周端（20a）受到朝向軸向另一側的外力時產生的第2反作用力更大，清掃體（20）由刷子構成，在機器人本體（10）的清掃體（20）的軸向的一側安裝有限制清掃體（20）朝向軸向的一側傾斜的限制體（21）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:管道清潔機器人</p>  
        <p type="p">2:管</p>  
        <p type="p">3:異物</p>  
        <p type="p">10:機器人本體</p>  
        <p type="p">20:清掃體</p>  
        <p type="p">20a:外周端</p>  
        <p type="p">21:限制體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1963" publication-number="202612839"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612839.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612839</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134138</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>建構化裂紋尖端應力場</chinese-title>  
        <english-title>ARCHITECTED CRACK TIP STRESS FIELD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B23P6/04</main-classification>  
        <further-classification edition="202001120251229B">G06F30/23</further-classification>  
        <further-classification edition="202001120251229B">G06F30/17</further-classification>  
        <further-classification edition="200601120251229B">B23B35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商西屋電器公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WESTINGHOUSE ELECTRIC COMPANY LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赫爾　Ｊ　布萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HALL, J. BRIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文中揭示一種用於改良一裂紋尖端之表觀斷裂韌度之方法。該方法可包含判定一裂紋存在於一表面上，該裂紋包含一裂紋尖端，且該表面包含一材料。該方法可進一步包含判定與材料相關聯之複數個參數。該方法可進一步包含基於在該表面安置之一組件之一幾何形狀、該裂紋之一幾何形狀或與該材料相關聯之該複數個參數之至少一者執行有限元素分析(FEA)。該方法可進一步包含基於該所執行FEA判定包括待自該表面選擇性移除之一孔或一槽之至少一者之一設計。該方法可進一步包含自該表面選擇性移除該孔或該槽之該至少一者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for improving apparent fracture toughness of a crack tip is disclosed herein. The method can include determining a crack is present on a surface, the crack including a crack tip, and the surface including a material. The method can further include determining a plurality of parameters associated with material. The method can further include performing finite element analysis (FEA) based on at least one of a geometry of a component for which the surface is disposed, a geometry of the crack, or the plurality of parameters associated with the material. The method can further include determining a design comprising at least one of a hole or a slot to be selectively removed from the surface based on the performed FEA. The method can further include selectively removing the at least one of the hole or the slot from the surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:裂紋</p>  
        <p type="p">202:孔</p>  
        <p type="p">204:裂紋尖端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1964" publication-number="202613322"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613322.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613322</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134226</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鐵水的精煉方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251112B">C21C5/28</main-classification>  
        <further-classification edition="200601120251112B">C21C7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本真慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上周大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, SHUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種鐵水的精煉方法，其適合於使用了固體鐵原料的精煉。鐵水的精煉方法包括：裝入工序，將固體鐵原料、CaO溶劑及熔融生鐵裝入轉爐中而製成鐵水；第一吹煉工序，向所述轉爐的所述鐵水供給氧；排渣工序，將所述第一吹煉工序中生成的爐渣自所述轉爐排出；第二吹煉工序，向進行了所述排渣工序後的所述轉爐中殘留的所述鐵水供給所述氧；以及排出工序，將進行了所述第二吹煉工序的所述鐵水排出。在所述第一吹煉工序及所述第二吹煉工序中的任一者中添加包含Si的升溫材料，且在添加所述升溫材料的所述第一吹煉工序及所述第二吹煉工序中，以使所述鐵水的Si含量成為0.8質量%以上且1.9質量%以下的方式添加所述升溫材料。在所述第一吹煉工序及所述第二吹煉工序中的至少一者中，向所述轉爐裝入所述固體鐵原料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S01、S02、S03、S04、S05、S06:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1965" publication-number="202614267"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614267.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614267</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134237</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於以基板為基礎之製程條件量測裝置之覆蓋最佳化</chinese-title>  
        <english-title>COVER OPTIMIZATION FOR SUBSTRATE-BASED PROCESS CONDITION MEASUREMENT DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/66</main-classification>  
        <further-classification edition="200601120251230B">H01L21/67</further-classification>  
        <further-classification edition="200601120251230B">G01D11/24</further-classification>  
        <further-classification edition="200601120251230B">G01D21/02</further-classification>  
        <further-classification edition="202101120251230B">G01K1/08</further-classification>  
        <further-classification edition="200601120251230B">G01D5/00</further-classification>  
        <further-classification edition="200601120251230B">H01L23/48</further-classification>  
        <further-classification edition="200601120251230B">H01L23/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奎利　伐漢特　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QULI, FARHAT A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　景</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪赫茲恩　拉茲赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAHZOON, RAZIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種製程條件量測裝置，其可包含一基板及一蓋。該蓋可覆蓋該基板以保護感測器及互連件使之免受一製程環境，諸如免受腐蝕性氣體、電漿及射頻信號之影響。該蓋可露出該基板之部分以改良該基板之熱機械行為。該蓋可藉由自該等感測器及互連件偏移之空白貫穿孔露出該基板之部分。該蓋亦可藉由穿過該蓋形成之溝槽露出該基板之部分。該製程條件量測裝置亦可包含形成於該等互連件上之一薄膜。該薄膜可保護互連件使之免受該製程環境之影響。該等空白貫穿孔、該等溝槽及該等薄膜可分開或組合使用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process condition measurement device may include a substrate and a cover. The cover may cover the substrate to protect sensors and interconnects from a process environment, such as from corrosive gases, plasma, and radio frequency signals. The cover may uncover portions of the substrate to improve the thermo-mechanical behavior of the substrate. The cover may uncover portions of the substrate by blank-through holes which are offset from the sensors and interconnects. The cover may also uncover portions of the substrate by grooves formed through the cover. The process condition measurement device may also include a thin-film which is formed over the interconnects. The thin-film may protect interconnects from the process environment. The blank-through holes, the grooves, and the thin-films may be used separately or in combination.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:製程條件量測裝置</p>  
        <p type="p">102:基板</p>  
        <p type="p">104:蓋</p>  
        <p type="p">108:組件封裝</p>  
        <p type="p">114:互連件</p>  
        <p type="p">118:封裝貫穿孔</p>  
        <p type="p">120:空白貫穿孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1966" publication-number="202613862"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613862.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613862</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134282</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>KECCAK操作指定指令</chinese-title>  
        <english-title>KECCAK-OPERATION-SPECIFYING INSTRUCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120251201B">G06F21/71</main-classification>  
        <further-classification edition="201801120251201B">G06F9/30</further-classification>  
        <further-classification edition="200601120251201B">H04L9/06</further-classification>  
        <further-classification edition="200601120251201B">H04L9/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＡＲＭ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARM LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>博徹　馬蒂亞斯洛塔爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOETTCHER, MATTHIAS LOTHAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文森　雨果約翰馬汀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VINCENT, HUGO JOHN MARTIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NZ</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬汀諾　迪迪埃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTINOT, DIDIER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種設備包含：指令解碼電路系統，其經組態以根據一指令集架構來解碼指令；及處理電路系統，其經組態以回應於由該指令解碼電路系統解碼的該等指令而執行資料處理。該處理電路系統包含Keccak輪次運算電路系統，其經組態以回應於該指令解碼電路系統解碼一Keccak操作指定指令而執行一原子操作，該原子操作包含應用於表示工作狀態資料元素的一陣列的Keccak狀態資訊的一Keccak函數的至少一個輪次，以產生該陣列的各工作狀態資料元素的經更新值。在該Keccak函數的一給定輪次中，該Keccak輪次運算電路系統基於基於與該Keccak操作指定指令相關聯的一輪次常數指定值選擇的一輪次常數，來更新該陣列的至少一個工作狀態資料元素。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus comprises instruction decoding circuitry configured to decode instructions according to an instruction set architecture; and processing circuitry configured to perform data processing in response to the instructions decoded by the instruction decoding circuitry. The processing circuitry comprises Keccak round computation circuitry configured to perform, in response to the instruction decoding circuitry decoding a Keccak-operation-specifying instruction, an atomic operation comprising at least one round of a Keccak function applied to Keccak state information representing an array of working state data elements, to generate updated values for each working state data element of the array. In a given round of the Keccak function, the Keccak round computation circuitry updates at least one working state data element of the array based on a round constant selected based on a round constant specifying value associated with the Keccak-operation-specifying instruction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">6:處理電路系統</p>  
        <p type="p">8:暫存器；暫存器儲存器</p>  
        <p type="p">9:Keccak輪次運算電路系統；Keccak功能單元</p>  
        <p type="p">10:設備；中央處理單元(CPU)；PE；記憶體存取請求器；資料處理設備</p>  
        <p type="p">13:指令解碼電路系統；解碼級</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1967" publication-number="202613134"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613134.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613134</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134285</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種手性劑化合物及包含其的膽甾相液晶組合物與應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">C07D493/04</main-classification>  
        <further-classification edition="200601120251001B">C09K19/34</further-classification>  
        <further-classification edition="200601120251001B">C09K19/32</further-classification>  
        <further-classification edition="200601120251001B">C09K19/12</further-classification>  
        <further-classification edition="200601120251001B">C09K19/58</further-classification>  
        <further-classification edition="200601120251001B">C09K19/30</further-classification>  
        <further-classification edition="200601120251001B">G02F1/1337</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商石家莊誠志永華顯示材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIJIAZHUANG CHENGZHI YONGHUA DISPLAY MATERIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巨鵬瑤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JU, PENG-YAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜開陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, KAI-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張虎波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, HU-BO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬彥濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, YAN-TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫新戰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, XIN-ZHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王璐璐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LU-LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種光敏手性劑化合物S、包含其的膽甾相液晶組合物、該的膽甾相液晶組合物在液晶顯示元件和液晶顯示器中的應用。該光敏手性劑化合物S具有兼顧高的HTP值、具有良好的溶解度同時轉化時間快的性能，包含該光敏手性劑化合物S的膽甾相液晶組合物具有高反射率保持率，確保R GB顏色均勻，無需繁瑣的圖元設計；低的黏度，確保其可適配現有的大規模面板製備工藝；快的UV變色速度，減少了UV製成時間，降低了生產成本，可以廣泛應用於液晶電子書，戶外和車載顯示等光學器件中。&lt;br/&gt;&lt;img align="absmiddle" height="143px" width="524px" file="ed10219.JPG" alt="ed10219.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1968" publication-number="202614500"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614500.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614500</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134303</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>連接器之浮動機構</chinese-title>  
        <english-title>FLOATING MECHNISM FOR ALIGNED MATE OF ELECTRICAL CONNECTORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251002B">H01R13/05</main-classification>  
        <further-classification edition="200601120251002B">H01R13/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英屬開曼群島商鴻騰精密科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOXCONN INTERCONNECT TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>KY</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐國峻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, KUO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種連接器之浮動機構，包括收容腔及多個導向凹部，以及金屬框架與彈性組件；所述收容腔及導向凹部設置在一設備中，每一導向凹部具有錐形內壁面；所述金屬框架內緊密配合有至少一插頭連接器，所述連接器設有對接方向；所述金屬框架收容在收容腔內，且金屬框架由彈性組件推動而沿對接方向向前移動，金屬框架設有位於對應導向凹部內的導向柱，導向柱能夠沿著所述導向凹部的錐形內壁面移動而導正所述金屬框架。本發明的導向柱與導向凹部的配合，以及彈性組件的配合，達成連接器的浮動，可以即時精準對位，避免連接器的對接破壞。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A floating mechanism for aligned mating of electrical connector, includes: a receiving cavity and plural caves defined in a device; and a frame fitly retained with a plug connector defining a mating direction, and pushed to move forwards in the mating direction by a spring member located behind the frame. The frame has guiding rods, each of the caves has conical insides, the guiding rods are capable of shifting along corresponding conical insides of the caves. Therefore, a precise position in order to align a plug connector and a receptacle connector is got.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:金屬框架</p>  
        <p type="p">141:頂面</p>  
        <p type="p">143:前表面</p>  
        <p type="p">15:導向柱</p>  
        <p type="p">16:通孔</p>  
        <p type="p">31:上基座</p>  
        <p type="p">32:下基座</p>  
        <p type="p">34:限位柱</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1969" publication-number="202614817"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614817.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614817</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134305</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括原位摻雜超晶格間隔層的溝槽式　MOSFET　(TFET)　裝置及其相關方法</chinese-title>  
        <english-title>TRENCH MOSFET (TFET) DEVICES INCLUDING IN-SITU DOPED SUPERLATTICE SPACER AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251222B">H10D30/60</main-classification>  
        <further-classification edition="202501120251222B">H10D30/63</further-classification>  
        <further-classification edition="202501120251222B">H10D62/81</further-classification>  
        <further-classification edition="202501120251222B">H10D64/27</further-classification>  
        <further-classification edition="202501120251222B">H01L21/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商安托梅拉公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ATOMERA INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹內秀樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEUCHI, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　書宜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, SHUYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳絲倩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭建中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種溝槽式場效電晶體(TFET)，可包括：一半導體層，其內部具有一溝槽，以及該半導體層中之一超晶格層，其沿着該溝槽的底部及側壁部分延伸。該超晶格層可包括複數個堆疊之層群組，各層群組包含複數個堆疊的基底半導體單層界定出一基底半導體部分，以及至少一非半導體單層，且各層群組的各至少一非半導體單層被侷限在相鄰基底半導體部分之一晶格中。該溝槽式場效電晶體可更包括源極區及汲極區，其沿着該超晶格層界定出一通道區，該通道區在該源極區及該汲極區之間延伸；以及該溝槽內部之一閘極，其包括襯覆該溝槽之一閘極絕緣體及該閘極絕緣體內部之一閘電極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A trench field effect transistor (TFET) may include a semiconductor layer having a trench therein, and a superlattice layer in the semiconductor layer extending along bottom and sidewall portions of the trench. The superlattice layer may include a plurality of stacked groups of layers, with each group of layers comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion and at least one non-semiconductor monolayer, and each at least one non-semiconductor monolayer of each group of layers being constrained within a crystal lattice of adjacent base semiconductor portions. The TFET may further include source and drain regions defining, along with the superlattice layer, a channel region extending between the source and drain regions, and a gate within the trench comprising a gate insulator lining the trench and a gate electrode within the gate insulator.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">55:溝槽式場效電晶體</p>  
        <p type="p">60:半導體層或基板</p>  
        <p type="p">61:源極區</p>  
        <p type="p">62:漂移區</p>  
        <p type="p">63:汲極區</p>  
        <p type="p">64:多晶矽閘電極</p>  
        <p type="p">65:閘極絕緣體</p>  
        <p type="p">66:通道區</p>  
        <p type="p">67:本體區</p>  
        <p type="p">68:屏蔽閘電極</p>  
        <p type="p">125:超晶格層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1970" publication-number="202613140"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613140.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613140</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134385</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>新穎化合物、使用其的製備方法、包含其的前驅物及使用其的薄膜的製備方法</chinese-title>  
        <english-title>NOVEL COMPOUNDS, PREPARING METHOD OF USING THE SAME, PRECURSOR INCLUDING THE SAME, AND PREPARING METHOD OF THIN FILM USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C07F5/00</main-classification>  
        <further-classification edition="200601120251103B">C23C16/40</further-classification>  
        <further-classification edition="200601120251103B">C23C16/455</further-classification>  
        <further-classification edition="202501120251103B">H10D30/67</further-classification>  
        <further-classification edition="202501120251103B">H10D99/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商韓松化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANSOL CHEMICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李炫炅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYUN-KYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔貞仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JEONG-IN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳大元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RYU, DAE-WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>昔壯衒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEOK, JANG-HYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廉圭玄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEOM, KYU-HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>文基寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUN, KI-YEUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於可實現薄膜沉積的化合物，具體地，係關於一種可應用於原子層沉積法(Atomic Layer Deposition；ALD)或化學氣相沉積法(Chemical Vapor Deposition；CVD)且反應性、揮發性及熱穩定性優異的新穎化合物、上述化合物的製備方法、包含上述化合物的前驅物化合物及利用上述前驅物化合物的薄膜的製備方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1971" publication-number="202612798"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612798.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612798</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134416</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">B08B3/04</main-classification>  
        <further-classification edition="200601120251226B">B08B3/08</further-classification>  
        <further-classification edition="200601120251226B">H01L21/67</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊豆田崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IZUTA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於實現能夠抑制因供處理基板之處理液與供洗淨過濾器之處理液混合所致之不良狀況之基板處理裝置。 &lt;br/&gt;本發明之基板處理裝置(100)包含：循環配管(21)，其包含分支成第1分支配管與第2分支配管之2個配管之部分；過濾器(53)，其過濾第1處理液，至少設置於第1分支配管；及控制器(73)，其進行朝第1分支配管逆向流動第2處理液，其後，朝第1分支配管逆向流動第3處理液之第1洗淨處理，在第1洗淨處理後朝第1分支配管順向流動第1處理液。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:基板處理槽(基板處理部)</p>  
        <p type="p">3:內槽</p>  
        <p type="p">5:外槽</p>  
        <p type="p">11:升降機</p>  
        <p type="p">13:第1處理液供給部</p>  
        <p type="p">15:第1處理液供給管</p>  
        <p type="p">17:控制閥</p>  
        <p type="p">18:液位感測器</p>  
        <p type="p">19:上流式管</p>  
        <p type="p">21:循環配管</p>  
        <p type="p">21a:第1分支點</p>  
        <p type="p">21b:第2分支點</p>  
        <p type="p">23:控制閥</p>  
        <p type="p">25:第1切換部</p>  
        <p type="p">26:第2切換部</p>  
        <p type="p">27:波紋管泵</p>  
        <p type="p">29:控制閥</p>  
        <p type="p">31:加熱器</p>  
        <p type="p">33:主過濾器</p>  
        <p type="p">35:排液管</p>  
        <p type="p">37:控制閥</p>  
        <p type="p">38:第1分支配管</p>  
        <p type="p">38a:第3分支點</p>  
        <p type="p">38b:第5分支點</p>  
        <p type="p">41:第2分支配管</p>  
        <p type="p">41a:第4分支點</p>  
        <p type="p">41b:第6分支點</p>  
        <p type="p">45:排出部</p>  
        <p type="p">47:第2處理液供給部</p>  
        <p type="p">48:第3處理液供給部</p>  
        <p type="p">49,51:第1循環閥</p>  
        <p type="p">53:過濾器</p>  
        <p type="p">55:第1過濾器</p>  
        <p type="p">57:第2過濾器</p>  
        <p type="p">60:排出配管</p>  
        <p type="p">61:第1排出閥</p>  
        <p type="p">62:第1供給配管</p>  
        <p type="p">63:第1-2供給閥</p>  
        <p type="p">65:第2排出閥</p>  
        <p type="p">67,71:第2循環閥</p>  
        <p type="p">69:第2-2供給閥</p>  
        <p type="p">73:控制器(控制部)</p>  
        <p type="p">75:行程感測器</p>  
        <p type="p">80:第2供給配管</p>  
        <p type="p">81:第1-3供給閥</p>  
        <p type="p">83:第1供給閥</p>  
        <p type="p">85:第2-3供給閥</p>  
        <p type="p">87:第2供給閥</p>  
        <p type="p">100:基板處理裝置</p>  
        <p type="p">731:CPU</p>  
        <p type="p">732:記憶體</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1972" publication-number="202613214"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613214.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613214</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134457</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>預浸體、覆金屬積層板及配線板</chinese-title>  
        <english-title>PREPREG, METAL CLAD LAMINATE AND WIRING BOARD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">C08J5/08</main-classification>  
        <further-classification edition="200601120251212B">C08J5/24</further-classification>  
        <further-classification edition="200601120251212B">C08L63/04</further-classification>  
        <further-classification edition="200601120251212B">C08K3/36</further-classification>  
        <further-classification edition="200601120251212B">C03C3/076</further-classification>  
        <further-classification edition="200601120251212B">C03C3/085</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商松下知識產權經營股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋龍史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, RYUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菅原譽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUGAHARA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示課題在於提供一種可實現控制半導體封裝件在高溫時之翹曲行為及減低所釋出之α射線量的預浸體。預浸體1具備樹脂組成物或樹脂組成物之半硬化物及玻璃布11。樹脂組成物含有熱硬化性樹脂(A)與無機充填材(B)。相對於樹脂組成物之總量，無機充填材(B)之含量為30質量%以上且75質量%以下。玻璃布11包含56質量%以上且70質量%以下之SiO&lt;sub&gt;2&lt;/sub&gt;、15質量%以上且26質量%以下之Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、及12質量%以上且18質量%以下之MgO。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:預浸體</p>  
        <p type="p">11:玻璃布</p>  
        <p type="p">12:樹脂層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1973" publication-number="202613680"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613680.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613680</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134485</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>自供電顯示裝置</chinese-title>  
        <english-title>SELF-POWERED DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250919B">G02F1/1333</main-classification>  
        <further-classification edition="202501120250919B">H10F19/50</further-classification>  
        <further-classification edition="201401120250919B">H02S10/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>虹彩光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張㻙堃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳志偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHIH WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖奇璋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHI CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種自供電顯示裝置，包含一太陽能模組以及一顯示面板。太陽能模組具有相對的一第一面及一第二面，太陽能模組包含一聚合層、複數太陽能電池及複數不透光圖形層。此些太陽能電池間隔埋設於聚合層中。此些不透光圖形層埋設於聚合層中，此些不透光圖形層於第一面的投影分別位於此些太陽能電池於第一面的投影之間。顯示面板設置於太陽能模組的第一面。太陽能模組可自第一面及第二面收光。藉此，提升自供電顯示裝置的獵能效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A self-powered display device is proposed. The self-powered display device includes a solar module and a display panel. The solar module has a first surface and an opposing second surface. The solar module includes a polymer layer, a plurality of solar cells, and a plurality of opaque patterned layers. The solar cells are embedded in the polymer layer at intervals. The opaque patterned layers are embedded in the polymer layer, with the projections of the opaque patterned layers on the first surface positioned between the projections of the solar cells on the first surface. The display panel is mounted on the first surface of the solar module. The solar module collects light from both the first surface and the second surface. Thus, enhances the energy-collecting efficiency of the self-powered display device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:自供電顯示裝置</p>  
        <p type="p">110:太陽能模組</p>  
        <p type="p">111:聚合層</p>  
        <p type="p">1111,1112:表面</p>  
        <p type="p">112:太陽能電池</p>  
        <p type="p">113:不透光圖形層</p>  
        <p type="p">114:基板</p>  
        <p type="p">120:顯示面板</p>  
        <p type="p">130:光學膠層</p>  
        <p type="p">140:殼體</p>  
        <p type="p">150:最大功率點追蹤控制器</p>  
        <p type="p">S1:第一面</p>  
        <p type="p">S2:第二面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1974" publication-number="202613377"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613377.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613377</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134525</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>編織式加熱器及其製造方法</chinese-title>  
        <english-title>KNITTED HEATER AND METHOD OF MANUFACTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251226B">D03D15/47</main-classification>  
        <further-classification edition="200601120251226B">H05B3/36</further-classification>  
        <further-classification edition="200601120251226B">H05B3/34</further-classification>  
        <further-classification edition="200601120251226B">D03D11/00</further-classification>  
        <further-classification edition="200601120251226B">D03D25/00</further-classification>  
        <further-classification edition="201801120251226B">F16L53/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商瓦特洛威電子製造公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATLOW ELECTRIC MANUFACTURING COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏佛　道格拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHAEFER, DOUGLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊格萊西亞斯　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGLESIAS, JORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿瓦雷斯　喬瑟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALVAREZ, JOSE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕斯特　巴勃羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PASTOR, PABLO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種由一三維(3D)編織機形成之布加熱器。該布加熱器包括一外層、一內層、以及設置在該內層與該外層之間的一載體層。該載體層包括一載體基板及由該3D編織機以一圖案縫至該載體基板的一電阻加熱元件。一絕緣層係設置在該外層與該載體層之間，且該外層及該內載體層係由該3D編織機形成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cloth heater is formed by a three-dimensional (3D) knitting machine. The cloth heater includes an outer layer, an inner layer, and a carrier layer disposed between the inner layer and the outer layer. The carrier layer includes a carrier substrate and a resistive heating element sewn to the carrier substrate in a pattern by the 3D knitting machine. An insulation layer is disposed between the outer layer and the carrier layer, and the outer layer and the inner carrier layer are formed by the 3D knitting machine.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:布加熱器</p>  
        <p type="p">102:外層</p>  
        <p type="p">104:內層</p>  
        <p type="p">108:絕緣層</p>  
        <p type="p">112:電阻加熱元件</p>  
        <p type="p">114:引線</p>  
        <p type="p">116:連接器</p>  
        <p type="p">120:感測器</p>  
        <p type="p">130:鉤環緊固件</p>  
        <p type="p">132:邊緣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1975" publication-number="202613620"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613620.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613620</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134559</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有電及光拼接之多光罩裝置</chinese-title>  
        <english-title>MULTI-RETICLE DEVICE WITH ELECTRICAL AND OPTICAL STITCHING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">G02B6/12</main-classification>  
        <further-classification edition="200601120251216B">H01L21/027</further-classification>  
        <further-classification edition="201201120251216B">G03F1/00</further-classification>  
        <further-classification edition="200601120251216B">H01L23/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商萊特美特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIGHTMATTER, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫迪　米圖爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MODI, MITUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈什　阿南達魯普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GHOSH, ANANDAROOP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦哈卡爾　圖莎爾　丁卡爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WAKHARKAR, TUSHAR DINKAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯托多爾斯基　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STODOLSKY, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩內　桑迪普</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANE, SANDEEP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫馬爾　尼基爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, NIKHIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂正忠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述組合電及光拼接兩者之混合互連方案。電拼接非常適合鄰近或緊密間隔單元之間之短距離、高頻寬連接。另一方面，光拼接非常適合非鄰近單元之間之長距離、低損耗連接。藉由利用電及光拼接之互補性質，可構造一多光罩裝置，與使用習知方法可達成相比，該多光罩裝置在運算及記憶體密度以及總互連頻寬方面提供實質上更大之可擴展性。一中間連接層經組態以電連接複數個電氣積體電路(EIC)之在彼此之一截距範圍內之EIC。一電光中介層經組態以光學連接該複數個EIC之在彼此之該截距範圍之外的EIC。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Hybrid interconnect schemes that combine both electrical and optical stitching are described. Electrical stitching is well-suited for short-reach, high-bandwidth connections between adjacent or closely spaced units. On the other hand, optical stitching is well-suited for long-reach, low-loss connections between non-adjacent units. By leveraging the complementary nature of electrical and optical stitching, a multi-reticle device may be constructed that provides substantially greater scalability in terms of compute and memory density and overall interconnect bandwidth than is achievable using conventional approaches. An intermediate connection layer is configured to electrically connect electrical integrated circuits (EIC) of the plurality of EICs that are within a cutoff range of one another. An electro-optical interposer is configured to optically connect EICs of the plurality of EICs that are outside the cutoff range of one another.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102&lt;sub&gt;1&lt;/sub&gt;至102&lt;sub&gt;6&lt;/sub&gt;:特定應用積體電路(ASIC)</p>  
        <p type="p">110:矽橋</p>  
        <p type="p">120:電光中介層</p>  
        <p type="p">125:電光片塊</p>  
        <p type="p">204&lt;sub&gt;1&lt;/sub&gt;至204&lt;sub&gt;24&lt;/sub&gt;:高頻寬記憶體(HBM)</p>  
        <p type="p">217:光纖纜線</p>  
        <p type="p">220:光耦合器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1976" publication-number="202613818"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613818.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613818</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134580</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在應用程式介面追蹤擷取期間減少系統開銷的方法及其裝置、非暫時性電腦可讀取儲存媒體</chinese-title>  
        <english-title>METHOD FOR REDUCING SYSTEM OVERHEAD DURING APPLICATION PROGRAMMING INTERFACE TRACE CAPTURE AND APPARATUS THEREOF, NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251201B">G06F11/36</main-classification>  
        <further-classification edition="200601120251201B">G06F11/34</further-classification>  
        <further-classification edition="201901120251201B">G06F16/174</further-classification>  
        <further-classification edition="200601120251201B">G06T1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯坦伯格　二世　克里斯　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEINBERG II, CHRIS ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達加尼　蓋布里爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAGANI, GABRIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>保羅　沃倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAUL, WARREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　羅尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING, RONNIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露裝置、方法、以及儲存媒體。方法包括以下步驟：在應用會話的初始階段產生資產庫，資產庫包括一組由應用程式介面（application programming interface，API）記錄機制擷取供應用使用的資產；在應用會話內啟動擷取程序；在擷取程序期間在擷取檔案中記錄API命令，其中擷取檔案包括對資產庫的參考；以及使用擷取檔案產生呈現內容的一個或多個影像或幀。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus, method, and storage medium are disclosed. The method includes the steps of generating, at an initial stage of an application session, an asset vault comprising a set of assets captured by an application programming interface (API) recording mechanism for use by an application; initiating a capture process within the application session; recording API commands in a capture file during the capture process, wherein the capture file includes a reference to the asset vault; and generating one or more images or frames of rendered content using the capture file.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">211:資產保管檔案</p>  
        <p type="p">212:擷取檔案</p>  
        <p type="p">213、214:資產資料</p>  
        <p type="p">215:前導碼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1977" publication-number="202614184"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614184.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614184</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134587</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著性膜</chinese-title>  
        <english-title>ADHESIVE FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251027B">H01L21/301</main-classification>  
        <further-classification edition="200601120251027B">H01L21/56</further-classification>  
        <further-classification edition="200601120251027B">C09J11/08</further-classification>  
        <further-classification edition="201801120251027B">C09J7/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種黏著性膜（10），包括基材層（A）及黏著性樹脂層（C），所述黏著性樹脂層（C）包含熱膨脹性微小球，所述熱膨脹性微小球的藉由規定的方法算出的真球度R為0.93以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An adhesive film (10) includes a base material layer (A) and an adhesive resin layer (C). The adhesive resin layer (C) contains thermally expandable microspheres, and a sphericity R of the thermally expandable microspheres calculated by a prescribed method is equal to or greater than 0.93.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:黏著性膜</p>  
        <p type="p">20:加工對象物</p>  
        <p type="p">30:支撐構件</p>  
        <p type="p">100:結構體</p>  
        <p type="p">A:基材層</p>  
        <p type="p">A1:第一面</p>  
        <p type="p">A2:第二面</p>  
        <p type="p">C:黏著性樹脂層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1978" publication-number="202614395"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614395.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614395</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134602</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用無機可轉化聚合物改善混合接合強度及導熱率</chinese-title>  
        <english-title>IMPROVING HYBRID BONDING STRENGTH AND THERMAL CONDUCTIVITY LEVERAGING INORGANIC-CONVERTIBLE POLYMERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L23/31</main-classification>  
        <further-classification edition="200601120251229B">H01L23/373</further-classification>  
        <further-classification edition="200601120251229B">H01L23/29</further-classification>  
        <further-classification edition="200601120251229B">H01L21/56</further-classification>  
        <further-classification edition="200601120251229B">C08G77/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達布拉　山傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DABRAL, SANJAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姚　計敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAO, JIMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈甘姆　西法錢德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANGAM, SIVACHANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉瑪錢德　維亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAMACHANDRAN, VIDHYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述利用無機可轉化聚合物改善接合強度及導熱率的積體電路（「IC」）結構及電子封裝。在一實施例中，無機可轉化聚合物作用為側部填充材料以密封晶粒周緣及改善直接接合強度。在另一實施例中，無機可轉化聚合物作用為熱接合層以增加晶粒與熱解決方案之間的導熱率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Integrated circuit (“IC”) structures and electronic packages that utilized an inorganic-convertible polymer to improve bond strength and thermal conductivity are described. In one embodiment, the inorganic-convertible polymer acts as a side fill material to seal a die periphery and improve direct bonding strength. In another embodiment, the inorganic-convertible polymer acts as a thermal bonding layer to increase the thermal conductivity between a die and a thermal solution.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:IC結構</p>  
        <p type="p">104:焊料凸塊</p>  
        <p type="p">110:晶粒</p>  
        <p type="p">112:接合表面</p>  
        <p type="p">114:金屬接合墊</p>  
        <p type="p">116:介電質接合層</p>  
        <p type="p">118:半導體層</p>  
        <p type="p">120:BEOL增層結構</p>  
        <p type="p">130:電子組件</p>  
        <p type="p">132:接合表面</p>  
        <p type="p">134:金屬接合墊</p>  
        <p type="p">136:介電質接合層</p>  
        <p type="p">138:半導體層</p>  
        <p type="p">140:BEOL增層結構</p>  
        <p type="p">142:貫通孔</p>  
        <p type="p">144:背側層</p>  
        <p type="p">146:端子</p>  
        <p type="p">150:側部填充材料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1979" publication-number="202613771"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613771.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613771</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134622</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置</chinese-title>  
        <english-title>ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251008B">G06F1/16</main-classification>  
        <further-classification edition="201301120251008B">G06F3/048</further-classification>  
        <further-classification edition="200601120251008B">G06F3/14</further-classification>  
        <further-classification edition="200601120251008B">G09F9/30</further-classification>  
        <further-classification edition="200601120251008B">G01R33/07</further-classification>  
        <further-classification edition="200601120251008B">G01B21/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁寶電腦工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMPAL ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃宥寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YOU-NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭喻文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, YU-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧冠臻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, KUAN-CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐勻亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, YUN-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉王鴻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, WANG-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置，包括機體、具有第一顯示區的第一顯示器以及具有第二顯示區的第二顯示器。第一顯示器與第二顯示器分別可旋轉地連接於機體的相對兩側。當第二顯示器覆蓋於機體上，且第一顯示器覆蓋於第二顯示器上時，第一顯示器局部遮蔽第二顯示區，且第二顯示區中未被遮蔽的部分被致能以執行顯像與觸控功能。當第一顯示器相對於機體展開，且第二顯示器覆蓋於機體上時，整體第二顯示區被致能以執行顯像與觸控功能。當第一顯示器覆蓋於機體上，且第二顯示器覆蓋於第一顯示器上時，整體第二顯示區被致能以執行顯像與觸控功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electronic device including a body, a first display having a first display area, and a second display having a second display area is provided. The first and second displays are rotatably connected to two opposite sides of the body, respectively. When the second display covers the body and the first display covers the second display, the first display partially shields the second display area, and an unshielded portion of the second display area is enabled to perform display and touch functions. When the first display is unfolded relative to the body and the second display covers the body, the entire second display area is enabled to perform display and touch functions. When the first display covers the body and the second display covers the first display, the entire second display area is enabled to perform display and touch functions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置</p>  
        <p type="p">110:機體</p>  
        <p type="p">113:鍵盤區</p>  
        <p type="p">114:凹槽</p>  
        <p type="p">1101:指紋辨識區</p>  
        <p type="p">120:第一顯示器</p>  
        <p type="p">121:第一顯示區</p>  
        <p type="p">122:第一背面</p>  
        <p type="p">130:第二顯示器</p>  
        <p type="p">131:第二顯示區</p>  
        <p type="p">132:第二背面</p>  
        <p type="p">160a:第一感測器</p>  
        <p type="p">160b:第二感測器</p>  
        <p type="p">160c:磁性元件</p>  
        <p type="p">170:處理器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1980" publication-number="202613053"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613053.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613053</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134655</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>層合玻璃及機能層</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">C03C27/12</main-classification>  
        <further-classification edition="200601120251222B">C09J133/08</further-classification>  
        <further-classification edition="200601120251222B">C09D123/08</further-classification>  
        <further-classification edition="200601120251222B">C07C69/82</further-classification>  
        <further-classification edition="200601120251222B">B32B17/10</further-classification>  
        <further-classification edition="201901120251222B">B32B7/023</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>百足山真平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKADEYAMA, SHIMPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉川仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIKAWA, JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明使具有光提取機能之層合玻璃之外觀良好。本層合玻璃包含：第1玻璃板，其具有主面；第2玻璃板，其配置於上述主面之法線方向；以及第1中間膜、機能層及第2中間膜，其等在上述第1玻璃板與上述第2玻璃板之間積層配置於上述主面之法線方向；且上述機能層包含將自側方入射之光提取至上述主面側之光提取層，於在130℃之環境中配置1小時之情形時，與上述主面之法線方向交叉之第1方向上之第1收縮率、以及與上述主面之法線方向及上述第1方向之各者交叉之第2方向上之第2收縮率均為5%以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:機能層</p>  
        <p type="p">11:光提取層</p>  
        <p type="p">12:凹部</p>  
        <p type="p">21:第1中間膜</p>  
        <p type="p">22:第2中間膜</p>  
        <p type="p">31:第1玻璃板</p>  
        <p type="p">32:第2玻璃板</p>  
        <p type="p">100:層合玻璃</p>  
        <p type="p">100a:主面</p>  
        <p type="p">122:黏接層</p>  
        <p type="p">131,132:基材層</p>  
        <p type="p">ISa:第1傾斜面</p>  
        <p type="p">ISb:第2傾斜面</p>  
        <p type="p">X:第1方向</p>  
        <p type="p">Y:第2方向</p>  
        <p type="p">Z:法線方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1981" publication-number="202614595"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614595.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614595</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134681</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>異質網路控制裝置以及其執行之非暫態性媒介</chinese-title>  
        <english-title>HETEROGENEOUS NETWORK CONTROL DEVICE AND NON-TRANSITORY MEDIUM PERFORMED BY HETEROGENEOUS NETWORK CONTROL DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251103B">H04L41/12</main-classification>  
        <further-classification edition="202201120251103B">H04L41/08</further-classification>  
        <further-classification edition="202201120251103B">H04L41/0893</further-classification>  
        <further-classification edition="202201120251103B">H04L43/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>光寶科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁宜通</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIANG, YI-TUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種異質網路控制裝置，包含一處理器，被配置為存取一程式並執行以下步驟。首先，使用每個異質網路裝置的媒體存取控制（MAC）位址作為索引，並分別統計每個異質網路設備所傳送與接收的封包數量。其次，針對任意一對異質網路裝置，執行候選判定程序。此候選判定程序包括以下步驟：取得異質網路裝置的封包數統計資料，例如封包的標準差與封包數量的差值；當其封包的標準差與封包數量的差值符合預定條件時，將該異質網路裝置標記為熱點或熱區的候選者。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A heterogeneous network control device includes a processor configured to access a program and perform the following steps. First, use Media Access Control address of each of the heterogeneous network devices as index, and count packets transmitted from and received by each of the heterogeneous network devices respectively. Second, for any pair of the heterogeneous network devices, perform a candidate determination procedure. The candidate determination procedure includes the steps of obtaining packet statistics of the heterogeneous network devices such as deviation of packets and difference of packet counts; and marking the heterogeneous network device as candidate of hot spot or hot zone when its deviation of packets and difference of packet counts meets a predetermined condition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S51~S54:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1982" publication-number="202613553"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613553.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613553</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134695</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>流道安裝機構及流道系統</chinese-title>  
        <english-title>FLOW CHANNEL INSTALLATION MECHANISM AND FLOW CHANNEL SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">G01N35/08</main-classification>  
        <further-classification edition="200601120251001B">G01N1/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邑流微測股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLOWVIEW TEK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭瑞峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, JUI FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林鈺凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李政哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHENG CHE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施敏權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, MIN-CHUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮國炤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, KUO CHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種流道安裝機構，包括導引組件和水密連接元件。導引組件用以將被偵測塊體引導至導引組件內。導引組件包括承靠主體、支撐主體和滾輪組。承靠主體有倒角。滾輪組透過至少一個第一彈性元件連接到支撐主體，其中被偵測塊體適合插入承靠主體和滾輪組之間。水密連接元件透過至少一個第二彈性元件連接到施力主體，並且具有至少兩個開口。施力主體用以向承靠主體移動，以對被偵測塊體施加壓力。承靠主體、支撐主體及施力主體排列在光通道上。一種流道系統亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flow channel installation mechanism includes a guiding assembly and a watertight jointing device. The guiding assembly is configured to guide a detected block into the guiding assembly. The guiding assembly includes a leaning body, a supporting body, and a roller set. The leaning body has a chamfer. The roller set is connected to the supporting body via at least one first elastic element, wherein the detected block is adapted to be inserted between the leaning body and the roller set. The watertight jointing device is connected to a force exerting body via at least one second elastic element and has at least two openings. The force exerting body is configured to move towards the leaning body to exert a pressure on the detected block. The leaning body, the supporting body, and the force exerting body are arranged on a light channel. A flow channel system is also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">50:被偵測塊體</p>  
        <p type="p">52:第一流道</p>  
        <p type="p">100:流道安裝機構</p>  
        <p type="p">102:光通道</p>  
        <p type="p">110:水密連接元件</p>  
        <p type="p">112:第二流道</p>  
        <p type="p">120:光源</p>  
        <p type="p">122:光束</p>  
        <p type="p">130:影像感測器</p>  
        <p type="p">140:透鏡組件</p>  
        <p type="p">150:流體管道</p>  
        <p type="p">200:導引組件</p>  
        <p type="p">210:承靠主體</p>  
        <p type="p">212:倒角</p>  
        <p type="p">220:支撐主體</p>  
        <p type="p">230:滾輪組</p>  
        <p type="p">240:第一彈性元件</p>  
        <p type="p">250:施力主體</p>  
        <p type="p">260:第二彈性元件</p>  
        <p type="p">A、B、C、D、E、F:開口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1983" publication-number="202613803"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613803.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613803</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134728</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於目前特權層級的執行模式轉變允許性</chinese-title>  
        <english-title>EXECUTION MODE TRANSITION ALLOWABILITY BASED ON CURRENT PRIVILEGE LEVEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251119B">G06F9/30</main-classification>  
        <further-classification edition="201801120251119B">G06F9/44</further-classification>  
        <further-classification edition="200601120251119B">G06F9/46</further-classification>  
        <further-classification edition="200601120251119B">G06F12/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛尼恩　傑夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONION, JEFF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夕米利亞　巴嫩得　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMERIA, BERNARD J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查德威克　亞歷山大　唐納　查爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHADWICK, ALEXANDER DONALD CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一處理器電路經組態以在一目前軟體代理正在一目前執行模式中執行時，接收一執行模式轉變的一指示，該執行模式轉變嘗試將一執行模式索引從指示該目前執行模式的一目前值改變為指示一新執行模式的一新值。該處理器電路經組態以基於該目前特權層級，存取一儲存電路中的特定執行模式轉變資訊，以判定是否允許該執行模式轉變。該處理器電路經組態以基於特定執行模式轉變資訊，判定是否更新指示該目前執行模式的該目前值。該處理器電路經組態以基於允許該執行模式轉變的一判定，更新指示該目前執行模式的該目前值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A processor circuit is configured to receive, while a current software agent is executing in a current execution mode, an indication of an execution mode transition that attempts to change an execution mode index from a current value indicative of the current execution mode to a new value indicative of a new execution mode. The processor circuit is configured to access, based on the current privilege level, particular execution mode transition information in a storage circuit to determine whether the execution mode transition is allowed. The processor circuit is configured to determine, based on particular execution mode transition information, whether to update the current value indicative of the current execution mode. The processor is further configured to update the current value indicative of the current execution mode based on a determination that the execution mode transition is permitted.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:設備；電腦系統</p>  
        <p type="p">102:指令資訊</p>  
        <p type="p">104:指令權限資訊</p>  
        <p type="p">106:執行模式轉變指示；指示</p>  
        <p type="p">108:目前特權層級</p>  
        <p type="p">110:處理器電路</p>  
        <p type="p">116:目前執行模式索引</p>  
        <p type="p">118:經更新執行模式索引</p>  
        <p type="p">120:權限電路；記憶體權限電路</p>  
        <p type="p">130:執行模式索引管理電路</p>  
        <p type="p">140:儲存電路</p>  
        <p type="p">140A,140B:部分；執行模式轉變資訊；資訊</p>  
        <p type="p">150:執行模式索引暫存器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1984" publication-number="202613810"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613810.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613810</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134741</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用處理器操作模式的異常向量表選擇</chinese-title>  
        <english-title>EXCEPTION VECTOR TABLE SELECTION USING PROCESSOR OPERATING MODE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251119B">G06F9/445</main-classification>  
        <further-classification edition="200601120251119B">G06F9/48</further-classification>  
        <further-classification edition="200601120251119B">G06F9/06</further-classification>  
        <further-classification edition="200601120251119B">G06F13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛尼恩　傑夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONION, JEFF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查德威克　亞歷山大　唐納　查爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHADWICK, ALEXANDER DONALD CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夕米利亞　巴嫩得　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMERIA, BERNARD J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種處理器電路可包括模式變換電路、異常管理電路、及經組態以確立各別異常信號的複數個電路。模式變換電路可經組態以選擇複數個處理器模式的一特定者，其對應於各別的一組記憶體存取權限。異常管理電路可經組態以接收複數個電路的一各別者確立特定異常信號的指示，並接著基於複數個處理器模式的經判定處理器模式來選擇複數個向量表的一向量表。異常管理電路亦可經組態以基於特定異常信號判定經選擇的向量表內的向量位址，並基於經判定的向量位址從經選擇的向量表擷取特定異常處置器位址。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A processor circuit may include a mode transition circuit, an exception management circuit, and a plurality of circuits configured to assert respective exception signals. The mode transition circuit may be configured to select a particular one of a plurality of processor modes, corresponding to a respective set of memory access permissions. The exception management circuit may be configured to receive an indication of an assertion of a particular exception signal by a respective one of the plurality of circuits, and then select a vector table of a plurality of vector tables based on a determined processor mode of the plurality of processor modes. The exception management circuit may also be configured to, based on the particular exception signal, determine a vector address within the selected vector table and, based on the determined vector address, retrieve a particular exception handler address from the selected vector table.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">101:處理器電路</p>  
        <p type="p">105:處理器模式</p>  
        <p type="p">110:異常管理電路</p>  
        <p type="p">115:模式變換電路</p>  
        <p type="p">120:記憶體電路</p>  
        <p type="p">122a~122c:向量表</p>  
        <p type="p">127a~127c:向量位址</p>  
        <p type="p">128:特定異常位址</p>  
        <p type="p">130a,130b:異常來源</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1985" publication-number="202613804"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613804.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613804</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134745</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於執行緒私用指示符及執行緒位址範圍之對於位址轉譯的限制</chinese-title>  
        <english-title>RESTRICTIONS ON ADDRESS TRANSLATIONS BASED ON THREAD PRIVATE INDICATOR AND THREAD ADDRESS RANGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251119B">G06F9/30</main-classification>  
        <further-classification edition="201801120251119B">G06F9/38</further-classification>  
        <further-classification edition="201601120251119B">G06F12/08</further-classification>  
        <further-classification edition="200601120251119B">G06F12/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛尼恩　傑夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONION, JEFF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫韋利　喬治亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOUVELI, GEORGIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夕米利亞　巴嫩得　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMERIA, BERNARD J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查德威克　亞歷山大　唐納　查爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHADWICK, ALEXANDER DONALD CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示與由一電腦處理器執行的執行緒的存取控制有關的技術。處理器電路系統可包括一執行管線、一基底暫存器、及一限制暫存器。該基底暫存器及該限制暫存器可定義由該執行管線執行的一執行緒的一虛擬位址範圍。控制電路系統可存取一轉譯表，該轉譯表儲存將一虛擬位址空間映射至一實體位址空間的轉譯項目，其中一給定項目包括一執行緒私用狀態指示。針對由該執行緒在一第一權限層級處提供的一虛擬位址，該控制電路系統可：判定該轉譯表的一對應項目的該執行緒私用狀態指示經設定；及回應於該判定，而僅在該虛擬位址落在該虛擬位址範圍內時提供該虛擬位址的一轉譯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques are disclosed relating to access control for threads executed by a computer processor. Processor circuitry may include an execution pipeline, a base register and a limit register. The base register and the limit register may define a range of virtual addresses for a thread executed by the execution pipeline. Control circuitry may access a translation table that stores translation entries that map a virtual address space to a physical address space, wherein a given entry includes a thread-private state indication. for a virtual address provided by the thread at a first permission level, the control circuitry may: determine that the thread-private state indication of a corresponding entry of the translation table is set and in response to the determination, provide a translation of the virtual address only if the virtual address falls within the range of virtual addresses.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">310,320,330,335,340,345,350:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1986" publication-number="202614307"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614307.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614307</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134756</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>遮蔽排氣環及反應腔結構</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H01L21/67</main-classification>  
        <further-classification edition="200601120251001B">C23C16/455</further-classification>  
        <further-classification edition="200601120251001B">C23C16/54</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商盛美半導體設備(上海)股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商盛美半導體設備韓國有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH KOREA CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港商清芯科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLEANCHIP TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董智超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DONG, ZHICHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白晛祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAEK, WILLIAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金京俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KYUNG JOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周培壟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, PEILONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種遮蔽排氣環及反應腔結構，屬於半導體製造領域的電漿處理領域，應用於電漿處理裝置的反應腔結構內，遮蔽排氣環包括內環周和以內環周向外延伸預設寬度的外環周，內環周的內徑小於電漿處理裝置待處理的晶圓的直徑且內環周的外徑大於或等於晶圓的直徑，內環周用於遮蔽晶圓的邊緣區域，外環周上設置多個通氣孔，用於排出反應腔結構內的反應氣體。本揭示內容的遮蔽排氣環降低了反應腔結構內晶圓表面污染的風險。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:遮蔽排氣環</p>  
        <p type="p">102:內環周</p>  
        <p type="p">103:外環周</p>  
        <p type="p">105:通氣孔</p>  
        <p type="p">106:凹槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1987" publication-number="202614336"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614336.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614336</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134757</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板對中裝置與基板對中方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251001B">H01L21/68</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商盛美半導體設備(上海)股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊小亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, XIAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊宏超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, HONGCHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>刁建華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIAO, JIANHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王蔚</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈照偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIA, ZHAOWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王堅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容提供一種基板對中裝置，用於對方形的基板對中操作，包括：兩個對中操作組件，分別作用於基板的預選對角線方向的兩個頂角；對中操作組件包括相互平行的第一臂與第二臂，一個對中操作組件先直線運動至目標位置以作用於預選對角線的一個頂角，另一個對中操作組件再直線運動至目標位置以作用於預選對角線的另一個頂角，以使基板中心與基板旋轉中心重合，對中操作組件以第一臂的延長線和第二臂的延長線到基板對應頂角兩邊的交點作為目標位置，基板的位置被精準且快速定位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:對中操作組件</p>  
        <p type="p">2:工藝腔</p>  
        <p type="p">3:基板保持件</p>  
        <p type="p">13:臂</p>  
        <p type="p">131:第一臂</p>  
        <p type="p">132:第二臂</p>  
        <p type="p">14:滾輪</p>  
        <p type="p">141:第一滾輪</p>  
        <p type="p">142:第二滾輪</p>  
        <p type="p">D:中間平行線</p>  
        <p type="p">D1:延伸方向</p>  
        <p type="p">D2:延伸方向</p>  
        <p type="p">W:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1988" publication-number="202613087"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613087.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613087</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134761</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有苯并噁嗪之反應生成物及其硬化物</chinese-title>  
        <english-title>BENZOXAZINE CONTAINING REACTION PRODUCT AND CURED PRODUCT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C07D265/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一工業製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DKS CO. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉岡汰玖哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIOKA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上賢志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係在使酚類、二胺及甲醛縮合反應所得到的反應生成物中，降低熱硬化時之質量減少。 &lt;br/&gt;上述課題的解決手段為本發明之實施型態的反應生成物，係包含式(1)之第一生成物及式(2)之第二生成物，且相對於以HPLC所得到的反應生成物之全部尖峰面積100%，第二生成物之尖峰面積為5至15%，第一生成物與第二生成物之尖峰面積的合計為65至80%。在式中，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;係表示甲基或乙基，R&lt;sup&gt;3&lt;/sup&gt;及R&lt;sup&gt;4&lt;/sup&gt;係表示烷基或烯基，p及q係表示0至4之整數，苯并噁嗪環或NH相對於聯苯基之鍵結位置為4,4’位或3,4’位。 &lt;br/&gt;&lt;img align="absmiddle" height="301px" width="557px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the present invention is to reduce mass loss during thermal curing in a reaction product obtained by condensation reaction of phenol, diamine, and formaldehyde. &lt;br/&gt;　A reaction product according to an embodiment of the present invention includes a first product of formula (1) and a second product of formula (2), wherein with respect to 100% total peak area of the reaction product measured by HPLC, the peak area of the second product is 5 to 15%, and the sum of the peak areas of the first product and the second product is 65 to 80%. In the formulas, R&lt;sup&gt;1&lt;/sup&gt; and R&lt;sup&gt;2&lt;/sup&gt; represent methyl or ethyl, R&lt;sup&gt;3&lt;/sup&gt; and R&lt;sup&gt;4&lt;/sup&gt; represent alkyl or alkenyl, p and q represent integers of 0 to 4, and the bonding positions of the benzoxazine ring or NH to the biphenyl are the 4,4' or 3,4' positions. &lt;br/&gt;&lt;img align="absmiddle" height="318px" width="548px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1989" publication-number="202613835"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613835.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613835</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134765</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>改善應用程式介面追蹤重播的方法及使用者設備</chinese-title>  
        <english-title>METHOD FOR IMPROVING APPLICATION PROGRAMMING INTERFACE TRACE REPLAY AND USER EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251201B">G06F16/17</main-classification>  
        <further-classification edition="200601120251201B">G06T1/60</further-classification>  
        <further-classification edition="202501120251201B">G06F11/36</further-classification>  
        <further-classification edition="200601120251201B">G06F9/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯坦伯格　二世　克里斯　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEINBERG II, CHRIS ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達加尼　蓋布里爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAGANI, GABRIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種方法和裝置，其中處理器透過記錄從中央處理單元（central processing unit，CPU）提供到加速器的命令來產生應用程式介面（application program interface，API）擷取檔案。API擷取檔案包括資產資料和具有命令的第一組幀。處理器確定由第一組幀中的一個或多個幀產生的差量變化。處理器產生包括第二組幀的擷取索引檔案。第二組幀的每個幀包括由第一組幀中的一個或多個幀的對應幀產生的差量變化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and device are provided in which a processor generates an application programming interface (API) capture file by recording commands provided from a central processing unit (CPU) to an accelerator. The API capture file includes asset data and a first set of frames having the commands. The processor determines delta changes generated by one or more frames in the first set of frames. The processor generates a capture index file including a second set of frames. Each frame of the second set of frames includes a delta change generated by a corresponding frame of the one or more frames in the first set of frames.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202:擷取檔案</p>  
        <p type="p">210、306:第一幀</p>  
        <p type="p">212、310:第二幀</p>  
        <p type="p">302:擷取索引檔案</p>  
        <p type="p">304:前導碼</p>  
        <p type="p">308:第一差量變化區塊</p>  
        <p type="p">312:第二差量變化區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1990" publication-number="202613826"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613826.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613826</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134772</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於載入/儲存非特權指令的索引暫存器</chinese-title>  
        <english-title>INDEX REGISTER FOR LOAD/STORE UNPRIVILEGED INSTRUCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F12/14</main-classification>  
        <further-classification edition="201601120251201B">G06F12/1027</further-classification>  
        <further-classification edition="200601120251201B">G06F9/46</further-classification>  
        <further-classification edition="201801220251201B">G06F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛尼恩　傑夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONION, JEFF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查德威克　亞歷山大　唐納　查爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHADWICK, ALEXANDER DONALD CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夕米利亞　巴嫩得　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMERIA, BERNARD J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">處理器電路可在複數個特權層級中的目前特權層級執行程式。處理器電路可包括LSU電路及MMU電路。LSU電路可發布記憶體存取指令，記憶體存取指令包括待基於對應於非特權層級之特定權限執行的載入/儲存非特權指令。MMU電路可從LSU電路接收與程式相關聯之特定載入/儲存非特權指令相關聯的位址。用於特定程式的碼可儲存在記憶體電路的特定區域中。基於判定目前特權層級係特定特權層級，MMU電路可使用特定索引來判定特定載入/儲存非特權指令的權限。特定索引可在與特定特權層級相關聯的一或多個暫存器中指定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A processor circuit may execute a program at a current one of a plurality of privilege levels. The processor circuit may include an LSU circuit and an MMU circuit. The LSU circuit may issue memory access instructions that include load/store unprivileged instructions to be performed based on particular permissions that correspond to an unprivileged level. The MMU circuit may receive, from the LSU circuit, an address associated with a particular load/store unprivileged instruction associated with the program. Code for the particular program may be stored in a particular region of the memory circuit. Based on a determination that the current privilege level is the particular privilege level, the MMU circuit may use particular indices to determine permissions for the particular load/store unprivileged instruction. The particular indices may be specified in one or more registers associated with the particular privilege level.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">101:處理器電路</p>  
        <p type="p">105:記憶體管理單元(MMU)電路</p>  
        <p type="p">110:載入/儲存單元(LSU)電路</p>  
        <p type="p">115:特權層級</p>  
        <p type="p">117:置換模式</p>  
        <p type="p">125:索引</p>  
        <p type="p">130:權限表</p>  
        <p type="p">135a~135j:權限組</p>  
        <p type="p">145:載入/儲存非特權指令</p>  
        <p type="p">160:記憶體電路</p>  
        <p type="p">165a~165d:區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1991" publication-number="202613088"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613088.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613088</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134790</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>含有苯并噁嗪之反應生成物及其硬化物</chinese-title>  
        <english-title>REACTION PRODUCT CONTAINING BENZOXAZINE, AND CURED PRODUCT THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C07D265/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一工業製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DKS CO. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉岡汰玖哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIOKA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高町祐輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAMACHI, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上賢志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題係在使酚類、二胺與甲醛縮合反應所得到的反應生成物中，降低熱硬化時之質量減少。 &lt;br/&gt;上述課題的為實施型態之反應生成物，係包含以式(1)所示的第一生成物及以式(2)所示的第二生成物，且相對於以HPLC所得到的反應生成物之全部尖峰面積100%，第二生成物之尖峰面積為5至15%，第一生成物與第二生成物之尖峰面積的合計為65至75%。式中，R&lt;sup&gt;1&lt;/sup&gt;係表示–CH&lt;sub&gt;2&lt;/sub&gt;–、–CH(CH&lt;sub&gt;3&lt;/sub&gt;)–、–C(CH&lt;sub&gt;3&lt;/sub&gt;)&lt;sub&gt;2&lt;/sub&gt;–、或–O–，R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;係表示甲基或乙基，R&lt;sup&gt;4&lt;/sup&gt;及R&lt;sup&gt;5&lt;/sup&gt;係表示烷基或烯基，p及q係表示0至4之整數。 &lt;br/&gt;&lt;img align="absmiddle" height="318px" width="524px" file="ed10020.JPG" alt="ed10020.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention aims to reduce mass loss during thermal curing in a reaction product obtained by condensation reaction of phenol, diamine, and formaldehyde. &lt;br/&gt;A reaction product according to an embodiment of the present invention includes a first product represented by formula (1) and a second product represented by formula (2), wherein relative to 100% total peak area of the reaction product measured by HPLC, the second product has a peak area of 5% to 15%, and the sum of the peak areas of the first and second products is 65% to 75%. In the formulae below, R&lt;sup&gt;1&lt;/sup&gt; represents -CH&lt;sub&gt;2&lt;/sub&gt;-, -CH(CH&lt;sub&gt;3&lt;/sub&gt;)-, -C(CH&lt;sub&gt;3&lt;/sub&gt;)&lt;sub&gt;2&lt;/sub&gt;-, or -O-, R&lt;sup&gt;2&lt;/sup&gt; and R&lt;sup&gt;3&lt;/sup&gt; represent methyl or ethyl groups, R&lt;sup&gt;4&lt;/sup&gt; and R&lt;sup&gt;5&lt;/sup&gt; represent alkyl or alkenyl groups, and p and q represent integers of 0 to 4. &lt;br/&gt;&lt;img align="absmiddle" height="359px" width="494px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1992" publication-number="202613459"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613459.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613459</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134824</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>油捕集裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251225B">F24F7/06</main-classification>  
        <further-classification edition="200601120251225B">F24F13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJI INDUSTRIAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菱谷康平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HISHIYA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種將裝置整體的高度構成得相對較低的油捕集裝置。一種油捕集裝置，具備：殼體（10），在朝向下方的吸入口（21a）和與吸入口（21a）交叉的朝向的排出口（a21）之間具有氣體流路（A）；和油脂捕集部（31），從自吸入口（21a）吸入的氣體捕集油分，氣體流路（A）具有從吸入口（21a）朝向上方的第一流路（a1）、和與第一流路（a1）的下游側連續且朝向與第一流路（a1）交叉的方向的第二流路（a2），第二流路（a2）設置有對其進行開閉的阻尼裝置（34）、和將通過了阻尼裝置（34）的氣體向排出口（a21）強制輸送的送風機（41）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:殼體</p>  
        <p type="p">11:分隔部</p>  
        <p type="p">12:罩</p>  
        <p type="p">12a:罩開口</p>  
        <p type="p">17:前蓋</p>  
        <p type="p">30:油脂捕集單元</p>  
        <p type="p">31:油脂捕集部</p>  
        <p type="p">34:阻尼裝置</p>  
        <p type="p">35:油脂捕集單元外殼</p>  
        <p type="p">40:送風機單元</p>  
        <p type="p">41:送風機</p>  
        <p type="p">41b:送風出口</p>  
        <p type="p">50:過濾器單元</p>  
        <p type="p">51:過濾器單元外殼</p>  
        <p type="p">51d、51e:引導板</p>  
        <p type="p">52:淨化過濾器</p>  
        <p type="p">A:氣體流路</p>  
        <p type="p">a1:第一流路</p>  
        <p type="p">a2:排出口</p>  
        <p type="p">a21:排出口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1993" publication-number="202614197"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614197.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614197</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134827</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清洗裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251112B">H01L21/304</main-classification>  
        <further-classification edition="200601120251112B">B08B9/08</further-classification>  
        <further-classification edition="200601120251112B">H01L21/68</further-classification>  
        <further-classification edition="200601120251112B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商芝浦機械電子裝置股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBAURA MECHATRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石原淳司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIHARA, JUNJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮迫久顕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYASAKO, HISAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西部幸伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHIBE, YUKINOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福岡洋太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUOKA, YOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提供一種可在旋轉載台的旋轉時適當地對基板收納容器進行定位的清洗裝置。清洗裝置包含：清洗處理槽，對基板收納容器進行清洗；以及容器保持部，對所述基板收納容器進行保持並且使其旋轉，所述容器保持部包含：旋轉載台，供載置所述基板收納容器；以及容器固定部，設置在所述旋轉載台，在所述旋轉載台處於旋轉狀態時對所述基板收納容器進行固定，在所述旋轉載台處於停止狀態時，所述容器固定部不會與所述基板收納容器接觸，在所述旋轉載台處於旋轉狀態時，由於作用在所述旋轉載台的離心力，所述容器固定部的一部分與所述基板收納容器接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:清洗處理部</p>  
        <p type="p">510:清洗處理槽</p>  
        <p type="p">520:蓋部</p>  
        <p type="p">521:蓋體保持部</p>  
        <p type="p">521a:旋轉軸部</p>  
        <p type="p">521b:旋轉支撐部</p>  
        <p type="p">521c:保持部</p>  
        <p type="p">522:旋轉驅動部</p>  
        <p type="p">530:容器保持部</p>  
        <p type="p">531:旋轉軸部</p>  
        <p type="p">532:旋轉載台</p>  
        <p type="p">532a:排液孔</p>  
        <p type="p">533:容器固定部</p>  
        <p type="p">534:平衡調整部</p>  
        <p type="p">540:旋轉驅動部</p>  
        <p type="p">551~553:清洗噴嘴</p>  
        <p type="p">561~563:乾燥噴嘴</p>  
        <p type="p">910:容器本體</p>  
        <p type="p">920:蓋體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1994" publication-number="202613335"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613335.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613335</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134835</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鋼板及琺瑯製品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251220B">C22C38/60</main-classification>  
        <further-classification edition="200601120251220B">C21D9/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本製鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉川伸麻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIKAWA, NOBUO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢頭久齊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YATOH, HISAYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矢野義成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANO, YOSHINARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楠見和久</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUSUMI, KAZUHISA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案的鋼板具有預定的化學組成，從表面朝板厚方向在1/4之位置中，肥粒鐵相之面積率為98%以上，下述夾雜物的個數密度為300~800個/mm&lt;sup&gt;2&lt;/sup&gt;，所述夾雜物為大於0.5μm且為10μm以下，並且含有：選自Mn、Cr、及Al所構成群組中之1種以上的氧化物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1995" publication-number="202612811"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612811.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612811</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134847</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鑄坯裂紋預測方法、鋼板的製造方法及鑄坯裂紋預測裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251225B">B22D11/16</main-classification>  
        <further-classification edition="200601120251225B">B22D11/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森田周吾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORITA, SHUGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鼓健二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUZUMI, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平田晃太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRATA, KOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村圭介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可基於鑄坯的表面的形狀資訊來適當地預測軋製處理所引起的裂紋產生的有無的鑄坯裂紋預測方法。一種鑄坯裂紋預測方法，其預測於對藉由連續鑄造而鑄造的鑄坯實施軋製處理時於所述鑄坯的表面是否產生裂紋，所述鑄坯裂紋預測方法具有：形狀資訊獲取步驟，獲取鑄造後的所述鑄坯的表面的形狀資訊；以及裂紋產生預測步驟，基於所述形狀資訊，來預測於實施所述軋製處理時於所述鑄坯的表面是否產生裂紋。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A:寬度方向</p>  
        <p type="p">B:鑄造方向</p>  
        <p type="p">G:槽</p>  
        <p type="p">S:鑄坯</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1996" publication-number="202613778"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613778.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613778</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134859</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合至接合晶粒介面</chinese-title>  
        <english-title>BOND-TO-BOND DIE INTERFACE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251118B">G06F1/26</main-classification>  
        <further-classification edition="200601120251118B">G06F1/16</further-classification>  
        <further-classification edition="200601120251118B">G06F13/38</further-classification>  
        <further-classification edition="200601120251118B">H01L23/538</further-classification>  
        <further-classification edition="202001320251118B">G06F115/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達維多芙　丹尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAVIDOV, DANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席密特　里爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZIMET, LIOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡羅　索吉歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLOR, SERGIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞伯　漢娜　漢娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABO HANA, HANA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種設備可包括包括複數個積體電路(IC)的一系統，該複數個積體電路包括具有一第一組代理電路的一第一IC，及具有一第二組代理電路的一第二IC。該第一IC可包括具有一第一永遠開啟部分及一第一電力管理部分的一第一介面。該第二IC可包括耦接至該第一介面的一第二介面，且具有一第二永遠開啟部分及一第二電力管理部分。該第一IC中的該第一組代理電路的一第一代理電路可經組態以在該第二IC處於一降低功率狀態時，將一異動發送至一第二代理電路。該第一介面可經組態以經由該第一介面及該第二介面的該等永遠開啟部分與該第二IC通訊，以使該第二IC喚醒該第二代理電路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus may include a system including a plurality of integrated circuits (ICs), including a first IC having a first set of agent circuits and a second IC having a second set of agent circuits. The first IC may include a first interface with a first always-on portion and a first power-managed portion. The second IC may include a second interface coupled to the first interface, and having a second always-on portion and a second power-managed portion. A first agent circuit of the first set of agent circuits in the first IC may be configured to send, while the second IC is in a reduced power state, a transaction to a second agent circuit. The first interface may be configured to communicate, via the always-on portions of the first and second interfaces, with the second IC to cause the second IC to wake up the second agent circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:系統</p>  
        <p type="p">101a,101b:積體電路(IC)</p>  
        <p type="p">110a,110b:b2b介面電路</p>  
        <p type="p">120a,120b:永遠開啟部分</p>  
        <p type="p">130a,130b:電力管理部分</p>  
        <p type="p">140:喚醒信號</p>  
        <p type="p">145:操作信號</p>  
        <p type="p">150a~150e:代理電路</p>  
        <p type="p">160a,160b:通訊網狀架構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1997" publication-number="202613964"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613964.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613964</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134891</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於高效影像變換操作之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR EFFICIENT IMAGE TRANSFORMATION OPERATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251201B">G06T3/00</main-classification>  
        <further-classification edition="202401120251201B">G06T3/40</further-classification>  
        <further-classification edition="200601120251201B">G06T1/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商谷歌有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOOGLE LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於接收對一輸入影像執行複數個影像變換操作以產生複數個輸出影像圖框的一請求的方法、系統及設備。向每一各別影像變換操作及一對應輸出影像圖框指派一識別符。自記憶體獲得針對輸入影像之影像資料且將該影像資料儲存於一區域快取中。基於儲存於區域快取中的針對輸入影像之影像資料之一部分及與各別輸出影像圖框之識別符相對應的一影像變換操作來產生一輸出影像圖框部分。將該輸出影像圖框部分儲存於記憶體中與該複數個輸出影像圖框中之各者相關聯的一單獨容器內。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods, systems, and apparatus for receiving a request to perform a plurality of image transformation operations on an input image to generate a plurality of output image frames. An identifier is assigned to each respective image transformation operation and a corresponding output image frame. Image data for the input image is obtained from memory and stored in a local cache. An output image frame portion is generated based on a portion of image data for the input image stored in the local cache and an image transformation operation corresponding to the identifier of the respective output image frame. the output image frame portion is stored in memory within a separate container associated with each of the plurality of output image frames.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子裝置/系統</p>  
        <p type="p">104:中央處理單元</p>  
        <p type="p">105:記憶體控制器</p>  
        <p type="p">106:記憶體</p>  
        <p type="p">108:資源管理器</p>  
        <p type="p">110:IP/電路區塊</p>  
        <p type="p">112:影像信號處理器</p>  
        <p type="p">114:主機處理單元</p>  
        <p type="p">116:數位信號處理器</p>  
        <p type="p">118:圖形處理單元</p>  
        <p type="p">120:影像變換引擎</p>  
        <p type="p">122:SoC匯流排</p>  
        <p type="p">126:影像處理引擎</p>  
        <p type="p">130:使用者/用戶端裝置</p>  
        <p type="p">130a:智慧型電話</p>  
        <p type="p">130b:平板電腦</p>  
        <p type="p">130c:膝上型電腦</p>  
        <p type="p">130d:智慧型手錶或可穿戴裝置</p>  
        <p type="p">140:系統單晶片/SoC處理器</p>  
        <p type="p">160:磁碟記憶體</p>  
        <p type="p">170:記憶體裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1998" publication-number="202613612"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613612.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613612</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134896</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導光體及照明裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251211B">G02B6/00</main-classification>  
        <further-classification edition="200601120251211B">G02B5/02</further-classification>  
        <further-classification edition="200601120251211B">G02F1/1335</further-classification>  
        <further-classification edition="200601120251211B">G02F1/13357</further-classification>  
        <further-classification edition="201601320251211B">F21Y101/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井上洸一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INOUE, KOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>翁宇峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WENG, YUFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村恒三</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, KOZO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提高入射至導光體之光之擴散性。本導光體係於內部設置空腔，供來自光源之光入射者，其包含端面、及與上述端面連續且與上述端面交叉之出射面，上述導光體將於上述導光體之內部導光之光的一部分藉由上述空腔反射，使藉由上述空腔反射之光自上述出射面出射，上述空腔於與上述端面及上述出射面之各者交叉之第1剖面中，具有凸形狀，於上述凸形狀之頂部包含平坦部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">64:空腔</p>  
        <p type="p">640:平坦部</p>  
        <p type="p">L:長度</p>  
        <p type="p">W:寬度</p>  
        <p type="p">Wt:平坦寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="1999" publication-number="202614330"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614330.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614330</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134898</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>映射裝置及映射方法</chinese-title>  
        <english-title>MAPPING DEVICE AND MAPPING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L21/677</main-classification>  
        <further-classification edition="200601120251229B">B65G49/07</further-classification>  
        <further-classification edition="200601120251229B">G01N21/89</further-classification>  
        <further-classification edition="201701120251229B">G06T7/543</further-classification>  
        <further-classification edition="201701120251229B">G06T7/13</further-classification>  
        <further-classification edition="200601120251229B">G01B11/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商昕芙旎雅股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SINFONIA TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤圭悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, KEIGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮下裕司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYASHITA, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了映射裝置及映射方法。裝載端口（4）檢測多個基板（S）的容納狀態，多個基板（S）在厚度方向上布置的同時被容納在FOUP（100）中。裝載端口（4）包括發光器（62）、相機（61）和控制器（66）。控制器（66）透過使用隨著基板（S）的厚度方向上的座標變化而變化的多個像素值的變化量訊息，來對成像區域（200）中的容納區域內是否容納有兩個以上的基板（S）進行重疊判定，該容納區域是用於容納多個基板（S）中的一個基板的區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S301:步驟</p>  
        <p type="p">S302:步驟</p>  
        <p type="p">S303:步驟</p>  
        <p type="p">S304:步驟</p>  
        <p type="p">S305:步驟</p>  
        <p type="p">S306:步驟</p>  
        <p type="p">S307:步驟</p>  
        <p type="p">S308:步驟</p>  
        <p type="p">S309:步驟</p>  
        <p type="p">S310:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2000" publication-number="202614599"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614599.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614599</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114134910</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>延時容忍度提升偵測</chinese-title>  
        <english-title>LATENCY TOLERANCE ESCALATION DETECTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251201B">H04L43/0852</main-classification>  
        <further-classification edition="202201120251201B">H04L41/0896</further-classification>  
        <further-classification edition="200601120251201B">G06F13/38</further-classification>  
        <further-classification edition="200601120251201B">G06F11/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>強生　馬修　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHNSON, MATTHEW R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝克　丹尼爾　Ｕ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BECKER, DANIEL U.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑德蓋特　喬伊　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANDGATHE, JOEL M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種設備包括一通訊網狀架構、複數個代理電路、一效能管理電路(performance management circuit, PMC)、及一除錯電路。該通訊網狀架構可將交易從來源電路轉移至目的地電路。該代理電路可根據該通訊網狀架構的一目前可用頻寬發布即時(real-time, RT)交易。該PMC可基於該目前可用頻寬來將各別頻寬使用目標分配至該等代理電路之多者。該除錯電路可存取該等代理電路的操作狀態。該等代理電路之一給定者亦可基於該各別頻寬使用目標不足以用於目前活動的一判定，在不影響該給定代理電路中之一或多個暫存器之一狀態的情況下，從該一或多個暫存器擷取一組目前值。該給定代理電路接著可將該組目前值的至少一部分發送至該除錯電路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An apparatus includes a communication fabric, a plurality of agent circuits, a performance management circuit (PMC), and a debug circuit. The communication fabric may transfer transactions from source circuits to destination circuits. The agent circuits may issue real-time (RT) transactions in accordance with a current available bandwidth of the communication fabric. The PMC may allocate, based on the current available bandwidth, respective bandwidth usage targets to ones of the agent circuits. The debug circuit may access operational states of the agent circuits. A given one of the agent circuits may also, based on a determination that the respective bandwidth usage target is insufficient for current activity, capture a set of current values from one or more registers in the given agent circuit without affecting a state of the registers. The given agent circuit may then send at least a portion of the set of current values to the debug circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:SOC</p>  
        <p type="p">101:效能管理電路</p>  
        <p type="p">110a~110d:代理電路</p>  
        <p type="p">120a~120e:延時提升偵測器(LED)電路；LED</p>  
        <p type="p">130a~130e:快照電路(SSC)</p>  
        <p type="p">130ba,130bb:SSC</p>  
        <p type="p">140:通訊網狀架構</p>  
        <p type="p">150:頻寬使用目標</p>  
        <p type="p">160:除錯電路</p>  
        <p type="p">165:緩衝電路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2001" publication-number="202614308"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614308.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614308</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135027</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>末端執行器、基底處理裝置及基底處理方法</chinese-title>  
        <english-title>END EFFECTOR, SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251112B">H01L21/67</main-classification>  
        <further-classification edition="200601120251112B">H01L21/677</further-classification>  
        <further-classification edition="200601120251112B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商尤金科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EUGENE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋炳奎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, BYOUNG GYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李葰錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUN SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供在支撐基底的同時旋轉基底的末端執行器、基底處理裝置及基底處理方法。末端執行器包括在一個方向上延伸的基板，以及設置在基板的中心部並配置為在根據壓力改變高度的同時提供旋轉力的升降旋轉單元。升降旋轉單元可包括支撐在基板上並可因壓力而壓縮的彈性體，以及配置為支撐基底並由彈性體支撐以便能夠在根據彈性體的壓縮而下降時旋轉的旋轉板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides an end effector that rotates a substrate while supporting the substrate, a substrate processing apparatus, and a substrate processing method. The end effector includes a base board extending in one direction, and an elevation rotation unit provided at a central portion of the base board and configured to provide rotational force while changed in height depending on a pressure. The elevation rotation unit may include an elastic body is supported on the base board and is compressible by the pressure, and a rotating plate configured to support a substrate and supported by the elastic body so as to be rotatable while descending according to the compression of the elastic body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基底</p>  
        <p type="p">100:末端執行器</p>  
        <p type="p">110:基板</p>  
        <p type="p">112:導引側壁</p>  
        <p type="p">120:升降旋轉單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2002" publication-number="202614568"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614568.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614568</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135037</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>多級自適應閘極驅動控制</chinese-title>  
        <english-title>MULTI-STAGE ADAPTIVE GATE DRIVE CONTROL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H03K17/687</main-classification>  
        <further-classification edition="200601120251229B">H02M1/088</further-classification>  
        <further-classification edition="200601120251229B">H03K17/082</further-classification>  
        <further-classification edition="200601120251229B">H03K17/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬國半導體國際有限合夥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>餘子威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, ZIWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>印　鍵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴國榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的裝置及相關方法涉及一種閘極驅動時序控制器（GDTC）。在一個示例性實施例中，GDTC可以生成功率級啟動訊號（PSAS）來控制功率級的MOSFET的輸出電流。三個上拉電晶體可以並聯電連接到控制輸出，配置為根據開關節點電壓（Vsw）和MOSFET的源極電感電壓（VLS）生成PSAS。第一上拉電晶體可以在接收到功率級的PWM訊號(脈波寬度調變Pulse-width modulation, PWM)時啟動，並根據VLS去啟動。第二上拉電晶體可以與PWM訊號同步。第三上拉電晶體可以在檢測到Vsw時啟動。各種實施例可以自適應地生成PSAS，以減少MOSFET的開啟損耗，同時保持較低的瞬態電壓尖峰。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatus and associated methods relate to a gate drive timing controller (GDTC). In an illustrative example, the GDTC may generate a power stage activation signal (PSAS) to control an output current of a MOSFET(s) of the power stage. Three pullup transistors, for example, may be electrically connected to the control output in parallel, configured to generate the PSAS as a function of a switch node voltage (Vsw) and a source inductance voltage (VLS) of the MOSFET. For example, a first pullup transistor may be activated when a PWM signal for the power stage is received, and deactivated based on the VLS. For example, a second pullup transistor may be synchronized with the PWM signal. For example, a third pullup transistor may be activated when the Vsw is detected. Various embodiments may advantageously generate the PSAS adaptively to reduce turn-on loss of the MOSFET while keeping a low transient voltage spike.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:自適應功率控制系統(APCS)</p>  
        <p type="p">105:電機</p>  
        <p type="p">110:高側開關功率包(HSPP)</p>  
        <p type="p">115:低側開關功率包(LSPP)</p>  
        <p type="p">120:直流電源</p>  
        <p type="p">125:高側功率驅動電路(HDM)</p>  
        <p type="p">130:低側功率驅動電路(LDM)</p>  
        <p type="p">140:自適應控制電路(AACC)</p>  
        <p type="p">150:感應模組</p>  
        <p type="p">155:源極電感電壓感應</p>  
        <p type="p">160:開關節點電壓感應</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2003" publication-number="202614010"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614010.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614010</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135038</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智慧多級功率驅動</chinese-title>  
        <english-title>SMART MULTI-STAGE POWER DRIVE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120251118B">G09G3/296</main-classification>  
        <further-classification edition="200601120251118B">G09G5/18</further-classification>  
        <further-classification edition="202001120251118B">H05B45/30</further-classification>  
        <further-classification edition="200601120251118B">H03K17/12</further-classification>  
        <further-classification edition="200601120251118B">H02M1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬國半導體國際有限合夥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>餘子威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, ZIWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安格凱提特拉古　習提彭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANGKITITRAKUL, SITTHIPONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>印　鍵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, JIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴國榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本裝置及相關方法涉及一種閘極驅動時序控制器（GDTC）。在一個示例性示例中，GDTC可包括控制輸出端，該控制輸出端配置為生成功率級啟動訊號（PSAS），以便控制功率級輸出。例如，控制輸出端可操作性地耦合到開關器件，該開關器件具有用於供電的功率 MOSFET 和感測場效電晶體。在一些實施例中，GDTC可包括配置為生成功率級啟動訊號的時序控制邏輯（TCL）。例如，TCL可包括三個上拉電晶體和三個下拉電晶體。例如，三個上拉電晶體和三個下拉電晶體的閘極端子由TCL根據與功率MOSFET的源極電壓相關的感測電壓分別控制。各種實施例可有利地允許基於從功率MOSFET感測的輸出電流自適應地生成功率級啟動訊號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatus and associated methods relate to a gate drive timing controller (GDTC). In an illustrative example, the GDTC may include a control output configured to generate a power stage activation signal (PSAS) to control a power stage output. For example, the control output may be operably coupled to a switch device having a power MOSFET for delivering power and a sense FET. In some embodiments, the GDTC may include a timing control logic (TCL) configured to generate the PSAS. For example, the TCL may include three pullup transistors and three pulldown transistors. For example, gate terminals of the three pullup transistors and the three pulldown transistors are separately controlled by the TCL as a function of the sense voltage related to a source voltage of the power MOSFET. Various embodiments may advantageously allow an adaptive generation of the PSAS based on a sensed output current from the power MOSFET.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:自適應功率控制系統(APCS)</p>  
        <p type="p">105:電機</p>  
        <p type="p">110:高側開關功率包(HSPP)</p>  
        <p type="p">115:低側開關功率包(LSPP)</p>  
        <p type="p">120:直流電源</p>  
        <p type="p">125:高側功率驅動電路(HDM)</p>  
        <p type="p">130:低側功率驅動電路(LDM)</p>  
        <p type="p">140:自適應控制電路(AACC)</p>  
        <p type="p">150:感應模組</p>  
        <p type="p">155:源極電感電壓感應</p>  
        <p type="p">160:開關節點電壓感應</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2004" publication-number="202613532"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613532.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613532</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135048</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>拍攝裝置、物品檢查裝置及拍攝方法</chinese-title>  
        <english-title>IMAGE CAPTURING DEVICE, ARTICLE INSPECTION DEVICE, AND IMAGE CAPTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G01N21/95</main-classification>  
        <further-classification edition="200601120251229B">G01N21/90</further-classification>  
        <further-classification edition="202301120251229B">H04N23/56</further-classification>  
        <further-classification edition="200601120251229B">G02B5/00</further-classification>  
        <further-classification edition="201701120251229B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商Ｎ　ＴＥＣＨ　股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA N-TECH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商養樂多本社股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA YAKULT HONSHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東邦商事股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOHOSHOJI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邊透</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, TOHRU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長瀬正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGASE, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豊島邦光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYOSHIMA, KUNIMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的拍攝裝置（11）具備照明部（20）、相機（30）、光路控制構件（40）、及控制部。照明部（20）會對配置在拍攝位置（SP）上的物品（12）進行照明。相對於物品（12）而言，相機（30）配置在照明部（20）的相反側的位置。光路控制構件（40）為板狀，其配置在照明部（20）與物品（12）之間。板表面（40S）上具有以2維狀的排列圖案排列的遮光部（41）及透光部（42）。控制部會使相機（30）拍攝穿透物品（12）及透光部（42）的穿透光的像（Img）。透光部（42）的節距為相機（30）的影像解析度以下。將被遮光部（41）限制成以特定的視野角穿透透光部（42）的穿透光的光軸作為穿透光軸（C2）時，穿透光軸（C2）會相對於相機（30）的拍攝光軸（C1）傾斜。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:拍攝裝置</p>  
        <p type="p">12:物品</p>  
        <p type="p">20:照明部</p>  
        <p type="p">30:相機</p>  
        <p type="p">40:光路控制構件</p>  
        <p type="p">40S:板表面</p>  
        <p type="p">41:遮光部</p>  
        <p type="p">42:透光部</p>  
        <p type="p">C1:拍攝光軸</p>  
        <p type="p">C2:穿透光軸</p>  
        <p type="p">Img:穿透光的像</p>  
        <p type="p">SP:拍攝位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2005" publication-number="202613866"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613866.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613866</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135049</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>塔結構物的設計方法、塔結構物的製造方法、以及塔結構物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251103B">G06F30/13</main-classification>  
        <further-classification edition="201601120251103B">F03D13/25</further-classification>  
        <further-classification edition="200601120251103B">E02D27/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JFE STEEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森岡宙光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIOKA, HIROMITSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大場雄登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHBA, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>難波隆行</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAMBA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種塔結構物的設計方法及塔結構物的製造方法，能夠在盡可能加長構成塔結構物的鋼管長度的同時，實現與塔結構物的高度方向變化的設計外力對應的合理結構，減少塔結構物的鋼材用量。&lt;br/&gt; 一種塔結構物的設計方法，所述塔結構物由在高度方向上層疊的多根鋼管焊接成為一體而構成，所述設計方法包括：第一設計步驟，在所述多根鋼管全部採用具有第一降伏強度σ&lt;sub&gt;y1&lt;/sub&gt;的第一鋼種，且上下相鄰的兩根鋼管的板厚差為預先設定的限制值以下的設計條件下，採用許容應力設計法來設計所述塔結構物，藉此算出所述多根鋼管各自的板厚t&lt;sub&gt;c1&lt;/sub&gt;；第二設計步驟，在所述多根鋼管全部採用所述第一鋼種，且不限制上下相鄰的兩根鋼管的板厚差的設計條件下，採用許容應力設計法來設計所述塔結構物，藉此算出所述多根鋼管各自的板厚t&lt;sub&gt;c2&lt;/sub&gt;；第一高度設定步驟，當所述第二設計步驟所算出的所述多根鋼管各自的板厚之中，存在上下相鄰的兩根鋼管的板厚差超過所述限制值的高度時，進一步從所述塔結構物的下端朝向上方探索所述超過的高度，藉此將最初探索到的所述超過的高度設定為第一高度h&lt;sub&gt;1&lt;/sub&gt;；第三設計步驟，所述多根鋼管之中，在從所述第一高度h&lt;sub&gt;1&lt;/sub&gt;以上的高度h&lt;sub&gt;L&lt;/sub&gt;到所述塔結構物的高度方向上的彎矩分布中彎矩最大的高度即第二高度h&lt;sub&gt;2&lt;/sub&gt;以上的高度h&lt;sub&gt;H&lt;/sub&gt;為止的範圍內的鋼管採用具有比所述第一降伏強度σ&lt;sub&gt;y1&lt;/sub&gt;更大的第二降伏強度σ&lt;sub&gt;y2&lt;/sub&gt;的第二鋼種，其他鋼管採用所述第一鋼種，且上下相鄰的兩根鋼管的板厚差為所述限制值以下的設計條件下，採用許容應力設計法來設計所述塔結構物，算出所述多根鋼管各自的板厚t&lt;sub&gt;c3&lt;/sub&gt;；以及判定步驟，判定所述多根鋼管是否全部滿足所述第三設計步驟所算出的所述板厚t&lt;sub&gt;c3&lt;/sub&gt;為所述第一設計步驟所算出的所述板厚t&lt;sub&gt;c1&lt;/sub&gt;以下之判定條件，當所述判定步驟判定為不滿足所述判定條件時，變更所述高度h&lt;sub&gt;L&lt;/sub&gt;和所述高度h&lt;sub&gt;H&lt;/sub&gt;之中至少一方，再次執行所述第三設計步驟之後的處理，並且當所述判定步驟判定為滿足所述判定條件時，將所述多根鋼管各自的板厚及鋼種設定為如所述第三設計步驟所設計那樣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:第一設計步驟</p>  
        <p type="p">S2:第二設計步驟</p>  
        <p type="p">S3:第一高度設定步驟</p>  
        <p type="p">S4:第三設計步驟</p>  
        <p type="p">S5:判定步驟</p>  
        <p type="p">S6:板厚設定步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2006" publication-number="202613805"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613805.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613805</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135072</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於關鍵性處理記憶體請求的機制</chinese-title>  
        <english-title>MECHANISMS FOR PROCESSING MEMORY REQUESTS BASED ON CRITICALITY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251201B">G06F9/30</main-classification>  
        <further-classification edition="200601120251201B">G06F9/06</further-classification>  
        <further-classification edition="201801120251201B">G06F9/44</further-classification>  
        <further-classification edition="201601120251201B">G06F12/08</further-classification>  
        <further-classification edition="200601120251201B">G06F13/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　瓊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, QIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>休伯蒂　泰勒　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUBERTY, TYLER J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅希拉　安瓦爾　Ｑ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROHILLAH, ANWAR Q.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬修斯　格雷戈里　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATHEWS, GREGORY S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克林葛夫　沃夫剛　Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLINGAUF, WOLFGANG H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古普塔　羅希特　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUPTA, ROHIT K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一實施例中，一種電腦系統包括經組態以耦接至一或多個記憶體裝置的一記憶體系統及經組態以對該記憶體系統發布讀取及寫入請求的處理器電路系統。該記憶體系統經組態以在處理複數個寫入請求的一寫入回合期間，接收一讀取請求及由該處理器電路系統指派之該讀取請求的一關鍵性的一指示。該記憶體系統進一步經組態以基於識別該讀取請求係一關鍵讀取請求的該指示及偵測到一組啟動標準獲滿足，從該寫入回合轉變至一讀取回合以處理該關鍵讀取請求而不完成該寫入回合。該記憶體系統經組態以執行處理包括該關鍵讀取請求的複數個讀取請求的該讀取回合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an embodiment, a computer system includes a memory system configured to couple to one or more memory devices and processor circuitry configured to issue read and write requests to the memory system. The memory system is configured to receive, during a write turn in which a plurality of write requests are processed, a read request and an indication of a criticality of the read request assigned by the processor circuitry. The memory system is further configured to, based on the indication identifying that the read request is a critical read request and a detection that a set of activation criteria is satisfied, transition, to process the critical read request, from the write turn to a read turn without completing the write turn. The memory system is configured to perform the read turn in which a plurality of read requests are processed including the critical read request.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:記憶體</p>  
        <p type="p">120:記憶體系統；組件</p>  
        <p type="p">130:讀取佇列</p>  
        <p type="p">140:寫入佇列</p>  
        <p type="p">150:轉變啟動電路系統；啟動電路系統</p>  
        <p type="p">410A:虛擬通道</p>  
        <p type="p">410B:虛擬通道</p>  
        <p type="p">410C:虛擬通道</p>  
        <p type="p">410D:虛擬通道</p>  
        <p type="p">420:仲裁電路系統</p>  
        <p type="p">430:啟動標準</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2007" publication-number="202612980"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612980.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612980</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135114</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以部署浮動單元之浮動碼頭</chinese-title>  
        <english-title>FLOATING QUAY TO DEPLOY FLOATING UNITS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251128B">B63B35/44</main-classification>  
        <further-classification edition="200601120251128B">B66C1/10</further-classification>  
        <further-classification edition="201601120251128B">F03D13/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法商德希尼布能源法國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHNIP ENERGIES FRANCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韋爾涅　弗雷德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERGNE, FREDERICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾拉　亞曼德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALLA, AHMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種浮動碼頭包括一甲板，該甲板可在一水體中遷移至相鄰於一固定碼頭以接收一或多個浮動單元。該甲板包括從該固定碼頭之一表面的一高度至低於該水體之一水面的一水位之一浸沒位置的一緩斜坡。該浮動碼頭進一步包括一升降機系統，該升降機系統可定位以將該甲板的至少一部分升高及降低，以從該固定碼頭接收該一或多個浮動單元，並使用該甲板的該緩斜坡將該一或多個浮動單元部署至該水體中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A floating quay includes a deck relocatable in a body of water adjacent a stationary quay to receive one or more floating units. The deck includes a gradual slope from an elevation of a surface of the stationary quay to a submerged position below a water level of a water surface of the body of water. The floating quay further includes an elevator system positionable to raise and lower at least a portion the deck to receive the one or more floating units from the stationary quay and to deploy the one or more floating units into the body of water using the gradual slope of the deck.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:浮動風力渦輪機</p>  
        <p type="p">102:浮動風力渦輪機平台；平台；柱</p>  
        <p type="p">104:半潛式柱；柱；第一柱</p>  
        <p type="p">106:半潛式柱；柱</p>  
        <p type="p">108:半潛式柱；柱</p>  
        <p type="p">110:連接構件；上部連接構件</p>  
        <p type="p">112:連接構件；下部連接構件</p>  
        <p type="p">114:風力渦輪機</p>  
        <p type="p">116:塔架；風力渦輪機塔架</p>  
        <p type="p">118:機艙</p>  
        <p type="p">120:可旋轉的轉子葉片</p>  
        <p type="p">122:水體</p>  
        <p type="p">124:表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2008" publication-number="202614871"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614871.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614871</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135155</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電網架構</chinese-title>  
        <english-title>POWER GRID ARCHITECTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251231B">H10D89/10</main-classification>  
        <further-classification edition="200601120251231B">H01L23/522</further-classification>  
        <further-classification edition="200601120251231B">H01L23/528</further-classification>  
        <further-classification edition="200601120251231B">H01L21/768</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉格凡　普瑞文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAGHAVAN, PRAVEEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科塔里　卡皮爾　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOTHARI, KAPIL K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏爾馬　阿比曼紐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARMA, ABHIMANYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裴　漢潔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, HANKYEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅德帕利　薩蒂什　Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDEPALLI, SATEESH V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾爾斯特　奧菲爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELSTER, OFIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">描述在積體電路裝置中之電力供應源、電力開關電路、與功能電路之間提供連接性的電網佈線。電網佈線包括從電力供應源至裝置之電力開關區域中的電力開關的實際電力供應電壓(TVDD)的佈線以及從電力開關至裝置之核心邏輯區域中的功能電路的經轉換電力供應電壓(VVDD)的佈線。亦描述接地供應電壓的佈線。佈線可包括在裝置之電晶體區域上方的頂側金屬層中的柱狀佈線（例如，主要垂直的電流傳輸佈線）及網狀佈線（例如，水平分布的佈線）的某些組合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Power grid routings that provide connectivity between power supply sources, power switch circuits, and functional circuits in integrated circuit devices are described. The power grid routings include routings for actual power supply voltage (TVDD) from the power supply source to the power switches in a power switch region of the device and converted power supply voltages (VVDD) from the power switches to the functional circuits in a core logic region of the device. Routings for ground supply voltage are also described. The routings may include certain combinations of pillar routings (e.g., primarily vertical current transfer routings) and mesh routings (e.g., horizontally distributed routings) in the topside metal layers above the transistor region of the device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:積體電路裝置；裝置</p>  
        <p type="p">110:電力供應源</p>  
        <p type="p">115:金屬佈線</p>  
        <p type="p">120:電晶體區域</p>  
        <p type="p">130:核心邏輯區域</p>  
        <p type="p">140:電力開關(PSW)區域；電力區域</p>  
        <p type="p">150:功能電路</p>  
        <p type="p">160:TVDD電力網路；TVDD</p>  
        <p type="p">170:VVDD電力網路；VVDD</p>  
        <p type="p">180:VSS電力網路；VSS</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2009" publication-number="202613807"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613807.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613807</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135173</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用多個偏向表的條件指示預測</chinese-title>  
        <english-title>CONDITIONAL INSTRUCTION PREDICTION WITH MULTIPLE BIAS TABLES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251201B">G06F9/38</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米夫塔胡特季諾夫　魯斯塔姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIFTAKHUTDINOV, RUSTAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧　歐托姆　穆阿維亞　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AL-OTOOM, MUAWYA M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JO</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金日賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, ILHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬杜里　尼基特　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOUDHARY, NIKET K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一實施例中，一電腦系統包括一處理器，該處理器具有預測電路系統，該預測電路系統經組態以提供關於一條件指令是否偏向一特定結果的一偏向預測，該特定結果影響該條件指令的一控制流程。該預測電路系統存取複數個表，以獲得該條件指令的偏向指示，該等偏向指示對應於一非循環狀態機中的狀態，且該複數個表經受破壞性混淆，該破壞性混淆允許多個條件指令映射至一表內的一相同項目。該預測電路系統可偵測一衝突，其中該等偏向指示包括該條件指令的不同偏向指示。該預測電路系統可基於該衝突的一解決方案來提供該偏向預測，該解決方案係基於對應於該等不同偏向指示的該非循環狀態機中的特定狀態的一相對排序來判定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In an embodiment, a computer system includes a processor having prediction circuitry configured to provide a bias prediction as to whether a conditional instruction is biased to a particular outcome that affects a control flow for the conditional instruction. The prediction circuitry accesses a plurality of tables to obtain bias indications for the conditional instruction, the bias indications corresponding to states in an acyclic state machine and the plurality of tables being subject to destructive aliasing that permits multiple conditional instructions to map to a same entry within a table. The prediction circuitry may detect a conflict in which the bias indications include different bias indications for the conditional instruction. The prediction circuitry may provide the bias prediction based on a resolution of the conflict that is determined based on a relative ordering of particular states in the acyclic state machine that correspond to the different bias indications.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">124:偏向預測電路系統；預測電路系統</p>  
        <p type="p">126A,126B:偏向表</p>  
        <p type="p">410A~410H:偏向指示</p>  
        <p type="p">510:雜湊電路系統</p>  
        <p type="p">515A,515B:雜湊函數</p>  
        <p type="p">520:預測電路系統</p>  
        <p type="p">525:解決電路系統</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2010" publication-number="202613688"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613688.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613688</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135183</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學裝置以及亮度與色度的補償方法</chinese-title>  
        <english-title>OPTICAL DEVICE AND LUMINANCE AND COLOR COMPENSATION METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251112B">G02F1/1335</main-classification>  
        <further-classification edition="200601120251112B">G02B5/30</further-classification>  
        <further-classification edition="200601120251112B">G02B27/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>源奇科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIQXTAL TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宏山</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, HUNG-SHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡國琳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, GUO-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學裝置包含發射光線的顯示裝置以及偏振旋轉器。偏振旋轉器設置於顯示裝置的發光表面之前。偏振旋轉器包含波板組件以及後偏振片。波板組件包含具有以第一角度定向的光軸之第一四分之一波板、具有以第二角度定向的光軸之第一半波板、以及具有以第三角度定向的光軸之第二四分之一波板，其中第一半波板在第一四分之一波板與第二四分之一波板之間，且第二角度不同於第一角度和第三角度。波板組件光學耦合於後偏振片與顯示裝置之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical device includes a display device emitting a light and a polarization rotator. The polarization rotator is disposed in front of a light emitting surface of the display device. The polarization rotator includes a wave plate assembly and a back polarizer. The wave plate assembly includes a first quarter-wave plate having an optical axis oriented at a first angle, a first half-wave plate having an optical axis oriented at a second angle, and a second quarter-wave plate having an optical axis oriented at a third angle, in which the first half-wave plate is between the first quarter-wave plate and the second quarter-wave plate, and the second angle is different from the first angle and the third angle. The wave plate assembly is optically coupling between the back polarizer and the display device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100a:光學裝置</p>  
        <p type="p">110:顯示裝置</p>  
        <p type="p">120:偏振旋轉器</p>  
        <p type="p">122:波板組件</p>  
        <p type="p">124:後偏振片</p>  
        <p type="p">HWP1:第一半波板</p>  
        <p type="p">L,L’:光線</p>  
        <p type="p">QWP1:第一四分之一波板</p>  
        <p type="p">QWP2:第二四分之一波板</p>  
        <p type="p">s1:發光表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2011" publication-number="202613800"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613800.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613800</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135219</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理指令的系統及方法</chinese-title>  
        <english-title>MSYSTEM AND METHOD FOR PROCESSING INSTRUCTIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251209B">G06F9/06</main-classification>  
        <further-classification edition="201801120251209B">G06F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張通</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, TONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾健平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZENG, JIANPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮茲馬尼　瑞克哈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PITCHUMANI, REKHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇　亮奭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KI, YANG SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭露一種系統。該系統可包括處理器，其包括暫存器和程式記憶體。重新排序元件可重新排序程式記憶體中儲存的程式碼清單中的第一類型指令集合中的第一指令和第二指令，第一指令和第二指令中的至少一個存取暫存器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system is disclosed. The system may include a processor including a register and a code memory. A reordering component may reorder a first instruction and a second instruction in a set of instructions of a first type in a list of code stored in the code memory, at least one of the first instruction and the second instruction accessing the register.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">205:機器</p>  
        <p type="p">210:處理器</p>  
        <p type="p">215:記憶體</p>  
        <p type="p">220:儲存裝置</p>  
        <p type="p">225:暫存器</p>  
        <p type="p">230:程式碼產生器</p>  
        <p type="p">235:記憶體控制器</p>  
        <p type="p">240:裝置驅動程式</p>  
        <p type="p">245:高頻寬記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2012" publication-number="202613089"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613089.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613089</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135242</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗蝕劑底層膜形成用組成物、半導體基板的製造方法及含芳香環的化合物的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C07D307/88</main-classification>  
        <further-classification edition="200601120251201B">C07D327/04</further-classification>  
        <further-classification edition="200601120251201B">C07D493/04</further-classification>  
        <further-classification edition="200601120251201B">C07D405/14</further-classification>  
        <further-classification edition="200601120251201B">C07D497/04</further-classification>  
        <further-classification edition="200601120251201B">C08G8/02</further-classification>  
        <further-classification edition="200601120251201B">G03F7/11</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＪＳＲ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JSR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平澤賢悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRASAWA, KENGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡勇気</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKA, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠形成埋入性及耐彎曲性優異的抗蝕劑底層膜的抗蝕劑底層膜形成用組成物、半導體基板的製造方法及含芳香環的化合物的製造方法。一種抗蝕劑底層膜形成用組成物，含有：含芳香環的化合物、以及溶媒，所述含芳香環的化合物為下述式（A1）、下述式（A2）或下述式（A3）所表示的化合物、或者具有下述式（A4）或下述式（A5）所表示的重複單元的聚合物。 &lt;br/&gt;[化1] &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="449px" width="266px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式（A1）～式（A5）中，X分別獨立地為-C(=O)-或-S(=O)&lt;sub&gt;2&lt;/sub&gt;-）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:抗蝕劑底層膜圖案</p>  
        <p type="p">3a:抗蝕劑底層膜圖案的橫側面</p>  
        <p type="p">X1、X2、X3、X4、X5、X6、X7、X8、X9、X10、Xa:位置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2013" publication-number="202613907"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613907.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613907</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135290</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>庫存管理方法及其系統</chinese-title>  
        <english-title>METHOD FOR MANAGING INVENTORY AND SYSTEM THEREFOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251103B">G06Q10/08</main-classification>  
        <further-classification edition="200601120251103B">G06F17/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商韓領有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COUPANG CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬赫什瓦里　迪柏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAHESHWARI, DEEPAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>魏崴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEI, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>強尼　拉維　拉朱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOHN, RAVI RAJU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森　蒂米</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEM, THIMMY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張光耀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, GUANGYAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金堰安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, YANAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裴賢俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, HYEON JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴里拉　拉胡爾　庫馬爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHARILLA, RAHUL KUMAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種庫存管理方法及其系統。根據本揭露的一實施例的庫存管理方法，其由計算裝置執行，可包括：對於第一庫存管理單位（Stock Keeping Unit），獲取第一履行中心（Fulfillment Center）的第一請求訂單數量及第二履行中心的第二請求訂單數量的步驟，合計上述第一請求訂單數量及上述第二請求訂單數量，獲取整體請求訂單數量的步驟，運算與上述整體請求訂單數量對應的最終訂單數量的步驟；以及將包括對於上述第一庫存管理單位的上述最終訂單數量的購買訂單發送至銷售商終端的步驟，上述最終訂單數量可以是訂購上述第一庫存管理單位的商品的最小單位即最小訂單單位數量的倍數（multiple）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided are a method for managing inventory and a system therefor. A method for managing inventory, performed by a computing device according to an exemplary embodiment of the present disclosure includes: obtaining a first request order quantity of a first fulfillment center and a second request order quantity of a second fulfillment center, for a first stock keeping unit; adding the first request order quantity and the second request order quantity and obtaining a total request order quantity; calculating a final order quantity corresponding to the total request order quantity; and transmitting a purchase order including the final order quantity for the first stock keeping unit to a vendor terminal, wherein the final order quantity is a multiple of a minimum order unit quantity, which is a minimum unit for ordering a product of the first stock keeping unit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:第一FC終端</p>  
        <p type="p">22:第二FC終端</p>  
        <p type="p">11:訂單確定模組</p>  
        <p type="p">12:移送確定模組</p>  
        <p type="p">30:銷售商終端</p>  
        <p type="p">40:物流中心終端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2014" publication-number="202613815"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613815.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613815</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135291</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>偵錯系統和用於操作偵錯系統之方法</chinese-title>  
        <english-title>DEBUG SYSTEM AND METHOD FOR OPERATING A DEBUG SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G06F11/26</main-classification>  
        <further-classification edition="200601120251201B">G01R31/3181</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>熵碼科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PUFSECURITY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許瀞文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHING-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳家徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHIA-CHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧彥彰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種偵錯系統，其包括偵錯傳輸模組、第一偵錯模組、第二偵錯模組和模組選擇器。第一偵錯模組耦接至第一處理核心，且第二偵錯模組耦接至第二處理核心。模組選擇器耦接至偵錯傳輸模組、第一偵錯模組和第二偵錯模組。當第一值被寫入偵錯傳輸模組的選擇資料暫存器時，偵錯傳輸模組控制模組選擇器選擇耦接在偵錯傳輸模組與第一偵錯模組之間的第一路徑。當第二值被寫入選擇資料暫存器時，偵錯傳輸模組控制模組選擇器選擇耦接在偵錯傳輸模組與第二偵錯模組之間的第二路徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a debug system including a DTM, a first DM, a second DM, and a module selector. The first DM is coupled to a first processing core, and the second DM is coupled to a second processing core. The module selector is coupled to the DTM, the first DM, and the second DM. When a selection data register of the DTM is written with a first value, the DTM controls the module selector to select a first path coupled between the DTM and the first DM. When the selection data register is written with a second value, the DTM controls the module selector to select a second path coupled between the DTM and the second DM.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:偵錯器</p>  
        <p type="p">200:偵錯系統</p>  
        <p type="p">210:偵錯傳輸模組(DTM)</p>  
        <p type="p">220,222:偵錯模組(DM)</p>  
        <p type="p">230,232,234:處理核心</p>  
        <p type="p">240:模組選擇器</p>  
        <p type="p">DR210:選擇資料暫存器</p>  
        <p type="p">PL2:硬體平台</p>  
        <p type="p">P1,P2:路徑</p>  
        <p type="p">TDI,TCK,TMS,TRST,TDO:接腳</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2015" publication-number="202613884"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613884.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613884</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135315</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用生成式人工智慧處理資料的方法、電子裝置及非暫態電腦可讀取儲存媒體</chinese-title>  
        <english-title>METHOD FOR PROCESSING DATA USING GENERATIVE ARTIFICIAL INTELLIGENCE, ELECTRONIC DEVICE AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251224B">G06N3/045</main-classification>  
        <further-classification edition="202201120251224B">G06V30/142</further-classification>  
        <further-classification edition="202001120251224B">G06F40/166</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁寶電腦工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COMPAL ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹惠文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAN, HUI WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林靜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種應用生成式人工智慧處理資料的方法、電子裝置及非暫態電腦可讀取儲存媒體。該方法由該電子裝置執行且包含：根據一使用者的一啟動輸入操作，取得並顯示對應的一文字信息；根據該使用者的一手寫輸入操作，取得並顯示對應的一手寫辨識信息；根據該使用者的一生成內容權重調整操作，產生一權重調整比例資訊；根據該使用者的一生成內容選擇輸入操作，產生一人工智慧資料處理模式；利用一生成式人工智慧根據該文字信息、該手寫辨識信息、該權重調整比例資訊及該人工智慧資料處理模式，產生一人工智慧生成內容；及顯示該人工智慧生成內容。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for processing data using generative artificial intelligence, an electronic device and a non-transitory computer-readable storage. The method is performed by the electronic device and includes: obtaining and displaying corresponding text information based on a startup input operation by an user; obtaining and displaying corresponding handwriting recognition information based on a handwriting input operation by the user; generating weight adjustment ratio information based on a generated content weight adjustment operation by the user; generating an AI data processing model based on a generated content selection input operation by the user; using a generative AI to generate AI-generated content based on the text information, the handwriting recognition information, the weight adjustment ratio information, and the AI data processing model; and displaying the AI-generated content.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">51~56:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2016" publication-number="202613361"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613361.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613361</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135329</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電極、電化學電池及其使用方法</chinese-title>  
        <english-title>ELECTRODE, ELECTROCHEMICAL CELL, AND METHOD OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251216B">C25B11/032</main-classification>  
        <further-classification edition="202101120251216B">C25B1/23</further-classification>  
        <further-classification edition="202201120251216B">B22F1/07</further-classification>  
        <further-classification edition="201001120251216B">H01M4/134</further-classification>  
        <further-classification edition="200601120251216B">H01B1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>香港理工大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE HONG KONG POLYTECHNIC UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佘小杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHE, XIAOJIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　樹平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAU, SHU PING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電極，其包括複數個金屬銀奈米粒子，其中該複數個金屬銀奈米粒子具有介於8.9至11.6之間之平均配位數及0.14%至0.81%之平均拉伸強度應變；一種包括其之電化學電池；以及其使用方法及其製備方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrode including a plurality of metallic silver nanoparticles, wherein the plurality metallic silver nanoparticles have an average coordination number between 8.9-11.6 and an average tensile strength strain of 0.14-0.81%, an electrochemical cell including the same, and methods of use thereof and preparation thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電化學電池</p>  
        <p type="p">101:電極</p>  
        <p type="p">102:相對電極</p>  
        <p type="p">103:陰離子交換膜</p>  
        <p type="p">104:質子交換膜</p>  
        <p type="p">105:CO&lt;sub&gt;2&lt;/sub&gt;入口</p>  
        <p type="p">106:入水口</p>  
        <p type="p">107:CO出口</p>  
        <p type="p">108:產物出口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2017" publication-number="202614054"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614054.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614054</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135332</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可組態的記憶體備置</chinese-title>  
        <english-title>CONFIGURABLE MEMORY PROVISIONING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G11C11/4078</main-classification>  
        <further-classification edition="200601120251201B">G11C29/52</further-classification>  
        <further-classification edition="200601120251201B">G06F13/14</further-classification>  
        <further-classification edition="201601120251201B">G06F12/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡　瓊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAI, QIONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">備置具有至少一第一維度及一第二維度之一種電腦系統之一記憶體子系統的部分，使得該等部分在正規操作期間不被使用。該設備包括一記憶體介面電路，該記憶體介面電路具有執行不同備置操作的備置電路。該記憶體介面電路經組態以接收一實體記憶體位址，並基於指示一第一備置操作的備置資訊而輸出一第一組選擇信號，該第一組選擇信號可用以存取該第一維度中的一些但非全部元件。該第一備置操作可包括式((y mod (C-1)) + z) mod C的一運算，其中C係該第一維度中之元件的一總數目，y係該實體記憶體位址的一相關部分，且z係指示該第一維度中的哪些元件將不被使用的一偏移值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provisioning portions of a memory subsystem of a computer system that has at least a first dimension and a second dimension, such that those portions are not used during normal operation. The apparatus includes a memory interface circuit having provisioning circuits performing different provisioning operations. The memory interface circuit is configured to receive a physical memory address, and output, based on provisioning information indicating a first provisioning operation, a first set of selection signals that are usable to access some, but not all, elements in the first dimension. The first provisioning operation may include an operation of the form ((y mod (C-1)) + z) mod C, where C is a total number of elements in the first dimension, y is a relevant portion of the physical memory address, and z is an offset value indicating which elements in the first dimension are to be unused.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電腦系統</p>  
        <p type="p">104:記憶體存取請求；請求</p>  
        <p type="p">120:記憶體介面電路</p>  
        <p type="p">127:路由電路</p>  
        <p type="p">150A~150Z:備置電路</p>  
        <p type="p">155:第一組選擇信號；選擇信號</p>  
        <p type="p">160:備置儲存器</p>  
        <p type="p">164:記憶體停用設定；設定；元件停用設定</p>  
        <p type="p">168:備置表</p>  
        <p type="p">170:備置資訊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2018" publication-number="202614117"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614117.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614117</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135337</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子顯微鏡</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251105B">H01J37/04</main-classification>  
        <further-classification edition="200601120251105B">H01J37/10</further-classification>  
        <further-classification edition="200601120251105B">H01J37/244</further-classification>  
        <further-classification edition="200601120251105B">H01J37/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅村恵多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMEMURA, KEITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圓山百代</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENYAMA, MOMOYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森本剛史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORIMOTO, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池上明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEGAMI, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川本雄太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAMOTO, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種電子顯微鏡，其即便於有電子之加減速之情形，亦毋須調整電子之成像位置。 &lt;br/&gt;　　一種電子顯微鏡，係具備：第一傳達透鏡，係以固定之條件傳達電子；入射側靜電透鏡，係使藉由前述第一傳達透鏡傳達之電子減速或加速；軌道變化部，係使藉由前述入射側靜電透鏡減速或加速之電子之軌道變化；出射側靜電透鏡，係使軌道藉由前述軌道變化部變化之電子加速或減速；以及第二傳達透鏡，係以固定之條件傳達藉由前述出射側靜電透鏡減速或加速之電子；該電子顯微鏡之特徵為：前述出射側靜電透鏡，係具有第一透鏡及第二透鏡，前述第一透鏡，係使軌道藉由前述軌道變化部變化之電子聚焦於前述第二透鏡之中心點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電子線</p>  
        <p type="p">101:第一傳達透鏡</p>  
        <p type="p">102:入射側靜電透鏡</p>  
        <p type="p">103:軌道變化部</p>  
        <p type="p">104:出射側靜電透鏡</p>  
        <p type="p">104A:第一透鏡</p>  
        <p type="p">104B:第二透鏡</p>  
        <p type="p">105:第二傳達透鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2019" publication-number="202614105"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614105.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614105</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135383</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電解電容器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251118B">H01G9/035</main-classification>  
        <further-classification edition="200601120251118B">H01G9/052</further-classification>  
        <further-classification edition="200601120251118B">H01G9/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本貴彌功股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON CHEMI-CON CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柏崎悠汰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASHIWAZAKI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部浩大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, KOHTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長原和宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAHARA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>甲斐智明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAI, TOMOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電解電容器，即便陽極體為粉末積層箔，亦可抑制洩漏電流隨時間的增大。本發明包括陽極體、與陽極體相向的陰極體、介隔存在於陽極體與陰極體之間的隔板、以及介隔存在於陽極體與陰極體之間的電解液。陽極體具有閥作用金屬的箔體、包含閥作用金屬的粉末且積層於所述陽極體的箔體上的粉末層、以及電介質皮膜。陰極體具有閥作用金屬的箔體、以及積層於所述陰極體的箔體上的導電層。電解液包含水分、醇類及具有羧基的化合物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2020" publication-number="202614309"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614309.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614309</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135384</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>加熱器及半導體製程設備</chinese-title>  
        <english-title>HEATER AND SEMICONDUCTOR PROCESSING EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251105B">H01L21/67</main-classification>  
        <further-classification edition="200601120251105B">H05B1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張雲龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, YUN LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡帥帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, SHUAI SHUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚瑞雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, RUI LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開了一種加熱器及半導體製程設備，屬於半導體技術領域。加熱器包括環狀的加熱體、環繞加熱體設置的保溫環和支撐組件，支撐組件與保溫環連接，支撐組件設置有用於支撐加熱體的限位空間，加熱體搭接在限位空間內，限位空間在保溫環的外壁至保溫環的內壁的延伸方向上的寬度大於所述加熱體的厚度。該方案中，加熱體可在限位空間內正常膨脹變形，使加熱體不易扭曲變形，支撐組件不易與保溫環分離，進而延長加熱體和保溫環的使用壽命。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application discloses a heater and a semiconductor processing equipment, belonging to the field of semiconductor technology. The heater includes an annular heating element, a heat‑retaining ring arranged around the heating element, and a supporting component. The supporting component is connected to the heat‑retaining ring and is provided with a limiting space for supporting the heating element. The heating element is placed within the limiting space, and the width of the limiting space, in the direction extending from the outer wall to the inner wall of the heat‑retaining ring, is greater than the thickness of the heating element. In this solution, the heating element can expand and deform normally within the limiting space, making it less prone to twisting or warping. The supporting component is also less likely to separate from the heat‑retaining ring, thereby extending the service life of both the heating element and the heat‑retaining ring.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:保溫環</p>  
        <p type="p">500:加熱體</p>  
        <p type="p">600:支撐組件</p>  
        <p type="p">611:第一限位部</p>  
        <p type="p">612:第二限位部</p>  
        <p type="p">613:保溫環連接部</p>  
        <p type="p">616:限位空間</p>  
        <p type="p">631:導向部</p>  
        <p type="p">632:同心連接部</p>  
        <p type="p">800:同心控制件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2021" publication-number="202614653"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614653.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614653</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135404</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用者設備以及使用者設備執行的方法</chinese-title>  
        <english-title>USER EQUIPMENT AND METHOD PERFORMED BY USER EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W24/10</main-classification>  
        <further-classification edition="200601120251201B">H04L5/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿瓦丁　穆罕默德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AWADIN, MOHAMED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>裵　正鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAE, JUNG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供使用者設備和由使用者設備執行的方法。使用者設備向配置為子頻帶全雙工的基地台通訊一或多個層1-跨鏈路干擾報告能力和一或多個層3-跨鏈路干擾報告能力，一或多個層1-跨鏈路干擾報告能力包括支援的層1-跨鏈路干擾量測資源的最大數量，以及一或多個層3-跨鏈路干擾報告能力包括支援的層3-跨鏈路干擾量測資源的最大數量。使用者設備從基地台接收跨鏈路干擾報告配置。使用者設備執行與層1-跨鏈路干擾量測資源相關聯的層1-跨鏈路干擾量測，層1-跨鏈路干擾量測基於跨鏈路干擾報告配置。使用者設備執行與層3-跨鏈路干擾量測資源相關聯的層3-跨鏈路干擾量測，層3-跨鏈路干擾量測基於跨鏈路干擾報告配置。使用者設備基於跨鏈路干擾報告配置產生層1-跨鏈路干擾報告和層3-跨鏈路干擾報告。使用者設備向基地台報告層1-跨鏈路干擾報告和層3-跨鏈路干擾報告。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A user equipment and a method performed by the user equipment are provided. A UE communicates, to a base station configured for SBFD, one or more L1-CLI reporting capabilities and one or more L3-CLI reporting capabilities, the one or more L1-CLI reporting capabilities including a maximum number of supported L1-CLI measurement resources, and the one or more L3-CLI reporting capabilities including a maximum number of supported L3-CLI measurement resources. The UE receives, from the base station, a CLI reporting configuration. The UE performs L1-CLI measurements associated with the L1-CLI measurement resources, the L1-CLI measurements based on the CLI reporting configuration. The UE performs L3-CLI measurements associated with the L3-CLI measurement resources, the L3-CLI measurements based on the CLI reporting configuration. The UE generates an L1-CLI report and an L3-CLI report based on the CLI reporting configuration. The UE reports, to the base station, the L1-CLI report and the L3-CLI report.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110,120,130,140,150,160,170,180,190:操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2022" publication-number="202613926"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613926.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613926</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135465</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>商品資訊的推薦方法、裝置、設備、介質及程式產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">G06Q30/0214</main-classification>  
        <further-classification edition="202301120251103B">G06Q30/02</further-classification>  
        <further-classification edition="201201120251103B">G06Q50/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商中國銀聯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉礪志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俞曉強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佟志臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣海儉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閔青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種商品資訊的推薦方法、裝置、設備、介質及程式產品，屬於資料處理領域。該方法包括：根據樣本用戶對商品的申請傾向資訊對推薦模型進行訓練，得到推薦模型預測的樣本用戶的偏好商品資訊集合；基於申請傾向資訊、偏好商品資訊集合和大語言模型，對推薦模型進行反覆運算訓練，直至推薦模型的性能參數滿足預設條件，將推薦模型確定為目標推薦模型，大語言模型用於從偏好商品資訊集合中提取用於對推薦模型進行反覆運算訓練的樣本資訊；利用目標推薦模型根據被測用戶對商品的申請傾向資訊，得到推薦商品資訊並向被測用戶推送。根據本發明實施例能夠提升推薦模型為用戶推薦商品資訊的準確性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101,S102,S103:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2023" publication-number="202612628"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612628.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612628</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135524</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>掃地機器人的避障方法和裝置、掃地機器人及儲存媒體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251112B">A47L11/24</main-classification>  
        <further-classification edition="200601120251112B">A47L11/40</further-classification>  
        <further-classification edition="202401120251112B">G05D1/241</further-classification>  
        <further-classification edition="202401120251112B">G05D1/43</further-classification>  
        <further-classification edition="202401120251112B">G05D1/622</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁勝軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QI, SHENGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種掃地機器人的避障方法和避障裝置、掃地機器人及儲存媒體。該避障方法回應於掃地機器人的碰撞感測器被觸發，判斷掃地機器人當前是出基座還是上基座；若掃地機器人當前是出基座，則確定當前的過機器中心的移動方向為第一方向，控制掃地機器人停止行進，根據被觸發的碰撞感測器確定第一旋轉方向；控制掃地機器人從第一方向按照第一旋轉方向旋轉第一預設角度後，繼續行駛第一預設距離，控制掃地機器人停止行進，將當前的機器中線方向調整回第一方向，繼續進行出基座。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101、S102、S103:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2024" publication-number="202613458"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613458.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613458</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135538</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>空氣淨化裝置及空氣淨化工作台</chinese-title>  
        <english-title>AIR PURIFICATION DEVICE AND AIR PURIFICATION TABLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251121B">F24F3/16</main-classification>  
        <further-classification edition="201801120251121B">F24F11/79</further-classification>  
        <further-classification edition="202101120251121B">F24F8/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葳潔科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEIJIE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱芎蓉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, CHIUNG-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種空氣淨化裝置及空氣淨化工作台。空氣淨化裝置包括機體及延伸組件。機體內部包含電源模組、控制單元、離子產生器及氣流產生模組。控制單元電性連接於所述電源模組。離子產生器電性連接於所述電源模組，並由所述控制單元控制以產生離子。氣流產生模組電性連接於所述電源模組，並由所述控制單元控制以產生氣流。延伸組件連接於所述機體，與所述離子產生器及氣流產生模組連通，所述延伸組件具有一開口，所述開口配置以釋放包含離子之氣流。本發明的空氣淨化裝置可有效清除粉塵及懸浮微粒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides an air purification device and an air purification table. The air purification device includes a device body and an extension assembly. The device body accommodates a power module, a control unit, a ion generator, and an airflow generation module. The control unit is electrically connected to the power module. The ion generator is electrically connected to the power module and controlled by the control unit to generate ions. The airflow generation module is electrically connected to the power module and controlled by the control unit to generate airflow. The extension assembly is connected to the device body and communicates with both the ion generator and the airflow generation module. The extension assembly has an outlet configured to release airflow containing ions. The air purification device of the present invention can effectively remove dust and suspended particles.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:空氣淨化裝置</p>  
        <p type="p">11:機體</p>  
        <p type="p">111:電源模組</p>  
        <p type="p">112:控制單元</p>  
        <p type="p">113:離子產生器</p>  
        <p type="p">113a:管件</p>  
        <p type="p">114:氣流產生模組</p>  
        <p type="p">114a:管件</p>  
        <p type="p">13:延伸組件</p>  
        <p type="p">13a:開口</p>  
        <p type="p">15:安裝組件</p>  
        <p type="p">151:集塵墊</p>  
        <p type="p">T1:承載裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2025" publication-number="202613509"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613509.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613509</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135546</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電極基板和液體檢測感測器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G01M3/16</main-classification>  
        <further-classification edition="200601120251229B">H01M12/06</further-classification>  
        <further-classification edition="200601120251229B">G01N27/403</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商藤倉複合材料科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIKURA COMPOSITES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今井諭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAI, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋昌樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的電極基板(10)的特徵在於具備具有第一面(21)和第二面(22)的基材(20)、以彼此分離的方式配置在基材(20)的第一面(21)上或第二面(22)上的正極(30)和負極(40)，並因液體滲透到正極(30)和負極(40)之間而進行放電，正極(30)和負極(40)之間的距離為0.1mm以上至100mm以下。另外，藉由具備與電極基板(10)電連接的發送部(70)或通知部(80)，能夠成為可檢測液體附著的液體檢測感測器(100)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:電極基板</p>  
        <p type="p">20:基材</p>  
        <p type="p">30:正極</p>  
        <p type="p">40:負極</p>  
        <p type="p">D1:第一方向</p>  
        <p type="p">L:長度方向</p>  
        <p type="p">W:寬度方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2026" publication-number="202614834"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614834.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614834</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135552</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>量子點分散液、半導體膜、半導體膜之製造方法、光檢測元件及影像感測器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251229B">H10D62/81</main-classification>  
        <further-classification edition="202501120251229B">H10F77/169</further-classification>  
        <further-classification edition="202501120251229B">H10F30/21</further-classification>  
        <further-classification edition="202501120251229B">H10F39/12</further-classification>  
        <further-classification edition="202301120251229B">H04N25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田淵敦子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TABUCHI, ATSUKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種量子點分散液，其包含量子點、配位體及溶劑，其中，上述量子點包含帶隙為1.35eV以下、圓形度為0.40以上且小於0.75的第1量子點及帶隙為1.35eV以下、圓形度為0.75以上且1.0以下的第2量子點，從上述量子點分散液中去除上述配位體和上述溶劑之成分中的量子點的含量為50質量%以上。一種使用了量子點分散液之半導體膜、半導體膜之製造方法、光檢測元件及影像感測器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2027" publication-number="202613749"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613749.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613749</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135636</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種機器人移動方法及相關裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251124B">G05D1/644</main-classification>  
        <further-classification edition="202401120251124B">G05D1/646</further-classification>  
        <further-classification edition="202401120251124B">G05D1/639</further-classification>  
        <further-classification edition="202401120251124B">G05D1/43</further-classification>  
        <further-classification edition="200601120251124B">B25J9/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國大陸商深圳市庫寶軟件有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENZHEN KUBO SOFTWARE CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國大陸商深圳市海柔創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAI ROBOTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商深圳市海柔智能科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAI INTELLIGENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AI, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李匯祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, HUIXIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳宇奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YUQI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尚磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭睿群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, JUI-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐聖東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, SHENGDONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀畊宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種機器人移動方法及相關裝置，方法包括：接收來自伺服器的至少一個移動指令，至少一個移動指令包括第一類移動指令和/或第二類移動指令；當至少一個移動指令包括第一類移動指令時，根據第一移動欄位移動至第一預約路徑點；當至少一個移動指令包括第二類移動指令，且根據條件欄位和參考機器人的狀態確定目標機器人滿足移動條件時，根據第二移動欄位移動至第二預約路徑點。可以提高機器人的移動效率，降低機器人的物理損耗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210:步驟</p>  
        <p type="p">S220:步驟</p>  
        <p type="p">S230:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2028" publication-number="202612830"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612830.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612830</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135639</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於形成通孔之方法及系統</chinese-title>  
        <english-title>METHODS AND SYSTEMS FOR FORMING VIAS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251205B">B23K26/062</main-classification>  
        <further-classification edition="201401120251205B">B23K26/36</further-classification>  
        <further-classification edition="201401120251205B">B23K26/50</further-classification>  
        <further-classification edition="201401120251205B">B23K26/57</further-classification>  
        <further-classification edition="200601120251205B">H01L21/02</further-classification>  
        <further-classification edition="200601120251205B">H01L21/302</further-classification>  
        <further-classification edition="200601120251205B">H01L23/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍斯　大衛馬克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANCE, DAVID MARK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯特列利佐夫　亞歷山大米哈伊洛維奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STRELTSOV, ALEXANDER MIKHAILOVICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種處理一基板之方法包括引導一脈衝式雷射光束穿過一視窗基板以在一液體輔助介質內形成一焦斑。一安裝總成包括該視窗基板及位於該視窗基板之一表面處的一個或多個間隔體。一基板附接至該一個或多個間隔體，使得在該基板之一第一表面與該視窗基板之該表面之間存在一間隙。該液體輔助介質存在於該間隙內及該基板之一第二表面處。該方法包括使該焦斑沿著穿過該基板之該第二表面、穿過該基板之一本體且穿過該基板之該第一表面的一運動路徑移動，以在該基板中產生一通孔。該通孔包含在該基板之該第二表面上及/或該基板之該第一表面上的多於一個開口。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of processing a substrate includes directing a pulsed laser beam through a window-substrate to form a focal spot within a liquid assist medium. A mount assembly includes the window-substrate and one or more spacers located at a surface of the window-substrate. A substrate is attached to the one or more spacers such that a gap is present between a first surface of the substrate and the surface of the window-substrate. The liquid-assist medium is present within the gap and at a second surface of the substrate. The method includes moving the focal spot over a motion path through the second surface of the substrate, through a body of the substrate, and through the first surface of the substrate, to create a via in the substrate. The via comprises more than one opening on the second surface of the substrate and/or on the first surface of the substrate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:液體輔助的基於雷射之微加工系統(「系統」)</p>  
        <p type="p">20:雷射源</p>  
        <p type="p">22:脈衝式雷射光束/實質上準直之雷射光束</p>  
        <p type="p">22F:聚焦雷射光束</p>  
        <p type="p">30:可移動的精密x-y-z載物台</p>  
        <p type="p">40:聚焦光學系統</p>  
        <p type="p">44:可移動載物台</p>  
        <p type="p">50:比色皿</p>  
        <p type="p">70:支撐基座</p>  
        <p type="p">AZ:系統軸線</p>  
        <p type="p">x,y,z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2029" publication-number="202612934"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612934.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612934</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135641</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>支撐裝置以及兒童載具</chinese-title>  
        <english-title>SUPPORT DEVICE AND CHILD CARRIER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251112B">B60N2/28</main-classification>  
        <further-classification edition="200601120251112B">B62B9/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭征文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, ZHENGWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪爾學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ERXUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫明星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, MINGXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種支撐裝置，其包括第一框體、第二框體、樞轉關節和第一鎖定機構。樞轉關節包括設置在所述第一框體上的第一樞接座和設置在所述第二框體上的第二樞接座。所述第一樞接座和所述第二樞接座樞接，使得所述第一框和所述第二框體可樞轉地連接，以允許所述支撐裝置在展開狀態和折疊狀態之間可切換。第一鎖定機構設置在所述第一樞接座和所述第二樞接座之間，並且能夠鎖定或解鎖所述第一框體和所述第二框體之間的相對樞轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a support device comprising a first frame body, a second frame body, a pivot joint and a first locking mechanism. The pivot joint includes a first pivot base disposed on the first frame body and a second pivot base disposed on the second frame body. The first pivot base and the second pivot base are pivotally connected such that the first frame body and the second frame body are pivotally connected to allow the support device to switch between an unfolded state and a folded state. The first locking mechanism is provided between the first pivot base and the second pivot base and is capable of locking or unlocking relative pivoting between the first frame body and the second frame body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:支撐裝置</p>  
        <p type="p">80:載具架體</p>  
        <p type="p">90:承載裝置</p>  
        <p type="p">100:第一框體</p>  
        <p type="p">200:第二框體</p>  
        <p type="p">300:樞轉關節</p>  
        <p type="p">810:前腳架</p>  
        <p type="p">820:後腳架</p>  
        <p type="p">830:推手架</p>  
        <p type="p">1042:卡接件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2030" publication-number="202613825"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613825.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613825</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135642</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>命令處理電路、命令處理方法及PIM裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251001B">G06F12/0893</main-classification>  
        <further-classification edition="201601120251001B">G06F12/0802</further-classification>  
        <further-classification edition="200601120251001B">G06F3/06</further-classification>  
        <further-classification edition="201801120251001B">G06F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商長鑫科技集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CXMT CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣明峰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, MINGFENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開提供一種命令處理電路、命令處理方法和PIM裝置。命令處理電路包括：PIM命令識別模組，與PIM裝置的命令位址匯流排電連接，被配置為，通過命令位址匯流排接收命令訊號，並判斷當前接收的命令訊號的類型；若判定當前接收的命令訊號為DRAM常規命令，則將命令訊號發送給常規命令處理模組；若判定當前接收的命令訊號為PIM相關命令，則將命令訊號發送給PIM命令處理模組；PIM命令處理模組，與PIM命令識別模組電連接，被配置為，接收PIM相關命令，並對PIM相關命令進行解碼處理，並根據解碼結果進行相應的操作；常規命令處理模組，與PIM命令識別模組電連接，被配置為，接收DRAM常規命令，並對DRAM常規命令進行解碼處理。本公開至少有利於避免模式切換，提高系統性能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:命令處理電路</p>  
        <p type="p">20:PIM命令識別模組</p>  
        <p type="p">30:PIM命令處理模組</p>  
        <p type="p">40:常規命令處理模組</p>  
        <p type="p">50:執行模組</p>  
        <p type="p">60:命令採樣模組</p>  
        <p type="p">70:PIM裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2031" publication-number="202612877"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612877.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612877</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135654</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>板狀體切斷裝置、石膏板製造裝置、石膏板的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B26D1/40</main-classification>  
        <further-classification edition="200601120251231B">B28D1/22</further-classification>  
        <further-classification edition="200601120251231B">B28B11/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商吉野石膏股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHINO GYPSUM CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白田茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRATA, SHIGERU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤晴彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOH, HARUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種板狀體切斷裝置，其具有：輸送板狀體的輸送裝置，切斷板狀體的切斷裝置，以及測量由輸送裝置輸送的板狀體的長度的接觸型長度測量裝置，切斷裝置包括：上刃，其具有第一輥和第一刀具，下刃，其具有第二輥和第二刀具，第一伺服電機，其使第一輥以第一旋轉軸為中心旋轉，第二伺服電機，其使第二輥以第二旋轉軸為中心旋轉，以及旋轉控制裝置，其控制第一伺服電機的旋轉和第二伺服電機的旋轉，旋轉控制裝置根據長度測量裝置的測量結果，控制第一伺服電機、第二伺服電機的旋轉，用第一刀具和第二刀具夾持板狀體，切斷板狀體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:板狀體切斷裝置</p>  
        <p type="p">11:板狀體</p>  
        <p type="p">111:板狀體</p>  
        <p type="p">112:板狀體</p>  
        <p type="p">12:輸送裝置</p>  
        <p type="p">121:上遊側輸送裝置</p>  
        <p type="p">122:下遊側輸送裝置</p>  
        <p type="p">122A:輸送輥</p>  
        <p type="p">13:切斷裝置</p>  
        <p type="p">14:長度測量裝置</p>  
        <p type="p">141:測量部</p>  
        <p type="p">142:控制裝置</p>  
        <p type="p">15:旋轉控制裝置</p>  
        <p type="p">16:位置變更裝置</p>  
        <p type="p">161:第一位置變更裝置</p>  
        <p type="p">162:第二位置變更裝置</p>  
        <p type="p">17:位置檢測裝置</p>  
        <p type="p">171:第一位置檢測裝置</p>  
        <p type="p">18:位置比較裝置</p>  
        <p type="p">19:空氣供給裝置</p>  
        <p type="p">21:上刃</p>  
        <p type="p">211:第一輥</p>  
        <p type="p">212:第一刀具</p>  
        <p type="p">213:第一旋轉軸</p>  
        <p type="p">214:第一伺服電機</p>  
        <p type="p">215:第一軸承</p>  
        <p type="p">2151:第一軸承</p>  
        <p type="p">2152:第一軸承</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2032" publication-number="202612985"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612985.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612985</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135690</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>枕式包裝裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251023B">B65B9/06</main-classification>  
        <further-classification edition="200601120251023B">B65B57/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鈴木製作所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI MANUFACTURING, LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田慎一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, SHINICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新関陽介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIIZEKI, YOUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種構造簡單但能夠對應被包裝物之長短，將被包裝物美觀且確實地包裝之枕式包裝裝置。該枕式包裝裝置10具有：薄膜供給部20；供給輸送機25；供給偵測感測器30；搬送輸送機35；中心密封部40；端部密封部45；間隔輸入部50，輸入先行之被包裝物H之後端Hb與下一個被包裝物H之前端Ha之間隔G；以及搬送輸送機動作部65，在從搬送輸送機35已停止之狀態，供給偵測感測器30偵測到被包裝物H之前端Ha時，使搬送輸送機35進行動作，且在來自供給偵測感測器30之偵測訊號中斷時，將被包裝物H搬送對應間隔G的距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:枕式包裝裝置</p>  
        <p type="p">23:薄膜形成部</p>  
        <p type="p">24:間隔件</p>  
        <p type="p">25:供給輸送機</p>  
        <p type="p">30:供給偵測感測器</p>  
        <p type="p">35:搬送輸送機</p>  
        <p type="p">40:中心密封部</p>  
        <p type="p">45:端部密封部</p>  
        <p type="p">46:熱密封部</p>  
        <p type="p">55:間隔偵測感測器</p>  
        <p type="p">60:搬出輸送機</p>  
        <p type="p">F:薄膜</p>  
        <p type="p">G:間隔</p>  
        <p type="p">H:被包裝物</p>  
        <p type="p">Ha:前端</p>  
        <p type="p">Hb:後端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2033" publication-number="202613624"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613624.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613624</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135774</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於矽光子波導之化學塊</chinese-title>  
        <english-title>CHEMICAL BLOCKS FOR SILICON PHOTONIC WAVEGUIDES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251215B">G02B6/122</main-classification>  
        <further-classification edition="200601120251215B">G02B6/13</further-classification>  
        <further-classification edition="200601120251215B">G02B6/136</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商無蓋燈光電公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OPENLIGHT PHOTONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪力克　艾迪亞　辛格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MALIK, ADITYA SINGH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾柏格　艾利克　裘漢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NORBERG, ERIK JOHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>欒　恩驍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUAN, ENXIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>包特斯　賈德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAUTERS, JARED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種矽光子裝置，其包含一半導體結構及一矽基基板。該基板係接合至該半導體結構，且經圖案化以包括一波導、一經墊高結構及一化學障壁結構。一通道係界定於該經墊高結構與該波導之間，使得該半導體結構在一第一方向上圍封該通道，且界定該通道之一口。該口在垂直於該第一方向之一第二方向上敞開。該化學障壁結構經定位以防止液體經由該口進入該通道之至少一部分中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A silicon photonic device includes a semiconductor structure and a silicon-based substrate. The substrate is bonded to the semiconductor structure and patterned to comprise a waveguide, a raised structure, and a chemical barrier structure. A channel is defined between the raised structure and the waveguide, such that the semiconductor structure encloses the channel in a first direction and defines a mouth of the channel. The mouth opening in a second direction perpendicular to the first direction. The chemical barrier structure is positioned to prevent ingress of liquid into at least a portion of the channel via the mouth.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:矽基板</p>  
        <p type="p">106:最終半導體結構</p>  
        <p type="p">108:波導</p>  
        <p type="p">110:第一經墊高結構</p>  
        <p type="p">112:第二經墊高結構</p>  
        <p type="p">114:第一通道</p>  
        <p type="p">116:第二通道</p>  
        <p type="p">118:口</p>  
        <p type="p">300:第二混合矽光子裝置</p>  
        <p type="p">302:縱向軸線</p>  
        <p type="p">304:化學障壁結構</p>  
        <p type="p">306:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2034" publication-number="202614661"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614661.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614661</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135788</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於行動通訊的調適性邏輯通道優先處理之方法及裝置</chinese-title>  
        <english-title>METHODS AND APPARATUSES FOR ADAPTIVE LOGICAL CHANNEL PRIORITIZATION IN MOBILE COMMUNICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">H04W72/04</main-classification>  
        <further-classification edition="200901120251103B">H04W28/02</further-classification>  
        <further-classification edition="202201120251103B">H04L47/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宏達國際電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HTC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李衍毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YEN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何建勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提出用於行動通訊的調適性（adaptive）邏輯通道優先處理（Logical Channel Prioritization，LCP）的方案。適用之裝置（如：使用者設備(User Equipment，UE)）可選擇用於上行（uplink，UL）授權之複數個邏輯通道，該複數邏輯通道之每一者皆配置有一優先級。然後，在符合至少一條件之情況下，所述裝置對該複數邏輯通道中之至少一邏輯通道套用一額外優先級，該至少一條件包括一第一條件，該第一條件為：該至少一邏輯通道乘載之資料關聯到一封包資料匯聚協定（Packet Data Convergence Protocol，PDCP）丟棄計時器之一剩餘時間，該剩餘時間小於一門檻值。接著，依據套用了該額外優先級而決定之一優先級遞減排序，所述裝置將該上行授權之資源分配給該複數邏輯通道中之一或多個邏輯通道，該一或多個邏輯通道之每一者關聯到一正數之權杖（token）數量。最後，所述裝置根據該上行授權之資源分配，執行到該網路節點之一新傳輸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various solutions for adaptive logical channel prioritization (LCP) in mobile communications are described. An apparatus may select a plurality of logical channels, each configured with a priority, for an uplink (UL) grant, and apply an additional priority for at least one of the logical channels in an event that the at least one of the logical channels carries data with a remaining time of an associated packet data convergence protocol (PDCP) discard timer less than a threshold. Then, the apparatus may allocate resources of the UL grant to one or more of the logical channels, each associated with a positive number of tokens, in a decreasing priority order determined based on the additional priority being applied. The apparatus may further perform a new transmission based on the allocation of the resources of the UL grant.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:程序</p>  
        <p type="p">610~640:區塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2035" publication-number="202614594"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614594.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614594</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135794</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>集群管理方法、計算伺服器、交換機及集群系統</chinese-title>  
        <english-title>CLUSTER MANAGEMENT METHOD, COMPUTING SERVER, SWITCH, AND CLUSTER SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202201120251001B">H04L41/0803</main-classification>  
        <further-classification edition="202201120251001B">H04L41/12</further-classification>  
        <further-classification edition="202201120251001B">H04L41/0893</further-classification>  
        <further-classification edition="202201120251001B">H04L41/0894</further-classification>  
        <further-classification edition="202201120251001B">H04L61/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商杭州光智元科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANGZHOU GUANGZHIYUAN TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈亦晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, YI CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孟懷宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MENG, HUAI YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜亞華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, YAHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及集群管理方法、計算伺服器、交換機及集群系統，所述集群包括集群管理伺服器和多個節點，每一個所述節點包括多個計算伺服器和至少一個交換機，每一個計算伺服器包括多個計算設備，所述集群管理方法包括：所述集群管理伺服器接收所述計算伺服器和交換機各自的IP位址，並且為所述計算伺服器分配伺服器ID；所述計算伺服器將自身的伺服器ID寫入該計算伺服器的各計算設備；所述交換機從與之相連的計算設備讀取同一節點中的計算伺服器的伺服器ID，並將所述同一節點中的計算伺服器的伺服器ID發送給所述集群管理伺服器；所述集群管理伺服器建立同一節點內計算伺服器的伺服器ID、計算伺服器的IP位址、交換機的IP位址中至少兩者之間的映射關係。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a cluster management method, a computing server, a switch, and a cluster system. The cluster includes a cluster management server and multiple nodes. Each of the nodes includes multiple computing servers and at least one switch. Each computing server includes multiple computing devices. The cluster management method includes the steps of receiving, by the cluster management server, respective IP addresses of the computing servers and the switch; assigning respective server IDs to the computing servers; writing, by the computing servers, their own server IDs into the computing devices of the computing servers respectively; reading, by the switches, the server IDs of computing servers in the same node from the computing devices connected thereto; sending the server IDs of the computing servers in the same node to the cluster management server; and establishing, by the cluster management server, a mapping relationship between at least two of the server ID of the computing server, the IP address of the computing server, and the IP address of the switch in the same node.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300A~300D:計算伺服器</p>  
        <p type="p">301:節點管理模組</p>  
        <p type="p">302:計算設備</p>  
        <p type="p">400:交換機</p>  
        <p type="p">401:交換機晶片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2036" publication-number="202612954"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612954.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612954</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135804</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>轉接架及輪式移動裝置</chinese-title>  
        <english-title>ADAPTER AND WHEELED MOBILE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251126B">B62B3/02</main-classification>  
        <further-classification edition="200601120251126B">B62B3/04</further-classification>  
        <further-classification edition="200601120251126B">A01K1/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商居佳國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANI INTERNATIONAL PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁家良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, JIALIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭征文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, ZHENGWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了用於將可攜式載具連接於輪式移動裝置的轉接架，以及包括轉接架的輪式移動裝置。轉接架包括：底座，其適於可拆卸地安裝至輪式移動裝置；以及限位件，其可活動地連接至底座。限位件相對於底座具有第一位置和第二位置，以使得轉接架在展開狀態和收合狀態之間可切換。當限位件處於第一位置時，轉接架處於展開狀態，限位件用於限制可攜式載具相對於底座的移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An adapter for connecting a portable carrier to a wheeled mobile device, and a wheeled mobile device including the adapter are disclosed. The adapter includes a base adapted to be removably mounted on the wheeled mobile device, and a limiting member movably connected to the base. The limiting member has a first position and a second position relative to the base such that the adapter is switchable between an unfolded state and a folded state. When the limiting member is at the first position, the adapter is in the unfolded state, and the limiting member is configured to restrict movement of the portable carrier relative to the base.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:轉接架</p>  
        <p type="p">110:底座</p>  
        <p type="p">111:第一桿件</p>  
        <p type="p">111a:第一卡桿</p>  
        <p type="p">111b:第一延伸桿</p>  
        <p type="p">112:第二桿件</p>  
        <p type="p">112a:第二卡桿</p>  
        <p type="p">112b:第二延伸桿</p>  
        <p type="p">113:連接桿</p>  
        <p type="p">120:限位件</p>  
        <p type="p">121:限位桿</p>  
        <p type="p">1211:中間段</p>  
        <p type="p">1212:連接段</p>  
        <p type="p">122:側片</p>  
        <p type="p">130:束帶</p>  
        <p type="p">150:固定件</p>  
        <p type="p">152:第一定位部</p>  
        <p type="p">160:扣具</p>  
        <p type="p">161:第一扣件</p>  
        <p type="p">162:第二扣件</p>  
        <p type="p">170:旋轉關節</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2037" publication-number="202614310"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614310.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614310</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135809</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於蝕刻反應器的渦輪分子泵及陰極組件</chinese-title>  
        <english-title>TURBOMOLECULAR PUMP AND CATHODE ASSEMBLY FOR ETCHING REACTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L21/67</main-classification>  
        <further-classification edition="200601120251229B">H01L21/302</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘭姆研究公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAM RESEARCH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>立爾　托爾斯滕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LILL, THORSTEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格雷戈爾　馬里烏斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREGOR, MARIUSCH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">呈現一種蝕刻半導體基板的處理腔室及方法。該處理腔室係對稱的，其中用以保持半導體基板的台座之卡盤及主桿的中心線係與位於泵的核心中之通道的中心線、以及與氣體通口的中心線對準，該泵係用以將處理腔室抽氣，而氣體係通過該氣體通口而被導引至處理腔室。主桿延伸穿過通道，且螺旋溝槽係形成在通道中且僅形成在主桿或核心之內表面的一者中，以提供泵抽作用，以抵銷氣體在介於主桿與核心之間的間隙內以中間且黏性流動的狀態從泵的排氣口之回流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A processing chamber and method of etching a semiconductor substrate are presented. The processing chamber is symmetric, with the centerlines of a chuck and stem of a stage to retain a semiconductor substrate aligned with a centerline of a passage in a core of a pump used to evacuate the processing chamber and with a centerline of a gas port through which gas is introduced to the processing chamber. The stem extends through the passage and a spiral groove is formed in the passage in only one of the stem or an inner surface of the core to provide pumping action to counter back streaming of the gas from an exhaust of the pump in an intermediate and viscous flow regime inside a gap between the stem and the core.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:處理腔室</p>  
        <p type="p">102:裝載通口</p>  
        <p type="p">104:氣體通口</p>  
        <p type="p">110:泵篩網</p>  
        <p type="p">120:可動台座</p>  
        <p type="p">122:卡盤</p>  
        <p type="p">124:主桿</p>  
        <p type="p">126:基板</p>  
        <p type="p">130:泵</p>  
        <p type="p">132:轉子核心</p>  
        <p type="p">134:貫穿通道</p>  
        <p type="p">142:來源RF</p>  
        <p type="p">152:偏壓RF</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2038" publication-number="202614399"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614399.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614399</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135812</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括冷卻模組的基板處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250927B">H01L23/34</main-classification>  
        <further-classification edition="200601120250927B">B05B1/14</further-classification>  
        <further-classification edition="200601120250927B">H01L23/467</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＰＳＫ控股公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PSK HOLDINGS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>全塞別</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUN, SAEBYUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金旻洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MINSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴載鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, JAEHO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基板處理裝置，其包括用於對加熱處理後的基板進行冷卻的冷卻模組，所述基板處理裝置包括：冷卻板，用於將所述基板安置於所述冷卻模組的內部空間；氣體注入部，用於向所述冷卻模組的所述內部空間供應冷卻氣體；以及擴散器，配置在所述冷卻板和所述氣體注入部之間，並且具有用於將所述冷卻氣體均勻供應到所述基板的上部的多個噴射孔，多個所述噴射孔以從所述擴散器的底面的中心形成同心圓的形式相互間隔排列。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:工位</p>  
        <p type="p">31:腔室</p>  
        <p type="p">40:殼體</p>  
        <p type="p">40a:底壁</p>  
        <p type="p">40b:上部壁</p>  
        <p type="p">50:冷卻板</p>  
        <p type="p">60:升降構件</p>  
        <p type="p">65:驅動裝置</p>  
        <p type="p">70:氣體注入部</p>  
        <p type="p">80:擴散器</p>  
        <p type="p">80B:底面</p>  
        <p type="p">81:水平圓盤部</p>  
        <p type="p">82:支撐構件</p>  
        <p type="p">85:緊固結構</p>  
        <p type="p">88:密封構件</p>  
        <p type="p">200:冷卻模組</p>  
        <p type="p">S:基板</p>  
        <p type="p">H:噴射孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2039" publication-number="202614311"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614311.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614311</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135837</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反應腔室、密封系統以及操作反應腔室之方法</chinese-title>  
        <english-title>REACTION CHAMBERS, SEALING SYSTEM AND METHOD OF OPERATING REACTION CHAMBER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/67</main-classification>  
        <further-classification edition="200601120251201B">H01L21/677</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍尼波爾　肯尼思</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONNIBALL, KENNETH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種反應腔室可包含：一基座，其經組態以支撐設置於反應腔室容積中之一基板；一上部腔室空間，其在該基座上方；一下部腔室空間，其在該基座下方；及/或一密封系統。該密封系統可使得該上部腔室空間與該下部腔室空間至少部分地流體分離。該密封系統可包含：一分隔板，其環繞該基座；及/或一密封構件，其附接至該基座。該密封系統可經組態以在該分隔板與該密封構件之間形成至少一部分真空密封，且引起該上部腔室空間與該下部腔室空間之間的至少部分流體分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A reaction chamber may comprise a susceptor configured to support a substrate disposed in the reaction chamber volume, an upper chamber space above the susceptor, a lower chamber space below the susceptor, and/or a sealing system. The sealing system may cause the upper chamber space and the lower chamber space to be at least partially fluidly separated. The sealing system may comprise a spacer plate surrounding and/or a sealing member attached to the susceptor. The sealing system may be configured to form at least a partial vacuum seal between the spacer plate and the sealing member and cause at least partial fluid separation between the upper chamber space and the lower chamber space.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:反應器</p>  
        <p type="p">103:裝載位置</p>  
        <p type="p">104:基座升降機</p>  
        <p type="p">110:反應腔室</p>  
        <p type="p">112:上部腔室空間</p>  
        <p type="p">114:下部腔室空間</p>  
        <p type="p">130:基座</p>  
        <p type="p">139:升降銷</p>  
        <p type="p">150:基板</p>  
        <p type="p">160:分隔板</p>  
        <p type="p">170:密封構件</p>  
        <p type="p">171:面朝上的表面</p>  
        <p type="p">172:面朝下的表面</p>  
        <p type="p">180:流體分配系統</p>  
        <p type="p">190:真空源</p>  
        <p type="p">192:控制器</p>  
        <p type="p">196:惰性氣體源</p>  
        <p type="p">198:真空源</p>  
        <p type="p">202:升降銷升降機/平台</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2040" publication-number="202614149"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614149.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614149</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135845</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理方法及電漿處理設備</chinese-title>  
        <english-title>PLASMA PROCESSING METHODS AND APPARATUSES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘭傑　艾洛克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RANJAN, ALOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凡特薩克　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VENTZEK, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大秦充敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHATA, MITSUNORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一電漿處理方法包含提供第一來源功率(SP)脈衝至SP耦合元件維持一第一SP脈衝持續時間，以在處理腔室中產生電漿；提供高頻偏壓功率(HBP)脈衝至設於處理腔室中之基板固持器維持一HBP脈衝持續時間，該HBP脈衝持續時間與第一SP脈衝持續時間重疊；及提供第一低頻偏壓功率(LBP)脈衝至基板固持器維持一第一LBP脈衝持續時間，該第一LBP脈衝持續時間不與第一SP脈衝持續時間重疊。HBP脈衝包含大於800 kHz的HBP脈衝頻率。第一LBP脈衝包含低於約800 kHz的LBP脈衝頻率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A plasma processing method includes providing a first source power (SP) pulse to an SP coupling element for a first SP pulse duration to generate plasma in a processing chamber, providing a high frequency bias power (HBP) pulse to a substrate holder disposed in the processing chamber for a HBP pulse duration overlapping the first SP pulse duration, and providing a first low frequency bias power (LBP) pulse to the substrate holder for a first LBP pulse duration not overlapping the first SP pulse duration. The HBP pulse includes an HBP pulse frequency that is greater than 800 kHz. The first LBP pulse includes an LBP pulse frequency that is less than about 800 kHz.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">55:遮罩</p>  
        <p type="p">57:鈍化層</p>  
        <p type="p">200:時序圖</p>  
        <p type="p">201:階段</p>  
        <p type="p">202:階段</p>  
        <p type="p">203:階段</p>  
        <p type="p">205:質化圖表</p>  
        <p type="p">206:示意圖</p>  
        <p type="p">209:脈衝循環</p>  
        <p type="p">212:SP脈衝</p>  
        <p type="p">222:LBP脈衝</p>  
        <p type="p">232:HBP脈衝</p>  
        <p type="p">256:基板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2041" publication-number="202614182"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614182.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614182</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135852</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於混成接合應用的介穩細晶粒銅</chinese-title>  
        <english-title>METASTABLE FINE GRAIN COPPER FOR HYBRID BONDING APPLICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">H01L21/288</main-classification>  
        <further-classification edition="200601120251231B">C25D3/38</further-classification>  
        <further-classification edition="200601120251231B">C25D13/10</further-classification>  
        <further-classification edition="200601120251231B">C25D5/50</further-classification>  
        <further-classification edition="200601120251231B">H01L21/768</further-classification>  
        <further-classification edition="200601120251231B">H01L21/324</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商麥克德米德恩索有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MACDERMID ENTHONE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉　萍萍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YE, PINGPING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓　建偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, JIANWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃爾薩維　阿卜杜勒哈米德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELSAWY, ABDELHAMID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布雷耶　史蒂芬Ｉ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRAYE, STEPHAN I.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>惠頓　凱爾Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WHITTEN, KYLE M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉道奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, TAOCHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李察森　湯瑪斯Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHARDSON, THOMAS B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>納賈爾　耶里Ｈ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAJJAR, ELIE H.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫寶成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝祥遇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種在一基材上電沉積包含一細晶粒銅結構的一銅膜之方法。該方法包括下列步驟：(a)使該基材與電沉積組成物接觸；及(b)在該基材上沉積具有該細晶粒銅結構的該銅膜。該銅膜中之銅晶粒的最大尺寸通常小於約200 nm。此外，當將該銅膜在至多且包括170℃之溫度下退火一時段時，該銅膜中之該等銅晶粒的該最大尺寸保持小於約200 nm。當將該銅膜在200℃或更高之溫度下退火時，該等銅晶粒生長至少20%或更多。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of electrodepositing a copper film comprising a fine grain copper structure on a substrate. The method includes the steps of: (a) bringing the substrate into contact with an electrodeposition composition; and (b) depositing the copper film having the fine grain copper structure on the substrate. A largest dimension of the copper grains in the copper film is typically less than about 200 nm. In addition, the largest dimension of the copper grains in the copper film remains at less than about 200 nm when the copper film is annealed at a temperature of up to and including 170°C for a period of time. The copper grains grow by at least 20% or more when the copper film is annealed at a temperature of 200°C or higher. &lt;b&gt;&lt;u&gt;  &lt;/u&gt;&lt;/b&gt;</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2042" publication-number="202614909"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614909.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614909</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135889</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水晶片、使用其的水晶元件及水晶元件用的中間體晶片以及水晶片的製造方法</chinese-title>  
        <english-title>CRYSTAL ELEMENT, QUARTZ CRYSTAL DEVICE USING THE SAME, AND INTERMEDIATE WAFER FOR QUARTZ CRYSTAL DEVICE, AND METHOD FOR MANUFACTURING CRYSTAL ELEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251103B">H10N30/80</main-classification>  
        <further-classification edition="200601120251103B">H03H9/02</further-classification>  
        <further-classification edition="202301120251103B">H10N30/01</further-classification>  
        <further-classification edition="200601120251103B">H03H3/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本電波工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIHON DEMPA KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木啓之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種水晶片，具有：由源自X軸的第一軸以及源自Z軸的第二軸規定的第一軸-第二軸平面、以及源自Y軸的第三軸，且第一軸-第二軸平面設為主表面、第三軸設為厚度方向。第一軸的第一側面及第一軸的第二側面分別由源自水晶的結晶面以及具有與水晶片的主表面的法線平行的輪廓的面構成。第二軸的第一側面及第二軸的第二側面分別由源自水晶的結晶面以及具有與主表面的法線平行的輪廓的面構成，或由與主表面的法線不平行的水晶來源的結晶面構成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A crystal element having a first axis-second axis plane specified by a first axis derived from an X-axis and a second axis derived from a Z-axis as a principal surface and having a third axis derived from a Y-axis as a thickness direction. The first side surface of the first axis and the second side surface of the first axis are each constituted of a crystal face derived from the crystal and a plane that has a contour parallel to a normal line of the principal surface. The first side surface of the second axis and the second side surface of the second axis are each constituted of a crystal face derived from the crystal and a plane that has a contour parallel to a normal line of the principal surface, or constituted of a crystal face derived from the crystal non-parallel to the normal line of the principal surface.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:實施形態的水晶片/水晶片</p>  
        <p type="p">10a:第一軸(水晶的X軸)</p>  
        <p type="p">10aa:第一軸的第一側面/第一側面/側面</p>  
        <p type="p">10ab:第一軸的第二側面/第二側面/側面</p>  
        <p type="p">10b:第二軸(水晶的Z'軸)</p>  
        <p type="p">10ba:第二軸的第一側面/第一側面/側面</p>  
        <p type="p">10bb:第二軸的第二側面/第二側面/側面</p>  
        <p type="p">10c:主表面</p>  
        <p type="p">10ca:水晶片的其中一個主表面/主表面</p>  
        <p type="p">10cb:水晶片的另一個主表面/主表面</p>  
        <p type="p">10cc:法線/主表面的法線</p>  
        <p type="p">10d:第三軸(水晶的Y'軸)</p>  
        <p type="p">10e:水晶的結晶面/結晶面</p>  
        <p type="p">10e1:第一結晶面/結晶面</p>  
        <p type="p">10e2:第二結晶面/結晶面</p>  
        <p type="p">10f:面/垂直面/與法線平行的面(與主表面垂直的面)</p>  
        <p type="p">10fa:面10f的輪廓/輪廓</p>  
        <p type="p">10g、10i、10h、10j:水晶片的4個角部/角部</p>  
        <p type="p">11:激勵用電極</p>  
        <p type="p">11a:引出電極</p>  
        <p type="p">R:中心點</p>  
        <p type="p">t:厚度</p>  
        <p type="p">t1、X1、X2、Z1、Z2:尺寸</p>  
        <p type="p">X、Y':軸/方向/坐標軸</p>  
        <p type="p">Z':軸/方向/端面/坐標軸</p>  
        <p type="p">θ1、θ2、θ3、θa、θb、θc、θd、θe、θf:角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2043" publication-number="202613410"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613410.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613410</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於變頻器的真空泵控制方法、裝置、設備及儲存介質</chinese-title>  
        <english-title>METHOD, APPARATUS, AND DEVICE FOR VFD-BASED VACUUM PUMP CONTROL, AND STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251023B">F04B49/06</main-classification>  
        <further-classification edition="200601120251023B">F04B37/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京通嘉宏瑞科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING GRAND HITEK.CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜新星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIANG, XIN-XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱世仁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基於變頻器的真空泵控制方法、裝置、設備及儲存介質。所述方法包括：獲取真空泵的當前運行參數；基於當前運行參數，在多個預設運行工況中確定真空泵的當前運行工況；在多個預設關聯關係中，確定當前運行工況下的目標關聯關係，其中，每一預設關聯關係中包括變頻器對真空泵的預設控制參數、預設控制參數關聯的調整後控制參數；獲取變頻器對真空泵的目標控制參數；若滿足預設條件，將目標控制參數作為一個預設控制參數，並在目標關聯關係中，確定目標控制參數關聯的調整後控制參數，採用目標控制參數關聯的調整後控制參數替換目標控制參數，以使變頻器按照替換後的目標控制參數驅動真空泵。本發明可以提高真空泵的效率和穩定性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed are a method, an apparatus, and a device for VFD-based vacuum pump control and a storage medium . The method includes: obtaining a current operating parameter of the vacuum pump; determining a current operating condition of the vacuum pump from among a plurality of preset operating conditions based on the current operating parameter; determining a target association relationship under the current operating condition from among a plurality of preset association relationships, each of the preset association relationships including a preset control parameter of the VFD with respect to the vacuum pump, and an adjusted control parameter associated with the preset control parameter; obtaining a target control parameter of the VFD with respect to the vacuum pump; determining, if a preset condition is satisfied, in the target association relationship, an adjusted control parameter associated with the target control parameter taken as a preset control parameter, and replacing the target control parameter with the adjusted control parameter associated with the target control parameter so that the VFD drives the vacuum pump according to the adjusted control parameter. The disclosure may enhance efficiency and stability of the vacuum pump..</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2044" publication-number="202613630"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613630.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613630</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135918</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光連接器插頭</chinese-title>  
        <english-title>OPTICAL CONNECTOR PLUG</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G02B6/36</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商本多通信工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONDA TSUSHIN KOGYO CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>関真二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEKI, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大久保靖明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHKUBO, YASUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉崎毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIZAKI, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">光連接器插頭，係一種可對具有套管插入孔的插座進行插拔的光連接器插頭。且，光連接器插頭具有：套管，其前端面露出光纖，並插入套管插入孔；以及密封構件，其設套管。此外，密封構件，用以密封套管的外周面與護蓋的內周面之間的間隙，該護蓋罩在套管上並覆蓋套管的前端面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical connector plug is an optical connector plug which should be inserted and extracted with respect to a receptacle having a ferrule insertion hole. The optical connector plug has a ferrule that should be inserted into the ferrule insertion hole and has a tip surface from which an optical fiber exposes, and a sealing member provided on the ferrule. The sealing member seals a gap between an outer peripheral surface of the ferrule and an inner peripheral surface of a cap covered on the ferrule to cover the tip surface of the ferrule.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:光連接器插頭</p>  
        <p type="p">3:光纖</p>  
        <p type="p">21:套管</p>  
        <p type="p">21a:前端面</p>  
        <p type="p">21b:後端面</p>  
        <p type="p">22:密封構件</p>  
        <p type="p">23:導引銷</p>  
        <p type="p">24:銷擋塊</p>  
        <p type="p">25:螺旋彈簧</p>  
        <p type="p">26:插頭框架</p>  
        <p type="p">27:護套</p>  
        <p type="p">28:耦合器</p>  
        <p type="p">29:護蓋</p>  
        <p type="p">35:露出部</p>  
        <p type="p">211:前端部</p>  
        <p type="p">212:後端部</p>  
        <p type="p">214:孔</p>  
        <p type="p">218:凹部</p>  
        <p type="p">261d:突起</p>  
        <p type="p">269:彈性卡止片</p>  
        <p type="p">269a:爪部</p>  
        <p type="p">272:光纖插通孔</p>  
        <p type="p">282:擋塊</p>  
        <p type="p">283:開口</p>  
        <p type="p">283a:內周面</p>  
        <p type="p">284:開口</p>  
        <p type="p">285:施力部</p>  
        <p type="p">291:凸緣</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2045" publication-number="202614372"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614372.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614372</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135942</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合基板、應用其之半導體裝置及其製造方法</chinese-title>  
        <english-title>COMPOSITE SUBSTRATE, SEMICONDUCTOR DEVICE USING THE SAME AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H01L23/15</main-classification>  
        <further-classification edition="200601120251103B">H01L23/367</further-classification>  
        <further-classification edition="200601120251103B">H01L23/373</further-classification>  
        <further-classification edition="200601120251103B">H01L23/48</further-classification>  
        <further-classification edition="200601120251103B">H01L23/498</further-classification>  
        <further-classification edition="200601120251103B">H01L23/538</further-classification>  
        <further-classification edition="200601120251103B">H01L21/768</further-classification>  
        <further-classification edition="200601120251103B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>銓心半導體異質整合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ND-HI TECHNOLOGIES LAB, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈺創科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ETRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐和明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TONG, HO-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧超群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHAO-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祁明輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林素華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>涂綺玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種具有導熱材料的複合基板。複合基板包括一玻璃基材、一第一重布層、一第二重布層及一散熱層。玻璃基材具有一第一表面、一與第一表面相對的第二表面以及一從第一表面延伸至第二表面的貫穿玻璃孔。第一重布層鄰近玻璃基材之第一表面配置。第二重布層鄰近玻璃基材之第二表面配置。散熱層配置在玻璃基材上，且具有一延伸至貫穿玻璃孔的貫穿導熱孔。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A composite substrate containing thermally conductive materials is provided. The composite substrate includes a glass base, a first RDL, a second RDL and a thermal dissipation layer. The glass base has a first surface, a second surface opposite to the first surface and a through glass via (TGV) extending to the second surface from the first surface. The first RDL is disposed adjacent to the first surface of the glass base or the thermal dissipation layer. The second RDL is disposed adjacent to the second surface of the glass base. The thermal dissipation layer is disposed on the glass base, having a through thermal via (TTV) extending to the TGV.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:複合基板</p>  
        <p type="p">110:玻璃基材</p>  
        <p type="p">110s1:第一表面</p>  
        <p type="p">110s2:第二表面</p>  
        <p type="p">110a:貫穿玻璃孔</p>  
        <p type="p">120:第一重布層</p>  
        <p type="p">130:第二重布層</p>  
        <p type="p">140:散熱層</p>  
        <p type="p">140a:貫穿導熱孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2046" publication-number="202613878"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613878.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613878</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135987</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於同時提供消息摘要和其相關圖像的方法、電腦裝置及電腦程式</chinese-title>  
        <english-title>METHOD, COMPUTER DEVICE, AND COMPUTER PROGRAM TO PROVIDE MESSAGE SUMMARY AND ASSOCIATED IMAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251001B">G06F40/35</main-classification>  
        <further-classification edition="202501120251001B">G06F16/33</further-classification>  
        <further-classification edition="201901120251001B">G06F16/9532</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商連加股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINE PLUS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權順鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, SOON HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李周洪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JOOHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹喆煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUN, CHUL-HWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>扈智秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, JI SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開用於同時提供消息摘要和相關圖像的方法、電腦裝置及電腦程式。用於同時提供消息摘要和相關圖像的方法可包括如下步驟：請求搜索與基於聊天室內消息生成的消息摘要（message summary）相關的圖像；回應於圖像搜索請求，接收包括至少一個圖像的圖像包；以及匹配所述消息摘要顯示所述圖像包。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S310,S320,S330:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2047" publication-number="202613551"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613551.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613551</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114135995</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作為癌診斷用生物標記之外被體蛋白質複合體次單元β２</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G01N33/68</main-classification>  
        <further-classification edition="200601120260102B">G01N33/574</further-classification>  
        <further-classification edition="200601120260102B">C07K16/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＩＳＭ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISM CO., LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松崎潤太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUZAKI, JUNTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朝倉啓介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAKURA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮戸光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYATO, MITSURU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種血液試樣中之癌診斷用生物標記，其包含外被體蛋白質複合體次單元β2(COPB2)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2048" publication-number="202613750"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613750.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613750</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136009</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智能清潔方法和裝置、自動清潔設備及儲存媒體</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251128B">G05D1/648</main-classification>  
        <further-classification edition="200601120251128B">A47L11/40</further-classification>  
        <further-classification edition="200601120251128B">A47L11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, QING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種智能清潔方法和裝置、自動清潔設備及儲存媒體，涉及智能機器人技術領域。該方法接收自動搜尋目標物體並將目標物體放到指定位置的控制指令；解析並執行控制指令，按照預設搜索演算法自動搜尋目標物體；當搜尋到目標物體時，對目標物體進行抓取；在完成抓取後，攜帶所抓取的目標物體自動前往至指定位置，將目標物體放置到指定位置。本實施例實現了對目標物體的自動搜尋和搬運，能夠實現對目標物體的有效清潔，無需人工干預，能夠適應變化的工作條件和需求，具有較好的靈活性和適應性，提高了清潔的效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S101、S102、S103、S104:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2049" publication-number="202614020"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614020.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614020</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136016</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置、顯示控制電路與影像處理方法</chinese-title>  
        <english-title>DISPLAY DEVICE, DISPLAY CONTROL CIRCUIT AND IMAGE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251001B">G09G3/3208</main-classification>  
        <further-classification edition="200601120251001B">G09G5/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯詠科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李祖城</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, TSU CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖硯韜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, YEN-TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林匯峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HUI-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種顯示裝置、顯示控制電路與影像處理方法。顯示裝置包括OLED顯示面板以及顯示控制電路。顯示控制電路調整輸入圖框中的週邊區的資料，以產生輸出圖框。OLED顯示面板顯示輸出圖框，其中輸出圖框包括主要區和亮度低於主要區的週邊區。主要區是人眼注視的區域。主要區為正常亮度以維持視效。週邊區的亮度調低可以節省能耗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a display device, a display control circuit, and an image processing method. The display device includes an OLED display panel and a display control circuit. The display control circuit adjusts data of a surrounding area of an input frame to generate an output frame. The OLED display panel displays the output frame which includes a main area and the surrounding area having less luminance than the main area. The main area is the area where the human eye is focused. The main area is set to normal luminance to maintain visual effects. The luminance of the surrounding area is lowered to save energy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S510、S520:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2050" publication-number="202613002"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613002.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613002</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136024</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>設備的並行輸入/輸出擴展裝置</chinese-title>  
        <english-title>PARALLEL INPUT/OUTPUT EXPANSION DEVICE FOR EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">B65G1/137</main-classification>  
        <further-classification edition="200601120251103B">G05B19/418</further-classification>  
        <further-classification edition="200601120251103B">G05B19/402</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商肯塔斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANTOPS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成烈權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, YOUL KWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳學瑞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, HAK SEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹成赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOUN, SUNG HYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔亨哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, HYEONG CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺基明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, GI MYUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種設備的並行輸入/輸出擴展裝置，其特徵在於，在不需要另行開發程式或者更改協定的情況下，通過擴展設備的並行輸入/輸出裝置，能夠通過1個並行輸入/輸出裝置在無線通訊範圍內自由地對多個埠進行信號控制。 &lt;br/&gt;根據上述本發明，利用1個從通信裝置可以在無線通訊範圍內自由地對多個裝載埠進行信號控制，具有能夠減少通信裝置的安裝費用的效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">22:無線通訊裝置</p>  
        <p type="p">23:基本輸入/輸出裝置</p>  
        <p type="p">24,25,26:擴展輸入/輸出裝置</p>  
        <p type="p">30,40:介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2051" publication-number="202614492"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614492.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614492</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136029</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含以變壓器形成之雙工器的天線裝置</chinese-title>  
        <english-title>ANTENNA DEVICE INCLUDING DIPLEXER FORMED USING TRANSFORMER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01Q21/29</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江忠信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHUNG-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種天線裝置可以包括一第一訊號端子、一第二訊號端子、一第一濾波器、一第二濾波器、一變壓器及一輻射器。該第一訊號端子用於存取一第一頻段的第一訊號。該第二訊號端子用於存取一不同於第一頻段的第二頻段的第二訊號。該第一濾波器包括一耦合至第一訊號端子的第一端子，及一第二端子。該第二濾波器包括一耦合至第二訊號端子的第一端子，及一第二端子。該變壓器包括一耦合至第一濾波器的第一端子的第一端子，一耦合至第二濾波器的第一端子的第二端子，一第三端子，及一第四端子。該輻射器至少耦合至該變壓器的第三端子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An antenna device may include a first signal terminal, a second signal terminal, a first filter, a second filter, a transformer, and a radiator. The first signal terminal is used to access a first signal of a first frequency band. The second signal terminal is used to access a second signal of a second frequency band different from the first frequency band. The first filter includes a first terminal coupled to the first signal terminal, and a second terminal. The second filter includes a first terminal coupled to the second signal terminal, and a second terminal. The transformer includes a first terminal coupled to the first terminal of the first filter, a second terminal coupled to the first terminal of the second filter, a third terminal, and a fourth terminal. The radiator is coupled to at least the third terminal of the transformer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:天線裝置</p>  
        <p type="p">110:雙工器</p>  
        <p type="p">11A:第一端子</p>  
        <p type="p">11B:第二端子</p>  
        <p type="p">11C:第三端子</p>  
        <p type="p">125:訊號處理電路</p>  
        <p type="p">A0:輻射器</p>  
        <p type="p">Sa、Sb:端子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2052" publication-number="202613868"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613868.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613868</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136036</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>模擬裝置、模擬裝置之控制方法及程式</chinese-title>  
        <english-title>SIMULATION DEVICE, METHOD OF CONTROLLING SIMULATION DEVICE, AND PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251230B">G06F30/20</main-classification>  
        <further-classification edition="201101120251230B">G06T19/20</further-classification>  
        <further-classification edition="201301120251230B">G06F3/048</further-classification>  
        <further-classification edition="200601120251230B">B25J9/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商發那科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANUC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林大貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, DAIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之模擬裝置（10）包含：當儲存於第一儲存部（26）的位置資料係以與共通座標系不同之個別座標系界定時，進行用來以共通座標系界定以個別座標系界定之位置資料的座標系轉換處理，並將藉由座標系轉換處理而獲得的位置資料儲存於第二儲存部（28）的轉換部（18），及使用儲存於第二儲存部的位置資料，而在虛擬空間上進行使第二物體移動至複數之物體中的與第一物體之位置相應的位置之處理的模擬處理部（20）</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:模擬裝置</p>  
        <p type="p">12:運算部</p>  
        <p type="p">14:儲存部</p>  
        <p type="p">16:儲存控制部</p>  
        <p type="p">18:轉換部</p>  
        <p type="p">20:模擬處理部</p>  
        <p type="p">22:逆轉換部</p>  
        <p type="p">24:顯示控制部</p>  
        <p type="p">26:第一儲存部</p>  
        <p type="p">28:第二儲存部</p>  
        <p type="p">30:外部設備</p>  
        <p type="p">32:顯示裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2053" publication-number="202614244"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614244.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614244</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136039</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導線接合方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251020B">H01L21/60</main-classification>  
        <further-classification edition="200601120251020B">C22C5/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商拓自達電線股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TATSUTA ELECTRIC WIRE &amp; CABLE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長谷川剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASEGAWA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>棚橋央</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANAHASHI, AKIRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供一種使用在以Ag為主成分之芯材之表面設置有以Au為主成分之被覆層的接合導線，可在大氣中形成真球度高之形狀良好之FAB之導線接合方法。 &lt;br/&gt;本發明之導線接合方法係於在以Ag為主成分之芯材5上設置有以Au為主成分之被覆層6的接合導線W之前端部形成銲球之銲球形成工序中，進行：熔融工序，其使該導線W之前端部與放電電極51之間發生第1放電，藉由第1放電之第1放電電流將該導線W之前端部熔融而產生導線熔融物；及緩冷工序，其使該導線W之前端部與放電電極之間發生第2放電，將在第1放電電流之電流值以下之範圍內電流值逐漸減少之第2放電電流供給至該導線W之前端部與放電電極51之間，直至在熔融工序中產生之導線熔融物至少再凝固為止。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">a1:第1時點</p>  
        <p type="p">a2:第2時點</p>  
        <p type="p">a3:第3時點</p>  
        <p type="p">i1:第1電流值</p>  
        <p type="p">i2:第2電流值</p>  
        <p type="p">T1:第1放電持續時間</p>  
        <p type="p">T2:第2放電持續時間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2054" publication-number="202613777"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613777.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613777</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136044</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>數據通訊系統電源裝置的熱管理</chinese-title>  
        <english-title>THERMAL MANAGEMENT FOR POWER SUPPLY DEVICE OF A DATA COMMUNICATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">G06F1/20</main-classification>  
        <further-classification edition="200601120251217B">G06F1/16</further-classification>  
        <further-classification edition="200601120251217B">G06F1/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商太谷康奈特提威提索洛訊有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TE CONNECTIVITY SOLUTIONS GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施密特　馬修　萊恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMITT, MATTHEW RYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種電源裝置(100)包括一匯流排(110)，其包括一支撐面板(112)、沿著該支撐面板之一第一側面(114)延伸的一第一匯流排元件(130)、以及沿著該支撐面板之一第二側面(116)延伸的一第二匯流排元件(140)。該電源裝置包括一護罩(150)，其圍繞該匯流排。該護罩包括護罩壁(152)，其形成收納該匯流排的一匯流排腔室(154)。該電源裝置包括一熱交換器(200)，其耦合到該護罩。該熱交換器包括一內部部分(210)，其熱耦合到該匯流排。該熱交換器在由對流散熱冷卻以散逸來自該匯流排的熱量的該護罩外部包括一外部部分(220)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power supply device (100) includes a busbar (110) that includes a support panel (112), a first busbar element (130) extending along a first side (114) of the support panel and a second busbar element (140) extending along a second side (116) of the support panel. The power supply device includes a shroud (150) surrounding the busbar. The shroud includes shroud walls (152) forming a busbar chamber (154) receiving the busbar. The power supply device includes a heat exchanger (200) coupled to the shroud. The heat exchanger includes an internal portion (210) thermally coupled to the busbar. The heat exchanger includes an external portion (220) exterior of the shroud cooled by convection cooling to dissipate heat from the busbar.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">34,132,142:前部</p>  
        <p type="p">50:電氣部件</p>  
        <p type="p">112:支撐面板</p>  
        <p type="p">114:第一側面</p>  
        <p type="p">116:第二側面</p>  
        <p type="p">120,224:基座</p>  
        <p type="p">122:主面板</p>  
        <p type="p">130:第一匯流排元件</p>  
        <p type="p">134,144:後部</p>  
        <p type="p">136,146:內表面</p>  
        <p type="p">138,148:外表面</p>  
        <p type="p">140:第二匯流排元件</p>  
        <p type="p">152:護罩壁</p>  
        <p type="p">154:匯流排腔室</p>  
        <p type="p">156:第一側壁</p>  
        <p type="p">158:第二側壁</p>  
        <p type="p">160:端壁</p>  
        <p type="p">162:護罩開口</p>  
        <p type="p">166:第一間隙；間隙</p>  
        <p type="p">168:第二間隙；間隙</p>  
        <p type="p">170,172:接地端子</p>  
        <p type="p">180:開口</p>  
        <p type="p">200:熱交換器；第一與第二熱交換器；第二熱交換器</p>  
        <p type="p">210:內部部分</p>  
        <p type="p">212:熱電橋</p>  
        <p type="p">214:交錯板</p>  
        <p type="p">216:內部表面</p>  
        <p type="p">218:外部表面</p>  
        <p type="p">220:外部部分</p>  
        <p type="p">222:散熱座</p>  
        <p type="p">226:散熱片</p>  
        <p type="p">250:熱交換器支撐組件</p>  
        <p type="p">252:壓縮元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2055" publication-number="202614032"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614032.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614032</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136068</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種移位暫存器單元、顯示面板、閘極驅動電路、顯示裝置及驅動方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">G09G3/36</main-classification>  
        <further-classification edition="200601120251201B">G09G3/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商京東方科技集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOE TECHNOLOGY GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商成都京東方光電科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商北京京東方技術開發有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于子阳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, ZIYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, HAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王本莲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, BENLIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赵国伟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, GUOWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>闫卓然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, ZHUORAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何庆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, QING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陈家兴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIAXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁晓敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, XIAOMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赵婷婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, TINGTING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於顯示技術領域，揭露了一種移位暫存器單元、顯示面板、顯示裝置及驅動方法，該移位暫存器單元包括：移位暫存器、第一驅動子電路和第二驅動子電路，移位暫存器被配置為根據輸入訊號端的訊號控制級聯輸出端輸出級聯訊號，第一驅動子電路回應於上拉節點和下聯節點的訊號，藉由第一驅動輸出端輸出第一驅動訊號，第二驅動子電路回應於上拉節點、下聯節點和局部刷新訊號控制端的訊號，藉由第二驅動輸出端輸出第二驅動訊號，上述移位暫存器單元能在實現顯示面板列刷新的同時，有效縮短了邊框的寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">T1-T16:級聯電晶體</p>  
        <p type="p">Q1-Q11:驅動電晶體</p>  
        <p type="p">L1-L6,L8-L9:電晶體</p>  
        <p type="p">C1-C3,c1-C3:電容</p>  
        <p type="p">CC1-CC3:驅動電容</p>  
        <p type="p">STV:輸入訊號端</p>  
        <p type="p">CK,CB:時鐘訊號端</p>  
        <p type="p">VGL:參考訊號端</p>  
        <p type="p">VGH:參考訊號端</p>  
        <p type="p">Scan_n:級聯輸出端</p>  
        <p type="p">Rout_n:第一驅動輸出端</p>  
        <p type="p">Nout_n:第二驅動輸出端</p>  
        <p type="p">Eout_N:重置控制訊號端</p>  
        <p type="p">MS:列刷新控制端</p>  
        <p type="p">N1-N15:節點</p>  
        <p type="p">N11_N:局部刷新訊號控制端</p>  
        <p type="p">N11_N-n:局部刷新訊號控制端</p>  
        <p type="p">NCX:上電重置訊號線</p>  
        <p type="p">N3_n-2:刷新選通端</p>  
        <p type="p">STV/scan_n-1:輸入訊號端</p>  
        <p type="p">N5_n-1:第一子驅動控制訊號端</p>  
        <p type="p">N11_N:局部刷新訊號控制端</p>  
        <p type="p">N11_N-n:前n級局部刷新訊號控制端</p>  
        <p type="p">307:第四控制單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2056" publication-number="202612825"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612825.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612825</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136082</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>接合裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120250930B">B23K20/10</main-classification>  
        <further-classification edition="200601120250930B">H01L23/049</further-classification>  
        <further-classification edition="200601120250930B">H01L23/488</further-classification>  
        <further-classification edition="200601120250930B">H05K3/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商雅馬哈智能機器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAHA ROBOTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀬山耕平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEYAMA, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種引線接合裝置，其能夠以高速形成接腳引線或凸塊。一種引線接合裝置100，包括：框架10；接合工具驅動機構20，安裝於框架10，將毛細管31相對於晶圓45沿Z方向驅動；XY載台40，安裝於框架10，對晶圓45進行保持，並且將晶圓45沿XY方向驅動；及切割器50，安裝於框架10，於預先決定的XY位置處將接合於晶圓45的引線32切斷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:框架</p>  
        <p type="p">12:下框架</p>  
        <p type="p">14:上框架</p>  
        <p type="p">15、16:柱</p>  
        <p type="p">17:上導軌</p>  
        <p type="p">18:支柱</p>  
        <p type="p">20:接合工具驅動機構</p>  
        <p type="p">21:接合臂</p>  
        <p type="p">22:十字板簧</p>  
        <p type="p">22A:旋轉軸</p>  
        <p type="p">23:超音波振子</p>  
        <p type="p">24:超音波焊頭</p>  
        <p type="p">25:轉子</p>  
        <p type="p">26:定子</p>  
        <p type="p">27:Z方向馬達</p>  
        <p type="p">28:夾持器</p>  
        <p type="p">29:位置感測器</p>  
        <p type="p">31:毛細管</p>  
        <p type="p">32:引線</p>  
        <p type="p">33:無空氣焊球</p>  
        <p type="p">40:XY載台</p>  
        <p type="p">41:XY驅動部</p>  
        <p type="p">42:載台</p>  
        <p type="p">45:晶圓</p>  
        <p type="p">46:半導體晶片</p>  
        <p type="p">50:切割器</p>  
        <p type="p">51:切削刃</p>  
        <p type="p">52:切削刃驅動部</p>  
        <p type="p">53:切割器Z方向驅動部</p>  
        <p type="p">60:焊炬</p>  
        <p type="p">70:位置檢測照相機</p>  
        <p type="p">80:控制部</p>  
        <p type="p">81:CPU</p>  
        <p type="p">82:記憶體</p>  
        <p type="p">100:引線接合裝置</p>  
        <p type="p">X、Y、Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2057" publication-number="202613446"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613446.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613446</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136104</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>間隙限制聯軸器</chinese-title>  
        <english-title>GAP LIMITING COUPLING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">F16L21/06</main-classification>  
        <further-classification edition="200601120251222B">F16L37/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商韋克陶立公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VICTAULIC COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬利森　艾瑞克　法蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FINLAYSON, ERIC FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種環繞一中心軸線且可附接至一管元件之一端之環包括一向前面，該向前面在面向該中心軸線且經調適以接納該管元件之一圓周內表面與背離該中心軸線之一圓周外表面之間延伸。該向前面包括一第一側表面及定位於該第一側表面與該圓周內表面之間的一傾斜表面。該第一側表面及該傾斜表面在該向前面內界定經構形以接納一焊縫之一凹穴。在包含該中心軸線之一橫截面平面中，該傾斜表面以一鈍角遠離該圓周內表面延伸。該鈍角延伸穿過該環。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A ring surrounding a central axis and attachable to an end of a pipe element comprises a forward face extending between a circumferential inner surface that faces the central axis and is adapted to receive the pipe element and a circumferential outer surface that faces away from the central axis. The forward face comprises a first side surface and a sloped surface positioned between the first side surface and the circumferential inner surface. The first side surface and the sloped surface define a pocket within the forward face configured to receive a weld. In a cross-sectional plane including the central axis, the sloped surface extends away from the circumferential inner surface at an obtuse angle. The obtuse angle extends through the ring.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:總成</p>  
        <p type="p">12:第一管元件</p>  
        <p type="p">14:第二管元件</p>  
        <p type="p">15:聯軸器</p>  
        <p type="p">16:縱向軸線</p>  
        <p type="p">18:第一環</p>  
        <p type="p">20:第二環</p>  
        <p type="p">50:外表面</p>  
        <p type="p">86:段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2058" publication-number="202613690"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613690.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613690</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136108</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶面板及液晶裝置</chinese-title>  
        <english-title>LIQUID CRYSTAL PANEL AND LIQUID CRYSTAL DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">G02F1/1337</main-classification>  
        <further-classification edition="200601120251204B">G02F1/139</further-classification>  
        <further-classification edition="200601120251204B">G02F1/1343</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>學校法人東京理科大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO UNIVERSITY OF SCIENCE FOUNDATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, OSAMU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黄瀬雄司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINOSE, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辻井敬亘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUJII, YOSHINOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種液晶面板，包括第一基板、第二基板、液晶層及電極層。在第一基板與第二基板之中，於具有電極層的至少一方的基板的電極層上形成有絕緣層。設於第一基板側的第一偏光板的穿透軸的方向與設於第二基板側的第二偏光板的穿透軸的方向為垂直或平行。從光源所發出的光依序穿透設於第二基板側的第二偏光板、第二基板、液晶層及第一基板。在電極層對液晶層施加電場的期間，從第一偏光板射出的光的穿透率在低穿透率與高穿透率之間呈脈衝型地被調變。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A liquid crystal panel includes a first substrate, a second substrate, a liquid crystal layer, and an electrode layer. An insulating layer is formed on the electrode layer of at least one of the first and second substrates that is provided with the electrode layer. A transmission axis direction of a first polarizing plate provided on the first substrate side and a transmission axis direction of a second polarizing plate provided on the second substrate side are perpendicular or parallel to each other. Light emitted from a light source passes through the second polarizing plate provided on the second substrate side, the second substrate, the liquid crystal layer, and the first substrate in this order. While the electrode layer applies an electric field to the liquid crystal layer, a light transmittance of the light emitted from the first polarizing plate is modulated in a pulse-like manner between a low transmittance and a high transmittance.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:液晶裝置</p>  
        <p type="p">12:液晶面板</p>  
        <p type="p">14:背光單元</p>  
        <p type="p">14A:光源</p>  
        <p type="p">16:第一基板</p>  
        <p type="p">18:第二基板</p>  
        <p type="p">20:第一偏光板</p>  
        <p type="p">22:第二偏光板</p>  
        <p type="p">26:電極層</p>  
        <p type="p">26A:畫素電極</p>  
        <p type="p">26B:共通電極</p>  
        <p type="p">28:第一配向膜</p>  
        <p type="p">29:第二配向膜</p>  
        <p type="p">30:液晶層</p>  
        <p type="p">30A:第一液晶層</p>  
        <p type="p">30B:第二液晶層</p>  
        <p type="p">32:玻璃基板</p>  
        <p type="p">34:電極線</p>  
        <p type="p">L:光</p>  
        <p type="p">Lp:液晶分子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2059" publication-number="202613751"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613751.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613751</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136159</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔設備控制方法及相關設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251128B">G05D1/648</main-classification>  
        <further-classification edition="200601120251128B">A47L11/40</further-classification>  
        <further-classification edition="200601120251128B">B25J11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露公開了一種清潔設備控制方法及相關設備，涉及清潔設備控制領域，所述清潔設備包括抓取機械臂，該方法包括：接收所述清潔設備關聯的控制設備發送的抓取參數資訊，其中，所述抓取參數資訊包括不同抓取機械臂連杆之間的角度資訊和/或夾取機構的夾取狀態資訊；基於所述抓取參數資訊控制抓取機械臂對待抓取物體執行抓取操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110:步驟</p>  
        <p type="p">S120:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2060" publication-number="202612633"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612633.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612633</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136160</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔設備控制方法、裝置、電腦程式產品、電腦可讀介質及清潔設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251126B">A47L11/40</main-classification>  
        <further-classification edition="200601120251126B">A47L11/24</further-classification>  
        <further-classification edition="200601120251126B">A47L11/28</further-classification>  
        <further-classification edition="200601120251126B">A47L11/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程冉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佳搏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種清潔設備控制方法包括機械臂，所述機械臂遠離所述清潔設備的底盤的一端用於夾持清潔件，所述清潔件用於清潔踢腳線，所述機械臂用於調節所述清潔件的位姿。所述方法包括：在所述清潔設備在進入清潔踢腳線狀態的情況下，控制所述機械臂將所述清潔件支撐在第一位姿，所述第一位姿為所述清潔件清潔踢腳線的位姿。在所述清潔設備在退出清潔踢腳線狀態的情況下，控制所述機械臂將所述清潔件支撐在第二位姿，所述第二位姿為所述清潔件在所述底盤向上投影的空間區域內的位姿。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">310:步驟</p>  
        <p type="p">320:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2061" publication-number="202613752"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613752.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613752</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136162</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔設備控制方法、裝置、電子設備、存儲介質及清潔設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251218B">G05D1/648</main-classification>  
        <further-classification edition="202401120251218B">G05D1/622</further-classification>  
        <further-classification edition="200601120251218B">A47L11/40</further-classification>  
        <further-classification edition="200601120251218B">A47L11/24</further-classification>  
        <further-classification edition="200601120251218B">A47L11/28</further-classification>  
        <further-classification edition="202401320251218B">G05D105/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程冉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種清潔設備控制方法、控制裝置、清潔設備及相關設備，涉及智慧家居技術領域，清潔設備包括機械臂模組和底盤，方法包括：獲取待清潔區域的全域圖像，其中，全域圖像中包括障礙物標記資訊，障礙物標記資訊包括障礙物的當前位置；基於障礙物標記資訊，確定障礙物的擺放位置；基於障礙物的當前位置和障礙物的擺放位置，控制底盤和機械臂模組對障礙物進行整理。由此，使得清潔設備説明用戶自動整理地面的雜物，將其分別放置在指定區域，解放了用戶的雙手，提高了用戶的滿意度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110:步驟</p>  
        <p type="p">S120:步驟</p>  
        <p type="p">S130:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2062" publication-number="202612866"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612866.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612866</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136163</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>移動機器人及機器人系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B25J9/16</main-classification>  
        <further-classification edition="200601120251229B">B25J5/00</further-classification>  
        <further-classification edition="200601120251229B">A47L11/24</further-classification>  
        <further-classification edition="200601120251229B">A47L11/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝道南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐洪亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程冉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
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        <p type="p">一種移動機器人，包括：移動主體、設置於所述移動主體的外延部、以及避障檢測組件，避障檢測組件活動安裝於所述移動主體，能夠調整所述避障檢測組件的探測區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:移動主體</p>  
        <p type="p">120:外延部</p>  
        <p type="p">160:避障檢測組件</p>  
        <p type="p">162:支架</p>  
        <p type="p">164:避障檢測器</p>  
        <p type="p">165:避障檢測器的探測區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2063" publication-number="202613747"> 
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      <tif no="1" file="TIF/202613747.zip"/> 
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      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202613747</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136164</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔設備控制方法、裝置、設備、介質和程式產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251203B">G05D1/622</main-classification>  
        <further-classification edition="202401120251203B">G05D1/648</further-classification>  
        <further-classification edition="200601120251203B">A47L11/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牛延升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種清潔設備控制方法包括：根據所述機械臂的實際姿態確定所述機械臂對應的目標預警空間；監測所述目標預警空間內是否存在障礙物；以及在所述目標預警空間存在所述障礙物的情況下，控制所述自移動清潔設備執行回避動作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S31:步驟</p>  
        <p type="p">S32:步驟</p>  
        <p type="p">S33:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2064" publication-number="202612634"> 
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      <tif no="1" file="TIF/202612634.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202612634</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136165</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔設備控制方法、裝置、清潔設備、存儲介質和電腦程式產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">A47L11/40</main-classification>  
        <further-classification edition="200601120251217B">A47L11/24</further-classification>  
        <further-classification edition="200601120251217B">A47L11/282</further-classification>  
        <further-classification edition="202401120251217B">G05D1/622</further-classification>  
        <further-classification edition="202401120251217B">G05D1/43</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牛延升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種清潔設備控制方法、裝置、清潔設備、存儲介質和電腦程式產品，應用於自移動清潔設備，自移動清潔設備佈設有機械臂；該方法包括：獲取自移動清潔設備對應的預設路徑上存在的目標障礙物的當前位置；確定用於存放目標障礙物的目標放置區域；控制機械臂將目標障礙物從當前位置移動至目標放置區域；控制自移動清潔設備對當前位置進行清潔操作。可見，本揭露實施例可以將阻擋自移動清潔設備執行清潔操作的障礙物進行移除，以便於對自移動清潔設備對障礙物在移動之前所佔用的地面區域進行清潔，以提高清潔覆蓋率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S31:步驟</p>  
        <p type="p">S32:步驟</p>  
        <p type="p">S33:步驟</p>  
        <p type="p">S34:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2065" publication-number="202612629"> 
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      <tif no="1" file="TIF/202612629.zip"/> 
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      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202612629</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136167</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>物體檢測方法和裝置、清潔設備控制方法和裝置及清潔設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">A47L11/24</main-classification>  
        <further-classification edition="200601120251219B">A47L11/28</further-classification>  
        <further-classification edition="200601120251219B">A47L11/40</further-classification>  
        <further-classification edition="201701120251219B">G06T7/11</further-classification>  
        <further-classification edition="201701120251219B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佳搏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牛延升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程冉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種物體檢測方法、清潔設備控制方法、清潔設備控制裝置、物體檢測裝置、及清潔設備。所述物體檢測方法應用於清潔設備，所述清潔設備包括機械臂和夾爪，所述夾爪設在所述機械臂遠離所述清潔設備機身的一端，所述機械臂用於配合所述夾爪抓取物體。所述物體檢測方法包括：獲取包含所述夾爪在內的目標圖像；基於所述目標圖像，檢測所述夾爪中是否存在被抓取的目標物體。透過本揭露提供的技術方案能夠提高清潔設備對被抓取物體檢測的準確性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">210:步驟</p>  
        <p type="p">220:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2066" publication-number="202612635"> 
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      <tif no="1" file="TIF/202612635.zip"/> 
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      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612635</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136172</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔設備控制方法、裝置、電腦程式產品、存儲介質及清潔設備</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">A47L11/40</main-classification>  
        <further-classification edition="200601120251222B">A47L11/38</further-classification>  
        <further-classification edition="202401120251222B">G05D1/648</further-classification>  
        <further-classification edition="202401120251222B">G05D1/246</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牛延升</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種清潔設備控制方法、裝置、電腦程式產品、存儲介質及清潔設備，所述清潔設備包括機械臂，所述機械臂遠離所述清潔設備底盤的一端用於夾持清潔件，所述清潔件用於清潔踢腳線，所述機械臂用於調節所述清潔件的位姿以清潔踢腳線，所述方法包括：獲取預先構建的待清潔區域的踢腳線分佈圖；基於所述踢腳線分佈圖，控制所述清潔設備對所述待清潔區域內的踢腳線執行清潔動作。透過本揭露提供的技術方案能夠提高清潔設備對踢腳線的清潔能力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">310:步驟</p>  
        <p type="p">320:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2067" publication-number="202612867"> 
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      <tif no="1" file="TIF/202612867.zip"/> 
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      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612867</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136173</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機器人控制方法、裝置、機器人、可讀存儲介質及電腦程式產品</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B25J9/16</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江融</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙嘉文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺中市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種機器人控制方法、裝置及機器人、可讀存儲介質及電腦程式產品，涉及機器人技術領域。所述方法包括：採集待抓取的目標物體的點雲和圖像資料，根據所述點雲和圖像資料建立所述目標物體的三維模型；基於所述三維模型確定所述目標物體上的易抓取部位；在所述機器人的底盤保持當前位置姿態不變的情況下，確定所述機械臂在所述當前位置姿態下能夠達到的位置姿態集合；控制所述機械臂挪動所述目標物體，直至所述易抓取部位的位置姿態處於所述位置姿態集合中；以及控制所述機械臂抓取所述易抓取部位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S1:步驟</p>  
        <p type="p">S2:步驟</p>  
        <p type="p">S3:步驟</p>  
        <p type="p">S4:步驟</p>  
        <p type="p">S5:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
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    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613581</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136186</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測試電子元件的處理機</chinese-title>  
        <english-title>HANDLER FOR TESTING ELECTRONIC COMPONENTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G01R31/28</main-classification>  
        <further-classification edition="202001120260102B">G01R31/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓商泰克元股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHWING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅閏成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, YUN SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於用於測試電子元件的處理機。&lt;br/&gt; 本發明的用於測試電子元件的處理機具有在內部收容除了裝卸區以外的重新配置區、連接區及移動區的密封腔，由於具備啟閉器而得以僅僅在需要時才自動打開或關閉密封腔的開放孔。&lt;br/&gt; 依據本發明，能嚴格控制測試空間的空氣品質而得以防止異物所引起的半導體元件損傷或測試錯誤。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:搬運穿梭機</p>  
        <p type="p">110:搬運台</p>  
        <p type="p">210:第一拾取機械手</p>  
        <p type="p">270:異物清除機構</p>  
        <p type="p">300:測試台</p>  
        <p type="p">310:第二拾取機械手</p>  
        <p type="p">400:真空器</p>  
        <p type="p">500:重新配置機構</p>  
        <p type="p">600:移動機構</p>  
        <p type="p">700:防結露機構</p>  
        <p type="p">800:控制器</p>  
        <p type="p">910:突出部位</p>  
        <p type="p">A1:第一領域</p>  
        <p type="p">A2:第二領域</p>  
        <p type="p">CP:連接區</p>  
        <p type="p">LU:裝卸區</p>  
        <p type="p">MP:移動區</p>  
        <p type="p">RP:重新配置區</p>  
        <p type="p">RS:重新配置空間</p>  
        <p type="p">S:位置感測器</p>  
        <p type="p">TB:測試板</p>  
        <p type="p">TS:測試空間</p>  
        <p type="p">TH:處理機</p>  
        <p type="p">X:軸</p>  
        <p type="p">Y:軸</p>  
        <p type="p">Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2069" publication-number="202614776"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614776.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614776</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136231</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>非揮發性存儲單元、隨機存取記憶體及其操作方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251201B">H10B51/00</main-classification>  
        <further-classification edition="202301120251201B">H10B61/00</further-classification>  
        <further-classification edition="200601120251201B">G11C11/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商洛瑪瑞科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOMARE TECHNOLOGIES LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商洛瑪瑞芯片技術常州有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOMARE CHIP TECHNOLOGY CHANGZHOU CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>江蘇省常州市</address>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃爾　哈吉　努爾丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EL HAJJI, NOUREDDINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄒斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZOU, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米哈伊　安德列　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIHAI, ANDREI PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>RO</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃志揚</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種非揮發性存儲單元、隨機存取記憶體及其操作方法，解決現有缺乏電壓控制FReRAM的存儲單元架構和控制方法的問題，涉及非揮發性存儲技術領域。存儲單元包括：第一存儲元件，包括可編碼為高阻狀態或低阻狀態中任一個的第一鐵電隧道接面（FTJ）元件；和第二存儲元件，包括可編碼為高阻狀態或低阻狀態中另一個的第二鐵電隧道接面元件；其中，該存儲單元存儲的資料位元由該第一鐵電隧道接面元件和該第二鐵電隧道接面元件的相反電阻狀態表示。在讀取操作過程中，藉由比較第一鐵電隧道接面和第二鐵電隧道接面的電阻狀態來讀取存儲單元。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:鐵電隧道接面元件</p>  
        <p type="p">11:第一電極層</p>  
        <p type="p">12:鐵電隧道障壁層</p>  
        <p type="p">13:第二電極層</p>  
        <p type="p">I&lt;sub&gt;read&lt;/sub&gt;:讀取電流</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2070" publication-number="202613352"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613352.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613352</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136248</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含過渡金屬硫屬化物薄膜之沉積方法及其所用之硫屬前驅物</chinese-title>  
        <english-title>METHOD FOR DEPOSITING A FILM CONTAINING TRANSITION METAL CHALCOGEN AND CHALCOGEN PRECURSOR FOR THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">C23C16/448</main-classification>  
        <further-classification edition="200601120251230B">C23C16/30</further-classification>  
        <further-classification edition="200601120251230B">C01B17/00</further-classification>  
        <further-classification edition="200601120251230B">C23C16/08</further-classification>  
        <further-classification edition="200601120251230B">C23C16/16</further-classification>  
        <further-classification edition="200601120251230B">H01L21/205</further-classification>  
        <further-classification edition="202501220251230B">H10D30/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商提迪艾思股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TDS INNOVATION INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓國科學技術院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜奇範</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, KI BUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李在現</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JAE HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東映</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONG YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴東建</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, DONGGEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳世英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OH, SAE YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種包含過渡金屬硫屬化物之薄膜的沉積方法，其包含：將一過渡金屬前驅物及一硫屬前驅物注入一反應室中之步驟；以及使所述過渡金屬前驅物及所述硫屬前驅物反應，從而在基板上沉積一包含過渡金屬硫屬化物之薄膜之步驟；其特徵在於，所述硫屬前驅物包含硫屬-硫屬鍵結，且所述硫屬-硫屬鍵結之鍵解離能為275 kJ/mol或更低。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2071" publication-number="202613210"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613210.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613210</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136277</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G73/10</main-classification>  
        <further-classification edition="200601120251201B">C08G73/12</further-classification>  
        <further-classification edition="200601120251201B">C08L79/08</further-classification>  
        <further-classification edition="200601120251201B">C08K5/18</further-classification>  
        <further-classification edition="200601120251201B">C08K5/375</further-classification>  
        <further-classification edition="200601120251201B">C08K5/41</further-classification>  
        <further-classification edition="200601120251201B">C08K5/45</further-classification>  
        <further-classification edition="200601120251201B">G03F7/004</further-classification>  
        <further-classification edition="200601120251201B">G03F7/038</further-classification>  
        <further-classification edition="200601120251201B">G03F7/20</further-classification>  
        <further-classification edition="200601120251201B">G03F7/32</further-classification>  
        <further-classification edition="200601120251201B">G03F7/40</further-classification>  
        <further-classification edition="200601120251201B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商富士軟片股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIFILM CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小澤友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZAWA, YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題為提供一種可獲得在長時間內抑制在硬化物與金屬層之間產生空隙及金屬氧化物之硬化物之樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件。一種樹脂組成物、硬化物、積層體、硬化物之製造方法、積層體之製造方法、半導體元件之製造方法及半導體元件，前述樹脂組成物包含：選自由環化樹脂及環化樹脂的前驅物組成之群組中之至少1種樹脂P；及化合物A，僅具有2個僅經1個胺基取代之芳香環。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2072" publication-number="202613151"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613151.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613151</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136288</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>心肌肌鈣蛋白I片段及用其製備的產品和應用</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C07K14/47</main-classification>  
        <further-classification edition="200601120251103B">G01N33/68</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海先賽生物科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹利勤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明屬於生物檢測領域，具體涉及心肌肌鈣蛋白I片段及用其製備的產品和應用。具體技術方案包括：cTnI的31-164蛋白質片段，HSP65的187-375蛋白片段，及蛋白片段組合。本發明提供了可用於檢測急性心肌梗塞的蛋白質抗原或組合物，檢測特異性和敏感性較理想，並可根據需要進一步製備為相關試劑或試劑盒。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2073" publication-number="202614248"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614248.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614248</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136312</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製造夾層總成之程序</chinese-title>  
        <english-title>PROCESS FOR THE MANUFACTURE OF A SANDWICH ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251204B">H01L21/603</main-classification>  
        <further-classification edition="200601120251204B">H01L21/60</further-classification>  
        <further-classification edition="200601120251204B">H01L23/488</further-classification>  
        <further-classification edition="202501120251204B">H10H20/857</further-classification>  
        <further-classification edition="200601120251204B">B23K35/362</further-classification>  
        <further-classification edition="201401120251204B">B23K26/21</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國大陸商上海賀利氏工業技術材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS MATERIALS TECHNOLOGY SHANGHAI LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鑫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀良政</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, LIANGZHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張靖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於製造夾層總成之程序，該總成由電子基材與至少一個雷射轉移LED經由一層焊料金屬牢固地互連所組成，該製造程序包含下列連續步驟或由下列連續步驟所組成：&lt;br/&gt;(1)  提供(1a)具有金屬接觸墊X之電子基材、(1b)各自具有一對金屬接觸墊Y之一或多個可雷射轉移LED、及(1c)包含可凝膠化助焊劑A'之材料A，&lt;br/&gt;(2)  將該材料A之一層施加至該等金屬接觸墊X及/或該等金屬接觸墊Y，&lt;br/&gt;(3)  使該材料A凝膠化，以使該助焊劑A’膠化並形成凝膠化之助焊劑A’’，&lt;br/&gt;(4)  將該（等）可雷射轉移LED在該等金屬接觸墊Y定向朝向該等金屬接觸墊X之情況下雷射轉移施加至該電子基材，及&lt;br/&gt;(5)  使該藉此獲得之夾層總成經受焊接程序，&lt;br/&gt;(i)   其中該材料A係包含該助焊劑A'之焊料膏，且其中該等金屬接觸墊X及/或該等金屬接觸墊Y可含有或不含有焊料金屬&lt;br/&gt;或&lt;br/&gt;(ii)  其中該材料A係該助焊劑A'本身，且其中該等金屬接觸墊X及/或該等金屬接觸墊Y均含有焊料金屬。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A process for the manufacture of a sandwich assembly consisting of an electronic substrate firmly interconnected to at least one laser-transferred LED via a layer of solder metal, the manufacturing process comprising or consisting of the successive steps:&lt;br/&gt;(1) providing (1a) an electronic substrate having metallic contact pads X, (1b) one or more laser-transferable LEDs each of which having a pair of metallic contact pads Y, and (1c) a material A comprising a gellable flux A’, &lt;br/&gt;(2) applying a layer of the material A to the metallic contact pads X and/or to the metallic contact pads Y,&lt;br/&gt;(3) gelating the material A so as the flux A’ to gel and to form a gelated flux A’’,&lt;br/&gt;(4) laser-transfer applying the laser-transferable LED(s) to the electronic substrate with the metallic contact pads Y directed towards the metallic contact pads X, and&lt;br/&gt;(5) subjecting the so-obtained sandwich assembly to a soldering process,&lt;br/&gt;(i) wherein the material A is a solder paste comprising the flux A’ and wherein the metallic contact pads X and/or the metallic contact pads Y may or may not be provided with solder metal&lt;br/&gt;or&lt;br/&gt;(ii) wherein the material A is the flux A’ itself and wherein the metallic contact pads X and/or the metallic contact pads Y is/are provided with solder metal.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2074" publication-number="202614582"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614582.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614582</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136333</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具訊號重構之射頻多輸入多輸出通訊系統</chinese-title>  
        <english-title>RF MIMO COMMUNICATION SYSTEM WITH SIGNAL RESTRUCTURING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251201B">H04B7/02</main-classification>  
        <further-classification edition="200601120251201B">H04B1/02</further-classification>  
        <further-classification edition="200601120251201B">H01Q1/36</further-classification>  
        <further-classification edition="200601120251201B">H01Q21/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江忠信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, CHUNG-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於射頻（RF）天線系統的訊號重構單元包括四個端口和一個訊號路由電路。該訊號路由電路在輸入端口接收RF訊號，並向天線端口提供相位控制的輸出。當接收到和訊號時，該單元提供同相重構訊號以進行共模天線操作。當接收到差訊號時，該單元提供反相重構訊號以進行差模天線操作。該訊號路由電路可以實現為具有傳輸線段的環形耦合器，或作為包含電感器和電容器的離散電路元件。RF通信系統將該訊號重構單元與數位處理電路、收發器和天線結合，以實現從單一天線結構的多輸入多輸出（MIMO）操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A signal restructure unit for radio frequency (RF) antenna systems includes four ports and a signal routing circuit. The signal routing circuit receives RF signals at input ports and provides phase-controlled outputs to antenna ports. When receiving sum signals, the unit provides in-phase restructured signals for common-mode antenna operation. When receiving difference signals, the unit provides anti-phase restructured signals for differential-mode antenna operation. The signal routing circuit may be implemented as a rat-race coupler with transmission line segments or as discrete circuit elements including inductors and capacitors. An RF communication system incorporates the signal restructure unit with digital processing circuits, transceivers, and antennas to achieve MIMO operation from a single antenna structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:訊號重構單元</p>  
        <p type="p">101:第一端口</p>  
        <p type="p">102:第二端口</p>  
        <p type="p">103:第三端口</p>  
        <p type="p">104:第四端口</p>  
        <p type="p">105:訊號路由電路</p>  
        <p type="p">106:MIMO天線</p>  
        <p type="p">RF1、RF2:RF訊號</p>  
        <p type="p">RF1_r、RF2_r:重構訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2075" publication-number="202614913"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614913.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614913</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136359</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製造用於類比神經形態裝置之憶阻器系統的方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING A MEMRISTOR SYSTEM FOR A NEUROMORPHIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251229B">H10N70/20</main-classification>  
        <further-classification edition="202301120251229B">G06N3/063</further-classification>  
        <further-classification edition="200601120251229B">H01L21/20</further-classification>  
        <further-classification edition="200601120251229B">H01L21/60</further-classification>  
        <further-classification edition="200601120251229B">H01L23/488</further-classification>  
        <further-classification edition="202301120251229B">H10N79/00</further-classification>  
        <further-classification edition="200601120251229B">G11C7/12</further-classification>  
        <further-classification edition="200601120251229B">G11C8/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格羅寧根大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RIJKSUNIVERSITEIT GRONINGEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班納吉　塔馬利卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANERJEE, TAMALIKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於製造用於一類比神經形態裝置之一憶阻器系統的方法，其包括：&lt;br/&gt; -提供一第一基體；&lt;br/&gt; -在該第一基體上沉積一磊晶緩衝層；&lt;br/&gt; -在該緩衝層上磊晶沉積至少一個憶阻器裝置層，特別係一半導體氧化物層；&lt;br/&gt; -移除該緩衝層，特別係藉由溶解及/或蝕刻該緩衝層，以提供一獨立憶阻器裝置層；&lt;br/&gt; -在該憶阻器裝置層中/自該憶阻器裝置層製造一憶阻器裝置胞元結構；&lt;br/&gt; -提供一第二基體；&lt;br/&gt; -在該第二基體上形成一第一電極結構；&lt;br/&gt; -將該獨立憶阻器裝置層接合至該第二基體之該第一電極結構上；以及&lt;br/&gt; -在該憶阻器裝置胞元結構上形成一第二電極結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention provides a method for manufacturing a memristor system for a neuromorphic device, including:&lt;br/&gt; -providing a first substrate;&lt;br/&gt; -depositing an epitaxial buffer layer on the first substrate;&lt;br/&gt; -epitaxially depositing at least one memristor device layer, in particular a semiconductor oxide layer, on the buffer layer; &lt;br/&gt; -removing the buffer layer, in particular by dissolving and/or etching the buffer layer, to provide a freestanding memristor device layer;&lt;br/&gt; -manufacturing a memristor device cell structure in/from the memristor device layer;&lt;br/&gt; -providing a second substrate;&lt;br/&gt; - forming a first electrode structure on the second substrate;&lt;br/&gt; -joining the freestanding memristor device layer onto the first electrode structure of the second substrate; and&lt;br/&gt; -forming a second electrode structure on the memristor device cell structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:第二基體</p>  
        <p type="p">5:第一(底部)電極結構</p>  
        <p type="p">7:第二(頂部)電極結構</p>  
        <p type="p">100:電氣絕緣材料，獨立(部分絕緣)層，(部分絕緣)獨立裝置層</p>  
        <p type="p">CE:額外的第一電子電路結構</p>  
        <p type="p">CS:額外的第二電子電路結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2076" publication-number="202614005"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614005.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614005</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136404</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學機械拋光液</chinese-title>  
        <english-title>CHEMICAL MECHANICAL POLISHING SOLUTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">G09G1/02</main-classification>  
        <further-classification edition="200601120251103B">C09K3/14</further-classification>  
        <further-classification edition="202201120251103B">C01F7/02</further-classification>  
        <further-classification edition="202001120251103B">C01F17/235</further-classification>  
        <further-classification edition="200601120251103B">C01B33/023</further-classification>  
        <further-classification edition="200601120251103B">C08G77/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商寧波安集微電子科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NINGBO ANJI MICROELECTRONICS TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, CHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郎鵬飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANG, PENGFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬俊洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, JUNYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種用於半導體材料平坦化的化學機械拋光組合物。該組合物包括：研磨顆粒，二氧化矽保護劑，pH調節劑和水。具有良好的穩定性，可對二氧化矽等材料進行化學機械拋光，快速實現平坦化，充分延長軟拋光墊的使用壽命，並減少拋光過程中二氧化矽表面產生的缺陷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention discloses a chemical mechanical polishing composition for flattening semiconductor materials. The composition comprises: abrasive particles, a silica protectant, a pH regulator and water. It has good stability and can perform chemical mechanical polishing on materials such as silica, quickly achieving flattening, significantly extending the service life of the soft polishing pad, and reducing the defects generated on the silica surface during the polishing process.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2077" publication-number="202612956"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612956.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612956</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136456</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>載具和推車</chinese-title>  
        <english-title>CARRIER AND STROLLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251130B">B62B9/12</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪爾學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ERXUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫明星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, MINGXING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請涉及一種載具，包括：第一樞轉關節，具有圍繞第一樞轉軸線樞轉的第一樞轉部和第二樞轉部；第二樞轉關節，具有圍繞第二樞轉軸線相互樞接的第四樞轉部和第二轉動部，第一樞轉軸線與第二樞轉軸線不共線；第一聯動釋鎖機構，當第一樞轉部和第二樞轉部相對固定時，第一聯動釋鎖機構鎖定第四樞轉部和第二轉動部，以限制第四樞轉部相對第二轉動部旋轉；當第二樞轉部相對第一樞轉部旋轉時，第一聯動釋鎖機構解除對第四樞轉部和第二轉動部的鎖定，以允許第四樞轉部相對第二轉動部旋轉，第二樞轉部的旋轉帶動第四樞轉部旋轉；第二聯動釋鎖機構，第四樞轉部的旋轉帶動第二聯動釋鎖機構移動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application relates to a carrier including: a first pivot joint having a first pivot portion and a second pivot portion that pivot around a first pivot axis; a second pivot joint having a fourth pivot portion and a second rotating portion that are pivotably connected to each other around a second pivot axis, and the first pivot axis being not collinear with the second pivot axis; a first linkage release mechanism, when the first pivot portion and the second pivot portion are relatively fixed, the first linkage release mechanism locks the fourth pivot portion and the second rotating portion to limit a rotation of the fourth pivot portion relative to the second rotating portion, when the second pivot portion rotates relative to the first pivot portion, the first linkage release mechanism releases a lock on the fourth pivot portion and the second rotating portion, allowing the fourth pivot portion to rotate relative to the second rotating portion, and a rotation of the second pivot portion drives the fourth pivot portion to rotate; and a second linkage release mechanism, wherein the rotation of the fourth pivot portion drives the second linkage release mechanism to move.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:載具</p>  
        <p type="p">10:樞接座</p>  
        <p type="p">11:第一轉動部</p>  
        <p type="p">12:第二轉動部</p>  
        <p type="p">13:第一框體</p>  
        <p type="p">14:第二框體</p>  
        <p type="p">20:第一樞轉關節</p>  
        <p type="p">283:扶手</p>  
        <p type="p">30:第二樞轉關節</p>  
        <p type="p">32:安裝座</p>  
        <p type="p">323:卡接部</p>  
        <p type="p">324:快拆開關</p>  
        <p type="p">40:第一聯動釋鎖機構</p>  
        <p type="p">463:釋放部</p>  
        <p type="p">60:座板</p>  
        <p type="p">9:車架</p>  
        <p type="p">91:卡接座</p>  
        <p type="p">92:釋鎖按鈕</p>  
        <p type="p">93:卡接孔</p>  
        <p type="p">94:收合關節</p>  
        <p type="p">95:車手</p>  
        <p type="p">96:前腳</p>  
        <p type="p">97:後腳</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2078" publication-number="202613136"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613136.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613136</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136461</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於熱穩定電容器應用的自摻雜噻吩</chinese-title>  
        <english-title>SELF-DOPED THIOPHENES FOR THERMALLY STABLE CAPACITOR APPLICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C07D495/04</main-classification>  
        <further-classification edition="200601120251103B">C08G61/12</further-classification>  
        <further-classification edition="200601120251103B">C08L65/00</further-classification>  
        <further-classification edition="200601120251103B">B32B27/00</further-classification>  
        <further-classification edition="200601120251103B">B32B37/24</further-classification>  
        <further-classification edition="200601120251103B">H01B1/12</further-classification>  
        <further-classification edition="200601120251103B">H01B5/14</further-classification>  
        <further-classification edition="200601120251103B">H01B13/00</further-classification>  
        <further-classification edition="200601120251103B">H01G9/025</further-classification>  
        <further-classification edition="200601120251103B">H01G9/028</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商賀利氏電子化學材料有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HERAEUS EPURIO GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希爾　史帝芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HILL, STEPHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛夫尼希　威爾弗里德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOVENICH, WILFRIED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希爾　阿爾努夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHEEL, ARNULF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>默克爾　烏多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERKER, UDO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種通式(I)之單體&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="300px" width="119px" file="ed10038.JPG" alt="ed10038.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;其中&lt;br/&gt;-       X彼此獨立地表示O或S；&lt;br/&gt;-       R&lt;sup&gt;1&lt;/sup&gt;表示直鏈或支鏈三價有機基團；&lt;br/&gt;-       M&lt;sup&gt;+&lt;/sup&gt;表示陽離子，較佳的是選自由H&lt;sup&gt;+&lt;/sup&gt;、Li&lt;sup&gt;+&lt;/sup&gt;、Na&lt;sup&gt;+&lt;/sup&gt;、K&lt;sup&gt;+&lt;/sup&gt;、及NH&lt;sub&gt;4&lt;/sub&gt;&lt;sup&gt;+&lt;/sup&gt;所組成之群組的陽離子，最佳的是Na&lt;sup&gt;+&lt;/sup&gt;。&lt;br/&gt;本發明亦係關於一種包含基於彼單體的重複單元的導電聚合物、一種包含彼導電聚合物的液體組成物、一種用於製備積層體的程序、一種積層體、一種電子裝置，及該單體、該導電聚合物、及該液體組成物之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a monomer of the general formula (&lt;b&gt;I&lt;/b&gt;) &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="297px" width="107px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;wherein &lt;br/&gt;&lt;b&gt;-       &lt;/b&gt;&lt;b&gt;X&lt;/b&gt; independently from each other represent O or S; &lt;br/&gt;&lt;b&gt;-       &lt;/b&gt;&lt;b&gt;R&lt;sup&gt;1&lt;/sup&gt;&lt;/b&gt; represents a linear or branched trivalent organic group; &lt;br/&gt;&lt;b&gt;-       &lt;/b&gt;&lt;b&gt;M&lt;sup&gt;+&lt;/sup&gt;&lt;/b&gt; represents a cation, preferably a cation selected from the group consisting of H&lt;sup&gt;+&lt;/sup&gt;, Li&lt;sup&gt;+&lt;/sup&gt;, Na&lt;sup&gt;+&lt;/sup&gt;, K&lt;sup&gt;+&lt;/sup&gt; and NH&lt;sub&gt;4&lt;/sub&gt;&lt;sup&gt;+&lt;/sup&gt;, most preferably Na&lt;sup&gt;+&lt;/sup&gt;. &lt;br/&gt;The present invention also relates to an electrically conductive polymer comprising repeating units based on that monomer, to a liquid composition comprising that electrically conductive polymer, to a process for preparing a layered body, to a layered body, to an electronic device and to the use the monomer, the electrically conductive polymer and the liquid composition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101a:電極體</p>  
        <p type="p">101b:電極材料</p>  
        <p type="p">101c:介電層</p>  
        <p type="p">102a:固體電解質層</p>  
        <p type="p">103:孔隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2079" publication-number="202612579"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612579.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612579</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136477</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電動作業車輛</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251130B">A01D34/00</main-classification>  
        <further-classification edition="200601120251130B">A01D34/78</further-classification>  
        <further-classification edition="200601120251130B">A01D34/69</further-classification>  
        <further-classification edition="200601120251130B">A01D34/76</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商井關農機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISEKI &amp; CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤聖人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, MASATO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森一芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORI, KAZUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三宅浩喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAKE, KOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木大翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, HIROTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小野弘喜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONO, KOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種能夠舒適地進行作業的電動作業車輛。電動作業車輛具備：第一電動馬達（30），其驅動作業裝置（4）；第二電動馬達（40），其驅動前輪（2）或後輪（3）；以及控制器（80），其控制所述第一電動馬達（30）和所述第二電動馬達（40），在所述第一電動馬達（30）的負載超過了第一閾值（C1）的情況下，所述控制器（80）使所述第二電動馬達（40）的輸出旋轉減速，其中，所述電動作業車輛具備如下的第一模式（M1）：在所述第一電動馬達（30）的負載為所述第一閾值（C1）以下且超過了第二閾值（C2）的情況下，限制所述第二電動馬達（40）的增速。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">C1:第一閾值</p>  
        <p type="p">C2:第二閾值</p>  
        <p type="p">C3:第三閾值</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2080" publication-number="202614150"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614150.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614150</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136544</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置、電漿處理裝置的分解方法以及電漿處理裝置的組裝方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H01J37/32</main-classification>  
        <further-classification edition="200601120251103B">B08B9/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>属優作</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKKA, YUSAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐藤浩平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SATO, KOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于盛楠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, SHENGNAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉次佑汰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KICHIJI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>門本豊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KADOMOTO, YUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">為了提供可以提昇運轉的效率或處理的收率的電漿處理裝置，故形成為以下的構成。 &lt;br/&gt;　　一種電漿處理裝置，其處理模組的真空容器，具備：上部區塊，側面與晶圓在內部搬運的真空搬運室容器連結；下部區塊，是配置於上部區塊的下方，與真空泵一起上下移動而可拆裝於上部區塊的底面的下部區塊，並具備與真空泵連結且具有處理室的排氣口的底板；支架，配置於上部區塊的下方，且與設置有電漿處理裝置的地面連結；以及調節機構，可將支架的上端部和底板的外周部連結，且調節底板相對於支架上端部之上下方向的距離，並且藉著調節上下方向的距離使下部區塊上端部抵接於上部區塊的底面而使其可氣密密封地連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電漿處理裝置</p>  
        <p type="p">103:真空搬運室容器</p>  
        <p type="p">105:大氣搬運室容器</p>  
        <p type="p">106:匣盒台</p>  
        <p type="p">200:處理模組</p>  
        <p type="p">201:電源箱</p>  
        <p type="p">202:處理氣體箱</p>  
        <p type="p">500:控制裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2081" publication-number="202614584"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614584.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614584</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136554</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>收發器-交換裝置</chinese-title>  
        <english-title>TRANSCEIVER-SWITCH DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120251103B">H04B10/27</main-classification>  
        <further-classification edition="200601120251103B">H04J14/02</further-classification>  
        <further-classification edition="200601120251103B">H04Q11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商ＵＣＬ　商業有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UCL BUSINESS LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧蒂諾　亞歷山德羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTTINO, ALESSANDRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>本傑明　喬舒亞　勞倫斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENJAMIN, JOSHUA LAWRENCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澤瓦斯　喬治斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZERVAS, GEORGIOS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李有財</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種收發器-交換裝置（16、20、40），用於在光網路（19、95）中傳輸數據，該網路（19）包括透過光信號路徑連接的複數個節點（90、92、94），該裝置（16、20、40）設置在複數個節點（90、92、94）中的一個節點處，配置為執行光波長、通信時間和光信號路徑的選擇，以便在光網路（19、95）中與節點進行數據傳輸，並且其中，裝置（16、20、40）設置在單個物理模組中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided a transceiver-switch device (16, 20, 40), for communicating data in an optical network (19, 95), the network (19) comprising a plurality of nodes (90, 92, 94) connected by optical signal paths, the device (16, 20, 40), provided at one node of said plurality of nodes (90, 92, 94), being configured to execute selection of optical wavelength, time of communication, and optical signal path, for communication of data in the optical network (19, 95) to and from said node, and wherein said device (16, 20, 40) is provided in a single physical module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:伺服器</p>  
        <p type="p">12:機架</p>  
        <p type="p">13:交換機</p>  
        <p type="p">15:交換機</p>  
        <p type="p">16:裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2082" publication-number="202614886"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614886.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614886</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136562</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有金屬變暗層的發光二極體晶片及相關方法</chinese-title>  
        <english-title>LIGHT-EMITTING DIODE CHIPS WITH METALLIC DIMMING LAYERS AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251231B">H10H20/841</main-classification>  
        <further-classification edition="202501120251231B">H10H20/84</further-classification>  
        <further-classification edition="202501120251231B">H10H20/814</further-classification>  
        <further-classification edition="202501120251231B">H10H20/831</further-classification>  
        <further-classification edition="202501120251231B">H10H20/857</further-classification>  
        <further-classification edition="200601120251231B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科銳ＬＥＤ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CREELED, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伍斯特　史蒂文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUESTER, STEVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>切克　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHECK, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯爾　尼古拉斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HALL, NIKOLAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示包括發光二極體（LED）之固態發光裝置，且更特定言揭示具有金屬變暗層的LED晶片及相關方法。金屬變暗層形成於LED晶片中之頂部表面及台面側壁上方以吸收及/或反射由所述LED晶片產生之光。所得LED晶片具有可以受控方式減小以滿足各種照明應用對特定亮度位準之需求的光輸出。揭示了延伸超過台面側壁但並未一直延伸至LED晶片之周邊邊緣的金屬變暗層。金屬變暗層可嵌入於鈍化層內以供電隔離，尤其在所述周邊邊緣處的電隔離。揭示了使用少至三個光微影步驟製造具有金屬變暗層之LED晶片的相關方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Solid-state lighting devices including light-emitting diodes （LEDs） and more particularly LED chips with metallic dimming layers and related methods are disclosed. Metallic dimming layers are formed over top surfaces and mesa sidewalls in LED chips to absorb and/or reflect light generated by the LED chips. Resulting LED chips have light outputs that may be reduced in a controlled manner to target various lighting applications where specific brightness levels are targeted. Metallic dimming layers are disclosed that extend past mesa sidewalls without extending all the way to perimeter edges of LED chips. Metallic dimming layers may be embedded within passivation layers for electrical isolation, particularly at the perimeter edges. Related methods are disclosed where LED chips with metallic dimming layers are fabricated with as few as three photolithography steps.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:LED晶片</p>  
        <p type="p">12:主動LED結構</p>  
        <p type="p">12':台面側壁</p>  
        <p type="p">14:載體子基板</p>  
        <p type="p">14':周邊邊緣</p>  
        <p type="p">16:p型層</p>  
        <p type="p">18:n型層</p>  
        <p type="p">20:主動層</p>  
        <p type="p">22:電流分散層</p>  
        <p type="p">24:接合金屬</p>  
        <p type="p">26:障壁層</p>  
        <p type="p">28:n接觸件</p>  
        <p type="p">28':周邊邊緣</p>  
        <p type="p">30-1:第一鈍化層</p>  
        <p type="p">30-2:第二鈍化層</p>  
        <p type="p">32:金屬層</p>  
        <p type="p">32':側向延伸件</p>  
        <p type="p">34:光</p>  
        <p type="p">36:間隙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2083" publication-number="202614312"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614312.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614312</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136707</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>安裝前處理裝置、安裝系統及安裝前處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/67</main-classification>  
        <further-classification edition="200601120251230B">B29C35/08</further-classification>  
        <further-classification edition="200601120251230B">H05H1/24</further-classification>  
        <further-classification edition="200601120251230B">H01J37/32</further-classification>  
        <further-classification edition="200601120251230B">B08B7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商芝浦機械電子裝置股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIBAURA MECHATRONICS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒岩杏太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUROIWA, KYOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大河原聡史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAWARA, TOSHIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瀬戸直樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SETO, NAOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大江卓矢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHE, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可抑制電子零件與安裝基板的接合面處的接合強度的降低的安裝前處理裝置、安裝系統及安裝前處理方法。實施形態的安裝前處理裝置（300）具有：電漿處理裝置（102），收容將具有黏著面（AS）的片（T）安裝在環（R）且在環（R）的內側中的片（T）的黏著面（AS）上黏著有小片化為電子零件（E）的晶圓（W）的零件供給體（TW），在將電子零件（E）接合在安裝基板（BW）之前進行電漿處理；以及硬化處理裝置（101），在利用電漿處理裝置（102）進行電漿處理之前，從片（T）中的黏著有電子零件（E）的一側照射電磁波，由此使黏著面（AS）中的未黏著電子零件（E）的露出面（Te）硬化。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1、10、11b:腔室</p>  
        <p type="p">9:照射裝置</p>  
        <p type="p">11a:基體</p>  
        <p type="p">11c:裝載口</p>  
        <p type="p">100:安裝系統</p>  
        <p type="p">102:電漿處理裝置</p>  
        <p type="p">110:供給體清洗裝置</p>  
        <p type="p">111:清洗室</p>  
        <p type="p">120:安裝基板清洗裝置</p>  
        <p type="p">130:調整處理裝置</p>  
        <p type="p">140:規測裝置</p>  
        <p type="p">150:對準裝置</p>  
        <p type="p">160:供給體緩衝裝置</p>  
        <p type="p">170:安裝基板緩衝裝置</p>  
        <p type="p">180:接合裝置</p>  
        <p type="p">190:搬送裝置(搬送部)</p>  
        <p type="p">191:搬送機器人</p>  
        <p type="p">191a:機械手</p>  
        <p type="p">192:移動機構</p>  
        <p type="p">200:控制裝置</p>  
        <p type="p">300:安裝前處理裝置</p>  
        <p type="p">BW:安裝基板</p>  
        <p type="p">F:搬送容器</p>  
        <p type="p">TW:零件供給體</p>  
        <p type="p">X:安裝前處理部</p>  
        <p type="p">Y:安裝部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2084" publication-number="202613003"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613003.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613003</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136742</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種倉儲分區方法、裝置、設備及倉儲系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B65G1/137</main-classification>  
        <further-classification edition="200601120251201B">G05B19/418</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國大陸商深圳市海柔創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAI ROBOTICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡永恆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸炯炳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尚磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐聖東</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭睿群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀畊宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開了一種倉儲分區方法、裝置、設備及倉儲系統。所述方法包括：根據第一數量和每個操作點對應的待執行任務負荷將多個物理巷道劃分為多個目標子巷道，以使目標子巷道的數量為第一數量，且當一個物理巷道中包括至少兩個目標子巷道時，同一物理巷道中的任意兩個目標子巷道對應的待執行任務負荷之間的第一差值小於待執行任務負荷均值，以及同一物理巷道中的任意兩個目標子巷道對應的待執行任務負荷之間的和大於待執行任務負荷均值，其中，目標子巷道中的操作點連續，且屬於同一物理巷道。根據本申請的技術方案，通過對物理巷道進行動態分區，可有效均衡每個機器人執行任務數量，提升機器人搬運作業效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:步驟</p>  
        <p type="p">120:步驟</p>  
        <p type="p">130:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2085" publication-number="202613607"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613607.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613607</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136744</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於包括ＬＥＤ之透明顯示器之覆蓋濾光片</chinese-title>  
        <english-title>A COVER FILTER FOR A TRANSPARENT DISPLAY INCLUDING LEDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">G02B5/22</main-classification>  
        <further-classification edition="202501120251223B">H10H29/80</further-classification>  
        <further-classification edition="202501120251223B">H10H29/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭鎭成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, JIN SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金大淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DAE YOUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李弦㜯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYUNHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李庚珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, KYUNG-JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹根尙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, GUN-SANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種用於透明顯示器之覆蓋濾光片，該透明顯示器包含透明背板及定位於該透明背板上之一個或多個光源。該覆蓋濾光片包含光學濾光片層，其定位於該一個或多個光源上或上方，該光學濾光片層包含一個或多個透明區域及一個或多個吸收區域，該一個或多個吸收區域吸收自該一個或多個光源反射的光，該一個或多個吸收區域經組態以定位成覆蓋該一個或多個光源；第一透明層，其定位於該光學濾光片層上；以及抗反射層，其視情況定位於該第一透明層上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided a cover filter for a transparent display, the transparent display comprising a transparent backplane and one or more light sources positioned on the transparent backplane. The cover filter comprises an optical filter layer positioned on or over the one or more light sources, the optical filter layer comprising one or more transparent areas and one or more absorptive areas, the one or more absorptive areas absorbing light reflected from the one or more light sources, the one or more absorptive areas configured to be positioned to cover the one or more light sources; a first transparent layer positioned on the optical filter layer; and an anti-reflection layer optionally positioned on the first transparent layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201:透明背板</p>  
        <p type="p">202:晶片，光源</p>  
        <p type="p">202a,202b,202c:光源</p>  
        <p type="p">203:覆蓋濾光片，光學濾光片層</p>  
        <p type="p">203a:透明區域</p>  
        <p type="p">203b:吸收區域，吸收圖案化區域，吸收著色區域</p>  
        <p type="p">204:覆蓋濾光片，第一透明層</p>  
        <p type="p">205:覆蓋濾光片，抗反射層</p>  
        <p type="p">206:覆蓋濾光片，透明黏著層</p>  
        <p type="p">B:藍</p>  
        <p type="p">G:綠</p>  
        <p type="p">R:紅</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2086" publication-number="202613987"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613987.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613987</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136759</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊處理系統、資訊處理方法、及資訊處理程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251220B">G08B21/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商川崎重工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松田義基</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUDA, YOSHIMOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之資訊處理系統之處理電路係構成為進行如下步驟：獲取表示由至少1個個人所設定之資訊粗雜化之程度的遮罩強度，獲取與前述個人之行為相關之個人行為資訊，生成粗雜化資訊，並將前述粗雜化資訊代替前述個人行為資訊用於既定之資訊處理，前述粗雜化資訊係以前述遮罩強度愈高愈降低前述個人行為資訊之詳細度之方式，根據前述遮罩強度降低前述個人行為資訊之前述詳細度而成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:資訊處理系統</p>  
        <p type="p">2:室內設施</p>  
        <p type="p">3:個人</p>  
        <p type="p">4:資訊處理終端</p>  
        <p type="p">5:無線存取點</p>  
        <p type="p">7:伺服器</p>  
        <p type="p">N:通訊網路</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2087" publication-number="202612630"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612630.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612630</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136773</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>底盤裝置、清潔基站及清潔系統</chinese-title>  
        <english-title>CHASSIS DEVICE, CLEANING DOCKING STATION AND CLEANING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251015B">A47L11/24</main-classification>  
        <further-classification edition="200601120251015B">A47L11/283</further-classification>  
        <further-classification edition="200601120251015B">A47L11/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡彩雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CAIYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝旭昶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAO, XUCHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>刘伟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赵立栋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, LIDONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種底盤裝置、清潔基站及清潔系統，包括底盤組件、刮洗組件、螺紋結構以及限位結構；底盤組件和刮洗組件之間通過螺紋結構相連接；底盤組件和刮洗組件之間形成有限位結構，限位結構用於限位刮洗組件沿底盤組件高度方向上的移動範圍；當清潔設備中的抹布組件進行雙向旋轉並在低位位置和高位位置之間移動時，通過抹布組件能帶動刮洗組件在第一位置和第二位置之間移動。本實施例提供的底盤裝置，可實現對抹布組件的雙向清洗，抹布的清洗效率以及清洗效果提升。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a chassis device, a cleaning docking station and a cleaning system. The chassis device includes a chassis assembly, a scraping assembly, a threaded structure and a limiting structure. The chassis assembly and the scraping assembly are connected through the threaded structure. The limiting structure is formed between the chassis assembly and the scraping assembly, and the limiting structure is used to limit a range of movement of the scraping assembly along a height direction of the chassis assembly. When a rag assembly in the cleaning device rotates in both directions and moves between a low position and a high position, the rag assembly can drive the scraping assembly to move between a first position and a second position. The chassis device provided in the embodiment can realize bidirectional cleaning of the rag assembly, and the cleaning efficiency and cleaning effect of the rag can be improved</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">113:底座柱體</p>  
        <p type="p">1131:底座孔</p>  
        <p type="p">1132:導向柱</p>  
        <p type="p">1134:底座台階</p>  
        <p type="p">1211:刮洗孔</p>  
        <p type="p">1212:連接柱</p>  
        <p type="p">12121:第一區段</p>  
        <p type="p">12122:第二區段</p>  
        <p type="p">1213:導向孔</p>  
        <p type="p">1214:刮條插入端</p>  
        <p type="p">1215:刮洗台階</p>  
        <p type="p">131:螺旋凹槽</p>  
        <p type="p">132:配合凸起</p>  
        <p type="p">14:限位件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2088" publication-number="202614396"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614396.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614396</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136774</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體封裝件和封裝基板</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE AND A PACKAGE SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H01L23/31</main-classification>  
        <further-classification edition="200601120251103B">H01L25/10</further-classification>  
        <further-classification edition="200601120251103B">H01L23/498</further-classification>  
        <further-classification edition="200601120251103B">H01L23/049</further-classification>  
        <further-classification edition="200601120251103B">H01L21/56</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐鉉哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, HYUN CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李峻信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JUN SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">半導體封裝件包括：封裝基板，其包括主體層和設置在主體層上的第一絕緣層；安裝在封裝基板上的第一半導體晶片和第二半導體晶片；以及填充封裝基板與第一半導體晶片和第二半導體晶片之間的空間的模製層，模製層圍繞第一半導體晶片和第二半導體晶片。主體層包括：與第一半導體晶片垂直地重疊的第一晶片重疊區域；與第二半導體晶片垂直地重疊的第二晶片重疊區域；以及在第一晶片重疊區域與第二晶片重疊區域之間的中間區域。第一絕緣層包括第一開口，該第一開口與第一半導體晶片的面對第二半導體晶片的第一側表面和第二半導體晶片的面對第一半導體晶片的第二側表面垂直地重疊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor package includes a package substrate including a body layer and a first insulating layer disposed on the body layer, first and second semiconductor chips mounted on the package substrate, and a molding layer filling the spaces between the package substrate and the first and second semiconductor chips, the molding layer surrounding the first and second semiconductor chips. The body layer includes a first chip overlapping region that vertically overlaps the first semiconductor chip, a second chip overlapping region that vertically overlaps the second semiconductor chip, and an intermediate region between the first chip overlapping region and the second chip overlapping region. The first insulating layer includes a first opening vertically overlapping a first side surface of the first semiconductor chip facing the second semiconductor chip and a second side surface of the second semiconductor chip facing the first semiconductor chip.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10A:封裝基板</p>  
        <p type="p">12A:第一凸塊接合襯墊</p>  
        <p type="p">12B:第二凸塊接合襯墊</p>  
        <p type="p">15:第一絕緣層</p>  
        <p type="p">21:第一半導體晶片</p>  
        <p type="p">22:第二半導體晶片</p>  
        <p type="p">100:半導體封裝件</p>  
        <p type="p">A-A’:線</p>  
        <p type="p">B-B’:線</p>  
        <p type="p">C-C’:線</p>  
        <p type="p">D-D’:線</p>  
        <p type="p">E-E’:線</p>  
        <p type="p">L1:長度</p>  
        <p type="p">L2:長度</p>  
        <p type="p">L3:長度</p>  
        <p type="p">OP1:第一開口</p>  
        <p type="p">OP2:第二開口</p>  
        <p type="p">OP3:第三開口</p>  
        <p type="p">OP4:第四開口</p>  
        <p type="p">OP5:第五開口</p>  
        <p type="p">OP6:第六開口</p>  
        <p type="p">OP7:第七開口</p>  
        <p type="p">OP8:第八開口</p>  
        <p type="p">OP9:第九開口</p>  
        <p type="p">TH1:第一通孔</p>  
        <p type="p">TH2:第二通孔</p>  
        <p type="p">W1:寬度</p>  
        <p type="p">W2:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2089" publication-number="202612632"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612632.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612632</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136783</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>底盤裝置、清潔基站及清潔系統</chinese-title>  
        <english-title>CHASSIS DEVICE, CLEANING BASE STATION AND CLEANING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251013B">A47L11/282</main-classification>  
        <further-classification edition="200601120251013B">A47L11/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡彩雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CAIYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝旭昶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAO, XUCHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>刘伟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>赵立栋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, LIDONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供了一種底盤裝置、清潔基站及清潔系統，涉及智慧家居技術領域，包括底盤組件、刮洗組件、提升結構以及限位結構；刮洗組件用於對能夠進行升降運動且能夠進行正轉和反轉的抹布組件進行清洗；限位結構連接刮洗組件，用於限制刮洗組件相對於底盤組件旋轉；提升結構設置於底盤組件與刮洗組件之間，提升結構至少用於帶動刮洗組件沿遠離底盤組件的方向抬升，使抹布組件能夠在正轉和反轉狀態的至少部分時段內與刮洗組件保持接觸。本揭露提供的底盤裝置，可實現對抹布組件的雙向清洗，抹布的清洗效率提升，抹布清洗效果提升，從而能夠有效地避免因抹布清潔度差影響清潔設備對待清潔面如地面等的清洗效果，從而提升使用者體驗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a chassis device, a cleaning base station, and a cleaning system, which relate to the technical field of smart home. The chassis device includes a chassis assembly, a scraping and cleaning assembly, a lifting structure, and a limiting structure. The scraping and cleaning assembly is used for cleaning a mopping assembly that can perform lifting movement and can rotate forward and backward. The limiting structure is connected to the scraping and cleaning assembly and is used to limit the rotation of the scraping and cleaning assembly relative to the chassis assembly. The lifting structure is arranged between the chassis assembly and the scraping and cleaning assembly, and the lifting structure is at least used to drive the scraping and cleaning assembly to lift along a direction away from the chassis assembly, so that the mopping assembly can keep in contact with the scraping and cleaning assembly during at least part of the forward and backward rotation states. The chassis device provided by the present disclosure can realize bi-directional cleaning of the mopping assembly, improve cleaning efficiency and cleaning effect of a mopping cloth, and thus can effectively prevent the cleaning effect of cleaning equipment on surfaces to be cleaned (such as the ground) due to poor cleanliness of the mopping cloth, thereby enhancing the user’s experience.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">113:底座柱體</p>  
        <p type="p">1131:底座孔</p>  
        <p type="p">1132:導向柱</p>  
        <p type="p">1133:底座台階</p>  
        <p type="p">112:清洗盤</p>  
        <p type="p">121:刮洗柱體</p>  
        <p type="p">1211:刮洗孔</p>  
        <p type="p">1212:定位柱</p>  
        <p type="p">1213:刮洗台階</p>  
        <p type="p">13:提升結構</p>  
        <p type="p">14:限位結構</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2090" publication-number="202613545"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613545.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613545</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136813</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>超音波檢查裝置及利用此裝置的超音波檢查方法</chinese-title>  
        <english-title>ULTRASONIC INSPECTION DEVICE AND ULTRASONIC INSPECTION METHOD USING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251107B">G01N29/06</main-classification>  
        <further-classification edition="200601120251107B">G01N29/24</further-classification>  
        <further-classification edition="200601120251107B">G01N33/48</further-classification>  
        <further-classification edition="200601120251107B">B65G69/20</further-classification>  
        <further-classification edition="200601120251107B">B65G47/74</further-classification>  
        <further-classification edition="200601120251107B">B65G43/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商麻省理工學院有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔鍾鳴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, JONG MYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金柱鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JU HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛鍾熏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, JONG HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭忠玟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, CHUNG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種超音波檢查裝置及方法，能快速且精確地大量檢測多個受檢體。該裝置包括：輸送受檢體之上料模組；支撐並固定受檢體之載台治具模組；對受檢體進行檢查之超音波檢查模組；輸送載台至檢查模組之載台輸送模組；以及於檢查前後拆裝蓋體之載台蓋處理模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:超音波檢查裝置</p>  
        <p type="p">100:上料模組</p>  
        <p type="p">200:載台治具模組</p>  
        <p type="p">300:超音波檢查模組</p>  
        <p type="p">400:載台輸送模組</p>  
        <p type="p">500:載台蓋處理模組</p>  
        <p type="p">510:載台蓋拆卸部</p>  
        <p type="p">520:載台蓋安裝部</p>  
        <p type="p">600:載台塊模組</p>  
        <p type="p">700:乾燥模組</p>  
        <p type="p">710:第一乾燥部</p>  
        <p type="p">720:第二乾燥部</p>  
        <p type="p">800:卸料模組</p>  
        <p type="p">B:塊體緩衝區</p>  
        <p type="p">C:控制模組</p>  
        <p type="p">S:受檢體</p>  
        <p type="p">X,Y,Z:軸方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2091" publication-number="202613500"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613500.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613500</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136836</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感測器的外參標定方法、清潔機器人、清潔系統、介質</chinese-title>  
        <english-title>METHOD FOR CALIBRATION OF EXTRINSIC PARAMETER OF SENSOR, CLEANING ROBOT, CLEANING SYSTEM, COMPUTER-READABLE STORAGE MEDIUM, AND AN ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G01C25/00</main-classification>  
        <further-classification edition="202401120251230B">G05D1/606</further-classification>  
        <further-classification edition="200601120251230B">G01C21/20</further-classification>  
        <further-classification edition="200601120251230B">B25J19/02</further-classification>  
        <further-classification edition="201701120251230B">G06T7/70</further-classification>  
        <further-classification edition="200601120251230B">G06F17/16</further-classification>  
        <further-classification edition="200601120251230B">A47L11/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭創新科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余一徽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, YIHUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及自動控制技術領域，提供了一種感測器的外參標定方法、清潔機器人、清潔系統、電腦可讀存儲介質、電子設備，其中，上述方法包括：在清潔機器人的運動過程中，獲取基準感測器針對每個運動區間的基準局部感知資料，以及，獲取每個待標定感測器針對每個運動區間的輔助局部感知資料；根據基準局部感知資料和輔助局部感知資料確定每個待標定感測器到基準感測器的第一轉換矩陣；獲取基準感測器到里程計坐標系的第二轉換矩陣，根據第一轉換矩陣結合第二轉換矩陣，確定每個待標定感測器到里程計坐標系的候選轉換矩陣；優化每個候選轉換矩陣，獲得每個待標定感測器到里程計坐標系的最終轉換矩陣。本公開能夠低成本的準確標定感測器外參。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to the field of automatic control technology, and provides a method for calibration of an extrinsic parameter of a sensor, a cleaning robot, a cleaning system, a computer-readable storage medium, and an electronic device, where the method includes: during the movement of the cleaning robot, obtaining reference local perception data of a reference sensor for each movement range, and obtaining auxiliary local perception data of each sensor to be calibrated for each movement range; based on the reference local perception data and the auxiliary local perception data, determining a first transformation matrix from each sensor to be calibrated to the reference sensor; obtaining a second transformation matrix from the reference sensor to a odometer coordinate system., and based on the first transformation matrix combined with the second transformation matrix, determining a candidate transformation matrix from each sensor to be calibrated to the odometer coordinate system; and obtaining a final transformation matrix from each sensor to be calibrated to the odometer coordinate system by optimizing each candidate transformation matrix. In the present disclosure, the extrinsic parameter of the sensor can be accurately calibrated at a low cost.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S110,S120,S130,S140:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2092" publication-number="202613748"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613748.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613748</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136838</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>移動機器人及機器人系統</chinese-title>  
        <english-title>MOBILE ROBOT AND ROBOTIC SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251023B">G05D1/622</main-classification>  
        <further-classification edition="202401120251023B">G05D1/648</further-classification>  
        <further-classification edition="202401120251023B">G05D1/43</further-classification>  
        <further-classification edition="200601120251023B">A47L11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐洪亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, HONGLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝道南</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, DAONAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝君朋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIE, JUNPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李圳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程冉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, RAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開實施例提出一種移動機器人及機器人系統，屬於機器人的技術領域。移動機器人，包括：避障檢測組件、移動主體和設置於移動主體的外延部；避障檢測組件的探測區域與外延部的操作區域至少部分重疊。避障檢測組件的探測區域與外延部的操作區域至少部分重疊，使得外延部在操作過程中，避障檢測組件能夠對外延部的活動範圍進行實時檢測，能夠盡可能地避免在外延部的操作區域內出現障礙物，使得外延部出現損害的情況，也能夠盡可能地避免外延部觸碰到人員，造成人員傷害。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a mobile robot and a robotic system, relating to the technical field of robotics. The mobile robot includes: an obstacle detection component, a mobile body, and an extension part mounted on the mobile body; where the detection area of the obstacle detection component at least partially overlaps with the operational area of the extension part. This arrangement enables the obstacle detection component to monitor the operational range of the extension part in real time during operation. It maximizes avoidance of obstacles within the operational area of the extension part, thereby minimizing the risk of damage to the extension part. Additionally, it maximizes avoidance of contact between the extension part and personnel, preventing potential injury.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:移動機器人</p>  
        <p type="p">110:移動主體</p>  
        <p type="p">120:外延部</p>  
        <p type="p">130:第一避障檢測器</p>  
        <p type="p">131:第一探測區域</p>  
        <p type="p">132:第一光軸</p>  
        <p type="p">140:第二避障檢測器</p>  
        <p type="p">141:第二探測區域</p>  
        <p type="p">142:第二光軸</p>  
        <p type="p">a1:第一橫向角</p>  
        <p type="p">a2:第二橫向角</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2093" publication-number="202612636"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612636.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612636</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136839</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔基站及清潔系統</chinese-title>  
        <english-title>CLEANING DOCKING STATION AND CLEANING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251007B">A47L11/40</main-classification>  
        <further-classification edition="200601120251007B">A47L11/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡彩雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CAIYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝旭昶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAO, XUCHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙立棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, LIDONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種清潔基站，至少用於清洗清潔組件，包括基座和清洗組件，基座具有輸出結構，輸出結構包括同軸設置的第一輸出接頭和第二輸出接頭，第一輸出接頭和第二輸出接頭的輸出動作方向相反；清洗組件設於基座，用於清洗清潔組件，清洗組件中部設置有穿孔，清洗組件朝向基座的一側設有第一傳動接頭，第一傳動接頭與第一輸出接頭相連；在清潔組件與清洗組件相接觸時，第二輸出接頭穿過穿孔與設於清潔組件上的第二傳動接頭相連；在清潔組件與清洗組件分離時，第二輸出接頭與第二傳動接頭分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A cleaning docking station is at least used for cleaning a cleaner component and includes a base and a cleaning component. The base is provided with an output structure including a first output connector and a second output connector coaxially arranged, where output action directions of the first output connector and the second output connector are opposite to each other. The cleaning component is arranged on the base and is configured to clean the cleaner component, where a through hole is provided in the middle of the cleaning component, a first transmission connector is provided on the side of the cleaning component facing the base, and the first transmission connector is connected to the first output connector. When the cleaner component contacts the cleaning component, the second output connector passes through the through hole and is connected to a second transmission connector provided on the cleaner component; and when the cleaner component separates from the cleaning component, the second output connector separates from the second transmission connector.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:清潔基站</p>  
        <p type="p">10:底座</p>  
        <p type="p">20:輸出結構</p>  
        <p type="p">30:清洗組件</p>  
        <p type="p">40:清洗盤</p>  
        <p type="p">50:刮洗清洗件</p>  
        <p type="p">60:引流槽</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2094" publication-number="202612637"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612637.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612637</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136840</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔基站及清潔系統</chinese-title>  
        <english-title>CLEANING BASE STATION AND CLEANING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251023B">A47L11/40</main-classification>  
        <further-classification edition="200601120251023B">A47L11/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡彩雲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HU, CAIYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郝旭昶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAO, XUCHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙立棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, LIDONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂昆餘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種清潔基站及清潔系統，清潔基站包括基座、清洗組件和驅動組件；清洗組件設於基座，用於清洗清潔組件，清洗組件包括清洗板，清洗板中部設有排污口，清洗板背向基座的一側設有清洗結構和導流筋，導流筋為一端指向排污口的螺旋結構，用於引導位於清洗板表面的至少部分液體流向排污口；驅動組件設於基座並與清洗組件傳動連接，用於驅動清洗組件旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a cleaning base station and a cleaning system, the cleaning base station including a base, a cleaning assembly, and a driving assembly; the cleaning assembly is arranged on the base and is configured to clean a cleaning component, the cleaning assembly including a cleaning plate, the cleaning plate having a sewage outlet at a middle portion thereof, a cleaning structure and a flow guiding rib being arranged on a side of the cleaning plate facing away from the base, the flow guiding rib being a spiral structure having one end directed toward the sewage outlet and configured to guide at least part of liquid on a surface of the cleaning plate to flow toward the sewage outlet; the driving assembly is arranged on the base and is in transmission connection with the cleaning assembly, and is configured to drive the cleaning assembly to rotate.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:清潔基站</p>  
        <p type="p">210:基座</p>  
        <p type="p">2101:排液槽</p>  
        <p type="p">220:清洗組件</p>  
        <p type="p">230:驅動組件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2095" publication-number="202612873"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612873.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612873</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136857</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>機器手臂及其關節模組</chinese-title>  
        <english-title>ROBOTIC ARM AND JOINT MODULE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251124B">B25J17/00</main-classification>  
        <further-classification edition="200601120251124B">B25J9/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商思輔科技有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAVFE TECH LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周皓凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, HAO-KAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊智閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘奕奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PAN, YI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>方玄翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, HSUAN-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭琇云</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, XIU-YUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林佑俞</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於機器手臂的關節模組，包括：基座，具有第一滾珠坡道組，第一滾珠坡道組包括多個第一滾珠坡道；固定環，具有多個容納槽，這些容納槽用於容納多個滾珠，這些滾珠被配置於基座與固定環之間；中心軸，穿設於基座及固定環；以及彈性件，配置於固定環之一側。當中心軸帶動固定環旋轉時，多個滾珠沿多個第一滾珠坡道滑動，使固定環產生軸向位移以擠壓彈性件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A joint module for a robotic arm is provided. The joint module includes a base having a first ball ramp assembly, where the first ball ramp assembly includes multiple first ball ramps; a fixing ring having multiple receiving slots for accommodating multiple balls, where the balls are disposed between the base and the fixing ring; a central shaft passing through the base and the fixing ring; and an elastic member disposed on one side of the fixing ring. When the central shaft drives the fixing ring to rotate, the balls slide along the first ball ramps, causing the fixing ring to generate an axial displacement to compress the elastic member.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:殼體</p>  
        <p type="p">100:關節模組</p>  
        <p type="p">110:基座</p>  
        <p type="p">120:固定環</p>  
        <p type="p">130:中心軸</p>  
        <p type="p">140:彈性件</p>  
        <p type="p">150:滾珠</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2096" publication-number="202614349"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614349.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614349</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136863</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>靜電吸盤</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">H01L21/683</main-classification>  
        <further-classification edition="200601120251103B">H02N13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商美科陶瓷科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICO CERAMICS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池珉皓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JI, MIN-HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙美娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, MINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種靜電吸盤，根據本發明的實施例的靜電吸盤，其包括具有第一面和第二面的陶瓷板，所述陶瓷板包括：多個陶瓷層；第一電極及第二電極，配置在多個所述陶瓷層之間；第一通孔及第二通孔，貫穿所述陶瓷層的一部分，所述第一通孔與所述第一電極相連，所述第二通孔與所述第二電極相連，所述第一通孔的一端和所述第二通孔的一端暴露於所述陶瓷板的第二面；以及導電矽墊，配置在所述陶瓷板的第二面，並且接合在所述第一通孔的一端和所述第二通孔的一端，以將所述第一通孔和所述第二通孔進行電連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:靜電吸盤</p>  
        <p type="p">112:陶瓷板</p>  
        <p type="p">112a、112b、112c:陶瓷層</p>  
        <p type="p">113a:第一面</p>  
        <p type="p">113b:第二面</p>  
        <p type="p">114:底座</p>  
        <p type="p">116、117:電極</p>  
        <p type="p">118、119:通孔</p>  
        <p type="p">120:導電矽墊</p>  
        <p type="p">124:黏合層</p>  
        <p type="p">128:電極棒</p>  
        <p type="p">B:接觸部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2097" publication-number="202613362"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613362.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613362</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136865</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電極及其製造方法</chinese-title>  
        <english-title>ELECTRODE AND METHOD FOR MAKING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251110B">C25B11/051</main-classification>  
        <further-classification edition="202101120251110B">C25B1/04</further-classification>  
        <further-classification edition="200601120251110B">B01J23/745</further-classification>  
        <further-classification edition="200601120251110B">B01J23/755</further-classification>  
        <further-classification edition="200601120251110B">B01J37/02</further-classification>  
        <further-classification edition="200601120251110B">B01J37/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>義商第諾拉工業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INDUSTRIE DE NORA S. P. A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富西　維多利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUSI, VITTORIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮諾　法蘭西斯柯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PINO, FRANCESCO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉恩廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address/> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種電極，優選地涉及一種氣體析出電極，其包括一基材及一催化塗層，其中該催化塗層包括鐠、鐵、鎳及從由銅、錫及其組合組成的群中選出的金屬。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to an electrode, preferably a gas evolution electrode, which comprises a substrate and a catalytic coating, wherein said catalytic coating comprises praseodymium, iron, nickel and a metal selected from a group consisting of copper, tin and a combination thereof.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2098" publication-number="202613585"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613585.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613585</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136866</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電池功率計算方法及使用該電池功率計算方法的電子裝置</chinese-title>  
        <english-title>BATTERY POWER COMPUTING METHOD AND ELECTRONIC DEVICE USING THE BATTERY POWER COMPUTING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201901120251110B">G01R31/389</main-classification>  
        <further-classification edition="201901120251110B">G01R31/385</further-classification>  
        <further-classification edition="201901120251110B">G01R31/382</further-classification>  
        <further-classification edition="201901120251110B">G01R31/367</further-classification>  
        <further-classification edition="201901120251110B">G01R31/374</further-classification>  
        <further-classification edition="200601120251110B">G01R21/06</further-classification>  
        <further-classification edition="200601120251110B">G01R21/133</further-classification>  
        <further-classification edition="200601120251110B">G01R21/14</further-classification>  
        <further-classification edition="200601120251110B">G01R27/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳冠宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, KUAN-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊家宥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, JIA-YOU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝廷祥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, TING-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳瑞騏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JUI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖基成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, CHI-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電池功率計算方法，應用於電池，包括：獲取該電池的電池電阻表，其中該電池電阻表包括該電池的複數個電池電阻與複數個電池功率水平之間的第一映射關係；獲取電阻轉換表，其中該電阻轉換表包括複數個電池電阻轉換與該電池的複數個條件之間的第二映射關係；以及根據該第一映射關係和該第二映射關係，在對該電池進行充電或放電時測量該電池功率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A battery power computing method, applied to a battery, comprising: acquiring a battery resistance table of the battery, wherein the battery resistance table comprises first mapping relations between a plurality of battery resistances of the battery and a plurality of battery power levels; acquiring a resistance conversion table, wherein the resistance conversion table comprises second mapping relations between a plurality of battery resistance conversions and a plurality of conditions of the battery; and measuring the battery power according to the first mapping relations and the second mapping relations, while charging or discharging the battery.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">901、903、905:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2099" publication-number="202614185"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614185.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614185</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136876</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>黏著性膜</chinese-title>  
        <english-title>ADHESIVE FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251027B">H01L21/301</main-classification>  
        <further-classification edition="200601120251027B">H01L21/52</further-classification>  
        <further-classification edition="201801120251027B">C09J7/20</further-classification>  
        <further-classification edition="200601120251027B">C09J11/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種黏著性膜（10），包括基材層（A）及黏著性樹脂層（C），所述黏著性樹脂層（C）包含熱膨脹性微小球，依照規定的方法觀察到的異物的數量小於10個。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An adhesive film (10) includes a substrate layer (A) and an adhesive resin layer (C), wherein the adhesive resin layer (C) includes thermally expandable microspheres, and the number of foreign matters observed in accordance with a predetermined method is less than 10.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:黏著性膜</p>  
        <p type="p">20:加工對象物</p>  
        <p type="p">30:支撐構件</p>  
        <p type="p">100:結構體</p>  
        <p type="p">A:基材層</p>  
        <p type="p">A1:第一面</p>  
        <p type="p">A2:第二面</p>  
        <p type="p">C:黏著性樹脂層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2100" publication-number="202613273"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613273.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613273</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136881</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251104B">C09J163/02</main-classification>  
        <further-classification edition="200601120251104B">B01J13/08</further-classification>  
        <further-classification edition="200601120251104B">B32B27/24</further-classification>  
        <further-classification edition="200601120251104B">C09J133/08</further-classification>  
        <further-classification edition="201801120251104B">C09J7/35</further-classification>  
        <further-classification edition="201901120251104B">B32B7/06</further-classification>  
        <further-classification edition="200601120251104B">B32B27/30</further-classification>  
        <further-classification edition="200601120251104B">B32B27/08</further-classification>  
        <further-classification edition="200601120251104B">C08J9/32</further-classification>  
        <further-classification edition="200601120251104B">H05B33/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置的製造方法，包含：準備結構體（100）的步驟，所述結構體（100）包含黏著性膜（10）、加工對象物（20）及支撐構件（30），所述黏著性膜（10）包括基材層（A）、黏著性樹脂層（B）、及黏著性樹脂層（C），所述加工對象物（20）暫時固定於所述黏著性樹脂層（B），所述支撐構件（30）暫時固定於所述黏著性樹脂層（C）；以及對暫時固定於所述黏著性樹脂層（B）的所述加工對象物（20）進行加工的步驟，所述基材層（A）位於所述黏著性樹脂層（B）與所述黏著性樹脂層（C）之間，所述黏著性樹脂層（C）包含熱膨脹性微小球，所述黏著性膜（10）的基於規定的測定方法的黏力為5 gf以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing an electronic device includes a process of preparing a structure (100) that includes an adhesive film (10) with a base material layer (A), an adhesive resin layer (B), and an adhesive resin layer (C), a workpiece (20) temporarily fixed to the adhesive resin layer (B), and a support member (30) temporarily fixed to the adhesive resin layer (C); and a process of processing the workpiece (20) temporarily fixed to the adhesive resin layer (B). The base material layer (A) is positioned between the adhesive resin layer (B) and the adhesive resin layer (C), the adhesive resin layer (C) contains thermally expandable microspheres, and a tack strength of the adhesive film (10) is 5 gf or less according to a specified measurement method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:黏著性膜</p>  
        <p type="p">20:加工對象物</p>  
        <p type="p">30:支撐構件</p>  
        <p type="p">40:加工後的加工對象物</p>  
        <p type="p">100:結構體</p>  
        <p type="p">A:基材層</p>  
        <p type="p">B:黏著性樹脂層</p>  
        <p type="p">C:黏著性樹脂層</p>  
        <p type="p">Y1:步驟</p>  
        <p type="p">Y2:步驟</p>  
        <p type="p">Y3:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2101" publication-number="202613267"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613267.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613267</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136884</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251212B">C09J7/30</main-classification>  
        <further-classification edition="200601120251212B">C08J9/32</further-classification>  
        <further-classification edition="200601120251212B">B32B37/12</further-classification>  
        <further-classification edition="200601120251212B">B32B7/12</further-classification>  
        <further-classification edition="200601120251212B">H01L21/673</further-classification>  
        <further-classification edition="202501120251212B">H10D1/60</further-classification>  
        <further-classification edition="201301120251212B">H01G13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置的製造方法，包含：準備結構體（100）的步驟，所述結構體（100）包含黏著性膜（10）及加工對象物（20），所述黏著性膜（10）包括基材層（A）及黏著性樹脂層（C），所述加工對象物（20）暫時固定於所述黏著性樹脂層（C）；以及對暫時固定於所述黏著性樹脂層（C）的所述加工對象物（20）進行加工的步驟，所述黏著性樹脂層（C）包含熱膨脹性微小球，所述黏著性膜（10）的基於規定的測定方法的黏力為5 gf以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing an electronic device includes a process of preparing a structure (100) that includes an adhesive film (10) with a substrate layer (A) and an adhesive resin layer (C), and an object to be processed (20) temporarily fixed to the adhesive resin layer (C); and a process of processing the object to be processed (20) temporarily fixed to the adhesive resin layer (C). The adhesive resin layer (C) contains thermally expandable microspheres, and a tack strength of the adhesive film (10) is 5 gf or less according to a specified measurement method.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:黏著性膜</p>  
        <p type="p">20:加工對象物</p>  
        <p type="p">30:支撐構件</p>  
        <p type="p">40:加工後的加工對象物</p>  
        <p type="p">100:結構體</p>  
        <p type="p">A:基材層</p>  
        <p type="p">C:黏著性樹脂層</p>  
        <p type="p">X1:步驟</p>  
        <p type="p">X2:步驟</p>  
        <p type="p">X3:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2102" publication-number="202613268"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613268.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613268</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136902</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251212B">C09J7/30</main-classification>  
        <further-classification edition="200601120251212B">C08J9/32</further-classification>  
        <further-classification edition="200601120251212B">B32B37/12</further-classification>  
        <further-classification edition="200601120251212B">B32B7/12</further-classification>  
        <further-classification edition="200601120251212B">H01L21/673</further-classification>  
        <further-classification edition="202501120251212B">H10D1/60</further-classification>  
        <further-classification edition="201301120251212B">H01G13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置的製造方法，包含：準備結構體（100）的步驟，所述結構體（100）包含黏著性膜（10）及加工對象物（20），所述黏著性膜（10）包括基材層（A）及黏著性樹脂層（C），所述加工對象物（20）暫時固定於所述黏著性樹脂層（C）；以及對暫時固定於所述黏著性樹脂層（C）的所述加工對象物（20）進行加工的步驟，所述黏著性樹脂層（C）包含熱膨脹性微小球，所述黏著性膜（10）的、進行了規定的處理後基於規定的方法2的算術平均粗糙度Ra&lt;sub&gt;2&lt;/sub&gt;相對於進行了規定的處理後基於規定的方法1的算術平均粗糙度Ra&lt;sub&gt;1&lt;/sub&gt;之比（Ra&lt;sub&gt;2&lt;/sub&gt;/Ra&lt;sub&gt;1&lt;/sub&gt;）為0.40以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing an electronic device comprises: a step of preparing a structure (100) including an adhesive film (10) and an object to be processed (20), wherein the adhesive film (10) includes a substrate layer (A) and an adhesive resin layer (C), and the object to be processed (20) is temporarily fixed to the adhesive resin layer (C); and a step of processing the object to be processed (20) temporarily fixed to the adhesive resin layer (C), wherein the adhesive resin layer (C) comprises thermally expandable microspheres, and the ratio (Ra2/Ra1) of the arithmetic mean roughness Ra2 of the adhesive film (10) by a predetermined method 2 after a predetermined treatment to the arithmetic mean roughness Ra1 by a predetermined method 1 after a predetermined treatment is 0.40 or more.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:黏著性膜</p>  
        <p type="p">20:加工對象物</p>  
        <p type="p">30:支撐構件</p>  
        <p type="p">40:加工後的加工對象物</p>  
        <p type="p">100:結構體</p>  
        <p type="p">A:基材層</p>  
        <p type="p">C:黏著性樹脂層</p>  
        <p type="p">X1:步驟</p>  
        <p type="p">X2:步驟</p>  
        <p type="p">X3:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2103" publication-number="202613229"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613229.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613229</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136906</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08K7/22</main-classification>  
        <further-classification edition="200601120251201B">C09J11/06</further-classification>  
        <further-classification edition="200601120251201B">C09J11/08</further-classification>  
        <further-classification edition="200601120251201B">C09J133/08</further-classification>  
        <further-classification edition="201801120251201B">C09J7/25</further-classification>  
        <further-classification edition="201801120251201B">C09J7/29</further-classification>  
        <further-classification edition="201801120251201B">C09J7/38</further-classification>  
        <further-classification edition="200601120251201B">H01L21/02</further-classification>  
        <further-classification edition="200601120251201B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置的製造方法，包含：準備結構體（100）的步驟，所述結構體（100）包含黏著性膜（10）及加工對象物（20），所述黏著性膜（10）包括基材層（A）及黏著性樹脂層（C），所述加工對象物（20）暫時固定於所述黏著性樹脂層（C）；以及對暫時固定於所述黏著性樹脂層（C）的所述加工對象物（20）進行加工的步驟，所述黏著性樹脂層（C）包含熱膨脹性微小球，所述黏著性膜（10）的依照規定的方法觀察到的異物的數量小於10個。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing an electronic device includes: a step of preparing a structure (100), the structure (100) including an adhesive film (10) and an object to be processed (20), the adhesive film (10) including a substrate layer (A) and an adhesive resin layer (C), and the object to be processed (20) being temporarily fixed to the adhesive resin layer (C); and a step of processing the object to be processed (20) temporarily fixed to the adhesive resin layer (C). The adhesive resin layer (C) includes thermally expandable microspheres, and a number of foreign matter observed on the adhesive film (10) according to a prescribed method is less than 10.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:黏著性膜</p>  
        <p type="p">20:加工對象物</p>  
        <p type="p">30:支撐構件</p>  
        <p type="p">40:加工後的加工對象物</p>  
        <p type="p">100:結構體</p>  
        <p type="p">A:基材層</p>  
        <p type="p">C:黏著性樹脂層</p>  
        <p type="p">X1:步驟</p>  
        <p type="p">X2:步驟</p>  
        <p type="p">X3:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2104" publication-number="202614237"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614237.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614237</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136921</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H01L21/56</main-classification>  
        <further-classification edition="201801120251201B">C09J7/30</further-classification>  
        <further-classification edition="200601120251201B">C09J163/00</further-classification>  
        <further-classification edition="200601120251201B">B32B7/12</further-classification>  
        <further-classification edition="200601120251201B">B32B27/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置的製造方法，包含：準備結構體（100）的步驟，所述結構體（100）包含黏著性膜（10）、加工對象物（20）及支撐構件（30），所述黏著性膜（10）包括基材層（A）、黏著性樹脂層（B）、及黏著性樹脂層（C），所述加工對象物（20）暫時固定於所述黏著性樹脂層（B），所述支撐構件（30）暫時固定於所述黏著性樹脂層（C）；以及對暫時固定於所述黏著性樹脂層（B）的所述加工對象物（20）進行加工的步驟，所述基材層（A）位於所述黏著性樹脂層（B）與所述黏著性樹脂層（C）之間，所述黏著性樹脂層（C）包含熱膨脹性微小球，所述黏著性膜（10）的依照規定的方法觀察到的異物的數量小於10個。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing an electronic device includes: a step of preparing a structure (100), the structure (100) including an adhesive film (10), an object to be processed (20), and a support member (30), the adhesive film (10) including a substrate layer (A), an adhesive resin layer (B), and an adhesive resin layer (C), the object to be processed (20) being temporarily fixed to the adhesive resin layer (B), and the supporting member (30) being temporarily fixed to the adhesive resin layer (C); and a step of processing the object to be processed (20) temporarily fixed to the adhesive resin layer (B). The substrate layer (A) is located between the adhesive resin layer (B) and the adhesive resin layer (C), the adhesive resin layer (C) includes thermally expandable microspheres, and a number of foreign matter observed on the adhesive film (10) according to a prescribed method is less than 10.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:黏著性膜</p>  
        <p type="p">20:加工對象物</p>  
        <p type="p">30:支撐構件</p>  
        <p type="p">40:加工後的加工對象物</p>  
        <p type="p">100:結構體</p>  
        <p type="p">A:基材層</p>  
        <p type="p">B:黏著性樹脂層</p>  
        <p type="p">C:黏著性樹脂層</p>  
        <p type="p">Y1:步驟</p>  
        <p type="p">Y2:步驟</p>  
        <p type="p">Y3:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2105" publication-number="202614015"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614015.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614015</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136928</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>像素電路和顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251103B">G09G3/32</main-classification>  
        <further-classification edition="200601120251103B">G09G3/36</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商京東方科技集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOE TECHNOLOGY GROUP CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖丽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO, LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郑皓亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHENG, HAOLIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玄明花</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUAN, MINGHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>张晨阳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, CHENYANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭玉珍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, YUZHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>张星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, XING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔晓荣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CUI, XIAORONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高立鹏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, LIPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周影</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種像素電路和顯示裝置。像素電路包括像素驅動電路、N個發光元件和N個電流控制電路；N為大於1的整數；第一發光元件的第一極與驅動電流輸出端電性連接；第n發光元件的第二極和第n+1發光元件的第一極都與第n顯示節點電性連接，第N發光元件的第二極與第一電壓端電性連接；n為小於N的正整數；第n電流控制電路在顯示控制信號的控制下，控制向第n顯示節點提供第n控制電流。本揭露通過一個像素驅動電路驅動N個相互串聯的發光元件，實現驅動電流通路上像素驅動電路中的驅動電晶體和發光控制電晶體共用，降低功耗。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:像素驅動電路</p>  
        <p type="p">11:第一電流控制電路</p>  
        <p type="p">12:第二電流控制電路</p>  
        <p type="p">13:第三電流控制電路</p>  
        <p type="p">E1:第一發光元件</p>  
        <p type="p">E2:第二發光元件</p>  
        <p type="p">E3:第三發光元件</p>  
        <p type="p">E4:第四發光元件</p>  
        <p type="p">NX1,NX2,NX3:顯示節點</p>  
        <p type="p">OT:驅動電流輸出端</p>  
        <p type="p">SWP:顯示控制端</p>  
        <p type="p">V1:第一電壓端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2106" publication-number="202613230"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613230.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613230</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136934</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電子裝置的製造方法</chinese-title>  
        <english-title>METHOD FOR MANUFACTURING ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08K7/22</main-classification>  
        <further-classification edition="200601120251201B">C09J11/06</further-classification>  
        <further-classification edition="200601120251201B">C09J11/08</further-classification>  
        <further-classification edition="200601120251201B">C09J133/08</further-classification>  
        <further-classification edition="201801120251201B">C09J7/25</further-classification>  
        <further-classification edition="201801120251201B">C09J7/29</further-classification>  
        <further-classification edition="201801120251201B">C09J7/38</further-classification>  
        <further-classification edition="200601120251201B">H01L21/02</further-classification>  
        <further-classification edition="200601120251201B">H01L21/683</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三井化學艾喜緹瑪蒂莉亞股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUI CHEMICALS ICT MATERIA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>三浦徹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIURA, TORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種電子裝置的製造方法，包含：準備結構體（100）的步驟，所述結構體（100）包含黏著性膜（10）、加工對象物（20）及支撐構件（30），所述黏著性膜（10）包括基材層（A）、黏著性樹脂層（B）、及黏著性樹脂層（C），所述加工對象物（20）暫時固定於所述黏著性樹脂層（B），所述支撐構件（30）暫時固定於所述黏著性樹脂層（C）；以及對暫時固定於所述黏著性樹脂層（B）的所述加工對象物（20）進行加工的步驟，所述基材層（A）位於所述黏著性樹脂層（B）與所述黏著性樹脂層（C）之間，所述黏著性樹脂層（C）包含熱膨脹性微小球，所述黏著性膜（10）的、進行了規定的處理後基於規定的方法2的算術平均粗糙度Ra&lt;sub&gt;2&lt;/sub&gt;相對於進行了規定的處理後基於規定的方法1的算術平均粗糙度Ra&lt;sub&gt;1&lt;/sub&gt;之比（Ra&lt;sub&gt;2&lt;/sub&gt;/Ra&lt;sub&gt;1&lt;/sub&gt;）為0.40以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for manufacturing an electronic device comprises: a step of preparing a structure (100), wherein the structure (100) comprises an adhesive film (10), an object to be processed (20), and a support member (30), wherein the adhesive film (10) comprises a substrate layer (A), an adhesive resin layer (B), and an adhesive resin layer (C), wherein the object to be processed (20) is temporarily fixed to the adhesive resin layer (B), and the support member (30) temporarily fixed to the adhesive resin layer (C); and a step of processing the object to be processed (20) temporarily fixed to the adhesive resin layer (B), wherein the substrate layer (A) is located between the adhesive resin layer (B) and the adhesive resin layer (C), and the adhesive resin layer (C) contains thermally expandable microspheres, and wherein the ratio (Ra2/Ra1) of the arithmetic mean roughness Ra2 of the adhesive film (10) after a predetermined treatment based on a predetermined method 2 to the arithmetic mean roughness Ra1 after a predetermined treatment based on a predetermined method 1 is 0.40 or more.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:黏著性膜</p>  
        <p type="p">20:加工對象物</p>  
        <p type="p">30:支撐構件</p>  
        <p type="p">40:加工後的加工對象物</p>  
        <p type="p">100:結構體</p>  
        <p type="p">A:基材層</p>  
        <p type="p">B:黏著性樹脂層</p>  
        <p type="p">C:黏著性樹脂層</p>  
        <p type="p">Y1:步驟</p>  
        <p type="p">Y2:步驟</p>  
        <p type="p">Y3:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2107" publication-number="202614655"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614655.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614655</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136971</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用戶設備（UE）及使用人工智慧（AI）進行移動性檢測的方法</chinese-title>  
        <english-title>AN USER EQUIPMENT (UE) AND A METHOD FOR MOBILITY DETECTION USING ARTIFICIAL INTELLIGENCE (AI)</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251201B">H04W36/00</main-classification>  
        <further-classification edition="200901120251201B">H04W36/30</further-classification>  
        <further-classification edition="200901120251201B">H04W36/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴嘉星</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAI, CHIA-SHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾紹綸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, SHAO-LUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王韻豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YUN-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李建農</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JIAN-NONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李志宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHIH-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種用於使用AI進行用戶設備（UE）移動性預測的設備和方法。在一個新穎的方面，UE移動性預測是基於UE測量資料通過機器學習技術進行的。在一實施例中，UE獲取一組移動性相關資料，將該組移動性相關資料饋入到用於UE移動性預測的移動性AI模型中，以及，基於該移動性AI模型獲取UE移動性預測。在一實施例中，UE移動性預測是基於範圍的。在另一實施例中，兩個獨立的AI模型被應用，以在不同情況下預測UE移動性，例如在服務區域內和不在服務區域內。在一實施例中，UE從一個或多個UE應用獲取移動性回饋，並基於該移動性回饋對該移動性AI模型進行微調。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatus and methods are provided for UE mobility prediction with AI. In one novel aspect, UE mobility prediction is performed based on UE measurement data through machine learning techniques. In one embodiment, the UE obtains a set of mobility-related data, feeds the set of mobility-related data to a mobility AI model for UE mobility prediction and obtains a UE mobility prediction based on the mobility AI model. In one embodiment, the UE mobility prediction is range-based. In another embodiment, two independent AI models are applied to predict the UE mobility under different situations, such as in-service and out-of-service. In one embodiment, the UE obtains mobility feedback from one or more UE applications and performs fine turning for the mobility AI model based on the mobility feedback.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">501,502,503:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2108" publication-number="202614617"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614617.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614617</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114136987</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊編解碼方法和裝置</chinese-title>  
        <english-title>METHODS AND APPARATUS FOR VIDEO CODING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251201B">H04N19/186</main-classification>  
        <further-classification edition="201401120251201B">H04N19/159</further-classification>  
        <further-classification edition="201401120251201B">H04N19/176</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡佳銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHIA-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾馨儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSENG, HSIN-YI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江嫚書</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, MAN-SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐志瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種用於導出新合併列表的方法和裝置。根據該方法，與包含亮度分量和色度分量的當前塊相關聯的輸入資料被接收，其中，所述輸入資料包括編碼器端待編碼的像素資料或解碼器端待解碼的當前塊相關聯的資料。藉由將來自相同相鄰空間或時間位置或塊的亮度和色度幀內預測資訊聯合繼承到當前塊，一個或多個聯合幀內合併模式（UIM）候選被導出。一個或多個幀間預測候選被導出。藉由使用組合所述一個或多個UIM候選和所述一個或多個幀間預測候選而得到的一個或多個最終預測，當前塊使用所述一個或多個最終預測進行編碼或解碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method and apparatus of deriving a new merge list are disclosed. According to the method, input data associated with a current block comprising a luma component and a chroma component is received, wherein the input data comprise pixel data to be encoded at an encoder side or data associated with the current block to be decoded at a decoder side. One or more UIM (Unified Intra Mode) candidates are derived by inheriting luma and chroma intra prediction information jointly from same neighbouring spatial or temporal positions or blocks of the current block. One or more inter predictions candidates are derived. The current block is encoded or decoded by using one or more final predictions derived by combining said one or more UIM candidates and said one or more inter predictions candidates.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1910:步驟</p>  
        <p type="p">1920:步驟</p>  
        <p type="p">1930:步驟</p>  
        <p type="p">1940:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2109" publication-number="202613206"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613206.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613206</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137040</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>取代聚苯醚、含胺基之聚苯醚及熱硬化性聚苯醚</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08G65/48</main-classification>  
        <further-classification edition="200601120251201B">C08L71/12</further-classification>  
        <further-classification edition="200601120251201B">C08J5/00</further-classification>  
        <further-classification edition="200601120251201B">C08J5/24</further-classification>  
        <further-classification edition="200601120251201B">H05K1/03</further-classification>  
        <further-classification edition="200601120251201B">B01D53/22</further-classification>  
        <further-classification edition="200601120251201B">B01D71/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商旭化成股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野村一幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOMURA, KAZUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>川上太郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAKAMI, TARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種分子間或分子內之網絡形成能力提高之取代聚苯醚。本發明提供一種聚苯醚，其特徵在於至少包含(3)或式(4)所表示之構成成分。 &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="253px" width="218px" file="ed10058.JPG" alt="ed10058.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2110" publication-number="202613226"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613226.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613226</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137048</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電極合劑用前驅物、電極合劑、電極合劑片材、電池用電極、及二次電池</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">C08K3/04</main-classification>  
        <further-classification edition="200601120251201B">C08L27/18</further-classification>  
        <further-classification edition="200601120251201B">C08J5/18</further-classification>  
        <further-classification edition="201001120251201B">H01M4/1393</further-classification>  
        <further-classification edition="201001120251201B">H01M4/587</further-classification>  
        <further-classification edition="200601120251201B">H01M4/62</further-classification>  
        <further-classification edition="201001120251201B">H01M10/05</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱鉛筆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI PENCIL COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新井啓之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAI, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玉置隆成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMAKI, RYUSEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑞賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的係提供一種可獲得能兼顧PTFE之原纖化狀態及高分散性之電極合劑的電極合劑用前驅物、及使用其之電極合劑、電極合劑片材、電池用電極、二次電池。 &lt;br/&gt;本發明係事先混煉PTFE及電極活性物質，製作PTFE為高濃度且為適於片材化之原纖化狀態的電極合劑用前驅物30。接著，對該電極合劑用前驅物30追加電極活性物質，製成所需之電極合劑40。因此，能夠在維持適於片材化之原纖化之狀態的同時，使PTFE均質地分散。藉此，可製作強度及柔軟性高之電極合劑片材50。並且，電極活性物質不均的狀況較少，可高良率地製造具均質特性之電極合劑片材50、電池用電極80、二次電池100。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:電極合劑用前驅物</p>  
        <p type="p">40:電極合劑</p>  
        <p type="p">50:電極合劑片材</p>  
        <p type="p">80:電池用電極</p>  
        <p type="p">100:二次電池</p>  
        <p type="p">S102:前驅物混煉步驟</p>  
        <p type="p">S104:電極合劑混煉步驟</p>  
        <p type="p">S106:片材化步驟</p>  
        <p type="p">S108:電極化步驟</p>  
        <p type="p">S110:電池化步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2111" publication-number="202613178"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613178.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613178</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137057</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗CLL-1的奈米抗體及其應用</chinese-title>  
        <english-title>ANTI-CLL-1 NANOANTIBODIES AND APPLICATIONS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251103B">C07K16/28</main-classification>  
        <further-classification edition="200601120251103B">C07K14/705</further-classification>  
        <further-classification edition="200601120251103B">A61K39/395</further-classification>  
        <further-classification edition="200601120251103B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商杭州百誠醫藥科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANGZHOU BIO-SINCERITY PHARMA-TECH CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱梓焱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, ZIYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卜瑞紅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BU, RUIHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丁銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DING, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田孟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, MENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黨蘊琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DANG, YUNQI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>任杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REN, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫夢召</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, MENGZHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>程璐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳佳璐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIALU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>溫清霞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WEN, QINGXIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳璟純</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JINGCHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐研</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, YAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王江海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, JIANGHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>苗雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIAO, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樓金芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOU, JINFANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡嘉慧</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種特異性結合CLL‑1的抗體或其抗原結合片段、多特異性抗原結合分子、嵌合抗原受體、免疫效應細胞、核酸片段、載體、宿主細胞、藥物組合物、套組、製備方法及其在治療疾病以及檢測CLL‑1中的應用。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides an antibody or an antigen-binding fragment thereof that specifically binds to CLL-1, as well as multispecific antigen-binding molecules, chimeric antigen receptors, immune effector cells, nucleic acid fragments, vectors, host cells, pharmaceutical compositions, and kits. Also provided are methods for preparing the foregoing and their use in the treatment of diseases and in the detection of CLL-1.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2112" publication-number="202613469"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613469.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613469</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137071</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>冷媒循環裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202101120251015B">F25B41/40</main-classification>  
        <further-classification edition="200601120251015B">F28F9/26</further-classification>  
        <further-classification edition="200601120251015B">G06F1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIDEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡慶次鋭彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKESHI, TOSHIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上拓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, TAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許志銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容之一態樣之冷媒循環裝置具備：殼體、一次流路、二次流路、熱交換器、及排出路徑。一次流路收容於殼體，且將設置於殼體之一次流入口與一次流出口接合。二次流路收容於殼體，且將設置於殼體之二次流入口與二次流出口接合。熱交換器收容於殼體，且連接於一次流路及二次流路。排出路徑收容於殼體，且將設置於殼體之排出口與一次流路或二次流路接合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:一次流路</p>  
        <p type="p">2:二次流路</p>  
        <p type="p">3:熱交換器</p>  
        <p type="p">5:儲槽</p>  
        <p type="p">6:控制單元</p>  
        <p type="p">9:殼體</p>  
        <p type="p">10:排出口</p>  
        <p type="p">11:主流路</p>  
        <p type="p">12:排出路徑</p>  
        <p type="p">21:主流路</p>  
        <p type="p">22:供給流路</p>  
        <p type="p">23:第一流路</p>  
        <p type="p">24:第二流路</p>  
        <p type="p">25:第三流路</p>  
        <p type="p">90:收容區域</p>  
        <p type="p">91:面</p>  
        <p type="p">91A:一次流入口</p>  
        <p type="p">91B:一次流出口</p>  
        <p type="p">92:面</p>  
        <p type="p">92A:二次流入口</p>  
        <p type="p">92B:二次流出口</p>  
        <p type="p">93:面</p>  
        <p type="p">94:面</p>  
        <p type="p">100:CDU</p>  
        <p type="p">101:第一排出口</p>  
        <p type="p">102:第二排出口</p>  
        <p type="p">111:壓力感測器</p>  
        <p type="p">112:溫度感測器</p>  
        <p type="p">113:閥</p>  
        <p type="p">114:流量感測器</p>  
        <p type="p">115:溫度感測器</p>  
        <p type="p">116:壓力感測器</p>  
        <p type="p">121:第一排出路徑</p>  
        <p type="p">122:第二排出路徑</p>  
        <p type="p">211:壓力感測器</p>  
        <p type="p">212:溫度感測器</p>  
        <p type="p">213:流量感測器</p>  
        <p type="p">214:溫度感測器</p>  
        <p type="p">215:壓力感測器</p>  
        <p type="p">231:泵</p>  
        <p type="p">232:止回閥</p>  
        <p type="p">241:泵</p>  
        <p type="p">242:止回閥</p>  
        <p type="p">251:泵</p>  
        <p type="p">252:止回閥</p>  
        <p type="p">X:軸</p>  
        <p type="p">Y:軸</p>  
        <p type="p">Z:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2113" publication-number="202614818"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614818.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614818</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137101</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於列的可撓性混合奈米片標準單元構造</chinese-title>  
        <english-title>ROW-BASED FLEXIBLE HYBRID NANOSHEET STANDARD CELL CONSTRUCTION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251230B">H10D30/60</main-classification>  
        <further-classification edition="202501120251230B">H10D84/80</further-classification>  
        <further-classification edition="202501120251230B">H10D88/00</further-classification>  
        <further-classification edition="200601120251230B">H01L23/522</further-classification>  
        <further-classification edition="200601120251230B">H01L23/528</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿爾普特金　埃姆雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALPTEKIN, EMRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>苗欣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIAO, XIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉格凡　普瑞文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAGHAVAN, PRAVEEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉門尼喬格魯　蘇克魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEMENICIOGLU, SUKRU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示與形成在一基材上的奈米片電晶體的使用有關的各種實施方案。一種奈米片電晶體包括具有一寬度的一主動區域，該寬度界定該電晶體的一主動裝置寬度。揭示包括與固定寬度電網路由對準的不同單元高度（例如，高單元及矮單元）的混合單元結構。該等電網路由的該固定寬度取決於該下層單元的該尺寸而為該等電網路由之間的信號路由間距的變化提供間距。此等結構為邏輯區塊中的一分區層級上的高單元對矮單元比率提供彈性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various implementations related to the use of nanosheet transistors formed on a substrate are disclosed. A nanosheet transistor includes an active region with a width that defines an active device width for the transistor. Hybrid cell structures are disclosed that include varying cell heights (e.g., tall and short cells) aligned with fixed width power grid routes. The fixed width of the power grid routes provides spacings for variations of signal route spacing between the power grid routes depending on the size of the underlying cell. These structures provide flexibility for tall to short cell ratios on a partition level in logic blocks.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">710:高單元</p>  
        <p type="p">720:矮單元</p>  
        <p type="p">730:電力網格路由</p>  
        <p type="p">1000:行</p>  
        <p type="p">1010:電晶體區域</p>  
        <p type="p">1012A:主動區域</p>  
        <p type="p">1012B:主動區域</p>  
        <p type="p">1014A:主動區域</p>  
        <p type="p">1014B:主動區域</p>  
        <p type="p">1020:第一金屬佈線層</p>  
        <p type="p">1022A至1022F:信號路由</p>  
        <p type="p">1024:節距</p>  
        <p type="p">1026A至1026E:信號路由</p>  
        <p type="p">1028:節距</p>  
        <p type="p">1030:第二金屬佈線層</p>  
        <p type="p">1032A至1032H:信號路由</p>  
        <p type="p">1034:節距</p>  
        <p type="p">1036A至1036F:信號路由</p>  
        <p type="p">1038:節距</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2114" publication-number="202612580"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612580.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612580</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137123</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聯合收割機</chinese-title>  
        <english-title>COMBINE HARVESTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251023B">A01D41/12</main-classification>  
        <further-classification edition="200601120251023B">A01D69/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商井關農機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISEKI &amp; CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山田幹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMADA, MIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>五島一実</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, KAZUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上村孝彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEMURA, TAKAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥村和哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUMURA, KAZUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李元戎</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種變速器23，係以下述構成抑制針對收割裝置4的輸出的傳輸損失地進行傳遞：將引擎22的輸出旋轉從無級變速裝置20的輸出軸24經由變速器23的輸入軸25傳輸至變速器23的第一軸29、第二軸32及第三軸26；第一軸29係設置：第一齒輪30，係常態地與輸入軸25的齒輪27嚙合；第二齒輪43；以及離合器48，係於第一齒輪30與第二齒輪43之間與第一軸29一體旋轉；第二軸32係設置：第三齒輪46，係常態地與第一齒輪30嚙合；第四齒輪45，係常態地與第二齒輪43嚙合；以及第五齒輪47，係將旋轉傳輸至第三軸26；於第一齒輪30設置：卡合部50，係與離合器48的卡合部48A卡合；於第二齒輪43設置：卡合部51，係與離合器48的卡合部48B卡合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A transmission 23 is provided, which is configured to transmit output to the harvesting device 4 while suppressing transmission loss. The rotational output of the engine 22 is transmitted from the output shaft 24 of the continuously variable transmission 20 to the first shaft 29, the second shaft 32 and the third shaft 26 of the transmission 23 via the input shaft 25 of the transmission 23. The first shaft 29 is provided with: the first gear 30, which is constantly meshed with the gear 27 of the input shaft 25; the second gear 43; and the clutch 48, which is configured to rotate integrally with the first shaft 29 between the first gear 30 and the second gear 43. The second shaft 32 is provided with: the third gear 46, which is constantly meshed with the first gear 30; the fourth gear 45, which is constantly meshed with the second gear 43; and the fifth gear 47, which transmits rotation to the third shaft 26. The first gear 30 is provided with the engaging portion 50 configured to engage with the engaging portion 48A of the clutch 48; and the second gear 43 is provided with the engaging portion 51 configured to engage with the engaging portion 48B of the clutch 48.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:油壓式無級變速裝置(無級變速裝置)</p>  
        <p type="p">21:變速箱體</p>  
        <p type="p">22:引擎</p>  
        <p type="p">22A,25:輸入軸</p>  
        <p type="p">24:輸出軸</p>  
        <p type="p">26:第三軸</p>  
        <p type="p">27:輸出齒輪(齒輪)</p>  
        <p type="p">29:第一軸</p>  
        <p type="p">30:第一齒輪</p>  
        <p type="p">31:收割輸出滑輪</p>  
        <p type="p">32:第二軸</p>  
        <p type="p">40:輪軸</p>  
        <p type="p">43:第二齒輪</p>  
        <p type="p">45:第四齒輪</p>  
        <p type="p">46:第三齒輪</p>  
        <p type="p">47:第五齒輪</p>  
        <p type="p">48:離合器</p>  
        <p type="p">48A,48B,50,51:卡合部</p>  
        <p type="p">69:左壁</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2115" publication-number="202613327"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613327.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613327</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137179</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導電性組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251111B">C22C13/02</main-classification>  
        <further-classification edition="200601120251111B">C22C5/08</further-classification>  
        <further-classification edition="200601120251111B">C09J163/04</further-classification>  
        <further-classification edition="200601120251111B">C09J163/02</further-classification>  
        <further-classification edition="200601120251111B">H01B1/22</further-classification>  
        <further-classification edition="200601120251111B">C07C275/04</further-classification>  
        <further-classification edition="200601120251111B">H01B5/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商拓自達電線股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TATSUTA ELECTRIC WIRE &amp; CABLE CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中園元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAZONO, HAJIME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>津田剛志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUDA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>天本修平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMAMOTO, SYUHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的課題在於提供一種導電性及接合性優異的導電性組成物。一種導電性組成物，包含金屬粒子、環氧樹脂、硬化劑及硬化促進劑，所述金屬粒子包含：第一金屬粒子，含有熔點為800℃以上的高熔點金屬；以及第二金屬粒子，含有熔點為240℃以下的低熔點金屬，所述硬化促進劑為脲系化合物及磷系化合物中的至少一種。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2116" publication-number="202614830"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614830.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614830</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137210</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光感測裝置</chinese-title>  
        <english-title>LIGHT DETECING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251110B">H10D62/10</main-classification>  
        <further-classification edition="202501120251110B">H10D64/20</further-classification>  
        <further-classification edition="202501120251110B">H10D62/60</further-classification>  
        <further-classification edition="202501120251110B">H10H20/85</further-classification>  
        <further-classification edition="200601120251110B">H01L23/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>富采光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENNOSTAR CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳韋龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WEI-LONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳義宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, I-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡長達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAI, CHANG-DA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃炤舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHAO-SHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇初日</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHU-JIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>言紹榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, SHAO-LUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光感測裝置，其包括第一半導體層、位於第一半導體層上的吸收層、位於吸收層上的第二半導體層、位於第二半導體層上的濾光結構、形成於濾光結構中的開口，以及設置於濾光結構上的電極結構。電極結構透過開口連接於第二半導體層。濾光結構包括相互堆疊的複數第一層及複數第二層，並且複數第一層包括最上第一層。最上第一層具有第一折射率，並且複數第二層中的一層具有大於第一折射率的第二折射率。最上第一層位於電極結構與複數第二層之間且直接接觸電極結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A light detecting device includes a first semiconductor layer, an absorption layer located on the first semiconductor layer, a second semiconductor layer located on the absorption layer, a filter structure located on the second semiconductor layer, an opening formed in the filter structure, and an electrode structure disposed on the filter structure. The electrode structure connects the second semiconductor layer through the opening. The filter structure includes a plurality of first layers and a plurality of second layers which are alternately stacked. The plurality of the first layers includes an uppermost first layer with a first refractive index, and one of the plurality of second layers has a second refractive index larger than the first refractive index. The uppermost first layer is located between the electrode structure and the plurality of second layers and directly contacts the electrode structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基底</p>  
        <p type="p">100a:光感測裝置</p>  
        <p type="p">20:半導體疊層</p>  
        <p type="p">200:發光裝置</p>  
        <p type="p">21:第一半導體層</p>  
        <p type="p">22:第二半導體層</p>  
        <p type="p">221:第一摻雜區</p>  
        <p type="p">222:第二摻雜區</p>  
        <p type="p">23:吸收層</p>  
        <p type="p">231:第三摻雜區</p>  
        <p type="p">232:未摻雜區</p>  
        <p type="p">30:濾波結構</p>  
        <p type="p">40:第一電極結構</p>  
        <p type="p">41:電極墊部</p>  
        <p type="p">42:延伸部</p>  
        <p type="p">49:第二電極結構</p>  
        <p type="p">50:鈍化層</p>  
        <p type="p">60:第一接觸結構</p>  
        <p type="p">70:抗反射層</p>  
        <p type="p">80:導電層</p>  
        <p type="p">99:入射光</p>  
        <p type="p">B:區域</p>  
        <p type="p">D1:擴散深度</p>  
        <p type="p">O1:第一開口</p>  
        <p type="p">O2:第二開口</p>  
        <p type="p">W1:第一寬度</p>  
        <p type="p">W3:第三寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2117" publication-number="202614614"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614614.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614614</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137244</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>影片編碼、解碼方法及其電子裝置</chinese-title>  
        <english-title>VIDEO CODING METHOD AND ELECTRONIC APPARATUS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251201B">H04N19/117</main-classification>  
        <further-classification edition="201401120251201B">H04N19/119</further-classification>  
        <further-classification edition="201401120251201B">H04N19/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聯發科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEDIATEK INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭裕霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, YU-LING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱世鈞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, SHIH-CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林郁晟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐志瑋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, CHIH-WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳慶曄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-YEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊子德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, TZU-DER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳渏紋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, YI-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃毓文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種基於以訊號傳送和推斷的語法元素執行自適應環路濾波器（ALF）運算的方法。一個影片編解碼器接收要編碼或解碼的資料作為影片的當前圖片的當前塊的像素。該影片編解碼器以訊號傳送或接收與ALF運算相關且適用於包含該當前塊的複數塊的片級語法元素（slice-level syntax element）。該影片編解碼器基於一個或多個基於該片級語法元素推斷的參數，對該當前塊的重建樣本執行ALF運算。至少一個與ALF運算相關的塊級語法元素（block-level syntax element）可能是基於該片級語法元素推斷的，且不是以訊號傳送的。該影片編解碼器基於該ALF運算濾波之樣本對塊進行編碼或解碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for performing adaptive loop filter (ALF) operations based on signaled and inferred syntax elements is provided. A video coder receives data to be encoded or decoded as a current block of pixels of a current picture of a video. The video coder signals or receives a slice-level syntax element related to adaptive loop filter (ALF) operations and applicable to blocks of the slice including the current block. The video coder performs ALF operations on reconstructed samples of the current block based on one or more parameters that are inferred based on the slice-level syntax element. At least one block-level syntax element related to ALF operations may be inferred and not signaled based on the slice-level syntax element. The video coder encodes or decodes a block based on the samples filtered by the ALF operations.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1500:電子設備執行過程</p>  
        <p type="p">1510~1540:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2118" publication-number="202613454"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613454.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613454</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137333</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>照明器具</chinese-title>  
        <english-title>LIGHTING FIXTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251128B">F21V19/02</main-classification>  
        <further-classification edition="200601120251128B">F21V21/26</further-classification>  
        <further-classification edition="200601120251128B">F21V31/03</further-classification>  
        <further-classification edition="201601120251128B">F21S2/00</further-classification>  
        <further-classification edition="201601320251128B">F21Y115/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商小泉照明股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOIZUMI LIGHTING TECHNOLOGY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤本佳史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIMOTO, YOSHIFUMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>時渝恒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺南市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種照明器具，本發明的課題在於不損害美觀地進一步提高照明器具中的通氣防水部的配置的自由度。本發明的一方式所涉及的照明器具（1）具備：器具主體（10），其具備筒狀的殼體（11），且從所述殼體（11）的第一端部（112）射出光；支承構件（20），其對所述器具主體（10）進行支承；以及通氣防水部（13），其具有通氣性和防水性，所述通氣防水部（13）安裝於通氣防水部安裝部（115），且進行所述殼體（11）的內側與外側之間的通氣和防水，所述通氣防水部安裝部（115）設置於所述殼體（11）中的與所述第一端部（112）相反的一側的第二端部（113）的外表面（114）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a lighting fixture. The objective of the invention is to further enhance the flexibility in arranging the ventilation and waterproofing portion of the lighting fixture without impairing its aesthetic appearance. According to one embodiment, the lighting fixture (1) comprises: a device body (10) including a cylindrical housing (11), from which light is emitted through a first end (112) of the housing (11); a supporting member (20) that supports the device body (10); and a ventilation and waterproofing portion (13) having both air permeability and water resistance. The ventilation and waterproofing portion (13) is mounted on a ventilation and waterproofing mounting portion (115), and performs ventilation and waterproofing between the inside and outside of the housing (11). The ventilation and waterproofing mounting portion (115) is provided on an outer surface (114) of a second end (113) of the housing (11), the second end (113) being opposite to the first end (112).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:照明器具</p>  
        <p type="p">10:器具主體</p>  
        <p type="p">11:殼體</p>  
        <p type="p">110:第二臂</p>  
        <p type="p">112:第一端部</p>  
        <p type="p">114:外表面</p>  
        <p type="p">115:通氣防水部安裝部(凹部)</p>  
        <p type="p">119:螺釘</p>  
        <p type="p">12:玻璃面板</p>  
        <p type="p">13:通氣防水部(呼吸器)</p>  
        <p type="p">20:支承構件(第一臂)</p>  
        <p type="p">30:安裝部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2119" publication-number="202614548"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614548.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614548</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137374</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>諧振轉換器</chinese-title>  
        <english-title>RESONANT CONVERTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">H02M3/04</main-classification>  
        <further-classification edition="200601120251201B">H02M3/335</further-classification>  
        <further-classification edition="200601120251201B">H02M1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>台達電子工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DELTA ELECTRONICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普坎　里彭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHUKAN, RIPUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳學儒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HSUEH-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>包　彼得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BARBOSA, PETER MANTOVANELLI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張博翊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, BOYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李秋成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曾國軒</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案提供一種諧振轉換器，包含初級電路、集成變壓器、次級電路、局部接地、第一Y電容以及第二Y電容。初級電路包含第一正極線及第一負極線。集成變壓器與初級電路電連接。次級電路與集成變壓器電連接，且包含第二正極線及第二負極線。第一Y電容係與局部接地及初級電路的第一正極線或第一負極線耦接。第二Y電容係與局部接地及次級電路的第二正極線或第二負極線耦接。第一Y電容、第二Y電容及局部接地架構於在初級電路與次級電路之間循環共模雜訊電流。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resonant converter is provided. The resonant converter includes a primary circuit, an integrated transformer, a secondary circuit, a local ground, a first Y capacitor and a second Y capacitor. The primary circuit has a first positive line and a first negative line. The integrated transformer is electrically connected to the primary circuit. The secondary circuit is electrically connected to the integrated transformer, and has a second positive line and a second negative line. The first Y capacitor is coupled between the local ground and the first positive line or the first negative line of the primary circuit. The second Y capacitor is coupled between the local ground and the second positive line or the second negative line of the secondary circuit. The first Y capacitor, the second Y capacitor and the local ground are configured to circulate common mode noise currents between the primary circuit and the secondary circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:集成變壓器</p>  
        <p type="p">2:初級電路</p>  
        <p type="p">3:次級電路</p>  
        <p type="p">5:控制器</p>  
        <p type="p">100:諧振轉換器</p>  
        <p type="p">101:散熱器</p>  
        <p type="p">102:局部接地</p>  
        <p type="p">103:機殼接地</p>  
        <p type="p">CP1、CP2、CP3、CP4、CP5、CP6:寄生電容</p>  
        <p type="p">CY1、CY2、CY3、CY4:Y電容</p>  
        <p type="p">Io:輸出電流</p>  
        <p type="p">Q1、Q2、Q3、Q4:初級開關</p>  
        <p type="p">Q5、Q6、Q7、Q8:次級開關</p>  
        <p type="p">Vin:輸入電壓</p>  
        <p type="p">Vo:輸出電壓</p>  
        <p type="p">Vp:初級電壓</p>  
        <p type="p">Vs:次級電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2120" publication-number="202613505"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613505.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613505</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137434</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>環境光感測器</chinese-title>  
        <english-title>AMBIENT LIGHT SENSOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">G01J3/36</main-classification>  
        <further-classification edition="202501120251222B">H10F77/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>昇佳電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SENSORTEK TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林裕閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YU-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秀玫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡依庭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種環境光感測器，其包含至少三個主通道感測單元及至少一個協作通道感測單元。各該主通道感測單元包含一濾波器及一感光元件，該濾波器設置於該感光元件的收光路徑上，其中包含一個主通道感測單元的濾波器為吸收式濾波器。各該協作通道感測單元包含一濾波器及一感光元件，該濾波器設置於該感光元件的收光路徑上，其中包含一個協作通道感測單元的濾波器為干涉濾波器。藉此，可有效控制受製程變異影響之環境光感測器產品的頻譜還原結果誤差範圍，以提升產品良率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An ambient light sensor comprising at least three main channel sensing units and at least one cooperative channel sensing unit. Each main channel sensing unit includes a filter and a photosensitive element, with the filter positioned on the light receiving path of the photosensitive element, wherein the filter of one main channel sensing unit is an absorptive filter. Each cooperative channel sensing unit includes a filter and a photosensitive element, with the filter positioned on the light receiving path of the photosensitive element, wherein the filter of one cooperative channel sensing unit is an interference filter. This configuration effectively controls the error range of spectral restoration results in ambient light sensor products affected by process variations, thereby improving product yield.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:主通道感測單元</p>  
        <p type="p">11:濾波器</p>  
        <p type="p">12:感光元件</p>  
        <p type="p">13:紅外光遮光層</p>  
        <p type="p">2:協作通道感測單元</p>  
        <p type="p">21:濾波器</p>  
        <p type="p">22:感光元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2121" publication-number="202613627"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613627.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613627</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114137632</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>複合光導光學元件的製造方法及光學結構</chinese-title>  
        <english-title>METHOD OF FABRICATION OF COMPOUND LIGHT-GUIDE OPTICAL ELEMENTS, AND OPTICAL STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G02B6/13</main-classification>  
        <further-classification edition="200601120251229B">G02B6/122</further-classification>  
        <further-classification edition="200601120251229B">G02B27/01</further-classification>  
        <further-classification edition="200601120251229B">G02B17/00</further-classification>  
        <further-classification edition="200601120251229B">G02B6/00</further-classification>  
        <further-classification edition="200601120251229B">B29D11/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商魯姆斯有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUMUS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格拉巴尼克　希蒙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRABARNIK, SHIMON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾森菲爾德　齊翁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EISENFELD, TSION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了一種製造複合光導光學元件（Light-guide Optical Element, LOE）的方法。將多個LOE前體和在多個LOE前體之間交替的多個透明間隔板的接合的堆疊接合至具有多個相互平行的成傾斜角度的內表面的第一光學塊。將該塊接合至堆疊，使得塊的第一多個部分反射內表面不平行於LOE前體的內表面。在接合之後，由此形成第二光學。通過貫穿至少兩個連續間隔板對第二塊進行切割來從第二光學塊切出至少一個複合LOE，至少兩個連續間隔板之間夾有LOE前體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">12:平面</p>  
        <p type="p">15:堆疊</p>  
        <p type="p">16:光學塊</p>  
        <p type="p">18:光學塊</p>  
        <p type="p">2’:LOE前體</p>  
        <p type="p">5:小平面</p>  
        <p type="p">6:表面</p>  
        <p type="p">7:透明間隔板</p>  
        <p type="p">8a、10b:面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2122" publication-number="202612935"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612935.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612935</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114138044</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>支撐腳組件、支撐腳伸縮機構及載具</chinese-title>  
        <english-title>SUPPORTING LEG ASSEMBLY, SUPPORTING LEG TELESCOPIC MECHANISM AND CARRIER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">B60N2/28</main-classification>  
        <further-classification edition="201801120251224B">B60N2/90</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫小龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MO, XIAOLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張錕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李如意</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, RUYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開了一種支撐腳組件包括：指示器，設置在所述指示端部，能在第一位置與第二位置之間移動，從而指示所述支撐腳是否接觸一表面；驅動件，能移動地設置在所述接觸端部中；牽引件，包括連接到所述指示器的牽引件第一端，和連接到所述接觸端部的牽引件第二端；保持套，套設在所述牽引件上，且阻止所述牽引件的至少一部分彎曲；當所述接觸端部接觸所述表面時，所述驅動件驅使所述牽引件相對於所述保持套滑動，所述牽引件進而帶動所述指示器。本申請還公開了一種支撐腳和一種載具。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure discloses a supporting leg assembly, which includes: an indicator, disposed at an indicating end and capable of moving between a first position and a second position, so as to indicate whether the supporting leg contacts a surface; a driving element, movably disposed in the contacting end; a traction element, including a first end of the traction element connected to the indicator and a second end of the traction element connected to the contacting end; a holding sleeve, sleeved on the traction element and prevents at least a part of the traction element from bending; when the contacting end contacts the surface, the driving element driving the traction element to slide relative to the holding sleeve, and the traction element further driving the indicator. The present disclosure also discloses a supporting leg and a carrier.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:支撐腳</p>  
        <p type="p">101:第一管件</p>  
        <p type="p">101b:調節裝置</p>  
        <p type="p">102:第二管件</p>  
        <p type="p">110:指示器</p>  
        <p type="p">130:驅動件</p>  
        <p type="p">131:接觸部</p>  
        <p type="p">132:柱孔</p>  
        <p type="p">133:第二容置部</p>  
        <p type="p">135:肩部</p>  
        <p type="p">140:固定座</p>  
        <p type="p">141:立柱</p>  
        <p type="p">150:牽引件</p>  
        <p type="p">151:牽引件第一端</p>  
        <p type="p">152:牽引件第二端</p>  
        <p type="p">155:牽引件套</p>  
        <p type="p">155a:牽引件套第一端</p>  
        <p type="p">155b:牽引件套第二端</p>  
        <p type="p">156:保持套</p>  
        <p type="p">156a:保持套第一端</p>  
        <p type="p">156b:保持套第二端</p>  
        <p type="p">170:支架</p>  
        <p type="p">183:第二彈性件</p>  
        <p type="p">184:第二螺絲</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2123" publication-number="202613731"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613731.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613731</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140184</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於製造波導主光柵壓印工具的方法及製造波導的方法</chinese-title>  
        <english-title>METHOD FOR FABRICATING A WAVEGUIDE MASTER GRATING IMPRINT TOOL, AND METHOD TO FABRICATE A WAVEGUIDE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">G03F7/20</main-classification>  
        <further-classification edition="200601120251217B">G02B5/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商史奈普公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SNAP INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅森　史蒂芬保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASON, STEPHEN PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種用於製造波導主光柵壓印工具之方法。該方法包括：用至少一個光阻層塗佈一基板；將一第一繞射光柵主輪廓選擇性地曝光至該至少一個光阻層的一第一區域上；將一第二繞射光柵主輪廓選擇性地曝光至該至少一個光阻層的一第二區域上；以及處理該基板，以形成該第一繞射光柵主輪廓及該第二繞射光柵主輪廓。該第一繞射光柵輪廓及該第二繞射光柵輪廓中之每一者包括在該基板與該個別光柵輪廓之間的邊緣，其中該邊緣大致上垂直於該基板表面，並且該等邊緣之每一者的高度與該第一繞射光柵主輪廓及該第二繞射光柵主輪廓的最大深度大致相同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided a method for fabricating a waveguide master grating imprint tool. The method comprises: coating a substrate with at least one photoresist layer; selectively exposing a first diffraction grating master profile onto a first area of the at least one photoresist layer; selectively exposing a second diffraction grating master profile onto a second area of the at least one photoresist layer; and processing the substrate to form the first diffraction grating master profile and the second diffraction grating master profile. Each of the first diffraction grating profile and the second diffraction grating profile comprises an edge between the substrate and the respective grating profile that is substantially perpendicular to the substrate surface and each of the edges is substantially the same height as a maximum depth of the first diffraction grating master profile and the second diffraction grating master profile.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">130:第一光柵輪廓</p>  
        <p type="p">135:第二光柵輪廓</p>  
        <p type="p">140:UV可硬化聚合物層</p>  
        <p type="p">145:第一外玻璃層</p>  
        <p type="p">150:介電塗層</p>  
        <p type="p">155:介電塗層</p>  
        <p type="p">160:層壓層</p>  
        <p type="p">165:第二外玻璃層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2124" publication-number="202613355"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613355.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613355</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140357</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置、電漿生成裝置、基板處理方法、半導體裝置之製造方法、電漿生成方法及程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C23C16/455</main-classification>  
        <further-classification edition="200601120251229B">H01J37/32</further-classification>  
        <further-classification edition="200601120251229B">H01L21/677</further-classification>  
        <further-classification edition="200601120251229B">G05B19/418</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商國際電氣股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹田剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEDA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>原大介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARA, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供可減低對複數基板之基板處理性能之偏差的技術。本發明提供之技術，係具備：具有處理基板之處理室與形成電漿之緩衝室的反應管；及加熱反應管之加熱裝置；於緩衝室具備：施加高頻電力且長度相異之至少2根的施加電極；賦予基準電位之基準電極；及保護施加電極與基準電極之電極保護管。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">249b:噴嘴</p>  
        <p type="p">269,271:棒狀電極(施加電極)</p>  
        <p type="p">270:棒狀電極(基準電極)</p>  
        <p type="p">275:電極保護管</p>  
        <p type="p">300:緩衝構造</p>  
        <p type="p">302,304,306:氣體供給口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2125" publication-number="202613689"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613689.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613689</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140612</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於產生一液晶裝置之方法、包含液晶材料之裝置以及撓性偏振器組件</chinese-title>  
        <english-title>A METHOD OF PRODUCING A LIQUID CRYSTAL DEVICE, A DEVICE COMPRISING LIQUID CRYSTAL MATERIAL AND A FLEXIBLE POLARISER COMPONENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G02F1/1335</main-classification>  
        <further-classification edition="200601120260102B">G02F1/1333</further-classification>  
        <further-classification edition="200601120260102B">G02F1/1347</further-classification>  
        <further-classification edition="200601120260102B">G02F1/1341</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商弗萊克英納寶技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FLEXENABLE TECHNOLOGY LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈汀　馬修　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARDING, MATTHEW JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係揭露一用於產生一液晶裝置之技術，其包含：提供一包含被直接含容於一偏振器組件與一第一控制組件之間的一液晶材料之總成，該第一控制組件包括一用於界定電控制電路之層堆積體；及將進一步的液晶材料直接含容於該總成的該偏振器組件與另一控制組件之間，該另一控制組件包括另一用於界定電控制電路之層堆積體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A technique of producing a liquid crystal device, comprising: providing an assembly comprising a liquid crystal material contained directly between a polariser component and a first control component including a stack of layers defining electrical control circuitry; and containing further liquid crystal material directly between said polariser component of said assembly and another control component including another stack of layers defining electrical control circuitry.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1,18:支撐基材</p>  
        <p type="p">2,20:層堆積體</p>  
        <p type="p">4:色濾器陣列</p>  
        <p type="p">6,16,22:對準塗覆物</p>  
        <p type="p">8:偏振器元件</p>  
        <p type="p">10,12:塑膠保護膜</p>  
        <p type="p">14:對準塗覆物/雙側黏劑單元</p>  
        <p type="p">24:LC材料/液晶材料</p>  
        <p type="p">C:第二背平面組件</p>  
        <p type="p">D:第一LC胞元總成</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2126" publication-number="202612743"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612743.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612743</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114140857</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗體-藥物結合物之用途</chinese-title>  
        <english-title>USE OF ANTIBODY-DRUG CONJUGATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201701120260102B">A61K47/68</main-classification>  
        <further-classification edition="200601120260102B">C07K16/32</further-classification>  
        <further-classification edition="200601120260102B">C07D491/22</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商第一三共股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAIICHI SANKYO COMPANY, LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內藤博之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAITO, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>扇谷祐輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OGITANI, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>益田剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASUDA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中田隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKADA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉田昌生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOSHIDA, MASAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘆田真二</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASHIDA, SHINJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>森田浩司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MORITA, KOJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮崎秀樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYAZAKI, HIDEKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>粕谷裕司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KASUYA, YUJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>早川市郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYAKAWA, ICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿部有生</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ABE, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王彥評</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種製造抗體-藥物結合物之方法，該抗體-藥物結合物作為抗腫瘤效果及安全性面優異之具有優異治療效果的抗腫瘤藥，其特徵為使下式所示的抗腫瘤性化合物與抗HER2抗體，經由下式：&lt;br/&gt; -L&lt;sup&gt;1&lt;/sup&gt;-L&lt;sup&gt;2&lt;/sup&gt;-L&lt;sup&gt;P&lt;/sup&gt;-NH-(CH&lt;sub&gt;2&lt;/sub&gt;)n&lt;sup&gt;1&lt;/sup&gt;-L&lt;sup&gt;a&lt;/sup&gt;-(CH&lt;sub&gt;2&lt;/sub&gt;)n&lt;sup&gt;2&lt;/sup&gt;-C(=O)-&lt;br/&gt; 所示的構造之連接物(linker)而結合(抗HER2抗體係於L&lt;sup&gt;1&lt;/sup&gt;之末端結合，抗腫瘤性化合物係將1位之胺基之氮原子作為結合部位，而與-(CH&lt;sub&gt;2&lt;/sub&gt;)n&lt;sup&gt;2&lt;/sup&gt;-C(=O)-部分之羰基結合)。&lt;br/&gt;&lt;img align="absmiddle" height="216px" width="245px" file="ed10096.JPG" alt="ed10096.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2127" publication-number="202614564"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614564.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614564</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141078</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>濾波器總成</chinese-title>  
        <english-title>FILTER ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H03H9/54</main-classification>  
        <further-classification edition="200601120260102B">H03H9/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商天工方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKYWORKS SOLUTIONS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安藤義明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDO, YOSHIAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>齋藤康之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAITO, YASUYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中村弘幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAMURA, HIROYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種聲波裝置。該聲波裝置可包括一傳輸濾波器，該傳輸濾波器包括體聲波諧振器及耦接於該等體聲波諧振器與一傳輸輸出節點之間的一串聯表面聲波諧振器。該聲波裝置亦可包括耦接至該傳輸濾波器的一環路電路。該環路電路可在一特定頻率下產生一目標信號的一反相信號。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An acoustic wave device is disclosed. The acoustic wave device can include a transmit filter that includes bulk acoustic wave resonators and a series surface acoustic wave resonator that is coupled between the bulk acoustic wave resonators and a transmit output node. The acoustic wave device can also include a loop circuit that is coupled to the transmit filter. The loop circuit can generate an anti-phase signal to a target signal at a particular frequency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">11:傳輸濾波器</p>  
        <p type="p">12:接收濾波器</p>  
        <p type="p">40:雙工器</p>  
        <p type="p">42:環路電路</p>  
        <p type="p">ANT:天線節點</p>  
        <p type="p">ANTL:分流電感器</p>  
        <p type="p">C1:電容器</p>  
        <p type="p">C2:電容器</p>  
        <p type="p">C3:電容器</p>  
        <p type="p">C4:電容器</p>  
        <p type="p">C5:電容器</p>  
        <p type="p">P1:BAW諧振器</p>  
        <p type="p">P2:BAW諧振器</p>  
        <p type="p">P3:BAW諧振器</p>  
        <p type="p">P4:BAW諧振器</p>  
        <p type="p">RA1:SAW諧振器</p>  
        <p type="p">RA2:SAW諧振器</p>  
        <p type="p">RB1:SAW諧振器</p>  
        <p type="p">RB2:SAW諧振器</p>  
        <p type="p">RB3:SAW諧振器</p>  
        <p type="p">RB4:SAW諧振器</p>  
        <p type="p">RB5:SAW諧振器</p>  
        <p type="p">RB6:SAW諧振器</p>  
        <p type="p">RB7:SAW諧振器</p>  
        <p type="p">RB8:SAW諧振器</p>  
        <p type="p">RB9:SAW諧振器</p>  
        <p type="p">RBA:SAW諧振器</p>  
        <p type="p">RX:接收輸出節點</p>  
        <p type="p">S1:BAW諧振器</p>  
        <p type="p">S2:BAW諧振器</p>  
        <p type="p">S3:BAW諧振器</p>  
        <p type="p">S4:BAW諧振器</p>  
        <p type="p">TX:輸輸入節點</p>  
        <p type="p">TXL:串聯電感器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2128" publication-number="202614651"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614651.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614651</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114141904</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>增強式頻寬協商</chinese-title>  
        <english-title>ENHANCED BANDWIDTH NEGOTIATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251229B">H04W16/14</main-classification>  
        <further-classification edition="200601120251229B">H04L5/00</further-classification>  
        <further-classification edition="202201120251229B">H04L67/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫　言軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, YANJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾斯特傑迪　阿爾佛瑞德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASTERJADHI, ALFRED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伽里恩　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHERIAN, GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帕提爾　雅伯西斯克普拉蒙德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PATIL, ABHISHEK PRAMOD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何　世耀當肯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, SAI YIU DUNCAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案內容提供了用於增強式頻寬協商的方法、設備和系統。一些實施方式更具體地係關於支援在根據IEEE 802.11標準的IEEE 802.11be修訂版和未來幾代可實現的頻寬範圍上的頻寬協商的請求發送（RTS）和清除發送（CTS）訊框設計。在一些實施方式中，頻寬協商訊框（諸如CTS或RTS訊框）可以是可配置的，以支援大於160 MHz的頻寬。在一些態樣，頻寬協商訊框可以符合傳統控制訊框格式。更具體而言，與傳統控制訊框格式相關聯的服務欄位中的一或多個位元可以被改變用途以攜帶增強式頻寬資訊。在一些態樣，頻寬協商訊框的接收方可以在該訊框由非傳統傳輸設備傳輸時將服務欄位中的一或多個位元解釋為攜帶增強式頻寬資訊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides methods, devices and systems for enhanced bandwidth negotiation. Some implementations more specifically relate to request-to-transmit (RTS) and clear-to-send (CTS) frame designs that support bandwidth negotiations over a range of bandwidths achievable in accordance with the IEEE 802.11be amendment, and future generations, of the IEEE 802.11 standard. In some implementations, a bandwidth negotiation frame (such as a CTS or RTS frame) may be configurable to support bandwidths greater than 160 MHz. In some aspects, the bandwidth negotiation frame may conform to a legacy control frame format. More specifically, one or more bits of a service field associated with the legacy control frame format may be repurposed to carry enhanced bandwidth information. In some aspects, a recipient of a bandwidth negotiation frame may interpret one or more bits of the service field to carry enhanced bandwidth information when the frame is transmitted by a non-legacy transmitting device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">600:頻寬協商訊框</p>  
        <p type="p">601:PHY前序信號</p>  
        <p type="p">602:傳統部分</p>  
        <p type="p">604:非傳統部分</p>  
        <p type="p">606:PHY有效負荷</p>  
        <p type="p">608:L-STF</p>  
        <p type="p">610:L-LTF</p>  
        <p type="p">612:L-SIG</p>  
        <p type="p">614:重複的傳統信號欄位(RL-SIG)</p>  
        <p type="p">616:通用信號欄位(U-SIG)</p>  
        <p type="p">618:非傳統信號欄位(EHT-SIG)</p>  
        <p type="p">622:非傳統短訓練欄位(EHT-STF)</p>  
        <p type="p">624:非傳統長訓練欄位(EHT-LTF)</p>  
        <p type="p">626:資料欄位</p>  
        <p type="p">632:服務欄位</p>  
        <p type="p">634:PSDU</p>  
        <p type="p">636:尾部</p>  
        <p type="p">638:填充位元</p>  
        <p type="p">640:頻寬資訊</p>  
        <p type="p">642:增強式頻寬資訊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2129" publication-number="202614644"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614644.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614644</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142041</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有生成式ＡＰＰ之行動裝置</chinese-title>  
        <english-title>MOBILE DEVICE WITH GENERATIVE APP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120260102B">H04W4/021</main-classification>  
        <further-classification edition="200901120260102B">H04W64/00</further-classification>  
        <further-classification edition="202201120260102B">H04L51/04</further-classification>  
        <further-classification edition="202301120260102B">G06N5/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美泰萬有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>METAONE CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江國慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, KUO-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江岳峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, YUEH-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提出一種生成式AI手機，包括控制器；通訊模組，耦合控制器；生成式AI搜尋引擎，耦合控制器，供使用者輸入請求，透過通訊模組傳輸請求至一生成式AI機器人，以生成相關的結果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention proposes a generative AI phone including a controller, a communication device coupled to the controller. A generative AI searching engineer is coupled to the controller for inputting a query. An AI chatbot is responsive to the query to fetch the information thereby generating a reply associated with the query.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:使用者裝置</p>  
        <p type="p">104:生成式AI機器人</p>  
        <p type="p">106:生成式AI伺服器</p>  
        <p type="p">102a:智能手機</p>  
        <p type="p">102b:平板電腦</p>  
        <p type="p">102c:交通載具上的運算裝置</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2130" publication-number="202614437"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614437.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614437</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142384</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置及電子機器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L23/528</main-classification>  
        <further-classification edition="202301120251229B">H10B69/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村松健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAMATSU, KEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>清水真也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMIZU, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之實施形態提供一種改善散熱性之半導體裝置。 &lt;br/&gt;本發明之實施形態之半導體裝置具備：基板；控制器，其配置於基板上；非揮發性記憶體，其與控制器隔開而配置於基板上；第1散熱器，其與控制器之上表面相接而配置；第2散熱器，其與非揮發性記憶體之上表面相接而配置；及第1樹脂密封體，其將控制器、非揮發性記憶體、第1散熱器、及第2散熱器密封。第1散熱器及第2散熱器係露出於第1樹脂密封體之上表面或側面之至少一面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:半導體裝置</p>  
        <p type="p">11:記憶體控制器</p>  
        <p type="p">12A,12B,12C,12D:NAND快閃記憶體</p>  
        <p type="p">14:基板</p>  
        <p type="p">15:第1樹脂密封體</p>  
        <p type="p">16:焊料球</p>  
        <p type="p">17:配線</p>  
        <p type="p">18A:第1接合線</p>  
        <p type="p">18B:第2接合線</p>  
        <p type="p">19A:第3接合線</p>  
        <p type="p">19B:第4接合線</p>  
        <p type="p">20A:第1散熱器</p>  
        <p type="p">20B:第2散熱器</p>  
        <p type="p">40:第1散熱器之上表面</p>  
        <p type="p">41:第2散熱器之上表面</p>  
        <p type="p">50:第1之一端</p>  
        <p type="p">51:第1之另一端</p>  
        <p type="p">52:第2之一端</p>  
        <p type="p">53:第2之另一端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2131" publication-number="202613633"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613633.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613633</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142603</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於與光子積體電路耦合的變形梯度折射率微透鏡以及用於光場及全像成像與顯示的三維梯度折射率(GRIN)微透鏡陣列</chinese-title>  
        <english-title>ANAMORPHIC GRADIENT-INDEX MICROLENSES FOR COUPLING WITH PHOTONIC INTEGRATED CIRCUITS &amp; THREE-DIMENSIONAL GRADIENT INDEX (GRIN) MICROLENS ARRAYS FOR LIGHT-FIELD AND HOLOGRAPHIC IMAGING AND DISPLAYS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G02B6/42</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商瓦迪恩光學有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VADIENT OPTICS, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威廉斯　喬治Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLIAMS, GEORGE M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜普伊　查爾斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUPUY, CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布朗　傑洛米</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROWN, JEREMY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格林　山謬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GRIMM, SAMUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿卡萬　胡曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKHAVAN, HOOMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈爾曼　Ｊ保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARMON, J. PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平謹榕</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種梯度折射率光學膜，用以將電磁(EM)輻射耦合至光子積體電路中或自光子積體電路耦合出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A gradient-index optical film is configured to couple electromagnetic (EM) radiation into or out of a photonic integrated circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:光子裝置</p>  
        <p type="p">104:光子積體電路</p>  
        <p type="p">106A:膜</p>  
        <p type="p">108:入射孔徑</p>  
        <p type="p">110:基板間隔物</p>  
        <p type="p">112:擋板</p>  
        <p type="p">114:光軸</p>  
        <p type="p">116A:波導</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2132" publication-number="202613576"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613576.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613576</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142651</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測試器結合部及對接組件</chinese-title>  
        <english-title>TESTER COUPLING PORTION AND DOCKING ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251222B">G01R31/26</main-classification>  
        <further-classification edition="200601120251222B">G01R1/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商泰克元有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHWING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成耆炷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNG, KI JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴善美</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, SUNMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金珉奭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, MIN SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及處理器。具體地，根據本發明的一實施例，可以提供測試器結合部，能夠與設置有可容納設備的插座基座的測試器及處理器中的任一個相結合，包括對接板，所述對接板中形成有開口部及多個引導部，所述開口部用於將設置於所述插座基座中的所述設備暴露於所述處理器，為了可分離式結合於所述測試器，所述引導部具有槽及突起中的一個形狀，多個所述引導部中的至少一部分與形成於所述測試器中的多個測試器引導件相結合，從而所述對接板能夠與所述測試器相結合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention relates to a test handler. Specifically according to an embodiment of the invention a tester coupling portion can be provided, which can be coupled with any one of a tester and a test handler provided with a socket base capable of accommodating equipment and includes a docking board, wherein the docking board is formed with an opening portion and a plurality of guide portions therein, the opening portion is configured to expose the equipment provided in the socket base to the test handler, in order for being detachably coupled to the tester, the guide portion is provided with a shape of one of a slot and a protrusion, and at least a part of the plurality of guide portions is coupled with a plurality of guide components formed in the tester, so that the docking board can be coupled with the tester.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:處理器</p>  
        <p type="p">10:測試器結合部</p>  
        <p type="p">20:基板</p>  
        <p type="p">30:框架</p>  
        <p type="p">40:第一梭子單元</p>  
        <p type="p">41:第一裝載區域</p>  
        <p type="p">42:第一交換區域</p>  
        <p type="p">43:第一卸載區域</p>  
        <p type="p">50:第二梭子單元</p>  
        <p type="p">51:第二裝載區域</p>  
        <p type="p">52:第二交換區域</p>  
        <p type="p">53:第二卸載區域</p>  
        <p type="p">60:元件供應單元</p>  
        <p type="p">70:溫度調節部</p>  
        <p type="p">80:裝載部</p>  
        <p type="p">90:卸載部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2133" publication-number="202612602"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612602.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612602</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142820</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>吸煙替代系統、吸煙替代設備、及操作吸煙替代設備的方法</chinese-title>  
        <english-title>SMOKING SUBSTITUTE SYSTEM, SMOKING SUBSTITUTE DEVICE, AND METHOD OF OPERATING SMOKING SUBSTITUTE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251220B">A24F40/57</main-classification>  
        <further-classification edition="202001120251220B">A24F40/50</further-classification>  
        <further-classification edition="202001120251220B">A24F47/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商帝國菸草有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMPERIAL TOBACCO LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲力　凱特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FERRIE, KATE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雪頓　羅絲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHENTON, ROSS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅德　克力斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LORD, CHRIS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>班耶札　馬德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BENYEZZAR, MED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案揭露了一種具有用於依據耗材循環來加熱耗材的吸煙替代設備的系統。吸煙替代設備包括：測量構件，用於在耗材循環期間測量設備被使用者進行的使用；及控制器，被配置為基於使用來在耗材循環期間決定耗材的用盡水平。控制器更被配置為基於用盡水平來在耗材操作循環期間控制吸煙替代設備的操作的一個方面。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a system having a smoking substitute device for heating a consumable according to a consumable cycle. The smoking substitute device comprises a measurement means for measuring a usage of the device by a user during the consumable cycle, and a controller configured to determine an exhaustion level of the consumable during the consumable cycle based on the usage. The controller is further configured to control an aspect of the operation of the smoking substitute device during the consumable operating cycle based on the exhaustion level.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">401:設備</p>  
        <p type="p">404:加熱器</p>  
        <p type="p">405:電源</p>  
        <p type="p">408:控制器</p>  
        <p type="p">409:記憶體</p>  
        <p type="p">411:使用者輸出</p>  
        <p type="p">412:使用者輸入</p>  
        <p type="p">425:噗氣感測器</p>  
        <p type="p">427:環境溫度感測器</p>  
        <p type="p">428:加熱器溫度感測器</p>  
        <p type="p">429:電力模組</p>  
        <p type="p">430:使用模組</p>  
        <p type="p">431:用盡模組</p>  
        <p type="p">432:UI控制模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2134" publication-number="202613558"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613558.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613558</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142942</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測試分選機及其控制方法</chinese-title>  
        <english-title>TEST HANDLER AND METHOD FOR CONTROLLING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G01R1/02</main-classification>  
        <further-classification edition="202001120260102B">G01R31/01</further-classification>  
        <further-classification edition="200601120260102B">G05B23/02</further-classification>  
        <further-classification edition="200601120260102B">B65G49/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商泰克元有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TECHWING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅閏成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, YUN SUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林冬春</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, DONG CHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金東現</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONG HYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴道賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, DO HYEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂長霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及測試用分選機和測試用分選機的控制方法。具體地，根據本發明一實施例可以提供測試用分選機，包括：搬運器，抓取客戶托盤後進行移動，所述客戶托盤上形成有能夠分別安置電子部件的多個凹槽；堆疊架，堆疊有客戶托盤；攝像機，拍攝客戶托盤並獲取圖像；以及控制器，基於從攝像機獲取的圖像判斷電子部件是否被正常安置於凹槽。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a test handler and a method of controlling the test handler. In particular, according to one embodiment of the present invention, there is provided a test handler including: a transfer for gripping and moving a customer tray which has a plurality of pockets for allowing electronic components to be seated therein; a stacker in which the customer tray is stacked; a camera for photographing the customer tray to obtain an image; and a controller that determines whether the electronic components are normally seated in the pockets based on the image obtained by the camera.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:測試用分選機</p>  
        <p type="p">100:搬運器</p>  
        <p type="p">110:托盤把持部</p>  
        <p type="p">120:把持部移動器</p>  
        <p type="p">121:垂直方向移動部</p>  
        <p type="p">121-1:垂直移動底座</p>  
        <p type="p">121-2:垂直移動連接構件</p>  
        <p type="p">121-3:垂直移動導軌</p>  
        <p type="p">121-4:垂直移動螺桿</p>  
        <p type="p">121-5:垂直移動驅動電機</p>  
        <p type="p">122:水準方向移動部</p>  
        <p type="p">122-1:水平移動底座</p>  
        <p type="p">122-2:水平移動導軌</p>  
        <p type="p">122-3:水平移動滑輪</p>  
        <p type="p">122-4:水平移動帶</p>  
        <p type="p">122-5:水平移動驅動電機</p>  
        <p type="p">200:堆疊架</p>  
        <p type="p">500:控制器</p>  
        <p type="p">600:顯示部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2135" publication-number="202613103"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613103.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613103</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114142999</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>克萊拉尼的晶型及其使用方法</chinese-title>  
        <english-title>CRYSTAL FORMS OF CRENOLANIB AND METHODS OF USE THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D405/14</main-classification>  
        <further-classification edition="200601120260102B">A61K31/4709</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商安羅格製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AROG PHARMACEUTICALS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡　維奈</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAIN, VINAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及單苯磺酸1-[2-[5-[(3-甲基-3-氧雜環丁烷基)甲氧基]-1H-苯并咪唑-1-基]-8-喹啉基]-4-哌啶胺的新型結晶多晶型物以及用於其製備的方法。本發明進一步涉及包含一種或多種型以及任選地一種或多種適合的藥學載體的藥物組合物。本發明還涉及使用本發明的結晶多晶型物治療疾病的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to novel crystalline polymorphs of 1-[2-[5-[(3-Methyl-3-oxetanyl)methoxy]-1H-benzimidazol-1-yl]-8-quinolinyl]-4- piperidinamine monobenzenesulfonate, and to methods for their preparation. The invention further relates to pharmaceutical compositions containing one or more forms and optionally one or more suitable pharmaceutical carriers. The invention also relates to methods of using the crystalline polymorphs of the invention in the treatment of disease.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2136" publication-number="202613163"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613163.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613163</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114143940</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種雙特異性抗體及其應用</chinese-title>  
        <english-title>Bispecific antibody and its application</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/22</main-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="200601120260102B">C12N15/13</further-classification>  
        <further-classification edition="200601120260102B">C12N15/63</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商榮昌生物製藥（煙臺）股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REMEGEN CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李棟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>房　健民</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FANG, JIANMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUAN, MEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳珊珊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHANSHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王斯斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, SISI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛英豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIN, YINGHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　元浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUANHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙國銳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, GUORUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬新婷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, XINTING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳豫宛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種靶向VEGF的VHH，以及基於該VHH開發的靶向PD-1和VEGF的雙特異性抗體及其應用，本發明提供的VHH具有穩定性高，具有易表達和純化等多種優良效果，基於本發明構建的靶向PD-1和VEGF的雙特異性抗體穩定性高，並可在高表達VEGF腫瘤區域靶向富集，具有良好的藥效和安全性，具備優異的治療潛力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a VHH targeting VEGF, as well as a bispecific antibody targeting PD-1 and VEGF developed based on the VHH and its application. The VHH provided by the invention has high stability, easy expression and purification, etc. This excellent effect is that the bispecific antibody targeting PD-1 and VEGF constructed based on the present invention has high stability, can be targeted and enriched in tumor areas with high expression of VEGF, has good efficacy and safety, and has excellent therapeutic potential.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2137" publication-number="202613651"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613651.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613651</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144139</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像系統</chinese-title>  
        <english-title>OPTICAL IMAGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G02B13/00</main-classification>  
        <further-classification edition="200601120251229B">G02B9/64</further-classification>  
        <further-classification edition="200601120251229B">G02B15/14</further-classification>  
        <further-classification edition="200601120251229B">G02B27/00</further-classification>  
        <further-classification edition="200601120251229B">G02B3/00</further-classification>  
        <further-classification edition="200601120251229B">G02B5/04</further-classification>  
        <further-classification edition="202101120251229B">G03B30/00</further-classification>  
        <further-classification edition="202301120251229B">H04N23/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金學哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HAG CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鏞主</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YONG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃孝眞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, HYO JIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像系統包括自物側依序設置的第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡及第七透鏡。所述光學成像系統滿足-2.0 ＜ L3R2/f ＜ -0.5及3.0 ＜ f/IMG_HT ＜ 4.0，其中L3R2是所述第三透鏡的像側表面的曲率半徑，f是所述光學成像系統的焦距，且IMG_HT是成像平面的對角線長度的一半。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens disposed sequentially from an object side. The optical imaging system satisfies -2.0 ＜ L3R2/f ＜ -0.5 and 3.0 ＜ f/IMG_HT ＜ 4.0, where L3R2 is a radius of curvature of an image-side surface of the third lens, f is a focal length of the optical imaging system, and IMG_HT is half a diagonal length of an imaging plane.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學成像系統</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:第六透鏡</p>  
        <p type="p">170:第七透鏡</p>  
        <p type="p">180:濾波器</p>  
        <p type="p">190:影像感測器</p>  
        <p type="p">C1:第一光軸</p>  
        <p type="p">C2:第二光軸/光軸中心</p>  
        <p type="p">G1:透鏡組/第一透鏡組</p>  
        <p type="p">G2:透鏡組/第二透鏡組</p>  
        <p type="p">G3:透鏡組/第三透鏡組</p>  
        <p type="p">P:稜鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2138" publication-number="202614230"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614230.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614230</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144212</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉由插入介面原子單層來改善對第ＩＶ族半導體的金屬接觸</chinese-title>  
        <english-title>IMPROVING METAL CONTACTS TO GROUP IV SEMICONDUCTORS BY INSERTING INTERFACIAL ATOMIC MONOLAYERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">H01L21/322</main-classification>  
        <further-classification edition="200601120251222B">H01L21/3205</further-classification>  
        <further-classification edition="202501120251222B">H10D62/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾肯科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ACORN TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈洛生　ＷＡ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARRISON, W. A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克林夫頓　保羅Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CLIFTON, PAUL A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬貝　安瑞絲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOEBEL, ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吉英斯　Ｒ史塔克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAINES, R. STOCKTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李世章</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示藉由在金屬與半導體之間的界面處插入第V族或第III族原子單層，或插入由一第V族原子單層與一第III族原子單層所製成的雙層，或插入多個此種雙層，而降低金屬–半導體(第IV族)接面之比接觸電阻的技術。所形成的低比電阻之金屬-第IV族半導體接面可應用在半導體元件(包括電子元件，例如電晶體、二極體，等等)及光電元件(例如，雷射、太陽能電池、光偵測器)中以作為低電阻電極，及/或可應用在場效電晶體(FET)中以作為金屬源極區及/或汲極區(或源極/汲極區的一部分)。該等第III族單層及第V族單層是形成在第IV族半導體表面上且主要呈秩序排列狀的原子層並且與第IV族半導體的表面原子形成化學鍵結。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques for reducing the specific contact resistance of metal – semiconductor (group IV) junctions by interposing a monolayer of group V or group III atoms at the interface between the metal and the semiconductor, or interposing a bi-layer made of one monolayer of each, or interposing multiple such bi-layers. The resulting low specific resistance metal – group IV semiconductor junctions find application as a low resistance electrode in semiconductor devices including electronic devices (e.g., transistors, diodes, etc.) and optoelectronic devices (e.g., lasers, solar cells, photodetectors, etc.) and/or as a metal source and/or drain region (or a portion thereof) in a field effect transistor (FET). The monolayers of group III and group V atoms are predominantly ordered layers of atoms formed on the surface of the group IV semiconductor and chemically bonded to the surface atoms of the group IV semiconductor.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2139" publication-number="202612936"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612936.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612936</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144264</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具旋轉座椅的兒童限制裝置</chinese-title>  
        <english-title>CHILD RESTRAINT WITH ROTATING SEAT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B60N2/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈欽森　詹姆斯ＭＦ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUTCHINSON, JAMES MF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安德森　羅伯特Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDERSON, ROBERT S</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷曼　大衛Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEHMAN, DAVID A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種可轉換兒童限制裝置，包括：一下基座，用於接觸一車輛座椅；一座椅殼，用於支撐一兒童；以及一中間基座，在所述下基座與所述座椅殼之間，以促進所述座椅殼相對於所述下基座的傾斜調整和旋轉調整。所述兒童限制裝置可用作一後向汽車座椅、一前向汽車座椅和一安全帶定位加高座椅。對於所述後向汽車座椅配置，沿著穿過所述兒童限制裝置的一後向安全帶路徑安裝一安全帶。當所述座椅殼處於一後向位置時，在所述兒童限制裝置中所述安全帶的部分經由一安全帶接入板被接入。另外，兒童限制裝置包括一旋轉鎖定機構，該旋轉鎖定機構在使用所述後向配置時，允許所述座椅殼從一後向位置旋轉到一側向位置，而不允許所述座椅殼從後向位置旋轉到一前向位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A convertible child restraint includes a lower base to contact a vehicle seat, a seat shell to support a child, and a mid base between the lower base and the seat shell to facilitate recline and rotational adjustment of the seat shell relative to the lower base. The child restraint may be used as a rear-facing car seat, a forward-facing car seat, and a belt positioning booster seat. For the rear-facing car seat configuration, a belt is installed along a rear-facing belt path that passes through the child restraint. The portion of the belt in the child restraint is accessed via a belt access panel when the seat shell is at a rear-facing position. Additionally, the child restraint includes a rotation lockout that allows the seat shell to be rotated from a rear-facing position to a side-facing position, but not a forward-facing position when using the rear-facing configuration.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:車輛座椅</p>  
        <p type="p">102:車輛座椅底板</p>  
        <p type="p">104:車輛座椅靠背</p>  
        <p type="p">110:安全帶、LATCH帶</p>  
        <p type="p">1000A:兒童限制裝置</p>  
        <p type="p">1010A:後向安全帶路徑</p>  
        <p type="p">1100:下基座</p>  
        <p type="p">1102A:後部</p>  
        <p type="p">1102B:底部</p>  
        <p type="p">1200:中間基座</p>  
        <p type="p">1204:開口</p>  
        <p type="p">1230:安全帶鎖定臂</p>  
        <p type="p">1300:座椅殼</p>  
        <p type="p">1301A:前端</p>  
        <p type="p">1301B:後側</p>  
        <p type="p">1301C:側部</p>  
        <p type="p">1312:凹口</p>  
        <p type="p">1320:安全帶接入板</p>  
        <p type="p">1360:可調頭枕、頭枕</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2140" publication-number="202613847"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613847.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613847</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144449</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>矩陣資料處理方法與人工智慧晶片</chinese-title>  
        <english-title>MATRIX DATA PROCESSING METHOD AND ARTIFICIAL INTELLIGENCE CHIP</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">G06F17/16</main-classification>  
        <further-classification edition="202301120251212B">G06N3/063</further-classification>  
        <further-classification edition="200601120251212B">G06N3/10</further-classification>  
        <further-classification edition="201801120251212B">G06F9/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海壁仞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI BIREN TECHNOLOGY CO.,LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種矩陣資料處理方法與人工智慧晶片。所述方法包括：取得第一矩陣資料，其中第一矩陣資料的資料格式符合第一精度標準；由人工智慧晶片的向量計算核心對第一矩陣資料執行基於精度位的資料拆分，以取得第二矩陣資料，其中第二矩陣資料的資料格式符合第二精度標準，且第二精度標準不同於第一精度標準；由向量計算核心，沿預設方向，對第二矩陣資料執行資料拼接，以生成拼接資料；以及由人工智慧晶片的張量計算核心處理所述拼接資料，以取得第三矩陣資料，其中第三矩陣資料的資料格式符合第一精度標準。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A matrix data processing method and an artificial intelligence chip are disclosed. The method includes: obtaining first matrix data, wherein a data format of the first matrix data conforms to a first precision standard; performing data splitting based on precision on the first matrix data by a vector computing core of the artificial intelligence chip to obtain second matrix data, wherein a data format of the second matrix data conforms to a second precision standard, and the second precision standard is different from the first precision standard; performing data splicing on the second matrix data along a preset direction by the vector computing core to generate spliced ​​data; and processing the spliced ​​data by a tensor computing core of the artificial intelligence chip to obtain third matrix data, wherein a data format of the third matrix data conforms to the first precision standard.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S601~S604:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2141" publication-number="202612803"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612803.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612803</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144744</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化學品儲槽的清洗方法及其裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251201B">B08B9/08</main-classification>  
        <further-classification edition="200601120251201B">B08B9/087</further-classification>  
        <further-classification edition="200601120251201B">B08B9/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上品綜合工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALLIED SUPREME CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇泳鍰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李瑩奕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林晉懷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉昌崙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種化學品儲槽的清洗方法及其裝置，包括一供水端及一桶槽，所述桶槽內設有一隔離層，該清洗方法至少包含一深層清洗步驟，即：由該供水端注入50~90℃高溫超純水於該桶槽，在該桶槽內以噴灑的方式使該高溫的超純水與該隔離層接觸並維持浸泡時間至少10分鐘再予以排除；藉該高溫的超純水以噴灑方式與該隔離層接觸並對其施予壓力，得令殘留在該隔離層上的化學品更容易被帶出洗淨。</p> 
      </isu-abst>  
      <isu-abst lang="en"/>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2142" publication-number="202614581"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614581.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614581</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144889</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於ＲＦＩＤ應用的可變Ｑ天線線圈電路</chinese-title>  
        <english-title>VARIABLE-Q ANTENNA COIL CIRCUIT FOR RFID APPLICATIONS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251222B">H04B5/00</main-classification>  
        <further-classification edition="200601120251222B">H01Q1/22</further-classification>  
        <further-classification edition="200601120251222B">H01Q7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾維德識別系統股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AVID IDENTIFICATION SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧　貴陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, GUI-YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>托奇　彼特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TROESCH, PETER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">被動式無線射頻識別（RFID）讀取器經配置為動態改變其諧振天線線圈電路的Q值，以最佳化其在不同條件下的效能。此RFID讀取器相配地為詢答器讀取操作和詢答器寫入操作兩者提供最佳效能，而不是僅針對一種操作或另一種操作或上述操作之間的某些固定折衷來設計最佳效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A passive radio frequency identification (RFID) reader is configured to dynamically vary the Q factor of its resonant antenna coil circuit in order to optimize its performance under different conditions. This RFID reader suitably provides optimal performance for both transponder reading and transponder writing operations, rather than being designed for optimal performance for only one operation or the other, or some fixed compromise between them.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:被動式RFID讀取器</p>  
        <p type="p">110:可變電阻元件</p>  
        <p type="p">120:AC電壓源</p>  
        <p type="p">130:電容器</p>  
        <p type="p">140:接收子系統</p>  
        <p type="p">150:天線線圈</p>  
        <p type="p">160:控制器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2143" publication-number="202613821"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613821.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613821</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144920</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>人工智慧晶片及其資料傳輸方法</chinese-title>  
        <english-title>ARTIFICIAL INTELLIGENCE CHIP AND DATA TRANSMISSION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251212B">G06F12/08</main-classification>  
        <further-classification edition="200601120251212B">G06F13/14</further-classification>  
        <further-classification edition="201801120251212B">G06F9/44</further-classification>  
        <further-classification edition="201801120251212B">G06F9/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海壁仞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI BIREN TECHNOLOGY CO.,LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種人工智慧晶片及其資料傳輸方法。人工智慧晶片包括L2快取、資料裝配器以及計算核。計算核發出多個資料請求。一般而言，多個資料請求的目標資料元素的位址為離散，且每次資料請求的資料量小於一個快取塊。若將資料請求所對應的原始快取塊返回給計算核，原始快取塊中的非目標資料元素會耗掉計算核以及L2快取之間的頻寬。資料裝配器從L2快取收集多個資料請求所對應的多個資料元素，且將所述多個資料元素裝配在同一個封包中，然後將所述封包返回給發出資料請求的計算核。因此，資料裝配器可以增加計算核以及L2快取之間的頻寬利用率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An AI chip and its data transmission method are disclosed. The AI chip includes an L2 cache, a data assembler, and a computing core. The computing core issues multiple data requests. Generally, the addresses of the target data elements in the multiple data requests are discrete, and the amount of data of each data request is less than one cache line. If the original cache line corresponding to the data request is returned to the computing core, the non-target data elements in the original cache line will consume bandwidth between the computing core and the L2 cache. The data assembler collects the multiple data elements corresponding to the multiple data requests from the L2 cache, assembles the multiple data elements into a single packet, and then returns the packet to the computing core that issued the data requests. Therefore, the data assembler can increase the bandwidth utilization between the computing core and the L2 cache.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:人工智慧(AI)晶片</p>  
        <p type="p">210_1、210_n:計算核</p>  
        <p type="p">211:執行核</p>  
        <p type="p">212:L1快取</p>  
        <p type="p">213:資料解裝配器</p>  
        <p type="p">220:資料裝配器</p>  
        <p type="p">230:L2快取</p>  
        <p type="p">240:記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2144" publication-number="202613824"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613824.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613824</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114144921</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快取及其操作方法</chinese-title>  
        <english-title>CACHE AND OPERATION METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251212B">G06F12/0891</main-classification>  
        <further-classification edition="201601120251212B">G06F12/0815</further-classification>  
        <further-classification edition="200601120251212B">G06F3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海壁仞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI BIREN TECHNOLOGY CO.,LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種人工智慧晶片的快取及其操作方法，以高效執行對快取的管理操作命令。快取包括命令表以及命中-未命中檢查單元。命中-未命中檢查單元耦接至命令表。回應於多個計算核中的一者發送管理操作命令給快取，命中-未命中檢查單元將管理操作命令登記於命令表以替代管理操作命令的執行。回應於所述多個計算核中的一者發送存取請求給快取，命中-未命中檢查單元在執行存取請求的過程中還補執行被登記於命令表中的管理操作命令。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides a cache of an artificial intelligence chip and an operation method thereof, to efficiently execute management operation commands on the cache. The cache includes a command table and a hit-miss check unit. The hit-miss check unit is coupled to the command table. In response to one of multiple computing cores sending a management operation command to the cache, the hit-miss check unit registers the management operation command into the command table to replace the execution of the management operation command. In response to one of the multiple computing cores sending an access request to the cache, the hit-miss check unit also executes the management operation command registered in the command table during the execution of the access request.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">500:人工智慧(AI)晶片</p>  
        <p type="p">510:計算核</p>  
        <p type="p">520:快取</p>  
        <p type="p">521:命中-未命中檢查單元</p>  
        <p type="p">522:標籤陣列</p>  
        <p type="p">523:操作引擎</p>  
        <p type="p">524:快取線陣列</p>  
        <p type="p">525:命令表</p>  
        <p type="p">530:主記憶體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2145" publication-number="202613577"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613577.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613577</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145140</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於晶片封裝測試之轉接器裝置</chinese-title>  
        <english-title>ADAPTER DEVICE FOR CHIP PACKAGING TEST</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251229B">G01R31/26</main-classification>  
        <further-classification edition="200601120251229B">G01R31/28</further-classification>  
        <further-classification edition="202001120251229B">G01R31/44</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海顯耀顯示科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JADE BIRD DISPLAY (SHANGHAI) LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐晨超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, CHENCHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岳楊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUE, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林育雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種用於晶片封裝測試之轉接器裝置。用於晶片封裝測試之該轉接器裝置包含：一連接板，其包括複數個封裝測試單元。各封裝測試單元包含：一板槽，其用於容納一微晶片；一信號傳輸片，其與該板槽耦合；一信號連接器，其與該板槽耦合；及一晶片基板。在一些實施例中，用於晶片封裝測試之該轉接器裝置進一步包含：一轉接器板，其透過包含於該轉接器板中之一板間連接區與該連接板耦合。一種用於晶片封裝測試之方法包含：將複數個該等微晶片接合至該連接板之該等晶片基板；耦合該連接板與該轉接器板；檢測該複數個微晶片；及使用識別碼識別一故障微晶片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An adapter device for chip packaging test is disclosed in the present disclosure. The adapter device for chip packaging test includes: a connection plate comprising a plurality of packaging testing units. Each packaging testing unit includes: a plate slot for accommodating a micro chip, a signal transmission sheet coupled with the plate slot, a signal connector coupled with the plate slot, and a chip substrate. In some embodiments, the adapter device for chip packaging test further includes: an adapter plate coupled with the connection plate through an inter-plate connection region included in the adapter plate. A method for chip packaging testing includes bonding a plurality of the micro chips to the chip substrates of the connection plate, coupling the connection plate with the adapter plate, inspecting the plurality of micro chips, and identifying a faulty micro chip using the identification code.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:連接板</p>  
        <p type="p">2:板槽</p>  
        <p type="p">3:信號傳輸片</p>  
        <p type="p">4:信號連接器</p>  
        <p type="p">5:晶片基板</p>  
        <p type="p">11:通孔</p>  
        <p type="p">12:十字標記</p>  
        <p type="p">14:定位孔</p>  
        <p type="p">15:識別碼</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2146" publication-number="202613286"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613286.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613286</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145171</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>液晶介質</chinese-title>  
        <english-title>LIQUID CRYSTAL MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C09K19/30</main-classification>  
        <further-classification edition="200601120260102B">C09K19/34</further-classification>  
        <further-classification edition="200601120260102B">C09K19/54</further-classification>  
        <further-classification edition="200601120260102B">C09K19/58</further-classification>  
        <further-classification edition="200601120260102B">G02F1/13</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬克專利公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MERCK PATENT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勞特　史分　克里斯丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAUT, SVEN CHRISTIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于碩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, FISHER (SHUO)</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許文亭</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種如技術方案1中所定義之液晶(LC)介質，其包含式 &lt;br/&gt;&lt;img align="absmiddle" height="154px" width="511px" file="ed10295.JPG" alt="ed10295.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;及 &lt;br/&gt;一或多種選自式IIA、IIB、IIC及IID之化合物之群的化合物， &lt;br/&gt;&lt;img align="absmiddle" height="448px" width="529px" file="ed10296.JPG" alt="ed10296.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;且係關於其用於光學、電光及電子目的，特定言之用於LC顯示器，尤其用於IPS、FFS、VA或PSA-VA顯示器中之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a liquid crystal (LC) medium comprising a compound of formula I &lt;br/&gt;&lt;img align="absmiddle" height="111px" width="435px" file="ed10297.JPG" alt="ed10297.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;and &lt;br/&gt;one or more compounds selected from the group of compounds of the formulae IIA, IIB, IIC and IID, &lt;br/&gt;&lt;img align="absmiddle" height="440px" width="507px" file="ed10298.JPG" alt="ed10298.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;as defined in claim 1, and to the use thereof for optical, electro-optical and electronic purposes, in particular in LC displays, especially in IPS, FFS, VA or PS-VA displays.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2147" publication-number="202613647"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613647.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613647</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145231</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像系統</chinese-title>  
        <english-title>OPTICAL IMAGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G02B11/34</main-classification>  
        <further-classification edition="200601120251229B">G02B15/14</further-classification>  
        <further-classification edition="200601120251229B">G02B13/00</further-classification>  
        <further-classification edition="202101120251229B">G02B7/04</further-classification>  
        <further-classification edition="200601120251229B">G02B1/04</further-classification>  
        <further-classification edition="200601120251229B">G02B13/18</further-classification>  
        <further-classification edition="200601120251229B">G02B15/22</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭弼鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, PHIL HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林台淵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIM, TAE YEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鏞主</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YONG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像系統包括：第一透鏡群組，具有負的折射力；第二透鏡群組，具有正的折射力；以及第三透鏡群組，具有負的折射力，其中第二透鏡群組及第三透鏡群組被配置成在光軸方向上移動以對焦距及放大率進行調節，且滿足以下條件表達式， &lt;br/&gt;FNOt ≤ 3.6， &lt;br/&gt;其中FNOt是光學成像系統的遠攝端處的F值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging system includes a first lens group having negative refractive power, a second lens group having positive refractive power, and a third lens group having negative refractive power, wherein the second lens group and the third lens group are configured to move in an optical axis direction to adjust a focal length and magnification, and the following conditional expression is satisfied, &lt;br/&gt;FNOt ≤ 3.6, &lt;br/&gt;where FNOt is an F value at a telephoto end of the optical imaging system.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學成像系統</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:第六透鏡</p>  
        <p type="p">170:第七透鏡</p>  
        <p type="p">F:濾光器</p>  
        <p type="p">G1:第一透鏡群組</p>  
        <p type="p">G2:第二透鏡群組</p>  
        <p type="p">G3:第三透鏡群組</p>  
        <p type="p">P:稜鏡</p>  
        <p type="p">S:影像感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2148" publication-number="202614313"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614313.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614313</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145242</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L21/67</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中島幹雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKASHIMA, MIKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅﨑翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UMEZAKI, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>稲富弘朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INADOMI, HIROAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 提供一種「在使用了超臨界狀態之處理流體的乾燥時，可抑制晶圓之圖案倒塌」的基板處理裝置及基板處理方法。 &lt;br/&gt;　　[解決手段] 基板處理裝置，係具備有：處理容器；及處理流體供給部，將超臨界狀態的處理流體供給至處理容器，處理流體供給部，係具有：流體供給管線，一方被連接於流體供給源，另一方被連接於處理容器；冷卻部，被介設於流體供給管線，冷卻氣體狀態的處理流體，生成液體狀態的處理流體；泵，被介設於流體供給管線，並被設置於冷卻部的下游側；加熱部，被介設於流體供給管線，並被設置於泵的下游側，加熱液體狀態的處理流體，生成超臨界狀態的處理流體；第1流量調整部，被介設於流體供給管線，並被設置於泵與加熱部之間，調整被供給至處理容器之處理流體的供給流量；及控制部，控制第1流量調整部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">18A:乾燥單元</p>  
        <p type="p">19:供給單元</p>  
        <p type="p">31:本體</p>  
        <p type="p">35:供給埠</p>  
        <p type="p">37:排出埠</p>  
        <p type="p">61:連接點</p>  
        <p type="p">62A:分歧點</p>  
        <p type="p">64:過濾器</p>  
        <p type="p">65:冷凝器</p>  
        <p type="p">66:儲槽</p>  
        <p type="p">67:泵</p>  
        <p type="p">68:加熱器</p>  
        <p type="p">71:第1供給管線</p>  
        <p type="p">72A:第2供給管線</p>  
        <p type="p">73A:第1分歧管線</p>  
        <p type="p">74:第2分歧管線</p>  
        <p type="p">75A:連接點</p>  
        <p type="p">76:排出管線</p>  
        <p type="p">77A:分歧點</p>  
        <p type="p">80:處理流體供給部</p>  
        <p type="p">90:處理流體供給源</p>  
        <p type="p">111:閥</p>  
        <p type="p">112:閥</p>  
        <p type="p">113:閥</p>  
        <p type="p">114A:閥</p>  
        <p type="p">115A:閥</p>  
        <p type="p">120:孔口</p>  
        <p type="p">121:孔口</p>  
        <p type="p">122:孔口</p>  
        <p type="p">123:孔口</p>  
        <p type="p">131A:背壓閥</p>  
        <p type="p">141A:壓力感測器</p>  
        <p type="p">142A:壓力感測器</p>  
        <p type="p">150A:第2流量調整部</p>  
        <p type="p">211:閥</p>  
        <p type="p">212:閥</p>  
        <p type="p">213:閥</p>  
        <p type="p">221:孔口</p>  
        <p type="p">222:孔口</p>  
        <p type="p">231:背壓閥</p>  
        <p type="p">241:溫度感測器</p>  
        <p type="p">242:壓力感測器</p>  
        <p type="p">250:第1流量調整部</p>  
        <p type="p">251:流量計</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2149" publication-number="202614837"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614837.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614837</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145292</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251229B">H10D64/00</main-classification>  
        <further-classification edition="202501120251229B">H10D64/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>姜明吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KANG, MYUNG GIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金洞院</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, DONG WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴雨錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, WOO SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙槿彙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, KEUN HWI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許盛祺</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUR, SUNG GI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供半導體裝置，包含：第一主動圖案，包含在第一方向上延伸的第一下部圖案及與第一下部圖案間隔開的第一薄片圖案；以及第一閘極電極，位於第一下部圖案上，第一閘極電極在與第一方向不同的第二方向上延伸且包圍第一薄片圖案，其中第一下部圖案包含彼此相對的第一側壁及第二側壁，第一下部圖案的第一側壁及第一下部圖案的第二側壁中的每一者在第一方向上延伸，第一閘極電極在第二方向上以第一深度與第一下部圖案的第一側壁重疊，第一閘極電極在第二方向上以第二深度與第一下部圖案的第二側壁重疊，且第一深度與第二深度不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Semiconductor devices include a first active pattern including a first lower pattern extending in a first direction and a first sheet pattern spaced apart from the first lower pattern; and a first gate electrode on the first lower pattern, the first gate electrode extending in a second direction different from the first direction and surrounding the first sheet pattern, wherein the first lower pattern includes a first sidewall and a second sidewall opposite to each other, each of the first sidewall of the first lower pattern and the second sidewall of the first lower pattern extends in the first direction, the first gate electrode overlaps the first sidewall of the first lower pattern in the second direction by a first depth, the first gate electrode overlaps the second sidewall of the first lower pattern in the second direction by a second depth, and the first depth is different from the second depth.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基底</p>  
        <p type="p">105:場絕緣層</p>  
        <p type="p">110:第一下部圖案</p>  
        <p type="p">110_s1、210_s1:第一側壁</p>  
        <p type="p">110_s2、210_s2:第二側壁</p>  
        <p type="p">110us、210us:頂部表面</p>  
        <p type="p">120_1:第一閘極電極</p>  
        <p type="p">120_1a:第一部分</p>  
        <p type="p">120_1b:第二部分</p>  
        <p type="p">120_1c:第三部分</p>  
        <p type="p">130:第一閘極絕緣層</p>  
        <p type="p">145:第一閘極封蓋圖案</p>  
        <p type="p">192:層間絕緣層</p>  
        <p type="p">195:佈線</p>  
        <p type="p">210:第二下部圖案</p>  
        <p type="p">C-C:線</p>  
        <p type="p">d11:第一_第一深度</p>  
        <p type="p">d12:第一_第二深度</p>  
        <p type="p">d21:第二_第一深度</p>  
        <p type="p">,22:第二_第二深度</p>  
        <p type="p">D2:第二方向</p>  
        <p type="p">D3:第三方向</p>  
        <p type="p">FT:鰭型溝渠</p>  
        <p type="p">GCS1:第一閘極隔離結構</p>  
        <p type="p">NS1_1:第一薄片圖案</p>  
        <p type="p">NS2_1:第二薄片圖案</p>  
        <p type="p">w11、w12、w13:寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2150" publication-number="202612977"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612977.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612977</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145303</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於人力車輛之輪轂</chinese-title>  
        <english-title>HUB FOR HUMAN-POWERED VEHICLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B62M25/08</main-classification>  
        <further-classification edition="200601120251229B">B60B27/02</further-classification>  
        <further-classification edition="200601120251229B">B60B27/04</further-classification>  
        <further-classification edition="201001120251229B">B62M6/55</further-classification>  
        <further-classification edition="201001120251229B">B62M6/80</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商島野股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMANO INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎梓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, AZUSA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仁木一喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIKI, KAZUTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上田剛史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UEDA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳俊良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於一人力車輛之輪轂。該輪轂包括一輪轂輪軸、一輪轂主體、一鏈輪支撐結構、一受偵測部件及一旋轉偵測感測器。該輪轂輪軸具有一中心軸線。該輪轂主體圍繞該中心軸線以可旋轉方式安置。該鏈輪支撐結構圍繞該中心軸線以可旋轉方式安置以在圍繞該中心軸線沿一驅動旋轉方向旋轉之同時將一驅動力傳輸至該輪轂主體。該受偵測部件係設置至該鏈輪支撐結構。該旋轉偵測感測器經組態以偵測該受偵測部件以便偵測該鏈輪支撐結構圍繞該中心軸線之旋轉且係安置於該輪轂主體中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A hub is provided for a human-powered vehicle. The hub comprises a hub axle, a hub body, a sprocket support structure, a detected part and a rotation detection sensor. The hub axle has a center axis. The hub body is rotatably disposed around the center axis. The sprocket support structure is rotatably disposed around the center axis to transmit a driving force to the hub body while rotating in a driving rotational direction around the center axis. The detected part is provided to the sprocket support structure. The rotation detection sensor is configured to detect the detected part to detect rotation of the sprocket support structure around the center axis and being disposed in the hub body.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:輪轂</p>  
        <p type="p">12:輪轂輪軸/軸件構件</p>  
        <p type="p">12a:主要主體</p>  
        <p type="p">12b:端件</p>  
        <p type="p">12c:旋轉限制構件</p>  
        <p type="p">14:輪轂主體</p>  
        <p type="p">14a:第一外凸緣</p>  
        <p type="p">14b:第二外凸緣</p>  
        <p type="p">14d:內部螺紋</p>  
        <p type="p">18:鏈輪支撐結構</p>  
        <p type="p">20:電組件</p>  
        <p type="p">22:電纜</p>  
        <p type="p">26:電纜</p>  
        <p type="p">36:受偵測部件</p>  
        <p type="p">36a:磁體</p>  
        <p type="p">38:旋轉偵測感測器</p>  
        <p type="p">38a:磁性感測器</p>  
        <p type="p">40:電路板</p>  
        <p type="p">42:電子控制器</p>  
        <p type="p">44:第一電力儲存裝置</p>  
        <p type="p">46:第二電力儲存裝置</p>  
        <p type="p">48:資料儲存裝置</p>  
        <p type="p">50:外主體</p>  
        <p type="p">50a:鍵槽</p>  
        <p type="p">64:固持器</p>  
        <p type="p">64a:外部螺紋</p>  
        <p type="p">64b:接觸表面</p>  
        <p type="p">68:支撐環</p>  
        <p type="p">70:外殼</p>  
        <p type="p">72:蓋</p>  
        <p type="p">76:固定板</p>  
        <p type="p">A1:中心軸線</p>  
        <p type="p">D1:驅動旋轉方向/第一旋轉方向</p>  
        <p type="p">D2:非驅動旋轉方向/第二旋轉方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2151" publication-number="202614047"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614047.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614047</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145328</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置、系統及解碼電路</chinese-title>  
        <english-title>MEMORY DEVICE, SYSTEM, AND DECODING CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G11C8/12</main-classification>  
        <further-classification edition="200601120251229B">G11C11/4063</further-classification>  
        <further-classification edition="200601120251229B">G11C16/06</further-classification>  
        <further-classification edition="200601120251229B">G11C8/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商長江存儲科技有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANGTZE MEMORY TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申雪松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHEN, XUESONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜智超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DU, ZHICHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宋　大植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SONG, DAESIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請實施例提供一種記憶體裝置、系統及解碼電路，其中，記憶體裝置包括：存儲單元陣列以及與存儲單元陣列耦接的週邊電路；其中，存儲單元陣列包括至少一個存儲塊，存儲塊設置有多行字元線和多列位元線，以及耦接在字元線和位元線之間的存儲單元；所述週邊電路包括列解碼電路；列解碼電路與多列位元線耦接，所述列解碼電路被配置為，接收列位址信號，將列位址信號進行多級解碼，輸出列解碼信號，所述列解碼信號指示使能所述存儲塊中的相應位元線。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of this application provide a memory device, a system, and a decoding circuit. The memory device includes a storage unit array and a peripheral circuit coupled to the storage unit array. The storage unit array includes at least one storage block, which is provided therein with a plurality of rows of word lines and a plurality of columns of bit lines, as well as a storage unit coupled between a word line and a bit line. The peripheral circuit includes a column decoding circuit. The column decoding circuit is coupled to the plurality of columns of bit lines; and the column decoding circuit is configured to receive a column address signal, perform multi-level decoding on the column address signals, and output a column selection signal, the column selection signal indicating that a corresponding bit line in the storage block is enabled.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2152" publication-number="202612710"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612710.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612710</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145341</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於治療POLYQ疾病之方法及新穎的脂肪組織衍生之間質幹細胞</chinese-title>  
        <english-title>METHODS FOR TREATING POLYQ DISEASE AND NOVEL ADIPOSE TISSUE DERIVED MESENCHYMAL STEM CELLS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120260102B">A61K35/28</main-classification>  
        <further-classification edition="200601120260102B">A61K38/17</further-classification>  
        <further-classification edition="200601120260102B">A61P25/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仲恩生醫科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEMINENT BIOTHERAPEUTICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅偉绮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LO, WEI-CHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王瑋琦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONG, WEI-KEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴秀玉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAI, HSIU-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃大維</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供表現活化素A之脂肪組織衍生之幹細胞或活化素A與經修飾之脂肪組織衍生之幹細胞的組合的用途，其用於藉由減少錯誤摺疊及聚集之polyQ蛋白，諸如共濟失調蛋白-3蛋白來治療polyQ疾病，諸如脊髓小腦性共濟失調3 (spinocerebellar ataxia 3，SCA 3)。本發明亦提供用於減少錯誤摺疊及聚集之polyQ蛋白之組合物，其中該組合物包含經修飾之脂肪組織衍生之幹細胞群體及活化素A。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides the use of adipose tissue derived stem cells that express Activin A or the combination of Activin A and modified adipose tissue derived stem cells, for treating polyQ diseases, such as spinocerebellar ataxia 3 (SCA 3), by reducing a misfolded and aggregated polyQ protein, such as ataxin-3 protein. The present invention also provides a composition for reducing misfolded and aggregated polyQ proteins, wherein the composition comprises a population of modified adipose tissue derived stem cells and Activin A.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2153" publication-number="202613652"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613652.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613652</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145363</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像系統</chinese-title>  
        <english-title>OPTICAL IMAGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G02B13/00</main-classification>  
        <further-classification edition="200601120251229B">G02B13/18</further-classification>  
        <further-classification edition="200601120251229B">G02B11/30</further-classification>  
        <further-classification edition="200601120251229B">G02B3/00</further-classification>  
        <further-classification edition="200601120251229B">G02B27/12</further-classification>  
        <further-classification edition="202101120251229B">G03B13/36</further-classification>  
        <further-classification edition="202301120251229B">H04N23/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柳浩植</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOO, HO SIK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁東晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, DONG SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像系統包括：具有正折光力的第一透鏡、第二透鏡、第三透鏡及第四透鏡，沿光軸自物側依序排列。所述第一透鏡至所述第四透鏡在近軸區域中沿所述光軸彼此間隔開。包括所述第一透鏡至所述第四透鏡的透鏡單元的總焦距f及影像感測器的成像表面的對角線長度的一半（IMG HT）滿足f/IMG HT ＞ 4.9。所述第一透鏡的物側表面的有效孔半徑及所述第二透鏡的物側表面的有效孔半徑二者均大於除所述第一透鏡及所述第二透鏡以外的透鏡中的每一者的物側表面的有效孔半徑及像側表面的有效孔半徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging system includes a first lens having positive refractive power, a second lens, a third lens, and a fourth lens, arranged sequentially from an object side along an optical axis. The first lens through the fourth lens are spaced apart from each other along the optical axis in a paraxial region. A total focal length f of a lens unit including the first lens through the fourth lens and half (IMG HT) of a diagonal length of an imaging surface of an image sensor satisfy f/IMG HT ＞ 4.9. An effective aperture radius of an object-side surface of the first lens and an effective aperture radius of an object-side surface of the second lens are both greater than effective aperture radii of an object-side surface and an image-side surface of each of the lenses other than the first lens and the second lens.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:濾波器</p>  
        <p type="p">170:影像感測器</p>  
        <p type="p">R:反射構件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2154" publication-number="202613141"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613141.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613141</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145371</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>原子層沉積法用之薄膜形成用原料及薄膜之製造方法</chinese-title>  
        <english-title>RAW MATERIAL FOR FORMING THIN FILM BY ATOMIC LAYER DEPOSITION METHOD, AND METHOD FOR MANUFACTURING THIN FILM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07F5/00</main-classification>  
        <further-classification edition="200601120260102B">C23C16/455</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＤＥＫＡ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEKA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武田圭介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEDA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠津正揮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENZU, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種原子層沉積法用之薄膜形成用原料，其含有下述式(1)所示的化合物； &lt;br/&gt;&lt;img align="absmiddle" height="101px" width="203px" file="ed10030.JPG" alt="ed10030.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式中，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;各自獨立地表示氫原子或碳原子數1～5的烷基，L表示下述通式(L-1)或(L-2)所示的基，M表示銦原子或鎵原子)； &lt;br/&gt;&lt;img align="absmiddle" height="151px" width="227px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式中，R&lt;sup&gt;11&lt;/sup&gt;及R&lt;sup&gt;12&lt;/sup&gt;各自獨立地表示氫原子、氟原子、碳原子數1～5的烷基或碳原子數1～5的烷氧基，＊表示與通式(1)中的M之鍵結位置)； &lt;br/&gt;&lt;img align="absmiddle" height="152px" width="223px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式中，R&lt;sup&gt;21&lt;/sup&gt;～R&lt;sup&gt;23&lt;/sup&gt;各自獨立地表示氫原子、氟原子或碳原子數1～5的烷基，＊表示與通式(1)中的M之鍵結位置；惟，R&lt;sup&gt;21&lt;/sup&gt;與R&lt;sup&gt;22&lt;/sup&gt;為不同的基)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2155" publication-number="202612892"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612892.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612892</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145400</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>注入成型系統及注入成型方法</chinese-title>  
        <english-title>INJECTION MOLDING SYSTEM AND INJECTION MOLDING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B29C44/60</main-classification>  
        <further-classification edition="200601120251229B">B29C44/58</further-classification>  
        <further-classification edition="200601120251229B">B29C44/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐特捷實業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTRAJET INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳璟浩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHING-HAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉良輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEH, LIANG-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種注入系統，該注入系統包括一擠出系統、一排放通道、一含有第一和第二模腔的成型裝置，以及一調節所述第一及第二模腔內壓力的一壓力調節系統。一種注入成型方法包括提供一成型裝置，該成型裝置具有一第一及一第二模腔、一連通該第一模腔的一第一進料口、及一連通該第二模腔的第二進料口；感測該第一模腔中的一第一壓力，並注入一第一氣體至該第一模腔中，直到感測到該第一模腔具有一第一預定壓力為止；及感測該第二模腔中的一第二壓力，並注入一第二氣體至該第二模腔中，直到感測到該第二模腔具有一第二預定壓力為止，其中所述第一及第二預定壓力為不同。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An injection molding system includes an extruding system, a discharging channel, a molding device including a first and second mold cavities, and a pressure regulating system regulates pressures inside the first and second mold cavities. An injection molding method includes providing a molding device having a first and second mold cavities, a first feeding port in communication with the first mold cavity, and a second feeding port in communication with the second mold cavity; sensing a first pressure in the first mold cavity, and injecting a first gas into the first mold cavity until the first mold cavity is sensed to have a first predetermined pressure; and sensing a second pressure in the second mold cavity, and injecting a second gas into the second mold cavity until the second mold cavity is sensed to have a second predetermined pressure, wherein the first and second predetermined pressures are different.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:擠出系統</p>  
        <p type="p">20:排放通道</p>  
        <p type="p">20a:第一排放通道</p>  
        <p type="p">21:出口</p>  
        <p type="p">21a:第一出口</p>  
        <p type="p">30a:成型裝置</p>  
        <p type="p">31:模腔</p>  
        <p type="p">31a:第一模腔</p>  
        <p type="p">31b:第二模腔</p>  
        <p type="p">32:上模具</p>  
        <p type="p">33:下模具</p>  
        <p type="p">34:上模座</p>  
        <p type="p">35:進料口</p>  
        <p type="p">35a:第一進料口</p>  
        <p type="p">35b:第二進料口</p>  
        <p type="p">36:壓力調節系統</p>  
        <p type="p">36a:第一壓力調節系統</p>  
        <p type="p">36b:第二壓力調節系統</p>  
        <p type="p">37:接點</p>  
        <p type="p">40:支撐裝置</p>  
        <p type="p">41:第一元件</p>  
        <p type="p">42:第二元件</p>  
        <p type="p">60:控制系統</p>  
        <p type="p">61:中央處理器</p>  
        <p type="p">62:感測器</p>  
        <p type="p">63:纜線</p>  
        <p type="p">100:注入成型系統</p>  
        <p type="p">311:內頂壁</p>  
        <p type="p">312:內側壁</p>  
        <p type="p">313:內底壁</p>  
        <p type="p">341:開口</p>  
        <p type="p">361:第一氣體導管</p>  
        <p type="p">362:第二氣體導管</p>  
        <p type="p">363:氣體源</p>  
        <p type="p">364:第一閥</p>  
        <p type="p">365:第二閥</p>  
        <p type="p">366:壓力感測單元</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2156" publication-number="202612645"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612645.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612645</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145411</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種經皮葡萄糖監測系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">A61B5/145</main-classification>  
        <further-classification edition="200601120251216B">A61B5/00</further-classification>  
        <further-classification edition="201801120251216B">G16H40/00</further-classification>  
        <further-classification edition="201601120251216B">A61B50/20</further-classification>  
        <further-classification edition="201601120251216B">A61B50/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華廣生技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIONIME CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃椿木</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHUN MU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葉智隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂正偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, CHENG WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫宏發</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUN, HUNG FA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉庭妤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張宇涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃姸昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YEN HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡清福</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡馭理</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了一種經皮葡萄糖監測系統，涉及醫療檢測技術領域，包括：連續性葡萄糖監測設備，用於監測患者皮下組織間液的葡萄糖濃度；患者使用者端，用於獲取連續性葡萄糖監測設備資訊、接收葡萄糖濃度資料、顯示連續性葡萄糖監測設備的暖機進度；雲端伺服器，用於完成資料共用及讀取資料的授權。本發明的患者使用者端關注連續性葡萄糖監測設備的暖機時間並對其進行正向的直觀展示，及葡萄糖監測資料分析的視覺化管理，以提升葡萄糖監測的便利性。此外，系統支援第二監控設備，使親友能及時瞭解患者的葡萄糖監測狀態，推測葡萄糖波動原因，進一步提高葡萄糖控制效果。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:經皮葡萄糖監測系統</p>  
        <p type="p">2:連續性葡萄糖監測設備</p>  
        <p type="p">3:患者使用者端</p>  
        <p type="p">4:雲端伺服器</p>  
        <p type="p">5:夥伴使用者端</p>  
        <p type="p">6:醫療照護端</p>  
        <p type="p">21:葡萄糖感測器</p>  
        <p type="p">22:無線通訊單元(發射器)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2157" publication-number="202613116"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613116.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613116</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145447</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抑制ＮＬＲＰ３的化合物及其用途</chinese-title>  
        <english-title>COMPOUNDS FOR INHIBITING NLRP3 AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D471/04</main-classification>  
        <further-classification edition="200601120260102B">A61K31/5025</further-classification>  
        <further-classification edition="200601120260102B">A61P25/00</further-classification>  
        <further-classification edition="200601120260102B">A61P29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商凡特斯治療美國公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VENTUS THERAPEUTICS U.S., INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜瑞奇　史蒂芬妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DORICH, STEPHANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布奇　傑森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURCH, JASON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聖安格　米格爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ST-ONGE, MIGUEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>切夫森　阿曼丁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEFSON, AMANDINE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科特　亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COTE, ALEXANDRE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝弗瑞　拉姆賽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEVERIDGE, RAMSAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽伯特　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CIBLAT, STEPHANE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露關於NLRP3的抑制劑，其在該蛋白質所抑制疾病和疾患的治療上有用並具有式(I)： &lt;br/&gt;&lt;img align="absmiddle" height="98px" width="152px" file="ed10180.JPG" alt="ed10180.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to inhibitors of NLRP3 useful in the treatment of diseases and disorders inhibited by said protein and having the Formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="78px" width="128px" file="ed10181.JPG" alt="ed10181.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2158" publication-number="202613798"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613798.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613798</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145488</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電腦所執行之編輯方法、程式及資訊處理裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">G06F3/12</main-classification>  
        <further-classification edition="200601120251216B">B41J3/36</further-classification>  
        <further-classification edition="200601120251216B">H04N1/387</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商樫尾計算機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CASIO COMPUTER CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>成瀨健一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARUSE, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴碧宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡淑美</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]&lt;br/&gt; 可容易知道於將供印刷物件之被印刷媒體的寬度變更後所需要之被印刷媒體的長度。&lt;br/&gt; [解決手段]&lt;br/&gt; 一種編輯方法，其中電腦執行尺寸調整操作，且於進行了前述尺寸調整操作的情況下，前述電腦導出放大後或縮小後需要之被印刷媒體的長度，使顯示部顯示所導出之前述被印刷媒體的長度，該尺寸調整操作係將用以對被印刷媒體進行圖像之印刷的可印刷區域放大或縮小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2159" publication-number="202614064"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614064.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614064</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145495</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>快閃記憶體裝置、快閃記憶體儲存管理方法及快閃記憶體控制器</chinese-title>  
        <english-title>FLASH MEMORY APPARATUS, STORAGE MANAGEMENT METHOD FOR FLASH MEMORY, AND FLASH MEMORY CONTROLLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G11C16/06</main-classification>  
        <further-classification edition="200601120260102B">G11C11/52</further-classification>  
        <further-classification edition="200601120260102B">G06F11/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>慧榮科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICON MOTION INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊宗杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, TSUNG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許鴻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, HONG-JUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種快閃記憶體儲存管理方法包括：提供一快閃記憶體模組，該快閃記憶體模組包括複數個單層單元資料區塊以及至少一多層單元資料區塊；將一筆欲寫入之資料分類為複數群資料；分別執行單層單元資料寫入以及執行一類似容錯式磁碟陣列的錯誤更正編碼操作產生一對應的校驗碼，以將複數群資料以及該對應的校驗碼寫入至該些單層單元資料區塊；當完成該些單層單元資料區塊的寫入時，執行內部複製，將該些單層單元資料區塊所儲存之該複數群資料以及該對應校驗碼，依該些單層單元資料區塊的儲存順序，依序寫入至該至少一多層單元資料區塊。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A flash memory storage management method includes: providing a flash memory module including single-level-cell (SLC) blocks and at least one multiple-level-cell block such as MLC block, TLC block, or QLC block; classifying data to be programmed into groups of data; respectively executing SLC programming and RAID-like error code encoding to generate corresponding parity check codes, to program the groups of data and corresponding parity check codes to the SLC blocks; when completing program of the SLC blocks, performing an internal copy to program the at least one multiple-level-cell block by sequentially reading and writing the groups of data and corresponding parity check codes from the SLC blocks to the multiple-level-cell block according to a storage order of the SLC blocks.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:快閃記憶體裝置</p>  
        <p type="p">105:快閃記憶體模組</p>  
        <p type="p">110:快閃記憶體控制器</p>  
        <p type="p">1051A,1051B,1051C:SLC資料區塊</p>  
        <p type="p">1052:TLC資料區塊</p>  
        <p type="p">1101:錯誤更正碼編碼電路</p>  
        <p type="p">1102:校驗碼緩衝器</p>  
        <p type="p">1102A,1102B:緩衝區</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2160" publication-number="202614663"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614663.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614663</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145498</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於兩步隨機存取通道程序的隨機存取回應映射</chinese-title>  
        <english-title>RANDOM ACCESS RESPONSE MAPPING FOR TWO-STEP RANDOM ACCESS CHANNEL PROCEDURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202401120251219B">H04W74/08</main-classification>  
        <further-classification edition="200901120251219B">H04W48/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷　敬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEI, JING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊斯萊　穆罕默德納茲穆爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISLAM, MUHAMMAD NAZMUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BD</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何　林海</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HE, LINHAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示案的各個態樣大體係關於無線通訊。在一些態樣中，基地台（BS）可以在訊息B（msgB）通訊中對複數個隨機存取通道回應（RAR）和無線電資源控制（RRC）訊息連同用於要映射到不同的msgB通訊的其他RAR的補充排程資訊進行分組和選擇性多工。BS可以向一或多個使用者設備（UE）發送msgB通訊。提供許多其他態樣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a base station (BS) may group and selectively multiplex a plurality of random access channel responses (RARs) and radio resource control (RRC) messages in a message B (msgB) communication, together with supplementary scheduling information for other RARs to be mapped to a different msgB communication. The BS may transmit the msgB communication to one or more user equipments. Numerous other aspects are provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:實例</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2161" publication-number="202614078"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614078.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614078</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145507</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>帶可配置糾錯碼（ＥＣＣ）資料保護的系統和記憶體及相關方法</chinese-title>  
        <english-title>SYSTEM AND MEMORY WITH CONFIGURABLE ERROR-CORRECTION CODE (ECC) DATA PROTECTION AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G11C29/42</main-classification>  
        <further-classification edition="200601120260102B">G06F11/16</further-classification>  
        <further-classification edition="200601120260102B">G06F13/14</further-classification>  
        <further-classification edition="200601120260102B">G06F13/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐　正元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUH, JUNGWON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千　德斯特塔密歐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUN, DEXTER TAMIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯瑞尼瓦桑　安納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRINIVASAN, ANAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾拉佛納　奧利佛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALAVOINE, OLIVIER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫兒　勞倫特瑞內</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOLL, LAURENT RENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了用於系統糾錯碼功能的方法和裝置。該裝置包括記憶體，該記憶體被配置成經由至少一個資料連接和至少一個非資料連接來與主機進行通訊。該記憶體包括記憶體陣列。該記憶體陣列包括第一部分和第二部分。該記憶體被進一步配置成在第一模式中在該記憶體陣列的第一部分和第二部分中儲存和輸出資料。第一部分可由第一位址定址，而第二部分可由第二位址定址。該記憶體被進一步配置成在第二模式中經由該至少一個非資料連接來從該主機接收資料的ECC，在該記憶體陣列的第一部分中儲存資料，並基於第一位址在該記憶體陣列的第二部分中儲存資料的ECC。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and apparatuses for a system error-correction code function are presented. The apparatus includes a memory configured to communicate with a host via at least one data connection and at least one non-data connection. The memory includes a memory array. The memory array includes a first portion and a second portion. The memory is further configured to, in a first mode, store and output data in the first portion and the second portion of the memory array. The first portion is addressable by a first address, and the second portion is addressable by a second address. The memory is further configured to, in a second mode, receive ECC of the data from the host via the at least one non-data connection, store the data in the first portion of the memory array, and store the ECC of the data in the second portion of the memory array based on the first address.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100_s:裝置</p>  
        <p type="p">110_s:主機</p>  
        <p type="p">115:匯流排系統</p>  
        <p type="p">120:處理器</p>  
        <p type="p">122:CPU</p>  
        <p type="p">123:GPU</p>  
        <p type="p">124:NPU</p>  
        <p type="p">130_s:記憶體控制器</p>  
        <p type="p">131:系統ECC解碼器</p>  
        <p type="p">132:系統ECC編碼器</p>  
        <p type="p">134_s:控制器PHY模組</p>  
        <p type="p">135:鏈路ECC解碼器</p>  
        <p type="p">136:鏈路ECC編碼器</p>  
        <p type="p">150_s:記憶體</p>  
        <p type="p">160:記憶體I/O模組</p>  
        <p type="p">161:記憶體鏈路ECC解碼器</p>  
        <p type="p">162:記憶體鏈路ECC編碼器</p>  
        <p type="p">163:節點</p>  
        <p type="p">164:節點</p>  
        <p type="p">171:陣列ECC解碼器</p>  
        <p type="p">172:陣列ECC編碼器</p>  
        <p type="p">173:節點</p>  
        <p type="p">174:節點</p>  
        <p type="p">175_s:記憶體陣列</p>  
        <p type="p">176:陣列ECC</p>  
        <p type="p">190_s:190_s</p>  
        <p type="p">932:第一部分</p>  
        <p type="p">934:第二部分</p>  
        <p type="p">936:第三部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2162" publication-number="202614499"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614499.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614499</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145508</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電連接器總成、安裝纜線連接器至基板之方法及壓接式連接器總成</chinese-title>  
        <english-title>ELECTRICAL CONNECTOR ASSEMBLY, METHOD OF MOUNTING A CABLE CONNECTOR TO A SUBSTRATE AND PRESSURE MOUNT CONNECTOR ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01R13/02</main-classification>  
        <further-classification edition="200601120251229B">H01R13/40</further-classification>  
        <further-classification edition="200601120251229B">H01R13/502</further-classification>  
        <further-classification edition="201101120251229B">H01R12/71</further-classification>  
        <further-classification edition="201101120251229B">H01R13/646</further-classification>  
        <further-classification edition="200601120251229B">H01R43/16</further-classification>  
        <further-classification edition="200601120251229B">H01R43/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＦＣＩ美國有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FCI USA LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賽拉比洛夫　阿卡迪　Ｙ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEREBILOV, ARKADY Y.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種具有一板連接器及一纜線連接器之中板纜線連接器總成。該板連接器具有相對於接合特徵部精確定位之端子。同樣地，一纜線連接器具有相對於互補接合特徵部精確定位之端子。當將該等連接器按壓在一起以進行配接時，一個或兩個連接器之該等端子變形，從而產生使該等連接器分離直至該等接合特徵部接合並阻止進一步向後運動之一力。由於該配接位置係由該等接合特徵部之位置界定，故可將該等連接器設計為具有低超行程及一所得短截線長度，此促進高頻效能。藉由使形成接地端子之配接接觸部分之樑互連從而減小未連接片段之長度之一接地導體及藉由具有減少該等纜線之變形之順應式壓縮特徵部之一纜線夾板來進一步促進高頻效能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A midboard cable connector assembly with a board connector and a cable connector. The board connector has terminals precisely positioned with respect to engagement features. A cable connector likewise has terminals precisely positioned with respect to complementary engagement features. When the connectors are pressed together for mating, the terminals of one or both connectors deform, generating a force that separates the connectors until the engagement features engage and block further backward motion. As the mating position is defined by the locations of the engagement features, the connectors can be designed with low over travel and a resulting short stub length, which promotes high frequency performance. High frequency performance is further promoted by a ground conductor interconnecting the beams forming mating contact portions of ground terminals, reducing the length of unconnected segments and by a cable clamp plate with compliant compression features that reduce distortion of the cables.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:電子系統</p>  
        <p type="p">2:印刷電路板(PCB)/電路板</p>  
        <p type="p">4:邊緣/面板</p>  
        <p type="p">6:子板/印刷電路子板/子卡</p>  
        <p type="p">8:組件/處理器</p>  
        <p type="p">10:散熱器</p>  
        <p type="p">12A:中板連接器/連接器/中板連接器總成</p>  
        <p type="p">12B:第二連接器/中板連接器總成/中板連接器</p>  
        <p type="p">14A:纜線</p>  
        <p type="p">14B:纜線</p>  
        <p type="p">16:第一端</p>  
        <p type="p">18:第二端</p>  
        <p type="p">20:I/O連接器/連接器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2163" publication-number="202613122"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613122.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613122</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145544</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>PRMT5抑制劑及其用途</chinese-title>  
        <english-title>PRMT5 INHIBITORS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D487/04</main-classification>  
        <further-classification edition="200601120260102B">C07D519/00</further-classification>  
        <further-classification edition="200601120260102B">C07D487/14</further-classification>  
        <further-classification edition="200601120260102B">A61K31/538</further-classification>  
        <further-classification edition="200601120260102B">A61K31/55</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4985</further-classification>  
        <further-classification edition="200601120260102B">A61K31/5383</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商基利科學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GILEAD SCIENCES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿姆斯壯　梅根　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARMSTRONG, MEGAN K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　阿爾伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIN, ELBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　建宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, CHIENHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>代比恩　勞倫特　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEBIEN, LAURENT P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧亦范</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DENG, YIFAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法爾　約書亞　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FARR, JOSHUA D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>古普塔　潘查　拉爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUPTA, PANCHAM LAL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪兆億</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, CHAO-I</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓊　班傑明　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNE, BENJAMIN J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑪哈傑　浦杉吉　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MUKHERJEE, PRASENJIT K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　賽娜　Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, SHAINA V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>諾特　葛雷高瑞　Ｔ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOTTE, GREGORY T.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅亞　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROA, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CO</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="14"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史基瑞爾　亞當　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHRIER, ADAM J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="15"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯彭思　凱蒂　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SPENCE, KATIE A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="16"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊　征宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, ZHENG-YU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉君怡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露大致上係關於抑制PRMT5之化合物。本揭露係進一步關於一種化合物用於製備用於透過抑制PRMT5治療疾病及/或病況的藥劑之用途。本揭露係進一步關於一種化合物用於治療與染色體9p21缺失、MTAP無效、或任何其他MTAP缺乏相關之疾病或病況之用途。本揭露係進一步關於一種化合物用於治療癌症之用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates generally to compounds that inhibit PRMT5. The disclosure further relates to the use of the compounds for the preparation of a medicament for the treatment of diseases and/or conditions through inhibiting PRMT5. The disclosure further relates to the use of the compounds for the treatment of a disease or condition associated with chromosome 9p21 deletion, MTAP null, or any other MTAP deficiency. The disclosure further relates to the use of the compounds for the treatment of cancers.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2164" publication-number="202612701"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612701.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612701</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145608</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雜環化合物</chinese-title>  
        <english-title>HETEROCYCLIC COMPOUND</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/506</main-classification>  
        <further-classification edition="200601120260102B">A61P25/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商大塚製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTSUKA PHARMACEUTICAL CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>篠原友一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINOHARA, TOMOICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岩田伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IWATA, SHIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木征希</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新井健太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAI, KENTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊藤展明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ITO, NOBUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>千葉拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIBA, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供由式 [I] 表示的新穎的雜環化合物及其鹽：其中，該等符號係如在說明書中所定義的，該等雜環化合物及其鹽用於治療、預防和/或診斷涉及癲癇發作或抽搐發作（包括多重抗藥性發作、難治性發作、急性症狀發作、熱性癲癇和癲癇持續狀態）的疾病之發作等，連同它們之醫學用途。 &lt;br/&gt;&lt;img align="absmiddle" height="124px" width="276px" file="ed10089.JPG" alt="ed10089.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a novel heterocyclic compound represented by Formula [I] and a salt thereof: wherein the symbols are as defined in the specification, which is useful for treating, preventing and/or diagnosing seizure and the like in disease involving epileptic seizure or convulsive seizure (including multiple drug resistant seizure, refractory seizure, acute symptomatic seizure, febrile seizure and status epilepticus), as well as a medical use therefor. &lt;br/&gt;&lt;img align="absmiddle" height="144px" width="335px" file="ed10090.JPG" alt="ed10090.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2165" publication-number="202612662"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612662.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612662</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145621</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>智齒牽引拉勾</chinese-title>  
        <english-title>WISDOM TOOTH TRACTION HOOK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">A61C7/02</main-classification>  
        <further-classification edition="200601120251229B">A61C7/12</further-classification>  
        <further-classification edition="200601120251229B">A61C7/28</further-classification>  
        <further-classification edition="200601120251229B">A61C7/30</further-classification>  
        <further-classification edition="200601120251229B">A61C3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳良誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIANG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺中市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳良誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, LIANG-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種智齒牽引拉勾，包括一握持桿、一長直部及一彎折部。該長直部的一端連接該握持桿的一前端，該彎折部連接該長直部的另一端，且該彎折部與該長直部之間的角度為90度以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wisdom tooth traction hook includes a holding rod, a long straight portion, and a bent portion. One end of the long straight portion is connected to a front end of the holding rod, and the bent portion is connected to the other end of the long straight portion. The angle between the bent portion and the long straight portion is greater than 90 degrees.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:握持桿</p>  
        <p type="p">11:前端</p>  
        <p type="p">2:延伸段</p>  
        <p type="p">21:長直部</p>  
        <p type="p">22:彎折部</p>  
        <p type="p">221:凹槽</p>  
        <p type="p">23:前凸塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2166" publication-number="202614615"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614615.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614615</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145657</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於視頻譯碼的濾波程序</chinese-title>  
        <english-title>FILTERING PROCESS FOR VIDEO CODING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260102B">H04N19/117</main-classification>  
        <further-classification edition="201401120260102B">H04N19/169</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡茲維克茲　馬塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KARCZEWICZ, MARTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王鴻滔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, HONGTAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳建樂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIANLE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯圖　梵卡達　梅荷　沙契特　阿納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOTRA, VENKATA MEHER SATCHIT ANAND</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於對經解碼的視頻資料進行濾波的示例設備包括：記憶體，其被配置為儲存視頻資料；以及一個或多個處理器，其在電路中實現並且被配置為：對視頻資料的區塊進行解碼以形成經解碼的區塊；將濾波器應用於經解碼的區塊以形成經濾波的區塊；將經濾波的區塊的樣本乘以縮放因子以形成經細化的經濾波的區塊；以及將經細化的經濾波的區塊的樣本與經解碼的區塊的對應樣本進行組合。一個或多個處理器還可以在對區塊進行解碼之前對區塊進行編碼。一個或多個處理器可以例如在包括區塊的圖片的圖片標頭中對表示縮放因子的語法元素的值進行編碼或解碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An example device for filtering decoded video data includes a memory configured to store video data; and one or more processors implemented in circuitry and configured to: decode a block of video data to form a decoded block; apply a filter to the decoded block to form a filtered block; multiply samples of the filtered block by a scaling factor to form a refined filtered block; and combine samples of the refined filtered block with corresponding samples of the decoded block. The one or more processors may further encode the block prior to decoding the block. The one or more processors may encode or decode a value of a syntax element representing the scaling factor, e.g., in a picture header of a picture including the block.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">410:步驟</p>  
        <p type="p">412:步驟</p>  
        <p type="p">414:步驟</p>  
        <p type="p">416:步驟</p>  
        <p type="p">418:步驟</p>  
        <p type="p">420:步驟</p>  
        <p type="p">422:步驟</p>  
        <p type="p">424:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2167" publication-number="202614537"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614537.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614537</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145659</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電機定子、電機及控制器之組裝方法</chinese-title>  
        <english-title>THE ASSEMBLY METHOD OF MOTOR STATOR, MOTOR AND CONTROLLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">H02K3/28</main-classification>  
        <further-classification edition="200601120251212B">H02K3/50</further-classification>  
        <further-classification edition="200601120251212B">H02K3/12</further-classification>  
        <further-classification edition="200601120251212B">H02K1/16</further-classification>  
        <further-classification edition="202501120251212B">H02K15/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鴻海精密工業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉家頊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, CHIA-HSU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林映竹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, YING-JU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃瑜智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YU-ZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents/> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供了一種電機定子、電機及控制器之組裝方法。電機定子包括電路板、至少一個導電輸出端子以及多個繞組。電路板開設有多個通孔，電路板構造有至少一相之導流電路。導電輸出端子安裝於電路板，且每一個導電輸出端子與對應一相之導流電路電性連接。繞組具有連接端。多個繞組均位於電路板背離導電輸出端子之一側，且每一個繞組之連接端對應穿設於一個通孔並與電路板焊。上述之電機定子不僅可以降低電機定子之體積，減小對電機內部裝配空間之佔用，且無需生產安裝人員手動結線，有利於提高電機之組裝效率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides an assembly method of motor stator, motor and controller. The motor stator comprises a circuit board, at least one conductive output terminal and multiple windings. The circuit board is provided with multiple through holes, and the circuit board is configured with at least one phase of a current diversion circuit. The conductive output terminals are installed on the circuit board, and each conductive output terminal is electrically connected to the corresponding phase of the current diversion circuit. The windings have connection ends. All the windings are located on one side of the circuit board away from the conductive output terminals, and the connection end of each winding is correspondingly passed through one through hole and welded to the circuit board. The above-mentioned motor stator can not only reduce the volume of the motor stator, reduce the occupation of the internal assembly space of the motor, but also does not require manual wiring by production and installation personnel, which is conducive to improving the assembly efficiency of the motor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">21:電路板</p>  
        <p type="p">2122:導線</p>  
        <p type="p">22:導電輸出端子</p>  
        <p type="p">23:繞組</p>  
        <p type="p">231:連接端</p>  
        <p type="p">70:連接孔</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2168" publication-number="202612621"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612621.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612621</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145732</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有可旋轉之支撐柱以及設置於支撐柱上之座椅的兒童搖椅</chinese-title>  
        <english-title>CHILD SWING HAVING A ROTATABLE COLUMN WITH SEAT DISPOSED THEREON</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251220B">A47D13/10</main-classification>  
        <further-classification edition="200601120251220B">A47D1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒙茲　強納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOUNTZ, JONATHAN K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯奈德　伊桑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SNYDER, ETHAN M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高銘良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種兒童搖椅包含基座、支撐柱、座椅、驅動機構及傾斜機構。基座支撐兒童搖椅於地板上。支撐柱自基座向上延伸且定義有旋轉軸。座椅被支撐柱支撐於支撐柱之上，使得座椅可繞著旋轉軸旋轉。驅動機構連接於基座及座椅之間以施力驅動座椅繞著旋轉軸週期性地旋轉。傾斜機構連接於座椅以及支撐柱之間且包含彼此可樞轉地連接的第一座椅安裝座以及第二座椅安裝座，使得座椅可繞著傾斜樞轉軸相對於支撐柱在複數個傾斜位置之間旋轉。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A child swing includes a base, a column, a seat, a drive mechanism and a recline mechanism. The base is configured to support the child swing on a floor. The column extends upwards from the base and defines an axis of rotation. The seat is supported by the column above the column so that the seat is configured to swing about the axis of rotation. The drive mechanism is coupled between the base and the seat applying a force to the seat to swing the seat periodically about the axis of rotation. The recline mechanism is coupled between the seat and the column including first and second seat mounts rotatably coupled to one another so that the seat is rotatable relative to the column about a recline pivot axis between a plurality of recline positions.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基座</p>  
        <p type="p">64:控制電路</p>  
        <p type="p">70:擺動作動感應器</p>  
        <p type="p">210:旋轉軸桿</p>  
        <p type="p">212:第一軸部</p>  
        <p type="p">212a:底端</p>  
        <p type="p">214:第二軸部</p>  
        <p type="p">232:樞轉軸桿</p>  
        <p type="p">234:轉子</p>  
        <p type="p">236:主軸</p>  
        <p type="p">238:軸承</p>  
        <p type="p">502:磁鐵</p>  
        <p type="p">504(2):第二端</p>  
        <p type="p">A&lt;sub&gt;R&lt;/sub&gt;:旋轉軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2169" publication-number="202614065"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614065.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614065</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145821</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置、記憶體系統及控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G11C16/06</main-classification>  
        <further-classification edition="200601120260102B">G11C16/34</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐野創</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANO, HAJIME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可抑制記憶體胞元的劣化的半導體記憶裝置、記憶體系統及控制方法。半導體記憶裝置的控制電路判定作為寫入對象的記憶體胞元所具有的第一臨限值電壓是否高於第二臨限值電壓，所述第二臨限值電壓是基於所述作為寫入對象的記憶體胞元中所記憶的資料而決定。在所述第一臨限值電壓高於所述第二臨限值電壓的情況下，所述控制電路使用所述擦除電壓來執行使所述作為寫入對象的記憶體胞元所具有的臨限值電壓降低的擦除動作，以使所述作為寫入對象的記憶體胞元記憶所述所記憶的資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A1、B1、C1、Er1:臨限值電壓範圍</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2170" publication-number="202613237"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613237.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613237</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145840</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>防藍光隱形眼鏡組合物、防藍光隱形眼鏡及其製造方法</chinese-title>  
        <english-title>ANTI-BLUE LIGHT CONTACT LENS COMPOSITION, ANTI-BLUE LIGHT CONTACT LENS AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">C08L33/14</main-classification>  
        <further-classification edition="200601120251212B">C08K5/103</further-classification>  
        <further-classification edition="200601120251212B">C08K5/132</further-classification>  
        <further-classification edition="200601120251212B">C08K5/42</further-classification>  
        <further-classification edition="200601120251212B">C08K5/5397</further-classification>  
        <further-classification edition="200601120251212B">B29D11/00</further-classification>  
        <further-classification edition="200601120251212B">G02B1/04</further-classification>  
        <further-classification edition="200601120251212B">G02C7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>望隼科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIZIONFOCUS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>苗栗縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林文卿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, WEN-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李靜芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHING-FANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳季晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, CHI-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種防藍光隱形眼鏡組合物，包括至少一種水膠單體、防藍光染料、交聯劑以及起始劑，其中防藍光染料包括乙烯磺酸鈉黃色染料和乙烯磺酸鈉藍色染料之至少其中之一。防藍光染料的含量占防藍光隱形眼鏡組合物的含量介於0.01 wt%至1 wt%。乙烯磺酸鈉黃色染料具有式(1)之結構，乙烯磺酸鈉藍色染料具有式(2)之結構，式(1)之結構和式(2)之結構如下所示： &lt;br/&gt;&lt;img align="absmiddle" height="142px" width="502px" file="ed10007.JPG" alt="ed10007.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;， &lt;br/&gt;&lt;img align="absmiddle" height="212px" width="500px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。 &lt;br/&gt;本發明還提供一種防藍光隱形眼鏡及其製造方法。本發明的防藍光隱形眼鏡具有防藍光功能，對波長380 nm至460 nm的光具有介於50~95%的藍光阻隔率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An anti-blue light contact lens composition including at least one hydrogel monomer, an anti-blue light dye, a crosslinking agent, and an initiator is provided, wherein the anti-blue light dye includes at least one of sodium vinyl sulfonate yellow dye and sodium vinyl sulfonate blue dye. The anti-blue light dye accounts for 0.01 wt% to 1 wt% of the anti-blue light contact lens composition. The sodium vinyl sulfonate yellow dye has a structure of formula (1), and the sodium vinyl sulfonate blue dye has a structure of formula (2). The structures of formula (1) and formula (2) are shown below: &lt;br/&gt;&lt;img align="absmiddle" height="142px" width="557px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;&lt;img align="absmiddle" height="223px" width="555px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. &lt;br/&gt;The present invention also provides an anti-blue light contact lens and a manufacturing method thereof. The anti-blue light contact lens of the present invention has an anti-blue light function and has a blue light blocking rate of 50~95% for light with a wavelength of 380 nm to 460 nm.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S100、S150、S200、S300、S400:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2171" publication-number="202613250"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613250.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613250</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145845</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>濾光器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">C09B57/00</main-classification>  
        <further-classification edition="200601120251217B">G02B5/22</further-classification>  
        <further-classification edition="200601120251217B">G02B5/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塩野和彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIONO, KAZUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>島田拓郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMADA, TAKURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>折田雄一朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORITA, YUICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種濾光器，其具備基材及介電體多層膜，該介電體多層膜作為最外層積層於上述基材之至少一個主面側，上述基材具有樹脂膜，該樹脂膜包含：色素(U)，其於二氯甲烷中在360～395 nm具有最大吸收波長；色素(A)，其於二氯甲烷中在600～800 nm具有最大吸收波長；及樹脂；且上述濾光器滿足特定之分光特性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1A:濾光器</p>  
        <p type="p">10:基材</p>  
        <p type="p">30:介電體多層膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2172" publication-number="202613306"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613306.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613306</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145848</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抑制核酸酶活性的方法、自細胞單離細胞核的方法及延展DNA的方法</chinese-title>  
        <english-title>METHODS OF INHIBITING NUCLEASE ACTIVITY, METHODS OF ISOLATING NUCLEI FROM CELLS, AND METHODS FOR EXTENDING DNA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C12N15/10</main-classification>  
        <further-classification edition="201801120260102B">C12Q1/6806</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>國立成功大學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺南市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江伯敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIANG, PO-MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛雅文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSUEH, YA-WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何美瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盛珮雯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容係關於一種抑制生物樣本中核酸酶活性的方法。依據本揭示內容某些實施方式，所述方法包含將生物樣本與金屬-螯合劑複合物混合。本揭示內容亦揭示一種藉由使用金屬-螯合劑複合物自生物樣本中的細胞單離細胞核的方法，以及於去氧核糖核酸的3’端添加去氧核糖核苷酸的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein is a method of inhibiting the activity of a nuclease in a biological sample. According to some embodiments of the present disclosure, the method comprises mixing the biological sample with a metal ion-chelator complex. Also disclosed herein is a method of isolating nuclei from cells in a biological sample by using the metal ion-chelator complex, and a method of adding a deoxyribonucleotide to the 3’ end of a deoxyribonucleic acid (DNA).</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2173" publication-number="202614071"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614071.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614071</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145892</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統及控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">G11C16/10</main-classification>  
        <further-classification edition="200601120251222B">G11C16/34</further-classification>  
        <further-classification edition="200601120251222B">G06F12/02</further-classification>  
        <further-classification edition="200601120251222B">G11C16/06</further-classification>  
        <further-classification edition="200601120251222B">G11C29/00</further-classification>  
        <further-classification edition="200601120251222B">G06F11/08</further-classification>  
        <further-classification edition="200601120251222B">G06F3/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本誠司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, SEIJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野田和敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NODA, KAZUTOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實現一種能夠有效率地實行資料寫入處理之記憶體系統。 &lt;br/&gt;　　若依據實施形態，則記憶體系統之控制器，係因應於從前述主機而收訊了第1寫入指令一事，而開始從前述主機而來之被與前述第1寫入指令相互附加有關連性之第1資料之收訊。前述控制器，係從前述複數之物理頁面之中的已完成第2資料之寫入並且尚未被實行讀取驗證之頁面，而選擇第1頁面。前述控制器，係對於前述所被選擇了的前述第1頁面，而實行讀取驗證。前述控制器，係將前述所收訊了的前述第1資料，寫入至被包含於前述複數之物理區塊之中之寫入目標區塊中的第2頁面中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">RV1:讀取驗證</p>  
        <p type="p">RV2:讀取驗證</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2174" publication-number="202614780"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614780.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614780</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145897</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於編程交叉電路的方法</chinese-title>  
        <english-title>METHOD FOR PROGRAMMING A CROSSBAR CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120260102B">H10B63/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商特憶智能科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TETRAMEM INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛　寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GE, NING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱恒芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, HENGFANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何秋遠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供了一種具有最小化寫入干擾的交叉電路。交叉電路可以包括多條位線與多條字線相交、多個交叉點器件以及一個或多個與多條位線操作性連接的第一電容器。多個交叉點器件中的每個均連接到至少一條字線和至少一條位線。該交叉電路還可以包括一個或多個與多條字線操作性連接的第二電容器。所述交叉電路還可以包括多條選擇線和/或一個或多個與選擇線操作性連接的第三電容器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides for crossbar circuits with minimized write disturbance. A crossbar circuit may include a plurality of bit lines intersecting with a plurality of word lines, a plurality of cross-point devices, and one or more first capacitors operatively connected to the plurality of bit lines. Each of the plurality of cross-point devices is connected to at least one of the plurality of word lines and at least one of the plurality of bit lines. The crossbar circuit may further include one or more second capacitors operatively connected to the plurality of word lines. The crossbar circuit may further include a plurality of select lines and/or one or more third capacitors operatively connected to the select lines.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400a:交叉矩陣電路</p>  
        <p type="p">401a:寄生電容</p>  
        <p type="p">401b:寄生電容</p>  
        <p type="p">401c:寄生電容</p>  
        <p type="p">411a:字線</p>  
        <p type="p">411n:字線</p>  
        <p type="p">413a:位線</p>  
        <p type="p">413m:位線</p>  
        <p type="p">415a:選擇線</p>  
        <p type="p">415n:選擇線</p>  
        <p type="p">420a:交叉點器件</p>  
        <p type="p">420b:交叉點器件</p>  
        <p type="p">420c:交叉點器件</p>  
        <p type="p">421a:RRAM器件</p>  
        <p type="p">421b:RRAM器件</p>  
        <p type="p">421c:RRAM器件</p>  
        <p type="p">430a:電容器</p>  
        <p type="p">430b:電容器</p>  
        <p type="p">440a:開關</p>  
        <p type="p">450a:開關</p>  
        <p type="p">450n:開關</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2175" publication-number="202613706"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613706.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613706</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145927</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反射型遮罩基底、反射型遮罩、及半導體元件之製造方法</chinese-title>  
        <english-title>REFLECTIVE MASK BLANK, REFLECTIVE MASK, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251218B">G03F1/24</main-classification>  
        <further-classification edition="201201120251218B">G03F1/52</further-classification>  
        <further-classification edition="201201120251218B">G03F1/64</further-classification>  
        <further-classification edition="200601120251218B">G03F7/20</further-classification>  
        <further-classification edition="200601120251218B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＨＯＹＡ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOYA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池邊洋平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEBE, YOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題為提供一種可滿足反射型相移遮罩所被要求的相移功能及光學特性，且高精度地進行遮罩檢查之反射型遮罩基底。 &lt;br/&gt;一種反射型遮罩基底，係於基板的主表面上依序具備多層反射膜、第1薄膜及第2薄膜；第2薄膜相對於該多層反射膜在波長13.5nm的光中之反射率的相對反射率R&lt;sub&gt;2&lt;/sub&gt;為3%以上；使得該第1薄膜在波長13.5nm的光中之消光係數為k&lt;sub&gt;1&lt;/sub&gt;，該第1薄膜的厚度為d&lt;sub&gt;1&lt;/sub&gt;[nm]時，係滿足(式1)的關係： &lt;br/&gt;(式1)21.5×k&lt;sub&gt;1&lt;/sub&gt;&lt;sup&gt;2&lt;/sup&gt;×d&lt;sub&gt;1&lt;/sub&gt;&lt;sup&gt;2&lt;/sup&gt;-52.5×k&lt;sub&gt;1&lt;/sub&gt;×d&lt;sub&gt;1&lt;/sub&gt;+32.1＞R&lt;sub&gt;2&lt;/sub&gt;。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Provided is a reflective mask blank that satisfies the phase shifting function and optical properties required for a reflective phase shift mask and which can perform a highly precise mask inspection. &lt;br/&gt;A reflective mask blank includes a multilayer reflective film, a first thin film, and a second thin film in this order on a main surface of a substrate, a relative reflectance R2 of the second thin film with respect to a reflectance of the multilayer reflective film in the light of 13.5nm wavelength is 3% or more, and an extinction coefficient k1 of the first thin film in the light of 13.5nm wavelength and a thickness d1 [nm] of the first thin film satisfy a relationship of (Formula 1). &lt;br/&gt;(Formula 1) 21.5×k&lt;sub&gt;1&lt;/sub&gt;&lt;sup&gt;2&lt;/sup&gt;×d&lt;sub&gt;1&lt;/sub&gt;&lt;sup&gt;2&lt;/sup&gt;-52.5×k&lt;sub&gt;1&lt;/sub&gt;×d&lt;sub&gt;1&lt;/sub&gt;+32.1＞R&lt;sub&gt;2&lt;/sub&gt;</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2176" publication-number="202613051"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613051.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613051</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145935</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>作為光學玻璃材料之四硼酸鍶</chinese-title>  
        <english-title>STRONTIUM TETRABORATE AS OPTICAL GLASS MATERIAL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C03C3/14</main-classification>  
        <further-classification edition="201501120260102B">G02B1/113</further-classification>  
        <further-classification edition="200601120260102B">G02B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科磊股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KLA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊　勇和　艾力克斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUANG, YUNG-HO ALEX</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>肖　寅瑩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIAO-LI, YINYING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>MX</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛吉諾夫瓦　艾琳娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOGINOVA, ELENA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費爾登　約翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FIELDEN, JOHN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">四硼酸鍶可用作一光學材料。四硼酸鍶展現高折射率、高光學損壞臨限值及高的微硬度。四硼酸鍶之透射窗涵蓋自130 nm至3200 nm之一非常廣之波長範圍，從而使該材料在VUV波長下尤其有用。由四硼酸鍶製成之一光學組件可併入於一光學系統中，諸如一半導體檢測系統、一度量衡系統或一微影系統。此等光學組件可包含鏡面、透鏡、透鏡陣列、稜鏡、光束分離器、窗、燈單元或布魯斯特角光學器件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Strontium tetraborate can be used as an optical material. Strontium tetraborate exhibits high refractive indices, high optical damage threshold, and high microhardness. The transmission window of strontium tetraborate covers a very broad range of wavelengths, from 130 nm to 3200 nm, making the material particularly useful at VUV wavelengths. An optical component made of strontium tetraborate can be incorporated in an optical system, such as a semiconductor inspection system, a metrology system, or a lithography system. These optical components may include mirrors, lenses, lens arrays, prisms, beam splitters, windows, lamp cells or Brewster-angle optics.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">201:燈單元</p>  
        <p type="p">202:電漿</p>  
        <p type="p">203:窗</p>  
        <p type="p">205:寬頻紫外光</p>  
        <p type="p">211:雷射</p>  
        <p type="p">212:雷射束</p>  
        <p type="p">213:鏡面</p>  
        <p type="p">214:透鏡</p>  
        <p type="p">225:透鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2177" publication-number="202614239"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614239.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614239</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114145996</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>側邊可焊接無引線封裝</chinese-title>  
        <english-title>SIDE-SOLDERABLE LEADLESS PACKAGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H01L21/58</main-classification>  
        <further-classification edition="200601120251217B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商先科公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMTECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝森　漢芮　迪斯卡洛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BATHAN, HENRY DESCALZO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>PH</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種引線架係藉由化學半蝕刻一片導電材料來加以形成。該半蝕刻係露出該引線架的一第一接點的一第一側表面。一焊料可濕層係被電鍍在該第一接點的該第一側表面之上。一密封劑係在電鍍該焊料可濕層之後被沉積在該引線架之上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A leadframe is formed by chemically half-etching a sheet of conductive material. The half-etching exposes a first side surface of a first contact of the leadframe. A solder wettable layer is plated over the first side surface of the first contact. An encapsulant is deposited over the leadframe after plating the solder wettable layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">28:接點</p>  
        <p type="p">30:側表面</p>  
        <p type="p">34:缺口</p>  
        <p type="p">40:分隔件</p>  
        <p type="p">58:凹口</p>  
        <p type="p">70:密封劑/模製化合物</p>  
        <p type="p">80:側邊可焊接的無引線封裝(SLP)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2178" publication-number="202613740"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613740.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613740</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146009</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感光體單元、匣盒、電子照片影像形成裝置</chinese-title>  
        <english-title>PHOTOSENSITIVE MEMBER UNIT, CARTRIDGE AND ELECTROPHOTOGRAPHIC IMAGE FORMING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G03G21/18</main-classification>  
        <further-classification edition="200601120251229B">G03G15/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤野俊輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJINO, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木輝彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, TERUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河井太刀夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAWAI, TACHIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平山明延</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAYAMA, AKINOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上竜太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, RYUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浜田孝俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMADA, TAKATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林田誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHIDA, MAKOTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新川悠介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIIKAWA, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題]使感光體單元發展。 &lt;br/&gt;　　[解決手段]可相對於影像形成裝置的裝置主體進行裝卸的感光體單元，具有可繞旋轉軸線進行旋轉的感光體、第1齒輪部以及具有複數個齒的第2齒輪部。前述第1齒輪部，為具備斜齒的斜齒齒輪部，前述斜齒，隨著沿前述感光體的旋轉軸線從前述感光體遠離而朝以前述感光體的旋轉軸線為中心的第1圓周方向扭轉；在前述感光體的旋轉軸線的方向上，在前述第1齒輪部與前述感光體之間配置前述第2齒輪部；在前述感光體的旋轉軸線的方向上，在前述第1齒輪部與前述第2齒輪部之間設置間隙；前述第2齒輪部的前述複數個齒，包含具備以下突起部的齒：(i)第1突起部，其至少延伸於前述感光體的旋轉軸線的方向；以及(ii)第2突起部，其配置於比前述第1突起部的至少一部分在前述第1圓周方向上靠下游，且比前述第1突起部的至少一部分在前述感光體的旋轉軸線的方向上配置於前述第1齒輪部的附近。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2763d:第2齒輪部</p>  
        <p type="p">2763dm:斜齒部</p>  
        <p type="p">2763dn:突起部</p>  
        <p type="p">2763dt:第2斜齒</p>  
        <p type="p">2763du:鉤爪部</p>  
        <p type="p">2763dv:抵接部</p>  
        <p type="p">L1:旋轉軸線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2179" publication-number="202614541"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614541.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614541</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146053</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線性致動器及操作方法</chinese-title>  
        <english-title>LINEAR ACTUATOR AND METHOD OF OPERATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H02K33/00</main-classification>  
        <further-classification edition="200601120251229B">B01D1/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商泰坦觸覺公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TITAN HAPTICS INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>司徒　正然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SZETO, TIMOTHY JING YIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種線性致動器包括：一質量塊，可移動地安裝在一線性位移路徑中，該質量塊具有一磁性段；一驅動力產生器，經組配來選擇性地在該線性位移路徑的該定向上將加速度施加至該質量塊；及一反作用力路徑，當該質量塊自一靜止位置位移時產生一返回力。該返回力處於該線性位移路徑的該定向上且朝向該靜止位置，該返回力的該振幅根據一力回應曲線隨該質量塊在該線性位移路徑中的該位置而變化，該反作用力路徑包含一永磁力元件，該永磁力元件與該線性位移路徑橫向相鄰地安置且與該磁性段磁耦合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A linear actuator comprising a mass movably mounted in a linear displacement path, the mass having a magnetic segment, a drive force generator configured to selectively impart acceleration to the mass in the orientation of the linear displacement path, and a reactive force path generating a return force when the mass is displaced from a rest position. The return force being in the orientation of the linear displacement path and towards the rest position, the amplitude of the return force varying as a function of the position of the mass in the linear displacement path in accordance with a force response curve, the reactive force path including a permanent magnet force element disposed transversally adjacent to the linear displacement path and magnetically coupled with the magnetic segment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:力元件</p>  
        <p type="p">102:磁場，永磁場</p>  
        <p type="p">104,112:質量塊</p>  
        <p type="p">106:磁力元件</p>  
        <p type="p">108:橫向側</p>  
        <p type="p">122:線性致動器</p>  
        <p type="p">124:線性位移路徑</p>  
        <p type="p">144:磁性段</p>  
        <p type="p">146:縱向端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2180" publication-number="202613628"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613628.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613628</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146058</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括具有二維擴展的光導光學元件的光學系統及用於製造供光學系統中使用的光導光學元件的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G02B6/24</main-classification>  
        <further-classification edition="200601120251229B">G02B5/12</further-classification>  
        <further-classification edition="200601120251229B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>以色列商魯姆斯有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUMUS LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹齊格　尤奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DANZIGER, YOCHAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>切里基　羅寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHRIKI, RONEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格爾貝格　喬納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GELBERG, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學系統，包括光導光學元件（LOE，Light-guide Optical Element，），該光導光學元件具有處於不同取向的第一組相互平行的部分反射表面和第二組相互平行的部分反射表面。兩組部分反射表面均位於平行主外表面之間。部署在耦入區域處的第三組至少部分反射表面接收從具有光學孔徑的投影儀注入的圖像照明，該光學孔徑具有第一面內寬度，並且第三組至少部分反射表面經由圖像照明的至少一部分在第三組至少部分反射小平面處的反射將圖像照明以有效光學孔徑朝向第一組部分反射小平面引導，該有效光學孔徑具有大於第一寬度的第二寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:投影儀</p>  
        <p type="p">202,204,206,211:小平面(部分)</p>  
        <p type="p">200,207,209:波導(部分)，區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2181" publication-number="202614016"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614016.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614016</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146081</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置</chinese-title>  
        <english-title>DISPLAY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251229B">G09G3/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申顯哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, HYUN CHYOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李喜元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HEE WON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>辛相學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, SANG HAK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李載光</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JAE KWANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴炯宣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, HYOUNG SUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅炫錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, HYUN SEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙成洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, SEONG SOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸耿旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUK, KYEONG MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>侯德銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種顯示裝置，其包括：絕緣層，設置在基板上；複數個第一電極及接觸電極，設置在絕緣層上；鈍化層，覆蓋第一電極，並暴露第一電極的一部分；複數個發光元件，設置在複數個第一電極上；焊料圖案，設置在第一電極與發光元件之間；以及第二電極，設置在複數個發光元件上。第一電極包含：第一金屬層，與焊料圖案接觸；第二金屬層，設置在第一金屬層下方；以及第三金屬層，設置在第二金屬層下方。第二金屬層的光反射率大於第一金屬層和第三金屬層的光反射率。鈍化層具有第一開孔，其暴露第一電極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a display device that includes an insulating layer disposed on a substrate; a plurality of first electrodes and contact electrodes disposed on the insulating layer; a passivation layer covering the first electrode while exposing a portion of the first electrode; a plurality of light-emitting elements disposed on the plurality of first electrodes; a solder pattern disposed between the first electrode and the light-emitting element; and a second electrode disposed on the plurality of light-emitting elements. The first electrode includes a first metal layer in contact with the solder pattern, a second metal layer disposed under the first metal layer, and a third metal layer disposed under the second metal layer. A light reflectivity of the second metal layer is greater than a light reflectivity of the first and third metal layers. The passivation layer has a first opening hole exposing the first electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:發光元件</p>  
        <p type="p">10-1:第一導電半導體層</p>  
        <p type="p">10-2:主動層</p>  
        <p type="p">10-3:第二導電半導體層</p>  
        <p type="p">14:第二驅動電極</p>  
        <p type="p">15:第一驅動電極</p>  
        <p type="p">20:像素驅動電路</p>  
        <p type="p">110:基板</p>  
        <p type="p">121:緩衝層</p>  
        <p type="p">122:絕緣層</p>  
        <p type="p">130:堤部圖案</p>  
        <p type="p">131:堤部圖案的一側</p>  
        <p type="p">133:鈍化層</p>  
        <p type="p">133a:第一開孔</p>  
        <p type="p">141:第一光學層</p>  
        <p type="p">161:第一電極</p>  
        <p type="p">161a:連接部分</p>  
        <p type="p">162:焊料圖案</p>  
        <p type="p">170:第二電極</p>  
        <p type="p">190:黑色矩陣</p>  
        <p type="p">RT2:第二連接線</p>  
        <p type="p">TL6:第六訊號線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2182" publication-number="202613833"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613833.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613833</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146141</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於UCIe的資料傳輸方法、人工智能芯片、記錄媒體及電子裝置</chinese-title>  
        <english-title>DATA TRANSMISSION METHOD BASED ON UCIE, ARTIFICIAL INTELLIGENCE CHIP, STORAGE MEDIUM, AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251212B">G06F13/42</main-classification>  
        <further-classification edition="200601120251212B">G06F11/07</further-classification>  
        <further-classification edition="200601120251212B">H04L1/08</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海壁仞科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHANGHAI BIREN TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>發明人放棄姓名表示權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種基於UCIe的資料傳輸方法、人工智能芯片、電腦可讀取記錄媒體及電子裝置。基於UCIe的資料傳輸方法包括以下步驟：通過第一芯粒的模組端與第二芯粒的模組夥伴端進行通信；當模組夥伴端接收到重新訓練觸發信號時，復位模組夥伴端的電路，並且通過模組端發出重新訓練要求信號至模組夥伴端；當模組夥伴端接收到重新訓練要求信號時，通過模組夥伴端回復重新訓練響應信號至模組端；以及當模組端接收到重新訓練響應信號時，使模組端進入重新訓練狀態。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A data transmission method based on universal chiplet interconnect express （UCIe）, an artificial intelligence chip, a computer-readable storage medium, and an electronic device are provided. The data transmission method based on UCIe includes the following steps： communicating between a module end of a first chip and a module partner end of a second chip; when the module partner end receives a retraining trigger signal, resetting the circuit of the module partner end and sending a retraining request signal to the module partner end through the module end; when the module partner end receives the retraining request signal, replying with a retraining response signal to the module end through the module partner end; and when the module end receives the retraining response signal, entering a retraining state.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S210~S240:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2183" publication-number="202612736"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612736.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612736</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146146</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>DLL3靶向之多特異性抗原結合分子及其用途</chinese-title>  
        <english-title>DLL3-TARGETING MULTISPECIFIC ANTIGEN-BINDING MOLECULES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K39/395</main-classification>  
        <further-classification edition="200601120260102B">C07K16/28</further-classification>  
        <further-classification edition="200601120260102B">C07K16/46</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商中外製藥股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHUGAI SEIYAKU KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>直井壯太朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAOI, SOTARO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮舒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FENG, SHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>井川智之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IGAWA, TOMOYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何　菽文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HO, SHU WEN SAMANTHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供多特異性抗原結合分子，其包括第一抗原結合部分及第二抗原結合部分，其中每一個皆可結合至CD3及CD137，但不同時結合至CD3及CD137；以及可結合至DLL3的第三抗原結合部分，較佳為人類DLL3，其更有效率地誘導T細胞依賴性細胞毒性，同時避免其他多特異性抗原結合分子可能具有的不良毒性問題或副作用。本發明提供藉由包括抗原結合分子作為活性成分的能夠治療不同癌症的多特異性抗原結合分子及醫藥組成物，特別是DLL3相關。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The disclosure provides multispecific antigen-binding molecules that comprise a first antigen-binding moiety and a second antigen-binding moiety, each of which is capable of binding to CD3 and CD137, but does not bind to CD3 and CD137 at the same time; and a third antigen-binding moiety that is capable of binding to DLL3, preferably human DLL3, which induce T-cell dependent cytotoxity more efficiently whilst circumventing adverse toxicity concerns or side effects that other multispecific antigen-binding molecules may have. The present invention provides multispecific antigen-binding molecules and pharmaceutical compositions that can treat various cancers, especially those associated with DLL3, by comprising the antigen-binding molecule as an active ingredient.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2184" publication-number="202613109"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613109.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613109</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146188</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於儲存用於[18F]FP-CIT合成的線型前驅物的液體組成物及試劑盒、用於提高用於[18F]FP-CIT合成的線型前驅物的儲存穩定性的組成物、用於穩定用於[18F]FP-CIT合成的線型前驅物的方法、以及用於製備[18F]FP-CIT的試劑盒及方法</chinese-title>  
        <english-title>LIQUID COMPOSITION AND KIT FOR STORING LINEAR FORM PRECURSOR FOR [18F]FP-CIT SYNTHESIS, COMPOSITION FOR IMPROVING STORAGE STABILITY OF LINEAR FORM PRECURSOR FOR [18F]FP-CIT SYNTHESIS, METHOD FOR STABILIZING LINEAR FORM PRECURSOR FOR [18F]FP-CIT SYNTHESIS, AND METHOD AND KIT FOR PREPARING [18F]FP-CIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D451/02</main-classification>  
        <further-classification edition="200601120260102B">C07B63/00</further-classification>  
        <further-classification edition="200601120260102B">C07B59/00</further-classification>  
        <further-classification edition="200601120260102B">A61K51/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>財團法人峨山社會福祉財團</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THE ASAN FOUNDATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高娜麗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KO, NARE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明是有關於一種用於儲存用於[&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT合成的線型前驅物的液體組成物及試劑盒、用於提高用於[&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT合成的線型前驅物的儲存穩定性的組成物、用於穩定用於[&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT合成的線型前驅物的方法以及用於製備[&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT的試劑盒及方法，並且當使用具有根據本發明的特性的有機溶劑來儲存（保存）用於[&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT合成的線型前驅物時，所述有機溶劑可有效地用作[&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT的起始材料，乃因其不僅可藉由抑制用於[&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT合成的線型前驅物轉化為環狀鹽型式或降解為各種化合物而維持高純度的用於[&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT合成的線型前驅物，而且亦可在原樣使用現有的[&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT標記條件的同時以高產率製備放射性藥物[&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to a liquid composition and a kit for storing a linear form precursor for [&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT synthesis, a composition for improving storage stability of a linear form precursor for [&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT synthesis, a method for stabilizing a linear form precursor for [&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT synthesis, and a method and a kit for preparing [&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT, and when the organic solvent having the characteristics according to the present invention is used for storing (preserving) a linear form precursor for [&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT synthesis, the organic solvent can be usefully used as a starting material of [&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT because it is possible not only to maintain the linear form precursor for [&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT synthesis at high purity by suppressing the conversion of the linear form precursor for [&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT synthesis into a cyclic salt form or degradation into various compounds, but also to prepare a radiopharmaceutical [&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT at a high yield while using the existing [&lt;sup&gt;18&lt;/sup&gt;F]FP-CIT labeling conditions as they are.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2185" publication-number="202614113"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614113.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614113</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146224</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>保護元件</chinese-title>  
        <english-title>PROTECTION ELEMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01H85/38</main-classification>  
        <further-classification edition="200601120251229B">H01H85/10</further-classification>  
        <further-classification edition="200601120251229B">H01H85/165</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商迪睿合股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEXERIALS CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>米田吉弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YONEDA, YOSHIHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之保護元件具備：熔絲元件，其於自第1端部向第2端部之第1方向被通電；遮蔽構件；及外殼，其於內部設置有收納前述熔絲元件與前述遮蔽構件之收容部。前述遮蔽構件具有板狀部，該板狀部之第1面與熔絲元件對向配置，第2面與在與第1方向交叉之第2方向延伸之旋轉軸相接地配置，且具有自熔絲元件觀察到之板狀部之面積就於板狀部與旋轉軸之接觸位置分斷而成之第1面積與第2面積不同之構成。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:熔絲元件</p>  
        <p type="p">3:遮蔽構件</p>  
        <p type="p">3a:第1遮蔽構件</p>  
        <p type="p">3b:第2遮蔽構件</p>  
        <p type="p">4:罩</p>  
        <p type="p">4a:傾斜面</p>  
        <p type="p">6:外殼</p>  
        <p type="p">6a:第1外殼</p>  
        <p type="p">6b:第2外殼</p>  
        <p type="p">21:第1端部</p>  
        <p type="p">22:第2端部</p>  
        <p type="p">23:切斷部(縮窄部)</p>  
        <p type="p">24a:第1彎曲部</p>  
        <p type="p">24b:第2彎曲部</p>  
        <p type="p">33:旋轉軸</p>  
        <p type="p">34:遮蔽構件收容槽</p>  
        <p type="p">38:凸部</p>  
        <p type="p">41:第1端</p>  
        <p type="p">42:第2端</p>  
        <p type="p">60:收容部</p>  
        <p type="p">61:第1端子</p>  
        <p type="p">61a,62a:外部端子孔</p>  
        <p type="p">62:第2端子</p>  
        <p type="p">64:插入孔</p>  
        <p type="p">65:熔絲元件載置面</p>  
        <p type="p">66:導引孔</p>  
        <p type="p">68:凹部</p>  
        <p type="p">71:內壓緩衝空間</p>  
        <p type="p">72:端構件</p>  
        <p type="p">73:第1緩衝用凹部</p>  
        <p type="p">78:第1接著劑注入口</p>  
        <p type="p">100:保護元件</p>  
        <p type="p">A-A′:線</p>  
        <p type="p">X,Y,Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2186" publication-number="202613671"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613671.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613671</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146305</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於近視眼的隱形眼鏡以及向近視眼提供方向提示以抑制近視進展的方法</chinese-title>  
        <english-title>CONTACT LENS FOR MYOPIA EYE AND METHOD FOR PROVIDING DIRECTIONAL CUE TO MYOPIA EYE TO INHIBIT MYOPIA PROGRESSION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G02C7/04</main-classification>  
        <further-classification edition="200601120251229B">G02B3/06</further-classification>  
        <further-classification edition="200601120251229B">A61B3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>澳大利亞商恩塔米克控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NTHALMIC HOLDING PTY LTD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亨泰光學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BRIGHTEN OPTIX CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芭卡羅朱　拉維　錢德拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAKARAJU, RAVI CHANDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃爾曼　克勞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EHRMANN, KLAUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法爾克　達林</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FALK, DARRIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AU</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　怡璁</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, RICHARD I-TSUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本公開涉及用於與眼睛異常的眼睛（例如近視或近視加散光）的隱形眼鏡鏡片。本發明涉及一種用於管理近視或近視加散光的隱形眼鏡；其中所述隱形眼鏡鏡片配置有基本圍繞光軸為中心定義的光學區，以提供子午和方位角變化的光度分佈，至少部分導致所述近視眼睛的中央凹矯正，並且至少部分地導致所述近視眼睛的視網膜處的部分模糊視錐信號，用作方向提示或光學停止信號；以及圍繞光學區的非光學周邊載體區，該非光學週邊載體區配置有不變的方位角厚度分佈，可以具有旋轉輔助特徵，以進一步提供時間上和空間上變化的停止信號以減速，控制，抑制或降低近視發展的速率，並隨時間變化保持基本一致。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100b:隱形眼鏡的正視圖</p>  
        <p type="p">110b:隱形眼鏡的截面圖</p>  
        <p type="p">101b:光學中心</p>  
        <p type="p">102b:光學區域</p>  
        <p type="p">103b:混合區域</p>  
        <p type="p">104b:非光學週邊載體區域</p>  
        <p type="p">1040:方位角厚度分佈</p>  
        <p type="p">105b:鏡片直徑</p>  
        <p type="p">106b:子午光度分佈函數</p>  
        <p type="p">107b:方位角光度分佈函數</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2187" publication-number="202614656"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614656.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614656</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146316</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線通訊系統中的使用者設備、供無線通訊系統中的使用者設備使用的方法、無線通訊系統中的基地台及供無線通訊系統中的基地台使用的方法</chinese-title>  
        <english-title>USER EQUIPMENT IN A WIRELESS COMMUNICATION SYSTEM, METHOD FOR USE BY A USER EQUIPMENT IN A WIRELESS COMMUNICATION SYSTEM, A BASE STATION IN A WIRELESS COMMUNICATION SYSTEM AND METHOD FOR USE BY A BASE STATION IN A WIRELESS COMMUNICATION SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251229B">H04W48/12</main-classification>  
        <further-classification edition="202301120251229B">H04W72/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商韋勒斯標準與技術協會公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILUS INSTITUTE OF STANDARDS AND TECHNOLOGY INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧珉錫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NOH, MINSEOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>崔庚俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOI, KYUNGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭眞三</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWAK, JINSAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於在無線通訊系統中藉由終端接收下行通道的方法，包括：從基地台接收與位於一個載波中的第一資源區域中的保護頻帶有關的第一資訊；從前述基地台接收與多個資源集有關的第二資訊，前述多個資源集中的每一個基於前述第一資訊在前述第一資源區域中藉由前述保護頻帶識別；以及從前述基地台接收藉由前述第二資訊指示的可用於接收前述下行通道的資源上的下行通道。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for receiving a downlink channel by a terminal in a wireless communication system includes： receiving, from a base station, first information related to a guard band in a first resource region located in one carrier; receiving, from the base station, second information related to multiple resource sets, each of which is identified by the guard band in the first resource region on the basis of the first information; and receiving, from the base station, a downlink channel on a resource indicated by the second information to be available for reception of the downlink channel.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2188" publication-number="202614660"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614660.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614660</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146320</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>無線電裝置及用於偵測使用者的近接度的方法</chinese-title>  
        <english-title>RADIO DEVICE AND METHOD FOR DETECTING PROXIMITY OF USERS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120251229B">H04W52/24</main-classification>  
        <further-classification edition="200901120251229B">H04W52/04</further-classification>  
        <further-classification edition="201801120251229B">H04W4/02</further-classification>  
        <further-classification edition="200601120251229B">G01S13/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬特森　安德　斯文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATTSON, ANDERS SVEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲依吉　傑納迪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FEYGIN, GENNADY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>達亞爾　帕拉那夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAYAL, PRANAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林孟閱</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧姵君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳怡如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露用於在無線電裝置的特定距離內偵測使用者的近接度的系統及方法。方法包含：經由無線電裝置的傳輸器及天線傳輸訊號；經由接收器及天線接收所接收訊號；處理所接收訊號以區分自使用者反射的訊號與所傳輸訊號的漏泄部分；以及回應於處理降低無線電裝置的功率。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system and method for detecting proximity of a user within a particular distance of a radio device is disclosed. The method includes transmitting a signal via a transmitter and antenna of the radio device, receiving a received signal via a receiver and the antenna, processing the received signal for distinguishing a signal reflected from the user from a leaked portion of the transmitted signal, and reducing power of the radio device in response to the processing.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200、202、204、206、208、210、212:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2189" publication-number="202614034"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614034.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614034</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146340</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>同步模式轉換</chinese-title>  
        <english-title>SYNCHRONIZED MODE TRANSITION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">G10K11/175</main-classification>  
        <further-classification edition="200601120251219B">H04R3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉克什米那拉雅南　坎樂許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LAKSHMINARAYANAN, KAMLESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅伯茲　馬克安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERTS, MARK ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>畢恩　雅各強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEAN, JACOB JON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>祖魯嘉　華特安德斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZULUAGA, WALTER ANDRES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾維斯　羅吉歐古迪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALVES, ROGERIO GUEDES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>BR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了用於同步模式轉換的方法、系統、電腦可讀取媒體、設備和裝置。被配置為耳部佩戴的第一設備包括處理器，該處理器被配置為在第一上下文模式下，基於音訊資料來產生音訊信號。該處理器亦被配置為：在第一上下文模式下，與第二設備交換對第一時間的時間指示。該處理器亦被配置為：基於時間指示，在第一時間處從第一上下文模式轉換到第二上下文模式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods, systems, computer-readable media, devices, and apparatuses for synchronized mode transitions are presented. A first device configured to be worn at an ear includes a processor configured to, in a first contextual mode, produce an audio signal based on audio data. The processor is also configured to, in the first contextual mode, exchange a time indication of a first time with a second device. The processor is further configured to, at the first time, transition from the first contextual mode to a second contextual mode based on the time indication.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102:信號處理電路</p>  
        <p type="p">202:麥克風</p>  
        <p type="p">204:輸入</p>  
        <p type="p">208:接近感測器</p>  
        <p type="p">210:揚聲器</p>  
        <p type="p">212:耳塞</p>  
        <p type="p">214:cybma掛鉤</p>  
        <p type="p">216:殼體</p>  
        <p type="p">D10R:耳機</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2190" publication-number="202613522"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613522.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613522</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146400</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>感測裝置、感測方法及感測運算元件</chinese-title>  
        <english-title>SENSING APPARATUS, SENSING METHOD AND SENSING COMPUTING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251229B">G01N21/359</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商光程研創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARTILUX, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>那允中</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NA, YUN-CHUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林德松</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, DER-SONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張閎智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, HUNG-CHIH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳書履</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, SHU-LU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請是提供用於感測物體之感測裝置、感測方法及感測運算元件。感測裝置可包括一感測器，感測器包含一光偵測單元，用於吸收：（i）一具有一第一波長之第一入射光，以產生一第一偵測訊號；及（ii）一具有一第二波長之第二入射光，以產生一第二偵測訊號。感測裝置可進一步包括一耦接於感測器之計算電路。計算電路可依據第一偵測訊號及第二偵測訊號而輸出一計算結果。感測裝置可進一步包括一耦接於計算電路之調整電路。調整電路可依據計算結果而對一或多種與感測裝置關聯之機能執行一調整。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Sensing apparatus, sensing method and sensing computing device for sensing objects are provided. A sensing apparatus can include a sensor comprising a photo-detecting unit configured to absorb (i) a first incident light having a first wavelength to generate a first detecting signal and (ii) a second incident light having a second wavelength to generate a second detecting signal. The sensing apparatus can further include a calculation circuit coupled to the sensor. The calculation circuit can be configured to output a calculating result according to the first detecting signal and the second detecting signal. The sensing apparatus can further include an adjustment circuit coupled to the calculation circuit. The adjustment circuit can be configured to perform an adjustment to one or more functionalities associated with the sensing apparatus according to the calculating result.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:感測裝置</p>  
        <p type="p">102:寬頻感測器、感測器</p>  
        <p type="p">104:計算電路</p>  
        <p type="p">106:調整電路</p>  
        <p type="p">IL1:第一入射光</p>  
        <p type="p">IL2:第二入射光</p>  
        <p type="p">SO:感測器輸出訊號、感測器輸出</p>  
        <p type="p">ED:計算結果</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2191" publication-number="202613653"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613653.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613653</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146448</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透鏡模組</chinese-title>  
        <english-title>LENS MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G02B13/00</main-classification>  
        <further-classification edition="200601120251229B">G02B9/62</further-classification>  
        <further-classification edition="200601120251229B">G02B13/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴一容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, IL YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種透鏡模組，包含：具有折射能力的第一透鏡、具有折射能力的第二透鏡、具有折射能力的第三透鏡、具有折射能力的第四透鏡、具有折射能力且具有凹狀的物側表面及凹狀的像側表面的第五透鏡以及具有折射能力及凹狀的像側表面的第六透鏡。第一透鏡至第六透鏡自物側至像側依序配置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A lens module includes a first lens having refractive power, a second lens having refractive power, a third lens having refractive power, a fourth lens having refractive power, a fifth lens having refractive power and having a concave object-side surface and a concave image-side surface, and a sixth lens having refractive power and a concave image-side surface. The first to sixth lenses are sequentially disposed from an object side to an image side.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:第六透鏡</p>  
        <p type="p">70:紅外線截止濾光片</p>  
        <p type="p">80:影像感測器</p>  
        <p type="p">100:透鏡模組</p>  
        <p type="p">ST:光欄</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2192" publication-number="202614613"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614613.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614613</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146482</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用率失真最佳化在視訊編碼之影像再成形</chinese-title>  
        <english-title>IMAGE RESHAPING IN VIDEO CODING USING RATE DISTORTION OPTIMIZATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120251223B">H04N19/107</main-classification>  
        <further-classification edition="201401120251223B">H04N19/117</further-classification>  
        <further-classification edition="201401120251223B">H04N19/147</further-classification>  
        <further-classification edition="201401120251223B">H04N19/159</further-classification>  
        <further-classification edition="201401120251223B">H04N19/176</further-classification>  
        <further-classification edition="201401120251223B">H04N19/46</further-classification>  
        <further-classification edition="201401120251223B">H04N19/503</further-classification>  
        <further-classification edition="201401120251223B">H04N19/82</further-classification>  
        <further-classification edition="201401120251223B">H04N19/85</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商杜拜研究特許公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOLBY LABORATORIES LICENSING CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹　鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>浦方君</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PU, FANGJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂陶然</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, TAORAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡薩克　瓦爾特　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUSAK, WALTER J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥卡錫　尚恩　湯瑪士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCCARTHY, SEAN THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊名宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">鑑於呈一第一碼字表示之影像之一序列，呈現用於利用率失真最佳化來影像再成形之方法、程序及系統，其中再成形允許以一第二碼字表示編碼影像，該第二碼字表示允許比利用該第一碼字表示更高效率之壓縮。本發明亦呈現用於傳信再成形參數之語法方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Given a sequence of images in a first codeword representation, methods, processes, and systems are presented for image reshaping using rate distortion optimization, wherein reshaping allows the images to be coded in a second codeword representation which allows more efficient compression than using the first codeword representation. Syntax methods for signaling reshaping parameters are also presented.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200D_D:架構</p>  
        <p type="p">265-3:反再成形函數</p>  
        <p type="p">270:迴路濾波</p>  
        <p type="p">280:框間預測器/框間預測區塊</p>  
        <p type="p">282:正向再成形函數</p>  
        <p type="p">284:框內預測區塊</p>  
        <p type="p">285:重建模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2193" publication-number="202613806"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613806.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613806</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146585</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用融合緩衝器進行運算元管理的處理器、方法與電腦可讀取媒體</chinese-title>  
        <english-title>PROCESSOR, METHOD, AND COMPUTER READABLE MEDIUM FOR OPERAND MANAGEMENT USING FUSION BUFFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251224B">G06F9/30</main-classification>  
        <further-classification edition="201801120251224B">G06F9/38</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查奇克　蘭　阿哈倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHACHICK, RAN AHARON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布亞爾　拉傑迪普　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BHUYAR, RAJDEEP L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>言康弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAN, KANGHONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">揭示涉及使用一融合緩衝器的運算元管理的技術。一種處理器包括運算元管理電路系統，其中該運算元管理電路系統包括一融合緩衝器，及執行電路系統。在一個實施例中，該運算元管理電路系統經組態以偵測可執行以儲存可由一或多個消耗指令操作使用的運算元值的一第一儲存指令操作且將該第一儲存指令操作儲存在該融合緩衝器中。回應於偵測到與該第一儲存指令操作關聯的一丟棄狀況，該運算元管理電路系統經組態以將該第一儲存指令操作從該融合緩衝器移除而不轉發該第一儲存指令操作以供執行。回應於偵測到一緩衝器騰空狀況且未偵測到該丟棄狀況，該運算元管理電路系統經組態以轉發該第一儲存指令操作以供該執行電路系統執行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Techniques are disclosed involving operand management using a fusion buffer. A processor includes operand management circuitry, where the operand management circuitry includes a fusion buffer, and execution circuitry. In one embodiment, the operand management circuitry is configured to detect a first storage instruction operation that is executable to store operand values usable by one or more consumer instruction operations and store the first storage instruction operation in the fusion buffer. In response to detecting a drop condition associated with the first storage instruction operation, the operand management circuitry is configured to remove the first storage instruction operation from the fusion buffer without forwarding the first storage instruction operation for execution. In response to detecting a buffer vacate condition and not detecting the drop condition the operand management circuitry is configured to forward the first storage instruction operation for execution by the execution circuitry.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:處理器</p>  
        <p type="p">102:運算元管理電路系統；電路系統</p>  
        <p type="p">104:融合緩衝器</p>  
        <p type="p">106:執行電路系統；電路系統</p>  
        <p type="p">108:資料記憶體</p>  
        <p type="p">110:暫存器</p>  
        <p type="p">112:儲存指令操作；指令操作；儲存操作</p>  
        <p type="p">114:消耗指令操作；指令操作</p>  
        <p type="p">116:經融合指令操作</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2194" publication-number="202614571"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614571.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614571</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146593</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>音訊處理電路</chinese-title>  
        <english-title>AUDIO PROCESSING CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251217B">H03M1/12</main-classification>  
        <further-classification edition="200601120251217B">H03M1/06</further-classification>  
        <further-classification edition="200601120251217B">H03M3/00</further-classification>  
        <further-classification edition="200601120251217B">H04S3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商星宸科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅晨輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, CHEN-HUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李春斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, CHUN-BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳准</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, ZHUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薛建鋒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XUE, JIAN-FENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林昱礽</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳彥誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹縣</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露了一種音訊處理電路，包含：一時脈產生電路、一第一類比數位轉換器、一第二類比數位轉換器、一第一數據對齊電路以及一第二數據對齊電路。時脈產生電路用來產生一第一取樣時脈及一第二取樣時脈。第一類比數位轉換器用來根據該第一取樣時脈將一輸入訊號轉換成一第一數位碼。第二類比數位轉換器用來根據該第二取樣時脈將該輸入訊號轉換成一第二數位碼。第一數據對齊電路用來接收該第一數位碼，並且產生一第三數位碼。第二數據對齊電路用來接收該第二數位碼，並且產生一第四數位碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An audio processing circuit includes a clock generation circuit, a first analog-to-digital converter (ADC), a second ADC, a first data alignment circuit, and a second data alignment circuit. The clock generation circuit is configured to generate a first sampling clock and a second sampling clock. The first ADC is configured to convert an input signal into a first digital code according to the first sampling clock. The second ADC is configured to convert the input signal into a second digital code according to the second sampling clock. The first data alignment circuit is configured to receive the first digital code and generate a third digital code. The second data alignment circuit is configured to receive the second digital code and generate a fourth digital code.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202:低壓差穩壓器</p>  
        <p type="p">510:音訊處理電路</p>  
        <p type="p">512,514:ADC(類比數位轉換器)</p>  
        <p type="p">516:時脈產生電路</p>  
        <p type="p">CLK1,CLK2:取樣時脈</p>  
        <p type="p">D1,D2,D1a,D2a:數位碼</p>  
        <p type="p">VDD:電源電壓</p>  
        <p type="p">Vin:輸入訊號</p>  
        <p type="p">517,518:數據對齊電路</p>  
        <p type="p">CLK_a1,CLK_a2:時脈</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2195" publication-number="202613050"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613050.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613050</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146657</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>尺寸穩定的玻璃</chinese-title>  
        <english-title>DIMENSIONALLY STABLE GLASSES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">C03C3/076</main-classification>  
        <further-classification edition="200601120251226B">C03C3/089</further-classification>  
        <further-classification edition="200601120251226B">G02F1/13</further-classification>  
        <further-classification edition="200601120251226B">C03B17/06</further-classification>  
        <further-classification edition="200601120251226B">H01L23/15</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商康寧公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORNING INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾利森　亞當詹姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ELLISON, ADAM JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇贊斯基　提摩西詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KICZENSKI, TIMOTHY JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金　伊蓮安妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KING, ELLEN ANNE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>湯迪亞　阿達馬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANDIA, ADAMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦何西　柯胡由帕拉羅姆畢迪那瑪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VARGHEESE, KOCHUPARAMBIL DEENAMMA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實質無鹼的玻璃具高退火點而有良好尺寸穩定性（亦即，低壓縮性），故可用作非晶矽、氧化物和低溫多晶矽TFT製程中的TFT背板基板。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Glasses that are substantially free of alkalis that possess high annealing points and, thus, good dimensional stability (i.e., low compaction) for use as TFT backplane substrates in amorphous silicon, oxide and low-temperature polysilicon TFT processes.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2196" publication-number="202614420"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614420.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614420</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146677</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括貫通電極的半導體晶片以及包括其的半導體封裝件</chinese-title>  
        <english-title>SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L23/498</main-classification>  
        <further-classification edition="200601120251229B">H01L23/485</further-classification>  
        <further-classification edition="200601120251229B">H01L23/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫晧榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, HO YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNG KYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李美仙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MI SEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體晶片可以包括：主體部分，主體部分具有前表面和後表面；一對貫通電極，該一對貫通電極穿透主體部分；絕緣層，絕緣層設置在主體部分的後表面和該一對貫通電極上；以及後連接電極，後連接電極設置在絕緣層上並且同時與該一對貫通電極連接，其中，該一對貫通電極之間的距離大於絕緣層的厚度的兩倍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor chip may include: a body portion with a front surface and a rear surface; a pair of through electrodes penetrating the body portion; an insulating layer disposed over the rear surface of the body portion and the pair of through electrodes; and a rear connection electrode disposed over the insulating layer and connected simultaneously with the pair of through electrodes, wherein a distance between the pair of through electrodes is greater than twice a thickness of the insulating layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">210:初始主體部分</p>  
        <p type="p">210A:主體部分</p>  
        <p type="p">211:前表面</p>  
        <p type="p">212A:後表面</p>  
        <p type="p">220:佈線部分</p>  
        <p type="p">230A:貫通電極</p>  
        <p type="p">230PA:電源貫通電極</p>  
        <p type="p">230SA:信號貫通電極</p>  
        <p type="p">240P:電源後連接電極</p>  
        <p type="p">240S:信號後連接電極</p>  
        <p type="p">250:前連接電極</p>  
        <p type="p">260:接合層</p>  
        <p type="p">280A:絕緣層</p>  
        <p type="p">292A:含金屬薄膜層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2197" publication-number="202614421"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614421.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614421</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146685</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括貫通電極的半導體晶片以及包括其的半導體封裝件</chinese-title>  
        <english-title>SEMICONDUCTOR CHIP INCLUDING THROUGH ELECTRODE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L23/498</main-classification>  
        <further-classification edition="200601120251229B">H01L23/485</further-classification>  
        <further-classification edition="200601120251229B">H01L23/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商愛思開海力士有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SK HYNIX INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫晧榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, HO YOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金成圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SUNG KYU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李美仙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, MI SEON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種半導體晶片可以包括：主體部分，主體部分具有前表面和後表面；一對貫通電極，該一對貫通電極穿透主體部分；絕緣層，絕緣層設置在主體部分的後表面和該一對貫通電極上；以及後連接電極，後連接電極設置在絕緣層上並且同時與該一對貫通電極連接，其中，該一對貫通電極之間的距離大於絕緣層的厚度的兩倍。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A semiconductor chip may include: a body portion with a front surface and a rear surface; a pair of through electrodes penetrating the body portion; an insulating layer disposed over the rear surface of the body portion and the pair of through electrodes; and a rear connection electrode disposed over the insulating layer and connected simultaneously with the pair of through electrodes, wherein a distance between the pair of through electrodes is greater than twice a thickness of the insulating layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">210:初始主體部分</p>  
        <p type="p">210A:主體部分</p>  
        <p type="p">211:前表面</p>  
        <p type="p">212A:後表面</p>  
        <p type="p">220:佈線部分</p>  
        <p type="p">230A:貫通電極</p>  
        <p type="p">230PA:電源貫通電極</p>  
        <p type="p">230SA:信號貫通電極</p>  
        <p type="p">240P:電源後連接電極</p>  
        <p type="p">240S:信號後連接電極</p>  
        <p type="p">250:前連接電極</p>  
        <p type="p">260:接合層</p>  
        <p type="p">280A:絕緣層</p>  
        <p type="p">292A:含金屬薄膜層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2198" publication-number="202613608"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613608.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613608</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146710</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光吸收體、附光吸收體之物品、及光吸收性組成物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G02B5/22</main-classification>  
        <further-classification edition="200601120260102B">B32B27/18</further-classification>  
        <further-classification edition="200601120260102B">C09D5/32</further-classification>  
        <further-classification edition="202101120260102B">G03B11/00</further-classification>  
        <further-classification edition="202501120260102B">H10F39/12</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日本板硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIPPON SHEET GLASS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>久保雄一郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUBO, YUICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">光吸收體10於0°之入射角度之穿透光譜滿足下述條件，（I）波長480nm～580nm之範圍中之穿透率之平均值為78％以上；（II）波長350nm～380nm之範圍中之穿透率之最大值為1％以下；（III）波長800nm～950nm之範圍中之穿透率之最大值為7％以下；（IV）波長400nm中之穿透率為10％以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">無</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:光吸收體</p>  
        <p type="p">1a:濾光器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2199" publication-number="202614766"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614766.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614766</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146734</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三維記憶體裝置</chinese-title>  
        <english-title>THREE-DIMENSIONAL MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251229B">H10B41/30</main-classification>  
        <further-classification edition="202301120251229B">H10B41/35</further-classification>  
        <further-classification edition="202301120251229B">H10B41/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商長江存儲科技有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANGTZE MEMORY TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張坤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, KUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　文犀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, WEN-XI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>夏志良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XIA, ZHI-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍宗亮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUO, ZONG-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊長峯</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">3D記憶體裝置包括周邊電路、儲存堆疊體、半導體層、多個通道結構及源極接觸部。儲存堆疊體處於周邊電路上方，且包括交替的導電層和介電質層。半導體層處於儲存堆疊體上方。通道結構各自垂直地貫穿儲存堆疊體延伸到半導體層中，其中，每個通道結構包括半導體通道，半導體層包圍半導體通道，半導體通道延伸到半導體層中的部分並與其接觸。源極接觸處部於儲存堆疊體上方並且與半導體層接觸。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A 3D memory device includes a peripheral circuit, a storage stack, a semiconductor layer, a plurality of channel structures and a source contact. The storage stack is disposed above the peripheral circuit and includes alternating conductive layers and dielectric layers. The semiconductor layer is disposed above the storage stack. Each channel vertically extends through the storage stack into the semiconductor layer. Each channel structure includes a semiconductor channel, and the semiconductor layer surrounds the semiconductor channel. The semiconductor channel extends to a portion of the semiconductor layer and contacts the semiconductor layer. The source contact is located above the storage stack and contacts the semiconductor layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:3D記憶體裝置</p>  
        <p type="p">101:基底</p>  
        <p type="p">102:第一半導體結構</p>  
        <p type="p">104:第二半導體結構</p>  
        <p type="p">106:鍵合介面</p>  
        <p type="p">108:周邊電路</p>  
        <p type="p">110、112:鍵合層</p>  
        <p type="p">111、113:鍵合接觸部</p>  
        <p type="p">114:儲存堆疊體</p>  
        <p type="p">116:導電層</p>  
        <p type="p">118:介電質層</p>  
        <p type="p">120:N型摻雜半導體層</p>  
        <p type="p">122:半導體插塞</p>  
        <p type="p">124:通道結構</p>  
        <p type="p">126:儲存膜</p>  
        <p type="p">127:頂部分</p>  
        <p type="p">128:半導體通道</p>  
        <p type="p">129:通道插塞</p>  
        <p type="p">130:絕緣結構</p>  
        <p type="p">132:源極接觸部</p>  
        <p type="p">133:互連層</p>  
        <p type="p">134:ILD層</p>  
        <p type="p">136:重新分佈層</p>  
        <p type="p">138:鈍化層</p>  
        <p type="p">140:接觸焊墊</p>  
        <p type="p">142、144:接觸部</p>  
        <p type="p">146、148:周邊接觸部</p>  
        <p type="p">150:通道局部接觸部</p>  
        <p type="p">152:字元線局部接觸部</p>  
        <p type="p">x，y:軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2200" publication-number="202613772"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613772.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613772</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146736</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及其製造方法</chinese-title>  
        <english-title>DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251218B">G06F1/16</main-classification>  
        <further-classification edition="200601120251218B">G09F9/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>平形吉晴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRAKATA, YOSHIHARU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一實施方式的目的之一是：提供可折疊的新穎顯示裝置或使用該新穎顯示裝置的電子裝置，例如，可攜式資訊處理裝置及通信資訊設備。實現能夠將一個顯示面板折疊n次(n&lt;img align="absmiddle" height="15px" width="10px" file="d10029.TIF" alt="其他非圖式ed10029.png" img-content="character" orientation="portrait" inline="no" giffile="ed10029.png"/&gt;1，n為自然數)的顯示裝置，該折疊方式為將顯示面以1mm以上且100mm以下的曲率半徑向內側和外側交替折疊。藉由使顯示裝置可折疊，可以實現顯示裝置的小型化。另外，在展開撓性顯示面板的狀態下，可以實現在多個外殼之間連續而無間隙的顯示。因為可以在多個外殼的內部適當地設置有電路、電子零件、電池等，所以可以減薄各外殼的厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A novel foldable display device or an electronic device using the same, e.g., a portable information processor or a portable communication information device, is provided. A foldable display device of which a display panel can be folded &lt;i&gt;n&lt;/i&gt; times (&lt;i&gt;n&lt;/i&gt;&lt;img align="absmiddle" height="14px" width="11px" file="d10030.TIF" alt="其他非圖式ed10030.png" img-content="character" orientation="portrait" inline="no" giffile="ed10030.png"/&gt; 1, and &lt;i&gt;n&lt;/i&gt; is a natural number) at a curvature radius of greater than or equal to 1 mm and less than or equal to 100 mm is obtained. The display device can be miniaturized by being foldable. In addition, in the state where the flexible display panel is opened, display which is unbroken and continuous over a plurality of housings is possible. The plurality of housings can store a circuit, an electronic component, a battery and the like inside as appropriate, and the thickness of each housing can be small.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:撓性顯示面板</p>  
        <p type="p">102-2:撓性基板</p>  
        <p type="p">111-2:邊框部件</p>  
        <p type="p">112-2:邊框部件</p>  
        <p type="p">113-2:邊框部件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2201" publication-number="202613644"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613644.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613644</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146820</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像系統</chinese-title>  
        <english-title>OPTICAL IMAGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251220B">G02B11/06</main-classification>  
        <further-classification edition="202101120251220B">G02B7/02</further-classification>  
        <further-classification edition="200601120251220B">G02B27/01</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金宗必</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, JONG PIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐立</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, SOT EUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李知秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JI SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像系統包括自物體側依次設置的第一透鏡、第二透鏡及第三透鏡。光學成像系統滿足1.2毫米＜ TTL ＜ 2.0毫米及0 ＜ f3/f ＜ 1.0，其中TTL是自第一透鏡的物體側表面至成像平面的距離，f是光學成像系統的焦距，且f3是第三透鏡的焦距。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging system includes a first lens, a second lens, and a third lens disposed in order from an object side. The optical imaging system satisfies 1.2 mm ＜ TTL ＜ 2.0 mm and 0 ＜ f3/f ＜ 1.0, where TTL is a distance from an object-side surface of the first lens to an imaging plane, f is a focal length of the optical imaging system, and f3 is a focal length of the third lens.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學成像系統</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">IF:濾光器</p>  
        <p type="p">IP:成像平面</p>  
        <p type="p">IS:影像感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2202" publication-number="202612960"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612960.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612960</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146913</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於自行車之座桿總成</chinese-title>  
        <english-title>SEAT POST ASSEMBLY FOR BICYCLE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B62J1/08</main-classification>  
        <further-classification edition="200601120251229B">B62J1/10</further-classification>  
        <further-classification edition="200601120251229B">B62J1/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商速聯有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SRAM, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錢伯斯　拉斐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAMBERS, RAFER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧拉普　查理斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUNLAP, CHARLES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於一自行車之座桿總成係包括一第一管，其具有一第一遠端；以及一第二管，其具有一第二遠端。當該第一管係在相對於該第二管之一第一位置時，在該第一管之該第一遠端與該第二管之該第二遠端之間的一距離係為一最大值。該座桿總成亦包括一第一腔室及一第二腔室，其等係可流體式耦接。該第一腔室為一正流體腔室，且該第二腔室為一負流體腔室。該座桿總成係包括設置在該第一腔室及該第二腔室中的一流體容積。該流體容積係包括一可壓縮流體。該第一腔室經組配可作用為一彈簧，組配來將該第一管朝向相對於該第二管之該第一位置偏壓。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A seat post assembly for a bicycle includes a first tube having a first distal end and a second tube having a second distal end. A distance between the first distal end of the first tube and the second distal end of the second tube is at a maximum when the first tube is in a first position relative to the second tube. The seat post assembly also includes a first chamber and a second chamber that are fluidly coupleable. The first chamber is a positive fluid chamber, and the second chamber is a negative fluid chamber. The seat post assembly includes a fluid volume disposed in the first chamber and the second chamber. The fluid volume includes a compressible fluid. The first chamber is configured to act as a spring configured to bias the first tube towards the first position relative to the second tube.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">124:座桿總成</p>  
        <p type="p">126:下管</p>  
        <p type="p">128:上管</p>  
        <p type="p">130:下遠端，第二遠端</p>  
        <p type="p">132:上遠端，第一端，第一遠端</p>  
        <p type="p">134:頭部</p>  
        <p type="p">136:凸起部</p>  
        <p type="p">138:第二端</p>  
        <p type="p">140:外部分</p>  
        <p type="p">142:密封頭</p>  
        <p type="p">144:填充閥，閥</p>  
        <p type="p">146:第一氣動腔</p>  
        <p type="p">148:第二氣動腔</p>  
        <p type="p">150:第一殘壓腔，第三氣動腔</p>  
        <p type="p">152:活塞</p>  
        <p type="p">154:活塞頭</p>  
        <p type="p">155:活塞軸</p>  
        <p type="p">156:塞幹</p>  
        <p type="p">158:端帽</p>  
        <p type="p">159:排放及填充閥，排放或止回閥</p>  
        <p type="p">160:搪孔</p>  
        <p type="p">162:肩部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2203" publication-number="202612619"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612619.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612619</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146927</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可運送一或多個兒童的推車系統</chinese-title>  
        <english-title>STROLLER SYSTEM TO TRANSPORT ONE OR MORE CHILDREN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251220B">A47D1/06</main-classification>  
        <further-classification edition="200601120251220B">B62B7/06</further-classification>  
        <further-classification edition="200601120251220B">B62B5/06</further-classification>  
        <further-classification edition="200601120251220B">B62B9/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰勒　安德魯Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAYLOR, ANDREW J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾格爾特　克洛伊　柯林Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EGGERT-CROWE, COLIN F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亨特里　約翰Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNTLEY, JOHN E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>基布勒　納撒尼爾Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KEEBLER, NATHANIEL W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈爾斯汀　柯堤斯Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARTENSTINE, CURTIS M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可從承載一位兒童轉換成承載兩位兒童，而無需從該推車移除一第一兒童承載裝置且無需添加轉接器到該推車的兒童推車系統。在安裝在該推車上時，兩兒童承載裝置係相對於該推車之底盤重新定位。一自立式且可折疊輔助籃可取代該等兒童承載裝置之一者而安裝在該推車上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A child stroller system can convert from carrying a single child to carrying two children without removing a first child-carrying apparatus from the stroller and without adding adapters to the stroller. Both child-carrying apparatuses can be repositioned with respect to the stroller’s chassis when mounted on the stroller. A self-standing and collapsible auxiliary basket can be mounted on the stroller in place of one of the child-carrying apparatuses.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:推車系統；推車；兒童推車</p>  
        <p type="p">105:推車構架；構架；可折疊構架</p>  
        <p type="p">112:可調整握把部位</p>  
        <p type="p">113:抓握部位；推車抓握部位</p>  
        <p type="p">114:固定握把部位；固定部位</p>  
        <p type="p">118:第一座椅調整握把；握把；座椅調整握把；調整握把</p>  
        <p type="p">120:第一兒童座椅；兒童座椅；第一兒童承載裝置；兒童承載裝置</p>  
        <p type="p">130:前支腳</p>  
        <p type="p">140:後支腳</p>  
        <p type="p">1200:輔助籃；籃子；置物籃子</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2204" publication-number="202613453"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613453.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613453</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146928</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>燈座模組及燈具系統</chinese-title>  
        <english-title>LAMP HOLDER MODULE AND LIGHTING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251220B">F21V17/16</main-classification>  
        <further-classification edition="200601120251220B">F21V19/04</further-classification>  
        <further-classification edition="201601320251220B">F21Y115/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚劭翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, SHAO-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>譚劭翰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, SHAO-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳紹良</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>桃園市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種燈具系統，包括一光源模組及一燈座模組，該燈座模組包括一燈座本體；一快拆連結元件固定座，設置在該燈座本體的一側，且該燈座本體的一側部分外露於該快拆連結元件固定座；一散熱模組，包含一散熱鰭片，該散熱鰭片設置在燈座本體的另一側用以提供散熱；一電控模組，該電控模組包含一電源供應器，透過該快拆連結元件固定座提供電源；該快拆連結元件固定座可以和該光源模組的一快拆連結元件快折固定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This invention provides a lighting system, including a light source module and a lamp holder module. The light source module includes a lamp holder body; a quick-release connector mounting bracket disposed on one side of the lamp holder body, with a portion of the lamp holder body exposed outside the quick-release connector mounting bracket; a heat dissipation module including a heat dissipation fin disposed on the other side of the lamp holder body for providing heat dissipation; and an electronic control module including a power supply that provides power through the quick-release connector mounting bracket. The quick-release connector mounting bracket can be quickly and easily fixed to a quick-release connector of the light source module.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:燈具系統</p>  
        <p type="p">11:光源模組</p>  
        <p type="p">12:燈座模組</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2205" publication-number="202613984"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613984.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613984</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146943</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於遊戲桌裝置之串通探測方法、遊戲桌裝置及遊戲桌裝置之非暫態儲存媒體</chinese-title>  
        <english-title>COLLUSION DETECTION METHOD FOR A GAMING TABLE DEVICE, GAMING TABLE APPARATUS, AND NON-TRANSITORY STORAGE MEDIUM OF A GAMING TABLE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251220B">G07F17/32</main-classification>  
        <further-classification edition="200601120251220B">A63F1/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商ＣＦＰＨ有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CFPH, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>帝喬凡尼　喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DIGIOVANNI, JOE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述了主要涉及串通的各種實施例。通過串通探測，可防止博彩場所的玩家違反遊戲公正性。本發明方法可追蹤玩家的操作，並為各種遊戲場景設置特定的投注概況。當一個玩家偏離自己的利益或者他的特定概況時，可認為其在進行串通操作。可提交關於串通的資訊用於評估，和/或在確定此種串通操作後可自動執行反串通操作。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various embodiments that may generally relate to collusion are described. Collusion detection may be used to prevent players in a wagering environment from violating the integrity of a game. Player actions may be tracked to develop a wagering profile that is specific to various game situations. A player acting in a manner that would be against their interest and against their defined profile may be considered a colluding action. Information about collusion actions may be presented for evaluation and/or anti-collusion actions may be automatically taken in response to such collusion actions being determined.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1201-1209:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2206" publication-number="202614115"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614115.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614115</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114146959</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於影響樣品的電荷狀態的方法與裝置以及電腦程式</chinese-title>  
        <english-title>METHOD AND DEVICE FOR INFLUENCING A CHARGE STATE OF A SAMPLE AND COMPUTER PROGRAM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H01J37/02</main-classification>  
        <further-classification edition="200601120251219B">H01J37/28</further-classification>  
        <further-classification edition="201201120251219B">G03F1/84</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮爾　漢斯艾爾曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PIEPER, HANS HERMANN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>埃姆里奇　丹尼爾亞歷山大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMMRICH, DANIEL ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇度慕迪凡卡塔拉曼　拉力薩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KODUMUDI VENKATARAMAN, LALITHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>克勒克爾　克勞蒂亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KROECKEL, CLAUDIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拜舒　凱瑟琳娜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BITSCH, KATHARINA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫拉克　芮尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KULLOCK, RENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明特別地關於一種用於影響樣品的電荷狀態的方法，包含將一帶電粒子束引導到樣品上，以用於分析及/或處理樣品，其中藉由第一加速電壓將粒子束的粒子加速到樣品上並導致樣品的充電，以及將帶電粒子束引導到樣品上，以用於影響樣品的充電，其中藉由至少達到第一加速電壓的15%的第二充電加速電壓將粒子束的粒子加速到樣品上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates, inter alia, to a method for influencing a charge state of a sample, comprising directing a charged particle beam onto the sample for the purpose of analysing and/or processing the sample, wherein the particles of the particle beam are accelerated onto the sample by a first acceleration voltage and result in charging of the sample, and directing the charged particle beam onto the sample for the purpose of influencing the charging of the sample, wherein the particles of the particle beam are accelerated onto the sample by a second, changed acceleration voltage amounting to at least 15% of the first acceleration voltage.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:圖表</p>  
        <p type="p">210:SEM加速電壓分布圖</p>  
        <p type="p">220:SEM粒子電流分布圖</p>  
        <p type="p">230:樣品電位分布圖</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2207" publication-number="202614588"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614588.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614588</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147013</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>實體層前序信號設計</chinese-title>  
        <english-title>PHYSICAL LAYER PREAMBLE DESIGN</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H04L5/00</main-classification>  
        <further-classification edition="200601120260102B">H04L27/26</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳嘉陵李</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, JIALING LI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費馬尼　薩米耶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VERMANI, SAMEER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>田　濱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TIAN, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案內容提供了用於產生封包前序信號的方法、設備和系統。更具體地，一些實現係關於支援根據IEEE 802.11標準的IEEE 802.11be修訂和之後的各代可實現的資料輸送量增益的前序信號設計。本實現的前序信號設計可以允許對信號欄位（SIG）符號進行更可靠的封包偵測、更準確的通道估計和更穩健的解碼以及其他實例。另外或替代地，與符合IEEE 802.11標準的現有版本的前序信號設計相比，本案內容的前序信號設計可以利用不同的長度、調制方案或傳輸功率來實現。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This disclosure provides methods, devices and systems for generating packet preambles. Some implementations more specifically relate to preamble designs that support gains in data throughput achievable in accordance with the IEEE 802.11be amendment, and future generations, of the IEEE 802.11 standard. Among other examples, the preamble designs of the present implementations may allow for more reliable packet detection, more accurate channel estimation, and more robust decoding of signal field (SIG) symbols. Additionally, or alternatively, the preamble designs of the present disclosure may be implemented with different lengths, modulation schemes, or transmit power compared to preamble designs that conform to existing versions of the IEEE 802.11 standard.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">900:PHY前序信號</p>  
        <p type="p">901:L-STF</p>  
        <p type="p">902:L-LTF</p>  
        <p type="p">903:L-SIG</p>  
        <p type="p">904:RL-SIG</p>  
        <p type="p">905:U-SIG</p>  
        <p type="p">906:EHT-SIG</p>  
        <p type="p">907:EHT-STF</p>  
        <p type="p">908:EHT-LTF</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2208" publication-number="202614151"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614151.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614151</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147034</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電漿處理裝置及電漿處理方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H01J37/32</main-classification>  
        <further-classification edition="200601120251219B">H05H1/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日立全球先端科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>今泉悟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IMAIZUMI, SATORU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>市川貴大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ICHIKAWA, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示之目的，係在於提供一種可使處理之良率提升的技術。電漿處理裝置(100)之裝置CPU(107)，係使用「表示在高頻電力的振幅大之期間PA與小之期間PB的任一期間(PA)開始後經過預定時間(TMV)後之期間(PA)中所檢測到的高頻電力之大小」的資訊，調節高頻電力之供給。而且，裝置CPU(107)，係具有可變地調節預定時間之長度(TMV)的功能。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2209" publication-number="202613743"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613743.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613743</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147060</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>電腦實施方法、用於工廠加工、設備及控制系統之動態監測及保護之系統、及非暫時性電腦可讀儲存媒體</chinese-title>  
        <english-title>COMPUTER-IMPLEMENTED METHOD, SYSTEM FOR DYNAMICALLY MONITORING AND SECURING FACTORY PROCESSES, EQUIPMENT AND CONTROL SYSTEMS, AND NON-TRANSITORY, COMPUTER-READABLE STORAGE MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G05B23/02</main-classification>  
        <further-classification edition="201901120251229B">G06N20/20</further-classification>  
        <further-classification edition="201301120251229B">G06F21/55</further-classification>  
        <further-classification edition="201301120251229B">G06F21/56</further-classification>  
        <further-classification edition="200601120251229B">G05B19/418</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商奈米創尼克影像公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NANOTRONICS IMAGING, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樸特曼　馬修　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PUTMAN, MATTHEW C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樸特曼　強恩　Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PUTMAN, JOHN B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>皮斯基　巴迪姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PINSKIY, VADIM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黎莫葛　達瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIMOGE, DAMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑斯壯　安德魯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNDSTROM, ANDREW</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>威廉斯　詹姆斯　三世</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WILLIAMS, JAMES III</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種包含一深度學習處理器之系統，其在一製程期間接收來自一工廠之加工、設備及控制(P/E/C)系統之一或多者之一或多個控制信號。該處理器為該等控制信號產生預期回應資料及預期行為模式資料。該處理器接收來自該工廠之P/E/C系統之該一或多者之生產回應資料並為該生產回應資料產生生產行為模式資料。該程序對以下至少一者進行比較：該生產回應資料與該預期回應資料，及該生產行為模式資料與該預期行為模式資料，以偵測異常活動。作為偵測異常活動之一結果，該處理器執行一或多個操作以提供通知或致使該工廠之P/E/C系統之一或多者解決該異常活動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A system including a deep learning processor receives one or more control signals from one or more of a factory’s process, equipment and control (P/E/C) systems during a manufacturing process. The processor generates expected response data and expected behavioral pattern data for the control signals. The processor receives production response data from the one or more of the factory’s P/E/C systems and generates production behavioral pattern data for the production response data. The process compares at least one of: the production response data to the expected response data, and the production behavioral pattern data to the expected behavioral pattern data to detect anomalous activity. As a result of detecting anomalous activity, the processor performs one or more operations to provide notice or cause one or more of the factory’s P/E/C systems to address the anomalous activity.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">118:深度學習處理器/深度學習控制器</p>  
        <p type="p">120:站控制器</p>  
        <p type="p">121:控制信號</p>  
        <p type="p">121a:控制信號</p>  
        <p type="p">121b:控制信號</p>  
        <p type="p">122:加工站</p>  
        <p type="p">124:中間輸出</p>  
        <p type="p">125:控制值</p>  
        <p type="p">125a:控制值</p>  
        <p type="p">125b:控制值</p>  
        <p type="p">126:控制輸入</p>  
        <p type="p">127:獨立感測器</p>  
        <p type="p">128:站值</p>  
        <p type="p">134a:中間輸出值</p>  
        <p type="p">136:通用輸入</p>  
        <p type="p">137:獨立感測器</p>  
        <p type="p">138:功能先驗</p>  
        <p type="p">139:經驗先驗</p>  
        <p type="p">140:站控制器</p>  
        <p type="p">141:控制信號</p>  
        <p type="p">141a:控制信號</p>  
        <p type="p">141b:控制信號</p>  
        <p type="p">142:加工站</p>  
        <p type="p">144:中間輸出</p>  
        <p type="p">144a:中間輸出值</p>  
        <p type="p">145:控制值</p>  
        <p type="p">145a:控制值</p>  
        <p type="p">145b:控制值</p>  
        <p type="p">146:控制輸入</p>  
        <p type="p">148:站值</p>  
        <p type="p">150:步驟</p>  
        <p type="p">160:步驟</p>  
        <p type="p">190:信號調節器</p>  
        <p type="p">191:信號調節器</p>  
        <p type="p">192:信號調節器</p>  
        <p type="p">193:信號調節器</p>  
        <p type="p">800:本地或中央資料處理伺服器</p>  
        <p type="p">820:步驟</p>  
        <p type="p">821:步驟</p>  
        <p type="p">830:步驟</p>  
        <p type="p">840:步驟</p>  
        <p type="p">841:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2210" publication-number="202614232"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614232.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614232</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147082</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>大面積/晶圓級　CMOS　相容製程的二維材料插層摻雜，包括摻雜合成石墨烯的摻雜工具、製程與方法</chinese-title>  
        <english-title>LARGE-AREA/WAFER-SCALE CMOS-COMPATIBLE 2D-MATERIAL INTERCALATION DOPING TOOLS, PROCESSES, AND METHODS, INCLUDING DOPING OF SYNTHESIZED GRAPHENE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L21/383</main-classification>  
        <further-classification edition="200601120251229B">H01J37/317</further-classification>  
        <further-classification edition="200601120251229B">H01J37/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商迪斯尼２Ｄ公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DESTINATION 2D INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴納吉　考斯塔夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BANERJEE, KAUSTAV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊延加　拉維</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IYENGAR, RAVI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑德爾　薩提許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNDAR, SATISH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐宏昇</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉俞佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種插層摻雜裝置，包括：反應腔室，用於將單一或多數晶圓或基板置放在其內，並用於在所述反應腔室內對所述單一或多數晶圓或基板的至少一個表面施加在2巴至500巴範圍內的壓力，其中所述單一或多數晶圓或基板具有25 mm至450 mm的直徑或兩側邊距；加熱器，用於向所述單一或多數晶圓或基板施加熱能，使其包括25 ℃至500 ℃的溫度；以及摻雜劑施加裝置，至少包括將摻雜劑從外部帶至所述反應腔室內的閥門和管道，以及至少一個摻雜劑坩堝，設置在所述反應腔室內，其中所述摻雜劑包括處於固相、液相或氣相的材料，且包括插層摻雜劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An intercalation doping apparatus including: a reactor chamber where single or multiple wafers or substrates (SoMWoSubs) are disposed within the reactor chamber, where SoMWoSubs have a diameter or a side distance from 25 mm to 450 mm; a heater, where the heater is configured to provide heat to the SoMWoSubs disposed within the reactor chamber, where the SoMWoSubs include a temperature from 25°C to 500°C; where pressure is applied to at least one surface of the SoMWoSubs disposed within the reactor chamber within a range of 2 bar to 500 bar; and a dopant application apparatus, where the dopant application apparatus includes at least valves and tubing which bring dopants from outside to within the reactor chamber and includes at least a dopant crucible disposed within the reactor chamber, where the dopants include material in solid, liquid, or gaseous phase, and where the dopants include intercalation doping agents.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:批次處理裝置</p>  
        <p type="p">102:反應腔室</p>  
        <p type="p">104:反應腔室門和密封件</p>  
        <p type="p">105:基板/晶圓</p>  
        <p type="p">106:槳葉</p>  
        <p type="p">108:摻雜劑處理氣體/霧氣入口</p>  
        <p type="p">110:全反應器處理室的內部空間</p>  
        <p type="p">112:多向高壓閥</p>  
        <p type="p">114:活塞室空間</p>  
        <p type="p">116:泵吹掃及加壓氣體</p>  
        <p type="p">118:加壓/排氣泵</p>  
        <p type="p">120:活塞運動軸</p>  
        <p type="p">122:活塞室</p>  
        <p type="p">124:螺線管或螺桿馬達</p>  
        <p type="p">126:活塞</p>  
        <p type="p">130:腔室側壁加熱器</p>  
        <p type="p">132:氣體3和4的額外設置</p>  
        <p type="p">134:腔室閥門</p>  
        <p type="p">140:氣體控制面板</p>  
        <p type="p">142:摻雜劑氣體混合區塊</p>  
        <p type="p">146:MFC(質量流量控制器)iso閥-輸出</p>  
        <p type="p">148:MFC(質量流量控制器)</p>  
        <p type="p">150:MFC iso閥-輸入</p>  
        <p type="p">152:氣體調節器</p>  
        <p type="p">154:顆粒過濾器</p>  
        <p type="p">156:摻雜劑1的氣瓶</p>  
        <p type="p">157:摻雜劑2的氣瓶</p>  
        <p type="p">158:無塵室氣體供應設施</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2211" publication-number="202613095"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613095.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613095</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147149</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>葡萄糖依賴性促胰島素多肽受體拮抗劑及其用途</chinese-title>  
        <english-title>GLUCOSE-DEPENDENT INSULINOTROPIC POLYPEPTIDE RECEPTOR ANTAGONISTS AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D401/12</main-classification>  
        <further-classification edition="200601120260102B">C07D403/12</further-classification>  
        <further-classification edition="200601120260102B">C07D207/16</further-classification>  
        <further-classification edition="200601120260102B">C07D209/56</further-classification>  
        <further-classification edition="200601120260102B">C07D401/14</further-classification>  
        <further-classification edition="200601120260102B">A61K31/506</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4439</further-classification>  
        <further-classification edition="200601120260102B">A61K31/40</further-classification>  
        <further-classification edition="200601120260102B">A61K31/4709</further-classification>  
        <further-classification edition="200601120260102B">A61K31/497</further-classification>  
        <further-classification edition="200601120260102B">A61K31/444</further-classification>  
        <further-classification edition="200601120260102B">A61P3/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商輝瑞大藥廠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PFIZER INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>菲里斯基　凱文　詹姆士</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FILIPSKI, KEVIN JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>費雪　伊桑　勞倫斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FISHER, ETHAN LAWRENCE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>管延飛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUAN, YANFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里維　山繆　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEVI, SAMUEL MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　基方</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, QIFANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬堤奈茲　艾爾席那　路易斯　安琪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MARTINEZ ALSINA, LUIS ANGEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐尼爾　史蒂芬　維特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>O'NEIL, STEVEN VICTOR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>潘查努拉　阿瓦塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PANCHAGNULA, ADVAITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍奇　丹妮卡　安東尼雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RANKIC, DANICA ANTONIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李斯　馬修　理查德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REESE, MATTHEW RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩蒙斯　馬修　佛瑞斯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMMONS, MATTHEW FORREST</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="12"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王陽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="13"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張　磊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, LEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱淑尹</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文描述式I化合物： &lt;br/&gt;&lt;img align="absmiddle" height="364px" width="353px" file="ed10361.JPG" alt="ed10361.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;及其醫藥學上可接受之鹽，其中R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、L&lt;sup&gt;1&lt;/sup&gt;、T&lt;sup&gt;1&lt;/sup&gt;、T&lt;sup&gt;2&lt;/sup&gt;、T&lt;sup&gt;3&lt;/sup&gt;、T&lt;sup&gt;4&lt;/sup&gt;、t1及t2在本文中定義；其作為GIPR拮抗劑之用途；含有此等化合物及鹽之醫藥組合物；及此等化合物及鹽用於治療或預防例如肥胖、體重增加及/或T2DM的用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described herein are compounds of Formula I: &lt;br/&gt;&lt;img align="absmiddle" height="379px" width="372px" file="ed10362.JPG" alt="ed10362.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;and their pharmaceutically acceptable salts, wherein R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, L&lt;sup&gt;1&lt;/sup&gt;, T&lt;sup&gt;1&lt;/sup&gt;, T&lt;sup&gt;2&lt;/sup&gt;, T&lt;sup&gt;3&lt;/sup&gt;, T&lt;sup&gt;4&lt;/sup&gt; , t1, and t2 are defined herein; their use as GIPR antagonists; pharmaceutical compositions containing such compounds and salts; and the use of such compounds and salts to treat or prevent, for example, obesity, weight gain, and/or T2DM.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2212" publication-number="202614039"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614039.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614039</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147152</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於深度學習語音情緒辨識與量化的方法、系統及裝置</chinese-title>  
        <english-title>METHOD, SYSTEM AND DEVICE OF SPEECH EMOTION RECOGNITION AND QUANTIZATION BASED ON DEEP LEARNING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120251222B">G10L25/63</main-classification>  
        <further-classification edition="200601120251222B">G10L15/08</further-classification>  
        <further-classification edition="201301120251222B">G10L21/0208</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹謙科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAMBOO TECHNOLOGY LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃筑萾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, CHU-YING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張連成</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, LIEN-CHENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪碩廷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUNG, SHUO-TING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邱宣翔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHIU, HSUAN-HSIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李貞儀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種學習語音情緒辨識的方法，包含接收並儲存原始語音資料；對該原始語音資料進行預處理，以產生預處理語音資料；接收並儲存多個情緒標註；根據該多個情緒標註，對該預處理語音資料進行處理，以產生處理後語音資料；輸入該處理後語音資料到一預訓練模型，以產生多個語音特徵向量；以及根據該多個情緒標註和該多個語音特徵向量，訓練一情緒辨識模組。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of learning speech emotion recognition is disclosed, and includes receiving and storing raw speech data, performing pre-processing to the raw speech data to generate pre-processed speech data, receiving and storing a plurality of emotional labels, performing processing to the pre-processed speech data according to the plurality of emotional labels to generate processed speech data, inputting the processed speech data to a pre-trained model to generate a plurality of speech embeddings, and training an emotion recognition module according to the plurality of emotional labels and the plurality of speech embeddings.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:流程</p>  
        <p type="p">31…36:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2213" publication-number="202613246"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613246.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613246</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147175</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>聚醯胺樹脂組成物及由該組成物構成之成形體、車載攝像機用零件</chinese-title>  
        <english-title>POLYAMIDE RESIN COMPOSITION AND MOLDED BODY MADE FROM THE COMPOSITION, AND PARTS FOR IN-VEHICLE CAMERA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">C08L77/06</main-classification>  
        <further-classification edition="200601120251222B">C08K3/40</further-classification>  
        <further-classification edition="200601120251222B">C08K7/02</further-classification>  
        <further-classification edition="200601120251222B">C08L71/12</further-classification>  
        <further-classification edition="200601120251222B">C08G69/26</further-classification>  
        <further-classification edition="200601120251222B">C08L67/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尤尼吉可股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNITIKA LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長畑聡記</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGAHATA, TOSHIKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪武雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳昭誠</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之聚醯胺樹脂組成物係含有半芳香族聚醯胺(A)100質量份、及填充材(B)70至250質量份，其中，射出成形體之在與射出成形時之樹脂的流動方向為正交之方向中之在80℃下之線膨脹係數為70×10&lt;sup&gt;-6&lt;/sup&gt;(1/℃)以下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A resin composition of the present invention contains 100 parts by mass of a semi-aromatic polyamide (A) and 70 to 250 parts by mass of a filler (B), wherein the linear expansion coefficient at 80℃ of the injection molded product in a direction orthogonal to the flow direction of the resin at the time of injection molding is 70 × 10&lt;sup&gt;-6&lt;/sup&gt; (1/℃) or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無。</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2214" publication-number="202614238"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614238.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614238</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147180</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>模組化互連單元、半導體封裝件和其製造方法</chinese-title>  
        <english-title>MODULAR INTERCONNECTION UNIT, SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">H01L21/56</main-classification>  
        <further-classification edition="200601120251222B">H01L21/60</further-classification>  
        <further-classification edition="200601120251222B">H01L23/28</further-classification>  
        <further-classification edition="200601120251222B">H01L23/488</further-classification>  
        <further-classification edition="200601120251222B">H01L23/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商ＪＣＥＴ星科金朋韓國有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JCET STATS CHIPPAC KOREA LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李賢哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, HYEONCHU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴敬熙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, KYOUNGHEE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金京煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, KYUNGHWAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李承炫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, SEUNGHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂紹凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪珮瑜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種模組化互連單元、一種半導體封裝件和其製造方法。所述方法包含：提供第一子封裝件，所述第一子封裝件包含第一基板、至少一個第一互連圖案、和至少一個第一電子元件；將至少一個模組化互連單元安裝於所述第一基板上，其中所述模組化互連單元包含介電層、穿過所述介電層的至少一個導電通孔、從所述介電層的上表面凸出的至少一個導電凸塊、和覆蓋所述導電凸塊且具有平坦的上表面的保護層，且所述導電通孔與所述第一互連圖案電耦接；在所述第一基板的上表面上形成第一密封劑；去除所述保護層的一部分以暴露所述導電凸塊的上表面；和將第二子封裝件安裝於所述第一密封劑上方。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:真空取放工具</p>  
        <p type="p">200:模組化互連單元</p>  
        <p type="p">210:介電層</p>  
        <p type="p">220:導電通孔</p>  
        <p type="p">230:導電凸塊</p>  
        <p type="p">240:保護層</p>  
        <p type="p">240a:上表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2215" publication-number="202614726"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614726.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614726</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147189</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>製冷劑迴圈裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251220B">H05K7/20</main-classification>  
        <further-classification edition="202101120251220B">F25B41/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商尼得科股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIDEC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡慶次銳彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKESHI, TOSHIHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>玉岡健人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAMAOKA, TAKEHITO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>濱野晉佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAMANO, SHINSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>村上拓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MURAKAMI, TAKU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安藤禎晃</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANDO, TOMOAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡邊大貴</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, HIROTAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>野野村尚也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NONOMURA, NAOYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦建譜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">製冷劑迴圈裝置具備：一次流路，所述一次流路是一次製冷劑的流路；二次流路，所述二次流路是二次製冷劑的流路；熱交換器，所述熱交換器與一次流路及二次流路連接；泵，所述泵與二次流路連接；以及框體，所述框體具有收納區域。收納區域在相互交叉的第一方向和第二方向上擴展，與第二方向相比，在第一方向上具有長尺寸。框體將一次流路、二次流路、熱交換器及泵收納於收納區域。熱交換器的整體位於比泵靠第二方向一側的位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">3:熱交換器</p>  
        <p type="p">4:泵</p>  
        <p type="p">5:罐</p>  
        <p type="p">7:電源單元</p>  
        <p type="p">8:觸控式螢幕</p>  
        <p type="p">2MB:歧管</p>  
        <p type="p">24:流路管</p>  
        <p type="p">25:流路管</p>  
        <p type="p">41:抓手</p>  
        <p type="p">51:注入口</p>  
        <p type="p">53:空氣抽出閥</p>  
        <p type="p">90:收納區域</p>  
        <p type="p">91:板</p>  
        <p type="p">92:板</p>  
        <p type="p">92B:框體二次出口</p>  
        <p type="p">93:板</p>  
        <p type="p">94:板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2216" publication-number="202614454"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614454.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614454</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147347</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>藉由導電黏合劑對導電膜片進行塗佈的方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01M4/04</main-classification>  
        <further-classification edition="201001120251229B">H01M4/13</further-classification>  
        <further-classification edition="200601120251229B">H01M4/64</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商馬修斯國際有限責任公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATTHEWS INTERNATIONAL GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商馬修斯國際有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATTHEWS INTERNATIONAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈克堡　托馬斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HACKFORT, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>袁鐵生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉偉隆</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係有關於一種藉由導電黏合劑對導電膜片進行塗佈的方法，其特徵在於，該方法包括提供導電膜片以及藉由導電黏合劑對該導電膜片進行印刷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:黏合劑，導電黏合劑</p>  
        <p type="p">2:饋送系統</p>  
        <p type="p">3:饋送系統</p>  
        <p type="p">4:輥子</p>  
        <p type="p">5:輥子</p>  
        <p type="p">6:輥子</p>  
        <p type="p">7:輥子</p>  
        <p type="p">9:收卷軸</p>  
        <p type="p">10:集電體，膜片，導電膜片</p>  
        <p type="p">11:第二輥縫</p>  
        <p type="p">12:輥縫</p>  
        <p type="p">13:第一輥縫</p>  
        <p type="p">14:第三輥縫</p>  
        <p type="p">20:乾電極膜</p>  
        <p type="p">21:乾電極膜</p>  
        <p type="p">22:乾電極材料</p>  
        <p type="p">100:多輥砑光機</p>  
        <p type="p">110:電極，乾電極</p>  
        <p type="p">200:柔性印刷裝置</p>  
        <p type="p">201:進料管線</p>  
        <p type="p">202:腔式刮刀</p>  
        <p type="p">203:網紋輥</p>  
        <p type="p">204:印版滾筒</p>  
        <p type="p">205:放卷軸</p>  
        <p type="p">210:膜片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2217" publication-number="202613674"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613674.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613674</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147354</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示器系統</chinese-title>  
        <english-title>DISPLAY SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G02F1/133</main-classification>  
        <further-classification edition="202301120251229B">H10K50/00</further-classification>  
        <further-classification edition="202301120251229B">H10B63/00</further-classification>  
        <further-classification edition="202501120251229B">H10H29/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商思娜公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SNAP INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑福德　詹姆斯Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANFORD, JAMES L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戈茨　霍華德Ｖ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOETZ, HOWARD V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰勒　史都華Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAYLOR, STEWART S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供了用於液晶顯示器的像素電路、包含像素電路的顯示裝置及像素電路操作方法。此設計包含雙電壓像素設計、雙電晶體位準偏移電路設計、自調節電晶體偏壓電路以及選擇性的晶片上測試陣列，以判斷關鍵電晶體漏電及閾值參數的特定晶片設計中心值。位準偏移設計的簡化、小的像素間距及適用於小型顯示器（例如微型顯示器）的可應用性為所獲得的各種優勢及優點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Pixel circuitry, display including the same, and method for operating the same for liquid crystal displays are provided. The design includes a dual-voltage pixel design, a two-transistor level-shift circuit design, self-adjusting transistor bias circuitry; and an optional on-chip test-array to determine die-specific design-center values for critical transistor leakage and threshold parameters. Level shift design simplicity, small pixel pitch, and applicability for small display applications such as microdisplays, are among the various benefits and advantages obtained.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:像素電路</p>  
        <p type="p">302、304:記憶體元件</p>  
        <p type="p">306:位準偏移塊</p>  
        <p type="p">308:像素電極</p>  
        <p type="p">V&lt;sub&gt;PIX&lt;/sub&gt;:供應電壓</p>  
        <p type="p">VCC:核心電壓</p>  
        <p type="p">IN、UPDATE、OUT:終端</p>  
        <p type="p">LOAD、UPDATE:輸入</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2218" publication-number="202613648"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613648.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613648</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147387</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像系統</chinese-title>  
        <english-title>OPTICAL IMAGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G02B11/34</main-classification>  
        <further-classification edition="200601120251229B">G02B9/64</further-classification>  
        <further-classification edition="200601120251229B">G02B13/00</further-classification>  
        <further-classification edition="200601120251229B">G02B13/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李知秀</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JI SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張東赫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, DONG HYUK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴一容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, IL YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光學成像系統。光學成像系統包含按自物側至成像側的次序安置的第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡、第七透鏡以及第八透鏡。第一透鏡具有正折射能力，而第二透鏡具有負折射能力，且滿足TTL/(2 x IMG HT) ＜ 0.6、-0.2 ＜ SAG52/TTL ＜ 0以及10 ＜ v1-(v6+v7)/2 ＜ 30，其中TTL為光軸上自第一透鏡的物側表面至成像平面的距離，IMG HT等於成像平面的對角線長度的一半，SAG52為第五透鏡的像側表面的有效孔徑的末端處的SAG值，v1為第一透鏡的阿貝數，v6為第六透鏡的阿貝數，且v7為第七透鏡的阿貝數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging system is provided. The optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, and an eighth lens disposed in order from an object side to an imaging side. The first lens has positive refractive power, while the second lens has negative refractive power, and TTL/(2 x IMG HT) ＜ 0.6, -0.2 ＜ SAG52/TTL ＜ 0, and 10 ＜ v1-(v6+v7)/2 ＜ 30 are satisfied, where TTL is a distance from an object-side surface of the first lens to an imaging plane on an optical axis, IMG HT is equal to half a diagonal length of the imaging plane, SAG52 is a SAG value at an end of an effective aperture of an image-side surface of the fifth lens, v1 is an Abbe number of the first lens, v6 is an Abbe number of the sixth lens, and v7 is an Abbe number of the seventh lens.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學成像系統</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:第六透鏡</p>  
        <p type="p">170:第七透鏡</p>  
        <p type="p">180:第八透鏡</p>  
        <p type="p">190:濾光片</p>  
        <p type="p">191:成像平面</p>  
        <p type="p">IS:影像感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2219" publication-number="202612737"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612737.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612737</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147460</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗ＣＤ３８抗體之皮下調配物及其用途</chinese-title>  
        <english-title>SUBCUTANEOUS FORMULATIONS OF ANTI-CD38 ANTIBODIES AND THEIR USES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K39/395</main-classification>  
        <further-classification edition="200601120260102B">A61K47/20</further-classification>  
        <further-classification edition="200601120260102B">A61K47/22</further-classification>  
        <further-classification edition="200601120260102B">A61K47/26</further-classification>  
        <further-classification edition="200601120260102B">A61K9/08</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商健生生物科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANSSEN BIOTECH, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊森　理查德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANSSON, RICHARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫馬爾　文尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, VINEET</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>何愛文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王仁君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於抗CD38抗體之皮下調配物及其用途。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention relates to subcutaneous formulations of anti-CD38 antibodies and their uses.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2220" publication-number="202613733"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613733.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613733</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147509</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯像方法及基板處理系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G03F7/30</main-classification>  
        <further-classification edition="200601120251229B">G03F7/32</further-classification>  
        <further-classification edition="200601120251229B">G03F7/40</further-classification>  
        <further-classification edition="200601120251229B">G03F7/42</further-classification>  
        <further-classification edition="200601120251229B">H01L21/027</further-classification>  
        <further-classification edition="200601120251229B">H01L21/30</further-classification>  
        <further-classification edition="200601120251229B">C11D7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亀井佑矢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMEI, YUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">[課題] 使金屬含有塗佈膜的顯像處理時產生的基板表面的殘渣物之量降低。 &lt;br/&gt;　　[解決手段] 一種顯像方法，係進行基板的顯像處理，具備：對金屬含有塗佈膜被曝光成預定的圖案的前述基板供應包含有機溶劑的顯像液的工程；對供應前述顯像液的前述基板供應包含有機溶劑的洗淨液的工程；前述洗淨液，相較於前述顯像液，前述金屬含有塗佈膜的溶解性小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">A&lt;sub&gt;1&lt;/sub&gt;:區域</p>  
        <p type="p">A&lt;sub&gt;2&lt;/sub&gt;:區域</p>  
        <p type="p">R:金屬含有光阻膜</p>  
        <p type="p">R&lt;sub&gt;1&lt;/sub&gt;:光阻膜</p>  
        <p type="p">R&lt;sub&gt;2&lt;/sub&gt;:光阻膜</p>  
        <p type="p">R&lt;sub&gt;3&lt;/sub&gt;:光阻膜</p>  
        <p type="p">W:晶圓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2221" publication-number="202614423"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614423.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614423</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147644</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L23/52</main-classification>  
        <further-classification edition="200601120251230B">G11C16/26</further-classification>  
        <further-classification edition="200601120251230B">G11C16/06</further-classification>  
        <further-classification edition="200601120251230B">G11C7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>前嶋洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAEJIMA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>磯部克明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISOBE, KATSUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內海哲章</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UTSUMI, TETSUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡田信彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKADA, NOBUAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>海野正樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UNNO, MASAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中塚圭祐</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKATSUKA, KEISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>篠原広</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHINOHARA, HIROSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於抑制記憶體裝置之面積增加。 &lt;br/&gt;一實施形態之記憶體裝置具備：第1晶片，其包含具有字元線及位元線之記憶胞陣列；第2晶片，其包含第1基板及設置於第1基板上之第1電路，與第1晶片相接；第3晶片，其包含第2基板及設置於第2基板上之第2電路，與第1晶片或第2晶片相接；及輸入輸出焊墊。第1晶片及第2晶片依序排列於自字元線朝向位元線之第1方向上。第1電路包含與位元線連接之第1電晶體，及與字元線連接之第2電晶體。第2電路包含與輸入輸出焊墊連接之第3電晶體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">BP:接合墊</p>  
        <p type="p">DC0:記憶體晶片</p>  
        <p type="p">DC1:電路晶片</p>  
        <p type="p">DC2:電路晶片</p>  
        <p type="p">HR:引出區域</p>  
        <p type="p">IOR0:輸入輸出區域</p>  
        <p type="p">IOR1:輸入輸出區域</p>  
        <p type="p">IOR2:輸入輸出區域</p>  
        <p type="p">MRa:記憶體區域</p>  
        <p type="p">MRb:記憶體區域</p>  
        <p type="p">PRa1:周邊電路區域</p>  
        <p type="p">PRa2:周邊電路區域</p>  
        <p type="p">PRb1:周邊電路區域</p>  
        <p type="p">PRb2:周邊電路區域</p>  
        <p type="p">SRa1:感測區域</p>  
        <p type="p">SRa2:感測區域</p>  
        <p type="p">SRb1:感測區域</p>  
        <p type="p">SRb2:感測區域</p>  
        <p type="p">X:方向</p>  
        <p type="p">XR1:傳輸區域</p>  
        <p type="p">XR2:傳輸區域</p>  
        <p type="p">Y:方向</p>  
        <p type="p">Z2:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2222" publication-number="202613707"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613707.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613707</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147646</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反射型光罩基底、反射型光罩、反射型光罩之製造方法、及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201201120251219B">G03F1/24</main-classification>  
        <further-classification edition="201201120251219B">G03F1/54</further-classification>  
        <further-classification edition="201201120251219B">G03F1/60</further-classification>  
        <further-classification edition="200601120251219B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＨＯＹＡ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOYA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川真徳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, MASANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種可防止基板周緣部產生靜電破壞的反射型光罩基底、反射型光罩、反射型光罩之製造方法、及半導體裝置之製造方法。 &lt;br/&gt;反射型光罩基底100具備基板10、基板10上之多層反射膜12、多層反射膜12上之保護膜14、及保護膜14上之吸收體膜16。吸收體膜16具有緩衝層18、及設置於緩衝層18之上之吸收層20。將基板10之中心至保護膜14之外周端之距離設為Lcap、基板10之中心至緩衝層18之外周端之距離設為Lbuf時，Lcap≦Lbuf。於自基板10之側面朝向基板10之中心0.5 mm以內之範圍內，至少存在一處保護膜14及緩衝層18之合計膜厚為4.5 nm以上的部位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">12:多層反射膜</p>  
        <p type="p">14:保護膜</p>  
        <p type="p">16:吸收體膜</p>  
        <p type="p">18:緩衝層</p>  
        <p type="p">20:吸收層</p>  
        <p type="p">22:背面導電膜</p>  
        <p type="p">100:反射型光罩基底</p>  
        <p type="p">Lcap:基板之中心至保護膜之外周端之距離</p>  
        <p type="p">Lbuf:基板之中心至緩衝層之外周端之距離</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2223" publication-number="202614569"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614569.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614569</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147687</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通用型輸入／輸出埠電路</chinese-title>  
        <english-title>GENERAL PURPOSE INPUT/OUTPUT(GPIO) CIRCUIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H03K19/0185</main-classification>  
        <further-classification edition="200601120251219B">H03K19/0944</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周詠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請請求保護一種通用型輸入/輸出埠電路。該通用型輸入/輸出埠電路的輸出電路部分包括連接在通用型輸入/輸出埠與參考地之間的第一NMOS電晶體和串聯連接在工作電壓輸出端與該通用型輸入/輸出埠之間的第一PMOS電晶體和第二PMOS電晶體。第一PMOS電晶體和第二PMOS電晶體在同一閘極驅動信號控制下同時導通和關斷。該電路能夠將工作電壓輸出端與通用型輸入/輸出埠有效隔離。通過在該通用型輸入/輸出埠電路中增設LED驅動電路和/或上拉高壓電路，該通用型輸入/輸出埠電路可根據實際應用需要靈活地工作在多種模式下。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application claims a general-purpose input/output(GPIO) circuit. An output circuit of the GPIO circuit includes a first NMOS transistor coupled between a GPIO pin and a reference ground, and a first PMOS transistor and a second PMOS transistor connected in series between an operating voltage output terminal and the GPIO pin. The first PMOS transistor and the second PMOS transistor are turned on and off simultaneously under the same gate driving signal control. The circuit can effectively isolate the operating voltage output terminal from the GPIO pin. By adding a LED driving circuit and/or a pull-up high-voltage circuit in the GPIO circuit, the GPIO circuit can flexibly work in various modes according to application needs.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:GPIO電路</p>  
        <p type="p">10:電壓選擇電路</p>  
        <p type="p">11:下拉電路</p>  
        <p type="p">12:上拉電路</p>  
        <p type="p">13:死區時間控制電路</p>  
        <p type="p">VPa,VPb,VPc:供電電壓</p>  
        <p type="p">VP_GPIO:工作電壓輸出端</p>  
        <p type="p">GPIO_PIN:GPIO端子</p>  
        <p type="p">mn1:第一NMOS電晶體</p>  
        <p type="p">mp1:第一PMOS電晶體</p>  
        <p type="p">mp2:第二PMOS電晶體</p>  
        <p type="p">bulk_p:第一公共點</p>  
        <p type="p">Drv1:第一閘極驅動電路</p>  
        <p type="p">Drv2:第二閘極驅動電路</p>  
        <p type="p">gate_1:第一閘極驅動信號</p>  
        <p type="p">gate_2:第二閘極驅動信號</p>  
        <p type="p">OUTPUT_signal:推挽輸出控制信號</p>  
        <p type="p">Pull_up:上拉信號</p>  
        <p type="p">Pull_down:下拉信號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2224" publication-number="202614051"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614051.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614051</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147690</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>三維ＮＯＲ記憶體串之環形通道鐵電記憶體電晶體的記憶體結構及製造方法</chinese-title>  
        <english-title>MEMORY STRUCTURE OF THREE-DIMENSIONAL NOR MEMORY STRINGS OF CHANNEL-ALL-AROUND FERROELECTRIC MEMORY TRANSISTORS AND METHOD OF FABRICATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G11C11/22</main-classification>  
        <further-classification edition="200601120260102B">G11C16/02</further-classification>  
        <further-classification edition="202301120260102B">H10B43/10</further-classification>  
        <further-classification edition="202301120260102B">H10B53/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商日升存儲公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUNRISE MEMORY CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, JIE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佩蒂　克里斯托弗　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PETTI, CHRISTOPHER J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈拉里　葉利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARARI, ELI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沙赫　卡維塔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHAH, KAVITA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種記憶體結構，其包括經組織為水平NOR記憶體串之可隨機存取的環形通道鐵電記憶體電晶體。該等NOR記憶體串在一半導體基板上方形成於薄膜鐵電記憶體電晶體之多個可擴展記憶體堆疊中。該等三維記憶體堆疊在一製程中製造，該製程包括在一多層膜堆疊中形成孔以用於形成局部字元線結構及形成狹縫溝槽以將膜堆疊劃分成包括形成於其中之局部字元線結構的記憶體堆疊。環形通道鐵電記憶體電晶體之記憶體結構致能用於實現一高密度、高容量記憶體裝置之一可擴展構造。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A memory structure includes randomly accessible, channel-all-around ferroelectric memory transistors organized as horizontal NOR memory strings. The NOR memory strings are formed over a semiconductor substrate in multiple scalable memory stacks of thin-film ferroelectric memory transistors. The three-dimensional memory stacks are manufactured in a process that includes forming holes in a multi-layer film stack for forming local word line structures and slit trenches to divide the film stack into memory stacks including local word line structures formed therein. The memory structure of channel-all-around ferroelectric memory transistors enables a scalable construction for realizing a high density, high capacity memory device.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10a:記憶體結構</p>  
        <p type="p">12:半導體層/半導體基板</p>  
        <p type="p">13:局部字元線結構</p>  
        <p type="p">14:絕緣層</p>  
        <p type="p">15:層間隔離層</p>  
        <p type="p">16:主動層</p>  
        <p type="p">17:記憶體堆疊</p>  
        <p type="p">19:溝槽</p>  
        <p type="p">20:記憶體電晶體</p>  
        <p type="p">26:通道層</p>  
        <p type="p">39:介電層</p>  
        <p type="p">BL:位元線</p>  
        <p type="p">SL:源極線</p>  
        <p type="p">X:第一方向</p>  
        <p type="p">Y:第二方向</p>  
        <p type="p">Z:第三方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2225" publication-number="202613037"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613037.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613037</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147708</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>反射型光罩基底、反射型光罩及半導體裝置之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">C01G55/00</main-classification>  
        <further-classification edition="201201120251219B">G03F1/24</further-classification>  
        <further-classification edition="201201120251219B">G03F1/48</further-classification>  
        <further-classification edition="201201120251219B">G03F1/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＨＯＹＡ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOYA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木宏太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, KOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中川真徳</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKAGAWA, MASANORI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尾上貴弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ONOUE, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種對用於吸收體膜及/或蝕刻遮罩膜之蝕刻之蝕刻氣體具有高耐性且可抑制起泡之發生之附多層反射膜之基板、反射型光罩基底、反射型光罩、及半導體裝置之製造方法。 &lt;br/&gt;附多層反射膜之基板100具有：基板10、設置於基板10上之多層反射膜12、及設置於多層反射膜12上之保護膜14。保護膜14含有釕(Ru)、銠(Rh)、及選自鈦(Ti)、鋯(Zr)、釔(Y)、鈮(Nb)、釩(V)及鉿(Hf)中之至少一種添加元素。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:基板</p>  
        <p type="p">12:多層反射膜</p>  
        <p type="p">14:保護膜</p>  
        <p type="p">22:背面導電膜</p>  
        <p type="p">24:吸收體膜</p>  
        <p type="p">26:抗蝕膜</p>  
        <p type="p">110:反射型光罩基底</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2226" publication-number="202614555"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614555.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614555</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147735</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>使用用於電流隔離之電容屏障用於改進矽數位隔離器中之共模瞬態抗擾性之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR IMPROVING COMMON MODE TRANSIENT IMMUNITY IN SILICON DIGITAL ISOLATORS USING CAPACITIVE BARRIER FOR GALVANIC ISOLATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">H03F3/195</main-classification>  
        <further-classification edition="200601120251222B">H03F3/45</further-classification>  
        <further-classification edition="200601120251222B">H04B1/04</further-classification>  
        <further-classification edition="200601120251222B">H04B1/16</further-classification>  
        <further-classification edition="200601120251222B">H04L25/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加拿大商芯凱科技國際控股有限合夥公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KINETIC TECHNOLOGIES INTERNATIONAL HOLDINGS LP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>杜塔　悉達多</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUTTA, SIDDHARTH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示使用用於電流隔離之電容屏障用於改進矽數位隔離器中之共模瞬態抗擾性之系統及方法。該等系統包括具有差分放大器之傳輸器及接收器。該差分放大器可包含：一第一電晶體，其電耦合於該傳輸器之一第一輸入與該傳輸器之一第一輸出之間；一第二電晶體，其電耦合於該傳輸器之一第二輸入與該傳輸器之一第二輸出之間；一第一被動負載，其電耦合於該傳輸器之該第一輸入與一電源軌之間；及一第二被動負載，其電耦合於該傳輸器之該第二輸入與該電源軌之間，其中該第一及第二被動負載具有相同阻抗；及一偏壓電壓源，其經組態以偏壓該第一電晶體之一閘極及該第二電晶體之一閘極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Systems and methods are disclosed for improving common mode transient immunity in silicon digital isolators using capacitive barrier for galvanic isolation. The systems include transmitters and receivers that include differential amplifiers. The differential amplifier may include a first transistor electrically coupled between a first input of the transmitter and a first output of the transmitter, a second transistor electrically coupled between a second input of the transmitter and a second output of the transmitter, a first passive load electrically coupled between the first input of the transmitter and a source rail, and a second passive load electrically coupled between the second input of the transmitter and the source rail, wherein the first and second passive loads have the same impedance; and a bias voltage source configured to bias a gate of the first transistor and a gate of the second transistor.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">202:傳輸器輸出驅動器(Tx裝置)</p>  
        <p type="p">204:接收器(Rx裝置)</p>  
        <p type="p">206:電流隔離屏障</p>  
        <p type="p">C:電容器</p>  
        <p type="p">Cin:輸入電容器</p>  
        <p type="p">Itail:偏壓電流源</p>  
        <p type="p">N1:電晶體</p>  
        <p type="p">N2:電晶體</p>  
        <p type="p">Rb:第一偏壓電阻器</p>  
        <p type="p">Rload:第一被動負載</p>  
        <p type="p">Rx+:第一輸入</p>  
        <p type="p">Rx-:第二輸入</p>  
        <p type="p">Tx VDD:電源電壓軌</p>  
        <p type="p">Tx VSS:電源接地軌</p>  
        <p type="p">Tx+:第一輸出</p>  
        <p type="p">Tx-:第二輸出</p>  
        <p type="p">Va:偏壓電壓源</p>  
        <p type="p">Vin+:第一輸入</p>  
        <p type="p">Vin-:第二輸入</p>  
        <p type="p">Vtail:共模電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2227" publication-number="202614017"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614017.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614017</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147843</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示面板的驅動電路</chinese-title>  
        <english-title>DRIVING CIRCUIT FOR DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251218B">G09G3/32</main-classification>  
        <further-classification edition="200601120251218B">G09G5/10</further-classification>  
        <further-classification edition="202001120251218B">H05B45/30</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>矽創電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SITRONIX TECHNOLOGY CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹縣</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇忠信</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, CHUNG-HSIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡秀玫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種顯示面板的驅動電路，其包含一電流產生電路與一電流控制電路，電流產生電路產生至少一電流，以驅動發光二極體，電流控制電路控制電流產生電路產生電流，並在一初始階段控制電流產生電路產生較小的電流，且在初始階段後控制電流產生電路產生較大的電流。另外，電流控制電路於複數周期控制電流產生電路產生電流，每一周期具有初始階段，電流控制電路於該些周期的每N個周期中的一個周期的初始階段控制電流產生電路產生電流，N大於等於2。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention provides a driving circuit for display panel, which comprises a current generating circuit and a current control circuit. The current generating circuit generates one or more current for driving light-emitting diodes. The current control circuit controls the current generating circuit to generate current. In an initial stage, the current control circuit controls the current generating circuit to generate smaller current. After the initial stage, the current control circuit controls the current generating circuit to generate larger current. In addition, the current control circuit controls the current generating circuit to generate current in a plurality of cycles. Each cycle includes the initial stage. The current control circuit controls the current generating circuit to generate current in the initial stage of a cycle for every N cycles of the cycles, wherein N is greater than 2.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:顯示元件</p>  
        <p type="p">26:致能電路</p>  
        <p type="p">27:儲存電路</p>  
        <p type="p">29:驅動電路</p>  
        <p type="p">90:電流控制電路</p>  
        <p type="p">91:比較電路</p>  
        <p type="p">94:周期計數器</p>  
        <p type="p">95:準位轉換電路</p>  
        <p type="p">96:時脈計數器</p>  
        <p type="p">99:電流產生電路</p>  
        <p type="p">DCK:時序訊號</p>  
        <p type="p">Din:輸入資料</p>  
        <p type="p">I:電流源</p>  
        <p type="p">M:開關</p>  
        <p type="p">PWMCLK:時脈訊號</p>  
        <p type="p">VDD:供應電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2228" publication-number="202614170"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614170.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614170</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147961</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法</chinese-title>  
        <english-title>METHOD FOR PROCESSING SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/20</main-classification>  
        <further-classification edition="200601120251230B">H01L21/302</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商周星工程股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUSUNG ENGINEERING CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳世煥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, SEWHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧載盛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROH, JAESUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孫清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SON, CHEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹弘旻</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, HONGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹洪守</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YOON, HONGSOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張允柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, YOUNJOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙炳夏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, BYOUNG-HA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曺知鉉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHO, JIHYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃喆周</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, CHUL JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明為基板處理方法，在分成第一處理區域以及第二處理區域的處理空間中在基板上進行處理製程，且本發明關於一種基板處理方法，包含在受支撐單元支撐的基板設置於第一處理區域中時於第一處理區域中在基板上進行第一處理製程的步驟、在完成第一處理製程時使支撐單元轉動以將基板移動到第二處理區域的步驟，以及在受支撐單元支撐的基板設置於第二處理區域時在第二處理區域中於基板上進行第二處理製程的步驟。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention is a method for processing a substrate, which performs a processing process on a substrate in a processing space divided into a first processing region and a second processing region, and relates to a substrate processing method including: a step of performing a first processing process on a substrate in the first processing region when the substrate supported by a supporting unit is disposed in the first processing region; a step of rotating the supporting unit to move the substrate to the second processing region, when the first processing process is completed; and a step of performing a second processing process on the substrate in the second processing region when the substrate supported by the supporting unit is disposed in the second processing region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S11,S12,S13,S13',S14:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2229" publication-number="202613615"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613615.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613615</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147963</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>導光光學零件、使用該導光光學零件的照明裝置及使用該照明裝置的投射型顯示裝置</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">G02B6/10</main-classification>  
        <further-classification edition="200601120251222B">G03B21/14</further-classification>  
        <further-classification edition="200601120251222B">G02F1/13357</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商岡本硝子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMOTO GLASS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奈良俊孝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NARA, TOSHITAKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志青</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供一種導光光學零件，在具有於水平方向呈β&lt;sub&gt;1&lt;/sub&gt;或β&lt;sub&gt;7&lt;/sub&gt;且於垂直方向呈β&lt;sub&gt;2&lt;/sub&gt;或β&lt;sub&gt;8&lt;/sub&gt;的傾斜角的第一四角錐台的底面為光的出射面且頂面為入射面的錐形部接續形成有以該入射面為底面的矩形CPC、第二四角錐台、橢圓錐台或圓形CPC作為光的入射部。在這些入射部側面的任意位置中的切平面的傾斜角比對應位置的錐形部的錐形角更大。錐形部的長度L&lt;sub&gt;1&lt;/sub&gt;與入射部的長度L&lt;sub&gt;2&lt;/sub&gt;的和的全長L的相對於出射面的對角線的長度D的比在入射部為矩形CPC時為1.5~5，第二四角錐台時為2.4~5，橢圓錐台時為2~5，圓形CPC時為2.4~5的範圍，如此能夠使出射光均勻且發散角小。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2230" publication-number="202613398"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613398.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613398</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147971</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>門體驅動機構、製程腔室及半導體製程設備</chinese-title>  
        <english-title>DOOR DRIVING MECHANISM, PROCESS CHAMBER AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201501120251220B">E05F15/603</main-classification>  
        <further-classification edition="200601120251220B">H01L21/67</further-classification>  
        <further-classification edition="201501120251220B">E05F15/632</further-classification>  
        <further-classification edition="201501120251220B">E05F15/665</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范穎旭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FAN, YINGXU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>唐希文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANG, XIWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馮博生</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供一種門體驅動機構、製程腔室及半導體製程設備。門體驅動機構，包括：第一驅動裝置、第二驅動裝置和連接部，連接部用於與門體連接，且與第一驅動裝置、第二驅動裝置驅動連接，第一驅動裝置用於驅動連接部沿第一方向移動，以使連接部帶動門體沿第一方向移動；第二驅動裝置用於驅動連接部沿第二方向移動，第二方向與第一方向相交，以使連接部帶動門體沿第二方向相對於第一驅動裝置移動。本申請的門體驅動機構通過設置第二驅動裝置可以實現門體的橫向移動，從而可以將門體壓在內襯結構上實現密封或者將門體與內襯分離，在保證門體密封效果的同時，還有效避免門體與內襯結構的擦碰。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application provides a door driving mechanism, a process chamber and a semiconductor process equipment. The door driving mechanism comprises: a first driving device, a second driving device and a connecting member, wherein the connecting member is used to connect with the door, and is drivingly connected with the first driving device and the second driving device; the first driving device is used to drive the connecting member to move along a first direction, so that the connecting member drives the door to move along the first direction; the second driving device is used to drive the connecting member to move along the second direction, and the second direction intersects with the first direction, so that the connecting member drives the door to move along the second direction relative to the first driving device. The door driving mechanism of the present application may achieve a lateral movement of the door by setting the second driving device, so that the door may be pressed against a lining structure to achieve sealing or separating the door from a lining, while ensuring the sealing effect of the door, it also effectively avoids the friction between the door and the lining structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:第一驅動裝置</p>  
        <p type="p">20:第二驅動裝置</p>  
        <p type="p">24:導向軸</p>  
        <p type="p">25:安裝座</p>  
        <p type="p">30:連接部</p>  
        <p type="p">31:連接杆</p>  
        <p type="p">70:門體</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2231" publication-number="202614544"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614544.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614544</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147975</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可重組態功率轉換器</chinese-title>  
        <english-title>RECONFIGURABLE POWER CONVERTER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200701120251222B">H02M1/00</main-classification>  
        <further-classification edition="200601120251222B">H02H7/125</further-classification>  
        <further-classification edition="200601120251222B">H02M1/084</further-classification>  
        <further-classification edition="200701120251222B">H02M1/38</further-classification>  
        <further-classification edition="200601120251222B">H02M7/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商予力半導體公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMPOWER SEMICONDUCTOR, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅西格　特雷</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROESSIG, TREY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐克　帕拉格</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OAK, PARAG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賈格納瑟　雪尼凡賽</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JAGANATHAN, SHRINIVASAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>葛丹　納任拉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GADDAM, NARENDRA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>理德斯基　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIDSKY, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳弈錡</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種功率轉換裝置，其包括：一半導體基板；複數個控制器，其形成於該半導體基板上；兩個或多於兩個轉換器相，其形成於該半導體基板上；兩個或多於兩個可程式化組件，其形成於該半導體基板上，該等可程式化組件中之每一者連接至該兩個或多於兩個轉換器相中之一各別者；及一互連電路，其形成於該半導體基板上。該兩個或多於兩個可程式化組件可程式化以經由該互連電路將該兩個或多於兩個轉換器相選擇性地耦接至該複數個控制器。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A power conversion device includes: a semiconductor substrate；a plurality of controllers formed on the semiconductor substrate；two or more converter phases formed on the semiconductor substrate；two or more programmable components formed on the semiconductor substrate, each of the programmable components connected to a respective one of the two or more converter phases；and an interconnect circuit formed on the semiconductor substrate. The two or more programmable components are programmable to selectively couple the two or more converter phases to the plurality of controllers via the interconnect circuit.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:可重組態功率轉換器</p>  
        <p type="p">105:第一控制器</p>  
        <p type="p">109:可組態電路</p>  
        <p type="p">110:第二控制器</p>  
        <p type="p">115a:第一相/轉換器電路</p>  
        <p type="p">115b:第二相/轉換器電路</p>  
        <p type="p">115c:相/轉換器電路</p>  
        <p type="p">115d:相/轉換器電路</p>  
        <p type="p">115e:相/轉換器電路</p>  
        <p type="p">120:通信匯流排</p>  
        <p type="p">125:時脈/時序電路系統</p>  
        <p type="p">130:標準化的功率轉換裝置</p>  
        <p type="p">V1:第一負載電壓</p>  
        <p type="p">V2:第二負載電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2232" publication-number="202612793"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612793.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612793</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147979</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>塗佈覆板之方法</chinese-title>  
        <english-title>METHOD OF COATING A SUPERSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B05D1/00</main-classification>  
        <further-classification edition="200601120251229B">C03C17/32</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧許金　伊利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RUSHKIN, ILYA L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉衛軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, WEIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">使用含有脊部之真空吸盤塗佈覆板之方法可包含將該覆板附加在該真空吸盤上；在該覆板上施加塗佈組成物之液體層，該塗佈組成物包含塗佈劑和非含氟溶劑，其中該非含氟溶劑具有至少165℃之沸點；以及固化該塗佈組成物以形成固體塗佈層。該覆板之材料可具有不大於10 W/mK之導熱度，且在固化後所得之固體塗佈層可包含不大於1%之平滑值(SM)，該平滑值定義為SM=(C&lt;sub&gt;RD&lt;/sub&gt;/C&lt;sub&gt;T&lt;/sub&gt;)×100%，其中C&lt;sub&gt;RD&lt;/sub&gt;是該塗佈層之最大粗糙深度，且C&lt;sub&gt;T&lt;/sub&gt;是在10 mm長度之該固體塗佈層上之該塗佈層的平均厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of coating a superstrate using a vacuum chuck containing ridges can comprise attaching the superstrate on the vacuum chuck; applying on the superstrate a liquid layer of a coating composition, the coating composition comprising a coating agent and a non-fluorinated solvent, wherein the non-fluorinated solvent has a boiling point of at least 165°C; and solidifying the coating composition to form a solid coating layer. The material of the superstrate can have a thermal conductivity of not greater than 10 W/mK and the solid coating layer obtained after solidifying may comprise a smoothness value (SM) of not greater than 1%, the smoothness value being defined as SM = (C&lt;sub&gt;RD &lt;/sub&gt;/ C&lt;sub&gt;T&lt;/sub&gt; ) x 100%, with C&lt;sub&gt;RD&lt;/sub&gt; being a maximum roughness depth of the coating layer and C&lt;sub&gt;T&lt;/sub&gt; an average thickness of the coating layer over a length of 10 mm of the solid coating layer.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2233" publication-number="202613447"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613447.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613447</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147986</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於連結第一及第二管道元件之聯軸器及其組裝方法</chinese-title>  
        <english-title>COUPLING FOR JOINING FIRST AND SECOND PIPE ELEMENTS AND METHOD OF ASSEMBLING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">F16L21/06</main-classification>  
        <further-classification edition="200601120251230B">F16L21/03</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商韋克陶立公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VICTAULIC COMPANY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>芬利森　艾瑞克　法蘭克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FINLAYSON, ERIC FRANK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐布萊特　克里斯多福</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALBRIGHT, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於連結第一及第二管道元件之聯軸器包含可附接至管道元件之第一及第二環。各環界定一溝槽及相鄰於該溝槽之複數個接收面。區段可端對端附接以環繞一中心空間及該等環。各區段包含朝向該中心空間突出以與該等環之各溝槽接合之鍵。各區段包含可與該第一及第二環之一接收面接合之至少一個作用面。該等作用面與該等接收面之間的接合防止該第一及第二管道元件相對於彼此旋轉。本發明亦揭示一種組裝該聯軸器之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A coupling for joining first and second pipe elements in includes first and second rings attachable to pipe elements. Each ring defines a groove and a plurality of receiving surfaces adjacent to the groove. Segments are attachable end to end to surround a central space and the rings. Each segment includes keys projecting toward the central space for engagement with each groove of the rings. Each segment includes at least one action surface engageable with a receiving surface of the first and second ring. Engagement between the action surfaces and the receiving surfaces prevents rotation of the first and second pipe elements with respect to one another. A method of assembling the coupling is also disclosed.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:聯軸器</p>  
        <p type="p">12:第一管道元件</p>  
        <p type="p">14:第二管道元件</p>  
        <p type="p">16:縱軸</p>  
        <p type="p">18:第一環</p>  
        <p type="p">20:第二環</p>  
        <p type="p">36:第一區段</p>  
        <p type="p">38:第二區段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2234" publication-number="202612756"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612756.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612756</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114147988</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>在換能器內的儲存器、用於超音波治療之系統、具有功率放大器之裝置、用於驅動高強度超音波換能器之功率放大器裝置、其控制、判定、計算、校準、調整、調諧及量測方法及其確認系統</chinese-title>  
        <english-title>STORAGE WITHIN TRANSDUCER, SYSTEM FOR ULTRASOUND TREATMENT, DEVICE WITH POWER AMPLIFIERS, POWER AMPLIFIER DEVICE FOR DRIVING HIGH INTENSITY ULTRASOUND TRANSDUCERS, CONTROLLING, DETERMINING, CALCULATING, CALIBRATING, ADJUSTING, TUNING AND MEASURING METHODS THEREOF, AND MEASURING AND CONFIRMING SYSTEMS THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">A61N7/00</main-classification>  
        <further-classification edition="200601120251222B">A61B8/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商奧賽拉公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ULTHERA, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾姆利　Ｃ　　Ｄ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EMERY, CHARLES D.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　和興　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEN, WOHSING P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>亞當森　羅伯特　Ｂ　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADAMSON, ROBERT B.A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維富林　彼得　雨果</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VIHVELIN, PEETER HUGO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩恩柯　丹尼爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZAENKER, DANIEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坎貝爾　尼可拉斯　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CAMPBELL, NICHOLAS A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊特　馬修　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WRIGHT, MATTHEW A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萊德貝特　Ｊ　　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEADBETTER, JEFFREY R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布朗　Ｊ　　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROWN, JEREMY A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供藉由例如高效的信號量測、校準及保證系統來增強超音波功效的實施例，該些實施例具有被配置以驅動一或多個聚焦超音波換能器之一控制系統射頻（RF）驅動器。該RF驅動器可包含一或多個功率放大器，該一或多個功率放大器包括一或多個III-V族半導體（例如，氮化鎵GaN、GaAs、GaSb、InP、InAs、InSb、InGaAs、AlSb、AlGaAs及/或AlGaN）場效電晶體，以在一寬頻率範圍內藉由相異窄頻帶RF信號高效地提供高功率。該RF驅動器可包括一功率量測及/或校準系統以監測自該功率放大器輸出之該RF信號的振幅及相位，且估計輸送至該些超音波換能器之RF功率的量。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments are provided that enhance ultrasound efficacy by for example, high efficiency, signal measurement, calibration, and assurance systems with a control system radiofrequency (RF) driver configured to drive one or more focused ultrasound transducers. The RF driver can comprise one or more power amplifiers including one or more III-V semiconductors, (e.g., gallium nitride GaN, GaAs, GaSb, InP, InAs, InSb, InGaAs, AlSb, AlGaAs, and/or AlGaN) field-effect transistors to efficiently provide high power with distinct narrow-band RF signals over a wide frequency range. The RF driver can include a power measurement and/or calibration system to monitor the amplitude and phase of the RF signal output from the power amplifier and estimate the amount of RF power delivered to the ultrasound transducers.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">20:超音波系統</p>  
        <p type="p">100:手柄</p>  
        <p type="p">300:控制器</p>  
        <p type="p">301:推車</p>  
        <p type="p">310:圖形顯示器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2235" publication-number="202613654"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613654.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613654</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148001</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像系統</chinese-title>  
        <english-title>OPTICAL IMAGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G02B13/00</main-classification>  
        <further-classification edition="200601120251229B">G02B9/34</further-classification>  
        <further-classification edition="200601120251229B">G02B9/60</further-classification>  
        <further-classification edition="200601120251229B">G02B13/18</further-classification>  
        <further-classification edition="200601120251229B">G02B3/00</further-classification>  
        <further-classification edition="202101120251229B">G03B30/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金學哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HAG CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鏞主</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YONG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭弼鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JUNG, PHIL HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學成像系統包括：光學路徑折疊元件；以及透鏡組，包括四或更多個透鏡。所述透鏡組中最靠近成像平面設置的最後透鏡具有正的折射力，且最靠近所述最後透鏡的物體側設置的向後透鏡具有負的折射力。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging system includes an optical path folding element, and a lens group including four or more lenses. A rearmost lens disposed closest to an imaging plane in the lens group has positive refractive power, and a rearward lens disposed closest to an object side of the rearmost lens has negative refractive power.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學成像系統</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">IF:濾波器</p>  
        <p type="p">IP:成像平面</p>  
        <p type="p">IS:影像感測器</p>  
        <p type="p">P:稜鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2236" publication-number="202613184"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613184.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613184</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148006</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>抗ＣＥＡＣＡＭ５抗體及其用途</chinese-title>  
        <english-title>ANTI-CEACAM5 ANTIBODIES AND USES THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07K16/30</main-classification>  
        <further-classification edition="200601120260102B">C12N15/13</further-classification>  
        <further-classification edition="200601120260102B">C12N15/63</further-classification>  
        <further-classification edition="200601120260102B">A61K39/395</further-classification>  
        <further-classification edition="201701120260102B">A61K47/68</further-classification>  
        <further-classification edition="200601120260102B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商諾納生物（蘇州）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NONA BIOSCIENCES (SUZHOU) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄔俊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪皛皛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, XIAOXIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>龔星群</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GONG, XINGQUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬瑞鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, RUIPENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>盧忠華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, ZHONGHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王苗苗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, MIAOMIAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉　禮樂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIU, LILE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本文公開了與CEACAM5結合的抗體及其抗原結合片段及其用途，編碼該等抗體和抗原結合片段的核酸，包含該等核酸的載體以及包含該等核酸或載體的宿主細胞。本文還公開了包含該等抗體的藥物組成物和軛合物，以及藉由施用該等抗體的治療方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed herein are antibodies that bind to CEACAM5 and antigen-binding fragments thereof, as well as uses thereof, nucleic acids encoding the antibodies and antigen-binding fragments, vectors comprising the nucleic acids, and host cell comprising the nucleic acids or the vectors. Also disclosed are pharmaceutical compositions and conjugates comprising the antibodies, and therapeutic methods by administering the antibodies.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2237" publication-number="202614018"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614018.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614018</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148021</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>發光裝置和電子裝置</chinese-title>  
        <english-title>LIGHT-EMITTING DEVICE AND ELECTRONIC DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251226B">G09G3/32</main-classification>  
        <further-classification edition="200601120251226B">G09F11/21</further-classification>  
        <further-classification edition="202301120251226B">H10K50/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廣木正明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIROKI, MASAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠藤秋男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENDO, AKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實施例提供一種可攜性好且一覽性強的發光裝置。本發明實施例還提供一種不易損壞的發光裝置。本發明的實施例一種發光裝置，其中交替配置有帶狀的高撓性區域和帶狀的低撓性區域。在高撓性區域中，發光面板和多個間隔物彼此重疊。在低撓性區域中，發光面板和支撐體彼此重疊。當使高撓性區域彎曲時，相鄰的兩個間隔物的互相相對的面的法線所形成的角度根據發光面板的彎曲狀況改變，從而可以將中和面形成在發光面板中或發光面板附近。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A highly portable and highly browsable light-emitting device is provided. A light-emitting device that is less likely to be broken is provided. The light-emitting device has a strip-like region having high flexibility and a strip-like region having low flexibility that are arranged alternately. In the region having high flexibility, a light-emitting panel and a plurality of spacers overlap with each other. In the region having low flexibility, the light-emitting panel and a support overlap with each other. When the region having high flexibility is bent, the angle between normals of facing planes of the two adjacent spacers changes according to the bending of the light-emitting panel; thus, a neutral plane can be formed in the light-emitting panel or in the vicinity of the light-emitting panel.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">101:發光面板</p>  
        <p type="p">103:支撐體</p>  
        <p type="p">103a(1),103a(2):支撐體</p>  
        <p type="p">103b(1),103b(2):支撐體</p>  
        <p type="p">105:連接部</p>  
        <p type="p">106:彈性體</p>  
        <p type="p">108:間隔物</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2238" publication-number="202613387"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613387.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613387</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148024</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>水下挖掘設備之改良及與水下挖掘設備相關之改良</chinese-title>  
        <english-title>IMPROVEMENTS IN AND RELATING TO UNDERWATER EXCAVATION APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">E02F3/92</main-classification>  
        <further-classification edition="200601120251229B">E02F3/90</further-classification>  
        <further-classification edition="200601120251229B">E02F5/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商羅泰克集團有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROTECH GROUP LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史戴華　多納德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEWART, DONALD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>史戴華　肯尼斯　羅德里克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEWART, KENNETH RODERICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種挖掘設備（5），諸如一水下挖掘設備及/或一控制流量挖掘設備，其包含一轉子（10），該轉子包含複數個第一轉子葉片（12）及複數個第二轉子葉片（14）。該等第二轉子葉片設置於鄰近第一轉子葉片對之間。該等第一轉子葉片（12）界定該轉子（10）之複數個主要轉子葉片。該等第二轉子葉片（14）界定該轉子（10）之複數個次要分流器轉子葉片。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An excavation apparatus (5), such as an underwater excavation apparatus and/or a controlled flow excavation apparatus, comprises a rotor (10) comprising a plurality of first rotor blades (12) and a plurality of second rotor blades (14). The second rotor blades are provided between adjacent pairs of first rotor blades. The first rotor blades (12) define a plurality of primary rotor blades of the rotor (10). The second rotor blades (14) define a plurality of secondary, splitter, rotor blades of the rotor (10).</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">5:挖掘設備</p>  
        <p type="p">10:轉子</p>  
        <p type="p">11:轉子葉片</p>  
        <p type="p">15:定子</p>  
        <p type="p">20:外殼</p>  
        <p type="p">25:入口</p>  
        <p type="p">26:側</p>  
        <p type="p">29:末端</p>  
        <p type="p">30:出口</p>  
        <p type="p">31:末端</p>  
        <p type="p">39:第一主體</p>  
        <p type="p">40:第二主體</p>  
        <p type="p">45:定子葉片</p>  
        <p type="p">70:馬達</p>  
        <p type="p">205:挖掘系統或工具</p>  
        <p type="p">A:縱向軸</p>  
        <p type="p">A&lt;sub&gt;1&lt;/sub&gt;:高度</p>  
        <p type="p">A&lt;sub&gt;2&lt;/sub&gt;:高度</p>  
        <p type="p">B:位置</p>  
        <p type="p">C&lt;sub&gt;1&lt;/sub&gt;:高度</p>  
        <p type="p">C&lt;sub&gt;2&lt;/sub&gt;:高度</p>  
        <p type="p">D:位置</p>  
        <p type="p">E:位置</p>  
        <p type="p">F:流動路徑</p>  
        <p type="p">F&lt;sub&gt;1&lt;/sub&gt;:第一入口部分/第一部分</p>  
        <p type="p">F&lt;sub&gt;2&lt;/sub&gt;:第二入口部分/第二部分</p>  
        <p type="p">F&lt;sub&gt;3&lt;/sub&gt;:轉子部分/第三部分</p>  
        <p type="p">F&lt;sub&gt;4&lt;/sub&gt;:另一或中間部分/第四部分</p>  
        <p type="p">F&lt;sub&gt;5&lt;/sub&gt;:定子部分/第五部分</p>  
        <p type="p">F&lt;sub&gt;6&lt;/sub&gt;:第一出口部分/第六部分</p>  
        <p type="p">α:第一角度</p>  
        <p type="p">β:第二角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2239" publication-number="202614654"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614654.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614654</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148098</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基於層１（Ｌ１）和層２（Ｌ２）的行動性程序</chinese-title>  
        <english-title>LAYER 1 (L1) AND LAYER 2 (L2) BASED MOBILITY PROCEDURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200901120260102B">H04W24/10</main-classification>  
        <further-classification edition="200901120260102B">H04W24/08</further-classification>  
        <further-classification edition="202301120260102B">H04W72/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商高通公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>QUALCOMM INCORPORATED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹加諾維克　吉雷納</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAMNJANOVIC, JELENA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>駱　濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUO, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>丹加諾維克　艾利克桑達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DAMNJANOVIC, ALEKSANDAR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒙托傑　貞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONTOJO, JUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>歐茲圖爾克　歐茲肯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OZTURK, OZCAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>薩克尼尼　艾葉柏伊薩姆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKHNINI, IYAB ISSAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>俄沃尼奧特瑞　歐露芬米洛拉歐墨賴得</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AWONIYI-OTERI, OLUFUNMILOLA OMOLADE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿卡拉卡蘭　索尼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AKKARAKARAN, SONY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李　君毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, JUNYI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>彭國洋</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本案內容的各態樣涉及無線通訊，並且更具體地，本案內容的各態樣涉及允許使用者設備（UE）在細胞集合之間的行動性的行動性技術。可以由UE執行的一種方法包括：接收訊號傳遞，該訊號傳遞將UE配置有支援實體（PHY）層或媒體存取控制（MAC）層行動性訊號傳遞的細胞集合以及用於該細胞集合的量測配置；根據量測配置來向網路實體報告針對該細胞集合中的至少一些細胞的量測；及從網路實體接收用於將UE移動到該集合中的細胞中的一個細胞的PHY層或MAC層行動性訊號傳遞，其中行動性訊號傳遞是至少部分地基於所報告的量測的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Aspects of the present disclosure relate to wireless communications, and more particularly, to mobility techniques that allow for mobility of a user equipment (UE) between a set of cells. A method that may be performed by a UE includes receiving signaling configuring the UE with a set of cells that support physical (PHY) layer or medium access control (MAC) layer mobility signaling and with a measurement configuration for the set of cells, reporting, to a network entity, measurements for at least some of the set of cells in accordance with the measurement configuration, and receiving, from the network entity, PHY layer or MAC layer mobility signaling to move the UE to one of the cells in the set, wherein the mobility signaling is based, at least in part, on the reported measurements.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:操作</p>  
        <p type="p">702:方塊</p>  
        <p type="p">704:方塊</p>  
        <p type="p">706:方塊</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2240" publication-number="202614570"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614570.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614570</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148112</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用值對組態位元進行組態之系統及方法</chinese-title>  
        <english-title>SYSTEMS AND METHODS FOR CONFIGURATION OF A CONFIGURATION BIT WITH A VALUE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251223B">H03K19/1776</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾爾斯賓科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EVERSPIN TECHNOLOGIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷沙米迪尼　迪米特爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOUSSAMEDDINE, DIMITRI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>FR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾朗姆　席德　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ALAM, SYED M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾嘉沃　桑吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGGARWAL, SANJEEV</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔣大中</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭示內容尤其係關於一種組態位元，該組態位元包含至少四個電阻元件及一電壓放大器。至少兩個第一電阻元件可經由一第一電極串聯地電連接且至少兩個第二電阻元件可經由一第二電極串聯地電連接。該至少兩個第一電阻元件可經由一第三電極及一第四電極與該至少兩個第二電阻元件並聯地電連接。該第一電極及該第二電極可電連接至一電壓源。該第三電極及該第四電極可電連接至該電壓放大器之一輸入端。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure is drawn to, among other things, a configuration bit including at least four resistive elements and a voltage amplifier. At least two first resistive elements may be electrically connected in series via a first electrode and at least two second resistive elements may be electrically connected in series via a second electrode. The at least two first resistive elements may be electrically connected in parallel to the at least two second resistive elements via a third electrode and a fourth electrode. The first electrode and the second electrode may be electrically connected to a voltage supply. The third electrode and the fourth electrode may be electrically connected to an input of the voltage amplifier.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">122:組態位元</p>  
        <p type="p">200:經組態用於讀出第一值之多次可程式化組態位元122的例示性電路</p>  
        <p type="p">202:MTJ橋</p>  
        <p type="p">204:電壓放大器</p>  
        <p type="p">206:反相器</p>  
        <p type="p">210a,210b,210c,210d,210e:電氣連接件</p>  
        <p type="p">212a,212b,212c,212d:電極</p>  
        <p type="p">208a,208b,208c,208d:電阻元件</p>  
        <p type="p">Rap:高阻態</p>  
        <p type="p">Rp:低阻態</p>  
        <p type="p">V&lt;sub&gt;out&lt;/sub&gt;:電壓輸出</p>  
        <p type="p">Vdd:正汲極電壓</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2241" publication-number="202614074"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614074.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614074</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148136</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體系統及控制方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">G11C16/30</main-classification>  
        <further-classification edition="200601120251219B">G11C16/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>松本肇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATSUMOTO, HAIJME</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明實現可防止因供給電壓之變動而導致初始化失敗之記憶體系統及電源控制電路。 &lt;br/&gt;根據實施形態，記憶體系統可連接於主機。記憶體系統具備非揮發性記憶體、控制器及電源控制電路。控制器控制非揮發性記憶體。電源控制電路控制向控制器與非揮發性記憶體供給之電力，且包含1個以上DC/DC轉換器。非揮發性記憶體及控制器包含1個以上電路區塊。1個以上DC/DC轉換器各者對1個以上電路區塊之一者分別供給內部電源電壓。1個以上DC/DC轉換器中之第1DC/DC轉換器對應於記憶體系統自低消耗電力模式轉變為通常動作模式，而轉變為強制脈衝寬度調變模式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">9:時序圖</p>  
        <p type="p">91:內部電源電壓</p>  
        <p type="p">92:動作模式</p>  
        <p type="p">93:內部電源電壓</p>  
        <p type="p">94:動作</p>  
        <p type="p">95:負載電流</p>  
        <p type="p">95A:邊界值</p>  
        <p type="p">t21~t25:時刻</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2242" publication-number="202612638"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612638.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612638</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148146</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>清潔裝置、清潔設備及清潔系統</chinese-title>  
        <english-title>CLEANING APPARATUS, CLEANING DEVICE AND CLEANING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251216B">A47L11/40</main-classification>  
        <further-classification edition="200601120251216B">A47L11/24</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周志威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ZHIWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙百年</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, BAINIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的實施例提供了一種清潔裝置、清潔設備和清潔系統，清潔裝置包括：殼體；驅動件，設置在所述殼體上；支架；清潔件，所述清潔件在所述驅動件的作用下相對於所述殼體轉動；所述清潔件安裝於所述支架上；所述支架可在第一位置和第二位置之間轉動；在所述支架位於所述第一位置的情況下，所述清潔件與所述驅動件的驅動軸連接；在所述支架轉動至所述第二位置的情況下，所述清潔件與所述驅動件的驅動軸分離，並且在所述支架位於所述第二位置的情況下，所述清潔件可與所述支架分離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure provide a cleaning apparatus, a cleaning device, and a cleaning system. The cleaning apparatus includes: a housing; a driving member, arranged on the housing; a bracket; a cleaning member rotating relative to the housing under an action of the driving member; the cleaning member is mounted on the bracket; where the bracket is rotatable between a first position and a second position; when the bracket is in the first position, the cleaning member is connected to a driving shaft of the driving member; when the bracket rotates to the second position, the cleaning member is separated from the driving shaft of the driving member, and when the bracket is in the second position, the cleaning member is able to be separated from the bracket.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:殼體</p>  
        <p type="p">300:支架</p>  
        <p type="p">400:清潔件</p>  
        <p type="p">A:處</p>  
        <p type="p">e:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2243" publication-number="202612639"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612639.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612639</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148147</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>可拆卸清潔件、清潔裝置和清潔系統</chinese-title>  
        <english-title>DETACHABLE CLEANING MEMBER, CLEANING APPARATUS AND CLEANING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">A47L11/40</main-classification>  
        <further-classification edition="200601120251222B">A47L11/24</further-classification>  
        <further-classification edition="200601120251222B">A47L11/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周志威</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHOU, ZHIWEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙百年</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, BAINIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露的實施例提供了一種可拆卸清潔件、清潔裝置和清潔系統。其中可拆卸清潔件包括：自由端和固定端，所述固定端可拆卸連接於所述驅動組件上；清潔件可在驅動組件的作用下轉動；所述清潔件內設置有配合孔，配合孔內設置有至少一個配合凸起，所述配合凸起與驅動組件可分離的連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments of the present disclosure provide a detachable cleaning member, a cleaning apparatus, and a cleaning system. The detachable cleaning member includes: a free end and a fixed end, where the fixed end is detachably connected to a driving component; the cleaning member is rotatable under an action of the driving component; the cleaning member is defined with a fitting hole, and at least one fitting projection is provided inside the fitting hole, where the fitting projection is detachably connected to the driving component.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">400:清潔件</p>  
        <p type="p">410:配合凸起</p>  
        <p type="p">411:配合孔</p>  
        <p type="p">420:自由端</p>  
        <p type="p">430:固定端</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2244" publication-number="202612631"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612631.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612631</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148154</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>行走輪升降機構以及清潔設備</chinese-title>  
        <english-title>WALKING WHEEL LIFTING MECHANISM AND CLEANING DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">A47L11/24</main-classification>  
        <further-classification edition="200601120251222B">A47L11/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中國商北京石頭世紀科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>韓奕非</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAN, YIFEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李智軍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, ZHIJUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>包安寧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BAO, ANNING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱道文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, DAOWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪茂</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請揭露了一種行走輪升降機構（100）以及清潔設備（1000）。行走輪升降機構（100）包括行走輪組件（10）、動力組件（20）以及柔性連接件（30）。動力組件（20）包括轉動動力元件（21）和轉動盤（22），轉動動力元件（21）用於驅動轉動盤（22）沿相反的兩個方向轉動；柔性連接件（30）設於行走輪組件（10）與轉動盤（22）之間，用於在轉動盤（22）轉動過程中，通過改變暴露於行走輪組件（10）與轉動盤（22）之間的長度，以使行走輪組件（10）相對於設備本體（200）轉動；轉動盤（22）在行走輪組件（10）轉動過程中的轉動角度不超過360度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a walking wheel lifting mechanism (100) and a cleaning device (1000). The walking wheel lifting mechanism (100) includes a walking wheel assembly (10), a power assembly (20) and a flexible connector (30). The power assembly (20) includes a rotating power element (21) and a rotating disk (22), where the rotating power element (21) is configured to drive the rotating disk (22) to rotate in two opposite directions. The flexible connector (30) is arranged between the walking wheel assembly (10) and the rotating disk (22), and is configured to make the walking wheel assembly (10) rotate relative to the device body (200) by changing a length thereof exposed between the walking wheel assembly (10) and the rotating disk (22) during the rotation of the rotating disk (22). The rotation angle of the rotating disk (22) during the rotation of the walking wheel assembly (10) does not exceed 360 degrees.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:行走輪升降機構</p>  
        <p type="p">10:行走輪組件</p>  
        <p type="p">11:傳動裝置</p>  
        <p type="p">12:行走輪</p>  
        <p type="p">20:動力組件</p>  
        <p type="p">21:轉動動力元件</p>  
        <p type="p">22:轉動盤</p>  
        <p type="p">30:柔性連接件</p>  
        <p type="p">50:光感測器</p>  
        <p type="p">60:安裝軸座</p>  
        <p type="p">61:轉軸</p>  
        <p type="p">70:彈簧</p>  
        <p type="p">80:掛點部</p>  
        <p type="p">90:鉤部</p>  
        <p type="p">a:主輪部分</p>  
        <p type="p">b:自由部分</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2245" publication-number="202613642"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613642.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613642</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148266</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學成像系統</chinese-title>  
        <english-title>OPTICAL IMAGING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G02B9/64</main-classification>  
        <further-classification edition="200601120251229B">G02B13/00</further-classification>  
        <further-classification edition="200601120251229B">G02B13/18</further-classification>  
        <further-classification edition="200601120251229B">G02B15/14</further-classification>  
        <further-classification edition="200601120251229B">G02B5/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朴一容</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PARK, IL YONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐寅燾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, IN DO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種光學成像系統，包含自物側依次配置的第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡、第七透鏡、第八透鏡以及第九透鏡，其中第一透鏡及第二透鏡各自具有正折射能力，且滿足15 ＜ v7-v8 ＜ 25，其中v7指示第七透鏡的阿貝數，且v8指示第八透鏡的阿貝數。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical imaging system includes: a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, an eighth lens and a ninth lens, arranged in order from an object side, wherein the first lens and the second lens each have positive refractive power, and 15 ＜ v7-v8 ＜ 25 is satisfied, where v7 indicates an Abbe number of the seventh lens, and v8 indicates an Abbe number of the eighth lens.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光學成像系統</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:第六透鏡</p>  
        <p type="p">170:第七透鏡</p>  
        <p type="p">180:第八透鏡</p>  
        <p type="p">190:第九透鏡</p>  
        <p type="p">191:成像平面</p>  
        <p type="p">IRCF:濾光片</p>  
        <p type="p">IS:影像感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2246" publication-number="202614510"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614510.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614510</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148302</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線端連接器</chinese-title>  
        <english-title>WIRE END CONNECTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">H01R13/648</main-classification>  
        <further-classification edition="200601120251223B">H01R13/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝爾威勒電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BELLWETHER ELECTRONIC CORP.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀永良</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHI, YUNG-LIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊明勲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, MING-HSUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張耀暉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莊志強</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開一種電連接器組件，其包括線端連接器與板端連接器。板端連接器用以電連接一電路板。板端連接器包括第一殼體、插槽及多個導電端子。多個導電端子設置於插槽內部。線端連接器可分離的對接於板端連接器。板端連接器包括第二殼體與舌板。線端連接器具有四側壁以共同定義一收容空間。舌板設置於收容空間內。舌板連接一電纜組件，舌板的表面設有多個接觸墊。當板端連接器與線端連接器對接時，舌板插入插槽，使多個接觸墊與多個導電端子電性接觸，而第一殼體插入收容空間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical connector assembly includes a wire end connector and a board end connector. The board end connector is electrically connected on a circuit board. The board end connector includes a first housing, a socket, and a plurality of conductive terminals. The plurality of conductive terminals are disposed inside the socket. The wire end connector can be detachably connected to the board end connector. The board end connector includes a second housing and a tongue plate. The wire end connector has four side walls that collectively define accommodating space. The tongue plate is disposed inside the accommodating space. The tongue plate is connected to a cable assembly, and a plurality of contact pads are provided on a surface of the tongue plate. When the board end connector mates with the wire end connector, the tongue plate is inserted into the socket, so that the plurality of contact pads are in electrical contact with the plurality of conductive terminals, and the first housing is inserted into the accommodating space.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">2:線端連接器</p>  
        <p type="p">21:第二殼體</p>  
        <p type="p">211:卡固槽</p>  
        <p type="p">215:槽孔</p>  
        <p type="p">22:舌板</p>  
        <p type="p">23:接觸墊</p>  
        <p type="p">24:金屬框件</p>  
        <p type="p">244:懸臂</p>  
        <p type="p">25:彈性扣件</p>  
        <p type="p">26:拉帶</p>  
        <p type="p">261:纏繞部</p>  
        <p type="p">27:固持件</p>  
        <p type="p">270:導引口</p>  
        <p type="p">3:電纜組件</p>  
        <p type="p">P2:第二收容空間</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2247" publication-number="202613142"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613142.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613142</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148329</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>錫化合物之純化方法</chinese-title>  
        <english-title>METHODS FOR PURIFYING TIN COMPOUNDS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07F7/22</main-classification>  
        <further-classification edition="200601120260102B">B01D3/32</further-classification>  
        <further-classification edition="200601120260102B">B01D3/42</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蓋列斯特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GELEST, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德美拓也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUMI, TAKUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
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                <last-name>石井洸毅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHII, KOKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
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                <last-name>日置優太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIOKI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
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              <chinese-name name-type="organization"> 
                <last-name>桑原和宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUWABARA, KAZUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
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              <chinese-name name-type="organization"> 
                <last-name>八島重夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASHIMA, SHIGEO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
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              <chinese-name name-type="organization"> 
                <last-name>奥野泰弘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUNO, YASUHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙木真理</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAKI, MARI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>渡辺翔太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATANABE, SHOTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長坂剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGASAKA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
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            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅伯森　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERTSON, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="11"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴希克　布蘭登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DECICCO, BRANDON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
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    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種用於製備具有95莫耳%或更高之純度之由式(A1)表示之錫化合物之方法，其涉及蒸餾該錫化合物之步驟，其中該蒸餾板數為10或更多，且回流比為30或更少。 &lt;br/&gt;RSnX&lt;sub&gt;3&lt;/sub&gt;   (A1) &lt;br/&gt;在式(A1)中，R為具有1至30個碳原子之有機基，且可經鹵素、氧原子或氮原子取代。X選自OR'及NR'&lt;sub&gt;2&lt;/sub&gt;。R'為具有1至10個碳原子之有機基，且部分可經鹵素、氧原子或氮原子取代。當在該分子中存在多個R'基時，其可具有相同或不同結構，且其可彼此鍵結以形成環狀結構。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for producing a tin compound represented by formula (A1) with a purity of 95 mol% or higher, involves a step of distilling the tin compound, in which the number of plates of the distillation is 10 or more, and the reflux ratio is 30 or less. &lt;br/&gt;RSnX&lt;sub&gt;3&lt;/sub&gt; (A1) &lt;br/&gt;In formula (A1), R is an organic group with 1 to 30 carbon atoms, and may be substituted with halogen, oxygen atoms, or nitrogen atoms. X is selected from OR' and NR'&lt;sub&gt;2&lt;/sub&gt;. R' is an organic group with 1 to 10 carbon atoms, and part may be substituted with halogen, oxygen atoms, or nitrogen atoms. When there are multiple R' groups in the molecule, they may have the same or different structures, and they may be bonded to each other to form a cyclic structure.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2248" publication-number="202614606"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614606.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202614606</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148348</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊寫碼中之色度量化</chinese-title>  
        <english-title>CHROMA QUANTIZATION IN VIDEO CODING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">H04N11/06</main-classification>  
        <further-classification edition="201401120251222B">H04N19/122</further-classification>  
        <further-classification edition="201401120251222B">H04N19/186</further-classification>  
        <further-classification edition="201401120251222B">H04N19/102</further-classification>  
        <further-classification edition="201401120251222B">H04N19/124</further-classification>  
        <further-classification edition="201401120251222B">H04N19/126</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖拉比斯　亞歷山卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOURAPIS, ALEXANDROS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯特　蓋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COTE, GUY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用信號發送特定於量化群組之額外色度量化參數(QP)偏移值的方法，其中每一量化群組明確地規定其自身的色度QP偏移值集合。或者，在圖像之標頭區域中規定色度QP偏移值之可能集合之一表，且每一量化群組使用一索引自該表中選擇用於判定量化群組自身的色度QP偏移值集合的一項目。除針對視訊寫碼階層之較高層級已規定之色度QP偏移值之外，亦接著使用該等量化群組特定色度QP偏移值來判定量化群組內之區塊之色度QP值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of signaling additional chroma QP offset values that are specific to quantization groups is provided, in which each quantization group explicitly specifies its own set of chroma QP offset values. Alternatively, a table of possible sets of chroma QP offset values is specified in the header area of the picture, and each quantization group uses an index to select an entry from the table for determining its own set of chroma QP offset values. The quantization group specific chroma QP offset values are then used to determine the chroma QP values for blocks within the quantization group in addition to chroma QP offset values already specified for higher levels of the video coding hierarchy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:處理程序</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2249" publication-number="202614607"> 
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          <doc-number>202614607</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148349</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊寫碼中之色度量化</chinese-title>  
        <english-title>CHROMA QUANTIZATION IN VIDEO CODING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">H04N11/06</main-classification>  
        <further-classification edition="201401120251222B">H04N19/102</further-classification>  
        <further-classification edition="201401120251222B">H04N19/122</further-classification>  
        <further-classification edition="201401120251222B">H04N19/124</further-classification>  
        <further-classification edition="201401120251222B">H04N19/126</further-classification>  
        <further-classification edition="201401120251222B">H04N19/186</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖拉比斯　亞歷山卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOURAPIS, ALEXANDROS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯特　蓋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COTE, GUY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用信號發送特定於量化群組之額外色度量化參數(QP)偏移值的方法，其中每一量化群組明確地規定其自身的色度QP偏移值集合。或者，在圖像之標頭區域中規定色度QP偏移值之可能集合之一表，且每一量化群組使用一索引自該表中選擇用於判定量化群組自身的色度QP偏移值集合的一項目。除針對視訊寫碼階層之較高層級已規定之色度QP偏移值之外，亦接著使用該等量化群組特定色度QP偏移值來判定量化群組內之區塊之色度QP值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of signaling additional chroma QP offset values that are specific to quantization groups is provided, in which each quantization group explicitly specifies its own set of chroma QP offset values. Alternatively, a table of possible sets of chroma QP offset values is specified in the header area of the picture, and each quantization group uses an index to select an entry from the table for determining its own set of chroma QP offset values. The quantization group specific chroma QP offset values are then used to determine the chroma QP values for blocks within the quantization group in addition to chroma QP offset values already specified for higher levels of the video coding hierarchy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:處理程序</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2250" publication-number="202614608"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614608.zip"/> 
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      <volno>24</volno>  
      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202614608</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148351</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊寫碼中之色度量化</chinese-title>  
        <english-title>CHROMA QUANTIZATION IN VIDEO CODING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">H04N11/06</main-classification>  
        <further-classification edition="201401120251222B">H04N19/122</further-classification>  
        <further-classification edition="201401120251222B">H04N19/186</further-classification>  
        <further-classification edition="201401120251222B">H04N19/102</further-classification>  
        <further-classification edition="201401120251222B">H04N19/124</further-classification>  
        <further-classification edition="201401120251222B">H04N19/126</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖拉比斯　亞歷山卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOURAPIS, ALEXANDROS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯特　蓋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COTE, GUY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用信號發送特定於量化群組之額外色度量化參數(QP)偏移值的方法，其中每一量化群組明確地規定其自身的色度QP偏移值集合。或者，在圖像之標頭區域中規定色度QP偏移值之可能集合之一表，且每一量化群組使用一索引自該表中選擇用於判定量化群組自身的色度QP偏移值集合的一項目。除針對視訊寫碼階層之較高層級已規定之色度QP偏移值之外，亦接著使用該等量化群組特定色度QP偏移值來判定量化群組內之區塊之色度QP值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of signaling additional chroma QP offset values that are specific to quantization groups is provided, in which each quantization group explicitly specifies its own set of chroma QP offset values. Alternatively, a table of possible sets of chroma QP offset values is specified in the header area of the picture, and each quantization group uses an index to select an entry from the table for determining its own set of chroma QP offset values. The quantization group specific chroma QP offset values are then used to determine the chroma QP values for blocks within the quantization group in addition to chroma QP offset values already specified for higher levels of the video coding hierarchy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:處理程序</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2251" publication-number="202613125"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613125.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613125</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148353</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有二環性哌嗪環之苯并噁唑衍生物或其鹽之製造方法以及其原料之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D487/08</main-classification>  
        <further-classification edition="200601120260102B">C07D417/04</further-classification>  
        <further-classification edition="200601120260102B">C07D263/58</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商明治製菓藥業股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEIJI SEIKA PHARMA CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>津村武史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSUMURA, TAKESHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>一色聡志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISSHIKI, SATOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奥江雅之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKUE, MASAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木銳郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, TOSHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>節原謙一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUSHIHARA, KENICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>毛利伸介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOURI, SHINSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種式(1)表示之化合物或其鹽之製造方法，其係包含： &lt;br/&gt;　　使用式(2)表示之化合物或其鹽，製造式(3)表示之化合物或其鹽之步驟B，與 &lt;br/&gt;　　使用前述式(3)表示之化合物或其鹽，製造式(1)表示之化合物或其鹽之步驟C， &lt;br/&gt;&lt;img align="absmiddle" height="167px" width="195px" file="ed10068.JPG" alt="ed10068.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　[式(2)中， &lt;br/&gt;　　R&lt;sup&gt;a&lt;/sup&gt;表示氫原子或亦可經取代之芳基甲基， &lt;br/&gt;　　R&lt;sup&gt;b&lt;/sup&gt;表示亦可經取代之烷基或環狀烷基， &lt;br/&gt;　　R&lt;sup&gt;3&lt;/sup&gt;表示氫原子、鹵原子或噻唑-2-基， &lt;br/&gt;　　X&lt;sup&gt;a&lt;/sup&gt;表示氫原子或鹵原子] &lt;br/&gt;&lt;img align="absmiddle" height="193px" width="244px" file="ed10069.JPG" alt="ed10069.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　[式(3)中，Boc表示tert-丁氧基羰基]。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2252" publication-number="202612890"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612890.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612890</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148364</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>奈米壓印模具與斜面光柵製造方法</chinese-title>  
        <english-title>NANOIMPRINTING MOLD AND SLANTED GRATING MANUFACTURING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B29C43/02</main-classification>  
        <further-classification edition="200601120251229B">B29C43/34</further-classification>  
        <further-classification edition="200601120251229B">B29C43/50</further-classification>  
        <further-classification edition="200601120251229B">B29C43/52</further-classification>  
        <further-classification edition="201101120251229B">B82Y40/00</further-classification>  
        <further-classification edition="200601120251229B">G02B5/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鉅嘉聯合科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GIGA-IMAGE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>臺北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>顏士傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YEN, SHIH-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊勝傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, SHENG-CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝佩玲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王耀華</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳仕勳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種奈米壓印模具，用以壓印被塗布在基材上的壓印材料以形成斜面光柵，其包括：第一模座；及第二模座，被配置為與第一模座合模，基材被夾設於第一模座與第二模座之間，第二模座包括：第一斜孔，具有斜面，第一斜孔的第一端貫穿第二模座的第一面並面對基材，第一斜孔的第二端貫穿第二模座的第二面；及第一斜銷，可沿移動方向移動於第一斜孔內，第一斜銷與基材接觸的一面具有多個凹陷紋路，各凹陷紋路具有斜面，第一斜銷可壓印被塗布在基材上的壓印材料以形成斜面光柵；其中，移動方向與各凹陷紋路的斜面及斜面光柵的斜面實質上互相平行。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A nanoimprinting mold, for imprinting an imprinting material was coated on a substrate to form a slanted grating, it includes: a first molding base; and a second molding base configured to close with the first molding base, the substrate sandwiched between the first molding base and the second molding base, and the second molding base includes a first inclined hole with an inclined surface, a first end of the first inclined hole penetrating a first surface of the second molding base and facing the substrate, and a second end of the first inclined hole penetrating a second surface of the second molding base; and a first inclined pin movable in the first inclined hole along a moving direction, a surface of the first inclined pin contacting with the substrate with a plurality of recessed patterns, each recessed pattern with an inclined surface, and the first inclined pin capable of imprinting the imprinting material coated on the substrate to form the slanted grating; wherein, the direction of exiting mold is substantially parallel to the inclined surface of each recessed pattern and the inclined surface of the slanted grating.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:第一模座</p>  
        <p type="p">2:第二模座</p>  
        <p type="p">8:基材</p>  
        <p type="p">9:斜面光柵</p>  
        <p type="p">21:第一斜孔</p>  
        <p type="p">21T:斜面</p>  
        <p type="p">23:第一斜銷</p>  
        <p type="p">210:壓印材料</p>  
        <p type="p">211:第一端</p>  
        <p type="p">212:第二端</p>  
        <p type="p">221:第一面</p>  
        <p type="p">222:第二面</p>  
        <p type="p">231:凹陷紋路</p>  
        <p type="p">232:連接桿</p>  
        <p type="p">233:模仁</p>  
        <p type="p">231T:斜面</p>  
        <p type="p">9T:斜面</p>  
        <p type="p">D1:移動方向</p>  
        <p type="p">D2:開閉模方向</p>  
        <p type="p">D3:水平方向</p>  
        <p type="p">M1:奈米壓印模具</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2253" publication-number="202612620"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612620.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612620</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148387</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>嬰兒床及嬰兒床架</chinese-title>  
        <english-title>CRIB AND CRIB FRAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">A47D9/00</main-classification>  
        <further-classification edition="200601120251229B">A47D7/01</further-classification>  
        <further-classification edition="200601120251229B">A47D13/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, TAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐頌雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及嬰兒床及嬰兒床架，嬰兒床架具有供使用的展開狀態和供收納的收折狀態，嬰兒床架包括：扶手組件，包括兩個扶手管，兩個扶手管的一端相互樞接以使扶手組件可收折；側杆組件，包括彼此交叉樞接的兩個立柱，且兩個立柱的頂端分別與兩個扶手管樞接且滑動地連接；當嬰兒床架處於展開狀態時，兩個立柱的頂端相互遠離且兩個扶手管處於同一直線上；當嬰兒床架處於收折狀態時，兩個立柱的頂端相互靠攏且兩個扶手管相對收折。由於側杆組件中的兩立柱不僅分別與扶手組件保持連接，兩立柱之間還交叉連接，如此，相對於傳統側杆組件而言，本發明中的側杆組件受力支撐點增多，進而可加強嬰兒床架的結構強度，使得嬰兒床穩定性更佳。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure relates to a crib and a crib frame. The crib frame includes an armrest assembly and a side rod assembly. The armrest assembly includes two armrest tubes. One ends of the two armrest tubes are pivotally connected to each other. The side rod assembly includes two upright posts which are crossed and pivotally connected to each other. Top ends of the two upright posts are pivotally and slidably connected to the two armrest tubes respectively. When the crib frame is in the unfolded state, the top ends of the two upright posts are far away from each other, and the two armrest tubes are in a same straight line. When the crib frame is in the folded state, the top ends of the two upright posts are close to each other, and the two armrest tubes are folded relatively.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:嬰兒床架</p>  
        <p type="p">110:扶手組件</p>  
        <p type="p">111:扶手管</p>  
        <p type="p">112:扶手樞轉座</p>  
        <p type="p">113:扶手套管</p>  
        <p type="p">120:側杆組件</p>  
        <p type="p">121:立柱</p>  
        <p type="p">130:收折支撐組件</p>  
        <p type="p">131:支撐件</p>  
        <p type="p">140:滑動件</p>  
        <p type="p">160:樞接底座</p>  
        <p type="p">170:轉角件</p>  
        <p type="p">171:第一樞接斜面</p>  
        <p type="p">180:連接組件</p>  
        <p type="p">181:中心樞接件</p>  
        <p type="p">182:底杆</p>  
        <p type="p">190:拉動件</p>  
        <p type="p">F1:第一方向</p>  
        <p type="p">F2:第二方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2254" publication-number="202612587"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612587.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612587</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148425</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>殺真菌劑混合物</chinese-title>  
        <english-title>FUNGICIDAL MIXTURES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A01N43/56</main-classification>  
        <further-classification edition="200601120260102B">A01N43/828</further-classification>  
        <further-classification edition="200601120260102B">A01N43/84</further-classification>  
        <further-classification edition="200601120260102B">A01N43/90</further-classification>  
        <further-classification edition="200601120260102B">A01N43/653</further-classification>  
        <further-classification edition="200601120260102B">A01N43/66</further-classification>  
        <further-classification edition="200601120260102B">A01N43/54</further-classification>  
        <further-classification edition="200601120260102B">A01N37/46</further-classification>  
        <further-classification edition="200601120260102B">A01N37/22</further-classification>  
        <further-classification edition="200601120260102B">A01N47/38</further-classification>  
        <further-classification edition="200601120260102B">A01N47/12</further-classification>  
        <further-classification edition="200601120260102B">A01N43/88</further-classification>  
        <further-classification edition="200601120260102B">A01N35/06</further-classification>  
        <further-classification edition="200601120260102B">A01N47/44</further-classification>  
        <further-classification edition="200601120260102B">A01N43/40</further-classification>  
        <further-classification edition="200601120260102B">A01N43/38</further-classification>  
        <further-classification edition="200601120260102B">A01N47/04</further-classification>  
        <further-classification edition="200601120260102B">A01N47/18</further-classification>  
        <further-classification edition="200601120260102B">A01N43/32</further-classification>  
        <further-classification edition="200601120260102B">A01P3/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商富曼西公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FMC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>隆　傑佛瑞　基斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LONG, JEFFREY KEITH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奇塔博納　斯林凡斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHITTABOINA, SRINIVAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>麥克瑪恩　崔維斯　錢德勒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MCMAHON, TRAVIS CHANDLER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳傳岳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭雨嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">係揭示一種殺真菌組合物，包含（a）至少一化合物，其選自於式&lt;b&gt;1&lt;/b&gt;化合物，包括其所有幾何和立體異構物、互變異構物，&lt;i&gt;N&lt;/i&gt;-氧化物及其鹽類， &lt;br/&gt;&lt;img align="absmiddle" height="212px" width="271px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中 &lt;br/&gt;R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;、R&lt;sup&gt;5&lt;/sup&gt;、R&lt;sup&gt;6&lt;/sup&gt;、m與n係如本發明揭示所定義， &lt;br/&gt;以及（b）至少一額外的殺真菌化合物。 &lt;br/&gt;亦揭示一種用於防治由真菌植物病原體引起的植物病害之方法，該方法包括向該植物或其部分，或植物種子施用殺真菌有效量的式&lt;b&gt;1&lt;/b&gt;化合物、其&lt;i&gt;N&lt;/i&gt;-氧化物或其鹽類（例如，作為上述組合物之一成分）。亦揭示一種組合物，其包含：（a）至少一選自於上述式&lt;b&gt;1&lt;/b&gt;化合物、其&lt;i&gt;N&lt;/i&gt;-氧化物及其鹽類之化合物；以及至少一無脊椎動物害蟲防治化合物或試劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a fungicidal composition comprising (a) at least one compound selected from the compounds of Formula &lt;b&gt;1&lt;/b&gt;, including all geometric and stereoisomers, tautomers, &lt;i&gt;N&lt;/i&gt;-oxides, and salts thereof, &lt;br/&gt;&lt;img align="absmiddle" height="212px" width="271px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein &lt;br/&gt;R&lt;sup&gt;1&lt;/sup&gt;,R&lt;sup&gt;2&lt;/sup&gt;,R&lt;sup&gt;3&lt;/sup&gt;,R&lt;sup&gt;4&lt;/sup&gt;,R&lt;sup&gt;5&lt;/sup&gt;,R&lt;sup&gt;6&lt;/sup&gt;, m and N are as defined in the disclosure. &lt;br/&gt;and (b) at least one additional fungicidal compound. &lt;br/&gt;Also disclosed is a method for controlling plant diseases caused by fungal plant pathogens comprising applying to the plant or portion thereof, or to the plant seed, a fungicidally effective amount of a compound of Formula &lt;b&gt;1&lt;/b&gt;, an &lt;i&gt;N&lt;/i&gt;-oxide, or salt thereof (e.g., as a component in the aforesaid composition). Also disclosed is a composition comprising: (a) at least one compound selected from the compounds of Formula &lt;b&gt;1&lt;/b&gt;described above, &lt;i&gt;N&lt;/i&gt;-oxides, and salts thereof and at least one invertebrate pest control compound or agent.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2255" publication-number="202612738"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612738.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612738</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148461</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對雙重難治性黑色素瘤使用腫瘤浸潤性淋巴細胞之方法</chinese-title>  
        <english-title>METHODS OF USING TUMOR INFILTRATING LYMPHOCYTES IN DOUBLE-REFRACTORY MELANOMA</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251230B">A61K40/11</main-classification>  
        <further-classification edition="202501120251230B">A61K40/42</further-classification>  
        <further-classification edition="201001120251230B">C12N5/078</further-classification>  
        <further-classification edition="202501120251230B">A61K35/17</further-classification>  
        <further-classification edition="200601120251230B">A61P35/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾歐凡斯生物治療公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IOVANCE BIOTHERAPEUTICS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法笛斯　瑪利亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FARDIS, MARIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示使用腫瘤浸潤性淋巴細胞治療其他療法所難治的黑色素瘤之方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods of treating melanomas refractory to other therapies using tumor infiltrating lymphocytes are disclosed.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2256" publication-number="202613603"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613603.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613603</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148497</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用於低光程距離背光模組的擴散板</chinese-title>  
        <english-title>DIFFUSION PLATE FOR USE IN BACKLIGHT MODULE WITH LOW OPTICAL PATH DISTANCE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">G02B5/02</main-classification>  
        <further-classification edition="200601120251223B">G02B1/04</further-classification>  
        <further-classification edition="200601120251223B">B29C44/60</further-classification>  
        <further-classification edition="202501120251223B">H10H29/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>穎台科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTIRE TECHNOLOGY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>桃園市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊志文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, CHIH WEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張裕偉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, YU WEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種應用於低光程距離背光模組的擴散板，可供組裝於以發光二極體(LED)為下方光源的一背光模組上。於擴散板的表層及主板層中分別添加不同擴散粒子添加劑，再以發泡技術押出。藉由把擴散板的表層與主板層中的原樹酯材料、微氣泡、以及擴散粒子添加劑的折射率與添加量做不同搭配，使上、下兩表層對於光線的折射率實質上大於主板層的折射率，可將下方光源所發出的光線做更有效的擴散，進而達到更佳的遮蔽MURA效果，以產生一個均勻的面光源。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a diffusion plate for use in a backlight module with a low optical path (OD) distance, which can be assembled on a backlight module with a plurality of light emitting diodes (LEDs) as the light source below. Different diffusion particle additives are added to the surface layers and the main layer of the diffusion plate, and then extrude it with foaming extrusion technology. By making different combinations of the refractive index and the amount of the original resin materials, microbubbles, and diffusion particle additives of the surface layers and the main layer, the light refractive index of the upper and lower surface layers can be substantially greater than which of the main layer. Such that, the light emitted by the light source below can be diffused more effectively, and thereby achieving a better shading effect of MURA, so as to produce a uniform surface light source.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:板體</p>  
        <p type="p">101:主板層</p>  
        <p type="p">1011、1021、1031:擴散粒子</p>  
        <p type="p">1012:微氣泡</p>  
        <p type="p">102、103:表層</p>  
        <p type="p">1022、1032:微結構</p>  
        <p type="p">91:基板</p>  
        <p type="p">911:頂面</p>  
        <p type="p">92:發光元件</p>  
        <p type="p">93:液晶面板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2257" publication-number="202613882"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613882.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613882</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148498</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>利用人工智慧處理模組來降低影像串流所需網路頻寬的方法</chinese-title>  
        <english-title>METHOD FOR REDUCING NETWORK BANDWIDTH REQUIRED FOR IMAGE STREAMING BY USING ARTIFICIAL INTELLIGENCE PROCESSING MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251229B">G06N3/04</main-classification>  
        <further-classification edition="202301120251229B">G06N3/08</further-classification>  
        <further-classification edition="201101120251229B">H04N21/20</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商優必達株式會社股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KABUSHIKI KAISHA UBITUS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭榮昌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUO, JUNG CHANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>曹文凱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TSAO, WEN KAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳英豪</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, YING HAU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳明哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種利用人工智慧處理模組來降低影像串流所需網路頻寬的方法，藉由在伺服器端先將欲傳輸之影像的解析度降低後再透過網路把低解析度影像傳輸給客戶端，藉以降低傳輸影像串流所需的網路頻寬。然後，在客戶端藉由一預先訓練之人工智慧(Artificial Intelligent；簡稱AI)處理模組，把所接收到的低解析度影像還原成高解析度影像，可同時享受高品質影像串流及低網路頻寬消耗的雙重優點。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for reducing network bandwidth required for image streaming by using an Artificial Intelligence (AI) processing module. The resolution of the images to be transmitted are firstly reduced on the server side, and then the resolution-reduced low-resolution images are transmitted to the client device through the network, thereby reducing the network bandwidth required to transmit the image streams. A pre-trained AI processing module is used on the client device to restore the received low-resolution images to high-resolution images, allowing users to enjoy high-quality image streaming and low-bandwidth consumption of network at the same time.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">701:伺服器</p>  
        <p type="p">702:客戶端裝置</p>  
        <p type="p">711-718:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2258" publication-number="202613143"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613143.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613143</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148591</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>錫化合物、錫組合物、彼等之製造方法、阻劑溶液、圖案形成方法、薄膜、經圖案化之薄膜及基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07F7/22</main-classification>  
        <further-classification edition="200601120260102B">G03F7/004</further-classification>  
        <further-classification edition="200601120260102B">G03F7/20</further-classification>  
        <further-classification edition="200601120260102B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蓋列斯特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GELEST, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日置優太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIOKI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>八幡澄子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAHATA, SUMIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡部　漆原紅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKABE URUSHIBARA, KO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供下述之錫化合物，其藉由平衡性良好地具有溶解性、疏水性、阻劑感度等特性而成為高性能之阻劑材料。 &lt;br/&gt;本發明之錫化合物係具有錫原子、有機基R、氧配位基及/或羥配位基者，且於上述錫化合物1分子中包含2種以上之上述有機基R，且包含Sn-O-Sn結構，上述有機基R具有1～30個碳原子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2259" publication-number="202613871"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613871.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613871</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148596</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於確定在半導體裝置虛擬製造環境中的規格界限之非暫態電腦可讀媒體、計算裝置實現的方法及計算系統</chinese-title>  
        <english-title>NON-TRANSITORY COMPUTER-READABLE MEDIUM, COMPUTING DEVICE-IMPLEMENTED METHOD, AND COMPUTING SYSTEM FOR DETERMINING SPECIFICATION LIMITS IN A SEMICONDUCTOR DEVICE VIRTUAL FABRICATION ENVIRONMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251223B">G06F30/367</main-classification>  
        <further-classification edition="202001120251223B">G06F30/373</further-classification>  
        <further-classification edition="202001120251223B">G06F30/392</further-classification>  
        <further-classification edition="202001320251223B">G06F119/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商科文特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COVENTOR, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伊根　威廉　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EGAN, WILLIAM J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孔瓦爾　阿許曼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUNWAR, ANSHUMAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格雷內爾　肯尼斯　Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GREINER, KENNETH B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佛萊德　大衛　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRIED, DAVID M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許峻榮</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種虛擬製造環境，用於半導體裝置製造，包括一分析模組，針對非常態分佈的虛擬計量資料而使用一擬合演算法來確定規格界限。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A virtual fabrication environment for semiconductor device fabrication that includes an analytics module for determining specification limits using a fitting algorithm for non-normally distributed virtual metrology data is discussed.</p> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2260" publication-number="202612920"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612920.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612920</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148615</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>輪式移動裝置</chinese-title>  
        <english-title>WHEELED MOBILE DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">B60B30/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭欽明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHENG, CHINMING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭征文</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, ZHENGWEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易小龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI, XIAOLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪爾學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ERXUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐頌雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種輪式移動裝置，包括：架體；至少一個車輪，設置在架體下方，車輪能相對於架體圍繞一定向軸線旋轉；以及限制結構，設置在架體與車輪之間，其中限制結構包括具有第一端和第二端的限位槽，限位槽繞定向軸線並介於第一端和第二端之間連續地延伸，架體設有能被限制於限位槽的第一端和第二端之間移動的第一限位部，由此限制車輪繞定向軸線的旋轉範圍；其中限位槽的第一端和第二端中之一者處於定向軸線前方與第一限位部抵接的位置形成旋轉範圍的初始位置，限位槽的第一端和第二端中之另一者處於定向軸線前方與第一限位部抵接的位置形成旋轉範圍的終止位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A wheeled mobile device includes: a frame body; at least one wheel provided below the frame body and rotatable around a directional axis relative to the frame body; and a limiting structure provided between the frame body and the wheel, wherein the limiting structure includes a limiting slot having a first and a second end, the limiting slot extends around the directional axis in a continuous manner between the first and the second end, and the frame body has a first limiting part that can be restricted to move between the first and the second end of the limiting slot, whereby limiting a rotation range of the wheel around the directional axis; wherein a position of one of the first and the second end of the limiting slot in front of the directional axis abutting against the first limiting part forms an initial position of the rotation range, and a position of the other one of the first and the second end of the limiting slot in front of the directional axis abutting against the first limiting part forms an end position of the rotation range.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:限制結構</p>  
        <p type="p">110:第一殼體</p>  
        <p type="p">112:第一部段</p>  
        <p type="p">113:第二部段</p>  
        <p type="p">120:第二殼體</p>  
        <p type="p">121:第二限位部</p>  
        <p type="p">122:定向軸孔</p>  
        <p type="p">123:鎖定孔</p>  
        <p type="p">124:盤狀部</p>  
        <p type="p">125:輪座連接部</p>  
        <p type="p">140:第一限位部</p>  
        <p type="p">300:車輪</p>  
        <p type="p">310:輪座</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2261" publication-number="202614167"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614167.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614167</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148621</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理方法</chinese-title>  
        <english-title>SUBSTRATE PROCESSING METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H01L21/027</main-classification>  
        <further-classification edition="200601120251229B">H01L21/30</further-classification>  
        <further-classification edition="200601120251229B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商斯庫林集團股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>竹松佑介</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKEMATSU, YUSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤雅彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, MASAHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石津岳明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ISHIZU, TAKAAKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>仲野彰義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAKANO, AKIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>白尾高</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIRAO, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之目的在於提供一種可有效地降低基板之圖案之倒塌率之技術。 &lt;br/&gt;本發明之基板處理方法具備保持工序、液供給工序、乾燥液供給工序、及乾燥工序。於保持工序中，保持具有形成有圖案之第1主表面、及與第1主表面為相反側之第2主表面之基板。於液供給工序中，對基板之第1主表面供給處理液。於乾燥液供給工序中，於液供給工序之後，將基板之第2主表面之至少一部分加熱至乾燥液之沸點bp以上，且以基板之第1主表面之溫度未達乾燥液之沸點bp之流量，將乾燥液供給至基板之第1主表面。於乾燥工序中，於乾燥液供給工序之後，使基板乾燥。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">32i:供給閥</p>  
        <p type="p">42:供給閥</p>  
        <p type="p">bp:沸點</p>  
        <p type="p">G1~G5:圖表</p>  
        <p type="p">S4:液供給工序(步驟)</p>  
        <p type="p">S5:乾燥液供給工序(步驟)</p>  
        <p type="p">S6:乾燥工序(步驟)</p>  
        <p type="p">t1:時點</p>  
        <p type="p">t2:時點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2262" publication-number="202614066"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614066.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202614066</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148661</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體記憶裝置</chinese-title>  
        <english-title>SEMICONDUCTOR MEMORY DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">G11C16/06</main-classification>  
        <further-classification edition="200601120251219B">H01L23/538</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商鎧俠股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIOXIA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荒井伸也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARAI, SHINYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">實施方式之半導體記憶裝置具備：第1晶片；及第2晶片，其與第1晶片相接，且經由第1連接墊而與第1晶片電性連接；第2晶片包含：記憶胞陣列，其設置於第1區域，且具有源極線、複數條字元線、及記憶柱；第1接點，其設置於第2區域，沿Z方向延伸，且與第1連接墊電性連接；及第1配線，其具有第1連接部分及第1延伸部分，該第1連接部分與第1接點之上端電性連接，該第1延伸部分係從第1連接部分之上端連續，於Z方向上之比源極線之上表面靠上方之位置從第1連接部分延伸；第1連接部分係具有將Z方向上之第1接點之上方之溝槽嵌埋至Z方向上之第1延伸部分之下表面之位置之形狀，且第1連接部分之下表面位於Z方向上比源極線之上表面靠下方之位置。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1-1:電路晶片</p>  
        <p type="p">1-2:記憶晶片</p>  
        <p type="p">10:記憶胞陣列</p>  
        <p type="p">30,31,31A,32,32A,36,39,101,102,103-1,103-2,104-1,104-2,105-1,105-2,106-1,106-2,201-1,201-2,202-1,202-2,203-1,203-2,204-1,204-2,205,205-1,206-1,206-2,206-3,207-1,207-2,207-3:導電體層</p>  
        <p type="p">44,45,46,47,48a,48b,48c,60,61,62:絕緣體層</p>  
        <p type="p">70:半導體基板</p>  
        <p type="p">301,302:半導體層</p>  
        <p type="p">PD:電極墊</p>  
        <p type="p">R1:區域</p>  
        <p type="p">SLT:構件</p>  
        <p type="p">Tr1,Tr2:電晶體</p>  
        <p type="p">V1,V2:連接部分</p>  
        <p type="p">X,Y,Z1:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2263" publication-number="202614609"> 
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        <document-id> 
          <doc-number>202614609</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148695</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊寫碼中之色度量化</chinese-title>  
        <english-title>CHROMA QUANTIZATION IN VIDEO CODING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H04N11/06</main-classification>  
        <further-classification edition="201401120260102B">H04N19/122</further-classification>  
        <further-classification edition="201401120260102B">H04N19/186</further-classification>  
        <further-classification edition="201401120260102B">H04N19/102</further-classification>  
        <further-classification edition="201401120260102B">H04N19/124</further-classification>  
        <further-classification edition="201401120260102B">H04N19/126</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖拉比斯　亞歷山卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOURAPIS, ALEXANDROS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯特　蓋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COTE, GUY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用信號發送特定於量化群組之額外色度量化參數(QP)偏移值的方法，其中每一量化群組明確地規定其自身的色度QP偏移值集合。或者，在圖像之標頭區域中規定色度QP偏移值之可能集合之一表，且每一量化群組使用一索引自該表中選擇用於判定量化群組自身的色度QP偏移值集合的一項目。除針對視訊寫碼階層之較高層級已規定之色度QP偏移值之外，亦接著使用該等量化群組特定色度QP偏移值來判定量化群組內之區塊之色度QP值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of signaling additional chroma QP offset values that are specific to quantization groups is provided, in which each quantization group explicitly specifies its own set of chroma QP offset values. Alternatively, a table of possible sets of chroma QP offset values is specified in the header area of the picture, and each quantization group uses an index to select an entry from the table for determining its own set of chroma QP offset values. The quantization group specific chroma QP offset values are then used to determine the chroma QP values for blocks within the quantization group in addition to chroma QP offset values already specified for higher levels of the video coding hierarchy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:處理程序</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2264" publication-number="202614610"> 
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          <doc-number>202614610</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148696</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊寫碼中之色度量化</chinese-title>  
        <english-title>CHROMA QUANTIZATION IN VIDEO CODING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H04N11/06</main-classification>  
        <further-classification edition="201401120260102B">H04N19/122</further-classification>  
        <further-classification edition="201401120260102B">H04N19/186</further-classification>  
        <further-classification edition="201401120260102B">H04N19/102</further-classification>  
        <further-classification edition="201401120260102B">H04N19/124</further-classification>  
        <further-classification edition="201401120260102B">H04N19/126</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖拉比斯　亞歷山卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOURAPIS, ALEXANDROS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯特　蓋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COTE, GUY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用信號發送特定於量化群組之額外色度量化參數(QP)偏移值的方法，其中每一量化群組明確地規定其自身的色度QP偏移值集合。或者，在圖像之標頭區域中規定色度QP偏移值之可能集合之一表，且每一量化群組使用一索引自該表中選擇用於判定量化群組自身的色度QP偏移值集合的一項目。除針對視訊寫碼階層之較高層級已規定之色度QP偏移值之外，亦接著使用該等量化群組特定色度QP偏移值來判定量化群組內之區塊之色度QP值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of signaling additional chroma QP offset values that are specific to quantization groups is provided, in which each quantization group explicitly specifies its own set of chroma QP offset values. Alternatively, a table of possible sets of chroma QP offset values is specified in the header area of the picture, and each quantization group uses an index to select an entry from the table for determining its own set of chroma QP offset values. The quantization group specific chroma QP offset values are then used to determine the chroma QP values for blocks within the quantization group in addition to chroma QP offset values already specified for higher levels of the video coding hierarchy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:處理程序</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2265" publication-number="202614611"> 
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        <document-id> 
          <doc-number>114148699</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>視訊寫碼中之色度量化</chinese-title>  
        <english-title>CHROMA QUANTIZATION IN VIDEO CODING</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H04N11/06</main-classification>  
        <further-classification edition="201401120260102B">H04N19/122</further-classification>  
        <further-classification edition="201401120260102B">H04N19/186</further-classification>  
        <further-classification edition="201401120260102B">H04N19/102</further-classification>  
        <further-classification edition="201401120260102B">H04N19/124</further-classification>  
        <further-classification edition="201401120260102B">H04N19/126</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蘋果公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>APPLE INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>圖拉比斯　亞歷山卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOURAPIS, ALEXANDROS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CY</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯特　蓋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COTE, GUY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃章典</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用信號發送特定於量化群組之額外色度量化參數(QP)偏移值的方法，其中每一量化群組明確地規定其自身的色度QP偏移值集合。或者，在圖像之標頭區域中規定色度QP偏移值之可能集合之一表，且每一量化群組使用一索引自該表中選擇用於判定量化群組自身的色度QP偏移值集合的一項目。除針對視訊寫碼階層之較高層級已規定之色度QP偏移值之外，亦接著使用該等量化群組特定色度QP偏移值來判定量化群組內之區塊之色度QP值。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of signaling additional chroma QP offset values that are specific to quantization groups is provided, in which each quantization group explicitly specifies its own set of chroma QP offset values. Alternatively, a table of possible sets of chroma QP offset values is specified in the header area of the picture, and each quantization group uses an index to select an entry from the table for determining its own set of chroma QP offset values. The quantization group specific chroma QP offset values are then used to determine the chroma QP values for blocks within the quantization group in addition to chroma QP offset values already specified for higher levels of the video coding hierarchy.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">700:處理程序</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2266" publication-number="202613547"> 
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        <document-id> 
          <doc-number>202613547</doc-number> 
        </document-id> 
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      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148702</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>線上微環境污染檢測與監測系統</chinese-title>  
        <english-title>IN-LINE MINI-ENVIRONMENT CONTAMINATION DETECTION AND MONITORING SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">G01N33/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>創控科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRICORNTECH CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新北市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周　宗冠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHOU, TSUNG-KUAN A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王　禮鵬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, LI-PENG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蕭敬霖</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIAO, CHING-LIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>董為劭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TUNG, WEI-SHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂光</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>邵而康</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示包含一或多個入口及一或多個出口之主動流量控制系統之實施例。第一出口經組態以流體地耦合至微環境之入口，且第一入口經組態以耦合至該微環境之出口。該主動流量控制系統包含一或多個流量控制組態；各流量控制組態對應於流量控制模式。該一或多個流量組態包含對應於取樣模式之組態。該取樣模式包含將中性流體自該第一出口注入至該微環境之該入口，且將通過該微環境之該出口離開之混合流體引導至該主動流量控制系統之該第一入口，該混合流體為該中性流體及在將該中性流體注入至該微環境中之前在該微環境中之流體之組合。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Embodiments are disclosed of an active flow control system including one or more inlets and one or more outlets. A first outlet is configured to be fluidly coupled to an inlet of a mini-environment, and a first inlet is configured to be coupled to an outlet of the mini-environment. The active flow control system includes one or more flow control configurations; each flow control configuration corresponds to a flow control mode. The one or more flow configurations include a configuration corresponding to a sampling mode. The sampling mode includes injecting a neutral fluid from the first outlet into the inlet of the mini-environment, and directing a mixed fluid exiting through the outlet of the mini-environment to the first inlet of the active flow control system, the mixed fluid being a combination of the neutral fluid and the fluid that was in the mini-environment before injecting the neutral fluid into the mini-environment.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">108:程序裝載鎖腔室</p>  
        <p type="p">300:系統及方法</p>  
        <p type="p">302:微環境</p>  
        <p type="p">302i:流體入口</p>  
        <p type="p">302o:流體出口</p>  
        <p type="p">304:主動流量控制模組/主動流量控制系統/主動流量控制件/裝載埠單元(LPU)</p>  
        <p type="p">304i:入口</p>  
        <p type="p">304o:出口</p>  
        <p type="p">306:污染分析系統</p>  
        <p type="p">308:流體管線</p>  
        <p type="p">310:流體管線</p>  
        <p type="p">312:流體管線</p>  
        <p type="p">314:控制中心</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2267" publication-number="202613591"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613591.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613591</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148733</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雷達系統以及用於雷達系統的資料處理方法</chinese-title>  
        <english-title>RADAR SYSTEM AND DATA PROCESSING METHOD FOR RADAR SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">G01S13/02</main-classification>  
        <further-classification edition="200601120251219B">G01S13/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>創未來科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRON FUTURE TECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃彥銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯承詠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, CHENG-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂保明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, PAO MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇柏青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, BOR-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王毓駒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-JIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃愷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種雷達系統的方法，其包含第一子陣列、第二子陣列與第三子陣列。該第一子陣列包含多個第一天線。該第二子陣列包含多個第二天線。該第三子陣列包含多個第三天線。該第三子陣列用以將從該第一子陣列接收的第一組資料及從該第二子陣列接收的第二組資料合併成一組合併後的資料、對該組合併後的資料進行波束成形處理以產生指示出目標物方位角資訊的第一波束成形資料，以及根據該多個第三天線所接收的多個輸入訊號來產生指示出目標物仰角資訊的第二波束成形資料。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A radar system includes a first subarray, a second subarray and a third subarray. The first subarray includes a plurality of first antennas. The second subarray includes a plurality of second antennas. The third subarray includes a plurality of third antennas. The third subarray is configured to combine a first set of data received from the first subarray and a second set of data received from the second subarray into a combined set of data, generate first beamformed data indicating target azimuth information by applying beamforming to the combined set of data, and generate second beamformed data indicating target elevation information according to a plurality of input signals received by the third antennas.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:雷達系統</p>  
        <p type="p">110,120,130:子陣列</p>  
        <p type="p">112_1~112_m,122_1~122_n,132_1~132_p:天線</p>  
        <p type="p">301,302,303:電路板</p>  
        <p type="p">310A,320A:訊號產生電路</p>  
        <p type="p">310B,320B,330B:訊號處理電路</p>  
        <p type="p">312,322.332:相位陣列天線電路</p>  
        <p type="p">314A,324A:射頻傳送端電路</p>  
        <p type="p">314B,324B,334B:射頻接收端電路</p>  
        <p type="p">316A,326A:類比傳送端電路</p>  
        <p type="p">316B,326B,336B:類比接收端電路</p>  
        <p type="p">318A,328A:數位傳送端電路</p>  
        <p type="p">318B,328B,338B:數位接收端電路</p>  
        <p type="p">{D1},{D2}:一組資料</p>  
        <p type="p">S&lt;sub&gt;AO1_1&lt;/sub&gt;~S&lt;sub&gt;AO1_m&lt;/sub&gt;,S&lt;sub&gt;AO2_1&lt;/sub&gt;~S&lt;sub&gt;AO2_n&lt;/sub&gt;:電訊號</p>  
        <p type="p">S&lt;sub&gt;AI1_1&lt;/sub&gt;~S&lt;sub&gt;AI1_m&lt;/sub&gt;,S&lt;sub&gt;AI2_1&lt;/sub&gt;~S&lt;sub&gt;AI2_n&lt;/sub&gt;,S&lt;sub&gt;AI3_1&lt;/sub&gt;~S&lt;sub&gt;AI3_p&lt;/sub&gt;:電訊號</p>  
        <p type="p">S&lt;sub&gt;BC1_1&lt;/sub&gt;~S&lt;sub&gt;BC1_m&lt;/sub&gt;,S&lt;sub&gt;BC2_1&lt;/sub&gt;~S&lt;sub&gt;BC2_n&lt;/sub&gt;,S&lt;sub&gt;BC3_1&lt;/sub&gt;~S&lt;sub&gt;BC3_p&lt;/sub&gt;:輸入訊號</p>  
        <p type="p">S&lt;sub&gt;DO1_1&lt;/sub&gt;~S&lt;sub&gt;DO1_m&lt;/sub&gt;,S&lt;sub&gt;DO2_1&lt;/sub&gt;~S&lt;sub&gt;DO2_n&lt;/sub&gt;:電訊號</p>  
        <p type="p">S&lt;sub&gt;DI1_1&lt;/sub&gt;~S&lt;sub&gt;DI1_m&lt;/sub&gt;,S&lt;sub&gt;DI2_1&lt;/sub&gt;~S&lt;sub&gt;DI2_n&lt;/sub&gt;,S&lt;sub&gt;DI3_1&lt;/sub&gt;~S&lt;sub&gt;DI3_p&lt;/sub&gt;:電訊號</p>  
        <p type="p">S&lt;sub&gt;FC1_1&lt;/sub&gt;~S&lt;sub&gt;FC1_m&lt;/sub&gt;,S&lt;sub&gt;FC2_1&lt;/sub&gt;~S&lt;sub&gt;FC2_n&lt;/sub&gt;:輻射訊號</p>  
        <p type="p">S&lt;sub&gt;RO1_1&lt;/sub&gt;~S&lt;sub&gt;RO1_m&lt;/sub&gt;,S&lt;sub&gt;RO2_1&lt;/sub&gt;~S&lt;sub&gt;RO2_n&lt;/sub&gt;:電訊號</p>  
        <p type="p">S&lt;sub&gt;RI1_1&lt;/sub&gt;~S&lt;sub&gt;RI1_m&lt;/sub&gt;,S&lt;sub&gt;RI2_1&lt;/sub&gt;~S&lt;sub&gt;RI2_n&lt;/sub&gt;,S&lt;sub&gt;RI3_1&lt;/sub&gt;~S&lt;sub&gt;RI3_p&lt;/sub&gt;:電訊號</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2268" publication-number="202614412"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614412.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614412</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148737</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有佈線結構的半導體元件</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE HAVING ROUTING STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">H01L23/48</main-classification>  
        <further-classification edition="200601120251222B">H01L23/488</further-classification>  
        <further-classification edition="200601120251222B">H01L23/50</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商茂力科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃柏憲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, PO-HSIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昱輝</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, YU-HUEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林信宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIN, HSIN-HUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>石淳元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIH, CHUN-YUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>于連杰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YU, LIEN CHIEH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本揭露提供一種半導體元件。半導體元件包括佈線結構。佈線結構具有中間導電佈線層。中間導電佈線層包括第一類型網狀導體層和第二類型網狀導體層。第二類型網狀導體層位於半導體元件的第一設定區域，第一類型網狀導體層位於半導體元件的第二設定區域，且第一類型網狀導體層及第二類型網狀導體層彼此電氣隔離。中間導電佈線層進一步包括多個第一類型導電島嶼及多個第二類型導電島嶼。第一類型導電島嶼位於半導體元件的第一設定區域，第二類型導電島嶼位於半導體元件的第二設定區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present disclosure provides a semiconductor device. The semiconductor device includes a routing structure. The routing structure has an intermediate conductive routing layer. The intermediate conductive routing layer includes a first mesh conductive layer and a second mesh conductive layer. The second mesh conductive layer is formed in a predetermined first region of the semiconductor device. The first mesh conductive layer is formed in a predetermined second region of the semiconductor device. The first mesh conductive layer and the second mesh conductive layer are electrically isolated from each other. The intermediate conductive routing layer further includes multiple first conductive islands and multiple second conductive islands. The first conductive islands are formed in the predetermined first region, and the second conductive islands are formed in the predetermined second region.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:半導體元件</p>  
        <p type="p">101:基板</p>  
        <p type="p">102,103,104:導電佈線層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2269" publication-number="202613881"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613881.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613881</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148747</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>經由瞬時同步之ＳＮＮ之自適應</chinese-title>  
        <english-title>ADAPTATION OF SNNS THROUGH TRANSIENT SYNCHRONY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G06N3/02</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商因納特拉納米系統有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INNATERA NANOSYSTEMS B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>茲哈荷　安敏兒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZJAJO, AMIR</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫莫　撒密特　瑟斯希爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, SUMEET SUSHEEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金若芸</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種用於組態一尖峰神經網路之方法。該尖峰神經網路包括複數個尖峰神經元及複數個突觸元件，該複數個突觸元件將該等尖峰神經元互連以形成至少部分地以硬體實施之網路。每一突觸元件適於接收一突觸輸入信號且對該突觸輸入信號施加一權重以產生一突觸輸出信號，該等突觸元件可組態以調整由每一突觸元件施加之該權重。該等尖峰神經元中之每一者適於自該等突觸元件中之一或多者接收該等突觸輸出信號中之一或多者，且回應於接收到的一或多個突觸輸出信號產生一時空尖峰列輸出信號。該網路內之一回應局部群集包括該等尖峰神經元之一集合及將該等尖峰神經元之該集合互連的複數個突觸元件。該方法包括設定該回應局部群集中之該等突觸元件之該等權重及該等尖峰神經元之尖峰行為，使得當該回應局部群集之一輸入信號在頻率域中表示時包括一預定振盪頻率時，該回應局部群集內之網路狀態為一週期性穩態，使得該回應局部群集內之該網路狀態以該預定振盪頻率為週期性的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present invention concerns a method for configuring a spiking neural network. The spiking neural network comprises a plurality of spiking neurons, and a plurality of synaptic elements interconnecting the spiking neurons to form the network at least partly implemented in hardware. Each synaptic element is adapted to receive a synaptic input signal and apply a weight to the synaptic input signal to generate a synaptic output signal, the synaptic elements being configurable to adjust the weight applied by each synaptic element. Each of the spiking neurons is adapted to receive one or more of the synaptic output signals from one or more of the synaptic elements, and generate a spatio-temporal spike train output signal in response to the received one or more synaptic output signals. A response local cluster within the network comprises a set of the spiking neurons and a plurality of synaptic elements interconnecting the set of the spiking neurons. The method comprises setting the weights of the synaptic elements and the spiking behavior of the spiking neurons in the response local cluster such that the network state within the response local cluster is a periodic steady-state when an input signal to the response local cluster comprises a pre-determined oscillation frequency when represented in the frequency domain, such that the network state within the response local cluster is periodic with the pre-determined oscillation frequency.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:微控制器積體電路</p>  
        <p type="p">101:微處理器核心</p>  
        <p type="p">102:記憶體裝置</p>  
        <p type="p">103:資料源</p>  
        <p type="p">104:外部匯流排</p>  
        <p type="p">105:感測器</p>  
        <p type="p">106:類比/數位轉換器</p>  
        <p type="p">107:一或多個串聯輸入/輸出埠</p>  
        <p type="p">108:通用輸入/輸出埠</p>  
        <p type="p">109:直接記憶體存取</p>  
        <p type="p">110:尖峰神經網路</p>  
        <p type="p">111:一或多個串流輸入資料埠</p>  
        <p type="p">112:一或多個輸出埠</p>  
        <p type="p">113:介面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2270" publication-number="202614796"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614796.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614796</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148774</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>垂直電晶體及其製造方法</chinese-title>  
        <english-title>A VERTICAL TRANSISTOR AND A METHOD TO PRODUCE A VERTICAL TRANSISTOR</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251223B">H10D30/01</main-classification>  
        <further-classification edition="202501120251223B">H10D30/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞典商艾皮諾科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EPINOVATECH AB</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧爾森　馬丁安德里亞斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OLSSON, MARTIN ANDREAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李彥慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林宗武</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">提供一種垂直電晶體及其製造方法。垂直電晶體包括有汲極觸點、垂直電子傳輸層、異質結構、至少一源極觸點、以及閘極觸點。垂直電子傳輸層佈置在汲極觸點上並包括垂直導電孔與支撐材料。支撐材料橫向包圍垂直導電孔。異質結構佈置在垂直電子傳輸層上並包括AlGaN層和GaN層。AlGaN層和GaN層一起形成異質結。至少一源極觸點與異質結構接觸。閘極觸點與異質結構接觸並佈置在垂直導電孔上方。其中，垂直導電孔在汲極觸點和異質結構之間形成一電子傳輸通道。還提供一種用於製造垂直電晶體的方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">There is provided a vertical transistor, comprising: a drain contact, a vertical electron transport layer arranged on the drain contact and comprising a vertically conducting apertureat and a supporting material laterally enclosing the vertically conducting apertureat, a heterostructure arranged on the vertical electron transport layer and comprising an AlGaN-layer and a GaN-layer together forming a heterojunction, at least one source contact in contact with the heterostructure, and a gate contact in contact with the heterostructure, arranged above the vertically conducting apertureat, wherein the vertically conducting apertureat is forming an electron transport channel between the drain contact and the heterostructure. There is also provided a method for producing a vertical HEMT.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:垂直高電子遷移率電晶體</p>  
        <p type="p">300:基層</p>  
        <p type="p">310:基底</p>  
        <p type="p">320:AlN層</p>  
        <p type="p">410:汲極觸點</p>  
        <p type="p">420a、420b:源極觸點</p>  
        <p type="p">430:閘極觸點</p>  
        <p type="p">500:奈米線層</p>  
        <p type="p">510:垂直奈米線</p>  
        <p type="p">511:第一端</p>  
        <p type="p">512:第二端</p>  
        <p type="p">520:支撐材料</p>  
        <p type="p">600:異質結構</p>  
        <p type="p">610:AlGaN層</p>  
        <p type="p">620:GaN層</p>  
        <p type="p">L:長度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2271" publication-number="202613643"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613643.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613643</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114148965</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>成像透鏡系統</chinese-title>  
        <english-title>IMAGING LENS SYSTEM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">G02B9/64</main-classification>  
        <further-classification edition="200601120251224B">G02B3/00</further-classification>  
        <further-classification edition="200601120251224B">G02B13/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蔡奎玟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHAE, KYU MIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金赫柱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, HYUK JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種成像透鏡系統包括自物體側依次設置的第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡、第七透鏡、第八透鏡及第九透鏡。所述第一透鏡至所述第九透鏡中的一者是溫度補償透鏡，所述溫度補償透鏡具有正的折射力且所具有的折射率溫度係數的絕對值為10（10&lt;sup&gt;-6&lt;/sup&gt;/℃）或小於10（10&lt;sup&gt;-6&lt;/sup&gt;/℃）。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An imaging lens system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, an eighth lens, and a ninth lens disposed in order from an object side. One of the first to ninth lenses is a temperature compensation lens having positive refractive power and having an absolute value of a refractive index temperature coefficient of 10 (10&lt;sup&gt;-6&lt;/sup&gt;/°C) or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:成像透鏡系統</p>  
        <p type="p">110:第一透鏡</p>  
        <p type="p">120:第二透鏡</p>  
        <p type="p">130:第三透鏡</p>  
        <p type="p">140:第四透鏡</p>  
        <p type="p">150:第五透鏡</p>  
        <p type="p">160:第六透鏡</p>  
        <p type="p">170:第七透鏡</p>  
        <p type="p">180:第八透鏡</p>  
        <p type="p">190:第九透鏡</p>  
        <p type="p">CG:蓋玻璃</p>  
        <p type="p">IF:濾波器</p>  
        <p type="p">IP:影像感測器</p>  
        <p type="p">ST:光闌</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2272" publication-number="202614268"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614268.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614268</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149023</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氣體箱</chinese-title>  
        <english-title>GAS BOX</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H01L21/66</main-classification>  
        <further-classification edition="200601120251219B">H01L21/67</further-classification>  
        <further-classification edition="200601120251219B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾爾測試系統</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AEHR TEST SYSTEMS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里奇蒙Ⅱ　唐納德　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHMOND II, DONALD P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬凡維克　喬凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOVANOVIC, JOVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>琳賽　史考特　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINDSEY, SCOTT E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述一種出於測試晶圓的目的而與晶圓上的端子接觸的種類的測試器設備。介電氣體用於減少觸點之間的電弧作用。固定結構及可攜式結構具有在可攜式結構與固定結構接合時接合的互補氣體介面。氣體箱具有連接至介電氣體壓力調節器及氮氣壓力調節器且連接至氣體供應通路以將氮氣或介電氣體可選擇地提供至氣體供應通路的引導區塊。托盤具有導電以與後晶圓端子、真空通路接觸的部分，且各真空通路具有待減小的放大區段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tester apparatus is described of the kind having contact with terminals on a wafer for purposes of testing the wafer. A dielectric gas is used to reduce arcing between the contact. A stationary structure and a portable structure have complimentary gas interfaces that engage when the portable structure engages with the stationary structure. A gas box has a channeling block connected to a dielectric gas pressure regulator and a nitrogen gas pressure regulator and connected to a gas supply passage to selectably provide nitrogen or dielectric gas to the gas supply passage. A tray has a portion that is electrically conductive to make contact with a rear wafer terminal, vacuum passages, and each vacuum passage has an enlarged section to reduce.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:測試器設備</p>  
        <p type="p">18A:第一槽總成</p>  
        <p type="p">18B:第二槽總成</p>  
        <p type="p">28A:第一晶圓封裝</p>  
        <p type="p">600:減壓止回閥</p>  
        <p type="p">602:真空釋放止回閥</p>  
        <p type="p">606:電壓力感測器介面</p>  
        <p type="p">802:氮氣罐</p>  
        <p type="p">804:介電氣體罐</p>  
        <p type="p">806:真空泵</p>  
        <p type="p">810:第一氮氣壓力調節器</p>  
        <p type="p">812、814、816:歧管</p>  
        <p type="p">820A、820B、822A、822B、824A、824B:耦接件</p>  
        <p type="p">830:第二氮氣壓力調節器</p>  
        <p type="p">834:介電氣體壓力調節器</p>  
        <p type="p">838:入口孔口</p>  
        <p type="p">840:出口孔口</p>  
        <p type="p">844:真空調節器</p>  
        <p type="p">848:加熱器控制板</p>  
        <p type="p">850:氣體供應閥</p>  
        <p type="p">852:氣體供應通路</p>  
        <p type="p">858:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2273" publication-number="202614269"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614269.zip"/> 
    </tif-files>  
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      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614269</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149024</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測試器設備、晶圓封裝與測試由基底固持的微電子電路的方法</chinese-title>  
        <english-title>TESTER APPARATUS, WAFER PACK AND METHOD OF TESTING MICROELECTRONIC CIRCUIT HELD BY SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H01L21/66</main-classification>  
        <further-classification edition="200601120251219B">H01L21/67</further-classification>  
        <further-classification edition="200601120251219B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾爾測試系統</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AEHR TEST SYSTEMS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里奇蒙Ⅱ　唐納德　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHMOND II, DONALD P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬凡維克　喬凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOVANOVIC, JOVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>琳賽　史考特　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINDSEY, SCOTT E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述一種出於測試晶圓的目的而與晶圓上的端子接觸的種類的測試器設備。介電氣體用於減少觸點之間的電弧作用。固定結構及可攜式結構具有在可攜式結構與固定結構接合時接合的互補氣體介面。氣體箱具有連接至介電氣體壓力調節器及氮氣壓力調節器且連接至氣體供應通路以將氮氣或介電氣體可選擇地提供至氣體供應通路的引導區塊。托盤具有導電以與後晶圓端子、真空通路接觸的部分，且各真空通路具有待減小的放大區段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tester apparatus is described of the kind having contact with terminals on a wafer for purposes of testing the wafer. A dielectric gas is used to reduce arcing between the contact. A stationary structure and a portable structure have complimentary gas interfaces that engage when the portable structure engages with the stationary structure. A gas box has a channeling block connected to a dielectric gas pressure regulator and a nitrogen gas pressure regulator and connected to a gas supply passage to selectably provide nitrogen or dielectric gas to the gas supply passage. A tray has a portion that is electrically conductive to make contact with a rear wafer terminal, vacuum passages, and each vacuum passage has an enlarged section to reduce.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:測試器設備</p>  
        <p type="p">18A:第一槽總成</p>  
        <p type="p">18B:第二槽總成</p>  
        <p type="p">28A:第一晶圓封裝</p>  
        <p type="p">600:減壓止回閥</p>  
        <p type="p">602:真空釋放止回閥</p>  
        <p type="p">606:電壓力感測器介面</p>  
        <p type="p">802:氮氣罐</p>  
        <p type="p">804:介電氣體罐</p>  
        <p type="p">806:真空泵</p>  
        <p type="p">810:第一氮氣壓力調節器</p>  
        <p type="p">812、814、816:歧管</p>  
        <p type="p">820A、820B、822A、822B、824A、824B:耦接件</p>  
        <p type="p">830:第二氮氣壓力調節器</p>  
        <p type="p">834:介電氣體壓力調節器</p>  
        <p type="p">838:入口孔口</p>  
        <p type="p">840:出口孔口</p>  
        <p type="p">844:真空調節器</p>  
        <p type="p">848:加熱器控制板</p>  
        <p type="p">850:氣體供應閥</p>  
        <p type="p">852:氣體供應通路</p>  
        <p type="p">858:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2274" publication-number="202614270"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614270.zip"/> 
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        <document-id> 
          <doc-number>202614270</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149025</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測試器設備與測試晶圓的方法</chinese-title>  
        <english-title>TESTER APPARATUS AND METHOD OF TESTING WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H01L21/66</main-classification>  
        <further-classification edition="200601120251219B">H01L21/67</further-classification>  
        <further-classification edition="200601120251219B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾爾測試系統</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AEHR TEST SYSTEMS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里奇蒙Ⅱ　唐納德　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHMOND II, DONALD P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬凡維克　喬凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOVANOVIC, JOVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>琳賽　史考特　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINDSEY, SCOTT E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述一種出於測試晶圓的目的而與晶圓上的端子接觸的種類的測試器設備。介電氣體用於減少觸點之間的電弧作用。固定結構及可攜式結構具有在可攜式結構與固定結構接合時接合的互補氣體介面。氣體箱具有連接至介電氣體壓力調節器及氮氣壓力調節器且連接至氣體供應通路以將氮氣或介電氣體可選擇地提供至氣體供應通路的引導區塊。托盤具有導電以與後晶圓端子、真空通路接觸的部分，且各真空通路具有待減小的放大區段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tester apparatus is described of the kind having contact with terminals on a wafer for purposes of testing the wafer. A dielectric gas is used to reduce arcing between the contact. A stationary structure and a portable structure have complimentary gas interfaces that engage when the portable structure engages with the stationary structure. A gas box has a channeling block connected to a dielectric gas pressure regulator and a nitrogen gas pressure regulator and connected to a gas supply passage to selectably provide nitrogen or dielectric gas to the gas supply passage. A tray has a portion that is electrically conductive to make contact with a rear wafer terminal, vacuum passages, and each vacuum passage has an enlarged section to reduce.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:測試器設備</p>  
        <p type="p">18A:第一槽總成</p>  
        <p type="p">18B:第二槽總成</p>  
        <p type="p">28A:第一晶圓封裝</p>  
        <p type="p">600:減壓止回閥</p>  
        <p type="p">602:真空釋放止回閥</p>  
        <p type="p">606:電壓力感測器介面</p>  
        <p type="p">802:氮氣罐</p>  
        <p type="p">804:介電氣體罐</p>  
        <p type="p">806:真空泵</p>  
        <p type="p">810:第一氮氣壓力調節器</p>  
        <p type="p">812、814、816:歧管</p>  
        <p type="p">820A、820B、822A、822B、824A、824B:耦接件</p>  
        <p type="p">830:第二氮氣壓力調節器</p>  
        <p type="p">834:介電氣體壓力調節器</p>  
        <p type="p">838:入口孔口</p>  
        <p type="p">840:出口孔口</p>  
        <p type="p">844:真空調節器</p>  
        <p type="p">848:加熱器控制板</p>  
        <p type="p">850:氣體供應閥</p>  
        <p type="p">852:氣體供應通路</p>  
        <p type="p">858:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2275" publication-number="202614271"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614271.zip"/> 
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          <doc-number>202614271</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149026</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測試器設備與測試晶圓的方法</chinese-title>  
        <english-title>TESTER APPARATUS AND METHOD OF TESTING A WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H01L21/66</main-classification>  
        <further-classification edition="200601120251219B">H01L21/67</further-classification>  
        <further-classification edition="200601120251219B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾爾測試系統</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AEHR TEST SYSTEMS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里奇蒙Ⅱ　唐納德　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHMOND II, DONALD P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬凡維克　喬凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOVANOVIC, JOVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>琳賽　史考特　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINDSEY, SCOTT E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述一種出於測試晶圓的目的而與晶圓上的端子接觸的種類的測試器設備。介電氣體用於減少觸點之間的電弧作用。固定結構及可攜式結構具有在可攜式結構與固定結構接合時接合的互補氣體介面。氣體箱具有連接至介電氣體壓力調節器及氮氣壓力調節器且連接至氣體供應通路以將氮氣或介電氣體可選擇地提供至氣體供應通路的引導區塊。托盤具有導電以與後晶圓端子、真空通路接觸的部分，且各真空通路具有待減小的放大區段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tester apparatus is described of the kind having contact with terminals on a wafer for purposes of testing the wafer. A dielectric gas is used to reduce arcing between the contact. A stationary structure and a portable structure have complimentary gas interfaces that engage when the portable structure engages with the stationary structure. A gas box has a channeling block connected to a dielectric gas pressure regulator and a nitrogen gas pressure regulator and connected to a gas supply passage to selectably provide nitrogen or dielectric gas to the gas supply passage. A tray has a portion that is electrically conductive to make contact with a rear wafer terminal, vacuum passages, and each vacuum passage has an enlarged section to reduce.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:測試器設備</p>  
        <p type="p">18A:第一槽總成</p>  
        <p type="p">18B:第二槽總成</p>  
        <p type="p">28A:第一晶圓封裝</p>  
        <p type="p">600:減壓止回閥</p>  
        <p type="p">602:真空釋放止回閥</p>  
        <p type="p">606:電壓力感測器介面</p>  
        <p type="p">802:氮氣罐</p>  
        <p type="p">804:介電氣體罐</p>  
        <p type="p">806:真空泵</p>  
        <p type="p">810:第一氮氣壓力調節器</p>  
        <p type="p">812、814、816:歧管</p>  
        <p type="p">820A、820B、822A、822B、824A、824B:耦接件</p>  
        <p type="p">830:第二氮氣壓力調節器</p>  
        <p type="p">834:介電氣體壓力調節器</p>  
        <p type="p">838:入口孔口</p>  
        <p type="p">840:出口孔口</p>  
        <p type="p">844:真空調節器</p>  
        <p type="p">848:加熱器控制板</p>  
        <p type="p">850:氣體供應閥</p>  
        <p type="p">852:氣體供應通路</p>  
        <p type="p">858:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2276" publication-number="202614272"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614272.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614272</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149027</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測試器設備與測試晶圓的方法</chinese-title>  
        <english-title>TESTER APPARATUS AND METHOD OF TESTING A WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H01L21/66</main-classification>  
        <further-classification edition="200601120251219B">H01L21/67</further-classification>  
        <further-classification edition="200601120251219B">G01R31/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾爾測試系統</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AEHR TEST SYSTEMS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里奇蒙Ⅱ　唐納德　Ｐ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RICHMOND II, DONALD P.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬凡維克　喬凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOVANOVIC, JOVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>琳賽　史考特　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINDSEY, SCOTT E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明描述一種出於測試晶圓的目的而與晶圓上的端子接觸的種類的測試器設備。介電氣體用於減少觸點之間的電弧作用。固定結構及可攜式結構具有在可攜式結構與固定結構接合時接合的互補氣體介面。氣體箱具有連接至介電氣體壓力調節器及氮氣壓力調節器且連接至氣體供應通路以將氮氣或介電氣體可選擇地提供至氣體供應通路的引導區塊。托盤具有導電以與後晶圓端子、真空通路接觸的部分，且各真空通路具有待減小的放大區段。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tester apparatus is described of the kind having contact with terminals on a wafer for purposes of testing the wafer. A dielectric gas is used to reduce arcing between the contact. A stationary structure and a portable structure have complimentary gas interfaces that engage when the portable structure engages with the stationary structure. A gas box has a channeling block connected to a dielectric gas pressure regulator and a nitrogen gas pressure regulator and connected to a gas supply passage to selectably provide nitrogen or dielectric gas to the gas supply passage. A tray has a portion that is electrically conductive to make contact with a rear wafer terminal, vacuum passages, and each vacuum passage has an enlarged section to reduce.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:測試器設備</p>  
        <p type="p">18A:第一槽總成</p>  
        <p type="p">18B:第二槽總成</p>  
        <p type="p">28A:第一晶圓封裝</p>  
        <p type="p">600:減壓止回閥</p>  
        <p type="p">602:真空釋放止回閥</p>  
        <p type="p">606:電壓力感測器介面</p>  
        <p type="p">802:氮氣罐</p>  
        <p type="p">804:介電氣體罐</p>  
        <p type="p">806:真空泵</p>  
        <p type="p">810:第一氮氣壓力調節器</p>  
        <p type="p">812、814、816:歧管</p>  
        <p type="p">820A、820B、822A、822B、824A、824B:耦接件</p>  
        <p type="p">830:第二氮氣壓力調節器</p>  
        <p type="p">834:介電氣體壓力調節器</p>  
        <p type="p">838:入口孔口</p>  
        <p type="p">840:出口孔口</p>  
        <p type="p">844:真空調節器</p>  
        <p type="p">848:加熱器控制板</p>  
        <p type="p">850:氣體供應閥</p>  
        <p type="p">852:氣體供應通路</p>  
        <p type="p">858:箭頭</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2277" publication-number="202613123"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613123.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613123</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149037</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>化合物</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C07D487/04</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠藤歳幸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENDO, TOSHIYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹雅倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YIN, YALUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藤枝司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUJIEDA, TSUKASA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>結城達也</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YUKI, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>名木達哉</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGI, TATSUYA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種液晶配向劑，含有藉由使含有下式(1)表示之二醯亞胺二酯化合物(B)之四羧酸衍生物成分與二胺成分聚合反應而獲得之聚合物(A)，前述聚合物(A)具有來自前述二醯亞胺二酯化合物(B)之下式(1A)表示之基。 &lt;br/&gt;&lt;img align="absmiddle" height="142px" width="386px" file="ed10034.JPG" alt="ed10034.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;X&lt;sub&gt;1&lt;/sub&gt;表示來自非環族脂肪族四羧酸二酐或脂環族四羧酸二酐或該等之衍生物之4價有機基。R各自獨立地表示碳數1~5之1價有機基。 &lt;br/&gt;&lt;img align="absmiddle" height="114px" width="298px" file="ed10035.JPG" alt="ed10035.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;R表示碳數1~5之1價有機基。＊表示和X&lt;sub&gt;1&lt;/sub&gt;鍵結之原子鍵。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2278" publication-number="202614678"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614678.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614678</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149044</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種具有低信號損耗的空腔模組的製作方法及PCB</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H05K1/02</main-classification>  
        <further-classification edition="200601120251226B">H05K3/00</further-classification>  
        <further-classification edition="200601120251226B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商滬士電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUS PRINTED CIRCUIT(KUNSHAN)CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　傳彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUAN PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, SHUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聶斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIE, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, ZHIGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卞智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIAN, ZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙連香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, LIANXIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種具有低信號損耗的空腔模組的製作方法及PCB，屬於PCB板製作技術領域，所述製作方法包括：以Detach Core作為芯板，將芯板一側銅箔作為接地層，在接地層上壓合半固化片和銅箔，將壓合的銅箔作為信號層；在信號層上製作圖形線路，同時在相鄰圖形線路之間製作一級遮罩牆；使用PET膜和導電銅膏在一級遮罩牆的基礎上製作二級遮罩牆；在二級遮罩牆上壓合半固化片和銅箔，並在壓合前將半固化片位於相鄰二級遮罩牆之間的區域撈空，壓合後在圖形線路上方形成空腔；以接地層底部作為分界線，對芯板進行分板操作，得到帶遮罩牆的空腔模組。本發明能夠在更高佈線密度的前提下保證信號完整性和傳輸速度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2279" publication-number="202613033"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613033.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613033</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149055</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>鉿前驅物及相關方法</chinese-title>  
        <english-title>HAFNIUM PRECURSORS AND RELATED METHODS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">C01G27/04</main-classification>  
        <further-classification edition="200601120251224B">C23C16/08</further-classification>  
        <further-classification edition="200601120251224B">C23C16/448</further-classification>  
        <further-classification edition="200601120251224B">B01D5/00</further-classification>  
        <further-classification edition="200601120251224B">C07F7/00</further-classification>  
        <further-classification edition="200601120251224B">C01G23/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENTEGRIS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維德茲　娟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VALDEZ, JUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>華生　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WATSON, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>貝托爾　史考特　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BATTLE, SCOTT L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡爾霍恩　馬修　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CALHOUN, MATTHEW W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加勒特　班傑明　Ｒ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GARRETT, BENJAMIN R.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>格甘斯　衛斯理　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOGGANS, WESLEY W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張哲倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳初梅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於包含鹵化鉿前驅物的前驅物容器。該鹵化鉿前驅物包含小於1 ppm之至少一種雜質。該至少一種雜質包含以下中之至少一者：鈦污染物、鉻污染物、鋁污染物、鐵污染物或其任何組合。亦提供相關系統及相關方法，包括例如但不限於用於遞送蒸氣前驅物之系統、用於純化前驅物之方法及類似系統與方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A precursor vessel comprises a hafnium halide precursor. The hafnium halide precursor comprises less than 1 ppm of at least one impurity. The at least one impurity comprises at least one of a titanium contaminant, a chromium contaminant, an aluminum contaminant, an iron contaminant, or any combination thereof. Related systems and related methods are also provided, including, for example and without limitation, systems for delivery of vapor precursors, methods for purifying a precursor, and the like.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:純化方法</p>  
        <p type="p">102:步驟</p>  
        <p type="p">104:步驟</p>  
        <p type="p">106:步驟</p>  
        <p type="p">108:步驟</p>  
        <p type="p">110:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2280" publication-number="202614168"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614168.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614168</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149060</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>資訊取得系統、資訊取得方法及記錄媒體</chinese-title>  
        <english-title>INFORMATION ACQUISITION SYSTEM, INFORMATION ACQUISITION METHOD AND RECORDING MEDIUM</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251219B">H01L21/027</main-classification>  
        <further-classification edition="200601120251219B">H01L21/304</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商東京威力科創股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKYO ELECTRON LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>牧準之輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MAKI, JUNNOSUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>東広大</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIGASHI, KOUDAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小西凌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KONISHI, RYO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良吉</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周良謀</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新竹市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供資訊取得系統及資訊取得方法，防止發生因位於藉由基板處理裝置處理的基板附近之構件配置於不適當的位置所造成之處理的狀況不佳。構成一種資訊取得系統，取得關於用來處理基板固持部所固持的基板之基板處理裝置的資訊；該資訊取得系統具備：基體，取代該基板，藉由該基板固持部加以固持；以及複數位置感測器，為了檢測位於該基體之外側的共通檢測對象物之位置，以使檢測方向彼此成為不同方向的方式設置於該基體。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An object of the invention is to prevent processing flaws that result from improper positioning of members that are positioned near substrates during processing in a substrate processing device. &lt;br/&gt;An information acquisition system that acquires information related to a substrate processing device which processes a substrate held by a substrate holding section, the information acquisition system comprising a base which is held by a substrate holding section instead of the substrate, and a plurality of position sensors which are provided on the base such that each has a detection direction different from the others and detect the position of a common detection target object positioned outward of the base.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">31:旋轉吸盤</p>  
        <p type="p">50:基板</p>  
        <p type="p">57,57A,57C:接近感測器</p>  
        <p type="p">58:接觸感測器</p>  
        <p type="p">61:基體</p>  
        <p type="p">62:基板</p>  
        <p type="p">64:零件群</p>  
        <p type="p">65:電池</p>  
        <p type="p">86:蓋部</p>  
        <p type="p">87:凸部</p>  
        <p type="p">9:運算裝置</p>  
        <p type="p">90:程式</p>  
        <p type="p">91:匯流排</p>  
        <p type="p">92:程式收納部</p>  
        <p type="p">93:無線收發部</p>  
        <p type="p">94:記憶體</p>  
        <p type="p">95:顯示部</p>  
        <p type="p">96:操作部</p>  
        <p type="p">H4:校正高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2281" publication-number="202614683"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614683.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614683</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149075</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種電路板及其製作方法和電子器件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">H05K1/11</main-classification>  
        <further-classification edition="200601120251229B">H05K1/14</further-classification>  
        <further-classification edition="200601120251229B">H05K3/36</further-classification>  
        <further-classification edition="200601120251229B">H05K3/46</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商滬士電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUS PRINTED CIRCUIT(KUNSHAN)CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　傳彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUAN PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, SHUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聶斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIE, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卞智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIAN, ZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>占貴濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAN, GUITAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, ZHIGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙連香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, LIANXIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開一種電路板及其製作方法和電子器件，屬於印製電路板製作技術領域。其中，電路板包括：母板，在母板上設有盲槽，在盲槽內設置有子板，子板內設有子板線路。在母板與子板的表面設置有增層板。增層板包括若干層增層結構，增層板設有第一晶片區域、第二晶片區域以及位於第一晶片區域和第二晶片區域之間的互連區域。互連區域覆蓋在子板的表面，其內設置有若干條互連線路，每條互連線路包括：設置於同一層增層結構上的第一水平線路和第二水平線路、設置在增層板內並連接第一水平線路與子板線路的第一垂直線路、及設置在增版板內並連接第二水平線路與子板線路的第二垂直線路。在第一晶片區域內設有連接第一水平線路和第一晶片的第一線路。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:母板</p>  
        <p type="p">2:子板</p>  
        <p type="p">3:增層板</p>  
        <p type="p">5:介質層</p>  
        <p type="p">6:第一晶片</p>  
        <p type="p">7:第二晶片</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2282" publication-number="202614679"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614679.zip"/> 
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      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202614679</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149076</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種可彎折嵌入式PCB的製作方法及PCB</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H05K1/02</main-classification>  
        <further-classification edition="200601120251226B">H05K1/18</further-classification>  
        <further-classification edition="200601120251226B">H05K1/11</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商滬士電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUS PRINTED CIRCUIT(KUNSHAN)CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　傳彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUAN PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, SHUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聶斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIE, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, ZHIGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卞智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIAN, ZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙連香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, LIANXIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種可彎折嵌入式PCB的製作方法及PCB，屬於PCB板製作技術領域，製作方法包括：單模組製備；焊盤製備；子板製備，將中間層和單模組交錯層疊壓合形成子板，左右兩部的中間層分別為半固化片和防粘連片；母板製備，根據子板的尺寸對組成母板的芯板和半固化片進行預處理，使其交錯層疊後形成Cavity槽；在組成母板的芯板和半固化片交錯層疊時將子板垂直嵌入槽內，再整體疊合半固化片和銅箔進行壓合形成母板；增層板製備，在母板對應焊盤的側壁上壓合增層板，BGA晶片和光模組設置於增層板上，通過增層板上開設的鐳射孔與焊盤連接導通。本發明通過子板垂直走線，優化線路佈局，能夠實現BGA晶片與更多光模組電氣互連。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2283" publication-number="202614690"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614690.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614690</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149077</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>一種嵌入式電路板及其製作方法和電子器件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H05K3/36</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商滬士電子股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WUS PRINTED CIRCUIT(KUNSHAN)CO.,LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳　傳彬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, CHUAN PIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>HK</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, SHUAI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>聶斌</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NIE, BIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卞智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BIAN, ZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>占貴濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAN, GUITAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, ZHIGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙連香</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHAO, LIANXIANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請公開一種嵌入式電路板及其製作方法和電子器件，屬於電路板技術領域。其中，嵌入式電路板包括母板，母板上設有盲槽。盲槽內設置有子板。母板與子板的表面設置有增層板。增層板設有覆蓋於子板表面的互連區域。在互連區域內設有垂直於子板表面的第三線路和第四線路，在子板內設有第五線路。第三線路、第五線路和第四線路依次連通形成互連線路。互連線路用於連接設於增層板表面的第一元器件和第二元器件。本申請中子板與增層板的互連區域形成較大的縱向空間，利用該縱向空間垂直佈線，以分散佈線密度，優化了線路佈局。在BGA晶片的連接應用中，本申請能夠減少BGA區域neckdown線長，有利於提高信號完整性。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:母板</p>  
        <p type="p">2:子板</p>  
        <p type="p">3:介質層</p>  
        <p type="p">4:增層板</p>  
        <p type="p">5:互連線路</p>  
        <p type="p">6:第一元器件</p>  
        <p type="p">7:第二元器件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2284" publication-number="202613790"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613790.zip"/> 
    </tif-files>  
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      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613790</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149134</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示裝置及控制程式</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G06F3/041</main-classification>  
        <further-classification edition="202501120260102B">H10D30/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>池田隆之</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKEDA, TAKAYUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡本佑樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OKAMOTO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高橋圭</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAHASHI, KEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎舜平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, SHUNPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林怡芳</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>童啓哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的一個實施方式的目的是提供一種可見度高的顯示裝置。本發明的一個實施方式是一種包括使用發光元件進行顯示的顯示區域的顯示裝置。在顯示區域中使用者所觸摸的點為第一點，使用者在觸摸第一點之前觸摸的點為第二點，以第一點為始點且以第二點為終點的向量為第一向量，第一向量的k倍（k為實數）為第二向量，位於使第一點移動了第二向量的位置的點為第三點。顯示區域包括第一區域以及從顯示區域去除第一區域的第二區域。第一區域包括以第一點為中心的第一圓以及以第三點為中心的第二圓。第一區域的亮度高於第二區域。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:顯示裝置</p>  
        <p type="p">30:顯示區域</p>  
        <p type="p">31:區域</p>  
        <p type="p">41:區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2285" publication-number="202614732"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614732.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614732</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149229</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251229B">H10B10/00</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商半導體能源研究所股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山崎舜平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAZAKI, SHUNPEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小山潤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOYAMA, JUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>加藤清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATO, KIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">設置第一電晶體，其包括通道形成區域、第一閘極絕緣層、第一閘極電極、及第一源極電極和第一汲極電極；第二電晶體，其包括氧化物半導體層、第二源極電極和第二汲極電極、第二閘極絕緣層、及第二閘極電極；以及一電容器，其包括第二源極電極和第二汲極電極之一、第二閘極絕緣層、及設置成在第二閘極絕緣層上方重疊第二源極電極和第二汲極電極之一的電極。第一閘極電極及第二源極電極和第二汲極電極之一彼此電連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A first transistor including a channel formation region, a first gate insulating layer, a first gate electrode, and a first source electrode and a first drain electrode; a second transistor including an oxide semiconductor layer, a second source electrode and a second drain electrode, a second gate insulating layer, and a second gate electrode; and a capacitor including one of the second source electrode and the second drain electrode, the second gate insulating layer, and an electrode provided to overlap with one of the second source electrode and the second drain electrode over the second gate insulating layer are provided. The first gate electrode and one of the second source electrode and the second drain electrode are electrically connected to each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:基板</p>  
        <p type="p">106:元件隔離絕緣層</p>  
        <p type="p">108:閘極絕緣層</p>  
        <p type="p">110:閘極電極</p>  
        <p type="p">114:雜質區域</p>  
        <p type="p">116:通道形成區域</p>  
        <p type="p">118:側壁絕緣層</p>  
        <p type="p">120:高濃度雜質區域</p>  
        <p type="p">124:金屬化合物區域</p>  
        <p type="p">126:層間絕緣層</p>  
        <p type="p">128:層間絕緣層</p>  
        <p type="p">130a:源極或汲極電極</p>  
        <p type="p">130b:源極或汲極電極</p>  
        <p type="p">130c:電極</p>  
        <p type="p">138:絕緣層</p>  
        <p type="p">140:氧化物半導體層</p>  
        <p type="p">142a:電極</p>  
        <p type="p">142b:電極</p>  
        <p type="p">142c:電極</p>  
        <p type="p">142d:電極</p>  
        <p type="p">144:絕緣層</p>  
        <p type="p">146:閘極絕緣層</p>  
        <p type="p">148a:電極</p>  
        <p type="p">148b:電極</p>  
        <p type="p">150:保護絕緣層</p>  
        <p type="p">152:層間絕緣層</p>  
        <p type="p">160:電晶體</p>  
        <p type="p">162:電晶體</p>  
        <p type="p">164:電容器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2286" publication-number="202613657"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613657.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613657</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149239</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於測量系統以檢查物體的放大成像光學單元</chinese-title>  
        <english-title>MAGNIFYING IMAGING OPTICAL UNIT FOR A METROLOGY SYSTEM FOR EXAMINING OBJECTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G02B17/06</main-classification>  
        <further-classification edition="200601120251229B">G02B21/00</further-classification>  
        <further-classification edition="201201120251229B">G03F1/84</further-classification>  
        <further-classification edition="200601120251229B">G01B11/00</further-classification>  
        <further-classification edition="200601120251229B">G01N21/88</further-classification>  
        <further-classification edition="200601120251229B">G01N21/95</further-classification>  
        <further-classification edition="200601120251229B">G02B21/04</further-classification>  
        <further-classification edition="200601120251229B">G02B27/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARL ZEISS SMT GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朵林　德克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DOERING, DIRK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高勒斯　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOELLES, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>安翠克　托斯坦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ANTRACK, TORSTEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾波　亞歷安卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EPPLE, ALEXANDER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>康納　赫爾穆特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOERNER, HELMUT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普立茲　莎夏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PERLITZ, SASCHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬泰卡　尤瑞奇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MATEJKA, ULRICH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴克曼　盧茨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>REICHMANN, LUTZ</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛葛斯基　歐拉夫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROGALSKY, OLAF</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>施密特　索倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SCHMIDT, SOEREN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>DE</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李宗德</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種作為測量系統的一部分之用於檢查物體的放大成像光學單元（20c）。該放大成像光學單元具有至多四個反射鏡（M1至M4），其將物體平面（17）中的物場（4）成像至成像平面（22）中的像場（21）。根據一態樣，該放大成像光學單元的一入射光瞳具有偏離橢圓的邊界形狀，且其縱橫比不等於1。根據一另外態樣，多個用於沿成像束路徑以引導成像光（3）之小面積反射鏡（M2、M3）的反射表面係與球面形狀偏差至多10 μm。這產生了一種放大成像光學單元，其中為了特定的製造費用，所生成的成像結果能夠滿足測量系統的嚴格要求。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A magnifying imaging optical unit （20c） is part of a metrology system for examining objects. The magnifying imaging optical unit has at most four mirrors （M1 to M4） which image an object field （4） in an object plane （17） into an image field （21） in an image plane （22）. According to one aspect, an entrance pupil of the magnifying imaging optical unit has a boundary shape which deviates from an ellipse and the aspect ratio of which is not equal to 1. In accordance with a further aspect, reflection surfaces of small-area mirrors （M2, M3） which are used for guiding imaging light （3） along an imaging beam path deviate from a spherical shape by at most 10 µm. This results in a magnifying imaging optical unit in which an imaging result which satisfies the stringent requirements of a metrology system results for a given manufacturing outlay.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:照明場</p>  
        <p type="p">9b:孔徑光闌</p>  
        <p type="p">17:物體平面</p>  
        <p type="p">20c:投影光學單元</p>  
        <p type="p">21:像場</p>  
        <p type="p">22:影像平面</p>  
        <p type="p">A:距離</p>  
        <p type="p">B:距離</p>  
        <p type="p">C:距離</p>  
        <p type="p">D:距離</p>  
        <p type="p">EP:入射光瞳</p>  
        <p type="p">M1:反射鏡</p>  
        <p type="p">M2:反射鏡</p>  
        <p type="p">M3:反射鏡</p>  
        <p type="p">M4:反射鏡</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2287" publication-number="202612957"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612957.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612957</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149268</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>扶手安裝單元</chinese-title>  
        <english-title>ARMREST INSTALLATION UNIT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251223B">B62B9/12</main-classification>  
        <further-classification edition="200601120251223B">B62B9/00</further-classification>  
        <further-classification edition="200601120251223B">B62B7/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>易小龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YI, XIAOLONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳海濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WU, HAITAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>汪爾學</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, ERXUE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐頌雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種扶手安裝單元包括：第一連接座，設置有配卡部；第一磁吸件，設置於第一連接座；第二連接座，設置有卡合件；及第二磁吸件，設置於第二連接座；第一連接座和第二連接座通過配卡部和卡合件的可拆卸地卡合以及第一磁吸件和第二磁吸件的磁性吸附而可拆卸地連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An armrest installation unit includes a first connecting element having a cooperating portion; a first magnetic element disposed on the first connecting element; a second connecting element having an engaging element; and a second magnetic element disposed on the second connecting element; the first connecting element and the second connecting element are detachably connected to each other by having the cooperating portion and the engaging element detachably engaged with each other and by having the first magnetic element and the second magnetic element magnetically attached to each other.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:載具</p>  
        <p type="p">100:車架</p>  
        <p type="p">110:座管</p>  
        <p type="p">120:推手架</p>  
        <p type="p">130:扶手架</p>  
        <p type="p">131:扶手本體</p>  
        <p type="p">132:第一扶手杆</p>  
        <p type="p">133:第二扶手杆</p>  
        <p type="p">160:前腳支撐架</p>  
        <p type="p">170:後腳支撐架</p>  
        <p type="p">200:座椅組件</p>  
        <p type="p">230:座椅架</p>  
        <p type="p">300:扶手安裝單元</p>  
        <p type="p">310:第一連接座</p>  
        <p type="p">320:第二連接座</p>  
        <p type="p">325:樞軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2288" publication-number="202612955"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612955.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612955</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149313</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>雙人座嬰兒車</chinese-title>  
        <english-title>DOUBLE SEAT STROLLER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">B62B7/00</main-classification>  
        <further-classification edition="200601120251229B">B62B7/04</further-classification>  
        <further-classification edition="200601120251229B">B62B7/06</further-classification>  
        <further-classification edition="200601120251229B">B62B7/14</further-classification>  
        <further-classification edition="200601120251229B">B62B9/12</further-classification>  
        <further-classification edition="200601120251229B">B62B9/28</further-classification>  
        <further-classification edition="200601120251229B">A47D13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱萬權</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, WANQUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐頌雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種雙人座嬰兒車，包括：框架部；座椅部，設置到框架部上，且包括第一座部和第二座部；以及第一連杆，與框架部連接且設置在第一座部和第二座部之間，以將框架部內的空間分隔成第一承載空間和第二承載空間，第一承載空間的寬度大於第二承載空間的寬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a double seat stroller comprising: a frame portion; a seat portion arranged on the frame portion, and comprising a first seat portion and a second seat portion; and a first connecting rod connected to the frame portion and disposed between the first seat portion and the second seat portion to separate a space within the frame portion into a first carrying space and a second carrying space, a width of the first carrying space being greater than a width of the second carrying space.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:雙人座嬰兒車</p>  
        <p type="p">101:框架部</p>  
        <p type="p">180:第一連杆</p>  
        <p type="p">190:座椅部</p>  
        <p type="p">191:第一座部</p>  
        <p type="p">192:第二座部</p>  
        <p type="p">110:推把</p>  
        <p type="p">120:推把連接杆</p>  
        <p type="p">150:後腳管</p>  
        <p type="p">102:車輪</p>  
        <p type="p">140:前腳管</p>  
        <p type="p">160:腳踏管</p>  
        <p type="p">170:第二連杆</p>  
        <p type="p">181:第一卡合機構</p>  
        <p type="p">131:擋塊</p>  
        <p type="p">130:扶手</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2289" publication-number="202612600"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612600.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612600</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149331</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包括萊賽爾絲束的香菸過濾嘴及其製造方法</chinese-title>  
        <english-title>CIGARETTE FILTER HAVING LYOCELL TOW AND MANUFACTURING METHOD THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251220B">A24D3/04</main-classification>  
        <further-classification edition="200601120251220B">A24D3/08</further-classification>  
        <further-classification edition="200601120251220B">A24D3/10</further-classification>  
        <further-classification edition="200601120251220B">A24D3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商韓國煙草人參股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KT&amp;G CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商可隆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLON INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁眞哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIN CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金守鎬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, SOO HO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬京培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, KYENG BAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭奉洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEONG, BONG SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河成薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HA, SUNG HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭鍾喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, JONG CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦尙佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, SANG WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李廷薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JEONG HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐昇潼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, SEUNG DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃永男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, YEONG NAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種香菸過濾嘴，其包括：萊賽爾絲束，其由複數個萊賽爾纖維製成；黏合劑，其使所述萊賽爾纖維相互結合；以及溶劑，其分散在包括所述萊賽爾絲束的香菸過濾嘴的內部空間中，所述溶劑包含多元醇。根據本發明的一具體例，所述多元醇為具有C1至C4的亞烷基的二醇。本發明一具體例的香菸過濾嘴克服了以往萊賽爾絲束所具有的材料問題，並具有優秀的硬度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:吸菸製品</p>  
        <p type="p">10:吸菸物質部</p>  
        <p type="p">20:過濾嘴部</p>  
        <p type="p">30a:吸菸物質部包裝紙</p>  
        <p type="p">30b:過濾嘴部包裝紙</p>  
        <p type="p">40:接裝紙</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2290" publication-number="202612601"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612601.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612601</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149351</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>應用功能性增强的黏合劑的過濾器及包括其的吸菸物品</chinese-title>  
        <english-title>FILTERS WITH FUNCTIONAL ENHANCING BINDERS AND SMOKING ARTICLES COMPRISING THEREOF</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">A24D3/06</main-classification>  
        <further-classification edition="200601120251231B">A24D3/08</further-classification>  
        <further-classification edition="200601120251231B">A24D3/10</further-classification>  
        <further-classification edition="200601120251231B">A24D3/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商韓國煙草人參股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KT&amp;G CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商可隆股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOLON INDUSTRIES, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>河成薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HA, SUNG HOON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬京培</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MA, KYENG BAE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梁眞哲</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YANG, JIN CHUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭奉洙</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHEONG, BONG SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱小英</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JU, SOYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐昇潼</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEO, SEUNG DONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李廷薰</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, JEONG HUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭鍾喆</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JEONG, JONG CHEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>秦尙佑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JIN, SANG WOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="10"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃永男</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HWANG, YEONG NAM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張仲謙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供用於吸菸物品的過濾器及其製造方法，該過濾器包括含有複數個萊賽爾纖維的萊賽爾絲束、酚類相關功能性物質和黏合劑，並且提供包含所述用於吸菸物品的過濾器的吸菸物品。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:吸菸物品</p>  
        <p type="p">10:菸草介質部</p>  
        <p type="p">20:過濾器部</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2291" publication-number="202614664"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614664.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614664</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149387</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>通信方法和多鏈路設備</chinese-title>  
        <english-title>COMMUNICATION METHOD AND MULTI-LINK DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201801120251223B">H04W76/15</main-classification>  
        <further-classification edition="200901120251223B">H04W92/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商華為技術有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>淦明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAN, MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李伊青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YIQING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭宇宸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUO, YUCHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃國剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, GUOGANG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李雲波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LI, YUNBO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陸雨昕</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, YUXIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>吳豐任</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴俊彥</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>新北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請提供通信方法和多鏈路設備，該方法包括當多條鏈路僅有一條鏈路建立成功時，第一MLD基於單鏈路通信規則與第二MLD進行空口傳輸。該多條鏈路可以為第一MLD請求建立的多條鏈路，或者該多條鏈路可以為第一MLD與第二MLD已經建立成功的多條鏈路。當多條鏈路中僅有一條鏈路建立成功時，第一MLD和第二MLD之間不基於多鏈路通信規則進行空口傳輸。第一MLD發送的空口傳輸的幀中攜帶的位址2欄位為第一MLD的MAC位址。在安全流程下，第一MLD生成金鑰所使用的位址也可為第一MLD的MAC位址。第一MLD生成金鑰使用的位址與進行空口傳輸攜帶的位址2欄位可以是一致的。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">This application provides a communication method and a multi-link device. The method includes: when only one link of a plurality of links is successfully established, performing, by a first MLD, air interface transmission with a second MLD based on a single-link communication rule. The multi-links may be multi-links that are established upon request of the first MLD, or the multi-links may be multi-links that have been already successfully established between the first MLD and the second MLD. According to the solution of this application, when only one link of a plurality of links is successfully established, air interface transmission performed between the first MLD and the second MLD is not based on a multi-link communication rule. Specifically, the field of address 2 carried in the frame transmitted over the air interface sent by the first MLD is a MAC address of the first MLD. In a security procedure, the address used by the first MLD to generate a key may be a MAC address of the first MLD. Therefore, the address used by the first MLD to generate the key may be consistent with the field of address 2 carried in an air interface transmission.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">300:通信方法</p>  
        <p type="p">S310:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2292" publication-number="202614417"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614417.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614417</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149392</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有高佈線密度補片的半導體封裝</chinese-title>  
        <english-title>SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251222B">H01L23/488</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱利　麥克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KELLY, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡默艾樂　羅德　派翠克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUEMOELLER, RONALD PATRICK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>錫納樂　大衛　喬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HINER, DAVID JON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於一種具有高佈線密度的佈線補片的半導體封裝之方法及系統係被揭示，並且其可包含一被接合到一基板的半導體晶粒、以及一被接合至該基板以及該半導體晶粒的高佈線密度的補片，其中該高佈線密度的補片係包括一比該基板更稠密的線路密度。該高佈線密度的補片可以是一無矽的整合的模組(SLIM)補片，其係包括一BEOL部分，並且可以是無TSV的。金屬接點可被形成在該基板的一第二表面上。一第二半導體晶粒可被接合至該基板以及該高佈線密度的補片。該高佈線密度的補片可以提供在該些半導體晶粒之間的電互連。該基板可被接合到一矽中介體。該高佈線密度的補片可以具有一10微米或更小的厚度。該基板可以具有一10微米或更小的厚度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Methods and systems for a semiconductor package with high routing density routing patch are disclosed and may include a semiconductor die bonded to a substrate and a high routing density patch bonded to the substrate and to the semiconductor die, wherein the high routing density patch comprises a denser trace line density than the substrate. The high routing density patch can be a silicon-less-integrated module (SLIM) patch, comprising a BEOL portion, and can be TSV-less. Metal contacts may be formed on a second surface of the substrate. A second semiconductor die may be bonded to the substrate and to the high routing density patch. The high routing density patch may provide electrical interconnection between the semiconductor die. The substrate may be bonded to a silicon interposer. The high routing density patch may have a thickness of 10 microns or less. The substrate may have a thickness of 10 microns or less.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:封裝</p>  
        <p type="p">101A、101B:半導體晶粒</p>  
        <p type="p">103:補片</p>  
        <p type="p">105:基板</p>  
        <p type="p">107:底膠填充材料</p>  
        <p type="p">109:金屬接點</p>  
        <p type="p">111:接點結構</p>  
        <p type="p">113:凸塊下金屬(UBM)</p>  
        <p type="p">115:密封劑</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2293" publication-number="202614513"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614513.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614513</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149393</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有高速安裝界面之電連接器及其製造方法</chinese-title>  
        <english-title>ELECTRICAL CONNECTORS WITH HIGH SPEED MOUNTING INTERFACE AND METHODS OF MANUFACTURING THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201101120251223B">H01R13/6582</main-classification>  
        <further-classification edition="201101120251223B">H01R12/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商安芬諾股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMPHENOL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧納姆　約翰　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUNHAM, JOHN ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡地爾　小馬克　Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CARTIER, JR., MARC B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋路司　馬克　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAILUS, MARK W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>勒文　大衛</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEVINE, DAVID</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阿斯特伯里　艾倫</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASTBURY, ALLAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>希瓦拉詹　邁索爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIVARAJAN, VYSAKH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>普羅文徹　丹尼爾　Ｂ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PROVENCHER, DANIEL B.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>里歐　艾瑞克</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEO, ERIC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種用於經由一電子系統以信號之一高密度及高信號完整性傳遞高速信號的電互連件。該互連件包括一電連接器及該連接器安裝至的一印刷電路板之一過渡部分。信號導體使用邊緣至襯墊安裝而連接至該PCB之表面上的襯墊。該些襯墊與該些信號導體之中間部分對準，使得避免了可使信號完整性降級的該連接器內之過渡。該些信號導體可經定位為在該連接器內成列延伸的個別屏蔽之寬邊耦合對。該PCB上之表面跡線將該些襯墊連接至經對準用於在該連接器佔據區外之垂直路由的信號通孔。在該些表面跡線下方之接地平面促進自該連接器中之該些信號路徑至該PCB中之信號路徑的一過渡，其中低模態轉換避免連接器屏蔽件中之共振。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An electrical interconnect for passing high speed signals through an electronic system with a high density of signals and high signal integrity. The interconnect includes an electrical connector and a transition portion of a printed circuit board to which the connector is mounted. Signal conductors are connected to pads on the surface of the PCB using edge-to-pad mounting. The pads align with intermediate portions of the signal conductors such that transitions within the connector that could degrade signal integrity are avoided. The signal conductors may be positioned as individually shielded broadside coupled pairs extending in rows within the connector. Surface traces on the PCB connect the pads to signal vias aligned for vertical routing out of the connector footprint. Ground planes underlying the surface traces facilitate a transition from the signal paths in the connector to those in the PCB with low mode conversion avoiding resonances in the connector shields.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:電互連系統</p>  
        <p type="p">102a:第一電連接器</p>  
        <p type="p">102b:第二電連接器</p>  
        <p type="p">136a:第一接觸尾端陣列</p>  
        <p type="p">136b:第二接觸尾端陣列</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2294" publication-number="202614905"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614905.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614905</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149441</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>組件傳遞之方法及裝置及相關之發光二極體（ＬＥＤ）</chinese-title>  
        <english-title>METHOD AND DEVICE FOR THE TRANSFER OF COMPONENTS AND RELATED LIGHT-EMITTING DIODE (LED)</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202301120251223B">H10K71/00</main-classification>  
        <further-classification edition="200601120251223B">H05K13/02</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧地利商ＥＶ集團Ｅ塔那有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EV GROUP E. THALLNER GMBH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>伯格拉夫　喬根</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BURGGRAF, JURGEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>AT</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於藉由至少以下步驟、特別是藉由以下順序將組件自一發送方基板傳遞至一接收方基板之方法： &lt;br/&gt;i)      在該發送方基板上設置及/或製造該等組件， &lt;br/&gt;ii)     將該發送方基板之該等組件傳遞至傳遞基板， &lt;br/&gt;iii)    將該等組件自該傳遞基板傳遞至該接收方基板， &lt;br/&gt;其中可憑藉結合構件及/或去結合構件選擇性地傳遞該等組件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method for the transfer of components from a sender substrate to a receiver substrate with at least the following steps, in particular with the following sequence: &lt;br/&gt;i) provision and/or production of the components on the sender substrate, &lt;br/&gt;ii) transfer of the components of the sender substrate to the transfer substrate, &lt;br/&gt;iii) transfer of the components from the transfer substrate to the receiver substrate, &lt;br/&gt;wherein the components can be transferred selectively by means of bonding means and/or debonding means.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:發送方基板</p>  
        <p type="p">1o:發送方基板表面</p>  
        <p type="p">2:組件</p>  
        <p type="p">3:黏合劑區域</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2295" publication-number="202613144"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613144.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613144</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149472</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>錫化合物及使用其之阻劑溶液、圖案形成方法、薄膜、經圖案化之薄膜、以及錫化合物之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C07F7/22</main-classification>  
        <further-classification edition="200601120251229B">G03F7/004</further-classification>  
        <further-classification edition="200601120251229B">G03F7/20</further-classification>  
        <further-classification edition="200601120251229B">G03F7/32</further-classification>  
        <further-classification edition="200601120251229B">H01L21/027</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商三菱化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MITSUBISHI CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant>  
          <applicant app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商蓋列斯特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GELEST, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日置優太</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIOKI, YUTA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供下述之錫化合物作為能夠具有高純度及均勻之溶解性之高性能之阻劑材料。 &lt;br/&gt;本發明之錫化合物係具有錫原子、有機基R、氧配位基及/或羥配位基者，X射線繞射測定中之最大強度峰之繞射角2θ(°)存在於5.00～15.00°，最大強度峰之半高寬為1.00～4.00°，上述有機基R具有1～30個碳原子。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2296" publication-number="202613655"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613655.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613655</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149480</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>透鏡組合</chinese-title>  
        <english-title>LENS ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G02B13/00</main-classification>  
        <further-classification edition="202101120251229B">G02B7/02</further-classification>  
        <further-classification edition="200601120251229B">G02B3/00</further-classification>  
        <further-classification edition="202101120251229B">G03B30/00</further-classification>  
        <further-classification edition="202301120251229B">H04N23/54</further-classification>  
        <further-classification edition="202301120251229B">H04N23/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商三星電機股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>趙鏞主</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JO, YONG JOO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張道炯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JANG, DO HYEONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金炳賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIM, BYUNG HYUN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭婷文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>詹富閔</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種透鏡組合包括：多個透鏡陣列，自物體側朝影像側依序設置，其中每一透鏡陣列包括多個透鏡，且所述多個透鏡陣列中的被設置成最靠近影像側的透鏡陣列中所包括的多個透鏡在與光軸垂直的第一軸方向上具有較在與光軸及第一軸方向兩者垂直的第二軸方向上的長度長的長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A lens assembly includes a plurality of lens arrays sequentially disposed from an object side toward an image side, wherein each lens array includes a plurality of lenses, and a plurality of lenses included in a lens array of the plurality of lens arrays, disposed to be closest to the image side have a length in a first axis direction, perpendicular to an optical axis, longer than a length in a second axis direction, perpendicular to both the optical axis and the first axis direction.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110、113:透鏡陣列</p>  
        <p type="p">111:第一透鏡陣列</p>  
        <p type="p">112:第二透鏡陣列/透鏡陣列</p>  
        <p type="p">114:第四透鏡陣列/透鏡陣列</p>  
        <p type="p">115:最後透鏡陣列/透鏡陣列</p>  
        <p type="p">130:透鏡固持器</p>  
        <p type="p">300:紅外截止濾波器</p>  
        <p type="p">410:影像感測器</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2297" publication-number="202614851"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614851.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614851</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149503</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>記憶體裝置、動態隨機存取記憶體（ＤＲＡＭ）裝置及電子系統</chinese-title>  
        <english-title>MEMORY DEVICES, DYNAMIC RANDOM ACCESS MEMORY (DRAM) DEVICE, AND ELECTRONIC SYSTEMS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120251223B">H10D84/80</main-classification>  
        <further-classification edition="200601120251223B">G11C8/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商美光科技公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MICRON TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>席賽克　艾吉　費瑪　雅遜</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SIMSEK-EGE, FATMA ARZUM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>紀佩君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種微電子裝置包含一第一微電子裝置結構及附接至該第一微電子裝置結構之一第二微電子裝置結構。該第一微電子裝置結構包含：記憶體陣列，其等包含記憶體胞元，該等記憶體胞元包含存取裝置及儲存節點裝置；數位線，其等耦合至該等存取裝置且在一第一方向上延伸至一數位線出口區；及字線，其等耦合至該等存取裝置且在一第二方向上延伸至一字線出口區。該第二微電子裝置結構包含在該等記憶體胞元上方並與該等記憶體胞元電連通之控制邏輯裝置。該微電子裝置進一步包含個別地與該數位線出口區中之該等數位線接觸且與該等控制邏輯裝置之至少一些者電連通之接觸結構，該等接觸結構之至少一者包含：一第一橫截面積，其在該第一微電子裝置結構及該第二微電子裝置結構之一介面處；及一第二橫截面積，其在該等數位線之一者及該等接觸結構之該至少一者之一介面處，該第二橫截面積小於該第一橫截面積。亦描述相關微電子裝置、記憶體裝置、電子系統及方法。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A microelectronic device comprises a first microelectronic device structure and a second microelectronic device structure attached to the first microelectronic device structure. The first microelectronic device structure comprises memory arrays comprising memory cells comprising access devices and storage node devices, digit lines coupled to the access devices and extending in a first direction to a digit line exit region, and word lines coupled to the access devices and extending in a second direction to a word line exit region. The second microelectronic device structure comprises control logic devices over and in electrical communication with the memory cells. The microelectronic device further comprises contact structures individually in contact with the digit lines in the digit line exit region and in electrical communication with at least some of the control logic devices, at least one of the contact structures comprising a first cross-sectional area at an interface of the first microelectronic device structure and the second microelectronic device structure, and a second cross-sectional area at an interface of one of the digit lines and the at least one of the contact structures, the second cross-sectional area smaller than the first cross-sectional area. Related microelectronic devices, memory devices, electronic systems, and methods are also described.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">102A:第一陣列區</p>  
        <p type="p">102B:第二陣列區</p>  
        <p type="p">102C:第三陣列區</p>  
        <p type="p">102D:第四陣列區</p>  
        <p type="p">102E:第五陣列區</p>  
        <p type="p">102F:第六陣列區</p>  
        <p type="p">102G:第七陣列區</p>  
        <p type="p">102H:第八陣列區</p>  
        <p type="p">102I:第九陣列區</p>  
        <p type="p">103:列</p>  
        <p type="p">104:數位線出口區</p>  
        <p type="p">104A:第一數位線出口子區</p>  
        <p type="p">104B:第二數位線出口子區</p>  
        <p type="p">105:行</p>  
        <p type="p">106:字線出口區</p>  
        <p type="p">106A:第一字線出口子區</p>  
        <p type="p">106B:第二字線出口子區</p>  
        <p type="p">108:插座區</p>  
        <p type="p">118:數位線</p>  
        <p type="p">118A:奇數數位線</p>  
        <p type="p">118B:偶數數位線</p>  
        <p type="p">120:字線</p>  
        <p type="p">120A:奇數字線</p>  
        <p type="p">120B:偶數字線</p>  
        <p type="p">250:微電子裝置</p>  
        <p type="p">252:感測放大器(SA)區段</p>  
        <p type="p">252A:第一SA區段</p>  
        <p type="p">252B:第二SA區段</p>  
        <p type="p">254:子字線驅動器(SWD)區段</p>  
        <p type="p">254A:第一SWD區段</p>  
        <p type="p">254B:第二SWD區段</p>  
        <p type="p">256A:第一隅角</p>  
        <p type="p">256B:第二隅角</p>  
        <p type="p">256C:第三隅角</p>  
        <p type="p">256D:第四隅角</p>  
        <p type="p">258:數位線佈線及接觸結構</p>  
        <p type="p">260:字線接觸及佈線結構</p>  
        <p type="p">262:額外控制邏輯區段</p>  
        <p type="p">264:控制邏輯區段</p>  
        <p type="p">270:框</p>  
        <p type="p">272:框</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2298" publication-number="202613578"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613578.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613578</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149508</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>測試器設備以及測試一或多個電子裝置的方法</chinese-title>  
        <english-title>TESTER APPARATUS AND METHOD OF TESTING ONE OR MORE ELECTRONIC DEVICES</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120260102B">G01R31/26</main-classification>  
        <further-classification edition="200601120260102B">B65G49/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾爾測試系統</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AEHR TEST SYSTEMS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬凡維克　喬凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOVANOVIC, JOVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德博伊　肯尼士　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEBOE, KENNETH W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯塔普斯　史蒂文　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEPS, STEVEN C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>琳賽　史考特　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINDSEY, SCOTT E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明闡述一種測試器設備。具體而言，公開一種匣盒以及測試多個電子裝置的方法。各種組件有助於達成所述測試器設備的功能，包括插入與拆卸設備、熱柱、獨立萬向運動、光電偵測器的包含、多種熱控制方法的組合、插座蓋中的偵測電路系統、具有支座的貫穿柱、及電壓目標重新確定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tester apparatus is described. Specifically, a cartridge and a method of testing a plurality of electronic devices are disclosed. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:測試器設備</p>  
        <p type="p">12:測試器</p>  
        <p type="p">14:框架</p>  
        <p type="p">16:電力匯流排</p>  
        <p type="p">18A:第一插槽總成/插槽總成</p>  
        <p type="p">18B:第二插槽總成/插槽總成</p>  
        <p type="p">20:測試器纜線</p>  
        <p type="p">22:電力纜線</p>  
        <p type="p">24A:冷液體供應管路/管路</p>  
        <p type="p">24B:冷液體返回管路/管路</p>  
        <p type="p">24C:控制液體供應管路/管路</p>  
        <p type="p">24D:控制液體返回管路/管路</p>  
        <p type="p">24E:真空管路/管路</p>  
        <p type="p">28A:第一匣盒/匣盒</p>  
        <p type="p">28B:第二匣盒/匣盒</p>  
        <p type="p">30A:第一晶圓/晶圓</p>  
        <p type="p">30B:第二晶圓/晶圓</p>  
        <p type="p">32:插槽總成本體</p>  
        <p type="p">34、222:熱卡盤</p>  
        <p type="p">36:溫度偵測器</p>  
        <p type="p">38:加熱電阻器</p>  
        <p type="p">40:第一插槽總成介面/插槽總成介面</p>  
        <p type="p">44:控制介面</p>  
        <p type="p">46:電力介面</p>  
        <p type="p">48A:冷液體供應介面/介面</p>  
        <p type="p">48B:冷液體返回介面/介面</p>  
        <p type="p">48C:控制液體供應介面/介面</p>  
        <p type="p">48D:控制液體返回介面</p>  
        <p type="p">48E:真空介面/介面</p>  
        <p type="p">50:熱控制器</p>  
        <p type="p">52:溫度回饋線路</p>  
        <p type="p">54:電力線路</p>  
        <p type="p">60:母板</p>  
        <p type="p">62:通道模組板</p>  
        <p type="p">64:撓性連接器</p>  
        <p type="p">66:連接板</p>  
        <p type="p">72:薄卡盤</p>  
        <p type="p">74:背襯板</p>  
        <p type="p">76:匣盒觸點</p>  
        <p type="p">77:密封件</p>  
        <p type="p">78:匣盒介面</p>  
        <p type="p">82:門</p>  
        <p type="p">84:鉸鏈</p>  
        <p type="p">86:門開孔</p>  
        <p type="p">88:密封件</p>  
        <p type="p">90:真空管路</p>  
        <p type="p">100、102:前密封件</p>  
        <p type="p">104:連續密封式前壁</p>  
        <p type="p">106:內部壁</p>  
        <p type="p">108、110:分隔密封件</p>  
        <p type="p">112:連續密封式分隔壁</p>  
        <p type="p">224:熱流體通路</p>  
        <p type="p">226:控制液體供應管路</p>  
        <p type="p">228:控制液體返回管路</p>  
        <p type="p">240:冷卻系統</p>  
        <p type="p">242:溫度控制系統</p>  
        <p type="p">244:真空幫浦</p>  
        <p type="p">246:冷板</p>  
        <p type="p">248:流體通路</p>  
        <p type="p">2-2:線段</p>  
        <p type="p">3-3:線段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2299" publication-number="202613579"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613579.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613579</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149517</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>匣盒</chinese-title>  
        <english-title>CARTRIDGE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202001120251222B">G01R31/26</main-classification>  
        <further-classification edition="200601120251222B">B65G49/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾爾測試系統</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AEHR TEST SYSTEMS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬凡維克　喬凡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOVANOVIC, JOVAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>德博伊　肯尼士　Ｗ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEBOE, KENNETH W.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>斯塔普斯　史蒂文　Ｃ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>STEPS, STEVEN C.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>琳賽　史考特　Ｅ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LINDSEY, SCOTT E.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明闡述一種測試器設備。具體而言，公開一種匣盒以及測試多個電子裝置的方法。各種組件有助於達成所述測試器設備的功能，包括插入與拆卸設備、熱柱、獨立萬向運動、光電偵測器的包含、多種熱控制方法的組合、插座蓋中的偵測電路系統、具有支座的貫穿柱、及電壓目標重新確定。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A tester apparatus is described. Specifically, a cartridge and a method of testing a plurality of electronic devices are disclosed. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:測試器設備</p>  
        <p type="p">12:測試器</p>  
        <p type="p">14:框架</p>  
        <p type="p">16:電力匯流排</p>  
        <p type="p">18A:第一插槽總成/插槽總成</p>  
        <p type="p">18B:第二插槽總成/插槽總成</p>  
        <p type="p">20:測試器纜線</p>  
        <p type="p">22:電力纜線</p>  
        <p type="p">24A:冷液體供應管路/管路</p>  
        <p type="p">24B:冷液體返回管路/管路</p>  
        <p type="p">24C:控制液體供應管路/管路</p>  
        <p type="p">24D:控制液體返回管路/管路</p>  
        <p type="p">24E:真空管路/管路</p>  
        <p type="p">28A:第一匣盒/匣盒</p>  
        <p type="p">28B:第二匣盒/匣盒</p>  
        <p type="p">30A:第一晶圓/晶圓</p>  
        <p type="p">30B:第二晶圓/晶圓</p>  
        <p type="p">32:插槽總成本體</p>  
        <p type="p">34、222:熱卡盤</p>  
        <p type="p">36:溫度偵測器</p>  
        <p type="p">38:加熱電阻器</p>  
        <p type="p">40:第一插槽總成介面/插槽總成介面</p>  
        <p type="p">44:控制介面</p>  
        <p type="p">46:電力介面</p>  
        <p type="p">48A:冷液體供應介面/介面</p>  
        <p type="p">48B:冷液體返回介面/介面</p>  
        <p type="p">48C:控制液體供應介面/介面</p>  
        <p type="p">48D:控制液體返回介面</p>  
        <p type="p">48E:真空介面/介面</p>  
        <p type="p">50:熱控制器</p>  
        <p type="p">52:溫度回饋線路</p>  
        <p type="p">54:電力線路</p>  
        <p type="p">60:母板</p>  
        <p type="p">62:通道模組板</p>  
        <p type="p">64:撓性連接器</p>  
        <p type="p">66:連接板</p>  
        <p type="p">72:薄卡盤</p>  
        <p type="p">74:背襯板</p>  
        <p type="p">76:匣盒觸點</p>  
        <p type="p">77:密封件</p>  
        <p type="p">78:匣盒介面</p>  
        <p type="p">82:門</p>  
        <p type="p">84:鉸鏈</p>  
        <p type="p">86:門開孔</p>  
        <p type="p">88:密封件</p>  
        <p type="p">90:真空管路</p>  
        <p type="p">100、102:前密封件</p>  
        <p type="p">104:連續密封式前壁</p>  
        <p type="p">106:內部壁</p>  
        <p type="p">108、110:分隔密封件</p>  
        <p type="p">112:連續密封式分隔壁</p>  
        <p type="p">224:熱流體通路</p>  
        <p type="p">226:控制液體供應管路</p>  
        <p type="p">228:控制液體返回管路</p>  
        <p type="p">240:冷卻系統</p>  
        <p type="p">242:溫度控制系統</p>  
        <p type="p">244:真空幫浦</p>  
        <p type="p">246:冷板</p>  
        <p type="p">248:流體通路</p>  
        <p type="p">2-2:線段</p>  
        <p type="p">3-3:線段</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2300" publication-number="202614890"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614890.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614890</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149576</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>微ＬＥＤ和微ＬＥＤ顯示面板</chinese-title>  
        <english-title>MICRO LED AND MICRO LED DISPLAY PANEL</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="202501120260102B">H10H20/857</main-classification>  
        <further-classification edition="200601120260102B">H01L25/13</further-classification>  
        <further-classification edition="202501120260102B">H10H29/10</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商上海顯耀顯示科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JADE BIRD DISPLAY (SHANGHAI) LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐群超</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>XU, QUNCHAO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　偉新</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAN, WEI SIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明公開了一種微LED，微LED包含鍵合層以及至少兩個發光檯面，鍵合層設置於微LED的底部。至少兩個發光檯面設置於鍵合層上，至少兩個發光檯面自上而下垂直排列並且電並聯連接。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The invention discloses a micro LED. The micro LED comprises a bonding layer and at least two emitting mesas. The bonding layer is located on the bottom of the micro LED. The at least two emitting mesas are located on the bonding layer. The at least two emitting mesas are arrangedvertically from top to bottom and electrically connected in series.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:微LED顯示面板</p>  
        <p type="p">110:微LED</p>  
        <p type="p">111:鍵合層</p>  
        <p type="p">112:第一發光檯面</p>  
        <p type="p">113:第二發光檯面</p>  
        <p type="p">114:底部連接結構</p>  
        <p type="p">115:頂部連接層</p>  
        <p type="p">116:底部連接層</p>  
        <p type="p">117:頂部導電層</p>  
        <p type="p">117A:下沉部分</p>  
        <p type="p">118:介電材料</p>  
        <p type="p">120:IC背板</p>  
        <p type="p">130:底部焊盤</p>  
        <p type="p">140:增強焊盤</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2301" publication-number="202614413"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614413.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614413</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149592</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置和製造半導體裝置的方法</chinese-title>  
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L23/48</main-classification>  
        <further-classification edition="200601120260102B">H01L21/60</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>新加坡商安靠科技新加坡控股私人有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>SG</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>莫印蘇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MOK, IN SU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李文古</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, WON GEOL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李義波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, IL BOK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>其王門</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KI, WON MYOUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一個實例中，一種半導體裝置包括：基底組合件，所述基底組合件包括：第一基板；第一裝置，所述第一裝置位於所述第一基板的頂表面上；以及第一囊封物，所述第一囊封物位於所述第一基板的所述頂表面上並且形成所述第一裝置的側表面的邊界。所述半導體裝置進一步包括導電柱，所述導電柱位於所述第一基板上和第一模製化合物中，其中所述導電柱包括非導電柱芯和所述柱芯上的導電柱殼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">In one example, a semiconductor device comprises a base assembly comprising a first substrate, a first device on a top surface of the first substrate, and a first encapsulant on the top surface of the first substrate and bounding a side surface of the first device. The semiconductor device further comprises a conductive pillar on the first substrate and in the first molding compound, wherein the conductive pillar comprises a non-conductive pillar core and a conductive pillar shell on the pillar core.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:半導體裝置</p>  
        <p type="p">100:基底組合件</p>  
        <p type="p">110:基板</p>  
        <p type="p">111:重新分佈結構</p>  
        <p type="p">112:介電結構</p>  
        <p type="p">113:襯墊</p>  
        <p type="p">120:電子裝置</p>  
        <p type="p">121:互連件</p>  
        <p type="p">122:介面層/模製材料/底部填料</p>  
        <p type="p">130:導電柱/柱</p>  
        <p type="p">131:柱芯</p>  
        <p type="p">132:柱殼</p>  
        <p type="p">140:囊封物</p>  
        <p type="p">200:頂部組合件</p>  
        <p type="p">210:基板</p>  
        <p type="p">211:重新分佈結構</p>  
        <p type="p">212:介電結構</p>  
        <p type="p">220:電子裝置</p>  
        <p type="p">221:互連件</p>  
        <p type="p">230:囊封物</p>  
        <p type="p">240:互連件</p>  
        <p type="p">300:介面層/囊封物/底部填料</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2302" publication-number="202613243"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613243.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613243</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149597</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>半導體裝置的製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">C08L63/04</main-classification>  
        <further-classification edition="200601120251224B">C08G59/32</further-classification>  
        <further-classification edition="200601120251224B">A61K31/4425</further-classification>  
        <further-classification edition="200601120251224B">G03F7/039</further-classification>  
        <further-classification edition="202301120251224B">H10K71/12</further-classification>  
        <further-classification edition="200601120251224B">H01L21/47</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日產化學股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISSAN CHEMICAL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>橋本雄人</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HASHIMOTO, YUTO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西田登喜雄</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NISHITA, TOKIO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠藤勇樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENDO, YUKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係提供在半導體基板加工時針對於濕蝕刻液之良好的遮罩(保護)機能，而且保存安定性優異的保護膜形成組成物及使用該組成物所製造而得之保護膜，附阻劑圖案之基板及半導體裝置的製造方法。一種針對於半導體用濕蝕刻液之保護膜形成組成物，其包含具有下述式(1-1)所示之單位結構之聚合物、熱聚合起始劑及溶劑： &lt;br/&gt;&lt;img align="absmiddle" height="244px" width="437px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(1-1)中，Ar表示苯環、萘環或蒽環，R&lt;sup&gt;1&lt;/sup&gt;表示羥基、可經甲基保護之巰基、可經甲基保護之胺基、鹵基或可經雜原子取代或中斷之可經羥基取代之碳原子數1~10的烷基，n1表示0~3的整數，n2表示1或2，L&lt;sup&gt;1&lt;/sup&gt;表示單鍵或碳原子數1~10的伸烷基，E表示環氧基，T&lt;sup&gt;1&lt;/sup&gt;在n2=1時，表示單鍵、可經醚鍵、酯鍵或醯胺鍵中斷之碳原子數1~10的伸烷基，T&lt;sup&gt;1&lt;/sup&gt;在n2=2時，表示氮原子或醯胺鍵)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2303" publication-number="202613621"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613621.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613621</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149674</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光子積體電路晶片、光互連模組、光互連裝置、計算裝置和系統</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G02B6/12</main-classification>  
        <further-classification edition="200601120251230B">G02B6/26</further-classification>  
        <further-classification edition="200601120251230B">G02B6/04</further-classification>  
        <further-classification edition="201301120251230B">H04B10/70</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商杭州光智元科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HANGZHOU GUANGZHIYUAN TECHNOLOGY CO. LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>孟懷宇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>沈亦晨</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂文清</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王瀧</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>胡濤</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及光子積體電路晶片、光互連模組、光互連裝置、計算裝置和系統。該系統中的多個計算裝置採用光互連裝置進行光纖連接，通過對光互連裝置中的光交換單元進行控制來切換外部光鏈路，可改變多個計算裝置的通信路徑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:光互連裝置</p>  
        <p type="p">200:光互連模組</p>  
        <p type="p">201:光子積體電路晶片</p>  
        <p type="p">202:收發用類比電晶片</p>  
        <p type="p">203:光纖陣列</p>  
        <p type="p">204:基板</p>  
        <p type="p">205:雷射光模組</p>  
        <p type="p">206-1:第一光纖接口</p>  
        <p type="p">206-2:第二光纖接口</p>  
        <p type="p">207:PCB板</p>  
        <p type="p">208:重定時器</p>  
        <p type="p">209:電壓調節模組</p>  
        <p type="p">210:電壓調節模組</p>  
        <p type="p">211:高速接口</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2304" publication-number="202613484"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613484.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613484</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149690</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於傳導式電性武器之彈藥筒及用於傳導式電性武器的彈藥筒之彈藥筒識別符</chinese-title>  
        <english-title>CARTRIDGE FOR CONDUCTED ELECTRICAL WEAPON AND CARTRIDGE IDENTIFIER FOR THE SAME</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201301120251224B">F41B11/57</main-classification>  
        <further-classification edition="200601120251224B">F41B6/00</further-classification>  
        <further-classification edition="200601120251224B">F41B15/00</further-classification>  
        <further-classification edition="200601120251224B">F41H13/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商愛克勝企業公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AXON ENTERPRISE, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅伯特　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ROBERTS, MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>查卡諾維克　杜博拉法寇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZEKANOVIC, DUBRAVKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">&lt;b&gt;　　&lt;/b&gt;用於傳導式電性武器的彈匣可包括被配置以接收彈藥筒的鏜孔。鏜孔可以被尺寸化並被成形以接收具有特定彈藥筒類型的彈藥筒。彈藥筒可以包括耦合到彈藥筒的外表面的彈藥筒識別符。彈藥筒識別符可以包括指示彈藥筒的彈藥筒類型的物理性質。彈藥筒識別符可以允許彈藥筒被正確地接收到彈匣的鏜孔中。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A magazine for a conducted electrical weapon may include a bore configured to receive a cartridge. The bore may be sized and shaped to receive a cartridge having a specific cartridge type. A cartridge may comprise a cartridge identifier coupled to an outer surface of the cartridge. The cartridge identifier may include a physical property indicating a cartridge type of the cartridge. The cartridge identifier may allow the cartridge to be correctly received into the bore of the magazine.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">555:彈藥筒</p>  
        <p type="p">570:主體</p>  
        <p type="p">571:第一端</p>  
        <p type="p">572:第二端</p>  
        <p type="p">574:寬部</p>  
        <p type="p">576:細長部</p>  
        <p type="p">580:彈藥筒識別符</p>  
        <p type="p">CL1:第一長度</p>  
        <p type="p">CL2:第二長度</p>  
        <p type="p">CL3:第三長度</p>  
        <p type="p">CL4:第四長度</p>  
        <p type="p">CW1:第一寬度</p>  
        <p type="p">CW2:第二寬度</p>  
        <p type="p">CW3:第三寬度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2305" publication-number="202612937"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612937.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612937</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149695</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>兒童安全座椅</chinese-title>  
        <english-title>CHILD CAR SEAT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251224B">B60N2/28</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瑞士商明門瑞士股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WONDERLAND SWITZERLAND AG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CH</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷曼　大衛　Ａ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEHMAN, DAVID A.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅森　凱爾　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MASON, KYLE S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>泰勒　安德魯　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAYLOR, ANDREW J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈滕斯汀　柯爾提絲　Ｍ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HARTENSTINE, CURTIS M.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍斯特　安德魯　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HORST, ANDREW J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王立成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>余宗學</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">在一實施例中，一種兒童安全座椅適用於一汽車且具有一本體、一乘坐面以及一後仰腳，本體具有椅背；乘坐面自椅背向前延伸；後仰腳具有一前端以及一後端，前端定義一卡掣區，卡掣區卡掣一汽車座椅，後端配置於前端的後方且與本體耦合，從而使後仰腳繞一樞轉軸相對於本體樞轉，進而使本體在至少一後仰位置以及至少一前傾位置間過渡。後端具有一剛性部，兒童安全座椅具有一可變形體，且可變形體固設於剛性部。可變形體卡掣汽車座椅並在比剛性部小的一力的作用下變形。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:兒童安全座椅</p>  
        <p type="p">12:本體</p>  
        <p type="p">22:第一側</p>  
        <p type="p">24:第二側</p>  
        <p type="p">100:椅背</p>  
        <p type="p">150:頭靠</p>  
        <p type="p">400:挽具</p>  
        <p type="p">402:第一繫帶</p>  
        <p type="p">402a:膝帶部</p>  
        <p type="p">402b:肩帶部</p>  
        <p type="p">404:第二繫帶</p>  
        <p type="p">404a:膝帶部</p>  
        <p type="p">404b:肩帶部</p>  
        <p type="p">406:胯扣</p>  
        <p type="p">408:胯帶</p>  
        <p type="p">410:織帶</p>  
        <p type="p">412:鎖件</p>  
        <p type="p">500:後仰基座</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2306" publication-number="202613595"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613595.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613595</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149705</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用以掃描物體的雷達系統與方法</chinese-title>  
        <english-title>RADAR SYSTEM AND METHOD FOR SCANNING OBJECTS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G01S13/87</main-classification>  
        <further-classification edition="200601120260102B">G01S13/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>創未來科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRON FUTURE TECH INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃彥銘</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, YEN-MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>柯承詠</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KE, CHENG-YUNG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>呂保明</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LU, PAO MING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蘇柏青</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SU, BOR-CHING</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>王毓駒</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WANG, YU-JIU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃愷</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本申請揭示一種雷達系統。雷達系統包含第一子陣列至第三子陣列。第一子陣列包含多個第一天線。第二子陣列包含多個第二天線。第三子陣列包含多個第三天線。當掃描雷達系統的雷達覆蓋範圍時，雷達系統利用第一子陣列與第二子陣列作為射頻信號收發器，並利用第三子陣列作為射頻信號接收器以：根據多個第一信號參數掃描第一探測距離範圍；以及根據多個第二信號參數掃描第二探測距離範圍。從雷達系統到第一探測距離範圍內的每一可探測位置所測得的最大距離小於或等於從雷達系統到第二探測距離範圍內的每一可探測位置所測得的最小距離。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">The present application discloses a radar system. The radar system includes a first subarray through a third subarray. The first subarray includes first antennas. The second subarray includes second antennas. The third subarray includes third antennas. When scanning a radar coverage of the radar system, the radar system utilizes the first subarray and the second subarray as RF signal transceivers and utilizes the third subarray as a RF signal receiver to scan a first detection distance range according to first signal parameters and scan a second detection distance range according to second signal parameters. A maximum distance measured from the radar system to each detectable location in the first detection distance range is less than or equal to a minimum distance measured from the radar system to each detectable location in the second detection distance range.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:雷達系統</p>  
        <p type="p">110、120、130:子陣列</p>  
        <p type="p">112_1至112_M、122_1至122_N、132_1至132_O:天線</p>  
        <p type="p">DV1、DV2、DH1、DH2、DH3:距離</p>  
        <p type="p">MP1:中點</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2307" publication-number="202613052"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613052.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613052</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149900</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>氟磷酸鹽玻璃及近紅外線截止濾波器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">C03C3/247</main-classification>  
        <further-classification edition="200601120251230B">C03C4/08</further-classification>  
        <further-classification edition="200601120251230B">G02B5/20</further-classification>  
        <further-classification edition="200601120251230B">G02B5/22</further-classification>  
        <further-classification edition="201901120251230B">B32B7/023</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大口佳奈子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OHGUCHI, KANAKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂上貴尋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAGAMI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明涉及一種氟磷酸鹽玻璃，其含有P、F、O作為必要成分，且以陽離子%計：Cu&lt;sup&gt;2+&lt;/sup&gt;為5~14%，(Ca&lt;sup&gt;2+&lt;/sup&gt;之含量+Ba&lt;sup&gt;2+&lt;/sup&gt;之含量)/ΣR&lt;sup&gt;2+&lt;/sup&gt;(ΣR&lt;sup&gt;2+&lt;/sup&gt;係指Ba&lt;sup&gt;2+&lt;/sup&gt;、Sr&lt;sup&gt;2+&lt;/sup&gt;、Ca&lt;sup&gt;2+&lt;/sup&gt;、Mg&lt;sup&gt;2+&lt;/sup&gt;之合計量)為0.75~1.0，Li&lt;sup&gt;+&lt;/sup&gt;之含量/ΣR’&lt;sup&gt;+&lt;/sup&gt;(ΣR’&lt;sup&gt;+&lt;/sup&gt;係指Li&lt;sup&gt;+&lt;/sup&gt;、Na&lt;sup&gt;+&lt;/sup&gt;之合計量)為0.75~1.0(惟，不包含1.0)；並且，該玻璃之楊氏模數為70GPa以上。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2308" publication-number="202614371"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614371.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614371</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114149916</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基板處理裝置及物品之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251226B">H01L23/12</main-classification>  
        <further-classification edition="202101120251226B">G01N27/62</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商佳能股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CANON KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黒野泰友</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KURONO, YASUTOMO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岸本克史</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KISHIMOTO, KATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">基板裝置，具備：腔室；基板保持部，其在前述腔室的內部空間中保持具有膜的基板；加熱器，其對前述膜進行加熱，以對前述膜進行熱處理；氣體分析儀，其具有與前述內部空間連通的氣體取樣部，並對前述內部空間的特定氣體進行檢測；氣流形成部，其包括供應部，前述供應部向前述內部空間供應惰性氣體，以形成沿著前述基板的表面流動而到達前述氣體取樣部的前述惰性氣體的流動；以及控制器，其基於前述氣體分析儀的輸出而判定前述膜的熱處理的結束。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:腔室</p>  
        <p type="p">SP:內部空間</p>  
        <p type="p">20:基板保持部</p>  
        <p type="p">30:排出泵</p>  
        <p type="p">32:排出口</p>  
        <p type="p">50:供應部</p>  
        <p type="p">52:供應噴嘴</p>  
        <p type="p">60:氣體分析儀</p>  
        <p type="p">62:氣體取樣部</p>  
        <p type="p">70:加熱器</p>  
        <p type="p">SPA:基板處理裝置</p>  
        <p type="p">90:控制器</p>  
        <p type="p">GFF:氣流形成部</p>  
        <p type="p">S:基板</p>  
        <p type="p">F:膜</p>  
        <p type="p">IGF:惰性氣體的流動</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2309" publication-number="202613664"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613664.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613664</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150002</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>分合光元件及投影裝置</chinese-title>  
        <english-title>LIGHT SPLITTING AND COMBINING ELEMENT AND PROJECTION DEVICE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G02B27/18</main-classification>  
        <further-classification edition="200601120260102B">G02B21/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>中強光電股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CORETRONIC CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹科學工業園區新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張睿</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>CHANG, JUI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>黃冠達</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HUANG, KUAN-TA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徐若涵</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSU, JO-HAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種照明系統，包括光源模組、分合光元件、擴束準直模組、反射元件以及合光模組。照明系統用以提供照明光束。光源模組用以產生第一色光束、第二色光束以及第三色光束。第一色光束及第二色光束傳遞至分合光元件後，第一色光束及第二色光束被分合光元件反射。第一色光束及第二色光束離開分合光元件的路徑重合。來自分合光元件的第一色光束及第二色光束藉由擴束準直模組擴束及準直並傳遞至合光模組。來自光源模組的第三色光束被反射元件反射並傳遞至合光模組。第一色光束、第二色光束及第三色光束離開合光模組後的路徑重合。一種投影裝置亦被提出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An illumination system including a light source module, a light splitting and combining element, a beam expanding and collimating module, a reflecting element, and a light combining module is provided. The illumination system is configured to provide an illumination beam. The light source module is configured to generate a first, a second and a third color beams. The first and second color beams are reflected by the light splitting and combining element after being transmitted to the light splitting and combining element. Paths of the first and second color beams leaving the light splitting and combining element are coincident. The first and second color beams from the light splitting and combining element are expanded and collimated by the beam expanding and collimating module and transmitted to the light combining module. The third color beam from the light source module is reflected by the reflecting element and transmitted to the light combining module. Paths of the first to third color beams after leaving the light combining module are coincident. A projection device is provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:投影裝置</p>  
        <p type="p">100:照明系統</p>  
        <p type="p">110:光源模組</p>  
        <p type="p">120:分合光元件</p>  
        <p type="p">130:擴束準直模組</p>  
        <p type="p">140:反射元件</p>  
        <p type="p">150:合光模組</p>  
        <p type="p">160:勻光元件</p>  
        <p type="p">200:光閥</p>  
        <p type="p">300:投影鏡頭</p>  
        <p type="p">C1:第一色光束</p>  
        <p type="p">C2:第二色光束</p>  
        <p type="p">C3:第三色光束</p>  
        <p type="p">IB:影像光束</p>  
        <p type="p">IL:照明光束</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2310" publication-number="202613391"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613391.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613391</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150043</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>建築施工法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">E04G23/02</main-classification>  
        <further-classification edition="200601120251229B">E04G21/14</further-classification>  
        <further-classification edition="200601120251229B">E04B2/02</further-classification>  
        <further-classification edition="200601120251229B">E04B2/52</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商阿斯特股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASTER CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鈴木正臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SUZUKI, MASAOMI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉賈塞卡蘭　香塔努</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAJASEKHARAN, SHANTHANU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>山本憲二郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YAMAMOTO, KENJIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鮑亞嵐</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉亞君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的建築施工法具有使圬工面板移動至建築物內的規定位置的步驟，所述圬工面板在框體的內部配置有多個圬工材，且在由所述多個圬工材構成的圬工牆的牆面形成有加強塗層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:圬工牆</p>  
        <p type="p">11:圬工材</p>  
        <p type="p">20:框體</p>  
        <p type="p">21:上部框架</p>  
        <p type="p">22:下部框架</p>  
        <p type="p">23:側框架</p>  
        <p type="p">30:加強塗層</p>  
        <p type="p">S100:圬工面板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2311" publication-number="202613886"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613886.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613886</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150065</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>與用於人工神經網路陣列的輸出電路相關的系統及方法</chinese-title>  
        <english-title>SYSTEM AND METHOD RELATED TO OUTPUT CIRCUIT FOR ARTIFICIAL NEURAL NETWORK ARRAY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G06N3/06</main-classification>  
        <further-classification edition="200601120260102B">G11C11/54</further-classification>  
        <further-classification edition="200601120260102B">G11C16/06</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商超捷公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SILICON STORAGE TECHNOLOGY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳　曉萬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRAN, HIEU VAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄭　史蒂芬</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TRINH, STEPHEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪　史丹利</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HONG, STANLEY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>武　順</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VU, THUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>樂　義</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LE, NGHIA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>范　賢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHAM, HIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>VN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>賴經臣</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宿希成</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示在人工神經網路中的輸出電路系統及相關方法的許多示例。在示例中，此系統包括：非揮發性記憶體胞元陣列，排列成為諸多列及行；輸出區塊，用於在第一時間週期將來自該陣列的行之電流轉換成第一數位輸出，且在第二時間週期將其轉換成第二數位輸出；第一輸出暫存器，用於在該第一時間週期儲存該第一數位輸出，且在該第二時間週期輸出所儲存的該第一數位輸出；以及，第二輸出暫存器，用於在該第二時間週期儲存該第二數位輸出，且在第三時間週期輸出所儲存的該第二數位輸出。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Numerous examples are disclosed of output circuitry and associated methods in an artificial neural network. In one example, a system comprises an array of non-volatile memory cells arranged into rows and columns, an output block to convert current from columns of the array into a first digital output during a first time period and a second digital output during a second time period, a first output register to store the first digital output during the first time period and to output the stored first digital output during the second time period, and a second output register to store the second digital output during the second time period and to output the stored second digital output during a third time period.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">C1:層</p>  
        <p type="p">C2:層</p>  
        <p type="p">C3:層</p>  
        <p type="p">CB1:突觸</p>  
        <p type="p">CB2:突觸</p>  
        <p type="p">CB3:突觸</p>  
        <p type="p">CB4:突觸</p>  
        <p type="p">P1:激勵函數</p>  
        <p type="p">P2:激勵函數</p>  
        <p type="p">S1:層</p>  
        <p type="p">S2:層</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2312" publication-number="202613047"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613047.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613047</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150091</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>玻璃基板及玻璃基板之製造方法</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">C03B5/18</main-classification>  
        <further-classification edition="200601120251229B">C03C3/076</further-classification>  
        <further-classification edition="200601120251229B">C03C3/078</further-classification>  
        <further-classification edition="200601120251229B">C03C3/083</further-classification>  
        <further-classification edition="200601120251229B">C03C3/085</further-classification>  
        <further-classification edition="200601120251229B">C03C3/087</further-classification>  
        <further-classification edition="200601120251229B">C03C3/089</further-classification>  
        <further-classification edition="200601120251229B">C03C3/091</further-classification>  
        <further-classification edition="200601120251229B">C03C3/093</further-classification>  
        <further-classification edition="200601120251229B">C03C3/095</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>小林悠波</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KOBAYASHI, YUHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>後藤賢志</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GOTO, KENJI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明可適當地製造半導體元件。本發明中，玻璃基板(10)係用於製造半導體元件者，於使一表面(10A)朝向鉛直方向下方，藉由支持構件(B)支持一表面(10A)之較玻璃基板(10)之中心點(O)靠徑向外側的第1位置(P1A)、第2位置(P2A)及第3位置(P3A)之情形時，從鉛直方向觀察，另一表面(10B)中鉛直方向上之高度最低之位置即最低點(SB1)位於圓形中央區域(AR)內，該圓形中央區域(AR)較第1位置(P1A)、第2位置(P2A)及第3位置(P3A)靠徑向內側，且中心為玻璃基板(10)之中心點(O)、而且直徑(D1)相對於玻璃基板(10)之直徑(W)而言為1/3之長度。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:玻璃基板</p>  
        <p type="p">10A:表面</p>  
        <p type="p">10B:表面</p>  
        <p type="p">AR:中央區域</p>  
        <p type="p">B:支持構件</p>  
        <p type="p">D1:直徑</p>  
        <p type="p">L1A:距離</p>  
        <p type="p">L2A:距離</p>  
        <p type="p">L3A:距離</p>  
        <p type="p">O:中心點</p>  
        <p type="p">P1A:第1位置</p>  
        <p type="p">P2A:第2位置</p>  
        <p type="p">P3A:第3位置</p>  
        <p type="p">SB1:最低點</p>  
        <p type="p">SB2:最高點</p>  
        <p type="p">TBmax:最大撓曲量</p>  
        <p type="p">W:直徑</p>  
        <p type="p">Z:方向</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2313" publication-number="202614025"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614025.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614025</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150186</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>顯示設備</chinese-title>  
        <english-title>DISPLAY APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201601120251230B">G09G3/3233</main-classification>  
        <further-classification edition="200601120251230B">G06F3/041</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LG DISPLAY CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>權洙贊</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KWON, SU-CHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>申東琢</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIN, DONGTACK</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>許世正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭露一種顯示設備。根據本公開的顯示設備可包括顯示面板，其包括主動區及包圍主動區的非主動區，發光元件單元，其包括設置在顯示面板主動區上方的多個發光元件，以及設置在剛性增強層上的極化層。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Disclosed is a display apparatus. The display apparatus according to the present disclosure may include a display panel including an active area and a non-active area surrounding the active area, a light emitting element unit including a plurality of light emitting elements disposed on the active area of the display panel, a rigidity reinforcement layer disposed above the display panel, and a polarization layer disposed on the rigidity reinforcement layer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1000:顯示設備</p>  
        <p type="p">101:基底基板</p>  
        <p type="p">1010:可撓性電路板</p>  
        <p type="p">1015:積體電路晶片</p>  
        <p type="p">1020:印刷電路板</p>  
        <p type="p">AA:主動區</p>  
        <p type="p">DL:資料線</p>  
        <p type="p">NAA:非主動區</p>  
        <p type="p">P:子像素</p>  
        <p type="p">PNL:顯示面板</p>  
        <p type="p">SL:掃描線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2314" publication-number="202613611"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613611.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613611</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150194</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>附光學補償層之偏光板及使用其之有機ＥＬ面板</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G02B5/30</main-classification>  
        <further-classification edition="201901120260102B">B32B7/02</further-classification>  
        <further-classification edition="202301120260102B">H10K59/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商日東電工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NITTO DENKO CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>有賀草平</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ARUGA, SOHEI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林大輔</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HAYASHI, DAISUKE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明提供一種附光學補償層之偏光板，其維持正面方向之優異之抗反射特性，且斜方向之抗反射特性亦優異，並且斜方向之色相為中性。 &lt;br/&gt;本發明之附光學補償層之偏光板用於有機EL面板。該附光學補償層之偏光板依次具備偏光元件、第一光學補償層及第二光學補償層。第一光學補償層顯示出nx≧nz＞ny之折射率特性，Re(550)為90 nm～180 nm。第二光學補償層顯示出nx＞ny＝nz之折射率特性，Re(550)為100 nm～180 nm。第一光學補償層之Re(450)及Re(550)實質上相等，第二光學補償層滿足Re(450)＞Re(550)。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:偏光元件</p>  
        <p type="p">20:保護層</p>  
        <p type="p">30:第一光學補償層</p>  
        <p type="p">40:第二光學補償層</p>  
        <p type="p">100:附光學補償層之偏光板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2315" publication-number="202614553"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614553.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614553</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150197</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>封裝模組</chinese-title>  
        <english-title>PACKAGED MODULE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H03F1/26</main-classification>  
        <further-classification edition="200601120260102B">H03F1/02</further-classification>  
        <further-classification edition="201501120260102B">H04B1/40</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商天工方案公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SKYWORKS SOLUTIONS, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>巴布科克　喬治　愛德華</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BABCOCK, GREGORY EDWARD</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>戴里歐　羅里　安</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DEORIO, LORI ANN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>弗奈特　戴倫　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FRENETTE, DARREN ROGER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>寇瑞　喬治</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KHOURY, GEORGE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洛彼安可　安東尼　詹姆斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LOBIANCO, ANTHONY JAMES</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>阮　紅孟</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NGUYEN, HOANG MONG</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅德里格斯　芮妮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RODRIGUEZ, RENE</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>索立曼　亞瑟　海拉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SOLIMAN, YASSER KHAIRAT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="9"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>瓦里斯　萊斯里　保羅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>WALLIS, LESLIE PAUL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CA</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林嘉興</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示前端系統及相關裝置、積體電路、模組及方法。一種此類前端系統包括在一接收路徑中之一低雜訊放大器及在一傳輸路徑中之一多模式功率放大器電路。該低雜訊放大器包括一第一電感器、一放大電路及磁耦合至該第一電感器以提供負回饋以線性化該低雜訊放大器之一第二電感器。該多模式功率放大器電路包括一堆疊輸出級，其包括兩個或兩個以上電晶體之一電晶體堆疊。該多模式功率放大器電路亦包括一偏壓電路，其經組態以基於該多模式功率放大器電路之一模式控制該電晶體堆疊中之至少一個電晶體之一偏壓。揭示前端系統之其他實施例，連同相關裝置、積體電路、模組、方法及其組件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Front end systems and related devices, integrated circuits, modules, and methods are disclosed. One such front end system includes a low noise amplifier in a receive path and a multi-mode power amplifier circuit in a transmit path. The low noise amplifier includes a first inductor, an amplification circuit, and a second inductor magnetically coupled to the first inductor to provide negative feedback to linearize the low noise amplifier. The multi-mode power amplifier circuit includes a stacked output stage including a transistor stack of two or more transistors. The multi-mode power amplifier circuit also includes a bias circuit configured to control a bias of at least one transistor of the transistor stack based on a mode of the multi-mode power amplifier circuit. Other embodiments of front end systems are disclosed, along with related devices, integrated circuits, modules, methods, and components thereof.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">30:前端系統</p>  
        <p type="p">31:多模式功率放大器</p>  
        <p type="p">32:低雜訊放大器</p>  
        <p type="p">33:射頻開關</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2316" publication-number="202614618"> 
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        <document-id> 
          <doc-number>202614618</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150280</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>編碼方法、解碼方法、編碼器、解碼器以及儲存媒介</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260102B">H04N19/50</main-classification>  
        <further-classification edition="201401120260102B">H04N19/176</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商ＯＰＰＯ廣東移動通信有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍俊彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周璽樂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬彥卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊付正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉爾順</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種編碼方法、解碼方法、編碼器、解碼器以及儲存媒介，當預測模式參數指示採用GPM確定當前塊的幀間預測值時，確定當前塊的兩個分區；從運動訊息候選清單中，確定兩個分區的運動訊息，將第一和第二運動訊息索引值分別設置為第一和第二分區的運動訊息在運動訊息候選清單中的索引序號值；分別對第一和第二運動訊息索引值進行二值化處理，得到第一符號串和第二符號串；使用不同的上下文概率模型分別對第一符號串和第二符號串的第一個二元符號熵編碼；使用預設模型分別對第一符號串和第二符號串內除第一個二元符號之外的二元符號熵編碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S401~S407:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2317" publication-number="202614619"> 
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      <tif no="1" file="TIF/202614619.zip"/> 
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      <volno>24</volno>  
      <isuno>7</isuno>  
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        <document-id> 
          <doc-number>202614619</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150281</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>編碼方法、解碼方法、編碼器、解碼器以及儲存媒介</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260102B">H04N19/50</main-classification>  
        <further-classification edition="201401120260102B">H04N19/176</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商ＯＰＰＯ廣東移動通信有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍俊彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>周璽樂</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>馬彥卓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>萬帥</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>楊付正</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name/>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉爾順</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種編碼方法、解碼方法、編碼器、解碼器以及儲存媒介，當預測模式參數指示採用GPM確定當前塊的幀間預測值時，確定當前塊的兩個分區；從運動訊息候選清單中，確定兩個分區的運動訊息，將第一和第二運動訊息索引值分別設置為第一和第二分區的運動訊息在運動訊息候選清單中的索引序號值；分別對第一和第二運動訊息索引值進行二值化處理，得到第一符號串和第二符號串；使用不同的上下文概率模型分別對第一符號串和第二符號串的第一個二元符號熵編碼；使用預設模型分別對第一符號串和第二符號串內除第一個二元符號之外的二元符號熵編碼。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">S401~S407:步驟</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2318" publication-number="202614616"> 
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      <tif no="1" file="TIF/202614616.zip"/> 
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        <document-id> 
          <doc-number>202614616</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150370</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>動態圖像解碼裝置及動態圖像編碼裝置</chinese-title>  
        <english-title>(無)</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="201401120260102B">H04N19/122</main-classification>  
        <further-classification edition="201401120260102B">H04N19/126</further-classification>  
        <further-classification edition="201401120260102B">H04N19/176</further-classification>  
        <further-classification edition="201401120260102B">H04N19/119</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商夏普股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHARP KABUSHIKI KAISHA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>八杉將伸</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>YASUGI, YUKINOBU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>佐佐木瑛一</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SASAKI, EIICHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豬飼知宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>IKAI, TOMOHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>青野友子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AONO, TOMOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>郭炫宏</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">課題&lt;br/&gt; 本發明之課題在於，於藉由矩陣與參照圖像之積生成中間預測圖像，且插補該中間預測圖像而生成預測圖像之預測部中，中間預測圖像之導出處理較為複雜。&lt;br/&gt; 解決手段&lt;br/&gt; 一種動態圖像解碼裝置，其特徵在於具備：矩陣參照像素導出部，其導出對鄰接於對象區塊之上與左之圖像進行下取樣而得之圖像作為參照圖像；權重矩陣導出部，其根據框內預測模式與對象區塊尺寸導出權重係數之矩陣；矩陣預測圖像導出部，其藉由上述參照圖像之元素與上述權重係數之矩陣之元素之積導出預測圖像；及矩陣預測圖像插補部，其導出上述預測圖像或插補有上述預測圖像之圖像作為預測圖像；且上述權重矩陣導出部導出對象區塊尺寸之寬度以下且高度以下之尺寸之矩陣。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">mWeight:權重矩陣</p>  
        <p type="p">nTbW:寬度</p>  
        <p type="p">nTbH:高度</p>  
        <p type="p">predMip:中間預測圖像</p>  
        <p type="p">predSize:寬度與高度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2319" publication-number="202613533"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613533.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613533</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150390</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>處理經切割半導體晶圓之方法</chinese-title>  
        <english-title>METHOD OF PROCESSING A CLEAVED SEMICONDUCTOR WAFER</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G01N21/95</main-classification>  
        <further-classification edition="201701120260102B">G06T7/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>環球晶圓股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GLOBALWAFERS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address>新竹市</address>  
              <english-country>TW</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>梅爾　班傑明　麥可</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MEYER, BENJAMIN MICHAEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>凱瑟　賈斯汀　史考特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAYSER, JUSTIN SCOTT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>維利　約翰　Ｆ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>VALLEY, JOHN F.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>艾奧夫　斯姆士　迪恩</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>EOFF, JAMES DEAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坦納　文登</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TANNA, VANDAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>路特　威廉　Ｌ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LUTER, WILLIAM L.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪榮宗</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種偵測一半導體晶圓上之缺陷之方法，其包含將漫射光引導至該半導體晶圓及使該漫射光反射離開該半導體晶圓。該方法進一步包含用一攝影機偵測該漫射光以產生該半導體晶圓之一影像及分析該影像以偵測該半導體晶圓上之缺陷。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A method of detecting defects on a semiconductor wafer includes directing diffuse light to the semiconductor wafer and reflecting the diffuse light off of the semiconductor wafer. The method further includes detecting the diffuse light with a camera to generate an image of the semiconductor wafer and analyzing the image to detect defects on the semiconductor wafer.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">110:半導體晶圓成像站或系統/成像系統</p>  
        <p type="p">116:共同位置</p>  
        <p type="p">118:黑箱</p>  
        <p type="p">120:末端執行器</p>  
        <p type="p">122:定位板</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2320" publication-number="202613656"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613656.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613656</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150401</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光學透鏡組</chinese-title>  
        <english-title>OPTICAL LENS ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">G02B13/00</main-classification>  
        <further-classification edition="200601120251230B">G02B13/18</further-classification>  
        <further-classification edition="200601120251230B">G03B21/14</further-classification>  
        <further-classification edition="200601120251230B">G02B13/16</further-classification>  
        <further-classification edition="200601120251230B">G02B27/00</further-classification>  
        <further-classification edition="200601120251230B">G02B9/60</further-classification>  
        <further-classification edition="202301120251230B">H04N23/55</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖華濱</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LIAO, HUABIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>朱清智</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHU, QINGZHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>張嘉元</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ZHANG, JIAYUAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>CN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>謝宏健</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HSIEH, HUNG-CHIEN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>TW</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卓俊傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種光學透鏡組，其從第一側至第二側沿光軸依序包括第一透鏡、第二透鏡、第三透鏡、第四透鏡以及第五透鏡。光學透鏡組滿足D34/D12≧2.600的條件式。另，其他光學透鏡組亦被提供。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An optical lens assembly including a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element sequentially along an optical axis from a first side to a second side is provided. The optical lens assembly satisfies the condition of D34/D12≧2.600. Furthermore, other optical lens assemblies are also provided.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">0:光圈</p>  
        <p type="p">1:第一透鏡</p>  
        <p type="p">2:第二透鏡</p>  
        <p type="p">3:第三透鏡</p>  
        <p type="p">4:第四透鏡</p>  
        <p type="p">5:第五透鏡</p>  
        <p type="p">10:光學透鏡組</p>  
        <p type="p">11、21、31、41、51:第一側面</p>  
        <p type="p">12、22、32、42、52:第二側面</p>  
        <p type="p">100a:參考面</p>  
        <p type="p">115、125、215、225、315、325、415、425、515、525:光軸區域</p>  
        <p type="p">116、126、216、226、316、326、416、426、516、526:圓周區域</p>  
        <p type="p">A1:第一側</p>  
        <p type="p">A2:第二側</p>  
        <p type="p">I:光軸</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2321" publication-number="202613254"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613254.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613254</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150415</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>耐腐蝕油漆去除劑組合物和從基材去除油漆的方法</chinese-title>  
        <english-title>CORROSION-RESISTANT PAINT REMOVER COMPOSITION AND METHOD FOR REMOVING PAINT FROM A SUBSTRATE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">C09D9/00</main-classification>  
        <further-classification edition="200601120260102B">C09D9/04</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商Ｗ·Ｍ·巴爾公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>W.M. BARR &amp; COMPANY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波爾格　道爾頓</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BOLGEO, DALTON</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布里昂　喬納森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BREON, JONATHAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>法默　雷切爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FARMER, RACHEL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蒂格　蒂莫西</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TEAGUE, TIMOTHY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>江日舜</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了一種油漆去除劑組合物和一種從多孔和無孔基材上去除油漆的方法。所述油漆去除劑組合物為乳液，所述乳液包含5重量%至80重量%的苯甲醇、30重量%至70重量%的水、萜烯烴和用於乳化組合物並提供腐蝕抑制的有效濃度的醇乙氧基化物磷酸酯。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img/> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2322" publication-number="202613240"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613240.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613240</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150428</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>光硬化性熱硬化性樹脂組成物、乾薄膜、硬化物及具有該硬化物之電子零件</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">C08L63/00</main-classification>  
        <further-classification edition="200601120251230B">C08L101/08</further-classification>  
        <further-classification edition="200601120251230B">C08G59/14</further-classification>  
        <further-classification edition="200601120251230B">C08G59/42</further-classification>  
        <further-classification edition="201801120251230B">C08K3/10</further-classification>  
        <further-classification edition="200601120251230B">C08K3/34</further-classification>  
        <further-classification edition="200601120251230B">G03F7/004</further-classification>  
        <further-classification edition="200601120251230B">H05K3/28</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商太陽控股股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>福田晋一朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FUKUDA, SHINICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>內山強</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UCHIYAMA, TSUYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>徳光香代子</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOKUMITSU, KAYOKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>宮部英和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>MIYABE, HIDEKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明之課題在於提供保管性優異，且取得之乾薄膜上針孔或收縮(crawling)等之不良情況受到抑制，以及電特性亦為優異之光硬化性熱硬化性樹脂組成物、其硬化物、及具有該硬化物之電子零件。 &lt;br/&gt;　　其解決手段為由至少2液系統之樹脂組成物所組成之光硬化性熱硬化性樹脂組成物、由該硬化性組成物所得之硬化物，具有該硬化物之電子零件；該組成物係含有：(A)環氧樹脂、(B)含羧基樹脂、(C)光聚合起始劑、(D)感光性單體、(E)二氧化矽、(F)硫酸鋇及有機溶劑，且係為了取得前述光硬化性熱硬化性樹脂組成物而由至少2液系統之樹脂組成物所組成，前述(B)含羧基樹脂、前述(D)感光性單體及前述(E)二氧化矽係包含在與前述(A)環氧樹脂、前述(F)硫酸鋇及前述(C)光聚合起始劑不同之樹脂組成物中，包含前述(C)光聚合起始劑之樹脂組成物係包含能溶解前述(C)光聚合起始劑之有機溶劑。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">無</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2323" publication-number="202613442"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613442.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613442</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150522</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>座杆元件</chinese-title>  
        <english-title>A SEATPOST ASSEMBLY</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">F16K17/20</main-classification>  
        <further-classification edition="200601120251229B">F16K5/04</further-classification>  
        <further-classification edition="200601120251229B">B62J1/02</further-classification>  
        <further-classification edition="200601120251229B">B62J1/08</further-classification>  
        <further-classification edition="200601120251229B">F16K17/18</further-classification>  
        <further-classification edition="200601120251229B">F16K31/04</further-classification>  
        <further-classification edition="200601120251229B">F16K5/18</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商福克斯制造有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FOX FACTORY, INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>科普倫　喬舒亞</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>COAPLEN, JOSHUA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>布朗四世　威廉姆　Ｏ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>BROWN IV, WILLIAM O.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>波洛克　托瑪斯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>POLLOCK, THOMAS</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>奧特尼斯　克里斯托弗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>OTTERNESS, CHRISTOPHER</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>廖俊龍</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">公開了一種升降座杆元件，所述升降座杆元件包括不需要線性運動的旋轉流量控制閥。所述旋轉流量控制閥包括驅動機構和與驅動機構聯接的旋轉流量控制閥，其中，旋轉流量控制閥通過驅動機構旋轉，而不需要將線性運動轉換為旋轉運動。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A dropper seatpost assembly comprising a rotary flow control valve that requires no linear motion is disclosed. The rotary flow control valve comprises a drive mechanism and a rotary flow control valve coupled with the drive mechanism, wherein the rotary flow control valve is rotated by the drive mechanism without requiring conversion of a linear motion to a rotational motion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">10:車座</p>  
        <p type="p">50:自行車</p>  
        <p type="p">93:座管</p>  
        <p type="p">119:自行車框架</p>  
        <p type="p">200:車把</p>  
        <p type="p">205:使用者介面</p>  
        <p type="p">300:升降座杆元件</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2324" publication-number="202613609"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613609.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613609</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150582</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>濾光器</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251229B">G02B5/22</main-classification>  
        <further-classification edition="200601120251229B">G02B5/26</further-classification>  
        <further-classification edition="202501120251229B">H10F99/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商ＡＧＣ股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>AGC INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>塩野和彦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIONO, KAZUHIKO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>島田拓郎</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SHIMADA, TAKURO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>折田雄一朗</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ORITA, YUICHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>遠藤清和</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ENDO, KIYOKAZU</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>坂上貴尋</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SAKAGAMI, TAKAHIRO</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>長田崇</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NAGATA, TAKASHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>上條克司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAMIJYO, KATSUSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於一種濾光器，其依序具備第一介電多層膜、樹脂膜、磷酸玻璃及第二介電多層膜，且樹脂膜包含樹脂及具有規定之分光特性之色素，第二介電多層膜包含折射率及QWOT為特定範圍之H&lt;sub&gt;2&lt;/sub&gt;層，在將最接近磷酸玻璃之H&lt;sub&gt;2&lt;/sub&gt;層設為第一H&lt;sub&gt;2&lt;/sub&gt;層時，於第一H&lt;sub&gt;2&lt;/sub&gt;層與磷酸玻璃之間包含QWOT滿足特定範圍之第一M&lt;sub&gt;2&lt;/sub&gt;層，濾光器滿足規定之分光特性(i-1)～(i-4)全部。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1B:濾光器</p>  
        <p type="p">11:磷酸玻璃</p>  
        <p type="p">12:樹脂膜</p>  
        <p type="p">20A:第二介電多層膜</p>  
        <p type="p">20B:第一介電多層膜</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2325" publication-number="202614350"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614350.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614350</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150622</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>對準方法</chinese-title>  
        <english-title>ALIGNMENT METHOD</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251230B">H01L21/683</main-classification>  
        <further-classification edition="200601120251230B">C30B28/14</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>岡古里　蘇羅吉特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GANGULI, SUROJIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>鄧恩　陶德　羅伯特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>DUNN, TODD ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>金堤　安基特</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KIMTEE, ANKIT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種用於一反應器系統之對準夾具可包含一夾具本體，夾具本體包含一內周部，其至少部分地界定一形狀，此形狀包含夾具本體之一內部空間，其中內部空間配置以收納一反應器系統的一基座；及/或一測量突出部，其在一第一位置處耦接至夾具本體，並從夾具本體朝內部空間突出。測量突出部可包含一指標，其介於夾具本體與測量突出部之一測量突出端之間。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">An alignment fixture for a reactor system may comprise a fixture body comprising an inner perimeter at least partially defining a shape which comprises an inner space of the fixture body, wherein the inner space is configured to receive a susceptor of a reactor system; and/or a measuring protrusion coupled to the fixture body at a first position and protruding from the fixture body toward the inner space. The measuring protrusion may comprise an indicator between the fixture body and a measuring protrusion end of the measuring protrusion.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:對準夾具</p>  
        <p type="p">110:夾具本體</p>  
        <p type="p">112:內周部</p>  
        <p type="p">114:外周部</p>  
        <p type="p">116:上表面</p>  
        <p type="p">120:內部空間</p>  
        <p type="p">150:測量突出部</p>  
        <p type="p">151:第一側</p>  
        <p type="p">152:第二側</p>  
        <p type="p">153:測量突出端</p>  
        <p type="p">155:突出部本體</p>  
        <p type="p">157:突出部空隙</p>  
        <p type="p">160:指標</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2326" publication-number="202613014"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613014.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613014</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150765</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>裝載埠</chinese-title>  
        <english-title/> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120251231B">B65G49/07</main-classification>  
        <further-classification edition="200601120251231B">B25J9/16</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>日商平田機工股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HIRATA CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>豊田哲慶</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TOYODA, NORIYOSHI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>髙城弘樹</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>TAKAJO, HIROKI</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>JP</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明的裝載埠，具備：載置容器用的載置台；及通口板；及通口門；及被設於前述通口門將被收容於前述容器內的前述基板檢出的基板檢出手段；及將前述通口門昇降的昇降手段；及將前述通口門在水平方向也就是進退方向進退的進退手段；及將前述基板檢出手段在前述進退方向變位的變位手段。前述變位手段，在由前述進退手段所進行的前述通口門的進退動作中，使前述基板檢出手段朝前述通口門相反方向變位。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p"/> 
      </isu-abst>  
      <representative-img> 
        <p type="p">4:通口門</p>  
        <p type="p">6:定位組件</p>  
        <p type="p">40:保持部</p>  
        <p type="p">41:支撐部</p>  
        <p type="p">60:定位感測器</p>  
        <p type="p">61a:支柱部</p>  
        <p type="p">61c:軸部</p>  
        <p type="p">600:變位組件</p>  
        <p type="p">P1:退避位置</p>  
        <p type="p">P2:待機位置</p>  
        <p type="p">P3:掃描位置</p>  
        <p type="p">α,β:傾斜角度</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2327" publication-number="202613880"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613880.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613880</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150792</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>具有磁場聚焦之ＲＦＩＤ標籤及用於判定物件在一遊戲環境中之位置之系統</chinese-title>  
        <english-title>RFID TAGS WITH B-FIELD FOCUSING AND SYSTEMS FOR DETERMINING LOCATIONS OF OBJECTS IN A GAMING ENVIRONMENT</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G06K19/06</main-classification>  
        <further-classification edition="200601120260102B">G06K19/07</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商福爾蒂斯公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>FORTISS, LLC</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西茲　佛里斯特　Ｓ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEITZ, FORREST S.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>西茲　泰勒　Ｊ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SEITZ, TYLER J.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>霍特　喬夏　Ｋ</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HOYT, JOSHUA K.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>陳長文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>簡秀如</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>羅文妙</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示一種射頻識別(RFID)標籤，其包含導致與一RFID讀取器之激勵頻率不同之一諧振頻率之電路元件。該RFID標籤在與其他類似RFID標籤堆疊時引導磁通量密度場(B場)通過該堆疊以供電給該堆疊中之該等標籤之各者。因此，該B場依增加一個維度(順著一籌碼堆疊)上之敏感度(讀取範圍)同時限制兩個橫向維度上之敏感度，由此提供各標籤關於其在一遊戲桌上之位置之精確空間解析度之一方式準直。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A radio-frequency identification (RFID) tag includes circuit elements that result in a resonant frequency that differs from the excitation frequency of an RFID reader. The RFID tag, when stacked with other similar RFID tags, channels the magnetic flux density field (B-field) through the stack to power each of the tags in the stack. As a result, the B-Field is collimated in a manner that increases the sensitivity (read range) in one dimension (up a stack of chips) while simultaneously limiting the sensitivity in the two lateral dimensions, thereby providing precise spatial resolution of each tag as to its location on a gaming table.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">200:射頻識別(RFID)標籤</p>  
        <p type="p">202:標籤電子器件</p>  
        <p type="p">204:串聯電路元件</p>  
        <p type="p">206:並聯電路元件/並聯電容器</p>  
        <p type="p">208:天線</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2328" publication-number="202612692"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202612692.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202612692</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114150812</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>包含ＩＤＯＢＲ１之醫藥組成物用於治療肌肉發炎之用途</chinese-title>  
        <english-title>USE OF A PHARMACEUTICAL COMPOSITION COMPRISING IDOBR1 FOR TREATING MUSCLE INFLAMMATION</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">A61K31/445</main-classification>  
        <further-classification edition="200601120260102B">A61P29/00</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>英商植物探索有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>PHYTOQUEST LIMITED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>耐許　羅伯</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>NASH, ROBERT</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>GB</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>劉法正</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>尹重君</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">係描述一種用於製造包含(2R,3R,4R,5S)-3,4,5-三羥基哌啶-2-羧酸(idoBR1)之組成物的方法，該方法包含下列步驟：(a)提供來自包含葫蘆科(Cucurbitaceae)家族植物之植物性來源的植物材料；(b)將該植物材料進行分餾，以製造富含idoBR1之萃取物；(c)針對下述測定該萃取物：(i) 對於唾液酸酶的抑制活性；(ii) 對於TNF-α的抑制活性；或(iii) IL-10刺激活性；以及(d)將該測定的萃取物與化妝品上、營養品上或醫藥上可接受的賦形劑或載體一起配製，以製造化妝品組成物、營養品組成物或醫藥組成物。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Described are processes for the production of a composition comprising (2R,3R,4R,5S)-3,4,5-trihydroxypiperidine-2-carboxylic acid (idoBR1), said process comprising the steps of: (a) providing plant material from a botanical source comprising plants of the the family Cucurbitaceae; (b) fractionating said plant material to produce an extract enriched in idoBR1; (c) assaying said extract for: (i) inhibitory activity against sialidase or TNF-alpha; or (ii) IL-10 stimulatory activity; and (d) formulating said assayed extract with a cosmetically-, nutraceutically- or pharmaceutically-acceptable excipient or carrier to produce a cosmetic, nutraceutical or pharmaceutical composition.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">(無)</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2329" publication-number="202614438"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614438.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614438</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151172</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>形成微電子結構的方法</chinese-title>  
        <english-title>METHOD OF FORMING A MICROELECTRONIC STRUCTURE</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L23/528</main-classification>  
        <further-classification edition="200601120260102B">H01L23/532</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈巴　貝高森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HABA, BELGACEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明揭示扇出封裝之各種具體實例。揭示一種形成一微電子組件之方法。該方法可包括在無介入黏著劑之情況下使用一直接接合技術將至少一個微電子基板之一第一表面接合至一載體的一表面，該微電子基板在該微電子基板之至少一個表面上具有複數個導電互連件。該方法可包括將一模製材料塗覆至該微電子基板周圍之該載體之該表面的一區域，以形成一重組基板。該方法可包括處理該微電子基板。該方法可包括使該載體之該表面之該區域處及該模製材料處的該重組基板單一化，以形成該微電子組件。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Various embodiments of fanout packages are disclosed. A method of forming a microelectronic assembly is disclosed. The method can include bonding a first surface of at least one microelectronic substrate to a surface of a carrier using a direct bonding technique without an intervening adhesive, the microelectronic substrate having a plurality of conductive interconnections on at least one surface of the microelectronic substrate. The method can include applying a molding material to an area of the surface of the carrier surrounding the microelectronic substrate to form a reconstituted substrate. The method can include processing the microelectronic substrate. The method can include singulating the reconstituted substrate at the area of the surface of the carrier and at the molding material to form the microelectronic assembly.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1:微電子組件</p>  
        <p type="p">2:載體</p>  
        <p type="p">3:元件</p>  
        <p type="p">4:前表面</p>  
        <p type="p">5:背表面</p>  
        <p type="p">6:模製化合物</p>  
        <p type="p">7:側表面</p>  
        <p type="p">10:重新分佈層</p>  
        <p type="p">17:單一化側表面</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2330" publication-number="202614360"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614360.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614360</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151210</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>模製直接接合且互連的堆疊</chinese-title>  
        <english-title>MOLDED DIRECT BONDED AND INTERCONNECTED STACK</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01L21/768</main-classification>  
        <further-classification edition="200601120260102B">H01L23/48</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>高　桂蓮</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAO, GUILIAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>烏佐　賽普里恩　艾米卡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>UZOH, CYPRIAN EMEKA</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>提爾　傑瑞米　阿弗烈德</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>THEIL, JEREMY ALFRED</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>哈巴　貝高森</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>HABA, BELGACEM</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡特卡　拉杰詡</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KATKAR, RAJESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>閻啓泰</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent>  
          <agent rep-type="agent" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林景郁</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">本發明係關於晶粒及/或晶圓，該些晶粒及/或晶圓以包括堆疊之各種配置而經堆疊且接合，且可覆蓋有模製物以便於處置、封裝以及類似操作。在各個實例中，該模製物可或多或少覆蓋一堆疊，以促進與該堆疊之裝置之連接性、增強熱管理等等。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Dies and/or wafers are stacked and bonded in various arrangements including stacks, and may be covered with a molding to facilitate handling, packaging, and the like. In various examples, the molding may cover more or less of a stack, to facilitate connectivity with the devices of the stack, to enhance thermal management, and so forth.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">100:堆疊/微電子組件</p>  
        <p type="p">102:晶粒</p>  
        <p type="p">102':晶粒</p>  
        <p type="p">104:基底基板</p>  
        <p type="p">106:絕緣層/介電層</p>  
        <p type="p">108:接合表面</p>  
        <p type="p">110:傳導特徵</p>  
        <p type="p">112:傳導跡線</p>  
        <p type="p">114:傳導矽穿孔</p>  
        <p type="p">116:電耦接墊/襯墊</p>  
        <p type="p">e:誤差/未對準</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2331" publication-number="202614152"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202614152.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202614152</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151265</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>基材處理設備</chinese-title>  
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">H01J37/32</main-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>ASM IP HOLDING B.V.</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>NL</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>李昌敏</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LEE, CHANGMIN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>KR</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>洪澄文</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">一種基材處理設備，其能夠局部地控制電漿強度並改善薄膜屬性和厚度均勻性。基材處理設備包括：一動力供應單元、電氣連接至動力供應單元的一處理單元以及在處理單元下方的一基材支撐單元，其中基材支撐單元包括一第一接地電極和一第二接地電極。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">A substrate processing apparatus capable of locally controlling a plasma intensity and improving thin film properties and thickness uniformity includes: a power supply unit, a processing unit electrically connected to the power supply unit, and a substrate support unit below the processing unit, wherein the substrate support unit includes a first ground electrode and a second ground electrode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">51:反應空間</p>  
        <p type="p">110:處理單元</p>  
        <p type="p">150:基材支撐單元</p>  
        <p type="p">CON:控制器</p>  
        <p type="p">GE1:第一接地電極</p>  
        <p type="p">GE2:第二接地電極</p>  
        <p type="p">GND:地</p>  
        <p type="p">HU1:第一加熱單元</p>  
        <p type="p">HU2:第二加熱單元</p>  
        <p type="p">PC1:第一電漿強度控制器</p>  
        <p type="p">PC2:第二電漿強度控制器</p>  
        <p type="p">PWR:動力供應單元</p>  
        <p type="p">S:待處理基材</p> 
      </representative-img> 
    </description> 
  </tw-patent-application>  
  <tw-patent-application no="2332" publication-number="202613827"> 
    <tif-files tif-type="multi-tif"> 
      <tif no="1" file="TIF/202613827.zip"/> 
    </tif-files>  
    <tw-bibliographic-data-application> 
      <volno>24</volno>  
      <isuno>7</isuno>  
      <publication-reference> 
        <document-id> 
          <doc-number>202613827</doc-number> 
        </document-id> 
      </publication-reference>  
      <application-reference appl-type="invention-public"> 
        <document-id> 
          <doc-number>114151400</doc-number> 
        </document-id> 
      </application-reference>  
      <invention-title> 
        <chinese-title>用於多租戶可縮放加速器的高效尋頁錯失處置的方法與設備</chinese-title>  
        <english-title>METHOD AND APPARATUS FOR HIGH-PERFORMANCE PAGE-FAULT HANDLING FOR MULTI-TENANT SCALABLE ACCELERATORS</english-title> 
      </invention-title>  
      <classification-ipc> 
        <main-classification edition="200601120260102B">G06F13/20</main-classification>  
        <further-classification edition="200601120260102B">G06F13/36</further-classification>  
        <further-classification edition="201801120260102B">G06F9/30</further-classification>  
        <further-classification edition="200601120260102B">G06F9/305</further-classification> 
      </classification-ipc>  
      <parties> 
        <applicants> 
          <applicant app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>美商英特爾股份有限公司</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>INTEL CORPORATION</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </applicant> 
        </applicants>  
        <inventors> 
          <inventor app-type="applicant" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>卡凱亞　烏卡許</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KAKAIYA, UTKARSH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="2"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>藍茲　菲利浦</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>LANTZ, PHILIP</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="3"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>庫瑪　森傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>KUMAR, SANJAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="4"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>桑卡安　羅傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>SANKARAN, RAJESH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="5"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>雷岡納森　納拉雅</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RANGANATHAN, NARAYAN</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="6"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>蓋恩　索拉布</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>GAYEN, SAURABH</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>IN</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="7"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>喬希　丹南傑</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>JOSHI, DHANANJAY</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor>  
          <inventor app-type="applicant" sequence="8"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>拉歐　尼基爾</last-name>  
                <first-name/> 
              </chinese-name>  
              <english-name name-type="organization"> 
                <last-name>RAO, NIKHIL</last-name>  
                <middle-name/>  
                <first-name/> 
              </english-name>  
              <address/>  
              <english-country>US</english-country> 
            </addressbook> 
          </inventor> 
        </inventors>  
        <agents> 
          <agent rep-type="agent" sequence="1"> 
            <addressbook> 
              <chinese-name name-type="organization"> 
                <last-name>林志剛</last-name>  
                <first-name/> 
              </chinese-name>  
              <address>臺北市</address> 
            </addressbook> 
          </agent> 
        </agents> 
      </parties> 
    </tw-bibliographic-data-application>  
    <description> 
      <isu-abst lang="tw"> 
        <p type="p">用於高效尋頁錯失處置的設備與方法。例如，設備的一實施例包含：一或更多加速器引擎，用以處理由客戶所提交至多數工作佇列的工作描述符；與該一或更多加速器引擎相關的錯失處理硬體邏輯，該錯失處理硬體邏輯係用以為該多數工作佇列的各個工作佇列實施一指定尋頁錯失處置模式，該尋頁錯失處置模式包含第一尋頁錯失處置模式與第二尋頁錯失處置模式。</p> 
      </isu-abst>  
      <isu-abst lang="en"> 
        <p type="p">Apparatus and method for high-performance page fault handling. For example, one embodiment of an apparatus comprises: one or more accelerator engines to process work descriptors submitted by clients to a plurality of work queues; fault processing hardware logic associated with the one or more accelerator engines, the fault processing hardware logic to implement a specified page fault handling mode for each work queue of the plurality of work queues, the page fault handling modes including a first page fault handling mode and a second page fault handling mode.</p> 
      </isu-abst>  
      <representative-img> 
        <p type="p">1710:主機處理器</p>  
        <p type="p">1800:加速器</p>  
        <p type="p">1801-4:客戶</p>  
        <p type="p">1801A-C:工作佇列</p>  
        <p type="p">1805A-C:錯失處理邏輯</p>  
        <p type="p">1810:記憶體</p>  
        <p type="p">1811:完成記錄緩衝器</p>  
        <p type="p">1812:事件日誌</p>  
        <p type="p">1821A-C:引擎</p> 
      </representative-img> 
    </description> 
  </tw-patent-application> 
</tw-patent-applications>
